NMC-P1210X7R105K50TRPF中文资料

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PCR热封仪技术参数

PCR热封仪技术参数1、工作环境1.1 工作温度10-30℃1.2 工作和存储湿度20-80%1.3 工作电源90–240 VAC (±10%), 50–60HZ2、用途对PCR反应板进行高效封膜处理，可防止PCR样本挥发及交叉污染，配套热封膜满足不同PCR实验的要求（PCR、定量PCR和ddPCR），确保PCR反应的结果。

3、性能与技术要求3.1 主要性能★3.1.1 快速启动，预热时间短，3分钟内即可达到设定温度。

★3.1.2 触摸屏操作界面直观，友好，节省编程时间。

3.1.3 可直接调用现有程序。

3.1.4 体积小巧，节省实验室宝贵空间。

3.2 主要技术要求（★为必须满足的指标）3.2.1 半自动PCR热封仪，保证操作安全。

★3.2.2 4.3英寸高分辨率(10.9cm)触摸屏，操作界面直观、友好，编程方便。

★3.2.3 预热时间 <3min (110/220 V输入电压)。

3.2.4 封膜温度：可调。

范围：100 - 190 ℃。

3.2.5 封膜时间：可调。

范围：0.5 - 10 s。

3.2.6 兼容高位、低位96孔板和384孔板。

★3.2.7 可存储12个封膜程序，可直接调用现有程序。

3.2.8 可根据不同耗材类型进行编程，可确保封膜效果的一致性。

3.2.9 仪器尺寸(w/d/h)：19 x 24 x 22 cm。

3.3 舒适混匀装置3.3.1 混匀频率最高可达 1200 rpm。

3.3.2 独特的二维混匀操控技术以可控的、二维圆周运动方式混匀液体，实现样品在反应管和工作板中快速而有效的混匀。

3.3.3 防溅射技术能有效防止管盖润湿和交叉污染。

3.3.4 独有的热盖可防止形成冷凝水，提高温度均一性，确保检测结果。

3.3.5 独立传感器控制，具有最佳温控精准性和均一性。

3.3.6 快速更换加热模块，模块具有自动识别功能。

3.3.7 从5µL 到50mL，可在所有通用样品管和工作板中进行加热、混匀和制冷。

TMCM-1210 硬件手册说明书

TRINAMIC Motion Control GmbH & Co. KGHamburg, GermanyHardware Version V 1.10HARDWARE MANUAL+ +TMCM-12101-Axis steppercontroller/drivermax. 0.6A RMS / 24V DC STOP / HOME switch input hall sensorRS485++Table of contents1Life support policy (3)2Features (4)3Order codes (5)4Mechanical and Electrical Interfacing (6)4.1Dimensions and Mounting Holes (6)4.2Board mounting considerations (6)4.3Connectors (7)4.3.1Power, RS485 + HOME connector (8)4.3.2Motor connector (9)4.4Power supply (9)4.5RS485 (10)5Motor driver current (12)6On-Board LEDs (13)7Reset to Factory Default Values (13)8EMC considerations (14)9Operational Ratings (15)10Functional Description (16)11Revision History (17)11.1Document revision (17)11.2Hardware revision (17)12References (17)1Life support policyTRINAMIC Motion Control GmbH & Co. KG does not authorize or warrant any of its products for use in life support systems, without the specific written consent of TRINAMIC Motion Control GmbH & Co. KG.Life support systems are equipment intended to support or sustain life, and whose failure to perform, when properly used in accordance with instructions provided, can be reasonably expected to result in personal injury or death.© TRINAMIC Motion Control GmbH & Co. KG 2015 - 2019Information given in this data sheet is believed to be accurate and reliable. However neither responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties, which may result from its use.Specifications are subject to change without notice.2FeaturesThe TMCM-1210 is a highly compact 20mm x 20mm single axis stepper motor controller and driver board with RS485 interface. It has been designed in order to be mounted on the rear side of a NEMA8 (20mm flange size) stepper motor and offers an integrated hall-sensor based encoder IC in addition to a reference switch input for easy homing / search of reference position. The module supports motor currents up to 0.6A RMS and supply voltages up to 24V DC nominal. It is available with standard TMCL firmware and supports stand-alone operation (TMCL programs with auto-start stored on-board) and remote control via RS485 interface.MAIN CHARACTERISTICSMotion controller∙Motion profile calculation in hardware in real-time∙Motion controller supports linear and sixPoint™ ramps∙On the fly alteration of motor parameters (e.g. position, velocity, acceleration)∙High performance microcontroller (Cortex-M0+) for overall system control and serial communication protocol handlingBipolar stepper motor driver∙Up to 256 microsteps per full step∙Highly integrated and highly-efficient operation∙Dynamic current control∙stallGuard2™ feature for stall detectionInterfaces∙RS485 2-wire communication interface∙Digital input IN0 (+24V compatible), can be used as reference switch or left and/or right stop switch input, alsoOn board hall sensor∙Absolute sensor within one motor rotation∙12bit / 4096 steps / revolution max.∙Low-cost sensor - suitable for low velocity applications (few hundred rpm) –e.g. initial reference search (together with HOME sensor input) after power-upSoftware∙TMCL™ remote (direct mode) and standalone oper ation with memory for up to 876 TMCL commands∙Fully supported by TMCL-IDE (PC based integrated development environment)Electrical data∙Supply voltage: +7V… +30V DC∙Motor current: up to 0.6A RMS (programmable)Mechanical data∙Board size: 20mm x 20mm, overall height 9mm max. (without mating connectors and cables)∙Mounting holes compatible with NEMA 8 stepper motors (for mounting the board to the rear side of a NEMA8 stepper motor using two of the four existing screw)Please see separate TMCM-1210 Firmware Manual for additional information regarding firmware functionality and TMCL programming.3Order codesThe TMCM-1210 is available as:A cable loom set is available for this module, also:Table 3.2: Cable loom order code4 Mechanical and Electrical Interfacing4.1 Dimensions and Mounting HolesThe dimensions of the board are approx. 20mm x 20mm x 9 mm in order to fit on the back side of a 20mm (NEMA8) stepper motor. Maximum component height (height above PCB level) without mating connectors is around 6mm above PCB level and 2 mm below PCB level. There are two mounting holes for M2 screws for mounting to a NEMA8 stepper motor.2xFigure 4.1 Dimensions of TMCM-1210 and position of mounting holes (with comparison of size)4.2 Board mounting considerationsThe TMCM-1210 offers two metal plated mounting holes. Both mounting holes are connected to power supply ground. Please keep this in mind when mounting the board to the rear side of a motor.Figure 4.2: Example of TMCM-1210 mounted to NEMA 8 stepper motor4.3 ConnectorsThe TMCM-1210 offers two connectors including the motor connector which is used for attaching the motor coils to the electronics. The Power, RS485 and HOME connector is used for power supply, RS485 serial wire communication and offers one digital input.4115Power, RS485 + HOME connector HOME 5RS485+RS485-34VDD GND 12IN0STOP_L / STOP_R Motor connectorOA1OA234OB1OB212Figure 4.2 Overview connectorsOverview of connectors and mating connectors types:Table 4.1: Connectors and mating connectors, contacts and applicable wire4.3.1Power, RS485 + HOME connectorThe module offers one combined power, RS485 2-wire serial communication and digital input (HOME) connector (JST PH series).51Table 4.2: Power, RS485 + IN0 connector4.3.2 Motor connectorAs motor connector a 4pin JST PH-series 2mm pitch single row connector is available. The motor connector is used for connecting the four motor wires of the two motor coils of the bipolar stepper motor to the electronics. 14Table 4.4: Motor connector 4.4 Power supplyFor proper operation care has to be taken with regard to power supply concept and design. Due to space restrictions the TMCM-1210 includes just about 20µF/35V of supply filter capacitors. These are ceramic capacitors which have been selected for high reliability and long life time.4.5RS485For remote control and communication with a host system the TMCM-1210 provides a two wire RS485 bus interface. For proper operation the following items should be taken into account when setting up an RS485 network:1.BUS STRUCTURE:The network topology should follow a bus structure as closely as possible. That is, the connection between each node and the bus itself should be as short as possible. Basically, it should be short compared to the length of the bus.termination resistor (120 Ohm)termination resistor (120 Ohm)Figure 4.6: Bus structure2.BUS TERMINATION:Especially for longer busses and/or multiple nodes connected to the bus and/or high communication speeds, the bus should be properly terminated at both ends. The TMCM-1210 does not integrate any termination resistor. Therefore, 120 Ohm termination resistors at both ends of the bus have to be added externally.3.NUMBER OF NODES:The RS485 electrical interface standard (EIA-485) allows up to 32 nodes to be connected to a single bus.The bus transceiver used on the TMCM-1210 unit (SN65HVD3085E) has a significantly reduced bus load and allow a maximum of 255 units to be connected to a single RS485 bus using TMCL firmware. Please note: usually it cannot be expected to get reliable communication with the maximum number of nodes connected to one bus and maximum supported communication speed at the same time. Instead, a compromise has to be found between bus cable length, communication speed and number of nodes. MUNICATION SPEED:The maximum RS485 communication speed supported by the TMCM-1210 hardware is 1Mbit/s. Factory default is 9600 bit/s. Please see separate TMCM-1210 TMCL firmware manual for information regarding other possible communication speeds below the upper limit in hardware.5.NO FLOATING BUS LINES:Avoid floating bus lines while neither the host/master nor one of the slaves along the bus line is transmitting data (all bus nodes switched to receive mode). Floating bus lines may lead to communication errors. In order to ensure valid signals on the bus it is recommended to use a resistor network connecting both bus lines to well defined logic levels.There are actually two options which can be recommended:Add resistor (Bias) network on one side of the bus, only (120R termination resistor still at both ends):termination resistor(120R)RS485- / RS485Btermination resistor (120R)RS485+ / RS485AFigure 4.7: Bus lines with resistor (Bias) network on one side, onlyOr add resistor (Bias) network at both ends of the bus (like Profibus™ termination):termination resistor (220R)RS485- / RS485BRS485+ / RS485A termination resistor (220R)Figure 4.8: Bus lines with resistor (Bias) network at both endsCertain RS485 interface converters available for PCs already include these additional resistors (e.g. USB-2-485 with bias network at one end of the bus).5Motor driver currentThe on-board stepper motor driver operates current controlled. The driver current may be programmed in software with 32 effective scaling steps in hardware.Explanation of different columns in table below:Motor current setting in software (TMCL)These are the values for TMCL axis parameter 6 (motor run current) and 7 (motor standby current). They are used to set the run / standby current using the following TMCL commands:SAP 6, 0, <value> // set run currentSAP 7, 0, <value> // set standby current(read-out value with GAP instead of SAP. Please see separate TMCM-1210 firmware manual for further information)Motor currentI RMS [A]Resulting motor current based on motor current setting6On-Board LEDsThe board offers one LED in order to indicate board status. The function of the LED is dependent on the firmware version. With standard TMCL firmware the green LED should be flashing slowly during operation.GREEN LEDFigure 6.1 On-board LED7Reset to Factory Default ValuesIn order to reset all settings (e.g. incl. address and RS485 baud rate) to factory default values please follow instruction sequence below:1.Switch OFF power supply.2.Short programming pads on bottom of PCB as shown in figure 7.1.3.Switch ON power supply (on-board LED should start flashing fast).4.Switch OFF power supply.5.Remove short circuit.Figure 7.1 Reset to factory default values (bottom view of pcb)8EMC considerationsThe TMCM-1210 contains ferrite beads on-board in line with the positive supply input and all 4 motor windings connections in addition to filter capacitors.Tests have shown that it is possible to meet Class B emission standards using the bare TMCM-1210 (motor and power connected) with the motor running slowly at maximum current (0.7A RMS) and +24V supply voltage without additional / external filters.Figure8.1:SetupwithTMCM-1210andattachedmotor(***************************/24Vsupply,stand-alone mode using on-board TMCL-autostart-program)Figure 8.2: measurement results (example)Please note that these measurement results using a bare TMCM-1210 unit with only motor and power supply connected do not imply any guarantee for a complete system with one or more integrated TMCM-1210 with meeting any emission limits.9Operational RatingsThe operational ratings show the intended or the characteristic ranges and should be used as design values. In no case shall the maximum values be exceeded!Table 9.1 General operational ratings of modulePERATIONAL RATINGS OF SWITCHTable 9.2 Operational ratings of HOME + STOP switches / IN0 inputsPERATIONAL RATINGS OF INTERFACETable 9.3: Operational ratings of RS485 interface10Functional DescriptionThe TMCM-1210 is a highly integrated controller/driver module which can be controlled via several serial interfaces. Communication traffic is kept low since all time critical operations (e.g. ramp calculations) are performed on board. The nominal supply voltage of the unit is 12V or 24V DC. The module is designed for both, standalone operation and direct mode. Full remote control of device with feedback is possible. The firmware of the module can be updated via the RS485 serial interfaces.In Figure 10.1 the main parts of the TMCM-1210 are shown:∙microprocessor, which runs the TMCL operating system (connected to TMCL memory),∙motion controller (part of TMC2130), which calculates ramps and speed profiles internally by hardware, ∙driver (part of TMC2130) with stallGuard2™ and its energy efficient coolStep™ feature and stealthCh o p™ for extremely quiet operation∙hall sensor based encoder which delivers position feedback at low speed (few 100rpm max.) – can be used for reference search e.g. after power-up7…Figure 10.1 Main parts of the TMCM-121011Revision History11.1D ocument revisionTable 11.1: Document revision11.2H ardware revisionTable 11.2: Hardware revision12References[JST] JST connector[TMC2130] TMC2130 datasheetManual available on [TMCL-IDE] TMCL-IDE User ManualManual available on .。

