SN74AHC541PWG4中文资料

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SN74AHCT1G00DBVT中文资料

SN74AHCT1G00DBVT中文资料

元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. To minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2003, Texas Instruments Incorporated。

MC74HC541中文资料

MC74HC541中文资料

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATIONCENTRAL/SOUTH AMERICA:Spanish Phone:303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)Email:ONlit–spanish@ASIA/PACIFIC: LDC for ON Semiconductor – Asia SupportPhone:303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)Toll Free from Hong Kong & Singapore:001–800–4422–3781Email: ONlit–asia@JAPAN: ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549Phone: 81–3–5740–2745Email: r14525@。

74AHCU04PW中文资料

74AHCU04PW中文资料

PINNING
PIN 1, 3, 5, 9, 11 and 13 2, 4, 6, 8, 10 and 12 7 14
SYMBOL 1A to 6A 1Y to 6Y GND VCC
DESCRIPTION data inputs data outputs ground (0 V) DC supply voltage
• Balanced propagation delays
• All inputs have Schmitt-trigger actions
• Inputs accepts voltages higher than VCC
• Specified from −40 to +85 and +125 °C.
OTHER
25
−40 to +85 −40 to +125 UNIT
VCC (V)
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH
HIGH-level input
voltage
2.0
1.7 −

1.7 −
1.7 −
V
3.0
2.4 −

2.4 −
2.4 −
5.5
4.4 −

4.4 −
for temperature range: −40 to +125 °C; note 2
MIN. MAX. UNIT
−0.5 +7.0 V
−0.5 +7.0 V

−20 mA

±20 mA

±25 mA

±75 mA
−65 +150 °C

74VHC541资料

74VHC541资料

74VHC541OCTAL BUS BUFFERWITH 3STATE OUTPUTS (NON INVERTED)®June 1999s HIGH SPEED:t PD =3.6ns (TYP.)at V CC =5V sLOW POWER DISSIPATION:I CC =4µA (MAX.)at T A =25o C sHIGH NOISE IMMUNITY:V NIH =V NIL =28%V CC (MIN.)s POWER DOWN PROTECTION ON INPUTS sSYMMETRICAL OUTPUT IMPEDANCE:|I OH |=I OL =8mA (MIN)sBALANCED PROPAGATION DELAYS:t PLH ≅t PHLsOPERATING VOLTAGERANGE:V CC (OPR)=2V to 5.5VsPIN AND FUNCTION COMPATIBLE WITH 74SERIES 541s IMPROVED LATCH-UP IMMUNITY sLOW NOISE:V OLP =0.9V(Max.)DESCRIPTIONThe VHC541is an advanced high speed CMOS OCTAL BUS BUFFER (3-STATE)fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOS technology.The 3STATE control gate operates as a two input AND such that if either G1and G2are high,all eight outputs are in the high impedance state.In order to enhance PC board layout,the AC541offers a pinout having inputs and outputs on opposite sides of the package.Power down protection is provided on all inputs and 0to 7V can be accepted on inputs with no regard to the supply voltage.This device can be used to interface 5V to 3V.All inputs and outputs are equipped with protection circuits against static discharge,giving them 2KV ESD immunity and transient excess voltage.PIN CONNECTION AND IEC LOGIC SYMBOLSORDER CODES :74VHC541M 74VHC541TM(Micro Package)T(TSSOP Package)1/8TRUTH TABLEINPUTOUTPUTG1G2An Yn H X X Z X H X Z L L H H LLLLX:”H”or ”L”Z:High impe dancePIN DESCRIPTIONPIN No SYMBOL NAME AND FUNCTION 1,19G1,G2Output Enable Input 2,3,4,5,6,7,8,9A1to A8Data Inputs 18,17,16,15,14,13,12,11Y1to Y8Data Outputs10GND Ground (0V)20V CCPositive Supply VoltageINPUT EQUIVALENT CIRCUITABSOLUTE MAXIMUM RATINGSSymbol ParameterValue Unit V CC Supply Voltage -0.5to +7.0V V I DC Input Voltage -0.5to +7.0V V O DC Output Voltage -0.5to V CC +0.5V I IK DC Input Diode Current -20mA I OK DC Output Diode Current ±20mA I O DC Output Current ±25mA I CC orI GN DDC V CC or Ground Current ±75mAT stg Storage Temperature -65to +150o C T LLead Temperature (10sec)300oCAbsolute Maximum Ratingsarethose values beyond which dam age to the device may occur.Functional operation un der these condition is not implied.RECOMMENDED OPERATING CONDITIONSSymbol ParameterValue Unit V CC Supply Voltage 2.0to 5.5V V I Input Voltage 0to 5.5V V O Output Voltage 0to V CC VT op Operating Temperature-40to+85oCdt/dvInput Rise and Fall Time (see note 1)(V CC =3.3±0.3V)(V CC =5.0±0.5V)0to 1000to 20ns/V ns/V1)V IN from 30%to70%of V CC74VHC5412/8AC ELECTRICAL CHARACTERISTICS (Input t r =t f =3ns)SymbolParameterTest Condition ValueUnitV CC (V)C L (pF)T A =25oC-40to 85oCMin.Typ.Max.Min.Max.t PLH t PHL Propagation Delay Time3.3(*)15 5.07.0 1.08.5ns3.3(*)507.510.5 1.012.05.0(**)15 3.5 5.0 1.0 6.05.0(**)50 5.07.01.08.0t PZL t PZHOutput Enable Time3.3(*)15R L =1K Ω 6.810.5 1.012.5ns3.3(*)50R L =1K Ω9.314.0 1.016.05.0(**)15R L =1K Ω 4.77.2 1.08.55.0(**)50R L =1K Ω6.29.2 1.010.5t PL Z t PH Z Output Disable Time 3.3(*)50R L =1K Ω11.215.4 1.017.5ns 5.0(**)50R L =1K Ω6.08.8 1.010.0t OSLH t OSHLOutput to Output Skew Time (note 1)3.3(*)50 1.5 1.5ns5.0(**)501.01.0(*)Voltag e range is 3.3V ±0.3V (**)Voltage range is 5V ±0.5VNote 1:Parameter guaranteed bydesign.t soLH =|t pLHm -t pLHn |,t soHL =|t pHLm -t pHLn |DC SPECIFICATIONSSymbolParameterTest Conditions ValueUnitV CC (V)T A =25oC -40to 85oC Min.Typ.Max.Min.Max.V IH High Level Input Voltage 2.0 1.5 1.5V 3.0to 5.50.7V CC0.7V CCV IL Low Level Input Voltage2.00.50.5V3.0to 5.50.3V CC0.3V CC V OHHigh Level Output Voltage2.0I O =-50µA 1.9 2.0 1.9V3.0I O =-50µA 2.9 3.0 2.94.5I O =-50µA 4.4 4.54.43.0I O =-4mA 2.58 2.484.5I O =-8mA 3.943.8V OLLow Level Output Voltage2.0I O =50µA 0.00.10.1V3.0I O =50µA 0.00.10.14.5I O =50µA 0.00.10.13.0I O =4mA 0.360.444.5I O =8mA 0.360.44I OZHigh Impedance Output Leakage Current5.5V I =V IH orV IL V O =V CC orGND ±0.25±2.5µAI I Input Leakage Current 0to 5.5V I =5.5V or GND ±0.1±1.0µA I CCQuiescent Supply Current5.5V I =V CC orGND440µA74VHC5413/8CAPACITIVE CHARACTERISTICSSymbolParameterTest ConditionsValueUnitT A =25oC -40to 85oC Min.Typ.Max.Min.Max.C IN Input Capacitance 41010pF C OUT Output Capacitance 6pF C PDPower Dissipation Capacitance (note 1)18pF1)C PD isdefined as the value of the IC’sinternal equiva lent capacitance which is calculated fromthe operating current consumption without load.(Referto Test Circuit).Average operating current can be obtained bythe following equation.I CC (opr)=C PD •V CC •f IN +I CC /8(per Circuit)TEST CIRCUITTESTSWITCH t PLH ,t PHL Open t PZL ,t PLZ V CC t PZH ,t PHZGNDC L =15/50pF or equ ivalent (includes jigand probe capacitance)R L =R 1=1K ΩorequivalentR T =Z OU T of pulse generator (typ ically 50Ω)DYNAMIC SWITCHING CHARACTERISTICSSymbolParameterTest Conditions ValueUnitV CC (V)T A =25oC -40to 85oC Min.Typ.Max.Min.Max.V OLP Dynamic Low Voltage Quiet Output (note 1,2) 5.0C L =50pF0.60.9VV OLV -0.9-0.6V IHD Dynamic High Voltage Input (note 1,3) 5.0 3.5V ILDDynamic Low Voltage Input (note 1,3)5.01.51)Worst case package.2)Max num ber of outputs defined as (n).Data inputs aredriven 0V to 5.0V,(n -1)outputs switching and one out put at GND.3)Max num ber of data inputs (n)switching.(n-1)switching 0V to5.0V.Inputs under test switching:5.0V to threshold (V ILD ),0V to threshold (V IHD ),f=1MHz.74VHC5414/874VHC541 WAVEFORM1:PROPAGATION DELAYS(f=1MHz;50%duty cycle)WAVEFORM2:OUTPUT ENABLE AND DISABLE TIME(f=1MHz;50%duty cycle)5/8DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.a10.2540.010B 1.391.650.0550.065b 0.450.018b10.250.010D 25.41.000E 8.50.335e2.540.100e322.860.900F 7.10.280I 3.930.155L 3.30.130Z1.340.053P001JPlastic DIP-20(0.25)MECHANICAL DATA74VHC5416/8DIM.mm inch MIN.TYP.MAX.MIN.TYP.MAX.A 2.650.104a10.100.200.0040.007a2 2.450.096b 0.350.490.0130.019b10.230.320.0090.012C 0.500.020c145(typ.)D 12.6013.000.4960.512E 10.0010.650.3930.419e 1.270.050e311.430.450F 7.407.600.2910.299L 0.50 1.270.190.050M 0.750.029S8(max.)P013LSO-20MECHANICAL DATA74VHC5417/874VHC541Information furnished is believed to be accurate and reliable.However,STMicroelectronics assumes no responsibility for the consequence s of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics.Specification mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a trademark of STMicroelectronics©1999STMicroelectronics–Printed in Italy–All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia-Brazil-Canada-China-France-Germany-Italy-Japan-Korea-Malaysia-Malta-Mexico-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A..8/8。

