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BGA及类似器件的底部填充和点胶封装工艺

作者：杨根林东莞市安达自动化设备有限公司BGA及类似器件的底部填充和点胶封装工艺摘要当前，高可靠性要求的航空航天航海、动车、汽车、室外LED照明、太阳能及军工企业的电子产品，电路板上的焊球阵列器件（BGA/CSP/WLP/POP）及特殊器件，都面临着微小型化的趋势（见图1），而板厚 1.0mm以下的薄PCB或柔性高密度组装基板，器件与基板间的焊接点在机械和热应力下作用下变得很脆弱，为提高PCBA及产品的可靠性，于是底部填充和点胶封装技术应用变得日益普遍，见图2。

底部填充和点胶封装工艺有多种，本文所指为毛细效应底部填充（Capillary Under-fill），把填充胶分配涂敷到组装好的器件边缘，利用液体的“毛细效应”使胶水渗透填充满芯片底部，而后加热使填充胶与芯片基材、焊点和PCB基板三者为一体。

通过底部填充和点胶封装工艺，不仅可减少BGA及类似器件因热膨胀系数(CTE)失配可能引发的焊点失效，还能为产品的跌落、扭曲、振动、湿气等提供很好的保护。

在相关绝缘胶的作用下，器件在遭受应力后将被分散释放，从而增加焊点的抗疲劳能力、机械连接强度，达到提高产品可靠性的目的。

图1 焊球阵列器件封装小型化趋势图2底部填充需求的常规定义为让BGA及类似器件有效填充和点胶封装，作业前须选择性能较好的胶水、恰当的点胶路径和点胶针头（Needle）或喷嘴（Nozzle），并正确地设置点胶参数以控制稳定相宜的胶水流量。

点胶后，须作首件检验确认点胶和填充效果，烘烤条件需符合胶水特性及产品特点，以确保胶水完全固化。

固化后，须做外观检查和测试，确保填充效果有效可靠。

点胶和填充时须避免汽泡，固化后需避免产生空洞，形成满意的边缘角或达到特定的填充效果，降低现场失效提高产品长期可靠性。

在选择胶水时，须选用可返修的，并注意返修方法。

关键词焊球阵列器件（BGA/CSP/WLP/POP），可靠性（Reliability），自动点胶机（Automatic Dispenser），底部填充（Under-fill），环氧树脂（Epoxy resin），高密度互连（HDI），点胶/喷胶，汽泡/空洞，声波微成像技术，可返修性（Rework-able）一、 BGA及类似器件的点胶工艺及底部填充的作用电子产品的点胶工艺多种多样，比如摄像镜头的密封固定（Lens Locking），光学镀膜防反射和红外线滤光片粘接（AR/IR Filter Attach），玻璃防护盖(Glass Lid)密封固定，镜头框架（Lens Holder）与基座或PCB基板粘接，影像芯片COB裸晶邦定（Die Attach），以及CCD/CMOS表面封装器件或其图3 相机模组主要的胶粘工艺图4底部填充和非底部填充的跌落试验效果PCB基板复杂多样，比如厚度1.0mm以下的PCB、Rigid-Flex PC、FPC、Ceramic PC、Metal PC 等，这些基板在SMT制程中不仅要克服PCB翘曲变形或易碎的问题，在测试组装中更要保护焊点免受外力破坏。

亚斯华科技有限公司产品手册说明书

項次相片類別品名廠牌型號
數量廠商牌價預定價格備註1
管配件相關Air Solenold Valve
Kaneko
M95G-8-301-H
2
新品
項次相片類別品名
廠牌型號
數量廠商牌價預定價格備註1
管配件相關Pneumatic Valve
NDV
P01430N-EP-015A-07-J10KFF
2
新品
項次相片類別
品名
廠牌型號數量廠商牌價預定價格備註1
管配件相關手動閥
KITZ
3
新品
2管配件相關手動閥KITZ
3新品
Kaneko NDV KITZ 自、手動閥 Automatic,Manual Valve 2
11
J 4
11
M
項次相片
類別
品名
廠牌型號
數量廠商牌價
預定價格
備註3
管配件相關手動閥
KITZ
4
新品
4管配件相關手動閥KITZ UJB15-43新品
5管配件相關手動閥KITZ UJB25-11新品
6管配件相關手動閥KITZ UJB50-15新品
7管配件相關手動閥KITZ UJB40-13新品
項次相片類別
品名
廠牌型號
數量廠商牌價預定價格備註1
管配件相關自動閥
KTM
M490-D100-81K
1
新品
項次相片類別
品名廠牌型號
數量廠商牌價預定價格備註1
管配件相關自動閥
Nippon
H014N-1042
1
新品
Nippon KTM 2
1Q。

高效液相色谱仪（3台）

高效液相色谱仪（3台）高效液相色谱仪（3台）详细配置：1. 高效液相色谱主机（包含四元低压梯度泵，自动进样器，柱温箱）1套2. 二极管阵列检测器1台3. 样品瓶微量进样瓶300个4. 色谱柱2根5. 色谱工作站软件1套6. 电脑（带刻录机）打印机1套7、不间断电源（3KW/1H）重要参数及指标：1.液相色谱部分：泵系统：四元泵系统1.1每台流量范围：0.001-10.000 mL/min1.2最大压力≥40 Mpa1.3脉动：±0.1MPa(水,1.0ml/min输液时)1.4流量精度：≤0.06%RSD1.5梯度精密度：≤0.15%RSD，流速为0.2和1.0ml时1.6 溶剂数：4种1.7在线脱气：二极管阵列检测器1.1波长范围：190－800nm；1.2波长精密度：±0.1nm；1.2灯：氘灯、钨灯；1.3波长准确度：＜1nm；1.4噪声：<±1.0×10-5Au(254nm)；1.5基线漂移：<±8.0×10-4Au/h(254nm)；自动进样器：1.1交叉污染：0.004%1.2进样体积：0.01~100 μl1.2进样准确度：±1％1.3进样量精密度：0.2％RSD以下1.4试样处理数：1.5ml瓶≥96个。

1.5样速度：10μL进样量≤20秒柱温箱：1.1温控范围：室温~80℃1.3温控精度：±0.5℃1.4 柱容量：≥3根(300mm色谱柱)色谱软件：1.1中文，可容Windows XP或Vista或Win7系统；1.2具有3D扫描功能，能做纯度分析，光谱匹配度分析1.3可自动进行数据采集和后处理，具有系统适应性软件，计算分离度、理论塔板数、拖尾因子、容量因子、信噪比等。

