APD3224PBC中文资料

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MAX322CPA+中文资料

_______________General DescriptionThe MAX320/MAX321/MAX322 are precision, dual,SPST analog switches designed to operate from ±3V to ±8V dual supplies. The MAX320 has two normally open (NO) switches and the MAX321 has two normally closed (NC) switches. The MAX322 has one NO and one NC switch. Low power consumption (1.25mW)makes these parts ideal for battery-powered equip-ment. They offer low leakage currents (100pA max) and fast switching speeds (t ON = 150ns max, t OFF = 100ns max).The MAX320 series, powered from ±5V supplies, offers 35Ωmax on-resistance (R ON ), 2Ωmax matching between channels, and 4Ωmax R ON flatness.These switches also offer 5pC max charge injection and a minimum of 2000V ESD protection per Method 3015.7.For equivalent devices specified for single-supply oper-ation, see the MAX323/MAX324/MAX325 data sheet.For quad versions of these switches, see the MAX391/MAX392/MAX393 data sheet.________________________ApplicationsBattery-Operated Systems Sample-and-Hold Circuits Heads-Up Displays Guidance and Control Systems Audio and Video Switching Military RadiosTest Equipment Communications Systems ±5V DACs and ADCsPBX, PABX____________________________Featureso Low On-Resistance, 35Ωmax (16Ωtypical)o R ON Matching Between Channels <2Ωo R ON Flatness <4Ωo Guaranteed Charge Injection <5pC o Bipolar Supply Operation (±3V to ±8V)o Low Power Consumption, <1.25mW o Low Leakage Current Over Temperature, <2.5nA at +85°C o Fast Switching, t ON <150ns, t OFF <100ns o Guaranteed Break-Before-Make (MAX322 only)______________Ordering InformationMAX320/MAX321/MAX322Precision, Dual-Supply, SPSTAnalog Switches________________________________________________________________Maxim Integrated Products 1_____________________Pin Configurations/Functional Diagrams/Truth TablesCall toll free 1-800-998-8800 for free samples or literature.19-0350; Rev 0; 12/94* Contact factory for dice specifications.** Contact factory for availability.Voltage Referenced to V-V+................................................................(V- - 0.3V) to +17V IN_, COM_, NC_, NO_ (Note 1).........(V- - 0.3V) to (V+ + 0.3V)Continuous Current (any terminal)......................................30mA Peak Current, COM_, NO_, NC_(pulsed at 1ms, 10% duty cycle max)..............................100mA ESD per Method 3015.7..................................................>2000V Continuous Power DissipationPlastic DIP (derate 9.09mW/°C above +70°C).............727mW Narrow SO (derate 5.88mW/°C above +70°C).............471mWµMAX (derate 4.10mW/°C above +70°C).....................330mW CERDIP (derate 8.00mW/°C above +70°C)..................640mW Operating Temperature RangesMAX32_C_ _........................................................0°C to +70°C MAX32_E_ _......................................................-40°C to +85°C MAX32_MJA...................................................-55°C to +125°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10sec).............................+300°CM A X 320/M A X 321/M A X 322Precision, Dual-Supply, SPST Analog Switches 2_______________________________________________________________________________________Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ABSOLUTE MAXIMUM RATINGSNote 1:Signals on NC_, NO_, COM_, or IN_ exceeding V+ or V- are clamped by internal diodes. Limit forward diode current tomaximum current rating.ELECTRICAL CHARACTERISTICS(V+ = +5V ±10%, V- = -5V ±10%, V INH = 3.5V, V INL = 2.5V, T A = T MIN to T MAX , unless otherwise noted.)MAX320/MAX321/MAX322Precision, Dual-Supply, SPSTAnalog Switches_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS(V+ = +5V ±10%, V- = -5V ±10%, V INH = 3.5V, V INL = 2.5V, T A = T MIN to T MAX , unless otherwise noted.)Note 2:The algebraic convention where the most negative value is a minimum and the most positive value a maximum is used in this data sheet.Note 3:Guaranteed by design.Note 4:∆R ON = ∆R ON max - ∆R ON min.Note 5:Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal range.Note 6:Leakage parameters are 100% tested at maximum rated hot temperature and guaranteed by correlation at +25°C.Note 7:Off Isolation = 20 log 10[ V COM ⁄ (V NC or V NO )], V COM = output, V NC or V NO = input to off switch.Note 8:Between any two switches.M A X 320/M A X 321/M A X 322Precision, Dual-Supply, SPST Analog Switches 4_________________________________________________________________________________________________________________________________Typical Operating Characteristics(V+ = +5V, V- = -5V, T A = +25°C, unless otherwise noted.)0.0001-556585OFF LEAKAGE CURRENT vs. TEMPERATURE10TEMPERATURE (°C)O F F L E A K A G E C U R R E N T (n A )-1552545-351051250.10.00110.011000-8-602ON-RESISTANCE vs. VOLTAGE AT COM PIN30V COM (V)R O N (Ω)-4-24682052510150-5-3-4-234ON-RESISTANCE vs. VOLTAGE AT COM PIN(OVER TEMPERATURE)30V COM (V)R O N (Ω)-11252052515100-5-1ON-RESISTANCE MATCH vs. VOLTAGE AT COM PIN (OVER TEMPERATURE)V COM (V)∆R O N (Ω)130.300.350.100.050.400.450.200.250.150.505-30.0001-556585ON LEAKAGE CURRENT vs. TEMPERATURE10TEMPERATURE (°C)O N L E A K A G E C U R R E N T (n A )-1552545-351051250.10.00110.011000-556585SUPPLY CURRENT vs. TEMPERATURE100120M A X 320-07TEMPERATURE (°C)I S U P P L Y (µA )2545-35-15510512580204060140-20-5CHARGE INJECTION vs. VOLTAGE AT COM PIN15M A X 320-06V COM (V)Q (p C )-1050-15105-10-520-4-3-21234MAX320/MAX321/MAX322Precision, Dual-Supply, SPSTAnalog Switches_______________________________________________________________________________________5__________Applications InformationLogic LevelsCalculate the logic thresholds typically as follows: V IH =(V+ - 1.5V) and V IL = (V+ - 2.5V).Power-supply consumption is minimized when IN1 and IN2 are driven with logic-high levels equal to V+ and logic-low levels well below the calculated V IL of (V+ - 2.5V). IN1and IN2 can be driven to V- without damage.Analog Signal LevelsAnalog signals that range over the entire supply voltage (V- to V+) can be switched, with very little change in on-resistance over the entire voltage range (see Typical Operating Characteristics ). All switches are bidirec-tional, so NO_, NC_, and COM_ pins can be used as either inputs or outputs.Power-Supply Sequencing and Overvoltage ProtectionDo not exceed the absolute maximum ratings, because stresses beyond the listed ratings may cause perma-nent damage to the devices.Proper power-supply sequencing is recommended for all CMOS devices. Always apply V+, followed by V-,before applying analog signals or logic inputs, especial-ly if the analog or logic signals are not current-limited. Ifthis sequencing is not possible, and if the analog or logic inputs are not current-limited to <30mA, add two small signal diodes (D1, D2) as shown in Figure 1.Adding protection diodes reduces the analog signal range to a diode drop (about 0.7V) below V+ for D1,and a diode drop above V- for D2. Leakage is not affected by adding the diodes. On-resistance increas-es by a small amount at low supply voltages. Maximum supply voltage (V- to V+) must not exceed 17V.Adding protection diode D1 causes the logic thresh-olds to be shifted relative to the positive power-supply rail. This can be significant when low positive supply voltages (+5V or less) are used. Driving IN1 and IN2 all the way to the supply rails (i.e., to a diode drop higher than the V+ pin or a diode drop lower than the V- pin) is always acceptable.The protection diodes D1 and D2 also protect against some overvoltage situations. With the circuit of Figure 1,if the supply voltage is below the absolute maximum rating and if a fault voltage up to the absolute maximum rating is applied to an analog signal pin, no damage will result. For example, with ±5V supplies, analog sig-nals up to ±8.5V will not damage the circuit of Figure 1.If only a single fault signal is present, the fault voltage can rise to +12V or to -12V without damage._____________________Pin DescriptionFigure 1. Overvoltage Protection Using Two External Blocking DiodesM A X 320/M A X 321/M A X 322Precision, Dual-Supply, SPST Analog Switches 6_______________________________________________________________________________________Figure 4. Charge InjectionFigure 2. Switching TimeFigure 3. Break-Before-Make Interval (MAX322 only)______________________________________________Test Circuits/Timing DiagramsMAX320/MAX321/MAX322Precision, Dual-Supply, SPSTAnalog Switches_______________________________________________________________________________________7Figure 6. Crosstalk_________________________________Test Circuits/Timing Diagrams (continued)Figure 8. Channel-On CapacitanceFigure 7. Channel-Off Capacitance__Ordering Information (continued)___________________Chip Topography0.075" (1.90mm)0.055" (1.40mm)V+ IN2V-IN1COM2NO2 (MAX320) NC2 (MAX321/2)COM1NO1 (MAX320/2) NC1 (MAX321)* Contact factory for dice specifications.** Contact factory for availability.TRANSISTOR COUNT: 91SUBSTRATE CONNECTED TO V+M A X 320/M A X 321/M A X 322Precision, Dual-Supply, SPST Analog Switches________________________________________________________Package Informationimplied. Maxim reserves the right to change the circuitry and specifications without notice at any time.8___________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©1994 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.。

