SMBSAC30中文资料
uscar-30 中文版
4 一般要求概述 ................................................................................................................. 錯誤! 尚未定義書籤。
4.1 持續紀錄................................................................................................................. 錯誤! 尚未定義書籤。 4.2 樣品文件................................................................................................................. 錯誤! 尚未定義書籤。 4.3 樣品尺寸................................................................................................................. 錯誤! 尚未定義書籤。 4.4 默認測試公差......................................................................................................... 錯誤! 尚未定義書籤。 4.5 默認測試條件......................................................................................................... 錯誤! 尚未定義書籤。 4.6 設備......................................................................................................................... 錯誤! 尚未定義書籤。 4.7 測量方法................................................................................................................. 錯誤! 尚未定義書籤。 4.8 測量重復性＆標准性............................................................................................. 錯誤! 尚未定義書籤。 4.9 一致性規定............................................................................................................. 錯誤! 尚未定義書籤。 4.10 樣品處置................................................................................................................. 錯誤! 尚未定義書籤。 4.11 零件耐久性 E.......................................................................................................... 錯誤! 尚未定義書籤。
鼎信通达综合接入网关 用户手册v2.2说明书
修正记录文档名称鼎信通达综合接入网关用户手册手册版本 2.2日期2014/10/18作者Porter修正说明同步支持IMS平台软件版本2.18.02.06或以上版本目录第一章产品介绍 (1)1.1概述 (1)1.2产品外观 (2)1.3接口及指示灯介绍 (2)1.3.1DAG1000-4S接口及指示灯介绍 (2)1.3.2DAG1000-8S接口及指示灯说明 (3)1.3.3DAG2000-16S接口及指示灯介绍 (5)1.3.4DAG2000-24/32S接口及指示灯介绍 (6)1.3.5DAG2500-48/72S接口及指示灯介绍 (9)1.3.6DAG3000-128S接口及指示灯介绍 (12)1.4组网应用 (13)1.5功能和特点 (13)1.5.1支持协议 (13)1.5.2语音传真参数 (14)1.5.3补充业务 (14)第二章基本操作 (15)2.1话机操作 (15)2.1.1拨打电话号码或分机号 (15)2.1.2IP地址呼叫 (15)2.2呼叫保持 (15)2.3呼叫等待 (16)2.4呼叫转移 (16)2.4.1盲转（Blind） (16)2.4.2询问转移（Attend） (16)2.4.3三方通话 (17)2.5操作码列表 (17)2.6发送和接收传真 (19)2.6.1DAG（FXS）支持四种传真模式： (19)2.6.2T.38和Pass-Through (19)第三章设备自助设置 (20)3.1IP地址查询 (20)3.2恢复出厂设置 (20)3.3设置IP地址 (20)第四章WEB配置 (22)4.1WEB登陆 (22)4.1.1登陆准备 (22)4.1.2登陆WEB (24)4.2状态和统计 (24)4.2.1系统信息 (24)4.2.2注册信息 (26)4.2.3TCP/UDP统计 (26)4.2.4RTP会话统计 (27)4.3快速配置向导 (27)4.4网络 (27)4.4.1本地网络 (27)4.4.2VLAN参数 (29)4.4.3Qos (31)4.4.4LAN Qos (31)4.4.4DHCP服务(路由模式下可选配置) (31)4.4.5DMZ主机(路由模式下可选配置) (32)4.4.6转发规则(路由模式下可选配置) (33)4.4.7静态路由(路由模式下可选配置) (33)4.4.8防火墙(路由模式下可选配置) (34)4.4.8地址解析 (35)4.5SIP服务器 (35)4.6端口配置 (37)4.7高级选项配置 (39)4.7.1FXS参数 (39)4.7.2媒体参数 (41)4.7.3SIP参数 (43)4.7.4传真参数 (47)4.7.5拨号规则 (48)4.7.6功能键 (50)4.7.7系统参数 (52)4.7.8Action URL (54)4.8呼叫和路由配置 (55)4.8.1通配组 (55)4.8.2端口组 (55)4.8.3IP中继 (56)4.8.4路由参数 (56)4.8.5IP-Tel路由 (57)4.8.6Tel-IP/Tel路由 (58)4.8.7IP->IP路由 (58)4.9号码变换 (59)4.9.1IP-Tel被叫号码 (59)4.9.2Tel-IP改变主叫号码 (60)4.9.3Tel-IP改变被叫号码 (62)4.10管理 (63)4.10.1TR069参数 (63)4.10.2SNMP参数 (63)4.10.3Syslog参数 (64)4.10.4云服务器 (66)4.11安全设置 (66)4.11.1WEB访问控制列表 (66)4.11.2Telnet访问控制列表 (67)4.11.3密码修改 (67)4.11.4加密配置 (68)4.12工具 (69)4.12.1固件升级 (69)4.12.2数据备份 (69)4.12.3数据恢复 (70)4.12.4Ping测试 (70)4.12.5Tracert测试 (71)4.12.6Outward测试 (72)4.12.7网络抓包 (73)4.12.8恢复出厂设置 (73)4.12.9设备重启 (74)第五章术语 (75)关于本文档本文档主要描述综合接入网关（IAD）设备的外观、功能特性、配置及维护操作方法。
电话交换机说明书
1．2 特点....................................................................................................................................5
2．1 基本结构.............................................................................................................................6
3．2．8 设置分机免拨“0”直通外线.............................................................................18
3．2．9 取消内外热线服务功能 ..............................................................................18 3．2．10 清除分机自行设置的外线呼出密码 .....................................................18 3．2．11 外线呼叫等待功能 .....................................................................................18 3．3 外线编程 ........................................................................................................................18 3．3．1 设置外线出局字头（如拨 0 出局）........................................................18 3．3．2 设置外线出局方式（直局／间局）........................................................19 3．3．3 设置外线呼入为听电脑话务员引导或是经总机转接........................20 3．3．4 设置打开或关闭某条外线..........................................................................21 3．3．5 设置外线呼出用双音频或脉冲.................................................................21 3．3．6 设置某条外线开始计费起始时间（延时／反极） ............................21 3．3．7 设置将外线分组 ............................................................................................22 3．4 计费编程 ........................................................................................................................23 3．4．1 选择集团电话以半价或全价方式计费 ...................................................23 3．4．2 设置市话需要计费或不计费 .....................................................................24
SMB5.0A中文资料
BI
5V0C
5V0C 6VA0C
6V0C 6VA5C
6V6C 7VA0C
7V0C 7VA5C
7V5C 8VA0C
8V0C 8VA5C
8V5C 9VA0C
9V0C 10AVC
10VC 11AVC
11VC 12AVC
12VC 13AVC
13VC 14AVC
14VC 15AVC
15VC 16AVC
16VC 17AVC
Stand-off Voltage Peak Pulse Power
5.0 to 170 Volts 600 Watts
Device Type
SMB5.0 SMB5.0A SMB6.0 SMB6.0A SMB6.5 SMB6.5A SMB7.0 SMB7.0A SMB7.5 SMB7.5A SMB8.0 SMB8.0A SMB8.5 SMB8.5A SMB9.0 SMB9.0A SMB10 SMB10A SMB11 SMB11A SMB12 SMB 12A SMB13 SMB13A SMB14 SMB14A SMB15 SMB15A SMB16 SMB16A SMB17 SMB17A SMB18 SMB18A SMB20 SMB20A SMB22 SMB22A SMB24 SMB24A SMB26 SMB26A SMB28 SMB28A SMB30 SMB30A SMB33 SMB33A
