TC1303B-ED0EMFTR中文资料
TC9400中文资料
14-Pin
0°C to +70°C
SOIC (Narrow)
14-Pin
0°C to +70°C
Plastic DIP
14-Pin
– 40°C to +85°C
CerDIP 14-Pin
5 0°C to +70°C
Plastic DIP
14-Pin
– 40°C to +85°C
CerDIP
14-Pin
APPLICATIONS
s µP Data Acquisition s 13-Bit Analog-to-Digital Converters s Analog Data Transmission and Recording s Phase-Locked Loops s Frequency Meters/Tachometer s Motor Control s FM Demodulation
TC9401 ......................................................... 0.02% TC9400 ......................................................... 0.05% TC9402 ......................................................... 0.25% s Programmable Scale Factor
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
Part No.
Linearity (V/F) Package
4 Temperature Range
CPC1303GRTR,CPC1303G,CPC1303GR, 规格书,Datasheet 资料
Approvals
• UL 1577 Approved Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN 60950 Certified Component: TUV Certificate B 10 05 49410 006
Typical Blocking Voltage vs. Temperature
500 Leakage Current (nA) 400
Leakage Current vs. Temperature
VCE Leakage 10V 300 200 100 0 -40 VCE Leakage 5V VCE Leakage 3V
-20
0
20 40 60 Temperature (ºC)
80
100
-20
0
20 40 60 Temperature (ºC)
80
100
Turn-On Time vs. Load Resistance (IF=1mA, VCC=5V, TA=25ºC)
1.5 Turn-Off Time (μs) Turn-On Time (μs) 1.4 1.3 1.2 1.1 1.0 0.9 0 20000 40000 60000 80000 Load Resistance (Ω) 100000 350 300 250 200 150 100 50 0 0
LED Forward Voltage vs. Temperature
IF=50mA IF=20mA IF=10mA IF=5mA
10
1
IF=2mA IF=1mA IF=0.2mA -20 0 20 40 60 Temperature (ºC) 80 100
RF基本概念剖析
• 8820T
BT 测试仪器
• CBT32
BT Test item
Output Power (TRM/CA/01/C) TX Output Spectrum - Frequency Range(TRM/CA/04/C) Initial Carrier Frequency Tolerance(TRM/CA/08/C) Carrier Frequency Drift(TRM/CA/09/C) EDR Relative Transmit Power(TRM/CA/10/C) EDR Frequency and Modulation Accuracy(TRM/CA/11/C) EDR Differential Phase Encoding(TRM/CA/12/C) EDR In-band Spurious Emissions(TRM/CA/13/C) Sensitivity - Single Slot Packets(RCV/CA/01/C) Sensitivity - Multi Slot Packets(RCV/CA/02/C) C/I Performance(RCV/CA/03/C) Blocking Performance(RCV/CA/04/C)(3K-6G Hz)
GPS
GPS:全球定位系统,Global Positioning System。
它是一个中距离圆形轨道卫星定位系统,可以为地球表面绝大部
分地区提供准确的定位 和高精度的时间基准。
。
该系统是通过太空中的24颗GPS卫星来完成的。最少需要其中3颗卫星
,就能迅速确定您在地球上的位置。所能接收到的卫星数越多,译码出来的位置
TCB接近开关中文资料
≤2.5V
消耗电流
≤10mA
保护回路
浪涌,过载,短路,逆极性保护
输出指示
黄色LED
环境温度
-25…70℃
环境湿度
35-95%
开关频率
800 Hz 500 Hz
防护等级
IP67
外壳材料
PBT
接线方式
2米PVC电缆
电气接线图Connection diagr式
埋入式非埋式
检测距离
7mm 10mm
电源电压
10…30VDC 90...250VAC
外形规格
25*25*39
输出方式
NPN/PNP NO/NC
开关点偏移
≤±10%
迟滞范围
1…20%
重复误差
≤3%
负荷电流
≤200mA
DC2线NC
TCB-3080LB
NPN NO
TCB-3080A
NPN NC
TCB-3080B
NPN NO+NC
TCB-3080AB
PNP NO
TCB-3080C
PNP NC
TCB-3080D
PNP NO+NC
TCB-3080CD
AC 2 线 NO
TCB-2080A
AC 2 线 NC
TCB-2080B
TCB接近开关中文资料(翔京联合)
产品图片Photo
尺寸图Dimension drawing
特点描述Feature Description
型号规格Item Code
◆ 采用非接触式检测方式,响应快、频率高
◆ 浪涌,过载,短路,逆极性保护
◆ 外壳材料:PBT
◆ 防护等级IP67(IEC)
ETS-EMCO产品说明书
Information presented is subject to change as product enhancements are made. Contact ETS Sales Department for current specifications.2/00 - 2k S © 2000 ETS-EMCO REV BUSA:Tel +1.512.835.4684Fax +1.512.835.4729FINLAND:Tel +358.2.8383.300Fax +358.2.8651.233ONLINE:****************1Positioning Controller Test Site HardwareFeatures:l Control for 2 Primary and4 Auxiliary Devicesl SEEK & SCAN Functionsl Automatic Target Overrun Correctionl Element Saving Limit Settingl Fiber Optic Control Linesl IEEE-488.2 I/O Portl Speed Control Model 2090 Positioning ControllerETS-EMCO’s Model 2090 Positioning Controller allows you to synchronize simultaneous movement of two primary ETS-EMCO devices (towers or turn-tables), and on/off operation of up to four auxiliary devices (LISNs, EUTs, etc.).Independent operation of primary devices can be performed manually, by either of the two front panel controls, or remotely, by a separate GPIB address for each device. Fiber optic control lines eliminate RF interference that can be conducted through traditional wire cables.The Model 2090 is designed to maximize the features of ETS-EMCO antenna towers and turntables. See page 4 for information about retrofits to earlier ETS-EMCO models and non-ETS products.Functions The front panel design of the Model 2090features a user-friendly interface which simplifies device control and clearly communicates primary device movement to the operator. T wo separate sets of controls (Device One and Device Two),each with identical displays and functions,are included. Other front panel features include four auxiliary control switches and the Model 2090 power switch.Model 2090A number of useful primary device commands can be performed by the operator. The SEEK function enables the user to reposition a device to a newtarget location and the SCAN command initiates cyclic movement of a device.The CONFIG and LIMIT functions enable the user to program operational parameters and upper/lower or clock-wise/counterclockwise limits for each device. The POSITION and STEP functions work together to control towercross boom and/or turntable positioning.Expanded details of these functions are offered below.SEEK & SC SEEK & SCAN AN SEEK allows a target location to be entered to redirect the device from its current location. Target locations can be automatically incremented/decremented by a given value. The SEEK command is available only through the GPIB. All otherfunctions can be performed from both the GPIB and the front panel. The SCAN key initiates cyclic movement of a device between pre-programmed limits. A cycle is defined as movement from the lower/counterclockwise limit to the upper/clockwise limit and back to the lower/counterclockwise limit. The total numberof cycles is programmable from 1 to 999or an entry of “000” causes the device to scan continuously.C ONFIG & LIMITThe CONFIG (Configuration of Param-eters) and LIMIT keys work together for system set up. The CONFIG function enables the operator to select six operational parameters for both primary devices.The LIMIT keys allow the operator to set upper and lower, or clockwise and counterclockwise limits. The user simplysets the limit by pressing the INCRM orDECRM keys until the desired limit is shown on the display and then selects the ENTER key. T o verify or set thecurrent position of a device undercontrol, the user can press the CURRENT POSITION key.POSITION & STEPThe POSITION and STEP functions work together to manually position the tower cross boom and/or turntable. Four POSITION keys and two STEP keys areavailable to achieve this control. 