ZVN4306GTA;ZVN4306GTC;中文规格书,Datasheet资料
ZVN4306AV;ZVN4306AVSTOA;ZVN4306AVSTOB;ZVN4306AVSTZ;中文规格书,Datasheet资料
nA µA µA A Ω Ω
I D(on)
R DS(on)
0.22 0.32
0.33 0.45
V GS =10V,I D =3A V GS =5V, I D =1.5A
g fs
700
mS
V DS =25V,I D =3A
C iss
350 140
pF pF V DS =25 V, V GS =0V, f=1MHz
Maximum Repetitive Avalanche Energy v Junction Temperature.
Maximum Repetitive Avalanche Current v Junction Temperature
Zetex plc. Fields New Road, Chadderton, Oldham, OL9-8NP, United Kingdom. Telephone: (44)161-627 5105 (Sales), (44)161-627 4963 (General Enquiries) Fax: (44)161-627 5467 Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 Zetex Inc. 47 Mall Drive, Unit 4 Commack NY 11725 USA Telephone: (516) 543-7100 Fax: (516) 864-7630 Zetex (Asia) Ltd. 3510 Metroplaza, Tower 2 Hing Fong Road, Kwai Fong, Hong Kong Telephone:(852) 26100 611 Fax: (852) 24250 494 These are supported by agents and distributors in major countries world-wide ©Zetex plc 1997 Internet: http://www.Leabharlann
NCV8450STT3G;中文规格书,Datasheet资料
NCV8450, NCV8450ASelf-Protected High Side Driver with Temperatureand Current LimitThe NCV8450/A is a fully protected High−Side Smart Discrete device with a typical R DS(on) of 1.0 W and an internal current limit of 0.8 A typical. The device can switch a wide variety of resistive, inductive, and capacitive loads.Features•Short Circuit Protection•Thermal Shutdown with Automatic Restart •Overvoltage Protection•Integrated Clamp for Inductive Switching•Loss of Ground Protection•ESD Protection•Slew Rate Control for Low EMI•Very Low Standby Current•NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable•This is a Pb−Free DeviceTypical Applications•Automotive•IndustrialPRODUCT SUMMARYSymbolCharacteristics Value Unit V IN_CL Overvoltage Protection54V V D(on)Operation Voltage 4.5 − 45V R on On−State Resistance 1.0WMARKINGDIAGRAM1AYWXXXXX GGXXXXX= V8450 or 8450AA= Assembly LocationY= YearW= Work WeekG= Pb−Free Package(Note: Microdot may be in either location)SOT−223(TO−261)CASE 318ESee detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.ORDERING INFORMATIONFigure 1. Block Diagram V (Pins 2, 4)OUT(Pin 3)IN(Pin 1)PACKAGE PIN DESCRIPTIONPin #Symbol Description1IN Control Input, Active Low2V D Supply Voltage3OUT Output4V D Supply VoltageMAXIMUM RATINGSRatingSymbol ValueUnit Min Max DC Supply Voltage (Note 1)V D −1645V Load Dump Protection(RI = 2 W , t d = 400 ms, V IN = 0, 10 V, I L = 150 mA, V bb = 13.5 V)V Loaddump100V Input CurrentIin −1515mAOutput Current (Note 1)I out Internally Limited A Total Power Dissipation@ T A = 25°C (Note 2)@ T A = 25°C (Note 3)P D1.131.60WElectrostatic Discharge (Note 4)(Human Body Model (HBM) 100 pF/1500 W )Input All other15kVSingle Pulse Inductive Load Switching Energy (Note 4)(V DD = 13.5 V, I = 465 mApk, L = 200 mH, T JStart = 150°C)E AS 29mJ Operating Junction Temperature T J −40+150°C Storage TemperatureT storage−55+150°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.Reverse Output current has to be limited by the load to stay within absolute maximum ratings and thermal performance.2.Minimum Pad.3. 1 in square pad size, FR −4, 1 oz Cu.4.Not subjected to production testing.THERMAL RESISTANCE RATINGSParameterSymbol Max Value Unit Thermal Resistance (Note 5)Junction −to −Ambient (Note 2)Junction −to −Ambient (Note 3)R q JA R q JA11078.3K/W5.Not subjected to production testing.Figure 2. Applications Test CircuitELECTRICAL CHARACTERISTICS (6 v V D v 45 V; −40°C <T J < 150°C unless otherwise specified)Rating Symbol ConditionsValueUnit Min Typ MaxOUTPUT CHARACTERISTICSOperating Supply Voltage V SUPPLY 4.5−45VOn Resistance(Pin 1 Connected to GND)R ON T J = 25°C , I OUT = 150 mA, V D = 7 V − 45 VT J = 150°C, I OUT = 150 mA, V D = 7 V − 45 V(Note 6)T J = 25°C , I OUT= 150 mA, V D = 6 V1.01.41.1232.1WStandby Current (Pin 1 Open)I D V D v 20 VV D> 20 V 0.610100m AINPUT CHARACTERISTICSInput Current – Off State I IN_OFF V OUT v 0.1 V, R L = 270 W, T J = 25°CV OUT v 0.1V, R L= 270 W, T J = 150°C (Note 6)−50−40m AInput Current – On State(Pin 1 Grounded)I IN_ON 1.53mA Input Resistance (Note 6)R IN1k W SWITCHING CHARACTERISTICSTurn−On Time (Note 7)(V IN = V D to 0 V) to 90% V OUT t ON R L = 270 W(Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C30125100m sTurn−Off Time (Note 7)(V IN= 0 V to V D) to 10% V OUT t OFF R L = 270 W (Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C60175150m sSlew Rate On (Note 7)(V IN = V D to 0V) 10% to 30% V OUT dV/dt ON R L = 270 W(Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C0.744V/m sSlew Rate Off (Note 7)(V IN= 0 V to V D) 70% to 40% V OUT dV/dt OFF R L = 270 W (Note 6)V D = 13.5 V, R L = 270 W, T J = 25°C0.944V/m sOUTPUT DIODE CHARACTERISTICS (Note 6)Drain−Source Diode Voltage V F I OUT = −0.2 A0.6V Continuous Reverse DrainCurrentI S T J = 25°C0.2A PROTECTION FUNCTIONS (Note 8)Temperature Shutdown (Note 6)T SD150175−°C Temperature ShutdownHysteresis (Note 6)T SD_HYST5°COutput Current Limit I LIM T J = −40°C, V D = 13.5 V, t m = 100 m s (Note 6)T J = 25 °C, V D = 13.5 V, t m = 100 m sT J = 150 °C , V D = 13.5 V, t m = 100 m s (Note 6)0.50.81.5AOutput Clamp Voltage(Inductive Load Switch Off)At V OUT = V D− V CLAMPV CLAMP I OUT = 4 mA4552VOvervoltage Protection V IN_CL I CLAMP = 4 mA5054V6.Not subjected to production testing7.Only valid with high input slew rates8.Protection functions are not designed for continuous repetitive operation and are considered outside normal operating rangeR D S (o n ) (W )TEMPERATURE (°C)Figure 3. R DS(on) vs. TemperatureR D S (o n ) (W )OUTPUT LOAD (A)Figure 4. R DS(on) vs. Output LoadV D (V)Figure 5. R DS(on) vs. V DR D S (o n ) (W )1020304050607080T U R N O N T I M E (m s )TEMPERATURE (°C)Figure 6. Turn On Time vs. TemperatureTEMPERATURE (°C)Figure 7. Turn Off Time vs. TemperatureT U R N O F F T I M E (m s )S L E W R A T E (O N ) (V /m s )TEMPERATURE (°C)Figure 8. Slew Rate (ON) vs. Temperature−40−20020406080100120140−40−20020406080100120140−TEMPERATURE (°C)Figure 9. Slew Rate (OFF) vs. Temperature S L E W R A T E (O F F ) (V /m s )TEMPERATURE (°C)Figure 10. Current Limit vs. TemperatureC U R R E N T L I M I T (A )P E A K S C C U R R E N T (A )V D , VOLTAGE (V)Figure 11. Peak Short Circuit Current vs. V DVoltageTEMPERATURE (°C)Figure 12. V D Leakage Current vs.Temperature Off −StateV D , L E A K A G E C U R R E N T (m A )V D , L E A K A G E C U R R E N T (m A )V D , VOLTAGE (V)Figure 13. V D Leakage Current vs. V D VoltageOff −State TEMPERATURE (°C)Figure 14. On −State Input Current vs.TemperatureI N P U T C U R R E N T (m A )V D , VOLTAGE (V)Figure 15. Output Voltage vs. V D VoltageO U T P U T V O L T A G E (V )V D , VOLTAGE (V)Figure 16. Input Current vs. V D VoltageOn −StateI N P U T C U R R E N T (m A )LOAD INDUCTANCE (mH)Figure 17. Single Pulse Maximum Switch −offCurrent vs. Load InductanceC U R R E N T (m A )V D , VOLTAGE (V)Figure 18. Input Current vs. V D VoltageOff −StateI N P U T C U R R E N T (m A )−S H U T D O W N T I M E (m s )TEMPERATURE (°C)Figure 19. Initial Short −Circuit Shutdown Timevs. TemperaturePULSE TIME (s)R (t ), E F F E C T I V E T R A N S I E N T T H E R M AL R E S P O N S ECOPPER HEAT SPREADER AREA (mm 2)R q J A (°C /W )06080100120140Figure 20. R q JA vs. Copper Area2040Figure 21. Transient Thermal ResponseISO PULSE TEST RESULTSTest PulseTest Level Test ResultsPulse Cycle Time and Generator Impedance1200 V C 500 ms, 10 W 2150 V C 500 ms, 10 W 3a 200 V C 100 ms, 50 W 3b 200 V C 100 ms, 50 W 5175 VE(100 V)400 ms, 2 WORDERING INFORMATIONDevicePackage Shipping †NCV8450STT3G SOT −223(Pb −Free)4000 / Tape & Reel NCV8450ASTT3GSOT −223(Pb −Free)4000 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSSOT −223 (TO −261)CASE 318E −04ISSUE MNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM A MIN NOM MAX MIN MILLIMETERS1.50 1.63 1.750.060INCHESA10.020.060.100.001b 0.600.750.890.024b1 2.90 3.06 3.200.115c 0.240.290.350.009D 6.30 6.50 6.700.249E 3.30 3.50 3.700.130e 2.20 2.30 2.400.0870.850.94 1.050.0330.0640.0680.0020.0040.0300.0350.1210.1260.0120.0140.2560.2630.1380.1450.0910.0940.0370.041NOM MAX L1 1.50 1.75 2.000.0606.707.007.300.2640.0690.0780.2760.287H E−−e10°10°0°10°q*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息: ONSEMINCV8450STT3G。
ZVN4306AV中文资料（Ze...
