74LVC1G00

VCC + 0.5 V
Power-down mode; notes 1 and 2 −0.5
2004 Sep 07
5
Philips Semiconductors
Product specification
Single 2-input NAND gate
DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = −40 °C to +85 °C VIH HIGH-level input voltage 1.65 to 1.95 0.65 × VCC − 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5 VIL LOW-level input voltage 2.3 to 2.7 2.7 to 3.6 4.5 to 5.5 VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA IO = 4 mA IO = 8 mA IO = 12 mA IO = 24 mA IO = 32 mA VOH HIGH-level output voltage VI = VIH or VIL IO = −100 µA IO = −4 mA IO = −8 mA IO = −12 mA IO = −24 mA IO = −32 mA ILI Ioff ICC ∆ICC input leakage current power OFF leakage current quiescent supply current additional quiescent supply current per pin VI or VO = 5.5 V VI = VCC or GND; IO = 0 A VI = VCC − 0.6 V; IO = 0 A 1.65 to 5.5 1.65 2.3 2.7 3.0 4.5 0 5.5 2.3 to 5.5 VCC − 0.1 1.2 1.9 2.2 2.3 3.8 − − − − − − − − − − ±0.1 ±0.1 0.1 5 1.65 to 5.5 1.65 2.3 2.7 3.0 4.5 − − − − − − − − − − − − 1.7 2.0 0.7 × VCC − − − − − − − − − − VCC (V) MIN. TYP.(1)
ቤተ መጻሕፍቲ ባይዱ74LVC1G00
handbook, halfpage
1 2
B A
Y
4
handbook, halfpage
1 2
&
4
MNA097
MNA098
Fig.3 Logic symbol.
Fig.4 IEE/IEC logic symbol.
handbook, halfpage
B Y A
MNA099
Fig.5 Logic diagram.
INTEGRATED CIRCUITS
DATA SHEET
74LVC1G00 Single 2-input NAND gate
Product specification Supersedes data of 2002 Nov 15 2004 Sep 07
Philips Semiconductors
Product specification
2004 Sep 07
4
Philips Semiconductors
Product specification
Single 2-input NAND gate
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V active mode VCC = 0 V; Power-down mode CONDITIONS 0 0 0 −40 0 0 MIN. 1.65
Single 2-input NAND gate
FEATURES • Wide supply voltage range from 1.65 V to 5.5 V • High noise immunity • Complies with JEDEC standard: – JESD8-7 (1.65 V to 1.95 V) – JESD8-5 (2.3 V to 2.7 V) – JESD8B/JESD36 (2.7 V to 3.6 V). • ±24 mA output drive (VCC = 3.0 V) • CMOS low power consumption • Latch-up performance exceeds 250 mA • Direct interface with TTL levels • Inputs accept voltages up to 5 V • Multiple package options • ESD protection: HBM EIA/JESD22-A114-B exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. • Specified from −40 °C to +85 °C and −40 °C to +125 °C. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 2.5 ns. SYMBOL tPHL/tPLH PARAMETER propagation delay inputs A, B to output Y CONDITIONS VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ VCC = 2.5 V; CL = 30 pF; RL = 500 Ω VCC = 2.7 V; CL = 50 pF; RL = 500 Ω VCC = 3.3 V; CL = 50 pF; RL = 500 Ω VCC = 5.0 V; CL = 50 pF; RL = 500 Ω CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total switching outputs; Σ(CL × VCC2 × fo) = sum of the outputs. 2. The condition is VI = GND to VCC. input capacitance power dissipation capacitance per buffer VCC = 3.3 V; notes 1 and 2 DESCRIPTION
74LVC1G00
MAX. 5.5 5.5 VCC 5.5 +125 20 10 V V V V
UNIT
°C ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. PARAMETER supply voltage input diode current input voltage output diode current output voltage output diode current VCC or GND current storage temperature power dissipation per package for temperature range from −40 °C to +125 °C VI < 0 V note 1 VO > VCC or VO < 0 V active mode; notes 1 and 2 VO = 0 V to VCC CONDITIONS − −0.5 − −0.5 − − −65 − MIN. −0.5 MAX. +6.5 −50 +6.5 ±50 +6.5 ±50 ±100 +150 250 V mA V mA V mA mA °C mW UNIT
TYPICAL 3.3 2.2 2.8 2.2 1.8 5 14
UNIT ns ns ns ns ns pF pF
2004 Sep 07
2
Philips Semiconductors
Product specification
Single 2-input NAND gate
FUNCTION TABLE See note 1. INPUT A L L H H Note 1. H = HIGH voltage level; L = LOW voltage level. ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE 74LVC1G00GW 74LVC1G00GV 74LVC1G00GM PINNING PIN (TSSOP5, VSSOP5) 1 2 3 4 5 PIN (XSON6) 1 2 3 4 5 6 SYMBOL B A GND Y n.c. VCC data input B data input A ground (0 V) data output Y not connected supply voltage −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C PINS 5 5 6 PACKAGE SC-88A SC-74A XSON6 MATERIAL plastic plastic plastic B L H L H
74LVC1G00
OUTPUT Y H H H L
CODE SOT353 SOT753 SOT886
MARKING VA V00 VA
DESCRIPTION
00
B 1 6 VCC
B A
1 2
5
VCC
00
4
001aab608
A
2
5
n.c.
GND
3
Y
GND
3
4
Y
001aab603
Transparent top view
74LVC1G00
The 74LVC1G00 is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Input can be driven from either 3.3 V or 5 V devices. These features allow the use of these devices in a mixed 3.3 V and 5 V environment. Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time. This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. The 74LVC1G00 provides the single 2-input NAND function.
Fig.1 Pin configuration TSSOP5 and VSSOP5.
Fig.2 Pin configuration XSON6.
2004 Sep 07
3
Philips Semiconductors
Product specification
Single 2-input NAND gate