1981Information presented is subject to change as product enhancements are made. Contact ETS Sales Department for current specifications.2/00 - 2k S © 2000 ETS-EMCO REV BUSA:Tel +1.512.835.4684Fax +1.512.835.4729FINLAND:Tel +358.2.8383.300Fax +358.2.8651.233ONLINE:****************2Front Panel Illustration – Model 2090 Positioning ControllerPOSITION K POSITION Ke e y sl UP / CW UP moves the tower cross boom upward.CW moves the turntable clockwise.l DOWN / CCWDOWN moves the tower cross boom W moves the turntable counterclockwise.l STOP STOP ceases movement of device.l POLARIZATION / FLOTATION/SPEED HOR / UP/ FAST VERT / DN / SLOW On a tower, pressing this button will toggle the tower cross boom between HORIZONTAL and VERTICAL polarization.On an air flotation turntable, pressing this button will toggle the UP (inflation) and DOWN (deflation) of the turntable top. On a two-speed turntable, pressing this button will toggle the speed of the turntablebetween FAST and SLOW. On a variable speed turntable, pressing this button will cycle the SPEED between four presets. The indicator lights will illuminate in a binaryfashion to indicate the current preset speed selection i.e. first preset OFF-OFF, second preset ON-OFF, third preset OFF-ON, fourth preset ON-ON.STEP K STEP Ke e y s l INCINC moves the device up or clockwise.l DEC DEC moves the device down orcounterclockwise.The controller will move the device in the desired direction as long as the key is pressed. The device will stop when thekey is released.L OC OCAL/REMO AL/REMO AL/REMOTE OPER TE OPER TE OPERA A TION The Model 2090 can be operatedmanually from the front panel or remotely via the GPIB port. When the Model 2090 is addressed via the GPIBport, the RMT indicator light will illuminate and the ADDR indicator will flash to show bus activity. Pressing the LOCAL function key allows you to exit the remote mode. When the optionalHand Control Unit (see Options, page 3)is used, all position changes will berecorded and displayed by the Model 2090 Controller.A UXILIAR UXILIARY C Y C Y CONTR ONTR ONTROL OL Four front panel keys are available to control auxiliary devices. While in manual mode, you can activate an auxiliary device by pressing the AUX CONTROL key that corresponds to the auxiliary device port. In remote mode,auxiliary devices can be activated by using the appropriate GPIB command. Thecontrol lines are on/off output only . In order to use these four auxiliary lines, an interface box that will perform a custom function and accept a fiber optic input, is needed. Contact ETS-EMCO Sales for details.FeaturesAutomatic Target Overrun Correction The Model 2090 constantly monitors inertia-induced target overrun. Ifoverrun on turntables or towers occurs, itis identified and tracked. Utilizing a special algorithm, the Model 2090continually adjusts subsequent positionings to minimize overrun,allowing for proper device positioning during tests.Element Saving Limit Setting To prevent damage to antenna elements which may accidentally rotate into the ground plane or ceiling during polariza-tion, the Model 2090 allows you to program two upper and two lower limit settings. These settings allow you to safely maximize antenna scan height ineither horizontal or vertical polarization – especially useful with BiConiLogs TM ,biconicals, log periodics, and otherantennas with protruding elements.Fiber Optic Input/Output LinesThe 2090 features fiber optic controllines to eliminate conducted noise. Eachprimary device cable contains two fiberInformation presented is subject to change as product enhancements are made. Contact ETS Sales Department for current specifications.2/00 - 2k S © 2000 ETS-EMCO REV BUSA:Tel +1.512.835.4684Fax +1.512.835.4729FINLAND:Tel +358.2.8383.300Fax +358.2.8651.233ONLINE:****************2090115/230 VAC 1 2 A 250 VAC Time Delay 8 fiber optic connectors.50/60 Hz IEEE-488.2 connector.IEC 320 power inlet.Fuse holder.MODEL WIDTH DEPTH 2HEIGHT WEIGHT Physical SpecificationsElectrical SpecificationsMODEL POWER FUSE BACK PANEL I/032090 43.8cm 34.3cm 13.3cm 4.5kg 17.3in 13.5in 5.3in 10.0lb 2 Excluding handlesoptic lines (transmit/receive). Auxiliary device lines are output only. Reliable and easy-to-use ST connectors are standard.GPIB The General Purpose Interface Bus (GPIB) complies with IEEE 488.1/488.2standards. All front panel functions can be exercised using GPIB commands while in the remote mode. GPIB com-mands are backward compatible with ETS-EMCO Model 1050, 1060 and 1090Controllers, simplifying upgrades to the new model. Model 1050 and 1060commands are compatible with Hewlett Packard's Model HP 85876A Commercial Radiated EMI Measurement Software and Rohde & Schwarz Model ES-KI EMI Measurement & Evaluation Software.S p eed C eed Con on ontr tr trol ol Users whose test facilities include a two-speed turntable will find the Model 