EV2360DG-00B中文资料
AT28HC64B高性能电擦可编程只读存储器（EEPROM）说明书
Features Array•Fast Read Access Time – 70 ns•Automatic Page Write Operation–Internal Address and Data Latches for 64 Bytes•Fast Write Cycle Times–Page Write Cycle Time: 10 ms Maximum (Standard)2 ms Maximum (Option – Ref. AT28HC64BF Datasheet)–1 to 64-byte Page Write Operation•Low Power Dissipation–40 mA Active Current–100µA CMOS Standby Current•Hardware and Software Data Protection•DATA Polling and Toggle Bit for End of Write Detection•High Reliability CMOS Technology–Endurance: 100,000 Cycles–Data Retention: 10 Years•Single 5 V ±10% Supply•CMOS and TTL Compatible Inputs and Outputs•JEDEC Approved Byte-wide Pinout•Industrial Temperature Ranges•Green (Pb/Halide-free) Packaging Option Only1.DescriptionThe AT28HC64B is a high-performance electrically-erasable and programmable read-only memory (EEPROM). Its 64K of memory is organized as 8,192 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 55 ns with power dissipation of just 220 mW. When the device is deselected, the CMOS standby current is less than 100µA.The AT28HC64B is accessed like a Static RAM for the read or write cycle without the need for external components. The device contains a 64-byte page register to allow writing of up to 64 bytes simultaneously. During a write cycle, the addresses and 1 to 64 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a write cycle, the device will automatically write the latched data using an internal control timer. The end of a write cycle can be detected by DATA polling of I/O7. Once the end of a write cycle has been detected, a new access for a read or write can begin.Atmel’s AT28HC64B has additional features to ensure high quality and manufactura-bility. The device utilizes internal error correction for extended endurance and improved data retention characteristics. An optional software data protection mecha-nism is available to guard against inadvertent writes. The device also includes anextra 64 bytes of EEPROM for device identification or tracking.20274L–PEEPR–2/3/09AT28HC64B2.Pin Configurations2.128-lead SOIC Top ViewPin Name Function A0 - A12Addresses CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7Data Inputs/Outputs NC No Connect DCDon’t Connect2.232-lead PLCC Top ViewNote:PLCC package pins 1 and 17 are Don’t Connect.2.328-lead TSOP Top View30274L–PEEPR–2/3/09AT28HC64B3.Block Diagram4.Device Operation4.1ReadThe AT28HC64B is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the out-puts. The outputs are put in the high-impedance state when either CE or OE is high. This dual line control gives designers flexibility in preventing bus contention in their systems.4.2Byte WriteA low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. Once a byte write has been started, it will automatically time itself to completion. Once a programming operation has been initiated and for the duration of t WC , a read operation will effectively be a polling operation.4.3Page WriteThe page write operation of the AT28HC64B allows 1 to 64 bytes of data to be written into the device during a single internal programming period. A page write operation is initiated in the same manner as a byte write; after the first byte is written, it can then be followed by 1 to 63 additional bytes. Each successive byte must be loaded within 150 µs (t BLC ) of the previous byte. If the t BLC limit is exceeded, the AT28HC64B will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as defined by the state of the A6 to A12 inputs. For each WE high-to-low transition during the page write operation, A6 to A12 must be the same.The A0 to A5 inputs specify which bytes within the page are to be written. The bytes may be loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur.4.4DATA PollingThe AT28HC64B features DATA Polling to indicate the end of a write cycle. During a byte or page write cycle, an attempted read of the last byte written will result in the complement of the written data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all outputs, and the next write cycle may begin. DATA Polling may begin at any time during the write cycle.40274L–PEEPR–2/3/09AT28HC64B4.5Toggle BitIn addition to DATA Polling, the AT28HC64B provides another method for determining the end of a write cycle. During the write operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling, and valid data will be read. Toggle bit reading may begin at any time during the write cycle.4.6Data ProtectionIf precautions are not taken, inadvertent writes may occur during transitions of the host system power supply. Atmel ® has incorporated both hardware and software features that will protect the memory against inadvertent writes.4.6.1Hardware ProtectionHardware features protect against inadvertent writes to the AT28HC64B in the following ways: (a) V CC sense – if V CC is below 3.8 V (typical), the write function is inhibited; (b) V CC power-on delay – once V CC has reached 3.8 V, the device will automatically time out 5 ms (typical) before allowing a write; (c) write inhibit – holding any one of OE low, CE high or WE high inhib-its write cycles; and (d) noise filter – pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a write cycle.4.6.2Software Data ProtectionA software-controlled data protection feature has been implemented on the AT28HC64B. When enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28HC64B is shipped from Atmel with SDP disabled.SDP is enabled by the user issuing a series of three write commands in which three specific bytes of data are written to three specific addresses (refer to the “Software Data Protection Algorithm” diagram on page 10). After writing the 3-byte command sequence and waiting t WC , the entire AT28HC64B will be protected against inadvertent writes. It should be noted that even after SDP is enabled, the user may still perform a byte or page write to the AT28HC64B. This is done by preceding the data to be written by the same 3-byte command sequence used to enable SDP.Once set, SDP remains active unless the disable command sequence is issued. Power transi-tions do not disable SDP, and SDP protects the AT28HC64B during power-up and power-down conditions. All command sequences must conform to the page write timing specifica-tions. The data in the enable and disable command sequences is not actually written into the device; their addresses may still be written with user data in either a byte or page write operation.After setting SDP, any attempt to write to the device without the 3-byte command sequence will start the internal write timers. No data will be written to the device, however. For the dura-tion of t WC , read operations will effectively be polling operations.4.7Device IdentificationAn extra 64 bytes of EEPROM memory are available to the user for device identification. By raising A9 to 12 V ±0.5 V and using address locations 1FC0H to 1FFFH, the additional bytes may be written to or read from in the same manner as the regular memory array.50274L–PEEPR–2/3/09AT28HC64BNotes:1.X can be VIL or VIH.2.See “AC Write Waveforms” on page 8.3.VH = 12.0 V ±0.5 V.Note:1.I SB1 and I SB2 for the 55 ns part is 40 mA maximum.5.DC and AC Operating RangeAT28HC64B-70AT28HC64B-90AT28HC64B-120Operating Temperature (Case)-40°C - 85°C -40°C - 85°C -40°C - 85°C V CC Power Supply5 V ±10%5 V ±10%5 V ±10%6.Operating ModesMode CE OE WE I/O Read V IL V IL V IH D OUT Write (2)V IL V IH V IL D IN Standby/Write Inhibit V IH X (1)X High ZWrite Inhibit X X V IH Write Inhibit X V IL X Output Disable X V IH XHigh ZChip Erase V ILV H (3)V IL High Z7.Absolute Maximum Ratings*Temperature Under Bias................................-55°C to +125°C *NOTICE:Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam-age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliabilityStorage Temperature.....................................-65°C to +150°C All Input Voltages(including NC Pins)with Respect to Ground.................................-0.6 V to +6.25 V All Output Voltageswith Respect to Ground...........................-0.6 V to V CC + 0.6 V Voltage on OE and A9with Respect to Ground..................................