Comment on ``Anisotropic s-wave superconductivity comparison with experiments on MgB_2 [A.

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s-snom工作原理

s-snom工作原理

s-snom工作原理英文回答:S-SNOM Working Principle.Scanning s-SNOM (scattering-type scanning near-field optical microscopy) is a powerful technique for imaging the local optical properties of materials with nanoscale resolution. The working principle of s-SNOM is based on the scattering of light from a sharp metallic tip that is brought into close proximity to the sample surface. The tip acts as a subwavelength antenna that concentrates the incident light field and enhances the scattering signal from the sample.The scattering signal collected by the tip is directly related to the optical properties of the sample at the nanoscale. For example, the amplitude of the scattering signal is proportional to the local refractive index, while the phase of the scattering signal is related to the localthickness and topography of the sample. By raster scanning the tip across the sample surface, it is possible to generate images that map the spatial distribution of these optical properties.S-SNOM has a number of advantages over other near-field optical microscopy techniques, such as apertureless SNOMand photoluminescence SNOM. First, s-SNOM does not require the use of a subwavelength aperture, which can be difficult to fabricate and maintain. Second, s-SNOM is compatiblewith a wide range of samples, including opaque and non-fluorescent materials. Third, s-SNOM can be used to image both the real and imaginary parts of the sample's optical response.S-SNOM has been used to study a wide range of materials, including semiconductors, metals, polymers, and biological materials. It has been used to investigate the optical properties of nanostructures, such as quantum dots and plasmonic resonators. It has also been used to study the local optical properties of materials in heterogeneous systems, such as solar cells and thin films.中文回答:S-SNOM工作原理。

各向异性s_波超导电性研究(2)

各向异性s_波超导电性研究(2)

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F ig. 6 Superflu id dens ities o f anisotropic and of isotrop ic s- w ave sup ercond u ctors
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R esearch on an isotrop ic s- wave sup erconductivity
Gong P ifeng, L iH ong, Z hang Zh im in, Zhou Zheng , D ai Jianm ing ( D epartm ent of Physics, Hua ibe iCoa l Industry T eachers Co llege, Hua ibe i 235000, Ch ina) Abstrac t: It has recently been obse rved tha tM gB2 is a superconductor w ith a h igh transition temperature. H ere the autho rs propose a m ode l of aniso trop ic s- wave superconductiv ity wh ich consistently describes the observed prope rties o f this compound, inc lud ing the therm o dynam ic and optical response in sintered M gB2 w ires. T he autho rs also de term ine the shape of the quas ipa rtic le density of states and the an i sotropy o f the upper cr itical fie ld and the superflu id density. K eyword s: A nisotropy, s- w ave superconductor, M gB2

原子力显微镜-扫描电子显微镜共定位表征系统的研发与应用

原子力显微镜-扫描电子显微镜共定位表征系统的研发与应用

第 30 卷第 1 期分析测试技术与仪器Volume 30 Number 1 2024年1月ANALYSIS AND TESTING TECHNOLOGY AND INSTRUMENTS Jan. 2024大型仪器功能开发(53 ~ 57)原子力显微镜-扫描电子显微镜共定位表征系统的研发与应用蔡 蕊,万 鹏,徐 强,吕天明,孙智广(大连理工大学分析测试中心,辽宁大连 116024)摘要:微纳加工过程中,常有样品需要进行聚焦离子束(FIB)溅射、切割,扫描电子显微镜(SEM)以及原子力显微镜(AFM)表征,而这三类仪器都需要将样品固定在样品台上才可测试,固定不佳会影响表征结果. 但固定好的样品在不同仪器之间转移、拆卸、再固定的过程中极易受到破坏. 基于以上问题,设计了AFM-SEM-FIB样品共定位系统,可实现样品在此三种仪器之间的无损转移及共定位,避免珍贵样品破坏及目标丢失,以及解决AFM扫描无法控制方向、迅速调整位点等问题. 在微纳表征中有优异的表现,系统已被开发成产品并量产销售.关键词:共定位系统;原子力显微镜;扫描电子显微镜;聚焦离子束;微纳表征中图分类号:O657;TH742 文献标志码:B 文章编号:1006-3757(2024)01-0053-05DOI:10.16495/j.1006-3757.2024.01.009Development and Application of Atomic Force Microscope-Scanning Electron Microscope Co-positioning Characterization SystemCAI Rui, WAN Peng, XU Qiang, LV Tianming, SUN Zhiguang(Instrumental Analysis Center, Dalian University of Technology, Dalian 116024, Liaoning China)Abstract:In the process of micro-nano machining, samples often need to be sputtered and cut by focused ion beam (FIB), and characterized by scanning electron microscope (SEM) and atomic force microscope (AFM). Samples need to be fixed on the sample table before tested by these three instruments. However, poor fixation will affect the characterization results, but the firmly fixed samples are easy to be destroyed in the process of transfer, disassembly and re-fixation between different instruments. Based on the above problems, the AFM-SEM-FIB sample co-positioning system was designed, which could realize non-destructive transfer and co-positioning of samples between the three instruments, and avoid the precious samples destruction and loss of targets. And the problems were solved that AFM scanning cannot control the direction and quickly adjust the location. With excellent performance in micro-nano characterization, the system has been developed into products and sold in large quantities.Key words:co-positioning system;atomic force microscope;scanning electron microscope;focused ion beam;micro-nano characterization收稿日期:2023−11−15; 修订日期:2023−12−19.基金项目:大连理工大学大型设备开发改造项目(SYSWX202205)[Dalian University of Technology, Large-Scale Instrument Function Development Technology Innovation Project (SYSWX202205)]作者简介:蔡蕊(1984−),女,博士,主要从事微区表征研究工作,Email:***************.cn通信作者:徐强(1978−),女,高级工程师,主要从事分子光谱及管理工作,Email:****************.cn.原子力显微镜(atomic force microscope,AFM)[1]是亚微米、纳米级形貌[2],纳米磁学[3]、电学[4]、力学[5]、生物学[6]研究领域必要的表征手段[7-8]. 但在微纳极窄样品表征时,AFM的探针只沿固定方向扫描,无法调整所需角度. 若样品放置的方向不正,受针尖性状、力学性质等影响[9],不但无法得到高质量扫描图像,而且还为后期谱图的处理(拉平基线)制造困难. 除此以外,在纳米力学摩擦力测试中,对于各向异性样品的摩擦力测试,需要样品在特定的方向上进行[10]. 而现有的AFM,尤其是生物型AFM,在对微纳极窄型等需要以一定方向呈现的样品进行扫描时,无法迅速、可控的变换样品方向,移动远距离的扫描位点.在微纳加工时,常使用聚焦离子束(focused ion beam,FIB)对样品表面原子进行剥离,以完成微纳米级表面形貌加工,加工后需要使用AFM进行形貌表征[11],或者转移到其他扫描电子显微镜(SEM)观察,以精准测量尺寸等. 而这三类仪器在测试过程中,都需要将样品固定于样品台上,保证在测试中不会移动(均为纳米级形貌表征,微小移动也会影响溅射、成像的精准度)才可进行测试. 而样品一般比较脆弱,从导电胶上取下再向不同仪器的样品台上转移时十分容易损坏样品,导致直接碎裂或者镊子用力夹持导致碎渣崩到样品表面,影响成像效果,如图1所示.为解决以上现有技术的缺点和不足之处,本设计计划提供一种AFM、SEM和FIB的样品共定位系统,其可实现仪器间样品无损转移,并通过参照点的辅助定位找到测试位点,建立起三个重要表征仪器之间的桥梁,还可实现AFM扫描方向可控、迅速调整位点等功能.1 试验部分1.1 仪器与试剂共定位系统(自主研制);原子力显微镜Nanowizard 4XP(美国Bruker公司);超高分辨场发射扫描电子显微镜7900F(JEOL日本电子株式会社);聚焦离子束Helios G4 UX(美国赛默飞世尔科技有限公司);光刻图案化后的样品(自制);FIB溅射后的沟槽样品(自制);探针SNL-10(美国Bruker公司).崩到表面的硅片渣取下时, 样品损伤碎渣、杂物, 严重影响形貌表征导致图1 样品由于拆卸造成的损坏及对AFM形貌表征的影响Fig. 1 Damage of sample caused by disassembly and its effect on AFM morphology characterization1.2 试验方法1.2.1 共定位系统的研发装置功能:(1)在AFM检测过程中,固定、快速移动样品(扫描位点),转换样品方向. (2)FIB、SEM和AFM的样品共定位系统:AFM、FIB、SEM 样品台适配模块,具有辅助定位点(与操作系统XY 坐标关联,实现定位),样品固定在该模块上,将模块放入固定器的卡槽中,即可用于AFM扫描. 将该模块从卡槽拆卸下来,即可直接作为SEM和FIB 样品台,带着固定好的样品进行检测,避免样品在不同仪器样品台间的拆卸转移过程中受到破坏.装置构造及用途:(1)转盘A,转盘下方的圆形凸起可嵌入底盘F的圆形镂空,且紧密接触,有一定阻尼,可转动,但不易打滑. 包括:两根长方形夹棍C,每根夹棍靠两根弹簧轴B固定到转盘两侧,两根夹棍C可依靠弹簧B的推力夹紧样品或样品托盘D,防止滑动. 把手螺丝E,与底盘F保持水平位置,拧松把手螺丝E可作为转动转盘A的把手,拧紧把手螺丝E,螺丝的另一端抵住底盘F的边缘,可固定好转盘. 用于调整样品的角度. 脚柱槽H-3用于放置脚柱H-2. (2)底盘F,铁质或者铝制,可吸附在AFM的载物台上(依靠磁力或吸力),底盘F 中心有圆形镂空,可将转盘A嵌入,底盘F和转盘A的接触位置有一定阻尼,可转动,但不易打滑. 形状可根据实际调节,不限制. (3)FIB、SEM样品台适配模块H,因考虑到SEM不可用带有磁性的样54分析测试技术与仪器第 30 卷品台,因此模块H为铝制. 模块H包括类圆形样品台H-1和脚柱H-2,脚柱H-2取下时为防止丢失可置于转盘A上的脚柱槽H-3中,使用时取出. 样品固定在该模块的类圆形样品台H-1上,将该类圆形样品台H-1对准位置放入样品托盘D的凹槽D-1中,两边由夹棍C夹住,用于AFM的扫描,通过转动转盘A、沿着夹棍C方向推拉样品托盘D改变角度和位置. (4)样品托盘D,长方形. 带两种尺寸的凹槽. 凹槽D-1:尺寸与普通市售载玻片尺寸吻合.尺寸微小、比较薄的样品可以先固定在载玻片上,再将载玻片置于此凹槽内,载玻片、样品托盘D被夹棍固定住,有阻尼,但可以拖动,可沿着夹棍C的方向移动样品,迅速更换扫描位置. 凹槽D-2:尺寸与FIB、SEM样品台适配模块H中类圆形样品台H-1形状一致,可放置该类圆形样品台H-1,夹棍C 夹住后,随样品托盘D移动. 如图2所示.类圆形样品台H-1取下后可直接作为SEM样品台使用. 底部中央有螺纹孔,脚柱H-2的螺纹和尺寸与SEM内用于固定样品台的螺纹柱尺寸一致,可通用. 将该模块的类圆形样品台H-1从样品托盘D的凹槽D-1中拆卸下来,即可直接拧在SEM样品台固定位置,作为SEM样品台直接用于测试,具有辅助定位点(与操作系统XY坐标关联,实现定位). 类圆形样品台H-1拧上与之匹配的脚柱H-2,即可作为FIB样品台,用于FIB的溅射等操作. 该适配模块H的尺寸适用于大部分品牌的FIB和SEM仪器,或根据SEM、FIB所需具体的尺寸制作.脚柱H-2尺寸较小,为防止丢失,不使用时可放置于转盘A上的特定脚柱槽H-3内保存. 该适配模块H无需将固定好的样品取下来转移到另外的样品台上,可避免样品在不同仪器样品台的拆卸转移过程中受到破坏,具有保护测试样品、便捷、实用性强等优点.1.2.2 微纳表面形貌表征方法AFM形貌表征条件:将微纳图案化样品或由FIB溅射的沟槽样品置于自主研制的共定位系统上,导电胶粘牢,且保证水平. 顶置10X光镜XY坐标协助定位. 使用Quantitative Imaging(QI)模式,Setpoint为 0.3 V,Zlength为 200 nm,Zspeed为 77µm/s. SEM形貌表征测试加速电压为10 kV.底盘 F 俯视图把手螺丝 E转盘 A脚柱 H-2/脚柱槽 H-3脚柱 H-2类圆形样品台 H-1类圆形样品台 H-1弹簧 B夹棍 C样品托盘 D FIB、SEM 样品台适配模块 H图2 共定位系统整体及分解图Fig. 2 Overall and decomposition diagrams of co-positioning system2 应用案例-微纳加工材料表征中的应用效果以光刻图案化后的样品为案例,对设计的共定位系统进行应用. 极紫外光刻材料的研发一直是半导体芯片产业的瓶颈之一[12],开发新型极紫外光刻胶材料具有重大的战略意义. 光刻胶膜表面形貌和粗糙度是评价光刻胶质量的重要指标[13-16]. 图案化的光刻有机膜,需要使用AFM和SEM表征证实其在电子束光刻和极紫外光刻测试中的表现. 使用本文设计的共定位系统,可以很好实现该样品在SEM、FIB和AFM之间的转换和样品定位,并且在AFM 表征中轻松实现方向调整和样品快速移位.如图3所示,光刻图案化后的样品(自制)需要先在SEM或FIB上进行电子束光刻蚀,刻蚀完毕后,在AFM上进行粗糙度测试以及3D成像. 使用所设计的共定位系统中的适配模块H作为样品台,实现了样品在三种仪器间的自由切换,无需拆卸,避免了样品损伤,还可以使用共定位功能,锁定目标区域分别进行SEM、AFM成像,操作便捷,节省了大量时间. 除此之外,以沟槽样品(自制)作为样本,使用AFM测试其沟槽的尺寸时,调整溅射的参数第 1 期蔡蕊,等:原子力显微镜-扫描电子显微镜共定位表征系统的研发与应用55后,需要先在FIB 上完成溅射,再置于AFM 上成像和测量. 若沟槽放置倾斜,会使计算存在偏差或成像出现瑕疵. 因此需要将沟槽角度调整于合适方向.如图4所示,使用所设计的适配模块H 固定样品,先后进行了FIB 和AFM 测试,利用所设计的共定位系统使得操作简便,并且测试结果优异.图4 固定于FIB 、SEM 样品台适配模块H 的类圆形样品台H-1上的FIB 溅射后的沟槽样品,需要测试其沟槽尺寸(a )经AFM 表征,发现沟槽方向倾斜,(b )经转盘调整角度后,摆正方向Fig. 4 Groove samples after FIB sputtering fixed on disk-like sample stage H-1 of FIB and SEM sample tablesadaptation module H, tested size of groove(a) groove direction was tilted after AFM characterization,(b) groove positioned in right direction after adjusting angleof turntable3 结论与现有的技术相比,所设计的共定位系统可建立AFM 、SEM 和FIB 三大形貌表征仪器之间的桥梁,不但可以保护珍贵样品不被损坏,还可大幅提高样品测试效率以及效果. 另外,其快速移位和变换方向功能可大幅提升方向依赖形貌、磁学、摩擦力等测试的成功率和图像效果,并且提升原有载物台的样品测试范围和速度,方便快捷,实用性强.参考文献:Binnig G, Quate C F, Gerber C. 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Heavy fermion d-wave superconductivity a X-boson approach