ZVN4306AV中文资料（Ze...n沟道增强模式垂直DMOS FET 发行3日 - 7月94特征* 60电压V* R= 0.33?*提供Spice模型应用* DC-DC转换器*螺线管/继电器驱动汽车ZVN4306A电子线TO92兼容绝对最大额定值.参数漏源电压连续漏极电流在T=25°C 实用连续漏电流在T=25°C漏电流脉冲栅源电压功耗在T=25°C在T实际功耗=25°C*工作和存储温度范围符号VIIIVPPT:T601.11.315±208501.13-55到+150单元VAAAVm WW°C*可以消散假设设备功率是安装在一个典型方式在P C B上用铜等于1英寸见方最小电气特性（在T amb= 25°C除非另有说明）.参数漏 - 源击穿电压门源阈值电压门体泄漏零栅极电压漏极电流导通状态漏C urrent(1)静态漏源导通电阻(1)前锋(1)(2)符号最小BVVIIIR120.220.327000.330.45601.3310010100TYP.M AX.单位条件. VVnAμAμAAm SI=1m A, V=0VID=1m A, V= VV=± 20V, V=0VV=60V, V=0V=48V, V=0V, T=125°C(2)V=10V, V=10VV=10V,I=3AV=5V, I=1.5AV=25V,I=3AgZVN4306A 电气特性（在T amb= 25°C除非另有说明）.参数共源输出电容(2)反向传输电容（2）导通延迟时间(2)(3)上升时间（2）（3）关断延迟时间(2)(3)下降时间（2）（3）符号最小C ossC rsst d(on)t rt d(off)t fTY P.M A X.350140308253016单元pFpFpFnsnsnsnsV DD 25V, V GEN=10V, I D=3AV DS=25 V, V GS=0V, f=1M Hz条件.输入电容（2）C iss（1）脉冲条件下进行测定.宽度= 300μ秒.占空比2%（2）抽样检测.（3）测定用50开关时间源阻抗和5ns上升时间脉冲发生器热特性参数热阻：结到环境结到外壳符号R th(j-amb)R th(j-case)M A X.15050单元°C/W°C/WM ax Pow er Dissipation - (Watts)T hermal Resistance (°C/W) AmttenbiempeturareT -T emperature(°C)Pulse Width (seconds)降额曲线最大瞬态热阻抗ZVN4306A典型特征R-Drain Source On Resistance(?)I- Drain Current (Amps)V- Drain SourceVoltage (Volts)I Drain Current (Amps)饱和特性导通电阻V 漏极电流Normalised Rand Vg-T ransconductance (S)T -Junction T emperature (°C)I- Drain Current (Amps)正常化?和VV 温度跨V 漏电流V-Gate Source Voltage (Volts)C-Capacitance (pF) V-Drain Source Voltage (Volts)Q-Charge (nC)电容V 漏源电压栅极电荷V 栅源电压。
HY4306B6 datasheet_v1.0
Pin1Pin7Pin1Pin2,3,5,6,7 Pin4Feature Description Pin Description●60V/290AR DS(ON)= 1.8m Ω(typ.)@V GS = 10V● 100% Avalanche Tested ● Reliable and Rugged●Lead Free and Green Devices Available (RoHS Compliant)Applications● Switch application ● Brushless Motor DriveOrdering and Marking InformationHY4306 YYXXXJWW G Note: HOOYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate Termi- Nation finish;which are fully compliant with RoHS. HOOYI lead-free products meet or exceed the lead-Free require- ments of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HOOYI defines “Green ” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).HOOYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to this pr -oduct and/or to this document at any time without notice.TO-263-6LN-Channel MOSFETAbsolute Maximum RatingsNote: * Repetitive rating；pulse width limited by max.junction temperature.** Surface mounted on FR-4 board.*** Limited by T J max , starting T J=25°C, L =0.5mH, R G= 25Ω, V GS =10V. Electrical Characteristics(Tc =25°C Unless Otherwise Noted)Electrical Characteristics (Cont.) (Tc =25°C Unless Otherwise Noted)Note: *Pulse test，pulse width ≤ 300us，duty cycle ≤ 2%Typical Operating CharacteristicsFigure 1: Power Dissipation Figure 2: Drain CurrentTc-Case Temperature(℃) Tc-Case Temperature(℃)Figure 3: Safe Operation Area Figure 4: Thermal Transient ImpedanceV DS -Drain-Source Voltage(V)Maximum Effective Transient ThermalImpedance, Junction-to-CaseFigure 5: Output Characteristics Figure 6: Drain-Source On ResistanceV DS -Drain-Source Voltage (V) I D -Drain Current(A)I D -D r a i n C u r r e n t (A )I D -D r a i n C u r r e n t (A )R D S (O N )-O N -R e s i s t a n c e (Ω)Typical Operating Characteristics(Cont.)Figure 7: On-Resistance vs. Temperature Figure 8: Source-Drain Diode ForwardTj-Junction Temperature (℃)V SD -Source-Drain Voltage(V)Figure 9: Capacitance Characteristics Figure 10: Gate Charge CharacteristicsV DS -Drain-Source Voltage (V) Q G -Gate Charge (nC )C -C a p a c i t a n c e (p F )N o r m a l i z e d O n -R e s i s t a n c eI S -S o u r c e C u r r e n t (A )Avalanche Test Circuit and WaveformsSwitching Time Test Circuit and WaveformsGate Charge Test Circuit and WaveformsDevice Per UnitPackage Information TO-263-6LClassification ProfileClassification Reflow ProfilesCustomer ServiceWorldwide Sales and Service: sales@Technical Support: technical @Xi’an Hooyi Semiconductor Technology Co., Ltd.No.105,5th Fengcheng Road, Economic and Technological Development Zone, Xi'an,China TEL: (86-029) 86685706FAX: (86-029) 86685705E-mail: sales@Web net: 。
PT4316资料
C3 C4
C2
3
RFIN
Frequency (MHz) 315 433.92
LNA Input Impedance (Pin 3) Normalized to 50Ω 4.18—j251.63 3.60—j180.20
The LNA output of PT4316 internally connects to the mixer stage so that its output impedance cannot be measured directly. The LNA output requires a DC supply through a choke inductor. For obtaining better LNA gain, a capacitor is recommended to be added in parallel with this inductor to implement a resonant tank at the desired frequency as shown in the following figure. Note that the LNA might self-oscillate and degrade the receiver sensitivity, particularly if a large inductor value is chosen. An alternate matching method is to replace the parallel capacitor with a 330 to 1KΩ resistor, which would reduce the resonant tank Q (quality factor) and avoid the self-oscillation.
ncp4306工作原理
ncp4306工作原理
NCP4306是一种电力管理芯片，广泛应用于移动设备和无线通信设备中。
它的工作原理是通过管理电源供应和电池充放电来保证设备的正常运行。
NCP4306通过连接到电源适配器或USB接口来获取输入电源。
它能够检测输入电压的变化，并根据需要调整电源输出的电压和电流。
这样，它能够为设备提供稳定的电源，以确保设备正常工作。
NCP4306还负责管理电池的充电和放电过程。
当设备连接到充电器时，它会监测电池的电量，并根据需要调整充电电流和电压，以确保电池能够快速、安全地充满。
当设备处于使用状态时，NCP4306会监测电池的电量，并根据需要调整设备的功耗，以延长电池的使用时间。
NCP4306还具有过电流保护和过温保护功能。
当设备的电流超过设定值或温度超过允许范围时，它会自动切断电源输出，以保护设备和电池的安全。
总的来说，NCP4306通过管理电源供应和电池充放电来确保设备的正常运行。
它能够提供稳定的电源，延长电池的使用时间，并保护设备和电池的安全。
作为一种重要的电力管理芯片，NCP4306在移动设备和无线通信设备中发挥着重要的作用。
通过它的工作，我们的移动设备能够持久地为我们提供便利和快乐。
LTC4306中文资料
V CC = 3.3VVCARD1 = 3.3VVCARD4 = 5VVBACK = 2.5V SCL42V/DIVSCL12V/DIVSCLIN 2V/DIV(Note 1)Supply Voltage (V CC )...................................–0.3V to 7V Input Voltages (ADR0, ADR1, ADR2,ENABLE, ALERT1, ALERT2, ALERT3,ALERT4)..................................................–0.3V to 7V Output Voltages (ALERT, READY)...............–0.3V to 7V Input/Output Voltages (SDAIN, SCLIN,SCL1, SDA1, SCL2, SDA2, SCL3,SDA3, SCL4, SDA4, GPIO1, GPIO2)........–0.3V to 7VOperating Temperature RangeLTC4306C ...............................................0°C to 70°C LTC4306I.............................................–40°C to 85°C Storage Temperature RangeSSOP.................................................–65°C to 150°C QFN ...................................................–65°C to 125°C Lead Temperature (Soldering, 10 sec)SSOP................................................................300°CConsult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.ABSOLUTE AXI U RATI GSW W WU The ● denotes specifications which apply over the full specified temperaturerange, otherwise specifications are at T A = 25°C. V CC = 3.3V unless otherwise noted.ELECTRICAL CHARACTERISTICSThe ● denotes specifications which apply over the full specified temperature range, otherwise specifications are at T A = 25°C. V CC = 3.3V unless otherwise noted.Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.Note 2: Guaranteed by design and not subject to test.Note 3: The boosted pull-up currents are regulated to prevent excessively fast edges for light loads. See the Typical Performance Characteristics for rise time as a function of V CC and parasitic bus capacitance C BUS and for I BOOST as a function of V CC and temperature.Note 4: When a logic low voltage, V LOW, is forced on one side of the Upstream-Downstream Buffers, the voltage on the other side is regulated to a voltage V LOW2 = V LOW + V OS, where V OS is a positive offset voltage. V OS,UP-BUF is the offset voltage when the LTC4306 is driving the upstream pin (e.g., SDAIN) and V OS,DOWN-BUF is the offset voltage when theLTC4306 is driving the downstream pin (e.g., SDA1). See the Typical Performance Characteristics for V OS,UP-BUF and V OS,DOWN-BUF as a function of V CC and bus pull-up current.Note 5: When floating, the ADR0-ADR2 pins can tolerate pin leakage currents up to I ADR(FLOAT) and still convert the address correctly.ELECTRICAL CHARACTERISTICSUUUPI FU CTIO S (GN24 Package/UFD24 Package)ALERT (Pin 3/Pin 1): Fault Alert Output. An open-drain output that is pulled low when a fault occurs to alert the host controller. The LTC4306 pulls ALERT low when any of the ALERT1-ALERT4 pins is low, when the 2-wire bus is stuck low, or when the Connection Requirement bit of Register 2 is low and a master tries to connect to a downstream channel that is low. See Operation section for the details of how ALERT is set and cleared. The LTC4306 is compatible with the SMBus Alert Response Address protocol. Connect a 10k resistor to a power supply voltage to provide the pull-up. Tie to ground if unused. SDAIN (Pin 4/Pin 2): Serial Bus Data Input and Output. Connect this pin to the SDA line on the master side. An external pull-up resistor or current source is required. GND (Pin 5/Pin 3): Device Ground.SCLIN (Pin 6/Pin 4): Serial Bus Clock Input. Connect this pin to the SCL line on the master side. An external pull-up resistor or current source is required.ENABLE (Pin 7/Pin 5): Digital Interface Enable and Regis-ter Reset. Driving ENABLE high enables I2C communica-tion to the LTC4306. Driving this pin low disables I2C communication to the LTC4306 and resets the registers to their default state as shown in the Operation section. When ENABLE returns high, masters can read and write the LTC4306 again. If unused, tie ENABLE to V CC.V CC (Pin 8/Pin 6): Power Supply Voltage. Connect a bypass capacitor of at least 0.01µF directly between V CC and GND for best results.GPIO1-GPIO2 (Pins 10, 11/Pins 8, 9): General Purpose Input/Output. These two pins can be used as logic inputs, open-drain outputs or push-pull outputs. The N-channel MOSFET pull-down devices are capable of driving LEDs. When used in input or open-drain output mode, the GPIOs can be pulled up to a supply voltage ranging from 1.5V to 5.5V independent of the V CC voltage. GPIOs default to a high impedance open-drain output mode. There are GPIO configuration and status bits in Register 1 and Register 2. Float if unused.ADR0-ADR2 (Pins 12, 13, 14/Pins 10, 11, 12): Three-State Serial Bus Address Inputs. Each pin may be floated, tied to ground or tied to V CC. There are therefore 27 possible addresses. See Table 1 in applications informa-tion. When the pins are floated, they can tolerate ±5µA of leakage current and still convert the address correctly. READY (Pin 15/Pin 13): Connection Ready Digital Output. An N-channel MOSFET open-drain output transistor that pulls down when none of the downstream channels is connected to the upstream bus and turns off when one or more downstream channels is connected to the upstream bus. Connect a 10k resistor to a power supply voltage to provide the pull-up. Tie to ground if unused.SCL1-SCL4 (Pins 18, 23, 1, 17/Pins 16, 21, 23, 15): Serial Bus Clock Outputs Channels 1-4. Connect pins SCL1-SCL4 to the SCL lines on the downstream channels 1-4, respectively. It is acceptable to float any pin that will never be connected to the upstream bus. Other-wise, an external pull-up resistor or current source is required on each pin.SDA1-SDA4 (Pins 19, 22, 2, 16/Pins 17, 20, 24, 14): Serial Bus Data Output Channels 1-4. Connect pins SDA1-SDA4 to the SDA lines on downstream channels 1-4, respectively. It is acceptable to float any pin that will never be connected to the upstream bus. Otherwise, an external pull-up resistor or current source is required on each pin.ALERT1-ALERT4 (Pins 20, 24, 21, 9/Pins 18, 22, 19, 7): Fault Alert Inputs, Channels 1-4. Devices on each of the four output channels can pull their respective pin low to indicate that a fault has occurred. The LTC4306 then pulls the ALERT low to pass the fault indication on to the host. See Operation section below for the details of how ALE RT is set and cleared. Connect unused fault alert inputs to V CC.Exposed Pad (Pin 25, UFD Package Only): Power Ground. Exposed Pad may be left open or connected to device ground.Control Register Bit Definitions OPERATIORegister 0 (00h)BIT NAME TYPE*DESCRIPTIONd7Downstream R Indicates if upstream bus is connected Connected to any downstream buses0 = upstream bus disconnected fromall downstream buses1 = upstream bus connected to one ormore downstream busesd6ALERT1 Logic State R Logic state of ALERT1 pin, noninverting d5ALERT2 Logic State R Logic state of ALERT2 pin, noninverting d4ALERT3 Logic State R Logic state of ALERT3 pin, noninverting d3ALERT4 Logic State R Logic state of ALERT4 pin, noninverting d2Failed Connection R Indicates if an attempt to connect to a Attempt downstream bus failed because the“Connection Requirement” bit inRegister 2 was low and thedownstream bus was low0 = Failed connection attempt occurred1 = No failed attempts at connectionoccurredd1Latched Timeout R Latched bit indicating if a timeout hasoccurred and has not yet been cleared.0 = no latched timeout1 = latched timeoutd0Timeout Real Time R Indicates real-time status of Stuck LowTimeout Circuitry0 = no timeout is occurring1 = timeout is occurringNote: Masters write to Register 0 to reset the fault circuitry after a fault has occurred and been resolved. Because Register 0 is Read-Only, no other functionality is affected.