1.4可提供适时分析条件参数和分析结果，在线监测和采集泵压力变化数据。

1.5可使用PDF、EXCEL等格式输出实验结果。

派克液压密封件说明书

保留修改权利2021年6月警告销售条件本样本中产品和/或系统或相关产品出现故障，选型不当或使用不当，均可能导致人身伤亡和财产损失。

本文档以及由派克·汉尼汾公司及其子公司和授权经销商提供的其他资料，为具有技术知识的用户提供进一步研究所需的产品和/或系统选项。

重要的是，用户必须对您的应用进行全面的分析，并对当前产品样本中与产品或系统相关的资料进行评估。

由于工作条件以及产品或系统的多样性，用户必须自行分析和测试，并独自承担一切后果，包括:产品和系统的最终选型以及确保满足应用的所有性能、安全和警告等方面的要求。

派克·汉尼汾及其子公司可能会随时对本样本中的产品，包括但不限于:产品的特性、产品的规格、产品的结构、产品的有效性以及产品的价格作出变更而不另行通知.本样本中的所有产品均由派克·汉尼汾公司及其子公司和援权经销商销售。

与派克签订的任何销售合同均按照派克标准条件和销售条件中规定的条款执行(提供复印件备索)。

本公司的密封件，只能在本公司的文件资料述及的应用参数范围与接触介质、压力、温度和存放时间相一致的情况下才能使用。

在规定的应用参数范围外使用以及错误选用不同的材料都可能导致密封件寿命的缩短以及设备的损坏，甚至更严重的后果(如生命安全，环境污染等)。

样本中所列出的工作压力、温度范围、运动速度是极限值，它们之间相互关联、相互影响；在极端的工况下，建议不要同时把各个参数都同时用到极限值。

对于特殊的要求（压力、温度、速度、介质等），请联系派克汉尼汾公司以咨询合适的密封结构、材料、配置、安装建议等。

由于诸多工作参数会影响到流体传动系统及密封元件，这些设备的制造商必须在实际工作条件下测试、验证并批准密封系统的功能与可靠性。

此外，对于不断出现的新的介质（液压油、润滑脂、清洗剂等)，用户特别注意它们与目前所用的密封件弹性体材料的兼容性。

我们建议用户在大批量应用之前，在厂内或现场先做密封材料的兼容性能测试，作为密封产品与系统供应商，我们建议用户遵循我们的这些建议。

超滤反渗透操作维护手册

2)膜元件内独特的流量分配器保证液体在膜元件和压力容器的整个长度方向都有效作用，确保流量分配均匀。
3)带化学药品反洗，比停车清洗更易实现自动化，清洗效果更彻底，系统需停车时间更短。
4)系统管路简单，方便处理。
D超滤系统与传统工艺的比较
超滤系统与传统工艺（化学加药+多介质过滤器+活性碳过滤器）相比具有以下优点：
规范
数量
1
超滤设备
Q=76m3/h，每套含海德能公司生产HYDRACAP60膜组件24件，回收率≥90％
4套
2
超滤膜组件
海德能公司的HYDRACAP60膜组件
共96只
型式
内压式中空纤维膜
型号
HYDRACAP60
膜元件有效面积
46m2
膜工作通量
60-140L/ m2h
反洗通量
300-340L/ m2h
推荐本系统选用进口复合阻垢剂Buckmen8802，它可以提高水中的难溶物质的饱和度，它主要具有以下功能：1）抑制析出作用；2）分散作用；3）晶格扭曲作用；4）络合作用。
采用该种阻垢剂后，具体阻垢能力表现如下：
膜内径/外径
0.8/1.2mm
最大进水压力
0.50MPa
反洗进水最大压力
0.24MPa
运行压差
0.02-0.15MPa
3
超滤给水泵
PWT125-100-315Q=150m3/h P=0.30MPa
Pentair
3台
4
超滤保安过滤器
50μm，DN700
2台
5
超滤保安过滤器滤芯
HFU620UY200J-20T，美国PALL
（4）热工仪表及程控系统
每套UF设备都配有相应的流量变送器，压力变送器，共用系统PLC控制系统。

耐强碱消泡剂

耐强碱消泡剂、耐强酸消泡剂、高温强碱消泡剂
作者：德丰
一、【产品说明】：耐强碱消泡剂是我公司新的研究成果，其突出特点是在中高温强碱条
件下能迅速消泡，持久抑泡。

具有优异的消泡、抑泡性能，品质已赶上和超
过一些进口品牌。

此外在高碱度的化学清洗中使用，比普通有机硅消泡剂具有
长得多的抑泡时间。

本品特点：高含量、溶水性好、不漂油、耐强酸碱、耐
高温60～130℃，在非离子和阴离子的表面活性剂系统中均能显示出优异的抑
泡持久性和良好的消泡性。

二、【技术指标】：
型号…………………………………DF-380/381
外观…………………………………白色乳状液体/透明状液体
乳液离子性质………………………非离子
乳液稳定性（3000r/m）……………不分层
密度（25°C）………………………1.00±0.10g/cm3
保质期…………………………………半年
注：本数据表所列数值只描述了本产品典型的性质，不代表规格范围。

三、【产品特点】：
1、消泡、抑泡力强，用量少，不影响起泡体系的基本性质。

2、耐热性好，化学性稳定，无腐蚀、无毒、无不良副作用、不燃、不爆。

3、其性能可与进口产品相媲美，而价格更具明显之优势。

四、【应用场合】：
应用于：粘合剂工、清洗工业、纺织印染工业、造纸工业、油田工业、发酵
工业等。

五、【使用方法】：耐强碱消泡剂直接使用，使用量根据现场泡沫情况而定，建议用量：
为0.1%～0.8%,终用量根据实际实验。

深水海纳公司产品介绍

12-15个月
第四级
超滤过滤器
韩国KOLON集团度假技术，仿肾脏透析原理，精密聚砜材质膜丝高效去除残留细菌、病毒，并保留有益矿物质。
24个月
三、“茉莉泉”淋浴净化器
产品外形：
型号：HBB 尺寸：220*70*142mm
零售价：398
产品特征

针对家庭沐浴用水，有效去除水中余氯、三卤甲烷、四氯化碳、硫化氢及重金属等对人体皮肤有侵害的物质；软化水质，降低水的硬度，减少水垢，保证沐浴用水的洁净； 40000升超大水处理量；安全、方便、免维护。长期使用，可美容保湿肌肤，保护肌肤健康，保护发质，同时还有按摩保健的功能。
9-12个月
第二级
椰炭滤芯
9-12个月
第三级
矿物质碱性还原滤芯
12-18个月
第四级
UF膜滤芯
24个月
技术参数
产品名称型号名外形尺寸冷热式净水机天灵 355*455*1250mm
水箱大小
冷水
3L
热水
2.8L
储水
10L
额定电压有效净水量耗电量
220W,60Hz 2700L 冷水 10 热水 5 W 450W
深水海纳公司产品介绍
资料整合：王晨宇
一、洁水天使（HC-UF-1800）
产品外形：
尺寸：380*130*385mm 价格：2180
产品特征

