MIM-3387K1F中文资料

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mimaki系列机器报错信息表

喷头出墨 !DO TEST DRAW 栈时间过
长
HEATER POWER OFF
加热器关闭
PRE PRT AFT **C **C
加热器未连接（左 BREAK 侧显示的范例为前加热器未连接）
PRE PRT AFT **C **C
L.*>NC [JV5-01]
电热调节器未连接（左侧显 THERM 示的范例为前加热器的电热调节器未连接）
材料加热器温度异常
HEADWARM TEMP （---） HEADWARM BREAK （---） HEADWARM THERM （---）
喷头加热器温度异常
喷头加热器未连接喷头电热调节器出错
ERR212 WASTE INKTANK SENSOR
废墨瓶感应器出错
ERR250 Y COORDINATES
SD-RAM控制异常
收到的数据不是版本升级数据
I/F板未安装
I/F板操作异常
主板与 I/F板连接错误
电脑与 I/F板连接超时
ROM0 清除错误 ROM1 清除错误 ROM0 写入错误 ROM1 写入错误校验错误无用信息检查错误
ERR90 h'******* ERR92 h'******* ERR95 MODE SHIFT ERR98 I/F FORMAT ERR99 VERSION DATA ERR111 NCU ROM 00
**Washing liquid** **unfilling up**
清洁液未注入
解决方法
相关描述
关闭电源 2-3分钟后重新开机如果问题仍然出现，联系经销商。关闭电源 2-3分钟后重新开机如果问题仍然出现，联系经销商。关闭电源 2-3分钟后重新开机如果问题仍然出现，联系经销商。

超米特电子有限公司产品说明书

1US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Superior elongation and tensilestrength help to prevent tearing in use due to mishandling. Typical properties for CHO-SEAL 1310 and 1273 materi-al are shown on pages 33 and 32respectively.High Shielding PerformanceCHO-SEAL 1310 material provides more than 80 dB of shielding effectiv-ness from 100 MHz to 10 GHz, while CHO-SEAL 1273 material provides more than 100 dB.Low Volume ResistivityBoth materials have exceptionally low volume resistivity, which makes them well suited for grounding appli-cations in which a flexible electrical contact is needed.Low Compression GasketSpacer gaskets are typicallydesigned to function under low deflec-tion forces. Chomerics uses design tools such as Finite Element Analysis (FEA) to accurately predict compres-sion-deflection behavior of various cross section options. Refer to page16.LCP Plastic SpacerLiquid crystal polymer (LCP)spacers, including those made with Vectra A130 material, provide aCHO-SEAL ®1310 or 1273Conductive ElastomersWith EMI spacer gaskets, shielding and grounding are provided by Chomerics’CHO-SEAL 1310 and 1273 conductive elastomers, specifi-cally formulated for custom shape molded parts. They provide excellent shielding and isolation against electro-magnetic interference (EMI), or act as a low impedance ground path between PCB traces and shielding media. Physically tough, these elas-tomers minimize the risk of gasket damage, in contrast to thin-walled extrusions or unsupported molded gaskets.Silicone-based CHO-SEAL 1310and 1273 materials offer excellent resistance to compression set over a wide temperature range, resulting in years of continuous service. CHO-SEAL 1310 material is filled with silver-plated-glass particles, while 1273 utilizes silver-plated-copper filler to provide higher levels of EMI shielding effectiveness.EMI Spacer GasketsThe unique design of Chomerics’EMI spacer gaskets features a thin plastic retainer frame onto which a conductive elastomer is molded. The elastomer can be located inside or outside the retainer frame, as well as on its top and bottom surface. EMI spacer gaskets provide a newapproach to designing EMI gaskets into handheld electronics such as dig-ital cellular phones. Board-to-board spacing is custom designed to fit broad application needs. Customized cross sections and spacer shapes allow for very low closure forcerequirements and a perfect fit in any design or device.Robotic InstallationSpacer gaskets can be installed quickly by robotic application. Integral locater pins in the plastic spacer help ensure accuratepositioning in both manual and pick-and-place assembly. Benefits include faster assembly and lower labor costs.The integrated conductive elastomer/plastic spacer gasket is a low cost,easily installed system for providing EMI shielding and grounding in small electronic enclosures.Figure 1Single Piece EMI Gasket/Locator PinsCHO-SEAL 1310 or 1273 Conductive Elastomer (Inside)Plastic Spacer Around Outsideor InsideApplications for EMI Spacer GasketsThe spacer gasket concept is especially suited to digital and dual board telephone handsets or other handheld electronic devices. It provides a low impedance path between peripheral ground traces on printed circuit boards and components such as:•the conductive coating on a plastic housing•another printed circuit board •the keypad assemblyTypical applications for EMI spacer gaskets include:•Digital cellular, handyphone and personal communications services (PCS) handsets •PCMCIA cards•Global Positioning Systems (GPS)•Radio receivers•Other handheld electronics, e.g.,personal digital assistants (PDAs)•Replacements for metal EMI shield-ing “fences” on printedcircuit boards in wireless tele-communications devicesstable platform for direct, highprecision molding of conductive elas-tomers. The Vectra A130 material described in Table 1 has excellent heat deflection temperature character-istics (489°F, 254°C). For weight con-siderations, the LCP has aspecific gravity of only 1.61. This plas-tic is also 100% recyclable.Typical EMI Spacer Gasket Design ParametersThe EMI spacer gasket concept can be considered using the design parameters shown in Table 2. Some typical spacer gasket profiles are shown below.Figure 2Typical Spacer Gasket Profiles3US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Finite Element AnalysisChomerics, a division of the Parker Hannifin Corporation’s Seal Group, is the headquarters of Parker Seal’s Elastomer Simulation Group. This unit specializes in elastomer finite element analysis (FEA) using MARC K6 series software as a foundation for FEA capability.Benefits of FEA include:•Quickly optimizing elastomer gasket designs•Allowing accurate predictions of alternate elastomer design concepts •Eliminating extensive trial and error prototype evaluationTypical use of FEA in EMI spacer gasket designs is to evaluate the force vs. deflection requirements of alternate designs.For example, onespacer design features a continuous bead of con-ductive elastomer molded onto a plastic spacer. An alternative designemploys an “interrupted bead,” where the interrup-tions (gaps left on the plastic frame) are sized to maintain the requiredlevel of EMI shielding. Figure 4illustrates these alternative designs.Gasket DeflectionFigure 5 compares the effect of continuous and interrupted elastomer gasket designs in terms of the force required to deflect the conductive elastomer. This actual cellular handset application required a spacer gasket with interrupted bead to meet desired deflection forces.Chomerics Designand Application ServicesChomerics will custom design a spacer for your application. Advice,analysis and design assistance will be provided by Chomerics Applications and Design engineers at no additional fee. Contact Chomerics directlyat the locations listed at the bottom of the page.Figure 3FEA Example of an EMISpacer Gasket Cross SectionFigure 4Continuous (top) and InterruptedElastomer GasketsFigure 5Typical Spacer Gasket Deflection。

微斯米微波式芯片公司2014年产品说明书

1FeaturesInputs/Outputs •Accepts differential or single-ended input •LVPECL, LVDS, CML, HCSL, LVCMOS •On-chip input termination resistors and biasing for AC coupled inputs•Six precision LVPECL outputs •Operating frequency up to 750 MHzPower •Options for 2.5 V or 3.3 V power supply •Core current consumption of 110 mA•On-chip Low Drop Out (LDO) Regulator for superior power supply rejectionPerformance •Ultra low additive jitter of 36 fs RMSApplications•General purpose clock distribution •Low jitter clock trees •Logic translation•Clock and data signal restoration•Wired communications: OTN, SONET/SDH, GE,10 GE, FC and 10G FC•PCI Express generation 1/2/3 clock distribution •Wireless communications•High performance microprocessor clock distributionApril 2014Figure 1 - Functional Block DiagramZL40205Precision 1:6 LVPECL Fanout Bufferwith On-Chip Input TerminationData SheetOrdering InformationZL40205LDG1 32 Pin QFN TraysZL40205LDF132 Pin QFNTape and ReelMatte TinPackage Size: 5 x 5 mm-40o C to +85o CTable of ContentsFeatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Change Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.0 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52.0 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73.1 Clock Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73.2 Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.3 Device Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.1 Sensitivity to power supply noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.2 Power supply filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.3 PCB layout considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .164.0 AC and DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175.0 Performance Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206.0 Typical Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217.0 Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .238.0 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24List of FiguresFigure 1 - Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2 - Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3 - Simplified Diagram of Input Stage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4 - Clock Input - LVPECL - DC Coupled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5 - Clock Input - LVPECL - AC Coupled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 6 - Clock Input - LVDS - DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 7 - Clock Input - LVDS - AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 8 - Clock Input - CML- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 9 - Clock Input - HCSL- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 10 - Clock Input - AC-coupled Single-Ended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 11 - Clock Input - DC-coupled 3.3V CMOS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 12 - Simplified Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 13 - LVPECL Basic Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 14 - LVPECL Parallel Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 15 - LVPECL Parallel Thevenin-Equivalent Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 16 - LVPECL AC Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 17 - LVPECL AC Output Termination for CML Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 18 - Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 19 - Decoupling Connections for Power Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 20 - Differential and Single-Ended Output Voltages Parameter Definitions . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 21 - Input To Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Change SummaryPage Item Change1Applications Added PCI Express clock distribution.6Pin Description Added exposed pad to Pin Description.8Figure 4 and Figure 5Removed 22 ohm series resistors from Figure 4 and 5. These resistor are not required; however there is no impact to performance if the resistors are included.16Power supply filtering 18Figure 20Clarification of V ID and V OD .Below are the changes from the February 2013 issue to the April 2014 issue:Page Item Change8Figure 4Changed text to indicate the circuit is not recommended for VDD_driver=2.5V.Below are the changes from the November 2012 issue to the February 2013 issue:Corrected typo of 0.3 Ohm to 0.15 Ohm.1.0 Package DescriptionThe device is packaged in a 32 pin QFNFigure 2 - Pin Connections2.0 Pin DescriptionPin # Name Description3, 6clk_p, clk_n,Differential Input (Analog Input). Differential (or single ended) input signals.For all input configurations see “Clock Inputs” on page 728, 27, 26, 25, 24, 23, 18, 17, 16, 15, 14, 13out0_p, out0_nout1_p, out1_nout2_p, out2_nout3_p, out3_nout4_p, out4_nout5_p, out5_nDifferential Output (Analog Output). Differential outputs.9, 19,22, 32vdd Positive Supply Voltage. 2.5 V DC or 3.3 V DC nominal.1, 8vdd_core Positive Supply Voltage. 2.5 V DC or 3.3 V DC nominal.2, 7,20, 21gnd Ground. 0 V.4vt On-Chip Input Termination Node (Analog). Center tap between internal 50 Ohmtermination resistors.The use of this pin is detailed in section 3.1, “Clock Inputs“, for various input signal types.5ctrl Digital Control for On-Chip Input Termination (Input). Selects differential input mode;0: DC coupled LVPECL or LVDS modes1: AC coupled differential modesThis pin are internally pulled down to GND. The use of this pin is detailed in section 3.1,“Clock Inputs“, for various input signal types.10, 11,12, 29,30, 31NC No Connection. Leave unconnected.Exposed Pad Device GND.3.0 Functional DescriptionThe ZL40205 is an LVPECL clock fan out buffer with six output clock drivers capable of operating at frequencies up to 750MHz.The ZL40205 provides an internal input termination network for DC and AC coupled inputs; optional input biasing for AC coupled inputs is also provided. The ZL40205 can accept DC or AC coupled LVPECL and LVDS input signals, AC coupled CML or HCSL input signals, and single ended signals. A pin compatible device with external termination is also available.The ZL40205 is designed to fan out low-jitter reference clocks for wired or optical communications applications while adding minimal jitter to the clock signal. An internal linear power supply regulator and bulk capacitors minimize additive jitter due to power supply noise. The device operates from 2.5V+/-5% or 3.3V+/-5% supply. Its operation is guaranteed over the industrial temperature range -40°C to +85°C.The device block diagram is shown in Figure 1; its operation is described in the following sections.3.1 Clock InputsThe device has a differential input equipped with two on-chip 50 Ohm termination resistors arranged in series with a center tap. The input can accept many differential and single-ended signals with AC or DC coupling as appropriate. A control pin is available to enable internal biasing for AC coupled inputs. A block diagram of the input stage is in Figure 3.Receiverclk_n 50clk_pVt 50BiasctrlFigure 3 - Simplified Diagram of Input StageThis following figures give the components values and configuration for the various circuits compatible with the input stage and the use of the Vt and ctrl pins in each case.In the following diagrams where the ctrl pin is logically one and the Vt pin is not connected, the Vt pin can be instead connected to VDD with a capacitor. A capacitor can also help in Figure 4 between Vt and VDD. This capacitor will minimize the noise at the point between the two internal termination resistors and improve the overall performance of the device.Figure 4 - Clock Input - LVPECL - DC CoupledFigure 5 - Clock Input - LVPECL - AC CoupledFigure 6 - Clock Input - LVDS - DC CoupledFigure 7 - Clock Input - LVDS - AC CoupledFigure 8 - Clock Input - CML- AC CoupledFigure 9 - Clock Input - HCSL- AC CoupledFigure 10 - Clock Input - AC-coupled Single-EndedFigure 11 - Clock Input - DC-coupled 3.3V CMOS3.2 Clock OutputsLVPECL has a very low output impedance and a differential signal swing between 1V and 1.6 V. A simplified diagram for the output stage is shown in Figure 12.The LVPECL to LVDS output termination is not shown since there is a different device with the same inputs and LVDS outputs.out_pout_nFigure 12 - Simplified Output DriverThe methods to terminate the ZL40205 LVPECL drivers are shown in the following figures.Figure 15 - LVPECL Parallel Thevenin-Equivalent Output TerminationFigure 16 - LVPECL AC Output TerminationFigure 17 - LVPECL AC Output Termination for CML Inputs3.3 Device Additive JitterThe ZL40205 clock fanout buffer is not intended to filter clock jitter. The jitter performance of this type of device is characterized by its additive jitter. Additive jitter is the jitter the device would add to a hypothetical jitter-free clock as it passes through the device. The additive jitter of the ZL40205 is random and as such it is not correlated to the jitter of the input clock signal.The square of the resultant random RMS jitter at the output of the ZL40205 is equal to the sum of the squares of the various random RMS jitter sources including: input clock jitter; additive jitter of the buffer; and additive random jitter due to power supply noise. There may be additional deterministic jitter sources, but they are not shown in Figure 18.Figure 18 - Additive Jitter3.4 Power SupplyThis device operates employing either a 2.5V supply or 3.3V supply.3.4.1 Sensitivity to power supply noisePower supply noise from sources such as switching power supplies and high-power digital components such as FPGAs can induce additive jitter on clock buffer outputs. The ZL40205 is equipped with a low drop out (LDO) regulator and on-chip bulk capacitors to minimize additive jitter due to power supply noise. The on-chip regulation, recommended power supply filtering, and good PCB layout all work together to minimize the additive jitter from power supply noise.3.4.2 Power supply filteringJitter levels may increase when noise is present on the power pins. For optimal jitter performance, the device should be isolated from the power planes connected to its power supply pins as shown in Figure 19. •10 µF capacitors should be size 0603 or size 0805 X5R or X7R ceramic, 6.3 V minimum rating •0.1 µF capacitors should be size 0402 X5R ceramic, 6.3 V minimum rating •Capacitors should be placed next to the connected device power pins •A 0.15 Ohm resistor is recommended3.4.3 PCB layout considerationsThe power nets in Figure 19 can be implemented either as a plane island or routed power topology without changing the overall jitter performance of the device.ZL402051891922320.1 µF 0.1 µFvdd_core10 µF 0.1 µF0.15 Ωvdd0.1 µF 10 µFFigure 19 - Decoupling Connections for Power PinsAbsolute Maximum Ratings*Parameter Sym.Min.Max.Units 1Supply voltage V DD_R-0.5 4.6V 2Voltage on any digital pin V PIN-0.5VDD V 4LVPECL output current I out30mA 5Soldering temperature T260 °C 6Storage temperature T ST-55125 °C 7Junction temperature T j125 °C 8Voltage on input pin V input VDD V 9Input capacitance each pin C p500fF 4.0 AC and DC Electrical Characteristics* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.* Voltages are with respect to ground (GND) unless otherwise statedRecommended Operating Conditions*Characteristics Sym.Min.Typ.Max.Units1Supply voltage 2.5 V mode V DD25 2.375 2.5 2.625V2Supply voltage 3.3 V mode V DD33 3.135 3.3 3.465V3Operating temperature T A-402585°C* Voltages are with respect to ground (GND) unless otherwise statedDC Electrical Characteristics - Current ConsumptionCharacteristics Sym.Min.Typ.Max.Units Notes 1Supply current LVPECL drivers -unloadedI dd_unload110mA Unloaded2Supply current LVPECL drivers - loaded (all outputs are active)I dd_load209mA Including powerto R L = 50DC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristics Sym.Min.Typ.Max.Units Notes1CMOS control logic high-level inputvoltageV CIH0.7*V DD V2CMOS control logic low-level inputvoltageV CIL0.3*V DD V3CMOS control logic Input leakagecurrentI IL1µA V I = V DD or 0 V4Differential input common modevoltageV CM 1.1 2.0V5Differential input voltage difference V ID0.251V6Differential input resistance V IR80100120ohm* This parameter was measured from 125 MHz to 750 MHz.* This parameter was measured from 125 MHz to 750 MHz.Figure 20 - Differential and Single-Ended Output Voltages Parameter Definitions7LVPECL output high voltage V OH V DD -1.40V 8LVPECL output low voltage V OL V DD - 1.62V 9LVPECL output differential voltage*V OD0.50.9VDC Electrical Characteristics - Inputs and Outputs - for 2.5 V SupplyCharacteristicsSym.Min.Typ.Max.Units Notes1Differential input common mode voltageV CM 1.1 1.6V 2Differential input voltage difference V ID 0.251V 3Differential input resistance V IR 80100120ohm 4LVPECL output high voltage V OH V DD -1.40V 5LVPECL output low voltage V OL V DD - 1.62V 6LVPECL output differential voltage*V OD0.40.9VDC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristicsSym.Min.Typ.Max.Units NotesAC Electrical Characteristics* - Inputs and Outputs (see Figure 21) - for 2.5/3.3 V supply.Characteristics Sym.Min.Typ.Max.Units Notes 1Maximum Operating Frequency1/t p750MHz2Input to output clock propagation delay t pd012ns3Output to output skew t out2out50100ps4Part to part output skew t part2part80300ps5Output clock Duty Cycle degradation t PWH/ t PWL-202Percent6LVPECL Output clock slew rate r SL0.75 1.2V/ns* Supply voltage and operating temperature are as per Recommended Operating ConditionsInputt Pt PWL t pdt PWHOutputFigure 21 - Input To Output TimingAdditive Jitter at 2.5 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1392212.512 kHz - 20 MHz 1093311.0412 kHz - 20 MHz 85442512 kHz - 20 MHz 57550012 kHz - 20 MHz 506622.0812 kHz - 20 MHz 40775012 kHz - 20 MHz36Additive Jitter at 3.3 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1152212.512 kHz - 20 MHz 853311.0412 kHz - 20 MHz 72442512 kHz - 20 MHz 55550012 kHz - 20 MHz 486622.0812 kHz - 20 MHz 41775012 kHz - 20 MHz395.0 Performance Characterization*The values in this table were taken with an approximate slew rate of 0.8 V/ns.*The values in this table were taken with an approximate slew rate of 0.8 V/ns.Additive Jitter from a Power Supply Tone*Carrier frequencyParameterTypicalUnitsNotes125MHz 25 mV at 100 kHz 115fs RMS 750MHz25 mV at 100 kHz59fs RMS* The values in this table are the additive periodic jitter caused by an interfering tone typically caused by a switching power supply. For this test, measurements were taken over the full temperature and voltage range for V DD = 2.5 V. The magnitude of the interfering tone is measured at the DUT.6.0 Typical BehaviorTypical Phase Noise at 622.08 MHzTypical Waveformat 155.52 MHzV OD versus FrequencyPropagation Delay versus TemperatureNote:This is for a single device. For more details see thePower Supply Tone Frequency (at 25 mV) versus PSRR at 125 MHz Power Supply Tone Frequency (at 25 mV) versus Additive Jitter at 125 MHzPower Supply Tone Magnitude (at 100 kHz) versus PSRR at 125 MHz Power Supply Tone Magnitude (at 100 kHz) versus Additive Jitter at 125 MHz7.0 Package CharacteristicsThermal DataParameter Symbol Test Condition Value UnitJunction to Ambient Thermal Resistance ΘJA Still Air1 m/s2 m/s 37.433.131.5o C/WJunction to Case Thermal Resistance ΘJC24.4o C/W Junction to Board Thermal Resistance ΘJB19.5o C/W Maximum Junction Temperature*T jmax125o C Maximum Ambient Temperature T A85o C© 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense and security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif. and has approximately 3,400 employees globally. Learn more at .Microsemi Corporate Headquarters One One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (800) 713-4113Outside the USA: +1 (949) 380-6100Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996E-mail: ***************************Information relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Microsemi or licensed from third parties by Microsemi, whatsoever. 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MAX3387中文资料

