MPC564MZP40中文资料
PCM56中文资料
®
PCM56
2
元器件交易网
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltages ...................................................................... ±16VDC Input Logic Voltage ............................................................ –1V to +VS/+VL Power Dissipation .......................................................................... 850mW Operating Temperature ..................................................... –25°C to +70°C Storage Temperature ...................................................... –60°C to +100°C Lead Temperature (soldering, 10s) ................................................ +300°C
Reference 16-Bit IOUT DAC
RF
16-Bit Input Latch
Audio Output
16-Bit Serial-to-Parallel Conversion Clock LE Data
International Airport Industrial Park • Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
LNK562-564中文资料
LNK562-564
4B
2 4.90 (0.193) BSC
A
4
8
5
SO-8C
0.10 (0.004) C A-B 2X
D
2 3.90 (0.154) BSC
0.10 (0.004) C D
2X
Pin 1 ID
1
1.27 (0.050) BSC
1.35 (0.053) 1.75 (0.069)
0.10 (0.004) 0.25 (0.010)
4. 在靠近塑料封装体表面的引脚8(源极)测量。
(θ ) ............................ 100 °C/W(3); 80 °C/W(4) JA
(θ )(2) .................................................... 30 °C/W JC
15
版本H 11/08
LNK562-564
了解最新信息,请访问我们的网站: Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
MPC5644A学习纪要
MPC5644A学习纪要Nichmean@2016-09-26 11:05:411SPC5644A简介学些资料:数据手册(datasheet):5644A – MPC5644A.pdf。
参考手册:MPC5644ARM.pdf使用/查询寄存器的依据内核手册:e200z3RM.pdf和e200z4RM.pdf查询汇编指令。
特性:●150MHz e200z4 Power架构内核-可变长度指令编码(VLE)-有两个可执行单元的大范围架构-每周期最多两个整形或浮点型指令运算-每周期最多四个乘法或加法运算●存储器组成-具有ECC和写时读功能的片内4MB Flash存储器-具有standby和ECC功能的片内192KB SRAM-可配置为2路或4路的带有线锁功能(line locking)8KB指令cache-14 + 3KB eTPU代码和数据RAM-5×4交叉开关(XBAR)-24端口的MMU-具有主从功能的外部总线接口(EBI)●故障安全保护-16端口的存储器保护单元(MPU)-带有3个子模块(sub-modules)的CRC单元-结温传感器●中断-带有NMI的可配置中断控制器-64通道的DMA●串行通道-3路eSCI-3路DSPI(有两路支持downstream MicroSecond Channel[MSC])-每路64个消息窗口的3路FlexCAN-1路搞到10Mbits/s的FlexRay模块(V2.1),可配置单通道或双通道,具有128个消息对象,具有ECC功能。
●1路eMIOS,具有24个未定义通道●1路eTPU2(第二代eTPU)-32个标准通道-1个反射模块(reaction module)(6通道,每通道3路输出)●两路增强型AD转化器(eQADCs)-40路12位输入通道(基于2个AD转化器切换),并且可通过外部选择器扩展到56路-6个命令队列-支持触发和DMA-最小转换时间688ns●带有启动辅助模块(BAM)的片内CAN/SCI/FlexRay启动引导●Nexus-Class 3+的e200z4内核-Class 1的eTPU●JTAG(5针)●Development Trigger Semaphore(DTS)-32位的信号量寄存器,一个唯一识别码寄存器-参与数据采集的触发器组成-用于与外部工具通讯的EVTO引脚●时钟产生-片内4-40 MHz的主振荡器-片内FMPLL(相位锁定的频率模块)●最多120个通用I/O口-可独立配置为输入、输出或特殊功能-可配置阈值●低功耗模式:slow,stop和stand-by模式●灵活的供电方式-使用外部ballast的5V单电源供电-多路外部供电:5V、3.3V和1.2V●封装-176 LQFP-208 MAPBGA-324 TEPBGA2环境2.1硬件平台北京龙邱智能科技公司的开发板LQ-56xx-EVB,主控芯片为SPC5644AMLU。
Canon imagePROGRAF iPF MFP M40系统技术文档说明书
imagePROGRAFTECHNICALDOCUMENTSMFP LARGE-FORMAT IMAGINGIntroducing the imagePROGRAF iPF MFP M40 SystemThe Canon imagePROGRAF iPF MFP M40 systems are multicomponent, multifunction solutions for architects, engineers, construction, GIS, and other professionals who need to scan, edit, save, share,and print large-format documents easily and efficiently.FEATURES• M40 Scanner with SingleSensor assemblytechnology* delivers incredibly fast and accurate scan speeds.• SmartWorks MFP scan to copy/file/sharesoftware includes new custom presets, imageenhancements, and all new cloud integration.• Direct Print & Share is Canon’s Cloud Portalsoftware for file sharing.• A customizable system–choose between 36”or 44” printers for maximum versatility.• Touch-Screen Monitor and Stand are included in the system.* SingleSensor assembly technology means that multiple sensors are contained in oneassembly device.2VERSATILITYChoose the printer that best fits your workflow—and budget. With five imagePROGRAF models in the MFP M40 system line-up, it’s easy to customize your system.iPF765/iPF760• 36” 5-color large-format printers• Flat stacker/basket neatly stacks up to 20 plain paper prints, 24” x 36” in size • Interface lock system allows you to password-protect all user interfaces • Built-in 250GB hard drive (iPF765 only)iPF765iPF760iPF825/iPF815• 44” 5-color large-format printers • Dual-roll capability with automatic switching for enhanced production (iPF825 only)• Large-capacity ink tanks(330ml and 700ml tanks available)• Built-in 160GB hard drive • Sub ink tank systemiPF815iPF750• 36” 5-color large-format printer • Borderless printing• Bundled with a variety of softwaresolutions to help enhance your workflow •Entry-level, low-cost solution3iPF825M40 SCANNERThe M40 scanner with SingleSensor assembly technology brings the MFP solution to a wholenew level. You have the ability to scan documentsat incredible speeds and, with the included USB 3 connection, experience data transfer speeds of upto 10 times faster than on previous MFP models! The intuitive control panel embedded on the scanner helps make operation of the device incredibly easy, and its compact design helps space become a non-issue when using and storing the device.• Optical resolution of 1200 dpi• Scan speeds of 13 inches per secondmonochrome and 3 inches per second color • Capability to accept media of differentthickness (up to 2mm)SMARTWORKSThe included SmartWorks MFP scan-to-copy/file/ share software has been enhanced and now helps you to be more efficient than ever before.• New user interface for easy navigation• Ability to add custom presets with one-touchretrieval for those often-used settings• New image enhancements for white point adjust, black point adjust, sharpen, mirror,and invert• Full integration with Direct Print & ShareCloud Portal software SYSTEMExperience the vast customization options that come with your MFP system. The Canon imagePROGRAFiPF MFP M40 large-format imaging system is designed to be a complete scan-to-copy, file, andshare solution. The system includes an imagePROGRAF iPF large-format printer, M40 large-format scanner, MFP stand, SmartWorks MFP software, and a large touch-screen monitor. This solution provides a fast and effective system for printing, copying, archiving, and distributing maps, drawings, renderings, site and facilities management plans, design and layout proofs, posters, and more.With the iPF765 or iPF760 printer, the integratedstand allows the user to position the monitorin a variety of configurations to provide optimal functionality and comfort, as well as allowing theuser to mount the stand onto the printer for a trueall-in-one structure, or keep them separate for easy maneuverability. The MFP solution includes atouch-screen monitor, and users now have the optionof selecting to have their scanned documents come straight out the back of the scanner, or rewind to the front for easy retrieval. Customization is truly broughtto a whole new level with the iPF MFP M40 system.• Integrated stand for structural customization(iPF765 and iPF760 printers only)MARKETSThe iPF MFP M40 system is designed to help bring a fully operational work solution to you out in the field and provide you with all the tools to help enhanceyour technical document productivity. Whetheryou have a low-volume architecture firm or a high production enterprise environment, you can choosethe right printing solution to meet your workflow requirements. See how the MFP solution can bringyour business to the next level. This solution’s capability to help you produce high image qualityat impressive speeds—and achieve remarkable productivity—help make it a welcome addition for anyone looking to advance in the AEC, GIS, andother technical industries.imagePROGRAF iPF MFP M40 SYSTEM 4Touch-Screen MonitorSmartWorks MFP SoftwareFeaturing one-touch “green button”M40 Large-Format Scanner• SingleSensor assembly technologyLarge-Format Ink-Jet PrinterFive models to choose fromMFP Stand5Canon’s Direct Print & Share * is a cloud-based portal service that allows users to expand their workflow. Through a Google ** account, users are given the ability to scan and upload documents to their own cloud storage space and have those documents printed from almost anywhere!Easily print PDFs, TIFFs, and JPEGs through the user-friendly interface, and even have the ability to do batch printing. To help further integrate with your Canon printer and software, Direct Print & Share comes with a print plug-in for SmartWorks MFP V3 (also included) and AutoCAD ® (sold separately) tomake cloud use through this software incredibly easy. Scan, upload, download, and print directly from these software solutions to help streamline your workflow.FEATURES• Accessible from almost anywhere in the world • 5GB of free storage• Batch printing of multiple files• Integration with software solutions, such as SmartWorks MFP V3 and AutoCAD• Drag-and-drop TIFF, JPEG, and PDF files toshortcut iconDIRECT PRINT & SHARE SOFTWARE*Direct Print & Share is also available as a free download at /downloads.**You must open a Google Cloud account to take advantage of the cloud functionality. Storage capacity and any pricing thereof is based on Google’s current offering and is atGoogle’s discretion. Your Google Cloud account is subject to Google’s terms and conditions, which is subject to change at Google’s discretion. Neither Canon Inc., nor Canon U.S.A., Inc. represents or warrants any third-party product, service or feature referenced hereunder.Cloud StorageCloud Service IntegrationiPF Direct Print & Share1. Select a file2. Right-click to sendmanagementPrint settings6Output Width44” WideNumber of Ink Tanks6Color SetDye: Cyan, Magenta, Yellow, BlackPigment: Matte BlackInk TypeDye/Pigment Reactive InkInk Tank Size330ml and 700mlMaximum Print Resolution (dpi)2400 x 1200Total Number of Nozzles15,360Ink DropletConsistent 4plMaximum Print Speed(1200 x 1200 dpi on Plain Paper)688 sq.ft. per hr.*Print Speed Best Quality Mode (2400 x 1200 dpi on Photo Gloss Paper)89 sq.ft. per hr.*Software/Utilities/Applications• Canon Printer Driver• HDI Driver• Print Plug-in for Microsoft Office• Digital Photo Front-Access• Remote User Interface• Media Configuration Tool• Supports HP-GL/2, HP RTL Files• PosterArtist Lite• PosterArtist (optional) (PC only)• Third-Party RIPs (optional)Special Features• Dual Media Rolls (iPF825 only)• Accounting Manager (PC only)• Economy Color Mode• Sub Ink Tank System• Independent Rotary CutterPrinter Dimensions ( H x W x D)iPF825: 45” x 74.5” x 50.9” (with basket)iPF815: 45” x 74.5” x 38.4Printer WeightiPF825: Approx. 417 lb.iPF815: Approx. 305 lb.Printer Memory384MB RAM32GB Dedicated File Processing MemoryHard Drive160GBConnectivityUSB 2.0: 10/100Base-T/TXOperating SystemW indows®,** Macintosh®*** O S: Windows XP SP2, CPU: Pentium 4 3.2GHz, RAM:1GB, Application: Adobe Photoshop 7.0, Interface: USB2.0 Hi-Speed, Data used: ISO/JIS-SCID No.5, Outputimage size: A1 (580mm x 724.9mm) for iPF655/650/610,A2 (410mm x 512.5mm) for iPF510 using optional Roll Feed.Measured by Canon Inc. Each print time does not includedata transfer time. The print speed may vary depending onthe data volume and size, PC, application, software, mediatype, and interface.**Please visit /download for availability.Output Width36” WideNumber of Ink Tanks6Color SetDye: Cyan, Magenta, Yellow, BlackPigment: Matte Black, Matte Black Ink TypeDye/Pigment Reactive InkInk Tank Size130ml†Maximum Print Resolution (dpi)2400 x 1200Total Number of Nozzles15,360Ink DropletConsistent 4plMaximum Print Speed(1200 x 1200 dpi on Plain Paper)733 sq.ft. per hr.*Print Speed Best Quality Mode (2400 x 1200 dpi on Photo Gloss Paper)79 sq.ft. per hr.*Software/Utilities/ApplicationsiPF765/760• Canon Printer Driver• Optimization Module for AutoCAD(PC only)• Print Plug-in for Microsoft Office• Remote User Interface• Media Configuration Tool• PosterArtist Lite• PosterArtist (optional) (PC only)• Third-Party RIPs (optional)iPF750• Canon Printer Driver• HDI Driver• Digital Photo Front-Access• Print Plug-in for Microsoft Office• Remote User Interface• Media Configuration Tool• Supports HP-GL/2, HP RTL• PosterArtist Lite• PosterArtist (optional) (PC only)• Third-Party RIPs (optional)Printer Dimensions (H x W x D)41.8” x 51.3” x 34.5”41.8” x 51.3” x 43.3 (when Basket is in the extendedposition for flatbed stacking, iPF765/760 only)Printer WeightApprox. 141.3 lb.Special FeaturesiPF765/760• Flat Stacker/Basket• Interface Lock• Accounting Manager (PC only)• Sub Ink Tank System• Top-loading Roll FeediPF750• Accounting Manager (PC only)• Sub Ink Tank System• Top-loading Roll Feed• Gigabit Ethernet Support• Intuitive Operation PanelPrinter Memory256MB (32GB iPF765 only)Hard Drive250GB (iPF765 only)ConnectivityUSB 2.0: 10/100/1000Base-T/TXOperating SystemW indows,** Macintosh**† The starter ink tanks in the package with the printer are not the samecapacity as the replacement ink tanks specified here.*OS: Windows XP SP2, CPU: Pentium 4 3.2GHz, RAM: 1GB, Applica-tion: Adobe Photoshop 7.0, Interface: USB 2.0 Hi-Speed, Data used:ISO/JIS-SCID No.5, Output image size: A0 (827mm x 1033.8mm).Measured by Canon Inc. Each print time does not include data trans-fer time. The print speed may vary depending on the data volume andsize, PC, application, software, media type, and interface.**P lease visit /download for availability.7Canon Latin America, Inc.703 Waterford Way Suite400Miami, FL 33126The imagePROGRAF iPF MFP M40 systems contain multiple components, some of which are manufactured by third parties. To the extent that such third party offerings come with limited warranties, such limited warranties are hereby passed to the purchaser, and Canon shall have no obligation or any liability with respect to such third party offerings.As an ENERGY STAR ® Partner, Canon U.S.A., Inc. has determined that this product meets the ENERGY STAR guidelines for energy efficiency. ENERGY STAR and the ENERGY STAR mark are registered U.S. marks. CANON, IMAGEPROGRAF, and the GENUINE logo are registered trademarks of Canon Inc. in the United States and may also be registered trademarks or trademarks in other countries. IMAGEANYWARE is a trademark of Canon. All other referenced product names and marks are trademarks of their respective owners and are hereby acknowledged. Some items may not be available at this time; please check for availability. Specifications and availability subject to change without notice. All printer output images and effects are simulated. MFP shown with iPF825 and iPF765 printer. ©2013 Canon U.S.A., Inc. All rights reserved.0176W631Scan Speed* • 48-bit Full Color @ 200 dpi: 3” (per second) • 8-bit Grayscale and Monochrome @ 200 dpi:13” (per second)Scan Modes • 16.7-million Color RGB (24-bit) • 256 color RGB Adaptive Indexed Color Palette (8-bit) • 256-level Grayscale (8-bit) • Black and White (1-bit)Color Space Normalized RGB Resolution • 9600 dpi (maximum interpolated) • 1200 dpi (optical)Scan Accuracy** +/- 0.1% ; +/- 1 pixel Maximum Image Width 40”Maximum Media Width 42”Maximum Scan Length 96”Maximum Media Thickness 0.079” (2mm)Media Feed System S ingle large diameter precision ground drive roller;adaptive CIS media focus management and media guide mechanism; intuitive face-up, front-loading, and front/rear-exit media path with side justification; automatic media size detection with reliable optical media sensorsDigital Imaging Technology C ontact Image Sensor (CIS) Technology (SingleSensorAssembly) • 5x close-spaced “deep focus” CIS (25,000 pixels) • 48-bit RGB digital color image capture (50,400 pixels) • 16-bit grayscale image capture • Panchromatic monochrome and black and white • B i-directional extra long-life LED light system foroptimum object illumination and instant-on scanning capabilityDigital Image Processing • 2D Intelligent Adaptive Thresholding (IAT) (1-bit mode) • Fixed Threshold Black and White (1-bit mode) • D ynamic Normalization Application (DNA) with16-bit Super SamplingUser Status and One-Touch Operation Center mounted LCD scanner control panel; walk-up operation and user selection of scanner mode with stop, forward, rewind, scan, and copy buttons; local language options, panel overlay, and Magnetic Media Guide Included Software • SmartWorks MFP Scan-to-file, Copy, E-mail with Real-time Image Viewer. Supports TIFF, JPEG, TIFFG4, and PDF. • Direct Print & Share Cloud Portal Solution Operating System Windows 7 Professional (64-bit)User Maintenance Installable Plug-and-Play Scanner; Simple Cleaning Scanner Interface Kit S uperspeed USB 3.0 ( PC Connector Compatible withUSB 2.0 and USB 3.0 sockets ) Operating Environments 10 – 35°C, 35-80% RH, Non-condensing External Power Supply 100-250 VAC Autosensing +/- 10%, 50-60Hz Scanner Power Consumption • 53Wh (scanning) • 5Wh (stand-by)Compliances VCCL, CB, CE, FCC, UL, RoHS, ENERGY STAR ®Stand and Scanner Dimensions Height: Swing Arm: 57.5” Straight Arm (max): 66” Width: Swing Arm (max): 69.9” Straight Arm: 53.6 Depth: 31.5”Stand and Scanner Weight Approx. 120.4 lb.What’s In The Box? • M40 Scanner with Power Cord and USB 3.0 and USB 2.0 Cables (scanner to server) • 2 Meter USB Cable (server to printer) • M40 MFP Stand • M40 MFP Stand Assembly Instructions • SmartWorks MFP Software • Flat Panel Touch-screen Display • Installation and Operation Manual • Operator Manual on CD-ROM • Document Return Guide • Magnetic Paper Guide* T he scan rate is proportional across the full range ofresolutions supported by the scanner. Actual scan times will depend on the host system performance. Quoted top speeds may be limited by the effective bandwidth of the USB 2 and is not guaranteed for all media types. ** T he quoted scan accuracy may vary depending on theoperating environment and the thickness of the media.。