74AHCT541PW中文资料

74AHCT541PW中文资料

MIN. MAX. UNIT
−0.5 +7.0 V
−0.5 +7.0 V

−20 mA

±20 mA

±25 mA

±75 mA
−65 +150 °C

500 mW
Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO-package: above 70 °C the value of PD derates linearly with 8 mW/K.
• Balanced propagation delays • All inputs have a Schmitt-trigger action • Inputs accepts voltages higher than VCC • For AHC only: operates with CMOS input levels • For AHCT only: operates with TTL input levels • Specified from −40 to +85 °C and −40 to +125 °C.
OFF-state current
ICC
quiescent supply
current
CI
input capacitance
TEST CONDITIONS
Tamb (°C)
OTHER
25
−40 to +85 −40 to +125 UNIT

74hc541中文资料

74hc541中文资料

74HC541 8路缓冲器/线路驱动器具备74HC240所有的功能,并且把输入引脚和输出引脚分布在封装的两边,这就极大方便了印刷电路板的布线。

1.74hc541中文资料
74HC541 8路缓冲器/线路驱动器具备74HC240所有的功能,并且把输入引脚和输出引脚分布在封装的两边,这就极大方便了印刷电路板的布线。

74HC541的三态输出由一个两输入或非门控制。

当任一个输出使能端(OE1或OE2)为高时,八个输出端将进入高阻态。

74HC541器件的输出为原码数据。

该7HC/HCT54是八进制非反相缓冲器/线路,具有三态输出的驱动器。

三态输出是由输出使能输入OE1和OE2控制。

OEN高导致输出呈现高电平。

阻抗呈关闭状态,“541”与“540”相同,但具有非反相输出。

2.74hc541引脚图及功能
SN74HC541能够完成两侧输入的封装和输引脚的排列与输出的功能,通俗的说,就是可以完成三态输出的八线路缓冲器和线路驱动器。

SN54HC541引脚配置和功能
OE1 :输出使能(低电平有效)两个OE必须为低电平才能使能输出
A1:通道1输入,A2 :通道2输入,A3:通道3输入,A4:通道4输入,A5:通道5输入,A6:通道6输入,A7:通道7输入,A8:通道8输入。