产品采用超滤工艺，能有效去除原水中的泥沙、悬浮物、胶体、余氯、有机物、重金属、细菌、病毒等对人体有害物质，同时保留对人体有益的微量元素和矿物质，出水可直接饮用，长期饮用，有利健康；全自动机械控制制水，无需电源；安装、使用、维护方便；适合安装于家庭厨柜内；获得韩国净水协会“水”认证、ISO、AWT、 UKAS等多种国际认证，质量更有保障。

瀚斯宝丽使用说明

第 3 章：输入文本 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
文本输入方法 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 使用 (QWERTY) 键盘输入文本 . . . . . . . . . . . . . . . . . . . . . . . . . . 18 使用符号 / 数字模式 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
硬件连接 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 电脑连接 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 存储卡 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 附件连接 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 软件连接 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 浏览器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Wi-Fi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 蓝牙 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 虚拟专用网 (VPN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 27 27 28 29 29 30 30 30

汉高电子胶水应用分类

HenkelElectronics Assembly SolutionsIrvine,CaliforniaRancho Dominguez, CaliforniaSan Diego,CaliforniaOntario,CaliforniaHemel Hempstead, UKLinton, UKTainan, TaiwanSeoul, Korea Lianyungang,ChinaShanghai, ChinaIpoh, MalaysiaKuala Lumpur, MalaysiaEcatepec de Morelos,MexicoDublin, IrelandYantai,ChinaIsogo, JapanHokkaido,JapanKakogawa, JapanAtsugi, Japan Port Huron, MichiganOlean, New YorkBillerica,MassachusettsWesterlo,BelgiumScheemda,NetherlandsCanton, MassachusettsSalisbury, North CarolinaSao Paulo, BrazilCity of Industry, CaliforniaManaus, BrazilElEctronics Group of HEnkElPlease see LT-5013 for SemiconductorToday’s electronics assembly market can be complex.Your materials supplier partnership shouldn’t be. That’s why Henkel has researched, analyzed,designed and formulated the most comprehensive range of advanced assembly materials available. We deliver unprecedented choice, convenience and, above all, a low-risk proposition to your business so that complexity is eliminated and performance is elevated. Any application that requires joining, bonding, adhering or protecting an electronicassembly will benefit from the value-added solutions within Henkel’s unmatched technology toolbox.Our leading-edge materials are uniquely strengthened by the exceptional expertise of our people. Bringing together the industry’s best and brightest chemists, applications experts, sales professionals, technical support specialists, scientists and researchers all under the guidance of aknowledgeable and dedicated management team, Henkel provides the depth ofexperience and breadth of capability you need to get the job done. Our worldwide service, manufacturing, sales and product development network delivers the global footprint that enables your company’s competitiveness – regardless of your requirements or your locale.Henkel’s successful history is only superseded by our promising future. Even as we havecommercialized ground-breaking formulations for modern electronics manufacture, we are diligently researching and developing materials technology that will make tomorrow’s products possible.Potting CompoundsConformal CoatingsPhotonic Componentand Assembly Materialssurface Mount Adhesivessemiconductor Molding Compoundsthermal Management MaterialsFlip Chip-on-BoardUnderfillsLiquid encapsulantsDam and FilloptoelectronicsDie Attach Adhesivessolder MaterialsLow Pressure MoldingsLiquid encapsulantsGlob top silicone encapsulantsGasketing Compounds CsP/BGA UnderfillsFlip Chip in Package Underfillselectronic MoldingCompoundsCoating PowdersautoMotive electronicSAddressing the needs of today’s advancedautomotive industry, Henkel has developed a broad range of conductive paste and film adhesives, glob top and underfill encapsulants, conformal coatings, sealants, potting encapsulants and solder products, technical and analytical test support, and customized formulations to meet increasingly demanding requirements. Our solutions are used in a wide range of vehicle electronic and sensor components for common rail fuel systems, safety electronics, engine and powertrain management, infotainment, and lighting applications.conSuMer & induStrialelectronicSConsumer and industrial applications requirematerials solutions that can meet the ever-changing demands for high reliability andimproved performance. With decades of materialsdevelopment expertise, Henkel offers a widerange of assembly and protection materials forchallenging industrial and consumer electronicsenvironments. We also offer advanced conformalcoatings to be used in protecting electronics circuitsfrom moisture, chemicals and other contaminants.But, we haven’t stopped there, with an unyieldingcommitment to sustainability, Henkel has developedmaterials that not only deliver the high reliabilityrequired, but also address the needs of ourenvironment. Halogen-free, lead-free, solvent-freeand low-VOC materials are all part of our portfolioand our ongoing promise to be environmentallyresponsible. All these innovative solutions willenable manufacturers to introduce products fasterto market and improve production efficiency.defenSe & aeroSPaceelectronicSHenkel has more than 35 yearsof experience in supplying thedefense and aerospace industrywith Emerson & Cuming™,Ablestik™, Loctite®, Hysol® andMulticore® product solutions.We are qualified and specified byall major defense and aerospaceOEMs and contractors, andsupport our products througha worldwide sales, applicationengineering, research anddevelopment, and manufacturingnetwork.certification to major defenseand aerospace specifications,and technical expertise ensurethat products built with Henkelelectronic assembly materialswill be both the highest inperformance and in reliability.We are committed to meetingand exceeding your requirementswith:• M IL-STD 883, Method 5011approved products• N ASA outgassing ASTM E595-77/84/90 approved products• P roven film and pastetechnology in Defense andAerospace applications• C ustom film pre-formmanufacturing capability• Low-risk supply chainHandHeld coMMunicationS& coMPutingHenkel designs and sells materials that improve the quality, robustness, use life and cost of laptops, mobile phones, MP3 players, game consoles, digital cameras, memory cards, and a range of other handheld devices and associated products. Our broad portfolio of encapsulants, adhesives, solder pastes, inks and coatings are used by designers and manufacturers during circuit assembly.We offer innovative products optimized to provide theprocessibility needed for intricate handheld applications. The materials Snap Cure at low temperatures to keep pace with fast production cycle times and are highly stable, offering convenient storage, staging and use conditions. We custom formulate and optimize current technology platforms to integrate with customers’ unique processes and needs, and continue to develop future technology platforms that offer greater value to customers by combining new benefits with lower overall cost of use.Henkel offers a wide range of underfills that improve themechanical robustness of CSP, BGA, LGA and WLSP components in mobile phones and other handheld devices, as well as underfills that dramatically improve the thermal cycle reliability of FlipChip assemblies. We also offer a large selection of solder paste and conductive adhesives used to interconnect components and circuitry. Our line of thermal interface materials are used for a variety of thermal management challenges in laptops and handhelds. Henkel has developed halogen-free conductive inks used in membranes for keyboards to provide optimal ERperformance. Our coatings provide excellent moisture and environmental protection for delicatecircuitry in handheld devices.led ligHtingHenkel manufactures numerous assemblyand protection materials for the demanding requirements of photovoltaic electronics. Whether your solar cells and modules are based on silicon, thin film, concentrator, dye sensitized or organic technology, Henkel materials enable a robust assembly, providing the performance and reliabilityrequired. Our portfolio consists of thermallyconductive materials, electrically conductiveadhesives and inks, as well as fluxes, solders,encapsulation materials, dielectric adhesives andsealants for assembly of photovoltaic modules.Lighting advancements are one of the mostpromising areas of electronics market growth.In fact, by some estimates, the LED market isprojected to grow at CAGR rates in the doubledigits over the next few years. Driven by the needfor high brightness (HB) LEDs and the requirementto manufacture these even more efficiently,opportunities in the lighting market abound.Success, however, depends on partnering with theright material supplier who can deliver both LEDassembly and protection solutions.With unmatched expertise in this market andnow empowered by the integration of the well-respected Ablestik™, Emerson & Cuming™, Hysol®and Loctite® brands, Henkel offers a broad rangeof products to meet the increasingly demandingrequirements of LED-based lighting assembly andprotection. Our extended product line covers LEDencapsulant, die