Module partition process model and method of integrated service product
学生考勤管理系统的设计和实现外文翻译
Design and Implementation of the Management System forStudents AttendanceAs for the development of information technology and economic, computer and networking applications become increasingly common. With the school informational construction inputs are constantly increasing, the construction of campus network accesses to space development. Networks have gradually infiltrated into the school management, teaching and other areas.For example: A comprehensive education system which utilizes information technology of the network to carry on college course to educate, it offers from the network classroom, essential study links discussing, answering questions, and processing homework to examination to teachers and students.The Manager System for Students Attendance is a system which can help exchange information between the school and students. As we know,In the high schools, students’job of check on work attendance not only workload is very large,but also time is very strong.In the past many high schools carry through managing by signing in and reporting forms, efficiency and diaphaneity are not good,and easy make a mistake,too.Along with development of database technology and progress of corporation information’s building,using computer to manage check on work attendance of corporations which it is necessary.It saves a mass of manpower and material resources and greatly lightens workload of employees.The system is an information system designed for asking for leave on line for students and managing attendance of undergraduate.It is generally divided into three main modules: the module for asking for on-line leave , the module for managing attendance of undergraduate and the module for backstage management. There are different customers in the university operating the system,such as student, teacher, a teacher in charge of a class,department leader, school leader,administrator.Administrators have the highest authority. Teachers have an audit and inquiry authority. Students only provide with competence.The system is based on Browser/Server (browser/server) structure and developed by JSP language and MySQL database. It also uses TOMCAT as a server. The system is written by the language: HTML and JA V A. The key techniques used in the process of development are: the page modularization, dynamic generating andstatic page showing of information, etc. And the thesis focuses on the introduction of the system’s attendance management and the management of asking for leave online.And it develops the function of student, teacher, a teacher in charge of a class,department leader, school leader on the whole. It included the whole design of system , logic frame , data flow ,partition of every function module ,design of system function modules and concrete realization and so on .Constructing the attendancesystem based on MVC is the typical case that uses JSP - Action-JA V ABAN to develop the website, it involves to the MVC design pattern, as well as the backstage database, the tied operation between the fundamental table and the system downstage, this system through the JDBC gain database actuation to tie up the fundamental table in the database and the downstage system. To construct the system in the process, I use MYECLIPSE to make the software development kit of my system back stage,uses DREAMWEA VER to make the software development kit of my downstage homepage .Implementation of a system is bound to apply to different resources, and technology. So, let's discuss this appraisal system under the use of technology in the application of concepts and resources:MVC and User Interfaces MVC was first popularized with Smalltalk and is now used in many modern user interface frameworks. One of the primary benefits of MVC is that it provides reusable components for interactive user interfaces. Swing does this admirably for rich Java clients, while Struts does so to a lesser extent on the Web. Even though the introduction of Tiles to Struts provides more reuse, the components are still more page-centric as opposed to Swing's more fine-grained widget-centric approach. Like Struts, JSF is targeted at Java Web applications, but moves closer to Swing with its concentration on reusable user interface widgets (or components).MVC Pattern We begin by describing the traditional form of MVC and then discuss how it has been adapted for the Web. Each of the three frameworks is then examined, and their respective implementations of this common pattern are uncovered. The intent of this pattern is to partition interactive applications into three separate components: Model, View, and Controller. The Model represents core application data and functional logic, the View renders the data and displays it to users of the application, and the Controller handles user interaction or input. All three components communicate via a change-propagation mechanism to stay synchronized.SQL Databases SQL database is a type of database technology that is the most widely used in today's computing environment. Here the data is stored in a very structured format that provides high levels of functionality. SQL databases are generally more robust, secure and have better performance than other older database technologies. It provides for SQL access to the data. So it is important to understand the term SQL before we proceed further.SQL SQL is used to create, maintain & query relational databases and uses regular English words for many of its commands, which makes it easy to use. It is often embedded within other programming languages. A fundamental difference between SQL and standard programming languages is that SQL is declarative. You specify what kind of data you want from the database; the RDBMS is responsible for figuring out how to retrieve it.JSPPut succinctly, JA V A Server Pages is a technology for developing web pages that include dynamic content. Unlike a plain HTML page, which contains static content that always remains the same, a JSP page can change its content based on any number of variable items, including the identity of the user, the user's browser type, information provided by the user, and selections made by the user.A JSP page contains standard markup language elements, such as HTML tags, just like a regular web page. However, a JSP page also contains special JSP elements that allow the server to insert dynamic content in the page. JSP elements can be used for a variety of purposes, such as retrieving information from a database or registering user preferences. When a user asks for a JSP page, the server executes the JSP elements, merges the results with the static parts of the page, and sends the dynamically composed page back to the browser.S2SHDAO layer is responsible for interaction with persistent objects. This layer encapsulates the data, add, delete, check, change operation.A typical J2EE three-tier structure, divided into the presentation layer, middle layer (business logic) and data services layer. Three-tier system, the business rules, data access and verify the legitimacy of such work on the intermediate layer processing. Clients do not directly interact with the database, but by the middle tier components and establish connections, then the middle tier and database interaction.S2SH frameworkA typical J2EE three-tier structure, divided into the presentation layer, middle layer (business logic) and data services layer. Three-tier system, the business rules, data access and verify the legitimacy of such work on the intermediate layer processing. Clients do not directly interact with the database, but by the middle tier components and establish connections, then the middle tier and database interaction.JSP presentation layer is the traditional technology, since its inception in 1999, after years of development, its wide application and stable performance, as the presentation layer technology for laying a solid foundation.The middle layer is the popular Spring + Hibernate, in order to control the separation layer and business logic layer, further divided into the following.Web tier is the MVC pattern inside the "C" (controller), controls the business logic and presentation layer of interaction, called business logic layer, and business data back to the presentation layer for organizational performance, the system using Struts MVC framework .Service layer (ie business logic), is responsible for achieving business logic. Business logic to DAO layer based on the positive mode DAO component packaging, complete system requires business logic.DAO layer is responsible for interaction with persistent objects. This layer encapsulates the data, add, delete, check, change operation.PO, persistent object. Through the entity-relational mapping tool for data relational database mapping objects, it is easy to realize object-oriented way of operating the database, the system uses Hibernate as the ORM framework.Spring's role throughout the entire middle layer, the Web layer, Service layer, DAO layer and PO seamless integration of its data services layer is used to store data.A good framework that allows developers to reduce the re-establishment of the burden of the program to solve complex problems and energy; it can be extended to the custom-house; and has a strong user community to support it. Usually a good framework to solve a problem. However, your application is layered, each layer may need their own framework. Only solve the UI problem does not mean you can be good business logic and persistence logic, and UI components of a good coupling.First,Development efficiency: the use of strict J2EE layered architecture, can be avoided when a simple button changes the page will damage the system. Changes to the presentation layer if an error occurs, it will not be extended to business logic errors, but will not affect the persistence layer. Therefore, the use of J2EE layeredarchitecture, even if the pre-development efficiency slightly lower, but it is worth.Second, changes in demand: customer demand for software, software development process, with the depth, clarity up constantly. Therefore, software developers often encounter a certain extent, due to customer demand for software change, making the realization of the software had to change. When the software needs to change, it can as much as possible to retain some of the software, change as little as possible the realization of software to meet customer needs change? The answer is - with good decoupling structure. This architecture is J2EE layered architecture, in good layered architecture, the control layer depends on the business logic layer,But not with any specific business logic component coupling, only the interface coupling; Similarly, the business logic depends on the DAO layer, it will not have any specific DAO component coupling, but for the interface programming. The software used in this way, even if some of the software changes, other parts do not change as much as possible.Using Hibernate as the persistence layer technology is the biggest advantage: you can completely object-oriented approach to system analysis, system design.As from the Spring DAO factory, not the programmer to achieve the factory model, only need to configure the Spring DAO component container, managed by the ApplicationContext can create DAO components. With Spring provides dependency injection, other components do not even have to visit the factory and they can directly use the DAO instance学生考勤管理系统的设计和实现由于信息技术和经济的发展,电脑和网络的应用变得越来越普遍。
全国大学毕业生就业管理信息系统
北方交通大学硕士学位论文全国大学毕业生就业管理信息系统姓名:***申请学位级别:硕士专业:管理科学与工程指导教师:***2002.2.1摘要摘要Y钉732s国的大学毕业生就业模式是在国家政策调控下,业的双向选择,由于每年的毕业生数量很大,为使就业管理工作顺利完成,增强各毕业生就业管理部门的信息处理能力,开发基于网络的全国大学毕业生管理信息系统具有重要的意义。
丫全国大学毕业生管理信息系统是为教育部、人事部、各院校,用人单位,大学毕业生等就业工作中的主体而设计的信息管理系统。
其主要功能是完成大学毕业生就业过程中的各主要工作。
根据大学毕业生就业管理工作职能需求、政府职能上网的需求和大学毕业生就业管理的业务流程,本文通过运用结构化的分析方法,分析出大学毕业生就业管理信息系统的系统需求。
根据全国大学生就业管理信息系统需求,该管理信息系统应是分布式的系统结构,设计开发全国大学毕业生就业管理信息系统就应考虑利用计算机网络把分布在不同地点的计算机硬件、软件、数据等信息资源联系在一起,服务于大学毕业生就业管理工作,以实现相互通信和不同地点的信息共享。
同时,又要考虑利用本地资源独立丌展二【:作。
从而可以看出全凼大学毕业生就业信息系统应是基于C/S计算模式和B/S计算模式的综合运用的模式。
N、在系统设计过程中,根据大学毕业生就业管理信息系统数据流程图,设计出该系统的软件模块结构和数据库结构;根掘信息系统的总体和局、网络的总体设汁原则和信息系统功能结构图,设计出大学毕业生就业管理信息系统的网络结构:根据网络结构设计出全国大学毕业生就业管理网站的结构功能图;根据网站内容的建设厶聪\实北方交通大学硕士学位论文需要和交互性要求进行了网站的输入输出设计和C/S的输入输出设计。
同时,为了节省存储空间,提高处理速度和精度进行了代码设计。
在网站设计的过程中,根据网站的特点,对基于wEB的大学毕业生管理信息系统进行了设计,设计出该网站的主要网页,以及网页栏目功能,并且对网站的各个功能进行了详细的介绍。
Autodesk Nastran 2023 参考手册说明书
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File Management Directives – Output File Specifications: .............................................................................. 5
BULKDATAFILE .................................................................................................................................................... 7
HP Development Company, L.P. Windows系统内存模块安装指南说明书
User Guide© Copyright 2017 HP Development Company, L.P.Windows is either a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries.Intel and Core are trademarks of Intel Corporation in the U.S. and other countries. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.First Edition: June 2017Document Part Number: 937232-001Table of contents1 Introduction (1)Warnings and cautions (1)Your responsibilities (1)System requirements (2)2 Installing the memory module in your computer (3)Models with M.2 connectors (3)Models without M.2 connectors (4)3 Installing the Intel Optane software (6)Installing the Intel RST software and driver (6)Installing the Intel RST driver into the operating system Recovery image (6)4 Using the Optane memory application (8)Initialization errors (8)Statistics page (8)5 Using Intel Optane memory with the Intel Rapid Storage Technology driver (9)Enabling Intel Optane memory (9)Disabling Intel Optane memory (9)6 Troubleshooting (10)iiiiv1IntroductionOptane memory is an M.2 module that is meant to boost system performance when used with a SATA storagedevice (hard drive) on 7th Generation Intel® Core™ processor-based computers. For detailed information onIntel Optane memory, go to /support/optane-memory.Warnings and cautionswith this symbol.Guide also provides important electrical and mechanical safety information. This guide is located at/ergo and on the documentation CD (if one is included with the product).injury from a hot component, allow the surface to cool before you touch it.IMPORTANT:Static electricity can damage the electronic components of the computer. Before beginningthese procedures, be sure you discharge static electricity by briefly touching a grounded metal object.IMPORTANT:To prevent damage to the computer, observe the following Electrostatic Discharge (ESD)precautions while performing the system parts removal and replacement procedures:●Work on a static-free mat.●Wear a static strap to ensure that any accumulated electrostatic charge is discharged from your body tothe ground.●Create a common ground for the equipment you are working on by connecting the static-free mat, staticstrap, and peripheral units to that piece of equipment.NOTE:HP accessories are for use in HP computer products. They have been extensively tested for reliabilityand are manufactured to high quality standards.Your responsibilitiesYou are responsible for determining whether the product is appropriate for your use and will interface withother equipment without malfunction or damage. You are also responsible for backing up data beforeinstalling any product and for regularly backing up data after installing the product. HP is not liable for anydamage to equipment or data loss resulting from the use of any product. To determine the compatibility ofthis product with your computer or workstation, view QuickSpecs at /go/productbulletin.Warnings and cautions1System requirements●Intel 7th Generation Core i3, i5, or i7 processors●Intel Rapid Storage Technology (Intel RST) driver, Version 15.5 or later●Operating system: Windows® 10 Spring 2017 Creator’s Update (1703) or later installed on a supportedstorage deviceIMPORTANT:Only Windows 10 Spring 2017 Creator’s Update (1703) or later is supported.● A supported backend (slow media system disk) storage device connected to the Intel AHCI controller offthe chipset with Windows 10 64-bit installed, formatted for the GUID partition table (GPT), and at least 5MB of continuous, unallocated space at the end of the boot volume●HP BIOS Version 02.06 or newerNOTE:To locate the latest BIOS for your product, go to /support.●BIOS configured for Optane●The Intel Optane memory module populated in an M.2 connectorIMPORTANT:Intel Optane memory does not support self-encrypting or Federal Information ProcessingStandard (FIPS) 140-2 drives.2Chapter 1 Introduction2Installing the memory module in your computerThe procedure to install the module differs depending on your computer model. If you need help preparingyour computer model for this installation, refer to the documentation provided with the computer, or go to/support to locate the manual for your model.Models with M.2 connectorsNOTE:If there are two M.2 connectors on the system board, install the memory module in the second M.2connector to avoid potential Electromagnetic interference.Install the module onto the system board.1.Locate the supported M.2 connector on your system board. The connector is labeled SSD.2.If necessary, install the screw standoff into hole near the connector.3.Insert the module into the M.2 connector (1).Models with M.2 connectors34.Rotate the module downward (2), and then install the screw (3).Models without M.2 connectorsInstall the module into a PCIe carrier card, and then install the carrier card in the x4 expansion slot.IMPORTANT:Do not install the carrier card into the x16 expansion slot.1.Install the module into a PCIe carrier card:a.Insert the module into the M.2 connector (1), and then insert the screw into the slot in the module(2).IMPORTANT:Be sure that the slot in the screw is facing the module so that the screw inserts fullyonto the module.b.Rotate the module downward (3), and then tighten the screw (4).4Chapter 2 Installing the memory module in your computer2.Insert the PCIe carrier card into the computer expansion slot (1), and then install the screw into thecarrier card bracket (2).Models without M.2 connectors53Installing the Intel Optane softwareThis section describes the process of installing the Intel Optane memory software and driver on a computer.You must use the Setup Utility to enable Optane memory. After enabling Optane in the Setup Utility, you mustenable it in the Intel RST software.NOTE:The system board requires a BIOS update to Version 02.06 or later before the Intel Optane memoryand software driver package can be installed. To locate the latest BIOS for your product, go to /support, and follow the on-screen instructions to find your product and locate downloads.To enable Intel Optane in the Setup Utility:1.Go to the Setup Utility by restarting the computer and repeatedly pressing F10 to enter setup.2.Select Advanced>System Options, and then select Configure Storage Controller for Intel Optane.NOTE:You can configure Optane memory programmatically with BiosConfigUtility.exe or WMI BIOSSettings commands.3.Restart the computer.IMPORTANT:Once you install the Intel Optane System Accelerator, reverting back to a BIOS version olderthan 02.06 will disable your Intel Optane System Accelerator and could keep your system from booting. Installing the Intel RST software and driverThis section provides an overview of steps to install and set up Intel Optane memory with the Intel RST userinterface.IMPORTANT:Update BIOS to Version 02.06 or later before installing the software and driver.1.Go to /support, and select the most recent Intel Rapid Storage Technology softwareand driver.2.Run setupRST.exe and install the defaults.3.Restart the computer.4.From the Windows desktop, launch the Intel RST user interface, and then click the Intel Optane Memorytab. The Status page opens.5.Click Enable.6.After the enable process is complete, reboot the computer.After the system restarts, installation continues in safe mode. When installation is complete, the systemagain restarts. You can now use the Intel Optane memory application.Installing the Intel RST driver into the operating system Recovery imageThe current Microsoft Intel Rapid Storage Technology driver does not support Intel Optane memory.Therefore, if the operating system image is damaged (for example, by hard drive corruption, file corruption, 6Chapter 3 Installing the Intel Optane softwaremissing files) and enters the Windows Recovery process, the operating system recovery image/tools must contain the Intel Rapid Storage Technology driver Version 15.5 or later. You can insert this driver into the operating system Recovery image/tools before you install Intel Optane.Requirements:●Windows Assessment and Deployment Kit (ADK) installed●Windows 10 64-bit image●Windows 10 Spring 2017 Creator’s Update (1703)●Intel Rapid Storage Technology software and driver, Version 15.5 or later, available from /support●USB flash drive for installationTo install the driver:1.Create a bootable USB flash drive from the Windows 10 operating system image.2.Create a temporary working directory on the local computer (for example, C:\Win10USB).3.In the working directory, create three subdirectories named Windows, Winre, and Drivers.4.Extract the Intel Rapid Storage Technology driver to the Drivers subdirectory.5.From the Windows 10 USB flash drive, copy the install.wim file from the Sources directory on the flashdrive to the working directory (for example, C:\Win10USB).6.Close all folders and File Explorer.7.Open a command prompt as Administrator and change to the working directory (for example, cd C:\Win10USB).8.Determine which index number to modify based on the installed version of Windows 10. Choose theindex that matches the Windows 10 version.To determine the index, run the command dism /get-wiminfo /wimfile:install.wim.IMPORTANT:This example modifies Index 2. You can repeat steps to modify additional versions.9.Modify the install.wim file by running the following commands:●Mount the Windows Image: dism /mount-image /imagefile:install.wim /index:2 /mountdir:windows●Add the Intel Rapid Storage Technology drivers to the Windows image: dism /image:windows /add-driver /driver:drivers /forceunsigned /recurse●Mount the Windows Recovery Image: dism/mountimage/imagefile:c:\Win10USB\windows\windows\system32\recovery\winre.wim /Index:1 /mountdir:winre●Add the Intel Rapid Storage Technology driver to the Windows Recovery Image: dism /image:winre /add-driver /driver:drivers /forceunsigned /recurse●Unmount the Windows Recovery Image: dism /unmount-wim /mountdir:winre /commit●Unmount the Windows Image: dism /unmount-wim /mountdir:windows /commit●Copy the updated install.wim file in the working directory back to the Sources directory on the USBflash driveInstalling the Intel RST driver into the operating system Recovery image74Using the Optane memory application Initialization errorsYou can open the application by selecting Intel Optane Memory on the Start menu.This section includes examples of errors that could occur if your computer is not ready to enable Intel Optanememory.Error Cause and solutionYour System is Intel Optane Memory Ready No Intel Optane memory modules are detected on your computer. Please insert amodule and try again.Error Initializing Intel Optane Memory There is a pending restart for this product. Please restart before running theapplication.Error Initializing Intel Optane Memory The Intel Optane memory application was not installed correctly. Please repair orreinstall the application.Your system is not fully compatible with Intel Optane memory.Your System is Not Intel Optane MemoryReadyIntel Optane Memory is Disabled If more than one Intel Optane memory module is installed, select the module to use,and then click Enable.Statistics pageTo display statistics, Intel Optane memory must be enabled.The Optimization schedule will be shown for only 32 GB or larger memory modules.8Chapter 4 Using the Optane memory application5Using Intel Optane memory with the Intel Rapid Storage Technology driverEnabling Intel Optane memoryTo enable Intel Optane memory using the Intel Rapid Storage Technology application, open the Intel RapidStorage Technology application, and then click the Intel Optane memory tab.NOTE:The Intel Optane memory tab displays only in the software for Intel Rapid Storage TechnologyVersion 15.5 or later.1.Click Enable.2.Select a compatible fast drive, and then click Yes. The compatible drive option displays only if more thanone Intel Optane memory module is installed in the computer.3.After the enable process is complete, click Reboot to restart the computer.IMPORTANT:The computer must be restarted, not shut down. Shutdown may cause incorrect displayof drive volumes.Disabling Intel Optane memoryIMPORTANT:Do not disable Optane memory in BIOS unless you first disable the feature in the Intel RSTapplication.Before removing the SATA storage device being accelerated by the memory or removing the memory modulefrom the system, you must disable Intel Optane memory.To disable Intel Optane memory using the Intel Rapid Storage Technology application:IMPORTANT:Do not remove the Intel Rapid Storage Technology driver after disabling Intel Optane memory.1.Open the Intel Rapid Storage Technology application, and then click the Intel Optane memory tab.2.Click Disable, and then click Yes to confirm.3.After the disable process is complete, click Reboot to restart the computer.IMPORTANT:The computer must be restarted, not shut down. Shutdown may cause incorrect displayof drive volumes.Enabling Intel Optane memory96TroubleshootingThis section includes examples of errors that could occur during installation of the Intel Optane memorysoftware and driver. For more information and help on these errors, please contact support at /support.Error Cause and solutionUnsupported CPU Intel Optane memory requires a 7th generation Intel Core processor or later.Unsupported Chipset Intel Optane memory requires a supported Intel 200 Series Chipset or later.Unsupported Operating System Intel Optane memory requires Windows 10 64-bit Spring 2017 Creator’s Update(1703) or later.Unsupported BIOS Intel Optane memory requires BIOS Version 02.06 or later.Unsupported BIOS mode Intel Optane memory requires BIOS Version 02.06 or later.Unsupported System Drive An MBR system drive partition table is not supported. To resolve this issue,change the system drive partition table type to GPT, and then reinstall theoperating system.Unsupported System Drive The last partition cannot be resized because it is blocked for resizing.Unsupported System Drive Last Partition The last partition cannot be resized because it does not have enough free space.Intel Rapid Storage Technology is Already Installed To resolve this issue, uninstall the Intel Rapid Storage Technology user interfaceand then install the Intel Optane memory application.Error Checking System Compatibility The installation failed to check for chipset compatibility.– or –The installation failed to check for the drive partition table.– or –The installation failed to check the available space on the last partition of thesystem drive.Intel Optane Memory is Currently Disabled You tried to uninstall the Intel Optane memory application with Intel Optanememory enabled. To uninstall the Intel Optane memory application, open theapplication and disable Intel Optane memory before uninstalling the Intel Optanememory application.10Chapter 6 Troubleshooting。
关于软件开发的知识(中英文)