MPC40电脑操作说明书
(3)按游标键 ,选择需要修改的参数。按输入数值,再按 完成设定。
3.2.6中子和绞牙
图07
(1)按 ,即出现图07所示之画面。
(2)此画面下可以设定三组中子参数。各项参数可以先通过按 进行激活,然后按数字键,再按 完成设定。
(3)第一组可以设定为:中子1、绞牙1、不动作。可以通过按 或 进行选择。
吹风3时间:吹风3所需的时间。
吹风3延时:从“吹风3开始的开模位置”到吹风3启动时的延时时间。
2、顶针加减速的设定
画面06
(1)在画面05下按 + ,进入密码输入画面,输入正确密码后。则显示画面06。在这个画面下可以进行顶针加减速参数设定
(2)可以设定顶针和调模顶针的加减数参数。调模顶针是特别功能。
震雄MPC40多功能电脑
特性:
日本原装计算机控制器,符合JIS各类检验标准。640×480彩色超大液晶显示屏,电源适用范围AC110V~AC280V 50/60HZ。稳定性高,储存资料在停电状态下可达5年以上,安全可靠。并备有中、英、日三种语言字幕可自由选择切换,方便学习操作。
基本性能:
1,特大容量内存,可储存150组模具成型资料,如时间、次数、压力、速度、行程、计量、模具厚度、模号批注、选择条件、原料温度,亦可选择存入软盘及个人PC。
3.1.1
电脑面板图
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4
3.1.3
成形条件控制按键
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6
3.1.3
成形条件数字资料按键
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6
3.1.4
手动操作按键及说明
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8
3.1.5
电源开关
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8
3.2计算机画面操作说明
Canon PIXMA MX系列打印机功能介绍说明书
• Powerful and productive Office All-In-One• 35-page 2-sided Auto Document Feeder for scanning,copying and faxing• Superior prints using 5 individual ink system with optionalXL capacity ink tanks• Print up to 1000 monochrome pages with optional XXLmonochrome ink• Convenient, high-capacity 250-sheet paper tray• Large, user-friendly 7.5cm (3.0") colour TFT display withDual Function Panel• Fast printing with A4 ISO ESAT 15 ipm mono/10 ipmcolour• Print from, and scan to, smartphones/tablets. AppleAirPrint supported• Google Cloud Print support and internet printing usingPIXMA Cloud Link• Advanced media handling with Direct Disc Print and2-sided printingPIXMA MX925 PIXMA MX525 PIXMA MX455 PIXMA MX395yGeneral Specifications Footnotes[1]Ink droplets can be placed with a minimum pitch of 1/9600 inch. [2]Document print speed on plain paper is measured based on average of ESAT in Office Category Test of ISO/IEC 24734 standard. [3]Photo print speed is based on default driver setting using ISO/JIS-SCID N2 standard on Canon Photo Paper Plus Glossy II and does not take intoaccount data processing time on host computer. [4]Some features available in Windows driver only. [5]Declared yield value in accordance with ISO/IEC 24711 standard. Values obtained by continuous printing.[6]Actual transmission speed may vary depending on document complexity, fax settings at receiving end, and line conditions. [7]Optical resolution is a measure of maximum hardware sampling resolution based on ISO 14473 standard. When scanning in high resolution, the scan size is restricted (maximum optical resolution for A4 scan is 600dpi). [8]Colour document scan speed is measured with ISO/IEC 24735 Annex C Test Chart A. Scan speed indicates the time measured between pressing the scan button of the scanner driver and the on-screen status display turns off. [9]Colour document copyspeed is measured based on average of sFCOT and sESAT in Performance Test of ISO/IEC 29183 standard. [10]Requires connection over Wi-Fi network and installation of free Canon application: EPP for Android, Windows RT and iEPP for iOS. Not available in certain countries or regions. [11]Full HD Movie Print is available for MOV and MP4 movie files created by select Canon digital cameras and camcorders. Requires installation of software bundled with Canon video or digitalcamera, from which the movie was captured. MOV files require: ZoomBrowser EX / ImageBrowser (version 6.5 or later), MP4 files require: ImageBrowser EX (version 1.0 or later). [12]Easy-WebPrint EX requires Internet Explorer 7 or later[13]When printing ISO/JIS-SCID N2 pattern on 10x15cm Photo Paper Plus Glossy II using default settings. [14]When copying ISO/JIS-SCID N2 (printed by inkjet printer) on A4 size plain paper using default settings.Standard disclaimersAll specifications subject to change without notice.Print speed may vary depending on system configuration, interface, software, document complexity, print mode, page coverage, type of paper used etc. Ink yield may vary depending on texts/photos printed, applications software used, print mode and type of paper used. For yield information see /ink/yield . Scan speed may vary depending on system configuration, interface, software, scan mode settings and document size etc. Copy speed may vary depending on document complexity, copy mode, page coverage; type of paper used etc. and does not take into account warming up time. All brand and product names are trademarks of their respective companies. Microsoft,Windows and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States and/or other countries. For more information on ChromaLife100+ please visit High productivity, powerful Office All-In-One with Wi-Fi andXXL ink optionPowerful and productive 5-ink All-In-One offering XL and XXL ink options, Wi-Fi, Ethernet and 35-page2-sided ADF. Advanced media handling with 250-sheet paper tray, 2-sided printing and Direct Disc Print.Sales start date: March 2013Positioning: Powerful 5-ink Wi-Fi All-In-One with XL and XXL inks for high productivity officesRecommended Retail Price MX925 EUR 6992B008AA 4960999922751 £179.00Recommended Retail Price PGI-550 PGBK 6496B001AA 4960999904580 £12.99CLI-551 BK 6508B001AA 4960999905235 £10.99CLI-551 C 6509B001AA 4960999905556 £10.99CLI-551 M 6510B001AA 4960999905242 £10.99CLI-551 Y 6511B001AA 4960999905563 £10.99Recommended Retail Price PGI-555PGBK XXL 8049B001AA 4960999965376 TBCPGI-550PGBK XL 6431B001AA 4960999904504 £15.99CLI-551BK XL 6443B001AA 4960999904948 £14.99CLI-551C XL 6444B001AA 4960999904931 £14.99CLI-551M XL 6445B001AA 4960999904924 £14.99CLI-551Y XL 6446B001AA 4960999904917 £14.99CLI-551 C/M/Y/BK Multipack 6509B009AA 8714574584416 £38.99Glossy Photo Paper ‘Everyday Use’ GP-501 (A4) 0775B001AB 4960999293929 £19.99Glossy Photo Paper ‘Everyday Use’ GP-501 (4"X6") 0775B003AA 4960999293967 £8.99High Resolution Paper HR-101N A4 200 SH 1033A001AB 4960999869131 £22.99High Resolution Paper HR-101N A4 50 SH 1033A002AB 4960999867090 £6.99Luster Paper LU-101 A4 20 SH 6211B006AA 4960999843995 £16.99Matte Photo Paper MP-101 A4 50 SH 7981A005AB 4960999174839 £11.99Photo Paper Plus Glossy II PP-201 4"X6" 50 SH 2311B003BA 4960999484198 £8.99Photo Paper Plus Glossy II PP-201 5"X7" 20 SH 2311B018BA 4960999537276 £5.99Photo Paper Plus Glossy II PP-201 A4 20 SH 2311B019BA 4960999537269 £9.99yPhoto Paper Plus Semi-gloss SG-201 4"X6" 50 SH 1686B015AA 4960999405339 £8.99Photo Paper Plus Semi-gloss SG-201 8"X10" 20 SH 1686B018AA 4960999405353 £11.99Photo Paper Plus Semi-gloss SG-201 A4 20 SH 1686B021AA 4960999405377 £11.99Photo Paper Pro Platinum PT-101 4"X6" 20 SH 2768B013AB 4960999575254 £7.99Photo Paper Pro Platinum PT-101 A4 20 SH 2768B016AB 4960999575285 £15.99Photo Stickers PS-101 4"x6" 5 SH 0001C001AA 4960999252957 £4.99T-Shirt Transfers TR-301 8938A001AA 4960999195186 £10.99Pro Variety Pack PVP-101 A4 10 SH TBC TBC TBCMix Variety Pack MVP-101 4"x6" & A4 20 SH TBC TBC TBCVariety Pack VP-101 4"X6" 20 SH TBC TBC TBCPhoto Frame/Calendar Pack PFC-101 5"x7" 20 SH 2311B054AA 8714574595597 TBCGreeting Card Pack GCP-101 4"x6" 10 SH 0775B077AA 8714574595559 TBCLogistics informationWeight (Net/Gross in kg) Individual 1 570.5 x 308 x 520.5 14.5/11.7Pallet (Upper) 12 1147 x 930 x 1045 175.8/174Pallet (Bottom) 12 1147 x 930 x 1045 175.8/174What’s in the box?• Printer • Multilingual set-up guides, set-up software and • Inks: 5 individual ink tanks PGI-550PGBK (Pigment user manualBlack), CLI-551BK (Black), CLI-551C (Cyan), • Software: My Image Garden and CREATIVE PARK CLI-551M (Magenta), CLI-551Y (Yellow) PREMIUM• CD tray • Warranty Sheet• Power cord • Ink Leaflet• Telephone cabley。
理光5627-5632-5640-5840维修代码
1-801 每分钟复印量下降选择┿
1-902 齐纸板间隔调整(侧挡板)┿
1-905 齐纸板间隔调整(反挡板)┿
5-812 电话号码输入┿(仅指a207复印机)
5-816 仅在日本使用。不要改变工厂设定。
5-817 仅在日本使用。不要改变工厂设定。
5-905 aps a4/lt横送优先┿
4-902 aps 8k/16k检测(仅指a4机器)┿
操作
5-001 全部显示点亮┿
5-002 优先纸路选择┿
5-003 aps优先选择┿
5-504 仅在日本使用。不要改变工厂设定。
5-505 仅在日本使用。不要改变工厂设定。
5-507 仅在日本使用。不要改变工厂设定。
5-801 内存全清┿
2-801 搅拌显影剂
2-802 鼓充电辊湿度┿
2-812 鼓反转调整┿
2-901 鼓充电辊清洁间隔时间┿
2-902 未使用
3-801 自动过程控制方式选择┿
3-901 空运转(曝光灯熄灭)
3-902 强制性过程控制
光学
4-001 曝光灯电压调整┿
5-906 手动装订复位时间设定┿
5-907 封页方式选择┿
5-908 图象移动/删除选择┿
5-909 数字键变倍/尺寸倍率┿
5-910 操作指导的语种设定(仅指a207复印机上)
2-208-001 初粉方式选择┿
2-208-002 补粉率(td传感器补粉方式)┿
2-208-003 补粉率(定量补粉方式)┿
2-214 td传感器初期设定
鼓周围
2-001 鼓充电电压调整(供复印)
MPC5606S中文资料
This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Offering high performance processing at speeds up to 64 MHz, the MPC5606S family is optimized for low power consumption and supports a range of on-chip SRAM and internal flash memories. The 1 MB flash version (MPC5606S) features 160 KB of on-chip graphics SRAM.
2 Pinout and Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . .9 2.1 144 LQFP Package Pinout . . . . . . . . . . . . . . . . . . . . . .10 2.2 176 LQFP Package Pinout . . . . . . . . . . . . . . . . . . . . . .11 2.3 208 MAPBGA Package Pinout . . . . . . . . . . . . . . . . . . .11 2.4 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 2.4.1 Pad Configuration during Reset Phases . . . . . .13 2.4.2 Voltage Supply Pins. . . . . . . . . . . . . . . . . . . . . .13 2.4.3 Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 2.4.4 System Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . .15 2.4.5 Nexus Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 2.4.6 Functional Ports A, B, C, D, E, F, G, H, I, J, K . .18 2.4.7 Signal Details. . . . . . . . . . . . . . . . . . . . . . . . . . .36
MPC561中文资料
MOTOROLA SEMICONDUCTOR PRODUCT BRIEFThis document contains information on a new product. Specifications and information herein are subject to change without notice.MPC561PB/DRev. 1, December 2001MPC561/MPC562 MPC563/MPC564Product BriefMPC561/MPC562 / MPC563/MPC564 RISC MCUIncluding Peripheral Pin Multiplexing withFlash and Code Compression OptionsFeaturesThe MPC561/MPC562 / MPC563/MPC564 are members of the Motorola MPC500 RISC Microcontrollerfamily. As shown in the block diagram, they are composed of:• High performance CPU system— High performance core• Single issue integer core• Compatible with PowerPC instruction set architecture• Precise exception model• Floating point• Extensive system development support— On-chip watchpoints and breakpoints— Program flow tracking— Background debug mode (BDM)— IEEE-ISTO Nexus 5001-1999 Class 3 Debug Interface— MPC500 system interface (USIU, BBC, L2U)— Fully static design— Four major power saving modes• On, doze, sleep, deep-sleep and power-down— 32-Kbyte static RAM (CALRAM)— 512-Kbyte flash (UC3F) on MPC563/MPC564— General-purpose I/O support• On address (24) and data (32) pins• 16 GPIO in MIOS14• Many peripheral pins can be used as GPIO when not used as primary functions• 2.6-V outputs on external bus pins• PPM (peripheral pin multiplexing with parallel-to-serial driver) module• Available in package or die— Plastic ball grid array (PBGA) packagingKey Feature DetailsMPC500 System Interface (USIU)• System configuration and protection features:— Periodic-interrupt timer— Bus monitor— Software watchdog timer— Real-time clock (RTC)元器件交易网— Decrementer— Time base• Clock synthesizer• Power management• Reset controller• External bus interface that tolerates 5-V inputs, provides 2.6-V outputs and supports multiple-mas-ter designs• Enhanced interrupt controller that supports up to eight external and 40 internal interrupts, simpli-fies the interrupt structure and decreases interrupt processing time• USIU supports dual mapping to map part of one internal/external memory to another external memory• USIU supports dual mapping of flash on MPC563 and MPC564 to move part of internal flash mem-ory to external bus for development• External bus, supporting non-wraparound burst for instruction fetches, with up to 8 instructions per memory cycleBurst Buffer Controller (BBC) Module• Support for enhanced interrupt controller (EIC)• Support for enhanced exception table relocation feature• Branch target buffer• Contains 2-Kbytes of decompression RAM (DECRAM) for code compression. This RAM may also be used as general-purpose RAM when code compression feature not used.Flexible Memory Protection Unit• Flexible memory protection units (MPU) in BBC and L2U• Default attributes available in one global entry• Attribute support for speculative accesses• Up to eight memory regions are supported, four for data and four for instructionsMemory Controller• Four flexible chip selects via memory controller• 24-bit address and 32-bit data buses• 4-Kbyte to one 16-Mbyte (data) or four-Gbyte (instruction) region size support• Supports enhanced external burst• Up to eight-beat transfer bursts, two-clock minimum bus transactions• Use with SRAM, EPROM, flash and other peripherals• Byte selects or write enables• 32-bit address decodes with bit masks• Four regions512-Kbytes of CDR3 Flash EEPROM Memory (UC3F) – MPC563 Only• One 512-Kbyte module• Page read mode• Block (64 Kbytes) erasable• External 4.75- to 5.25-V VFLASH power supply for program, erase, and read operations32-Kbyte static RAM (CALRAM)• Composed of one 32-Kbyte CALRAM module— 28-Kbyte static RAM— 4-Kbyte calibration (overlay) RAM feature that allows calibration of flash-based constants • Eight 512-byte overlay regions• One clock fast accesses• Two-clock cycle access option for power saving• Keep-alive power (VDDSRAM) for data retentionGeneral-Purpose I/O Support• 24 Address pins and 32 data pins can be used for general-purpose I/O in single-chip mode • 16 GPIO in MIOS14• Many peripheral pins can be used as GPIO when not used as primary functions• 2.6-V outputs on external bus pins• 5-V outputs with slew rate controlNEXUS Debug Port (Class 3)• Compliant with Class 3 of the IEEE-ISTO Nexus 5001-1999• Program trace via branch trace messaging (BTM)• Data trace via data write messaging (DWM) and data read messaging (DRM)• Ownership trace via ownership trace messaging (OTM)• Run-time access to on-chip memory map and MPC5xx special purpose registers (SPRs) via the READI read/write access protocol• Watchpoint messaging via the auxiliary port• Reduced-port mode (1 MDI, 2 MDO) or full-port mode (2 MDI. 8 MDO)• All features configurable and controllable via the auxiliary port• Security features for production environment• Supports the RCPU debug mode via the auxiliary port• READI module can be reset independent of system resetIntegrated I/O SystemTwo Time Processor Units (TPU3)• True 5-V I/O• Two time processing units (TPU3) with16 channels each• Each TPU3 is a micro-coded timer subsystem• Eight-Kbytes of dual port TPU RAM (DPTRAM) shared by two TPU3 modules for TPU micro-code22-Channel Modular I/O System (MIOS14)• Six modulus counter sub-modules (MCSM)• 10 double-action sub-modules (DASM)• 12 dedicated PWM sub-modules (PWMSM)• One MIOS14 16-bit parallel port I/O sub-modules (MPIOSM)Two Enhanced Queued Analog-to-Digital Converter Modules (QADC64E)• Two queued analog-to-digital converter modules (QADC64_A, QADC64_B) providing a total of 32 analog channels• 16 analog input channels on each QADC64E module using internal multiplexing• Directly supports up to four external multiplexers• Up to 41 total input channels on the two QADC64E modules with external multiplexing• Software configurable to operate in Enhanced or Legacy (MPC555 compatible) mode• Unused analog channels can be used as digital input/output pins— GPIO on all channels in Enhanced mode• 10-bit A/D converter with internal sample/hold• Typical conversion time of less than 5 µs (>200 K samples/second)• Two conversion command queues of variable length• Automated