DRV8842PWP;DRV8842PWPR;中文规格书,Datasheet资料
QX6104中文规格书
.典型应用电路图图1:QX6104典型应用电路图概述 QX6104是一款高精度降压型大功率LED 恒流驱动芯片。
适用于交流85V 到265V 全范围输入电压的大功率LED 恒流驱动电源。
专利的高端电流检测、固定频率、电流模PWM 控制方式,具有优异的线性调整率和负载调整率。
芯片典型工作频率约65KHz 。
芯片采用的特有恒流控制方式,使得LED 输出电流精度达到±3%以内。
芯片内部集成的抖频功能可降低EMI 成本。
内置环路补偿与斜坡补偿,无需外部补偿,应用设计简单。
QX6104具有多重保护功能,包括DRV 驱动MOS 栅极电压钳位、LED 开路/短路保护,逐周期限流保护,输入供电欠压/过压保护及电源嵌位等功能。
特点高端MOS 驱动 输出电流:可达2ALED 均值电流控制:恒流效果好 LED 输出电流精度:±3%高效率:最高可达93%以上固定工作频率,电流模PWM 控制 抖频功能内置环路补偿、斜坡补偿 LED 开路/短路保护 芯片供电欠压/过压保护 功率管栅极电压嵌位:17V 应用领域 LED 球泡灯、日光灯 其它LED 照明订货信息产品型号QX6104丝印6104X批号封装及管脚分配DRVVSN VSPOVPVDD132645VSS6104XSOT23-6管脚描述内部电路方框图DRVVSPVSN图2:QX6104内部电路方框图极限参数(注1)注1:超过上表中规定的极限参数会导致器件永久性损坏。
而工作在以上极限条件下可能会影响器件的可靠性。
电气特性除非特别说明,T A =25o C电气特性(接上一页) 除非特别说明,T A =25o C应用指南概述QX6104是一款高精度降压型大功率LED 恒流驱动芯片,输出电流可达2A 以上。
芯片采用专利的高端电流检测、固定频率、电流模PWM 控制方式,具有优异的线性调整率和负载调整率。
芯片内置频率补偿与斜坡补偿,无需外部补偿。
QX6104还集成了抖频功能,以改善系统的EMI 特性。
Rockwell Automation Trusted 8 Channel Temperature
PD-T8840 TrustedTrusted 8 Channel Temperature FTAProduct OverviewThe Trusted® Temperature Field Termination Assembly (FTA) is designed to interface between a Trusted system and up to eight temperature, voltage or current devices using a range of available plug in conditioning units.Features:•Eight Input channels per Trusted Temperature FTA.•Flexible user defined conditioning.•Standard DIN rail compatibility.•Configurable 2 or 3 wire Resistance Temperature Detector (RTD) inputs.•Dual 24 V Supply.Trusted PD-T8840Page intentionally left blankPREFACEIn no event will Rockwell Automation be responsible or liable for indirect or consequential damages resulting from the use or application of this equipment. The examples given in this manual are included solely for illustrative purposes. Because of the many variables and requirements related to any particular installation, Rockwell Automation does not assume responsibility or reliability for actual use based on the examples and diagrams.No patent liability is assumed by Rockwell Automation, with respect to use of information, circuits, equipment, or software described in this manual.All trademarks are acknowledged.DISCLAIMERIt is not intended that the information in this publication covers every possible detail about the construction, operation, or maintenance of a control system installation. You should also refer to your own local (or supplied) system safety manual, installation and operator/maintenance manuals.REVISION AND UPDATING POLICYThis document is based on information available at the time of its publication. The document contents are subject to change from time to time. The latest versions of the manuals are available at the Rockwell Automation Literature Library under "Product Information" information "Critical Process Control & Safety Systems".TRUSTED RELEASEThis technical manual applies to Trusted Release: 3.6.1.LATEST PRODUCT INFORMATIONFor the latest information about this product review the Product Notifications and Technical Notes issued by technical support. Product Notifications and product support are available at the Rockwell Automation Support Centre atAt the Search Knowledgebase tab select the option "By Product" then scroll down and select the Trusted product.Some of the Answer ID’s in the Knowledge Base require a TechConnect Support Contract. For more information about TechConnect Support Contract Access Level and Features please click on the following link:https:///app/answers/detail/a_id/50871This will get you to the login page where you must enter your login details.IMPORTANT A login is required to access the link. If you do not have an account then you can create one using the "Sign Up" link at the top right of the web page.DOCUMENTATION FEEDBACKYour comments help us to write better user documentation. If you discover an error, or have a suggestion on how to make this publication better, send your comment to our technical support group at SCOPEThis manual specifies the maintenance requirements and describes the procedures to assist troubleshooting and maintenance of a Trusted system. WHO SHOULD USE THIS MANUALThis manual is for plant maintenance personnel who are experienced in the operation and maintenance of electronic equipment and are trained to work with safety systems. SYMBOLSIn this manual we will use these notices to tell you about safety considerations.SHOCK HAZARD: Identifies an electrical shock hazard. If a warning label is fitted, it can be on or inside the equipment.WARNING: Identifies information about practices or circumstances that can cause an explosion in a hazardous environment, which can cause injury or death, property damage or economic loss.ATTENTION: Identifies information about practices or circumstances that can cause injury or death.CAUTION: Identifies information about practices or circumstances that can cause property damage or economic loss.BURN HAZARD: Identifies where a surface can reach dangerous temperatures. If a warning label is fitted, it can be on or inside the equipment.This symbol identifies items which must be thought about and put in place when designing and assembling a Trusted controller for use in a Safety Instrumented Function (SIF). It appears extensively in the Trusted Safety Manual.IMPORTANTIdentifies information that is critical for successful application and understanding of the product.NOTE Provides key information about the product or service.TIP Tips give helpful information about using or setting up the equipment.WARNINGS AND CAUTIONSWARNING: EXPLOSION RISKDo not connect or disconnect equipment while the circuit is live or unless the area is known to be free of ignitable concentrations or equivalentAVERTISSEMENT - RISQUE D’EXPLOSIONNe pas connecter ou déconnecter l’équipement alors qu’il est sous tension, sauf si l’environnement est exempt de concentrations inflammables ou équivalenteMAINTENANCEMaintenance must be carried out only by qualified personnel. Failure to follow these instructions may result in personal injury.CAUTION: RADIO FREQUENCY INTERFERENCEMost electronic equipment is influenced by Radio Frequency Interference. Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.CAUTION:The module PCBs contains static sensitive components. Static handling precautions must be observed. DO NOT touch exposed connector pins or attempt to dismantle a module.ISSUE RECORDIssue Date Comments1 July 052 Aug 06 Corrections3 Jun 08 Open circuit effects4 Apr 10 Change to sub-section 2.15 Apr 16 Rebranded, reformatted, Inclusion of IEEE symbols and correction oftypographical errorsPage intentionally left blankTrusted 8 Channel Temperature FTA Table of Contents Table of Contents1.Description (3)2.Installation (5)2.1. Cable Selection (5)2.2. Module Pin-out Connections (7)2.2.1. RTD1 to RTD8 (7)2.2.2. PWR (7)2.2.3. IOIF (8)3.Applications (9)3.1. Signal Conditioning units (9)3.1.1. Isolator Physical dimensions (9)3.1.2. Conditioning Unit Specification (10)3.1.3. Available Conditioning Units (10)3.1.4. Cold Junction Compensation (12)4.Specifications (13)Table of Contents Trusted 8 Channel Temperature FTAPage intentionally left blank1.DescriptionFigure 1 Trusted Temperature FTAThe Trusted Temperature FTA enables connection to 8 temperature, voltage or current devices using RTD, Thermocouple, Voltage and Current input conditioning units. The Trusted Temperature FTA excludes the conditioning units to allow maximum configurability. More than one type of conditioning unit can be used on the same FTA.Figure 2 Module Layout2. Installation2.1. Cable SelectionThe Trusted Temperature FTA can connect direct to an Analogue Input Module using either companion cables TC-211/212 or SmartSlot cables TC-511/512. The Output can also be connected to the Analogue Input module via a Versatile Field Termination Assembly (VFTA) if necessary to be compatible with an existing installation.Some isolator modules will float their output to 10 V on an open circuit field input. This will cause slice faults on the analogue input module. If the isolator output is connected to the module via a 250 Ω resistor on a VFTA, the voltage will be pulled down into the module’s operating range. Therefore even if the isolator output is a voltage signal, it is recommended to connect the input via a VFTA with the 250 Ω VFTA resistor in parallel.Figure 3 System Connectivity using 1-5 V Output DevicesAnalogue module 8431/ 8432Temperature FTA 8840Temperature FTA 8840 Temperature FTA 8840Temperature FTA 8840Temperature FTA 8840TC-211/212Typical Configuration using conditioning devices with 1-5 V outputUp to 8 temperature devicesFigure 4 System Connectivity using VFTAFor signal conditioning units that provide signals as 4 mA to 20 mA for low to highengineering range, a conversion is needed because the voltage measured by the module input is not exactly 1 V to 5 V.EU = ((count/4036.5) – 0.007828) x (HEU – LEU) + LEU Where:LEU = Low engineering unit range HEU = High engineering unit range Count = Raw value seen by input EU = Engineering unit valueFor signal conditioning units that provide a voltage signal of 1 V to 5 V, no special factors are required:EU = (count/4096) x (HEU – LEU) + LEU.VFTA 8842Temperature FTA 8840 Temperature FTA 8840 Temperature FTA 8840Temperature FTA 8840Temperature FTA 8840Typical Configuration using conditioning Devices with 1 to 5 V outputusing a VFTAUp to 8 temperature devicesAnalogue module 84312.2.Module Pin-out Connections 2.2.1.RTD1 to RTD8Terminal Description ConditioningModule Pin Thermocoupleor Voltage2 wireRTD3 wireRTD4 wireRTDR Sense Input (X) 0 Red Red R Input Low (-) 2 - Red Red Red W Input High (+) 1 + White White White/WhiteTable 1 Input TerminationsFigure 5 Temperature Input Schematic2.2.2.PWRTerminal Description+ 24 Vdc- 0 V- 0 V+ 24 VdcTable 2 Power TerminationsThere are no fuses fitted to the power rails on the Trusted Temperature FTA. External 2 A fuses should be fitted to the power wiring.2.2.3.IOIFTerminal Description1 0 V2 Output, channel 13 Output, channel 24 Output, channel 35 Output, channel 46 Output, channel 57 Output, channel 68 Output, channel 79 Output, channel 810 0 VTable 3 Temperature Signal Outputs3.ApplicationsThe Trusted Temperature FTA interfaces between a Trusted system and up to eight monitoring devices using, isolated RTD, Thermocouple, Voltage and Current input conditioning units. Compatible conditioning units must have 1 V to 5 V outputs.3.1.Signal Conditioning unitsCompatible conditioning unit include the 7B series of units from Analog Devices Inc and SCM7B series from Dataforth.3.1.1.Isolator Physical dimensionsFigure 6 Conditioning Unit Dimensions3.1.2.Conditioning Unit SpecificationThe following specification applies to all signal conditioning unit types Operating Voltage Range15 Vdc to 30 Vdc Power consumption 2 W maxOperating Temperature -40 °C to +85 °C Common mode Isolation 1500 Vac rms Continuous field voltage withstand 120 Vac rmsAccuracy ±0.3 % spanOutput Signal range +1 V to +5 V3.1.3.Available Conditioning UnitsInput Types Range ModelNumber (A)Model Number (B)Isolated Voltage0 mV to +10 mV7B30-01-1SCM7B30-010 mV to +100 mV7B30-02-1SCM7B30-020 V to +1 V7B30-03-1SCM7B30-03+1 V to +5 V7B30-05-1SCM7B30-04-10 mV to +10 mV7B30-06-1SCM7B30-05-100 mV to +100 mV7B30-07-1SCM7B30-06-1 V to +1 V7B30-08-1SCM7B30-070 V to 10 V Not available SCM7B30-08-5 V to +5 V Not available SCM7B31-01-10 V to +10 V Not available SCM7B31-020 V to 5 V Not available SCM7B31-03 Isolated Current 4 mA to 20 mA7B32-01-1SCM7B32-010 mA to 20 mA Not available SCM7B32-02 Isolated RTD-100 °C to +100 °C (-148 °F to +212 °F)7B34-01-1SCM7B34-01Number (A)Number (B) Pt 100 ΩLinearized0 °C to +100 °C (+32 °F to +21 2 °F)7B34-02-1SCM7B34-020 °C to +200 °C (+32 °F to +392 °F)7B34-03-1SCM7B34-030 °C to +600 °C (+32 °F to +1112 °F)7B34-04-1SCM7B34-04-50 °C to +350 °C (-58 °F to +662 °F)7B34-05-1SCM7B34-05Isolated RTD Ni 120 ΩLinearized 0 °C to +300 °C (+32 °F to +572 °F)7B34-N-01-1SCM7B34N-01 0 °C to +200 °C (+32 °F to +392 °F)7B34-N-02-1SCM7B34N-02Isolated 2 wireTransmitter(inc loop power)4 mA to 20 mA7B35-01-1SCM7B35-01Isolated Potentiometer 0 Ω to 100 ΩNot available SCM7B36-01 0 Ω to 200 ΩNot available SCM7B36-02 0 Ω to 500 ΩNot available SCM7B36-03 0 Ω to 1 KΩNot available SCM7B36-04 0 Ω to 5 KΩNot available SCM7B36-05 0 Ω to 10 KΩNot available SCM7B36-06Isolated Thermocouple Type J -100 °C to +760 °C (-148 °F to +1400 °F)7B37-J-01-1SCM7B37J-01 0 °C to +200 °C (+32 °F to +392 °F)7B37-J-10-1SCM7B37J-10 0 °C to +400 °C (+32 °F to +752 °F)7B37-J-11-1SCM7B37J-11 0 °C to +600 °C (+32 °F to +1112 °F)7B37-J-12-1SCM7B37J-12 +300 °C to +600 °C (+572 °F to +1112 °F)7B37-J-13-1SCM7B37J-13Isolated Thermocouple Type K -100 °C to +1350 °C (-148 °F to +2462 °F)7B37-K-02-1SCM7B37K-02 0 °C to +300 °C (+32 °F to +572 °F)7B37-K-20-1SCM7B37K-20 0 °C to +600 °C (+32 °F to +1112 °F)7B37-K-21-1SCM7B37K-21 0 °C to +1200 °C (+32 °F to +2192 °F)7B37-K-22-1SCM7B37K-22 +600 °C to +1200 °C (+1112 °F to +2192 °F)7B37-K-23-1SCM7B37K-23Number (A)Number (B)Isolated Thermocouple Type J Linearized 0 °C to +760 °C (+32 °F to +1400 °F)7B47-J-01-1SCM7B47J-01 -100 °C to +300 °C (-148 °F to +572 °F)7B47-J-02-1SCM7B47J-02Isolated Thermocouple Type K Linearized 0 °C to +1300 °C (+32 °F to +2372 °F)7B47-K-03-1SCM7B47K-03 0 °C to +600 °C (+32 °F to +1112 °F)7B47-K-04-1SCM7B47K-04Table 4 Available Conditioning UnitsAdditional standard ranges, including custom are available. Information and datasheets can be supplied upon request.3.1.4.Cold Junction CompensationThe Trusted Temperature FTA includes a Cold Junction Compensation (CJC) resistor for each of the inputs. This makes the FTA compatible with Thermocouple conditioning units. For information in determining compatible Thermocouple Units the CJC resistor specification is as follows:GE Thermometrics Part D95G104WNTC, 100 K at 25 °CFor further information see the manufacturer’s data sheet.Trusted 8 Channel Temperature FTA 4. Specifications 4.SpecificationsVoltage Range 15 Vdc to 30 VdcMaximum Input Current 2.5 ANumber of Inputs 8Input types Voltage, Current, RTD and Thermocoupledepending on chosen conditioning unit. Environmental Specifications Refer to Document 552517DimensionsHeight 110 mm (4.3 in)Width 145 mm (5.7 in)Depth 68 mm (2.6 in)Depth with conditioning unit fitted 90 mm (3.6 in)Weight 248 g (0.55 lb)Accuracy, resolution Dependant on conditioning unitRockwell Automation Publication PD-T8840 Issue 5 13。
XLSEMI XL8002 80V 1A高效降压PWM LED常电流驱动器说明书
80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002FeaturesOperation Voltage DC 12V~80V. 0.1V current sense voltage reference. Directly drive 1~18 Series 1W/3W LED. Excellent line and load regulation.Internal Optimize Power HV-MOSFET. Built in Thermal Shutdown Function. Built in Current Limiting Function.Built in Soft-Start Circuit.Available in TO263-5L package. Up to 98% efficiency. ApplicationsLED Lighting & LED LAMP General purpose LED lightingGeneral DescriptionThe XL8002 is a monolithic high voltage switching regulator with PFM that is specifically designed to operate from a 12V~80V DC power supply.The XL8002 is a high efficiency LED driver switching regulator. The LED string is driven at DC constant current rather than constant voltage, thus providing constant light output and enhanced reliability.Figure1. Package Type of XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure4. XL8002 Typical Application80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure5. Efficiency VS Output N*1W LEDFigure6. Output ILED Load Regulation VS Output N*1W LED80V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002 Figure7. XL8002 System Application at VIN=60V~80V Schematic Figure8. XL8002 System Application at VIN=60V~80V Efficiency Curve80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002 Figure9. XL8002 System Application at VIN=36V~60V Schematic80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure10. XL8002 System Application at VIN=36V~60V Efficiency Curve Table2: Figure9 Input VIN=36V/48V system parameters table:80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure11. XL8002 System Application at VIN=12V~36V SchematicFigure12. XL8002 System Application at VIN=12V~36V Efficiency CurveTable3: Figure11 Input VIN=12V/24V system parameters table:VIN=12V VIN=24VFOSC Pout Efficiency FOSC Pout Efficiency1.01W 82.3%1.96W 90.8%2.91W 94.1%47.25K 3.80W 95.5%42.17K 4.70W 96.6%31.13K 5.61W 97.2%80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002 Figure13. XL8002 System Application at VIN=60V~80V Schematic Figure14. XL8002 System Application at VIN=60V~80V Efficiency Curve80V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002。
