BU4011BFV中文资料

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M50FLW040ANB1P中文资料

1/52PRELIMINARY DATAAugust 2004This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.M50FLW040A M50FLW040B4 Mbit (5 x 64KByte Blocks + 3 x 16 x 4KByte Sectors)3V Supply Firmware Hub / Low Pin Count Flash MemoryFEATURES SUMMARYsFLASH MEMORY–Compatible with either the LPC interfaceor the FWH interface (Intel Spec rev1.1) used in PC BIOS applications– 5 Signal Communication Interfacesupporting Read and Write Operations – 5 Additional General Purpose Inputs forplatform design flexibility–Synchronized with 33MHz PCI clock s8 BLOCKS OF 64 KBYTES – 5 blocks of 64 KBytes each– 3 blocks, subdivided into 16 uniformsectors of 4 KBytes eachTwo blocks at the top and one at the bottom (M50FLW040A)One block at the top and two at the bottom (M50FLW040B)sENHANCED SECURITY–Hardware Write Protect Pins for BlockProtection–Register-based Read and WriteProtectionsSUPPLY VOLTAGE–V CC = 3 to 3.6V for Program, Erase andRead Operations–V PP = 12V for Fast Program and Erase sTWO INTERFACES–Auto Detection of Firmware Hub (FWH) orLow Pin Count (LPC) Memory Cycles for Embedded Operation with PC Chipsets –Address/Address Multiplexed (A/A Mux)Interface for programming equipment compatibility.s PROGRAMMING TIME: 10µs typical sPROGRAM/ERASE CONTROLLER–Embedded Program and Erase algorithms –Status Register BitssPROGRAM/ERASE SUSPEND–Read other Blocks/Sectors duringProgram Suspend–Program other Blocks/Sectors duringErase SuspendsELECTRONIC SIGNATURE –Manufacturer Code: 20h–Device Code (M50FLW040A): 08h –Device Code (M50FLW040B): 28hM50FLW040A, M50FLW040BTABLE OF CONTENTSFEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Figure 1.Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Figure 2.Logic Diagram (FWH/LPC Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Figure 3. Logic Diagram (A/A Mux Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Table 1.Signal Names (FWH/LPC Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Table 2.Signal Names (A/A Mux Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Figure 4.PLCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Figure 5.TSOP32 Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Figure 6.TSOP40 Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Table 3.Addresses (M50FLW040A). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Table 4.Addresses (M50FLW040B). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9SIGNAL DESCRIPTIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10Firmware Hub/Low Pin Count (FWH/LPC) Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . .10 Input/Output Communications (FWH0/LAD0-FWH3/LAD3).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Input Communication Frame (FWH4/LFRAME).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Identification Inputs (ID0-ID3).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 General Purpose Inputs (GPI0-GPI4).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Interface Configuration (IC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1010 CPU Reset (INIT).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Clock (CLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Top Block Lock (TBL).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1011 Reserved for Future Use (RFU).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Address/Address Multiplexed (A/A Mux) Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . .11 Address Inputs (A0-A10). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Data Inputs/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Row/Column Address Select (RC).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Ready/Busy Output (RB). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Supply Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 V CC Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 V PP Optional Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 V SS Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Table 5.Memory Identification Input Configuration (LPC mode). . . . . . . . . . . . . . . . . . . . . . . . . .12BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12Firmware Hub/Low Pin Count (FWH/LPC) Bus Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122/52M50FLW040A, M50FLW040BBus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Bus Abort. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Block Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Address/Address Multiplexed (A/A Mux) Bus Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 6.FWH Bus Read Field Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Figure 7.FWH Bus Read Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Table 7.FWH Bus Write Field Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Figure 8.FWH Bus Write Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Table 8.LPC Bus Read Field Definitions (1-Byte). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Figure 9.LPC Bus Read Waveforms (1-Byte) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Table 9.LPC Bus Write Field Definitions (1 Byte). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Figure 10.LPC Bus Write Waveforms (1 Byte) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Table 10.A/A Mux Bus Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18Table mand Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Read Memory Array Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Read Status Register Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Read Electronic Signature Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Table 12.Electronic Signature Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Quadruple Byte Program Command (A/A Mux Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Double/Quadruple Byte Program Command (FWH Mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Chip Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Block Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Sector Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Clear Status Register Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Program/Erase Suspend Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Program/Erase Resume Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Table mands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21STATUS REGISTER. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22Program/Erase Controller Status (Bit SR7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Erase Suspend Status (Bit SR6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Erase Status (Bit SR5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Program Status (Bit SR4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 V PP Status (Bit SR3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Program Suspend Status (Bit SR2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..22 Block Protection Status (Bit SR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Reserved (Bit SR0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .233/52M50FLW040A, M50FLW040B4/52Table 14.Status Register Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23FIRMWARE HUB/LOW PIN COUNT (FWH/LPC) INTERFACE CONFIGURATION REGISTERS . . .24Lock Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Write Lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Read Lock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Lock Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Table 15.Configuration Register Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Table 16.Lock Register Bit Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Table 17.General Purpose Inputs Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Firmware Hub/Low Pin Count (FWH/LPC) General Purpose Input Register . . . . . . . . . . . . . .25 Manufacturer Code Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25PROGRAM AND ERASE TIMES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Table 18.Program and Erase Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Table 19.Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Table 20.Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Table 21.FWH/LPC Interface AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Table 22.A/A Mux Interface AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Figure 11.FWH/LPC Interface AC Measurement I/O Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . .28 Figure 12.A/A Mux Interface AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Figure 13.AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Table 23.Impedance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Table 24.DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Figure 14.FWH/LPC Interface Clock Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Table 25.FWH/LPC Interface Clock Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Figure 15.FWH/LPC Interface AC Signal Timing Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Table 26.FWH/LPC Interface AC Signal Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .32 Figure 16.Reset AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Table 27.Reset AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Figure 17.A/A Mux Interface Read AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Table 28.A/A Mux Interface Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Figure 18.A/A Mux Interface Write AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Table 29.A/A Mux Interface Write AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36Figure 19.PLCC32 – 32 pin Rectangular Plastic Leaded Chip Carrier, Package Outline. . . . . . . .36 Table 30.PLCC32 – 32 pin Rectangular Plastic Leaded Chip Carrier, Package Mechanical Data37 Figure 20.TSOP32 – 32 lead Plastic Thin Small Outline, 8x14 mm, Package Outline . . . . . . . . . .38 Table 31.TSOP32 – 32 lead Plastic Thin Small Outline, 8x14 mm, Package Mechanical Data. . .38 Figure 21.TSOP40 – 40 lead Plastic Thin Small Outline, 10 x 20mm, Package Outline. . . . . . . . .39M50FLW040A, M50FLW040B Table 32.TSOP40 – 40 lead Plastic Thin Small Outline, 10 x 20mm, Package Mechanical Data .39PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Table 33.Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40APPENDIX A.BLOCK AND SECTOR ADDRESS TABLE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41Table 34.M50FLW040A Block and Sector Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Table 35.M50FLW040B Block and Sector Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42APPENDIX B.FLOWCHARTS AND PSEUDO CODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44Figure 22.Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Figure 23.Double/Quadruple Byte Program Flowchart and Pseudo code (FWH Mode Only). . . . .45 Figure 24.Quadruple Byte Program Flowchart and Pseudo Code (A/A Mux Interface Only) . . . . .46 Figure 25.Program Suspend and Resume Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . .47 Figure 26.Chip Erase Flowchart and Pseudo Code (A/A Mux Interface Only) . . . . . . . . . . . . . . . .48 Figure 27.Sector/Block Erase Flowchart and Pseudo Code. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Figure 28.Erase Suspend and Resume Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . .50REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Table 36.Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .515/52M50FLW040A, M50FLW040B6/52SUMMARY DESCRIPTIONThe M50FLW040 is a 4 Mbit (512Kb x8) non-vola-tile memory that can be read, erased and repro-grammed. These operations can be performed using a single low voltage (3.0 to 3.6V) supply. For fast programming and fast erasing in production lines, an optional 12V power supply can be used to reduce the erasing and programming time.The memory is divided into 8 Uniform Blocks of 64KBytes each, three of which are divided into 16uniform sectors of 4KBytes each (see APPENDIX A. for details). All blocks and sectors can be erased independently. So, it is possible to pre-serve valid data while old data is erased. Blocks can be protected individually to prevent accidental program or erase commands from modifying their contents.Program and erase commands are written to the Command Interface of the memory. An on-chip Program/Erase Controller simplifies the process of programming or erasing the memory by taking care of all of the special operations that are re-quired to update the memory contents. The end of a program or erase operation can be detected andany error conditions identified. The command set to control the memory is consistent with the JE-DEC standards.Two different bus interfaces are supported by the memory:s The primary interface, the FWH/LPCInterface, uses Intel ’s proprietary Firmware Hub (FWH) and Low Pin Count (LPC)protocol. This has been designed to remove the need for the ISA bus in current PCChipsets. The M50FLW040 acts as the PC BIOS on the Low Pin Count bus for these PC Chipsets.s The secondary interface, the Address/Address Multiplexed (or A/A Mux) Interface, is designed to be compatible with current Flash Programmers, for production lineprogramming prior to fitting the device in a PC Motherboard.The memory is supplied with all the bits erased (set to ’1’).M50FLW040A, M50FLW040BNote: 1.ID3 is Reserved for Future Use (RFU) in LPC mode.Table 1. Signal Names (FWH/LPC Interface) Table 2. Signal Names (A/A Mux Interface) FWH0/LAD0-FWH3/LAD3Input/Output CommunicationsFWH4/LFRAMEInput Communication FrameID0-ID3Identification InputsGPI0-GPI4General Purpose InputsIC Interface ConfigurationRP Interface ResetINIT CPU ResetCLK ClockTBL Top Block LockWP Write ProtectRFUReserved for Future Use. LeavedisconnectedV CC Supply VoltageV PP Optional Supply Voltage for FastProgram and Erase OperationsV SS GroundNC Not Connected InternallyIC Interface ConfigurationA0-A10Address InputsDQ0-DQ7Data Inputs/OutputsG Output EnableW Write EnableRC Row/Column Address SelectRB Ready/Busy OutputRP Interface ResetV CC Supply VoltageV PPOptional Supply Voltage for FastProgram and Erase OperationsV SS GroundNC Not Connected Internally7/52M50FLW040A, M50FLW040B8/529/52M50FLW040A, M50FLW040BTable 3. Addresses (M50FLW040A)Table 4. Addresses (M50FLW040B)Note:Also see APPENDIX A., Table 34. and Table 35. for a full listing of the Block Addresses.BlockSize (KByte)Address Range Sector Size (KByte)6470000h-7FFFFh 16 x 4KBytes 6460000h-6FFFFh 16 x 4KBytes6450000h- 5FFFFh 5 x 64KBytes 6440000h- 4FFFFh 6430000h-3FFFFh 6420000h-2FFFFh 6410000h-1FFFFh 6400000h-0FFFFh16 x 4KBytes BlockSize (KByte)Address Range Sector Size (KByte)6470000h-7FFFFh 16 x 4KBytes6460000h- 6FFFFh 5 x 64KBytes 6450000h- 5FFFFh 6440000h- 4FFFFh 6430000h-3FFFFh 6420000h-2FFFFh 6410000h-1FFFFh 16 x 4KBytes 6400000h-0FFFFh16 x 4KBytesM50FLW040A, M50FLW040B10/52SIGNAL DESCRIPTIONSThere are two distinct bus interfaces available on this device. The active interface is selected before power-up, or during Reset, using the Interface Configuration Pin, IC.The signals for each interface are discussed in the Firmware Hub/Low Pin Count (FWH/LPC) Signal Descriptions section and the Address/Address Multiplexed (A/A Mux) Signal Descriptions sec-tion, respectively, while the supply signals are dis-cussed in the Supply Signal Descriptions section.Firmware Hub/Low Pin Count (FWH/LPC) Signal DescriptionsPlease see Figure 2. and Table 1..Input/Output Communications (FWH0/LAD0-FWH3/LAD3).All Input and Output Communica-tions with the memory take place on these pins.Addresses and Data for Bus Read and Bus Write operations are encoded on these pins.Input Communication Frame (FWH4/LFRAME).The Input Communication Frame bus operation. When Input Communication Frame is Low, V IL , on the rising edge of the Clock, a new bus operation is initiated. If Input Communication Frame is Low, V IL , during a bus operation then the operation is aborted. When Input Communication Frame is High, V IH , the current bus operation is ei-ther proceeding or the bus is idle.Identification Inputs (ID0-ID3).Up to 16 memo-ries can be addressed on a bus, in the Firmware Hub (FWH) mode. The Identification Inputs allow each device to be given a unique 4-bit address. A ‘0’ is signified on a pin by driving it Low, V IL , or leaving it floating (since there is an internal pull-down resistor, with a value of R IL ). A ‘1’ is signified on a pin by driving it High, V IH (and there will be a leakage current of I LI2 through the pin).By convention, the boot memory must have ad-dress ‘0000’, and all additional memories are giv-en addresses, allocated sequentially, from ‘0001’.In the Low Pin Count (LPC) mode, the identifica-tion Inputs (ID0-ID2) can address up to 8 memo-ries on a bus. In the LPC mode, the ID3 pin is Reserved for Future Use (RFU). The value on ad-dress A19-A21 is compared to the hardware strap-ping on the ID0-ID2 pins to select the memory that is being addressed. For an address bit to be ‘1’,the corresponding ID pin can be left floating or driven Low, V IL (again, with the internal pull-down resistor, with a value of R IL ). For an address bit to be ‘0’, the corresponding ID pin must be driven High, V IH (and there will be a leakage current of I LI2 through the pin, as specified in Table 24.). For details, see Table 5..General Purpose Inputs (GPI0-GPI4).TheGeneral Purpose Inputs can be used as digital in-puts for the CPU to read, with their contents being available in the General Purpose Inputs Register.The pins must have stable data throughout the en-tire cycle that reads the General Purpose Input Register. These pins should be driven Low, V IL, or High, V IH , and must not be left floating.Interface Configuration (IC).The Interface Con-figuration input selects whether the FWH/LPC in-terface or the Address/Address Multiplexed (A/A Mux) Interface is used. The state of the Interface Configuration, IC, should not be changed during operation of the memory device, except for select-ing the desired interface in the period before pow-er-up or during a Reset.To select the FWH/LPC Interface, the Interface Configuration pin should be left to float or driven Low, V IL . To select the Address/Address Multi-plexed (A/A Mux) Interface, the pin should be driv-en High, V IH . An internal pull-down resistor is included with a value of R IL ; there will be a leakage current of I LI2 through each pin when pulled to V IH .Interface Reset (RP).The Interface Reset (RP)input is used to reset the device. When Interface IL , the memory is in Reset mode (the outputs go to high impedance,and the current consumption is minimized). When IH , the device is in normal op-eration. After exiting Reset mode, the memory en-ters Read mode.is used to Reset the device when the CPU is reset.It behaves identically to Interface Reset, RP, and the internal Reset line is the logical OR (electrical AND) of RP and INIT.Clock (CLK).The Clock, CLK, input is used to clock the signals in and out of the Input/Output Communication Pins, FWH0/LAD0-FWH3/LAD3.The Clock conforms to the PCI specification.The Top Block Lock in-put is used to prevent the Top Block (Block 7) from being changed. When Top Block Lock, TBL, is driven Low, V IL , program and erase operations in the Top Block have no effect, regardless of the state of the Lock Register. When Top Block Lock,TBL, is driven High, V IH , the protection of the Block is determined by the Lock Register. The state of Top Block Lock, TBL, does not affect the protec-tion of the Main Blocks (Blocks 0 to 6). For details,see APPENDIX A..Top Block Lock, TBL, must be set prior to a pro-gram or erase operation being initiated, and must not be changed until the operation has completed,otherwise unpredictable results may occur. Simi-larly, unpredictable behavior is possible if WP is。