attach, PCB protection and thermalmanagement materials. High performance inksare also available for applications that dictate aprintable solution.Medical electronicSAccurate diagnosis, improved alternative treatments, patientmonitoring: electronic technology and related assembly materials are having an ever-increasing impact on healthcare. They improve access to healthcare, enabling more accurate collection of patient data for more precise treatment. They enable doctors to treat more patients with less, reducing the costs and improving the effectiveness of total healthcare and expanding the capability to treat chronic medical conditions. Implanting medical devices, as well as improving ease of use, requires a form factor that is achieved through advanced electronic components, materials and assembly methods. Henkel combines local technical support and applies materials developed for the most advanced electronic assembly processes to provide solutions for applications ranging from printing simple biological sensors to advanced implantable micro-electronic assemblies.Used for everything from toll booths to department store inventory control to pet identification, Radio Frequency Identification (RFID) tags are devices capable of uniquely identifying an object via a pre-programmed response when queried by an external radio frequency wave.Today’s RFID tags consist of a graphic overlay and an inlay, with the inlay being the functional part of the tag and containing the die (used to carry the coded information) and the antenna (used to both transmit and receive RF signals). Critical to the assembly of the tags and their robust in-field performance is the selection of adhesives used to construct these devices.Adhesive materials are used to attach diesonto antenna to build the inlays, which can be constructed in one of two ways:1. A n interconnect adhesive is used to attach a small bare die directly to an antenna.2. An interconnect adhesive is first used to build a much larger packaged die (interposer or die strap), which is then adhered onto an antenna.Both methods of assembly have been successfully employed to make active and passive RFID tags.Henkel’s line of RFID adhesives are advancing this critical technology by addressing the dichotomy of high-performance and lower-cost assembly that defines the RFID market. By formulating materials that offer increased throughput, exceptionalprocessability, simplified manufacturing techniques and outstanding in-field reliability, Henkel isfacilitating higher yield, lower cost manufacturingfor modern RFID assembly.Die Strap AttachDirect Die AttachAdhesive Antenna Inkradio freQuencyidentification (rfid)WireleSS datacoMinfraStructureHenkel supplies high-performance assembly materials for electronics in wirelesstelecommunications infrastructure equipment. With our unique RF grounding adhesives, available in both film and paste formats, we have earned a leading position in the assembly of base station electronics, as well as point-to-point and point-to-multipoint radiolink devices, satellite electronics, wireless home/office equipment and fiber optics.Henkel products are used in the assembly of power amplifiers, transmitters, receivers, couplers, and filters, as well as RF modules such as system-in-packages, power transistors, oscillators, optical fiber and more.Our unique product line meets emerging market demands for improved RF performance in next-generation wireless telecommunicationsequipment, as well as increased thermal dissipation requirements for achieving longer distance communication capabilities. Henkel’s solutions for these market challenges include RF groundingadhesives in film and paste formats, thermal interface materials for heat dissipation of highpower components, electrically conductive adhesives as lead-free solder alternatives for active and passive component attach, lid seal adhesives, and underfills for component reinforcement.adHeSiveS to address today’s most demanding applications.From electrically conductive and non-conductivepaste adhesives through to thermally conductivedielectric materials, Henkel’s product line affordsmaximum performance and cost-efficiency.Our electrically conductive and non-conductive pasteadhesives are ideal for withstanding the thermal andphysical stresses of Defense, Automotive, Medicaland Consumer Electronic assembly applications,while our spot cure technologies enable high-speedassembly for RFID tags and other printed electronicdevices. Non-conductive paste systems in the Henkelportfolio include a series of one- and two-part roomtemperature, thermal and UV cure adhesives for theultimate in flexibility and performance.For manufacturers that require both adhesive andthermal dissipation functionality, Henkel’s lineProviding outstanding adhesion and thermalperformance, Henkel offers both shimmed and non-shimmed formulations. For assembly specialiststhat require the utmost in accuracy, our shimmedadhesives contain engineered spacers for moreprecise bondline control.adHeSiveSadHeSiveSadHeSiveSadHeSiveSdiSPlay MaterialSWith materials solutions for many facets of flat panel display (FPD) production, Henkel deliversa variety of Loctite®, Hysol®, P3®, Eccoseal™ and Electrodag™ branded products that enable highly efficient manufacturing and excellent reliability.For color filter production, the P3® line of cleaners, developers and strippers ensures that the essential FPD color filters are prepared properly and are very stable for the subsequent module assembly process. With both off-the-shelf and customer-developed materials, Henkel’s FPD line of materials enable highly efficient, advanced product manufacture.Module and panel assembly materials are also part of Henkel’s core competency. The Loctite® brandof UV curable temporary bonding and endseal materials are used to deliver a robust, complete panel assembly. In addition, Henkel has developed pin terminal bonding, overcoat and flexible printed circuit (FPC) materials to help reinforce and facilitate exceptional and reliable product-to-host connection. The Hysol® QMI brand of through-hole bonding materials delivers a reliable panel assembly withits flexibility and low temperature curability. The newly joined Eccoseal™ brand provides UV cureand low temperature, fast cure perimeter sealants for displays requiring extreme protection against moisture, such as organic light-emitting diode (OLED) displays and electronic paper displays (EPD). The Electrodag™ brand provides thick polymer film ink for many applications including ITO-coated film. For display applications, a thermoplastic resin-based conductive ink is used to deliver a reliable printed busbar for touch screens with its low temperature process profile, wide range of flexibility and stable electric conductivity.diSPlay MaterialSinkS & coatingS For decades, Henkel’s product range of conductive,dielectric and other functional polymer thick filminks have been used to apply selective coatings ona variety of flexible and rigid substrates, via screen,flexographic and rotogravure printing methods.They can be effectively dried or cured through heator UV radiation. Henkel’s conductive (silver, silver/silverchloride, carbon-based), dielectric andother functional (e.g., electroluminescingpigments–based) inks are used for theproduction of:• F lexible circuits for membrane touch switchesand keyboards for desktop and notebook PCs• Heating elements• Automotive sensors• Biosensors and EKG/ECG electrodes• A ntennas for contactless smartcards andRFID labels• Touch screens• EL lamps• P rinted circuit boards andpotentiometersMicro-encaPSulantS (cSP underfillS)Henkel offers innovative capillary flow underfill encapsulants for Flip Chip, CSP and BGA devices. These are highly flowable, high purity, one-component encapsulants. They form a uniform and void-free underfill layer to improve the reliability performance by redistributing stress away fromthe solder interconnects as well as enhancing mechanical performance. We have formulations that quickly fill very small gap/pitch parts that offer fast cure capabilities, have a long pot and shelf life, and are reworkable. Reworkability allows for cost savings by allowing the removal of the underfill to enable re-use of a board.Flip Chip applications require assistance with redistributing stress away from the solder joints to extend thermal aging and cycle life. A CSP or BGA application requires an underfill to improve the mechanical integrity of the assembly during a bend, vibration or drop test. Henkel’s Flip Chip underfills are formulated with a high loading of specialty fillers to achieve low CTEs yet maintain the ability to flow fast in small gaps, possessing high glass transition temperatures and high modulus. Our CSP underfills are designed with little to no filler loading, a choice of glass transition temperatures, and modulus to match the intended application. For certain applications, Loctite® Cornerbond™ and Edgebond™ technologies allow for a cost-effective underfill solutions. The Cornerbond™ technology is applied at all four corners of the package and then can be cured during the normal solder reflow cycle, allowing for a more efficient process. The material’s self-centering characteristic ensures high assembly reliability and outstanding yield rates.Micro-encaPSulantS (cob encaPSulantS)Encapsulants are used to provide environmental protection and add mechanical strength towire bonded devices. Two different application technologies are employed for the protective encapsulation of wire bonded die:• G lob top technology requires an encapsulant with a fine-tuned rheology, as the flow capabilities must allow the wires to be covered without the encapsulant flowing beyond the chip.