2090positioning controller well suited to their needs. The unit ’s SLOW control activates the turntable ’s lower speed drive. The FAST control activates the turntable ’s higher speed drive. The controller can be used for speed-control with ETS-EMCO turntables that feature dual speeds andother brands of two-speed turntables.Memory All settings in the Model 2090 are savedwhen the unit is turned off, allowing for easy set-up when testing is interrupted and returned to later.Precise Resolution Display accuracy on the Model 2090 is highly precise. The unit offers position readout increments of 1 mm for towersand 0.1 degree for turntables.Universal Power SupplyThe positioning controller has a conve-nient built-in auto ranging feature that automatically senses supply voltage. Any AC power source input within the range of 115/230 V AC, 50/60 Hz can be used.Rack Mounting For convenience, the Model 2090 is standard rack width and 3U rack size.Standard Configuration l Controller assembly l IEC 320 power cord l Manual OptionsHand Control Unit The Hand Control Unit is designed to manually operate ETS-EMCO antenna towers and turntables. Lightweight and easy to operate, this convenient unit plugs into the motor base of the tower orturntable and enables you to perform simple manual movement of these devices. It works in tandem with ETS-EMCO ’s Model 2090 Controller. Changes in position location made by the HandControl Unit will be recorded and displayed by the Model 2090 Controller.T o order, specify part number 105136.Auxiliary Control UnitThe Auxiliary Control Unit provides a means to remotely open and close contacts via fiber optic cable. These contacts can be used to remotely control power relays or other devices to automate EMC testing. Simplex fiber optic cable connects the output of the Model 2090Aux Control to the input of the Auxiliary Control Unit. The Auxiliary Control Unit is powered by a wall-mount power supply (user-specified 115 V AC or 230V AC at time of order).Additional Fiber Optic CableStandard fiber optic cable length is 10meters. Custom lengths are available.To order, specify part number 708029-m (10 m increments).Fiber Optic FeedthroughBulkhead feedthrough consisting of a wave-guide cutoff for fiber optic cable.To order, specify part number 105120.Rack Mount RailsA rack mount kit can be purchased for mounting the Model 2090 in a rack.To order, specify part number 540037.1 AutoselectInformation presented is subject to change as product enhancements are made. Contact ETS Sales Department for current specifications.2/00 - 2k S © 2000 ETS-EMCO REV BUSA:Tel +1.512.835.4684Fax +1.512.835.4729FINLAND:Tel +358.2.8383.300Fax +358.2.8651.233ONLINE:****************Positioning Controller Upgrade Kits Now your older ETS-EMCO tower and turntable can operate with all of the new command features available with our Model 2090 Positioning Controller. All you need is our Retrofit-Kit and a Model2090 Controller to replace your existing EMCO Model 1050, 1060, 1060C or 1090Controller. Y ou'll be able to control two devices (tower or turntable) and four auxiliary devices at once, plus access theSEEK, SCAN, target overrun, and multiple limit functions. For a thorough description of all Model 2090 features and functions please turn to page one.Note: Bore Sight functions are only available with Model 2071 towers.T o install the Retrofit-Kit, the included interface box is placed in line between the tower/ turntable motor box andcontroller. Existing cables are used between the tower/turntable motor box and the Retrofit-Kit's interface box. Fiber optic cables are connected between the interface box and the new Model 2090Positioning Controller.Retrofit-Kit to replaceModel 1050 or 1060 ControllersPN # 105637Retrofit-Kit to replace Model 1090 ControllerPN # 105797Retrofit-Kit for non-EMCOtowers/turntablesCALL FOR QUOTEAll kits consist of an interface box withpower cord and a 10 meter fiber opticcable.Specifications4OptionslCustom length fiber optic cable l Custom length wire cable l Hand Control Unit(SELECTABLE)Retrofit-Kit 35.6 cm 30.5cm 16.5cm 11.4 kg 115/23050/60for 1050, 106014.0 in12.0in 6.5in 25.2lbMODEL PHYSICAL ELECTRICALWIDTH DEPTH HEIGHT WEIGHT VOLTAGE HzExisting (pre Model 2090)Tower / Turntable Motor BoxExisting Cables (one cable on 1090 kit)New Interface Box New Fiber Optic CableModel 2090 Controller。
中九机顶盒配置资料大全
针脚定义 ①-GND .②-TXD .③-RXD .④ VCC .⑤-BL(亲测) 歌德威尔 ABS-208H/高斯贝尔 208P 3 晶 14 芯 针脚定义 ①-GND .②-TXD .③-RXD .④ VCC .(亲测) 高斯贝尔 ABS-208P/歌德威尔 208H 1 晶 14 芯 针脚定义 ①-GND .②-TXD .③-RXD .④ VCC .⑤-BL(亲测) 高斯贝尔 ABS-208P/歌德威尔 208H 1 晶 14 芯 针脚定义 ①-GND .②-TXD .③-RXD .④ VCC (亲测) 高斯贝尔 ABS—208F 高斯贝尔 ABS—208 吉祥 ABS-208C 吉祥 ABS-2009B 3 晶 14 芯 2晶 2 晶 14 芯 IC:AVL1108EGi+Hi2023+5812 IC:M3330E+AVL1108EG+AV2020+M12L64164A IC:Hi2023+AVL1108EGA+M88TS2020 IC:HTV903+1108+5812 IC:Hi2023+AVL1108EGa+GST GAIM-18R ABS-STUNER IC:GX3001+GX1121+RDK5812 IC:GX3001+GX1121+夏普高频头 IC:HTV903+1108+GAIM-18R IC:D61216GJ+1108+5812 (9 针接口) IC:M3330+1108+5812 IC:AVL1108+Hi2023+GAIM-18R IC:D61216GJ100+AVL1108EG+S29AL016D70TF102+ISSI 高斯贝尔 ABS-208N 铁壳 (9 针母串口) 高斯贝尔 ABS-208 高斯贝尔 ABS-208S 1晶 IC42s16400F IC:D61216GJ+AV1108+29AL016D+5812 IC:NEC D61216GJ+AVL1108EGa+高频头 IC:AVL1108EGA+M3330E+M12L64164A+AV2020 IC:GX3001+GX1121+5812 IC:GX3001+GX1121+5812+EN25D80+HY57V641620ETP-6 IC:1108EG(Hi3121)+Hi2023+5812. IC:0001(GX3001)+HN4F74+5812 IC:00001(GX3001)+HN4LSW+S6416AHTA+5812 IC:HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812 IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558 IC:0002(GX6121)+5812+M12L64164A IC:M88VS2000+ES256454K+M88TS2020 IC:HN4F910931M2EE+0001G1K729-1TA060932+5812 IC:GX3001+GX1121+5812 2 晶 11 芯 2晶 IC:M3330E+AVL108 的+夏普高频头 IC:GX3001+GX1121-ES29L160FB+SHARP 高频头 IC:HTV903+AVL1108+25L160+ST2020(Y32S-8BAT 081113) 1 晶 10 芯 1 晶 10 芯 3晶 10 芯 IC:GX6121+RDA5812+ZB-1A IC:GX6121-RDA5812-2B-1A IC:GX3001+1121+TS2020 IC:0002(GX6121)+EEPLDA+5812+M12L64164A IC:GX3001+GX1121+5812 IC:GX3001+GX1121+5812 IC:GX3001+GX1121+5812 IC:GX3001+GX1121+5812 IC:CH216H+AVL1108+C6XS-8CA IC:HN4N46+EN25F80+G1N540-1TA06+IS42S16400-7T+5812 IC:Hi2023EC+Hi3102E+AV2020 IC:Hi2023EC+Hi3102E+AV2020 IC:Hi2023+AVL1108EG+夏普高频头 IC:Hi2023E+AVL1108EG+AV2020 IC:M3330E+AVL1108EG+AV2020+M12L64164