-0.6 V to +13.5V8.DC CharacteristicsSymbol Parameter ConditionMinMax Units I LI Input Load Current V IN = 0 V to V CC + 1 V 10µA I LO Output Leakage Current V I/O = 0 V to V CC10µA I SB1V CC Standby Current CMOS CE = V CC - 0.3 V to V CC + 1 V 100(1)µA I SB2V CC Standby Current TTL CE = 2.0 V to V CC + 1 V 2(1)mA I CC V CC Active Current f = 5 MHz; I OUT = 0 mA40mA V IL Input Low Voltage 0.8V V IH Input High Voltage 2.0V V OL Output Low Voltage I OL = 2.1 mA 0.40V V OH Output High VoltageI OH = -400 µA2.4V60274L–PEEPR–2/3/09AT28HC64B10.AC Read Waveforms (1)(2)(3)(4)Notes:1.CE may be delayed up to t ACC - t CE after the address transition without impact on t ACC .2.OE may be delayed up to t CE - t OE after the falling edge of CE without impact on t CE or by t ACC - t OE after an address changewithout impact on t ACC .3.t DF is specified from OE or CE whichever occurs first (C L = 5 pF).4.This parameter is characterized and is not 100% tested.9.AC Read CharacteristicsSymbol ParameterAT28HC64B-70AT28HC64B-90AT28HC64B-120Units MinMax MinMax MinMax t ACC Address to Output Delay 7090120ns t CE (1)CE to Output Delay 7090120ns t OE (2)OE to Output Delay 035040050ns t DF (3)(4)OE to Output Float 035040050ns t OHOutput Hold00ns70274L–PEEPR–2/3/09AT28HC64B11.Input Test Waveforms and Measurement Level12.Output Test LoadNote:1.This parameter is characterized and is not 100% tested.R F 13.Pin Capacitancef = 1 MHz, T = 25°C (1)Symbol Typ Max Units Conditions C IN 46pF V IN = 0 V C OUT 812pFV OUT = 0 V815.AC Write Waveforms15.1WE Controlled15.2CE Controlled14.AC Write CharacteristicsSymbol ParameterMin MaxUnits t AS , t OES Address, OE Setup Time 0ns t AH Address Hold Time 50ns t CS Chip Select Setup Time 0ns t CH Chip Select Hold Time 0ns t WP Write Pulse Width (WE or CE)100ns t DS Data Setup Time 50ns t DH , t OEHData, OE Hold Timens90274L–PEEPR–2/3/09AT28HC64B17.Page Mode Write Waveforms (1)(2)Notes: 1.A6 through A12 must specify the same page address during each high to low transition of WE (or CE).2.OE must be high only when WE and CE are both low.18.Chip Erase Waveformst S = t H = 5 µs (min.)t W = 10 ms (min.)V H = 12.0 V ±0.5 V16.Page Mode CharacteristicsSymbol Parameter MinMax Units t WC Write Cycle Time10ms t WC Write Cycle Time (Use AT28HC64BF))2ms t AS Address Setup Time 0ns t AH Address Hold Time 50ns t DS Data Setup Time 50ns t DH Data Hold Time 0ns t WP Write Pulse Width 100ns t BLC Byte Load Cycle Time 150µs t WPHWrite Pulse Width High50ns100274L–PEEPR–2/3/09AT28HC64B19.Software Data Protection EnableAlgorithm (1)Notes:1.Data Format: I/O7 - I/O0 (Hex);Address Format: A12 - A0 (Hex).2.Write Protect state will be activated at end of writeeven if no other data is loaded.3.Write Protect state will be deactivated at end of writeperiod even if no other data is loaded.4.1 to 64 bytes of data are loaded.20.Software Data Protection DisableAlgorithm (1)Notes:1.Data Format: I/O7 - I/O0 (Hex);Address Format: A12 - A0 (Hex).2.Write Protect state will be activated at end of writeeven if no other data is loaded.3.Write Protect state will be deactivated at end of writeperiod even if no other data is loaded.4. 1 to 64 bytes of data are loaded.21.Software Protected Write Cycle Waveforms (1)(2)Notes:1.A6 through A12 must specify the same page address during each high to low transition of WE (or CE) after the softwarecode has been entered.2.OE must be high only when WE and CE are both low.11AT28HC64BNote:1.These parameters are characterized and not 100% tested. See “AC Read Characteristics” on page 6.23.Data Polling WaveformsNotes:1.These parameters are characterized and not 100% tested.2.See “AC Read Characteristics” on page 6.25.Toggle Bit Waveforms (1)(2)(3)Notes: 1.Toggling either OE or CE or both OE and CE will operate toggle bit.2.Beginning and ending state of I/O6 will vary.3.Any address location may be used, but the address should not vary.22.Data Polling Characteristics (1)Symbol Parameter Min TypMaxUnits t DH Data Hold Time 0ns t OEH OE Hold Time 0ns t OE OE to Output Delay (1)ns t WR Write Recovery Timens24.Toggle Bit Characteristics (1)Symbol Parameter Min TypMaxUnits t DH Data Hold Time 10ns t OEH OE Hold Time 10ns t OE OE to Output Delay (2)ns t OEHP OE High Pulse 150ns t WR Write Recovery Timens12AT28HC64B26.Normalized I CCGraphs13AT28HC64B27.Ordering Information27.1Green Package Option (Pb/Halide-free)t ACC (ns)I CC (mA)Ordering Code Package Operation RangeActive Standby 70400.1AT28HC64B-70TU 28T Industrial (-40°C to 85°C)AT28HC64B-70JU 32J AT28HC64B-70SU 28S 90400.1AT28HC64B-90JU 32J AT28HC64B-90SU 28S AT28HC64B-90TU 28T 120400.1AT28HC64B-12JU 32J AT28HC64B-12SU28SPackage Type32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)28S 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)28T28-lead, Plastic Thin Small Outline Package (TSOP)27.2Die ProductsContact Atmel Sales for die sales options.28.Packaging Information 28.132J – PLCC14AT28HC64BAT28HC64B 28.228S – SOIC1528.328T – TSOP16AT28HC64BHeadquarters InternationalAtmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USATel: 1(408) 441-0311 Fax: 1(408) 487-2600Atmel AsiaUnit 1-5 & 16, 19/FBEA Tower, Millennium City 5418 Kwun Tong RoadKwun Tong, KowloonHong KongTel: (852) 2245-6100Fax: (852) 2722-1369Atmel EuropeLe Krebs8, Rue Jean-Pierre TimbaudBP 30978054 Saint-Quentin-en-Yvelines CedexFranceTel: (33) 1-30-60-70-00Fax: (33) 1-30-60-71-11Atmel Japan9F, Tonetsu Shinkawa Bldg.1-24-8 ShinkawaChuo-ku, Tokyo 104-0033JapanTel: (81) 3-3523-3551Fax: (81) 3-3523-7581Product ContactWeb SiteTechnical Support******************Sales Contact/contactsLiterature Requests/literatureDisclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.© 2009 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.。
(改)威步产品目录2011.03(1) ZLMICRO半导体品牌
Low ESR Caps Compatible High Speed LDO Voltage Regulators with ON/OFF Switch High Current, High Speed LDO Regulators 3A 150KHZ PWM Buck DC/DC Converter 2A 150KHZ PWM Buck DC/DC Converter Low-Power DC/DC Boost Converter In SOT-23 And Son Packages Multiple Voltage Regulator
EEPROM
K24C01 K24C02 K24C04 K24C08 K24C16 K24C32 K24C64
RDS解码
AT6588 AT6579 BU1924
锁相环
AT9256 AT9257 LC72131
LCD驱动
HL1621 ZL LP6578 ZL75823A ZL75823B ZL75823C ZL75824 Temp Sensor DS3501 新增产品 MP2259 MP2359DJ AD9943 TW2868 TW2867 ZLIA171 K24C256
step-up DC/DC converter is optimized for driving OLEDs or white LEDs inductor-based DC/DC boost converter designed to drive LED Arrays 1.3A Fixed Frequency White LED Driver 1.3A Fixed Frequency white LED Driver 3A, 28V, 385KHz Step-Down Converter 250mW Dual Channel Audio Power Amplifier With Shutdown 1 Watt Audio Power Amplifier Dual 2.2w Audio Amplifier Plus Stereo Headphone Function 1.1W Audio Power Amplifier With Shutdown Mode 5X5W Amplifier With DC Volume Control 2x6W Stereo Power Amplifier 4X35W Quad Bridge Car Radio Amplifier 4X45W Quad Bridge Car Radio Amplifier 4X41W Quad Bridge Car Radio Amplifier 4-Channel Audio Processor IC 4 channels sound effect processor 4 channels sound effect processor Car radio multimedia signal processor (CMSP) 3 Band Car Audio Processor 3 Band Car Audio Processor Car Audio Processor Sound Processor for car audio SigmaDSP® 28/56-Bit Audio Processor with 2ADC/4DAC SigmaDSP® 28/56-Bit Audio Processor with 2ADC/4DAC 3-Input Video Switch 3-Input Video Switch With 75Ω Driver 8-Input,6-Output Video Switch Matrix With Output Drivers,Input clamp,and Bias Circuitry 12-Input,9-Output Video Switch Matrix With Input clamp,Input Bias Circuitry,and Output Drivers 10-Bit, 4× Oversampling SDTV Video Decoder
三星AMOLED驱动芯片中文版说明书
表 5 所示为其他端口。 Symbol I/O 功能描述 DUMMYR[3:1] 电阻测量管脚，正常情况下悬空。 DUMMYL[3:1] DUMMY 无用管脚，悬空即可。 V0/V63 O 伽玛电压镜像管脚。 VDD3DUM O 内部与 VDD3 接在一起。
VSSDUM FUSE_EN RTEST EN_EXCLK EN_CLK TEST_MODE[1:0] TEST_IN[6:0] TE TEST_OUT[2:0]
表 2 系统接口
表3为 Symbol MDP MDN MSP MSN GPIO[9:0] (DB[17:8]) S_CSB(DB [7])
MDDI 管脚作用。 I/O 功能描述 I/O MDDI 数据输入/输出正端，如果 MDDI 不用，该端口悬空。 I/O MDDI 数据输入/输出负端，如果 MDDI 不用，该端口悬空。 I MDDI 数据选通输入正端，如果 MDDI 不用，该端口悬空。 I MDDI 数据选通输入负端，如果 MDDI 不用，该端口悬空。 I/O 总体输入输出，如果在 MDDI 中没有用 GPIO 的话，这些管 脚应该置地。 O 子屏幕驱动 IC 片选信号。 低电平时说明子屏幕驱动 IC 可用，高电平时说明子屏幕驱动
表 1 电源接口
如表 2 所示为系统接口。 Symbol I/O 功能描述 S_PB I 选择 CPU 接口模式，低电平时为并行接口，高电平时为串行 接口。 MDDI_E I 选择 MDDI 接口，低电平时 MDDI 接口不可用，高电平时 N MDDI 接口可用。 ID_MIB I 选择 CPU 种类， 低电平为 intel 80 系列 CPU， 高电平为 motorola 68 系列 CPU，如果 S_PB 是高电平，该端口为 ID 设置端口。 CSB I 片选信号，低电平芯片可用，高电平芯片不可用。 RS I 寄存器选择管脚。 低电平时，指令/状态，高电平时为指令参数/RAM 数据。 不用时需与 VDD3 接在一起。 RW_WR I 管脚作用 CPU 种类 管脚说明 B/SCL RW 68 系列 读写选择，低电平写，高电平读。 WRB 80 系列 写选通作用，在上升沿捕获数据。 SCL 串行接口 时钟同步信号。 E_RDB I 管脚作用 CPU 种类 管脚说明 E 68 系列 读写操作使能端。 RDB 80 系列 读选通作用，低电平时读出数据。 选择串行模式时，将此端口接在 VDD3 上。 SDI I 串行接口的数据输入接口，在 SCL 上升沿捕捉到输入数据，
6300B系列工业计算机产品选择指南说明书
1 x bootable CFast SATA III slot on board with external rear access 1 x onboard connector for direct insertion of M.2 2242 / 2280 SSD key M PCIex4 2 x onboard connector for 2.5 in. SSD/HDD SATA III 1 or 2 x extractable drawers for 2.5 in. units
Dual 4K Quad core Intel Atom x7-E3950 4 GB
1 x RS232 (DB9M)
1 x DVI-D
2 x PCIe x 4 or 1 x PCI + 1 x PCIe x4 (5 Gb/s), max 10W total
24V DC (18…32V DC) isolated, UPS option (future)
1 x DVI-D 1 x PCI or 1 x PCIe x4 (5 Gb/s) 24V DC (18…32V DC) isolated, UPS option (future)
-20…60 °C
CE, cULus Listed, EAC, KC and RCM Wall, VESA Mount, DIN Rail, Bookshelf, Machine N/A
Dual Single core Intel Atom E3815 1 GB N/A N/A
N/A
Fanless ThinManager® 24V DC
文石tab10参数
文石tab10参数一、产品概述文石tab10是一款10.3英寸的电子书平板电脑，专为阅读设计。
它采用高清显示屏，支持多种阅读格式，并配备了丰富的阅读辅助功能，如书签、批注、字体调整等，为用户提供沉浸式的阅读体验。
二、主要参数1. 尺寸与重量：尺寸：160mm x 243mm x 7.8mm重量：约485g2. 屏幕：尺寸：10.3英寸分辨率：2240x1660像素类型：IPS显示屏色彩：1677万色阅读格式支持：PDF，EPUB，TXT等3. 处理器：芯片：Rockchip RK3568八核处理器，主频1.8GHz4. 内存与存储：内存：3GB LPDDR4X双通道内存存储：64GB eMMC高速存储扩展存储：支持microSD卡扩展，最大支持512GB5. 电池：电池容量：6000mAh锂离子电池充电方式：USB-C充电接口（5V-3A）待机时间：约12小时（典型使用场景）6. 其他功能：操作系统：Frida Android系统，可刷各种定制版固件前置摄像头：2百万像素，支持视频通话和人脸识别功能后置摄像头：5百万像素，支持拍照和视频录制蓝牙版本：蓝牙5.0版本，支持蓝牙耳机、键盘等设备连接WiFi标准：Wi-Fi a/b/g/n/ac，支持2.4G和5G网络连接音频播放：支持MP3、WAV、FLAC等音频格式播放录音功能：支持录音功能，内置麦克风三、阅读功能文石tab10内置多种阅读格式支持，可轻松阅读PDF、EPUB、TXT等格式的书籍。
同时，它还具备以下阅读辅助功能：1. 书签功能：用户可以在阅读过程中方便地添加书签，标记重要部分。
2. 批注功能：用户可以在书籍中添加文字、图片等批注，方便后续回顾。
3. 字体与亮度调整：用户可以通过系统设置调整字体大小、颜色和亮度，以满足不同阅读需求。
4. 翻页效果：用户可以选择不同的翻页效果，增加阅读体验。
5. 夜间模式：系统内置夜间模式，适合在昏暗环境下阅读。
MSI 迪贝尔 GAMING电脑主机说明书
Generated 2023-06-30, check for the latest version /datasheet. The information provided in this document is intended for informational purposes only and is subject to change without notice.
