Dynamic Redesign of a Flow Control Servovalve Using a Pressure Control Pilot
管理学词汇中英文对照
管理学词汇中英文对照Accountability 责任感Achievement-oriented leadership 成就取向型领导Activity ratio 活动比率Adaptive organization (horizontal corporation) 自适应组织Administrative management 行政管理Affiliation needs 归属的需要Aggregate planning 综合计划Alternative courses of action 可供选择的行动Artifacts 人工环境Assessment center 评价中心Assets 资产Attitudes 态度Authority 职权Autonomy 自治Balance sheet 资产负债表BCG matrix 波士顿咨询集团矩阵Behavior modification 行为修正Behavioral approach 行为法Behavioral decision model 行为决策模型Boundary-spanning roles 跨界角色Bounded rationality 有限理性Brainstorming 头脑风暴法Breakeven analysis 头脑风暴法Budgets 预算Bureaucratic control 官僚控制Bureaucratic management 官僚管理Business ethics 商业道德Business portfolio matrix 商业资产组合矩阵Business strategy 商业策略Cash cows 金钱牛Chain of command 指挥链Changing 变革Charismatic authority 魅力权威模式Classical perspective 古典管理理论Closed system 封闭系统Code of ethics 伦理规范Coercive power 强制力Cohesiveness 凝聚力Communication 沟通Communication network 沟通网Compensation 报酬Competitive advantage 竞争优势Computer-aided software engineering (CASE) 计算机辅助设计Conceptual skill 概念能力Concurrent control 并行控制Constraints 强制,约束Contingency approaches 随即制宜法Contingency perspective 权变观Contingency planning 随即计划Continuous schedule of reinforcement 连续性奖励Continuous-flow production system 连续生产系统controlling 控制职能Controls 控制Corporate social responsibility 公司社会责任Corporate strategy 公司战略Cost leadership strategy 成本领先战略Current assets 流动资产Current liabilities 流动负债Customer divisional structure 消费者多样化结构Data 数据Debt ratios 负债比率Decision making 决策Decision support system (DSS) 决策制定系统Decision tree 决策树(体系)Decision varialbes 决策变量decisional roles 决策角色Decoding 解码Delegation 授权Delphi technique 魔鬼提倡法Devil's advocacy 唱反调的人Dialectical inquiry 辩证探求法Differention strategy 差异化战略Directive leadership 指示领导Diversity 多样化Divisional structure 部门是结构Dogs 瘦狗Downward communication 下行沟通Dynamic network 动态网络Economic feasibility 经济可行性Effectiveness 效果Efficiency 效率Electronic data interchange (EDI) EDI电子数据交换Electronic funds transfer (EFT) 电子资金转换Electronic mail (e-mail) 电子邮件Employee assistance programs (EAPs) 员工辅助项目顾问Employee-centered work redesign 员工工作再设计Employment test 就业测试Empowering employees 职工授权Encoding 编码End users 终极用户Entropy 衰退趋势Escalation of commitment 递增效忠Esteem needs 尊重的需要Ethical behavior 道德表现Ethical dilemma 伦理困境Ethics 伦理Expectancy 期望Expected monetary value (EMV) 预期货币价值Expected value 预期价值Expert power 专家权力Expert system 专家系统External communication 外部环境External customer 外部顾客External forces 外部力量Extinction 废止Feedback 反馈Feedback 反馈Feedback 反馈Feedback (corrective) control 反馈校正控制Feedback controls 反馈控制Feedforward (preventive) control 前馈预防控制Feedforward controls 前馈控制Fixed assets 固定资产Fixed-interval schedule 定时给奖Fixed-position layout 定位式布置Fixed-ratio schedule 定比给奖Focus strategy 集中战略Force-field analysis 立场分析Formal groups 正式群体Functional manager 职能管理者Functional strategy 职能管理者Functional structure 职能式战略GE matrix 职能式结构General environment 一般环境General manager 总经理Generic strategies 一般性策略Geographic divisional structure 全球多样化战略Global strategy 全球化战略Goal setting 目标结构Goals 目标Grand strategy 主战略Grapevine 藤状网络式沟通Group 群体Groupthink 群体思想Groupware 群件Halo-and-horn effect 月晕效应Hawthorne effect 关注作用Human resource information systems (HRISs) 人力资源信息系统Human resource management 人力资源管理Human resource planning 人力资源计划Human rights approach 人权方法Human skills 人工技巧Hybrid layout 混合式布置Hygiene factors 保健因素hyperchange 极度改变Income statement 损益表Informal groups 非正式群体Information 信息Information overload 信息过量Information power 信息权力Information technology 信息技术Informational roles 信息角色Inputs 投入Instrumental values 工具价值Instrumentality 媒介;工具;手段Intangible costs 无形成本Integrating mechanisms 结合机制Interdependence 互相依赖Internal customer 内部顾客Internal forces 内力Internal network 内部网络Interpersonal roles 人际交往能力Intuition 直觉Jargon 行话Job analysis 工作分析;工种分析Job depth 工作深度Job description 工作说明Job description 工作说明Job design 工作设计Job enlargement 工作扩大化Job enrichment 工作丰富化Job rotation 岗位轮换Job satisfaction 工作满意Job scope 工作丰富化Job specifications 工作规范;操作规程Job-shop production system 职务专业化Justice approach 公正合理观Just-in-time (JIT) inventory management 及时存货系统Labor-management relations 劳工管理关系Language systems and metaphors 语言习惯Lateral communication 横向沟通Law of effect 效应法则Law of requisite variety 必要多样性定律Leadership 领导Leadership substitutes 领导替代leading 领导Least preferred coworker (LPC)scale 最不喜欢的同事Legitimate power 法定权利Liabilities 负债Line personnel 线形人事管理Liquidity ratios 流动率Local-area network (LAN) 局域网Locus of control 控制点Locus of decision making 局域网Long-term liabilities 长期债务Machiavellian personality 马基雅弗利人格理论Management 管理Management by exception 例外管理Management by objectives (MBO) 目标管理责任制Management information system (MIS) 信息管理系统Managers 经理Master production schedule 主生产排程Matket growth rate 市场增长率Matrix structure 矩阵结构Mechanistic systems 机械式组织Medium 载体Messages 消息Motivation 激励Motivator factors 激励因素Multidomestic strategy 多元化策略Myths 虚构的故事Need for achievement 成就需要Negative reinforcement 消极强化Network structure 网络结构Noise 噪声Nominal group technique (NGT) 名义群体技术Nonprogrammed decision 非程序化决策Nonverbal communicationa 非语言沟通Norms 标准;规范;典范;限额Objectives 目标Objectives function 目标函数Open system 开放系统Operational feasibility 造作可行性Operational plan 作业计划Operational planing 作业计划职能Opportunity 机遇Oral communication 口头交流Organic (clan) control 有机控制Organic system 有机系统organization 组织安排Organizational change 组织变革Organizational control 组织控制Organizational culture 组织文化Organizational design 住址决策Organizational development (OD) 组织发展Organizational feasibility 组织可行性Organizational mission 组织使命Organizational structure 组织结构Organizing 组织Orientation 定位Outputs 产出Owner's equity 所有者权益Partial schedule of reinforcement 间断性奖励Participative leadership 参与型领导Participative management 参与管理Path-goal model 途径-目标模型Payoff table 决定(因素)表;结算表;成果表Payoffs 发工资Performance appraisal 绩效考评Personality 性格PERT(program Evaluation and review technique) 计划审评技术Physiological needs 生理的需要Plan 计划planning 计划,部署Policies 政策Pooled interdependence 共有相互依存Positive reinforcement 正强化Power 权利Problem 问题Procedures 程序Process consultation 过程咨询Process layout 工艺式布置Product divisional structure 生产部门式结构Product layout 产品式布置Productivity 生产力Profitability ratios 收益比率Programmed decision 程序化决策Programs 规划Project production system 工程生产系统Projects 项目Protected class 受保护一类Punishment 惩罚Quality assurance 质量保证Quality circle QC小组Quality control 质量管理;质量控制Quality management 质量管理Question marks 问号Rational-economic decision model 理性经济决策模型Rational-legal authority 法理权威模式Reciprocal interdependence 交互性的互赖性Recruitment 招聘Reengineering 工程再造Referent power 指示权力Refreezing 再冻结阶段Relationship orientation 关系导向Relationship-orientation roles 关系导向角色Relative market share 相关市场份额Repetitive, assembly-line, or mass-production system 重复性、流水线、大量生产系统Responsibility 职责Restraining forces 阻力Reward power 奖励权力Rites 仪式Robotics 机器人技术Roles 任务,角色Rules 规则Satisficing 满意性Scalar principle 等级原则Schedules of reinforcement 强化时间表Scientific management 科学管理Security needs 安全的需要Selection 选拔Selective perception 选择性理解Self-actualization needs 自我实现需要Self-esteem 自尊Self-management teams 自我管理小组Self-management teams 自我管理小组Self-monitoring 自我控制Self-oriented roles 自我取向角色Sequential interdependence 顺序式互赖Sexual harassment 性骚扰Single-use plans 一次性计划Skill vareity 多种技能SLT model 情境领导模型Social context 社会关联性Span of control 控制幅度,管理幅度Special-purpose team 特殊目标小组Stable environment 环境稳定Stable network 稳固网络Staff personnel 员工人事管理Staffing 人员雇佣;职工配备Stakeholders 利益相关者Standing plans 长设计划Stars 明星States of nature 自然状态Stereotyping 典型化Stories 事迹Strategic analysis 战略分析Strategic control 战略控制Strategic decision-making matrix 战略决策矩阵Strategic goals 战略目标Strategic plan 战略计划Strategic plan 战略计划Strategic planning 战略计划职能Strategic planning 战略计划职能Strategy formulation 战略制定Strategy Implementation 战略实施Supportive leadership 支持型领导Survey feedback 调查反馈Synergy 共同作用Systems analysis 系统分析Systems development life cycle (SDLC) 发展周期系统Tangible costs 可收回成本Task environment 任务环境Task identity 任务说明Task orientation 任务导向型Task significance 任务重要性Task-oriented roles 任务导向型角色Team building 团队建设Technical feasibility 技术可行性Technical skills 技术技能Telecommuting 远程办公Terminal values 终极价值Theory X (管理)X理论Theory Y (管理)Y理论Theory Z (管理)Z理论Total quality management (TQM) TQM全面质量管理Total quality management (TQM) TQM全面质量管理Traditional authority 传统权威模式Training 培训Trait approach 特征途径Transactional leadership 执行性领导Transformation process 变革过程Turbulent environments 动荡环境Type A orientation A型意向者Type B orientation B型意向者Unfreezing 解冻Unity of command 统一指挥Upward communication 上行沟通Utility approach 功利主义观Valence 效价Validity 效度Values 价值Variable-ratio schedule 变动比率增时制Variance reporting 视频会议Videoconferencing 视频会议Vigilance 警戒Whistleblower 揭发Wide-area network (WAN) 局域网Written communication 笔头交流。
管理英语专业词汇
管理学英语专业词汇Aaccess discrimination 进入歧视action research 动作研究adjourning 解散adhocracy 特别结构administrative principle 管理原则artifacts 人工环境artificial intelligence 人工智能工巧匠avoiding learning 规避性学习ambidextrous approach 双管齐下策略Bbalance sheet 资产负债表bcg matrix 波士顿咨询集团矩阵bona fide occupation qualificationѕ善意职业资格审查bounded rationality 有限理性 bureaucracy 官僚机构benchmarking 标杆瞄准 bounded rationality perspective 有限理性方法boundary-spanning roles 跨超边界作用Ccomputer-aided design and computer-automated manufacturing(cad/cam)计算机辅助设计与计算机自动生产confrontation 对话consortia 企业联合change agent 变革促进者chaos theory 混沌理论chariѕmatic leaders 魅力型领导者charity principle 博爱原则coercive power 强制权cohesiveness 凝聚力collaborative management 合作型管理comparable worth 可比较价值competitive benchmarking 竞争性基准confrontation meeting 碰头会constancy of purpose 永久性目标contingency approach 权变理论corporate social performance 公司社会表现corporate social responsibility公司社会责任corporate social responsiveness公司社会反应critical incident 关键事件current assets 流动资产current liabilities 流动负债culture strength 文化强度creative department 创造性部门craft technology 技艺性技术contextual dimension 关联性维度continuous process production 连续加工生产collectivity stage 集体化阶段clan control 小团体控制clan culture 小团体文化coalition 联合团体collaborative 协作网络centrality 集中性centraliazation 集权化chariѕmatic authority 竭尽忠诚的权力Ddecentralization 分权democracy management 民主管理departmentalization 部门化differential rate system 差别报酬系统dialectical inquiry methods 辩证探求法division of labor 劳动分工downward mobility 降职流动dynamic engagement 动态融合dynamic network 动态网络domain 领域direct interlock 直接交叉divisional form 事业部模式differentiation strategy 差别化战略decision premise 决策前提dual-core approach 二元核心模式Eelectronic data-processing(edp) 电子数据处理employee-oriented style 员工导向型风格empowerment 授权encoding 解码end-user computing 终端用户计算系统entrepreneurship 企业家精神equity 净资产equity theory 公平理论espoused value 信仰价值ethnocentric manager 种族主义的管理者expectancy theory 期望理论expense budget 支出预算expense center 费用中心external audit 外部审计external stakeholders 外部利益相关者extrinsic rewards 外部奖励ethic ombudsperson 伦理巡视官external adaption 外部适应性elaboration stage 精细阶段entrepreneurial stage 创业阶段escalating commitment 顽固认同Ffamily group 家庭集团financial statement 财务报表flat hierarchies 扁平型结构flexible budget 弹性预算force-field theory 场力理论formal authority 合法权力formal systematic appraisal 正式的系统评估franchise 特许经营权formalization stage 规范化阶段functional grouping 职能组合formal channel of communication 正式沟通渠道Ggame theory 博弈论general financial condition 一般财务状况geocentric manager 全球化管理者general manager 总经理globalization 全球化gossip chain 传言链grapevine 传言网global strategic partnership 全球战略伙伴关系general environment 一般环境generalist 全面战略geographic grouping 区域组合global company 全球公司global geographic structure 全球区域结构Hhawthorne effect 霍桑效应heuristic principles 启发性原理hierarchy 科层制度hiring specification 招聘细则horizontal linkage model 横向联系模型hybrid structure 混合结构high tech 高接触high-velocity environments 高倍速环境Iimpoverished management 放任式管理income statement 损益表information transformation 信息转换infrastructure 基础设施integrative process 整合过程intelligent enterprises 智力企业internal audit 内部审计internal stakeholder 内部相关者internship 实习intrapreneurship 内部企业家精神intrinsic reward 内在报酬inventory 库存, 存货internal integration 内部整合interorganization relationship 组织间的关系intergroup conflict 团体间冲突interlocking directorate 交叉董事会institutional perspective 机构的观点intuitive decision making 直觉决策idea champion 构思倡导者incremental change 渐进式变革informal organizational structure 非正式组织结构informal performance appraisal 非正式业绩评价Jjob description 职务描述job design 职务设计job enlargement 职务扩大化job enrichment 职务丰富化job rotation 职务轮换job specialization 职务专业化Kkey performance areas 关键业丨务区key result areas 关键绩效区Llabor productivity index 劳动生产力指数laissez management 自由化管理large batch production 大批量生产lateral communication 横向沟通leadership style 领导风格least preferred co-worker(lpc)最不喜欢的同事legitimate power 合法权力liability 负债liaison 联络者line authority 直线职权liquidity 流动性 liaison role 联络员角色long-linked technology 纵向关联技术losses from conflict 冲突带来的损失low-cost leadership 低成本领先Mmanagement by objective 目标管理Managerial Grid 管理方格matrix bosseѕ矩阵主管management champion 管理倡导者materials-requirements planning(MRP) 物料需求计划Mslow,s hierarchy of needs 马斯洛需求层次论marketing argument 管理文化多元化营销观multiculturalism 文化多元主义multidivisional firm 多部门公司moral rules 道德准则management by walking around(MBWA) 走动式管理matrix structure 矩阵结构multinational enterprise(MNE) 跨国公司moral relativism 道德相对主义mechanistic system 机械式组织middle-of-the-road management 中庸式管理meso theory 常态理论multidomestic strategy 多国化战略mediating technology 调停技术Nnaïve relativism 朴素相对主义need-achievement 成就需要norming 规范化 norms 规范nonprogrammed decisions 非程序化决策nonsubstitutability 非替代性nonroutine technology 非例行技术niche 领地Ooff-the-job training 脱产培训on-the-job training 在职培训operational budget 运营预算order backlog 订单储备organic system 有机系统organizational development(OD) 组织发展orientation 定位outcome interdependence 结果的相互依赖性outplacement services 外延服务organization ecosystem 组织生态系统Pparadox of authority 权威的矛盾paradox of creativity 创造力的矛盾paradox of disclosure 开放的矛盾paradox of identify 身份的矛盾paradox of individuality 个性的矛盾paradox of regression 回归的矛盾partial productivity 部分生产率participative management 参与式管理path-goal model 路径目标模型peer recruiter 同级招聘political action committees(PACs) 政治活动委员会polycentric manager 多中心管理者ortfolio framework 业丨务组合框架portfolio investment 资产组合投资positive reinforcement 正强化production flexibility 生产柔性profitability 收益率programmed decisions 程序化决策psychoanalytic view 精神分析法paradigm 范式 personal ratios 人员比例pooled dependence 集合性依存professional bureaucracy 专业官僚机构problem identification 问题识别problemistic search 问题搜寻population ecology model 种群生态模型Qquality 质量quality circle 质量圈question mark 问题类市场quid pro quo 交换物Rrational model of decision making 理性决策模式realistic job preview(RJP) 实际工作预览reciprocal interdependence 相互依存性resource dependence 资源依赖理论routine technology 例行技术retention 保留rational approach 理性方法rational model 理性模型rational-legal authority 理性—合法权威Ssemivariable cost 准可变成本sense of potency 力量感sensitivity training 敏感性训练sexual harassment 性骚扰short-run capacity changes 短期生产能力变化single-strand chain 单向传言链situational approach 情境方法situational force 情境力量situational leadership theory 情境领导理论sliding-scale budget 移动规模预算small-batch production 小规模生产sociotechnical approaches 社会科技方法span of management 管理幅度staff authority 参谋职权standing plan 长设计划step budget 分步预算stewardship principle 管家原则stimulus 刺激storming 调整阶段strategic management 战略管理strategic partnering 战略伙伴关系strategy formulation 战略制定strategy implementation 战略实施strategic control 战略控制strategic contingencies 战略权变satisficing 满意度subsystems 子系统subunits 子单位synergy 协同system boundary 系统边界structure dimension 结构性维度sequential interdependence 序列性依存self-directed team 自我管理型团队specialist 专门战略strategy and structure changes 战略与结构变革symptoms of structural deficiency 结构无效的特征Ttall hierarchies 高长型科层结构task force or project team 任务小组或项目团队task independence 任务的内部依赖性task management 任务型管理task-oriented style 任务导向型管理风格total productivity 全部生产率Total Quality Management 全面质量管理training positions 挂职培训training program 培训程序transactional leaders 交易型领导transformational leaders 变革型领导treatment discrimination 歧视待遇two-factory theory 双因素理论two-boss employees 双重主管员工technical or product champion 技术或产品的倡导者Uunfreezing 解冻 unit production 单位产品Vvariation 变种子variety 变量valence 效价variable costs 可变成本vertical communication 纵向沟通vertical integration 纵向一体化vestibule training 仿真培训volume flexibility 产量的可伸缩性vertical linkage 纵向连接venture team 风险团队value based leadership 基于价值的领导Wwin-lose situation 输赢情境win-win situation 双赢情境workforce literacy 员工的读写能力work in progress 在制品work flow redesign 工作流程再造成work flow automation 工作流程自动化whistle blowing 揭发Zzero-sum 零---和zone of indifference(area of acceptance) 无差异区域(可接受区域)目标 mission/ objective内部环境 internal environment外部环境 external environment集体目标 group objective计划 planning组织 organizing人事 staffing领导 leading控制 controlling步骤 process原理 principle方法 technique经理 manager总经理 general manager行政人员 administrator主管人员 supervisor企业 enterprise商业 business产业 industry公司 company效果 effectiveness效率efficiency企业家 entrepreneur权利 power职权 authority职责 responsibility科学管理 scientific management现代经营管理 modern operational management 行为科学 behavior science生产率 productivity激励 motivate动机 motive法律 law法规 regulation经济体系 economic system管理职能 managerial function产品 product服务 service利润 profit满意 satisfaction归属 affiliation尊敬 esteem自我实现 self-actualization人力投入 human input盈余 surplus收入 income成本 cost资本货物 capital goodѕ机器 machinery设备 equipment建筑 building存货 inventory经验法 the empirical approach人际行为法 the interpersonal behavior approach集体行为法 the group behavior approach协作社会系统法 the cooperative social systems approach社会技术系统法 the social-technical systems approach 决策理论法 the decision theory approach数学法 the mathematical approach系统法 the systems approach随机制宜法 the contingency approach管理任务法 the managerial roles approach经营法 the operational approach人际关系 human relation心理学 psychology态度 attitude压力 pressure冲突 conflict招聘 recruit鉴定 appraisal选拔 select培训 train报酬 compensation授权 delegation of authority协调 coordinate业绩 performance考绩制度 merit system表现 behavior下级 subordinate偏差 deviation检验记录 inspection record误工记录 record of labor-hours lost 销售量 sales volume产品质量 quality of products先进技术 advanced technology顾客服务 customer service策略 strategy结构 structure领先性 primacy普遍性 pervasiveness忧虑 fear忿恨 resentment士气 morale解雇 layoff批发 wholesale零售 retail程序 procedure规则 rule规划 program预算 budget共同作用 synergy大型联合企业 conglomerate资源 resource购买 acquisition增长目标 growth goal专利产品 proprietary product竞争对手 rival晋升 promotion管理决策 managerial decision商业道德 business ethics有竞争力的价格 competitive price .供货商 supplier小贩 vendor利益冲突 conflict of interests派生政策 derivative policy开支帐户 expense account批准程序 approval procedure病假 sick leave休假 vacation工时 labor-hour机时 machine-hour资本支出 capital outlay现金流量 cash flow工资率 wage rate税收率 tax rate股息 dividend现金状况 cash position资金短缺 capital shortage总预算 overall budget资产负债表 balance sheet可行性 feasibility投入原则 the commitment principle 投资回报 return on investment生产能力 capacity to produce实际工作者 practitioner最终结果 end result业绩 performance个人利益 personal interest福利 welfare市场占有率 market share创新 innovation生产率 productivity利润率 profitability社会责任 public responsibility董事会 board of director组织规模 size of the organization 组织文化 organizational culture 目标管理 management by objectives 评价工具 appraisal tool激励方法 motivational techniques 控制手段 control device个人价值 personal worth优势 strength弱点 weakness机会 opportunity威胁 threat个人责任 personal responsibility 顾问 counselor定量目标 quantitative objective 定性目标 qualitative objective可考核目标 verifiable objective 优先 priority工资表 payroll策略 strategy政策 policy灵活性 discretion多种经营 diversification评估 assesѕment一致性 consistency应变策略 consistency strategy公共关系 public relation价值 value抱负 aspiration偏见 prejudice审查 review批准 approval主要决定 major decision分公司总经理 division general manager 资产组合距阵 portfolio matrix明星 star 问号 question mark现金牛 cash cow赖狗 dog采购 procurement人口因素 demographic factor地理因素 geographic factor公司形象 company image产品系列 product line合资企业 joint venture破产政策 liquidation strategy 紧缩政策 retrenchment strategy 战术 tactics追随 followership个性 individuality性格 personality安全 safety自主权 latitude .悲观的 pessimistic静止的 static乐观的 optimistic动态的 dynamic灵活的 flexible抵制 resistance敌对 antagoniѕm折中 eclectic激励 motivation潜意识 subconscious地位 status情感 affection欲望 desire压力 pressure满足 satisfaction自我实现的需要 needs for self-actualization 尊敬的需要 esteem needs归属的需要 affiliation needs安全的需要 security needs生理的需要 physiological needѕ维持 maintenance保健 hygiene激励因素 motivator概率 probability强化理论 reinforcement theory反馈 feedback奖金 bonus股票期权 stock option劳资纠纷 labor dispute缺勤率 absenteeiѕm人员流动 turnover奖励 reward特许经营 franchise热诚 zeal信心 confidence鼓舞 inspire要素 ingredient忠诚 loyalty奉献 devotion作风 style品质 trait适应性 adaptability进取性 aggressiveness热情 enthusiaѕm毅力 persistence人际交往能力 interpersonal skills 行政管理能力 administrative ability 智力 intelligence专制式领导 autocratic leader民主式领导 democratic leader自由放任式领导 free-rein leader管理方格图 the managerial grid工作效率 work efficiency服从 obedience领导行为 leader behavior支持型领导 supportive leadership参与型领导 participative leadership 指导型领导 instrumental leadership成就取向型领导 achievement-oriented leadershipAutomated inspection 自动化检验automatic assembly system 自动化装配系统applied biomechanics 应用生物力学CAD/CAM 计算机辅助设计与制造computer integrated manufacturing system 计算机整合制造系统data structure 数据结构data base management system 数据库管理系统decision analysis 决策分析engineering economy 工程经济engineering statistics 工程统计facilities planning 设施规划factory diagnoisis and improvement method 工厂诊断与改善方法financial and cost analysis 财务与成本分析fuzzy theory and application 模糊理论与应用human-computer interaction (HCI)人因工程与计算机系统human factors engineering 人因工程human information processing 人类讯息处理human-machine system design 人机系统设计human resource management 人力资源管理human system diagnosis and improvement 人体系统诊断与改善industrial environment evaluation 工业环境评估industrial organizations and management 工业组织与管理industrial safety 工业安全information technology 信息技术intellectual property laws 智慧财产权法knowledge engineering 知识工程linear algebra 线性代数manufacturing automation 制造自动化manufacturing engineering 制造工程manufacturing management 制造管理manufacturing procesѕ制造程序manufacturing systems and management 制造系统与管理market and marketing 市场与行销material flows automation 物流自动化mathematical programming 数学规划multicriteria decision making 多目标规划multi-criteria decision methods 多准则决策分析network analysis 网络分析numerical analysis 数值分析organization and management 组织与管理product and technology development management 产品与技术开发管理production management 生产管理production planning and control 生产计划与管制quality control 质量管理quality engineering 品质工程quality management techniques and practice 品质管理queueing theory 等候线理论reliability engineering 可靠度工程research,development and innovation management 研究发展管理semiconductor production management 半导体生产管理sequencing and scheduling 排序与排程simulation 模拟分析statistical method 统计方法stochastic processes 随机系统strategic management of technology 技术策略system analysis and design in large scale 大型系统分析与设计system performance evaluation 系统绩效评估技术system quality assurance engineering 系统品质保证工程systems engineering 系统工程systems simulation 系统仿真vision and colors 视觉与色彩work physiology 工作生理学work study 工作研究Accounting Assistant 会计助理Accounting Clerk 记帐员Accounting Manager 会计部经理Accounting Stall 会计部职员Accounting Supervisor 会计主管Administration Manager 行政经理Administration Staff 行政人员Administrative Assistant 行政助理Administrative Clerk 行政办事员Advertising Staff 广告工作人员Airlines Sales Representative 航空公司定座员Airlines Staff 航空公司职员Application Engineer 应用工程师Assistant Manager 副经理Bond Analyst 证券分析员Bond Trader 证券交易员Business Controller 业丨务主任Businesѕ Manager 业丨务经理Buyer 采购员Cashier 出纳员Chemical Engineer 化学工程师Civil Engineer 土木工程师Clerk/Receptionist 职员/接待员Clerk Typist & Secretary 文书打字兼秘书Computer Data Input Operator 计算机资料输入员Computer Engineer 计算机工程师Computer Processing Operator 计算机处理操作员Computer System Manager 计算机系统部经理Copywriter 广告文字撰稿人Deputy General Manager 副总经理Economic Research Assistant 经济研究助理Electrical Engineer 电气工程师Engineering Technician 工程技术员English Instructor/Teacher 英语教丨师Export Saleѕ Manager 外销部经理Export Sales Staff 外销部职员Financial Controller 财务主任Financial Reporter 财务报告人F.X. (Foreign Exchange)Clerk 外汇部职员F.X. Settlement Clerk 外汇部核算员Fund Manager 财务经理General Auditor 审计长General Manager/ President 总经理General Manager Assistant 总经理助理General Manager's Secretary 总经理秘书Hardware Engineer 计算机硬件工程师Import Liaison Staff 进口联络员Import Manager 进口部经理Insurance Actuary 保险公司理赔员International Sales Staff 国际销售员Interpreter 口语翻译Legal Adviser 法律顾问Line Supervisor 生产线主管Maintenance Engineer 维修工程师Management Consultant 管理顾问Manager 经理Manager for Public Relationѕ公关部经理Manufacturing Engineer 制造工程师Manufacturing Worker 生产员工Market Analyst 市场分析员Market Development Manager 市场开发部经理Marketing Manager 市场销售部经理Marketing Staff 市场销售员Marketing Assistant 销售助理Marketing Executive 销售主管Marketing Representative 销售代表Marketing Representative Manager 市场调研部经理Mechanical Engineer 机械工程师Mining Engineer 采矿工程师Music Teacher 音乐教丨师Naval Architect 造船工程师Office Assistant 办公室助理Office Clerk 职员Operational Manager 业丨务经理Package Designer 包装设计师Passenger Reservation Staff 乘客票位预订员Personnel Clerk 人事部职员Personnel Manager 人事部经理Plant/ Factory Manager 厂长Postal Clerk 邮政人员Private Secretary 私人秘书Product Manager 生产部经理Production Engineer 产品工程师Professional Staff 专业人员Programmer 电脑程序设计师Project Staff 项目策划人员Promotional Manager 推售部经理Proof-reader 校对员Purchasing Agent 采购进货员Quality Control Engineer 质量管理工程师Real Estate Staff 房地产职员Recruitment Co-ordinator 招聘协调人Regional Manger 地区经理Research&.Development Engineer 研究开发工程师Restaurant Manager 饭店经理Sales and Planning Staff 销售计划员Sales Assistant 销售助理Sales Clerk 店员、售货员Sales Coordinator 销售协调人Sales Engineer 销售工程师Sales Executive 销售主管Saleѕ Manager 销售部经理Salesperson 销售员Seller Representative 销售代表Sales Supervisor 销售监管School Registrar 学校注册主任Secretarial Assistant 秘书助理Secretary 秘书Securities Custody Clerk 保安人员Security Officer 安全人员Senior Accountant 高级会计Senior Consultant/Adviser 高级顾问Senior Employee 高级雇员Senior Secretary 高级秘书Service Manager 服务部经理Simultaneous Interpreter 同声传译员Software Engineer 计算机软件工程师Supervisor 监管员Systems Adviser 系统顾问Systems Engineer 系统工程师Systems Operator 系统操作员Technical Editor 技术编辑Technical Translator 技术翻译Technical Worker 技术工人Telecommunication Executive电讯(电信)员Telephonist / Operator 电话接线员、话务员Tourist Guide 导游Trade Finance Executive 贸易财务主管Trainee Manager 培训部经理Translation Checker 翻译核对员Translator 翻译员Trust Banking Executive 银行高级职员Typist 打字员Wordprocessor Operator 文字处理操作员。
IND560 weighing terminal和Fill-560应用软件商品说明书