• D am and fill technology, where the dam is usedto limit the flow of the low viscosity fill material, allowing its use with fine pitch wire leads. Henkel’s Hysol® and Eccobond™ encapsulantsare available as either thermal or ultraviolet cure materials and are designed for the highest reliability in that they offer low coefficient of thermal expansion, high glass transition temperature, and low ionic content. These encapsulants have been engineered to provide protection to wire bonds, leads, aluminium and silicon dies from harsh environments, mechanical damage and corrosion. Formulated from epoxy, polyurethane, acrylate (UV curable) and silicone chemistries, these systems have proven reliability for electronic insulation. Henkel encapsulants offer excellent elevated temperature stability and thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage and low stress during cure, as well as excellent chemical resistance. Our encapsulants have been designed to offer high throughput and low-cost assembly processes.While Henkel is providing the leading materials used inside advanced packages and on sophisticated assemblies, we also deliver next-generation Loctite® and Eccocoat™ brand conformal coating materials to ensure superior product protection. Many applications expose printed circuit boards (PCBs)to harsh environments and Henkel is committedto delivering materials that provide extraordinary environmental and thermal cycling protection.Our advanced conformal coating materials protect PCBs from thermal shock, moisture corrosive materials, and a variety of other adverse conditions to ensure long product life cycles in harsh marine, automotive, aerospace and consumer electronics applications. We also keep the environment top of mind with every formulation, which is why Henkel has migrated to solvent-free, low-VOC materials and processes. Loctite® and Eccocoat™ conformal coatings areavailable in solvent-free and fast curematerials, enablingprocess efficiencyand environmentalresponsibility.Pcb ProtectionPcb ProtectionEnsuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermalcycling and adverse environmental conditions is the other critical component for product durability and reliability. Under the leading Hysol® and Stycast™ brands, Henkel offers several PCB protectionproducts to minimize external product stress and maximize performance. Our portfolio of conformal coatings keeps moisture, humidity and other adverse conditions from deteriorating printed circuit boardsused in harsh marine, automotive, aerospace and consumer electronics applications. Henkel also strives to keep environmental consciousness at the forefront of all our product development efforts, which is why we have moved toward solvent-free, low-VOC materials and processes.Henkel’s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, offering electrical insulation, and protecting against vibration and shock.Pcb ProtectionPcb ProtectionLoctite® silicone gasketing materials offer precise, reliable sealing for electronic enclosures, ensuring that housing modules are tightly secured and componentry is protected. Loctite® siliconeencapsulants are specially formulated to isolate sensitive fine-pitch leads from potentially damaging thermal cycling conditions. Like all Henkelproducts, these materials have been designed for ease-of-use and are conveniently packaged for dispense operations.Pcb ProtectionHenkel’s renowned Macromelt® low-pressuremolding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage: because the entire Macromelt® operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged, delivering measurable improvements over that of traditional potting or encapsulating processes. PCB and circuitry protection is essential in modern, challenging applications; and Henkel delivers manufacturers proven, reliable solutions and peace-of-mind.Advantages:• Complete watertight encapsulation • Fast cycle time (15 to 45 seconds)• Low capital equipment costs• Safe, one component, UL 94V-0 approved • L ow pressure and high speed molding for electronics encapsulation Applications:• Automotive sensors • Strain relief • Hall effect sensors• Switches• Circuit board protection• Battery sealingSolder MaterialS performance liquid flux technology is compatiblewith dual-wave and lead-free processes, deliveringoutstanding results. From no-clean to low-residueto VOC-free, Multicore® brand fluxes deliver uniqueproperties for individualized manufacturing needs.Henkel’s flux formulation teams are unmatchedof modern, lead-free and environmentallyresponsible processes. Through careful processanalysis and a complete understanding of chemicalinteractions and manufacturing requirements,Henkel has developed a broad range of Multicore®brand liquid fluxes to suit a variety of applications.Solder MaterialSAs the world’s leading developer of advanced solder paste materials, Henkel delivers decadesof technology and expertise for optimizedprocess performance. With groundbreaking new formulations to provide an easy transition tolead-free as well as proven, traditional tin-lead formulations, Multicore® brand solder materials are enabling the production of some of today’s most advanced products. Our portfolio of solder paste materials addresses a variety of manufacturing requirements and offers performance characteristics unmatched by any other materials supplier. Low-voiding lead-free solder pastes, no-clean pastes, water-wash pastes and crossover pastes for mixed-metal manufacturing are all part of our vast offering. Supporting ultra-fine pitch printing athigh speed, delivering long open and abandon times and pin-testability across all types of assembliesand surface finishes, Multicore® pastes deliver the flexibility modern electronics firms require to stay competitive. Our materials also offer outstanding resistance to high temperature and high humidity, providing multinational firms with the confidence they need to deploy Multicore® materials on a global level with consistent performance. Plus, all of our products are supported locally with outstanding technical expertise and are backed by Henkel’s global infrastructure and inimitable resource base.Solder MaterialSThe Multicore® portfolio of cored solder wirefeatures the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers ease of use and outstanding performance for today’s delicate hand soldering assembly and rework operations.Formulated with a variety of different alloy selections, Multicore® cored wires supporttraditional tin-lead manufacturing operations as well as modern lead-free processes. Our fast-wetting materials deliver excellent solder joint integrity and outstanding long-term performance.As the first commercially available adhesive toaddress the emerging surface-mount market inthe 1980s, Loctite® Chipbonder™ and Eccobond™products today are the industry standard for mixed-technology and double-sided SMT applications.Henkel offers a wide range of Chipbonder™ andEccobond™ products to meet the diversity andchallenges of today’s manufacturing requirements.Developed using in-process analysis ensures thatHenkel’s surface mount adhesives can address high-speed assembly processes while delivering lead-freecompatibility with no loss in productivity. Theportfolio includes formulations for low-temperaturescreen printing and dispensing.Surface Mount adHeSiveS(cHiPbonder™)Henkel’s thermal materials scientists have developed some unique and user-friendly products to address the requirements of today’s thermal transfer priorities. The Loctite® line of Phase Change Thermal Interface Materials (PCTIM) offers exceptionallylow thermal impedance between heat dissipating devices and the surface to which the componentis mounted. The premiere product in this line-up, Loctite® Powerstrate™ Xtreme™ adheres to heat sinks or components without heating, delivering amazing ease-of-use without compromising thermal performance. Henkel offers a wide range of thermally conductivefilm adhesives that are ideal for bonding largeareas or complex shapes. With customizedpreforms, adhesive can be placed precisely whereneeded, whether around through-holes or on anyarea requiring a specialized pattern, deliveringexceptional accuracy and enhanced performance.Offering the perfect blend of high thermalconductivity with varying degrees of flexibilityand adhesion, Henkel’s thermally enhanced filmproducts have been specially formulated for heatsink or thermal dissipation applications.tHerMal ManageMentMaterialS。

