厚膜片式固定电阻ThickFilmResistor

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厚声贴片电阻规格中文版

d. Max. Working Voltage t 最大工作电压
15V
25V
50V
50V
150V
200V
200V
200V
200V
200V
L Max. Overload Voltage ., 最大过负荷电压
30V
50V
100V
100V
300V
400V
500V
500V
500V
500V
o Dielectric withstanding
l Resistance Value of
a Jumper
-
y 零欧姆电阻阻值
iro Rated Current of Jumper
-
零欧姆电阻额定电流
Un Max. Current of Jumper
-
<50mΩ <50mΩ <50mΩ <50mΩ <50mΩ <50mΩ <50mΩ <50mΩ <50mΩ
Resistance Range of 2% (E-24) 2% 的阻值范围 (E-24)
10Ω ~ 10MΩ
1Ω ~ 10MΩ 1Ω ~ 10MΩ 1Ω ~ 10MΩ 1Ω ~ 10MΩ 1Ω ~ 10MΩ 1Ω ~ 10MΩ 1Ω ~ 10MΩ 1Ω ~ 10MΩ 1Ω ~ 10MΩ
Resistance Range of 5% (E-24) 5% 的阻值范围 (E-24)
0.10 ± 0.05 0.10 ± 0.05 0.20 ± 0.10 0.30 ± 0.20 0.40 ± 0.20 0.45 ± 0.20 0.50 ± 0.25 0.50 ± 0.20 0.60 ± 0.25 0.60 ± 0.25

风华产品-电阻汇总

厚膜电阻
常规厚膜片式固定电阻
厚膜片式跨接电阻
超低阻值厚膜片式固定电阻
高阻值厚膜片式固定电阻
高精度厚膜片式固定电阻
抗硫化厚膜片式固定电阻器
功率型厚膜片式固定电阻器
厚膜高压片式固定电阻器
低TCR超低阻值厚膜片式固定电阻器
抗浪涌厚膜片式固定电阻器
软灯条厚膜片式固定电阻器
低铅厚膜片式固定电阻器
超小尺寸厚膜片式固定电阻器
厚膜网络电阻
厚膜片式网络电阻
低铅厚膜片式网络电阻
厚膜网络电阻
合金片式固定电阻器
合金超低阻值片式固定电阻
热敏电阻
厚膜片式负温度系数电阻（NTC热敏电阻）
PTC插件热敏电阻
NTC插件热敏电阻
高精度AT型NTC热敏电阻
高精度玻封NTC热敏电阻
压敏电阻
多层片式压敏电阻
片式压敏电阻排
氧化锌压敏电阻
钛酸锶环形压敏电阻
定制电阻
油位传感器用厚膜电阻板
机油压力传感器用厚膜电阻板
节气门位置传感器用厚膜电阻板
空调风门执行器用厚膜电阻板
激光打印机用陶瓷加热电阻条
厚膜高压电阻器
色环电阻
碳膜电阻
金属膜电阻
金属氧化膜电阻
水泥电阻
绕线电阻。

贴片电阻规格、封装、尺寸00249

贴片电阻规格、封装、尺寸ChipR Dimensions 、Footprint简述基本结构分类额定功率及工作电压阻值,标准阻值标识规格书、生产厂家命名方法价格、报价创建时间：2005-12-30 最后修改时间：2006-10-29我们常说的贴片电阻 (SMD Resistor)叫"片式固定电阻器"(Chip Fixed Resistor)，又叫"矩形片状电阻"(Rectangular Chip Resistors)，是由ROHM公司发明并最早推出市场的。

特点是耐潮湿，耐高温，可靠度高，外观尺寸均匀，精确且温度系数与阻值公差小。

按生产工艺分厚膜(Thick Film Chip Resistors)、薄膜(Thin Film Chip Resistors )两种。

厚膜是采用丝网印刷将电阻性材料淀积在绝缘基体(例如玻璃或氧化铝陶瓷)上，然后烧结形成的。

我们通常所见的多为厚膜片式电阻，精度范围±0.5% ~ 10%，温度系数:±50PPM/℃ ~ ±400PPM/℃。

薄膜是在真空中采用蒸发和溅射等工艺将电阻性材料淀积在绝缘基体工艺(真空镀膜技术)制成，特点是低温度系数(±5PPM/℃)，高精度(±0.01%～±1%)。

封装有：0201，0402，0603，0805，1206，1210，1812，2010，2512。

其常规系列的精度为5%，1%。

阻值范围从0.1欧姆到20M欧姆。

标准阻值有E24，E96系列。

功率有1/20W、1/16W、1/8W、1/10W、1/4W、1/2W、1W。

特性：∙体积小，重量轻∙适合波峰焊和回流焊∙机械强度高，高频特性优越∙常用规格价格比传统的引线电阻还便宜∙生产成本低，配合自动贴片机，适合现代电子产品规模化生产使用状况：由于价格便宜，生产方便，能大面积减少PCB面积，减少产品外观尺寸，现在已取代绝大部分传统引线电阻。

厚膜片式跨接电阻器

2.电阻器引出端电极覆盖均匀镀层较难脱落且平整无裂痕针孔变色 The terminal part is covered equable , the plating is hard to fade, and should avoid unevenness, flaw, pinhole and discoloration.
Standard
负荷下降曲线 Derating Curve
-55
70
100
75
50
25
使用温度范围
Operating Temperature Range
-55 125
额定负荷百分比 Percent rated load
-75 -50 -25
0
25 50 75 100 125 155
环境温度 Ambient temperature ( )
型号 Type 0201 0402 0603 0805 1206 1210
P 2.0 0.05 2.0 0.05 4.0 0.1 4.0 0.1 4.0 0.1 4.0 0.1
P0 4.0 0.1 4.0 0.1 4.0 0.1 4.0 0.1 4.0 0.1 4.0 0.1
P1 2.0 0.05 2.0 0.05 2.0 0.05 2.0 0.05 2.0 0.05 2.0 0.05

广东风华高新科技股份有限公司
Fenghua Advanced Technology (holding) Co., Ltd
产品外观 Appearance
1.电阻器表面二次玻璃体保护膜覆盖完好且难以脱落,表面平整 The surface of resistor is covered with Protective Coating which hard to fade, and the surface of coating should avoid unevenness.

