DTC143ZCA-TP;中文规格书,Datasheet资料

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DTC143TM3T5G资料

∞ቤተ መጻሕፍቲ ባይዱ
DTC123EM3T5G DTC143EM3T5G
8H 8J
2.2
2.2
SOT−723
4.7
4.7
(Pb−Free)
8000/Tape & Reel
DTC143ZM3T5G*
8K
4.7
47
DTC124XM3T5G*
8L
22
47
DTC123JM3T5G
8M
2.2
47
DTC115EM3T5G
8N
100
Device DTC114EM3T5G
Marking 8A
R1 (K) 10
R2 (K) 10
Package
Shipping†
DTC124EM3T5G
8B
22
22
DTC144EM3T5G
8C
47
47
DTC114YM3T5G
8D
10
47
DTC114TM3T5G
8E
10
∞
DTC143TM3T5G
8F
4.7
DTC114TM3T5G
160
350
−
DTC143TM3T5G
160
350
−
DTC123EM3T5G
8.0
15
−
DTC143EM3T5G
15
30
−
DTC143ZM3T5G
80
200
−
DTC124XM3T5G
80
150
−
DTC123JM3T5G
80
140
−
DTC115EM3T5G
80
150

DTC143TS3中文资料

N*2 N*2 N*2 N*2 P*2 P*2 P*2 P*2 N+P 50 60 75 40 -40 -60 -40 -60 75 -60 60 -40 40 40 40 40 -32 -50 -40 -60 40 -60 40 -40 150 200 600 600 500 150 200 600 600 600 200 200 200 200 200 200 200 200 200 200 200 200 200 200 120 100 100 82 100 120 100 100 100 100 100 100 820 300 300 560 300 820 300 300 300 300 300 300 1 10 150 100 -150 -1 -10 -150 150 -150 10 -10 6 1 10 3 -10 -6 -1 -10 10 -10 1 -1 0.4 0.2 0.5 0.4 -0.4 -0.5 -0.25 -0.4 0.3 -0.4 0.2 -0.25 1 10 150 100 -150 -1 -10 -150 150 -150 10 -10 5 1 10 10 -15 -5 -1 -15 15 -15 1 -1 180 300 300 300 200 140 250 200 300 200 300 250
BCE BCE BCE BCE BCE BCE BCE BCE DAUL DAUL DAUL DAUL DAUL DAUL DAUL DAUL
N+P
SOT-363 (P.29)
MMDT2412 MMDT3904 MMDT2222 MMDT2411 MMDT1036 MMDT1037 MMDT3906 MMDT2907 MMDT2227 MMDT3946
---------------------------------------------------------

FOSAN富信电子三极管 DTC143Z-产品规格书

安徽富信半导体科技有限公司ANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.DTC143Z SOT-23Digital Transistor数字晶体管▉Features特点NPN With Bias Resistor Network带偏置电阻▉Absolute Maximum Ratings最大额定值Characteristic特性参数Symbol符号Rat额定值Unit单位Supply Voltage电源电压V CC50V Input Voltage输入电压V IN-5~+30V Output Current输出电流I O100mA Power dissipation耗散功率P C(T a=25℃)200mW Thermal Resistance Junction-Ambient热阻RΘJA625℃/WJunction and Storage TemperatureT J,T stg-55to+150℃结温和储藏温度■Device Marking产品打标DTC143Z=E23ANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.DTC143Z■ElectricalCharacteristics 电特性(T A =25℃unless otherwise noted 如无特殊说明，温度为25℃)Characteristic 特性参数Symbol 符号Min 最小值Type 典型值Max 最大值Unit 单位Input Voltage 输入电压(V CC =5V ，I O =100µA)V I(off)0.5——VInput Voltage 输入电压(V O =0.3V ，I O =5mA)V I(on)—— 1.3V Output Voltage 输入电压(I O /I I =5mA/0.25mA)V O(on)—0.10.3VInput Current 输入电流(V I =5V)I I —— 1.8mAOutput Current 输出电流(V CC =5V ，V I =0)I O(off)——0.5µADC Current Gain 直流电流增益(V O =5V ，I O =10mA)G I 80——Input Resistor 输入电阻R13.34.7 6.1KΩResistor Ratio 电阻比率R2/R181012Transition frequency 特征频率(V O =10V ，I O =5mA)f T—250—MHzANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.DTC143Z ■Typical Characteristic Curve典型特性曲线ANHUI FOSAN SEMICONDUCTOR TECHNOLOGY CO.,LTD.DTC143Z■Dimension外形封装尺寸Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.900 1.1500.0350.045A10.0000.1000.0000.004A20.900 1.0500.0350.041b 0.3000.5000.0120.020c 0.0800.1500.0030.006D 2.800 3.0000.1100.118E 1.200 1.4000.0500.055E1 2.2502.5500.0890.100e 0.950TYP0.037TYPe1 1.8002.0000.0710.079L 0.550REF0.022REFL10.3000.5000.0120.020θ0o8o 0o8o。

DTC143ECA中文资料

DTC143ESA
TO-92S

l Any changing of specification will not be informed individua
01-Jun-2002 Rev. A
Page 1 of 2
DTC143EE/DTC143EUA/DTC143EKA DTC143ECA/TC143ESA
Elektronische Bauelemente
NPN Digital Transistors (Built-in Resistors)
Absolute maximum ratings(Ta=25℃)
Parameter Supply voltage Input voltage Output current Power dissipation Junction temperature Storage temperature
Typ Max. 0.5 Unit V V mA µA Conditions VCC=5V ,IO=100µA VO=0.3V ,IO=20 mA IO/II=10mA/0.5mA VI=5V VCC=50V ,VI=0 VO=5V ,IO=10mA 4.7 1 250 6.11 1.2 MHz KΩ
PIN CONNENCTIONS AND MARKING
DTC143EE DTC143EUA
SOT-523
Abbreviated symbol: 23
SOT-323
Abbreviated symbol: 23
DTC143EKA
DTA114ECA DTC143ECA
SOT-23-3L Abbreviated symbol: 23 SOT-23 Abbreviated symbol: 23

DDTC124XUA-7-F;DDTC143XUA-7-F;DDTC114WUA-7-F;DDTC114YUA-7-F;DDTC143FUA-7-F;中文规格书,Datasheet资料