GND:【地】
Y8 :通道8输出,Y7 :通道7输出,Y6 :通道6输出,Y5 :通道5输出,Y4 :通道4输出,Y3 :通道3输出,Y2 :通道2输出,Y1 :通道1输出。

OE2 :输出使能(低电平有效)OE必须为低电平才能使能输出。

VCC :电源引脚。

SN74AHCT14NSRG4中文资料

SN74AHCT14NSRG4中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9680101Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9680101QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9680101QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9680101VCA ACTIVE CDIP J141TBD Call TI Call TI5962-9680101VDA ACTIVE CFP W141TBD Call TI Call TISN74AHCT14D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74AHCT14DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT14NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT14PWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74AHCT14PWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT14RGYR ACTIVE QFN RGY141000Green(RoHS&CU NIPDAU Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SNJ54AHCT14FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54AHCT14W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

74HCT541PW中文资料

74HCT541PW中文资料

74HCT541PW中文资料DATA SHEETProduct speci?cationFile under Integrated Circuits, IC06December 1990INTEGRATED CIRCUITS74HC/HCT541Octal buffer/line driver; 3-stateFor a complete data sheet, please also download:The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications ?The IC06 74HC/HCT/HCU/HCMOS Logic Package Information ?The IC06 74HC/HCT/HCU/HCMOS Logic Package OutlinesFEATURESNon-inverting outputs ?Output capability: bus driver ?I CC category: MSI GENERAL DESCRIPTIONThe 74HC/HCT541 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A.The 74HC/HCT541 are octal non-inverting buffer/line drivers with 3-state outputs. The 3-state outputs are controlled by the output enable inputs OE 1and OE 2.A HIGH on OE n causes the outputs to assume a high impedance OFF-state.The “541” is identical to the “540” but has non-inverting outputs.QUICK REFERENCE DATAGND = 0 V; T amb = 25°C; t r = t f = 6 ns Notes1.C PD is used to determine the dynamic power dissipation (P D in μW):P D = C PD ×V CC 2×f i +∑(C L ×V CC 2×f o )where:f i = input frequency in MHz f o = output frequency in MHz ∑(C L ×V CC 2×f o )= sum of outputs C L =output load capacitance in pF V CC =supply voltage in V2.For HC the condition is V I = GND to V CCFor HCT the condition is V I = GND to V CC ?1.5 V ORDERING INFORMATIONSee “74HC/HCT/HCU/HCMOS Logic Package Information”.SYMBOL PARAMETERCONDITIONSTYPICAL UNIT HCHCT t PHL / t PLH propagation delay A n to Y n C L = 15 pF; V CC = 5 V1012ns C I input capacitance3.5 3.5pF C PD power dissipation capacitance per buffer notes 1and 23739pFPIN DESCRIPTIONPIN NO.SYMBOL NAME AND FUNCTION1, 19OE1,OE2output enable input (active LOW)2, 3, 4, 5, 6, 7, 8, 9A0to A7data inputs10GND ground (0 V)18, 17, 16, 15, 14, 13, 12, 11Y0to Y7bus outputs20V CC positive supply voltageFig.1 Pin configuration.Fig.2 Logic symbol.Fig.3 IEC logic symbol.Fig.4 Functional diagram.FUNCTION TABLENotes1.H = HIGH voltage levelL= LOW voltage levelX=don’t careZ=high impedance OFF-stateINPUTS OUTPUTOE1OE2A n Y nLLXHLLHXLHXXLHZZ Fig.5 Logic diagram.DC CHARACTERISTICS FOR 74HCFor the DC characteristics see“74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: bus driverI CC category: MSIAC CHARACTERISTICS FOR 74HCGND = 0 V; t r= t f= 6 ns; C L= 50 pFSYMBOL PARAMETERT amb(°C)UNITTEST CONDITIONS74HCV CC(V)WAVEFORMS +25?40to+85?40to+125 min.typ.max.min.max.min.max.t PHL/ t PLH propagation delayA n to Y n 331210115232014529251753530ns 2.04.56.0Fig.6t PZH/ t PZL3-state outputenable timeOE to Y n 552016322720040342404841ns 2.04.56.0Fig.7t PHZ/ t PLZ3-state output disable timeOE to Y n 612218160322720040342404841ns 2.04.56.0t THL/ t TLH output transition time1454601210751513901815ns 2.04.56.0Fig.6DC CHARACTERISTICS FOR 74HCTFor the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.Output capability: bus driver I CC category: MSI Note to HCT typesThe value of additional quiescent supply current (?I CC )for a unit load of 1 is given in the family specifications.To determine ?I CC per input, multiply this value by the unit load coefficient shown in the table below.AC CHARACTERISTICS FOR 74HCT GND = 0 V; t r = t f = 6 ns;C L = 50 pFINPUT UNIT LOAD COEFFICIENT OE 1OE 2A n1.501.000.70SYMBOL PARAMETERT amb (°C)TEST CONDITIONS 74HCTV CC(V)WAVEFORMS +2540to +8540to +125min.typ.max.min.max.min.max.t PHL / t PLH propagation delay A n to Y n15283542ns 4.5Fig.6t PZH / t PZL 3-state output enable time OE to Y n21354453ns 4.5Fig.7t PHZ / t PLZ 3-state output disable time OE to Y n21354453ns 4.5Fig.7t THL / t TLHoutput transition time5121518ns4.5Fig.6AC WAVEFORMS(1)HC : V M=50%; V I= GND to V CC.HCT:V M = 1.3V; V I= GND to 3 V.Fig.6 Waveforms showing the input (A n)to output (Y n)propagation delays and the output transition times.(1)HC : V M=50%; V I= GND to V CC.HCT:V M= 1.3V; V I= GND to 3 V.Fig.7 Waveforms showing the 3-state enable and disabletimes.PACKAGE OUTLINESSee“74HC/HCT/HCU/HCMOS Logic Package Outlines”.。