PSL-646U线路保护测控装置(多合一)技术说明书_V3.00_印刷

* 本说明书可能会被修改，请注意核对实际产品与说明书的版本是否相符 * 2015 年 05 月第 1 版第 1 次印刷 * 国7.04 修改日期
目录
版本声明 1. 概述 ............................................................................................................................................................ 1
国电南自 DL/T 1075-2007
PSL-646U 线路保护测控装置（多合一）
技术说明书
国电南京自动化股份有限公司 GUODIAN NANJING AUTOMATION CO.，LTD
PSL-646U 线路保护测控装置
技术说明书（多合一）
V 3.00 国电南京自动化股份有限公司
2015 年 3 月
版本声明
z 本说明书适用于 PSL-646U 线路保护测控装置(多合一)。保护的设计标准引用了国网公司 Q／GDW 766 -2014《10kV～110（66）kV 线路保护及辅助装置标准化设计规范》。
z 本说明书适用于 PSL-646U 线路保护测控装置(多合一)V3.00 及以上版本的保护软件。
1.1. 保护功能配置 ...................................................................................................................................... 1 1.2. 测控功能配置 ..............................................

LM324D中文资料

ORDERING INFORMATIONQUAD OPERATION AMPLIFIERSLM324 is consists of four independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single power supply over a wide voltage range.Operation from split power supplies is also possible so long as the difference between the two supplies is 3 volts to 32 volts voltage.Application areas include transducer amplifier, DC gain blocks and all the conventional OP amp circuits which now can be easily implemented in single power supply systems.EQUIMMENT CIRCUITHTCDevice Package LM324D 14 SOP LM324N 14 DIPFor more information, or to purchase call E.C.C. Inc @ 1-800-214-8769ABSOLUTE MAXIMUM RATINGSCHARACTERISTIC Power Supply Voltage Differential Input Voltage Input VoltageOutput Short Circuit to GND V CC •15V T A =25• (One Amp)Power DissipationOperating Temperature Range Storage Temperature RangeElectrical characterisitics at specified free-air temperature, V CC =5V(unless otherwise noted)V IOV CC =5V to MAX, Input Offset VoltageV IC =V ICR MIN, V O =1.4VV IOAverage Temperature Coefficient of Input Offset Voltage I IOInput Offset Current lloAverage Temperature Coefficient of Input Offset Current I IBInput Bias Current V ICRCommon-Mode Input Voltage RangeR L •2•V OHV CC =MAX, R L =2• High-Level Output Voltage V CC =MAX, R L •10• V OLLow-Level Output Voltage A VDV CC =15V, Large-Signal Differential V O =1V to 11V, Voltage Amplification R L •2•CMRRV CC =5V to MAX, Common-Mode Rejection Ratio VIC=VICR MIN, K SVR Supply Voltage Rejection Ratio( V CC / V IO ) V 01/V 02Crosstalk AttenuationV CC =15V,V ID =1V, V O =0I O V CC =15V,Output CurrentV ID =1V, V O =15V V ID =1V, V O =200• I OSV CC at 5V, Short-Circuit Output CurrentGND at -5V, V O =0 I CC V O -2.5V, No LoadSupply Current (Four Amplifiers) V CC =MAX, V O =0.5V CC , No loadotherwise specified <<MAX>> V CC for testing purpose is 30V. Full range is 0• to 70•.HTCFor more information, or to purchase call E.C.C. Inc @ 1-800-214-8769V Continuous SYMBOL VALUE UNIT V V CC ±18 or 32V V I-0.3 to +32V I(DIFF)32T OPR 0~+70•P D 570•T STG-65 to +150•PARAMETER*TEST CONDITIONSLM324D UNIT MINTYP MAX •Full Range 925•37Full Range7•/•V O =1.4V25•250•Full Range 150Full Range10•/•V O =1.4V 25•-20-250•Full Range-500V CC =5V to MAX 25•0toV CC -1.5Full Range 0toV CC -2VV 2825• R L •10•Full RangeFull Range 27V CC -1.5Full Range 26520•25•25100V/•Full Range1525•6580• V CC =5V to MAX 25•65100• f=1 kHz to 20kHz25•120•25•-20-30•Full Range -1025•1020Full Range 525•123025•±40±60•Full Range 0.7 1.2•Full Range 1.13HTC For more information, or to purchase call E.C.C. Inc @ 1-800-214-8769HTC For more information, or to purchase call E.C.C. Inc @ 1-800-214-8769。

19032中文说明书

1. 1.1 1.2
2.
3.
4. 4.1 4.2 4.3 4.4 4.5
4.5.1 4.5.2 4.5.3
4.6
4.6.1 4.6.2
4.7
4.7.1 4.7.2
4.8
4.8.1 4.8.2 4.8.3
4.9 4.10 4.11 4.12 4.13
5. 5.1 5.2
5.2.1 5.2.2 5.2.3 5.2.4 5.2.5
讀取記憶體................................................................................................................ 4-8 儲存記憶體................................................................................................................ 4-8 刪除記憶體................................................................................................................ 4-8
測試參數 (PROGRAM) 設定 ....................................................................4-10
操作方式.................................................................................................................. 4-10 各項參數設定資料說明.......................................................................................... 4-10

