HybridReflectivecrackReliefSystemAtGreaterPeoria混合型反射裂缝的救济制度在大皮奥里亚

合集下载

光电技术专业英语词汇

《光电技术》专业英语词汇1.Absorption coefficient 吸收系数2.Acceptance angle 接收角3.fibers 光纤4.Acceptors in semiconductors 半导体接收器5.Acousto-optic modulator 声光调制6.Bragg diffraction 布拉格衍射7.Air disk 艾里斑8.angular radius 角半径9.Airy rings 艾里环10.anisotropy 各向异性11.optical 光学的12.refractive index 各向异性13.Antireflection coating 抗反膜14.Argon-ion laser 氩离子激光器15.Attenuation coefficient 衰减系数16.Avalanche 雪崩17.breakdown voltage 击穿电压18.multiplication factor 倍增因子19.noise 燥声20.Avalanche photodiode(APD) 雪崩二极管21.absorption region in APD APD 吸收区域22.characteristics-table 特性表格23.guard ring 保护环24.internal gain 内增益25.noise 噪声26.photogeneration 光子再生27.primary photocurrent 起始光电流28.principle 原理29.responsivity of InGaAs InGaAs 响应度30.separate absorption and multiplication(SAM) 分离吸收和倍增31.separate absorption grading and multiplication(SAGM) 分离吸收等级和倍增32.silicon 硅33.Average irradiance 平均照度34.Bandgap 带隙35.energy gap 能级带隙36.bandgap diagram 带隙图37.Bandwidth 带宽38.Beam 光束39.Beam splitter cube 立方分束器40.Biaxial crystal双s 轴晶体41.Birefringent 双折射42.Bit rate 位率43.Black body radiation law 黑体辐射法则44.Bloch wave in a crystal 晶体中布洛赫波45.Boundary conditions 边界条件46.Bragg angle 布拉格角度47.Bragg diffraction condition 布拉格衍射条件48.Bragg wavelength 布拉格波长49.Brewster angle 布鲁斯特角50.Brewster window 布鲁斯特窗51.Calcite 霰石52.Carrier confinement 载流子限制53.Centrosymmetric crystals 中心对称晶体54.Chirping 啁啾55.Cladding 覆层56.Coefficient of index grating 指数光栅系数57.Coherence连贯性pensation doping 掺杂补偿59.Conduction band 导带60.Conductivity 导电性61.Confining layers 限制层62.Conjugate image 共轭像63.Cut-off wavelength 截止波长64.Degenerate semiconductor 简并半导体65.Density of states 态密度66.Depletion layer 耗尽层67.Detectivity 探测率68.Dielectric mirrors 介电质镜像69.Diffraction 衍射70.Diffraction g rating 衍射光栅71.Diffraction grating equation 衍射光栅等式72.Diffusion current 扩散电流73.Diffusion flux 扩散流量74.Diffusion Length 扩散长度75.Diode equation 二极管公式76.Diode ideality factor 二极管理想因子77.Direct recombinatio直n接复合78.Dispersion散射79.Dispersive medium 散射介质80.Distributed Bragg reflector 分布布拉格反射器81.Donors in semiconductors 施主离子82.Doppler broadened linewidth 多普勒扩展线宽83.Doppler effect 多普勒效应84.Doppler shift 多普勒位移85.Doppler-heterostructure 多普勒同质结构86.Drift mobility 漂移迁移率87.Drift Velocity 漂移速度88.Effective d ensity o f s tates 有效态密度89.Effective mass 有效质量90.Efficiency 效率91.Einstein coefficients 爱因斯坦系数92.Electrical bandwidth of fibers 光纤电子带宽93.Electromagnetic wave 电磁波94.Electron affinity 电子亲和势95.Electron potential energy in a crystal 晶体电子阱能量96.Electro-optic effects 光电子效应97.Energy band 能量带宽98.Energy band diagram 能量带宽图99.Energy level 能级100.E pitaxial growth 外延生长101.E rbium doped fiber amplifier 掺饵光纤放大器102.Excess carrier distribution 过剩载流子扩散103.External photocurrent 外部光电流104.Extrinsic semiconductors 本征半导体105.Fabry-Perot laser amplifier 法布里-珀罗激光放大器106.Fabry-Perot optical resonator 法布里-珀罗光谐振器107.Faraday effect 法拉第效应108.Fermi-Dirac function 费米狄拉克结109.Fermi energy 费米能级110.Fill factor 填充因子111.Free spectral range 自由谱范围112.Fresnel’s equations 菲涅耳方程113.Fresnel’s optical indicatrix 菲涅耳椭圆球114.Full width at half maximum 半峰宽115.Full width at half power 半功率带宽116.Gaussian beam 高斯光束117.Gaussian dispersion 高斯散射118.Gaussian pulse 高斯脉冲119.Glass perform 玻璃预制棒120.Goos Haenchen phase shift Goos Haenchen 相位移121.Graded index rod lens 梯度折射率棒透镜122.Group delay 群延迟123.Group velocity 群参数124.Half-wave plate retarder 半波延迟器125.Helium-Neon laser 氦氖激光器126.Heterojunction 异质结127.Heterostructure 异质结构128.Hole 空穴129.Hologram 全息图130.Holography 全息照相131.Homojunction 同质结132.Huygens-Fresnel principle 惠更斯-菲涅耳原理133.Impact-ionization 碰撞电离134.Index matching 指数匹配135.Injection 注射136.Instantaneous irradiance 自发辐射137.Integrated optics 集成光路138.Intensity of light 光强139.Intersymbol interference 符号间干扰140.Intrinsic concentration 本征浓度141.Intrinsic semiconductors 本征半导体142.Irradiance 辐射SER 激光144.active medium 活动介质145.active region 活动区域146.amplifiers 放大器147.cleaved-coupled-cavity 解理耦合腔148.distributed Bragg reflection 分布布拉格反射149.distributed feedback 分布反馈150.efficiency of the He-Ne 氦氖效率151.multiple quantum well 多量子阱152.oscillation condition 振荡条件ser diode 激光二极管sing emission 激光发射155.LED 发光二极管156.Lineshape function 线形结157.Linewidth 线宽158.Lithium niobate 铌酸锂159.Load line 负载线160.Loss c oefficient 损耗系数161.Mazh-Zehnder modulator Mazh-Zehnder 型调制器162.Macrobending loss 宏弯损耗163.Magneto-optic effects 磁光效应164.Magneto-optic isolator 磁光隔离165.Magneto-optic modulator 磁光调制166.Majority carriers 多数载流子167.Matrix emitter 矩阵发射168.Maximum acceptance angle 最优接收角169.Maxwell’s wave equation 麦克斯维方程170.Microbending loss 微弯损耗171.Microlaser 微型激光172.Minority carriers 少数载流子173.Modulated directional coupler 调制定向偶合器174.Modulation of light 光调制175.Monochromatic wave 单色光176.Multiplication region 倍增区177.Negative absolute temperature 负温度系数 round-trip optical gain 环路净光增益179.Noise 噪声180.Noncentrosymmetric crystals 非中心对称晶体181.Nondegenerate semiconductors 非简并半异体182.Non-linear optic 非线性光学183.Non-thermal equilibrium 非热平衡184.Normalized frequency 归一化频率185.Normalized index difference 归一化指数差异186.Normalized propagation constant 归一化传播常数187.Normalized thickness 归一化厚度188.Numerical aperture 孔径189.Optic axis 光轴190.Optical activity 光活性191.Optical anisotropy 光各向异性192.Optical bandwidth 光带宽193.Optical cavity 光腔194.Optical divergence 光发散195.Optic fibers 光纤196.Optical fiber amplifier 光纤放大器197.Optical field 光场198.Optical gain 光增益199.Optical indicatrix 光随圆球200.Optical isolater 光隔离器201.Optical Laser amplifiers 激光放大器202.Optical modulators 光调制器203.Optical pumping 光泵浦204.Opticalresonator 光谐振器205.Optical tunneling光学通道206.Optical isotropic 光学各向同性的207.Outside vapor deposition 管外气相淀积208.Penetration depth 渗透深度209.Phase change 相位改变210.Phase condition in lasers 激光相条件211.Phase matching 相位匹配212.Phase matching angle 相位匹配角213.Phase mismatch 相位失配214.Phase modulation 相位调制215.Phase modulator 相位调制器216.Phase of a wave 波相217.Phase velocity 相速218.Phonon 光子219.Photoconductive detector 光导探测器220.Photoconductive gain 光导增益221.Photoconductivity 光导性222.Photocurrent 光电流223.Photodetector 光探测器224.Photodiode 光电二极管225.Photoelastic effect 光弹效应226.Photogeneration 光子再生227.Photon amplification 光子放大228.Photon confinement 光子限制229.Photortansistor 光电三极管230.Photovoltaic devices 光伏器件231.Piezoelectric effect 压电效应232.Planck’s radiation distribution law 普朗克辐射法则233.Pockels cell modulator 普克尔斯调制器234.Pockel coefficients 普克尔斯系数235.Pockels phase modulator 普克尔斯相位调制器236.Polarization 极化237.Polarization transmission matrix 极化传输矩阵238.Population inversion 粒子数反转239.Poynting vector 能流密度向量240.Preform 预制棒241.Propagation constant 传播常数242.Pumping 泵浦243.Pyroelectric detectors 热释电探测器244.Quantum e fficiency 量子效应245.Quantum noise 量子噪声246.Quantum well 量子阱247.Quarter-wave plate retarder 四分之一波长延迟248.Radiant sensitivity 辐射敏感性249.Ramo’s theorem 拉莫定理250.Rate equations 速率方程251.Rayleigh criterion 瑞利条件252.Rayleigh scattering limit 瑞利散射极限253.Real image 实像254.Recombination 复合255.Recombination lifetime 复合寿命256.Reflectance 反射257.Reflection 反射258.Refracted light 折射光259.Refractive index 折射系数260.Resolving power 分辩力261.Response time 响应时间262.Return-to-zero data rate 归零码263.Rise time 上升时间264.Saturation drift velocity 饱和漂移速度265.Scattering 散射266.Second harmonic generation 二阶谐波267.Self-phase modulation 自相位调制268.Sellmeier dispersion equation 色列米尔波散方程式269.Shockley equation 肖克利公式270.Shot noise 肖特基噪声271.Signal to noise ratio 信噪比272.Single frequency lasers 单波长噪声273.Single quantum well 单量子阱274.Snell’s law 斯涅尔定律275.Solar cell 光电池276.Solid state photomultiplier 固态光复用器277.Spectral intensity 谱强度278.Spectral responsivity 光谱响应279.Spontaneous emission 自发辐射280.stimulated emission 受激辐射281.Terrestrial light 陆地光282.Theraml equilibrium 热平衡283.Thermal generation 热再生284.Thermal velocity 热速度285.Thershold concentration 光强阈值286.Threshold current 阈值电流287.Threshold wavelength 阈值波长288.Total acceptance angle 全接受角289.Totla internal reflection 全反射290.Transfer distance 转移距离291.Transit time 渡越时间292.Transmission coefficient 传输系数293.Tramsmittance 传输294.Transverse electric field 电横波场295.Tranverse magnetic field 磁横波场296.Traveling vave lase 行波激光器297.Uniaxial crystals 单轴晶体298.UnPolarized light 非极化光299.Wave 波300.W ave equation 波公式301.Wavefront 波前302.Waveguide 波导303.Wave n umber 波数304.Wave p acket 波包络305.Wavevector 波矢量306.Dark current 暗电流307.Saturation signal 饱和信号量308.Fringing field drift 边缘电场漂移plementary color 补色310.Image lag 残像311.Charge handling capability 操作电荷量312.Luminous quantity 测光量313.Pixel signal interpolating 插值处理314.Field integration 场读出方式315.Vertical CCD 垂直CCD316.Vertical overflow drain 垂直溢出漏极317.Conduction band 导带318.Charge coupled device 电荷耦合组件319.Electronic shutter 电子快门320.Dynamic range 动态范围321.Temporal resolution 动态分辨率322.Majority carrier 多数载流子323.Amorphous silicon photoconversion layer 非晶硅存储型324.Floating diffusion amplifier 浮置扩散放大器325.Floating gate amplifier 浮置栅极放大器326.Radiant quantity 辐射剂量327.Blooming 高光溢出328.High frame rate readout mode 高速读出模式329.Interlace scan 隔行扫描330.Fixed pattern noise 固定图形噪声331.Photodiode 光电二极管332.Iconoscope 光电摄像管333.Photolelctric effect 光电效应334.Spectral response 光谱响应335.Interline transfer CCD 行间转移型CCD336.Depletion layer 耗尽层plementary metal oxide semi-conductor 互补金属氧化物半导体338.Fundamental absorption edge 基本吸收带339.Valence band 价带340.Transistor 晶体管341.Visible light 可见光342.Spatial filter 空间滤波器343.Block access 块存取344.Pupil compensation 快门校正345.Diffusion current 扩散电流346.Discrete cosine transform 离散余弦变换347.Luminance signal 高度信号348.Quantum efficiency 量子效率349.Smear 漏光350.Edge enhancement 轮廓校正351.Nyquist frequency 奈奎斯特频率352.Energy band 能带353.Bias 偏压354.Drift current 漂移电流355.Clamp 钳位356.Global exposure 全面曝光357.Progressive scan 全像素读出方式358.Full frame CCD 全帧CCD359.Defect correction 缺陷补偿360.Thermal noise 热噪声361.Weak inversion 弱反转362.Shot noise 散粒噪声363.Chrominance difference signal 色差信号364.Colotremperature 色温365.Minority carrier 少数载流子366.Image stabilizer 手振校正367.Horizontal CCD 水平CCD368.Random noise 随机噪声369.Tunneling effect 隧道效应370.Image sensor 图像传感器371.Aliasing 伪信号372.Passive 无源373.Passive pixel sensor 无源像素传感器374.Line transfer 线转移375.Correlated double sampling 相关双采样376.Pinned photodiode 掩埋型光电二极管377.Overflow 溢出378.Effective pixel 有效像素379.Active pixel sensor 有源像素传感器380.Threshold voltage 阈值电压381.Source follower 源极跟随器382.Illuminance 照度383.Refraction index 折射率384.Frame integration 帧读出方式385.Frame interline t ransfer CCD 帧行间转移CCD 386.Frame transfer 帧转移387.Frame transfer CCD 帧转移CCD388.Non interlace 逐行扫描389.Conversion efficiency 转换效率390.Automatic gain control 自动增益控制391.Self-induced drift 自激漂移392.Minimum illumination 最低照度393.CMOS image sensor COMS 图像传感器394.MOS diode MOS 二极管395.MOS image sensor MOS 型图像传感器396.ISO sensitivity ISO 感光度。