SN74AHC1G04_08中文资料

SN74AHC1G04_08中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74AHC1G04DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DBVRE4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DBVTE4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DCKR ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DCKRE4ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DCKRG4ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DCKT ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DCKTE4ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DCKTG4ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DRLR ACTIVE SOT DRL54000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G04DRLRG4ACTIVE SOT DRL54000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC1G04DBVR SOT-23DBV 53000178.09.0 3.23 3.17 1.37 4.08.0Q3SN74AHC1G04DBVR SOT-23DBV 53000180.09.2 3.23 3.17 1.37 4.08.0Q3SN74AHC1G04DBVT SOT-23DBV 5250180.09.2 3.23 3.17 1.37 4.08.0Q3SN74AHC1G04DCKR SC70DCK 53000180.09.2 2.24 2.34 1.22 4.08.0Q3SN74AHC1G04DCKR SC70DCK 53000180.09.2 2.24 2.34 1.22 4.08.0Q3SN74AHC1G04DCKT SC70DCK 5250180.09.2 2.24 2.34 1.22 4.08.0Q3SN74AHC1G04DCKT SC70DCK 5250180.09.2 2.24 2.34 1.22 4.08.0Q3SN74AHC1G04DRLRSOTDRL54000180.09.21.781.780.694.08.0Q3*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74AHC1G04DBVR SOT-23DBV53000180.0180.018.0 SN74AHC1G04DBVR SOT-23DBV53000205.0200.033.0 SN74AHC1G04DBVT SOT-23DBV5250205.0200.033.0 SN74AHC1G04DCKR SC70DCK53000205.0200.033.0 SN74AHC1G04DCKR SC70DCK53000202.0201.028.0 SN74AHC1G04DCKT SC70DCK5250205.0200.033.0 SN74AHC1G04DCKT SC70DCK5250202.0201.028.0 SN74AHC1G04DRLR SOT DRL54000202.0201.028.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。

SN74AHC541PWRG4中文资料

SN74AHC541PWRG4中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9685701Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9685701QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9685701QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC541DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC541DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC541NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC541NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWLE OBSOLETE TSSOP PW 20TBDCall TI Call TISN74AHC541PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC541FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC541J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC541WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in29-Jun-2006a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.29-Jun-2006TAPE AND REELINFORMATION30-Apr-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC541DBR DB 20MLA 330168.27.5 2.51216Q1SN74AHC541DGVR DGV 20MLA 330127.0 5.6 1.6812Q1SN74AHC541DWR DW 20MLA 3302410.813.0 2.71224Q1SN74AHC541NSR NS 20MLA 330248.213.0 2.51224Q1SN74AHC541PWRPW20MLA330166.957.11.6816Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74AHC541DBR DB 20MLA 333.2333.228.58SN74AHC541DGVR DGV 20MLA 338.1340.520.64SN74AHC541DWR DW 20MLA 333.2333.231.75SN74AHC541NSR NS 20MLA 333.2333.231.75SN74AHC541PWRPW20MLA333.2333.228.5830-Apr-2007PACKAGE MATERIALS INFORMATION30-Apr-2007Pack Materials-Page3元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements,and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarilyperformed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products andapplications using TI components.To minimize the risks associated with customer products and applications,customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,maskwork right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or servicesare rmation published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement e of such information may require a license from a third party underthe patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is anunfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreementspecifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding anyapplications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet militaryspecifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74AHCT541中文资料

SN74AHCT541中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9685801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9685801QRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-9685801QSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN74AHCT541DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74AHCT541DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT541PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74AHCT541PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54AHCT541FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54AHCT541W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74AHC1GU04中文资料

SN74AHC1GU04中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74AHC1GU04DBVRG4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AHC1GU04DBVTE4ACTIVE SOT-23DBV 5250Pb-Free (RoHS)CU NIPDAU Level-1-260C-UNLIM 74AHC1GU04DCKRG4ACTIVE SC70DCK 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AHC1GU04DCKTG4ACTIVE SC70DCK 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC1GU04DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC1GU04DBVT ACTIVE SOT-23DBV 5250Pb-Free (RoHS)CU NIPDAU Level-1-260C-UNLIM SN74AHC1GU04DCKR ACTIVE SC70DCK 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC1GU04DCKT ACTIVE SC70DCK 5250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC1GU04DRLRACTIVESOPDRL54000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM8-Aug-2005Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74AHC14DG4中文资料

SN74AHC14DG4中文资料

IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9680201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9680201QCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type 5962-9680201QDA ACTIVE CFP W 141TBD A42N /A for Pkg Type 5962-9682001QCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type 5962-9682001QDA ACTIVE CFP W 141TBD A42N /A for Pkg Type SN74AHC14D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DBLE OBSOLETE SSOP DB 14TBDCall TI Call TISN74AHC14DBR ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DBRE4ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DBRG4ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DGVR ACTIVE TVSOP DGV 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DGVRE4ACTIVE TVSOP DGV 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DGVRG4ACTIVE TVSOP DGV 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14DRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC14NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC14NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14NSRG4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14PW ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14PWE4ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14PWG4ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14PWLE OBSOLETE TSSOP PW 14TBDCall TI Call TISN74AHC14PWR ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14PWRE4ACTIVETSSOPPW142000Green (RoHS &CU NIPDAULevel-1-260C-UNLIM28-May-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)SN74AHC14PWRG4ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC14RGYR ACTIVE QFN RGY 141000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74AHC14RGYRG4ACTIVE QFN RGY 141000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SNJ54AHC08J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SNJ54AHC08W ACTIVE CFP W 141TBD A42N /A for Pkg Type SNJ54AHC14FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeSNJ54AHC14J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SNJ54AHC14WACTIVECFPW141TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based dieadhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.28-May-2007TAPE AND REELINFORMATION16-Jun-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC14DBR DB 14MLA 330168.2 6.6 2.51216Q1SN74AHC14DGVR DGV 14MLA 33012 6.8 4.0 1.6816Q1SN74AHC14DR D 14FMX 33016 6.59.0 2.1816Q1SN74AHC14DR D 14MLA 33016 6.59.0 2.1816Q1SN74AHC14NSR NS 14MLA 330168.210.5 2.51216Q1SN74AHC14PWR PW 14MLA 330127.0 5.6 1.6812Q1SN74AHC14RGYRRGY14MLA180123.853.851.35812Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74AHC14DBR DB 14MLA 342.9336.628.58SN74AHC14DGVR DGV 14MLA 342.9336.620.64SN74AHC14DR D 14FMX 342.9336.628.58SN74AHC14DR D 14MLA 342.9336.628.58SN74AHC14NSR NS 14MLA 342.9336.628.58SN74AHC14PWR PW 14MLA 342.9336.620.64SN74AHC14RGYRRGY14MLA190.0212.731.7516-Jun-2007PACKAGE MATERIALS INFORMATION16-Jun-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74HC08PWTG4中文资料