摩泰光电 SFP-GE-BIDI-60KM-T1310 R1550-x-D10 光收发模块说明书
数据手册SFP-GE-BIDI-60KM-T1310/R1550-x-D101.25Gb/s SFP(小型可插拔)Tx1310nm/Rx1550nm双向光收发模块产品简介ModuleTek的SFP-GE-BIDI-60KM-T1310/R1550-x-D10光收发模块基于千兆以太网IEEE802.3标准和光纤通道FC-PI-2Rev7.0,为GE/FC应用提供快速可靠的接口。
该产品通过2线串行总线实现数字诊断功能,符合小型可插拔多源协议(MSA)和SFF-8472的标准。
产品特性高达1.25Gb/s的双向数据传输能力符合IEEE802.3z千兆以太网符合SFP MSA热插拔设计1310nm DFB激光发射器单LC接口具有数字诊断功能在9/125um单模光纤上传输距离可达60km单电源供电3.3V符合RoHS标准1类激光产品,符合EN60825-1标准工作温度范围(外壳温度):商业温度等级:0◦C至70◦C工业温度等级:−40◦C至85◦C应用1.25Gb/s千兆以太网1.063Gb/s光纤通道摩泰光电用心做好每一次服务1订购信息型号产品ID 描述拉环颜色SFP-GE-BIDI-60KM-T1310/R1550-C-D10M336403SFP-BIDI ,单LC 接口,Tx1310nm/Rx1550nm ,传输距离可达60km ,商业级蓝色SFP-GE-BIDI-60KM-T1310/R1550-I-D10M336404SFP-BIDI ,单LC 接口,Tx1310nm/Rx1550nm ,传输距离可达60km ,工业级蓝色注:1.产品ID 为我司产品标准型号的简写订货号如需了解更多信息或订购上述产品,请联系:电子邮件:*******************摩泰光电官网:产品一般规格参数符号最小值典型值最大值单位备注数据速率DR 1.25Gb/s 1DR 1.063Gb/s2误码率BER 10−12工作温度T C 070◦C 3-4085◦C 3储存温度T STO −4085◦C4工作电流I CC 230300mA 5工作电压V CC 3.14 3.33.46V 最大电压V MAX−0.54V5注:1.IEEE 802.32.FC-PI-2Rev7.03.外壳表面温度4.环境温度5.用于电接口传输距离数据速率光纤类型距离范围(km)备注1.25Gb/s9/125um 单模光纤60光学特性—发射机V CC=3.14V to3.46V,T C参数符号最小值典型值最大值单位备注发射光功率P TX05dBm1光中心波长λC126013101360nm消光比ER9dB光谱宽度(-20dB)Δλ1nm光信号上升/下降时间t r/t f250300ps(20%-80%)注:1.1类产品典型光眼图使用1.25Gb/s,PRBS27-1信号测试光学特性—接收机V CC=3.14V to3.46V,T C参数符号最小值典型值最大值单位备注接收机过载P OL0dBm光中心波长λC147015501600nm接收灵敏度R X SEN−26dBm1回波损耗ORL14dBmLOS信号生效LOS A−35dBmLOS信号失效LOS D−28dBmLOS信号迟滞区间LOS H0.5dB注:1.用PRBS27-1测试模式测量,BER<10−12;电气特性—发射机V CC=3.14V to3.46V,T C参数符号最小值典型值最大值单位备注差分输入阻抗R IN100Ω单端输入摆幅V IN PP2501200mV发射机关闭电压V D V CC-1.3V CC V发射机使能电压V EN V EE V EE+0.8V电气特性—接收机V CC=3.14V to3.46V,T C参数符号最小值典型值最大值单位备注单端输出摆幅V OUT PP300400800mV输出信号上升时间/下降时间t r/t f300ps(20%-80%)LOS信号生效V LOS A V CC−0.5V CC HOST VLOS信号失效V LOS D V EE V EE+0.5V 接收端压制功能压制功能的判断方式备注禁用N.AA0H 设备的寄存器说明IIC 地址字节大小寄存器名称寄存器描述取值(HEX)01IdentifierSFP 0311Extended Identifier使用IIC 接口0421Connector使用LC 连接器073-108Transceiver 1000BASE-BX-U 0000004000000000111Encoding 使用8B/10B 编码方式01121BR,Nominal 1.25Gb/s 的标称速率0D 131Rate Identifier 无速率选择功能00141Length(9μm)-km 在单模光纤传输60km 3C 151Length (9μm)-100m 在单模光纤传输60km FF 161Length (50μm)-10m 在多模光纤的传输距离00171Length (62.5μm)-10m 在多模光纤的传输距离00181Length (Copper)在铜缆的传输距离00191Reserved 未定义0020-3516厂商名称MODULETEKASCII Format361Transceiver 未定义0037-393Vendor OUI 厂商IEEE 公司ID 00000040-5516Vendor PN厂商产品型号由厂商定义56-594Vendor Revision Number厂商产品版本号由厂商定义60-612Wavelength 激光器的波长1310纳米051E 621Reserved 未定义00631CC_BASE 0-62字节的校验和由厂商定义64-652Transceiver Options1.Rx_LOS 信号监控2.Tx_FAULT 信号监控3.Tx_DIS 信号监控001A 661BR,max 高比特率余量00671BR,min 低比特率余量0068-8316Vendor SN 厂商序列号由厂商定义84-918Date code 日期代码由厂商定义921Monitoring TypeDOM 信息内部校准接收光功率测量使用平均光功率68931Enhanced Options 1.发射光与接收光Alarm 与Warning 监控2.Tx_DIS 信号监控与控制3.Rx_LOS 信号监控4.Tx_FAULT 信号监控F0941Compliance 按照12.0版本的SFF-8472定义08951CC_EXT 64-94字节的校验和由厂商定义96-12732Vendor Specific 厂商自定义区域由厂商定义128-255128Vendor Specific厂商自定义区域由厂商定义数字诊断功能SFP-GE-BIDI-60KM-T1310/R1550-x-D10支持SFP MSA中定义的2线串行通信协议,该产品通过地址为0xA2的2线接口访问数字诊断信息。
ETC收费系统
ETC基本系统图形监控软件TCO生产厂家:北京握奇数据系统有限公司型号:TS-TSJ101数量:1套性能指标:TS-TSJ101是一套收费站实时监控管理软件。
该软件主要实现监控收费车道现场情况的功能。
具体功能包括了:(1)车道监视设置包括设置站点名称、车道数量、车道类型、车道控制主机的IP地址等信息。
(2)车道监视实时监视收费车道相关设备的运行信息,如车道状态、收费员名称、收费监控画面、收费设备状态、收费状态等信息。
(3)流量统计可按收费站、收费车道、收费时间、收费车型、收费方式、车流量等单一或组合方式进行查询和统计。
(4)发送短信息可向收费车道控制机发送短消息通知。
图形监控软件OPE生产厂家:北京握奇数据系统有限公司型号:TS-TSY201数量:1套性能指标:TS-TSY201是一套收费业务管理软件。
该软件的主要功能是:系统参数设置、收费数据导入导出、用户管理、车道管理、综合查询、报表管理。
具体功能包括了:(1)浏览查询功能包括区域浏览、路段浏览、车种浏览、IC卡类型浏览、收费站浏览、收费广场浏览、车道浏览、工班表浏览、费率浏览、公务卡黑名单浏览、身份卡黑名单浏览、通行卡黑名单浏览、公务车白名单浏览、系统参数设置等功能。
(2)数据导入导出功能若收费站与车道网络连接处于故障时,收费站与车道将不能正常的通讯,收费站的各项业务如查询、各项统计报表等都不能正常进行,同时收费站的各项业务参数也不能下发到各车道。
为了能够接收车道的收费数据和传输收费参数到车道计算机,可以利用“数据导入导出”功能。
(3)用户管理功能包括操作员的设置,增加、修改和删除操作员信息和权限等功能。
(4)车道管理功能本功能用于监测车道各项数据,车流量、收费情况、车道处理、网络情况。
车流量:用于监测各车道的各种车型的流量。
收费情况:用于监测各车道的各种车型的收费金额。
车道处理:用于监测各车道的各种处理类型的数量。
网络状况:用于监测各车道的网络状况。
B-2203中文资料
FIGURE 2.CIRCUIT FOR COMMON-MODE REJECTIONFIGURE 3.CIRCUIT FOR WAVEFORM INTEGRITYNote:Input to be applied and output to be measured for all dash numbers as shown.N represents highest turns winding in each -STD-1553 TRANSFORMERS© 1996, 1999Data Device CorporationFEATURES•Complete Line of Custom andQPL Units•For Use with MIL-STD-1553Aand B,MacAir A-5690,A-5232,and A-4905•Low Profile•Epoxy Cased,HermeticallySealed•-55°C to +130°C OperatingTemperature Range•Built and Tested to MIL-PRF-21038 and MIL-STD-202Web site:元器件交易网Transceiver T ype 1 (Trapezoidal +5 V/-15 V) BU-61580X1BU-65170X1BUS-61559BUS-61553BUS-65153BUS-65142BUS-63105/25IITransceiver T ype 2 (Trapezoidal +5 V/-12 V) BU-61580X2BU-65170X2BUS-61560BUS-61554BUS-65154BUS-65143BUS-63107/27IITransceiver T ype 3 (Monolithic T rapezoidal +5 V) BU-61580X3BU-65170X3BU-61580X6BU-65170X6Transceiver T ype 3A (Discrete T rapezoidal +5 V) BUS-61561BUS-61555BUS-63147/48Transceiver T ype 5 (Sinusoidal McAir)BU-61590X5BUS-65149BUS-63102Consult Factory For:MIL-PRF-21038 QPL Part Numbers Special MarkingSpecial T estingSpecial PackagingSource InspectionNotes:1.Numbers in parenthesis ( ) reference MIL-PRF-21038 dash numbers.2.For configuration “A”only.See individual specifications for actual values.3.Design parameter only.Not screened in production.ORDER BY BETA PART NUMBER FROM ADDRESS AT THE TOP OF THE PAGE元器件交易网The information in this data sheet is believed to be accurate;however, no responsibility isassumed by Beta T ransformer Technology Corporation for its use, and no licenseor rights are granted by implication or otherwise in connection therewith.Specifications are subject to change without notice.A Subsidiary of Data Device Corporation40 Orville Drive, Bohemia, NY 11716-2529Phone:(631) 244-7393;Fax:(631) 244-8893Web site:J-04/01-500PRINTED IN THE U.S.A.。