Heavy fermion d-wave superconductivity a X-boson approach

a r X i v :c o n d -m a t /0311118v 1 [c o n d -m a t .s u p r -c o n ] 5 N o v 2003Heavy fermion d wave superconductivity:a X-boson approachLizardo H.C.M.Nunes a M.S.Figueira a E.V.L.de Melllo aa Institutode F´ısica da Universidade Federal FluminenseAv.Litorˆa nea s/n,24210-340Niter´o i,Rio de Janeiro,Brasil.C.P.100.0931.IntroductionRecently,we have used the X-boson method [1]to study the superconducting phase diagram of the PAM in the U →∞,where U is the on-site Coulomb repulsion,in the presence of an attractive interaction between the localized f -electrons,H = k ,σǫk ,σc †k ,σc k ,σ+ k ,σE f X k ,σσ+k ,σV (X †k ,0σc k ,σ+c †k ,σX k ,0σ)+k ,k ′W k ,k ′b †k b k ′,(1)where we only considered site independent localenergies E f,j,σ=E f,σand a constant hybridiza-tion V =V j,σ,k .The operator b †k =X †k ,0σX †−k ,0⋆We acknowledge the financial support from the Rio de Janeiro State Research Foundation (F APERJ)and Na-tional Research Council (CNPq).higher values of T c ,what suggests that the Kondo behavior of the system favors superconductivity in the X-boson approach.Nevertheless,as charge carriers are added to the system the superconduc-tivity was found both for configurations where the system presented intermediate valence (IV)and heavy fermion (HF)behavior and we have recov-ered the three characteristic regimes of the PAM:Kondo,IV and magnetic.This behavior which can-not be found for the same model by the slave-boson treatment [3],since it breaks down when the f -occupation number N f →1.Despite the fact that the model was primar-ily designed to the study of the heavy fermion compounds,theoretical descriptions of the su-perconducting phases based on two-band models have application for a large variety of systems and the model could fit into the description of the high temperature superconductors compounds (HTSC)[4]or into the new two-band supercon-ductor MgB 2.Meanwhile,unconventional super-conductors may exhibit different pair symmetries.For instance,HTSC cuprates appears to present d x 2−y 2superconductivity for some compounds and s -wave for others while for the HF compounds the crystallographic anisotropies and strong spin-orbit coupling make the task of determining the pairPreprint submitted to Elsevier Science2February 2008symmetry very difficult,athough d-wave model is still one of the leading candidates to describe superconductivity in UPt3[5].In this paper we employ the X-boson approach to compare the results for the superconducting phase diagram of an isotropic s-wave superconduc-tor with the results provided by a d x2−y2super-conductor.2.The MethodThe X-boson approach consists of introducing the variational parameter R=1− σ<Xσσ>, which modifies the Green’s functions(GF)so that it minimizes an adequate thermodynamic poten-tial while being forced to satisfy the“complete-ness”relation n0+nσ+n[6] A.C.Hewson,J.Phys.C:Solid State Phys.10,4973(1977).3。

Richtek RT4823 单元说明书

Richtek RT4823 单元说明书

RT4823Wide Input and Ultra-Low Quiescent Current Boost Converter with High EfficiencyGeneral DescriptionThe RT4823 integrates built-in power transistors, synchronous rectification, and low supply current to provide a compact solution for systems using advanced Li-Ion battery chemistries. The RT4823 is capable of supplying significant energy when the battery voltage is lower than the required voltage for system power ICs. The RT4823 is a boost regulator designed to provide a minimum output voltage from a single-cell Li-Ion battery, even when the battery voltage is below system minimum. In boost mode, output voltage regulation is guaranteed to a maximum load current of 1500mA. Quiescent current in shutdown mode is less than 1μA, which maximizes the battery life. The regulator transitions smoothly between bypass and normal boost mode. The device can be forced into bypass mode to reduce quiescent current.The RT4823 is available in the WL-CSP-9B 1.3x1.2 (BSC) package.Applications⚫NFC Device Power Supply⚫USB Charging Ports⚫PC Accessory Application (Keyboard, Mouse...etc.)⚫TWS (True Wireless Stereo) Hall Sensor⚫Gaming Device Sensor Features⚫Ultra-Low Operating Quiescent Current⚫Quickly Start-Up Time (< 400μsec)⚫3 Few External Components : 1μH Inductor, 0402 Case Size Input and 0603 Case Size Output Case Size Capacitors⚫Input Voltage Range : 1.8V to 5.5V⚫Support V IN > V OUT Operation⚫Default Boost Output Voltage Setting :V OUT = 5V⚫Maximum Continuous Load Current : 1.3A atV IN > 3.6V Boosting V OUT to 5V⚫Up to 93% Efficiency⚫EN(H) : Boost Mode⚫EN(L), BP(H) : Bypass Mode⚫EN(L), BP(L) : Shutdown Mode⚫Internal Synchronous Rectifier⚫Over-Current Protection⚫Cycle-by-Cycle Current Limit⚫Over-Voltage Protection⚫Short-Circuit Protection⚫Over-Temperature Protection⚫Small WL-CSP-9B 1.3x1.2 (BSC) PackageSimplified Application CircuitV INV OUTRT4823Ordering InformationRT4823WSC : WL-CSP-9B 1.3x1.2 (BSC)Note :Richtek products are :④ RoHScompliant and compatible with the currentrequirements of IPC/JEDEC J -STD -020.④ Suitable for use in SnPb or Pb -free soldering processes.Marking Information8B : Product CodeW : Date CodePin Configuration(TOP VIEW)VOUT GNDVIN EN BPSW V O U TSWG N DC1C2C3B3B1B2A1A2A3WL -CSP -9B 1.3x1.2 (BSC)Functional Pin DescriptionRT4823Functional Block DiagramVINVOUTENBPGNDOperationThe RT4823 combines built-in power transistors, synchronous rectification, and low supply current, and it provides a compact solution for system using advanced Li-Ion battery chemistries.In boost mode, output voltage regulation is guaranteed to maximum load current of 1.5A. Quiescent current in Shutdown mode is less than 1 A, which maximizes the battery life.Power-On ResetIf input voltage is lower than POR, the internal digital and analog circuit are disabled. If input voltage is higher than POR, the Boost converter behavior is shown as follows :1. IC Digital circuit will be activated.2. Internal register will be loaded in default value.3. Boost converter will enter free-running mode (detailed information is shown in free-running mode section).4. If V OUT > 2.2V (or V IN > 2.2V), Boost converter will enter closed loop control and load in E-fuse value to the internal register.RT4823Free-Running ModeIf both voltages of V IN and V OUT are lower than 2.2V, the Boost converter will into free-running mode. In this mode, switching frequency operation is 1.5MHz and duty cycle of Boost converter is 25%. It is translation of power-on stage, and there is implemented current limit function for converter soft-start. The current limit level should be lower than 900mA.EN and BPAs Table 1 shows, there are three device states in the RT4823. When EN and BP pull low, it is shutdown mode, and the quiescent current is less than 1μA. If EN pulls high (BP do not care), the RT4823 is in boost mode and it is with low quiescent operation. If BP pulls high and EN pulls low, the RT4823 is in bypass mode. There should be a delay time (< 250μs) from EN pull-high to power ready, to guarantee normal operation.EnableThe boost can be enabled or disabled by the EN pin. When the EN pin is higher than the threshold of logic-high, the device starts operating as shown in Figure 1 operation diagram. In shutdown mode, the converter stops switching, and the internal control circuit is turned off. The output voltage is discharged by component consumption (such as Cap ESR) since there is no discharge function in this state. Soft-Start StateDuring soft-start state, if VOUT reaches 99% V OUT_Target , the RT4823 will enter boost operation. When system powers on with heavy loading (higher than pre-charge current), the RT4823 is in pre-charge state until loading release. Boost/Auto Bypass ModeThere are two normal operation modes, the boost mode, and the auto bypass mode. In the boost mode (V IN – 0.3V < V OUT_Target ), the converter boosts output voltage to V OUT_Target , and delivers power to loading by internal synchronous switches after the soft-start state. In the auto bypass mode (V IN – 0.3V ≥ V OUT_Target ), input voltage will deliver to the output terminal loadingdirectly. That can provide maximum current capacity with the RT4823. Detailed information is shown in the Boost Mode section.Boost Mode (Auto PFM/PWM Control Method) In order to save power and improve efficiency at low loads, the Boost converter operates in PFM (Pulse Frequency Modulation) as the inductor drops into DCM (DiscontinuousCurrentMode).Theswitchingfrequency is proportional to loading to reach output voltage regulation. When loading increases and inductor current is in continuous current mode, the Boost automatically enters PWM mode.RT4823Table 2. The RT4823 Start -Up DescriptionV OUTV V IN V 0.99 x VFigure 1. V OUT Mode Transition Diagram with EN L to H and V IN Variation (I OUT = 0A)ProtectionThe RT4823 features protections listed in the table below. It describes the protection behaviors.RT4823Absolute Maximum Ratings (Note 1)⚫VIN, VOUT, SW, EN, BP -------------------------------------------------------------------------------------------- –0.3V to 6.5V ⚫Power Dissipation, P D@ T A = 25°C⚫WL-CSP-9B 1.3x1.2 (BSC) ----------------------------------------------------------------------------------------- 1.54W⚫Package Thermal Resistance (Note 2)⚫WL-CSP-9B 1.3x1.2 (BSC) ----------------------------------------------------------------------------------------- 64.9︒C/W⚫Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------- 260︒C⚫Junction Temperature ------------------------------------------------------------------------------------------------ 150︒C⚫Storage Temperature Range --------------------------------------------------------------------------------------- −65︒C to 150︒C ⚫ESD Susceptibility (Note 3)HBM (Human Body Model) ----------------------------------------------------------------------------------------- 2kV Recommended Operating Conditions (Note 4)⚫Input Voltage Range (Boost Mode) ------------------------------------------------------------------------------- 1.8V to 5.5V⚫Input Voltage Range (Bypass Mode) ----------------------------------------------------------------------------- 2.2V to 5.5V⚫Output Voltage Range ----------------------------------------------------------------------------------------------- 5V⚫Input Capacitor, CIN -------------------------------------------------------------------------------------------------- 4.7μF⚫Output Capacitor, COUT -------------------------------------------------------------------------------------------- 3.5μF to 50μF ⚫Inductance, L ----------------------------------------------------------------------------------------------------------- 0.7μH to 2.2μH ⚫Input Current (Average current into SW) ----------------------------------------------------------------------- 1.8A⚫Input Current (Peak current into SW) ----------------------------------------------------------------------------- 4A⚫Ambient Temperature Range -------------------------------------------------------------------------------------- −40︒C to 85︒C ⚫Junction Temperature Range -------------------------------------------------------------------------------------- −40︒C to 125︒C Electrical Characteristics(V IN = 3.6V, C IN = 4.7μF, C OUT = 10μF, L1 = 1μH. All typical (TYP) limits apply for T A = 25︒C, unless otherwise specified. All minimum (MIN) and maximum (MAX) apply over the full operating ambient temperature range (−40︒C ≤ T A≤85︒C).RT4823RT4823Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.Note 2. θJA is measured under natural convection (still air) at T A= 25°C with the component mounted on a high effective-thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard. θJC is measured at the exposed pad of the package.Note 3. Devices are ESD sensitive. Handling precautions are recommended.Note 4. The device is not guaranteed to function outside its operating conditions.RT4823Typical Application CircuitV OUTV INTable 3. Recommended Components InformationRT4823Typical Operating CharacteristicsEfficiency vs. Output Current204060801000.0010.010.11101001000Output Current (mA)E f f i c i e n c y (%)Boost Load Regulation4.904.955.005.055.105.155.200.0010.0100.1001.00010.000Output Current (A)O u t p u t V o l t a g e (V )Boost Line Regulation4.905.005.105.205.305.405.502.43.03.64.24.85.46.0Input Voltage (V)O u t p u t V o l t a g e(V )Maximum Output Current vs. Input Voltage0.00.51.01.52.02.51.82.22.63.03.43.84.24.65.0Input Voltage (V)M a x i m u m O u t p u t C ur r e n t (A )204060801001200.0010.010.11Output Current (A)O u t p u t R i p p l e (m V )Output Ripple vs. Output Current204060801001200.0010.010.11Output Current (A)O u t p u t R i p p l e (m V )Quiescent Current vs. Input Voltage1.82.12.42.73.03.33.63.94.24.54.8Input Voltage (V)2.2 2.5 2.83.1 3.4 3.74.0 4.3 4.6 4.95.2 5.5Input Voltage (V)Pre-Charge Current vs. Input Voltage0501001502002503003504004505001.82.12.42.73.03.33.63.94.24.5Input Voltage (V)P r e -C h a r g e C u r r e n t (m A)Pre-Charge Current vs. Temperature50100150200250300350400-50-250255075100125Temperature (°C)P r e -C h a r g e C u r r en t (m A )VOUT (1V/Div)ILX (1V/Div)Boost Short CircuitTime (0.01ms/Div)SW (4V/Div)VOUT (1V/Div)ILX (0.2V/Div)Power-OnTime (0.1ms/Div)E N (2V/Div)VOUT (0.1V/Div)Load TransientTime (0.1ms/Div)IOUT (0.2V/Div)VOUT (0.1V/Div)IOUT (0.2V/Div)Time (0.1ms/Div)Load TransientVOUT (0.1V/Div)IOUT (0.5V/Div)Load Transient Time (0.1ms/Div)IOUT (0.5V/Div)Sine Waveform StabilityTime (5ms/Div)VOUT (0.1V/Div)SW (4A/Div)VOUT (0.1V/Div)Time (20ms/Div)PFM Output RippleILX (0.4A/Div)Time (20ms/Div)PFM Output RippleVOUT (0.02V/Div)ILX (0.4V/Div)PWM Output RippleTime (0.0002ms/Div)SW (4V/Div)VOUT (0.02V/Div)ILX (0.4V/Div)PWM Output RippleTime (0.0002ms/Div)SW (4V/Div)SW (2V/Div)E N (1V/Div)Bypass Mode into Boost ModeTime (1ms/Div)VOUT (1V/Div)VOUT (1V/Div)SW (2V/Div)Time (1ms/Div)Boost Mode into Bypass ModeE N (1V/Div)Application InformationEnableThe device can be enabled or disabled by the EN pin. When the EN pin is higher than the threshold of logic-high, the device starts operating with soft-start. Once the EN pin is set at low, the device will be shut down. In shutdown mode, the converter stops switching, internal control circuitry is turned off, and the load is disconnected from the input. This also means that the output voltage can drop below the input voltage during shutdown. Power Frequency Modulation (PFM)PFM is used to improve efficiency at light load. When the output voltage is lower than a set threshold voltage, the converter will operate in PFM. It raises the output voltage with several pulses until the loop exits PFM.Thermal ShutdownThe device has a built-in temperature sensor which monitors the internal junction temperature. If the temperature exceeds the threshold, the device stops operating. As soon as the IC temperature decreases below the threshold with a hysteresis, it starts operating again. The built-in hysteresis is designed to avoid unstable operation at IC temperatures near the over temperature threshold. Inductor SelectionThe primary concern of inductor selection is the maximum loading of the application. The example is given by the application condition and equations below.Application condition:V IN = 3.6V, V OUT = 5V, I OUT = 1.3A, converter efficiency = 90.2%, Frequency = 3.5MHz, L = 1μH. Step 1 : To calculate input current (I IN ).OUT OUT IN IN V II 2.001A V Eff⨯==⨯Step 2 : To calculate duty cycle of boost converter.INOUTV D 10.28V =−= Step 3 : To calculate peak current of inductor.IN L(Peak)IN V DI I 0.5 2.145A L Freq.⨯=+⨯=⨯The recommended nominal inductance value is 1μH. It is recommended to use inductor with dc saturation current ≥ 2200mA. Input Capacitor SelectionAt least an input capacitor of 4.7μF and the rate voltage of 6.3V for DC bias is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit for SW. And input capacitor placed as close as possible to the VIN and GND pins of the IC is recommended. Output Capacitor SelectionAt least a 10μF capacitors is recommended to improve V OUT ripple.Output voltage ripple is inversely proportional toC OUT .Output capacitor is selected according to output ripple which is calculated as :LOADRIPPLE(P P)ON OUT IN ON SW SW OUT INLOAD OUT SW OUT RIPPLE(P P)SW SWIV t C andV t t D t 1V therefore :VI C t 1V V and1t f −−=⨯⎛⎫=⨯=⨯− ⎪⎝⎭⎛⎫=⨯−⨯⎪⎝⎭=The maximum V RIPPLE occurs at minimum input voltage and maximum output load.Boost Converter Sleeping Mode OperationThe PFM mode and PWM mode are implemented in the RT4823. PFM mode is designed for power saving operation when the system operates at light load. There is a mode transition between PFM and PWM mode. When system loading is increasing, the operating mode transitions from PFM mode to PWM mode. Please note that, within this small loading current range, the mode changed causes output ripple to increase.Current LimitThe RT4823 employs a valley-current limit detection scheme to sense inductor current during the off-time. When the loading current is increased such that the loading is above the valley current limit threshold, the off-time is increased until the current is decreased to valley-current threshold. Next on-time begins after current is decreased to valley-current threshold. On-time is decided by (V OUT− V IN) / V OUT ratio. The output voltage decreases when further loading current increases. The current limit function is implemented by the scheme, refer to Figure 2.OCP (I LIM(5A)) Shutdown ProtectionThe RT4823 implements OCP shutdown protection. When the converter operates in boost mode, peak current limit and valley current limit function cannot protect the IC from short circuit or the huge loading. The RT4823 implements truth disconnection function. When peak current is > 5A (Typ.), the boost converter will turn off high-side MOSFET (UG) and low-side MOSFET (LG).I IN (DC) Inductor CurrentV DINI =L L fD⨯Figure 2. Inductor Currents in Current Limit OperationThermal ConsiderationsThe junction temperature should never exceed the absolute maximum junction temperature T J(MAX), listed under Absolute Maximum Ratings, to avoid permanent damage to the device. The maximum allowable power dissipation depends on the thermal resistance of the IC package, the PCB layout, the rate of surrounding airflow, and the difference between the junction and ambient temperatures. The maximum power dissipation can be calculated using the following formula :P D(MAX) = (T J(MAX) - T A) / θJAwhere TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance.For continuous operation, the maximum operating junction temperature indicated under Recommended Operating Conditions is 125°C. The junction-to- ambient thermal resistance, θJA, is highly package dependent. For a WL-CSP-9B 1.3x1.2 (BSC) package, the thermal resistance, θJA, is 64.9°C/W on a standard JEDEC 51-7 high effective-thermal-conductivity four-layer test board. The maximum power dissipation at T A = 25°C can be calculated as below :P D(MAX) = (125°C - 25°C) / (64.9°C/W) = 1.54W for a WL-CSP-9B 1.3x1.2 (BSC) package.The maximum power dissipation depends on the operating ambient temperature for the fixed TJ(MAX) and the thermal resistance, θJA. The derating curves in Figure 3 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation.Figure 3. Derating Curve of Maximum PowerDissipationLayout ConsiderationsThe PCB layout is an important step to maintain the high performance of the RT4823.Both the high current and the fast switching nodes demand full attention in the PCB layout to save the robustness of the RT4823. Improper layout might show the symptoms of poor line or load regulation, ground and output voltage shifts, stability issues, unsatisfying EMI behavior or worsened efficiency. For the best performance of the RT4823, the following PCB layout guidelines must be strictly followed.④Place the input and output capacitors as close aspossible to the input and output pins respectively for good filtering.④For thermal consideration, it is needed to maximizethe pure area for power stage area besides the SW.0.00.40.81.21.62.00255075100125Ambient Temperature (°C)MaximumPowerDissipation(W)input voltage ringing because of long wires.Layer 1Layer 4Figure 4. PCB Layout GuideOutline Dimension9B WL-CSP 1.3x1.2 Package (BSC)Footprint InformationRichtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei CityHsinchu, Taiwan, R.O.C.Tel: (8863)5526789Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.。

