74LVTH16244BDGG中文资料
关于74HC244芯片的中文资料
电源电压Vcc 54 4.5 5 5.5 V
74 4.75 5 5.25
输入高电平电ViH 2 V
输入低电平电ViL 54 0.7 V
74 0.8
输出高电平电流IOH 54 -12 mA
74 -15
输出低电平电流IOL 54 12 mA
74 24
求关于74HC244线接收器(3S,两组控制)
简要说明:
244为三态输出的八组缓冲器和总线驱动器,其主要电器特性的典型值如下(不同厂家具体值有差别):
型号 tPLH tphl PD
54LS241/74LS241 12ns 12ns 110mW
引出端符号:
1A1~1A4,2A1~2A4 输入端
/1G, /2G 三态允许端(低电平有效)
1Y1~1Y4,2Y1~2Y4 输出端
逻辑图:
双列直插封装
极限值:
电源电压 …………………………………………. 7V
输入电压 …………………………………………. 5.5V
tPHZ输出由高到高阻态禁止时间 Vcc=5V CL=5pF
RL=90 Ω 18 ns
tPLZ输出由低到高阻态禁止时间 25 ns
静态特性（TA为工作环境温度范围）
参 数 测 试 条 件【1】 LS244 单位
最小 最大
VIK输入嵌位电压 Vcc=最小，Iik=-18mA -1.5 V
输出高阻态时高电平电压 …………………………. 5.5V
工作环境温度
54XXX …………………………………. -55~125℃
74XXX …………………………………. 0~70℃
SN74CBT16244DGGR,SN74CBT16244CDGGR,SN74CBT16244DGVR, 规格书,Datasheet 资料
Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-9855301QXA ACTIVE CFP WD 481TBDCall TICall TI74CBT16244DGGRE4ACTIVE TSSOP DGG 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBT16244DGGRG4ACTIVE TSSOP DGG 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBT16244DGVRE4ACTIVE TVSOP DGV 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBT16244DGVRG4ACTIVE TVSOP DGV 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16244DGGR ACTIVE TSSOP DGG 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16244DGVR ACTIVE TVSOP DGV 482000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16244DL ACTIVE SSOP DL 4825Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16244DLG4ACTIVE SSOP DL 4825Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16244DLR ACTIVE SSOP DL 481000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16244DLRG4ACTIVE SSOP DL 481000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSNJ54CBT16244WDACTIVECFPWD481TBDA42N / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.芯天下--/Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54CBT16244, SN74CBT16244 :•Catalog: SN74CBT16244•Military: SN54CBT16244NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 2芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74CBT16244DGGR TSSOP DGG 482000330.024.48.615.8 1.812.024.0Q1SN74CBT16244DGVR TVSOP DGV 482000330.016.47.110.2 1.612.016.0Q1SN74CBT16244DLRSSOPDL481000330.032.411.3516.23.116.032.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74CBT16244DGGR TSSOP DGG482000367.0367.045.0 SN74CBT16244DGVR TVSOP DGV482000367.0367.038.0SN74CBT16244DLR SSOP DL481000367.0367.055.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。
HD74LV1G14AVS中文资料
Features
• The basic gate function is lined up as hitachi uni logic series. • Supplied on emboss taping for high speed automatic mounting. • Electrical characteristics equivalent to the HD74LV14A Supply voltage range : 1.65 to 5.5 V Operating temperature range : –40 to +85°C • All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) • Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V) • All the logical input has hysteresis voltage for the slow transition.
2
HD74LV1G14A
Function Table
Input A H L H : High level L : Low level Output Y L H
Pin Arrangement
NC
1
5
VCC
IN A
2
GND
3
4
OUT Y
(Top view)
3
ቤተ መጻሕፍቲ ባይዱD74LV1G14A
Absolute Maximum Ratings
74LVTH16244TTR, 规格书,Datasheet 资料
1/13February 2004sHIGH SPEED:t PD =3.2ns (MAX.)at T A =85°C V CC =3.0V sLOW POWER DISSIPATION HIGH LEVEL OUTPUT:I CC =190µA (MAX.)at T A =85°C sOUTPUT IMPEDANCE:|I OH |=32mA,I OL =64mA (MIN at V CC =3.0V)|I OH |=8mA,I OL =24mA (MIN at V CC =2.7V)sBALANCED PROPAGATION DELAYS:t PLH ≅t PHLsPOWER DOWN PROTECTION ON INPUTS AND OUTPUTSsCOMPATIBLE WITH TTL OUTPUTS:V IH =2V (MIN),V IL =0.8V(MAX)at V CC =2.7to 3.6VsPOWER-UP/DOWN 3-STATE:I OZPU =100µA MAX at V CC =0V to 1.5V,V CC =1.5V to 0V,T A =85°Cs BUS HOLD PROVIDED ON DATA INPUTS sOPERATING VOLTAGE RANGE:V CC (OPR)=2.7V to 3.6VsPIN AND FUNCTION COMPATIBLE WITH 74SERIES H16244sLATCH-UP PERFORMANCE EXCEEDS 500mA (JESD 17)DESCRIPTIONThe 74LVTH16244is a low voltage BiCMOS 16BIT BUS BUFFER (NON-INVERTED)fabricated with sub-micron silicon gate and five-layer metal wiring BiCMOS technology.It is ideal and full specified for hot-insertion and high speed 3.3V ap-plications;the power-up/down 3-state circuitry places the outputs in the high impedance state during power-up/down,which prevents driver con-flict.This function is guaranteed when V CC is be-tween 0and 1.5V.It can be interfaced to 3.3V sig-nal environment for both inputs and outputs.Any nG output control governs four BUS BUFFERS.Output Enable input (nG)tied together gives full 16-bit operation.When nG is LOW,the outputs are on.When nG is HIGH,the output are in high impedance state effectively isolated.Bus hold on data inputs is provided in order to eliminate the need for external pull-up or pull-down resistors.All inputs and outputs are equipped with protec-tion circuits against static discharge,giving them ESD immunity and transient excess voltage.74LVTH16244LOW VOLTAGE BICMOS 16BIT BUS BUFFER WITH BUS HOLD AND POWER UP 3-STATEORDER CODESPACKAGE T &RTSSOP4874LVTH16244TTR TFBGA5474LVTH16244LBRLOGIC DIAGRAMOb s o l e t e P r o d uc t (s ) - od u c t (s ) O b s o le t e P r o d u c t (s ) - o l e t e P r o dOb s o l e t e P r o d uc t (s ) - O b s o l e t e P r od 74LVTH162442/13INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTFBGA PIN N oTSSOP PIN N oSYMBOLNAME AND FUNCTIONA3,J31,241G,4G Output Enable Inputs A6,B5,B6,C5,C6,D5,D6,E5,E6,F5,F6,G5,G6,H5,H6,J647,46,44,43,41,40,38,37,36,35,33,32,30,29,27,261A1-4,2A1-43A1-4,4A1-4Data Inputs A1,B2,B1,C2,C1,D2,D1,E2,E1,F2,F1,G2,G1,H2,H1,J12,3,5,6,8,9,11,12,13,14,16,17,19,20,22,231Y1-4,2Y1-43Y1-4,4Y1-4Data OutputsJ4,A425,483G,2G Output Enable Inputs D3,D4,E3,E4,F3,F44,10,15,21,28,34,39,45GND Ground (0V)A2,A5,B3,B4,H3,H4,J2,J5-NC No ConnectedC4,G4,C3,G342,31,7,18V CCPositive Supply VoltageO b s o l e t e P r o d u c t (s ) - O b s o lOb s o l e74LVTH162443/13PIN CONNECTION (top view for TSSOP,top through view for BGA)TRUTH TABLEZ =High Impedance;X =Don’t care,n =1..4,x =1..4INPUTSOUTPUT nG xAn xYn L L LL H H HXZOb s o l e t e P r o d uc t (s ) - O b s o l e t e P r od u c t (s ) 74LVTH162444/13ABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur.Functional operation under these conditions isnot implied(*)500mW:≅ 65°C derated to 300mW by 10mW/°C:65°C to 85°CRECOMMENDED OPERATING CONDITIONS1)V I from 0.8V to 2.0V at V CC =2.7V to 3.6VSymbol ParameterValue Unit V CC Supply Voltage -0.5to +4.6V V I DC Input Voltage-0.5to +4.6V V O DC Output Voltage (Output disabled)-0.5to +4.6V V O DC Output Voltage -0.5to V CC +0.5V I IK DC Input Diode Current −50mA I OK DC Output Diode Current −50mA I O DC Output Current low state 128mA I O DC Output Current high state 64mA I CC DC V CC or Ground Current ±100mA P d Power Dissipation (*)400mWT stgStorage Temperature-65to +150°CT LLead Temperature (10sec)300°CSymbol ParameterValue Unit V CC Supply Voltage 2.7to 3.6V V I Input Voltage (An,nG)0to 3.6VV O Output VoltageV CC VV OOutput Voltage (Output Disabled) 3.6VT op Operating Temperature -40to 85°Cdt/dV CC Minimum Power-up ramp rate200µs/V dt/dvInput Rise and Fall Time (note 1)0to 20ns/VO b s o l e t e P r o d u c t (s ) - O b s o l e t e P r o d u c t (s )Ob s o l e t e P r o d uc t (s ) - O b s o l e t e P