LAN
Realtek® RTL8111H
Cooling System
Liquid Cooling (For AMD Ryzen™ 7 5800X Processor) Air Cooling
Volume
40 Liter
Dimension (WxDxH来自 195 x 514.8 x 466 mm (mm)
© 2023 Micro-Star Int'l Co.Ltd. MSI is a registered trademark of Micro-Star Int'l Co.Ltd. All rights reserved.
out
Combo port
7. 1x USB 3.2 Gen 2x2 Type C / 1x 6. 2x USB 3.2 Gen 1 Type A / 2x USB 3.2 Gen 2 Type A / RJ45 (2.5G USB 2.0 Type A
LAN)
8. 2x WiFi Antenna
9. 6x Audio jacks
I/O (Rear)
4 x USB 3.2 Gen1 Type A 2x USB 2.0 Type A 2x PS/2 port 1x DVI-D out 1x HDMI™ (supports 4K @24Hz as specified in HDMI 1.4b) 1x RJ45 (1GLAN) 3x Audio jacks
MMSZ4xxxT1G系列和SZMMSZ4xxxT1G系列零点电阻电源器件的商品说明书
MMSZ4686T1G MMSZ4686T1G.MMSZ4xxxT1G Series, SZMMSZ4xxxT1G Series Zener Voltage Regulators 500 mW, Low I ZT SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 1.8 V to 43 V•Low Reverse Current (I ZT) − 50 m A•Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications•ESD Rating of Class 3 (>16 kV) per Human Body Model•SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free and are RoHS Compliant*Mechanical Characteristics:CASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSRating Symbol Max Units Total Power Dissipation on FR−5 Board,(Note 1) @ T L = 75°CDerated above 75°C P D5006.7mWmW/°CThermal Resistance, (Note 2) Junction−to−Ambient R q JA340°C/WThermal Resistance, (Note 2) Junction−to−Lead R q JL150°C/WJunction and Storage Temperature Range T J, T stg−55 to+150°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Cathode AnodeSee specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONSOD−123CASE 425STYLE 1Device Package Shipping†ORDERING INFORMATIONMARKING DIAGRAM†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.MMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & Reel xx= Device Code (Refer to page 3)M= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)1SZMMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelSZMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & ReelELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Symbol ParameterV Z Reverse Zener Voltage @ I ZTI ZT Reverse CurrentI R Reverse Leakage Current @ V RVR Reverse VoltageI F Forward CurrentV F Forward Voltage @ I FProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Device*DeviceMarkingZener Voltage (Note 3)Leakage CurrentV Z (Volts)@ I ZT I R @ V RMin Nom Max m A m A VoltsMMSZ4678T1G CC 1.71 1.8 1.89507.51 MMSZ4679T1G CD 1.90 2.0 2.105051 MMSZ4680T1G CE 2.09 2.2 2.315041 MMSZ4681T1G CF 2.28 2.4 2.525021 MMSZ4682T1G CH 2.565 2.7 2.8355011 MMSZ4683T1G CJ 2.85 3.0 3.15500.81 MMSZ4684T1G CK 3.13 3.3 3.47507.5 1.5 MMSZ4685T1G CM 3.42 3.6 3.78507.52 MMSZ4686T1G CN 3.70 3.9 4.105052 MMSZ4687T1G CP 4.09 4.3 4.525042 SZMMSZ4687T1G CG6 4.09 4.3 4.525042 MMSZ4688T1G CT 4.47 4.7 4.9450103 MMSZ4689T1G CU 4.85 5.1 5.3650103 MMSZ4690T1G/T3G CV 5.32 5.6 5.8850104 MMSZ4691T1G CA 5.89 6.2 6.5150105 MMSZ4692T1G CX 6.46 6.87.145010 5.1 MMSZ4693T1G CY7.137.57.885010 5.7 MMSZ4694T1G CZ7.798.28.61501 6.2 MMSZ4695T1G DC8.278.79.14501 6.6 MMSZ4696T1G DD8.659.19.56501 6.9 MMSZ4697T1G DE9.501010.505017.6 MMSZ4698T1G DF10.451111.55500.058.4 MMSZ4699T1G DH11.401212.60500.059.1 MMSZ4700T1G DJ12.351313.65500.059.8 MMSZ4701T1G DK13.301414.70500.0510.6 MMSZ4702T1G DM14.251515.75500.0511.4 MMSZ4703T1G†DN15.201616.80500.0512.1 MMSZ4704T1G DP16.151717.85500.0512.9 MMSZ4705T1G DT17.101818.90500.0513.6 MMSZ4706T1G DU18.051919.95500.0514.4 MMSZ4707T1G DV19.002021.00500.0115.2 MMSZ4708T1G DA20.902223.10500.0116.7 MMSZ4709T1G DX22.802425.20500.0118.2 MMSZ4710T1G DY23.752526.25500.0119.0 MMSZ4711T1G†EA25.652728.35500.0120.4 MMSZ4712T1G EC26.602829.40500.0121.2 MMSZ4713T1G ED28.503031.50500.0122.8 MMSZ4714T1G EE31.353334.65500.0125.0 MMSZ4715T1G EF34.203637.80500.0127.3 MMSZ4716T1G EH37.053940.95500.0129.6 MMSZ4717T1G EJ40.854345.15500.0132.6 3.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C ±1°C.*Include SZ-prefix devices where applicable.†MMSZ4703 and MMSZ4711 Not Available in 10,000/Tape & ReelTYPICAL CHARACTERISTICSV Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θV Z , NOMINAL ZENER VOLTAGE (V)Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θ100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (5C)Figure 3. Steady State Power Derating P p k, P E A K S U R G E P O W E R (W A T T S )PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge PowerP D , P O W E R D I S S I P A T I O N (W A T T S )V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener ImpedanceZ Z T , D Y N A M I C I M P E D A N C E ()ΩTYPICAL CHARACTERISTICSC , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 6. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01I Z , Z EN E R C U R R E N T (m A )V Z , ZENER VOLTAGE (V)1001010.10.01I R , L E A K A G E C U R R E N T (A )μV Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Leakage Current10001001010.10.010.0010.00010.00001I Z , Z E N E R C U R R E N T (m A )Figure 8. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 9. Zener Voltage versus Zener Current(12 V to 91 V)SOD−123CASE 425−04ISSUE GDATE 07 OCT 2009SCALE 5:1NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM MIN NOM MAXMILLIMETERSINCHESA0.94 1.17 1.350.037A10.000.050.100.000b0.510.610.710.020c1.600.150.055D 1.40 1.80E 2.54 2.69 2.840.100---3.680.140L0.253.860.0100.0460.0020.0240.0630.1060.1450.0530.0040.0280.0710.1120.152MIN NOM MAX3.56H E---------0.006------------GENERICMARKING DIAGRAM**For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT**This information is generic. Please refer to device datasheet for actual part marking. Pb−Free indicator, “G” ormicrodot “ G”, may or may not be present.XXX= Specific Device CodeM= Date CodeG= Pb−Free Package1STYLE 1:PIN 1. CATHODE2. ANODE0.910.036ǒmminchesǓSCALE 10:1------q001010°°°°(Note: Microdot may be in either location) MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.PUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************ON Semiconductor Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales RepresentativeMMSZ4686T1G MMSZ4686T1G.。
莫贾V2416A系列迷你型无风扇、振动防护计算机产品介绍说明书
V2416A SeriesCompact,fanless,vibration-proof computers for rolling stock applicationsFeatures and Benefits•Intel Celeron/Core i7processor•Two hot-swappable2.5-inch HDD or SSD storage expansion trays•Dual independent DVI-I displays•2Gigabit Ethernet ports with M12X-coded connectors•2CFast sockets for OS backup•M12A-coded power connector•Compliant with EN50121-4•Complies with all EN50155mandatory test items1•IEC61373certified for shock and vibration resistance•Ready-to-run Debian7,Windows Embedded Standard7,and Windows10Embedded IoT Enterprise2016LTSB platforms•-40to70°C wide-temperature models available•Supports SNMP-based system configuration,control,and monitoring(Windows only)CertificationsIntroductionThe V2416A Series embedded computers are based on the Intel3rd Gen processor and feature4RS-232/422/485serial ports,dual LAN ports,and 3USB2.0hosts.In addition,the V2416A computers provide dual DVI-I outputs and comply with the mandatory test items of the EN50155 standard,making them suitable for a variety of industrial applications.The CFast socket,SATA connectors,and USB sockets provide the V2416A computers with the reliability needed for industrial applications that require data buffering and storage expansion.Most importantly,the V2416A computers come with2hot-swappable storage trays for inserting additional storage media,such as hard disk or solid-state drives,and support hot swapping for convenient,fast,and easy storage replacement. Each storage tray has its own LED to indicate whether or not a storage module is plugged in.The V2416A Series computers come preinstalled with a choice of Linux Debian7or Windows Embedded Standard7to provide programmers with a familiar environment in which to develop sophisticated,bug-free application software at a low cost.1.This product is suitable for rolling stock railway applications,as defined by the EN50155standard.For a more detailed statement,click here:/doc/specs/EN_50155_Compliance.pdfAppearanceFront View Rear ViewSpecificationsComputerCPU V2416A-C2Series:Intel®Celeron®Processor1047UE(2M cache,1.40GHz)V2416A-C7Series:Intel®Core™i7-3517UE Processor(4M cache,up to2.80GHz) System Chipset Mobile Intel®HM65Express ChipsetGraphics Controller Intel®HD Graphics4000(integrated)System Memory Pre-installed4GB DDR3System Memory Slot SODIMM DDR3/DDR3L slot x1Supported OS Linux Debian7Windows Embedded Standard7(WS7E)32-bitWindows Embedded Standard7(WS7E)64-bitStorage Slot CFast slot x2Computer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(M12X-coded)x2Serial Ports RS-232/422/485ports x4,software selectable(DB9male)USB2.0USB2.0hosts x1,M12D-coded connectorUSB2.0hosts x2,type-A connectorsAudio Input/Output Line in x1,Line out x1,M12D-codedDigital Input DIs x6Digital Output DOs x2Video Input DVI-I x2,29-pin DVI-D connectors(female)Digital InputsIsolation3k VDCConnector Screw-fastened Euroblock terminalDry Contact On:short to GNDOff:openI/O Mode DISensor Type Dry contactWet Contact(NPN or PNP)Wet Contact(DI to COM)On:10to30VDCOff:0to3VDCDigital OutputsConnector Screw-fastened Euroblock terminalCurrent Rating200mA per channelI/O Type SinkVoltage24to40VDCLED IndicatorsSystem Power x1Storage x1Hot-swappable2LAN2per port(10/100/1000Mbps)Serial2per port(Tx,Rx)Serial InterfaceBaudrate50bps to921.6kbpsFlow Control RTS/CTS,XON/XOFF,ADDC®(automatic data direction control)for RS-485,RTSToggle(RS-232only)Isolation N/AParity None,Even,Odd,Space,MarkData Bits5,6,7,8Stop Bits1,1.5,2Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersInput Voltage12to48VDCPower Connector M12A-coded male connectorPower Consumption(Max.) 3.3A@12VDC0.82A@48VDCPower Consumption40W(max.)Physical CharacteristicsHousing AluminumIP Rating IP30Dimensions(with ears)250x86x154mm(9.84x3.38x6.06in)Dimensions(without ears)275x92x154mm(10.83x3.62x6.06in)Weight4,000g(8.98lb)Installation DIN-rail mounting(optional),Wall mounting(standard) Protection-CT models:PCB conformal coating Environmental LimitsOperating Temperature Standard Models:-25to55°C(-13to131°F)Wide Temp.Models:-40to70°C(-40to158°F) Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kVIEC61000-4-6CS:10VIEC61000-4-8PFMFRailway EN50121-4,IEC60571Railway Fire Protection EN45545-2Safety EN60950-1,IEC60950-1Shock IEC60068-2-27,IEC61373,EN50155Vibration