SD101C-TR中文资料
怎样制作全面精简版XP系统
怎样制作精简版XP系统安装系统和安装后的优化设置确实太消耗时间和精力了,而且有的东西是安装完后再去清除,在系统里面会留存些垃圾文件,而从网上下载的精简系统也不一定适合我的要求,实在是没有办法,于是找来了系统精简工具nlite,打算从根源上去进行精简优化。
网络确实是好东西,想要的几乎都可以找到,但往往找到的东西又有很多的矛盾,经过几天的突击了解实验,今天总算是有了成就。
为了方便别人的使用,把自己的一点成功经验总结下来。
不同的人对系统的要求是不同,我所做的精简并不是为了精简而精简,所以没有套用网络上现成的资料做成极尽精简的系统,那样的系统确实很小,安装文件只有200M,安装完后所占用的空间也很小,可能只有4、5百m,但这样的系统对于有的人来说却是不完整的,它只保留了多数人常用的功能,而有部分不常用的功能往往都被精简掉了。
我进行的精简只是去掉了几乎没有人去使用或者已经过时而被更好的工具替代的部分,在实际使用上绝对不会对任何功能产生影响。
关于如何去精简,我这里不做更细致的介绍,网络上高手的文章都描述地很清楚,我只是针对关于中文输入法的精简做下经验性的总结。
我使用的系统精简工具是nlite1.4.1版本的,这个版本带有中文,在运行时可以选择简体中文的界面,不过它需要NET Framework的支持,在安装它之前还要去下载个NET Framework 3.5版本的先安装上。
1. nlite运行时在第一个界面上就是选择语言在这里选择简体中文的,界面就变成中文的了(别说你不会哦,那就不要用这个工具了),接下来的界面就要选择系统文件所在的目录。
这个目录你可以事先把系统盘里面的所有文件都拷贝到一个指定的目录里面,或者把系统盘镜像解压到那个目录里面。
2. 接下来你可以导入以前保存的设置文件,若没有就可以跳到下一界面。
3. 在这个界面你可以按自己的需要选择进行设置的界面,我要的是纯净的原始系统,所以就不整合补丁和驱动,只选择“组件”、“人值守安装”、“选项”、“优化调整”和“可引导iso镜像”。
2010公司中英文
QFNFC5*5-18L (Flip-chip) SOT-23-5L (Flip-chip) QFN5*5-40 QFN6*6-48
Package Type - SiP 封装形式-SiP
MicroSD USB Module
MiniSD
SD
SIM
LGA
BGA
Module
Wire Bonding
SiP工程技术能力 SiP Engineering Capability
2009 Revenue($M) 2009 收入(百万美元) 2,597 2,179 1,722 1,326 982 600 368 342 319 300 10,735 6,452 17,187
2009 Growth(%) 2009 增长率(%) -12.0 -18.0 -10.2 -20.0 -1.2 -15.6 -29.1 -2.0 -22.8 -19.6 -14.4 -14.6 -14.5
Wafer Probe
圆片测试
Wafer Grinding
圆片减薄
Assembly
封装
Final Test
成品测试
Analog,Mixed Signal 集成电路封装、 Logic,Mosfet 基板、分立器件 IC,SiP,Discrete Package Memory Devices
Drop Shipment
Film On Wire D/B Technology
25um Chip Grinding & Stack Technology
SiP技术发展里程 Technical Roadmap of SiP
I/O
SiP / SoP MODULE Wire Bonding BGA MEMS Flip Chip BGA
TR100D说明书
5
3-5 TR100D 功能树图
主显示界面:百分比/物位值
8 0.0
9 0.0
C 900 电容值 C 1000
F 1000 频率值 F 1100
CH2
CH1
密码输入 000100
通道选择 1.CH
料位校准 2.CAL
1/2
实物校准 CAL1
理论校准 CAL2
对应关系 3.rELAt
模拟量选择 4.Ao.tYP
TR100D
数字射频导纳物位控制器 使用说明书
V01.01/2013.01
LONGTEC
过程料位专家
目录
1 概述 ............................................................................................................................................................................1 2 技术参数 ....................................................................................................................................................................1 3 安装与接线说明 ........................................................................................................................................................2
国家简码代码中英文对应表
181
PW
帕劳
Palau
182
PY
巴拉圭
Paraguay
183
QA
卡塔尔
Qatar
184
QM
根西岛
Guernsey
185
QN
扬马延岛
Jan Mayen
186
QO
泽西岛
Jersey
187
RE
留尼旺岛
Reunion
188
RO
罗马尼亚
Romania
189
RS
塞尔维亚
Serbia
190
RU
俄罗斯
Russian Federation
澳大利亚
Australia
阿鲁巴
Aruba
阿塞拜疆
Azerbaijan
波斯尼亚和黑塞哥
Bosnia and
维那
Herzegovina
巴巴多斯
Barbados
孟加拉国
Bangladesh
比利时
Belgium
布基纳法索
Burkina Faso
保加利亚
Bulgaria
巴林
Bahrain
布隆迪
Burundi
222
TR
土耳其
Turkey
223
TT
特里尼达和多巴哥
Trinidad and Tobago
224
TV
图瓦卢
Tuvalu
225
TW
中国台湾省
Taiwan, Province of China
226
TZ
坦桑尼亚联合共和 Tanzania, United
国
Republic of
超低功耗微型超声时间差测距传感器CH101说明书
CH101 Ultra-low Power Integrated Ultrasonic Time-of-Flight Range SensorChirp Microsystems reserves the right to change specifications and information herein without notice.Chirp Microsystems2560 Ninth Street, Ste 200, Berkeley, CA 94710 U.S.A+1(510) 640–8155Document Number: DS-000331Revision: 1.2Release Date: 07/17/2020CH101 HIGHLIGHTSThe CH101 is a miniature, ultra-low-power ultrasonic Time-of-Flight (ToF) range sensor. Based on Chirp’s patented MEMS technology, the CH101 is a system-in-package that integrates a PMUT (Piezoelectric Micromachined Ultrasonic Transducer) together with an ultra-low-power SoC (system on chip) in a miniature, reflowable package. The SoC runs Chirp’s advanced ultrasonic DSP algorithms and includes an integrated microcontroller that provides digital range readings via I2C.Complementing Chirp’s long-range CH201 ultrasonic ToF sensor product, the CH101 provides accurate range measurements to targets at distances up to 1.2m. Using ultrasonic measurements, the sensor works in any lighting condition, including full sunlight to complete darkness, and provides millimeter-accurate range measurements independent of the target’s color and optical transparency. The sensor’s Field-of-View (FoV) can be customized and enables simultaneous range measurements to multiple objects in the FoV. Many algorithms can further process the range information for a variety of usage cases in a wide range of applications.The CH101-00ABR is a Pulse-Echo product intended for range finding and presence applications using a single sensor for transmit and receive of ultrasonic pulses. The CH101-02ABR is a frequency matched Pitch-Catch product intended for applications using one sensor for transmit and a second sensor for receiving the frequency matched ultrasonic pulse.DEVICE INFORMATIONPART NUMBER OPERATION PACKAGECH101-00ABR Pulse-Echo 3.5 x 3.5 x 1.26mm LGA CH101-02ABR Pitch-Catch 3.5 x 3.5 x 1.26mm LGA RoHS and Green-Compliant Package APPLICATIONS•Augmented and Virtual Reality•Robotics•Obstacle avoidance•Mobile and Computing Devices•Proximity/Presence sensing•Ultra-low power remote presence-sensing nodes •Home/Building automation FEATURES•Fast, accurate range-finding•Operating range from 4 cm to 1.2m•Sample rate up to 100 samples/sec• 1.0 mm RMS range noise at 30 cm range•Programmable modes optimized for medium and short-range sensing applications•Customizable field of view (FoV) up to 180°•Multi-object detection•Works in any lighting condition, including full sunlight to complete darkness•Insensitive to object color, detects opticallytransparent surfaces (glass, clear plastics, etc.) •Easy to integrate•Single sensor for receive and transmit•Single 1.8V supply•I2C Fast-Mode compatible interface, data rates up to 400 kbps•Dedicated programmable range interrupt pin•Platform-independent software driver enables turnkey range-finding•Miniature integrated module• 3.5 mmx 3.5 mm x 1.26 mm, 8-pin LGA package•Compatible with standard SMD reflow•Low-power SoC running advanced ultrasound firmware•Operating temperature range: -40°C to 85°C •Ultra-low supply current• 1 sample/s:o13 µA (10 cm max range)o15 µA (1.0 m max range)•30 samples/s:o20 µA (10 cm max range)o50 µA (1.0 m max range)Table of ContentsCH101 Highlights (1)Device Information (1)Applications (1)Features (1)Simplified Block Diagram (3)Absolute Maximum Ratings (4)Package Information (5)8-Pin LGA (5)Pin Configuration (5)Pin Descriptions (6)Package Dimensions (6)Electrical Characteristics (7)Electrical Characteristics (Cont’d) (8)Typical Operating Characteristics (9)Detailed Description (10)Theory of Operation (10)Device Configuration (10)Applications (11)Chirp CH101 Driver (11)Object Detection (11)Interfacing to the CH101 Ultrasonic Sensor (11)Device Modes of Operation: (12)Layout Recommendations: (13)PCB Reflow Recommendations: (14)Use of Level Shifters (14)Typical Operating Circuits (15)Ordering Information (16)Part Number Designation (16)Package Marking (17)Tape & Reel Specification (17)Shipping Label (17)Revision History (19)SIMPLIFIED BLOCK DIAGRAMFigure 1. Simplified Block DiagramABSOLUTE MAXIMUM RATINGSPARAMETER MIN. TYP. MAX. UNIT AVDD to VSS -0.3 2.2 V VDD to VSS -0.3 2.2 V SDA, SCL, PROG, RST_N to VSS -0.3 2.2 V Electrostatic Discharge (ESD)Human Body Model (HBM)(1)Charge Device Model (CDM)(2)-2-5002500kVV Latchup -100 100 mA Temperature, Operating -40 85 °C Relative Humidity, Storage 90 %RH Continuous Input Current (Any Pin) -20 20 mA Soldering Temperature (reflow) 260 °CTable 1. Absolute Maximum RatingsNotes:1.HBM Tests conducted in compliance with ANSI/ESDA/JEDEC JS-001-2014 Or JESD22-A114E2.CDM Tests conducted in compliance with JESD22-C101PACKAGE INFORMATION8-PIN LGADESCRIPTION DOCUMENT NUMBER CH101 Mechanical Integration Guide AN-000158CH101 and CH201 Ultrasonic Transceiver Handling andAssembly Guidelines AN-000159Table 2. 