1. What is software development?Software development is the process of developing software through successive phases in an orderly way. This process includes not only the actual writing of code but also the preparation of requirements and objectives, the design of what is to be coded, and confirmation that what is developed has met objectives.Before systems development methods came into being, the development of new systems or products was often carried out by using the experienceand intuition of management and technical personnel. However, the complexityof modern systems and computer products long ago made the need clear forsome kind of orderly development process.Typical phases of software development:1) Identification of required software2) Analysis of the software requirements3) Detailed specification of the software requirements4) Software design5) Programming6) Testing7) MaintenanceIn general, the development of commercial software is usually a result of demand in the marketplace, while enterprise software developmentgenerally arises from a need or a problem within the enterprise environment.2. How is software development guided?The software development process is almost invariably guided bysome systematic software development method (SDM). Referred to by a numberof terms, including process models, development guidelines,and systems development life cycle models (SDLC), software development methods nevertheless generally include the same development phases:∙The existing system is evaluated and its deficiencies identified, usually through interviewing system users and support personnel.∙The new system requirements are defined. In particular, the deficiencies in the existing system must be addressed with specific proposals for improvement.∙The proposed system is designed. Plans are laid out concerning the physical construction, hardware, operating systems, programming, communications, and security issues.∙The new system is developed. The new components and programs must be obtained and installed. Users of the system must be trained in its use, and all aspects of performance must be tested. If necessary, adjustments must be made at this stage.∙The system is put into use. This can be done in various ways. The new system can phased in, according to application or location,andthe old system gradually replaced. In some cases, it may be more cost-effective to shut down the old system and implement the new system all at once.∙Once the new system is up and running, then it should be exhaustively evaluated. Maintenance must be kept up rigorously at allers of the system should be kept up-to-date concerning the latest modificationsand procedures.The systems development life cycle model was developed as a structured approach to information system development that guides all the processesinvolved from an initial feasibility study through to maintenance of thefinished application. SDLC models take a variety of approaches to development.Systems development life cycle models include:· The waterfall model:This is the classic SDLC model, with a linear and sequential method that has goals for each developmentphase. The waterfall model simplifies task scheduling, because there areno iterative or overlapping steps. One drawback of the waterfall is thatit does not allow for much revision.· Rapid application development (RAD):This models based on the concept that better products can be developed more quicklyby: using workshops or focus groups to gather system requirements; prototyping and reiterative testing of designs; rigid adherence to schedule; and less formality of team communications such as reviews.· Joint application development (JAD): This modelinvolves the client or end user in the design and development of an applicationthrough a series of collaborative workshops called JAD sessions.· The prototyping model: In this model, a prototype (an early approximation of a final system or product) is built, testedand then reworked as necessary until an acceptable prototype is finallyachieved from which the complete system or product can now be developed.· Synchronize-and-stabilize: This model involves teams working in parallel on individual application modules, frequently synchronizingtheir code with that of other teams and stabilizing code frequently throughout the development process.· The spiral model: This model of development combines the features of the prototyping model and the waterfall model. The spiral model is favored for large, expensive, and complicated projects.3. How has the open source development process influenced software development in general?Open source software is developed collaboratively; source code is freely available for use and modification. The open source movement arose because some developers came to believe that competition amongst vendors leads to inferior products and that the best approach to development isa collaborative one.The OSI (Open Source Initiative) is an industry body that certifies products as open source if they conform to a number of rules:· The software being distributed must be redistributed to anyone else without any restriction· The source code must be made available (so that the receiving party will be able to improve or modify it)· The license can require improved versions of the software to carry a different name or version from the original softwareDespite its emphasis on the collaborative process, the biggest influence that open source has had on software development in general may be through competition: by competing with proprietary software products, open source products force vendors to work that much harder to hold their market share in the face of viable open source alternatives.4. What are some generally accepted best practices common to all or most development models?Here's a collection of some of the top tips from a variety of industry sources:· Make sure that you've chosen a systems development life cycle model that suits your project, because every one of the processesinvolved depends on the model. That said, however, implementing any modelis betterthan none -- much of the success of a project depends upon howscrupulously the model is adhered to.· Reuse software components when it's appropriate, but don't use code that doesn't work perfectly for its intended purpose just because you have it on hand.· Be very thorough in gathering requirements, ensuring that all parties agree on what they are -- and make sure you document them.· Don't promise the moon, if you can't deliver it. Avoidletting someone who isn't fully informed negotiate with the client.· Make sure that the architecture you've chosen is appropriate for the application you're building. To retain perspective, you might want to look at the smaller picture and plan the architecture incrementally.· Change is part of life, including software development. You have to accept that various things -- requirements, for example -- are likely to change throughout the life of the project. Keep control of them, but not too rigidly.· Set up peer review process es for every element of the project.· Design thoroughly and with care, but remember the KISSprinciple: Keep it simple.· In your project plan, split big projects into manageable chunks, with concrete milestones and deadlines.· Ensure accountability: make sure that deadlines are clear and that people have to report on whether they made them, and explain why not if they don't.· Implement quality control procedures throughout the project.· Test exhaustively -- there's no point in doing a cursory run through only to have an application fail when you run it for the client.· After the project is completed, conduct a thorough post-mortem, with everyone involved. You'll see what worked well and what should havebeen differently, and your future projects will benefit.5. What are some common mistakes in software development?According to a Standish Group report, corporations in the United States spend over $275 billion every year on software development projects, many of which are doomed to failure. Research by the group found that over 80% of projects fail for various reasons, and that fully 30% of projectswere cancelled prior to completion because of poor execution.David B. Stewart, at the University of Maryland, set out to document the 10 most common mistakes of software development. He found, however,that the sheer number of errors that were commonly practiced made it impossible to keep the number to ten. He ended up calling his article "Twenty-FiveMost Common Mistakes with Real-Time Software Development." Even so, afterthe title had been established, he found another five errors so common that the felt compelled to add them.According to Dr. Michael, the most common project problems are due to failure to manage project elements successfully:· Requirement s are not clearly and accurately defined, and agreed upon by all concerned.· Resources are not adequately planned and allocated.· Threats to project success are not clearly detected, identified, and protected against.· Critical path analysis is omitted, or poorly executed.· The project's progress is not tracked adequately.· Quality management is not carried out well enough throughout the life of the project.· Too little data is collected, or data is ignored or poorly understood.Correcting flaws identified during software security audits is expensive and time consuming. Worse, vast resources are spent on containing and recovering from exploits. Fortunately, providing development staff with the knowledge and tools to avoid many of these pitfalls is easy and inexpensive.6. Given a particular process model, is there a set of tools(a development environment) to support it?In general, a process model usually begins as a philosophy of "who does what development when" rather than a rigid methodology complete with tools. For example, rapid application development (RAD) is an approach that can make use of existing development tools. In general, tools for supporting all or part of a process model tend to arrive later, if at all.Historically, development tools have focused on the code-building, code archive management, documentation, testing, and packaging parts ofthe process, sometimes offered as a suite. Such a suite is generally known as an integrated development environment (IDE).A set of tools for managing or supporting a development project is generally known as a computer-assisted software environment (CASE). A number of companies offer products that support early stages of development such as requirements gathering, design prototyping, and data modeling. A number of these provide tools that support data modeling with the Unified Modeling Language. Overall, there is a trend toward providing all or most of the tools for a development project in a single product or related set of products.Today, the main code-building development environments or program suites come from Microsoft with its Visual Studio and Visual Studio .NET, providing support for Visual Basic, Visual C#, Visual C++, and Visual J#; Sun Microsystems with its Java 2 Enterprise Environment; and numerous software vendors such as Borland who repackage these environments with some value-added features. Recently, almost all providers of software development environments have added features that enable the software to be used on the Web.7. How do you choose the "right" programming language for your project?For most projects, the right language is easy to choose. Your company may have standardized on a particular development environment and language (and you may have been hired because you were already familiar with the language). Or you may be updating or enhancing an existing program; it's almost always best to use the same language the existing program is written in. In some cases, however, someone will need to select the best (or, since the best may be somewhat arguable, at least an appropriate language). In somecases, you or your team of developers may need to know several languages fordifferent purposes.General truisms about programming languages are that:∙Perl or a similar script language is most suitable for small tasks and sometimes acting as a program that goes between other,largerprograms.∙Visual Basic is most suitable for relatively novice programmers and relatively simple programs.∙Java, C++, or comparable languages like Python and Tcl aremost suitable for larger applications using object orientation as adesignmodel.∙ C is most suitable for programs where efficiency and performance are the primary concern.∙The appropriate assembler language is most suitable where the program is relatively short and high performance is critical.Where constraints permit, some programmers may favor one object-oriented language over another (for example, Java, C++, Python, or Tcl). A programmer with skills in C is likely to prefer C++, which combines the proceduraland other concepts and syntax of C with object-oriented concepts.8. What are some trends regarding the future of software development?Blogs - A growing number of big-name softwaredevelopers are finding they can make better software applications if theyshare information with potential customers from the start and incorporate customer feedback into development decisions. While developers of gamessoftware have used this method for years, business software makers are nowalso catching on and using blogs as an important part of the development process.Big-name support for independent software vendors (ISVs) - Big players like Microsoft, IBM, and Sun have recognized that they cannot fill every niche industry's software demands, so they have begun to activelyseek partnerships with small ISVs, in hopes that by encouraging ISVs to focuson vertical industry applications, everyone will benefit.Component-based development- In this approach, softwareis developed in modules that are linked dynamically to construct a completeapplication. Charles Simonyi (creator of the WYSIWYG editor) believes thateventually, software development will become so modular that even lay-peoplewill be able to assemble components effectively to create customizedsoftware applications.Continued improvements in refactoring tools - Eric Raymond,a leading philosopher about program development, maintains that the conceptof refactoring is consistent with the idea ofget-something-working-now-and-perfect-it-laterapproach long familiarto Unix and open source programmers. The idea is alsoembodied in the approach known as Extreme Programming. As software applicationsbecome larger, better refactoring tools will be required to maintain codebases and diagnose bugs.Outsourcing - Using this approach, software companies hire employees around the world to take advantage of time zone and labor/cost differences.Proponents say that in effect, software development teams now have a 24-hourwork day, and are able to provide fast turn-around. Detractors say that outsourcingparts of a project leads to sloppy coding and only works if there is a highdegree of coordination regarding modularized tasks, and above-average communicationwithin the team.1。
计算机常用英语词汇表
计算机常用英语词汇表高频700单词一、硬件类Hardware 'hɑ:dwεCPUCenter Processor Unit中央处理单元'sent 'pr uses 'ju:nitMain board主板mein b :dRAMrandom access memory随机存储器内存'r nd m ' kses 'mem riROMRead Only Memory只读存储器ri:d ' unli 'mem riFloppy Disk 软盘'fl pi diskHard Disk 硬盘hɑ:d diskCD-ROM 光盘驱动器光驱monitor 监视器'm nitkeyboard 键盘'ki:b :dmouse 鼠标mauschip 芯片t ipCD-R 光盘刻录机HUB 集线器Modem= MOdulator-DEModulator; 调制解调器'm udem'm djuleit di:'m djuleitP-PPlug and Play 即插即用pl ɡ pleiUPSUninterruptable Power Supply 不间断电源 nint 'r pt b l pau s 'plaiBIOSBasic-input-Output System 基本输入输出系统'beisik 'input 'autput 'sist mCMOSComplementary- Metal-Oxide-Semiconductor k mpli'ment ri 'met l ' ksaid semik n'd kt 互补金属氧化物半导体setup安装set puninstall卸载 nin'st :lwizzard向导'wiz dOSOperation System操作系统 p 'rei n 'sist mOAOffice AutoMation办公自动化' fis :t 'mei nedit编辑'editcopy复制'k picut剪切k tpaste粘贴peistdelete删除di'li:tselect选择si'lektfind查找faindselect all全选si'lekt :lreplace替换ri'pleisundo撤消 n'du:redo重做 ri:'du:program程序'pr uɡr mlicense许可证'lais nsback前一步'b knext下一步'nekstfinish结束'finifolder文件夹'f uldDestination Folder目的文件夹desti'nei n 'f uld user用户'juzclick点击klikdouble click双击'd bl klikright click右击rait kliksettings设置'setiupdate更新 p'deitrelease发布ri'li:sdata数据'deitdata base数据库'deit beisDBMSData Base ManageSystem数据库管理系统'deit beis 'm nid 'sist m view视图vju:insert插入in's :tobject对象' bd iktconfiguration配置k n;fiɡju'rei ncommand命令k 'mɑ:nddocument文档'd kjum ntPOSTpower-on-self-test电源自检程序 power n self test cursor光标'k :sattribute属性' tribju:ticon图标'aik nservice pack服务补丁's :vis p koption pack功能补丁' p n p kDemo演示'dem ushort cut快捷方式 :t k texception异常ik'sep ndebug调试di:'b ɡprevious前一个'pri:vj scolumn行'k l mrow列r urestart重新启动ri:'stɑ:ttext文本tekstfont字体 f ntsize大小saizscale比例skeilinterface界面'int feisfunction函数'f k naccess访问' ksesmanual指南'm nju lactive激活' ktivcomputer language计算机语言k m'pju:t 'l ɡwidmenu菜单'menjuGUIgraphical user interfaces 图形用户界面'ɡr fik l juz 'int feistemplate模版'templitpage setup页面设置peid 'set ppassword口令'pɑ:sw :dcode密码k udprint preview打印预览print pri:'vju:zoom in放大zu:m inzoom out缩小zu:m autpan漫游p ncruise漫游kru:zfull screen全屏ful skri:ntool bar工具条tu:l bɑ:status bar状态条'steit s bɑ:ruler标尺'ru:ltable表'teiblparagraph段落'p r ɡrɑ:fsymbol符号'simb lstyle风格stailexecute执行'eksikju:tgraphics图形'ɡr fiksimage图像'imidUnix用于服务器的一种操作系统'ju:niksMac OS苹果公司开发的操作系统OOObject-Oriented面向对象' bd ikt' :rientid virus病毒'vai r sfile文件'failopen打开' up nclose关闭kl uznew新建nju:save保存seivexit退出'eksitclear清除klidefault默认di'f :ltLAN Local Area Network局域网'l uk l 'ε ri 'netw :kWAN Wide Area Network广域网waid'ε ri 'netw :kClient/Server客户机/服务器'klai nt 's :vATM AsynchronousTransfer Mode异步传输模式ei'si kr n s tr nsf m udWindows NT微软公司的网络操作系统Internet互联网'int netWorld Wide Web万维网w :ld waid webprotocol协议'pr ut k lHTTP Hyper Text Transfer Protocol超文本传输协议'haip tekst tr nsf 'pr ut k lFTP File Transfer Protocol文件传输协议'fail tr nsf 'pr ut k lBrowser浏览器'brauzhomepage主页'h umpeidWebpage网页'webpeidwebsite网站'websaitURL 在Internet的服务程序上用于指定信息位置的表示方法Uniform Resource Locator'ju:nif :m ri's :s l u'keitOnline在线' nlainEmail电子邮件'i:'meilICQ网上寻呼Firewall防火墙'fai w :lGateway网关'ɡeitweiHTML Hypertext Markup Language超文本标识语言'haip tekst 'mɑ:k p 'l ɡwidhypertext超文本'haip teksthyperlink超级链接'haip li kIPAddress互联网协议地址Internet Protocol'int net 'pr ut k l 'dresSearch Engine搜索引擎s :t 'end inTCP/IP用于网络的一组通讯协议Transmission Control Protocol trnz'mi n k n'tr ul 'pr ut k lTelnet远程登录'telnetIEInternet Explorer探索者微软公司的网络浏览器'int net ik'spl :rNavigator引航者网景公司的浏览器'n viɡeitmultimedia多媒体m lti'mi:diISO国际标准化组织International Standardization Organization int 'n n l st nd dai'zei n :ɡ nai'zei n二、软件类SoftwareANSI American National Standards Institute美国国家标准协会'merik n 'n n l 'st nd dz 'institjutable 能'eiblactive file 活动文件' ktiv 'failadd watch 添加监视点 d w tall files 所有文件 :l 'failsall rights reserved 所有的权力保留 :l rights ri'z :vd altdirlst切换目录格式and other information 以及其它的信息 nd ' e inf 'mei n archive file attribute 归档文件属性'ɑ:kaiv fail 'tribju:t assign to 指定到 'sain tu:autoanswer 自动应答' :t u 'ɑ:nsautodetect 自动检测' :t u di'tektautoindent 自动缩进' :t u in'dentautosave 自动存储' :t u seivavailable on volume 该盘剩余空间 'veil bl n 'v lju:mbad command 命令错b d k 'mɑ:ndbad command or filename 命令或文件名错 b d k 'mɑ:nd :'fail;neimbatch parameters 批处理参数 b t p 'r mit zbinary file 二进制文件'bain ri 'failBorland international borland国际公司'b l nd int 'n n l bottom margin 页下空白'b t m 'mɑ:d inby date 按日期bai deitby extension 按扩展名bai ik'sten nby name 按名称bai neimbytes free 字节空闲baits fri:callstack 调用栈k :l st kcasesensitive 区分大小写keis'sensitivcentral point software inc incorporated central point 软件股份公司'sensitiv p int 's ftwε i k 'sentr l p intchange directory 更换目录t eind di'rekt richange drive 改变驱动器t eind draivchange name 更改名称t eind neimcharacter set 字符集'k r kt setchecking for 正在检查't eki f :change drive path 改变盘/路径t eind draiv pɑ:θchoose one of the following 从下列中选一项t u:z w n v e 'f l uiclear all 全部清除kli :lclear all break points 清除所有断点kli :l breik p intsclear attribute 清除属性kli 'tribju:tclear command history 清除命令历史kli k 'mɑ:nd 'hist riclear screen 清除屏幕kli skri:nclose all 关闭所有文件kl uz :lcode generation 代码生成k ud d en 'rei ncolor palette 彩色调色板'k l 'p litcommand line 命令行k 'mɑ:nd laincommand prompt 命令提示符k 'mɑ:nd pr mptcompressed file 压缩文件 k m'prest 'failconventional memory 常规内存k n'ven n l 'mem ricopy diskette 复制磁盘'k pi 'disketcopyright 版权'k pi;raitcreate dos Disk Operating System partition or logical dos drive 创建DOS分区或逻辑DOS驱动器kri'eit du:z pɑ:'ti n : 'l d ik l du:z draivcreate extended dos partition 创建扩展DOS分区kri'eitik'stendid du:z pɑ:'ti ncreate primary dos partition 创建DOS主分区kri'eit 'praim ri du:z pɑ:'ti ncreate a directory 创建一个目录kri'eit di'rekt ricurrent file 当前文件'k r nt 'faildefrag 整理碎片di'fr ɡdele 删去'di:li:deltree 删除树'deltri:device driver 设备驱动程序di'vais draivdialog box 对话栏'dai l ɡ b ksdirection keys 方向键di'rek n ki:zdirectly 直接地di'rektlidirectory list argument 目录显示变量di'rekt ri list 'ɑ:ɡjum ntdirectory listing 目录清单di'rekt ri 'listidirectory structure 目录结构di'rekt ri 'str ktdisk access 磁盘存取disk ' ksesdisk copy 磁盘拷贝disk 'k pidisk space 磁盘空间disk speisdisplay file 显示文件dis'plei 'faildisplay options 显示选项dis'plei ' p nzdisplay partition information 显示分区信息dis'plei pɑ:'ti n inf 'mei ndos shell DOS 外壳du:z eldouble click 双击'd bl klikdrive letter 驱动器名draiv 'letedit menu 编辑选单'edit 'menju:ems Enhanced Message Service memory ems内存end of file 文件尾end v 'failend of line 行尾end v lainenter choice 输入选择'ent t isentire disk 转换磁盘'ent diskenvironment variable 环境变量in'vai r nm nt 'vε ri blevery file and subdirectory 所有的文件和子目录'evri 'fail nd s bdi'rekt riexisting destination file 已存在的目录文件时iɡ'zistidesti'nei n fileexpanded memory 扩充内存ik'spendid 'mem riexpand tabs 扩充标签ik'spendid t bzexplicitly 明确地ik'splisitlifastest 最快的fɑ:st istfat file system fat 文件系统 f t 'failfdisk options fdisk选项' p nzfile attributes 文件属性'fail 'tribju:tfile format 文件格式'fail 'f :m tfile functions 文件功能'fail 'f k nzfile selection 文件选择'fail si'lek nfile selection argument 文件选择变元'fail si'lek n 'ɑ:ɡjum ntfiles in 文件在'failz infiles in subdirectory 子目录中文件'failz in s bdi'rekt rifiles listed 列出文件'failz 'listidfile spec specification文件说明'failz spesifi'kei nfiles selected 选中文件'failz si'lektidfind file 文件查寻faind 'failfixed disk 硬盘fikst diskfixed disk setup program 硬盘安装程序fikst disk 'set p 'pr uɡrmfixes errors on the disk 解决磁盘错误fiksis 'er rz n e diskfloppy disk 软盘'fl pi diskformat diskette 格式化磁盘'f :m t 'disketformats a disk for use with msdos 格式化用于MS-DOS的磁盘'f :m ts disk f :form feed 进纸 f :m fi:dfree memory 闲置内存fri: 'mem rifull screen 全屏幕ful skri:nfunction procedure 函数过程'f k n pr 'si:dgraphical 图解的'ɡr fik lgraphics library 图形库'ɡr fiks 'laibr rigroup directories first 先显示目录组ɡru:p di'rekt riz f :sthang up 挂断'h phard disk 硬盘hɑ:d diskhardware detection 硬件检测'hɑ:dwε di'tek nhasbeen 已经h z bi:nhelp file 帮助文件help 'failhelp index 帮助索引help 'indekshelp in formation 帮助信息help in f :'mei nhelp path 帮助路径help pɑ:θhelp screen 帮助屏help skri:nhelp text 帮助说明help teksthelp topics 帮助主题help 't pikshelp window 帮助窗口help 'wind uhidden file 隐含文件'hid n 'failhidden file attribute 隐含文件属性'hid n 'fail 'tribju:thowto 操作方式hau tu:ignore case 忽略大小写iɡ'n : keisincorrect dos 不正确的DOS ink 'rekt du:zincorrect dos version DOS 版本不正确ink 'rekt du:z 'v : nindicates a binary file 表示是一个二进制文件'indikeits 'bain ri 'failindicates an ascii text file 表示是一个ascii文本文件'indikeits n ' ski tekst 'failinsert mode 插入方式in's :t m udinstead of using chkdsktry using scandisk 请用scandisk;不要用chkdskinuse 在使用in ju:zinvalid directory 无效的目录'inv li:d di'rekt rikbytes 千字节keibaitskeyboard type 键盘类型'ki:b :d taiplabel disk 标注磁盘'leibl disklaptop 膝上'l pt plargest executable program 最大可执行程序'la:d ist 'eksikju:t bl 'pr uɡr mlargest memory block available 最大内存块可用'la:d ist 'mem ri bl k 'veil blleft handed 左手习惯left'h ndidleft margin 左边界left 'mɑ:d inline number 行号lain 'n mbline spacing 行间距lain 'speisilist by files in sorted order 按指定顺序显示文件list bai 'fails in 's :tid ' :dlistfile 列表文件list 'faillistof 清单list vlocatefile 文件定位l u'keit 'faillook at 查看luk tlook up 查找luk pmacroname 宏名字'm kr u neimmake directory 创建目录meik di'rekt rimemory information 内存信息'mem ri inf 'mei nmemory model 内存模式'mem ri 'm d lmenu bar 菜单条'menju: bɑ:menu command 菜单命令'menju: k 'mɑ:ndmessage window 信息窗口'mesid 'wind umicrosoft 微软'maikr us ftmicrosoft antivirus 微软反病毒软件'maikr us ft nti'vai r s microsoft corporation 微软公司'maikr us ft k :p 'rei n modem setup 调制解调器安装'm udem 'set pmodule name 模块名'm dju:l neimmonitor mode 监控状态'm nit m udmonochrome monitor 单色监视器'm n kr um 'm nitmoveto 移至mu:v tu:multi 多'm ltinew data 新建数据nju: 'deitnewer 更新的njunew file 新文件nju: 'failnew name 新名称nju: neimnew window 新建窗口nju: 'wind unote use deltree cautiously 注意:小心使用deltreeonline help 联机求助' nlain helpoptionally 可选择地' p n lipage frame 页面peid freimpagelength 页长peid le θpc tools pc工具pi: 'si: tu:lzpostscript 附言p ust skriptprint all 全部打印print :lprint device 打印设备print di'vaisprinter port 打印机端口'print p :tprogram file 程序文件'pr uɡr m 'failpull down 下拉pul daunpull down menus 下拉式选单pul daun menjuzquick format 快速格式化kwik 'f :m tquick view 快速查看kwik vju:read only file 只读文件ri:d ' unli 'failread only file attribute 只读文件属性ri:d ' unli 'fail 'tribju:tread only mode 只读方式ri:d ' unli m udredial 重拨ri:'dai lrepeat last find 重复上次查找ri'pi:t lɑ:st faindreport file 报表文件ri'p :t 'failresize 调整大小ri'saizrespectively 分别地ri'spektivliright margin 右边距rait 'mɑ:d inroot directory 根目录ru:t di'rekt riruntime error 运行时出错r n'taim 'ersave all 全部保存seiv :lsave as 另存为seiv zscan disk 磁盘扫描程序sk n diskscreen colors 屏幕色彩skri:n 'k l zscreen options 屏幕任选项skri:n ' p nzscreen saver屏幕保护程序屏幕暂存器skri:n 'seiv screen size 屏幕大小skri:n saizscroll bars 翻卷栏skr ulscroll lock off 滚屏已锁定skr ul l k :fsearch for 搜索s :t f :sectors per track 每道扇区数'sekt z p : tr kselect group 选定组si'lekt ɡru:pselection bar 选择栏si'lek n bɑ:set active partition 设置活动分区set' ktiv pɑ:'ti n set up options 安装选项set p ' p nzshort cut keys 快捷键 :t k t ki:zshow clipboard 显示剪贴板 u 'klipb :dsingles ide 单面'si ɡl z aidsize move 大小/移动saiz mu:vsorthelp S排序H帮助s :t helpsortorder 顺序s :t ' :dstack over flow 栈溢出st k ' uv fl ustand alone 独立的st nd 'l unstart up options 启动选项stɑ:t p ' p nz status line 状态行'steit s lainstep over 单步step ' uvsummary of 摘要信息's m ri vswap file 交换文件sw p 'failswitch to 切换到swit tu:sync 同步si ksystem file 系统文件'sist m 'failsystem files 系统文件'sist m 'failzsystem information 系统信息'sist m inf 'mei n table of contents 目录'teibl v 'k ntents terminal emulation 终端仿真't :min l emju'lei n terminal settings 终端设置't :min l 'seti ztest file 测试文件test 'failtest file parameters 测试文件参数test 'fail p 'r mit z the active window 激活窗口e ' ktiv 'wind utoggle break point 切换断点't ɡl breik p intto msdos 转到MS-DOStop margin 页面顶栏t p 'mɑ:d inturn off 关闭t :n :funmark 取消标记 n mɑ:kunselect 取消选择 n si'lektuse bare format 使用简洁方式ju:z bε 'f :m tuse lower case 使用小写ju:z 'l u keisuse wide list format 使用宽行显示ju:z waid list 'f :m t use help 使用帮助ju:z helpverbosely 冗长地v :'b uslivideo mode 显示方式'vidi u m udview window 内容浏览vju: 'wind uviruses 病毒'vai r sizvision 景象'vi nvollabel 卷标volume label 卷标'v lju:m 'leiblvolume serial number is 卷序号是'v lju:m 'si ri l 'n mb izwindows help windows 帮助'wind uz helpword wrap 整字换行w :d r pworking directory 正在工作的目录'w :ki di'rekt riworm 蠕虫w :mwrite mode 写方式rait m udwrite to 写到rait tu:expanded memory 扩充内存ik'spendid 'mem ri三、网络类Network网络安全方面的专业词汇Access Control ListACL 访问控制列表' kses k n'tr ul listaccess token 访问令牌' kses 't uk naccount lockout 帐号封锁 'kaunt 'l kautaccount policies 记帐策略 'kaunt 'p lisizaccounts 帐号 'kauntsadapter 适配器 'd ptadaptive speed leveling 自适应速率等级调整 'd ptiv spi:d 'lev liAddress Resolution ProtocolARP 地址解析协议 'dres rez 'lu: n 'pr ut k lAdministrator account 管理员帐号 d'ministreit 'kauntARPANET 阿帕网internet的前身algorithm 算法' lɡ rie malias 别名小应用程序'eili sallocation 分配、定位 l u'kei nallocation layer 应用层 l u'kei n 'lei API 应用程序编程接口anlpasswd 一种与Passwd+相似的代理密码检查器applications 应用程序 pli'kei nzATM 异步传递模式attack 攻击 't kaudio policy 审记策略' :di u 'p lisi auditing 审记、监察' :ditiback-end 后端'b kendborder 边界'b :dborder gateway 边界网关'b :d 'ɡeitwei breakable 可破密的'breik blbreach 攻破、违反bri:tcipher 密码'saifciphertext 密文'saif tekstCAlass A domain A类域 d u'meinCAlass B domain B类域CAlass C domain C类域classless addressing 无类地址分配'klɑ:slis 'dr si cleartext 明文 kli tekstCSNW Cusmmer Service for NetwareNetware客户服务client/server 客户、客户机/服务器'klai nt s :vcode 代码k udCOM port COM通信端口p :tCIX 服务提供者computer name 计算机名k m'pju:t neimcrack 闯入kr kcryptanalysis 密码分析kript 'n lisisDLC data link control数据链路控制'deit li k k n'tr ul decryption 解密di:'krip ndatabase 数据库'deit beisdefault route 缺省路由di'f :lt ru:tdefault share 缺省共享di'f :lt εdenial of service 拒绝服务di'nai l v 's :vis dictionary attack 字典式攻击'dik n ri 't kdirectory 目录di'rekt ridirectory replication 目录复制di'rekt ri repli'kei ndomain 域 d u'meindomain controller 域名控制器 d u'mein k n'tr uldomain name 域名域名其实就是入网计算机的名字;它的作用就象寄信需要写明人们的名字、地址一样重要..域名结构如下:计算机主机名.机构名.网络名.最高层域名..域名用文字表达;比用数字表达的IP地址容易记忆..加入Internet的各级网络依照DNS的命名规则对本网内的计算机命名;并负责完成通讯时域名到IP地址的转换 ..DNS 域名服务器DNSDomain Name System;域名系统是指在 Internet上查询域名或IP地址的目录服务系统..在接收到请求时;它可将另一台主机的域名翻译为IP地址;或反之..大部分域名系统都维护着一个大型的数据库;它描述了域名与 IP地址的对应关系;并且这个数据库被定期地更新..翻译请求通常来自网络上的另一台计算机;它需要IP地址以便进行路由选择..DDE Domain Name Exchange动态数据交换 d u'mein neim iks't eindDHCP Dynamic Host Configuration Protocol动态主机配置协议dai'n mik h ust k nfiɡju'rei n 'pr ut k lencryption 加密in'krip nEGP Exterior Gateway Protocol外部网关协议ik'sti ri 'ɡeitwei 'pr ut k lFDDI Fiber Distributed Data Interface光纤分布式数据接口'faib di'stribjutid 'deit 'int feisFAT File Allocation Table文件分配表'fail l u'kei n 'teiblFTPFile Transfer Protocol 文件传送协议'fail 'tr nsf 'pr ut k lfilter 过滤器filtfirmware 固件'f :mwεflooding 淹没'fl diGSNW Gateway Service for Network NetWare网关服务'ɡeitwei 's :vis f : 'netw :kGDIGraphical Device Interface 图形设备界面'ɡr fik l di'vais'int feisGUI Graphical User Interface图形用户界面'ɡr fik l 'ju:z 'ju:zHTML Hyper Text Markup Language超文本标记语言'haip tekst'mɑ:k p 'l ɡwidHTTP Hypertext Transfer Protocol超文本传送协议'haip tekst 'tr ns'f 'pr ut k lIGP Interior Gateway Protocol内部网关协议in'ti ri 'ɡeitwei 'pr ut k lICMPInternet Control Message Protocol 网际控制报文协议'int net k n'tr ul 'mesid 'pr ut k lICMP用来发送关于IP数据报传输的控制和错误信息的TCP/IP协议..当一个IP数据报不能传送到目的地时;可能是因为目的地的机器暂停服务或者信息交通阻塞;路由器可能使用ICMP将失败信息通知发送者..IGMPInternet Group Management Protocol'int net ɡru:p 'm nid m nt 'pr ut k Internet群组管理协议这种TCP/IP协议允许Internet主机参加多点播送multicasting----一种向计算机群广播信息的有效手段IIS Internet Information Server信息服务器'int net inf 'mei n s :vIPInternet Protocol 网际协议'int net 'pr ut k lIRC Internet Relay Chat网上交谈'int net 'ri:lei t tISP Internet Service Provider网络服务提供者'int net 's :vis pr u'vaidIPX Internet Packet eXchange互连网分组协议'int net 'p kit iks't eindIPC Internet Process Connection进程间通信'int net 'pr uses k 'nek nIRQ Interrupt Request中断请求int 'r pt ri'kwestIP address IP地址 'dresIP地址称作网络协议地址;是分配给主机的一个32位地址;由4个字节组成;分为动态IP地址和静态IP地址两种..动态IP地址指的是每次连线所取得的地址不同;而静态IP地址是指每次连线均为同样固定的地址..一般情况下;以电话拨号所取得的地址均为动态的;也就是每次所取得的地址不同..IP masquerade IP伪装m sk 'reidIP spoofing IP欺骗'spu:fiLAN Local Area Network局域网'l uk l 'ε ri 'netw :kLPC local procedure call局部过程调用'l uk l pr 'si:d k :lNNTP Network News Transfer Protocol网络新闻传送协议'netw :k nju:z 'tr ns'f 'pr ut k lPPP Point-to-Point Protocol点到点协议p int 'pr ut k l称为点对点通信协议Point to Point Protocol;是为适应那些不能在网络线上的使用者;通过电话线的连接而彼此通信所制定的协议..PDC Primary Domain Controller主域控制器'praim ri d u'mein k n'tr ulTelnet 远程登陆'telnetTCP Transmission Control Protocol传输控制协议/网际协议tr nz'mi n k n'tr ul 'pr ut k lTCP/IP通信协议主要包含了在Internet上网络通信细节的标准;以及一组网络互连的协议和路径选择算法..TCP是传输控制协议;相当于物品装箱单;保证数据在传输过程中不会丢失..IP是网间协议;相当于收发货人的地址和姓名;保证数据到达指定的地点..TFTP Trivial File Transfer Protocol普通文件传送协议'trivi l'fail 'tr ns'f 'pr ut k lTFTP是无盘计算机用来传输信息的一种简化的FTP协议..它非常之简单;所以可固化在硬盘上;而且支持无认证操作..TFTP是一种非常不安全的协议..Trojan Horse 特洛伊木马'tr ud n h :sURL Uniform Resource Locator统一资源定位器'ju:nif :m ri's :s l u'keitUDP User Datagram Protocol用户数据报协议'ju:z 'deit ɡr m 'pr ut k lVDM 虚拟DOS机UUCP Unix to Unix Copy Protocol'ju:niks 'k pi 'pr ut k l是一种基于猫的使用已经很久的文件传输协议;有时候还使用它在Internet上传输Usenet新闻和E-mail;尤其是在那些间断性联网的站点上..现在很少站提供匿名的UUCP来存取文件..而它做为一种文件传输协议;只有那些没有入网而使用猫的用户使用此方法..World Wide Web w :ld waid web万维网;是Internet最新的一种信息服务..它是一种基于超文本文件的交互式浏览检索工具..用户可用在Internet网上浏览、传递、编辑超文本格式的文件..WAN Wide Area Network广域网waid 'ε ri 'netw :kvirtual server 虚拟服务器'v :t u l s :vUsenet ju:znet用户交流网Usenet是网络新闻服务器的主要信息来源enet完全是一个民间自发建立的;使用Internet交换信息但又不完全依赖Internet进行通讯的用户交流网络..使用Usenet的自愿者共同遵守一些约定的网络使用规则..USER name 用户名'ju:z neimUSER account 用户帐号'ju:z 'kauntWeb page 网页web peidOpenGL Open Graphic Language开放图形语言' up n 'ɡr fik 'l ɡwidODBC open database connection开放数据库连接' up n deit beis k 'nek nPCI peripheral Component Interconnect 外设连接接口p 'rif r l k m'p un nt int k 'nekt四、其它authentication 认证、鉴别:;θenti'kei nauthorization 授权:θ rai'zei nBack Office Microsoft公司的一种软件包 b k ' fisBack up 备份b k pbackup browser 后备浏览器'b k p 'brauzBDC backup domain controller备份域控制器'b k p d u'mein k n'tr ulbaseline 基线'beislainBIOS basic input/output system基本输入/输出系统'beisik 'input 'sist mBinding 联编、汇集'baindibit 比特、二进制位bitBOOTP bootstrap protocol引导协议'bu:tstr p 'pr ut k lBGP Border Gateway Protocol引导网关协议'b :d 'ɡeitwei 'pr ut k lBottleneck 瓶径'b tlnekbridge 网桥、桥接器bridbrowser 浏览器'brauzbrowsing 浏览'brauzichannel 信道、通路't n lCSU/DSU channel Service Unit/ Data Service Unit信道服务单元/数字服务单元't n l 's :vis 'ju:nit 'deitChecksum 校验和't eks mCluster 簇、群集'kl stCGI Common gateway interface公共网关接口'k m n 'ɡeitwei 'int feisCGICommon Gateway Interface公用网关接口是一个可以产生相同结果或结果随用户输入而变化的程序..它可以用一种解释性的界面语言编写;也可以用一种编译方式的编程语言编写..CGI规定了Web服务器调用其它可执行程序的接口协议标准..Web服务器通过调用CGI程序实现和Web浏览器的交互;也就是CGI程序接受Web浏览器发送给Web服务器的信息;进行处理;并将响应结果再回送给Web服务器和Web浏览器..CGI程序一般完成Web网页中表单数据的处理、数据库查询和实现与传统应用系统的集成等工作..CGI程序虽然可以用任何程序设计语言编写;但是用C语言编写的CGI程序具有执行速度快、安全性高等特点..CGI-based attack beist 't k基于CGI攻击它利用公共网关接口的脆弱点进行攻击;通常借助站点进行crash崩溃系统突然失效;需要从新引导krCD-ROM 只读型光盘Component 组件k m'p un ntdata link 数据链路'deit li kdatagram 数据报'deit ɡr mdefault document 缺省文档di'f :lt 'd kjum ntdigital key system 数字键控系统'did it l ki: 'sist mdisk mirroring 磁盘镜像disk 'mir ridistributed file system 分布式文件系统di'stribjutid 'fail'sist mdata-driven attack'deit driv n 't k数据驱动攻击依靠隐藏或者封装数据进行的攻击;那些数据可不被察觉的通过防火墙..DNS spoofing域名服务器电子欺骗攻击者用来损害域名服务器的方法;可通过欺骗DNS的高速缓存或者内应攻击来实现的一种方式通常为攻击者假扮合法的DNS服务器角色DoS不是DOS;这个是denial of service;为服务拒绝di'nai l v's :vis用户恶意使用网络信息服务器时;将拒绝为合法的用户提供服务..eavesdropping 窃听、窃取'i:vz;dr piencrypted tunnel 加密通道in'kriptidenterprise network 企业网'ent praiz 'netw :kEthernet 以太网'i:θ ;netExternal security 外部安全性ik'st :n l si'kju ritienvironment variable 环境变量in'vai r nm nt 'vε ri blfax modem 传真猫 f ks 'm udemfile attribute 文件属性'fail 'tribju:tfile system 文件系统'fail 'sist mFORM 格式f :mfragment 分段'fr ɡm ntframe relay 桢中继freim 'ri:leifirewall 防火墙'fai w :lFirework防火墙是加强加 Internet 与 Intranetp内部网之间安全防范的一个或一组系统..防火墙可以确定哪些内部服务允许外部访问;哪些外人被许可访问所允许的内部服务;那些外部服务可由内部人员访问..为了使防火墙发挥效力;来自和发往 Internet 的所有信息都必须经由防火墙出入.. 防火墙只允许授权信息通过;而防火墙本身不能被渗透..gated daemon gated进程是一种早期的UNIX寻径服务'ɡeitid 'di:m nglobal account 全局帐号'ɡl ub l 'kauntglobal group 全局组'ɡl ub lɡru:pgroup account 组帐号ɡru:p 'kauntgroup identifier 组标识符ɡru:p ai'dentifaiHCL Hardware Compatibility List硬件兼容性表'hɑ:dwε k m;p t 'bil ti listhash 散表hHPFS High Performance File System高性能文件系统hai p 'f :m ns 'fail 'sist mHome directory 主目录h um di'rekt rihome page 主页h um peidhop 驿站、中继段h phost 主机h usthyperlink 超文本链接'haip li khighjacking 'haid ki 劫持终端;即为攻击者捕获另一个用户会话的控制..这是很少发生的;一旦发生就表明目标的安全性已经被破坏.. 其实NetXRay 在这一点就做的很好..HTPASSWD 一种用密码来保护UNIX上的站点的系统icon 图标'aik nimpersonation attack 伪装攻击im;p :s 'nei n 't kindex server 索引服务器'indeks s :vISA Industry Standard Architecture工业标准结构'ind stri 'st nd d 'ɑ:kitektInherited Rights Filter 继承权限过滤器in'heritid raits filtISDN Integrated Services Digital Network综合业务数字网'intiɡreitid 's :visis 'did it l 'netw :kinteractive user 交互性用户int r' ktiv ju:zintermediate system 中介系统int 'mi:dj t 'sist minternal security 内部安全性in't :n l si'kju ritiInternet ExplorerIE IBM的万维网浏览器'int net ik'spl :rInternet server 因特网服务器'int net s :vInterpreter 解释程序in't :pritintranet 内联网;企业内部网'intr netintruder 入侵者in'tru:dIMAP Internet Message Access Protocol一种邮件协议'int net 'mesid ' kses 'pr ut k l是Internet Message Access Protocal 的缩写..IMAP 提供了一个在远程服务器上管理邮件的手段;它与POP 协议相似;但功能比POP 要多;功能包括:只下载邮件的标题、建立多个邮箱和在服务器上建立保存邮件的文件夹..Java Virtual Machine Java虚拟机'v :t u l m ' i:njava script skript基于Java语言的一种脚本语言jack in 一句黑客常用的口语;意思为破坏服务器安全的行为 d k inkernel 内核'k :n lkeys 密钥ki:zkeyspace 密钥空间ki: speisKeystroke Recorder按键记录器一些用语窃取他人用户名和密码的工具'ki:str uk ri'k :dLAN Server 局域网服务器Local security 局部安全性'l uk l si'kju ritilog 日志、记录l ɡlogging 登录'l ɡilogoff 退出、注销l ɡ :flogical port 逻辑端口'l d ik l p :tlogon 注册'l ug nlogon script 登录脚本'l ug n skriptLFN Long File Name长文件名l 'fail neimlogic bomb逻辑炸弹'l d ik b m一种可导致系统加锁或者故障的程序或代码..mass browser 主浏览器m s 'brauzMAPI 是Messaging Application Programming Interface 'mesid i pli'kei n 'pr uɡr mi 'int feis的缩写..微软和其它一些公司开发了MAPI;可使Windows 应用程序接入到从Microsoft Mail 到Novell MHS 的多种消息系统..但是; MAPI 仅限于在日常工作的水平上工作;即感知邮件的应用程序;它可在网络上交换邮件与数据..member server 成员服务器'memb s :vmenu 菜单'menju:message 消息'mesidmultilink 多链接'm ltili kMIME Multipurpose Internet Mail Extensions多媒体Internet邮件扩展m lti'p :p s 'int net meil ik'sten nzMPR Multi Protocol Router多协议路由器'm lti 'pr ut k l 'rautmultiprocessing 多重处理m lti'pr usesiModule 模块'm dju:lmultihomed host 多穴主机'm ltih umd h ustnamed pipes 命名管道neimd paipsNDS NetWare Directory Service NetWare目录服务net di'rekt ri's :visNetBEUI NetBIOS扩展用户接口NetBIOS gateway NetBIOS网关NDIS Network Driver Interface Specification网络驱动程序接口规范'netw :k draiv 'int feis spesifi'kei nNetDDE Network Dynamic Data Exchange网络动态数据交换'netw :k dai'n mik 'deit iks't eindNIC Network Interface Card网络接口卡'netw :k 'int feis kɑ:dnetwork layer 网络层'netw :k 'leiNetwork Monitor 一个网络监控程序'netw :k 'm nitnetwork operating system 网络操作系统'netw :k ' p reiti 'sist mnetwork printer 网络打印机'netw :k 'printnetwork security 网络安全'netw :k si'kju ritinetwork user 网络用户'netw :k ju:zNFS Network File System网络文件系统'netw :k 'fail 'sist m。