queue modes initiated by:— External edge trigger— Software command— Periodic/interval timer within QADC64E module, that can be assigned to both queue 1 and 2— External Gated trigger (queue 1only)• 64 result registers— Output data is right- or left-justified, signed or unsigned• Alternate reference input (ALTREF), with control in the conversion command word (CCW)Three CAN 2.0B Controller (TouCAN) Modules• Three TouCAN modules (TOUCAN_A, TOUCAN_B, TOUCAN_C)• Each TouCAN provides the following features:— 16 message buffers each, programmable I/O modes— Maskable interrupts— Independent of the transmission medium (external transceiver is assumed)— Open network architecture, multi-master concept— High immunity to EMI— Short latency time for high-priority messages— Low-power sleep mode, with programmable wake-up on bus activity— TOUCAN_C pins are shared with MIOS14 GPIO or QSMCMQueued Serial Multi-Channel Module (QSMCM)• One queued serial module with one queued SPI and two SCIs (QSMCM)• QSMCM matches full MPC555 QSMCM functionality• Queued SPI— Provides full-duplex communication port for peripheral expansion or inter-processor commu-nication— Up to 32 preprogrammed transfers, reducing overhead— Synchronous serial interface with baud rate of up to system clock / 4— Four programmable peripheral-selects pins:— Support up to 16 devices with external decoding— Support up to eight devices with internal decoding— Special wrap-around mode allows continuous sampling of a serial peripheral for efficient inter-facing to serial analog-to-digital (A/D) converters• SCI— UART mode provides NRZ format and half- or full-duplex interface— 16 register receive buffers and 16 register transmit buffers on one SCI— Advanced error detection and optional parity generation and detection— Word-length programmable as eight or nine bits— Separate transmitter and receiver enable bits, and double buffering of data— Wake-up functions allow the CPU to run uninterrupted until either a true idle line is detected, or a new address byte is receivedPeripheral Pin Multiplexing (PPM) PPM• Synchronous serial interface between the microprocessor and an external device• Four internal parallel data sources can be multiplexed through the PPM— TPU3_A: 16 channels— TPU3_B: 16 channels— MIOS14: 12 PWM channels, 4 MDA channels— Internal GPIO: 16 general-purpose inputs, 16 general-purpose outputs• Software configurable stream size• Software configurable clock (TCLK) based on system clock• Software selectable clock modes (SPI mode and TDM mode)• Software selectable operation modes— Continuous mode— Start-transmit-receive (STR) mode• Software configurable internal modules interconnect (shorting)MPC561/MPC562 / MPC563/MPC564 Optional FeaturesThe following are optional features of the MPC561/MPC562 / MPC563/MPC564:• 56-MHz operation (40 MHz is default)• Code compression supported on the MPC562 and the MPC564— Compression reduces instruction memory requirements by 40-50%— Compression optimized for automotive (non-cached) applications • 512 Kbytes flash (available on the MPC563/MPC564 only)— Single array— Page mode read— Block (64 Kbytes) erasable— External 4.75- to 5.25-V VFLASH program, erase, and read power supplyFigure 1 MPC561/MPC562 / MPC563/MPC564 Block DiagramE-BUSMPC5xx Core L-BUSU-BUSIMB3+FPUSIUBuffer Burst Int.L2U I/FUIMB QSMCM MIOS14DPTRAM8-Kbyte READIQADC64JTAGTPU3QADC64TPU332-Kbyte CALRAM 28-Kbyte (No Overlay)4-Kbyte OverlayTou CAN Tou CANPPMSRAM Tou CAN Controller512 Kbytes Flash (on MPC563/MPC564 only)Figure 2 MPC561 / MPC563 Internal Memory Map4-Kbyte Overlay Section0x30 7FFF 0x2F FFFF 0x30 00000x00 00000x38 00000x38 3FFF 0x3F FFFF0x2F C0000x2F BFFF 0x30 80000x37 FFFF 0x38 40000x07 FFFF 0x3F 7FFF 0x3F 80000x08 00000x38 00FF 0x38 01000x2F 80000x2F 7FFF UC3F Flash*512 KbytesReserved for Flash 2,605 KbytesBBC DECRAM 2 Kbytes USIU & Flash Control16 KbytesUIMB I/F & IMB Modules 32 KbytesReserved for IMB 491 Kbytes CALRAM/READI Control 256 bytes Reserved (L-bus Control)~32 KbytesReserved (L-bus Mem)464 KbytesCALRAM 32 Kbytes*NOTE: Only available on MPC563/MPC564.0x3F F0000x30 00000x30 7FFFDPTRAM (8 Kbytes)QSMCM (1 Kbyte)MIOS14 (4 Kbytes)TOUCAN_A (1 Kbyte)TOUCAN_B (1 Kbyte)UIMB Registers (128 bytes)TPU3_A (1 Kbyte)TPU3_B (1 Kbyte)QADC64_A (1 Kbyte)QADC64_B (1 Kbyte)DPTRAM Control (32 bytes)USIU Control Registers0x2F C0000x30 7C000x30 70000x30 60000x30 54000x30 50000x30 4C000x30 48000x30 44000x30 40000x30 20000x30 7400Reserved (8160 bytes)Reserved (2 Kbytes)Reserved (896 bytes)0x30 78000x2F C8000x30 7F80TOUCAN_C (1 Kbyte)0x30 5C00PPM (64 bytes)0x30 5C80Reserved (960 bytes) 0x30 0020UC3F Control Registers*0x2F 8800 Reserved for BBC 0x2F A000 BBC CONTROLFigure 3 MPC561 / MPC563 Ball Map1234567891011121314151617181920212223242526AVDDVSSVSSVSSA_TPUCH3A_TPUCH7A_TPUCH11A_TPUCH15VSSAVRLA_AN3_A NZ_PQB3A_AN51_P QB7A_AN55_PQA3A_AN56_P QA4B_AN0_AN W_PQB0B_AN48_PQB4B_AN52_M A0_PQA0B_AN56_P QA4VSSETRIG2_PCS7MDA13MDA28VSSVSSVDDVSSAB VSS VDD VSS VSS A_TPUCH2A_TPUCH6A_TPUCH10A_TPUCH14VSSA ALTREF A_AN2_A NY_PQB2A_AN50_P QB6A_AN54_MA2_PQ A2A_AN58_P QA6B_AN1_AN X_PQB1B_AN49_PQB5B_AN53_M A1_PQA1B_AN57_P QA5VSSETRIG1_PCS6MDA14MDA29VSSVDDVSSQVDDLBC VSS VSS VDD VSS A_TPUCH1A_TPUCH4A_TPUCH8A_TPUCH12NVDDL VRH A_AN0_A NW_PQB 0A_AN48_P QB4A_AN52_MA0_PQ A0A_AN59_P QA7B_AN2_AN Y_PQB2B_AN50_PQB6B_AN54_M A2_PQA2B_AN58_P QA6VDDH MDA11MDA15VDDH VDD VSS QVDDL VSS CD VSS VSS VSS VDD VSS A_TPUCH5A_TPUCH9A_TPUCH13NVDDL VDDA A_AN1_A NX_PQB1A_AN49_P QB5A_AN53_MA1_PQ A1A_AN57_P QA5B_AN3_AN Z_PQB3B_AN51_PQB7B_AN55_P QA3B_AN59_P QA7VDDH MDA12MDA27VDD VSS QVDDL VSS VSS DE VDDH VSS VSS VSS QVDDL VSS VSS VSS EF B_T2CLK_P CS4A_T2CLK_PCS5A_TPUCH 0QVDDL VDDH MDA30MDA31MPWM0_MDI1F GB_TPUCH12B_TPUCH13B_TPUCH 14B_TPUCH15MPWM1_MDO2MPWM16MPWM3_PP M_RX1MPWM2_PP M_TX1GH B_TPUCH8B_TPUCH9B_TPUCH 10B_TPUCH11MPWM17_M DO3MPWM18_MD O6MPWM19_MDO7MPIO32B5_MDO5HJ B_TPUCH4B_TPUCH5B_TPUCH6B_TPUCH7MPIO32B6_MPWM4_MDO6MPIO32B7_MP WM5MPIO32B8_MPWM20MPIO32B9_MPWM21JK B_TPUCH0B_TPUCH1B_TPUCH2B_TPUCH3MPIO32B12_C_CNTX0MPIO32B11_C _CNRX0MPIO32B10_PPM_TSYNC MPIO32B13_PPM_TCLK KLJCOMP_RS TI_B TCK_DSCK_MCKI B_CNRX0B_CNTX0VSS VSS VSS VSS VSS VSS VF0_MPIO32B0_MDO1VF1_MPIO32B 1_MCKO MPIO32B15_PPM_TX0MPIO32B14_PPM_RX0LM TDI_DSDI_MDI0TMS_EVTI _B VDDSRA MTDO_DSDO_MDO0VSS VSS VSS VSS VSS VSS A_CNTX0VF2_MPIO32B2_MSEI_B VFLS0_MPIO32B3_MSEO_BVFLS1_MPIO 32B4M N IRQ3_B_KR_B_RETRY _B_SGPIO C3IWP0_VFL S0IWP1_VFL S1SGPIOC6_FRZ_PTR_BVSS VSS VSS VSS VSS VSSPCS2_QGPI O2PCS1_QGPIO1PCS0_SS_B_QGPIO0A_CNRX0NP IRQ4_B_AT 2_SGPIOC4IRQ2_B_CR_B_SGPIOC2_MDO5_MTSIRQ0_B_S GPIOC0_MDO4IRQ1_B_RSV_B_SGPIOC1VSS VSS VSS VSS VSS VSSSCK_QGPIO 6MOSI_QGPIO5MISO_QGPIO4PCS3_QGPIO3PR SGPIOC7_IRQOUT_B_LWP0BB_B_VF2_IWP3BG_B_VF 0_LWP1BR_B_VF1_IWP2VSS VSS VSS VSS VSS VSSRXD1_QGPI 1TXD2_QGPO2_C_CNTX0TXD1_QGPO1PULL-SEL RTWE_B_AT0WE_B_AT1WE_B_AT 2WE_B_AT 3VSS VSS VSS VSS VSS VSS EPEE BOEPEE VDDHRXD2_QGPI2_C_CNRX0TU CS0_B CS1_B CS2_BCS3_BCLKOUT VSSF VDDF VFLASH UV RD_WR_B OE_B TEA_B TSIZ0VDD EXTCLK VSS ENGCLK_BUCLK VW TSIZ1TS_B TA_B BDIP_B HRESET_B SRESET_B PORESET_B _TRST_BKAPWRWY BURST_BBI_B_STS_B ADDR_SG PIOA12ADDR_SG PIOA11NVDDLIRQ7_B_MODC K3RSTCONF_B_TEXPVDDSYN YAA VSS VSS VSS QVDDL VSS VSS VSS XFC AA ABVSSVSSQVDDLVSSQVDDLVSSVSSVSSSYNABAC VSS QVDDL VSS NVDDL VSS ADDR_SGP IOA10ADDR_SG PIOA18ADDR_SGPI OA20ADDR_SGPIOA23NVDDL ADDR_S GPIOA26DATA_SG PIOD1DATA_SG PIOD5DATA_SGPIOD7NVDDL DATA_SG PIOD9DATA_SGP IOD11DATA_SGPIOD12NVDDL DATA_SGPIOD14VSS VDD VSS QVDDL VSS EXTAL ACAD QVDDL VSS NVDDL VSS VSS QVDDLADDR_SG PIOA13ADDR_SGPI OA16ADDR_SG PIOA19ADDR_SGP IOA21ADDR_S GPIOA24ADDR_SG PIOA25DATA_SG PIOD0DATA_SG PIOD28DATA_SGP IOD26DATA_SG PIOD24DATA_SGP IOD22DATA_SG PIOD13DATA_SGPI OD15DATA_SGPIOD16IRQ5_B_SGPIOC5_MODCK1VSS VDD VSS QVDDL XTAL ADAE VSS NVDDL VSS VSS VSS QVDDL ADDR_SG PIOA14ADDR_SGPI OA17ADDR_SG PIOA31ADDR_SGP IOA30ADDR_S GPIOA28ADDR_SG PIOA29DATA_SG PIOD30DATA_SG PIOD29DATA_SGP IOD27DATA_SG PIOD25DATA_SGP IOD23DATA_SG PIOD21DATA_SGPI OD19DATA_SGPIOD17IRQ6_B_MODCK2VSS VSS VDD VSS QVDDL AEAF NVDDL VSS VSS VSS VDDH VSS ADDR_SG PIOA15ADDR_SGPI OA9ADDR_SG PIOA8ADDR_SGP IOA22ADDR_S GPIOA27DATA_SG PIOD31DATA_SG PIOD3DATA_SG PIOD2DATA_SGP IOD4DATA_SG PIOD6DATA_SGP IOD8DATA_SG PIOD10DATA_SGPI OD20DATA_S GPIOD18VDDH VSS VSS VSS VDD VSS AF1234567891011121314151617181920212223242526MPC561 / MPC563 Ball Map(As viewed from top, through the package and silicon)NOTE: The flash balls are only available on the MPC563 and MPC564. These are no connect balls onthe MPC561 and MPC562. Flash supplies and inputs are located on the following balls: T23, T24, U24, U25. U26.Ordering InformationTable 2 lists the documents that provide a complete description of the MPC561/563 and are required to design properly with the part. Documentation is available from a local Motorola distributor, a Motorola semiconductor sales office, a Motorola Literature Distribution Center, or through the Motorola Semicon-ductor documentation page on the Internet (the source for the latest information).Table 1 MPC561/562 / MPC563/564Device Name Order Part Number 1NOTES:1. Add R2 suffix for parts shipped in tape and reel media.Package Info Temperature Range Maximum Frequency Code CompressionMPC561MPC561MZP40388 PBGA -40 – 125° C 40 MHz No MPC561MPC561CZP40388 PBGA -40 – 85° C 40 MHz No MPC561MPC561MZP56388 PBGA -40 – 125° C 56 MHz No MPC561MPC561CZP56388 PBGA -40 – 85° C 56 MHz No MPC562MPC562MZP40388 PBGA -40 – 125° C 40 MHz Yes MPC562MPC562CZP40388 PBGA -40 – 85° C 40 MHz Yes MPC562MPC562MZP56388 PBGA -40 – 125° C 56 MHz Yes MPC562MPC562CZP56388 PBGA -40 – 85° C 56 MHz Yes MPC563MPC563MZP40388 PBGA -40 – 125° C 40 MHz No MPC563MPC563CZP40388 PBGA -40 – 85° C 40 MHz No MPC563MPC563MZP56388 PBGA -40 – 125° C 56 MHz No MPC563MPC563CZP56388 PBGA -40 – 85° C 56 MHz No MPC564MPC564MZP40388 PBGA -40 – 125° C 40 MHz Yes MPC564MPC564CZP40388 PBGA -40 – 85° C 40 MHz Yes MPC564MPC564MZP56388 PBGA -40 – 125° C 56 MHz Yes MPC564MPC564CZP56388 PBGA-40 – 85° C56 MHzYesTable 2 Available DocumentationDocument Number TitleMPC561_3RM/ADMPC561/MPC563 Reference ManualAN1821/D Exception Table Relocation and Multi-Processor Address Mapping in the Embedded MPC5XX Family AN2109/D MPC555 Interrupts.AN2127/DEMC Guidelines for MPC500-Based Automotive Powertrain SystemsMPC561/MPC563 PRODUCTBRIEF MOTOROLA11Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty,representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers,employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.OnCE, DigitalDNA, and the DigitalDNA logo are trademarks of Motorola, Inc.Order Number MPC561PB/DHow to reach us:USA/EUROPEMotorola Literature DistributionP.O. Box 5405Denver, Colorado 802171-303-675-21401-800-441-2447Technical Information Center1-800-521-6274JAPAN Motorola Japan Ltd.SPS, Technical Information Center 3-20-1, Minami-Azabu, Minato-ku Tokyo 106-8573 Japan 81-3-3440-3569ASIA/PACIFICMotorola Semiconductors H.K. Ltd.Silicon Harbour Centre2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong852-********Home Page /semiconductors。
RiCoh MP 4054 MP 5054 MP 6054 多功能黑白复印机打印机传真扫描仪说明书
CopierPrinterFacsimileScannerMP 6054ppmmonochrome60MP 4054ppmmonochrome40MP 5054ppmmonochrome50Manage information — and new opportunities — effortlessly You’re the expert. But what good is having all that information if you can’t share it with anybody? With the RICOH®MP 4054/MP 5054/MP 6054, you can produce and share your best ideas with more people in more locations. Whether you need to print important documents and fax them to a client, scan an invoice to your mailbox or simply copy notes from a morning meeting, you can move information quickly and intuitively from this multifunction device. Create shortcuts for frequent tasks to save time. Use your smartphone to print documents whether you’re at your desk, down the hall or outof the office. Take advantage of user authentication tools to ensure key information gets to the right people. You can even monitor user activity and energy consumption remotely, so you know if you’re making the right decisions along the way.• Print up to 60 black-and-white prints/copies per minute• Use mobile printing to produce documents from anywhere• Perform more everyday tasks using less space• Protect documents and intellectual property with user authentication• Minimize operating costs with energy-saving featuresPerform ordinary tasks with extraordinary precisionImprove the way you manage informationWork faster, make better decisionsHow quickly can you get information in the hands of those who need it themost? Use the Ricoh MP 4054/MP 5054/MP 6054 to transition from one jobto the next with ease. With recovery from sleep mode in only 4.9 seconds, youcan start moving information almost as soon as you think of it. Use the intuitive,one-touch controls to produce up to 60 black-and-white pages per minuteon a wide range of media. Convert paper documents into digital format forfaster retrieval and distribution with the standard 220-Sheet Single PassDocument Feeder (SPDF), which scans up to 180 color or black-and-whiteimages per minute. You can also use the optional OCR scanning featureto create PDF files that can be accessed simply by searching for key wordsin the document.Work from more locationsYou never know where your workday will take you. Be ready for anything— from anywhere. Print directly to the Ricoh MP 4054/MP 5054/MP 6054using Ricoh HotSpot Enterprise. Use your smartphone to connect to theMFP and print network documents at your convenience and save yourselfa long trek back to your desk. You can also bring your work with you viaa USB drive or SD card. Simply plug it into the networked MFP and printor scan documents right from the device. With the Ricoh Smart DeviceConnector app, you can copy, print, scan and fax directly from your smartdevice. Simply touch your smart device to the NFC tag on the optionalSmart Operation Panel or scan the QR Code to automatically connect tothe MFP and access these functions.Minimize steps, maximize productivityNobody knows your job better than you do — so you know how to makeit better. With the Ricoh MP 4054/MP 5054/MP 6054, you can customizeworkflows to simplify how you work. Use icons on the Home Screen asshortcuts to frequently used tasks and skip repetitive steps with a singletouch. Take advantage of embedded software like Ricoh GlobalScan NX toscan and convert paper documents to digital files quickly so you gain easieraccess to important information across the enterprise. Add other third-partyvendor solutions to simplify content management and other business-criticaltasks so you can work with fewer manual touchpoints and minimize errors.Impress with high-quality documentsCapture the attention of your audience with a wider range of professional-looking documents. It’s easy with the icon-driven, preset PCL6 interfacedriver. With a single click, you can produce eye-catching black-and-whitedocuments at up to 1200 dpi. Print on more types of stocks, includingthicker paper, sizes up to 11" x 17" and even envelopes from thestandard tray. Plus, you can choose between several automatedfinishers for end-to-end document production with incredible qualityin fewer steps.Simplify your workday with a wider range of capabilitiesAccess key functions convenientlyYou use your smartphone or tablet every day because it’s convenientand keeps you connected. Now you can say the same about the MFPin your office. With the Ricoh MP 4054/MP 5054/MP 6054, you cansimplify routine actions like printing, copying, scanning and faxingwith the same intuitive drag-and-drop, pinch-and-flick and swipescrolling you use on your personal devices. Navigate between keyfunctions with ease via the optional 10.1" Wide Super VGA SmartOperation Panel. You’ll have fewer steps, so you can access andshare information in only moments.Move information in more ways,from more placesYou have enough to do. Let us handle some of it for you. After all,our legacy includes finding fast, affordable ways to automate routine tasks to simplify the way you work. Need to grab an important document to share with an offsite client? Want to share newly captured information with people who may be away from the office? Use the optional Ricoh Integrated Cloud Environment (ICE) solution to manage information in the Cloud — and be spared expensive servers, equipment and maintenance. Visitors to your office can have the same convenience. They can send emails with attachments directly to the MFP for fast, easy printing without downloading