SN74HC08PWTG4中文资料

2
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元器件交易网

Recommended Operating Conditions(1)
SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007
VCC Supply voltage VIH High-level input voltage
VIL Low-level input voltage VI Input voltage VO Output voltage ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature
(TOP VIEW)
SN54HC04...FK PACKAGE (TOP VIEW)
4B
VCC
NC
1A
1B
1A 1 1B 2 1Y 3 2A 4 2B 5 2Y 6 GND 7
14 VCC 13 4B 12 4A 11 4Y 10 3B 9 3A 8 3Y
3 2 1 20 19
1Y 4
18 4A
NC 5
VCC = 2 V VCC = 4.5 V VCC = 6 V VCC = 2 V VCC = 4.5 V VCC = 6 V
VCC = 2 V VCC = 4.5 V VCC = 6 V
SN54HC08
MIN NOM
2
5
1.5
3.15
4.2
0 0
–55
MAX 6
0.5 1.35

SN74HC541数据手册

SN74HC541数据手册

IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third–party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Mailing Address:Texas InstrumentsPost Office Box 655303Dallas, Texas 75265Copyright 2002, Texas Instruments Incorporated。

74AHC541PW中文资料

74AHC541PW中文资料
For TSSOP-package: above 60 °C the value of PD derates linearly with 5.5 mW/K.
1999 Nov 24
5
元器件交易网
Philips Semiconductors
Octal buffer/line driver; 3-state
PINS 20 20 20 20
PACKAGES
PACKAGE
MATERIAL
SO TSSOP
SO TSSOP
plastic plastic plastic plastic
CODE SOT163-1 SOT360-1 SOT163-1 SOT360-1
PINNING
PIN 1 2, 3, 4, 5, 6, 7, 8 and 9 10 11, 12, 13, 14, 15, 16, 17 and 18 19 20
MIN. MAX. UNIT
−0.5 +7.0 V
−0.5 +7.0 V

−20 mA

±20 mA

±25 mA

±75 mA
−65 +150 °C

500 mW
Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO-package: above 70 °C the value of PD derates linearly with 8 mW/K.
OFF-state current

SN74LS541DW中文资料

SN74LS541DW中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)84155012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8415501RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 8415501RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 8415501SA OBSOLETE20TBD Call TI Call TI8415501SA OBSOLETE20TBD Call TI Call TI84156012A OBSOLETE LCCC FK20TBD Call TI Call TI84156012A OBSOLETE LCCC FK20TBD Call TI Call TI8415601SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC 8415601SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32404B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32404B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32404BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32404BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32405B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32405B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32405BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32405BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32405BSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32405BSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN54LS540J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS540J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN74LS540DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS540DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS540N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS540N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS540N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS540NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS540NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS540NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS540NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS541N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS541N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS541N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS541NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS541NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS541NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS541NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSNJ54LS540FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ54LS540FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS540J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS540J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS540W OBSOLETE20TBD Call TI Call TISNJ54LS540W OBSOLETE20TBD Call TI Call TISNJ54LS541FK OBSOLETE LCCC FK20TBD Call TI Call TISNJ54LS541FK OBSOLETE LCCC FK20TBD Call TI Call TISNJ54LS541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS541W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54LS541W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74AHC1G08DBVTG4资料

SN74AHC1G08DBVTG4资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74AHC1G08DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVRE4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVTE4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKR ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKRE4ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKRG4ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKT ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKTE4ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKTG4ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DRLR ACTIVE SOT DRL54000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DRLRG4ACTIVE SOT DRL54000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is 22-Oct-2007provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.22-Oct-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC1G08DBVR DBV 5SITE 341809 3.23 3.17 1.3748Q3SN74AHC1G08DBVR DBV 5SITE 4500 3.23 3.17 1.3748Q3SN74AHC1G08DBVT DBV 5SITE 341809 3.23 3.17 1.3748Q3SN74AHC1G08DBVT DBV 5SITE 453301610.615.8 4.91624Q3SN74AHC1G08DCKR DCK 5SITE 341809 2.24 2.34 1.2248Q3SN74AHC1G08DCKR DCK 5SITE 4500 2.4 2.5 1.248Q3SN74AHC1G08DCKT DCK 5SITE 341809 2.24 2.34 1.2248Q3SN74AHC1G08DCKT DCK 5SITE 4500 2.4 2.5 1.248Q3SN74AHC1G08DRLRDRL5SITE 3518091.781.780.6948Q316-Nov-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC1G08DBVR DBV 5SITE 34205.0200.033.0SN74AHC1G08DBVR DBV 5SITE 450.0185.0220.0SN74AHC1G08DBVT DBV 5SITE 34201.0192.026.0SN74AHC1G08DBVT DBV 5SITE 450.00.00.0SN74AHC1G08DCKR DCK 5SITE 34205.0200.033.0SN74AHC1G08DCKR DCK 5SITE 450.0185.0220.0SN74AHC1G08DCKT DCK 5SITE 34201.0192.026.0SN74AHC1G08DCKT DCK 5SITE 450.0185.0220.0SN74AHC1G08DRLRDRL5SITE 35202.0201.028.016-Nov-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

74系列功能大全(中文)

74系列功能大全(中文)

74系列功能大全(中文)74、74HC、74LS系列芯片资料,从网上下的,集合了一下系列电平典型传输延迟ns 最大驱动电流(-Ioh/Lol)mAAHC CMOS 8.5 -8/8AHCT COMS/TTL 8.5 -8/8HC COMS 25 -8/8HCT COMS/TTL 25 -8/8ACT COMS/TTL 10 -24/24F TTL 6.5 -15/64ALS TTL 10 -15/64LS TTL 18 -15/24注:同型号的74系列、74HC系列、74LS系列芯片,逻辑功能上是一样的。