RS PRO IPM 242 600A 电流探头测试仪说明书
ENGLSpecifications: (All at 23℃±5℃, ≦80% R.H.)DC/AC VoltageDC/AC VoltageFunction Range Accuracy*DCV 99.99V± (0.7% + 2dgt) 999.9VACV 99.99V ± (1.0% + 5dgt)50 ~ 500Hz 999.9VLPF ACV 99.99V 50 ~ 60Hz ± (1% + 5dgt)>60 ~ 400Hz ± (5% + 5dgt) 999.9V* DCV <1000dgt, add 6 dgt to the accuracy.ACV <1000dgt, add 3 dgt to the accuracy.Overload Protection: 1000VrmsInput Impedance:3.5MΩ // <100pFAC+DC V RMS Accuracy: same as ACV spec. +DCV spec.AC CurrentAC CurrentFunction Range AccuracyACA 99.99A 50 ~ 60Hz ± (1.5% + 5dgt) **>60 ~ 400Hz ± (2% + 5dgt) ** 599.9ALPF ACA 0.10A ~ 99.99A 50 ~ 60Hz ± (1.5% + 5dgt) **>60 ~ 400Hz ± (5% + 5dgt) ** 599.9A** The measured value <1000dgt, add 5 dgt to the accuracy. Overload Protection: 600ArmsPeak Hold (Peak MAX / Peak MIN)Peak Hold : Peak MAX / Peak MIN Function Range AccuracyACV 140.0V± (3.0% + 15dgt) 1400VACA 140.0A± (3.0% + 15dgt) 850AOverload Protection: 1000 V RMS, 600 Arms FrequencyFrequencyFunction Range AccuracyFrequency20.00 ~ 99.99Hz± (0.5% + 3dgt) 20.0 ~ 999.9Hz0.020 ~ 9.999KHzOverload Protection: 1000 V RMS, 600 Arms Harmonic DistortionTotal Harmonic DistortionFunction Range AccuracyACA /ACV 99.9% ± (3.0% + 10dgt)Harmonic distortion measurement Harmonic order Range AccuracyH01 ~ H1299.9% ± (5% + 10dgt)H13 ~ H25 ± (10% + 10dgt)Overload Protection: 1000 V RMS, 600 Arms-If ACV<10Vrms or ACA <10Arms, it will display “rdy”.-If the fundamental frequency out of range 45 ~ 65Hz, it will display “out.F”.Inrush CurrentInrush Current :Function Range AccuracyACA 99.99A ± (2.5% + 0.2A) 599.9A ± (2.5% + 5dgt)Overload Protection: 1000 V RMS, 600 ArmsAccuracy defined for:Sine wave, ACA≧10Arms, Freq. 50/60Hz- Integration time about 100m secActive Power (AC)Active Power (AC)Function Range AccuracyACW 9.999 kW**A,error×V,reading+V,error×A,reading 99.99 kW599.9KW** The measured value<1.000kW,add 10 dgt to the accuracy.Overload Protection: 1000 V RMS, 600 ArmsAccuracy defined for:ACW : Sine wave , ACV≧10 V RMS, ACA≧5 ArmsFreq. 50~60Hz, PF=1.00Power FactorPower FactorFunction Range Accuracy* PF-1.00 ~ 0.00 ~1.00 ±3°±1dgt * ACA<100A, add ±2° to the accuracyOverload Protection: 1000 V RMS, 600 ArmsResistance & Continuity & DiodeResistance & Continuity & Diode Function Range AccuracyResistance 999.9 Ω± (1.0% + 5dgt) 9.999 kΩ± (1.0% + 3dgt) 99.99 kΩContinuity 999.9 Ω± (1.0% + 5dgt)Diode 0.40~ 0.80V ± 0.1V Overload Protection: 1000VrmsMax. Test Current: Approx. 0.5mA.Continuity Check: <30Ω Beep On.>100Ω Beep OFF.Continuity Indicator: 2 KHz Tone BuzzerContinuity Response Time: < 100ms. CapacitanceCapacitanceFunction Range AccuracyCapacitance 3.999 μF± (1.9% + 8dgt) 39.99 μF399.9 μF3999 μFOverload Protection: 1000 V RMS TemperatureTemperatureFunction Range Accuracy°C-50 °C ~ 99.9 °C ± (1% + 2°C)100 °C ~ 399.9 °C400 °C ~ 1000 °C± (1% + 1°C)°F-58 °F ~ 211.9 °F ± (1% + 4°F)212.0 °F ~ 751.9 °F752 °F ~ 1832 °F± (1% + 2°F)Overload Protection: 1000 V RMS。
福禄克 884xa系列台式万用表手册
有限担保和有限责任
Fluke 担保在正常使用和保养的情况下,其产品没有材料和工艺上的缺陷。从寄送之日起,担保期为三年。部ቤተ መጻሕፍቲ ባይዱ件、产品修理和服务的担保期限为 90 天。本担保仅限于 Fluke 授权零售商的原购买人或最终用户,并且不适 用于一次性电池、电缆接头、电缆绝缘转换接头或 Fluke 认为由于误用、改装、疏忽、污染及意外或异常操 作或处理引起的任何产品损坏。Fluke 担保软件能依照功能规格正常运行 90 天,并且软件是记录在无缺陷的 媒介上。Fluke 并不担保软件毫无错误或在运行中不会中断。
Fluke Europe B.V. P.O. Box 1186 5602 BD Eindhoven The Netherlands
11/99
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目录
章节 1
标题
页
章概述和技术指标.................................................................................. 1-1
®
8845A/8846A Digital Multimeter
用户手册
July 2006, Rev. 3, 3/11 (Simplified Chinese)
© 2006 - 2011 Fluke Corporation. Specifications subject to change without notice. All rights reserved. All product names are trademarks of their respective companies.
概述 ....................................................................................................... 1-3 用户文件 ................................................................................................ 1-3 关于本手册 ............................................................................................ 1-3 安全信息 ................................................................................................ 1-4
ISL8841AABZ资料
Features
• 1A MOSFET gate driver • 90μA start-up current, 125μA maximum • 35ns propagation delay current sense to output • Fast transient response with peak current mode control • 30V operation • Adjustable switching frequency to 2MHz • 20ns rise and fall times with 1nF output load • Trimmed timing capacitor discharge current for accurate deadtime/maximum duty cycle control • 1.5MHz bandwidth error amplifier • Tight tolerance voltage reference over line, load and temperature • ±3% current limit threshold • Pb-free plus anneal available and ELV, WEEE, RoHS Compliant
GND
2.5V
A = 0.5
CS
FB
+ -
ERROR AMPLIFIER
VF TOTAL = 1.15V
COMP
VREF
100k
2.9V 1.0V
150k
OSCILLATOR COMPARATOR <10ns
RTCT
+
8.4mA
ON
FN6320.3 April 18, 2007
ISL8844A中文资料
PART NUMBER ISL8840A ISL8841A ISL8842A ISL8843A ISL8844A ISL8845A
RISING UVLO 7.0 7.0
14.4V 8.4V 14.4V 8.4V
MAX. DUTY CYCLE 100% 50% 100% 100% 50% 50%
Pinout
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
deadtime/maximum duty cycle control • 1.5MHz bandwidth error amplifier • Tight tolerance voltage reference over line, load and
temperature • ±3% current limit threshold • Pb-free plus anneal available and ELV, WEEE, RoHS
ISL8843AMBZ 8843 AMBZ -55 to +125 8 Ld SOIC M8.15 (See Note)
ISL8843AMUZ 43AMZ (See Note)
-55 to +125 8 Ld MSOP M8.118
ISL8844AABZ 8844 AABZ -40 to +105 8 Ld SOIC M8.15 (See Note)
DRV8818PWP;DRV8818PWPR;DRV8818EVM;中文规格书,Datasheet资料
DRV8818 SLVSAX9A–SEPTEMBER2011–REVISED FEBRUARY2012STEPPER MOTOR CONTROLLER ICCheck for Samples:DRV8818FEATURES•Pulse Width Modulation(PWM)Microstepping Lower R ds(on)Motor Driver•Thermally Enhanced Surface Mount Package –Built-In Microstepping IndexerAPPLICATIONS–Up to2.5-A Current Per Winding•Printers–Microstepping Indexer Provides up to1/8-Step Operation•Textile Machinery–Low0.37-Ω(HS+LS)MOSFET•Positioning/TrackingOn-Resistance(at25°)•Factory Automation–Programmable Mixed Decay,Blanking,and•RoboticsOff Time•Pin-Compatible Upgrade to DRV8811WithDESCRIPTION/ORDERING INFORMATIONThe DRV8818provides an integrated stepper motor driver solution for printers,scanners,and other automated equipment applications.The device has two H-bridge drivers,as well as microstepping indexer logic to control a stepper motor.The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings.A simple step/direction interface allows easy interfacing to controller circuits.Pins allow configuration of the motor in full-step,half-step,quarter-step,or eighth-step modes.Decay mode and PWM off time are programmable.Internal shutdown functions are provided for over current protection,short circuit protection,under-voltage lockout and overtemperature.The DRV8818is packaged in a PowerPAD™28-pin HTSSOP package with PowerPAD™(Eco-friendly:RoHS and no Sb/Br).ORDERING INFORMATION(1)PACKAGE(2)ORDERABLE PART NUMBER TOP-SIDE MARKINGReel of2000DRV8818PWPRPowerPAD™(HTSSOP)–PWP DRV8818Tube of50DRV8818PWP(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TIweb site at .(2)Package drawings,thermal data,and symbolization are available at /packaging.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PowerPAD is a trademark of Texas Instruments.DRV8818SLVSAX9A–SEPTEMBER2011–REVISED FUNCTIONAL BLOCK DIAGRAMDRV8818 SLVSAX9A–SEPTEMBER2011–REVISED FEBRUARY2012TERMINAL FUNCTIONSNAME NO.I/O(1)DESCRIPTION EXTERNAL COMPONENTS OR CONNECTIONSPOWER AND GROUNDGND7,21-Device groundVMA28-Bridge A power supply Connect to motor supply(8V to35V).Both pins must be connectedto same supply.VMB15-Bridge B power supply Connect to motor supply(8V to35V).Both pins must be connectedto same supply.VCC10-Logic supply voltage Connect to3-V to5-V logic supply.Bypass to GND with a0.1-μFceramic capacitor.CP123IO Charge pump flying capacitor Connect a0.22-μF capacitor between CP1and CP2.CP224IO Charge pump flying capacitor Connect a0.22-μF capacitor between CP1and CP2.VCP22IO High-side gate drive voltage Connect a0.22-μF ceramic capacitor to V M.VGD20IO Low-side gate drive voltage Bypass to GND with a0.22-μF ceramic capacitor.CONTROLENABLEn26I Enable input Logic high to disable device outputs,logic low to enable outputs.Weak internal pullup to VCC.SLEEPn27I Sleep mode input Logic high to enable device,logic low to enter low-power sleep mode.Weak internal pulldown.DECAY5I Decay mode select Voltage applied sets decay mode-see motor driver description fordetails.Bypass to GND with a0.1-μF ceramic capacitor.Weakinternal pulldown.STEP19I Step input Rising edge causes the indexer to move one step.Weak internalpulldown.DIR3I Direction input Level sets the direction of stepping.Weak internal pulldown.USM013I Microstep mode0USM0and USM1set the step mode-full step,half step,quarterstep,or eight microsteps/step.Weak internal pulldown.USM112I Microstep mode1USM0and USM1set the step mode-full step,half step,quarterstep,or eight microsteps/step.Weak internal pulldown.RESETn17I Reset input Active-low reset input initializes the indexer logic and disables theH-bridge outputs.Weak internal pullup to VCC.SRn16I Sync.Rect.enable input When active low,synchronous rectification is enabled.Weak internalpulldown.VREF8I Current set reference input Reference voltage for winding current setRCA6I Bridge A blanking and off time adjust Connect a parallel resistor and capacitor to GND-see motor driverdescription for details.RCB9I Bridge B blanking and off time adjust Connect a parallel resistor and capacitor to GND-see motor driverdescription for details.ISENA1-Bridge A ground/Isense Connect to current sense resistor for bridge AISENB14-Bridge B ground/Isense Connect to current sense resistor for bridge BOUTPUTSAOUT14O Bridge A output1Connect to bipolar stepper motor windingAOUT225O Bridge A output2Positive current is AOUT1→AOUT2BOUT111O Bridge B output1Connect to bipolar stepper motor windingBOUT218O Bridge B output2Positive current is BOUT1→BOUT2HOMEn2O Home position Logic low when at home state of step table,logic high at other states (1)Directions:I=input,O=output,OZ=3-state output,OD=open-drain output,IO=input/outputISENAHOMEDIRAOUT1DECAYRCAGNDVREFRCBVCCBOUT1USM1USM0ISENBVMASLEEPnENABLEnAOUT2CP2CP1VCPGNDVGDSTEPBOUT2RESETnSRnVMBDRV8818SLVSAX9A–SEPTEMBER2011–REVISED ABSOLUTE MAXIMUM RATINGS(1)(2)(3)MIN MAX UNIT V MX Power supply voltage range–0.335VV CC Power supply voltage range–0.37V Digital pin voltage range–0.57VV REF Input voltage range–0.3V V CC V ISENSEx pin voltage range–0.30.5VI O(peak)Peak motor drive output current Internally limitedP D Continuous total power dissipation See Thermal Information table T J Operating junction temperature range–40150°CT stg Storage temperature range–60150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to network ground terminal.(3)Power dissipation and thermal limits must be observed.THERMAL INFORMATIONDRV8818THERMAL METRIC(1)PWP UNITS28PINSθJA Junction-to-ambient thermal resistance(2)32.2θJCtop Junction-to-case(top)thermal resistance(3)16.3θJB Junction-to-board thermal resistance(4)14°C/WψJT Junction-to-top characterization parameter(5)0.5ψJB Junction-to-board characterization parameter(6)13.8θJCbot Junction-to-case(bottom)thermal resistance(7) 2.1(1)For more information about traditional and new thermal metrics,see the IC Package Thermal Metrics application report,SPRA953.(2)The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard,high-K board,asspecified in JESD51-7,in an environment described in JESD51-2a.(3)The junction-to-case(top)thermal resistance is obtained by simulating a cold plate test on the package top.No specificJEDEC-standard test exists,but a close description can be found in the ANSI SEMI standard G30-88.(4)The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCBtemperature,as described in JESD51-8.(5)The junction-to-top characterization parameter,ψJT,estimates the junction temperature of a device in a real system and is extractedfrom the simulation data for obtainingθJA,using a procedure described in JESD51-2a(sections6and7).(6)The junction-to-board characterization parameter,ψJB,estimates the junction temperature of a device in a real system and is extractedfrom the simulation data for obtainingθJA,using a procedure described in JESD51-2a(sections6and7).(7)The junction-to-case(bottom)thermal resistance is obtained by simulating a cold plate test on the exposed(power)pad.No specificJEDEC standard test exists,but a close description can be found in the ANSI SEMI standard G30-88.DRV8818 SLVSAX9A–SEPTEMBER2011–REVISED FEBRUARY2012RECOMMENDED OPERATING CONDITIONST A=25°C(unless otherwise noted)MIN NOM MAX UNITV M Motor power supply voltage range(1)835VV CC Logic power supply voltage range3 5.5VV REF VREF input voltage0V CC VR X R X resistance value4706801500kΩC X C X capacitance value1256100pF(1)All V M pins must be connected to the same supply voltage.ELECTRICAL CHARACTERISTICST A=25°C(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Power SuppliesI VM V M operating supply current V M=35V,f PWM<50KHz710mAI VCC V CC operating supply current f PWM<50KHz0.44mAI VMQ V M sleep mode supply current V M=35V320μAI VCCQ V CC sleep mode supply current0.520μAV M undervoltage lockout voltage V M rising 6.77.5V UVLO V V CC undervoltage lockout voltage V CC rising 2.75 2.95VREF Input/Current Control AccuracyI REF VREF input current VREF=3.3V–33μAVREF=2.0V,70%to100%current–55%ΔI CHOP Chopping current accuracyVREF=2.0V,20%to56%current–1010% Logic-Level InputsV IL Input low voltage0.3×V CC VV IH Input high voltage0.7×V CC VV HYS Input hysteresis300mVI IL Input low current VIN=0.3×V CC–2020μAI IH Input high current VIN=0.3×V CC–2020μAR PU Pullup resistance1MΩR PD Pulldown resistance1MΩHOMEn OutputV OL Output low voltage I O=200μA0.3×VCC VV OH Output high voltage I O=–200μA0.7×VCC V Decay InputV IL Input low threshold voltage For fast decay mode0.21×VCC VV IH Input high threshold voltage For slow decay mode0.6×VCC VH-Bridge FETSR ds(on)HS FET on resistance V M=24V,I O=2.5A,T J=25°C0.220.30ΩR ds(on)LS FET on resistance V M=24V,I O=2.5A,T J=25°C0.150.24ΩI OFF–2020μA Motor Drivert OFF Off time Rx=56kΩ,Cx=680pF354453μst BLANK Current sense blanking time Rx=56kΩ,Cx=680pF90012501500nst DT Dead time SRn=010*******nst R Rise time1080nst F Fall time1080nsSTEP DIR,USMx SLEEPnDRV8818SLVSAX9A–SEPTEMBER2011–REVISED ELECTRICAL CHARACTERISTICS(continued)T A=25°C(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Protection CircuitsT TSD Thermal shutdown temperature Die temperature150160180°CI OCP Overcurrent protection level 3.5At OCP OCP deglitch time 1.5µst RET OCP retry time800µsTIMING REQUIREMENTST A=25°C(unless otherwise noted)PARAMETER MIN MAX UNIT f STEP Step frequency500kHz t WH(STEP)Pulse duration,STEP high1μst WL(STEP)Pulse duration,STEP low1μst SU(STEP)Setup time,command to STEP rising200nst H(STEP)Hold time,command to STEP rising200nst WAKE Wakeup time,SLEEPn inactive to STEP 1.5msDRV8818 SLVSAX9A–SEPTEMBER2011–REVISED FEBRUARY2012FUNCTIONAL DESCRIPTIONPWM H-Bridge DriversDRV8818contains two H-bridge motor drivers with current-control PWM circuitry,and a microstepping indexer.A block diagram of the motor control circuitry is shown below.Figure1.Motor Control Circuitry8REFX CHOP ISENSEV I R =·OFF t R C=·1400BLANK t C=·DRV8818SLVSAX9A –SEPTEMBER 2011–REVISED FEBRUARY 2012Current RegulationThe PWM chopping current is set by a comparator,which compares the voltage across a current sense resistor,multiplied by a factor of 8,with a reference voltage.The reference voltage is input from the VREF pin.The full-scale (100%)chopping current is calculated as follows:(1)Example:If a 0.22-Ωsense resistor