r od u c t (s ) 74LVTH162445/13DC SPECIFICATIONS(*)Power Supply Range V CC =3.3±0.3VSymbolParameterTest ConditionValueUnitV CC (V)T A =25°C -40to 85°C Min.Typ.Max.Min.Max.V IK Input Voltage Clamp (An,nG)2.7I IK =-18mA-0.85-1.2V V IH High Level Input Voltage (An,nG)2.7 2.0 2.0V3.3(*) 2.02.0V IL Low Level Input Voltage (An,nG)2.70.80.8V3.3(*)0.80.8I IControl Input Leakage Current3.6V I =GND or V CC ±1µA Data Input Leakage Current3.6V I =GND or V CCnG =GND ±1µA I I(HOLD)Data Input Hold Current3.0V I =0.8V13575µA3.0V I =2.0V -135-753.6V I =0to 3.6V ±500µAV OHHigh Level Output Voltage2.7I O =-100µA 2.5V2.7I O =-8mA 2.43.0I O =-32mA 2.0V OLLow Level Output Voltage2.7I O =100µA0.2V2.7I O =24mA 0.53.0I O =16mA 0.43.0I O =32mA 0.53.0I O =64mA0.55I OZHigh Impedance Output Leakage Current3.6V O =0.5V or 3.0V V I =V IL or V IH nG =V CC±5µAI OZPUHigh Impedance Output Leakage Current0to 1.5V O =0.5V or 3.0V V I =GND or V CC nG =GND or V CC±100µAI OZPDHigh Impedance Output Leakage Current 1.5to 0V O =0.5V or 3.0V V I =GND or V CC nG =GND or V CC±100µAI OFFPower Off Leakage CurrentV I =GND to 3.6V V O =GND to 3.6V ±100µAI CCAQuiescent Supply Current3.6V O =High ,I O =00.19mAV O =Low,I O =05.0nG =V CC,I O =0V O =GND or V CC0.19∆I CCMaximum Quiescent Supply Current /Input (An or nG)3.3(*)V I =V CC -0.6V An,nG =V CC or GND0.2mAO b s o l e t e P r o d u c t (s ) - O b s o l e t e P r o d u c t (s )Ob s o l e t e P r o d uc t (s ) 74LVTH162446/13AC ELECTRICAL CHARACTERISTICS1)Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switching in the same direction,either HIGH or LOW (t OSLH =|t PLHm -t PLHn |,t OSHL =|t PHLm -t PHLn |2)Parameter guaranteed by designCAPACITANCE CHARACTERISTICSTEST CIRCUITC L =50pF or equivalent (includes jig and probe capacitance)R L =R 1=500Ωor equivalentR T =Z OUT of pulse generator (typically 50Ω)SymbolParameterTest ConditionValueUnitV CC =2.7V V CC =3.3± 0.3V Min.Max.Min.Typ.Max.t PLH Propagation Delay Time An to Yn T A =-40to 85°C3.7 1.2 2.5 3.2ns t PHL Propagation Delay Time An to Yn 3.7 1.2 2.5 3.2ns t PZL Output Enable Time nG to Yn 5.0 1.2 2.74.0ns t PZH Output Enable Time nG to Yn5.0 1.2 2.7 4.0ns t PLZ Output Disable Time nG to Yn 4.4 2.0 3.7 4.2ns t PHZOutput Disable Time nG to Yn 5.02.24.45.1ns t OSLHt OSHLOutput To Output Skew Time (note1,2)0.5nsSymbol ParameterTest Condition ValueUnitV CC (V)T A =25°C -40to 85°C Min.Typ.Max.Min.Max.C IControl Input Capacitance open 6pFC OOutput Capacitance3.315pFTEST SWITCH t PLH ,t PHLOpen t PZL ,t PLZ (V CC =3.0to 3.6V)6V t PZL ,t PLZ (V CC =2.7V)6V t PZH ,t PHZGNDt (s ) - O b s o l e t e P r o d u c t (s )Ob s o l e t e P r o d uc t (s74LVTH162447/13WAVEFORM SYMBOL VALUEWAVEFORM 1:PROPAGATION DELAY (f=1MHz;50%duty cycle)SymbolV CC3.0to 3.6V2.7V V IH 2.7V V CC V M 1.5V 1.5V V X V OL +0.3V V OL +0.15V V YV OH -0.3VV OH -0.15VO b s o l e t e POb s o l e t e P r o d uc t (s ) - O b s o l e74LVTH162448/13WAVEFORM 2:OUTPUT ENABLE AND DISABLE TIME (f=1MHz;50%duty cycle)O b s o l e t e P r o d u c t (s )Ob s o l e t e P r o d uc t (s ) - O b s o l e t e P r od u c t (s ) 74LVTH1624413/13Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for theconsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners © 2004 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIESAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.O b s o l e t e P r o d u c t (s ) - O b s o l e t e P r o d u c t (s )。
74HC164D中文资料 参数及应用
74HC164D中文资料参数SN54HC164,/SN74HC164是8位移位寄存器，当其中一个（或二个）选通串行输入端的低电平禁止进入新数据，并把第一个触发器在下一个时钟脉冲来后复位到低电平时，门控串行输入端（A 和B）可完全控制输入数据。
一个高电平输入后就使另一个输入端赋能，这个输入就决定了第一个触发器的状态。
虽然不管时钟处于高电平或低电平时，串行输入端的数据都可以被改变，但只有满足建立条件的信息才能被输入。
时钟控制发生在时钟输入由低电平到高电平的跃变上。
为了减小传输线效应，所有输入端均采用二极管钳位。
功能表：Inputs输入Outputs输出CLRCLK A B QA QB ...QHL X X X L L LH L X X QAQBQH0H↑H H H QAnQGnH↑L X L QAnQGnH↑X L L QAnQGnH=高电平（稳定态）L=低电平（稳定态）×=不定↑=从低电平转换到高电平QA0…QH0=在稳定态输入条件建立前QA…QH 的相应电平QAn…QHn=在最近的时钟输入条件（↑）建立前QA…QH 的相应电平，表示移位一位图1 逻辑图（正逻辑）图2 引脚图Absolute Maximum Ratings绝对最大额定值Supply voltage range, 电源电压范围VCC–0.5 V to 7V Input clamp current, 输入钳位电流IIK (VI < 0 or VI > VCC) (seeNote 1)±20 mA Output clamp current,输出钳位电流IOK (VO < 0 or VO > VCC) (seeNote 1)±20 mA Continuous output current,连续输出电流IO (VO = 0 to VCC)±25 mA Continuous current through 连续通过电流VCC or GND±50 mA封装热阻thermal impedance, θJA (see Note 2):D 封装86℃/W N 封装80℃/W NS 封装76℃/W PW 封装113℃/WStorage temperature range, Tstg储存温度范围–65℃ to 150℃DC SPECIFICATIONS直流电气规格表：符号Parameter 参数SN54HC164SN74HC164最小典型最大最小典型最大VCCSupply Voltage 电源电压256256图3 参数测量信息图4 typical clear, shift, and clear sequence典型清除、移位和清除时序应用电路：图5 LCD驱动电路图6 LED驱动电路74HC164中文资料参数时间：2016-06-15 来源：资料室作者：编号:颖展电子SN54HC164,/SN74HC164是8位移位寄存器，当其中一个（或二个）选通串行输入端的低电平禁止进入新数据，并把第一个触发器在下一个时钟脉冲来后复位到低电平时，门控串行输入端（A 和B）可完全控制输入数据。
SN74LVCH16245中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
74HC245详细中文资料
74HC245详细中文资料74HC245是一款高速CMOS器件，74HC2 45引脚兼容低功耗肖特基TTL（LSTTL）系列。
74HC245译码器可接受3位二进制加权地址输入（A0, A1和A2），并当使能时，提供8个互斥的低有效输出（Y0至Y7）。
74HC245特有3个使能输入端：两个低有效（E1和E2）和一个高有效（E3）。
除非E1和E2置低且E3置高，否则74HC138将保持所有输出为高。
利用这种复合使能特性，仅需4片7 4HC245芯片和1个反相器，即可轻松实现并行扩展，组合成为一个1-32（5线到32线）译码器。
任选一个低有效使能输入端作为数据输入，而把其余的使能输入端作为选通端，则74HC245亦可充当一个8输出多路分配器，未使用的使能输入端必须保持绑定在各自合适的高有效或低有效状态。
74HC245与74HC 238逻辑功能一致，只不过74HC138为反相输出。
功能CD74HC245 ，CD74HC238和CD74HCT245， CD74HCT238是高速硅栅CMO S解码器，适合内存地址解码或数据路由应用。
74HC245作用原理于高性能的存贮译码或要求传输延迟时间短的数据传输系统,在高性能存贮器系统中,用这种译码器可以提高译码系统的效率。
将快速赋能电路用于高速存贮器时,译码器的延迟时间和存贮器的赋能时间通常小于存贮器的典型存取时间,这就是说由肖特基钳位的系统译码器所引起的有效系统延迟可以忽略不计。
HC138 按照三位二进制输入码和赋能输入条件,从8 个输出端中译出一个低电平输出。
两个低电平有效的赋能输入端和一个高电平有效的赋能输入端减少了扩展所需要的外接门或倒相器,扩展成24 线译码器不需外接门;扩展成32 线译码器,只需要接一个外接倒相器。
在解调器应用中,赋能输入端可用作数据输入端。
特性复合使能输入，轻松实现扩展兼容JEDEC标准no.7A 存储器芯片译码选择的理想选择低有效互斥输出 ESD保护 HBM EIA/JESD22-A114-C超过2000 V MM EIA/JESD22-A115-A超过200 V 温度范围 -40～+85 ℃ -40～+125 ℃多路分配功能74HC245是一款高速CMOS器件，74HC245引脚兼容低功耗肖特基T TL（LSTTL）系列。
74LV241DB中文资料
元器件交易网DIP20:plastic dual in-line package; 20 leads (300 mil)SOT146-1SO20:plastic small outline package; 20 leads; body width 7.5 mm SOT163-1SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1TSSOP20:plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.This data sheet contains preliminary data, and supplementary data will be published at a later date. PhilipsSemiconductors reserves the right to make changes at any time without notice in order to improve designand supply the best possible product.Philips Semiconductors811 East Arques AvenueP .O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381DEFINITIONSData Sheet IdentificationProduct Status Definition Objective Specification Preliminary Specification Product Specification Formative or in Design Preproduction Product Full ProductionThis data sheet contains the design target or goal specifications for product development. Specificationsmay change in any manner without notice.This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changesat any time without notice, in order to improve design and supply the best possible product.© Copyright Philips Electronics North America Corporation 1998All rights reserved. Printed in U.S.A.print codeDate of release: 05-96。
HD74ALVC162834T资料