V-
Pin Configuration
TOP VIEW
C1+ 1 V+ 2 C1- 3 C2+ 4 C2- 5 V- 6 T1IN 7 T2IN 8 INVALID 9 T3IN 10 FORCEON 11 R3OUT 12 24 FORCEOFF 23 VCC 22 GND 21 T1OUT
7 T1IN TTL/CMOS INPUTS 8 T2IN 10 T3IN
+3.3V CBYPASS C1 0.1µF C2 0.1µF 24 FORCEOFF 1 C1+ 3 4 5 C1C2+ C2T1OUT 21 T2OUT 20 T3OUT 19 VL 14 R1OUT R1IN 18 5k R2IN 17 5k VL 12 9 R3OUT INVALID FORCEON 11 GND 22 R3IN 16 5k RS-232 INPUTS RS-232 OUTPUTS 23 VCC 15 VL V+ 2 C3 0.1µF 6 C4 0.1µF
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MAX3387E
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MCZ33883EGR2资料

Document Number: MC33883Rev 9.0, 1/2007Freescale Semiconductor Advance Information* This document contains certain information on a new product.Specifications and information herein are subject to change without notice.© Freescale Semiconductor, Inc., 2007. All rights reserved.H-Bridge Gate Driver ICThe 33883 is an H-bridge gate driver (also known as a full-bridge pre-driver) IC with integrated charge pump and independent high-•V CC •V CC2••••••••Figure 1. 33883 Simplified Application Diagram33883Analog Integrated Circuit Device Data33883INTERNAL BLOCK DIAGRAMINTERNAL BLOCK DIAGRAMFigure 2. 33883 Simplified Internal Block DiagramUndervolt-age/Over-voltageG_ENIN_HS1IN_LS1IN_HS2IN_LS2GATE_LS1SRC_HS1GATE_HS CP_OUTLR_OUTGATE_LS2SRC_HS2GATE_HS Pulse GeneratorV DD / V CC Level ShiftPulse GeneratorV DD / V POS Level ShiftIN OUCon-trol a nd LogicLinearReg V CC2EN GND +5.0 V+14.5 V V DDHIGH- AND LOW-SIDECharge PumpEN GNDC2V POSV CCC1V CC2V CCV CCV CC2VCC VCC2CP_OUTLR_OUT V CC, V CC2V DDC2C1BRG_ENPulse GeneratorV DD / V CC Level ShiftPulse GeneratorV DD / V POS Level ShiftGND CONTROL WITH CHARGE PUMPCP_OUTV CCOutputDriverIN OUCP_OUTV CCOutputDriverIN OULR_OUTOutputDriverIN OULR_OUTOutputDriverCon-trol a nd LogicCon-trol a nd LogicCon-trol a nd LogicBRG_ENBRG_ENBRG_ENHIGH-SIDE CHANNELLOW-SIDE CHANNELHIGH-SIDE CHANNELLOW-SIDE CHANNELGND2GND2GND1GND GND_GND2GND_AT SD 1Thermal ShutdownT SD 1T SD 1T SD 2Thermal ShutdownT SD 2T SD 2Analog Integrated Circuit Device Data 33883TERMINAL CONNECTIONSFigure 3. 33883 20-SOICW Terminal ConnectionsTable 1. 20-SOICW Terminal DefinitionsA functional description of each terminal can be found in the FUNCTIONAL TERMINAL DESCRIPTION section beginning on page 10.TerminalTerminal Name Formal Name Definition1VCC Supply Voltage 1Device power supply 1.2C2Charge Pump Capacitor External capacitor for internal charge pump.3CP_OUT Charge Pump Out External reservoir capacitor for internal charge pump.4SRC_HS1Source 1 Output High Side Source of high-side 1 MOSFET 5GATE_HS 1Gate 1 Output High Side Gate of high-side 1 MOSFET.6IN_HS1Input High Side 1 Logic input control of high-side 1 gate (i.e., IN_HS1 logic HIGH = GATE_HS1 HIGH).7IN_LS1Input Low Side 1Logic input control of low-side 1 gate (i.e., IN_LS1 logic HIGH = GATE_LS1 HIGH).8GATE_LS1Gate 1 Output Low Side Gate of low-side 1 MOSFET. 9GND1Ground 1Device ground 1.10LR_OUT Linear Regulator Output Output of internal linear regulator.11VCC2Supply Voltage 2Device power supply 2.12GND_A Analog GroundDevice analog ground.13C1Charge Pump Capacitor External capacitor for internal charge pump.14GND2Ground 2Device ground 2.15GATE_LS2Gate 2 Output Low Side Gate of low-side 2 MOSFET.16IN_LS2Input Low Side 2Logic input control of low-side 2 gate (i.e., IN_LS2 logic HIGH = GATE_LS2 HIGH). 17IN_HS2Input High Side 2 Logic input control of high-side 2 gate (i.e., IN_HS2 logic HIGH = GATE_HS2 HIGH).18GATE_HS 2Gate 2 Output High Side Gate of high-side 2 MOSFET. 19SRC_HS2Source 2 Output High Side Source of high-side 2 MOSFET.20G_ENGlobal EnableLogic input Enable control of device (i.e., G_EN logic HIGH = Full Operation, G_EN logic LOW = Sleep Mode).Analog Integrated Circuit Device Data33883ELECTRICAL CHARACTERISTICS MAXIMUM RATINGSELECTRICAL CHARACTERISTICSMAXIMUM RATINGSTable 2. Maximum RatingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.RatingSymbolValueUnitELECTRICAL RATINGS Supply Voltage 1V CC -0.3 to 65V Supply Voltage 2 (1)V CC2-0.3 to 35V Linear Regulator Output VoltageV LR_OUT -0.3 to 18V High-Side Floating Supply Absolute Voltage V CP_OUT -0.3 to 65V High-Side Floating Source VoltageV SRC_HS-2.0 to 65V High-Side Source Current from CP_OUT in Switch ON State I S 250mA High-Side Gate VoltageV GATE_HS -0.3 to 65V High-Side Gate Source Voltage (2)V GATE_HS - V SRC_HS -0.3 to 20V High-Side Floating Supply Gate Voltage V CP_OUT - V GATE_HS -0.3 to 65V Low-Side Gate Voltage V GATE_LS -0.3 to 17V Wake-Up Voltage V G_EN -0.3 to 35V Logic Input VoltageV IN -0.3 to 10V Charge Pump Capacitor Voltage V C1-0.3 to V LR_OUTV Charge Pump Capacitor Voltage V C2-0.3 to 65V ESD Voltage (3)Human Body Model on All Pins (V CC and V CC2 as Two Power Supplies) Machine ModelV ESD1V ESD2±1500±130VNotes1.V CC2 can sustain load dump pulse of 40 V, 400 ms,2.0 Ω.2.In case of high current (SRC_HS >100 mA) and high voltage (>20 V) between GATE_HSX and SRC_HS an external zener of 18 V isneeded as shown in Figure 14.3.ESD1 testing is performed in accordance with the Human Body Model (C ZAP =100 pF, R ZAP =1500 Ω), ESD2 testing is performed inaccordance with the Machine Model (C ZAP =200 pF, R ZAP =0Ω).Analog Integrated Circuit Device Data 33883ELECTRICAL CHARACTERISTICSMAXIMUM RATINGSPower Dissipation and Thermal Characteristics Maximum Power Dissipation @ 25°C Thermal Resistance (Junction to Ambient)Operating Junction Temperature Storage TemperatureP D R θJA T J T STG 1.25100-40 to 150-65 to 150W °C / W °C °C Peak Package Reflow Temperature During Reflow (4), (5)T PPRTNote 5°CNotes4.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits maycause malfunction or permanent damage to the device.5.Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package ReflowTemperature and Moisture Sensitivity Levels (MSL),Go to , search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.Table 2. Maximum RatingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.RatingSymbolValueUnitAnalog Integrated Circuit Device Data33883ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSTable 3. Static Electrical CharacteristicsCharacteristics noted under conditions V CC = 12 V, V CC2 = 12 V, C CP = 33 nF, G_EN = 4.5 V unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbolMinTypMaxUnitOPERATING CONDITIONSSupply Voltage 1 for Output High-Side Driver and Charge Pump V CC 5.5–55V Supply Voltage 2 for Linear Regulation V CC2 5.5–28V High-Side Floating Supply Absolute VoltageV CP_OUTV CC +4–V CC + 11 but < 65VLOGICLogic 1 Input Voltage (IN_LS and IN_HS) V IH 2.0–10V Logic 0 Input Voltage (IN_LS and IN_HS) V IL ––0.8V Logic 1 Input Current V IN = 5.0 VI IN+200–1000µAWake-Up Input Voltage (G_EN)V G_EN 4.55.0V CC2V Wake-Up Input Current (G_EN) V G_EN = 14 VI G_EN–200500µAWake-Up Input Current (G_EN) V G_EN = 28 V I G_EN2––1.5mALINEAR REGULATOR Linear RegulatorV LR_OUT @ V CC2 from 15 V to 28 V, I LOAD from 0 mA to 20 mA V LR_OUT @ I LOAD = 20 mAV LR_OUT @ I LOAD = 20 mA, V CC2 = 5.5 V, V CC = 5.5 V V LR_OUT12.5V CC2 - 1.54.0–––16.5––VCHARGE PUMPCharge Pump Output Voltage, Reference to VCC V CC = 12 V, I LOAD = 0 mA, C CP_OUT = 1.0 µF V CC = 12 V, I LOAD = 7.0 mA, C CP_OUT = 1.0 µF V CC2 = V CC = 5.5 V, I LOAD = 0 mA, C CP_OUT = 1.0 µF V CC2 = V CC = 5.5 V, I LOAD = 7.0 mA, C CP_OUT = 1.0 µF V CC = 55 V, I LOAD = 0 mA, C CP_OUT = 1.0 µF V CC = 55 V, I LOAD = 7.0 mA, C CP_OUT = 1.0 µFV CP_OUT7.57.02.31.87.57.0––––––––––––VPeak Current Through Pin C1 Under Rapidly Changing VCC Voltages (see Figure 13, page 17)I C1-2.0– 2.0AMinimum Peak Voltage at Pin C1 Under Rapidly Changing VCC Voltages (see Figure 13, page 17)V C1MIN -1.5––VAnalog Integrated Circuit Device Data 33883ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSSUPPLY VOLTAGEQuiescent VCC Supply Current V G_EN = 0 V and V CC = 55 V V G_EN = 0 V and V CC = 12 V IV CCSLEEP––––1010µAOperating VCC Supply Current (6)V CC = 55 V and V CC2 = 28 V V CC = 12 V and V CC2 = 12 VIV CCOP––2.20.7––mAAdditional Operating V CC Supply Current for Each Logic Input Terminal ActiveV CC = 55 V and V CC2 = 28 V (7)IV CCLOG––5.0mAQuiescent VCC2 Supply Current V G_EN = 0 V and V CC = 12 V V G_EN = 0 V and V CC = 28 V IV CC2SLEEP––––5.05.0µAOperating VCC2 Supply Current (6) V CC = 55 V and V CC2 = 28 V V CC = 12 V and V CC2 = 12 VIV CC2OP––––129.0mA Additional Operating VCC2 Supply Current for Each Logic Input Terminal ActiveV CC = 55 V and V CC2 = 28 V (7) IV CC2LOG–– 5.0mAUndervoltage Shutdown VCC UV 4.0 5.0 5.5V Undervoltage Shutdown VCC2 (8)UV2 4.0 5.0 5.5V Overvoltage Shutdown VCC OV 576165V Overvoltage Shutdown VCC2OV229.53135VOUTPUTOutput Sink Resistance (Turned Off)I discharge LSS = 50 mA , V SRC_HS = 0 V (8)R DS––22ΩOutput Source Resistance (Turned On)I charge HSS = 50 mA, V CP_OUT = 20 V (8)R DS––22ΩCharge Current of the External High-Side MOSFET Through GATE_HSn Terminal (9)I CHARGE HSS–100200mAMaximum Voltage (V GATE_HS - V SRC_HS ) INH = Logic 1, I S max = 5.0 mAVMAX––18VNotes6.Logic input terminal inactive (high impedance).7.High-frequency PWM-ing (» 20 kHz) of the logic inputs will result in greater power dissipation within the device. Care must be taken to remain within the package power handling rating.8.The device may exhibit predictable behavior between 4.0 V and 5.5 V.9.See Figure 5, page 12, for a description of charge current.Table 3. Static Electrical Characteristics (continued)Characteristics noted under conditions V CC = 12 V, V CC2 = 12 V, C CP = 33 nF, G_EN = 4.5 V unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbol Min Typ Max UnitAnalog Integrated Circuit Device Data33883ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSTable 4. Dynamic Electrical CharacteristicsCharacteristics noted under conditions 7.0 V ≤ V SUP ≤ 18 V, -40°C ≤ T A ≤ 125°C, GND = 0.0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbolMinTypMaxUnitTIMING CHARACTERISTICSPropagation Delay High Side and Low SideC LOAD = 5.0 nF, Between 50% Input to 50% Output (10) (see Figure 4) t PD–200300nsTurn-On Rise TimeC LOAD = 5.0 nF, 10% to 90% (10), (11) (see Figure 4) t R–80180ns Turn-Off Fall TimeC LOAD = 5.0 nF, 10% to 90% (10), (11) (see Figure 4)t F–80180ns10.C LOAD corresponds to a capacitor between GATE_HS and SRC_HS for the high side and between GATE_LS and ground for low side. 11.Rise time is given by time needed to change the gate from 1.0 V to 10 V (vice versa for fall time).Analog Integrated Circuit Device Data 33883TIMING DIAGRAMSTIMING DIAGRAMSFigure 4. Timing Characteristics50%50%t fIN_HS GATE_HS 50%50%t pdt pdt ror IN_LS or GATE_LSAnalog Integrated Circuit Device Data33883FUNCTIONAL DESCRIPTION INTRODUCTIONFUNCTIONAL DESCRIPTIONINTRODUCTIONThe 33883 is an H-bridge gate driver (or full-bridge pre-driver) with integrated charge pump and independent high- and low-side driver channels. It has the capability to drivelarge gate-charge MOSFETs and supports high PWM frequency. In sleep mode its supply current is very low.FUNCTIONAL TERMINAL DESCRIPTIONSUPPLY VOLTAGE TERMINALS (VCC AND VCC2)The VCC and VCC2 terminals are the power supply inputs to the device. V CC is used for the output high-side drivers and the charge pump. V CC2 is used for the linear regulation. They can be connected together or independent with different voltage values. The device can operate with V CC up to 55 V and V CC2 up to 28 V.The VCC and VCC2 terminals have undervoltage (UV) and overvoltage (OV) shutdown. If one of the supply voltage drops below the undervoltage threshold or rises above the overvoltage threshold, the gate outputs are switched LOW in order to switch off the external MOSFETs. When the supply returns to a level that is above the UV threshold or below the OV threshold, the device resumes normal operationaccording to the established condition of the input terminals.INPUT HIGH- AND LOW-SIDE TERMINALS (IN_HS1, IN_HS2, AND IN_LS1, IN_LS2)The IN_HSn and IN_LSn terminals are input control terminals used to control the gate outputs. These terminals are 5.0 V CMOS-compatible inputs with hysteresis. IN_HSn and IN_LSn independently control GATE_HSn and GATE_LSn, respectively.During wake-up, the logic is supplied from the G_EN terminal. There is no internal circuit to prevent the external high-side and low-side MOSFETs from conducting at the same time.SOURCE OUTPUT HIGH-SIDE TERMINALS (SRC_HS1 AND SRC_HS2)The SRC_HSn terminals are the sources of the external high-side MOSFETs. The external high-side MOSFETs are controlled using the IN_HSn inputs.GATE HIGH- AND LOW-SIDE TERMINALS (GATE_HS1, GATE_HS2, AND GATE_LS1, GATE_LS2)The GATE_HSn and GATE_LSn terminals are the