is used and the VREFx pin is 3.3V,the full-scale (100%)chopping current is 3.3V/(8*0.22Ω)=1.875A.The reference voltage is also scaled by an internal DAC that allows torque control for fractional stepping of a bipolar stepper motor,as described in the "Microstepping Indexer "section below.When a winding is activated,the current through it rises until it reaches the chopping current threshold described above,then the current is switched off for a fixed off time.The off time is determined by the values of a resistor and capacitor connected to the RCA (for bridge A)and RCB (for bridge B)pins.The off time is approximated by:(2)To avoid falsely tripping on transient currents when the winding is first activated,a blanking period is used immediately after turning on the FETs,during which the state of the current sense comparator is ignored.The blanking time is determined by the value of the capacitor connected to the RCx pin and is approximated by:(3)Decay ModeDuring PWM current chopping,the H-bridge is enabled to drive through the motor winding until the PWM current chopping threshold is reached.This is shown in Figure 2,Item 1.The current flow direction shown indicates positive current flow in the step table below.Once the chopping current threshold is reached,the H-bridge can operate in two different states,fast decay or slow decay.In fast decay mode,once the PWM chopping current level has been reached,the H-bridge reverses state to allow winding current to flow in a reverse direction.If synchronous rectification is enabled (SRn pin logic low),the opposite FETs are turned on;as the winding current approaches zero,the bridge is disabled to prevent any reverse current flow.If SRn is high,current is recirculated through the body diodes,or through external Schottky diodes.Fast-decay mode is shown in Figure 2,Item 2.In slow-decay mode,winding current is re-circulated by enabling both of the low-side FETs in the bridge.This is shown in Figure 2,Item 3.If SRn is high,current is recirculated only through the body diodes,or through external Schottky diodes.In this case fast decay is always used.Drive current Slow decay (brake)Fast decay (reverse)0.6CC FD DECAY V t R C In V æö·=··ç÷èøDRV8818SLVSAX9A –SEPTEMBER 2011–REVISED FEBRUARY 2012Figure 2.Decay ModeThe DRV8818also supports a mixed decay mode.Mixed decay mode begins as fast decay,but after a period of time switches to slow decay mode for the remainder of the fixed off time.Fast and mixed decay modes are only active if the current through the winding is decreasing;if the current is increasing,then slow decay is always used.Which decay mode is used is selected by the voltage on the DECAY pin.If the voltage is greater than 0.6x V CC ,slow decay mode is always used.If DECAY is less than 0.21x V CC ,the device operates in fast decay mode when the current through the winding is decreasing.If the voltage is between these levels,mixed decay mode is enabled.In mixed decay mode,the voltage on the DECAY pin sets the point in the cycle that the change to slow decay mode occurs.This time can be approximated by:(4)Mixed decay mode is only used while the current though the winding is decreasing;slow decay is used while thecurrent is increasing.Operation of the blanking,fixed off time,and mixed decay mode is illustrated in Figure 3.ONITRIPONPWM PWMWindingCurrentRCxVoltageDECAYDRV8818SLVSAX9A–SEPTEMBER2011–REVISED Figure3.PWMMicrostepping IndexerBuilt-in indexer logic in the DRV8818allows a number of different stepping configurations.The USM1and USM0 pins are used to configure the stepping format as shown in the table below:USM1USM0STEP MODE00Full step(2-phase excitation)011/2step(1-2phase excitation)101/4step(W1-2phase excitation)11Eight microsteps/stepsThe following table shows the relative current and step directions for different settings of USM1and USM0.At each rising edge of the STEP input,the indexer travels to the next state in the table.The direction is shown with the DIR pin high;if the DIR pin is low the sequence is reversed.Positive current is defined as xOUT1=positive with respect to xOUT2.Note that the home state is45degrees.This state is entered at power-up or device reset.The HOMEn output pin is driven low in this state.In all other states it is driven logic high.分销商库存信息:TIDRV8818PWP DRV8818PWPR DRV8818EVM。
DRV8840EVM;DRV8842EVM;中文规格书,Datasheet资料
User's GuideSLVU410–April2011CPG005_DRV88xx Evaluation Modules This document is provided as a supplement to the DRV8840and DRV8842datasheets.It details thehardware implementation of the CPG005_DRV88xxEVM Customer Evaluation Module(EVM).On thisdocument,DRV88xx will be used interchangeably to refer to any of the aforementioned devices.Contents1Block Diagram (2)1.1Power Connectors (2)1.2Test Stakes (2)1.3Jumpers (2)1.4Motor Outputs (3)2Installing Drivers And Software (4)2.1Installing the FTDI USB Driver (4)2.2Installing the CPG004_DRV88xx Evaluation Board Windows Application Software (4)2.3Running the Windows Application Software (4)3The Windows Application (4)3.1The Menu (7)3.2DRV88xx GPIO Control Signals (7)3.3Updating DAC Output for Current Control(VREFA and VREFB) (8)3.4DC Motor Speed Control(PWM) (8)4Schematic (9)List of Figures1AVREF Select Jumper Configuration (3)2DECAY Select Jumper Configuration (3)3DRV8840Tab (5)4DRV8842Tab (6)5GPIO Control Signals (7)6Current Control (8)7PWM Control (9)1 SLVU410–April2011CPG005_DRV88xx Evaluation ModulesSubmit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/Where DRV88xx stands for one of DRV8840 or DRV8842Block Diagram 1Block Diagram1.1Power ConnectorsThe CPG005_DRV88xx Customer EVM offers access to VM (Motor Voltage)power rail via a terminalblock (J1).A set of test clips in parallel with the terminal block allows for the monitoring of the input power rail.User must apply VM according to datasheet recommended parameters.NOTE:VDD for logic and microcontroller is derived from USB interface.1.2Test StakesEvery pin on the DRV88xx device has been brought out to a test stake.A label on the silkscreen identifies each signal.For those pins that change functionality depending on device flavor,a table is provided with corresponding function name on its particular column.1.3JumpersThere are only three jumpers the user must configure as detailed below.Default configuration assumes microcontroller resources are being utilized.As an alternative,a variable resistance is provided on the opposing jumper configuration.2CPG005_DRV88xx Evaluation ModulesSLVU410–April 2011Submit Documentation Feedback Copyright ©2011,Texas Instruments Incorporated /(a)(b)11From PotFrom DACTo configure the AVREF select jumper:(a) Use position JP2-1:2 to select the MSP430 DAC output (default).(b) Use position JP2-2:3 to select the respective variable resistancepotentiometer.This jumper should not be left open as lack ofreference voltage on the device will minimize current sourcinginto the respective H Bridge,resulting in very poor motion orno motion at all.(a)(b)11From PotFrom DACTo configure the DECAY select jumper:(a) Use position JP3-1:2 to select the MSP430 GPIO functionality (default).(b) Use position JP3-2:3 to select the respective variable resistancepotentiometer.Allowing the jumper to not be placed,will result in the device operating under mixed decay mode. Block Diagram1.3.1AVREF Select Jumper (JP2)Figure 1.AVREF Select Jumper Configuration1.3.2DECAY Select Jumper (JP3)Figure 2.DECAY Select Jumper Configuration1.4Motor OutputsThere are two ways of connecting the DC motor into the CPG005_DRV88xx Evaluation Module:two pin header (J4)or two position terminal block (J3).Although feasible,we do not recommend the connection of any motor into the test clips as these are Kelvin connections and not rated for high current output.3SLVU410–April 2011CPG005_DRV88xx Evaluation Modules Submit Documentation Feedback Copyright ©2011,Texas Instruments Incorporated /Installing Drivers And Software 2Installing Drivers And Software2.1Installing the FTDI USB DriverInstructions on how to install the FTDI USB driver on a Windows based computer are detailed in the“USB_Drivers_Install_Readme.pdf”file supplied with the CD inside the USB_Driver folder.2.2Installing the CPG004_DRV88xx Evaluation Board Windows Application SoftwareThe Windows application for the CPG005based EVM’s is the same Windows Application as for theCPG004based EVM’s.Copy the contents of the“WindowsApplication”folder provided within the CD,into your hard disk.2.3Running the Windows Application SoftwareTo run the application,double click the CPG004_DRV88xxEVM.exe application icon found on the samefolder the application was extracted into.3The Windows ApplicationThe CPG004_DRV88xxEVM Windows application is the software counterpart for the CPG004_DRV88xxEVM.It allows the PC computer to connect to the MSP430F1612microcontroller though an USB interfacechip.Once connection is established and commands are sent,microcontroller takes care of configuringcontrol signals and administering certain levels of automation,such as PWM output.The graphical user interface(GUI)has been designed to allow for all of the DRV88xx device’s functionalityto be tested without having to intervene with the hardware,except for the proper configuration of jumpers,when needed.Figure3shows the CPG004_DRV88xxEVM.exe main screen.The application is divided into several tabs:One for each one of the available devices.The menu contains items to configure and enable/disable theserial port.4CPG005_DRV88xx Evaluation Modules SLVU410–April2011Submit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/ The Windows ApplicationFigure3.DRV8840TabOn the CPG004DRV88xx EVM Windows Application there are two tabs usable with the CPG005basedEVMs.They are very similar and refer to the differences in the two devices,namely the ENABLE/PHASEinterface and the IN1/IN2interface.Everything else will operate in the same fashion.All the control signals needed to control motor enablement(ENABLE or INx),direction of rotation(PHASEor the respective combination of the INx pins),current control(through VREF)and PWM control for bothenablement and direction control signals are made available.Access to the DAC responsible of generating the VREF analog voltage is achieved by moving a simpleslider.A label offers information on what this reference voltage should be on a scale ranging from0V to2.5V.Similar sliders allow the control of PWM Duty Cycle on the ENABLE and PHASE pins(IN1and IN2on theDRV8842).This will allow for the control of both DC motor speed and direction.5 SLVU410–April2011CPG005_DRV88xx Evaluation ModulesSubmit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/The Windows Application Figure4.DRV8842TabA look at the DRV8842tab on the CPG004DRV88xx EVM Windows Application.This tab is virtually identical to the DRV8840tab.Only labels of respective signals differ:•ENABLE becomes IN1•PHASE becomes IN26CPG005_DRV88xx Evaluation Modules SLVU410–April2011Submit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/DRV8840DRV8842 The Windows Application3.1The MenuThe menu at the top of the application offers a series of quick options for how the COM port is to behave.File:Exit –Terminates the applicationSettings:Port –Selects from COM1to COM4.Default is COM4.The serial port's actual port number defaults to what we have specified on the“USB_Drivers_Install_Readme.pdf ”.However,any port between COM 1and COM 4are equally usable.Connect:Opens the serial port.When this menu item is pressed,its caption changes to “Disconnect ”.Disconnect:Closes the serial port.When this menu item is pressed,its caption changes to “Connect ”.After opening the application,the order of events should be:1.Go to Settings →Port and choose the COM Port where the FTDI device has been configured to work.If the COM port is 4,then this step can be skipped,as application defaults to COM4.2.Press Connect.If the port is available,the menu changes the “Connect “caption to “Disconnect “.PressDisconnect to disable the serial communications.3.After pressing any command button,<1><0><0>should return on the text box as an acknowledge.The text box also changes from red to green.4.The application is ready for use.3.2DRV88xx GPIO Control SignalsOnce the application is communicating with the interface board,the control signals can be actuated bychecking or un-checking check boxes on the Control Signals frame.Functionality of control signals is identical across the platform.A checked checkbox translates to a HI level on the respective control signal.Unchecked checkboxes translate to a LO level on the respective control signals.Both tabs (DRV8840and DRV8842)will have a very similar set of control signals.Changes to reflectcorrect signal naming have been incorporated.Figure 5.GPIO Control Signals7SLVU410–April 2011CPG005_DRV88xx Evaluation Modules Submit Documentation Feedback Copyright ©2011,Texas Instruments Incorporated /VREF = DAC_VALUE · 2.5V ¾4095The Windows Application 3.2.1About DECAYThe DECAY pin is in reality a triple state input.The GPIO operates as HI and LO according to thecheckbox.To have the DECAY pin floating,engaging mixed decay mode,simply remove the decayjumper JP3.3.3Updating DAC Output for Current Control (VREFA and VREFB)If the DRV88xx has been configured to accept VREF analog voltages through the microcontroller DAC outputs (refer to Jumpers section),then the slider bar on the Current Control frame can be used to set the VREF voltage.The label below the slider bar will inform the user what this analog voltage should be set to,if proper communications have been established with the EVM module.Figure 6.Current ControlThe 12-bit DAC channels 0/1are connected to the DRV88xx VREF analog inputs VREF.Changing the DAC digital value from 0to 4095,changes the analog voltage at the respective VREF pin from 0V to 2.5V respectively,following the equation:(1)Where:VREF is the output voltage.DAC_VALUE is a number from 0to 4095.3.4DC Motor Speed Control (PWM)For the purpose to control DC motor speed and direction,sliders have been provided which apply a PWM to the ENABLE and PHASE lines (IN1and IN2on the DRV8842variant).Each PWM slider consists of an 8-bit number so positions from 0to 255are obtained.A label below the slider bar informs the user what the obtained duty cycle should be,if proper communications have been established with the EVM module.The MSP430microcontroller directly transforms this 8-bit number into the respective duty cycle.PWMfrequency is around 31.25kHz.8CPG005_DRV88xx Evaluation ModulesSLVU410–April 2011Submit Documentation Feedback Copyright ©2011,Texas Instruments Incorporated / SchematicDRV8840DRV8842Figure7.PWM Control4SchematicA schematic is available in the form of a PDF file(“CPG005_Schematic.pdf”)inside the EVM_Relatedfolder on the supplied CD.9 SLVU410–April2011CPG005_DRV88xx Evaluation ModulesSubmit Documentation FeedbackCopyright©2011,Texas Instruments Incorporated/IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products andapplications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,andacknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet militaryspecifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and /automotiveAutomotiveMicrocontrollers Video and Imaging /videoRFID Wireless /wireless-appsRF/IF and ZigBee®Solutions /lprfTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated/分销商库存信息:TIDRV8840EVM DRV8842EVM。
艾森高压电路保护器产品说明书