HD74ALVC16283418-bit Universal Bus Driver with 3-state Outputsand Inverted Latch EnableADE-205-217D (Z)5th. EditionDecember 1999 DescriptionThe HD74ALVC162834 is an 18-bit universal bus driver designed for 2.3 V to 3.6 V Voperation.CCData flow from A to Y is controlled by the output enable (OE). The device operates in the transparent mode when the latch enable (LE) is low. When LE is low, the A data is latched if the clock (CLK) input is held at a high or low logic level. If the LE is high, the A data is stored in the latch/flip flop on the low to high transition of CLK. When OE is high, the outputs are in the high impedance state.To ensure the high impedance state during power up or power down, OE should be tied to Vthrough aCCpullup registor; the minimum value of the registor is determined by the current sinking capability of the driver.All outputs, which are designed to sink up to 12 mA, include 26 Ω resistors to reduce overshoot and undershoot.Features• Meets “PC SDRAM registered DIMM design support document, Rev. 1.2”• V CC = 2.3 V to 3.6 V• Typical V OL ground bounce < 0.8 V (@V CC = 3.3 V, Ta = 25°C)• Typical V OH undershoot > 2.0 V (@V CC = 3.3 V, Ta = 25°C)• High output current ±12 mA (@V CC = 3.0 V)• All outputs have equivalent 26 Ω series resistors, so no external resistors are requiredHD74ALVC1628342Function TableInputs OE LE CLK A Output Y H X X X Z L L X L L L L X H H L H ↑L L L H ↑H H L HL or HXY 0 *1H :High level L :Low level X :ImmaterialZ :High impedance↑ :Low to high transitionNote:1.Output level before the indicated steady-state input conditions were established.HD74ALVC162834 Pin Arrangement3HD74ALVC1628344Absolute Maximum RatingsItemSymbol Ratings Unit ConditionsSupply voltage range V CC –0.5 to 4.6V Input voltage range *1V I –0.5 to 4.6V Output voltage range *1, 2V O –0.5 to V CC +0.5V Input clamp current I IK –50mA V I < 0Output clamp current I OK ±50mA V O < 0 or V O > V CC Continuous output current I O±50mA V O = 0 to V CC V CC , GND current / pin I CC or I GND ±100mA Maximum power dissipation at Ta = 55°C (in still air) *3P T 1W TSSOP Storage temperature rangeTstg–65 to 150°CStresses beyond those listed under “absolute maximum ratings” may cause permanent damage to thedevice. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating condition” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.Notes: 1.The input and output negative-voltage ratings may be exceeded if the input and output clampcurrent ratings are observed.2.The input and output positive-voltage ratings may be exceeded up to 4.6 V if the input and outputclamp-current ratings are observed.3.The maximum power dissipation is calculated using a junction temperature of 150°C and boardtrace length of 750 mils.Recommended Operating ConditionsItemSymbol Min Max Unit ConditionsSupply voltage V CC 2.3 3.6V Input voltage V I 0V CC V Output voltageV O 0V CC V High-level output currentI OH—–6mAV CC = 2.3 V —–8V CC = 2.7 V —–12V CC = 3.0 V Low-level output currentI OL—6mA V CC = 2.3 V —8V CC = 2.7 V —12V CC = 3.0 V Input transition rise or fall rate ∆t/∆v 010ns/V Operating free-air temperatureTa–4085°C Note: Unused or floating control pins must be held high or low.HD74ALVC162834 Logic Diagram5HD74ALVC1628346Electrical CharacteristicsTa = –40 to 85°CItem Symbol V CC (V)Min Max Unit Test Conditions Input voltageV IH 2.3 to 2.7 1.7—V2.7 to3.6 2.0—V IL2.3 to 2.7—0.7V2.7 to3.6—0.8Output voltageV OH2.3 to3.6V CC –0.2—VI OH = –100 µA2.3 1.9—I OH = –4 mA, V IH = 1.7 V 2.3 1.7—I OH = –6 mA, V IH = 1.7 V3.0 2.4—I OH = –6 mA, V IH = 2.0 V 2.7 2.0—I OH = –8 mA, V IH = 2.0 V 3.02.0—I OH = –12 mA, V IH = 2.0 V V OL2.3 to3.6—0.2V I OL = 100 µA2.3—0.4I OL = 4 mA, V IL = 0.7 V 2.3—0.55I OL = 6 mA, V IL = 0.7 V3.0—0.55I OL = 6 mA, V IL = 0.8 V 2.7—0.6I OL = 8 mA, V IL = 0.8 V 3.0—0.8I OL = 12 mA, V IL = 0.8 V Input currentI IN 3.6—±5.0µA V IN = V CC or GND Off state output currentI OZ 3.6—±10µA V OUT = V CC or GND Quiescent supply current I CC3.6—40µA V IN = V CC or GND∆I CC3.0 to 3.6—750µA One input at (V CC –0.6)V,other inputs at V CC or GNDHD74ALVC1628347Switching Characteristics (Ta = –40 to 85°C)ItemSymbol V CC (V)Min Typ Max Unit From (Input)To (Output)Maximum clock f max2.5±0.2150——MHzfrequency2.7150——3.3±0.3150——Propagation delay timet PLH 2.5±0.2 1.0— 5.0nsAYt PHL2.7—— 5.03.3±0.3 1.0—4.22.5±0.2 1.4— 6.0LEY2.7—— 6.13.3±0.3 1.4— 5.42.5±0.2 1.4— 6.3CLKY2.7—— 6.13.3±0.31.4— 5.4Output enable timet ZH 2.5±0.2 1.4— 6.3nsOEYt ZL2.7—— 6.53.3±0.3 1.1— 5.5Output disable timet HZ 2.5±0.2 1.0— 4.4nsOEYt LZ2.7—— 4.93.3±0.3 1.3—4.5Input capacitance C IN 3.3 3.0 4.57.0pFControl inputs 3.3 3.0 6.09.0Data inputs Output capacitanceC O3.33.07.09.0pF Y portsHD74ALVC1628348Switching Characteristics (Ta = –40 to 85°C) (cont)Item Symbol V CC (V)Min Typ Max Unit From (Input)Setup timet su2.5±0.2 2.1——nsData before CLK ↑2.7 2.1——3.3±0.3 1.7——2.5±0.2 1.2——Data before LE ↑2.7 1.6——CLK “H”3.3±0.3 1.3——2.5±0.2 1.4——Data before LE ↑2.7 1.5——CLK “L”3.3±0.31.2——Hold timet h2.5±0.20.6——nsData after CLK ↑2.70.6——3.3±0.30.7——2.5±0.20.8——Data after LE ↑2.7 1.1——CLK “H” or “L”3.3±0.31.1——Pulse widtht w2.5±0.23.3——nsLE “L”2.7 3.3——3.3±0.3 3.3——2.5±0.2 3.3——CLK “H” or “L”2.73.3——3.3±0.33.3——Switching Characteristics (Ta = 0 to 85°C)Item Symbol V CC (V)Min Typ Max Unit FROM (Input)TO(Output)Propagation C L =0pF *1t PLH , t PHL 3.3±0.1650.9— 2.0nsA Y delay timeC L =50pF 3.3±0.165 1.0— 4.5C L =0pF *1 3.3±0.165 1.4— 2.9CLK Y C L =50pF 3.3±0.165 1.9— 4.5C L =50pFt SSO *1, 2 3.3±0.165 1.9— 4.8CLK, AY Output rise /fall timeC L =50pFt TLH , t THL*13.3±0.165 1.0—2.5volts/nsYNotes: 1.This parameter is characterized but not tested.2.t SSO : Simultaneous switching output time.HD74ALVC1628349Operating Characteristics (Ta = 25°C)ItemSymbolV CC = 2.5±0.2 V V CC = 3.3±0.3 V Unit Test ConditionsTypTyp Power dissipation Outputs enable C pd 22.024.5pFC L = 0, f = 10 MHz capacitanceOutputs disable5.06.0Test CircuitHD74ALVC162834 Waveforms – 1Waveforms – 210Waveforms – 3IV Characteristics for Register Output (Measured value)Package DimensionsUnit : mmCautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/index.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。
中文芯片手册SN54LVTH16244
SN54LVTH16244A, SN74LVTH16244A3.3-V ABT 16-BIT BUFFERS/DRIVERSWITH 3-STATE OUTPUTS特征•德州仪器成员Widebus™系列•先进设备，在最先进的先进的BiCMOS技术（ABT）设计为3.3-V操作和低静态功耗•支持混合模式信号操作（5-V输入和输出电压3.3-V VCC）•支持非稳压电池工作电压可低至2.7 V•典型VOLP（输出地弹跳）<0.8 V在VCC = 3.3 V，TA = 25°C•的Ioff和上电三态支持热插入•在数据输入总线保持消除了需要外部上拉/下拉电阻•闭锁性能每JESD17超过500 mA•ESD保护超过JESD22- 2000-V人体模型（A114-A）- 200-V机型号（A115-A）描述/订购信息在‘LVTH16244A设备是16位缓冲器和专为低电压（3.3 V ）的VCC操作线路驱动器，且有能力提供一个TTL接口，一个5-V系统环境。
这些设备可被用作四个4位缓冲器，两个8位缓冲器，或一个16位缓冲器。
这些器件提供了真正的输出和对称低电平有效输出使能（OE）投入。
有源总线保持电路持有未使用或无驱动输入一个有效的逻辑状态。
不推荐使用上拉或下拉电阻与总线保持电路。
当VCC之间0和1.5 V ，在开机或关机时候，该设备是在高阻抗状态。
而且为了确保上述1.5 V高阻抗状态，OE应通过上拉电阻连接到VCC;电阻器的最低值是由驱动器的电流吸收能力来确定。
这些设备使用的Ioff和上电三态热插入应用程序完全指定。
该的Ioff电路禁止输出，防止损坏电流回流通过设备时，他们断电。
上电三态电路使输出在高阻抗状态在上电和断电，防止驱动器冲突。
74FCT16245资料
DC Output Current (Maximum Sink Current/Pin) ........................–60 to +120 mA
The CY74FCT162H245T is a 24-mA balanced output part that has bus hold on the data inputs. The device retains the input’s last state whenever the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs.