• Plastic package has Underwriters Laboratory Flammability Classification 94V-O
• For surface mounted applications in order to optimize board space
SA版全套社会责任文件管理手册程序文件作业指导书和记录
SA8000-2014社会责任管理手册版本号：A/0文件编号: SAM 1.0生效日期：2017年08 月18 日受控状态：编写审核适用于SA8000-2014BSCI2.0-2014 SEDEX 2P/4P WALMAR社T会责任验厂TARGET社会责任验厂KMART社会责任验厂利丰社会责任验厂家乐福社会责任验厂COC社会责任验厂WCA社会责任验厂目录序号内容页码0.0 发布令??????????????????? 31.0 前言????????????????????? 42.0 企业简介??????????????????? 43.0 公司组织架构????????????????? 54.0 社会责任政策????????????????? 55.0 社会责任管理手册??????????????? 76.0 名词定义??????????????????? 87.0 管理职责??????????????????? 108.0 法律法规收集?????????????????? 139.0 目标及相关管理方案?????????????? 1410.0 童工与未成年工???????????????? 1411.0 强迫和强制劳动??????????????? 1512.0 健康与安全?????????????????? 1613.0 自由结社与集体谈判权????????????? 1714.0 禁止歧视??????????????????? 1815.0 惩戒性措施?????????????????? 1916.0 工作时间??????????????????? 1917.0 工资报酬??????????????????? 2018.0 政策、程序和记录??????????????? 2119.0 社会绩效委员会（SPT）设立??????????? 2320.0 风险识别与评估???????????????? 2421.0 监督????????????????????? 2422.0 内部参与和沟通??????????????? 2523.0 投诉管理与解决???????????????? 2624.0 外部验证和利益相关方参与??????????? 2625.0 纠正和预防行动???????????????? 2726.0 培训和能力培养????????????????? 2727.0 供应商与分包商管理??????????????? 2828.0 内部审核??????????????????? 3029.0 管理评审??????????????????? 3030.0 手册修订记录????????????????? 3231.0 附件1 ：社会责任目标指标??????????? 3332.0 附件2 ：健康安全委员会???????????? 3433.0 附件3 ：社会责任绩效委员会??????????? 3534.0 附件4 ：组织架构图??????????????? 360.0 发布令发布令为贯彻本公司的社会责任方针，完善社会责任管理体系，本公司根据SA8000:2014 要求，并结合公司实际情况制定《社会责任管理手册》，《社会责任管理手册》是本公司一切社会责任管理活动必须遵循的纲领性文件，现批准发布，于发布之日起实施。
Bitsoft-IAMS-V30
系统背景为了提高各机关企事业单位的档案管理工作效率、提高档案查找的准确率，加快检索速度，促进档案管理的规范化和正规化，上海必特软件有限公司在原有Bitsoft_DOC V2.0的基础上开发一套“Bitsoft综合档案管理系统”，版本定为Bitsoft_IAMS V3.0。
该系统为基于Internet/Intrant和大型网络数据库集（文书、科技、照片、声像、财会、实物等）档案管理、人员组织管理、系统权限管理和档案分类管理为一体遵循国家档案标准和档案行业标准多名科技精英与档案专家的密切合作和精心开发系统功能结构图如下：主要功能- 1 -1操作管理注册：指用户登录本系统后，可以用其他身份重新登录进入本系统。
连续三次登录失败（用户名或口令不对）后无权登录。
修改口令：指用户登录本系统后，可更改自己的口令（密码）。
（必须重复两次输入新口令后，才能更改完成！）任务清单：指该系统有任务需要用户执行时，系统会不断提示用户去执行，例如文件要办理、催还等。
通信信息：可以设定一周（或一月）的会议安排。
例如会议召集人、地点、出：指的是用户退出本系统。
流程管理- 2 - 2收发文归档把一些已送到档案室的收发文进行归档。
指纸质或电子文档的收发文。
归档完以后档案文件库中会自动保存文件。
收发文编号维护在收发文的维护中，只要输入编号维护、年代号、下编号即可。
档案管理- 3 - 3文书档案管理案卷级登录：采用卡片式录入案卷方式。
案卷级登录是将案卷的有关属性登录到系统中，包括案卷号、案卷标题、责任者、保管期限、密级、编制日期、归档日期、页数等。
其中编制日期、归档日期、页数根据案卷中的文件的属性自动生成。
具有增加、删除、修改、保存、案卷定位、文件级属性输入等功能。
文件级登录：采用卡片式录入案卷方式。
文件级登录是将文件的有关属性登录到系统中，包括案卷号、文件材料题名、文件编号、责任者、图幅、保管期限、密级、编制日期、归档日期、收图日期、起始页数、页数、版本号、备品标志、项目名称、项目编号、修改单编号、设计修改单编号根据图纸和文件修改的情况自动生成。
smb
在Windows Vista中微软又推出了Server Message Block 2.0。
从 Windows 95开始，Microsoft Windows操作系统（operating system）都包括了客户机和服务器 SMB 协议支持。Microsoft为 Internet提供了 SMB的开源版本，即通用 Internet文件系统 （CIFS）。与现有 Internet应用程序如文件传输协议（FTP）相比， CIFS灵活性更大。对于 UNIX系统，可使用一种称为 Samba的 共享软件。
SMB也是由软件定义数据中心 (SDDC)解决方案（如存储空间直通、存储副本和其他）使用的结构协议。 SMB 版本 3.0已引入到 Windows Server 2012中，并在后续版本中不断得到改进，包括：Windows Server 2022、 Windows Server 2019、Windows Server 2016、Windows Server 2012 R2。
SMB3.1.1被引入到Windows Server 2016和Windows 10，。
IBMSMB
（IBM S protocol）
服务器信息块（SMB）协议是一种IBM协议，用于在计算机间共享文件、打印机、串口等。SMB协议可以用在 因特的TCP/IP协议之上，也可以用在其它络协议如IPX和NetBEUI之上。
SMB 3.0极大的提升了性能、可靠性和安全性。具体来说，当它与Windows Storage Spaces（Windows Server 2012的一个功能，将普通的硬盘虚拟化为高性能、高可用性的存储）结合时，SMB 3.0可以使用廉价的 直连存储（DAS）、JBOD或RBOD，创建一个特定的NAS设备（或SAN存储阵列）。IT组织可以因此在不购买昂贵的 SAN存储的情况下得到企业级存储的特性，而且管理也变得更加简单。此外，SMB 3.0支持一些以前只在块存储环 境下才可以使用的应用程序，如SQL Server。
SMBJ30CA-TR中文资料
SMBJ5.0A-TR,CA-TR SMBJ188A-TR,CA-TRTRANSIL TM®PEAK PULSE POWER :600W (10/1000µs)STAND OFF VOLTAGE RANGE :From 5V to 188V.UNI AND BIDIRECTIONAL TYPES LOW CLAMPING FACTOR FAST RESPONSE TIMEJEDEC REGISTERED PACKAGE OUTLINE FEATURESSMB(JEDEC DO-214AA)Symbol ParameterValue Unit P PP Peak pulse power dissipation (see note 1)Tj initial =T amb 600W P Power dissipation on infinite heatsink T amb =50°C 5W I FSM Non repetitive surge peak forward current for unidirectional types tp =10msTj initial =T amb100A T stg T j Storage temperature range Maximum junction temperature-65to +175150°C °C T LMaximum lead temperature for soldering during 10s.260°CNote 1:For a surge greater than the maximum values,the diode will fail in short-circuit.ABSOLUTE MAXIMUM RATINGS (T amb =25°C)DESCRIPTIONThe SMBJ series are TRANSIL TM diodesdesigned specifically for protecting sensitive equipment against transient overvoltages.Transil diodes provide high overvoltage protection by clamping action.Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC’s.January 1998Ed:3Symbol ParameterValue Unit R th (j-l)Junction to leads20°C/W R th (j-a)Junction to ambient on printedcircuit on recommendedpad layout100°C/WTHERMAL RESISTANCES 1/6II F V F V CLV BRV RMI PPI RMVSymbol ParameterV RM Stand-off voltage V BR Breakdown voltage V CL Clamping voltage I RM Leakage current @V RM I PPPeak pulse currentαTVoltage temperature coefficient V FForward voltage dropELECTRICAL CHARACTERISTICS (T amb =25°C)TypesI RM @V RM V BR @I RV CL @I PPV CL @I PP αT C max.min.max.max.max.typ.note210/1000µs 8/20µs note3note4Unidirectional Mark.Bidirectional Mark.