艾默生DELTAV系统常见英语单词
baud rate Bi-directional Edge Trigger Bias/Gain (BG) bind block Books Online Boolean Fan Input Boolean Fan Output broker Broadcast Mode browse Bulk Edit bulk power button
命名集 网络 网络时间服务器 网络拓扑 神经网络 节点 互斥或非
O OPC Data Server operation object Off Delay Timer On Delay Timer One-Click Lockdown Online Help operand Operator Graphic Operator Keyboard display Operator Station Out of Service overview
可扩展参数 外部阶段 外部引用
F Foundation Fieldbus(FF) faceplate Failure Monitor Fault-tolerant server Fiber Switch Fiber-Optic Cable field wiring Fieldbus H1 card Fieldbus Power Hub Fieldbus port filter fire and gas firewall Flow Meter Force a Transition Force an Input Format Specification Files formula Function Block
条件
Conditional Alarming
HP Quality Center用户手册说明书
Deliver enhanced business results through high-quality applicationsIn today’s digitally powered business landscape, applications are core to any business process and ultimately to every business outcome. Organizations cannot afford to deliver a poor-quality application as the costs to the business can be severe. To prevent this outcome, organizations must ensure that their applications function and perform at the levelsdemanded by the business. In addition, security has come forward as a critical aspect of application quality. Applications must be secure from the risk of exploitation by hackers. Functionality, performance, and security all drive quality processes and testing methods. And, the Quality Assurance (QA) teamneeds a modern, automated, and integrated platform to manage and control these critical aspects toachieve IT success in implementing applications that deliver for the business. HP Quality Center is that modern quality management platform.Too often organizations use standalone documents or a collection of disparate systems to keep track of their quality and testing efforts, including their testing assets. This can result in:• Increased risk of deploying a poor-quality application • A lack of consistent and repeatable processes • No single point of truth, clear priorities, or effective communication of vital information• Inefficient and redundant testing due to missing information• Inadequate visibility into project progress, and status • Many hours spent compiling reports that are immediately out of date• QA and development not working on what the business requiresTo help ensure the quality of an application byleveraging consistent, repeatable, and standardized processes, and to turn quality into a competitive advantage, thousands of organizations turn to HP Quality Center.HP Quality CenterDeliver high-quality applications at the speed of business with an integrated platform for requirements, test, and defect managementData sheetAbout HP Quality CenterHP Quality Center is the market-leading* quality management platform that scales from a single project to multiple, enterprise-wide projects and releases.It enables you to manage application quality witha consistent, repeatable process that reduces risk and costs, and increases efficiency across the entire application lifecycle.HP Quality Center delivers requirements management, release and cycle management, test management, defects management, and reporting, all within a single platform providing traceability and visibility across your entire process—delivering the information you need to make informed application release decisions. HP Quality Center is a Web-based solution that gives these often distributed teams access to a steel thread of critical project information. This information is the catalyst bridging the distributed teams in their related efforts to deliver high-quality applications that deliver business results—regardless of geographic and organizational boundaries, thereby facilitating communication and collaboration between business analysts, QA, and development teams.Key features and benefitsDefine and manage requirementsHP Quality Center provides a central repositoryfor defining, managing, and controlling software requirements so that the business needs are met.The HP Requirements Management module provides real-time visibility of requirements coverage and associated defects to evaluate quality and business risk. Multidimensional traceability is provided between requirements, source code, tests, and defects, across releases and test cycles, providing the confidence to make “go/no-go” decisions.HP Requirements Management allows for business process models to be imported and displayed, visually representing and communicating the defined business process flows. When requirements change, a change impact report provides visibility into the requirements and subsequent part of the business process affected, enabling you to avoid a full regression test aftereach change. Dispersed teams also receive prompt notification of any requirements changes that might impact the tasks they are working on.Align testing priorities based on risk Organizations typically do not have unlimited resources to fully test every requirement. HP Quality Center provides risk-based quality management to objectively assess and prioritize the highest-risk, highest-priority requirements. You can then fine-tune your testing effort based on quantifiable business risk. Accelerate manual testingHP Sprinter is the next generation of manual testing. Manual testing does not need to be tedious, error prone, or time consuming. HP Sprinter accelerates and revolutionizes the way manual tests are executed, automates data injection, and provides easy-to-use, built-in tools (such as screen capture and annotation, screen recorder, and system information capture) to exactly communicate results and defects. In addition, HP Sprinter supports simultaneous testing of an application across multiple machines and environments without the need for additional testers with innovative mirror testing.* I DC report: “Worldwide Automated Software Quality 2009–2013 Forecast and 2008 Vendor Shares”HP Quality Center is the industry leader* for quality management software designed for the challenges of today’s modern application environments. HP Quality Center manages and governs your quality processes, arming you with the capabilities you need to deliver high-quality applications efficiently and effectively.2Define test plansBased on the requirements, your testers can build test plans and design tests using HP Quality Center, or import them from Microsoft® Word or Excel.HP Quality Center provides a repository for both manual and automated tests (through HP Functional Testing software), including the ability to leverageHP Business Process Testing software for collaborative test design. By maintaining all test planning information in a central repository, team members can easily reuse entire test plans or individual test cases across project components and even different releases. Monitor quality across releases and cyclesThe Release Management module helps you manage application releases and cycles more efficiently. You can track the progress of an application release against your plan to determine whether your release is on track, allowing informed, real-time budgetary and release decisions.Schedule and run testsYour testing team can use the Test Lab module to run scheduled tests unattended, overnight, or when the system is in least demand. HP Quality Center supports various types of testing—functional, regression, load, unit, and integration—each with its own set of requirements, schedules, and procedures. By defining dependencies among tests, you can realistically emulate real-life business processes and make it easier to maintain and reuse the tests.Track defectsAnalyzing defects and defect trends helps you make effective “go/no-go” decisions while reducing the risk to the business. The Defects Management module supports the entire defect lifecycle—from initial problem detection through fixing the defect and verifying the fix. Before any new defect is submitted, HP Quality Center checks the database for similar defects, reducing duplication and removing the need for manual checking.Developer CollaborationIt is important that requirements and defects are communicated to developers without them needingto learn and use a new, additional tool. HP Quality Center provides supported integrations into integrated development environments and source code change management systems for linking tasks, requirements, and defects. Using HP Quality Center, developer tasks and code changes are tracked against the requirements in order to track project progress and evaluate risk.Use versioning and baseliningBuilt into HP Quality Center, version control is provided for requirements, tests, test scripts, and business components. Versioning allows distributed teams to collaborate and manage multiple versions ofrequirements and test assets in parallel, while providingan audit history of changes throughout the projectlifecycle. Baselining allows you to capture a group ofrequirements, tests, or test assets at strategic pointsin the project lifecycle to mark specific milestones.You can compare baselines to assess the impact ofchanges and enable rollback of assets, if required. Report and graph your quality processHP Quality Center has an integrated Dashboardmodule to centralize quality reporting so you canmake real-time decisions based on application statusacross projects and QA initiatives. HP Quality Centerallows report templates to be created and customizedaccording to your organization’s needs. Reportswithin HP Quality Center are easily exported intoMicrosoft Excel, letting your end users perform endlessdata manipulation. The document generator withinHP Quality Center allows you to push requirements,tests, defects, and their associated data to a MicrosoftWord document tailored to your needs.Manage your agile development and testing efforts The HP Quality Center Agile Accelerator is acustomized HP Quality Center project designed tohelp manage Agile development and testing efforts.It delivers predefined workflows, configurations, andrules to manage Agile processes, along with prebuiltuser roles and privileges, and Agile reporting such asburn-up, burn-down, and cross-sprint velocity charts. HP Quality Center—a key element in HP Application Lifecycle Management HP Application Lifecycle Management software furtherenhances IT’s ability to manage the complete lifecycleof a software project, enterprise release, or programfrom inception to delivery, enabling organizationsto establish best practices and common processesor move fully to a model of Application Center ofExcellences. HP Application Lifecycle Managementsoftware expands the value of HP Quality Center withthe following additional capabilities:• Project planning and tracking to manage milestonesand associate key performance indicators (KPIs)• Cross-project asset sharing and reuse to remove duplication of effort• Cross-project reporting to provide aggregatedmetrics and trends, giving you a holistic view• Cross-project customization to enforce standardizedprocesses and best practices centrally• Cross-project defect sharing to increasedeveloper efficiency in finding, prioritizing, andresolving defects3Get connected/go/getconnectedAdditional HP Quality CentermodulesBridge the quality gap between subject matterexperts and quality engineersHP Business Process Testing brings business analystsinto the process of defining business use cases andprocess flows to increase the accuracy of tests,aligning testing more closely to business outcomes.Using HP Business Process testing to define tests basedon the defined business processes, the test engineeris able to create reusable test components using bothmanual and automated methods and share them withdistributed quality teams within HP Quality Center.Get change impact and service-oriented qualitymanagementThe HP Service Test Management module is acomplementary solution that lets your IT teamsautomatically create QA testing requirements and testassets for composite applications and service-orientedarchitecture (SOA) services, often referred to as sharedservices. HP Service Test Management supportschange impact testing for composite applicationsand SOA services and integrates seamlessly withHP Application Governance software to enablepolicy-driven governance based on testing results.The HP Change Impact Testing module for SAPapplications is an integrated set of software,services, and best practices for automating key SAPquality activities. This module lets you improve yourapplications by focusing your testing at the right time onthe SAP transactions and business processes that areimpacted by changes, so you can release applicationswith high quality and at a low level of risk.Standardize security as part of your testingprocessBring security testing earlier into the ApplicationLifecycle and find security risks and defects when theyare less costly to fix. HP QAInspect software allowsQA to incorporate fully automated Web applicationsecurity testing into the overall test managementprocess without the need for specialized securityknowledge and without the risk of slowing aggressiveproduct release schedules.About HP BTO Application SolutionsHP BTO Application Solutions help ensuremodernization initiatives deliver business outcomesinstead of failing under the burden of outdated,legacy delivery mechanisms. Where rival solutionsmistake the software development lifecycle for a totalpicture of the application, HP sees core delivery inthe context of the complete application lifecycle—from business idea through retirement. Furthermore,by providing unified management and automationsolutions, HP offers customers not simply more toolsand integrations but greater simplicity. The result forenterprise application teams is improved predictability,repeatability, quality, and change readiness in boththe core and complete lifecycles.© Copyright 2007–2008, 2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissionscontained herein.Microsoft is a U.S. registered trademark of Microsoft Corporation.4AA1-2115ENW, Created May 2007; Updated August 2010, Rev. 2Share with colleagues。
艾默生DELTAV系统常见英语单词编译
艾默生Deltav系统常见英文单词编译
中文
英文
中止
Analog I/O Card
确认
Analog Voter
获取
Analog monitor
动作
Application Station
自适应整定
arbitration
添加
architecture
管理员
archive
先进控制
area
高级单元管理
Asset Optimization
手动模式
Marine Certified
海上认证
Master Recipe
主配方
matrix
矩阵
Media Converter
媒介转换器
Mid Selector (MID)
中值选择器
Migrate Database
迁移数据库
Model Predictive Control Process 模型预估控制过程仿真
别名解析表
Batch ID
模拟控制
Batch Operator Interface
波特率
card
双向边沿触发
carrier
偏差/增益
Cause and Effect Matrix (CEM)
中文 模拟量I/O卡件
模拟表决器 模拟监控 应用站
仲裁 架构 存档 厂区 资产优化 分配 授权 自动感应 自动更新 自动切换
diode Discrete I/O Card
Discrete Input Discrete Output
download dry contact Dynamo set
Extensible Parameter External Phase
幕墙专业英语术语表
幕墙外语词汇A安全防火隔热 fire-safing insulation安全荷载 safe load;safety load安全荷载系数 safety load factor安全帽 protecting cap;safety helmet安全设施 safety facilities安全系数 safety factor/coefficient安装 installation; erection安装标准 installation benchmark安装程序 installation procedure安装方法报告书 installation method statement 安装工程erection work安装就位 erecting and setting安装施工资格 installation qualification安装容差 installation toleranceB百分比 percentage百叶(窗)louver;shutter百叶跨度 length of the louver百叶帘venetion blind百叶铝板 aluminum louver panel百叶式出气口 louvered air outlet搬运 handling(n 装卸;转运)板;板块board; plate;panel;slab板材 plate办公楼 office building半径 radius;semidiameter半透明的 translucent包装 packaging保护 protect/protection保护(涂)层 protective coating保证(书)warranties保温材料 insulation material保温层 insulating layer保温顶棚heat insulated ceiling保温(岩)棉 insulation报价 bid;quote报价单 quotation背板 back-pan;lining; shadow box备注 remark比;比率 ratio比例 scale比例 proportion避雷保护 lightning protection编号 numbering;serial number边缘荷载 edge load边缘块 edge block变化系数variation coefficient变形 deform; deformation变形能力 movement capacity标称 nominal标记 mark/marking; indicator; label标价 bid price标单 bid sheet标签 label;checklist标示 display标书 bid;bidding document; tender document标志 signage标准 standard;criteria标准的 typical(规范的;成为标本的);standard标准尺寸 typical dimension标准版本 standards version标准构件 standard element标准间隔材料 standard spacer material标准节点 typical detail标准化 standardization标准值 characteristic value表面 surface表面处理 finish表面涂层 surface coating表面压缩应力 surface compression stress冰雪处理与缓和 ice and snow management and mitigation 丙烯酸喷涂 duracronglass panel wall; coated glass; twinkle wall波纹 corrugation波纹拉丝不锈钢板 stainless steel finish corrugated波形垫片 corrugated gasket波形铝板 corrugated aluminum sheet薄板 thin slab薄膜 film;membrane薄膜防水 membrane waterproofing补充文件supplement rider document不规则荷载 abnormal load不透明的 opaque不锈钢 stainless steel(S.S)不锈钢吊杆 S.S rod不锈钢暖气罩 S.S heating cover部分;局部 part部分的 partial部位 locationC擦窗机 gondola;擦窗设备BMU (building maintenance unit)擦窗设备公司 BMU supplier擦窗机荷载 gondola load擦窗设备荷载 BMU loads擦窗器 window cleaner材料 material材料审查报告 materials testing report采购 purchase;procure/procurement采购订单 purchase order采购活动 procurement activity采光顶 skylight采光系数 daylighting factor采用 adopt采用预埋件 embed model参考 reference;refer to;referenced参数 parameter操作 operate/operation槽钢 channel steel;channel槽口 notch侧,测向的 lateral侧塞块 side block测试 test; testing测试方案 test proposal测压孔 pressure tap测验 test;testing测验实体模型 testing mock-up叉车 fork lift truck产品 product产品保证 product guaranties长度 length长期 long time/term长期强度 long-term strength常温养护 normal temperature curing场地勘查 field survey场地条件 site condition超高层建筑 super high-rise building撤除 removal衬板 lining承包范围 extent of contractor;scope 承包商;承包人 contractor成本 cost成本分析 cost analysis成本核算 cost accounting成本控制 cost control承压面 bearing surface承压墙 bearing wall;carrying wall承压强度 bearing strength承载力 carrying /bearing capacity承载力系数 bearing capacity factor尺寸 size/dimension初步方案preliminary scheme初步概算 preliminary estimate初步规划 preliminary planning初步勘查 preliminary exploration初期养护 initial curing出入口 access;openings储存 storage处理 treatment;management;process 穿孔百叶 perforated louver传热路系统 heat-trace system传热系数 heat-transfer coefficient窗洞 window opening窗格 window division窗合页 window hinge窗框 window frame窗帘匣 pelmet窗棂 window bar窗扇 window sash窗台/槛 window sill垂直(方向)vertical;vertically垂直度 squareness垂直于 vertical to;perpendicular to垂直挡雨板 vertical rain-shield垂直幕墙 vertical curtain wall雌料 female material次支撑构件 secondary support member 磁锁 mag-lock粗糙 rough;roughness粗糙系数roughness factor存放期 shelf lifeD打胶 sealant installation打孔 holes drilling大跨度结构 long span structure大理石 marble大理石板 marble slab大理石墙面 marble wall face大理石饰面 marble finish单层索网幕墙 single-layer cable-net curtain wall单剪连接 one shear joint单位成本 unit cost单位面积 unit area单一货源责任 single source responsibility单元 unit单元式幕墙 unitized curtain wall挡风板 wind shield挡水板 flashing挡雨板 rain-shield导热 heat conduction导热系数 thermal conductivity灯架 light mounting灯具 lighting灯槽 light trough灯荷载 light load等边角钢Equal angle等效equivalent;equivalence等效荷载 equivalent load等效厚度 equivalent thickness等压设计 pressure equalization低碳钢 mild steel底部 bottom底漆 primer抵抗(力)矩resisting moment地震 earthquake地面粗糙度 ground roughness type地震测试 seismic rocking testing地震荷载 seismic load地震荷载作用效应组合系数 seismic load action combination coefficient 典型幕墙单元typical curtain wall unit点拨件 spider点支式幕墙 point supporting curtain wall电导管 electrical conduit电动开启窗 automatic operable vent垫块/塞块setting block垫片 shim垫圈 washer吊顶 ceiling吊顶板材 ceiling tile吊顶荷载 suspended-ceiling load吊顶梁 ceiling beam吊顶龙骨 ceiling joist吊顶主龙骨 main joist of suspended ceiling;main runner吊顶幕墙 overhang curtain wall吊顶体系 ceiling suspension system;suspended ceiling system 吊杆结构 suspending structure吊挂系统 hanger system顶部 top顶部采光 toplighting顶层 top level定期检查 regular inspection定期清洁 progressive cleaning定义 definition定位块 setting block定位螺钉 set screw动荷载 dynamic load; moving load洞口 opening动力系数 dynamic factor动力放大系数 dynamic amplificatory coefficient独立试验机构 independent testing agent镀锌处理 galvanize镀锌的 galvanized; zinc-plated镀锌钢板 galvanized steel panel镀锌瓦楞钢板 corrugated galvanized sheet对称荷载 symmetrical load对角线 diagonal对接焊接 butt welding对接埋入焊 penetration butt对齐销钉 alignment rod端部释放 ends released短期强度 short-term strength断桥隔热条 thermal break断热条 thermal break断热材料 thermal break material对齐销钉 alignment rod多功能建筑 multi-purpose architecture多功能裙楼 multi- functional podium多叶片转台 multiple plate turntableE额定荷载 rated load耳生噪音阻力 self-generated noise resistanceF发包 contract award发包工程 award work法规要求 regulatory requirements法兰 flange反复荷载 cyclic load反力 reaction; reaction force; counterforce泛水区 flashed area方案 plan;scheme方形管 square hollow section防暴测试 bomb blast protection resistance testing 防虫网 insect screen防腐蚀 corrosion protection;antisepsis防腐蚀垫片 anti-corrosion washer防火 fire protection/prevention防火标准 fire protection standard防火材料 fire-proof material防火等级 fire-protection rating防火堵料 fire proof plug防火隔断 fire proof partition; fire stop防火构造 fire proof construction防火绝缘材料 fire-safing insulation防火棉 fire stop防结露技术 dew preventive technology防漏技术 penetration preventive technology防鸟网 bird screen防汽阻隔 vapour barrier防水 water proof; water proofing防水薄膜 waterproofing membrane防水层屋面系统 membrane roof system防水海绵 waterproofing sponge防水汽板 vapour retarder; vapour retardant panel 防霜加热线 de-icing heating cable防碳化涂层 anti-carbonation coating防锈白漆 anti-corrosive zinc paint防锈涂料 antirust paint防烟密封装置 smoke seal防雨(水)板 flashing非标准的 special非承重结构 non-bearing structure分包合同 subcontract分包商 subcontractor分布荷载 distributed load分布离差 dispersion分布众数 mode分段完工 staged completion分格 module分格高度 module height分析 analyze;analysis分项系数 distribution coefficient分子筛 molecular sieve粉末喷涂 PPC;powder coating风道 air passage风洞测试 wind tunnel test/study风洞试验报告 wind tunnel testing report风格式样 style风荷载 wind load风荷载作用效应组合系数 wind load action combination coefficient 风区 fetch;air pressure风压 wind pressure封口砖 closer封烟板 smoke seal蜂窝铝板 aluminum honey-comb panel附加费用 extra charges附加荷载 additional load附加建筑 additional building附加条款 additional clause附加弯矩 secondary moment附件 accessory附录;附件 appendix附属结构 accessory structure附图 attached drawings扶手 handrail;railing氟碳喷涂 PVDF; Fluorine Carbon;PVF2 coating腐蚀 corrode;corrosion/erode;erosion辅助建筑 accessory building;subsidiary building辅助框架 sub-frame负风压区 negative wind pressure area负荷 load负荷等级 load grade负剪力 negative shear负弯矩 negative bending moment负值 negative valueG干挂石 granite cladding干密封 gasket sealed干燥剂 desiccant概率 probability钢板 steel panel钢度 rigidty;inflexibilitytoughened glass;hardened glass钢结构 steel structure/steelwork钢筋 reinforced bar;steel reinforcement钢筋混凝土 reinforced concrete钢拉索 steel cable钢码 steel bracket刚性垫层 rigid fill刚性结点 rigid joint刚性结构 rigid structure刚性支承 rigid support高层建筑 high-rise building高度 height高级碳纤维 high-grade carbon fibre高温防火密封胶 fire stop sealant高温防火岩棉 fire stop wool高温喷涂 pyrolytic coating隔断 partition隔断衬板 partition lining隔热数值 thermal/insulation value格栅 grille隔声材料 acoustical material隔声要求 acoustic requirement工程 project;engineering;works工程编号 PROJ. No.(project number)工程拨款 project appropriation工程测量 engineering survey工程进度 progress of works工程项目 construction item工程造价 construction cost工地 site工地质量控制经理 on-site quality control manager 公差 tolerance供电系统 power supply system供货商 supplier供暖 heating供暖系统 heating system供应 supply; provide; furnish; offer公共通道 public passage公共照明 public lighting供货商 supplier公料 male extrusion工艺 workmanship工艺说明书 workmanship specification公制 metric拱肩 spandrel构件 component/member/element固定端 fixed end固定爪spider fixing顾问 consultant故障 defect挂钩 hook挂件 bracket管件系统 ductwork惯性 inertia惯性矩inertia moment光电幕墙 photoelectric curtain wall规定 specify规定标准 specified standards规范 specifications/code硅树脂 silicone硅酮结构密封胶 structural silicone硅酮密封剂 silicone sealant硅酮耐候密封胶 weather proofing sealant 滚动痕迹 roller markHH型钢 H-type steel焊接 welding焊接标准 welding standards合同 contract合同签订 award of contract合同文件 contract documents合格证明 certification合页 hinge荷载 load桁架 truss; girder横梁 transom横料 transom厚度 thickness划痕 scratch(es)花岗岩 granite花岗岩维护 granite cladding环保的 environmental friendly缓冲结构 buffer structure缓和 mitigation混合物 composite活动的;动态的 dynamic活动窗 operable window活荷载 live loadJ基本参数 basic parameter基本风压 basic wind pressure基本竣工substantial completion机械通风百叶 mechanical ventilation louvers机械装备 mechanical equipment基准位置 reference location集水槽 gutter集中荷载 concentrated load;point load极限值 extreme value几何参数 geometry coefficient几何图形 geometry挤压硅胶 extruded silicone挤压铝型材 aluminum extrusion挤压应力 extrusion stress; pressure stress技术规范 technical specification技术性能 technical performance技术要求 technical requirements计算 calculate/calculation/computation计算高度Calculating Height计算书 engineering calculation; calculation计算系数 computing coefficient加工(制作)fabricate/ fabrication加工容差 fabrication tolerance加工商 fabricator加热线 heating cable夹层 interlayer夹具 fixture甲级 Grade A甲(一)级资质 Grade A certification/qualification甲级建筑幕墙专项设计资质 Grade A certification of Curtain Wall Design 假设 assume;assumption监理 Supervision Company兼容 compatible兼容性compatibility兼容性测试 compatibility test间隙 gap/clearance间隔条 spacer剪力 shear force剪切 shear剪切面 shear front检查 examine /examination; inspect/inspection检验 examine/examination; inspect/inspection检修孔 access hole简支梁 free beam;simply supported beam建设单位 Owner建筑 architecture; building建筑的 architectural建筑钢结构 architectural steelwork建筑师 architect建筑设计单位 the Architect建筑设计顾问 architectural design consultant建筑主体 primary structure建筑主体混凝土 primary structure concrete建筑主体钢结构 primary steel structure交错排列形式 staggered pattern交底 submittal交货 deliver/delivery胶条 gasket角度 angle角焊缝 fillet weld角码 bracket校订 revision校核 check;checking校核依据 checking basis接触面 contact surface接缝 joint接缝清洁剂 joint cleaner接合 bond;bonding接口界面 interface节点 detail;node结构 structure结构打胶 structural glazing结构分析 structural analysis结构工程 structural engineering结构跨度structure span结构计算structural calculation结构胶 structural silicone结构图 structural drawing结构支撑 structural support截流器 restrictor截面 section截面参数Section parameter节能 energy-saving节能技术 energy-saving technology节能环保技术 energy-saving environmental friendly design金属防虫网 metal insect screen金属覆面 metal cladding金属结构 metalwork金属幕墙 metal curtain wall金属天花板底面 metal panel soffit金属涂层 metallic coating仅供参考 for information only紧固材料 fixings;fasteners紧固件 fastener紧急出口 egress door浸透;浸入 penetrate/penetration经营理念 business concept景观 landscape静定梁 statically determinate beam镜面 mirror镜面不锈钢扶手 mirror stainless steel handrail局部 local;partial矩形管 rectangle hollow section距离 distance聚乙烯泡沫填充棒 backer rod均布荷载 uniform load;uniformly load;uniformly distributed load;even load 均方根值 rms value均压空腔 pressure equalized cavity均匀的 uniform均匀 uniformityK开工 commencement开口 opening开启扇 operable vent;operable window开启扇配件 operable vent hardware勘查 survey抗剪承载力 shear bearing capacity抗剪强度 permissible shear stress抗剪直径shear diameter抗拉承载力 tensile bearing capacity抗拉强度 permissible tensile strength抗拉直径 tensile diameter抗冷凝 condenzation resistance抗弯刚度 bending rigidity抗弯强度 flexural strength; permissible bending strength 抗震设防烈度 anti-seismic fortify intensity可更换面板系统 replacable panel system可见光反射率 visible light reflectance可见光透光率 visible light transmittance可见缺陷 observable defect可视位置 visible location可移动采光顶 operable skylight客户 Client空中花园 hanging garden孔径 aperture扣盖 capping跨度 span宽度 width框架 frame框架式 stick system矿物纤维 mineral fiberL拉丝不锈钢板 linen stainless steel panel拉索 cable; wire拉索系统 tension system栏杆 railing类型;型号 type冷凝 condenzation冷凝水 condensation离地高度 height to ground力臂 arm of force; arm立面 elevation; façade立面出入口清洁 façade access cleaning立面图 elevation; elevation drawing; vertical plan立面承包商 façade contractor立柱 mullion连接 junction; connection连接件 fixing; bracket连接节点 connection detail连续梁 continuous beam梁 beam;girder临界的;危险的 critical临时标记 temporary marking临时的 temporary菱形钢结构 diamond diagrid菱形槽式钢结构 diamond channel steel structure轮廓 profile罗纹成形紧固件 thread forming fastener铝板 aluminum panel铝板屋面 aluminum panel roof铝板幕墙 aluminum cladding;aluminum panel curtain wall 铝盖板 aluminum trimming(扣盖)铝合金 aluminum alloy; aluminum铝合金百叶aluminum louver铝合金集水槽 aluminum gutter铝合金扣盖 aluminum capping铝合金横梁公料 male transom extrusion铝合金横梁母料 female transom extrusion铝合金立柱公料 male mullion extrusion铝合金立柱母料 female mullion extrusion铝合金门窗 aluminum door & window铝合金型材 aluminum extrusion铝合金托片 aluminum setting block铝合金隐框窗 frame hidden aluminum window铝合金中横梁 aluminum middle transom铝合金中立柱aluminum middle mullion铝合金转角立柱 aluminum corner mullion铝框 aluminum frame铝片 aluminum sheet铝型材/铝挤压件 aluminum extrusion铝压板 aluminum capping铝制间隔条 aluminum spacer氯丁橡胶 neoprene龙骨 keelM马赛克 mosaic马赛克面转 mosaic tile马赛克铺面 mosaic cladding埋入 cast-in锚固 anchor/anchorage锚固测试标准 anchor test standards锚固件 anchorage; fixing锚栓 anchor美学效应 aesthetic effect门窗边框 jamb密度 density密封 seal密封的 sealed;hermetic密封材料 sealant密封剂 sealer密封胶 sealant密封条 tape面板panel面积 area面积荷载 area load明框 exposed frame磨损 abrasion模具;冲模 die模型比例 model scale母材 base material; female extrusion幕墙 curtain wall(CW);幕墙维护系统 façade access systemN耐候密封 weather seal挠度 deflection挠度超限 excessive deflection内部 internal/interior内力 endogen force内力分析 endogen force analysis尼龙垫片 nylon washer拟建工程 proposed development逆风 upwind年温差 annual temperature difference粘结厚度bonding thickness粘结宽度bonding width粘结力测试 adhesion test(胶)凝固 cure扭矩 torsional moment; moment of torque; moment of torsion 扭曲 warp暖气管 heater pipe暖气罩 heating cover女儿墙 parapetP排水 drainage排水沟 gutter/channel排水管 drainage pipe排水孔 weep hole排水腔 drained cavities排水闸 drainage trap排水装置 drainage泡沫填充棒 foam rod;backer rod配件 attachment批准 approve批准的 approved批准的供货商 approved supplier疲劳 fatigue偏心的 eccentric偏心距 eccentricity distance偏移 deflection拼接 splice; joint拼接头 splice平衡架 balancer平均风速 mean wind-speed平均隔热性能 average maintained insulating performance 平均值 mean value平面图 plan平行 parallel泊松比 poisson ratioQ漆底漆 priming气密性 air-tightness; air sealing强度 strength强度分配原理 