半导体一些术语的中英文对照

半导体一些术语的中英文对照离子注入机ion implanterLSS理论Lindhand Scharff and Schiott theory 又称“林汉德-斯卡夫-斯高特理论”。

沟道效应channeling effect射程分布range distribution深度分布depth distribution投影射程projected range阻止距离stopping distance阻止本领stopping power标准阻止截面standard stopping cross section 退火annealing激活能activation energy等温退火isothermal annealing激光退火laser annealing应力感生缺陷stress-induced defect择优取向preferred orientation制版工艺mask-making technology图形畸变pattern distortion初缩first minification精缩final minification母版master mask铬版chromium plate干版dry plate乳胶版emulsion plate透明版see-through plate高分辨率版high resolution plate, HRP超微粒干版plate for ultra-microminiaturization 掩模mask掩模对准mask alignment对准精度alignment precision光刻胶photoresist又称“光致抗蚀剂”。

负性光刻胶negative photoresist正性光刻胶positive photoresist无机光刻胶inorganic resist多层光刻胶multilevel resist电子束光刻胶electron beam resistX射线光刻胶X-ray resist刷洗scrubbing甩胶spinning涂胶photoresist coating后烘postbaking光刻photolithographyX射线光刻X-ray lithography电子束光刻electron beam lithography离子束光刻ion beam lithography深紫外光刻deep-UV lithography光刻机mask aligner投影光刻机projection mask aligner曝光exposure接触式曝光法contact exposure method接近式曝光法proximity exposure method光学投影曝光法optical projection exposure method 电子束曝光系统electron beam exposure system分步重复系统step-and-repeat system显影development线宽linewidth去胶stripping of photoresist氧化去胶removing of photoresist by oxidation等离子［体］去胶removing of photoresist by plasma 刻蚀etching干法刻蚀dry etching反应离子刻蚀reactive ion etching, RIE各向同性刻蚀isotropic etching各向异性刻蚀anisotropic etching反应溅射刻蚀reactive sputter etching离子铣ion beam milling又称“离子磨削”。

2022款福特 Bronco 两门和四门车型规格说明书

* H orsepower and torque ratings based on premium fuel per SAE J1349 standard. Horsepower and torque are independent attributes and may not be achieved simultaneously.For editorial use only. Information correct at time of publication. Check for updates.BODYVehicle type Midsize two-door and four-door rugged 4x4 SUVTrim series Base, Big Bend ™, Black Diamond ™, Everglades ™, Outer Banks ™, Badlands ™, Wildtrak ™, Raptor ™ (see specs on separate page)Option packages Mid, High, Lux, Sasquatch ™ Package Final assembly locationMichigan Assembly Plant, Wayne, MichiganENGINES2.3-liter EcoBoost ® 2.7-liter EcoBoost Configuration Ti-VCT GTDI I-4Ti-VCT GTDI 60-degree V6Displacement 138 cu. in. (2,264 cc)164 cu. in. (2,694 cc)Bore x stroke 3.45 in. x 3.7 in. (87.55 mm x 94 mm) 3.27 in. x 3.27 in. (83 mm x 83 mm)Compression ratio 10.0:110.0:1Fuel deliveryDirect injectionPort fuel/direct injectionEngine control system Chassis integrated powertrain control module Chassis integrated powertrain control module Engine block material High-pressure die cast aluminum alloyCompacted graphite ironPistonsLightweight, high-strength cast aluminum with low-friction skirt coating and steel ring Lightweight, high-strength cast aluminum with low-friction skirt coating and steel ring Connecting rods Forged steel Forged steel Crankshaft Forged steelForged steelValve diameter/lift Intake, 32.5 mm/8.9 mm Exhaust, 30 mm/7.8 mm Intake, 32.50 mm/10 mm Exhaust, 28.30 mm/9.0 mmValve lifters Direct acting mechanical bucket Roller finger follower, hydraulic compensating lash adjusters Intake Composite, split plenum Composite Ignition Coil on plugCoil on plugInduction Twin-scroll turbocharger with electrically actuated wastegate Dual mono-scroll turbochargers with electrically actuated wastegate ExhaustCast ironIntegrated cylinder head casting Recommended fuel Regular unleaded 87 octane minimum Regular unleaded 87 octane minimum Oil capacity 6.2 quarts 7.0 quarts Coolant capacity 11.1 liters11.7 litersExhaust system Single catalyst with resonator and single muffler Double catalyst with resonator and single muffler Alternator Standard: Single 240A Standard: Single 240A Battery groupH7 AGM 80 AH 800 CCA H7 AGM 80 AH 800 CCA SAE horsepower (regular fuel)275 @ 5,700 rpm 315 @ 5,500 rpm SAE torque (regular fuel)315 @ 3,400 rpm 410 @ 3,250 rpm SAE horsepower (premium fuel)*300 @ 5,700 rpm 330 @ 5,250 rpm SAE torque (premium fuel)*325 @ 3,400 rpm 415 @ 3,100 rpm Build locationCleveland Engine PlantLima Engine Plant* M aximum ratios with high-capability option packages.For editorial use only. Information correct at time of publication. Check for updates.DRIVETRAINLayoutLongitudinally mounted front engine with center-mounted transfer case, independent front axles/solid rear axlesTRANSMISSIONSStandard 7-speed (6+1 crawler gear) Getrag manual (offered on 2.3-liter engine only)Optional10-speed automatic (available on both 2.3- and 2.7-liter engines)Gear Ratios7-Speed Manual 10-Speed Automatic Crawler 6.588:1First 4.714:1First 4.283:1Second 2.997:1Second 2.365:1Third 2.149:1Third1.453:1Fourth 1.769:1Fourth 1.000:1Fifth 1.521:1Fifth 0.776:1Sixth 1.275:1Sixth 0.646:1Seventh 1.000:1Reverse-5.625:1Eight 0.853:1Ninth 0.689:1Tenth 0.636:1Reverse-4.885:1Transfer Cases StandardOptional4x4 with part-time engagement electronic shift-on-the-fly, 2.72:1 low ratioAdvanced 4x4 with 4A mode automatic on-demand engagement, 3.06:1 low ratioMaximum crawl ratios*79.92:1 – 7-speed manual with standard ESOF57.19:1 – 10-speed speed automatic with standard ESOF 94.75:1 – 7-speed manual with optional Advanced 4x467.80:1 – 10-speed automatic with optional Advanced 4x4Flat-tow capability Yes Yes Axles FrontRearStandard Dana ™ AdvanTEK ® M190 independent front suspension Dana 44™ AdvanTEK M220 solid rear differential OptionalDana ™ AdvanTEK ® M210 independent front suspension with Spicer ® Performa-TraK electronic lockerDana 44™ AdvanTEK M220 solid rear differential with Spicer ®Performa-TraK electronic lockerCHASSISTypeBody-on-frame; fully boxed high-strength steel frame with seven cross members, High-Performance Off-Road Stability Suspension (HOSS) System with low-mass independent front suspension, five-link solid rear axle with Panhard rod and outboard coilover springs Suspensions FrontRearStandard Twin forged alloy A-arms with long-travel coil-over springs, HOSS-tuned heavy-duty dampers 220 mm solid rear axle with long-travel, variable rate coil-over springs, HOSS-tuned heavy-duty dampers OptionalBilstein ® position-sensitive dampers with Bilstein position-sensitive dampers with* R equires heavy-duty modular front bumper.For editorial use only. Information correct at time of publication. Check for updates.BODYTwo-door Four-door Tops standard(varies by trim series)Removable hardtop Removable soft-top Removable hardtopRoof panel weight (pounds)14.0 front left, 15.4 front right 13.6 front left, 14.5 front right, 28.1 mid panel Doors/storage Two removeable frameless doors Four removable frameless doors Available rear storage for four doors Door weight (pounds)Front 62Front 55/Rear 44Modular section Doors, roof panels, front fenders, grille, fender flares, rear quarter panels, bumpersRock rail Standard on Black Diamond, Everglades and Badlands series dealer installed accessory on all other Bronco series Tube stepsStandard on Outer Banks, available on Big Bend and WildtrakUnderbody protectionBlack Diamond, Everglades and Widltrak (optional): Five steel underbody shields including engine shield, transfer case shield, fuel tank shield, shin guards and heavy-duty front bash plate*Badlands: Six steel underbody shields including engine shield, transfer case shield, fuel tank shield, shin guards, stabilizer-bar shield and heavy-duty front bash plate*Modular bumpers Heavy-duty powder-coated modular steel front bumper with heavy-duty bash plate standard on Everglades, available on all other seriesWashout vinyl flooring with drain plugsStandard on Black Diamond, Everglades and Badlands series Trail sights with 150-pound tie-down capacityStandard on all Bronco seriesBRAKESFront RearType Four-wheel power disc brakes with four-sensor, four-channel antilock braking system and electronic stability control Boost2.3-liter engine, vacuum brake boost, 2.7-liter engine, electronic brake boost Brake configuration Vented discs, twin-piston floating caliper Discs with single-piston floating caliper, integral electronic parking brake Rotor diameter/thickness 311 mm x 34 mm 308 mm x 24 mm Pad material Non-asbestos organic Non-asbestos organic Caliper type Twin 51-mm floating Single 54-mm floating Pad swept area413 cm 2373 cm2TypeThree-mode rack-and-pinion steering with standard, comfort and sport modes controlled via Terrain Management System ™ with G.O.A.T. Modes ™ (Goes Over Any Type of Terrain)Turning radius (curb-to-curb)35.53 feet (10.83 m)12.13 m (Badlands)/12.15 m (Sasquatch)BANG & OLUFSEN ©2021 and B&O ©2021. BANG & OLUFSEN ™ and B&O ™ are registered trademarks of Bang & Olufsen Group. Licensed by Harman Becker Automotive Systems Manufacturing Kft. All rights reserved.For editorial use only. Information correct at time of publication. Check for updates.TECHNOLOGYTerrain Management with G.O.A.T. ModesStandard modes, Base (5): Normal, Eco, Sport, Slippery and SandBig Bend, Outer Banks (6): Normal, Eco, Sport, Slippery, Mud/Ruts and SandBlack Diamond and Everglades (7): Normal, Eco, Sport, Slippery, Mud/Ruts, Sand and Rock Crawl Badlands, First Edition (7): Normal, Eco, Slippery, Mud/Ruts, Baja, Sand and Rock Crawl Wildtrak (7): Normal, Eco, Sport, Slippery, Baja, Mud/Ruts and Sand Trail control Standard on all Bronco series with 10-speed automatic transmission Trail turn assist Standard on all Bronco series with 10-speed automatic transmission Trail one-pedal driveStandard on 2.7-liter V6 models with 10-speed automatic transmissionBaseBig Bend Black Diamond Everglades Outer Banks Badlands Wildtrak HMI/audio system, SYNC ® 4 8-inch8-inch 8-inch 12-inch 8-inch 8-inch 8-inchABS/stability control electric power-assisted steering, and ABSAirbagsFirst-row driver and passenger dual-stage front and seat side airbagsAll rows: Safety Canopy side-curtain airbags with rollover sensors for all rows*D enotes Sasquatch ™ PackageFor editorial use only. Information correct at time of publication. Check for updates.WHEELSSeries StandardBase 16-inch bright polished silver-painted steel Standard Big Bend 17-inch Carbonized Gray-painted aluminum Standard Black Diamond 17-inch black gloss-painted black steel Optional Black Diamond 17-inch black mid-gloss-painted aluminum Standard Everglades 17-inch Carbonized Gray-painted alloy wheelsStandard Outer Banks 18-inch bright machined black high-gloss-painted aluminum Standard Badlands 17-inch machined Carbonized Gray-painted aluminumOptional Badlands 17-inch black high-gloss-painted aluminum with Carbonized Gray beauty ring, beadlock-capable StandardWildtrak*17-inch black high-gloss-painted aluminum with black beauty ring, beadlock-capableSasquatch Package SeriesOptionalBase, Big Bend, Black Diamond, Badlands17-inch black high-gloss-painted aluminum with warm alloy beauty ring, beadlock-capableLIGHTING/CONVENIENCEBaseBig Bend Black Diamond Everglades Outer Banks Badlands Wildtrak Headlamps Auto on/off LED Auto high-beamS S S S S S S Bronco signature LED lighting N/A O N/A N/A S S S LED fog lampsN/A S S S S S S Mirror LED approach lamps and LED spotlightsN/A N/A N/A N/A O O O Overhead upfitter switches with six-pre-wired user-defined electrical connectionsO O S S O S S Dual-control HVAC automatic temperature control N/A O O S S O S Heated front seatsN/A O O S S O S Central locking system with keyless entry and push-button start S S S S S S S Push button startS S S S S S S Intelligent access (lock/unlock)N/A O O S S O S Remote start system with FordPass Connect (automatic transmission models only)S S S S S S S Power window SSSSSSSAccessory ElectricalOne 110V AC 400 watt power outlet (Mid Package and up; rear of center console)Power points (12V) – one (1) center floor console, one (1) cargo areaStandard: Smart Charging Multimedia USB Ports, First Row – One (1) USB-A and one (1) USB-C; Smart Charging USB Ports, Second Row – One (1) USB-A and one (1) USB-C in the back side of the center floor consoleOptional: Lux package – Smart Charging USB Ports, dash board – One (1) USB-A and one (1) USB-CDIMENSIONS/CAPACITIES (INCHES)Two-door Four-doorWheelbaseAll series100.4116.1LengthBase173.7189.4Big Bend173.7189.4Wildtrak173.7189.5Badlands174.8190.5Everglades N/A198.9HeightBase71.973.0 (soft-top)Big Bend72.972.9Wildtrak75.275.3Badlands73.873.9( W hen available roof racks are installed, add 3.6 inches to two-doormodels, 3.4 inches to four-door models for maximum height)Everglades N/A78.7 (includes standard roof rack) Width (with mirrors folded)Base/Big Bend75.975.9Wildtrak79.379.3Badlands76.376.3Everglades N/A79.4 (includes mirrors)Track width, front/rearBase/Big Bend/Badlands65.0/65.065.0/65.0Wildtrak/Everglades66.9/66.966.9/66.9Seating capacity Four FivePassenger volume, hardtop (cu. ft.)99103.7Passenger volume, soft-top (cu. ft.)N/A108.2Behind first row, hardtop (cu. ft.)52.377.6Behind first row, soft-top (cu. ft.)N/A83.0Behind second row, hardtop (cu. ft.)22.435.6Behind second row, soft-top (cu. ft.)N/A38.3HeadroomFirst row, hardtop41.040.8First row, soft-top N/A43.3Second row, hardtop39.840.1Second row, soft-top N/A41.1LegroomFirst row43.143.1Second row35.736.3Hip roomFirst row56.355.9Second row43.354.8Shoulder roomFirst row57.157.1Second row51.856.5Fuel capacity (gallons)16.920.8For editorial use only. Information correct at time of publication. Check for updates.* R emote start on automatic transmission models only. **Trailer tow capability determined using SAE J2807 standard. † Requires optional Ford Accessories hitch. †Additional options may decrease payload.For editorial use only. Information correct at time of publication. Check for updates.OPTION GROUP HIGHLIGHTSMid Package equipment group highlightsSYNC 4 with 8-inch LCD touch screen/audio system, connected navigation, dual-zone HVAC, front-rowheated seats, two-door intelligent access, remote start system,* Ford Co-Pilot360, reverse sensing system, rear passenger power outletHigh Package equipment group highlightsIncludes all Mid Package content plus:SYNC 4 with 12-inch LCD touch screen/audio system and information on-demand panel, 360-degree camera, forward sensing system, additional sound deadening, mirror-mounted LED approach lamps and spotlights Lux Package equipment group highlightsIncludes all Mid and High Package content plus:10-speaker B&O Sound System by Bang & Olufsen, adaptive cruise control and evasive steering assist, heated steering wheel, connected built-in navigation with three years of service, wireless charging padand dash-mounted USB-A and USB-C smart charging portsBase 2.3-liter EcoBoost I-47-speed manual 2,3384,2941,2465,5402,9003,0003,500†8,780Big Bend 2.3-literEcoBoost I-47-speed manual 2,3444,3041,2365,5402,9003,0003,5008,780Black Diamond 2.3-liter EcoBoost I-47-speed manual 2,4904,5871,0535,6402,9003,0003,5008,780Badlands 2.3-liter EcoBoost I-47-speed manual 2,5764,6991,0215,7202,9003,0003,5008,780Base 2.3-liter EcoBoost I-410-speed SelectShift automatic 2,3534,3141,2265,5402,9003,0003,500†8,480Big Bend 2.3-liter EcoBoost I-410-speed SelectShift automatic 2,3594,3241,2165,5402,9003,0003,5008,780Black Diamond 2.3-liter EcoBoost I-410-speed SelectShift automatic 2,5044,6051,0345,6402,9003,0003,5008,480Outer Banks 2.3-liter EcoBoost I-410-speed SelectShift automatic 2,4024,4131,1275,5402,9003,0003,5008,480Badlands 2.3-liter EcoBoost I-410-speed SelectShift automatic 2,5914,7191,0015,7203,0003,0003,5008,780Base 2.7-liter EcoBoost V610-speed SelectShift automatic 2,4934,4661,2345,7003,0003,0003,500†8,740Big Bend 2.7-liter EcoBoost V610-speed SelectShift automatic 2,4994,4761,2245,7003,0003,0003,5008,740Black Diamond 2.7-liter EcoBoost V610-speed SelectShift automatic 2,6444,7571,0225,7803,0003,0003,5008,840Outer Banks 2.7-liter EcoBoost V610-speed SelectShift automatic 2,5424,5651,1355,7003,0003,0003,5008,740Badlands 2.7-liter EcoBoost V610-speed SelectShift automatic 2,7314,8719895,8603,0003,0003,5008,840Wildtrak2.7-liter EcoBoost V610-speed SelectShift automatic2,5444,5741,0695,7403,0003,0003,5008,740†Requires optional Ford Accessories hitch.For editorial use only. Information correct at time of publication. Check for updates.WARRANTYBumper-to-bumper Three years/36,000 miles Powertrain Five years/60,000 miles CorrosionFive years/unlimited miles Roadside assistance24-hour/day (3 years/36 miles)。