µA V V mA V A V A 10-4/°C pF SMBJ5.0A-TR BUZ SMBJ5.0CA-TR BBZ 800 5.0 6.4109.26813.4298 5.74000SMBJ6.0A-TR BUA SMBJ6.0CA-TR BBA 800 6.0 6.71010.36113.7290 5.93850SMBJ6.5A-TR BUB SMBJ6.5CA-TR BBB 500 6.57.21011.25614.5276 6.13700SMBJ8.5A-TR BUC SMBJ8.5CA-TR BBC 58.59.4114.441.719.52057.32800SMBJ10A-TR BUD SMBJ10CA-TR BBD 51011.11173721.71847.82300SMBJ12A-TR BUE SMBJ12CA-TR BBE 51213.3119.93125.31578.32025SMBJ13A-TR BUF SMBJ13AC-TR BBF 11314.4121.52927.21478.41900SMBJ15A-TR BUG SMBJ15CA-TR BBG 11516.7124.425.132.51238.81600SMBJ18A-TR BUH SMBJ18CA-TR BBH 11820129.221.539.31029.21350SMBJ20A-TR BUI SMBJ20CA-TR BBI 12022.2132.419.442.8939.41250SMBJ22A-TR BVA SMBJ22CA-TR CBH 12224.4135.517.748.3839.61150SMBJ24A-TR BUJ SMBJ24CA-TR BBJ 12426.7138.91650809.61112SMBJ26A-TR BUK SMBJ26CA-TR BBK 12628.9142.114.953.5759.71075SMBJ28A-TR BUL SMBJ28CA-TR BBL 12831.1145.413.859689.81000SMBJ30A-TR BUM SMBJ30CA-TR BBM 13033.3148.41364.3629.9950SMBJ33A-TR BUN SMBJ33CA-TR BBN 13336.7153.311.869.75710.0900SMBJ40A-TR CUJ SMBJ40CA-TR CBJ 14044.4164.59.7844810.1800SMBJ48A-TR BUW SMBJ48CA-TR BBW 14853.3177.48.11004010.3700SMBJ58A-TR BUO SMBJ58CA-TR BBO 15864.4193.6 6.71213310.4625SMBJ70A-TR CUM SMBJ70CA-TR CBM 17077.81113 5.51462710.5550SMBJ85A-TR BUQ SMBJ85CA-TR BBQ 18594.41137 4.617822.510.6500SMBJ100A-TR CUQ SMBJ100CA-TR CBQ 11001111162 3.82121910.7450SMBJ130A-TR BUS SMBJ130CA-TR BBS 1130144120932651510.8400SMBJ154A-TR BUT SMBJ154CA-TR BBT 11541711246 2.431712.610.8360SMBJ170A-TR BUU SMBJ170CA-TR BBU 11701891275 2.235311.310.8350SMBJ188A-TRBUV SMBJ188CA-TR BBV 11882091328238810.310.8330Note 2:Pulse test :t p <50ms.Note 3:∆V BR =αT *(T amb -25)*V BR (25°C).Note 4:V R =0V,F =1MHz.For bidirectional types,capacitance value is divided by 2.10s1000s%I PP 50tPULSE WAVEFORM 10/1000s100SMBJxxxA-TR,CA-TR2/6SMBJxxxA-TR,CA-TR Fig.1:Peak pulse power dissipation versus initialjunction temperature(printed circuit board).Fig.2:Peak pulse power versus exponentialpulse duration.3/6SMBJ188A SMBJ130A SMBJ58A SMBJ33A SMBJ18ASMBJ8.5A SMBJ5.0AFig.3:Clamping voltage versus peak pulse current.Exponentialwaveform t p =20µs ________t p =1ms -------------t p =10ms ...............Note :The curves of the figure 3are specified for a junction temperature of 25°C before surge.The given results may be extrapolated for other junction temperaturesby using the following formula :∆V BR = αT *[T amb -25]*V BR (25°C)For intermediate voltages,extrapolate the given results.C (pF)11010010100100010000S M B J 5.0A13A58A 188A V (V)R F=1MHz500S M B J S M B J S M B J S M B J 26A Tj =25°C Fig.4b :Capacitance versus reverse applied voltage for bidirectional types (typical values).C (pF)110100101001000100005.0A13A26A58A188AV (V)R Tj =25°C F=1MHz500S M B J S M B J S M B J S M B J S M B J Fig.4a :Capacitance versus reverse applied voltage for unidirectional types (typical values).SMBJxxxA-TR,CA-TR4/6Fig.6:Transient thermal impedance junction-ambient versus pulse duration.Mounting on FR4PC Board with Recommended pad layout.Fig.5:Peak forward voltage drop versus peak forward current (typical values for unidirectional types).Fig.7:Relative variation of leakage current versus junction temperature.ORDER CODEBIDIRECTIONALNo suffix :UnidirectionalSURFACE MOUNTSTAND OFF VOLTAGE600WATTSSM BJ 85C A -TRTAPE &REEL SMBJxxxA-TR,CA-TR5/6REF.DIMENSIONSMillimeters Inches Min.Typ.Max.Min.Typ.Max.A1 1.90 2.15 2.450.0750.0850.096A20.050.150.200.0020.0060.008b 1.95 2.200.0770.087c 0.150.410.0060.016E 5.10 5.40 5.600.2010.2130.220E1 4.05 4.30 4.600.1590.1690.181D 3.30 3.60 3.950.1300.1420.156L0.751.151.600.0300.0450.063Information furnished is believed to be accurate and reliable.However,SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specifications mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorized for use as critical components in lifesupport devices or systems withoutexpress written approval of SGS-THOMSON Microelectronics.©1998SGS-THOMSON Microelectronics -Printed in Italy -All rights reserved.SGS-THOMSON Microelectronics GROUP OF COMPANIESAustralia -Brazil -Canada -China -France -Germany -Italy -Japan -Korea -Malaysia -Malta -Morocco The Netherlands -Singapore -Spain -Sweden -Switzerland -Taiwan -Thailand -United Kingdom -U.S.A.Packaging :standard packaging is in tape and reel.PACKAGE MECHANICAL DATA SMB (Plastic)DEE1cA1A2bLMARKING :Logo,Date Code,Type Code,Cathode Band (for unidirectional types only).FOOTPRINT DIMENSIONS (Millimeter)SMD Plastic.1.522.75 2.31.52Weight :0.12gSMBJxxxA-TR,CA-TR6/6。
企业信息门户用户使用手册
企业信息门户用户使用手册(wss3.0）北京明峻达科技有限公司微软（中国)有限公司2007年5月目录第1章简介 (4)1.1 简介 (4)1.2 门户内容完善过程 (4)第2章网站登录 (4)2.1 打开IE浏览器 (4)2.2 输入用户名、密码 (4)第3章企业内部门户使用手册 (5)3.1 企业简介 (6)3.1.1 创建页面 (6)3.1.2 编辑页面内容 (7)3.1.3 发布页面内容 (8)3.1.4 修改页面 (9)3.2 主要业绩 (10)3.3 咨询院导航 (10)3.4 工程集团部门导航 (11)3.5 图片新闻 (11)3.5.1 增加图片新闻 (11)3.5.2 审批图片新闻 (14)3.6 相关专题 (15)3.7 Mis系统登录、质量体系、数字档案、客户服务中心、企业通讯录、车辆调度 153.8 论坛中心 (15)3.8.1 创建一个讨论板 (16)3.8.2 新建项目 (18)3.9 院长信箱 (18)3.10 常用表单 (19)3.10.1 创建InfoPath表单 (19)3.10.2 SharePoint中设置Web部件页 (25)第4章部门门户使用手册 (32)4.1 部门门户登录 (32)4.2 部门简介 (33)4.3 部门工作 (33)4.3.1 技术质量 (33)4.3.2 科技进步、安全生产、规程规范、信息网络、管理体系、质量体系 (51)4.4 综合管理 (51)4.4.1 部门资产 (51)4.4.2 部门预算 (52)4.4.3 考核指标 (52)4.5 部门动态 (52)4.6 个人工作助理 (52)4.6.1 个人信息 (52)4.6.2 个人邮件 (53)4.6.3 个人订阅 (53)4.6.4 日程安排 (53)4.6.5 网络传真 (53)4.6.6 待办审批 (53)4.7 部门专题 (53)4.8 信息共享 (53)4.9 交流协作 (53)第1章简介1.1简介本手册详细说明了企业信息门户的具体使用过程。
samba howto 中文版
Samba HOWTO中文版Samba计划文档(初稿)Samba小组编译：meaculpa (mailto:meaculpa@)中文译稿声明：该文档是Samba软件的一部分，受GNU GPL保护，使用时请注意版权问题；由于译者水平有限，错误之处在所难免，希望各位读者来信指正，由此产生的一切后果，本人概不负责。
----------------------------------------------------------------------------------------------------------------------------------------------------------------概要本文档汇集了Samba文档历年来的HOWTOs。
我试图确保所有内容都是最新的，但有时一个人维护不了这么大的项目。
你可以在http:///的“Documentation”找到这份文档的最新版本，有更新的话寄给jerry@。