8-Pin LGAPIN CONFIGURATIONTop ViewFigure 2. Pin Configuration (Top View)PIN DESCRIPTIONSPIN NAME DESCRIPTION1 INT Interrupt output. Can be switched to input for triggering and calibration functions2 SCL SCL Input. I2C clock input. This pin must be pulled up externally.3 SDA SDA Input/Output. I2C data I/O. This pin must be pulled up externally.4 PROG Program Enable. Cannot be floating.5 VSS Power return.6 VDD Digital Logic Supply. Connect to externally regulated 1.8V supply. Suggest commonconnection to AVDD. If not connected locally to AVDD, b ypass with a 0.1μF capacitor asclose as possible to VDD I/O pad.7 AVDD Analog Power Supply. Connect to externally re gulated supply. Bypass with a 0.1μFcapacitor as close as possible to AVDD I/O pad.8 RESET_N Active-low reset. Cannot be floating.Table 3. Pin DescriptionsPACKAGE DIMENSIONSFigure 3. Package DimensionsELECTRICAL CHARACTERISTICSAVDD = VDD = 1.8VDC, VSS = 0V, T A = +25°C, min/max are from T A = -40°C to +85°C, unless otherwise specified.PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSPOWER SUPPLYAnalog Power Supply AVDD 1.62 1.8 1.98 V Digital Power Supply VDD 1.62 1.8 1.98 VULTRASONIC TRANSMIT CHANNELOperating Frequency 175 kHzTXRX OPERATION (GPR FIRMWARE USED UNLESS OTHERWISE SPECIFIED)Maximum Range Max Range Wall Target58 mm Diameter Post1.2(1)0.7mm Minimum Range Min Range Short-Range F/W used 4(2)cm Measuring Rate (Sample/sec) SR 100 S/s Field of View FoV Configurable up to 180º deg Current Consumption (AVDD +VDD) I SSR=1S/s, Range=10 cmSR=1S/s, Range=1.0mSR=30S/s, Range=10 cmSR=30S/s, Range=1.0m13152050μAμAμAμA Range Noise N R Target range = 30 cm 1.0 mm, rms Measurement Time 1m max range 18 ms Programming Time 60 msTable 4. Electrical CharacteristicsNotes:1.Tested with a stationary target.2.For non-stationary objects. While objects closer than 4cm can be detected, the range measurement is not ensured.ELECTRICAL CHARACTERISTICS (CONT’D)AVDD = VDD = 1.8VDC, VSS = 0V, T A = +25°C, unless otherwise specified.PARAMETERSYMBOL CONDITIONS MINTYP MAX UNITS DIGITAL I/O CHARACTERISTICS Output Low Voltage V OL SDA, INT,0.4 V Output High Voltage V OH INT 0.9*V VDD V I 2C Input Voltage Low V IL_I2C SDA, SCL 0.3*V VDDV I 2C Input Voltage High V IH_I2C SDA, SCL 0.7*V VDD V Pin Leakage Current I L SDA,SCL, INT(Inactive), T A =25°C±1μA DIGITAL/I 2C TIMING CHARACTERISTICSSCL Clock Frequencyf SCLI 2C Fast Mode400kHzTable 5. Electrical Characteristics (Cont’d)TYPICAL OPERATING CHARACTERISTICSAVDD = VDD = 1.8VDC, VSS = 0V, T A = +25°C, unless otherwise specified.Typical Beam Pattern – MOD_CH101-03-01 Omnidirectional FoV module(Measured with a 1m2 flat plate target at a 30 cm range)Figure 4. Beam pattern measurements of CH101 moduleDETAILED DESCRIPTIONTHEORY OF OPERATIONThe CH101 is an autonomous, digital output ultrasonic rangefinder. The Simplified Block Diagram, previously shown, details the main components at the package-level. Inside the package are a piezoelectric micro-machined ultrasonic transducer (PMUT) and system-on-chip (SoC). The SoC controls the PMUT to produce pulses of ultrasound that reflect off targets in the sensor’s Field of View (FoV). The reflections are received by the same PMUT after a short time delay, amplified by sensitive electronics, digitized, and further processed to produce the range to the primary target. Many algorithms can further process the range information for a variety of usage cases in a wide range of applications.The time it takes the ultrasound pulse to propagate from the PMUT to the target and back is called the time-of-flight (ToF). The distance to the target is found by multiplying the time-of-flight by the speed of sound and dividing by two (to account for the round-trip). The speed of sound in air is approximately 343 m/s. The speed of sound is not a constant but is generally stable enough to give measurement accuracies within a few percent error.DEVICE CONFIGURATIONA CH101 program file must be loaded into the on-chip memory at initial power-on. The program, or firmware, is loaded through a special I2C interface. Chirp provides a default general-purpose rangefinder (GPR) firmware that is suitable for a wide range of applications. This firmware enables autonomous range finding operation of the CH101. It also supports hardware-triggering of the CH101 for applications requiring multiple transceivers. Program files can also be tailored to the customer’s application. Contact Chirp for more information.CH101 has several features that allow for low power operation. An ultra-low-power, on-chip real-time clock (RTC) sets the sample rate and provides the reference for the time-of-flight measurement. The host processor does not need to provide any stimulus to the CH101 during normal operation, allowing the host processor to be shut down into its lowest power mode until the CH101 generates a wake-up interrupt. There is also a general-purpose input/output (INT) pin that is optimized to be used as a system wake-up source. The interrupt pin can be configured to trigger on motion or proximity.APPLICATIONSCHIRP CH101 DRIVERChirp provides a compiler and microcontroller-independent C driver for the CH101 which greatly simplifies integration. The CH101 driver implements high-level control of one or more CH101s attached to one or more I2C ports on the host processor. The CH101 driver allows the user to program, configure, trigger, and readout data from the CH101 through use of C function calls without direct interaction with the CH101 I2C registers. The CH101 driver only requires the customer to implement an I/O layer which communicates with the host processor’s I2C hardware and GPIO hardware. Chirp highly recommends that all designs use the CH101 driver.OBJECT DETECTIONDetecting the presence of objects or people can be optimized via software, by setting the sensor’s full-scale range (FSR), and via hardware, using an acoustic housing to narrow or widen the sensor’s field-of-view. The former means that the user may set the maximum distance at which the sensor will detect an object. FSR values refer to the one-way distance to a detected object.In practice, the FSR setting controls the amount of time that the sensor spends in the listening (receiving) period during a measurement cycle. Therefore, the FSR setting affects the time required to complete a measurement. Longer full-scale range values will require more time for a measurement to complete.Ultrasonic signal processing using the CH101’s General Purpose Rangefinder (GPR) Firmware will detect echoes that bounce off the first target in the Field-of-View. The size, position, and material composition of the target will affect the maximum range at which the sensor can detect the target. Large targets, such as walls, are much easier to detect than smaller targets. Thus, the associated operating range for smaller targets will be shorter. The range to detect people will be affected by a variety of factors such as a person’s size, clothing, orientation to the sensor and the sensor’s field-of-view. In general, given these factors, people can be detected at a maximum distance of 0.7m from the CH101 sensor.For additional guidance on the detection of people/objects using the NEMA standard, AN-000214 Presence Detection Application Note discusses the analysis of presence detection using the Long-Range CH201 Ultrasonic sensor.INTERFACING TO THE CH101 ULTRASONIC SENSORThe CH101 communicates with a host processor over the 2-wire I2C protocol. The CH101 operates as an I2C slave and responds to commands issued by the I2C master.The CH101 contains two separate I2C interfaces, running on two separate slave addresses. The first is for loading firmware into the on-chip program memory, and the second is for in-application communication with the CH101. The 7-bit programming address is0x45, and the 7-bit application address default is 0x29. The application address can be reprogrammed to any valid 7-bit I2C address. The CH101 uses clock stretching to allow for enough time to respond to the I2C master. The CH101 clock stretches before the acknowledge (ACK) bit on both transmit and receive. For example, when the CH101 transmits, it will hold SCL low after it transmits the 8th bit from the current byte while it loads the next byte into its internal transmit buffer. When the next byte is ready, it releases the SCL line, reads the master’s ACK bit, and proceeds accordingly. When the CH101 is receiving, it holds the SCL line low after it receives the 8th bit in a byte. The CH101 then chooses whether to ACK or NACK depending on the received data and releases the SCL line.The figure below shows an overview of the I2C slave interface. In the diagram, ‘S’ indicates I2C start, ‘R/W’ is the read/write bit, ‘Sr’ is a repeated start, ‘A’ is acknowledge, and ‘P’ is the stop condition. Grey boxes indicate the I2C master actions; white boxes indicate the I2C slave actions.Figure 5. CH101 I2C Slave Interface DiagramDEVICE MODES OF OPERATION:FREE-RUNNING MODEIn the free-running measurement mode, the CH101 runs autonomously at a user specified sample rate. In this mode, the INT pin is configured as an output. The CH101 pulses the INT pin high when a new range sample is available. At this point, the host processor may read the sample data from the CH101 over the I2C interface.HARDWARE-TRIGGERED MODEIn the hardware triggered mode, the INT pin is used bi-directionally. The CH101 remains in an idle condition until triggered by pulsing the INT pin. The measurement will start with deterministic latency relative to the rising edge on INT. This mode is most useful for synchronizing several CH101 transceivers. The host controller can use the individual INT pins of several transceivers to coordinate the exact timing.CH101 BEAM PATTERNSThe acoustic Field of View is easily customizable for the CH101 and is achieved by adding an acoustic housing to the transceiver that is profiled to realize the desired