MM54HC191中文资料

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74HC11-54HC11中文资料pdf

74HC11-54HC11中文资料pdf

0.4
V
0.5
II最 大输 入电 压时输入 电流
Vcc=最大
VI=5.5V VI=7V
1
1
mA
0.1
IIH输入高电平电流
Vcc=最大
VIH=2.4V VIH=2.7V
50
50
µA 20
IIL输入低电平电流
Vcc=最大
VIL=0.4V VIL=0.5V
-2
-0.4 mA -2
IOS输出短路电流
Vcc=最大
7.6ns 4.5ns
tphl
8.8ns 5ns
PD
120mW 94mW
co
54/74LS11
8ns
10ns 13mW

引出端符号

1A-3A 1B-3B 1C-3C 1Y-4Y
输入端 输入端 输入端 输出端
-ar
逻辑图
ga






双列直插封装
极限值 电源电压 …………………………………………. 7V 输入电压 54/74H11、54/74S11……………………………….5.5V 54/74LS11 …………………………………………. 7V A-C 间电压 54/74H11、54/74S11……………………………….5.5V
VIK输入嵌位电压
w Vcc=最小
Iik=-12mA Iik=-18mA
-1.5
-1.2
V -1.5
VOH输出高电平电压
Vcc=最小VIH=2V, 54 2.4
IOH=最大
74 2.4
2.5 2.7
2.5 2.7
V
VOL输出低电平电压

CD54HCT190中文资料

CD54HCT190中文资料

This data sheet is applicable to the CD54HC190, CD74HC190, CD74HCT190, CD54HC191, and CD54HCT191. The CD54HCT190 was not acquired from Harris Semiconductor. See SCHS192 for information on the CD74HC191 and CD74HCT191.Data sheet acquired from Harris Semiconductor SCHS275IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

C1419中文资料

C1419中文资料

Vectron International · v.2005-02-10 · page 1 of 3Vectron International Headquarters Vectron International LLC. 100 Watts StreetVectron international GmbH & Co. KG LandstrasseVectron Asia Pacific Sales OfficeUnit 3119 31st Floor, Jin Mao Tower, 88Typical ApplicationsFeaturesTelecommunication Standard 4-Pin DIP Package Universal Clock Enable FunctionPrevious Vectron Model NumbersMCO1XXX; AA;Frequency range1 MHz – 100 MHzFrequency stabilities 1ParameterMin Typ Max. Units Operating temprange Ordering Code 5Overall (vs. Initial, vs. operatingtemperature range vs. supply voltage change vs. load change vs. aging /1. Yea)r-100.0 -50.0 -25.0 -100.0 -50.0 -32.0+100.0 +50.0 +25.0 +100.0 +50.0 +32.0ppm ppm ppm ppm ppm ppm-0 … +70°C -0 … +70°C -0 … +70°C -40 … +85°C -40 … +85°C -40 … +85°CC104 C505 C255 F104 F505 F325Supply voltageParameterMin Typ Max. Units ConditionOrdering Code 5Supply voltage (Vs)4.755.0 5.25 VDCSV050Current consumption40 50 55 70 mA@ HCMOS fo < 24.0 MHz @ HCMOS fo < 50.0 MHz @ HCMOS fo < 70.0 MHz @ HCMOS fo < 100.0 MHz Supply voltage (Vs) 3.135 3.3 3.465 VDC SV033 Current consumption30 35 40 50mA@ HCMOS fo < 24.0 MHz @ HCMOS fo < 50.0 MHz @ HCMOS fo < 70.0 MHz @ HCMOS fo < 100.0 MHzRF outputParameter Min Typ Max.Units ConditionOrdering Code 5SignalHCMOSRFHLoad15.0 pFRise and Fall time 10 ns @ 15 pF 10 to 90 %Duty cycle4060%@ Vs/2Vectron International · v.2005-02-10 · page 2 of 3Vectron International Headquarters Vectron International LLC.100 Watts StreetVectron international GmbH & Co. KGLandstrasseVectron Asia Pacific Sales OfficeUnit 3119 31st Floor, Jin Mao Tower, 88EnclosuresAbsolute Maximum RatingsParameter Min Typ Max. Units Condition Supply voltage (Vs) 7 VOperable temperature range -30 +80 °CStorage temperature range -40 +90 °CVectron International · v.2005-02-10 · page 3 of 3Vectron International Headquarters Vectron International LLC.100 Watts StreetVectron international GmbH & Co. KGLandstrasseVectron Asia Pacific Sales OfficeUnit 3119 31st Floor, Jin Mao Tower, 88How to Order this Product:Step 1 Use this worksheet to forward the following information to your factory representative:Model Stability Code Supply Voltage Code RF Output Code Package Code C1419Example: C1419 C104 SV050 RFH A1Step 2 The factory representative will then respond with a Vectron Model Number in the following Configuration: Model Package Code Dash Dash NumberC1419 [Customer Specified Package Code]- [Factory Generated 4 digit number] Typical P/N = C1419A1-0001Notes:1 Contact factory for improved stabilities or additional product options. Not all options and codes are available at all frequencies.2 Unless otherwise stated all values are valid after warm-up time and refer to typical conditions for supply voltage, frequency controlvoltage, load, temperature (25°C)3 Phase noise degrades with increasing output frequency.4 Subject to technical modification.5 Contact factory for availability.。

MM74C922中文资料

MM74C922中文资料

General Description
The MM74C922 and MM74C923 CMOS key encoders provide all the necessary logic to fully encode an array of SPST switches. The keyboard scan can be implemented by either an external clock or external capacitor. These encoders also have on-chip pull-up devices which permit switches with up to 50 kΩ on resistance to be used. No diodes in the switch array are needed to eliminate ghost switches. The internal debounce circuit needs only a single external capacitor and can be defeated by omitting the capacitor. A Data Available output goes to a high level when a valid keyboard entry has been made. The Data Available output returns to a low level when the entered key is released, even if another key is depressed. The Data Available will return high to indicate acceptance of the new key after a normal debounce period; this two-key roll-over is provided between any two switches.

CD54AC191中文资料

CD54AC191中文资料

FAST™ is a Trademark of Fairchild Semiconductor.
Copyright © 2000, Texas Instruments Incorporated
1
元器件交易网
CD54AC191, CD54ACTBINARY PRESET
P0 P1 P2 P3
15 1 10 9 ASYN. PARALLEL 11
LOAD ENABLE
CLOCK 14
3 Q0 2 Q1 6 Q2
BINARY OUTPUTS
UP/DOWN 5
COUNT 4 ENABLE
7 Q3
12 TERMINAL COUNT
13 RIPPLE CLOCK
___
Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
• Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption
• Balanced Propagation Delays
• AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply
DC Electrical Specifications

HSMQ-C191中文资料

HSMQ-C191中文资料

元器件交易网
Package Dimensions
LED DIE
CATHODE LINE
1.0 (0.039)
CLEAR EPOXY
PC BOARD
2.6 (0.102 ) 3.2 (0.126 )
POLARITY
1.5 (0.059)
1.6 (0.063 ) 3.2 (0.126 )
SOLDERING TERMINAL
HSMx-C120
3
元器件交易网
Package Dimensions, continued
3.4 (0.134) LED DIE
CATHODE MARK (ETCHED)
1.25 (0.049)
GREEN SOLDER MASK
UNDIFFUSED EPOXY
0.6 (0.023) 0.3 (0.012)
0.3 ± 0.15 (0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING TERMINAL
HSMx-C190
SOLDERING TERMINAL
HSMx-C191
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
1.25 (0.049)
0.62 (0.025)
POLARITY 0.40 (0.016)
PC BOARD
CATHODE LINE 0.40 ± 0.15
(0.016 ± 0.006)
0.16 (0.006)
0.40 ± 0.15 (0.016 ± 0.006) 1.10 (0.043) MIN.

74HC191中文资料

74HC191中文资料
fi = input frequency in MHz fo = output frequency in MHz ∑ (CL × VCC2 × fo) = sum of outputs CL = output load capacitance in pF VCC = supply voltage in V
Counting is inhibited by a HIGH level on the count enable (CE) input. When CE is LOW internal state changes are initiated synchronously by the LOW-to-HIGH transition of the clock input. The up/down (U/D) input signal determines the direction of counting as indicated in the function table. The CE input may go LOW when the clock is in either state, however, the LOW-to-HIGH CE transition must occur only when the clock is HIGH. Also, the U/D input should be changed only when either CE or CP is HIGH.
The 74HC/HCT191 are asynchronously presettable 4-bit binary up/down counters. They contain four master/slave flip-flops with internal gating and steering logic to provide asynchronous preset and synchronous count-up and count-down operation.

MM74HC594中文资料

MM74HC594中文资料
Logic Diagram
MM74HC594

2
元器件交易网
MM74HC594
Absolute Maximum Ratings(Note 1)
(Note 2)
Recommended Operation Conditions
Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Power Dissipation (PD)
General Description
This high speed shift register utilizes advanced silicon-gate CMOS technology. This device possesses the high noise immunity and low power consumption of standard CMOS integrated circuits, as well as the ability to drive 15 LS-TTL loads.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating—plastic “N” package: −12 mW/°C from 65°C to 85°C.