爱莫斯迪PDG32G0400E5WJ电源防御铆封电路保护器说明书

Eaton PDG32G0400E5WJEaton Power Defense molded case circuit breaker, Globally Rated, Frame 3, Two Pole, 400A, 35kA/480V, PXR20 ARMS LSIG w/ Modbus RTU, ZSI and Relays, Standard Line and Load (PDG3X2TA400)General specificationsEaton Power Defense molded case circuit breakerPDG32G0400E5WJ 786679451915109.1 mm 257.1 mm 138.9 mm 5.2163 kg Eaton Selling Policy 25-000, one (1) year from the date of installation of theProduct or eighteen (18) months from thedate of shipment of the Product,whichever occurs first.RoHS Compliant CSAIEC 60947-2CCC MarkedUL 489Product NameCatalog Number UPCProduct Length/Depth Product Height Product Width Product Weight WarrantyCompliancesCertifications400 AComplete breaker 3Two-polePD3 Global Class A PXR 20 LSIG w/ARMSModbus RTU600 Vac600 VStandard Line and Load35 kAIC at 480 Vac 10 kAIC Icu @250 Vdc 65 kAIC @240V (UL)400 AEaton Power Defense MCCB PDG32G0400E5WJ 3D drawing Power Xpert Protection Manager x32Consulting application guide - molded case circuit breakers Power Xpert Protection Manager x64Amperage Rating Circuit breaker frame type Frame Number of poles Circuit breaker type Class Trip TypeCommunication Voltage rating Voltage rating - max TerminalsInterrupt rating Interrupt rating range Trip rating 3D CAD drawing packageApplication notesBrochuresStrandAble terminals product aidPower Defense technical selling bookletPower Defense molded case circuit breaker selection posterPower Defense brochureCatalogsMolded case circuit breakers catalogPower Xpert Release trip units for Power Defense molded case circuit breakersCertification reportsPDG3 45-400A CB reportPDG3 CSA certification 100-400aPDG3 CSA certification 250-600aPDG3 UL authorization 100-400aPDG3 UL authorization 250-600a TMTUPDG3B 450A-600A CB reportEU Declaration of Conformity - Power Defense molded case circuit breakersInstallation instructionsPower Defense Frame 1-2-3-4 IP door barrier assembly instructions - IL012278ENPower Defense Frame 3 interphase barrier - IL012229EN H03 Power Defense Frame 3 plug-in adapter installation instructions -IL012311ENPower Defense Frame 3 multi-tap terminal kit Cat NumPDG3X3(2)(4)TA6006W Instructions - IL012248ENPower Defense Frame 3 multi wire connector kit -PDG3X3(2)(4)TA4006W and PDG3X3(2)(4)TA4003W instructions-IL012247EN H01Power Defense Frame 4 locking devices and handle block instructions - IL012151ENPower Defense Frame 3 locking devices and handle block instructions - IL012150ENPower Defense Frame 3 handle mech direct rotary handle instructions - IL012111ENPower Defense Frame 3 reverse feed connector kit Cat NumPDG3X3(2)(4)TA400HRF instructions - IL012252ENPower Defense Frame 3 rear connection installation instructions -IL012300ENPower Defense Frame 3 terminal spreader assembly instructions -IL012301ENPower Defense Frame 2/3/4/5/6 voltage neutral sensor module wiringinstructions – IL012316ENPower Defense Frame 3 Breaker Instructions (IL012107EN).pdfPower Defense Frame 3 shunt trip UVR instructions - IL012140EN Power Defense Frame 3 extendable shaft rotary handle mech -IL012112ENPower Defense Frame 3 adapter kit installation instructions LZM3 to PD3 - IL012227ENPower Defense Frame 3 box terminal installation instructions -IL012299ENPower Defense Frame 3 multi-tap terminal kit Cat NumPDG3X3(2)(4)TA6006WSW instructions - IL012250ENPower Defense Frame 3 reverse feed connector kit Cat NumPDG3X3(2)(4)TA630RF instructions - IL012253ENPower Defense Frame 3 trip unit replacement instructions - IL012157EN Power Defense Frame 3 terminal kit Cat Num PDG3X3(2)(4)TA400RF instructions - IL012251ENPower Defense Frame 4 shunt trip UVR instructions - IL012129EN Power Defense Frame 3 Direct Rotary Handle Assy With Interlock Version Instructions (IL012139EN).pdfPower Defense Frame 3 Aux, Alarm, ST and UVR Animated Instructions.rh Power Defense Frame 3 finger protection assembly installation instructions - IL012279ENPower Defense Frame 4 reverse feed connector kit instructions for PDG4X3(2)(4)TA800RF instructions - IL012254ENInstallation videosPower Defense Frame 3 Handle Mech Variable Depth Rotary Handle Animated Instructions.rhPower Defense Frame 3 Shunt Trip_UVR Animated Instructions.pdf.rh Power Defense Frame 3 Handle Mech Direct Rotary Handle Animated Instructions.rhPower Defense Frame 3 trip unit replacement animated instructions.rh Power Defense Frame 3 Locking Devices and Handle Block Animated Instructions.pdf.rhMultimediaPower Defense Frame 3 Aux, Alarm, Shunt Trip, and UVR How-To Video Power Defense Frame 5 Trip Unit How-To VideoPower Defense Frame 3 Variable Depth Rotary Handle Mechanism Installation How-To VideoPower Defense Frame 6 Trip Unit How-To VideoPower Defense Frame 2 Variable Depth Rotary Handle Mechanism Installation How-To VideoPower Defense molded case circuit breakersEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaEaton Power Defense for superior arc flash safety Power Defense Breakers Eaton Specification Sheet - PDG32G0400E5WJ Power Defense time current curve Frame 3 - PD3Intelligent circuit protection yields space savings Single and double break MCCB performance revisited Intelligent power starts with accurate, actionable data Making a better machineMolded case and low-voltage power circuit breaker healthImplementation of arc flash mitigating solutions at industrial manufacturing facilitiesMolded case and low-voltage breaker health Safer by design: arc energy reduction techniquesSpecifications and datasheetsTime/current curvesWhite papers。