DDTC (R1≠R2 SERIES) UANPN PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTORFeatures• Ordering Information: See Page 4 • Weight: 0.006 grams (approximate)P/N R1 (NOM) R2 (NOM) Type CodeDDTC113ZUA DDTC123YUA DDTC123JUA DDTC143XUA DDTC143FUA DDTC143ZUA DDTC114YUA DDTC114WUA DDTC124XUA DDTC144VUA DDTC144WUA 1K Ω2.2K Ω2.2K Ω 4.7K Ω4.7K Ω 4.7K Ω 10K Ω10K Ω22K Ω47K Ω47K Ω10K Ω 10K Ω 47K Ω 10K Ω 22K Ω 47K Ω 47K Ω 4.7K Ω 47K Ω 10K Ω 22K Ω N02 N05 N06 N09 N10 N11 N14 N15 N18 N21 N22SOT-323Dim Min Max A 0.25 0.40 B 1.15 1.35 C 2.00 2.20 D0.65 NominalE 0.30 0.40 G1.20 1.40 H 1.802.20 J 0.0 0.10 K 0.90 1.00 L 0.25 0.40 M0.100.18α0° 8° All Dimensions in mmMaximum Ratings @T A = 25°C unless otherwise specifiedCharacteristicSymbol Value Unit Supply Voltage, (3) to (2)V CC50 VInput Voltage, (1) to (2) DDTC113ZUA DDTC123YUA DDTC123JUA DDTC143XUA DDTC143FUA DDTC143ZUA DDTC114YUA DDTC114WUA DDTC124XUA DDTC144VUA DDTC144WUA V IN -5 to +10 -5 to +12 -5 to +12 -7 to +20 -6 to +30 -5 to +30 -6 to +40 -10 to +30 -10 to +40 -15 to +40 -10 to +40 VOutput Current DDTC113ZUA DDTC123YUA DDTC123JUA DDTC143XUA DDTC143FUA DDTC143ZUA DDTC114YUA DDTC114WUA DDTC124XUA DDTC144VUA DDTC144WUA I O 100 100 100 100 100 100 70 100 50 30 30 mAOutput Current AllI C (Max) 100mANotes: 1. No purposefully added lead. 2. Diodes Inc.'s "Green" policy can be found on our website at /products/lead_free/index.php. 3. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.R1OUT B CE R2321IN GND(0)132GND (0)C BIN OUTESchematic and Pin Configuration Equivalent Inverter CircuitMaximum Ratings (continued)@T A = 25°C unless otherwise specifiedCharacteristic Symbol Value Unit Output Current All I C (Max) 100 mA Power Dissipation P d200 mW Thermal Resistance, Junction to Ambient Air (Note 4) RθJA625 °C/W Operating and Storage Temperature Range T j, T STG-55 to +150 °CNotes: 4. Mounted on FR4 PC Board with recommended pad layout at /datasheets/ap02001.pdf.Electrical Characteristics@T A = 25°C unless otherwise specifiedCharacteristic Symbol Min Typ Max Unit Test ConditionInput Voltage DDTC113ZUADDTC123YUADDTC123JUADDTC143XUADDTC143FUADDTC143ZUADDTC114YUADDTC114WUADDTC124XUADDTC144VUADDTC144WUAV l(off)0.30.30.50.30.30.50.30.80.41.00.8⎯⎯V CC = 5V, I O = 100μAInput Voltage DDTC113ZUADDTC123YUADDTC123JUADDTC143XUADDTC143FUADDTC143ZUADDTC114YUADDTC114WUADDTC124XUADDTC144VUADDTC144WUAV l(on)⎯⎯3.03.01.12.51.31.31.43.02.55.04.0V V O = 0.3V, I O = 20mAV O = 0.3V, I O = 20mAV O = 0.3V, I O = 5mAV O = 0.3V, I O = 20mAV O = 0.3V, I O = 3mAV O = 0.3V, I O = 5mAV O = 0.3V, I O = 1mAV O = 0.3V, I O = 2mAV O = 0.3V, I O = 2mAV O = 0.3V, I O = 2mAV O = 0.3V, I O = 2mAOutput Voltage V O(on)⎯0.1 0.3 V I O/I l = 5mA/0.25mA DDTC123JUA I O/I l = 5mA/0.25mA DDTC143ZUA I O/I l = 5mA/0.25mA DDTC114YUA I O/I l = 10mA/0.5mA All OthersInput Current DDTC113ZUADDTC123YUADDTC123JUADDTC143XUADDTC143FUADDTC143ZUADDTC114YUADDTC114WUADDTC124XUADDTC144VUADDTC144WUAI l⎯⎯7.23.83.61.81.81.80.880.880.360.160.16mA V I = 5VOutput Current I O(off)⎯⎯0.5 μA V CC = 50V, V I = 0VDC Current Gain DDTC113ZUADDTC123YUADDTC123JUADDTC143XUADDTC143FUADDTC143ZUADDTC114YUADDTC114WUADDTC124XUADDTC144VUADDTC144WUAG l3333803068806824683356⎯⎯⎯V O = 5V, I O = 5mAV O = 5V, I O = 10mAV O = 5V, I O = 10mAV O = 5V, I O = 10mAV O = 5V, I O = 10mAV O = 5V, I O = 10mAV O = 5V, I O = 5mAV O = 5V, I O = 10mAV O = 5V, I O = 5mAV O = 5V, I O = 5mAV O = 5V, I O = 5mAInput Resistor Tolerance ΔR1-30 ⎯+30 % ⎯Resistance Ratio Tolerance ΔR2/R1-20 ⎯+20 % ⎯Gain-Bandwidth Product* f T⎯250 ⎯MHz V CE = 10V, I E = 5mA,f = 100MHz* Transistor - For Reference OnlyTypical Curves – DDTC123JUA-5005010025020015050100T , AMBIENT TEMPERATURE (C)Fig. 1 Derating CurveA °150P , P O W E R D I S S I P A T I O N (m W )D 0.0010.010.111020304050V , C O L L E C T O R E M I T T E R V O L T A G E (V )C E (S A T )I , COLLECTOR CURRENT (mA)Fig. 2 V vs. IC CE(SAT) C101,000100110h , D 100C C U R R E N T G A I NF E I , COLLECTOR CURRENT (mA)Fig. 3 DC Current GainC012342030C , C A P A C IT A N C E (p F )O B V , REVERSE BIAS VOLTAGE (V)Fig. 4 Output CapacitanceR 10515250.0010.01110100012348910I , C O L L E C T O R C U R R E N T (m A )C V , INPUT VOLTAGE (V)Fig. 5 Collector Current vs. Input Voltagein 5670.10.111010203040I , COLLECTOR CURRENT (mA)Fig. 6 Input Voltage vs. Collector CurrentC 50V , I N P U T V O L T A G E (V )i nOrdering Information (Note 3 & 5)Device Packaging Shipping DDTC113ZUA-7-F SOT-323 3000/Tape & ReelDDTC123YUA-7-F SOT-323 3000/Tape & ReelDDTC123JUA-7-F SOT-323 3000/Tape & ReelDDTC143XUA-7-F SOT-323 3000/Tape & ReelDDTC143FUA-7-F SOT-323 3000/Tape & ReelDDTC143ZUA-7-F SOT-323 3000/Tape & ReelDDTC114YUA-7-F SOT-323 3000/Tape & ReelDDTC114WUA-7-F SOT-323 3000/Tape & ReelDDTC124XUA-7-F SOT-323 3000/Tape & ReelDDTC144VUA-7-F SOT-323 3000/Tape & ReelDDTC144WUA-7-F SOT-323 3000/Tape & Reel Notes: 5. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationDate Code Key NXXYMNXX = Product Type Marking CodeSee Page 1 DiagramsYM = Date Code MarkingY = Year ex: T = 2006M = Month ex: 9 = SeptemberYear20022003200420052006200720082009201020112012 Code N P R S T U V W X Y ZMonth Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N DIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.分销商库存信息:DIODESDDTC124XUA-7-F DDTC143XUA-7-F DDTC114WUA-7-F DDTC114YUA-7-F DDTC143FUA-7-F DDTC143ZUA-7-F DDTC144VUA-7-F DDTC144WUA-7-F DDTC144WUA-7 DDTC144VUA-7DDTC143ZUA-7DDTC123JUA-7 DDTC123JUA-7-F DDTC114WUA-7DDTC113ZUA-7 DDTC113ZUA-7-F DDTC114YUA-7DDTC124XUA-7 DDTC123YUA-7-F DDTC143FUA-7DDTC123YUA-7 DDTC143XUA-7。

DTC143ZUBTL;中文规格书,Datasheet资料

DTC143ZE SOT-416 (SC-75A)
UMT3 OUT IN GND SMT3
DTC143ZUB (SC-85)
OUT IN GND
DTC143ZUA SOT-323 (SC-70)
DTC143ZKA SOT-346 (SC-59)
lInner circuit
lPackaging specifications Part No. DTC143ZM DTC143ZEB DTC143ZE DTC143ZUB DTC143ZUA DTC143ZKA Package VMT3 EMT3F EMT3 UMT3F UMT3 SMT3 Package size (mm) 1212 1616 1616 2021 2021 2928 Taping code T2L TL TL TL T106 T146 Basic Reel size Tape width ordering (mm) (mm) unit (pcs) 180 180 180 180 180 180 8 8 8 8 8 8 8,000 3,000 3,000 3,000 3,000 3,000 Marking E23 E23 E23 123 123 E23
Data Sheet
EMT3F
D
A
x
S A
b e
HE
E
c
e
A2
A
A1
S
l1
b2
Patterm of terminal position areas
MILIMETERS MIN MAX 0.65 0.85 0.00 0.10 0.60 0.80 0.21 0.36 0.08 0.18 1.50 1.70 0.76 0.96 0.50 1.50 1.70 0.37 0.35 0.55 0.10 MILIMETERS MIN MAX 1.05 0.46 0.65 INCHES MIN 0 0.024 0.008 0.003 0.059 0.03 0.02 0.059 0.015 0.014 INCHES MIN MAX 0.041 0.018 0.026 0.022 0.004 0.067 MAX 0.004 0.031 0.014 0.007 0.067 0.038

DDTA143ECA中文资料

2005 S
Jan
Feb March Apr
May Jun
1
2
3
4
5
6
2006 T
2007 U
Jul Aug Sep
7
8
9
2008 V
2009 W
Oct
Nov Dec
O
N
D
DS30333 Rev. 2 - 2
2 of 3
DDTA (R1 = R2 SERIES) CA
NEW PRODUCT
Pd, POWER DISSIPATION (MILLIWATTS)
Output Current
All
Power Dissipation
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage and Temperature Range
Symbol VCC
VIN
IO
IC (Max) Pd RqJA
J 0.013
K 0.903 1.10
L
0.45 0.61
M
0.85 0.80
a
0°
8°
All Dimensions in mm
SCHEMATIC DIAGRAM
Maximum Ratings @ TA = 25°C unless otherwise specified
Characteristic
hFE, DC CURRENT GAIN (NORMALIZED)
TYPICAL CURVES - DDTA143ECA
250
200
150
100