电阻基础知识学习资料

贴片电阻资料大全简述:我们常说的贴片电阻(SMD Resistor)学名叫：片式固定电阻器，是从Chip Fixed Resistor直接翻译过来的。

特点是耐潮湿，耐高温，可靠度高，外观尺寸均匀，精确且温度系数与阻值公差小。

按生产工艺分厚膜(Thick Film Chip Resistors)、薄膜(Thin Film Chip Resistors)两种。

厚膜是采用丝网印刷将电阻性材料淀积在绝缘基体(例如玻璃或氧化铝陶瓷)上，然后烧结形成的。

我们通常所见的多为厚膜片式电阻，精度范围±0.5% ~ 10%，温度系数:±50PPM/℃~ ±400PPM/℃。

薄膜是在真空中采用蒸发和溅射等工艺将电阻性材料淀积在绝缘基体工艺(真空镀膜技术)制成，特点是低温度系数(±5PPM/℃)，高精度(±0.01%～±1%)。

封装有：0201，0402，0603，0805，1206，1210，1812，2010，2512。

其常规系列的精度为5%，1%。

阻值范围从0.1欧姆到20M欧姆。

标准阻值有E24，E96系列。

功率有1/20W、1/16W、1/8W、1/10W、1/4W、1/2W、1W。

除一些小厂或不得不使用引线电阻的设计，各种电器上几乎都在使用。

目前绝大部分电子产品，以0603、0805器件为主；以手机，PDA为代表的高密度电子产品多使用0201、0402的器件；一些要求稳定和安全的电子产品，如医疗器械、汽车行驶记录仪、税控机则多采用1206、1210等尺寸偏大的电阻。

市场状况：目前，在全球的市场份额中，排名依次是台湾、日本、中国、韩国，欧美几乎不再生产。

贴片电阻、厚膜电阻以及薄膜电阻的可靠性评估

薄膜电阻和厚膜电阻的三种结构

薄膜电阻和聚合厚膜条形电阻设计成三种结构，1.5 mm×4 square,1.0 mm×2 squares,和0.5 mm×1square.另外，薄膜电阻设计成三种基本形状，条状，多条状，和弯曲状，电阻线路宽度分别为1.4 mm、1 mm和0.75 mm. 测试板T1,160 mm×160 mm,使用Ohmega-Ply材料，内含 240个成形的薄膜电阻，电阻外部压合覆树脂铜箔（RCC）。测试板T2,177 mm×192 mm,在FR4层压板上网印189个厚膜电阻，外部压合RCC材料。

介绍

随着元件越变越小，制造商和组装者在这类印制板的制造、组装、检验、操作和费用控制等方面面临着许多挑战。由于减少了焊点数量，内埋无源元件更加可靠。同时，内埋式元件增加了线路密度，提升了电子设备的电气性能和功能。虽然内埋无源元件有很多优势，但是依旧有一些问题，包括断裂分层及各种埋置元件的稳定性问题。因为内埋元件通常需要多层叠构设计，而不同材料的CTE不匹配将会产生较大的热应力。与分立式元件不同，有缺陷的内埋式元件无法替换，这意味着即使一个小元件出现问题也会造成整个线路板报废。所以，保持元件长期稳定和可靠，是制造商运用这一技术的关注点。内埋无源元件的概念在很多年前就已出现在线路板行业内。上世纪 60年代末，第一次试验制作内埋电容；
厚膜电阻材料和结构

厚膜（PTF）电阻通常是用聚合物电阻浆制作，适用于不同印制板基材。一般，电阻浆组成是碳（炭黑和石墨）和/或混合聚合树脂的银填料（含溶剂和稀释剂，有时加入绝缘粉末填料使之具有适当的流变性能）。印制板上PTF电阻浆固化温度不应超过180 ℃，但一些制造商可提供固化温度达到220 ℃的电阻膏。电阻浆和电阻膏的方阻范围远大于薄膜电阻材料，但阻值公差较大，稳定性有限。聚合物和铜层接触面间氧化层会引起阻值偏差，且更易发生CTE不匹配造成的分层和断裂。薄膜电阻制造技术是使用NiP作为电阻材料，压合在FR-4层压片上。具体来说，该技术首先将镍（Ni）磷（P）合金薄层电镀于铜箔之上，制成被称作RCM的电阻/导体复合金属箔，然后将其压合在FR-4基材之上。最后使用减成法蚀刻出铜线路和平面电阻。本研究使用电阻材料制作内埋电阻，方阻值分别为25 Ω/米和 100 Ω/米，压合在FR-4基材上。基本参数见表1.

厚膜片式网络电阻器

特性ＦＥＡＴＵＲＥＳ品名构成Ｔｙｐｅ　Ｄｅｓｉｇｎａｔｉｏｎ体积小、重量轻。

适应再流焊与波峰焊。

电性能稳定，可靠性高。

装配成本低，并与自动装贴设备匹配。

机械强度高、高频特性优越。

Ｍｉｎｉａｔｕｒｅ　ａｎｄ　ｌｉｇｈｔ　ｗｅｉｇｈｔ．Ｓｕｉｔ　ｆｏｒ　ｒｅｆｌｏｗ　ａｎｄ　ｗａｖｅ　ｆｌｏｗ　ｓｏｌｄｅｒ．Ｓｔａｂｌｅ　ｅｌｅｃｔｒｉｃａｌ　ｃａｐａｂｉｌｉｔｙ，　ｈｉｇｈ　ｒｅｌｉａｂｉｌｉｔｙ．Ｌｏｗ　ａｓｓｅｍｂｌｙ　ｃｏｓｔ，　ｓｕｉｔ　ｆｏｒ　ａｕｔｏｍａｔｉｃ　ＳＭＴｅｑｕｉｐｍｅｎｔ．Ｓｕｐｅｒｉｏｒ　ｍｅｃｈａｎｉｃａｌ　ａｎｄ　ｆｒｅｑｕｅｎｃｙｃｈａｒａｃｔｅｒｉｓｔｉｃｓ．例１Ｅｘａｍｐｌｅ１例２Ｅｘａｍｐｌｅ２ＲＣＭＬ０８Ｗ１０３ＪＴＭＬ０６１０Ｒ１０３ＪＴ厚膜片式网络电阻器ＴＨＩＣＫＦＩＬＭＣＨＩＰＮＥＴＷＯＲＫＲＥＳＩＳＴＯＲＴＨＩＣＫ　ＦＩＬＭ　ＣＨＩＰ　ＮＥＴＷＯＲＫＲＥＳＩＳＴＯＲ参考标准ＲＥＦＥＲＥＮＣＥＳＴＡＮＤＡＲＤ结构图ＣＯＮＳＴＲＵＣＴＩＯＮＩＥＣＥ－２４系列电阻值代码对照表ＧＢ／Ｔ　５７２９－９４ＧＢ／Ｔ　９５４６－１９９５ＪＩＳ　Ｃ　５２２３－１９８９ＪＩＳ　Ｃ　５２０１－１９９４ＪＩＳ　Ｃ　５２０２－１９８５ＩＥＣ　Ｅ－２４　Ｓｅｒｉｅｓ　Ｒｅｓｉｓｔａｎｃｅ　Ｃｒｏｓｓ－ｒｅｆｅｒｅｎｃｅ　ＬｉｓｔｎＥ－２４　系列　Ｅ－２４　Ｓｅｒｉｅｓ　（×１０Ω）（单位ｕｎｉｔ：１Ω、１０Ω、１００Ω、１ＫΩ、１０ＫΩ、１００ＫΩ、１ＭΩ）６．二次玻璃２ｎｄ　ｃｏｖｅｒ　ｇｌａｓｓ５．　一次玻璃１ｓｔ　ｃｏｖｅｒ　ｇｌａｓｓ４．　电阻体ｒｅｓｉｓｔｉｖｅ　ｅｌｅｍｅｎｔ３．　面电极ｆａｃｅ　ｅｌｅｃｔｒｏｄｅ７．　端电极ｉｎｎｅｒ　ｔｅｒｍｉｎａｔｉｏｎ８．　中间电极Ｍｉｄｄｌｅ　ｔｅｒｍｉｎａｔｉｏｎ２．　背电极ｒｅｖｅｒｓｅ　ｓｉｄｅ　ｅｌｅｃｔｒｏｄｅ１．　陶瓷基片ｃｅｒａｍｉｃ　ｓｕｂｓｔｒａｔｅ９．　外部电极ｏｕｔｅｒｔｅｒｍｉｎａｔｉｏｎ６．　二次玻璃２ｎｄ　ｃｏｖｅｒ　ｇｌａｓｓ５．　一次玻璃１ｓｔ　ｃｏｖｅｒ　ｇｌａｓｓ４．　电阻体ｒｅｓｉｓｔｉｖｅ　ｅｌｅｍｅｎｔ３．　面电极ｆａｃｅ　ｅｌｅｃｔｒｏｄｅ７．　端电极ｉｎｎｅｒ　ｔｅｒｍｉｎａｔｉｏｎ８．　中间电极Ｍｉｄｄｌｅ　ｔｅｒｍｉｎａｔｉｏｎ２．　背电极ｒｅｖｅｒｓｅ　ｓｉｄｅ　ｅｌｅｃｔｒｏｄｅ１．　陶瓷基片ｃｅｒａｍｉｃ　ｓｕｂｓｔｒａｔｅ９．　外部电极ｏｕｔｅｒｔｅｒｍｉｎａｔｉｏｎ例１Ｅｘａｍｐｌｅ１：ＲＣＭＴ／ＲＣＭＬ／ＲＣＭＣ：例２Ｅｘａｍｐｌｅ２：ＭＬ０６／ＭＬ１２：ＴＨＩＣＫ　ＦＩＬＭ　ＣＨＩＰ　ＮＥＴＷＯＲＫＲＥＳＩＳＴＯＲ规格尺寸及等效电路　ＤＩＭＥＮＳＩＯＮＳＡＮＤＥＱＵＩＶＡＬＥＮＴＣＩＲＣＵＩＴ例１Ｅｘａｍｐｌｅ１：ＲＣＭＴ／ＲＣＭＬ／ＲＣＭＣ：Ｒ１Ｒ２Ｒ３Ｒ４Ｒ１＝Ｒ２＝Ｒ３＝Ｒ４Ｒ１Ｒ２Ｒ１＝Ｒ２例２Ｅｘａｍｐｌｅ　　２：ＭＬ０６／ＭＬ１２：ＳＲＲ１Ｒ５Ｒ１＝Ｒ２＝Ｒ３＝Ｒ４＝Ｒ５＝Ｒ６＝Ｒ７＝Ｒ８负荷下降曲线ＤＥＲＡＴＩＮＧＣＵＲＶＥ当电阻使用的环境温度超过７０℃时，其额定负荷（额定功率或额定电流）按上述曲线下降。