烽火03B操作手册
烽火光设备(GF155/622-03B)操作手册GF155/622-03B是基于STM-1/OC-3(或STM-4)传输速率的光纤传输设备,具有SDH同等级设备的基本功能,该设备利用半动态(即预先指定)地按需分配带宽(N ×E1或N×T1)的处理技术,有效地利用现有SDH/SONET网络资源,灵活、高效无缝隙地实现多种宽带业务的接入。
1、面板结构说明GF155/622-03B设备结构图GF155/622-03B光传输部分第2个155支路盘单元或用户接入单元2 基本配置2.1 单板配置2.1.1 EMU为网元管理盘;EOW为公务盘。
2.1.2 AGG1为西向(W)群路盘;AGG2为东向(E)群路盘。
用于STM-4传输速率时群路为O622光盘;用于STM-1传输速率时为O155盘,其两块群路盘可以是光接口也可以是电接口;在某些系统中也可以只用一块群路盘。
2.1.3 TRi为光传输平台的支路盘总称。
在这些盘位上可以选插多种不同速率的接口盘。
2.1.4 AC2为2M接入控制盘,相当于用户接入部分的群路盘,具有集线功能和业务接入功能。
2.1.5 SIFi为话音、数据等业务接口盘的总称。
在这些盘位上可以选插多种不同业务的接口机盘。
2.1.6 PWRR为带铃流的电源盘,它有多种装配方式,用户可根据工程业务容量的要求,选定合适的电源盘装配形式。
PWR为不带铃流的电源盘。
2.1.7 NC为空盘位,出厂时加装假面板。
下表为GF155/622-03B传输部分机盘配置表2.2 最大配置IBAS 130(GF155/622-03B/C )单子架具有2×STM-4+4×STM-1容量,设备可接入2个STM-4+252个E1/T1标准接口、或2个STM-4+4个STM-1标准接口或上述接口的若干组合。
提供STM-4/1基于G.652光纤的全系列光接口,包括I-4、S-4.1、L4.1、L4.2光接口、I-1、S-1.1、L1.1、L1.2光接口,通过EDFA 可提供V-4.2、U4.2或V-1.2、U1.2光接口,满足各种传输距离的要求。
TC100B数据手册V1.3中文手册发布
青岛鼎信通讯股份有限公司目录1概述 (1)2功能特点 (1)3原理框图 (1)4引脚定义 (2)4.1 芯片引脚图 (2)4.2 引脚说明 (2)5功能描述 (3)5.1供电电源 (3)5.2过流保护功能 (3)5.3接收发送控制 (3)5.4数据收发 (3)6电气参数 (4)6.1额定直流电气参数 (4)6.2交流电气指标 (5)6.3电气特性图 (5)6.4ESD特性 (6)7封装尺寸 (7)8参考电路 (8)8.1典型应用电路 (8)8.2关键器件选型 (8)1概述XY•CN-PDC总线是一种可供电、无极性、两线制通信机制,具有通讯设备容量大,通讯速率高,设计简单,布线方便,抗干扰能力强等特点。
采用《可供电分布式控制协议XY•CN-PDC》,可保证在252个设备组网情况下,任一设备事件上报时间小于100mS,多点设备同时上报逐一提取,不会产生网络冲突。
XY•CN-PDC总线特别适用于三表集抄、智能家居控制、消防报警及联动控制、楼宇自动化控制等系统。
XY•CN-PDC总线采用主从方式通讯,TC100B芯片实现主站的通讯接口功能,TC001B芯片实现从站的通讯接口功能。
2功能特点静态功耗典型值小于1mA;工作电压范围宽:12V~36V;自带内部稳压输出:+5V,10mA;下行发码满幅电压调制,上行收码电流环解调,抗干扰能力强;最多可挂接252个节点设备;通讯距离1200m,上行通讯速率可达19200bps,下行通讯速率可达9600bps;采用半双工通讯;小体积QFN-16封装;可隔离设计保证电磁兼容特性;功率器件外置,芯片不易损坏;工作温度:-40℃~ +85℃。
3原理框图图1 TC100B原理框图4 引脚定义4.1 芯片引脚图T X DI D E TV O U TTREORXDBUSL GNDV D DV D E T REVINVBBUSHVCCN CR B图2 TC100B 芯片引脚图4.2注:当输入+5V/+3.3V 时,RXD 和EO 输出的高电平为+5V/+3.3V ,低电平为0V 。
TC1303A
TC1303A 固定输出应用 10 引脚 MSOP
VIN 2.7V 至 4.2V 4.7 µF 4.7 µH 8 2 7 1 RPULLUP 处理器的 RESET 4 VIN1 VIN2 SHDN1 SHDN2 PG LX VOUT1 VOUT2 AGND 9 4.7 µF PGND 10 6 3 5 1 µF VOUT2 2.5V @ 300 mA VOUT1 1.5V @ 500 mA
VIH
45
—
—
%VIN
VIN1 =VIN2 = 2.7V 至 5.5V
IIN
-1.0
±0.01
1.0
µA
VIN1 =VIN2 = 2.7V 至 5.5V SHDNX = GND SHDNY = VIN 注 6,注 7 VIN1 下降
VIN2
PGND AGND
PG TC1304(注) 带有延时的 PG 发生器
输出电压 定序器电路
Байду номын сангаас
AGND
VREF
UVLO VOUT2 LDO AGND
注:
TC1304 的 PG 开漏输出。
DS21949B_CN 第 4 页
2005 Microchip Technology Inc.
TC1303A/TC1303B/TC1303C/TC1304
TC1303B 可调输出应用 10 引脚 DFN
输入 电压 4.5V 至 5.5V * 可选 电容 VIN2 1.0 µF 4.7 µH 8 4.7 µF 2 7 1 4 处理器的 RESET VIN1 VIN2 SHDN1 SHDN2 PG LX 9 4.7 µF 200 kΩ VOUT2 1 µF 3.3V @ 300 mA 4.99 kΩ 33 pF 121 kΩ PGND 10 VOUT1 6 VOUT2 AGND 3 5 (注) VOUT1 2.1V @ 500 mA
TCIP智能家居对讲系统设备招标书
本文由【中文word文档库】搜集整理。
中文word文档库免费提供海量教学资料、行业资料、范文模板、应用文书、考试学习和社会经济等word文档数字家居TCP/IP系统技术要求一.数字家居系统网络要求1. 网络总体要求⏹采用星型网络拓扑结构⏹布线要求交换机至室内智能终端、交换机至梯口公用大门终端均采用超五类双绞线;管理中心至各楼栋接入点采用光纤连接。
⏹带宽要求管理中心交换机至各楼栋接入点交换机带宽达100M;楼栋交换机至室内智能终端、楼栋交换机至梯口公用大门终端带宽达10M。
⏹支持VLAN功能最多支持4K符合IEEE 802.1Q标准VLAN。
⏹支持广播风暴抑制功能支持基于端口带宽百分比的广播风暴抑制。
⏹支持生成树型协议支持STP/RSTP/MSTP。
⏹MAC地址表8K。
⏹支持堆叠功能⏹管理支持命令行接口、TELNET、CONSOLE口配置;支持QUIDVIEW网管系统、WEB网管;支持系统日志、分级告警。
⏹安全性用户分级管理和口令保护;支持802.1X认证、集中MAC地址认证。
2. 设备要求1)中心交换机⏹24口10/100M以太网端口⏹2个10/100M/1000M以太网端口⏹2个1000M SFP 以太网端口⏹管理端口:1个CONSOLE⏹交换容量:19.2Gbit/s,所有端口支持线速转发⏹包转发率:6.55Mpps2)楼栋交换机⏹24口10/100M以太网端口⏹管理端口:1个CONSOLE⏹交换容量:19.2Gbit/s,所有端口支持线速转发⏹包转发率:6.55Mpps3)服务器⏹内存要求1G以上⏹CPU主频3GHZ以上⏹CPU二级缓:2*2MB以上⏹硬盘:160G以上⏹光驱类型:DVD-ROM⏹需要安装声卡显卡驱动⏹操作系统Windowns2003(SP1)/XP(SP2)版⏹Microsoft SQL Server版本SQL server 2000sp44)管理员机⏹内存要求1G以上⏹CPU主频3GHZ以上⏹硬盘:160G以上⏹光驱类型:DVD-ROM⏹需要安装声卡显卡驱动⏹耳机和MIC⏹操作系统Windowns2003(SP1)/XP(SP2)版⏹Microsoft SQL Server版本SQL server 2000sp4二.系统功能要求1.可视对讲功能实现共用大门终端(梯口、区口)与室内智能终端、共用大门终端与中心可视对讲,中心与室内智能终端双向对讲。
PV1303版本2001.3中文
该文件为保密性文件。
我们保留一切更改权利。
未经大众公司康采恩集团标准部门的书面许可,不得转载、复印。
采购者只能通过相关的采购部门才能得到该标准。
©大众汽车公司在使用标准之前要检查是否为最新版本来源: N O L I S 部门第二页PV 1303:2001-032.概念2.1 恒定光所谓恒定光即在检验过程中试样以及耐光度标尺一直面对光源,也就是说,在检验过程中光源不会有明-暗的变化(光源转换)。
2.2 干照射即进行此项检验时不向被测物体喷水。
3.名称检验标准PV1303规定为热光照射。
4.要求由于零部件的安装位置不同,所要求的周期数在技术供货条件中已做出规定(请参见附件A-1)。
检验方法的要求与偏差要按照标准VW、技术供货条件TL或图纸以及产品放行规定来执行。
为了判断材质的耐光照性,有时需要在中间检验期间或照射检验之后加上其它的检测程序(例如进行电刷处理检测、克罗科计检测、马氏摩擦检测)。
5.检验5.1 原理即根据设备的条件对试样进行“恒定”和“干燥光”照射。
同时还需要考虑汽车车厢内的零部件的耐高温情况。
(用热光源照射)详细的检验条件在每项照射时间周期的说明中予以描述(根据DIN75202标准,1991版)。
5.2 检验设备必须使用光照检测设备,该光照检测设备必须符合DIN 75202标准的要求(例如,赫罗斯(Heraeus)公司的氙检测仪1200、1200CPS、Alpha氙检测仪、AlphaHE氙检测以及Beta氙检测仪,或者是阿特拉斯(Atlas)公司的Weather-Ometer CI35A,Fade-Ometer CI 3000、4000 型检测仪)。
为了确保供货商与验收者的检验结果可以相对照,在特殊情况下所选择使用的仪器类型必须与大众公司康采恩集团负责检验的部门进行协商。
建议将检验设备放置在可以调节温度的室内,否则的话可能需要使用空调装置。
第三页PV 1303:2001-03 5.3 光照条件下面所说明的滤光系统,其紫外线范围内的滤光边缘为320nm。
3843B中文资料
TL284xB, TL384xB HIGH-PERFORMANCE CURRENT-MODE PWM CONTROLLERS
SLVS610A – AUGUST 2006 – REVISED SEPTEMBER 2006
FEATURES
• Low Start-Up Current (<0.5 mA) • Trimmed Oscillator Discharge Current • Current Mode Operation to 500 kHz • Automatic Feed-Forward Compensation • Latching PWM for Cycle-by-Cycle Current
TOP-SIDE MARKING TL2842BP TL2843BP TL2844BP TL2845BP 2842B
2843B
2844B
2845B
TL2842B
TL2843B
TL2844B
TL2845B TL3842BP TL3843BP TL3844BP TL3845BP 3842B
3843B
3844B
FUNCTIONAL BLOCK DIAGRAM
34 V NOM 5 GND
−+
UVLO
5-V VREF EN
8 VREF
RT/CT 4
2.5 V OSC
VREF Good
Logic
Internal Bias
6 OUTPUT
T
2 VFB COMP 1
Error Amplifier
+ −
2R
R
1V
ISENSE 3 A. Pin numbers shown are for the 8-pin D package.