表面增强衰减全反射红外光谱英文

表面增强衰减全反射红外光谱英文Alright, here's a piece of writing on Surface-Enhanced Attenuated Total Reflection Infrared Spectroscopy (SEATR-IR) in an informal and conversational tone, while adhering tothe given requirements:So, have you ever heard of SEATR-IR? It's like thiscool party trick in the world of spectroscopy. It takes infrared light and makes it dance on a surface, but notjust any surface. This one's enhanced! It's like adding a little sparkle to your outfit, but for molecules.Yeah, the science part is that it uses total reflection to capture the vibrations of molecules. But don't get me wrong, it's not like a mirror reflecting light—it's more like a whisper-loud conversation between molecules andlight waves. And when you enhance that surface, it's like adding a megaphone to the mix.Imagine going to a concert and being able to hear everynote, every breath, every nuance. That's what SEATR-IR does for molecules. It gives us a super-detailed view of what's happening on that surface, like a high-def camera zoomingin on a tiny dance floor.And the cool thing is, this isn't just for show. Scientists use it to understand reactions, to figure.。

电器电子词汇英语翻译

模拟数字转换器模数转换器 a d converter缓冲存储器abbreviated code快速呼叫abbreviated dialing象差aberration?异常辉光放电abnormal glow discharge异常反射abnormal reflections磨耗abrasion?磨粉abrasive dust磨料喷射加工abrasive jet machining?磨料喷射蝶abrasive jet trimming磨蚀剂abrasive paste?研磨蝶abrasive trimming磨料abrasive?急剧退化abrupt degradation突变异质结abrupt heterojunction突变结abrupt junction绝对亮度阈absolute threshold of luminance吸收功率absorbed power吸收剂absorber?吸收能力absorbing capacity?吸收电路absorbing circuit吸收层absorbing layer 吸收媒质absorbing medium?吸收跃迁absorbing transition吸收带absorption band吸收长度absorption length吸收线absorption line吸收损失absorption loss?吸收测定absorption measurement 吸收灯absorption modulation吸收点absorption point吸收电阻absorption resistance吸收absorption?对接abutment joint?截割水晶片ac cut quartz ac加速老化accelerated aging?加速粒子accelerated particle加速试验accelerated test?加速阳极accelerating anode加速周期accelerating cycle?加速电极accelerating electrode加速栅极accelerating grid加速缝accelerating slit加速管accelerating tube?加速波accelerating wave?带电粒子加速acceleration of charged particles加速空间acceleration space加速电压acceleration voltage?加重accentuation较佳对比度acceptable contrast ratio受主acceptor受汁子acceptor atom受中心acceptor center受周度acceptor density受钟质acceptor impurity受周级acceptor level受滞半导体acceptor type semiconductor 存取码access code访问方法access method适应性第accommodation第系数accommodation coefficient?累积层accumulation layer再生精确度accuracy in reproduction精确定位accurate positioning改进型专用射极耦合逻辑ace 消色差区achromatc region消色差透镜achromatic lens?消色差阈值achromatic threshold针状结晶acicular crystal酸腐蚀acid etch橡实管acorn tube吸声系数acoustic absorptivity?滤声器acoustic filter?声频acoustic frequency?声像acoustic image声阻抗acoustic impedance?声迷路acoustic labyrinth声动录音机acoustic manipulated recorder 声面波acoustic surface waves声能转换器acoustic transducer声学处理acoustic treatment音波acoustic wave表面声波振荡器acoustic wave oscillator声延时线acoustical delay line受钟质acceptor impurity受周级acceptor level受滞半导体acceptor type semiconductor存取码access code访问方法access method适应性第accommodation第系数accommodation coefficient?累积层accumulation layer再生精确度accuracy in reproduction精确定位accurate positioning改进型专用射极耦合逻辑ace消色差区achromatc region消色差透镜achromatic lens?消色差阈值achromatic threshold针状结晶acicular crystal酸腐蚀acid etch橡实管acorn tube吸声系数acoustic absorptivity?滤声器acoustic filter?声频acoustic frequency?声像acoustic image声阻抗acoustic impedance?声迷路acoustic labyrinth声动录音机acoustic manipulated recorder 声面波acoustic surface waves 声能转换器acoustic transducer声学处理acoustic treatment音波acoustic wave表面声波振荡器acoustic wave oscillator 声延时线acoustical delay line酌半径action radius?活化阴板activated cathode活化分子activated molecule?激活能activation energy?激活activation?有源区active area有效分量active component积极干扰active counter measures活性粉尘active dust有源元件active element有源元件组active element group活性纤维active fiber有源滤波器active filter织制导active guidance织寻的制导active homing guidance有源激光元件active laser element激光皮捉质active laser substance活性液体active liquid有源波模同步active mode locking有源寄生元件active parasitics有源q 开关active q switching有源备份active redundancy有源中继器active repeater有源四端网络的反射损耗active return loss 有源卫星转发器active satellite repeater 有源衬底active substrate有源衬底蝶active substrate trimming传动机构actuator?锐度acuity适应性均衡器adaptability equalizer适应adaptation?套筒式联轴器adapter coupling转接器adapter?自适应相关器adaptive correlator自适应增量灯adaptive delta modulation 自适应接收机adaptive receiver吸附原子adatom爱德考克天线adcock antenna爱德考克测向仪adcock direction finder 附加元件add ons加色法混合additive color mixture加色法合成additive color synthesis加色法系统additive color system基色的相加混合additive mixing of primaries加色法原色additive primaires印刷电路的添加技术additive printed circuit technique加色法additive process?寻址系统addressing system附着adherence?粘着强度adhesion strength?粘合剂adhesive粘合剂涂敷adhesive coating芯片粘附adhesive die attachment胶粘密封adhesive sealing粘合带adhesive tape邻道伴音载波adjacent audio carrier相邻信道adjacent channel邻信道衰减adjacent channel attenuation 邻信道干扰adjacent channel interference 邻频道抑制器adjacent channel rejector相邻信道选择性adjacent channel selectivity相邻线路adjacent lines邻信道图象载波adjacent picture carrier相邻图象载波间隔adjacent picture carrier spacing邻频道图象载波陷波器adjacent picture carrier trap可单减器adjustable attenuator可堤路adjustable short可敌值金属氧化物半导体adjustable threshold mos蝶adjustment?导纳矩阵admittance matrix导纳admittance?混合物admixture?吸附质adsorbate吸附剂adsorbent?吸附层adsorption layer?吸附adsorption?低劣半导体材料adulterated semiconductor material超前角advance angle?改进型低功耗肖特基晶体管晶体管逻辑电路advanced low power schottky ttl 改进型自对准多晶硅栅工艺advanced polysilicon self aligned process改进型肖特基晶体管逻辑电路advanced schottky transistor logic改进型肖特基晶体管晶体管逻辑电路advanced schottky ttl天线阵aerial array天线衰减器aerial attenuator天线电缆aerial cable天线电容aerial capacity天线扼力aerial choke天线电路aerial circuit天线藕合aerial coupling天线藕合线圈aerial coupling coil天线电流aerial current天线效率aerial efficiency天线激励aerial excitation天线馈电aerial feed天线馈线aerial feeder天线阻抗aerial impedance天线电感aerial inductance天线引入线aerial lead in透镜天线aerial lens天线损耗aerial loss天线噪声aerial noise天线功率aerial power天线辐射电阻aerial radiation resistance 天线电抗aerial reactance天线电阻aerial resistance天线系统aerial system天线接头aerial terminal天线杆aerial tower?天线党电容器aerial tuning capacitor天线党线圈aerial tuning coil天线aerial?航空电子学的aeroelectronic航空电子学aeroelectronics?无线电报aerogram导航电台aeronautical station飞机天线aeroplane antenna飞机反射的干扰信号aeroplane flutter俄歇电子能谱学aes音频af?亲合力affinity?后加速after acceleration余辉afterglow 余像afterimage后处理aftertreatment?老化条件ageing condition老化ageing?集聚aggregate?雪崩注入ai雪崩注入二极管aid半自动跟踪aided tracking雪崩感生徙动aim空气隔离型单片集成电路aimic空气轴承台air bearing stage空隙air clearance?空气冷却式激光器air cooled laser空对地通信air ground communication空气隔离air isolation空气隔离型集成电路air isolation integrated circuit空气隔离型集成工艺air isolation process漏气air leak?空气氧化物隔离air oxide isolation空中位置指示器air position indicator吹气清洗air purge侦察海面舰艇的飞机监视雷达air to surface vessel radar风动传送设备air track飞机无线电信标airborne beacon空传污染airborne contamination机载雷达airborne radar机载电视接收机airborne television receiver拦截飞机雷达aircraft interception radar飞机电台aircraft station机场信标airport beacon机场危险信标airport danger beacon机场交通控制airport traffic control气密接合airtight joint报警信号alarm signal?反射率测量albedo measurement反照率albedo?自动逻辑设计ald阿尔福德环形天线alford loop antenna铝栅alg算法algorithm?对准器aligner对准精度alignment accuracy 对准误差alignment error蝶用激光器alignment laser对准标记alignment mark定位锁alignment pin?精密对准alignment registration校准要求alignment requirements定位alignment?碱金属锑化物alkali antimonide无碱环境alkali free environment由碱可除光刻胶alkaline strippable resist 全波段电视党器all band tv tuner全扩散型集成电路all diffused integrated circuit交直两用接收机all mains receiver全天候雷达all weather radar分配器allotter?容许能带allowed band?容许能级allowed level容许线allowed line容许跃迁allowed transition合金薄膜alloy film合金结alloy junction合金结晶体管alloy junction transistor合金晶体管alloy transistor合金alloy?合金接触alloyed contact合金型二极管alloyed diode合金区域alloyed region接字母顺序的alpha抗射线性alpha immunity粒子轰击alpha particle bombardment粒子保护alpha particle protection粒子辐射灵敏度alpha radiation sensitivity 粒子闪烁计数器alpha scintillation counter 字符印字管alphanumeric printing tube管alphatron?更替路由alternate route隔行扫描alternate scanning交流alternating current交菱量alternating current measurement 交羚阻alternating current resistance超导交流alternating supercurrent高度计altimeter?高度指示器altitude indicator?算术与逻辑部件alu 氧化铝陶瓷板划线alumina ceramic scribing氧化铝管壳alumina package氧化铝alumina?铝金属化aluminizing铝硅酸盐玻璃aluminosilicate glass铝线热压焊aluminum bonding氧化铝陶瓷aluminum oxide ceramics铝尖峰形成aluminum spiking氧化物阶梯的铝覆盖aluminum step coverage铝线热压焊接aluminum wire bond爹收音机am receiver爹接收am reception爹am?爱好者amateur业余波段amateur band业余无线电台amateur radio station环境空气监测器ambient air monitor周围环境ambient enviroment环境湿度ambient humidity环境压力ambient pressure?周围介质温度ambient temperature非单值性ambiguity?双极性扩散ambipolar diffusion?氨微波激射器氨脉泽ammonia maser铵分子束频率标准ammonium molecular beam frequency standard无定形化amorphization非晶态晶态转变amorphous crystalline transition对非晶半导体离子注入amorphous implantation非晶半导体amorphous semiconductor非晶半导体掐amorphous semiconductor device非晶形状态amorphous state?无定形结构amorphous structure?信息量amount of information?放大系数amplification constant?放大谱线宽amplification linewidth放大amplification?放大屁频带amplifier band放大齐声amplifier noise放大级amplifier stage放大器amplifier?放大速弟amplifying klystron 放大跃迁amplifying transition放大管amplifying tube特高频功率放大管amplitron幅度校正amplitude correction?鉴幅器amplitude discriminator?振幅失真amplitude distortion?振幅误差校正amplitude error correction 振幅偏移amplitude excursion振幅频率失真amplitude frequency distortion振幅频率响应amplitude frequency response?限幅歧路amplitude limiter circuit限幅器amplitude limiter?爹发射机amplitude modulated transmitter爹甚高频发射机amplitude modulated vhf transmitter爹监视器amplitude modulation monitor 爹噪声amplitude modulation noise爹抑制amplitude modulation suppression 爹器amplitude modulator视频信号振幅amplitude of videosignal视频信号振幅范围amplitude range ofvideosignal振幅特性曲线amplitude response?振幅稳定激光器amplitude stabilized laser 酌距离amplitude?模拟阵列analog array模拟集成电路analog chip模拟计算机analog computer?模拟数字网络analog digital network模拟电子学analog electronics模拟信息analog information模拟微电子学analog microelectronics模拟灯analog modulation模拟网络analog network模拟移相器analog phase shifter模拟记录analog recording模拟信号analog signal?模拟开关analog switch模拟的analogue模拟放大器analogue amplifier模拟计算analogue computation模拟式乘法运算器analogue multiplier分析器analyzer? 与电路and circuit?与元件and element或非门and nor gate 与与操作and operation与或电路and or circuit无回声室anechoic room磨角angle lap角灯angle modulation?射束偏转角angle of beam deflection发散角angle of divergence仰角angle of elevation?槽倾斜角angle of groove inclination入射角angle of incidence?倾斜角angle of inclination?光入射角angle of light incidence辐射角angle of radiation角度数字变换器angle to digit converter 角跟踪angle tracking倾斜离子注入angled ion implantation角分布angular distribution?角分辨率angular resolution?阴离子交换尸anion resin阴离子anion?蛤异性腐蚀anisotropic etch蛤异性腐蚀断面图anisotropic etch profile 蛤异性腐蚀性质anisotropic etch property 蛤异性腐蚀剂anisotropic etchant蛤异性材料anisotropic material?蛤异性anisotropy?退火炉annealer?退火杂质活化annealing activation退火覆盖层annealing cap热处理annealing?广播员announcer环形锯片annular blade环形接触annular contact环形锯片切割annular cutting环状电阻器annular resistor环状旋转接头annular rotary joint环形锯annular saw环状缝隙annular slot 阳极特性anode characteristic阳极暗区anode dark space阳极检波anode detection屏极耗散anode dissipation阳极效率anode efficiency阳极电解腐蚀anode etching屏极输出器anode follower阳辉光anode glow阳极栅极电容anode grid capacity 屏极负载anode load阳极中和anode neutralization阳极氧化anode oxidation阳极射线anode rays屏极检波anode rectification阳极电阻anode resistance阳极溅射anode sputtering?阳极寄生振荡抑制器anode stopper阳极电源anode supply阳极端子anode terminal阳极电压anode voltage阳极anode?阳极的anodic阳极处理anodization异常晶体生长anomalous crystal growth应答塞绳answering cord应答装置answering device应答塞answering plug天线放大器antenna amplifier天线电容器antenna capacitor天线转换开关antenna change over switch 天线接线antenna connection天线耦合电容器antenna coupling condenser天线效应antenna effect天线元件antenna element天线电动势antenna emf天线输入阻抗antenna feed impedance 天线场强增益antenna field gain天线接地开关antenna grounding switch平均地表面上天线高度antenna height above average terrain天线引线antenna lead天线插座antenna socket天线仰角antenna tilt防撞雷达anti collision device消感网络anti induction network抗氧化层anti oxidation layer天线收发转换开关anti transmit receive switch对阴极anticathode?预告信号anticipating signal反符合电路anticoincidence circuit抗衰落犬线antifading antenna抗衰落装置antifading device反铁电体antiferroelectric阻厄电路antihunt circuit抗干扰接收机antijam receiver抗干扰装置antijamming unit锑antimony?抗噪声antinoise反雷达antiradar 反雷达导弹antiradar missile反雷达学antiradiolocation反卫星导弹antisatellite missile防静电剂antistatic agent防静电设备antistatic aids防静电组装antistatic assembly防静电袋antistatic bag防静电手套antistatic gloves防静电掩模底版antistatic mask blank 防静电台antistatic station防静电表面处理antistatic surface treatment防静电工具antistatic tool反斯托克斯线antistockes line收发开关盒antitrans mit receive box常压化学汽相淀积apcvd非党天线aperiodic antenna非周期电路aperiodic circuit张角aperture angle孔径失真补偿aperture compensation 孔径耦合aperture coupling孔径失真aperture distortion孔径均衡aperture equalization针孔透镜aperture lens孔径损失aperture loss多孔障板aperture mask孔镜aperture mirror孔径光阑aperture stop口径aperture?外观检查appearance inspection? 苹果彩色显象管apple tube敷料器applicator应用全息照相术applied holography 进场信标approach beacon进场管理approach control进场指挥雷达approach control radar 水清洗器aqueous cleaner水处理aqueous processing电弧阴极arc cathode弧光灯激励arc lamp pumping电弧等离子体arc plasma弧arc?逆弧arcback构造architecture?电弧放电arcing显光管arcotron区域码area code面积型成像机area imager氩激光器argon laser?氩argon?运算装置arithmetical unit?盗丹振荡器armstrong oscillator 排列arrangement?阵列array阵列式芯片array chip阵列集成电路array device阵列布图array layout阵列逻辑array logic存贮企列array memory阵列图象形成array patterning 阵列间距array pitch阵列处理array processing阵列结构array structure输入电流arrival current掺砷发射极arsenic doped emitter掺砷外延层arsenic doped epi砷掺杂arsenic doping涂布的砷溶液arsenic spin on solution 砷arsenic?砷化物arsenide可听清晰度articulation?假天线artificial aerial人工老化artificial ageing?仿真天线artificial antenna黑电平测试信号artificial black signal 仿真延迟线artificial delay line假回波artificial echo人造电子眼artificial electronic eye 仿真全息图artificial hologram仿置线artificial line版图检查工具artwork checking tool 原图设计artwork design图形发生artwork generation图形发生器artwork generator原图制备刀artwork knife照相底图artwork master原图artwork?超声波水下探测器asdic长宽比aspect ratio? 微观粗糙度asperity汇编程序;装配器assembler组装错误assembly defect装配图assembly drawing?装配设备assembly equipment装配夹具assembly fixture?装配室assembly room组装台assembly station?组装成品率assembly yield组装assembly?分配频率assigned frequency交莲磁assistating current magnetic biasing相联存储器associative memory非稳定电路astable circuit非稳态多谐振荡器astable multivibrator 像散现象astigmatism天文电子学astrionics天体电子学astronics天体脉泽astronomical maser天文航海astronomical navigation非对称振幅灯asymmetric amplitude modulation不对称边带传送asymmetric sideband transmission不对称偏转asymmetrical deflection异先操作asynchronous operation异步应答方式asynchronous response mode异步传输asynchronous transmission 切割晶体at cut crystal at 自动测试设备ate大气模型atmosphere model大气atmosphere?大气吸收带atmospheric absorption band 大气吸收atmospheric absorption?大气衰减atmospheric attenuation大气波导atmospheric duct大气电场atmospheric electric field大气波导管atmospheric guide大气压激光器atmospheric pressure laser大气透射带atmospheric transmission band大气透射系数atmospheric transmittance 大气窗atmospheric window?大气干扰atmospherics原子吸收分光光度法atomic absorptionspectrophotometry原子束频率标准atomic beam frequency standard原子束激光器atomic beam laser原子钟atomic clock?原子发射光谱仪Atomic Emission Spectrometer AES原子频率标准atomic frequency standard 原子氢atomic hydrogen原子型杂质atomic impurity原子电离atomic ionization原子激光器atomic laser原子谱线宽度atomic linewidth原子核atomic nucleus?原子时标准atomic time standard自动测试系统ats 可达清晰度attainable resolution衰减常数attenuation constant?衰减器attenuation pad?衰减attenuation?听觉的audio声频放大器audio amplifier伴音载波audio carrier伴音中心频率audio center frequency伴音通道audio channel声频放大audio frequency amplification 音频频带audio frequency band音频扼力audio frequency choke音频发生器audio frequency generator 音频频率计audio frequency meter音频峰值限幅器audio frequency peak limiter音频变压器audio frequency transformer 音频电平指示器audio level indicator音频混频器audio mixer音频回音装置audio output unit音频范围audio range音频信号audio signal音频频谱audio spectrum音频频谱分析器audio spectrum analyzer 声道audio track音频发射机audio transmitter听力图audiogram听力计audiometer测听技术audiometry 三极检波管audion检查audit?听能听能audition俄歇电子发射auger electron emission 俄歇电子auger electron?俄歇微探针auger microprobe俄歇复合auger recombination俄歇能谱仪auger spectrometer俄歇跃迁auger transition无线电导航有声信标aural radio range 收听aural reception伴音发射机aural transmitter南极光aurora australis北极光aurora borealis极光aurora?故障autage确认authentication自动加速autoacceleration自动补偿器autocompensator自动控制autocontrol?自相关数autocorrelation?自差接收法autocyne reception自掺杂autodoping自差autodyne自拍接收机autodyne receiver自动标引autoindexing自动掩模对准器automask aligner自动设计automated design?自动应答装置automatic answering device 对比度与亮度自动平衡automatic balance of contrast and brightness自动黑电平电路automatic black level circuit自动黑电平控制automatic black level control自动检验automatic check?自动色度蝶automatic chrominance control自动元件装卸装置automatic component handler自动计算机automatic computer对比度自动蝶automatic contrast control 自动控制系统automatic control system? 自动消磁automatic degaussing自动电话交换机automatic exchange自动聚焦automatic focusing自动频率控制特性automatic frequencycontrol characteristic自动频率控制automatic frequency control? 自动增益控制automatic gain control自偏压automatic grid bias自动色地制automatic hue control自动插入automatic insertion自动布图技术automatic layout technique 自动行同步automatic line phasing直接长途拨号automatic long distance service自动监视器automatic monitor自动图象稳定控制automatic picture stabilization自动定线器automatic router自动停机automatic stop?自动副载波平衡控制automatic subcarrier balance control 自动电报automatic telegraphy自动电话交换局automatic telephone exchange自动电话交换系统automatic telephone switching system自动发射机automatic transmitter自动党automatic tuning自动真空淀积系统automatic vacuum deposition system自动视频杂波限制器automatic video noise limiter自动白电平控制automatic white control汽车收音机automobile radio汽车电话automobile telephone自对准autoregistration辅助阳极auxiliary anode辅助栅极auxiliary grid辅助塞孔auxiliary jack辅助存储器auxiliary memory辅助信号auxiliary signal备份发射机auxiliary transmitter可用功率available power雪崩酌avalanche action雪崩哗avalanche breakdown雪崩哗电压avalanche breakdown voltage 雪崩二极管avalanche diode雪崩注入多层栅金属氧化物半导体avalanche injection stacked gate mos雪崩电离avalanche ionization雪崩倍增avalanche multiplication雪崩倍增系数avalanche multiplication factor 雪崩噪声avalanche noise雪崩光电探测器avalanche photodetector 雪崩光电二极管avalanche photodiode雪崩晶体管avalanche transistor雪崩渡越时间二极管avalanche transit time diode雪崩渡越时间二极管振荡器avalanche transit time oscillator电子雪崩avalanche?平均亮度average brightness平均图象电平average picture level求平均数averaging?轴向电子感应加速岂荡axial betatron oscilations轴向腐蚀不均匀性axial etch nonuniformity轴向通量分米波超高功率四极管axial flow resnatron轴向注入axial injection轴向引线成形设备axial lead former 轴心线axial lead?轴向稳定性axial stability轴向激励激光器axially excited laser 波导管轴axis of a waveguide方位角精度azimuth accuracy方位蝶azimuth adjustment方位角驱动azimuth drive方位角仰角指示器azimuth elevation indicator方位角损失azimuth loss方位角分辨率azimuth resolution方位角;方位角azimuth?方位角群聚azimuthal bunchingDN A及蛋白质的测序和合成仪-- Sequencers and Synthesizers for DNA and Protein。