74LSxx的使用说明如果找不到的话,可参阅74xx或74HCxx的使用说明。

有些资料里包含了几种芯片,如74HC161资料里包含了74HC160、74HC161、74HC162、74HC163四种芯片的资料。

找不到某种芯片的资料时,可试着查看一下临近型号的芯片资料。

7400 QUAD 2-INPUT NAND GATES 与非门7401 QUAD 2-INPUT NAND GATES OC 与非门7402 QUAD 2-INPUT NOR GATES 或非门7403 QUAD 2-INPUT NAND GATES 与非门7404 HEX INVERTING GATES 反向器7406 HEX INVERTING GATES HV 高输出反向器7408 QUAD 2-INPUT AND GATE 与门7409 QUAD 2-INPUT AND GATES OC 与门7410 TRIPLE 3-INPUT NAND GATES 与非门7411 TRIPLE 3-INPUT AND GATES 与门74121 ONE-SHOT WITH CLEAR 单稳态74132 SCHMITT TRIGGER NAND GATES 触发器与非门7414 SCHMITT TRIGGER INVERTERS 触发器反向器74153 4-LINE TO 1 LINE SELECTOR 四选一74155 2-LINE TO 4-LINE DECODER 译码器74180 PARITY GENERATOR/CHECKER 奇偶发生检验74191 4-BIT BINARY COUNTER UP/DOWN 计数器7420 DUAL 4-INPUT NAND GATES 双四输入与非门7426 QUAD 2-INPUT NAND GATES 与非门7427 TRIPLE 3-INPUT NOR GATES 三输入或非门7430 8-INPUT NAND GATES 八输入端与非门7432 QUAD 2-INPUT OR GATES 二输入或门7438 2-INPUT NAND GATE BUFFER 与非门缓冲器7445 BCD-DECIMAL DECODER/DRIVER BCD译码驱动器7474 D-TYPE FLIP-FLOP D型触发器7475 QUAD LATCHES 双锁存器7476 J-K FLIP-FLOP J-K触发器7485 4-BIT MAGNITUDE COMPARATOR 四位比较器7486 2-INPUT EXCLUSIVE OR GATES 双端异或门74HC00 QUAD 2-INPUT NAND GATES 双输入与非门74HC02 QUAD 2-INPUT NOR GATES 双输入或非门74HC03 2-INPUT OPEN-DRAIN NAND GATES 与非门74HC04 HEX INVERTERS 六路反向器74HC05 HEX INVERTERS OPEN DRAIN 六路反向器74HC08 2-INPUT AND GATES 双输入与门74HC107 J-K FLIP-FLOP WITH CLEAR J-K触发器74HC109A J-K FLIP-FLOP W/PRESET J-K触发器74HC11 TRIPLE 3-INPUT AND GATES 三输入与门74HC112 DUAL J-K FLIP-FLOP 双J-K触发器74HC113 DUAL J-K FLIP-FLOP PRESET 双JK触发器74HC123A RETRIGGERABLE MONOSTAB 可重触发单稳74HC125 TRI-STATE QUAD BUFFERS 四个三态门74HC126 TRI-STATE QUAD BUFFERS 六三态门74HC132 2-INPUT TRIGGER NAND 施密特触发与非门74HC133 13-INPUT NAND GATES 十三输入与非门74HC137 3-TO-8 DECODERS W/LATCHES 3-8线译码器74HC138 3-8 LINE DECODER 3线至8线译码器74HC139 2-4 LINE DECODER 2线至4线译码器74HC14 TRIGGERED HEX INVERTER 六触发反向器74HC147 10-4 LINE PRIORITY ENCODER 10-4编码器74HC148 8-3 LINE PRIORITY ENCODER 8-3编码器74HC149 8-8 LINE PRIORITY ENCODER 8-8编码器74HC151 8-CHANNEL DIGITAL MUX 8通道多路器74HC153 DUAL 4-INPUT MUX 双四输入多路器74HC154 4-16 LINE DECODER 4线至16线译码器74HC155 2-4 LINE DECODER 2线至4线译码器74HC157 QUAD 2-INPUT MUX 四个双端多路器74HC161 BINARY COUNTER 二进制计数器74HC163 DECADE COUNTERS 十进制计数器74HC164 SERIAL-PARALLEL SHIFT REG 串入并出74HC165 PARALLEL-SERIAL SHIFT REG 并入串出74HC166 SERIAL-PARALLEL SHIFT REG 串入并出74HC173 TRI-STATE D FLIP-FLOP 三态D触发器74HC174 HEX D FLIP-FLOP W/CLEAR 六D触发器74HC175 HEX D FLIP-FLOP W/CLEAR 六D触发器74HC181 ARITHMETIC LOGIC UNIT 算术逻辑单元74HC182 LOOK AHEAD CARRYGENERATR 进位发生器74HC190 BINARY UP/DN COUNTER 二进制加减计数器74HC191 DECADE UP/DN COUNTER 十进制加减计数器74HC192 DECADE UP/DN COUNTER 十进制加减计数器74HC193 BINARY UP/DN COUNTER 二进制加减计数器74HC194 4BIT BI-DIR SHIFT 4位双向移位寄存器74HC195 4BIT PARALLEL SHIFT 4位并行移位寄存器74HC20 QUAD 4-INPUT NAND GATE 四个四入与非门74HC221A NON-RETRIG MONOSTAB 不可重触发单稳74HC237 3-8 LINE DECODER 地址锁3线至8线译码器74HC242/243 TRI-STAT TRANSCEIVER 三态收发器74HC244 OCTAL 3-STATE BUFFER 八个三态缓冲门74HC245 OCTAL 3-STATE TRANSCEIVER 三态收发器74HC251 8-CH 3-STATE MUX 8路3态多路器74HC253 DUAL 4-CH 3-STATE MUX 4路3态多路器74HC257 QUAD 2-CH 3-STATE MUX 4路3态多路器74HC258 2-CH 3-STATE MUX 2路3态多路器74HC259 3-8 LINE DECODER 8位地址锁存译码器74HC266A 2-INPUT EXCLUSIVE NOR GATE 异或非74HC27 TRIPLE 3-INPUT NOR GATE三个3输入或非门74HC273 OCTAL D FLIP-FLOP CLEAR 8路D触发器74HC280 9BIT ODD/EVEN GENERATOR 奇偶发生器74HC283 4BIT BINARY ADDER CARRY 四位加法器74HC299 3-STATE UNIVERSAL SHIFT 三态移位寄存74HC30 8-INPUT NAND GATE 8输入端与非门74HC32 QUAD 2-INPUT OR GATE 四个双端或门74HC34 NON-INVERTER 非反向器74HC354 8-CH 3-STATE MUX 8路3态多路器74HC356 8-CH 3-STATE MUX 8路3态多路器74HC365 HEX 3-STATE BUFFER 六个三态缓冲门74HC366 3-STATE BUFFER INVERTER 缓冲反向器74HC367 3-STATE BUFFER INVERTER 缓冲反向器74HC368 3-STATE BUFFER INVERTER 缓冲反向器74HC373 3-STATE OCTAL D LATCHES 三态D型锁存器74HC374 3-STATE OCTAL D FLIPFLOP 三态D触发器74HC393 4-BIT BINARY COUNTER 4位二进制计数器74HC4016 QUAD ANALOG SWITCH 四路模拟量开关74HC4020 14-Stage Binary Counter 14输出计数器74HC4017 Decade Counter/Divider with 10 Decoded Outputs 十进制计数器带10个译码输出端74HC4040 12 Stage Binary Counter 12出计数器74HC4046 PHASE LOCK LOOP 相位监测输出器74HC4049 LEVEL DOWN CONVERTER 电平变低器74HC4050 LEVEL DOWN CONVERTER 电平变低器74HC4051 8-CH ANALOG MUX 8通道多路器74HC4052 4-CH ANALOG MUX 4通道多路器74HC4053 2-CH ANALOG MUX 2通道多路器74HC4060 14-STAGE BINARY COUNTER 14阶BIN计数74HC4066 QUAD ANALOG MUX 四通道多路器74HC4075 TRIPLE 3-INPUT OR GATE 3输入或门74HC42 BCD TO DECIMAL BCD转十进制译码器74HC423A RETRIGGERABLE MONOSTAB 可重触发单稳74HC4511 BCD-7 SEG DRIVER/DECODER 7段译码器74HC4514 4-16 