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Covaris E220 DNA Shearing Quick Guide

Covaris E220 DNA Shearing Quick Guide

Quick Guide:This Quick Guide provides DNA Shearing protocols when using microTUBE-130, microTUBE-50, microTUBE-15, microTUBE-500, or miniTUBE and a Covaris E220 Focused-ultrasonicator.Revision History010308 K 1/17 Format Changes; Addition of microTUBE-500 AFA Fiber Screw-Capprotocols; update ‘Additional Accessories’; update Appendix B 010308 L 2/17 Changes to 8 microTUBE-50 Strip V2 protocols; addition of 8 microTUBE-15AFA Beads H Slit Strip V2 and 8 microTUBE-50 AFA Fiber H Slit Strip V2010308 M 5/17 Addition of 96 microTUBE-50 AFA Fiber Plate Thin Foil (PN 520232) and 130ul 96 microTUBE AFA Fiber Plate Thin Foil (PN 520230)010308 N 7/17 Add the names of the well plates definition for 520230 & 520232. Changedyear for Rev M Date.Values mentioned in this Quick Guide are nominal values. The tolerances are as follows: -Temperature +/-2°C-Sample volumeo microTUBE-15: from 15 to 20 µl, +/- 1 µlo microTUBE-50: 55 µl, +/- 2.5 µlo microTUBE Plate, Strip, Snap and Crimp Cap: 130 µl, +/- 5 µlo microTUBE-500: 500 µl, +/- 10 µl or 320 µl, +/- 10 µlo miniTUBE: 200 µl, +/- 10 µl-Water Level +/- 1Sample guidelines-DNA input: up to 5 µg purified DNA (1 µg for the microTUBE-15; minimum 320 ng for the microTUBE-500) -Buffer: Tris-EDTA, pH 8.0-DNA quality: Genomic DNA (> 10 kb). For lower quality DNA, Covaris recommends setting up a time dose response experiment for determining appropriate treatment times.-DO NOT use the microTUBE or miniTUBE for storage. Samples should be transferred after processing. Instrument setup-Refer to the instrument manual for complete setup.-microTUBE and miniTUBE have specific holders or racks associated with them.-E220 and E220 evolution may require the Intensifier (PN 500141). Refer to Appendix C for instructions.-E220 and E220 evolution may require Y-dithering. Refer to Appendix A for instructions.Instrument settings-Recommended settings are subject to change without notice.-Mean DNA fragment size distributions are based on electropherograms generated from the Agilent Bioanalyzer with the DNA 12000 Kit (cat# 5067-1509), with the exception of the 320 µl microTUBE-500 protocol (HighSensitivity DNA Kit, cat# 5067-4626). DNA fragment representation will vary with analytical systems, please carry out a time course experiment based on settings provided in this document to reach desired fragment sizedistribution.See /wp-content/uploads/pn_010308.pdf for updates to this document.130 µl sample volume - from 150 to 1,500 bpVessel microTUBEAFA FiberSnap-Cap(PN 520045)microTUBEAFA FiberCrimp-Cap(PN 520052)8 microTUBEStrip(PN 520053)96 microTUBEPlate(PN 520078)96 microTUBEAFA Fiber PlateThin Foil(PN 520230)Sample Volume 130 µlE220RacksRack 24 PlacemicroTUBESnap-Cap (PN500111)Rack 96 PlacemicroTUBECrimp-Cap(PN 500282)Rack 12 Place 8microTUBE Strip(PN 500191)No Rack needed Plate Definitions“500111 24microTUBEsnap +4mmoffset”“E220_500282Rack 96 PlacemicroTUBE-6mm offset”“E220_500191 8microTUBE stripPlate -6mmoffset”“E220_52007896 microTUBEPlate -6mmoffset”“E220_52023096 microTUBEPlate Thin Foil -6mm offset”Water Level 6Intensifier (PN 500141) YesY-dithering NoE220 evolutionRacks Rack E220e 8 Place microTUBECrimp and Snap Cap (PN 500433)Rack E220e 8microTUBE Strip(PN 500430)Non Compatible Plate Definitions“500433 E220e 8 microTUBECrimp and Snap Cap -3.7mmoffset”“500430 E220e 8microTUBE Strip-6mm offset”N/A Water Level 6Intensifier (PN 500141) YesY-dithering NoAllTemperature (°C) 7Target BP (Peak) 150 200 300 400 500 800 1,000 1,500 Peak Incident Power (W) 175 175 140 140 105 105 105 140 Duty Factor 10% 10% 10% 10% 5% 5% 5% 2% Cycles per Burst 200 200 200 200 200 200 200 200 Treatment Time (s) 430 180 80 55 80 50 40 15Vessel microTUBE-50Screw-Cap (PN 520166)8 microTUBE-50 AFA FiberStrip V2 (PN 520174)8 microTUBE-50 AFA Fiber HSlit Strip V2 (PN 520240)96 microTUBE-50AFA Fiber Plate(PN 520168)96 microTUBE-50AFA Fiber Plate ThinFoil (PN 520232) Sample Volume 55 µlE220RacksRack 24 PlacemicroTUBE Screw-Cap (PN 500308)Rack 12 Place 8 microTUBEStrip (PN 500444) No Rack needed Plate Definitions“E220_500308 Rack24 Place microTUBE-50 Screw-Cap+6.5mm offset”“E220_500444 Rack 12 Place 8microTUBE-50 Strip V2-10mm offset”“E220_520168 96microTUBE-50 Plate-10.5mm offset”“E220_520232 96microTUBE-50 PlateThin Foil -10.5mmoffset”E220evolutionRacksRack E220e 4 PlacemicroTUBE ScrewCap (PN 500432)Rack E220e 8 microTUBE StripV2 (PN 500437) Non Compatible Plate Definitions“500432 E220e 4microTUBE-50 ScrewCap -8.32mm offset”“500437 E220e 8 microTUBE-50 Strip V2 -10mm offset” N/AAllTemperature (°C) 7Water Level 6 -2 0 Intensifier (PN 500141) Yes Yes YesY-dithering No No Yes (0.5mm Y-dither at10mm/s) Target BP (Peak) 150 200 250 300 350 400 550Screw-CapPeak Incident Power(W) 100 75 75 75 75 75 30Duty Factor 30% 20% 20% 20% 20% 10% 10%Cycles per Burst 1000 1000 1000 1000 1000 1000 1000Treatment Time (s) 130 95 62 40 30 50 708-StripPeak Incident Power (W) 75 75 75 75 75 75 50Duty Factor 15% 15% 20% 20% 20% 10% 10%Cycles per Burst 500 500 1000 1000 1000 1000 1000Treatment Time (s) 360 155 75 45 35 52 50 PlatePeak Incident Power (W) 100 100 75 75 75 75 75Duty Factor 30% 30% 20% 20% 20% 10% 10%Cycles per Burst 1000 1000 1000 1000 1000 1000 1000Treatment Time (s) 145 90 70 49 34 50 32 The Y-dithering function is required for shearing with 96 microTUBE-50 plate (PN 520168). This function is only available on SonoLab versions 7.3 and up. Please see Appendix A for detailed instructions.Vessel microTUBE-15 AFA BeadsScrew-Cap (PN 520145)8 microTUBE-15 AFA BeadsStrip V2 (PN 520159)8 microTUBE-15 AFA BeadsH Slit Strip V2 (PN 520241)Sample Volume 15 µlE220Racks Rack 24 Place microTUBEScrew-Cap (PN 500308)Rack 12 Place 8 microTUBEStrip V2 (PN 500444) Plate Definitions“E220_500308 Rack 24 PlacemicroTUBE-15 Screw-Cap+15mm offset”“E220_500444 Rack 12 Place 8microTUBE-15 Strip V2 -1.5mmoffset”Water Level 10 6Intensifier (PN 500141) NoY-dithering NoE220evolutionRacks Rack E220e 4 Place microTUBEScrew Cap (PN 500432)Rack E220e 8 microTUBE StripV2 (PN 500437)Plate Definitions ”500432 E220e 4 microTUBE-15Screw Cap 0.18mm offset”“500437 E220e 8 microTUBE-15Strip V2 -1.58mm offset”Water Level 10 6Intensifier (PN 500141) NoY-dithering NoAllTemperature (°C) 20Target BP (Peak) 