索尼HDR-CX900 1英寸 CMOS 传感器摄像头说明书

索尼HDR-CX900 1英寸 CMOS 传感器摄像头说明书

Key Features1” Exmor R ® CMOS sensor w/ Direct Pixel Read OutThe world’s first 1.0” CMOS sensor featuring an Exmor R ® CMOS image sensor technology. With this back-illuminated technology, the sensor doubles light sensitivity and combines with Sony’s Column A/D Conversion to reduce noise by half — a great help when photographing in dimly lit environments. Markedly reduced noise is evident even when high-sensitivity settings are used for capturing night landscapes or indoor scenes.14MP resolution video and 20MP still image captureCreate cinematic video with 14MP resolution sensor (for video) and high quality 20MP still images.Versatile shooting w/ XA VC-S, A VCHD and MP4 codecsThe HDR-CX900 records HD movies in the XA VC-S format, which uses MPEG-4 A VC/H.264 for video compression and linear PCM for audio compression, while saving files in a MP42 wrapper. The highly compressed files allow extensive record times. The camcorder also records in A VCHD, ideal for quality video for HDTV and Blu-ray disc burning. Additionally, the camcorder can shoot MP4 HD video, which is ideal for sharing over the internet at up to 28Mbps. Having the ability to switch between all three of three formats makes this camcorder an ideal tool that is versatile for creating content to live in a number of different environments.Carl Zeiss ® Vario Sonnar T* lens w/ 12x optical zoomThe HDR-CX900 comes equipped with a newly developed Carl Zeiss ® Vario-Sonnar T* lens that has cleared a series of tough performance tests. Not only is this 29mm wide-angle lens ideal for capturing grand landscapes, but it covers wide-ranging image expression thanks to maximum 12x optical zoom and 24x Clear Image zoomMulti-interface Accessory Shoe for system accessoriesUsers can expand photographic and movie shooting possibilities by attaching optional accessories via the Multi Interface Shoe, including an electronic viewfinder, powerful external flash and stereo microphone. You can also connect with a compatible remote control via Multi Terminal.BIONZ ® X Processor enables high Speed rec 120fpsThe new BIONZ ® X image processor enables the camcorder to create more naturally vivid and lifelike image quality, and higher resolution imagery.Notable features of BIONZ X technology include:1. Detail reproduction technology optimally filters edges and textures differently depending on the scene.2. Area specific noise reduction swiftly and efficiently analyzes the subject and reduces noise.This new image processing technology achieves an even better balance of exceptional detail and advanced noise control.Its ability to record at 120p enables slow-motion playback at one-fifth the speed in a 24p environment in post-processing.Optical SteadyShot™ Image Stabilization w/ Active ModeHDR-CX900/BHD Camcorder with 1" sensorWelcome to broadcast-quality HD video from the palm of your hand. The 1” image sensor is approximately 8x larger than that of typical camcorders for capturing defocused backgrounds and true cinematic depth. It’s flexible, too. Record your vision in XA VCS (up to 50mpbs), A VCHD or MP4 codecs with impressive clarity and color accuracy. There’s nothing else like it in the industry.Optical SteadyShot™ Image Stabilization with Intelligent Active Mode is an advanced optical image stabilization technology that corrects camera shake to capture scenes with phenomenal smoothness and stability. Intelligent Active Mode analyzes video frames and provides compensation with assistance from the new BIONZ® X image processing engine. Whether recording movies while strolling on vacation, shooting while chasing a child, or zooming in to capture faraway subjects, Handycam’s simple solution smoothly reproduces the scene with a higher level of stability.High contrast 0.39" OLED EVF for eye-level framingThe HDR-CX900 employs high contrast a 0.39” OLED Tru-Finder EVF which reproduces rich color and deep black. A new optical design of the EVF, using four dual-surface aspherical lenses, allows for a 33-degree wide angle view that is amazing clear through the edge of the view finder. Large 3.5" Xtra Fine LCD™ (921K)The 3.5” (16:9) Xtra Fine LCD™ screen (921K) displays sharp, bright, vivid images, letting you compose a shot more easily -- even outdoors, while enabling you to change settings to best represent the scene.Simple connectivity to smartphones via Wi-Fi®/NFCConnectivity with smartphones for One-touch sharing/One-touch remote has been simplified with Wi-Fi®/NFC control. In addition to Wi-Fi® support for connecting to smartphones, the HDR-CX900 also supports NFC (near field communication) providing “touch connection” convenience when transferring images to Android™ smartphones and tablets. Users need only touch devices to connect; no complex set-up is required. Moreover, when using Smart Remote Control — a feature that allows shutter release to be controlled by a smartphone — connection between HDR-CX900 and the smartphone can be established by simply touching devices.Specifications1. Requires NFC-compatible mobile device. Check device’s user manual for compatibility.© 2014 Sony Electronics Inc. All rights reserved. Reproduction in whole or in part without written permission is prohibited. Sony, Exmor R, BIONZ and the Sony logo are trademarks of Sony Corporation. All other trademarks are trademarks of their respective owners. Features and specifications subject to change without notice. / UPC:027********* / Updated: January 3, 2014。

物理学专业英语

物理学专业英语

华中师范大学物理学院物理学专业英语仅供内部学习参考!2014一、课程的任务和教学目的通过学习《物理学专业英语》,学生将掌握物理学领域使用频率较高的专业词汇和表达方法,进而具备基本的阅读理解物理学专业文献的能力。

通过分析《物理学专业英语》课程教材中的范文,学生还将从英语角度理解物理学中个学科的研究内容和主要思想,提高学生的专业英语能力和了解物理学研究前沿的能力。

培养专业英语阅读能力,了解科技英语的特点,提高专业外语的阅读质量和阅读速度;掌握一定量的本专业英文词汇,基本达到能够独立完成一般性本专业外文资料的阅读;达到一定的笔译水平。

要求译文通顺、准确和专业化。

要求译文通顺、准确和专业化。

二、课程内容课程内容包括以下章节:物理学、经典力学、热力学、电磁学、光学、原子物理、统计力学、量子力学和狭义相对论三、基本要求1.充分利用课内时间保证充足的阅读量(约1200~1500词/学时),要求正确理解原文。