print drivers. Protect what’s most importantYou have something in high demand — information. It’s important that you protect it to ensure it gets to the right people. With the Ricoh MP 4054/MP 5054/MP 6054, you can store documents atthe device for safekeeping. Release them by swiping an authorizedID card at the optional card reader or by entering a passcode on the control panel. Add watermarks to documents and mask copy when unauthorized users try to duplicate them. You can also use PDF encryption to scramble data on confidential PDFs to keep information safe. Worried about information you leave behind? With the DataOverwriteSecurity System (DOSS), images and data on thehard drive are rendered unreadable automatically.SCANCLOUD SERVICESPC/TABLET /SMARTPHONE MFPUSER INTERFACESCAN/PRINTSCANDATASCANDATAPRINTDATAPRINTUPLOAD/DOWNLOADOCRINTEGRATED CLOUD ENVIRONMENTDiscover an easier way to handle more types of jobsImprove collaboration with digital deliveryYou can’t predict when you’re going to get a great idea. But youcan know exactly when the next person gets it. Send importantinformation — including black-and-white or color images anddocuments — in PDF, TIFF or JPEG formats via Scan-to-File/Folder/URL/FTP/Email without wasting paper or time. You can compresslarger or more complex graphics files and send them just as easilywithout compromising quality. When you need to send contracts,invoices or other paper documents, use Internet Faxing, LAN Faxingor IP Fax for fast delivery. You can even use the Ricoh MP 4054/MP 5054/MP 6054 as a conduit for remote faxing and minimizethe need for additional phone lines and fax boards.Expedite everyday tasksYou’re facing enough challenges. Your office MFP shouldn’t be yournext one. On other systems, a single paper jam can derail productivityfor an entire workgroup before the problem is even discovered. Withthe Ricoh MP 4054/MP 5054/MP 6054, you only need to follow theon-screen animation and LED guide (inside the MFP) and you cantrace the source of the problem in moments. Reloading paper is justas easy. Expand capacity to 4,700 sheets with optional paper traysand print for extended runs without interruptions. In addition, you canautomate meter reads, access system settings, streamline firmwareupdates and more — all from the convenience of your desktop —so you can spend more time on core, revenue-generating tasks.Conserve energy to reduce operating costsYou’ll find just the opposite to be true with the Ricoh MP 4054/MP 5054/MP 6054. It offers low cost-per-page and best-in-classtypical electricity consumption (TEC) values so you can reduce costswhile meeting your sustainability goals. With a shorter recoverytime of less than 5 seconds from sleep mode, the Ricoh MP 4054/MP 5054/MP 6054 keeps up with today’s fast-paced businessenvironment. You can program the device to power on or off duringspecified times to conserve energy for even greater savings. Plus, thedevice meets EPEAT® Gold* criteria — a global environmental ratingsystem for electronic products — and is certified with the latestENERGY STAR™ specifications.Eco-Friendly Indicator Screen as shown on the Smart Operation Panel. *EPEAT Gold rating is applicable only in the USA.tasks in small offices and workgroups123457635Ricoh MP 6054 shown with optional one-Bin Tray, 2,000-Sheet Tandem Large Capacity Tray, 1,500-Sheet Side Large Capacity Tray and 3,000-Sheet Stapler Finisher.R3533Ricoh Americas Corporation, 70 Valley Stream Parkway, Malvern, PA 19355, 1-800-63-RICOHRicoh and the Ricoh Logo are registered trademarks of Ricoh Company, Ltd. All other trademarks are the property of their respective owners. ©2015 Ricoh Americas Corporation. All rights reserved. The content of this document, and the appearance, features and specifications of Ricoh products and services are subject to change from time to time without notice. Products are shown with optional features. While care has been taken to ensure the accuracy of this information, Ricoh makes no representation or warranties about the accuracy, completeness or adequacy of the information contained herein, and shall not be liable for any errors or omissions in these materials. Actual results will vary depending upon use of the products and services, and the conditions and factors affecting performance. The only warranties for Ricoh products and services are as set forth in the express warranty statements accompanying them.。
Addressing SR SIL3 and ASIL-D with MPC5643L
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
►Note:
No hands-on programming session
Wed. 14:00; Gene Fortanely, Multicore Initiation: System Initialization for the MPC5643L
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLink and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
MPC565MZP40中文资料
MOTOROLA
MPC565PB/D Rev. 2, 5 DNDUCTOR
PRODUCT BRIEF
MPC565/MPC566
Product Brief
MPC565/MPC566 RISC MCU with Code Compression Option
Features The MPC565 / MPC566 key features are as follows. The information inside boxes are optional features. • 40 MHz / 56 MHz operation • 56 MHz operation is available as an option. — -40° – 125 °C ambient temperature — 2.6 V ± 0.1 V external bus • External bus is compatible with external memory devices operating from 2.5 V to 3.4 V. • Extended voltage range (2.7 – 3.4 V) degrades data drive timing by 1.1 ns on date writes. — 2.6 ± 0.1 V internal logic — 5-V I/O (5.0 ± 0.25 V) • High performance RISC CPU system — High performance core • Single issue integer core • Instruction set compatible with PowerPC instruction set architecture • Precise exception model • Floating point • Code compression supported on the MPC566 — Compression reduces usage of internal or external flash memory — Compression optimized for automotive (non-cached) applications — New compression scheme increases compression performance to 40% – 50% compression — 4-Kbyte static DECRAM can be used as memory if Compression is not used. — General-purpose I/O support • On address (24) and data (32) pins • 16 GPIO in MIOS14 • Many peripheral pins can be used as GPIO when not used as primary functions • 2.6-V outputs on external bus pins • Extensive system development support — On-chip watchpoints and breakpoints — Program flow tracking — Background debug mode (BDM) Key Feature Details MPC500 System Interface (USIU, BBC, L2U) • Periodic interrupt timer, bus monitor, clocks, decrementer and time base • Clock synthesizer, power management, reset controller • External bus tolerates 5-V inputs, provides 3.3-V outputs • Enhanced interrupt controller supports a separate interrupt vector for up to eight external and 40 Internal interrupts
SPC560P34x SPC560P40x串行引导自动波特率自动扫描参考手册补充说明说明书
TN0837Technical note SPC560P34x/SPC560P40x Serial Boot with Autobaud Autoscanreference manual addendumIntroductionThe aim of this document is to give a supplementary description for serial boot modes inaddition to the description in RM0046, rev. 3 (see Section Appendix A). It is described thehardware configuration to allow the right selection of the serial boot mode with autobaud bymeans of autoscan and the RX pins configuration of serial communication peripherals(FlexCAN and LINFlex).September 2013Doc ID 022359 Rev 21/11Contents SPC560P34x, SPC560P40x Contents1Hardware configuration to select boot mode . . . . . . . . . . . . . . . . . . . . . 51.1SPC560P34x/SPC560P40x boot pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.2Autobaud feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Appendix A Reference document. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102/11Doc ID 022359 Rev 2SPC560P34x, SPC560P40x List of tables List of tablesTable 1.Hardware configuration to select boot mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 2.SPC560P34x/SPC560P40x boot pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Doc ID 022359 Rev 23/11List of figures SPC560P34x, SPC560P40x List of figuresFigure 1.BAM Autoscan code flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4/11Doc ID 022359 Rev 2SPC560P34x, SPC560P40x Hardware configuration to select boot modeDoc ID 022359 Rev 25/111 Hardware configuration to select boot modeThe SPC560P34x/SPC560P40x devices detect the serial boot mode based on external pins.To enter boot mode via FlexCAN or LINFlex, the device must be forced into an Alternate Boot Loader Mode via the FAB (Force Alternate Boot Mode), which must be asserted before initiating the reset sequence. The type of alternate boot mode is selected according to the ABS (Alternate Boot Selector) pins (see Table 1).Boot configuration pins are:●PAD A[2] - ABS[0],●PAD A[3] - ABS[1],●PAD A[4] - FABNote:PAD A[2] - ABS[0] is not bonded on SPC560P34x/SPC560P40x LQFP64 so for thispackage the option 'FlexCAN without Autobaud ' is not available and the internal pull-down on PAD A[2] assures that it is at low logical value at reset."1.1 SPC560P34x/SPC560P40x boot pinsThe TX/RX pin (LINFlex_0 and FlexCAN_0) used for serial boot and configuration boot pins to select the serial boot mode are described in the Table 2 for LQFP64 and LQFP100 packages.Table 1.Hardware configuration to select boot modeFAB (1)1.During reset the boot configuration pins are weak pull down.ABS[1,0]Standby-RAM boot flagBoot IDBoot mode1000-Serial Boot via LINFlex without autobaud 1010-Serial Boot via FlexCAN without autobaud 110-Scan of both serial interfaces (FlexCAN and LINFlex) for Serial Boot with autobaudTable 2.SPC560P34x/SPC560P40x boot pinsPort pinFunctionPin64-pin100-pin A[2](1)ABS[0]-57A[3](1)ABS[1]4164A[4](1)FAB 4875B[0]CAN_0 TX 4976B[1]CAN_0 RX 5077B[2]LIN_0 TX5179Hardware configuration to select boot modeSPC560P34x, SPC560P40x6/11Doc ID 022359 Rev 21.2 Autobaud featureSPC560P34x/SPC560P40x devices implement the autobaud feature via FlexCAN orLINFlex selecting the active serial communication peripheral by means of an autoscan routine.When autobaud configuration is selected by ABS and FAB pins, the autoscan routine starts and listens to the active bus protocol. Initially the LinFlex_0 RX pin and FlexCAN_0 RX pin are configured as GPIO inputs:●for LQFP100 internal weak pull-up enabled for both RX pins,●for LQFP64 internal weak pull-up enabled only for FlexCAN_0 RX pin.The autoscan routine waits in polling for the first LOW level to select which routine will be executed:●FlexCAN Autobaud routine ●LinFlex Autobaud routineThen the measurement baud rate is computed to configure the serial communication at the right rate. In the end of baud rate measurement, LinFlex_0 RX pin and FlexCAN_0 RX pin switches to work as dedicated pin.Baud rate measurement is using the System Timer Module (STM) which is driven by the system clock. Measurement itself is performed by software polling the related inputs as general purpose IO’s, resulting in a detection granularity that is directly related to the execution speed of the software.One main difference of the autobaud feature is that the system clock is not driven directly by the external oscillator, but it is driven by the FMPLL output. The reason is that to have an optimum resolution for baud rate measurement, the system clock needs to be nearer to the maximum allowed device’s frequency.This is achieved with the following two steps:ing the Clock Monitor Unit (CMU) and the internal RC oscillator (IRC), the external frequency is measured using the IRC as reference to determine this frequency.2.Based on the result of this measurement, the FMPLL is programmed to generate a system clock that is configured to be near, but lower, to the maximum allowed frequency.After setting up the system clock, the BAM autoscan code configures the FlexCAN RX pin (B[1] on all packages) and LINFlex RX pin (B[3] on LQFP100 or B[7] on LQFP64) as GPIO inputs and searches for FlexCAN RX pin level to verify if CAN is connected or not.B[3](2)LIN_0 RX -80(2)B[7](3)LIN_0 RX20(3)291.Weak pull down during reset.2.SPC560P34x/SPC560P40x LQFP100 package uses only PAD B[3] - pin 80 for boot via LINFLEX3.SPC560P34x/SPC560P40x LQFP64 package uses only PAD B[7] - pin 20 for boot via LINFLEXTable 2.SPC560P34x/SPC560P40x boot pins (continued)Port pinFunctionPin64-pin100-pinSPC560P34x, SPC560P40x Hardware configuration to select boot mode Then continuously waits in polling on change of RX pins level.The FlexCAN RX pin leveltakes precedence. First signal found at low level selects the serial boot routine that will beexecuted.In case a low level is detected on any input, the corresponding autobaud measurementfunctionality is started:●when FlexCAN RX (corresponds to pin B[1]) level is low, the CAN autobaudmeasurement starts and then sets up the FlexCAN baud rate accordingly;●when UART RX (corresponds to pin B[3] on LQFP100 or B[7] on LQFP64) level is low,the UART autobaud measurement starts and then sets up the LINFlex baud rateaccordingly.After performing the autobaud measurement and setting up the baud rate, thecorresponding RX input is reconfigured and the related standard download process isstarted; in case of a detected CAN transmission a download using the CAN protocol asdescribed in section “Bootstrap with FlexCAN— autobaud disabled”of RM0046, rev. 3 (seeSection Appendix A), and in case of a detected UART transmission a download using theUART protocol as described in Section” Boot from UART— autobaud disabled” of RM0046,rev.3 (see Section Appendix A).The following Figure1 identifies the corresponding flow and steps.Note:When autobaud scan is selected, initially both LINFlex_0 RX pin and FlexCAN_0 RX pin should be at high level. No external circuity should pull-down them to allow right autoscan.Doc ID 022359 Rev 27/11Hardware configuration to select boot modeSPC560P34x, SPC560P40x8/11Doc ID 022359 Rev 2Figure 1.BAM Autoscan code flowFlexCAN RX and LINFlex RX configured as GPIO inputsFlexCAN RX== 1FlexCAN RX== 0LINFlex RX== 0C A N A u t o b a u dSet matching baud rate for FlexCANAutobaud measurement Continue with FlexCANL I N F l e x A u t o b a u dSet matching baud rate for LINFlexAutobaud measurement downloadContinue with LINFlexdownloadNOYESdetecteddetectedLINFlex RX== 0detectedBoth RDX pins have to be at high level.Avoid to connect them to external pull-down resistor.If CAN is connected, after reset CAN_RX has to be at high levelSPC560P34x, SPC560P40x Reference document Appendix A Reference document1.SPC560P34/SPC560P40 32-bit MCU family built on the embedded PowerArchitecture® (RM0046, rev.3 - Doc ID 16912)Doc ID 022359 Rev 29/11Revision history SPC560P34x, SPC560P40x Revision historyTable 3.Document revision historyDate Revision Changes12-Oct-20111Initial release.18-Sep-20132Updated disclaimer.10/11Doc ID 022359 Rev 2SPC560P34x, SPC560P40xPlease Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. 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MPC5565_08资料