Ritec发布新一代ClearShield生态系统玻璃

在实验中，研究人员将ＡＲ涂层用磁控溅射的方
法进行沉积。该方法用的机器最初是在眼睛镜片上沉积减反射涂层用的，因此很容易实现工业化生产。
正如Ｗａｌｌｓ指出，玻璃制造商已具备应用这些宽带增透膜的能力。有关专家认为： “ 太阳能组件制造商需要了解它的优势和应用需求，其成本将随量产而大大降低。 ” 测试数据表明，这种材料还具有防刮擦、耐用，耐久性满足光伏制造商的２５年保修。Ｗａｌｌｓ和他的同
康宁第三代大猩猩玻璃的坚韧度是普通钠钙玻
Ｒｉｔｅｃ发布新一代ＣｌｅａｒＳｈｉｅｌｄ生态系统玻璃
在今年举办的世界玻璃技术展上，Ｒｉｔｅｃ公司将发布其最新一代的ＣｌｅａｒＳｈｉｅｌｄ生态系统玻璃。新一代的ＣｌｅａｒＳｈｉｅｌｄ突出了化学交联系统，提升了抑制剂
一
绝大部分资产出售给汽车玻璃制造商福耀玻璃美国有限公司。公司并未透露此次交易的财务细节。
— —
种结石，它由呈扇状排列的针状晶体组成，最大可
达几毫米。失透物的存在会影响到玻璃的外观和光
４０— —
Ａｒｃｈｉｔｅｃｔｕｒａｌ＆ＦｕｎｃｔｉｏｎａｌＧｌａｓＳＮ＿ｏ９２０１４
拉夫堡大学的叠层设计，厚度小于３００纳米，仅
福耀玻璃计划重建并改造该工厂的两条生产线，