strength distributing principle强度设计值 design strength墙角 wall corner墙面 wall area切割 cut清洁 clean/cleaning倾斜 slope倾斜幕墙 sloped curtain wall取用 adopt全长 overall length缺陷 defect/incorrect work裙楼 podiumR染色的 tinted热处理 heat treat热反射镀膜幕墙heat reflecting coated curtain热浸镀锌 hot-dipped galvanized热浸镀锌方钢管 hot-dipped galvanized steel pipe 热浸镀锌角钢 hot-dipped galvanized steel angle热浸镀锌钢板 hot-dipped galvanized steel panel热位移 thermal movement热应力 thermal stress人性化设计理念 human-oriented design concept人造的 artificial认可 approve/approval; endorse/endorsement认可的 approved容差;公差 tolerance熔焊角部 fused corner柔性降噪垫片 flexible acoustic shim软镀膜 soft coating润色 touch up;touch-upS三角形 triangle三角形荷载 triangle load三元乙丙密封胶 EPDM三维导线测量系统 3-dimensional traversing system 色彩color色彩范围 color range色彩重现指数 color rendering index上(部)upper上部结构 superstructure上槛 head射钉 drive pin设计 design设计单位 Architect设计经理 design manager设计值 design value深度 depth审查 review/inspect/inspection审定 examined审核 review生产测试程序 production testing program生产基地 manufacture plant;plant生产容差 manufacturing tolerance生产商 manufacturer声学性能 acoustic performance施工图纸 shop /workshop drawing石材面板 stone panel石材幕墙 stone cladding curtain wall石材饰面 stone finish;stone facing实际面积 area in fact实际施工图纸 as-built record shop drawings 时间标度 time scaling时间关系曲线图 time histories实体模型 mock-up使用长度 applying length视觉实体模型 visual mock-up视觉效果 visual effect饰面 finish室内 inside;indoor室内柱面板 interior column cladding室外 outside;outdoor室外地面 site-ground试验 test;testing试用组装 trial assembly书面报告 written report属性 property竖料 mullion竖向荷载 vertical load竖向剪力 vertical shear force数据 data数量 quantity数字递归滤波器 digital recursive filter刷形密封剂 brush seal双层呼吸式幕墙 double-skin curtain wall双剪连接 double shear joint双密封 dual seal双边缘密封 dual edge -seal水槽 gutter;dam水槽受力 dam force水密性 water-tightness水泥 grout;cement水泥砂浆 grouting水平(方向)的 horizontal水平地震荷载 horizontal seismic load水平剪力 horizontal shear force说明 note说明书 specification手册 manual首层 first floor手动开启窗 manually operable vent手算 hand/manual computation顺风(面)downwind瞬时风压阵风系数Gust coefficient of momentary wind pressure 四边支撑 support on four sides四边简支 simply supported by four sides塑性发展系数plastic development coefficient索网幕墙 cable-net curtain wallT塔基 tower base弹性的 elastic弹性密封胶 elastomeric sealant弹性模量 elastic modulus;modulus of elasticity陶板幕墙 terracotta curtain wall特殊担保 special warranty特制 custom梯形 trapezoid梯形荷载 trapezoid load提供 supply;furnish;equip提交 submit提交材料 submittal体型系数 shape coefficient天窗 skylight天花底面 soffit填料 gasket条款 clause条文说明 commentary挑梁;外神梁 overhanging beam挑出屋顶 overhanging roof挑檐 overhang eaves挑檐底板 soffit铁金属 ferrous metal通风 ventilation通风口 vent铜 copper投标 tender;bid投标者;投标单位 tenderer透明的 clear/transparent图案 pattern图标 drawing title图标符号;图例(说明) legend图表 diagram;figure涂层 coating图纸 drawing推荐 recommend/recommendation托架 bracket托梁;桁 joist托条;托片 setting blockW外部 external/exterior外观 appearance外露的 exposed外墙 exterior wall外墙辅助系统 façade access system外墙挂板 exterior panel外墙饰面 facade cladding外墙系统;外挂系统 exterior wall system 外墙照明 façade lighting外围护结构 enclosing structure外装饰 exterior cladding外装饰系统 cladding system弯矩 bending moment弯矩系数 coefficient for bending moment 弯曲 bow弯曲刚度 bending inflexibility网孔 mesh维护 maintenance维护系统 access system位移 movement位置 location/position温度 temperature紊流边界层 turbulent boundary layer稳定的 stable稳定性 stability屋顶 roof五金件 hardware50年一遇 50-year return period物理性能标准 physical performance criteria XX轴 X axis吸水海绵 water absorbing sponge细节 details系列 series系数 factor;coefficient系统 system系统描述 system description系统调试 system commissioning下(部)lower纤维 thread现场 field;site现场淋水测试 field water testing现行版 current version线荷载 line load线膨胀系数 linear expansion coefficient/factor; linear expansiblity 线性转化分析 linear converting analysis镶边 trim相对位移 relative movement相关说明书 related specification相似项目 comparable project详尽样品 comprehensive sample详图 detail响应频率 frequency response项目 project项目经理 project manager项目条件 project conditions向下的 downward橡胶;塑胶 elastomer销钉;栓 pin效应 effect斜截,斜切 miter性能 performance性能要求 performance requirements雄料 male material修复工作 remedial works许用单剪力 allowable shear single许用拉力 allowable tension序列 serial序言 foreword悬臂 jib arm; cantilever悬臂梁 cantilever; projecting beam悬挂 suspend; hang悬挑 soffit; overhang悬挑雨蓬 overhang canopy旋转门 revolving door雪荷载 snow loadYY轴 Y axis压力传感器 defferential transducer颜色范围 color range验收 inspect/inspection验收条件 verification of conditions养护 cure;curing阳极氧化处理 anodize阳极氧化 anodized样板 mock-up样品 sample样品交底 sample submittal要求 requirements业主 the Owner/the Client业主合同 Owner’s Contract一级建筑幕墙工程施工资质 Grade A certificate of Curtain Wall Construction 一览表 schedule1秒钟峰值净压力 1-sec Net External Pressure1秒钟峰值压差1-sec Peak differential Pressure1秒钟外部峰值压力1-sec peak external pressure翼缘;凸缘 flange隐蔽位置 concealed location引用规范 referred code影响 influence; effect影响系数 influence coefficient应力 stress应力超限 overstress永久密封胶 permanent elastomeric sealant有关部门 relevant authorities有害物质 deleterious substances有效的 effective有效长度 effective length有效面积 area in fact雨篷 canopy预埋 pre-cast;embed;embedment预埋板 cast-in plate预埋件 embedded parts; embedment; anchor; cast-in item预埋锚栓 cast-in anchor预算 estimate/estimation; budget预算成本 estimated cost预算员 estimator;bugeteer预制面板 pre-fabricated panel原型 prototype原尺寸 full-scale圆通 circular hollow section允许变形 permissible deformation允许剪应力 allowable shear stress允许拉应力 allowable tensile stress允许扭应力 allowable twisting stress允许弯应力 allowable bending stress运输 transportation;delivery;shipZ造价 fabrication cost;manufacturing cost造价估算 cost estimate障碍物 obstructions招标 tender招标图纸 tender drawing招标文件 tender documents照明 lighting遮蔽面板 blanking panel遮光膜/剂 opacifier遮阳 sunshade遮阳帘 sun shade遮阳系数 shading coefficient折减系数 reduction coefficient/factor折弯钢板 formed/bent steel panel折弯不锈钢板 formed S.S panel整改 repair and replacement整合 integration证明;证明书 certificate证书 certification正风压区 positive wind pressure area正面填隙片 face shim正值 positive value支撑维护系统 back-up closure system支座 support直观实体模型 full-scale visual mock-up直角型材 orthogonal profile直径 diameter直面幕墙 flat curtain wall指导规范 governing codes指数 index止动块 stop质保期 defects liability period质量 quality质量保证 quality assurance; quality assurance 质量控制计划 quality assurance program质量监控 quality control质量监控步骤 quality control procedure质量监控人员 quality control supervisor质量控制代表 quality assurance representative质量控制经理 quality control manager智能幕墙 intelligent curtain wall智能遮阳百叶系统 intelligent sunshade louver制造商 manufacturer中国南玻 CSG中横梁 middle transom中立柱 middle mullion中庭 atrium中央商务区 CBD (central business district)重力 gravity重力荷载 dead load重力密度Gravity density重心 centroid周边;边缘 perimeter周长 perimeter轴向的 axial主导风 magistral wind主建筑结构 primary building structure主楼 main building主塔楼 mega tower主体(结构) main structure;super-structure;base structure 主体外围护结构 primary enclosing structure柱 column专利技术 patented technology转化系数 transferring coefficient转角 corner转角立柱 corner mullion装饰 decorate; decoration装饰物 feature装饰地板 decorative floor装饰性雨棚 features canopy准则 guideline着色 tint资格 qualification紫外线辐射阻力 ultra-violet(UV)radiation resistance自攻紧固件 self threading fastener自然饰面 natural finish自重(荷载) dead load;self-weight自重荷载计算dead load calculation自重面荷载 area dead load自重作用效应分项系数 dead load effect distribution coefficient 自钻孔紧固件 self drilling fastener总承包商 main contractor组合 combination组合校验 checking interaction组合系数 combination coefficient组件 assembly; component组装 assembly最大 maximum;Max.最大分格 Max. module最后清洁 final cleaning最小 minimum;Min.坐(落)地式 free stand type作用 action作用力 force作用于 apply on。
网络建模和可视化平台基于Moodle和Mxgraph用户指南说明书
Network Modeling and Visualization Platform based onMoodle and MxgraphFang-jian He, Xiao-pan Zhang, Xiao-yan MaSchool of Resources and Environmental Engineering, Wuhan University of Technology, Wuhan, ChinAbstract - For the model of learning, Most of the information of relevant professional beginners are difficult to adapt to the training of the model structure. In the early learning students should focus on the cultivation of thinking structure, visual modeling study is conducive to the strengthening of the relevant professional structured learning and understanding. Nowadays Study on the visualization of teaching are few all over the world, Visualization technology is often manifested as data visualization, but the visualization model of image network still remain at the theoretical level. In order to meet the requirements of teaching at present, we design and build the network platform of visual modeling training. Take advantage of the network script language, Moodle and Mxgraph, which have the correlation of modelling, the platform is developed in the server environment. The modeling steps platform record students, in order to guide the development of structured programming thinking, to help the designer to master and practice model.Index Terms - Modeling and visualization, structured, network platformIn the teaching process, we should strengthen students' understanding of the model[1]. In the absence of visual teaching aid. The main research field of visualization is the visualization of teaching of computer technology, where image express some abstract problems intuitively in Teaching, it is proposed the establishment of visual model in the teaching and training platform services. At the same time the single teaching method makes students lack of clarity on the teaching requirements, which did not issue a structured way of thinking to think. Using modeling ideology teaching visualization helps to stimulate students' interest and understand the course content better. The main research field of visualization is the visualization of teaching of computer technology, where image express some abstract problems Intuitively in Teaching, it is proposed the establishment of visual model in the teaching and training platform services. Gene expression is the idea of the model, so implementation model visualization has important practical significance for modern teaching. Teaching visualization helps teachers improve teaching efficiency, which helps students understand what they have learned to master the curriculum.1.The Demand of Modeling and Visualization PlatformVisual thinking teaching appears in recent years, using visual tool for mining the potential of students’memory and imagination, Improving students' way of thinking, enhancing the efficiency of teaching research. Teaching modeling visualization is enhanced teaching and research of great significance,mainly for students to deepen their intuitive understanding of some models by rendering, but also to learn how to use the model to solve the education problem.Combined with a variety of information, Modeling visualization can be summarized as abstract and difficult to describe things or relationships through a number of related data processing to make it intuitive, visualized. In the research on visualization modeling teaching, compared with the traditional teaching can be found that combined with the model of teaching can enable students to understand the teaching task. The students themselves establish the model, which also converts structure of thinking into the process of space structure, showing their reachability and topology. For example, in the programming process of learning, Visual training adds algorithms and modeling of two modules, letting beginners only need to draw the flow chart for the learning algorithm.2.The Network Framework of Model’s Visual PlatformThe rapid development of the technology of model’s visualization is based on the visualization technology of graphics, besides, visualization is the theory, method and technology of interactive processing by computer. Due to the high requirements of image, the teaching model is bound to get rid of the traditional teaching methods. Combining with the requirements of teaching curriculum, it is prevalent to establish teaching platforms which support interactive information. Visual learning need to display in the WEB platform. At the same time, as for the teaching management, the visual learn of WEB could provide the network teaching platform, which is convenient for evaluation, communication and monitoring of study. Besides, the popularity of the network makes the students can realize remote visualization modeling training in any place .As for as the establishment of the platform, we should consider that the important curriculum and experiment related professional integrated into this platform and Setting up several different professional courses on he platform.In view of the above content, we divide the whole system into six different levels of the following: curriculum management modular, task management modular, user course selection authentication modular, model establishment modular, data monitor and interact modular, structure query modular, frame as shown in Fig1.International Conference on Applied Social Science Research (ICASSR 2015)Fig.2. Platform Framework3. Establishment of Plantform EnvironmentA. Model Selection of Platform SoftwareWe usually use two software which responsible for teaching communicate platf orm’s establishment and the model of the plug-in support. It provides a data view at the time of containing the actual data. In JGraph products, Mxgraph is a graphical component which provides interface with web integrated. The client requires a Web server to provide the required documents, it can also run on the local file system. The background can be used to support the integrated of existing server language, so it is very friendly to the development.In consideration of the analysis of the component of model, the platform must also meet the course assignments, including task management modular and data monitor and interact modular. At the same time, the development of language of model plug-in and learning platform need to keep compatibility, so finally we select the current market popular teaching platform software Moodle to meet the needs of establishment of WEB visual modeling and learning platform. B. Moodle Learning Platformand Mxgraph Graphical TrainingMoodle[3] is an open-source Course Management System (CMS), also known as the Learning Management System (LMS) or Virtual Learning Environment (VLE), which has simple and elegant interface, so users can adjust interface and content according to the requirement at any time. The Moodle platform is a dynamic website program by the PHP scripting language, it is configured of the MySQL database supported by PHP, and it could be used to storage the data and file generated by the Moodle interface.The creation of graphics is by Mxgraph, which includes all the web[2] development language. Mxgraph client is a graphical component,and it can provide a interface of web integrated. Mxgraph has the architecture and graphics components of MVC, which has the same rules of JGraphthe, and it can be applied in a number of development. The clientcan realize localized operation, also is convenient to users to develop project alone.4. The Key Technology of Visualization Platform In the visual modeling training platform development process, the internal structure of the Moodle must be carried out to understand the, including the database and the module of data link. For example, the user who select the corresponding courses in the Moodle will enter into the corresponding modeling interface, and the operation is fed back to the establishment of the database, which also marks the link between two software. To achieve the overall visual programming training platform, it must be associated with Mxgraph and Moodle. Relationship in the user operation with reference to FIG. 2.Fig.2. flow chart of software operation platformA. Graphical Development Training Page in the MxgraphIn the Mxgraph, The menu bar and feature-rich tool make creating and editing simple graphics. However, the official demo given too much to call back url and Java code, it’s not easy to develop in the front page to connect Moodle. Written by JavaScript and built in the Tomcat server environment. The development of requirements is to refer to the corresponding component, the front page of the project Mxgraph should be met:1) Drag the icon to create a user model. There are mobile location, modify the size of the function.2) The above steps can be recorded in real time by the back-end database records. For the above requirements, the project on the local server for Mxgraph develop new homepage.In response to these requirements, the extraction of the core code of internal mxClient. Js can create a model. Then, Simple graphical configuration pull function that meets the basic requirements. To create a model of the type, according tothe different needs of different courses, it can be added in the model gallery.B.Monitoring Training Records by MoodleMoodle course modules not only provide support, this project requires the user has a monitoring operation on, that is user real-time monitoring and recording procedures. Monitoring records shall be, user adds a type of block diagram, or the user modifies a block diagram. User visualization and modeling in Mxgraph interface has been developed, in order for managers to understand their structure and thinking to create.With JavaScript, we can reconstruct the entire Mxgraph client to add some function, including adding, removing, changing or rearranging items on the page. When we want to change any module on the page. JavaScript needs access to the entrance of all the elements in the HTML document, which entrance along with the methods and properties to add, move, change or remove the HTML element, Is obtained through the document object model(DOM).C.Structure Analysis of Moodle and Mxgraph and theirInteractionThe first two has completed the creation of the Mxgraph model and the operation of the user record creation process. Then We need to establish the model to transfer to Moodle. And the database recording operation is also uploaded to the result. So what we need to achieve is data exchange between Mxgraph and Moodle. But the data in the Moodle will display where the front in the corresponding position has becoming the key of the platform’s development.The specific steps are provided by the user clicks on the link after elective operation. Table assign submission in the corresponding Mysql in the formation generate the corresponding value. Then the results of MVC model corresponding to the records generate in the online text field in the assign submission online text. At the same time, IP, time to submit homework and so on will be recorded. This text will be submitted in the Moodle view display operation.The technical scheme is able to complete the relationship and coordination between the two software, presents a complete WEB visualization programming training platform in the server set up after the completion.5.Moodle Operation Modular ManagementEasy to operate, to complete the development of the technology of Moodle and Mxgraph after the details of the treatment in the actual operation, the front end service platform forms a teaching system.Managers can create courses in Moodle, and publish the work that can be placed in the Mxgraph link. The information can be accepted by the users who select corresponding course. After the user selection in the MySQL assign submission database automatically appear in a record, recording the submission user ID and field operation number corresponding to the submission field in assign submission online text with the serial number. Finally, managers can give the score in the submitted after the operation. The score will be saved in the assign grades data sheet.So far, all the function modules of experimental teaching platform of visual modeling is the development and application. It is not only support the modeling of all kinds of teaching model, but also set up the framework of the platform of information processing, which is used for the analysis of the job submission. Managers judge from the record whether the user can independently accomplish the work directly or theft. It can be in the operation record inquiry knowing, which exceeds the completeness of traditional teaching that can have in the practical application.6.SummaryThe visualization platform for educational institutions or small laboratory provides a practical digital teaching, scientific research, management and service network platform. In addition, through the realization of the environment (including equipment, etc.), resources to the application (including teaching, learning, management, service and office), it construct a digital space based on the traditional campus. In the dimension of time and space to expand the real campus the traditional campus, the platform finally realizes the educational process information, so as to improve the management level and efficiency of the aim of education. AcknowledgmentsThe authors gratefully acknowledge financial support from the Practices Education System Improvement Project of Wuhan University of Technology.References[1]Zhiyuan Yuan, Xinqi Zheng, Lina Lv et al.. From design to digital model:A quantitative analysis approach to Garden Cities theory. EcologicalModelling, 2014, 289.[2]Kartik Kandadai Agaram. Prefetch mechanisms by application memoryaccess pattern. The University of Texas at Austin, 2007.[3]Zoran Vručinić,Aleksandar Janković,Milan Miladinovićet al..EVALUATION OF CLINICAL DIAGNOSIS WITH “STORE AND FORWARD”TELEDERMATOLOGY. Acta Medica Medianae, 2010, 49(4).[4]Chris Brunsdon, Lex Comber. Assessing the changing flowering date ofthe common lilac in North America: a random coefficient model approach. GeoInformatica, 2012, 16(4).[5]Qian Liu. Securing telehealth applications in a Web-based e-Healthportal. Concordia University (Canada), 2008.。
MS5525DSO 数字小型压力传感器说明书
MS5525DSO(Digital Small Outline)SPECIFICATIONS∙ Integrated Digital Pressure Sensor (24-bit ∆Σ ADC)∙ Fast Conversion Down to 1 ms ∙ Low Power, 1 µA (standby < 0.15 µA) ∙Supply Voltage: 1.8 to 3.6V ∙ Pressure Range: 1 to 30 PSI ∙I 2C and SPI InterfaceThe MS5525DSO is a new generation of Digital Small Outline pressure sensors from MEAS with SPI and I 2C bus interface designed for high volume OEM users. The sensor module includes a pressure sensor and an ultra-low power 24-bit ∆Σ ADC with internal factory calibrated coefficients. It provides a 24-bit digital pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. The MS5525DSO can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device.This new sensor module generation is based on leading MEMS technology and latest benefits from TE proven experience and know-how in high volume manufacturing of pressure modules, which have been widely used for over a decade.The rugged engineered thermoplastic transducer is available in single and dual port configurations, and can measure absolute, gauge, compound, and differential pressure from 1 to 30psi.FEATURES∙ Small Outline IC Package ∙ Barbed Pressure Ports∙ Low Power, High Resolution ADC∙Digital Pressure and Temperature OutputsAPPLICATIONS∙ Factory Automation∙ Altitude and Airspeed Measurements ∙ Medical Instruments ∙Leak DetectionSTANDARD RANGES (PSI)FS Pressure Absolute Gauge Differential001 DB, SB,ST, DH002 DB, SB, ST, DH,FT DB, SB,ST, DH005 DB, SB, ST, DH,FT DB, SB,ST ,DH015 DB, FB, DH, FT DB, SB, ST, DH,FT DB, DH030 DB, FB, DH, FT DB, SB, ST, DH,FT DB, DHSee Package Configurations: DB= Dual Barb, DH= Dual Hole, SB=Single Barb, ST=Single Tube, FT=Front Side Tube, FB=Front Single Barb ABSOLUTE MAXIMUM RATINGParameter Conditions Min Max Unit Symbol/Notes Supply Voltage T A = 25°C -0.3 3.6 V V DD Storage Temperature -40 125 °COverpressure T A = 25 °C, both Ports 60 psiBurst Pressure T A = 25 °C, Port 1 psi See Table 1 ESD HBM -4 +4 kV EN 61000-4-2 Solder Temperature 250°C, 5 sec max.Table 1- BURST PRESSURE BY RANGE AND PORT DESIGNATION.Range Port 1Port 2Unit001 10 10 psi002 20 20 psi005 50 15 psi015 120 60 psi030 120 120 psiENVIRONMENTAL SPECIFICATIONSParameter ConditionsMechanical Shock Mil Spec 202F, Method 213B, Condition C, 3 DropsMechanical Vibration Mil Spec 202F, Method 214A, Condition 1E, 1Hr Each AxisThermal Shock 100 Cycles over Storage Temperature, 30 minute dwellLife 1 Million FS CyclesMTTF >10Yrs, 70 ºC, 10 Million Pressure Cycles, 120%FSPressureMSL Moisture Sensitivity Level is 3PERFORMANCE SPECIFICATIONSUnless otherwise specified: Supply Voltage1 3.0 V DC, Reference Temperature: 25°CPARAMETERS MIN TYP MAX UNITS NOTES Operating Voltage 1.8 3.6ADC 24 bitsPressure Accuracy See Table 2 Below %FS 2,5 Total Error Band (TEB) -2.5 2.5 %FS 3 Temperature Accuracy (Reference Temperature) ±1.5ºC 4,5 Temperature Accuracy ±2.5ºC 4,5 Supply Current See OSR Table Below mACompensated Temperature 0 85 ºCOperating Temperature -40 +125 ºCConversion Time See OSR Table Below msWeight 3 gramsMedia Non-Corrosive Dry Gases Compatible with Silicon, Glass, LCP, RTV,Gold, Thermo-Epoxy, Silicone Gel, Aluminum and Epoxy. See“Wetted Material by Port Designation” chart.Notes1.Proper operation requires an external capacitor placed as shown in Application Circuit. Output is not ratiometric to supply voltage.2.The maximum deviation from a best fit straight line(BFSL) fitted to the output measured over the pressure range at 25°C. Includes allerrors due to pressure non-linearity, hysteresis, and non-repeatability.3.The maximum deviation from ideal output with respect to input pressure and temperature over the compensated temperature range.Total error band (TEB) includes all accuracy errors, thermal errors over the compensated temperature range, span and offset calibration tolerances. TEB values are valid only at the calibrated supply voltage.4.The deviation from a best fit straight line (BFSL) from 25°C. to 85°C.5.Six coefficients must be read by microcontroller software and are used in a mathematical calculation for converting D1 and D2 intocompensated pressure and temperature values.Table 2- TYPICAL ACCURACY SPECIFICATION BY PRESSURE RANGERange Port 1 Port 2 Unit001 ±0.25 ±1.0 %FSS002 ±0.25 ±0.5 %FSS005 ±0.50 ±1.0 %FSS015 ±0.25 ±0.25 %FSS030 ±0.25 ±0.25 %FSSOVERSAMPLNG RATIO (OSR) PERFORMANCE CHARACTERISTICSSUPPLY CURRENT CHARACTERISTICSParameter Symbol Conditions Min.Typ.Max UnitSupply current (1 sample per sec.)I DDOSR 40962048102451225612.56.33.21.70.9µAPeak supply current during conversion 1.4mA Standby supply current at 25°C0.020.14µAANALOG DIGITAL CONVERTER (ADC)Parameter Symbol Conditions Min.Typ.Max UnitConversion time t c OSR 4096204810245122567.403.721.880.950.488.224.132.081.060.549.044.542.281.170.60msINPUT/OUTPUT SPECIFICATIONS DIGITAL INPUTS (CSB, I2C, DIN, SCLK)Parameter Symbol Conditions Min.Typ.Max UnitSerial data clock SCLK SPI protocol20MHzSerial data clock SCL I2C protocol 400 kHzInput high voltage V IH Pins CSB80%V 100% V DD VInput low voltage V IL0%V 20% V DD VInput leakage current I leak25°CI leak85°Cat 25°C0.15µAInput capacitance C IN6pF PRESSURE OUTPUTS (I2C, DOUT)Parameter Symbol Conditions Min.Typ.MaxUnitOutput high voltage V OH I source = 0.6 mA80% V DD100%V VOutput low voltage V OL I sink = 0.6 mA0% V DD20% V DD V Load capacitance C LOAD16pFFUNCTIONAL DESCRIPTIONGENERALThe MS5525DSO consists of a piezo-resistive sensor and a sensor interface IC. The main function of theMS5525DSO is to convert the uncompensated analog output voltage from the piezo-resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. FACTORY CALIBRATIONEvery module is individually factory calibrated at two temperatures and three pressures. As a result, six coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 128-bit PROM of each module. These bits, partitioned into six coefficients, C1 through C6, must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values.The coefficients C0 and C7 are for factory calibration and CRC.SERIAL INTERFACEThe MS5525DSO has built in two types of serial interfaces: SPI and I2C. Pulling the Protocol Select pin PS to2C bus protocol.SPI MODEThe external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used toenable/disable the interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the end of the command execution (for example end of conversion). The best noise performance from the module is obtained when the SPI bus is idle and without communication to other devices during the ADC conversion.I2C MODE & ADDRESSINGThe external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In I2C -Mode the complement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to use two sensors with two different addresses on the I2C bus. The pin CSB must be connected to VDD or GND do not leave these pins unconnected.COMMANDSThe MS5525DSO has only five basic commands:1. Reset2. Read PROM (128 bit of calibration words)3. D1 conversion4. D2 conversion5. Read ADC result (24 bit pressure / temperature)Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the PROM read command using the Ad2, Ad1 and Ad0 bits.structureFigure 2: Flow chart for pressure and temperature reading and software compensation.MEMORY MAPPINGFigure 3: Memory PROM Mapping Notes[1] Maximal size of intermediate result during evaluation of variable.SPI INTERFACERESET SEQUENCEThe Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device ROM from an unknown conditionCONVERSION SEQUENCEThe conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. The chip select can be disabled during this time to communicate with other devices.After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect result as well.PROM READ SEQUENCEThe read command for PROM shall be executed once after reset by the user to read the content of the calibration PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and address 7 contains the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first.I 2C INTERFACECOMMANDSEach I 2C communication message starts with the start condition and it is ended with the stop condition. The MS5525DSO address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does not have a microcontroller inside, the commands for I 2C and SPI are quite similar.RESET SEQUENCEThe reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5525DSO to function is to send several SCLKs followed by a reset sequence or to repeat power on reset.Figure 10: I2C Reset CommandPROM READ SEQUENCEThe PROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system.Figure 11: I2C Command to read memory address= 011 (Coefficient 3)Figure 12: I2C response from MS5525DSOS = Start Condition W = Write A = Acknowledge P = Stop ConditionR = ReadN = Not AcknowledgeS = Start Condition W = Write A = Acknowledge P = Stop ConditionR = ReadN = Not AcknowledgeS = Start Condition W = Write A = Acknowledge P = Stop ConditionR = ReadN = Not AcknowledgeCONVERSION SEQUENCEA conversion can be started by sending the command to MS5525DSO. When command is sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read command, when an acknowledge appears from the MS5525DSO, 24 SCLK cycles may be sent to receive all result bits. Every 8-bit the system waits for an acknowledge signal.Figure 13: I 2C Command to initiate a pressure conversion (OSR=4096, typ=D1)Figure 14: I 2C ADC read sequenceFigure 15: I 2C response from MS5525DSOCYCLIC REDUNDANCY CHECK (CRC)MS5525DSO contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data validity in memory. The application note AN520 describes in detail CRC-4 code used.S = Start Condition W = Write A = Acknowledge P = Stop ConditionR = ReadN = Not AcknowledgeS = Start Condition W = Write A = Acknowledge P = Stop ConditionR = ReadN = Not AcknowledgeS = Start Condition W = Write A = Acknowledge P = Stop ConditionR = ReadN = Not AcknowledgeMARKING, AND PRESSURE TYPE CONFIGURATIONPressure Type Pmin Pmax DescriptionAbsolute 0psiA +Prange Output is proportional to the difference between 0psiA (Pmin) and pressureapplied to Port 1.Differential/ Bidirectional -Prange +Prange Output is proportional to the difference between Port 1 and Port 2. Outputswings positive when Port 2> Port 1. Output is 50% of total counts whenPort 1=Port 2.Gauge 0psiG +Prange Output is proportional to the difference between 0psiG (Pmin) and Port 1.Output swings positive when Port 2> Port 1.WETTED MATERIAL BY PORT DESIGNATIONMaterialStyle Port LCP Thermo-EpoxyResinEpoxy RTV Glass Silicon Silicone GelAll Port 1 X X X X Port 2 X X X X X X"X" Indicates Wetted MaterialsPINOUT DESIGNATIONPin Name Pin FunctionI2C SPI SIN- 1,3 Sensor Input, Negative Sensor Input, Negative SOUT- 2,4 Sensor Outputs, Negative Sensor Outputs, Negative SDO 5 Not Applicable Serial Data Output SDA/SDI 6 I2C Data Input and Output SPI Serial Data Input SCL/SCLK 7 I2C Clock SPI ClockCSB 8 Defines I2C Address Chip Select (Active Low) Supply - 9 Return Supply Voltage Return Supply Voltage PS 10 Protocol SelectPS = (VDD) PS = (GND)I2C Protocol Selected SPI Protocol SelectedCSB= (VDD) I2C Address =1110110X (0xEC, 0xED)CSB= (GND) I2C Address=1110111X (0xEE, 0xEF) Supply + 11,13 Positive Supply Voltage Positive Supply VoltageSOUT+ 12,14 Sensor Outputs, Positive Sensor Outputs, PositiveBLOCK DIAGRAMFigure 5: SIN- Pins 1 and 3 of MS5525DSOTable BRECOMMEND PCB LAYOUTPad No.Function Notes1SIN-Connect to Pin 32SOUT-Connect to Pin 43SIN-Connect to Pin 14SOUT-Connect to Pin 25SDO6SDI/SDA7SCLK/SCL8CSB9SUPPLY-10PS11SUPPLY+Connect to Pin 1312SOUT+Connect to Pin 1413SUPPLY+Connect to Pin 1114SOUT+Connect to Pin 12Notes:[1] Function pins that share the same name (SOUT+, SOUT-, SIN-, SUPPLY+) must be connected on the PCB for proper operation, as described in the ‘Notes’ column of Table B.[2] Must place a 0.1µf decoupling capacitor between VDD and GND on PCB and as close as possible to sensor.APPLICATION CIRCUITThe MS5525DSO is a circuit thatcan be used in conjunction with a microcontroller. It is designed for low-voltage systems with a supply voltage of 3 V.Note:1. Place 100nF capacitor between Supply and GND to within 2cm of sensorDIMENSIONSMS5525DSO-DBxxxySORDERING INFORMATION5525DSO – DB 005 G S(2)Available in Differential and Gauge Pressure Types/sensorsolutionsMeasurement Specialties, Inc., a TE Connectivity company.Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners.The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2015 TE Connectivity Ltd. family of companies All Rights Reserved.NORTH AMERICAMeasurement Specialties, Inc., a TE Connectivity company Tel: 1 800-522-6752Email: ************************EUROPEMeasurement Specialties (Europe), Ltd., a TE Connectivity Company Tel: +31 73 624 6999Email: ************************ASIAMeasurement Specialties (China) Ltd., a TE Connectivity company Tel: 86 0400-820-6015Email: ************************。
