sht10温湿度传感器生产厂家
SHT10温湿度检测设计要点及故障分析
引言
S l HT x系列属 于 S noin传感器家族 中的贴片封装系列 。 e sr o 传感 器将传感 元件和信号 处理 电路集 成在一块微 型电路板上 , 输 出完 全标定 的数据 信号。传感器采用专利 的 C MOSn 技术 , es
氧化。主板在 生产时要 刷防潮胶进行T H1 0温湿度检测设计要 点
《 开发 使用 S T x H x 温湿 度传 感 器注 意事 项 》之 中提 到 了
包装 、运 输 、焊 接 、防静 电 的要 求 ,以及 编程 使 用 中应该 注 意的 问题 ,都是 设计开 发要注意 的事项 ,下 面结合空 调机组
S T1 湿 度 检 测 板 的 开 发 过 程 ,分 别 从 安 装 、硬 件 、 软 件 方 H 0温
境下氧化。 1 H1 2 S T 湿 度 检 测 板 硬 件 设 计 要 点 0温
S TI H O温湿度检 测板硬件设计 要注意在 电源处加 电容 进行 滤波去耦 ,在 S T O传感器的 四周 开槽 隔热 ,同时也要 注意 HI 拉 电阻的使用 。 ”
确保 产 品具有 极高 的可靠 性与卓越 的长期稳定性 。传感器包括
现时钟 S K信号的脉冲输出不全 , C 导致 S TI H O的I c通讯不 正常。 在 S K增加 1K的上拉 电阻,进 行 E C 0 MC测试 时 S K的脉 冲输 C 出正常 ,不再 出现 “ 回风探 头故 障”。所以在 数据线 D A AT
接 l ~ 0 的上 拉 电阻 , 同时 在 S K接 l~ 0 的 上 拉 电 阻 ,可 0 2K C 02K 以 提 高 S T O检测 板 抗 干 扰 能力 。 HI
面总结设计要点 。 11 H 1 . S T 0温湿度检测板安装设计要点 S I HT O温湿 度检测板 安装在空 调机组上长期运 行 ,如不进
SHT10空气温湿度MODbus协议(单指令)
SHT10温湿度传感器的通信协议命令包含:1.读取站号命令2.写站号命令3.读取数据4.手动矫正数据串口参数设置:读站号命令(固定命令)主站从站地址功能码H地址L地址 H数据L数据 CRC00 03 00 01 00 01 CRClo CRChi 从站从站地址功能码H地址L地址H数据CRC00 03 02 00 XX CRClo CRChi 注:返回帧与主站相同设备地址:(XX=01-FF)示例:命令00 03 00 01 00 01 D4 1B(固定命令)回复00 03 02 00 FF C5 C4 (设备默认站号FF)写站号命令主站从站地址功能码H地址L地址寄存器个数寄存器个数数据长度数据CRC00 10 00 01 00 01 02 00 XX CRClo CRChi 注:(XX=0X01-0XFF)从站从站地址功能码 H地址L地址寄存器个数CRC00 10 00 01 00 01 CRClo CRChi 示例:命令00 10 00 01 00 01 02 00 33 EA 04回复00 10 00 01 00 01 51 D8读数据主站从站地址功能码 H地址L地址寄存器个数寄存器个数CRCXX 03 00 00 00 02 CRClo CRChi注:(XX=0X01-0XFF)从站从站地址功能码数据长度数据数据CRCXX 03 04 19 AD 1B E4 CRClo CRCh 示例命令FF 03 00 00 00 02 D1 D5回复FF 03 04 19 AD 1B E4 79 FA注:温度:第4,5个字节19 AD温度=读数/100-40度湿度:第5,6个字节1B E4。
SHT10,SHT11,SHT20,SHT21替代品温湿度传感器HTU21D
最小值
-40
-40 -40
典型值
0.01 0.04
±0.3 ±0.4
44 22 11 6 10
最大值
+125
125 221 58 29 15
8
单位
℃ ℃ ℃
℃ ℃ ℃ °F ms ms ms ms s
9.温度误差估算
温湿度感应芯片HTU21D郑:18070430980
10.焊接说明 可以使用标准的回流焊炉对 HTU21 进行焊接。传感器完全符合 IPC/JEDEC J-STD-020D 焊
2.传感器的特点
·完整的互换性,在标准环境下无需校准 ·长期处于湿度饱和状态,可以迅速恢复 ·自动组装工艺生产,无铅材料制成,适合回流焊 ·每个传感器具有单独标记,可追溯生产源头
应用举例
·家庭应用 ·医疗领域 ·打印机 ·加湿器
3.性能规格
参数
储藏温度
供电电压(峰值)
湿度测量范围
温度测量范围
VDD to GND 数字 I/O 口引脚(DATA/SCK)to VDD 每个引脚输入电流
·相对湿度转换
不论基于哪种分辨率,相对湿度RH 都可以根据SDA 输出的相对湿度信号SRH通过如下 公式计算获得 (结果以 %RH 表示):
例如16位的湿度数据为0x6350:25424,相对湿度的计算结果为42.5%RH。
·温度转换
不论基于哪种分辨率,温度T 都可以通过将温度输出信号ST代入到下面的公式计算得到 (结果以温度°C 表示):
无论哪种传输模式,由于测量的最大分辨率为14 位,第二个字节SDA 上的后两位LSBs (bit43 和44)用来传输相关的状态信息。两个LSBs 中的bit1 表明测量的类型(’0’温度;‘1’: 湿度)。bit0 位当前没有赋值。
SHT10(温湿度传感器)
应用领域
框图
_ 暖通空调 HVAC
_ 测试及检测设备
_ 汽车
_ 数据记录器
1
_ 消费品
_ 自动控制
_ 气象站
_ 家电
_ 湿度调节器
_ 医疗
_ 除湿器
湿度 传感
器
Amplification
14-bit
校验存储器
D A
数字 2-线 接口
& CRC 发生器
SCK DATA
订货信息
型号 测湿精度 测温精度
封装
200 ns
表 5 SHTxx I/O 信号特性
2.3.2 电量不足 “电量不足”功能可监测到 Vdd 电压低于 2.47V 的 状态。精度为±0.05V。
2.3.3 加热元件
传感芯片上集成了一个可通断的加热元件。接通 后,可将 SHTxx 的温度提高大约 5-15℃(9-27℉)。 功耗增加~8mA @ 5V。 应用于:
2.2.2 串行数据 (DATA) DATA三态门用于数据的读取。DATA在 SCK 时
钟下降沿之后改变状态,并仅在 SCK 时钟上升沿有 效。数据传输期间,在SCK 时钟高电平时,DATA必 须保持稳定。为避免信号冲突,微处理器应驱动 DATA 在低电平。需要一个外部的上拉电阻(例如: 10kΩ)将信号提拉至高电平(参见图 2)。上拉电阻 通常已包含在微处理器的 I/O 电路中。详细的 IO 特 性,参见表 5。
DATA
Transmission Start
SCK 1 2
图4
3 4 -8 9 通讯复位时序
2.2.6 CRC-8 校验
数字信号的整个传输过程由 8bit 校验来确保。任 何错误数据将被检测到并清除。 详情可参阅应用说明“CRC-8 校验”。
基于SHT10的数字温湿度计设计
装或 四脚互换封装 , 积微小 , 自动降能功能。 体 全
22 单片机和 S . HT1 0接口电路
由于 A 8 S 1 T 9 5 不具备 I C总线接 口, 2 故使 用单 片机通用
I / O口线来虚拟 IC总线[ 利用 P . 2 9 1 , 1 6来虚拟时钟线 , 利用 P . 1 5
图3 主程序流程 图
H . 6
只支持 ” 0 ” 0 0 )和 5 个命 令位 ,当上述命令 发送给 S 1 HT 0之 后, 单片机通过检测 D T A A脚 的 A K位 是否处于低 电位确认 C
P . 32
度
传
感
嚣
嚣
S 1 HT 0是否正确讯
会使 串口复位 : 当使 DA A线处 于高 电平时 , T 触发 S K9次以 C 上 ( 9次 )并随后发一个前述的“ 含 , 传输开始” 命令 。
33 温 湿 度 测 量 时 序 .
0 6
8
当单片机发出 了传输开始命令 ,且 S HT 1 0正确接收到温
李 志 强 , 顺 , 黄 郭华新
( . 阳师范学院, 1衡 湖南 衡 阳 4 l 0 ;. 2 0 82 湖南省常宁市农业局 , 湖南 常宁 4 l 0 ) 2 0 5
【 摘 要 】 介绍了 种基于S T 0 度计的设计原理, 说明了 度计的电 一 H 1 温湿 详细 温湿 路结构、H 1 数据传输格式、 度、 ST0 温
湿度数 据采集软件设 计。通过硬件 电路 设计和软件程序设 计并实施 实验的数字式温湿度 计具有智 能化 、 高精度 、 高可靠性等优势。
【 关键词 】 S T 0数字 温 湿度 H 1; 式; 度; 【 中图分类号 】 T 22 P1 【 文献标识码 】 A
AHT10温湿度传感器技术手册说明书
AHT10 技术手册温湿度传感器• 完全标定应用范围暖通空调 、除湿器、测试及检测设备、消费品、汽车 、自动控制、数据记录器、气象站、家电、湿度调节、医疗及其他相关温湿度检测控制。