Eaton MPN6203VEAXXSWEaton Magnum low voltage power circuit breaker, Magnum PXR,Narrow frame, 2000 A, 65 kA, Three-pole, Fixed vertical mounting,No trip unitGeneral specificationsEaton Magnum low voltage power circuitbreakerMPN6203VEAXXSW78668960224614.6 in16.8 in12.5 in95 lbNEMA Compliant CCC MarkedCE Marked SABA Listed ANSIUL ListedCSA CertifiedLloyd's Register Certified KEMA CertifiedABS CertifiedDNV GL CertifiedProduct Name Catalog NumberUPCProduct Length/Depth Product Height Product Width Product Weight Compliances CertificationsNarrow Three-pole Magnum PXR Narrow MagnumThree-pole2000 A65 kAIC65 kAIC 2000 A Zone selective interlocking application paperMagnum circuit breakers with Power Xpert Release trip units product aidSelevctive coordination application paper - IA0120000E3Magnum PXR and PD-SB standard and narrow frame UL Certificate of ComplianceMagnum PXR and PD-SB double and double narrow frame UL Certificate of CompliancePower Xpert Release trip unit for Magnum PXR circuit breakers PXR20/25 user manualMicrosoft Word - Power Xpert Protection Manager Quick StartGuide.docxMagnum PXR low voltage power circuit breakers user manualPower Xpert Protection Manager x32 22.06 1Power Xpert Protection Manager x64 22.6 1FrameNumber of poles Type FrameSeriesNumber of polesRated uninterrupted current (Iu)Interrupt ratingInterrupt ratingRated uninterrupted current (Iu)Application notesBrochuresCatalogsCertification reportsManuals and user guides Software, firmware, and applicationsEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaEaton Specification Sheet - MPN6203VEAXXSW Low voltage circuit breakers guide spec Magnum PXR 20/25 electronic trip units time current curves Safer by design: arc energy reduction techniques Cyber security white paperMolded case and low-voltage power circuit breaker healthSpecifications and datasheetsTime/current curvesWhite papers。
CW1274 Datasheet说明书
CW1274 4~7节电池保护IC功能特性●过充电保护•阈值范围3.650V、3.850V、4.175V~4.350V,25mV步进,±25mV精度●过放电保护•阈值范围2.300V~2.800V,100mV步进,±30mV精度●放电过流保护•过流检测1阈值范围0.050V~0.100V,±5mV精度•过流检测2阈值范围0.100V~0.200 V,,±10mV精度•短路保护阈值范围0.200V~0.500V,±20mV精度●充电过流保护•阈值范围-0.010V~-0.050V,±5mV精度●温度检测功能充放电高低温保护,温度外部可设●均衡功能●断线检测功能●负载检测功能●级联功能●低功耗设计•工作状态20μA (25°C)•休眠状态5μA (25°C)●封装形式:SSOP24应用领域●吸尘器●电动工具●电动自行车●后备电源●锂离子及锂聚合物电池包基本描述CW1274系列产品是一款高度集成的4~7串锂离子电池或锂聚合物电池保护芯片。
CW1274为电池包提供过充、过放、充放电过流、断线、充放电过温保护以及均衡功能,并支持芯片级联使用。
CW1274 典型应用框图CW1274产品选择指南CW1274 X X X X封装形式,S: SSOP24参数类型,从A到Z电池类型,L:代表锂离子电池F:代表磷酸铁锂电池功能和版本信息,从A 到Z产品目录CW1274 引脚排列图CW1274CW1274 绝对最大额定值注意:绝对最大额定值是指无论在任何条件下都不能超过的额定值。
如果超过此额定值,有可能造成产品损伤。
ESD等级额定工作电压CW1274电气特性除特殊说明外T A=25°CCW1274*2充放电温度保护温度取决于不同电阻的设定,放电低温保护温度默认为充电过温保护温度-20℃,即充电低温保护温度为0℃,则放电低温保护温度为-20℃*3所有过电流保护(包括过流1,过流2和短路保护)解除延迟时间均为60msCW1274原理框图CW1274 功能描述正常状态所有电池电压处于过充检测电压(V OC)和过放检测电压(V OD)之间,且CS端子电压处于过流检测电压(V EC1)和充电过流检测电压(V COC)之间时,CW1274处于正常工作状态。
SC8804高效率,同步,升压充电降压放电双向控制器.pdf
上海南芯半导体科技有限公司SC8804 DATASHEETSOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDA SC8804 高效率, 同步, 升压充电降压放电双向控制器Copyright © 2016, 上海南芯半导体科技有限公司具体应用信息请联系application@SC8804 DATASHEETSOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDA 上海南芯半导体科技有限公司5应用电路图DIR = Low, 充电(charging)DIR = High, 反向放电(discharging)2具体应用信息请联系application@ Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd.SC8804 DATASHEET上海南芯半导体科技有限公司SOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDACopyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd. 具体应用信息请联系application@ 36 管脚设置及功能简介C P _HC P _LN CV B U SS N S 1N P G N DN CS N S 1PSC8804 DATASHEETSOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDA 上海南芯半导体科技有限公司4具体应用信息请联系application@ Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd.SC8804 DATASHEET 上海南芯半导体科技有限公司SOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDACopyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd. 具体应用信息请联系application@ 5SC8804 DATASHEETSOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDA 上海南芯半导体科技有限公司7电气规格7.1绝对最大耐压在通风温度范围之内(除非另外标注)(1)6具体应用信息请联系application@ Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd.SC8804 DATASHEET 上海南芯半导体科技有限公司SOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDACopyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd. 具体应用信息请联系application@ 7SC8804 DATASHEETSOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDA 上海南芯半导体科技有限公司7.4电气性能T J= 25°C and V BUS = 12V, V BAT = 5V, R SS1 = R SS2= 1kΩ unless otherwise noted.8具体应用信息请联系application@ Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd.SC8804 DATASHEET 上海南芯半导体科技有限公司SOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDACopyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd. 具体应用信息请联系application@ 9SC8804 DATASHEETSOUTHCHIP CONFIDENTIAL, DISCLOSURE UNDER NDA 上海南芯半导体科技有限公司10具体应用信息请联系application@ Copyright © 2016, Southchip Semiconductor Technology (Shanghai) Co., Ltd.8和截止电压的对应关系如下表所示:表格 1 CSEL 电阻设定充电截止电压SC8804通过R SNS1和R SNS2分别检测VBUS 端和VBAT 端充电电流,如下图所示:电池端充电电流RVRRR1)R SNSx需连接在MOS管和输入/输出电容之间2)R SS1/R SS1’为一对电阻对,阻值需相等,同理,R SS2/R SS2’也需相等,典型值为1 kΩ若需要调整R SNSx的阻值,则对应的R SSx/R SSx’阻值也需要),1) 2) 3) 4)SC8804支持充电自适应功能。
8845A编程手册中文完全版
配有 IEEE-488 接口的仪器通过一组标准的互相连接的电缆相互通信,详细信息请参见 IEEE-488.1 标准文档。
IEEE-488 接口连接器位于仪表的后面板上。
配置 RS-232 端口
译
翻 RS-232 通信接口允许万用表与主机或终端之间进行 ASCII、异步、串行通信。下文描述
了配置 RS-232 端口的过程。设置 RS-232 端口为程控的活动端口,请参阅上文的“选择程控
者 0. conf:volt:dc 0.1 将直流范围设置为手动和 100 mV。
3 volt:dc:nplc 0.02 将 NPLC 设置为更快的读取速率 4 1/2 位。
爱好 DT8 zero:auto 0
关闭自动归零。
表trig:sour imm 仪trig:del 0
trig:coun 1
设置立即触发。 将触发延迟设置为零。 将触发计数设置为 1 或指定更大的数字。
表或<BACKSPACE>键删除前一个字符。退格键被返回显示到主机终端。 注意
仪 ^C (CNTRL C)是 RS-232 中相当于 IEEE-488 DCI(设备清除)的命令,因此输出“1>”后 面跟着回车和换行。 当使用计算机程序控制万用表时时,采用计算机模式。在这种模式下,请求信息通过查
询方式返回,接口消息通过命令方式排队返回。字符不会在主机上回显,禁止使用命令提示
述。
者 0. 下表给出了适用于万用表的规范以及简短的说明。这些规范符合 IEEE-488.2 的要求。
3 IEEE-488.1 文档的附录 C 包含了每个规范的完整描述。
好 8IEEE-488 功能规范
T IEEE-488 子集 爱 D SH1
DRV8832电机驱动芯片及其应用
DRV8832电机驱动芯片及其应用作者:李旭东陆宇炯张彪来源:《科学与财富》2015年第07期摘要:DRV8832是一种针对电池供电的玩具、打印机和其他低电压供电的集成电机驱动芯片,驱动器具有一个H型桥,可驱动一个直流电机或一个单相步进电机的绕组。
文中介绍了该芯片的特点、引脚功能和工作原理。
并给出了一种基于DRV8832和单片机STC11F01的电机控制电路。
关键词:电机;DRV8832;驱动器;单片机中图分类号:TP29 文献标识码:B1 概述DRV8832[1]是美国TI公司生产的电机驱动专用芯片。
用于电池供电的玩具、打印机和其他低电压供电的移动控制的应用中对电机驱动的解决方案。
一片DRV8832中具有一个H型桥,可驱动一个直流电机或一个单相步进电机的绕组。
其工作电压范围为2.75V ~ 6.8V,电流可达1A。
为确保电池有更长的使用寿命并电机转速的恒定,DRV8832内部提供了PWM电压控制模式,可以通过输入脚编程控制电压。
并提供一个输出的参考电压。
DRV8832芯片还提供完善的保护措施,其中包括过流保护、短路保护、欠压保护和过热保护等功能。
同时,DRV8832具备电流限制功能用于电机启动或堵转时对电机的控制,此外,也可通过故障输出管脚向控制器发出一个故障信号。
2 引脚功能和主要特点2.1 引脚功能DRV8832有两种封装形式。
一种是10脚的MSOP封装DRV8832D GQ,另一种是10引脚的WSON封装DRV8832DRC,两种封装的电特性完全相同,图1为DRV8832的引脚排列图。
各引脚说明如下:Fig.1 DRV8832 pins diagram引脚1、3(OUT2、OUT1):两输出引脚,其中每一个分别与电机绕组的一端相连;引脚2(ISENSE):电流取样电阻输入端,用于检测负载电流;引脚4(VCC):电源端,通常接0.1μF旁路电容;引脚5(GND):接地端;引脚6(FAULTn):故障信号端;引脚7(VSET):电压设置输入端,用于控制输出电压;引脚8(VREF):参考电压输出端,用于输出参考电压;引脚9、10(IN1、IN2):输入控制端1、2,用于逻辑控制H电桥的输出1、2。
MB90F884APMC中文资料
DS07-13743-2EFUJITSU SEMICONDUCTORDATA SHEETCopyright©2006-2007 FUJITSU LIMITED All rights reserved“Check Sheet” is seen at the following support pageURL : /global/services/microelectronics/product/micom/support/index.html“Check Sheet” lists the minimal requirement items to be checked to prevent problems beforehand in system development.Be sure to refer to the “Check Sheet” for the latest cautions on development.16-Bit Proprietary MicrocontrollerCMOSF 2MC-16LX MB90880 SeriesMB90F882(S)/F883(S)/F883A(S)/F884(S)/F884A(S)MB90882(S)/883(S)/884(S)/V880(A)-101/-102■DESCRIPTIONThe MB90880 series is a general-purpose 16-bit microcontroller, designed by F ujitsu, for process control of devices such as consumer appliances, which require high-speed real-time processing capabilities.The instruction set of the F 2MC-16LX CPU core retains the same AT architecture as the F 2MC*1 family, with further refinements including high-level language instructions, an expanded addressing mode, enhanced multiplier-divider instructions and bit processing. In addition, a 32-bit accumulator is built in to enable long word processing. As its peripheral resources, the MB90880 series has a 16-bit PPG, multi-function serial interface (software switch over enabled for SIO, UART and I 2C*2) , 10-bit A/D converter, 16-bit I/O timer, 8/16-bit up-down counter, base timer (software switch over enabled for 16-bit reload timer, PWC timer, PPG timer and PWM timer) , DTP / external interrupt and chip select pins.*1 : F 2MC is the abbreviation of FUJITSU Flexible Microcontroller.*2 : Purchase of Fujitsu I 2C components conveys a license under the Philips I 2C Patent Rights to use, thesecomponents in an I 2C system provided that the system conforms to the I 2C Standard Specification as defined by Philips.MB90880 Series2■FEATURES•ClockMinimum instruction execution time : 30.3 ns / 4.125 MHz source oscillation × eight times(in internal operation : 33 MHz/3.3 V ± 0.3 V)PLL clock multiplication system•Maximum memory space16 Mbytes•Instruction set optimized for control applicationsSupported data types : bit, byte, word and long wordStandard addressing modes : 23 typesEnhanced high-precision calculation realized by 32-bit accumulatorSigned multiplication/division instructions and extended RETI instruction functions•Instruction set supporting high-level language (C language) and multi-task operationsIntroduction of system stack pointerSymmetrical instruction set and barrel shift instructions•Improved execution speed4-byte queue•Powerful interrupt functionsEight priority levels programmable; External interrupts : 24•Data transfer functions (µDMAC)Up to 16 channels•Built-in ROMFlash ROM : 256, 384 and 512 Kbytes; MASK ROM : 256, 384 and 512 Kbytes•Built-in RAMFlash RAM : 16, 24 and 30 Kbytes; MASK RAM : 16, 24 and 30 Kbytes•General-purpose portsDual clock product : up to 81 channels; Single clock product : up to 83 channels•A/D converterRC successive approximation conversion type : 20 channels (Resolution : 8 or 10 bits)•Multi-function serial interface7 channels (software switchable between for SIO, UART and I2C)•16-bit PPG8 channels•8/16-bit up-down counter/timerEvent input pins : 68-bit up-down counters : 28-bit reload/compare registers : 2•Base timer4 channels (software switchable between 16-bit reload timer, PWC timer, PPG timer, and PWM timer)•16-bit I/O timerInput capture × 2 channels, output compare × 6 channels, free run timer × 1 channel•Built-in dual clock generator•Low power consumption modesStop mode, sleep mode, CPU intermittent operation mode, watch timer, time base timer mode•PackageQFP-100/LQFP-100•ProcessCMOS technology•Power supply voltage3V : Single power supply operationMB90880 Series3■PRODUCT LINEUP(Continued)ItemName MB90882 (S) MB90883 (S) MB90884 (S) MB90F882 (S)MB90F883 (S) /MB90F883A (S) MB90F884 (S) /MB90F884A (S) Class MASK ROM productFlash memory productROM size 256 Kbytes 384 Kbytes 512 Kbytes 256 Kbytes 384 Kbytes 512 Kbytes RAM size16 Kbytes24 Kbytes30 Kbytes16 Kbytes24 Kbytes30 KbytesCPU functionsNumber of instructions Instruction bit length Instruction length Data bit lengthMinimum execution time : 351: 8 bits, 16 bits : 1 to 7 bytes: 1 bit, 8 bits, 16 bits: 30.3 ns (machine clock : 33 MHz)The maximum operating frequency of MB90F883(S) and MB90F884(S) is 25 MHz.PortsGeneral-purpose I/O ports : up to 81 for dual clock model, up to 83 for single clock model General-purpose I/O ports (CMOS output)Multi-function serial interface 7 channels (software switchable between SIO, UART & I 2C) 16-bit PPG timer8 channels8/16-bit up-down counter/timer Event input pins : 6, 8-bit up-down counters : 28-bit reload/compare registers : 216-bit I/O timer16-bitfree run timerNumber of channels : 1Overflow interruptOutputcompare(OCU) Number of channels : 6Pin input source : Match signal of compare registerInput capture (ICU)Number of channels : 2Rewriting register by pin input (rising, falling or both edges) DTP/external interrupt circuit External interrupt pins : 24 channels (edge/level support)Base timer4 channels(software switchable between 16-bit reload timer, PWC timer, PPG timer, and PWM timer) In MB90F883(S) and MB90F884(S), P24/TIO0, P25/TIO1, P26/TIO2, and P27/TIO3cannot be used as input function.Time base timer18-bit counterInterrupt interval : 1.0 ms, 4.1 ms, 16.4 ms, 131.1 ms (source oscillation : 4 MHz) A/D converterConversion accuracy : 8 or 10 bits can be switchedSingle conversion mode (Selected channel converted only once) Scan conversion mode (Multiple successive channels converted)Successive conversion mode (Selected channel converted repeatedly)Stop conversion mode (Selected channel converted and stopped repeatedly) Watchdog timerReset generation interval : 3.58 ms, 14.33 ms, 57.23ms, 458.75 ms(source oscillation : 4 MHz, minimum value)MB90880 Series4(Continued)ItemNameMB90882 (S) MB90883 (S) MB90884 (S) MB90F882 (S)MB90F883 (S) /MB90F883A (S)MB90F884 (S) /MB90F884A (S) Low powerconsumption(standby)modesSleep, stop, CPU intermittent operation, watch timer, time base timerFlash memory⎯Flash security/ write-protect feature(not available in MB90F883(S), MB90F884(S),MB90F883A(S), and MB90F884A(S))Process CMOS technologyMB90880 Series5MB90880 Series6MB90880 Series7■PIN DESCRIPTIONS(Continued)Pin no.Pin name I/O circuit type*3FunctionLQFP *1QFP *213P26DGeneral-purpose I/O portA22In multiplex mode, it serves as higher address output pin (A22) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A22) when corresponding bit in external address output control register (HACR) is set to "0".TIO2Base timer I/O pin (ch.2) 24P27DGeneral-purpose I/O portA23In multiplex mode, it serves as higher address output pin (A23) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A23) when corresponding bit in external address output control register (HACR) is set to "0".TIO3Base timer I/O pin (ch.3) 35P30EGeneral-purpose I/O port A00Serves as an external address pin in non-multiplex mode.ZIN08/16-bit up-down counter/timer input pin (ch.0) UI1Multi-function serial input pin 46P31EGeneral-purpose I/O portA01Serves as an external address pin in non-multiplex mode.AIN08/16-bit up-down counter/timer input pin (ch.0) UO1/ (SDA1) Multi-function serial output pin 57P32EGeneral-purpose I/O portA02Serves as an external address pin in non-multiplex mode.BIN08/16-bit up-down counter/timer input pin (ch.0) UCK1/ (SCL1) Multi-function serial clock I/O pin 68P33EGeneral-purpose I/O port A03Serves as an external address pin in non-multiplex mode.UI2Multi-function serial input pin 79P34EGeneral-purpose I/O port A04Serves as an external address pin in non-multiplex mode.UO2/ (SDA2)Multi-function serial output pinMB90880 Series8(Continued) Pin no.PinnameI/Ocircuittype*3FunctionLQFP *1QFP *2810P35EGeneral-purpose I/O portA05Serves as an external address pin in non-multiplex mode.ZIN18/16-bit up-down counter/timer input pin (ch.1)UCK2/(SCL2) Multi-function serial clock I/O pin911P36DGeneral-purpose I/O portA06Serves as an external address pin in non-multiplex mode.AIN18/16-bit up-down counter/timer input pin (ch.1)IRQ8External interrupt input pin1012P37DGeneral-purpose I/O portA07Serves as an external address pin in non-multiplex mode.BIN18/16-bit up-down counter/timer input pin (ch.1)IRQ9External interrupt input pin1113P40A/DGeneral-purpose I/O portA08Serves as an external address pin in non-multiplex mode.X0A32 kHz oscillator connecting pin1214P41A/DGeneral-purpose I/O portA09Serves as an external address pin in non-multiplex mode.X1A32 kHz oscillator connecting pin1315VCC-Power supply pin1416VSS-Power supply pin (GND)1517C-Regulator stabilization capacity connecting pin1618P42EGeneral-purpose I/O portA10Serves as an external address pin in non-multiplex mode.UI3Multi-function serial input pin1719P43EGeneral-purpose I/O portA11Serves as an external address pin in non-multiplex mode.UO3/(SDA3) Multi-function serial output pin1820P44EGeneral-purpose I/O portA12Serves as an external address pin in non-multiplex mode.UCK3/(SCL3) Multi-function serial clock I/O pin1921P45EGeneral-purpose I/O portA13Serves as an external address pin in non-multiplex mode.UI4Multi-function serial input pinMB90880 Series9(Continued)Pin no.Pin name I/O circuit type*3FunctionLQFP *1QFP *22022P46EGeneral-purpose I/O port A14Serves as an external address pin in non-multiplex mode.UO4/ (SDA4) Multi-function serial output pin 2123P47EGeneral-purpose I/O portA15Serves as an external address pin in non-multiplex mode.UCK4/ (SCL4) Multi-function serial clock I/O pin 2224P90H General-purpose I/O portCS0Chip select 0AN8Analog input pin2325P91H General-purpose I/O portCS1Chip select 1AN9Analog input pin2426P92H General-purpose I/O portCS2Chip select 2AN10Analog input pin2527P93H General-purpose I/O portCS3Chip select 3AN11Analog input pin2628P94HGeneral-purpose I/O port AN12Analog input pin2729P95KGeneral-purpose I/O port AN13Analog input pin(UI3)Multi-function serial input pin (when set by P9FSR register) 2830P96KGeneral-purpose I/O port AN14Analog input pin(UO3)/ (SDA3) Multi-function serial output pin (when set by P9FSR register) 2931P97KGeneral-purpose I/O portAN15Analog input pin(UCK3)/ (SCL3)Multi-function serial clock I/O pin (when set by P9FSR register)3032AVCC -A/D converter power supply pin3133AVRH -A/D converter external reference power supply pin 3234P70HGeneral-purpose I/O port AN16Analog input pinMB90880 Series10(Continued) Pin no.PinnameI/Ocircuittype*3FunctionLQFP *1QFP *23335AVSS-A/D converter power supply pin3436P60HGeneral-purpose I/O portAN0Analog input pin3537P61HGeneral-purpose I/O portAN1Analog input pin3638P62HGeneral-purpose I/O portAN2Analog input pin3739P63HGeneral-purpose I/O portAN3Analog input pin3840P64HGeneral-purpose I/O portAN4Analog input pin3941P65HGeneral-purpose I/O portAN5Analog input pin4042P66HGeneral-purpose I/O portAN6Analog input pin4143P67HGeneral-purpose I/O portAN7Analog input pin4244VSS-Power supply pin (GND)4345P71KGeneral-purpose I/O portIRQ10External interrupt input pinAN17Analog input pin(UI4)Multi-function serial input pin (when set by P7FSR register) 4446P72KGeneral-purpose I/O portIRQ11External interrupt input pinAN18Analog input pin(UO4)/(SDA4) Multi-function serial output pin (when set by P7FSR register) 4547P73KGeneral-purpose I/O portIRQ12External interrupt input pinAN19Analog input pin(UCK4)/(SCL4) Multi-function serial clock I/O pin (when set by F7FSR register) 4648P74GGeneral-purpose I/O portIRQ13External interrupt input pinUI5Multi-function serial input pin11(Continued)Pin no.Pin name I/O circuit type*3FunctionLQFP *1QFP *24749P75GGeneral-purpose I/O port UO5/ (SDA5) Multi-function serial output pin 4850P76GGeneral-purpose I/O portIRQ14External interrupt input pin UCK5/ (SCL5)Multi-function serial clock I/O pin4951MD2L Operation mode specification input pin 5052MD1L Operation mode specification input pin 5153MD0L Operation mode specification input pin 5254RST B Reset input pin5355P80GGeneral-purpose I/O port IRQ15External interrupt input pin UI6Multi-function serial input pin 5456P81GGeneral-purpose I/O portUO6/ (SDA6) Multi-function serial output pin 5557P82GGeneral-purpose I/O portIRQ16External interrupt input pin UCK6/ (SCL6)Multi-function serial clock I/O pin5658P83I General-purpose I/O port IRQ17External interrupt input pin 5759P84GGeneral-purpose I/O port UI0Multi-function serial input pin 5860P85GGeneral-purpose I/O portUO0/ (SDA0) Multi-function serial output pin 5961P86GGeneral-purpose I/O portUCK0/ (SCL0) Multi-function serial clock I/O pin 6062P87I General-purpose I/O portIRQ18External interrupt input pinADTG External trigger input pin, when A/D converter is used.6163PA0J General-purpose I/O portIRQ19External interrupt input pin(PPG4)PPG timer output pin (when set by P AFSR register)Pin no.PinnameI/Ocircuittype*3FunctionLQFP *1QFP *26264PA1JGeneral-purpose I/O portIRQ20External interrupt input pin(PPG5)PPG timer output pin (when set by P AFSR register)6365DVCC-P A port power supply pin6466DVSS-P A port power supply pin (GND)6567PA2JGeneral-purpose I/O portIRQ21External interrupt input pin(PPG6)PPG timer output pin (when set by P AFSR register)6668PA3JGeneral-purpose I/O portIRQ22External interrupt input pin(PPG7)PPG timer output pin (when set by P AFSR register)6769P50FGeneral-purpose I/O portALEServes as address latch enable signal (ALE) pin in external busmode.6870P51FGeneral-purpose I/O portRD Serves as read strobe output (RD) pin in external bus mode.6971P52FGeneral-purpose I/O portWRLServes as lower data write strobe output (WRL) pin in external busmode, and serves as a general-purpose I/O port when WRE bit inEPCR register is "0".7072P53FGeneral-purpose I/O portWRHServes as higher data write strobe output (WRH) pin in external busmode with 16-bit bus width, and serves as a general-purpose I/Oport when WRE bit in EPCR register is "0".IRQ23External interrupt input pin7173P54FGeneral-purpose I/O portHRQServes as hold request input (HRQ) pin in external bus mode, andserves as a general-purpose I/O port when HDE bit in EPCR registeris "0".PPG4PPG timer output pin7274P55FGeneral-purpose I/O portHAKServes as hold acknowledge output (HAK) pin in external bus mode,and serves as a general-purpose I/O port when HDE bit in EPCRregister is "0".PPG5PPG timer output pin1213(Continued)Pin no.Pin name I/O circuit type*3FunctionLQFP *1QFP *27375P56FGeneral-purpose I/O port RDY Serves as external ready input (RDY) pin in external bus mode, and serves as a general-purpose I/O port when RYE bit in EPCR register is "0".PPG6PPG timer output pin 7476P57FGeneral-purpose I/O portCLK Serves as machine cycle clock output (CLK) pin in external bus mode, and serves as a general-purpose I/O port when CKE bit in EPCR register is "0".PPG7PPG timer output pin 7577P00CGeneral-purpose I/O portAD00/D00In multiplex mode, it serves as lower external address/data bus I/O pin.Serves as lower external data bus output pin in non-multiplex mode.IRQ0External interrupt input pin 7678P01CGeneral-purpose I/O portAD01/D01Serves as an external address/lower data bus I/O pin in multiplex mode.Serves as a lower external data bus output pin in non-multiplex mode.IRQ1External interrupt input pin 7779P02CGeneral-purpose I/O portAD02/D02Serves as an external address/lower data bus I/O pin in multiplex mode.Serves as a lower external data bus output pin in non-multiplex mode.IRQ2External interrupt input pin 7880P03CGeneral-purpose I/O portAD03/D03Serves as an external address/lower data bus I/O pin in multiplex mode.Serves as a lower external data bus output pin in non-multiplex mode.IRQ3External interrupt input pin 7981P04CGeneral-purpose I/O portAD04/D04In multiplex mode, it serves as lower external address/data bus I/O pin.Serves as a lower external data bus output pin in non-multiplex mode.IRQ4External interrupt input pin14(Continued)Pin no.Pin name I/O circuit type*3FunctionLQFP *1QFP *28082P05CGeneral-purpose I/O portAD05/D05In multiplex mode, it serves as lower external address/data bus I/O pin.Serves as a lower external data bus output pin in non-multiplex mode.IRQ5External interrupt input pin 8183P06CGeneral-purpose I/O portAD06/D06In multiplex mode, it serves as lower external address/data bus I/O pin.Serves as a lower external data bus output pin in non-multiplex mode.IRQ6External interrupt input pin 8284P07CGeneral-purpose I/O portAD07/D07In multiplex mode, it serves as lower external address/data bus I/O pin.Serves as a lower external data bus output pin in non-multiplex mode.IRQ7External interrupt input pin 8385P10CGeneral-purpose I/O portAD08/D08In multiplex mode, it serves as higher external address/data bus I/O pin.In non-multiplex mode, it serves as higher external data output pin.OUT0Output compare event output pin 8486P11CGeneral-purpose I/O portAD09/D09In multiplex mode, it serves as higher external address/data bus I/O pin.In non-multiplex mode, it serves as higher external data output pin.OUT1Output compare event output pin 8587P12CGeneral-purpose I/O portAD10/D10In multiplex mode, it serves as higher external address/data bus I/O pin.In non-multiplex mode, it serves as higher external data output pin.OUT2Output compare event output pin 8688P13CGeneral-purpose I/O portAD11/D11In multiplex mode, it serves as higher external address/data bus I/O pin.In non-multiplex mode, it serves as higher external data output pin.OUT3Output compare event output pin15(Continued)Pin no.Pin name I/O circuit type*3FunctionLQFP *1QFP *28789P14CGeneral-purpose I/O port AD12/D12In non-multiplex mode, it serves as higher external data output pin.OUT4Output compare event output pin8890VCC -Power supply pin 8991VSS -Power supply pin (GND) 9092X1A Main oscillator connecting pin 9193X0AMain oscillator connecting pin 9294P15CGeneral-purpose I/O portAD13/D13In multiplex mode, it serves as higher external address/data bus I/O pin.In non-multiplex mode, it serves as higher external data output pin.OUT5Output compare event output pin 9395P16CGeneral-purpose I/O portAD14/D14In multiplex mode, it serves as higher external address/data bus I/O pin.In non-multiplex mode, it serves as higher external data output pin.IN0T rigger input pin for input capture ch.09496P17CGeneral-purpose I/O portAD15/D15In multiplex mode, it serves as higher external address/data bus I/O pin.In non-multiplex mode, it serves as higher external data output pin.IN1T rigger input pin for input capture ch.19597P20DGeneral-purpose I/O portA16In multiplex mode, it serves as higher address output pin (A16) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A16) when corresponding bit in external address output control register (HACR) is set to "0".PPG0PPG timer output pin 9698P21DGeneral-purpose I/O portA17In multiplex mode, it serves as higher address output pin (A17) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A17) when corresponding bit in external address output control register (HACR) is set to "0".PPG1PPG timer output pin16(Continued)*1 : LQFP : FPT-100P-M20*2 : QFP : FPT-100P-M06*3 : For the I/O circuit type, refer to “■ I/O CIRCUIT TYPE”.Pin no.Pin name I/O circuit type*3FunctionLQFP *1QFP *29799P22DGeneral-purpose I/O portA18In multiplex mode, it serves as higher address output pin (A18) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A18) when corresponding bit in external address output control register (HACR) is set to "0".PPG2PPG timer output pin 98100P23DGeneral-purpose I/O portA19In multiplex mode, it serves as higher address output pin (A19) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A19) when corresponding bit in external address output control register (HACR) is set to "0".PPG3PPG timer output pin 991P24DGeneral-purpose I/O portA20In multiplex mode, it serves as higher address output pin (A20) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A20) when corresponding bit in external address output control register (HACR) is set to "0".TIO0Base timer I/O pin (ch.0) 1002P25DGeneral-purpose I/O portA21In multiplex mode, it serves as higher address output pin (A21) when corresponding bit in external address output control register (HACR) is set to "0".In non-multiplex mode, it serves as higher address output pin (A21) when corresponding bit in external address output control register (HACR) is set to "0".TIO1Base timer I/O pin (ch.1)■I/O CIRCUIT TYPE(Continued)171819■HANDLING DEVICES1.Maximum rated voltages for the prevention of latch-upBe cautious not to exceed the absolute maximum rating.CMOS ICs may cause latch-up, when a voltage higher than V CC or lower than V SS is applied to input or output pins other than medium-to-high resistant pins, or when a voltage exceeding the rating is applied between VCC and VSS pins.If latch-up occurs, the power supply current increases rapidly, sometimes resulting in thermal breakdown of the device. Take the utmost care not to let it occur.Likewise, care must be taken not to allow the analog power supply (AV CC, AVRH) and analog input to exceed the digital power supply (V CC) when turning on or off any analog system.2.Handling unused pinsLeaving unused input pins open may cause a malfunction or latch-up which leads to fatal damage to the device.Therefore, they must be pulled up or down through at least 2 kΩ resistance. Also, any unused I/O pin should be left open in the output state, or set to the input state and handled in the same way as an unused input pin.3.Notes on using external clockEven when an external clock is being used, oscillation stabilization wait time is required for a power-on reset or release from sub clock mode or stop mode. Note that 25 MHz is the upper limit on the external clock that can4.Handling power supply pins (V CC/V SS)When multiple VCC and VSS pins supply pins are used, all the power supply pins must be connected to external power and ground lines due to the device design, to reduce latch-up and unwanted radiation, prevent abnormal operation of strobe signals caused by the rise in the ground level and to conform to the total output current rating.Make sure to connect the VCC and VSS pins of this device via lowest impedance to power lines. It is recommended that a bypass capacitor of around 0.1 µF be placed between the VCC and VSS pins near the device.5.Crystal oscillator circuitNoises around X0/X1 or X0A/X1A pins may cause abnormal operations. It is strongly recommended to provide bypass capacitors via shortest distance from X0/X1, X0A/X1A pins, crystal oscillator (or ceramic oscillator) and ground lines and also not to allow the lines of the oscillation circuit to cross the lines of other circuits. This will ensure stable operations of the printed circuit boards. Please ask each crystal maker to evaluate the oscillational characteristics of the crystal and this device.6.Notes on PLL clock mode operationIf an oscillator comes off or clock input stops during PLL clock mode operation, this microcontroller may continue its operation using a free-running frequency from a self-excited oscillation circuit within PLL. This is not a guaranteed operation.207.Power-on and power-off sequence of A/D converter and analog inputTurn on the A/D converters (AV CC, AVRH) and analog inputs (AN0 to AN19) after turning on the digital power supply (V CC) .During power-off, turn off the digital power supply (V CC) after turning off the A/D converters and analog inputs (AN0 to AN19) .In this case, make sure that AVRH does not exceed AV CC during the power-on/power-off procedure.Also make sure that the input voltage does not exceed AV CC when a pin which is also used as an analog input is used as an input port.8.Handling power supply pins on A/D converter-mounted modelsMake sure to achieve "AV CC= AVRH = V CC" and "AV SS= V SS" in connecting the circuits, even when not using the A/D converter function.9.Note on power-upTo prevent the internal regulator from malfunctioning, maintain the voltage rise time at 50 µs (between 0.2V and2.7V) or more during power-up.10.Stabilization of power supplyEven when the V CC power supply voltage is within the specified operating range, it may still cause the device to malfunction, if the power supply changes rapidly. For stabilization reference, it is recommended to control the supply voltage so that V CC ripple variations (P-P values) at commercial frequencies (50/60 Hz) fall below 10% of the standard V CC supply voltage and the coefficient of fluctuation does not exceed 0.1 V/ms at instantaneous power switching.11.Writing to Flash memoryFor serial writing to Flash memory, always make sure that the operating voltage V CC is between 3.13V and 3.6V.For normal writing to Flash memory, always make sure that the operating voltage V CC is between 3.0V and 3.6V.12.P90/CS0 pinsP90/CS0 pins output “L” during writing Flash serial. Do not input from external.13.Note of MB90F883 (S) , MB90F884 (S)•Maximum operating frequency is 25 MHz.•The base timer cannot use P24/TIO0, P25/TIO1, P26/TIO2, and P27/TIO3 as input function.•MB90F883(S) and MB90F884(S) do not contain the flash security feature and write-protect feature.。
MBI6658 Datasheet恒流驱动规格书
**量测时,PCB面积为IC的4倍大,且量测实测热阻时无外加散热片;参考JEDEC JESD51-3标准。
***此为最大限定范围值,并非IC工作时温度,越接近此最大范围值操作,IC的寿命越短、可靠度越低;超过此最大限
定范围工作时,将会影响IC运作并造成毁损,因此建议的IC工作温度(Topr)在125°C以内。
代表符号
条件
Vccs IDD IOUT VSU UVLO
VSEN,vref VSEN,hys
VIN=12V VIN=12V
Rds(ON) TR,SW TF,SW
Fsw Tmin-on Tmin-off
TSD TSDHYS
(IOCP)
VIH,DIM VIL,DIM
VIN=12V VIN=12V
VIN=12V VIN=12V
2.100 A 2.050 A 2.000 A 1.950 A 1.900 A 1.850 A 1.800 A
0V
Load Regulation @2A, L=47uH, COUT=0.1uF
5V
10V
15V
20V
25V
Output Voltage (VLED)
12.0 V 24.0 V 30.0 V
LED*1
LED*2
LED*3
LED*4 LED*5
LED*6
LED*7
LED*8
LED*9
5V
10V
15V
20V
25V
30V
35V
Input Voltage (VIN)
图二 效率 vs. 输入端电压@ IOUT = 1A
Efficiency
100.00% 95.00% 90.00% 85.00% 80.00% 75.00% 70.00% 65.00% 60.00% 55.00% 50.00% 0V
DRV8432DKDR;中文规格书,Datasheet资料