top258pn

TOP252-262TOPSwitch-HX Family January 2009Enhanced EcoSmart ®, Integrated Off-Line Switcher with Advanced Feature Set and Extended Power Range®Product HighlightsLower System Cost, Higher Design FlexibilityMulti-mode operation maximizes efﬁciency at all loads New eSIP-7F and eSIP-7C packagesLow thermal impedance junction-to-case (2 °C per watt)Low height is ideal for adapters where space is limitedSimple mounting using a clip to aid low cost manufacturing Horizontal eSIP-7F package ideal for ultra low height adapter and monitor applicationsExtended package creepage distance from DRAIN pin to adjacent pin and to heat sinkNo heatsink required up to 35 W using P , G and M packages with universal input voltage and up to 48 W at 230 VACOutput overvoltage protection (OVP) is user programmable for latching/non-latching shutdown with fast AC reset Allows both primary and secondary sensingLine undervoltage (UV) detection prevents turn-off glitches Line overvoltage (OV) shutdown extends line surge limit Accurate programmable current limitOptimized line feed-forward for line ripple rejection132 kHz frequency (254Y-258Y and all E/L packages) reduces transformer and power supply sizeHalf frequency option for video applications Frequency jittering reduces EMI ﬁ lter cost •••••••••••••••••Figure 1. Typical Flyback Application.Heatsink is connected to SOURCE for low EMIImproved auto-restart delivers <3% of maximum power in short circuit and open loop fault conditionsAccurate hysteretic thermal shutdown function automatically recovers without requiring a resetFully integrated soft-start for minimum start-up stress Extended creepage between DRAIN and all other pins improves ﬁ eld reliability•••••Table 1.Output Power Table. (for notes see page 2).Rev. F 01/09EcoSmart ®– Energy Efﬁ cientEnergy efﬁcient over entire load range No-load consumptionLess than 200 mW at 230 VAC Standby power for 1 W input>600 mW output at 110 VAC input >500 mW output at 265 VAC inputDescriptionTOPSwitch-HX cost effectively incorporates a 700 V power MOSFET, high voltage switched current source, PWM control, oscillator, thermal shutdown circuit, fault protection and other control circuitry onto a monolithic device.••••••Figure 2. Typical Flyback Application TOP259YN, TOP260YN and TOP261YN.Y Package Option for TOP259-261In order to improve noise-immunity on large TOPSwitch-HX Y package parts, the F pin has been removed (TOP259-261YN are ﬁ xed at 66 kHz switching frequency) and replaced with a SIGNAL GROUND (G) pin. This pin acts as a low noise path for the C pin capacitor and the X pin resistor. It is only required for the TOP259-261YN package parts.Notes for Table 1:1. Minimum continuous power in a typical non-ventilatedenclosed adapter measured at +50 °C ambient. Use of an external heat sink will increase power capability. 2. Minimum continuous power in an open frame design at+50 °C ambient.3. Peak power capability in any design at +50 °C ambient.4. 230 VAC or 110/115 VAC with doubler.5. Packages: P: DIP-8C, G: SMD-8C, M: SDIP-10C,Y: TO-220-7C, E: eSIP-7C, L: eSIP-7F .See part ordering information.6. TOP261 and TOP262 have the same current limit set point. Insome applications TOP262 may run cooler than TOP261 due to a lower R DS(ON) for the larger device.7. TOP256E package parts are available with Green (HalogenFree) mold compound. See Part Ordering Information on page 47. Parametrically green material encapsulated E package parts are identical to non-green parts. Section ListFunctional Block Diagram (4)Pin Functional Description (6)TOPSwitch-HX Family Functional Description (7)CONTROL (C) Pin Operation (8)Oscillator and Switching Frequency (8)Pulse Width Modulator (9)Maximum Load Cycle (9)ErrorAmpliﬁer (9)On-Chip Current Limit with External Programmability (9)Line Under-Voltage Detection (UV) (10)Line Overvoltage Shutdown (OV) (11)Hysteretic or Latching Output Overvoltage Protection (OVP) (11)Line Feed-Forward with DCMAX Reduction (13)Remote ON/OFF and Synchronization (13)Soft-Start (13)Shutdown/Auto-Restart (13)Hysteretic Over-Temperature Protection (13)BandgapReference (13)High-Voltage Bias Current Source (13)Typical Uses of FREQUENCY (F) Pin (15)Typical Uses of VOLTAGE MONITOR (V) and EXTERNAL CURRENT LIMIT (X) Pins (16)Typical Uses of MULTI-FUNCTION (M) Pin (18)Application Examples (21)A High Efﬁ ciency, 35 W, Dual Output – Universal Input Power Supply (21)A High Efﬁ ciency, 1500 W, 250-380 VDC Input Power Supply (22)A High Efﬁ ciency, 20 W Continuous – 80 W Peak, Universal Input Power Supply (23)A High Efﬁ ciency, 65 W, Universal Input Power Supply (24)Key Application Considerations (25)TOPSwitch-HX vs.TOPSwitch-GX (25)TOPSwitch-HX Design Considerations (26)TOPSwitch-HX Layout Considerations (27)Quick Design Checklist (31)DesignTools (31)Product Speciﬁ cations and Test Conditions (32)Typical Performance Characteristics (39)Package Outlines (43)Part Ordering Information (47)Rev. F 01/09Rev. F 01/09Figure 3a. Functional Block Diagram (P and G Packages).Figure 3b. Functional Block Diagram (M Package).Rev. F 01/09Figure 3c. Functional Block Diagram (TOP254-258 YN Package and all eSIP Packages).Figure 3d. Functional Block Diagram TOP259YN, TOP260YN, TOP261YN.Rev. F 01/09Pin Functional DescriptionDRAIN (D) Pin:High-voltage power MOSFET DRAIN pin. The internal start-up bias current is drawn from this pin through a switched high-voltage current source. Internal current limit sense point for drain current.CONTROL (C) Pin:Error ampliﬁ er and feedback current input pin for duty cycle control. Internal shunt regulator connection to provide internal bias current during normal operation. It is also used as the connection point for the supply bypass and auto-restart/compensation capacitor.EXTERNAL CURRENT LIMIT (X) Pin (Y, M, E and L package):Input pin for external current limit adjustment and remote ON/OFF. A connection to SOURCE pin disables all functions on this pin.Figure 4. Pin Conﬁ guration (Top View).P I -4711-021308Figure 5. TOP254-258 Y and All M/E/L Package Line Sense and Externally Set Current Limit.Figure 7. P/G Package Line Sense.P I -4983-021308Figure 6. TOP259-261 Y Package Line Sense and External Current Limit.VOLTAGE MONITOR (V) Pin (Y & M package only):Input for OV, UV, line feed forward with DC MAX reduction, output overvoltage protection (OVP), remote ON/OFF and device reset. A connection to the SOURCE pin disables all functions on this pin.MULTI-FUNCTION (M) Pin (P & G packages only):This pin combines the functions of the VOLTAGE MONITOR (V) and EXTERNAL CURRENT LIMIT (X) pins of the Y package into one pin. Input pin for OV, UV, line feed forward with DC MAXRev. F 01/09Figure 8. P/G Package Externally Set Current Limit.reduction, output overvoltage protection (OVP), external current limit adjustment, remote ON/OFF and device reset. Aconnection to SOURCE pin disables all functions on this pin and makes TOPSwitch-HX operate in simple three terminal mode (like TOPSwitch-II).FREQUENCY (F) Pin (TOP254-258Y, and all E and L packages):Input pin for selecting switching frequency 132 kHz if connected to SOURCE pin and 66 kHz if connected to CONTROL pin. The switching frequency is internally set for ﬁ xed 66 kHzoperation in the P , G, M package and TOP259YN, TOP260YN and TOP261YN.SIGNAL GROUND (G) Pin (TOP259YN, TOP260YN & TOP261YN only):Return for C pin capacitor and X pin resistor.SOURCE (S) Pin:Output MOSFET source connection for high voltage power return. Primary side control circuit common and reference point.TOPSwitch-HX Family Functional DescriptionLike TOPSwitch-GX, TOPSwitch-HX is an integrated switched mode power supply chip that converts a current at the control input to a duty cycle at the open drain output of a high voltage power MOSFET. During normal operation the duty cycle of the power MOSFET decreases linearly with increasing CONTROL pin current as shown in Figure 9.In addition to the three terminal TOPSwitch features, such as the high voltage start-up, the cycle-by-cycle current limiting, loop compensation circuitry, auto-restart and thermalshutdown, the TOPSwitch-HX incorporates many additional functions that reduce system cost, increase power supply performance and design ﬂ exibility. A patented high voltageCMOS technology allows both the high-voltage power MOSFET and all the low voltage control circuitry to be cost effectively integrated onto a single monolithic chip.Three terminals, FREQUENCY, VOLTAGE-MONITOR, andEXTERNAL CURRENT LIMIT (available in Y and E/L packages),two terminals, VOLTAGE-MONITOR and EXTERNAL CURRENT LIMIT (available in M package) or one terminal MULTI-FUNCTION (available in P and G package) have been used to implement some of the new functions. These terminals can be connected to the SOURCE pin to operate the TOPSwitch-HX in aTOPSwitch-like three terminal mode. However, even in this three terminal mode, the TOPSwitch-HX offers many transparent features that do not require any external components:A fully integrated 17 ms soft-start signiﬁcantly reduces or eliminates output overshoot in most applications by sweeping both current limit and frequency from low to high to limit the peak currents and voltages during start-up.A maximum duty cycle (DC MAX ) of 78% allows smaller inputstorage capacitor, lower input voltage requirement and/or higher power capability.Multi-mode operation optimizes and improves the powersupply efﬁ ciency over the entire load range while maintaining good cross regulation in multi-output supplies.1.2.3.Figure 9. Control Pin Characteristics (Multi-Mode Operation).Rev. F 01/09Switching frequency of 132 kHz reduces the transformer sizewith no noticeable impact on EMI.Frequency jittering reduces EMI in the full frequency mode athigh load condition.Hysteretic over-temperature shutdown ensures automaticrecovery from thermal fault. Large hysteresis prevents circuit board overheating.Packages with omitted pins and lead forming provide largedrain creepage distance.Reduction of the auto-restart duty cycle and frequency toimprove the protection of the power supply and load during open loop fault, short circuit, or loss of regulation.Tighter tolerances on I 2f power coefﬁ cient, current limitreduction, PWM gain and thermal shutdown threshold.The VOLTAGE-MONITOR (V) pin is usually used for line sensing by connecting a 4 M Ω resistor from this pin to the rectiﬁ ed DC high voltage bus to implement line overvoltage (OV), under-voltage (UV) and dual-slope line feed-forward with DC MAXreduction. In this mode, the value of the resistor determines the OV/UV thresholds and the DC MAX is reduced linearly with a dual slope to improve line ripple rejection. In addition, it also provides another threshold to implement the latched and hysteretic output overvoltage protection (OVP). The pin can also be used as a remote ON/OFF using the I UV threshold.The EXTERNAL CURRENT LIMIT (X) pin can be used to reduce the current limit externally to a value close to the operating peak current, by connecting the pin to SOURCE through a resistor. This pin can also be used as a remote ON/OFF input.For the P and G package the VOLTAGE-MONITOR andEXTERNAL CURRENT LIMIT pin functions are combined on one MULTI-FUNCTION (M) pin. However, some of the functions become mutually exclusive.The FREQUENCY (F) pin in the TOP254-258 Y and E/L packages set the switching frequency in the full frequency PWM mode to the default value of 132 kHz when connected to SOURCE pin. A half frequency option of 66 kHz can be chosen by connecting this pin to the CONTROL pin instead. Leaving this pin open is not recommended. In the P , G and M packages and the TOP259-261 Y packages, the frequency is set internally at 66 kHz in the full frequency PWM mode.CONTROL (C) Pin OperationThe CONTROL pin is a low impedance node that is capable of receiving a combined supply and feedback current. During normal operation, a shunt regulator is used to separate thefeedback signal from the supply current. CONTROL pin voltage V C is the supply voltage for the control circuitry including the MOSFET gate driver. An external bypass capacitor closely connected between the CONTROL and SOURCE pins is required to supply the instantaneous gate drive current. The total amount of capacitance connected to this pin also sets the auto-restart timing as well as control loop compensation.When rectiﬁ ed DC high voltage is applied to the DRAIN pin during start-up, the MOSFET is initially off, and the CONTROL pin capacitor is charged through a switched high voltage4.5.6.7.8.9.current source connected internally between the DRAIN and CONTROL pins. When the CONTROL pin voltage V C reaches approximately 5.8 V, the control circuitry is activated and the soft-start begins. The soft-start circuit gradually increases the drain peak current and switching frequency from a low starting value to the maximum drain peak current at the full frequency over approximately 17 ms. If no external feedback/supplycurrent is fed into the CONTROL pin by the end of the soft-start, the high voltage current source is turned off and the CONTROL pin will start discharging in response to the supply current drawn by the control circuitry. If the power supply is designed properly, and no fault condition such as open loop or shorted output exists, the feedback loop will close, providing external CONTROL pin current, before the CONTROL pin voltage has had a chance to discharge to the lower threshold voltage of approximately 4.8 V (internal supply undervoltage lockout threshold). When the externally fed current charges theCONTROL pin to the shunt regulator voltage of 5.8 V, current in excess of the consumption of the chip is shunted to SOURCE through an NMOS current mirror as shown in Figure 3. The output current of that NMOS current mirror controls the duty cycle of the power MOSFET to provide closed loop regulation. The shunt regulator has a ﬁ nite low output impedance Z C that sets the gain of the error ampliﬁ er when used in a primary feedback conﬁ guration. The dynamic impedance Z C of the CONTROL pin together with the external CONTROL pin capacitance sets the dominant pole for the control loop.When a fault condition such as an open loop or shorted output prevents the ﬂ ow of an external current into the CONTROL pin, the capacitor on the CONTROL pin discharges towards 4.8 V. At 4.8 V, auto-restart is activated, which turns the output MOSFET off and puts the control circuitry in a low current standby mode. The high-voltage current source turns on and charges the external capacitance again. A hysteretic internal supply undervoltage comparator keeps V C within a window of typically 4.8 V to 5.8 V by turning the high-voltage current source on and off as shown in Figure 11. The auto-restart circuit has a divide-by-sixteen counter, which prevents the output MOSFET from turning on again until sixteen discharge/charge cycles have elapsed. This is accomplished by enabling the output MOSFET only when the divide-by-sixteen counter reaches the full count (S15). The counter effectively limitsTOPSwitch-HX power dissipation by reducing the auto-restart duty cycle to typically 2%. Auto-restart mode continues until output voltage regulation is again achieved through closure of the feedback loop.Oscillator and Switching FrequencyThe internal oscillator linearly charges and discharges an internal capacitance between two voltage levels to create atriangular waveform for the timing of the pulse width modulator. This oscillator sets the pulse width modulator/current limit latch at the beginning of each cycle.The nominal full switching frequency of 132 kHz was chosen to minimize transformer size while keeping the fundamental EMI frequency below 150 kHz. The FREQUENCY pin (available only in TOP254-258 Y and E, L packages), when shorted to the CONTROL pin, lowers the full switching frequency to 66 kHzRev. F 01/09Figure 10. Switching Frequency Jitter (Idealized V DRAIN Waveforms).