Operating Range
Range
Ambient Temperature
Industrial
–40°C to +85°C
VCC 5V ± 10%
Notes:
1. On CY74FCT162H245T these pins have bus hold. 2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance. 3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
IDT74FCT16240ATPFB中文资料
The FCT16240T/AT/CT/ET and FCT162240T/AT/CT/ET16-bit buffer/line drivers are built using advanced dual metalCMOS technology. These high-speed, low-power devicesoffer bus/backplane interface capability with improved packingdensity. The flow-through organization of signal pins simplifieslayout. The three-state controls are designed to operate thesedevices in a Quad-Nibble, Dual-Byte or single 16-bit wordmode. All inputs are designed with hysteresis for improvednoise margin.The FCT16240T/AT/CT/ET are ideally suited for drivinghigh capacitance loads and low-impedance backplanes. Theoutput buffers are designed with power off disable capabilityto allow "live insertion" of boards when used as backplanedrivers.The FCT162240T/AT/CT/ET have balanced output drivewith current limiting resistors. This offers low ground bounce,minimal undershoot, and controlled output fall times– reduc-ing the need for external series terminating resistors. TheFCT162240T/AT/CT/ET are plug-in replacements forFCT16240T/AT/CT/ET and 54/74ABT16240 for on-board in-terface applications.The IDT logo is a registered trademark of Integrated Device Technology, Inc.FUNCTIONAL BLOCK DIAGRAM1OE1A11A21A31A41Y11Y21Y3142OE2A12A22A32A42Y1222Y3242541 drw 013OE3A13A23A33A43Y13Y233344OE4A14A24A34A44Y14243442541 drw 02•Common features:–0.5 MICRON CMOS Technology–High-speed, low-power CMOS replacement forABT functions–Typical t SK(o) (Output Skew) < 250ps–Low input and output leakage ≤1µA (max.)–ESD > 2000V per MIL-STD-883, Method 3015;> 200V using machine model (C = 200pF, R = 0)–Packages include 25 mil pitch SSOP, 19.6 mil pitchTSSOP, 15.7 mil pitch TVSOP and 25 mil pitch Cerpack–Extended commercial range of -40°C to +85°C–V CC = 5V ±10%•Features for FCT16240T/AT/CT/ET:–High drive outputs (-32mA I OH, 64mA I OL)–Power off disable outputs permit “live insertion”–Typical V OLP (Output Ground Bounce) < 1.0V atV CC = 5V, T A = 25°C•Features for FCT162240T/AT/CT/ET:–Balanced Output Drivers:±24mA (commercial),±16mA (military)–Reduced system switching noise–Typical V OLP (Output Ground Bounce) < 0.6V atV CC = 5V,T A = 25°CMILITARY AND COMMERCIAL TEMPERATURE RANGES AUGUST 1996PIN CONFIGURATIONS2541 drw 031A 11A 2GND1A 31A 4V CC2A 12A 22A 32A 43A 13A 23A 33A 4V CC4A 14A 34A 44A 2GNDGNDGND23SSOP/TSSOP/TVSOP TOP VIEWGND1GNDV CCGND44Y 44Y 342413Y 43332312Y 422211Y 4131Y 11Y 2V CCGND231A 11A 2GND1A 31A 4V CC2A 12A 22A 32A 43A 13A 23A 33A 4V CC4A 14A 34A 44A 2GNDGNDGND232541drw 04CERPACK TOP VIEWGND1OE GNDV CCGND4OE4Y 44Y 34Y 241343Y 33Y 23Y 12Y 422211Y 41Y 3111Y 2V CCGND23ABSOLUTE MAXIMUM RATINGS (1)(1)PIN DESCRIPTION1.H = HIGH Voltage Level X = Don’t CareL = LOW Voltage Level Z = High Impedance1. This parameter is measured at characterization but not tested.NOTES:1.Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGSmay cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.2.All device terminals except FCT162XXXT Output and I/O terminals.3.Output and I/O terminals for FCT162XXXT.2541 lnk 03DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGEFollowing Conditions Apply Unless Otherwise Specified:A CC A CCOUTPUT DRIVE CHARACTERISTICS FOR FCT16240T2541 lnk 06 OUTPUT DRIVE CHARACTERISTICS FOR FCT162240TNOTES:1.For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.2.Typical values are at Vcc = 5.0V, +25°C ambient.3.Not more than one output should be tested at one time. Duration of the test should not exceed one second.4.Duration of the condition can not exceed one second.5.The test limit for this parameter is ± 5µA at T A = –55°C.1.For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.2.Typical values are at V CC = 5.0V, +25°C ambient.3.Per TTL driven input (V IN = 3.4V). All other inputs at V CC or GND.4.This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.5.Values for these conditions are examples of the I CC formula. These limits are guaranteed but not tested.6.I C = I QUIESCENT + I INPUTS + I DYNAMICI C = I CC + ∆I CC D H N T + I CCD (f CP N CP/2 + f i N i)I CC = Quiescent Current (I CCL, I CCH and I CCZ)∆I CC = Power Supply Current for a TTL High Input (V IN = 3.4V)D H = Duty Cycle for TTL Inputs HighN T = Number of TTL Inputs at D HI CCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL)f CP = Clock Frequency for Register Devices (Zero for Non-Register Devices)N CP = Number of Clock Inputs at f CPf i = Input FrequencyN i = Number of Inputs at f iSWITCHING CHARACTERISTICS OVER OPERATING RANGE1.See test circuit and waveforms.2.Minimum limits are guaranteed but not tested on Propagation Delays.3.Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.7.0V3V 1.5V 0V3V 1.5V 0V 3V 1.5V 0V 3V 1.5V 0V DATA INPUTPRESET CLEAR ETC.1.5V1.5VSAME PHASE 3V 1.5V 0V 1.5V V OH OUTPUT3V 1.5V 0VV OL 3V 1.5V 0V 3.5V0VV OLENABLEDISABLEV OH PRESET CLEARCLOCK ENABLEETC.C L =Load capacitance: includes jig and probe capacitance.R T =Termination resistance: should be equal to Z OUT of the PulseGenerator.ENABLE AND DISABLE TIMESPROPAGATION DELAYSET-UP, HOLD AND RELEASE TIMES PULSE WIDTHSWITCH POSITIONTEST CIRCUITS AND WAVEFORMS TEST CIRCUITS FOR ALL OUTPUTSNOTES:1.Diagram shown for input Control Enable-LOW and input Control Disable-HIGH2.Pulse Generator for All Pulses: Rate ≤ 1.0MHz; t F ≤ 2.5ns; t R ≤ 2.5ns2541 drw 092541 drw 072541 drw 052541 drw 062541 drw 08ORDERING INFORMATIONIDT XX XXXXDevice TypeX XBlankBPVPAPFE16240T 16240AT 16240CT 16240ET 162240T 162240AT 162240CT 162240ET CommercialMIL-STD-883, Class BShrink Small Outline Package (SO48-1) Thin Shrink Small Outline Package (SO48-2) Thin Very Small Outline Package (SO48-3) CERPACK (E48-1)Inverting 16-Bit Buffer/Line Driver54 74–55°C to +125°C –40°C to +85°CFCT2541 drw 10。
74LVTH16245中文资料
The LVT16245 and LVTH16245 contain sixteen non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus oriented applications. The device is byte controlled. Each byte has separate control inputs which can be shorted together for full 16-bit operation. The T/R inputs determine the direction of data flow through the device. The OE inputs disable both the A and B ports by placing them in a high impedance state. The LVTH16245 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These non-inverting transceivers are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT16245 and LVTH16245 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation.
74LVT16245B中文资料
元器件交易网SSOP48:plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1TSSOP48:plastic thin shrink small outline package; 48 leads; body width 6.1mm SOT362-1DefinitionsShort-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.DisclaimersLife support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.Philips Semiconductors811 East Arques AvenueP.O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381© Copyright Philips Electronics North America Corporation 1998All rights reserved. Printed in U.S.A.print code Date of release: 05-96。
HD74LVC16240AT资料
HD74LVC16240A16-bit Buffers / Line Drivers with 3-state OutputsADE-205-118B(Z)3rd EditionDecember 1996 DescriptionThe HD74LVC16240A has sixteen inverter drivers with three state outputs in a 48 pin package. This device is a inverting buffer and has two active low enables (1G to 4G). Each enable independently controls four buffers. Low voltage and high speed operation is suitable at the battery drive product (note type personal computer) and low power consumption extends the life of a battery for long time operation. Features•V CC = 2.0 V to 5.5 V•All inputs V IH (Max.) = 5.5 V (@V CC = 0 V to 5.5 V)•All outputs V OUT (Max.) = 5.5 V (@V CC = 0 V or output off state)•Typical V OL ground bounce < 0.8 V (@V CC = 3.3 V, Ta = 25°C)•Typical V OH undershoot > 2.0 V (@V CC = 3.3 V, Ta = 25°C)•High output current ±24 mA (@V CC = 3.0 V to 5.5 V)Function TableInputsOutput YH X ZL H LL L HH:High levelL:Low levelX:ImmaterialZ:High impedanceHD74LVC16240A Pin ArrangementRev.3, Dec. 1996, page 2 of 9HD74LVC16240ARev.3, Dec. 1996, page 3 of 9Absolute Maximum RatingsItemSymbol Ratings Unit ConditionsSupply voltage V CC –0.5 to 6.0V Input diode current I IK –50mA V I = –0.5 V Input voltage V I –0.5 to 6.0V Output diode current I OK –50mA V O = –0.5 V 50mA V O = V CC +0.5 V Output voltage V O –0.5 to V CC +0.5V Output “H” or “L”–0.5 to 6.0V Output “Z” or V CC :OFF Output current I O±50mA V CC , GND current / pin I CC or I GND 100mA Storage temperatureTstg–65 to +150°CNote:The absolute maximum ratings are values which must not individually be exceeded, and furthermore,no two of which may be realized at the same time.Recommended Operating ConditionsItemSymbol Rating Unit Conditions Supply voltage V CC 1.5 to 5.5V Data hold 2.0 to 5.5V At operation Input / output voltageV I 0 to 5.5V G , AV O0 to V CC V Output "H" or "L"0 to 5.5V Output "Z" or V CC :OFFOperating temperature Ta –40 to 85°C Output currentI OH –12mA V CC = 2.7 V –24*2mA V CC = 3.0 V to 5.5 V I OL12mA V CC = 2.7 V 24*2mA V CC = 3.0 V to 5.5 V Input rise / fall time *1t r , t f10ns/VNotes: 1.This item guarantees maximum limit when one input switches.Waveform : Refer to test circuit of switching characteristics.2.duty cycle ≤ 50%HD74LVC16240ARev.3, Dec. 1996, page 4 of 9Electrical CharacteristicsTa = –40 to 85°CItem Symbol V CC (V)Min Max Unit Test ConditionsInput voltageV IH 2.7 to 3.6 2.0—V 4.5 to 5.5V CC ×0.7—V V IL2.7 to3.6—0.8V4.5 to5.5—V CC ×0.3V Output voltageV OH2.7 to 5.5V CC –0.2—V I OH = –100 µA 2.7 2.2—V I OH = –12 mA 3.0 2.4—V 3.0 2.2—V I OH = –24 mA 4.53.8—V V OL2.7 to 5.5—0.2V I OL = 100 µA 2.7—0.4V I OL = 12 mA3.0—0.55V I OL = 24 mA4.5—0.55V Input currentI IN 0 to 5.5—±5.0µA V IN = 5.5 V or GND Off state output current I OZ 2.7 to 5.5—±5.0µA V IN = V CC , GNDV OUT = 5.5 V or GND Output leak current I OFF 0—20µA V IN / V OUT = 5.5 V Quiescent supply currentI CC 2.7 to 3.6—±20µA V IN / V OUT = 3.6 to 5.5 V 2.7 to 5.5—20µA V IN = V CC or GND∆I CC3.0 to 3.6—500µAV IN = one input at(V CC –0.6)V, other inputs at V CC or GNDHD74LVC16240ARev.3, Dec. 1996, page 5 of 9Switching CharacteristicsTa = –40 to 85°CItemSymbol V CC (V)Min Typ Max Unit From (Input)To (Output)Propagation delay timet PLH 2.7—— 6.2ns AYt PHL3.3±0.3 1.5— 5.5ns 5.0±0.5——4.5ns Output enable timet ZH 2.7——7.7ns GYt ZL3.3±0.3 1.5—7.0ns 5.0±0.5—— 6.0ns Output disable timet HZ 2.7——7.7ns GYt LZ3.3±0.3 1.5—7.0ns 5.0±0.5—— 6.0ns Between output pins skew *1t OSLH 2.7———ns t OSHL3.3±0.3—— 1.0ns 5.0±0.5—— 1.0ns Input capacitance C IN 2.7— 3.0—pF Output capacitance C O2.7—15.0—pFNote:1.This parameter is characterized but not tested.tos LH = | t PLHm – t PLHn |, tos HL = | t PHLm – t PHLn |HD74LVC16240A Test CircuitWaveforms – 1Rev.3, Dec. 1996, page 6 of 9HD74LVC16240A Waveforms – 2Rev.3, Dec. 1996, page 7 of 9HD74LVC16240A Package DimensionsRev.3, Dec. 1996, page 8 of 9HD74LVC16240ARev.3, Dec. 1996, page 9 of 9Disclaimer1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Sales OfficesHitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.Hitachi Asia Ltd. Hitachi Tower16 Collyer Quay #20-00, Singapore 049318Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877URL : .sg URLNorthAmerica : /Europe : /hel/ecg Asia : Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.(Taipei Branch Office)4/F, No. 167, Tun Hwa North Road, Hung-Kuo Building, Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TPURL : Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components) 7/F., North Tower, World Finance Centre,Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong KongTel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281URL : Hitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 585160Hitachi Europe GmbHElectronic Components Group Dornacher Stra ße 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:Colophon 2.0。
74LVT16244中文资料
32
64
40
0
85
10
qC
ns/V
't/'V
Note 3: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied. Note 4: IO Absolute Maximum Rating must be observed.