干杯，jerry目录表1. 如何安装并测试Samba1.1. Step 0: 阅读手册页1.2. Step 1: 编译二进制1.3. Step 2: 所有关键步骤1.4. Step 3: 建立配置文件1.5. Step 4: 用testparm测试你的配置文件1.6. Step 5: 启动smbd和nmbd进程1.6.1. Step 5a: 从inetd.conf启动1.6.2. Step 5b. 可选法：以后台进程启动1.7. Step 6: 尝试列出服务器可获得之共享项1.8. Step 7: 尝试从UNIX客户端建立连接1.9. Step 8: 尝试从DOS、WfWg、Win9x、WinNT、Win2k、OS/2及其它客户端建立连接1.10. 如不工作咋办？1.10.1. 诊断问题1.10.2. 范围ID1.10.3. 选择协议级别1.10.4. 从UNIX向PC客户端进行打印1.10.5. 锁定1.10.6. 映射用户名1.10.7. 其它字符集2. Samba 2.x中的LanMan和NT口令加密2.1. 介绍2.2. 工作原理2.3. 重要的安全性说明2.3.1. SMB加密的好处2.3.2. 非加密口令的好处2.4. smbpasswd文件2.5. smbpasswd命令2.6. 设定Samba支持LanManager加密3. 在Samba中配置微软分布式文件系统树3.1. 介绍3.1.1. 说明4. Samba 2.2.x中的打印支持4.1. 介绍4.2. 配置4.2.1. 建立[print$]项4.2.2. 为现有打印机设定驱动程序4.2.3. 支持大量打印机4.2.4. 通过Windows NT APW添加新打印机4.2.5. Samba和打印机端口4.3. Imprints工具包4.3.1. 什么是Imprints？4.3.2. 建立打印机驱动程序包4.3.3. Imprints服务器4.3.4. 客户端安装程序4.4. 从Samba 2.0.x向2.2.x迁移5. Samba 2.x中的security = domain选项5.1. 把Samba 2.2添加到NT域5.2. Samba和Windows 2000域5.3. 为什么比security = server选项更好？6. 把Samba 2.2配置成主域控制器6.1. 说明6.2. 配置Samba域控制器6.3. 建立机器信任账号并把客户添加到域中6.4. 常见问题及错误6.5. 系统策略及配置文件6.6. 其它可获得的帮助6.6.1. 链接及类似资源6.6.2. 邮件列表6.7. DOMAIN_CONTROL.txt：Samba & Windows NT域控制7. 用Winbind在Windows NT与UNIX间进行统一登录7.1. 概要7.2. 介绍7.3. Winbind的功能7.3.1. 使用目标7.4. winbind如何工作7.4.1. Microsoft远程过程调用7.4.2. 名字服务切换7.4.3. 可插式验证模块7.4.4. 用户及组ID的分配7.4.5. 缓存结果7.5. 安装及配置7.6. 限制7.7. 结语8. UNIX权限位和Windows NT访问控制表8.1. 用NT安全对话框浏览和修改UNIX权限8.2. 如何浏览Samba共享项上的文件权限8.3. 浏览文件所有权8.4. 浏览文件或目录权限8.4.1. 文件权限8.4.2. 目录权限8.5. 修改文件或目录权限8.6. 使用创建掩码选项8.7. 使用文件属性映射9. OS2客户HOWTO9.1. 常见问答集9.1.1. 如何把OS/2 Warp Connect或OS/2 Warp 4配置成Samba的客户端？9.1.2. 如何把How can I configure OS/2 Warp 3 (非Connect版)、OS/2 1.2、1.3或2.x配置成Samba的客户端？9.1.3. 把OS/2(任何版本)作为客户端还有其它的问题吗？9.1.4. 如何让OS/2客户下载打印机驱动程序呢？10. 中文翻译版致谢--------------------------------------------------------------------------------第1章. 如何安装并测试Samba1.1. Step 0: 阅读手册页Samba发布版中所带的手册页包含了大量有用的信息，如果你不知道怎样阅读它们，可以试试下面的命令：$ nroff -man smbd.8 | more在Samba的网站可以找到其它的资源。
SMB全系列网络产品介绍
品牌
H3C
D-LINK 思科精睿
HW
产品型号
端口形态 聚合
端口特性 镜像 限速 Port
vlan特性 802.1Q
管理方式
S1526
24FE+2GE COMBO Y Y Y Y Y Web
DES-1126T SLM224G2
24FE+2GE (电)
Y Y Y Y N Web
24FE+2GE COMBO Y Y Y Y Y
SMB全系列网络产品介绍
SMB网络产品 01 SMB 交换机产品介绍 02 SMB 路由器产品介绍
1
H3C SMB交换机产品全家福
无管理型交换机
百兆
• S1016 • S1016R • S1024 • S1024R • S1026T • S1048 • S1050T
千兆
• S1208 • S1224 • S1224R • S1324 • S1324F
功能增强，支持IMC等 软件集中拓扑管理、STP、 用户接入认证等特性；
功能进一步增强，在智能管理 型产品功能基础上，支持访问 控制列表（ACL），实现ARP 病毒防御等安全功能；
2
基本管理型交换机产品介绍
S1526： 24FE + 2GE COMBO
S5016P： 16GE + 4GE SFP（复用）
8
典型应用 – 经济型酒店
锦江之星 （全国连锁）
ER5200
1. 资金投入有限，需要快速收回成本，对网络产
品功能要求不高，SMB产品完全满足要求。在传统的经 济型酒店组网方案中，H3C基本管理型百兆S1526是首 选接入层交换机；
2. 经济型酒店市场竞争激烈，目前越来越多的中 小型酒店采用无管理千兆交换机S1200做接入实现千兆 到桌面，增加房客上网速度，提升业内服务口碑；
P6SMB30CAT3G资料
P6SMB11CAT3 Series600 Watt Peak Power Zener Transient Voltage Suppressors Bidirectional*The SMB series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMB series is supplied in ON Semiconductor’s exclusive, cost-effective, highly reliable Surmetic t package and is ideally suited for use in communication systems, automotive, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications.Features•Working Peak Reverse V oltage Range − 9.4 to 77.8 V •Standard Zener Breakdown V oltage Range − 11 to 91 V •Peak Power − 600 W @ 1 ms•ESD Rating of Class 3 (>16 KV) per Human Body Model •Maximum Clamp V oltage @ Peak Pulse Current•Low Leakage < 5 m A Above 10 V•UL 497B for Isolated Loop Circuit Protection •Response Time is Typically < 1 ns•Pb−Free Packages are AvailableMechanical Characteristics:CASE:V oid-Free, Transfer-Molded, Thermosetting Plastic FINISH:All External Surfaces are Corrosion Resistant and Leads are Readily SolderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsLEADS:Modified L−Bend Providing More Contact Area to Bond Pads POLARITY:Polarity Band Will Not be IndicatedMOUNTING POSITION:AnyMAXIMUM RATINGSRating Symbol Value Unit Peak Power Dissipation (Note 1) @ T L = 25°C,Pulse Width = 1 msP PK600WDC Power Dissipation @ T L = 75°C Measured Zero Lead Length (Note 2) Derate Above 75°CThermal Resistance, Junction−to−LeadP DR q JL3.04025WmW/°C°C/WDC Power Dissipation (Note 3) @ T A = 25°C Derate Above 25°CThermal Resistance, Junction−to−AmbientP DR q JA0.554.4226WmW/°C°C/WOperating and Storage Temperature Range T J, Tstg−65 to+150°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.10 X 1000 m s, non−repetitive2.1″ square copper pad, FR−4 board3.FR−4 board, using ON Semiconductor minimum recommended footprint, asshown in 403A case outline dimensions spec.*Please see P6SMB6.8AT3 to P6SMB200AT3 for Unidirectional devices.Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value.Device Package Shipping†ORDERING INFORMATIONP6SMBxxCAT3SMB2500/T ape & ReelP6SMBxxCAT3G SMB(Pb−Free)2500/T ape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.The “T3” suffix refers to a 13 inch reel.ELECTRICAL CHARACTERISTICS(T A = 25°C unless otherwise noted)Symbol ParameterI PP Maximum Reverse Peak Pulse CurrentV C Clamping Voltage @ I PPV RWM Working Peak Reverse VoltageI R Maximum Reverse Leakage Current @ V RWMV BR Breakdown Voltage @ I TI T Test CurrentQ V BR Maximum Temperature Coefficient of V BRELECTRICAL CHARACTERISTICS (Devices listed in bold, italic are ON Semiconductor Preferred devices.)Device*DeviceMarkingV RWM(Note 4)I R@V RWMBreakdown Voltage V C @ I PP(Note 6)Q V BRC typ(Note 7)V BR Volts (Note 5)@ I T V C I PPVolts m A Min Nom Max mA Volts Amps%/°C pFP6SMB11CAT3, G P6SMB12CAT3, G P6SMB13CAT3, G 11C12C13C9.410.211.155510.511.412.411.051213.0511.612.613.711115.616.718.23836330.0750.0780.081865800740P6SMB15CAT3, G P6SMB16CAT3, G P6SMB18CAT3, G P6SMB20CAT3, G 15C16C18C20C12.813.615.317.1555514.315.217.11915.0516182015.816.818.921111121.222.525.227.7282724220.0840.0860.0880.09645610545490P6SMB22CAT3, G P6SMB24CAT3, G P6SMB27CAT3, G P6SMB30CAT3, G 22C24C27C30C18.820.523.125.6555520.922.825.728.5222427.053023.125.228.431.5111130.633.237.541.420181614.40.090.0940.0960.097450415370335P6SMB33CAT3, G P6SMB36CAT3, G P6SMB39CAT3, G P6SMB43CAT3, G 