(half frequency), which may be preferable in some cases such as noise sensitive video applications or a high efﬁ ciency standby mode. Otherwise, the FREQUENCY pin should be connected to the SOURCE pin for the default 132 kHz. In the M, P and G packages and the TOP259-261 Y package option, the full frequency PWM mode is set at 66 kHz, for higher efﬁ ciency and increased output power in all applications.To further reduce the EMI level, the switching frequency in the full frequency PWM mode is jittered (frequency modulated) by approximately ±2.5 kHz for 66 kHz operation or ±5 kHz for 132 kHz operation at a 250 Hz (typical) rate as shown in Figure 10. The jitter is turned off gradually as the system is entering the variable frequency mode with a ﬁ xed peak drain current.Pulse Width ModulatorThe pulse width modulator implements multi-mode control by driving the output MOSFET with a duty cycle inversely proportional to the current into the CONTROL pin that is in excess of the internal supply current of the chip (see Figure 9). The feedback error signal, in the form of the excess current, is ﬁ ltered by an RC network with a typical corner frequency of 7 kHz to reduce the effect of switching noise in the chip supply current generated by the MOSFET gate driver.To optimize power supply efﬁ ciency, four different control modes are implemented. At maximum load, the modulator operates in full frequency PWM mode; as load decreases, the modulator automatically transitions, ﬁ rst to variable frequency PWM mode, then to low frequency PWM mode. At light load, the control operation switches from PWM control to multi-cycle-modulation control, and the modulator operates in multi-cycle-modulation mode. Although different modes operate differently to make transitions between modes smooth, the simple relationship between duty cycle and excess CONTROL pin current shown in Figure 9 is maintained through all three PWM modes. Please see the following sections for the details of the operation of each mode and the transitions between modes.Full Frequency PWM mode: The PWM modulator enters full frequency PWM mode when the CONTROL pin current (I C ) reaches I B . In this mode, the average switching frequency is kept constant at f OSC (66 kHz for P , G and M packages and TOP259-261 Y, pin selectable 132 kHz or 66 kHz for Y and E/Lpackages). Duty cycle is reduced from DC MAX through the reduction of the on-time when I C is increased beyond I B . This operation is identical to the PWM control of all other TOPSwitch families. TOPSwitch-HX only operates in this mode if the cycle-by-cycle peak drain current stays above k PS(UPPER)*I LIMIT (set), where k PS(UPPER) is 55% (typical) and I LIMIT (set) is the current limit externally set via the X or M pin.Variable Frequency PWM mode: When peak drain current is lowered to k PS(UPPER)* I LIMIT (set) as a result of power supply load reduction, the PWM modulator initiates the transition to variable frequency PWM mode, and gradually turns off frequency jitter. In this mode, peak drain current is held constant at k PS(UPPER)* I LIMIT (set) while switching frequency drops from the initial full frequency of f OSC (132 kHz or 66 kHz) towards the minimum frequency of f MCM(MIN) (30 kHz typical). Duty cycle reduction is accomplished by extending the off-time.Low Frequency PWM mode: When switching frequencyreaches f MCM(MIN) (30 kHz typical), the PWM modulator starts to transition to low frequency mode. In this mode, switchingfrequency is held constant at f MCM(MIN) and duty cycle is reduced, similar to the full frequency PWM mode, through the reduction of the on-time. Peak drain current decreases from the initial value of k PS(UPPER)* I LIMIT (set) towards the minimum value ofk PS(LOWER)*I LIMIT (set), where k PS(LOWER) is 25% (typical) and I LIMIT (set) is the current limit externally set via the X or M pin.Multi-Cycle-Modulation mode: When peak drain current is lowered to k PS(LOWER)*I LIMIT (set), the modulator transitions to multi-cycle-modulation mode. In this mode, at each turn-on, the modulator enables output switching for a period of T MCM(MIN) at the switching frequency of f MCM(MIN) (4 or 5 consecutive pulses at 30 kHz) with the peak drain current of k PS(LOWER)*I LIMIT (set), and stays off until the CONTROL pin current falls below I C(OFF). This mode of operation not only keeps peak drain current low but also minimizes harmonic frequencies between 6 kHz and30 kHz. By avoiding transformer resonant frequency this way, all potential transformer audible noises are greatly supressed.Maximum Duty CycleThe maximum duty cycle, DC MAX , is set at a default maximum value of 78% (typical). However, by connecting the VOLTAGE-MONITOR or MULTI-FUNCTION pin (depending on the package) to the rectiﬁ ed DC high voltage bus through a resistor with appropriate value (4 M Ω typical), the maximum duty cycle can be made to decrease from 78% to 40% (typical) when input line voltage increases from 88 V to 380 V, with dual gain slopes.Error Ampliﬁ erThe shunt regulator can also perform the function of an error ampliﬁ er in primary side feedback applications. The shunt regulator voltage is accurately derived from a temperature-compensated bandgap reference. The CONTROL pin dynamic impedance Z C sets the gain of the error ampliﬁ er. TheCONTROL pin clamps external circuit signals to the V C voltage level. The CONTROL pin current in excess of the supply current is separated by the shunt regulator and becomes the feedback current I fb for the pulse width modulator.Rev. F 01/09On-Chip Current Limit with External ProgrammabilityThe cycle-by-cycle peak drain current limit circuit uses the output MOSFET ON-resistance as a sense resistor. A current limit comparator compares the output MOSFET on-state drain to source voltage V DS(ON) with a threshold voltage. High drain current causes V DS(ON) to exceed the threshold voltage and turns the output MOSFET off until the start of the next clock cycle. The current limit comparator threshold voltage is temperature compensated to minimize the variation of the current limit due to temperature related changes in R DS(ON) of the output MOSFET. The default current limit of TOPSwitch-HX is preset internally. However, with a resistor connected between EXTERNAL CURRENT LIMIT (X) pin (Y, E/L and M packages) or MULTI-FUNCTION (M) pin (P and G package) and SOURCE pin (for TOP259-261 Y, the X pin is connected to the SIGNAL GROUND (G) pin), current limit can be programmed externally to a lower level between 30% and 100% of the default current limit. By setting current limit low, a larger TOPSwitch-HX than necessary for the power required can be used to take advantage of the lower R DS(ON) for higher efﬁ ciency/smaller heat sinkingrequirements. TOPSwitch-HX current limit reduction initial tolerance through the X pin (or M pin) has been improved signiﬁ cantly compare with previous TOPSwitch-GX. With a second resistor connected between the EXTERNAL CURRENT LIMIT (X) pin (Y, E/L and M packages) or MULTI-FUNCTION (M) pin (P and G package) and the rectiﬁ ed DC high voltage bus, the current limit is reduced with increasing line voltage, allowing a true power limiting operation against line variation to be implemented. When using an RCD clamp, this power limiting technique reduces maximum clamp voltage at high line. This allows for higher reﬂ ected voltage designs as well as reducing clamp dissipation.The leading edge blanking circuit inhibits the current limitcomparator for a short time after the output MOSFET is turned on. The leading edge blanking time has been set so that, if a power supply is designed properly, current spikes caused by primary-side capacitances and secondary-side rectiﬁ er reverse recovery time should not cause premature termination of the switching pulse.The current limit is lower for a short period after the leading edge blanking time. This is due to dynamic characteristics of the MOSFET. During startup and fault conditions the controller prevents excessive drain currents by reducing the switching frequency.Line Undervoltage Detection (UV)At power up, UV keeps TOPSwitch-HX off until the input line voltage reaches the undervoltage threshold. At power down, UV prevents auto-restart attempts after the output goes out of regulation. This eliminates power down glitches caused by slow discharge of the large input storage capacitor present in applications such as standby supplies. A single resistor connected from the VOLTAGE-MONITOR pin (Y, E/L and M packages) or MULTI-FUNCTION pin (P and G packages) to the rectiﬁ ed DC high voltage bus sets UV threshold during power up. Once the power supply is successfully turned on, the UV threshold is lowered to 44% of the initial UV threshold to allow extended input voltage operating range (UV low threshold). If the UV low threshold is reached during operation without the power supply losing regulation, the device will turn off and stay off until UV (high threshold) has been reached again. If the power supply loses regulation before reaching the UV lowthreshold, the device will enter auto-restart. At the end of each auto-restart cycle (S15), the UV comparator is enabled. If the UV high threshold is not exceeded, the MOSFET will bedisabled during the next cycle (see Figure 11). The UV feature can be disabled independent of the OV feature.Figure 11. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-Restart (4) Power Down.Line Overvoltage Shutdown (OV)The same resistor used for UV also sets an overvoltage threshold, which, once exceeded, will force TOPSwitch-HX to stop switching instantaneously (after completion of the current switching cycle). If this condition lasts for at least 100 μs, the TOPSwitch-HX output will be forced into off state. Unlike with TOPSwitch-GX, however, when the line voltage is back to normal with a small amount of hysteresis provided on the OV threshold to prevent noise triggering, the state machine sets to S13 and forces TOPSwitch-HX to go through the entire auto-restart sequence before attempting to switch again. The ratio of OV and UV thresholds is preset at 4.5, as can be seen in Figure 12. When the MOSFET is off, the rectiﬁ ed DC high voltage surge capability is increased to the voltage rating of the MOSFET (700 V), due to the absence of the reﬂ ected voltage and leakage spikes on the drain. The OV feature can be disabled independent of the UV feature.In order to reduce the no-load input power of TOPSwitch-HX designs, the V-pin (or M-pin for P Package) operates at very low currents. This requires careful layout considerations when designing the PCB to avoid noise coupling. Traces and components connected to the V-pin should not be adjacent to any traces carrying switching currents. These include the drain, clamp network, bias winding return or power traces from otherconverters. If the line sensing features are used, then the senseresistors must be placed within 10 mm of the V-pin to minimizethe V-pin node area. The DC bus should then be routed to theline sense resistors. Note that external capacitance must notbe connected to the V-pin as this may cause misoperaton of theV pin related functions.Hysteretic or Latching Output Overvoltage Protection (OVP) The detection of the hysteretic or latching output overvoltageprotection (OVP) is through the trigger of the line overvoltagethreshold. The V-pin or M-pin voltage will drop by 0.5 V, andthe controller measures the external attached impedanceimmediately after this voltage drops. If IVor IMexceeds IOV(LS) (336 μA typical) longer than 100 μs, TOPSwitch-HX will latchinto a permanent off state for the latching OVP. It only can bereset if VVor VMgoes below 1 V or VCgoes below the power-up-reset threshold (VC(RESET)) and then back to normal.If IVor IMdoes not exceed IOV(LS)or exceeds no longer than100 μs, TOPSwitch-HX will initiate the line overvoltage and thehysteretic OVP. Their behavior will be identical to the line overvoltage shutdown (OV) that has been described in detail in the previous section.Voltage Monitor and External Current Limit Pin Table**This table is only a partial list of many VOLTAGE MONITOR and EXTERNAL CURRENT LIMIT Pin Conﬁ gurations that are possible. Table 2. VOLTAGE MONITOR (V) Pin and EXTERNAL CURRENT LIMIT (X) Pin Conﬁ guration Options.Multi-Function Pin Table**This table is only a partial list of many MULTI-FUNCTIONAL Pin Conﬁ gurations that are possible.Table 3. MULTI-FUNCTION (M) Pin Conﬁ guration Options.。