DC Electrical Characteristics
Symbol VIK VIH VIL VOH Parameter Input Clamp Diode Voltage Input HIGH Voltage Input LOW Voltage Output HIGH Voltage VCC (V) 2.7 2.7–3.6 2.7–3.6 2.7–3.6 2.7 3.0 VOL Output LOW Voltage 2.7 2.7 3.0 3.0 3.0 II(HOLD) (Note 5) II(OD) (Note 5) II Bushold Input Over-Drive Current to Change State Input Current Control Pins Data Pins IOFF IPU/PD IOZL IOZH IOZH Power Off Leakage Current Power Up/Down 3-STATE Current 3-STATE Output Leakage Current 3-STATE Output Leakage Current 3-STATE Output Leakage Current Bushold Input Minimum Drive 3.0 3.0 3.6 3.6 3.6 0 0 – 1.5V 3.6 3.6 3.6 75 VCC 0.2 2.4 2.0 0.2 0.5 0.4 0.5 0.55 V V 2.0 0.8 TA
MC74LCX16245DTG资料
MC74LCX16245Low−Voltage CMOS16−Bit TransceiverWith 5 V−Tolerant Inputs and Outputs(3−State, Non−Inverting)The MC74LCX16245 is a high performance, non−inverting 16−bittransceiver operating from a 2.3 to 3.6 V supply. The device is byte controlled. Each byte has separate Output Enable inputs which can be tied together for full 16−bit operation. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A V I specification of 5.5 V allows MC74LCX16245 inputs to be safely driven from 5.0 V devices. The MC74LCX16245 is suitable for memory address driving and all TTL level bus oriented transceiver applications.The 4.5 ns maximum propagation delays support high performance applications. Current drive capability is 24 mA at both A and B ports. The Transmit/Receive (T/Rn) inputs determine the direction of data flow through the bidirectional transceiver. Transmit (active−HIGH) enables data from A ports to B ports; Receive (active−LOW) enables data from B to A ports. The Output Enable inputs (OEn), when HIGH, disable both A and B ports by placing them in a HIGH Z condition. Features•Designed for 2.3 to 3.6 V V CC Operation•4.5 ns Maximum t pd•5.0 V Tolerant − Interface Capability With 5.0 V TTL Logic •Supports Live Insertion and Withdrawal•I OFF Specification Guarantees High Impedance When V CC = 0 V •LVTTL Compatible•LVCMOS Compatible•24 mA Balanced Output Sink and Source Capability•Near Zero Static Supply Current in All Three Logic States (20 m A) Substantially Reduces System Power Requirements •Latchup Performance Exceeds 500 mA•ESD Performance:Human Body Model >2000 V;Machine Model >200 V•These are Pb−Free Devices**For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.ORDERING INFORMATIONFigure 1. Pinout: 48−Lead (Top View)481OE1T/R1472A0B0463A1B1454GND GND 445A2B2436A3B3427V CC V CC 418A4B4409A5B53910GND GND 3811A6B63712A7B73613A8B83514A9B93415GND GND 3316A10B103217A11B113118V CC V CC 3019A12B122920A13B132821GND GND 2722A14B142623A15B152524OE2T/R2Table 1. PIN NAMESPinsFunctionOEn T/Rn A0 − A15B0 − B15Output Enable Inputs Transmit/Receive InputsSide A Inputs or 3−State Outputs Side B Inputs or 3−State OutputsT/R1Figure 2. Logic DiagramTRUTH TABLEInputs OutputsInputsOutputsOE1T/R1OE2T/R2L L Bus B0:7 Data to Bus A0:7L L Bus B8:15 Data to Bus A8:15L H Bus A0:7 Data to Bus B0:7L H Bus A8:15 Data to Bus B8:15H XHigh Z State on A0:7, B0:7HXHigh Z State on A8:15, B8:15H =High Voltage Level L =Low Voltage Level Z =High Impedance StateX=High or Low Voltage Level and Transitions Are Acceptable; for I CC reasons, DO NOT FLOAT InputsORDERING INFORMATIONDevice Package Shipping†MC74LCX16245DT TSSOP−48*39 Units / RailMC74LCX16245DTG TSSOP−48*39 Units / RailMC74LCX16245DTR2TSSOP−48*2500 / Tape & ReelM74LCX16245DTR2G TSSOP−48*2500 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.*This package is inherently Pb−Free.MAXIMUM RATINGSSymbol Parameter Value Condition Unit V CC DC Supply Voltage−0.5 to +7.0V V I DC Input Voltage−0.5 ≤ V I≤ +7.0V V O DC Output Voltage−0.5 ≤ V O≤ +7.0Output in 3−State V−0.5 ≤ V O≤ V CC + 0.5Output in HIGH or LOW State. (Note 1)VI IK DC Input Diode Current−50V I < GND mAI OK DC Output Diode Current−50V O < GND mA+50V O > V CC mAI O DC Output Source/Sink Current±50mAI CC DC Supply Current Per Supply Pin±100mAI GND DC Ground Current Per Ground Pin±100mAT STG Storage Temperature Range−65 to +150°C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.1.I O absolute maximum rating must be observed.RECOMMENDED OPERATING CONDITIONSSymbol Parameter Min Typ Max UnitV CC Supply Voltage OperatingData Retention Only 2.01.52.5,3.32.5,3.33.63.6VV I Input Voltage0 5.5VV O Output Voltage(HIGH or LOW State)(3−State)0V CC5.5VI OH HIGH Level Output Current V CC = 3.0 V − 3.6 VV CC = 2.7 V − 3.0 VV CC = 2.3 V − 2.7 V − 24− 12− 8mAI OL LOW Level Output Current V CC = 3.0 V − 3.6 VV CC = 2.7 V − 3.0 VV CC = 2.3 V − 2.7 V + 24+ 12+ 8mAT A Operating Free−Air Temperature−40+85°C D t/D V Input Transition Rise or Fall Rate, V IN from 0.8 V to 2.0 V, V CC = 3.0 V010ns/VDC ELECTRICAL CHARACTERISTICSSymbol Characteristic Condition T A = −40°C to +85°CUnit Min MaxV IH HIGH Level Input Voltage (Note 2) 2.3 V ≤ V CC≤ 2.7 V 1.7V2.7 V ≤ V CC≤3.6 V 2.0V IL LOW Level Input Voltage (Note 2) 2.3 V ≤ V CC≤ 2.7 V0.7V2.7 V ≤ V CC≤3.6 V0.8V OH HIGH Level Output Voltage 2.3 V ≤ V CC≤ 3.6 V; I OL = 100 m A V CC−0.2VV CC = 2.3 V; I OH = −8 mA 1.8V CC = 2.7 V; I OH = −12 mA 2.2V CC = 3.0 V; I OH = −18 mA 2.4V CC = 3.0 V; I OH = −24 mA 2.2 V OL LOW Level Output Voltage 2.3 V ≤ V CC≤ 3.6 V; I OL = 100 m A0.2VV CC = 2.3 V; I OL= 8 mA0.6V CC = 2.7 V; I OL= 12 mA0.4V CC = 3.0 V; I OL = 16 mA0.4V CC = 3.0 V; I OL = 24 mA0.55I I Input Leakage Current 2.3 V ≤ V CC≤ 3.6 V; 0 V ≤ V I≤ 5.5 V±5.0m AI OZ3−State Output Current 2.3 ≤ V CC≤ 3.6 V; 0V ≤ V O≤ 5.5 V;V I = V IH or V IL±5.0m AI OFF Power−Off Leakage Current V CC = 0 V; V I or V O = 5.5 V10m AI CC Quiescent Supply Current 2.3 ≤ V CC≤ 3.6 V; V I = GND or V CC20m A2.3 ≤ V CC≤3.6 V; 3.6 ≤ V I or V O≤ 5.5 V±20m AD I CC Increase in I CC per Input 2.3 ≤ V CC≤ 3.6 V; V IH = V CC − 0.6 V500m A2.These values of V I are used to test DC electrical characteristics only.AC CHARACTERISTICS t R = t F = 2.5 ns; R L = 500 WSymbol Parameter WaveformT A = −40°C to +85°CUnit V CC = 3.3 V ± 0.3 VC L = 50 pFV CC = 2.7 VC L = 50 pFV CC = 2.5 V ± 0.2 VC L = 30 pFMin Max Min Max Min Maxt PLH t PHL Propagation DelayInput to Output1 1.51.54.54.51.51.55.25.21.51.55.45.4nst PZH t PZL Output Enable Time toHigh and Low Level2 1.51.56.56.51.51.57.27.21.51.58.58.5nst PHZ t PLZ Output Disable Time FromHigh and Low Level2 1.51.56.46.41.51.56.96.91.51.57.77.7nst OSHL t OSLH Output−to−Output Skew(Note 3)1.01.0ns3.Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t OSHL) or LOW−to−HIGH (t OSLH); parameter guaranteed by design.DYNAMIC SWITCHING CHARACTERISTICSSymbol Characteristic ConditionT A = +25°CUnit Min Typ MaxV OLP Dynamic LOW Peak Voltage(Note 4)V CC = 3.3 V, C L = 50 pF, V IH = 3.3 V, V IL = 0 VV CC = 2.5 V, C L = 30 pF, V IH = 2.5 V, V IL = 0 V0.80.6VVV OLV Dynamic LOW Valley Voltage (Note 4)V CC = 3.3 V, C L = 50 pF, V IH = 3.3 V, V IL = 0 VV CC = 2.5 V, C L = 30 pF, V IH = 2.5 V, V IL = 0 V−0.8−0.6VV4.Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output ismeasured in the LOW state.CAPACITIVE CHARACTERISTICSSymbol Parameter Condition Typical UnitC IN Input Capacitance V CC = 3.3 V, V I = 0 V or V CC7pFC I/O Input/Output Capacitance V CC = 3.3 V, V I = 0 V or V CC8pFC PD Power Dissipation Capacitance10 MHz, V CC = 3.3 V, V I = 0 V or V CC20pFAn, Bn WAVEFORM 1 − PROPAGATION DELAYS t R = t F = 2.5 ns, 10% to 90%; f = 1 MHz; t W = 500 ns V CC0 VV OHV OLAn, BnBn, AnWAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMESt R = t F = 2.5 ns, 10% to 90%; f = 1 MHz; t W = 500 ns0 VOEn,T/RnAn, BnFigure 3. AC WaveformsV OH V HZ V OLV CCV LZ Table 2. AC WAVEFORMSSymbol V CC3.3 V ±0.3 V2.7 V 2.5 V +0.2 V Vmi 1.5 V 1.5 V V CC / 2Vmo 1.5 V 1.5 V V CC / 2V HZ V OL + 0.3 V V OL+ 0.3 V V OL + 0.15 V V LZV OH − 0.3 VV OH − 0.3 VV OH − 0.15 VOPEN V 6 V or V CC x 2GNDFigure 4. Test CircuitTable 3. TEST CIRCUITTESTSWITCH t PLH , t PHL Opent PZL , t PLZ6 V at V CC = 3.3 0.3 V 6 V at V CC = 2.5 0.2 VOpen Collector/Drain t PLH and t PHL 6 V t PZH , t PHZGNDC L = 50 pF at V CC = 3.3 0.3 V or equivalent (includes jig and probe capacitance)C L = 30 pF at V CC = 2.5 0.2 V or equivalent (includes jig and probe capacitance)R L = R 1 = 500 W or equivalentR T = Z OUT of pulse generator (typically 50 W )PACKAGE DIMENSIONSTSSOP−48DT SUFFIX CASE 1201−01ISSUE ADIM MIN MAX MIN MAX INCHESMILLIMETERS A 12.4012.600.4880.496B 6.00 6.200.2360.244C −−− 1.10−−−0.043D 0.050.150.0020.006F 0.500.750.0200.030G 0.50 BSC 0.0197 BSC H 0.37−−−0.015−−−J 0.090.200.0040.008J10.090.160.0040.006K 0.170.270.0070.011K10.170.230.0070.009L 7.958.250.3130.325M0 8 0 8 ____NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.4.DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.5.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.6.DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