PMEM4020APD,115;中文规格书,Datasheet资料

1.Product proﬁle1.1General descriptionCombination of a PNP transistor with low V CEsat and high current capability and a planar Schottky barrier rectiﬁer with an integrated guard ring for stress protection in a SOT457(SC-74) small plastic package. NPN complement: PMEM4020AND1.2FeaturesI 600 mW total power dissipation I High current capability up to 2 AI Reduces printed-circuit board area required I Reduces pick and place costs I Small plastic SMD package ITransistorN Low collector-emitter saturation voltage I DiodeN Ultra high-speed switching N Very low forward voltage N Guard ring protected1.3ApplicationsI DC-to-DC converters I Inductive load driversI General purpose load driversI Reverse polarity protection circuits IMOSFET drivers1.4Quick reference dataPMEM4020APDPNP transistor/Schottky rectiﬁer moduleRev. 02 — 31 August 2009Product data sheetTable 1.Quick reference data Symbol ParameterConditions Min Typ Max Unit PNP transistorV CEO collector-emitter voltage open base --−40V I Ccollector current (DC)continuous;T s ≤ 55°C[1]--−2A[1]Soldering point of collector or cathode tab.2.Pinning information3.Ordering information4.Marking5.Limiting valuesSchottky barrier rectiﬁerV R continuous reverse voltage --40V I Fcontinuous forward current--1ATable 1.Quick reference data …continued Symbol ParameterConditionsMin Typ Max Unit Table 2.Discrete pinningPin Description Simpliﬁed outline Symbol1emitter 2not connected 3cathode 4anode 5base 6collector132456sym04036145Table 3.Ordering informationType numberPackage NameDescriptionVersion PMEM4020APDSC-74plastic surface mounted package; 6 leadsSOT457Table 4.MarkingType number Marking code PMEM4020APDD3Table 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit PNP transistorV CBO collector-base voltage open emitter -−40V V CEO collector-emitter voltage open base -−40V V EBOemitter-base voltageopen collector-−5V[1]Mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.[2]Device mounted on a printed-circuit board, single-sided copper, tin-plated, 1cm 2 mounting pad for both collector and cathode.[3]Mounted on a ceramic printed-circuit board, single-sided copper, tin-plated, standard footprint.[4]Soldering point of collector or cathode tab.I Ccollector current (DC)continuous [1]-−0.75A continuous [2]-−1A continuous [3]-−1.3A continuous;T s ≤ 55°C[4]-−2A I CM peak collector current -−3A I BM peak base current -−1A P tottotal power dissipationT amb ≤ 25°C [1]-295mW T amb ≤ 25°C [2]-400mW T amb ≤ 25°C [3]-500mW T s ≤ 55°C[4]-1000mW T j junction temperature -150°C Schottky barrier rectiﬁerV R continuous reverse voltage -40V I F continuous forward voltage -1A I FRM repetitive peak forward currentt p ≤ 1 ms;δ≤ 0.5- 3.5A I FSM non-repetitive peak forward currentt = 8 ms; square wave -10A P tottotal power dissipationT amb ≤ 25°C [1]-295mW T amb ≤ 25°C [2]-400mW T amb ≤ 25°C [3]-500mW T s ≤ 55°C[4]-1000mW T j junction temperature [2]-150°C Combined deviceP tot total power dissipation T amb ≤ 25°C[2]-600mW T stg storage temperature −65+150°C T ambambient temperature[2]−65+150°CTable 5.Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit6.Thermal characteristics[1]For Schottky barrier rectiﬁers thermal run-away has to be considered, as in some applications the reverse power losses P R are a signiﬁcant part of the total power losses. Nomograms for determining the reverse power losses P R and I F(AV) rating will be available on request.[2]Soldering point of collector or cathode tab.[3]Mounted on a ceramic printed-circuit board, single-sided copper, tin-plated, standard footprint.[4]Device mounted on a printed-circuit board, single-sided copper, tin-plated, 1cm 2 mounting pad for both collector and cathode tab.[5]Mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.Table 6.Thermal characteristics [1]Symbol Parameter Conditions Min Typ Max Unit Single device R th(j-s)thermal resistance from junction to soldering point in free air [2]--95K/W R th(j-a)thermal resistance from junction to ambientin free air[3]--250K/W [4]--315K/W [5]--425K/W Combined device R th(j-a)thermal resistance from junction to ambientin free air[3]--208K/W7.Characteristics[1]Pulse test: t p ≤ 300µs;δ≤ 0.02Table 7.CharacteristicsT amb = 25°C unless otherwise speciﬁed Symbol ParameterConditionsMin Typ Max Unit PNP transistorI CBOcollector-base cut-off current V CB =−40 V; I E = 0 A --−100nA V CB =−40 V; I E = 0 A;T j = 150°C--−50µA I CEO collector-emitter cut-off current V CE =−30 V; I B = 0 A --−100nA I EBO emitter-base cut-off current V EB =−5 V; I C = 0 A --−100nAh FEDC current gainV CE =−5 V; I C =−1 mA 300--V CE =−5 V; I C =−100 mA 300--V CE =−5 V; I C =−500 mA 250-900V CE =−5 V; I C =−1 A 160--V CE =−5 V; I C =−2 A[1]50--V CEsatcollector-emitter saturation voltageI C =−100 mA; I B =−1 mA --−120mV I C =−500 mA; I B =−50 mA --−145mV I C =−1 A; I B =−100 mA --−260mV I C =−2 A; I B =−200 mA--−530mV R CEsat equivalent on-resistance I C =−1 A; I B =−100 mA [1]-180280m ΩV BEsat base-emittersaturation voltage I C =−1 A; I B =−100 mA [1]--−1.1V V BEon base-emitter turn-on voltageV CE =−5 V; I C =−1 A [1]--−1.0V f T transition frequency V CE =−10 V; I C =−50 mA;f = 100 MHz150--MHz C ccollector capacitanceV CB =−10 V; I E = i e = 0 A;f = 1 MHz --10pFSchottky barrier rectiﬁer V Fcontinuous forward voltagesee Figure 1I F = 0.1 mA [1]-95130mV I F = 1 mA [1]-155210mV I F = 10 mA [1]-220270mV I F = 100 mA [1]-295350mV I F = 1000 mA[1]-540640mV I Rreverse currentsee Figure 2V R = 10 V [1]-720µA V R = 40 V[1]-30100µA C ddiode capacitanceV R = 1 V; f = 1 MHz;see Figure 3-4348pFSchottky barrier rectiﬁer (1)T amb =150°C (2)T amb =85°C (3)T amb =25°CSchottky barrier rectiﬁer (1)T amb =150°C (2)T amb =85°C (3)T amb =25°CFig 1.Forward current as a function of forward voltage; typical valuesFig 2.Reverse current as a function of reverse voltage; typical valuesSchottky barrier rectiﬁer;T amb = 25°C; f = 1 MHzPNP transistor;V CE =−5 V (1)T amb = 150°C (2)T amb = 25°C (3)T amb =−55°CFig 3.Diode capacitance as a function of reverse voltage; typical valuesFig 4.DC current gain as a function of collector current; typical values0.60.40.2010310210110−1mdb669I F (mA)V F (V)(1)(2)(3)020103040V R (V)mdb670105104103102101I R (µA)(1)(2)(3)05102010008015604020mdb671V R (V)C d (pF)012002004006008001000mhc088−10−1h FE −10−1I C (mA)−102−103−104(1)(2)(3)PNP transistor;V CE =−5 V (1)T amb =−55°C (2)T amb = 25°C (3)T amb = 150°CPNP transistor;I C /I B = 10(1)T amb = 150°C (2)T amb = 25°C (3)T amb =−55°CFig 5.Base-emitter voltage as a function of collector current; typical valuesFig 6.Collector-emitter saturation voltage as a function of collector current; typical valuesPNP transistor;I C /I B = 10(1)T amb = 150°C (2)T amb = 25°C (3)T amb =−55°CPNP transistor;V CE =−10 VFig 7.Equivalent on-resistance as a function of collector current; typical valuesFig 8.Transition frequency as a function of collector current−10−1−10−1mhc089−10−1−1−10V BE (V)I C (mA)−103−102−104(1)(2)(3)−103−102−10−1mhc090−1−10V CEsat (mV)I C (mA)−102−103−104(1)(2)(3)10110−1102mhc091−10−1−1−10R CEsat (Ω)I C (mA)−103−102−104(1)(2)(3)0−100030010020025050150−200−400f T (MHz)I C (mA)−600−800mhc0928.Application informationFig 9.DC-to-DC converterFig 10.Inductive load driver (relays, motors andbuzzers) with free-wheeling diodemgu866V OUTV INCONTROLLERmgu867V CCIN9.Package outlineFig 11.Package outline SOT457 (SC-74)REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDECJEITA SOT457SC-74w BM b pD epin 1indexAA 1L pQdetail XH EE v M AA B yscalecX13245601 2 mmPlastic surface-mounted package (TSOP6); 6 leadsSOT457UNIT A 1b p c D E H E L p Q y w v mm0.10.0130.400.253.12.70.260.101.71.3e 0.953.02.50.20.10.2DIMENSIONS (mm are the original dimensions)0.60.20.330.23A 1.10.905-11-0706-03-1610.Packing informationTable 8.Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]Type number Package Description Packing quantity300010000 PMEM4020APD SOT457 4 mm pitch, 8 mm tape and reel; T1-115-1354 mm pitch, 8 mm tape and reel; T2-125-165 [1]For further information and the availability of packing methods, see Section13.分销商库存信息: NXPPMEM4020APD,115。

APD3224PBCA-F01;中文规格书,Datasheet资料

Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V.
Absolute Maximum Ratings at TA=25°C
Parameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature
3.2x2.4mm SMD CHIP LED LAMP
Part Number: APD3224PBC/A-F01 Blue
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
Features
Description
The Blue source color devices are made with InGaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded.
Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Blue 120 30 100 5 -40°C To +85°C -40°C To +85°C

APD-320G064中文资料

320 x 64 Full Field Pixel Pitch: 0.066 [1.68] Vertical 0.064 [1.63] Horizontal 0.148 [3.76] Mountng Holes (8) Pixel Size: 0.040 [1.02] Diameter 0.40 21.616 [549.05] [10.16] 5.478 4.198 5.778 [139.14] [106.63] [146.76] 0.150 [3.81] 0.54 [13.72] 0.83 0.150 [21.08] [3.81]
1.30 [33.02] Max. Pin #1 of P2 0.800 [20.32] Max. Component Height
....... ....... ....
0.35 ± 0.02 [8.89 ± 0.51]
Vil * Recommended operating voltages. All maximums are absolute maximum.
FEATURES
• TTL level video interface • On board DC converter • Slim profile • Large, bright characters and graphics • Highly visible for long distance viewing The APD-320G064 DC Plasma display offers viewing qualities designers seek such as high contrast, viewing angle of 150° minimum, and long distance readability. It is bright (50 foot lamberts minimum) with characters and graphics figures presented in a pleasing neon orange color against a black background. Plasma is much more readable and eye-pleasing than liquid crystal or vacuum fluorescent displays and is filterable to red, amber, or neutral density. These plasma display panels are driven in a standard row - column refresh method much like a CRT display. The designer need only supply TTL level signals for SERIAL DATA, DOT CLOCK, COLUMN LATCH, ROW DATA, ROW CLOCK and DISPLAY ENABLE. The SERIAL DATA is entered with the DOT CLOCK up to frequencies as high as 8mHz. After a row of 320 pixels is clocked in, the COLUMN LATCH signal is toggled and the data is latched. At the time the data is latched, the display is briefly disabled using the DISPLAY ENABLE signal, then the row pointer is advanced with the ROW CLOCK signal. Once each frame the ROW DATA must be asserted to synchronize the column serial data with the beginning row. The recommended scanning frequency is approximately 70 Hz but may be as high as 200 Hz. The high clock rate on the data clock allows for rapid refresh and maximum access time to the refresh ram.