图 1: AHT10 传感器封装图(单位:mm 公差:0.1mm )2• 数字输出,I C 接口• 优异的长期稳定性• 采用SMD封装适于回流焊• 响应迅速、抗干扰能力强0.80.84.05.01.271.02.7ADRSDASCLNCGNDVDDASAIR®传感器性能相对湿度温度-40 -20 0 20 40 60 80图 3 温度典型误差和最大误差。
温度(℃)±0±2±4±6±8图 2 25°C 时相对湿度的最大误差。
△R H (%RH )△T℃相对湿度(%RH )电气特性表2 电气特性。
包装信息此精度为出厂检验时,传感器在 25℃供电电压为3.3V 条件下的测试精度。
此数值不包括迟滞和非线性,并只适用于 非冷凝条件。
25℃和1m/s 气流条件下,达到一阶响应 63%所需时间。
正常工作范围:0-80%RH, 超出此范围,传感器读数会有偏差(在90%RH 湿度下 200 小时后,漂移<3%RH)。
工作范围进一步限定在 -40– 80℃。
如果传感器周围有挥发性溶剂、带刺激性气味的胶带、粘合剂以及包装材料,读数可能会偏高。
详细说明请参阅相关文件。
供电电流和功耗的最小值和最大值都是基于 VDD = 3.3V 和 T<60℃的条件。
平均值为每两秒中进行一次测量的数值。
响应时间取决于传感器基片的导热率。
表 1 湿度特性表表 3 温度特性表表4 包装信息。
123456表1中给出的功耗与温度和供电电压VDD有关。
关于功耗的估测参见图6和7。
请注意图6和7中的曲线为典型自然特性,有可能存在偏差。
图6VDD=3.3V时,典型的供电电流与温度的关系曲线(休眠模式)。
常见十大温度传感器品牌
1、日本(OMRON)欧姆龙OMRON欧姆龙集团始创于1933年,目前拥有近87年历史。
现有员工32583人,全球营业额6272亿日元,产品品种达几十万种,涉及工业自动化控制系统、电子元器件、汽车电子、社会系统以及健康医疗设备等广泛领域。
为了适应时代的发展,在公司成立50周年纪念时,公司名称与品牌名称实现了统一,改为“欧姆龙集团(株式会社)”。
创造社会需求,构筑“安心”,“安全”,“环保”“健康”的社会,是欧姆龙集团的发展目标。
2、德国(KROHNE)科隆德国KROHNE公司一直是国际测量领域的先驱,拥有先进技术和丰富的应用经验,使其能够根据市场的要求不断创新,从而提供给全球用户可靠、便捷、先进的测量仪器。
近百年来,KROHNE所研发的一系列新产品,不仅创造出多项世界第一,而且还成为测量领域里的标竿,引导着全球测量仪器的变革和发展。
3、美国(banner)邦纳BANNER始建于1966年,目前有54周年历史。
总部位于美国的明尼苏达州,是全球顶尖的自动化技术专家和整体解决方案提供者。
公司拥有22,000多种产品,具有最为齐全的产品线,经过40多年的发展,现已成为全球最大的光电传感器、测量检测、视觉传感器和机床安全产品的专业制造商之一。
丰富完整的产品选择、迅速的交货期、强大的技术支持以及同行业中首屈一指的研发能力保证了BANNER在同行业中的领军地位。
4、德国(IFM)易福门IFM是德国的一个工控品牌。
1969年德国易福门IFM这家家族企业发明了基于薄膜技术的电感式接近传感器,经过51年的发展从此走上了成功的道路。
今天,“efector”品牌成为了位置与流体传感器、物体识别、诊断和识别系统的代名词,而“ecomat”品牌则是网络和控制系统的杰出结果公司在全球70多个国家拥有5200多名员工,主要为机械制造等行业提供研发和销售服务,用户超过约10万家。
5、瑞士(ABB)ABB是电力和自动化技术领域的全球领导厂商,ABB集团位列全球500强企业。
SHT10 SHT11中文资料
可以使用标准的回流焊炉对SHT1x 进行焊接。传感 器完全符合IPC/JEDEC J-STD-020D 焊接标准,在最高 260℃温度下,接触时间应小于40 秒。
TP tP
Temperature
TL TS (max)
tL
图 6: 传感器电极的后面, 俯视图. No copper in this field
max 单位 0.01 14 °C bit °C °C °C °C 123.8 254.9 30 °C °F s °C/yr
典型值 最大值 典型值 最大值 典型值 最大值
可完全互换 -40 -40 (63%) 5 < 0.04
± 10 ±8 RH (%RH)
T (°C)
± 2.0
SHT10 SHT11 SHT15
± 3.0 ± 2.5
max 0.05 12
单位 %RH bit %RH %RH %RH %RH
参数 分辨率 1 精度 2 SHT10 精度 2 SHT11 精度 2 SHT15 重复性 互换性 工作范围 响应时间6 漂移
条件
min 0.04 12
typ 0.01 14 0.5 参见图 3 0.4 参见图 3 0.3 参见图 3 0.1
1.8
用于密封/包装的材质
许多材质吸收湿气并将充当缓冲器的角色,这会加 大响应时间和迟滞。因此传感器周边的材质应谨慎 选用。推荐使用的材料有:金属材料, LCP, POM (Delrin),PTFE (Teflon), PE, PEEK,PP, PB, PPS, PSU, PVDF,PVF。 用于密封和粘合的材质(保守推荐):推荐使用充 满环氧树脂的方法进行电子元件的封装,或是硅树 脂。这些材料释放的气体也有可能污染SHT7x(见 1.3)。因此,应最后进行传感器的组装,并将其置 于通风良好处,或在50℃的环境中干燥24小时,以 使其在封装前将污染气体释放。
基于SHT10传感器的仓库温湿度监测系统
的温 度、 湿度值 超过设 定值 时, 由单 片 机 A T 8 9 S 5 5输 出控 制 信 号 启 动 相 应 的加 温 和 除 湿 装 置 . 同时 由报 警 电 路 实现
超温 、 超湿报警 。 本 文给 出 了 系统 实 现 方 案 框 图及 数 据 采 集 电路 ; 介 绍 了 系统 软 件 实现 思 路 。该 系统 最 终 实现 了对 仓
s i n g l e c h i p mi c r o c o mp u t e r AT 8 9 S 5 5 o u t p u t c o n t r o l s i g n a l s t a r t c o r r e s p o n d i n g h e a t i n g a n d d e h u mi d i f i c a t i o n d e v i c e s , a s we l l a s t h e a l a r m c i r c u i t t o r e li a z e s u p e r t e mp e r a t u r e ,s u p e r we t la a r m. hi T s p a p e r p r e s e n t s t h e i mp l e me n t a t i o n s c h e me d i a g r a m a n d
第 2 l卷 第 l 5期
V0 1 . 2 1
No . 1 5
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电子 设计 工 程
El e c t r oni c De s i g n Eng i ne e r i ng
2 0 1 3年 8月
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基于 S HT I O传感器的仓库 温湿度监测 系统
土壤型温湿度传感器说明书 (详细)
土壤型温湿度传感器说明书_ 相对湿度和温度测量_ 兼有露点_ 全部校准,数字输出,_ 卓越的长期稳定性_ 防水封装,可用于土壤测量_ 超低能耗产品概述数字温湿度传感器系列中土壤型专用传感器,它把传感元件和信号处理集成起来,输出全标定的数字信号。
产品具有极高的可靠性与卓越的长期稳定性。
传感器包括一个电容性聚合体测湿敏感元件、一个用能隙材料制成的测温元件,并在同一芯片上,与14 位的A/D 转换器以及串行接口电路实现无缝连接。
因此,该产品具有品质卓越、超快响应、抗干扰能力强、极高的性价比等优点。
每个传感器芯片都在极为精确的湿度腔室中进行标定,校准系数以程序形式储存在OTP 内存中,在标定的过程中使用。
传感器在检测信号的处理过程中要调用这些校准系数。
两线制的串行接口与内部的电压调整,使外围系统集成变得快速而简单。
微小的体积极低的功耗,使SS2005成为各类应用的首选。
土壤专用传感器提供4 脚引线封装,且传感器与引线之间采用接插件形式,易于更换与替换。
接口说明:技术参数:传感器外形尺寸:SHT系列传感器性能说明图 2 25℃时传感器的最大相对湿度误差图3 最大温度误差电气特性:1 默认测量分辨率为温度14 位,湿度12 位。
通过状态寄存器可分别降至12 位和8 位2 在出厂质量检验时,每支传感器都在25℃(77℉)和3.3V 条件下测试并且完全符合精度指标。
该精度值不包括滞后与非线性。
3 在25℃和1m/s 气流的条件下,达到一阶响应63%所需要的时间。
4 在挥发性有机混合物中数值可能会高一些。
见说明书1.3。
5 在VDD=5.5V 和25℃的条件下,每秒进行一次12 位精度测量的平均值。