软件工程选择题
chapter 11. Which question no longer concerns the modern software engineeringWhy does computer hardware cost so much?Why does software take a long time to finish?Why does it cost so much to develop a piece of software?Why can't software errors be removed from products prior to delivery?Answer: a2.Today the increased power of the personal computer has brought about an abandonment of the practice of team development of software.TrueFalseAnswer: b3.Software is a product and can be manufactured using the same technologies used for other engineering artifacts.TrueFalseAnswer: b4.Software deteriorates rather than wears out becauseSoftware suffers from exposure to hostile environments.Defects are more likely to arise after software has been used often.Multiple change requests introduce errors in component interactions.Software spare parts become harder to order.Answer: c5. Most software continues to be custom built becausea. Component reuse is common in the software world.b. Reusable components are too expensive to use.c. Software is easier to build without using someone else's components.d. Off-the-shelf software components are unavailable in many application domains.Answer: d6. The nature of software applications can be characterized by their informationa. complexityb. contentc. determinacyd. both b and cAnswer: d7. Change cannot be easily accommodated in most software systems, unless the system was designed with change in mind.TrueFalseAnswer: a8. The functionality of most computer systems does not need to be enhanced the lifetime of the system.TrueFalseAnswer: bchapter 21.Which of the items listed below is not one of the software engineering layers? Answer: bProcessManufacturingMethodsTools2.Software engineering umbrella activities are only applied during the initial phases of software development projects. Answer: bTrueFalse3.Which of these are the 5 generic software engineering framework activities? Answer: a communication, planning, modeling, construction, deploymentcommunication, risk management, measurement, production, reviewinganalysis, designing, programming, debugging, maintenanceanalysis, planning, designing, programming, testing4.Which of these terms are level names in the Capability Maturity Model? Answer: ePerformedRepeatedReusedOptimizedBoth a and d5. Which of the items listed below is not one of the process patterns. Answer: da. Intentb. Solutionc. Resulting Contextd. Output6. Process technology tools allow software organizations to compress schedules by skipping unimportant activities. Answer: ba. Trueb. False7. It is generally accepted that one cannot have weak software processes and create high quality end products. Answer: aTrueFalse8. The tasks (and degree of rigor) for each activity are always unchanged. Answer: bTrueFalsechapter 31.The linear sequential model of software development is Answer:aA reasonable approach when requirements are well defined.A good approach when a working program is required quickly.The best approach to use for projects with large development teams.An old fashioned model that cannot be used in a modern context.2.The linear sequential model of software development is also known as the Answer:eClassical life cycle modelFountain modelSpiral modelWaterfall modelboth a and d3.The incremental model of software development isAnswer:bA reasonable approach when requirements are well defined.A good approach when a working core product is required quickly.The best approach to use for projects with large development teams.A revolutionary model that is not used for commercial products.4.The rapid application development model isAnswer:cAnother name for component-based development.A useful approach when a customer cannot define requirements clearly.A high speed adaptation of the linear sequential model.All of the above.5. Evolutionary software process models Answer:dAre iterative in natureCan easily accommodate product requirements changesDo not generally produce throwaway systemsAll of the above6. The prototyping model of software development is Answer:ba. A reasonable approach when requirements are well defined.b. A useful approach when a customer cannot define requirements clearly.c. The best approach to use for projects with large development teams.d. A risky model that rarely produces a meaningful product.7. Which of these is not one of the phase names defined by the Unified Process model for software development? Answer:dInception phaseElaboration phaseConstruction phaseValidation phase8. In the Unified Process model requirements are determined iteratively and may span more than one phase of the process. Answer:aTrueFalsechapter 4Chapter 55. UML notations that can be used to model the hardware and software elements of a system areActivity diagramsClass diagramsDeployment diagramsUse-case diagramsa, b, and cAnswer: e6. The system model template contains which of the following elementsa. inputb. outputc. user interfaced. all of aboveAnswer: d7. The top level of the hierarchical model of a system is known as theAFDDFDSCDSFDAnswer: cChapter 61.In requirements validation the requirements model is reviewed to ensure its technical feasibility.TrueFalseAnswer: b2.In win-win negotiation, the customer's needs are met even though the developer's need may not be.TrueFalseAnswer: b3.Which of the following is not one of the context-free questions that would be used during project inception? What will be the economic benefit from a good solution?Who is against this project?Who will pay for the work?Who will use the solution?Answer: b4.The use of traceability tables helps todebug programs following the detection of run-time errorsdetermine the performance of algorithm implementationsidentify, control, and track requirements changesnone of the aboveAnswer: c5. The system specification describes theFunction, performance and constraints of a computer-based systemimplementation of each allocated systemelement software architecturetime required for system simulationAnswer: a6. Use-case actors are always people, never system devices.a. Trueb. FalseAnswer: b7. Which of the following is not one of the requirement classifications used in Quality Function Deployment (QFD)?excitingexpectedmandatorynormalAnswer: cChapter 71.Which of these is not an element of an object-oriented analysis model?Answer: cBehavioral elementsClass-based elementsData elementsScenario-based elements2.Which of the following is not an objective for building an analysis model? Answer: cdefine set of software requirements that can be validateddescribe customer requirementsdevelop an abbreviated solution for the problemestablish basis for software design3. The data flow diagram: Answer: edepicts relationships between data objectsdepicts functions that transform the data flowindicates how data are transformed by the systemindicates system reactions to external eventsboth b and c4.Which of the following items does not appear on a CRC card? Answer: cclass collaboratorsclass nameclass reliabilityclass responsibilities5. For purposes of behavior modeling a state is anyconsumer or producer of data.data object hierarchy.observable mode of behavior.well defined process.Answer: c6. Attributes cannot be defined for a class until design has been completed.a. Trueb. FalseAnswer: b7. Operations are object procedures that are invoked when an object receives a message.TrueFalseAnswer: a8. UML activity diagrams are useful in representing which analysis model elements?a. Behavioral elementsb. Class-based elementsc. Flow-based elementsd. Scenario-based elementsAnswer: dChapter 81.Which of the following are areas of concern in the design model? Answer: earchitecturedatainterfaceproject scopea, b and c2.Which of these are characteristics of a good design? Answer: eexhibits strong coupling between its modulesimplements all requirements in the analysis modelincludes test cases for all componentsprovides a complete picture of the softwareboth b and drmation hiding makes program maintenance easier by hiding data and procedure from unaffected parts of the program. Answer: aTrueFalse4.Cohesion is a qualitative indication of the degree to which a module Answer: bcan be written more compactly.focuses on just one thing.is able to complete its function in a timely manner.is connected to other modules and the outside world.5. Coupling is a qualitative indication of the degree to which a module Answer: dcan be written more compactly.focuses on just one thing.is able to complete its function in a timely manner.is connected to other modules and the outside world.6. Polymorphism reduces the effort required to extend an object system by Answer: bcoupling objects together more tightly.enabling a number of different operations to share the same namemaking objects more dependent on one another.removing the barriers imposed by encapsulation.7. Which design model elements are used to depict a model of information represented from the user's view? Answer: cArchitectural design elementsComponent-level design elementsData design elementsInterface design elements8. Which design is analogous to the floor plan of a house? Answer: aa. Architectural design elementsb. Component-level design elementsc. Data design elementsd. Interface design elements9. Which design model is analogous to the detailed drawings of the access points and external utilities for a house?Architectural design elementsComponent-level design elementsData design elementsInterface design elementsAnswer: d10. Which design model is analogous to a set of detailed drawings for each room in a house?a. Architectural design elementsb. Component-level design elementsc. Data design elementsd. Interface design elementsAnswer: b11. The deployment design elements specify the build order for the software components.a. Trueb. FalseAnswer: b12. One of the key problems in software reuse is the inability to find existing reusable design patterns when hundreds of candidates exist.a. Trueb. FalseAnswer: aChapter 91.An architectural style encompasses which of the following elements?Answer: ea.constraintsb.set of componentsc.semantic modelsd.syntactic modelse.a, b and c2.During the process of modeling the system in context, systems that interact with the target system are not represented as Answer: da.Peer-level systemsb.Subordinate systemsc.Super-ordinate systemsd.Working systems3.When the overall flow in a segment of a data flow diagram is largely sequential and follows straight-line paths, _________ is present. Answer: da.low couplingb.Good modularityc.transaction flowd.transform flow4.When you encounter both transform flow and transaction flow in the same DFD the flow is partitioned and the appropriate mapping technique is used on each part of the DFD. Answer: aa.Trueb.False5. When a single item that triggers other data flow along one of many paths of a data flow diagram, ________ characterizes the information flow.Answer: ca.high couplingb.poor modularityc.transaction flowd.transform flow6. In transaction mapping the first level factoring results in the Answer: ba.creation of CFD.b.derivation of control hierarchyc.distribution of work modulesd.refinement of the module view7. A successful application of transform or transaction mapping to create an architectural design is supplemented by Answer: ea.entity relationship diagramb.module interface descriptionsc.processing narratives for each moduled.test case for each modulee.Both b and c8. The best representation of system architecture is an operational software prototype. Answer: ba. Trueb. FalseChapter 101.In the context of object-oriented software engineering a component containsa.attributes and operationsb.instances of each classc.roles for each actor (device or user)d.a set of collaborating classesAnswer: d2. In traditional software engineering, modules must serve in which of the following roles?a.Control componentb.Infrastructure componentc.Problem domain componentd.All of the aboveAnswer: d3. Which of the following is not one of the four principles used to guide component-level design?a.Dependency Inversion Principleb.Parsimonious Complexity Principlec.Interface Segregation Principled.Open-Closed PrincipleAnswer: b4. Classes and components that exhibit functional, layer, or communicational cohesion are relatively easy to implement, test, and maintain. Answer: aa.Trueb.False5. In component design, elaboration does not require which of the following elements to be described in detail?a.Source codeb.Attributesc.Interfacesd.Operationse.b, c and dAnswer: a6. In component-level design "persistent data sources" refer to Answer: eponent librariesb.Databasesc.Filesd.All of the abovee.Both b and c7. The object constraint language (OCL) complements UML by allowing a software engineer to use a formal grammar to construct unambiguous statements about design model elements.a.Trueb.FalseAnswer: a8. Which of these criteria are useful in assessing the effectiveness of a particular design notation?a. maintainabilityb. modularityc. simplicityd. sizee. a, b, and cAnswer: eChapter 111.Which of the following interface design principles does not allow the user to remain in control of the interaction with a computer?Answer: da.allow interaction to interruptibleb.allow interaction to be undoablec.hide technical internals from casual usersd.only provide one defined method for accomplishing a task2.Which of the following interface design principles reduces the user's memory load? Answer: ea.define intuitive shortcutsb.disclose information in a progressive fashionc.establish meaningful defaultsd.provide an on-line tutoriale.answers a, b and c3.Interface consistency implies thatAnswer: ea.each application should have its own distinctive look and feelb.input mechanisms remain the same throughout the applicationc.navigational methods are context sensitived.visual information is organized according to a design standarde.both b and d4.The reason for reducing the user's memory load is make his or her interaction with the computer quicker to complete. Answer: ba.Trueb.False5. Which model depicts the profile of the end users of a computer system?Answer: ca.design modelb.implementation modeler modeler's model6. Which of these framework activities is not normally associated with the user interface design processes? Answer: aa.cost estimationb.interface constructionc.interface validationer and task analysis7. Which approach(es) to user task analysis can be useful in user interface design? Answer: ea.have users indicate their preferences on questionnairesb.rely on the judgement of experienced programmersc.study existing computer-based solutionsd.observe users performing tasks manuallye.both c and d8. Several usability measures can be collected while observing users interacting with a computer system including Answer: ea. down time for the applicationb. number of user errorsc. software reliabilityd. time spent looking at help materialse. both b and d1.Which of the following interface design principles allow the user to remain in control of the interaction witha computer?Answer: ea.allow interaction to interruptibleb.allow interaction to be undoablec.hide technical internals from casual usersd.only provide one defined method for accomplishing a taske.a, b and c2.Which of the following interface design principles does not reduce the user's memory load?a.define intuitive shortcutsb.disclose information in a progressive fashionc.establish meaningful defaultsd.provide an off-line tutoriale.answers a, b and cAnswer: d3.Interface consistency implies thata.each application should have its own distinctive look and feelb.input mechanisms remain the same throughout the applicationc.navigational methods are context sensitived.visual information is organized according to a design standarde.both b and dAnswer: e4.If past interactive models have created certain user expectations it is not generally good to make changes to the model.a.Trueb. FalseAnswer: a5. Which model depicts the image of a system that an end user creates in his or her head?a.design modeler modelc.system modeld.system perceptionAnswer: d6. Which of these framework activities is normally associated with the user interface design processes?a.cost estimationb.interface constructionc.interface validationer and task analysise.b, c and dAnswer: e7. Which approach(es) to user task analysis can be useful in user interface design?a.have users indicate their preferences on questionnairesb.rely on the judgement of experienced programmersd.observe users performing tasks manuallyAnswer: d8. Several common design issues surface for almost every user interface includinga. adaptive user profilesb. error handling resolution of graphicsc. response timed. displays systeme. both b and dAnswer: eChapter 121.What is the normal order of activities in which traditional software testing is organized?Answer:ca.integration testing, unit testing, system testing, validation testingb.validation testing, unit testing, integration testing, system testingc.unit testing, integration testing, validation testing, system testingd.system testing, validation testing, integration testing, unit testing2.Which of the following strategic issues needs to be addressed in a successful software testing process? Answer: ea.conduct formal technical reviews prior to testingb.specify requirements in a quantifiable mannere independent test teamsd.wait till code is written prior to writing the test plane.answers a and b3.Which of the following need to be assessed during unit testing? Answer: ea.algorithmic performanceb.code stabilityc.error handlingd.execution pathse.both c and d4.Drivers and stubs are not needed for unit testing because the modules are tested independently of one another. Answer: ba.Trueb.False5. Top-down integration testing has as it‘s major advantage(s) that Answer: ea.low level modules never need testingb.major decision points are tested earlyc.no drivers need to be writtend.no stubs need to be writtene.both b and c6. Bottom-up integration testing has as it's major advantage(s) that Answer: ca.major decision points are tested earlyb.no drivers need to be writtenc.no stubs need to be writtend.regression testing is not required7. The OO testing integration strategy involves testing Answer: ab.single operations as they are added to the evolving class implementationc.operator programs derived from use-case scenariosd.none of the above8. Which of the following is an approach to debugging? Answer: ea. backtrackingb. cause eliminationc. brute forced. code restructuringe. a, b and c1.What is the normal order of activities in which traditional software testing is organized?Answer: ca.integration testing, unit testing, system testing, validation testingb.validation testing, unit testing, integration testing, system testingc.unit testing, integration testing, validation testing, system testingd.system testing, validation testing, integration testing, unit testing2.Which of the following strategic issues needs to be addressed in a successful software testing process? Answer: ea.conduct formal technical reviews prior to testingb.specify requirements in a quantifiable mannere independent test teamsd.wait till code is written prior to writing the test plane.answers a and b3.Which of the following need to be assessed during unit testing? Answer: ea.algorithmic performanceb.code stabilityc.error handlingd.execution pathse.both c and d4.When testing object-oriented software it is important to test each class operation separately as part of the unit testing process. Answer: ba.Trueb.False5. Which of the following tests is a system test that forces the software to fail in a variety of ways and verifies that software is able to continue execution without interruption?Answer: da.security testingb.performance testingc.stress testingd.recovery testing6. Bottom-up integration testing has as it's major advantage(s) that Answer: ca.major decision points are tested earlyb.no drivers need to be writtenc.no stubs need to be writtend.regression testing is not requiredAnswer: aa.groups of classes that collaborate or communicate in some wayb.single operations as they are added to the evolving class implementationc.operator programs derived from use-case scenariosd.none of the above8. Which of the following is an approach to debugging?Answer: ea. backtrackingb. cause eliminationc. brute forced. code restructuringe. a, b and cChapter 131.Which of the following are characteristics of testable software? Answer: da.observabilityb.simplicityc.stabilityd.all of the above2.The testing technique that requires devising test cases to demonstrate that each program function is operational is called? Answer: aa.black-box testingb.glass-box testingc.grey-box testingd.white-box testing3.The testing technique that requires devising test cases to exercise the internal logic of a software module is called? Answer: da.behavioral testingb.black-box testingc.grey-box testingd.white-box testing4.The cyclomatic complexity metric provides the designer with information regarding the number ofa.cycles in the programb.errors in the programc.independent logic paths in the programd.statements in the program Answer: c5. Black-box testing attempts to find errors in which of the following categories Answer: da.incorrect or missing functionsb.interface errorsc.performance errorsd.all of the abovee.none of the above6. Testing OO class operations is made more difficult by Answer: dc.polymorphismd.both b and c7. What is the differences between black-box testing and white-box testing?Answer: Black-box testing involves testing the functionality of a software component without knowing the details of its internal logic. White-box testing involves testing the independent logic paths with full implementation knowledge.8. What is equivalence partitioning as it applies to software testing? What is scenario-based testing?Answer: Equivalence partitioning technique divides the input domain into classes of equivalent data items. Test cases are derived from combinations of elements from each equivalence class. Exhaustive testing of all input domain values is not necessary. Scenario-based testing: The user tasks described in the use-cases are used to construct the test cases. It is used to uncover errors that occur when actors interact with the software (focus is on user behavior, not product behavior).1.Which of the following are characteristics of testable software?Answer: da.observabilityb.simplicityc.stabilityd.all of the above2.The testing technique that requires devising test cases to demonstrate that each program function is operational is called? Answer:da.while-box testingb.glass-box testingc.grey-box testingd.black-box testing3.The testing technique that requires devising test cases to exercise the internal logic of a software module is called? Answer:ca.behavioral testingb.grey-box testingc.while-box testingd.black-box testing4.The cyclomatic complexity metric provides the designer with information regarding the number ofa.Independent logic paths in the programb.cycles in the programc.errors in the programd.statements in the program Answer: a5. Black-box testing attempts to find errors in which of the following categories Answer: da.incorrect or missing functionsb.interface errorsc.performance errorsd.all of the abovee.none of the above6. Testing OO class operations is made more difficult by Answer: da.polymorphismd.both b and c7. What is the differences between black-box testing and white-box testing?Answer: Black-box testing involves testing the functionality of a software component without knowing the details of its internal logic. White-box testing involves testing the independent logic paths with full implementation knowledge.8. What is equivalence partitioning as it applies to software testing? What is scenario-based testing?Answer: Equivalence partitioning technique divides the input domain into classes of equivalent data items. Test cases are derived from combinations of elements from each equivalence class. Exhaustive testing of all input domain values is not necessary. Scenario-based testing: The user tasks described in the use-cases are used to construct the test cases. It is used to uncover errors that occur when actors interact with the software (focus is on user behavior, not product behavior).。
NI VeriStand Model Framework用户指南说明书