施耐德宝光微机保护产品选型手册说明书

Schneider Baoguang关于施耐德宝光施耐德（陕西）宝光电器有限公司（简称SSBEA或施耐德宝光）是施耐德电气有限公司与陕西宝光集团有限公司共同组建的一家专业从事中、系统及相关产品研发、生产和销售的中外合资企业。

高新科技园区。

在世界五百强企业与中国中压电器龙头企业的通力合作下，作为国内中压行业著名的“宝光”品牌真空断路器的唯一合法生产商，施耐德宝光秉承精益生产科学理念，凭借品质过硬、安全可靠的全系列高品质产品和覆盖用户全生命周期的完善服务，帮助用户实现卓越的生产运营绩效和市场竞争力，用品质的“不妥协”实现可持续发展之道。

我们致力于将施耐德宝光打造成为中国卓越和高效的中压断路器和系统的制造平台，依托自身的专业优势，为广大用户和合作伙伴提供领先的总成本和长期全面的安心保障。

目录V5系列新一代微机保护测控装置 (1)产品概述 (1)产品特点 (2)型号及功能说明 (3)保护功能 (4)测控功能 (6)技术参数 (7)典型接线图 (8)外形尺寸及面板开孔尺寸 (11)V5订货选型表 (12)V3系列微机保护测控装置 (13)产品概述 (13)产品特点 (14)型号及功能说明 (15)保护功能 (16)测控功能 (17)技术参数 (18)典型接线图 (19)外形尺寸及面板开孔尺寸 (21)V3订货选型表 (22)V3U微机综合保护装置 (23)产品概述 (23)型号及功能说明 (24)保护功能 (25)测控功能 (26)技术参数 (27)外形尺寸图/典型接线图 (28)后台系统 (29)系统总体结构 (30)V5系列新一代微机保护测控装置是一种用于测量、控制、保护、通讯一体化的智能设备，产品主要用于工业及能源领域对线路、变压器、电动机及电容器的保护测控。

此产品外观时尚、结构精巧、大屏幕液晶显示，图形化中文菜单，四位方向导航盘，操作快捷方便。

内部基于SOC芯片软件方案，32位处理器，并根据硬件进行深度改良优化的嵌入式操作系统，使CPU运行效率更高。

LM324中文资料_数据手册_参数

LM324，LM324A，LM224，LM2902，LM2902V，NCV2902订购信息设备包工作温度范围运输 LM224D SO-14 55个单位/铁路 LM224DR2 SO-14 2500磁带和卷轴 LM224DTB TSSOP-14 -25 °至+ 85°C 96个单位/铁路 LM224DTBR2 TSSOP-14 5 O 85 C 2500磁带和卷轴 LM224N PDIP-14 25个单位/铁路 LM324D SO-14 55个单位/铁路 LM324DR2 SO-14 2500磁带和卷轴 LM324DTB TSSOP-14 96个单位/铁路 LM324DTBR2 TSSOP-14 2500磁带和卷轴 LM324N PDIP-14 0 °至+ 70°C 25个单位/铁路 LM324AD SO-14 0 °至+ 70°C 55个单位/铁路 LM324ADR2 SO-14 2500磁带和卷轴 LM324ADTB TSSOP-14 96个单位/铁路 LM324ADTBR2 TSSOP-14 2500磁带和卷轴 LM324AN PDIP-14 25个单位/铁路 LM2902D SO-14 55个单位/铁路 LM2902DR2 SO-14 2500磁带和卷轴 LM2902DTB TSSOP-14 -40 °至+ 105°C 96 个单位/铁路 LM2902DTBR2 TSSOP-14 0 O05 C 2500磁带和卷轴 LM2902N PDIP-14 25个单位/铁路 LM2902VD SO-14 55个单位/铁路 LM2902VDR2 SO-14 2500磁带和卷轴 LM2902VDTB TSSOP-14 40 °至+ 125°C 96个单位/铁路 LM2902VDTBR2 TSSOP-14 -40 °至+ 125°C 2500磁带和卷轴 LM2902VN PDIP-14 25个单位/铁路 NCV2902DR2 SO-14 2500磁带和卷轴电气特性（V CC = 5.0 V，V EE = GND，T A = 25°C，除非另有说明）. LM224 LM324A LM324 LM2902 LM2902V / NCV2902特点符号敏典型马克斯敏典型马克斯敏典型马克斯敏典型马克斯敏典型马克斯单元输出电压-高限（T A = T 高到 T 低）（注5） V OH V V CC = 5.0 V，R L = 2.0 K Ω，T A = 25°C 3.3 3.5 - 3.3 3.5 - 3.3 3.5 - 3.3 3.5 - 3.3 3.5 - V CC = 30 V （对于LM2902，V为26V）， R L = 2.0KΩ 26 - - 26 - - 26 - - 22 - - 22 - - V CC = 30 V （对于LM2902，V为26V）， R L = 10KΩ 27 28 - 27 28 - 27 28 - 23 24 - 23 24 - 输出电压 -下限， V CC = 5.0 V， R L = 10KΩ， T A = T 高到T 低（注5） V OL - 5 20 - 5 20 - 5 20 - 5 100 - 5 100毫伏输出源电流（V ID = +1.0 V， V CC = 15 V）我 O +嘛 T A = 25℃ 20 40 - 20 40 - 20 40 - 20 40 - 20 40 - T A = T 高到T 低（注5） 10 20 - 10 20 - 10 20 - 10 20 - 10 20 - 输出吸收电流我 O -嘛（V ID = -1.0V， V CC = 15 V） T A = 25℃ 10 20 - 10 20 - 10 20 - 10 20 - 10 20 - T A = T 高到T 低（注5） 5 8 - 5 8 - 5 8 - 5 8 - 5 8 - （V ID = -1.0V， V O = 200MV， T A = 25℃） 12 50 - 12 50 - 12 50 - - - - - - - μA输出短路到地面（注6）我 SC - 40 60 - 40 60 - 40 60 - 40 60 40 60嘛电源电流（T A = T 高到T 低）（注5）我 CC嘛 V CC = 30 V （对于LM2902，V为26V）， V O = 0 V，R L =∞ - - 3.0 - 1.4 3.0 - 3.0 - - 3.0 - - 3.0 V CC = 5.0 V， V O = 0 V，R L 电路描述 LM324系列内部使用四个补偿的两级运算放大器.首先每个阶段由差分输入设备Q20和Q20组成 Q18与输入缓冲晶体管Q21和 Q17以及差分到单端转换器Q3和Q4.首先舞台不仅执行阶段的增益功能，而且还执行执行电平移位和跨导减小功能.通过减小跨导，一个更小因此可以使用补偿电容器（仅5.0 PF）节省芯片面积.跨导减少是通过拆分Q20和Q18的收藏家来完成.这个输入阶段的另一个特点是输入通用模式范围可以包括负电源或接地，单电源供电，不会使输入饱和器件或差分至单端转换器.该第二阶段由标准电流源负载组成放大器舞台.图2.大信号电压跟随器响应 V CC = 15 VDC R L = 2.0千瓦 T A = 25℃ 5 MS / DIV每个放大器都由内部电压偏置因此具有低温度系数的调节器给每个放大器良好的温度特性以及出色的电源抑制.单电源拆分耗材 V CC V EE / GND 3.0 V至V CC（大） 1 2 3 4 V CC 1 2 3 4 V EE 1.5 V至V CC（大） 1.5 V至V EE（大）图3. 70 60 50 40三十 20 10 0 1.0 10 100 10000负载电容（PF）相位裕度图4.增益和一站式配套，解决物料烦恼，万联芯城销售电子元器件范围包括IC集成电路，电阻电容，二三极管，可进行一站式BOM表配单，万联芯城BOM报价流程：联系商城客服-提交物料清单-等待报价-下单-商城发货，电子元器件配套采购，专为客户节省成本，满足客户的多样化物料需求，点击进入万联芯城。

Ardisam RC4432 部件说明书

12
29238
13
29240
14
29311
15
29314
16
29317
17
400022
18
400023
19
400024
20
W1265V0903
- 800-345-6007 2
DESCRIPTION
WASHER M10 TONGUE DECK MOUNT
HITCH MOUNT GREEN HANDLE M10 TONGUE LATCH PIN
16
10
DESCRIPTION
BOLT M8 X 25 BOLT M8 X 16
GAS CAP GAS TANK STRAINER GAS TANK MOUNT
CLAMP GAS TANK WASHER M8 WASHER M8
13
QTY. /QTÉ
4 4 1 1 1 4 1 4 4
20
14
14 2
PIN M12 X 64 TONGUE
WASHER M12 BOLT M10 X 100
SHAFT CAP BOLT M12 X 25 ROPE BRACKET ROPE MOUNT
QTY. /QTÉ
3 2 1 1 1 4 2 1 1 1
REF./ PART NO. REP. /° RÉF.
11
2431
© 2021 Ardisam, Inc. All Rights Reserved Tous droits réservés P/N: 33522 SVC: 35840 ECN: 13076 REV 1: 2020-12-09
THIS INSTRUCTION BOOKLET CONTAINS IMPORTANT SAFETY INFORMATION. PLEASE READ AND KEEP FOR FUTURE REFERENCE.

