Infineon HC-49 UP SMD Crystal 产品说明书
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Mode of Operation AT-Cut Fundamental
Packaging Options Tape & Reel
Nominal Frequency 25.000MHz
Load Capacitance 18pF
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Time Maintained Above: - Temperature (TL) - Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Moisture Sensitivity Level
Level 1
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 4 of 5
E1SFA18-25.000M TR
Recommended Solder Reflow Methods
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
3°C/second Maximum
150°C 175°C 200°C 60 - 180 Seconds 3°C/second Maximum
E1SFA18-25.000M TR
Pb RoHS
E1S F A 18 -25.000M TR
Series RoHS Compliant (Pb-free) Resistance Welded Short HC-49/UP SMD Crystal
Frequency Tolerance/Stability ±30ppm at 25°C, ±50ppm over -40°C to +85°C
Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above: - Temperature (TL) - Time (tL)
TP TL TS Max TS Min
Ramp-up
Critical Zone TL to T P
Ramp-down
Temperature (T)
t SPreheat
tL
t 25°C to Peak
tP
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20 MAX
LINE MARKING
1 E25.000M E=Ecliptek Designator M=MHz
13.30 MAX 4.88 ±0.20
4.85 MAX 0.50 MIN (x2)
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010
Vibration
MIL-STD-883, Method 2007 Condition A
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 5 of 5
7pF Maximum
Equivalent Series Resistance
40 Ohms Maximum
Mode of Operation
AT-Cut Fundamental
Drive Level
1mWatt Maximum
Storage Temperature Range
-40°C to +125°C
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
MIL-STD-883, Method 1014 Condition C
Lead Termination
Sn 2µm - 6µm
Mechanical Shock
MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat
MIL-STD-202, Method 210
25.000MHz
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Aging at 25°C
±5ppm/year Maximum
Load Capacitance
18pF
Shunt Capacitance (C0)
11.60 MAX
0.80 ±0.30 (x2) NOTE: Coplanarity 0.360 MAX
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 1 of 5
E1SFA18-25.000M TR
12.0 ±0.2 1.5 MIN
B0*
K0*
DIA 40 MIN Access Hole at Slot Location
30.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN DIA 13.0 ±0.2
2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start
TS MAX to TL (Ramp-up Rate)
Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN)
Ramp-up Rate (TL to TP)
E1SFA18-25.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units 4.0 ±0.2 2.0 ±0.1
11.5 ±0.1 24.0 ±0.3
10.75 ±0.10
DIA 1.5 ±0.1
0.4 ±0.1
A0*
*Compliant to EIA 481A
24.4 +2.0/-0.0
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 3 of 5
E1SFA18-25.000M TR
Recommended Solder Reflow Methods
Suggested Solder Pad Layout
All Dimensions in Millimeters
5.5 (X2)
2.0 (X2)
4.0
Solder Land
(X2)
All Tolerances are ±0.1
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 2 of 5
217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 seconds 6°C/second Maximum
Time 25°C to Peak Temperature (t)
8 minutes Maximum
5°C/second Maximum
N/A 150°C N/A 30 - 60 Seconds 5°C/second Maximum
150°C 200 Seconds Maximum 245°C Maximum 245°C Maximum 2 Times / 230°C Maximum 1 Time 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5°C/second Maximum
TP TL TS Max TS Min
Ramp-up
Critical Zone TL to T P
Ramp-down
Temperature (T)
t SPreheat
tL
t 25°C to Peak
tP
Time (t)
Low Temperature Infrared/Convection 245°C
Insulation Resistance
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ethod 1014 Condition A
Gross Leak Test
Packaging Options Tape & Reel
Nominal Frequency 25.000MHz
Load Capacitance 18pF
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Time Maintained Above: - Temperature (TL) - Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Moisture Sensitivity Level
Level 1
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 4 of 5
E1SFA18-25.000M TR
Recommended Solder Reflow Methods
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
3°C/second Maximum
150°C 175°C 200°C 60 - 180 Seconds 3°C/second Maximum
E1SFA18-25.000M TR
Pb RoHS
E1S F A 18 -25.000M TR
Series RoHS Compliant (Pb-free) Resistance Welded Short HC-49/UP SMD Crystal
Frequency Tolerance/Stability ±30ppm at 25°C, ±50ppm over -40°C to +85°C
Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above: - Temperature (TL) - Time (tL)
TP TL TS Max TS Min
Ramp-up
Critical Zone TL to T P
Ramp-down
Temperature (T)
t SPreheat
tL
t 25°C to Peak
tP
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20 MAX
LINE MARKING
1 E25.000M E=Ecliptek Designator M=MHz
13.30 MAX 4.88 ±0.20
4.85 MAX 0.50 MIN (x2)
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010
Vibration
MIL-STD-883, Method 2007 Condition A
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 5 of 5
7pF Maximum
Equivalent Series Resistance
40 Ohms Maximum
Mode of Operation
AT-Cut Fundamental
Drive Level
1mWatt Maximum
Storage Temperature Range
-40°C to +125°C
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
MIL-STD-883, Method 1014 Condition C
Lead Termination
Sn 2µm - 6µm
Mechanical Shock
MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat
MIL-STD-202, Method 210
25.000MHz
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Aging at 25°C
±5ppm/year Maximum
Load Capacitance
18pF
Shunt Capacitance (C0)
11.60 MAX
0.80 ±0.30 (x2) NOTE: Coplanarity 0.360 MAX
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 1 of 5
E1SFA18-25.000M TR
12.0 ±0.2 1.5 MIN
B0*
K0*
DIA 40 MIN Access Hole at Slot Location
30.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN DIA 13.0 ±0.2
2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start
TS MAX to TL (Ramp-up Rate)
Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN)
Ramp-up Rate (TL to TP)
E1SFA18-25.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units 4.0 ±0.2 2.0 ±0.1
11.5 ±0.1 24.0 ±0.3
10.75 ±0.10
DIA 1.5 ±0.1
0.4 ±0.1
A0*
*Compliant to EIA 481A
24.4 +2.0/-0.0
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 3 of 5
E1SFA18-25.000M TR
Recommended Solder Reflow Methods
Suggested Solder Pad Layout
All Dimensions in Millimeters
5.5 (X2)
2.0 (X2)
4.0
Solder Land
(X2)
All Tolerances are ±0.1
| Specification Subject to Change Without Notice | Rev F 8/28/2009 | Page 2 of 5
217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 seconds 6°C/second Maximum
Time 25°C to Peak Temperature (t)
8 minutes Maximum
5°C/second Maximum
N/A 150°C N/A 30 - 60 Seconds 5°C/second Maximum
150°C 200 Seconds Maximum 245°C Maximum 245°C Maximum 2 Times / 230°C Maximum 1 Time 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5°C/second Maximum
TP TL TS Max TS Min
Ramp-up
Critical Zone TL to T P
Ramp-down
Temperature (T)
t SPreheat
tL
t 25°C to Peak
tP
Time (t)
Low Temperature Infrared/Convection 245°C
Insulation Resistance
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ethod 1014 Condition A
Gross Leak Test