INTRODUCTIONNI VeriStand Model Framework™The NI VeriStand software and the NI LabVIEW Model Interface Toolkit allow you to run simulations of your simulation models written in C and C++. To enable your models to interact with this NI software, you must design them to work with the NI VeriStand Model Framework, a group of files that provide entry points to your models.This guide describes the components of the NI VeriStand Model Framework, the process for creating model code that is compatible with the framework, and requirements for compiling your model with the framework.ContentsInteraction of Framework Code and Your Model Code (1)Installing the Model Framework (2)Components of the Model Framework (3)Components of Your Model Code (3)Overview: Model Creation and Compilation Process (4)Creating a model.h Header File (4)Adapting template.c to Serve as Your Model Code (5)Compiling Your Model with the NI VeriStand Model Framework (5)Where to Go Next (6)Interaction of Framework Code and Y our Model CodeWhen you run your test application, designed using NI VeriStand or the LabVIEW Model Interface Toolkit, the application executes functions defined in NI VeriStand Model Framework files. These functions then call functions in your model code, which convert user-defined data types, initialize your model, and take a time step.The following illustration shows how NI software, Model Framework code, and code in your model interact. In this illustration, your test application calls a function that the Model Framework exports. That function in turn calls a function in your model code.Figure 1. Interaction of NI Software, Framework Code, and Model CodeAs the model executes, the test application can interact with the model in the following ways:•Write data to model inports•Read data from model outports•Allow you to adjust model parameter values•Allow you to probe model signalsInstalling the Model FrameworkIn the NI VeriStand installer, the NI VeriStand Model Framework feature installs the Model Framework files on the host computer. If you cannot locate the files described in the next section of this document, run the NI VeriStand installer again and select the NI VeriStand Model Framework item from the list of features to install. You do not need to reinstall other NIsoftware to install the Model Framework.2||NI VeriStand Model Framework IntroductionNI VeriStand Model Framework Introduction |© National Instruments |3Components of the Model FrameworkThe following table describes the files in the Model Framework. These files describe how you must implement your model code.Components of Y our Model CodeYou typically create the following two files to implement your C/C++ model:•model.h —Contains the type definitions for your model parameters. This file must be named model.h and must include all the user-visible parameters in your model.•model.c —Contains your model code. Make a copy of template.c and modify the copy to ensure you maintain interdependent structures, such as headers, imported and exported symbols, and functions NI software recognizes, between your model code and ni_modelframework.c . You can name this .c file however you want.The next section of this document contains information about creating your model.h and .c files.FileDescription Installed Location ni_modelframework.h A header file that includes thefollowing components:•Type definitions that your model code can use to define properties of outward-facing components of your model, such as inports, outports, parameters, and signals.•Functions the NI VeriStand Model Framework exports to your compiled model.RootDrive :\VeriStand\version \ModelInterfacewhere RootDrive is the drive where NI software installs and version is the version number of NI VeriStand.ni_modelframework.c Implements the commoninterface between your test application and your model code.RootDrive :\VeriStand\version \ModelInterface\custom\srctemplate.c A template for your model code. Use this file to create code that maintains interdependent structures between your model and ni_modelframework.c .RootDrive :\VeriStand\version \ModelInterface\custom\examples4| |NI VeriStand Model Framework Introduction Overview: Model Creation and Compilation ProcessTo create a model written in C/C++ that NI software can load and execute via the Model Framework, you typically perform the following tasks:1.Create a model.h header file.2.Adapt template.c to serve as your model code.3.Create a makefile to compile your model code.The following sections contain high-level guidelines about the files you need to create and customize to prepare a model for use by NI software. However, these sections do not contain detailed instructions for creating and compiling a model using the Model Framework. For details about this process, refer to code comments inside the Model Framework files.Creating a model.h Header FileYou must create a header file named model.h for your model code. The model.h file contains the type definitions for model parameters and must include all the user-visible parameters in your model.The following code, copied from the model.h file in the engine model example atRootDrive :\VeriStand\version \ModelInterface\custom\examples\engine , provides an example of the model.h file you must create.Figure 2. Example model.h fileThe previous example contains definitions for both scalar and vector double parameters. For information about defining parameters whose data type is something other than double, refer to TO DO comments in the template.cfile installed by the Model Framework.NI VeriStand Model Framework Introduction |© National Instruments |5Adapting template.c to Serve as Y our Model Code The template.c file installed by the Model Framework serves as a starting point for your model code. You can save your C model file with any filename.Use the following guidelines to modify template.c to serve as your own model code:1.Refer to the contents of template.c for all the code you must customize, which is marked with TO DO comments. This file also contains information about how to instantiate and access parameters.2.Refer to the contents of ni_modelframework.h for the type definitions you must use to define properties of outward-facing components of your model, such as inports, outports, parameters, and piling Y our Model with the NI VeriStand Model FrameworkFor your model code to work with the NI VeriStand Model Framework, you must compile the model. To compile your model, create a makefile that is appropriate for the compiler you plan to use and the operating system on which the model will run. The following list describes the type of makefile to use and the corresponding output to generate:•Windows/NI ETS targets—Create a .mak makefile that generates a DLL. Refer to the National Instruments website at /info and enter the Info Code exjr6s for information about compiling a DLL for ETS targets.•VxWorks targets—Create a .mk makefile that generates a .out file. Refer to the National Instruments website at /info and enter the Info Code ex2xp2 for information about compiling a .out file for VxWorks targets.Note To determine which real-time operating system your RT target runs, refer to the National Instruments website at /info and enter the Info Code exxjax .Refer to the example .mak and .mk files installed in the RootDrive :\VeriStand\version \ModelInterface\custom\examples directory, where RootDrive is the drive where NI software installs and version is the version number of NI VeriStand, for examples of makefiles designed to compile models that work with the Model Framework.The following files must be present when you run a makefile to compile your model code:•ni_modelframework.h •ni_modelframework.c•model.h•model.c© 2009–2015 National Instruments. All rights reserved.372952C-01Aug15Refer to the NI Trademarks and Logo Guidelines at /trademarks for more information on National Instruments trademarks. Other product and company names mentioned herein are trademarks or trade names of their respective companies. For patents covering National Instruments products/technology, refer to the appropriate location: Help»Patents in your software, the patents.txt file on your media, or the National Instruments Patents Notice at /patents . You can find information about end-user license agreements (EULAs) and third-party legal notices in the readme file for your NI product. Refer to the Export Compliance Information at /legal/export-compliance for the National Instruments global trade compliance policy and how to obtain relevant HTS codes, ECCNs, and other import/export data. NI MAKES NO EXPRESS OR IMPLIED WARRANTIES AS TO THE ACCURACY OF THE INFORMATION CONTAINED HEREIN AND SHALL NOT BE LIABLE FOR ANY ERRORS. U.S. Government Customers: The data contained in this manual was developed at private expense and is subject to the applicable limited rights and restricted data rights as set forth in FAR 52.227-14, DFAR 252.227-7014, and DFAR 252.227-7015.Where to Go NextThe Model Framework installs several example models, including their .c and model.h files and makefiles. Refer to the RootDrive :\VeriStand\version \ModelInterface\custom\examples directory, where RootDrive is the drive where NI software installs and version is the version number of NI VeriStand, for examples of model code you can explore.Refer to the appropriate help system for the NI software you are using:•NI VeriStand Help —Available in NI VeriStand by selecting Help»Search the NI VeriStand Help . Browse to the Integrating and Executing Models section on the Contents tab for more information about simulating models in NI VeriStand.•Model Interface Toolkit Help —Available in LabVIEW by selecting Help»LabVIEW Help . Browse to the Toolkits»Model Interface Toolkit section on the Contents tab for more information about simulating models in LabVIEW with the Model Interface Toolkit.。
AT056TN53 V[1].1(Final V03(AA0560005111)0603
INNO L U X DISPLAY CORPORATIONLCD MODULESPECIFICATIONCustomer:Model Name: AT056TN53 V.1SPEC NO.: A056-53-TT-13Date: 2008/06/03Version: 03□Preliminary Specification■Final SpecificationRemark■AT056TN53 V.1 LCM (PCB)For Customer’s AcceptanceApproved by CommentApproved by Reviewed by Prepared byJoe Lin2008/06/03 Jack Huang2008/06/03David Lee2008/06/03聯凱光電The copyright belongs to InnoLux. Any unauthorized use is prohibited.I NNO L U XThe copyright belongs to InnoLux. Any unauthorized use is prohibited.InnoLux copyright 2004 All rights reserved, Copying forbidden.Record of RevisionVersion Revise Date Page ContentPre-spec.012007/06/05Initial ReleaseFinal-spec.01 2007/10/22 1 Add Backlight Power consumption & Panel Power consumption & Weight6 Add Max. values of Current Consumption 19 Modify Mechanical Drawing21 Modify Packaging Drawing 02 2008/04/177Modify Power Sequence8 Modify Timing Conditions03 2008/06/03 20 Modify Quantity of LCM Module And PartitionI NNO L U XContents:1.General Specifications (1)2.Pin Assignment (2)3.Operation Specifications (5)3.1. Absolute Maximum Ratings (5)3.2.Typical Operation Conditions (6)3.3.Power Sequence (7)3.4.Timing Characteristics (8)3.4.1.Timing Conditions (8)3.4.2.Timing Diagram (10)4. Optical Specifications (13)5.Reliability Test (17)6.General Precautions (18)6.1.Safety (18)6.2.Handling (18)6.3.Static Electricity (18)6.4.Storage (18)6.5.Cleaning (18)7.Mechanical Drawing (19)8.Package Drawing (20).8.1.Packaging Material Table (20).8.2.Packaging Quantity (20)8.3.Packaging Drawing (21)The copyright belongs to InnoLux. Any unauthorized use is prohibited.1.General SpecificationsNo. Item Specification Remark1 LCD size 5.6 inch(Diagonal)2 Driver element a-Si TFT active matrix3 Resolution 640 × (RGB) × 4804 Display mode Normally White, Transmissive5 Dot pitch 0.0588(W) × 0.1764(H) mm6 Active area 112.896 (W) × 84.672(H) mm7 Module size 126.5(W) × 100(H) × 5.7(D) mm Note 18 Surface treatment Anti-Glare9 Color arrangement RGB-stripe10 Interface Digital11 Backlight Power consumption 1.900W(Typ) Note 212 Panel Power consumption 0.660W(Typ) Note 313 Weight 88gNote 1: Refer to Mechanical Drawing.Note 2: Including LED Driver power consumption.Note 3: Including T-con Board power consumption.2.Pin AssignmentTFT LCD Panel Driving SectionFPC connector is used for the module electronics interface. The recommended model isFH19-40S -0.5SH manufactured by HiRose.Pin No. Symbol I/O Function Remark1 V LED P Power Voltage for LED circuit2 V LED P Power Voltage for LED circuit3 ADJ I Adjust the LED brightness with PWMPulseNote1,24 G LED P Ground for LED circuit5 G LED P Ground for LED circuit6 V CC P Power Voltage for digital circuit7 V CC P Power Voltage for digital circuit8 MODE I DE or HV mode control Note 39 DE I Data enable10 VS I Vsync signal input11 HS I Hsync signal input12 GND P Power ground13 B5 I Blue data input (MSB)14 B4 I Blue data input15 B3 I Blue data input16 GND P Power ground17 B2 I Blue data input18 B1 I Blue data input19 B0 I Blue data input(LSB)20 GND P Power ground21 G5 I Green data input(MSB)22 G4 I Green data input23 G3 I Green data input24 GND P Power ground25 G2 I Green data input26 G1 I Green data input27 G0 I Green data input(LSB)28 GND P Power ground29 R5 I Red data input(MSB)30 R4 I Red data input31 R3 I Red data input32 GND P Power ground33 R2 I Red data input34 R1 I Red data input35 R0 I Red data input(LSB)36 GND P Power ground37 DCLK I Sample clock38 GND P Power ground39 L/R I Select left to right scanning direction Note4,540 U/D I Select up or down scanning direction Note4,5 Note:I: input, O: output t, P: PowerNote1: Pin.3 is used to adjust brightness.Note 2:ADJ signal=0~3.3V,operation frequency:100~300HzNote 3: DE Mode, Mode=”H”,HS floating and VS floatingHV Mode, Mode=”L” and DE floatingNote 4: Selection of scanning modeSetting of scan control inputU/D L/RScanning directionGND V CC Up to down, left to rightV CC GND Down to up, right to leftGND GND Up to down, right to leftV CC V CC Down to up, left to rightNote 5: Definition of scanning direction.Refer to the figure as below:Left RightUpDown3.Operation Specifications3.1. Absolute Maximum Ratings(Note 1)ValuesUnit Remark Item SymbolMin. Max.V CC -0.3 6.5 V Power voltageV LED -0.3 6.5 V Operation temperature T OP -20 70 ℃Storage temperature T ST -30 80 ℃Note 1: The absolute maximum rating values of the module should not be exceeded.Once exceeded absolute maximum rating values, the characteristics of themodule may not be recovered. Even in an extreme condition, may result inmodule permanently destroyed.3.2. Typical Operation ConditionsValuesUnit Remark Item SymbolMin. Typ. Max.V CC 3.1 3.3 3.5 V Note 1 Power voltageV LED 4.8 5.0 5.2 V Note 2I CC - 200 250 mACurrent ConsumptionI LED- 380 450 mA Note 3Input logic high voltage V IH 0.7V CC- 1V CC VNote 4 Input logic low voltage V IL 0 - 0.3V CC VLED life time - 20,000 - - Hr Note 5Note 1: V CC setting should match the signals output voltage (refer to Note 4) of customer’s system board.Note 2: LED driving voltage.Note 3: LED driving current.Note 4: DCLK,DE, HS, VS, R0~ R5,,G0~ G5,B0~ B5.Note 5: The “LED life time” is defined as the module brightness decrease to 50% original brightness at Ta=25℃ and V LED=5.0V. The LED lifetime could be decreased ifoperating V LED is larger than 5.0V.3.3.Power SequencePower Supply VccData Signalt1t1 B/Lt2t3 Note:Data includes DE, VS ,HS,B0~B5,G0~G5,R0~R5,DCLK.t1 >50 mSect2>200 mSec3.4.Timing Characteristicsk3.4.1.Timing ConditionsInput/Output TimingValuesItem SymbolUnit. RemarkMin. Typ. Max.PXLCLK clock time Tclk 33.3 39.7 - nsPXLCLK pulse duty Tcwh 40 50 60 % Tclk DATA set-up time Tdsu 12 - - ns DATA to PXLCLK DATA hold time Tdhd 12 - - ns DATA to PXLCLK DE setup time Tesu 12 - - ns DE to PXLCLK VSYNC setup time Tvst 12 - - nsVSYNC hold time Tvhd 12 - - nsHSYNC setup time Thst 12 - - nsHSYNC hold time Thhd 12 - - nsHSYNC period time Th 22.91 31.76 - usHSYNC width Thwh 1 - - TclkVSYNC width Tvwh 1 - - ThHSYNC to CLKIN Thc - - 1 TclkDE Mode input Timing LimitationValuesUnit RemarkDE ModeMin. Typ. Max.THC 48 160 765 tclkTHD 640 640 640 tclkTH 688 800 1405 tclk 1TH=1lineTVC 6 45 255 lineTVD 480 480 480 lineTV 486 525 735 line 1TV=1fieldHV Mode input Timing LimitationValuesUnit Remark HV ModeMin. Typ. Max.Thwh - 10 - tclkThbp - 134 - tclkThfp - 16 - tclkTHD - 640 - tclkTH - 800 - tclk 1TH=1 lineTvwh - 2 - lineTvbp - 11 - lineTvfp - 32 - lineTVD - 480 - lineTV - 525 - line 1TV=1 field3.4.2.Timing DiagramFig.3-1 Clock and Data Input Timing Diagram4. Optical SpecificationsValuesItem Symbol ConditionMin. Typ. Max.Unit RemarkθL Φ=180°(9 o’clock) 60 70 -θRΦ=0°(3 o’clock) 60 70 -θTΦ=90°(12 o’clock) 40 50 -Viewing angle(CR≥10)θBΦ=270°(6 o’clock) 60 70 -degree Note 1T ON - 10 20 msec Note 3 Response timeT OFF -1530msec Note 3 Contrast ratio CR 400500-- Note 4W X 0.260.310.36-Color chromaticityW Y 0.280.330.38-Note 2Note 5Note 6 Luminance L1300350- cd/m² Note 6 Luminance uniformity Y UNormalθ=Φ=0°7075-% Note 6,7Test Conditions:1. V CC=3.3V, V LED=5.0V , the ambient temperature is 25.℃2. The test systems refer to Note 2.Note 1: Definition of viewing angle rangeFig. 4-1 Definition of viewing angleNote 2: Definition of optical measurement system.The optical characteristics should be measured in dark room. After 30 minutesoperation, the optical properties are measured at the center point of the LCD screen. (Response time is measured by Photo detector TOPCON BM-7, other items are measured by BM-5A/Field of view: 1° /Height: 500mm.)Fig. 4-2 Optical measurement system setupNormal line θ=Φ=0°Normal lineθ=Φ=0°Photo detectorΦ=90° 12 o’clock directionΦ=270°6 o’clock directionΦ=0°Φ=180°Active Area500mmLCD PanelΦ=90°12 o’clock directionΦ=270°6 o’clock directionΦ=0°Φ=180°Active Area θL θTθBθRNote 3: Definition of Response timeThe response time is defined as the LCD optical switching time interval between “White” state and “Black” state. Rise time (T ON) is the time between photo detector output intensity changed from 90% to 10%. And fall time (T OFF) is the time between photo detector output intensity changed from 10% to 90%.Fig. 4-3 Definition of response timeNote 4: Definition of contrast ratiostateBlack""theonisLCDwhenmeasuredLuminancestateWhite""theonisLCDwhenmeasuredLuminance=(CR)ratioContrastNote 5: Definition of color chromaticity (CIE1931)Color coordinates measured at center point of LCD.Note 6: All input terminals LCD panel must be ground while measuring the center area of the panel. The LED driving condition is V LED=5.0V90%10%0%Photodetectoroutput(Relativevalue)ONTWhite (TFT OFF) Black (TFT ON) White (TFT OFF)Note 7:Definition of Luminance UniformityActive area is divided into 9 measuring areas (Refer to Fig. 4-4 ).Every measuring point is placed at the center of each measuring area.maxminBB(Yu)UniformityLuminance=L-------Active area length W----- Active area widthWW/3W/3W/6L/3L/3L/6LFig. 4-4 Definition of measuring pointsB max: The measured maximum luminance of all measurement position.B min: The measured minimum luminance of all measurement position.5.Reliability Test(Note3)Item Test Conditions Remark High Temperature Storage Ta = 80℃240 hrs Note 1, 4 Low Temperature Storage Ta = -30240hrs℃Note 1,4High Temperature Operation Ts = 70240hrs℃Note 2,4Low Temperature Operation Ta = -20240hrs℃Note 1,4Operate at High Temperature and Humidity +40, 90%RH 240 hrs℃Note 4Thermal Shock -30/30 min ~ +℃80/30 min for a total 100℃cycles, Start with cold temperature and endwith high temperatureNote 4Vibration Test Frequency range:10~55Hz Stroke:1.5mmSweep:10Hz~55Hz~10Hz2 hours for each direction of X. Y. Z.(6 hours for total)Mechanical Shock 100G 6ms,±X, ±Y, ±Z 3 times for each directionPackage Vibration Test Random Vibration :0.015G*G/Hz from 5-200HZ, -6dB/Octave from 200-500HZ2 hours for each direction of X. Y. Z.(6 hours for total)Package Drop Test Height:60 cm1 corner, 3 edges, 6 surfacesElectro Static Discharge ± 2KV, Human Body Mode, 100pF/1500ΩNote 1: Ta is the ambient temperature of samples.Note 2: Ts is the temperature of panel’s surface.Note 3: In the standard condition, there shall be no practical problem that may affect the display function. After the reliability test, the product only guaranteesoperation, but doesn't guarantee all the cosmetic specification.Note 4: Before cosmetic and function tests , the product must have enough recovery time, at least 2 hours at room temperature.6.General Precautions6.1.SafetyLiquid crystal is poisonous. Do not put it in your mouth. If liquid crystal touches your skin or clothes, wash it off immediately by using soap and water.6.2.Handling1. The LCD panel is plate glass. Do not subject the panel to mechanical shock or toexcessive force on its surface.2. The polarizer attached to the display is easily damaged. Please handle it carefullyto avoid scratch or other damages.3. To avoid contamination on the display surface, do not touch the module surfacewith bare hands.4. Keep a space so that the LCD panels do not touch other components.5. Put cover board such as acrylic board on the surface of LCD panel to protect panelfrom damages.6. Transparent electrodes may be disconnected if you use the LCD panel underenvironmental conditions where the condensation of dew occurs.7. Do not leave module in direct sunlight to avoid malfunction of the ICs.6.3.Static Electricity1. Be sure to ground module before turning on power or operating module.2. Do not apply voltage which exceeds the absolute maximum rating value.6.4.Storage℃1. Store the module in a dark room where must keep at +25±10 and 65%RH orless.2. Do not store the module in surroundings containing organic solvent or corrosivegas.3. Store the module in an anti-electrostatic container or bag.6.5.Cleaning1. Do not wipe the polarizer with dry cloth. It might cause scratch.2. Only use a soft sloth with IPA to wipe the polarizer, other chemicals mightpermanent damage to the polarizer.7.Mechanical Drawing8.Package Drawing.8.1.Packaging Material TableNo. ItemModel(Material)Dimensions(mm)UnitWeight(kg)Quantity Remark1 LCMModuleAT056TN53 V.1 126.5 × 100 × 5.7 0.088 60pcs2 Partition B Corrugatedpaper105 × 349 0.020 8pcs3 CorrugatedBoardB Corrugatedpaper510 × 350 0.144 2pcs4 PartitionPaperBC Corrugatedpaper512 × 226 × 349 1.170 1set5 Dust-ProofBagPE 700 × 530 0.060 1pcs6 A/S Bag PE 170 × 110 × 0.2 0.002 60pcs7 Carton Corrugated paper 530 × 355 × 255 1.100 1 pcs8 Total Weight 8.178kg±5%.8.2.Packaging QuantityTotal LCM quantity in Carton: no. of Partition 4 Rows x quantity per Row 15= 608.3.Packaging Drawing。
DeltaV中英文词汇对照表
Device Control (DC) 设备控制
Device Signal Tag(DST) 设备信号标签
Device Tag 设备位号
Diagnostics 诊断
dimension 尺寸
diode 二极管
Discrete I/O Card 离散量I/O卡件
I/O 输入/输出
icon 图标
idle 空闲
import 导入
index 索引
indicator 指示灯
initiation 初始化
install 安装
instance 实例
integration 集成
integrator 积分器
intellectual property 知识产权
Bias/Gain (BG) 偏差/增益
bind 绑定
block 功能块
Books Online 在线文档
Boolean Fan Input 布尔扇输入
Boolean Fan Output 布尔扇输出
broker 代理程序
Broadcast Mode 广播模式
Current Limiter 电流限幅器
D
Daily Export 每日导出
Daisy chain 菊花链拓扑
Data Compression 数据压缩
Data Conversion 数据转换
Data Entry Expert 数据输入专家
Data Source 数据源
equipment 设备
Equipment Trains 设备链
Equipment modules 设备模块
Method and system for protecting data of storage u
专利名称:Method and system for protecting data ofstorage unit发明人:Kuen-Tsan Wu,Jung-Hsun Yu,Yu-ChengSheng申请号:US10787975申请日:20040227公开号:US20050193195A1公开日:20050901专利内容由知识产权出版社提供专利附图:摘要:A method and a system for protecting data of a storage unit are disclosed for use in a data processing device. A user identification module encodes and encrypts apassword preset by the user and stores the encoded and encrypted password into the storage unit. Next, the user identification module encodes and encrypts partition table data read from a memory unit and stores the encoded and encrypted partition table data in a predetermined location of the storage unit. Then, the user identification module deletes the partition table data stored in the memory unit. Finally, when the user re-starts power of the data processing device and inputs a password consistent with the preset password, the user identification module decodes and decrypts the partition table data stored in the storage unit and writes the decoded and decrypted partition table data to the memory unit to thereby perform booting operation.申请人:Kuen-Tsan Wu,Jung-Hsun Yu,Yu-Cheng Sheng地址:Taipei TW,Taipei TW,Taipei TW国籍:TW,TW,TW更多信息请下载全文后查看。
SIMADYN D数字控制系统处理器模块PM16用户手册说明书
SIMADYN DUser Manual Digital Control SystemProcessor module PM16Edition 05.95DK-Nr. 221441User Manual, Processor module PM16Edition Edition status 1Processor module PM1603.91 2Processor module PM1605.95Copying of this document and giving it to others and the use orcommunication of the contents thereof is forbidden without expressauthority. Offenders are liable to the payment of damages. All rightsare reserved in the event of the grant of a patent or the registration ofa utility model or design.We have checked the contents of this Manual to ensure that theycoincide with the described hardware and software. However,deviations cannot be completely ruled-out, so we cannot guaranteecomplete conformance. However, the information in this document isregularly checked and the necessary corrections included insubsequent editions. We are thankful for any recommendations orsuggestions.ContentsContentsWarning information (1)1. Order Designation: (3)2. Functional Description (3)3. Board Design (4)4. Application Notes (5)5. Technical Specifications (8)5.1. General Data (8)5.2. Electrical data (8)5.2.1. Power supply (8)5.2.2. Binary inputs (9)5.2.3. Binary outputs (9)5.2.4. Serial Interfaces (9)6. Pin allocation of the PM16 (10)6.1. Allocation of the serial interfaces X01, X02 (10)6.2. Pin allocation of the binary inputs and outputs, Connector X5 (11)7. STRUC L-Mask for the PM16 board Master program (12)8. Appendix (13)8.1. Block diagram (13)8.2. Scale drawing and connector table (13)8.3. Arrangement drawing (13)9. Miscellaneous (13)10. ECB instructions (14)Siemens AG Dk-Nr. 221441Edition 05.95SIMADYN D Hardware User ManualWarning informationEdition 05.95Siemens AG Dk-Nr. 221441SIMADYN D Hardware User ManualWarning informationN O T E !The information in this Manual does not purport to cover all details or variations in equipment, nor to provide for every possible contingency to be met in connection with installation, operation or maintenance.Should further information be desired or should particular problems arise which are not covered sufficiently for the purchaser’s purposes, please contact your local Siemens office.Further, the contents of this Manual shall not become a part of or modify any prior or existing agreement, committment or relationship. The sales contract contains the entire obligation of Siemens. The warranty contained in the contract between the parties is the sole warranty of Siemens. Any statements contained herein do not create new warranties nor modify the existing warranty.Warning informationSiemens AG Dk-Nr. 221441Edition 05.951 SIMADYN D Hardware User ManualWarning information2Edition 05.95Siemens AG Dk-Nr. 221441SIMADYN D Hardware User ManualDefinitions*QUALIFIED PERSONNELFor the purpose of this User Manual and product labels, a …Qualified person“ is someone who is familiar with the installation, mounting, start-up and operation of the equipment and the hazards involved. He or she must have the following qualifications:1.Trained and authorized to energize, de-energize, clear, ground and tag circuits and equipment in accordance with established safety procedures.2.Trained in the proper care and use of protective equipment in accordance with established safety procedures.3.Trained in rendering first aid.*DANGERFor the purpose of this User Manual and product labels, …Danger“ indicates death, severe personal injury and/or substantial property damage will result if proper precautions are not taken.*WARNINGFor the purpose of this User Manual and product labels, …Warning“ indicates death, severe personal injury or property damage can result if proper precautions are not taken.*CAUTIONFor the purpose of this User Manual and product labels, …Caution“ indicates that minor personal injury or material damage can result if proper precautions are not taken.*NOTEFor the purpose of this User Manual, …Note“ indicates information about the product or the respective part of the User Manual which is essential to highlight.W A R N I N G !Hazardous voltages are present in this electrical equipment during operation.Non-observance of the safety instructions can result in severe personal injury orproperty damage.It is especially important that the warning information in all of the relevantOperating Instructions are strictly observed.Order Designation: 1. Order Designation:6DD 1600 - 0AF0 Processor module PM16 with 128K RAM for software versions from 3.0 .2. Functional DescriptionThe processor module PM16 processes general technological control, calculation and regulation tasks in the SIMADYN D system. These tasks lie above the drive level control and regulation functions (torque shell). The board contains the -CMOS- 16 bit microprocessor 80C186 - 16MHz with corresponding peripherals.Plug-in program memory modules (MS31, MS3) are used in the mounting location X50 for the board user programs as well as for the system firmware (operating system, supervisor program, function module code, .... ). The user programs run on the processor under the SIMADYN D real time operating system. This guarantees interrupt controlled fixed cycle times of ≥ 1ms, dependent upon the configuration.There are 16 binary input and 16 binary output channels available for the fast exchange of data with the process IO (connector X5).The binary inputs can be declared, via software, as interrupt inputs. At the occurrence of a signal edge at an interrupt input, the processor interrupts the current cyclic processing and runs the function packet process interrupt job PIJ . Connection cables carrying binary signals are connected to interface modules and not directly to the processor module.The interface modules implement both the mechanical connection terminal and the electrical signal adaptation. The plant signals can be directly connected to these terminals.Two serial interfaces (connectors X01, X02) are available for communication :- to a higher level computer- for data transfers between SIMADYN D systems- listing outputs to printers- to the SIMADYN D system peripheral IO(operator panel OP1, service unit US1 and programming unit PG 675, 685 or 750)The seven segment display on the board front panel, indicates a "-" character during the start-up phase and the configured processor number during normal operation. The display flashes with an error code when a fault occurs.The error codes are described in the processor module handling instructions /1/.When an error message is displayed, the HEX supervisor can be activated by pressing the S1 key.A forced board reset (Restart) can be initiated using the twin jack connectors X10 and X11 . The jack connectors must therefore be jumpered by a switch or a shorting plug.The 50 pin diagnostic connector X4 is available on the board for hardware diagnostics using a logic analyzer or a recorder.Three watchdogs are installed on each processor board to monitor the hardware and software system states.Siemens AG Dk-Nr. 221441Edition 05.953 SIMADYN D Hardware User ManualBoard DesignThe hardware monitor checks:- Ready signal time-outs during system bus accessing- Double address decoding errors- Accessing unused or non-existent addresses- Collision detection of a DMA access with a system bus access (Detection can be disabled bysoftware)- System bus fault messagesThe software monitor checks:- Whether the processor is still running a cyclic task.- Whether the interrupt controller for the serial interface, timer and inputs are fully operational.A "Non-Maskable Interrupt" (NMI) is generated when the supervisor detects a fault. The processor attempts to resolve the problem and resume cyclic operation. If the fault is caused by the processor itself, then the processor switches to 'inactive', the red dot on the seven segment display is switched on and the bus signal "system error" is activated.3. Board Design- Connectors for local and communication busses.