2Industrial Weighing and MeasuringDairy & CheeseNewsIncrease productivitywith efficient filling processesThe new IND560 weighing terminal enables you to boost speed and precision during the filling process. Choose from a wide range of scales and weigh modules to connect to the terminal.The versatile IND560 excels in control-ling filling and dosing applications, delivering best-in-class performance for fast and precise results in manual, semi-automatic or fully automatic operations. For more advanced filling, the Fill-560 application software adds additional sequences and component inputs. Without complex and costly programming you can quickly con-figure standard filling sequences, or create custom filling and blending applications for up to four compo-nents, that prompt operators for action and reduce errors.Ergonomic design Reducing operator errors is achieved through the large graphic display which provides visual signals.SmartTrac ™, the METTLER TOLEDO graphical display mode for manual operations, which clearly indicate sta-tus of the current weight in relation to the target value, helps operators to reach the fill target faster and more accurately.Connectivity and reliabilityMultiple connectivity options are offered to integrate applications into your con-trol system, e.g. Allen-Bradley ® RIO, Profibus ®DP or DeviceNet ™. Even in difficult vibrating environments, the TraxDSP ™ filtering system ensures fast and precise weighing results. High reli-ability and increased uptime are met through predictive maintenance with TraxEMT ™ Embedded MaintenanceTechnician.METTLER TOLEDO Dairy & Cheese News 22Speed up manual operations with flexible checkweighingB e n c h & F l o o r S c a l e sHygienic design, fast display readouts and the cutting-edge color backlight of the new BBA4x9 check scales and IND4x9 terminals set the standard for more efficient manual weigh-ing processes.Flexibility through customizationFor optimal static checkweighing the software modules ‘check’ and‘check+’ are the right solutions. They allow customization of the BBA4x9 and the IND4x9 for individual activi-ties and needs, e.g. manual portion-ing or over/under control. Flexibility is increased with the optional battery which permits mobility. Hygienic design Easy-to-clean equipment is vital in food production environments. Both the BBA4x9 scale and the IND4x9 ter-minal are designed after the EHEDGand NSF guidelines for use in hygi-enically sensitive areas.Even the back side of the scale stand has a smooth and closed surfacewhich protects from dirt and allowstrouble-free cleaning.Fast and preciseThe colorWeight ® display with a colored backlight gives fast, clear indication when the weight is with-in, below or above the tolerance.The color of the backlight can be chosen (any mixture of red, greenand blue) as well as the condition itrefers to (e.g. below tolerance). The ergonomic design enables operators to work more efficiently due to less exhaustion.Short stability time, typically between 0.5s and 0.8s, ensures high through-put and increased productivity.PublisherMettler-Toledo GmbH IndustrialSonnenbergstrasse 72CH-8603 Schwerzenbach SwitzerlandProductionMarCom IndustrialCH-8603 Schwerzenbach Switzerland MTSI 44099754Subject to technical changes © 06/2006 Mettler-Toledo GmbH Printed in SwitzerlandYellow – weight above toleranceGreen – weight within toleranceRed – weight below toleranceYour benefits• Fast and precise results and operations • Higher profitability• Ergonomic design, simple to operate • Mobility up to 13h due to optional batteryFast facts BBA4x9 and IND4x9• 6kgx1g, 15kgx2g, 30kgx5g (2x3000d), for higher capacity scales: IND4x9 terminal • Weights and measures approved versions 2x3000e • Functions: simple weighing, static checkweighing, dispensing • Color backlight, bar graph • Tolerances in weight or %• 99 Memory locations • Optional WLAN, battery• Meets the IP69k protection standardsagainst high-pressure and steam cleaning • Complete stainless steel construction Immediate checkweighing resultswith color Weight®EHEDGThe colored backlight of the LC display provides easy-to- recognize indication whether the weight is within the tolerancelimits or not.WLANMETTLER TOLEDO Dairy & Cheese News 23HACCP programs, GMP (Good Manufacturing Practice), pathogen monitoring and good cleaning practices are essential for effective food safety plans. Our scales are constructed for compliance with the latest hygienic design guidelines.Hygienic design to improve food safetyMETTLER TOLEDO supports you in complying with the latest food safety standards like BRC, IFS or ISO 22000 by offering solutions which are:• Compliant with EHEDG (European Hygienic Engineering & Design Group) and NSF (National Sanitation Foundation) guidelines • Full V2A stainless steel construc-tions, optional V4A load plates • Smooth surface (ra < 0.8μm)• Easy-to-clean construction, no exposed holes • Radius of inside corners > 3mm• Ingress protection rating up to IP69k• Hermetically sealed loadcellsYour benefits• Reduce biological and chemical contamination risks • Fast and thorough cleaning procedures • Fulfillment of hygiene regulations • Long equipment life thanks to rugged designGuaranteed serviceKeep your business runningAvoid unnecessary downtime with our wide range of service packages.With a range of innovative service solutions offering regulatory compli-ance, equipment calibration, train-ing, routine service and breakdown assistance, you can profit from sus-tained uptime, together with ongoing performance verification and long life of equipment. There is a range of contract options designed to comple-ment your existing quality systems. Each one offers its own unique set of benefits depending on the equipment and its application.4/serviceFast facts PUA579 low profile scale • 300kgx0.05kg – 1500kgx0.2kg • Open design• Lifting device for easy cleaning • EHEDG conform(300 and 600kg models -CS/-FL)• Free size scale dimensions • Approach rampsExample:PUA579 first EHEDG conform floor scaleEHEDGW e i g h P r i c e L a b e l i n gChallenges faced in the packaging area are:• Responding quickly to retailer demands while improving margins • Improving pack presentation • Minimizing downtime and product giveawaysWith a complete offering of cutting-edge weighing technology, high-per-formance printing, and smart soft-ware solutions, we can help you tackle your labeling challenges whether they are very simple or highly demanding. Intuitive human-machine interfaceTouch-screen operator displays withgraphical icons guide the operator intuitively and reduce nearly every operation to just one or two key-strokes. This interface allows reduced operator training as well as increased operating efficiency.Advanced ergonomics and sani-tary designOur weigh-price labelers are made out of stainless steel for extensive pro-tection against food contamination. Careful attention to hygienic design requirements, with no dead spots and few horizontal parts, ensure that the labelers are easy to clean.Modular designOur product offering includes both manual and automatic weigh-price labelers constructed of flexible “build-ing blocks.” Different combinations and configurations can meet specific budget and operational requirements. METTLER TOLEDO will help you toselect the right:• Scale performance • Display technology • Memory capacity • IT connections • Degree of automation• Integration kitsA large range of options and peripher-als give flexibility for meeting unique requirements e.g. wireless network, hard disks, external keyboards, bar code scanners, RFID transponder, dynamic checkweighing, or metal detection.Weigh-price-labeling Ergonomic, modular, fastEtica 2300 standard manual labelerFor individual weight labeling of various products, high- speed weighing, smart printing and fast product changes are essential. METTLER TOLEDO offers static and automated solutions for both manual and high-speed prepack applica-tions. Choose from our Etica and PAS product range.METTLER TOLEDO Dairy & Cheese News 24Etica 2400i combination with automatic stretch wrappersEtica 2430G multi-conveyer weigh-price labeler rangeEfficient label applicatorsThe unique Etica label applicator (Etica G series) does not require an air compressor, allowing savings on initial equipment expense and ongo-ing maintenance costs. Labels are gently applied in any pre-memorized orientation.PAS systems provide motorized height adjustment and places the label in any corner of the package. Users will have a new degree of freedom in planning their case display layouts to maximize both product presentation and consumer impact.Smart label design tools Retailers want labels to carry clear, correct information, in accordance with their traceability and style requirements. Our solutions are equipped with labeldesign software tools which facili-tate the design of labels customizedfor retailers demands. A touch-screenallows the user to create specific labels– even with scanned elements such aslogos and graphics, pre-programmedlabel templates, or RFID.Versatile integration capabilitiesThe engineers at METTLER TOLEDOworked closely with Europe’s leadingautomatic stretch wrapper suppliersto design performance-enhancingand cost-effective weigh-wrap-labelsystem solutions. Achieving a smallsystem footprint means the systemsrequire only slightly more floor spacethan the wrapper alone.The PAS and Etica weigh-price label-ers can be integrated via TCP/IP ina METTLER TOLEDO scale network,in host computer systems and goodsmanagement systems.Etica weigh-price-labeling systems• Static and automatic weigh-price-labeling up to 55 pieces/min.• Operator displays:– 5.7” color back-lighted LCD (Etica 2300 series)– 10.4” high resolution touch screen (Etica 4400 series)• 3 inch graphic thermal printer (125 to 250mm/sec) withfully programmable label format (max. size 80x200mm)• Data memory:– 64 to 256 Mb RAM– 128 Mb to 10 Gb mass storage– Unlimited number of logo graphics and label descriptions• Interfaces:– 1 serial RS232 interface– Optional second RS232 + RS485 + Centronics port– Ethernet network communication interface(10baseT), TCP/IP, 2 USB ports (1)– Optional: hand-held bar code scanner for automatictraceability data processingGarvens PAS 3008/3012 price labelersEtica 4400METTLER TOLEDO Dairy & Cheese News 2FlexMount ® weigh moduleFast, reproducible and reliable batch-ing and filling are key success factors for your production process. Various factors can affect precision: foam can compromise optical/radar sensors, and solids do not distribute evenly in a tank or silo. Our weighing techno-logy is not affected by these condi-tions and provides direct, accurate and repeatable measurement of mass without media contact. In addition our range of terminals and transmit-ters/sensors enable easy connectivity to your control systems.Key customer benefits• Increased precision and consistencyof your material transfer processes• Faster batching process throughsupreme TraxDSP ™ noise and vibration filtering • Minimal maintenance cost Fast facts terminals/transmitters: PTPN and IND130• Exclusive TraxDSP ™ vibration rejection and superior noise filter-ing system • Easy data integration through a variety of interfaces, including Serial, Allen-Bradley ® RIO, Modbus Plus ®, Profibus ® and DeviceNET • IP65 stainless harsh versionsProcess terminal PTPN• Local display for weight indication and calibration checks • Panel-mount or stainless steel desk enclosureIND130 smart weight transmitter• Direct connectivity where no local display is required • Quick setup and run via PC tool • CalFREE ™ offers fast and easy cali-bration without test weights • DIN rail mounting versionPLCIND1306Tank and silo weighing solutions master your batching processesT a n k & S i l o W e i g h i n g S o l u t i o n sBoost your productivity and process uptime with reliable weighing equipment – improved batching speed and precision, maximum uptime at low maintenance cost.TraxDSP ™ ensures accurate results evenin difficult environments with vibrationPTPN process terminalMETTLER TOLEDO Dairy & Cheese News 27Quality data under control?We have the right solutionConsistently improving the quality of your products requires the ability of efficiently controlling product and package quality parameters in a fast-changing and highly competi-tive environment.Competition in the food industry –with high volumes but tight margins – causes demands for efficient quality assurance systems. Statistical Quality Control (SQC) systems for permanent online information and documenta-tion about your key quality para-meters convert into real cost savings.Our solutions for Statistical Quality Control (SQC) combine ease of opera-tion, quality data management and analysis functionality.• We offer mobile compact solutions with embedded SQC intelligence up to networked systems with an SQL database.• The systems are upgradeable and can be expanded and adapted to meet changing customer needs.• Simple and intuitive prompts guide the user through the sample proc-ess, reducing training costs as well as sampling errors.• Realtime analysis and alarms help to take immediate corrective measures and to save money by reducing overfilling.Throughout the manufacturing pro-cess, METTLER TOLEDO SQC solu-tions analyze your important product and package quality parameters andpresent them the way you want, help-ing to comply to legislation, to control and document your product qualityand your profitability.Metal detectionCheckweigher Sample check ® onlinequality data analysis/dairy-cheeseFor more informationMettler-Toledo GmbH CH-8606 Greifensee SwitzerlandTel. +41 44 944 22 11Fax +41 44 944 30 60Your METTLER TOLEDO contact:1. SevenGo ™ portable pH-meter2. In-line turbidity, pH and conductivity sensors3. DL22 Food and beverage analyzer4. Halogen moisture analyzersA wide range of solutions to improve processes1. Statistical Quality Control/Statistical Process Control2. Process weighing3. Predictive maintenance4. Methods of moisture content determinationShare our knowledgeLearn from our specialists – our knowledge and experience are at your disposal in print or online.Learn more about all of our solutions for the dairy and cheese industry at our website. You can find information on a wide range of topics to improve your processes, including case studies,application stories, return-on invest-ment calculators, plus all the product information you need to make aninformed decision.1 2 341423。
51单片机英文及其翻译
英文翻译原文:51 Microcontroller IntroductionMicrocontrollers basic component is a central processing unit (CPU in the computing device and controller), read-only memory (usually expressed as a ROM), read-write memory (also known as Random Access Memory MRAM is usually expressed as a RAM) , input / output port (also divided into parallel port and serial port, expressed as I / O port), and so composed. In fact there is also a clock circuit microcontroller, so that during operation and control of the microcontroller, can rhythmic manner. In addition, there are so-called "break system", the system is a "janitor" role, when the microcontroller control object parameters that need to be intervention to reach a particular state, can after this "janitor" communicated to the CPU, so that CPU priorities of the external events to take appropriate counter-measures.Microcontrollers are used in a multitude of commercial applications such as modems, motor-control systems, air conditioner control systems, automotive engine and among others. The high processing speed and enhanced peripheral set of these microcontrollers make them suitable for such high-speed event-based applications. However, these critical application domains also require that these microcontrollers are highly reliable. The high reliability and low market risks can be ensured by a robust testing process and a proper tools environment for the validation of these microcontrollers both at the component and at the system level. Intel Platform Engineering department developed an object-oriented multi-threaded test environment for the validation of its AT89C51 automotive microcontrollers. The goals of this environment was not only to provide a robust testing environment for the AT89C51 automotive microcontrollers, but to develop an environment which can be easily extended and reused for the validation of several other future microcontrollers. The environment was developed in conjunction with Microsoft Foundation Classes (AT89C51). The paper describes the design and mechanism of this test environment, its interactions with various hardware/software environmental components, and how to use AT89C51.Are 8-bit microcontroller early or 4 bits. One of the most successful is the INTEL 8031, for a simple, reliable and good performance was a lot of praise. Then developed in 8031 out of MCS51 MCU Systems. SCM systems based on this system until now is still widely used. With the increased requirements of industrial control field, began a 16-bit microcontroller, but not ideal because the cost has not been very widely used. After 90 years with the great development of consumer electronics, microcontroller technology has been a huge increase. With INTEL i960 series, especially the later series of widely used ARM, 32-bit microcontroller quickly replace high-end 16-bit MCU status and enter the mainstream market. The traditional 8-bit microcontroller performance have been therapid increase capacity increase compared to 80 the number of times. Currently, high-end 32-bit microcontroller clocked over 300MHz, the performance catching the mid-90s dedicated processor, while the average model prices fall to one U.S. dollar, the most high-end model is only 10 dollars. Modern SCM systems are no longer only in the development and use of bare metal environment, a large number of proprietary embedded operating system is widely used in the full range of SCM. The handheld computers and cell phones as the core processing of high-end microcontroller can even use a dedicated Windows and Linux operating systems.SCM relies on the program, and can be modified. Through different procedures to achieve different functions, in particular special unique features, this is another device much effort needs to be done, some are great efforts are very difficult to achieve. A not very complex functions if the 50's with the United States developed 74 series, or the 60's CD4000 series of these pure hardware buttoned, then the circuit must be a large PCB board! But if the United States if the 70's with a series of successful SCM market, the result will be a drastic change! Just because you are prepared by microcomputer programs can achieve high intelligence, high efficiency and high reliability!IntroductionThe 8-bit AT89C51 CHMOS microcontrollers are designed to handle high-speed calculations and fast input/output operations. MCS 51 microcontrollers are typically used for high-speed event control systems. Commercial applications include modems, motor-control systems, printers, photocopiers, air conditioner control systems, disk drives, and medical instruments. The automotive industry use MCS 51 microcontrollers in engine-control systems, airbags, suspension systems, and antilock braking systems (ABS). The AT89C51 is especially well suited to applications that benefit from its processing speed and enhanced on-chip peripheral functions set, such as automotive power-train control, vehicle dynamic suspension, antilock braking, and stability control applications. Because of these critical applications, the market requires a reliable cost-effective controller with a low interrupt latency response, ability to service the high number of time and event driven integrated peripherals needed in real time applications, and a CPU with above average processing power in a single package. The financial and legal risk of having devices that operate unpredictably is very high. Once in the market, particularly in mission critical applications such as an autopilot or anti-lock braking system, mistakes are financiallyProhibitive. Redesign costs can run as high as a $500K, much more if the fix means back annotating it across a product family that share the same core and/or peripheral design flaw. In addition, field replacements of components are extremely expensive, as the devices are typically sealed in modules with a total value several times that of the component. To mitigate these problems, it is essential that comprehensive testing of the controllers be carried out at both the component level and system level under worst case environmental and voltage conditions. This complete and thorough validation necessitates not only a well-defined process but also a proper environment and tools to facilitate and execute the mission successfully.Intel Chandler Platform Engineering group provides postSilicon system validation (SV) of various micro-controllers and processors. The system validation process can be broken into three major parts. The type of the device and its application requirements determine which types of testing are performed on the device.The AT89C51 provides the following standard features: 4Kbytes of flash, 128 bytes of RAM, 32 I/O lines, two 16-bittimer/counters, five vector two-level interrupt architecture, a full duple ser -ail port, on-chip oscillator and clock circuitry. In addition, the AT89C51 is designed with static logic for operation down to zero frequency and supports two software selectable power saving modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial port and interrupt sys -tem to continue functioning. The Power-down Mode saves the RAM contents but freezes the social -labor disabling all other chip functions until the next hardware reset.Pin DescriptionVCC Supply voltage.GND Ground.Port 0Port 0 is an 8-bit open-drain bi-directional I/O port. As an output port, each pin can sink eight TTL inputs. When 1s are written to port 0 pins, the pins can be used as high impedance inputs.Port 0 may also be configured to be the multiplexed lowered address/data bus during accesses to external program and data memory. In this mode P0 has internal pull-ups’.Port 0 also receives the code bytes during Flash programming, and outputs the code bytes during program verification. External pull-ups are required during program verification.Port 1Port 1 is an 8-bit bi-directional I/O port with internal pullups.The Port 1 output buffers can sink/so -urge four TTL inputs. When 1s are written to Port 1 pins they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 1 pins that are externally being pulled low will source current (IIL) because of the internal pull-ups.Port 1 also receives the low-order address bytes during Flash programming and verification.Port 2Port 2 is an 8-bit bi-directional I/O port with internal pullups.The Port 2 output buffers can sink/source four TTL inputs. When 1s are written to Port 2 pins they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 2 pins that are externally being pulled low will source current (IIL) because of the internal pull-ups.Port 2 emits the high-order address byte during fetches from external program memory and during accesses to Port 2 pins that are externally being pulled low will source current (IIL) because of the internal pull-ups.Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that uses 16-bit addresses (MOVX @DPTR). In this application, it uses strong internal pull-ups when emitting 1s. During accesses to external data memory that uses 8-bit addresses (MOVX @ RI); Port 2 emits the contents of the P2 Special Function Register.Port 2 also receives the high-order address bits and some control signals during Flash programming and verification.Port 3Port 3 is an 8-bit bi-directional I/O port with internal pullups.The Port 3 output buffers can sink/soul -race four TTL inputs. When 1s are written to Port 3 pins they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 3 pins that are externally being pulled low will source current (IIL) because of the pull-ups.RSTReset input. A high on this pin for two machine cycles while the oscillator is running resets the device.ALE/PROGAddress Latch Enable output pulse for latching the low byte of the address during accesses to external memory.This pin is also the program pulse input (PROG) during Flash programming.In normal operation ALE is emitted at a constant rate of 1/6 the oscillator frequency, and may be used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped dui -nag each access to external DataMemory.If desired, ALE operation can be disabled by setting bit 0 of SFR location 8EH. With the bit set, ALE is active only during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled high. Setting the ALE-disable bit has no effect if the microcontroller is in external execution mode.PSENProgram Store Enable is the read strobe to external program memory. When the AT89C51 is executing code from external program memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external data memory.EA/VPPExternal Access Enable. EA must be strapped to GND in order to enable the device to fetch code from external program memory locations starting at 0000H up to FFFFH. Note, however, that if lock bit 1 is programmed, EA will be internally latched on reset. A should be strapped to VCC for internal program executions. This pin also receives the 12-volt programming enable voltage (VPP) during Flash programming, for parts that require 12-volt VPP.The AT89C51 code memory array is programmed byte-by byte in either programming mode. To program any nonblank byte in the on-chip Flash Memory, the entire memory must be erased using the Chip Erase Mode.Data Polling: The AT89C51 features Data Polling to indicate the end of a write cycle. During a write cycle, an attempted read of the last byte written will result in the complement of the written datum on PO.7. Once the write cycle has been completed, true data are valid on all outputs, andThe next cycle may begin. Data Polling may begin any time after a write cycle has been initiated.Ready/Busy: The progress of byte programming can also be monitored by the RDY/BSY output signal. P3.4 is pulled low after ALE goes high during programming to indicate BUSY. P3.4 is pulled high again when programming is done to indicate READY.Program Verify: If lock bits LB1 and LB2 have not been programmed, the programmed code data can be read back via the address and data lines for verification. The lock bits cannot be verified directly. Verification of the lock bits is achieved byobserving that their features are enabled.A microcomputer interface converts information between two forms. Outside the microcomputer the information handled by an electronic system exists as a physical signal, but within the program, it is represented numerically. The function of any interface can be broken down into a number of operations which modify the data in some way, so that the process of conversion between the external and internal forms is carried out in a number of steps.An analog-to-digital converter (ADC) is used to convert a continuously variable signal to a corresponding digital form which can take any one of a fixed number of possible binary values. If the output of the transducer does not vary continuously, no ADC is necessary. In this case the signal conditioning section must convert the incoming signal to a form which can be connected directly to the next part of the interface, the input/output section of the microcomputer itself.Output interfaces take a similar form, the obvious difference being that here the flow of information is in the opposite direction; it is passed from the program to the outside world. In this case the program may call an output subroutine which supervises the operation of the interface and performs the scaling numbers which may be needed for a digital-to-analog converter (DAC). This subroutine passes information in turn to an output device which produces a corresponding electrical signal, which could be converted into analog form using a DAC. Finally the signal is conditioned (usually amplified) to a form suitable for operating an actuator.The signals used within microcomputer circuits are almost always too small to be connected directly to the “outside world” and some kind of interface must be used to translate them to a more appropriate form. The design of section of interface circuits is one of the most important tasks facing the engineer wishing to apply microcomputers. We have seen that in microcomputers information is represented as discrete patterns of bits; this digital form is most useful when the microcomputer is to be connected to equipment which can only be switched on or off, where each bit might represent the state of a switch or actuator.To solve real-world problems, a microcontroller must have more than just a CPU, a program, and a data memory. In addition, it must contain hardware allowing the CPU to access information from the outside world. Once the CPU gathers information and processes the data, it must also be able to effect change on some portion of the outside world. T hese hardware devices, called peripherals, are the CPU’s window t o the outside.The most basic form of peripheral available on microcontrollers is the general purpose I70 port. Each of the I/O pins can be used as either an input or an output. The function of each pin is determined by setting or clearing corresponding bits in a corresponding data direction register during the initialization stage of a program. Each output pin may be driven to either a logic one or a logic zero by using CPU instructions to pin may be viewed (or read.) by the CPU using program instructions.Some type of serial unit is included on microcontrollers to allow the CPU to communicate bit-serially with external devices. Using a bit serial format instead of bit-parallel format requires fewer I/O pins to perform the communication function, which makes it less expensive, but slower. Serial transmissions are performed either synchronously or asynchronously.Its applicationsSCM is widely used in instruments and meters, household appliances, medical equipment, aerospace, specialized equipment, intelligent management and process control fields, roughly divided into the following several areas:SCM has a small size, low power consumption, controlling function, expansion flexibility, the advantages of miniaturization and ease of use, widely used instrument, combining different types of sensors can be realized, such as voltage, power, frequency, humidity, temperature, flow, speed, thickness, angle, length, hardness, elemental, physical pressure measurement. SCM makes use of digital instruments, intelligence, miniaturization, and functionality than the use of more powerful electronic or digital circuits. Such as precision measuring equipment (power meter, oscilloscope, various analytical instrument).译文:51单片机简介单片机的基本组成是由中央处理器(即CPU中的运算器和控制器)、只读存贮器(通常表示为ROM)、读写存贮器(又称随机存贮器通常表示为RAM)、输入/输出口(又分为并行口和串行口,表示为I/O口)等等组成。
NVIDIA Shader Debugger for FX Composer June 2008 1
2. Shader/Technique & Function Selector for Editor. On the left, provides a summary of all the techniques and their respective passes for the current effect. On the right, provides a dropdown of all functions in the current shader file.
Makes it easy to understand shader algorithms and control logic Improving productivity by removing the need to embed additional debugging
functionality into shaders Quickly understanding shaders written by other artists, developers, or shader
Feature List
The NVIDIA Shader Debugger contains several features to debug and understand shaders. These features include:
1. Debugger Toolbar. This toolbar contains several convenient buttons:
Features ............................................................................................................. 2 Overview ......................................................................................................................... 2 Feature List...................................................................................................................... 2
机械专业英语短文带翻译
机械工程师的关键责任之一是设计与分析机械系统。这涉及使用计算机辅助设计(CAD)软件创建系统的详细三维模型,并在不同条件下模拟其性能。通过分析作用于系统组件的力、应力和振动,机械工程师可以优化设计,确保安全、可靠和高效。
Case Study: Designing an Automotive Suspension System
案例研究:汽车悬挂系统设计
例如,让我们考虑一下汽车悬挂系统的设计。悬挂系统负责在保持车辆稳定控制的同时提供平稳的行驶。机械工程师使用CAD软件设计悬挂系统的各个组件,例如弹簧、减振器和控制臂。
在完成初始设计后,工程师将使用有限元分析(FEA)软件对系统进行分析。这样可以模拟系统在不同的道路条件下(如坑洼或减速带)的行为。通过分析组件中的应力和位移,工程师可以确定潜在的设计问题,并进行必要的修改,以改善悬挂系统的性能和安全性。
For example, let's consider the design of an automotive suspension system. A suspension system is responsible for providing a smooth ride while maintaining the stability and control of the vehicle. A mechanical engineer would use CAD software to design the various components of the suspension system, such as the springs, dampers, and control arms.
After the initial design is complete, the engineer would then analyze the system using finite element analysis (FEA) software. This allows them to simulate the behavior of the system under different road conditions, such as potholes or speed bumps. By analyzing the stresses and displacements in the components, the engineer can identify potential design issues and make necessary modifications to improve the performance and safety of the suspension system.