W191HI资料

W191HI资料

Skew Controlled SDRAM BufferW191Features•Six skew controlled CMOS outputs•Output skew between any two outputs is less than 150ps •SMBus Serial configuration interface •2.5 ns to 5 ns propagation delay •DC to 133 MHz operation (Commercial)•DC to 100 MHz operation (Industrial)•Single 3.3V supply voltage•Low power CMOS design packaged in a 16-pin SSOP (Small Shrink Outline Package)Key SpecificationsSupply Voltages:......................................V DDQ3 = 3.3V ±5%Operating Temperature: (Commercial).............0°C to +70°C Operating Temperature:(Industrial)..............–40°C to +85°C Input Threshold:...................................................1.5V typical Maximum Input Voltage:..................................V DDQ3 + 0.5V Input Frequency: (Commercial)........................0 to 133 MHz Input Frequency: (Industrial).............................0 to 100 MHz BUF_IN to SDRAM0:5 Propagation Delay:.......2.5 ns to 5 ns Min. Output Edge Rate:.............................................1.0V/ns Max. Output Skew:.....................................................150 ps Output Duty Cycle:...................................45/55% worst case Output Impedance:...................................................15: typ.OverviewThe W191 is a skew controlled fanout buffer optimized for interface with registered DIMMs.Functional DescriptionOutput DriversThe W191 output buffers are CMOS type which deliver a rail-to-rail (GND to VDD) output voltage swing into a nominal capacitive load. Thus, output signaling is both TTL and CMOS level compatible. Nominal output buffer impedance is 15:.Serial ControlSerial control data is written to the W191 in ten bytes of eight bits each. Bytes are written in the order shown in Table 1 Writing Data BytesEach bit in the data bytes control a particular device function. Bits are written MSB (most significant bit) first, which is bit 7. Table 1 gives the bit formats for registers located in Data Bytes0-2.Pin DefinitionsPin Name Pin No.PinType Pin DescriptionSDRAM0:51, 3, 6,11, 13, 15O SDRAM Outputs: Provides buffered copy of BUF_IN. The propagation delay from a rising input edge to a rising output edge is 2.5 to 5 ns. All outputs are skew controlled to within ±150 ps of each other.BUF_IN4I Clock Input: This clock input has an input threshold voltage of 1.5V (typ).SDATA8I/O SMBus Data input: Data should be presented to this input as described in the SMBussection of this data sheet. Internal 250-k: pull-up resistor.SCLOCK9I SMBus clock input: The SMBus Data clock should be presented to this input asdescribed in the SMBus section of this data sheet. Internal 250-k: pull-up resistor. VDDQ37, 12, 16P Power Connection: Power supply for core logic and output buffers. Connected to3.3V supply.GND2, 5, 10,14G Ground Connection: Connect all ground pins to the common system ground plane.Table 1.Byte Writing SequenceByteSequence Byte Name Bit Sequence Byte Description1Slave Address11010010Commands the W191 to accept the bits in Data Bytes 0-6 for internalregister configuration. Since other devices may exist on the samecommon serial data bus, it is necessary to have a specific slave addressfor each potential receiver. The slave receiver address for the W191 is11010010. Register setting will not be made if the Slave Address is notcorrect (or is for an alternate slave receiver).2Command Code Don’t Care Unused by the W191, therefore bit values are ignored (don’t care). Thisbyte must be included in the data write sequence to maintain proper byteallocation. The Command Code Byte is part of the standard serialcommunication protocol and may be used when writing to anotheraddressed slave receiver on the serial data bus.3Byte Count Don’t Care Unused by the W191, therefore bit values are ignored (don’t care). Thisbyte must be included in the data write sequence to maintain proper byteallocation. The Byte Count Byte is part of the standard serial communi-cation protocol and may be used when writing to another addressed slavereceiver on the serial data bus.4Data Byte 0Refer toTable 2The data bits in these bytes set internal W191 registers that control device operation. The data bits are only accepted when the Address Byte bit sequence is 11010010, as noted above. For description of bit control functions, refer to Table 2.5Data Byte 16Data Byte 27Data Byte 3Don’t Care 8Data Byte 49Data Byte 510Data Byte 6Table 2.Data Bytes 0–2 Serial Configuration Map[2]Bit(s)Affected PinControl FunctionBit ControlPin No.Pin Name01Data Byte 0 SDRAM Active/Inactive Register (1 = Enable, 0 = Disable)76SDRAM2Clock Output Disable Low Active 6----(Reserved)----5----(Reserved)----4----(Reserved)----3----(Reserved)----23SDRAM1Clock Output Disable Low Active 1----(Reserved)----01SDRAM0Clock Output Disable----Data Byte 1 SDRAM Active/Inactive Register (1 = Enable, 0 = Disable)7----Clock Output Disable----615SDRAM5Clock Output Disable Low Active 5----Clock Output Disable----4----(Reserved)----313SDRAM4Clock Output Disable Low Active 2----(Reserved)----1----(Reserved)----0----(Reserved)----Data Byte 2 SDRAM Active/Inactive Register (1 = Enable, 0 = Disable)711SDRAM3Clock Output Disable Low Active 6----(Reserved)----5----(Reserved)----4----(Reserved)----3----(Reserved)----2----(Reserved)----1----(Reserved)----0----(Reserved)----Note:2.At power up all SDRAM outputs are enabled and active. Program Reserved bits to 0.Absolute Maximum Ratings [3]Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stressrating only. Operation of the device at these or any other condi-tions above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability.DC Electrical Characteristics: T A = 0°C to +70°C (Commercial), V DDQ3 = 3.3V ± 5%,T A = –40°C to +85°C (Industrial),V DDQ3 = 3.3V ± 5% [4]Parameter DescriptionRating Unit V DDQ3, V IN Voltage on any pin with respect to GND –0.5 to + 7.0V T STG Storage Temperature–65 to + 150°C T B Ambient Temperature under Bias –55 to + 125°C T A Operating Temperature (Commercial)0 to + 70°C T AOperating Temperature (Industrial)–40 to + 85°CParame-ter DescriptionTest Condition Min.Typ.Max.Unit I DD 3.3V Supply CurrentBUF_IN = 100 MHz 173mA I DD 3.3V Supply Current in three-stateBUF_IN = 100 MHz5mALogic Inputs (BUF_IN, OE, SCLOCK, SDATA)V IL Input Low Voltage GND–0.30.8V V IH Input High Voltage2.0V DDQ3+0.5V I ILEAK Input Leakage Current, BUF_IN –5+5µA I ILEAK Input Leakage Current [5]–20+5µALogic Outputs (SDRAM0:5)V OL Output Low Voltage I OL = 1 mA 50mV V OH Output High Voltage I OH = –1 mA 3.1V I OL Output Low Current V OL = 1.5V 65100160mA I OH Output High CurrentV OH = 1.5V70110185mAPin Capacitance/InductanceC IN Input Pin Capacitance (Except BUF_IN)5pF C OUT Output Pin Capacitance 6pF L INInput Pin Inductance7nHNotes:3.Multiple supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.4.Outputs loaded by 6” 60:transmission lines with 20 pF capacitors.5.OE, SCLOCK, and SDATA logic pins have a 250-k : internal pull-up resistor (not CMOS level).AC Electrical Characteristics: T A = 0°C to +70°C (Commercial), V DDQ3 = 3.3V ± 5%,T A = -40°C to +85°C (Industrial), V DDQ3 = 3.3V ± 5% (Lump Capacitance Test Load = 30pF)Parameter Description Test Condition Min.Typ.Max.Unitf IN Input Frequency (Commercial)0133MHzf IN Input Frequency (Industrial)0100MHzt R Output Rise Edge Rate Measured from 0.4V1.0 4.0V/nsto2.4V1.0 4.0V/nst F Output Fall Edge Rate Measured from 2.4Vto0.4Vt SR Output Skew, Rising Edges150pst SF Output Skew, Falling Edges150pst EN Output Enable Time 1.08.0nst DIS Output Disable Time 1.08.0nst PR Rising Edge Propagation Delay 2.5 5.0nst PF Falling Edge Propagation Delay 2.5 5.0nst D Duty Cycle Measured at 1.5V4555%Z o AC Output Impedance15:How To Use the Serial Data InterfaceElectrical RequirementsFigure1 illustrates electrical characteristics for the serial interface bus used with the W191. Devices send data over the bus with an open drain logic output that can (a) pull the bus line low, or (b) let the bus default to logic 1. The pull-up resistor on the bus (both clock and data lines) establish a default logic 1. All bus devices generally have logic inputs to receive data. Although the W191 is a receive-only device (no data write-back capability), it does transmit an “acknowledge” data pulse after each byte is received. Thus, the SDATA line can both transmit and receive data.The pull-up resistor should be sized to meet the rise and fall times specified in AC parameters, taking into consideration total bus line capacitance.Signaling RequirementsAs shown in Figure2, valid data bits are defined as stable logic 0 or 1 condition on the data line during a clock HIGH (logic 1)pulse. A transitioning data line during a clock high pulse may be interpreted as a start or stop pulse (it will be interpreted as a start or stop pulse if the start/stop timing parameters are met).A write sequence is initiated by a “Start Bit” as shown in Figure3. A “Stop Bit” signifies that a transmission has ended. As stated previously, the W191 sends an “acknowledge” pulse after receiving eight data bits in each byte as shown in Figure4.Sending Data to the W191The device accepts data once it has detected a valid start bit and address byte sequence. Device functionality is changed upon the receipt of each data bit (registers are not double buffered). Partial transmission is allowed meaning that a trans-mission can be truncated as soon as the desired data bits are transmitted (remaining registers will be unmodified). Trans-mission is truncated with either a stop bit or new start bit (restart condition)..Figure 1. Serial Interface Bus Electrical CharacteristicsFigure 2. Serial Data Bus Valid Data BitFigure 3. Serial Data Bus Start and Stop BitFigure 4. Serial Data Bus Write SequenceFigure 5. Serial Data Bus Timing Diagrams Ordering InformationWhile SLI has reviewed all information herein for accuracy and reliability, Spectra Linear Inc. assumes no responsibility for the use of any cir-cuitry or for the infringement of any patents or other rights of third parties which would result from each use. This product is intended for use in normal commercial applications and is not warranted nor is it intended for use in life support, critical medical instruments, or any other applica-tion requiring extended temperature range, high reliability, or any other extraordinary environmental requirements unless pursuant to additional processing by Spectra Linear Inc., and expressed written agreement by Spectra Linear Inc. Spectra Linear Inc. reserves the right to change any circuitry or specification without notice.Package DiagramsShrink Small Outline Package (SSOP 150 inch)。

BOSE 191隐藏式扬声器 说明书

BOSE 191隐藏式扬声器 说明书

191隐藏式扬声器May 13,2003 AM267565_00_V.pdf下列这些操作说明只适用于在木结构或类似结构上安装 在墙体或天花板中安装扬声器时,每只扬声器安装所需的水平方向的空间距离为81/16 英寸(20.5cm),垂直方向的空间距离为14英寸(35.6cm),至墙板表面的深度至少为 41/8英寸(10.5cm),而且墙板的厚度不应超过1英寸(2.5cm)。

Bose公司建议将这些扬声器只安装在木结构或其它类似结构的墙体或吊顶中,而且墙 体或吊顶的柱子之间需有足够的安装空间,柱子的截面为2×4或4×6英寸。

本指南中 的操作说明是针对这类安装条件的。

注意:该扬声器不是为安装在砖石墙体或吊顶中而设计的。

重要警告事项警告:安装必须符合美国国家电气规范ANSI/NFPA70 和/或 美国国家火警规范ANSI/  NFPA 72中的适用条款。

接线方式和安装空间必须不使扬声器的工作受到干扰。

小心: 在开始安装之前参阅当地的相关建筑规范。

在开始之前请完整地阅读该用户指南。

然后仔细考虑您使用工具的经验和这里涉及的需引起注意的事项。

小心:如果没有按照用户指南中的说明安装所造成的扬声器损坏不在保修范围内。

如果您对安装过程没有把握,您需与专业安装人员联系。

在接受安装人员服务之前,您可向他描述工作的情况并要求提供大致的安装花费。

手册中的提示内容有助于避免您在安装中产生错误。

2简介------------------------------------------------------4 开始之前------------------------------------------------4 使音质效果更佳的结构特点---------------------------------4准备------------------------------------------------------5 拆箱事宜------------------------------------------------5 所需的其它设备-----------------------------------------5 考虑您所要的扬声器形状----------------------------------6 考虑墙体的类型和所需的安装方式-------------------------------6 附件------------------------------------------------7 在抹灰条板墙上开孔时需格外小心----------------------------7 在有预埋线的房间中安装----------------------------------7 确定扬声器的布置------------------------------------------8 选择扬声器在墙面上安装的初步位置---------------------------9 扬声器连接线的使用----------------------------------------11 连接线的准备-----------------------------------------11 扬声器连接线的布线----------------------------------------11 墙板安装之前-----------------------------------------13 在已完成施工的墙上布线----------------------------------13安装步骤--------------------------------------------------15 开孔之前-----------------------------------------------15 钻一个引导孔用于检查墙体内的空间-----------------------------15 初次使用安装模板--------------------------------------15 钻引导孔--------------------------------------------17 检查开孔后面的空间-------------------------------------18 引导孔的修补-----------------------------------------20 完成引导孔的检测--------------------------------------20 准备装入扬声器的墙面--------------------------------------21 再次使用安装模板--------------------------------------21 扬声器安装孔的切割-------------------------------------22 将扬声器放人安装孔并接线-----------------------------------23 将扬声器装入安装孔-------------------------------------24 扬声器的接线-----------------------------------------26 测试扬声器------------------------------------------26 扬声器与墙体的固定----------------------------------------28 如果扬声器看起来不平整----------------------------------29 当扬声器面罩安装完成后----------------------------------29 扬声器的油漆--------------------------------------------29 面罩的油漆-------------------------------------------30 框架的油漆-------------------------------------------31参考资料--------------------------------------------------32 故障检修-----------------------------------------------32 售后服务-----------------------------------------------32 保修期-------------------------------------------------32 附件--------------------------------------------------33 技术资料-----------------------------------------------33用户记录产品序列号在每只191隐藏式扬声器的左侧靠近顶面的位置。