Freescale Semiconductor Data Sheet: Technical DataContentsDocument Number: MPC5565Rev. 2.0, 11/2008This document provides electrical specifications, pin assignments, and package diagrams for the MPC5565 microcontroller device. For functional characteristics, refer to the MPC5565 Microcontroller Reference Manual .1OverviewThe MPC5565 microcontroller (MCU) is a member of the MPC5500 family of microcontrollers built on the Power Architecture™ embedded technology. Thisfamily of parts has many new features coupled with high performance CMOS technology to provide substantial reduction of cost per feature and significant performance improvement over the MPC500 family.The host processor core of this device complies with the Power Architecture embedded category that is 100% user-mode compatible (including floating point library) with the original Power PC™ user instruction set architecture (UISA). The embedded architectureenhancements improve the performance in embedded applications. The core also has additional instructions, including digital signal processing (DSP) instructions, beyond the original Power PC instruction set.1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 43.1Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 43.2Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 53.3Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83.4EMI Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 83.5ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 93.6VRC and POR Electrical Specifications . . . . . . . . . 93.7Power-Up/Down Sequencing. . . . . . . . . . . . . . . . . 103.8DC Electrical Specifications . . . . . . . . . . . . . . . . . 133.9Oscillator and FMPLL Electrical Characteristics . . 203.10eQADC Electrical Characteristics . . . . . . . . . . . . . 223.11H7Fa Flash Memory Electrical Characteristics . . . 233.12AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 243.13AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464.1MPC5565 324 PBGA Pinouts . . . . . . . . . . . . . . . . 464.2MPC5565 324-Pin Package Dimensions. . . . . . . . 475Revision History for the MPC5565 Data Sheet . . . . . . . 495.1Changes to Revision 1.0 in Revision 2.0. . . . . . . . 495.2Changes to Revision 0.0 in Revision 1.0. . . . . . . . 52MPC5565Microcontroller Data Sheetby:Microcontroller DivisionOverviewThe MPC5500 family of parts contains many new features coupled with high performance CMOS technology to provide significant performance improvement over the MPC565.The host processor core of the MPC5565 also includes an instruction set enhancement allowing variable length encoding (VLE). This allows optional encoding of mixed 16- and 32-bit instructions. With this enhancement, it is possible to significantly reduce the code size footprint.The MPC5565 has two levels of memory hierarchy. The fastest accesses are to the 8-kilobytes (KB) unified cache. The next level in the hierarchy contains the 80-KB on-chip internal SRAM andtwo-megabytes (MB) internal flash memory. The internal SRAM and flash memory hold instructions and data. The external bus interface is designed to support most of the standard memories used with the MPC5xx family.The complex input/output timer functions of the MPC5565 are performed by an enhanced time processor unit (eTPU) engine. The eTPU engine controls 32 hardware channels. The eTPU has been enhanced over the TPU by providing: 24-bit timers, double-action hardware channels, variable number of parameters per channel, angle clock hardware, and additional control and arithmetic instructions. The eTPU is programmed using a high-level programming language.The less complex timer functions of the MPC5565 are performed by the enhanced modular input/output system (eMIOS). The eMIOS’ 24 hardware channels are capable of single-action, double-action,pulse-width modulation (PWM), and modulus-counter operations. Motor control capabilities include edge-aligned and center-aligned PWM.Off-chip communication is performed by a suite of serial protocols including controller area networks (FlexCANs), enhanced deserial/serial peripheral interfaces (DSPIs), and enhanced serial communications interfaces (eSCIs). The DSPIs support pin reduction through hardware serialization and deserialization of timer channels and general-purpose input/output (GPIOs) signals.The MCU has an on-chip enhanced queued dual analog-to-digital converter (eQADC). The 324 package has 40-channels.The system integration unit (SIU) performs several chip-wide configuration functions. Pad configuration and general-purpose input and output (GPIO) are controlled from the SIU. External interrupts and reset control are also determined by the SIU. The internal multiplexer submodule provides multiplexing of eQADC trigger sources, daisy chaining the DSPIs, and external interrupt signal multiplexing.Ordering Information2Ordering InformationFigure 1. MPC5500 Family Part Number ExampleUnless noted in this data sheet, all specifications apply from T L to T H .Table 1. Orderable Part NumbersFreescale Part Number 1All devices are PPC5565, rather than MPC5565 or SPC5565, until product qualifications are complete. Not all configurations are available in the PPC parts.Package DescriptionSpeed (MHz)Operating Temperature 22The lowest ambient operating temperature is referenced by T L ; the highest ambient operating temperature is referenced by T H.Nominal Max. 3 (f MAX )3Speed is the nominal maximum frequency. Max. speed is the maximum speed allowed including frequency modulation (FM). 82 MHz parts allow for 80 MHz system clock + 2% FM; 114 MHz parts allow for 112 MHz system clock + 2% FM; and 135 MHz parts allow for 132MHz system clock +2% FM.Min. (T L )Max.(T H )MPC5565MVZ132MPC5565 324 package Lead-free (PbFree)132135–40° C 125° CMPC5565MVZ112112114MPC5565MVZ808082MPC5565MZQ132MPC5565 324 packageLeaded (SnPb)132135–40° C 125° CMPC5565MZQ112112114MPC5565MZQ808082M PC M 80RQualification statusCore codeDevice numberTemperature range Package identifierOperating frequency (MHz)T ape and reel status Temperature Range M = –40° C to 125° CPackage Identifier ZQ = 324PBGA SnPb VZ = 324PBGA Pb-freeOperating Frequency 80 = 80 MHz 112 = 112 MHz 132 = 132 MHzTape and Reel Status R = Tape and reel (blank) = T raysQualification Status P = Pre qualificationM = Fully spec. qualified, general market flow S = Fully spec. qualified, automotive flow5565ZQ Note: Not all options are available on all devices. Refer to Table 1.Electrical Characteristics3Electrical CharacteristicsThis section contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MCU.3.1Maximum RatingsTable2. Absolute Maximum Ratings1Spec Characteristic Symbol Min.Max.Unit1 1.5 V core supply voltage 2V DD–0.3 1.7V2Flash program/erase voltage V PP–0.3 6.5V 4Flash read voltage V FLASH–0.3 4.6V 5SRAM standby voltage V STBY–0.3 1.7V 6Clock synthesizer voltage V DDSYN–0.3 4.6V7 3.3 V I/O buffer voltage V DD33–0.3 4.6V8Voltage regulator control input voltage V RC33–0.3 4.6V 9Analog supply voltage (reference to V SSA)V DDA–0.3 5.5V 10I/O supply voltage (fast I/O pads) 3V DDE–0.3 4.6V 11I/O supply voltage (slow and medium I/O pads) 3V DDEH–0.3 6.5V12DC input voltage 4V DDEH powered I/O padsV DDE powered I/O pads V IN–1.0 5–1.0 56.5 64.6 7V13Analog reference high voltage (reference to V RL)V RH–0.3 5.5V 14V SS to V SSA differential voltage V SS – V SSA–0.10.1V 15V DD to V DDA differential voltage V DD – V DDA–V DDA V DD V 16V REF differential voltage V RH – V RL–0.3 5.5V 17V RH to V DDA differential voltage V RH – V DDA–5.5 5.5V 18V RL to V SSA differential voltage V RL – V SSA–0.30.3V 19V DDEH to V DDA differential voltage V DDEH – V DDA–V DDA V DDEH V 20V DDF to V DD differential voltage V DDF – V DD–0.30.3V 21 V RC33 to V DDSYN differential voltage spec has been moved to Table9 DC Electrical Specifications, Spec 43a.22V SSSYN to V SS differential voltage V SSSYN – V SS–0.10.1V 23V RCVSS to V SS differential voltage V RCVSS – V SS–0.10.1V 24Maximum DC digital input current 8(per pin, applies to all digital pins)4I MAXD–22mA25Maximum DC analog input current 9(per pin, applies to all analog pins)I MAXA–33mA26Maximum operating temperature range 10Die junction temperatureT J T L150.0o C 27Storage temperature range T STG–55.0150.0o CElectrical Characteristics3.2Thermal CharacteristicsThe shaded rows in the following table indicate information specific to a four-layer board.28Maximum solder temperature 11Lead free (Pb-free)Leaded (SnPb)T SDR ——260.0245.0oC29Moisture sensitivity level 12MSL—3Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability or cause permanent damage to the device.21.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 o C.3All functional non-supply I/O pins are clamped to V SS and V DDE , or V DDEH .4AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of 60 hours over the complete lifetime of the device (injection current not limited for this duration).5Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.6Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDEH supplies, if themaximum injection current specification is met (2 mA for all pins) and V DDEH is within the operating voltage specifications.7Internal structures hold the input voltage less than the maximum voltage on all pads powered by V DDE supplies, if the maximum injection current specification is met (2 mA for all pins) and V DDE is within the operating voltage specifications.8T otal injection current for all pins (including both digital and analog) must not exceed 25 mA.9T otal injection current for all analog input pins must not exceed 15 mA.10Lifetime operation at these specification limits is not guaranteed.11Moisture sensitivity profile per IPC/JEDEC J-STD-020D.12Moisture sensitivity per JEDEC test method A112.Table 3. MPC5565 Thermal CharacteristicsSpec MPC5565 Thermal CharacteristicSymbol 324 PBGAUnit 1Junction to ambient 1, 2, natural convection (one-layer board)Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.2Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.R θJA 29°C/W 2Junction to ambient 1, 3, natural convection (four-layer board 2s2p)3Per JEDEC JESD51-6 with the board horizontal.R θJA 19°C/W 3Junction to ambient (@200 ft./min., one-layer board)R θJMA 23°C/W 4Junction to ambient (@200 ft./min., four-layer board 2s2p)R θJMA 16°C/W 5Junction to board 4 (four-layer board 2s2p)4Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package.R θJB 10°C/W 6Junction to case 55Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.R θJC 7°C/W 7Junction to package top 6, natural convection6Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2.ΨJT2°C/WTable 2. Absolute Maximum Ratings 1 (continued)Spec CharacteristicSymbol Min.Max.UnitElectrical Characteristics3.2.1General Notes for Specifications at Maximum Junction Temperature, can be obtained from the equation:An estimation of the device junction temperature, TJT J = T A + (RθJA× P D)where:T A = ambient temperature for the package (o C)RθJA = junction to ambient thermal resistance (o C/W)P D = power dissipation in the package (W)The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance depends on the:•Construction of the application board (number of planes)•Effective size of the board which cools the component•Quality of the thermal and electrical connections to the planes•Power dissipated by adjacent componentsConnect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.As a general rule, the value obtained on a single-layer board is within the normal range for the tightly packed printed circuit board. The value obtained on a board with the internal planes is usually within the normal range if the application board has:•One oz. (35 micron nominal thickness) internal planes•Components are well separated•Overall power dissipation on the board is less than 0.02 W/cm2The thermal performance of any component depends on the power dissipation of the surrounding components. In addition, the ambient temperature varies widely within the application. For many natural convection and especially closed box applications, the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the local ambient conditions that determine the temperature of the device.Electrical CharacteristicsAt a known board temperature, the junction temperature is estimated using the following equation:T J = T B + (R θJB × P D )where:T J = junction temperature (o C)T B = board temperature at the package perimeter (o C/W)R θJB = junction-to-board thermal resistance (o C/W) per JESD51-8P D = power dissipation in the package (W)When the heat loss from the package case to the air does not factor into the calculation, an acceptable value for the junction temperature is predictable. Ensure the application board is similar to the thermal test condition, with the component soldered to a board with internal planes.The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal resistance:R θJA = R θJC + R θCA where:R θJA = junction-to-ambient thermal resistance (o C/W)R θJC = junction-to-case thermal resistance (o C/W)R θCA = case-to-ambient thermal resistance (o C/W)R θJC is device related and is not affected by other factors. The thermal environment can be controlled to change the case-to-ambient thermal resistance, R θCA . For example, change the air flow around the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to heat sink to ambient. For most packages, a better model is required.A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal resistance and the junction-to-case thermal resistance. The junction-to-case thermal resistance describes when using a heat sink or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed circuit board. This model can be used to generate simple estimations and for computational fluid dynamics (CFD) thermal models.To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization parameter (ΨJT ) to determine the junction temperature by measuring the temperature at the top center of the package case using the following equation:T J = T T + (ΨJT × P D )where:T T = thermocouple temperature on top of the package (o C)ΨJT = thermal characterization parameter (o C/W)P D = power dissipation in the package (W)Electrical CharacteristicsThe thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling effects of the thermocouple wire.References:Semiconductor Equipment and Materials International 3081 Zanker Rd.San Jose, CA., 95134(408) 943-6900MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or 303-397-7956.JEDEC specifications are available on the web at .1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.2.G . Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applica-tions,” Electronic Packaging and Production, pp. 53–58, March 1998.3. B. Joiner and V . Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.3.3PackageThe MPC5565 is available in packaged form. Read the package options in Section 2, “Ordering Information.” Refer to Section 4, “Mechanicals,” for pinouts and package drawings.3.4EMI (Electromagnetic Interference) CharacteristicsTable 4. EMI Testing Specifications 1EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554 and applied to the MPC5500 family as generic EMI performance data. Spec CharacteristicMinimum Typical Maximum Unit 1Scan range 0.15—1000MHz 2Operating frequency ——f MAX MHz 3V DD operating voltages— 1.5—V 4V DDSYN , V RC33, V DD33, V FLASH , V DDE operating voltages — 3.3—V 5V PP , V DDEH , V DDA operating voltages — 5.0—V 6Maximum amplitude ——14 232 32Measured with the single-chip EMI program.3Measured with the expanded EMI program.dBuV7Operating temperature——25oCElectrical Characteristics3.5ESD (Electromagnetic Static Discharge) Characteristics3.6Voltage Regulator Controller (V RC ) andPower-On Reset (POR) Electrical SpecificationsThe following table lists the V RC and POR electrical specifications:Table 5. ESD Ratings 1, 21All ESD testing conforms to CDF-AEC-Q100 Stress T est Qualification for Automotive Grade Integrated Circuits.2Device failure is defined as: ‘If after exposure to ESD pulses, the device does not meet the device specification requirements, which includes the complete DC parametric and functional testing at room temperature and hot temperature.CharacteristicSymbolValue Unit ESD for human body model (HBM)2000V HBM circuit descriptionR11500ΩC100pFESD for field induced charge model (FDCM)500 (all pins)V 750 (corner pins)Number of pulses per pin:Positive pulses (HBM)Negative pulses (HBM)——11——Interval of pulses—1second Table 6. V RC and POR Electrical SpecificationsSpec CharacteristicSymbol Min.Max.Units 11.5 V(V DD ) POR 1Negated (ramp up)Asserted (ramp down)V POR151.11.1 1.351.35V23.3 V(V DDSYN ) POR 1Asserted (ramp up)Negated (ramp up)Asserted (ramp down)Negated (ramp down)V POR330.02.02.00.00.302.852.850.30V3RESET pin supply (V DDEH6) POR 1, 2Negated (ramp up)Asserted (ramp down) V POR5 2.02.0 2.852.85V 4V RC33 voltageBefore V RC allows the pass transistor to start turning onV TRANS_START 1.0 2.0V 5When V RC allows the passtransistor to completely turn on 3, 4V TRANS_ON 2.02.85V6When the voltage is greater than the voltage at which the V RC keeps the 1.5 V supply in regulation 5, 6V VRC33REG3.0—V Current can be sourced – 40o C 11.0—mA 7by V RCCTL at Tj:25oC I VRCCTL 79.0—mA 150o C7.5—mA 8Voltage differential during power up such that:V DD33 can lag V DDSYN or V DDEH6 before V DDSYN and V DDEH6 reach the V POR33 and V POR5 minimums respectively.V DD33_LAG —1.0VElectrical Characteristics3.7Power-Up/Down SequencingPower sequencing between the 1.5 V power supply and V DDSYN or the RESET power supplies is required if using an external 1.5 V power supply with V RC33 tied to ground (GND). To avoid power-sequencing, V RC33 must be powered up within the specified operating range, even if the on-chip voltage regulator controller is not used. Refer to Section 3.7.2, “Power-Up Sequence (VRC33 Grounded),” and Section 3.7.3, “Power-Down Sequence (VRC33 Grounded).”Power sequencing requires that V DD33 must reach a certain voltage where the values are read as ones before the POR signal negates. Refer to Section 3.7.1, “Input Value of