MC-700系列质量流量控制器使用说明书
LN0427E2103E0Mass Flow Controller Instruction ManualSafety PrecautionsIncorrect handling may cause death or injury(1)Before connecting the fittings, check that no damage or defects are found on the fittings. Make connections properly and make sure that a leak test is conducted before actual operation to prevent fluid from leaking into the atmosphere (Hereafter, the measured fluid is called “gas” or “fluid”).(2) DO NOT apply any fluids corrosive to materials exposed to gas. Corrosion may cause fluid to leak into the atmosphere. Check the gas type to be used in advance. (3)This device is not designed as an explosion proof structure. DO NOT use this device in a place where explosion-proof structures are required. Doing so may cause fire or explosion.Incorrect handling may lead to medium or slight injury or may cause damage to, or loss of, facilities or equipment(1) Observe the precautions listed in the WARNING (above)(2) Strictly observe the electrical specifications. Not doing so may cause fire, damage to sensors or malfunction.(3) This device is not designed to be waterproof. DO NOT locate this device outdoors or in a place where it may be splashed with water. Doing so may cause fire, trouble, or malfunction of the device.(4) DO NOT modify this device. It may cause fire or other problems.(5)This device is not designed to handle hot swap. Please avoid attaching and removing the power supply connector and interface connector with the power switched on. Attachment and/or removal with the power on may result in failure of the device.(6) While a power supply is applied to MFC, ±15VDC must be applied simultaneously. If only +15VDC or -15VDC is applied, electronic circuits will become unstable and it may cause a malfunction of MFC.(7) This device is a precious device, please handle it carefully. Dropping down or handling it carelessly will cause damage. Please use assist instrument while moving or setting the device.(8)Regular maintenance is recommended for steady use of this device (Recommended proofreading frequency is once a year).1. IntroductionThis manual explains basic operation of the MC-700 series (Hereafter, it is called"MFC"). Please read through this manual and other separate volumes (Digital Interface Manual, Special Function Manual, Command Chart) carefully to familiarize yourself with the features of this device.2. SummaryThis device is the mass flow controller with the function of switching differentkinds of gas and flow rate (Hereafter called "variable function" or "VR"). By using the 3 rotary switches on the MFC, the gas type and flow rate can be changed. The rotary switches are placed conveniently on top of the MFC unit so thatadjustments can be made accordingly even after the unit is set in position. For old models, stocking MFC for each of gas and flowrate was necessary because only one spec is available to one MFC, and MC-700 can reduce your stocking because it can be used for more than one spec with one MFC.3. FeaturesThe MFC has the following features.(1) LINTEC’s proprietary ambient temperature compensation type flow sensor.·The influence of ambient temperature is small due to the sensor temperature control following the ambient temperature.·Since the temperature distribution of the sensor is constant, high-speed response is possible.(2) Gas type and flow rate setting can be changed by using the 3 switches on the mass flow controller unit.(3) Digital interface (RS-485) is standard equipment and the maximum of 32 MFCs could be connected together with daisy chain. (Option: Digital interface RS-232C is possible)(4) Small structure of dead volume using diaphragm valve.(5) Stainless steel 316L is used because of good corrosion resistance and seal ability. (6) Particule-free structure(7) RoHS compliant, CE conformity4. StructureThe MFC consists of sensors, bypass, valves, and a microcomputer for signalprocessing. A digital PID feedback control system controls the valve action so that flow rate output from the sensor agrees with flow rate setting value.5. Specification / DimensionsNote 2) The value at the time of shipping. This may change with gas type and flow rate setting. · Connect the MFC to the ground.(2) Dimensions6. Ordering informationMC-710 MC - 4VR2 A0A0A0 - 06 - N2 - 1.5SLM [1] [2] [3] [4] [5] [6] [7][1] Model: MC: Mass Flow Controller Series MC-710 MC-720 MC-730 [2] Valve operation mode · Internal surface treatmentNO: Normally opened valve / No treatment NC: Normally closed valve / No treatmentMO: Normally opened valve / Precision polishing MC: Normally closed valve / Precision polishing [3] Fitting4VR2: 6.35VCRType 124mm4VR1: 6.35VCRType 106mm (option) 4SWL: 6.35SWLType 127mm (option) ※ Please consult us for other fitting types. [4] Other optionsDefault settings is labeled “A 0A0A0”, please consult for more information. [5] VR Number [6] Gas type[7] Full scale flow rate and unit: SCCM(0°C standard), SLM(0°C standard)7. Connection(1) Analog interface connectorMounted connector : D-Sub 9 pin(male)Note4)Pin No.[4],[7]and No.[8] are connected internally in MFC.Wirings should be done as shown below in order to remove the effect of potential difference among the COMMON.Do not connect. Flow rate setting signal COMMON[8], Flow rate output signal[7], and Power supply COMMON[4] in the power supply unit.(2) Digital interface connectorMounted connector : RJ-45 Modular jack Pair connector : RJ-45 Modular plugR0 or R1. Refer to the attached sheet of digital interface instruction manual for connection. Note6)[Power OUT] means the power output of RS-1 interface and it is not applicable for connections to other machines without R1 option.· RS-1 is a discontinued product. Therefore, MC-3000E series / MC-2000 series can be replaced with MC-700 series including option.8. Alarm functionsThe MFC has two types of alarm functions built in. In addition, alarm status can be confirmed using both digital communication (alarm output from the digital connector) and an LED located on top of the body of the MFC. As alarm settings can only be changed using digital communication, please carry out necessary changes using this method. For 9. Software switch (factory shipped value)This MFC is provided with a software switch for operation mode setting. Beforeoperation, input the necessary data for various functions by using the digital interface.· If the zero adjust button on the top of the MFC is pressed and held for over 5 seconds, the communication protocol is reset to default.10. Operation (1) Procedure1)This product is packed in a clean room before shipment. Please break theseals in a clean room after taking it out of its box.2) Check the gas type and flow rate and check the direction of the gas flow and the MFC before installation.3) Check for gas leaks from the tubing with a helium (He) leak detector. 4) Connect the interface connectors according to the Connector table.5) Power requirements are +15VDC:120mA and -15VDC: 50mA. Check the voltage, polarity, and capacitance of the power supply voltage.6) Turn on power supply and let the equipment warm up for at least 5 minutes (Recommended time: 30min).7)Adjust the zero point by pressing the zero adjustment, switch located on the top of the MFC. Before zero-point adjustment, check that gas is not being supplied and the device was warmed up for 30 minutes or more in order to ensure sensor stability.8)Input the flow rate setting signal and supply gas with required differential pressure to the MFC. The MFC will begin to control the gas flow in proportion to the preset voltage. Full-scale voltage is 5VDC. Maximum input voltage is ±15.5VDC.9) When the output flow rate signal is used, the tolerance voltage of the external device should be more than ±15.5VDC. When it’s conne cted the output valve may be within the range of the maximum voltage ±15.5VDC. 10) Complete shut-off cannot be achieved with the mass flow controller. If complete shut-off is desired, a shut-off valve should be installed.11) When a highly reactive gas is used, thoroughly purge all foreign matter from the tubing and the MFC before operation.12) When contaminated gas is used, install a filter at the equipment inlet.13)Use the MFC within the range of the operating temperature (15 to 35°C), and keep it at the same temperature with the gas. If used in any environment that does not meet the above-mentioned requirements, the flow rate cannot be measured accurately and the device may fail.14)Do not switch the power supply on and off within one second. It may cause failure.(2) Valve control signalThe MFC features a forced valve open/close input function.The connector pin No.1 is used to input the internal valve open/close signal. By inputting this signal, a forced opening/closing of the internal valve can be performed without depending on the value of the flow rate preset signal. When +15VDC is input: fully open When –15VDC is input: fully closed(3) Variable Range functionBy using one device of MFC, it is possible to modify multiple flow rate ranges and gas types. To modify the flow rate or the gas type, refer to the following VR corresponding chart or the calculation formula, and modify the variable range by the rotary switches (for analog control) or digital communications (for digitalcontrol).[Formula](standard flow rate) ÷ (desired flow rate) × (conversion factor) By using this function, the flow rate and gas type may be changed, however if a different gas is to be used, please consider the properties of the gas and confirm the responsiveness before usage. Also, in the case that the gas may cause debris or particle, please refrain from using it. If you have any questions of conversion factor, please contact us.(4) Digital interfaceThe MFC features the RS-485 or RS-232C (Note 5) digital interfaces. Manyspecial functions can be employed using the digital interfaces.Please refer to other manuals (Digital Interface Manual, Special FunctionManual Command Chart).11. Product warranty(1) PeriodThis product is guaranteed for a period of 1 year from date of shipment. Defects are repaired according to the following regulations.(2) ScopeWarranty coverage is restricted to this product only. Any other damage caused by an is not covered.(3) Disclaimer factsThe following repairs are not covered by the warranty:1) Failure caused by by-product of fluid used2) Failure caused by misuse (including careless operation) or incorrect repair ormodification3) Failure caused by dropping after purchasing4) Failure caused by a natural disastersEven if the warranty period is still in effect, the following items may not be repaired.1) In case of the product is returned with fluid remaining inside2) In case of what kind of fluid was not informed used on the productThe MFC is a precision instrument. Control may become unstable if electric noise, temperature change of fluid, pulsation of fluid pressure etc. occurs. Please be forewarned.This instruction manual is subject to revision without noticehttp://www.lintec-mfc.co.jpCorporate Headquarters4-1-23 Sekinotsu, Otsu City, Shiga Pref. 520-2277, JapanTEL.+81-(0)77-536-2210 FAX. +81-(0)77-536-2215Tokyo Branch Office3F Hattori Build., 4-30-14 Yotsuya Shinjyuku-ku Tokyo 160-0004, JapanTEL. +81-(0)3-5366-2801 FAX. +81-(0)3-3341-3513。
控制工程1(英文)
School of Automation,NUST 2011.9
Ch1 Introduction to Control system
1)Basic Concept of Control System 2)History and Development of Automatic Control 3)The Principle of Feedback Control 4)Basic Forms of Control System 5)Basic Components of Closed-loop system
1.6 Basic Requirements (Performance)
StabilityQuic源自ness Accuracy1.7 Classification of Control System
Open-loop and closed-loop system
Linear and nonlinear system
desired output comparison
actual output
controller
process
measurement
Closed-loop feedback system
1.4 Basic Forms of Control System
open-loop control system
output
input
Open-loop Control System
An open-loop Control System utilizes an actuating device to control the process directly without using feedback, as shown in the following Figure.
National Instruments TestStand序列编辑器用户手册说明书
Execution Object StructureExecution ObjectContains information TestStand needs to run a sequence, its steps, and any subsequences it calls. You can suspend,interactively debug, resume, terminate, or abort executions.Thread ObjectRepresents an independent path of control flow.Report ObjectContains the report text. The process model updates the Report object, and the sequence editor or user interface displays it.Call StackLists the chain of active sequences waiting for nestedsubsequences to complete. The first item in the call stack is the most-nested sequence invocation.Root SequenceContext ObjectRepresents the execution of the least-nested sequence invocation that contains a list of steps and calls to other sequences.SequenceContext ObjectRepresents the execution of a sequence that another sequence called.Current StepRepresents the executing step of the currently executingsequence in the call stack.Architecture OverviewTestStand Sequence EditorTestStand development environment for creating, modifying,executing, and debugging sequences.Custom User InterfacesCustomizable applications that, depending on mode,edit, execute, and debug test sequences on a test station. User interfaces are available in several different programming languages and include fullsource code, which allows you to modify them to meet specific needs.Process ModelsDefine the operations that occur for all test sequences,such as identifying the UUT, notifying the operator of pass/fail status, generating a test report, and logging results. TestStand includes three fully customizable process models: Sequential, Parallel, and er Interface ControlsA powerful set of ActiveX controls and support APIs for creating custom user interfaces.TestStand EngineA set of DLLs that provides an extensive ActiveX Automation API for controlling and interacting with TestStand. The TestStand Sequence Editor, User Interface Controls, and user interfaces use this API.Sequence File ExecutionsCreated by the TestStand Engine when you execute a test sequence using the sequence editor or a user interface.AdaptersAllow TestStand to call code modules in a variety of different formats and languages. Adapters also allow TestStand to integrate with various ADEs to streamline test code generation and debugging.Code ModulesProgram modules, such as LabVIEW VIs (.vi ) or Windows Dynamic Link Libraries (.dll ), that contain one or more functions that perform a specific test or action. TestStand adapters call code modules. Built-In Step TypesDefine the standard behaviors for common testing operations. Some step types use adapters to call code modules that return data to TestStand for furtheranalysis. Other step types perform standard operations,such as calling an executable or displaying dialog boxes.User-Defined Step TypesDefine a set of custom step properties and default behaviors for each step of that custom type. You can also define data types.TemplatesCreate custom sequences, steps, and variables to use as templates to build sequence files.OVERVIEW CARDNI TestStandTMSystem and ArchitectureNI TestStand is flexible test management software that offers the following major features:•Out-of-the-box configuration and components provide a ready-to-run, full-featured test management environment.•Numerous methods for modifying, configuring,and adding new components, which provide extensibility so you can create a test executive that meets specific requirements without altering the core TestStand Engine. You can upgrade to newer versions of TestStand without losing your customizations.•Sophisticated sequencing, execution, anddebugging capabilities, and a powerful sequence editor that is separate from the user interfaces.•User interface controls for creating custom user interfaces and sequence editors.•You can also create your own user interface in any programming language that can host ActiveX controls or control ActiveX automation servers.•Example user interfaces with source code for National Instruments LabVIEW, National Instruments LabWindows ™/CVI ™, Microsoft Visual Basic .NET, C#, and C++ (MFC).•An open language interface that provides support for many application development environments (ADEs). You can create code modules in a variety of ADEs and call pre-existing modules or executables.• A comprehensive application programminginterface for building multithreaded test systems and other sophisticated test applications.•Integration with third-party source code control packages.•Deployment tools to aid in transferring a test system from development to production.TestStand Sequence EditorCode ModulesResultsResultsResultsResultsResultsResultsResultsResultsCustom User InterfacesUser Interface (UI)ControlsApplication Programming Interface (API) TestStand EngineSequence File ExecutionsUser-Defined Step TypesSequence File ExecutionsNo ModelTest Socket 0Execution UUTUUTUUTTest Socket 1Execution UUTUUT TestSocket nExecution UUTUUTUUT UUT UUTUUTUUTUUTProcess Model Result ProcessingSchema DefinitionsDatabase LoggerReport GeneratorADO/ODBCThread Object 0Thread Object n Sequence File GlobalsStepsMain Step GroupStepsCleanup Step GroupParametersSequencesLocal VariablesAdapters.VI.DLL, .OBJ, .LIB, .C.DLL .DLL, .EXE .DLL, .EXE.PRG .SEQLabVIEW Adapter LabWindows/CVI Adapter C/C++ DLL Adapter .NET Adapter ActiveX/COM Adapter HTBasic Adapter Sequence AdapterTypesSequence FileParallel Process ModelBatch Process ModelSequential Process ModelProcess Model Sequence File ExecutionTestSocket nExecution Test Socket 1Execution TestSocket 0Execution Oracle . . .SQL ServerReport ObjectExecution ObjectCall StackRootSequenceContextObject 0SequenceContextObject 1SequenceContextObject nStep Object 0Step Object n. . .Current StepMicrosoft Access Process Models. ... ..XMLHTMLASCII-Text. . .Sequence File Execution FlowSequence File ExecutionsYou can execute a sequence directly, or you can execute a sequence file through a process model Execution entry point,such as Test UUTs and Single Pass.Process Model Sequence File ExecutionWhen you start an execution through a process modelExecution entry point, the process model defines how to test the UUTs. The Sequential model tests one UUT at a time. The Parallel model tests multiple independent test sockets at the same time. The Batch model tests a batch of UUTs using dependent test sockets.Process Model Result ProcessingThe TestStand Engine collects the results of each step that executes into a result list. Process models use the result list to generate reports and log data to databases. Unit Under Test (UUT)Device or component that you are testing.Test Socket ExecutionFor each test socket, or fixture, in the system, the Parallel and Batch models launch a separate test socket execution that controls the testing of UUTs in that test socket.Report GeneratorThe report generator traverses test results to create reports in XML, HTML, and ASCII-text formats. You can fully customize the reports.Schema DefinitionsSchema definitions define SQL statements, table definitions,and TestStand expressions that define how to log results to a database. You can fully customize the schemas.Database LoggerThe database logger traverses test results and exports data into database tables using schema definitions.Sequence File StructureSequence FileContains any number of sequences, a set of data types and step types the sequence file uses, and any global variables that sequences in the sequence file share.SequencesContain groups of steps, local variables, and parameters used for passing data between steps and subsequences.TypesSequence files contain definitions of all data types and step types that its sequences use. Variables and properties in a sequence are instances of data types. Steps in a sequence are instances of step types.Sequence File GlobalsStore data you want to access from any sequence or step within the sequence file in which you define the sequence file global variable.Setup, Main, Cleanup Step GroupsTestStand executes the steps in the Setup step group first,the Main step group next, and the Cleanup step group last.By default, a sequence moves to the Cleanup step group when a step generates an error in the Setup or Main step group.Local VariablesStore data relevant to the execution of the sequence. You can access local variables from within steps and code modules defined in a sequence.ParametersUse parameters to exchange data between calling and called sequences.StepsPerform built-in operations or call code modules. A step is an instance of a step type, which defines a set of step properties and default behaviors for each step.373457B-01 Apr07. . .. . .. . .National Instruments, NI, , NI TestStand, and LabVIEW are trademarks of National Instruments Corporation. Refer to the Terms of Use section on /legal for more information aboutNational Instruments trademarks. Other product and company names mentioned herein are trademarks or trade names of their respective companies. For patents covering National Instruments products,refer to the appropriate location: Help»Patents in your software, the patents.txt file on your CD, or /patents .© 2003–2007 National Instruments Corporation. All rights reserved.Printed in Ireland.StepsSetup Step GroupTemplatesFlow Control Sequence Call Statement LabelMessage Popup Call Executable Property Loader FTP FilesSynchronization Steps Database Steps IVI-C Steps LabVIEW UtilityPass/Fail Test Numeric Limit Test Multiple Numeric Limit Test String Value Test Action Built-In Step TypesYou can use the fully customizable TestStand developmentenvironment to create, modify, execute, and debug sequences. You can also use the sequence editor to modify step types and process models. You can customize the environment by docking, auto-hiding, and floating panes to optimize your development tasks. TheDevelopment EnvironmentOVERVIEW CARD NI TestStand TMSystem and ArchitectureTestStand includes separate user interface applications developed in LabVIEW, LabWindows/CVI, Microsoft Visual Basic .NET,C#, and C++ (MFC). Because TestStand includes the source code for each user interface, you can fully customize the userinterfaces. You can also create your own user interface using any programming language that can host ActiveX controls orcontrol ActiveX automation servers. With the user interfaces in operator mode, you can start multiple concurrent executions, set breakpoints, and single-step. In editor mode, you can modify sequences, display sequence variables, sequence parameters,step properties, and so on.TestStand Sequence Editor Overview User Interface OverviewPrinted DocumentationNI TestStand Quick Start GuideUse this document for system requirements andinstallation instructions. This document also contains information about the different TestStand licensing options.NI TestStand Release NotesUse this document to learn about new features and upgrade information.Using TestStandUse this manual to familiarize yourself with the TestStand environment and the basic features you use to build and run test sequences.Using LabVIEW with TestStandUse this manual in conjunction with the Using TestStand manual to learn how to use LabVIEW with ing LabWindows/CVI with TestStandUse this manual in conjunction with the Using TestStand manual to learn how to use LabWindows/CVI with TestStand.NI TestStand Reference ManualUse this manual to learn about TestStand concepts,architecture, and features.Online HelpNI TestStand HelpUse this help file to learn more about the TestStand environment and the TestStand User Interface Controls and Engine APIs. The NI TestStand Help also includes basic information about using an ActiveX automation server.NI TestStand VIs and Functions HelpUse this help file to learn more about TestStand-specific VIs and functions. This help file is accessible only from LabVIEW.Cards and PostersNI TestStand User Interface Controls Reference Poster Use this poster to learn about the controls available for writing custom user interfaces for TestStand.NI TestStand API Reference PosterUse this poster as an overview of the TestStand API. This poster lists the properties, objects, methods, and APIinheritance of the TestStand API.L i s t B a r Lists the currentlyopen sequence files and executions.S e q u e n c e F i l e W i n d o wE x e c u t i o n V i e wR e p o r t V i e wS e q u e n c e V i e wLists steps in the sequence and step group for the sequence file you select in the list bar.Displays the threads,call stack, and steps for the execution you select.Displays the report for the execution you select.Displays sequences and other items in a sequence Displays the threads,call stack, and stepsthat an execution runs.When executioncompletes, displays thereport for theexecution.User Manager WindowAdministers groups, users,login names, pass-words, and privi-leges.UsersDisplays users for the test station. Output Pane Displays output messages that expressions and code modules post to theTestStand Engine.Call Stack Pane Displays the nested sequence invocations for the thread you select.sequence editor provides familiar LabVIEW, LabWindows/CVI, and Microsoft Visual Studio .NET debugging tools, including breakpoints, single-stepping, stepping into or over function calls, tracing, a Variables pane, and a Watch View pane. In the TestStand Sequence Editor, you can start multiple concurrent executions, execute multiple instances of the same sequence, and execute different sequences at the same time. Separate Execution windows display each execution. In trace mode, the Execution window displays the steps in the currently executing sequence. When you suspend an execution, the Execution window displays the next step to execute and provides single-stepping options.Templates List Organizes custom sequences, steps,and variables you can use as templates for building sequence files.Step Settings PaneSpecifies the settings for the step, such as code module parameters, switching, flow control, and post actions.Variables Pane Displays the variables andproperties, including the values, that steps can access at run time.StepPerforms built-in operations or calls code modules.ProjectOrganizes sequence files and code module files in folders.Workspace PaneManages projects for source code control (SCC) integration and deployment. TestStand inte-grates with third-party SCC pack-ages to add files, obtain the lat-est versions of files, and check files in and out.Watch View Pane Monitors the values of specifiedvariables, properties,and expressions during an execution.Threads Pane Contains a list of threads in the current execution.Insertion Palette Displays step types and templates you can insert into sequence files.GroupsDisplays groups that users belong to.。
sae_j2534-1_2004