天龙AVR-1911中文说明书

天龙AVR-1911中文说明书

警告:
為避免發生火災或觸電危險,請勿將本裝置暴露於雨中 或潮濕環境下。
注意:
表面高溫,請勿觸碰。
表面高溫 標記 持續使用本產品時,內部散熱器的上方表面溫度 會升高。 請勿觸碰高溫區域,尤其是「表面高溫標記」以 及上方面板附近。
注意:
若要完全中斷本產品與主機的連接,請將插頭從壁式插座中拔下。 由於主機插頭可用來完全中斷機體的電源,因此必須方便使用者 插拔。
目錄
開始操作 ............................................................................... 1 配件 ................................................................................. 1 關於本手冊 ...................................................................... 1 產品特色 .......................................................................... 2 搬運注意事項 ................................................................... 2
注意:
為避免觸電危險,請勿開啟護蓋(或後蓋)。用戶不可 自行維修內部零件,請交由合格的服務人員進行維修。
等邊三角形內有箭頭的閃電符號,用意在於警 告用戶產品內部有未絕緣的「危險電壓」,其 程度足以造成人員觸電的風險。 等邊三角形內的驚嘆號,用意在於警告用戶注 意本設備隨附文件中的重要操作指示及保養 (維修)說明書。

HD 191 预制型水压比例器系统(预制型水泡比例器储蓄膜袋)说明书

HD 191 预制型水压比例器系统(预制型水泡比例器储蓄膜袋)说明书

SISTEMA DOSIFICADOR DE DEPÓSITO DE MEMBRANA PREMONTADO(BLADDER TANK PROPORTIONING SYSTEM PRE-PIPED)DATOS TÉCNICOSAPLICACIÓNEl sistema dosificador de espuma de depósito de membrana utiliza presión de agua para inyectar concentrado de espuma en el suministro de agua y proporciona automáticamente concentrado de espuma a través de un amplio rango de flujo y presión, con una bajada de presión muy baja. Este sistemano requiere una bomba de suministro de concentrado de espuma.ESPECIFICACIÓNEl sistema dosificador de espuma de depósito de membrana está disponible con depósitos de membranas horizontales y verticales. Los depósitos de acero al carbono están diseñados y construidos de acuerdo con la sección del código ASME VIII Div. 1 para recipientes a presión expuestos a llama.La presión máxima de trabajo es 12 Bar (175 PSI). El montaje del depósito vertical está soportado por patas soldadas al depósito con accesorios para su anclaje. Los depósitos horizontales están apoyados con dos fijaciones soldadas al depósito y perforadas para su anclaje. El depósito tiene orejetas de elevación.El sistema está suministrado con un recipiente de presión, membrana, válvula de llenado y de drenaje y concentradoMONTAJE DE Vertical u H orizontal DEPÓSITO TIPO CONCENTRADO Para depósito vertical 200 litros CAPACIDAD ALM.hasta 7500 litros (53 A 2000 Galones (EEUU)) Para depósito horizontal 200 litros a 15000 litros (53 a 4000 Galones (US))PRESIÓN MÁXIMA 12 Bar (175PSI) Sumin. estándar TRABAJOSe puede poporcionar presión nominal más elevada a petición PRUEBA PRESIÓN Según código ASME HIDRÁULICA CONSTRUCCIÓN Acero al carbonoRECIPIENTEsegún código ASME sección VIII Div 1, pararecipientes a presión expuestos a llama. CE Marking Opcional ASME “U” STAMP Opcional BLADDER Buna-N TUBO CENTRALPVC perforadoTUBERÍAEXTERNALado agua: Acero al carbono sin soldaduras sch 40Lado concentrado de espuma: Acero inoxidable sch 40CONTROLADOR Tipo wafer con acero inoxidable DE RATIO304/CF8 estándar Opcional: Acero inoxidable 316/CF8M o bronce VENTILACIÓN Y PURGA Válvula bola APROBACIONES Listado ULSUMIN.OPCIONAL Consultar página 3ACABADORojo RAL 3000INFORMACIÓNPEDIDO ESPECIFICAR:1)Tipo de depósito, vertical u horizontal2)Capacidad almacen.3)Nº modelo,tamaño de controlador de ratio con flujo y presión4)Tipo de concentrado de espuma a utilizarse y porcentaje inducción necesario5)Elementos opcionalesde espuma, controlador de ratio y válvula de ventilación. A petición se pueden suministrar una escalera y un indicador visual como elementos opcionales.Todas las válvulas están etiquetadas mostrando una posición y función de trabajo normal.Todos los depósitos tienen un gran tamaño para permitir la expansión de todos los concentrados, si hay alguno. PRINCIPIO DE FUNCIONAMIENTOLas instrucciones para rellenarlo están proporcionadas con el equipo. Una vez que se haya establecido el flujo de agua principal y que se abran las válvulas de entrada y de salida, el agua entra en el área entre la pared del recipiente y la membrana, aplicando presión a la membrana. El agua que fluye a través del chorro del controlador de ratio crea una zona de bajas presiones comunes al flujo de agua hacia abajo y el concentrado de agua. Esto inyecta el concentrado en el controlador de ratio a través de un orificio dimensionado proporcionado a un venturi de agua. Esto garantiza una dosificación correcta a través de un amplio rango de condición de flujo.El sistema dosificador de depósito de membrana funciona con el mismo principio que el de un sistema dosificador de presión de equilibrio. El concentrado de espuma se inyecta en el controlador de ratio utilizando presión de agua.El sistema también se suministra con una válvula de control de concentrado de espuma como elemento opcional .La válvula permite fluljo de concentrado sólo cuando se establece en el sistema una presión de agua de 2,1 kg/cm2 . Para una bajada de presión y de características de flujo consulte el catálogo de controlador de ratio. Para bajada de presión y características de flujo consulte el contrlador de ratio.SELECCIÓN DE DEPÓSITOS DE MEM-BRANA HORIZONTALES / VERTICALES Ventajas de los depósitos horizontales(i)Mejor estabilidad que los depósitos verticales en zonaspropensas a terremotos(ii)Más fáciles de rellenar que los depósitos verticales (iii)Más fáciles de transportar, almacenar e instalar(iv)Gran capacidadVentajas de los depósitos verticales(i)Precisa menos espacio en el suelo que los depósitoshorizontalesINSTALACIÓN, INSPECCIÓN Y MANTEN-IMIENTOEn cada unidad hay embalado un manual de instalación, inspección y mantenimiento. El manual proporciona procedimientos detallados en esquemas, procedimiento inicial, inspección y mantenimiento. El manual de instrucciones ha de ser leído con atención cuidado y seguirse durante la instalación y puesta en marcha del sistema.Después de varias pruebas exitosas iniciales una persona autorizada ha de recibir la formación para realizar inspecciones y comprobaciones del sistema. Es recomendable llevar a cabo inspecciones físicas del sistema con regularidad, la inspección debe verificar que no hay daños en ningún componente y que todas las válvulas están en su posición correcta según los requisitos del sistema. El sistema debe ser revisado completamente al menos una vez al año y de acuerdo con el código NFPA aplicable o de acuerdo con las directrices de la organización que tenga jurisducción local.No desconecte el sistema ni ninguna válvula para reparar o comprobar el sistema sin colocar una patrulla de incendios itinerante en la zona cubierta por el sistema. La patrulla debería seguir activa hasta que el sistema vuelva a ponerse en servicio. Informe también al personal local de seguridad y a la sala de control por si una falsa alarma no fuera comunicada.PRECAUCIÓN1)No suele en el depósito ya que puede dañar lamembrana equipada dentro del depósito.2)Liberar la presión antes de una inspección ymantenimiento del sistema.3)El indicador visual no es hermético, o sea que antestomar la lectura del concentrado, se ha de liberar la presión del depósito.4)El depósito de membrana se ha de instalar debajo desombra para evitar la radiación directa del sol en el equipo.5)Mientras diseña sistemas de espuma, se tienen quetomar medidas para permitir la eliminación de los tubos internos centrales. Los tubos centrales son de longitud total y/o altura del depósito de membrana. 