6 响应时间取决于传感器表面的热容和热阻。
使用指南1. 应用信息1.1 工作条件传感器在建议的工作条件下性能正常,请参阅图4。
超出建议的工作范围可能导致信号暂时性漂移(60 小时后漂移+3%RH)。
当恢复到正常工作条件后,传感器会缓慢自恢复到校正状态。
温湿度传感器型号大全
温湿度传感器型号大全1. DHT11温湿度传感器•型号:DHT11•工作电压:3.3V-5V•测量范围:温度0-50°C,湿度20-90%RH•精度:温度±2°C,湿度±5%RH•特点:低成本,数字输出,单线串行通信2. DHT22温湿度传感器•型号:DHT22•工作电压:3.3V-5V•测量范围:温度-40-80°C,湿度0-100%RH•精度:温度±0.5°C,湿度±2%RH•特点:数字输出,较高精度,需要外部电阻3. AM2302温湿度传感器•型号:AM2302•工作电压:3.3V-5V•测量范围:温度-40-80°C,湿度0-100%RH•精度:温度±0.5°C,湿度±2%RH•特点:数字输出,与DHT22相同4. SHT11温湿度传感器•型号:SHT11•工作电压:2.4V-5.5V•测量范围:温度-40-123.8°C,湿度0-100%RH•精度:温度±0.5°C,湿度±3%RH•特点:数字输出,较低功耗5. SHT15温湿度传感器•型号:SHT15•工作电压:2.4V-5.5V•测量范围:温度-40-123.8°C,湿度0-100%RH•精度:温度±0.3°C,湿度±2%RH•特点:数字输出,较高精度,带有可选的I2C接口6. HTU21D温湿度传感器•型号:HTU21D•工作电压:3.3V-5V•测量范围:温度-40-125°C,湿度0-100%RH•精度:温度±0.3°C,湿度±2%RH•特点:数字输出,高精度,可通过I2C接口进行通信7. BME280温湿度传感器•型号:BME280•工作电压:1.71V-3.6V•测量范围:温度-40-85°C,湿度0-100%RH•精度:温度±0.5°C,湿度±3%RH•特点:数字输出,温湿度压力三合一传感器,可通过I2C或SPI接口进行通信8. BME680温湿度传感器•型号:BME680•工作电压:1.71V-3.6V•测量范围:温度-40-85°C,湿度0-100%RH•精度:温度±0.5°C,湿度±3%RH•特点:数字输出,温湿度压力气体四合一传感器,可通过I2C或SPI 接口进行通信9. HDC2080温湿度传感器•型号:HDC2080•工作电压:1.62V-3.6V•测量范围:温度-40-125°C,湿度0-100%RH•精度:温度±0.2°C,湿度±2%RH•特点:数字输出,高精度,可通过I2C接口进行通信以上是一些常见的温湿度传感器型号及其主要参数介绍。
SHT102-2023
SHT102-2023概述SHT102-2023是一种新型智能温湿度传感器,广泛应用于环境监测、气象观测、室内空调系统等领域。
该传感器具有高精度、快速响应、稳定性好等特点,能够提供准确的温湿度数据,为用户提供可靠的环境信息参考。
技术规格•工作电压:3.3V-5V•测量范围:–温度:-40°C至80°C–湿度:0%RH至100%RH•精度:–温度:±0.3°C–湿度:±2%RH•长期稳定性:温度<0.03°C/年,湿度<0.25%RH/年•响应时间:–温度:8秒–湿度:5秒•通信接口:I2C功能特点高精度测量SHT102-2023采用先进的温湿度传感器技术,具有高精度的测量能力。
温度测量精度可以达到±0.3°C,湿度测量精度可以达到±2%RH,能够满足各种应用场景的需求。
快速响应SHT102-2023具有快速响应的特点,能够在8秒内完成温度测量,5秒内完成湿度测量。
这种快速响应的特性使得该传感器可广泛应用于要求实时性较高的系统中,如气象监测、工业自动化等。
长期稳定性SHT102-2023具有优异的长期稳定性,温度长期稳定性小于0.03°C/年,湿度长期稳定性小于0.25%RH/年。
这意味着在长时间使用过程中,传感器能够保持较高的测量精度,不需要频繁的校准。
简易接口SHT102-2023采用标准的I2C通信接口,方便与主控设备进行连接。
通过简单的通信协议,用户可以轻松地获取传感器测量到的温湿度数据,并进行相应的处理与分析。
应用领域环境监测由于SHT102-2023具有高精度和快速响应的特点,广泛应用于环境监测领域。
比如空气质量监测、温湿度变化监测等。
通过对环境温湿度的实时监测,可以帮助用户及时发现异常情况,采取相应的措施。
气象观测SHT102-2023的高精度和长期稳定性使其成为理想的气象观测设备。
sht10温湿度传感器说明
4 在挥发性有机混合物中数值可能会高一些。见说明书1.3。 5 此数值为 VDD=5.5V 在温度为 25°C 时, 12bit 测量,1 次/秒条件下
的平均值
6 响应时间取决于传感器底层的热容和热阻。
Relative Humidity (%)
2.6 MAX 0.8 ±0.1
2.2 MAX
图1 SHT1x 传感器尺寸(1mm=0.039inch),“11”表示该传感 器型号为SHT11。 外部接口:1:GND, 2: DATA, 3: SCK, 4: VDD
每个传感器芯片都在极为精确的湿度腔室中进行标 定,校准系数以程序形式储存在OTP 内存中,用 于内部的信号校准。两线制的串行接口与内部的电 压调整,使外围系统集成变得快速而简单。微小的 体积、极低的功耗,使SHT1x 成为各类应用的首 选。
1.9 布线规则和信号完整性 如果SCK和DATA信号线相互平行并且非常接近, 有可能导致信号串扰和通讯失败。解决方法是在两 个信号线之间放置VDD和/或GND,将信号线隔 开,和使用屏蔽电缆。此外,降低SCK频率也可能 提高信号传输的完整性。如使用导线,应在电源引 脚(VDD,GND)之间加一个100nF的去藕电容, 用于滤波。此电容应尽量靠近传感器。详情可参阅
1.8 用于密封/包装的材质 许多材质吸收湿气并将充当缓冲器的角色,这会加 大响应时间和迟滞。因此传感器周边的材质应谨慎 选用。推荐使用的材料有:金属材料, LCP, POM (Delrin),PTFE (Teflon), PE, PEEK,PP, PB, PPS, PSU, PVDF,PVF。
用于密封和粘合的材质(保守推荐):推荐使用充 满环氧树脂的方法进行电子元件的封装,或是硅树 脂。这些材料释放的气体也有可能污染SHT7x(见 1.3)。因此,应最后进行传感器的组装,并将其置 于通风良好处,或在50℃的环境中干燥24小时,以 使其在封装前将污染气体释放。
ShtXX系列介绍
ShtXX系列介绍SHTxx 系列产品是一款高度集成的温湿度传感器芯片,提供全量程标定的数字输出。
它采用专利的CMOSens? 技术,确保产品具有极高的可靠性与卓越的长期稳定性。
传感器包括一个电容性聚合体湿度敏感元件和一个用能隙材料制成的温度敏感元件,这两个敏感元件与一个14 位的A/D 转换器以及一个串行接口电路设计在同一个芯片上面。
该传感器品质卓越、响应超快、抗干扰能力强、极高的性价比。
每个传感器芯片都在极为精确的恒温室中进行标定,以镜面冷凝式露点仪为参照。
通过标定得到的校准系数以程序形式储存在芯片本身的OTP内存中。
通过两线制的串行接口与内部的电压调整,使外围系统集成变得快速而简单微小体积、极低功耗等优点使其成为各类应用中的首选。
相对湿度和温度测量特点露点测量全标定输出,无需标定即可互换使用卓越的长期稳定性两线制数字接口,无需额外电路基于请求式测量,低能耗表面贴片或4针引脚安装超小尺寸自动休眠超快响应时间应用领域暖通空调HVAC 汽车消费电子家用气象站湿度调节器_ 测试及检测设备数据记录仪自动控制家电产品医疗仪器型号测湿精度[%RH] 测温精度[℃] 封装SHT10 ±4.5 ±0.5℃在25℃SMD(LCC)SHT11 ±3.0 ±0.4℃在25℃SMD(LCC)SHT15 ±2.0 ±0.3℃在5~40℃SMD(LCC)SHT71 ±3.0 ±0.4℃在25℃4-PIN单排直插SHT75 ±1.8 ±0.3℃在5~40℃4-PIN单排直插框图性能指标电气特性接口说明电源引脚SHTxx 的供电电压为2.4~5.5V。
传感器上电后,要等待11m 来完成“休眠”状态。
在此期间无需发送任何指令。
电源引脚(VDD,GND)之间可增加一个100nF的滤波电容。
串行接口(两线双向)SHTxx 应用的的串行接口技术,在传感器信号读取及电源损耗方面都做了优化处理;但与I2C 接口不兼容,SHTxx 温湿度传感器注意事项1. 按引脚说明图连接电路。
Sensirion SHTxx 湿度与温度传感器操作指南说明书