33C36C39C43C28.230.833.336.8555531.434.237.140.933.053639.0543.0534.737.84145.2111145.749.953.959.313.21211.210.10.0980.0990.10.101305280260240P6SMB47CAT3, G P6SMB51CAT3, G P6SMB56CAT3, G P6SMB62CAT3, G 47C51C56C62C40.243.647.853555544.748.553.258.947.0551.05566249.453.658.865.1111164.870.177859.38.67.87.10.1010.1020.1030.104220205185170P6SMB68CAT3, G P6SMB75CAT3, G P6SMB82CAT3, G P6SMB91CAT3, G 68C75C82C91C58.164.170.177.8555564.671.377.986.56875.05829171.478.886.195.51111921031131256.55.85.34.80.1040.1050.1050.1061551401301204. A transient suppressor is normally selected according to the working peak reverse voltage (V RWM), which should be equal to or greater thanthe DC or continuous peak operating voltage level.5.V BR measured at pulse test current I T at an ambient temperature of 25°C.6.Surge current waveform per Figure 2 and derate per Figure 3 of the General Data − 600 Watt at the beginning of this group.7.Bias Voltage = 0 V, F = 1 MHz, T J = 25°C*The “G’’ suffix indicates Pb−Free package available. Please refer back to Ordering Information on front page.P , P E A K P O W E R (k W )P 1101000.1t, TIME (ms)Figure 2. Pulse WaveformTYPICAL PROTECTION CIRCUITFigure 3. Pulse Derating CurveP E A K P U L S E D E R A T I N G I N % O F P E A K P O W E R O R C U R R E N T @ T A = 25C°T A , AMBIENT TEMPERATURE (°C)Figure 4. Typical Junction Capacitance vs. BiasVoltageBIAS VOLTAGE (VOLTS)110100C , C A P A C I T A N C E (p F )APPLICATION NOTESRESPONSE TIMEIn most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 4.The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 5. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMB series have a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Z in is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation.DUTY CYCLE DERATINGThe data of Figure 1 applies for non-repetitive conditions and at a lead temperature of 25°C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 6. A verage power must be derated as the lead or ambient temperature rises above 25°C. The average power derating curve normally given on data sheets may be normalized and used for this purpose.At first glance the derating curves of Figure 6 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 m s pulse. However, when the derating factor for a given pulse of Figure 6 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend.VFigure 5. Figure 6.Figure 7. Typical Derating Factor for Duty CycleD E R A T I N GF A C T O R10.70.50.30.050.10.010.020.030.07D, DUTY CYCLE (%)UL RECOGNITIONThe entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2)under the UL standard for safety 497B and File #116110.Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several testsincluding Strike V oltage Breakdown test, Endurance Conditioning, Temperature test, Dielectric V oltage-Withstand test, Discharge test and several more.Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category.PACKAGE DIMENSIONSSMBDO−214AACASE 403A−03ISSUE F*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SURMETIC is a trademark of Semiconductor Components Industries, LLC.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
SUN T3 产品说明
(CR 6978171) 21
iv SPARC T3-1 服务器产品说明 • 2010 年 12 月
set /SP send_break_action=break 只有在域和服务处理器启动 3 分钟以后才能成功 (6984298) 22
SPARC T3-1 服务器
产品说明
文件号码： 821-2879-15 2010 年 12 月，修订版 A
Copyright © 2010， Oracle 和/或其附属公司。保留所有权利。 本软件和相关文档是根据许可证协议提供的，该许可证协议中规定了关于使用和公开本软件和相关文档的各种限制，并受知识产权法的保护。 除非在许可证协议中明确许可或适用法律明确授权，否则不得以任何形式、任何方式使用、拷贝、复制、翻译、广播、修改、授权、传播、 分发、展示、执行、发布或显示本软件和相关文档的任何部分。除非法律要求实现互操作，否则严禁对本软件进行逆向工程设计、反汇编或 反编译。 此文档所含信息可能随时被修改，恕不另行通知，我们不保证该信息没有错误。如果贵方发现任何问题，请书面通知我们。 如果将本软件或相关文档交付给美国政府，或者交付给以美国政府名义获得许可证的任何机构，必须符合以下规定： U.S. GOVERNMENT RIGHTS Programs, software, databases, and related documentation and technical data delivered to U.S. Government customers are "commercial computer software" or "commercial technical data" pursuant to the applicable Federal Acquisition Regulation and agency-specific supplemental regulations. As such, the use, duplication, disclosure, modification, and adaptation shall be subject to the restrictions and license terms set forth in the applicable Government contract, and, to the extent applicable by the terms of the Government contract, the additional rights set forth in FAR 52.227-19, Commercial Computer Software License (December 2007). Oracle America, Inc., 500 Oracle Parkway, Redwood City, CA 94065. 本软件或硬件是为了在各种信息管理应用领域内的一般使用而开发的。它不应被应用于任何存在危险或潜在危险的应用领域，也不是为此而开 发的，其中包括可能会产生人身伤害的应用领域。如果在危险应用领域内使用本软件或硬件，贵方应负责采取所有适当的防范措施，包括备份、 冗余和其它确保安全使用本软件或硬件的措施。对于因在危险应用领域内使用本软件或硬件所造成的一切损失或损害， Oracle Corporation 及 其附属公司概不负责。 Oracle 和 Java 是 Oracle 和/或其附属公司的注册商标。其他名称可能是各自所有者的商标。 AMD、 Opteron、 AMD 徽标以及 AMD Opteron 徽标是 Advanced Micro Devices 的商标或注册商标。 Intel 和 Intel Xeon 是 Intel Corporation 的商标或注册商标。所有 SPARC 商标均是 SPARC International, Inc 的商标或注册商标，并应按照许可证的规定使用。 UNIX 是通过 X/Open Company, Ltd 授权的注册商标。 本软件或硬件以及文档可能提供了访问第三方内容、产品和服务的方式或有关这些内容、产品和服务的信息。对于第三方内容、产品和服务， Oracle Corporation 及其附属公司明确表示不承担任何种类的担保，亦不对其承担任何责任。对于因访问或使用第三方内容、产品或服务所造 成的任何损失、成本或损害， Oracle Corporation 及其附属公司概不负责。
富士通 SPARC Enterprise M3000 服务器数据表说明书