150 200 250 350 550Peak Incident Power (W) 18 18 18 18 18Duty Factor 20% 20% 20% 20% 20%Cycles per Burst 50 50 50 50 50Treatment Time (s) 300 120 80 45 22To ensure reproducible DNA shearing, it is required to centrifuge samples before processing DNA in amicroTUBE-15. Please see Appendix B for instructions.Please note that microTUBE-15 requires removal of the Intensifier (PN 500141) from the E220 focused-ultrasonicator. Please see Appendix C for instructions.200 µl sample - 2,000; 3,000 and 5,000 bpVesselminiTUBE Clear(PN 520064)Blue(PN 520065)Red(PN 520066) Sample Volume 200 µlE220Racks Rack 24 Place miniTUBE (PN 500205)Plate Definition “500205 24 miniTUBE +15mm offset”Water Level 11Intensifier (PN 500141) NoY-dithering NoE220evolutionRacks Rack E220e 4 Place miniTUBE (PN 500434)Plate definition “500434 E220e 4 miniTUBE 4.9mm offset”Water Level 11Intensifier (PN 500141) NoY-dithering NoAllTemperature (°C) 7 20 20 Target BP (Peak) 2,000 3,000 5,000miniTUBE Clear Blue RedPeak Incident Power (W) 3 3 25Duty Factor 20% 20% 20%Cycles per Burst 1000 1000 1000Treatment Time (s) 900 600 600Please note that miniTUBE requires removal of the Intensifier (PN 500141) from the E220 focused-ultrasonicator. Please see Appendix C for instructions.320 µl and 500 µl sample volume – from 150 to 600 bpVesselmicroTUBE-500 AFA Fiber Screw-Cap(PN 520185)Sample Volume320 µl 500 µlE220Rack Rack, 24 microTUBE-500 Screw-Cap (PN 500452)Plate Definition “E220_500452 Rack 24 Place microTUBE-500 Screw-Cap +6mmoffset” Water Level6 Intensifier (PN 500141)Yes Y-dithering NoE220 evolutionRackRack E220e 4 microTUBE-500 Screw-Cap (PN 500484) Plate Definition “500484 E220e 4 microTUBE-500 Screw-Cap -9.9mm offset”Water Level6 Intensifier (PN 500141)Yes Y-ditheringNo AllTemperature (°C)7Target BP (Peak)500 - 600150200350550Peak Incident Power (W) 75 175 175 175 175 Duty Factor 25% 20% 20% 20% 5% Cycles per Burst 200 200 200 200 200 Treatment Time (s)7540018055110To fragment DNA to sizes larger than 5 kb, Covaris offers the g-TUBE: a single-use device that shears genomic DNA into selected fragments sizes ranging from 6 kb to 20 kb. The only equipment needed is a compatible bench-top centrifuge.Additional AccessoriesPart Number Preparation stationsmicroTUBE Prep Station Snap & Screw Cap 500330 microTUBE-500 Screw-Cap Prep Station 500510 miniTUBE loading and unloading station 500207 8 microTUBE Strip Prep Station500327 Centrifuge and Heat Block microTUBE Screw-Cap Adapter Fits microTUBE Screw-Caps into bench top microcentrifuges500406 Centrifuge 8 microTUBE Strip V2 Adapter Fits the 8 microTUBE Strip into a Thermo Scientific TM mySPIN TM 12 mini centrifuge 500541 g-TUBEg-TUBEs (10) and prep station520079Appendix A – Using Y-dithering with SonoLab 7.3 and upA Y-dithering step is required for DNA shearing with the 96 microTUBE-50 Plate-This feature is only available on SonoLab versions 7.3 and up.-To obtain a copy of the SonoLab 7.3 and the Plate Definition installers, please employ the Registered Users Login on the Covaris website, -For any assistance in this process, please contact your local representative, or Covaris Global Technical Services at ***********************.Use the following steps to include Y-dithering in sample treatment1.Go into the Method Editor2.Select ‘Add Step’ and enter the treatment settings for the desired fragment sizea.Note: The following steps must be done for each individual treatment3.Select the Motion tab4.Enter the following values into the ‘X-Y Dithering Box’a.Y Dither (mm): 0.5b.X-Y Dither Speed (mm/sec): 10.0c.Both X Dither (mm) and X-Y Dwell (sec) should be set to 0Appendix B – microTUBE-15 centrifugation before DNA Shearing1.Sample loading and centrifugationmicroTUBE-15 AFA Beads Screw-CapLoad and centrifuge microTUBE-15 Screw-Cap as described before placing the tubes in the rack.If some of the sample splashes onto the wall of the microTUBE while removing from centrifuge or placing into rack, repeat centrifuge step. All liquid should be at the bottom of the microTUBE-15 before starting the AFA treatment.8 microTUBE-15 AFA Beads Strip V2The 8 microTUBE-15 AFA Beads Strip V2 will fit into the Covaris Centrifuge 8 microTUBE Strip V2 Adapter (PN 500541) for the Thermo Scientific TM mySPIN TM 12 mini centrifuge. Place the strip in the adapter and spin for a minimum of 1 minute.2.Sample processingUse settings provided in page 4.3.Sample recoveryRepeat the centrifuge step before recovering sample from microTUBE-15.Appendix C – Removing or Installing the Intensifier (Covaris PN 500141) from an E System The 500141 Intensifier is a small inverted stainless steel cone centered over the E Series transducer by four stainless wires. The wires are held by in a black plastic ring pressed into the transducer well.If an AFA protocol requires “no intensifier”, please remove the Intensifier, using the following steps:1.Empty the water bath. Start the E System and start the SonoLab software.2.Wait for the homing sequence to complete (the transducer will be lowered with the rack holder at it home position,allowing easy access to the Intensifier).3.Grasp opposite sides of plastic ring and gently pull the entire assembly out of the transducer well. Do not pull on the steelcone or the wires. The ring is a friction fit in the well – no hardware is used to hold it in place.The 500141 Intensifier (left) shown installed in the E System transducer well and (right) removed.Note the “UP” marking at the center of the Intensifier.If a protocol requires the Intensifier to be present, simply reverse this process:1.Align the black plastic ring with the perimeter of the transducer well. Note that the flat side of the center cone (marked UP)should be facing up (away from the transducer).2.Gently press each section of the ring into the well until the ring is seated uniformly in contact with the transducer, withapproximately 2 mm of the ring evenly exposed above the transducer assembly. Do not press on the cone or wires. The rotation of the ring relative to the transducer assembly is not important.3.Refill the tank. Degas and chill the water before proceeding.Technical Assistance•By telephone (+1 781 932 3959) during the hours of 9:00am to 5:00pm, Monday through Friday, United States Eastern Standard Time (EST) or Greenwich Mean Time (GMT) minus 05:00 hours•By e-mail at ***********************。