beam pattern. Symmetric, asymmetric, and omnidirectional (180° FoV) beam patterns are realizable. An example beam pattern is shown in the Typical Operating Characteristics section of this document and several acoustic housing designs for various FoV’s are available from Chirp.LAYOUT RECOMMENDATIONS:RECOMMENDED PCB FOOTPRINTDimensions in mmFigure 6. Recommended PCB FootprintPCB REFLOW RECOMMENDATIONS:See App Note AN-000159, CH101 and CH201 Ultrasonic Transceiver Handling and Assembly Guidelines.USE OF LEVEL SHIFTERSWhile the use of autosense level shifters for all the digital I/O signal signals is acceptable, special handling of the INT line while using a level shifter is required to ensure proper resetting of this line. As the circuit stage is neither a push-pull nor open-drain configuration (see representative circuit below), it is recommended that level shifter with a manual direction control line be used. The TI SN74LVC2T45 Bus Transceiver is a recommended device for level shifting of the INT signal line.Figure 7. INT Line I/O Circuit StageTYPICAL OPERATING CIRCUITSFigure 8. Single Transceiver OperationFigure 9. Multi- Transceiver OperationORDERING INFORMATIONPART NUMBER DESIGNATIONFigure 10. Part Number DesignationThis datasheet specifies the following part numbersPART NUMBER OPERATION PACKAGE BODY QUANTITY PACKAGING CH101-00ABR Pulse-Echo 3.5 mm x 3.5 mm x 1.26 mmLGA-8L 1,000 7” Tape and ReelCH101-02ABR Pitch-Catch 3.5 mm x 3.5 mm x 1.26 mmLGA-8L 1,000 7” Tape and ReelTable 6. Part Number DesignationCH101-xxABxProduct FamilyProduct Variant Shipping CarrierR = Tape & Reel 00AB = Pulse-Echo Product Variant02AB = Pitch-Catch Product VariantCH101 = Ultrasonic ToF SensorPACKAGE MARKINGFigure 11. Package MarkingTAPE & REEL SPECIFICATIONFigure 12. Tape & Reel SpecificationSHIPPING LABELA Shipping Label will be attached to the reel, bag and box. The information provided on the label is as follows:•Device: This is the full part number•Lot Number: Chirp manufacturing lot number•Date Code: Date the lot was sealed in the moisture proof bag•Quantity: Number of components on the reel•2D Barcode: Contains Lot No., quantity and reel/bag/box numberDimensions in mmDEVICE: CH101-XXXXX-XLOT NO: XXXXXXXXDATE CODE: XXXXQTY: XXXXFigure 13. Shipping LabelREVISION HISTORY09/30/19 1.0 Initial Release10/22/19 1.1 Changed CH-101 to CH101. Updated figure 7 to current markings.07/17/20 1.2 Format Update. Incorporated “Maximum Ratings Table” and “Use of LevelShifters” section.This information furnished by Chirp Microsystems, Inc. (“Chirp Microsystems”) is believed to be accurate and reliable. However, no responsibility is assumed by Chirp Microsystems for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. Chirp Microsystems reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. Chirp Microsystems makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. Chirp Microsystems assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.Certain intellectual property owned by Chirp Microsystems and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of Chirp Microsystems. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. Chirp Microsystems sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.©2020 Chirp Microsystems. All rights reserved. Chirp Microsystems and the Chirp Microsystems logo are trademarks of Chirp Microsystems, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated.©2020 Chirp Microsystems. All rights reserved.。
Linux10.1寸WLX-101C(R)-SP2D产品规格书
10.1寸Linux平板1配置信息产品型号WLT-101C-SP2D、WLT-101R-SP2D基本参数【配置】:●处理器(CPU):四核Cortex®-A9 架构,最高主频1.4GHz●内存:1GB的DDR3●Flash:8GB的NandFlash显示屏●尺寸:10.1 inch(英寸)●分辨率:1280×800●宽温型,1600万色或24位真彩●LED背光:寿命>25000小时触摸屏可选电容/电阻触摸屏硬件接口●四路3线RS-232串口(COM1,COM2,COM3,COM4)(选配隔离)●两路RS-485接口(COM1、COM2),与RS-232的COM1、COM2复用。
(选配隔离)●一路带隔离的CAN总线接口(选配)●一路USB Device接口●两路USB Host接口,支持鼠标、键盘、U盘等设备●一路100M以太网络接口●一路SD/MMC接口,支持TF卡,SD小卡●一路3.5mm耳机输出接口●一路电源接口(DC12V~24V),工业电源方案,可靠性更高●一路WIFI接口(选配)●一路蓝牙接口(选配)操作系统Linux防护等级前面板IP65工作环境●工作条件:DC12V ~ 24V(推荐24V)●工作温度:-20~60℃保存温度:-20~80℃●工作湿度:10~90%RH产品规格●结构:塑料外壳●面板尺寸:275.00×181.00 (mm)●机柜开孔:266.00×171 .00 (mm)应用领域●工业控制,检测设备,仪器仪表,安全监控,医疗器械,智能终端等产品嵌入式高端应用●支持CAN方便客户构建现场总线网络软件支持●推荐使用QT Creator(QT C++)开发,可灵活使用其他软件●用户可方便设定开机界面●支持屏幕旋转(0°、90°、180°、270°)2接口定义1 (12)1 CANL接口2 CANH接口3 GND4 RS-232接口COM3-RX5 RS-232接口COM3-TX6 RS-232接口COM4-RX7 RS-232接口COM4-TX 8 RS-485接口COM2-485B9 RS-485接口COM2-485A 10 GND11 RS-485接口COM1-485B 12 RS-485接口COM1-485A1 2 3 4 5 6 1USB 从机接口(USB Device) 2 USB 主机接口(USB host)3 立体音频接口4 DB9 RS-232 COM1接口5 DB9 RS-232COM2接口6 100M 以太网接口2.1RS-232接口10.1寸Linux单板电脑有四路串口,支持最高波特率115200bps。
SD101A_07中文资料
SD101A/101B/101CDocument Number 85629Rev. 1.5, 01-Mar-07Vishay Semiconductors194 9367Small Signal Schottky DiodesFeatures•Integrated protection ring against static discharge•Low capacitance•Low leakage current•Low forward voltage drop •Lead (Pb)-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECApplications•HF-Detector •Protection circuit•Diode for low currents with a low supply voltage •Small battery charger •Power supplies•DC/DC converter for notebooksMechanical DataCase: DO35 Glass case Weight: approx. 125 mg Cathode Band Color: black Packaging Codes/Options:TR/10 k per 13" reel (52 mm tape), 50 k/boxTAP/10 k per Ammopack (52 mm tape), 50 k/boxParts TableAbsolute Maximum RatingsT amb = 25°C, unless otherwise specified1) Valid provided that electrodes are kept at ambient temperature.Thermal CharacteristicsT amb = 25°C, unless otherwise specified1) Valid provided that electrodes are kept at ambient temperature.Part T ype differentiationOrdering codeT ype Marking RemarksSD101A V R = 60 V, V F max. 410 mV at I F = 1 mA SD101A-TR or SD101A-T AP SD101A T ape and Reel/Ammopack SD101B V R = 50 V, V F max. 400 mV at I F = 1 mASD101B-TR or SD101B-T APSD101B T ape and Reel/Ammopack SD101CV R = 40 V, V F max. 390 mV at I F = 1 mA SD101C-TR or SD101C-TAPSD101CT ape and Reel/AmmopackParameterT est conditionPart Symbol Value Unit Reverse voltageSD101A V R 60V SD101B V R 50V SD101CV R 40V Forward continuous current I F 30mA Peak forward surge current t p = 10 µsI FSM 2A Repetitive peak forward current I FRM 150mA Power dissipationP tot3101)mWParameterT est conditionSymbol Value Unit Junction temperature T j 125°C Storage temperature rangeT stg - 65 to + 150°C Thermal resistance junction to ambient airR thJA3201)K/W 2Document Number 85629Rev. 1.5, 01-Mar-07SD101A/101B/101CVishay SemiconductorsElectrical CharacteristicsT amb = 25°C, unless otherwise specifiedTypical CharacteristicsT amb = 25°C, unless otherwise specifiedParameterTest conditionPart Symbol Min Typ.MaxUnit Reverse Breakdown VoltageI R = 10 µASD101A V (BR)60V SD101B V (BR)50V SD101CV (BR)40V Leakage currentV R = 50 V SD101A I R 200nA V R = 40 V SD101B I R 200nA V R = 30 VSD101C I R 200nA Forward voltage dropI F = 1 mASD101A V F 410mV SD101B V F 400mV SD101CV F 390mV I F = 15 mASD101A V F 1000mV SD101B V F 950mV SD101CV F 900mV Diode capacitanceV R = 0 V , f = 1 MHz SD101A C D 2.0pF SD101B C D 2.1pF V R = 0 V , f = 1 MHzSD101CC D2.2pFFigure 1. Reverse Current vs. Reverse Voltage I R = R e v e r s e C u r r e n t (µA)0.010.11101000101520253035404550V R - Re v erse V oltage (V )162045Figure 2. Diode Capacitance vs. Reverse Voltage0.00.20.40.60.81.01.21.41.61.82.0101520253035404550V R - Re v erse V oltage (V )16205C D - D i o d e C a p a c i t a n c e (p F )5SD101A/101B/101CDocument Number 85629Rev. 1.5, 01-Mar-07Vishay Semiconductors3Package Dimensions in millimeters (inches): DO35Figure3. Forward Current vs. Forward Voltage0.010.101.0010.000.00.10.20.30.40.50.60.70.80.9 1.0I F - F o r w a r d C u r r e n t (m A )V F - For w ard V oltage (V )16206 4Document Number 85629Rev. 1.5, 01-Mar-07SD101A/101B/101CVishay SemiconductorsOzone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendmentsrespectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDocument Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。
世界各国和地区英文简写