CC1210KKX7R9BB105中文资料

物料编号：CC1210KKX7R9BB105的详细参数_易容网
MLCC即是多层陶瓷电容片式，是电子信息产品不可或缺的基本组件之一。

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目前，MLCC的应用领域已从手机、电脑、电视机等消费电子领域，逐步拓展到新能源发电、新能源汽车、节能灯具、轨道交通、直流输变电、三网融合、高清电视、机顶盒、手机电视等多个行业。

对于这个悄悄活跃在人们生活中的元件你又知道多少呢.
本次易容网为大家推荐比较常用的MLCC国巨 | Yageo品牌的料号CC1210KKX7R9BB105的相关参数
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易容网（）现已建成全球最大的MLCC电容搜索引擎数据库，包含全球25家电容生产厂商超过28万组MLCC产品数据，用户可根据行业应用、物料编号、规格参数等信息快速的找到所有相关的MLCC电容数据。

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英飞凌 FP50R12N2T7P EconoPIM 2 模块数据表

EconoPIM ™2 模块采用第七代沟槽栅/场终止IGBT7和第七代发射极控制二极管带有温度检测NTC 和预涂导热介质特性•电气特性-V CES = 1200 V-I C nom = 50 A / I CRM = 100 A -沟槽栅IGBT7-低 V CEsat-过载操作达175°C•机械特性-高功率循环和温度循环能力-集成NTC 温度传感器-铜基板-低热阻的三氧化二铝 Al 2O 3 衬底-预涂导热介质-焊接技术可选应用•辅助逆变器•电机传动•伺服驱动器产品认证•根据 IEC 60747、60749 和 60068标准的相关测试，符合工业应用的要求。