GL3224规格书

Genesys Logic, Inc.
12F., No. 205, Sec. 3, Beixin Rd., Xindian Dist. 231, New Taipei City, Taiwan Tel : (886-2) 8913-1888 Fax : (886-2) 6629-6168 http ://
© 2015 Genesys Logic, Inc. - All rights reserved. GLI Confidential
Page 4
GL3224 Datasheet
List of Figures
Figure 3.1 – QFN48 Pinout Diagram ...................................................................................... 9 Figure 3.2 – QFN32 Pinout Diagram .................................................................................... 10 Figure 4.1 – QFN48 Functional Block Diagram .................................................................. 16 Figure 4.2 – QFN32 Functional Block Diagram .................................................................. 16 Figure 5.1 - Timing Diagram of Reset Width ...................................................................... 19 Figure 5.2 - Timing Diagram of Power Good to USB Command Receive Ready ............ 20 Figure 7.1 - QFN 48 Pin Package .......................................................................................... 23 Figure 7.2 - QFN 32 Pin Package .......................................................................................... 24

夏普IDP显示器产品培训

是
是
接口
有HDMI、有LAN、有S－Video
有DVI环出、RS232环出
音频控制
组合通道
独立通道
针对市三菱夏普优派
02
行业竞争品牌分析
01
松下等离子
尺寸：42－50－58－65－103 最大优势：灵活的接口设计。主要劣势：等离子本身的缺陷（单独分析）
02
1200：1
亮度
450cd/㎡
400cd/㎡
500cd/㎡
500cd/㎡
500cd/㎡
450cd/㎡
视角
176°/176°
176°/176°
176°/176°
176°/176°
176°/176°
178°/178°
响应时间
6ms
6ms
16ms
8ms
6ms
8ms
背光灯
可以更换
不可以换
不可以换
不可以换
不可以换
二、PN系列产品介绍
灵活的图像格式用内置屏幕图像功能可以动态性再现大量的信息。可以将来自PC 的数码信号以及AV信号以“画中画”（PIP）和“画外画”（PbyP）的形式播出放，也可以创建“2×2”，“3×3”，“4×4”和“5×5”的视频墙面。
端子
PN系列产品介绍
应用案例
歌华有线总前端项目
应用案例
谢谢！
添加副标题
汇报人姓名
技术特点
应用案例最高人民法院会议系统
PN系列产品介绍
1080P全高清ASV黑色TFT显示器
PN系列产品介绍
为商业用途而设计 7×24小时全天候工作它采用高可靠性的零部件以及高散热性的机体设计，因此性能十分可靠，适用于各种商业和工业用途。纵向使用根据操作的内容和信息，夏普提供可横向使用和纵向使用的液晶显示器。

PIP3221-DC资料

Table 4: Truth table Abbreviations: L = logic LOW; H = logic HIGH; X = don’t care; 0 = condition not present; 1 = condition present; UV = undervoltage; OV = overvoltage; OC = open circuit load; SC = short circuit; OT = overtemperature [1]. Input 1 L L 2 L L Supply UV 0 0 OV X X OC 0 1 Load 1 SC X X OT X X OC 0 X Load 2 SC X X OT X X Load output 1 OFF OFF 2 OFF OFF H L both off & normal both off, one/both OC or shorted to VS or battery; Figure 10 one off & OC, with other on & normal one on & normal, with other off & normal both on & normal supply undervoltage lockout supply overvoltage shutdown one SC shutdown one SC shutdown, with other off & normal one SC shutdown, with other on & normal one OT shutdown one OT shutdown, with other off & normal one OT shutdown, with other on & normal Status Operating mode