不同型号热分析仪铝坩埚尺寸汇总

上海和晟仪器科技有限公司
SHANGHAI HE SHENG INSTRUMENT co.,ltd
铝坩埚作为热分析仪中主要的配套工具，作为样品的载体。

铝为银白色金属，由于表面形氧化层而保护其不与空气和水起反应，易溶于稀硫酸、硝酸、盐酸、氢氧化钠和氢氧化钾溶液，难溶于水。

相对密度2.70。

熔点660℃。

沸点2327℃。

以其轻、良好的导电和导热性能、高反射性和耐氧化而被广泛使用。

货号型号品种品类尺寸（MM）体积约（ul）单价（元/套）HS010美国TA Q20固体铝坩埚Φ5.4*2.660 2.70
HS011美国TA Q20液体铝坩埚Φ5.4*250 2.70
HS012美国TA Q10固体铝坩埚Φ6.65*1.760 2.50
HS013美国TA Q10液体铝坩埚Φ6.8*2.7100 2.50
HS014瑞士梅特勒固液平底铝坩埚Φ6*1.750 2.80
HS015瑞士梅特勒固液定位铝坩埚Φ6*1.750 2.80
HS016梅特勒100ul100ul铝坩埚Φ6*4100 4.50
HS017铂金埃尔默PE固体铝坩埚Φ6.65*1.760 2.50
HS018铂金埃尔默PE液体铝坩埚Φ4.7*1.320 2.50
HS019德国耐驰固液铝坩埚Φ8*2.1100 2.70
HS020日本精工固体铝坩埚Φ5.2*2.550 2.50
HS021日本精工液体铝坩埚Φ6.8*2.7100 2.50
HS022日本岛津固体铝坩埚Φ5.7*1.740 2.50
HS023日本岛津液体铝坩埚Φ6*2.570 2.50
HS024上海和晟/国产固液铝坩埚Φ5*480 2.50。

黎明滤芯型号

XU-A系列回油过滤器滤芯型号：TXX-25×* TXX-40×* TXX-63×* TXX-100×* TXX-160X* TXX-250×* TXX-400×* TXX-630×* （*分别代表30，50）
GP系列磁性回油过滤器滤芯型号：GP300×*Q2 GP400×*Q2 GP500×*Q2 GP600×*Q2 （*分别代表3，5，10，20，30）
联系人：杨建林
联系电话：0316-7028020（6227270）
手机： 13513012114 18233644020
QQ： 1140779277
网址：
SRLF系列双筒回油管路过滤器滤芯型号：SFX-60×* SFX-110×* SFX-160×* SFX-240×* SFX-330×* SFX-500×* SFX-660×* SFX-850×* SFX-950×* SFX-1300×* （*分别代表1，3，5，10，20，30，40）
密封材料：氟胶圈丁晴胶
GU-H系列自封式压力管路过滤器滤芯型号：GX-10×* GX-25×* GX-40×* GX-63×* GX-100×* GX-160×* GX-250x* GX-400×* GX-630×* （*分别代表3，5，10，20，30，40）
ISV系列管路吸油过滤器滤芯型号：IX-40×* IX-63×* IX-100×* IX-160×* IX-250×* IX-400×* IX-630×* IX-800×* IX-1000×* （*分别代表80，100，180） ZU-A，QU-A，
旋装式管路过滤器滤芯型号：SPX-06×10，SPX-06X25，SPX-08×10、SPX-08×25、SPX-10×10、SPX-10×25、SPAX-10×10