描述FP50R12N2T7PEconoPIM ™2 模块内容描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1特性 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1可选应用 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1产品认证 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1内容 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 1封装 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2IGBT, 逆变器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3二极管,逆变器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 4二极管,整流器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 5IGBT, 斩波器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 6Diode-斩波器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 7负温度系数热敏电阻 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 8特征参数图表 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 9电路拓扑图 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 10封装尺寸 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 11模块标签代码 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17修订历史 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18免责声明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191封装表 1绝缘参数特征参数代号标注或测试条件数值单位绝缘测试电压V ISOL RMS, f = 50 Hz, t = 1 min 2.5kV 模块基板材料Cu内部绝缘基本绝缘 (class 1, IEC 61140)Al2O3爬电距离d Creep端子至散热器10.0mm 电气间隙d Clear端子至散热器7.5mm 相对电痕指数CTI>200相对温度指数 (电)RTI封装140°C 表 2特征值特征参数代号标注或测试条件数值单位最小值典型值最大值杂散电感,模块L sCE35nH 模块引线电阻,端子-芯片R AA'+CC'T H=25°C, 每个开关 5.5mΩ模块引线电阻,端子-芯片R CC'+EE'T H=25°C, 每个开关 4.8mΩ储存温度T stg-40125°C 最高基板工作温度T BPmax150°CM5, 螺丝36Nm 模块安装的安装扭距M根据相应的应用手册进行安装重量G180g注:The current under continuous operation is limited to 50 A rms per connector pin.Storage and shipment of modules with TIM => see AN2012-072IGBT, 逆变器表 3最大标定值特征参数代号标注或测试条件数值单位集电极－发射极电压V CES T vj = 25 °C1200V 连续集电极直流电流I CDC T vj max = 175 °C T H = 90 °C50A 集电极重复峰值电流I CRM t P = 1 ms100A 栅极－发射极峰值电压V GES±20V表 4特征值特征参数代号标注或测试条件数值单位最小值典型值最大值集电极－发射极饱和电压V CE sat I C = 50 A, V GE = 15 V T vj = 25 °C 1.50 1.80VT vj = 125 °C 1.64T vj = 175 °C 1.72栅极阈值电压V GEth I C = 2 mA, V CE = V GE, T vj = 25 °C 5.15 5.80 6.45V 栅极电荷Q G V GE = ±15 V, V CE = 600 V0.92µC 内部栅极电阻R Gint T vj = 25 °C0Ω输入电容C ies f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V11.1nF 反向传输电容C res f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V0.039nF 集电极-发射极截止电流I CES V CE = 1200 V, V GE = 0 V T vj = 25 °C0.01mA 栅极-发射极漏电流I GES V CE = 0 V, V GE = 20 V, T vj = 25 °C100nA开通延迟时间(感性负载)t don I C = 50 A, V CE = 600 V,V GE = ±15 V, R Gon = 7.5 ΩT vj = 25 °C0.059µs T vj = 125 °C0.061T vj = 175 °C0.062上升时间(感性负载)t r I C = 50 A, V CE = 600 V,V GE = ±15 V, R Gon = 7.5 ΩT vj = 25 °C0.043µs T vj = 125 °C0.047T vj = 175 °C0.049关断延迟时间(感性负载)t doff I C = 50 A, V CE = 600 V,V GE = ±15 V, R Goff = 7.5 ΩT vj = 25 °C0.290µs T vj = 125 °C0.380T vj = 175 °C0.420下降时间(感性负载)t f I C = 50 A, V CE = 600 V,V GE = ±15 V, R Goff = 7.5 ΩT vj = 25 °C0.110µs T vj = 125 °C0.200T vj = 175 °C0.270开通损耗能量 (每脉冲)E on I C = 50 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Gon = 7.5 Ω, di/dt = 900A/µs (T vj = 175 °C)T vj = 25 °C 5.07mJ T vj = 125 °C 6.76T vj = 175 °C7.72关断损耗能量 (每脉冲）E off I C = 50 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Goff = 7.5 Ω, dv/dt =2900 V/µs (T vj = 175 °C)T vj = 25 °C 3.37mJ T vj = 125 °C 5.31T vj = 175 °C 6.58(待续)表 4(续) 特征值特征参数代号标注或测试条件数值单位最小值典型值最大值短路数据I SC V GE≤ 15 V, V CC = 800 V,V CEmax=V CES-L sCE*di/dt t P≤ 8 µs,T vj=150 °C190At P≤ 7 µs,T vj=175 °C180结－散热器热阻R thJH每个 IGBT, Valid with IFX pre-appliedThermal Interface Material0.777K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.3二极管,逆变器表 5最大标定值特征参数代号标注或测试条件数值单位反向重复峰值电压V RRM T vj = 25 °C1200V 连续正向直流电流I F50A 正向重复峰值电流I FRM t P = 1 ms100A I2t-值I2t V R = 0 V, t P = 10 ms T vj = 125 °C465A²sT vj = 175 °C420表 6特征值特征参数代号标注或测试条件数值单位最小值典型值最大值正向电压V F I F = 50 A, V GE = 0 V T vj = 25 °C 1.72 2.10VT vj = 125 °C 1.59T vj = 175 °C 1.52反向恢复峰值电流I RM I F = 35 A, V R = 600 V,V GE = -15 V, -di F/dt = 900A/µs (T vj = 175 °C)T vj = 25 °C31A T vj = 125 °C39T vj = 175 °C45恢复电荷Q r I F = 50 A, V R = 600 V,V GE = -15 V, -di F/dt = 900A/µs (T vj = 175 °C)T vj = 25 °C 3.96µC T vj = 125 °C7.37T vj = 175 °C9.89(待续)表 6(续) 特征值特征参数代号标注或测试条件数值单位最小值典型值最大值反向恢复损耗（每脉冲）E rec I F = 50 A, V R = 600 V,V GE = -15 V, -di F/dt = 900A/µs (T vj = 175 °C)T vj = 25 °C 1.31mJ T vj = 125 °C 2.52T vj = 175 °C 3.46结－散热器热阻R thJH每个二极管, Valid with IFX pre-appliedThermal Interface Material1.13K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.4二极管,整流器表 7最大标定值特征参数代号标注或测试条件数值单位反向重复峰值电压V RRM T vj = 25 °C1600V 最大正向均方根电流(每芯片)I FRMSM T H = 60 °C70A最大整流器输出均方根电流I RMSM T H = 60 °C100A 正向浪涌电流I FSM t P = 10 ms T vj = 25 °C560AT vj = 150 °C435I2t-值I2t t P = 10 ms T vj = 25 °C1570A²sT vj = 150 °C945表 8特征值特征参数代号标注或测试条件数值单位最小值典型值最大值正向电压V F I F = 50 A T vj = 150 °C 1.05V 反向电流I r T vj = 150 °C, V R = 1600 V1mA 结－散热器热阻R thJH每个二极管, Valid with IFX pre-appliedThermal Interface Material1.10K/W 允许开关的温度范围T vj, op-40150°C5IGBT, 斩波器表 9最大标定值特征参数代号标注或测试条件数值单位集电极－发射极电压V CES T vj = 25 °C1200V 连续集电极直流电流I CDC T vj max = 175 °C T H = 110 °C25A 集电极重复峰值电流I CRM t P = 1 ms50A 栅极－发射极峰值电压V GES±20V表 10特征值特征参数代号标注或测试条件数值单位最小值典型值最大值集电极－发射极饱和电压V CE sat I C = 25 A, V GE = 15 V T vj = 25 °C 1.60 1.85VT vj = 125 °C 1.74T vj = 175 °C 1.82栅极阈值电压V GEth I C = 0.525 mA, V CE = V GE, T vj = 25 °C 5.15 5.80 6.45V 栅极电荷Q G V GE = ±15 V, V CE = 600 V0.395µC 内部栅极电阻R Gint T vj = 25 °C0Ω输入电容C ies f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V 4.77nF 反向传输电容C res f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V0.017nF 集电极-发射极截止电流I CES V CE = 1200 V, V GE = 0 V T vj = 25 °C0.004mA 栅极-发射极漏电流I GES V CE = 0 V, V GE = 20 V, T vj = 25 °C100nA开通延迟时间(感性负载)t don I C = 25 A, V CE = 600 V,V GE = ±15 V, R Gon = 9.1 ΩT vj = 25 °C0.041µs T vj = 125 °C0.043T vj = 175 °C0.044上升时间(感性负载)t r I C = 25 A, V CE = 600 V,V GE = ±15 V, R Gon = 9.1 ΩT vj = 25 °C0.025µs T vj = 125 °C0.028T vj = 175 °C0.030关断延迟时间(感性负载)t doff I C = 25 A, V CE = 600 V,V GE = ±15 V, R Goff = 9.1 ΩT vj = 25 °C0.230µs T vj = 125 °C0.320T vj = 175 °C0.350下降时间(感性负载)t f I C = 25 A, V CE = 600 V,V GE = ±15 V, R Goff = 9.1 ΩT vj = 25 °C0.140µs T vj = 125 °C0.220T vj = 175 °C0.280(待续)表 10(续) 特征值特征参数代号标注或测试条件数值单位最小值典型值最大值开通损耗能量 (每脉冲)E on I C = 25 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Gon = 9.1 Ω, di/dt = 810A/µs (T vj = 175 °C)T vj = 25 °C 1.47mJ T vj = 125 °C 2.05T vj = 175 °C 2.39关断损耗能量 (每脉冲）E off I C = 25 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Goff = 9.1 Ω, dv/dt =3120 V/µs (T vj = 175 °C)T vj = 25 °C 1.65mJ T vj = 125 °C 2.58T vj = 175 °C 3.13短路数据I SC V GE≤ 15 V, V CC = 800 V,V CEmax=V CES-L sCE*di/dt t P≤ 8 µs,T vj=150 °C90At P≤ 7 µs,T vj=175 °C85结－散热器热阻R thJH每个 IGBT, Valid with IFX pre-appliedThermal Interface Material1.19K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.6Diode-斩波器表 11最大标定值特征参数代号标注或测试条件数值单位反向重复峰值电压V RRM T vj = 25 °C1200V 连续正向直流电流I F25A 正向重复峰值电流I FRM t P = 1 ms50A I2t-值I2t V R = 0 V, t P = 10 ms T vj = 125 °C125A²sT vj = 175 °C95表 12特征值特征参数代号标注或测试条件数值单位最小值典型值最大值正向电压V F I F = 25 A, V GE = 0 V T vj = 25 °C 1.83 2.30VT vj = 125 °C 1.70T vj = 175 °C 1.63(待续)表 12(续) 特征值特征参数代号标注或测试条件数值单位最小值典型值最大值反向恢复峰值电流I RM I F = 25 A, V R = 600 V,V GE = -15 V, -di F/dt = 810A/µs (T vj = 175 °C)T vj = 25 °C21.7A T vj = 125 °C26.7T vj = 175 °C29.8恢复电荷Q r I F = 25 A, V R = 600 V,V GE = -15 V, -di F/dt = 810A/µs (T vj = 175 °C)T vj = 25 °C 1.69µC T vj = 125 °C 3.29T vj = 175 °C 4.29反向恢复损耗（每脉冲）E rec I F = 25 A, V R = 600 V,V GE = -15 V, -di F/dt = 810A/µs (T vj = 175 °C)T vj = 25 °C0.63mJ T vj = 125 °C 1.28T vj = 175 °C 1.69结－散热器热阻R thJH每个二极管, Valid with IFX pre-appliedThermal Interface Material1.63K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.7负温度系数热敏电阻表 13特征值特征参数代号标注或测试条件数值单位最小值典型值最大值额定电阻值R25T NTC = 25 °C5kΩR100偏差ΔR/R T NTC = 100 °C, R100 = 493 Ω-55%耗散功率P25T NTC = 25 °C20mW B-值B25/50R2 = R25 exp[B25/50(1/T2-1/(298,15 K))]3375K B-值B25/80R2 = R25 exp[B25/80(1/T2-1/(298,15 K))]3411K B-值B25/100R2 = R25 exp[B25/100(1/T2-1/(298,15 K))]3433K 注:根据应用手册标定7 负温度系数热敏电阻9电路拓扑图图 110封装尺寸图 211模块标签代码图 3修订历史修订历史修订版本发布日期变更说明1.002022-02-01Initial version商标所有参照产品或服务名称和商标均为其各自所有者的财产。