SkyTraq Venus638FLPx GPS接收器数据手册说明书

SkyTraq Venus638FLPx GPS接收器数据手册说明书

Venus638FLPx GPS ReceiverData Sheet10mmx 10mmVenus638FLPx-L / Venus638FLPx-DFEATURES20Hz update rate-148dBm cold start sensitivity-165dBm tracking sensitivity29 second cold start TTFF3.5 second TTFF with AGPS1 second hot start2.5m accuracyMultipath detection and suppressionJamming detection and mitigationSBAS (WAAS / EGNOS) support7-day extended ephemeris AGPS67mW full power navigationWorks directly with active or passive antennaInternal flash for optional 75K point data logging Supports external SPI flash memory data logging Complete receiver in 10mm x 10mm x 1.3mm size Contains LNA, SAW Filter, TCXO, RTC Xtal, LDO Pb-free RoHS compliant Venus638FLPx is a high performance, low cost, single chip GPS receiver targeting mobile consumer and cellular handset applications. It offers very low power consumption, high sensitivity, and best in class signal acquisition and time-to-first-fix performance.Venus638FLPx contains all the necessary components of a complete GPS receiver, includes 1.2dB cascaded system NF RF front-end, GPS baseband signal processor, 0.5ppm TCXO, 32.768kHz RTC crystal, RTC LDO regulator, and passive components. It requires very low external component count and takes up only 100mm2 PCB footprint.Dedicated massive-correlator signal parameter search engine within the baseband enables rapid search of all the available satellites and acquisition of very weak signal. An advanced track engine allows weak signal tracking and positioning in harsh environments such as urban canyons and under deep foliage.The self-contained architecture keeps GPS processing off the host and allows integration into applications with very little resource.Venus638FLPx is very easy to use, minimizes RF layout design issues and offers very fast time to market.Product Series Product DescriptionVenus638FLPx-L Flash version GPS receiver (internal 1.2V LDO version)Suitable for Venus634FLPx direct drop-in replacementVenus638FLPx-D Flash version GPS receiver (external 1.2V version)Suitable for lower power application using external 1.2V supplyTECHNICAL SPECIFICATIONSReceiver Type L1 frequencyGPS C/A codeSBAS capable65-channel architecture8 million time-frequency searches per secondAccuracy Position 2.5m CEPVelocity 0.1m/secTiming 60nsOpen Sky TTFF 29 second cold start3.5 second with AGPS1 second hot startReacquisition < 1sSensitivity -165dBm tracking-148dBm cold startUpdate Rate 1 / 2 / 4 / 5 / 8 / 10 / 20 Hz (default 1Hz)Dynamics 4GOperational Limits Altitude < 18,000m*1 , Velocity < 515m/s*1Datum Default WGS-84Interface UART LVTTL levelBaud Rate 4800 / 9600 / 38400 / 115200Protocol NMEA-0183 V3.01, GGA, GLL, GSA, GSV, RMC, VTG (default GGA, GSA, GSV, RMC, VTG) SkyTraq BinaryMain Supply Voltage 2.8V ~ 3.6V (Venus638FLPx-L)2.8V ~3.6V, 1.08V ~ 1.32V (Venus638FLPx-D)Backup Voltage 1.5V ~ 6VCurrent ConsumptionEnhanced Acquisition Low Power Acquisition TrackingVenus638FLPx-L ***************************Venus638FLPx-D ******************************************************Assuming 75% efficiency switch-mode 3.3V-to-1.2V regulator is used, thenEnhanced Acquisition Low Power Acquisition TrackingVenus638FLPx-D *************************** Operating Temperature -40 ~ +85 deg-CStorage Temperature -40 ~ +125 deg-CPackage LGA69 10mm x 10mm x 1.3mm, 0.8mm pitch*1: COCOM limit, either may be exceeded but not bothBLOCK DIAGRAMFigure-1 GPS Receiver based on Venus638FLPxVENUS638FLPx PIN-OUT DIAGRAMFigure-2b Venus638FLPx Pin-Out DiagramVENUS638FLPx PIN DEFINITIONPin Number Signal Name Type Description1 RSTN Input Active LOW reset input, 3.3V LVTTL2 VCC33I Power Input Main voltage supply input, 2.8V ~ 3.6V3 NC Not connected, empty pin4 PIO12 Bidir General purpose I/O pin, 3.3V LVTTL5 GPIO2 Bidir General purpose I/O pin, 3.3V LVTTL6 GPIO1 Bidir General purpose I/O pin, 3.3V LVTTL7 LED / GPIO0 Bidir Navigation status indicator or General purpose I/O. 3.3V LVTTL8 GPIO24 Bidir General purpose I/O pin. 3.3V LVTTLAlso serves as Search Engine Mode Selection upon power-up1: low power acquisition mode0: enhanced acquisition mode9 BOOT_SEL Bidir Boot mode selection. Pull-high or pull-low using 10K resistor. Mustnot connect to VCC or GND directly.1: execute from internal ROM0: execute from internal Flash memory10 GND Power System ground11 GND Power System ground12 GPIO22 Bidir General purpose I/O pin, 3.3V LVTTL13 GPIO23 Bidir General purpose I/O pin, 3.3V LVTTL14 GPIO20 Bidir General purpose I/O pin, 3.3V LVTTL15 GND Power System ground16 GPIO29 Bidir General purpose I/O pin, 3.3V LVTTL17 V12O_RTC Power Output 1.2V LDO output for RTC & backup memory. Normally unused.18 VBAT Power Input Supply voltage for internal RTC and backup SRAM, 1.5V ~ 6V.VBAT should be powered by non-volatile supply voltage to haveoptimal performance. If VBAT is connected to VCC33I, powered offas VCC33I power is removed, then it’ll cold start every time. Forapplications that do not care lesser performance cold startingevery time, this pin can be connected to VCC33I.19 GND Power System ground20 NC Not connected, empty pin21 GND_RF Power RF section system ground22 GND_RF Power RF section system ground23 NC Not connected, empty pin24 GND_RF Power RF section system ground25 GND_RF Power RF section system ground26 NC Not connected, empty pin27 GND_RF Power RF section system ground28 GND_RF Power RF section system ground29 GND_RF Power RF section system ground30 NC Not connected, empty pin31 GND_RF Power RF section system ground32 RFIN Input GPS signal input, connect to GPS antenna.33 GND_RF Power RF section system ground34 NC Not connected, empty pin35 NC Not connected, empty pin36 REG_ENA Input Connect to pin-2 VCC33I37 PIO14 Bidir General purpose I/O pin, 3.3V LVTTL38 MOSI / PIO9 Bidir SPI data output or general purpose I/O pin, 3.3V LVTTL39 MISO / PIO8 Bidir SPI data input or general purpose I/O pin, 3.3V LVTTL40 P1PPS Output 1 pulse per second output. Active after position fix; goes HIGH forabout 4msec, 3.3V LVTTL41 SPI_CLK / PIOO7 Output SPI clock or general purpose output pin, 3.3V LVTTL42 RXD0 Input Received input of the asynchronous UART port. Used to inputbinary command to the GPS receiver. 3.3V LVTTL43 SPI_CSN / PIO6 Bidir SPI chip select output or general purpose I/O pin, 3.3V LVTTL44 TXD0 Output Transmit output of the asynchronous UART port. Used to outputstandard NMEA-0183 sentence or response to input binarycommand. 3.3V LVTTL45 SDA Bidir I2C data, 3.3V I/O46 SCL Bidir I2C clock, 3.3V I/O47 GPIO4 Bidir General purpose I/O pin, 3.3V LVTTL48 GPIO3 Bidir General purpose I/O pin, 3.3V LVTTL49 GND System ground50 PIO5 Output General purpose output pin, 3.3V LVTTL51 PIO11 Bidir General purpose I/O pin, 3.3V LVTTL52 RXD1 Input Received input of the asynchronous UART port.3.3V LVTTL53 GPIO25 Bidir General purpose I/O pin, 3.3V LVTTL54 GPIO30 Bidir General purpose I/O pin, 3.3V LVTTL55 PIO15 Bidir General purpose I/O pin, 3.3V LVTTL56 NC / V12 NC pin for Venus638FLPx-L1.2V supply input pin for Venus638FLPx-D57 TXD1 Output Transmit output of the asynchronous UART port.3.3V LVTTL58 VCC33I Power Input Main voltage supply input, 2.8V ~ 3.6V59 GPIO28 Bidir General purpose I/O pin, 3.3V LVTTL60 GND Power System ground61 GND_RF Power RF section system ground62 GND_RF Power RF section system ground63 GPIO6 Bidir General purpose I/O pin, 3.3V LVTTL64 GND Power System ground65 GND_RF Power RF section system ground66,67,68 NC69 GND_RF Power RF section system groundWhen using Venus638FLPx-L to replace Venus634FLPx, pin-45 ~ pin-69 can all be left unconnected.When using Venus638FLPx-D, 1.2V need to be supplied at pin-56The NC pins are to be left unconnected.DC CHARACTERISTICS OF DIGITAL INTERFACEBelow is when VCC3I is at nominally 3.3VParameter Min. Typ. Max. Units Input Low Voltage 0.8 Volt Input High Voltage 2.0 Volt Output Low Voltage, Iol = 2 ~ 16mA 0.4 Volt Output High Voltage, Ioh = 2 ~ 16mA 2.9 VoltMECHANICAL DIMENSIONRECOMMENDED PCB FOOTPRINTFigure-3 Recommended PCB Footprint.RECOMMENDED REFLOW PROFILETemperature (℃) 25 82.5 140 150 160 170 180 190 200 225 250 250 215 185 155 125 95 65 35 Time(minute) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9Profile Description SnPb Eutectic Process Lead Free ProcessPreheatMaximum Temperature 100+/-10 ℃140+/-10 ℃Time(ΔT) 40~60s 50~70sRamp-UpRamp-Up Rate 1 ℃/s Max. 1 ℃/s Max.Time(ΔT) 120~150s 160~200sReflowMaximum Temperature Peak Temp. Peak Temp.Minimum Temperature 180+/-5℃200+/-10℃Peak Temperature 220+/-2℃250+/-2℃Time(ΔT) during Peak10~30s20~40sTemp.+/-2℃Reflow Time(ΔT) 120~150s 120~150sCoolingCooling Rate 1.5 ℃/s Max 1.5 ℃/s MaxTime(ΔT) 60~120s 150~180sAPPLICATION CIRCUIT INTERFACE SIGNALSGND_A: RF groundLED: Signal to indicate GPS position status, 3.3V LVTTL.Active low for no-fix, toggle every second after position fix.PSE_SEL: Search engine mode selection, sampled only at end of power-on reset cycle1: Low power acquisition mode0: Enhanced acquisition modeGND: Digital groundP1PPS: 1 pulse per second time-mark (3.3V LVTTL)RSTN: Active low reset inputVCC33: 3.3V power inputFRXD0: UART input (3.3V LVTTL)FTXD0: UART output (3.3V LVTTL)VBAT: Battery-backed RTC and SRAM supply input, 1.5V ~ 6V, must not be unconnected.APPLICATION INFORMATION1. For fast-rising power supply, a simple series R/C reset delay to pin-1, RSTN, as indicated in the application circuit is suitable.For system having slow-rising power supply, a reset IC providing 2~5ms reset duration may be necessary.2. The RF input of Venus638FLPx is already matched to 50-ohm. Passive antenna matched to 50-ohm can be directly applied.3. For using Venus638FLPx with active antenna, one with gain in range of 10~30dB and noise figure < 2dB can be used. Powerto the active antenna needs to be applied externally.4. Pin-18 VBAT supplies backup power to the real-time clock and backup SRAM for fast startup. For portable applicationswhere there is battery with voltage in range of 1.5V ~ 6.0V as the main source, the VBAT pin can be directly connected to it.If VBAT is connected to main power as pin-2, no supply voltage as Venus638FLPx is powered off, then it’ll cold start every time and GPS performance will not be optimal.5. Like BGA device, the Venus638FLPx is moisture sensitive. It needs to be handled with care to void damage from moistureabsorption and SMT re-flow. The device should be baked for 24 hours at 125-degC before mounting for SMT re-flow if it has been removed from the protective seal for more than 48*1hours.6. The supported SPI Flash memory verified for data logging application are:Manufacturer Device ID SizeEON EN25F040 4MbitEON EN25F080 8MbitMXIC MX25L400 4MbitMXIC MX25L800 8MbitMXIC MX25L1605 16MbitMXIC MX25L3205 32MbitMXIC MX25L6405 64MbitWINBOND W25X40 4MbitWINBOND W25X80 8MbitWINBOND W25X16 16MbitWINBOND W25X32 32MbitWINBOND W25X64 64MbitSST SST25LF040 4MbitSST SST25LF080 8MbitSST SST25VF016 16MbitSST SST 25VF032 32Mbit7. The P1PPS pin must not be pulled-high during power on reset, or it’ll enter into debug mode and freeze.