* For Type, “R/W” = Read Write, “R” = Read Only Register 1 (01h)BIT NAME TYPE*DESCRIPTIONd7Upstream R/W Activates upstream rise time Accelerators accelerator currentsEnable0 = upstream rise time acceleratorcurrents inactive (default)1 = upstream rise time acceleratorcurrents actived6Downstream R/W Activates downstream rise time Accelerators accelerator currentsEnable0 = downstream rise time acceleratorcurrents inactive (default)1 = downstream rise time acceleratorcurrents actived5GPIO1 Output R/W GPIO1 output driver state,Driver State noninverting, default = 1d4GPIO2 Output R/W GPIO2 output driver state,Driver State noninverting, default = 1d3-d2Reserved R Not Usedd1GPIO1 Logic R Logic state of GPIO1 pin,State noninvertingd0GPIO2 Logic R Logic state of GPIO2 pin,State noninverting* For Type, “R/W” = Read Write, “R” = Read OnlyRegister 2 (02h)BIT NAME TYPE*DESCRIPTIONd7GPIO1 ModeR/W Configures Input/Output mode ofConfigureGPIO10 = output mode (default)1 = input mode d6GPIO2 ModeR/W Configures Input/Output Mode ofConfigureGPIO20 = output mode (default)1 = input mode d5ConnectionR/W Sets logic requirements forRequirementdownstream buses to be connected to upstream bus0 = Bus Logic State bits (see register 3) of buses to be connected must be high for connection to occur (default)1 = Connect regardless of downstream logic state d4GPIO1 OutputR/W Configures GPIO1 Output ModeMode Configure 0 = open-drain pull-down (default)1 = push-pull d3GPIO2 OutputR/W Configures GPIO2 Output ModeMode Configure 0 = open-drain pull-down (default)1 = push-pull d2Mass Write EnableR/W Enable Mass Write Address usingaddress (1011 101)b 0 = Disable Mass Write1 = Enable Mass Write (default)d1Timeout Mode Bit 1R/W Stuck Low Timeout Set Bit 1**d0Timeout Mode Bit 0R/W Stuck Low Timeout Set Bit 0*** For Type, “R/W” = Read Write, “R” = Read Only **Stuck bus program tableTIMSET1TIMSET0TIMEOUT MODE 00Timeout Disabled (Default)01Timeout After 30ms 10Timeout After 15ms 11Timeout After 7.5msOPERATIORegister 3 (03h)BIT NAME TYPE*DESCRIPTIONd7Bus 1 FET StateR/W Sets and indicates state of FETswitches connected to downstream bus 10 = switch open (default)1 = switch closed d6Bus 2 FET StateR/W Sets and indicates state of FETswitches connected to downstream bus 20 = switch open (default)1 = switch closed d5Bus 3 FET StateR/W Sets and indicates state of FETswitches connected to downstream bus 30 = switch open (default)1 = switch closed d4Bus 4 FET StateR/W Sets and indicates state of FETswitches connected to downstream bus 40 = switch open (default)1 = switch closed d3Bus 1 Logic StateRIndicates logic state of downstream bus 1; only valid when disconnected from upstream bus †0 = SDA1, SCL1 or both are below 1V 1 = SDA1 and SCL1 are both above 1Vd2Bus 2 Logic StateRIndicates logic state of downstream bus 2; only valid when disconnected from upstream bus †0 = SDA2, SCL2 or both are below 1V 1 = SDA2 and SCL2 are both above 1Vd1Bus 3 Logic State RIndicates logic state of downstream bus 3; only valid when disconnected from upstream bus †0 = SDA3, SCL3 or both are below 1V 1 = SDA3 and SCL3 are both above 1Vd0Bus 4 Logic State RIndicates logic state of downstream bus 4; only valid when disconnected from upstream bus †0 = SDA4, SCL4 or both are below 1V 1 = SDA4 and SCL4 are both above 1V* For Type, “R/W” = Read Write, “R” = Read Only† These bits give the logic state of disconnected downstream buses to the master, so that the master can choose not to connect to a low downstream bus. A given bit is a “don’t care” if its associated downstream bus is already connected to the upstream bus.The LTC4306 is a 4-channel, 2-wire bus multiplexer/ switch with bus buffers to provide capacitive isolation between the upstream bus and downstream buses. Mas-ters on the upstream 2-wire bus (SDAIN and SCLIN) can command the LTC4306 to any combination of the 4 downstream buses. Masters can also program the LTC4306 to disconnect the upstream bus from the downstream buses if the bus is stuck low.Undervoltage Lockout (UVLO) and ENABLE FunctionalityThe LTC4306 contains undervoltage lockout circuitry that maintains all of its SDA, SCL, GPIO and ALERT pins in high impedance states until the device has sufficient V CC supply voltage to function properly. It also ignores any attempts to communicate with it via the 2-wire buses in this condi-tion. When the ENABLE pin voltage is low (below 0.8V), all control bits are reset to their default high impedance states, and the LTC4306 ignores 2-wire bus commands. However, with ENABLE low, the LTC4306 still monitors the ALERT1-ALERT4 pin voltages and pulls the ALERT pin low if any of ALERT1-ALERT4 is low. When ENABLE is high, devices can read from and write to the LTC4306. Connection CircuitryMasters on the upstream SDAIN/SCLIN bus can write to the Bus 1 FET State through Bus 4 FET State bits of register 3 to connect to any combination of downstream channels 1 to 4. By default, the Connection Circuitry shown in the Block Diagram will only connect to downstream channels whose corresponding Bus Logic State bits in register3 are high at the moment that it receives the connection com-mand. If the LTC4306 is commanded to connect to mul-tiple channels at once, it will only connect to the channels that are high. Masters can override this feature by setting the Connection Requirement bit of register 2 high. With this bit high, the LTC4306 executes connection com-mands without regard to the logic states of the down-stream channels.Upon receiving the connection command, the Connec-tion Circuitry will activate the Upstream-Downstream Buffers under two conditions: first, the master must be commanding connection to one or more downstream channels, and second, there must be no stuck low condition (see Stuck Low Timeout Fault discussion). If the connection command is successful, the Upstream-Downstream Buffers pass signals between the upstream bus and the connected downstream buses. The LTC4306 also turns off its N-channel MOSFET open-drain pull-down on the READY pin, so that READY can be pulled high by its external pull-up resistor.Upstream-Downstream BuffersOnce the Upstream-Downstream Buffers are activated, the functionality of the SDAIN and any connected down-stream SDA pins is identical. A low forced on any con-nected SDA pin at any time results in all pins being low. External devices must pull the pin voltages below 0.4V worst-case with respect to the LTC4306’s ground pin to ensure proper operation. The SDA pins enter a logic high state only when all devices on all connected SDA pins force a high. The same is true for SCLIN and the connected downstream SCL pins. This important feature ensures that clock stretching, clock arbitration and the acknowl-edge protocol always work, regardless of how the devices in the system are connected to the LTC4306.The Upstream-Downstream Buffers provide capacitive isolation between SDAIN/SCLIN and the downstream con-nected buses. Note that there is no capacitive isolation between connected downstream buses; they are only separated by the series combination of their switches’ on resistances.While any combination of downstream buses may be connected at the same time, logic high levels are corrupted if multiple downstream buses are active and both the V CC voltage and one or more downstream bus pull-up voltages are larger than the pull-up supply voltage for another downsteam bus. An example of this issue is shown in Figure 1. During logic highs, DC current flows from V BUS1 through the series combination of R1, N1, N2 and R2 and into V BUS2, causing the SDA1 voltage to drop and current to be sourced into V BUS2. To avoid this problem, do not activate bus 1 or any other downstream bus whose pull-up voltage is above 2.5V when bus 2 is active.OPERATIO114306f12In all other cases, the LTC4306 communicates with the master to resolve the fault. After the master broadcasts theconnect to bus 2, so that it can communicate with the source of the fault. At this point, the master writes to OPERATIOOPERATIOTable 1. LTC4306 I2C Device AddressingHEX DEVICE LTC4306 DESCRIPTION ADDRESS BINARY DEVICE ADDRESS ADDRESS PINSh a6a5a4a3a2a1a0R/W ADR2ADR1ADR0Mass Write BA10111010X X X Alert Response1900011001X X X 0801000000X L NC L 1821000001X L H NC 2841000010X L NC NC 3861000011X L NC H 4881000100X L L L 58A1000101X L H H 68C1000110X L L NC 78E1000111X L L H 8901001000X NC NC L 9921001001X NC H NC 10941001010X NC NC NC 11961001011X NC NC H 12981001100X NC L L 139A1001101X NC H H 149C1001110X NC L NC 159E1001111X NC L H 16A01010000X H NC L 17A21010001X H H NC 18A41010010X H NC NC 19A61010011X H NC H 20A81010100X H L L 21AA1010101X H H H 22AC1010110X H L NC 23AE1010111X H L H 24B01011000X H H L 25B21011001X L H L 26B41011010X NC H Lusers follow the Write Byte protocol exactly, the new data contained in the Data Byte is written into the register selected by bits r1 and r0 on the Stop Bit.General Purpose Input/Outputs (GPIOs)The LTC4306 provides two general purpose input/output pins (GPIOs) that can be configured as logic inputs, open-drain outputs or push-pull outputs. The GPIO1 and GPIO2Mode Configure bits in register 2 determine whether the GPIOs are used as inputs or outputs. When the GPIOs are used as outputs, the GPIO1 and GPIO2 Output Mode Configure bits of register 2 configure the GPIO outputs either as open-drain N-channel MOSFET pull-downs or push-pull stages.In push-pull mode, at V CC = 3.3V, the typical pull-up impedance is 670Ω and the typical pull-down impedance134306f4306f14OPERATIOis 35Ω, making the GPIO pull-downs capable of driving LEDs. At V CC = 5V, the typical pull-up impedance is 320Ωand the typical pull-down impedance is 20Ω. In open-drain output mode, the user provides the logic high by connecting a pull-up resistor between the GPIO pin and an external supply voltage. The external supply voltage can range from 1.5V to 5.5V independent of the V CC voltage.In input mode, the GPIO input threshold voltage is 1V.The GPIO1 and GPIO2 Logic State bits in register 1indicate the logic state of the two GPIO pins. The logic-level threshold voltage for each pin is 1V. The GPIO1 and GPIO2 Output Driver State bits in register 1 indicate the logic state that the LTC4306 is attempting to write to the GPIO pins. This is useful when the GPIOs are being usedFigure 4. Protocols Accepted by LTC4306Figure 3. Data Transfer Over I 2C or SMBusSCLSDASTART CONDITIONSTOP CONDITIONADDRESS ACK DATA ACK DATA ACK1-7894306 F03a6-a0d7-d0d7-d01-7891-789PS4306 F04S 0M 1ALERT RESPONSE ADDRESS PROTOCOL1in open-drain output mode and one or more external devices are connected to the GPIOs. If the LTC4306 is trying to write a high to a GPIO pin, but the pin’s actual logic state is low, then the LTC4306 knows that the low is being forced by an external device.Glitch FiltersThe LTC4306 provides glitch filters on the SDAIN and SCLIN pins as required by the I 2C Fast Mode (400kHz)Specification. The filters prevent signals of up to 50ns (minimum) time duration and rail-to-rail voltage magnitude from passing into the two-wire bus digital interface circuitry.154306f16Assume in Figure 5 that the total parasitic bus capacitance on SDA1 due to trace and device capacitance is 100pF. To ensure that the boost currents are active during rising edges, the pull-up resistor must be strong enough to cause the SDA1 pin voltage to rise at a rate of 0.8V/µs as the pin voltage is rising above 0.8V. The equation is:R k V V ns V PULL UP MAX BUSMIN −Ω[]=⎡⎣⎢,(–.)