国控精仪 PCM-6661 多功能数据采集卡用户手册说明书

PCM-6661 250Ks/S单端32通道/差分16通道轮询模拟量输入4通道模拟量输出24通道可编程数字量IO3通道计数器多功能数据采集卡用户手册版本号：Q7-32-00修订日期:2020-01-05国控精仪（北京）科技有限公司2020年版权所有本软件文档及相关套件均属国控精仪(北京)科技有限公司所有，包含专利信息，其知识产权受国家法律保护，除非本公司书面授权许可，其他公司、组织不得非法使用和拷贝。

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国控精仪公司信息网址: 英文中文销售服务: ***************电话: 400 9936 400 或************传真: ************地址: 北京市海淀区安宁庄东路18号9号楼请将您下列的信息通过邮件或传真发送给我们目录1概述...................................................................................................................................... - 1 -1.1产品特性.................................................................................................................. - 1 -1.2产品应用.................................................................................................................. - 1 -1.3产品详细指标.......................................................................................................... - 2 -1.3.1模拟量输入(AI) ........................................................................................... - 2 -1.3.2模拟量输出(AO) ....................................................................................... - 4 -1.3.3通用数字I O ................................................................................................. - 5 -1.3.4通用定时计数器 ......................................................................................... - 5 -1.3.5模拟量触发（A.T rig） ............................................................................... - 5 -1.3.6数字量触发（D.T rig） ............................................................................... - 6 -1.3.7稳定时间...................................................................................................... - 6 -1.3.8物理特征...................................................................................................... - 6 -1.3.9产品功耗(典型值) ..................................................................................... - 6 -1.3.10工作环境...................................................................................................... - 6 -1.3.11存储环境...................................................................................................... - 6 -1.4软件支持.................................................................................................................. - 7 -2设备安装.............................................................................................................................. - 8 -2.1产品开箱.................................................................................................................. - 8 -2.2软件安装.................................................................................................................. - 8 -2.3产品布局图.............................................................................................................. - 9 -2.4产品硬件配置.......................................................................................................... - 9 -3信号连接说明.................................................................................................................... - 10 -3.1连接器管脚分配.................................................................................................... - 10 -3.2模拟量输入的信号连接方式................................................................................ - 12 -3.2.1信号源类型................................................................................................ - 12 -3.2.2单端连接方式............................................................................................ - 12 -3.2.3差分连接方式............................................................................................ - 13 -4产品功能详细介绍............................................................................................................ - 15 -4.1AI转换 .................................................................................................................. - 15 -4.1.1AI数据获取模式....................................................................................... - 15 -4.1.2AI 数据格式.............................................................................................. - 16 -4.1.3时钟源相关................................................................................................ - 17 -4.1.4AI启动方式............................................................................................... - 17 -4.1.5触发功能.................................................................................................... - 18 -4.1.6DMA数据传输功能 ................................................................................. - 19 -4.2AO转换................................................................................................................. - 19 -4.2.1AO数据输出模式..................................................................................... - 20 -4.2.2AO数据格式............................................................................................. - 20 -4.2.3AO启动方式............................................................................................. - 20 -4.2.4AO停止方式............................................................................................. - 21 -4.3数字量输入、输出................................................................................................ - 21 -4.3.1数字量输入、输出控制............................................................................ - 21 -4.3.2电气特性.................................................................................................... - 22 -4.4计数器.................................................................................................................... - 22 -4.4.1方式0：计数模式0；.............................................................................. - 22 -4.4.2方式1：计数模式1；.............................................................................. - 23 -4.4.3方式2：频率周期模式0；...................................................................... - 23 -4.4.4方式3：频率周期模式1；...................................................................... - 23 -4.4.5方式4：频率周期模式2；...................................................................... - 24 -4.4.6方式5：脉冲发生模式0；...................................................................... - 24 -4.4.7方式6：脉冲发生模式1；...................................................................... - 25 -4.4.8方式7：脉冲发生模式2；...................................................................... - 25 -5注意事项、产品校准........................................................................................................ - 26 -6产品检测、校准....................................................................................... 错误!未定义书签。

启珑微电子产品手册说明书

产品手册PRODUCT MANUAL(北京︶有限公司并一直致力于为工业智能控制、医疗设备、轨道交通、智能交通以及智能家居等领域提供更优质的产品与服务。

公司具有深厚的文化底蕴，由多位有欧美留学、工作经历的归国人员创办，坚实的理论功底和丰富的芯片设计经验奠定了启珑微电子的高起点和高水准，并迅速成长为业内具有自主知识产权的中国IC设计品牌之一。