*1: Actual will be longer, moisture sensitivity level still undergoing verification.SLEEP MODEFor application requiring sleep mode, it can be implemented using regulator with enable control as below figure shows. To put Venus638FLPx to sleep, the power to Venus638FLPx is cut off by disabling the regulator via host processor GPIO pin. In sleep mode, VBAT consume less than 10uA. Fast start up operation is provided by keeping supply voltage to VBAT constant, retaining the internal data and keep RTC running while Venus638FLPx is put to sleep or when supply 3.3V power is removed.For applications needing sleep mode but cannot have extra cost of adding a rechargeable backup supply battery, it can be implemented as below figure shows. It will provide fast start up when Venus638FLPx is put to sleep and awakened, but will cold start every time when the 3.3V supply voltage is removed and re-applied again.When using sleep mode, add 10K series resistor on pin-42 RXD0 and pin-44 TXD0.PACKAGENMEA MESSAGESThe full descriptions of supported NMEA messages are provided at the following paragraphs.GGA - Global Positioning System Fix DataTime, position and fix related data for a GPS receiver.Structure:$GPGGA,hhmmss.sss,ddmm.mmmm,a,dddmm.mmmm,a,x,xx,x.x,x.x,M,,,,xxxx*hh<CR><LF>1 2 3 4 5 6 7 8 9 10 11Example:$GPGGA,111636.932,2447.0949,N,12100.5223,E,1,11,0.8,118.2,M,,,,0000*02<CR><LF>Field Name Example Description1 UTC Time 111636.932 UTC of position in hhmmss.sss format, (000000.000 ~ 235959.999)2 Latitude 2447.0949 Latitude in ddmm.mmmm formatLeading zeros transmitted3 N/S Indicator N Latitude hemisphere indicator, ‘N’ = North, ‘S’ = South4 Longitude 12100.5223 Longitude in dddmm.mmmm formatLeading zeros transmitted5 E/W Indicator E Longitude hemisphere indicator, 'E' = East, 'W' = West6 GPS qualityindicator 1 GPS quality indicator0: position fix unavailable1: valid position fix, SPS mode2: valid position fix, differential GPS mode3: GPS PPS Mode, fix valid4: Real Time Kinematic. System used in RTK mode with fixed integers5: Float RTK. Satellite system used in RTK mode. Floating integers6: Estimated (dead reckoning) Mode7: Manual Input Mode8: Simulator Mode7 Satellites Used 11 Number of satellites in use, (00 ~ 12)8 HDOP 0.8 Horizontal dilution of precision, (00.0 ~ 99.9)9 Altitude 108.2 mean sea level (geoid), (-9999.9 ~ 17999.9)10 DGPS Station ID 0000 Differential reference station ID, 0000 ~ 1023NULL when DGPS not used11 Checksum 02GLL – Latitude/LongitudeLatitude and longitude of current position, time, and status.Structure:$GPGLL,ddmm.mmmm,a,dddmm.mmmm,a,hhmmss.sss,A,a*hh<CR><LF>1 2 3 4 5 6 7 8Example:$GPGLL,2447.0944,N,12100.5213,E,112609.932,A,A*57<CR><LF>Field Name Example Description1 Latitude 2447.0944 Latitude in ddmm.mmmm formatLeading zeros transmitted2 N/S Indicator N Latitude hemisphere indicator‘N’ = North‘S’ = South3 Longitude 12100.5213 Longitude in dddmm.mmmm formatLeading zeros transmitted4 E/W Indicator E Longitude hemisphere indicator'E' = East'W' = West5 UTC Time 112609.932 UTC time in hhmmss.sss format (000000.000 ~235959.999)6 Status A Status, ‘A’ = Data valid, ‘V’ = Data not valid7 Mode Indicator A Mode indicator‘N’ = Data not valid‘A’ = Autonomous mode‘D’ = Differential mode‘E’ = Estimated (dead reckoning) mode‘M’ = Manual input mode‘S’ = Simulator mode8 Checksum 57GSA – GNSS DOP and Active SatellitesGPS receiver operating mode, satellites used in the navigation solution reported by the GGA or GNS sentence and DOP values.Structure:$GPGSA,A,x,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,xx,x.x,x.x,x.x*hh<CR><LF>1 2 3 3 3 3 3 3 3 3 3 3 3 3 4 5 6 7Example:$GPGSA,A,3,05,12,21,22,30,09,18,06,14,01,31,,1.2,0.8,0.9*36<CR><LF>Field Name Example Description1 Mode A Mode‘M’ = Manual, forced to operate in 2D or 3D mode‘A’ = Automatic, allowed to automatically switch 2D/3D2 Mode3 Fix type1 = Fix not available2 = 2D3 = 3D3 Satellite used 1~12 05,12,21,22,30,09,18,06,14,01,31,, Satellite ID number, 01 to 32, of satellite used in solution, up to 12 transmitted4 PDOP 1.2 Position dilution of precision (00.0 to 99.9)5 HDOP 0.8 Horizontal dilution of precision (00.0 to 99.9)6 VDOP 0.9 Vertical dilution of precision (00.0 to 99.9)7 Checksum 36GSV – GNSS Satellites in ViewNumber of satellites (SV) in view, satellite ID numbers, elevation, azimuth, and SNR value. Four satellites maximum per transmission.Structure:$GPGSV,x,x,xx,xx,xx,xxx,xx,…,xx,xx,xxx,xx *hh<CR><LF>1 2 3 4 5 6 7 4 5 6 7 8Example:$GPGSV,3,1,12,05,54,069,45,12,44,061,44,21,07,184,46,22,78,289,47*72<CR><LF>$GPGSV,3,2,12,30,65,118,45,09,12,047,37,18,62,157,47,06,08,144,45*7C<CR><LF>$GPGSV,3,3,12,14,39,330,42,01,06,299,38,31,30,256,44,32,36,320,47*7B<CR><LF>Field Name Example Description1 Number of message 3 Total number of GSV messages to be transmitted (1-3)2 Sequence number 1 Sequence number of current GSV message3 Satellites in view 12 Total number of satellites in view (00 ~ 12)4 Satellite ID 05 Satellite ID number, GPS: 01 ~ 32, SBAS: 33 ~ 64 (33 =PRN120)5 Elevation 54 Satellite elevation in degrees, (00 ~ 90)6 Azimuth 069 Satellite azimuth angle in degrees, (000 ~ 359 )7 SNR 45 C/No in dB (00 ~ 99)Null when not tracking8 Checksum 72RMC – Recommended Minimum Specific GNSS DataTime, date, position, course and speed data provided by a GNSS navigation receiver.Structure:$GPRMC,hhmmss.sss,A,dddmm.mmmm,a,dddmm.mmmm,a,x.x,x.x,ddmmyy,,,a*hh<CR><LF>1 2 3 4 5 6 7 8 9 10 11Example:$GPRMC,111636.932,A,2447.0949,N,12100.5223,E,000.0,000.0,030407,,,A*61<CR><LF>Field Name Example Description1 UTC time 0111636.932 UTC time in hhmmss.sss format (000000.00 ~235959.999)2 Status A Status‘V’ = Navigation receiver warning‘A’ = Data Valid3 Latitude 2447.0949 Latitude in dddmm.mmmm formatLeading zeros transmitted4 N/S indicator N Latitude hemisphere indicator‘N’ = North‘S’ = South5 Longitude 12100.5223 Longitude in dddmm.mmmm formatLeading zeros transmitted6 E/W Indicator E Longitude hemisphere indicator'E' = East'W' = West7 Speed over ground 000.0 Speed over ground in knots (000.0 ~ 999.9)8 Course over ground 000.0 Course over ground in degrees (000.0 ~ 359.9)9 UTC Date 030407 UTC date of position fix, ddmmyy format10 Mode indicator A Mode indicator‘N’ = Data not valid‘A’ = Autonomous mode‘D’ = Differential mode‘E’ = Estimated (dead reckoning) mode‘M’ = Manual input mode‘S’ = Simulator mode11 checksum 61VTG – Course Over Ground and Ground SpeedThe Actual course and speed relative to the ground.Structure:GPVTG,x.x,T,,M,x.x,N,x.x,K,a*hh<CR><LF>1 2 3 4 5Example:$GPVTG, 000.0,T,,M,000.0,N,0000.0,K,A*3D<CR><LF>Field Name Example Description1 Course 000.0 True course over ground in degrees (000.0 ~ 359.9)2 Speed 000.0 Speed over ground in knots (000.0 ~ 999.9)3 Speed 0000.0 Speed over ground in kilometers per hour (0000.0 ~1800.0)4 Mode A Mode indicator‘N’ = not valid‘A’ = Autonomous mode‘D’ = Differential mode‘E’ = Estimated (dead reckoning) mode‘M’ = Manual input mode‘S’ = Simulator mode5 Checksum 3DORDERING INFORMATIONPart Number DescriptionVenus638FLPx-L Flash version GPS receiver (internal 1.2V LDO version)Venus638FLPx-D Flash version GPS receiver (external 1.2V version)SkyTraq Technology, Inc.4F, No.26, Minsiang Street, Hsinchu, Taiwan, 300Phone: +886 3 5678650Fax: +886 3 5678680Email: ****************.tw© 2008 SkyTraq Technology Inc. All rights reserved.Not to be reproduced in whole or part for any purpose without written permission of SkyTraq Technology Inc (“SkyTraq”). Information provided by SkyTraq is believed to be accurate and reliable. These materials are provided by SkyTraq as a service to its customers and may be used for informational purposes only. SkyTraq assumes no responsibility for errors or omissions in these materials, nor for its use. SkyTraq reserves the right to change specification at any time without notice.These materials are provides “as is” without warranty of any kind, either expressed or implied, relating to sale and/or use of SkyTraq products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. SkyTraq further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. SkyTraq shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials.SkyTraq products are not intended for use in medical, life-support devices, or applications involving potential risk of death, personal injury, or severe property damage in case of failure of the product.Change LogVersion 0.7, January 25, 20111. Changed latitude, longitude, speed, heading number of digits back to original format due to customer backwardcompatibility issueVersion 0.6, October 20, 20101. Edited performance spec due to firmware enhancement2. Added 1 more decimal digit to latitude, longitude, speed, heading in NMEA sentenceVersion 0.5, August 31, 20101. Added application information on P1PPS pinVersion 0.4, August 3, 20101. Pin-1 orientation in the shipping tray rotated 90-degreeVersion 0.3, April 6, 20101 Modified for Flash typeVersion 0.2, March 24, 20101. Added current consumption number for –D version at 3.3VVersion 0.1, February 24, 20101. Initial release。