gates of the external high- and low-side MOSFETs. The external high- and low-side MOSFETs are controlled using the IN_HSn and IN_LSn inputs.GLOBAL ENABLE (G_EN)The G_EN terminal is used to place the device in a sleep mode. When the G_EN terminal voltage is a logic LOW state, the device is in sleep mode. The device is enabled and fully operational when the G_EN terminal voltage is logic HIGH, typically 5.0 V.CHARGE PUMP OUT (CP_OUT)The CP_OUT terminal is used to connect an external reservoir capacitor for the charge pump.CHARGE PUMP CAPACITOR TERMINALS (C1 AND C2)The C1 and C2 terminals are used to connect an external capacitor for the charge pump.LINEAR REGULATOR OUTPUT (LR_OUT)The LR_OUT terminal is the output of the internal regulator. It is used to connect an external capacitor.GROUND TERMINALS (GND_A, GND1 AND GND2)These terminals are the ground terminals of the device. They should be connected together with a very low impedance connection.FUNCTIONAL DESCRIPTIONFUNCTIONAL TERMINAL DESCRIPTIONTable 5. Functional Truth TableConditions G_EN IN_HSn IN_LSn Gate_HSn Gate_LSn Comments Sleep0x x00Device is in Sleep mode. The gates are at low state.Normal11111Normal mode. The gates are controlled independently.Normal10000Normal mode. The gates are controlled independently. Undervoltage1x x00The device is currently in fault mode. The gates are atlow state. Once the fault is removed, the 33883 recoversits normal mode.Overvoltage1x x00The device is currently in fault mode. The gates are atlow state. Once the fault is removed, the 33883 recoversits normal mode.Overtemperatureon High-Side Gate Driver 11x0x The device is currently in fault mode. The high-side gateis at low state. Once the fault is removed, the 33883recovers its normal mode.Overtemperatureon Low-Side Gate Driver 1x1x0The device is currently in fault mode. The low-side gateis at low state. Once the fault is removed, the 33883recovers its normal mode.x = Don’t care.FUNCTIONAL DEVICE OPERATIONFUNCTIONAL DEVICE OPERATIONDRIVER CHARACTERISTICSFigure 5 represents the external circuit of the high-side gate driver. In the schematic, HSS represents the switch that is used to charge the external high-side MOSFET through the GATE_HS terminal. LSS represents the switch that is used to discharge the external high-side MOSFET through the GATE_HS terminal. A 180K Ω internal typical passivedischarge resistance and a 18 V typical protection zener are in parallel with LSS. The same schematic can be applied to the external low-side MOSFET driver simply by replacing terminal CP_OUT with terminal LR_OUT, terminal GATE_HS with terminal GATE_LS, and terminal SRC_HS with GND.Figure 5. High-Side Gate Driver Functional SchematicThe different voltages and current of the high-side gate driver are illustrated in Figure 6. The output driver sources a peak current of up to 1.0 A for 200 ns to turn on the gate. After 200 ns, 100 mA is continuously provided to maintain the gate charged. The output driver sinks a high current to turn off the gate. This current can be up to 1.0 A peak for a 100 nF load.Note G ATE_HS is loaded with a 100 nF capacitor in thechronograms. A smaller load will give lower peak and DC charge or discharge currents.Figure 6. High-Side Gate Driver ChronogramsHSSCP_OUTI GATE_HSI charge HSS I discharge LSSGATE_HS1LSSSRC_HS1180k Ω18VHSSpulse_IN LSS_INHSSDC_ININ_HS11.0 A Peak1.0 A Peak100 mA Typical1.0 A Peak100 mA Typical-1.0 A PeakIN_HS1HSSpulse_INHSS DC_INLSS_INI discharge LSSI GATE_HSI charge HSSFUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESOPERATIONAL MODESTURN-ONFor turn-on, the current required to charge the gate source capacitor C iss in the specified time can be calculated as follows:I P = Q g / t r = 80 nC/ 80 ns ≈ 1.0 A Where Q g is power MOSFET gate charge and t r is peakcurrent for rise time.TURN-OFFThe peak current for turn-off can be obtained in the same way as for turn-on, with the exception that peak current for fall time, t f , is substituted for t r :I P = Q g / t f = 80 nC/ 80 ns ≈ 1.0 A In addition to the dynamic current required to turn off or onthe MOSFET, various application-related switching scenarios must be considered. These scenarios are presented in Figure 7. In order to withstand high dV/dt spikes, a low resistive path between gate and source is implemented during the OFF-state.Figure 7. OFF-State Driver RequirementDriver Requirement:Low Resistive Gate-Source Path DuringOFF-StateFlyback spike charges low-side gate via C rss charge current I rss up to 2.0 A. Causes increased uncon-trolled turn-on of low-sideMOSFET.C issC iss C rss C rssV BATDriver Requirement: Low Resistive Gate-Source Path During OFF-State. High Peak Sink Current CapabilityFlyback spike pulls down high-side source V GS .Delays turn-off of high-side MOSFET.C issC issC rssC rssV BATDriver Requirement:High Peak Sink CurrentCapabilityFlyback spike charges low-side gate via C rss charge current I rss up to 2.0 A.Delays turn-off of low-sideMOSFET.C issC issC rss C rssV BATDriver Requirement:Low Resistive Gate-Source Path DuringOFF-StateC issC issC rssC rssV BATFlyback spike pulls down high-side source V GS .Causes increased uncon-trolled turn-on of high-sideOFFOFFOFFOFFGATE_LSI LOADL1I LOAD L1I LOAD L1I LOAD L1I rssV GATEV GATE -V DRNGATE_HSGATE_LSGATE_HS GATE_HS GATE_LSGATE_HSGATE_LSFUNCTIONAL DEVICE OPERATION OPERATIONAL MODESLOW-DROP LINEAR REGULATORThe low-drop linear regulator is supplied by V CC2. If V CC2 exceeds 15.0 V, the output is limited to 14.5 V (typical).The low-drop linear regulator provides the 5.0 V for the logic section of the driver, the V gs_ls buffered at LR_OUT, and the +14.5 V for the charge pump, which generates theCP_OUT The low-drop linear regulator provides 4.0 mA average current per driver stage.In case of the full bridge, that means approximately16 mA —8.0 mA for the high side and 8.0 mA for the low side.Note: The average current required to switch a gate with a frequency of 100 kHz is:I CP = Q g * f PWM = 80 nC * 100 kHz = 8.0 mAIn a full-bridge application only one high side and one low side switches on or off at the same time.CHARGE PUMPThe charge pump generates the high-side driver supply voltage (CP_OUT), buffered at C CP_OUT. Figure 8 shows the charge pump basic circuit without load.Figure 8. Charge Pump Basic CircuitWhen the oscillator is in low state [(1) in Figure 8], C CP is charged through D2 until its voltage reaches V CC - V D2. When the oscillator is in high state (2), C CP is discharged though D1 in C CP_OUT, and final voltage of the charge pump, V CP_OUT, is V cc+ V LR_OUT - 2V D. The frequency of the 33883 oscillator is about 330 kHz.EXTERNAL CAPACITORS CHOICEExternal capacitors on the charge pump and on the linear regulator are necessary to supply high peak current absorbed during switching.Figure 9 represents a simplified circuitry of the high-side gate driver. Transistors Tosc1 and Tosc2 are the oscillator-switching MOSFETs. When Tosc1 is on, the oscillator is at low level. When Tosc2 is on, the oscillator is at high level. The capacitor C CP_OUT provides peak current to the high-sideFUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESC CPC CP choice depends on power MOSFET characteristics and the working switching frequency. Figure 10 contains two diagrams that depict the influence of C CP value on V CP_OUT average voltage level. The diagrams represent two different frequencies for two power MOSFETs, MTP60N06HD and MPT36N06V.Figure 10. V CP_OUT Versus C CPThe smaller the C CP value is, the smaller the V CP_OUT value is. Moreover, for the same C CP value, when the switching frequency increases, the average V CP_OUT level decreases. For most of the applications, a typical value of 33 nF is recommended.C CP_OUTFigure 11 depicts the simplified C CP_OUT current and voltage waveforms. f PWM is the working switching frequency.CP_OUTWaveformsAs shown above, at high-side MOSFET turn-on V CP_OUTvoltage decreases. This decrease can be calculatedaccording to the C CP_OUT value as follows:Where Q g is power MOSFET gate charge.C LR_OUTC LR_OUT provides peak current needed by the low-sideMOSFET turn-on. V LR_OUT decrease is as follows:TYPICAL VALUES OF CAPACITORSIn most working cases the following typical values arerecommended for a well-performing charge pump:C CP = 33 nF, C CP_OUT = 470 nF, and C LR_OUT = 470 nFThese values give a typical 100 mV voltage ripple onV CP_OUT and V LR_OUT with Q g = 50 nC.g∆V CP_OUT =C CP_OUTQ g∆V LR_OUT =C LR_OUTQ gFUNCTIONAL DEVICE OPERATIONPROTECTION AND DIAGNOSTIC FEATURESPROTECTION AND DIAGNOSTIC FEATURESGATE PROTECTIONThe low-side driver is supplied from the built-in low-drop regulator. The high-side driver is supplied from the internal charge pump buffered at CP_OUT.The low-side gate is protected by the internal linear regulator, which ensures that V GATE_LS does not exceed the maximum V GS. Especially when working with the charge pump, the voltage at CP_OUT can be up to 65 V. The high-side gate is clamped internally in order to avoid a V GS exceeding 18 V.Gate protection does not include a fly-back voltage clamp that protects the driver and the external MOSFET from a fly-back voltage that can occur when driving inductive load. This fly-back voltage can reach high negative voltage values and needs to be clamped externally, as shown in Figure 12.Figure 12. Gate Protection and Flyback Voltage Clamp LOAD DUMP AND REVERSE BATTERYV CC and V CC2 can sustain load a dump pulse of 40 V and double battery of 24 V. Protection against reverse polarity is ensured by the external power MOSFET with the free-wheeling diodes forming a conducting pass from ground to V CC. Additional protection is not provided within the circuit. To protect the circuit an external diode can be put on the battery line. It is not recommended putting the diode on the ground line.TEMPERATURE PROTECTIONThere is temperature shutdown protection per each half-bridge. Temperature shutdown protects the circuitry against temperature damage by switching off the output drivers. Its typical value is 175°C with an hysteresis of 15°C.DV/DT AT V CCV CC voltage must be higher than (SRC_HS voltage minus a diode drop voltage) to avoid perturbation of the high-side driver.In some applications a large dV /d t at terminal C2 owing to sudden changes at V CC can cause large peak currents flowing through terminal C1, as shown in Figure 13.For positive transitions at terminal C2, the absolute value of the minimum peak current, I C1min, is specified at 2.0 A for a t C1min duration of 600 ns.For negative transitions at terminal C2, the maximum peak current, I C1max, is specified at 2.0 A for a t C1max duration of 600 ns. Current sourced by terminal C1 during a large dV /d t will result in a negative voltage at terminal C1 (Figure 13). The minimum peak voltage V C1min is specified at -1.5 V for a duration of t C1max = 600 ns. A series resistor with the charge pump capacitor (Ccp) capacitor can be added in order to limit the surge current.Output DriverOUTOutput Driver OUTINL1M2GATE_LSSRC_HSGATE_HSInductiveFlyback VoltageClampIND c l M1VCCCP_OUTLR_OUTV GS < 14 VUnder AllConditionsFUNCTIONAL DEVICE OPERATIONPROTECTION AND DIAGNOSTIC FEATURESFigure 13. Limits of C1 Current and Voltage with Large Values of dV/dtIn the case of rapidly changing V CC voltages, the large dV/dt may result in perturbations of the high-side driver, thereby forcing the driver into an OFF state. The addition ofcapacitors C3 and C4, as shown in Figure 14, reduces the dV/dt of the source line, consequently reducing driverperturbation. Typical values for R3 / R 4 and C3 / C 4 are 10 Ω and 10 nF, respectively.DV/DT AT V CC2When the external high-side MOSFET is on, in case of rapid negative change of V CC2 the voltage (V GATE_HS -V SRC_HS ) can be higher than the specified 18 V. In this case a resistance in the SRC line is necessary to limit the current to 5.0 mA max. It will protect the internal zener placed between GATE_HS and SRC terminals.In case of high current (SRC_HS >100 mA) and high voltage (>20 V) between GATE_HSX and SRC_HS an external zener of 18 V is needed as shown in Figure 14.t C1maxt C1minV CCI (C1+C2)I C1maxI C1minV (LR_OUT)0 VV (C1)0 AV C1minTYPICAL APPLICATIONSTYPICAL APPLICATIONSFigure 14. Application Schematic with External Protection CircuitIN_LS2IN_HS2IN_LS1IN_HS1V BAT G_ENC1C2C CPC LR_OUT C CP_OUT MCUVCC2VCC V BOOST33883M1M2M3M4R1R2470nF 470nF 50Ω50Ω50Ω50Ω33nFDC MotorR310Ω10nFC310nFC410ΩR4IN_LS2IN_HS2IN_LS1IN_HS1G_EN C1C2VCC2VCC GNDGATE_LS2SRC_HS2GATE_HS2GATE_LS1SRC_HS1GATE_HS1LR_OUT CP_OUT 18 V18 V。