产品手册01序号产品型号封装形式产品概述兼容型号1CLM811HST-AXC TQFP-48SL811HST-AXC 2CLCP82C55AZ DIP-40CP82C55AZ 3CLIP82C55AZ DIP-40IP82C55AZ 4CLCS82C55AZ PLCC-44CS82C55AZ 5CLIS82C55AZ PLCC-44IS82C55AZ 6CLCQ82C55AZ MQFP-44CQ82C55AZ 7CLIQ82C55AZ MQFP-44IQ82C55AZ 8CLID82C55AZ DIP-40ID82C55A 9CLMD82C55A/B DIP-40MD82C55A/B 10CLMD82C55QA DIP-40MD82C55QA 11CLM65HVD230D SOIC-8SN65HVD230D 12CLM65HVD230QD SOIC-8SN65HVD230QD 13CLM65HVD231D SOIC-8SN65HVD231D 14CLM65HVD231QD SOIC-8SN65HVD231QD 15CLM65HVD232D SOIC-8SN65HVD232D 16CLM65HVD232QD SOIC-8SN65HVD232QD 17CLM65HVD233D SOIC-8具有待机模式和环回功能的 3.3V SN65HVD233D 18CLM65HVD233HD SOIC-8具有待机模式和环回功能的 3.3V SN65HVD233HD 19CLM65HVD233QDRQ1SOIC-8具有待机模式和环回功能的 3.3V SN65HVD233QDRQ120CLM65HVD233MDREP SOIC-8具有待机模式和环回功能的 3.3V SN65HVD233MDREP产品手册02序号产品型号封装形式产品概述兼容型号21CLM65HVD234D SOIC-8SN65HVD234D 22CLM65HVD234QDRQ1SOIC-8SN65HVD234QDRQ123CLM65HVD235D SOIC-8SN65HVD235D 24CLM65HVD235QDRQ1SOIC-8SN65HVD235QDRQ125CLM75176BPS SOIC-8SN75176BPSR 26CLM75176BDR SOIC-8SN75176BDR 27CLM75176ADR SOIC-8SN75176ADR 28CLM75176AP DIP-8SN75176AP 29CLM76176BP DIP-8SN75176BP 30CLM75179BPS SOIC-8SN75179BPS 31CLM75179BDR SOIC-8SN75179BDR 32CLM75179AP DIP-8SN75179AP 33CLM75179BP DIP-8SN75179BP 34CLM65HVD08D SOIC-8SN65HVD08D 35CLM65HVD08P DIP-8SN65HVD08P 36CLM65HVD75D SOIC-8具有IEC ESD保护功能和20Mbps的SN65HVD75D 37CLM65HVD75DGK VSSOIC-8具有IEC ESD保护功能和20Mbps的SN65HVD75DGK 38CLM65HVD75DRBT VDFN-8具有IEC ESD保护功能和20Mbps的SN65HVD75DRBT 39CLM3085CPA+DIP-8(10Mbps)、限摆率RS-485/MAX3085CPA+40CLM3085EPA+DIP-8(10Mbps)、限摆率RS-485/MAX3085EPA+产品手册03序号产品型号封装形式产品概述兼容型号41CLM3085EEPA DIP-8(10Mbps)、限摆率RS-485/MAX3085EEPA 42CLM3085CSA+T SOIC-8(10Mbps)、限摆率RS-485/MAX3085CSA+43CLM3085ECSA+T MSOIC-8(10Mbps)、限摆率RS-485/MAX3085ECSA+T 44CLM3085ESA+T SOIC-8(10Mbps)、限摆率RS-485/MAX3085ESA+45CLM3085EESA+T SOIC-8(10Mbps)、限摆率RS-485/MAX3085EESA+46CLM3088CSA+T SOIC-8MAX3088CSA+T 47CLM3088ECSA+T SOIC-8MAX3088ECSA+T 48CLM3088ESA+T SOIC-8MAX3088ESA+T 49CLM3088EESA+T SOIC-8MAX3088EESA+T 50CLM3088CPA+DIP-8MAX3088CPA+51CLM3088ECPA+DIP-8MAX3088ECPA+52CLM3088EPA+DIP-8MAX3088EPA+53CLM3088EEPA+DIP-8MAX3088EEPA+54CLM485CPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX485CPA+55CLM485ECPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX485ECPA+56CLM485EPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX485EPA+57CLM485EEPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX485EEPA+58CLM485CSA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX485CSA+59CLM485ESA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX485ESA+60CLM485EESA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX485EESA+产品手册04序号产品型号封装形式产品概述兼容型号61CLM3490CSA+SOIC-8 3.3V供电、10Mbps、限摆率、真MAX3490CSA+62CLM3490ECSA+SOIC-8 3.3V供电、10Mbps、限摆率、真MAX3490ESA+63CLM3490ESA+SOIC-8 3.3V供电、10Mbps、限摆率、真MAX3490ESA+64CLM3490EESA+SOIC-8 3.3V供电、10Mbps、限摆率、真MAX3490EESA+65CLM3491CSD SOP-14 3.3V供电、10Mbps、限摆率、真MAX3491CSD+66CLM3491ECSD+SOP-14 3.3V供电、10Mbps、限摆率、真MAX3491ECSD+67CLM3491ESD+SOP-14 3.3V供电、10Mbps、限摆率、真MAX3491ESD+68CLM3491EESD+SOP-14 3.3V供电、10Mbps、限摆率、真MAX3491EESD+69CLM490CSA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX490CSA+70CLM490ECSA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX490ECSA+71CLM490ESA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX490ESA+72CLM490EESA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX490EESA+73CLM490CPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX490CPA+74CLM490ECPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX490ECPA+75CLM490EPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX490EPA+76CLM490EEPA+DIP-8低功耗、限摆率、RS-485/RS-422MAX490EEPA+77CLM488CSA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX488CSA+78CLM488ECSA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX488ECSA+79CLM488ESA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX488ESA+80CLM488EESA+SOIC-8低功耗、限摆率、RS-485/RS-422MAX488EESA+产品手册序号产品型号封装形式产品概述兼容型号81CLM488CPA+DIP-8MAX488CPA+82CLM488ECPA+DIP-8MAX488ECPA+83CLM488EPA+DIP-8MAX488EPA+84CLM488EEPA+DIP-8MAX488EEPA+85CLM232CSE SOIC-16MAX232CSE+T86CLM232ECSE SOIC-16MAX232ECSE+87CLM232ESE SOIC-16MAX232ESE+T88CLM232EESE SOIC-16MAX232EESE+T89CLM232CPE DIP-16MAX232CPE+90CLM232ECPE DIP-16MAX232ECPE+91CLM232EPE DIP-16MAX232EPE+92CLM232EEPE DIP-16MAX232EEPE+93CLM232CWE SOIC-16MAX232CWE+T94CLM232ECWE SOIC-16MAX232ECWE+T95CLM232EWE SOIC-16MAX232EWE+T96CLM232EEWE SOIC-16MAX232EEWE+T97CLM232ACWE SOIC-16MAX232ACWE+T98CLM232AEWE SOIC-16MAX232AEWE+99CLM3232CSE SOIC-16MAX3232CSE+T 100CLM3232ECSE SOIC-16MAX3232ECSE+T05产品手册06序号产品型号封装形式产品概述兼容型号101CLM3232ESE SOIC-16MAX3232ESE+T 102CLM3232EESE SOIC-16MAX3232EESE+T 103CLM1302S SOIC-8DS1302S+T&R 104CLM1302SN+SOIC-8DS1302SN+T&R 105CLM1302Z+T SOIC-8DS1302Z+T&R 106CLM1302ZN+SOIC-8DS1302ZN+T&R 107CLM1302+DIP-8DS1302+108CLM1302N+DIP-8DS1302N+109CLM307Z+SOIC-8DS1307Z+T&R 110CLM1307ZN+SOIC-8DS1307ZN+T&R 111CLM1307+DIP-8DS1307+112CLM1307N+DIP-8DS1307N+113CLM4717EUB+MSOP-10拟开关MAX4717EUB+114CLM231N/NOPB DIP-8LM231N/NOPB 115CLM231AN/NOPB DIP-8LM231AN/NOPB 116CLM331N/NOPB DIP-8LM331N/NOPB 117CLM331AN/NOPB DIP-8LM331AN/NOPB 118CLM298N Multiwatt-15L298N 119CLM298P POWERSO-20L298P 120CLM2543CDW SOIC-20TLC2543CDW产品手册07序号产品型号封装形式产品概述兼容型号121CLM2543IDW SOIC-20TLC2543IDW 122CLM2543CDB SSOP-20TLC2543CDB 123CLM2543IDB SSOP-20TLC2543IDB 124CLM2543CN DIP-20TLC2543CN 125CLM2543IN DIP-20TLC2543IN 126CLM1543CDW SOIC-20TLC1543CDW 127CLM1543IDW SOIC-20TLC1543IDW 128CLM1543CN DIP-20TLC1543CN 129CLM1543IN DIP-20TLC1543IN 130CLM5615CDGK VSSOIC-8趋稳时间为12.5us并具备上电复位功能的10位、单通道、低功耗DAC TLC5615CDGK 131CLM5615IDGK VSSOIC-8趋稳时间为12.5us并具备上电复位功能的10位、单通道、低功耗DAC TLC5615IGGK 132CLM5615CD SOIC-8趋稳时间为12.5us并具备上电复位功能的10位、单通道、低功耗DAC TLC5615CD 133CLM5615ID SOIC-8趋稳时间为12.5us并具备上电复位功能的10位、单通道、低功耗DAC TLC5615ID 134CLM5615CP DIP-8趋稳时间为12.5us并具备上电复位功能的10位、单通道、低功耗DAC TLC5615CP 135CLM5615IP DIP-8趋稳时间为12.5us并具备上电复位功能的10位、单通道、低功耗DAC TLC5615IP 136CLM3616-00SOP-14IW3616-00137CLM3616-01SOP-14IW3616-01138CLM3617-00SOP-14IW3617-00139CLM3617-01SOP-14IW3617-01140CLM3630-00SOP-14IW3630-00产品手册序号产品型号封装形式产品概述兼容型号141CLM1100-0001BGA-128ASIC从站控制ET1100-0001142CLM1100-0002BGA-128ASIC从站控制ET1100-0002143CLM1100-0003BGA-128ASIC从站控制ET1100-0003144CLM1200-0001QFN-48ASIC从站控制ET1200-0001145CLM1200-0002QFN-48ASIC从站控制ET1200-0002146CLM1200-0003QFN-48ASIC从站控制ET1200-0003147CLM8656ARZ SOIC-8AD8656ARZ148CLM8656ARMZ MSOIC-8AD8656ARMZ149CLM1040T/CM,118SOIC-8TJA1040T/CM,118 150CLM1042T/CM,118SOIC-8TJA1042T/CM,118 151CLM1050T/CM,118SOIC-8TJA1050T/CM,118 152CLM1051T/CM,118SOIC-8TJA1051T/CM,118 153CLM82C250T/YM SOIC-8PCA82C250T/YM 154CLM82C251T/YM SOIC-8PCA82C251T/YM 155CLMEE80C196KC20PLCC-68EE80C196KC20 156CLMEN80C196KC20PLCC-68EN80C196KC20 157CLMN80C196KC20PLCC-68N80C196KC20 158CLMTN80C196KC20PLCC-68TN80C196KC20 159CLMEE87C196KC20PLCC-68EE87C196KC20 160CLMEN87C196KC20PLCC-68EN87C196KC2008产品手册09序号产品型号封装形式产品概述兼容型号161CLMN87C196KC20PLCC-68N87C196KC20162CLMTN87C196KC20PLCC-68TN87C196KC20163CLM8051F020-GQ TQFP-100C8051F020-GQ 164CLM8051F021-GQ TQFP-64C8051F021-GQ 165CLM8051F330-GM VFQFN-20C8051F330-GM 166CLM8051F500-IQ TQFP-48C8051F500-IQ 167CLM8051F500-IM VFQFN-48C8051F500-IM 168CLM8051F502-IQ LQFP-32C8051F502-IQ 169CLM8051F502-IM QFN-32C8051F502-IM170CLM08D1500CIYB/NOPB HLQFP-128ADC08D1500CIYB/NOPB 171CLM083000CIYB/NOPB HLQFP-128ADCADC083000CIYB/NOPB 172CLM10AQ190AVTPY EBGA-38010位5GSPS ADC EV10AQ190AVTPY 173CLM9680BCPZ-1250LFCSP-64双通道14位1GSPS ADC AD9680BCPZ-1250174CLM9739BBCZ BGA-16014位、2.5 GSPS、RF数模AD9739BBCZ 175CLM9779ABSVZ TQFP-100双通道16位1GSPS DAC AD9779ABSVZ 176CLM12DS130AVZPY FPBGA-19612位3GSPS DAC EV12DS130AVZPY 177CLM12DS460AVZP FPBGA-19612位6.4GSPS DAC EV12DS460AVZP 178CLM9434BCPZ-370LFCSP-5612位370MSPS ADC AD9434BCPZ-370179CLM9434BCPZ-500LFCSP-5612位500MSPS ADC AD9434BCPZ-500180CLM4149IRGZTVQFN-4814位250MSPS ADCADS4149IRGZT产品手册10序号产品型号封装形式产品概述兼容型号181CLM9467BCPZ-200LFCSP-7216位200MSPS ADC AD9467BCPZ-200182CLM9467BCPZ-250LFCSP-7216位250MSPS ADC AD9467BCPZ-250183CLM9656BCPZ-125LFCSP-56四通道16位125MSPS ADC AD9656BCPZ-125184CLM9245BCPZ-40LFCSP-3214位40MSPS ADC AD9245BCPZ-40185CLM9245BCPZ-65LFCSP-3214位65MSPS ADC AD9245BCPZ-80186CLM9245BCPZ-80LFCSP-3214位80MSPS ADC AD9245BCPZ-80187CLM9783BCPZ LFCSP-72双通道16位500MSPS DAC AD9783BCPZ 188CLM7656BSTZ-REEL LQFP-64六通道16位250KSPS ADC AD7656BSTZ-REEL 189CLM7960BCPZLFCSP-3218位2MSPS ADC AD7960BCPZ190CLM128S102CIMTX/NOPB TSSOP-1612位1MSPS ADC ADC128S102CIMTX/NOPB 191CLM5638IDR SOIC-8DACTLV5638IDR 192CLM7606BSTZ LQFP-64AD7606BSTZ 193CLM9625BBPZ-2.5BGA-19612位2.6GSPS ADC AD9625BBPZ-2.5194CLM9164BBCZ BGA-16516位12GSPS DAC AD9164BBCZ 195CLM9154BCPZ LFCSP-88四通道16位2.4GSPS DAC AD9154BCPZ 196CLM2160IUK#PBF QFN-4816位25MSPS ADC LTC2160IUK#PBF 197CLM9652BBCZ-310BGA-144双通道16位310MSPS ADC AD9652BBCZ-310198CLM7779ACPZ-RL LFCSP-6424位16KSPS ADC AD7779ACPZ-RL 199CLM9208BBPZ-3000BGA-196双通道14位3GSPS ADCAD9208BBPZ-3000200CLM320VC33PGE120LQFP-144TMS320VC33PGE120产品手册序号产品型号封装形式产品概述兼容型号201CLM320VC33PGEA120LQFP-144TMS320VC33PGEA120 202CLM320VC33PGE150LQFP-144TMS320VC33PGE150203CLM320VC5402PGE100LQFP-144TMS320VC5402PGE100 204CLM320F28335PGFA LQFP-176TMS320F28335PGFA205CLM320LF2406APZA LQFP-100TMS320LF2406APZA206CLM320LF2406APZS LQFP-100TMS320LF2406APZS207CLM320LF2407APGES LQFP-144TMS320LF2407APGES208CLM320LF2407APGEA LQFP-144TMS320LF2407APGEA 209CLM320C6713BPYP200HLQFP-208TMS320C6713BPYP200 210CLM320C6713BZDP225BGA-272TMS320C6713BZDP225 211CLM320C6713BGDP225BGA-272TMS320C6713BGDP225 212CLM320C6713BZDP300BGA-272TMS320C6713BZDP300 213CLM320C6713BGDG300BGA-272TMS320C6713BGDP30011邮箱：*******************。