SURFACEVEHICLERECOMMENDED PRACTICESAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefrom, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions.Copyright © 2004 SAE InternationalAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE.TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada)Tel: 724-776-4970 (outside USA)SAE J2534-1 Revised DEC2004TABLE OF CONTENTS 1. Scope (5)2. References (5)2.1 Applicable Documents (5)2.1.1 SAE Publications (5)2.1.2 ISO Documents (6)3. Definitions (6)4. Acronyms (6)5. Pass-Thru C oncept (7)6. Pass-Thru System Requirements (8)6.1 P C Requirements (8)6.2 Software Requirements and Assumptions (8)6.3 Connection to PC (9)6.4 Connection to Vehicle............................................................................................................9 6.5 C ommunication Protocols (9)6.5.1 ISO 9141................................................................................................................................9 6.5.2 ISO 14230-4 (KWP2000).. (10)6.5.3 SAE J1850 41.6 kbps PWM (Pulse Width Modulation) (10)6.5.4 SAE J1850 10.4 kbps VPW (Variable Pulse Width) (10)6.5.5 C AN (11)6.5.6 ISO 15765-4 (CAN) (11)6.5.7 SAE J2610 DaimlerChrysler SCI (11)6.6 Simultaneous Communication on Multiple Protocols (11)6.7 Programmable Power Supply (12)6.8 Pin Usage (13)6.9 Data Buffering (14)6.10 Error Recovery (14)6.10.1 Device Not Connected (14)6.10.2 Bus Errors (14)7. Win32 Application Programming Interface (15)7.1 API Functions – Overview (15)7.2 API Functions - Detailed Information (15)7.2.1 PassThruOpen (15)7.2.1.1 C /C ++ Prototype (15)7.2.1.2 Parameters (16)7.2.1.3 Return Values (16)7.2.2 PassThru C lose (16)7.2.2.1 C /C ++ Prototype (16)7.2.2.2 Parameters (16)7.2.2.3 Return Values (17)7.2.3 PassThru C onnect (17)7.2.3.1 C /C ++ Prototype (17)7.2.3.2 Parameters (17)7.2.3.3 Flag Values (18)7.2.3.4 Protocal ID Values (19)SAE J2534-1 Revised DEC20047.2.3.5 Return Values (20)7.2.4 PassThruDisconnect............................................................................................................20 7.2.4.1 C /C ++ Prototype (20)7.2.4.2 Parameters (21)7.2.4.3 Return Values ......................................................................................................................21 7.2.5 PassThruReadMsgs. (21)7.2.5.1 C /C ++ Prototype (22)7.2.5.2 Parameters...........................................................................................................................22 7.2.5.3 Return Values . (23)7.2.6 PassThruWriteMsgs (23)7.2.6.1 C /C ++ Prototype ..................................................................................................................24 7.2.6.2 Parameters (24)7.2.6.3 Return Values (25)7.2.7 PassThruStartPeriodicMsg..................................................................................................26 7.2.7.1 C /C ++ Prototype (26)7.2.7.2 Parameters (26)7.2.7.3 Return Values ......................................................................................................................27 7.2.8 PassThruStopPeriodicMsg .. (27)7.2.8.1 C /C ++ Prototype (28)7.2.8.2 Parameters...........................................................................................................................28 7.2.8.3 Return Values . (28)7.2.9 PassThruStartMsgFilter.......................................................................................................28 7.2.9.1 C /C ++ Prototype (31)7.2.9.2 Parameters (31)7.2.9.3 Filter Types ..........................................................................................................................32 7.2.9.4 Return Values . (33)7.2.10 PassThruStopMsgFIlter (33)7.2.10.1 C /C ++ Prototype ..................................................................................................................33 7.2.10.2 Parameters (34)7.2.10.3 Return Values (34)7.2.11 PassThruSetProgrammingVoltage (34)7.2.11.1 C /C ++ Prototype (34)7.2.11.2 Parameters (35)7.2.11.3 Voltage Values (35)7.2.11.4 Return Values (35)7.2.12 PassThruReadVersion (36)7.2.12.1 C /C ++ Prototype (36)7.2.12.2 Parameters (36)7.2.12.3 Return Values (37)7.2.13 PassThruGetLastError (37)7.2.13.1 C /C ++ Prototype (37)7.2.13.2 Parameters (37)7.2.13.3 Return Values (37)7.2.14 PassThruIoctl (38)7.2.14.1 C /C ++ Prototype (38)7.2.14.2 Parameters (38)7.2.14.3 Ioctl ID Values (39)7.2.14.4 Return Values (39)7.3 IO C TL Section (40)7.3.1 GET_C ONFIG (41)7.3.2 SET_C ONFIG (42)SAE J2534-1 Revised DEC20047.3.3 READ_VBATT (46)7.3.4 READ_PROG_VOLTAGE....................................................................................................46 7.3.5 FIVE_BAUD_INIT . (47)7.3.6 FAST_INIT (47)7.3.7 C LEAR_TX_BUFFER (48)7.3.8 C LEAR_RX_BUFFER (48)7.3.9 C LEAR_PERIODI C _MSGS (49)7.3.10 C LEAR_MSG_FILTERS (49)7.3.11 C LEAR_FUN C T_MSG_LOOKUP_TABLE (49)7.3.12 ADD_TO_FUN C T_MSG_LOOKUP_TABLE (50)7.3.13 DELETE_FROM_FUN C T_MSG_LOOKUP_TABLE (50)8. Message Structure (51)8.1 C /C ++ Definition (51)8.2 Elements (51)8.3 Message Data Formats (52)8.4 Format Checks for Messages Passed to the API (53)8.5 Conventions for Returning Messages from the API (53)8.6 Conventions for Returning Indications from the API (53)8.7 Message Flag and Status Definitions..................................................................................54 8.7.1 RxStatus. (54)8.7.2 RxStatus Bits for Messaging Status and Error Indication....................................................55 8.7.3 TxFlags.................................................................................................................................56 9. DLL Installation and Registry...............................................................................................57 9.1 Naming of Files....................................................................................................................57 9.2 Win32 Registy. (57)9.2.1 User Application Interaction with the Registry (59)9.2.2 Attaching to the DLL from an application (60)9.2.2.1 Export Library Definition File (61)10. Return Value Error Codes (61)11. Notes (63)11.1 Marginal Indicia (63)Appendix A General ISO 15765-2 Flow Control Example (64)A.1 Flow Control Overview (64)A.1.1 Examples Overview (65)A.2 Transmitting a Segmented Message (66)A.2.1 C onversation Setup (66)A.2.2 Data Transmission (67)A.2.3 Verification (68)A.3 Transmitting an Unsegmented Message (69)A.3.1 Data Transmission (70)A.3.2 Verification (70)A.4 Receiving a Segmented Message (70)A.4.1 C onversation Setup (70)A.4.2 Reception Notification (70)A.4.3 Data Reception (71)A.5 Receiving and Unsegmented Messages (72)1.ScopeThis SAE Recommended Practice provides the framework to allow reprogramming software applications from all vehicle manufacturers the flexibility to work with multiple vehicle data link interface tools from multiple tool suppliers. This system enables each vehicle manufacturer to control the programming sequence for electronic control units (EC Us) in their vehicles, but allows a single set of programming hardware and vehicle interface to be used to program modules for all vehicle manufacturers.This document does not limit the hardware possibilities for the connection between the PC used for the software application and the tool (e.g., RS-232, RS-485, USB, Ethernet…). Tool suppliers are free to choose the hardware interface appropriate for their tool. The goal of this document is to ensure that reprogramming software from any vehicle manufacturer is compatible with hardware supplied by any tool manufacturer.U.S. Environmental Protection Agency (EPA) and the C alifornia Air Resources Board (ARB) "OBD service information" regulations include requirements for reprogramming emission-related control modules in vehicles for all manufacturers by the aftermarket repair industry. This document is intended to conform to those regulations for 2004 and later model year vehicles. For some vehicles, this interface can also be used to reprogram emission-related control modules in vehicles prior to the 2004 model year, and for non-emission related control modules. For other vehicles, this usage may require additional manufacturer specific capabilities to be added to a fully compliant interface. A second part to this document, SAE J2534-2, is planned to include expanded capabilities that tool suppliers can optionally include in an interface to allow programming of these additional non-mandated vehicle applications. In addition to reprogramming capability, this interface is planned for use in OBD compliance testing as defined in SAE J1699-3. SAE J2534-1 includes some capabilities that are not required for Pass-Thru Programming, but which enable use of this interface for those other purposes without placing a significant burden on the interface manufacturers.Additional requirements for future model years may require revision of this document, most notably the inclusion of SAE J1939 for some heavy-duty vehicles. This document will be reviewed for possible revision after those regulations are finalized and requirements are better understood. Possible revisions include SAE J1939 specific software and an alternate vehicle connector, but the basic hardware of an SAE J2534 interface device is expected to remain unchanged.2.References2.1Applicable PublicationsThe following publications form a part of this specification to the extent specified herein. Unless otherwise indicated, the latest version of SAE publications shall apply.2.1.1SAE P UBLICATIONSAvailable from SAE, 400 Commonwealth Drive, Warrendale, PA 15096-0001.SAE J1850—Class B Data Communications Network InterfaceSAE J1939—Truck and Bus Control and Communications Network (Multiple Parts Apply)SAE J1962—Diagnostic ConnectorSAE J2610—DaimlerChrysler Information Report for Serial Data Communication Interface (SCI)2.1.2 ISO D OCUMENTSAvailable from ANSI, 25 west 43rd Street, New York, NY 10036-8002.ISO 7637-1:1990—Road vehicles—Electrical disturbance by conduction and coupling—Part 1:Passenger cars and light commercial vehicles with nominal 12 V supply voltageISO 9141:1989—Road vehicles—Diagnostic systems—Requirements for interchange of digital informationISO 9141-2:1994—Road vehicles—Diagnostic systems—C ARB requirements for interchange of digitalinformationISO 11898:1993—Road vehicles—Interchange of digital information—Controller area network (CAN) forhigh speed communicationISO 14230-4:2000—Road vehicles—Diagnostic systems—Keyword protocol 2000—Part 4:Requirements for emission-related systemsISO/FDIS 15765-2—Road vehicles—Diagnostics on controller area networks (C AN)—Network layerservicesISO/FDIS 15765-4—Road vehicles—Diagnostics on controller area networks (C AN)—Requirements foremission-related systems3.Definitions 3.1 RegistryA mechanism within Win32 operating systems to handle hardware and software configuration information.4. AcronymsAPI Application Programming InterfaceASCII American Standard Code for Information InterchangeCAN Controller Area NetworkC R C C yclic Redundancy C heckDLL Dynamic Link LibraryECU Electronic Control UnitIFR In-Frame ResponseIOCTL Input / Output ControlKWP Keyword ProtocolOEM Original Equipment ManufacturerP C Personal C omputerPWM Pulse Width ModulationSCI Serial Communications InterfaceSCP Standard Corporate ProtocolUSB Universal Serial BusVPW Variable Pulse Width5.Pass-Thru ConceptProgramming application software supplied by the vehicle manufacturer will run on a commonly available generic PC. This application must have complete knowledge of the programming requirements for the control module to be programmed and will control the programming event. This includes the user interface, selection criteria for downloadable software and calibration files, the actual software and calibration data to be downloaded, the security mechanism to control access to the programming capability, and the actual programming steps and sequence required to program each individual control module in the vehicle. If additional procedures must be followed after the reprogramming event, such as clearing Diagnostic Trouble C odes (DTC), writing part numbers or variant coding information to the control module, or running additional setup procedures, the vehicle manufacturer must either include this in the PC application or include the necessary steps in the service information that references reprogramming.This document defines the following two interfaces for the SAE J2534 pass-thru device:a. Application program interface (API) between the programming application running on a PC and asoftware device driver for the pass-thru deviceb. Hardware interface between the pass-thru device and the vehicleThe manufacturer of an SAE J2534 pass-thru device shall supply connections to both the PC and the vehicle. In addition to the hardware, the interface manufacturer shall supply device driver software, and a Windows installation and setup application that will install the manufacturer's SAE J2534 DLL and other required files, and also update the Windows Registry. The interface between the PC and the pass-thru device can be any technology chosen by the tool manufacturer, including RS-232, RS-485, USB, Ethernet, or any other current or future technology, including wireless technologies.All programming applications shall utilize the common SAE J2534 API as the interface to the pass-thru device driver. The API contains a set of routines that may be used by the programming application to control the pass-thru device, and to control the communications between the pass-thru device and the vehicle. The pass-thru device will not interpret the message content, allowing any message strategy and message structure to be used that is understood by both the programming application and the ECU being programmed. Also, because the message will not be interpreted, the contents of the message cannot be used to control the operation of the interface. For example, if a message is sent to the ECU to go to high speed, a specific instruction must also be sent to the interface to go to high speed.The OEM programming application does not need to know the hardware connected to the PC, which gives the tool manufacturers the flexibility to use any commonly available interface to the PC. The pass-thru device does not need any knowledge of the vehicle or control module being programmed. This will allow all programming applications to work with all pass-thru devices to enable programming of all control modules for all vehicle manufacturers.The interface will not handle the tester present messages automatically. The OEM application is responsible to handle tester present messages.6.3Connection to PCThe interface between the PC and the pass-thru device shall be determined by the manufacturer of the pass-thru device. This can be RS-232, USB, Ethernet, IEEE1394, Bluetooth or any other connection that allows the pass-thru device to meet all other requirements of this document, including timing requirements. The tool manufacturer is also required to include the device driver that supports this connection so that the actual interface used is transparent to both the PC programming application and the vehicle.6.4Connection to VehicleThe interface between the pass-thru device and the vehicle shall be an SAE J1962 connector for serial data communications. The maximum cable length between the pass-thru device and the vehicle is five (5) meters. The interface shall include an insulated banana jack that accepts a standard 0.175" diameter banana plug as the auxiliary pin for connection of programming voltage to a vehicle specific connector on the vehicle.If powered from the vehicle, the interface shall:a. operate normally within a vehicle battery voltage range of 8.0 to 18.0 volts D.C.,b. survive a vehicle battery voltage of up to 24.0 volts D.C. for at least 10 minutes,c. survive, without damage to the interface, a reverse vehicle battery voltage of up to 24.0 volts D.C. forat least 10 minutes.6.5Communication ProtocolsThe following communication protocols shall be supported:6.5.1ISO9141The following specifications clarify and, if in conflict with ISO 9141, override any related specifications in ISO 9141:a. The maximum sink current to be supported by the interface is 100 mA.b. The range for all tests performed relative to ISO 7637-1 is –1.0 to +40.0 V.c. The default bus idle period before the interface shall transmit an address, shall be 300 ms.d. Support following baud rate with ±0.5% tolerance: 10400.e. Support following baud rate with ±1% tolerance: 10000.f. Support following baud rates with ±2% tolerance: 4800, 9600, 9615, 9800, 10870, 11905, 12500,13158, 13889, 14706, 15625, and 19200.g. Support other baud rates if the interface is capable of supporting the requested value within ±2%.h. The baud rate shall be set by the application, not determined by the SAE J2534 interface. Theinterface is not required to support baud rate detection based on the synchronization byte.i. Support odd and even parity in addition to the default of no parity, with seven or eight data bits.Always one start bit and one stop bit.j. Support for timer values that are less than or greater than those specified in ISO 9141 (see Figure 30 in Section 7.3.2).k. Support ability to disable automatic ISO 9141-2 / ISO 14230 checksum verification by the interface to allow vehicle manufacturer specific error detection.l. If the ISO 9141 checksum is verified by the interface, and the checksum is incorrect, the message will be discarded.m. Support both ISO 9141 5-baud initialization and ISO 14230 fast initialization.n. Interface shall not adjust timer parameters based on keyword values.6.5.2ISO14230-4(KWP2000)The ISO 14230 protocol has the same specifications as the ISO 9141 protocol as outlined in the previous section. In addition, the following specifications clarify and, if in conflict with ISO 14230, override any related specifications in ISO 14230:a. The pass-thru interface will not automatically handle tester present messages. The application needsto handle tester present messages when required.b. The pass-thru interface will not perform any special handling for the $78 response code. Anymessage received with a $78 response code will be passed from the interface to the application. The application is required to handle any special timing requirements based on receipt of this response code, including stopping any periodic messages.6.5.3SAE J185041.6 KBPS PWM(P ULSE W IDTH M ODULATION)The following additional features of SAE J1850 must be supported by the pass-thru device:a. Capable of 41.6 kbps and high speed mode of 83.3 kbps.b. Recommend Ford approved SAE J1850PWM (SCP) physical layer6.5.4SAE J185010.4 KBPS VPW(V ARIABLE P ULSE W IDTH)The following additional features of SAE J1850 must be supported by the pass-thru device:a. Capable of 10.4 kbps and high speed mode of 41.6 kbpsb. 4128 byte block transferc. Return to normal speed after a break indication6.5.5CANThe following features of ISO 11898 (CAN) must be supported by the pass-thru device:a. 125, 250, and 500 kbpsb. 11 and 29 bit identifiersc. Support for 80% ± 2% and 68.5% ± 2% bit sample pointd. Allow raw C AN messages. This protocol can be used to handle any custom C AN messagingprotocol, including custom flow control mechanisms.6.5.6ISO15765-4(CAN)The following features of ISO 15765-4 must be supported by the pass-thru device:a. 125, 250, and 500 kbpsb. 11 and 29 bit identifiersc. Support for 80% ± 2% bit sample pointd. To maintain acceptable programming times, the transport layer flow control function, as defined inISO 15765-2, must be incorporated in the pass-thru device (see Appendix A). If the application does not use the ISO 15765-2 transport layer flow control functionality, the CAN protocol will allow for any custom transport layer.e. Receive a multi-frame message with an ISO15765_BS of 0 and an ISO15765_STMIN of 0, asdefined in ISO 15765-2.f. No single frame or multi-frame messages can be received without matching a flow control filter. Nomulti-frame messages can be transmitted without matching a flow control filter.g. Periodic messages will not be suspended during transmission or reception of a multi-framesegmented message.6.5.7SAE J2610D AIMLER C HRYSLER SCIReference the SAE J2610 Information Report for a description of the SCI protocol.When in the half-duplex mode (when SCI_MODE of TxFlags is set to {1} Half-Duplex), every data byte sent is expected to be "echoed" by the controller. The next data byte shall not be sent until the echo byte has been received and verified. If the echoed byte received doesn't match the transmitted byte, or if after a period of T1 no response was received, the transmission will be terminated. Matching echoed bytes will not be placed in the receive message queue.6.6Simultaneous Communication On Multiple ProtocolsThe pass-thru device must be capable of supporting simultaneous communication on multiple protocols during a single programming event. Figure 2 indicates which combinations of protocols shall be supported. If SC I (SAE J2610) communication is not required during the programming event, the interface shall be capable of supporting one of the protocols from data link set 1, data link set 2, and data link set 3. If SC I (SAE J2610) communication is required during the programming event, the interface shall be capable of supporting one of the SCI protocols and one protocol from data link set 1.6.9Data BufferingThe interface/API shall be capable of receiving 8 simultaneous messages. For ISO 15765 these can be multi-frame messages. The interface/API shall be capable of buffering a maximum length (4128 byte) transmit message and a maximum length (4128 byte) receive message.6.10Error Recovery6.10.1D EVICE N OT C ONNECTEDIf the DLL returns ERR_DEVICE_NOT_CONNECTED from any function, that error shall continue to be returned by all functions, even if the device is reconnected. An application can recover from this error condition by closing the device (with PassThruC lose) and re-opening the device (with PassThruOpen, getting a new device ID).6.10.2B US E RRORSAll devices shall handle bus errors in a consistent manner. There are two error strategies: Retry and Drop.The Retry strategy will keep trying to send a packet until successful or stopped by the application. If loopback is on and the message is successfully sent after some number of retries, only one copy of the message shall be placed in the receive queue. Even if the hardware does not support retries, the firmware/software must retry the transmission. If the error condition persists, a blocking write will wait the specified timeout and return ERR_TIMEOUT. The DLL must return the number of successfully transmitted messages in pNumMsgs. The DLL shall not count the message being retried in pNumMsgs. After returning from the function, the device does not stop the retries. The only functions that will stop the retries are PassThruDisconnect (on that protocol), PassThruC lose, or PassThruIoctl (with an IoctllD of CLEAR_TX_BUFFER).Devices shall use the Retry strategy in the following scenarios:•All CAN errors, such as bus off, lack of acknowledgement, loss of arbitration, and no connection (lack of terminating resistor)•SAE J1850PWM or SAE J1850VPW bus fault (bus stuck passive) or loss of arbitration (bus stuck active)The Drop strategy will delete a message from the queue. The message can be dropped immediately on noticing an error or at the end of the transmission. PassThruWriteMsg shall treat dropped messages the same as successfully transmitted messages. However, if loopback is on, the message shall not be placed in the receive queue.Devices shall use the Drop strategy in the following scenarios:•If characters are echoed improperly in SCI•Corrupted ISO 9141 or ISO 14230 transmission•SAE J1850PWM lack of acknowledgement (Exception: The device must try sending the message 3 times before dropping)7.2.5.1 C / C++ Prototypeextern “C” long WINAPI PassThruReadMsgs(unsigned long ChannelID,*pMsg,PASSTHRU_MSGunsigned long *pNumMsgs,unsigned long Timeout)7.2.5.2ParametersChannelID The channel ID assigned by the PassThruConnect function.pMsg Pointer to message structure(s).pNumMsgs Pointer to location where number of messages to read is specified. On return from the function this location will contain the actual number of messages read.Timeout Read timeout (in milliseconds). If a value of 0 is specified the function retrieves up to pNumMsgs messages and returns immediately. Otherwise, the API will not return untilthe Timeout has expired, an error has occurred, or the desired number of messageshave been read. If the number of messages requested have been read, the functionshall not return ERR_TIMEOUT, even if the timeout value is zero.When using the ISO 15765-4 protocol, only SingleFrame messages can be transmitted without a matching flow control filter. Also, P I bytes are transparently added by the API. See PassThruStartMsgFilter and Appendix A for a discussion of flow control filters.7.2.6.1 C / C++ Prototypeextern “C” long WINAPI PassThruWriteMsgs(u nsigned long ChannelID,*pMsg,PASSTHRU_MSGunsigned long *pNumMsgs,unsigned long Timeout)7.2.6.2ParametersChannelID The channel ID assigned by the PassThruConnect function.pMsg Pointer to message structure(s).pNumMsgs Pointer to the location where number of messages to write is specified. On return will contain the actual number of messages that were transmitted (when Timeout is non-zero) or placed in the transmit queue (when Timeout is zero).Timeout Write timeout (in milliseconds). When a value of 0 is specified, the function queues as many of the specified messages as possible and returns immediately. When a valuegreater than 0 is specified, the function will block until the Timeout has expired, an errorhas occurred, or the desired number of messages have been transmitted on the vehiclenetwork. Even if the device can buffer only one packet at a time, this function shall beable to send an arbitrary number of packets if a Timeout value is supplied. Since thefunction returns early if all the messages have been sent, there is normally no penalty forhaving a large timeout (several seconds). If the number of messages requested havebeen written, the function shall not return ERR_TIMEOUT, even if the timeout value iszero.W hen an ERR_TIMEOUT is returned, only the number of messages that were sent onthe vehicle network is known. The number of messages queued is unknown. Applicationwriters should avoid this ambiguity by using a Timeout value large enough to work onslow devices and networks with arbitration delays.。
SciLog TFF Con
The SciLog TFF Confi gurable System is a fullyautomated tangential fl ow fi ltration system capable of utilizing any brand of hollow fi ber or cassette in a single use or reusable format. The modular system design allows it to be tailored to your process specifi cations.Parker’s years of industry experience in engineering and building Tangential Flow Filtration (TFF) systems have allowed us to streamline the design and build process. This enables Parker to deliver confi gured systems with the same lead times as standard competitor ing a modular system design, components can be easily switched to fi t process specifi cations. Each component is independently validated and integrated using standard industry automation practices (S88).SciLog TFF Systems are also available as commercial off-the-shelf systems in low, medium, and high fl ow standard formats.Features and Benefi ts• Capable of processing at fl ow rates of 0.2-83 L/min depending on format • Operating pressure up to 60 PSI• Suitable for ultrafi ltration (3kD-750kD) and microfi ltration (750 kD- 0.65µm) applications and comes standard with diafi ltration capabilities • Recipe based control of process in either discrete steps or batch mode • Touch-screen HMI with intuitive graphical interface • Fully programmable alarms and interlocks• 21CFR Part 11 Ready• Easy integration into DCS/SCADA systems• Direct connection to scales and mixers or integration via DCS • User access level control via local or active directory • Minimizes retentate vessel size using batch fedconcentration mode • Systems and manifolds designed in tandem to minimize hold up • Smallest footprint on the marketNote: SciLog is a registered trademark of Parker Hannifin Corporation.Sample Manifold Design Control OptionsSciLog TFF Systems can be operated as a standalone system with process control, data collection and user levels remaining on the local system.Parker has experience integrating systems with all major plant control systems using OPC, Profi bus and Ethernet IPcommunication protocols.TFF Permeate Cassette ManifoldTFF High Flow Retentate Manifold• Parker SciSoft • DeltaV• Wonderware • Siemens S7Parker’s single-use manifolds are designed and manufactured tooptimize the filtration process and minimize product loss. Overmolded connections are used to prevent leaks in areas of high pressure. Parker will incorporate any components specified regardless of manufacturer and can supply the manifolds gamma irradiated.Documentation and SupportIncluded with System • FAT and SAT• Hands-on training at FAT • Certificate of Compliance • System operations manual• P&ID and General Arrangement Drawing with P&ID Callouts • Electrical schematic • Calibration certificates• Critical spares list with manuals or datasheets • Frame material certificatesAdditional Options •GAMP document packageIncludes:- Functional specification- Sofware design specification - Hardware design specification - IQ/OQ document package• Service package • On-site training • IQ/OQ document package •PQ document packageSpecifi cationsOrdering Information **************************************************************************************************************DS_P_TFF-C_04/21 Rev. 1BParker Bioscience Filtration has a continuous policy of product development and although the company reserves the right to change specifi cations, it attempts to keep customersinformed of any alterations. This publication is for general information only and customers are requested to contact their local sales representative for detailed information and advice on a products suitability for specifi c applications. All products are sold subject to the company’s standard conditions of sale.E u r o p e : ✆ +44 (0)191 4105121 b i o p r o c e s s .e m e a @p a r k e r .c o m - N o r t h A m e r i c a : ✆ t o l l f r e e 877 784 2234 ✆ +1 805 604 3400 b i o s c i e n c e .n a @p a r k e r .c o m w w w .p a r k e r .c o m /b i o s c i e n c e。
瓶颈管理的学习-英文版