DRV8412DRV8432SLES242D –DECEMBER 2009–REVISED JULY 2011Dual Full Bridge PWM Motor DriverCheck for Samples:DRV8412,DRV8432The DRV8412/32require two power supplies,one at FEATURES12V for GVDD and VDD,and another up to 50V for •High-Efficiency Power Stage (up to 97%)with PVDD.The DRV8412/32can operate at up to Low R DS(on)MOSFETs (110m Ωat T J =25°C)500-kHz switching frequency while still maintain •Operating Supply Voltage up to 52Vprecise control and high efficiency.They also have an innovative protection system safeguarding the device •DRV8412(power pad down):up to 2x 3A against a wide range of fault conditions that could Continuous Output Current (2x 6A Peak)in damage the system.These safeguards are Dual Full Bridge Mode or 6A Continuous short-circuit protection,overcurrent protection,Current in Parallel Mode (12A Peak)undervoltage protection,and two-stage thermal •DRV8432(power pad up):up to 2x 7Aprotection.The DRV8412/32have a current-limiting Continuous Output Current (2x 12A Peak)in circuit that prevents device shutdown during load transients such as motor start-up.A programmable Dual Full Bridge Mode or 14A Continuous overcurrent detector allows adjustable current limit Current in Parallel Mode (24A Peak)and protection level to meet different motor •PWM Operating Frequency up to 500kHz requirements.•Integrated Self-Protection Circuits Including The DRV8412/32have unique independent supply Undervoltage,Overtemperature,Overload,and and ground pins for each half bridge,which makes it Short Circuitpossible to provide current measurement through •Programmable Cycle-by-Cycle Current Limit external shunt resistor and support multiple motors Protectionwith different power supply voltage requirements.•Independent Supply and Ground Pins for Each Simplified Application DiagramHalf Bridge•Intelligent Gate Drive and Cross Conduction Prevention•No External Snubber or Schottky Diode is RequiredAPPLICATIONS•Brushed DC and Stepper Motors•Three Phase Permanent Magnet Synchronous Motors•Robotic and Haptic Control System •Actuators and Pumps •Precision Instruments •TEC Drivers•LED Lighting DriversDESCRIPTIONThe DRV8412/32are high performance,integrated dual full bridge motor drivers with an advanced protection system.Because of the low R DS(on)of the H-Bridge MOSFETs and intelligent gate drive design,the efficiency of these motor drivers can be up to 97%,which enables the use of smaller power supplies and heatsinks,and are good candidates for energy efficient applications.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.DRV8412DRV8432SLES242D–DECEMBER2009–REVISED This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled with appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.ABSOLUTE MAXIMUM RATINGSOver operating free-air temperature range unless otherwise noted(1)VALUEVDD to GND–0.3V to13.2VGVDD_X to GND–0.3V to13.2VPVDD_X to GND_X(2)–0.3V to70VOUT_X to GND_X(2)–0.3V to70VBST_X to GND_X(2)–0.3V to80V Transient peak output current(per pin),pulse width limited by internal over-current protection circuit.16ATransient peak output current for latch shut down(per pin)20AVREG to AGND–0.3V to4.2VGND_X to GND–0.3V to0.3VGND to AGND–0.3V to0.3VPWM_X to GND–0.3V to4.2VOC_ADJ,M1,M2,M3to AGND–0.3V to4.2VRESET_X,FAULT,OTW to GND–0.3V to7V Maximum continuous sink current(FAULT,OTW)9mAMaximum operating junction temperature range,T J-40°C to150°CStorage temperature,T STG–55°C to150°C(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)These voltages represent the dc voltage+peak ac waveform measured at the terminal of the device in all conditions. RECOMMENDED OPERATING CONDITIONSMIN NOM MAX UNIT PVDD_X Half bridge X(A,B,C,or D)DC supply voltage05052.5V GVDD_X Supply for logic regulators and gate-drive circuitry10.81213.2V VDD Digital regulator supply voltage10.81213.2VI O_PULSE Pulsed peak current per output pin(could be limited by thermal)15AI O Continuous current per output pin(DRV8432)7AF SW PWM switching frequency500kHzR OCP_CBC OC programming resistor range in cycle-by-cycle current limit modes24200kΩR OCP_OCL OC programming resistor range in OC latching shutdown modes22200kΩC BST Bootstrap capacitor range33220nFT ON_MIN Minimum PWM pulse duration,low side50nST A Operating ambient temperature-4085(1)°C (1)Depending on power dissipation and heat-sinking,the DRV8412/32can support ambient temperature in excess of85°C.Refer to thepackage heat dissipation ratings table and package power deratings table.DRV8412DRV8432 SLES242D–DECEMBER2009–REVISED JULY2011 PACKAGE HEAT DISSIPATION RATINGSPARAMETER DRV8412DRV8432RθJC,junction-to-case(power pad/heat slug)thermal1.1°C/W0.9°C/WresistanceThis device is not intended to be used without aRθJA,junction-to-ambient thermal resistance25°C/W heatsink.Therefore,RθJA is not specified.See theThermal Information section.Exposed power pad/heat slug area34mm280mm2PACKAGE POWER DERATINGS(DRV8412)(1)DERATINGT A=25°CFACTOR T A=70°C POWER T A=85°C POWER T A=125°C POWER PACKAGE POWERABOVE T A=RATING RATING RATINGRATING25°C44-PIN TSSOP(DDW) 5.0W40.0mW/°C 3.2W 2.6W 1.0W(1)Based on EVM board layoutMODE SELECTION PINSMODE PINS OUTPUTDESCRIPTIONCONFIGURATIONM3M2M1Dual full bridges(two PWM inputs each full bridge)or four half bridges with 0002FB or4HBcycle-by-cycle current limitDual full bridges(two PWM inputs each full bridge)or four half bridges with 0012FB or4HBOC latching shutdown(no cycle-by-cycle current limit) 0101PFB Parallel full bridge with cycle-by-cycle current limitDual full bridges(one PWM input each full bridge with complementary PWM 0112FBon second half bridge)with cycle-by-cycle current limit 1x x ReservedDRV8412DDW Package (Top View)123456789101112131415161718363534333231302928272625242322212019GVDD_B FAULT RESET_ABRESET_CDPWM_B PWM_D PWM_C OTW GND PWM_A AGND OC_ADJM3VDD GVDD_CVREG M2M1GVDD_A BST_A PVDD_A OUT_A GND_A GND_B OUT_B PVDD_B BST_B PVDD_C BST_C OUT_C GND_C GND_D OUT_D PVDD_D BST_D GVDD_DDRV8432DKD Package (Top View)DRV8412DRV8432SLES242D –DECEMBER 2009–REVISED JULY 2011DEVICE INFORMATIONPin AssignmentHere are the pinouts for the DRV8412/32:•DRV8412:44-pin TSSOP power pad down DDW package.This package contains a thermal pad that is located on the bottom side of the device for dissipating heat through PCB.•DRV8432:36-pin PSOP3DKD package.This package contains a thick heat slug that is located on the top side of the device for dissipating heat through heatsink.PIN FUNCTIONSPINDESCRIPTIONNAME DRV8412DRV8432FUNCTION(1)AGND 129P Analog groundBST_A 2435P High side bootstrap supply (BST),external capacitor to OUT_A required BST_B 3328P High side bootstrap supply (BST),external capacitor to OUT_B required BST_C 3427P High side bootstrap supply (BST),external capacitor to OUT_C required BST_D 4320P High side bootstrap supply (BST),external capacitor to OUT_D required GND 138P GroundGND_A 2932P Power ground for half-bridge A requires close decoupling capacitor to ground GND_B 3031P Power ground for half-bridge B requires close decoupling capacitor to ground GND_C 3724P Power ground for half-bridge C requires close decoupling capacitor to ground GND_D 3823P Power ground for half-bridge D requires close decoupling capacitor to ground GVDD_A 2336P Gate-drive voltage supply GVDD_B 221P Gate-drive voltage supply GVDD_C 118P Gate-drive voltage supply GVDD_D 4419P Gate-drive voltage supply M1813IMode selection pin(1)I =input,O =output,P =power,T =thermalDRV8412DRV8432 SLES242D–DECEMBER2009–REVISED JULY2011PINDESCRIPTIONNAME DRV8412DRV8432FUNCTION(1)M2912I Mode selection pinM31011I Reserved mode selection pin,AGND connection is recommendedNC3,4,19,20,25,42––No connection pin.Ground connection is recommendedOC_ADJ147O Analog overcurrent programming pin,requires resistor to AGNDOTW212O Overtemperature warning signal,open-drain,active-low.An internal pull-up resistorto VREG(3.3V)is provided on output.Level compliance for5-V logic can beobtained by adding external pull-up resistor to5VOUT_A2833O Output,half-bridge AOUT_B3130O Output,half-bridge BOUT_C3625O Output,half-bridge COUT_D3922O Output,half-bridge DPVDD_A26,2734P Power supply input for half-bridge A requires close decoupling capacitor to ground.PVDD_B3229P Power supply input for half-bridge B requires close decoupling capacitor to gound.PVDD_C3526P Power supply input for half-bridge C requires close decoupling capacitor to ground.PVDD_D40,4121P Power supply input for half-bridge D requires close decoupling capacitor to ground.PWM_A174I Input signal for half-bridge APWM_B156I Input signal for half-bridge BPWM_C714I Input signal for half-bridge CPWM_D516I Input signal for half-bridge DRESET_AB165I Reset signal for half-bridge A and half-bridge B,active-lowRESET_CD615I Reset signal for half-bridge C and half-bridge D,active-lowFAULT183O Fault signal,open-drain,active-low.An internal pull-up resistor to VREG(3.3V)isprovided on output.Level compliance for5-V logic can be obtained by addingexternal pull-up resistor to5VVDD217P Power supply for digital voltage regulator requires capacitor to ground fordecoupling.VREG1110P Digital regulator supply filter pin requires0.1-μF capacitor to AGND.THERMAL PAD-N/A T Solder the exposed thermal pad to the landing pad on the pcb.Connect landingpad to bottom side of pcb through via for better thermal dissipation.HEAT SLUG N/A-T Mount heat sink with thermal interface on top of the heat slug for best thermalperformance.DRV8412DRV8432SLES242D–DECEMBER2009–REVISED SYSTEM BLOCK DIAGRAMDRV8412DRV8432 SLES242D–DECEMBER2009–REVISED JULY2011 ELECTRICAL CHARACTERISTICST A=25°C,PVDD=50V,GVDD=VDD=12V,f Sw=400kHz,unless otherwise noted.All performance is in accordance with recommended operating conditions unless otherwise specified.PARAMETER TEST CONDITIONS MIN TYP MAX UNITInternal Voltage Regulator and Current ConsumptionV REG Voltage regulator,only used as a reference node VDD=12V 2.95 3.3 3.65VIdle,reset mode912mAI VDD VDD supply currentOperating,50%duty cycle10.5Reset mode 1.7 2.5mAI GVDD_X Gate supply current per half-bridgeOperating,50%duty cycle8I PVDD_X Half-bridge X(A,B,C,or D)idle current Reset mode0.71mAOutput StageT J=25°C,GVDD=12V,Includes metallizationMOSFET drain-to-source resistance,low side(LS)110mΩbond wire and pin resistanceR DS(on)T J=25°C,GVDD=12V,Includes metallizationMOSFET drain-to-source resistance,high side(HS)110mΩbond wire and pin resistanceV F Diode forward voltage drop T J=25°C-125°C,I O=5A1Vt R Output rise time Resistive load,I O=5A14nSt F Output fall time Resistive load,I O=5A14nSt PD_ON Propagation delay when FET is on Resistive load,I O=5A38nSt PD_OFF Propagation delay when FET is off Resistive load,I O=5A38nSt DT Dead time between HS and LS FETs Resistive load,I O=5A 5.5nSI/O ProtectionGate supply voltage GVDD_X undervoltageV uvp,G8.5V protection thresholdV uvp,hyst(1)Hysteresis for gate supply undervoltage event0.8VOTW(1)Overtemperature warning115125135°COTW hyst(1)Hysteresis temperature to reset OTW event25°COTSD(1)Overtemperature shut down150°COTE-OTE-OTW overtemperature detect temperature25°C OTW differential(1)differenceHysteresis temperature for FAULT to be releasedOTSD HYST(1)25°C following an OTSD eventI OC Overcurrent limit protection Resistor—programmable,nominal,R OCP=27kΩ9.7ATime from application of short condition to Hi-Z ofI OCT Overcurrent response time250nsaffected FET(s)Internal pulldown resistor at the output of each Connected when RESET_AB or RESET_CD isR PD1kΩhalf-bridge active to provide bootstrap capacitor chargeStatic Digital SpecificationsV IH High-level input voltage PWM_A,PWM_B,PWM_C,PWM_D,M1,M2,M32 3.6VV IH High-level input voltage RESET_AB,RESET_CD2 5.5VPWM_A,PWM_B,PWM_C,PWM_D,M1,M2,M3,V IL Low-level input voltage0.8VRESET_AB,RESET_CDl lkg Input leakage current–100100μAOTW/FAULTInternal pullup resistance,OTW to VREG,FAULT toR INT_PU202635kΩVREGInternal pullup resistor only 2.95 3.3 3.65V OH High-level output voltage VExternal pullup of4.7kΩto5V 4.55V OL Low-level output voltage I O=4mA0.20.4V (1)Specified by design1.100.961.000.981.021.04GVDD –Gate Drive –VN o r m a l i z e d R / (R a t 12 V )D S (o n )D S (o n )11.010.08.010.59.58.59.011.51.061.0812010*********8090E f f i c i e nc y –%f –Switching Frequency –kHz100150200250300350400450500501020301.60.40.60.81.0T –Junction Temperature –CJ oN o r m a l i z e d R / (R a t 25C )D S (o n )D S (o n )o 8040120–406020–201001.21.4140V –Voltage –VI –C u r r e n t –A1.20.8010.60.20.4DRV8412DRV8432SLES242D –DECEMBER 2009–REVISED JULY 2011TYPICAL CHARACTERISTICSEFFICIENCYNORMALIZED R DS(on)vsvsSWITCHING FREQUENCY (DRV8432)GATE DRIVEFigure 1.Figure 2.NORMALIZED R DS(on)vsDRAIN TO SOURCE DIODE FORWARDJUNCTION TEMPERATUREON CHARACTERISTICSFigure 3.Figure 4.0100102030405060708090O u t p u t D u t y C y c l e –%Input Duty Cycle –%906010070402010305080DRV8412DRV8432SLES242D –DECEMBER 2009–REVISED JULY 2011TYPICAL CHARACTERISTICS (continued)OUTPUT DUTY CYCLEvsINPUT DUTY CYCLEFigure 5.DRV8412DRV8432SLES242D–DECEMBER2009–REVISED THEORY OF OPERATIONSpecial attention should be paid to the power-stage POWER SUPPLIES power supply;this includes component selection,PCB placement,and routing.As indicated,each To facilitate system design,the DRV8412/32needhalf-bridge has independent power-stage supply pin only a12-V supply in addition to H-Bridge power(PVDD_X).For optimal electrical performance,EMI supply(PVDD).An internal voltage regulator providescompliance,and system reliability,it is important that suitable voltage levels for the digital and low-voltageeach PVDD_X pin is decoupled with a ceramic analog circuitry.Additionally,the high-side gate drivecapacitor(X5R or better)placed as close as possible requiring a floating voltage supply,which isto each supply pin.It is recommended to follow the accommodated by built-in bootstrap circuitry requiringPCB layout of the DRV8412/32EVM board.external bootstrap capacitor.The12-V supply should be from a low-noise, To provide symmetrical electrical characteristics,thelow-output-impedance voltage regulator.Likewise,the PWM signal path,including gate drive and output50-V power-stage supply is assumed to have low stage,is designed as identical,independentoutput impedance and low noise.The power-supply half-bridges.For this reason,each half-bridge has asequence is not critical as facilitated by the internal separate gate drive supply(GVDD_X),a bootstrappower-on-reset circuit.Moreover,the DRV8412/32 pin(BST_X),and a power-stage supply pinare fully protected against erroneous power-stage (PVDD_X).Furthermore,an additional pin(VDD)isturn-on due to parasitic gate charging.Thus, provided as supply for all common circuits.Specialvoltage-supply ramp rates(dv/dt)are non-critical attention should be paid to place all decouplingwithin the specified voltage range(see the capacitors as close to their associated pins asRecommended Operating Conditions section of this possible.In general,inductance between the powerdata sheet).supply pins and decoupling capacitors must beavoided.Furthermore,decoupling capacitors need ashort ground path back to the device.SYSTEM POWER-UP/POWER-DOWNSEQUENCEFor a properly functioning bootstrap circuit,a smallceramic capacitor(an X5R or better)must be Powering Upconnected from each bootstrap pin(BST_X)to thepower-stage output pin(OUT_X).When the The DRV8412/32do not require a power-up power-stage output is low,the bootstrap capacitor is sequence.The outputs of the H-bridges remain in a charged through an internal diode connected high impedance state until the gate-drive supply between the gate-drive power-supply pin(GVDD_X)voltage GVDD_X and VDD voltage are above the and the bootstrap pin.When the power-stage output undervoltage protection(UVP)voltage threshold(see is high,the bootstrap capacitor potential is shifted the Electrical Characteristics section of this data above the output potential and thus provides a sheet).Although not specifically required,holding suitable voltage supply for the high-side gate driver.and in a low state while In an application with PWM switching frequencies in powering up the device is recommended.This allows the range from10kHz to500kHz,the use of100-nF an internal circuit to charge the external bootstrap ceramic capacitors(X5R or better),size0603or capacitors by enabling a weak pulldown of the 0805,is recommended for the bootstrap supply.half-bridge output.These100-nF capacitors ensure sufficient energystorage,even during minimal PWM duty cycles,to Powering Downkeep the high-side power stage FET fully turned onThe DRV8412/32do not require a power-down during the remaining part of the PWM cycle.In ansequence.The device remains fully operational as application running at a switching frequency lowerlong as the gate-drive supply(GVDD_X)voltage and than10kHz,the bootstrap capacitor might need to beVDD voltage are above the UVP voltage threshold increased in value.(see the Electrical Characteristics section of this datasheet).Although not specifically required,it is a goodpractice to hold RESET_AB and RESET_CD lowduring power down to prevent any unknown stateduring this transition.分销商库存信息: TIDRV8432DKDR。