风华高新常规厚膜片式固定电阻器 R-6.1-1说明书

承认书APPROV AL SHEET客户名称:CUSTOMER品名：常规厚膜片式固定电阻器PARTNAME规格版本号VERSION日期DATE制造客户APPROV AL APPROV AL 拟制审核确认检验审核批准序号No目录TABLE OF CONTENTS1.0 概述Summary2.0 结构及尺寸Structure And Dimensions3.0 型号规格表示办法How To Order4.0 电气性能Performance Specification5.0 可靠性Reliability Data6.0 包装Package7.0 环保情况说明Environmental Protection Statement8.0 推荐使用的焊接曲线Recommended soldering profile9.0 使用注意事项Precautions For UseRC/RS□□□□1.0概述Summary片式电阻器主要生产的型号包括01005、0201、0402、0603、0805、1206、1210、2010、2512。

其特点是：The dimension type for chip resistor including01005、 0201、0402、0603、0805、1206、1210、2010、2512, and the features are as below:*体积小、重量轻miniature and light weight*电性能稳定，可靠性高 stable electrical capability and high reliability *机械强度高、高频特性优越superior mechanical and frequency*装配成本低，并与自动贴装设备匹配low assembly cost, suit for automatic SMT *适应再流焊与波峰焊suit for re-flow and wave flow soldering .*符合ROHS指令要求Compliant with ROHS Directive*符合无卤素要求Compliant with halogen free requirement*禁止使用SS-00259中规定的1级环境管理物质*SONY指定原材料只能从绿色伙伴认定供应商处采购产品广泛应用于计算机、通讯、工业自动化、航天航空、军事、数字电视、数字音响及消费类电子等领域。

合科泰常规厚膜片式电阻器规格书

1．品名的构成例如：RI0603L1003FTRI 0603 L 1003 F T2．结构1.外保护层2.字码印记3.内保护层4.阻体层5.导体层6.侧面导体层7.镀镍层8.镀锡层9. 陶瓷基体2 3 4 5 6 7 8 913．尺寸和电性参数4．字码4.1 （大于1Ω表示方法）*0201、0402 因电阻本体太小，固无印记表示。

*公差为±0.1%、±0.5%、±1%的用四位数表示，前三位表示有效数字，第四位表示乘幂（10V）。

例如1003=100X103=100X1000=100000Ω=100KΩ4703=470X103.=470X1000=470000Ω=470KΩ22R1=22.1Ω（R表示小数点）1R30=1.3Ω(R表示小数点，不足四位在后面加0)*公差为±2%、±5%、用三位数表示，前二位数表示有效数字，第三位数表示乘幂（10V）。

例如103=10X103=10X1000=10000Ω=10KΩ473=47X103.=47X1000=47000Ω=47KΩ1R3=1.3Ω（R表示小数点）*E96代码表示, 公差为±0.1%、±0.5%、±1%用三位数表示（仅对0603表示）例如02C=102X102=102X100=10200Ω=10.2KΩ15E=140X104=140X10000=1400000Ω=1.4MΩ*公差为±0.1%、±0.5%、±1%（仅对0603表示）在E-24 系列中,但不属于E-96系列的阻值,标示和±5%的公差相同,但是在字码下多加一条横线.例如：124=120K4.2 （小于1Ω表示方法）*0201、0402 因电阻本体太小，固无印记表示。