74LVC162245ADG-T资料
1DIR 1B0 1B1 GND 1B2 1B3 VCC 1B4 1B5
1 2 3 4 5 6 Байду номын сангаас 8 9
48 1OE 47 1A0 46 1A1 45 GND 44 1A2 43 1A3 42 VCC 41 1A4 40 1A5 39 GND 38 1A6 37 1A7 36 2A0 35 2A1 34 GND 33 2A2 32 2A3 31 VCC 30 2A4 29 2A5 28 GND 27 2A6 26 2A7 25 2OE
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 2.5 ns. SYMBOL tPHL/tPLH CI CI/O CPD Note 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; Σ(CL × VCC2 × fo) = sum of the outputs. 2. The condition is VI = GND to VCC. PARAMETER propagation delay nAn to nBn; nBn to nAn input capacitance input/output capacitance power dissipation capacitance VCC = 3.3 V; notes 1 and 2 CONDITIONS CL = 50 pF; VCC = 3.3 V TYPICAL 3.3 5.0 10 28 ns pF pF pF UNIT
74LVT16244BDL-T资料
1.General descriptionThe 74LVT16244B;74LVTH16244B is a high-performance BiCMOS product designed for V CC operation at 3.3 V .This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.2.FeaturesI 16-bit bus interface I 3-state buffersI Output capability: +64 mA and −32 mA I TTL input and output switching levelsI Input and output interface capability to systems at 5 V supplyI Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs I Power-up 3-stateI Live insertion and extraction permittedI No bus current loading when output is tied to 5 V bus ILatch-up protection:N JESD78: exceeds 500mA I ESD protection:N MIL STD 833 method 3015: exceeds 2000 V N Machine model: exceeds 200 V3.Quick reference data74LVT16244B; 74LVTH16244B3.3 V 16-bit buffer/driver; 3-stateRev. 05 — 21 March 2006Product data sheetTable 1.Quick reference data GND = 0 V; T amb = 25°C.Symbol ParameterConditionsMin Typ Max Unit t PLH LOW-to-HIGH propagation delay nAn to nYnC L =50pF;V CC = 3.3V- 1.8-ns t PHL HIGH-to-LOW propagation delay nAn to nYn C L =50pF;V CC = 3.3V - 1.7-ns C i input capacitance V I = 0V or 3.0V -3-pF C o output capacitance outputs disabled;V O =0V or 3.0V -9-pF I CCquiescent supply currentoutputs disabled;V CC =3.6V; I O =0A;V I =GND or V CC-70-µA4.Ordering information5.Functional diagramTable 2.Ordering informationType numberPackageTemperature range NameDescriptionVersion 74LVT16244BDL −40°C to +85°C SSOP48plastic shrink small outline package; 48 leads;body width 7.5 mmSOT370-174LVT16244BDGG −40°C to +85°C TSSOP48plastic thin shrink small outline package; 48 leads;body width 6.1 mmSOT362-174LVT16244BEV −40°C to +85°C VFBGA56plastic very thin fine-pitch ball grid array package;56 balls; body 4.5× 7× 0.65 mmSOT702-174LVTH16244BDL−40°C to +85°CSSOP48plastic shrink small outline package; 48 leads;body width 7.5 mmSOT370-174LVTH16244BDGG −40°C to +85°CTSSOP48plastic thin shrink small outline package; 48 leads;body width 6.1 mmSOT362-1Pin numbers are shown for SSOP and TSSOP packages only.Pin numbers are shown for SSOP and TSSOP packages only.Fig 1.Logic symbol Fig 2.IEC logic symbol001aae5064746444323561A01A11A21A31Y01Y11Y21Y311OE 36353332131416173A03A13A23A33Y03Y13Y23Y3253OE 30292726192022234A04A14A24A34Y04Y14Y24Y3244OE414038378911122A02A12A22A32Y02Y12Y22Y3482OE11111324001aae231333230292726161719202223474644434140383736352356891112131424251A01A11A21A32A02A12A22A33A03A13A23A34A04A14A24A31Y01Y11Y21Y32Y02Y12Y22Y33Y03Y13Y23Y34Y04Y14Y24Y34814OE 1OE2OE3OEEN1EN2EN3EN46.Pinning information6.1Pinning6.2Pin descriptionFig 3.Pin configuration for SSOP48 and TSSOP48Fig 4.Pin configuration for VFBGA5674LVT16244B 74LVTH16244B1OE 2OE 1Y01A01Y11A1GND GND 1Y21A21Y31A3V CC V CC 2Y02A02Y12A1GND GND 2Y22A22Y32A33Y03A03Y13A1GND GND 3Y23A23Y33A3V CC V CC 4Y04A04Y14A1GND GND 4Y24A24Y34A34OE 3OE001aae507123456789101112131415161718192021222324484746454443424140393837363534333231302928272625001aae5081OE 1Y11Y32Y12Y33Y03Y24Y04Y24OEA B C D E F G H J K1Y074LVT16244Bn.c.n.c.n.c.n.c.n.c.n.c.n.c.n.c.1Y22Y02Y23Y13Y34Y14Y3GND V CC GNDGND V CC GND GND V CC GNDGND V CC GND 1A01A22A02A23A13A34A14A32OE 1A11A32A12A33A03A24A04A21234563OETransparent top viewTable 3.Pin description Symbol Pin Description(T)SSOP48VFBGA561OE 1A1output enable input 1OE n.c.-A2, A3, A4, A5not connected1Y02B2data output 1Y01Y13B1data output 1Y1GND 4B3ground (0 V)1Y25C2data output 1Y21Y36C1data output 1Y3V CC 7C3supply voltage 2Y08D2data output 2Y0Table 3.Pin description …continuedSymbol Pin Description(T)SSOP48VFBGA562Y19D1data output 2Y1GND10D3ground (0 V)2Y211E2data output 2Y22Y312E1data output 2Y33Y013F1data output 3Y03Y114F2data output 3Y1GND15G3ground (0 V)3Y216G1data output 3Y23Y317G2data output 3Y3V CC18H3supply voltage4Y019H1data output 4Y04Y120H2data output 4Y1GND21J3ground (0 V)4Y222J1data output 4Y24Y323J2data output 4Y34OE24K1output enable input 4OE n.c.-K2, K3, K4, K5not connected3OE25K6output enable input 3OE 4A326J5data input 4A34A227J6data input 4A2GND28J4ground (0 V)4A129H5data input 4A14A030H6data input 4A0V CC31H4supply voltage3A332G5data input 3A33A233G6data input 3A2GND34G4ground (0 V)3A135F5data input 3A13A036F6data input 3A02A337E6data input 2A32A238E5data input 2A2GND39D4ground (0 V)2A140D6data input 2A12A041D5data input 2A0V CC42C4supply voltage1A343C6data input 1A31A244C5data input 1A2GND45B4ground (0 V)7.Functional description7.1Function table[1]H = HIGH voltage level;L = LOW voltage level;X = don’t care;Z = high-impedance OFF-state.8.Limiting values[1]The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.[2]The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability.1A146B6data input 1A11A047B5data input 1A02OE48A6output enable input 2OETable 3.Pin description …continuedSymbol Pin Description(T)SSOP48VFBGA56Table 4.Function table [1]Control Input Output nOE nAn nYn L L L H H HXZTable 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).Symbol Parameter ConditionsMin Max Unit V CC supply voltage −0.5+4.6V V I input voltage [1]−0.5+7.0V V O output voltage output in OFF-state or HIGH-state [1]−0.5+7.0V I IK input clamping current V I < 0 V -−50mA I OK output clamping current V O < 0 V-−50mA I O output current output in LOW-state -128mA output in HIGH-state-−64mA T stg storage temperature −65+150°C T jjunction temperature[2]-150°C9.Recommended operating conditions10.Static characteristicsTable 6.Recommended operating conditions Symbol Parameter ConditionsMin Typ Max Unit V CC supply voltage 2.7- 3.6V V I input voltage0- 5.5V V IH HIGH-state input voltage 2.0--V V IL LOW-state input voltage --0.8V I OH HIGH-state output current--−32mA I OLLOW-state output currentnone--32mA current duty cycle ≤50%;f i ≥ 1kHz --64mA T amb ambient temperature in free-air −40-+85°C ∆t/∆Vinput transition rise and fall rateoutputs enabled --10ns/VTable 7.Static characteristicsAt recommended operating conditions; voltages are referenced to GND (ground =0V).Symbol Parameter Conditions Min Typ Max Unit T amb =−40°C to +85°C [1]V IK input clamping voltage V CC = 2.7 V; I IK =−18mA-−0.85−1.2V V OHHIGH-state output voltageI OH =−100µA;V CC =2.7V to 3.6V V CC −0.2V CC-V I OH =−8mA; V CC = 2.7 V 2.4 2.5-V I OH =−32mA; V CC = 3.0 V2.0 2.3-V V OLLOW-state output voltageV CC = 2.7V I OL = 100µA -0.070.2V I OL = 24mA -0.30.5V V CC = 3.0V I OL = 16mA -0.250.4V I OL = 32mA -0.30.5V I OL = 64mA-0.40.55V I LIinput leakage current all input pins V CC = 0V or 3.6V; V I =5.5V -0.410µA control pins V CC = 3.6V; V I =V CC or GND -0.1±1.0µA data pinsV CC = 3.6V [2]V I =V CC -0.11µA V I =0V-−0.4−5µA I OFFpower-off leakage currentV CC = 0V; V I or V O = 0V to 4.5V-0.1±100µA[1]Typical values are measured at V CC = 3.3 V and at T amb = 25°C.[2]Unused pins at V CC or GND.[3]This is the bus hold overdrive current required to force the input to the opposite logic state.[4]This parameter is valid for any V CC between 0V and 1.2V with a transition time of up to 10ms.From V CC =1.2V to V CC =3.3V ±0.3V a transition time of 100µs is permitted. This parameter is valid for T amb = 25°C only.[5]I CC is measured with outputs pulled to V CC or GND.