IEC60068-2-64,IEC61373,EN50155DeclarationGreen Product RoHS,CRoHS,WEEEMTBFTime332,173hrsStandards Telcordia(Bellcore),GBWarrantyWarranty Period3yearsDetails See /warrantyPackage ContentsDevice1x V2416A Series computerInstallation Kit8x screw,for storage installation2x storage key1x wall-mounting kit8x washer,for HDD/SSDDocumentation1x document and software CD1x quick installation guide1x warranty cardDimensionsOrdering InformationModel Name CPU Memory(Default)OS CFast(CTO)Backup CFast(CTO)Hot-SwappableSSD/HDD Tray(CTO)Operating Temp.ConformalCoatingV2416A-C2Celeron1047UE4GB or optional1(Optional)1(Optional)2(Optional)-25to55°C–V2416A-C2-T Celeron1047UE4GB or optional1(Optional)1(Optional)2(Optional)-40to70°C–V2416A-C2-CT-T Celeron1047UE4GB or optional1(Optional)1(Optional)2(Optional)-40to70°C✓V2416A-C7i7-3517UE4GB or optional1(Optional)1(Optional)2(Optional)-25to55°C–V2416A-C7-T i7-3517UE4GB or optional1(Optional)1(Optional)2(Optional)-40to70°C–V2416A-C7-CT-T i7-3517UE4GB or optional1(Optional)1(Optional)2(Optional)-40to70°C✓V2416A-C2-W7E Celeron1047UE4GB8GB1(Optional)2(Optional)-25to55°C–V2416A-C2-T-W7E Celeron1047UE4GB8GB1(Optional)2(Optional)-40to70°C–V2416A-C7-T-W7E Core i7-3517UE4GB8GB1(Optional)2(Optional)-40to70°C–Accessories(sold separately)Battery KitsRTC Battery Kit Lithium battery with built-in connectorCablesCBL-M12XMM8PRJ45-BK-100-IP67M12-to-RJ45Cat-5E UTP gigabit Ethernet cable,8-pin X-coded male connector,IP67,1mCBL-M12(FF5P)/Open-100IP67A-coded M12-to-5-pin power cable,IP67-rated5-pin female M12connector,1mConnectorsM12A-5PMM-IP685-pin male circular threaded D-coded M12USB connector,IP68M12X-8PMM-IP678-pin male X-coded circular threaded gigabit Ethernet connector,IP67M12A-5P-IP68A-coded screw-in sensor connector,female,IP68,4.05cmM12A-8PMM-IP678-pin male circular threaded A-codes M12connector,IP67-rated(for field-installation)Power AdaptersPWR-24270-DT-S1Power adapter,input voltage90to264VAC,output voltage24V with2.5A DC loadPower CordsPWC-C7AU-2B-183Power cord with Australian(AU)plug,2.5A/250V,1.83mPWC-C7CN-2B-183Power cord with two-prong China(CN)plug,1.83mPWC-C7EU-2B-183Power cord with Continental Europe(EU)plug,2.5A/250V,1.83mPWC-C7UK-2B-183Power cord with United Kingdom(UK)plug,2.5A/250V,1.83mPWC-C7US-2B-183Power cord with United States(US)plug,10A/125V,1.83mAntennasANT-WDB-ANF-0407 2.4/5GHz,omni-directional antenna,4/7dBi,N-type(male)Wall-Mounting KitsV2400Isolated Wall Mount Kit Wall-mounting kit with isolation protection,2wall-mounting brackets,4screwsDIN-Rail Mounting KitsDK-DC50131DIN-rail mounting kit,6screws©Moxa Inc.All rights reserved.Updated Jun12,2019.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。
深圳百为电子科技有限公司 BYS2 00-U MP3 模块使用说明书
深圳市百为电子科技有限公司BYS200-U MP3模块使用说明书深圳市百为电子科技有限公司 Shenzhen Balway Electronic Technology Co., Ltd.BYS200-U MP3模块使用说明书一、简介市场上语音模块的语音烧录，类似于U盘的，操作简单方便，但是外挂NAND FLASH成本昂 贵；OTP或外挂SPI FLASH的模块，大多需要通过上位机软件、烧写器、转换座、SD卡等方式来实 现，使用过程中，给用户带来了很多操作上的麻烦；2013年初，深圳百为电子科技有限公司应市场需求和广大用户操作方便性，成功研发一款低成 本、高音质、高性价比的BYS200-U MP3模块；该模块最突出的特点：外挂SPI FLASH，带USB座，与电脑相连能发现盘符，拷贝到此盘，就是可以由终端用户，自行去更换语音。
二、应用行业消费类电子: 玩具，礼品盒，贺卡，促销品，音乐盒；工业控制领域（电梯、工业设备）；智能交通设备（收费站、停车场）；广告宣传行业;二、BYS200-U模块功能供电：锂电池（3.7V-4.2V） 可外接5V电源。
喇叭：16欧或者32欧，0.5-1W存储器容量可选：6M、32M（电脑上可以看到容量）带USB座，用线连出来的，与电脑相连能发现盘符，拷贝到此盘。
就是可以由终端用户，自 行去更换语音。
USB口也可以做充电使用，求锂电池带充电保护板。
语音触发方式：有7种模式。
能够满足99%的用户需求。
电路板上有3个短路点，用来选择语音触发方式：三、见实物图如下：（1）光控 （2）按键深圳市百为电子科技有限公司是一家集语音方案、语音半成品、语音成品开发，生产，服务于一体的技术型企业，主要一直专注于语音技术研究，语音芯片方案，MP3模块，语音提示板，语音成品等软、硬件设计开发及语音行业电子元器件配单。
并承接电子产品的开发和小批量生产，成熟后采用OEM方式批量生产和供货，业务范围涉及汽车电子、安防、家居防盗、通信、家电、医疗器械、工业自动化控制、教育设备、玩具及礼品消费类产品等领域。
戴尔dell笔记本bios 中英文对照表
This section lists out the primary hardware features of the system. There are no configurable options in this section, only information.Lists the the following:System Informationo BIOS Versiono Service Tago Asset Tago Ownership Tago Manufacture Dateo Ownership DateMemory Informationo Memory Installedo Memory Availableo Memory Speedo Memory Channel Modeo Memory Technologyo DIMM A Sizeo DIMM B SizeProcessor Informationo Processor Typeo Core Counto Processor IDo Current Clock Speedo Minimum Clock Speedo Maximum Clock SpeedDevice Informationo Primary Hard Drive 该选项列出系统的主要硬件信息。
此处仅提供信息，无法修改。
系统信息o BIOS 版本o机器编号o资产编号o Ownership编号o出厂日期o Ownership日期内存信息o安装内存容量o可用内容容量o当前内存频率o Memory通道o Memory技术o DIMM A尺寸o DIMM B尺寸CPU信息o CPU型号o CPU核数（几核）o CPU IDo当前时钟频率o最小时钟频率o最大时钟频率设备信息o主硬盘容量o光驱型号o系统eSATA设备o Dock eSATA 设备The computer attempts to boot from the sequence of devices specified in this list:Diskette driveUSB Storage DeviceCD/DVD/CD-RW Drive.Internal HDD (IRRT)Cardbus NICOnboard NICThis list specifies the order that the BIOS searches devices when trying to find an operating system to boot. To change the boot order, select the device to be changed in the list then click the up/down arrows or use the keyboard PgUp/PgDn keys to change the boot order of the device. The boot devices can also 计算机尝试从以下列表顺序启动：软驱USB存储设备光驱Internal HDD (IRRT)Cardbus NICOnboard NIC我们可以勾选需要启动的设备。
ISD-DEMO2360微控制器基础系统设计指南说明书
ISD-DEMO2360 User ManualThe information contained in this document is the exclusive intellectual property of Nuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton provides this document for reference purposes only in the design of ISD ChipCorder®microcontroller-based systems. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information, please contact: Nuvoton Technology Corporation atPublication Release Date: Apr 13, 2016Contents1. Overview (3)2. Board Description (5)2.1. ISD-DEMO2360_QFN32 for QFN32 package (5)2.1.1. ISD-DEMO2360_QFN32 Jumper Description (5)2.2. ISD-DEMO2360_SOP16 for SOP16 package (6)2.2.1. ISD-DEMO2360_SOP16 Jumper Description (6)2.3. 2x5 connector pin assignment (7)3. Operation Description (7)3.1. Software Installation (7)3.2. Operation under VPE (8)4. ISD-DEMO2360 board schematic (10)4.1. ISD-DEMO2360_QFN32 schematic (10)4.2. ISD-DEMO2360_SOP16 schematic (11)5. Appendix: ISD-VPE Video Tutorial (12)6. Revision History (13)Publication Release Date: Apr 13, 20161.OverviewThe ISD2360 demo board is a small board dedicated for ISD2360 device evaluation andapplication development. The ISD2360 comes in two packages: QFN32 and SOP16, hence there are two types of demo boards for the ISD2360.-For QFN32 package: ISD-DEMO2360_QFN32 – shown in Picture 1-1 ISD-DEMO2360_QFN32-For SOP16 package: ISD-DEMO2360_SOP16 – shown in Picture 1-2Picture 1-1 ISD-DEMO2360_QFN32Picture 1-2 ISD-DEMO2360_SOPPublication Release Date: Apr 13, 2016The ISD2360 evaluation kit consists of three parts:-ISD-DEMO2360 (QFN or SOP)-ISD-ES_MINI_USB: a small interface board providing USB connection to PC-ISD-VPE2360: free downloadable GUI evaluation software for ISD2360.The ISD2360 demo board connecting to the ISD-ES_MINI_USB board, along with the ISD-VPE2360, makes up a small but complete evaluation system for ISD2360, as shown in Picture 1-3 A complete ISD2360 evaluation system.Picture 1-3 A complete ISD2360 evaluation systemPublication Release Date: Apr 13, 20162.Board Description2.1.ISD-DEMO2360_QFN32 for QFN32 package2.1.1.ISD-DEMO2360_QFN32 Jumper DescriptionJ1 – 2-pin power connector, to connect battery pack or external power supply J2 – 2-pin speaker connector directly connecting to ISD2360 PWM outputJ3 – Audio jack directly connecting to ISD2360 PWM outputJ4 – 2x5 10-pin connector connecting to ISD-ES_MINI_USB donglePublication Release Date: Apr 13, 2016J5 – Reserved, not to be used.2.2.ISD-DEMO2360_SOP16 for SOP16 package2.2.1.ISD-DEMO2360_SOP16 Jumper DescriptionJ2 – 2x5 10-pin connector connecting to ISD-ES_MINI_USB dongleJ3 – Audio jack directly connecting to ISD2360 PWM outputJ4 – 2-pin speaker connector directly connecting to ISD2360 PWM outputJ7 – Reserved, not to be used.J8 – 2-pin power connector, to connect battery pack or external power supplyPublication Release Date: Apr 13, 20162.3.2x5 connector pin assignmentThe ISD2360 demo board can be connected to ISD USB dongle via a 2x5 10-pinconnector. Table 2-1 shows the pin assignment.3.Operation Description3.1.Software InstallationSoftware DownloadThe ISD2360 user can use ISD-VPE2360 (VPE stands for Voice Prompt Editor) GUIsoftware to control the demo board, and fully evaluate the ISD2360 device.The ISD-VPE2360 software is freely downloaded from Nuvoton website, or from the link below:https:///FS/v.aspx?v=8a6e688761676eb6a4ad.During the software installation, user will be prompted for username and password. The user should email Nuvoton ChipCorder team at **********************, to requestPublication Release Date: Apr 13, 2016the username and password. In the email user should provide the detailed companyname and company address, city, including country name if outside of US. Thisinformation is required by Nuvoton to generate the username and password and tocontact the user for future software updates.System RequirementsThe ISD-VPE2360 is PC windows application software; it currently supports Windows XP, Windows 7- 32bit, and Windows 7- 64bit.3.2.Operation under VPEThe user can follow the sequence below to launch the ISD2360 VPE and start evaluating the ISD2360 chip functionality with the ISD-DEMO2360 board.-Connect a demo board to USB dongle-Plug in USB dongle into a PC USB port-Launch VPETo connect demo board with the USB dongle, both board need to face up for the connection.Please refer to Picture 3.2-1Demo board connects to USB dongle board with both boardsfacing up below.Publication Release Date: Apr 13, 2016Picture 3.2-1 Demo board connects to USB dongle board with both boards facing upPublication Release Date: Apr 13, 20164.ISD-DEMO2360 board schematic 4.1.ISD-DEMO2360_QFN32 schematicPublication Release Date: Apr 13, 20164.2.ISD-DEMO2360_SOP16 schematicPublication Release Date: Apr 13, 20165.Appendix: ISD-VPE Video TutorialThere are ISD-VPE video tutorials available online which can help users who are new to the ISD-VPE GUI software. Users can access these video tutorials using the web links below:o A Simple VPE project: https:///watch?v=BXTa7Kaux0oo A GPIO Trigger project: https:///watch?v=XVDcPGpHtkIo Record and playback project: https:///watch?v=o-L-6L3TXvcPublication Release Date: Apr 13, 20166.Revision HistoryPublication Release Date: Apr 13, 2016。
BAS70W系列低开关电压快速切换肩带电子硅晶体管说明书