莱宝产品手册

目录阀门与附件概述莱宝真空阀 3 产品“微型”阀门综述 6 角阀和直通阀，波纹管密封，多种驱动器7 ISO - KF法兰真空阀综述9 DN 16 ISO-KF 到DN 50 ISO-KF角阀，波纹管密封，手动操作10 直通阀，波纹管密封，手动操作11 角阀，波纹管密封（电磁）气动12 直通阀，波纹管密封（电磁）气动14 角阀和直通阀，电磁操作16 ISO - K法兰真空阀综述18 DN 63 ISO-K 到DN 160 ISO-K角阀，波纹管密封手动操作19 电磁气动操作21 DN 250 ISO-K角阀，波纹管密封，电磁气动操作23 DN 400 到DN 1000大角阀25 ISO - KF / ISO - K / CF 法兰真空阀综述27 DN 10 ISO-KF 到DN 40 ISO-KF or ISO-KSECUVAC真空安全阀28抗干扰抑制套件30 泄压阀31 断电破空阀，电磁32 粗调可变漏率阀，无隔离阀33 带隔离阀的可变漏率阀34 破空阀手动操作35 电磁气动操作36 真空锁和密封阀37 球阀39 电磁气动操作阀附件先导阀40 干扰抑制套件40 DN 250 ISO - K电磁线圈41涡轮分子泵特殊阀42 DN 16 CF 到DN 63 CFUHV全金属角阀UHV全金属角阀，两侧都带活套法兰44 UHV全金属可变漏率阀45 插板阀，配ISO - KF/CF/ISO - F法兰综述46 微型插板阀，ISO - KF，手动操作（活节杆）47 微型UHV插板阀，ISO - KF和CF手动操作（手轮）49 电磁气动操作51 HV插板阀，ISO - F手动操作53 电磁气动操作55 UHV插板阀，CF，手动操作57 UHV插板阀，电磁气动操作ISO - F法兰59 CF法兰61 法兰和真空连接件63 穿通密封接头64莱宝真空概述莱宝真空阀莱宝真空旨在通过提供各种隔离元所有应用都有以下共同要求：根据各种用途选择和设计的阀门与件和阀门满足客户与该类元件设计有关真空保护元件体现了莱宝真空长期以来 - 轻巧地打开，振动很小在真空工程方面的经验。

天宇正恒产品最新报价

特价硒鼓
碳 10 8 18 粉系
兄弟2050（120克）兄弟2050（100克）惠普1215彩粉
填充墨水
填充墨水 50 28毫升 2 70 100毫升 4 500毫升 25
9 8 30
惠普388（90克）惠普388（80克）佳能290
列 13 （100克）惠普2600彩粉
12 兰博2612A硒鼓 9 兰博388A硒鼓 50
硒鼓系列
TY-2612A TY-2613A TY-435A TY-436A TY-388A TY-505A TY-278A TY-7115A TY-4092A TY-3906F TY-5942A TY-5949A TY-7551A TY-7553A TY-4129X TY-7516A TY-1338A TY-1339A TY-4127X TY-4096A TY-3903F TY-92274A TY-6511A 惠普硒鼓 65 TY-2610A 80 TY-2624A 85 TY-364 80 TY-8061X 80 TY6001-6003 100 TY530-533 95 TY540-543 70 TY3960-3963 80 联想硒鼓 75 TY-1600硒鼓 190 TY-1800粉盒 90 TY-1800鼓架 180 TY-1900粉盒 95 TY-0112粉盒 190 TY-0225粉盒 220 TY-2312鼓架 240 TY-2020粉盒 240 TY-2020鼓架 180 TY-2822粉盒 180 TY-2822鼓架 140 TY-2435粉盒 140 TY-2922粉盒 180 TY-2922鼓架 175 85 280 170 150 200 160 160 130 130 240 95 95 95 190 90 160 90 160 110 95 160 兄弟硒鼓 TY-2050粉盒 TY-2050鼓架 TY-2115粉盒 TY-2125粉盒 TY-2150鼓架 TY-2880粉盒 TY-3135粉盒 TY-3175粉盒 TY-3150鼓架 TY-4150粉盒 TY-4150鼓架 TY-8050鼓架施乐硒鼓 TY-3110 TY-3115 TY-3116 TY-3117 TY-3119 TY-P8E TY-PE220 TY-203 TY-204 90 160 90 90 160 40 95 100 245 130 245 260 100 100 100 100 100 130 100 130 130 佳能硒鼓 TY-E-16 TY-EP-22 TY一EP25 TY-EP-26 TY-EP-62 TY-FX-3 TY-FX-9 TY-912 TY-303 TY-U鼓 TY-W鼓 TY-307BK TY-307C/M/Y TY-308 TY-309 爱普生硒鼓 TY-5700粉盒 TY-5900硒鼓 TY-6200粉盒 TY-6200鼓架 TY-2180 TY-2020 130 85 80 105 200 80 80 80 80 100 90 160 170 100 220 130 190 135 195 三星硒鼓 TY-1210 100 TY-1610 100 TY-1710 100 TY-2010 105 TY-4100 100 TY-4200 100 TY-4216 105 TY-4521 100 TY-4500 105 TY-4725 110 TY-5100 105 TY-550 105 TY-560R 110 TY-5800 160 TY-2250 150 TY-CLP300黑 70 TY-CLP300彩 70 TY-2150 160 TY-1666 140 TY-108S 130 TY-109S原芯片 140 TY-209S 195 109s带盘 120 松下硒鼓 TY-76A粉盒 TY-78A鼓架 TY-83E粉盒 TY-84E鼓架 TY-90E粉盒 TY-91E鼓架 TY-94E粉盒 TY-95E鼓架利盟硒鼓 TY-E210 TY-E230 TY-X215 其它型号

嘉实多 Hysol EM 400 高性能油相多功能水溶金属液产品说明说明书

产品技术说明书Hysol™ EM 400高性能油相多功能水溶金属液产品说明嘉实多Hysol™ EM 400 是嘉实多新型两相金属加工液的油相包。

嘉实多两相金属加工液具有高效的先进的金属加工性能，有效管理液体系统最大化油槽寿命。

Hysol EM 400是植物油相添加先进的润滑组件从而确保延长刀具寿命以及零件质量。

配合使用Boost WP系列，含液体的水相管理零件，可以保持生物和pH稳定性，以及最佳的防锈性能。

嘉实多两相金属加工液可根据不同的加工配置各种不同的浓度。

此外，添加被损耗的部分可获得更低的添加液成本。

应用场合两相植物油基适用于钢铁及铝合金加工。

该产品仅限于与水相Boost WP结合使用。

铸铁中低合金钢高合金-不锈钢铝合金镁合金有色研磨铣削、车削(一般加工)钻孔铰孔、攻丝拉削产品优点不含氯,苯酚和亚硝酸盐，符合当地法律规定，废品处理要求及环境要求。