•081250⎤⎦⎥⎧⎨⎩⎫⎬⎭[]C pF BUS (1)where V BUSMIN is the minimum operating pull-up supply voltage, and C BUS is the bus parasitic capacitance. In our example, V BUS1 = V CC = 3.3V, and assuming ±10% supply tolerance, V BUS1MIN = 2.97V. With C BUS = 100pF,R PULL-UP,MAX = 27.1k. Therefore, we must choose a pull-up resistor smaller (i.e., stronger pull-up) than 27.1k, so a 10k resistor works fine.ALERT, READY and GPIO Component Selection The pull-up resistors on the ALERT and READY pins must provide a maximum pull-up current of 3mA, so that the LTC4306 is capable of holding the pin at logic low voltages below 0.4V. When choosing LE Ds to be driven by the LTC4306’s GPIO pins, make sure that the required LED sinking current is less than 5mA, and add a current-limiting resistor in series with the LED.Level Shifting ConsiderationsIn the design example of Figure 5, the LTC4306 V CC voltage is less than or equal to both of the downstream bus pull-up voltages, so buses 1 and 4 can be active at the same time. Likewise, the rise time accelerators can be turned on for the downstream buses, but must never be activated on SCLIN and SDAIN, because doing so would result in significant current flow from V CC to V BACK during rising edges.Other Application CircuitsFigure 6 illustrates how the LTC4306 can be used to expand the number of devices in a system by using nested addressing. Each I/O card contains a temperature sensorhaving device address 1001 000. If the four I/O cards were plugged directly into the backplane, the four sensors would require four unique addresses. However, if masters use the LTC4306 in multiplexer mode, where only one downstream channel is connected at a time, then each I/O card can have a device with address 1001 000 and no problems will occur.Figures 7 and 8 show two different methods for hot-swapping I/O cards onto a live two-wire bus using the LTC4306. The circuitry of Figure 7 consists of an LTC4306residing on the edge of an I/O card having four separate downstream buses. Connect a 200k resistor to ground from the E NABLE pin and make the E NABLE pin the shortest pin on the connector, so that the ENABLE pin remains at a constant logic low while all other pins are connecting. This ensures that the LTC4306 remains in its default high impedance state and ignores connection transients on its SDAIN and SCLIN pins until they have established solid contact with the backplane 2-wire bus. In addition, make sure that the ALE RT connector pin is shorter than the V CC pin, so that V CC establishes solid contact with the I/O card pull-up supply pin and powers the pull-up resistors on ALERT1–ALERT4 before ALERT makes contact.Figure 8 illustrates an alternate SDA and SCL hot-swap-ping technique, where the LTC4306 is located on the backplane and an I/O card plugs into downstream channel 4. Before plugging and unplugging the I/O card, make sure that channel 4’s downstream switch is open, so that it does not disturb any 2-wire transaction that may be occurring at the moment of connection/disconnection. Note that pull-up resistor, R17, on ALERT4 should be located on the backplane and not the I/O card to ensure proper operation of the LTC4306 when the I/O card is not present. The pull-up resistors on SCL4 and SDA4, R15 and R16 respec-tively, may be located on the I/O card, provided that downstream bus 4 is never activated when the I/O card is not present. Otherwise, locate R15 and R16 on the backplane.APPLICATIO S I FOR ATIOW UUU174306f18Figure 7. Hot-Swapping ApplicationAPPLICATIO S I FOR ATIOW UUUBACKPLANE CONNECTOR CARD CONNECTORV CARD_SCL1CARD_SDA1CARD_ALERT1CARD_SCL2CARD_SDA2CARD_ALERT2CARD_SCL3CARD_SDA3CARD_ALERT3CARD_SCL4CARD_SDA4CARD_ALERT4ADDRESS = 1010 000Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.194306f20Linear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● © LINEAR TECHNOLOGY CORPORA TION 2005LT/LWI/TP 0805 500 • PRINTED IN USAAPPLICATIO S I FOR ATIOW UUU RELATED PARTSPART NUMBER DESCRIPTIONCOMMENTSLTC1380/LTC1393Single-Ended 8-Channel/Diffierential 4-Channel Analog Low R ON : 35Ω Single-Ended/70Ω Differential, Expandable to Mux with SMBus Interface32 Single or 16 Differential ChannelsLTC1427-50Micropower, 10-Bit Current Output DAC with SMBus Precision 50µA ±2.5% Tolerance Over Temperature, 4 Selectable InterfaceSMBus Addresses, DAC Powers Up at Zero or MidscaleLTC1694/LTC1694-1SMBus AcceleratorImproved SMBus/I 2C Rise Time, Ensures Data Integrity with Multiple SMBus/I 2C DevicesLT ®1786F SMBus Controlled CCFL Switching Regulator 1.25A, 200kHz, Floating or Grounded Lamp Configurations LTC1695SMBus/I 2C Fan Speed Controller in ThinSOT TM 0.75Ω PMOS 180mA Regulator, 6-Bit DACLTC1840Dual I 2C Fan Speed Controller Two 100µA 8-Bit DACs, Two Tach Inputs, Four GPIO LTC4300A-1/LTC4300A-2Hot Swappable 2-Wire Bus Buffer Isolates Backplane and Card Capacitances LTC4300A-3Hot Swappable 2-Wire Bus BufferProvides Level Shifting and Enable Functions LTC4301Supply Independent Hot Swappable 2-Wire Bus Buffer Supply IndependentLTC4301LHot Swappable 2-Wire Bus Buffer with Low Voltage Allows Bus Pull-Up Voltages as Low as 1V on SDAIN and SCLIN Level TranslationLTC4303/LTC4304How Swappable Bus Buffers with Stuck Bus Recovery Recover Stuck Buses with Automatic ClockingLTC43052-Channel 2-Wire Multiplexer with Capacitance2 Selectable Downstream Buses, Stuck Bus Disconnect, Rise Time BufferingAccelerators, Fault Reporting, ±10kV HBM ESD ToleranceThinSOT is a trademark of Linear Technology Corporation.Figure 8. Downstream Side Hot-Swapping Application。
LTC4306IUFD-DC906A-用户手册说明书
QUICK START GUIDE FOR DEMONSTRATION CIRCUIT 906A4-CHANNEL, 2-WIRE BUS MULTIPLEXER WITH CAPACITANCE BUFFERINGLTC4306IUFDDESCRIPTIONDemonstration circuit 906A features the LTC ®4306IUFD, a 4-channel, 2-wire I2C bus and SMBus compatible multiplexer having bus buffers that provide capacitive isolation between the up-stream bus and downstream buses. Through soft-ware control, the LTC4306IUFD connects the up-stream 2-wire bus to any desired combination of downstream buses. Each bus can be pulled up to a supply voltage ranging from 2.2V to 5.5V, independ-ent of the LTC4306IUFD supply voltage. The down-stream buses are also provided with ALERT1B – ALERT4B inputs for fault reporting.Programmable timeout circuitry disconnects the downstream buses if the bus is stuck low. When acti-vated, rise time accelerators source currents into the 2-wire bus pins during rising edges to reduce rise time. Two general purpose input/output (GPIO) pins can be configured as inputs, open-drain outputs or push-pull outputs. Green LED’s D3 and D2 light up when GPIO1 and GPIO2, respectively, are low. Driv-ing the ENABLE pin low restores all device features totheir default states. Three address pins provide 27 distinct addresses.Design files for this circuit board are available. Call the LTC factory.LTC is a registered trademark of Linear Technology CorporationTable 1. Performance Summary (T A = 25°C)PARAMETERCONDITION VALUE V CC Voltage Operating Range2.7V – 5.5V Bus Pull-up Supply Voltage Range (V BUS1-V BUS4) 2.2V – 5.5V 2-Wire Bus Frequency Range0 - 400kHzBus Stuck Low Disconnect TimesV CC = 2.7V - 5.5V7.5ms, 15ms, 30ms optionsall times +/-16.7% feature can also be disabledBus Buffer V OL Offset Voltage R BUS = 10K 100mV (maximum) V CC = 3.3V 5.5mA (typical) Rise Time Accelerator Pull-up Current V CC = 5V9mA (typical) ALERTB and READY Output V OL VoltagesV CC = 2.7V - 5.5V; I ALERTB = I READY = 3mA0.4V (maximum)OPERATING PRINCIPLESFor operation with the DC906A, connect the host con-troller’s SDA and SCL pins to the LTC4306IUFD’s SDAIN and SCLIN pins (hereafter referred to as the upstream bus), and connect the upstream bus supply of 2.7V to 5.5V to Vcc (as shown in Figure 1). The host controller on the upstream side first addresses and configures the LTC4306IUFD to connect the up-stream bus to one or more of the four downstreambuses. Communications between the upstream and downstream components are then established and a host controller on any bus can then control the LTC4306IUFD.Use turrets VBUS1-VBUS4 and jumpers JP1-JP4 to pull up the downstream buses to supply voltages dif-ferent than VCC (i.e., to provide level-shifting). Forexample, in Figure1, JP1 is set to the right position and a supply voltage is connected between VBUS1 and ground. Voltages on VBUS1-VBUS4 must range between 2.2V and 5.5V. To connect a downstream bus’s pull-up supply to VCC, set its jumper to the left position.Additional configurations include enabling and dis-abling the rise time accelerators on the backplane side and/or the card side, setting the GPIO’s to open-drain output, push-pull output, or input mode, setting or resetting the GPIO’s outputs, disabling the Bus Stuck Low disconnect feature or setting the discon-nect time to 7.5ms, 15ms, 30ms. A host controller can also read the internal registers of the LTC4306IUFD to determine the settings of these fea-tures as well as fault statuses. All of these features are accessed by sending commands on the 2-wire bus.The ENABLE pin, when pulled low, resets the LTC4306IUFD to its registers default state and dis-ables communication to it. Communication can be reestablished when ENABLE is released high. There-fore, set jumper JP5 to the left position for normal operation, and set it to the right position to disable the LTC4306IUFD.Slave devices that are capable of fault reporting and that are located on downstream buses 1-4 should connect their fault pins to ALERT1B-ALERT4B, re-spectively. The LTC4306IUFD passes downstream faults to the upstream host by pulling down on the ALERTB pin, so this host’s fault input should be con-nected to the LTC4306IUFD ALERTB pin.When the upstream bus is connected to one or more downstream buses, the READY pin voltage is pulled up to VCC. When the upstream bus is disconnected from all downstream buses, the READY voltage is low (~0.2V).On the DC906A, the board’s default setting for jump-ers JP6, JP7 and JP8 is the center position, which sets the address of the LTC4306IUFD to (1001 010)2. To set a different address, configure the jumpers ac-cording to Table 1 of the data sheet (note: left posi-tion = H, middle position = NC, right position = L; de-fault = NC for all three jumpers).QUICK START PROCEDUREDemonstration circuit 906A is easy to set up to evalu-ate the performance of the LTC4306IUFD. Refer toFigure 1 for proper measurement equipment setup and follow the procedure below:KEY NOTES: a. Do not activate rise time acceleratorson buses whose pull-up supply voltages are lower than VCC. b. Make sure logic low voltages forced onall clock and data pins are < 0.4V. c. When activatingmultiple downstream buses that are powered from separate supply voltages, make sure that theLTC4306IUFD’s VCC voltage is less than or equal tothe lowest downstream bus pull-up supply voltage. 1.Jumpers JP1-JP4 choose the pull-up supply volt-ages VBUS1 – VBUS4 for downstream buses 1-4.For unused buses and buses pulled up to VCC, set the jumpers in the left position. To pull up a down-stream bus to a different voltage than VCC, set itsjumper to the right position, and connect the sup-ply voltage to the appropriate turret on the left side of the board.2.Set jumper J5 in the left position to enable communication to the LTC4306IUFD.3.Configure jumpers JP6 – JP8 to set the desired 2-wire bus address for the LTC4306IUFD according to Table 1 on page 13 of the datasheet (note: left position = H, middle position = NC, right position = L; default = NC for all three jumpers).4.Connect a cable from 6-pin header J2 to a board containing the master device(s).5.Connect a 20-pin ribbon cable from J1 to a board that contains downstream slave devices. Note: the downstream buses can contain masters, but the original command to connect must come from amaster connected to the upstream SDAIN/SCLIN bus.6. Connect power supplies to VCC and, if required,one or more of VBUS1 – VBUS4.7. Turn on the power supplies.NOTE: Make sure that the power supply voltages donot exceed 5.5V.8. Use the SMBus Read Byte and Write Byte proto-cols in conjunction with the register definitions on pages 8 and 9 of the datasheet to experiment with the LTC4306IUFD’s features and to establish up-stream-downstream communications between the master and slave devices.Figure 1.Proper Measurement Equipment Setup。