2.泛读适量课外相关英文读物,要求基本理解原文主要内容。

3.掌握基本专业词汇(不少于200词)。

4.应具有流利阅读、翻译及赏析专业英语文献,并能简单地进行写作的能力。

四、参考书目录1 Physics 物理学 (1)Introduction to physics (1)Classical and modern physics (2)Research fields (4)V ocabulary (7)2 Classical mechanics 经典力学 (10)Introduction (10)Description of classical mechanics (10)Momentum and collisions (14)Angular momentum (15)V ocabulary (16)3 Thermodynamics 热力学 (18)Introduction (18)Laws of thermodynamics (21)System models (22)Thermodynamic processes (27)Scope of thermodynamics (29)V ocabulary (30)4 Electromagnetism 电磁学 (33)Introduction (33)Electrostatics (33)Magnetostatics (35)Electromagnetic induction (40)V ocabulary (43)5 Optics 光学 (45)Introduction (45)Geometrical optics (45)Physical optics (47)Polarization (50)V ocabulary (51)6 Atomic physics 原子物理 (52)Introduction (52)Electronic configuration (52)Excitation and ionization (56)V ocabulary (59)7 Statistical mechanics 统计力学 (60)Overview (60)Fundamentals (60)Statistical ensembles (63)V ocabulary (65)8 Quantum mechanics 量子力学 (67)Introduction (67)Mathematical formulations (68)Quantization (71)Wave-particle duality (72)Quantum entanglement (75)V ocabulary (77)9 Special relativity 狭义相对论 (79)Introduction (79)Relativity of simultaneity (80)Lorentz transformations (80)Time dilation and length contraction (81)Mass-energy equivalence (82)Relativistic energy-momentum relation (86)V ocabulary (89)正文标记说明:蓝色Arial字体(例如energy):已知的专业词汇蓝色Arial字体加下划线(例如electromagnetism):新学的专业词汇黑色Times New Roman字体加下划线(例如postulate):新学的普通词汇1 Physics 物理学1 Physics 物理学Introduction to physicsPhysics is a part of natural philosophy and a natural science that involves the study of matter and its motion through space and time, along with related concepts such as energy and force. More broadly, it is the general analysis of nature, conducted in order to understand how the universe behaves.Physics is one of the oldest academic disciplines, perhaps the oldest through its inclusion of astronomy. Over the last two millennia, physics was a part of natural philosophy along with chemistry, certain branches of mathematics, and biology, but during the Scientific Revolution in the 17th century, the natural sciences emerged as unique research programs in their own right. Physics intersects with many interdisciplinary areas of research, such as biophysics and quantum chemistry,and the boundaries of physics are not rigidly defined. New ideas in physics often explain the fundamental mechanisms of other sciences, while opening new avenues of research in areas such as mathematics and philosophy.Physics also makes significant contributions through advances in new technologies that arise from theoretical breakthroughs. For example, advances in the understanding of electromagnetism or nuclear physics led directly to the development of new products which have dramatically transformed modern-day society, such as television, computers, domestic appliances, and nuclear weapons; advances in thermodynamics led to the development of industrialization; and advances in mechanics inspired the development of calculus.Core theoriesThough physics deals with a wide variety of systems, certain theories are used by all physicists. Each of these theories were experimentally tested numerous times and found correct as an approximation of nature (within a certain domain of validity).For instance, the theory of classical mechanics accurately describes the motion of objects, provided they are much larger than atoms and moving at much less than the speed of light. These theories continue to be areas of active research, and a remarkable aspect of classical mechanics known as chaos was discovered in the 20th century, three centuries after the original formulation of classical mechanics by Isaac Newton (1642–1727) 【艾萨克·牛顿】.University PhysicsThese central theories are important tools for research into more specialized topics, and any physicist, regardless of his or her specialization, is expected to be literate in them. These include classical mechanics, quantum mechanics, thermodynamics and statistical mechanics, electromagnetism, and special relativity.Classical and modern physicsClassical mechanicsClassical physics includes the traditional branches and topics that were recognized and well-developed before the beginning of the 20th century—classical mechanics, acoustics, optics, thermodynamics, and electromagnetism.Classical mechanics is concerned with bodies acted on by forces and bodies in motion and may be divided into statics (study of the forces on a body or bodies at rest), kinematics (study of motion without regard to its causes), and dynamics (study of motion and the forces that affect it); mechanics may also be divided into solid mechanics and fluid mechanics (known together as continuum mechanics), the latter including such branches as hydrostatics, hydrodynamics, aerodynamics, and pneumatics.Acoustics is the study of how sound is produced, controlled, transmitted and received. Important modern branches of acoustics include ultrasonics, the study of sound waves of very high frequency beyond the range of human hearing; bioacoustics the physics of animal calls and hearing, and electroacoustics, the manipulation of audible sound waves using electronics.Optics, the study of light, is concerned not only with visible light but also with infrared and ultraviolet radiation, which exhibit all of the phenomena of visible light except visibility, e.g., reflection, refraction, interference, diffraction, dispersion, and polarization of light.Heat is a form of energy, the internal energy possessed by the particles of which a substance is composed; thermodynamics deals with the relationships between heat and other forms of energy.Electricity and magnetism have been studied as a single branch of physics since the intimate connection between them was discovered in the early 19th century; an electric current gives rise to a magnetic field and a changing magnetic field induces an electric current. Electrostatics deals with electric charges at rest, electrodynamics with moving charges, and magnetostatics with magnetic poles at rest.Modern PhysicsClassical physics is generally concerned with matter and energy on the normal scale of1 Physics 物理学observation, while much of modern physics is concerned with the behavior of matter and energy under extreme conditions or on the very large or very small scale.For example, atomic and nuclear physics studies matter on the smallest scale at which chemical elements can be identified.The physics of elementary particles is on an even smaller scale, as it is concerned with the most basic units of matter; this branch of physics is also known as high-energy physics because of the extremely high energies necessary to produce many types of particles in large particle accelerators. On this scale, ordinary, commonsense notions of space, time, matter, and energy are no longer valid.The two chief theories of modern physics present a different picture of the concepts of space, time, and matter from that presented by classical physics.Quantum theory is concerned with the discrete, rather than continuous, nature of many phenomena at the atomic and subatomic level, and with the complementary aspects of particles and waves in the description of such phenomena.The theory of relativity is concerned with the description of phenomena that take place in a frame of reference that is in motion with respect to an observer; the special theory of relativity is concerned with relative uniform motion in a straight line and the general theory of relativity with accelerated motion and its connection with gravitation.Both quantum theory and the theory of relativity find applications in all areas of modern physics.Difference between classical and modern physicsWhile physics aims to discover universal laws, its theories lie in explicit domains of applicability. Loosely speaking, the laws of classical physics accurately describe systems whose important length scales are greater than the atomic scale and whose motions are much slower than the speed of light. Outside of this domain, observations do not match their predictions.Albert Einstein【阿尔伯特·爱因斯坦】contributed the framework of special relativity, which replaced notions of absolute time and space with space-time and allowed an accurate description of systems whose components have speeds approaching the speed of light.Max Planck【普朗克】, Erwin Schrödinger【薛定谔】, and others introduced quantum mechanics, a probabilistic notion of particles and interactions that allowed an accurate description of atomic and subatomic scales.Later, quantum field theory unified quantum mechanics and special relativity.General relativity allowed for a dynamical, curved space-time, with which highly massiveUniversity Physicssystems and the large-scale structure of the universe can be well-described. General relativity has not yet been unified with the other fundamental descriptions; several candidate theories of quantum gravity are being developed.Research fieldsContemporary research in physics can be broadly divided into condensed matter physics; atomic, molecular, and optical physics; particle physics; astrophysics; geophysics and biophysics. Some physics departments also support research in Physics education.Since the 20th century, the individual fields of physics have become increasingly specialized, and today most physicists work in a single field for their entire careers. "Universalists" such as Albert Einstein (1879–1955) and Lev Landau (1908–1968)【列夫·朗道】, who worked in multiple fields of physics, are now very rare.Condensed matter physicsCondensed matter physics is the field of physics that deals with the macroscopic physical properties of matter. In particular, it is concerned with the "condensed" phases that appear whenever the number of particles in a system is extremely large and the interactions between them are strong.The most familiar examples of condensed phases are solids and liquids, which arise from the bonding by way of the electromagnetic force between atoms. More exotic condensed phases include the super-fluid and the Bose–Einstein condensate found in certain atomic systems at very low temperature, the superconducting phase exhibited by conduction electrons in certain materials,and the ferromagnetic and antiferromagnetic phases of spins on atomic lattices.Condensed matter physics is by far the largest field of contemporary physics.Historically, condensed matter physics grew out of solid-state physics, which is now considered one of its main subfields. The term condensed matter physics was apparently coined by Philip Anderson when he renamed his research group—previously solid-state theory—in 1967. In 1978, the Division of Solid State Physics of the American Physical Society was renamed as the Division of Condensed Matter Physics.Condensed matter physics has a large overlap with chemistry, materials science, nanotechnology and engineering.Atomic, molecular and optical physicsAtomic, molecular, and optical physics (AMO) is the study of matter–matter and light–matter interactions on the scale of single atoms and molecules.1 Physics 物理学The three areas are grouped together because of their interrelationships, the similarity of methods used, and the commonality of the energy scales that are relevant. All three areas include both classical, semi-classical and quantum treatments; they can treat their subject from a microscopic view (in contrast to a macroscopic view).Atomic physics studies the electron shells of atoms. Current research focuses on activities in quantum control, cooling and trapping of atoms and ions, low-temperature collision dynamics and the effects of electron correlation on structure and dynamics. Atomic physics is influenced by the nucleus (see, e.g., hyperfine splitting), but intra-nuclear phenomena such as fission and fusion are considered part of high-energy physics.Molecular physics focuses on multi-atomic structures and their internal and external interactions with matter and light.Optical physics is distinct from optics in that it tends to focus not on the control of classical light fields by macroscopic objects, but on the fundamental properties of optical fields and their interactions with matter in the microscopic realm.High-energy physics (particle physics) and nuclear physicsParticle physics is the study of the elementary constituents of matter and energy, and the interactions between them.In addition, particle physicists design and develop the high energy accelerators,detectors, and computer programs necessary for this research. The field is also called "high-energy physics" because many elementary particles do not occur naturally, but are created only during high-energy collisions of other particles.Currently, the interactions of elementary particles and fields are described by the Standard Model.●The model accounts for the 12 known particles of matter (quarks and leptons) thatinteract via the strong, weak, and electromagnetic fundamental forces.●Dynamics are described in terms of matter particles exchanging gauge bosons (gluons,W and Z bosons, and photons, respectively).●The Standard Model also predicts a particle known as the Higgs boson. In July 2012CERN, the European laboratory for particle physics, announced the detection of a particle consistent with the Higgs boson.Nuclear Physics is the field of physics that studies the constituents and interactions of atomic nuclei. The most commonly known applications of nuclear physics are nuclear power generation and nuclear weapons technology, but the research has provided application in many fields, including those in nuclear medicine and magnetic resonance imaging, ion implantation in materials engineering, and radiocarbon dating in geology and archaeology.University PhysicsAstrophysics and Physical CosmologyAstrophysics and astronomy are the application of the theories and methods of physics to the study of stellar structure, stellar evolution, the origin of the solar system, and related problems of cosmology. Because astrophysics is a broad subject, astrophysicists typically apply many disciplines of physics, including mechanics, electromagnetism, statistical mechanics, thermodynamics, quantum mechanics, relativity, nuclear and particle physics, and atomic and molecular physics.The discovery by Karl Jansky in 1931 that radio signals were emitted by celestial bodies initiated the science of radio astronomy. Most recently, the frontiers of astronomy have been expanded by space exploration. Perturbations and interference from the earth's atmosphere make space-based observations necessary for infrared, ultraviolet, gamma-ray, and X-ray astronomy.Physical cosmology is the study of the formation and evolution of the universe on its largest scales. Albert Einstein's theory of relativity plays a central role in all modern cosmological theories. In the early 20th century, Hubble's discovery that the universe was expanding, as shown by the Hubble diagram, prompted rival explanations known as the steady state universe and the Big Bang.The Big Bang was confirmed by the success of Big Bang nucleo-synthesis and the discovery of the cosmic microwave background in 1964. The Big Bang model rests on two theoretical pillars: Albert Einstein's general relativity and the cosmological principle (On a sufficiently large scale, the properties of the Universe are the same for all observers). Cosmologists have recently established the ΛCDM model (the standard model of Big Bang cosmology) of the evolution of the universe, which includes cosmic inflation, dark energy and dark matter.Current research frontiersIn condensed matter physics, an important unsolved theoretical problem is that of high-temperature superconductivity. Many condensed matter experiments are aiming to fabricate workable spintronics and quantum computers.In particle physics, the first pieces of experimental evidence for physics beyond the Standard Model have begun to appear. Foremost among these are indications that neutrinos have non-zero mass. These experimental results appear to have solved the long-standing solar neutrino problem, and the physics of massive neutrinos remains an area of active theoretical and experimental research. Particle accelerators have begun probing energy scales in the TeV range, in which experimentalists are hoping to find evidence for the super-symmetric particles, after discovery of the Higgs boson.Theoretical attempts to unify quantum mechanics and general relativity into a single theory1 Physics 物理学of quantum gravity, a program ongoing for over half a century, have not yet been decisively resolved. The current leading candidates are M-theory, superstring theory and loop quantum gravity.Many astronomical and cosmological phenomena have yet to be satisfactorily explained, including the existence of ultra-high energy cosmic rays, the baryon asymmetry, the acceleration of the universe and the anomalous rotation rates of galaxies.Although much progress has been made in high-energy, quantum, and astronomical physics, many everyday phenomena involving complexity, chaos, or turbulence are still poorly understood. Complex problems that seem like they could be solved by a clever application of dynamics and mechanics remain unsolved; examples include the formation of sand-piles, nodes in trickling water, the shape of water droplets, mechanisms of surface tension catastrophes, and self-sorting in shaken heterogeneous collections.These complex phenomena have received growing attention since the 1970s for several reasons, including the availability of modern mathematical methods and computers, which enabled complex systems to be modeled in new ways. Complex physics has become part of increasingly interdisciplinary research, as exemplified by the study of turbulence in aerodynamics and the observation of pattern formation in biological systems.Vocabulary★natural science 自然科学academic disciplines 学科astronomy 天文学in their own right 凭他们本身的实力intersects相交,交叉interdisciplinary交叉学科的,跨学科的★quantum 量子的theoretical breakthroughs 理论突破★electromagnetism 电磁学dramatically显著地★thermodynamics热力学★calculus微积分validity★classical mechanics 经典力学chaos 混沌literate 学者★quantum mechanics量子力学★thermodynamics and statistical mechanics热力学与统计物理★special relativity狭义相对论is concerned with 关注,讨论,考虑acoustics 声学★optics 光学statics静力学at rest 静息kinematics运动学★dynamics动力学ultrasonics超声学manipulation 操作,处理,使用University Physicsinfrared红外ultraviolet紫外radiation辐射reflection 反射refraction 折射★interference 干涉★diffraction 衍射dispersion散射★polarization 极化,偏振internal energy 内能Electricity电性Magnetism 磁性intimate 亲密的induces 诱导,感应scale尺度★elementary particles基本粒子★high-energy physics 高能物理particle accelerators 粒子加速器valid 有效的,正当的★discrete离散的continuous 连续的complementary 互补的★frame of reference 参照系★the special theory of relativity 狭义相对论★general theory of relativity 广义相对论gravitation 重力,万有引力explicit 详细的,清楚的★quantum field theory 量子场论★condensed matter physics凝聚态物理astrophysics天体物理geophysics地球物理Universalist博学多才者★Macroscopic宏观Exotic奇异的★Superconducting 超导Ferromagnetic铁磁质Antiferromagnetic 反铁磁质★Spin自旋Lattice 晶格,点阵,网格★Society社会,学会★microscopic微观的hyperfine splitting超精细分裂fission分裂,裂变fusion熔合,聚变constituents成分,组分accelerators加速器detectors 检测器★quarks夸克lepton 轻子gauge bosons规范玻色子gluons胶子★Higgs boson希格斯玻色子CERN欧洲核子研究中心★Magnetic Resonance Imaging磁共振成像,核磁共振ion implantation 离子注入radiocarbon dating放射性碳年代测定法geology地质学archaeology考古学stellar 恒星cosmology宇宙论celestial bodies 天体Hubble diagram 哈勃图Rival竞争的★Big Bang大爆炸nucleo-synthesis核聚合,核合成pillar支柱cosmological principle宇宙学原理ΛCDM modelΛ-冷暗物质模型cosmic inflation宇宙膨胀1 Physics 物理学fabricate制造,建造spintronics自旋电子元件,自旋电子学★neutrinos 中微子superstring 超弦baryon重子turbulence湍流,扰动,骚动catastrophes突变,灾变,灾难heterogeneous collections异质性集合pattern formation模式形成University Physics2 Classical mechanics 经典力学IntroductionIn physics, classical mechanics is one of the two major sub-fields of mechanics, which is concerned with the set of physical laws describing the motion of bodies under the action of a system of forces. The study of the motion of bodies is an ancient one, making classical mechanics one of the oldest and largest subjects in science, engineering and technology.Classical mechanics describes the motion of macroscopic objects, from projectiles to parts of machinery, as well as astronomical objects, such as spacecraft, planets, stars, and galaxies. Besides this, many specializations within the subject deal with gases, liquids, solids, and other specific sub-topics.Classical mechanics provides extremely accurate results as long as the domain of study is restricted to large objects and the speeds involved do not approach the speed of light. When the objects being dealt with become sufficiently small, it becomes necessary to introduce the other major sub-field of mechanics, quantum mechanics, which reconciles the macroscopic laws of physics with the atomic nature of matter and handles the wave–particle duality of atoms and molecules. In the case of high velocity objects approaching the speed of light, classical mechanics is enhanced by special relativity. General relativity unifies special relativity with Newton's law of universal gravitation, allowing physicists to handle gravitation at a deeper level.The initial stage in the development of classical mechanics is often referred to as Newtonian mechanics, and is associated with the physical concepts employed by and the mathematical methods invented by Newton himself, in parallel with Leibniz【莱布尼兹】, and others.Later, more abstract and general methods were developed, leading to reformulations of classical mechanics known as Lagrangian mechanics and Hamiltonian mechanics. These advances were largely made in the 18th and 19th centuries, and they extend substantially beyond Newton's work, particularly through their use of analytical mechanics. Ultimately, the mathematics developed for these were central to the creation of quantum mechanics.Description of classical mechanicsThe following introduces the basic concepts of classical mechanics. For simplicity, it often2 Classical mechanics 经典力学models real-world objects as point particles, objects with negligible size. The motion of a point particle is characterized by a small number of parameters: its position, mass, and the forces applied to it.In reality, the kind of objects that classical mechanics can describe always have a non-zero size. (The physics of very small particles, such as the electron, is more accurately described by quantum mechanics). Objects with non-zero size have more complicated behavior than hypothetical point particles, because of the additional degrees of freedom—for example, a baseball can spin while it is moving. However, the results for point particles can be used to study such objects by treating them as composite objects, made up of a large number of interacting point particles. The center of mass of a composite object behaves like a point particle.Classical mechanics uses common-sense notions of how matter and forces exist and interact. It assumes that matter and energy have definite, knowable attributes such as where an object is in space and its speed. It also assumes that objects may be directly influenced only by their immediate surroundings, known as the principle of locality.In quantum mechanics objects may have unknowable position or velocity, or instantaneously interact with other objects at a distance.Position and its derivativesThe position of a point particle is defined with respect to an arbitrary fixed reference point, O, in space, usually accompanied by a coordinate system, with the reference point located at the origin of the coordinate system. It is defined as the vector r from O to the particle.In general, the point particle need not be stationary relative to O, so r is a function of t, the time elapsed since an arbitrary initial time.In pre-Einstein relativity (known as Galilean relativity), time is considered an absolute, i.e., the time interval between any given pair of events is the same for all observers. In addition to relying on absolute time, classical mechanics assumes Euclidean geometry for the structure of space.Velocity and speedThe velocity, or the rate of change of position with time, is defined as the derivative of the position with respect to time. In classical mechanics, velocities are directly additive and subtractive as vector quantities; they must be dealt with using vector analysis.When both objects are moving in the same direction, the difference can be given in terms of speed only by ignoring direction.University PhysicsAccelerationThe acceleration , or rate of change of velocity, is the derivative of the velocity with respect to time (the second derivative of the position with respect to time).Acceleration can arise from a change with time of the magnitude of the velocity or of the direction of the velocity or both . If only the magnitude v of the velocity decreases, this is sometimes referred to as deceleration , but generally any change in the velocity with time, including deceleration, is simply referred to as acceleration.Inertial frames of referenceWhile the position and velocity and acceleration of a particle can be referred to any observer in any state of motion, classical mechanics assumes the existence of a special family of reference frames in terms of which the mechanical laws of nature take a comparatively simple form. These special reference frames are called inertial frames .An inertial frame is such that when an object without any force interactions (an idealized situation) is viewed from it, it appears either to be at rest or in a state of uniform motion in a straight line. This is the fundamental definition of an inertial frame. They are characterized by the requirement that all forces entering the observer's physical laws originate in identifiable sources (charges, gravitational bodies, and so forth).A non-inertial reference frame is one accelerating with respect to an inertial one, and in such a non-inertial frame a particle is subject to acceleration by fictitious forces that enter the equations of motion solely as a result of its accelerated motion, and do not originate in identifiable sources. These fictitious forces are in addition to the real forces recognized in an inertial frame.A key concept of inertial frames is the method for identifying them. For practical purposes, reference frames that are un-accelerated with respect to the distant stars are regarded as good approximations to inertial frames.Forces; Newton's second lawNewton was the first to mathematically express the relationship between force and momentum . Some physicists interpret Newton's second law of motion as a definition of force and mass, while others consider it a fundamental postulate, a law of nature. Either interpretation has the same mathematical consequences, historically known as "Newton's Second Law":a m t v m t p F ===d )(d d dThe quantity m v is called the (canonical ) momentum . The net force on a particle is thus equal to rate of change of momentum of the particle with time.So long as the force acting on a particle is known, Newton's second law is sufficient to。