瓶颈管理的学习-英文版Bottleneck management is an essential aspect of business operations that involves identifying and removing any obstacles that hinder the smooth flow of production. It is a critical concept to understand in order to improve efficiency and maximize productivity. In this article, we will discuss the importance of bottleneck management and how businesses can effectively implement it.First and foremost, understanding the concept of bottlenecks is crucial. In a business setting, a bottleneck refers to any process or resource that constrains the overall capacity of a system. It is the slowest or lowest-capacity part of a process that limits the rate at which the entire system can produce its output. Identifying bottlenecks is essential to address and resolve productivity issues and ensure a seamless production flow.One of the main reasons why bottleneck management is essential is because it helps to optimize resource utilization. By identifying and resolving bottlenecks, businesses can ensure that resources are used to their full potential. This in turn leads to improved efficiency and reduced costs. For example, if a manufacturing plant identifies a bottleneck in the production line causing a delay, they can address it by either increasing the capacity of that particular machine or finding alternative ways to bypass it. This optimization of resources ensures that the business is operating at its maximum potential.Another significant benefit of bottleneck management is that it enables businesses to prioritize their efforts. By identifying themain bottlenecks, businesses can focus their resources on improving those specific areas. This allows for a more targeted and effective approach towards process improvement. Prioritizing the resolution of bottlenecks ensures that the most critical issues are addressed first, leading to faster and more noticeable improvements in productivity.Additionally, bottleneck management helps to improve overall quality control. When a bottleneck is present, it often leads to a backlog of work. This can cause rushed production and an increased chance of errors or defects. By identifying and addressing bottlenecks, businesses can reduce the likelihood of such issues occurring. Ultimately, this leads to improved product quality and customer satisfaction.Implementing effective bottleneck management strategies requires a structured approach. Here are some steps businesses can take to ensure successful implementation:1. Identify and prioritize bottlenecks: Evaluate various processes and resources to identify the main bottlenecks. Prioritize them based on their impact on overall efficiency.2. Analyze causes: Determine the root cause of each bottleneck. This may require data analysis, process mapping, or input from employees familiar with the specific area.3. Develop a plan: Once the root cause is known, develop a plan to address each bottleneck. This may involve process redesign, resource allocation, or investment in new technology.4. Monitor progress: Implement the proposed solutions and closely monitor their impact. Regularly review and adjust the plan as needed to ensure continuous improvement.5. Repeat the process: Bottlenecks can evolve over time as business needs change. It is important to regularly revisit bottleneck management strategies to identify new obstacles and address them promptly.In conclusion, bottleneck management is a critical aspect of business operations. By identifying and resolving bottlenecks, businesses can improve efficiency, optimize resource utilization, and enhance overall productivity. Implementing effective bottleneck management strategies requires a structured approach that involves identifying and prioritizing bottlenecks, analyzing their causes, developing a plan, monitoring progress, and continuously reassessing for new bottlenecks. By focusing on bottleneck management, businesses can ensure a smooth and efficient production flow, leading to improved quality and customer satisfaction.Certainly! Here are some additional points and elaborations to further discuss bottleneck management:1. Increases Overall Throughput: Bottleneck management is crucial for increasing the overall throughput of a system or process. By identifying and resolving bottlenecks, businesses can speed up the rate at which products or services are produced, leading to higher customer satisfaction and potentially increased revenue. This is particularly important in industries with high demand and fast-paced markets.2. Enhances Capacity Planning: Effective bottleneck management allows businesses to better plan and allocate their resources. By understanding where the bottlenecks occur and how they impact the overall system, businesses can make informed decisions about resource allocation, such as investing in additional machinery or increasing staffing levels in specific areas. This proactive approach to capacity planning helps businesses meet demand and avoid unnecessary costs.3. Facilitates Continuous Improvement: Bottleneck management is closely tied to the concept of continuous improvement. By regularly assessing and addressing bottlenecks, businesses can identify areas for improvement and implement changes to boost efficiency. This continuous improvement mindset helps businesses stay competitive in a dynamic marketplace and adapt to changing customer needs and industry trends.4. Promotes Cross-functional Collaboration: Resolving bottlenecks often requires collaboration across different departments or functions within a business. Bottlenecks can arise from various areas such as production, logistics, quality control, or supply chain management. By involving the relevant stakeholders and working together to identify and resolve bottlenecks, businesses can foster a culture of collaboration and enhance teamwork within the organization.5. Utilizes Lean Principles: Bottleneck management aligns with the principles of lean manufacturing and lean management. The focus on identifying value-added activities, eliminating waste, andoptimizing the flow of operations are core principles of lean thinking. By integrating bottleneck management into lean initiatives, businesses can streamline their processes, reduce lead times, and improve overall efficiency.6. Considers Real-time Data Analysis: To effectively manage bottlenecks, businesses need access to timely and accurate data. Real-time data analysis allows organizations to monitor key performance indicators (KPIs), identify bottlenecks as they occur, and make informed decisions quickly. Implementing data-driven decision-making processes and leveraging technology, such as automation or digital dashboards, can greatly enhance bottleneck management efforts.7. Considers External Factors: Bottlenecks can arise not only from internal factors within a business but also from external factors beyond their control. Factors such as market fluctuations, supplier delays, or regulatory changes can create bottlenecks in the production process. By keeping an eye on the broader business environment and anticipating potential external bottlenecks, businesses can develop contingency plans and mitigate their impact.8. Prioritizes Employee Training and Development: Effective bottleneck management requires knowledgeable and skilled employees. Employers should invest in ongoing employee training and development to equip their workforce with the necessary skills and knowledge to identify and address bottlenecks. Boosting employee capabilities not only helps resolve bottlenecks but also promotes employee engagement, job satisfaction, and retention.9. Encourages Innovation and Experimentation: Bottleneck management can drive innovation and encourage businesses to explore alternative approaches or technologies. When confronted with a bottleneck, businesses can experiment with different solutions and technologies to overcome the constraint and improve overall efficiency. Embracing a culture of innovation and allowing employees the freedom to test new ideas can yield creative solutions to bottleneck challenges.10. Enhances Customer Experience: Ultimately, bottleneck management has a direct impact on the customer experience. By resolving bottlenecks and ensuring smooth operations, businesses can meet customer expectations for timely delivery, quality products, and reliable service. A seamless customer experience leads to increased customer loyalty, positive word-of-mouth, and ultimately, sustainable business growth.In conclusion, bottleneck management is an essential practice for businesses to optimize efficiency, improve resource allocation, and enhance overall productivity. It enables businesses to identify and resolve constraints in their operations, increasing throughput and capacity planning. By fostering a culture of collaboration, utilizing data analysis, considering internal and external factors, prioritizing employee training, and encouraging innovation, businesses effectively manage bottlenecks and gain a competitive edge in the market while providing a superior customer experience.。
EN_ReleaseNotes_FirewareXTM_11_3_1pdf
Note that most data input must still be made using standard ASCII characters. You can use non-ASCII characters in some areas of the UI, including: Proxy deny message Wireless hotspot title, terms and conditions, and message WatchGuard Server Center users, groups, and role names
Fireware XTM and WSM v11.3.1 Operating System Compatibility
RELEASE NOTES
AUGUST 31, 2010
PAGE 2
FIREWARE XTM V11.3.1
System Requirements
If you have WatchGuard System Manager client software only installed Minimum CPU Minimum Memory Minimum Available Disk Space Minimum Recommended Screen Resolution Intel Pentium IV 1GHz 1 GB 250 MB 1024x768 If you install WatchGuard System Manager and WatchGuard Server software Intel Pentium IV 2GHz 2 GB 1 GB 1024x768
RELEASE NOTES
科朋德可变距离涡卷式压缩机 ZFKQ 型号 用户手册说明书
Product catalogueCopeland Scroll ™ compressorZFKQ for Refrigeration Applications2TM Emerson developed the ZFKQ range of Copeland Scroll TM compressors to provide the best performance in low temperatures. The series has a wide application envelope that can operate from -40°C to +7°C evaporating temperature. Its optimized design perfectly fits frozen food application requirements while its scroll compliance mechanism makes it highly tolerant of liquid slugging.The range consists of:• The ZF*KQE models that operate with liquid injection in order to control discharge temperature and extend the operating envelope. • The ZFI*KQE models that are optimized for vapor injection with the use of a subcooler. This boosts the refrigeration system's cooling capacity and efficiency.High efficiency all year round• The unique Copeland Compliant Scroll design patented by Emerson operates under continuous scroll flank contact, maintained by centrifugal force. This minimizes gas leakage while maximizing efficiency.• With its capability for condensing operation down to 4°C on low temperature applications, Copeland Scroll technology provides the best seasonal efficiencies.• Equipped with dynamic discharge valve that allows the discharge gas to reach desired pressure. This helps reduce efficiency loss by preventing gas re-compression.• The vapor injection technology allows ZFI*KQE compressors to perform higher efficiency than single-stage compressors at low temperature operation condition. Thus makes ZFI*KQE the best in-class performance.Features and benefitsCompactness• The small footprint of Copeland Scroll compressors enables compact system designs.• Weight and dimensions for refrigeration equipment is reduced with increased capacity per compressorweight.3Table of contents4Robustness and reliability• The Copeland Compliant Scroll design is tolerant to stresses caused by liquid slugging, flooded starts and debris commonly found in refrigeration systems.• Easy to service and maintain due to their compact size and lightweight, simple design.• Engineered for optimum performance with today’s chlorine-free refrigerants.• The Copeland Scroll compressor design has several inherent reliability advantages:• Redesigned suction gas flow results in lower oil circulation and better motor cooling.• EVI CoreSense™ Control kits provide advanced features to ensure optimum system operation.- 70% fewer moving parts than reciprocating compressors- Axial & radial scroll compliance provides improved liquid handling capability- Hermetic design reduces leak potentialSmooth operation• All Copeland Scroll compressors are designed with a discharge check valve that isolates the high pressure discharge gas. This allows the compressor to start unloaded, resulting in low inrush currents.• Smooth operations are made possible by the continuous compression process. This generates less vibration than reciprocating technology.Delivers unmatched energy efficiency: 5%–20% improvement• Motor, scroll and bearing redesign minimize annual energy consumption.• Precision machined scrolls provide the highest isentropic efficiency and wear-in for improved performance over time.• New valving technology adjusts the scroll compression ratio based on operating condition, significantly improving low ambient performance.• Using vapor injection improves system capacity by 50% and efficiency by 20% on average at the low temperature rating condition.Compressor protection• ZF*KQE and ZFI*KQE compressors are supplied with internal thermal protectors that prevent motor overheating in case of loss of phase or low refrigerant charge.• The ZF*KQE models that operate with liquid injection through DTC Valve in order to control the discharge temperature.• The ZFI*KQE models that can operate with Emerson EVI CoreSense™ control kits in order to control vapor injection superheat as well as a safe discharge temperature.5Base capacity @ LT rating(Btu/h) @ 60Hz (ARI)Low temperature refrigerationNomenclatureZ F I 20 K Q E - T F D - X X XLubricantBlank Mineral oil EPOE oilBill of materialGenerationScroll familyBase capacity multiplierK1,000TechnologyIVapor injection BlankLiquid injectionElectricalMotor type T Three-phase motor Motor protection W External electronic protection F Internal inherent protection Electrical codes50 Hz 60 Hz 7–380 V C 200 V 208-230 V D 380-420 V 460 VBill of materialRemarks: See technical data sheet for the detailed connection sizeZF06-ZF49KQE only provide Rotalock connection to liquid injection fitting for the installation of DTC valve *Except ZF28KQE-TFC and ZFI39KQE-TFC6Operating envelopesZF06 - 18KQEZFI20-26KQER22ZF25-41KQEZFI36-59KQEZF49KQEZFI68KQELiquid injectionVapor injection05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)Note: 20°C return gas + liquid injection Note:20°C return gas + vapor injection7R404A/R507Operating envelopesLiquid injectionVapor injectionZF06 - 18KQEZFI20 - 26KQEZF25 - 41KQEZFI36 - 59KQEZF49KQEZFI68KQE05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)18.3°C Return Gas + Liquid injection05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)05101520253035404550556065-45-40-35-30-25-20-15-10-5510C o n d e n s i n g t e m p e r a t u r e (°C )Evaporating temperature (°C)Note:20°C return gas + liquid injection Note:20°C return gas + vapor injectionProduct line-upR404A - 50HzR404A - 60HzNotes: Based on low temperature cold room conditions: -25°C evaporating, 45°C condensing and 20°C return gas temperature.Preliminary data for ZF54, ZFI23, ZFI81. Release date to be announced.81. Q for capacity; P for power. Units in kW2. All ZF*KQE values are rated at return gas temperature: 20°C and subcooling: 0 K91. Q for capacity, P for power. Units in kW; LO for liquid out temperature in °C2. All ZF*KQE values are rated at return gas temperature: 20°C and max subcooling 10TF7: 380 V ; 3-Phase, 60 Hz TFC: 200 V ; 3-Phase, 60 Hz TFD: 380-420 V ; 3-Phase, 60 HzLiquid injectionNotes:1. Q for capacity; P for power. Units in kWTF7: 380 V ; 3-Phase, 60 HzTFC: 200 V ; 3-Phase, 60 HzTFD: 380-420 V ; 3-Phase, 60 HzVapor injection Array1. Q for capacity, P for power. Units in kW; LO for liquid out temperature in °CTFC: 200 V ; 3-Phase, 50 Hz TFD: 380-420 V ; 3-Phase, 50 Hz Liquid injection1. Q for capacity; P for power. Units in kWTFC: 200 V ; 3-Phase, 50 HzTFD: 380-420 V ; 3-Phase, 50 HzVapor injection Array1. Q for capacity, P for power. Units in kW; LO for liquid out temperature in °CNotes:1. Q for capacity; P for power. Units in kW1. Q for capacity, P for power. Units in kW; LO for liquid out temperature in °CEVI CoreSense control kits IntroductionThe EVI CoreSense control kit of ZFI compressor is intended to control vapor injection, maintain a safe discharge temperature, and provide intelligent diagnosis and protection.The kit includes a printed circuit board (PCB), an electronic expansion valve (EXV), and three sensors, as well as containing atransformer and an EXV filter. All parts are common, except the EXV valve orifice size, which will be applied to different ZFI models. In vapor injection application, the valve is driven by sensors mounted near the heat exchanger and attempts to maintain the vapor outlet sensor 5K higher than the vapor inlet. The system will switch to discharge line temperature control if vapor injection is insufficient to maintain a safe discharge temperature. If the discharge temperature becomes dangerously high, the system will stop the compressor, turn on an LED alarm, and trigger a voltage free alarm relay contact. The compressor can auto-reset, but not lockout.Emerson provides customer EVI CoreSense control kits with and without CoreSense box.EVI CoreSense™ control kits and wiring diagramPrinted circuit boardWear a ground strap when working with the PCB to avoid the risk of damage from static discharges.General PCB layout, input and output ports are shown in the image below, the ports to EXV, DLT, as well as the vapor in and vapor out sensors are done with Poka-yoke connector design. Connect sensors, EXV, and system wiring as shown in wiring diagram.The PCB is supplied power through a transformer with a power input of 50/60Hz, 220VAC, and an output of 12VAC to the PCB board.For EVI control kits with CoreSense box, the board and transformer are both mounted in the box, using 4x05mm holes at 61x101mm centers, fastened by screws. Spare part number is 543-0189-01 for field service.For EVI control kits without CoreSense™ box, we provide individual parts for compact system design. The board is with 4 xØ4mm holes at 61 x 101mm centers, please use plastic stakes provided. Spare part number is 543-0219-01 for field service.LED 2LED 3Board power supply input terminalsCompressor start/stop input signal EXV driver output portsDLT sensor input ports Vapor in sensor input ports Vapor out sensor input portsDip-switch settingThe dip-switch default setting has been done in-factory, please do not change setting and ensure that the replacement board is set correctly.For the glide-refrigerants application like R407A, R407F, R407C, we would recommend 10K superheat. Please contact your local Emerson sales and application engineer to reset the dip-switch.LED functionsLED1 (yellow-green)LED1will light up during initialization after power on, after that, blinking lights will indicate the sensor status.LED2, LED3 (yellow-green)LED2 and LED3 will blink once when entering or exiting EXV manual operation, and also indicate EXV opening and closing.LED4 (red color) alarmwill turn on when alarm is triggered by the following itemsLED4The EVI kits include 3 temperature sensors. Please ensure all sensors are mounted in the correct locations, fastened, and insulated properly.The discharge temperature sensor should be installed approximately 178mm (7 inches) from discharge tube outlet. If a service valve is installed at the discharge tube, the sensor should be located 127mm (5 inches) from the valve braze.The vapor in sensor is connected to the pipe between the EXV and PHE. The vapor out sensor is connected to the pipe from thePHE to the compressor vapor injection port. Please don’t make the vapor in and vapor out sensor location reversed.Electronic expansion valve (EXV)The EXV contains an EXV-valve and EXV-coil, lead wire length for coil is 1796mm, the valve size includes Ø1.3mm, Ø1.65mm and Ø1.8mm depending on system size, applied to different ZFI models.The liquid refrigerant should pass from the bending tube and flow out from the straight tube. Please weld the filter before the EXV provided along with the kits.ZFI standard control box wiring exampleCables fixed by ribbonControl boardTransformerTerminal123A B C D EFWiring diagramPlate heat exchanger (PHE)and liquid line temperatureMount plate heat exchanger in the vertical position and oriented correctly. Ensure that sensors are located correctly as well.ZFI vapor injection compressors can deliver very cold liquid with economizer cycle. The sub-cooling of liquid line calls for these recommendations:1. Liquid line pipe connecting the economizer to theevaporator expansion valve should be well-insulatedseparately.2. The lower liquid line temperature can increase theevaporator valve capacities. Please follow the valvemanufacturer's recommended liquid temperaturecorrection factors for proper selection of evaporatorRotalock connectionNotes:(1) All tolerances ± 1.5mm [0.06in] unless otherwise specified(2) Due to accumulated assembly tolerances, the listed components may vary from the mounting holes. All fittings: ± 3.0mm [0.12in]Rotalock connectionNotes:(1) All tolerances ± 1.5mm [0.06in] unless otherwise specified(2) Due to accumulated assembly tolerances, the listed components may vary from the mounting holes. All fittings: ± 3.0mm [0.12in]Rotalock connectionNotes:(1) All tolerances ± 1.5mm [0.06in] unless otherwise specified(2) Due to accumulated assembly tolerances, the listed components may vary from the mounting holes. All fittings: ± 3.0mm [0.12in]Rotalock connectionNotes:(1) All tolerances ± 1.5mm [0.06in] unless otherwise specified(2) Due to accumulated assembly tolerances, the listed components may vary from the mounting holes. All fittings: ± 3.0mm [0.12in]Rotalock connectionNotes:(1) All tolerances ± 1.5mm [0.06in] unless otherwise specified(2) Due to accumulated assembly tolerances, the listed components may vary from the mounting holes. All fittings: ± 3.0mm [0.12in]Stub tube connectionZF28KQE-TFC and ZFI39KQE-TFC (BOM 580) Stub tube connectionStub tube connectionStub tube connectionZF49KQE-TFD/TF7 (BOM569) Stub tube connectionZF49KQE-TFC and ZFI68KQE-TFC (BOM569) Stub tube connectionStub tube connectionStub tube connectionLiquid injection schematicVapor injection schematic*PHE: Plate heat exchangerGeneral informationTechnical data are correct at the time of printing. Updates may occur, and should you need confirmation of a specific value, please contact Emerson clearly stating the information required.Emerson cannot be held responsible for errors in capacities, dimensions, etc., stated herein. Products, specifications and data in this literature are subject to change without notice.The information given herein is based on data and tests which Emerson believes to be reliable and which are in accordance with today’s technical knowledge. It is intended for use by persons having the appropriate technical knowledge and skill, at their own discretion and risk. Our products are designed and adapted for fixed locations. For mobile applications, failures may occur.The suitability for this has to be assured from the plant manufacturer, which may include making appropriate tests.Note:The components listed in this catalogue are not released for use with caustic, poisonous or flammable substances. Emerson cannot be held responsible for any damage caused by using these substances. About EmersonEmerson (NYSE: EMR), headquartered in St. Louis, Missouri (USA), is a global technology and engineering company providing innovative solutions for customers in industrial, commercial, and residential markets. Our Emerson Automation Solutions business helps process, hybrid, and discrete manufacturers maximize production, protect personnel and the environment while optimizing their energy and operating costs. Our Emerson Commercial and Residential Solutions business helps ensure human comfort and health, protect food quality and safety, advance energy efficiency, and create sustainable infrastructure. For more information visit .Asia 02 A01 03 - R00 Issued 5/2017 - GSCAA035Asia Pacific HeadquartersEmerson Climate Technologies Suite No. 2503-8, 25/F,Exchange Tower, 33 Wang Chiu Road, Kowloon Bay, Kowloon, Hong Kong Tel: (852) 2866 3108Fax: (852) 2520 6227AustraliaEmerson Climate Technologies Australia Pty Ltd356 Chisholm RoadAuburn NSW 2144, Australia Tel: (612) 9795 2800 Fax: (612) 9738 1699China - BeijingEmerson Climate Technologies (Suzhou) Co. Ltd Beijing Sales OfficeRoom 1017 JianWei Building,66 Nan Lishi Road, XiCheng District, Beijing, PRCTel: (8610) 5763 0488Fax: (8610) 5763 0499China - GuangzhouEmerson Climate Technologies (Suzhou) Co. LtdGuangzhou Sales Office508-509 R&F Yinglong Plaza, No. 76 Huangpu Road West, Guangzhou, PRCTel: (8620) 2886 7668Fax: (8620) 2886 7622China - ShanghaiEmerson Climate Technologies (Suzhou) Co. LtdShanghai Sales Office7F, Emerson Building, 1582 Gumei Rd, Shanghai, PRC Tel: (8621) 3338 7333India - MumbaiEmerson Climate Technologies (India) Ltd Delphi B-Wing, 601-602, 6th FloorCentral Avenue, Hiranandani Business Park,Powai, Mumbai 400076Tel: (9122) 6786 0793Fax: (9122) 6662 0500India - PuneEmerson Climate Technologies (India) Ltd Plot No. 23, Rajiv Gandhi Infotech Park,Phase - II, Hinjewadi,Pune 411 057, Maharashtra, India Tel: (9120) 4200 2000Fax: (9120) 4200 2099IndonesiaPT Emerson Indonesia BSD Taman Tekno 8Jl. Tekno Widya Blok H10 No 2 & 3Tangerang Selatan 15314IndonesiaTel: (6221) 2966 6242 Fax: (6221) 2966 6245JapanEmerson Japan LtdShin-yokohama Tosho BuildingNo. 3-9-5 Shin-Yokohama, Kohoku-ku Yokohama 222-0033 Japan Tel: (8145) 475 6371Fax: (8145) 475 3565MalaysiaEmerson Electric (Malaysia) Sdn. Bhd.Level M2, Blk A, Menara PKNS-PJ Jalan Yong Shook Lin46050 Petaling Jaya, Selangor, Malaysia Tel: (603) 7949 9222Fax: (603) 7949 9333Middle East & AfricaEmerson Climate Technologies PO Box 26382Jebel Ali Free Zone – South Dubai, UAETel: (9714) 811 8100Fax: (9714) 886 5465PhilippinesEmerson Climate Technologies10/F SM Cyber West Avenue, EDSA cor. West Avenue, Barangay Bungad, Diliman, Quezon City 1105 Philippines Tel: (632) 689 7200Saudi ArabiaEmerson Arabia Inc.P.O Box 34332 – 3620 Building 7874Unit 1, 67th street 2nd Industrial City Dammam, Saudi Arabia Toll Free: 8008443426Tel: + 966 3 8147560Fax: + 966 3 8147570South KoreaEmerson Electric Korea Ltd.3F POBA Gangnam Tower343, Hakdong-ro, Gangnam-gu,Seoul 135-820, Republic of Korea Tel: (822) 3483 1500Fax: (822) 592 7883TaiwanEmerson Electric (Taiwan) Co. Ltd 3F No. 122 Lane 235,Pao Chiau Rd., XinDian Dist.,New Taipei City 23145, Taiwan ( R.O.C.) Tel: (8862) 8912 1360 Fax: (8862) 8912 1890 Thailand - BangkokEmerson Electric (Thailand) Ltd 34th Floor, Interlink Tower,1858/133, Bangna Trad,Bangkok 10260, Thailand Tel: (662) 716 4700Fax: (662) 751 4241United Arab EmiratesEmerson Climate Technologies FZE Jebel Ali Free Zone PO Box 26382Dubai UAEToll Free: 8004413428Tel: + 971 4 8118100Fax: + 971 4 8865465VietnamEmerson Commercial & Residential Solutions Level 6, Melinh Point Tower, 2 Ngo Due Ke,District 1, Ho Chi Minh City VietnamTel: (84) 908 009 189Contact listsEmerson Commercial & Residential Solutions@EmersonComResAPScan to visit:Emerson Asia。
Native Instruments MASCHINE MIKRO MK3用户手册说明书
The information in this document is subject to change without notice and does not represent a commitment on the part of Native Instruments GmbH. The software described by this docu-ment is subject to a License Agreement and may not be copied to other media. No part of this publication may be copied, reproduced or otherwise transmitted or recorded, for any purpose, without prior written permission by Native Instruments GmbH, hereinafter referred to as Native Instruments.“Native Instruments”, “NI” and associated logos are (registered) trademarks of Native Instru-ments GmbH.ASIO, VST, HALion and Cubase are registered trademarks of Steinberg Media Technologies GmbH.All other product and company names are trademarks™ or registered® trademarks of their re-spective holders. Use of them does not imply any affiliation with or endorsement by them.Document authored by: David Gover and Nico Sidi.Software version: 2.8 (02/2019)Hardware version: MASCHINE MIKRO MK3Special thanks to the Beta Test Team, who were invaluable not just in tracking down bugs, but in making this a better product.NATIVE INSTRUMENTS GmbH Schlesische Str. 29-30D-10997 Berlin Germanywww.native-instruments.de NATIVE INSTRUMENTS North America, Inc. 6725 Sunset Boulevard5th FloorLos Angeles, CA 90028USANATIVE INSTRUMENTS K.K.YO Building 3FJingumae 6-7-15, Shibuya-ku, Tokyo 150-0001Japanwww.native-instruments.co.jp NATIVE INSTRUMENTS UK Limited 18 Phipp StreetLondon EC2A 4NUUKNATIVE INSTRUMENTS FRANCE SARL 113 Rue Saint-Maur75011 ParisFrance SHENZHEN NATIVE INSTRUMENTS COMPANY Limited 5F, Shenzhen Zimao Center111 Taizi Road, Nanshan District, Shenzhen, GuangdongChina© NATIVE INSTRUMENTS GmbH, 2019. All rights reserved.Table of Contents1Welcome to MASCHINE (23)1.1MASCHINE Documentation (24)1.2Document Conventions (25)1.3New Features in MASCHINE 2.8 (26)1.4New Features in MASCHINE 2.7.10 (28)1.5New Features in MASCHINE 2.7.8 (29)1.6New Features in MASCHINE 2.7.7 (29)1.7New Features in MASCHINE 2.7.4 (31)1.8New Features in MASCHINE 2.7.3 (33)2Quick Reference (35)2.1MASCHINE Project Overview (35)2.1.1Sound Content (35)2.1.2Arrangement (37)2.2MASCHINE Hardware Overview (40)2.2.1MASCHINE MIKRO Hardware Overview (40)2.2.1.1Browser Section (41)2.2.1.2Edit Section (42)2.2.1.3Performance Section (43)2.2.1.4Transport Section (45)2.2.1.5Pad Section (46)2.2.1.6Rear Panel (50)2.3MASCHINE Software Overview (51)2.3.1Header (52)2.3.2Browser (54)2.3.3Arranger (56)2.3.4Control Area (59)2.3.5Pattern Editor (60)3Basic Concepts (62)3.1Important Names and Concepts (62)3.2Adjusting the MASCHINE User Interface (65)3.2.1Adjusting the Size of the Interface (65)3.2.2Switching between Ideas View and Song View (66)3.2.3Showing/Hiding the Browser (67)3.2.4Showing/Hiding the Control Lane (67)3.3Common Operations (68)3.3.1Adjusting Volume, Swing, and Tempo (68)3.3.2Undo/Redo (71)3.3.3Focusing on a Group or a Sound (73)3.3.4Switching Between the Master, Group, and Sound Level (77)3.3.5Navigating Channel Properties, Plug-ins, and Parameter Pages in the Control Area.773.3.6Navigating the Software Using the Controller (82)3.3.7Using Two or More Hardware Controllers (82)3.3.8Loading a Recent Project from the Controller (84)3.4Native Kontrol Standard (85)3.5Stand-Alone and Plug-in Mode (86)3.5.1Differences between Stand-Alone and Plug-in Mode (86)3.5.2Switching Instances (88)3.6Preferences (88)3.6.1Preferences – General Page (89)3.6.2Preferences – Audio Page (93)3.6.3Preferences – MIDI Page (95)3.6.4Preferences – Default Page (97)3.6.5Preferences – Library Page (101)3.6.6Preferences – Plug-ins Page (109)3.6.7Preferences – Hardware Page (114)3.6.8Preferences – Colors Page (114)3.7Integrating MASCHINE into a MIDI Setup (117)3.7.1Connecting External MIDI Equipment (117)3.7.2Sync to External MIDI Clock (117)3.7.3Send MIDI Clock (118)3.7.4Using MIDI Mode (119)3.8Syncing MASCHINE using Ableton Link (120)3.8.1Connecting to a Network (121)3.8.2Joining and Leaving a Link Session (121)4Browser (123)4.1Browser Basics (123)4.1.1The MASCHINE Library (123)4.1.2Browsing the Library vs. Browsing Your Hard Disks (124)4.2Searching and Loading Files from the Library (125)4.2.1Overview of the Library Pane (125)4.2.2Selecting or Loading a Product and Selecting a Bank from the Browser (128)4.2.3Selecting a Product Category, a Product, a Bank, and a Sub-Bank (133)4.2.3.1Selecting a Product Category, a Product, a Bank, and a Sub-Bank on theController (137)4.2.4Selecting a File Type (137)4.2.5Choosing Between Factory and User Content (138)4.2.6Selecting Type and Character Tags (138)4.2.7Performing a Text Search (142)4.2.8Loading a File from the Result List (143)4.3Additional Browsing Tools (148)4.3.1Loading the Selected Files Automatically (148)4.3.2Auditioning Instrument Presets (149)4.3.3Auditioning Samples (150)4.3.4Loading Groups with Patterns (150)4.3.5Loading Groups with Routing (151)4.3.6Displaying File Information (151)4.4Using Favorites in the Browser (152)4.5Editing the Files’ Tags and Properties (155)4.5.1Attribute Editor Basics (155)4.5.2The Bank Page (157)4.5.3The Types and Characters Pages (157)4.5.4The Properties Page (160)4.6Loading and Importing Files from Your File System (161)4.6.1Overview of the FILES Pane (161)4.6.2Using Favorites (163)4.6.3Using the Location Bar (164)4.6.4Navigating to Recent Locations (165)4.6.5Using the Result List (166)4.6.6Importing Files to the MASCHINE Library (169)4.7Locating Missing Samples (171)4.8Using Quick Browse (173)5Managing Sounds, Groups, and Your Project (175)5.1Overview of the Sounds, Groups, and Master (175)5.1.1The Sound, Group, and Master Channels (176)5.1.2Similarities and Differences in Handling Sounds and Groups (177)5.1.3Selecting Multiple Sounds or Groups (178)5.2Managing Sounds (181)5.2.1Loading Sounds (183)5.2.2Pre-listening to Sounds (184)5.2.3Renaming Sound Slots (185)5.2.4Changing the Sound’s Color (186)5.2.5Saving Sounds (187)5.2.6Copying and Pasting Sounds (189)5.2.7Moving Sounds (192)5.2.8Resetting Sound Slots (193)5.3Managing Groups (194)5.3.1Creating Groups (196)5.3.2Loading Groups (197)5.3.3Renaming Groups (198)5.3.4Changing the Group’s Color (199)5.3.5Saving Groups (200)5.3.6Copying and Pasting Groups (202)5.3.7Reordering Groups (206)5.3.8Deleting Groups (207)5.4Exporting MASCHINE Objects and Audio (208)5.4.1Saving a Group with its Samples (208)5.4.2Saving a Project with its Samples (210)5.4.3Exporting Audio (212)5.5Importing Third-Party File Formats (218)5.5.1Loading REX Files into Sound Slots (218)5.5.2Importing MPC Programs to Groups (219)6Playing on the Controller (223)6.1Adjusting the Pads (223)6.1.1The Pad View in the Software (223)6.1.2Choosing a Pad Input Mode (225)6.1.3Adjusting the Base Key (226)6.2Adjusting the Key, Choke, and Link Parameters for Multiple Sounds (227)6.3Playing Tools (229)6.3.1Mute and Solo (229)6.3.2Choke All Notes (233)6.3.3Groove (233)6.3.4Level, Tempo, Tune, and Groove Shortcuts on Your Controller (235)6.3.5Tap Tempo (235)6.4Performance Features (236)6.4.1Overview of the Perform Features (236)6.4.2Selecting a Scale and Creating Chords (239)6.4.3Scale and Chord Parameters (240)6.4.4Creating Arpeggios