加严型片式多层瓷介电容器(CT41G系列)

±1%
±2%
±5%
±5%
注:特殊精度在型号及规格中，采用直标法表示。 ⑦ 端头形式： N= 银/镍/锡或铜/镍/锡（无铅化）标准品
P=钯银合金（单层高温端头） ⑧ 包装：T=散装 1000只/包、 500支/包
F=纸编带盘装 4000只/盘 1206、0805 、0603尺寸 10000只/盘 0402尺寸
③ 电气性能
项目环境温度特性绝缘电阻
2X1(X7R) -55℃～125℃
±15% ≥20GΩ或500MΩ μF
2R2(X5R) -55℃～85℃
±15% ≥20GΩ或500MΩ μF
损耗角正切抗电强度
≥50V: ≤3.5% 25V: ≤5.0% 16V: ≤7.0% 10V: ≤10%
3.0倍额定电压
cap 100 （pF） 120
150
180
W
220
L
270
T
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
cap （μF）
.010 .012
.015
.018
.022
.027
.033
.039
.047
.056
.068
ct41g系列加严型片式多层瓷介电容器组别y5vcgx7rx5r代码允许偏差c10pfb特选c10pfg特选01pf025pf05pf12551020502013ct41g系列加严型片式多层瓷介电容器ct41g型x7rx5r要了解最大容量及500v以上系列产品请联络火炬电子

贴片电容的标识

贴片电容型号-如何识别各厂家贴片电容标识
作者：来源：欣达科技时间：1970-01-01
贴片电容和其它贴片电子元器件一样，按封装类型（也就是体积的大小）可分为0402（1.0×0.5）、 0603（1.6×0.8）、0805（2.0×1.2）、 1206（3.2×1.6）、 1210（3.2×2.5）、 1812（4.5×3.2）等。

除了封装类型外，常见的贴片电容还必须包括材质、容量、电压和精度等。

以下以系列的贴片电容的型号为例：
例：0805 CG 102 J 500 N T
0805：是指该贴片电容的尺寸套小，是用英寸来表示的。

08表示长度是0.08英寸、05表示宽度为0.05英寸；CG：是表示做这种电容要求用的材质，这个材质一般适合于做小于10000PF以下的电容；
102：是指电容容量，前面两位是有效数字、后面的2表示有多少个零102=10×102,也就是=1000PF；
J：是要求电容的容量值达到的误差精度为5％，介质材料和误差精度是配对的；
500：是要求电容承受的耐压为50V。

同样500前面两位是有效数字，后面是指有多少个零；
N：是指端头材料。

现在一般的端头都是指三层电极(银/铜层)、镍、锡；
T：是指包装方式。

T表示编带包装，B表示塑料盒散包装；
国巨、TDK，三星等贴片电容型号基本上也是这样，只是使用的符号不一样而已。

msc1210中文

参数
模拟输入 AIN0-AIN7 AINCOM 模拟输入范
围
全输入电压范围差分输入阻抗
输入电流带宽
快速沉积滤波器 Sinc2滤波器 Sinc2滤波器
可编程增益放大器输入电容输入漏电流熔断电流
偏移DAC 偏移DAC范围偏移DAC单调性偏移DAC增益偏差偏移DAC增益偏差漂移
条件
缓冲区关闭缓冲区打开 IN+ - IN- 看图4 缓冲区关闭缓冲区打开
256
内部 MOVX 静态随机存储器字节 1024
1024
1024
1024
数
外部可存取存储器字节数
程序 64K 数据 64K
程序 64K 数据 64K
程序 64K 数据 64K
程序 64K 数据 64K
注释 1 所有器件的外围特性相同仅闪存容量不同 2 类型号的最后一位数字代表片内闪存容量的大小= 2N KB
DC下 fCM = 60Hz, fDATA = 10Hz fCM = 50Hz, fDATA = 50Hz fCM = 60Hz, fDATA = 60Hz fSIG = 50Hz, fDATA = 50Hz fSIG = 60Hz, fDATA = 60Hz
DC下 dB =–20log( VOUT/ VDD)
MSC1210YX
最小值
典型值
最大值
单位
AGND-0.1 AGND
1
5/PGA 0.5
AVDD+0.1
AVDD-1.5
+VREF/PGA
0.469 • fDATA 0.318 • fDATA 0.262 • fDATA
9 0.5 +6
128

tusb1210中文规格书

tusb1210中文规格书TUSB1210中文规格书TUSB1210是一款具有USB到串行总线转换功能的集成电路芯片。

它能够实现USB与串行总线之间的高速数据传输和通信。

本文将对TUSB1210的功能特性、电气特性和应用领域进行详细介绍。

一、功能特性TUSB1210支持USB 2.0规范，具有以下功能特性：1. USB接口：TUSB1210采用了USB2.0接口标准，支持高速（480 Mbps）、全速（12 Mbps）和低速（1.5 Mbps）三种传输速率。