SURFACE MOUNT SCHOTTKY BARRIER DIODEFeatures• Low Turn-on Voltage • Fast Switching• PN Junction Guard Ring for Transient and ESD Protection • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 3) •"Green" Device (Note 4 and 5)Mechanical Data• Case: SOT-323• Case Material: Molded Plastic, "Green" Molding Compound, Note 5. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D• Terminals: Solderable per MIL-STD-202, Method 208• Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe).• Polarity: See Diagrams Below • Marking Information: See Page 2 • Ordering Information: See Page 2 •Weight: 0.006 grams (approximate)Top View BAS70WBAS70W-04 BAS70W-05 BAS70W-06Maximum Ratings @T A = 25°C unless otherwise specifiedCharacteristicSymbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking VoltageV RRM V RWM V R 70 V RMS Reverse VoltageV R(RMS) 49 V Forward Continuous Current (Note 1)I F 70 mA Non-Repetitive Peak Forward Surge Current @ t p < 1.0sI FSM100mAThermal CharacteristicsCharacteristicSymbol Value Unit Power Dissipation (Note 1)P D 200 mW Thermal Resistance Junction to Ambient Air (Note 1) R θJA 625 °C/W Operating Temperature Range T J -55 to +125 °C Storage Temperature Range T STG-65 to +150°CElectrical Characteristics @T A = 25°C unless otherwise specifiedCharacteristicSymbol Min Max Unit Test ConditionReverse Breakdown Voltage (Note 2) V (BR)R 70 — — I R = 10μAForward Voltage V F — 410 1000 mV t p <300µs, I F = 1.0mA t p <300µs, I F = 15mA Reverse Current (Note 2) I R ⎯ 100 nA t p < 300µs, V R = 50V Total Capacitance C T ⎯ 2.0 pF V R = 0V, f = 1.0MHzReverse Recovery Timet rr—5.0nsI F = I R = 10mA to I R = 1.0mA, I rr = 0.1 x I R , R L = 100ΩNotes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at /datasheets/ap02001.pdf.2. Short duration pulse test used to minimize self-heating effect.3. No purposefully added lead.4. Diodes Inc.'s "Green" policy can be found on our website at /products/lead_free/index.php.5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to DateCode 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.Please click here to visit our online spice models database.1.010V , INSTANTANEOUS FORWARD VOLTAGE (V)Fig. 1 Typical Forward Characteristics F I , I N S T A N T A N E O U S F O R W A R D C U R R E N T (m A )FV , INSTANTANEOUS REVERSE VOLTAGE (V)Fig. 2 Typical Reverse Characteristics R I , I N S T A N T A N E O U S R E V E R S E C U R R E N T (n A )RT , AMBIENT TEMPERATURE (C)Fig. 4 Power Derating Curve, Total Package A °P , P O W E R D I S S I P A T I O N (m W )D0.20.40.81.41.21.0C , T O T A L C A P A C I T A N C E (p F )T V , DC REVERSE VOLTAGE (V)Fig. 3 Total Capacitance vs. Reverse Voltage ROrdering Information (Notes 5 & 6)Part NumberCase Packaging BAS70W-7-F SOT-323 3000/Tape & Reel BAS70W-04-7-F SOT-323 3000/Tape & Reel BAS70W-05-7-F SOT-323 3000/Tape & Reel BAS70W-06-7-FSOT-323 3000/Tape & ReelNotes:6. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationKxx = Product Type Marking CodeK73 = BAS70W K74 = BAS70W-04 K75 = BAS70W-05 K76 = BAS70W-06 YM = Date Code Marking Y = Year (ex: N = 2002)M = Month (ex: 9 = September) KxxY MDate Code KeyYear 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 Code NP R S T UVWXYZABCMonth Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N DPackage Outline DimensionsSuggested Pad LayoutIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.SOT-323Dim Min Max Typ A 0.25 0.40 0.30 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D - - 0.65 F 0.30 0.40 0.425 G 1.20 1.40 1.30 H 1.80 2.20 2.15 J 0.0 0.10 0.05 K 0.90 1.00 1.00 L 0.25 0.40 0.30 M 0.10 0.18 0.11α0° 8° - All Dimensions in mmX EY CZDimensions Value (in mm)Z 2.8 X 0.7 Y 0.9 C 1.9 E 1.0。
IQRF Tech TR-76D RF Transceiver Module 数据手册说明书
TR-76DRF Transceiver Module SeriesData SheetBlock diagramKey features• Operating system (upgradeable at the user), easy to use • DPA framework for Data controlled approach (formerly DCTR) • GFSK modulation• Selectable RF band 868 / 916 MHz, multiple channel • RF output power 10 mW• MCU with extended resources, user interrupt capability • Extra low power consumption, power management modes • SPI interface supported by OS in background • Serial EEPROM 256 Kb • PWM output• Programmable HW timer • Battery monitoring• 18 pins, 11 I/O pins, 1 input only pin• A/D converter (4 channels), D/A converter, analog comparator • Options: on-board antenna or soldering antenna pad-hole• Stamp-hole pads, SMT mounting, compatible with SIM card connector without metallic holder (KON-SIM-02) • Shielding canApplications• Bidirectional RF communication• Point-to-point or network wireless connectivity • Telemetry, AMR (automatic meter reading) • WSN (wireless sensor network) • Building automation • Street lighting control• Wireless monitoring, control and regulation • Remote data acquisition• RF connectivity in many other fields • Also for municipal and indoor areas • Internet of ThingsElectrical specificationsTypical values unless otherwise statedSupply voltage (V CC ) 13.0 V min., 3.4 V max., stabilizedOperating temperature 2-40 °C to +85 °CSupply currentDeep sleep mode (OS v4.00 or higher only) 56 nA (all peripherals disabled4, RF IC in Standby mode) Sleep mode610 nA (all peripherals disabled 4, RF IC in Sleep mode)Run modeRF sleep 1.6 mA RF ready3.0 mARX modeSTD 11.8 mA LP 5 250 µA XLP 5 16.3 µATX mode8.3 mA – 25 mA (according to RF output power)RF band 868 MHz or 916 MHz (software configurable)RF channelsSee IQRF OS User’s guide, Appendix Channel maps RF data modulationGFSK (Gaussian Frequency Shift Keying) RF data transmission bit rate 619.8 kb/sRF receiver category 1.5 (according to ETSI EN 300 220-1 V3.1.1)RF sensitivity 7-101 dBm (STD RX mode, checkRF(0)). See Diagram 4.RF output power (TR-76D) 7Up to 10 dBm (for 50 Ω load), programmable in 8 levels (0 – 7).Effective radiated power (TR-76DA) Up to 6.5 dBm 3A , 11 dBm 3B (868 MHz band), 2.0 to 6.5 dBm 3A (916 MHz band).See Diagrams 2A, 2B .RF interface (TR-76D)Single-ended, output impedance 50 ΩAntenna (TR-76DA)PCB meander line, linear polarization, omnidirectional. See Diagram 1.RF range (TR-76DA)500 m 3A , 1100 m 3BInput voltage on Q4 to Q15 pins0 V to VCCA/D converter10 bit, 4 inputs. Refer to MCU datasheet.Size (L x W x H) 15.2 mm x 14.9 mm x 3.3 mm (TR-76D)23.3 mm x 14.9 mm x 3.3 mm (TR-76DA)Note 1: RF power and other parameters depend on the supply voltage. Refer to datasheets of MCU and RF IC used. Test yourapplication with respect to required supply voltage range.Note 2: RF range may change with lower temperature. Frost, condensation or humidity over 85% may disable module functionality.Module suitability should be tested in the final application at real conditions before volume use.Note 3: Arrangement: Two TR-76DA transceivers plugged in DK-EVAL-04A kits, vertically, 1.6 m above the ground, in free space,bidirectional communication.3A: TR-76DA transceivers plugged in DK-EVAL-04A kits through the KON-TR-01 adapters.3B: TR-76DA transceivers plugged in DK-EVAL-04A kits through the RNG-EXT-01 adapters.Test software: E09-LINK example (STD mode, setRFpower(7), checkRF(0)), bit rate 19.8 kb/s.Note 4: Additional current is consumed when a peripheral (e.g. watchdog, Brown-out detection etc.) is enabled. Note 5: Depends on interferences.Note 6: Several RF bit rates different from 19.8 kb/s will be available in future IQRF OS versions. Note 7: RF circuitry and RF balun included, built-in PCB antenna not included.Absolute maximum ratingsSupply voltage (V CC ) 3.9 VVoltage on Q4 to Q15 pins (configured as inputs) vs. GND -0.3 V to (V CC + 0.3 V) Storage temperature -40 °C to +85 °C Ambient temperature under bias-40 °C to +85 °CSee the application note AN015 - IQRF HW design for TR-7xD transceivers .Simplified schematicBasic componentsFor more information refer to datasheets of ICs used.Pin Name DescriptionQ1 1GND GroundQ2, C4GND Ground Top viewQ3, C3V CC Power supply voltageQ4IO / TX / PWMRC6General I/O pinTX UART TXCCP3PWM outputQ5IO / RXRC7General I/O pinRX UART RXQ6, C6IO / SCK / SCLRC3General I/O pinSCK SPI clock inputSCL I2C clockQ7 2, C7IO / SDI / SDARC4General I/O pinSDI SPI dataSDA I2C dataQ8 2, C8IO / SDORC5General I/O pinSDO SPI data outQ9, C5IO / ADC / -SS / COUT Bottom view RA5General I/O pinAN4Analog A/D input-SS SPI Slave selectC2OUT Comparator outputQ10 3IO / LEDGRB7 General I/O pin, programmable pull-upInterrupt/Wake-up on change (IOC)LED1 LEDG supported by OSQ11 3IO / ADC / LEDRRA2General I/O pinAN2Analog A/D inputLED2LEDR supported by OSDACOUT D/A converter outputQ12IO / ADCRB4General I/O pin, with programmable pull-upInterrupt/Wake-up on change (IOC)RFPGM / (X)LP mode terminationAN11Analog A/D inputQ13INRE3General input only pinQ14, C1IO / ADC / C-INRA0General I/O pinAN0Analog A/D inputC12IN0Comparator –inputQ15, C2IORC2General I/O pinQ16–Do not use, leave unconnectedQ17 1GND GroundQ18 1ANT AntennaP1–P5For manufacturer onlyNote 1: Not implemented for TR-76DA.Note 2:Pin Q8 is used as output and pin Q7 as input during the initial approximately 200 ms boot-up (after power supply rising-up) to detect a possible request to enter the programming mode (PGM - wired upload via SPI). After reset, the OS generates adeterminate sequence on the Q8 pin. If this sequence is copied to the Q7, the OS jumps to the PGM bootloader. (The PGMmode is indicated by short red LED flashing every 2 s.)This must be taken into account to avoid collisions with application circuitry connected to these pins.The Q7 pin must not be interconnected to Q8 or left unconnected or without a defined level on its input. Thislevel must be arranged by application hardware. If the application circuitry ensures no such level, a pull-down resistor on Q7 pin must be used otherwise a cross-talk between Q8 and Q7 may cause anunintentional switching to PGM.Note 3: This pin is affected by IQRF OS (and possibly DPA) LED functions and system LED indication.There are no on-board protection series resistors on I/O pins. It is recommended to use 200 Ω series resistors on each pin. See the application note AN015 - IQRF HW design for TR-7xD transceivers.Recommended circuit for developmentFor development, it is recommended to implement the following arrangement:•Decoupling capacitor on V CC to filter the supply voltage. The type and the value should be selected with respect to general rules observed in electronic design, according to given application hardware and power source.•Serial protective resistors on each I/O pin used.