and Repeated Notes (253)6.4.5Swing on Note Repeat / Arp Output (257)6.5Using Lock Snapshots (257)6.5.1Creating a Lock Snapshot (257)7Working with Plug-ins (259)7.1Plug-in Overview (259)7.1.1Plug-in Basics (259)7.1.2First Plug-in Slot of Sounds: Choosing the Sound’s Role (263)7.1.3Loading, Removing, and Replacing a Plug-in (264)7.1.4Adjusting the Plug-in Parameters (270)7.1.5Bypassing Plug-in Slots (270)7.1.6Using Side-Chain (272)7.1.7Moving Plug-ins (272)7.1.8Alternative: the Plug-in Strip (273)7.1.9Saving and Recalling Plug-in Presets (273)7.1.9.1Saving Plug-in Presets (274)7.1.9.2Recalling Plug-in Presets (275)7.1.9.3Removing a Default Plug-in Preset (276)7.2The Sampler Plug-in (277)7.2.1Page 1: Voice Settings / Engine (279)7.2.2Page 2: Pitch / Envelope (281)7.2.3Page 3: FX / Filter (283)7.2.4Page 4: Modulation (285)7.2.5Page 5: LFO (286)7.2.6Page 6: Velocity / Modwheel (288)7.3Using Native Instruments and External Plug-ins (289)7.3.1Opening/Closing Plug-in Windows (289)7.3.2Using the VST/AU Plug-in Parameters (292)7.3.3Setting Up Your Own Parameter Pages (293)7.3.4Using VST/AU Plug-in Presets (298)7.3.5Multiple-Output Plug-ins and Multitimbral Plug-ins (300)8Using the Audio Plug-in (302)8.1Loading a Loop into the Audio Plug-in (306)8.2Editing Audio in the Audio Plug-in (307)8.3Using Loop Mode (308)8.4Using Gate Mode (310)9Using the Drumsynths (312)9.1Drumsynths – General Handling (313)9.1.1Engines: Many Different Drums per Drumsynth (313)9.1.2Common Parameter Organization (313)9.1.3Shared Parameters (316)9.1.4Various Velocity Responses (316)9.1.5Pitch Range, Tuning, and MIDI Notes (316)9.2The Kicks (317)9.2.1Kick – Sub (319)9.2.2Kick – Tronic (321)9.2.3Kick – Dusty (324)9.2.4Kick – Grit (325)9.2.5Kick – Rasper (328)9.2.6Kick – Snappy (329)9.2.7Kick – Bold (331)9.2.8Kick – Maple (333)9.2.9Kick – Push (334)9.3The Snares (336)9.3.1Snare – Volt (338)9.3.2Snare – Bit (340)9.3.3Snare – Pow (342)9.3.4Snare – Sharp (343)9.3.5Snare – Airy (345)9.3.6Snare – Vintage (347)9.3.7Snare – Chrome (349)9.3.8Snare – Iron (351)9.3.9Snare – Clap (353)9.3.10Snare – Breaker (355)9.4The Hi-hats (357)9.4.1Hi-hat – Silver (358)9.4.2Hi-hat – Circuit (360)9.4.3Hi-hat – Memory (362)9.4.4Hi-hat – Hybrid (364)9.4.5Creating a Pattern with Closed and Open Hi-hats (366)9.5The Toms (367)9.5.1Tom – Tronic (369)9.5.2Tom – Fractal (371)9.5.3Tom – Floor (375)9.5.4Tom – High (377)9.6The Percussions (378)9.6.1Percussion – Fractal (380)9.6.2Percussion – Kettle (383)9.6.3Percussion – Shaker (385)9.7The Cymbals (389)9.7.1Cymbal – Crash (391)9.7.2Cymbal – Ride (393)10Using the Bass Synth (396)10.1Bass Synth – General Handling (397)10.1.1Parameter Organization (397)10.1.2Bass Synth Parameters (399)11Working with Patterns (401)11.1Pattern Basics (401)11.1.1Pattern Editor Overview (402)11.1.2Navigating the Event Area (404)11.1.3Following the Playback Position in the Pattern (406)11.1.4Jumping to Another Playback Position in the Pattern (407)11.1.5Group View and Keyboard View (408)11.1.6Adjusting the Arrange Grid and the Pattern Length (410)11.1.7Adjusting the Step Grid and the Nudge Grid (413)11.2Recording Patterns in Real Time (416)11.2.1Recording Your Patterns Live (417)11.2.2Using the Metronome (419)11.2.3Recording with Count-in (420)11.3Recording Patterns with the Step Sequencer (422)11.3.1Step Mode Basics (422)11.3.2Editing Events in Step Mode (424)11.4Editing Events (425)11.4.1Editing Events with the Mouse: an Overview (425)11.4.2Creating Events/Notes (428)11.4.3Selecting Events/Notes (429)11.4.4Editing Selected Events/Notes (431)11.4.5Deleting Events/Notes (434)11.4.6Cut, Copy, and Paste Events/Notes (436)11.4.7Quantizing Events/Notes (439)11.4.8Quantization While Playing (441)11.4.9Doubling a Pattern (442)11.4.10Adding Variation to Patterns (442)11.5Recording and Editing Modulation (443)11.5.1Which Parameters Are Modulatable? (444)11.5.2Recording Modulation (446)11.5.3Creating and Editing Modulation in the Control Lane (447)11.6Creating MIDI Tracks from Scratch in MASCHINE (452)11.7Managing Patterns (454)11.7.1The Pattern Manager and Pattern Mode (455)11.7.2Selecting Patterns and Pattern Banks (456)11.7.3Creating Patterns (459)11.7.4Deleting Patterns (460)11.7.5Creating and Deleting Pattern Banks (461)11.7.6Naming Patterns (463)11.7.7Changing the Pattern’s Color (465)11.7.8Duplicating, Copying, and Pasting Patterns (466)11.7.9Moving Patterns (469)11.8Importing/Exporting Audio and MIDI to/from Patterns (470)11.8.1Exporting Audio from Patterns (470)11.8.2Exporting MIDI from Patterns (472)11.8.3Importing MIDI to Patterns (474)12Audio Routing, Remote Control, and Macro Controls (483)12.1Audio Routing in MASCHINE (484)12.1.1Sending External Audio to Sounds (485)12.1.2Configuring the Main Output of Sounds and Groups (489)12.1.3Setting Up Auxiliary Outputs for Sounds and Groups (494)12.1.4Configuring the Master and Cue Outputs of MASCHINE (497)12.1.5Mono Audio Inputs (502)12.1.5.1Configuring External Inputs for Sounds in Mix View (503)12.2Using MIDI Control and Host Automation (506)12.2.1Triggering Sounds via MIDI Notes (507)12.2.2Triggering Scenes via MIDI (513)12.2.3Controlling Parameters via MIDI and Host Automation (514)12.2.4Selecting VST/AU Plug-in Presets via MIDI Program Change (522)12.2.5Sending MIDI from Sounds (523)12.3Creating Custom Sets of Parameters with the Macro Controls (527)12.3.1Macro Control Overview (527)12.3.2Assigning Macro Controls Using the Software (528)13Controlling Your Mix (535)13.1Mix View Basics (535)13.1.1Switching between Arrange View and Mix View (535)13.1.2Mix View Elements (536)13.2The Mixer (537)13.2.1Displaying Groups vs. Displaying Sounds (539)13.2.2Adjusting the Mixer Layout (541)13.2.3Selecting Channel Strips (542)13.2.4Managing Your Channels in the Mixer (543)13.2.5Adjusting Settings in the Channel Strips (545)13.2.6Using the Cue Bus (549)13.3The Plug-in Chain (551)13.4The Plug-in Strip (552)13.4.1The Plug-in Header (554)13.4.2Panels for Drumsynths and Internal Effects (556)13.4.3Panel for the Sampler (557)13.4.4Custom Panels for Native Instruments Plug-ins (560)13.4.5Undocking a Plug-in Panel (Native Instruments and External Plug-ins Only) (564)14Using Effects (567)14.1Applying Effects to a Sound, a Group or the Master (567)14.1.1Adding an Effect (567)14.1.2Other Operations on Effects (574)14.1.3Using the Side-Chain Input (575)14.2Applying Effects to External Audio (578)14.2.1Step 1: Configure MASCHINE Audio Inputs (578)14.2.2Step 2: Set up a Sound to Receive the External Input (579)14.2.3Step 3: Load an Effect to Process an Input (579)14.3Creating a Send Effect (580)14.3.1Step 1: Set Up a Sound or Group as Send Effect (581)14.3.2Step 2: Route Audio to the Send Effect (583)14.3.3 A Few Notes on Send Effects (583)14.4Creating Multi-Effects (584)15Effect Reference (587)15.1Dynamics (588)15.1.1Compressor (588)15.1.2Gate (591)15.1.3Transient Master (594)15.1.4Limiter (596)15.1.5Maximizer (600)15.2Filtering Effects (603)15.2.1EQ (603)15.2.2Filter (605)15.2.3Cabinet (609)15.3Modulation Effects (611)15.3.1Chorus (611)15.3.2Flanger (612)15.3.3FM (613)15.3.4Freq Shifter (615)15.3.5Phaser (616)15.4Spatial and Reverb Effects (617)15.4.1Ice (617)15.4.2Metaverb (619)15.4.3Reflex (620)15.4.4Reverb (Legacy) (621)15.4.5Reverb (623)15.4.5.1Reverb Room (623)15.4.5.2Reverb Hall (626)15.4.5.3Plate Reverb (629)15.5Delays (630)15.5.1Beat Delay (630)15.5.2Grain Delay (632)15.5.3Grain Stretch (634)15.5.4Resochord (636)15.6Distortion Effects (638)15.6.1Distortion (638)15.6.2Lofi (640)15.6.3Saturator (641)15.7Perform FX (645)15.7.1Filter (646)15.7.2Flanger (648)15.7.3Burst Echo (650)15.7.4Reso Echo (653)15.7.5Ring (656)15.7.6Stutter (658)15.7.7Tremolo (661)15.7.8Scratcher (664)16Working with the Arranger (667)16.1Arranger Basics (667)16.1.1Navigating Song View (670)16.1.2Following the Playback Position in Your Project (672)16.1.3Performing with Scenes and Sections using the Pads (673)16.2Using Ideas View (677)16.2.1Scene Overview (677)16.2.2Creating Scenes (679)16.2.3Assigning and Removing Patterns (679)16.2.4Selecting Scenes (682)16.2.5Deleting Scenes (684)16.2.6Creating and Deleting Scene Banks (685)16.2.7Clearing Scenes (685)16.2.8Duplicating Scenes (685)16.2.9Reordering Scenes (687)16.2.10Making Scenes Unique (688)16.2.11Appending Scenes to Arrangement (689)16.2.12Naming Scenes (689)16.2.13Changing the Color of a Scene (690)16.3Using Song View (692)16.3.1Section Management Overview (692)16.3.2Creating Sections (694)16.3.3Assigning a Scene to a Section (695)16.3.4Selecting Sections and Section Banks (696)16.3.5Reorganizing Sections (700)16.3.6Adjusting the Length of a Section (702)16.3.6.1Adjusting the Length of a Section Using the Software (703)16.3.6.2Adjusting the Length of a Section Using the Controller (705)16.3.7Clearing a Pattern in Song View (705)16.3.8Duplicating Sections (705)16.3.8.1Making Sections Unique (707)16.3.9Removing Sections (707)16.3.10Renaming Scenes (708)16.3.11Clearing Sections (710)16.3.12Creating and Deleting Section Banks (710)16.3.13Working with Patterns in Song view (710)16.3.13.1Creating a Pattern in Song View (711)16.3.13.2Selecting a Pattern in Song View (711)16.3.13.3Clearing a Pattern in Song View (711)16.3.13.4Renaming a Pattern in Song View (711)16.3.13.5Coloring a Pattern in Song View (712)16.3.13.6Removing a Pattern in Song View (712)16.3.13.7Duplicating a Pattern in Song View (712)16.3.14Enabling Auto Length (713)16.3.15Looping (714)16.3.15.1Setting the Loop Range in the Software (714)16.3.15.2Activating or Deactivating a Loop Using the Controller (715)16.4Playing with Sections (715)16.4.1Jumping to another Playback Position in Your Project (716)16.5Triggering Sections or Scenes via MIDI (717)16.6The Arrange Grid (719)16.7Quick Grid (720)17Sampling and Sample Mapping (722)17.1Opening the Sample Editor (722)17.2Recording Audio (724)17.2.1Opening the Record Page (724)17.2.2Selecting the Source and the Recording Mode (725)17.2.3Arming, Starting, and Stopping the Recording (729)17.2.5Checking Your Recordings (731)17.2.6Location and Name of Your Recorded Samples (734)17.3Editing a Sample (735)17.3.1Using the Edit Page (735)17.3.2Audio Editing Functions (739)17.4Slicing a Sample (743)17.4.1Opening the Slice Page (743)17.4.2Adjusting the Slicing Settings (744)17.4.3Manually Adjusting Your Slices (746)17.4.4Applying the Slicing (750)17.5Mapping Samples to Zones (754)17.5.1Opening the Zone Page (754)17.5.2Zone Page Overview (755)17.5.3Selecting and Managing Zones in the Zone List (756)17.5.4Selecting and Editing Zones in the Map View (761)17.5.5Editing Zones in the Sample View (765)17.5.6Adjusting the Zone Settings (767)17.5.7Adding Samples to the Sample Map (770)18Appendix: Tips for Playing Live (772)18.1Preparations (772)18.1.1Focus on the Hardware (772)18.1.2Customize the Pads of the Hardware (772)18.1.3Check Your CPU Power Before Playing (772)18.1.4Name and Color Your Groups, Patterns, Sounds and Scenes (773)18.1.5Consider Using a Limiter on Your Master (773)18.1.6Hook Up Your Other Gear and Sync It with MIDI Clock (773)18.1.7Improvise (773)18.2Basic Techniques (773)18.2.1Use Mute and Solo (773)18.2.2Create Variations of Your Drum Patterns in the Step Sequencer (774)18.2.3Use Note Repeat (774)18.2.4Set Up Your Own Multi-effect Groups and Automate Them (774)18.3Special Tricks (774)18.3.1Changing Pattern Length for Variation (774)18.3.2Using Loops to Cycle Through Samples (775)18.3.3Load Long Audio Files and Play with the Start Point (775)19Troubleshooting (776)19.1Knowledge Base (776)19.2Technical Support (776)19.3Registration Support (777)19.4User Forum (777)20Glossary (778)Index (786)1Welcome to MASCHINEThank you for buying MASCHINE!MASCHINE is a groove production studio that implements the familiar working style of classi-cal groove boxes along with the advantages of a computer based system. MASCHINE is ideal for making music live, as well as in the studio. It’s the hands-on aspect of a dedicated instru-ment, the MASCHINE hardware controller, united with the advanced editing features of the MASCHINE software.Creating beats is often not very intuitive with a computer, but using the MASCHINE hardware controller to do it makes it easy and fun. You can tap in freely with the pads or use Note Re-peat to jam along. Alternatively, build your beats using the step sequencer just as in classic drum machines.Patterns can be intuitively combined and rearranged on the fly to form larger ideas. You can try out several different versions of a song without ever having to stop the music.Since you can integrate it into any sequencer that supports VST, AU, or AAX plug-ins, you can reap the benefits in almost any software setup, or use it as a stand-alone application. You can sample your own material, slice loops and rearrange them easily.However, MASCHINE is a lot more than an ordinary groovebox or sampler: it comes with an inspiring 7-gigabyte library, and a sophisticated, yet easy to use tag-based Browser to give you instant access to the sounds you are looking for.What’s more, MASCHINE provides lots of options for manipulating your sounds via internal ef-fects and other sound-shaping possibilities. You can also control external MIDI hardware and 3rd-party software with the MASCHINE hardware controller, while customizing the functions of the pads, knobs and buttons according to your needs utilizing the included Controller Editor application. We hope you enjoy this fantastic instrument as much as we do. Now let’s get go-ing!—The MASCHINE team at Native Instruments.MASCHINE Documentation1.1MASCHINE DocumentationNative Instruments provide many information sources regarding MASCHINE. The main docu-ments should be read in the following sequence:1.MASCHINE MIKRO Quick Start Guide: This animated online guide provides a practical ap-proach to help you learn the basic of MASCHINE MIKRO. The guide is available from theNative Instruments website: https:///maschine-mikro-quick-start/2.MASCHINE Manual (this document): The MASCHINE Manual provides you with a compre-hensive description of all MASCHINE software and hardware features.Additional documentation sources provide you with details on more specific topics:►Online Support Videos: You can find a number of support videos on The Official Native In-struments Support Channel under the following URL: https:///NIsupport-EN. We recommend that you follow along with these instructions while the respective ap-plication is running on your computer.Other Online Resources:If you are experiencing problems related to your Native Instruments product that the supplied documentation does not cover, there are several ways of getting help:▪Knowledge Base▪User Forum▪Technical Support▪Registration SupportYou will find more information on these subjects in the chapter Troubleshooting.Document Conventions1.2Document ConventionsThis section introduces you to the signage and text highlighting used in this manual. This man-ual uses particular formatting to point out special facts and to warn you of potential issues.The icons introducing these notes let you see what kind of information is to be expected:This document uses particular formatting to point out special facts and to warn you of poten-tial issues. The icons introducing the following notes let you see what kind of information canbe expected:Furthermore, the following formatting is used:▪Text appearing in (drop-down) menus (such as Open…, Save as… etc.) in the software andpaths to locations on your hard disk or other storage devices is printed in italics.▪Text appearing elsewhere (labels of buttons, controls, text next to checkboxes etc.) in thesoftware is printed in blue. Whenever you see this formatting applied, you will find thesame text appearing somewhere on the screen.▪Text appearing on the displays of the controller is printed in light grey. Whenever you seethis formatting applied, you will find the same text on a controller display.▪Text appearing on labels of the hardware controller is printed in orange. Whenever you seethis formatting applied, you will find the same text on the controller.▪Important names and concepts are printed in bold.▪References to keys on your computer’s keyboard you’ll find put in square brackets (e.g.,“Press [Shift] + [Enter]”).►Single instructions are introduced by this play button type arrow.→Results of actions are introduced by this smaller arrow.Naming ConventionThroughout the documentation we will refer to MASCHINE controller (or just controller) as the hardware controller and MASCHINE software as the software installed on your computer.The term “effect” will sometimes be abbreviated as “FX” when referring to elements in the MA-SCHINE software and hardware. These terms have the same meaning.Button Combinations and Shortcuts on Your ControllerMost instructions will use the “+” sign to indicate buttons (or buttons and pads) that must be pressed simultaneously, starting with the button indicated first. E.g., an instruction such as:“Press SHIFT + PLAY”means:1.Press and hold SHIFT.2.While holding SHIFT, press PLAY and release it.3.Release SHIFT.1.3New Features in MASCHINE2.8The following new features have been added to MASCHINE: Integration▪Browse on , create your own collections of loops and one-shots and send them directly to the MASCHINE browser.Improvements to the Browser▪Samples are now cataloged in separate Loops and One-shots tabs in the Browser.▪Previews of loops selected in the Browser will be played in sync with the current project.When a loop is selected with Prehear turned on, it will begin playing immediately in-sync with the project if transport is running. If a loop preview starts part-way through the loop, the loop will play once more for its full length to ensure you get to hear the entire loop once in context with your project.▪Filters and product selections will be remembered when switching between content types and Factory/User Libraries in the Browser.▪Browser content synchronization between multiple running instances. When running multi-ple instances of MASCHINE, either as Standalone and/or as a plug-in, updates to the Li-brary will be synced across the instances. For example, if you delete a sample from your User Library in one instance, the sample will no longer be present in the other instances.Similarly, if you save a preset in one instance, that preset will then be available in the oth-er instances, too.▪Edits made to samples in the Factory Libraries will be saved to the Standard User Directo-ry.For more information on these new features, refer to the following chapter ↑4, Browser. Improvements to the MASCHINE MIKRO MK3 Controller▪You can now set sample Start and End points using the controller. For more information refer to ↑17.3.1, Using the Edit Page.Improved Support for A-Series Keyboards▪When Browsing with A-Series keyboards, you can now jump quickly to the results list by holding SHIFT and pushing right on the 4D Encoder.▪When Browsing with A-Series keyboards, you can fast scroll through the Browser results list by holding SHIFT and twisting the 4D Encoder.▪Mute and Solo Sounds and Groups from A-Series keyboards. Sounds are muted in TRACK mode while Groups are muted in IDEAS.。
IBM System x3750 M4 (8722) 产品指南(已撤销产品)说明书
System x3750 M4 (8722)Product Guide (withdrawn product)The System x3750 M4 is a 4-socket server featuring a streamlined design, optimized for price and performance, with best-in-class flexibility and expandability. Models of the x3750 M4, machine type 8722, are powered with Intel Xeon E5-4600 processors, up to 8 cores each, for an entry-level 4-socket solution. The x3750 M4 provides maximum storage density, with flexible PCI and 10 Gb Ethernet networking options in a 2U form factor.Suggested uses: High performance computing (HPC), workloads with floating-point computations, and small to medium databases requiring fast I/O; applications that require 4-socket performance without needing the scalability that the eX5 systems provide.Figure 1. The System x3750 M4Did you know?The x3750 M4 has outstanding memory performance that is achieved by supporting three-RDIMM-per-channel configurations at speeds up to 25% faster than the Intel specification, while still maintaining world-class reliability. LR-DIMM speeds are also 25% beyond the Intel specification for 1.35 V DIMMs, and this speed improve not only performance, but reduces overall system power at the same time.The x3750 M4 offers a flexible, scalable design and simple upgrade path to 16 hard-disk drives (HDDs) or 32 eXFlash solid-state drives (SSDs), with up to eight PCIe Gen 3 slots and up to 1.5 TB of memory. The flexible embedded Ethernet solution provides two standard Gigabit Ethernet ports onboard, along with a dedicated 10 GbE slot that allows for a choice of either two copper or two fiber optic connections. Comprehensive systems management tools with the next-generation Integrated Management Module II (IMM2) make it easy to deploy, integrate, service, and manage.Click here to check for updatesLocations of key components and connectorsThe following figure shows the front of the server.Figure 2. Front view of the System x3750 M4The following figure shows the rear of the server.Figure 3. Rear view of the System x3750 M4The following figure shows the locations of key components inside the server.Figure 4. Inside view of the System x3750 M4Standard specificationsThe following table lists the standard specifications.Table 1. Standard specificationsComponents SpecificationMachine type8722Form factor2U rack.Processor Up to four Intel Xeon processor E5-4600 product family processors, each with eight cores (up to 2.7 GHz), six cores (up to 2.9 GHz), or four cores (up to 2.0 GHz). Two processor sockets on thesystem board and two processors on the processor and memory expansion tray (standard on mostmodels). Two QPI links up to 8.0 GTps each. Up to 1600 MHz memory speed. Up to 20 MB L3cache per processor.Chipset Intel C600 series.Memory Up to 48 DIMM sockets (12 DIMMs per processor). RDIMMs and LRDIMMs (Load Reduced DIMMs) are supported, but memory types cannot be intermixed. The memory speed is up to 1600MHz. There are 24 DIMM sockets on the system board. There are an additional 24 DIMM socketson the processor and memory expansion tray (standard on most models).Memory maximums With RDIMMs: Up to 768 GB with 48x 16 GB RDIMMs and four processors, With LRDIMMs: Up to 1.5 TB with 48x 32 GB LRDIMMs and four processors.MemoryprotectionECC, Chipkill (for x4-based memory DIMMs), memory mirroring, and memory sparing.Standard modelsThe following table lists the standard models. Table 2. Standard modelsModel Intel Xeon processor†(four maximum)*Memory RAID controller Hot-swapdisk baysDisks PCIe GbE PowersupplyModels announced May 20128722-A1x2x E5-4617 6C 2.9 GHz15 MB 1600 MHz 130W 2x 8 GBRDIMM1600 MHzM5110e4x 2.5"16 maxOpen 5 / 821x 1400W8722-A2x1x E5-4603 4C 2.0 GHz10 MB 1066 MHz 95W*1x 8 GBRDIMM1333 MHzM5110e Open Open 5 / 821x 1400W8722-A3x2x E5-4607 6C 2.2 GHz12 MB 1066 MHz 95W 2x 8 GBRDIMM1333 MHzM5110e4x 2.5"16 maxOpen 5 / 821x 1400W8722-B1x2x E5-4610 6C 2.4 GHz15 MB 1333 MHz 95W 2x 8 GBRDIMM1333 MHzM5110e4x 2.5"16 maxOpen 5 / 821x 1400W8722-B2x2x E5-4620 8C 2.2 GHz16 MB 1333 MHz 95W 2x 8 GBRDIMM1333 MHzM5110e8x 1.8"32 maxOpen8 / 821x 1400W8722-C1x2x E5-4640 8C 2.4 GHz20 MB 1600 MHz 95W 2x 8 GBRDIMM1333 MHzM5110e(1 GB,F,R5)‡4x 2.5"16 maxOpen8 / 821x 1400W8722-C2x2x E5-4650 8C 2.7 GHz20 MB 1600 MHz 130W 2x 8 GBRDIMM1333 MHzM5110e(1 GB,F,R5)‡4x 2.5"16 maxOpen 5 / 821x 1400W8722-D1x4x E5-4610 6C 2.4 GHz15 MB 1333 MHz 95W 24x 8 GBRDIMM1333 MHzM5110e + 1xM5110(512,B,R5,SSD)§16x 1.8"32 max16x 200GSSD8 / 822x 1400W8722-D2x4x E5-4650 8C 2.7 GHz20 MB 1600 MHz 130W 24x 16GBLRDIMM1333 MHzM5110e + 3xM5110(512,B,R5,SSD)§32x 1.8"32 max32x 200GSSD8 / 822x 1400W† Processor detail: Processor quantity and model, cores, core speed, L3 cache, memory speed, and power consumption.* All models except for 8722-A2x include the processor and memory expansion tray containing sockets for processors 3 and 4 and 24 DIMMs. For model A2x, order part number 88Y7365.‡ Models C1x and C2x include the 1 GB Flash/RAID 5 Upgrade (part number 81Y4559) which is a 1 GB flash-backed cache with support for RAID 5.§ Model D1x has two RAID controllers, D2x has four RAID controllers total. D1x and D2x include the 512 MB Cache/RAID 5 Upgrade (81Y4484), plus the Battery Kit (81Y4508), plus the SSD Performance Key (90Y4273) for each controller.Refer to the Standards specifications section for information about the standard features of the server. Processor optionsTable 8. RAID controller upgradesPart number FeaturecodeDescription MaximumsupportedModelswhere used81Y4544A1X2ServeRAID M5100 Series Zero Cache/RAID 5 Upgrade1-81Y4484A1J3ServeRAID M5100 Series 512 MB Cache/RAID 5 Upgrade4D1x (2 standard)D2x, (4 standard) 81Y4487A1J4ServeRAID M5100 Series 512 MB Flash/RAID 5 Upgrade4-81Y4559A1WY ServeRAID M5100 Series 1 GB Flash/RAID 5 Upgrade4C1x (1 standard)C2x (1 standard) 81Y4508A22E ServeRAID M5100 Series Battery Kit4*D1x (2 standard)D2x, (4 standard) 81Y4546A1X3ServeRAID M5100 Series RAID 6 Upgrade**1†-90Y4273A2MC ServeRAID M5100 Series SSD Performance Key**1D1x, D2x90Y4318A2MD ServeRAID M5100 Series SSD Caching Enabler **1-81Y4542A1X1ServeRAID M1100 Series Zero Cache/RAID 5 Upgrade1-* The ServeRAID M5100 Series Battery Kit (81Y4508) is only supported with ServeRAID M5100 Series 512 MB Cache/RAID 5 Upgrade (81Y4484).† The ServeRAID M5100 Series RAID 6 Upgrade (81Y4546) requires RAID 5 upgrades with cache(81Y4484, 81Y4487, or 81Y4559 only).** Only one ServeRAID Feature on Demand upgrade is required per system, regardless of the number of adapters installed.Internal drive optionsThe following table lists the hard disk drive options for the internal disk storage of the x3750 M4 server. Table 9. 1.8-inch SSDsPart number Feature Description Maximum supported1.8-inch hot-swap SSDs - 6 Gb SATA - Enterprise Mainstream (3-5 DWPD)00AJ335A56V120GB SATA 1.8" MLC Enterprise Value SSD32 00AJ340A56W240GB SATA 1.8" MLC Enterprise Value SSD32 00AJ345A56X480GB SATA 1.8" MLC Enterprise Value SSD32 00AJ350A56Y800GB SATA 1.8" MLC Enterprise Value SSD32Table 10. 2.5-inch hot-swap 6 Gb SAS/SATA HDDsPart number Feature Description Maximum supported2.5-inch hot-swap HDDs - 6 Gb SAS 10K90Y8877A2XC300GB 10K 6Gbps SAS 2.5" SFF G2HS HDD16 90Y8872A2XD600GB 10K 6Gbps SAS 2.5" SFF G2HS HDD16 81Y9650A282900GB 10K 6Gbps SAS 2.5" SFF HS HDD16 00AD075A48S 1.2TB 10K 6Gbps SAS 2.5" G2HS HDD16 2.5-inch hot-swap HDDs - 6 Gb SAS 15K90Y8926A2XB146GB 15K 6Gbps SAS 2.5" SFF G2HS HDD16 81Y9670A283300GB 15K 6Gbps SAS 2.5" G2HS HDD16 00AJ300A4VB600GB 15K 6Gbps SAS 2.5" G2HS HDD16 2.5-inch hot-swap HDDs - 6 Gb NL SAS90Y8953A2XE500GB 7.2K 6Gbps NL SAS 2.5" SFF G2HS HDD16 81Y9690A1P31TB 7.2K 6Gbps NL SAS 2.5" SFF HS HDD16 2.5-inch hot-swap HDDs - 6 Gb NL SATA81Y9726A1NZ500GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD16 81Y9730A1AV1TB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD16 2.5-inch hot-swap SED HDDs - 6 Gb SAS 10K90Y8913A2XF300GB 10K 6Gbps SAS 2.5" SFF G2HS SED16 90Y8908A3EF600GB 10K 6Gbps SAS 2.5" SFF G2HS SED16Table 11. 2.5-inch hot-swap 6 Gb SAS/SATA SSDsPart number Feature Description Maximum supported2.5-inch hot-swap SSDs - 6 Gb SAS - Enterprise Performance (10+ DWPD)49Y6129A3EW200GB SAS 2.5" MLC HS Enterprise SSD16 49Y6134A3EY400GB SAS 2.5" MLC HS Enterprise SSD16 49Y6139A3F0800GB SAS 2.5" MLC HS Enterprise SSD16 49Y6195A4GH 1.6TB SAS 2.5" MLC HS Enterprise SSD16 2.5-inch hot-swap SSDs - 6 Gb SATA - Enterprise Mainstream (3-5 DWPD)00AJ355A56Z120GB SATA 2.5" MLC HS Enterprise Value SSD16 00AJ360A570240GB SATA 2.5" MLC HS Enterprise Value SSD16 00AJ365A571480GB SATA 2.5" MLC HS Enterprise Value SSD16 00AJ370A572800GB SATA 2.5" MLC HS Enterprise Value SSD16Internal backup unitsThe server does not supports any internal backup units, such as tape drives or RDX drives. Optical drivesTable 15. Network adaptersPart number Feature Description Maximum supported#1 Gb Ethernet49Y42305767Intel Ethernet Dual Port Server Adapter I340-T2 for IBM System x849Y42405768Intel Ethernet Quad Port Server Adapter I340-T4 for IBM System x800AG500A56K Intel I350-F1 1xGbE Fiber Adapter for IBM System x800AG510A56L Intel I350-T2 2xGbE BaseT Adapter for IBM System x800AG520A56M Intel I350-T4 4xGbE BaseT Adapter for IBM System x810 Gb Ethernet49Y7960A2EC Intel X520 Dual Port 10GbE SFP+ Adapter for IBM System x849Y7970A2ED Intel X540-T2 Dual Port 10GBaseT Adapter for IBM System x881Y3520AS73Intel X710 2x10GbE SFP+ Adapter for IBM System x800D9690A3PM Mellanox ConnectX-3 10 GbE Adapter for IBM System x842C18005751QLogic 10Gb CNA for IBM System x890Y4600A3MR QLogic 8200 Dual Port 10GbE SFP+ VFA for IBM System x847C9952A47H Solarflare SFN5162F 2x10GbE SFP+ Performant Adapter for IBM System x847C9960A47J Solarflare SFN6122F 2x10GbE SFP+ Onload Adapter for IBM System x847C9977A522Solarflare SFN7122F 2x10GbE SFP+ Flareon Ultra for IBM System x840 Gb Ethernet00D9550A3PN Mellanox ConnectX-3 40GbE / FDR IB VPI Adapter for IBM System x8# Maximum quantity is achieved with processor 2 installed and the 3-slot riser card (88Y7371). With one processor, the maximum quantity is three (this maximum does not apply to the 10 Gb cards in the dedicated slot).For more information, see the list of Product Guides in the Networking adapters categoryhttps:///servers/options/ethernetStorage HBAs and external RAID controllersThe following table lists storage HBAs supported by x3750 M4 server. The maximum quantity is achieved with processor 2 and the 3-slot riser card (88Y7371) installed. With one processor, the maximum quantity is three (this configuration does not apply to the 10 Gb cards in the dedicated slot).Power suppliesThe server supports up to two redundant power supplies. Standard models come with one or two 1400 W power supplies (model dependent; see Table 2). 