6)El código ASME puede precisar una protección contrala sobre presión antes de presurizar el sistema. HD FIRE no suministra una válvula de descarga de presión con los depósitos. Es la responsabilidad del propietario proporcionar la protección contra la sobre presión para el depósito de acuerdo con el código ASME.7)Se ha de seguir el procedimiento de llenado deconcentrado. Un procedimiento de llenado incorrecto pueden dañar la membrana. El producto HD tiene la garantía limitada y un procedimiento de llenado incorrecto anulará la garantía.NOTA1)El concentrado de espuma se tiene que llenar en lamembrana con mucho cuidado para evitar la rotura de la membrana. Las directrices de llenado proporcionadas con el equipo han de cumplirse estrictamente.2)Suministro de aire con regulador (0 a 1.0 kg/cm2)necesario durante el procedimiento de llenado, ha serdispuesto por el instalador / usuario.3)Suministro de agua a 0-1.5 kg/cm2 necesario para elllenado del depósito durante la puesta en servicio a ser dispuesta por el instalador / usuario.4)La bomba de llenado del concentrado ha de serdispuesta por el instalador / usuario.5)Se debe proporcionar una longitud mínima de 5(cinco)veces el diámetro de la tubería recta sin obstrucciones en la entrada y salida del controlador de ratio, donde el diámetro de la tubería es el tamaño nominal del controlador de ratio.SUMINISTRO OPCIONAL•Indicador visual con válvula de cierre y drenaje (material de vidrio o de policarbonato)•Escalera•Válvula de control de concentrado•Kit de llenado•Tubería de acero inoxidable para lado de suministro de agua•Tubería de acero inoxidable y suministro estándar de válvulaSS304/CF8.Opcionales son : SS316/CF8M o SS316L•Pintura según requisito específico•Depósitos diseñados contra seísmos•Diseñados a medida para mayor potencia, materiales y dimensiones•Revestimiento interno de alquitrán epóxico, suministro estándar o cualquier otra pintura, según requisitos del cliente•Material de controlador de ratio de bronce, acero inoxidableCF8, CF8M•La válvula de descarga no está incluida en el suministro estándar, es opcional según el requisito específico del clienteVÁLVULA DE DESCARGA (SUMINISTRO OPCIONAL)(i)Válvula de seguridad(ii)Flujo total según ASME(iii)Flujo total, sello “U”LISTADO Y APROBACIÓN1)El sistema dosificador de depósito de membrana estálistado UL sistema canalizado.2)Listado y Aprobación sólo es válido de las formasindicadas en el Listado y Aprobación aplicables. DETALLES DE ENVÍOi)Todas las aberturas del depósito serán tapadas para suenvío.ii)Todas las tuberías canalizadas, válvulas, indicadores de presión indicadores visuales, etc. estarán embaladas aparte para su envío.iii)El depósito se montará en un palet, con tablones como sistema de embalaje estándar de HD FIRE.Para cualquier requisito de embalaje personalizado, póngase en contacto con HD Sales.SISTEMA DOSIFICADOR MANUAL DE DEPÓSITO DE MEMBRANA VERTICALSISTEMA DOSIFICADOR AUTOMÁTICO DE DEPÓSITO DE MEMBRANA VERTICALINLETWANº VÁLVULADESCRIPCIÓNPOSICIÓN NORMALSISTEMA MANUALSISTEMA AUTOV1VÁLVULA DE CIERRE DE CONCENTRADO DE CERRADA ----V1A VÁLVULA DE CIERRE DE CONCENTRADO DE ----CERRADA V2VÁLVULA DE CIERRE DE PRESIÓN DE AGUA ABIERTA ABIERTA V3VÁLVULA DE DRENAJE DE DEPÓSITO DE AGUA CERRADA CERRADA V4VÁLVULA DE VENTILACIÓN DE DEPÓSITO AGUA CERRADA CERRADA V5VENTILACIÓN DE CONCENTRADOCERRADA CERRADA V6VÁLVULA LLENADO CONCENTRADO / DRENAJE CERRADA CERRADA V7INDICADOR VISUAL VÁLVULA DE LLENADO CERRADA CERRADA V8INDICADOR VISUAL VÁLVULA DE DRENAJE CERRADA CERRADA B1VÁLVULA DE ANULACIÓN MANUAL ----ABIERTA B2VÁLVULA EN REPOSO----CERRADASÍMBOLOS Y ABREVIATURAI N D I C A D O R V I S U A LI N D I C A D O R V I S U A LSISTEMA DOSIFICADOR MANUAL DE DEPÓSITO DE MEMBRANA HORIZONTALSISTEMA DOSIFICADOR AUTO DE DEPÓSITO DE MEMBRANA HORIZONTALINLETWA TER V8V8Nº VÁLVULADESCRIPCIÓNPOSICIÓN NORMALSISTEMA MANUALSISTEMA AUTOV1VÁLVULA DE CIERRE DE CONCENTRADO DE CERRADA ----V1A VÁLVULA DE CIERRE DE CONCENTRADO DE ----CERRADA V2VÁLVULA DE CIERRE DE PRESIÓN DE AGUA ABIERTA ABIERTA V3VÁLVULA DE DRENAJE DE DEPÓSITO DE AGUA CERRADA CERRADA V4VÁLVULA DE VENTILACIÓN DE DEPÓSITO AGUA CERRADA CERRADA V5VENTILACIÓN DE CONCENTRADOCERRADA CERRADA V6VÁLVULA LLENADO CONCENTRADO / DRENAJE CERRADA CERRADA V7INDICADOR VISUAL VÁLVULA DE LLENADO CERRADA CERRADA V8INDICADOR VISUAL VÁLVULA DE DRENAJE CERRADA CERRADA B1VÁLVULA DE ANULACIÓN MANUAL ----ABIERTA B2VÁLVULA EN REPOSO----CERRADASÍMBOLOS Y ABREVIATURAGARANTÍA LIMITADAHD FIRE PROTECT PVT. LTD. a partir de ahora referida como HD FIRE garantiza al comprador original de los productos de protección contra incendios fabricados por HD FIRE y a cualquier otra persona a quien se transfiera ese equipo, que ese esos productos estarán libres de defectos en materiales y mano de obra con uso y cuidado normales, y dos(2) años desde la fecha del envío por parte de HD FIRE. Los productos o los componentes que hayan sufrido mal uso, una instalación inadecuada, corrosión, una reparación no autorizada, alteración o no mantenida perderán la garantía. HD FIRE no debe ser responsabilizado por errores de diseño de sistema o instalación inadecuada o información inexacta o incompleta suministrada por el comprador o por los representantes del comprador. HD FIRE reparará o sustituirá material defectuoso que se devuelva a fábrica sin costo alguno, con los gastos de transporte prepagados, despues de que hayamos inspeccionado el material defectuoso en el momento de inicial de envío desde nuestra fábrica. HD FIRE no será responsable de ninguna pérdida fortuita o accidental, daño o gasto resultante directamente o indirectamente del uso del producto incluidos daños o lesiones a personas, daños a la propiedad y sanciones resultantes de cualquier producto o componente fabricado por HD FIRE. HD FIRE no será responsable de cargas laborales o gastos de la reparación o ajuste del producto. HD FIRE no será responsable de ningún daño o gastos relacionados con la adaptación o uso de sus datos y servicios de ingeniería. En ningún caso la responsabilidad de los productos de HD Fire superará un importe igual al precio de venta. La presente garantía es exclusiva y sustituye al resto de otras garantías y representación ya sea expresada, implícita, ral o por escrito, incluida pero no limitada a, ninguna garantía implícita o comerciabilidad o aptitud para un propósito en particular. Por lo tanto el resto de garantías y representaciones están canceladas.NOTA:El equipo presentado en este boletín se tiene que instalar de acuerdo con los últimos estándares de publicación del NFPA u organizaciones similares y también con la presentación de códigos gubernamentales u ordenanzas cuando sea aplicable.La información proporcionada por nuestra parte es según nuestro leal saber y creencia, y son sólo directrices generales. La gestión del sitio y el control de la instalación están fuera de nuestro alcance. Por lo tanto no damos garantía por el resultado y no nos responsabilizamos de daños pérdidas o sanciones sean las que sean, resultado de nuestrassugerencias, información, recomendación o daños debido a nuestro producto.El desarrollo de producto es un programa continuo de HD FIRE PROTECT PVT.LTD.y por lo tanto el derecho a realizar modificaciones sin previo aviso es exclusivo de la empresa.D-6/2, ROAD NO 34, WAGLE INDUSTRIAL ESTATE, THANE 400604, INDIA.•TELÉFONOS : + (91) 22 21582600 • 2582 6958 • 2582 6793• FAX : +(91) 22 2581 2524 • 21582602•EMAIL:**********************:HD FIRE PROTECT PVT . LTD.Protecting What Matters Most to You。