MITREK系列产品说明书

CONTROL HEADREF.NO.PART NO.DESCRIPTIONREF.NO.PART NO.DESCRIPTIONBAR COPY IF NECESSARYLOW BAND RADIO ASSEMBLY 284180175A01Spring (3.05 MM OD), pivot 290310904A02Screw (3.5 x 6-PH-M)300480149A01Washer, captivitate 313280074A02Gasket, cable plug341484391F01Insulator Mica, transistor 350484180C01Washer, shoulder (nylon)360310905A01Screw, (9.0 x 6-FIL-M), transistor 371483572K01Insulator Mica, transistor39HLN4033BCover, bottom inner w/gasket(includes 1580004A01, cover, and 3280129F01, gasket400310906A19Screw (3.5 x 13-FH-M), inner cover 414280013A01Clip, coax (dress)440180701T74Conn. and Feed Through Caps 470780079A01Bracket, IC board support 492910271A15Pin, terminal512880141H03Plug, male (2.54 CTRS) (25 post)542880096A01Plug, male (3.96 CTRS)(4 post)553280080A01Gasket, antenna connector560280006A01Nut, spanner, antenna connector 570400114522Washer, lock, antenna connector 581480077A01Insulator, P.A. compartment 590780078A01Bracket, thermal device 602980014A01Clip, coax (terminal)631480179A01Insulator, mica10980028A01Socket, transistor2HLN4034C Bottom Cover, assembly40310906A05Screw (3.5 x 6-FH-M) bottom cover latch50180252J01Top Cover, assembly 64680026A01Stud Latch, top cover 87580178A01Pad, compression 90180252J01Housing, frame 104780027A01Pushbutton, latch 134180029A01Spring, latch140780016A02Bracket, lock slide 150780015A02Support, lock slide 164180022A01Spring, lock170310936B15Screw (3.5 x 13-FM-TH) holds lock slide 185584101B01Lock203280081A01Gasket, lock support 214380150A01Sleeve, cover release 235580002A01Handle240780113B01Spring, torsion 264780021A01Pin, pivotREF.NO.PART NO.DESCRIPTIONREF.NO.PART NO.DESCRIPTIONBAR COPY IF NECESSARYHIGH BAND RADIO ASSEMBLY 370310905A01Screw (3.0 x 6-FIL-M)392980014A01Clip, coax (terminal)40HLN4033BCover, bottom inner w/gasket (includes 1580004A01, cover and 3280129F01, gasket)410310906A19Screw (3.5 x 13-FH-M)434280013A01Clip, coax 442680211A01Shield, PA 455584300B04Handle, nylon460180701T74Conn. and Feed Through Caps 490780079A01Bracket, IC board support 512910271A15Pin, terminal520980028A01Socket, transistor 542880141H03Plug, male (25 post)572880096A01Plug, male (4 post)581580008A01Housing610280045A01Nut, retainer M5x1620200007003Nut, 8-32 x 5⁄16x 1⁄8hex643280080A01Gasket, antenna connector 650280006A01Nut, spanner 660400114522Washer, lock 671480077A01Insulator, PA680780078A01Bracket thermistar mounting12684716D01Heatsink3HLN4034C Bottom Cover, assembly 50310906A05Screw (3.5 x 6-FH-M)60180252J01Top Cover, assembly 74680026A01Stud, latch97580178A01Pad, compression 114780027A01Push Button 144180029A01Spring, latch150780016A02Bracket, lock slide 160780015A02Support, lock slide 174180022A01Spring, lock180310936B15Screw (3.5 x 13-FH-TH)195584101B01Lock213280081A01Gasket, lock support 224380150A01Sleeve, cover release 245580002A01Handle250780113B01Spring, torsion 274780021A01Pin, pivot294180175A01Spring (3.05 MM OD)300310904A02Screw (3.5 x 6-PH-M)310480149A01Washer, captive 323280074A02Gasket, cable plug 351484391F01Insulator, mica360484180C01Washer, shoulder nylonREF.NO.PART NO.DESCRIPTIONREF.NO.PART NO.DESCRIPTIONUHF ASSEMBLY410310906A19Screw (3.5 x 13-FH-M)434280013A01Clip, coax442680211A01Shield, PA455584300B04Handle, nylon460180701T74Conn. and Feed Through Caps490780079A01Bracket, IC512910271A15Pin, terminal520980028A01Socket, transistor542880141H03Plug, male (2.54 CTRS) (25 post)572880096A01Plug, male (3.96 CTRS) (4 post)604680009A01Stud, coil M6x1614680010A01Stud, coil M8x1.25620380012A03Screw, set M6x1630380256A01Screw, set M8x1.75640280045A03Nut, retainer M6x1.0650280045A02Nut, retainer M8x1.25670200007003Nut, 8.32 x 5⁄16x 1⁄8hex680480083A01Washer, stud device703280080A01Gasket, antenna connector710280006A01Nut, spanner720400114522Washer, lock7314-80077A01Insulator, PA740780078A01Bracket, thermal mount752980014A01Clip, coax (terminal)760780157A01Support, transistor PA771580003A01Housing, filter (harmonic)12684716D01Heatsink3HLN4034C Bottom Cover, assembly 50310906A05Screw (3.5 x 6-FH-M) 60180252J01Top Cover, assembly 70780015A02Stud, latch97580178A01Pad, compression114780027A01Push Button144180029A01Spring, latch150780016A02Bracket, lock slide160780015A01Support, lock slide174180022A01Spring, lock180310936B15Screw (3.5 x 13-FH-TH) 195584101B01Lock213280081A01Gasket, lock support 224380150A01Sleeve, cover release 245580002A01Handle250780113B01Spring, torsion274780021A01Pin, pivot294180175A01Spring (3.05 MM OD) 300310904A02Screw (3.5 x 6-PH-M) 310480149A01Washer, captive323280074A02Gasket, cable plug351484391F01Insulator, mica360484180C01Washer, shoulder370310905A01Screw (3.05 x 6-FIL-M) 390310936B06Screw (3.5 x 8-FILM-TF)40HLN4033B Cover, bottom inner w/gasket(includes 15-80004A01, cover)MOBILE MICROPHONESHMN1015AHLN4024Bmode while still on-hook arealso available.HLN4024BHang-up BoxHLN4025ATLN4698BCradle, Private-LineTLN4507ACradle with Slide SwitchTLN4505BCradle, Carrier SquelchHSN4009ACONTROL HEADSHLN4022EHLN4012ANOISE REDUCTION KITSSingle HousingConsists of a single housing with standard trunnion which can accommodate one, one board option and one alterna-tive control module.THN6125A HLN1002ATLN1391ATHN6125AMITREK SYSTEMS•90 ACCESSORIESHSN4010A Microphone Hang-upHLN4188AMOBILE ANTENNASRAB4012ARA RAB4013ARA&RAB4014ARA 6680385A04RSX4028AService Aids, Manuals SERVICE AIDSTEKA48。

LM338参数-PDF文件格式

LM138/LM3385-Amp Adjustable RegulatorsGeneral DescriptionThe LM138series of adjustable 3-terminal positive voltage regulators is capable of supplying in excess of 5A over a 1.2V to 32V output range.They are exceptionally easy to use and require only 2resistors to set the output voltage.Careful circuit design has resulted in outstanding load and line regulation —comparable to many commercial power supplies.The LM138family is supplied in a standard 3-lead transistor package.A unique feature of the LM138family is time-dependent cur-rent limiting.The current limit circuitry allows peak currents of up to 12A to be drawn from the regulator for short periods of time.This allows the LM138to be used with heavy tran-sient loads and speeds start-up under full-load conditions.Under sustained loading conditions,the current limit de-creases to a safe value protecting the regulator.Also in-cluded on the chip are thermal overload protection and safe area protection for the power transistor.Overload protection remains functional even if the adjustment pin is accidentally disconnected.Normally,no capacitors are needed unless the device is situ-ated more than 6inches from the input filter capacitors in which case an input bypass is needed.An output capacitor can be added to improve transient response,while bypass-ing the adjustment pin will increase the regulator’s ripple re-jection.Besides replacing fixed regulators or discrete designs,the LM138is useful in a wide variety of other applications.Since the regulator is “floating”and sees only the input-to-output differential voltage,supplies of several hundred volts can be regulated as long as the maximum input to output differential is not exceeded,i.e.,do not short-circuit output to ground.The part numbers in the LM138series which have a K suffix are packaged in a standard Steel TO-3package,while those with a T suffix are packaged in a TO-220plastic package.The LM138is rated for −55˚C ≤T J ≤+150˚C,and the LM338is rated for 0˚C ≤T J ≤+125˚C.Featuresn Guaranteed 7A peak output current n Guaranteed 5A output current n Adjustable output down to 1.2V n Guaranteed thermal regulationn Current limit constant with temperature n P +Product Enhancement tested nOutput is short-circuit protectedApplicationsn Adjustable power supplies n Constant current regulators n Battery chargersConnection Diagrams(See Physical Dimension section for further information)(TO-3STEEL)Metal Can PackageDS009060-30Bottom ViewOrder Number LM138K STEEL or LM338K STEELSee NS Package Number K02A(TO-220)Plastic PackageDS009060-31Front ViewOrder Number LM338T See NS Package Number T03BMay 1998LM138/LM3385-Amp Adjustable Regulators©1999National Semiconductor Corporation 查询LM338K供应商Absolute Maximum Ratings(Note1)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.(Note4)Power Dissipation Internally limited Input/Output Voltage Differential+40V,−0.3V Storage Temperature−65˚C to+150˚C Lead TemperatureMetal Package(Soldering,10seconds)Plastic Package(Soldering,4seconds)300˚C260˚C ESD Tolerance TBD Operating Temperature RangeLM138−55˚C≤T J≤+150˚C LM3380˚C≤T J≤+125˚CElectrical CharacteristicsSpecifications with standard type face are for T J=25˚C,and those with boldface type apply over full Operating Tempera-ture Range.Unless otherwise specified,V IN−V OUT=5V;and I OUT=10mA.(Note2)Symbol Parameter Conditions LM138UnitsMin Typ MaxV REF Reference Voltage3V≤(V IN−V OUT)≤35V, 1.19 1.24 1.29V10mA≤I OUT≤5A,P≤50WV RLINE Line Regulation3V≤(V IN−V OUT)≤35V(Note3)0.0050.01%/V0.020.04%/V V RLOAD Load Regulation10mA≤I OUT≤5A(Note3)0.10.3%0.30.6%Thermal Regulation20ms Pulse0.0020.01%/W I ADJ Adjustment Pin Current45100µA ∆I ADJ Adjustment Pin Current Change10mA≤I OUT≤5A,0.25µA3V≤(V IN−V OUT)≤35V∆V R/T Temperature Stability T MIN≤T J≤T MAX1% I LOAD(Min)Minimum Load Current V IN−V OUT=35V 3.55mA I CL Current Limit V IN−V OUT≤10VDC58A0.5ms Peak712AV IN−V OUT=30V11A V N RMS Output Noise,%of V OUT10Hz≤f≤10kHz0.003%Electrical Characteristics(Continued)Symbol Parameter Conditions LM338UnitsMin Typ Max∆V R/T Temperature Stability T MIN≤T J≤T MAX1% I LOAD(Min)Minimum Load Current V IN−V OUT=35V 3.510mA I CL Current Limit V IN−V OUT≤10VDC58A0.5ms Peak712AV IN−V OUT=30V1A V N RMS Output Noise,%of V OUT10Hz≤f≤10kHz0.003%Typical Performance Characteristics(Continued)Application HintsIn operation,the LM138develops a nominal 1.25V reference voltage,V REF ,between the output and adjustment terminal.The reference voltage is impressed across program resistor R1and,since the voltage is constant,a constant current I 1then flows through the output set resistor R2,giving an out-put voltage ofTemperature StabilityDS009060-38Output ImpedanceDS009060-39Minimum Operating CurrentDS009060-40Ripple Rejection DS009060-41Ripple Rejection DS009060-42Ripple RejectionDS009060-43Line Transient Response DS009060-44Load Transient ResponseDS009060-45 4Application Hints(Continued)Since the 50µA current from the adjustment terminal repre-sents an error term,the LM138was designed to minimize I ADJ and make it very constant with line and load changes.To do this,all quiescent operating current is returned to the output establishing a minimum load current requirement.If there is insufficient load on the output,the output will rise.External CapacitorsAn input bypass capacitor is recommended.A 0.1µF disc or 1µF solid tantalum on the input is suitable input bypassing for almost all applications.The device is more sensitive to the absence of input bypassiing when adjustment or output capacitors are used but the above values will eliminate the possiblity of problems.The adjustment terminal can be bypassed to ground on the LM138to improve ripple rejection.This bypass capacitor prevents ripple from being amplified as the output voltage is increased.With a 10µF bypass capacitor 75dB ripple rejec-tion is obtainable at any output level.Increases over 20µF do not appreciably improve the ripple rejection at frequen-cies above 120Hz.If the bypass capacitor is used,it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device.In general,the best type of capacitors to use are solid tanta-lum.Solid tantalum capacitors have low impedance even at high frequencies.Depending upon capacitor construction,it takes about 25µF in aluminum electrolytic to equal 1µF solid tantalum at high frequencies.Ceramic capacitors are also good at high frequencies;but some types have a large decrease in capacitance at frequencies around 0.5MHz.For this reason,0.01µF disc may seem to work better than a 0.1µF disc as a bypass.Although the LM138is stable with no output capacitors,like any feedback circuit,certain values of external capacitance can cause excessive ringing.This occurs with values be-tween 500pF and 5000pF.A 1µF solid tantalum (or 25µF aluminum electrolytic)on the output swamps this effect and insures stability.Load RegulationThe LM138is capable of providing extremely good load regulation but a few precautions are needed to obtain maxi-mum performance.The current set resistor connected be-tween the adjustment terminal and the output terminal (usu-ally 240Ω)should be tied directly to the output of the regulator (case)rather than near the load.This eliminates line drops from appearing effectively in series with the refer-ence and degrading regulation.For example,a 15V regula-tor with 0.05Ωresistance between the regulator and load will have a load regulation due to line resistance of 0.05Ωx I L .If the set resistor is connected near the load the effective line resistance will be 0.05Ω(1+R2/R1)or in this case,11.5times worse.Figure 2shows the effect of resistance between the regula-tor and 240Ωset resistor.With the TO-3package,it is easy to minimize the resistance from the case to the set resistor,by using 2separate leads to the case.The ground of R2can be returned near the ground of the load to provide remote ground sensing and improve load regulation.Protection DiodesWhen external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to prevent the capacitors from discharging through low current points into the regulator.Most 20µF capacitors have low enough internal series resistance to deliver 20A spikes when shorted.Although the surge is short,there is enough energy to damage parts of the IC.When an output capacitor is connected to a regulator and the input is shorted,the output capacitor will discharge into the output of the regulator.The discharge current depends on the value of the capacitor,the output voltage of the regu-lator,and the rate of decrease of V IN .In the LM138this dis-charge path is through a large junction that is able to sustain 25A surge with no problem.This is not true of other types of positive regulators.For output capacitors of 100µF or less at output of 15V or less,there is no need to use diodes.The bypass capacitor on the adjustment terminal can dis-charge through a low current junction.Discharge occurs when either the input or output is shorted.Internal to the LM138is a 50Ωresistor which limits the peak discharge cur-rent.No protection is needed for output voltages of 25V or less and 10µF capacitance.Figure 3shows an LM138with protection diodes included for use with outputs greater than 25V and high values of output capacitance.DS009060-6FIGURE 1.DS009060-7FIGURE 2.Regulator with Line Resistance in Output Lead5Application Hints(Continued)DS009060-8D1protects against C1D2protects against C2FIGURE3.Regulator with Protection Diodes 6Typical ApplicationsRegulator and Voltage ReferenceDS009060-31.2V–25V Adjustable RegulatorDS009060-1Temperature ControllerDS009060-10Full output current not available at high input-output voltages†Optional —improves transient response.Output capacitors in the range of 1µF to 1000µF of aluminum or tantalum electrolytic are commonly used to provide improved output impedance and rejection of transients.*Needed if device is more than 6inches from filter capacitors.**R1=240Ωfor LM138.R1,R2as an assembly can be ordered from Bourns:MIL part no.7105A-AT2-502COMM part no.7105A-AT7-5027Schematic DiagramD S 009060-9 8Typical ApplicationsPrecision Power Regulator with Low Temperature CoefficientDS009060-12*Adjust for3.75across R1Slow Turn-On15V RegulatorDS009060-13Adjustable Regulator with Improved Ripple RejectionDS009060-14†Solid tantalum*Discharges C1if output is shorted to ground**R1=240Ωfor LM138High Stability10V RegulatorDS009060-15Digitally Selected OutputsDS009060-16*Sets maximum V OUT**R1=240Ωfor LM1389Typical Applications(Continued)15A RegulatorDS009060-17 *Minimum load—100mA5V Logic Regulator with Electronic Shutdown**DS009060-18**Minimum output≈1.2VLight ControllerDS009060-11 10Typical Applications(Continued)0to22V RegulatorDS009060-19*R1=240Ω,R2=5k for LM138Full output current not availableat high input-output voltages12V Battery ChargerDS009060-2011Typical Applications(Continued)Adjustable Current RegulatorDS009060-21Precision Current LimiterDS009060-225A Current Regulator DS009060-23Tracking PreregulatorDS009060-24Adjusting Multiple On-Card Regulators with Single Control *DS009060-25†Minimum load —10mA *All outputs within ±100mV 12Typical Applications(Continued)Power AmplifierDS009060-27A V=1,R F=10k,C F=100pFA V=10,R F=100k,C F=10pFBandwidth≥100kHzDistortion≤0.1%Simple12V Battery ChargerDS009060-28Use of R S allows low charging rates with fully charged battery.**The1000µF is recommended to filter out input transients13Typical Applications(Continued)Adjustable 15A RegulatorDS009060-26Current Limited 6V ChargerDS009060-29*Set max charge current to 3A**THE 1000µF is recommended to filter out input transients.10A RegulatorDS009060-2*Minimum load —100mA 14Physical Dimensions inches(millimeters)unless otherwise noted2Lead TO-3Metal Can Package(K)Order Number LM138K or LM338K STEELNS Package Number K02A3Lead Molded TO-220(T)Order Number LM338TNS Package Number T03B15LIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-CONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or sys-tems which,(a)are intended for surgical implant intothe body,or (b)support or sustain life,and whose fail-ure to perform when properly used in accordancewith instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:support@National Semiconductor EuropeFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)180-5308585English Tel:+49(0)180-5327832Français Tel:+49(0)180-5329358Italiano Tel:+49(0)180-5341680National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:sea.support@National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507L M 138/L M 3385-A m p A d j u s t a b l e R e g u l a t o r sNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.。