Pins During POR Dependent on VDD33.”Although power sequencing is not required between V RC33 and V DDSYN during power up, V RC33 must not lead V DDSYN by more than 600 mV or lag by more than 100 mV for the V RC stage turn-on to operate within specification. Higher spikes in the emitter current of the pass transistor occur if V RC33 leads or lags V DDSYN by more than these amounts. The value of that higher spike in current depends on the board power supply circuitry and the amount of board level capacitance.Furthermore, when all of the PORs negate, the system clock starts to toggle, adding another large increase of the current consumed by V RC33. If V RC33 lags V DDSYN by more than 100 mV , the increase in current consumed can drop V DD low enough to assert the 1.5 V POR again. Oscillations are possible when the 1.5V POR asserts and stops the system clock, causing the voltage on V DD to rise until the 1.5V POR negates again. All oscillations stop when V RC33 is powered sufficiently.9Absolute value of slew rate on power supply pins ——50V/ms 10Required gain at Tj: I DD ÷ I VRCCTL (@ f sys = f MAX ) 6, 7, 8, 9– 40o C BET A 1040——25oC45——150o C55500—1The internal POR signals are V POR15, V POR33, and V POR5RESET must remain asserted until the power supplies are within the operating conditions as specified in T able 9 DC Electrical internal POR asserts.2V IL_S (T able 9, Spec15) is guaranteed to scale with V DDEH6 down to V POR5.3Supply full operating current for the 1.5 V supply when the 3.3 V supply reaches this range.4It is possible to reach the current limit during ramp up—do not treat this event as short circuit current.5At peak current for device.6Requires compliance with Freescale’s recommended board requirements and transistor recommendations. Board signal traces/routing from the V RCCTL package signal to the base of the external pass transistor and between the emitter of the pass transistor to the V DD package signals must have a maximum of 100 nH inductance and minimal resistance(less than 1 Ω). V RCCTL must have a nominal 1 μF phase compensation capacitor to ground. V DD must have a 20 μF (nominal) bulk capacitor (greater than 4 μF over all conditions, including lifetime). Place high-frequency bypass capacitors consisting of eight 0.01 μF , two 0.1 μF , and one 1 μF capacitors around the package on the V DD supply signals.7I VRCCTL is measured at the following conditions: V DD = 1.35 V , V RC33 = 3.1 V , V VRCCTL = 2.2 V .8Refer to T able 1 for the maximum operating frequency.9Values are based on I DD from high-use applications as explained in the I DD Electrical Specification. 10BET A is the worst-case external transistor BETA. It is measured on a per-part basis and calculated as (I DD ÷ I VRCCTL ).Table 6. V RC and POR Electrical Specifications (continued)Spec CharacteristicSymbol Min.Max.UnitsWhen powering down, V RC33 and V DDSYN have no delta requirement to each other, because the bypass capacitors internal and external to the device are already charged. When not powering up or down, no delta between V RC33 and V DDSYN is required for the V RC to operate within specification.There are no power up/down sequencing requirements to prevent issues such as latch-up, excessive current spikes, and so on. Therefore, the state of the I/O pins during power up and power down varies depending on which supplies are powered.Table 7 gives the pin state for the sequence cases for all pins with pad type pad_fc (fast type).Table 8 gives the pin state for the sequence cases for all pins with pad type pad_mh (medium type) and pad_sh (slow type).The values in Table 7 and Table 8 do not include the effect of the weak-pull devices on the output pins during power up.Before exiting the internal POR state, the pins go to a high-impedance state until POR negates. When the internal POR negates, the functional state of the signal during reset applies and the weak-pull devices (up or down) are enabled as defined in the device reference manual. If V DD is too low to correctly propagate the logic signals, the weak-pull devices can pull the signals to V DDE and V DDEH .To avoid this condition, minimize the ramp time of the V DD supply to a time period less than the time required to enable the external circuitry connected to the device outputs.Table 7. Pin Status for Fast Pads During the Power SequenceV DDE V DD33V DD POR Pin Status for Fast Pad Output Driverpad_fc (fast)Low ——Asserted Low V DDE Low Low Asserted High V DDE Low V DD Asserted HighV DDE V DD33Low Asserted High impedance (Hi-Z)V DDE V DD33V DD Asserted Hi-Z V DDEV DD33V DDNegatedFunctionalTable 8. Pin Status for Medium and Slow Pads During the Power SequenceV DDEH V DD POR Pin Status for Medium and Slow Pad Output Driverpad_mh (medium) pad_sh (slow)Low —Asserted LowV DDEH Low Asserted High impedance (Hi-Z)V DDEH V DD Asserted Hi-Z V DDEHV DDNegatedFunctional。
mpc5674f 单片机参考手册说明书
MPC5674F MicrocontrollerReference ManualDevices Supported:MPC5674FMPC5673FMPC5674FRMRev. 7Feb 2015This page is intentionally left blank.MPC5674F Microcontroller Reference Manual, Rev. 7ii Freescale SemiconductorTable of ContentsChapter1Device Overview1.1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.1MPC5500 and MPC5600 Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-41.2.1Critical Performance Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-41.2.2Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-51.2.3Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-51.2.4Chip-Level Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-51.2.5Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-61.2.6Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-91.2.6.1 High-Performance e200z7 Core Processor . . . . . . . . . . . . . . . . . . . . . 1-91.2.6.2 Crossbar Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-101.2.6.3 Enhanced Direct Memory Access Controller (eDMA2) . . . . . . . . . . . . 1-101.2.6.4 Interrupt Controller (INTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-111.2.6.5 Frequency-Modulated PLL (FMPLL) . . . . . . . . . . . . . . . . . . . . . . . . . 1-121.2.6.6 External Bus Interface (EBI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-121.2.6.7 System Integration Unit (SIU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-131.2.6.8 Error Correction Status Module (ECSM) . . . . . . . . . . . . . . . . . . . . . . 1-141.2.6.9 On-Chip Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-141.2.6.10 General-Purpose Static RAM (SRAM) . . . . . . . . . . . . . . . . . . . . . . . 1-151.2.6.11 Boot Assist Module (BAM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-151.2.6.12 Enhanced Modular Input Output System (eMIOS) . . . . . . . . . . . . . . 1-151.2.6.13 Enhanced Timing Processor Unit (eTPU2) . . . . . . . . . . . . . . . . . . . . 1-161.2.6.14 Enhanced Queued Analog to Digital Converter (eQADC) . . . . . . . . 1-171.2.6.15 Deserial Serial Peripheral Interface Module (DSPI) . . . . . . . . . . . . . 1-181.2.6.16 Enhanced Serial Communication Interface Module (eSCI) . . . . . . . 1-191.2.6.17 FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-201.2.6.18 Dual-Channel FlexRay Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-211.2.6.19 Nexus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-221.2.6.20 System Timer Module (STM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-231.2.6.21 Software Watchdog Timer (SWT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-231.2.6.22 Periodic Interrupt Timer (PIT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-241.2.6.23 JTAG Controller (JTAGC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-241.2.6.24 Power Management Controller (PMC) . . . . . . . . . . . . . . . . . . . . . . . 1-25 1.3Developer Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25Chapter2Signal Descriptions2.1Pin Function Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1MPC5674F Microcontroller Reference Manual Rev. 7Freescale Semiconductor Table of Contents-i2.1.1Pad Configuration Register (PCR) PA Definition . . . . . . . . . . . . . . . . . . . . . . . 2-12.1.2LVDS Signal Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.2External Signal Descriptions, Pin Multiplexing, and Attributes . . . . . . . . . . . . . . . . . . . 2-3 2.3Detailed Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-552.3.1eTPU Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-552.3.2IRQ and GPIO Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-562.3.3eMIOS Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-572.3.4eQADC Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-582.3.5FlexRay Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-592.3.6FlexCAN Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-592.3.7eSCI Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-602.3.8DSPI Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-602.3.9EBI Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-622.3.10Reset and Clock Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-642.3.11JTAG and Nexus Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-642.3.12PMC and Power/Voltage Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-66Chapter3Resets3.1Reset Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.2Reset Vector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 3.3Reset Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23.3.1RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23.3.2RSTOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 3.4FMPLL Lock Gating Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 3.5Reset Source Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33.5.1Power-on Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63.5.2External Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63.5.3Loss of Lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63.5.4Loss of Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-73.5.5Core Watchdog Timer/Debug Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-73.5.6JTAG Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-73.5.7Software System Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-83.5.8Software External Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 3.6Reset Registers in the SIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 3.7Reset Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.7.1Reset Configuration Half Word (RCHW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.7.1.1 RCHW Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.7.1.2 RCHW Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.7.2Reset Configuration Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-113.7.3Reset Weak Pull Up/Down Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11MPC5674F Microcontroller Reference Manual Rev. 7Table of Contents-ii Freescale SemiconductorChapter4Power Management Controller (PMC)4.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14.1.1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14.1.1.1 Features of the Analog Portion of PMC_SMPS . . . . . . . . . . . . . . . . . . 4-24.1.1.2 Features of the Digital Portion of PMC_SMPS . . . . . . . . . . . . . . . . . . . 4-24.1.2Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.1.3PMC Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.2External Signals Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-44.2.1Signals Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 4.3Signals Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-44.3.1VDDREG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-44.3.2VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.3.3VDDSYN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.3.4VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.3.5REGCTL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.3.6REGSEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.3.7VDD33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 4.4Memory Map/Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-64.4.1Configuration Register (PMC_MCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-64.4.2Trimming Register (PMC_TRIMR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-84.4.3Status Register (PMC_SR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12 4.5Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-144.5.1PMC Internal 1.2V Voltage Regulator Selection . . . . . . . . . . . . . . . . . . . . . . . 4-154.5.2PMC Bandgap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-164.5.3VDDREG LVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-164.5.4 3.3V Internal Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-164.5.5 3.3V VDDSYN LVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-174.5.6 1.2V Voltage Regulator Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-184.5.7 1.2V VDD LVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-194.5.8Trimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-204.5.9Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-204.5.10PMC Power-on Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-204.5.11ADC Test Mux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22 4.6Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23 4.7Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-234.7.1Regulator Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-234.7.2Hardware Design Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24Chapter5Frequency Modulated Phase-Locked Loop (FMPLL)5.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15.1.1Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25.1.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2MPC5674F Microcontroller Reference Manual Rev. 7Freescale Semiconductor Table of Contents-iii5.1.3Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 5.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 5.3Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35.3.1Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35.3.2Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-45.3.2.1 FMPLL Synthesizer Status Register (SYNSR) . . . . . . . . . . . . . . . . . . . 5-45.3.2.2 FMPLL Enhanced Synthesizer Control Register 1 (ESYNCR1) . . . . . . 5-65.3.2.3 FMPLL Enhanced Synthesizer Control Register 2 (ESYNCR2) . . . . . . 5-85.3.2.4 FMPLL Synthesizer FM Control Register(SYNFMCR) . . . . . . . . . . . . 5-11 5.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135.4.1General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135.4.2PLL Off Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135.4.3Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135.4.3.1 PLL Lock Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-145.4.3.2 Loss-of-Clock Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-155.4.3.3 PLL Normal Mode Without FM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-165.4.3.4 PLL Normal Mode With Frequency Modulation . . . . . . . . . . . . . . . . . 5-18 5.5Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-215.5.1Clock Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-215.5.1.1 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-215.5.1.2 External Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-215.5.2PLL Loss-of-Lock Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-225.5.3PLL Loss-of-Clock Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22 5.6Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-225.6.1Loss-of-Lock Interrupt Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-225.6.2Loss-of-Clock Interrupt Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22Chapter6System Integration Unit (SIU)6.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16.1.1Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-26.1.2Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.1.3Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3 6.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.2.1Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.2.1.1 Reset Input (RESET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.2.1.2 Reset Output (RSTOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-56.2.1.3 General-Purpose I/O (GPIO n) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-56.2.1.4 Boot Configuration (BOOTCFG[0:1]) . . . . . . . . . . . . . . . . . . . . . . . . . . 6-56.2.1.5 I/O Weak Pullup Reset Configuration (WKPCFG) . . . . . . . . . . . . . . . . 6-66.2.1.6 External Interrupt Request Input (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . 6-6 6.3Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-76.3.1Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-106.3.1.1 MCU ID Register (SIU_MIDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-106.3.1.2 Reset Status Register (SIU_RSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11MPC5674F Microcontroller Reference Manual Rev. 7Table of Contents-iv Freescale Semiconductor6.3.1.3 System Reset Control Register (SIU_SRCR) . . . . . . . . . . . . . . . . . . . 6-156.3.1.4 External Interrupt Status Register (SIU_EISR) . . . . . . . . . . . . . . . . . . 6-156.3.1.5 DMA/Interrupt Request Enable Register (SIU_DIRER) . . . . . . . . . . . 6-166.3.1.6 DMA/Interrupt Request Select Register (SIU_DIRSR) . . . . . . . . . . . . 6-176.3.1.7 Overrun Status Register (SIU_OSR) . . . . . . . . . . . . . . . . . . . . . . . . . 6-186.3.1.8 Overrun Request Enable Register (SIU_ORER) . . . . . . . . . . . . . . . . 6-196.3.1.9 IRQ Rising-Edge Event Enable Register (SIU_IREER) . . . . . . . . . . . 6-206.3.1.10 IRQ Falling-Edge Event Enable Register (SIU_IFEER) . . . . . . . . . . 6-216.3.1.11 IRQ Digital Filter Register (SIU_IDFR) . . . . . . . . . . . . . . . . . . . . . . . 6-226.3.1.12 IRQ Filtered Input Register (SIU_IFIR) . . . . . . . . . . . . . . . . . . . . . . . 6-226.3.1.13 Pad Configuration Registers (SIU_PCR) . . . . . . . . . . . . . . . . . . . . . 6-246.3.1.14 GPIO Pin Data Output Registers 0–512 (SIU_GPDO n) . . . . . . . . . . 6-406.3.1.15 GPIO Pin Data Input Registers 0–255 (SIU_GPDI n) . . . . . . . . . . . . 6-406.3.1.16 External IRQ Input Select Register (SIU_EIISR) . . . . . . . . . . . . . . . 6-416.3.1.17 DSPI Input Select Register (SIU_DISR) . . . . . . . . . . . . . . . . . . . . . . 6-436.3.1.18 eQADC Command FIFO Trigger Source Select - IMUX Select Registers(SIU_ISEL[4-7]) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-466.3.1.19 eTPU Input Select Register (SIU_ISEL 8) . . . . . . . . . . . . . . . . . . . . 6-606.3.1.20 eQADC Advance Trigger Selection (SIU_ISEL9) . . . . . . . . . . . . . . . 6-616.3.1.21 Decimation Filter Register 1 (SIU_DECFIL1) . . . . . . . . . . . . . . . . . . 6-626.3.1.22 Decimation Filter Register 2 (SIU_DECFIL2) . . . . . . . . . . . . . . . . . . 6-646.3.1.23 Chip Configuration Register (SIU_CCR) . . . . . . . . . . . . . . . . . . . . . 6-656.3.1.24 External Clock Control Register (SIU_ECCR) . . . . . . . . . . . . . . . . . 6-666.3.1.25 Compare B Register High (SIU_CBRH) . . . . . . . . . . . . . . . . . . . . . . 6-686.3.1.26 Compare B Register Low (SIU_CBRL) . . . . . . . . . . . . . . . . . . . . . . . 6-686.3.1.27 System Clock Register (SIU_SYSDIV) . . . . . . . . . . . . . . . . . . . . . . . 6-696.3.1.28 Halt Register (SIU_HLT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-696.3.1.29 Halt Acknowledge Register (SIU_HLTACK) . . . . . . . . . . . . . . . . . . . 6-716.3.1.30 Parallel GPIO Pin Data Output Register (SIU_PGPDO0 - SIU_PGPDO15)6-736.3.1.31 Parallel GPIO Pin Data Input Register (SIU_PGPDI0 - SIU_PGPDI15) 6-746.3.1.32 Masked Parallel GPIO Pin Data Output Register (SIU_MPGPDO0 -SIU_MPGPDO31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-746.3.1.33 SIU DSPI Serialization Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-756.3.1.34 Serialized Output Signal Selection Registers for DSPI_D . . . . . . . . 6-836.3.1.35 GPIO Pin Data Input Registers (SIU_GPDI0_3 - SIU_GPDI508_511) -Standard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-85 6.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-866.4.1Pad Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-866.4.2Reset Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-876.4.2.1 Reset Boot Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-876.4.2.2 RESET Pin Glitch Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-876.4.3External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-876.4.4GPIO Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-90MPC5674F Microcontroller Reference Manual Rev. 7Freescale Semiconductor Table of Contents-v6.4.5.1 eQADC External Trigger Input Multiplexing . . . . . . . . . . . . . . . . . . . . 6-916.4.5.2 SIU External Interrupt Input Multiplexing . . . . . . . . . . . . . . . . . . . . . . 6-926.4.5.3 Multiplexed Inputs for DSPI Multiple Transfer Operation . . . . . . . . . . 6-92Chapter7System Information Module7.1SIM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17.1.1SIM Constants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1Chapter8Boot Assist Module (BAM)8.1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 8.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 8.3Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-18.3.1Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-18.3.2Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-28.3.3Internal Boot Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-28.3.4Serial Boot Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-28.3.5Development Bus Boot Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2 8.4Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2 8.5Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-38.5.1BAM Program Flow Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-38.5.2BAM Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-48.5.3Reset Configuration Half Word (RCHW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-68.5.3.1 Application Start Address Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-88.5.4Internal Boot Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-88.5.5Serial Boot Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-88.5.5.1 CAN Controller Configuration in the Fixed Baud Rate Mode . . . . . . . 8-108.5.5.2 SCI Controller Configuration in Fixed Baud Rate Mode . . . . . . . . . . . 8-118.5.5.3 Serial Boot Mode Download Protocol . . . . . . . . . . . . . . . . . . . . . . . . . 8-118.5.5.4 Download Protocol Execution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-128.5.5.5 Baud Rate Detection Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-148.5.5.6 CAN Baud Rate Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-148.5.6Booting from the Development Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-168.5.6.1 EBI Configuration for Separate Address and Data Development Bus BootMode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-168.5.6.2 EBI Configuration for multiplexed Address and Data Development BusBoot Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-178.5.7Enabling Debug of a Censored Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-17Chapter9Interrupts and Interrupt Controller (INTC)9.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1MPC5674F Microcontroller Reference Manual Rev. 7Table of Contents-vi Freescale Semiconductor9.1.2Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-29.1.3Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-49.1.4Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-59.1.4.1 Software Vector Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-59.1.4.2 Hardware Vector Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6 9.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7 9.3Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-79.3.1Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-99.3.1.1 INTC Module Configuration Register (INTC_MCR) . . . . . . . . . . . . . . . 9-99.3.1.2 INTC Current Priority Register (INTC_CPR) . . . . . . . . . . . . . . . . . . . 9-109.3.1.3 INTC Interrupt Acknowledge Register (INTC_IACKR) . . . . . . . . . . . . 9-109.3.1.4 INTC End-of-Interrupt Register (INTC_EOIR) . . . . . . . . . . . . . . . . . . 9-119.3.1.5 INTC Software Set/Clear Interrupt Registers (INTC_SSCIR0–7) . . . . 9-129.3.1.6 INTC Priority Select Registers (INTC_PSR0–479) . . . . . . . . . . . . . . . 9-13 9.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-139.4.1Interrupt Request Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-139.4.1.1 Peripheral Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-319.4.1.2 Software configurable Interrupt Requests . . . . . . . . . . . . . . . . . . . . . 9-319.4.1.3 Unique Vector for Each Interrupt Request Source . . . . . . . . . . . . . . . 9-319.4.2Priority Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-319.4.2.1 Current Priority and Preemption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-329.4.2.2 LIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-339.4.3Details on Handshaking with Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-339.4.3.1 Software Vector Mode Handshaking . . . . . . . . . . . . . . . . . . . . . . . . . 9-339.4.3.2 Hardware Vector Mode Handshaking . . . . . . . . . . . . . . . . . . . . . . . . . 9-34 9.5Initialization and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-359.5.1Initialization Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-359.5.2Interrupt Exception Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-369.5.2.1 Software Vector Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-369.5.2.2 Hardware Vector Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-379.5.3ISR, RTOS, and Task Hierarchy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-379.5.4Order of Execution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-389.5.5Priority Ceiling Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-399.5.5.1 Elevating Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-399.5.5.2 Ensuring Coherency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-399.5.6Selecting Priorities According to Request Ratesand Deadlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-429.5.7Software configurable Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-429.5.7.1 Scheduling a Lower Priority Portion of an ISR . . . . . . . . . . . . . . . . . . 9-429.5.7.2 Scheduling an ISR on Another Processor . . . . . . . . . . . . . . . . . . . . . 9-439.5.8Lowering Priority Within an ISR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-439.5.9Negating an Interrupt Request Outside of its ISR . . . . . . . . . . . . . . . . . . . . . . 9-439.5.9.1 Negating an Interrupt Request as a Side Effect of an ISR . . . . . . . . . 9-439.5.9.2 Negating Multiple Interrupt Requests in One ISR . . . . . . . . . . . . . . . . 9-44MPC5674F Microcontroller Reference Manual Rev. 7Freescale Semiconductor Table of Contents-vii。
AD5624 5644 5664 中文数据手册
INPUT REGISTER
DAC REGISTER
STRING DAC D
BUFFER
VOUTA VOUTB VOUTC VOUTD
05856-001
POWER-ON LOGIC
POWERDOWN LOGIC
图1
表1. 相关器件 产品型号 AD5624/AD5664
AD5666
描述
2.7 V至5.5 V、四通道、12/16位DAC,外 部基准电压源 2.7 V至5.5 V、四通道、16位DAC,内部 基准电压源,LDAC、CLR引脚
AD5624R-5/AD5644R-5/AD5664R-5.................................... 3 AD5624R-3/AD5644R-3/AD5664R-3.................................... 4 交流特性................................................................................... 6 时序特性................................................................................... 7 时序图 ....................................................................................... 7 绝对最大额定值 ............................................................................ 8 ESD警告.................................................................................... 8 引脚配置和功能描述.................................................................... 9 典型工作特性................................................................................. 10 术语.................................................................................................. 18 工作原理 ......................................................................................... 20 数模转换部分 .......................................................................... 20 电阻串 ....................................................................................... 20 输出放大器............................................................................... 20
对汽车片上系统采用双核架构
对汽车⽚上系统采⽤双核架构1. 简介汽车SoC⼀直以来都采⽤单核结构,因为它们不需要执⾏⼤量的计算或运⾏⾼端应⽤。
汽车系统相对简单,与其相关的应⽤和SoC也是如此。
随着汽车内部空间越来越多地采⽤电⼦设备,SoC也变得越来越复杂。
现在,业界的焦点是将汽车的⼤部分置于电⼦控制之下。
⽬前⽣产的⾼端汽车提供了电⼦稳定控制(ESC)、牵引控制系统(TCS)、⾼级驾驶员辅助系统(ADAS)等等。
这些特性要求在汽车的核⼼使⽤复杂的SoC,能够从多个外围设备以较快的速度收集、处理和传输数据。
不管单核的运⾏频率有多⾼,在执⾏多个任务时,它始终存在性能瓶颈和⼀些挑战。
以较⾼频率运⾏的单核会消耗更多的功率。
因此,单核架构⽆法满⾜超低功率应⽤的需求。
与基于单核的架构相⽐,基于双核的SOC架构在性能和功率消耗⽅⾯实现了更好的平衡。
因此,双核SoC⽬前已经被⼤量应⽤于汽车设计。
除了提供⽐单核更⾼的性能外,基于双核的架构还被⽤于安全应⽤。
安全性是汽车制造商⽐较关⼼的主要问题之⼀。
随着更多复杂应⽤的引⼊,硬件或软件出现故障的机率也⼤⼤增加。
汽车的设计必须⾜够可靠,从⽽能够检测出任何故障并采取相应的修复措施。
基于双核的SoC的架构优势也使它们受到安全应⽤的青睐。
本⽂将介绍汽车SoC中采⽤的各种双核架构• 异构双核架构• 同构双核架构1. 锁步模式(LSM)2. 去耦并⾏模式(DPM)2. 异构双核架构:顾名思义,异构架构具有两个不同的内核:由于这种架构含有两个内核,并且这两个内核分别使⽤了较⾼和较低的配置,因此较⼩的内核也被称为协处理器。
其中,主内核⽤于执⾏批量应⽤处理,⽽较⼩的内核⽤于处理⼀些不太复杂的操作,⽐如持续在I/O上发送数据。
因此即使有第⼆个内核存在,由于它的作⽤是⽀持或补充主内核,因此仍称为协处理器。
下图显⽰了MPC5668G的架构:⾯向⽹关应⽤的双核32位MCU。
图字:MPC5668G block diagram:MPC5668G 构件图;System integration:系统集成;PIT 8-ch., 32 bit:PIT 8通道,32位;Communication I/O system:通信I/O 系统;Int. control:内部控制;Osc.:振荡器;Data flash:数据闪存;Bridge:桥;standby RAM:备⽤RAM;crossbar switch:交叉开关;cache:缓存;Power architecture e200z6 core:Power architecture e200z6 内核;32-ch. eDMA:32通道eDMA;24-ch:24通道,36-ch:通道;boot assist module(BAM):启动辅助模块;Crossbar slaves:交叉从设备它提供了2个e200系列内核,采⽤PowerPC架构。
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理光5640复印机维修代码大全共26页
FT--5035(4027\4527\5632\5640等有相同之处)故障代码E101 嚗光灯故障E103 电源频率检测故障E120 /121 扫描架原位故障E124 扫描架驱动电机故障E140/141 镜头垂直方向原位传感器故障E142/143 镜头水平方向原位传感器故障E144/145第二把手扫描架原位传感器故障E191 自动图象浓度传感器调整故障E302 鼓充电辊漏电E346 显影偏压故障E351 图象浓度传感器调整故障E352色粉浓度传感器初始设置故障E353 传感器样板电压 VSP 异常《超过2。
5V》E354 鼓电压值VSG异常《不足2。
5V》E355 图象浓度传感器上限检测异常E356 图象浓度传感器下限检测异常E405 转印带充电位置故障E440 主电机故障E442 感光鼓热敏电阻故障E501/502 上/下纸盘升降电机故障E503/504/505 纸盘装置第1/2/3升降电机故障E506纸盘装置主电机卡住E507 LCT升降电机故障E522/523双面纸盘端拦板齐纸传感器故障E524/525 双面纸盘侧拦板齐纸传感器故障E451 定影器热敏电阻故障E452定影温度升温故障E453/454/457 定影温度过热E458 定影灯可复印温度异常E620 主控板-ARDF通讯故障E621 主控板-纸盘装置通讯故障E900/901 总计数器故障进入SP方式节能键107清除/停止键3秒,程序号由三级组成用数字键选择第一和第二程序号,按R/# ,如有第三级程序按+/-,按R/#键要退到上一级按清除/停止键,按三次清除/停止键退出SP方式SP方式表1-001 对位调整范围0-32 标准=161-003-001至1-003-008 供纸时序调整范围=0-32 标准=161-008 卡纸检测 0=OFF 1=ON1-103 定影器空转 0=OFF 1=ON 空转两分钟1-104 定影器温度控制 0=ON/OFF控制 1=相位控制1-105-001 定影主灯温度调整标准=180度1-105-02 节能方式温度调整1-105-03 定影温度副灯调整1-105-XXX 定影温度调整1-106 定影温度显示1-108 强制启动1-902 齐纸板间隔调整(侧档板)1-905 齐纸板间隔调整(后挡板)2-001 鼓充电电压调整(供复印)2-002-XXX 鼓充电电压显示2-03 鼓充电电压调整(供制作VSP样图)2-101-XXX 先端/尾端删边空白调整2-201-XXX 显影偏压调整2-203 显影偏压调整(供制作VSP样图)2-206-XXX 显影偏压显示2-207 强制补粉(显示屏显示“2-208-001 补粉方式选择2-208-002 补粉率(TD传感器补粉方式)2-208-003 补粉率(定量补粉方式)2-214 TD传感器初期设定2-215-XXX TD传感器输出显示2-220 TD传感器初期输出显示2-221 补粉率(检测补粉方式)2-301-XXX 转印电流调整仅供工厂使用不要改变设置2-801 搅拌显影剂2-802 鼓充电辊温度2-812 鼓反转调整2-901 鼓充电辊清洁间隔2-902 不使用3-001 ID传感器初期设定3-002 ID传感器初期设定显示3-103-XXX ID传感器输出显示3-105 VL强制检测3-106初期VLP/VLG显示3-107 当前VLP/VLG显示3-111 当前VRP/VRG显示3-112 VR强制检测3-123 鼓初始化3-801 自动过程方式选择3-901 空运转(暴光灯熄灭)3-902 强制过程控制4-001 暴光灯电压调整4-002 暴光灯电压显示4-008 垂直倍率调整4-001-XXX 镜头水平原位调整4-013 扫描架空运转4-101 水平倍率调整4-102 镜头误差校正4-103 聚焦调整4-201 自动ADS增益调整4-202 ADS初期增益显示4-203 ADS实际增益显示4-301 APS传感器功能检查4-302 选购件APS传感器(仅指LT机器)4-303 APS A5/HLT检测4-901 APS尺寸优先(指F4尺寸)4-902 APS 8K/16K检测(仅指A4机器)操作5-001 全部显示点亮5-002 优先纸路选择5-003 APS优选选择5-004 ADS优选选择5-013 计数器递增/递减选择5-017 最大复印数量(复印限制)5-019-XXX 纸尺寸设定5-101 自动复位时间设定5-102 自动节能时间设定5-103 自动纸盘切换5-104 A3/DLT加倍计数5-106 图象浓度等级校正(ADS校正)5-107-XXX 图象移动白边调整5-108 边框删除白边调整5-110 中央删除白边调整5-113 投币锁按装5-115 双面图象移动(背面白边)5-121 T/C(总数计数器)计数时序5-305 自动关机时间设定5-401 用户代码方式5-402 用户代码计数器检查5-404-XXX 用户代码计数器清除5-405 用户代码号码设定5-407-XXX 用户代码号码清除5-408 已登记用户代码总数显示5-501-001 PM周期设定5-501-002 PM 报警方式设定5-801 内存全5-802-XXX 空运转方式5-803 输入检查方式5-804 输出检查方式5-810 SC复位5-811 仅在日本使用不要改变工厂设定5-812 电话号码输入(仅指A156复印机)5-816仅在日本使用不要改变工厂设定5-905 APS A4/LT横送优先5-906 手动装订复位时间设定5-907 封页方式选择5-908 图象移动/删除选择5-909 数字键缩放/尺寸被率5-910 操作指导的语种设定(仅指A156复印机)6-001 SADF自动复位时间设定6-002 AD自由尺寸设定6-003 自由分页选择6-005 双面复印时最终的齐数原稿空白复印6-006-XXX DF对位调整6-009 DF带纸空运转6-010 自动APS选择6-011 厚/薄原稿方式选择6-101分页器安装6-102 分页器堆叠限制6-104 装订张数限制6-107 分页器空运转方式7-001 总运转时间显示7-002 原稿总计数器显示7-003 RDS/CSS复印收费计数器显示。