霍尼韦尔宣布拓展SOLARC抗反射涂层材料产品线

霍尼韦尔宣布拓展SOLARC抗反射涂层材料产品线
霍尼韦尔公司电子材料部今天宣布推出一种新配方以拓展其用于太阳能面板的SOLARC 抗反射涂层材料产品线，这种新配方更便于应用并减少材
料用量。

这种被称为霍尼韦尔SOLARC R 的新产品专用于单面辊涂应用，其优势在于使太阳能面板制造商更方便应用而且材料用量比其他涂层方式更少。

霍尼韦尔SOLARC 产品系列是在半导体应用的先进材料基础上开发而成。

它是一种透明的涂层材料，可以改进光伏玻璃的透射率，从而提高组件的效率和功率输出。

该涂层还能显著降低玻璃的眩光，使组件能更好地融入周围的环境。

霍尼韦尔电子材料部电子聚合物全球产品总监朱林博士说：SOLARC R 抗反射涂层材料具有行业领先的透射能力，同时结合辊涂工艺可实现方便应用和减少材料用量。

霍尼韦尔致力于凭借自身新材料开发实力满足行业对单位功率成本更低、性能更高组件的需求，这一新产品推出是又一个很好的例证。

目前市面上的大多数组件因为上层盖板玻璃对光的反射作用，都会损失约4% 的潜在功率输出。

光反射除了会导致发电量减少，还会造成令人不悦的眩光，如果在住宅的屋顶上安装这种设备，尤其令人反感。

霍尼韦尔SOLARC 产品系列会显著减少光反射，可以让更多的太阳光抵达太阳能电池，从而可以转化成更多的能量。

随着行业中越来越多地采用抗反射涂层，霍尼韦尔SOLARC 技术可在光学性能、耐用性和生产成本之间实现最佳平衡。

霍尼韦尔于2009 年首次推出应用于喷涂的SOLARC 抗反射涂层配方。

电弧离子镀nicralysi涂层抗高温氧化行为

电弧离子镀nicralysi涂层抗高温氧化行为高温氧化的抗性已经成为各种金属材料用于特殊高温行业的重要指标。

传统的防腐涂层效果不佳，因此，能够有效抵御氧化腐蚀的表面涂层是金属构件在高温环境中耐久可靠的重要技术手段。

电弧离子束镀nicralysi技术（IBS）是一种新型表面涂层技术，具有优异的抗腐蚀表面性能，可在高温下达到良好的抗氧化效果。

电弧离子束镀nicralysi技术是一种利用电弧离子束技术对金属材料表面形成密封保护膜的表面涂层技术。

而且，由于表面粗糙度较小，能够有效降低表面粘度，提高涂层紧固性。

使用该技术可以在金属表面形成一层致密的抗氧化膜，可以抵御各种高温氧化腐蚀。

此外，这种涂层还具有良好的耐磨性和热稳定性。

电弧离子束镀nicralysi技术在高温抗氧化性能方面具有显著优势。

实验表明，在800℃-1100℃条件下，nicralysi涂层的耐氧化性能优于传统热镀锌和热浸锌涂层，且自重面系数较低，可以更好地抵御高温氧化环境，形成一层致密、柔韧的氧化膜，从而减少钢铁件的磨损，降低维修成本。

此外，由于nicralysi抗高温氧化涂层具有良好的抗腐蚀性能和热稳定性，因此也可以用于船舶、设备、石油装备、炼钢、建筑和汽车行业等多种领域，在抗腐蚀和耐用方面取得了良好的效果。

综上所述，电弧离子束镀nicralysi技术可以在高温环境中提供优异的抗氧化性能，为金属的抗腐蚀和耐用性提供了有力的支持。

Nicralysi技术的发展和推广有助于改善金属表面涂层的性能，为高
温环境下的防腐和耐用带来更多的便利。

nVent RAYCHEM TraceCalc

nVent RAYCHEM TraceCalc© Pro Version 2.17Readme FileWelcome to nVent RAYCHEM TraceCalc© Pro, the industry standard for heat tracing design. nVent is devoted to delivering quality software and support to make this the best design tool available in the industry today. Your feedback is very important to us. Please feel free tocontact us at **********************with questions, issues or suggestions for this program.IMPORTANT: Please check our web site periodically to obtain the latest TraceCalc Pro newsand updates.This Readme covers the following topics:1. Main New Features of Version2.172. Known Issues and Limitations3. System Requirements4. Installation5. Register for a Validation Code6. Technical Support7. Change History (new features and fixed issues)1. Main new features of version2.17•The recently introduced Raychem 20XTVR2-CT has successfully passed hazardous area approval testing to allow for an unconditional T3 rating up to a nominal supply voltage of240Vac. This means that the Raychem 20XTVR2-CT is now unconditionally T3 rated up to 240 Vac and T2 rated up to 277Vac. This is applicable for all approvals schemes the product is certified to (IEC, NAM, CCC,…).•The recently introduced High Power Retention (HPR) self-regulating heating cables, nVent RAYCHEM XTVR and HTV, are now CCC approved allowing them for use in hazardousarea as per GB standard for China.•The TraceCalc Pro attachment algorithm was modified to also include glass tape when aluminum tape is used, to better reflect actual installation practices when heating cables are installed using aluminum tape on pipes. We have given the user flexibility to specify theamount of glass tape to include on the design tab since the glass tape is used only as atemporary fixation aid.2. Known Issues and Limitations•For designs with European single conductor, polymer insulated (PI) series heater cables, the connection components selected by TraceCalc Pro have the following limitations:a. For CS-150-xx-PI connection kits, the specific crimp size is not indicated in the bill ofmaterial. You will need to manually select the correct crimp based on data presentedin the latest Technical Data Book.b. For Power Tee or Power Splice configurations, a JB-EX-20 junction box will beselected by TraceCalc Pro; a JB-EX-21 should be substituted instead.c. The last leg of a multi-segment Parent/Child design will include two single conductorsegments and a junction box allowed for series connection of the two segments. Atthis point, TraceCalc Pro does not support a single looped cable as the lastsegment.d. TraceCalc Pro will not support the full application range of the universal connectionand splice kit for PI heating cables, reference: CS-150-UNI-PI.Its maximum use temperature has been limited to 120°C for simplification of theselection algorithms. If the user plans to select the kit, it is important to verify themaximum allowed wattages for higher temperatures as detailed in our installationinstructions (ref. Install-064). In case of doubt, please contact nVent or use the kit CS-150-2.5- PI instead.•For European series cable designs, TraceCalc Pro will propose a bill of materials for which some components have the quantity set to zero. These are small electrical items required to create the desired electrical configuration and are compatible with the proposed junction box. Users should adjust the quantities of these components to ensure that the requested electrical configuration can be realized. Refer to the individual datasheets of the proposed junction boxes for more information on the exact contents and electrical limitations.3. System RequirementsThe TraceCalc Pro installation package no longer supports installation on Windows XP.Contact nVent for more information.Minimum Requirements:•Microsoft Windows 10 or later, Server 2012 or later•At least 25 MB of free hard disk space•Internet Explorer 6.0 or later•Adobe Acrobat Reader 5.0 or later•Recommended: 500 MHZ, 2 GB RAM4. InstallationThe program can be downloaded from our website. After downloading, just start theTraceCalc Pro 2.17 Setup.exe program and follow the instructions.During installation, Setup will detect if an earlier version has been installed. If you have an earlier version installed, then Setup will uninstall it before continuing. All of your application settings will be retained. Old projects will not be removed and can be used with TraceCalc Pro 2.17.5. Register for a Validation CodeWhen you install the TraceCalc Pro software, you are getting a trial version that will only function for 30 days, unless it is registered and a valid registration code entered.The first time you launch TraceCalc Pro, you will be prompted to register. Register online through our public website. Once you register, we will send you the validation code. To enter the code, launch TraceCalc Pro, click Register on the main menu and type the code in the pop-up window.6. Technical SupportFor help using TraceCalc Pro, first check the extensive on-line help in the program.•To contact your local nVent representative, visit our website, click on the ‘Support’ menu, then choose ‘Where to Buy’•To view Frequently Asked Questions, visit our website, click on the ‘Support’ menu, then choose ‘Frequently Asked Questions (FAQ)’•To contact Technical Support, send email to **********************andindicate your country and preferred language.•To download the latest version of TraceCalc Pro or the user manual, go to the TraceCalc Pro page.Thanks for reporting any issues to us.7. Change historyVersion 2.17New Recently launched nVent RAYCHEM XTVR and HTV that use HPR technology are now CCC approvedNew Recently launched nVent RAYCHEM 20XTVR2-CT now has an unconditional T3 rating up to 240Vac for all approval schemes to which the product is certified to.New To improve flexibility reflecting actual installation practices, the ‘Design tab’ allows to specify the pipe length interval to use to include additional glass tape whendesigns with aluminum tape are done.Fixed The max exposure temp of the mechanical thermostat with limiter type RAYCHEM T-M-20-S/0+200C/EX has been corrected to 230°C to deal with the limitations of thecontrol sensor.Fixed The ‘Register online’ button (on the Register form) pointed to an obsolete URL and hence returned an error. This has been corrected to ensure it takes the user to thecorrect page on our website.Fixed When using Global Edit on the startup temperature, the SW would under specific circumstances erroneously not always update all lines.Fixed The warning “maximum segment length exceeded” was being raised unnecessarily on series cable vessel designs.Fixed On a vessel design using parallel heater technology, if the cable type was forced but the attachment type was not, the system sometimes applied an incorrectcircuit length adjustment factor, resulting in an erroneously long reportedmaximum circuit length.Fixed HTV reported maximum heater lengths were sometimes shorter than actually allowed for design conditions.Fixed When installing a new version over a previous installation with different regional settings, a user’s customized default project settings (which includes regionalsettings) are preserved, so the user does not get the (new) regional settings.Therefore a button that allows the user to replace his default project with the last-installed default regional settings has been added.Copyright 2023 nVent.。