*公差为±0.1%、±0.5%、±1%的用四位数表示，R表示小数点。

例如R200=0.2ΩR002=0.002Ω*公差为±2%、±5%、用三位数表示，R表示小数点。

沃士达罗利克高功率厚膜片电阻器说明书

CRCW06032K20FKEAHPCRCW-HP e3Vishay DraloricPulse Proof, High Power Thick Film Chip ResistorsLINKS TO ADDITIONAL RESOURCESThe pulse proof, high power thick film chip resistors series is the perfect choice for most fields of power measurement electronics where reliability, stability, high power rating and excellent pulse load performance are of major concern. Typical applications include battery management systems in automotive appliances.FEATURES•Excellent pulse load capability •Enhanced power rating•Double side printed resistor element •AEC-Q200 qualified•Material categorization: for definitions of compliance please see /doc?99912APPLICATIONS•Automotive •Industrial •Commercial •High powerNotes(1)Please refer to APPLICATION INFORMATION below(2)CRCW0402-HP resistors feature a single side printed resistive layer only, except jumpers (3)Specified power rating requires a thermal resistance of R th≤ 110 K/W APPLICATION INFORMATIONWhen the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded.These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.3D 3D3D ModelsTECHNICAL SPECIFICATIONSDESCRIPTIONCRCW0402-HP e3CRCW0603-HP e3CRCW0805-HP e3CRCW1206-HP e3CRCW1210-HP e3CRCW1218-HP e3CRCW2010-HP e3CRCW2512-HP e3Imperial size 04020603080512061210121820102512Metric size code RR1005M RR1608M RR2012MRR3216M RR3225M RR3246M RR5025M RR6332M Resistance range 1 Ω to 1 M Ω; jumper (0 Ω)Resistance tolerance ± 5 %; ± 1 %; ± 0.5 %Temperature coefficient ± 200 ppm/K; ± 100 ppm/K Rated dissipation, P 70 (1)0.2 W (2)0.33 W 0.5 W 0.75 W (3)0.75 W 1.5 W 1.0 W 1.5 W Operating voltage, U max. AC RMS /DC 50 V 75 V 150 V 200 V 200 V 200 V 400 V 500 V Permissible film temperature, ϑF max. (1)155 °C Operating temperature range-55 °C to +155 °C Max. resistance change at P 70 for resistance range, |ΔR /R | after:1000 h ≤ 2.0 %8000 h ≤ 4.0 %Permissible voltage against ambient (insulation):1 min, U ins 75 V 100 V 200 V 300 V 300 V 300 V 300 V 300 VFailure rate: FIT observed ≤ 0.1 x 10-9/hCRCW-HP e3Vishay DraloricNote•The temperature coefficient of resistance (TCR) is not specified for 0 Ω jumpersTEMPERATURE COEFFICIENT AND RESISTANCE RANGETYPE / SIZE TCR TOLERANCERESISTANCE E-SERIES CRCW0402-HP e3± 200 ppm/K ± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 3 A ≤ 10 m Ω0 Ω-CRCW0603-HP e3± 200 ppm/K± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 5 A ≤ 8 m Ω0 Ω-CRCW0805-HP e3± 200 ppm/K± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 6 A ≤ 5 m Ω0 Ω-CRCW1206-HP e3± 200 ppm/K± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 10 A≤ 5 m Ω0 Ω-CRCW1210-HP e3± 200 ppm/K± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 12 A≤ 4 m Ω0 Ω-CRCW1218-HP e3± 200 ppm/K± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 20 A≤ 4 m Ω0 Ω-CRCW2010-HP e3± 200 ppm/K± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 12 A≤ 5 m Ω0 Ω-CRCW2512-HP e3± 200 ppm/K± 5 % 1 Ω to 1 M ΩE24± 100 ppm/K ± 1 % 1 Ω to 1 M ΩE24; E96± 0.5 %Jumper, I max. = 16 A≤ 5 m Ω0 Ω-PACKAGINGTYPE / SIZE CODE QUANTITY PACKAGING STYLEWIDTHPITCH PACKAGING DIMENSIONS CRCW0402-HP e3ED = ET710 000Paper tape acc. to IEC 60286-3, type 1a8 mm2 mmØ 180 mm / 7"EE = EF450 000Ø 330 mm / 13"CRCW0603-HP e3EI = ET25000 2 mmØ 180 mm / 7"ED = ET310 000Ø 180 mm / 7"EL = ET420 000Ø 285 mm / 11.25"EE = ET820 000Ø 330 mm / 13"EA = ET15000 4 mmØ 180 mm / 7"EB = ET510 000Ø 285 mm / 11.25"EC = ET620 000Ø 330 mm / 13"CRCW0805-HP e3EA = ET15000 4 mmØ 180 mm / 7"EB = ET510 000Ø 285 mm / 11.25"EC = ET620 000Ø 330 mm / 13"CRCW1206-HP e3EA = ET15000 4 mmØ 180 mm / 7"EB = ET510 000Ø 285 mm / 11.25"EC = ET620 000Ø 330 mm / 13"CRCW1210-HP e3EA = ET15000 4 mm Ø 180 mm / 7"EB = ET510 000Ø 285 mm / 11.25"EC = ET620 000Ø 330 mm / 13"CRCW1218-HP e3EK = ET94000Blister tape acc. to IEC 60286-3, type 2a12 mm4 mm Ø 180 mm / 7"CRCW2010-HP e3EF = E024000 4 mm Ø 180 mm / 7"EJ = E0816 000 4 mm Ø 330 mm / 13"CRCW2512-HP e3EG = E6720008 mm Ø 180 mm / 7"EH = E8240004 mmCRCW-HP e3 Vishay DraloricPART NUMBER AND PRODUCT DESCRIPTIONPart Number: CRCW0603562RFKEAHPPart Number: CRCW06030000Z0EAHPTYPE / SIZE VALUE TOLERANCE TCR PACKAGING SPECIALCRCW0402 CRCW0603 CRCW0805 CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512R = decimalK = thousandM = million0000 = jumperD = ± 0.5 %F = ± 1 %J = ± 5 %Z = jumperK = ± 100 ppm/KN = ± 200 ppm/K0 = jumperEAEBECEDEEEFEGEIEJEHEKELUp to 2 digitsHP = pulse proof,high powerProduct Description: CRCW0603-HP 100 562R 1 % ET1 e3Product Description: CRCW0603-HP 0R0 ET1 e3CRCW0603-HP100562R 1 %ET1e3 TYPE / SIZE TCR RESISTANCE VALUE TOLERANCE PACKAGING LEADCRCW0402-HP CRCW0603-HP CRCW0805-HP CRCW1206-HP CRCW1210-HP CRCW1218-HP CRCW2010-HP CRCW2512-HP ± 100 ppm/K± 200 ppm/K10R = 10 Ω562R = 562 Ω10K = 10 kΩ1M = 1 MΩ0R0 = jumper± 0.5 %± 1 %± 5 %ET1, ET2,ET3, ET4,ET5, ET6,ET7, ET8,ET9, EF4,E02, E08,E67, E82e3 = pure tinterminationfinishC R C W0603562R F K E A H PCRCW-HP e3 Vishay DraloricDESCRIPTIONProduction is strictly controlled and follows an extensive set of instructions established for reproducibility. A cermet film layer and a glass-over are deposited on both sides of a high grade (Al2O3) ceramic substrate with its prepared inner contacts on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating.The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a and Type 2a (1).ASSEMBLYThe resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system.The resistors are RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing.MATERIALSVishay acknowledges the following systems for the regulation of hazardous substances:•IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2)•The Global Automotive Declarable Substance List (GADSL) (3)•The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see /how/leadfree.Hence the products fully comply with the following directives:•2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II)•2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU•2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE)Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at /doc?49037.APPROVALSThe resistors are qualified according to AEC-Q200.Where applicable, the resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1, EN 60115-8 and the variety of environmental test procedures of the IEC 60068 (1) series.RELATED PRODUCTSF or more information about products with superior surge and pulse performance please refer to datasheet:D/CRCW-IF e3, Pulse Proof Thick Film Chip Resistors /doc?20024.For thick film resistors with standard requirements for power rating, please refer to datasheet:D/CRCW e3, Standard Thick Film Chip/doc?20035.For anti-surge products and high power rating, please refer to datasheet:RCS e3, Anti-Surge High Power Thick Film Chip Resistors /doc?20065.Notes(1)The quoted IEC standards are also released as EN standards with the same number and identical contents(2)The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474(3)The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at (4)The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-tableCRCW-HP e3Vishay DraloricFUNCTIONAL PERFORMANCESingle PulseMaximum pulse load, single pulse; applicable if → 0 and n < 1000 and Û ≤ Ûmax.;for permissible resistance change equivalent to 8000 h operationContinuous PulseMaximum pulse load, continuous pulses; applicable if ≤ P (ϑamb ) and Û ≤ Ûmax.;for permissible resistance change equivalent to 8000 h operation0.010.1110100100010 0000.0000010.000010.00010.0010.010.1110100^P m a x .