改善环境符合循环使用，植物油技术先进的润滑化合物保证改善机床寿命及工件质量多功能液体，应用于多金属的多用途在建议的水硬度条件下优异的稳定性优异的起泡控制典型数据项目测试方法单位Value 浓缩液外观目测琥珀色矿物油含量计算Wt%0乳化液(4% Hysol EM 400 + 2% Boost WP Series)外观目测乳白色pH 值DIN 51369ASTM E70-799.3推荐使用浓度磨削1-3% Hysol EM 400+ 1.5-2.0% Boost WP 钻孔加工4-8% Hysol EM 400+ 1.5-2.0% Boost WP 钻孔推荐水硬度100-300 ppm CaCO3Hysol™ EM 40017 Sep 2015Castrol, the Castrol logo and related marks are trademarks of Castrol Limited, used under licence.本《产品技术说明书》及其包含的信息在印刷之日是准确的，但对其准确性或完整性，我们不做保证与陈述（无论明示还是暗示）。

分散型高硅氧玻璃纤维纱用浸润剂

分散型高硅氧玻璃纤维纱用浸润剂下载提示：该文档是本店铺精心编制而成的，希望大家下载后，能够帮助大家解决实际问题。

文档下载后可定制修改，请根据实际需要进行调整和使用，谢谢！本店铺为大家提供各种类型的实用资料，如教育随笔、日记赏析、句子摘抄、古诗大全、经典美文、话题作文、工作总结、词语解析、文案摘录、其他资料等等，想了解不同资料格式和写法，敬请关注！Download tips: This document is carefully compiled by this editor. I hope that after you download it, it can help you solve practical problems. The document can be customized and modified after downloading, please adjust and use it according to actual needs, thank you! In addition, this shop provides you with various types of practical materials, such as educational essays, diary appreciation, sentence excerpts, ancient poems, classic articles, topic composition, work summary, word parsing, copy excerpts, other materials and so on, want to know different data formats and writing methods, please pay attention!分散型高硅氧玻璃纤维纱用浸润剂1. 引言在现代复合材料制造中，高硅氧玻璃纤维纱因其优异的性能广泛应用于航空航天、汽车工业及建筑领域。

UF3808.zh.MSDS_UT_CN

有害物成分炭黑呼吸系统防护：眼睛防护：身体防护：手防护：其他防护 : 推荐使用个人防护设备的象形图：
第八部分接触控制/个体防护
国家标准 GACGIH 3 mg/m3 TWA
NIOSH
OSHA 无
通风不足时佩戴适当的呼吸面具。适当的呼吸系统防护措施：
LD50
597 mg/kg
经口
LD50
> 10,000
LD50
mg/kg
> 46,400
mg/kg
经口经皮
LD50
> 5,000 mg/kg 经口
LD50
4,4'-
LD50
异亚丙基二苯酚、表氯 LD50
醇的聚合物（分子量<=7
00）
25068-38-6
炭黑
LD50
1333-86-4
> 6,000 mg/kg
在正常贮存和使用条件下稳定。防止受热。与醇类和胺类发生反应。与氧化剂，酸和碱液发生反应。高温或有禁忌物存在时可能发生聚合。刺激性有机蒸气。碳氧化物。氮氧化物。正常操作条件下不会发生。
第十一部分毒理学资料
毒理信息：无实验室动物测试数据。
经口毒性：急性毒性估计值 : > 5,000 mg/kg 测试方法: 计算方法
皮肤接触：
眼睛接触：吸入：食入：
有害燃烧产物: 灭火剂: 灭火注意事项:
第四部分急救措施
用流动的水和肥皂清洗。涂润手霜。更换所有污染的衣服。必要时，看皮肤科医生。
立即用大量的水清洗并持续几分钟，同时保持眼睑撑开。咨询医生。
移至新鲜空气处，如症状持续寻求医生帮助。
漱口，给饮1~2杯水。禁止催吐。寻求医生帮助。

underfill胶水资料

UNDERFILL底部填充胶之基本简介篇2013-11-18 21:0UNDERFILL，中文名有很多：底部填充胶、底填胶、下填料、底部填充剂、底填剂、底填料、底充胶等等。

其实从这个英文词来是Under和Fill两个词的组合，原本应该是一个动词，这是应用在这个领域逐步演变成了一个名词。

其实用了几个在线的工具，翻译出来的结果都略有差异：最原始的翻译是Underfill [‘ʌndəfil] n. 未充满；填充不足。

而上述的中文名基本上只能在网络释义或专业释义里查的，分别称为底部填充剂（谷歌翻译）、底部填充胶（金山词霸）及底部填充（百度翻译及有道翻译）。

所以基本上称为底部填充剂（胶）应该是最贴近在电子行业实际应用中的名称。

记得2005年底06年初的时候，拿到的是韩国元化学的技术资料，韩文以及英文对照的，而英文里面对此也没做太多的解释。

当时由于需要制作中文版的资料，所以最后参考了乐泰的技术资料最后形成了中文的版本。

底填胶里面最经典的型号之一乐泰的3513对此产品的英文版本描述如下：“3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.”最后我这边成文的中文版描述如下：（为避免广告之嫌疑略去了品牌及型号）“×××是一种单组分环氧密封剂，用于CSP或BGA 底部填充制程。

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Hysol UF3800
填料：环氧树脂
颜色：黑色液体
黏度：375 MPa
比重：1.13
工作时间：25℃ 3天
保存条件：-20℃ 9个月
固化条件：130℃固化，不低于8分钟
包装：50ML/支
应用： CSP/BGA的可维修底部填充胶，专为手持通讯及娱乐设备应用而设计
Hysol UF3800可室温快速流动，低温快速固化，从而降低能源损耗，减少加热装置等固定成本的投入，提高生产速度。

Hysol UF3800与多种无铅以及无卤型焊锡膏兼容，适合各种工艺要求并具有出色的可靠性能。

在可维修的同时，Hysol UF3800还具有相对较高的Tg 温度，是市场上唯一一款同时具备室温快速流动，低温快速固化，高Tg点，可维修，以及出色的热、电性能的底部填充胶。

”其实作为电子胶水的领先公司汉高乐泰是在不断推出一些新的产品来适合电子封装和组装行业的快速发展的，此款产品的基本TDS参数如下：
TYPICAL PROPERTIES OF UNCURED MATERIAL：
Viscosity @ 25°C, MPa Physica MCR100, Spindle CP50-1, 1000S-1 375
Specific Gravity 1.13
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, months 6
TYPICAL CURING PERFORMANCE Cure Schedule ≥8 minutes @ 130°C。