Reflective crack relief layer that is permeable

专利名称：Reflective crack relief layer that is permeable发明人：Phillip B. Blankenship,Richard K.Steger,James D. Campbell申请号：US11195900申请日：20050803公开号：US07479185B2公开日：20090120专利内容由知识产权出版社提供摘要：A design method for making a bituminous mixture that is used to form a vapor-permeable layer of pavement is provided. This design procedure includes preparing one or more bituminous mixture test specimens, measuring the performance of these specimens, and selecting a desirable bituminous mixture for paving that is vapor-permeable based on the performance of the specimens. Another aspect of the present invention is the selected bituminous mixture, which includes aggregate and a bituminous binder. The aggregate should be selected such that no more than about 5% by mass of the aggregate and preferably no more than about 3.5% by mass of the aggregate is able to pass through a 75 μm sieve. The selected bituminous mixture should have an Air Permeability Value that is at least about 8 cmso as to reduce its propensity for blistering during and after construction. Still further, the selected bituminous mixture should have desirable fatigue resistance and should be substantially water-impermeable.申请人：Phillip B. Blankenship,Richard K. Steger,James D. Campbell地址：606 N. Stratford La. Wichita KS 67206 US,4234 N. Mission Wichita KS 67222 US,8711 S. Meridian Rd. Sedgwick KS 67135 US国籍：US,US,US更多信息请下载全文后查看。

科学家研发纳米等离子混合玻璃复合材料

可减少强光照射智能玻璃意外带火机场汉堡店
德国联邦环境部（ＢＭＵＢ）将从 “环境创新计划” 中划拨１３００万欧元，用于支持玻璃生产废料再利用新工艺开发创新示范项目。项目承担机构是德国Ｗｉｅｇａｎｄ—Ｇｌａｓｈｉｉｔｔｅｎｗｅｒｋｅ有限公司，其研发任务是将食品和饮料行业生产周期中产生的粉尘再利用，以提高能效，创新加工工艺。
“Ｂｌｉｔｚ—Ｍ”卫星直径为２２０毫米，重量为ｌ６．５公斤。卫星将被送入１５００公里高的地球轨道，为了其不会受到大气的影响。卫星发射升空计划于２０１８年ｌＯ月举行。
ｈｔｔｐ：／／ｓｐｕ支持研发玻璃生产废料再利用新工艺
一４２一
Ａｒｃｈｉｔｅｃｔｕｒａｌ＆ＦｕｎｃｔｉｏｎａｌＧｌａｓｓＮｏ４２０１８
Ｓｐｈｉｎｘ公司商务总监ＷａｓｓｉｍＫｈａｌｉｌ表示，埃及地区市场需求量已占据了我们年产能的６５％。目前公司的产能为６５０吨／日，但我们还希望产品能够进入更多的非洲地区国家。
美国达拉斯一沃思堡国际机场在Ａ２８登机口周围安装能减少强光照射的智能玻璃，没想到让相邻的一家连锁汉堡店多了很多生意。
智能玻璃由美国 “视野 ”公司生产，能过滤紫外线、减少强光照射，从而提升人们候机时的舒适度。这种智能玻璃去年秋天被安装在Ａ２８登机口周围，现仍处于测试阶段。英国《每１３邮报》报道，意外的是，安装这种玻璃后，相邻的ＴｗｉｓｔｅｄＲｏｏｔ汉堡店生意变好，不仅人们在店里逗留的时间有所增加，店里销售额也同比增长１０２％。

使用穿透硅通道的半导体封装方法[发明专利]

专利名称：使用穿透硅通道的半导体封装方法专利类型：发明专利
发明人：B·哈巴,G·汉普斯通,M·毛尔高丽特
申请号：CN201310022626.8
申请日：20080731
公开号：CN103178032A
公开日：
20130626
专利内容由知识产权出版社提供
摘要：一种微电子单元可包括半导体元件，所述半导体元件具有前表面、靠近前表面的微电子半导体器件、位于前表面的接触部和远离前表面的后表面。

半导体元件可具有从后表面延伸穿过半导体元件并且穿过接触部的通孔。

介电层可铺衬于通孔。

导电层可层叠于通孔中的介电层上。

导电层可将接触部与单元接触部导电互连。

申请人：英闻萨斯有限公司
地址：美国加利福尼亚
国籍：US
代理机构：永新专利商标代理有限公司
代理人：蔡胜利
更多信息请下载全文后查看。

与电子工程的英语单词

与电子工程的英语单词antifog insulator 防雾绝缘子antifriction metal 减磨金属antihunt circuit 防振电路antihunting transformer 防震变压器antijamming 抗干扰antimagnetic alloy 抗磁合金antimagnetic shield 防磁屏蔽antinodal point 波腹antinode 波腹antiphase 逆相位antiresonance 并联谐振antiresonance frequency 反共振频率antiresonance point 反共振点antiresonant circuit 反共振电路antitorque 反转矩aperiodic 非周期的.aperiodic circuit 非周期电路aperiodic component 非周期性分量aperiodic conditions 非周期状态aperiodic damping 非周期衰减aperiodic element 非周期摆动的可动部分aperiodic exponential signal 非周期指数信号aperiodic galvanometer 直指电疗aperiodic instability 非周期不稳定性aperiodic network 非周期网络aperiodic phenomenon 非周期现象aperiodic regime 非周期状态aperiodic time constant 非周期分量时间常数aperiodicity 非周期性apparatus 仪器apparent capacity 视在容量apparent efficiency 视在效率apparent energy 表观能量apparent energy meter 伏安时计apparent gap area 表观气隙面积apparent gap density 表观气隙磁通密度apparent impedance 表观阻抗apparent inductance 视在电感apparent power 视在功率apparent reluctance 表观磁阻apparent resistance 视在电阻apparent sag 视在垂度apparent tooth density 表观齿磁束密度appendiron core transformer 铁芯变压器appliance load 生活负载appliance motor 电气用具用电动机appliances 电气用具application field 应用区域application program 应用程序applied electromotive force 外加电动势applied voltage 外加电压approach light 接近信号灯approach locking 接近锁定approximate calculation 近似计算approximate formula 近似公式approximate solution 近似解approximate value 近似值approximation 近似approximation method 近似法arago's rotating disk 阿拉哥旋转盘arbitrary constant 任意常数arbitrary function 任意函数arbitrary function generator 任意函数发生器arbitrary pulse transfer function generator 任意脉冲传递函数发生装置arbitrary sequence computer 可变时序计算机arbitray phase angle power relay 有功无功功率继电器arc 电弧arc breaking 断弧arc chute 灭弧室arc control device 灭弧装置arc current 电弧电流arc cutting 电弧切割arc discharge 电弧放电arc discharger 电弧放电器arc drop 电弧电压降arc duration 电弧持续时间arc energy 电弧能arc extinction 灭弧arc extinguish chamber 灭弧室arc extinguisher 灭弧器arc extinguishing 消弧arc furnace 电弧炉arc guide 弧导筒arc lamp 弧光灯arc light 弧光灯arc lighting 弧光灯照明arc over 弧络arc over path 闪络途经arc plasma 电弧等离子体arc protection 闪络保护arc rectifier 电弧整流arc resistance 电弧电阻arc resistance insulation 耐弧绝缘arc stream voltage 弧羚压arc striking 起弧arc suppression circuit 消弧电路arc suppression coil 消弧线圈arc suppression transformer 消弧变压器arc voltage 电弧电压arc welding 弧焊arc welding electrode 电弧焊条arc zone 电弧区域arcback 逆弧arch dam 拱坝architectual lighting 建筑照明arcing 形成电弧arcing contact 灭弧触点arcing distance 放电距离arcing earth 电弧接地arcing fault 闪故障arcing ground suppressor 接地电弧抑制器arcing horn 消弧角保护放电间隙arcing ring 电弧环arcing time 起弧时间area flow meter 面积量计argon 氩argument 自变量arithmetic and logic unit 算术逻辑运算器arithmetical instruction 算术指令arm 横担arm extension bracket 伸缩臂托架arm tie 撑柱arm type brush holder 旋臂式电刷握柄armature 电枢armature ampere turns 电枢安匝armature band 电枢绑带armature bars 电枢条armature characteristic curve 电枢特性曲线armature circuit 电枢电路armature coil 电枢线圈armature control 电枢电压控制armature controlled motor 电枢电压可控直羚动机armature core 电枢铁芯armature current 电枢电流armature diameter 电枢直径armature end connections 电枢端部接线armature end plate 电枢端板armature field 电枢磁场armature induction 电枢感应armature keys 电枢槽楔armature loop 电枢绕组元armature of electromagnet 磁铁衔铁armature reactance 电枢电抗armature reaction 电枢反力armature reaction field 电枢反力场armature resistance 电枢电阻armature shaft 电枢轴armature slot 电枢槽armature spider 电枢支架armature stampings 电枢冲片armature stroke 衔铁动程armature time constant 电枢时间常数armature tooth 电枢齿armature winding 电枢绕组armature winding equalizer 电枢绕组均衡线armor 铠装armor of a cable 电缆镫装armored 镫装的armored cable 铠装电缆;镫装电缆armored insulator 铠装绝缘子armoring tape 铠装带armoring wire 铠装线arrangement 布置arrangement of pole attachments 电杆附件的配置array 阵列array declarator 数组说名array element 数组元素array identifier 数组说名array name 数组说名array processor 阵列处理机arrester 避雷器arrester discharge capacity 避雷婆电容量arrester discharge voltage current characteristic 避雷婆电伏安特性arrival current 输入电流articulation 清晰度artificial brain 人工脑artificial cable 仿真电缆artificial circuit 模拟电路artificial cooling 人工冷却artificial illumination 人工照明artificial light source 人造光源artificial lightning 人造电闪artificial line 仿真线artificial load 仿真负载artificial magnet 人造磁铁artificial mains network 仿真电源网络artificial radioactivity 人工放射能artificial ventilation 人工通风。

核壳复合材料等效电导率

核壳复合材料等效电导率Composite materials, such as core-shell composites, have gained significant attention due to their unique properties and potential applications in various industries. One of the key parameters that need to be considered in the design and optimization of these composites is their effective electrical conductivity, also known as the equivalent electrical conductivity. This property plays a crucial role in determining the overall performance of composite materials, especially in applications where electrical conductivity is essential.复合材料，如核壳复合材料，因其独特的性能和在各个行业中的潜在应用而受到了广泛关注。

在这些复合材料的设计和优化过程中需要考虑的关键参数之一是它们的有效电导率，也称为等效电导率。

这个性质在确定复合材料的整体性能方面起着至关重要的作用，特别是在需要电导性的应用中。

The effective electrical conductivity of a core-shell composite is influenced by various factors, including the electrical properties of the core and shell materials, their volume fractions, the interface between the core and shell, as well as the overall morphology and microstructure of the composite. The core-shell structure is designedto enhance specific properties of the composite, and the electrical conductivity is one of the key properties that can be tailored through the design of the core-shell structure.核壳复合材料的有效电导率受多种因素影响，包括核心和外壳材料的电性能、它们的体积分数、核心和外壳之间的界面，以及复合材料的整体形貌和微观结构。

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

4
Greater Peoria Regional Airport (GPRA)
Air Traffic: 36,000 operations in 2009 TWY E: Flexible pavement; multiple overly
cycles, recent cycles only lasting 7 years Severe reflective cracking distress
– Cracks of up to 50 mm width – 15 – 50 m crack spacing
5
TWY E in 1999
Ai
6
TWY E in 1999
7
Extent of Project
Taxiway-E: Main taxiway parallel to Rwy 13-31
– Cold winters, freeze-thaw, heavy aircraft (727, DC-8, C-130 [Air National Guard], Antonov [Caterpillar HQ])
Initially, the ISAC (Interlayer Stress Absorbing Composite) was proposed. However, due to the very wide crack spacing, predicted horizontal joint movement the standard ISAC strip treatment.
Allows water to infiltrate into underlying pavement structure, leading to further deterioration
One of the predominant failure modes in rehabilitated pavements
Crack Relief System Material Characterization and Modeling Field Performance Summary and Conclusions
2
Reflective Cracking in Asphalt Overlays
Appearance of a cracking pattern in the surface of an overlay that reflects the cracking/joint pattern in the underlying pavement
Stress Absorbing Membrane Interlayers (or SAMIs)
– ‘Sand Anti-Fracture Mixtures (SAF)’ – ‘Strain-Tolerant Interlayer Mixtures’ – ‘Reflective Crack Relief Interlayers (RCRI)’
– Reflective, block, and longitudinal (cold joint) cracks
– Reflective cracks were very wide and cupped
– Reflective cracks were widely spaced (avg = 100’)
The U of I research team was tasked with developing a variant on the ISAC system. FEA showed that a thicker stress absorbing layer was needed.
Kim, J., and W. G. Buttlar, Analysis of Reflective Crack Control System Involving Reinforcing Grid over Base-Isolating Interlayer Mixture, ASCE Journal of Transportation Engineering, Vol. 128, No. 4, pp. 375-384, 2002. 9
– Approximately 1780 m C/L length (5800 ft) – Project involved resurfacing and widening in some
areas
8
Rehabilitation Strategy
Existing conditions were very severe:
Daniel S. Sherman
V3 Companies of Illinois, Woodridge, IL
Outline
Introduction to Reflective Cracking Greater Peoria Regional Airport Design and Construction of a Hybrid Reflective
Hybrid Reflective-crack Relief System At Greater Peoria Regional Airport: A Case Study
William G. Buttlar Eshan V. Dave
University of Illinois, Urbana, IL
Often overlooked during overlay design
3
Interlayer Treatments
Reinforcement Layers and Paving Fabrics
– Steel Netting – Fabrics/Geotextiles – Grid Type Systems – Composite Systems (e.g. ISAC)