PDTC143T中文资料

PDTC143T series
VALUE 250 500 500 625 500 500 833
UNIT K/W K/W K/W K/W K/W K/W K/W
MIN. − − − − 200 − 3.3 −
TYP. − − − − − − 4.7 −
MAX. 100 1 50 100 − 100 6.1 2.5
2004 Aug 06
2
Philips Semiconductors
Product speciﬁcation
NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = open
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PDTC143TE PDTC143TEF PDTC143TK PDTC143TM PDTC143TS PDTC143TT PDTC143TU − − − − − − − DESCRIPTION plastic surface mounted package; 3 leads plastic surface mounted package; 3 leads plastic surface mounted package; 3 leads
2004 Aug 06
4
Philips Semiconductors
Product speciﬁcation
NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = open
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) SOT54 SOT23 SOT346 SOT323 SOT490 SOT883 SOT416 Notes 1. Refer to standard mounting conditions. 2. Reflow soldering is the only recommended soldering method. 3. Refer to SOT883 standard mounting conditions; FR4 with 60 µm copper strip line. CHARACTERISTICS Tamb = 25 °C unless otherwise speciﬁed. SYMBOL ICBO ICEO IEBO hFE VCEsat R1 Cc PARAMETER collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain collector-emitter saturation voltage input resistor collector capacitance IE = ie = 0 A; VCB = 10 V; f = 1 MHz CONDITIONS VCB = 50 V; IE = 0 A VCE = 30 V; IB = 0 A VCE = 30 V; IB = 0 A; Tj = 150 °C VEB = 5 V; IC = 0 A VCE = 5 V; IC = 1 mA IC = 5 mA; IB = 0.25 mA PARAMETER thermal resistance from junction to ambient CONDITIONS in free air note 1 note 1 note 1 note 1 notes 1 and 2 notes 2 and 3 note 1

DTC143_datasheet

Datasheet© 2012 ROHM Co., Ltd. All rights reserved.NPN 100mA 50V Digital Transistors (Bias Resistor Built-in Transistors)l Features1) Built-In Biasing Resistors, R 1 = R 2 = 47k W .2) Built-in bias resistors enable the configuration ofan inverter circuit without connecting external input resistors (see inner circuit).3) The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the input. They also have the advantage of completely eliminating parasitic effects.4) Only the on/off conditions need to be set for operation, making the circuit design easy.5) Complementary PNP Types :DTA144E series 6) Complex transistors :EMH2 /UMH2N /IMH2A l Inner circuit/EMH6 /UMH6N /IMH6A （NPN type ）7) Lead Free/RoHS Compliant.l ApplicationSwitching circuit, Inverter circuit, Interface circuit, Driver circuitOUTGNDOUTINGNDDTC144EUB DTC144EE DTC144EKA SOT-346 (SC-59)DTC144EUADTC144EEB OUTINGNDOUTIN GNDOUTINGNDOUTINGND*2 Each terminal mounted on a reference footprintFig.1 Input voltage vs. output current I N P U T V O L T A G E : V I (o n ) [V ]OUTPUT CURRENT : I O [A] Fig.2 Output current vs. input voltage (OFF characteristics)O U T P U T C U R R E N T : I O [A ]INPUT VOLTAGE : V I(off)[V]Fig.3 Output current vs. output voltageO U T P U T C U R R E N T : I O [m A ]OUTPUT VOLTAGE : V O [V] Fig.4 DC current gain vs. output currentD C C U R RE N T G A I N : G IOUTPUT CURRENT : I O [A]0102030510I =Fig.5 Output voltage vs. output currentO U T P U T V O L T A G E : V O (o n ) [V ]OUTPUT CURRENT : I O [A]VMT3Patterm of terminal position areasDimension in mm/inchesPatterm of terminal position areasDimension in mm/inchesEMT3Patterm of terminal position areasDimension in mm/inchesUMT3FPatterm of terminal position areasUMT3 ArrayPatterm of terminal position areasDimension in mm/inchesDimension in mm/inchesSMT3Patterm of terminal position areasR1120A © 2012 ROHM Co., Ltd. All rights reserved.Notice ROHM Customer Support System/contact/Thank you for your accessing to ROHM product informations.More detail product informations and catalogs are available, please contact us.N o t e sNo copying or reprod uction of this d ocument, in part or in whole, is permitted without the consent of ROHM Co.,Ltd.The content specified herein is subject to change for improvement without notice.The content specified herein is for the purpose of introd ucing ROHM's prod ucts (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request.Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any d amage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Prod ucts. ROHM d oes not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu-nication devices, electronic appliances and amusement devices).The Products specified in this document are not designed to be radiation tolerant.While ROHM always makes efforts to enhance the quality and reliability of its Prod ucts, a Product may fail or malfunction for a variety of reasons.Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Prod ucts for the above special purposes. If a Prod uct is intend ed to be used for any such special purpose, please contact a ROHM sales representative before purchasing.If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.。

ZCAT磁环规格书

Clamp Filters For CableZCAT SeriesFEATURES•Unique plastic case ensures simple, convenient installation and includes a self-holding mechanism to prevent slippage on cables.•Ferrite core provides excellent absorption of high-frequency EMC.•Highly effective as countermeasure against common mode EMC without adverse effect on signal quality.•Large core size prevents saturation during large signal surges.APPLICATIONSPersonal computers, word processors, monitors, hard disk drives,digital telephones, audio devices, electronic musical instruments, video games, copiers and facsimiles.PRODUCT IDENTIFICATION (1) Series name(2) Outer dimensions(mm)(3) Length(mm)(4) Inner dimensions(mm)(5) Material code(6) Fixed type codeA: Cable fixedHold the cable to secure it with the main bodyAP:Cable fixed(with lock mechanism)B: Clamp fixedC: Cable coil securing type(Coil the cable one time within the case to fix it/with lock mechanism.)D: Flat cable typeDT: Flat cable type (Hold with adhesive pad.) Non code: Band fixed(Secure the cable and main body with the nylon belt.)(7) Outer color codeBK: BlackNon code: GrayZCAT-C TYPEConformity to RoHS DirectiveZCA T 2436–1330A –BK (1)(2)(3)(4)(5)(6)(7)PACKAGING STYLE AND QUANTITIESPart No.QuantityZCAT3035200 pieces/box ZCAT2017-B 350 pieces/box ZCAT2235400 pieces/box ZCAT2436400 pieces/box ZCAT2032420 pieces/box ZCAT2132480 pieces/box ZCAT2749400 pieces/box ZCAT1730840 pieces/box ZCAT2017640 pieces/box ZCAT13251344 pieces/box ZCAT3618-D 480 pieces/box ZCAT4625-D 240 pieces/box ZCAT6819-D160 pieces/box•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.SHAPES AND DIMENSIONS ZCAT TYPEZCAT -A, ZCAT -AP TYPEZCAT-B TYPEZCAT-C TYPEZCAT -D TYPEDimensions in mm∗1 These products are delivered with fixed band.∗2 ZCA T -DT type: Adapted for flat cables and hold with adhesive pad.• ZCA T -B type: Clamp fixed type installation hole diameter ø4.8 to 4.9mm, thickness of board 0.5 to 2mm.• ZCA T -AP , ZCAT -C type: Once closed, the case will not be easily opened manually.STRUCTURE OF THE MOUNTING BANDPart No.ABøCøDEApplicable cable outer dia.Weight(g)freq. characteristics Fig.∗1∗1ZCAT2032-0930(-BK)∗136±132±19±119.5±1–9max.223∗1∗1ZCAT1325-0530A(-BK)25±120±15±112.8±111.2±1 3 to 5(USB)74ZCAT2035-0930A(-BK)35±128±19±119.5±117.4±1 6 to 9223ZCAT2235-1030A(-BK)35±128±110±121.5±120±18 to 10277∗2ZCAT4625-3430D(-BK)45.5±124.5±134±112±1–For 26 wires flat cable 3211ZCAT4625-3430DT(-BK)∗245.5±124.5±134±113±1–For 26 wires flat cable 3211ZCAT6819-5230DT(-BK)∗267.5±118.5±152±117±1–For 40 wires flat cable 5811ELECTRICAL CHARACTERISTICS•Test conditions: R-X meter at unloaded condition, ø1mm solder plated copper wire passes through.TYPICAL EMC SUPPRESSION EFFECTSRADIATION LEVEL vs. FREQUENCY CHARACTERISTICSTYPICAL ELECTRICAL CHARACTERISTICSIMPEDANCE vs. FREQUENCY CHARACTERISTICS Part No.Impedance (Ω)min.[50 to 500MHz]ZCAT1518-073035ZCAT2017-093035ZCAT2032-093080ZCAT3035-1330100ZCAT1525-0430AP 50ZCAT1325-0530A 50ZCAT1730-0730A 50ZCAT2035-0930A 80ZCAT2017-0930B 35ZCAT2749-0430C 80ZCAT3618-2603D(T)30ZCAT4625-3430D(T)35ZCAT6819-5230D(T)35Fig.2Fig.1Fig.3Fig.4ZCAT2017-0930ZCAT1518-0730ZCAT2032-0930ZCAT2035-0930AZCAT1525-0430AP ZCAT2132-1130ZCAT1325-0530AFig.5ZCAT3035-1330Fig.6ZCAT1730-0730AFig.7ZCAT2235-1030AFig.8ZCAT2436-1330ATYPICAL ELECTRICAL CHARACTERISTICSIMPEDANCE vs. FREQUENCY CHARACTERISTICSFig.10Fig.11ZCAT4625-3430D ZCAT6819-5230DZCAT3618-2630DFig.9ZCAT2749-0430C。