DatasheetFujitsu SPARC Enterprise M3000 serverPowerful entry-level solution to mission critical computing, with the high-end benefits of virtualization, automation and the deployment flexibility of a UNIX application portfolio, usable in both A/C and D/C powered datacenters.Only the best with Fujitsu SPARC Enterprise Based on robust SPARC architecture and running the leading Oracle Solaris 11, Fujitsu SPARC Enterprise servers are ideal for customers needing highly scalable, reliable platforms that increase their system utilization and performance through virtualization.The combined leverage of Fujitsu’s expertise in mission-critical computing technologies and high-performance processor design, with Oracle’s expertise in open, scalable, partition-based network computing, provides the overall flexibility to meet any task. A SPARC of steelFujitsu SPARC Enterprise M3000 is the entry to mission-critical system with high-end features plus a ‘Super Green Product” profile. It uses the same aggressive RAS functions as its larger enterprise class cousins, yet the compact rack mounted single processor design ensures the lowest possible cost of ownership.In-built self-healing mechanisms and rock solid dependability, plus the latest 2.86 GHz SPARC64 VII+ processor, means excellent and long term operation for a wide range of systems including databases, ERP application modules and telecommunication systems. Total binary compatibility also fully protects your application investments, as well as providing Solaris Containers for resource virtualization at no extra cost. You will find that Fujitsu SPARC Enterprise M3000 is a cost performance leader for whatever tasks you have in mind.Features and benefits Flexible investment protectionThe latest SPARC64 VII+ quad-core processor, suited to both high performance business tasks and multi-process virtual environment. Investment protection for years to come, less risk and lower cost of ownership.Scales 30% beyond previous Fujitsu PRIMEPOWER models with lower space and power requirements.Fast deployment of new applications with total availability for business critical processes.Supports thousands of Solaris Containers and highly secure clustered environments based on Fujitsu PRIMECLUSTER. Reliability that makes you forgetEngineered with mainframe class self-healing capability.Major circuits of processors and memory are constantly monitored to ensure correct and continuous operation Suits the needs for mission critical systems - databases and various industry application systems including finance and telecommunications.Maximizes the delivery of peak performance by the self-managing hardware.World’s most advanced OS, Oracle Solaris 11Whole network can be virtualized by mapping physical network entities onto virtualization entitiesSolaris 10 Containers can help applications run on Solaris 11Boot Environment greatly reduces downtime for server updates Highest security including delegated administration can minimize risks of attacks Minimizes costs of server administration and maintenanceApplication asset protection by non-disruptive upgradesMaximum system operations time due to online systems update abilityProtects business credibility by eliminating information exposure and business disruption risksTopicsReliability that makes you forget Flexible investment protectionThe use of four core processors reduces the cost of socket based application licenses as well as enabling more flexible and extensive use of Solaris Containers. Add in the high reliability and lower operating costs and you have unrivalled investment protection. Not only will your servers have a longer useful life but they will also reduce your overall IT spends.As advances in processor technology have continued, Fujitsu SPARC Enterprise and SPARC64 processors provide the ability to significantly increase performance over time. In addition great advances continue to be made in improved Green credentials. M3000 has now achieved Fujitsu’s highest classification of “Super Green Product.” Not only is it very good to the environment it will also reduce your power consumption and cooling costs.To ensure that the available performance can be fully used, Solaris Containers let you quickly and dynamically reconfigure the system to support both existing and new processes concurrently. Fully compatible with all Solaris applications Fujitsu SPARC Enterprise M3000 inter-works will all other Solaris and SPARC Enterprise systems to let you start small and grow as your requirements increase. While Fujitsu SPARC Enterprise M3000 is positioned as an entry to mission-critical server, its reliability is second to none. The Fujitsu design reflects a long engineering heritage where quality and robustness are not seen as items only available at the enterprise level. The result is a most reliable self-sustaining system that works well with all the applications it supports. The wide ranging error checking and correction systems are implemented directly in the hardware. This not only takes the pressure off the OS and applications but also ensures the platform really can manage itself. This relieves system administrators from most of the difficult diagnostic and recovery tasks required with many other systems. Once you own a Fujitsu SPARC Enterprise system you will soon forget the operational problems of the past. Like the engine management systems in the finest cars, everything is monitored and self-managed to ensure all applications work non-stop at the peak of their capability.World’s most advanced OS, Oracle SolarisSolaris is the only OS that has the scalability, security, and diagnostic features to fully and quickly respond if a major application problem occurs. That has directly led to Solaris having one of the world’s largest application portfolios and why it is the development platform of choice for many of the world’s major software developers.Technical detailsProcessorProcessor quantity and type 1 x SPARC64 VII+Processor options 1 x SPARC64 VII+ quad-core processor (2.86GHz, 128KB L1 cache on core, 5.5MBL2 cache per chip)MemoryMemory slots 8 slotsMemory slot type DDR2 SDRAMMemory capacity (min. – max.) 4GB–64GBMemory