nRF401中文手册

表 1. nRF401 主要技术特性
*PWR_UP 管脚间歇供电占空比 2% 周期 200ms
单位
MHZ
KHz dBm dBm kbit/s
V uA mA uA
定购信息
型号
nRF401-IC nRF401-EVKIT
特性
20pin SSOIC Evaluation kit with nRF401 IC
Sensitivity
@400
.BR=20kbit/s,BER<10-3
Bit rate
ZI
Recommended antenna
port differential impedance
Spurious emission
to +85
最小
典型
最大单位
2.7
3
5.25
V
0
V
11
mA
8
mA
8
uA
10
DBm
名称 tTR tRT tST tSR tVT tVR
最大延时
3ms 1ms 2ms 3ms 4ms 5ms
条件连续工作
上电
COPYRIGHT ©2001 ALL RIGHTS RESERVED 迅通科技 TEL: (0451)6349363 6332356 4
433MHZ 单片无线收发芯片
功能描述
真正的单片 FSK 收发芯片非常少的外围元件无需进行初始化和配置不需要对数据进行曼彻斯特编码最高速率 20Kbps 2 个工作频道宽工作电压范围低功耗待机模式
nRF401
应用领域
报警和安全系统自动测试系统家庭自动化控制遥控装置车辆安全系统工业控制无线通信电信终端