MIM-3337K3F中文资料

INFRARED RECEIVER MODULE MIM-3xx7K3F DescriptionFeaturesl Photo detector and preamplifier in one packagel Internal filter for PCM frequencyl High immunity against ambient lightl Improved shielding against electric field disturbancel 3.0-Volt supply voltage; low power consumptionl TTL and CMOS compatibilityMIM-3xx7K3F Series Modelsl MIM-3337K3F 32.7KHzl MIM-3377K3F 36.7KHzl MIM-3387K3F 37.9KHzl MIM-3407K3F 40.0KHzl MIM-3567K3F 56.7KHzBLOCK DIAGRAMREV: A1Absolute Maximum RatingsItem Symbol Ratings Unit RemarkSupply voltage Vs-0.3 ~ 6.0VSupply Current Is 2.5mAOperating temperature T opr-25 ~ + 85o CStorage temperature T stg-25 ~ + 85o CSoldering temperature T sd260o C t≦5 s, 1mm from caseJunction Temperature T j100o CElectro-optical characteristics (Vcc=3.0V)Parameter Symbol Min.Typ.Max.Unit RemarksSupply Voltage Vs 2.7 3.0 5.5VCurrent consumption Icc 1.1 2.5mA Under no signal Response wavelength l p940nmOutput form - - - - - active low output - - - - -H level output voltage V0h 2.8 3.0VL level output voltage V0l0.20.4VH level output pulse width Twh500800m sL level output pulse width Twl500800m sDistance between emitter & detector L110.0m Note 1Half angle Dq±45deg Horizonal directionTest MethodA. Standard TransmitterREV: A1B. Detection Length TestC . Pulse Width TestApplication CircuitREV: A1Dimensions in mmREV: A1CHARACTERISTIC CURVES (T A=25o C)REV: A1INFRARED RECEIVER MODULE MIM-3xx7K3F ReliabilityTest item Test condition StandardHigh temparature Ta=+80o C t=240H Note 2.High temp. & high humi.Ta=+40o C 90%RH t=240H Note 2.Low temparature Ta= -25o C t=240H Note 2.Temperature cycle -25o C(0.5H) ~ +80o C(0.5H) 20cycle Note 2.Dropping Test devices shall be dropped 3 times naturally Note 3.onto hard wooden board from a 75cm height position.NOTE 1. Distance between emitter & detector specifies maximum distance that output wave form satisfiesthe standard under the conditions below against the standerd transmitter.(1)Measuring place ………Indoor without extreme reflection of light.(2)Ambient light source… Detecting surface illumination shall be 200±50Lux under ordinaryhite fluorescense lamp of no high frequency lighting.(3)Standard transmitter … Burst wave indicated in Fig 1. of standard transmittershall be arranged to 50mVp-p under the measuring circuit specified in Fig 2.NOTE 2. (electro-optical charactistics) shall be satisfied after leaving 2 hours in the normal temperature .NOTE 3. (electro-optical charactistics) shall be satisfied and no conoid deformsand destructions of appearance .(excepting deforms of terminals)Inspection standard1.Among electrical characteristics , total number shall be inspected on items blow.1-1 front distance between emitter & detector1-2 Current consumption1-3 H level output voltage1-4 L level output voltage2.Items except above mentioned are not inspected particularly , but shall fully satisfyCAUTION ( When use and storage of this device )1.Store and use where there is no force causing transformation or change in quality .2.Store and use where there is no corrosive gas or sea(salt) breeze .3.Store and use where there is no extreme humidity .4.Solder the lead-pin within the condition of ratings. After soldering do not add extra force .5.Do not wash this device . Wipe the stains of diode side with a soft cloth. You canuse the solvent , ethylalcohol or methylalcohol or isupropylene only .6.To prevent static electricity damage to the Pre-AMP make sure that the human body, the soldering iron is connected to ground before using .7.Put decoupling device between Vcc and GND for reduse the noise from power supply line .8.The performance of remote-control system depends on environments condition and abilityof periferal parts. Customer should evaluate the performance as total system in those conditionsafter system up with components such as commander , micon and this receiver module .Others1.This device is not design to endure radiative rays and heavily charged particles .2.In case where any trouble or questions arise,both parties agress to make full discussioncovering the said problem .REV: A1。

MSA338仪器操作说明

MICRONIX 338频谱仪工程操作说明一、仪器理论1、概述MICRONIX 338频谱仪在工程上主要用于测试空中信号（调制之后，解调之前）场强、观察频谱。

2、配件构成MICRONIX 338频谱仪、跳线、SMA/N接头、接收天线（外加数据线和导图软件）3、面板介绍FREQ：设置观察频谱的中心频率SPAN：设置扫描频谱的范围，当该参数设置为零时，横轴代表时间轴而不是频率轴REFER：设置参考电平，即将纵轴上可观察到的最高电平值作为参考电平，其设置范围建议在-40dBm至+10dBm之间RBW：分辨率带宽，表示扫描的步长，值越小越能分辨出小功率信号，容易将底噪和有用信号分辨出来，但扫描速度越慢，即扫描时间SWEEP值越大VBW：视频带宽，表示采样频率，对读数不大，该参数设置得越小，波形曲线越平滑，设置得越大，毛刺越多，直接影响视觉效果AUTOTUNE：自动捕捉键，输入信号的峰值频谱将自动被搜索并出现在屏幕中心MEAS：测量键（CH POWER测量信道功率；ADJ CH PW 测量相邻信道功率；OCC BW 测量占用带宽；E/F ANT 电场强测量；M/F PROBE磁场强测量；F6重新选择模式）CALC：计算键，在一定次数的扫描完成后，每点轨迹将显示计算结果（NORM无限次进行扫描并更新轨迹；MAXHD在完成调节旋钮设置的扫描次数后，保持每点轨迹的最大值；MINHD在完成调节旋钮设置的扫描次数后，保持每点轨迹的最小值；A VER在完成调节旋钮设置的扫描次数后，显示每点轨迹的平均值。

）SCALE：设置纵轴每栅格代表的电平值（10dBm/2dBm）SWEEP：扫描一次SPAN范围内的频谱所需的时间HOLD/RUN：捕捉单次扫描数据/连续扫描MKR：显示/不显示标记（NORM用旋钮设置频标位置；DELTA增量，即频标位置变化的步长；PEAK最大峰值位置；CONN改变频点功率显示单位dBm/W）SA VE/LOAD：保存/调用数据PRINT：启动导出数据打印RS232C/MHz：一种计算机串口标准，启动数据传输/频率单位键DSPL/GHz：显示控制键，设定对比度、亮度/频率单位键4、注意事项A、由于待测信号的未知性和不稳定性，为了更好地保证仪器的安全，请先设置好参数后，再接入信号B、MSA338频谱仪允许输入的最大信号电平值为+20dBm，超过该上限，易导致仪器烧毁，因此，请不要将超过+20 dBm的信号接入MSA338频谱仪，且在设置仪器参数时，建议先将REFER设置为最大值10dBm，以此更好地保证仪器的安全性C、请注意，如果没有需要，请不要随意按AUTOTUNE键，否则所有参数设置将恢复原始状态，即要重新进行参数设置才能进行信号测量。

义隆中文资料 EM78P447S中文

EM78P447S
8位 OTP 微控制器
产品规Байду номын сангаас书
版本 1.7
义隆电子股份有限公司
2009.11
本文内容是由英文规格书翻译而来，目的是为了您的阅读更加方便。它无法跟随原稿的更新，文中可能存在翻译上的错误，请您参考英文规格书以获得更准确的信息。
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IBM 为一个注册商标，PS/2 是 IBM 的商标之ㄧ.。
4.5 复位和唤醒 ..................................................................................................... 16
4.5.1 复位................................................................................................................... 16 4.5.2 状态寄存器的 RST, T, 和 P 的状态 ....................................................................... 20
Korea:
Elan Korea Electronics Company, Ltd.
301 Dong-A Building 632 Kojan-Dong, Namdong-ku Incheon City, KOREA Tel: +82 32 814-7730 Fax:+82 32 813-7730
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Mitsumi Electric Co., Ltd. Wavit11 User's Manual.p

Wavit11 User’s Manual Revision 1.01Revision HistoryDecember 6, 2001 Revision 1.0 Translated from Japanese edition (Rev. 1.0) January 19, 2002 Revision 1.01 Regulatory Compliance Notice changedContentsRevision History (2)About This Guide (5)Regulatory Compliance Notices (6)1. Preface (8)1. Preface (8)2. Accompanied Accessories (8)3. Features (8)4. How to use Wavit11 (9)5. About Wireless LAN Network (10)5.1. Ad-Hoc LAN (11)5.2. IBSS LAN (12)5.3. Infrastructure LAN (13)5.4. Wireless Bridge (14)6. Installation method of Wavit11 Configuration Utility (15)6.1. Microsoft Windows Version (16)6.2. Confirm an Ethernet port (17)6.3. Confirm the TCP/IP protocol (19)6.4. Confirm an IP Address (25)6.5. Installation of the Wavit11Configuration Utility (28)7. Wavit11 Set Up (33)7.1. How to Start the Wavit11Configuration Utility (34)7.2. How to setup the Ad-Hoc mode (38)7.3. How to Setup the 802.11 Ad-Hoc mode (41)7.4. How to Setup the Infrastructure mode (44)7.5. How to Setup the Both mode (47)7.6. How to Setup the AP mode (51)7.7. How to Setup the Wireless Bridge Mode (55)7.8. How to Change the Wavit11 IP address (59)7.9. How to Change the Control Password (61)7.10. Wavit11 Initialization (63)8. Encryption Setting (65)8.1. Encryption setting (65)8.2. Original Encryption (68)8.2. 40bit WEP Encryption (71)8.3. 128bit WEP Encryption (74)8.4. Encryption Disable (77)9. Wavit11Setting up (79)9.1. Connection to personal computer (80)9.2. Connection to Printer (81)9.3. Connection to Network Equipment (82)10. Items that can be set with Configuration Utility (83)10.1. Operational Mode (84)10.2. SS ID (85)10.3. Channel (86)10.4. Data Rate (87)10.5. Roaming (88)10.6. Hidden Node Compensation (89)10.7. Details (90)10.8. RTS Threshold (91)10.9. Fragmentation Threshold (92)10.10. Short Retry Limit (93)10.11. Long Retry Limit (94)10.12. Beacon Interval (95)10.13. SSID transmission (96)10.14. Authentication Algorithm (97)10.15. Basic Rate Set (98)10.16. Encryption mode (99)10.17. Encryption Key (100)10.18. Default Key (101)10.19. Destination Address (102)11. Interoperability with third vendor wireless LAN (103)11.1. Confirmed wireless LAN card (103)11.2. Confirmed Access Point (104)11.3. Setting (105)12. Troubleshooting (106)13. Specifications (108)About This GuideAbsolutely do not do the operation when the instruction is given with this mark.Please pay attention in the case you do the operation indicated with this mark.The relevant usage is explained. Please refer, as occasion demands. This is for an explanation such as terminology.Regulatory Compliance NoticesWavit is a registered trademark of Mitsumi Electric Co., Ltd.Wi-Fi TM is a registered trademark of Wireless Ethernet Compatibility Alliance. RC4 is a registered trademark of RSA Security Inc. in United State and other country.Microsoft, Windows, and Windows NT are trademarks of Microsoft Corporation.All company names and product names are trademark of their respective companies.Mitsumi are not responsible for any damage or loss caused by the Wavit11 Wireless LAN.Mitsumi hold the copyright on this User’s Manual. Anyone cannot copy or reproduce this User’s manual unless Mitsumi grant agreement in writing form.If this product is used near the television set or radio receiver, the TV display may be sometimes disturbed or the noise may be heard in audio output. In such a situation, it will be necessary to install this product far from TV and radio set. This product may affect the medical apparatus, so you cannot install this product inside a hospital.If you install this product near the microwave oven,communication performances may degrade due to the radio waveemitted from microwave oven. Install this product far from microwave oven or prevent from the simultaneous usage.Accompanied AC adapter is designed for 117volts AC use only.The use of AC other than 117volts is dangerous and not permitted.The use of other AC adapters is prohibited. If other AC adapters were used, the product would heat or it may lead to a fire.1. PrefaceThank you for purchasing the Wavit11. This user’s manual includes various notices to allow you to use the Wavit11 safely and properly. Keep this anytime and read carefully. In this way, you can always refer to this.2. Accompanied AccessoriesThe following accessories are accompanied to Wavit11.If you could not check all accessories, contact with the distributor.AccessoriesItem QuantityNoteWavit11 Wireless LAN 1AC Adapter 1Ethernet Cable 1 Straight Cable (1m)Wall Mount Attachment 1User’s Manual 1 This documentWavit11 Configuration Utility 1 3.5 inch Floppy disk3. FeaturesThe Wavit11 is standalone wireless LAN with 10BASE-T interface. When using Wavit11, you can install wireless network not only to personal computers but also to printer and other network equipment that have 10BASE-T ports. The Wavit11 is connected to network devices with 10BASE-T cable, so you do not need to install device drivers to set up Wavit11.The Wavit11 operates as Access Point that supports up to 16 Wavit11. Also, it operates as Wireless Bridge. Wireless Bridge connects two networks that are physically separated by two Wavit11s.Wavit11Wireless LANAC Adapter EthernetCableWall MountAttachmentUsersManual ConfigurationUtility5. About Wireless LAN NetworkThere are 4 types of wireless LAN network that using Wavit11.Make a selection according to the usage of the wireless LAN network. Wireless LAN Type FunctionAd-Hoc LAN The network consists of only wireless clients.IBSS LAN The network consists of only wireless clients. Infrastructure LAN The network combined both wired and wireless clients. Wireless Bridge The network connects two networks wirelessly.5.1. Ad-Hoc LANThe Ad-Hoc LAN is a network consisting of only wireless LAN. It is the network that does not connect to the Ethernet backbone and external network such as Internet. There is not a restriction on the number of wireless LAN units in the Ad-Hoc LAN.Set the communication mode of Wavit11 to “Ad-Hoc” mode.5.2. IBSS LANThe IBSS LAN is a network of only wireless LAN. It is the network that does not communicate to the Ethernet backbone and external network such as Internet. There is not a restriction on the number of wireless LAN units in the IBSS LAN. Set the communication mode of Wavit11 to “802.11 Ad-Hoc” mode.5.3. Infrastructure LANCommunication is established via an Access Point in the infrastructure LAN, therefore direct communication with other Wavit11s is not possible. This is the network that is used in such an occasion where Ethernet is being connected to Access Point and Internet access is carried out through Ethernet.Set the communication mode of one Wavit11 to “AP” mode and set the other Wavit11 communication mode to “Infrastructure” mode.5.4. Wireless BridgeThe Wireless Bridge connects two wired network using two Wavit11. The maximum number of network equipment that can be connected to wired LAN is 16.Set the communication mode of Wavit11 to “Wireless Bridge” mode.6. Installation method of Wavit11 Configuration Utility6.1. Microsoft Windows VersionWavit11 Configuration Utility runs on Microsoft Windows of the following version.OS Status NotesWindows95 Install 4.01 or above Internet Explorer Windows95 OSR2 Install 4.01 or above Internet Explorer Windows95OSR2.5Install 4.01 or above Internet Explorer Windows98 OKWindows98 SE OKWindows Me OKWindows NT 4.0 WorkStation Install 4.01 or above Internet Explorer Windows NT SP3 is required to install Internet Explorer 4.01.Windows 2000 OK Windows XP OK6.2. Confirm an Ethernet portWavit11 Configuration Utility should be installed to the personal computer with Ethernet port. Also, the device driver needs to be set up appropriately. Confirm in accordance with the following procedure.[STEP1] Select “Start”->”Setting”->”Control Panel”.[STEP2] Click “Network” icon in the control panel.[STEP3] Check to see t hat an Ethernet adapter is installed in “Configuration” page.[STEP4] Click the “Cancel” button.6.3. Confirm the TCP/IP protocolThe TCP/IP protocol should be installed to the personal computer with Wavit11 Configuration Utility. It is necessary that Wavit11 Configuration Utility is set up appropriately. Confirm the TCP/IP protocol in accordance with the following procedure.[STEP1] Select “Start”->”Setting”->”Control Panel”[STEP2] Click “Network” icon in the “Control Panel”.[STEP3] Check to see that the relevant TCP/IP protocol is installed that corresponds to the Ethernet adapter used in the “Configuration” page. Select TCP/IP protocol corresponding to the Ethernet adapter and click the “Properties” button.[STEP4] Confirm your selection in the “IP address” page. Which one is selected, either “Obtain an IP address automatically” or “Specify an IP address”?[STEP5] Click “Cancel” button.[STEP6] Click “Cancel” button.[STEP10] In the case that “Specify an IP address” is selected in the “IP Address” page, check that the “IP Address” and “Subnet Mask” are set.[STEP11] Click the “Cancel” button.[STEP12] Click the “Cancel” button.6.4. Confirm an IP Address[STEP1] Click “Start”->”Run”[STEP2] Input “winipcfg” to “Open” and click “OK” button.[STEP3] Select Ethernet adapter at “Adapter Address” in “IP Configuration” window.[STEP4] Confirm the “IP Address” and “Subnet Mask”.[STEP5] Click “OK” button.6.5. Installation of the Wavit11Configuration Utility [STEP1] Insert Wavit11Configuration Utility disk to drive A. [STEP2] Click “My Computer” icon.[STEP3] Click “3.5 ½ floppy (A:)” icon.[STEP4] Click “Setup” icon.The “Install Shield Wizard” window appears.[STEP5] Click the “Next>” button in “Install Shield Wizard” window.[STEP6] Select “Destination Folder”. Click “Next>” button to install the Configuration Utility to the default folder. Click the “Browse” button in the case that you want to install to a different folder.[STEP7] Select Program Folder. Click “Next>” button if you agree the default folder. If you prefer to install it to another folder, select from the “Existing Folders” and click “Next” button.The “Setup Status” appears.[STEP8] Install Shield Wizard Complete appears. Click the “Finish” button.。