24LC32中文资料

•ISO 7816 compliant contact locations•Single supply with operation down to 2.5V -Maximum write current 3 mA at 6.0V -Maximum read current 150 µ A at 6.0V -Standby current 1 µ A max at 2.5V•T wo wire serial interface bus, I 2 C ™ compatible •100 kHz (2.5V) and 400 kHz (5V) compatibility •Self-timed ERASE and WRITE cycles •Power on/off data protection circuitry•1,000,000 ERASE/WRITE cycles guaranteed •32 byte page or byte write modes available •Schmitt trigger inputs for noise suppression•Output slope control to eliminate ground bounce • 2 ms typical write cycle time, byte or page •Electrostatic discharge protection > 4000V •Data retention > 200 years•8-pin PDIP and SOIC packages •T emperature ranges:DESCRIPTIONThe Microchip T echnology Inc. 24LC32A is a 4K x 8(32K bit) Serial Electrically Erasable PROM in an ISO micromodule for use in smart card applications. The device has a page-write capability of up to 32 bytes.-Commercial: 0˚C to +70˚C2元器件交易网24LC32A MODULE1.0ELECTRICAL CHARACTERISTICS1.1Maximum Ratings*V CC ........................................................................7.0V All inputs and outputs w.r.t. V SS ......-0.6V to VCC +1.0V Storage temperature ..........................-65˚C to +150˚C Ambient temp. with power applied......-65˚C to +125˚C Soldering temperature of leads (10 seconds)..+300˚C ESD protection on all pins .....................................≥ 4 kV*Notice: Stresses above those listed under “Maximum Ratings”may cause permanent damage to the device. This is a stress rat-ing only and functional operation of the device at those or anyother conditions above those indicated in the operational listings of this speciﬁcation is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.TABLE 1-1:PIN FUNCTIONSName Function V SS Ground SDA Serial Data SCL Serial ClockV CC+2.5V to 6.0V Power SupplyTABLE 1-2:DC CHARACTERISTICSVcc = +2.5V to 6.0VCommercial (C):T amb = 0˚C to +70 ° CParameterSymbolMinTypMaxUnitsConditionsSCL and SDA pins:High level input voltage V IH .7 V CC —V Low level input voltage V IL —.3 Vcc V Hysteresis of Schmitt T rigger inputsV HYS .05 V CC—V Note 1Low level output voltage V OL —.40V I OL = 3.0 mA @ V CC = 4.5V I OL = 2.1 mA @ V CC = 2.5V Input leakage current I LI -1010 µ A V IN = .1V to V CC Output leakage current I LO -1010 µ A V OUT = .1V to V CC Pin capacitance (all inputs/outputs)C IN ,C OUT —10pF V CC = 5.0V (Note 1)T amb = 25˚C, f c = 1 MHz Operating current I CC Write —3mA V CC = 6.0VI CC Read —400 µ A V CC = 6.0V , SCL = 400Khz Standby currentI CCS —1 µ A5 µ A SCL = SDA = V CC = 5.0VI CCS1µ AVCC = 2.5V (Note 1)Note 1:This parameter is periodically sampled and not 100% tested.元器件交易网24LC32A MODULETABLE 1-3:AC CHARACTERISTICSParameterSymbolVcc = 2.5 - 6.0V STD. MODE Vcc = 4.5 - 6.0V FAST MODE UnitsRemarksMinMaxMinMaxClock frequency F CLK —100—400kHz Clock high time T HIGH 4000—600—ns Clock low timeT LOW 4700—1300—ns SDA and SCL rise time T R —1000—300ns Note 1SDA and SCL fall time T F —300—300ns Note 1START condition hold timeT HD : STA 4000—600—ns After this period the ﬁrst clock pulse is generatedST ART condition setup timeT SU : STA 4700—600—ns Only relevant for repeated ST ART conditionData input hold time T HD : DAT 0—0—ns Data input setup time T SU : DAT 250—100—ns STOP condition setup timeT SU : STO 4000—600—ns Output valid from clock T AA —3500—900ns Note 2Bus free timeT BUF 4700—1300—ns Time the bus must be free before a new transmission can start Output fall time from V IH min to V IL maxT OF —25020 +0.1C B 250ns Note 1, CB ≤ 100 pF Input ﬁlter spike sup-pression (SDA and SCL pins)T SP—50—50nsNote 3Write cycle timeTWR —5—5ms Byte or Page modeNote 1: Not 100% tested. CB = total capacitance of one bus line in pF .2: As a transmitter, the device must provide an internal minimum delay time to bridge the undeﬁned region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of ST ART or STOP conditions. 3: The combined T SP and VHYSspeciﬁcations are due to Schmitt trigger inputs which provide improved noise and spike suppression. This eliminates the need for a Ti speciﬁcation for standard operation.元器件交易网24LC32A MODULE2.0PIN DESCRIPTIONS2.1SDA (Serial Data)This is a bidirectional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pullup resistor to V CC (typical 10K Ω for 100 kHz, 1K Ω for 400kHz)For normal data transfer SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the ST ART and STOP condi-tions.2.2SCL (Serial Clock)This input is used to synchronize the data transfer from and to the device.3.0FUNCTIONAL DESCRIPTIONThe 24LC32A supports a bidirectional two-wire bus and data transmission protocol. A device that sends data onto the bus is deﬁned as transmitter, and a device receiving data as receiver. The bus must be con-trolled by a master device which generates the serial clock (SCL), controls the bus access, and generates the ST ART and STOP conditions, while the 24LC32A works as slave. Both master and slave can operate as transmitter or receiver but the master device deter-mines which mode is activated.元器件交易网24LC32A MODULE4.0BUS CHARACTERISTICSThe following bus protocol has been deﬁned:•Data transfer may be initiated only when the bus is not busy.•During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data line while the clock line is HIGH will be interpreted as a ST ART or STOP condition.Accordingly, the following bus conditions have been deﬁned (See Figure 4-1).4.1Bus not Busy (A)Both data and clock lines remain HIGH.4.2Start Data Transfer (B)A HIGH to LOW transition of the SDA line while the clock (SCL) is HIGH determines a ST ART condition.All commands must be preceded by a START condi-tion.4.3Stop Data Transfer (C)A LOW to HIGH transition of the SDA line while the clock (SCL) is HIGH determines a STOP condition. All operations must be ended with a STOP condition.4.4Data Valid (D)The state of the data line represents valid data when,after a ST ART condition, the data line is stable for the duration of the HIGH period of the clock signal.The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data.Each data transfer is initiated with a ST ART condition and terminated with a STOP condition. The number of the data bytes transferred between the ST ART and STOP conditions is determined by the master device.4.5AcknowledgeEach receiving device, when addressed, is obliged to generate an acknowledge signal after the reception of each byte. The master device must generate an extra clock pulse which is associated with this acknowledge bit.A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of course,setup and hold times must be taken into account. Dur-ing reads, a master must signal an end of data to the slave by NOT generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24LC32A) will leave the data line HIGH to enable the master to generate the STOP condition.(See Figure 4-2)元器件交易网24LC32A MODULE5.0DEVICE ADDRESSINGA control byte is the ﬁrst byte received following the start condition from the master device. (See Figure 5-1) The control byte consists of a four bit control code;for the 24LC32A this is set as 1010 binary for read and write operations. The next three bits are device select bits on standard devices, however, for micromodules,these must be zeros. The last bit of the control byte deﬁnes the operation to be performed. When set to a one a read operation is selected, and when set to a zero a write operation is selected. The next two bytesreceived deﬁne the address of the ﬁrst data byte (see Figure 5-2). Because only A11...A0 are used, the upper four address bits must be zeros. The most signif-icant bit of the most signiﬁcant byte of the address is transferred ﬁrst.Following the start condition, the 24LC32A monitors the SDA bus checking the device type identiﬁer being transmitted. Upon receiving a valid control byte, the slave device outputs an acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24LC32A will select a read or write operation元器件交易网24LC32A MODULE6.0WRITE OPERATIONS6.1Byte WriteFollowing the start condition from the master, the con-trol code (four bits), the device select (three bits), and the R/W bit which is a logic low are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an acknowl-edge bit during the ninth clock cycle. Therefore the next byte transmitted by the master is the high-order byte of the word address and will be written into the address pointer of the 24LC32A MODULE. The next byte is the least signiﬁcant address byte. After receiving another acknowledge signal from the 24LC32A the master device will transmit the data word to be written into the addressed memory location.The 24LC32A acknowledges again and the master generates a stop condition. This initiates the internal write cycle, and during this time the 24LC32A will not generate acknowledge signals (see Figure 6-1).6.2Page WriteThe write control byte, word address and the ﬁrst data byte are transmitted to the 24LC32A in the same way as in a byte write. But instead of generating a stop con-dition, the master transmits up to 32 bytes which are temporarily stored in the on-chip page buffer and will be written into memory after the master has transmitted a stop condition. After receipt of each word, the ﬁve lower address pointer bits are internally incremented by one.If the master should transmit more than 32 bytes prior to generating the stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the stop condition is received, an internal write cycle will begin. (see Figure 6-2).元器件交易网24LC32A MODULE7.0ACKNOWLEDGE POLLINGSince the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the stop condition for a write com-mand has been issued from the master, the device ini-tiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master send-ing a start condition followed by the control byte for a write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next read or write command. See Figure 7-1 for ﬂow diagram.FIGURE 7-1:ACKNOWLEDGE POLLING8.0READ OPERATIONRead operations are initiated in the same way as write operations with the exception that the R/W bit of the slave address is set to one. There are three basic types of read operations: current address read, random read,and sequential read.8.1Current Address ReadThe 24LC32A contains an address counter that main-tains the address of the last word accessed, internally incremented by one. Therefore, if the previous access (either a read or write operation) was to address n (n is any legal address), the next current address read oper-ation would access data from address n + 1. Upon receipt of the slave address with R/W bit set to one, the 24LC32A issues an acknowledge and transmits the eight bit data word. The master will not acknowledge the transfer but does generate a stop condition and the 24LC32A discontinues transmission (see Figure 8-1).8.2Random ReadRandom read operations allow the master to access any memory location in a random manner. T o perform this type of read operation, ﬁrst the word address must be set. This is done by sending the word address to the 24LC32A as part of a write operation (R/W bit set to 0).After the word address is sent, the master generates a start condition following the acknowledge. This termi-nates the write operation, but not before the internal address pointer is set. Then the master issues the con-trol byte again but with the R/W bit set to a one. The 24LC32A will then issue an acknowledge and transmit the eight bit data word. The master will not acknowl-edge the transfer but does generate a stop condition which causes the 24LC32A to discontinue transmis-sion (see Figure 8-2).元器件交易网24LC32A MODULE8.3Sequential ReadSequential reads are initiated in the same way as a ran-dom read except that after the 24LC32A transmits the ﬁrst data byte, the master issues an acknowledge as opposed to the stop condition used in a random read.This acknowledge directs the 24LC32A to transmit the next sequentially addressed 8 bit word (see Figure 8-3). Following the ﬁnal byte transmitted to the master,the master will NOT generate an acknowledge but will generate a stop condition.To provide sequential reads the 24LC32A contains an internal address pointer which is incremented by one at the completion of each operation. This address pointer allows the entire memory contents to be serially read during one operation. The internal address pointer will automatically roll over from address 0FFF to address 000 if the master acknowledges the byte received from the array address 0FFF .元器件交易网24LC32A MODULE9.0SHIPPING METHODThe micromodules will be shipped to customers in clear plastic trays. Each tray holds 150 modules, and the trays can be stacked in a manner similar to shipping die in wafﬂe packs. A tray drawing with dimensions is shown in Figure 9-1.元器件交易网24LC32A MODULE元器件交易网24LC32A MODULENOTES:元器件交易网24LC32A MODULENOTES:元器件交易网24LC32A MODULENOTES:元器件交易网24LC32A MODULE24LC32A MODULE PRODUCT IDENTIFICATION SYSTEMT o order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales ofﬁce.Sales and SupportData SheetsProducts supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:1.Y our local Microchip sales ofﬁce.2.The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277.3.The Microchip’s Bulletin Board, via your local CompuServe number (CompuServe membership NOT required).Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.元器件交易网MAll rights reserved. © 1997, Microchip T echnology Incorporated, USA. 9/97 Printed on recycled paper.元器件交易网。

AD5624 5644 5664 中文数据手册

INPUT REGISTER
DAC REGISTER
STRING DAC D
BUFFER
VOUTA VOUTB VOUTC VOUTD
05856-001
POWER-ON LOGIC
POWERDOWN LOGIC
图1
表1. 相关器件产品型号 AD5624/AD5664
AD5666
描述
2.7 V至5.5 V、四通道、12/16位DAC，外部基准电压源 2.7 V至5.5 V、四通道、16位DAC，内部基准电压源，LDAC、CLR引脚
AD5624R-5/AD5644R-5/AD5664R-5.................................... 3 AD5624R-3/AD5644R-3/AD5664R-3.................................... 4 交流特性................................................................................... 6 时序特性................................................................................... 7 时序图 ....................................................................................... 7 绝对最大额定值 ............................................................................ 8 ESD警告.................................................................................... 8 引脚配置和功能描述.................................................................... 9 典型工作特性................................................................................. 10 术语.................................................................................................. 18 工作原理 ......................................................................................... 20 数模转换部分 .......................................................................... 20 电阻串 ....................................................................................... 20 输出放大器............................................................................... 20