2. 串行总线接口：TUSB1210具备了可编程的串行总线接口，支持SPI（Serial Peripheral Interface）和I2C（Inter-Integrated Circuit）两种通信协议。

3. 集成电源管理：TUSB1210内部集成了电源管理电路，可通过软件配置实现低功耗模式和待机模式，有效延长电池寿命。

4. 多通道支持：TUSB1210具备多个通道，可以同时连接多个外设设备，实现多通道数据传输。

5. 热插拔支持：TUSB1210支持热插拔功能，用户可以在系统运行时插拔USB设备，无需重启系统。

二、电气特性TUSB1210具有以下电气特性：1. 工作电压：TUSB1210的工作电压范围为3.3V至5.5V，适用于各种电源供应系统。

2. 工作温度：TUSB1210的工作温度范围为-40℃至85℃，适用于工业级应用。

3. ESD保护：TUSB1210内部集成了ESD（Electrostatic Discharge）保护电路，能够有效抵御静电击穿，提高芯片的可靠性和稳定性。

4. 引脚配置：TUSB1210的引脚配置灵活多样，可根据不同的应用需求进行定制。

5. 低功耗设计：TUSB1210采用了低功耗设计，工作时的功耗较低，适合于移动设备和便携式电子产品。

三、应用领域TUSB1210广泛应用于各种USB接口和串行总线接口的设备和系统中，包括但不限于以下领域：1. 个人电脑：TUSB1210可用于连接USB设备，如USB鼠标、USB键盘、USB摄像头等，实现与计算机的数据交互。

NUC微控制器产品系列说明书

112 µA/MHz @ 正常模式 1.5 µA @ 掉电模式
M251 Feature
。 Arm® Cortex®-M23 。运行速度可达 48 MHz
M252 Feature
。 USB 2.0 全速设备无需外挂晶振
M253 Feature
。 USB 2.0 全速设备无需外挂晶振
。高达五路 UART 。 CAN FD x1
2
Low Power
TrustZone
AEC-Q100
Market Trend
随着电子应用对低功耗或电池供电的需求日益增加，现今的应用必须尽量降低能源消耗，甚至在极端情况下，可能需要倚赖单颗电池来维持长达 15 至 20 年运转
低功耗应用情景包含手持式设备、居家、 AIoT、IIoT (工业物联网) 等应用情景，使用范围十分广泛
(Programmable Serial I/O) • USB 2.0 全速装置无需外挂晶振 • 独立的 RTC 电源 VBAT 管脚
Highlight
• 支持 1.8 V ~ 5.5 V 串行接口，可连接不同电压装置
*USCI: Universal Serial Control Interface Controller
C
1.8 3.3 5 M253
CU
3.3 5 M071
1.8 3.3 5 M252
U
3.3 5 M051
1.8 3.3 5 M251
3.3 5 Mini51
3.3 5 3.3 5
1.8 3.3 Nano100
M480 M460 M471 M453 M452 M451
E CU E CU
U C
U
Arm9™

1210使用说明书

HYP1210微机电容器保护装置使用说明书ＵＳＥＲＧＵＩＤＥ®ZHEJIANG HUAYI ELECTRIC POWER AUTOMATION CO.，LTD ®ZHEJIANG HUAYI ELECTRIC POWER AUTOMA TION CO.，LTD目录1.适用范围 (4)2.装置功能及保护原理简述 (4)2.1 电气参数测量 (4)2.2 延时速断保护 (4)2.3 定时限过流保护 (4)2.4中性点不平衡电流保护（适用于电容器组双Y形接线） (4)2.5零序电压保护(开口三角电压,适用于单组电容器) (4)2.6过电压保护 (4)2.7低电压保护 (4)2.8 PT断线报警 (5)2.9定值错误报警 (5)2.10装置故障报警 (5)3、技术参数 (5)4.按键功能及操作方法 (6)4.1按键功能 (6)4.1.1“▼”搜索键与功能键 (6)4.1.2“◄►”显示、进入修改状态及移动、修改键 (6)4.1.3“▲”修改、操作键 (6)4.1.4“■信号复归”键 (6)4.2输入密码的方法: (6)4.3搜索方法(适用于定点显示和进入定值区的显示): (6)4.4密码种类 (6)5.数码管的显示种类 (6)5.1 数码管显示说明 (6)5.2几种显示列表 (6)5.2.1循环显示（供运行人员使用） (7)5.2.2定点显示 (7)5.2.3定值区的显示(输入密码1111) (7)5.2.4有报警或预告时的显示: (8)6.调试大纲(适用于调试人员及维护人员) (9)6.1查看、输入或修改保护定值: (9)6.2开关量的检查 (9)6.3保护继电器的出口检查 (9)6.4模拟量输入检查及精度检查 (9)6.4.1电流校准 (9)6.4.2电压校准 (9)6.4.3不平衡电流校准 (9)6.6保护试验 (10)6.6.1延时速断与定时限过流保护测试 (10)6.6.2过电压保护测试 (10)6.6.3低电压保护测试 (10)®ZHEJIANG HUAYI ELECTRIC POWER AUTOMA TION CO.，LTD®ZHEJIANG HUAYI ELECTRIC POWER AUTOMA TION CO.，LTD 36.6.4不平衡电流保护测试 (10)6.6.5零序电压保护测试 (10)6.6.6保护动作时间测试 (10)6.6.7 PT回路断线报警 (10)7.机箱结构及端子图 (11)7.1装置组成 (11)7.1机箱结构图与说明 (11)7.2安装与开孔图 (12)7.3装置端子图 (12)8.运行人员注意事项及要求 (13)9.检修及维护 (14)附录1：HYP1210微机电容器保护装置原理图 (1)附录2：HYP1210微机电容器保护装置原理接线图 (2)1.适用范围HYP1210微机电容器保护装置适用于6－66KV 中性点不接地系统，作为电容器的成套保护和监视报警装置，适用于高低压开关柜、箱式变电站等使用电容补偿的场合。

NMC-P1210X7R105K5KVTRPLPF中文资料

NMC-P SeriesMultilayer Ceramic Chip CapacitorsTemperature Coefﬁ cient NPO X7R Capacitance Range2.2pF ~ 0.22µF 180pF ~ 10µFCapacitance Tolerance For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F)Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K)±10% (K) & ±20% (M)Operating Temperature Range -55°C ~ +125°C Temperature Characteristics±30ppm/°C ±15% ∆ Cap.Rated Voltages 16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5KvdcQ or Dissipation FactorQ = > 1000 (more then 30pF)*Q = > 400 + 20 x C in pF (30pF and below)*2.5% max. @ 1KHz, 1.0V ± 0.2Vrms insulation Resistance 10,000Megohm or 500Megohm/µF whichever is less @ +25°CDielectric Withstanding Voltage 200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)FEATURES• CRACK RESISTANT TERMINATION• SOFT TERMINATION, OPEN MODE FAILURE • WIDE VOLTAGE RANGE (16V TO 5KV)• HIGH CAPACITANCE (UP TO 10µF)• RoHS COMPLIANT• SAC SOLDER COMPATIBLE****Reﬂ ow soldering is recommended. Contact NIC regarding the use of other soldering methods.Base layer (Cu 50V ~ 250V) (Ag 500V ~ up)Flexible layer (Polymer)Barrier layer (Ni)Finish layer (Sn)Termination Separation (Open Failure Mode)CONSTRUCTIONOPEN MODE FAILURE AS A RESULT OF BENDING STRESSRoHS Compliantincludes all homogeneous materials*See Part Number System for Details*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms NMC-P 1206 X7R 105 K 50 TRP or TRPLP FRoHS CompliantTape & Reel (Plastic Carrier) Tape & Reel (Paper Carrier)Voltage (Vdc) Capacitance Tolerance Code (see chart) Capacitance Code, expressed in pF, ﬁ rst 2 digits are signiﬁ cant, 3rd digit is no. of zeros Temperature Characteristic (NPO or X7R) Size Code (see chart) SeriesPART NUMBER SYSTEMMultilayer Ceramic Chip CapacitorsNMC-P SeriesMultilayer Ceramic Chip CapacitorsNMC-P SeriesNMC-P SeriesMultilayer Ceramic Chip CapacitorsMultilayer Ceramic Chip CapacitorsNMC-P Series。

半导体器件芯片常用型号参数12页word文档

半导体器件常用型号参数一、半导体二极管参数符号及其意义CT---势垒电容Cj---结（极间）电容，表示在二极管两端加规定偏压下，锗检波二极管的总电容Cjv---偏压结电容Co---零偏压电容Cjo---零偏压结电容Cjo/Cjn---结电容变化Cs---管壳电容或封装电容Ct---总电容CTV---电压温度系数。