离子交换树脂分离富集-分光光度法测定铜尾矿中金含量

离子交换树脂分离富集-分光光度法测定铜尾矿中金含量

总第192期2021年第2期山西化工SHANXI CHEMICAL INDUSTRYTotal192No.2,2021分析与测试叫DOI:10.16525/l4-1109/tq.2021.02.15离子交换树脂分离富集■分光光度法测定铜尾矿中金含量咎敏娇(北方铜业股份有限公司计量检验部,山西运城043700)摘要:研究了717型阴离子交换树脂对金的吸附和解析性能,考察了上柱液流速、上柱液酸度、样品体积对吸附率的影响,建立了离子交换树脂分离富集-分光光度法测定铜尾矿中金含量的方法。

该方法的检出限为0.43“g/L,铜尾矿样品的测定结果与活性炭纸浆吸附碘量法的测定结果相吻合。

关键词:分光光度法;离子交换树脂;铜尾矿中图分类号.Q657.3文献标识码:A文章编号:1004-7050(2021)01-0049-03引言铜矿峪铜矿系大型矽卡岩型铜铁共生矿床,铜 铁品位高,储量大,并伴生金、银。

矿石分氧化铜铁矿和硫化铜铁矿,两种类型的矿石进入选矿厂,分两大系统进行选别口勾。

选矿厂采用浮选一弱磁选一强磁选的工艺流程生产出铜精矿和铁精矿,产出的强磁铜尾矿总量约25万t。

在实验的基础上,选矿厂设计建立了日处理量1000t的铜尾矿综合利用厂,采用常规的浮-重-磁联合工艺流程综合回收铜、金、银和铁。

为实现铜尾矿中矿物金的有效回收,必须对铜尾矿中的金含量进行准确测定。

在铜矿峪铜矿铜尾矿中,其金含量较低,实际矿样中铜、金、铁等元素含量较高,给金元素的测定带来了很大的干扰,当前一般都需要对铜尾矿样品进行预分离富集后再进行测定。

当前金的分离和富集方法主要有活性炭吸附法、泡沫塑料吸附法、MIBK萃取法等,以上分离和富集方法实验时间长,操作过程复杂,对实验人员要求非常高。

离子交换树脂分离富集法具有分析成本低、劳动强度小、无污染等特点,在处理铜尾矿的预分离富集应用中具有较好的效果。

金元素的测定主要有原子吸收分光光度法、电感耦合等离子体原子发射光谱法、液相色谱与电感耦合等离子体质谱联用法等,以上方法存在基体干扰严重、仪器设备昂贵等问题。

WHO化学药品实验室预认证情况介绍

WHO化学药品实验室预认证情况介绍

7)仪器设备的校准、验证和确认 仪器设备的校准、
– 操作人员必须要有资质 – 仪器确认、校准、维护和记录保存 – 仪器供应商提供技术支持 – 仪器确认(DQ, IQ, OQ, PQ) 仪器确认( PQ) – 天平每日校准
8)分包
– 分包商选择和评价程序 – 检验分包
质控实验室负责 客户的同意 分包商名单,评估记录
一、 WHO预认证简介 预认证简介
• WHO预认证所依据标准及相关文件 预认证所依据标准及相关文件
– 联合国机构评价使用质控实验室的指导原则 联合国机构评价使用质控实验室的指导原则(2004年发布 WHO TRS, No. 917, Annex 4,2007年修订 WHO TRS, No. 943, Annex 5,修订中) – 药品采购项目的实验室评估 药品采购项目的实验室评估(比如全球基金项目和联合国防治结核艾滋病 项目)要求执行此规范 ) – 药品质控实验室良好操作规范 药品质控实验室良好操作规范(WHO good practices for pharmaceutical quality control laboratories , GPCL,WHO TRS, No. 957 ,2010) – WHO 实验室文件准备指导原则 实验室文件准备指导原则(WHO Guidelines for Preparing a Laboratory Information File)
• WHO 预认证的目的
– 增加质控实验室的数量:
符合药品检验的相关标准 并受委托为联合国机构进行药品检验;
– 促进发展中国家的国家质控实验室的能力建设
技术支持 培训 指导原则
一、WHO预认证简介 预认证简介
• 2004年WHO建立预认证程序 年 建立预认证程序

TEKPROBE BNC接口适用于P6204、P6205、P6217和P6231s激活FET探头的产

TEKPROBE BNC接口适用于P6204、P6205、P6217和P6231s激活FET探头的产
1103
• Powers up to Two Probes
• For Use with: - 11000 Series Probes on NonTEKPROBETM Interfaced Scopes - P6203, P6204, P6205, P6217, P6231, P6245
• Overload Protected
Teldronix Distributor (see pages 59(}595).
Product(s) avalla~le through your local Tektronix representative (listed In the bac~ of this catalog) or call 1-800-426-2200.
.(809001
.NXillSIifl:I"',*~~
Tektronix M!lll$llf6ll1eRt products are m~ufaClureQ IR
ISO registered facilities.
P6205
• DC to 750 IVIHz • 2 pF Input C • 1 MQ Input R • Low Price
These Active Probes may also be used with 50 Q or 1 MQ oscilloscope systems, with conventional BNC interfaces, via the Tektronix 1103 TEKPROBETM Power Supply. The 1103 has dual TEKPROBpM inputs, dual BNC signal outputs, and dual voltage offset on/off switches and potentiometers.