ZVN4106FTA中文资料(Diodes)中文数据手册「EasyDatasheet - 矽搜」
封装外形尺寸
A
BC
H
K
M K1
D
JF
G
L
ZVN4106F
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H 2.80 3.00 2.90
零件号
ZVN4106FTA
打标
MZ
卷盘尺寸（英寸）
7
胶带宽度（ mm） 8
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
每卷数量
3000
3. Halogen- and Antimony-free "Green” productsare defined asthose which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
机械数据
• 案例：SOT23 • 外壳材料：模压塑料,“绿色”模塑料. UL
可燃性分类额定值94V-0 • 湿度敏感度：每J-STD-020 1级 • 终端：雾锡完成.每MIL-STD-202,方法
208 e3 • 重量：0.008克（近似值）
SOT23
D
顶视图
G
S
设备符号
引脚分配 顶视图
IRG4PC50SDPBF;中文规格书,Datasheet资料
IRG4PC50SDPbFINSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODEV CES = 600VV CE(on) typ. = 1.28V@V GE = 15V, I C = 41AStandard Speed CoPack IGBTFeaturesStandard: Optimized for minimum saturation voltage and low operating frequencies (<1kHz)IGBT co-packaged with HEXFRED TM ultrafast, ultra-soft-recovery anti-parallel diodes for use in bridge configurationsIndustry standard TO-247AC packageBenefitsGeneration -4 IGBT's offer highest efficiencies availableIGBT's optimized for specific application conditions HEXFRED diodes optimized for performance with IGBT's . Minimized recovery characteristics requireless/no snubbingPD - 97316GC E TO-247ACCIRG4PC50SDPbFNotes:Repetitive rating: V GE=15V; pulse width limited by maximum junction temperature. (See figure 20) V CC=80%(V CES), V GE=15V, R G = 5.0Ω. (See figure 19)Pulse width≤80µs; duty factor≤0.1%.IRG4PC50SDPbFFig. 1 - Typical Load Current vs. Frequency(Load Current = I RMS of fundamental)Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer CharacteristicsIRG4PC50SDPbFFig. 5 - Typical Collector-to-Emitter Voltagevs. Junction TemperatureFig. 4 - Maximum Collector Current vs.Case TemperatureFig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-CaseIRG4PC50SDPbFFig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage Fig. 8 - Typical Gate Charge vs.Gate-to-Emitter VoltageFig. 9 - Typical Switching Losses vs. GateResistance Fig. 10 - Typical Switching Losses vs.Junction TemperatureIRG4PC50SDPbFFig. 11 - Typical Switching Losses vs.Collector-to-Emitter CurrentFig. 12 - Turn-Off SOAFig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current1101000.61.0 1.4 1.82.2 2.6FMFI n s t a n t a n e o u s F o r w a r d C u r r e n t - I (A ) Forward Voltage Drop - V (V)IRG4PC50SDPbFFig. 14 - Typical Reverse Recovery vs. di f /dtFig. 15 - Typical Recovery Current vs. di f /dtFig. 16 - Typical Stored Charge vs. di f /dtFig. 17 - Typical di (rec)M /dt vs. di f /dt300600900120015001001000f di /dt - (A/µs)R R Q - (n C )1001000100001001000fdi /dt - (A/µs)d i (r e c )M /d t - (A /µs )1101001001000fdi /dt - (A/µs)I - (A )I RR M204060801001201401001000fdi /dt - (A/µs)t - (n s )r rIRG4PC50SDPbFt1t2Fig. 18b - Test Waveforms for Circuit of Fig. 18a, DefiningE off , t d(off), tfFig. 18a - Test Circuit for Measurement ofI LM , E on , E off(diode), t rr , Q rr , I rr , t d(on), t r , t d(off), t fFig. 18c - Test Waveforms for Circuit of Fig. 18a,Defining E on , t d(on), t rFig. 18d - Test Waveforms for Circuit of Fig. 18a,Defining E rec , t rr , Q rr , I rrIRG4PC50SDPbFVg GATE SIGNALDEVICE UNDER TESTCURRENT D.U.T.VOLTAGE IN D.U.T.CURRENT IN D1t0t1t2Figure 19. Clamped Inductive Load TestCircuit =480V4 X I C @25°CFigure 18e. Macro Waveforms for Figure 18a'sTest CircuitFigure 20. Pulsed Collector CurrentTest Circuit233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105TAC Fax: (310) 252-7903 Visit us at for sales contact information. 04/08分销商库存信息: IRIRG4PC50SDPBF。
IXGH48N60C3D1;中文规格书,Datasheet资料
Coes 100
Cres
20 10
10 0 5 10 15 20 25 30 35 40
0 200
250
300
350
400
450
500
550
600
650
VCE - Volts
VCE - Volts
Fig. 11. Maximum Transient Thermal Impedance
1.00
Z(th)JC - ºC / W
Inches Min. Max. .185 .209 .087 .102 .059 .098 .040 .055 .065 .084 .113 .123 .016 .031 .819 .845 .610 .640 0.205 0.225 .780 .800 .177 .140 .144 0.232 0.252 .170 .216
VCE(sat) - Normalized
IC - Amperes
40 35 30 25 20 15 10 5 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 7V 9V
1.0 0.9 0.8 0.7 0.6 0.5 25 50 75 I
C
C
= 30A
I
C
= 15A
100
125
150
VCE - Volts
Characteristic Values Min. Typ. Max. 3.0 5.5 V 300 μA 1.75 mA ±100 2.3 1.8 2.5 nA V V
z z z z z z z
High Frequency Power Inverters UPS Motor Drives SMPS PFC Circuits Battery Chargers Welding Machines Lamp Ballasts
STGP10NB60SFP;中文规格书,Datasheet资料
- O 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
20
V
±100 nA
10 µA 100 µA
2.5
5V
1.15 1.35 1.75
V
1.25
5
S
ct(s) Table 5. du Symbol
Dynamic Parameter
Pro Cies teCoes le Cres
Figure 3. Transfer characteristics
Product(s) Figure 4. Transconductance
Figure 5. Collector-emitter on voltage vs temperature
lete Product(s) - Obsolete Figure 6. Collector-emitter on voltage vs Obso collector current
0.6
µJ
-
5
- µJ
5.6
µJ
-
8
- µJ
t(s 1. Eon is the turn-on losses when a typical diode is used in the test circuit. If the IGBT is offered in a package c with a co-pack diode, the co-pack diode is used as external diode. IGBTs and diode are at the same u temperature (25°C and 125°C). Obsolete Prod 2. Turn-off losses include also the tail of the collector current.
电子元器件ZVN4106F中文资料_数据手册_IC数据表
Device DescriptionThe ZXFV201is a quad,high speed amplifier designed for video and other high speed applications.It features low differential gain and phase performance.Together with high output drive and slew rate capability,this brings high performance to video applications.Features and Benefits·Unity gain bandwidth 300MHz ·Slew rate 400V/s ·Differential gain 0.01%·Differential phase 0.01Њ·Output current 40mA·Characterized up to 300pF load ·±5 Volt supply·Supply current 7mA per amplifier.·14 pin SO packageApplications·Video gain stages ·CCTV buffer ·Video distribution ·RGB buffering ·xDSL ·Home theatre·Fast ADC signal input drive ·High frequency instrumentation ·Cable driving ·Radar imaging ·Medical imagingZXFV201ISSUE 1 - FEBRUARY 20021QUAD VIDEO AMPLIFIERPart Number Container Increment ZXFV201N14TA reel 7”500ZXFV201N14TCreel 13”2500ORDERING INFORMATIONConnection diagramABSOLUTE MAXIMUM RATINGSSupply Voltage, V+ to V-11V differential ( 5.5V)Inputs to ground*V+ - 0.5V to V- - 0.5V Operating Ambient Temperature Range -40C to 85C Storage -65C to 150COperating Junction Temperature T JMAX **150°C**The thermal resistance from the semiconductor die to ambient is typically 120ЊC/W when the SO14package is mounted on a PCB in free air.The power dissipation of the device when loaded must be designed to keep the device junction temperature below T JMAX .*During power-up and power-down,these voltage ratings require an appropriate sequence of applying and removing signals and power supplies.ESD: This device is sensitive to static discharge and proper handling precautions are required.ZXFV201ISSUE 1 - FEBRUARY 20022PARAMETERCONDITIONSTESTMIN TYP MAX UNIT Supply Voltage V+operating range 4.755 5.25V Supply Voltage V-operating range -5.25-5-4.75V Supply currentP 233035mA Input Common mode voltage range P Ϯ3V Input offset voltage P 110mV Output offset voltageP220mV Input bias current,non-inverting inputP 510A Input resistance P 1.52 6.5M ⍀Open loop gain P 4861dB Output voltage swing P Ϯ3V Output drive current P 40mA Positive PSRR P 4957dB Negative PSRR P 5158dB Bandwidth –3dB Av=+1,Vout =200mV pk-pkC 300MHz Bandwidth –0.1dB Av=+1,Vout =200mV pk-pk C 30MHz Slew rateAv=+1Av =+2Av =+10C400400400V/sRise time Vout =Ϯ1V,10%-90%C 4.0ns Fall timeVout =Ϯ1V,10%-90%C 3.2ns Propagation delay Vout =Ϯ2V,50%C4.0ns Differential Gain 3.6MHz(NTSC)and4.4MHz(PAL),R L =150⍀C 0.01%Differential phase3.6MHz(NTSC)and4.4MHz(PAL),R L =150⍀C 0.01degELECTRICAL CHARACTERISTICS±5V power supplies ,T amb = 25C unless otherwise stated. R f = 1k ⍀,R L = 150⍀, C L <= 10pFTest – P = production tested. C = characterisedhttps://ZXFV201ISSUE 1 - FEBRUARY 20023Figure 2: Pulse Response, Unity Gain, 1V pk-pk, R F= 510Figure 1: Typical Video Signal Application Circuit, Gain = 2 (overall gain = 1 for 75load)https://APPLICATIONS INFORMATIONIntroductionA typical circuit application is shown in Figure 1,above.This is suitable for 75ohm transmission line connections at both the input and the output and is useful for distribution of wide-band signals such as video and xDSL via cables.The 75ohms reverse terminating resistor R4gives the correct matching condition to a terminated video cable.The amplifier load is then 150ohms in parallel with the local feedback network.The wide bandwidth of this device necessitates some care in the layout of the printed circuit.A continuous ground plane is required under the device and its signal connection paths,to provide the shortest possible ground return paths for signals and power supply filtering.A double-sided or multi-layer PCB construction is required,with plated-through via holes providing closely spaced low-inductance connections from some components to the continuous ground plane.For the power supply filtering,low inductance surface mount capacitors are normally required.It has been found that very good RF decoupling is provided on each supply using a 1000pF NPO size 0805or smaller ceramic surface mount capacitor,closest to the device pin,with an adjacent 0.1uF X7R capacitor.Other configurations are possible and it may be found that a single 0.01uF X7R capacitor on each supply gives good results.However this should be supported by larger decoupling capacitors elsewhere on the printed circuit board.Values of 1to 10µF are recommended,particularly where the voltage regulators are located more than a few inches from the device.These larger capacitors are recommended to be solid tantalum electrolytic or ceramic types.Note particularly that the inverting input of this current feedback type of amplifier is sensitive to small amounts of capacitance to ground which occur as part of the practical circuit board layout.This capacitance affects bandwidth,frequency response peaking and pulse overshoot.Therefore to minimise this capacitance,the feedback components R2and R3of Figure1should be positioned as close as possible to the inverting input connection.The frequency response and pulse response will vary according to particular values of resistors and layout capacitance.The response can be tailored for the application to some extent by choice of the value of feedback resistor.Figure 2shows an oscilloscope display of the pulse response for a practical double sided printed circuit board where RF=510ohms.ZXFV201ISSUE 1 - FEBRUARY 20025Figure 3: Graphs of Gain and Phase vs Frequncy (R L =150)https://ZXFV201PACKAGE OUTLINEDIMINCHESMIN MAX A 0.0530.069A10.0040.010D 0.3370.344H 0.2280.244E 0.1500.157L 0.0160.050e 0.050BSC b 0.0130.020c 0.0080.010⍜0Њ8Њh0.0100.020PACKAGE DIMENSIONShttps://。
430NM中文资料
4.5
3.6
3.5
2.25
2.2
2.0
V
Forward Voltage (max.)