-P u l s e L o a d (W )t i -Pulse Duration (s)P 0.010.1110100100010 0000.0000010.000010.00010.0010.010.1110100^P m a x .-P u l s e L o a d (W )t i -Pulse Duration (s)PCRCW-HP e3Vishay DraloricPulse VoltageMaximum pulse voltage, single and continuous pulses; applicable if ;for permissible resistance change equivalent to 8000 h operationDerating2004006008001000120014001600180020000.0000010.000010.00010.0010.010.1110^U m a x .-P u l s e V o l t a g e (V )t i -Pulse Duration (s)P ˆP ˆmax .≤00.20.40.60.81.01.21.41.61.8-70-60-50-40-30-20-10102030405060708090100110120130140150160P -P o w e r D i s s i p a t i o n (W )ϑamb -Ambient Temperature (°C)CRCW-HP e3Vishay DraloricTESTS AND REQUIREMENTSAll executed tests are carried out in accordance with the following specifications:EN 60115-1, generic specificationEN 60115-8 (successor of EN 140400), sectional specificationEN 140401-802, detail specification IEC 60068-2-xx, test methodsThe parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included.The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5201-1.The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied:Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 %Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days).The components are mounted for testing on boards in accordance with EN 60115-8, 2.4.2 unless otherwise specified.TEST PROCEDURES AND REQUIREMENTSEN 60115-1 CLAUSE IEC60068-2 (1)TESTMETHODTESTPROCEDUREREQUIREMENTSPERMISSIBLE CHANGE (ΔR )Stability for product types:STABILITY CLASS 2 OR BETTERCRCW-HP e31 Ω to 1 M Ω4.5-Resistance -± 0.5 %; ± 1 %; ± 5 %4.8-Temperature coefficient(20 / -55 / 20) °C and (20 / 155 / 20) °C ± 100 ppm/K; ± 200 ppm/K4.25.1-Endurance at 70 °CU = or U = U max.;whichever is the less severe;1.5 h on; 0.5 h off70 °C; 1000 h ± (2 % R + 0.1 Ω)70 °C; 8000 h± (4 % R + 0.1 Ω)4.25.3-Endurance at upper category temperature 155 °C, 1000 h ± (2 % R + 0.1 Ω)4.2478 (Cab)Damp heat,steady state (40 ± 2) °C; 56 days;(93 ± 3) % RH;± (1 % R + 0.05 Ω)4.3767 (Cy)Damp heat,steady state,accelerated (85 ± 2) °C; (85 ± 5) % RH;U = ≤ 100 V;1000 h± (2 % R + 0.1 Ω)4.23-Climatic sequence:-± (2 % R + 0.1 Ω)4.23.2 2 (Bb)dry heat 125 °C; 16 h 4.23.330 (Db)damp heat, cyclic55 °C; 24 h; ≥ 90 % RH;1 cycle4.23.4 1 (Ab)cold -55 °C; 2 h4.23.513 (M)low air pressure 8.5 kPa; 2 h; (25 ± 10) °C4.23.630 (Db)damp heat, cyclic55 °C; 24 h;≥ 90 % RH; 5 cycles4.23.7-DC load U = ≤ U max.; 1 min-1 (Aa)Cold-55 °C; 2 h± (0.5 % R + 0.05 Ω)P 70 x R 0.1 x P 85 x R P 70 x RCRCW-HP e3Vishay DraloricNote(1)The quoted IEC standards are also released as EN standards with the same number and identical contents4.1914 (Na)Rapid change of temperature 30 min at -55 °C and 30 min at 125 °C;1000 cycles ± (1 % R + 0.05 Ω)no visible damage 4.13-Short time overloadU = 2.5 x ≤ 2 x U max.;whichever is the less severe;5 s ± (2 % R + 0.05 Ω)4.27-Single pulse high voltage overload Severity no. 4:U = 10 x orU = 2 x U max.;whichever is the less severe;10 pulses 10 μs/700 μs ± (1 % R + 0.05 Ω)no visible damage4.39-Periodic electricoverload U = orU = 2 x U max.;whichever is the less severe;0.1 s on; 2.5 s off;1000 cycles ± (1 % R + 0.05 Ω)no visible damage4.38-Electrostatic discharge(human body model)IEC 61340-3-1 (1);3 pos. + 3 neg. discharges;ESD voltage acc. to the size ± (1 % R + 0.05 Ω)4.22 6 (Fc)VibrationEndurance by sweeping;10 Hz to 2000 Hz;no resonance;amplitude ≤ 1.5 mm or≤ 200 m/s 2;7.5 h ± (0.5 % R + 0.05 Ω)no visible damage4.1758 (Td)SolderabilitySolder bath method;Sn60Pb40non-activated flux;(235 ± 5) °C;(2 ± 0.2) s Good tinning (≥ 95 % covered)no visible damageSolder bath method;Sn96.5Ag3Cu0.5non-activated flux;(245 ± 5) °C;(3 ± 0.3) s 4.1858 (Td)Resistance to soldering heat Solder bath method(260 ± 5) °C;(10 ± 1) s ± (0.5 % R + 0.05 Ω)4.2945 (XA)Component solventresistanceIsopropyl alcohol;+50 °C; method 2No visible damage4.3221 (Uu 3)Shear (adhesion)CRCW0402-HP and CRCW0603-HP: 9 N No visible damageCRCW0805-HP to CRCW2512-HP: 45 N4.3321 (Uu 1)Substrate bending Depth 2 mm;3 times ± (0.25 % R + 0.05 Ω)no visible damage, no open circuit in bent position4.7-Voltage proof U = 1.4 x U ins ; 60 s No flashover or breakdown 4.35-Flammability,needle flame testIEC 60695-11-5 (1);10 sNo burning after 30 sTEST PROCEDURES AND REQUIREMENTSEN 60115-1 CLAUSE IEC60068-2 (1)TESTMETHODTESTPROCEDUREREQUIREMENTSPERMISSIBLE CHANGE (ΔR )Stability for product types:STABILITY CLASS 2 OR BETTERCRCW-HP e31 Ω to 1 M ΩP 70 x R P 70 x R 15 x P 70 x RCRCW-HP e3Vishay DraloricDIMENSIONSSOLDER PAD DIMENSIONSNotes•The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g in standards IEC 61188-5-x (1) or in publication IPC-7351.Still, the given solder pad dimensions will be found adequate for most general applications(1)The quoted IEC standards are also released as EN standards with the same number and identical contentsDIMENSIONS AND MASSTYPE / SIZE L (mm)W (mm)H (mm)T1(mm)T2(mm)MASS (mg)CRCW0402-HP e3 1.0 ± 0.050.5 ± 0.050.3 ± 0.100.25 ± 0.100.2 ± 0.100.65CRCW0603-HP e3 1.6 ± 0.100.85 ± 0.100.45 ± 0.100.3 ± 0.200.3 ± 0.202CRCW0805-HP e3 2.0 ± 0.15 1.25 ± 0.150.5 ± 0.100.4 ± 0.200.35 ± 0.20 5.5CRCW1206-HP e3 3.1 ± 0.20 1.6 ± 0.150.5 ± 0.150.5 ± 0.200.45 ± 0.2010CRCW1210-HP e3 3.2 ± 0.20 2.5 ± 0.200.6 ± 0.100.45 ± 0.200.4 ± 0.2018CRCW1218-HP e3 3.1 ± 0.20 4.6 ± 0.200.6 ± 0.100.45 ± 0.200.4 ± 0.2031CRCW2010-HP e3 5.0 ± 0.15 2.5 ± 0.150.6 ± 0.100.6 ± 0.200.6 ± 0.2025.5CRCW2512-HP e36.3 ± 0.203.15 ± 0.150.6 ± 0.100.6 ± 0.200.6 ± 0.2042RECOMMENDED SOLDER PAD DIMENSIONSTYPE / SIZE WAVE SOLDERINGREFLOW SOLDERING G (mm)Y (mm)X (mm)Z (mm)G (mm)Y (mm)X(mm)Z (mm)CRCW0402-HP e3----0.450.60.6 1.65CRCW0603-HP e30.65 1.10 1.25 2.850.750.75 1.00 2.25CRCW0805-HP e30.90 1.30 1.60 3.50 1.000.95 1.45 2.90CRCW1206-HP e3 1.40 1.40 1.95 4.20 1.50 1.05 1.8 3.60CRCW1210-HP e3 1.80 1.452.95 4.70 1.70 1.10 2.803.90CRCW1218-HP e3 1.60 1.50 5.104.60 1.70 1.10 4.90 3.90CRCW2010-HP e3 3.60 1.65 2.85 6.90 3.70 1.20 2.70 6.10CRCW2512-HP e34.901.603.508.105.001.253.357.50Legal Disclaimer Notice VishayDisclaimerALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROV E RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.V ishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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ALL RIGHTS RESERVEDRevision: 01-Jan-20221Document Number: 91000CRCW06032K20FKEAHP。