•Both system LEDs (LEDR and LEDG) for IQRF OS and DPA status indication and for possible user indication. When the Q10 and Q11 pins are used as user I/Os, it must be taken into account that these pins can be affected by IQRF OS or DPA.•Pin Q12 configured as an input with the internal pull-up resistor and equipped with a pushbutton connected to the ground.Then pressing the button can generate an interrupt on pin change, wake-up the transceiver from sleep, terminate RFPGM mode, initiate bonding etc.•Pull-down resistor on pin Q7 recommended to avoid unintentional switching to PGM mode due to SDO - SDI cross-talk during TR boot.•SPI interface for wired upload of application code into the transceiver using an IQRF programmer, e.g CK-USB-04A.RF rangeRF range strongly depends on the following design aspects:•Hardware:•Construction of the devices (especially TR location within the device, PCB layout, ground planes, conductive areas and bulk objects such as metallic parts and batteries in the nearest surroundings, with respect to possible reflections and counterpoise effect). To achieve an efficient range and reliable connectivity, no parts impacting the range must be placed close to the built-in meander antenna. Even non-conductive parts including a mainboard PCB under the antenna can significantly impact the range.•Physical arrangement of devices (especially mutual orientations of antennas with respect to polarizations and radiation patterns)•Application software:•RF output power is selectable from 8 levels•To increase immunity to RF noise, incoming RF signal can be filtered according to signal strength.Refer to IQRF OS Reference guide, function checkRF and Application note AN014 RF range optimizing at TR-7xDx transceivers.Diagram 1: TR-7xDA RF output power [in dBm] vs. antenna orientation (radiation patterns).Examples of the correct and incorrect arrangement of TR-7xDA pairs:Correct Correct Incorrect Incorrect IncorrectWrong radiation angle Mismatched polarization Wrong radiation angleMismatched polarizationDiagram 2A: Effective radiated power (ERP) vs. level in the setRFpower(level) function. TR-76D(A), 868 MHz band, channels 0 to 67. Refer to IQRF OS Reference guide.Diagram 2B: Effective radiated power (ERP) vs. level in the setRFpower(level) function. TR-76D(A), 916 MHz band. Refer to IQRF OS Reference guide.Diagram 2C: Relative RF range vs. level in the setRFpower(level) function. TR-76D(A), 868 MHz and 916 MHz bands. Refer to IQRF OS Reference guide.Diagram 3A: Relative effective radiated power (ERP) vs. channel, with respect to channel 52 (100 %). TR-76D(A), 868 MHz band.Diagram 3B: Relative effective radiated power (ERP) vs. channel, with respect to channel 104 (100%). TR-76DA, 916 MHz band.Diagram 4: Relative RF range vs. level in the checkRF(level) function in STD, LP and XLP RX modes. Refer to IQRF OS Reference guide.Diagram 5: Relative RF range vs. antenna height above the ground. TR-76DA, 868 MHz and 916 MHz bands.Mechanical drawingsTR-76DTR-76DATop view. Units: mm.Hardware revision•TR-76DA v1.05 Minor improvements to optimize production.•TR-76D(A) v1.04 Minor improvements to optimize production.•TR-76D(A) v1.02 Minor improvements to optimize production. TR-76DA also for 916 MHz band.•TR-76D(A) v1.01 Minor improvements to optimize production. TR-76DA for 868 MHz band only.•TR-76D(A) v1.00 First standard release. TR-76DA for 868 MHz band only.ApplicationSee IQRF video tutorial set on /videos.See the application noteAN015 - IQRF HW design for TR-7xD transceivers .AssemblyFor proper mounting of surface mount TR modules and avoiding damage during solder reflow assembly, refer to the reflow profile and other details in the Application note AN015 – IQRF HW design , chapter SMT mounting .It is not allowed to connect wires to pads C1 to C8 and P1 to P5 by soldering.Recommended PCB layoutTR-76D TR-76DAPadsTop view. Units: mm.Restricted areas for wires on top sideThese patterns are for reference purposes only. Consult your producer to ensure that its manufacturing guidelines are met.SealingIn case of sealing or protecting TR modules against a harsh environment by coating, encapsulating or potting using a lacquer, gel or other filling matter, refer to the Application note AN015 – IQRF HW design for TR-7xD transceivers, chapter Sealing. Operating systemSee IQRF OS User's guide and IQRF OS Reference guide.DPA frameworkSee DPA Framework technical guide.Application softwareSee IQRF Quick start guide and IQRF application examples.Programming (upload)There are the following possibilities to upload an application program in TR-76Dx modules:•Wired upload with TR-76Dx plugged via the SIM connector in the CK-USB-04A programmer.•For TR-76Dx modules populated in an application:•Wired upload•Using the CK-USB-04A programmer. See the CK-USB-04A User's guide.•Using the CK-USB-04 programmer and the KON-TR-01P adapter. See the KON-TR-01P User's guide.•Completely arranged by user application. See the IQRF SPI Technical guide, chapter Programming mode.•Wireless upload: See the IQRF OS User's guide, Appendix RFPGM – RF programming TM.Product informationOrdering codesT R-76D AAntenna optionsnil - soldering pad-hole (no antenna, no U.FL connector)A - PCB antennaTransceiver series. TR/DCTR are not differentiated from IQRF OS v4.02D.TR-76D TR-76DADocument history•200525 References to application note AN015 – IQRF HW design for TR-7xD transceivers added.•191209 Note 2 in Pin description table extended. Paragraph Programming (upload) in chapter Application slightly extended. Chapters Assembly and Sealing relocated into Application note AN015 – IQRF HW design,chapters SMT mounting and Sealing.•191010 Supply current in TX mode and Note 3A in Electrical specifications modified. Legend added to chapter Recommended PCB layout. Updated for TR-76DA HW version 1.05.•180627 Diagram 2C added. Decoupling capacitor added to Recommended circuit for development.•180130 Block diagram revised. RF parameters in chapter Electrical specifications revised. HW revisions updated.Chapter RF range extended. Directives in Quality management updated.•171108 Note 3 in chapter Electrical specification revised. The legend at Diagrams 2A, 2B, 3A and 3B slightly precised.•170823 A bug in Recommended PCB layout fixed. Updated for IQRF OS v4.02D.•170810 V CC reduced to 3.9 V in chapter Absolute maximum ratings. Diagram 4, Mechanical drawings and Recommended PCB layout updated. Updated for TR/DCTR fusion from IQRF OS v4.02D. Some minorimprovements.•170322 Diagrams 3A and 3B added. Preliminary.•170314 Updated for HW v1.02 and IQRF OS v4.00 (preliminary). Electrical specification revised. Chapter Sealing added. Chapter Recommended circuit for development slightly extended. Variances in mechanicaldrawings slightly precised. Some minor improvements.•160304 Pin Q12 description slightly extended.•160219 More detailed RF range specification. Q7 and Q8 pin description extended.•160118 Note 10 added to pin description table. Chapter Recommended circuit for development added.A bug in Key features, antenna options fixed.•151005 ETSI directives updated. Preliminary.•151001 First release. Preliminary.Sales and ServiceCorporate officeIQRF Tech s.r.o., Prumyslova 1275, 506 01 Jicin, Czech Republic, EUTel: +420 493 538 125, Fax: +420 493 538 126, www.iqrf.techE-mail (commercial matters): **************Technology and developmentE-mail (technical matters): ****************Partners and distribution/partnersQuality managementISO 9001 : 2009 certifiedComplies with ETSI directives EN 301 489-1 V1.9.2:2011, EN 301 489-3 V1.6.1:2013,EN 300 220-1 V3.1.1:2017, EN 300 220-2 V3.2.0:2017 and ERC Recommendation70-03 (2017) and VO-R/10/05.2014-3.Complies with directives 2011/65/EU (RoHS) and 2012/19/EU (WEEE).TrademarksThe IQRF name and logo are registered trademarks of IQRF Tech s.r.o.PIC, SPI, Microchip and all other trademarks mentioned herein are a property of their respective owners.LegalAll information contained in this publication is intended through suggestion only and may be superseded by updates without prior notice. No representation or warranty is given and no liability is assumed by IQRF Tech s.r.o. with respect to the accuracy or use of such information.Without written permission, it is not allowed to copy or reproduce this information, even partially.No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.The IQRF® products utilize several patents (CZ, EU, US).On-line support: ****************。
HP ENVY x360 13-bd0000 Convertible PC BIOS 说明书
Interactive BIOS simulatorWelcome to the interactive BIOS simulator for theHP ENVY x360 13-bd0000 Convertible PCHere’s how to use it…BIOS Utility Menus: (Click the link to navigate to the individual menus)On this page you will find thumbnail images of each of the product’s BIOS utility menus. To view a specific menu in greater detail, simply click that thumbnail. Just as in the live BIOS, on each menu, you can select the tab of each of the other utility menus to navigate directly to that menu. Menu options:While the menu options cannot be toggled, many of them offer item specific information about that option. To view this information, use the cursor to rollover the option and the information will present in a pane on the right of the BIOS screen.That’s it!On every page there is a link that brings you back to either this Welcome page or the BIOS Utility Menus page enabling you to navigate to whatever BIOS option you wish to review.BIOS Utility MenusBack to Welcome PageMain Security Configuration ExitBoot OptionsMain MenuBack to BIOS Utility MenusMain Security Configuration Boot Options ExitItem Specific HelpSystem Time System Date Product Name System Family Product Number System Board ID Born On Date Processor Type Processor Speed Total Memory BIOS Vendor BIOS Revision Device Firmware Revision Serial Number UUID Number System Board CT Number Factory installed OS Primary Battery SN System Log Build ID Feature Byte [00:09:34][09/20/2020]HP ENVY x360 Convertible 13m-bd0xxx HP ENVY x38SKU1#ABA 8518[09/20/2020]Intel(R)Core(TM)*******************3200 MHz 8 GB Insyde B.07T505CD8273Y1Y 38444335-3732-5933-3159-5959373-24435PX38FDC8JB0008Win1001070 06/11/202018WW2S5T6a#SABA#DABA 3K6z 6b7B 7N7W aBaH apaq asaw bVbh bzcA cbdU dpdq fPhZ j6 .nnSecurity MenuBack to BIOS Utility MenusMain