BONDING

WORK INSTRUCTIONS

TITLE Design Guideline for Manufacturing (Wire Bonding)

Revision History

Rev.Description Page Effective Date 1.0New Release All 28Aug. 16, 2002

Distribution List

Department HK DG Department DG Department DG AAT Sourcing – QA Comp-LAB Plant 1-ENG1 ADM (Administration)DEE1Plant 1-PROD1 BD (Business Development)DEM1Plant 1-GSM1 DC (Document Control)GSM-PROD1Plant 1-SMD1 GSM/DEE IQC1Plant 2-ENG1 PCT (Procurement)MSE1Plant 2-PROD1 PMGT (Product Management)PA/GA1R&D SZ1 PUR (Purchasing)11PMC SMT2

R&D11PQC TE

Shipping QA1

Store QA-LAB

Others :

VTech Canada (Vancouver)1

VTech Canada (Calgary)1

Prepared by:( TITLE )

( Name )

Date:( M/D/Y )

Approved by:( TITLE )

( Name )

Date:( M/D/Y )

Content

1.Introduction of Wire Bonding (3)

2.VTT Wire Bonding Equipment List (3)

3.Process Flow Chart (5)

3.1Wire Bonding General Flow Chart (5)

3.2Relationship of Wire Bonding and Other Processes (6)

3.3Product Development Schedule for Bonding Die (7)

4.PCB Board Size (8)

5.PCB Material (9)

6.Dummy Edge (9)

7.Method of Penalization and Depanel (9)

8.Alignmnet for Die (11)

9.Pad and Land for Chip On Board (12)

10.Bonding Wire (16)

11.Clearance for Wire Bonding (16)

12.Subsequent Process Influence (18)

12.1S MT (18)

12.2W ave Solder (19)

12.3W ave Solder Chip On Board (19)

13.Material for Wire Bonding (20)

13.1D ie Attach Silver Epoxy (20)

13.2E ncapsulant (22)

14.Die Incoming Package (24)

15.De-capsulation (26)

16.Workmanship (27)

17.Appendix (28)

1. Introduction to Wire Bonding

Wedge bonding is a solid state process. The primary bonding parameters in wedge bonding are ultrasonic power, force, and time. When bonding gold wire, the fourth parameter of heat is added. Wedge bonding joins two pieces of metal using a process of diffusion. The bonding wire is mechanically bonded to the die pad or package

metallization by rubbing the surfaces of the wire and metallization together. This rubbing occurs by vibrating a clamped wedge at ultrasonic frequency while the wire is held under the bond foot of the wedge. Commonly called scrubbing, this rubbing disturbs any surface oxide film, exposes clean metallic surfaces and forms a metallurgical weld. This metallurgical weld is not degraded significantly by heat.

(Gaiser Tool Company)

2. VTT Wire Bonding Equipment List a. Alumiinum Wire Bonder ASM AB559A-06b. Aluminum Wire Bonder ASM AB559c. Aluminum Wire Bonder ASM AB509 d. Aluminum Wire Bonder K&S 1470e. Manual Wire Bonder K&S 4523f. Glue Encapsulator CAM/ALOT 3700 g. Glue Encapsulator CAM/ALOT 1414h. Glue Encapsulator FDPX-520S i. Die Bonder

ASM AD809j. Die Bonder ASM AD889k.

Bond Wire Strength Tester Dage 2400

Die

Encapsulant