薄膜电阻_厚膜电阻_合金电阻_陶瓷电阻_概述说明

薄膜电阻厚膜电阻合金电阻陶瓷电阻概述说明1. 引言1.1 概述电阻是一种电子元件，用于控制和限制电流的流动。

薄膜电阻、厚膜电阻、合金电阻和陶瓷电阻是常见的几种类型。

本文将对这些电阻进行概述说明。

1.2 文章结构本文主要分为五个部分，分别介绍薄膜电阻、厚膜电阻、合金电阻和陶瓷电阻的定义和原理、特点和应用以及制备方法和工艺。

1.3 目的本文旨在向读者提供关于薄膜电阻、厚膜电阻、合金电阻和陶瓷电阻的基本知识，并介绍它们的应用领域和制备方法。

通过了解这些不同类型的电阻，读者可以更好地选择适合自己需求的电子元件，提高设计和应用效果。

引言部分内容结束。

2. 薄膜电阻：2.1 定义和原理：薄膜电阻是一种制造出非常薄的金属或合金膜的电阻器件。

它在基底上通过物理或化学方法形成，其厚度通常在几纳米到数微米之间。

这种电阻器件使用了薄膜材料的导电性质，其原理是利用导体中的自由电子传导电流时会遇到阻力而产生电阻。

2.2 特点和应用：薄膜电阻具有以下特点：- 精度高：由于制备过程中能够较好地控制材料的良好性质，因此可以实现较高的精度要求。

- 高频特性好：薄膜结构有助于降低元件内部的等效电感和等效电容，提高了元件在高频率下的响应速度。

- 温度系数恒定：根据所选用的材料类型和制备工艺，可以使温度系数保持相对恒定。

这些特点使得薄膜电阻广泛应用于各种领域，包括以下几个主要应用领域：- 通信设备：在无线通信设备中，薄膜电阻被用于控制和调节信号的电流和阻抗。

- 汽车电子：在汽车电子设备中，薄膜电阻常用于传感器、发动机系统以及车载娱乐等方面，起到精确测量和控制的作用。

- 工业自动化：在工业自动化领域，薄膜电阻用于测量和控制仪表、仪器以及各种传感器。

2.3 制备方法和工艺：生产薄膜电阻需要通过一系列特定工艺来实现。

以下是一些常见的制备方法：- 物理气相沉积（PVD）：利用物理手段将金属或合金材料以原子形式在基底上进行沉积，形成细小的颗粒并逐渐成为连续的薄膜结构。

贴片电阻生产工艺流程简介

贴片电阻生产工艺流程简介、引言贴片电阻(SMD Resistor)学名叫片式固定电阻器，是从Chip Fixed Resistor直接翻译而来的，特点是耐潮湿、耐高温、可靠度高、外观尺寸均匀，精确且温度系数与阻值公差小。

按生产工艺分厚膜片式电阻( Thick Film Chip Resistor)和薄膜片式电阻(Thin Film Chip Resistor)两种。

厚膜贴片电阻是采用丝网印刷将电阻性材料淀积在绝缘基体(例如氧化铝陶瓷)上，然后烧结形成的。

我们常见且我司在大量使用的基本都是厚膜片式电阻，精度范围在土0.5%~10之间，温度系数在土200ppm/C ~± 400ppm/C。

薄膜片式电阻，通常为金属薄膜电阻，是在真空中采用蒸发和溅射等工艺将电阻性材料溅镀(真空镀膜技术)在绝缘基体上制成，特点是温度系数低，温漂小，电阻精度高。

按封装分01005、0201、0402、0603、0805、1206、1210、2010、2512 等，其常见序列的精度为土1% ± 5%标准阻值有E24和E96序列，常见功率有1/20W、1/16W、1/8W、1/4W、1/2W、1W 等。