CD4040BE中文资料

Data sheet acquired from Harris Semiconductor SCHS030D − Revised December 2003The CD4020B and CD4040B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (NSR suffix), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). The CD4040B type also is supplied in 16-lead small-outline packages (M and M96 suffixes).The CD4024B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)89271AKB3T OBSOLETE CFP WR16TBD Call TI Call TI89274AKB3T OBSOLETE CFP WR16TBD Call TI Call TICD4020BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4020BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4020BF ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4020BF3A ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4020BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4020BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BE ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4024BEE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4024BF ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4024BF3A ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type CD4024BF3AS2534OBSOLETE CDIP J14TBD Call TI Call TI CD4024BM ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BM96ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BM96E4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BM96G4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BME4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BMG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BMT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD4024BMTE4ACTIVE SOIC D14250Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)CD4024BMTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BNSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BNSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BNSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BPWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BPWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4024BPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4040BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4040BF ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4040BF3A ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4040BM ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BM96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BM96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BM96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BMG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4040BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4040BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM JM38510/05653BEA ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type JM38510/05655BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4020BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4020BPWR TSSOP PW 162000330.012.47.0 5.6 1.68.012.0Q1CD4024BM96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1CD4024BNSR SO NS 142000330.016.48.210.5 2.512.016.0Q1CD4024BPWR TSSOP PW 142000330.012.47.0 5.6 1.68.012.0Q1CD4040BM96SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4040BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4040BPWRTSSOPPW162000330.012.47.05.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4020BNSR SO NS162000346.0346.033.0 CD4020BPWR TSSOP PW162000346.0346.029.0 CD4024BM96SOIC D142500346.0346.033.0 CD4024BNSR SO NS142000346.0346.033.0 CD4024BPWR TSSOP PW142000346.0346.029.0 CD4040BM96SOIC D162500333.2345.928.6 CD4040BNSR SO NS162000346.0346.033.0 CD4040BPWR TSSOP PW162000346.0346.029.0。

无线红外防盗报警器的设计

1 前言随着微电子技术与网络技术的飞速进展，人们关于居住环境的平安、方便、舒适提出了愈来愈高的要求因此智能化住宅就随之显现，也随着改革开放的深切和市场经济的迅速进展、提高，城市外来流动人口的大量增加，带来了许多不平安因素，刑事案件专门是入室盗窃、抢劫居高不下，因此家庭智能平安防范系统是智能化小区建设中不可缺少的一项，而以往的做法是安装防盗门、防盗网，但普遍存在有碍美观，不符合防火要求，而且不能有效地避免犯法分子对住宅的入侵，故利用高科技的电子防盗报警系统也就应运而生。

无线红外防盗报警器的进展主若是基于传感器之上，因此有必要先谈谈红别传感器的进展状况。

而传感器技术是21世纪人们在高新技术进展方面争夺的一个制高点，各发达国家都将传感技术视为现代高新技术进展的关键。

从20世纪80年代起，日本就将传感器技术列为优先进展的高新科技之首，美国等西方国家也将此技术列为国家科技和国防技术进展的重点。

从而基于传感器技术的防盗报警系统也取得了高速进展。

不管是基于哪一种方式的无线防盗报警器，它的工作原理都是将探测到的信号，通过编码，经电路放大，输出并将报警信号通过天线发射出，再用接收电路接收信号，解码并通过操纵电路判定是不是属于异样信号，再决定是不是发送报警信号给报警电路，从而达到防盗的成效，本系统也是采纳此原理。

本系统采纳经常使用的STC89C52单片机作为系统的核心操纵部份，是一个利用红别传感器作为信号输入的操纵部份的智能报警器。

当有不明人物进过红外探头时，会有操纵信号输入单片机，进而输出扎耳报警声引发相关人员的注意，同时利用显示器来显示。

如此专门大程度上减少了搜索时刻，从而提高了时效性。

达到了信号同意灵明度高，显示反映快，报警声音响的成效。

2 整体方案设计方案比较2.1.1 方案一图方案一方框图2.1.1 方案二图方案二方框图方案论证2.3.1 收发模块的比较方案一中收发模块采纳的核心芯片是Nrf905，此芯片为32引脚芯片，工作电压在，需外接433MHz 50Ω天线。

HMC401QS16G中文资料

OUTPUT FREQUENCY (GHz)
13.8
13.7
13.6
13.5
13.4
13.3
13.2
13.1 13
12.9
Vcc= 4.75V Vcc= 5.0V Vcc= 5.25V
12.8 0 1 2 3 4 5 6 7 8 9 10
TUNING VOLTAGE (VOLTS)
OUTPUT FREQUENCY (GHz)
Pushing @ Vtune= 5V
Frequency Drift Rate
Typ. 13.2 - 13.5
-7 -6 -105
65 225
2 -7 -28 -17 -40 0.6 5 1.5
Max.
10 10
Units
GHz
dBm dBm
dBc/Hz
V
mA mA
µA
dB
dBc dBc dBc dBc
+85 C
-3
-40 C
-4
-5
-6
-7
-8
-9
-10 0 1 2 3 4 5 6 7 8 9 10
TUNING VOLTAGE (VOLTS)
Divided Output SSB Phase Noise @ Vtune= 5V
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
Order Online at
元器件交易网
v01.0402 MICROWAVE CORPORATION
HMC401QS16G
Ku-BAND MMIC VCO with DIVIDE-BY-8, 13.2 - 13.5 GHz