- CPU 80C186 - 16 MHz- RAM 128 K ByteBattery buffered by the power supply (PS)- Connector terminal for the program memory sub-modules MS3/31/4/45- 2 serial interfacesselection of V24(RS232), 20mA(TTY), RS485- 16 binary inputsno galvanic isolation, used as interrupt controlled inputs- 16 binary outputsno galvanic isolationmaximum of 30V / 50mA- Real time clockresolution 10 ms; battery buffered by the PS- 7 segment display for the configured processor numberor error display- Board identification4Edition 05.95Siemens AG Dk-Nr. 221441SIMADYN D Hardware User ManualApplication Notes- Hardware and software monitoring by watchdogs- Test connector for a logic analyzer or recorder4. Application NotesThe processor module PM16 can be installed in both the large racks such as SR1 and SR5 with local and communication busses and the small racks such as SR2 and SR4 with local bus. It occupies two standard slots in the racks.The rack must either be installed with the bus terminator or a memory coupling board.The board can be installed on any rack slot with "slot number coding", that contains the SIMADYN D system bus interface. Whereby, it should be noted that the left-aligned slot must be installed with a local bus master (processor module). If this is not adhered to, then the local peripheral boards will not be supplied with the 8MHz clock. Daisy chain jumpers must be installed on empty slots for multi-processor configurations.The board must be fixed to the rack by screws (even during commissioning) to ensure correct functioning.If the board is connected to an adapter, then the frame must be shorted to the rack housing by a short conductor.The board may not be pulled or installed under power.When the serial interfaces X01 and X02 are used, then thick film interface modules (hybrid modules) must be installed. The following hybrid modules are currently available:SS1 : 20 mA (TTY)SS2 : V.24 (RS 232)SS3 : (RS 485)The hybrid module for the serial interface X01 is to be installed on connector X51 (U1) and on connector X52 (U2, see printed diagram) for the interface X02 .ATTENTION: CHECK INSTALLATION LOCATION CAREFULLY!The binary inputs and outputs are connected via interface modules, which are fixed to a terminal rail. The connection from the board connector X5 to the interface modules is implemented with ribbon cable.Siemens AG Dk-Nr. 221441Edition 05.955 SIMADYN D Hardware User ManualApplication Notes6Edition 05.95Siemens AG Dk-Nr. 221441SIMADYN D Hardware User Manual The following connection configurations are possible:a) All 16 binary inputs and outputs are brought from the PM16 connector X5 to the interface module SE3.1 (24V no galvanic isolation) via a 40 pin ribbon cable.The external connection to the plant are implemented there (screw terminals).X516 Binärin/outputs 24V PM16ribbon cable 40-wayb) The 16 binary inputs and outputs are distributed to 4 different interface modules. A ribbon cable istherefore connected to the PM16 board connector X5 with split connectors at the other end (4x10 pin) which are then brought out to the interface modules. It is then possible to connect e.g. 8 inputs or outputs with galvanic isolation and 8 without galvanic isolation. The reference voltage ofM24/screen may be selected via the DIP-FIX switch S2 for the binary input signals. The default setting is the reference voltage for M24 (s. 2GE 465 600 9005.01 AO).X516 binaryin/outputs 24V PM16binary signals 40-way10-way 10-way 10-way 10-wayApplication NotesAdditional PM16 components:a) Serial Interfaces- Hybrid interface SS1 (20 mA)6DD 1688-1AA0- Hybrid interface SS2 ( V24 )6DD 1688-1AB0- Cable PM-SE12.1 : SC30.1 20 mA/ 2 m6DD 1684-0DA1- Cable PM-AS 512 : SC22.1 20 mA/ 10 m6DD 1684-0CC1- Cable PM-PG 675 : SC32 20 mA/ 10 m6DD 1684-0DC0- Cable PM-printer : SC34 20 mA/ 10 m6DD 1684-0DE0- Set of parts 25pin Cannon connector: SM3.16DD 1680-0AD0- Hybrid interface SS3 (RS485)6DD 1688-1AC0- Cable : SC27 RS485/ 2,1 m6DD 1684-0CH0- SE 47.1 Bus connector module6DD 1681-0EH0b) Binary input cable- 40pin 2,0 m SC186DD 1684-0BJ0- 40pin --> 4+10pin 2,0 m SC136DD 1684-0BD0c) Interface module- SE3.16DD 1681-0AD016 Binary inputs and outputs, no galvanic isolation- SE4.16DD 1681-0AE18 Binary inputs and outputs, no galvanic isolation- SE5.36DD 1681-0AF38 Binary inputs maximum 220V galvanic isolation- SE6.16DD 1681-0AG18 Binary outputs maximum 220V galvanic isolation- SE376DD 1681-0DH08 Binary outputs 24V galvanic isolation- SE41.16DD 1681-0EB18 Binary inputs 48V galvanic isolation6DD 1681-0EB28 Binary inputs 24V galvanic isolationTechnical Specifications5. Technical Specifications5.1. General DataINSULATION GROUP A FROM VDE 011 PARAGRAPH 13 GROUP 2 AT 24V-,15V,5V-AMBIENT TEMPERATURE0 TO 55 DEG. C WITH FORCED VENTILATIONSTORAGE TEMPERATURE-40 TO +70 DEG. CHUMIDITY CLASS F ACCORDING TO DIN 40050ALTITUDE RATING S ACCORDING TO DIN 40040MECHANICAL STRESS INSTALL IN FIXED EQUIPMENT, SENSITIVE TO VIBRATIONS PACKAGING SYSTEM ES 902 CDIMENSIONS233,4 * 220 MMBOARD WIDTH 2 2/3 SEP = 2EB = 40.28 MMWEIGHT0,7 KG5.2. Electrical data5.2.1. Power supplycross-connectionprotection Fuse protectionVOLTAGE+ 5 V no noVOLTAGE+ 15 V no noVOLTAGE- 15 V no noVOLTAGE VCC no noVOLTAGE+ 3,4 V EXT yes noDES MIN TYPICAL MAX UNIT VOLTAGE(+ 5 V)+ 5 V+ 4,75+ 5,25V VOLTAGE(+ 15 V)+ 15 V+ 14,40+ 15,60V VOLTAGE(- 15 V)- 15 V- 14,40- 15,60V VOLTAGE VCC VCC+ 2,20+ 5,25V VOLTAGE(+ 3,4 V EXT)+ 3,4 V EXT+ 2,20+ 5,90V HARMONICS(+ 5 V)0,10Vpp HARMONICS(+ 15 V)0,15Vpp HARMONICS(- 15 V)0,15Vpp HARMONICS VCC ---Vpp HARMONICS(+ 3,4 V) ---Vpp CURRENT(+ 5 V) without modules1,30A CURRENT(+ 5 V) without module1,40A CURRENT(+ 15 V)0,05A CURRENT(- 15 V)0,05A CURRENT VCC (buffered)0,80mA CURRENT(+ 3,4 V) (buffered)1,15mA POWER LOSS(+ 5 V) without modules7,00VAPOWER LOSS(+ 15 V)0,78VAPOWER LOSS(- 15 V)0,78VAVCC4,00mVA(+ 3,4 V)3,90mVA8Edition 05.95Siemens AG Dk-Nr. 221441Technical Specifications 5.2.2. Binary inputsNUMBER16 NO GALVANIC ISOLATIONINPUT VOLTAGE+ 24 V RATED VALUEINPUT VOLTAGEFOR 0 SIGNAL-1 V TO + 6 V ;OR BINARY INPUT OPENFOR 1 SIGNAL+ 13 V TO + 33VINPUT CURRENTFOR 1 SIGNAL TYP. 3 MARESPONSE TIME220 uS with hybrid capacitorRESPONSE TIME20 uS without hybrid capacitor / Standard design5.2.3. Binary outputsNUMBER16 NO GALVANIC ISOLATION!POWER SUPPLY P24 EXTERNAL SUPPLY-RATED VALUE24 V --HARMONICS 3.6 V --PERM. RANGE+ 20 TO +30 V INCL. HARMONICS-TEMPORARILY+ 35 V SMALLER 0,5 SEC.CURRENT COMSUMP.P24 MAX. 900mAOUTPUT CURRENT FOR 1 SIGNAL-RATED VALUE50 MA-PERM. RANGE0.2 MA TO 50 MASHORT CIRCUIT PROTECT ELECTRONICINDUCTIVE LIMITATIONTRIP VOLTAGE AT V CC + 1 VTOTAL LOADING80 % FOR 50 DEG C ALL OUTPUTS 50 MARESIDUAL CURRENT20 uA FOR O SIGNALSIGNAL LEVEL-FOR 0 SIGNAL MAX. 3 V-FOR 1 SIGNAL MIN. SUPPLY - 2.5 VSWITCHING DELAY15 uS5.2.4. Serial InterfacesNUMBER2DATA RATE MAX. 19.2 KBd / SS1 (20 mA) / SS2 (V24)MAX. 1.0 MBD / SS3 (RS485)Pin allocation of the PM166. Pin allocation of the PM166.1. Allocation of the serial interfaces X01, X02PIN V2420 MA (TTY)1FRAME GROUND FRAME GROUND2TRANSMIT DATA OUT T*D ---3RECEIVE DATA IN R*D ---4REQUEST TO SEND OUT*RTS ---5CLEAR TO SEND*CTS ---6DATA SET READY IN ---7GROUND ---8DATA CARRIER DETECT IN*DCD ---9GROUND GROUND10 ---CURRENT LOOP + TRANSMIT+T*D11+ 15 V+ 15 V12 ---20 MA SOURCE 113 ---CURRENT LOOP + RECEIVE+R*D14 ---CURRENT LOOP - RECEIVE-R*D15RECEIVE/TRANSMIT CLOCK*RT*C ---16 ---20 MA SOURCE 217RECEIVE/TRANSMIT CLOCK ---18GROUND GROUND19 ---CURRENT LOOP - TRANSMIT-T*D20DATA TERMINAL READY OUT ---21 ---20 MA DRAIN 122+ 5 V+ 5 V23+ 5 V+ 5 V24TRANSMIT RECEIVE CLOCK*TR*C20 MA DRAIN 225- 15 V- 15 VPIN RS4851FRAME GROUND2REQUEST TO SEND+OUT 1,D3TRANSMIT/RECEIVE CLOCK+IN 2,R4 ---5TRANSMIT DATA OUT+OUT 2,D6RECEIVE/TRANSMIT CLOCK+IN 3,R7DATA CARRIER DETECT+IN 4,R8RECEIVE DATA IN+IN 1,R9GROUND10 ---11+ 15 V12 ---13 ---14REQUEST TO SEND-OUT 1,D15TRANSMIT/RECEIVE CLOCK-IN 2,R16 ---17TRANSMIT DATA OUT-OUT 2,D18GROUND19RECEIVE/TRANSMIT CLOCK-IN 3,R20DATA CARRIER DETECT-IN 4,R21RECEIVE DATA IN-IN 1,R22+ 5 V23+ 5 V24 ---25- 15 V10Edition 05.95Siemens AG Dk-Nr. 221441Pin allocation of the PM166.2. Pin allocation of the binary inputs and outputs, Connector X5Ribbon cable connectorPIN DES.CONNECTOR1OUTPUT 1X5 A2OUTPUT 2X5 A3OUTPUT 3X5 A4OUTPUT 4X5 A5OUTPUT 5X5 A6OUTPUT 6X5 A7OUTPUT 7X5 A8OUTPUT 8X5 A9P EXTERNAL X5 A10M EXTERNAL X5 A11OUTPUT 9X5 B12OUTPUT 10X5 B13OUTPUT 11X5 B14OUTPUT 12X5 B15OUTPUT 13X5 B16OUTPUT 14X5 B17OUTPUT 15X5 B18OUTPUT 16X5 B19P EXTERNAL X5 B20M EXTERNAL X5 B21INPUT 1X5 C pos. INTERRUPT CONTROLLED22INPUT 2X5 C pos. INTERRUPT CONTROLLED23INPUT 3X5 C pos. INTERRUPT CONTROLLED24INPUT 4X5 C pos. INTERRUPT CONTROLLED25INPUT 5X5 C pos. INTERRUPT CONTROLLED26INPUT 6X5 C pos. INTERRUPT CONTROLLED27INPUT 7X5 C pos. INTERRUPT CONTROLLED28INPUT 8X5 C pos. INTERRUPT CONTROLLED29P EXTERNAL30M EXTERNAL31INPUT 9X5 D pos. INTERRUPT CONTROLLED32INPUT 10X5 D pos. INTERRUPT CONTROLLED33INPUT 11X5 D pos. INTERRUPT CONTROLLED34INPUT 12X5 D pos. INTERRUPT CONTROLLED35INPUT 13X5 D pos. INTERRUPT CONTROLLED36INPUT 14X5 D pos. INTERRUPT CONTROLLED37INPUT 15X5 D pos. INTERRUPT CONTROLLED38INPUT 16X5 D pos. INTERRUPT CONTROLLED39P EXTERNAL40M EXTERNALSTRUC L-Mask for the PM16 board Master program7. STRUC L-Mask for the PM16 board Master program(see Master program description)STRUC-L MASK: PM16 ^"processor module 1 standard, L+C-bus^"PIJ 1N = 0 ^"alarm processing FP^"SFJ 1N = 0 ^"system error FP^"PRX 1N = 0 ^"special communication FP receive^"PJ1 1N = ? ^"1. permanent processing FP^"PJ2 1N = 0PJ3 1N = 0PJ4 1N = 0PJ5 1N = 0PJ6 1N = 0PJ7 1N = 0PJ8 1N = 0PTX 1N = 0 ^"special communication FP transmit^"ILS IK = 0 ^"L-Bus-Interrupt transmit^"ICS IK = 0 ^"C-Bus-Interrupt transmit^"TO TG = ? ^"basic sampling time^"T1 TS = ? ^"1. s.t.*T0,produced LB- and CB-conn.^"T2 TS = ? ^"2. s.t. ^" ^"T3 TS = ? ^"3. s.t. ^" ^"T4 TS = ? ^"4. s.t. ^" ^"T5 TS = ? ^"5. s.t. ^" ^"TY TX = T? ^"sampling time of system FP^"SSM 2C = 0 ^"Length SAVE-area, (n*1+2) kByte^"ISE 1C = N ^"Ignore syst. except. (RDYINT) (Y/N) ?^"CCT 8R = 0 ^"transmitter communication names.Tx^"CCR 8R = 0 ^"receiver communication names.Tx^"COP 8R = 0 ^"service communication names.Tx^"CMS 8N = 0 ^"message system names^"CTS 8N = 0 ^"comm. transport system names^"MS 2M = 0 ^"message systems^"X01 1M = 0 ^"1. serial interface^"X02 1M = 0 ^"2. serial interface^"X5C 8K < ^"binary inp. 1, interrupt ctr.^"X5D 8K < ^"binary inp. 2, interrupt ctr.^"X5A 8K > ^"binary outputs 1^"X5B 8K > ^"binary outputs 2^"The PM16 requires 3 Sub-modules :- 1 * PROGRAM MEMORY- 2 * SERIAL INTERFACESThe X5 connector, binary input and output, can be accessed by the following function modules: CONN. SECTION FUNCTION MODULEX5C -|--|- BII8 Binary input (8 Binary valu&es)X5D -| |- BID8 Binary input (8 Binary valu&es, normal mode)12Edition 05.95Siemens AG Dk-Nr. 221441Appendix|- SBI Numerical input, ByteX5A -|--|- BIQ8 Binary output (8 Binary valu&es)X5B -| |- BQD8 Binary output (8 Binary valu&es, normal mode)|- SBQ Numerical output, Byte8. Appendix8.1. Block diagramBlock diagram 3GE.465 600.9005.01 SU8.2. Scale drawing and connector tableScale drawing with front panel view and table ofthe utilized connectors 3GE.465 600.9005.00 MB8.3. Arrangement drawingArrangement drawing 3GE.465 600.9005.02 AO9. MiscellaneousECB instructions10. ECB instructionsComponents which can be destroyed by electrostatic discharge (ECB)Generally, electronic boards should only be touched when absolutely necessary.The human body must be electrically discharged before touching an electronic board. This can be simply done by touching a conductive, grounded object directly beforehand (e.g. bare metal cubicle components, socket outlet protective conductor contact.Boards must not come into contact with highly-insulating materials - e.g. plastic foils, insulated desktops, articles of clothing manufactured from man-made fibers.Boards must only be placed on conductive surfaces.When soldering, the soldering iron tip must be grounded.Boards and components should only be stored and transported in conductive packaging (e.g. metalized plastic boxes, metal containers).If the packing material is not conductive, the boards must be wrapped with a conductive packing material, e.g. conductive foam rubber or household aluminum foil.The necessary ECB protective measures are clearly shown in the following diagram.a = Conductive floor surface d = ECB overallb = ECB table e = ECB chainc = ECB shoes f = Cubicle ground connection14Edition 05.95Siemens AG Dk-Nr. 221441ECB instructionsECB instructions16Edition 05.95Siemens AG Dk-Nr. 221441Drives and Standard Products Motors and Drives Systems GroupPostfach 3269, D-91050 ErlangenSystem-Based Technology。
multiprogramming
Operating SystemConceptWhat is Operating System?multiprogrammingcylinder, track, sectormechanism and policies分離平行系統的好處Hardware protection (dual-mode, …)平行系統之SMP及ASMP時間locality (looping, susroutings, stack)空間locality (matrix operation)special purpose system (real-time, handheld, and embedded system)Virtual machineSystem call 分類control:fork(), execve(), wait(), kill(), …processmemorymanagement:malloc(), free(), mmap(), mlock(), shmat(), …manipulation:create(), open(), close(), read(), lseek(), chmod(), … filemanagement:open(), close(), read(), write(), ioctl(), …devicemaintenance:gettimeofday(), getpid(), setuid(), …informationcommunication:open(), close(), read(), write(), …interprocesslayered approach電腦系統四個組成要素作業系統之user View作業系統之System View作業系統之System GoalsMainframe system (batch system, multiprogramming system, time-sharing system) multiporocessor之check points的目的Von Neumann Machine(CU, ALU, memory, input, output)作業系統服務(程式的執行,I/O操作,檔案管理,通訊,錯誤偵測)mechanism:指做一件事的目標或方向ploicies:指做這件事的具體方法Process ManagementSchedulingSynchronizationDeadlockPCBProcess stateScheduling EvaluationScheduling Criteria使用Thread好處user-level and kernel-level threadContext-switchDispatchCooperating Process的好處Thread的三種modelCritical Section問題Turn, Flag, combination, bakery, semaphore, critical region, monitor 同步的三個典型問題:the bounded buffer problemthe reader and writer problemthe dining philosopher problemDeadlock成立之四個條件Deadlock preventionDeadlock avoidanceDeadlock detectionDeadlock recoverylong-term and mid-term and short-term schedulerIPC(shared-memory and message-passing)scheduling queuesend/receive操作方法Semaphore好處scheduling 時機Process 和program比較PCB的search(hash table)實作傳送與接收direct/indirectsymmetric/asymmetricsend copy/send referenceblock send/receive & nonblock send/receiveI/O bound and CPU boundstarvationaging護航現象行程同步(共享資料,資料不一致性,race condition)Î various solutions通訊機制:pipe, signal, semaphore, message-passing, shared memory, socket, port(mail box)Memory Management記憶體配置(contiguous, non-contiguous)logical address and physical address spaceaddress binding time為何PagingSegmentationsegmentation with pagingVirtual Memory記憶體太小的問題(dynamic loading, overlay, virtual memory, swapping)Virtual Memory設計理念為何Inverted page table (pid, p, d)Dynamic storage allocation(first, worst, best)Replacement Algorithminternal and external fragmentation及其解決方法thrashingworking set model and page fault frequencypage table如果太大 (multilevel paging, inverted page table, shared page)分頁系統的一些考量 (replacement,分配政策, 預先分頁, 分頁大小, inverted page table, 程式結構)LRU approximation algorithm之兩種方法(additional-reference bit, second chance) Frame allocationMMU(base/relocation register)TLB(Translation Look-aside Buffer)page faultpure demand pagingFile SystemFile attributesFile OperationFAT(File Allocation Table)File access method and type目錄結構可用空間管理(linked list, bit vector, counting)檔案空間配置(contiguous, linked list, indexed allocation)Applicationlogical file systemorganizationmodulefilesystemfilebasiccontrolI/Odevice檔案目錄的實作File system evaluation (performance, efficiency, reliability, consistency)Second-Storage Management Disk schedulingRAID(reliability and efficiency)Storage Attachmenthost-attachedstoragenetwork-attached storage (NAS)storage area network (SAN)I/O SystemPoolingInterrupt-drivenDMAI/O mapped I/OMemory-mapped I/OKernel提供的一些和I/O相關的serviceschedulingI/Obufferingcachingspoolingerrorhandlingport(埠)daisy chainCPU和I/O重疊執行interrupt / exception / trap / software interrupt maskable interrupt and nonmaskable interruptDistributed System happened-before and global ordering(time stamp)使用分散式系統的好處分散式系統特性分散式系統缺點Distributed System design issuesTransparency (transition, replication, concurrency, parallelism, migration) Migration (process, computation, data)分散式系統Mutual exclusion分散式系統Concurrency control分散式系統Deadlock detection分散式系統Deadlock handling解決封包碰撞問題 (CSMA/CD, token passing, message slots)Distributed file systemfile service (upload/download, remote access)分散式系統不可分割交易的做法網路作業系統 and 分散式系統process migration理由election algorithmJava RIM CORBA RPCArchitecture (network operating system and distributed system)fixed routing / virtual routing / dynamic routingcircuit switching / package switchingmonolithis kernel and microkerneldistributed file system(naming transparency, cache consistency, file replication, 檔案共享問題)location transparency(檔案的路徑不顯露出檔案伺服器的實際位置)location independence(檔案實際位置搬移時不需要更改檔案的路徑)Important Algorithms行程合作 (Process Cooperation):Producer/Consumer problemCritical Section:1.Turn algorithm2.Flag algorithmbination algorithm4.Bakery algorithm5.Bakery algorithm6.Hardware suppoer(test-and-set, swap) Semaphore:counting and binary同步典型問題:1.the bounded-buffer problem2.the reader and writer problem3.the dining-philosophers problem Sleeping barber problem高階同步工具:Critical region and monitor Banker’s algorithm (Deadlock avoidance)spin lockDistributed system之mutual exclusioncentralizedalgorithmalgorithmdistributedtoken ring algorithmDistributed system之election algorithm the bully algorithmringalgorithmDistributed system之concurrency controllockingoprimistic concurrency controltimestampsDistributed system之deadlock prevention wait-die and wound-waitDistributed system之deadlock detection centralized and distributed wait for graph第一章作業系統簡介何謂作業系統OS保護方式Dual-modeoperationProtectionI/OMemoryProtectionProtectionCPU程式比記憶體大LoadingDynamicOverlaysMemoryVirtualSwapping第二章作業系統結構系統元件系統服務第三章行程行程內容程式碼ProgramCounterRegisterStackSectionData行程狀態Termination,WaitingRunning,New,Ready,PCB內容行程狀態CounterProgramRegisterCPUScheduling相關資訊Management相關資訊MemoryI/O state行程建立原因新的批次工作互動式登入被作業系統建立來提供服務由現有的程序來產生的行程終止正常完成運算錯誤父終止Time OutI/O失敗父要求( abort() )記憶體不足不合法指令OS介入保護錯誤特權指令邊界衝突行程決策時機中斷(preemptive)I/O結束 (preemptive)轉成等等狀態 (non-preemptive)行程終止 (non-preemptive)Long-Term Scheduling, Middle-Term Scheduling, Short-Term Scheduling DispatcherSwitchContextJump into User ModeJump into the location of new execution第四章執行緒User-Level Thread and Kernel-Level Thread執行緒的好處資源共享容易節省記憶體快速的Context Switch平行處理ModelsMulti-ThreadMany-to-OneOne-to-OneMany-to-Many第五章CPU之排程排程演算法FCFSSJFPriorityRound-RobinQueueMultilevelFeedbackQueueMultilevelSchedulingMultiple-ProcessorSchedulingReal-TimeEvaluation(評估)SchedulingDeterministicModelingModelsQueuingSimulationsImplementationCriteriaSchedulingUtilizationCPUThroughputTimeTurnaroundResponseTimeTimeWaiting第六章行程同步問題Section之特性CriticalExclusionMutualProgressMaitingBounded解決Critical Section問題AlgorithmTurnAlgorithmFlagAlgorithmCombinationAlgorithmBakerySemaphoreCounting and Binary SemaphoreRegionCriticalMonitor同步經典問題ProblemTheBounded-BufferWriterProblemandReaderTheDining-PhilosophersProblemThe第七章死結問題特性Mutual Exclusion, Hold and Wait, No-Preemption, and Circular Wait 偵測資源配置圖解除(Discovery)如何解除 ?預防(Deadlock Prevention)破除四個特性其一之一即可(代價大)避免(Deadlock Avoidance)StateSafeAlgorihmResource-AllocationGraphAlgorithmBanker’s第八章記憶體管理Address-Binding時機Compile time, Load Time, and Execution TimeDynamic Loading and Dynamic Linking and OverlayFragmentationandInternalExternal記憶體配置方式連續AllocationPartitionSingleandMultiple非連續SegmentationandPaging第九章虛擬記憶體ReplacementAlgorithmFIFOOptimalLRUApproximationLRULFUMFU第十章檔案系統檔案屬性Type, Location, Size, Protection, Owner, Date, and TimeFileAccessIndexedandAccessRandom,Sequential,AllocationFileContigous, linked list, and indexed allocationFile System EvaluationReliability, and ConsistencyPerformance,Efficient,OperationFileCreate File, Write File, Read File, Search, Delete, Rename, and Append 目錄邏輯結構Tree-structured, Acyclic-graph, and General graph Single-level,Two-level,ofAccessTypeRead, Write, Execute, Append, Delete, and List第十一章 I/O系統CPU和Device溝通方式MappedI/OMemory-MappedI/O(Programmed I/O)PIO and Interrupt-Driven I/O and DMA中斷InterruptExceptionTrapsInterruptSoftware第十二章大量儲存系統SchedulingDiskFCFSShortest-Seek-Time-FirstC-SCANSCAN,C-LOOKLOOK,第十三章分散式檔案系統第十四章分散式系統分散式系統好處資源共享加速計算可信度通訊分散式系統具備的特性提供方便的使用者介面,隱藏分散事實溝通網路有效地分配工作與系統資源提供保護機制分散式系統的設計考量透通性TransparencyFlexibility 彈性Reliability 可靠性效能PerformanceScalability 擴充性Transparency 透通性transparencyTransitiontransparencyMigrationReplicationtransparencytransparencyConcurrencytransparencyParallelism網路作業系統LoginRemote遠端檔案移轉分散式作業系統資料轉移運算轉移行程轉移行程轉移的理由BalancingLoadSpeedupComputationPreferenceHardwarePreferenceSoftwareAccessData分散式系統的Mutual ExclusionCentralizedDistributedFullyToken-Passing分散式系統的並行控制Concurrency ControlLocking Protocol(two phase locking)Optimistic ConcurrencyTimestamping分散式系統的死結處理PreventionDeadlockwait-diewound-waitDetectionDeadlockDetectionDeadlockCentralizedDeadlockDetectionDistributed第十五章主要作業系統概要(Linux, Windows2000, and FreeBSD)第十六章其他IPCIndirectandDirectAsymmetricandSymmetricSend Copy and Send ReferenceIPCMessage-Passing Model and Shared-Memory Model Computing EnvironmentComputingTraditionalComputingWeb-BasedComputingEmbedded行程間的合作資訊共享加速運算模組化方便性RAID【行程同步】生產者/消費者問題(bounded-buffer)生產者產生資訊,而消費者消耗這些資訊in指向buffer下一個空位out指向buffer第一個填滿的位置允許n-1項資料在buffer區生產者item nextProduced; //產生的資料內容while (1) {while (((in + 1) % BUFFER_SIZE) == out) //full; /* do nothing */buffer[in] = nextProduced; //填入空位in = (in + 1) % BUFFER_SIZE; //指向下一個新的空位}消費者item nextConsumed;while (1) {while (in == out) //empty; /* do nothing */nextConsumed = buffer[out]; //消耗掉out = (out + 1) % BUFFER_SIZE; //指向下一個可以消耗的位置}臨界區問題Turn Algorithm說明兩個行程之解決方法滿足mutual exclusionturn = 0 P0進入turn = 1 P1進入Turn AlgorithmShared variables:int turn;turn = 0turn = i⇒Pi can enter its critical section Process Pi{do!=i)//turn!=i不能進入CS ;(turnwhilesectioncriticalj;//讓Pj進入=turnsectionreminder(1);}whileSatisfies mutual exclusion, but not progressFlag Algorithm說明兩個行程之解決方法滿足mutual exclusionP i首先設定flag[i]=true告之已準備要進入CSFlag AlgorithmShared variablesboolean flag[2];initially flag [0] = flag [1] = false.flag [i] = true ⇒Pi ready to enter its critical section Process Pi{do//我想進入true;flag[i]:=while (flag[j]) ; //別人有沒有想要進入critical sectionflag [i] = false; //我不想進入了(我已出來了)sectionremainder(1);while}Satisfies mutual exclusion, but not progress requirement. Combination AlgorithmCombined shared variables of algorithms 1 and 2.Process Pi{dotrue;//我想進入flag[i]:=turn = j;//別人先while (flag [j] and turn = j) ;//別人先及也想進入sectioncriticalfalse;=[i]flagremaindersection(1);}whileMeets all three requirements; solves the critical-section problem for two processes. Bakery Algorithm說明行程的名稱具唯一性及次序性每一個行程選擇一個號碼Bakery Algorihtmdo {choosing[i] = true; //P i正在選號碼number[i] = max(number[0], number[1], …, number [n – 1]) + 1;choosing[i] = false;//P i選完了for (j = 0; j < n; j++) {//對每一個行程(共有n個行程)做比較,若比較完自己是最小的就住入CS;//若行程j正在選號碼,就等它一下再比大小(choosing[j])whilewhile ((number[j] != 0) && (number[j,j] < number[i,i])) ;}sectioncriticalnumber[i] = 0;sectionremainder} while (1);Test-and-Set說明lock若為false則可以進入CS,在進作之後便把lock設為true以讓別人不能進入要出來了才把lock設為false好讓別人可以進入CSTest-and-SetTest-and-Set定義:傳回目前target,並把target設為trueFunction Test-and-Set(var target : Boolean) : BooleanBeginTest-and-Set := target; // return Test-and-SetTarget := true;End;使用test-and-set製作互斥性repeatwhile Test-and-Set(lock) do no-op;critical sectionlock=false;remainder sectionuntil false;Swap說明key為true表示想進入CS先和lock交換一下以知道是否有lcok住若無(交換到的值為false)則可以進入SwapSwap指令定義Procedure swap(var a, b : Boolean);Var temp:Boolean;Begintemp=a;a=b;b=temp;End;使用swap製作互斥性repeatkey = true;repeatswap(lock, key);until key = false;critical sectionlock = false;remainder sectionuntil false;另外一個寫法do {=TRUE;keywhile( key = = TRUE )key);swap(lock,sectioncriticallock = FALSE:remaindersection} while(1)使用Test-and-Set製作限制性等待之互斥(多個行程)var j : 0 ..n-1;key : boolean;repeatwaiting[i] = true;key = true;while (waiting[i] and key) do key = Test-and-Set(lock);waiting[i] = false;critical sectionj = i + 1 mod n; //往後一個一個找是否有想進入CS的,直到找到自己iwhile (j != i) and (not waiting[j]) do j = j + 1 mod nif j = I then lock = false; //因為無想進入的行程,故解開lockelse waiting[j] = false; //直接讓Pj進作CS,但lock還是trueremainder sectionuntil false;另外一個寫法do {//想進入TRUE;=waiting[i]TRUE;=keywhile(waiting[i] = = TRUE && key)Test-and-Set(lock); //看看有沒有lock住(傳回lock目前的值,並把lock設為true) key=FALSE;=waiting[i]critical sectionj = (i + 1) % n;while( (j!= i) && !waiting[j])j = (j + 1) % n;i)if(j==FALSE;lock=elseFALSE; //讓Pj進入waiting[j]=remainder section} while(1);Semaphore號誌之說明新的同步工具號誌S只能由wait和signal兩個標準的不可分割的運算來存取Wait(S) {While(S<=0);//waitS--;}Signal(S) {S++;}使用semaphore來製作的互斥關係repeatwait(mutex);critical sectionsignal(mutex);remainder sectionuntil false;為了不要busy waitingtypedef struct {value;intstruct process *L;} semaphore;void wait(S) {--;S.valueif (S.value < 0) {把行程加入S.L之中block();}}void signal(S) {S.value++;if( S.value <= 0) {由S.L之中移除一個行程P;wakeup(p);}}典型同步問題The Bounded-Buffer Problem 有限緩衝區問題#include "prototypes.h"#define N 100 /* number of slots in the buffer */typedef int semaphore ; /* semaphore are a special kind of int */ semaphore mutex = 1 ; /* controls access to critical region */ semaphore empty = N ; /* counts empty buffer slots */semaphore full = 0 ; /* counts full buffer slots */void producer ( void ){int item ;while (TRUE) { /* TURE is the constant 1 */produce_item(&item) ; /* generate something to put in buffer */ down(&empty) ; /* decrement empy count */down(&mutex); /* enter critical region */enter_item(item); /* put new item in buffer */up(&mutex); /* leave critical region */up(&full); /* increment count of full slots */}}void consumer (void){int item;while (TRUE) { /* infinite loop */down(&full); /* decrement full count */down(&mutex); /* enter critical region */remove_item(&item); /* take item from buffer */up(&mutex); /* leave critical region */up(&empty); /* increment count of empty slots */consume_item(item); /* do something with the item */}}初始值:mutex Î 1empty Î nfull Î 0生產者do {…產生一個新的項目放在 nextp…wait(empty); //看看空的有沒有用完wait(mutex); //看看能不能進入CS…將nextp加入buffer中…//讓別人進入signal(mutex);signal(full); //滿的多1} while(1);消費者do {wait(full);wait(mutex);…將一個項目由buffer中移到nextc…signal(mutex);signal(empty);…消耗放在nextc中的項目…} while(1);The Readers/Writers Problem 讀取者/寫入者問題Writerwait(wrt);…writing is performed…signal(wrt);Readerwait(mutex);readcount = readcount + 1;if readcount == 1 then wait(wrt); signal(mutex);…reading is performed…wait(mutex);readcount = readcount + 1 ;if readcount == 0 then signal(wrt) ; signal(mutex);讀取者wait(mutex);readcount++;if(readcount = = 1)wait(wrt);signal(mutex);…進行讀取…wait(mutex);readcount--;if(readcount ==0)signal(wrt);signal(mutex);寫入者wait(wrt);…進行寫入…signal(wrt);The Dining-Philophers Problem 哲學家吃飯問題這是大型系統並行控制問題的範例五個哲學家,五支筷子用一個號誌表示一支筷子哲學家i的結構repeatwait(chopstick[i]); //等左 wait(chopstick[i+1 mod 5]); //等右 …eat…signal(chopstick[i]);//放左 signal(chopstick[i+1 mod 5]);//放左 …think…until false;do {wait(chopstick[i]);wait(chopstick[(i+1) % 5]);…eating…signal(chopstick[i]);signal(chopstick[(i+1) % 5]);…thinking…} while(1);Critical Regions說明高階的同步結構-Critical Region(條件式臨界區)region v when B do S可使用mutex, first_delay, second_delay號誌及first_count及second_count 兩個數數來實作Critical Regions以下宣告一個具有共享變數v的critical region,在B條件式成立下,如果沒有其行程在此critical region中執行,就會執行S敘述。
网络购物系统简介(英文)
System of Shopping OnlineSummary:Along with Internet and computer’s fast development, in data bank technology network application more and more widespread, moreover more and more good service has been provided for the people by the network. This article has studied one kind of the shopping system on network based on the data association rule, compared with some methods used nowadays network, it has the merits ,such as more simple for user to use, the contact surface are more direct-viewing and so on. On the net the shopping just started in our country, but developed very quickly. Along with the more popularity of our country Internet and the shopping net hastening maturely, it will have more and more big consuming community, the market potential can be put to the full use.Key words: Electronic commerce, system analysis, system designForewordThe electronic commerce source in English ELECTRONIC COMMERCE, the simple form is EC. As the name suggests, its content contains two aspects, the first is the electronic way, and the second is business trade activity. Electronic commerce refers is the use simple, is quick, the low cost electronic communication way, business both sides does not seek a meeting carries on each kind of business trade activity.Designing a electronic commerce website to need to consider to each aspect question, it has needed the information of the client, the information of the merchant, and that needs to deliver the supplier――logistics company aspect the information, and so on. These all designs of the information which a shopping website must understand, only then it had understood this information can have a quite comprehensive understanding to the website design; that can design a quite comprehensive website. Now let’s understand the electronic shopping website the analysis and the design.1. System analysis(1). demands analysesOn the net the shopping, is an electronic commerce concrete manifestation actually, must realize this system, first needs is the commodity information detailed material, thus can realize the commercial activity, next is the user information, only then had the user information commerce activity only then to be able to develop, finally was the order form information, moved after the commerce successfully carries on needs the seller and the buyer achieves the mutual recognition, signed the order form, as well as both sides paid money, commercial activity conclusion. These data items and construction of data as follows:●User information:ID (automatic serial number), user ID, password, name, sex, E-mail address, telephone, address, zip code and registration date and so on.●Commodity information:The commodity number (automatic serial number), commodity ID, business commodity name, respective is big kind, the respective minor sort, the commodity introduced, the commodity price, the member price, stock merchandise the time and the browsing number of times and so on.●Order form information:Order form ID, user ID, name, zip code, telephone, and address and payment method and so on.(2).System overall analysisOn the net the shopping system divides into the front stage management and the backstage management, the front stage management including function and so on browsing commodity, inquiry commodity, fixed purchase commodity, shopping cart, user information maintenance. Backstage management modules include the announcement management, the commodity management, the order form management, the suit management and the user management, and so on.●Website front stage page link structure:After the user enters the system, can carry on a series of operate us to be called on the net the shopping system front stage, it provides the buyer operation a platform. But the backstage buyer is cannot go in, the petroleum manager can carry on the operation to the backstage.RankNew commodity recommendationSale commodityUser managementService center2. System designIn the shopping system analysis, it is not difficult for us to see that each process needs the careful design, but each function module design here seems suitable important.(1) Function module partitionWhen doing function module partition, it can be partitioned into three modules in whole, the distinction:●the front stage module is:●the backend module is:● user administration moduleIn this system, user administration module following chart; When system initialization, some defaults "the system administrator" user Admin, is from our manual increase to the database in. The Admin user may create other administrator information; the average consumer then may modify oneself registers the information and the password.(2) System flow designThis system divides into the front end shopping flow and the backend order form processing flow ● Front stage shopping flow chart:Landing usershopping car Pay moneySubmit the order form● Backstage shopping flow chart:When the user fills in the order form, the manager carries on the order form processing, carries on the final examination to the shopping, in other words must finish in electronic commerce all operations, met down is must carry on the material object the operation. The manager carries on is the background processing work.●Registration function flow chart:When the new user just logged on, by carrying on the user registration, he could enter the shopping activity, how this flow chart carries on the user registration on the extremely explicit introduction user. In the electronic commerce activity, needs the information which the user fills in all is generally the request extremely strict, because once the manager is carrying on the order form to confirm the operation was had discovered the question, could the information paper which filled in through the user come and the user relation, therefore the request user's information was extremely real. But very is all difficult this request to the present to realize, some users can use the vacation the information to cheat the seller.●Commodity search flow chart:The commodity information search is in terms of the database examination, it can reflect the quality of a good electronic commerce website, because the commodity information renewal is this website core, only then promptly deletes the expired commodity information from the database changes into the new commodity the information, can guarantee the electronic commerce website the movement.The user landing chart:The user lands is each website all has, also is necessary, because the present commercial website all is needs the fixed subscriber the support, once lost the user, merchant's commodity very has been difficult to sell. On the other hand, only then registers the user can purchase the thing in this website, mainly is advantageous for the commodity transmission, if the user does not land, 11,000 order forms or the commodity had the problem in the processing process on to be very difficult to inform to buy the buyer.●Order form management flow chart:The order form management is extremely important, we go shopping generally all must first under the order form, produces business only then to be able to deliver goods to us, here also is same, only it also may be advantageous for the product management, at the same time also is the transaction both sides transaction contract, is a certificate.●Commodity control flow chartThe commodity management just like is to the database renewal, must to not have the value the information to carry on the deletion as necessary, the renewal more valuable commodity information, is helpful in the commodity sale and the website operation.●Shopping car flow chart"The shopping car" was in fact we usually when the supermarket shopping uses a shopping car hypothesized realization, it may let the user see has purchased any commodity to oneself, may choose the commodity which oneself wants to purchase whether purchases the commodity which complete or exchanged already chooses.(3). Database structure and designThis system definition database has encompassed 7 tables:Board, Goods Type, Goods, Basket, Complain, Users, and Admin.●Board●Goods Type●Goods●Basket●Complain●Users●AdminUses for to preserve the user the basic information, the structure as follows shows:3. Concluding remarkThrough the analysis design of this system, I realized the basic flows of the electronic commerce system, had the further understanding of the electronic commerce. Along with the electronic commerce development, enterprise's sales ways also change along with the transformation, more and more many enterprises joins to the net on sells, said regarding the small and medium-sized enterprise, for own survival and the development, they always in seeks the opportunity to become on the more transactions chain the link, can have the connection with the different chain host between. Along with the net on the transaction development and the popularization, the small and medium-sized enterprise in under the market competition pressure, could urgently need the electronic commerce platform which set up by the third party, on the net the transaction market has been catering to this kind of demand. It may change in the traditional trade a pair or pair of many patterns, turned has been many to the multi- patterns, and the creation multitudinously bought and sold the on-line transaction space which the merchant gathered. Business both sides not only may seek to the more trades partner, increases the more commercial opportunity, but also can enjoy more conveniences and the standardized commercial service, obtains a good commercial environment.On the net the shopping system has provided a fast development opportunity for all enterprises, moreover also promoted the thing flowing industry development, because regardless of when in the electronic commerce only ison one kind of hypothesized net the transaction activity, must face the customer truly between the actual commodity and the customer relations, therefore electronic commerce not only may impel the modern expense pattern the development, moreover also impelled the new industrial appearance, therefore said electronic commerce is the present society development inevitable product.Reference material:●Sa Shixuan, Wang Shan, "Database System Introduction" (third edition), Beijing: Higher education publishinghouse, 2000.2●Zhang Haifan, "Software engineering Introductory remarks", Beijing: Qing Hua University publishinghouse,2002.7。