贴片电阻的结构贴片的电阻主要构造如下:三、贴片电阻生产工艺流程结构层主要成分①陶瓷基片三氧化二铝2 3Substrate AI2O3②面电极Face Electrode③背电极Reverse Electrode④电阻体Resistive Eleme nt⑤一次保护层1st protective coating⑥二次保护层2st protective coating⑦标记Marki ng⑧端电极Term in ati on⑨中间电极Betwee nTerm in ati on银-钯电极Ag-Pd银电极Ag氧化钉、玻璃Ruthe nium oxide ,glass玻璃Glass玻璃/树脂Glass / Resin玻璃/树脂Glass / Resin银电极/镍铬合金Ag / Ni-Cr镍层Ni Plat ing锡层Sn Plat ing1. 生产流程常规厚膜片式电阻的完整生产流程大致如下:2 .生产工艺原理及 CTQ针对上述的厚膜片式电阻生产流程中的相关生产工序的功能原理及 CTQ 介绍如下。

厚膜片式固定电阻器

W 8பைடு நூலகம்00±0.20 8.00±0.20 8.00±0.20 8.00±0.20 8.00±0.20
P1 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05
F 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05
D0 1.50±0.10 1.50±0.10 1.50±0.10 1.50±0.10 1.50±0.10
E 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10
T
0.60max 0.60±0.10 0.75±0.10 0.75±0.10 0.75±0.10
广州总部地址：广州经济技术开发区西区创业路三号同兴大厦四楼华东区办事处：南京市玄武区墨香路３０号墨香山庄３２幢３单元５０５室公司网址：ｈｔｔｐ：／／ｗｗｗ．ｇｚ－ｓｕｎｂｅａｍ．ｃｏｍ
广州创天电子科技有限公司
塑料带
型号
1812 2010 2512
型号 1812 2010 2512 卷盘：
F ↓ 电阻值误差
F：±1％ G：±2％ J：±5％ K：±10％
T ↓ 包装方式
T：编带 B：散包装
广州创天电子科技有限公司华东区销售工程师：王竹生ＱＱ：１８０６１８８０１１６
ＴＥＬ：１８６５１６０４８８１１８０６１８８０１１６
传真：０２５－８６７０１６００（南京）邮箱：ｗａｎｇ．ｚｈｕ．ｓｈｅｎｇ．＠ｆｏｘｍａｉｌ
0402
0603 0805 1206 1210
1812 2010 2512
0402
0603 0805 1206

三叶源-常规厚膜片式固定电阻器-产品说明书

2018产品说明书PRODUCT MANUAL深圳市叁叶源主要生产被动元器件SMD R‐Chip 电阻，产品尺寸：0402‐1206，阻值范围：1‐22兆欧姆，产品具有高可靠性电极设计、兼容所有焊接制程等特点。

Administrator深圳市叁叶源电子有限公司2018/6/1目录Contents●特点Features3●品名构成Type Designation3●结构Construction4●规格尺寸Dimensions4●负荷下降曲线Derating Curve4●额定值Ratings5●常规TCR值5●高精度TCR±50额定值6●特性Characteristics6●推荐焊盘尺寸Recommend Solder Pad Size9●包装Packaging9●IEC E-24、E-96系列电阻值代码对照表12●厚膜电阻阻值代码及标记规则14●片式电阻器使用说明16●焊接Soldering17■常规厚膜片式固定电阻器General Thick Film Chip Fixed Resistor●特点Features体积小、重量轻Miniature and light weight 适应再流焊与波峰焊Suit for reflow and wave flow solder 电性能稳定，可靠性高Stable electrical capability,high reliability 装配成本低，并与自动贴装设备匹配Low assembly cost,suit for automatic SMT equipment 机械强度高，高频特性优越Superior mechanical and frequency characteristics 符合RoHS 指令要求Compliant with RoHS directive 符合无卤素Halogen free requirement●品名构成Type Designation Single Chip ResistorSY 0402J N 100R P (1)(2)(3)(4)(5)(6)(1)(2)(3)(4)(5)(6)SeriesSize Reslstance Toleiance TCRResistance Packing style SY Thinck Film ST Thinck FilmSA Atuomotive Garde0402060308051206B=±0.1%D=±0.5%F=±1%J=±5%N=Base on Spc E=±50ppm/℃D=±25ppm/℃F=±100ppm/℃G=±200ppm/℃1K 100K 10R 4K71MP=Pager TapeB=Embossed Plastic●结构Construction①陶瓷基板Ceramic Substrate ②背电极Bottom Electrode ③面电极Top Electrode ④电阻体Resistor Layer ⑤一次保护Primary Overcoat ⑥二次保护Secondary Overcoat ⑦端电极Edge Electrode ⑧中间电极Barrier Layer ⑨外部电极External Electrode●规格尺寸Dimensions型号Type 尺寸Dimensions(mm)L W t a b 0402 1.00±0.100.50±0.050.35±0.050.20±0.100.25±0.100603 1.60±0.100.80±0.100.45±0.100.30±0.200.30±0.200805 2.00±0.15 1.25+0.15-0.100.55±0.100.40±0.200.40±0.2012063.10±0.151.55+0.15-0.100.55±0.100.45±0.200.45±0.20●负荷下降曲线Derating Curve额定负荷百分比Percent Rated Load环境温度Ambient temperature(℃)使用温度范围：OperatingTemperature Range:①-55℃~125℃②-55℃~155℃注1：图中曲线适用于适用于0402、0603、0805、1206。

贴片电阻规格、封装、尺寸

贴片电阻规格、封装、尺寸ChipR Dimensions 、Footprint简述基本结构分类规格、封装、尺寸额定功率及工作电压阻值,标准阻值标识规格书、生产厂家命名方法价格、报价创建时间：2005-12-30 最后修改时间：2006-10-29贴片电阻套件为方便学生、研发人员试验和产品试制，特推出片式电阻系列套件。

简述我们常说的贴片电阻(SMD Resistor)叫"片式固定电阻器"(Chip Fixed Resistor)，又叫"矩形片状电阻"(Rectangular Chip Resistors)，是由ROHM公司发明并最早推出市场的。

特点是耐潮湿，耐高温，可靠度高，外观尺寸均匀，精确且温度系数与阻值公差小。

按生产工艺分厚膜(Thick Film Chip Resistors)、薄膜(Thin Film Chip Resistors )两种。

厚膜是采用丝网印刷将电阻性材料淀积在绝缘基体(例如玻璃或氧化铝陶瓷)上，然后烧结形成的。

我们通常所见的多为厚膜片式电阻，精度范围±0.5% ~ 10%，温度系数:±50PPM/℃~ ±400PPM/℃。

薄膜是在真空中采用蒸发和溅射等工艺将电阻性材料淀积在绝缘基体工艺(真空镀膜技术)制成，特点是低温度系数(±5PPM/℃)，高精度(±0.01%～±1%)。

封装有：0201，0402，0603，0805，1206，1210，1812，2010，2512。

其常规系列的精度为5%，1%。

阻值范围从0.1欧姆到20M欧姆。

标准阻值有E24，E96系列。

功率有1/20W、1/16W、1/8W、1/10W、1/4W、1/2W、1W。

特性：•体积小，重量轻•适合波峰焊和回流焊•机械强度高，高频特性优越•常用规格价格比传统的引线电阻还便宜•生产成本低，配合自动贴片机，适合现代电子产品规模化生产使用状况：由于价格便宜，生产方便，能大面积减少PCB面积，减少产品外观尺寸，现在已取代绝大部分传统引线电阻。