TC74VHC4051AFT中文资料

TOSHIBA CMOS Digital Integrated Circuit Silicon MonolithicTC74VHC4051AF,TC74VHC4051AFT,TC74VHC4051AFKTC74VHC4052AF,TC74VHC4052AFT,TC74VHC4052AFKTC74VHC4053AF,TC74VHC4053AFT,TC74VHC4053AFK TC74VHC4051AF/AFT/AFK8-Channel Analog Multiplexer/DemultiplexerTC74VHC4052AF/AFT/AFKDual 4-Channel Analog Multiplexer/DemultiplexerTC74V4053AF/AFT/AFKTriple 2-Channel Analog Multiplexer/DemultiplexerThe TC74VHC4051A/4052A/4053A are high-speed, low-voltage drive analog multiplexer/demultiplexers using silicon gate CMOS technology. In 3 V and 5 V systems these can achieve high-speed operation with the low power dissipation that is a feature of CMOS.The TC74VHC4051A/4052A/4053A offer analog/digital signal selection as well as mixed signals. The 4051A has an 8-channel configuration, the 4052A has an 4-channel × 2 configuration, and the 4053A has a 2-channel × 3 configuration.The switches for each channel are turned ON by the control pin digital signals.All control inputs are equipped with a newly developed input protection circuit that avoids the need for a diode on the plus side (forward side from the input to the V CC). As a result, for example, 5.5 V signals can be permitted on the inputs even when the power supply voltage to the circuits is off. As a result of this input power protection, the TC74VHC4051A/4052A/4053A can be used in a variety of applications, including in the system which has two power supplies, and in battery backup circuits.Features•Low ON resistance: R on = 45Ω (typ.) (V CC = 3 V)R on = 24Ω (typ.) (V CC = 4.5 V)•Low power dissipation: I CC= 2.0 μA (max) (Ta = 25°C) •Input level: V IL= 0.8V (max) (V CC = 3 V) V IH= 2.0V (min) (V CC = 3 V)•Power down protection is provided on all control inputs TC74VHC4051AF, TC74VHC4052AF,TC74VHC4053AFTC74VHC4051AFT, TC74VHC4052AFT,TC74VHC4053AFTTC74VHC4051AFK, TC74VHC4052AFK,TC74VHC4053AFKSOP16-P-300-1.27A : 0.18 g ( typ.) TSSOP16-P-0044-0.65A : 0.06 g ( typ.) VSSOP16-P-0030-0.50 : 0.02 g ( typ.)Pin Assignment (top view)Truth TableControl Inputs“ON” ChannelInhibit C *BA VHC4051A VHC4052A VHC4053AL L L L 0 0X, 0Y 0X, 0Y, 0Z L L L H 1 1X, 1Y 1X, 0Y,0Z L L H L 2 2X, 2Y 0X, 1Y, 0Z LLHH33X, 3Y1X, 1Y, 0ZL H L L 4 ⎯ 0X, 0Y, 1Z L H L H 5 ⎯ 1X, 0Y, 1Z L H H L 6 ⎯ 0X, 1Y,1Z L H H H7⎯ 1X, 1Y, 1ZH X X X None None NoneX: Don't care, *: Except VHC4052AFT1 14 0 3 A B C13 12 11 10 915 4 6 COM 7 5 INH GND 2 816 GND V CC 1X 14 X-COM 0X 3X A B13 12 11 10 915 0Y 12345672Y Y-COM 3Y 1Y INH GND 816 GND V CC X-COM 14 1X 0X A B C13 12 11 10 915 1Y 0Y 1Z Z-COM 0Z INH GND Y-COM 816 GND V CCSystem DiagramTC74VHC4051ATC74VHC4052ATC74VHC4053ACOM 01 2 3 45 67X-COM0X 1X 2X 3X 0Y 1Y 2Y3Y Y-COMX-COM0X 1X0Y 1Y0Z 1Z Z-COMY-COMAbsolute Maximum Ratings (Note)Characteristics Symbol Rating Unit Power supply voltage V CC−0.5~7.0 VControl input voltage V IN−0.5~7.0 VSwitch I/O voltage V I/O − 0.5~V CC+ 0.5VInput diode current I IK−20 mAI/O diode current I IOK±25 mASwitch through current I T±25 mADC V CC or ground current I CC±50 mAmW Power dissipation P D 180Storage temperature T stg−65~150 °CNote : Exceeding any of the absolute maximum ratings, even briefly, may lead to deterioration in IC performance or even destruction.Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and thesignificant change in temperature, etc.) may cause this product to decrease in the reliability significantlyeven if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolutemaximum ratings and the operating ranges.Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability testreport and estimated failure rate, etc).Operating Range (Note)Characteristics Symbol Rating Unit Power supply voltage V CC2~5.5 VInput voltage V IN 0~5.5 VSwitch I/O voltage V I/O 0~V CC VOperating temperature T opr−40~85 °C0~200 (V CC= 2.5 ± 0.2 V)ns/VInput rise and fall time dt/dv0~100 (V CC= 3.3 ± 0.3 V)0~20 (V CC= 5 ± 0.5 V)Note: The operating ranges must be maintained to ensure the normal operation of the device.Unused control inputs must be tied to either V CC or GND.Electrical Characteristics DC Electrical CharacteristicsTa = 25°C Ta = −40~85°CCharacteristics Symbol Test ConditionV CC (V)MinTyp.Max Min Max Unit2.0 1.5 ⎯⎯ 1.5 ⎯ 3.0 2.0 ⎯ ⎯2.0⎯ 4.5 3.15 ⎯ ⎯ 3.15 ⎯ High-level V IH⎯5.5 3.85⎯ ⎯ 3.85 ⎯ 2.0⎯ ⎯ 0.5 ⎯ 0.5 3.0 ⎯ ⎯0.8⎯0.8 4.5 ⎯ ⎯ 1.35 ⎯ 1.35Input voltageLow-level V IL⎯5.5⎯ ⎯ 1.65 ⎯ 1.65V2.3 ⎯ 200⎯⎯⎯ 3.0 ⎯ 45 86 ⎯ 108V IN = V IL or V IH V I/O = V CC to GNDI I/O = 2 mA 4.5 ⎯ 24 37 ⎯ 46 2.3 ⎯ 28 73 ⎯ 84 3.0 ⎯ 22 38 ⎯ 44 ON resistanceR ONV IN = V IL or V IH V I/O = V CC or GND I I/O = 2 mA4.5 ⎯ 17 27 ⎯ 31 Ω 2.3 ⎯ 10 25 ⎯ 35 3.0 ⎯ 5 15 ⎯ 20 Difference of ON resistance between switchesΔR ON V IN = V IL or V IHV I/O = V CC to GNDI I/O = 2 mA 4.5⎯5 13 ⎯18Ω Input/Output leakagecurrent(switch OFF)I OFFV OS = V CC or GNDV IS = GND to V CC V IN = V IL or V IH5.5⎯⎯±0.1 ⎯ ±1.0μAInput/Output leakage current(switch ON, output open) I I/O V OS = V CC or GND V IN = V IL or V IH 5.5 ⎯ ⎯ ±0.1 ⎯ ±1.0μA Control input current I IN V IN = V CC or GND 5.5 ⎯ ⎯±0.1 ⎯ ±1.0μA Quiescent supply currentI CCV IN = V CC or GND5.5⎯⎯2.0⎯20.0μAAC Electrical Characteristics (Input: t r = t f = 3 ns)Ta = 25°C Ta = −40~85°CCharacteristics SymbolTest ConditionV CC (V)Min Typ.Max Min MaxUnit2.5±0.2⎯ 1.2 10 ⎯ 16 3.3±0.3⎯ 0.8 6 ⎯ 10 C L = 15 pFR L = 1 k Ω5.0±0.5⎯ 0.3 4 ⎯ 7ns2.5±0.2⎯ 2.6 12 ⎯ 183.3±0.3⎯ 1.5 9 ⎯ 12 Phase difference between input and outputφI/OC L = 50 pF R L = 1 k Ω5.0±0.5⎯ 0.6 6 ⎯ 8 2.5±0.2⎯ 3.3 15 ⎯ 20 3.3±0.3⎯ 2.3 11 ⎯ 15 C L = 15 pF R L = 1 k ΩFigure 15.0±0.5⎯ 1.6 7 ⎯ 10ns 2.5±0.2⎯ 4.2 25 ⎯ 32 3.3±0.3⎯ 3.0 18 ⎯ 22 Output enable timet pZL t pZHC L = 50 pF R L = 1 k ΩFigure 15.0±0.5⎯ 2.1 12 ⎯ 16 2.5±0.2⎯ 6 15 ⎯ 23 3.3±0.3⎯ 4.5 11 ⎯ 15 C L = 15 pF R L = 1 k ΩFigure 15.0±0.5⎯ 3.2 7 ⎯ 10ns 2.5±0.2⎯ 9.6 25 ⎯ 32 3.3±0.3⎯ 7.2 18 ⎯ 22 Output disable timet pLZ t pHZC L = 50 pF R L = 1 k ΩFigure 15.0±0.5⎯ 5.1 12 ⎯ 16 Control input capacitance C IN All types⎯⎯3⎯⎯10 pF4051A 23.44052A 13.1COMMON terminal capacitanceC IS4053A Figure 2⎯ ⎯ 8.2⎯ ⎯ ⎯ pF4051A 5.74052A 5.6SWITCH terminalcapacitanceC OS4053A Figure 2⎯ ⎯ 5.6 ⎯ ⎯ ⎯ pF 4051A 0.54052A 0.5Feedthrough capacitanceC IOS4053A Figure 2⎯ ⎯ 0.5 ⎯ ⎯ ⎯ pF 4051A 154052A 24Power dissipationcapacitanceC PD4053A Figure 2(Note)⎯ ⎯ 12⎯ ⎯ ⎯ pF Note: C PD is defined as the value of the internal equivalent capacitance of IC which is calculated from theoperating current consumption without load.Average operating current can be obtained by the equation: I CC (opr) = C PD ･V CC ･f IN + I CCAnalog Switch Characteristics (Ta = 25°C ) (Note)Characteristics Test ConditionV CC (V)Typ. UnitV IN = 2.0 V p-p 3.0 0.1Sine Wave Distortion (T.H.D)R L = 10 kΩ, C L = 50 pF, f IN = 1 kHzV IN = 4.0 V p-p 4.5 0.03%4051A 150 4052A 200 4053A3.0 2404051A 180 4052A 230 Frequency response(switch ON)V IN is centered at (V CC /2). Adjust input for 0dBm.Increase f IN frequency until dB meter reads −3dB.R L = 50 Ω, C L = 10 pF,sine wave Figure 34053A4.5 280 MHz3.0 -45V IN is centered at (V CC /2). Adjust input for 0dBm.R L = 600 Ω, C L = 50 pF, f IN = 1 MHz, sine wave Figure 44.5 -45 3.0 -65 Feed through attenuation(switch OFF)R L = 50 Ω, C L = 10 pF, f IN = 1 MHz, sine wave 4.5 -65dB 3.0 60Crosstalk(control input to signal output)R L = 600 Ω, C L = 50 pF, f IN = 1 MHz, square wave (t r = t f = 6 ns) Figure 54.5 100 mV 3.0 -45 Crosstalk(between any switches)VIN is centered at (VCC/2). Adjust input for 0dBm. R L = 600 Ω, C L = 50 pF, f IN = 1 MHz, sine wave Figure 64.5 -45 dBNote: These characteristics are determined by design of devices.AC Test CircuitFigure 2 C IOS , C IS , C OSFigure 1 t pLZ , t pHZ , t pZL , t pZHV CCGND V CV OH V OL V OH V OLV O/I(S 1 = V CC , S 2 =V O/I(S 1= GND, S 2 =S2Figure 3 Frequency Response (switch on)1/2V CCFigure 4 FeedthroughV IN 1/2V CCFigure 5 Cross Talk (control input to output signal)V Figure 6 Cross Talk (between any two switches)V IN1/2V CCPackage DimensionsWeight: 0.18 g (typ.)Weight: 0.06 g (typ.)Weight: 0.02 g (typ.)RESTRICTIONS ON PRODUCT USE20070701-EN •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。