GigaVUE HC系列产品数据手册说明书

GigaVUE HC系列产品数据手册说明书

GigaVUE HC SeriesScalable Traffic Intelligence for Small to Large Enterprises and Service ProvidersKey BenefitsThe GigaVUE HC series consists of three models: GigaVUE-HC1, GigaVUE-HC2, and GigaVUE-HC3.Management, Integration, and InstallationSmall footprint with low space, power and cooling needs Modular for flexibility and scalability as needs change Rapid programmatic response to detectable events Advanced integration with tools, controllers and other infrastructure systemsTraffic Forwarding for Network and Security Operations Optimize the delivery of your network traffic to your monitoring and security tools, enabling:• Eliminating contention for network data access• Targeting specific flows to specific tools with network and application awareness• Sharing traffic load across multiple tools’ instances, even for encapsulated trafficSelectively aggregate and replicate traffic at line rate Optimize the content of the delivered traffic, enabling:• Removing duplicate packets• Feeding non-packet based tools with flow and/or rich meta data• Removing unwanted/undesirable protocol headers and/or payload content• Obfuscating private or sensitive dataReuse existing tools for current and new network links Scale network coverage and tool deployment, with USB MGMT PTP CON RDY PTPPPS FAN PWRM/SSTACK STACK P/S PPS(IN)RDY POWERH/SSMT-HC3-C05C5C4C3C2C1RDYPOWERH/SPRT-HC3-X24X1/X2X3/X4X5/X6X7/X8X9/X10X11/X12X13/X14X15/X16X17/X18X19/X20X21/X22X23/X24RDY POWERH/SPRT-HC3-X24X1/X2X3/X4X5/X6X7/X8X9/X10X11/X12X13/X14X15/X16X17/X18X19/X20X21/X22X23/X24RDYC1C2C3C4C5C6C7C8POWERH/SPRT-HC3-C08Q08X1/X2RDY PWR FAN PTP PPS M/SStack/PTP Mgnt / Con G1 / G2G3 / G4USB X3/X4X5/X6X7/X8X9/X10X11/X12TAP1TAP2TAP3TAP4RDY POWER ON/OF TAP1TAP2TAP3TAP4RDYPOWER ON/OF Fan PPS RearRdy PwrM/SLockPTPIEEE 1588StackMgmt PortMgmtCon-soleGigaVUE-HC211234T A P H C 0G 100C 0RdyPwrTAP 1TAP 2TAP 3TAP 4TAP 5TAP 6TAP 7TAP 8TAP 9TAP 10TAP 11TAP 12X1X2RdyPwr S M T H C 0X 16X3X4X5X6X7X8X9X10X11X12X13X14X15X16H/SX1X2RdyPwr B P S H C 0D 25A 4GX3X4X5X6X7X8X9X10X11X12X13X14X15X16SX / SR50 umP R T H C 0Q 06Rdy Pwr Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENAAs a key product family within the Gigamon Visibility and Analytics Fabric™, the GigaVUE HC series enables comprehensive traffic and security intelligence at scale. These next-generation network packet brokers are an ideal choice to enhance your security and monitoring solutions.inline and out-of-band security and monitoring tools.GigaVUE HC Series is used to provide visibility for active and passive security as well as network and application monitoring.The GigaVUE HC Series Modelsacross medium-sized branch offices.GigaVUE-HC3A 3RU form factor offers trafficintelligence at scale to meet thedemands of large enterprises andservice providers.GigaVUE-HC3GigaVUE-HC3Key Features and BenefitsNetwork and Traffic Access Three modular chassis models with portspeed and media options:• 100Mb, 1000Mb and 10Gb copper• 1Gb, 10Gb, 25Gb, 40Gb and 100Gbmultimode and single-mode fiberCompatible with SFP, SFP+, QSFP+ andQSFP28 MSA-compliant transceivers,as offered by Gigamon • Scale from low to high density systems:–Cost-effective for only whatis needed–Increased flexibilityPort configurability:• Full flexibility in selecting ports as ingress, intermediate, interconnect or egress functions• Unidirectional and bi-direction ports • Tunneling (e.g. L2GRE, ERSPAN, TCP, VXLAN)• Enable agile response to changes in monitoring infrastructure and monitoring needs• Facilitate passive out-of-band and active inline monitoring via the same HC node• Allow virtualized traffic to be accessed, or backhauled between locations, over an IP network – and with reliable delivery (using TCP)Core Intelligence Flow Mapping®:• Aggregation and replication–Selective any-to-any port mapping• Filtering–Layer 2 to 7 rules–Ingress aggregate and egress• Load-balancing–Layers 2 to 4 hashing criteria–Session stickiness • Access traffic from any link to any tool, even for different link rates• Remove issues with asymmetric routing and link aggregation (LAG)• Optimize tools by forwarding only traffic of interest or dropping traffic not of interest• Spread load across multiple tool instances of same typeInline Bypass:• Optional physical bypass for100M/1G/10G/25G/40G/100G link rates and copper/fiber (multimode, single mode) media types• Aggregate multiple network segments • Filter and load-balance towards inline applications/tools• Easily configure simple and complex tool chains• Customizable heartbeat packets for positive (through-path) and negative (block) tests • Remove multiple points of network failure• Provide full visibility for each inline security tool type (e.g. IPS, WAF)• Easily deploy security in layers solutions, for both active and passive scenarios• Seamlessly migrate tools from passive out-of-band to active inline mode • Reduce likelihood of network impact due to malfunctioning active inline toolsVLAN port tagging• Pinpoint source of traffic Clustering and Fabric Mapping• Enable resilient traffic forwarding• Manage up to 32 nodes in a cluster asa single virtual node• Enact end-to-end Flow Mapping,across clusters, scaling to hundredsof nodesTraffic Intelligence Adaptive packet filtering, Advancedload-balancing, Deduplication, Headerstripping, Masking, NetFlow generation,Slicing, SSL/TLS decryption, Advancedtunneling, Advanced flow slicing Refer to the GigaSMART® datasheet found hereApplication Intelligence Application Filtering, ApplicationMetadata, Video Data Records Refer to the GigaSMART datasheet found hereSubscriber Intelligence Flow Sampling, GTP Correlation,SIP/RTP Correlation, 5G & CUPScorrelation, Subscriber-aware Metadata*Refer to the GigaSMART datasheet found hereNetwork Detection ThreatINSIGHT Sensor Refer to the GigaSMART datasheetfound hereManagement Local and remote management using:• Command line interface (CLI)(T elnet/SSH)• Web GUI (HTTP/HTTPS)• XML API (HTTP/HTTPS)• Fabric Manager (HTTP/HTTPS)• SNMP (v1, v2, v3)• Syslog • Easy to manage via a web GUI or via CLI for users already familiarwith Cisco• Easy integration with applications using CLI or RESTful API• Support SDN paradigm• Manage and orchestrate from single pane of glass• Alerts can be received by any Syslog server or SNMP managerUser access:• Role-based Access Control (RBAC) –Multi-tenant user access–Flexible user/role definedprivileges, screen viewsand access• AAA security with local and remote authentication (LDAP, RADIUS, TACACS+)• Adhere to corporate IT security policies• Meet corporate IT authentication policySystem Field replaceable hardware:• Port modules• AC and DC power supplies• Fan trays• Control card • Achieve five nines highly available uptime• Without needing to replace or remove the chassis, you can:–Scale as needs change–Upgrade features and capabilitiesMetrics and statistics:• Management CPU resources • Switching ASIC resources • Port utilization• Flow map throughput • Facilitate troubleshooting• Guide capacity planning and traffic forward rules* Available with 5.11 releaseChassis Maximum CapabilitiesATTRIBUTE GIGAVUE-HC1GIGAVUE-HC2GIGAVUE-HC3 Size Small (1RU)Medium (2RU)Large (3RU) Throughput604Gbps960Gbps 6.4Tbps No. of port modules244No. of GigaSMART modules 3 (2 front, 1 built-in) 5 (4 front, 1 rear) 4 (front) No. of GigaSMART engines358 (2 per module) No. of ports and speeds10/100Mb20 (4 built-in UTP)72***-1Gb40 (12 built-in SFP+ and 4built-in UTP)96-10Gb36 (12 built-in SFP+)9612825Gb--12840Gb82464100Gb-8‡64Physical bypass options10/100/1000Mb copper,1/10Gb SX/SR Fiber 10/100/1000Mb copper,1/10Gb SX/SR Fiber,1/10Gb LX/LR Fiber,40Gb SR4 Fiber40/100Gb SR4 Fiber,10/25Gb SR Fiber(using breakout),40/100Gb LR4 Fiber*** Using module with SKU TAP-HCO-G100C0Field Swappable Port and GigaSMART ModulesPRODUCT DESCRIPTIONGigaVUE-HC1 Modules PRT-HC1-X1212 x 1Gb/10Gb (SFP/SFP+) portsPRT-HC1-Q04X08* 4 x 40Gb (QSFP+) & 8 x 1Gb/10Gb (SFP/SFP+) ports• QSFP+ Port Modes: 1 x 40Gb or 4 x 10GbBPS-HC1-D25A241Gb/10Gb Bypass combo module• 2 pairs of SX/SR 50/125μm Bypass + 4 x 10Gb/1Gb(SFP+/SFP) ports• 100Mb/1000Mb embeddedTAP-HC1-G10040TAP and Bypass module• 4 pairs of copper (RJ-45) TAP or Bypass• Each pair can be individually configured as TAPor Bypass• 100Mb/1000Mb embeddedSMT-HC1-S Third generation GigaSMART front module with:• One GigaSMART engine• No front portsRefer to the GigaSMART datasheet found here formore informationGigaVUE-HC2 Modules PRT-HC0-X2424 x 10Gb/1Gb (SFP+/SFP) ports modulePRT-HC0-Q06 6 x 40Gb (QSFP+) ports modulePRT-HC0-C02 2 x 100Gb (QSFP28) ports module• Supports 100GBASE-SR4• PRT-HC0-C02 requires Control Card Version 2• 40Gb Bypass and 1Gb/10GbBPS-HC0-Q25A28Combo module• 2 pairs of 40G SR4 Bypass + 8 x 10Gb/1Gb (SFP+/SFP)ports• 1Gb/10Gb BypassBPS-HC0-D25A4G Combo module• 4 pairs of SX/SR 50/125μm Bypass + 16 x 10Gb/1Gb(SFP+/SFP) ports• 1Gb/10Gb BypassBPS-HC0-D35C4G Combo module• 4 pairs of LX/LR single-mode Bypass + 16 x 10Gb/1Gb(SFP+/SFP) ports• 1Gb/10Gb Bypass* Available with 5.11 releaseGigaVUE-HC2 Modules TAP-HC0-D25AC0TAP module• 12 x SX/SR 50/125μm TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-D25BC0TAP module• 12 x SX/SR 62.5/125μm TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-D35CC0TAP module• 12 x LX/LR TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-G100C0TAP and Bypass module• 12 x copper (RJ-45) TAP or Bypass pair• Each pair can be individually configured as TAP or Bypass• 100Mb/1000Mb embeddedSMT-HC0-Q02X081Second generation GigaSMART front module with:• One GigaSMART engine• 2 x 40Gb (QSFP+), 8 x 10Gb/1Gb (SFP+/SFP) portsRefer to the GigaSMART datasheet found here formore informationSMT-HC0-X16First generation GigaSMART front module with:• One GigaSMART engine• 16 x 10Gb/1Gb (SFP+/SFP) portsRefer to the GigaSMART datasheet found here formore informationSMT-HC0-R First generation GigaSMART rear module with:• One GigaSMART engine• No portsRefer to the GigaSMART datasheet found here formore information1 SMT-HC0-Q02X08 requires Control Card Version2 (CTL-HC0-002)GigaVUE-HC3 Modules PRT-HC3-C16216 x 100Gb/40Gb (QSFP28/QSFP+) ports module• Port Modes: 1 x 100Gb/40Gb, 4 x 25Gb1 or 4 x 10Gb1PRT-HC3-C08Q088 x 100Gb QSFP28 ports module• Port Modes: 1 x 100Gb, 2 x 40Gb, 4 x 25Gb1, 2 or4 x 10Gb1PRT-HC3-X2424 x 25Gb2/10Gb (SFP28/SFP+) ports module• Port Modes: 1 x 25Gb/10GbBPS-HC3-C25F2G100Gb/40Gb/25Gb/10Gb Bypass combo module• 2 x 100Gb/40Gb SR4 Bypass pairs• Up to 8 x 10Gb SR Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsBPS-HC3-Q35C2G40Gb/25Gb/10Gb Bypass combo module• 2 x 40Gb LR4 Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsBPS-HC3-C35C2G100Gb/40Gb/25Gb/10Gb Bypass combo module• 2 x 100Gb LR4 Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsSMT-HC3-C05GigaSMART front module with:• Two GigaSMART engines• 5 x 100Gb QSFP ports• Port Modes: 1 x 100Gb, 1 x 40Gb, 4 x 25Gb1, 2 or4 x 10Gb1Refer to the GigaSMART® datasheet found here formore information.1 Requires MPO-to-4xLC breakout cable or the PNL-M341 or PNL-M343 modules for G-TAP M Series2 Requires Control Card Version 2 (CTL-HC3-002)Physical Dimensions and