DRV8840PWP;DRV8840PWPR;中文规格书,Datasheet资料
DRV8840 SLVSAB7B–MAY2010–REVISED MAY2011DC MOTOR DRIVER ICCheck for Samples:DRV8840FEATURES•8.2-V to45-V Operating Supply Voltage Range•Thermally Enhanced Surface Mount Package •Single H-Bridge Current-Control Motor Driver–Drives One DC MotorAPPLICATIONS–Brake Mode•Printers–Five-Bit Winding Current Control Allows Up•Scannersto32Current Levels•Office Automation Machines –Low MOSFET On-Resistance•Gaming Machines•5-A Maximum Drive Current at24V,25°C•Factory Automation•Built-In3.3-V Reference Output•Robotics•Industry-Standard Parallel Digital ControlInterfaceDESCRIPTIONThe DRV8840provides an integrated motor driver solution for printers,scanners,and other automated equipment applications.The device has one H-bridge driver,and is intended to drive one DC motor.The output driver block for each consists of N-channel power MOSFET’s configured as full H-bridges to drive the motor windings.The DRV8840can supply up to5-A peak or3.5-A output current(with proper heatsinking at24V and 25°C).A simple parallel digital control interface is compatible with industry-standard devices.Decay mode is programmable to allow braking or coasting of the motor when disabled.Internal shutdown functions are provided for over current protection,short circuit protection,under voltage lockout and overtemperature.TheDRV8840is available in a28-pin HTSSOP package with PowerPAD™(Eco-friendly:RoHS&no Sb/Br).ORDERING INFORMATION(1)ORDERABLE PART TOP-SIDE T A PACKAGE(2)NUMBER MARKING –40°C to85°C PowerPAD™(HTSSOP)-PWP Reel of2000DRV8840PWPR8840(1)For the most current packaging and ordering information,see the Package Option Addendum at the end of this document,or see the TIweb site at .(2)Package drawings,thermal data,and symbolization are available at /packaging.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PowerPAD is a trademark of Texas Instruments.DRV8840SLVSAB7B–MAY2010–REVISED DEVICE INFORMATIONFunctional Block DiagramDRV8840 SLVSAB7B–MAY2010–REVISED MAY2011Table1.TERMINAL FUNCTIONSEXTERNAL COMPONENTS NAME PIN I/O(1)DESCRIPTIONOR CONNECTIONSPOWER AND GROUNDGND14,28-Device groundConnect to motor supply(8.2-45V).BothVM4,11-Bridge A power supplypins must be connected to same supply.Bypass to GND with a0.47-μF,6.3-V ceramic V3P3OUT15O 3.3-V regulator outputcapacitor.Can be used to supply VREF.CP11IO Charge pump flying capacitor Connect a0.01-μF50-V capacitor betweenCP1and CP2.CP22IO Charge pump flying capacitorConnect a0.1-μF16-V ceramic capacitor to VCP3IO High-side gate drive voltageVM.CONTROLLogic high sets OUT1high,OUT2low. PHASE20I Bridge phase(direction)Internal pulldown.Logic high to enable H-bridge.InternalENBL21I Bridge enablepulldown.I023II124ISets winding current as a percentage ofI225I Current set inputsfull-scale.Internal pulldown.I326II427ILow=brake(slow decay),high=coast(fast DECAY19I Decay(brake)modedecay).Internal pulldown and pullup.Active-low reset input initializes the logic and nRESET16I Reset input disables the H-bridge outputs.Internalpulldown.Logic high to enable device,logic low to enter nSLEEP17I Sleep mode inputlow-power sleep mode.Internal pulldown.Reference voltage for winding current set. VREF12,13I Current set reference input Both pins must be connected together on thePCB.STATUSLogic low when in fault condition(overtemp, nFAULT18OD Faultovercurrent)OUTPUTConnect to current sense resistor.Both pins ISEN6,9IO Bridge ground/Isensemust be connected together on the PCB.Connect to motor winding.Both pins must be OUT15,10O Bridge output1connected together on the PCB.Connect to motor winding.Both pins must be OUT27,8O Bridge output2connected together on the PCB.(1)Directions:I=input,O=output,OZ=tri-state output,OD=open-drain output,IO=input/outputGND I4I3I2I1I0NC ENBL PHASE DECAY nFAULT nSLEEP nRESET V3P3OUTVREF GNDVM VREF ISEN OUT1OUT2OUT2OUT1ISEN VCP VM CP1CP2PWP PACKAGE (TOP VIEW)DRV8840SLVSAB7B –MAY 2010–REVISED MAY 2011ABSOLUTE MAXIMUM RATINGSover operating free-air temperature range (unless otherwise noted)(1)(2)VALUE UNIT VMx Power supply voltage range –0.3to 47V Digital pin voltage range –0.5to 7V VREFInput voltage –0.3to 4V ISENSEx pin voltage–0.3to 0.8V Peak motor drive output current,t <1μS Internally limitedA Continuous motor drive output current (3)5A Continuous total power dissipationSee Dissipation Ratings tableT J Operating virtual junction temperature range –40to 150°C T A Operating ambient temperature range –40to 85°C T stg Storage temperature range–60to 150°C(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute –maximum –rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to network ground terminal.(3)Power dissipation and thermal limits must be observed.DRV8840 SLVSAB7B–MAY2010–REVISED MAY2011THERMAL INFORMATIONDRV8840THERMAL METRIC(1)PWP UNITS28PINSθJA Junction-to-ambient thermal resistance(2)31.6θJCtop Junction-to-case(top)thermal resistance(3)15.9θJB Junction-to-board thermal resistance(4) 5.6°C/WψJT Junction-to-top characterization parameter(5)0.2ψJB Junction-to-board characterization parameter(6) 5.5θJCbot Junction-to-case(bottom)thermal resistance(7) 1.4(1)For more information about traditional and new thermal metrics,see the IC Package Thermal Metrics application report,SPRA953.(2)The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard,high-K board,asspecified in JESD51-7,in an environment described in JESD51-2a.(3)The junction-to-case(top)thermal resistance is obtained by simulating a cold plate test on the package top.No specificJEDEC-standard test exists,but a close description can be found in the ANSI SEMI standard G30-88.(4)The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCBtemperature,as described in JESD51-8.(5)The junction-to-top characterization parameter,ψJT,estimates the junction temperature of a device in a real system and is extractedfrom the simulation data for obtainingθJA,using a procedure described in JESD51-2a(sections6and7).(6)The junction-to-board characterization parameter,ψJB,estimates the junction temperature of a device in a real system and is extractedfrom the simulation data for obtainingθJA,using a procedure described in JESD51-2a(sections6and7).(7)The junction-to-case(bottom)thermal resistance is obtained by simulating a cold plate test on the exposed(power)pad.No specificJEDEC standard test exists,but a close description can be found in the ANSI SEMI standard G30-88.RECOMMENDED OPERATING CONDITIONSover operating free-air temperature range(unless otherwise noted)MIN NOM MAX UNITV M Motor power supply voltage range(1)8.245VV REF VREF input voltage(2)1 3.5VI V3P3V3P3OUT load current01mAf PWM Externally applied PWM frequency0100kHz(1)All V M pins must be connected to the same supply voltage.(2)Operational at VREF between0V and1V,but accuracy is degraded.DRV8840SLVSAB7B–MAY2010–REVISED ELECTRICAL CHARACTERISTICSover operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLIESI VM VM operating supply current V M=24V,f PWM<50kHz58mAI VMQ VM sleep mode supply current V M=24V1020μAV UVLO VM undervoltage lockout voltage V M rising7.88.2VV3P3OUT REGULATORV3P3V3P3OUT voltage IOUT=0to1mA 3.2 3.3 3.4V LOGIC-LEVEL INPUTSV IL Input low voltage0.60.7VV IH Input high voltage 2.2 5.25VV HYS Input hysteresis0.30.450.6VI IL Input low current VIN=0–2020μAI IH Input high current VIN=3.3V33100μAR PD Internal pulldown resistance100kΩnFAULT OUTPUT(OPEN-DRAIN OUTPUT)V OL Output low voltage I O=5mA0.5VI OH Output high leakage current V O=3.3V1μA DECAY INPUTV IL Input low threshold voltage For slow decay(brake)mode00.8VV IH Input high threshold voltage For fast decay(coast)mode2VI IN Input current±40μAR PU Internal pullup resistance130kΩR PD Internal pulldown resistance80kΩH-BRIDGE FETSV M=24V,I O=1A,T J=25°C0.1R DS(ON)HS FET on resistanceΩV M=24V,I O=1A,T J=85°C0.130.16V M=24V,I O=1A,T J=25°C0.1R DS(ON)LS FET on resistanceΩV M=24V,I O=1A,T J=85°C0.130.16I OFF Off-state leakage current–4040μA MOTOR DRIVERInternal current control PWMf PWM50kHzfrequencyt BLANK Current sense blanking time 3.75μst R Rise time30200nst F Fall time30200ns PROTECTION CIRCUITSI OCP Overcurrent protection trip level6At TSD Thermal shutdown temperature Die temperature150160180°C CURRENT CONTROLI REF VREF input current VREF=3.3V–33μAV TRIP ISENSE trip voltage VREF=3.3V,100%current setting635660685mVVREF=3.3V,5%current setting–2525VREF=3.3V,10%-34%current setting–1515 Current trip accuracyΔI TRIP% (relative to programmed value)VREF=3.3V,38%-67%current setting–1010VREF=3.3V,71%-100%current setting–55A ISENSE Current sense amplifier gain Reference only5V/VDRV8840 SLVSAB7B–MAY2010–REVISED MAY2011FUNCTIONAL DESCRIPTIONPWM Motor DriverThe DRV8840contains one H-bridge motor driver with current-control PWM circuitry.A block diagram of the motor control circuitry is shown in Figure1.Figure1.Motor Control CircuitryNote that there are multiple VM,ISEN,OUT,and VREF pins.All like-named pins must be connected together on the PCB.Bridge ControlThe PHASE input pin controls the direction of current flow through the H-bridge,and hence the direction of rotation of a DC motor.The ENBL input pin enables the H-bridge outputs when active high,and can also be used for PWM speed control of the motor.Note that the state of the DECAY pin selects the behavior of the bridge when ENBL=0,allowing the selection of slow decay(brake)or fast decay(coast).Table2shows the logic.Table2.H-Bridge LogicDECAY ENBL PHASE OUT1OUT200X L L10X Z ZX11H LX10L HThe control inputs have internal pulldown resistors of approximately100kΩ.I= CHOPVREFX 5·RISENSE ¾DRV8840SLVSAB7B–MAY2010–REVISED Current RegulationThe maximum current through the motor winding is regulated by a fixed-frequency PWM current regulation,or current chopping.When the H-bridge is enabled,current rises through the winding at a rate dependent on the DC voltage and inductance of the winding.Once the current hits the current chopping threshold,the bridge disables the current until the beginning of the next PWM cycle.For DC motors,current regulation is used to limit the start-up and stall current of the motor.Speed control is typically performed by providing an external PWM signal to the ENBLx input pins.If the current regulation feature is not needed,it can be disabled by connecting the ISENSE pins directly to ground and the VREF pins to V3P3.The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor connected to the ISEN pin,multiplied by a factor of5,with a reference voltage.The reference voltage is input from the VREF pin,and is scaled by a5-bit DAC that allows current settings of zero to100%in an approximately sinusoidal sequence.The full-scale(100%)chopping current is calculated in Equation1.(1)Example:If a0.25-Ωsense resistor is used and the VREFx pin is2.5V,the full-scale(100%)chopping current will be2.5V/(5x0.25Ω)=2A.Five input pins(I0-I4)are used to scale the current in the bridge as a percentage of the full-scale current set by the VREF input pin and sense resistance.The I0-I4pins have internal pulldown resistors of approximately 100kΩ.The function of the pins is shown in Table3.Table3.Pin FunctionsRELATIVE CURRENTI[4..0](%FULL-SCALE CHOPPING CURRENT)0x00h0%0x01h5%0x02h10%0x03h15%0x04h20%0x05h24%0x06h29%0x07h34%0x08h38%0x09h43%0x0Ah47%0x0Bh51%0x0Ch56%0x0Dh60%0x0Eh63%0x0Fh67%0x10h71%0x11h74%0x12h77%0x13h80%0x14h83%0x15h86%0x16h88%DRV8840 SLVSAB7B–MAY2010–REVISED MAY2011Table3.Pin Functions(continued)RELATIVE CURRENTI[4..0](%FULL-SCALE CHOPPING CURRENT)0x17h90%0x18h92%0x19h94%0x1Ah96%0x1Bh97%0x1Ch98%0x1Dh99%0x1Eh100%0x1Fh100%Decay Mode and BrakingDuring PWM current chopping,the H-bridge is enabled to drive current through the motor winding until the PWM current chopping threshold is reached.This is shown in Figure2as case1.The current flow direction shown indicates the state when the xENBL pin is high.Once the chopping current threshold is reached,the H-bridge can operate in two different states,fast decay or slow decay.In fast decay mode,once the PWM chopping current level has been reached,the H-bridge reverses state to allow winding current to flow in a reverse direction.As the winding current approaches zero,the bridge is disabled to prevent any reverse current flow.Fast decay mode is shown in Figure2as case2.In slow decay mode,winding current is re-circulated by enabling both of the low-side FETs in the bridge.This is shown in Figure2as case3.Figure2.Decay ModeDRV8840SLVSAB7B–MAY2010–REVISED The DRV8840supports fast decay and slow decay mode.Slow or fast decay mode is selected by the state of the DECAY pin-logic low selects slow decay,and logic high sets fast decay mode.The DECAY pin has both an internal pullup resistor of approximately130kΩand an internal pulldown resistor of approximately80kΩ.This sets the mixed decay mode if the pin is left open or undriven.DECAY mode also affects the operation of the bridge when it is disabled(by taking the ENBL pin inactive).This applies if the ENABLE input is being used for PWM speed control of the motor,or if it is simply being used to start and stop motor rotation.If the DECAY pin is high(fast decay),when the bridge is disabled fast decay mode will be entered until the current through the bridge reaches zero.Once the current is at zero,the bridge is disabled to prevent the motor from reversing direction.This allows the motor to coast to a stop.If the DECAY pin is low(slow decay),both low-side FETs will be turned on when ENBL is made inactive.This essentially shorts out the back EMF of the motor,causing the motor to brake,and stop quickly.The low-side FETs will stay in the ON state even after the current reaches zero.Blanking TimeAfter the current is enabled in an H-bridge,the voltage on the xISEN pin is ignored for a fixed period of time before enabling the current sense circuitry.This blanking time is fixed at3.75μs.Note that the blanking time also sets the minimum on time of the PWM.nRESET and nSLEEP OperationThe nRESET pin,when driven active low,resets the internal logic.It also disables the H-bridge driver.All inputs are ignored while nRESET is active.Driving nSLEEP low will put the device into a low power sleep state.In this state,the H-bridges are disabled,the gate drive charge pump is stopped,the V3P3OUT regulator is disabled,and all internal clocks are stopped.In this state all inputs are ignored until nSLEEP returns inactive high.When returning from sleep mode,some time (approximately1ms)needs to pass before the motor driver becomes fully operational.Note that nRESET and nSLEEP have internal pulldown resistors of approximately100kΩ.These signals need to be driven to logic high for device operation.Protection CircuitsThe DRV8840is fully protected against undervoltage,overcurrent and overtemperature events.Overcurrent Protection(OCP)An analog current limit circuit on each FET limits the current through the FET by removing the gate drive.If this analog current limit persists for longer than the OCP time,all FETs in the H-bridge will be disabled and the nFAULT pin will be driven low.The device will remain disabled until either nRESET pin is applied,or VM is removed and re-applied.Overcurrent conditions on both high and low side devices;i.e.,a short to ground,supply,or across the motor winding will all result in an overcurrent shutdown.Note that overcurrent protection does not use the current sense circuitry used for PWM current control,and is independent of the I SENSE resistor value or VREF voltage.Thermal Shutdown(TSD)If the die temperature exceeds safe limits,all FETs in the H-bridge will be disabled and the nFAULT pin will be driven low.Once the die temperature has fallen to a safe level operation will automatically resume. Undervoltage Lockout(UVLO)If at any time the voltage on the VM pins falls below the undervoltage lockout threshold voltage,all circuitry in the device will be disabled and internal logic will be reset.Operation will resume when V M rises above the UVLO threshold.分销商库存信息:TIDRV8840PWP DRV8840PWPR。