DTC143Z-T92-K中文资料

UNISONIC TECHNOLOGIES CO., LTDDTC143Z NPN SILICON TRANSISTORNPN DIGITAL TRANSISTOR (BUILT-IN RESISTORS)FEATURES* Built-in bias resistors that implies easy ON/OFF applications. * The bias resistors are thin-film resistors with complete isolation to allow negative input.EQUIVALENT CIRCUITOUTOUT ININ*Pb-free plating product number: DTC143ZLORDERING INFORMATIONOrder NumberPin AssignmentNormal Lead Free Plating Package 1 2 3 PackingDTC143Z-AE3-R DTC143ZL-AE3-R SOT-23 G I O TapeReel DTC143Z-AL3-R DTC143ZL-AL3-R SOT-323 G IO Tape Reel DTC143Z-AN3-R DTC143ZL-AN3-R SOT-523 G I O Tape Reel DTC143Z-T92-B DTC143ZL-T92-B TO-92 G O I Tape Box DTC143Z-T92-K DTC143ZL-T92-K TO-92 G O I Bulk DTC143Z-T92-R DTC143ZL-T92-R TO-92 G O I Tape Reel DTC143Z-T9S-K DTC143ZL-T9S-K TO-92SP G O I BulkMARKINGFor SOT-23/SOT-323 Package For SOT-523 PackageABSOLUTE MAXIMUM RATINGS (Ta = 25 )PARAMETER SYMBOL RATINGS UNITSupply Voltage V CC 50 V Input Voltage V IN -5 ~ +30 VI OUT 100Output Current I C (MAX) 100mASOT-523 150 mWSOT-23/SOT-323200 mWPower Dissipation TO-92/TO-92SP P D 300 mWJunction Temperature T J +150 Storage Temperature T STG -55 ~ +150Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.Absolute maximum ratings are stress ratings only and functional device operation is not implied.ELECTRICAL CHARACTERISTICS (Ta = 25 )PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITV IN (OFF) V CC =5V, I OUT =100µA 0.5 Input Voltage V IN (ON) V OUT =0.3V, I OUT =5mA 1.3VOutput Voltage V OUT (ON) I OUT /I IN =5mA/0.25mA 0.1 0.3 V Input Current I IN V IN =5V 1.8 mA Output Current I O (OFF) V CC =50V, V IN =0V 0.5 µA DC Current Gain h FE V OUT =5V, I OUT =10mA 80 Input Resistance R 1 3.29 4.7 6.11 K Ω Resistance Ratio R 2/R 1 8 10 12 Transition Frequency f T V CE =10V, I E =-5mA, f=100MHz * 250 MHz * Transition frequency of the deviceTYPICAL CHARACTERISTICS100101Output Current, I OUT (mA)I n p u t V o l t a g e , V I N (O N ) (V )200m 220 Input Voltage vs. Output Current(ON Characteristics)Output Current vs. Input Voltage(OFF Characteristics)505500m 100m0Input Voltage , V IN(OFF) (V)Ou t p u t C u r r e n t , I O U T (µA )0.51.0 1.52.0 2.53.00.10.20.512510205010012510205010020050010002000500010000DC Current Gain vs. Output Current Output Voltage vs. Output Current1K 10010Output Current, I OUT (mA)D C C u r r e n t G a i n , h F E2202005051100010010O u t p ut V o l t a g e , V O U T (O N ) (m V )2202005005051Output Current, I OUT (mA)。

SDTC114YET1G;中文规格书,Datasheet资料

Min
Typ
OFF CHARACTERISTICS
Collector−Base Cutoff Current (VCB = 50 V, IE = 0)
ICBO
−
−
Collector−Emitter Cutoff Current (VCE = 50 V, IB = 0)
ICEO
−
−
Emitter−Base Cutoff Current
(IC = 2.0 mA, IB = 0)
ON CHARACTERISTICS (Note 3)
V(BR)CBO
50
−
V(BR)CEO
50
−
DC Current Gain
© Semiconductor Components Industries, LLC, 2012
1
May, 2012 − Rev. 12
/

NPN SILICON BIAS RESISTOR TRANSISTORS
PIN 1
R1
BASE
See detailed ordering, marking, and shipping information in the package dimensions section on page 2 of this data sheet.
Publication Order Number: DTC114EET1/D
DTC123JET1 DTC123JET1G
8M
2.2
47
SC−75/SOT−416
SC−75/SOT−416 (Pb−Free)
3000 Tape & Reel 3000 Tape & Reel

XP143 Specification-Chinese

φ0 .7 φ1 .0 φ1 .3 φ1 .8 φ2 .5 φ3 .7
φ5 .0
对应于吸嘴尺寸φ0.37～φ2.5mm ３）吸嘴配置的限制
对应于吸嘴尺寸φ3.7～φ5.0mm
吸嘴 N o .4
吸嘴 N o .1 吸嘴 N o .10
吸嘴 N o .7
对于中型对应吸嘴φ3.7，φ5.0，安装位置有限制。（安装位置:吸嘴No.1,4,7,10）
５．选项
5.1 选项 ____________________________________________ 13
６．机器外观
6.1 外观图 __________________________________________ 14 Spec1（前后MFU-X10E类型） ___________________________ 14
学习MSA影像处理后可以以强有力的图形匹配对所有的特殊元件方便地进行影像处理
查找线
＜创建模板例＞
MSA的影像处理程序不是直接参考物理像素，而是根据虚拟影像画面，可以在任意的位置、角度进行影像处理以达到高解析度以及高精度。
-2-
XP143-020505RS
1. 概要
1.2.3 高生产率
１）由于采用了独特的“ON-THE-VISION”系统和旋转工作头，实现了以周期时间0.165秒进行贴装。此外，不像原来的多吸嘴机型那样要以同时吸取作为前提条件，减少了因电路板的种类和元件种类的不同而产生的运转率的变动。可以保持高的生产量。
1.2.6 与需求相对应的规格选择
在供料平台上，可以选择可以脱卸的MFU-X10E类型或者固定类型。更进一步，可以选择Side1，Side2的双供料平台的规格，或者是仅仅Side1的单供料平台的规格。可以从以下6种类型中选择类型。

DDTA114ECA-7-F;DDTA143ECA-7-F;DDTA144ECA-7-F;DDTA124ECA-7-F;DDTA115ECA-7-F;中文规格书,Datasheet资料