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MOTOROLA SEMICONDUCTOR PRODUCT BRIEFThis document contains information on a new product. Specifications and information herein are subject to change without notice.MPC561PB/DRev. 1, December 2001MPC561/MPC562 MPC563/MPC564Product BriefMPC561/MPC562 / MPC563/MPC564 RISC MCUIncluding Peripheral Pin Multiplexing withFlash and Code Compression OptionsFeaturesThe MPC561/MPC562 / MPC563/MPC564 are members of the Motorola MPC500 RISC Microcontrollerfamily. As shown in the block diagram, they are composed of:• High performance CPU system— High performance core• Single issue integer core• Compatible with PowerPC instruction set architecture• Precise exception model• Floating point• Extensive system development support— On-chip watchpoints and breakpoints— Program flow tracking— Background debug mode (BDM)— IEEE-ISTO Nexus 5001-1999 Class 3 Debug Interface— MPC500 system interface (USIU, BBC, L2U)— Fully static design— Four major power saving modes• On, doze, sleep, deep-sleep and power-down— 32-Kbyte static RAM (CALRAM)— 512-Kbyte flash (UC3F) on MPC563/MPC564— General-purpose I/O support• On address (24) and data (32) pins• 16 GPIO in MIOS14• Many peripheral pins can be used as GPIO when not used as primary functions• 2.6-V outputs on external bus pins• PPM (peripheral pin multiplexing with parallel-to-serial driver) module• Available in package or die— Plastic ball grid array (PBGA) packagingKey Feature DetailsMPC500 System Interface (USIU)• System configuration and protection features:— Periodic-interrupt timer— Bus monitor— Software watchdog timer— Real-time clock (RTC)元器件交易网— Decrementer— Time base• Clock synthesizer• Power management• Reset controller• External bus interface that tolerates 5-V inputs, provides 2.6-V outputs and supports multiple-mas-ter designs• Enhanced interrupt controller that supports up to eight external and 40 internal interrupts, simpli-fies the interrupt structure and decreases interrupt processing time• USIU supports dual mapping to map part of one internal/external memory to another external memory• USIU supports dual mapping of flash on MPC563 and MPC564 to move part of internal flash mem-ory to external bus for development• External bus, supporting non-wraparound burst for instruction fetches, with up to 8 instructions per memory cycleBurst Buffer Controller (BBC) Module• Support for enhanced interrupt controller (EIC)• Support for enhanced exception table relocation feature• Branch target buffer• Contains 2-Kbytes of decompression RAM (DECRAM) for code compression. This RAM may also be used as general-purpose RAM when code compression feature not used.Flexible Memory Protection Unit• Flexible memory protection units (MPU) in BBC and L2U• Default attributes available in one global entry• Attribute support for speculative accesses• Up to eight memory regions are supported, four for data and four for instructionsMemory Controller• Four flexible chip selects via memory controller• 24-bit address and 32-bit data buses• 4-Kbyte to one 16-Mbyte (data) or four-Gbyte (instruction) region size support• Supports enhanced external burst• Up to eight-beat transfer bursts, two-clock minimum bus transactions• Use with SRAM, EPROM, flash and other peripherals• Byte selects or write enables• 32-bit address decodes with bit masks• Four regions512-Kbytes of CDR3 Flash EEPROM Memory (UC3F) – MPC563 Only• One 512-Kbyte module• Page read mode• Block (64 Kbytes) erasable• External 4.75- to 5.25-V VFLASH power supply for program, erase, and read operations32-Kbyte static RAM (CALRAM)• Composed of one 32-Kbyte CALRAM module— 28-Kbyte static RAM— 4-Kbyte calibration (overlay) RAM feature that allows calibration of flash-based constants • Eight 512-byte overlay regions• One clock fast accesses• Two-clock cycle access option for power saving• Keep-alive power (VDDSRAM) for data retentionGeneral-Purpose I/O Support• 24 Address pins and 32 data pins can be used for general-purpose I/O in single-chip mode • 16 GPIO in MIOS14• Many peripheral pins can be used as GPIO when not used as primary functions• 2.6-V outputs on external bus pins• 5-V outputs with slew rate controlNEXUS Debug Port (Class 3)• Compliant with Class 3 of the IEEE-ISTO Nexus 5001-1999• Program trace via branch trace messaging (BTM)• Data trace via data write messaging (DWM) and data read messaging (DRM)• Ownership trace via ownership trace messaging (OTM)• Run-time access to on-chip memory map and MPC5xx special purpose registers (SPRs) via the READI read/write access protocol• Watchpoint messaging via the auxiliary port• Reduced-port mode (1 MDI, 2 MDO) or full-port mode (2 MDI. 8 MDO)• All features configurable and controllable via the auxiliary port• Security features for production environment• Supports the RCPU debug mode via the auxiliary port• READI module can be reset independent of system resetIntegrated I/O SystemTwo Time Processor Units (TPU3)• True 5-V I/O• Two time processing units (TPU3) with16 channels each• Each TPU3 is a micro-coded timer subsystem• Eight-Kbytes of dual port TPU RAM (DPTRAM) shared by two TPU3 modules for TPU micro-code22-Channel Modular I/O System (MIOS14)• Six modulus counter sub-modules (MCSM)• 10 double-action sub-modules (DASM)• 12 dedicated PWM sub-modules (PWMSM)• One MIOS14 16-bit parallel port I/O sub-modules (MPIOSM)Two Enhanced Queued Analog-to-Digital Converter Modules (QADC64E)• Two queued analog-to-digital converter modules (QADC64_A, QADC64_B) providing a total of 32 analog channels• 16 analog input channels on each QADC64E module using internal multiplexing• Directly supports up to four external multiplexers• Up to 41 total input channels on the two QADC64E modules with external multiplexing• Software configurable to operate in Enhanced or Legacy (MPC555 compatible) mode• Unused analog channels can be used as digital input/output pins— GPIO on all channels in Enhanced mode• 10-bit A/D converter with internal sample/hold• Typical conversion time of less than 5 µs (>200 K samples/second)• Two conversion command queues of variable length• Automated queue modes initiated by:— External edge trigger— Software command— Periodic/interval timer within QADC64E module, that can be assigned to both queue 1 and 2— External Gated trigger (queue 1only)• 64 result registers— Output data is right- or left-justified, signed or unsigned• Alternate reference input (ALTREF), with control in the conversion command word (CCW)Three CAN 2.0B Controller (TouCAN) Modules• Three TouCAN modules (TOUCAN_A, TOUCAN_B, TOUCAN_C)• Each TouCAN provides the following features:— 16 message buffers each, programmable I/O modes— Maskable interrupts— Independent of the transmission medium (external transceiver is assumed)— Open network architecture, multi-master concept— High immunity to EMI— Short latency time for high-priority messages— Low-power sleep mode, with programmable wake-up on bus activity— TOUCAN_C pins are shared with MIOS14 GPIO or QSMCMQueued Serial Multi-Channel Module (QSMCM)• One queued serial module with one queued SPI and two SCIs (QSMCM)• QSMCM matches full MPC555 QSMCM functionality• Queued SPI— Provides full-duplex communication port for peripheral expansion or inter-processor commu-nication— Up to 32 preprogrammed transfers, reducing overhead— Synchronous serial interface with baud rate of up to system clock / 4— Four programmable peripheral-selects pins:— Support up to 16 devices with external decoding— Support up to eight devices with internal decoding— Special wrap-around mode allows continuous sampling of a serial peripheral for efficient inter-facing to serial analog-to-digital (A/D) converters• SCI— UART mode provides NRZ format and half- or full-duplex interface— 16 register receive buffers and 16 register transmit buffers on one SCI— Advanced error detection and optional parity generation and detection— Word-length programmable as eight or nine bits— Separate transmitter and receiver enable bits, and double buffering of data— Wake-up functions allow the CPU to run uninterrupted until either a true idle line is detected, or a new address byte is receivedPeripheral Pin Multiplexing (PPM) PPM• Synchronous serial interface between the microprocessor and an external device• Four internal parallel data sources can be multiplexed through the PPM— TPU3_A: 16 channels— TPU3_B: 16 channels— MIOS14: 12 PWM channels, 4 MDA channels— Internal GPIO: 16 general-purpose inputs, 16 general-purpose outputs• Software configurable stream size• Software configurable clock (TCLK) based on system clock• Software selectable clock modes (SPI mode and TDM mode)• Software selectable operation modes— Continuous mode— Start-transmit-receive (STR) mode• Software configurable internal modules interconnect (shorting)MPC561/MPC562 / MPC563/MPC564 Optional FeaturesThe following are optional features of the MPC561/MPC562 / MPC563/MPC564:• 56-MHz operation (40 MHz is default)• Code compression supported on the MPC562 and the MPC564— Compression reduces instruction memory requirements by 40-50%— Compression optimized for automotive (non-cached) applications • 512 Kbytes flash (available on the MPC563/MPC564 only)— Single array— Page mode read— Block (64 Kbytes) erasable— External 4.75- to 5.25-V VFLASH program, erase, and read power supplyFigure 1 MPC561/MPC562 / MPC563/MPC564 Block DiagramE-BUSMPC5xx Core L-BUSU-BUSIMB3+FPUSIUBuffer Burst Int.L2U I/FUIMB QSMCM MIOS14DPTRAM8-Kbyte READIQADC64JTAGTPU3QADC64TPU332-Kbyte CALRAM 28-Kbyte (No Overlay)4-Kbyte OverlayTou CAN Tou CANPPMSRAM Tou CAN Controller512 Kbytes Flash (on MPC563/MPC564 only)Figure 2 MPC561 / MPC563 Internal Memory Map4-Kbyte Overlay Section0x30 7FFF 0x2F FFFF 0x30 00000x00 00000x38 00000x38 3FFF 0x3F FFFF0x2F C0000x2F BFFF 0x30 80000x37 FFFF 0x38 40000x07 FFFF 0x3F 7FFF 0x3F 80000x08 00000x38 00FF 0x38 01000x2F 80000x2F 7FFF UC3F Flash*512 KbytesReserved for Flash 2,605 KbytesBBC DECRAM 2 Kbytes USIU & Flash Control16 KbytesUIMB I/F & IMB Modules 32 KbytesReserved for IMB 491 Kbytes CALRAM/READI Control 256 bytes Reserved (L-bus Control)~32 KbytesReserved (L-bus Mem)464 KbytesCALRAM 32 Kbytes*NOTE: Only available on MPC563/MPC564.0x3F F0000x30 00000x30 7FFFDPTRAM (8 Kbytes)QSMCM (1 Kbyte)MIOS14 (4 Kbytes)TOUCAN_A (1 Kbyte)TOUCAN_B (1 Kbyte)UIMB Registers (128 bytes)TPU3_A (1 Kbyte)TPU3_B (1 Kbyte)QADC64_A (1 Kbyte)QADC64_B (1 Kbyte)DPTRAM Control (32 bytes)USIU Control Registers0x2F C0000x30 7C000x30 70000x30 60000x30 54000x30 50000x30 4C000x30 48000x30 44000x30 40000x30 20000x30 7400Reserved (8160 bytes)Reserved (2 Kbytes)Reserved (896 bytes)0x30 78000x2F C8000x30 7F80TOUCAN_C (1 Kbyte)0x30 5C00PPM (64 bytes)0x30 5C80Reserved (960 bytes) 0x30 0020UC3F Control Registers*0x2F 8800 Reserved for BBC 0x2F A000 BBC CONTROLFigure 3 MPC561 / MPC563 Ball Map1234567891011121314151617181920212223242526AVDDVSSVSSVSSA_TPUCH3A_TPUCH7A_TPUCH11A_TPUCH15VSSAVRLA_AN3_A NZ_PQB3A_AN51_P QB7A_AN55_PQA3A_AN56_P QA4B_AN0_AN W_PQB0B_AN48_PQB4B_AN52_M A0_PQA0B_AN56_P QA4VSSETRIG2_PCS7MDA13MDA28VSSVSSVDDVSSAB VSS VDD VSS VSS A_TPUCH2A_TPUCH6A_TPUCH10A_TPUCH14VSSA ALTREF A_AN2_A NY_PQB2A_AN50_P QB6A_AN54_MA2_PQ A2A_AN58_P QA6B_AN1_AN X_PQB1B_AN49_PQB5B_AN53_M A1_PQA1B_AN57_P QA5VSSETRIG1_PCS6MDA14MDA29VSSVDDVSSQVDDLBC VSS VSS VDD VSS A_TPUCH1A_TPUCH4A_TPUCH8A_TPUCH12NVDDL VRH A_AN0_A NW_PQB 0A_AN48_P QB4A_AN52_MA0_PQ A0A_AN59_P QA7B_AN2_AN Y_PQB2B_AN50_PQB6B_AN54_M A2_PQA2B_AN58_P QA6VDDH MDA11MDA15VDDH VDD VSS QVDDL VSS CD VSS VSS VSS VDD VSS A_TPUCH5A_TPUCH9A_TPUCH13NVDDL VDDA A_AN1_A NX_PQB1A_AN49_P QB5A_AN53_MA1_PQ A1A_AN57_P QA5B_AN3_AN Z_PQB3B_AN51_PQB7B_AN55_P QA3B_AN59_P QA7VDDH MDA12MDA27VDD VSS QVDDL VSS VSS DE VDDH VSS VSS VSS QVDDL VSS VSS VSS EF B_T2CLK_P CS4A_T2CLK_PCS5A_TPUCH 0QVDDL VDDH MDA30MDA31MPWM0_MDI1F GB_TPUCH12B_TPUCH13B_TPUCH 14B_TPUCH15MPWM1_MDO2MPWM16MPWM3_PP M_RX1MPWM2_PP M_TX1GH B_TPUCH8B_TPUCH9B_TPUCH 10B_TPUCH11MPWM17_M DO3MPWM18_MD O6MPWM19_MDO7MPIO32B5_MDO5HJ B_TPUCH4B_TPUCH5B_TPUCH6B_TPUCH7MPIO32B6_MPWM4_MDO6MPIO32B7_MP WM5MPIO32B8_MPWM20MPIO32B9_MPWM21JK B_TPUCH0B_TPUCH1B_TPUCH2B_TPUCH3MPIO32B12_C_CNTX0MPIO32B11_C _CNRX0MPIO32B10_PPM_TSYNC MPIO32B13_PPM_TCLK KLJCOMP_RS TI_B TCK_DSCK_MCKI B_CNRX0B_CNTX0VSS VSS VSS VSS VSS VSS VF0_MPIO32B0_MDO1VF1_MPIO32B 1_MCKO MPIO32B15_PPM_TX0MPIO32B14_PPM_RX0LM TDI_DSDI_MDI0TMS_EVTI _B VDDSRA MTDO_DSDO_MDO0VSS VSS VSS VSS VSS VSS A_CNTX0VF2_MPIO32B2_MSEI_B VFLS0_MPIO32B3_MSEO_BVFLS1_MPIO 32B4M N IRQ3_B_KR_B_RETRY _B_SGPIO C3IWP0_VFL S0IWP1_VFL S1SGPIOC6_FRZ_PTR_BVSS VSS VSS VSS VSS VSSPCS2_QGPI O2PCS1_QGPIO1PCS0_SS_B_QGPIO0A_CNRX0NP IRQ4_B_AT 2_SGPIOC4IRQ2_B_CR_B_SGPIOC2_MDO5_MTSIRQ0_B_S GPIOC0_MDO4IRQ1_B_RSV_B_SGPIOC1VSS VSS VSS VSS VSS VSSSCK_QGPIO 6MOSI_QGPIO5MISO_QGPIO4PCS3_QGPIO3PR SGPIOC7_IRQOUT_B_LWP0BB_B_VF2_IWP3BG_B_VF 0_LWP1BR_B_VF1_IWP2VSS VSS VSS VSS VSS VSSRXD1_QGPI 1TXD2_QGPO2_C_CNTX0TXD1_QGPO1PULL-SEL RTWE_B_AT0WE_B_AT1WE_B_AT 2WE_B_AT 3VSS VSS VSS VSS VSS VSS EPEE BOEPEE VDDHRXD2_QGPI2_C_CNRX0TU CS0_B CS1_B CS2_BCS3_BCLKOUT VSSF VDDF VFLASH UV RD_WR_B OE_B TEA_B TSIZ0VDD EXTCLK VSS ENGCLK_BUCLK VW TSIZ1TS_B TA_B BDIP_B HRESET_B SRESET_B PORESET_B _TRST_BKAPWRWY BURST_BBI_B_STS_B ADDR_SG PIOA12ADDR_SG PIOA11NVDDLIRQ7_B_MODC K3RSTCONF_B_TEXPVDDSYN YAA VSS VSS VSS QVDDL VSS VSS VSS XFC AA ABVSSVSSQVDDLVSSQVDDLVSSVSSVSSSYNABAC VSS QVDDL VSS NVDDL VSS ADDR_SGP IOA10ADDR_SG PIOA18ADDR_SGPI OA20ADDR_SGPIOA23NVDDL ADDR_S GPIOA26DATA_SG PIOD1DATA_SG PIOD5DATA_SGPIOD7NVDDL DATA_SG PIOD9DATA_SGP IOD11DATA_SGPIOD12NVDDL DATA_SGPIOD14VSS VDD VSS QVDDL VSS EXTAL ACAD QVDDL VSS NVDDL VSS VSS QVDDLADDR_SG PIOA13ADDR_SGPI OA16ADDR_SG PIOA19ADDR_SGP IOA21ADDR_S GPIOA24ADDR_SG PIOA25DATA_SG PIOD0DATA_SG PIOD28DATA_SGP IOD26DATA_SG PIOD24DATA_SGP IOD22DATA_SG PIOD13DATA_SGPI OD15DATA_SGPIOD16IRQ5_B_SGPIOC5_MODCK1VSS VDD VSS QVDDL XTAL ADAE VSS NVDDL VSS VSS VSS QVDDL ADDR_SG PIOA14ADDR_SGPI OA17ADDR_SG PIOA31ADDR_SGP IOA30ADDR_S GPIOA28ADDR_SG PIOA29DATA_SG PIOD30DATA_SG PIOD29DATA_SGP IOD27DATA_SG PIOD25DATA_SGP IOD23DATA_SG PIOD21DATA_SGPI OD19DATA_SGPIOD17IRQ6_B_MODCK2VSS VSS VDD VSS QVDDL AEAF NVDDL VSS VSS VSS VDDH VSS ADDR_SG PIOA15ADDR_SGPI OA9ADDR_SG PIOA8ADDR_SGP IOA22ADDR_S GPIOA27DATA_SG PIOD31DATA_SG PIOD3DATA_SG PIOD2DATA_SGP IOD4DATA_SG PIOD6DATA_SGP IOD8DATA_SG PIOD10DATA_SGPI OD20DATA_S GPIOD18VDDH VSS VSS VSS VDD VSS AF1234567891011121314151617181920212223242526MPC561 / MPC563 Ball Map(As viewed from top, through the package and silicon)NOTE: The flash balls are only available on the MPC563 and MPC564. These are no connect balls onthe MPC561 and MPC562. Flash supplies and inputs are located on the following balls: T23, T24, U24, U25. U26.Ordering InformationTable 2 lists the documents that provide a complete description of the MPC561/563 and are required to design properly with the part. Documentation is available from a local Motorola distributor, a Motorola semiconductor sales office, a Motorola Literature Distribution Center, or through the Motorola Semicon-ductor documentation page on the Internet (the source for the latest information).Table 1 MPC561/562 / MPC563/564Device Name Order Part Number 1NOTES:1. Add R2 suffix for parts shipped in tape and reel media.Package Info Temperature Range Maximum Frequency Code CompressionMPC561MPC561MZP40388 PBGA -40 – 125° C 40 MHz No MPC561MPC561CZP40388 PBGA -40 – 85° C 40 MHz No MPC561MPC561MZP56388 PBGA -40 – 125° C 56 MHz No MPC561MPC561CZP56388 PBGA -40 – 85° C 56 MHz No MPC562MPC562MZP40388 PBGA -40 – 125° C 40 MHz Yes MPC562MPC562CZP40388 PBGA -40 – 85° C 40 MHz Yes MPC562MPC562MZP56388 PBGA -40 – 125° C 56 MHz Yes MPC562MPC562CZP56388 PBGA -40 – 85° C 56 MHz Yes MPC563MPC563MZP40388 PBGA -40 – 125° C 40 MHz No MPC563MPC563CZP40388 PBGA -40 – 85° C 40 MHz No MPC563MPC563MZP56388 PBGA -40 – 125° C 56 MHz No MPC563MPC563CZP56388 PBGA -40 – 85° C 56 MHz No MPC564MPC564MZP40388 PBGA -40 – 125° C 40 MHz Yes MPC564MPC564CZP40388 PBGA -40 – 85° C 40 MHz Yes MPC564MPC564MZP56388 PBGA -40 – 125° C 56 MHz Yes MPC564MPC564CZP56388 PBGA-40 – 85° C56 MHzYesTable 2 Available DocumentationDocument Number TitleMPC561_3RM/ADMPC561/MPC563 Reference ManualAN1821/D Exception Table Relocation and Multi-Processor Address Mapping in the Embedded MPC5XX Family AN2109/D MPC555 Interrupts.AN2127/DEMC Guidelines for MPC500-Based Automotive Powertrain SystemsMPC561/MPC563 PRODUCTBRIEF MOTOROLA11Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty,representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers,employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.OnCE, DigitalDNA, and the DigitalDNA logo are trademarks of Motorola, Inc.Order Number MPC561PB/DHow to reach us:USA/EUROPEMotorola Literature DistributionP.O. Box 5405Denver, Colorado 802171-303-675-21401-800-441-2447Technical Information Center1-800-521-6274JAPAN Motorola Japan Ltd.SPS, Technical Information Center 3-20-1, Minami-Azabu, Minato-ku Tokyo 106-8573 Japan 81-3-3440-3569ASIA/PACIFICMotorola Semiconductors H.K. Ltd.Silicon Harbour Centre2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong852-********Home Page /semiconductors。