protection ECCExtended ECCMemory PatrollingMemory modules 8GB Memory Expansion (4 x 2GB DIMM)16GB Memory Expansion (4 x 4GB DIMM)32GB Memory Expansion (4 x 8GB DIMM)Drive baysHard disk bay configuration 4 x 2.5-inch hot-swap SASHard disk drives 300GB 2.5-inch 10,000rpm600GB 2.5-inch 10,000rpmOptical drive bay configuration 1 x 128mm bayOptical drives CD-RW/DVD-RW (8xDVD-ROM, 6xDVD-RW, 24xCD/CD-R, 10xCD-RW) InterfacesLAN/Ethernet 4 ports (Gbit/s, RJ45)SAS 1 port (mini-SAS)Remote Cabinet Interface (RCI) 1 portService LAN for XSCF 2 ports (10/100Mbit/s, RJ45)Service serial for XSCF 1 port (RS232C, RJ45)SlotsPCI Express 4x PCI Express (x8, full-height, short)Supported operating systemsSupported operating systems Oracle Solaris 10 9/10 or laterOracle Solaris 11Operating system release link /sparcenterprise/manual/notes/VirtualizationVirtualization features Solaris ContainersRAS featuresRedundant components Hard disk drive (software RAID/hardware RAID)FanPower supply unit,Power systemHot-swap components Hard disk drive (software RAID/hardware RAID)FanPower supply unit,Dimensions / WeightRack-mount (W x D x H) 440 x 657 x 87 mm; 2U17.4 x 25.9 x 3.4 inches ; 2UWeight 22 kg48.5 lb.EnvironmentSound pressure (LpAm) 47 dB (A)Operating ambient temperature 5–35°C (depending on altitude)41–95°F (depending on altitude)Operating relative humidity 20–80%Operating altitude 0–3,000 m0–10,000 ftElectrical values AC Power DC Power Rated voltage range AC 100–120V, AC 200–240V DC -48 V, DC -60V Rated frequency range 50/60 Hz -Rated current max. 5.15 A (100V–120V) 10.52 A (-48V)2.81A (200V–240V) 8.50A (-60V) Active power max. 505W (100V–120V) 505W (-48V)500W (200V–240V) 510W (-60V) Apparent power max. 515VA (100V–120V) -562VA (200V–240V)Heat emission 1,818 kJ/h (100V–120V), 1,818 kJ/h (-48V)1,802 kJ/h (200V–240V) 1,836 kJ/h (-60V)ComplianceEurope CERoHSUSA/Canada FCCUL/CSAJapan VCCIChina CCCChinese RoHSKorea MICTaiwan BSMICompliance note There is general compliance with the safety requirements of major countries.National approvals required in order to satisfy statutory regulations or for otherreasons can be applied for on request.Warranty and support servicesService link /supportMore informationIn addition to Fujitsu SPARC EnterpriseM3000, Fujitsu provides a range of platform solutions. They combine reliable Fujitsu products with the best in services,know-how and worldwide partnerships.Dynamic InfrastructuresWith the Fujitsu Dynamic Infrastructuresapproach, Fujitsu offers a full portfolio of IT products, solutions and services, ranging from clients to datacenter solutions, Managed Infrastructure andInfrastructure-as-a-Service. How much you benefit from Fujitsu technologies and services depends on the level ofcooperation you choose. This takes IT flexibility and efficiency to the next level.Computing Products/global/services/computing/ - PRIMERGY: Industrial standard server - SPARC Enterprise: UNIX server- PRIMEQUEST: Mission-critical IA server - ETERNUS: Storage system - BS2000/OSD: Mainframe - GS21: Mainframe - ESPRIMO: Desktop PC - LIFEBOOK: Notebook PC - CELSIUS: WorkstationSoftware/software/- Interstage: Application infrastructure software- Systemwalker: System management software- Symfoware: Database software - PRIMECLUSTER: Clustering softwareLearn more about Fujitsu SPARC Enterprise M3000, please contact your Fujitsu sales representative, Fujitsu business partner, or visit our website.©Copyright 2010 Fujitsu Limited. Fujitsu, the Fujitsu logo, PRIMERGY,PRIMEQUEST, ETERNUS, BS2000/OSD, GS21, ESPRIMO, LIFEBOOK, CELSIUS, Interstage, Systemwalker, Symfoware, PRIMECLUSTER are trademarks or registered trademarks of Fujitsu Limited in Japan and other countries. /sparcenterprise/GLOVIA is a trademark of GLOVIAInternational LLC in the United States and other countries.Fujitsu Green Policy Innovation is ourworldwide project for reducing burdens on the environment. Using our global know-how, we aim to resolve issues ofenvironmental energy efficiency through IT. Please find further information at:UNIX is a registered trademark of The Open Group in the United States and other countries.All SPARC trademarks are trademarks or registered trademarks of SPARCInternational, Inc. in the United States and other countries./global/about/environment/Oracle and Java are registered trademarks of Oracle and/or its affiliates.Other company, product and service names may be trademarks or registeredtrademarks of their respective owners.DisclaimerTechnical data subject to modification and delivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective manufacturer, the use of which by third parties for their own purposes may infringe the rights of such owner.ContactFUJITSU LIMITEDWebsite: 2011-11-11 WW-EN。
[精华]sma、smb、smc三极管的三种封装
![[精华]sma、smb、smc三极管的三种封装](https://img.taocdn.com/s3/m/bfc72a3a2bf90242a8956bec0975f46527d3a7b0.png)
SMA、SMB、SMC三极管的三种封装最近的PCB封装绘制的过程中，发现一个问题，同样的一个二极管，我标记的是SK34，但是采购那边给我的既有SL34，SS34，SK34，问了一下，这几种管子的参数都差不多，具体见下表，但是封装怎么会有这么多呢。
因此下定决心把这几种封装详细查阅一下。
SS34的封装为SMA/DO-214AC 符号SS34 SK34 单元最大峰值反向电压VRRM40 40 V Maximum repetitive peak reverse voltage最大反向有效值电压VR(RMS)28 28 V Maximum RMS voltage最大直流阻断电压VDC40 40 V Maximum DC blocking voltage最大正向平均整流电流IFM3.0 3.0 A Maximum average forward rectified current最大正向电压降@IF=1.0A VF0.55 0.50 V Maximum forward voltage正向峰值浪涌电流8.3ms单一正弦半波IFSM100.0 100 A Peak forward surge current 8.3 ms single halfsine-wave最大反向漏电流@TA=25℃/@TA=100℃IR0.5/20 0.5/20 mA Maximum reverse current典型热阻RθJA55.0 60.0 ℃/W Typical thermal resistance典型结点容VR=4.0V f=1.0MHz Cj500 300 pF Type junction capacitance工作温度和存储温度Tj,T STG-65 to+125 -65 to+150℃Operating junction and storage temper rangeSK34的封装是SMC/DO-214AB还有一种封装是SMB/DO-214AA。