Security Configuration Boot Options ExitItem Specific HelpAdministrator Password [Clear]Power-On Password [Clear]TPM Device [Available]TPM State [Enable]Clear TMP [No]Restore Security settings to Factory defaultsFingerprint Reset on RebootBack to BIOS Utility MenusMain Security Configuration Boot Options ExitItem Specific HelpLanguage [English]Virtualization Technology [Disabled]Fan Always On [Disabled]Action Key Mode [Enabled]USB Charging [Enabled]Battery Remaining Time [Disabled]Adaptive Battery Optimizer [Disabled]Back to BIOS Utility MenusMain Security Configuration Boot Options ExitItem Specific HelpPOST HotKey Delay [0]USB Boot [Enabled]Network Boot [Disabled]Network Boot Protocol [IPv4+IPv6 (UEFI]Secure Boot [Disabled]Platform Key [Enrolled]Pending Action NoneClear All Secure Boot KeysLoad HP Factory Defaults KeysLoad MSFT Debug Policy KeysUEFI Boot OrderOS Boot ManagerUSB Flash Drives/USB Hard DiskUSB CD/DVD ROM Drive! Network AdapterExit MenuBack to BIOS Utility MenusMain Security Configuration Boot Options ExitItem Specific HelpSave Changes and ExitIgnore Changes and ExitLoad Setup DefaultsDevice Firmware RevisionBack to BIOS Utility MenusMainItem Specific HelpDevice Firmware RevisionEmbedded Controller Intel ME (Management Engine) Intel ISH (Integrated Sensor Hubs) GOP (Graphic Output Protocol) USB Type-C Controller(s) Thunderbolt Controller(s) 10.1012.0.3.1092 N/A9.0.1079 003204-NVM35.00System LogBack to BIOS Utility MenusMainItem Specific HelpSystem LogResult Time:0502 010109-000039- No Data -- No Data -- No Data -- No Data -- No Data -- No Data -- No Data -- No Data -- No Data -- No Data -- No Data -UEFI HII ConfigurationBack to BIOS Utility MenusConfigurationItem Specific HelpUEFI HII ConfigurationRealtek PCIe GBE Controller (MAC: 10:E7:C6: 29:62:00 )。
ASUS DSEB-DG系列主板说明书
VG248QG 系列液晶显示器用户指南第一版2018 年 8 月版权所有 © 2018 ASUSTeK COMPUTER INC.保留所有权利。
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ASUS“按原样”提供本手册，不提供任何明示或隐含的担保，包括但不限于对于适销性或特定目的适用性的隐含担保或条件。
无论在任何情况下，ASUS 及其董事成员、高级职员、员工或代理不对由于本手册或产品中存在任何缺陷或错误而导致的任何间接、特殊、偶然或必然损失（包括收益损失、业务损失、不能使用或数据丢失、业务中断等）承担任何责任，即使 ASUS 得知此类损失的可能性。
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ASUS 对本手册（包括其中介绍的产品和软件）中可能存在的任何错误不承担任何责任。
本手册中出现的产品名称和公司名称可能分别是或不是相应公司的注册商标或版权，仅用于标示或解释目的，无意侵犯其所有者的权益。
ii声明 (iv)安全信息 (v)保养和清洁 (vii)中国产品回收服务 (viii)欧盟能源标签产品信息 (viii)第 1 章：产品介绍1.1 欢迎使用！ ...................................................................................1-11.2 物品清单.........................................................................................1-11.3 显示器简介 .....................................................................................1-21.3.1 前部概览..........................................................................1-21.3.2 后部概览..........................................................................1-3功能 ...............................................................1-41.3.3 GamePlus功能 ............................................................1-51.3.4 GameVisual第 2 章：安装2.1 安装显示器支撑臂/ 底座 ................................................................2-12.2 调整显示器 .....................................................................................2-22.3 卸下支撑臂（VESA 壁挂安装时） .................................................2-32.4 连接线缆.........................................................................................2-42.5 打开显示器电源 ..............................................................................2-4第 3 章：一般说明3.1 OSD（屏幕显示）菜单..................................................................3-13.1.1 如何重新配置 ..................................................................3-13.1.2 OSD功能介绍.................................................................3-13.2 规格摘要........................................................................................3-73.3 外形尺寸.........................................................................................3-93.4 故障排除（常见问题） .................................................................3-103.5 支持的运行模式 ............................................................................3-11iiiiv联邦通信委员会声明本设备符合 FCC 规则第 15 部分的要求。
MP2360
MP23601.8A, 24V, 1.4MHz Step-Down ConverterThe Future of Analog IC TechnologyTMTMDESCRIPTIONThe MP2360 is a monolithic step-down switchmode converter with a built-in internal power MOSFET. It achieves 1.8A continuous output current over a wide input supply range with excellent load and line regulation. Current mode operation provides fast transient response and eases loop stabilization. Fault condition protection includes cycle-by-cycle current limiting and thermal shutdown.The MP2360 requires a minimum number of readily available standard external components. The MP2360 is available in a 2mm x 2mm QFN8 package.EVALUATION BOARD REFERENCEBoard Number Dimensions EV2360DG-00B1.8”X x 1.6”Y x 0.4”ZFEATURES• 2.5A Peak Output Current• 1.8A Continuous Output Current• 0.3Ω Internal Power MOSFET Switch• Stable with Low ESR Output CeramicCapacitors• 0.1µA Shutdown Mode • Fixed 1.4MHz Frequency • Thermal Shutdown• Cycle-by-Cycle Over Current Protection • Wide 4.5V to 24V Operating Input Range • Output Adjustable from 0.81V to 15V • Available in 2x2 QFN8 PackagesAPPLICATIONS• Broadband Communications Equipment • Digital Entertainment Systems • Distributed Power Systems • Battery Charger• Pre-Regulator for Linear Regulators“MPS” and “The Future of Analog IC Technology” are Trademarks of Monolithic Power Systems, Inc.TYPICAL APPLICATION1009080706050E F F I C I E N C Y (%)0.51.01.52.0LOAD CURRENT (A)Efficiency vs Load CurrentPACKAGE REFERENCE* For Tape & Reel, add suffix –Z (eg. MP2360DG–Z) For RoHS compliant packaging, add suffix –LF (eg.MP2360DG–LF–Z) ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage V IN (26V)V SW.......................................–0.3V to V IN + 0.3V V BS .......................................................V SW + 6V All Other Pins.................................–0.3V to +6V Junction Temperature...............................150°C Lead Temperature....................................260°C Storage Temperature..............–65°C to +150°C Recommended Operating Conditions (2) Supply Voltage V IN...........................4.5V to 24V Output Voltage V OUT......................0.81V to 15V Operating Temperature.............–40°C to +85°C Thermal Resistance (3)θJA θJC2x2 QFN8...............................80......16...°C/W Notes:1) Exceeding these ratings may damage the device.2) The device is not guaranteed to function outside of itsoperating conditions.3) Measured on approximately 1” square of 1 oz copper.ELECTRICAL CHARACTERISTICSV IN = 12V, T A = +25°C, unless otherwise noted.Parameters SymbolConditionMinTypMaxUnitsFeedback Voltage V FB 4.5V ≤ V IN≤ 24V 0.790 0.810 0.830 VFeedback Current I FB V FB = 0.8V 10 nASwitch On-Resistance (4)R DS(ON)0.3 ΩSwitch Leakage V EN = 0V, V SW = 0V 0 10 µACurrent Limit (4)Duty Cycle = 40% 2.0 2.5 AOscillator Frequency f SW V FB = 0.6V 1.4 MHzFold-back Frequency V FB = 0V 460 KHzMaximum Duty Cycle V FB = 0.6V 87 %Minimum On-Time (4)t ON100 nsUnder-Voltage Lockout Threshold Rising 2.5 2.8 3.1 VUnder-Voltage Lockout Threshold Hysteresis150 mVEN Input Low Voltage 0.4 VEN Input High Voltage 1.2 VV EN = 2V 2.1EN Input CurrentV EN = 0V 0.01µASupply Current (Shutdown) V EN= 0V 0.1 1.0 µASupply Current (Quiescent) V EN= 2V, V FB = 1V 0.8 1.0 mAThermal Shutdown (4)150°C Note:4) Guaranteed by design.PIN FUNCTIONSPin # Name Description1, 8 NC No Connect. 2 SW Switch Output.3 INSupply Voltage. The MP2360 operates from a +4.5V to +24V unregulated input. C1 is neededto prevent large voltage spikes from appearing at the input.4 EN On/Off Control Input. Pull above 1.2V to turn the device on.5 FBFeedback. An external resistor divider from the output to GND, tapped to the FB pin sets the output voltage. To prevent current limit run away during a short circuit fault condition thefrequency foldback comparator lowers the oscillator frequency when the FB voltage is below 250mV.6 GND Ground. This pin is the voltage reference for the regulated output voltage. For this reason caremust be taken in its layout. This node should be placed outside of the D1 to C1 ground path toprevent switching current spikes from inducing voltage noise into the part.7 BST Bootstrap. This capacitor is needed to drive the power switch’s gate above the supply voltage. Itis connected between SW and BST pins to form a floating supply across the power switchdriver.TYPICAL PERFORMANCE CHARACTERISTICSV IN = 12V, V OUT = 3.3V, T A = +25°C, unless otherwise noted.Efficiency vs Load CurrentsCurrent Limit vs Duty CycleLOAD CURRENT (A)100908070605040E F F I C I E N C Y (%)1.00.5 1.52.0 2.5LOAD CURRENT (A)Efficiency vs Load Current1.00.5 1.52.0 2.5DUTY CYCLE (%)040206080100TYPICAL PERFORMANCE CHARACTERISTICS (continued)V IN = 12V, V OUT = 3.3V, T A = +25°C, unless otherwise noted.V SW 10V/div.V EN 5V/div.V OUT 2V/div.I L 2A/div.Start-up through EnableV IN = 12V, V OUT = 3.3V, I OUT = 2A Resistive LoadV OUT 2V/div.V SW10V/div.V EN 5V/div.Start-up through EnableV IN = 12V, V OUT = 3.3V, No LoadV OUT 2V/div.V SW10V/div.V EN 5V/div.I L 2A/div.Shut-down through EnableV IN = 12V, V OUT = 3.3V,I OUT= 2A Resistive LoadShort Circuit EntryV IN = 12V, V OUT = 3.3VI L 2A/div.V OUT 2V/div.I L2A/div.V SW 10V/div.V EN 5V/div.V OUT 2V/div.I L2A/div.Shut-down through EnableV IN = 12V, V OUT = 3.3V, No LoadShort Circuit RecoveryV IN = 12V, V OUT = 3.3VV OUT 2V/div.I L 2A/div.400ns/div.Steady State TestV IN = 12V, V OUT = 3.3V, I OUT = 0.5AV OUT 20mV/div.V SW 10V/div.I L500mA/div.V OUTAC Coupled 200mV/div.I L 1A/div.I LOAD 1A/div.Load Transient TestV IN = 12V, V OUT = 3.3VOPERATIONThe MP2360 is a current mode buck regulator. That is, the EA output voltage is proportional to the peak inductor current.At the beginning of a cycle, M1 is off. The EA output voltage is higher than the current sense amplifier output, and the current comparator’s output is low. The rising edge of the 1.4 MHz CLK signal sets the RS Flip-Flop. Its output turns on M1 thus connecting the SW pin and inductor to the input supply.The increasing inductor current is sensed and amplified by the Current Sense Amplifier. Ramp compensation is summed to Current Sense Amplifier output and compared to the Error Amplifier output by the PWM Comparator. When the sum of the Current Sense