物理化学生物英语单词表

物理化学生物英语单词表
物理(127个)
词汇 acceleration anion ammeter amplitude band bar bombard cation capacitor centripetal force circuit coherent coil collision comet convection converging lens coulomb critical angle decay deflect density diffraction dilation diminish discrete diverge diverging lens elastic electric generator electric motor longitudinal wave 音标
音标
美[ɪ,lɛktro'motɪv fɔrs] 美 [ɪ'lɛktrɑn] 美 [ɪ'mɪʃən] 美 ['ɛntrəpi] 美 ['ɛstə,met] 美 [ɪɡ'zɝt] 美 [ɪk'spænʃən] 美 ['faɪbɚ] 美 ['fokl] 美 ['frikwənsi] 美 ['frɪkʃən] 美 ['ɡrævəti]
美 [mo'mɛntəm] 美 ['nɛɡlɪdʒəbl] 美 ['nʊtrɑn] 美 ['fɪʃən] 美 ['fjʊʒən] 美 ['ɑptɪk] 美 ['ɑsɪlet] 美 [,prɑpə'geʃən] 美 ['protɑn] 美 [pə'ræbələ] 美 ['pærəlɛl] 美 ['pɑrtɪkl] 美 ['pɛndʒələm] 美 ['pɝmənənt] 美 ['fotɑn] 美 [pɪtʃ] 美 [,polərɪ'zeʃən] 美 ['pɑzɪtrɑn] 美 [pə'tɛnʃl] 美 ['pʊli] 美 ['redɪo'æktɪv] 美 [rɪ'frækt] 美 [,rɛlə'tɪvəti] 美 [rɪ'zɪstɚ]

Flipchip工艺流程

Flipchip工艺流程

Bump Substrate
Kingbond Training Course
SBB Process
IC
IC
Stud Bump
Substrate
Flip Chip Bond
Cure oven
IC
Cure oven
Substrate
Underfill
Kingbond Training Course
C4: Controlled Collapse Chip Connection Process
Silicon Wafer arrives with an aluminum based final metal pad and die passivation. Wafer can be probed prior to bumping.
Kingbond Training Course
Wafer Bump (Printed method) Process: Sputter UBM
IC
Solder
Bump
Substrate
GGI (Gold to Gold interconnection)
IC
Au Bump
Substrate
Au Electrode
ACF/ACP (Anisotropic Conductive Film/Paste)
IC
Anisotropic
conductive
Etch to form UBM cap
Kingbond Training Course
Wafer Bump (Printed method) Process: Print solder paste & reflow

纹理物体缺陷的视觉检测算法研究--优秀毕业论文

纹理物体缺陷的视觉检测算法研究--优秀毕业论文

摘 要
在竞争激烈的工业自动化生产过程中,机器视觉对产品质量的把关起着举足 轻重的作用,机器视觉在缺陷检测技术方面的应用也逐渐普遍起来。与常规的检 测技术相比,自动化的视觉检测系统更加经济、快捷、高效与 安全。纹理物体在 工业生产中广泛存在,像用于半导体装配和封装底板和发光二极管,现代 化电子 系统中的印制电路板,以及纺织行业中的布匹和织物等都可认为是含有纹理特征 的物体。本论文主要致力于纹理物体的缺陷检测技术研究,为纹理物体的自动化 检测提供高效而可靠的检测算法。 纹理是描述图像内容的重要特征,纹理分析也已经被成功的应用与纹理分割 和纹理分类当中。本研究提出了一种基于纹理分析技术和参考比较方式的缺陷检 测算法。这种算法能容忍物体变形引起的图像配准误差,对纹理的影响也具有鲁 棒性。本算法旨在为检测出的缺陷区域提供丰富而重要的物理意义,如缺陷区域 的大小、形状、亮度对比度及空间分布等。同时,在参考图像可行的情况下,本 算法可用于同质纹理物体和非同质纹理物体的检测,对非纹理物体 的检测也可取 得不错的效果。 在整个检测过程中,我们采用了可调控金字塔的纹理分析和重构技术。与传 统的小波纹理分析技术不同,我们在小波域中加入处理物体变形和纹理影响的容 忍度控制算法,来实现容忍物体变形和对纹理影响鲁棒的目的。最后可调控金字 塔的重构保证了缺陷区域物理意义恢复的准确性。实验阶段,我们检测了一系列 具有实际应用价值的图像。实验结果表明 本文提出的纹理物体缺陷检测算法具有 高效性和易于实现性。 关键字: 缺陷检测;纹理;物体变形;可调控金字塔;重构
Keywords: defect detection, texture, object distortion, steerable pyramid, reconstruction
II

《2024年类EIT太赫兹超材料与可调控极化转换器的设计与研究》范文

《2024年类EIT太赫兹超材料与可调控极化转换器的设计与研究》范文

《类EIT太赫兹超材料与可调控极化转换器的设计与研究》篇一一、引言在科技进步的今天,超材料成为了材料科学研究领域的热门方向,其在微波、毫米波和太赫兹频段等领域展现出巨大的应用潜力。