Handling InstructionsFor SHTxx Humidity and Temperature SensorsAbstractSensirion SHTxx are relative humidity and temperature sensors of high quality. For taking advantage of their outstanding performance some precautions must be taken during storage, assembly and packaging. Therefore, please read the following instructions carefully - preferably during design-in phase and before production release of the respective device. Special attention is required regarding the exposure to volatile organic compounds, i.e. high concentration and long exposure time to respective gases shall be avoided. Such conditions are known to occur in manufacturing environment and/or during storage. Therefore, proper handling and choice of materials are crucial. Applying sensors in the field in ambient environment is not critical.ApplicabilityThis document is applicable to all Sensirion SHTxx humidity and temperature sensors.ESD protectionThe sensor shall be protected from ESD (Electrostatic Discharge) and only be handled in ESD protected areas (EPA) under protected and controlled conditions (ground all personnel with wrist-straps, ground all non-insulating and conductive objects, exclude insulating materials from the EPA, operate only in grounded conductive floor, etc.). Protect sensor outside the EPA using ESD protective packaging.Protection against ESD is mandatory. Exposure to chemicalsHumidity and Temperature sensors are highly accurate environmental sensors and as such they are not ordinary electronic components. The opening in the package exposes the sensor to the environment and makes it susceptible to pollutants. While applying sensors in the field in ambient environment is not critical, pollutants are known to occur in manufacturing environments and during storage. Please carefully follow the guidelines in this application note to ensure that you can benefit of the sensor’s outstand ing performance.The sensor shall not get in close contact with volatile chemicals such as solvents or other organic compounds. Especially high concentration and long exposure must be avoided. Ketenes, Acetone, Ethanol, Isopropyl Alcohol, Toluene, etc. are known to cause drift of the humidity reading –irreversibly in most of the cases. Please note that such chemicals are integral part of epoxies, glues, adhesives, etc. and outgas during baking and curing. These chemicals are also added as plasticisers into plastics, used for packaging materials, and do out-gas for some period.Acids and bases may affect the sensor irreversibly and shall be avoided: HCl, H2SO4, HNO3, NH3etc. Also Ozone in high concentration or H2O2have the same effect and therefore shall be avoided. Please note, that above examples represent no complete list of harmful substances.The sensor shall not get in contact with cleaning agents (e.g. PCB board wash after soldering) or strong air blasts from an air-pistol (not oil-free air). Applying cleaning agents to the sensor may lead to drift of the reading or complete breakdown of the sensor.Ensure good ventilation (fresh air supply) to avoid high concentrations of volatile chemicals (solvents, e.g. ethanol, isopropanol, methanol, acetone, cleaning solutions, detergents…).Packaging and storagePrior to assembly or use of the sensors it is strongly recommended to store the sensors in the original sealed ESD bag at following conditions: Temperature shall be in the range of 10°C – 50°C (0 – 125°C for limited time) and humidity at 20 – 60%RH (sensors that are not stored in ESD bags).Store sensors in original, unopened ESD bag. Place additional stickers only on the outside of the ESD bag.Once sensors have been removed from the original ESD bag we recommend to store the individual sensors as well as devices with assembled sensors in metal-in antistatic shielded ESD bags. In particular, it is recommended not to use any adhesive or adhesive tapes to reseal the sensor bag after opening. Following ESD Bags can be recommended (no polluting effect on humidity sensor):ESD Bag Manufacturer ProductStroebel"Topshield" BagsSensors as a component