厚膜片式电阻器、厚膜片式网络电阻器 MSDS

产品安全数据说明书MATERIAL SAFETY DATA SHEET1、产品及公司信息Product and Company Identification产品名称：厚膜片式电阻器/厚膜片式网络电阻器Product Name: Thick Film Chip Fixed Resistor/ Thick Film Chip Fixed Network Resistor供应商名称：广东风华高新科技股份有限公司端华片式电阻器分公司Supplier Name: Guangdong Fenghua Advanced Technology (Holding)Co.,Ltd. Duanhua Chip Resistor BranchCompany地址：中国广东省肇庆市风华路18号风华电子工业园Address: Fenghua Electronic Industrial City, 18th Fenghua Road, Zhaoqing, Guangdong, China联系电话(Tel)：+86-758-6923225/6923477传真(Fax)：+86-758-28656072、材料成分信息Composition/Information on Ingredients化学性质：固体，非化学品Chemical Character: Solid, not chemical productCAS编号：不适用CAS No: Not applicable化学成分Chemical Ingredients：成分Materials CAS# Weigh %三氧化二铝Aluminum trioxide 1344-28-1 77~85%氧化镁 Magnesium oxide 1309-48-4 1.3～1.5%氧化钙 Calcium oxide 1305-78-8 0.2～0.3%石英玻璃 Silicon dioxide 7631-86-9 1.6~1.8%银 Silver 7440-22-4 1.5~2.8%＜0.1%钯Palladium 7440-05-3氧化硅Silicon oxide 11126-22-0 0.3~0.8%三氧化二铋Bismuth trioxide 1304-76-3 0.6~1.2%氧化钌Ruthenium dioxide 12036-10-1 0.1%~0.4%钌酸铅Dilead diruthenium hexaoxide 37194-88-0 ＜0.2%氧化铅（玻璃釉中的）PbO（in glass） 1317-36-8 ＜0.2%炭黑Carbon black 1333-86-4 ＜0.1%0.1~0.2% 云母Talc 14807-96-6三氧化二铬Chromium oxide 1308-38-9 ＜0.1%环氧树脂Epoxy Resin 1675-54-3 0.4~1.0%酚醛树脂Phenolic Resin 9003-35-4 0.1~0.4%二氧化硅 Silicon dioxide 60676-86-0 0.5~1.0%油墨Epoxy resin 25085-99-8 ＜0.2%氧化钛Titanium dioxide 13463-67-7 ＜0.1%镍 Nickel 7440-02-0 3.5~6.5%＜0.1%铬Chromium 7440-47-3锡 Tin 7440-31-5 2.1~3.6%3、危害性信息Hazards Identification有害物质分类规定：不适用Hazards Material Classification: Not Applicable理化特性：固体，非化学品Physical and Chemical Character: Solid, not chemical product人体危害性：无危害Human Health Hazards: Not Applicable环境危害性：无相关资料Environmental Hazards: No relevant information found.4、急救方法First Aid Measures此类产品常态下极其稳定，无刺激性，一般不需急救。

常规厚膜片式固定电阻器

FEATURESGENERAL THICK FILM CHIP FIXED RESISTORRoHSTYPE DESIGNATIONExampleGENERAL THICK FILM CHIP FIXED RESISTORMiniature and light weight.Suit for reflow and wave flow solder.Stable electrical capability,high reliability.Low assembly cost,suit for automatic SMT equipment.Superior mechanical and frequency characteristics.RoHS compliantCONSTRUCTION AND DIMENSIONLaWtbunit:mmAPPEARANCE,The surface of resistor is covered with Protective Coating which hard to fade,and the surface of coating should avoid unevenness.The terminal part is covered equable ,the plating is hard to fade,and should avoid unevenness,flaw,pinhole and discoloration.With a clear mark ,the resistor body is crack-free.REFERENCE STANDARDGB/T 5729-2003GB/T 9546-1995DERATING CURVE70()For resistors operated in ambient over 70,rated load (power rating or current rating)shall be deratedin accordance with the above figure.1007550-55-50-25255075100125175Ambient temperature()P e r c e n t r a t e d l o a dGENERAL THICK FILM CHIP FIXED RESISTOR150RATINGSPACKAGINGTape and reelPaper taping 02010402GENERAL THICK FILM CHIP FIXED RESISTOR0603080512061210Embossed tapingP P1W FEA0B0D0P0D1tA0K0K0B0tP P1WFEABD0P0TRemark:For0201type,T1refers to the hole depth of paper carrier tape,T refers to the thickness of the paper carrier tape.ReelDMWTGENERAL THICK FILM CHIP FIXED RESISTORBulk casePACKAGING QUANTITYunit:mm110313612GENERAL THICK FILM CHIP FIXED RESISTORThe Explanation For The Resistance Value MarkingIEC E-24E-96IEC E-24E-96Series Resistance Cross-reference ListE-24E-24series10nunit1101001K10K100K1M10MTable oneE-2410E-24series:Express resistance value on the glass side with three digits,the first tow digits should be significant and the third one denote number of zeros.ExampleE-96Example0603E-96For the dimension type of 0603,express the resistance value with three code,the first two digit code denote the resistance of E-96series,and the third code of letter denote the multiplier (see the table three and four ).ExampleR The decimal point should be expressed by .R ExampleThe jumper should be expressed by 0Example02010402For the dimension type of 02010402,there is no mark on the glass side.ExampleIEC IEC E-24For the resistancewhich don't belong to IEC serial,use the resistance of IEC serial which is most close to the required resistance of non-IEC serial for replacement.To get agreement by both party if there special requirement for the marking.10K100K2M5.610E-96series:For the dimension type of 0805,1206,12102010,2512express the resistance value with four digits,the first three digits are significant figures and the fourth denotes the number of zeros.,GENERAL THICK FILM CHIP FIXED RESISTOR Table threeE-96E-96series resistance value codeTable fourMultiplied code11。

厚膜片式固定电阻ThickFilmResistor

厚声贴片电阻规格中文版

风华产品-电阻汇总

贴片电阻规格、封装、尺寸00249

厚膜片式跨接电阻器

电阻基础知识学习资料

贴片电阻、厚膜电阻以及薄膜电阻的可靠性评估

厚膜片式网络电阻器

风华高新 常规厚膜片式固定电阻器 R-6.1-1说明书

合科泰常规厚膜片式电阻器规格书

沃士达罗利克高功率厚膜片电阻器说明书

薄膜电阻_厚膜电阻_合金电阻_陶瓷电阻_概述说明

贴片电阻生产工艺流程简介

厚膜片式固定电阻器

三叶源-常规厚膜片式固定电阻器-产品说明书

贴片电阻规格、封装、尺寸

厚膜片式电阻器、厚膜片式网络电阻器 MSDS

常规厚膜片式固定电阻器

风华高新常规厚膜片式固定电阻器 R-6.1-1说明书