900 W AC and 750 W DC power supplies also available through CTO or Special Bid.Installing a second power supply requires that the processor and memory expansion tray (88Y7365) or the power interposer card (88Y7367) be installed. The power interposer card option enables redundancy power support when the processor and memory expansion tray is not installed. If you do not have the processor and memory expansion tray installed and want to install two power supplies, then the power interposer card must be installed.Table 19. Power suppliesPart number Featurecode Description MaximumsupportedModelswhere used88Y7373A2A61400 W HE Redundant Power Supply2All models 88Y7431A2A7900 W Power Supply2-88Y7433A2EA System x 4S- 750W High Efficiency -48 V DC Power Supply2-88Y7367A2A0Power Interposer for Redundant Power Supply1*-* The power interposer is not needed if the processor and memory expansion tray (88Y7365) is installed. Each AC power supply ships standard with one 2.8 m C13 - C14 power cord.Two installed 1400 W power supplies form a redundant pair. Under extreme configurations, it may be possible to exceed 1400 W DC output. If this condition exists and a power supply fails, the server caps power at 1400 W until the second power supply is back online.Integrated virtualizationThe server supports VMware ESXi installed on a USB memory key. The key is installed in a USB socket inside the server. The following table lists the virtualization options.Table 20. Virtualization optionsPart number Featurecode Description Maximumsupported41Y8298A2G0Blank USB Memory Key for VMware ESXi Downloads1 41Y8300A2VC USB Memory Key for VMware ESXi 5.01 41Y8307A383USB Memory Key for VMware ESXi 5.0 Update 11 41Y8311A2R3USB Memory Key for VMware ESXi 5.11 41Y8382A4WZ USB Memory Key for VMware ESXi 5.1 Update 11 41Y8385A584USB Memory Key for VMware ESXi 5.51Remote managementExternal backup unitsThe following table lists the external backup options that are offered by Lenovo. Table 24. External backup optionsPart number DescriptionExternal RDX USB drives4T27A10725ThinkSystem RDX External USB 3.0 DockExternal SAS tape backup drives6160S7E IBM TS2270 Tape Drive Model H7S6160S8E IBM TS2280 Tape Drive Model H8S6160S9E IBM TS2290 Tape Drive Model H9SExternal SAS tape backup autoloaders6171S7R IBM TS2900 Tape Autoloader w/LTO7 HH SAS6171S8R IBM TS2900 Tape Autoloader w/LTO8 HH SAS6171S9R IBM TS2900 Tape Autoloader w/LTO9 HH SASExternal tape backup libraries6741A1F IBM TS4300 3U Tape Library-Base Unit6741A3F IBM TS4300 3U Tape Library-Expansion UnitFull High 8 Gb Fibre Channel for TS430001KP938LTO 7 FH Fibre Channel Drive01KP954LTO 8 FH Fibre Channel Drive02JH837LTO 9 FH Fibre Channel DriveHalf High 8 Gb Fibre Channel for TS430001KP936LTO 7 HH Fibre Channel Drive01KP952LTO 8 HH Fibre Channel Drive02JH835LTO 9 HH Fibre Channel DriveHalf High 6 Gb SAS for TS430001KP937LTO 7 HH SAS Drive01KP953LTO 8 HH SAS Drive02JH836LTO 9 HH SAS DriveFor more information, see the list of Product Guides in the Backup units category: https:///servers/options/backupTop-of-rack Ethernet switches00YJ777ATZZ 0U 36 C13/6 C19 32A 1 Phase PDU Y Y N Y Y Y Y Y Y N N Y Y 00YJ778AU000U 21 C13/12 C19 32A 3 Phase PDU Y Y N Y Y Y Y Y Y N N Y Y 0U Switched and Monitored PDUs00YJ783AU040U 12 C13/12 C19 Switched and Monitored48A 3 Phase PDUN N Y N N N Y N N Y Y Y N 00YJ781AU030U 20 C13/4 C19 Switched and Monitored 24A 1 Phase PDUN N Y N Y N Y N N Y Y Y N 00YJ782AU020U 18 C13/6 C19 Switched and Monitored 32A 3 Phase PDUY Y Y Y Y Y Y Y Y N Y N Y 00YJ780AU010U 20 C13/4 C19 Switched and Monitored 32A 1 Phase PDUY Y Y Y Y Y Y Y Y N Y N Y1U Switched and Monitored PDUs 4PU7A81117BNDV 1U 18 C19/C13 switched and monitored 48A 3P WYE PDU - ETLN N N N N N N N N N N Y N 4PU7A77467BLC41U 18 C19/C13 Switched and Monitored 80A 3P Delta PDUN N N N N N N N N Y N Y N 4PU7A77469BLC61U 12 C19/C13 switched and monitored 60A 3P Delta PDUN N N N N N N N N N N Y N 4PU7A77468BLC51U 12 C19/C13 switched and monitored 32A 3P WYE PDUY Y Y Y Y Y Y Y Y N Y Y Y 4PU7A81118BNDW 1U 18 C19/C13 switched and monitored 48A 3P WYE PDU - CEY Y Y Y Y Y Y Y Y N Y N Y 46M400258961U 9 C19/3 C13 Switched and Monitored DPI PDUY Y Y Y Y Y Y Y Y Y Y Y Y 46M400458941U 12 C13 Switched and Monitored DPI PDUY Y Y Y Y Y Y Y Y Y Y Y Y46M400358971U 9 C19/3 C13 Switched and Monitored 60A 3 Phase PDUY Y Y Y Y Y Y Y Y Y Y Y Y 46M400558951U 12 C13 Switched and Monitored 60A 3Phase PDUY Y Y Y Y Y Y Y Y Y Y Y Y1U Ultra Density Enterprise PDUs (9x IEC 320 C13 + 3x IEC 320 C19 outlets)71763NU 6051Ultra Density Enterprise C19/C13 PDU 60A/208V/3PHN N Y N N N N N N Y Y Y N 71762NX6091Ultra Density Enterprise C19/C13 PDU ModuleY Y Y Y Y Y Y Y Y Y Y Y Y1U C13 Enterprise PDUs (12x IEC 320 C13 outlets)39M28166030DPI C13 Enterprise PDU Plus Module (WW)Y Y Y Y Y Y Y Y Y Y Y Y Y 39Y89416010DPI C13 Enterprise PDU Module (WW)Y Y Y Y Y Y Y Y Y Y Y Y Y 1U C19 Enterprise PDUs (6x IEC 320 C19 outlets)39Y89486060DPI C19 Enterprise PDU Module (WW)Y Y Y Y Y Y Y Y Y Y Y Y Y 39Y89236061DPI Three-phase 60A/208V C19 Enterprise PDU (US)N N Y N N N Y N N N Y Y N1U Front-end PDUs (3x IEC 320 C19 outlets)Part number Feature code Description A N ZA S E AB r a z i E E T M E A R UC I W E H T K I ND I A J A P A L AN A P R C39Y89386002DPI Single-phase 30A/120V Front-end PDU(US)Y Y Y Y Y Y Y Y Y Y Y Y Y 39Y89396003DPI Single-phase 30A/208V Front-end PDU (US)Y Y Y Y Y Y Y Y Y Y Y Y Y 39Y89346005DPI Single-phase 32A/230V Front-end PDU (International)Y Y Y Y Y Y Y Y Y Y Y Y Y 39Y89406004DPI Single-phase 60A/208V Front-end PDU (US)Y N Y Y Y Y Y N N Y Y Y N 39Y89356006DPI Single-phase 63A/230V Front-end PDU (International)Y Y Y Y Y Y Y Y Y Y Y Y Y1U NEMA PDUs (6x NEMA 5-15R outlets)39Y89055900DPI 100-127V NEMA PDUY Y Y Y Y Y Y Y Y Y Y Y Y Line cords for 1U PDUs that ship without a line cord40K96116504 4.3m, 32A/380-415V, EPDU/IEC 3093P+N+G 3ph wye (non-US) Line Cord Y Y Y Y Y Y Y Y Y Y Y Y Y 40K96126502 4.3m, 32A/230V, EPDU to IEC 309 P+N+G (non-US) Line CordY Y Y Y Y Y Y Y Y Y Y Y Y 40K96136503 4.3m, 63A/230V, EPDU to IEC 309 P+N+G (non-US) Line CordY Y Y Y Y Y Y Y Y Y Y Y Y 40K96146500 4.3m, 30A/208V, EPDU to NEMA L6-30P (US) Line CordY Y Y Y Y Y Y Y Y Y Y Y Y 40K96156501 4.3m, 60A/208V, EPDU to IEC 309 2P+G (US) Line CordN N Y N N N Y N N Y Y Y N 40K96176505 4.3m, 32A/230V, Souriau UTG Female to AS/NZ 3112 (Aus/NZ) Line Cord Y Y Y Y Y Y Y Y Y Y Y Y Y 40K961865064.3m, 32A/250V, Souriau UTG Female to KSC 8305 (S. Korea) Line CordY Y Y Y Y Y Y Y Y Y Y Y YPart number Feature code Description For more information, see the Lenovo Press documents in the PDU category:https:///servers/options/pduRack cabinetsA N ZA S E AB r a z i E E T M E A R UC I W E H T K I ND I A J A P A L AN A P R CRack cabinetsThe server supports the rack cabinets listed in the following table.Table 28. Rack cabinetsPart number Description201886X11U Office Enablement Kit93072PX25U Static S2 Standard Rack93072RX25U Standard Rack93074RX42U Standard Rack93074XX42U Standard Rack Extension93084EX42U Enterprise Expansion Rack93084PX42U Enterprise Rack93604EX42U 1200 mm Deep Dynamic Expansion Rack93604PX42U 1200 mm Deep Dynamic Rack93614EX42U 1200 mm Deep Static Expansion Rack93614PX42U 1200 mm Deep Static Rack93624EX47U 1200 mm Deep Static Expansion Rack93624PX47U 1200 mm Deep Static Rack99564RX S2 42U Dynamic Standard Rack99564XX S2 42U Dynamic Standard Expansion RackFor more information, see the list of Product Guides in the Rack cabinets category: https:///servers/options/racksKVM console optionsThe following table lists the supported KVM consoles, keyboards, and KVM switches. Table 29. Console keyboardsPart number DescriptionConsoles17238BX1U 18.5" Standard Console (without keyboard)Console keyboards00MW310Lenovo UltraNav Keyboard USB - US Eng46W6713Keyboard w/ Int. Pointing Device USB - Arabic 253 RoHS v246W6714Keyboard w/ Int. Pointing Device USB - Belg/UK 120 RoHS v246W6715Keyboard w/ Int. Pointing Device USB - Chinese/US 467 RoHS v246W6716Keyboard w/ Int. Pointing Device USB - Czech 489 RoHS v246W6717Keyboard w/ Int. Pointing Device USB - Danish 159 RoHS v246W6718Keyboard w/ Int. Pointing Device USB - Dutch 143 RoHS v246W6719Keyboard w/ Int. Pointing Device USB - French 189 RoHS v246W6720Keyboard w/ Int. Pointing Device USB - Fr/Canada 445 RoHS v246W6721Keyboard w/ Int. Pointing Device USB - German 129 RoHS v246W6722Keyboard w/ Int. Pointing Device USB - Greek 219 RoHS v2Part number Description46W6723Keyboard w/ Int. Pointing Device USB - Hebrew 212 RoHS v246W6724Keyboard w/ Int. Pointing Device USB - Hungarian 208 RoHS v246W6725Keyboard w/ Int. Pointing Device USB - Italian 141 RoHS v246W6726Keyboard w/ Int. Pointing Device USB - Japanese 194 RoHS v246W6727Keyboard w/ Int. Pointing Device USB - Korean 413 RoHS v246W6728Keyboard w/ Int. Pointing Device USB - LA Span 171 RoHS v246W6729Keyboard w/ Int. Pointing Device USB - Norwegian 155 RoHS v246W6730Keyboard w/ Int. Pointing Device USB - Polish 214 RoHS v246W6731Keyboard w/ Int. Pointing Device USB - Portuguese 163 RoHS v246W6732Keyboard w/ Int. Pointing Device USB - Russian 441 RoHS v246W6733Keyboard w/ Int. Pointing Device USB - Slovak 245 RoHS v246W6734Keyboard w/ Int. Pointing Device USB - Spanish 172 RoHS v246W6735Keyboard w/ Int. Pointing Device USB - Swed/Finn 153 RoHS v246W6736Keyboard w/ Int. Pointing Device USB - Swiss F/G 150 RoHS v246W6737Keyboard w/ Int. Pointing Device USB - Thai 191 RoHS v246W6738Keyboard w/ Int. Pointing Device USB - Turkish 179 RoHS v246W6739Keyboard w/ Int. Pointing Device USB - UK Eng 166 RoHS v246W6740Keyboard w/ Int. Pointing Device USB - US Euro 103P RoHS v246W6741Keyboard w/ Int. Pointing Device USB - Slovenian 234 RoHS v2Console switches1754D2X Global 4x2x32 Console Manager (GCM32)1754D1X Global 2x2x16 Console Manager (GCM16)1754A2X Local 2x16 Console Manager (LCM16)1754A1X Local 1x8 Console Manager (LCM8)Console switch cables43V6147Single Cable USB Conversion Option (UCO)39M2895USB Conversion Option (4 Pack UCO)46M5383Virtual Media Conversion Option Gen2 (VCO2)46M5382Serial Conversion Option (SCO)For more information, see the list of Product Guides in the KVM Switches and Consoles category: /servers/options/kvmRelated publications and linksTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®Lenovo ServicesRackSwitchServeRAIDServerGuideServerProven®System x®ThinkSystem®UltraNav®eX5eXFlashThe following terms are trademarks of other companies:Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries.Linux® is the trademark of Linus Torvalds in the U.S. and other countries.Microsoft®, Windows Server®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.Other company, product, or service names may be trademarks or service marks of others.。
MIC2033 高精度高侧固定电流限制电源分布开关说明书
MIC2033 Evaluation BoardHigh-Accuracy, High-Side, Fixed Current Limit Power SwitchMicrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 •General DescriptionThe MIC2033 is a high-side MOSFET power distribution switch providing increased system reliability using 5% current limit accuracy.The MIC2033 has an operating input voltage range from 2.5V to 5.5V, is internally current limited, and has thermal shutdown to protect the device and system. The MIC2033 is offered with either active-high or active-low logic level enable input controls. It has an open drain fault status output flag with a built-in 32ms delay that asserts low during overcurrent or thermal shutdown conditions.The MIC2033 is available with several different fixed current limit options: 0.5A, 0.8A, 1A, and 1.2A. A capacitor-adjustable soft-start circuit minimizes inrush current in applications using high capacitive loads.The MIC2033 is offered in both 6-pin SOT-23 and 6-pin 2mm x 2mm thin DFN packages. It has an operating junction temperature range of −40°C to +125°C. RequirementsThe MIC2033 evaluation board requires a single power supply to provide V IN . The V IN power supply must be able to deliver a minimum of 2.5V and more than 1.5A capability. The output load can either be active or passive. PrecautionsThe evaluation board does not have reverse polarity protection. Applying a negative voltage to the V IN terminal can damage the device. In addition, the maximum V IN operating voltage of the MIC2033 evaluation board is 5.5V. Exceeding 5.5V on V IN can permanently damage the device.Getting Started1. Connect an external supply to the V IN terminal .Apply the desired input voltage to the V IN and ground terminals of the evaluation board, paying careful attention to polarity and supply voltage. The user can place an ammeter between the input supply and the V IN terminal to the evaluation board. Make sure that the supply voltage is monitored at the V IN terminal. The ammeter and/or power lead resistance can reduce the voltage supplied to the input.2. Connect the load to the V OUT and ground terminals.The load can be either passive (resistive) or active (as in an electronic load). The user can place an ammeter between the load and the V OUT terminal. Make sure that the output voltage is monitored at the V OUT terminal.3. Enable the switchThe MIC2033-12AYxx evaluation boards are configured for default enable using a 10k Ω pull-up resistor from the ENABLE pin to VIN. To disable the switch, place a jumper short across the jumper pins at TP2. The MIC2033-05BYxx evaluation boards are configured for default disable. To enable the switch, place a jumper short across the jumper pins at TP2. 4. Fault detectionThe MIC2033 is equipped with an error flag, FAULT/. TP3 is provided to monitor the FAULT/ pin.Ordering InformationPart Number DescriptionMIC2033-05BYM6 EV Evaluation board featuring the MIC2033-05BYM6 500mA Switch MIC2033-12AYM6 EV Evaluation board featuring the MIC2033-12AYM6 1.2A Switch MIC2033-05BYMT EV Evaluation board featuring the MIC2033-05BYMT 500mA Switch MIC2033-12AYMT EVEvaluation board featuring the MIC2033-12AYMT 1.2A SwitchApplication InformationSoft-StartSoft-start reduces the power supply input surge current at startup by controlling the output voltage rise time. The input surge appears while the output capacitor is charged up. A slower output rise time draws a lower input surge current.During soft-start, an internal current sink discharges the external capacitor at CSLEW to ground to control the ramp of the output voltage. The output voltage rise time depends on the value of C CSLEW, the input voltage, output voltage, and the current limit. Micrel recommends that the value of the CSLEW external capacitor be in the range of 0.1µF to 1µF. For the MIC2033 evaluation board, CSLEW = C3 = 0.1µF. Output VoltageThe MIC2033 evaluation board is available with either a 0.5A or 1.2A fixed current limit. If the output current exceeds the current limit, the MIC2033 switch enters constant current limit mode. The maximum allowable current limit can be less than the full specified and/or expected current if the MIC2033 is not mounted on a circuit board with sufficiently low thermal resistance. The MIC2033 responds to short circuits within 10µs to limit the output current. It also provides an output fault flag that asserts (low) for an overcurrent condition that lasts longer than the overcurrent fault response delay time (t FAULT/), which is typically 32ms.MIC2033-xxxYMx Evaluation Board SchematicsMIC2033-xxxYMT Evaluation BoardMIC2033-xxxYM6 Evaluation BoardBill of MaterialsNumber Manufacturer Description Qty. Item PartC1608X5R0J105K TDK(1)C1, C21.0µF/6.3V ceramic capacitor, X5R, 0603 206036D105KAT2A AVX(2)06033C104KAT2A TDK0.1µF/25V ceramic capacitor, X7R, 0603 1C3C1608X7R1E104K AVXR1, R2 CRCW060310K0FKEA Vishay/Dale(3) 10.0kΩ, film resistor, 0603, 1% 2U1 MIC2033-xxxYMx Micrel(4)High-accuracy, high-side, fixed current limit power switch 1Notes:1. TDK: .2. AVX: .3. Vishay: .4. Micrel, Inc.: .Evaluation Board PCB LayoutMIC2033-xxxYMT Evaluation Board – Top LayerMIC2033-xxxYMT Evaluation Board – Bottom LayerEvaluation Board PCB Layout (Continued)MIC2033-xxxYM6 Evaluation Board – Top LayerMIC2033-xxxYM6 Evaluation Board – Bottom Layer。
Liebherr 新型长筒机介绍说明书
Pressinformation New telescopic handler series: Liebherr presents 8 new models in 26 different versions∙Lifting heights from 6 m to 10 m in two different model lines∙Dynamic travel drive, powerful and fast working hydraulics∙Extensive options for a wide range of applications∙Machine hitches from various manufacturers make it easier to use existing tool attachments∙Sales collaboration with Claas for customers from the agricultural sectorLeoben (Austria), 24 October 2017 – In the course of 2018, Liebherr will launch 8 new telescopic handler models in a total of 26 different versions. The new Liebherr telescopic handlers will be available in two model lines: First, the top-of-the-range models for materials handling or for production applications (identified by the suffix S). Second, the simple, cost-optimised value models for stacking and lifting applications.As of January, three 7 metre models with a load bearing capacity of 3.2 t, 3.6 t and 4.1 t, one 6 metre model with a load bearing capacity of 3.5 t and one 10 metre model with a load bearing capacity of 3.3 t will be produced in the manufacturing plant in Telfs, Tirol. Two additional 7 metre models with a load bearing capacity of 4.6 t and 5.5 t will follow in the course of the year. A 9 metre model with a load bearing capacity of 6 t will complete the extensive range of the new Liebherr telescopic handlers for the time being.In the new generation of telescopic handlers, Liebherr is also relying on established Deutz diesel engines. These have been optimised in terms of performance and fuel consumption and have a displacement of 3.6 l and 74 or 100 kW and a displacement of 4.1 l with 115 kW. The engines comply with Stage IV/Tier 4 Final emission standards thanks to the diesel oxidation catalyst (DOC) and selective catalytic reduction (SCR).The telescopic handlers with a displacement of 4.1 l are additionally equipped with diesel particulate filters; this is offered ex-works as an option for engines with a displacement of 3.6 l. For operating sites in countries with differing emission regulations, where the diesel grade available often has a negative impact on engineoperation, Liebherr will also offer telescopic handlers in emission Stage IIIa, staggered over time. When it comes to the travel drive, Liebherr relies on the established hydrostatics. The infinitely variable, and always powerful, hydrostatic drive produces a maximum traction of up to 70 kN, depending on the engine power available.The new Liebherr telescopic handlers have a maximum speed of 40 km/h. As an alternative, the machines are offered in speed versions of 20 km/h and 30 km/h. The telescopic handlers are braked without wear by means of the hydrostatic drive's self-stoppage function. The "Liebherr hill assist", installed as standard, ensures safety and maximum driving comfort when travelling over uneven ground thanks to the automatic activation of the parking brake.The machines' performance has been improved as a result of the complete redesign of the working hydraulics. As an alternative to the established working hydraulics in the value models, Liebherr is equipping the S models with high-performance hydraulics. A powerful load sensing working hydraulic pump with an oil output of 160 l/min and a control block with load-independent flow rate distribution enable overlapping working movements and therefore dynamic and rapid operating cycles.Different machine hitches are offered for all models in the new generation of telescopic handlers ex-works. In addition to the Liebherr quick coupler, quick couplers which are compatible with the machine hitches from the manufacturers Claas, Manitou, Kramer, JCB and Volvo are also offered. The variety of machine hitches available means that customers can also use their existing tool attachments from other manufacturers on the Liebherr telescopic handlers.Application-specific user requirements were used as crucial design criteria for the new Liebherr telescopic handlers. The developers focused specifically on ideal visibility and intuitive and convenient operation.The machine's new design guarantees ideal visibility of the load to the front for high machine productivity, as well as to the side and to the rear for optimum safety. This is achieved in particular by the very low linkage point of the telescopic boom and by the edges, which slope outwards, and therefore the engine bonnet which follows the line ofsight. With an all-round windscreen and the narrow internal ROPS/FOPS guard, which is adapted to the line of sight, the cab contributes to providing the best view of the load.Other design aspects focus on intuitive operation, comfort and ergonomics. The 5-in-1 joystick installed in the value models, or the multifunctional joystick integrated into the S models, enables all essential operating functions to be carried out using single-arm operation, so that the driver's left hand remains safely on the steering wheel at all times.Even before its official market launch, the new T46-7 model won two design awards.. The German Design Council named this telescopic handler as the winner of the renowned "German Design Award 2018" in the transportation category for its ideal visibility and its dynamic appearance. It also won the "Red Dot Product Design Award 2017".The spacious cab, the tilting steering column, various adjustable seat versions and the intelligently designed operating and switch system improve ergonomics and therefore create optimum comfort. This is additionally supported by the very wide range of options available ex-works. These include the "Liebherr comfort drive", a driving vibration damper for comfortable driving with low vibrations, as well as camera systems, lubrication systems and different lighting packages for optimum illumination of the work environment. The manual control package, which can be used to conveniently match the speed of the travel drive and the working hydraulics to the requirements of the specific usage case, is especially innovative.A wide range of additional options allows the new telescopic handlers to be configured for specific applications. For instance, Liebherr offers its customers ex-works a reversible fan for cleaning the radiator and additional safety guards or covers for the travel drive and main frame. Automatic pressure relief for the working hydraulics in order to make replacing tool attachments simple, an additional hydraulic circuit for actuating further functions on the boom head and a separate control option for the hydraulic oil flow rate in the working hydraulics are also offered.In March 2015, Liebherr-Werk Telfs GmbH entered into an OEM partnership with the Claas Group. This collaboration involves the development, production and supply ofsignificant quantities of telescopic handlers. As a result, Liebherr will in future be able to access additional sales potential in the agricultural sector in addition to the traditional target segments of the construction industry. The first telescopic handlers will be delivered to Claas in January 2018.Captionsliebherr-tl36_7-telescopic-handler1.jpgLiebherr's new TL 36-7 telescopic handler demonstrates its performance when used in sawmills.liebherr-tl36_7-telescopic-handler2.jpgThe cab in the new Liebherr telescopic handlers offers ideal visibility.liebherr-tl33_10-telescopic-handler.jpgLiebherr TL 33-10 telescopic handler: New development in the 10 m class.Contact personAlexander KatryczPhone: +43 (0) 508096-1416E-mail:******************************Published byLiebherr-Werk Telfs GmbHTelfs, Austria。
Silent Knight 5820XL Addressable Fire Alarm Contro
IntelliKnight 5820XL is the first fire alarm system to provide you with revolutionary value and performance in addressable sensing technology. The 5820XL FACP offers exclusive, built-in digital communication, distributed intelligent power, a modular design and an expanded, easy to use interface. Powerful features such as drift compensation and maintenance alert are delivered in this powerful FACP from Silent Knight.For more information about the 5820XL system, or to locate your nearest source, please call 800-328-0103.Model 5820XLDescription5820XL is an intelligent addressable fire alarm control panel (FACP). The basic 5820XL system can be expanded by adding modules such as 5860 remote annunciator, 5815XL signalling line circuit expander, 5824 serial/parallel printer interface module (for printing system reports), and 5895XL intelligent power module. 5820XL supports SD or SK devices. 5820XL also features a powerful built-in dual line fire communicator that allows for reporting of all system activity to a remote monitoring location.Features•Built in support for 99 SK detectors and 99 SK modules,expandable to 396 SK detectors and 396 SK modules using System Sensor protocol•Built in support for 127 SD devices, expandable to 508 SD devices using the SD protocol.•Uses standard wire—no shielded or twisted pair required •Built-in digital communicator•Central station reporting by point or by zone•Built-in synchronization for appliances from AMSECO®,Gentex®, Faraday, System Sensor, and Wheelock®•Flexput™ I/O circuits•Supports Class B (Style 4) and Class A (Style 6) configuration for SLC, SBUS, and Flexput circuits•13 pre-programmed output cadences (including ANSI-3.41)and 4 programmable outputs•Built-in annunciator with 80-character LCD display•RS-485 bus provides communication to system accessories •Built-in RS-232 and USB interface for programming via PC •Built-in Form C trouble relay rated at 2.5 amps at 27.4 VDC •Improvements in SKSS software deliver five times faster uploads/downloads•Two built-in Form C programmable relays rated at 2.5 amps at 27.4 VDC•Plex-1 door option combines a dead front cabinet door with a clear window, limiting access to the panel while providing single button operation of the reset and silence functions•6 amp power supply and maximum charging capacity of 35 amp hours (An additional cabinet enclosure is required for batteries in excess of 18 amp hours)•Programmable date setting for Daylight Saving TimeInstallationThe 5820XL can be surface or flush mountedCompatibilityThe 5820XL signal line circuit (SLC)supports multiple device types of the same protocol:•SK (System Sensor)•SDYou cannot mix SD and SK SLC devices on a FACP .IntelliKnight Model 5820XLAddressable Fire Alarm Control PanelIndicator LightsGeneral Alarm (Red): Flashes when in alarm; solid when alarm silenced Supervisory (Yellow): Flashes when a supervisory condition exists; solid when supervisory silencedSystem Troubles (Yellow): Flashes when a trouble condition exists; solid when trouble silencedSystem Silenced (Yellow): On when an alarm, trouble or supervisory condition has been silenced but not yet cleared System Power (Green): Flashes for AC failure; solid when power systems are normalSystem Application5820XL has one built-in signalling line circuit (SLC) which supports multiple devices dependent on protocol being used. Three additional loops can be added using the 5815XL SLCexpanders to increase overall capacity.The 5820XL SLC loops support multiple device types, including:•Addressable photoelectric smoke detector •Addressable ionization smoke detector •Addressable heat sensor •Addressable duct smoke detector •Contact module •Relay output module•Addressable notification module •Addressable beam detector (SK protocol only)•Addressable multi-criteria smoke detector (SK protocol only)•Addressable multi modules (SK protocol only)The following advanced sensorcapabilities are available with 5820XL:•Automatic drift compensation •Maintenance alert•Built-in sensor test to comply with NFPA 72 calibration testing requirements5820XL features a 6 amp power supply and maximum battery chargingcapacity of 35 amp hours. An additional cabinet enclosure (PN RBB) is required for batteries in excess of 18 amp hours.Flexput circuits on 5820XL control can be individually programmed to function as notification circuits, auxiliary power outputs, or initiation circuits that support both 2- and 4-wire smoke detectors.The 5820XL system operates on non-twisted, unshielded cable when wired in compliance with standard wiring practices as called out in the National Electric Code 760-51 specifications for power-limited fire protective signalling cables. No special wiring is required.5820XL provides 13 preset notification cadence patterns (including ANSI 3.41)and four user programmable selections for fire alarm notification.Two programmable general purpose Form C relay outputs are provided on 5820XL.Additionally, the IntelliKnight system features a built-in walk test and auto-programming. Its innovative, dead-front cabinet design allows for flush orsurface mounting. System maintenance is easy to perform.User InterfaceThe 5820XL built-in annunciator with 80 character LCD display and large easy-to-use tactile touchpad can be used for system operation,programming and maintenance. It has five LEDs for alarm, supervisory,system trouble, system silenced and system power. System operations include silencing alarms and troubles,resetting alarms and the display of alarm troubles and memory. The system's non-volatile event history buffer stores 1000 events for viewing from the built-in or remote annunciator.System operation can be initiated with a mechanical firefighter's key or a valid 4- to 7-digit operator's code.ProgrammingThe IntelliKnight system offers several options to simplify and speed upprogramming. The JumpStart ®feature minimizes programmingrequired to start a new system. The built-in keypad and 5860 remoteannunciator give on-site access to all programming. You can also program remotely using the 5660 Silent Knight Software Suite, which is Windows ®-based software.Built-In Digital Communicator5820XL features a built-in UL listed digital communicator for remotereporting of system activity and system programming. The communicator has the ability to seize two telephone lines to report alarms and troubles to a monitoring facility. The communicator supervises two phone lines and will activate a trouble signal if a line failure is sustained for more than 45 seconds.Other communication features include:retry if communication fails, two phone number capability, download phone number capability and Touch-Tone or rotary dialing. The communicator is compatible with SIA and AdemcoContact ID. The format is selectable by account number.ApprovalsNFPA 13, NFPA 15, NFPA 16, NFPA 72: Central Station; Remote Signalling; Local Protective Signalling Systems; Auxiliary Protected Premises Unit; & Water Deluge Releasing Service. Suitable for automatic,manual, waterflow, sprinkler supervisory (DACT non-coded)signalling services.Other Approvals: UL Listed; CSFM 7165-0559:0135;MEA 429-92-E Vol. VI; FM ApprovedIntelliKnight Model 5820XL Addressable Fire Alarm Control PanelMade in AmericaPN 350210 Rev J© 2017 Honeywell International Inc.This document is not intended to be used for installation purposes. We try to keep our product information up-to-date and accurate. We cannot cover all specific applications or anticipate all requirements. All specifications are subject to change without notice.For more information, contact Silent Knight 12 Clintonville Road, Northford, CT 06472Phone: (203) 484-7161, Fax: (203) 484-7118. .IntelliKnight & JumpStart are Registered Trademarks of Silent KnightFlexput is a Trademark of Silent KnightIntelliKnight Model 5820XLAddressable Fire Alarm Control Panel。
行业专业名词解释(Explana...