or mounted into the final product shall not be packaged in outgassing plastic materials which could cause sensor pollution. Besides metal-in antistatic shielded ESD bags, paper or cardboards based packaging, deep drawn plastic trays (PE, PET, PP) may be considered. Do not use antistatic polyethylene bags (light blue, pink or rose color); be very careful with bubble foils and foams.Be careful about stickers present inside the packing (e.g. on the housing of the device). Sticker size should be kept to a minimum, and the sticky side shall fully adhere onto a surface.Please note that many packaging materials may be provided with additives (plasticizers) which may have a polluting effect on the sensor. Generally speaking, if a material emits a strong odour you should not use it. Additives may also be added to materials which are listed for recommended use. For high safety, device housing and shipment packaging must be qualified. Such a qualification test may contain exposure of the final device with sensor in its shipment packaging to temperature ≥65°C for at least 168 hours. (If shipping or storage conditions are expected to be harsh, the qualification test conditions for the packing material have to be customized.) The sensor reading then shall showno changed deviation against a reference compared to same measurements before the exposure.Do not use polyethylene antistatic bags (light blue, pink or rose color). Do not use adhesive tapes inside packaging.For guidance on simple and straight-forward testing of humidity sensors please consult the Testing Guide for humidity sensors.Assembly - SolderingFor soldering, standard reflow soldering ovens may be used. The sensors are designed to withstand soldering profile according to IPC/JEDEC J-STD-020 with peak temperatures at 260°C during up to 30sec for Pb-free assembly in IR/Convection reflow ovens (see Error! Reference source not found.).Make sure that maximum temperatures and exposure times are respected. In case the PCB passes through multiple solder cycles (as is the case for e.g. PCB that are assembled on top and bottom side), it is recommended to assemble the SHTxx only in the last solder cycle. This is to reduce risks of sensor pollution.Figure 1 Soldering profile according to JEDEC standard. T P ≤ 260°C and t P ≤ 30sec above 255°C for Pb -free assembly. T L < 220°C and t L < 150sec. Ramp-up rate <3°C and ramp-down rate < 6°C/sec for temperatures > T L .SHT31 – 500pcsInspectedT e m p e r a t u r eTimet P T PT L T S (max)t Lpreheatin liquid phaseThe use of “no clean” type ≥3 solder paste 1 is strongly recommended as no board wash can be applied to SHTxx humidity sensors. An appropriate amount of solder paste shall be used, to result in a stand-off height (clearance between the package body and any part of the substrate) of 50μm to 75μm. Please consult the appropriate sensor data sheet for device specific information on the metal land pattern and recommendations on solder paste printing stencils. Standard pick & place equipment and vacuum nozzles for standard QFN packages may be used for assembly of SHTxx and STSxx sensors.Manual soldering is not recommended. For rework soldering, contact time must be limited to 5 seconds at up to 350°C.Immediately after the exposure to high temperatures SHTxx humidity sensors may temporarily read a negative humidity offset (typ. -1 to -2 %RH after reflow soldering). This offset slowly disappears again by itself when the sensor is exposed to ambient conditions (typ. within 1-3 days). If RH testing is performed immediately after reflow soldering, this offset should be considered when defining the test limits.It is important to note that the diced edge or side faces of the I/O pads may oxidise over time, therefore a solder fillet may or may not form. Hence there is no guarantee for solder joint fillet heights of any kind.Assembly – OthersSensors