TC TR系列温度传感器说明书
TC/TR SERIESthe tc/tr series offers thermocouple and rtd temperature sensors for measurements ranging from -100 to +450 °c, or up to 600 °c for the t101-J model.the J type (Iron/constantan) or k type (chromel/alumel) thermocouples present a tubular stainless steel housing or with brass ring; the measurement junction is grounded in order to obtain the best response speed.The resistance temperature detectors are made with a Pt100Ω/0°c type platinium sensistive element and are available in different tubular housings, with chamfer point for penetrationmeasurements, or holed for detection in open air; in stainless steel in all cases, with an insulated sensitive element.The thermocouples and the resistance temperature detectors of the tc/tr series are suitable for applications in automatic packaging, food sector, plastic material printing and wood working.S e N S OR SPHOTOeLeCTRICTHeRMOCOUPLeS & ReSISTANCeCalibration J type tc (fe/cu-ni) - dIn 43710k type tc (ni-cr/ni-al) - dIn 43710Pt100Ω/0°c rtd - dIn 43760 (refer to table 1) Tolerance:thermocouple ± 2°c at 200°crtd ± 0.55°c at 200°cConnection:bi-polar 2 m cable2 screw terminals (P105 mod.)tc polarity and colour - dIn 43713, non-polarised rtd (refer to table 2) Assembly:tc with grounded junctionrtd with insulated elementHousing material:stainless steel aIsI 304brass ring (t104-J and t104-k mod.)Operating temperature:-100 ... +450°c-100 ... +600°c (t101-J and t102-k mod.)Table 1: SENSOR CALIBRATIONTable 2: SENSOR CONNECTIONt101-Jt102-J/kt104-J/kP103P102P101P105P106mmthe company endeavours to continuously improve and renew its products; for this reason the technical data and contents of this catalogue may undergo variations without prior notice. for correct installation and use, the company can guarantee only the data indicated in the instruction manual supplied with the products.。
TC1303B-DP3EUNTR资料
TC1303BFeatures•Dual-Output Regulator (500mA Buck Regulator and 300mA Low-Dropout Regulator)•Power-Good Output with 300ms Delay•Total Device Quiescent Current = 65µA, Typ.•Independent Shutdown for Buck and LDO Outputs•Both Outputs Internally Compensated •Synchronous Buck Regulator:-Over 90% Typical Efficiency- 2.0MHz Fixed Frequency PWM(Heavy Load)-Low Output Noise-Automatic PWM to PFM mode transition-Adjustable (0.8V to 4.5V) and Standard FixedOutput Voltages (0.8V, 1.2V, 1.5V, 1.8V, 2.5V,3.3V)•Low-Dropout Regulator:-Low-Dropout Voltage=137mV Typ. @200mA-Standard Fixed Output Voltages(1.5V, 1.8V, 2.5V, 3.3V)•Power-Good Function:-Monitors LDO Output Function (TC1303B)-300ms Delay Used for Processor Reset •Small 10-pin 3X3 DFN or MSOP Package Options•Operating Junction Temperature Range:--40°C to +125°C•Undervoltage Lockout (UVLO)•Output Short Circuit Protection •Overtemperature ProtectionApplications•Cellular Phones•Portable Computers•USB Powered Devices•Handheld Medical Instruments•Organizers and PDAs DescriptionThe TC1303B combines a 500mA synchronous buck regulator and 300mA Low-Dropout Regulator (LDO) with a power-good monitor to provide a highly integrated solution for devices that require multiple supply voltages. The unique combination of an integrated buck switching regulator and low-dropout linear regulator provides the lowest system cost for dual-output voltage applications that require one lower processor core voltage and one higher bias voltage. The 500mA synchronous buck regulator switches at a fixed frequency of 2.0MHz when the load is heavy providing a low noise, small-size solution. When the load on the buck output is reduced to light levels, it changes operation to a Pulse Frequency Modulation (PFM) mode to minimize quiescent current draw from the battery. No intervention is necessary for smooth transition from one mode to another.The LDO provides a 300mA auxiliary output that requires a single 1µF ceramic output capacitor, minimizing board area and cost. The typical dropout voltage for the LDO output is 137mV for a 200mA load.For the TC1303B, the power-good output logic level is based on the regulation of the LDO output only. The buck regulator can be turned on and off without affecting the power-good signal.The TC1303B is available in either the 10-pin DFN or MSOP package.Additional protection features include: UVLO, overtemperature and overcurrent protection on both outputs.For a complete listing of TC1303B standard parts, con-sult your Microchip representative.Package Type10-Lead DFN12687910543SHDN2V IN2V OUT2A GNDP GNDL XV IN1SHDN1V FB1/V OUT1PG10-Lead MSOP12687910543SHDN2V IN2V OUT2A GNDP GNDL XV IN1SHDN1V FB1/V OUT1PG500mA Synchronous Buck Regulator,+ 300mA LDO with Power-Good Output© 2005 Microchip Technology Inc.DS21949A-page 1TC1303BDS21949A-page 2© 2005 Microchip Technology Inc.Functional Block DiagramSynchronous BUCK RegulatorNDRVPDRVP GNDV IN1L XDriverP GNDControlV OUT1/V FB1V IN2SHDN1PGV REFLDOV OUT2A GNDA GNDP GNDUndervoltage LockoutUVLOUVLOSHDN2V REFTC1303BPG Generator with Delay(UVLO)© 2005 Microchip Technology Inc.DS21949A-page 3TC1303BTypical Application Circuits10-Lead DFN12687910543SHDN2V IN2V OUT2A GNDP GND L XV IN1SHDN1V OUT1PG4.7µFProcessor RESETInput Voltage 4.7µH4.7µF2.1V @1µF3.3V @4.5V to5.5V Adjustable Output Application121k Ω200k Ω 4.99k Ω33pF 12687910543SHDN2V IN2V OUT2A GNDP GND L X V IN1SHDN1V OUT1PG4.7µFProcessor RESET4.7µH4.7µF1.5V @ 500mA1µF2.5V @ 300mA2.7V to 4.2VTC1303BV OUT1V OUT2V IN V OUT1V OUT21.0µF*Optional Capacitor V IN2300mA500mANote: Connect DFN package exposed pad to A GND .10-Lead MSOPFixed Output ApplicationTC1303BNoteTC1303BDS21949A-page 4© 2005 Microchip Technology Inc.1.0ELECTRICALCHARACTERISTICSAbsolute Maximum Ratings †V IN - A GND ......................................................................6.0V All Other I/O ..............................(A GND - 0.3V) to (V IN + 0.3V)L X to P GND ..............................................-0.3V to (V IN + 0.3V)P GND to A GND ...................................................-0.3V to +0.3V Output Short Circuit Current .................................Continuous Power Dissipation (Note 7)..........................Internally Limited Storage temperature.....................................-65°C to +150°C Ambient Temp. with Power Applied.................-40°C to +85°C Operating Junction Temperature...................-40°C to +125°C ESD protection on all pins (HBM)....................................... 