Amplifier output and the Slope Compensation signal exceeds the EA output voltage, the RS Flip-Flop is reset and the M1 is turned off. The external Schottky rectifier diode (D1) conducts the inductor current. If the sum of the Current Sense Amplifier output and the Slope Compensation signal does not exceed the EA output for a whole cycle, then the falling edge of the CLK resets the Flip-Flop. The output of the Error Amplifier integrates the voltage difference between the feedback and the 0.81V bandgap reference. The polarity is such that a FB pin voltage lower than 0.8V increases the EA output voltage. Since the EA output voltage is proportional to the peak inductor current, an increase in its voltage also increases current delivered to the output.IN ENFB GNDSWBSTFigure 1—Functional Block DiagramAPPLICATION INFORMATIONSetting Output VoltageThe external resistor divider is used to set the output voltage (see the schematic on front page). The feedback resistor R1 also sets the feedback loop bandwidth with the internal compensation capacitor (see Figure 1). R2 can be determined by:1V81.0V 1R 2R OUT−=Table 1—Resistor Selection for CommonOutput VoltagesV OUT (V) R1 (k Ω) R2 (k Ω) 1.8 80.6 (1%) 64.9 (1%) 2.5 49.9 (1%) 23.7 (1%) 3.3 49.9 (1%) 16.2 (1%) 549.9 (1%)9.53 (1%)Selecting the InductorA 1µH to 10µH inductor with a DC current rating of at least 25% percent higher than the maximum load current is recommended for most applications. For highest efficiency, the inductor’s DC resistance should be less than 200m Ω. For most designs, the required inductance value can be derived from the following equation.OSCL IN OUT IN OUT f I V )V V (V L ×∆×−×=Where ∆IL is the inductor ripple current.Choose an inductor with a rating current of approximately 30% higher than the maximum load current if the maximum load current is ≥1.8A. The maximum inductor peak current is calculated from:2I I I LLOAD )MAX (L ∆+= Under light load conditions below 100mA, a larger inductance is recommended for improved efficiency. See Table 2 for suggested inductors.Selecting the Input CapacitorThe input capacitor reduces the surge current drawn from the input and the switching noise from the device. The input capacitor impedance at the switching frequency should be less than the input source impedance to prevent high frequency switching current from passing through the input. Ceramic capacitors with X5R or X7R dielectrics are highly recommended because of their low ESR and small temperature coefficients. For most applications, a 10µF capacitor is sufficient. Selecting the Output CapacitorThe output capacitor keeps output voltage ripple small and ensures loop stability. The output capacitor impedance should be low at the switching frequency. Ceramic capacitors with X5R or X7R dielectrics are recommended for their low ESR characteristics. For most applications, a 22µF ceramic capacitor will be sufficient.PC Board LayoutThe high current paths (GND, IN and SW) should be placed very close to the device with short, direct and wide traces. The input capacitor needs to be as close as possible to the IN and GND pins. The external feedback resistors should be placed next to the FB pin. Keep the switch node traces short and away from the feedback network. External Bootstrap DiodeIt is recommended that an external bootstrap diode be added when the input voltage is no greater than 5V or the 5V rail is available in the system. This helps improve the efficiency of the regulator. The bootstrap diode can be a low cost one such as IN4148 or BAT54.10nFIN (4.5 to 5V)Figure 2—External Bootstrap Diode This diode is also recommended for high duty cycle operation (whenINOUTV V >65%) applications.Table 2—Suggested Surface Mount InductorsManufacturer Part Number Inductance(µH) Max DCR(Ω) Current Rating(A)DimensionsL x W x H (mm3)Wurth Electronics 7447785004 4.7 0.060 2.5 5.9 x 6.2 x 3.3 Toko A916CY-4R7M 4.7 0.026 2.5 6.2 x 6.3 x 3.5Coiltronics DR73-4R7 4.7 0.03 36.0 x7.6 x 3.5TYPICAL APPLICATION CIRCUITV OUT3.3VFigure 3—1.4MHz, 3.3V Output Step-Down ConverterNOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not assume any legal responsibility for any said applications.PACKAGE INFORMATION2mm x 2mm QFN8RECOMMENDED LAND PATTERNNOTE:1) ALL DIMENSIONS ARE IN MILLIMETERS.2) EXPOSED PADDLE SIZE DOES NOT INCLUDE MOLD FLASH. 3) LEAD COPLANARITY SHALL BE 0.10 MILLIMETER MAX.4) DRAWING CONFORMS TO JEDEC MO-229, VARIATION VCCD-3. 5) DRAWING IS NOT TO SCALE.DETAIL ASIDE VIEW。
VersaView 6300B 壁掛式電腦說明書说明书
安裝指示VersaView 6300B 壁掛式電腦型號編號 6300B-PBCx 、6300B-PBDx環境與機殼資訊UL/cUL 標記合規含 UL/cUL 標記的設備必須符合 UL 61010-1、UL 61010-2-201、CSA C22.2 No. 61010-1 和 CSA C22.2 No. 61010-2-201 的要求。
可在 rok.auto/certifications 上取得認證合規的副本。
歐盟指令規範在歐盟或歐洲經濟區的區域內安裝時，本電腦符合歐盟指令的規定並附有 CE 標誌。
您可在 rok.auto/certifications 找到合規聲明副本。
安裝指南請按照下列指導原則確定電腦提供絕佳可靠性的服務：•選擇安裝地點時，請考量下列因素：-現場必須具有足夠的電源-必須是安全的室內地點-地點不得使電腦直接曝露在陽光照射下•可在以下的周圍氣溫範圍下操作電腦：-0 50 °C (32 122 °F)，適用於配備 Intel Core i3 處理器的 6300B-PBCx 壁掛式電腦-0 45 °C (32 113 °F)，適用於配備 Intel Core i7 處理器的 6300B-PBCx 壁掛式電腦-0 50 °C (32 122 °F)，適用於配備 Intel Core i3 和 Intel Core i7 處理器 的 6300B-PBDx 壁掛式電腦周圍氣溫不可超過電腦的最⾼溫度，尤其是在機殼內安裝電腦時。
•可將電腦存放在周圍氣溫範圍 -10…+60 °C (14…140 °F) 的地點。
•周圍氣溫濕度不可超過 80% (不凝結)。
注意事項：本設備專供於在污染等級2的工業環境，過電壓類別II 之應用（如IEC 60664-1之定義），⾼度達2000 m （6561 ft） 的環境中使用，⽽不降低額定值。
配置单
电脑型号OEM 台式电脑(扫描时间：2015年11月01日)操作系统Windows 7 旗舰版64位SP1 ( DirectX 11 )处理器英特尔酷睿2 双核E7300 @ 2.66GHz主板英特尔主板( 英特尔Q33 Express - ICH9R )内存 4 GB ( 蓝魔(三星) DDR2 800MHz / 金士顿DDR2 800MHz )主硬盘希捷ST1000DM003-1CH162 ( 1 TB / 7200 转/分)显卡ATI Radeon HD 6700 Series ( 512 MB )显示器三星SAM0525 SyncMaster ( 23.1 英寸)光驱东芝-三星CDDVDW SH-224DB DVD刻录机声卡创新Audigy 2 LS SB0612网卡瑞昱RTL8169/8110 Gigabit Ethernet Controller处理器英特尔酷睿2 双核E7300 @ 2.66GHz速度 2.70 GHz (266 MHz x 10.0) 前端总线: 1067 MHz处理器数量核心数: 2 / 线程数: 2核心代号Wolfdale生产工艺45 纳米插槽/插座Socket 775 (FC-LGA6)一级数据缓存 2 x 32 KB, 8-Way, 64 byte lines一级代码缓存 2 x 32 KB, 8-Way, 64 byte lines二级缓存 3 MB, 12-Way, 64 byte lines特征MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, EM64T, EIST主板型号英特尔主板芯片组英特尔Q33 Express - ICH9RBIOS Phoenix Technologies, LTD 6.00 PG / 制造日期: 2008年01月18日BIOS的大小1024 KBA0 金士顿DDR2 800MHz 2GB型号7F98序列号E72ADB04A1 蓝魔(三星) DDR2 800MHz 2GB制造日期2008 年10月型号FF RM2GE484CA-64FC9R08I39DT09序列号FFFFFFFF产品希捷ST1000DM003-1CH162大小 1 TB转速7200 转/分缓存64 MB硬盘已使用共975 次，累计2014 小时固件CC47接口SATA III数据传输率600 MB/秒特征S.M.A.R.T, APM, 48-bit LBA, NCQ主显卡ATI Radeon HD 6700 Series显存512 MB频率核心: 700MHz / 显存: 1150MHzBIOS版本113-C099-001BIOS日期2011年08月11日驱动版本14.301.1001.0驱动日期9-15-2014产品东芝-三星CDDVDW SH-224DB DVD刻录机缓存/固件: 768 KB /CM00网卡瑞昱RTL8169/8110 Gigabit Ethernet Controller声卡创新Audigy 2 LS SB0612声卡英特尔82801I HD Audio Controller声卡ATI Radeon HD 5700 Juniper HDMI Audio Device键盘PS/2 标准键盘鼠标HID-compliant 鼠标。
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EV2360DG-00B
1.8A, 24V, 1.4MHz Step-Down Converter
in 2mm x 2mm QFN8 Evaluation Board
The Future of Analog IC Technology
DESCRIPTION
The EV2360DG-00B is the evaluation board for the MP2360, a monolithic non-synchronous step-down switch mode converter with an integrated power MOSFET.
The MP2360 achieves 1.8A continuous output current over a wide input supply range with excellent load and line regulation.
Current mode operation provides fast transient response and eases loop stabilization.
Fault condition protection includes cycle-by-cycle current limiting and thermal shutdown.
The MP2360 is available in a 2mm x 2mm QFN8 package.
ELECTRICAL SPECIFICATIONS
Parameter Symbol Value Units Input Voltage V IN 4.5 – 24 V Output Voltage V OUT 3.3
V Output Current
I OUT 1.8 A
FEATURES
• 2.5A Peak Output Current
• 1.8A Continous Output Current
• Wide 4.5V to 24V Operating Input Range • Output Adjustable from 0.8V to 15V
• Ultra Compact 2mmx2mm QFN8 Package •
Fully Assembled and Tested
APPLICATIONS
• Broadband Communications Equipment • Digital Entertainment Systems • Distributed Power Systems • Battery Chargers
• Pre-Regulator for Linear Regulators
“MPS” and “The Future of Analog IC Technology”, are Trademarks of Monolithic Power Systems, Inc.
EV2360DG-00B EVALUATION BOARD
(L x W x H) 1.8” x 1.6” x 0.4” (4.5cm x 4.0cm x 1.0cm) Board Number
MPS IC Number
EV2360DG-00B MP2360DG
10090
80
70
60
50E F F I C I E N C Y (%)
0.5
1.0
1.5
2.0
LOAD CURRENT (A)
Efficiency vs
Load Current
EV2360DG-00B – 1.8A, 24V, 1.4MHz STEP-DOWN CONVERTER in 2x2 QFN8 EV BOARD EVALUATION BOARD SCHEMATIC
VIN
GND
EN VOUT
3.3V
GND
EV2360DG-00B BILL OF MATERIALS
P/N
Qty Ref Value Description Package Manufacturer Manufacturer
1 C1 10µF Ceramic Capacitor, 25V, X7R 1210 TDK C3225X7R1E106M
1 C2, C5 0.1µF Ceramic Capacitor, 50V, X7R 805 TDK C2012X7R1H104K
1 C3 22nF Ceramic Capacitor, 50V, X7R 603 TDK C1608X7R1H223K
2 C4 22µF Ceramic Capacitor, 6.3V, X5R 1210 TDK C3225X5R0J226M
1 C6 Not Stuffed, Optional
1 R1 49.9kΩFilm Resistor, 1% 603 Panasonic ERJ-3EKF4992V
1 R
2 16.2kΩFilm Resistor, 1% 60
3 Panasonic ERJ-3EKF1622V
1 R3 100kΩFilm Resistor, 5% 603 Panasonic ERJ-3GEYJ104V
1 R4 0ΩFilm Resistor, 5% 603 Panasonic ERJ-3GEY0R00V
B1015AS-4R7N
1 L1 4.7µH Inductor, 3.3A, DS84LC SMD
Toko
1 D1 Diode Schottky, 30V, 2A SMA Diodes Inc B230A-13
2 D2, D
3 Not Stuffed, Optional
Converter QFN8 MPS MP2360DG
1 U1 DC/DC
EV2360DG-00B – 1.8A, 24V, 1.4MHz STEP-DOWN CONVERTER in 2x2 QFN8 EV BOARD PRINTED CIRCUIT BOARD LAYOUT
Figure 1—Top Silk Layer Figure 2—Top Layer
Figure 3—Bottom Layer
EV2360DG-00B – 1.8A, 24V, 1.4MHz STEP-DOWN CONVERTER in 2x2 QFN8 EV BOARD
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not assume any legal responsibility for any said applications.
QUICK START GUIDE
1. Connect the positive terminal of the load to VOUT pin, and the negative terminal of the load to
GND pin. 2. Preset the power supply output to 4.5V – 24V and turn off the power supply.
3. Connect the positive terminal of the power supply output to the VIN pin and the negative
terminal of the power supply output to the GND pin. 4. Turn the power supply on. The board will automatically startup.
5. To use the Enable function, apply a digital input to EN pin. Drive EN higher than 1.2V to turn on
the regulator, drive EN less than 0.4V to turn it off. 6. The output voltage V OUT can be changed by varying R1. Calculate the new values by the
following formula:
⎟⎟⎠⎞⎜⎜⎝
⎛−×=181
.0V 2R 1R OUT
Where R2 = 16.2k Ω
Example:
For V OUT = 3.3V:
⎟⎠
⎞
⎜⎝⎛−×Ω=181.03.3k 2.161R = 49.8k Ω
Therefore, use a 49.9k Ω standard 1% value resistor.。