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DRV8842 SLVSAB8D–MAY2010–REVISED JANUARY2012DC MOTOR DRIVER ICCheck for Samples:DRV8842FEATURES•Single H-Bridge Current-Control Motor Driver•Thermally Enhanced Surface Mount Package –Drives One DC Motor,One Coil of a StepperAPPLICATIONSMotor,or Other Actuators•Printers–Five-Bit Winding Current Control Allows Upto32Current Levels•Scanners–Low MOSFET On-Resistance•Office Automation Machines•5-A Maximum Drive Current at24V,25°C•Gaming Machines•Built-In3.3-V Reference Output•Factory Automation•Industry-Standard PWM Control Interface•Robotics•8.2-V to45-V Operating Supply Voltage RangeDESCRIPTIONThe DRV8842provides an integrated motor driver solution for printers,scanners,and other automated equipment applications.The device has one H-bridge driver,and is intended to drive one DC motor,one coil of a stepper motor,or other loads.The output driver block consists of N-channel power MOSFET’s configured as an H-bridge.The DRV8842can supply up to5-A peak or3.5-A RMS output current(with proper heatsinking at24V and25°C).Separate inputs to independently control each half of the H-bridge are provided.Internal shutdown functions are provided for over current protection,short circuit protection,under voltage lockout and overtemperature.TheDRV8842is available in a28-pin HTSSOP package with PowerPAD™(Eco-friendly:RoHS&no Sb/Br).ORDERING INFORMATION(1)ORDERABLE PART TOP-SIDE T A PACKAGE(2)NUMBER MARKING –40°C to85°C PowerPAD™(HTSSOP)-PWP Reel of2000DRV8842PWPR8842(1)For the most current packaging and ordering information,see the Package Option Addendum at the end of this document,or see the TIweb site at .(2)Package drawings,thermal data,and symbolization are available at /packaging.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PowerPAD is a trademark of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©2010–2012,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.DRV8842SLVSAB8D–MAY2010–REVISED DEVICE INFORMATIONFunctional Block Diagram2Submit Documentation Feedback Copyright©2010–2012,Texas Instruments IncorporatedProduct Folder Link(s):DRV8842DRV8842 SLVSAB8D–MAY2010–REVISED JANUARY2012Table1.TERMINAL FUNCTIONSEXTERNAL COMPONENTS NAME PIN I/O(1)DESCRIPTIONOR CONNECTIONSPOWER AND GROUNDGND14,28-Device groundConnect to motor supply(8.2-45V).BothVM4,11-Bridge A power supplypins must be connected to same supply.Bypass to GND with a0.47-μF,6.3-V ceramic V3P3OUT15O 3.3-V regulator outputcapacitor.Can be used to supply VREF.CP11IO Charge pump flying capacitor Connect a0.01-μF50-V capacitor betweenCP1and CP2.CP22IO Charge pump flying capacitorConnect a0.1-μF16-V ceramic capacitor to VCP3IO High-side gate drive voltageVM.CONTROLLogic input controls state of OUT1.InternalIN121I Input1pulldown.Logic input controls state of OUT2.InternalIN220I Input2pulldown.I023II124ISets winding current as a percentage ofI225I Current set inputsfull-scale.Internal pulldown.I326II427ILow=slow decay,open=mixed decay, DECAY19I Decay mode high=fast decay.Internal pulldown andpullup.Active-low reset input initializes the logic and nRESET16I Reset input disables the H-bridge outputs.Internalpulldown.Logic high to enable device,logic low to enter nSLEEP17I Sleep mode inputlow-power sleep mode.Internal pulldown.Reference voltage for winding current set. VREF12,13I Current set reference input Both pins must be connected together on thePCB.STATUSLogic low when in fault condition(overtemp, nFAULT18OD Faultovercurrent)OUTPUTConnect to current sense resistor.Both pins ISEN6,9IO Bridge ground/Isensemust be connected together on the PCB.Connect to motor winding.Both pins must be OUT15,10O Bridge output1connected together on the PCB.Connect to motor winding.Both pins must be OUT27,8O Bridge output2connected together on the PCB.(1)Directions:I=input,O=output,OZ=tri-state output,OD=open-drain output,IO=input/outputCopyright©2010–2012,Texas Instruments Incorporated Submit Documentation Feedback3Product Folder Link(s):DRV8842GNDI4I3I2I1I0NCIN1IN2DECAYnFAULTnSLEEPnRESETV3P3OUTVREFGNDVMVREFISENOUT1OUT2OUT2OUT1ISENVCPVMCP1CP2PWP PACKAGE(TOP VIEW)DRV8842SLVSAB8D–MAY2010–REVISED ABSOLUTE MAXIMUM RATINGSover operating free-air temperature range(unless otherwise noted)(1)(2)VALUE UNITVM Power supply voltage range–0.3to47V Digital pin voltage range–0.5to7V VREF Input voltage–0.3to4V ISENSEx pin voltage–0.3to0.8VPeak motor drive output current,t<1μS Internally limited AContinuous motor drive output current(3)5AContinuous total power dissipation See Dissipation Ratings tableT J Operating virtual junction temperature range–40to150°CT A Operating ambient temperature range–40to85°CT stg Storage temperature range–60to150°C (1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to network ground terminal.(3)Power dissipation and thermal limits must be observed.4Submit Documentation Feedback Copyright©2010–2012,Texas Instruments IncorporatedProduct Folder Link(s):DRV8842DRV8842 SLVSAB8D–MAY2010–REVISED JANUARY2012THERMAL INFORMATIONDRV8842THERMAL METRIC(1)PWP UNITS28PINSθJA Junction-to-ambient thermal resistance(2)31.6θJCtop Junction-to-case(top)thermal resistance(3)15.9θJB Junction-to-board thermal resistance(4) 5.6°C/WψJT Junction-to-top characterization parameter(5)0.2ψJB Junction-to-board characterization parameter(6) 5.5θJCbot Junction-to-case(bottom)thermal resistance(7) 1.4(1)For more information about traditional and new thermal metrics,see the IC Package Thermal Metrics application report,SPRA953.(2)The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard,high-K board,asspecified in JESD51-7,in an environment described in JESD51-2a.(3)The junction-to-case(top)thermal resistance is obtained by simulating a cold plate test on the package top.No specificJEDEC-standard test exists,but a close description can be found in the ANSI SEMI standard G30-88.(4)The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCBtemperature,as described in JESD51-8.(5)The junction-to-top characterization parameter,ψJT,estimates the junction temperature of a device in a real system and is extractedfrom the simulation data for obtainingθJA,using a procedure described in JESD51-2a(sections6and7).(6)The junction-to-board characterization parameter,ψJB,estimates the junction temperature of a device in a real system and is extractedfrom the simulation data for obtainingθJA,using a procedure described in JESD51-2a(sections6and7).(7)The junction-to-case(bottom)thermal resistance is obtained by simulating a cold plate test on the exposed(power)pad.No specificJEDEC standard test exists,but a close description can be found in the ANSI SEMI standard G30-88.RECOMMENDED OPERATING CONDITIONSover operating free-air temperature range(unless otherwise noted)MIN NOM MAX UNITV M Motor power supply voltage range(1)8.245VV REF VREF input voltage(2)1 3.5VI V3P3V3P3OUT load current01mAf PWM Externally applied PWM frequency0100kHz(1)All V M pins must be connected to the same supply voltage.(2)Operational at VREF between0V and1V,but accuracy is degraded.Copyright©2010–2012,Texas Instruments Incorporated Submit Documentation Feedback5Product Folder Link(s):DRV8842DRV8842SLVSAB8D–MAY2010–REVISED ELECTRICAL CHARACTERISTICSover operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLIESI VM VM operating supply current V M=24V,f PWM<50kHz58mAI VMQ VM sleep mode supply current V M=24V1020μAV UVLO VM undervoltage lockout voltage V M rising7.88.2VV3P3OUT REGULATORV3P3V3P3OUT voltage IOUT=0to1mA 3.2 3.3 3.4V LOGIC-LEVEL INPUTSV IL Input low voltage0.60.7VV IH Input high voltage 2.2 5.25VV HYS Input hysteresis0.30.450.6VI IL Input low current VIN=0–2020μAI IH Input high current VIN=3.3V33100μAR PD Internal pulldown resistance100kΩnFAULT OUTPUT(OPEN-DRAIN OUTPUT)V OL Output low voltage I O=5mA0.5VI OH Output high leakage current V O=3.3V1μA DECAY INPUTV IL Input low threshold voltage For slow decay(brake)mode00.8VV IH Input high threshold voltage For fast decay(coast)mode2VI IN Input current±40μAR PU Internal pullup resistance(to3.3V)130kΩR PD Internal pulldown resistance80kΩH-BRIDGE FETSV M=24V,I O=1A,T J=25°C0.1R DS(ON)HS FET on resistanceΩV M=24V,I O=1A,T J=85°C0.130.16V M=24V,I O=1A,T J=25°C0.1R DS(ON)LS FET on resistanceΩV M=24V,I O=1A,T J=85°C0.130.16I OFF Off-state leakage current–4040μA MOTOR DRIVERf PWM Internal current control PWM frequency50kHzt BLANK Current sense blanking time 3.75μst R Rise time30200nst F Fall time30200ns PROTECTION CIRCUITSI OCP Overcurrent protection trip level6At TSD Thermal shutdown temperature Die temperature150160180°C CURRENT CONTROLI REF VREF input current VREF=3.3V–33μAV TRIP ISENSE trip voltage VREF=3.3V,100%current setting635660685mVVREF=3.3V,5%current setting–2525VREF=3.3V,10%-34%current setting–1515 Current trip accuracyΔI TRIP% (relative to programmed value)VREF=3.3V,38%-67%current setting–1010VREF=3.3V,71%-100%current setting–55A ISENSE Current sense amplifier gain Reference only5V/V6Submit Documentation Feedback Copyright©2010–2012,Texas Instruments IncorporatedProduct Folder Link(s):DRV8842DRV8842 SLVSAB8D–MAY2010–REVISED JANUARY2012FUNCTIONAL DESCRIPTIONPWM Motor DriversThe DRV8842contains one H-bridge motor driver with current-control PWM circuitry.A block diagram of the motor control circuitry is shown in Figure1.Figure1.Motor Control CircuitryNote that there are multiple VM,ISEN,OUT,and VREF pins.All like-named pins must be connected together on the PCB.Bridge ControlThe IN1and IN2input pins directly control the state of the OUT1and OUT2outputs.Either input can also be used for PWM control of the load.Table2shows the logic.Table2.H-Bridge LogicxIN1xIN2xOUT1xOUT200L L01L H10H L11H HThe control inputs have internal pulldown resistors of approximately100kΩ.Current RegulationThe maximum current through the load is regulated by a fixed-frequency PWM current regulation,or current chopping.When the H-bridge is enabled,current rises through the winding at a rate dependent on the DC voltage and inductance of the winding.Once the current hits the current chopping threshold,the bridge disables the current until the beginning of the next PWM cycle.For DC motors,current regulation is used to limit the start-up and stall current of the motor.Speed control is typically performed by providing an external PWM signal to the xIN1or xIN2input pins.If the current regulation feature is not needed,it can be disabled by connecting the ISENSE pins directly to ground and the VREF pins to V3P3.Copyright©2010–2012,Texas Instruments Incorporated Submit Documentation Feedback7Product Folder Link(s):DRV8842I= CHOPVREFX 5·RISENSE ¾DRV8842SLVSAB8D–MAY2010–REVISED The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor connected to the ISEN pin,multiplied by a factor of5,with a reference voltage.The reference voltage is input from the VREF pin,and is scaled by a5-bit DAC that allows current settings of zero to100%in an approximately sinusoidal sequence.The full-scale(100%)chopping current is calculated in Equation1.(1)Example:If a0.25-Ωsense resistor is used and the VREFx pin is2.5V,the full-scale(100%)chopping current will be2.5V/(5x0.25Ω)=2A.Five input pins(I0-I4)are used to scale the current in the bridge as a percentage of the full-scale current set by the VREF input pin and sense resistance.The I0-I4pins have internal pulldown resistors of approximately 100kΩ.The function of the pins is shown in Table3.Table3.Pin FunctionsRELATIVE CURRENTI[4..0](%FULL-SCALE CHOPPING CURRENT)0x00h0%0x01h5%0x02h10%0x03h15%0x04h20%0x05h24%0x06h29%0x07h34%0x08h38%0x09h43%0x0Ah47%0x0Bh51%0x0Ch56%0x0Dh60%0x0Eh63%0x0Fh67%0x10h71%0x11h74%0x12h77%0x13h80%0x14h83%0x15h86%0x16h88%0x17h90%0x18h92%0x19h94%0x1Ah96%0x1Bh97%0x1Ch98%0x1Dh99%0x1Eh100%0x1Fh100%8Submit Documentation Feedback Copyright©2010–2012,Texas Instruments IncorporatedProduct Folder Link(s):DRV8842DRV8842 SLVSAB8D–MAY2010–REVISED JANUARY2012Decay ModeDuring PWM current chopping,the H-bridge is enabled to drive current through the motor winding until the PWM current chopping threshold is reached.This is shown in Figure2as case1.The current flow direction shown indicates the state when the IN1pin is high and the IN2pin is low.Once the chopping current threshold is reached,the H-bridge can operate in two different states,fast decay or slow decay.In fast decay mode,once the PWM chopping current level has been reached,the H-bridge reverses state to allow winding current to flow in a reverse direction.As the winding current approaches zero,the bridge is disabled to prevent any reverse current flow.Fast decay mode is shown in Figure2as case2.In slow decay mode,winding current is re-circulated by enabling both of the low-side FETs in the bridge.This is shown in Figure2as case3.Figure2.Decay ModeThe DRV8842supports fast decay,slow decay and a mixed decay mode.Slow,fast,or mixed decay mode is selected by the state of the DECAY pin-logic low selects slow decay,open selects mixed decay operation,and logic high sets fast decay mode.The DECAY pin has both an internal pullup resistor of approximately130kΩand an internal pulldown resistor of approximately80kΩ.This sets the mixed decay mode if the pin is left open or undriven.Mixed decay mode begins as fast decay,but at a fixed period of time(75%of the PWM cycle)switches to slow decay mode for the remainder of the fixed PWM period.Blanking TimeAfter the current is enabled in an H-bridge,the voltage on the xISEN pin is ignored for a fixed period of time before enabling the current sense circuitry.This blanking time is fixed at3.75μs.Note that the blanking time also sets the minimum on time of the PWM.Copyright©2010–2012,Texas Instruments Incorporated Submit Documentation Feedback9Product Folder Link(s):DRV8842DRV8842SLVSAB8D–MAY2010–REVISED nRESET and nSLEEP OperationThe nRESET pin,when driven active low,resets the internal logic.It also disables the H-bridge driver.All inputs are ignored while nRESET is active.Driving nSLEEP low will put the device into a low power sleep state.In this state,the H-bridges are disabled,the gate drive charge pump is stopped,the V3P3OUT regulator is disabled,and all internal clocks are stopped.In this state all inputs are ignored until nSLEEP returns inactive high.When returning from sleep mode,some time (approximately1ms)needs to pass before the motor driver becomes fully operational.Note that nRESET and nSLEEP have internal pulldown resistors of approximately100kΩ.These signals need to be driven to logic high for device operation.Protection CircuitsThe DRV8842is fully protected against undervoltage,overcurrent and overtemperature events.Overcurrent Protection(OCP)An analog current limit circuit on each FET limits the current through the FET by removing the gate drive.If this analog current limit persists for longer than the OCP time,all FETs in the H-bridge will be disabled and the nFAULT pin will be driven low.The device will remain disabled until either nRESET pin is applied,or VM is removed and re-applied.Overcurrent conditions on both high and low side devices;i.e.,a short to ground,supply,or across the motor winding will all result in an overcurrent shutdown.Note that overcurrent protection does not use the current sense circuitry used for PWM current control,and is independent of the I SENSE resistor value or VREF voltage.Thermal Shutdown(TSD)If the die temperature exceeds safe limits,all FETs in the H-bridge will be disabled and the nFAULT pin will be driven low.Once the die temperature has fallen to a safe level operation will automatically resume. Undervoltage Lockout(UVLO)If at any time the voltage on the VM pins falls below the undervoltage lockout threshold voltage,all circuitry in the device will be disabled and internal logic will be reset.Operation will resume when V M rises above the UVLO threshold.10Submit Documentation Feedback Copyright©2010–2012,Texas Instruments IncorporatedProduct Folder Link(s):DRV8842分销商库存信息:TIDRV8842PWP DRV8842PWPR。