PNP PRE-BIASED SMALL SIGNAL SOT23 SURFACE MOUNT TRANSISTORFeatures• Epitaxial Planar Die Construction• Complementary NPN Types Available (DDTC) • Built-In Biasing Resistors, R1 = R2• “Lead Free”, RoHS Compliant (Note 1)• Halogen and Antimony Free "Green" Device (Note 2) • Qualified to AEC-Q101 Standards for High ReliabilityMechanical Data• Case: SOT23 • Case material: Molded Plastic. “Green” Molding Compound. • Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Matte Tin Finish • Weight: 0.008 grams (approximate)Part Number R1, R2 (NOM)DDTA123ECA 2.2K Ω DDTA143ECA 4.7K Ω DDTA114ECA 10K Ω DDTA124ECA 22K Ω DDTA144ECA 47K Ω DDTA115ECA 100K ΩOrdering Information (Note 3 & 4)Product Grade Marking Reel size (inches) Tape width (mm)Quantity per reelDDTA123ECA-7-F Commercial P04 7 8 3,000 DDTA143ECA-7-F Commercial P08 7 8 3,000 DDTA114ECA-7-F Commercial P13 7 8 3,000 DDTA114ECAQ-7-F Automotive P13 7 8 3,000 DDTA114ECAQ-13-F Automotive P13 13 8 10,000 DDTA124ECA-7-F Commercial P17 7 8 3,000 DDTA144ECA-7-F Commercial P20 7 8 3,000 DDTA115ECA-7-F Commercial P24 783,000Notes: 1. No purposefully added lead.2. Diodes Inc's "Green" policy can be found on our website at .3. For packaging details, go to our website at .4. Products with Q-suffix are automotive grade. Automotive products are electrical and thermal the same as the commercial, except where specified.Marking InformationDate Code KeyYear 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017Code N P R S T U V W X Y Z A B C D EMonth Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov DecCode 1 2 3 4 5 6 7 8 9 O N DDevice Schematic Top View SOT23XXX = Product Type Marking Code, See Ordering Information YM = Date Code Marking Y = Year (ex: X = 2010) M = Month (ex: 9 = September) 132GND (0)C BIN OUTEEquivalent Inverter CircuitINGND(+)XXX Y MMaximum Ratings @T A = 25°C unless otherwise specifiedCharacteristic SymbolValue UnitSupply Voltage <Pin: (3) to (2)> V CC50 VInput Voltage <Pin: (1) to (2)> DDTA123ECADDTA143ECADDTA114ECADDTA124ECADDTA144ECADDTA115ECAV IN+10 to –12+10 to –30+10 to –40+10 to –40+10 to –40+10 to –40VOutput Current DDTA123ECADDTA143ECADDTA114ECADDTA124ECADDTA144ECADDTA115ECAI O-100-100-50-30-30-20mAOutput Current I C (Max) -100 mAThermal Characteristics @T A = 25°C unless otherwise specifiedCharacteristic SymbolValue UnitPower Dissipation (Note 5 & 6) P D200 mW Thermal Resistance, Junction to Ambient Air (Note 5) RθJA625 °C/W Operating and Storage Temperature Range T J, T STG-55 to +150 °CNotes: 5. Mounted on FR4 PC Board with minimum recommended pad layout6. 150mW per element must not be exceeded.Electrical Characteristics@T A = 25°C unless otherwise specifiedCharacteristic SymbolMinTypMaxUnitTestConditionInput Voltage V l(off)-0.5 -1.1 ⎯VV CC = -5V, I O = -100μAV l(on)⎯-1.9 -3V O = -0.3V, I O = -20mA, DDTA123ECAV O = -0.3V, I O = -20mA, DDTA143ECAV O = -0.3V, I O = -10mA, DDTA114ECAV O = -0.3V, I O = -5mA, DDTA124ECAV O = -0.3V, I O = -2mA, DDTA144ECAV O = -0.3V, I O = -1mA, DDTA115ECAOutput Voltage V O(on)⎯-0.1 -0.3 V I O/I l = -10mA/-0.5mA DDTA123ECA I O/I l = -10mA/-0.5mA DDTA143ECA I O/I l = -10mA/-0.5mA DDTA114ECA I O/I l = -10mA/-0.5mA DDTA124ECA I O/I l = -10mA/-0.5mA DDTA144ECA I O/I l = -5mA/-0.25mA DDTA115ECAInput Current DDTA123ECADDTA143ECADDTA114ECADDTA124ECADDTA144ECADDTA115ECAI l⎯⎯-3.8-1.8-0.88-0.36-0.18-0.15mA V I = -5VOutput Current I O(off)⎯⎯-0.5 μA V CC = -50V, V I = 0VDC Current Gain DDTA123ECADDTA143ECADDTA114ECADDTA124ECADDTA144ECADDTA115ECAG l202030566882⎯⎯⎯V O = -5V, I O = -20mAV O = -5V, I O = -10mAV O = -5V, I O = -5mAV O = -5V, I O = -5mAV O = -5V, I O = -5mAV O = -5V, I O = -5mAInput Resistor Tolerance ΔR1-30 ⎯+30 % ⎯Resistance Ratio Tolerance ΔR2/R10.8 1 1.2 % ⎯Gain-Bandwidth Product f T⎯250 ⎯MHz V CE = -10V, I E = -5mA,f = 100MHzTypical Characteristics – DDTA143ECA-5050100150250200150501000T , AMBIENT TEMPERATURE (C)Fig. 1 Derating CurveA °P , P O W E R D I S S I P A T I O N (m W )d 0.0010.010.111020304050V , C O L L E C T O R E M I T T E R V O L T A G E (V )C E (S A T )I , COLLECTOR CURRENT (mA)Fig. 2 V vs. IC CE(SAT) C101,0001001110100h , D C C U R R E N T G A I NF E I , COLLECTOR CURRENT (mA)Fig. 3 DC Current GainC0246102030C , C A P A C I T A N C E (p F )O B V , REVERSE BIAS VOLTAGE (V)Fig. 4 Output CapacitanceR 12105152580.010.111010012348910I , C O L L E C T O R C U R R E N T (m A )C V , INPUT VOLTAGE (V)Fig. 5 Collector Current vs. Input Voltage in 56701101020304050I , COLLECTOR CURRENT (mA)Fig. 6 Input Voltage vs. Collector CurrentC V , I N P U T V O L T A G E (V )i nPackage Outline DimensionsSuggested Pad LayoutSOT23Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.0130.10 0.05 K 0.903 1.10 1.00 K1 - - 0.400 L 0.45 0.61 0.55 M 0.0850.18 0.11α0° 8°- All Dimensions in mmDimensions Value (in mm)Z2.9 X 0.8 Y 0.9 C 2.0 E 1.35X EYCZIMPORTANT NOTICEDIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which:1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.Copyright © 2011, Diodes Incorporated分销商库存信息:DIODESDDTA114ECA-7-F DDTA143ECA-7-F DDTA144ECA-7-F DDTA124ECA-7-F DDTA115ECA-7-F DDTA123ECA-7-F DDTA124ECA-7DDTA144ECA-7DDTA115ECA-7 DDTA123ECA-7DDTA114ECA-7DDTA143ECA-7。

DTC143XCA中文资料

元器件交易网
DTC143XE/DTC143XUA/DTC143XKA DTC143XCA/TC143XSA
Elektronische Bauelemente
NPN Digital Transistors (Built-in Resistors)
FEATURES
* Built-in bias resistors enable the configuration of an inverter circuit without connecting input resistors (see equivalent circuit). * Only the on/off confitions need to be set for operation, making device design easy. * The bias resistors consis of thin-film resistors with compete isolation to allow negative biasing of the input. They also have the advantage of almost completely eliminating parasitic effects.
Symbol VCC VIN IO IC(MAX) Pd Tj Tstg
Symbol VI(off) VI(on) VO(on) II IO(off) GI R1 R2/R1 fT 30 3.29 1.7 2.5 Min.
Limits (DTC143X ) E UA CA 50 -7~+20 100 100 150 200 150 -55~150
0.1
0.3 1.8 0.5
Typical Characteristics