世界各国和地区英文简写世界各国和地区英文简写序号缩写中文英文1 AE 阿联酋 United Arab Emirates2 AF 阿富汗 Afghanistan3 AL 阿尔巴尼亚 Albania4 AO 安哥拉 Angola5 AR 阿根廷 Argentina6 AT 奥地利 Austria7 AU 澳大利亚 Australia8 AZ 亚塞拜然 Azerbaijan9 BD 孟加拉 Bangladesh10 BE 比利时 Belgium11 BG 保加利亚 Bulgaria12 BH 巴林 Bahrain13 BI 蒲隆地 Burundi14 BJ 贝南 Benin15 BM 百慕大 Bermuda16 BN 汶莱 Brunei17 BO 玻利维亚 Bolivia18 BR 巴西 Brazil19 BS 巴哈马 Bahamas20 BT 不丹 Bhutan21 BW 波札那 Botswana22 CA 加拿大 Canada23 CF 中非共和国 Central Africa24 CG 刚果 Congo25 CH 瑞士 Switzerland26 CK 库克群岛 Cook Is.27 CL 智利 Chile28 CM 喀麦隆 Cameroon29 CN 中国 China30 CO 哥伦比亚 Colombia31 CR 哥斯大黎加 Costa Rica32 CU 古巴 Cuba33 CV 维德角群岛 Cape Verde Is.34 CY 塞普勒斯 Cyprus35 CZ 捷克共和国 Czech36 DE 德国 Germany37 DK 丹麦 Denmark38 DZ 阿尔及利亚 Algeria39 EC 厄瓜多 Ecuador40 EE 爱沙尼亚 Estonia41 EG 埃及 Egypt42 ES 西班牙 Spain43 ET 衣索比亚 Ethiopia44 FI 芬兰 Finland45 FJ 斐济 Fiji46 FR 法国 France47 GA 加彭 Gabon48 GB 英国 Great Britain49 GD 格瑞那达 Grenada50 GH 迦纳 Ghana51 GM 甘比亚 Gambia52 GN 几内亚 Guinea-Bissau53 GQ 赤道几内亚 Equatorial Guinea54 GR 希腊 Greece55 GT 瓜地马拉 Guatemala56 GU 关岛 Guam57 GY 盖亚那 Guyana58 HK 香港 Hong kong59 HN 宏都拉斯 Honduras60 HR 克罗埃西亚 Croatia61 HT 海地 Haiti62 HU 匈牙利 Hungary63 ID 印度尼西亚 Indonesia64 IE 爱尔兰 Ireland65 IL 以色列 Israel66 IN 印度 India67 IQ 伊拉克 Iraq68 IR 伊朗 Iran69 IS 冰岛 Iceland70 IT 义大利 Italy71 JM 牙买加 Jamaica72 JO 约旦 Jordan73 JP 日本 Japan74 KE 肯亚 Kenya75 KH 柬埔寨 Cambodia76 KP 韩国 R.O.Korea77 KR 北朝鲜 D.P.R.Korea78 KW 科威特 Kuwait79 KZ 哈萨克 Kazakhstan80 LA 寮国 Laos81 LB 黎巴嫩 Lebanon82 LT 立陶宛 Lithuania83 LU 卢森堡 Luxembourg84 LV 拉托维亚 Latvia85 LY 利比亚 Libya86 MA 摩洛哥 Moroo87 MC 摩纳哥 Monaco88 MD 摩尔多瓦 Moldova89 MG 马达加斯加 Madagascar90 ML 马里 Mali91 MN 蒙古 Mongolia92 MO 澳门 Macao93 MR 茅利塔尼亚 Mauritania94 MT 马耳他 Malta95 MU 模里西斯 Mauritius96 MV 马尔地夫 Maldives97 MX 墨西哥 Mexico98 MY 马来西亚 Malaysia99 MZ 莫三比克 Mozambique100 NA 奈米比亚 Namibia101 NE 尼日 Niger102 NG 奈及利亚 Nigeria103 NI 尼加拉瓜 Nicaragua104 NL 荷兰 Netherlands105 NO 挪威 Norway106 NP 尼泊尔 Nepal107 NZ 纽西兰 New Zealand108 OM 阿曼 Oman109 PA 巴拿马 Panama110 PE 祕鲁 Peru111 PG 巴布亚纽几内亚 Papua New Guinea 112 PH 菲律宾 Philippines113 PK 巴基斯坦 Pakistan114 PL 波兰 Poland115 PT 葡萄牙 Portugal116 PY 巴拉圭 Paraguay117 QA 卡达 Qatar118 RO 罗马尼亚 Romania119 RU 俄罗斯 Russia120 RW 卢安达 Rwanda121 SA 沙乌地阿拉伯 Saudi Arabia 122 SD 苏丹 Sudan123 SE 瑞典 Sweden124 SG 新加坡 Singapore125 SK 斯洛伐克 Slovakia126 SM 圣马利诺 San Marino 127 SN 塞内加尔 Senegal128 SO 索马利亚 Somalia129 SY 叙利亚 Syria130 TH 泰国 Thailand131 TJ 塔吉克 Tadzhikistan132 TM 土库曼 Turkmenistan 133 TN 突尼西亚 Tunisia134 TO 汤加 Tonga135 TW 台湾 Taiwan136 TZ 坦尚尼亚 Tanzania137 UA 乌克兰 Ukraine138 UG 乌干达 Uganda139 UK 英国 United Kingdom 140 US 美国 United States141 UY 乌拉圭 Uruguay142 UZ 乌兹别克 Uzbekistan143 VA 梵蒂冈 Vatican City144 VE 委内瑞拉 Venezuela145 VN 越南 Viet Nam146 YE 叶门 Yemen147 YU 南斯拉夫 Yugoslavia148 ZA 南非 South Africa149 ZM 尚比亚 Zambia150 ZR 扎伊尔 Zaire151 ZW 辛巴威 Zimbabwe世界各国英文简称阿尔巴尼亚Albania Lek ALL阿尔及利亚第纳尔 DZD安道尔法郎 FRF亚美尼亚 AMD安第列斯群岛盾 ANG安哥拉 AON阿根廷比索 ARP奥地利先令 ATS澳大利亚元 AUD安圭拉东加勒比海元 XCD阿鲁巴岛弗罗林 AWF安地卡及巴布达岛东加勒比海元 XCD亚塞拜然 AZM波斯尼亚和黑塞哥维那 BAK巴贝多元 BBD比利时法郎 BEF保加利亚列弗 BGL蒲隆地法郎 BIF巴哈马群岛元 BSD汶莱元 BND玻利维亚 BOB巴西 BRL不丹卢比 BTR波札那 BWP宏都拉斯元 BZD 加拿大元 CAD贝南法郎 XAF刚果法郎 CDF瑞士法郎 CHF智利比索 CLP中国人民币 CNY 哥伦比亚比索 COP 哥斯大黎加 CRC 捷克克郎 CZK古巴比索 CUP维德角 CVE塞普路斯镑 CYP 英镑 GBP德国马克 DEM丹麦克郎 DKK多美尼加比索 DOP 布吉纳法索 XAF 厄瓜多 ECS缅甸元 MMK爱沙尼亚 EEK埃及镑 EGP厄利垂亚 ERN西班牙彼萨塔 ESP 柬埔寨 KHR衣索比亚 ETB喀麦隆 XAF欧元 EUR芬兰 FIM斐济元 FJD法国法郎 FRF中非共和国 XAF 查德 XAF乔治亚 GEL迦纳塞第 GHC直布罗陀 GIP甘比亚 GMD几内亚法郎 GNF 希腊 GRD瓜地马拉 GTQ盖亚那 GYD港币 HKD纽西兰元 NZD克罗埃西亚 HRK 海地 HTG匈牙利福林 HUF 印尼卢比 IDR爱尔兰 IEP以色列 ILS印度卢比 INR伊拉克第纳尔 IQD 伊朗里亚尔 IRR 冰岛克郎 ISK荷兰盾 NLG义大利里拉 ITL牙买加元 JMD约旦第纳尔 JOD 日圆 JPY肯亚先令 KES萨尔瓦多El SVC朝鲜 KPW赤道几内亚 XAF韩国 KRW衣索比亚 ETB科威特第纳尔 KWD 哈萨克 KZT寮国 LAK黎巴嫩镑 LBP斯里兰卡卢比 LKR 赖比瑞亚元 LRD赖索托 LSL立陶宛 LTL卢森堡法郎 LUF拉托维亚 LVL利比亚第纳尔 LYD 摩洛哥迪拉姆 MAD 摩尔多瓦 MDL马达加斯加 MGF 马其顿第纳尔 MKD 加彭 XAF甘比亚 GMD蒙古 MNT澳门 MOP茅利塔尼亚 MRO 马耳他 MTL模里西斯卢比 MUR 马尔地夫 MVR希腊德拉玛 GRD 墨西哥比索 MXP 格陵兰 DKK马来西亚 MYR莫三比克 MZM奈米比亚 NAD奈及利亚奈拉 NGN 尼加拉瓜 NIO瓜地马拉 GTQ挪威克郎 NOK几内亚 GNF尼泊尔卢比 NPR 纽西兰 NZD阿曼 OMR巴拿马 PAB祕鲁 PEN菲律宾比索 PHP 巴基斯坦卢比 PKR 波兰 PLZ巴拉圭 PYG卡达 QAR罗马尼亚 ROL俄罗斯卢布 RUR 卢安达法郎 RWF 沙乌地阿拉伯 SAR 苏丹 SDD瑞典克郎 SEK新加坡 SGD斯洛维尼亚 SIT斯洛伐克 SKK塞拉里昂 SLL约旦 JOD索马利亚 SOS叙利亚 SYP史瓦济兰 SZL泰铢 THB塔吉克 TJR土库曼 TMM突尼西亚 TND拉托维亚 LVL汤加 TOP土耳其 TRL台湾 TWD坦尚尼亚 TZS乌克兰 UAH乌干达 UGX乌拉圭 UYU美圆 USD乌兹别克 UZS委内瑞拉 VEB越南 VND万那杜 VUV叶门 YER南斯拉夫 YUN世界各国家英文简称中国 china谁能给我世界各国和地区的英文名AF Afghanistan 阿富汗AL Albania 阿尔巴尼亚AD Andorra 安道尔AO Angola 安哥拉AI Angola 安圭拉AQ Antarctica 南极洲AG Ntigua and Barbuda 安地卡及巴布达AR Argentina 阿根廷AM Armenia 亚美尼亚AW Aruba 阿鲁巴AU Australia 澳大利亚AT Austria 奥地利AZ Azerbaijan 亚塞拜然AN Netherlands AntillesAE United Arab Emirates 阿联酋BS Bahamas 巴哈马BH Bahrain 巴林BD Bangladesh 孟加拉BB Barbados 巴贝多BY White Russia 白俄罗斯BZ Belize 贝里斯BE Belgium 比利时BJ Benin 贝南BM Bermuda 百慕大BT Bhutan 不丹BO Bolivia 玻利维亚BA Bosnia Hercegovina 波黑BW Botswana 波札那BV Bouvet Island 布维岛BR Brazil 巴西BN Brunei Darussalam 汶莱BG Bulgaria 保加利亚BF Burkina Faso 布其纳法索BI Burundi 蒲隆地BY Byelorussian SSR 白俄罗斯CM Cameroon 喀麦隆CA Canada 加拿大CV Cape Verde,Republic of 维德角CF The Central African Republic 中非共和国CL Chile 智利CN China 中国CX Christmas Island 圣诞岛CC COCOS Islands 可可岛CO Colombia 哥伦比亚CH Switzerland 瑞士CG Congo 刚果CK Cook Island 库克群岛CR Costa rica 哥斯大黎加CI Lvory Coast 象牙海岸CU Cuba 古巴CY Cyprus 塞普勒斯CZ Czech Republic 捷克共和国DK Denmark 丹麦DJ Djibouti 吉布提DM Gominica 多明哥DE Grmany 德国DO Dominica 多明尼加DZ Algeria 阿尔及利亚EC Ecuador 厄瓜多EC Ecuador 厄瓜多EG Egypt 埃及EH West Sahara 西撒哈拉ES Spain 西班牙EE Estonia 爱沙尼亚ET Ethiopia 衣索比亚FJ Fiji 斐济FK Falkland Islands 福克兰群岛FO Faroe IslandsFI Finland 芬兰FR France 法国FM Micronesia 密克罗尼西亚GA Gabon 加彭GQ Equatorial Guinea 赤道几内亚GF French Guiana 法属盖亚那GM Gambia 甘比亚GE Geia 乔治亚GH Ghana 迦纳GI Gibraltar 直布罗陀GR Greece 希腊GL Greenland 格陵兰GB United Kingdom 英国GD Grenada 格瑞那达GP Guadeloupe 瓜德罗普GU Guam 关岛GT Guatemala 瓜地马拉GN Guinea 几内亚GW Guinea-Bissau 几内亚比索GY Guyana 盖亚那HR Croatia 克罗埃西亚HT Haiti 海地HM Heard and McDonald Islands HN Honduras 宏都拉斯HK Hong Kong 中国香港HU Hungary 匈牙利IS Iceland 冰岛IN India 印度ID Indonesia 印度尼西亚IR Iran 伊朗IQ Iraq 伊拉克IO British Indian Ocean Territory 英联邦的印度洋领域IE Ireland 爱尔兰IL Israel 以色列IT Italy 义大利JM Jamaica 牙买加JP Japan 日本JO Jordan 约旦KZ Kazakstan 哈萨克KE Kenya 肯亚KI Kiribati 吉里巴斯KP North Korea 朝鲜KR Korea 韩国KH Cambodia 柬埔寨KM Comoros 葛摩KW kuwait 科威特KG Kyrgyzstan 吉尔吉斯斯坦KY Cayman Islands 开曼群岛KN St. Kitts and NevisLA Laos 寮国LK Sri Lanka 斯里兰卡LV Latvia 拉托维亚LB Lebanon 黎巴嫩LS Lesotho 赖索托LR Liberia 赖比瑞亚LY Libya 利比亚LI Liechtenstein 列支敦斯登LT Lithuania 立陶宛LU Luxembourg 卢森堡LC St. Lucia 圣露西亚MO Macao 中国澳门MG Malagasy 马达加斯加MW Malawi 马拉维MY Malaysia 马来西亚MV Maldives 马尔地夫ML Mali 马里MT Malta 马尔他MH Marshall Islands 马绍尔群岛MQ MauritaniaMR Mauritania 茅利塔尼亚MU Mauritius 模里西斯MX Mexico 墨西哥MD Moldova,Republic of 摩尔多瓦MC Monaco 摩纳哥MN Mongolia 蒙古MS MontserratMA Moroo 摩洛哥MZ Mozambique 莫三比克MM Burma 缅甸MP Northern Nariana Islands NA Namibia 奈米比亚NR Naura 诺鲁NP Nepal 尼泊尔NL Netherlands 荷兰NT Neutral ZoneNC New Caledonia 新喀里多尼亚NZ New Zealand 纽西兰NI Nicaragua 尼加拉瓜NE Niger 尼日NG Nigeria 奈及利亚NU Niue 纽埃NF Norfolk IslandNO Norway 挪威OM Oman 阿曼PK Pakistan 巴基斯坦PF French Polynesia 法属玻里尼西亚PW Palau 帛琉PA Panama 巴拿马PG Papua,Territory of 巴布亚纽几内亚PY Paraguay 巴拉圭PE Peru 祕鲁PH Philippines 菲律宾PN Pitcairn Islands 皮特开恩群岛PL Poland 波兰PT Portugal 葡萄牙PR Puerto Rico 波多黎各(美)PM St.Pierre and MiquelonQA Qatar 卡达RE Reunion IslandRO Romania 罗马尼亚RU Russia 俄罗斯联邦RW Rwanda 卢安达SV El Salvador 萨尔瓦多SH St.Helena 圣赫勒那SM San Marino 圣马利诺ST Sao Tome and Principe 圣多美与普林西比SA Saudi Arabia 沙乌地阿拉伯SN Senegal 塞内加尔SC Seychelles 塞席尔SL Sierra leone 狮子山SG Singapore 新加坡SK Slovakia 斯洛伐克SI Slovene 斯洛维尼亚SB Solomon Islands 索罗门群岛SO Somali 索马利亚SD Sudan 苏丹SR Surinam 苏利南SJ Svalbard and Jan Mayen IslandsSZ Swaziland 史瓦济兰SE Sweden 瑞典SY Syria 叙利亚SU USSR(formerly) 苏联(前)TD Chad 查德TF French Southern Territoties 法属南方领土TW Taiwan 中国台湾TJ Tsjikistan 塔吉克TZ Tanzania 坦尚尼亚TH Thailand 泰国TG Togo 多哥TK Tokela 托克劳TO Tonga 汤加TT Trinidad and T obago 千里达及托巴哥TN Tunisia 突尼西亚TR Turkey 土尔其TP East Timor 东帝TM Turkomanstan 土库曼TC Turks and Caicos IslandsTV Tuvalu 吐瓦鲁UG Uganda 乌干达UA Ukiain 乌克兰UK England 英国(正式程式码为GB)US America 美国UM 美国边远小岛UY uruguay 乌拉圭UZ Uzbekstan 乌兹别克VA Vatican 梵蒂冈(罗马教庭)VE Venezuela 委内瑞拉VN Vietnam 越南VG Virgin Islands(British) 不列颠岛(英) VI Vigin Islands(U.S.) 不列颠岛(美)VC St. Vincent and the GrenadinesWS Western Samoa 西萨摩亚WF Wallis and Furtuna IslandsYE Yemen 叶门YU Yugoslavia 南斯拉夫ZA South Africa 南非ZR Zaire 扎伊尔ZM Zambia 尚比亚ZW Zimbabwe 辛巴威急求世界各国国名的英文(三个字母)简写?CHN, AUS, CAN, FRA,GB,RUS世界舞台的英文,和英文简写world arenaWA求世界各国(地区)国花亚洲中国--国花蕙芷、牡丹(未定)台湾--区花梅花香港--区花紫荆花澳门--区花莲花朝鲜--国花朝鲜杜鹃(金达莱)韩国--国花木槿日本--国花樱花、菊花寮国--国花鸡蛋花缅甸--国花龙船花泰国--国花素馨、睡莲马来西亚--国花扶桑印度尼西亚--国花毛茉莉新加坡--国花万带兰菲律宾--国花毛茉莉印度--国花荷花、菩提树尼泊尔--国花杜鹃花不丹--国花蓝花绿绒蒿孟加拉--国花睡莲斯里兰卡--国花睡莲阿富汗--国花郁金香巴基斯坦--国花素馨伊朗--国花大马士革月季伊拉克--国花月季(红)阿拉伯联合大公国--国花孔雀、百日草叶门--国花咖啡叙利亚--国花月季黎巴嫩--国花雪松以色列国--国花银莲花、油橄榄土耳其--国花郁金香欧洲挪威--国花欧石楠瑞典--国花欧洲白蜡芬兰--国花铃兰丹麦--国花冬青冰岛--国花三色堇俄罗斯--国花向日葵波兰--国花三色堇捷克--椴树斯洛伐克--国花石竹、玫瑰德国--国花矢车菊塞尔维亚--国花桃花克罗埃西亚--国花天竺葵马其顿--国花矢车菊匈牙利--国花郁金香罗马尼亚--国花狗蔷薇保加利亚--国花玫瑰、突厥蔷薇英国--国花玫瑰爱尔兰--国花白车轴草法国--国花鸢尾荷兰--国花郁金香比利时--国花虞美人、杜鹃花卢森堡--国花月季摩纳哥--国花石竹西班牙--国花香石竹葡萄牙--国花雁来红、薰衣草瑞士--国花火绒草奥地利--国花火绒草义大利--国花雏菊、月季圣马利诺--国花仙客来马耳他--国花矢车菊希腊--国花油橄榄、老鼠?北美洲加拿大--国花糖槭美国--国花玫瑰墨西哥--国花大丽花、仙人掌瓜地马拉--国花爪哇木棉萨尔瓦多--国花丝兰宏都拉斯--国花香石竹尼加拉瓜--国花百合(姜黄色)哥斯大黎加--国花卡特兰古巴--国花姜花、百合牙买加--国花愈疮木海地--国花刺葵多明尼加共和国--国花桃花心木南美洲哥伦比亚--国花卡特兰、咖啡厄瓜多--国花白兰花祕鲁--国花金鸡纳树、向日葵玻利维亚--国花向日葵巴西--国花卡特兰、毛蟹爪莲智利--国花野百合阿根延--国花刺桐乌拉圭--国花商陆、山楂大洋洲澳大利亚--国花金合欢、桉树纽西兰--国花桫椤、四翅槐斐济--国花扶桑非洲埃及--国花睡莲利比亚--国花石榴突尼西亚--国花素馨阿尔及利亚--国花夹竹桃、鸢尾摩洛哥--国花月季、香石竹塞内加尔--国花猴面包树赖比瑞亚--国花胡椒迦纳--国花海枣苏丹--国花扶桑坦尚尼亚--国花丁香、月季加彭--国花火焰树尚比亚--国花叶子花马达加斯加--国花凤凰木、旅人蕉塞席尔--国花凤尾兰辛巴威--国花嘉兰,梅花也是国花之一。
GSe+1016+控标参数
•减少云存储服务的占用空间
-重复数据删除
- 数据压缩
•云存储设备加密传输
- AES-256 Encryption
- Secure Sockets Layer (SSL)
兼容的云服务
可实时监控每个控制器的整体性能,可实时监控每颗磁盘的性能数值以及延迟时间,可实时监控存储系统的缓存使用率,可对历史性能数据进行分析。
访问权限管理
本地用户/组管理,支持建立不同级别用户,支持用户审计管理。
支持 Windows AD/LDAP
支持 Windows ACL
云存储数据服务(不能以增加硬件设备的方式实现)
•Amazon S3 / Glacier
•Microsoft Azure
•Google Cloud Platform
•AlibabaAliCloud
•OpenStack
技术支持服务
提供三年硬件、软件保固服务,免费更换故障部件;
提供免费电话,网络和邮件支持服务
2.5寸SAS-300GB/600GB/900GB/1.2TB/1.8TB 15K
3.5寸NL-SAS/2TB/3TB/4TB/6TB/8TB 7.2K
3.5寸SATA-1TB/2TB/3TB/4TB/6TB/8TB 7.2K
实际最大可用不少于436颗硬盘;
扩展柜单柜支持≥60盘位;
支持硬盘混插;
未来磁盘阵列扩充容量,不得额外收取许可费用.