MAXIM MAX338 MAX339 数据手册

The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ωmax, and the devices conduct current equally well in both directions.These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resis-tance, see the MAX328 and MAX329.The MAX338/MAX339 operate from a single +4.5V to +30V supply or from dual supplies of ±4.5V to ±20V.All control inputs (whether address or enable) are TTL compatible (+0.8V to +2.4V) over the full specified tem-perature range and over the ±4.5V to ±18V supply range. These parts are fabricated with Maxim’s 44V sili-con-gate process.________________________ApplicationsData-Acquisition Systems Sample-and-Hold Circuits Test Equipment Heads-Up Displays Military RadiosCommunications Systems Guidance and Control SystemsPBX, PABX____________________________Features♦On-Resistance, <400Ωmax ♦Transition Time, <500ns ♦On-Resistance Match, <10Ω♦NO-Off Leakage Current, <20pA at +25°C ♦1.5pC Charge Injection♦Single-Supply Operation (+4.5V to +30V)Bipolar-Supply Operation (±4.5V to ±20V)♦Plug-In Upgrade for Industry-Standard DG508A/DG509A ♦Rail-to-Rail Signal Handling ♦TTL/CMOS-Logic Compatible♦ESD Protection >2000V, per Method 3015.7Ordering InformationMAX338/MAX3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers________________________________________________________________Maxim Integrated Products 1_____________________Pin Configurations/Functional Diagrams/Truth Tables19-0272; Rev 3; 11/04Ordering Information continued at end of data sheet.*Contact factory for dice specifications.**Contact factory for availability.For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .General DescriptionM A X 338/M A X 3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS—Dual Supplies(V+ = +15V, V- = -15V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Referenced to V-V+............................................................................-0.3V, 44V GND.........................................................................-0.3V, 25V Digital Inputs, NO, COM (Note 1)...........(V- - 2V) to (V+ + 2V) or30mA (whichever occurs first)Continuous Current (any terminal)......................................30mA Peak Current, NO or COM(pulsed at 1ms, 10% duty cycle max)..........................100mAContinuous Power Dissipation (TA = +70°C)Plastic DIP (derate 10.53mW/°C above +70°C)..........842mW Narrow SO (derate 8.70mW/°C above +70°C)............696mW 16-Pin TQFN (derate 21.3mW/°C above +70°C).......1702mW CERDIP (derate 10.00mW/°C above +70°C)...............800mW Operating Temperature RangesMAX33_C__........................................................0°C to +70°C MAX33_E__......................................................-40°C to +85°C MAX33_MJE ..................................................-55°C to +125°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10sec).............................+300°CNote 1:Signals on NO, COM, EN, A0, A1, or A2 exceeding V+ or V- are clamped by internal diodes. Limit forward current to maximum current ratings.MAX338/MAX3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS—Dual Supplies (continued)(V+ = +15V, V- = -15V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)M A X 338/M A X 3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—Single Supply(V+ = +12V, V- = 0V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)Note 2:The algebraic convention where the most negative value is a minimum and the most positive value a maximum is used inthis data sheet.Note 3:Guaranteed by design.Note 4:ΔR ON = R ON(MAX)- R ON(MIN).Note 5:Leakage parameters are 100% tested at the maximum rated hot temperature and guaranteed by correlation at +25°C.Note 6:Worst-case isolation is on channel 4 because of its proximity to the drain pin. Off isolation = 20log V COM /V NO , whereV COM = output and V NO = input to off switch.MAX338/MAX3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers_______________________________________________________________________________________5600ON-RESISTANCE vs. V COM(DUAL SUPPLIES)500010*******-2020-1515-1010-55400V COM (V)R O N (Ω)ON-RESISTANCE vs. V COM OVER TEMPERATURE (DUAL SUPPLIES)100200300-1515-1010-550400V COM (V)R O N (Ω)12001400ON-RESISTANCE vs. V COM(SINGLE SUPPLY)100002004006001520105800V COM (V)R O N (Ω)600700ON-RESISTANCE vs. V COM OVER TEMPERATURE (SINGLE SUPPLY)500010020030015105400V COM (V)R O N (Ω)30CHARGE INJECTION vs. V COM200-30-20-100-1515-1010-55010V COM (V)Q j (p C )40100.0001-55125OFF LEAKAGE vs. TEMPERATURE1TEMPERATURE (°C)O F F L E A K A G E (n A )250.010.001-35-15650.1100100045851055100.0001-55125ON LEAKAGE vs. TEMPERATURE1TEMPERATURE (°C)O N L E A K A G E (n A )250.010.001-35-15650.11001000458510551000.001-55125SUPPLY CURRENT vs. TEMPERATURE10TEMPERATURE (°C)I +, I - (μA )250.10.01-35-156514585105510006001000900800700TRANSITION TIME vs.POWER SUPPLIES5000100200300OR 10V(SINGLE)OR 5V(SINGLE)400SUPPLY VOLTAGE (V)t T R A N S (n S )__________________________________________Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)__________Applications InformationOperation withSupply Voltages Other than 15VUsing supply voltages less than ±15V will reduce the analog signal range. The MAX338/MAX339 switches operate with ±4.5V to ±20V bipolar supplies or with a +4.5V to +30V single supply. Connect V- to GND when operating with a single supply. Both device types can also operate with unbalanced supplies such as +24V and -5V. The Typical Operating Characteristics graphs show typical on-resistance with 20V, 15V, 10V, and 5V supplies. (Switching times increase by a factor of two or more for operation at 5V.)Overvoltage ProtectionProper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maxi-mum ratings, because stresses beyond the listed rat-ings may cause permanent damage to the devices.Always sequence V+ on first, then V-, followed by the logic inputs NO and COM. If power-supply sequencing is not possible, add two small signal diodes in series with supply pins for overvoltage protection (Figure 1).Adding diodes reduces the analog signal range to 1V below V+ and 1V above V-, but does not affect the devices’ low switch resistance and low leakage charac-teristics. Device operation is unchanged, and the differ-ence between V+ and V- should not exceed 44V.M A X 338/M A X 3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers 6_____________________________________________________________________________________________________________________________________________________Pin DescriptionFigure 1. Overvoltage Protection Using External Blocking DiodesMAX338/MAX3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers_______________________________________________________________________________________7______________________________________________Test Circuits/Timing DiagramsFigure 2. Transition TimeM A X 338/M A X 3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers 8________________________________________________________________________________________________________________________Test Circuits/Timing Diagrams (continued)Figure 5. Charge InjectionMAX338/MAX3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers_______________________________________________________________________________________9_________________________________Test Circuits/Timing Diagrams (continued)Figure 6. Off-Isolation Figure 7. CrosstalkFigure 8. NO/COM CapacitanceM A X 338/M A X 3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers 10______________________________________________________________________________________________Pin Configurations/Functional Diagrams/Truth Tables (continued)A2A1A0EN ON SWITCH X 00001111X 00110011X 01010101011111111None 12345678MAX338LOGIC “0” V AL ≤ 0.8V, LOGIC “1” V AH ≥ 2.4VA1A0EN ON SWITCH X 0011X 010101111None 1234MAX339LOGIC “0” V AL ≤ 0.8V, LOGIC “1” V AH ≥ 2.4VMAX338/MAX3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers______________________________________________________________________________________11Ordering Information (continued)*Contact factory for dice specifications.**Contact factory for availability.Pin Configurations/Functional Diagrams/Truth Tables (continued)M A X 338/M A X 3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog Multiplexers 12________________________________________________________________________________________________________________________________________________Chip TopographiesV+NO3EN 0.114"(2.89mm)0.078"(1.98mm)COM NO8NO5NO6N07A0A1A2GNDNO2 NO1 V-N.C.NO4V+NO3AEN0.114"(2.89mm)0.078"(1.98mm)COMA COMB NO1B NO2B N04BA0A1N.C.GNDNO2A NO1A V-NO3BNO4ATRANSISTOR COUNT: 224SUBSTRATE IS INTERNALLY CONNECTED TO V+Note:On Thin QFN packages connect exposed pad to V+.TRANSISTOR COUNT: 224SUBSTRATE IS INTERNALLY CONNECTED TO V+MAX338MAX339N.C. = NO INTERNAL CONNECTIONMAX338/MAX3398-Channel/Dual 4-Channel,Low-Leakage, CMOS Analog MultiplexersMa xim ca nnot a ssume responsibility for use of a ny circuitry other tha n circuitry entirely embodied in a Ma xim product. No circuit pa tent licenses a re implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________13©2004 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

lm338中文资料汇总（lm338引脚图功能

lm338中文资料汇总（lm338引脚图功能展开全文LM338可调三端稳压器提供5A的平均输出电流，输出电压范围为1.2V至32V连续可调。

LM338内置过载保护电路，自动限制功耗。

此保护电路允许瞬态负载强电流通过，12A以内的瞬态电流不会实施保护，以利于某些设备的顺利启动。

LM338稳压器特性：1.输出电流：5A2.允许瞬态电流：12A3.输出电压：1.2V~32V4.最高输入输出压差：35V5.线路调整率：0.005%6.负载调整率：0.1%7.工作温度：0~125℃LM338引脚图及其功能LM338有两种封装，分别是TO-3金属封装、TO-220塑料封装，以下是封装外形和引脚排列：LM338内部结构LM338应用电路（一）一种高精度大电流稳压电源电路。

该电路采用额定输出电流为5A 的三端稳压器LM338做成大电流可调稳压电源。

其特点是：（1）输出电流大。

额定电流为5A，最大允许峰值电流为7A。

（2）电路简单。

（3）电压调整率可达到0.012%N，漂移可达0.0005V/H。

（4）输出电压在1.25～32V之间可调。

LM338应用电路（二）LM338典型应用电路LM338应用电路（三）本电路的关键是LM338可调三端稳压器。

可以根据蓄电池充电过程中的不同状态，通过变换LM338的外电路使其具有“恒压”和“恒流”两种功能。

在本电路中当电池电压低于15V时，LM338恒流输出；当电池电压充到15V电压时，LM338自动变为恒压输出。

从而能很好地完成整个的设电过程。

这个电路是如何达到这一目的的呢。

由电压比较器LM393及稳压二极管组成恒流恒压切换电路，Z1的稳压值为15V（为了保证比较器可靠切换，在调试时让比较器IC1⑵脚略低于15V），当电池电压高于此值时，LM393⑶脚输出高电位，J1通电继电器吸合。

当电池电压低于此值时，LM393⑴脚输出低电位。

J1失电释放。

按钮开关K1处于分开位置时，对外供电，当需要充电时，按下K1，电池正极与继电器的第二组公用接点4脚接通，此时的电池电压低于15V．比较器|1脚输出低电位，三极管G1截止，继电器J1释放，⑾～⒀脚通，⑷~⑹脚通。

MA338 中文操作手册

Ver.1.1 中文仪器使用注意事项·使用仪器前，请阅读仪器背面的如下注意事项：·安全使用注意事项：1）发现仪器有异常的声音，气味和烟，应立即停止使用仪器，断开AC适配器的电池2）不要用湿手操作，否则可能导致仪器的损坏，失火和触电3）不要使用指定外的AC适配器，否则可能导致仪器的损坏，为防静电，尽可能使用三芯电源线，未接地可能导致仪器和被测物的损坏4）打雷时切勿使用仪器，否则可能导致仪器的损坏，失火和触电5）不要使用除指定型号以外的电池，否则可能导致仪器的损坏，当卸或安装电池时请确认已关闭电源和断开AC适配器6）更换保险丝时，断开AC适配器，打开背板的电池盖和卸掉电池，小心进行相关的操作，使用5A/250V(慢熔型)保险丝。

不要使用其它规格的保险丝，否则可能导致仪器的损坏，失火和触电。

·质量保证保修期：交付后一年，火灾，自然灾害，人为等造成的损坏不属保修范围·热机时间开机后，热机至少10分钟，可确保性能指标·保存注意事项严格遵守仪器的保存条件，如避免阳光的照射和灰尘储存仪器的环境温度为-20℃∽60℃，湿度小于70%RH(60℃),温度和湿度变化范围小·售后服务：目录1．概述 ־־־־־־־־־־־־־־ 11.1 产品介绍 ־־־־־־־־־־־־ 11.2 标准配件־־־־־־־־־־־־־ 21.3 可选附件־־־־־־־־־־־־־־ 2 2．规格־־־־־־־־־־־־־־־־ 32.1 性能־־־־־־־־־־־־־־־ 32.2概述־־־־־־־־־־־־־־־ 6 3．面板־־־־־־־־־־־־־־־־ 7 4．显示 ־־־־־־־־־־־־־־־ 10 5．功能鍵־־־־־־־־־־־־־־־115.1 功能菜单鍵一览 ־־־־־־־־־־־־125.2 菜单树图 ־־־־־־־־־־־־־ 12 6．操作前的准备6.1 预备工作6.2 和电源的连接6.3 更换保险丝6.4 安装电池6.5便携软包7．中心频率＜FREQ＞7.1用步进鍵设定7.2用旋钮设定7.3用数字鍵输入设定7.4依照光标的位置8．频率范围＜SPAN＞9．参考电平＜REFER＞9.1设置参考电平9.2幅度轴的单位切换9.3每种单位的参考电平的设置范围9.4参考电平和幅度衰减的关系10．显示栅格＜SCALE＞10.1用数字鍵设定10.2用旋钮设定11．分辨带宽＜RBW＞11.1手动模式（MANUAL）11.2自动模式（AUTO）11.3全自动模式（ALL AUTO）12．分辨带宽＜RBW＞12.1 手动模式（MANUAL）12.2 自动模式（AUTO）12.3 全自动模式（ALL AUTO）13．扫描ּ捕捉模式13.1 手动模式（MANUAL）13.2 自动模式（AUTO）13.3 全自动模式（ALL AUTO）13.4 设置捕捉模式14．自动调谐＜AUTO TUNE＞15．保持/运行＜HOLD/RUN>16．运算功能＜CALC＞16.1 正常模式（NORM）16.2 最大保持模式（MAX HOLD）16.3 最小保持模式（MIN HOLD）16.4 平均模式（A VERAGE）16.5 覆盖模式（OVER WRITE）17．光标. 峰值检测＜MKR＞17.1 移动光标17.2 峰值检测的设定17.3 光标示值单位的改变18．存储/调用<SA VE/RECALL>18.1 存储轨迹的设置18.2 存储参数的设置18.3 日期的存储18.4 日期的调用18.5 清除存储的轨迹18.6 重置（初始化）19．测量功能＜MEAS＞19.1 信道功率测量＜Ch Power>19.2 邻道泄漏功率测量＜Adj Ch Pw>19.3 占用带宽测量＜Occ BW>19.4 电场场强测量<E/F ANT>19.5 磁场场强测量<M/F PROBE>(选件) 20．屏幕设置＜DSPL>20.1 调整对比度20.2 LCD背景光的关闭20.3 LCD亮度的调整20.4 显示的反向20.5 允许或不允许beep响声21．打印＜PRONT＞20.1 连接方式20.2 屏幕的硬拷贝22．数据的输出＜RS232C＞22.1 选择轨迹的输出22.2 选择连接的速度（波特率）22.3 输出数据23．RS－232C接口23.1 RS-232C特性23.2连接的方法23.3指令描述23.4频率的输入23.5程序举例24．PC 软件25．基本性能的测试25.1 频率特性25.2参考电平的准确度25.3中心频率的显示准确度25.4频率范围的显示准确度25.5幅度轴的线性1．概述1.1 产品简介MSA338是一部值得依赖的便携式频谱分析仪，具有和台式频谱分析仪一样的性能和功能，且更是一种紧凑，轻便和价廉物美的频谱分析仪。