WeightsPRODUCT NAME HEIGHT WIDTH DEPTH WEIGHTGigaVUE-HC1GigaVUE-HC1base chassis(includes built-insecond generationGigaSMART engine)1.75in (4.5cm)17.26in (43.85cm)without ears19.5in (495mm)With PSU handleand card ejector:20.92in (53.18 cm)20.88lbs (9.47kg)With ears: 21.12lbs(9.58kg)PRT-HC1-X12 1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (0.68kg) PRT-HC1-Q04X08 1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (0.68kg) BPS-HC1-D25A24module1.6in (4.10cm) 4.65in (11.80cm)10.13in (24.98cm)2.2lb (0.99kg)TAP-HC1-G10040module1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (.68kg) SMT-HC1-S* 1.6in (4.10cm) 4.65in (11.80cm)10.13in (24.98cm)2.54lb (1.15kg)GigaVUE-HC2GigaVUE-HC2base chassis 2RU3.5in (8.9cm)17.26in (43.85cm)without ears24.2in (61.6cm)without cablemanagement27.0in (68.6cm)with cablemanagement36.8lbs (16.7kg)PRT-HC0-X24module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.12lbs (0.96kg)PRT-HC0-Q06module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.40lbs (1.09kg)PRT-HC0-C02module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.30lbs (1.09kg)BPS-HC0-Q25A28 module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.14lbs (1.42kg)BPS-HC0-D25A4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)BPS-HC0-D25B4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)BPS-HC0-D35C4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)TAP-HC0-D25AC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-D25BC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-D35CC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-G100C0module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.20lbs (1.45kg) * Available with 5.10 releasePRODUCT NAME HEIGHT WIDTH DEPTH WEIGHT GigaVUE-HC2SMT-HC0-Q02X08module1.6in (4.1cm)8.0in (20.3cm)10.2in (26.0cm) 4.1lbs (1.86kg)SMT-HC0-X16module1.6in (4.1cm)8.0in (20.3cm)10.2in (26.0cm) 4.40lbs (2.00kg)SMT-HC0-Rmodule1.6in (4.1cm)9.3in (23.5cm)13.2in (33.6cm) 4.40lbs (2.00kg)0GigaVUE-HC3GigaVUE-HC3base chassis 3RU5.25in (13.34cm)17.26in (43.85cm)without ears29.1in (74.0cm)without cablemanagement33.5in (85.0cm)with cablemanagement88.0lbs (40.00kg)PRT-HC3-C16module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.00lbs (2.72kg)PRT-HC3-C08Q08 module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm)2.40lbs (1.09kg)PRT-HC3-X24module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm)2.12lbs (0.96kg)BPS-HC3-C25F2Gmodule1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.40lbs (2.90kg)BPS-HC3-Q35C2G module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.05lbs (2.74kg)BPS-HC3-C35C2G module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.05lbs (2.74kg)SMT-HC3-C05module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 4.40lbs (2.00kg) Power SpecificationsPRODUCT LINE COMPONENT SPECIFICATIONSGivaVUE-HC1Power Configurations• 1 + 1 Power: 2 Power Supply ModulesMax power consumption/heat output • 212 Watts; 722.9 BTU/hr• Fully populated system with all ports at 100 percent traffic loadAC power supply modules • Min/max voltage: 100V–127V AC, 200V–240V AC, 50/60Hz • Max PSM input current: 5.8A @ 100V, 2.9A @ 200VDC power supply modules • Min/max voltage: -40.5V to -60V DC • MaxPSMinputcurrent:**********PRODUCT LINE COMPONENT SPECIFICATIONS GivaVUE-HC2Power configurations• 1 + 1 power: 2 power supply modulesMax power consumption/heat output • 960 Watts; 3276 BTU/hr (Control Card Version s 1 and 2)• Fully populated system with all ports at 100 percent traffic loadAC power supply modules• Min/max voltage: 100V–240V AC, 50/60Hz, 8.4A @ 200 V• Max PSM input current: 14.0A @ 100VDC power supply modules• Min/max voltage: -36V to -72V DC• Max PSM input current: 35A @ -36VGivaVUE-HC3Power configurations• 1 + 1 power: 2 power supply modules• 2 + 2 power: 4 power supply modulesMax power consumption/heat output • 1850 Watts; 6312.4 BTU/hr (Control Card Version 1)• 2000 Watts; 6824.3 BTU/hr (Control Card Version 2)• Fully populated system with all ports at 100 percent traffic loadAC power supply modules • Min/max voltage: 100V–115V AC, 200V–240V AC, 50/60Hz • Max PSM input current: 14A @ 100V, 10A @ 200VDC power supply modules• Min/max voltage: -40V to -72V DC• Max PSM input current: 48A @ -40VEnvironmental SpecificationsASPECT SPECIFICATIONSOperating temperature32.F to 104.F (0.C to 40.C)Operating relative humidity20–80 percent, non-condensing Recommended storage temperature-4.F to 158.F (-20.C to 70.C) Recommended storage relative humidity15–85 percent, non-condensing Altitude Systems: Up to 13,000 ft (3.96km)Power Supply Modules: Up to 10,000 ft (3.05km)Standards and ProtocolsTYPE STANDARDSProtocols IEEE 802.3-2012, IEEE 802.1Q VLAN, IEEE 802.3 10BASE-T, IEEE 802.3u 100BASE-TX, IEEE 802.3ab 1000BASE-T, IEEE 802.3z 1000BASE-X, IEEE 802.3ae 10000BASE-X, IEEE 802.3ba, RFC 783 TFTP, RFC 791IP, RFC 793 TCP, RFC 826 ARP, RFC 854 T elnet, RFC 768 UDP, RFC 792 ICMP, SNMP v1/v2c & v3, RFC 2131DHCP client, RFC 1492 TACACS+, and support for IPv4 and IPv6ComplianceASPECT GIGAVUE STANDARDSafety HC1UL 60950-1; CSA C22.2 EN 60950-1; IEC-60950-1:2005(2nd Edition) + Am 1:2009 +Am 2:2013HC2UL 60950-1; CSA C22.2 EN 60950-1; IEC-60950-1HC3UL 60950-1, 2nd Edition; CAN/CSA C22.2 No. 60950-1-07, 2nd Edition;EN 60950-1:2006/ A11:2009/ A1:2010/A12:2011/A2:2013; IEC 60950-1:2005(2nd Edition) + Am 1:2009 + Am 2:2013Emissions HC1FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A: RCM; EU: CE Mark EN 55022 Class A, China CCC, TaiwanBSMI, Korea KCC, Russia EACHC2FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A; CE Mark EN 55022 Class A, China CCC, Taiwan BSMI,Korea KCC, Russia EACHC3FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A; EU:CE Mark EN 55022 Class A; Taiwan BSMI, Korea KCC,Russia EACImmunity HC1ETSI EN300 386 V1.3.2, EN61000-4-2, EN 61000-4-3, 61000-4-4, EN 61000-4-5, EN61000-4-6, EN 61000-3-2HC2HC3ETSI EN300 386 V1.6.1:2012; EN61000-3-2; EN61000-3-3; EN61000-4-2; EN61000-4-3; EN61000-4-4; EN61000-4-5; EN61000-4-6; EN61000-4-8; EN61000-4-11 Environment HC1RoHS 6: EU directive 2002/95/ECHC2HC3EU RoHS 6, EU Directive 2011/65/EU; 2006/1907/EC (REACH); ISTA 2ANEBS HC1Level 3 (GVS-HC102/2)HC2Level 3 (GVS-HC2A1/2)HC3Level 3 (GVS-HC301/2)Security HC1FIPS 140-2HC2FIPS 140-2, UC APL, Common CriteriaHC3FIPS 140-2PRODUCT CATEGORY PART NUMBER DESCRIPTIONBase Hardware GVS-HC101GigaVUE-HC1 node, 12 1G/10G cages, 4 10/100/1000M copper, fan tray,2 power supplies, AC powerGVS-HC102 GigaVUE-HC1 node, 12 1G/10G cages, 4 10/100/1000M copper, fan tray,2 power supplies, DC powerBPS-HC1-D25A24Bypass Combo Module, GigaVUE-HC1, 2 SX/SR 50/125 BPS pairs,4 10G cagesTAP-HC1-G10040TAP and Bypass module, GigaVUE-HC1, 10/100/1000M copper,4 TAPs or BPC pairsPRT-HC1-X12Port Module, GigaVUE-HC1, 12x10G/1G SFP+/SFPPRT-HC1-Q04X08*Port Module, GigaVUE-HC1, 4x40G QSFP+ and 8x10G SFP+ cagesSMT-HC1-S GigaSMART, HC Series, Front Module w/o ports (includesSlicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) Licenses-Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-TAXQ0GigaVUE-TA10, TA40, HC1 fan assembly, each (2 required on TA10,3 on TA40 and HC1)PWR-TAXQ1Power Supply Module, GigaVUE-TA10, TA40, or HC1, AC, each PWR-TAXQ2Power Supply Module, GigaVUE-TA10, TA40, or HC1 DC, each* Available with 5.11 releasePRODUCT CATEGORY PART NUMBER DESCRIPTIONBase Hardware GVS-HC2A1GigaVUE-HC2 base unit with chassis, Control Card Version 2, 1 fan Tray, CLI,2 power supplies, AC powerGVS-HC2A2GigaVUE-HC2 base unit with chassis, Control Card Version 2, 1 fan tray, CLI,2 power supplies, DC powerCTL-HC0-002Control Card Version 2, GigaVUE-HC2PRT-HC0-X24Port Module, HC Series, 24x10GPRT-HC0-Q06Port Module, HC Series, 6x40GPRT-HC0-C02Port Module, HC Series, 2x100G QSFP28 cages. Requires Control CardVersion 2BPS-HC0-D25A4G Bypass Combo Module, HC Series, 4 SX/SR 50/125 BPS pairs, 16 10G cagesBPS-HC0-D25B4G Bypass Combo Module, HC Series, 4 SX/SR 62.5/125 BPS pairs,16 10G cagesBPS-HC0-D35C4G Bypass Combo Module, HC Series, 4 LX/LR BPS pairs, 16 10Gb cagesBPS-HC0-Q25A28Bypass Combo Module, GigaVUE-HC2, 2 40G SR4 BPS pairs, 8 10G cagesTAP-HC0-D25AC0TAP module, HC Series, SX/SR Internal TAP module 50/125, 12 TAPsTAP-HC0-D25BC0TAP module, HC Series, SX/SR Internal TAP module 62.5/125, 12 TAPsTAP-HC0-D35CC0TAP module, HC Series, LX/LR Internal TAP module, 12 TAPsTAP-HC0-G100C0TAP and Bypass Module, HC Series, copper, 12 TAP or BPS pairsSMT-HC0-Q02X08GigaSMART, HC Series, Front Module, 2 40Gb, 8 10Gb cages (includesSlicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) SMT-HC0-R GigaSMART, HC Series, Rear Module (includes Slicing, Masking, Source Portand GigaVUE Tunneling De-Encapsulation SW)SMT-HC0-X16GigaSMART, HC Series, Front Module, 16 10Gb cages (includes Slicing,Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) Licenses-Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-HC200GigaVUE-HC2 fan assembly, each (1 required) PWR-HC201Power supply module, GigaVUE-HC2, AC PWR-HC202Power supply module, GigaVUE-HC2, DC© 2019-2021 Gigamon. All rights reserved. Gigamon and the Gigamon logo are trademarks of Gigamon in the United States and/or other countries. Gigamon trademarks can be found at /legal-trademarks . All other trademarks are the trademarks of their respective owners. Gigamon reserves the right to change, modify, transfer, or otherwise revise this publication without notice.Worldwide Headquarters 3300 Olcott Street, Santa Clara, CA 95054 USA +1 (408) 831-4000 | PRODUCT CATEGORY PART NUMBERDESCRIPTION Base HardwareGVS-HC301GigaVUE-HC3 base unit with chassis, Control Card, 5 fan modules, CLI, 2 power supplies, AC power GVS-HC302GigaVUE-HC3 base unit with chassis, Control Card, 5 fan modules, CLI, 2 power supplies, DC power GVS-HC3A1GigaVUE-HC3 base unit with chassis, Control Card v2, 5 fan modules, CLI, 2 power supplies, AC power GVS-HC3A2GigaVUE-HC3 base unit with chassis, Control Card v2, 5 fan modules, CLI, 2 power supplies, DC power CTL-HC3-002Control Card Version 2, GigaVUE-HC3, each PRT-HC3-C16Port Module, GigaVUE-HC3, 16x100G QSFP28 cages PRT-HC3-C08Q08Port Module, GigaVUE-HC3, 8x100G QSFP28 cages and 8x40G QSFP+ cages PRT-HC3-X24Port Module, GigaVUE-HC3, 24x10G BPS-HC3-C25F2GBypass Combo Module, GigaVUE-HC3, 2 40/100Gb SR4 BPS pairs, 16 10G cages BPS-HC3-Q35C2GBypass Combo Module, GigaVUE-HC3, 2 40Gb LR BPS pairs, 16 10G cages BPS-HC3-C35C2GBypass Combo Module, GigaVUE-HC3, 2 100Gb LR BPS pairs, 16 10G cages SMT-HC3-C05GigaSMART, GigaVUE-HC3, 5x100G QSFP28 cages(includes Slicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW)Licenses -Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-HC300GigaVUE-HC3 fan assembly, each (5 required)PWR-HC301Power supply module, GigaVUE-HC3, AC (each)PWR-HC302Power supply module, GigaVUE-HC3, DC (each)Support and ServicesGigamon offers a range of support and maintenance services. For details regarding the Gigamon Limited Warranty and our product support and software maintenance programs, visit /support-and-services/overview-and-benefits . For More InformationFor more information about the Gigamon Platform or to contact your local representative, please visit: .Learn more or get a demo: /contact-us。