in SMT packages are classified as Moisture Sensitivity Level 1 (IPC/JEDEC J-STD-020). It is recommended to process the sensors within 1 year after date of delivery.Before developing the assembly process, please read the User ’s Guide and the Datasheets carefully. In the following, crucial items are underlined plus additional items are given:No mechanical force shall be applied to any part of the sensor during assembly or usage.No board wash shall be applied to SHTxx humidity sensors. Therefore, and as mentioned in the previous section , it is strongly recommended to use “no -clean” solder paste.1 Solder types are related to the solder particle size in the paste: Type 3covers the size range of 25 – 45 µm as specified in IPC J-STD-005A .Do not apply board wash.For application in corrosive environment – such as condensed water or corrosive gases – it may be necessary to protect the electronic assembly including the soldered contacts of the sensor with a passivation. Such passivation may be achieved by conformal coating or by applying adhesive.Low viscose conformal coatings or potting materials may flow into the inside the sensor cap, cover the sensor element and thus make the humidity sensor inoperative. Use only high viscose conformal coatings or potting materials, or seal the interface between sensor cap and sensor PCB before applying conformal coating. In any case, covering the humidity sensor opening with any kind of coating must be avoided. Therefore, the top surface of the sensor should remain free of coating.If conformal coating is applied, the top surface of the sensor must remain free of coating.Solvent vapors are produced during curing and processing of the coating. Ensure good ventilation throughout the application, staging and curing to prevent pollution of the sensor. Ventilation shall be established in such a way that the concentration of these gaseous substances remains low, e.g. by using ovens with fresh air supply.XXXCoating thickness and curing times shall be chosen according to respective datasheets and application notes of the manufacturer. If a time frame for curing is provided it is recommended to apply the upper time limit. This is especially true if the PCB design features large components with undercuts where high layer thicknesses on/under components or drain-off edges can form. Please note that the tack-free state of the coating is no indication of full curing. For full curing refer to application notes of the manufacturer. Ensure process stability for coating thickness and apply corresponding safety margins for curing times.The following table lists conformal coatings which have been tested regarding pollution of the humidity sensorand are known to be suitable if applied and fully cured under good ventilation and according to respective datasheet.Conformal CoatingsManufacturer ProductPeters Elpeguard SL 1301 ECO-FLZ Electrolube AFA (Aromatic Free Acrylic) Coating Chase HumiSeal 1B51NSLUDow Corning Dow corning 1-2620Do not apply spray to unprotected sensor. Whenever using spray coating techniques (e.g. to apply varnish or conformal coating, etc.) the SHT3x with protective cover option can be used or the SHTxx sensor has to be covered by the adhesive tape to prevent coating of the humidity sensor opening. The following table lists adhesive tapes which have been tested regarding pollution of the humidity sensor and are known to be suitable.Adhesive TapesManufacturer Product3M Electrical Tape 92Do not apply any other adhesive tapes such as Scotch Tape, Sello Tape, Tesa Film, etc. In conjunction with the sensor, use only recommended Kapton® tape Electrical Tape 92 by 3M™.Regarding adhesives and encapsulants the material in the following tables may be used –according to respective datasheets, applied and fully cured in well ventilated environment (fresh air supply). Materials and brands not