LINE DECODER 4至16线译码器74HC4538A RETRIGGERAB MONOSTAB 可重触发单稳74HC4543 LCD BCD-7 SEG LCD用的BCD-7段译码驱动74HC51 AND OR GATE INVERTER 与或非门74HC521 8BIT MAGNITUDE COMPARATOR 判决定路74HC533 3-STATE D LATCH 三态D锁存器74HC534 3-STATE D FLIP-FLOP 三态D型触发器74HC540 3-STATE BUFFER 三态缓冲器74HC541 3-STATE BUFFER INVERTER三态缓冲反向器74HC58 DUAL AND OR GATE 与或门74HC589 3STATE 8BIT SHIFT 8位移位寄存三态输出74HC594 8BIT SHIFT REG 8位移位寄存器74HC595 8BIT SHIFT REG 8位移位寄存器出锁存74HC597 8BIT SHIFT REG 8位移位寄存器入锁存74HC620 3-STATE TRANSCEIVER 反向3态收发器74HC623 3-STATE TRANSCEIVER 八路三态收发器74HC640 3-STATE TRANSCEIVER 反向3态收发器74HC643 3-STATE TRANSCEIVER 八路三态收发器74HC646 NON-INVERT BUS TRANSCEIVER 总线收发器74HC648 INVERT BUS TRANCIVER 反向总线收发器74HC688 8BIT MAGNITUDE COMPARATOR 8位判决电路74HC7266 2-INPUT EXCLUSIVE NOR GATE 异或非门74HC73 DUAL J-K FLIP-FLOP W/CLEAR 双JK触发器74HC74A PRESET/CLEAR D FLIP-FLOP 双D触发器74HC75 4BIT BISTABLE LATCH 4位双稳锁存器74HC76 PRESET/CLEAR JK FLIP-FLOP 双JK触发器74HC85 4BIT MAGNITUDE COMPARATOR 4位判决电路74HC86 2INPUT EXCLUSIVE OR GATE 2输入异或门74HC942 BAUD MODEM 300BPS低速调制解调器74HC943 300 BAUD MODEM 300BPS低速调制解调器74LS00 QUAD 2-INPUT NAND GATES 与非门74LS02 QUAD 2-INPUT NOR GATES 或非门74LS03 QUAD 2-INPUT NAND GATES 与非门74LS04 HEX INVERTING GATES 反向器74LS05 HEX INVERTERS OPEN DRAIN 六路反向器74LS08 QUAD 2-INPUT AND GATE 与门74LS09 QUAD 2-INPUT AND GATES OC 与门74LS10 TRIPLE 3-INPUT NAND GATES 与非门74LS109 QUAD 2-INPUT AND GATES OC 与门74LS11 TRIPLE 3-INPUT AND GATES 与门74LS112 DUAL J-K FLIP-FLOP 双J-K触发器74LS113 DUAL J-K FLIP-FLOP PRESET 双JK触发器74LS114 NEGATIVE J-K FLIP-FLOP 负沿J-K触发器74LS122 Retriggerable Monostab 可重触发单稳74LS123 Retriggerable Monostable 可重触发单稳74LS125 TRI-STATE QUAD BUFFERS 四个三态门74LS13 QUAL 4-in NAND TRIGGER 4输入与非触发器74LS160 BCD DECADE 4BIT BIN COUNTERS 计数器74LS136 QUADRUPLE 2-INPUT XOR GATE 异或门74LS138 3-8 LINE DECODER 3线至8线译码器74LS139 2-4 LINE DECODER 2线至4线译码器74LS14 TRIGGERED HEX INVERTER 六触发反向器74HC147 10-4 LINE PRIORITY ENCODER 10-4编码器74HC148 8-3 LINE PRIORITY ENCODER 8-3编码器74HC149 8-8 LINE PRIORITY ENCODER 8-8编码器74LS151 8-CHANNEL DIGITAL MUX 8通道多路器74LS153 DUAL 4-INPUT MUX 双四输入多路器74LS155 2-4 LINE DECODER 2线至4线译码器74LS156 2-4 LINE DECODER/DEMUX 2-4译码器74LS157 QUAD 2-INPUT MUX 四个双端多路器74LS158 2-1 LINE MUX 2-1线多路器74LS160A BINARY COUNTER 二进制计数器74LS161A BINARY COUNTER 二进制计数器74LS162A BINARY COUNTER 二进制计数器74LS163A DECADE COUNTERS 十进制计数器74LS164 SERIAL-PARALLEL SHIFT REG 串入并出74LS168 BI-DIRECT BCD TO DECADE 双向计数器74LS169 4BIT UP/DN BIN COUNTER 四位加减计数器74LS173 TRI-STATE D FLIP-FLOP 三态D触发器74LS174 HEX D FLIP-FLOP W/CLEAR 六D触发器74LS175 HEX D FLIP-FLOP W/CLEAR 六D触发器74LS190 BINARY UP/DN COUNTER 二进制加减计数器74LS191 DECADE UP/DN COUNTER 十进制加减计数器74LS192 DECADE UP/DN COUNTER 十进制加减计数器74LS193 BINARY UP/DN COUNTER 二进制加减计数器74LS194A 4BIT BI-DIR SHIFT 4位双向移位寄存器74LS195A 4BIT PARALLEL SHIFT4位并行移位寄存器74LS20 QUAD 4-INPUT NAND GATE 四个四入与非门74LS21 4-INPUT AND GATE 四输入端与门74LS240 OCTAL 3-STATE BUFFER 八个三态缓冲门74LS244 OCTAL 3-STATE BUFFER 八个三态缓冲门74LS245 OCTAL 3-STATE TRANSCEIVER 三态收发器74LS253 DUAL 4-CH 3-STATE MUX 4路3态多路器74LS256 4BIT ADDRESS LATCH 四位可锁存锁存器74LS257 QUAD 2-CH 3-STATE MUX 4路3态多路器74LS258 2-CH 3-STATE MUX 2路3态多路器74LS27 TRIPLE 3-INPUT NOR GATES 三输入或非门74LS279 QUAD R-S LATCHES 四个RS非锁存器74LS28 QUAD 2-INPUT NOR BUFFER 四双端或非缓冲74LS283 4BIT BINARY ADDER CARRY 四位加法器74LS30 8-INPUT NAND GATES 八输入端与非门74LS32 QUAD 2-INPUT OR GATES 二输入或门74LS352 4-1 LINE SELECTOR/MUX 4-1线选择多路器74LS365 HEX 3-STATE BUFFER 六个三态缓冲门74LS367 3-STATE BUFFER INVERTER 缓冲反向器74LS368A 3-STATE BUFFER INVERTER 缓冲反向器74LS373 OCT LATCH W/3-STATE OUT三态输出锁存器74LS76 Dual JK Flip-Flop w/set 2个JK触发器74LS379 QUAD PARALLEL REG 四个并行寄存器74LS38 2-INPUT NAND GATE BUFFER 与非门缓冲器74LS390 DUAL DECADE COUNTER 2个10进制计数器74LS393 DUAL BINARY COUNTER 2个2进制计数器74LS42 BCD TO DECIMAL BCD转十进制译码器74LS48 BCD-7 SEG BCD-7段译码器74LS49 BCD-7 SEG BCD-7段译码器74LS51 AND OR GATE INVERTER 与或非门74LS540 OCT Buffer/Line Driver 8路缓冲驱动器74LS541 OCT Buffer/LineDriver 8路缓冲驱动器74LS74 D-TYPE FLIP-FLOP D型触发器74LS682 8BIT MAGNITUDE COMPARATOR 8路比较器74LS684 8BIT MAGNITUDE COMPARATOR 8路比较器74LS75 QUAD LATCHES 双锁存器74LS83A 4BIT BINARY ADDER CARRY 四位加法器74LS85 4BIT MAGNITUDE COMPARAT 4位判决电路74LS86 2INPUT EXCLUSIVE OR GATE 2输入异或门74LS90 DECADE/BINARY COUNTER 十/二进制计数器74LS95B 4BIT RIGHT/LEFT SHIFT 4位左右移位寄存74LS688 8BIT MAGNITUDE COMPARAT 8位判决电路74LS136 2-INPUT XOR GATE 2输入异或门74LS651 BUS TRANSCEIVERS 总线收发器74LS653 BUS TRANSCEIVERS 总线收发器74LS670 3-STATE 4-BY-4 REG 3态4-4寄存器74LS73A DUAL J-K FLIP-FLOP W/CLEAR 双JK触发器。