MC54HC4051中文资料

MC54HC4051中文资料
X0 13 X1 Y0 1 Y1 Z0 3 Z1 A 10 CHANNEL-SELECT B INPUTS 9 C 6 ENABLE
11 5 2 12 14
Control Inputs Enable L L L L L L L L H C L L L L H H H H X Select B A L L H H L L H H X L H L H L H L H X ON Channels Z0 Z0 Z0 Z0 Z1 Z1 Z1 Z1 Y0 Y0 Y1 Y1 Y0 Y0 Y1 Y1 NONE X0 X1 X0 X1 X0 X1 X0 X1
元器件交易网
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Analog Multiplexers/ Demultiplexers
MC54/74HC4051 MC74HC4052 MC54/74HC4053
High–Performance Silicon–Gate CMOS
X0 14 X1 15 X2 ANALOG 12 MULTIPLEXER/ INPUTS/ X3 DEMULTIPLEXER OUTPUTS X4 1 5 X5 2 X6 4 X7 11 A CHANNEL 10 B SELECT 9 INPUTS C 6 ENABLE PIN 16 = VCC PIN 7 = VEE PIN 8 = GND
X SWITCH
X
ANALOG INPUTS/OUTPUTS
Y SWITCH
15
Y
COMMON OUTPUTS/INPUTS
Z SWITCH
4
Z
X = Don’t Care
PIN 16 = VCC PIN 7 = VEE PIN 8 = GND

CP1H操作手册中文

CP1H操作手册中文

关于在国外的使用
当出口(或提供给非居住者)本产品中属于外汇及外国贸易管理法所规定的出口许可、 承认对象货物(或技术)范围的产品时,必须有以相关法律为基准的出口许可、承认(或 官方交易许可)。
4
关于 CP 系列的「单元版本」
关于 CP 系列的「单元版本」
单元版本是指
在 SYSMAC CP 系列中,为了管理由于版本升级等引起的 CPU 单元配置功能的差异,引 入了「单元版本」这个概念。
W451
CP1H-X40D□-□ CP1H-XA40D□-□ CP1H-Y20DT-D CS1G/H-CPU□□H CS1G/H-CPU□□-V1 CS1D-CPU□□H CS1D-CPU□□S CS1W-SCU21 CS1W-SCB21-V1/41-V1 CJ1G/H-CPU□□H CJ1G-CPU□□P CP1H-CPU□□ CJ1G-CPU□□ CJ1W-SCU21-V1/41-V1 WS02-CXPC1-EV6 WS02-CXPC1-EV6
6
关于 CP 系列的「单元版本」
3)通过单元版本标签进行识别
单元版本标签(下图)附带在产品中。
Ver. Ver.
1.0 1.0
Ver. Ver.
为了管理由于版本升级等引起的 CPU 单元配置功能的差异的标 签。
请根据需要贴在产品的正面。 These Labels can be used to manage differences in the available functions among the Units. Place the appropriate label on the front of the Unit to show what Unit version is actually being used.

绘图仪说明书第6版

绘图仪说明书第6版

目录第1章简介 (3)第2章安全操作必读…………………第3章系统配置及指标 (5)3-1 系统配置 (5)3-2 HipoJET 183技术指标 (5)第4章准备工作 (10)4-1安装绘图机 (10)4-2 绘图机的主要零部件 (11)4-3 放纸轴的作用 (12)4-4放纸轴的安装 (12)4-5收纸轴的作用 (13)4-6收纸轴的安装 (13)4-7绘图机装纸步骤 (14)4-7-1绘图机装纸步骤4-7-2绘图机裁纸步骤4-7-3绘图机取纸步骤第5章液晶面板及按键说明5-1 操作面板的菜单结构 (7)5-2 控制键的说明 (8)5-3 选择语言显示5-4 正常联机 (9)5-5液晶错误信息提示……………………………第6章关于墨盒 (16)6-1 墨盒型号 (16)6-2 墨尽标志 (16)6-3 墨盒安装 (17)6-4 墨盒清洗 (18)第7章打印管理程序基本操作 (18)7-1 软件的安装 (18)7-2 菜单介绍 (19)7-3 使用流程 (21)7-3-1语言设置7-3-2 绘图设置7-3-3 图形显示7-3-4 绘图机设置7-3-5 图形绘制7-3-6 查看历史7-3-7 自动绘制第8章关于绘图机矫正 (31)8-1宽度矫正 (31)8-2 长度矫正 (31)8-3 对接矫正 (32)8-4 错位矫正 (33)8-5 喷头之间的调整 (34)8-6 矫正步骤 (36)第9章解决问题可靠运行 (37)9-1 绘图机状态 (37)9-2 打印质量 (38)9-3 数据传输 (38)9-4 应用软件 (38)第1章简介由衷的感谢您使用HipoJET系列绘图机,该机融合了国际先进技术,性能稳定、操作简单、性价比高、并配有最先进的自动收放纸功能。

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M74HC191F1R中文资料

M74HC191F1R中文资料

3/14
元器件交易网
M54/M74HC190/191
LOGIC DIAGRAM (HC191)
4/14
元器件交易网
M54/M74HC190/191
TIMING CHART (HC190)
TIMING CHART (HC191)
5/14
元器件交易网
DESCRIPTION The M54/74HC190/191 are high speed CMOS 4-BIT SYNCHRONOUS UP/DOWN COUNTERS fabricated in silicon gate C2MOS technology. They have the same high speed performance of LSTTL combined with true CMOS low power consumption. State changes of the counter are synchronous with the LOW-to-HIGH transition of the Clock Pulse input. An asynchronous parallel load input overrides counting and loads the data present on the DATA inputs into the flip-flops, which makes it possible to use the circuits as programmable counters. A countenable input serves as the carry/borrow input in multi-stage counters. Control input, Down/Up, determines whether a circuit counts up or down. A MAX/MIN output and a Ripple Clock output provide overflow/underflow indication and make possible a variety of methods for generating carry/borrow signals in multistage counter applications. All inputs are equipped with protection circuits against static discharge and transient excess voltage.

SN54LS191中文资料

SN54LS191中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.SDLS072 – DECEMBER 1972 – REVISED MARCH 198811 POST OFFICE BOX 655303 • DALLAS, TEXAS 7526512POST OFFICE BOX 655303 • DALLAS, TEXAS 7526513 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

多功能数码复合机 理光1911复印机

多功能数码复合机 理光1911复印机

夏普4018详细参数切换到传统表格版基本参数复印功能打印功能扫描功能其它特性基本参数∙产品类型:数码复合机∙颜色类型:黑白∙涵盖功能:复印/打印/扫描∙速度类型:低速∙最大原稿尺寸:A3∙进纸盘容量:标配纸盒:250页,手送纸盘:100页∙内存容量:16MB∙耗材描述:AR-205DR-C感光鼓,AR-205DU-C感光鼓组件AR-021ST-C墨粉盒,AR-022ST-C墨粉盒∙双面器:手动∙网络功能:不支持∙接口类型:USB2.0复印功能∙复印速度:18cpm∙复印分辩率:600×600dpi∙预热时间:4.5秒∙首页复印时间:7.2秒∙连续复印页数:1-999页∙缩放范围:25-400%(以1%为单位)∙复印倍率:50%,70%,81%,86%,100%,115%,122%,141%,200% ∙灰度等级:256级打印功能∙打印控制器:标准配置∙打印速度:18ppm∙打印分辨率:600×600dpi ∙打印语言:SPLC扫描功能∙扫描控制器:标准配置∙扫描分辨率:600×600dpi∙输出格式:BMP,TIFF,PDF其它特性∙主机尺寸:590×550×495mm∙重量:30.1kg∙电源:AC 220V(±10V),50Hz∙功率:1200W∙系统平台:Windows 2000/XP/vISTA/7东芝181详细参数切换到传统表格版基本参数复印功能打印功能扫描功能其它特性复印机附件保修信息基本参数∙产品类型:数码复合机∙颜色类型:黑白∙涵盖功能:复印/打印/扫描∙速度类型:低速∙最大原稿尺寸:A3∙进纸盘容量:标配纸盒:250页旁路纸盘:100页最大容量:600页∙出纸盘容量:250页∙介质重量:纸盒:64-80g/m²旁路供纸:64-80g/m²(连接供纸),50-163g/m²(单张供纸)∙内存容量:标配:32MB,最大:96MB∙耗材描述:墨粉PS-ZT1810C5k:5900页,PS-ZT1810C510:10000页,PS-ZT1810C:24500页感光鼓OD2320C,70000页载体D2320∙双面器:手动∙网络功能:不支持网络打印∙接口类型:USB2.0复印功能∙复印方式:间接电子成像方式∙感光材料:OPC∙显影系统:双组分磁穗显影∙定影系统:卤素灯(2 个)∙曝光控制:自动加7级手动曝光∙复印速度:18cpm∙复印分辩率:2400×600dpi∙原稿类型:单/多张书本和三维物体∙复印尺寸:纸盒:A3,A4,A4-R,B4,B5,B5-R,FOLIO,8K,16K,16K-R,LD,LG,LT,LTR,COMP旁路供纸:A3,A4,A4-R,A5-R,B4,B5,B5-R,FOLIO,8K,16K,16K-R,LD,LG,LT,LT-R,ST-R,COMP∙预热时间:25秒∙首页复印时间:7.6秒∙连续复印页数:1-999页∙缩放范围:25-400%(以1%为单位)∙无图像区域:前端消边:3±2mm后端/两侧消边:2±2mm∙灰度等级:256级∙复印其它性能:一次扫描多次复印,电子分页,作业插入,自动作业启动,自动更换纸盒打印功能∙打印控制器:标准配置∙打印速度:18ppm∙打印分辨率:600×600dpi ∙打印语言:GDI扫描功能∙扫描控制器:标准配置∙扫描幅面:A3∙扫描分辨率:600×600dpi ∙输出格式:TIFF∙扫描其它性能:TWAIN扫描其它特性∙主机尺寸:600×462.5×643mm∙主机安装空间:948×643mm∙重量:31.8kg∙电源:220-240V(±10%),50/60Hz,8A∙功率:1500W∙系统平台:Windows 2000/XP/Server 2003/2008/Vista∙环境参数:工作温度:10-30℃,工作湿度:20-85%(无凝露)∙上市日期:2009年12月复印机附件∙包装清单:主机 x1 操作手册 x1电源线 x1安装报告 x1CD-ROM(2张) x1∙可选配件:MY-1027-C 第二纸盒 x1 KK-1660C 操作手册盒 x1MH-3600 简易工作台 x1MR-2020C 自动单面输稿器 x1MY-1028C 纸盒 x1GC-1240C 64MB内存 x1保修信息∙保修政策:全国联保∙质保时间:1年∙质保备注:购机后1年或复印量达到规定条件先满足者为准∙客服电话:800-820-8068∙电话备注:周一至周五:9:00-18:00(节假日休息)∙详细内容:东芝复印机在致力于为全球用户提供高品质,高性能产品的同时,更注重所销售产品的售后服务,在全国建立以授权维修站为基础的覆盖全国各地的维修服务网络,以百分之百的用户满意为目标,为东芝复印机用户提供良好保障。