listed in the following tables may be harmful and shall be tested carefully before applying.Epoxy AdhesivesManufacturer ProductEPO-TEK H70E/SEPO-TEK T6067EPO-TEK 93-86Lord MD-130Eccobond E3503-1Ablebond 84-3Epoxy Glob Top EncapsulantsManufacturer ProductStycast 50300 / 50400 seriesHysol EO1061/EO1062Silicone AdhesivesManufacturer ProductRTV 6424 (Momentive)Dow Corning 732Silicone Glob Top EncapsulantsManufacturer ProductStycast S 7503Instant AdhesivesManufacturer ProductLoctite 401PUR (Polyutherane) Casting Compounds Manufacturer ProductPeters VU 4457-61Hot melts may absorb water and thus may have an impact on the response time of the sensor in the device. Therefore, hot melt shall be applied sparingly.The sensor shall be mounted into the device, if possible, after all materials that are used in the assembly process have completely cured or dried out. Otherwise ensure good ventilation (fresh air supply) in curing ovens and assembly lines.Prevent any dust or particles from entering the sensor opening (sensor performance may be affected).Wear clean gloves or finger cots while handling the sensor and avoid touching the sensor opening.Ensure recommendations in this application note are equally considered during repair and rework of assemblies containing sensors. During repair and rework, it may be recommendable to cover the sensor with Kapton tape (specific recommendation see above). Be particularly careful when using strong cleaning agents (e.g. detergents, alcohols, brominated or fluorinated solvents). Cleaning any part of a product might lead to high concentration of cleaning agents on the sensor. Please remove any sensors or devices containing sensors before cleaning the production area and tools. Ensure good ventilation (fresh air supply) and that any solvents have evaporated before resuming production.Prevent sensor from exposure to cleaning agents. Application in extreme environment Some applications require the exposure of humidity and temperature sensors to harsh environments. In many of the cases the sensor is uncritical to be used. However, some precautions must be taken.For exposure to extreme conditions with regards to humidity and temperature please consult the datasheet 275%RH can conveniently be generated with saturated NaCl solution. of respective product. Please make sure that exposure time of the sensor to maximum range of operating conditions is limited as given in datasheet. Exposure to volatile organic compounds at high concentration and long exposure time is critical not only in assembly but also in the field. Such application needs to be carefully tested and qualified.Exposure to acids or bases may be critical, too. In order to be critical, the concentration must be such that polymers are attacked. For bases there is a rule of thumb that pH<9 are uncritical. Etching substances such as H2O2, NH3, etc. at high concentrations are critical to the sensor, too.Corrosive substances at very low concentrations are not critical to the sensor itself. However, they may attack the solder contacts. Therefore, the contacts must be well protected (passivated) in case of an application to such environment –compare also Section “Assembly”. Application of Sensirion humidity and temperature sensors to harsh environment must be carefully tested and qualified. Sensirion qualifies its humidity and temperature sensors to work properly within ambient clean air – qualification for use in harsh environment is duty of the user of the sensor. Reconditioning procedureAs stated above extreme conditions or exposure to solvent vapors may offset the sensor. The following reconditioning procedure may bring the sensor back to calibration state:Baking: 100 – 105°C at < 5%RH for 10hRe-Hydration: 20 – 30°C at ~ 75%RH for 12h 2. DisclaimerThe above given restrictions, recommendations, materials, etc. do not cover all possible cases and