Luminex GigaCore 14R和16Xt RPSU商品说明书

Luminex GigaCore 14R和16Xt RPSU商品说明书

GigaCore RPSU Quick Start Guide Document lu_01_00054_qsg Copyright © 2002-2015 .All rights reserved.No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, without the prior written permission of Luminex.The information in this documentation is supplied without warranty of any kind, either directly or indirectly, and is subject to change without prior written notice. Luminex, its employees or appointed representatives will not be held responsible for any damages to software, hardware, or data, howsoever arising as a direct or indirect result of the product(s) mentioned herein.Issued by:Publications Department,Luminex LCE, Berkenlaan 8A, Hechtel Eksel, B-3940, Belgium.Documentation last reviewed 27 February 2015 by Luminex LCE.Printed in the EU.Table of Content■Safety Instructions 3 ■Compliance information 4 ■Warranty information 5 ■Registration 5 ■In the box5■Description 6 ■Starting 8 ■Wiring 8■Additional documentation103Safety Instructions■Read Instructions - All the safety and operating instructions should be read before the appliance is operated.■Retain Instructions - The safety and operating instructions should be retained for future reference. ■Heed Warnings - All warnings on the appliance in the operating instructions should be adhered to.■Follow Instructions - All operating and user instructions should be followed.■Water and Moisture - The appliance should not be used near water; for example, near a fountain, or submitted to direct water exposure.■The apparatus shall not be exposed to dripping or splashing liquids and no objects filled with liquids, such as bottles, shall be placed on the apparatus. Do not touch the appliance with wet hands. Do not handle the appliance or power cord with wet or damp hands. If water or any other liquid enters the appliance cabinet, take it to qualified service personnel for inspection.■Cleaning - The appliance should be cleaned only as recommended by the manufacturer. From time to time you should wipe off the front and side panels and the enclosure with a soft cloth. Do not use rough material, thinners, alcohol or other chemical solvents or cloths since this may damage the finish or remove the panel lettering. ■Ventilation - The appliance should be situated so that its location or position does not interfere with its proper ventilation. Place the unit in a well-ventilated location, leaving at least 5 cm (2 inches) of clearance on front, side and rear of unit for air flow. If ventilation is blocked, the unit may overheat and malfunction.■Heat - The appliance should be situated away from heat sources such as radiators or heating systems. ■Power Cord Protection - Power supply cords should be routed so that they are not likely to be walked on or pinched by items placed upon or against them, paying particular attention to cords at plugs, receptacles, and the point where they exit from the appliance.■Power Sources - The appliance should be connected to a power supply only of the type described in the operating instructions or as marked on the appliance. ■Attachments / Options - Only use attachments/options specified by the manufacturer.■Object and Liquid Entry - Care should be taken so that objects do not fall and liquids are not spilled into the enclosure through the openings.■Servicing - The user should not attempt to service the appliance beyond that described in the operating instructions. All other servicing should be referred to qualified service personnel.■Damage Requiring Service - The appliance should be serviced by qualified service personnel when: A. The power supply cord or the inlet has been damaged; B. Objects have fallen, liquid has been spilled into the appliance; C. The appliance has been exposed to rain; or D. The appliance does not appear to operate normally; or E. The appliance has been dropped or the enclosure is damaged.■The equipment shall be used at a maximum ambient temperature of 50° C / 140° F.WARNING : TO REDUCE THE RISK OF FIRE OR ELECTRIC SHOCK, DO NOT EXPOSE THIS APPLIANCE TO RAIN OR MOISTURE.CAUTION : TO REDUCE THE RISK OF ELECTRIC SHOCK, DO NOT REMOVE THE COVER. NO USER SERVICEABLE PARTS INSIDE. REFER SERVICING TO QUALIFIED SERVICE PERSONNEL.The lightning flash with arrowhead symbol, within an equilateral triangle, is intended to alert the user to the presence of uninsulated “dangerous voltage” within the product’s enclosure that may be of sufficientmagnitude to constitute a risk of electric shock to persons.The exclamation point within anequilateral triangle is intended to alert the user to the presence of important operating and maintenance (servicing) instructions in the literature accompanying the appliance.Disposal of Waste Equipment by users in the European UnionThis symbol on the product or its packaging indicates that this product must not be disposed ofwith other waste. Instead, it is your responsibility to dispose of your waste equipment by handing itover to a designated collection point for the recycling of waste electrical and electronic equipment.The separate collectionand recycling of your waste equipment at the time of disposal will help conserve natural resourcesand ensure that it is recycled in a manner that protects human health and the environment. Formore information about where you can drop off your waste equipment for recycling, pleasecontact your local city recycling office or the dealer from whom you purchased the product.EMC (Electromagnetic Compliance)This model GigaCore RPSU complies with the following standards regulating interference and EMC:• EN 55022• EN 55024CE Compliance (EMC and Safety)Luminex is authorized to apply the CE mark on this compliant equipment thereby declaringconformity to EMC Directive 2004/108/EC and Low Voltage Directive 2006/95/EC.4Limited warrantyUnless otherwise stated, your product is covered by a two (2) years parts and labor limited warranty. It is the owner’s responsibility to furnish receipts or invoices for verification of purchase, date, and dealer or distributor. If purchase date cannot be provided, date of manufacture will be used to determine warranty period.Returning under warrantyAny Product unit or parts returned to Luminex LCE must be packaged in a suitable manner to ensure the protectionof such product unit or parts, and such package shall be clearly and prominently marked to indicate that the package contains returned product units or parts. Accompany all returned product units or parts with a written explanation of the alleged problem or malfunction.FreightAll shipping will be paid by the purchaser. Items under warranty shall have return shipping paid by the manufacturer only in the European Union.Under no circumstances will freight collect shipments be accepted. Prepaid shipping does not include rush expediting such as air freight. Air freight can be sent customer collect in the European Union.Warranty is void if the product is misused, damaged, modified in any way, or for unauthorized repairs or parts.RegistrationUse your favorite web browser, and visit http://www.luminex.be/support.php?show=registrationto register your product online.By registering, you become eligible to receive the following:■Technical support information■Software update and upgrade notices■Hardware warranty informationIn the box1 x GigaCore RPSU1 x Quick Start Guide ( including warranty information and safety instructions).4 x 1 meter Molex Micro-Fit 6 pins cable (LU 90 00879)5DescriptionThe GigaCore RPSU is able to monitor two GigaCore Ethernet switches (14R and 16Xt model) at a time. In the unlikely event one of the switch’s power supply fails, the unit will deliver power, seamlessly. The unit can backup both power and power over Ethernet supplies.Please bear in mind the unit can only deliver power or power over Ethernet to one unit a a time.Front panelLED indication for redundant PoE supply status- PoE 1- PoE 2LED indication for redundant power supply status- PSU1- PSU2■2 x LED for backup power over Ethernet supply status (PoE 1 and PoE 2)■2 x LED for backup power supply status (PoE 1 and PoE 2)6Output connectors for backup power supply Output connectors forbackup power overEthernet supply7IEC socket for mains inputFan Rear panel■1 x IEC socket for power input■1 x Fan■2 x Molex output connectors for redundant power supply■2 x Molex output connectors for redundant power over Ethernet supply8The GigaCore RPSU should be located in the same rack where the GigaCore switches to protect are installed.The RPSU is fitted with four 1 meter 6 ways MICRO-FIT Molex cables. In the case the distance between the RPSU and the connected switch to protect is less than one meter, best is to correctly roll the cable to prevent of heating issue.StartingWiringThe device operates with an AC voltage between 100V and 240VAC within a frequency range of 50Hz to 60Hz.An IEC socket is located at the rear of the unit. Please use an IEC plug compliant cable to feed power to the unit.Luminex recommends the use of a power cable, fitted with a locking mechanism to ensure a reliable connection to the device. Luminex also recommends to use power cable in accordance with the standards and the relevant authorities of your country.!!! WARNING: TO ENSURE A TOTAL PROTECTION, THIS EQUIPMENT MUST BEEARTHED !!!Backup PSU Backup PoEGigaCore 14RGigaCore 16XtGigaCore RPSUAbove illustration : wiring exampleLEDStatus MeaningPoE 1GreenUnit is active, ready to sourceRed Unit connected to this port has a failed power over Ethernet supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source PoE 2Green Unit is active, ready to sourceRed Unit connected to this port has a failed power over Ethernet supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source PSU 1Green Unit is active, ready to sourceRed Unit connected to this port has a failed power supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source PSU 2Green Unit is active, ready to sourceRed Unit connected to this port has a failed power supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source9The LED indicators of the GigaCore RPSU includes power and power over Ethernet supplies status. The following shows the LED indicators for the GigaCore RPSU along with an explanation of each indicator.10Luminex LCE operates a policy of continuous development. Luminex LCE reserves the right to make changes andimprovements to any of the products described in this document above without prior notice. Specifications are subject to change without notice.Power InputPhysicalPower Input100-240VAC - 50/60Hz 2.7A - 1.2AEnclosureMetal Housing Dimensions (W x D x H)482 x 183 x 44 mm 19” x 17.4” x 1.73”Power OutputPackaging 520 x 235 x 50 mm 20.47” x 9.25” x 1.96”PSU output 2 x 15VDC / 2.7A on Molex Micro-Fit 6 pins connector Weight2.7KgPOE supply output 2 x 48VDC / 4.2A on Molex Micro-Fit 6 pins connectorApprovalsEnvironmentalCE P Operating Temperature 0 to + 50°C EN 55022P Storage temperature -10 to +70°C EN 55024P Humidity5 to 95 % RHRoHS Compliance PAdditional documentationAll additional documenttion can be downloaded from our web pages in the support section :http://www.luminex.be--> Support11。