配置自动精简功能,包含Thin Provisioning,full Provisioning两种模式.
支持自动分级存储功能,根据数据使用热度自动将数据存放在本地不同类型硬盘中,不少于4级分层(SSD\SAS\NL-SAS\SATA).
速芯微电子产品说明书
免责声明:本文所述方法、方案均供客户参考,用于提示或者展示芯片应用的一种或者多种方式,不作为最终产品的实际方案。
文中所描述的功能和性能指标在实验室环境下测试得到,部分可以提供第三方测试报告,但是不保证客户产品上能获得相同的数据。
本文信息只作为芯片使用的产品手册无锡速芯微电子有限公司FastSOC Microelectronics Co.,Ltd.2022年顾工微信号速芯微公众号销售联系方式:联系人:顾先生手机:180****3071邮箱:***************网址:地址:无锡市新吴区菱湖大道200号中国物联网国际创新园E-503室FS512支持PD3.0协议,支持DRP 、SOURCE 、SINK 三种角色可选,支持外部MCU 进行I2C 程控配置,也可以独立控制外部电源芯片。
FS512的PDO 可以通过寄存器灵活设置。
FS512可以通过FB 直接控制外部电源芯片的输出电压。
在功耗敏感的应用,芯片可以进入低功耗模式。
芯片采用SSOP10封装,焊接装配简单。
FS8611X 可以自动将QC 协议转换为PD 协议,而无需额外的功率电路。
适合搭配目前的存量TYPE-A 口快充充电器,将其改装为PD 充电器。
FS8611X 可以适配从5W~100W 的各种功率充电器。
FS8611X 采用高耐压设计。
FS8611X 支持PDO 外部引脚设置,备货灵活。
芯片采用SSOP10封装,焊接装配简单。
VIN 123459876NAFUNC1DP DMFUNC2NAVSS FS8611X CC1CC210VBUSGNDDPDM VBUS CC2CC1DP DMGNDR1R2Type-CUSB-AGND47K MCUPOWER SYSTEMPMOSVBUS CC2CC1DP DMGND100K%24k7.5KCURRENT新品快览FS512:储能设备新生力FS8611X :A 转C 的桥梁GND65W-2C1A 智能分配功率VIN 526431987VSS FBQC_EN PLUG_INCSN-CSP+DM DPGATE FS116D 10PB552186734VIN VSSPB2PB3PB4PB0PB1ZT220215VIN 193827645C_GATEFB SCL SDACC1CC2VSS FS8611S DMDP 10VBUS CC2CC1DP DMGNDVBUS CC2CC1DP DMGNDVBUS DP DMGND47KVIN 193827645C_GATEFB SCL SDACC1CC2VSS FS8611S DMDP 1047K0.47uF0.47uFBUCK 电源系统VINVOUTFB GNDBUCK 电源系统VINVOUTFB GNDBUCK 电源系统VINVOUTFB GNDHT7133VIN3.3VGND接3.3V接3.3V10uF 1uF10uF47K0.47uF接3.3V10nFRadj220R 10m Ω3.3V接电源系统GND GNDGNDFS8611S:自带I2C ,PDO 编写灵活FS116D:A 口18W 全协议,带插入指示单口 C1/C2=65W;A=18W A+C C1/C2=45W,A=18WC+CC1=20V;C1=45W,C2=20W C2=20V;C1=20W,C2=45WC1<20V 且C2<20V;C1=30W,C2=30W C+C+AC1=20V;C1=45W,C2=7.5W,A=7.5W C2=20V;C1=7.5W,C2=45W,A=7.5WC1<20V 且C2<20V;C1=20W,C2=20W,A=18W功率分配表FS8611SX2+FS116D+MCU 典型应用原理图应用实例图FS512典型应用原理图FS512应用实例图FS8611X 典型应用原理图FS8611X 应用实例图Type-C169834572VIN VSSFB SCL SDA GATE DMDP CC1CC2FS51210PMOSType-CPMOSPMOSType-C USB-A应用实例图典型应用原理图速芯微USB 快充协议触发诱骗芯片主要用于受电端。
密码常识及例题
【密码常识】字母表顺序-数字加密的时候,经常要把A~Z这26个字母转换成数字,最常见的一种方法就是取字母表中的数字序号。
A代表1,B代表2,C代表3...字母 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z数字 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26进制转换密码例如二进制:1110 10101 1101 10 101 10010 1111 1110 101转为十进制:14 21 13 2 5 18 15 14 5对应字母表:numberMod算法我们可以对字母序号进行数学运算,然后把所得的结果作为密文。
当运算结果大于26或小于1的时候,我们希望把这个数值转为1~26的范围,那么取这个数除以26的余数即可。
Mod就是求余数的运算符,有时也用“%”表示。
例如 29 Mod 26 = 3,或写成 29 % 26 = 3,意思是29除以26的余数是3。
倒序加密时为经常要对字符进行倒序处理。
如果让你按abcdef...的顺序背出字母表的每个字母会很容易,但是如果是zyxwvu...的顺序那就很难背出来了。
一个很熟悉的单词,如果按相反的顺序拼写,可能就会感到很陌生。
例如“love”字母倒过来拼就是“evol”。
具体加密时倒序有很多种方案,需要灵活运用。
例如:每个单词的倒序:siht si a tset - this is a test整句的倒序:tset a si siht - this is a test数字的倒序:02 50 91 02 - 20 05 19 20(test)间隔单词之间的间隔一般使用空格。
在加密时常常要去掉空格,但有时某些字母或数字来替代空格也不失为一种好的加密方案。
错误空格位置也会起到很强的误导作用。
例如:t hi sis at est - this is a test字母频率频率分析法可以有效的破解单字母替换密码。
富士达电梯故障代码
在安装富士达电梯时动慢车有时会发生故障造成电梯慢车不运行1、电机不得电——#36不吸合--#1E -—未吸合造成2、电机得电但不开闸-—抱闸检测回路断开-—故障6 系3、电机得电但开闸不走——抱闸检测回路不断开-- 故障6 系4、电梯在机房可以走慢车在轿顶不运行-—防撞头开工未封、轿顶通讯不良呼叫记录开始:按动上按钮,同时将EQDO 开关切到ON ,然后放开.实行:按动上按钮,上面的一层(按住2 秒以上,顶层)即被预约。
按动下按钮,下面的一层(按住2 秒以上,底层)即被预约。
按住中按钮,以上被预约的楼层即被记录下来。
保持按住中按钮,门将被关闭。
结束:将EQDO 开关切到OFF .安装运行开始:将轿顶、轿内的自动/ 手动开关均切换到自动位。
按住下按钮,同时将EQDO 开关切到ON ,然后放开按钮。
运转:按动上按钮,轿厢慢车向上。
按动下按钮,轿厢慢车向下。
结束:将EQDO 开关切到OFF 。
楼层选择器的错开开始:按住上按钮,同时将EQDO 开关切到ON ,然后放开按钮实行:按动上按钮,上面的一层(按住2 秒以上,顶层)即被预约。
按动下按钮,下面的一层(按住2 秒以上,底层)即被预约。
按住中按钮,以上被预约的楼层上的选择器即错开。
结束:将EQDO 开关切到OFF在“呼叫记录”,“楼层选择器的错开”的实行过程中,所记录的呼叫楼层和选择器错开的楼层将会在LED 的bit0~bit7 上以2 进制数显示出来.(操作开始之初显示的是当时轿厢所处的楼层)bit 7 □□□□□□□□□□□□bit 6 □□□□□□□□□□□□bit 5 □□□□□□□□□□□□bit 4 □□□□□□□□□□□□bit 3 □□□□□□□■■■■■bit 2 □□□■■■■□□□□■bit 1 □■■□□■■□□■■□bit 0 ■□■□■□■□■□■□表示-—1——2——3--4--5—-6--7—-8-—9-—10-11—12 ……平常表示【SEL=0 数据=0 】时LED 的显示灯亮高速闪动低速闪动熄灭Bit7有项目代码—-————无项目代码Bit6地震时管制运行火灾时,自备电,漏水时的管制停车运转平常Bit5与IF61 ,IF66 通信断开——-——-与IF61 ,IF66 通信正常Bit4与SV ,其它号机通信断开与SV ( MAIN )通信断开-—-与SV ,其它号机通信正常Bit3与COB/ 候梯厅电脑通信断开———*6与COB/ 候梯厅电脑通信正常Bit2启动禁止高速运转禁止高速运转可能Bit1门关闭完成位置门中间位置---门打开完成位置Bit0门区内——-—-—富士达电梯控制屏操作方法E411中文翻译( 故障灯)1.DZ或ADZ 与MCSS的命令状态不一致2。
脱硫系统中英文对照表
48
石灰石制备
LS-PR
49
排水坑
DRN PIT
50
自引罐
self priming
SEF
51
自引灌
self priming
SEF
52
搅拌器电机
AGR
53
低泄露风机电机
L-LK FAN
54
取样系统
SAMPLING SYSTEM
SM-S
55
事故浆液箱
EM SL TK
56
事故浆液
EM SL
57
氧化空气
180
传感器
transmitter
TSMR
181
油站
OIL ST
182
备用泵
STANDBY PUMP
S-PU
183
电加热器
HTR
184
加热器
HTR
185
超温报警
T-ALM
186
吹灰器
SO-BLWR
187
推进状态
ENGED
188
退出状态
EXTACED
189
推进指令
ENGE
190
退出指令
EXTAC
191
S-C-P
16
循环泵
Circular Pump
C-P
17
石膏旋流器
Gypsum cyclone[ˈsaikləun]
G-C
18
就地操作位置
LOC
19
密封空气
SEAL AIR
SL-A
20
补给水流量调节
M-U-W FL
21
润滑油流量低
LU-OIL F L
SD101中文资料
0 0 10 20 30 40 50 VR, REVERSE VOLTAGE (V) Fig. 2 Typ. Junction Capacitance vs Reverse Voltage
DS11008 Rev. I-2
2 of 2
SD101A - SD101C
元器件交易网
SD101A - SD101C
SCHOTTKY BARRIER DIODE Features
· · · · Low Forward Voltage Drop Guard Ring Construction for Transient Protection Low Reverse Recovery Time Low Reverse Capacitance
A
B
A
D
C
Mechanical Data
· · · · · Case: DO-35, Plastic Leads: Solderable per MIL-STD-202, Method 208 Marking: Type Number Polarity: Cathode Band Weight: 0.13 grams (approx.)