专业布线管理软件——iCaMs30简介
专业布线管理软件——iCaMs 3.0 布线管理软件独特优势软件设计始终贯穿以人为本宗旨，充分满足客户体验及效率优先的原则，系统投入运行极大提高了布线管理水平，主要体现在以下几个方面：一、系统可直接在数据库脱离AUTOCAD的环境中使用查阅检索工程图纸，找到所需的信息，大幅度提高效率，这是一般的布线管理系统所无法匹敌的。
二、数据库的维护人员或工程人员可以在数据库中直接利用现有的工程CAD图纸，通过调用程序模块，对工程图纸进行简单地排错后直接使用，大幅度提高效率。
三、银基布线软件通过自身直接对工程图纸进行数据分析，以达到信息点工程图纸数据与软件系统数据库的准确匹配，以进一步提高布线管理软件的实用价值。
四、工程图纸的变更可直接反映到数据库中。
做到规范的图纸拿来直接可以用。
布线管理软件技术特点⏹数据和图形的完美统一⏹规范的综合布线管理⏹规范的技术管理机制⏹全面实用的设备管理布线管理软件案例分析以某项目为例：整个工程近10万个信息点，分布在数百张平面图纸中，系统对每个信息点自动加以关联。
当网管人员指向每个信息点时，自动打开显示图纸并定位到该信息点所处的位置、机架设备的位置及相关的图文信息，以方便维护人员对系统故障进行快速定位和排除。
布线管理软件主要功能一、协助网管人员更好，更快捷的了解布线系统的结构，以及查询信息点的位置和对应连接关系。
把综合布线系统中的连接关系、产品属性、信息点的位置等都存放在数据库中，并用图形的方式直观地显示出来。
实现数据录入、网络更改、系统查询等功能，随时拥有更新的电子数据文档。
二、布线管理软件也能在综合布线施工过程中发挥它的作用。
工程实施中深化设计、工程变更、工程测试数据及竣工资料均能归入其中。
三、支持多项目管理，便于项目经理或软件工程实施人员异地实施及项目移交。
四、支持与信息点相关的用户自定义数据批处理及查询。
丰富的查询功能A、水平信息点查询：快速定位每个信息点到CAD图纸并自动加载定位显示、每个机柜位置图端口闪烁显示。
SACS中文教程
SACS 中文教程建模流程简叙.1启动程序启动SACS 5.2 Executive程序，出现如下主界面：点击左下角的“Directory”选项卡，在“CURRENT DRIVE”中选择文件所在的硬盘盘符； 在CURRENT DIRECTORY 窗口中选择文件存储目录。
CURRENT DIRECTORY窗口CURRENT DRIVE 选项框双击“INTERACTIVE”窗口中的“MOEL”按纽，出现如下界面：选择“Create new model”,点击“OK”按纽确认。
出现如下界面：中选择“JACKET “（导管架）类型，使用向导建模。
根据向导出现的界面，依次输入以下数据：根据以上步骤，已建立了导管架的主框架，见下图，我们可以根据设计图纸或设计思路，接下来建更详细的模型。
灵活的运用向导可以节省建模的时间。
尤其是对于有斜度的导管架、塔等采用向导建模会相对简单些，且不容易出错。
通用的建模规则.1点的建立2.1.1点坐标系的定义一般以平台轴线围成的四边形的中心作为原点；X轴： 平台北向为X轴正向；Y轴： 平台东向为Y轴正向；Z轴： 垂直水面向上为Z轴正向，零点为海图面；2.1.2 点的命名一个平台整个模型包括有很多模块，大概有成千上万个点构成，为方便建模（模型的导入等）及校对，有序的点编号将使模型变得有条理，便于管理。
根据以往设计的经验对整个平台每个模块结构上的点的命名进行了规范。
z导管架点的命名规则以下我们以四条腿的导管架举例来说明导管架点的命名方法：1、导管架腿上的点命名以xxxL(L代表leg)，第一个x为其导管架的层数。
后两个根据实际需要编号；2、每层平面内点的命名以Hxxx（H代表HORIZONTAL）,第一个x为层数。
后两个xx根据实际需要编号；3、对立面上x支撑的交点的命名以Xxxx（x代表x－brace）第一个x跟第二个x代表上下两层的层数，第三个x根据实际情况编号；z上部组块点的命名规则以下我们以四条腿的上部组块举例来说明上部组块点的命名方法：1、上部组块上的点命名以A（B/C/D..）xxx(L代表leg)，第一个字母表示层数，第一层为A开头，第二层为B开头依次类推，第二、三不用字母，均使用数字编号，如果表示的点是在腿上，则最后一个数字用L表示。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
0.1s
1.0s
td - Pulse Width (sec.)
TL Lead Temperature (°C)
Fig.3 - Pulse Waveform
150
Fig. 4 - AC Line Protection Application
tr = 10µsec. IPPM - Peak Pulse Current,% IRSM
元器件交易网
Ml Components
omponents 20736 Marilla Street Chatsworth !"# $
% !"#
Revision: 1
2 of 4
2006/05/12
元器件交易网
MCC
Micro Commercial Components
Fig.2-Power Derating Curve
100 Average Power 87.5 75
TM
Electrical Ratings and Characteristic Curves (Ta=25 °C unless otherwise specified)
Revision: 1
4 of 4
2006/05/12
NOTES: 1. 2. Non-repetitive current pulse, per Fig.3 and derated above o TA=25 C per Fig.2. 2 Mounted on 5.0mm copper pads to each terminal.
A
C
E B F
DIMENSIONS INCHES MIN .083 .075 .002 .006.030 .200 .160 .130 MM MIN 2.13 1.91 0.051 0.152 0.76 5.08 4.06 3.30
SMBSAC5.0 THRU SMBSAC50
Low Capacitance Transient Voltage Suppressors 5 to 50 Volts 500Watt
DO-214AA (SMB) (LEAD FRAME)
G
Features
l For surface mount applications in or der to optimize boar d space l Excellent clamping capability l Fast response time: typical less than 1.0ps from 0 volts to VBR minimum l Ideal for data line applications l UL Recognized File # E222849
45 45 45 45 45 45 45 45 45 45 45 45 45 45 45
75 75 75 75 75 75 75 75 75 75 75 75 75 150 150
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
100 100 100 100 100 100 100 100 100 100 100 100 100 200 200
Revision: 1
3 of 4
2006/05/12
元器件交易网
MCC
Micro Commercial Components
TM
***IMPORTANT NOTICE*** Micro Commercial Components Corp . reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. ***APPLICATIONS DISCLAIMER*** Products offer by Micro Commercial Components Corp . are not intended for use in Medical, Aerospace or Military Applications.
Mechanical Data
l Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 l l l Terminals: solderable per MIL-STD-750, Method 2026
The band denotes TVS cathode
Maximum soldering temperature: 260 C for 10 seconds
D
H
o
Maximum Ratings @ 25oC Unless Otherwise Specified Peak Pulse Current on IPP See Table 1 Note: 1 10/1000us waveform Peak Pulse Power PPP 500W Note: 1, Dissipation 2 Steady State Power Dissipation PD 3 Watt TL= 75o C With at lead lengths 0.375"(9.5mm) Operation and Storage TJ , TSTG -55o C to +175o C Temperature Range
10/1000µsec.Waveform as defined by R.E.A.
td
0 0 1.0 2.0
3.0
3.0
4.0
4.0
t - Time(ms)
Application Note: Device must be used with two units in parallel,opposite in polarity as shown in circuit for AC signal line protection.
100
Pig.1 - Peak Pulse Power Rating Curve
30 Non-repetitive Pulse Waveform shown in Fig. 3 TA=25°C
10
IPPM-Peak Pulse Power (kW)
Percentage of Rated Power(%)
Peak Value IPPM
TJ = 25°C Pulse Width (t d) is defined as the point where the peak current decays to 50% of IPPM Low Capacitance TVS
100
Half Value- IPPM 2 50
SLT SLX SME SMK SMP SMV SMZ
5.0 6.0 7.0 8.0 8.5 10.0 12.0 15.0 18.0 22.0 26.0 30.0 36.0 45.0 50.0
7.6 7.9 8.3 8.9 9.44 11.10 13.30 16.70 20.00 24.40 28.90 33.30 40.00 50.00 55.50
TM
SMBSAC 5.0THRU SMBSAC50
STANDMINIMUM OFF BREAKDOWN MCC Marking VOLTAGE VOLTAGE PART AT IT=1.0mA VWM Code NUMBERS V(BR) (VOLTS) (VOLTS)
SMBSAC5.0 SKE SMBSAC6.0 SKG SMBSAC7.0 SKM SMBSAC8.0 SKR SMBSAC8.5 SKT SMBSAC10 SKX SMBSAC12 SLE SMBSAC15 SLM SMBSAC18 SMBSAC22 SMBSAC26 SMBSAC30 SMBSAC36 SMBSAC45 SMBSAC50
0.082”
0.050”
Schematic Diagram
Revision: 1
1 of 4
2006/05/12
元器件交易网
MCC
Micro Commercial Components
MAXIMUM REVERSE LEAKAGE AT VWM IR(uA) MAXIMUM MAXIMUM MAXIMUM WORKING CLAMPING PEAK PULSE JUNCTION INVERSE CURRENT CAPACITANCE BLOCKING VOLTAGE PER FIG.3 AT Ipp=5.0A AT 0 VOLTS VOLTAGE Ipp (AMPS) (pF) VC (V) VWIB (VOLTS) INVERSE PEAK BLOCKING INVERSE LEAKAGE BLOCKING CURRENT VOLTAGE VWIB VPIB IIB(mA) (VOLTS)