IF=20mA
5.5
4.0
4.0
2.6
2.5
2.5
2.5
V
Reverse Current
VR=5V
100
50
50
10
10
10
10
uA
Wavelength at Peak Emmission
IF=20mA
V mA mA mW
o
Derating linear from 50oC Power Dissipation Operating/Storage Temperature
C
Operating Characteristics
(TA=25 C)
oБайду номын сангаас
565nm (GaP)
590nm (GaAsP/GaP)
625nm (GaAsP/GaP)
元器件交易网
TECHNICAL DATA 5V/12V LED WITH INTERNAL RESISTANCE
Absolute Maximum Ratings
(TA=25 C)
o
565nm (GaP)
590nm (GaAsP/GaP)
625nm (GaAsP/GaP)
IF=20mA
Spectraline half-width IF=20mA
30
35
45
20
nm
RELATIVE INTENSITY VS. WAVELENGTH
Telephone: 781-935-4442 Fax: 781-938-5867
Victron GX产品系列介绍说明书
Victron GX product rangeIntroductionGX products are Victron's state-of-the-art monitoring solution. The family consists of the different GX products, and their accessories.The GX-device lies at the heart of the system - providing monitoring, and operating as the communication-centre of your installation. All the other system-components - such asinverter/chargers, solar chargers, and batteries - are connected to it. Monitoring can be carried out locally and remotely - via our free-to-use Victron Remote Management portal (VRM). The GX-device also provides Remote firmware updates and allows inverter/charger settings to be changed remotely.The GX Family consists of these models:Cerbo GX - Our newly released GX product.Color Control GX - Our first released GX product, the CCGX has a display and buttons.Venus GX - The Venus GX has more analog and digital IO, no LCD and is more cost effectivethan the CCGX.CANvu GX - The CANvu GX is best for harsh environments - when its IP67 rating and touch LCD is a must.Octo GX - The Octo GX is particularly suited to medium size installations which have many MPPT Solar Chargers, as it has 10 VE.Direct ports.Maxi GX - Compared to the other GX devices, the Maxi GX has most CPU power and mostVE.Direct ports: 25. This is the GX device to use for large systems with many VE.Direct MPPT Solar Chargers.Lastly, there is a GX device built into our MultiPlus-II GX and EasySolar-II GX Inverter/chargers. Available accessoriesGX Touch 50 - Touch screen display accessory for the Cerbo GXGX GSM - A cellular modem. It connects to GX device via USB, and takes a simcardWiFi USB sticksEnergy Meters - Measures PV Inverter Output where PV Inverters cannot be read-out directly.Also used as a grid meter in an Energy Storage System (ESS).VE.Can resistive tank sender adapter Allows a standard resistive tank-level sender to beconnected to the GX device.Comparison tableAppearanceDisplayGX Touch 50optional touchdisplay (16)800×480480 x 272 LCDDisplay & 7buttonsno display no display4.3“ touch-screen2×16 character displayRemote Console yesBuzzer yes yes yes no yes no Documentation Cerbo GX CCGX Venus GX Octo GX CANvu GX Maxi GXMultiPlus-IIGX andEasySolar-IIGX Manual Cerbo GX manual CCGX manual VGX manual OGX manual CANvu manualMaxi GXmanualMultiPlus-IIGX manual Product detailpagepage page page page page page pageVictron comm.portsCerbo GX CCGX Venus GX Octo GX CANvu GX(12)Maxi GXMultiPlus-IIGX andEasySolar-IIGX VE.Direct ports(always isolated) 3(1) 2 (1)10 (1) 3 (1)251 VE.Bus(always isolated)2 paralleled RJ45 sockets 1 RJ45 socket2 paralleledRJ45 sockets VE.Can yes - non isolated 2 paralleled RJ45 sockets – isolated no (14)OthercommunicationCerbo GX CCGX Venus GX Octo GX CANvu GX Maxi GXMultiPlus-IIGX andEasySolar-IIGX USB 3 USB Host ports 2 USB Host ports 1 USB Host portEthernet10/100 RJ45 socket - isolated except shield1 port.isolation?(12)10/100 RJ45 socket WiFi built-in optional (2)built-in, butsee (3)built-in,externalantenna (11)optional (2)no built-inBluetooth Smart yes (17)noMicro SDcardslot SDHC cards up to max. of 32GB.(5)no yes no Second CAN-busport(also featuresBMS-Can (18))no noyes - non-isolatedyes - non-isolatedno no no BMS-Can port (15)yes no yes (14)Built-in RS485no no noyes - non-isolatedno noIO Cerbo GX CCGX Venus GX Octo GX CANvu GX(12)Maxi GXMultiPlus-IIGX andEasySolar-IIGX Programmablerelay (7)2 x NO/NC (8) 1 x NO 1 x NO/NC (8)1x NO / NC2x NO / NC (8)n/a Resistive tanklevel inputs 4(9)no 3 (9)noTemperaturesense inputs 4(10)no 2 (10)noDigital Inputs4no5314noThird party compatibility Cerbo GX CCGX Venus GX Octo GX CANvu GX Maxi GXMultiPlus-IIGX andEasySolar-IIGXCanbus-BMSbatteriesMany battery brands. See here for details Fronius PVInvertersSee here for detailsSMA PV Inverters See here for detailsABB PV Inverters See here for detailsSolarEdge PVInvertersSee here for detailsMarine MFD AppSupportGeneric MFD Manual, Navico, Garmin, RaymarinePerformance Cerbo GX CCGX Venus GX Octo GX CANvu GX Maxi GX MultiPlus-IIGX and EasySolar-IIGXCPU dual core single core quad core RAM1GB256MB512MB512MB256MB512MB512MB Max. VE.Directdevices (1)tbd - 15 orso561042525Other Cerbo GX CCGX Venus GX Octo GX CANvu GX Maxi GX MultiPlus-IIGX and EasySolar-IIGXSupply voltage8 - 70 VDC8 - 32 VDC32 - 70 VDCpowered internally, no externalsupplyMounting Wall or DIN rail(35mm)(19)PanelIntegrationWall mountingDIN Rail(35mm)PanelWall mountIP65Built-inOuter dimensions ( h x w x d )78 x 154 x 48mm130 x 120 x 28mm45 x 143 x 96mm61 x 108 x 90mm?600 x 380 x210 mmOperatingtemperature-20 to +50°C-20 to +70°C-20 to +50°C Batterybackupped clockyes no yes yes 5V output no 1 A (13)noStandards Cerbo GX CCGX Venus GX Octo GX CANvu GX Maxi GX MultiPlus-IIGX and EasySolar-IIGXSafety tbd EN 60950???EMC tbd EN 61000-6-3, EN 55014-1, EN 61000-6-2, EN 61000-6-1, EN 55014-2 Automotive tbd E4-10R-053535In progress??noNotesThe listed maximum on the `Performance` section in above table is the total connected 1.VE.Direct devices such as MPPT Solar Charge controllers. Total means all directly connected devices plus the devices connected over USB. The limit is mostly bound by CPU processing power. Note that there is also a limit to the other type of devices of which often multiple areconnected: PV Inverters. Up to three or four three phase inverters can typically be monitored ona CCGX. Higher power CPU devices can monitor more.2.Though the CCGX has no built-in WiFi that functionality can easily be added by attaching a USB-WiFi dongle. See CCGX Manual, section 1.4.2 for details.3.The built-in WiFi in the Venus GX has a very low signal strength - unfortunately. It is strong enough to connect to a phone, tablet or laptop in order to access setup and monitoring. But to connect the Venus GX to the internet either use the built-in Ethernet port or add a USB-WiFi dongle. See CCGX Manual, section 1.4.2 for details. Make sure the Venus GX is running v2.06 or later - early shipments of Venus GX units ran v2.05.4.The hardware of the Venus GX and Octo GX includes a built-in Bluetooth Smart chipset which hasn't proved satisfactory. Bluetooth Smart for GX devices is coming soon but will not use built-in chipsets.5.Larger SD memory cards (SDXC) are not supported. SD cards can be used for two purposes: 1.Logging data, see this section in the ccgx manual for details.2.Updating firmware, see this section in the ccgx manual for detials.6.The second CANbus port is accessible via the GND, CAN-H and CAN-L terminals. Note that the port is not Isolated. See Settings → Services for configuring that port.7.The programmable relay can be set to act as an alarm relay, automatic genset start stop, or an on/off switch, and is controlled via the GUI and/or ModbusTCP.8.In the Venus GX hardware there are two relays - at present only one of them is available for use.The tank level inputs are resistive and should be connected to a resistive tank sender. Victron 9.does not supply tank senders. The tank level ports can each be configured to work with either European (0 - 180 Ohm); or US tank senders (240 - 30 Ohm).The Cerbo GX has four temperature terminals, and the Venus GX has two. They can be used to 10.measure & monitor all kinds of temperature-inputs. Temperature senders are not included. The required sensor is ASS000001000 - Temperature Sensor QUA/PMP/Venus GX. (Note that this is not the same as the BMV temperature accessory.)11.Octo GX comes with a small Wifi antenna. You may remove and replace it with any other Wifiantenna having an RP-SMA connector.12.Requires the CANvu GX IO Extender and wiring kit13.The 5V output on the Venus GX can be used to power, for example, a USB hub. Note that its output is not current limited or otherwise protected, and it shares the internal power supply in the Venus GX: overdrawing from it will result in shutdown(s) of the Venus GX. It isrecommended to install a fuse for prevention.14.Though some early batches of the Maxi GX, MultiPlus-II GX and EasySolar-II GX all have a dual set of RJ-45 sockets labelled VE.Can, this port is actually a BMS-Can port. It can only be used to connected to managed batteries such as Freedomwon, BYD, Pylontech, BlueNova, MG Energy Systems and others, at 500kbps. The hardware does not meet the requirements for a VE.Can port; and thus it is not possible to use to port to connect Victron products such as theSmartSolar VE.Can MPPT product range. Note that for a while Venus OS firmware did allow to select the VE.Can function and other baudrates. The result will be unreliable, and therefor they have been updated to lock into BMS-Can only at 500kbps.15.A BMS-Can port is a port dedicated to be used for connecting managed batteries, such asFreedomwon, BYD, Pylontech, BlueNova, MG Energy Systems and others, only. It is not possible to connect Victron VE.Can products to that port. To connect such managed battery, use our special cables, and see documentation here. Connect the side labelled 'VE.Can' into the BMS-Can/VE.Can port on the GX Device. And connect the other side to the battery. The baudrate of a BMS-Can port is fixed to 500kbps.16.The GX Touch 50 connects to the Cerbo GX using a single cable; fixed permanently to the GX Touch 50, which on the other end splits into a USB and a connector for the video signal. Bothneed to be inserted into the Cerbo GX, taking one of the three USB ports. The USB part of the cable is used to power the GX Touch 50. The cable is 2 meters in length; and can not beextended in length.17.The Bluetooth feature of the Cerbo GX allows to configure its WiFi and Ethernet settings from within VictronConnect.18.The secondary CAN port, available on some GX devices as per table above, can be configured to be used as a BMS-Can port, as well as other profiles. For details, see manual.DIN rail mounting requires additional accessory - DIN35 Adapter.19.。
NuMicro M460系列产品简介说明书