DO-35 Dim A B C D Min 25.40 ¾ ¾ ¾ Max ¾ 4.00 0.60 2.00
All Dimensions in mm
Maximum Ratings
@ TA = 25°C unless otherwise specified Symbol VRRM VRWM VR VR(RMS) IFM @ t £ 1.0s @ t = 10ms IFSM Pd RqJA Tj, TSTG SD101A 60 42 SD101B 50 35 15 50 2.0 400 375 -65 to +175 SD101C 40 28 Unit V V mA mA A mW K/W °C
EVACTRON SD系列疏散装置安装手册说明书
EVACTRONSD Series Evacuation UnitsInstallation Manual ver3.2Models SD20-120The EVACTRON SD series amplifier units are a new range of Building Occupant Warning System (BOWS) which provide Automatic and Manual control of Alert and Evacuation tones.The SD series units are available in a variety of sizes- 20, 40, 60,120 and 250 watt.NEW KEY FEATURES INCLUDE∙High efficiency, class D amplifiers.∙Removable SD Card with voice-over messages for Alert and Evacuation tones.∙ A library of messages and tones easily changed to suit individual customer’s requirements.∙ 4 x Inputs to play custom tones and messages e.g. school bell, lock-down, chemical alarm etc ∙Test and False Alarm messages using on-board push buttons.∙ 2 wire Monitored Strobe Output, up to 3amps to directly drive strobe indicators.∙Local microphone connection including a socket for a plug-in mic using EVACTRON MIC-SD.∙Local microphone output, for simple looping of microphone, no balancing transformers required.∙Balanced AUX input for paging/music with 3.5mm socket for speaker testing with IPOD etc.∙T.G. 1V audio output with RCA connection to drive additional slave amplifiers if required.∙All models have plug-in terminal connectors.∙Test Tone for 100V speaker output calibration.OTHER FEATURES INCLUDED∙22-30vdc power input with reverse-polarity protection.∙Onboard LED indication for fault and function status.∙ALERT and EVACUATE tones (Evac ISO T3-default or Evac2220 selectable via DIP switch) ∙Alarm input with ALERT to EVAC change-over timer 0-8 minute.∙Chime feature available for both M1 and M2 if required, upon activation.∙Monitored 100v speaker output with open and short protection.∙Fault output contacts selectable N.O. or N.C. with remote common-fault input and output.∙Fault condition after 10 minutes if no action or left in ISOLATE.∙Connections for standard wired in 003 KEY SWITCH or SELECTOR SWITCH.∙IDC socket for connection to EVACTRON KEYPAD.∙LMU4 compatible. Multiple EVACTRON LMU4 cards can be connected.∙Easy access from above for all controls and connections.∙Supplied on powder coated base plate (same footprint mount for model SD20, 40, 60 &120) ∙19” 3U rack versions are available also in various wattages.TERMINAL CONNECTIONSTB1-1 COM Common 0vTB1-2 AUTO0v to activate.TB1-3 EVAC0v to activate.TB1-4 ALERT0v to activate.TB1-5 SD-C0v to activate. SD Card input, DSW1-3 ON = latched, OFF = un-latched (default)TB1-6 SD-D0v to activate. SD Card input, DSW1-3 ON = latched, OFF = un-latched (default)TB1-7 SD-E0v to activate. SD Card input, DSW1-3 ON = latched, OFF = un-latched (default)TB1-8 SD-F0v to activate. SD Card input, DSW1-3 ON = latched, OFF = un-latched (default)TB2-1 M1/1V Mic1 audio out, to loop hand mic to multiple SD1’s. Matching transformers not required.TB2-2 PA10v to activate M1 audio inputTB2-3 M1+Mic1+ balanced audio in, 1mV (default) for hand microphoneTB2-4 M1-Mic1- balanced audio in, 1mV (default) for hand microphoneTB2-5 0v Audio ground, 0VTB2-6 M2-Mic2- balanced audio in, 1v (default) for line level (music etc)TB2-7 M2+Mic2+ balanced audio in, 1v (default) for line level (music etc)TB2-8 PA20v to activate M2 audio input (must be in AUTO-NON ALARM)TB3-1 24VDC OUT Output fused 1amp max (+24vdc, power for control relays, paging mics pre-amp etc)TB3-2 CON OUT Control output, 0v, 300mA max (0v out for LMU4 all call, speaker relays etc, if required)TB3-3 ALM+24vdc in to activate, reverse polarity protected. See connection diagram for optionsTB3-4 ALM-0V in to activate, reverse polarity protected. See connection diagram for optionsTB3-5 N.O/N.C.Selectable common fault relay contacts. N.O. closes in fault, N.C (default) opens in fault.TB3-6 COM FAULT COM contact for common fault relay.TB3-7 R.FLT OUT Remote common fault contact out, 0v output up to 1amp max, in fault conditionTB3-8 R.FLT IN Remote common fault in, 0V in to activate, used for fault connection to LMU4/s, SRB1’s etcTB4-1 STR A+Monitored strobe output, 4k7 E.O.L. A+ = +24vdc in ALERT A+ = 0vdc in EVACUATE TB4-1 STR E+ Monitored strobe output, 3amp max E+ = 0vdc in ALERT E+ = +24vdc in EVACUATE TB5-1 +24V BATT Battery/PSU input +22-30vdcTB5-2 0V BATT Battery/PSU input 0vTB6-1 100V SPK Monitored, 100V speaker output 22k E.O.L supplied on speaker output terminals,TB6-2 100V SPK Monitored, 100V speaker output. relocate to end of speaker circuit to monitor.TB7-1 4R Amplifier output 4 ohm to step-up transformerTB7-2 C Amplifier Common to step-up transformerTB7-3 A1 100V IN100v from step-up transformer, Loop to A1 input on LMU4 if installed.TB7-4 A2 100V IN100v from step-up transformer, Loop to A2 input on LMU4 if installed.CONNECTORS3.5mm M2 SOCKET A 3.5mm socket has been provided for connection to an IPOD etc for speaker testing.To activate input, place M2 jumper from CTRL to LOCK and select AUTO.Note input is looped from M2 in, so only one source can be used at once.Un-plug TB2 if BGM/paging mic connected whilst using 3.5mm input.M2 GAIN jumper should be in the 1V position (default) adjust M2 to required level.4 PIN MIC1 SOCKET 4 Pin socket for connection to plug-in hand microphone EVACTRON model MIC-SDAUD-OUT RCA 1v common audio out to drive slave amplifier/s.IDC CONNECTOR 16 way IDC- connection for keypad control, EVACTRON model KEYPAD-SD.FUNCTION SETTINGSDIP SWITCH1-Evacuate T3/2220 OFF (default) = T3 temporal EVAC tone. ON = old 2220 EVAC tone2-Messages in manual OFF (default) = ALERT and EVACUATE messages in AUTO only ON = ALERT and EVACUATE messages in MANUAL and AUTO.3-SD-Latching OFF (default) = Non-latching- SD Card inputs C, D, E & F only play whilst input is low. ON = Latched - 0v momentary to trigger, will play full file whilst in AUTO. 4-100V Test ToneOFF = Test tone off (default)ON = 100v test tone active. Adjust TONE VOL to 100vac MAX on SPK output.TIMER ALERT to EVACUATE change-over time in AUTO-ALARM mode.BLACK 0=min straight to EVAC (Vertical) 1=1min ALERT then EVAC 2=2min ALERT then EVAC3=3min ALERT then EVAC 4=4min ALERT then EVAC5=5min ALERT then EVAC 6=6min ALERT then EVAC 7=7min ALERT then EVAC 8=8min ALERT then EVAC 9= stay in ALERT VOLUME CONTROLSMIC1 VOL Adjusts level of MIC1 input, see M1 GAIN jumper links below MIC2 VOL Adjusts level of MIC2 input, see M2 GAIN jumper links below TONE VOL Adjusts ALERT, EVACUATE & TEST TONE level MESS VOL Adjusts TONE and MESSAGE files (loaded on SD Card)JUMPER LINKSM1 GAIN 1mV (default) microphone level, 1V line level (music/PABX) & 3V if removed. M2 GAIN 1mV microphone level, 1V (default) line level (music/PABX) & 3V if removed.FUNC1 SPK Monitoring Disable ON speaker monitoring is disabled (used when no speaker caps fitted)OFF (default) speaker monitoring is enabled (22k E.O.L required)FUNC2 Strobe Monitoring Disable ON strobe monitoring is disabled (used when connecting multiple SRB1’s) OFF (default) strobe monitoring is enabled (4k7 E.O.L. required)PA1 STD/SEL STD (default) for all connections other than selector switch.SEL link when connecting a selector switch.PA2 CTRL/LOCK CTRL (default) control output 0v is active with any function other than PA2. LOCK PA2 locked on (0V) and Control output active. REMOVED all functions activate control output, including PA2.COM-FLT Common Fault Contacts N.C. (default) Closed under normal conditions, opens on com fault or loss of power.N.O. Remains open under normal conditions, closes on com fault or loss of power.PUSH BUTTONSF FALSE ALARM MESSAGE Press button “F ” to play False Alarm message.T TEST MESSAGE Press button “T ” to play Test Message.TEST MESSSD CARDThe SD1 units have been supplied with a removable SD card, this stores a library of messages and tones for you to choose from if required. Also loaded onto the card are various data sheets and installation notes.To view files simply remove the SD Card, located under the left hand corner of the PCB (next to IDC) then insert into a SD slot on your computer. Copy files from the library into the required trigger folder, replacing existing ones.NOTE removing SD Card will not stop ALERT and EVAC tones from functioning.Multiple files can be loaded into trigger folders. These will play in alphabetical or numerical order, re-name if required.e.g. 1bell.wav 2bellmessage.wav 3bellmessage.wav (bell tone will play once followed by bell message twice)Note a file with the same name can not be loaded into a trigger folder as it will try to over-write the file.1 Tone Library contains various tones files to choose from.2 Message Library contains various messages to choose from.TRIGGER FOLDERSALERT and EVAC default tones are loaded on to the EEPROM.If different tones are required, load the new files into the“Alternate” folders and they will override the default tones,once the SD Card is re-inserted. If ALERT or EVAC messagesare not required, remove files from the folder.Note if the old 2220 Evac tone is required, set DSW1-1 to ON.∙Alert Message -plays after every 5 tone pulses.∙Alert Tone Ramp Alternative -insert a different file if required.∙Alert Tone Steady Alternative -insert a different file if required.∙Evac 2220 Message -plays after every 4 tone pulses.∙Evac 2220 Tone Alternative -insert a different file if required.∙Evac T3 Message1 -plays after every 3 tone pulses.∙Evac T3 Message2 -insert for alternating messages in EVACIf loaded, message 1 & 2 will alternate after each 3 tone pulses.∙Evac T3 Tone Alternative -insert different file if required.∙Mic1 Chime -insert chime file, will play when mic1 is activated.∙Mic2 Chime -insert chime file if required, when mic2 is activated.∙PB F False Alarm Message-default message loaded.Press push button 1 “F” to activate.∙PB T Test Message-default message loaded.Press push button 2 “T” to activate.∙SD A Input- activated via KEYPAD-SD.Test message (default) insert different file if required.