在测试电流下，稳定电压的相对变化与环境温度的绝对变化之比CTC---电容温度系数Cvn---标称电容IF---正向直流电流（正向测试电流）。

锗检波二极管在规定的正向电压VF下，通过极间的电流；硅整流管、硅堆在规定的使用条件下，在正弦半波中允许连续通过的最大工作电流（平均值），硅开关二极管在额定功率下允许通过的最大正向直流电流；测稳压二极管正向电参数时给定的电流IF（AV）---正向平均电流IFM（IM）---正向峰值电流（正向最大电流）。

在额定功率下，允许通过二极管的最大正向脉冲电流。

发光二极管极限电流。

IH---恒定电流、维持电流。

Ii--- 发光二极管起辉电流IFRM---正向重复峰值电流IFSM---正向不重复峰值电流（浪涌电流）Io---整流电流。

在特定线路中规定频率和规定电压条件下所通过的工作电流IF(ov)---正向过载电流IL---光电流或稳流二极管极限电流ID---暗电流IB2---单结晶体管中的基极调制电流IEM---发射极峰值电流IEB10---双基极单结晶体管中发射极与第一基极间反向电流IEB20---双基极单结晶体管中发射极向电流ICM---最大输出平均电流IFMP---正向脉冲电流IP---峰点电流IV---谷点电流IGT---晶闸管控制极触发电流IGD---晶闸管控制极不触发电流IGFM---控制极正向峰值电流IR（AV）---反向平均电流IR（In）---反向直流电流（反向漏电流）。

在测反向特性时，给定的反向电流；硅堆在正弦半波电阻性负载电路中，加反向电压规定值时，所通过的电流；硅开关二极管两端加反向工作电压VR时所通过的电流；稳压二极管在反向电压下，产生的漏电流；整流管在正弦半波最高反向工作电压下的漏电流。

电源适配器 MA1210 用户手册说明书

用户手册电源适配器MA1210规格参数参数项参数内容170-240VAC 50Hz AC输入尺寸使用环境内直径2.1毫米，外直径5.5毫米DC插头工作温度：-30~50℃、存储温度：-40~70℃工作湿度：10%~90%RH不凝结、存储湿度：5%~90%RH不凝结DC输出12VDC 1A(MAX)80mmX132mmX33mm注意：此为A级产品，在生活环境中，该产品可能会造成无线电干扰。

在这种情况下，可能需要客户对干扰采取切实可行的措施。

按电源内盒卡扣，取出内盒。

①③将监控摄像机的DC电源线与稳压电源DC接口连接，线头保持安全距离，以防短路。

④将电源内盒推入外壳中，确认锁紧，并⑤通过壁挂孔将电源安装在合适的位置。

物品清单：电源适配器 x 6 说明书 x 1②根据不同布线需求，选择合适的操作方式。

7108502529 REV1.0.4有毒有害物质含量声明产品保修卡下列情况不属于免费维修范围，深圳市美科星通信技术有限公司（以下简称本公司）可提供有偿服务，请注意：未按使用说明书要求安装、使用、维护、保管导致的产品故障或损坏；已经超出保修、保换期限；擅自涂改、撕毁产品条形码；产品保修卡上的产品条形码或型号与产品本身不符；未经本公司许可，擅自改动产品固有的设置文件或擅自拆机修理；意外因素或人为行为导致的产品故障或损坏，如对准强光聚焦、输入不合适电压、高温、进水、机械破坏、摔坏、产品严重氧化或生锈等；产品在客户发回返修途中由于运输、装卸所导致的损坏；因不可抗力如地震、火灾、水灾、雷击等导致的产品故障或损坏；其他非产品本身设计、技术、制造、质量等问题而导致的产品故障或损坏。

特别说明：在国家法律法规的范围内，本承诺的解释权、修改权归深圳市美科星通信技术有限公司。

电源适配器的保换期限为1年，电池的保换期限为6个月。

如因用户使用不当或意外因素，造成电源适配器或电池有明显的硬物损伤、裂痕、断脚、严重变形，电源线破损、断线、裸芯等现象则不予保换，用户可另行购买。

CC1210EX5R110K中文资料

/3a3a.htmlCAPACITORSCeramic ChipTDK`s new Sub-Miniature chip capacitor additions answer the electronics industry`s need for higher density packaging.TDK`s advanced technology allows for smaller size,highest capacitance,increased reliability,and automated assembly.Applications include computers and peripherals,telecommunications,measuring and medical equipment,and any application that requires miniaturization.Capacitance Range10pF tolVrms,1kHz 25NPO 1,000pF and less:1MHzCapacitance Tolerance Operating Temperature RangeAt the same condition as temperaturecharacteristics Working Voltage (DC WV)6.3V,10V,16V,25V,50V Dielectric Strength250%DC WVInsulation Resistance (DC WV)(I.R.)Greater than 10G ohms or 500ohms-F whichever is smaller16V,10V,6.3V:10G ohms or 100ohms-Fwhichever is smallerElectrical SpecificationPart Number ConfigurationDOC. NO. 22CB-000111PART NO. 2203-000013DOC. NO. 22CB-000111PART NO. 2203-000013/3a3a.htmlCeramic Capacitors CAPACITANCE TEMPERATURE CHARACTERISTICS Class IMULTILAYER CERAMIC CHIP CAPACITORSC TYPE [16,25,50Vdc],CLASS I AND CLASS IIClass IICAPACITANCE AND TOLERANCE3-1DOC. NO. 22CB-000111PART NO. 2203-000013Ceramic CapacitorsCAPACITANCE RANGEClass I 25Vdc Class II 16Vdc50Vdc25Vdc50Vdc 3-2Ceramic CapacitorsC TYPE[BASEMETAL ELECTRODE,16,25,50Vdc],CLASS IICAPACITANCE RANGE16Vdc50VdcHC TYPE[LARGECAPACITANCE,16,25,50,75Vdc],CLASS II HIGH DIELECTRIC CONSTANTCAPACITANCE RANGE(Operating temperature range:-25to+85o C[-13 to +185o F])l6Vdc50Vdcc25Vdc 75Vdc3-3Ceramic CapacitorsC TYPE [HIGH VOLTAGE]CLASS I [3kVd c] AND CLASS II [500Vdc,1k,2kVdc]Class I CAPACITANCE TEMPERATURE CHARACTERISTICS CAPACITANCE RANGE Class I 3kVdcClass II500Vdc2kVdclkVdc3-4Ceramic Capacitors FC AND FR TYPE [LOW LOSS FOR VHF/UHF]CLASS I [50,100,200,300,500Vdc]AND CLASS II [50Vdc]Multilayer Ceramic Capacitors for high frequency and low loss are designed for 100to 1000MHz power circuit applications.FC type FR typeCAPACITANCE RANGE (Operating temperature range:-55to +l25o C [-67to +257o F])Class I Class II 50,100,200,300,500Vdc 50VdcCAPACITANCE AND TOLERANCE3-5DOC. NO. 22CB-000111PART NO. 2203-000013。

电解电容105c

电解电容105c（最新版）目录1.电解电容的概述2.105c 的含义3.电解电容的种类和特点4.105c 电容的应用领域5.我国电解电容行业的发展现状和前景正文一、电解电容的概述电解电容，又称为电解电容器，是一种常见的电子元器件，具有储存电能的功能。

它主要由阳极、阴极和电解质构成，广泛应用于滤波、耦合、退耦等电路。

电解电容的种类繁多，根据不同的分类标准，可以分为不同的类型。

二、105c 的含义在电解电容的型号中，数字和字母的组合代表了电容的各项性能参数。

其中，数字 105 代表电容的容量值为 105 微法拉（pF），而字母 c 则表示电容的工作温度范围。

一般来说，字母 c 代表的是 -55℃至 +125℃的工作温度范围。

因此，105c 电容指的是容量为 105pF，工作温度范围为 -55℃至 +125℃的电解电容。

三、电解电容的种类和特点根据电解电容的电解质材料不同，电解电容可分为以下几种类型：1.铝电解电容：以铝为阳极材料的电解电容，具有容量大、漏电流小、稳定性好等特点，广泛应用于滤波和耦合电路。

2.钽电解电容：以钽为阳极材料的电解电容，具有体积小、容量大、漏电流低等特点，常用于高密度电子设备中。

3.铌电解电容：以铌为阳极材料的电解电容，具有更高的容量和更低的漏电流，适用于高性能电子设备。

4.聚合物电解电容：以聚合物为电解质的电解电容，具有体积小、容量大、稳定性好等特点，常用于微型电子设备中。

四、105c 电容的应用领域105c 电容容量较小，适用于对滤波性能要求较高的电路。

其广泛应用于通信、计算机、家电等领域，如：1.通信设备：滤波器、信号放大器、振荡器等电路中，对信号的传输质量和稳定性有较高要求。

2.计算机：内存条、显卡、主板等部件的电路中，对电源噪声的抑制和信号的耦合有较高要求。

3.家电：电视机、收音机、音响等设备的电路中，对信号的处理和放大有较高要求。

五、我国电解电容行业的发展现状和前景近年来，随着我国电子信息产业的快速发展，电解电容行业也取得了长足的进步。