NuMicro® FamilyArm® Cortex®-M4-based MicrocontrollerM460 SeriesProduct BriefM460 SERIES PRODUCT BRIEFThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microcontroller andmicroprocessor based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.1 GENERAL DESCRIPTIONThe NuMicro M460 series is a 32-bit microcontroller based on Arm Cortex-M4F core, with DSP instruction set and single-precision floating-point unit (FPU), targeted for IoT, Industrial, and consumer applications. The M460 series runs up to 200 MHz, and features 1.7 V to 3.6 V wide operating voltage, -40 °C to 85 °C /105°C wide operating temperature, a variety of packages choice, and excellent high immunity characteristics by ESD HBM 2 KV and EFT 4.4 KV.As the new smart function added on home appliances, the M460 series provides up to 1024 KB dual-bank of Flash memory for code storage and 512 KB SRAM for run time operation. The dual bank design of 1024 KB Flash memory supports the Firmware update through the Over-The-Air (FOTA) process. Additionally, in response to the code security requirements, the M460 series supports Execute-Only Memory (XOM) function to protect confidential program code information from stealing in the run-time. In order to reduce the data access overhead of CPU core to peripherals, up to 2 sets of peripheral direct memory access (PDMA) is provided.The M460 series supports plenty of peripherals, including Ethernet 10/100 MAC, hardware crypto engine, key store, true random number generator (TRNG), programmable audio PLL, HyperBus interface, 4 sets of CAN FD, USB HS OTG, USB FS OTG, up to 24 channels of 16-bit PWM, 10 sets of UART, 4 sets of SPI/I2S, 2 set of Quad-SPI, 5 sets of I²C, 1 set of USCI, 1 set of PSIO, 4 sets of EQEI and a real-time clock (RTC). The M460 series also provides rich analog peripherals including 4 sets of analog comparators, up to 28 channels of 12-bit SAR ADC, and 2 channel of 12-bit DAC.For the development, Nuvoton provides the NuMaker-M467HJ, NuMaker-M463KG evaluation board, and Nuvoton Nu-Link debugger. The 3rd Party IDE such as Keil MDK, IAR EWARM, Eclippse IDE with GNU GCC compilers are also supported.Product Line Core(MHz)EthernetCrypto+ TRNGCAN FDUSBOTGHBI EBI UART I2CQSPI/SPIPWM ADC DAC ACMP EQEIM467xJHAx Series200 √√ 4 HS x1FS x1√√10+3 5SPI x4QSPI x224 28 2 4 4M463xGCAx Series 200 - √ 2 HS x1 - √8+1 5SPI x4QSPI x224 16 - 2 2Table 1-1 NuMicro M460 Series Key Features Support Table The NuMicro M460 series supports six package choices.●QFN48 w/ EPAD: 5 mm x 5 mm, Load pitch: 0.35 mm●LQFP48: Body Size 7 mm x 7 mm, Load Pitch 0.5 mm●LQFP64: Body Size 7 mm x 7 mm, Load Pitch 0.4 mm●LQFP128: Body Size 14 mm x 14 mm, Load Pitch 0.4 mm●LQFP144: Body Size 20 mm x 20 mm, Load Pitch 0.5 mm●LQFP176: Body Size 24 mm x 24 mm, Load Pitch 0.5 mmThe NuMicro M460 series is suitable for a wide range of applications such as:●IoT Gateway●Industrial Control●Telecom●Data CenterM460 SERIES PRODUCT BRIEF2 FEATURES2.1 M467xJHAx Series●Operating Characteristics–Voltage range: 1.7 V to 3.6 V–Temperature range: -40 °C to +85 °C–EFT 4.4 KV–ESD HBM 2 KV●Core–Up to 200 MHz ARM Cortex-M4F–DSP instruction set–Single-precision floating point instructions (FPU) –Memory Protection Unit (MPU) with eightmemory regions●Memories–Up to 1024 KB Flash memory with dual bank structure supporting Firmware Over-The-Air(FOTA)–Flash memory supporting up to four regions of eXecute-Only-Memory (XOM)–8 KB user-defined loader (LDROM)– 3 KB One-Time-Programmable ROM–Up to 512 KB SRAM including hardware parity check 64 KB–16 KB Cache for XIP in external QSPI Flash●External Memory Interface–External bus interface (EBI), i80 mode–HyperBus interface (HBI), up to 90 MHz●Clock– 4 to 24 MHz crystal oscillator–32.768 kHz crystal oscillator for RTC–Internal 48 MHz RC oscillator–Internal 10 kHz RC oscillator–Internal PLL up to 200 MHz–Programmable Audio PLL (APLL)●Power Management–Active: 175 μA/MHz at 25°C/3.3V (peripheral off)–Low leakage power-down (LLPD): 340 μA–Standby power-down (SPD) w/o RAM retention:1.2 μA–Deep power-down (DPD): 0.2 μA (RTC off)–RTC with VBAT supply: 1 μA–Supports wake up from Normal Power-down mode by: RTC, WDT, I²C, Timer, UART, GPIO,EINT, ACMP, SDH, USB FS, USB HS, EMAC,and BOD●Timer & PWM–Four 32-bit timers–Up to 12 Enhanced PWM with twelve 16-bit counters–Up to 12 Basic PWM with two 16-bit counters–One 24-bit count-down SysTick timer–One watchdog timer–One window watchdog timer ●Peripheral Direct Memory Access (PDMA)– 2 set of PDMA, each with 16 channels–Channel can be operated by software trigger,UART, SPI, EPWM, TIMER, ADC, DAC, ACMPand I2C●Analog Peripheral– 3 set of 12-bit, up to 28-ch, 5 MSPS SAR ADC– 2 set of 12-bit, 1 MSPS DAC– 4 sets of analog comparators–Built-in internal reference voltage●Communication Interface–Up to 10 sets of UART interfaces with IrDA(Support LIN in UART0 and UART1)–Up to 3 set of ISO-7816-3 interfaces, whichsupport full duplex UART mode–Up to 5 sets of I2C interfaces with SMBus/PMBus(Up to 3.4 Mbps)–Up to 4 sets of SPI/I2S interfaces (SPI up to 100MHz in Master mode)–Up to 2 set of Quad-SPI interface (Up to 100MHz in Master mode)– 2 set of I2S interface– 4 set of CAN FD interfaces– 2 set of Secure Digital Host Controllers (Up to 50MHz)– 1 set of SPI Flash interface supports quad modeand eXecute-In-Place–Up to 1 set of USCI interfaces–Up to 1 set of PSIO interfaces–Support 6x8 KPI–Up to 4 set of enhanced quadrature encoderinterfaces (EQEI)–Up to 4 set of 24-bit, 3-ch enhanced inputcapture timer/counter units●Camera Capture Interface●Advanced Connectivity–USB 2.0 high speed device/host/OTG controllerwith on-chip PHY–USB 2.0 full speed device/host/OTG controllerwith on-chip PHY–10/100 Ethernet MAC with RMII (IEEE1588v2)●Cryptography Accelerator–ECC-571–AES-256–SHA-512–HMAC-512–RSA-4096–SM2●Pseudo Random Number Generator (PRNG)●True Random Number Generator (TRNG)●Key Store●Secure Boot●Voltage Adjustable Interface (VAI)M460 SERIES PRODUCT BRIEF●Cyclic Redundancy Calculation (CRC)●Real Time Clock (RTC) with Vbat●Up to 146 I/O pins with interrupt capability ●IEC60730-1 Class B–Supports certified IEC60730-1 Class B Software Test Library (STL)●Development Platform Support–Arm Keil RVMDK and IAR EWARM IDE–Free GNU compiler with Eclipse IDE support–ICP (In Circuit Programmer) support for updating internal code via Nu-Link debugger–ISP (In System Programmer) support forupdating code through UART, SPI, I2C, RS-485peripheral interfaces–Pin Viewer for real time monitoring the status of all I/O pins–PinConfigure tool for pin assignment, initial code generation and OrCAD/Protel part generation●96-bit Unique ID (UID)●128-bit Unique Customer ID (UCID)●Package–Package is Halogen-free, RoHS-compliant and TSCA-compliant.Pin Count 176 144 12864Type LQFP LQFP LQFP LQFPI/O Pin 146 114 100 44Lead Pitch(mm)0.5 0.5 0.4 0.4Dimensions(mm) 24x24x1.420x20x1.414x14x1.47x7x1.4M460 SERIES PRODUCT BRIEF2.2 M463xGCAx Series●Operating Characteristics–Voltage range: 1.7 V to 3.6 V–Temperature range: -40 °C to +105 °C–EFT 4.4 KV–ESD HBM 2 KV●Core–Up to 200 MHz ARM Cortex-M4F–DSP instruction set–Single-precision floating point instructions (FPU) –Memory Protection Unit (MPU) with eightmemory regions●Memories–Up to 256 KB Flash memory–Flash memory supporting up to four regions of eXecute-Only-Memory (XOM).–8 KB user-defined loader (LDROM)–Up to 128 KB SRAM including hardware parity check 64 KB●External Memory Interface–External bus interface (EBI), i80 mode●Clock– 4 to 24 MHz crystal oscillator–32.768 kHz crystal oscillator for RTC–Internal 48 MHz RC oscillator–Internal 10 kHz RC oscillator–Internal PLL up to 200 MHz●Power Management–Active: 135 μA/MHz at 25°C/3.3V (peripheral off)–Low leakage power-down (LLPD): 80 μA–Standby power-down (SPD) w/o RAM retention:0.9 μA–Deep power-down (DPD): 0.15 μA (RTC off)–RTC with VBAT supply: 0.5 μA–Supports wake up from Normal Power-down mode by: RTC, WDT, I²C, Timer, UART, GPIO,EINT, ACMP, SDH, USB HS, and BOD●Timer & PWM–Four 32-bit timers–Up to 12 Enhanced PWM with twelve 16-bit counters–Up to 12 Basic PWM with two 16-bit counters–One 24-bit count-down SysTick timer–One watchdog timer–One window watchdog timer●Peripheral Direct Memory Access (PDMA)– 1 set of PDMA with 16 channels–Channel can be operated by software trigger, UART, SPI, EPWM, TIMER, ADC, DAC, ACMPand I2C●Analog Peripheral– 1 set of 12-bit, up to 16-ch, 5 MSPS SAR ADC – 2 sets of analog comparators–Built-in internal reference voltage●Communication Interface–Up to 8 sets of UART interfaces with LIN andIrDA–Up to 1 set of ISO-7816-3 interfaces, whichsupport full duplex UART mode–Up to 5 sets of I2C interfaces with SMBus/PMBus(Up to 3.4 Mbps)–Up to 4 sets of SPI/I2S interfaces (SPI up to 100MHz in Master mode)–Up to 2 set of Quad-SPI interface (Up to 100MHz in Master mode)– 2 set of CAN FD interfaces–Up to 1 set of Secure Digital Host Controllers (upto 50 MHz)–Up to 1 set of USCI interfaces–Up to 1 set of PSIO interfaces–Support 6x8 KPI–Up to 2 set of enhanced quadrature encoderinterfaces (EQEI)–Up to 2 set of 24-bit, 3-ch enhanced inputcapture timer/counter units●Advanced Connectivity–USB 2.0 high speed device/host/OTG controllerwith on-chip PHY●Cryptography Accelerator–AES-256●Pseudo Random Number Generator (PRNG)●True Random Number Generator (TRNG)●Key Store●Secure Boot●Voltage Adjustable Interface (VAI)●Cyclic Redundancy Calculation (CRC)●Real Time Clock (RTC) with Vbat●Up to 119 I/O pins with interrupt capability●IEC60730-1 Class B–Supports certified IEC60730-1 Class B SoftwareTest Library (STL)●Development Platform Support–Arm Keil RVMDK and IAR EWARM IDE–Free GNU compiler with Eclipse IDE support–ICP (In Circuit Programmer) support for updatinginternal code via Nu-Link debugger–ISP (In System Programmer) support forupdating code through UART, SPI, I2C, CAN-FD,USB HS peripheral interfaces–Pin Viewer for real time monitoring the status ofall I/O pins–PinConfigure tool for pin assignment, initial codegeneration and OrCAD/Protel part generation●96-bit Unique ID (UID)M460 SERIES PRODUCT BRIEF●128-bit Unique Customer ID (UCID)●Package–Package is Halogen-free, RoHS-compliant and TSCA-compliant.Pin Count 128 64 4848Type LQFP LQFP LQFP QFNI/O Pin 100 44 33 33Lead Pitch(mm)0.4 0.4 0.5 0.35Dimensions(mm) 14x14x1.47x7x1.47x7x1.45x5X0.8M460 SERIES PRODUCT BRIEF3 BLOCK DIAGRAM3.1M460 Series Block DiagramM460 SERIES PRODUCT BRIEF4 PARTS INFORMATION 4.1 Package Type4.1.1 M460 SeriesPart No.QFN48(5x5mm)LQFP48(7x7mm)LQFP64(7x7mm)LQFP128(14x14mm)LQFP144(20x20mm)LQFP176(24x24mm)M463 M463YGCAE M463LGCAE M463SGCAE