∙SD B Input- activated via KEYPAD-SD.False Alarm message (default) insert a different file if required.∙SD C Input- default file loaded, change if required.∙SD D Input- default file loaded, change if required.∙SD E Input- default file loaded, change if required.∙SD F Input- default file loaded, change if required.Inputs C-F can only be activated in AUTO NON-ALARMLOADING YOU OWN FILESYou may choose to record or supply your own CUSTOM files to load onto SD Card, they must be in the following format. FILE TYPES SUPPORTEDUncompressed PCM WAVE files with the file extension “.wav”. Files must only contain a single audio channel (Mono audio) MP3 files will not work and need to be converted. Save as WAV PCM signed 16 bit, mono.Many free programs are available to convert files to required format. A free program commonly used is called Gold Wave to edit files. Otherwise send file to *****************.au and we can have it converted.EVACTRON SD SERIES EVACUATION UNITS SPECIFICATIONSSupply Voltage22-30vdcCurrent Draw MaxStandby 120mASD20 20W output- 1.1 FLASD40 40W output- 2.0 FLASD60 60W output- 2.8 FLASD120 120W output- 5.5 FL AAdd loading of strobes if connected.Speaker Impedance Max using Impedance meter SD20 20W500 ohms ACSD40 40W250 ohms ACSD60 60W 166 ohms ACSD120 120W 83 ohms ACSpeaker Output22k end of line resistor (E.O.L.)Recovery Time from S/C 13 secondsRecovery Time from O/C 20 secondsStrobe Output4k7 end of line (E.O.L)3amp maximum (can drive strobes directly) Control OutputOpen collector transistor 0v switch,300mA max (to drive relay or multiple LMU4 all call) Common Fault Contacts1amp rating, selectable N.O or N.C Output LevelsM1 Output 1V (for mic looping)RCA audio out 1VInput LevelsM1 Gain JumperInput Level M1 Top -1mV (mic level)Input Level M1 Bottom -1V (line level)Input Level M1 Removed 3V (3V line level)M2 Gain JumperInput Level M2 Top -1mV (mic level)Input Level M2 Bottom -1V (line level)Input Level M2 Removed 3V (3V line level)Frequency ResponseFrequency response any channel (-3dB) 50Hz - 15 kHz DimensionsSD20-120221mmL x 115mmD x 90mmH(Mounted on hat section including transformer)PCB only 200mmL x 115mmD x 40mmH (no stand-offs) Individual Transformers20watt 65mmR x 30mmH,40watt 95mmR x 35mmH,60watt 95mmR 35mmH,120watt 110mmR x 40mmHAll specifications are for supply voltage of 24VDC and ambient temperature of 26C unless otherwise statedEVACTRON SD SERIES EVACUATION UNITS TYPICAL AMPLIFIER CONFIGURATIONSINGLE SD UNITSingle control/mic, single speaker circuitSingle control/mic, multiple slavese.g 2 x SD120=240wSingle mic, multiple controls, multiple SD1 units RECOMMENDED TEST PROCEDURE1. Make sure the PSU is capable of the full load current draw of the installed SD1 unit and ancillaries.2. Connect all controls and microphone if required. Leave speaker circuit disconnected for now.3. Connect 24vdc to BATT input, all LEDS except ALARM will momentarily light up on power-up.AMP POWER and STR POWER green leds should remain on at all times whilst power connected.SPK S/C led should stay on for 13 seconds and then clear after power-up,SPK O/C led will come on, if 22K E.O.L. is not across the speaker output terminals.4. With the speaker circuit disconnected, place an AC meter across the speaker output and turn DSW1-4 to the ON position(TEST TONE) the meter should read 100VAC, adjust TONE VOL if required, return DSW1-4 to OFF.5. Connect a test speaker to speaker output (this allows local testing without disrupting the building occupants)6. Press on-board push button “T” (TEST MESSAGE) the green P.A. led should flash. Adjust MESS VOL if required.7. If a microphone is connected. Select P.A; speak into the microphone, green led P.A. should be steady.Adjust M1 VOL to required level. (If key switch fitted, hand microphone will work in AUTO or override EVAC)8. Set timer ALERT to EVAC change-over time see time instructions (0 min = straight to EVAC)Select AUTO and activate a FIP ALARM, the red ALARM led should light. (ALM requires 24vdc supply to activate) ALERT or EVAC tones will activate with corresponding led.Messages should interrupt the tones and P.A. led will flash whilst messages are playing.9. Test all other functions as required.10. Once initial local is complete, disconnect test speaker and connect building speaker circuit.The 22K E.O.L. resistor will need to be moved to the end of the speaker circuit for monitoring to be complete.Test levels and adjust as required, if adjusting TONE VOL again use DS1-4 TEST TONE function to set up to 100V.Exceeding 100v could result damage to speakers. Check speaker supplier’s specifications if required.NOTE POWERING DOWN THE UNIT CAN BE SIMPLY DONE BY UN-PLUGGING 2 WAY “BATT 24V” TERMINAL.EVACTRON SD SERIES EVACUATION UNITSTROUBLE SHOOTINGFAULT CONDITION CHECKLISTNo leds on but power connected Check Battery/PSU polarity and voltage 22-30VDC.AMP POWER green led - off Check blade fuse (amplifier fuse only) and replace fuse with same rating.STR POWER green led - off Overload on strobe circuit, max 3 amps at one time. Self re-setting poly-fuse. Alarm input no action ALM input requires both 0V & +24VDC to activate and in AUTO mode (AUT low) SPK S/C red led stays on after 13sec Speaker Short Circuit, disconnect circuit, E.O.L. it should be 22K.SPK O/C yellow led - on Open Circuit in speaker line, disconnect circuit, E.O.L. it should be 22K.No SPK S/C or O/C fault function Check FUNC1 jumper, should be in OFF position (SPK monitoring enabled)STR S/C red led on Strobe Short Circuit, disconnect circuit, E.O.L. should be 4K7.STR O/C yellow led on Open Circuit in strobe circuit, disconnect circuit, E.O.L. should be 4K7.No Strobe S/C or O/C fault function Check FUNC2 jumper, it should be in the OFF position (STR monitoring enabled) AMP CLIP blue led on/flashing Amplifier close to maximum gain, indicator only.AMP FAULT-yellow led - on Amplifier shut down due to over-load or over temperature, check loading.AMP FAULT-yellow led flashing Amplifier High Temperature condition, fan should come on.Fan on Fan will cycle on as heat sink requires, depending on temp/load.COM FAULT yellow led on Fault condition O/C or S/C, Amp fault, remote fault in, supply voltage under 22VDC. COM FAULT yellow led flashing Fault condition after 10min with no input activated e.g. left in OFF position.No audio out of speakers Check for speaker fault condition. Use tone test (DSW1-4) for 100v test tone.No SD tones/messages working Check the SD Card is inserted underneath (pins to top) re-insert.SD C-F not working SD1 must be in AUTO with no ALARM to operate as SD C-F inputs.SD C-F not staying on If momentary trigger is required, set DSW1-3 to ON (latched), file should play fully. SD C-F stays on Set DSW1-3 to OFF, file will only play whist C-F input is low.Adjust M1/M2 VOL to suit (1mV=hi gain, 3V= low gain)Press either on-board push buttons to test. If P.A led flashes check MESS VOL. Custom message not playing Check format of loaded files, try one from library. See SD Card file type instructions Multiple tones/messages playing Check input folder for more than one file loaded in folder. Leave required one.M1 level too low /high M1 GAIN - 1mV=mic level (default) 1V=line level & 3V if removed. Adjust M1 VOL. M2 level too low/high M2 GAIN - 1mV=mic level 1V=line level (default) & 3V if removed. Adjust M2 VOL. Alert to EVAC Timer issues BLUE timer switches with clear power relay, use the following settings-0=EVAC, 1=2min, 2=1, 3=3, 4=8, 5=10, 6=ALERT stays on, 7=11, 8=4, 9=6min. LMU4/s connection problem Check 100V to LMU4, it must come from A1 & A2 of step up transformer on SD1, toA1 & A2 on LMU4, matching polarity. SD1 should have 22K across SPKSee LMU4 connection drawing for details.SRB1’s connection problem If using SRB1’s on STR output, check FUNC2 jumper, it should be in the ONposition (STR monitoring disabled) to allow 0V switching to strobe relays.See SRB1 connection drawing for details.E V A C T R O N K E Y P A D S D。
DAB性能要求
对于手机类终端,要求mot 接收同时可使用终端上其 他非DAB功能应用。
多任务系统 压力测试标准(snr=10 带宽24kbps、48kpbs、 64kbps)
要求使用智能导航时可以使用电话功能。
2M 数据样本,首轮接收率100%
备注
北京将使用使用三波段11A,11B,11C,11D四个频点发射.中 国DAB发射频率规范见说明2
对于手机类终端,要求接收广播同时可以接听来电/收 发 SMS/MMS/查询电话簿等基本手机操作 接收广播中可以上 WAP 在日光直射的条件下可以看清楚屏幕内容 ≤400mW
DMB连续接收播放时间 平均故障间隔时间
≥3Hrs (喇叭输出/音量:85dB;LCD 亮度:100cd;手 机待机状态) ≥3 years 无死机或工作不正常现象在≤±10KV 空气放电静电 电压下 -30º C ~60 º C
快速搜索:对指定频点做快速扫描 全频搜索:搜索整个三波段 频率 For other teminal:
≥-102dBm(Still);≥-100dBm(Moving)
环境场强-80dBm
MUSICAM
支持耳机DAB天线,以及车载DAB天线。
可兼容并自适应上述两款发端设备
可兼容并自适应上述各类编码方式
DAB性能要求 DAB性能要求
类别 遵 循 标 准 项目
ETSI EN 300 401 V1.4.1 (2006-06) ETSI TS 102 428 V1.1.1 (2005-06) ETSI TR 101 758 V2.1.1 (2000-11) GY/T 214-2006
III波段T-DMB
频道信息显示 最大DMB接收速度 音频解码器
音频采样频率
民航定座指令
民航定座指令民航定座指令⼀.订座系统:包括代理⼈分销系统(CRS),航空公司系统(ICS),离港系统,货运系统三个⼤型主机系统为⽀持的发展格局。
⼆.系统注册1.进⼊系统:DA:查看是否输⼊营业员⼯作号2.进⼊营业员⼯作号SI 格式:SI:⼯作号/密码/级别例:⼯作号为1111,密码为123A,级别41的营业员准备进⼊系统。
〉SI:11111/123A/413.退出系统SO4.密码的修改AN 格式:旧保密号/新保密号例:假定有⼯作号11111,原保密号为123A,现欲改为888F。
(1)进⼊系统:〉SI:11111/123A/41(2)⽤AN指令进⾏修改:〉AN:123A/888F(3)退出系统:〉SO(4)重新进⼊系统:SI:11111/888F/41三.航班信息查询指令(⼀)航班时刻显⽰SK:查询⼀城市对在特定周期内所有航班的信息,包括航班号、出发到达时间、舱位、机型、周期和有效期限。
格式:SK 城市对三字代码/ ⽇期/ 航空公司⼆字代码/ 舱位例1:查询15OCT前后三天的⼀周时间内上海到深圳的航班时刻〉SK:SHASZX/15OCT(航空公司⼆字代码和舱位可省略,表⽰查询所有信息)12OCT(MON)/18OCT(SUN)SHASZX2 FM373 SHASZX 0830 1035 757 0 M 31MAR26OCT FAYIHKLMTEVUQGW 以上显⽰信息中,分别为序号、航班号、航程、出发到达时间、机型、经停点、餐⾷、期限和舱位。
例2:显⽰以今天为中⼼前后三天之内北京到上海的航班信息〉SK:PEKSHA例3:显⽰14OCT前后三天从北京⾄长沙的MU的F舱的航班〉SK:PEKCSX/14OCT/MU/F例4:显⽰10OCT前后三天北京到巴黎的直达航班〉SK:PEKCDG/10OCT/D(⼆)座位可利⽤情况显⽰AV——查询航班座位可利⽤情况,及其相关航班信息,如航班号、舱位、起飞到达时间、经停点等。
ELENESSA电梯备件资料(盖章版)
恒大电梯备件标准定价(ELENESSA电梯)
品目 231 231 231 231 231 231 231 231 231 231 231 231 231 231 231 231 231 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235 235
恒大电梯备件标准定价(ELENESSA电梯)
品目 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 203 206 207 207 207 207 213 214 214 214 214 214 221 226 226 231