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Module partition process model and method of integrated service productHao Li a ,b ,Yangjian Ji a ,*,Xinjian Gu a ,Guoning Qi a ,Renzhong Tang aa Department of Mechanical Engineering,Zhejiang University,Hangzhou,310027,PR ChinabSchool of Mechanical and Electric Engineering,Zhengzhou University of Light Industry,Zhengzhou 450002,PR China1.IntroductionAs environmental pollution and unsustainable development intensify,so do people’s needs for environmental protection and sustainable products.From this demand comes the emergence of a new strategy:product-service system (PSS),which changes tradi-tional product and consumer offering patterns.This strategy aims to integrate tangible physical products and intangible services to achieve a minimum environmental load and sustainability [1,2].At the same time,the enterprise provides the user with value-added services,achieves more sustainable profit,and enhances the competitiveness of the enterprise [3].With the development of research on PSS,the popular understandings for PSS are:satisfy customers’needs,create more value and make low environmental impact.Various phrases in the literature:‘‘functional sales/economy’’,‘‘integrated product-service offerings’’,‘‘product-to-service’’and ‘‘product-service systems’’all refer to this concept [4].Goedkoop et al.[1],Mont [2],Manzini and Vezzoli [5],Brandstotter et al.[6]and Wong [7]analyzed the concept of PSS,Baines et al.put forward three types of PSS systems:product-oriented PSS,use-oriented PSS and result-oriented PSS,which has become the popular classification of PSS [8].In recent years,the users show more and more requirements for the personalized product and service [9,10].Individualized and changeable products and services inevitably cause cost increases in enterprise management,design and manufacture and the supply chain [11].The modularization of physical products and services can solve the conflicts between personalization and low cost.By establishing a series of standard physical modules and service modules,it can simplify product internal structure and reduce production cost and environmental impact;through the combinations of modulars,it can achieve a variety of physical products and services,and satisfy the customers’personalized needs [12].However,the modularization offering of physical product and service needs to be realized through the modular design platform [9],and the Baines classification of PSS cannot meet the needs of establishing the modular design platform [8].For example,product-oriented PSS may have pure physical products or ‘‘physical product plus service’’,but due to complex relationships between physical products and services,larger differences may exist between pure physical product modular-ization principle and ‘‘physical product plus service’’modulariza-tion principle,which makes it impossible to establish a uniform product-oriented PSS modular design platform.Therefore,the reclassification of the PSS is needed to establish an adaptable modular product platform.Computers in Industry 63(2012)298–308A R T I C L E I N F OArticle history:Received 20July 2011Received in revised form 15February 2012Accepted 16February 2012Available online 6April 2012Keywords:Integrated service product Physical product Product serviceProduct-service system Module partitionQuality function deploymentA B S T R A C TDue to customers’constantly increasing demand for personalized products and services,manufacturing enterprises must provide more diverse physical products and services in the product sale stage.However,the massive diversity of personalized products and services offered leads to the internal diversification of products and services,which greatly increases production costs.The application of the modular method can effectively improve the reusability of a product or service,and reduce internal diversification of the product and service.In this paper,the interactive modular design process is established by the analysis of the relationship between a product or service of integrated service product (ISP)and the analysis of the physical module and service module.This paper deals with the module partition principle of ISP,puts forward the three-stages module partition processes and methods,mainly including service module partition processes based on the ‘‘Top-Down’’and ‘‘Bottom-Up’’methods,the physical module partition process based on the ‘‘Top-Down’’,and the module partition methods based on Quality Function Deployment and mapping matrix.Finally,a case study is done on an electric power transformer using proposed principle and methods,and the processes and methods can achieve the interactive module partition of ISP.ß2012Elsevier B.V.All rights reserved.*Corresponding author.Tel.:+86057187953242.E-mail addresses:lh9666@ (H.Li),mejyj@ (Y.Ji),xjgu@ (X.Gu),gnqi@ (G.Qi),tangrz@ (R.Tang).Contents lists available at SciVerse ScienceDirectComputers in Industryj o ur n a l ho m e p a g e :w w w.e l s e vi e r .c om /l o c a t e /c o mp i n d0166-3615/$–see front matter ß2012Elsevier B.V.All rights reserved.doi:10.1016/pind.2012.02.015In order to establish the customer personalized modular product platform,the author puts forward the concept of‘‘integrated service product(ISP)’’in Refs.[3,13],pointing out that:in product sales stage,to meet the clients’multi-level needs,the manufacturer provides customers with‘‘physical product plus service’’service packs;whereas,physical product is the carrier of product service, and product services are function added and the value added for the physical product.However,since the ISP combines characteristics of both physical products and services,it becomes the most complex product type.In module partition process,how to effectively and reasonably divide the modules of ISP has become the most pressing problem to be solved in the product design.This paper deals with a module partition methodology of ISP. The second section briefly reviews the existing design method for ISP.The third section analyzes the product modularization design of ISP,as well as the relations between the product and service,and related concepts.The fourth section analyzes the module dividing principle of ISP.Thefifth section puts forward a three-stage process for module partition,and provides the realization method at each stage.Finally,a transformer case is used to show the feasibility of the related methods.The discussion and summary show the significance of the described process and methods,as well as limitations and future prospects.2.An overview of related research2.1.Research progress of PSS designIn recent years,the environment and sustainable development have become of increasing concern to both producers and consumers. Thus,PSS has attracted great interest from industry and academia as an important means for sustainable product development[1].PSS design is the most important stage in the realization of PSS,and has become a hot research spot in thefield of PSS.Scholars have proposed a set of methods to support PSS System design,such as Kathalys PSS method[14],sustainable product and service development method[15],Methodology for PSS develop-ment[16],and the product-service blueprint method[17].These methods provide specific design frames,PSS development processes,implement tools,and play important roles in service design process and PSS implementation.However,research on product and service integration design theory and on the overall scheme description is still lacking[18].For this issue,Aurich put forward the design methodology for integrated products and services system development,the result reflects the interactive design of product and service[19].Ge et al.put forward product/service integration design methodology based on the axiomatic design theory and the fault tree analysis[18].Zhang et al.put forward the product/service overall design of full product, and proposed variational configuration model of full product based on general bill of material[20].These studies make up for the research deficiency on the design methodology of integrated products and services,and provide PSS design with technical support.2.2.Research progress of PSS modular designFor the research on physical product modulization,many scholars such as Aoki[21],Pahl and Beitz[22],Suh[23],Tong[12], Li[24],Hou et al.[25],Qi et al[9],Erixon et al.[26],Tseng and Jiao [27],Dahmus et al.[28],Gu and Sosale[29],and Fan et al.[30],have already built a mature system of modularization theory and methodology.The main methods used in the physical product modulization are:the design structure matrix,genetic algorithms, the quality house matrix,the functionflow model,simulated annealing algorithms,the axiomatic design theory,clustering algorithms,and complex networks[9,12,21–30].These methods aim at the particular stage of the product life cycle,and make physical product module division more quantitative.For the intangibility and changeability of the service product,Li divided the service modularization into content modularization and process modularization,interfaces between modulars are more loose than interfaces between industry product modules [31].Guan put forward a module partition method based on service blueprints and functionflow[32].Deng put forward the basic characteristics and processes based on the module combina-tion offinancial service innovation[33].The abovefindings refine the service module partition and make it more concrete.With the emergence of PSS strategy,the traditional module partition methodology needs to be expanded[34].With the customer’s increasing personalized needs for products and services, the product offering and system implementation of PSS become more and more complex.Therefore,the modular strategy for products and services has been applied to reduce the complexity of product engineering.In order to improve the product and service potential,Aurich gave a modular principle to realize the technical PSS,and put forward a process library used to design and manufacture module technical PSS[35].Wang deeply investigated PSS parallel modular development and the relationship between the physical products and services,and used QFD method and portfolio technique to complete PSS module development[36].According to the above studies,many scholars have made great advances in physical product modularization,service modulariza-tion,integrated design of ISP,but mainly from the perspective of strategy,management,and process.Up to now,the research on the modular design methodology of ISP is still minimal,and the influence relation analysis between physical product and service has not been revealed.Therefore,the key question remaining in the field is how to solve ISP module partitioning.3.The modular design of ISP3.1.Understanding the relationship between the product and serviceISP includes physical products and services,and the relation-ship between physical products and services can be analyzed from the product structure(Fig.1).According to the correlation degree of physical products and service,service can be divided into functional service and non-functional service.A functional service is a type of service which needs to be completed with specific physical components for support,includ-ing maintenance service,remote monitoring,etc.,and these services will directly affect the function and structure of physical product.Non-functional service is independent of the function physical module,including consulting service,installation service, transportation service,training service and so on.As shown in Fig.1,functional services can be carried out when the special optional physical component assembled in the physical product; but the non-functional service can be carried out without the physical component.Therefore,ISP design not only considers the service-oriented physical product design,but should also take into account service design based on the physical product,so ISP design is the integrated design process of physical product and service.3.2.Physical module V.S.Service module3.2.1.Physical moduleFor the traditional physical product,many scholars have given definitions of the‘‘physical module’’[21–26],but there is still no unified standard definition and the popular view is the definition from Masahiko.He described the module as a kind of semi-self-disciplined subsystem with independent function that couldH.Li et al./Computers in Industry63(2012)298–308299constitute a more complex system through a standard interface and semi-self-disciplined subsystems according to interrelated rules [21].3.2.2.Service moduleDefinition 1:Service module.Service module is the abstraction from tangible service or intangible service with independent function,and it realizes service functions through the interaction of physical modules and services process.Tangible service meets customers’specific needs by providing physical product or parts,for intangible service,the service process or result does not provide physical products or parts.According to the coupling degree between the service module and the physical module,the service module is divided into functional service modules and non-functional service modules,whose differences are shown in Table 1. Definition 2:Functional service module.A functional service module can realize specific functional services with the support of some physical modules.It has a close relationship with particular physical modules,such as remote monitoring service,which can be used by installing the corresponding monitoring parts to the physical product if necessary.Definition 3:Non-functional service module.A non-functional service module has not strict relation to the physical product,and it does not depend on the specific physical module,such as installation service,transportation service.3.3.The modular design of ISPThe modular design of ISP is shown in Fig.2.Before the product’s formation,we must establish a modular platform oriented to service configuration.Through this platform,we can configure out personalized ISP.The basis of the establishment of amodular platform is to finish the modular design of ISP and build a product main structure.In the phases of customer demand,concept design,and detailed design,customers’needs should be collected and converted into technology characteristics and service requirements.Service requirements include functional services and non-functional services,and form the service module structure through the module partition.In the modular design of the physical product,through the analysis of technical features and functional service,the physical module structure is con-structed by using an appropriate module partition method.Finally,through the association rules,the main structure of ISP can be set up,and the modular platform oriented to service configuration can be formed.4.Module partition process and method of ISP4.1.The common form of service moduleThere are three forms of service modules:independent function service modules,‘‘class’’service modules and process service modules [37,38].A function independent service module is an independent function corresponding to a physical module or service module.There is a 1:1relationship between function and module,such as the service module of spare parts.A class service module is a class of service with the same characteristics,and these services are grouped to the same service class.This type of service forms a ‘‘class’’services module,such as the main components maintenance service package in maintenance services.A process service module is a service process in a specific phase,which completes some service tasks in a certain period of time or certain stage,such as the lubricating oil company’s overallTable 1Comparison of physical module and service module.ClassificationSubclassTangible or notStabilityModule compositionPhysical module Physical moduleTangible moduleIt is highly stablePhysical module is composed of general modules and special modulesService moduleFunctional service moduleTangible moduleIt can be added or cancelled dynamically Special modules will be neededNon-functional service module Intangible moduleIt can be added or cancelled dynamicallyService module is composed of general modulesPhysical ProductServiceFig.1.The relationship between the product and service.H.Li et al./Computers in Industry 63(2012)298–308300chemicals management module,full performance service module of ABB.4.2.The module partition process of ISPThe development of ISP is a collaborative development process of products and services,which cannot avoid considering the shortcomings of the mutual influence between products and services[36].Therefore,the module partition process of ISP is an interaction process of service module partition and physical module partition,and physical modules and service modules influence each other.The module partition process can be divided into three steps(Fig.3).4.3.The module partition method of ISP4.3.1.The service module partition method based on the‘‘Top-Down’’methodThe service module partitionfirstly uses‘‘Top-Down’’method. In the‘‘Top-Down’’module partition process,service modules can be divided into function related,class related and process related according to the relationship between services,and then a comprehensive correlation matrix is set up through the calculation of correlation between services,and the divided modules can meet the maximum demand.1)Realize the mapping from customer’s requirement to servicefunctionThe customer’s service needs include functional requirement and non-functional requirement,through the Quality function deployment(QFD)can realize the mapping from customer’s requirement to service function.QFD is a kind of product development method derived by customer requirements,and its core content is requirements conversion.The tool of QFD method is the house of quality, which is an intuitive matrix expression form[39].2)The correlation analysis of the influencing factors:(1)Function correlationThe definition of the function correlation is as following: in the service module partition,the services that achieve the same function will be put together as a module,and keep function independence.Correlations exist between service modules,and the closeness of the relationship can be said to be its correlation degree.According to the function correlation between services,it can be divided into several service modules,Table2shows the function correlation evaluation criteria between services.Fig.2.The modular design of ISP.Table2Correlation degree of function-based service module.Description of relation between modules CorrelationcoefficientThe two service modules exist to achieve thesame function,and are indispensable1.0The implementation of one service modulewill affect another module significantly0.7The implementation of one service modulewill affect another module0.5The implementation of one service modulewill affect another module slightly0.3No relations between the two service modules0Table3Correlation degree of class-based service module.Description of association between modules CorrelationcoefficientThe services belong to the same class and achievethe same function,their specifications and propertiesare also the identical1.0The services belong to the same class,and achieve the samefunction,but their specifications andproperties are different0.8The services belong to the same class,but theirfunctions are different0.4The services does not belong to the same class,their functions and properties are differentH.Li et al./Computers in Industry63(2012)298–308301(2)Class correlationThe definition of the class correlation is that some services have the same characteristics,and these kinds of services can be put into the same service groups and form a module,which will facilitate the service management and provide more similar services.According to the class-oriented service correlation,it can be divided into service modules,Table 3is the class correlation evaluation criteria between services.(3)Process correlationThe service module has the time or process continuity,and it will complete the corresponding service tasks in a continuous time.According to service process correlation degree,theservice module partition can be finished.Table 4is the process correlation evaluation criteria between services.3)Establish correlation integration analysis matrixFor the analysis of the entire service modules division,the influence of three factors should be integrated:function,class and process.Through analyzing the correlation coefficient between the services,we obtain the correlative matrix by the Dot Product method:M ¼f m i j g(1)m i j ¼1i ¼jX n1r i j F f þX n 1r i j F c þX n1r i j Fp i ¼j8><>:(2)where r ij is the correlation between the service modules respectively.The correlation determination method of this paper is based on Tables 2–4.F f ,F c ,F p are the weight coefficients of the three partition method respectively,F f +F c +F p =1.4)According to the correlation integration analysis matrix,we can calculate correlation between services and get the service module partition scheme at different levels.User’s service needs (non-functional service)User’s service needs functional service …………Service modularPhysical modular…User’s basic function needsBottom -UpTop-DownTop-DownThe modular product ofISPThe main structure of physical productRequirements S6S1S2S3S4S5m2m3m4m5m6m1service moduleService functionCorrelative matrixm7S7……Modular partition based on function Modular partition based on class Modular partition based on processP h a s e 1P h a s e 2Phase 3m6m1m2m3m4m5p2p3p4p5p6p1Physical modulep7m7……R1R2R3R4R5S1S3S4S5S6S7FunctionS2R1R2R3R4R5F1F3F4F5F6F7FunctionF2Mapping matrix……F1F2F3F4F5P1P3P4P5P6P7Structure moduleFunctionP2Autocorrelationmatrix…………Mapping matrixMapping matrixCorrelative matrixService function AutocorrelationmatrixThe main structure of service productAutocorrelationmatrixRequirements Fig.3.The module partition process model of ISP.Table 4Correlation degree of process-based service module.Description of association between modulesCorrelation coefficientThe service implementation process is continuous 1.0The service implementation process is discontinuousH.Li et al./Computers in Industry 63(2012)298–3083024.3.2.The physical module partition method based on the‘‘Top-Down’’methodThe relevant literature on physical module partition has been reviewed in the section of‘‘An overview of related research’’,and shows that physical module partition is mainly achieved through a four-step approach[9,12,21–30].The physical module partition of ISP is a service-derived module process.In this paper,a detailed process on physical module partition of ISP is given according to the popular four-step module partition approach.Step1:From the user requirements,the user requirements include product basic function requirements and functional service needs.Through the quality function house,the basic function requirements and functional service requirements are transformed into products of total function and sub function, and complete the product function decomposition.Step2:Establish function and structure mapping matrix to divide the physical module.Analyze the correlation of the product substructure in view of function and structure,and realize the mapping of‘‘function domain-structure module domain’’.The product function and structure of the relationship between the module matrices reflect the mapping relationship and related degree between function and structure.The autocorrelation matrix of product structure module represents the influence degree when the module changes into other product structure modules.Step3:Analyze the correlation degree between function and structure according to the function correlation matrix,which can obtain physical module partition schemes from different levels.Step4:Establish the main structure of the physical module according to the relationship between physical modules.4.3.3.The service module partition method based on the‘‘Bottom-Up’’methodThe service modules,such as maintenance warranty service, and spare parts,have close correlation with specific physical modules,but the service content can’t be accurately determined before the accomplishment of physical product design.When the finished physics module is used to determine the specific service module,this is the process moves from bottom to top in the so-called‘‘Bottom-Up’’method.In the‘‘Bottom-Up’’method,according to the divided physical module,the integrality of basic product services and other special services which provide the customer with physical products are evaluated,if not present,add required service modules by the ‘‘physical module-service module’’mapping method.In Fig.3, physical modules are already divided modules,and the needed service modules can be supplied through the physical modules mapping.If the service module does not exist or the module partition is coarse in granularity according to the‘‘Top-Down’’method,then add the service module.Based on the correlation of physical modules and service modules,the service modules can be divided and mapped by analyzing the informed physical module,as shown in Fig.6.The mapping of physical module to service module and the‘‘Bottom-Up’’service module partition mainly contribute to improve the maintenance service.4.3.4.Establish the modular platform of ISPAccording to the module partition procedures and methods given above,the physical module partition and the service module partition can befinished.According to the relationship between the physical module and the service module,one can set association rules between modules(physical modules,service modules,physical modules and service modules),and establish the modular main structure of ISP.5.Case studyCustomer demands for power transformers change greatly,and there are many product services at the stage of sale,operation and recovery.Accordingly,this paper uses the oil-immersed power transformer as an example to prove the proposed principle and method of ISP modularization.5.1.Mine and analyse the customers’requirements1.Customer’s demand:basic functional requirements(1)The demand for electricity consumption.(2)Environ-mental conditions:altitude.(3)Environmental conditions: environmental temperature and cooling medium temperature.(4)Environmental conditions:the level of pollution.(5)Electricpower loss.(6)Partial discharge.(7)The ability to avoid or prevent short circuits.(8)Operating conditions,such as whether to run in parallel with the existing transformer.(9)Using environment.The transformer hasfire prevention requirements, indoor or outdoor,etc.(10)Color requirements.2.Customer’s service demand:functional service requirementsThe functional service of the transformer mainly includes measurement,control,testing,monitoring,protection service, etc.3.Customer’s service demand:non-functional service require-mentsThe non-functional service of the transformer mainly includes: (1)Consulting service.(2)Transportation service.(3)Installation service.(4)Maintenance service pack.(5)Spare parts service.(6) etc.5.2.Module partition5.2.1.The transformer service module partition based on the‘‘Top-Down’’method1.The mapping of transformer product service requirement toservice function based on the quality function house This case only gives37kinds of service,so the service granularities is rough and big,but it can prove the basic theory and methods proposed in the paper.By using the quality function house,it can realize the conversion from transformer product service needs to function(omission).The service function after the transformation are as follows.The preliminary service classification of transformer based on function has beenfinished.Transformer non-functional service are basic services,including technical advice and guidance m1,transportation service m2,installation services m3,guarantee service m4,spare parts m5,semi-finished products and plug-in boards m6,DC resistance measurements m7,voltage test m8,seal test m9,insulating oil test(before the test)m10,finished product voltage and connecting label measurement than group m11,operation test of on-load tap-changer m12,etc.Functional service module includes:temperature rise test analysis m13,thunder impact test(the full wave,carrier wave) m14,temperature rise and insulation oil chromatographic analysis m15,mechanical strength test of oil tank m16,transition characteristic test of on-load tap-changer switching m17, winding degeneration m18,zero sequence impedance measure-ment experiment of three-phase transformer m19,no-load current harmonic measurement m20,sound level measurementH.Li et al./Computers in Industry63(2012)298–308303。