低压保护器

高精度：采用功能强大的微处理器芯片，尤其采用交流采样技术，电压测量精度为±1%，能分别显示
，保证全球通用（不能使用于变频器输出回路）。

，使低压保护器的规格大为减少，便于高可靠：采用独特的三相电源供电技术，即使在极低电压、甚至在缺相情况下，也能保证保护、报警、
相序保护器原理图
相序监测：当低压保护器通电时，如果相序正确并且所有三相带电，继电器吸合。

过欠压保护器原理
缺相保护器原理图
缺相检测：当缺相故障时，继电器断电。

正常工作（无故障）时继电器吸合。

当缺相时立即断电。

电压不平衡保护器原理图
A、B、C：“不平衡”字符闪烁D：“不平衡”字符长亮。

LC401中文资料

Total Device Dissipation 120 Watts Junction to Case Thermal Resistance o 1.30 C/W Maximum Junction Temperature o 200 C Storage Temperature o o -65 C to 150 C DC Drain Current Drain to Gate Voltage 70 V Drain to Source Voltage 70 V Gate to Source Voltage 20 V
Pout
50 40 30 12.00 13.00 100
Ciss Coss
Efficiency = 65%
20
Gain
11.00
10
10 1 0 0 1 2 3 4 5 6 7 Pin in Watts 10.00 0 5 10
Crss
15 20 25 30
VDS IN VOLTS
IV CURVE
L4 1 DIE IV
7.0 A
RF CHARACTERISTICS (
SYMBOL Gps PARAMETER Common Source Power Gain Drain Efficiency Load Mismatch Tolerance MIN 12 65 TYP
60.0 WATTS OUTPUT )
MAX UNITS dB % 20:1 TEST CONDITIONS Idq = 0.20 A, Vds = 28.0 V, F = Idq = 0.20 A, Vds = 28.0 V, F =
18 16 14 12 ID IN AMPS 10 8 6 4 2 0 0 2 4 6 8 10 12 VDS IN VOLTS Vg=6v vg=8v 14 16 18 20

401CNQPBF中文资料

Document Number: 94205For technical questions, contact: ind-modules@Schottky Rectifier, 400 A401CNQ...PbF SeriesVishay High Power ProductsFEATURES•175 °C T J operation•Center tap module •Low forward voltage drop •High frequency operation•Guard ring for enhanced ruggedness and long term reliability•Lead (Pb)-free•Designed and qualified for industrial levelDESCRIPTIONThe 401CNQ... center tap Schottky rectifier module series has been optimized for low reverse leakage at high temperature. The proprietary barrier technology allows for reliable operation up to 175 °C junction temperature. Typical applications are in high current switching power supplies,converters, freewheeling diodes, welding and reverse battery protection.PRODUCT SUMMARYI F(AV)400 A V R40/45 VTO-244MAJOR RATINGS AND CHARACTERISTICSSYMBOL CHARACTERISTICS VALUESUNITS I F(AV)Rectangular waveform400A V RRM Range 40/45V I FSM t p = 5 µs sine25 000A V F 200 Apk, T J = 125 °C (per leg)0.56V T JRange- 55 to 175°CVOLTAGE RATINGSPARAMETER SYMBOL 401CNQ040P F401CNQ045P bFUNITS Maximum DC reverse voltageV R 4045VMaximum working peak reverse voltageV RWMABSOLUTE MAXIMUM RATINGSPARAMETER SYMBOL TEST CONDITIONSVALUES UNITSMaximum average forward current See fig. 5per leg I F(AV)50 % duty cycle at T C = 147 °C, rectangular waveform 200Aper device400Maximum peak one cycle non-repetitivesurge current per leg See fig. 7I FSM 5 µs sine or 3 µs rect. pulseFollowing any rated load condition and with rated V RRM applied25 00010 ms sine or 6 ms rect. pulse 3450Non-repetitive avalanche energy per leg E AS T J = 25 °C, I AS = 24 A, L = 1 mH270mJ Repetitive avalanche current per legI ARCurrent decaying linearly to zero in 1 µsFrequency limited by T J maximum V A = 1.5 x V R typical40A 元器件交易网 For technical questions, contact: ind-modules@Document Number: 94205401CNQ...PbF SeriesVishay High Power Products Schottky Rectifier, 400 ANote(1)Pulse width < 300 µs, duty cycle < 2 %ELECTRICAL SPECIFICATIONSPARAMETER SYMBOLTEST CONDITIONSVALUES UNITSMaximum forward voltage drop per leg See fig. 1V FM (1)200 AT J = 25 °C 0.67V 400 A 0.78200 A T J = T J maximum 0.56400 A0.69Maximum reverse leakage current per leg See fig. 2I RM (1)T J = 25 °C V R = Rated V R20mA T J = 125 °C180Maximum junction capacitance per leg C T V R = 5 V DC (test signal range 100 kHz to 1 MHz) 25 °C 10 300pF Typical series inductance per leg L S From top of terminal hole to mounting plane 5.0nH Maximum voltage rate of change dV/dtRated V R10 000V/µs THERMAL - MECHANICAL SPECIFICATIONSPARAMETER SYMBOL MIN.TYP.MAX.UNITS Maximum junction and storage temperature range T J , T Stg - 55-175°CThermal resistance, junction to case per leg R thJC --0.19°C/W Thermal resistance, junction to case per module --0.095Thermal resistance, case to heatsink R thCS-0.10-Weight-68-g - 2.4-oz.Mounting torque35.4 (4)53.1 (6)lbf ⋅ in(N ⋅ m)Mounting torque center hole 30 (3.4)40 (4.6)Terminal torque 30 (3.4)-44.2 (5)Vertical pull --80lbf ⋅ in 2" lever pull--35元器件交易网Document Number: 94205For technical questions, contact: ind-modules@401CNQ...PbF SeriesSchottky Rectifier, 400 AVishay High Power ProductsFig. 1 - Maximum Forward Voltage Drop CharacteristicsFig. 2 - Typical Values of Reverse Current vs.Reverse VoltageFig. 3 - Typical Junction Capacitance vs. Reverse VoltageFig. 4 - Maximum Thermal Impedance Z thJC Characteristics (Per Leg)元器件交易网 For technical questions, contact: ind-modules@Document Number: 94205401CNQ...PbF SeriesVishay High Power Products Schottky Rectifier, 400 AFig. 5 - Maximum Allowable Case Temperature vs.Average Forward CurrentFig. 6 - Forward Power Loss CharacteristicsFig. 7 - Maximum Non-Repetitive Surge CurrentFig. 8 - Unclamped Inductive Test CircuitNote(1)Formula used: T C = T J - (Pd + Pd REV ) x R thJC ;Pd = Forward power loss = I F(AV) x V FM at (I F(AV)/D) (see fig. 6);Pd REV = Inverse power loss = V R1 x I R (1 - D); I R at V R1 = 80 % rated V R元器件交易网元器件交易网Schottky Rectifier, 400 A Vishay High Power ProductsORDERING INFORMATION TABLELINKS TO RELATED DOCUMENTSDimensions /doc?95021Document Number: 94205For technical questions, contact: ind-modules@ Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