Annex02

Annex02

Page 2 of 4 N885-13GB / 04.05ATTENTIONATTENTIONATTENTIONN885-13GB / 04.05 Page 3 of 4Alkaline Alkaline German English French earths ions earths ions hardnessppm hardness hardness mmol/lmval/l °d CaCO 3°e °f 1 mmol/l Alkaline earths ions 1,002,005,60100,007,0210,001 mval/l Alkaline earths ions 0,501,002,8050,003,515,001 German hardness 0,180,3571,0017,801,251,781 ppm CaCO 30,010,0200,0561,000,07020,101 English hardness 0,140,2850,79814,301,001,431 French hardness0,100,2000,56010,000,7021,00Conversion table:3Faults and their eliminationFaults can be detected in the following ways, for instance:●Variances from the allowed limits ●Rusty or silted cooling water ●Incrustation (e.g.lime deposits)●Pitting●Destruction of naturally formed protective layers.The underlying causes are often difficult to find.Various reactions are feasible depending on the cooling system itself, the materials contacting water, the cooling water temperature, pH value and the concentrations of the dissolved substances.The services of a specialist company for water treatment should be enlisted for those malfunctions which cannot be dealt with quickly.The ALD Vacuum Technologies AG project manager responsible for your plant is always available for consultation.4Cooling systems and their influence on the cooling waterThe facility's cooling water inlet and outlet are to be connected to the factory's cooling system.The facility is designed for non-pressurized outlet.Should backpressure be expected or the connection to a closed-circuit cooling system be planned the express consent of the facility vendor is required.It must have been clearly stipulated in the request to tender.The individual cooling circuits, the available monitoring systems and the inlet temperature, pressure and volume are shown in the cooling water diagram of the facility.4.1Fresh Water Once-through CoolingThe fresh, cold water flows directly through the facility's cooling circuits.The heated cooling water flows away into the sewage system without recooling.Water consumption is quite substantial and effective conditioning is difficult.The fresh water once-through cooling system must be examined continuously for corrosion and incrustation (e.g.lime deposits = poor heat conductivity), and be cleaned chemically whenever necessary .4.2Open-circuit Cooling SystemCooling water is recooled in an open-circuit installation such as a cooling tower.Part of the water is allowed to evaporate, thereby removing an adequate amount of thermal energy from the remain-ing cooling water.As a consequence of this process, the dissolved salts within the cooling water are concentrated further – drastically increasing its corrosiveness;any remaining free carbon dioxide tends to be driven out, while the oxygen content approaches the saturation level.Moreover, the residual calcium hydrogen carbonate (carbonate hardness) decomposes under the influence of warming and continued loss of carbon dioxide – into almost insoluble calcium carbonate (scale), leading to incrustation.As a result, the compulsory safeguard actions for open-circuit cooling systems include permanent monitoring of the permissible salt content, coupled with the administration of corrosion inhibitors,hardness stabilizers and biocides.All cooling water characteristics must also be controlled regularly.Page 4 of 4 N885-13GB / 04.054.3Quasi Closed-circuit Cooling SystemThe cooling water gives off a fraction of the absorbed thermal energy to a heat exchanger, flowing first through a minimal aerated equalization tank before returning to the system inlet.Only negli-gible water evaporation results.Incrustations are minimal and directly proportional to the volume of replenished cooling water.Oxygen can diffuse continuously into the cooling system water over the equalization tank, its concentration approaching the saturation level.Fouling caused by organic material can occur and lead to a build up of deposits.High salt concentrations, dissimilar metal parts and an unfavorable pH value promote internal corrosion processes.The quasi closed-circuit cooling system requires an effective inhibitor for corrosion protection.4.4Closed-circuit Cooling SystemThis cooling system is hermetically sealed and conveys the absorbed thermal energy to a heat exchanger.Thermal expansion of the cooling water is compensated over a diaphragm pressure ves-sel.Cooling water loss does not occur.The employment of pressurized closed-circuit cooling systems with double-walled vacuum instal-lations increases investment costs appreciably, as the inner wall of the vessel must be sufficiently reinforced to withstand the cooling system operating pressure.Using this system incrustation (lime deposit) is effectively stopped.Never the less, a yearly preventive maintenance check of the system using a water analysis is recommended to eliminate the risks of corrosion.。

Annexin V凋亡检测常见问题盘点

Annexin V凋亡检测常见问题盘点

Annexin V凋亡检测常见问题盘点Annexin V是一种分子量约35kDa的钙依赖性磷脂结合蛋白。

可与细胞膜中的磷脂酰丝氨酸(PS)高亲和力特异性结合,是检测细胞凋亡的最常用的试剂之一。

AnnexinⅤ偶联FITC、EGFP 等荧光标记,并与膜不通透型DNA荧光染料PI(碘化丙啶)或7-AAD(7-氨基放线菌素D)联用可以区分早期凋亡与晚期凋亡或坏死细胞。

本文中,小尚总结了Annexin V凋亡检测常见的一些问题,帮助大家做出更准确的实验结果。

Q染色时间是多长?A通常为室温避光染色10-15min,染色时间过长并不会显著增加染色强度,反而可能因为长时间室温及不适宜细胞存活的染色环境导致假阳性影响实验稳定性。

Q染色后怎么处理数据?A荧光显微镜下可以配合细胞计数板,对活细胞、凋亡前期细胞、凋亡后期及死细胞进行分别计数,计算各部分细胞的比例。

流式则可以根据软件自带的系统分析各部分细胞比例。

Q染色后怎么区分凋亡前期与后期的细胞?A以Annexin V-FITC/PI双染为例,凋亡前期的细胞只带FITC荧光,凋亡后期及坏死细胞除FITC 荧光外还会带PI荧光,从流式和荧光显微镜结果来看的话见下图示例:左图:SF9细胞(SNL-170)高密度培养24h后通过Annexin V-FITC染色检测,采用荧光显微镜观察(白光+FITC荧光+PI荧光三色合成图片),无荧光为正常细胞,FITC荧光(绿色)为凋亡早期细胞,FITC荧光(绿色)+PI荧光(红色)为凋亡后期或死细胞。

右图:Jurkat 细胞用5μM 喜树碱处理4h后通过Annexin V-FITC染色检测,采用流式细胞仪检测,左下分区(无荧光)为正常细胞,右下分区(FITC荧光)为凋亡前期细胞,右上分区(FITC+PI荧光)为凋亡后期或死细胞。

Q染色后样本检测无荧光怎么办?A首先检查各试剂是否在有效期内,是否正确使用各组分,仪器是否正常工作;其次可以配合台盼蓝染色检查细胞样本本身是否死亡偏少,若确实偏少可以调整药物处理浓度和时间;最后可以提高染色液浓度2倍对样本再次进行染色。

AOI性能比较

AOI性能比较

Refow
Orbotech S22
18um,25um,29um 相同 56 X 42 mm 1 um 光學頭 + 軌道(Read on the fly) 3~4 sec 1.5sec左右(1sec-1.7sec) Up to 60cm^2/Sec 60 cm2 500mm X 380mm 90mm 90mm ±10 mm 所有的晶片元件(01005)及最小至 0.3mm fine pitch 3D Z轴自动补偿 1110x1290x1397 4M digital Camera Directional Flash 自動進出板和寬度調整控制系統; 與SMEMA相容 1. 先進的3D檢測技朮﹔ 2. 檢測速度快﹔ 1. 機台硬件性能不穩定﹔ 2. 機台軟件反應緩慢﹔
After Print
TRI TR7006
12um,16um, 20um 相同 Line Scan方式測試 1um 光學頭(Read on the fly) 2~3 sec 同步處理,不需令花時間 Line Scan方式測試 12345600个Pixcel 330mm X 280mm/510mm X 460mm 65mm 65mm ± 4mm 01005元件 3D Z軸自動上下移動補償 (硬件) + 彎補償 (軟件) 1000x940x2100mm CCD 鐳射光 PLC control
OMRON VP3000
8um,12um, 18um 相同 30 mm X 23 mm 1um 光學頭 + 軌道(Read on the fly) 2~3 sec 0.25 sec 0.25 s / 窗 1600 mm2 330mm X 250mm 15mm 40mm ± 3m件) + 彎補償 (軟件) 700x830x2000mm 彩色 3 CCD 攝像頭 LED 光源 PLC control 2. 高精 3. 真實彩 自動板