类电磁感应透明(EIT)效应超材料以其独特的物理特性和优越的调控性能在光学、光电子学以及通信等领域展现出重要的研究价值。

本篇论文旨在研究一种类EIT太赫兹超材料与可调控极化转换器,通过设计、制备和测试,探讨其性能和应用前景。

二、类EIT太赫兹超材料的设计与制备1. 设计思路类EIT效应是指光在介质中传播时,其电磁波在特定频率下表现出类似透明介质的行为。

本部分主要设计一种基于类EIT效应的太赫兹超材料,通过合理设计结构单元和排列方式,实现太赫兹波段的电磁波调控。

2. 制备方法采用微纳加工技术,如电子束蒸发、光刻、干法刻蚀等工艺,制备出具有特定几何形状和尺寸的超材料结构。

在制备过程中,严格控制各工艺参数,确保超材料的性能稳定和可靠性。

三、可调控极化转换器的设计与实现1. 设计思路可调控极化转换器是一种能够实现极化转换功能并具有可调谐特性的器件。

本部分设计一种基于类EIT太赫兹超材料的可调控极化转换器,通过改变超材料的结构参数或外部条件,实现极化转换的动态调控。

2. 实现方法采用电容加载、液晶调制等手段,实现极化转换器的可调谐特性。

在保持极化转换器的高效性和稳定性的同时,优化其动态调节范围和响应速度。

四、实验结果与分析1. 实验结果通过实验测试,验证了所设计的类EIT太赫兹超材料与可调控极化转换器的性能。

实验结果表明,该超材料在太赫兹波段表现出优异的电磁波调控性能,而可调控极化转换器则具有较高的极化转换效率和快速的动态调节能力。

2. 数据分析对实验数据进行详细分析,包括超材料的电磁波调控性能、极化转换器的极化转换效率以及动态调节范围等。

通过对比不同结构参数和外部条件下的性能变化,进一步揭示了所设计器件的物理特性和工作原理。

五、应用前景与展望1. 应用前景类EIT太赫兹超材料与可调控极化转换器在通信、雷达、生物医学等领域具有广泛的应用前景。

MD-013 GNSS(GPS、GLONASS、Galileo) disciplined oscil

MD-013 GNSS(GPS、GLONASS、Galileo) disciplined oscil

MD-013GNSS (GPS, GLONASS, Galileo) Disciplined Oscillator ModuleThe MD-013 is a Microchip standard platform module that provides 1 pps TTL,10 MHz sine wave and 10 MHz square wave outputs that aredisciplined to an embedded 72 channel GNSS Receiver. In addition, an external reference input can override the internal receiver as thereference. Internal to the module is a Microchip digitally corrected OCXO.• Embedded GNSS Receiver - GPS, GLONASS, Galileo • 1pps TTL output signal• 10MHz sinewave and square wave output • Other RF output frequencies available• Adaptive aging correction during holdover • Barometric pressure correction • Evaluation kit with software• Serial Communications Interface • NMEA 0183 V4.1• Basestation Communication • Digital Video Broadcast • E911 Location Systems• General Timing and Synchronization • Military Radio • Radar SystemsFeaturesBlock DiagramApplicationsQuartz Oscillator(OCXO)Processor/ControllerOutput Frequency GenerationAntenna Input1PPS OutputRF Output(10 MHz standard - other frequencies available)SerialFigure 1. Functional Block DiagramOutput Locked Module OKGNSS ReceiverHardwareResetManual Holdover External ReferenceInputSpecificationsGPS AntennaParameter Min Typical Max Units Condition Antenna Bias Voltage 4.0 4.8 5.1VDCAntenna Current620100mARF Output Waveform Characteristics (via MCX)Parameter Min Typical Max Units Condition Waveform SinewaveOutput Power+3.0+9.0+11.0dBm50 Ohm Harmonics-30dBc50 Ohm Spurious-70dBc50 OhmRF Output Waveform Characteristics (via pin 8)Waveform HCMOSHigh Level Output Voltage (VOH ) 4.0 5.0VDC<-0.5mA LoadLow Level Output Voltage (VOL )0.00.4VDC<0.5mA LoadRise/Fall Time35nSec15 pFDuty Cycle405060%15 pF1pps Output Characteristics (via MCX and pin 2)Parameter Min Typical Max Units ConditionWaveform TTLHigh-level output voltage (VOH) 3.0 5.0V DC50 OhmsLow-level output voltage (VOL)0.00.4V DC50 Ohms Pulse Width9.91010.1uSec default setting, user programmableExternal 1PPS Reference Input (Pin 1)Waveform TTLHigh-Level Output Voltage (VOH) 2.0 5.0V DC50 Ohms input impedanceLow-Level Output Voltage (VOL)0.00.4V DCPulse width10uSecNotes:• RF and 1pps input and output connectors are MCX type (SMA, SMB, MMCX connectors require additional part numbers).• Keyed connector is Samtec FTSH-108-01LDVK type.• Dimensions: mm• Module height in part number is the sum of oscillator height, board, and clearancePackage OutlineAlthough ESD protection circuitry has been designed into the MD-013 proper precautions should be taken when handling and mounting.Microchip employs a human body model (HBM) and a charged-device model (CDM) for ESD susceptibility testing and design protectionReliabilityMicrochip qualification includes aging various extreme temperatures, shock and vibration, temperature cycling, and IR reflow simulation. The MD-013 family is capable of meeting the following qualification tests:J3J9Ordering Information InstructionsCustomization to unique customer requirements is available and is common for this level of integration. Common customizations include alternate output frequencies, temperature ranges, differing values and methods of hold over specification, and holdover optimization in the frequency domain. The table below lists exisiting combinations available as of the date of publication of this data sheet. Please contact the factory for additional options.Ordering InformationMD - 013 3 - B X E - 15E7 - 10M0000000Product FamilyMD: Precision ModulesPackage 65x115mm Height 3: 19.5 mmSupply Voltage B: +12VHold Over15E7: 1.5 µs hold over option 40E7: 4.0 µs hold over optionFrequencyRF Output Code X: standard outputs per specificationTemperature Range E: -40°C to +85°C1) Holdover and aging performance is after 7 days of power-on time. Temperature and aging rates are whendevice is not locked. Performance measured in still air.2) After customer applies correct offset using cable delay command while locked, after 24 hours of locked opera-tion3) ADEV at t =86400s while locked to GPS, after 24 hours of locked operation4) The status locked indicator is intended to indicate when the module is fully locked to a reference.5) The Hardware OK indicator is intended to indicate when the module is operating properly without any failures, including hardware, software or parameter out of range.6) Antenna over current flag will be set if maximum current is exceeded. Circuit has overcurrent protection.7) The Rx pin is the serial interface input and the Tx pin is the serial interface output. The serial interface shall operate at 115,200 baud with eight (8) data bits, one (1) stop bit and no parity.USA:100 Watts StreetMt Holly Springs, PA 17065Tel: 1.717.486.3411Fax: 1.717.486.5920Europe:Landstrasse74924 NeckarbischofsheimGermanyTel: +49 (0) 7268.801.0Fax: +49 (0) 7268.801.281Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your reasonability to ensure that your application meets with your specifications. MICRO-CHIP MAKES NO REPRESENTATION OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING, BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly, or otherwise, under any Microchip intellectual property rights unless otherwise stated.。

CST中文教程

CST中文教程

CST中文教程CST 中文教程目录第一章—引言 ................................................................. .............................… 3欢迎 ................................................................. ..................................................................3如何快速上手…………............................................................. ........................................ 3CST DESIGN STUDIO是什么...................................................................... ................ 4CST DESIGN STUDIO的主要应用………................................................................ ...... 4CST DESIGN STUDIO 的主要特征.................................................................. ..............5器件…............................................................... .............................................................. 5分析 ................................................................. ................................................................. 5结果管理………................................................................ .................................................. 5显示....... ................................................................ .. (6)资料.......... .............................................................. ......................................................... 6自动化....................................................................... (6)关于此手册...................................................................... . (7)手册中的一些约定…................................................................... ...................................... 7如何反馈….................................................................... ..................................................... 7第二章— QUICK TOUR.................................................................... ...................8用户创界面结构................................................................................ .. (8)建一个系统...................................................................... ..............................................10添加并连接器件…………………... .................................................... ............................... 11改变Block的性质…………... .......................................................... .................................. 16改变外置端口的设置………………….................................................... ........................... 17仿真.................. ..................................................... . (19)单位设置 ..................................................................... . (19)定义仿真目标………… ............................................................. .......................................20开始仿真………................................................................ ............................................... 23查看仿真结果………............................................................ .............................................24标准显示接口……................................................................. ......................................... 24个性化显示接口性质……………............................................................ .......................... 28用户自定义显示接口 ..................................................................... .............................. 30参数化及优化……………….. ....................................................... .....................................31使用参数……. ................................................................ ................................................. 31使用参数扫频……………….. ....................................................... .................................... 36优化…………………….. ................................................... ...............................................41估计额外的结果… ….. .......................................................... .........................................51获取SPICE 网络参数……………………………………………. .................................. ..... 51基于后加工的模版………….. ........................................................... ............................... 53第三章– BLOCK TYPES................................................................... ................55特殊的blocks …………………............................................... ..........................................56参考Block .............................................................. ...............................…….................. 56复制Block .............................................................. ........................................................ 58CST DESIGN STUDIOBlock .................................................................. ........................ 58CST MICROWAVE STUDIOBlocks.............................................................. .................. 62库Block............................................................... ........... .......................................... 69标准Block ...……....................................................... ..................................................... 75电路Blocks.............................................................. ....................................................... 76Sonnet emBlocks.................................................................. ......................................... 81特殊模块属性.......................................................... …………….......................................82修改模块的版图 ..................................................................... ..……………..................... 82模块的内嵌 ..................................................................... ............…………….................. 82为模块选择求解器 ..................................................................... ............……………....... 84使用插值........................................................................... (85)微分端口……………….......................................................... ........................................... 87第四章—仿真任务……................................................................. ....................90S参数仿真………………...................................................... .............................................90AC 仿真…….............................................................. .......................................................91工作点DC 仿真…….........................................…………................. ...............................93天线插件 ..................................................................... .....................................................94谱线仿真……................................................……………....... .........................................95放大器仿真………........................................................... ..............................................100混频器仿真……................................................................. ...........................................102第五章—与 CST MICROWAVE STUDIO 集成…..........................105示例………….......................................................... ........................................................105CST MICROWAVE STUDIO 模型...................................................................... .........106天线 ..................................................................... .. (106)变换器 ..................................................................... ................................................... 108CST DESIGN STUDIO 建模............……................................................. ................108优化…................................................................ .............................................................113天线计算 ..................................................................... ...........................................117第六章–更多信息…………………………….. .................….......................... .....120例子.................................................................. ..............................................................120在线参考文件……………….......................................................... ..................................120获取技术支持......... .......................................................... (120)宏............................................................................. . (1)21改变记录…... ............................................................ ......................................................121附录A — BLOCK REFERENCE .............................................................. ....122基本Blocks …............................................................... ................................................122特殊Blocks ....................................................................................... . (123)传输线 Blockswhite/yellow ……..............…..................……………....... ....................124微带 Blocksred/yellow ... ......................................................... ...........................125矩形波导 Blocksblue/yellow…………..................................................... ...................127其他波导Blocks.............................................................……. ........................................129基本电路Blocks .….............................................................. ........................................130半导体电路Blocks ........................................……..................... ...................................132射频电路Blocks ………………………………………………………....................... ..........134附录 B —快捷键………......................................................................................140可用的快捷键........................................……………….................. .................................140设计时用到的快捷键Canvas.................................…………………................... ........140 第一章—引言欢迎欢迎使用 CST DESIGN STUDIO 这是一个功能强大使用简单的示意图设计工具它是为复杂系统的快速综合及优化设计的。

TecQuipment AF300 间歇超声风洞说明书

TecQuipment AF300 间歇超声风洞说明书

•TecQuipment Ltd, Bonsall Street, Long Eaton, Nottingham NG10 2AN, UKInvestigates subsonic and supersonic air flow, including flow around two-dimensional models•Laboratory-scale wind tunnel for subsonic and supersonic tests, up to Mach 1.8•Compact design – does not need large laboratory space•Supplied with aerodynamic models for supersonic tests – includes model angle-feedback encoder •Works with TecQuipment’s Versatile Data Acquisition System (VDAS ®) for instant recording of multiple readings and automatic calculations •Electronic instruments measure and display multiple pressures at the same time, for ease of use and for connection to TecQuipment’s VDAS ®•Supplied with set of different liners for controlled subsonic and supersonic air flow •Induction flow for better air flow and accurate resultsWorks withShown withoptional Schlieren Apparatus (AF300a)Bench-mounted Instrument Frame (shown on floor for photograph only)Screenshot of the optional VDAS®softwareDescriptionAn intermittent operation, induction-type supersonic wind tunnel for investigations into subsonic and supersonic flow. This includes tests on the flow around two-dimensional models at subsonic and supersonic air speeds.A compressed air supply (AF300b, available separately) induces a flow in the working section of the wind tunnel. This gives a less turbulent and more stable flow for accurate results and comparison with theory. The optional compressed air supply includes filters and air dryers to give a dust-free and dry air source needed for good results. Students use a delivery valve to allow compressed air to enter the wind tunnel. The wind tunnel includes two analogue pressure gauges. One measures the compressed air pressure available from the supply (for reference); the other measures the pressure delivered to the wind tunnel and includes an electronic transducer that connects to TecQuipment’s optional Versatile Data Acquisition System (VDAS®) to record the pressure.The working section of the wind tunnel is a convergent-divergent nozzle with a removable top part (‘liner’). The shape of the liner controls the maximum air velocity at the divergent part of the working section. Included are three different liners.High optical-quality glass windows (‘portals’) are at each side of the divergent part of the working section. The portals allow students to use the optional Schlieren Apparatus (AF300a, available separately). This allows display and recording of images of pressure waves around two-dimensional models.Included is a set of two-dimensional models. These mount between the portals inside the working section. Students can adjust the angle of the models. An encoder electronically measures the model angle.Spaced at precise intervals along the working section of the wind tunnel are pressure tappings. Two extra tappings connect to one of the models when in use. A 32-way pressure display (included) connects to all the pressure tappings. It displays the pressures and transmits them to VDAS® for instant recording and calculations of pressure ratios and Mach numbers.Included is a bench-mounting instrument frame that holds and provides power for the electronic instruments and the optional VDAS® interface unit. The instrument frame connects to a suitable electrical supply.VDAS® allows accurate real-time data capture, monitoring, display, calculation and charting of all the important readings on a suitable computer (computer not included). Standard Features•Supplied with comprehensive user guide•Five-year warranty•Manufactured in accordance with the latest European Union directives Experiments•Pressure distribution along a convergent/divergent (Laval) nozzle with subsonic and supersonic air flow •Comparison of theoretical and actual pressure distribution•Comparison of actual and theoretical area ratio of a nozzle at supersonic air velocities (Mach numbers)•Pressures around a two-dimensional model in subsonic and supersonic flow conditions, at different angles ofincidence•Lift coefficient for aerodynamic models in supersonic flow•Shock waves and expansion patterns around a two-dimensional model in supersonic flow conditions (when used with the optional Schlieren Apparatus).Recommended Ancillaries•Schlieren Apparatus AF300a•Air Compressor Receiver and Dryer AF300bEssential Ancillaries•Versatile Data Acquisition System - Frame-mounted version (VDAS-F)Essential ServicesElectrical supply:50 Hz to 60 Hz 90 VAC to 250 VAC for the AF300 Instrument Frame. ‘See specifications’ for AF300b.Air supply:Greater than 7 bar and 0.5 kg.s–1of clean, dry air, or use the optional AF300b.The air supply must not contain more than 0.2 kg of water for 450 kg of air.Floor space needed:4 m x 2 m for the wind tunnel and optional Schlieren Apparatus (AF300a)5 m x 3 m for the wind tunnel with the optional Compressed Air Supply (AF300b)Operating ConditionsOperating environment:Laboratory environment that allows for high sound levelsStorage temperature range:–25°C to +55°C (when packed for transport)Operating temperature range:+5°C to +40°COperating relative humidity range:80% at temperatures < 31°C decreasing linearly to 50% at 40°C•TecQuipment Ltd, Bonsall Street, Long Eaton, Nottingham NG10 2AN, UK•TecQuipment Ltd, Bonsall Street, Long Eaton, Nottingham NG10 2AN, UKSound LevelsThis equipment emits sound levels greater than 100 dB(A). You must wear ear defenders when you use it or work near to it.Specifications – AF300Dimensions and weight (wind tunnel):Nett: 2000 mm high x 3031 mm long x 805 mm wide and 236 kgPacked: Approximately 5.9 m 3and 300 kgDimensions and weight (instrument frame without instruments):Nett: 1260 mm long x 840 mm high x 510 mm wide and 22 kgPacked: Approximately 0.78 m 3and 30 kg Nominal nett dimensions (AF300b):2120 mm high x 4500 mm x 1000 mm Working section:Nominal 100 mm x 25 mm Liners:Subsonic, Mach 1.4 and Mach 1.8Models:•5-degree single wedge •7-degree double wedge •10-degree double wedge•10-degree double wedge with two pressure tappings.Instruments:•Angle encoder input board for VDAS-F •Angle encoder•32-way pressure display •Pressure mimic module•Delivery pressure – mechanical gauge and electronic transducer •Supply pressure – mechanical gaugeSpecifications – AF300b•Three air receivers/reservoirs – one receiver has its own inlet and outlet isolation valves to give a choice of operating time and pressure recharge rate •Main outlet isolation valve•Maximum pressure approximately 14 bar•Compressor – rated at a nominal 15 kW total electrical power, needing 32 A at 400-440 VAC three phase with earth. Voltage to be specified on order.•Air dryer and filter – rated at less than 25 W andnormally single phase. Voltage to be specified on order.58 East South Street, Rossville, IN 46065 800-251-9935**************FOR MORE INFORMATION CONTACT US!。