BU406-X-T3P-T中文资料

UNISONIC TECHNOLOGIES CO., LTDBU406NPN PLANAR TRANSISTORSILICON NPN SWITCHING TRANSISTORDESCRIPTIONThe UTC BU406 is a NPN expitaxial planar transistor. It is a fast switching device for use in horizontal deflection output stages of large screens MTV receivers with 110℃ CRT.*Pb-free plating product number: BU406LORDERING INFORMATIONOrder Number Pin AssignmentNormal Lead Free Plating Package 1 2 3 PackingBU406-x-TA3-T BU406L-x-TA3-T TO-220 B C E Tube BU406-x-TF3-T BU406L-x-TF3-T TO-220F B C E Tube BU406-x-T3P-T BU406L-x-T3P-T TO-3P B C E TubeABSOLUTE MAXIMUM RATINGPARAMETER SYMBOL RATINGS UNITCollector-Base Voltage (I E =0) V CBO 400 V Collector-Emitter Voltage (V BE =-1.5V) V CEV 400 V Collector-Emitter Voltage (I B =0) V CEO 200 V Emitter-Base Voltage (I C =0) V EBO 6 V Collector Current I C 7 A Collector Peak Current (repetitive) I CM 10 A Collector Peak Current (tp=10ms) I CM 15 ABase Current I B 4 ACollector Dissipation (T C ≤25 ) P C 60 W Junction Temperature T J 150 Storage Temperature T STG -65 ~ +150 Note Absolute maximum ratings are those values beyond which the device could be permanently damaged.Absolute maximum ratings are stress ratings only and functional device operation is not implied.THERMAL DATAPARAMETER SYMBOL RATINGS UNITThermal Resistance, Junction to Ambient θJA 70 /W Thermal Resistance, Junction to Case θJC 2.08 /WELECTRICAL CHARACTERISTICS (Ta=25℃)PARAMETER SYMBOLTEST CONDITIONS MIN TYP MAX UNITCollect Cutoff Current (V BE =0) I CESV CE =400VV CE =250V T C =150°CV CE =250V5 100 1 mA µA mA Emitter Cut-off Current (I C =0) I EBO V BE =6V 1 mA Collector-Emitter Saturation Voltage V CE(SAT)*I C =5A, I B =0.5A 1 V Base-Emitter Saturation Voltage V BE(SAT)*I C =5A, I B =0.5A 1.2 V DC Current Gain h FE V CE =10V, I C =500mA 70 240 Transition Frequency f T I C =500mA, V CE =10V 10 MHz Turn-off Time t OFF I C =5A, I B =0.5A 0.75 µs Second Breakdown Collector Current Is/b V CE =40V, t=10ms 4 APulse duration=300µs, duty cycle 1.5%CLASSIFICATION OF h FERANK A BRANGE 70 ~ 120 110 ~ 240TYPICAL CHARACTERISTICS10Collector-Base Voltage, V CE (V)1600Case Temperature, T C (°C)30P o w e r D i s s i p a t i o n , P C (W )50402010Power DeratingSafe Operating AreaC o l l e c t o r C u r r e n t , I C (A )10000100010Collector Current, I C (mA)S a t u r a t i o n V o l t a g e , V C E (S A T ) (V ), V B E (S A T ) (V )100100010000100101001Collector-Base Voltage, V CB (V)10Collector Output CapacitanceBase-Emitter Saturation Voltage Collector-Emitter Saturation Voltage C a p a c i t a n c e , C o b (p F )。

NEC P401_P461_P521_P551

遥控器维护 ..............................................................................................................................................简体中文 -11 设置 .....................................................................................................................................................................简体中文 -12 连接 .....................................................................................................................................................................简体中文 -14
画面.........................................................................................................................................................简体中文 -20 调节.........................................................................................................................................................简体中文 -20 音频.........................................................................................................................................................简体中文 -21 定时.........................................................................................................................................................简体中文 -21 画中画 .....................................................................................................................................................简体中文 -22 OSD ........................................................................................................................................................简体中文 -22 多显示器..................................................................................................................................................简体中文 -23 显示器保护 ..............................................................................................................................................简体中文 -24 高级选项..................................................................................................................................................简体中文 -24 遥控器控制功能 ...................................................................................................................................................简体中文 -27 通过 RS-232C 遥控器控制 LCD 显示器 ...............................................................................................................简体中文 -29 通过 LAN 控制 LCD 显示器 .................................................................................................................................简体中文 -30 特性 .....................................................................................................................................................................简体中文 -33 故障排除 ..............................................................................................................................................................简体中文 -34 规格 - MultiSync P401 .........................................................................................................................................简体中文 -35 规格 - MultiSync P461 .........................................................................................................................................简体中文 -36 规格 - MultiSync P521 .........................................................................................................................................简体中文 -37 规格 - MultiSync P551 .........................................................................................................................................简体中文 -38 针脚分配 ..............................................................................................................................................................简体中文 -39 制造商回收和节能信息.........................................................................................................................................简体中文 -40

BCR401U中文资料

元器件交易网
LED Driver • Supplies stable bias current even at low battery
voltage • Ideal for stabilizing bias current of LEDs • Negative temperature coefficient protects
10 2 -40°C 25°C 85°C
mA 150°C
10 1
Iout
10 0 0
5 10 15 20 25 30 V 40
VS
4
2008-05-06
元器件交易网
Output current versus external resistor Iout = (Rext), VS = 10V, VS -Vout = 1.4 V TA = Parameter
VSmin
-
1.4
-V
Output current change versus TA
∆Iout/Iout -
-0.2
- %/K
VS = 10 V
Output current change versus VS
∆Iout/Iout -
1
- %/V
VS = 10 V
2
2008-05-06
元器件交易网
150
°C
-65 ... 150
Value
Unit
≤ 50
K/W
1For calculation of RthJA please refer to Application Note Thermal Resistance
1
2008-05-06
元器件交易网
BCR401U

VGC401 中文手册

单通道控制器VGC 401使用说明书产品标识与INFICON联系时，请告知产品名牌上的信息。

为便于参考，现将名牌上的信息表示如下:有效性本说明书用于件号为398-010的产品。

件号（PN）可从产品名牌上看到。

本说明书件基于固件版号302-519-A。

如你的仪器工作与本文件的说明不符，请检查是否与上述固件版号（48）相符。

我们保留本说明书不事先通知的技术修改权。

全部尺寸均用毫米表示。

用途V GC401与INFICON生产的规管同时使用，用于真空系统的总压强测量。

全部产品必须按产品说明书使用。

供货范围1件单通道控制器1根电源电缆1根橡皮条2个橡皮脚4个凹槽螺丝4个塑料套管产品标识有效性用途供货范围1 安全1.1 使用符号1.2 人员要求1.3 一般安全规则1.4 责任与保修2 技术参数3 安装3.1 人员3.2 安装，设置3.2.1 机架安装3.2.2 安装在控制屏内3.2.3 用作桌上式仪器3.3 电源连接3.4 传感器连接3.5 控制器连接3.6 RS232接口连接4 运行4.1 面板4.2 VGC401的On和Off 4.3 工作模式4.4 测量模式4.5 参数模式4.5.1 参数4.6 测试模式4.6.1 参数4.6.2 测试程序5 维护6 故障查找7 检修8 附件9 储存10 废物处理附录A. 转换表提供的压强传感器B. 缺省参数C. 软件升级D. 文献E. 索引质量保证书参考在本说明书内的内容使用符号（XY）。

参考“文献”中的内容使用符号（［Z］）。

1.1 使用符号其它符号灯亮灯闪灯黑按此键（例：’para’键）不要按任何键.1.2 人员要求1.3 一般安全规则对于全部要进行的工作，必须遵守规章制度和采取必要的预防措施和考虑本说明书中的安全规则。

向所有其他用户通报安全信息。

1.4 责任与保修如最终用户或第三方发生以下情况，INFICON将不承担赔偿责任和保修将不再有效。

●不顾本说明书中的信息。

IXDN404PI中文资料

Power supply current
CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V
VIN = 3.5V VIN = 0V VIN = + VCC
Specifications Subject To Change Without Notice
VCC + 0.3
V
IIN
Input current
0V ≤ VIN ≤ VCC
-10
10
µA
VOH VOL ROH
ROL
IPEAK
High output voltage
Low output voltage
Output resistance @ Output High Output resistance @ Output Low Peak output current
Package Type
8-Pin PDIP 8-Pin SOIC with Grounded Metal Back 8-Pin SOIC 16-Pin SOIC with Grounded Metal Back 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC with Grounded Metal Back 8-Pin SOIC 16-Pin SOIC with Grounded Metal Back 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC with Grounded Metal Back 8-Pin SOIC 16-Pin SOIC with Grounded Metal Back 16-Pin SOIC
Applications

DFU400 使用说明书

0XJ 465 160第 3 页共 63 页旧底图总号底图总号签字日期z 回校指示和接收外部控制及开关设备所发报警信号；z 模拟量的测量；z 通过电触发信号产生的内部时钟同步；z 通过光触发信号产生的内部时钟同步。