Tektronix P6205 Active FET Probe 数据手册说明书

Tektronix P6205 Active FET Probe 数据手册说明书

P6205Active FET ProbeP6205 DatasheetThe P6205 probe is part of Tektronix' line of Low Circuit Loading Signal Acquisition probes for CSA (Communications Signal Analyzers), DSA (Digitizing Signal Analyzers), 11000 Series and the TDS family of oscilloscopes.Key featuresDC to 750 MHz 2 pF Input C 1 MΩ Input RIntegral Probe Power TekProbe ™ BNC High-speed Digital Systems DesignECL GaAsMOS: CMOS; FastCMOS; BiCMOS; TTL Component Design/CharacterizationAmplitude Levels AberrationsPropagation Delay and Timing Bandwidths and Rise TimesEducational ResearchManufacturing Engineering and TestActive FET probes for TekProbe ™ BNC interfaceThe P6205 is designed with FET devices for its inputs, which allows very high input resistance values and low input capacitances.Both Active FET probes provide a wide linear dynamic input range for accessing most digital device families using today's logic voltage levels.Power for the P6205 is supplied by the CSA, DSA, TDS and 11000 Series mainframes through the TekProbe BNC Interface, eliminating the need for extra cabling and/or external power supplies.Probe information such as type, serial number, attenuation factor, offset scale factor, input resistance, and termination resistance required is communicated through the TekProbe interface between the Active Probe and the CSA, DSA, and 11000 Series mainframes. This information is used by these oscilloscope mainframes during the initialization sequence and measurement analysis.BenefitsLow Input C, High Input R - Minimizes circuit under test loading Probe Power Directly from CSA, DSA, TDS, or 11000 SeriesTekProbe ™ BNC Interfaces - Means no additional cables or power supplies requiredReadout Coding for 10X Attenuation - Reduces confusion and errors in measurement readingsGold-plated Replaceable Probe Tips - Improved electrical connections and lower maintenance costsMiniature Size Accessories - Provides wide range of circuit attachmentsUL Listed - UL 1244DatasheetSpecificationsAll specifications apply to all models unless noted otherwise.Warranted electrical characteristicsAttenuation10XNominal electrical characteristicsCable length 1.5 m (60 in) tip to BNCBandwidth at -3 dB750 MHzInput capacitance 2 pFInput resistance 1 MΩLinear dynamic range±10 VDC offset range NAMaximum input voltage±40 V (DC + peak AC)Interface/Readout/Identity TekProbe™ BNC / Yes / NoRecommended instruments 111000 2, TDS400, TDS500, TDS600, TDS700, TDS3000, TDS5000, TDS70001The P6205 also works with other instruments with appropriate adapters. Please visit /probes for more details.21100 Series = 11A32/11A34/11A52/11A71/11A72/11A812 Ordering informationStandard accessoriesP6205 10x, 750 MHz active FET probe013-0107-xx Retractable hook tip196-3120-xx 6 in. ground lead with alligator196-3198-xx 6 in. ground lead with square-pin receptacle214-4125-xx Ground contact, spring206-0569-xx SMT KlipChip™ adapter166-0404-xx Insulating ground cover015-0201-xx IC test tip016-0156-xx Carrying case070-8202-xx Instruction manualWarrantyOne-year warranty covering all parts and labor.Recommended accessoriesPlease see 5 mm Probe Accessories (miniature) probe system at /datasheet/probe-accessories-2Tektronix is registered to ISO 9001 and ISO 14001 by SRI Quality System Registrar.P6205 Datasheet 3DatasheetASEAN / Australasia (65) 6356 3900 Austria 00800 2255 4835*Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777 Belgium 00800 2255 4835*Brazil +55 (11) 3759 7627 Canada180****9200Central East Europe and the Baltics +41 52 675 3777 Central Europe & Greece +41 52 675 3777 Denmark +45 80 88 1401Finland +41 52 675 3777 France 00800 2255 4835*Germany 00800 2255 4835*Hong Kong 400 820 5835 India 000 800 650 1835 Italy 00800 2255 4835*Japan 81 (3) 6714 3010 Luxembourg +41 52 675 3777 Mexico, Central/South America & Caribbean 52 (55) 56 04 50 90Middle East, Asia, and North Africa +41 52 675 3777 The Netherlands 00800 2255 4835*Norway 800 16098People's Republic of China 400 820 5835 Poland +41 52 675 3777 Portugal 80 08 12370Republic of Korea 001 800 8255 2835 Russia & CIS +7 (495) 6647564 South Africa +41 52 675 3777Spain 00800 2255 4835*Sweden 00800 2255 4835*Switzerland 00800 2255 4835*Taiwan 886 (2) 2722 9622 United Kingdom & Ireland 00800 2255 4835*USA180****9200* European toll-free number. If not accessible, call: +41 52 675 3777 Updated 10 April 2013 For Further Information. Tektronix maintains a comprehensive, constantly expanding collection of application notes, technical briefs and other resources to help engineers working on the cutting edge of technology. Please visit . Copyright © Tektronix, Inc. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specification and pricechange privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade names referenced are the service marks, trademarks, or registered trademarks of their respective companies.19 Apr 201360W-14842-2 P6205。

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© World Health OrganizationWHO Technical Report Series, No. 917, 2003Annex 5Guidelines for preparing a laboratoryinformation fileA laboratory information file (LIF) is a document prepared by thelaboratory. It contains specific and factual information about the operations carried out at the named site and any closely integrated operations of the laboratory. If only some of the operations are car-ried out on the site, the LIF need describe only those operations, e.g.sampling, chemical analysis or stability testing. The LIF does not include information specific to environmental management, occupa-tional health and safety management, financial management or risk management.A LIF should be succinct and, if possible, should not exceed 25 A4pages.The laboratory should give a short description of its activities under each of the following headings. Where appropriate, supportive docu-mentation should be appended.1.General information1.1Brief information on the laboratory (including name, address andcontact details).1.2Summary of laboratory activities (including those listed below).Activity Performed by Contracted to:laboratory(give name and address)itself (mark X)Conventionalchemical analysisInstrumentalanalysisMicrobiologicalanalysisBiological testingStability testing891.3Any other activities carried out on site. In addition, state therelation (if any) to a manufacturing site.1.4Short description of the quality management system of the labo-ratory (including reference to the existence or not of a quality manual). (Include reference here regarding certification e.g. ISO 17025.)2.Documentation and quality assurance systems2.1Brief description of the procedures for the preparation, revisionand distribution of necessary documentation for specifications, stan-dard test procedures, analyst workbooks or worksheets.2.2Brief description of any other documentation related to producttesting, including reports, records, arrangements for the handling of results (including laboratory information management systems (LIMS) where used).2.3Procedures for release of certificates and analytical reports, stan-dard operating procedures, etc.2.4Brief description of general policy for validation of analyticalmethods.3.Personnel3.1Number of employees engaged in the following activities:Activity NumberSupervisorsAnalystsTechniciansMicrobiologistsOtherTotal:3.2Organization chart showing the arrangements, responsibilitiesand reporting lines in the laboratory.3.3Qualifications, experience and responsibilities of key personnel.3.4Outline of arrangements for basic and in-service training and howrecords are maintained.904.Handling of samples4.1Brief description of general policy for sampling and handling ofsamples.4.2Brief description of the procedures followed. Where possible,flow sheets and charts describing important steps, pooling of samples, storage, work allocation in the laboratory and related aspects should be supplied.5.Materials5.1Brief description of general policy for purchasing and handling ofmaterials including chemicals and reagents, and handling of waste.5.2Brief description of the arrangements for the storage of materialsincluding retention samples, toxic substances and poisons.5.3Brief description of the system for purchasing, preparation, han-dling and testing of reference materials.6.Premises6.1Simple plan or description of the layout of the laboratory areaswith an indication of scale (architectural or engineering drawings not required, but photographs may be submitted if available).6.2Nature of construction and finishes.6.3Brief description of ventilation systems including those for micro-biological testing areas, storage areas, etc. (Include reference to air circulation and to control of temperature and relative humidity.)6.4Brief description of special areas for the handling of highly toxic,hazardous, and sensitizing materials.6.5Description of planned programmes for preventive maintenanceof the premises and the system for recording maintenance activities.Sanitation6.6Brief description of the procedures for cleaning of areas andequipment.Storage6.7Types of products stored on the site, and information about anyspecifically toxic or hazardous substances handled.6.8Short description of the site (size, location, and immediate envi-ronment and other activities conducted on the site).917.1Brief description of main equipment used in the laboratory. At-tach a list of equipment in use, in table form, indicating the equipment and its make and model.7.2Brief description of planned programme for the preventive main-tenance of equipment and the system for recording the maintenance activities.7.3Brief description of qualification (e.g. installation qualification(IQ), operational qualification (OQ) and performance qualification (PQ)) as well as calibration, including the recording system.7.4Brief description of computer system, access to data, data integ-rity management and validation of the computer system.8.Contract operations and activities8.1List of activities contracted out to other laboratories, includingnames, addresses and contact details. Description of the way in which the compliance with standards for activities contracted out is assessed.9.Out-of-specification investigation9.1Brief description of the procedure for recording and investigationof out-of-specification results.10.Self-inspection10.1Brief description of the self-inspection procedure.11.Stability testing (where applicable)11.1Brief description of the stability-testing procedure.11.2Brief description of the conditions under which samples arekept, the arrangements for monitoring and the equipment used.12.Microbiological testing(where applicable)12.1Brief description of the activities for microbiological testing.12.2Brief description of preparation of media and types of mediaused.12.3Brief description of the procedure in place for positive andnegative controls.12.4Brief description of validation policy.12.5Brief description of arrangements for waste disposal.9213.Water system13.1Brief description of the water system in the laboratory.13.2Brief description of arrangements for the sampling and testing ofwater used in the laboratory.93。

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