Pulse wave detector, pulse wave detection method,

Pulse wave detector, pulse wave detection method,

专利名称:Pulse wave detector, pulse wave detectionmethod, and program发明人:梅松 旭美,辻川 剛範,大西 祥史申请号:JP2019555299申请日:20181119公开号:JPWO2019102966A1公开日:20201119专利内容由知识产权出版社提供专利附图:摘要: In the detection of the pulse wave, it is suppressed that the accuracy of the pulse wave information is lowered due to the movement of the face of the person to be measured. The pulse wave detection device according to the embodiment of the presentinvention includes a region of interest setting unit for setting the region of interest of the subject's face and the region of interest in the time-series image in which the subject's face is captured. A brightness data generation unit that generates brightness data, which is time-series data of representative values of brightness values of predetermined color components, and displacement data indicating the movement of the face of the person to be measured based on the time-series image. And the pulse wave component extraction unit that extracts the signal component caused by the pulse wave in the brightness data by using the displacement data generation unit and the pulse wave based on the extracted signal component. It includes an output unit that outputs information.申请人:日本電気株式会社地址:東京都港区芝五丁目7番1号国籍:JP代理人:机 昌彦,下坂 直樹更多信息请下载全文后查看。

bq20z75 95 PCB 布线指南说明书

bq20z75   95 PCB 布线指南说明书

Application ReportSLUA431–December2007 bq20z75/95Printed-Circuit Board Layout Guide Doug Williams Battery ManagementABSTRACTNew single-package IC fuel gauges can significantly simplify PCB layout.Attention tolayout,however,is critical to the success of any battery management circuit board.Themixture of high-current paths with an ultralow-current microcontroller creates thepotential for design issues that can be troublesome.This document presents guidelinesthat can ensure a stable and well performing project.IntroductionNew single-package integrated circuits(IC)are available that combine the separate fuel gauge and AFE chips into one small package.This configuration can significantly simplify printed-circuit board(PCB)layout,but attention to layout is critical to the success of any battery management circuit board.Themixture of high-current paths with an ultralow-current microcontroller creates the potential for designissues.Careful placement and routing with regard to the principles described in the following discussion can ensure success.IC OrientationThe orientation of the fuel gauge IC is often driven by the shape of the board.Some pack designs have severe dimensional constraints,such as only allowing for a10-mm width.This leaves no choice but tomount the bq20z75/95IC in such a manner that no space is available for decoupling/filter capacitors to be placed next to the IC pins.In that case,adequate decoupling can be provided by mounting the capacitors on the other side of the board,as shown in Figure1.Figure1.Typical Narrow Board Design Where Most Decoupling/Filter Capacitors Are Located on OtherSide.bq20z75/95Power Supply Decoupling CapacitorFortunately,only one capacitor needs to be extremely close to the IC.The power supply decoupling from REG to VSS is very important for optimal operation of the bq20z75/95advanced gas gauge.For thebq20z95,this is the1-µF ceramic capacitor from pin32to pins31and34.Ensure that a heavy copper trace is between pins31and34.For the bq20z75,the capacitor is from REG pin26to VSS pins25and28.This is C15in the reference schematic in Figure10.SLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide1 Ground SystemTo keep the loop area small,place both terminals of this capacitor within3mm of the IC,and centered around pin32(bq20z95)or pin26(bq20z75).Use the shortest possible traces.A large loop area renders the capacitor useless and forms a little loop antenna for noise pickup.Ground SystemThe bq20z75/95requires a low-current ground system separate from the high-current PACK(–)path.Refer to the ground symbols in the bq20z75/95reference designs,and provide the separate low-current ground system accordingly.It is important that the low-current ground system only connects to PACK(–)at the sense resistor Kelvin pick-off point as shown in Figure2.The use of an optional inner layer ground plane is recommended,but not required,for the ground system.Figure2.Diagram Showing bq20z75/95Using Low-Current Ground System for Its Vss Pins andAssociated Components2SLUA431–December2007 bq20z75/95Printed-Circuit Board Layout GuideKevin Connections Kevin ConnectionsKelvin voltage sensing is extremely important in order to accurately measure current and top and bottom cell voltages.Figure3and Figure4demonstrate correct and incorrect techniques,respectively.Figure3.Incorrect Kelvin Voltage Sensing TechniqueIn Figure3,sensing through high-current copper traces produces measurement errors.SLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide3 RBI and LED CapacitorsFigure4.Correct Kelvin Voltage Sensing TechniqueAs Figure4shows,in some cases,the top and bottom cell voltage sensing may be extended out to the cells.RBI and LED CapacitorsThe3.3-V LEDOUT(pin8)output requires a4.7-µF ceramic capacitor when LEDs are used,but stillrequires2.2µF capacitance for loop stability when LEDs are not used,as with the bq20z75.Thiscapacitor also should be placed as close to the IC as is practical,but several millimeters of copper trace is not a problem.Placement of the RBI capacitor is not as critical.It can be placed further away from the IC.MRST ConnectionRESET and MRST are connected to allow the internal AFE to control the gas gauge reset state.Theconnection between these pins must be as short as possible in order to avoid any incoming noise.The recommended direct interconnection presents no problem.If unwanted resets are found,one or more of the following solutions may be effective:•Add a0.1-µF capacitor between MRST and ground.•Provide a1-kΩpullup resistor to2.5V at RESET.•Surround the entire circuit with a ground pattern.Normally,these steps are not required.If a test pin is added at MRST,provide it with a10-kΩseriesresistor.Communication Line Protection ComponentsThe5.6-V zener diodes,used to protect the communication pins of the bq20z75/95from ESD,should be located as close to the pack connector as possible.Return the grounded end of these zener diodes to the Pack(–)node,rather than to the low-current digital ground system.In this manner,ESD is diverted away from the sensitive electronics as much as possible.4SLUA431–December2007 bq20z75/95Printed-Circuit Board Layout GuideProtector FET Bypass and Pack Terminal Bypass Capacitors Protector FET Bypass and Pack Terminal Bypass CapacitorsThe general principle is to use wide copper traces to lower the inductance of the bypass capacitor circuits.In Figure5,an example layout demonstrates this technique.ing Wide Copper Traces Lowers the Inductance of Bypass Capacitors C1,C2,C3Board Offset ConsiderationsAlthough the most important component for board offset reduction is the decoupling capacitor for REG(2.5V REG),additional benefit is possible by using this recommended pattern for the Coulomb Counterdifferential low-pass filter network.Maintain the symmetrical placement pattern shown for optimum current offset e symmetrical shielded differential traces,if possible,from the sense resistor to the 100-Ωresistors as shown in Figure6.If the current sense leads are long,ensure that the100-Ωresistors are within10–15mm from the IC.Figure6.Differential Filter Components With Symmetrical LayoutSLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide5 ESD Spark GapESD Spark GapProtect SMBus Clock,Data,and other communication lines from ESD with a spark gap at the connector.The pattern shown in Figure7is recommended,with0,2-mm spacing between the points.Figure7.Recommended Spark Gap Pattern Helps Protect Communication Lines From ESDRadio Frequency InterferenceNormally,strong RF signals have no effect on gas gauge performance.However,any silicon structure can rectify RF signals,producing unwanted voltages and currents at critical nodes.In fact,any copper trace or battery connection has a frequency where it becomes an effective half-wave or quarter-wave receiving antenna.For example,the1900-MHz cell phone band has a quarter wavelength of only3,9cm.A3-watt cell phone,held next to a battery management circuit board,can induce significant errors under the right conditions.Full sweep RF testing for every new design is strongly yout modificationand/or the use of small bypass capacitors can usually mitigate the problem.The most vulnerable node on the bq20z75/95reference design is the SAFE output,which feeds into a signal diode,followed by a FET gate and shunt capacitor.This type of network demodulates an RF signal and can produce enough DC on the gate of the fuse ignition FET to actually ignite the chemical fuse.The solution is to keep the trace from the SAFE output to the diode as short as possible to reduce itseffectiveness as an antenna.Alternately,both sides of the trace can be guarded with grounded copper. Unwanted Magnetic CouplingA battery fuel gauge circuit board is a challenging environment due to the fundamental incompatibility ofhigh-current traces and ultralow-current semiconductor devices.The best way to protect against unwanted trace-to-trace coupling is with a component placement such as that shown in Figure8,where thehigh-current section is on the opposite side of the board from the electronic devices.This is not possible in many situations due to mechanical constraints;nevertheless,every attempt should be made to routehigh-current traces away from signal traces,which enter the bq20z75/95directly.IC voltage references and registers can be disturbed and,in rare cases,damaged due to magnetic and capacitive coupling from the high-current path.Note that during surge current and ESD events,thehigh-current traces appear inductive and can couple unwanted noise into sensitive nodes of the gasgauge electronics,as illustrated in Figure9.6bq20z75/95Printed-Circuit Board Layout Guide SLUA431–December2007Thermal ConsiderationsFigure8.Separating High-and Low-Current Sections Provides an Advantage in Noise ImmunityFigure9.Avoiding Close Spacing Between High-Current and Low-Level Signal LinesThermal ConsiderationsAvoid thermal problems by placing the sense resistor,protection FETS,and high-current traces well away from the ICs.SLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide7 Reference SchematicReference SchematicFigure10is a reference schematic for a4-series-cell bq20z95battery management fuel gaugeThe bq20z75schematic is similar,but has no LEDs.Figure10.bq20z954-Series-Cell Reference Schematic8bq20z75/95Printed-Circuit Board Layout Guide SLUA431–December2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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索尼 HDR-CX150 16GB 高清定位摄像机说明书