1.3.2 串行接口z 与主控站通信；z 配置参数，调试和就地控制；z 下载系统固件。

2 技术参数2.1 基本数据2.1.1 开关量输入a)输入通道个数: 40；b)额定电压: 24 VDC, 110 VDC, 220 VDC 可选；c)电压范围: 额定电压的±20%；d)信号电平/电压范围:低电平: 0 V ∼ 额定电压的40% ；高电平: 额定电压的60% ∼ 额定电压的120%。

e)输入死区时间：1 ms ∼ 2550 s可配置；f)输入滤波时间：1 ms ∼ 2550 s可配置；g)每个通道的功耗: 1.1 W (2.5 mA 220 VDC)；h)电气隔离: 光耦；i)连接: 插入式连接, 4 mm2端子。

2.1.2 开关量输出a)输出通道个数: 24, 每个通道2个空接点（触点）, 每两个通道一个公共回路；b)输出接点电压:选项1: 110 VDC/175 VAC（带触点防护）；选项2: 220 VDC/250 VAC（带触点防护）；选项3: 220 VDC/250 VAC（无触点防护）。

c)最大开关电流: 15 A 最大4 s (通道1到通道22)；25 A 最大4 s (通道23到通道24)；d)最大持续电流: 8 A (通道1到通道22)；10 A (通道23到通道24)；e)切换容量: 50 W∼270 W (通道1到通道22)；35 W∼500 W (通道23到通道24)；f)电气隔离: 继电器；g)连接: 插入式连接, 4 mm2端子。

2.1.3 模拟量输入a)输入通道个数: 8；0XJ 465 160第 4 页共 63 页旧底图总号底图总号签字日期b)额定值: 20 mA，10 V可选；c)标幺值: 10 mA，5 V为100% ；d)测量误差: 0.5%额定值；e)输入滤波器的死区时间: 0.8 ms(20 mA 输入), 50 µF(10 V 输入)；f)每个通道功耗: 20 mW (电流输入) / 2 mW (电压输入)；g)每个电压/电流通道输入阻抗: 50 kΩ(电压输入)/200 Ω(电流输入)；h)电气隔离: 通过外部连接的变送器或互感器；i)连接: 插入式连接, 2.5 mm2端子。

8534T1AVBE1中文资料

SPST
Part number shown: 8533MZQE2
MOM. = Momentary
All models
with all options when ordered with G or Q contact material.
A–61
Third Angle Projection
Dimensions are shown: Inches (mm) Specifications and dimensions subject to change
MODEL NO.
8531
SP
8551
SPST
RATING
1 AMP OFF
3 AMPS
TOTAL TRAVEL
ACTUATION FORCE
MOM.
.095 (2,41) TYP.
with overtravel .042 (1,07) TYP.
7.7 oz (220g) TYP.
SCHEMATIC N.O. with overtravel
nickel plated.
NOTE: Specifications and materials listed above are for switches with standard options. For information on specific and custom switches, consult Customer Service Center.
Build-A-Switch
To order, simply select desired option from each category and place in the appropriate box. Available options are shown and described on pages A-61 thru A-64. For additional options not shown in catalog, consult Customer Service Center. All models have epoxy terminal seal and are compatible with all “bottom-wash” PCB cleaning methods.

PC401,PC401,PC401J00000F,PC401J00000F,PC401TJ0000F, 规格书,Datasheet 资料

PC401s Features(Unit :mm )s Outline DimensionsCompact, Surface Mount Type OPIC PhotocouplerFHL represents forward current when output gose from high to low.FLH represents forward current when output goes from low to high.FHL /I FLH .t r =Z O OH %020010015010050025*********Ambient temperature T a (˚C )P o w e r d i s s i p a t i o n P O , P t o t (m W )1020605040300-2525507510085F (m A )Ambient temperature T a (˚C )F o r w a r d c u r r e n t I Fig. 2 Power Dissipation vs. Ambient Temperature-25P tot P O*3 I *4 I *5 Hysteresis stands for I *6 Test circuit for response time is shown below.125102050100200500F (m A )Fig. 3 Forward Current vs. Forward VoltageFig. 4 Relative Threshold Input Current vs. Supply Voltage00.4R e l a t i v e t h r e s h o l d i n p u t c u r r e n t0.60.81.6-1.41.21.00.2Ambient temperature T a (˚C )Low level output current IOL (mA )F o r w a r d c u r r e n t I 0.2L o w l e v e l o u t p u t v o l t a g e V O L (V )0.30.5-25025501000.100.47516mA5mAAmbient temperature T a (˚C )Fig. 7 Low Level Output Voltage vs. Ambient Temperature0.100.20.511010602520304050Fig. 8 High Level Output Current vs.Forward current IF (mA )Forward CurrentI OL =30mAV CC =5V I F =0V CC =5VT a =25˚CH i g h l e v e l o u t p u t c u r r e n t I O H (µA )0.050.5H i g h l e v e l o u t p u t c u r r e n t I O H (µA )12-252550751000.20.1Fig. 9 High Level Output Current vs. Ambient Temperature012948181254367810146225˚C 85˚C 16 Supply voltage V CC (V )-25˚C C C (m A )Forward current I F (mA )0123561020304060504 (µs )Fig.11 Propagation Delay Time vs. Forward Current00.10.20.512510200.20.30.40.50.6L (k Ω)R i s e t i m e , f a l l t i m e (µs )Fig.12 Rise Time, Fall Time vs.P r o p a g a t i o n d e l a y t i m e Fig.10 Supply Current vs.Supply VoltageS u p p l y c u r r e n t I Ambient temperature T a (˚C )s Preautions for UseGND near the device in order to stabilize power supply line.(2) Handle this product the same as with other integrated circuits against static electricity.(3) As for other general cautions, refer to the chapter “Precautions for Use ”(1) It is recommended that a by-pass capacitor of more than 0.01µF is added between V cc and I F =4mAV CC =V O =15V T a =I CCH I CCLI CCH I CCL I CCH I CCLt ft rV CC =5V I F = 4mA T a =25˚Ct PLHt PHLV CC =5VR L =280ΩT a =25˚CLoad ResistanceLoad resistance RApplication CircuitsNOTICEq The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.q Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.q Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions:(i) The devices in this publication are designed for use in general electronic equipment designs such as:--- Personal computers--- Office automation equipment--- Telecommunication equipment [terminal]--- Test and measurement equipment--- Industrial control--- Audio visual equipment--- Consumer electronics(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)--- Traffic signals--- Gas leakage sensor breakers--- Alarm equipment--- Various safety devices, etc.(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:--- Space applications--- Telecommunication equipment [trunk lines]--- Nuclear power control equipment--- Medical and other life support equipment (e.g., scuba).q Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use.q If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices.q This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.q Contact and consult with a SHARP representative if there are any questions about the contents of this publication.。

FBL22041资料

SYMBOL ai0 – ai6 aO0 – aO6 b0 – b6 OEB0 OEB1 OEB2 OEB3 OEA1 OEA2 OEA3 bus gnd LOGIC gnd LOGIC/bus VCC BG VCC BIAS V TMS Tck Tdi Tdo BG GND PIN NUMBER 51, 2, 3, 8, 9, 14, 18 50, 52, 4, 6, 10, 12, 16 40, 38, 36, 34, 32, 30, 28 46 45 25 26 47 20 24 41, 39, 37, 35, 33, 31, 29 1, 5, 7, 11, 13, 15 23, 43, 49 17 48 42 44 22 21 19 TYPE Input Output i/o Input Input Input Input Input Input Input GND GND Power Power Power Input Input Input Output GND NAME AND FUNCTION Data inputs (TTL) 3-state outputs (TTL) Data inputs/Open Collector outputs, High current drive (BTL) Enables the Bn outputs when High Enables the B0 output when Low Enables the B1 – B3 outputs when Low Enables the B4 – B6 outputs when Low Enables the A0 outputs when High Enables the A1 – A3 outputs when High Enables the A4 – A6 outputs when High Bus ground (0V) Logic ground (0V) Positive supply voltage Positive supply voltage BAND GAP Positive supply voltage Test Mode Select (no-connect) Test Clock (no-connect) Test Data In (shorted to TDO) Test Data Out (TDI) BAND GAP GROUND (0V)

F4931 使用说明书

F4931使用说明书文档版本密级V2.0.0产品名称：F4931共31页F4931使用说明书此说明书适用于下列型号产品：型号产品类别F4931工业计算机厦门四信通信科技有限公司Add：厦门市集美区软件园三期诚毅大街370号A06栋11层客户热线：400-8838-199电话：+86-592-6300320传真：+86-592-5912735网址文档修订记录日期版本说明作者2016.9.06V1.0.0初始版本XHH/WZQ 2016.12.27V1.0.1更新图片内容WZQ 2017.9.23V2.0.0更新地址Faine著作权声明本文档所载的所有材料或内容受版权法的保护，所有版权由厦门四信通信科技有限公司拥有，但注明引用其他方的内容除外。