LM337中文资料_数据手册_参数

LM337中⽂资料_数据⼿册_参数-V IN Copyright ? 2016, Texas Instruments Incorporated TO-92SOICPin 1. Output2.Adjustment3. Input3121ProductFolder Sample &Buy TechnicalDocuments Tools &Software Support &CommunityLM337LSNVS780E –MAY 1998–REVISED DECEMBER 2016LM337L 3-Terminal Adjustable Regulator1FeaturesAdjustable Output Down to 1.2V ?Ensured 100-mA Output Current ?Line Regulation Typically 0.01%/V ?Load Regulation Typically 0.1%?Current Limit Constant With Temperature ?Eliminates the Need to Stock Many Voltages ?Standard 3-Pin Transistor Package ?80-dB Ripple Rejection ?Output is Short Circuit Protected 2Applications ?Industrial Power Supplies ?Factory Automation Systems ?Building Automation Systems ?PLC Systems ?Instrumentation ? IGBT Drive Negative Gate Supplies ?Networking ?Set-Top Boxes 3Description The LM337L is an adjustable 3-pin negative voltage regulator capable of supplying 100mA over a –1.2-V to –37-V output range.The LM337L is easy to use and requires only two external resistors to set the output voltage.Both line and load regulation are better than standard fixed regulators.The LM337L is packaged in a standard,easy-to-use TO-92transistor package.In addition to higher performance than fixedregulators,the LM337L offers full overload protection.Included on the chip are current limit,thermaloverload protection,and safe area protection.Alloverload protection circuitry remains fully functionaleven if the adjustment pin is disconnected.Normally,only a single 1-µF solid tantalum output capacitor is required unless the device is situated more than 6inches from the input filter capacitors,in which case an input bypass is required.A larger output capacitor can be added to improve transient response.The adjustment pin can be bypassed to achieve very high ripple rejection ratios,which are difficult to achieve with standard 3-pin regulators.Besides replacing fixed regulators,the LM337L is useful in a wide variety of other applications.Because the regulator is floating and monitors only the input-to-output differentialvoltage,supplies of severalhundred volts can be regulated as long as themaximum input-to-output differential is not exceeded.The LM337L makes a simple adjustable switchingregulator,a programmable output regulator,or byconnecting a fixed resistor between the adjustmentand output,the LM337L can be used as a precisioncurrent regulator.Supplies with electronic shutdowncan be achieved by clamping the adjustment pin toground,which programs the output to 1.2V,wheremost loads draw little current.The LM337L is available in a standard TO-92transistor package and a standard SO-8surfacemount package.The LM337L is rated for operationover a –25°C to 125°C range.For applications requiring output current in excess of0.5A and 1.5A,The LM137series may be suitable.For the positive complement,the LM117and LM317Lseries are options.Device Information (1)PART NUMBERPACKAGE BODY SIZE (NOM)LM337L SOIC (8)3.91mm ×4.90mm TO-92(3) 4.30mm ×4.30mm (1)For all available packages,see the orderable addendum at the end of the data sheet.1.2-V to 25-V Adjustable Regulator LM337L Available PackagesLM337LSNVS780E–MAY1998–REVISED /doc/c345595427fff705cc1755270722192e453658bd.htmlTable of Contents1Features (1)2Applications (1)3Description (1)4Revision History (2)5Pin Configuration and Functions (3)6Specifications (3)6.1Absolute Maximum Ratings (3)6.2ESD Ratings (3)6.3Recommended Operating Conditions (3)6.4Thermal Information (4)6.5Electrical Characteristics (4)6.6Typical Characteristics (5)7Detailed Description (6)7.1Overview (6)7.2Functional Block Diagram (6)7.3Feature Description (6)7.4Device Functional Modes (6)8Application and Implementation (8)8.1Application Information (8)8.2Typical Applications (8)9Power Supply Recommendations (10)10Layout (10)10.1Layout Guidelines (10)10.2Layout Example (10)11Device and Documentation Support (11)11.1Documentation Support (11)11.2Receiving Notification of Documentation Updates1111.3Community Resources (11)11.4Trademarks (11)11.5Electrostatic Discharge Caution (11)11.6Glossary (11)12Mechanical,Packaging,and OrderableInformation (11)4Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision D(May2013)to Revision E Page ?Added Applications section,Device Information table,Pin Configuration and Functions section,ESD Ratings table, Recommended Operating Conditions table,Typical Characteristics section,Detailed Description section,Application and Implementation section,Power Supply Recommendations section,Layout section,Device and Documentation Support section,and Mechanical,Packaging,and Orderable Information section (1)Deleted DSBGA Package references throughout the data sheet (1)Deleted soldering information rows from Absolute Maximum Ratings table (3)Added Thermal Information table (4)Changed RθJA values for D(SOIC)package From:180To:111.3and for LP(TO-92)package From:160To:156.9 (4)Changes from Revision C(May2013)to Revision D Page ?Changed layout of National Semiconductor Data Sheet to TI format (1)LM337L/doc/c345595427fff705cc1755270722192e453658bd.html SNVS780E –MAY 1998–REVISED DECEMBER 20165Pin Configuration and FunctionsD Package8-Pin SOICTop View LP Package 3-Pin TO-92Bottom ViewPin FunctionsPINI/O DESCRIPTIONNAMETO-92SOIC ADJ14—Adjust pin NC—5,8—No connection VIN32,3,6,7Input Input voltage pin for the regulator VOUT 21Output Output voltage pin for the regulator (1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)If Military/Aerospace specified devices are required,please contact the Texas Instruments Sales Office/Distributors for availability andspecifications.6Specifications6.1Absolute Maximum RatingsSee (1)(2)MINMAX UNIT Input-output voltage differential40V Power dissipationInternally Limited Storage temperature,T stg–55150°C (1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.Pins listed as ±1500V may actually have higher performance.(2)Human-body model,1.5k ?in series with 100pF.6.2ESD RatingsVALUEUNIT V (ESD)Electrostatic discharge Human-body model (HBM),per ANSI/ESDA/JEDEC JS-001(1)(2)±1500V 6.3Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)MINMAX UNIT Operating junction temperature –25125°CLM337LSNVS780E –MAY 1998–REVISED DECEMBER /doc/c345595427fff705cc1755270722192e453658bd.html(1)For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics applicationreport.6.4Thermal InformationTHERMAL METRIC(1)LM337LUNIT D (SOIC)LP (TO-92)8PINS 3PINS R θJAJunction-to-ambient thermal resistance 111.3156.9°C/W R θJC(top)Junction-to-case (top)thermal resistance 56.180.2°C/W R θJBJunction-to-board thermal resistance 51.9—°C/W ψJTJunction-to-top characterization parameter 10.624.7°C/W ψJBJunction-to-board characterization parameter 51.3136.2°C/W (1)Unless otherwise specified,these specifications apply –25°C ≤T J ≤125°C for the LM337L;|V IN –V OUT |=5V and I OUT =40mA.Although power dissipation is internally limited,these specifications are applicable for power dissipations up to 625mW.I MAX is 100mA.(2)Regulation is measured at constant junction temperature,using pulse testing with a low duty cycle.Changes in output voltage due toheating effects are covered under the specification for thermal regulation.6.5Electrical Characteristics (1)PARAMETERTEST CONDITIONS MIN TYP MAX UNIT Line regulation (2)T A =25°C,3V ≤|V IN –V OUT |≤40V 0.010.04%/V Load regulation (2)T A =25°C,5mA ≤I OUT ≤I MAX 0.1%0.5%Thermal regulationT A =25°C,10-ms Pulse 0.040.2%/W Adjustment pin current50100µA Adjustment pin current change5mA ≤I L ≤100mA,3V ≤|V IN –V OUT |≤40V 0.25µA Reference voltage3V ≤|V IN –V OUT |≤40V,10mA ≤I OUT ≤100mA,P ≤625mW 1.2 1.25 1.3V Line regulation (2)3V ≤|V IN –V OUT |≤40V 0.020.07%/V Load regulation (2)5mA ≤I OUT ≤100mA 0.3% 1.5%Temperature stabilityT MIN ≤T j ≤T MAX 0.65%Minimum load current|V IN –V OUT |≤40V 3.55mA 3V ≤|V IN –V OUT |≤15V 2.2 3.5mA Current limit3V ≤|V IN –V OUT |≤13V 100200320mA |V IN –V OUT |=40V 2550120mA RMS output noise,%of V OUTT A =25°C,10Hz ≤f ≤10kHz 0.003%Ripple rejection ratioV OUT =–10V,F =120Hz,C ADJ =065dB C ADJ =10µF 6680dB Long-term stabilityT A =125°C 0.3%1%LM337L /doc/c345595427fff705cc1755270722192e453658bd.html SNVS780E–MAY1998–REVISED DECEMBER20166.6Typical CharacteristicsFigure3.Line Transient Response Figure4.Load Transient ResponseINPUTOUTPUTADJUSTCopyright ? 2016,Texas Instruments IncorporatedLM337LSNVS780E –MAY 1998–REVISED DECEMBER /doc/c345595427fff705cc1755270722192e453658bd.html7Detailed Description7.1OverviewThe LM337L devices are adjustable 3-terminal negative-voltage regulators capable of supplying 100mA over anoutput voltage range of –1.2V to –37V.They are exceptionally easy to use,requiring only two external resistorsto set the output voltage and one output capacitor for frequency compensation.In addition,LM337L offers fulloverload protection.Included on the chip are current limit,thermal overload protection and safe area protection.All overload protection circuitry remains fully functional even if the adjustment terminal is disconnected.TheLMx37devices serve a wide variety of applications,including local on-card regulation,programmable output-voltage regulation,and precision current regulation.7.2Functional Block Diagram7.3Feature Description7.3.1Output Voltage AdjustmentThe Adjustment (ADJ)pin serves as a voltage adjustment reference for the output.The ADJ pin can be attachedto a resistor divider circuit to adjust the output voltage level.The reference voltage VADJ will typically be 1.25Vhigher than VO.7.4Device Functional Modes7.4.1Protection DiodesWhen external capacitors are used with any IC regulator,it is sometimes necessary to add protection diodes toprevent the capacitors from discharging through low current points into the regulator.Most 10-µF capacitors havelow enough internal series resistance to deliver 20-A spikes when shorted.Although the surge is short,there isenough energy to damage parts of the IC.When an output capacitor is connected to a negative output regulatorand the input is shorted,the output capacitor pulls current out of the output of the regulator.The current dependson the value of the capacitor,the output voltage of the regulator,and the rate at which VIN is shorted to ground.The bypass capacitor on the adjustment terminal can discharge through a low current junction.Discharge occurswhen either the input,or the output,is shorted.Figure 15shows the placement of the protection diodes.LM337L /doc/c345595427fff705cc1755270722192e453658bd.html SNVS780E–MAY1998–REVISED DECEMBER2016 Device Functional Modes(continued)When CL is larger than20µF,D1protects the LM337L in case the input supply is shorted.When C2is larger than10µF and?VOUT is larger than?25V,D2protects the LM337L in case the output is shorted.Figure5.Regulator With Protection DiodesOUT R2V 1.25V 1240§· ¨?:?1-V IN Copyright ? 2016, Texas Instruments IncorporatedLM337LSNVS780E –MAY 1998–REVISED DECEMBER /doc/c345595427fff705cc1755270722192e453658bd.html8Application and ImplementationNOTEInformation in the following applications sections is not part of the TI componentspecification,and TI does not warrant its accuracy or completeness.TI’s customers areresponsible for determining suitability of components for their purposes.Customers shouldvalidate and test their design implementation to confirm system functionality.8.1Application InformationThe LM337L is a negative output linear regulator with high accuracy and a wide temperature range.An outputcapacitor can be added to further improve transient response,and the ADJ pin can be bypassed to achieve veryhigh ripple-rejection ratios.The device's functionality can be utilized in many different applications that requirenegative voltage supplies,such as bipolar amplifiers,operational amplifiers,and constant current regulators.8.2Typical Applications8.2.1 1.2-V to 25-V Adjustable RegulatorFull output current not available at high input-output voltagesC1=1-µF solid tantalum or 10-µF aluminum electrolytic required for stability*C2=1-µF solid tantalum is required only if regulator is more than 4″from power supply filter capacitorFigure 6. 1.2-V to 25-V Adjustable Regulator Diagram8.2.1.1Design RequirementsThe device component count is very minimal,employing two resistors as part of a voltage divider circuit and anoutput capacitor for load regulation.An input capacitor is needed if the device is more than 4in.from the filtercapacitors.8.2.1.2Detailed Design ProcedureThe output voltage is set based on the selection of the two resistors (R1and R2)as shown in Equation 1.(1)-22 VCopyright ? 2016, Texas Instruments Incorporated LM337L/doc/c345595427fff705cc1755270722192e453658bd.html SNVS780E–MAY1998–REVISED DECEMBER2016 Typical Applications(continued)8.2.1.3Application CurveFigure7.Dropout Voltage across Load Current at25°C(?Vout<100mV8.2.2Regulator With Trimmable Output VoltageFigure8.Regulator with Trimmable Output Voltage Diagram8.2.2.1Design RequirementsThis design uses five resistors with two being used for a voltage divider circuit and the other three used for trimming the output voltage.The benefit is lower cost as compared to using a trim pot.An output capacitor is needed to improve load regulation.8.2.2.2Detailed Design ProcedureThis design will trim the output voltage to within1%of–22V.The parallel combination of R1,R3,R4and R5 serve as the bottom resistance and R2as the top resistance in the voltage divider that sets the output voltage. Trim Procedure:If V OUT is–23.08V or larger,do not use R3,otherwise leave it in.Then if V OUT is–22.47V or bigger,do not use R4,otherwise leave it in.Then if V OUT is–22.16V or bigger,do not use R5,otherwise leave it in.This will trim the output to well within1%of–22V DC,without any of the expense or trouble of a trim pot(see LB-46).This technique can be used at any output voltage level.LM337LSNVS780E–MAY1998–REVISED /doc/c345595427fff705cc1755270722192e453658bd.html 9Power Supply RecommendationsThe input supply to the LM337L must be kept at a voltage level such that its maximum input to output differential voltage rating is not exceeded.The minimum dropout voltage must also be met with extra headroom when possible to keep the LM337L in regulation.TI recommends an input capacitor,especially when the input pin is placed more than4in.away from the power-supply filter capacitor.10Layout10.1Layout GuidelinesSome layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise. Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the feedback loop from VOUT to ADJ must be kept as short as possible.To improve PSRR,a bypass capacitor can be placed at the ADJ pin and must be placed as close as possible to the IC.In cases when VIN shorts to ground, an external diode must be placed from VIN to VOUT to divert the surge current into the output capacitor and protect the IC.Similarly,in cases when a large bypass capacitor is placed at the ADJ pin and VOUT shorts to ground,an external diode must be placed from VOUT to ADJ to provide a path for the bypass capacitor to discharge.These diodes must be placed close to the corresponding IC pins to increase their effectiveness.10.2Layout ExampleFigure9.LM337L Layout ExampleLM337L /doc/c345595427fff705cc1755270722192e453658bd.html SNVS780E–MAY1998–REVISED DECEMBER201611Device and Documentation Support11.1Documentation Support11.1.1Related DocumentationFor related documentation see the following:LM317L-N3-Terminal Adjustable Regulator(SNOSBW2)LM117,LM317-N Wide Temperature Three-Pin Adjustable Regulator(SNVS774)LM317L-N3-Terminal Adjustable Regulator(SNVS775)11.2Receiving Notification of Documentation UpdatesTo receive notification of documentation updates,navigate to the device product folder on /doc/c345595427fff705cc1755270722192e453658bd.html .In the upper right corner,click on Alert me to register and receive a weekly digest of any product information that has changed.For change details,review the revision history included in any revised document.11.3Community ResourcesThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E?Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At/doc/c345595427fff705cc1755270722192e453658bd.html ,you can ask questions,share knowledge,explore ideas and helpsolve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.11.4TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.11.5Electrostatic Discharge CautionThis integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled with appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.12Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check/doc/c345595427fff705cc1755270722192e453658bd.html /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.Addendum-Page 1(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant LM337LMX SOIC D 82500330.012.4 6.5 5.4 2.08.012.0Q1LM337LMX/NOPB SOIC D 82500330.012.4 6.5 5.4 2.08.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) LM337LMX SOIC D8*******.0367.035.0 LM337LMX/NOPB SOIC D8*******.0367.035.0PACKAGE OUTLINETO-92 - 5.34 mm max height LP0003A TO-92NOTES:1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. Lead dimensions are not controlled within this area.4. Reference JEDEC TO-226, variation AA.5. Shipping method:a. Straight lead option available in bulk pack only.b. Formed lead option available in tape and reel or ammo pack.c. Specific products can be offered in limited combinations of shipping medium and lead options.d. Consult product folder for more information on available options.EXAMPLE BOARD LAYOUTTO-92 - 5.34 mm max heightLP0003A TO-92。

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而本手册，也没有任何包含的材料外，可以不写作者的同意转载。

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制造商保留的权利，修改本出版物和更改本法没有时间，生产商有义务在任何时间通知内容人的修改或变更。

商标识别微软的MS - DOS和Windows是微软公司的注册商标MMX公司，奔腾，奔腾二，奔腾三，赛扬是英特尔公司的注册商标心病，第一高。

其他产品在本手册中使用的名称是其各自所有者的财产和是公认的。

联邦通讯委员会（FCC）的本设备已经过测试，证明符合B类数字的限制设备，根据FCC规则第15条。

这些限制旨在提供理由，能够保护，防止有害干扰，在一个住宅安装。

本设备产生，使用，并能发射无线电频率能量，如果没有安装和使用的指示，根据可能造成有害干扰无线电通讯。

但是，我们不能保证不会产生干扰在特定的安装。

如果本设备确实造成有害干扰无线电或电视接收可以通过打开和关闭设备来确定，用户可以尝试纠正一个或多个下列措施排除干扰：••• •重新调整或重新定位接收天线增加设备与接收器的分离线路上连接到不同的设备，电源插座上接收器连接咨询经销商或有经验的无线电/电视技术人员寻求帮助屏蔽电缆和屏蔽的互连交流电源线必须与此雇设备，以确保符合有关射频管这类规定的排放限值设备。

变更或修改，明确许可的系统制造商可能导致用户无权操作设备。

前言二符合性声明此设备符合FCC规则的15。

操作必须符合以下条件：•该设备不会产生有害干扰，此装置必须接受任何收到的干扰，包括干扰这可能导致意外操作加拿大通信部此B类数字设备符合加拿大干扰的所有要求，造成设备规例。

鲸鱼appareil Numerique的德拉classe乙respecte toutes莱斯紧迫性河畔乐杜Réglement 物资brouilieur杜加拿大。