东芝-DTC143Z-D-数字三极管 (BRT) 的用户手册说明书

MUN2233, MMUN2233L,MUN5233, DTC143ZE,DTC143ZM3, NSBC143ZF3Digital Transistors (BRT)R1 = 4.7 k W , R2 = 47 k WNPN Transistors with Monolithic Bias Resistor NetworkThis series of digital transistors is designed to replace a single device and its external resistor bias network. The Bias Resistor Transistor (BRT) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base−emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space.Features•Simplifies Circuit Design •Reduces Board Space•Reduces Component Count•S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101Qualified and PPAP Capable•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS CompliantMAXIMUM RATINGS (T A = 25°C)RatingSymbol Max Unit Collector−Base Voltage V CBO 50Vdc Collector−Emitter Voltage V CEO 50Vdc Collector Current − Continuous I C 100mAdc Input Forward Voltage V IN(fwd)30VdcInput Reverse VoltageVIN(rev)5VdcStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not beassumed, damage may occur and reliability may be affected.PIN 3(OUTPUT)PIN 2EMITTER (GROUND)PIN 1BASE ORDERING INFORMATIONSC−75CASE 463STYLE 1MARKING DIAGRAMSXXX = Specific Device Code M =Date Code*G =Pb−Free Package(Note: Microdot may be in either location)*Date Code orientation may vary depending up-on manufacturing location.SC−59CASE 318DSTYLE 1SOT−23CASE 318STYLE 6SC−70/SOT−323CASE 419STYLE 3SOT−723CASE 631AA STYLE 1SOT−1123CASE 524AA STYLE 1XX M G G 11XXX M GG XX M G G1XX M 1X M 1PIN CONNECTIONSTable 1. ORDERING INFORMATIONDevicePart MarkingPackage Shipping †MUN2233T1G, NSVMUN2233T1G*8K SC−59(Pb−Free)3000 / Tape & Reel MMUN2233LT1G, SMMUN2233LT1G*A8K SOT−23(Pb−Free)3000 / Tape & Reel NSVMMUN2233LT3G*A8K SOT−23(Pb−Free)10000 / Tape & Reel MUN5233T1G, SMUN5233T1G*8K SC−70/SOT−323(Pb−Free)3000 / Tape & Reel DTC143ZET1G, NSVDTC143ZET1G*8K SC−75(Pb−Free)3000 / Tape & Reel DTC143ZM3T5G, NSVDTC143ZM3T5G*8K SOT−723(Pb−Free)8000 / Tape & ReelNSBC143ZF3T5GRSOT−1123(Pb−Free)8000 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.*S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable.Figure 1. Derating CurveAMBIENT TEMPERATURE (°C)P D , P O W E R D I S S I P A T I O N (m W )(1) SC−75 and SC−70/SOT−323; Minimum Pad (2) SC−59; Minimum Pad (3) SOT−23; Minimum Pad(4) SOT−1123; 100 mm 2, 1 oz. copper trace (5) SOT−723; Minimum PadTHERMAL CHARACTERISTICS (SC−59) (MUN2233)Total Device DissipationT A = 25°C(Note 1)(Note 2) Derate above 25°C(Note 1)(Note 2)P D2303381.82.7mWmW/°CThermal Resistance,(Note 1) Junction to Ambient(Note 2)R q JA540370°C/WThermal Resistance,(Note 1) Junction to Lead(Note 2)R q JL264287°C/WJunction and Storage Temperature Range T J, T stg−55 to +150°C THERMAL CHARACTERISTICS (SOT−23) (MMUN2233L)Total Device DissipationT A = 25°C(Note 1)(Note 2) Derate above 25°C(Note 1)(Note 2)P D2464002.03.2mWmW/°CThermal Resistance,(Note 1) Junction to Ambient(Note 2)R q JA508311°C/WThermal Resistance,(Note 1) Junction to Lead(Note 2)R q JL174208°C/WJunction and Storage Temperature Range T J, T stg−55 to +150°C THERMAL CHARACTERISTICS (SC−70/SOT−323) (MUN5233)Total Device DissipationT A = 25°C(Note 1)(Note 2) Derate above 25°C(Note 1)(Note 2)P D2023101.62.5mWmW/°CThermal Resistance,(Note 1) Junction to Ambient(Note 2)R q JA618403°C/WThermal Resistance,(Note 1) Junction to Lead(Note 2)R q JL280332°C/WJunction and Storage Temperature Range T J, T stg−55 to +150°C THERMAL CHARACTERISTICS (SC−75) (DTC143ZE)Total Device DissipationT A = 25°C(Note 1)(Note 2) Derate above 25°C(Note 1)(Note 2)P D2003001.62.4mWmW/°CThermal Resistance,(Note 1) Junction to Ambient(Note 2)R q JA600400°C/WJunction and Storage Temperature Range T J, T stg−55 to +150°C THERMAL CHARACTERISTICS (SOT−723) (DTC143ZM3)Total Device DissipationT A = 25°C(Note 1)(Note 2) Derate above 25°C(Note 1)(Note 2)P D2606002.04.8mWmW/°CThermal Resistance,(Note 1) Junction to Ambient(Note 2)R q JA480205°C/WJunction and Storage Temperature Range T J, T stg−55 to +150°C1.FR−4 @ Minimum Pad.2.FR−*******.0InchPad.3.FR*4 @ 100 mm2, 1 oz. copper traces, still air.4.FR*4 @ 500 mm2, 1 oz. copper traces, still air.THERMAL CHARACTERISTICS (SOT−1123) (NSBC143ZF3)Total Device DissipationT A = 25°C(Note 3)(Note 4) Derate above 25°C(Note 3)(Note 4)P D2542972.02.4mWmW/°CThermal Resistance,(Note 3) Junction to Ambient(Note 4)R q JA493421°C/WThermal Resistance, Junction to Lead(Note 3)R q JL193°C/W Junction and Storage Temperature Range T J, T stg−55 to +150°C1.FR−4 @ Minimum Pad.2.FR−*******.0InchPad.3.FR*4 @ 100 mm2, 1 oz. copper traces, still air.4.FR*4 @ 500 mm2, 1 oz. copper traces, still air.Table 3. ELECTRICAL CHARACTERISTICS (T A = 25°C, unless otherwise noted)Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICSCollector−Base Cutoff Current (V CB = 50 V, I E = 0)I CBO−−100nAdcCollector−Emitter Cutoff Current (V CE = 50 V, I B = 0)I CEO−−500nAdcEmitter−Base Cutoff Current (V EB = 6.0 V, I C = 0)I EBO−−0.18mAdcCollector−Base Breakdown Voltage(I C = 10 m A, I E = 0)V(BR)CBO50−−VdcCollector−Emitter Breakdown Voltage (Note 5)(I C = 2.0 mA, I B = 0)V(BR)CEO50−−VdcON CHARACTERISTICSDC Current Gain (Note 5)(I C = 5.0 mA, V CE = 10 V)h FE80200−Collector *Emitter Saturation Voltage (Note 5)(I C = 10 mA, I B = 1.0 mA)V CE(sat)−−0.25VdcInput Voltage (off)(V CE = 5.0 V, I C = 100 m A)V i(off)−0.60.5VdcInput Voltage (on)(V CE = 0.3 V, I C = 5 mA)V i(on)1.30.9−VdcOutput Voltage (on)(V CC = 5.0 V, V B = 2.5 V, R L = 1.0 k W)V OL−−0.2VdcOutput Voltage (off)(V CC = 5.0 V, V B = 0.5 V, R L = 1.0 k W)V OH4.9−−VdcInput Resistor R1 3.3 4.7 6.1k W Resistor Ratio R1/R20.080.10.12Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.5.Pulsed Condition: Pulse Width = 300 msec, Duty Cycle v 2%.MUN2233, MMUN2233L, MUN5233, DTC143ZE, DTC143ZM3Figure 2. V CE(sat) versus I CFigure 3. DC Current GainFigure 4. Output Capacitance Figure 5. Output Current versus Input VoltageV in , INPUT VOLTAGE (V)V R , REVERSE BIAS VOLTAGE (V)Figure 6. Input Voltage versus Output CurrentI C , COLLECTOR CURRENT (mA)I C , COLLECTOR CURRENT (mA)IC , COLLECTOR CURRENT (mA)V C E (s a t ), C O L L E C T O R−E M I T T E R S A T U R A T I O N V O L T A G E (V )h F E , D C CU RR E N T G A I N5040302010C o b , C A P A C I T A N C E (p F )I C , C O L L E C T O R C U R R E N T (m A )V i n , I N P U T V O L T A G E (V )10.10.0110003.2014231001010.10.010.0011010.150403020100100102.82.421.61.20.80.40NSBC143ZF3Figure 7. V CE(sat) versus