items. The material recommendations are given with regard to pollution of SHTxx sensors and assume optimal processing for avoiding VOC in process – the materials were not tested regarding other properties like reliability, performance, usability or mechanical properties. The material recommendations have been compiled with our best knowledge at the time of writing. Manufacturers may change the compounds without notice, which can lead to reduced Sensor performance due to outgassing.This document is not to be considered complete and is subject to change without prior notice.Revision historyImportant NoticesWarning, Personal InjuryDo not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing this product, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION shall be allegedly negligent with respect to the design or the manufacture of the product.ESD PrecautionsThe inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation, take customary and statutory ESD precautions when handling this product.See application note “ESD, Latchup and EMC” for more information.WarrantySENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product s hall be of the quality, material and workmanship defined in SENSIRION’s published specifications of the product. 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Recommended parameters can and do vary in different applications.SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improve reliability, functions and design of this product.Copyright© 2021, by SENSIRION. CMOSens® is a trademark of Sensirion. All rights reservedHeadquarters and SubsidiariesSensirion AG Laubisruetistr. 50CH-8712 Staefa ZH Switzerlandphone: +41 44 306 40 00 fax: +41 44 306 40 30 ****************** Sensirion Inc., USAphone: +1 312 690 5858*********************Sensirion Korea Co. Ltd.phone: +82 31 337 7700~3*********************/krSensirion Japan Co. Ltd.phone: +81 3 3444 4940*********************/jpSensirion China Co. Ltd.phone: +86 755 8252 1501*********************/cnSensirion Taiwan Co. Ltdphone: +886 3 5506701******************To find your local representative, please visit /distributors。
sht10工作原理
sht10工作原理温湿度传感器是一种广泛应用于工业自动化控制、环境监测、医疗器械、农业研究等领域的传感器。
通过测量环境中的温度和湿度,可以帮助我们了解环境条件,保障生产和生活的质量。
在这方面,SHT10温湿度传感器作为一种常用的传感器设备,其工作原理和应用十分重要。
SHT10温湿度传感器是瑞士Sensirion公司生产的一种数字式温湿度传感器,采用表面微机电系统(Surface Micro Electro-Mechanical System, S-MEMS)技术,具有高精度、长期稳定性、响应速度快等特点。
传感器内部集成了温度传感器和湿度传感器,通过数字接口可以方便地与微控制器等单片机设备进行通信。
SHT10传感器的工作原理主要包括湿度测量和温度测量两个部分。
在正常工作状态下,SHT10传感器会不断地采样环境中的温湿度数据,并将数据通过数字接口输出,供用户进行进一步的处理和分析。
SHT10温湿度传感器工作原理的详细解析如下:一、温度测量原理SHT10传感器内部集成了一颗高精度的热敏电阻,用来测量环境中的温度。
热敏电阻是一种阻值随温度变化的电阻元件,其阻值随温度的变化规律可以通过热敏电阻的特性曲线来描述。
SHT10传感器内部的热敏电阻是一种硅微机电元件,其阻值随温度的变化规律符合斯特恩-沃尔什定律,即在绝对温标下热敏电阻的阻值与温度成指数关系。
这种特性使得SHT10传感器可以通过测量热敏电阻的阻值变化来准确地计算环境中的温度。
SHT10传感器的温度测量原理主要可以分为以下几个步骤:1. 看电阻温度传感器的表面微机电系统技术:SHT10传感器内部的热敏电阻通过表面微机电系统技术制作成微小的敏感元件,能够高灵敏地反映环境温度的变化。
2. 采样环境温度:SHT10传感器通过热敏电阻感知环境中的温度,并将感知到的温度转换为相应的电信号。
3. 转换为数字信号:传感器内部的模数转换电路将温度转换的模拟信号转换为数字信号,以便于后续处理和通信。
SHT10温湿度检测设计要点及故障分析
引言SHT1x 系列属于Sensorion 传感器家族中的贴片封装系列。
传感器将传感元件和信号处理电路集成在一块微型电路板上,输出完全标定的数据信号。
传感器采用专利的CMOSens 技术,确保产品具有极高的可靠性与卓越的长期稳定性。
传感器包括一个电容聚合体测湿敏感元件、一个能隙材料制成的测温元件,并在同一芯片上,与14位的A/D 转换及串行接口电路实现无缝连接。
因此,该产品具有品质卓越、响应迅速、抗干扰能力强、性价比高等优点,广泛应用于化工、机械、家电等温度及湿度的测量中[1]。
1 SHT10温湿度检测设计要点《开发使用SHTxx 温湿度传感器注意事项》之中提到了包装、运输、焊接、防静电的要求,以及编程使用中应该注意的问题[2],都是设计开发要注意的事项,下面结合空调机组SHT10温湿度检测板的开发过程,分别从安装、硬件、软件方面总结设计要点。
1.1 SHT10温湿度检测板安装设计要点SHT10温湿度检测板安装在空调机组上长期运行,如不进行防尘处理,灰尘积聚在SHT10传感器上,会影响检测精度;冷凝水积聚在检测板上,会造成主板氧化受潮,导致主板失效。
SHT10温湿度检测板安装时注意垂直安装,防止板上积水造成SHT10温湿度检测设计要点及故障分析缪玉珍(珠海格力电器股份有限公司制冷技术研究院 珠海 519070)氧化。
主板在生产时要刷防潮胶进行防护,防止主板在潮湿环境下氧化。
1.2 SHT10温湿度检测板硬件设计要点SHT10温湿度检测板硬件设计要注意在电源处加电容进行滤波去耦,在SHT10传感器的四周开槽隔热,同时也要注意上拉电阻的使用[1]。
规格书上要求数据线DATA 上接10~20K 的上拉电阻,用示波器观察SHT10工作正常,每次发送温度及湿度测试命令,都有数据回传。
在EMC 测试中,却出现不能读到温度及湿度测试数据,报“回风探头故障”,有时能自动恢复,有时不能自动恢复。
用示波器观察EMC 测试中的DATA 与SCK 波形,发现时钟SCK 信号的脉冲输出不全,导致SHT10的I 2C 通讯不正常。