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TL F 5322MM54HC190 MM74HC190 MM54HC191 MM74HC191January1988 MM54HC190 MM74HC190SynchronousDecade Up Down Counters with ModeControl MM54HC191 MM74HC191Synchronous Binary Up Down Counterswith Mode ControlGeneral DescriptionThese high speed synchronous counters utilize advancedsilicon-gate CMOS technology They possess the high noiseimmunity and low power consumption of CMOS technologyalong with the speeds of low power Schottky TTLThese circuits are synchronous reversible up down count-ers The MM54HC191 MM74HC191are4-bit binary count-ers and the MM54HC190 MM74HC190are BCD countersSynchronous operation is provided by having all flip-flopsclocked simultaneously so that the outputs change simulta-neously when so instructed by the steering logic This modeof operation eliminates the output counting spikes normallyassociated with asynchronous(ripple clock)countersThe outputs of the four master-slave flip-flops are triggeredon a low-to-high level transition of the clock input if theenable input is low A high at the enable input inhibits count-ing The direction of the count is determined by the level ofthe down up input When low the counter counts up andwhen high it counts downThese counters are fully programmable that is the outputsmay be preset to either level by placing a low on the loadinput and entering the desired data at the data inputs Theoutput will change independent of the level of the clock in-put This feature allows the counters to be used as modulo-N dividers by simply modifying the count length with thepreset inputsTwo outputs have been made available to perform the cas-cading function ripple clock and maximum minimum countThe latter output produces a high-level output pulse with aduration approximately equal to one complete cycle of theclock when the counter overflows or underflows The rippleclock output produces a low-level output pulse equal inwidth to the low-level portion of the clock input when anoverflow or underflow condition exists The counters can beeasily cascaded by feeding the ripple clock output to theenable input of the succeeding counter if parallel clocking isused or to the clock input if parallel enabling is used Themaximum minimum count output can be used to accom-plish look-ahead for high-speed operationFeaturesY Level changes on Enable or Down Up can be made re-gardless of the level of the clock inputY Wide power supply range 2–6VY Low quiescent supply current 80m A maximum(74HC Series)Y Low input current 1m A maximumConnection DiagramDual-In-Line PackageTL F 5322–1Top ViewLoadEnable DownClock FunctionG UpH L L u Count UpH L H u Count DownL X X X LoadH H X X No ChangeAsynchronous inputs Low input to load sets Q A e AQ B e B Q C e C and Q D e DOrder Number MM54HC190 191or MM74HC190 191C1995National Semiconductor Corporation RRD-B30M105 Printed in U S AAbsolute Maximum Ratings(Notes1 2) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Supply Voltage(V CC)b0 5to a7 0V DC Input Voltage(V IN)b1 5to V CC a1 5V DC Output Voltage(V OUT)b0 5to V CC a0 5V Clamp Diode Current(I IK I OK)g20mA DC Output Current per pin(I OUT)g25mA DC V CC or GND Current per pin(I CC)g50mA Storage Temperature Range(T STG)b65 C to a150 C Power Dissipation(P D)(Note3)600mW S O Package only500mW Lead Temp (T L)(Soldering10seconds)260 C Operating ConditionsMin Max Units Supply Voltage(V CC)26V DC Input or Output Voltage0V CC V (V IN V OUT)Operating Temp Range(T A)MM74HC b40a85 C MM54HC b55a125 C Input Rise or Fall TimesV CC e2 0V(t r t f)1000ns V CC e4 5V500nsV CC e6 0V400nsDC Electrical Characteristics(Note4)T A e25 C 74HC54HCSymbol Parameter Conditions V CC T A eb40to85 C T A eb55to125 C UnitsTyp Guaranteed LimitsV IH Minimum High Level V V Input Voltage V VV VV IL Maximum Low Level V V Input Voltage V VV VV OH Minimum High Level V IN e V IH or V ILOutput Voltage l I OUT l s m A V VV VV VV IN e V IH or V ILl I OUT l s mA V Vl I OUT l s mA V V V OL Maximum Low Level V IN e V IH or V ILOutput Voltage l I OUT l s m A V VV VV VV IN e V IH or V ILl I OUT l s mA V Vl I OUT l s mA V V I IN Maximum Input V IN e V CC or GND V g g g m ACurrentI CC Maximum Quiescent V IN e V CC or GND V m ASupply Current I OUT e m ANote1 Absolute Maximum Ratings are those values beyond which damage to the device may occurNote2 Unless otherwise specified all voltages are referenced to groundNote3 Power Dissipation temperature derating plastic‘‘N’’package b12mW C from65 C to85 C ceramic‘‘J’’package b12mW C from100 C to125 C Note4 For a power supply of5V g10%the worst case output voltages(V OH and V OL)occur for HC at4 5V Thus the4 5V values should be used when designing with this supply Worst case V IH and V IL occur at V CC e5 5V and4 5V respectively (The V IH value at5 5V is3 85V )The worst case leakage current(I IN I CC and I OZ)occur for CMOS at the higher voltage and so the6 0V values should be usedV IL limits are currently tested at20%of V CC The above V IL specification(30%of V CC)will be implemented no later than Q1 CY’892AC Electrical Characteristics T A e25 C V CC e5 0V t r e t f e6ns C L e15pF(unless otherwise specified)Symbol ParameterFrom ToTyp Units (Input)(Output)f MAX Maximum Clock MHzFrequencyt PLH t PHL Maximum Propagation Delay Time Load Q A Q B nsQ C Q Dt PLH t PHL Maximum Propagation Delay Time Data A Q A Q B nsB C D Q C Q Dt PLH t PHL Maximum Propagation Delay Time Clock Ripple nsClockt PLH t PHL Maximum Propagation Delay Time Clock Q A Q B nsQ C Q Dt PLH t PHL Maximum Propagation Delay Time Clock Max Min nst PLH t PHL Maximum Propagation Delay Time Down Up Ripple nsClockt PLH t PHL Maximum Propagation Delay Time Down Up Max Min ns t PHL t PLH Maximum Propagation Delay Time Enable Ripple Clock nst W Minimum Clock Clear or Load ns Input Pulse WidthAC Electrical Characteristics V CC e2 0V to6 0V C L e50pF t r e t f e6ns(unless otherwise specified)From To T A e25 C 74HC54HCSymbol Parameter(Input)(Output)V CC T A e b40to85 C T A eb55to125 C UnitsTyp Guaranteed Limitsf MAX Maximum Clock V MHzFrequency V MHzV MHz t PLH t PHL Maximum Propagation Load Q A Q B V ns Delay Time Q C Q D V nsV ns t PLH t PHL Maximum Propagation Data A Q A Q B V ns Delay Time B C D Q C Q D V nsV ns t PLH t PHL Maximum Propagation Clock Ripple V ns Delay Time Clock V nsV ns t PLH t PHL Maximum Propagation Clock Q A Q B V ns Delay Time Q C Q D V nsV ns3AC Electrical Characteristics(Continued)Symbol ParameterFrom ToConditions V CCT A e25 C74HC54HCUnits (Input)(Output)T A eb40to85 C T A eb55to125 CTyp Guaranteed Limitst PLH t PHL Maximum Propagation Clock Max Min V ns Delay Time V nsV nst PLH t PHL Maximum Propagation Down Up Ripple V ns Delay Time Clock V nsV nst PLH t PHL Maximum Propagation Down Up Max Min V ns Delay Time V nsV nst PHL t PLH Maximum Propagation Enable Ripple V ns Delay Time Clock V nsV nst W Minimum Clock Load or V ns Clear Input Pulse Width V nsV nst S Minimum Setup Time Data Load V nsV nsV nst H Data Hold Time Load Data V b nsV b nsV b nst S Minimum Setup Time Down Up Clock V nsV nsV nst H Minimum Hold Time Clock Down Up V b nsV b nsV b nst S Minimum Setup Time Enable Clock V nsV nsV nst H Minimum Hold Time Clock Enable V b nsV b nsV b nst rem Minimum Removal Time Load Clock V nsV nsV nst THL t TLH Maximum Output V s Rise and Fall Time V nsV nst W Minimum Load V ns Pulse Width V nsV nsC IN Input Capacitance pFC PD Power Dissipation pFCapacitance NoteNote5 C PD determines the no load dynamic power consumption P D e C PD V CC2f a I CC V CC and the no load dynamic current consumption I S e C PD V CC f aI CC4Logic Diagrams’HC190Decade CountersTL F 5322–2 Pin(16)e V CC Pin(8)e GND5Logic Diagrams(Continued)’HC191Binary CountersTL F 5322–3Pin(16)e V CC Pin(8)e GND6Timing Diagrams’HC190Synchronous Decade CountersTypical Load Count and Inhibit SequencesTL F 5322–4Sequence(1)Load(preset)to BCD seven(2)Count up to eight nine zero one and two(3)Inhibit(4)Count down to one zero nine eight and seven’HC191Synchronous Binary CountersTypical Load Count and Inhibit SequenceTL F 5322–5Sequence(1)Load(preset)to binary thirteen(2)Count up to fourteen fifteen zero one and two(3)Inhibit(4)Count down to one zero fifteen fourteen and thirteen7M M 54H C 190 M M 74H C 190 M M 54H C 191 M M 74H C 191Physical Dimensions inches (millimeters)Order Number MM54HC190J MM54HC191J MM74HC190J or MM74HC191JNS Package J16AOrder Number MM74HC190N or MM74HC191NNS Package N16ELIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a)are intended for surgical implant support device or system whose failure to perform can into the body or (b)support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectivenessbe reasonably expected to result in a significant injury to the userNational Semiconductor National Semiconductor National Semiconductor National Semiconductor CorporationEuropeHong Kong LtdJapan Ltd1111West Bardin RoadFax (a 49)0-180-530858613th Floor Straight Block Tel 81-043-299-2309。

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