I CFigure 8. DC Current GainFigure 9. Output Capacitance Figure 10. Output Current versus Input VoltageV in , INPUT VOLTAGE (V)V R , REVERSE BIAS VOLTAGE (V)Figure 11. Input Voltage versus Output CurrentI C , COLLECTOR CURRENT (mA)I C , COLLECTOR CURRENT (mA)I C , COLLECTOR CURRENT (mA)V C E (s a t ), C O L L E C T O R −E M I T T E R S A T U R A T I O N V O L T A G E (V )h F E , D C C U R R E N T G A I N5040302010C o b , C A P A C I T A N C E (p F )I C , C O L L E C T O R C U R R E N T (m A )V i n , I N P U T V O L T A G E (V )10.10.0110002.414231001010.10.010.0011005040302010010010121.61.20.80.401010.1SOT −23 (TO −236)CASE 318−08ISSUE ASDATE 30 JAN 2018SCALE 4:11XXXM G G XXX = Specific Device Code M = Date Code G = Pb −Free Package*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “ G ”,may or may not be present.GENERICMARKING DIAGRAM*NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.SOLDERING FOOTPRINTDIM A MIN NOM MAX MINMILLIMETERS0.89 1.00 1.110.035INCHES A10.010.060.100.000b 0.370.440.500.015c 0.080.140.200.003D 2.80 2.90 3.040.110E 1.20 1.30 1.400.047e 1.78 1.90 2.040.070L 0.300.430.550.0120.0390.0440.0020.0040.0170.0200.0060.0080.1140.1200.0510.0550.0750.0800.0170.022NOM MAX L1STYLE 22:PIN 1.RETURN2.OUTPUT3.INPUT STYLE 6:PIN 1.BASE2.EMITTER3.COLLECTOR STYLE 7:PIN 1.EMITTER2.BASE3.COLLECTORSTYLE 8:PIN 1.ANODE2.NO CONNECTION3.CATHODESTYLE 9:PIN 1.ANODE2.ANODE3.CATHODE STYLE 10:PIN 1.DRAIN2.SOURCE3.GATE STYLE 11:PIN 1.ANODE 2.CATHODE 3.CATHODE −ANODE STYLE 12:PIN 1.CATHODE2.CATHODE3.ANODE STYLE 13:PIN 1.SOURCE2.DRAIN3.GATESTYLE 14:PIN 1.CATHODE2.GATE3.ANODESTYLE 15:PIN 1.GATE2.CATHODE3.ANODE STYLE 16:PIN 1.ANODE2.CATHODE3.CATHODE STYLE 17:PIN 1.NO CONNECTION2.ANODE3.CATHODE STYLE 18:PIN 1.NO CONNECTION 2.CATHODE 3.ANODE STYLE 19:PIN 1.CATHODE 2.ANODE 3.CATHODE −ANODE STYLE 23:PIN 1.ANODE2.ANODE3.CATHODESTYLE 20:PIN 1.CATHODE2.ANODE3.GATE STYLE 21:PIN 1.GATE2.SOURCE3.DRAIN STYLE 1 THRU 5:CANCELLEDSTYLE 24:PIN 1.GATE2.DRAIN3.SOURCESTYLE 25:PIN 1.ANODE2.CATHODE3.GATESTYLE 26:PIN 1.CATHODE2.ANODE3.NO CONNECTIONSTYLE 27:PIN 1.CATHODE2.CATHODE3.CATHODE2.10 2.40 2.640.0830.0940.104H E 0.350.540.690.0140.0210.027c0−−−100−−−10T°°°°END VIEWDIMENSIONS: MILLIMETERS3X3XRECOMMENDED STYLE 28:PIN 1.ANODE2.ANODE3.ANODESC −59CASE 318D −04ISSUE HDATE 28 JUN 2012SCALE 2:1STYLE 3:PIN 1.ANODE2.ANODE3.CATHODESTYLE 1:PIN 1.BASE2.EMITTER3.COLLECTORSTYLE 2:PIN 1.ANODE2.N.C.3.CATHODESTYLE 4:PIN 1.CATHODE2.N.C.3.ANODE STYLE 5:PIN 1.CATHODE2.CATHODE3.ANODE STYLE 6:PIN 1.ANODE2.CATHODE3.ANODE/CATHODENOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.ǒmm inchesǓXXX M GG XXX = Specific Device Code M = Date CodeG= Pb −Free Package*GENERICMARKING DIAGRAM*This information is generic. Please refer todevice data sheet for actual part marking.Pb −Free indicator, “G” or microdot “ G ”,may or may not be present.1*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*DIM A MIN NOM MAX MINMILLIMETERS1.00 1.15 1.300.039INCHES A10.010.060.100.001b 0.350.430.500.014c 0.090.140.180.003D2.70 2.903.100.106E 1.30 1.50 1.700.051e 1.70 1.90 2.100.067L 0.200.400.600.0082.502.803.000.0990.0450.0510.0020.0040.0170.0200.0050.0070.1140.1220.0590.0670.0750.0830.0160.0240.1100.118NOM MAX H E(*Note: Microdot may be in either location)SC −70 (SOT −323)CASE 419ISSUE PDATE 07 OCT 2021SCALE 4:1STYLE 3:PIN 1.BASE2.EMITTER3.COLLECTOR STYLE 4:PIN 1.CATHODE2.CATHODE3.ANODE STYLE 2:PIN 1.ANODE2.N.C.3.CATHODE STYLE 1:CANCELLEDSTYLE 5:PIN 1.ANODE 2.ANODE 3.CATHODE STYLE 6:PIN 1.EMITTER 2.BASE3.COLLECTORSTYLE 7:PIN 1.BASE 2.EMITTER 3.COLLECTORSTYLE 8:PIN 1.GATE 2.SOURCE 3.DRAINSTYLE 9:PIN 1.ANODE 2.CATHODE3.CATHODE-ANODESTYLE 10:PIN 1.CATHODE 2.ANODE3.ANODE-CATHODEXX M G G XX = Specific Device Code M = Date CodeG= Pb −Free PackageGENERICMARKING DIAGRAM1STYLE 11:PIN 1.CATHODE2.CATHODE3.CATHODE*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “G ”, may or may not be present. Some products maynot follow the Generic Marking.SC −75/SOT −416CASE 463−01ISSUE GDATE 07 AUG 2015SCALE 4:1NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.STYLE 1:PIN 1.BASE2.EMITTER3.COLLECTOR STYLE 2:PIN 1.ANODE2.N/C3.CATHODE STYLE 3:PIN 1.ANODE2.ANODE3.CATHODESTYLE 4:PIN 1.CATHODE2.CATHODE3.ANODEXX = Specific Device Code M = Date Code G = Pb −Free PackageSTYLE 5:PIN 1.GATE2.SOURCE3.DRAINDIM MIN NOM MAX MILLIMETERS A 0.700.800.90A10.000.050.10b C 0.100.150.25D 1.55 1.60 1.65E e 1.00 BSC 0.0270.0310.0350.0000.0020.0040.0040.0060.0100.0610.0630.0650.04 BSCMIN NOM MAX INCHES0.150.200.300.0060.0080.012*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “ G ”,may or may not be present.GENERICMARKING DIAGRAM*H EL 0.100.150.201.50 1.60 1.700.0040.0060.0080.0600.0630.0670.700.800.900.0270.0310.035ǒmm inchesǓSCALE 10:1*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*SOT −1123CASE 524AA ISSUE CDATE 29 NOV 2011SCALE 8:1NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.GENERICMARKING DIAGRAM*X = Specific Device Code M= Date Code*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “ G ”,may or may not be present.DIM MIN MAXMILLIMETERS A 0.340.40b 0.150.28c 0.070.17D 0.750.85E 0.550.650.95 1.05L 0.185 REF H E cA*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*X Me b10.100.20STYLE 1:PIN 1.BASE2.EMITTER3.COLLECTOR STYLE 2:PIN 1.ANODE2.N/C3.CATHODE STYLE 3:PIN 1.ANODE2.ANODE3.CATHODE STYLE 4:PIN 1.CATHODE2.CATHODE3.ANODE STYLE 5:PIN 1.GATE2.SOURCE3.DRAIN0.350.40TOP VIEWSIDE VIEWBOTTOM VIEW DIMENSIONS: MILLIMETERS0.26OUTLINEL20.050.15SOT −723CASE 631AA −01ISSUE DDATE 10 AUG 2009DIMMIN NOM MAX MILLIMETERS A 0.450.500.55b 0.150.210.27b10.250.310.37C 0.070.120.17D 1.15 1.20 1.25E 0.750.800.85e 0.40 BSC H 1.15 1.20 1.25L E NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.4.DIMENSIONS D AND E DO NOT INCLUDE MOLDFLASH, PROTRUSIONS OR GATE BURRS.eLXX = Specific Device Code M= Date CodeGENERICMARKING DIAGRAM*SCALE 4:1XX M STYLE 1:PIN 1.BASE2.EMITTER3.COLLECTOR STYLE 2:PIN 1.ANODE2.N/C3.CATHODESTYLE 3:PIN 1.ANODE2.ANODE3.CATHODESTYLE 4:PIN 1.CATHODE2.CATHODE3.ANODE1*This information is generic. Please refer to device data sheet for actual part marking. Pb −Free indicator, “G”, may or not be present.*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*STYLE 5:PIN 1.GATE2.SOURCE3.DRAINL20.150.200.250.29 REF 3X3X2XBOTTOM VIEWSIDE VIEWRECOMMENDEDDIMENSIONS: MILLIMETERS3XPUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTLITERATURE FULFILLMENT:。