软性线路之印制电路板常用标准介绍

软性线路之印制电路板常用标准介绍软性线路板广泛应用在商用电子设备、汽车仪表板、印表机、硬碟机、软碟机、传真机、车用行动电话、一般电话、笔记型电脑、照相机、摄影机、CD-ROM、硬碟、手表、电脑、照相机、医疗仪器设备等各种电子产品和设备中。

IPC-AC-62A: 焊接后水成清洗手册。

描述制造残留物、水成清洁剂的类型和性质、水成清洁的过程、设备和工艺、质量控制、环境控制及员工安全以及清洁度的测定和测定的费用。

IPC-DRM -4 0E: 通孔焊接点评估桌面参考手册。

按照标准要求对元器件、孔壁以及焊接面的覆盖等详细的描述，除此之外还包括计算机生成的3D 图形。

涵盖了填锡、接触角、沾锡、垂直填充、焊垫覆盖以及为数众多的焊接点缺陷情况。

IPC-TA-722: 焊接技术评估手册。

包括关于焊接技术各个方面的45 篇文章，内容涉及普通焊接、焊接材料、手工焊接、批量焊接、波峰焊接、回流焊接、气相焊接和红外焊接。

IPC-7525: 模板设计指南。

为焊锡膏和表面贴装粘结剂涂敷模板的设计和制造提供指导方针i 还讨论了应用表面贴装技术的模板设计，并介绍了带有通孔或倒装晶片元器件的?昆合技术，包括套印、双印和阶段式模板设计。

IPC/EIA J-STD-004: 助焊剂的规格需求一包括附录I 。

包含松香、树脂等的技术指标和分类，根据助焊剂中卤化物的含量和活化程度分类的有机和无机助焊剂;还包括助焊剂的使用、含有助焊剂的物质以及免清洗工艺中使用的低残留助焊剂。

IPC/EIA J-STD -005 :焊锡膏的规格需求一包括附录I 。

列出了焊锡膏的特征和技术指标需求，也包括测试方法和金属含量的标准，以及粘滞度、塌散、焊锡球、粘性和焊锡膏的沾锡性能。

IPC/EIA J-STD -0 06A: 电子等级焊锡合金、助焊剂和非助焊剂固体焊锡的规格需求。

为电子等级焊锡合金，为棒状、带状、粉末状助焊剂和非助焊剂的焊锡，为电子焊锡的应用，为特殊电子等级焊锡提供术语命名、规格需求和测试方法。

32寸IPB电源的培训资料

Load regulation 负载调整率
±5%
±5%
家电维修资料网
具体的技术指标
FHD 屏规格书家电维修资料网
Adobe Acrobat 7.0
Inverter部份的特性（型号：CAS_LC320WUE-SAA1；lamp:16； EEFL） Document
90Vac---270Vac
47---63HZ
2.205A
20A/100Vac 40A/220Vac ≥ 82% ≥ 87% ≥ 86%
GB17625.0-1998 IEC61000-3-2 calls D ≤0.35mv/220Vac
T3.15AH/250Vac & T1AL/250Vac ≥96% （90VAC） ≥93% （220VAC） ≥90% （264VAC） ≤0.15W
Efficiency (full load when 90V) 效率(100V输入时最大负载) Efficiency (full load when 220V) 效率(220V输入时最大负载) Efficiency (full load when 264V) 效率(264V输入时最大负载)
Harmonic current
谐波电流
Leakage current
漏电流
Input FUSC spec
输入保险丝规格
Power Factor(full load)
功率因数范围
Standby Power Consumption 待机功耗(3.3V负载≤10mA, 230Vac)
家电维修资料网
100Vac---240Vac
开机: 当收到MCU发出开机的高电平信号后、经DB15、RB22后送到QB21的B极，此时QB21导通、光耦IC6的1、2脚导通、将信号耦合到光耦IC6的3、4脚。这时QB1导通，VCC供电通过QB1输出10~12V电压，给继电器提供工作电压,继电器闭合，主电源接通交流。

常熟开关有限公司生产APD-32,APD-40,APD-50,APD-63自复式过欠电压保护器

APD自复式过欠电压保护器主编：刘双喜常熟开关有限公司
（上海红申电气科技有限公司）
一、APD自复式过欠压保护器简介

APD：电压自动处理系统:Aransaction Processing Dystems 220:市电照明电压220V C5：设计序号试验注册型号：APD-16/25/32/40/50/63-C5 家用“自复式过欠压延时保护器”APD是常熟开关有限公司根据目前市电状况所研制的新一代家电保护装置。过欠压延时保护器控制线路选用进口元器件组装，产品的设计符合模块化标准，性能优良、可靠，能在电压异常情况下正常工作。当市电电压超过保护器动作电压时，保护器能迅速、可靠地切断电路，以达到保护电器和人身安全。当市电电压恢复正常时，保护器能自动接通电源、恢复供电，所有功能全部自动化处理实施、无需人员操作。面板上的红绿色发光二极管能指示保护器工作状态。指示灯发绿光时正常供电，发红光时保护功能启动切断供电。本“过欠电压延时保护器”产品结构紧凑、外观美观、安装与DZ47（C45）导轨通用。

三、型号及含义
四、产品选型表及主要参数
外壳采用防火材料； ● 复位功能，确保任何情况下，手动恢复供电； ● 工作功耗1.4W/小时，每年节省电费百余元； ● 快速脉冲试验通过4级，使用高谐波家电工作稳定； ● 带有防雷功能，防止雷电天家庭中家用电器被雷电击中； ● 电源采用变压器供电，抗干扰能力强，器件性能稳定，使用寿命长； ● 带自检测按键，常规检查及其便利，后续定期可以检测设备是否正常工作，保证用电安全；

二、APD主要技术指标

1、额定电压220V、频率50Hz 2、通过最大电流：16A、25A、32A、40A、50A、63A，可定做80A 3、最大负载功率：4.4KVA、6.6KVA、8.8KVA 4、过压动作切断值：270±5VAC 5、过压恢复值：248±5VAC 6、欠压动作切断值：170±5VAC 7、欠压恢复值∶183±5VAC 8、断电后送电延时：2～5分钟 9、自身功耗:≤2W 10、电气机械寿命∶≥9万次 11、外形尺寸 86*45*66.5mm 12、具有防雷功能

pbc材料

pbc材料PBC（Printed Circuit Board，印刷电路板）是一种用于电子设备的基础组件，它以覆盖着金属导线的绝缘基板为主体，通过打孔、电镀、印刷等工艺制成。

PBC材料是制造PBC的基材，常见的PBC材料包括FR-4、金属基板、陶瓷基板等。

FR-4是最常用的PBC材料之一，它是一种玻璃纤维增强基材，具有较高的耐热性、耐燃性和耐化学腐蚀性。

它常用于制造普通电子设备的PBC，如计算机、手机、电视机等。

FR-4具有优异的电性能，能够承受较高的电压和电流，同时还具有良好的机械强度和耐久性。

FR-4材料的主要成分是玻璃纤维和环氧树脂，制造工艺复杂，生产成本较高。

金属基板是另一种常见的PBC材料，它主要由铝基板和铜基板两种。

金属基板具有良好的散热性能，能够有效地将电子设备产生的热量迅速散发出去，从而保证设备的稳定工作。

在电力、电子、通讯等领域，金属基板被广泛用于制造功率放大器、光电器件、太阳能电池等高功率设备。

金属基板的主要成分是金属材料，如铝、铜等，具有良好的导热性和尺寸稳定性。

陶瓷基板是一种特殊的PBC材料，它主要用于制造高频、高温等特殊要求的电子设备。

陶瓷基板具有优异的电性能、机械强度和耐高温性能，能够在恶劣的工作环境下保持稳定工作。

陶瓷基板通常由氧化铝、氮化硅等材料制成，制造工艺相对复杂，生产成本较高。

陶瓷基板被广泛应用于计算机、通信、医疗等领域的高频电子设备。

除了以上几种常见的PBC材料外，还有一些新型PBC材料正在不断的研发和应用。

例如，柔性基板是一种可以弯曲和扭曲的PBC材料，它主要由柔性聚酰亚胺薄膜制成，具有良好的耐热性和耐弯曲性能，广泛应用于移动设备、可穿戴设备等领域。

总之，PBC材料是制造PBC不可或缺的基本材料，不同的PBC材料适用于不同的电子设备，具有不同的特性和应用领域。

随着科技的不断发展，新型PBC材料的研发和应用将进一步推动电子设备的创新和发展。