规格型号 DOR-261A DOR-275Cቤተ መጻሕፍቲ ባይዱDOR-560 DOR-221A X44BX-37 ZWS30-12/J LDA50F-12 X59LX-222 DOR-1241 DOR-1231 DOR-565 DOR-590A DOR-710B JW-MW11RKK 单极单投 黑色 JW-MW21RKK-027L 2极单投 黑色 ZJL6V-005 YX201B497-02 KCZ-900A ZYBAN-001 ZYBAN-001 LHS-451A LHS-452A LHD-730A LHD-730A LHD-730A LHS-420A LHB-056A LHB-056A LHB-056A LHB-056A LHB-058A LHB-058A LHB-055A LHB-055A LHB-051A LHB-051A ZDH01-016 ZDH01-028 FL1D-2M FL2D-2M WD2301 LP1S-26G-R LP1S-26G-M LP1S-26G-W MAK YE603C090-01 YE603C565-01 YE602B303-01 YE602B176-01 YE602B099-01 YE603C009-01 YE603C208-01 YE603C566-01 YE602B304-01 YE602B176-19 YE602C969-03 YE603C090-01 YE603C565-01 YE602B303-03
航空公司二三字代码
三字程序代码两字代码三字代码三字数字代码1002Z CGN1013K JSA1023Q CYH5921033R ROV3761043U CSC1053W CNJ1065X UPS1078C DXH1088L LKE8591098Y CYZ1109C CQH111AA AAL1112AC ACA14113AF AFR57114AH DAH124115AI AIC98116AK AXM117AN AAA90118AR ARG44119AY FIN105120BA BAW125121BD BMA236122BG BBC997123BI RBA672124BK OKA125BP BOP636126BR EVA695127CA CCA999128CI CAL297129CJ CBJ782130CK CKK112131CN GDC132CU CUB136133CZ CSN784134EK UAE176135ET ETH136EU UEA137F6CAG138FD AIQ139FM CSH774140FX FDX23141G4CGH142G5HXA143G8GWL144GA GIA126145GF GFA72146GS GCR826147HO DLH148HU CHH880149IJ GWL150IR IRA96 151IV CFJ152J5EPA153JD DER898 154JI JAE189 155JL JAL131 156KA HAD43 157KE KAL180 158KM AMC643 159KN CUA160KQ KQA161KU KAC229 162KX CAY378 163LA LAN45 164LH DLH165LX CRX724 166LZ LAZ196 167MA MAH182 168MD MDG169MF CXA731 170MH MAS232 171MI SLK629 172MK MAU239 173MP MPH129 174MS MSR77 175MU CES781 176NG LDA231 177NH ANA205 178NH DBH179NS HBH180NW NWA12 181NZ ANZ86 182O3CSS183OQ CQN184OS AUA257 185OZ AAR988 186PK PIA214 187PN CHB847 188PR PAL79 189PX ANG656 190QF QFA81 191QR QTR192QV LAO627 193RJ RJA512 194SA SAA83 195SB ACI63 196SC CDG324 197SD SUD200 198SK SAS117 199SN SAB82 200SQ SIN618201SR SWR85 202SU AFL555 203SV SVA65 204SZ CXN785 205TG GHA217 206TR TGW207TW TWA15 208UA UAL16 209UL ALK603 210UN TSO670 211VD KPA212VJ RAC658 213VN HVN738 214WH CNW783 215WU CWU216X2CXH217XO CXJ651 218Y8YZR219YX MEP453 220ZH CSZ479 2215J CEB2228M MAI223CX CPA224TK THY225U6SVR226Y6BTV999ZZ ZZZ航空公司英文名Yunnan AirlinesRover Airways (cargo)SICHUAN AIRLINESEast Star Airlines Limited Corporation Lucky Air Co. LtdChina Postal AirlinesSpring Airlines Limited Corporation American Airlines INC.Air CanadaAir FranceAir AlgerieAir IndiaAnsett AustraliaAerolineas ArgentinasFinnairBritish AirwayBritish Midland Airways Ltd.Biman Bangladesh AirlinesRoyal Brunei AirlinesOKAIRAir Botswana CorporationEVA Airways CorporationAir ChinaChina AirlinesChina Northern AirlinesChina Cargo Airlines LTDGRAND CHINA/CHINA DRAGONCubana de Aviacion S.AChina Southern AirlinesEmiratesSHANGHAI AIRLINES CO.,LTD.Federal Express Corporation d/b/a FedEx CHINA EXPRESSGreatwall AirlinesGaruda IndonesiaGulf Air Company G.S.C.GRAND CHINA/CHINA DRAGONJUNYAO AIRLINES CO., LTDHainan Airlines Co.,Ltd.Greatwall AirlinesIran Air - The Airline of Islamic Republic of Iran DEERJETJade Cargo International Company LimitedJapan Airlines International Co. LtdHong Kong Dragon Airlines LimitedKOREAN AIR LINES CO.LTDAir Malta p.l.c.China United Airlines Co.,LTDKuwait AirwaysCayman Airways LimitedLAN Airlines, S.A.Swiss International Airlines Ltd. d/b/a Swiss BALKAN-BULGARIAN AIRLINESMALEV Hungarian Airlines LimitedXiamen AirlinesMalaysia Airline System BerhadSilkAir (S) Pte. Ltd.Air MauritiusMartinair Holland N.V.EgyptairChina Eastern AirlinesLauda Air (Austria)ALL NIPPON AIRWAYS CO, LTD.Northwest Airlines, IncAir New Zealand Ltd.Austrian Airlines, Osterreichische Luftverkehrs AG ASIANA AIRLINESPakistan International AirlinesWEST CHINAPhilippine Airlines, IncAir Niugini Pty Limited d/b/a Air NiuginiQantas Airways LtdLao Airlines /LAO AVIATIONThe Royal Jordanian AirlineSouth African AirwaysAir Caledonie InternationalShandong AirlinesSudan Airways Co. Ltd.Scandinavian Airlines System (SAS)SABENA-SOCIETE ANONYME BELGE D’EXPLOITATION DEL SINGAPORE AIRLINES LIMITEDSWISSAIR (SOCIETE ANONYME SUISSE)Aeroflot Russian AirlinesSAUDI ARABIAN AIRLINESThai Airways International Public Company Ltd. TRANS WORLD AIRLINES INC.United Airlines, IncSriLankan Airlines LimitedTransaero Airlines(Russian Federation)Royal Air CambodgeVietnam Airlines CorporationChina Northwest AirlinesChina Xinhua AirlinesYangtze River Express Airlines Company Limited Midwest Airlines, Inc.SHENZHEN AIRLINESCebu AirCathayTURKAIRSverdlovskBatavia未知中国长安航空公司(海航)新加坡捷星航空公司中国云南航空公司(东航)罗孚航空公司中国四川航空公司中国南京航空公司美国联合包裹速递公司中国东兴航空公司(武汉)中国云南昆明祥鹏航空公司(海航)中国货运邮政航空有限公司(上海虹桥,南航)中国春秋航空公司(上海虹桥)美国航空公司加拿大枫叶航空公司法国航空公司阿尔及尔航空公司印度航空公司马来西亚航空公司澳洲安捷航空公司阿根廷航空公司芬兰航空公司英国航空公司英伦航空公司孟加拉航空公司文莱皇家航空公司中国奥凯航空公司(总部:北京,基地:天津)博茨瓦纳航空公司台湾长荣航空公司中国国际航空公司中华航空公司中国北方航空公司(南航)中国航空货运公司(上海,东航)中国北京大新华航空(海航)古巴航空公司中国南方航空公司阿联酋埃塞俄比亚航空公司鹰联中国中航浙江航空公司(国航)泰国亚洲航空公司中国上海航空公司美国联邦快递中国贵州航空公司中国华夏航空有限公司(贵阳)中国长城航空公司(上海浦东)印度尼西亚巴林海湾航空公司的管治委员会中国天津大新华快运航空有限公司(海航)中国上海吉祥航空公司(上海浦东)中国海南航空公司中国长城航空公司(上海浦东)中国深圳东海航空公司(深圳)中国北京金鹿航空(海航)中国翡翠国际货运航空公司(深圳;深航,德国汉莎)日本航空有限公司港龙航空公司(中国香港)韩国大韩航空公司马尔他航空公司中国联合航空公司(北京南苑机场)肯尼亚航空公司科威特航空公司开曼群岛航空公司智利航空公司德国汉莎航空公司瑞士国际航空公司保加利亚巴尔干航空公司匈牙利航空公司马达加斯加航空公司中国厦门航空公司马来西亚航空公司新加坡胜安航空公司毛里求斯航空有限公司荷兰马丁航空公司埃及航空公司中国东方航空公司(上海虹桥)奥在利维也纳航空公司日本全日航空公司中国东北航空公司(川航,沈阳)河北航空公司美国西北航空公司新西兰航空公司顺丰中国重庆航空有限公司(重庆)奥地利航空公司韩亚航空公司巴基斯坦国际航空公司中国西部航空有限公司(重庆)菲律宾航空公司新几内亚航空公司澳洲航空公司卡塔尔航空公司老挝民航局约旦皇家航空公司南非航空公司新喀里多尼亚中国山东航空公司苏丹航空公司斯堪的纳维亚(瑞典北欧)航空公司比利时航空公司新加坡航空公司沙特阿拉伯航空公司中国西南航空公司(国航)泰国国际航空公司新加皮欣丰虎航环球航空公司(美国)美国联合航空公司斯里兰卡航空公司俄罗斯航空公司中国西安鲲鹏航空(深航)皇家柬埔寨航空公司越南航空公司中国西北航空公司(东航)中国武汉航空公司(东航)中国新华航空公司(天津,海航)中国新疆航空公司(南航)中国上海浦东杨子江快运航空(海航)美国中西部快运公司中国深圳航空公司菲律宾宿务太平洋航空缅甸国际航空公司香港国泰航空有限公司土耳其航空公司俄罗斯乌拉尔航空公司印度尼西亚巴达维亚航空公司。
ICS93718资料
SYMBOL CONDITIONS IIH VI = VDD or GND IIL VI = VDD or GND IDD3.3_2.5 CL = 0pf, 133MHz CL = 0pf, 133MHz Operating Supply Current IDD2.5 CL = 0pf, all frequencies IDDPD Output High Current IOH VDD = 3.3V, VOUT = 1V IOL VDD = 3.3V, VOUT = 1.2V VDD = 3.3V, VOH = -12mA VDD = 3.3V I OH= 12mA VI
SEL_DDR=0
3.3V
0434D—10/10/03
ICS93718
元器件交易网
ICS93718
Pin Descriptions
PIN NUMBER 1 2, 8, 12, 17, 23, 3, 9, 14, 18, 26, 31, 35, 40, 46 45, 43, 39, 34, 30, 28, 44, 42, 38, 33, 29, 27, 21, 19, 15, 10, 6, 4 PIN NAME FB_OUT VDD3.3_2.5 GND DDRT (11:6) DDRC (11:6) DDRT (5:0) SDRAM (10, 8, 6, 4, 2, 0) TYPE OUT PWR PWR OUT OUT OUT OUT IN I/O IN PWR DESCRIPTION Feedback output, dedicated for external feedback 2.5V or 3.3V voltage supply to pins 4, 5, 6, 7, 10, 11, 15 , 16, 19 , 20, 21, 22 Ground "Tr ue" Clock of differential pair outputs. "Complementory" clocks of differential pair outputs. "Tr ue" Clock of differential pair outputs, or 3.3V SDRAM clock outputs depending on SEL_DDR input "Complementory" clocks of differential pair outputs, or 3.3V SDRAM clock outputs depending on SEL_DDR input Single ended buffer input Data pin for I2C circuitry 5V tolerant Clock input of I2C input, 5V tolerant input 2.5V voltage supply Asynchronous active low input pin used to power down the device into a low power state. The inter nal clocks are disabled. The latency of the power down will not be greater t h a n 3 m s. Select input for DDR mode or DDR/SD mode 0=DDR/SD mode 1=DDR mode
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
SD101A/101B/101CDocument Number 85629Rev. 1.5, 01-Mar-07Vishay Semiconductors194 9367Small Signal Schottky DiodesFeatures•Integrated protection ring against static discharge•Low capacitance•Low leakage current•Low forward voltage drop •Lead (Pb)-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECApplications•HF-Detector •Protection circuit•Diode for low currents with a low supply voltage •Small battery charger •Power supplies•DC/DC converter for notebooksMechanical DataCase: DO35 Glass case Weight: approx. 125 mg Cathode Band Color: black Packaging Codes/Options:TR/10 k per 13" reel (52 mm tape), 50 k/boxTAP/10 k per Ammopack (52 mm tape), 50 k/boxParts TableAbsolute Maximum RatingsT amb = 25°C, unless otherwise specified1) Valid provided that electrodes are kept at ambient temperature.Thermal CharacteristicsT amb = 25°C, unless otherwise specified1) Valid provided that electrodes are kept at ambient temperature.Part T ype differentiationOrdering codeT ype Marking RemarksSD101A V R = 60 V, V F max. 410 mV at I F = 1 mA SD101A-TR or SD101A-T AP SD101A T ape and Reel/Ammopack SD101B V R = 50 V, V F max. 400 mV at I F = 1 mASD101B-TR or SD101B-T APSD101B T ape and Reel/Ammopack SD101CV R = 40 V, V F max. 390 mV at I F = 1 mA SD101C-TR or SD101C-TAPSD101CT ape and Reel/AmmopackParameterT est conditionPart Symbol Value Unit Reverse voltageSD101A V R 60V SD101B V R 50V SD101CV R 40V Forward continuous current I F 30mA Peak forward surge current t p = 10 µsI FSM 2A Repetitive peak forward current I FRM 150mA Power dissipationP tot3101)mWParameterT est conditionSymbol Value Unit Junction temperature T j 125°C Storage temperature rangeT stg - 65 to + 150°C Thermal resistance junction to ambient airR thJA3201)K/W 2Document Number 85629Rev. 1.5, 01-Mar-07SD101A/101B/101CVishay SemiconductorsElectrical CharacteristicsT amb = 25°C, unless otherwise specifiedTypical CharacteristicsT amb = 25°C, unless otherwise specifiedParameterTest conditionPart Symbol Min Typ.MaxUnit Reverse Breakdown VoltageI R = 10 µASD101A V (BR)60V SD101B V (BR)50V SD101CV (BR)40V Leakage currentV R = 50 V SD101A I R 200nA V R = 40 V SD101B I R 200nA V R = 30 VSD101C I R 200nA Forward voltage dropI F = 1 mASD101A V F 410mV SD101B V F 400mV SD101CV F 390mV I F = 15 mASD101A V F 1000mV SD101B V F 950mV SD101CV F 900mV Diode capacitanceV R = 0 V , f = 1 MHz SD101A C D 2.0pF SD101B C D 2.1pF V R = 0 V , f = 1 MHzSD101CC D2.2pFFigure 1. Reverse Current vs. Reverse Voltage I R = R e v e r s e C u r r e n t (µA)0.010.11101000101520253035404550V R - Re v erse V oltage (V )162045Figure 2. Diode Capacitance vs. Reverse Voltage0.00.20.40.60.81.01.21.41.61.82.0101520253035404550V R - Re v erse V oltage (V )16205C D - D i o d e C a p a c i t a n c e (p F )5SD101A/101B/101CDocument Number 85629Rev. 1.5, 01-Mar-07Vishay Semiconductors3Package Dimensions in millimeters (inches): DO35Figure3. Forward Current vs. Forward Voltage0.010.101.0010.000.00.10.20.30.40.50.60.70.80.9 1.0I F - F o r w a r d C u r r e n t (m A )V F - For w ard V oltage (V )16206 4Document Number 85629Rev. 1.5, 01-Mar-07SD101A/101B/101CVishay SemiconductorsOzone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendmentsrespectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDocument Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.。