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产品外形图目录目录 (4)第一章产品简介 (5)1.1产品概述 (5)1.2产品特点 (5)1.3产品规格 (7)第二章安装 (10)2.1概述 (10)2.2开箱 (10)2.3安装与电缆连接 (10)第三章硬件功能 (12)3.1外部接口指示图 (12)3.1.1前视图 (12)3.1.2后视图 (12)3.2前面板I/O连接器 (12)3.2.1音频接口（Speak-out，Mic-in） (12)3.2.2LED指示灯 (13)3.2.3串口（COM1-COM6） (13)3.2.4USB接口 (14)3.2.5以太网接口（LAN） (15)3.2.6显示接口（HDMI高清接口、VGA） (15)3.2.7电源接口 (16)3.3内部接口说明 (16)3.3.1SSD接口（mSATA、J23） (16)3.3.2显示接口（LVDS、CN3） (17)3.3.3Micro SD卡槽 (17)3.3.4SIM卡槽 (18)第四章软件功能 (19)4.1WEB参数配置 (19)4.1.1配置连接图 (19)4.1.2登录到配置页面 (19)4.1.3系统配置 (21)4.1.4系统管理 (25)4.1.4系统信息 (27)4.2自定义脚本配置 (28)4.3tomcat服务 (28)4.4mysql server (29)4.5COM接口 (29)4.6显示接口 (29)4.7播放器启动 (29)附录一常见问题 (30)第一章产品简介1.1产品概述工控机（Industrial Personal Computer，IPC）即工业控制计算机，是一种采用总线结构，对生产过程及机电设备、工艺装备进行检测与控制的工具总称。

F400说明

连接图操作
FA 400 / FA 401
SDI: 数字信号 (内部使用) -VB: 电源电压负极 +VB: 电源电压正极 +I: 4..20 mA 阳性信号 NC: 未连接 NO1: 继电器输出 NO2: 继电器输出 SEL: 内部信号
Pin 1 A SDI B SEL
Pin 2 -VB NC
Pin 3 +VB NC
通电后，显示屏会先进行一个初始化过程，接着就会显示实时的读数。
2 sec.
Software: 1.20 Hardware: 1.1
2 sec.
FA 400/ FA 401
-25.2
ºCtd
出厂时FA 400 / FA 401会被设置成显示露点读数。通过配置菜单可以将它设置成显示最多3个通道的实时读数。FA 400 / FA 401会每两秒切换一次通道。
FA 400 露点传感器 (-80…+20 ºC) FA 401 露点传感器 (-60…+20 ºC)
产品特点
FA 400 / FA 401
适用于低露点应用的露点变送器，可低
至 –80 ºC
长期的稳定性带显示继电器输出 IP65外壳，即使在恶劣工业环境中也
能提供良好保护
8
FA 400 / FA 401 Chinese, V1.20, 14.09.09
在保修期内，如发现产品有问题，请及时与我们联系。
因不按操作手册正确使用造成的损坏将不享受保修。
拆开过的测量仪表也不享受保修，但按操作手册的说明来拆开以进行维护的情况除外。同样，序列号被更改、损坏或移除过的产品也不享受保修。
如果在保修服务范围之外，我们提供了额外的服务，如必要的维修或调节，那么保修服务是免费的，但额外的服务要收费。除非有法定条文规定，希尔思不会对用户的其他损失（如在仪表之外发生的损坏）负责。

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Apr.2008
●Absolute Maximum Ratings
Parameter
Limit
Symbol
Unit
BU4001B BU4011B BU4030B/BU4070B BU4081B BU4093B BU4069UB BU4584B
Power Supply Voltage
VDD
-0.3 to 18
BU4081B/F/FV (Quad 2-input AND gate)
BU4093B/F/FV (Quad 2-input NAND Schmitt trigger)
BU4069UB/F/FV (Hex inverter)
BU4584B/F/FV (Hex Schmitt trigger inverter)
TECHNICAL NOTE
General-purpose CMOS Logic IC Series (BU4000B Series)
High Voltage CMOS Logic ICs
<Logic Gate>
BU4001B/F,BU4011B/F/FV,BU4030B/F,BU4070B/F, BU4081B/F/FV,BU4093B/F/FV,BU4069UB/F/FV,BU4584B/F/FV
AND gate
NAND gate
INV gate
INV gate
BU4001B/F BU4011B/F/FV
(Quad 2-input NOR gate) (Quad 2-input NAND gate)
BU4030B/F
(Quad exclusive OR gate)
BU4070B/F
(Quad exclusive OR gate)
VIL IIH IIL VOH
VOL
IOH
IOL
IDD
MIN 3.5 7.0 11.0 －－－－－ 4.95 9.95 14.95 －－－ -0.16 -0.4 -1.2 0.44 1.1 3.0 －－－
Standard Value
TYP －－－－－－－－－－－－－－－－－－－－－－－
“L” to ”H” Propagation delay time “H” to ”L” Propagation delay time Input capacitance
Symbol tTLH tTHL tPLH tPHL CIN
Standard Value
MIN
TYP
MAX
－
180
－
－
90
－
－
65
●Features
1) Low power consumption 2) Broad operating supply voltage range: 3V to 16V 3) High input impedance 4) High fan out 5) L-TTL2 and LS-TTL1 inputs can be directly driven 6) All outputs are equipped with buffers (except for BU4069UB)
150
℃
●Recommended Operating Conditions
Parameter
Limit
Symbol
Unit
BU4001B BU4011B BU4030B/BU4070B BU4081B BU4093B BU4069UB BU4584B
Operating Power y
VDD
（＊1）（＊2）（＊3） UNIT
9.5
7.0
4.9
mW/℃
When used at Ta=25[°C] or above, values of above are reduced per 1[°C]. Allowable loss is the value for mounting 70[mm] x 70[mm] x 1.6[mm] FR4 glass epoxy circuit board (copper foil area is 3% or less).
MAX －－－ 1.5 3.0 4.0 0.3 -0.3 －－－ 0.05 0.05 0.05 －－－－－－ 1 2 4
Unit VDD[V]
Condition
5
V
10
－
15
5
V
10
－
15
μA
15
VIH=15[V]
μA
15
VIL=0[V]
5
V
10
IO=0[mA]
15
5
V
10
IO=0[mA]
3 to 16
V
Input Voltage
VIN
0 to VDD
V
●Thermal Derating Curve
Power dissipation Pd [mW]
1400 1200 1000 800 600 400 200
0
1180[mV] BU4＊＊＊ (*1) 870[mV] BU4＊＊＊FV (*2) 610[mV] BU4＊＊＊F (*3)
VD D
VD D
VDD
VDD
GND
GND
＜Input＞
GND
GND
＜Output＞
2/16
●Electrical Characteristics（BU4001B）（Unless otherwise noted, VSS=0V, Ta=25℃, CL=50pF）
DC Characteristics
Parameter Input “H” voltage
●Description
BU4001B series ICs are 2-input positive logic NOR gates, each with four built-in circuits. A buffer achieved by an inverter added at the gate output improves the input / output propagation characteristics and minimizes variation in the propagation time caused by an increase in the load capacitance. BU4011B series ICs are 2-input positive logic NAND gates. Four circuits are contained on a single chip. An inverter-based buffer is included at the gate output, enabling improved input / output propagation characteristics, and an increased load capacitance minimizes fluctuations in the propagation time. BU4030B and BU4070B series ICs are exclusive OR gates, each with four built-in circuits. An inverter-based buffer was incorporated at the gate output for enhanced I/O voltage characteristics, and the load capacitance has been increased in order to minimize fluctuations in the propagation time. BU4081B series are 2-input positive logic AND gates with four circuits mounted on a single chip. An inverter-type buffer was added to the gate output, improving input/output transmission speed, and an increased load capacitance suppresses fluctuations in the transmission time. BU4093B series ICs are 4-circuit, 2-input NAND gates whose input pins all have a Schmitt trigger function. BU4069UB series ICs are 6-circuit inverters with no buffers. A single-stage gate configuration reduces propagation time. BU4584B series ICs are inverter-type Schmitt trigger circuits, each incorporating 6 circuits in a single chip.
V
Supply current
Iin
±10
mA
Operating temperature
Topr
-40 to 85
℃
Storage temperature
Tstg
-55 to 150
℃
Input Voltage
VIN
-0.3 to VDD+0.3
V
Maximum junction temperature Tjmax