[6]This is the increase in supply current for each input at the specified voltage level other than V CC or GND.11.Dynamic characteristicsI HOLDbus hold current data inputV CC = 3V [3]V I = 0.8V 75135-µA V I = 2.0V −75−135-µA V CC = 0V to 3.6V V I = 3.6V±500--µA I EX external current into output output in HIGH-state whenV O >V CC ; V O = 5.5V; V CC =3.0V -50125µA I O(pu/pd)power-up/power-down output currentV CC ≤1.2V; V O =0.5V to V CC ;V I =GND or V CC ; nOE =don’t care [4]-1±100µAI OZOFF-state output currentV CC = 3.6V; V I = V IH or V IL output HIGH: V O = 3.0 V -0.55µA output LOW: V O = 0.5 V-+0.5−5µAI CCquiescent supply currentV CC = 3.6V; V I = GND or V CC ;I O =0A output HIGH -0.070.12mA output LOW - 4.0 6.0mA outputs disabled[5]-0.070.12mA ∆I CCadditional quiescent supply currentper input pin; V CC = 3.0V to 3.6V;one input at V CC −0.6V and other inputs at V CC or GND [6]-0.10.2mAC i input capacitance V I = 0V or 3.0V-3-pF C ooutput capacitanceoutputs disabled; V O =0V or 3.0V-9-pFTable 7.Static characteristics …continuedAt recommended operating conditions; voltages are referenced to GND (ground =0V).Symbol Parameter Conditions Min Typ Max Unit Table 8.Dynamic characteristicsVoltages are referenced to GND (ground = 0 V); for test circuit see Figure 7.Symbol Parameter Conditions MinTypMaxUnitT amb =−40°C to +85°C [1]t PLHLOW-to-HIGH propagation delay nAn to nYn see Figure 5V CC = 2.7 V -- 4.0ns V CC = 3.0 V to 3.6 V 0.51.83.2nst PHLHIGH-to-LOW propagation delay nAn to nYnsee Figure 5V CC = 2.7 V -- 4.0ns V CC = 3.0 V to 3.6 V0.51.73.2nst PZH output enable time toHIGH-level see Figure6V CC = 2.7 V-- 5.0ns V CC = 3.0 V to 3.6 V 1.0 2.3 4.0nst PZL output enable time toLOW-level see Figure6V CC = 2.7 V-- 5.3ns V CC = 3.0 V to 3.6 V 1.0 2.1 4.0nst PHZ output disable timefrom HIGH-level see Figure6V CC = 2.7 V-- 5.0ns V CC = 3.0 V to 3.6 V 1.0 3.2 4.5nst PLZ output disable timefrom LOW-level see Figure6V CC = 2.7 V-- 4.4ns V CC = 3.0 V to 3.6 V 1.0 2.9 4.0nsTable 8.Dynamic characteristics …continuedVoltages are referenced to GND (ground = 0 V); for test circuit see Figure7.Symbol Parameter Conditions Min Typ Max Unit[1]Typical values are measured at V CC = 3.3 V and T amb = 25°C.12.WaveformsMeasurements points are given in Table 9.V OL and V OH are typical voltage output drop that occur with the output load.Fig 5.Propagation delay input (nAn) to output (nYn)Measurements points are given in Table 9.V OL and V OH are typical voltage output drop that occur with the output load.Fig 6.3-state output enable and disable times Table 9.Measurement pointsInput Output V M V M V XV Y1.5V1.5VV OL + 0.3VV OH − 0.3Vmna171nAn inputnYn outputt PLHt PHLGNDV IV MV M V MV MV OHV OL001aae464t PZLnYn outputnYn outputnOE inputV OLV OH3.0 VV IV MGND0 Vt PLZt PZHt PHZV XV YV MV MTest data is given in T able 10.Definitions test circuit:R L = Load resistor.C L = Load capacitance including jig and probe capacitance.R T = Termination resistance should be equal to output impedance Z o of the pulse generator.V EXT = Test voltage for switching times.Fig 7.Load circuitry for switching times Table 10.Test dataInput Load V EXTV I f it W t r , t f C L R L t PHZ , t PZH t PLZ , t PZL t PLH , t PHL 2.7 V≤ 10 MHz500 ns≤ 2.5 ns50 pF500ΩGND6VopenV EXTV CCV IV O001aae235DUTC L R TR LR LPULSE GENERATORV M V Mt Wt W10 %90 %0 VV IV I negative pulsepositive pulse0 VV MV M90 %10 %t ft r t rt f13.Package outlineFig 8.Package outline SOT370-1 (SSOP48)UNIT A 1A 2A 3b p c D (1)E (1)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.40.22.352.200.250.30.20.220.1316.0015.757.67.40.6351.40.2510.410.11.00.61.21.00.850.4080oo 0.180.1DIMENSIONS (mm are the original dimensions)Note1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.SOT370-199-12-2703-02-19(1)w Mb pD H EE Z ecv M AXAy4825MO-118241θAA 1A 2L pQdetail XL(A )3pin 1 index0510 mmscaleSSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mmSOT370-1Amax.2.8Fig 9.Package outline SOT362-1 (TSSOP48)UNIT A 1A 2A 3b p c D (1)E (2)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.150.050.20.180oo 0.1DIMENSIONS (mm are the original dimensions).Notes1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.SOT362-199-12-2703-02-19w MθAA 1A 2D L p Qdetail XE ZecLX(A )30.251244825ypin 1 indexb H 1.050.850.280.1712.612.46.26.00.510.258.37.90.500.350.80.40.080.80.4pEv M AATSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1Amax.1.20 2.5 5 mmscaleMO-153Fig 10.Package outline SOT702-1 (VFBGA56)0.65A 1b A 2UNIT D y e REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE 02-08-0803-07-01IECJEDEC JEITAmm10.30.20.70.64.64.4y 17.16.90.450.350.080.1e 13.25e 25.85DIMENSIONS (mm are the original dimensions) SOT702-1MO-225E 0.15v 0.08w 02.5 5 mmscaleSOT702-1VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm A max.AA 2A 1detail Xyy 1CeebXD ECAB C D E F H G J K 246135ball A1index areaB Ae 2e 11/2 e1/2 eA C CB ∅ v M ∅ w M ball A1index area14.Abbreviations15.Revision historyTable 11.AbbreviationsAcronym DescriptionBiCMOS Bipolar Complementary Metal Oxide Semiconductor DUT Device Under Test ESD Electrostatic Discharge TTLT ransistor-Transistor LogicTable 12.Revision historyDocument IDRelease date Data sheet status Change notice Supersedes 74LVT_LVTH16244B_520060321Product data sheet-74LVT16244B_4Modifications:•The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors.•Section 4: added type numbers 74LVTH16244BDL and 74LVTH16244BDGG.74LVT16244B_420021031Product specification -74LVT16244B_374LVT16244B_319981007Product specification -74LVT16244B_274LVT16244B_219980219Product specification--16.Legal information16.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Definitions”.[3]The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL .16.2DefinitionsDraft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences of use of such information.Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office.In case of any inconsistency or conflict with the short data sheet,the full data sheet shall prevail.16.3DisclaimersGeneral —Information in this document is believed to be accurate andreliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.Right to make changes —Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use —Philips Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmentaldamage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk.Applications —Applications that are described herein for any of theseproducts are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134)may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in theCharacteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.Terms and conditions of sale —Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale,as published at /profile/terms , including thosepertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by PhilipsSemiconductors.In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.16.4TrademarksNotice:All referenced brands,product names,service names and trademarks are the property of their respective owners.17.Contact informationFor additional information, please visit: For sales office addresses, send an email to: sales.addresses@Document status [1][2]Product status [3]DefinitionObjective [short] data sheet Development This document contains data from the objective specification for product development.Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.Product [short] data sheetProductionThis document contains the product specification.18.Contents1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Quick reference data. . . . . . . . . . . . . . . . . . . . . 14Ordering information. . . . . . . . . . . . . . . . . . . . . 25Functional diagram . . . . . . . . . . . . . . . . . . . . . . 26Pinning information. . . . . . . . . . . . . . . . . . . . . . 36.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 37Functional description . . . . . . . . . . . . . . . . . . . 57.1Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 58Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 59Recommended operating conditions. . . . . . . . 610Static characteristics. . . . . . . . . . . . . . . . . . . . . 611Dynamic characteristics . . . . . . . . . . . . . . . . . . 712Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 913Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1114Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 1415Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1416Legal information. . . . . . . . . . . . . . . . . . . . . . . 1516.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1516.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1516.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1516.4T rademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1517Contact information. . . . . . . . . . . . . . . . . . . . . 1518Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© Koninklijke Philips Electronics N.V.2006.All rights reserved.For more information, please visit: .For sales office addresses, email to: sales.addresses@.Date of release: 21 March 2006。
74VHCT16244资料