LM338 数据手册说明书

2546 kb.
lm338 pdf
The LM317 LM338 LM350 family of adjustable 3-terminal positive. LM338 5 Amp 3-Terminal Adjustable Regulator Datasheet PDF.LM338 datasheet,LM338 Pinout Pin out,LM338 application circuits can be. Pinout of LM338,If you need more pinouts please
Pinout of LM338,If you need more pinouts please download LM338s PDF datasheet.LM138 LM338. The LM138 series of adjustable 3-terminal positive voltage regulators is capable of.
LM338.
The LM138 series of adjustable 3-terminal positive vห้องสมุดไป่ตู้ltage regulators is capable of.LT138ALT338A. Voltage Regulator.The LM138LM238LM338 are adjustable 3-terminal positive voltage regulators capable of supplying in ex- cess of 5A over a 1. 2V to 32 V output range. They are.The LM138, LM238, LM338 are adjustable 3- terminal positive voltage regulators capable of supplying in

lm337

FEATURESLM337...KTE,KTP,OR KVU PACKAGE(TOP VIEW)OUTPUT INPUT ADJUSTMENTI N P U TI N P U TLM337...KTT (TO-263) PACKAGE(TOP VIEW)OUTPUT INPUT ADJUSTMENTLM237,LM337...KC (TO-220) PACKAGE(TOP VIEW)INPUTOUTPUTADJUSTMENTINPUTOUTPUT LM337...KCS (TO-220) PACKAGE(TOP VIEW)ADJUSTMENTI N P UTI N P UTDESCRIPTION/ORDERINGINFORMATIONLM237,LM3373-TERMINAL ADJUSTABLE REGULATORSSLVS047K–NOVEMBER 1981–REVISED NOVEMBER 2007•Output Voltage Range Adjustable From •Peak Output Current Constant Over –1.2V to –37VTemperature Range of Regulator •Output Current Capability of 1.5A Max •Ripple Rejection Typically 77dB•Input Regulation Typically 0.01%Per •Direct Replacement for Industry-Standard Input-Voltage ChangeLM237and LM337•Output Regulation Typically 0.3%The LM237and LM337are adjustable 3-terminal negative-voltage regulators capable of supplying in excess of –1.5A over an output voltage range of –1.2V to –37V.They are exceptionally easy to use,requiring only two external resistors to set the output voltage and one output capacitor for frequency compensation.The current design has been optimized for excellent regulation and low thermal transients.In addition,the LM237and LM337feature internal current limiting,thermal shutdown,and safe-area compensation,making them virtually immune to failure by overloads.The LM237and LM337serve a wide variety of applications,including local on-card regulation,programmable output-voltage regulation,and precision current regulation.ORDERING INFORMATIONT JPACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING –25°C to 150°CTO-220–KC Tube of 50LM237KC LM237PowerFLEX™–KTE Reel of 2000LM337KTER LM337PowerFLEX –KTPReel of 3000LM337KTPR L337TO-220–KC Tube of 50LM337KC LM3370°C to 125°CTO-220–KCS Tube of 50LM337KCSE3LM337TO-252–KVU Reel of 2500LM337KVURG3LM337TO-263–KTTReel of 500LM337KTTRLM337(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.ADJUSTMENTOUTPUTINPUTAbsolute Maximum Ratings (1)Package Thermal Data (1)LM237,LM3373-TERMINAL ADJUSTABLE REGULATORSSLVS047K–NOVEMBER 1981–REVISED NOVEMBER 2007SCHEMATIC DIAGRAMover operating temperature ranges (unless otherwise noted)MINMAX UNIT V I –V O Input-to-output differential voltage –40V T J Operating virtual junction temperature 150°C Lead temperature1,6mm (1/16in)from case for 10s260°C T stg Storage temperature range–65150°C(1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.PACKAGEBOARD θJC θJA PowerFLEX (KTE)High K,JESD 51-53°C/W 23°C/W PowerFLEX (KTP)High K,JESD 51-519°C/W 28°C/W TO-220(KC)High K,JESD 51-53°C/W 24.8°C/W TO-220(KCS)High K,JESD 51-53°C/W24.8°C/W TO-252(KVU)High K,JESD 51-530.3°C/W TO-263(KTT)High K,JESD 51-518°C/W 25.3°C/W(1)Maximum power dissipation is a function of T J (max),θJA ,and T A .The maximum allowable power dissipation at any allowable ambient temperature is P D =(T J (max)–T A )/θJA .Operating at the absolute maximum T J of 150°C can affect reliability.Recommended Operating Conditions Electrical CharacteristicsLM237,LM337 3-TERMINAL ADJUSTABLE REGULATORSSLVS047K–NOVEMBER1981–REVISED NOVEMBER2007MIN MAX UNIT|V I–V O|≤40V,P≤15W101500I O Output current mA|V I–V O|≤10V,P≤15W61500LM237–25150T J Operating virtual junction temperature°CLM3370125over recommended ranges of operating virtual junction temperature(unless otherwise noted)LM237LM337 PARAMETER TEST CONDITIONS(1)UNITMIN TYP MAX MIN TYP MAXT J=25°C0.010.020.010.04Input regulation(2)V I–V O=–3V to–40V%/VT J=MIN to MAX0.020.050.020.07V O=–10V,f=120Hz6060Ripple rejection dB V O=–10V,f=120Hz,C ADJ=10µF66776677|V O|≤5V2550mVI O=10mA to1.5A,T J=25°C|VO |≥5V0.30.50.31%Output regulation|V O|≤5V5070mVI O=10mA to1.5A|V O|≥5V1 1.5%Output-voltage change withT J=MIN to MAX0.60.6% temperatureOutput-voltageAfter1000h at T J=MAX and V I–V O=–40V0.310.31% long-term driftOutput noise voltage f=10Hz to10kHz,T J=25°C0.0030.003% |V I–V O|≤40V 2.55 2.510 Minimum output current tomA maintain regulation|VI–V O|≤10V 1.23 1.56|V I–V O|≤15V 1.5 2.2 1.5 2.2Peak output current A |V I–V O|≤40V,T J=25°C0.240.40.150.4ADJUSTMENT current6510065100µAChange in ADJUSTMENT V I–V O=–2.5V to–40V,I O=10mA to MAX,2525µA current T J=25°CReference voltage V I–V O=–3V to–40V,T J=25°C–1.225–1.25–1.275–1.213–1.25–1.287 (OUTPUT to I O=10mA to1.5A,VT J=MIN to MAX–1.2–1.25–1.3–1.2–1.25–1.3 ADJUSTMENT)P≤rated dissipationThermal regulation Initial T J=25°C,10-ms pulse0.0020.020.0030.04%/W (1)Unless otherwise noted,the following test conditions apply:|V I–V O|=5V and I O=0.5A.For conditions shown as MIN or MAX,usethe appropriate value specified under recommended operating conditions.All characteristics are measured with a0.1-µF capacitor across the input and a1-µF capacitor across the output.Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible.Thermal effects must be taken into account separately.(2)Input regulation is expressed here as the percentage change in output voltage per1-V change at the input.Electrical CharacteristicsLM237,LM3373-TERMINAL ADJUSTABLE REGULATORSSLVS047K–NOVEMBER 1981–REVISED NOVEMBER 2007T J =25°CLM237,LM337PARAMETERTEST CONDITIONS (1)UNIT MINTYP MAX Input regulation (2)V I –V O =–3V to –40V 0.010.04%/V V O =–10V,f =120Hz60Ripple rejection dB V O =–10V,f =120Hz,C ADJ =10µF 6677|V O |≤5V 50mV Output regulation I O =10mA to 1.5A |V O |≥5V0.31%Output noise voltagef =10Hz to 10kHz 0.003%|V I –V O |≤40V 2.510Minimum output current to maintain mA regulation|V I –V O |≤10V 1.56|V I –V O |≤15V 1.5 2.2Peak output current A |V I –V O |≤40V0.150.4ADJUSTMENT current65100µA Change in ADJUSTMENT current V I –V O =–2.5V to –40V,I O =10mA to MAX 25µA Reference voltageV I –V O =–3V to –40V,I O =10mA to 1.5A,–1.213–1.25–1.287V(OUTPUT to ADJUSTMENT)P ≤rated dissipation(1)Unless otherwise noted,the following test conditions apply:|V I –V O |=5V and I O =0.5A.All characteristics are measured with a 0.1-µF capacitor across the input and a 1-µF capacitor across the output.Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible.Thermal effects must be taken into account separately.(2)Input regulation is expressed here as the percentage change in output voltage per 1-V change at the input.APPLICATION INFORMATIONLM237or V OVIC1 is a 1-µF solid tantalum capacitor required only if the regulator is more than 10 cm (4 in) from the power-supply filter capacitor.C2 is a 1-µF solid tantalum or 10-µF aluminum electrolytic capacitor required for stability.R2+R1ǒ–VO –1..25*1ǓR1 typically is 120 Ω., where V O is the output in volts.V IV OLM237orR S =1.25 V I LIMITLM237,LM3373-TERMINAL ADJUSTABLE REGULATORSSLVS047K–NOVEMBER 1981–REVISED NOVEMBER 2007Figure 1.Adjustable Negative-Voltage RegulatorFigure 2.Current-Limiting CircuitPACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)LM237KC OBSOLETE TO-220KC3TBD Call TI Call TI Samples Not Available LM237KCE3OBSOLETE TO-220KC3TBD Call TI Call TI Samples Not Available LM237KCSE3ACTIVE TO-220KCS350Pb-Free (RoHS)CU SN N / A for Pkg Type Request Free Samples LM237KTER OBSOLETE PFM KTE3TBD Call TI Call TI Samples Not Available LM337KC OBSOLETE TO-220KC3TBD Call TI Call TI Samples Not Available LM337KCE3OBSOLETE TO-220KC3TBD Call TI Call TI Samples Not Available LM337KCSE3ACTIVE TO-220KCS350Pb-Free (RoHS)CU SN N / A for Pkg Type Request Free Samples LM337KTER OBSOLETE PFM KTE3TBD Call TI Call TI Samples Not Available LM337KTPR OBSOLETE PFM KTP2TBD Call TI Call TI Samples Not Available LM337KTPRG3OBSOLETE PFM KTP2TBD Call TI Call TI Samples Not AvailableLM337KTTR ACTIVE DDPAK/TO-263KTT3500Green (RoHS& no Sb/Br)CU SN Level-3-245C-168 HR Request Free SamplesLM337KTTRG3ACTIVE DDPAK/TO-263KTT3500Green (RoHS& no Sb/Br)CU SN Level-3-245C-168 HR Request Free SamplesLM337KVURG3ACTIVE PFM KVU32500Green (RoHS& no Sb/Br)CU SN Level-3-260C-168 HR Request Free Samples LM337Y OBSOLETE DIESALE Y0TBD Call TI Call TI Samples Not Available (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)Addendum-Page 1(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant LM337KTTR DDPAK/TO-263KTT 3500330.024.410.615.8 4.916.024.0Q2LM337KVURG3PFMKVU32500330.016.46.910.52.78.016.0Q2*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) LM337KTTR DDPAK/TO-263KTT3500340.0340.038.0 LM337KVURG3PFM KVU32500340.0340.038.0MECHANICAL DATAMPFM001E – OCTOBER 1994 – REVISED JANUARY 2001KTE (R-PSFM-G3)PowerFLEX ™ PLASTIC FLANGE-MOUNT0.360 (9,14)0.350 (8,89)0.080 (2,03)0.070 (1,78)0.010 (0,25) NOM0.040 (1,02) Seating Plane0.050 (1,27)0.001 (0,03)0.005 (0,13)0.010 (0,25)NOMGage Plane0.010 (0,25)0.031 (0,79)0.041 (1,04)4073375/F 12/00NOM310.350 (8,89)0.220 (5,59)0.360 (9,14)0.295 (7,49)NOM0.320 (8,13)0.310 (7,87)0.025 (0,63)0.031 (0,79)Thermal Tab (See Note C)0.004 (0,10)M0.010 (0,25)0.100 (2,54)3°–6°0.410 (10,41)0.420 (10,67)0.200 (5,08)0.365 (9,27)0.375 (9,52)NOTES: A.All linear dimensions are in inches (millimeters).B.This drawing is subject to change without notice.C.The center lead is in electrical contact with the thermal tab.D.Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).E.Falls within JEDEC MO-169PowerFLEX is a trademark of Texas Instruments.MECHANICAL DATAMPSF001F – JANUARY 1996 – REVISED JANUARY 20021POST OFFICE BOX 655303 • DALLAS, TEXAS 75265KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE0.228 (5,79)0.218 (5,54)0.233 (5,91)0.243 (6,17)0.001 (0,02)0.005 (0,13)0.070 (1,78)Seating Plane0.080 (2,03)0.010 (0,25) NOMGage Plane 0.010 (0,25)4073388/M 01/020.037 (0,94)0.047 (1,19)0.247 (6,27)0.237 (6,02)NOM0.215 (5,46)0.371 (9,42)0.381 (9,68)0.090 (2,29)0.100 (2,54)0.287 (7,29)0.031 (0,79)0.032 (0,81) MAX0.277 (7,03)0.025 (0,63)0.130 (3,30) NOM 0.090 (2,29)0.180 (4,57)M 0.010 (0,25)0.004 (0,10)2°–ā6°0.040 (1,02)0.050 (1,27)Thermal Tab (See Note C)0.010 (0,25) NOMNOTES: A.All linear dimensions are in inches (millimeters).B.This drawing is subject to change without notice.C.The center lead is in electrical contact with the thermal tab.D.Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).E.Falls within JEDEC TO-252 variation AC.PowerFLEX is a trademark of Texas Instruments.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements 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TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

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INFRARED RECEIVER MODULE MIM-3xx7K1F DescriptionFeaturesl Photo detector and preamplifier in one packagel Internal filter for PCM frequencyl High immunity against ambient lightl Improved shielding against electric field disturbancel 3.0-Volt supply voltage; low power consumptionl TTL and CMOS compatibilityMIM-3xx7K1F Series Modelsl MIM-3337K1F 32.7KHzl MIM-3377K1F 36.7KHzl MIM-3387K1F 37.9KHzl MIM-3407K1F 40.0KHzl MIM-3567K1F 56.7KHzBLOCK DIAGRAMREV: A1Absolute Maximum RatingsItem Symbol Ratings Unit RemarkSupply voltage Vs-0.3 ~ 6.0VSupply Current Is 2.5mAOperating temperature T opr-25 ~ + 85o CStorage temperature T stg-25 ~ + 85o CSoldering temperature T sd260o C t≦5 s, 1mm from caseJunction Temperature T j100o CElectro-optical characteristics (Vcc=3.0V)Parameter Symbol Min.Typ.Max.Unit RemarksSupply Voltage Vs 2.7 3.0 5.5VCurrent consumption Icc 1.1 2.5mA Under no signal Response wavelength l p940nmOutput form - - - - - active low output - - - - -H level output voltage V0h 2.8 3.0VL level output voltage V0l0.20.4VH level output pulse width Twh500800m sL level output pulse width Twl500800m sDistance between emitter & detector L110.0m Note 1Half angle Dq±45deg Horizonal directionTest MethodA. Standard TransmitterREV: A1B. Detection Length TestC . Pulse Width TestApplication CircuitREV: A1Dimensions in mmREV: A1CHARACTERISTIC CURVES (T A=25o C)REV: A1INFRARED RECEIVER MODULE MIM-3xx7K1F ReliabilityTest item Test condition StandardHigh temparature Ta=+80o C t=240H Note 2.High temp. & high humi.Ta=+40o C 90%RH t=240H Note 2.Low temparature Ta= -25o C t=240H Note 2.Temperature cycle -25o C(0.5H) ~ +80o C(0.5H) 20cycle Note 2.Dropping Test devices shall be dropped 3 times naturally Note 3.onto hard wooden board from a 75cm height position.NOTE 1. Distance between emitter & detector specifies maximum distance that output wave form satisfiesthe standard under the conditions below against the standerd transmitter.(1)Measuring place ………Indoor without extreme reflection of light.(2)Ambient light source… Detecting surface illumination shall be 200±50Lux under ordinaryhite fluorescense lamp of no high frequency lighting.(3)Standard transmitter … Burst wave indicated in Fig 1. of standard transmittershall be arranged to 50mVp-p under the measuring circuit specified in Fig 2.NOTE 2. (electro-optical charactistics) shall be satisfied after leaving 2 hours in the normal temperature .NOTE 3. (electro-optical charactistics) shall be satisfied and no conoid deformsand destructions of appearance .(excepting deforms of terminals)Inspection standard1.Among electrical characteristics , total number shall be inspected on items blow.1-1 front distance between emitter & detector1-2 Current consumption1-3 H level output voltage1-4 L level output voltage2.Items except above mentioned are not inspected particularly , but shall fully satisfyCAUTION ( When use and storage of this device )1.Store and use where there is no force causing transformation or change in quality .2.Store and use where there is no corrosive gas or sea(salt) breeze .3.Store and use where there is no extreme humidity .4.Solder the lead-pin within the condition of ratings. After soldering do not add extra force .5.Do not wash this device . Wipe the stains of diode side with a soft cloth. You canuse the solvent , ethylalcohol or methylalcohol or isupropylene only .6.To prevent static electricity damage to the Pre-AMP make sure that the human body, the soldering iron is connected to ground before using .7.Put decoupling device between Vcc and GND for reduse the noise from power supply line .8.The performance of remote-control system depends on environments condition and abilityof periferal parts. Customer should evaluate the performance as total system in those conditionsafter system up with components such as commander , micon and this receiver module .Others1.This device is not design to endure radiative rays and heavily charged particles .2.In case where any trouble or questions arise,both parties agress to make full discussioncovering the said problem .REV: A1。