索尼 HDR-CX150 16GB 高清定位摄像机说明书

Capture stunning 1920 x 1080 Full HD video and 3.0 megapixel images with the ultra-compact HDR-CX150, whichfeatures an "Exmor R" CMOS sensor for superior low-light performance, 16GB of embedded flash memory, and a Carl Zeiss® Vario Tessar 25x optical zoom lens to help bring you closer to the action.2 11920x1080 Full HD Recording:1920 x 1080 high definition resolution lets you record your memories inexceptional Sony® Full High Definition quality . Capable of 1080/60pplayback via HDMI™ and compatible HDTV providing stunning clarity and incredibly detailed playback of your memories.2 43 megapixel still image capture:3 megapixel still image capture lets you take high resolution digital photos.16GB embedded Flash memory The built-in 16GB embedded Flash memory can record and store up to 6 hours of high definition video footage (HD LP mode), or up to4 hours of standard definition footage (SD HQ mode).1 1 1/4" back-illuminated "Exmor R" CMOS sensorA 1/4” "Exmor R" CMOS image sensor delivers bright, vivid, spectacularly detailed video footage, as well as 3 megapixel still images.Back-illuminated "Exmor R" CMOS sensorExperience stunning low-light sensitivity with improved image clarity anddrastically reduced grain with the back-illuminated "Exmor R" sensor. Designed for compact cameras and camcorders, the "Exmor R" sensor relocates the photo diodes above the support circuitry,maximizing the light gathering area per pixel so you can shoot with better results in lower lighting conditions.2x faster Quick AF With the new and improved autofocus (AF) system, Quick AF, the focusing speed is twice as fast compared to previous models. Whether in bright daylight or in dimly lit environment, Quick AF ensures fast, accurate, and consistent focus lock, enabling users to shoot in a wide range of scenes without missing any important moment. Especially when shooting night scenes where conventional AF might struggle to focus, thanks to the much improved AF algorithm in Quick AF, users can nowcapture crisp images, fast.1080/60p playback via HDMI™ andcompatible HDTV 1080/60p playback via HDMI™ andcompatible HDTV providing stunningclarity and incredibly detailedplayback of your memories.44 Carl Zeiss™ Vario-Tessar lens:The professional-quality Carl Zeiss®Vario-Tessar® lens designedspecifically for compact camcorders. Precision ground optics help maintain the sharpness and contrast of larger lenses, and SteadyShot™ image stabilization helps reduce blur caused by camera shake.Face Detection technology w/ Face Priority With Face Priority, your camcorder optimizes focus, color, exposure, and Smile Shutter™ technology for the faceyou prioritize. Just touch the preferredface on the LCD display and thecamcorder will assign it priority, even ifit leaves and returns to the frame.Smile Shutter™ technology for still anddual capture:Smile Shutter™ technology lets the camcorder automatically take still photos when your subject smiles, even while shooting high definition video. You can also set the sensitivity and choose child, adult, or auto priority.Direct Copy to external HDD w/o PC Store your memories in a whole new way with the ability to copy videos from your camcorder directly to an external hard disk drive (sold separately), all without a computer. Your camcorder can also 13 13 ADDITIONAL FEATURES Highlight Playback with Highlight Scenario playback 2.7” Clear Photo™ LCD (230 K) display 3Intelligent Auto (9 iAuto modes)SteadyShot® image stabilization with Active Mode:Up to 24Mbps AVCHD video2 25X Optical / 300X Digital Zoom:Power On by opening LCD display:Personalized Menu System Dolby® Digital stereo recording with Built-in Zoom Mic:Dual Record with still image capture:Face Index function:Film Roll Index:Built-in Intelligent Flash:x.v. Color™ technology for superior color:BIONZ™ Image Processor: Dynamic Range Optimizer:Hybrid Recording to 16GB internalmemory or Memory Stick Duo™ media: 1 One Touch Disc Burn:Record and zoom controls on LCD:BRAVIA® Sync™ technology: HDMI™ connection output: USB 2.0 interface:Sony Electronics Inc. • 16530 Via Esprillo • S an Diego, CA 92127 • 1.800.222.7669 • w Last Updated: 06/23/2010Please visit the Dealer Source for more informationat /dealersourceSpecificationsConvenience FeaturesMultiple Language Display: YesManual / Auto Lens Cover: Manual Quick On: Power On by LCDS/S & Zoom button on LCD: Yes Fader Effect(s): Black, WhiteOptics/LensAperture: F1.8-2.6Filter Diameter: 30mmFocal Distance: 2.5 - 62.5mmProgressive Shutter Mode: Yes (Still Image) Optical Zoom: 25xDigital Zoom: 300xResolution: 3 megapixel stillLens Type: Carl Zeiss® Vario-Tessar®Focal Length (35mm equivalent): 37 - 1075mm (16:9), 45 - 1325mm (4:3)PowerBattery Type: InfoLITHIUM® with AccuPower™ Meter System (NP-FV50)Power Requirements: 7.2V (battery pack); 8.4V (AC Adaptor)Power Consumption (in Operation): 3.0WSoftwareOperating System Compatibility: "Windows XP SP3 * /Windows Vista SP2 ** /Windows7* 64-bit editions and Starter (Edition) are notsupported.The Windows Image Mastering API(IMAPI)Ver.2.0 or later is required to use the function for creating discs.** Starter (Edition) are not supported. Standard installation is required.Operation is not assured if the above OS has been upgraded or in a multi-boot environment. "Supplied Software: PMB Ver.5.0 - Windows XP Service Pack3 (SP3)(32bit),Windows Vista Service Pack2 (SP2)(32bit), Windows 7. Not supported by Mac OS.LCD DisplayLCD Type: 2.7” Clear Photo™ LCD (230 K) displayAdvanced FeaturesFace Detection: Yes - video and stillImage Stabilization: SteadyShot® image stabilization w/ Active mode x.v.Color™: YesSmile Shutter™ technology: YesIntelligent Auto: Yes (Auto, Landscape, Backlight, Twilight, Spotlight, Low light, Macro, Portrait, Baby, Tripod)RecordingVideo Actual (Pixel): 1350K Pixels (16:9) 1010K Pixels (4:3)Dual Record: 2.7 megapixel (16:9)Photo Capture from Movie: Yes Audio Format: Dolby® Digital 2chMicrophone/Speaker: Built-in Zoom MicrophoneStill Image Max Effective Resolution: 3 megapixel Still Image Mode: JPEGVideo Format: HD: MPEG4 AVC/H.264; SD: MPEG2Video Signal: HD: 1920 x 1080/60i; SD: NTSC color, EIA standardsMedia Type: 16GB Non-Removeable Flash Memory; Memory Stick PRO Duo™ MARK2 Media andSD/SDHC/SDXC (Class 4) media (Sold Separately) Recording and Playback Times: 16GB Flash:High Definition: FX = up to 85 min., FH = up to 115 min., HQ = up to 230 min., LP = up to 395 min. Standard Definition: HQ = up to 235 min.Exposure SystemMinimum Illumination: 3 lux(Auto Slow Shutter ON, 1/30 Shutter Speed )Exposure Settings: Yes (Touch Panel)D-Range Optimizer: YesScene Mode(s): Auto, Twilight, Candle, Sunrise & Sunset, Fireworks, Landscape, Portrait, Spotlight, Beach, Snow White Balance Mode: Auto, Outdoor, Indoor, One Push (via Touch panel)InterfaceDirect Copy: YesBRAVIA® Sync™: YesSD Output: Included (via A/V Remote Terminal) ; Video / S Video / Audio / Component Out / Remote USB Port(s): Hi-speed (2.0 compliant) HD Output: HDMI (mini) PhotoTV HD: YesImaging SensorProcessor: BIONZ™ image processorEffective Picture Resolution: 1180K Pixels (16:9) 1570K Pixels (4:3)Imaging Sensor: 1/4" back-illuminated "Exmor R" CMOS sensorFocus ControlFocus System: Full range Auto / Manual (Touch Panel)Service and Warranty InformationLimited Warranty Term: Limited Warranty --- 1 Year Parts; 90 Days LaborDimensionsWeight: w/o battery: 7oz (210g), w battery: 9oz (260g) Measurements: 2 x 2 1/4 x 4 1/4 inch (50 x 56 x 114mm)Supplied AccessoriesAC adaptor (AC-L200)Rechargable Battery Pack (NP-FV50) Component A/V CableA/V Connecting CableLithium Battery (CR2025)Application Software / USB Driver / (CD-ROM) USB CableOptional AccessoriesRechargeable InfoLITHIUM Batteries (NP-FV50/FV70/FV100) AC Adaptor/Charger for H series batteries (AC-VQV10) Travel Charger (BC-TRV)HDMI Cable (mini) (VMC-30MHD) UPC Code: 027*********1. 16GB equals 16 billion bytes. A portion of the total storage is used for system management and/or application files. The capacity that a user can use is approximately 15.5GB.2.This camcorder captures high definition footage in the AVCHD format. High Definition AVCHD discs can be created using standard DVD media, the supplied software and a compatible PC. DVD mediacontaining AVCHD footage may be played on a compatible Blu-ray Disc™ player/recorder, PC with supplied software or PLAYSTATION®3 devices. DVD media containing AVCHD footage should not be used with standard DVD based players, as the DVD player may fail to eject the media and may erase its contents without warning. 3. Viewable area measured diagonally.4. HD viewing requires compatible HDTV and HDMI™ cable, both sold separately.5. Requires BRAVIA Sync feature in each product, including a compatible BRAVIA® HDTV. Please refer to owner’s manual to determine compatibility.7. By using Picture Motion Browser software, supplied with certain Sony cameras and camcorders*, a PC and a broadband Internetconnection, your photos can be shown on an online map service. The online map service is currently provided courtesy of Google, and is subject to change or termination without notice.9. Requires Microsoft Windows XP SP3/ Windows Vista SP2/Windows 7. Picture Motion Browser software not supported by Mac OS.10. Smooth Slow Record captures 3 seconds of video which play back over 12 seconds.12. One Touch Disc Burn feature requires DVDirect burner or compatible PC with supplied PBM software (sold separately).13. Requires USB 2.0 connection via VMC-UAM1 cable (sold separately), AC power for camcorder, and hard drive formatted in FAT-32. Connection via USB-hub not supported. External HHD/USB media should be less than 2TB(Terabytes).© 2009 Sony Electronics Inc. All rights reserved. Reproduction in whole or in part without written permission is prohibited. Sony, AccuPower, BIONZ, BRAVIA, Clear Photo LCD Plus, ClearVid, Exmor R, Handycam, InfoLITHIUM, Optical SteadyShot, Smile Shutter, x.v. Color, Memory Stick Duo,Memory Stick PRO Duo, Memory Stick and the Memory Stick logo are trademarks or registered trademarks of Sony Corporation. PlayStation is a registered trademark of Sony Computer Entertainment. Microsoft, Windows, and Windows Vista are registered trademarks of MicrosoftCorporation in the United States and/or other countries. Blu-ray Disc and it’s logo are trademarks. Dolby is a registered trademark of Dolby Laboratories. HDMI is a trademark of HDMI Licensing LLC. All other trademarks are trademarks of their respective owners.*Logo mentions need to be included if logo shown or listed in copy。

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T. M. Mishonov 1,2 , E. S. Penev 2 and J. O. Indekeu 1 Laboratorium voor Vaste-Stoffysica en Magnetisme, Katholieke Universiteit Leuven - Celestijnenlaan 200 D, B-3001 Leuven, Belgium 2 Department of Theoretical Physics, Faculty of Physics, Sofia University “St. Kliment Ohridski” 5 J. Bourchier Blvd., Bg-1164 Sofia, Bulgaria
For a given specific heat jump, this expression leads to two solutions (oblate, ∆e /∆p > 1, and prolate, ∆e /∆p < 1). The relevant example is shown in fig. 1; the function ∆C (A)/CN is tabulated in ref. [1]. The analysis of the angular dependence of Hc2 [6, 7] performed in the commented paper [1] unambiguously demonstrates that one has to analyze only the “oblate” case. Thereby the experimentally reported value in ref. [2] ∆C/CN = 0.82 ± 10% gives A ≈ 16 and ∆e /∆p ≈ b ≈ 4.0 ± 10%. For this significant anisotropy, the “distribution” of Cooper pairs 2 2 |∆k | ∝ 1/[kz + (kF /b)2 ] has a maximum at kz = 0. This general qualitative conclusion is in agreement with the hints from band calculations that the maximal order parameter is concentrated in an almost two-dimensional 2 electron band, but all bands εb,k take part in the normal specific heat per unit cell CN = (π 2 /3)kB T 1. For the two-band model, advocated for the first time for MgB2 in ref. [8], eq. (1) gives (to within a typographical correction) the result by Moskalenko [9] ∆C (|∆1 |2 ρ1 + |∆2 |2 ρ2 )2 12 [z 2 x + (1 − x)]2 = = 1 . 426 , CN 7ζ (3) (ρ1 + ρ2 )(|∆1 |4 ρ1 + |∆2 |4 ρ2 ) z 4 x + (1 − x) where z = ρ1 ∆1 , x= , ∆2 ρ1 + ρ2 (3)
following the weak-coupling BCS approach [1, 4] we derived the explicit analytic expressions valid for A > 0, and −1 < A < 0, respectively 2 2 2 √ ∆e 12 2(1 + b ) (arctan b) , − 1, b= A= 2 2 ∆ p 7ζ (3) b + b(1 + b ) arctan b ∆C (A) (2) = 2 −1 CN 2 2 √ ) p 2(1 − p tanh ∆ 12 e . , p = ib = −A = 1 − ∆p 7ζ (3) 2 p + p(1 − p2 ) tanh−1 p
2
f (k) = 2
b
δ (εb,k − EF )f (k)
dk , (2π )3
(1)
EF is the Fermi energy, εb,k are the band energies, 1 is the density ofБайду номын сангаасstates, ζ is the Riemann zeta function, β∆ is analogous to Abrikosov’s parameter βA [3], and 12/7ζ (3) = 1.42613 . . . is the sacramental BCS ratio. Then
Europhysics Letters
PREPRINT
arXiv:cond-mat/0205104v3 [cond-mat.supr-con] 21 May 2002
Comment on “Anisotropic s-wave superconductivity: comparison with experiments on MgB2” [A. I. Posazhennikova, T. Dahm and K. Maki, cond-mat/0204272; submitted to Europhys. Lett.]
In a very recent e-print Posazhennikova, Dahm and Maki [1] discuss a model for the gap anisotropy in MgB2 , a material which has attracted a lot of attention from condensed matter physicists in the past two years. A central issue in this work [1] is to propose an analytic model for analyzing thermodynamic behavior. Assuming √ a spherical Fermi surface, a simple gap anisotropy function is suggested, ∆(k) = ∆e / 1 + Az 2 , where z = cos θ, and θ is the polar angle. This model leads to useful results for the temperature dependence of the upper critical field Hc2 and of the specific heat, which can be fitted to the experimental data, thereby determining the optimal anisotropy parameter A. Note that √ A = (∆e /∆p )2 − 1, with ∆p = ∆(z = 1) and ∆e = ∆(z = 0), and the gap ratio is parameterized as ∆e /∆p = 1 + A > 0. The aim of the present Comment is to provide a convenient analytical expression giving the possibility for determining ∆e /∆p from the available data for the jump of the specific heat [2]. For the latter we derive the explicit formula 12 1 1 |∆k | 2 ∆C = , where = 4 , CN 7ζ (3) β∆ β∆ 1 |∆k |
and ρ1 and ρ2 are the densities of states for the two bands. Taking for an illustration x = 0.515 and ∆C/CN = 0.82, eq. (3) gives ∆1 /∆2 ≈ 4.0 in agreement with ∆e /∆p ≈ 4.0 obtained using eq. (2). Thus the gap ratios are model-independent. For a survey on a set of parameters see Table I in ref. [10]. Certainly the jump of the heat capacity alone cannot be an arbiter for the validity of any model, so subtleties, e.g., related to strong coupling effects and other anisotropies, can be hidden in the parameters spread in the table mentioned. ∗∗∗
1
PACS. 74.20.Rp – Pairing symmetries. PACS. 74.25.Bt – Thermodynamic properties.
Abstract. – An analytical result for the renormalization of the jump of the heat capacity ∆C/CN by the anisotropy of the order parameter is derived within the framework of the very recent model proposed by Posazhennikova, Dahm and Maki [cond-mat/0204272 submitted to Europhys. Lett.], for both oblate and prolate anisotropy. The graph of ∆C/CN versus the ratio of the gaps on the equator and the pole of the Fermi surface, ∆e /∆p , allows a direct determination of the gap anisotropy parameter ∆e /∆p by fitting data from specific heat measurements ∆C/CN . Using the experimental value ∆C/CN = 0.82 ± 10% by Wang, Plackowski, and Junod [Physica C 355 (2001) 179] we find ∆e /∆p ≈ 4.0.
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