1/9February 2003sHIGH SPEED:t PD =5.4ns (TYP .)at V CC =5V sLOW POWER DISSIPATION:I CC =4µA (MAX.)at T A =25°CsCOMPATIBLE WITH TTL OUTPUTS:V IH =2V (MIN.)V IL =0.8(MAX.)s POWER DOWN PROTECTION ON INPUTS sSYMMETRICAL OUTPUT IMPEDANCE:|I OH |=I OL =8mA (MIN)sBALANCED PROPAGATION DELAYS:t PLH ≅t PHLsOPERATING VOLTAGE RANGE:V CC (OPR)=4.5V to 5.5VsPIN AND FUNCTION COMPATIBLE WITH 74SERIES 16244s IMPROVED LATCH-UP IMMUNITY sLOW NOISE:V OLP =0.9V (MAX.)DESCRIPTIONThe 74VHCT16244A is an advanced high-speed CMOS 16-BIT BUS BUFFER (3-STATE)fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOS tecnology.Any nG output control governs four BUS BUFFERS.Output Enable inputs (nG)tied together give full 16bit operation.When nG is LOW,the outputs are enabled.When nG is HIGH,the output are in high impedance state.The device is designed to be used with 3-state memory address drivers,etc.Power down protection is provided on all inputs and 0to 7V can be accepted on inputs with no regard to the supply voltage.This device can be used to interface 5V to 3V.All inputs and outputs are equipped with protec-tion circuits against static discharge,giving them 2KV ESD immunity and transient excess voltage.74VHCT16244A16-BIT BUS BUFFERWITH 3-STATE OUTPUTS (NONINVERTED)ORDER CODESPACKAGE TUBET &RTSSOP74VHCT16244ATTRPIN CONNECTION74VHCT16244A2/9INPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEX :Don‘t CareZ :High ImpedanceIEC LOGIC SYMBOLSPIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,3,5,61Y1to 1Y4Data Outputs 8,9,11,122Y1to 2Y4Data Outputs 13,14,16,173Y1to 3Y4Data Outputs 19,20,22,234Y1to 4Y4Data Outputs244G Output Enable Input 253G Output Enable Input 30,29,27,264A1to 4A4Data Outputs 36,35,33,323A1to 3A4Data Outputs 41,40,38,372A1to 2A4Data Outputs 47,46,44,431A1to 1A4Data Outputs482G Output Enable Input 4,10,15,21,28,34,39,45GND Ground (0V)7,18,31,42V CCPositive Supply VoltageINPUTS OUTPUTG An Yn L L L L H H HXZ74VHCT16244A3/9ABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur.Functional operation under these conditions is not impliedRECOMMENDED OPERATING CONDITIONS1)V IN from 0.8V to 2.0VSymbol ParameterValue Unit V CC Supply Voltage -0.5to +7.0V V I DC Input Voltage -0.5to +7.0V V O DC Output Voltage -0.5to V CC +0.5V I IK DC Input Diode Current -20mA I OK DC Output Diode Current ±20mA I O DC Output Current ±25mA I CC or I GND DC V CC or Ground Current±75mA T stg Storage Temperature -65to +150°C T LLead Temperature (10sec)300°CSymbol ParameterValue Unit V CC Supply Voltage 4.5to 5.5V V I Input Voltage 0to 5.5V V O Output Voltage 0to V CC V T op Operating Temperature-55to 125°C dt/dvInput Rise and Fall Time (note 1)(Vcc=5.0±0.5V)0to 20ns/V74VHCT16244A4/9DC SPECIFICATIONSAC ELECTRICAL CHARACTERISTICS (Input t r =t f =3ns)(*)Voltage range is 5.0V ±0.5VCAPACITIVE CHARACTERISTICS1)C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load.(Refer to Test Circuit).Average operating current can be obtained by the following equation.I CC(opr)=C PD x V CC x f IN +I CC /16(per Latch)SymbolParameterTest ConditionValue UnitV CC (V)T A =25°C -40to 85°C -55to 125°C Min.Typ.Max.Min.Max.Min.Max.V IH High Level Input Voltage4.5to5.5222V V IL Low Level Input Voltage4.5to5.50.80.80.8V V OH High Level Output Voltage4.5I O =-50µA 4.4 4.54.4 4.4V 4.5I O =-8mA 3.943.83.7V OL Low Level Output Voltage4.5I O =50µA 0.00.10.10.1V 4.5I O =8mA 0.360.440.55I OZHigh Impedance Output Leakage Current5.5V I =V IH or V IL V O =V CC or GND ±0.25±2.5±2.5µA I I Input Leakage Current0to 5.5V I =5.5V or GND ±0.1±1±1µA I CCQuiescent Supply Current5.5V I =V CC or GND44040µA SymbolParameterTest ConditionValue UnitV CC (*)(V)C L (pF)T A =25°C -40to 85°C -55to 125°C Min.Typ.Max.Min.Max.Min.Max.t PLH t PHL Propagation Delay Time5.015 5.48.5 1.09.5 1.010.0ns 5.05079.5 1.010.5 1.011.0t PLZ t PHZ Output Disable Time5.015RL =1K Ω7.710.4 1.012.0 1.012.0ns 5.0508.211.4 1.013.0 1.013.0t PZL t PZHOutput Enable Time5.050RL =1K Ω8.811.41.013.01.013.0ns SymbolParameterTest ConditionValue UnitV CC (V)T A =25°C -40to 85°C -55to 125°C Min.Typ.Max.Min.Max.Min.Max.C IN Input Capacitance 4101010pF C OUT OutputCapacitance6pF C PDPower Dissipation Capacitance (note 1)5.0f IN =10MHz21pF74VHCT16244A5/9DYNAMIC SWITCHING CHARACTERISTICS1)Worst case package.2)Max number of outputs defined as (n).Data inputs are driven 0V to 5.0V,(n-1)outputs switching and one output at GND.3)Max number of data inputs (n)switching.(n-1)switching 0V to 5.0V.Inputs under test switching:5.0V to threshold (V ILD ),0V to threshold (VIHD ),f=1MHz.TEST CIRCUITC L =15/50pF or equivalent (includes jig and probe capacitance)R L =R1=1K Ω or equivalentR T =Z OUT of pulse generator (typically 50Ω)SymbolParameterTest ConditionValue UnitV CC (V)T A =25°C -40to 85°C -55to 125°C Min.Typ.Max.Min.Max.Min.Max.V OLP Dynamic Low Voltage Quiet Output (note 1,2) 5.0C L =50pF0.60.9V V OLV -0.9-0.6V IHD Dynamic High Voltage Input (note 1,3) 5.0 3.5VV ILDDynamic Low Voltage Input (note 1,3)5.0 1.5VTESTSWITCH t PLH ,t PHL Open t PZL ,t PLZ V CC t PZH ,t PHZGND74VHCT16244A6/9WAVEFORM 1:PROPAGATION DELAYS (f=1MHz;50%duty cycle)WAVEFORM 2:OUTPUT ENABLE AND DISABLE TIME (f=1MHz;50%dutycycle)74VHCT16244A Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2003 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.© 9/9。
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11 12 13 14
2 1Y0 3 1Y1 5 1Y2 6 1Y3 8
2Y0 9
2Y1 11 2Y2 12 2Y3 13 3Y0 14
3Y1 16
3Y2 17
3Y3 19
4Y0 20 4Y1 22 4Y2 23
4Y3 001aae231
Pin numbers are shown for SSOP and TSSOP packages only.
元器件交易网
Philips Semiconductors
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
6. Pinning information
6.1 Pinning
74LVT16244B 74LVTH16244B
VI = GND or VCC
Min Typ Max Unit
-
1.8 -
ns
-
1.7 -
ns
-
3
-
pF
-
9
-
pF
-
70 -
µA
元器件交易网
Philips Semiconductors
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Philips Semiconductors
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Table 3. Symbol
2Y1 GND 2Y2 2Y3 3Y0 3Y1 GND 3Y2 3Y3 VCC 4Y0 4Y1 GND 4Y2 4Y3 4OE n.c. 3OE 4A3 4A2 GND 4A1 4A0 VCC 3A3 3A2 GND 3A1 3A0 2A3 2A2 GND 2A1 2A0 VCC 1A3 1A2 GND
8
D2
data output 2Y0
74LVT_LVTH16244B_5
Product data sheet
Rev. 05 — 21 March 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
3 of 16
元器件交易网
001aae507
Fig 3. Pin configuration for SSOP48 and TSSOP48
74LVT16244B
1
2
3
4
5
6
A 1OE n.c. n.c. n.c. n.c. 2OE
B 1Y1 1Y0 GND GND 1A0 1A1
C 1Y3 1Y2 VCC VCC 1A2 1A3 D 2Y1 2Y0 GND GND 2A0 2A1
48 2OE 47 1A0 46 1A1 45 GND 44 1A2 43 1A3 42 VCC 41 2A0 40 2A1 39 GND 38 2A2 37 2A3 36 3A0 35 3A1 34 GND 33 3A2 32 3A3 31 VCC 30 4A0 29 4A1 28 GND 27 4A2 26 4A3 25 3OE
5. Functional diagram
1A0 47 46 1A1
1A2 44 43 1A3
1OE 1
2A0 41 40 2A1
2A2 38 37 2A3
2OE 48
1Y0 2
1Y1 3 1Y2
5 1Y3 6
2Y0 8
2Y1 9 2Y2
11 2Y3 12
3A0 36 35 3A1
3A2 33 32 3A3
1OE 1 1Y0 2 1Y1 3 GND 4 1Y2 5 1Y3 6 VCC 7 2Y0 8 2Y1 9 GND 10 2Y2 11 2Y3 12 3Y0 13 3Y1 14 GND 15 3Y2 16 3Y3 17 VCC 18 4Y0 19 4Y1 20 GND 21 4Y2 22 4Y3 23 4OE 24
Fig 1. Logic symbol
1
1OE
EN1
2OE 48 EN2
25
3OE
EN3
24
4OE
EN4
1A0 47 1A1 46 1A2 44 1A3 43
41 2A0
40 2A1 2A2 38 2A3 37 3A0 36 3A1 35
33 3A2
32 3A3
30 4A0 4A1 29 4A2 27
元器件交易网
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Rev. 05 — 21 March 2006
Product data sheet
1. General description
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for VCC operation at 3.3 V.
plastic thin shrink small outline package; 48 leads; body width 6.1 mm
plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 × 7 × 0.65 mm
Pin description …continued
Pin
Description
(T)SSOP48 VFBGA56
9
D1
data output 2Y1
10
D3
ground (0 V)
11
E2
data output 2Y2
12
E1
data output 2Y3
13
F1
data output 3Y0
14
2. Features
I 16-bit bus interface I 3-state buffers I Output capability: +64 mA and −32 mA I TTL input and output switching levels I Input and output interface capability to systems at 5 V supply I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs I Power-up 3-state I Live insertion and extraction permitted I No bus current loading when output is tied to 5 V bus I Latch-up protection:
74LVT16244BEV −40 °C to +85 °C VFBGA56
74LVTH16244BDL −40 °C to +85 °C SSOP48
74LVTH16244BDGG −40 °C to +85 °C TSSOP48
Description
plastic shrink small outline package; 48 leads; body width 7.5 mm
Fig 4. Pin configuration for VFBGA56
6.2 Pin description
Table 3. Symbol
1OE n.c. 1Y0 1Y1 GND 1Y2 1Y3 VCC 2Y0
Pin description
Pin
Description
(T)SSOP48 VFBGA56
Fig 2. IEC logic symbol
74LVT_LVTH16244B_5
Product data sheet
Rev. 05 — 21 March 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
2 of 16
N JESD78: exceeds 500 mA I ESD protection:
N MIL STD 833 method 3015: exceeds 2000 V N Machine model: exceeds 200 V
3. Quick reference data
Table 1. Quick reference data GND = 0 V; Tamb = 25 °C.
4. Ordering information
Table 2. Ordering information
Type number
Package
Temperature range Name
74LVT16244BDL −40 °C to +85 °C SSOP48
74LVT16244BDGG −40 °C to +85 °C TSSOP48
23
J2
data output 4Y3
24
K1
output enable input 4OE
-
K2, K3, K4, K5 not connected
25
K6
output enable input 3OE
26
J5
data input 4A3
Ci
input capacitance