M463KGCAEM467 M467SJHAN M467KJHAN M467JJHAN M467HJHANM460 SERIES PRODUCT BRIEFM460 SERIES PRODUCT BRIEF4.2NuMicro M460 Series Selection Guide4.2.1M463xGCAE SeriesPART NUMBERM463KGCAESGCAELGCAEYGCAESystem Frequency (MHz)200 Flash (KB) 256 SRAM (KB) 128 LDROM (KB) 8 XOM (regions)4 PDMA16-chI/O100443333RTC (V BAT ) √ 32-bit Timer 4 16-bit EPWM 12 16-bit BPWM12 C o n n e c t i v i t yUART 8 QSPI 2 SPI/I 2S4 I 2C5 CAN-FD 2 PSIO 1USCI 1 SD Host 1 ISO-7816-31 USB High Speed OTG with PHY√ LCD Parallel Data Bus (External Bus Interface)√ EQEI 2 ECAP 2 KPI6x812-bit ADC161612 12Analog Comparator2 Crypto AES-256TRNG√ Operating Temperature-40°C ~ 105°CPackageLQFP 128(14x14mm)LQFP 64 (7x7mm)LQFP 48 (7x7mm)QFN 48 (5x5mm)M460 SERIES PRODUCT BRIEF4.2.2M467xJHAN SeriesPART NUMBERM467HJHANJJHANKJHAN SJHANSystem Frequency (MHz)200 Flash (KB) 1024 SRAM (KB) 512 LDROM (KB) 8 XOM (regions)4PDMA2 set, each with 16-ch I/O14611410044RTC (V BAT ) √ 32-bit Timer 4 16-bit EPWM 12 16-bit BPWM12C o n n e c t i v i t yUART 109QSPI 2 SPI/I 2S 4 SPI Master1 I 2S2 I 2C 5 CAN-FD 4 PSIO 1 USCI 1 SD Host 2 ISO-7816-33 USB High Speed OTG with PHY √ USB Full Speed OTG with PHY√ LCD Parallel Data Bus (External Bus Interface)√HyperBus Interface√-EQEI 4 ECAP 4 KPI6x812-bit ADC 282012-bit DAC2 Analog Comparator4Crypto AES-256, ECC-571, SHA-512, HMAC-512, RSA-4096, SM2TRNG √Ethernet 10/100 Mac √Camera Capture Interface √Operating Temperature -40°C ~ 85°CPackage LQFP 176(24x24mm)LQFP 144(20x20mm)LQFP 128(14x14mm)LQFP 64(7x7mm)M460 SERIES PRODUCT BRIEF4.3 NuMicro M460 Naming RuleM4 60 H J H A E Core Series Package Flash Size SRAM Size Revision TemperatureCortex-M4F63: CAN FD/USB HS67: Ethernet/Crypto Y: QFN48(5x5 mm)L: LQFP48(7x7 mm)S: LQFP64(7x7 mm)K: LQFP128(14x14 mm)J: LQFP144(20x20 mm)H: LQFP176(24x24 mm)J: 1024 KBG: 256 KBH: 512 KBC: 128 KBA E:-40°C ~ 105°CN:-40°C ~ 85°CM460 SERIES PRODUCT BRIEF5 DEVELOPMENT PLATFORM5.1 Programmer and DebuggerNu-Link Basic full speed USB2.0 hardware debugger/programmerNu-Link-Pro Advanced hardware debugger/programmer with programming counterNu-Link 2.0 Advanced high speed USB2.0 hardware debugger/programmer with multi-functionsNu-Link-Gang Off-line hardware programmer supporting up to four chips programming for mass-production ISP In System Programmer, a software programming tool supporting UART/USBICP In Chip Programmer, a software programming tool supporting Nu-Link programmer5.2 Development EnvironmentProgramming IDE Keil MDK, IAR, NuEclipse (GCC)Software Package Board Support Package (BSP), Sample CodeDevelopment IDE NuTool PinView, NuTool PinConfig, NuConsole5.3 Development BoardEVB NuMaker Part Number FeatureNK-M467HJ M467SJHAN, M467KJHAN, M467JJHAN,M467HJHAN Support Ethernet, CAN-FD, Crypto, USB HS, EBI, Expand Connector, and Arduino Uno InterfaceNK-M463GC M463KGCAE, M463SGCAE, M463LGCAE,M463YGCAE Support USB HS, EBI, ExpandConnector, and Arduino Uno InterfaceM460 SERIES PRODUCT BRIEF6 REVISION HISTORYDate Revision Description2022.07.05 1.00 Initial version M460 SERIES PRODUCT BRIEFM460 SERIES PRODUCT BRIEFImportant NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, any malfunction or failure of which may cause loss of human life, bodily injury or severe propertydamage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomic energycontrol instruments, airplane or spaceship instruments, the control or operation of dynamic, brakeor safety systems designed for vehicular use, traffic signal instruments, all types of safety devices,and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claims toNuvoton as a result of customer’s Insecure Usage, customer shall i ndemnify the damages andliabilities thus incurred by Nuvoton.。
NCP4306同步矩阵评估板用户手册说明书
EVBUM2520/DNCP4306 Synchronous Rectification Evaluation Board User's ManualDescriptionThis evaluation board user’s manual describes a high efficiency synchronous rectification evaluation board that can easily replace a secondary side rectification diode in an SMPS.The NCP4306 is used as synchronous rectification controller. The evaluation board has very few external components and illustrates how small and effective such a design can be.The NCP4306 features a very precise 0 mV turn −off comparator that supports even very low current flowing through the MOSFET even when very low RDSON synchronous MOSFETs is used.NCP4306 can be used in application working in CCM without external synchronization thanks to very low propagation delay and strong driver.Key Features•Precise Turn −off Comparator •Wide Input V oltage Range •High Operation Frequency •Strong MOSFET Driver •High Efficiency•Adjustable Minimum On and Off Times •Adjustable Light Load Detection Feature•Capable to Operate in Positive and Negative Branch •Small SizeTable 1.SMPS TypeSupply VoltageReverse VoltageEffective ResistanceFlyback, QR3.5 − 35 V150 V10 m WEVAL BOARD USER’S MANUALFigure 1. Evaluation Board PhotoCONNECTION DIAGRAMFigure 2. Possible Connections into Circuita)b)The evaluation board can be connected in circuit wherethe rectification diode is in the positive or negative branch.When connection to a positive branch is used, it is necessaryto use an external power supply (or auxiliary winding withrectification) to provide power to the evaluation board. VCCshould be referenced to A1 or A2 points.EVALUATION BOARD SCHEMATICFigure 3. Schematic of the NCP4306The evaluation board was designed to support a minimal external component count implementation. C1 is decoupling capacitor that should be placed as close as possible to the VCC and GND pins. Resistors RMIN_TON and RMIN_TOFF are used to set the protection interval when the synchronous MOSFET is turned on and off. It may be needed to adjust them according to used SMPS. RLLD sets light load detection time and CLLD is optional for LLD voltage decoupling. Components CSNB, RSNB1 and RSNB2 form a snubber circuit.Transistor M1 is 150 V V DS capable with R DSON of 9.3 m W typ@10 V .CIRCUIT LAYOUTThe PCB consists of a 2 layer FR4 board with 35 m m copper cladding. All components are surface mount. Critical component such as blocking capacitor C1 has to be placed carefully near the IC. The synchronous driver path to the MOSFET was done with very low resistance and parasitic inductance to minimize emissions and minimize turn−on and turn−off times. The same is true for the CS pin. For the CS pin, a kelvin contact was done to be able to sense the voltage directly at the drain. Improper connection of the GND and CS connects can impact the turn−off process especially when a very low R DSON MOSFET is used.Figure 4. Top LayerFigure 5. Bottom LayerFigure 6. Top Side ComponentsFigure 7. Bottom Side ComponentsFigure 8. Evaluation Board PhotosBILL OF MATERIALTable 2. BILL OF MATERIAL FOR THE NCP4306 PUT−IN BOARD D2PAK 150 VDesigna-tor Qty Description Value Tolerance Footprint Manufacturer Manufacturer PartNumberSubstitutionAllowedC11Ceramic Capacitor 2.2 m F / 50 V10%1206KEMET C1206C225K5RACTU Yes CLLD1Ceramic Capacitor1n20%0805KEMET C0805C102M5RACTU YesCSNB1Ceramic Capacitor1n25%1206TDKCorporation C3216C0G2J122J085AAYesIC11Secondary SideSynchronousRectificationController NCP4306AADZZZA−SOIC−08ONSemiconductorNCP4306AADZZZADR2GNoM11N−Channel PowerMOSFET FDB110N15A−D2PAK ONSemiconductorFDB110N15A YesRVCC1Resistor SMD 2.2 W1%0805YAGEO RC0805FR−072R2L Yes RLLD1Resistor SMD91 k W1%0805YAGEO RC0805FR−0791KL Yes R MIN_TOFF1Resistor SMD27 k W1%0805YAGEO RC0805FR−0727KL Yes R MIN_TON1Resistor SMD15 k W1%0805YAGEO RC0805FR−0715KL Yes R TRIG_PD1Resistor SMD10 k W1%0805YAGEO RC0805FR−0710KL Yes RSNB11Resistor SMD15 W1%1206YAGEO RC1206FR−0715RL Yes RSNB21Resistor SMD NU−1206−−Yes NOTE:All components are Pb−Free.PUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************ON Semiconductor Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales Representative。
单 双通道焊接重工站商品说明书
/exclusive-brands /exclusive-brandsFeatures• User friendly operator interface and big number display.• Automatic recognition of the tools connected to the rework station.• Three user defined temperature set points.• Two output channels can work at the same time. Only for MP740069.Part Number MP740068MP740069 Rated Working Voltage AC 230V ±10% 50Hz (110V ±10% 60Hz) Rated Power150W200WTemperature Range150°C to 480°C / 302°F to 896°F (Configurable temperature range depends on the connected accessories of the soldering handle)Temperature Accuracy±8°C / ±15°F Temperature Stability±2°C / ±4°FChannels12 Functional Ground Connection 3.5mm plugStand-by and Auto-sleep Mode SupportedDisplay Resolution240 × 160 Dots (white letters on blue) Operating Temperature0°C to +40°C Relative humidity <80% Storage Temperature-20°C to +80°C Relative humidity <80% Dimension315mm (L) ×252mm (W) ×127mm (H) Weight Approximately 4kgAccessories Manual,Power Cord (UK/EU),Iron Stand,130W Soldering Iron (MP740071)Manual, Power Cord (UK/EU),Iron Stand,130W Soldering Iron (MP740071),100W Tweezer type Soldering Iron (MP740073)SpecificationsMP740068MP740069/exclusive-brands /exclusive-brandsImportant Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019.Part Number TableDescriptionPart Number Single Channel Soldering Rework Station, 150W, UK/EU MP740068Dual Channel Soldering Rework Station, 200W, UK/EUMP74006950W Mini Soldering IronMP740070130W Soldering Iron MP740071150W High Power Soldering Iron MP740072100W Tweezer type Soldering IronMP740073Replacement PartsMP740070 - 50W Mini Soldering ironMP740071 - 130W Soldering ironMP740072 - 150W High-power Soldering ironMP740073 - 100W Tweezer type Soldering Iron。
ZVG60W资料
Part Number:
3.0mmx1.5mm SMD CHIP LED LAMP
Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1)
The device has a single mounting surface. The device must be mounted according to the specifications.
Tape Specification (Units : mm)
Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Published Date : FEB 23, 2008 Drawing No : SDSA4502 V4 Checked : B.L.LIU P.3/4
VG (InGaAlP) 2.1 2.5 10
Unit V V uA
λP
574
nm
°C -40 ~ +85
λD
FPN430A资料
500 H FE - CURRENT GAIN 400 300
25° C 125° C
TO-226
0.75
0.5
200 100 0 0.0001
- 40° C
0.25
0 0.001 0.01 0.1 1 I C - COLLECTOR CURRENT (A) 10
0
25
50 75 100 TEMPE RATURE (°C)
125
150
元器件交易网
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
Max
FPN430 / FPN430A 1.0 50 125
Units
W °C/W °C/W
1999 Fairchild Semiconductor Corporation
元器件交易网
FPN430 / FPN430A
PNP Low Saturation Transistor
Parameter
Collector-Emitter Voltage
Value
30 35 5.0 2.0 -55 to +150
Units
V V V A °C
Operating and Storage Junction Temperature Range