SN74LVC541A中文资料

SN74LVC541A中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

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PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9685701Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9685701QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9685701QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC541DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC541DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC541NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC541NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWLE OBSOLETE TSSOP PW 20TBDCall TI Call TISN74AHC541PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC541PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC541FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC541J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC541WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in29-Jun-2006a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.29-Jun-2006TAPE AND REELINFORMATION30-Apr-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC541DBR DB 20MLA 330168.27.5 2.51216Q1SN74AHC541DGVR DGV 20MLA 330127.0 5.6 1.6812Q1SN74AHC541DWR DW 20MLA 3302410.813.0 2.71224Q1SN74AHC541NSR NS 20MLA 330248.213.0 2.51224Q1SN74AHC541PWRPW20MLA330166.957.11.6816Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74AHC541DBR DB 20MLA 333.2333.228.58SN74AHC541DGVR DGV 20MLA 338.1340.520.64SN74AHC541DWR DW 20MLA 333.2333.231.75SN74AHC541NSR NS 20MLA 333.2333.231.75SN74AHC541PWRPW20MLA333.2333.228.5830-Apr-2007PACKAGE MATERIALS INFORMATION30-Apr-2007Pack Materials-Page3元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements,and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarilyperformed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products andapplications using TI components.To minimize the risks associated with customer products and applications,customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,maskwork right,or other TI intellectual property right relating to any combination,machine,or process in which TI 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