PDTC143ZT中文资料

10−1
1
10
IC (mA)
VCE = 5 V. (1) Tamb = −40 °C. (2) Tamb = 25 °C. (3) Tamb = 100 °C.
Fig.5 Input-off voltage as a function of collector current; typical values.
collector cut-off current
IE = 0; VCB = 50 V
−
−
collector cut-off current
IB = 0; VCE = 30 V
−
−
IB = 0; VCE = 30 V; Tj = 150 °C −
−
emitter cut-off current
IC = 0; VEB = 5 V
0.15 0.09
3.0 2.8
1.4 1.2
1.9
0.95
2.5 2.1
0.45 0.55 0.15 0.45
0.2
0.1
OUTLINE
VERSION
IEC
SOT23
1999 May 21
REFERENCES
JEDEC
EIAJ
5
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
1999 May 21
ห้องสมุดไป่ตู้
元器件交易网
Philips Semiconductors
NPN resistor-equipped transistor
Product speciﬁcation
PDTC143ZT
FEATURES
• Built-in bias resistors R1 and R2 (typ. 4.7 kΩ and 47 kΩ respectively)

江苏长江电子科技有限公司数码晶体管技术有限公司数字晶体管（内置抗阻器）DTC143XM DTC143

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD Digital Transistors (Built-in Resistors)DTC143XM/DTC143XE/DTC143XUADTC143XKA /DTC143XCA/DTC143XSA ·Equivalent CircuitDIGITAL TRANSISTOR (NPN)FEATURES● Built-in bias resistors enable the configuration of an inverter circuitwithout connecting external input resistors(see equivalent circuit) ● The bias resistors consist of thin-film resistors with complete isolationto allow negative biasing of the input.They also have the advantage of almost completely eliminating parasitic effects● Only the on/off conditions need to be set for operation, making device design easyMAXIMUM RATINGS(Ta=25℃ unless otherwise noted)Limits(DTC143X □)Symbol ParameterM E UA CA KA SA Unit V CC Supply Voltage 50 V V IN Input Voltage -7～+20 V I O Output Current 100mA P D Power Dissipation 100150200200200300mW T j Junction Temperature 150 ℃ T stgStorage Temperature-55～+150℃ELECTRICAL CHARACTERISTICS (Ta=25℃ unless otherwise specified)Parameter SymbolConditionsMin Typ Max UnitV I(off)V CC =5V,I O =100µA 0.3 V Input voltage V I(on)V O =0.3V,I O =20mA 2.5 V Output voltageV O(on)I O /I I =10mA/0.5mA 0.1 0.3 V Input current I I V I =5V 1.8 mA Output current I O(off)V CC =50V,V I =0 0.5 μA DC current gain G IV O =5V,I O =10mA30 Input resistance R 1 3.29 4.7 6.11 k Ω Resistance ratio R 2/R 1 1.7 2.1 2.6Transition frequencyf TV O =10V,I O =5mA,f =100MHz250 MHzPart Number Package Packing MethodPack QuantitySOT-723 SOT-523 DT C 143X M DT C 143X EDTC 143X UA DT C 143X KA TO-92S TapeDTC 143X CA DT C 143X SA TO-92SBulk DT C 143X SA-TASOT-323 SOT-23-3L SOT-23ReelORDERING INFORMATIONMARKING43C143X XXXC143X XXX(2)(2)zz(1)z43z43z43z43zReel Reel Reel Reel 1000pcs/Bag 3000pcs/Box8000pcs/Reel 3000pcs/Reel 3000pcs/Reel 3000pcs/Reel 3000pcs/ReelNotes: (1).(2). ;;; &RGHSolid dot = Greenmolding compound device, if none, the normal device.REVERSE VOLTAGE VR (V)AMBIENT TEMPERATURE Ta()℃Symbol Dimensions In Millimeters Dimensions In Inches Min.Max.Min.Max.A 0.430 0.500 0.017 0.020 A10.000 0.050 0.000 0.002 b 0.170 0.270 0.007 0.011 b10.270 0.370 0.011 0.015 c 0.080 0.150 0.003 0.006 D 1.150 1.250 0.045 0.049 E 1.150 1.250 0.045 0.049 E10.750 0.850 0.030 0.033e 0.800TYP.0.031TYP.θ7°REF.7°REF.SO T -723 Package Outline DimensionsSO T -723Suggested Pad LayoutSO T-723 Tape and ReelSO T -523 Package Outline DimensionsSO T -523Suggested Pad LayoutSO T-523 Tape and ReelSO T -323 Package Outline DimensionsSO T -323Suggested Pad LayoutSO T-323 Tape and Reel627 -3L 3DFNDJH 2XWOLQH 'LPHQVLRQV627 -3L 6XJJHVWHG 3DG /D\RXWSO T -23 Package Outline DimensionsSO T -23Suggested Pad LayoutSymbol Dimensions In Millimeters Dimensions In Inches Min.Max.Min.Max.A 1.420 1.6200.0560.064 A10.6600.8600.0260.034 b0.3300.4800.0130.019 b10.4000.5100.0160.020 c0.3300.5100.0130.020 D 3.900 4.1000.1540.161 D1 2.280 2.6800.0900.106 E 3.050 3.2500.1200.128 e 1.270 TYP.0.050 TYP.e1 2.440 2.6400.0960.104 L15.10015.5000.5940.610θ45°TYP.45° TYP.。

MOTOROLA DTA143EE DATA SHEET

Preliminary Data SheetBias Resistor TransistorPNP Silicon Surface Mount Transistor with Monolithic Bias Resistor NetworkThe BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base–emitter resistor. These digital transistors are designed to replace a single device and its external resistor bias network. The BRT eliminates these individual components by integrating them into a single device. The DTA143EE is housed in the SOT–416/SC–90 package which is ideal for low–power surface mount applications where board space is at a premium.•Simplifies Circuit Design •Reduces Board Space •Reduces Component Count•Available in 8 mm, 7 inch/3000 Unit Tape and Reel.MAXIMUM RATINGS (T A = 25°C unless otherwise noted)RatingSymbol Value Unit Output Voltage V O –50Vdc Input Voltage V I –30Vdc Output CurrentI O–100mAdcDEVICE MARKINGDTA143EE = 43THERMAL CHARACTERISTICSPower Dissipation @ T A = 25°C (1)P D *125mW Operating and Storage Temperature Range T J , T stg –55 to +150°C Junction TemperatureT J150°CELECTRICAL CHARACTERISTICS (T A = 25°C)CharacteristicSymbol Min Typ Max Unit Input Off Voltage (V O = –5.0 Vdc, I O = –100 µAdc)V I(off)——–0.5Vdc Input On Voltage (V O = –0.3 Vdc, I O = –20 mAdc)V I(on)–3.0——Vdc Output On Voltage (I O = –10 mAdc, I I = –0.5 mAdc)V O(on)——–0.3Vdc Input Current (V I = –5.0 Vdc)I I ——–1.8mAdc Output Cutoff Current (V O = –50 Vdc)I O(off)——–500nAdc DC Current Gain (V O = –5.0 Vdc, I O = –10 mAdc)G I 20———Input Resistance R 1 3.3 4.7 6.1kOhmsResistance RatioR 1/R 20.81.01.21.Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint.* Typical electrical characteristic curves are not available at this time.This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.Thermal Clad is a trademark of the Bergquist CompanyOrder this documentby DTA143EE/DMOTOROLA SEMICONDUCTOR TECHNICAL DATADTA143EECASE 463–01, STYLE 1SOT–416/SC–90123R 1R 2IN (1)GND (2)OUT (3)R 1 = 4.7 k ΩR 2 = 4.7 k Ω查询DTA143EE供应商DTA143EEMINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connectioninterface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.1.410.5 min. (3x)0.5 m i n . (3x )TYPICAL0.5SOLDERING PATTERNUnit: mmSOT–416/SC–90 POWER DISSIPATIONThe power dissipation of the SOT–416/SC–90 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction tempera-ture of the die, R θJA , the thermal resistance from the device junction to ambient; and the operating temperature, T A .Using the values provided on the data sheet, P D can be calculated as follows:P D =T J(max) – T AR θJAThe values for the equation are found in the maximum ratings table on the data sheet. Substituting these values intothe equation for an ambient temperature T A of 25°C, one can calculate the power dissipation of the device which in this case is 125 milliwatts.P D =150°C – 25°C1000°C/W= 125 milliwattsThe 1000°C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 125 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad ™. Using a board material such as Thermal Clad, a higher power dissipation can be achieved using the same footprint.SOLDERING PRECAUTIONSThe melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.•Always preheat the device.•The delta temperature between the preheat and soldering should be 100°C or less.*•When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method,the difference should be a maximum of 10°C.•The soldering temperature and time should not exceed260°C for more than 10 seconds.•When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.•After soldering has been completed, the device should be allowed to cool naturally for at least three minutes.Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.•Mechanical stress or shock should not be applied during cooling.*Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.DTA143EESOLDER STENCIL GUIDELINESPrior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brassor stainless steel with a typical thickness of 0.008 inches.The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.TYPICAL SOLDER HEATING PROFILEFor any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board.On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 1 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board.This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows theactual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board.The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177–189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30degrees cooler than the adjacent solder joints.STEP 1PREHEAT ZONE 1“RAMP”STEP 2VENT “SOAK”STEP 3HEATING ZONES 2 & 5“RAMP”STEP 4HEATINGZONES 3 & 6“SOAK”STEP 5HEATING ZONES 4 & 7“SPIKE”STEP 6VENT STEP 7COOLING200°C150°C100°C50°CTIME (3 TO 7 MINUTES TOTAL)T MAXSOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)205° TO 219°C PEAK AT SOLDER JOINTDESIRED CURVE FOR LOWMASS ASSEMBLIES100°C150°C160°C140°CFigure 1. Typical Solder Heating ProfileDESIRED CURVE FOR HIGHMASS ASSEMBLIES170°CDTA143EEPACKAGE DIMENSIONSCASE 463–01ISSUE A SOT–416/SC–90DIM MIN MAX MIN MAX INCHES MILLIMETERS A 0.700.800.0280.031B 1.40 1.800.0550.071C 0.600.900.0240.035D 0.150.300.0060.012G 1.00 BSC 0.039 BSC H –––0.10–––0.004J 0.100.250.0040.010K 1.45 1.750.0570.069L 0.100.200.0040.008S0.50 BSC0.020 BSCNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.M0.20 (0.008)B–A––B–SD G 3 PL 0.20 (0.008)AKJLCH321STYLE 1:PIN 1.BASE 2.EMITTER 3.COLLECTORMotorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.How to reach us:USA /EUROPE /Locations Not Listed : Motorola Literature Distribution;JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–54543–14–2 T atsumi Koto–Ku, T okyo 135, Japan. 03–81–3521–8315MFAX : RMFAX0@ – TOUCHTONE 602–244–6609ASIA/PACIFIC : Motorola Semiconductors H.K. Ltd.; 8B T ai Ping Industrial Park, INTERNET : http://Design–51 Ting Kok Road, T ai Po, N.T ., Hong Kong. 852–26629298。