行业专业名词解释(Explanation of professional terms inindustry)Explanation of professional terms in industryExplanation of professional termsCAD (Computer Aided Design, referred to as CAD) computer aided designCAM (Computer Aided Manufacture) computer aided manufacturingCAPP Computer Aided Process Planning, referred to as CAPP. Computer aided process planningComputer aided engineering analysis of CAE (Computer Aided Engineering, referred to as CAE)ERP (Enterprise resource plan) Enterprise Resource PlanningManagement PDM Product Data in product data management products as the center, through the computer network and database technology, the production process of all product related information and process integration management technology.BPR (Business Process Reengineering Business Process Reengineering): from reconsider fundamentally and radical redesign of business processes to achieve the key performance, such as cost, quality, service and speed of response, made breakthrough progress.BOM bill of materials (Bill of Materials) it is a description of the assembly parts list structured, including all sub assemblies, parts, raw materials and making a list of assemblies required quantity of materials, such as labor, material, equipment, tooling and workshop etc..MRP material requirements planning (Material Requirement Planning). MRP is a computer aided production planning management system integrating inventory management and production schedule planning. It aims to reduce the inventory and provide the managers with the means of supplying materials to meet the production plan.MRPII manufacturing resource planning (Manufacturing Resource Planning). It is developed on the basis of material requirement planning (MRP). It not only prepares the production schedule and material purchasing plan of products and parts, but also obtains various financial information directly from the system, such as sales revenue, inventory capital occupation and product cost. It is a management information system covering all production resources of enterprise.SCM supply chain management (Supply Chain Management). The supply chain consists of suppliers, manufacturing plants, distribution networks, customers and so on. Supply chain management is the management of "logistics", "capital flow", "information flow", and "value-added flow" and "workflow" in the supply chain.CRM Customer Relationship Management (Customer Relation Management). Automate and improve business processes relatedto managing customer relationships in the areas of sales, marketing, customer service and support.Finite element analysis of the object is divided into finite elements, these elements are connected with each other by a finite element node, can not be regarded as a rigid body deformation, the force between the nodes of the transfer unit, and then establish the unit matrix by using the energy principle; in the input material properties, loads and constraints such as boundary conditions, object deformation, should calculate the mechanical properties of stress and temperature field by computer. Finally, the calculation results show the deformation after the object shape and stress distribution.Digital control, referred to as numerical control, refers to the use of discrete digital information to control the operation of mechanical devices such as NC (Numerical Control)CNC (Computer Numerical Control, computer numerical control), refers to the use of computer as a control device in general CNC systemB2C a business to personal e-commerce, which uses computer networks to direct consumers to participate in economic activitiesB2B a kind of electronic commerce mode of enterprise to enterprise, the whole transaction behavior of ordering, selling and delivering between enterprise and enterprise is carried out in the way of electronic commerceEnterprise informatization enterprise business process reorganization (optimization) as the basis, the use of computer technology, network technology and database technology in a certain depth and breadth, all information control and integrated management in enterprise production and operating activities,To realize the sharing and effective use of the internal and external information of enterprises, so as to improve the economic efficiency and market competition ability of enterprises.Electronic Commerce refers to the electronic realization of the whole trade activities. From the coverage area can be defined as: parties to electronic transactions rather than through face-to-face interviews or direct way to exchange any form of commercial transactions; from the technical aspects can be defined as: e-commerce is a combination of multiple technologies, including the exchange of data (such as electronic data exchange, data sharing, access (email) database, electronic bulletin board) and automatic data capture (barcode) etc.. Refers to the use of information technology to deal with business activities of the system. You can also have other names, such as Electronic Business, Net Commerce, Internet commerce, Eeb commerce, Web shopping, etc., called unified e-commerce.Concurrent engineering and concurrent engineering is the essence in the product design stage to fully predict the products in the manufacturing, assembly, sales, customer service and service use, scrap, recycling in the process of"performance", find out the existing problems, timely revision and optimization.Virtual manufacturing virtual manufacturing (Virtual manufacturing, also translated as "virtual manufacturing"), is the application of virtual reality (Virtual reality) technology (also translated as "magic truth" technology or "spirit" technology) in manufacturing. Virtual reality technology is based on the multimedia computer audio and video technology and advanced sensing technology, make a scene, to the immersive "real" feeling.CIMS Integrated Manufacturing Computer System (CIMS) is a new generation of manufacturing system under the condition of modern information technology. It takes integrated computer aided manufacturing system, in order to fully and timely exchange of information and information sharing, enterprise design, technology, production and marketing management department and workshop integrated an organic whole, mutually coordinated operation, to ensure that the overall efficiency of enterprises, improve the enterprise's competitive ability and survival ability.Agile manufacturing (Agile Manufacturing, referred to as AM): refers to the enterprise to be able to grasp the market opportunity, timely dynamic reorganization of production system, in the shortest time (compared with other enterprises) launched high quality profitable, user acceptance, products to the market. The use of computer networks to coordinate local, remote, and even foreign manufacturing or manufacturing resources (equipment, product design or process regulations)into a whole, for common purposes, coordinated efforts. If CIMS focuses on the integration and exchange of information among the departments and links within the enterprise, agile manufacturing develops into the integration and information exchange between enterprises. Enterprises connected by computer networks are called "Virtual Enterprise", and some Chinese documents are translated into "virtual enterprises"".The manufacturing system and manufacturing process that mimics the organization and operation patterns of biological organisms is called Bionic Manufacturing. People in the "bionic manufacturing" is not only from nature, but also to learn their own grasp organization mode and operation mode. If the mechanization and automation of the manufacturing process extend human strength, and intelligence extends human intelligence, then "bionic manufacturing" is the extension of human's own organizational structure and evolution process.Green manufacturing and green manufacturing is a modern manufacturing model considering the environmental impact and resource efficiency, the goal is to make products from the design, manufacturing, transportation, use and disposal of the entire product life cycle, the impact on the environment (negative effect) minimum, resource utilization efficiency is highest. Green manufacturing is the embodiment of sustainable development strategy in manufacturing industry. In other words, green manufacturing is the sustainable development mode of modern manufacturing industry.Obviously, the implementation of the sustainable development strategy is closely related to the adjustment of the industrialstructure of the manufacturing industry and the revitalization and development of the enterprise.Rapid prototyping is a process from three-dimensional to two-dimensional (software discretization), and then from two-dimensional to three-dimensional (material accumulation).Three dimensional modeling of CAD has three levels of building method, that is, wireframe, surface and entity, that is, corresponding to the use of one-dimensional lines,two-dimensional surface and three-dimensional body to form the body.Author: yifuncadSource: CAD world。
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Perry Y.Li Department of Mechanical Engineering,University of Minnesota,111Church St.SE,Minneapolis,MN55455e-mail:pli@ Dynamic Redesign of a Flow Control Servovalve Using a Pressure Control Pilot1In this paper,the dynamic performance of an unconventional two-spoolflow control servovalve using a pressure control pilot is analyzed.Such valves are less expensive than typical servovalves but also tend to be limited in their dynamic performance.Based on a previously developed eight state nonlinear model,we develop a simplified linear model which is able to capture the essential dynamics of the ing root locus analysis method,the limitation in dynamic performance is shown to be due to a‘‘zero’’introduced by the structure of the interconnection of the subsystems.Design parameters that move the zero further to the left half plane,and do not adversely affect other steady-state criteria are identified.The effectiveness of these parameters to improve the dynamic performance is demonstrated.This analysis demonstrates how the structure of the interactions between subsystems in a dynamic component,such as a hydraulic valve,can critically limit the dynamic performance of the component.͓DOI:10.1115/1.1485288͔I IntroductionMost designs of servo-flow control valves͓1͔consist of a single spool boost stage,a nozzleflapper pilot,and a feedback wire. These valves have very high performance but tend to be expensive because of the stringent manufacturing tolerances and the compli-cated assembly process.A less common,commercially available alternate design͑Fig.1͒consists of a pressure control pilot stage and a boost stage that uses two separate spools to independently meterflow into and out of the valve.Since the critical dimensions are easier to adjust and a feedback wire is not used,such valves are easier to manufacture and assemble.Consequently,they tend to be cheaper.Readers are also referred to͓2͔,in which an experi-mentally validated complete physical model is presented,for a more detailed discussion of the advantages of the unconventional two-spool servovalve.Despite these advantages,the unconven-tional two-spool servovalve design tends to have lower dynamic performance in terms of bandwidth compared to the conventional servovalve design utilizing a single spool and a feedback wire. For example,the valves studied in͓2,3͔have bandwidths between 15–40Hz whereas conventional servovalves of similarflow rat-ings can have bandwidths of over100Hz.It would therefore be advantageous if dynamic response of the two-spool design can be improved.In this paper,we study the unconventional two-spool design so as to understand the nature of the performance limitation,and to suggest design modifications for potential performance improve-ments.The experimentally validated eight state nonlinear physical model derived in͓2͔consists of the interconnection of three sub-systems.This model is similar to the one constructed by Lin and Akers previously͓3͔.Using this model,we develop a simplified five state linear model that retains the interconnection structure as well as the dominant dynamics.The reduced model reveals a puz-zling aspect of the valve dynamics in that each of the three sub-systems has bandwidth at least an order of magnitude higher than the bandwidth of the complete ing simple root locus arguments,it is found that the way in which the subsystems are interconnected creates a zero which causes the bandwidth of the interconnected system to be significantly lower than the individualsubsystems.Based on this insight,several system parameters thatcan potentially improve the dynamic performance without ad-versely affecting the steady-state performance͑such asflow gain͒are identified,and their effects demonstrated.The rest of the paper is organized as follows.In Section II,weformulate a simplified model of the two-spoolflow control servo-valve.The interconnections of the three linearized subsystems arestudied using root locus techniques in Section III.Section IV pre-sents the effort to optimize the performance by applying the in-sights gained in Section III.Sections V and VI contain discussionand concluding remarks,respectively.II Simplified Model of the Two-Spool Flow Control ServovalveThe unconventionalflow control servovalve shown in Fig.1uses a two-spool boost stage and a pressure controlflapper-nozzlepilot stage.The two stages are separated by a simple transitionplate and connected via two pressure chambers.The design philosophy of the valve is as follows.The pressurecontrol pilot stage generates a differential pressure between thetwofluid chambers adjacent to theflapper,determined by thecurrent input to and the torque generated by the electromagnetictorque motor.For example,if the torque motor applies a counterclockwise torque to theflapper,theflapper displaces to the right.This tends to increase the pressure P2and to decrease the pressureP1.The differential pressure acts on the two ends of the twospools in the boost stage.Since the spools are spring centered,their equilibrium displacements will be roughly proportional tothe differential pilot pressure and inversely proportional to thecombined mechanical andflow force induced spring stiffness.Flows into and out of the valve are separately metered accordingto the displacements of the two spools.A Review of Full State Model.The servovalve can be con-sidered an interconnection of three subsystems:͑1͒the pilot sub-system whose states are theflapper displacement x f͑left to right positive͒and velocity x˙f;͑2͒the pressure chambers whose statesare the chamber pressures P1and P2;and͑3͒the boost stagespool dynamics whose states are the displacements and velocitiesof the two spools x a,x˙a and x b,x˙b.Therefore,the total numberof states is eight.Following͓2͔,the dynamics of the pilot subsystem can be rep-resented by:1Most of this work was presented at the ASME IMECE-2001Symposium onControl and Modeling of Fluid Power Systems͑DSC Division2B-1͒in New YorkCity,November2001.Contributed by the Dynamic Systems and Control Division for publication in theJ OURNAL OF D YNAMIC S YSTEMS,M EASUREMENT,AND C ONTROL.Manuscriptreceived by the Dynamic Systems and Control Division February1,2001.AssociateEditor:N.Manring.428ÕVol.124,SEPTEMBER2002Copyright©2002by ASME Transactions of the ASMEM p x ¨f ϩB p x ˙f ϩK ¯p x f ϭA n ͑P 1ϪP 2͒ϩ4C d f 2͓͑x f o ϩx f ͒2P 1Ϫ͑x f o Ϫx f ͒2P 2͔ϩg ͑x f ,i ͒(1)where M p ,B p ,and K¯p are,respectively,the combined inertia,damping,and mechanical stiffness of the flapper,x f o is the null nozzle-flapper gap when x f ϭ0,and C d f is the discharge coeffi-cient of the flapper-nozzle,A n is the nozzle area.The first and second terms on the right-hand side correspond,respectively,to the pressure and the flow induced forces at the nozzle,and g (x f ,i ),which is a highly nonlinear function ͑see ͓2͔for details ͒,represents the force on the flapper generated by the electromag-netic torque motor with input current i .The dynamics of the two boost stage spools are givenby:(2)(3)where x a and x b represent the upward displacements of spools A and B,respectively,M s is the spool inertia,B s is the viscous damping coefficient,2K s is the total stiffness of the two springs above and below the spools ͑Fig.1͒,A s is the spool area.The steady-state and transient flow forces manifest themselves asspring forces and positive/negative damping forces with K¯f (•,•)Ͼ0,and B ¯f (x ,P )Ͼ0when x Ͼ0,B ¯f (x ,P )Ͻ0when x Ͻ0,and not well defined when x ϭ0.Therefore,depending on the sign of the spool displacement,the transient flow force may introduce nega-tive damping effects.The third subsystem is associated with the dynamics of the pressures P 1,P 2in,respectively,the upper and the lower fluid chambers connecting the pilot stage and the boost stage spools.Its dynamics are given by:P˙1ϭQ 1͑P 1,x f ͒ϪV ˙1͑t ͒V 1͑t ͒;P ˙2ϭQ 2͑P 2,x f ͒ϪV˙2͑t ͒V 2͑t ͒.(4)Here,Q 1(P 1,x f )and Q 2(P 2,x f )are the total flows into the upperand lower chambers,V 1(t )and V 2(t )are the volumes in the chambers,and is the compressibility of the fluid.Q 1(P 1,x f )and Q 2(P 2,x f )are comprised of the flows from the pilot supply orifice,leakage past the nozzle,and to a small extent,leakage past the spools:for i ϭ1and 2,Q i ϭC d 0A 0ͱ2͑P spϪP i ͒ϪC d f D n ͑x f o Ϯx f ͒ͱ2P iϪleakage i (5)where ‘‘ϩ’’sign is used for i ϭ1and ‘‘Ϫ’’sign is used for i ϭ2,P sp is the pilot supply pressure ͑which is usually lower than the supply pressure for the boost stage ͒,A o is the area of the orifice to the supply pressure,C d 0and C d f are the discharge coefficients of the orifice to the supply and the gap between the flapper and nozzle.The first two terms in ͑5͒are monotonically decreasing functions of P i .Thus,they provide at least local exponential stability for the pressure dynamics ͑4͒.Notice also the pilot stage communicates with the chamber pressures via Q 1and Q 2since they depend on the flapper displacement x f .On the other hand,the pressure chambers are affected by theboost stage spool dynamics via V 1(t ),V 2(t ),V˙1(t ),and V ˙2(t )in ͑4͒sinceV 1ϭV 1o ϪA s x a ϪA s x b ,(6)V 2ϭV 2o ϩA s x a ϩA s x b (7)V˙1ϭϪV ˙2ϭϪA s x ˙a ϪA s x ˙b (8)where V 1o and V 2o are the chamber volumes when the spools are centered (x a ϭx b ϭ0).For details of the model,readers are re-ferred to ͓2͔.B Reduced Order Linear Model.In order to obtain mean-ingful design information,we consider a reduced fifth-order linear model.This is achieved as follows:1In the spool system,we consider only the total spool dis-placement ͑not the displacements of the individual spools ͒⌺͑t ͒ϭϪ͑x a ͑t ͒ϩx b ͑t ͒͒.2In the pressure chamber system,we consider only the differ-ential pressure⌬P ͑t ͒ϭP 1͑t ͒ϪP s ͑t ͒.3The transient component of the flow forces and leakage flows past the spools are ignored.4The pilot stage dynamics in ͑1͒,the spool dynamics in ͑2͒–͑3͒and the differential pressure dynamics obtained from ͑4͒are linearized at the equilibrium condition given by flapper displace-ment x f ϭ0,chamber pressures P 1ϭP 2ϭ.P ¯,spool displacements x a ϭx b ϭ0,spool velocities x ˙a ϭx ˙b ϭ0,chamber volumes V 1ϭV 2ϭ(V 10ϩV 20)/2ϭ.V ¯,and work pressures P a ϭP b ϭP s /2where P s is the boost stage supply pressure.The rationale for ignoring the mean pressure (P 1ϩP 2)/2is that near the equilibrium,the chamber pressures P 1and P 2affect the pilot and spool dynamics ͑1͒,͑2͒,͑3͒,predominantly through (P 2ϪP 1),and individually only through second ordereffects.Fig.1A two-spool flow control servovalve using a pressure control pilot state.Journal of Dynamic Systems,Measurement,and ControlSEPTEMBER 2002,Vol.124Õ429Because the linearized dynamics of the spools’differential dis-placement(⌬xªx aϪx b)are given by an exponentially stable system driven by the difference in theflow forces,M s⌬¨xϩB s⌬˙xϩ͑2K sϩK f͒⌬xϭdifference inflow forces(9)⌬x would be small since the difference inflow forces are small. The dynamics of⌬x are therefore also neglected.The resulting reduced linear models for the pilot,chamber pres-sure and spool subsystems are,respectively:Pilot subsystemM p x¨fϩB p x˙fϩK p x fϭ͑A nϩB͒⌬PϩG•i(10) Pressure chamber subsystem⌬˙PϭϪ␣V¯⌬PϪ2␥V¯x fϩ2A sV¯⌺˙͑t͒(11)Spool subsystemM s⌺¨ϩB s⌺˙ϩ͑2K sϩK f s͒⌺ϭϪ2A s⌬P͑t͒(12) whereGªץgץiͯx fϭ0,iϭ0,K f sªK¯f͑0,P s/2͒,K pϭK¯pϪ16C d f2x f o P¯Ϫץgץx fͯx fϭ0,iϭ0,BªC d f2x f o2,␥ϭϪץQ1ץx fͯP¯,x fϭ0ϭץQ2ץx fͯP¯,x fϭ0,␣ϭϪץQ1ץP1ͯP¯,x fϭ0ϭϪץQ2ץP2ͯP¯,x fϭ0(13)B,␥,and␣are all positive quantities.The expression for K p shows that the nozzleflow forces and the magnetics tend to offset the mechanical stiffness K¯p of theflapper.The term A nϩB in͑10͒is the apparent nozzle area of theflapper-nozzle upon which the pressure and the nozzleflow forces act.From͑11͒,␣is the con-vergence rate of the pressure chamber normalized by the inverse of the chamber capacitance,/V¯.To verify that the linearized model in͑10͒–͑12͒indeed captures the dominant dynamics of the valve,the responses to the step current input are simulated for an input step size of iϭ20mA ͑50%full range͒using the complete nonlinear model in͓2͔and the linearized model in͑10͒–͑12͒.The step responses of the dif-ferential pressure⌬P(t)are very close͑Fig.2͒.The64%rise-time for the linearized and nonlinear models are8.1ms and8.2 ms,respectively.The similarity among the responses of the model in͑10͒–͑12͒and of the full nonlinear model in͓2͔suggests that the dynamics of the system represented by the interconnection between the pilot,pressure,and spool dynamics are well captured by the reduced order linear dynamics.Each of the pilot͑10͒,differential pressure͑11͒,and the boost spool͑12͒subsystems are ing physical parameters of the valve that are verified in͓2͔,it can be shown that the pilot sub-system has a natural frequency ofn,pϭ3037rad/s,and a damp-ing ratio ofpϭ0.91;the differential chamber pressure subsystem has an eigenvalue ofϪ␣/V¯ϭϪ1599rad/s;the boost spool sub-system has a natural frequency ofn,sϭ1861rad/s with a negli-gible damping ratio ofsϭ0.025.The eigenvalues of the com-bined system are atϪ137.2rad/s,Ϫ702Ϯ16475j rad/s,Ϫ2837Ϯ700j rad/s.We point out that the dominant pole is atϪ137.2 rad/s which is consistent with the fact that the64%rise-time of the linearized model is8.2ms.In order to improve the dynamic performance of the valve,the dominant pole must be moved fur-ther into the left half plane.III Analysis for Performance LimitationWe now proceed to analyze thefifth-order linearized model ͑10͒-͑12͒to understand why the bandwidth of the valve is rela-tively low,whereas the natural frequency of each individual sub-system is at least an order of magnitude higher.Is the limited performance due to the fact that the spools are too lightly damped (sϭ0.025)?Or,is thefluid capacitance in the pressure chamber the reason?As we shall see,neither the spool damping nor the chamber capacitance is important.The key turns out to be the structure of the interconnection between the pressure chamber,the pilot,and the spool subsystems.A Fifth-Order Root Locus.The pilot,chamber pressure, and the boost spool subsystems are connected in a closed-loop manner as shown in Fig.3with K1ϭK2ϭ1.To understand the effect of the interconnection,we apply Evan’s root locus tech-nique͓4͔to investigate how the closed-loop eigenvalues migrate as the parameters in the system are varied.Considerfirst the inner loop in Fig.3which is the interconnection between the pilot and the differential pressure subsystems.Figure4shows the loci of the closed-loop poles of the inner loop as thefictitious gain K1is varied from0→ϱ.K1ϭ1corresponds to the gain in the actual loop in the present valve design.Figure5shows the locus of the closed-loop poles of the outer loop system in Fig.3as theficti-tious gain K2is increased.The set of poles at K2ϭ1are the actual poles in the valve.As expected,when K2ϭ1,the dominant poleis Fig.2Differential pressure response to a20mA step input current:full nonlinear model and simplified linearized model. Also shown is afirst order simplified model to be discussed in SectionIII-B.Fig.3Block diagram for root locus analysis with the upper feedback loop as the inner loop.The actual valve dynamics are obtained when K1ÄK2Ä1.430ÕVol.124,SEPTEMBER2002Transactions of the ASMEat p ϭϪ137.2rad/s ͑which is the reason why the dynamic perfor-mance is limited ͒.Notice that the real parts of all the other eigen-value locations are significantly more negative.Figure 5shows that for the present valve design ͑i.e.,K 2Ϸ1͒,the pole locations are well approximated by the asymptotic behav-iors of the root locus.These are governed by the ‘‘open-loop’’pole and zero configurations.In particular,the dominant pole at p ϭϪ137.2is being attracted to the zero at 0.Two other poles are close to the zeros at the pilot’s open-loop pole locations.The remaining two poles are also close to the two Ϯ90deg asymptotic branches.Since the damping in the spools can only affect the asymptotes slightly,contrary to our initial speculation,the negli-gible damping of the spool does not contribute significantly to the relatively poor dynamic performance of the valve.Rather,the rea-son is due to the zero at the origin.This zero is present because the spool subsystem interacts with the chamber pressure dynamicsvia ⌺˙.As far as the loop gains K 1and K 2are concerned,from Fig.5,decreasing K 2delays the migration of the dominant pole to the zero at the origin.Similarly,if we had interconnected the differential pressure and the spool ͑lower loop ͒first before con-necting the pilot system in Fig.3and derived the corresponding root loci,then we would have noticed that by increasing K 1in Fig.3,the partial root locus is shown in Fig.6.Notice that the dominant pole migrates from an open loop pole near the origin toward the left half plane as K 1increases.B Reduced Order Root Locus.The root locus analysis above indicates that the four complex poles of the valve design can be approximated by their asymptotic behaviors.In addition,the complex poles originate from the poles associated with the pilot and the spool subsystems.This suggests that we may ap-proximate the behavior of the dominant eigenvalue of the valve by considering the pilot and the spool systems as quasi-static sys-tems,i.e.,by assuming that at each instant,the spools and the flapper are in static equilibria with the instantaneous differential pressure.The resulting configuration is given in Fig.7.Figure 2shows that the step response for the differential pressure dynamics matches well with the eight-state nonlinear model and the five-state linear model.Indeed,the closed-loop pole of the reduced order quasi-static system in Fig.7is p ϭϪ127.7rad/s which is very close to the actual dominant pole ͑Ϫ137.2rad/s ͒.The char-acteristic equation for the system in Fig.7is given by:1ϩV¯ͩ␣ϩ2␥A n ϩB K pͪϩ4A s22K s ϩK f sS Sϭ0.(14)The root locus for positive /V ¯͑inverse chamber capacitance,i.e.,the ratio between the fluid compressibility and the chamber vol-ume ͒is given in Fig.8which shows that the performance of the system would be limited by a zeroatFig.4Root locus diagram of the pilot Õchamber differential pressure subsystem as K 1increases from 0\ؕin Fig.3Fig.5Root locus diagram of the spool subsystem and the pilot Õchamber differential pressure subsystem as K 2increases from 0\ؕand K 1Ä1in Fig.3Fig.6Partial root locus diagram of outer loop with inner loop being the spool Õchamber system with K 2Ä1as K 1increases from 0\ؕ.Two other poles on the far left are notincluded.Fig.7Block diagram with the pilot and the spool subsystems approximated by their static systemsJournal of Dynamic Systems,Measurement,and Control SEPTEMBER 2002,Vol.124Õ431Ϫͩ␣ϩ2␥A n ϩBK p ͪ/ͩ4A s 22K s ϩK f sͪ.(15)In the current valve design,the zero of the quasi-static model is at Ϫ129.3rad/s.Since the pole ͑of the quasi-static model ͒is already at Ϫ127.7rad/s,the performance cannot be significantly improved by increasing /V ¯.Although the presence of finite pressure cham-ber dynamics is essential for the existence of the slow valve dy-namics,the values of the chamber volume,the compressibility,or capacitance ͑i.e.,V ¯/͒do not matter significantly.Rather,the per-formance limitation is determined by the feedback structure itself.The performance limitation can be alleviated if the zero in ͑15͒can be moved further to the left.Consistent with the previous analysis,this can be achieved by increasing the pilot loop gain and by decreasing the spool loop gain ͑i.e.,K 1and K 2,respectively,in Fig.3͒.IV Dynamic RedesignA Dynamic Performance.Since the dominant pole of thesystem limits the performance of the valve,it must be moved further to the left half plane to improve dynamic performance.According to the root locus analysis in Section III-A,this can be achieved if the loop gain in the upper loop is increased,and the loop gain in the lower loop is decreased.From the reduced order root locus analysis in Section III-B,performance is limited by the open-loop zero of the reduced order system.Since the dominant pole location of the valve will be close to the zero location,the zero location must be moved to the left if the dynamic perfor-mance is to improve.The expression for this blocking zero is:Ϫ␣ϩ2␥G p2A s G s,(16)where ␣and ␥are defined in ͑13͒and are associated with the convergence rate of and the flapper input gain to the pressure chamber dynamics ͑11͒;G p ªA n ϩB /K p and G s ª2A s /2K s ϩK f s are,respectively,the steady-state ratio of the flapper displacement x f to the differential pressure ⌬P ,and steady-state ratio between the total spool displacement Ϫ⌺and ⌬P .Therefore,from ͑16͒,the key design parameters in the various subsystems are:Nozzle-flapper :The apparent nozzle area A n ϩB ,which can be modified by changing the physical size of the nozzle and the gap between nozzle-flapper.␥is the sensitivity of the nozzle flow to flapper displacement which can also be modified by changing the nozzle diameter.The apparent flapper stiffness K p is affected by the mechanical stiffness,the negative magnetic stiffness,and the negative nozzle flow induced stiffness.Boost stage spools :The spool area A s ,and the centering spring stiffness K s .Pressure Chambers :␣,which is the convergence rate of the differential pressure normalized by the inverse chamber capaci-tance,/V ¯.Shifting the zero in ͑16͒to the left can be achieved by 1͒modi-fying the flapper nozzle design so as to increase ␥G p ͑increase A n ϩB ,decrease K p ,increase ␥͒;2͒modifying the boost stage spool design so as to decrease A s G s ͑decrease A s ,increase K s ͒;or 3͒by modifying the open-loop convergence rate of the pressure chamber dynamics so as to increase ␣.B Steady-State Criteria.In addition to their effects on the dynamic response of the valve,it is important also to evaluate the effects of these design parameters on the operating pressure and motion ranges,and ultimately the flow gain of the valve.We de-termine these from the ponents of the transfer functions assuming 2␥/␣is large.Differential pressure gain :⌬P ͑s ͒I ͑s ͒ͯs ϭ0ϭϪ͑2␥/␣͒G p1ϩ͑2␥/␣͒G p G A n ϩB ϷϪG A n ϩBFlapper displacement gain :x f ͑s ͒I ͑s ͒ͯs ϭ0ϭϪͩ␣2␥ͪ⌬P ͑s ͒I ͑s ͒ͯs ϭ0Ϸ␣2␥G A n ϩB Spool displacement gain :⌺͑s ͒I ͑s ͒ͯs ϭ0ϭϪG s⌬P ͑s ͒I ͑s ͒ͯs ϭ0ϷG s G A n ϩBFlow gain :Q L ͑s ͒I ͑s ͒ͯs ϭ0ϭC d w 2ͱP s ⌺͑s ͒I ͑s ͒ͯs ϭ0ϷC d w 2ͱP s GG s A n ϩBwhere G ϭץg /ץi for the torque motor,P s is the supply pressure for the boost stage.For a given input current,it is generally pref-erable that ⌬P and x f be small,and the flow Q L be large.Because the pilot supply pressure P sp is limited,large ⌬P excursion re-duces the operating range.On the other hand,large x f generally requires large magnetic air gap,which can complicate the design of the torque motor.A large flow gain is desirable so that a small input current can be used to control large flows.The consequences on these criteria when the various parameters are used to improve the dynamic performance are summarized in Fig.9.If the apparent nozzle area A n ϩB is increased,for the same input current,the differential pressure and the steady-state flapper displacement will be decreased.Unfortunately,since the flow gain has also been proportionately reduced,more force is required from the torque motor to achieve the same flow.Simi-larly,decreasing G s of the spool system will decrease the flow gain significantly.Increasing ␣will have the adverse effect of increasing flapper motion.The design parameters that do not ad-versely affect the steady state criteria significantly are the apparent flapper stiffness K p ,the spool area A s ͑while maintaining G s constant ͒and ␥of the nozzle-flapper.Of these three parameters,in fact only K p and A s can be used independently to improve dynamic performance without affecting the steady state performance.␥,which is the sensitivity of the chamber flow to flapper displacement,cannot be varied to any significant degree without affecting the apparent nozzle area A n ϩB .Indeed,even a 5%increase in ␥necessitates an increaseinFig.8Root locus of the reduced order model in Fig.7Fig.9Consequences on the static criteria when various de-sign parameters are used to improve the dynamic performance.Direction of the arrow indicates the direction of proposed change.‘‘X’’represents significant degradation,‘‘ͱ’’represents some improvement.For each column,the variables in all other columns are assumed to be constant.432ÕVol.124,SEPTEMBER 2002Transactions of the ASMEthe actual nozzle area A n by over 140%!This can potentially increase the apparent nozzle area A n ϩB which in turn decreases the steady-state flow gain.C Reducing the Spool Area A s .According to the expres-sion of the zero in ͑16͒,if spool area A s is reduced by 50%and G s is maintained constant,the bandwidth of the system should double and the flow gain should remain the same.Ignoring K f s ͑spring constant due to steady-state flow force ͒in G s ,K s is halved.Fig-ure 10͑a ͒shows that the rise time of the modified 20mA step response has been reduced from 8.2ms to 4.2ms.The quasi-static flow-current relationship in Fig.10͑b ͒,generated using a 5Hz sinusoidal current input,shows that the flow-gain of the modified valve is only slightly smaller than in the original design.The small decrease is due to the fact that G s is not exactly kept con-stant by ignoring K f s .The modified valve also shows a decreased hysteresis,which is consistent with improved dynamic response.Interestingly,the step response for the reduced A s case also shows some slight ripples.This is due to the spools’differential displacement ⌬x ªx a Ϫx b which is ignored in the linear analysis.The dynamics of ⌬x are given by ͑9͒which are stable but under-dampled.As K s is reduced to compensate for reduction in A s ,however,its effect on the flow become slightly more prominent with a larger amplitude and a lower ripple frequency.To reduce this effect,damping of the main spool is required.D Reducing the Flapper Stiffness K p .K p is the apparentflapper stiffness given by:K p ϭK ¯p Ϫ16C d f 2x f 0P ¯Ϫץgץx fͯx f ϭ0,i ϭ0.It can be reduced by reducing the mechanical stiffness K¯p or by increasing the nozzle flapper gap x f o ,or by increasing the mag-nitude of the negative stiffness due to the permanent magnet in thetorque motor.We consider reducing the mechanical stiffness K¯p →0.75K¯p so that K p is reduced to 54%of the original value.The location of the zero is expected to migrate from Ϫ129.3rad/s to Ϫ222.3rad/s.Figure 11shows that the 64%rise time has indeed been reduced from 8.2ms to 4.9ms.V DiscussionThe original design philosophy of the two spool flow control servo-valve using a pressure control pilot is that the pilot stage first establishes a differential pressure,which in turn positions the two boost stage spools according to the stiffness of thecenteringFig.10Step response …top …and current-flow relationship …bot-tom …of the valve modified by A s ]A s Õ2,K s ]K s Õ2Fig.11Step response of the valve modified by K¯p ]0.75K ¯p …K p ]0.54K p ….Note that 64%rise time has been reduced from 8.2ms to 4.9ms.Fig.12Step response of the valve modified by changing A o to 1.5A oJournal of Dynamic Systems,Measurement,and ControlSEPTEMBER 2002,Vol.124Õ433。