3kV† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied.Exposure to maximum rating conditions for extended periods may affect device reliability.DC CHARACTERISTICSElectrical Characteristics: V IN1=V IN2=SHDN1,2=3.6V,C OUT1=C IN =4.7µF, C OUT2=1µF,L =4.7µH, V OUT1 (ADJ)=1.8V, I OUT1=100ma, I OUT2=0.1mA T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C .ParametersSymMinTypMaxUnitsConditionsInput/Output Characteristics Input VoltageV IN 2.7— 5.5V Note 1, Note 2, Note 8Maximum Output Current I OUT1_MAX 500——mA Note 1Maximum Output Current I OUT2_MAX 300——mA Note 1Shutdown CurrentCombined V IN1 and V IN2 Current I IN_SHDN—0.051µA SHDN1=SHDN2=GND TC1303B Operating I Q I Q—65.0110µA SHDN1=SHDN2=V IN2I OUT1=0mA,I OUT2=0mA Synchronous Buck I Q —38—µA SHDN1 = V IN , SHDN2 = GND LDO I Q + Voltage Monitor I Q —46—µA SHDN1 = GND, SHDN2 = V IN2Shutdown/UVLO/Thermal Shutdown CharacteristicsSHDN1,SHDN2,Logic Input Voltage Low V IL ——15%V IN V IN1=V IN2=2.7V to 5.5V SHDN1,SHDN2,Logic Input Voltage High V IH 45——%V IN V IN1=V IN2=2.7V to 5.5V SHDN1,SHDN2,Input Leakage Current I IN -1.0±0.011.0µAV IN1=V IN2=2.7V to 5.5V SHDNX =GND SHDNY =V IN Thermal ShutdownT SHD —165—°C Note 6, Note 7Thermal Shutdown Hysteresis T SHD-HYS —10—°C Undervoltage Lockout (V OUT1 and V OUT2)UVLO 2.4 2.55 2.7V V IN1 FallingUndervoltage Lockout Hysteresis UVLO -HYS—200—mVNote 1:The Minimum V IN has to meet two conditions: V IN ≥ 2.7V and V IN ≥ V RX + V DROPOUT , V RX = V R1 or V R2.2:V RX is the regulator output voltage setting.3:TCV OUT2 = ((V OUT2max – V OUT2min ) * 106)/(V OUT2 * D T ).4:Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current.5:Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.6:The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junctiontemperature and the thermal resistance from junction to air. (i.e. T A , T J , θJA ). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown.7:The integrated MOSFET switches have an integral diode from the L X pin to V IN , and from L X to P GND . In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.8:V IN1 and V IN2 are supplied by the same input source.TC1303BSynchronous Buck Regulator (V OUT1)Adjustable Output Voltage Range V OUT10.8— 4.5VAdjustable Reference FeedbackVoltage (V FB1)V FB10.780.80.82VFeedback Input Bias Current(I FB1)I VFB1—-1.5—nAOutput Voltage Tolerance Fixed(V OUT1)V OUT1-2.5±0.3+2.5%Note2Line Regulation (V OUT1)V LINE-REG—0.2—%/V V IN =V R+1V to 5.5V,I LOAD = 100mALoad Regulation (V OUT1)V LOAD-REG—0.2—%V IN=V R+1.5V,I LOAD=100mA to500mA (Note1)Dropout Voltage V OUT1V IN – V OUT1—280—mV I OUT1 = 500mA, V OUT1=3.3V(Note5)Internal Oscillator Frequency F OSC 1.6 2.0 2.4MHzStart Up Time T SS—0.5—ms T R = 10% to 90%R DSon P-CHANNEL R DSon-P—450650mΩI P=100mAR DSon N-CHANNEL R DSon-N—450650mΩI N=100mAL X Pin Leakage Current I LX-1.0±0.01 1.0μA SHDN = 0V, V IN = 5.5V, L X = 0V,L X = 5.5VPositive Current Limit Threshold+I LX(MAX)—700—mALDO Output (V OUT2)Output Voltage Tolerance (V OUT2)V OUT2-2.5±0.3+2.5%Note2Temperature Coefficient TCV OUT—25—ppm/°C Note3Line RegulationΔV OUT2/ΔV IN-0.2±0.02+0.2%/V(V R+1V) ≤ V IN≤ 5.5VLoad Regulation, V OUT2≥ 2.5VΔV OUT2/I OUT2-0.750.1+0.75%I OUT2 = 0.1mA to 300mA(Note4)Load Regulation, V OUT2 < 2.5VΔV OUT2/I OUT2-0.900.1+0.90%I OUT2 = 0.1mA to 300mA(Note4)Dropout Voltage V OUT2 > 2.5V V IN – V OUT2—137205300500mV I OUT2 = 200mA (Note5)I OUT2=300mAPower Supply Rejection Ratio PSRR—62—dB f ≤ 100Hz, I OUT1 = I OUT2 = 50mA,C IN = 0µFOutput Noise eN— 1.8—µV/(Hz)½ f ≤ 1kHz, I OUT2=50mA,SHDN1=GNDOutput Short Circuit Current (Average)I OUT sc2—240—mA R LOAD2≤ 1ΩDC CHARACTERISTICS (CONTINUED)Electrical Characteristics: V IN1=V IN2=SHDN1,2=3.6V,C OUT1=C IN=4.7µF, C OUT2=1µF,L=4.7µH, V OUT1 (ADJ)=1.8V,I OUT1=100ma, I OUT2=0.1mA T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C.Parameters Sym Min Typ Max Units ConditionsNote1:The Minimum V IN has to meet two conditions: V IN≥ 2.7V and V IN≥ V RX + V DROPOUT, V RX = V R1 or V R2.2:V RX is the regulator output voltage setting.3:TCV OUT2 = ((V OUT2max – V OUT2min) * 106)/(V OUT2 * D T).4:Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current.5:Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.6:The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e. T A, T J, θJA). Exceeding the maximum allowable powerdissipation causes the device to initiate thermal shutdown.7:The integrated MOSFET switches have an integral diode from the L X pin to V IN, and from L X to P GND. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is notable to limit the junction temperature for these cases.8:V IN1 and V IN2 are supplied by the same input source.© 2005 Microchip Technology Inc.DS21949A-page 5TC1303BDS21949A-page 6© 2005 Microchip Technology Inc.Wake-Up Time (From SHDN2 mode), (V OUT2)t WK —31100µs I OUT1 = I OUT2 = 50mA Settling Time (From SHDN2 mode), (V OUT2)t S—100—µsI OUT1 = I OUT2 = 50mAPower-Good Voltage Range PGV PG1.01.2—5.55.5VT A = 0°C to +70°C T A = -40°C to +85°C V IN ≤ 2.7 I SINK = 100µA PG Threshold High (V OUT1 or V OUT2)V TH_H —9496% of V OUTX On Rising V OUT1 or V OUT2V OUTX =V OUT1 or V OUT2PG Threshold Low (V OUT1 or V OUT2)V TH_L 8992—% of V OUTX On Falling V OUT1 or V OUT2V OUTX =V OUT1 or V OUT2PG Threshold Hysteresis (V OUT1 and V OUT2)V TH_HYS —2—% of V OUTXV OUTX =V OUT1 or V OUT2PG Threshold Tempco ΔV TH /ΔT —30—ppm/°C PG Delayt RPD —165—µs V OUT1 or V OUT2=(V TH + 100mV)to (V TH - 100mV)PG Active Time-out Periodt RPU140262560msV OUT1or V OUT2=V TH -100mV to V TH +100mV,I SINK = 1.2mAPG Output Voltage LowPG_V OL——0.2VV OUT1o r V OUT2=V TH -100mV , I PG = 1.2mA V IN2>2.7VI PG = 100µA, 1.0V <V IN2< 2.7V PG Output Voltage HighPG_V OH 0.9*V OUT2——VV OUT1 or V OUT2=V TH + 100mV V OUT2 ≥ 1.8V, I PG =-500µA VOUT2 < 1.8V,I PG =-300µADC CHARACTERISTICS (CONTINUED)Electrical Characteristics: V IN1=V IN2=SHDN1,2=3.6V,C OUT1=C IN =4.7µF, C OUT2=1µF,L =4.7µH, V OUT1 (ADJ)=1.8V, I OUT1=100ma, I OUT2=0.1mA T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C .ParametersSym Min Typ Max Units ConditionsNote 1:The Minimum V IN has to meet two conditions: V IN ≥ 2.7V and V IN ≥ V RX + V DROPOUT , V RX = V R1 or V R2.2:V RX is the regulator output voltage setting.3:TCV OUT2 = ((V OUT2max – V OUT2min ) * 106)/(V OUT2 * D T ).4:Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current.5:Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.6:The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junctiontemperature and the thermal resistance from junction to air. (i.e. T A , T J , θJA ). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown.7:The integrated MOSFET switches have an integral diode from the L X pin to V IN , and from L X to P GND . In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.8:V IN1 and V IN2 are supplied by the same input source.TC1303BTEMPERATURE SPECIFICATIONSElectrical Specifications: Unless otherwise indicated, all limits are specified for: V IN = +2.7V to +5.5V Parameters Sym Min Typ Max Units Conditions Temperature RangesT J-40—+125°C Steady stateOperating Junction TemperatureRangeStorage Temperature Range T A-65—+150°CMaximum Junction Temperature T J——+150°C TransientThermal Package ResistancesThermal Resistance, 10L-DFNθJA—41—°C/W Typical 4-layer board withInternal Ground Plane and 2 Viasin Thermal PadThermal Resistance, 10L-MSOPθJA—113—°C/W Typical 4-layer board withInternal Ground Plane© 2005 Microchip Technology Inc.DS21949A-page 7TC1303BDS21949A-page 8© 2005 Microchip Technology Inc.2.0TYPICAL PERFORMANCE CURVESNote: Unless otherwise indicated, V IN1= V IN2=SHDN1,2=3.6V,C OUT1=C IN =4.7µF,C OUT2=1µF,L =4.7µH,V OUT1 (ADJ)=1.8V, T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A =+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-1:I Q Switcher and LDO Current vs. Ambient Temperature.FIGURE 2-2:I Q Switcher Current vs. Ambient Temperature.FIGURE 2-3:I Q LDO Current vs. AmbientTemperature.FIGURE 2-4:V OUT1 Output Efficiency vs. Input Voltage (V OUT1 = 1.2V).FIGURE 2-5:V OUT1 Output Efficiency vs. I OUT1 (V OUT1 = 1.2V).FIGURE 2-6:V OUT1 Output Efficiency vs. Input Voltage (V OUT1 = 1.8V).Note:The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.TC1303B Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-7:V OUT1 Output Efficiency vs.I OUT1 (V OUT1 = 1.8V).FIGURE 2-8:V OUT1 Output Efficiency vs.Input Voltage (V OUT1 = 3.3V).FIGURE 2-9:V OUT1 Output Efficiency vs.I OUT1 (V OUT1 = 3.3V).FIGURE 2-10:V OUT1 vs. I OUT1(V OUT1 = 1.2V).FIGURE 2-11:V OUT1 vs. I OUT1(V OUT1 = 1.8V).FIGURE 2-12:V OUT1 vs. I OUT1(V OUT1 = 3.3V).© 2005 Microchip Technology Inc.DS21949A-page 9TC1303BDS21949A-page 10 2005 Microchip Technology Inc.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN =4.7µF, C OUT2=1µF, L =4.7µH,V OUT1 (ADJ)=1.8V, T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A =+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.OUT1 Switching Frequencyvs. Input Voltage.OUT1 Switching Frequency vs. Ambient Temperature.OUT1 Adjustable Feedback Voltage vs. Ambient Temperature.OUT1 Switch Resistancevs. Input Voltage.Resistance vs. Ambient Temperature.OUT1 Dropout Voltage vs. Ambient Temperature.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-19:V OUT1 and V OUT2 HeavyLoad Switching Waveforms vs. Time.FIGURE 2-20:V OUT1 and V OUT2 LightLoad Switching Waveforms vs. Time.FIGURE 2-21:V OUT2 Output Voltage vs.Input Voltage (V OUT2 = 1.5V).FIGURE 2-22:V OUT2 Output Voltage vs.Input Voltage (V OUT2 = 1.8V).FIGURE 2-23:V OUT2 Output Voltage vs.Input Voltage (V OUT2 = 2.5V).FIGURE 2-24:V OUT2 Output Voltage vs.Input Voltage (V OUT2= 3.3V).Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-25:V OUT2 Dropout Voltage vs.Ambient Temperature (V OUT2 = 2.5V).FIGURE 2-26:V OUT2 Dropout Voltage vs.Ambient Temperature (V OUT2 = 3.3V).FIGURE 2-27:V OUT2 Line Regulation vs.Ambient Temperature.FIGURE 2-28:V OUT2 Load Regulation vs.Ambient Temperature.FIGURE 2-29:PG Active Delay Time-outvs. Ambient Temperature.FIGURE 2-30:PG Threshold Voltage vs.Ambient Temperature.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-31:PG Output Voltage LevelLow vs. Ambient Temperature.FIGURE 2-32:PG Output Voltage LevelHigh vs. Ambient Temperature.FIGURE 2-33:V OUT2 Power Supply RippleRejection vs. Frequency.FIGURE 2-34:V OUT2 Noise vs. Frequency.FIGURE 2-35:V OUT1 Load Step Responsevs. Time.FIGURE 2-36:V OUT2 Load Step Responsevs. Time.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-37:V OUT1 and V OUT2 Line StepResponse vs. Time.FIGURE 2-38:V OUT1 and V OUT2 StartupWaveforms.FIGURE 2-39:V OUT1 and V OUT2 ShutdownWaveforms.FIGURE 2-40:Power-Good Output Timing.3.0PIN DESCRIPTIONSThe descriptions of the pins are listed in Table3-1. TABLE 3-1:PIN FUNCTION TABLE3.1LDO Shutdown Input Pin (SHDN2) SHDN2 is a logic level input used to turn the LDO Reg-ulator on and off. A logic high (> 45% of V IN), will enable the regulator output. A logic low (< 15% of V IN) will ensure that the output is turned off.3.2LDO Input Voltage Pin (V IN2)V IN2 is a LDO power input supply pin. Connect variable input voltage source to V IN2. Connect V IN1 and V IN2 together with board traces as short as possible. V IN2 provides the input voltage for the LDO regulator. An additional capacitor can be added to lower the LDO regulator input ripple voltage.3.3LDO Output Voltage Pin (V OUT2)V OUT2 is a regulated LDO output voltage pin. Connect a 1µF or larger capacitor to V OUT2 and A GND for proper operation.3.4Power-Good Output Pin (PG)PG is an output level indicating that V OUT2 (LDO) is within 94% of regulation. The PG output is configured as a push-pull for the TC1303B.3.5Analog Ground Pin (A GND)A GND is the analog ground connection. Tie A GND to the analog portion of the ground plane (A GND). See the physical layout information in Section 5.0 “Application Circuits/Issues” for grounding recommendations. 3.6Buck Regulator Output Sense Pin(V FB/V OUT1)For V OUT1 adjustable output voltage options, connect the center of the output voltage divider to the V FB pin. For fixed-output voltage options, connect the output of the buck regulator to this pin (V OUT1). 3.7Buck Regulator Shutdown InputPin (SHDN1)regulator on and off. A logic-high (> 45% of V IN), will enable the regulator output. A logic-low (< 15% of V IN) will ensure that the output is turned off.3.8Buck Regulator Input Voltage Pin(V IN1)V IN1 is the buck regulator power input supply pin. Connect a variable input voltage source to V IN1. Connect V IN1 and V IN2 together with board traces as short as possible.3.9Buck Inductor Output Pin (L X) Connect L X directly to the buck inductor. This pin carries large signal-level current; all connections should be made as short as possible.3.10Power Ground Pin (P GND)Connect all large-signal level ground returns to P GND. These large-signal, level ground traces should have a small loop area and length to prevent coupling of switching noise to sensitive traces. Please see the physical layout information supplied in Section 5.0“Application Circuits/Issues” for grounding recommendations.3.11Exposed Pad (EP)For the DFN package, connect the EP to A GND with vias into the A GND plane.Pin Function1SHDN2Active Low Shutdown Input for LDO Output Pin2V IN2Analog Input Supply Voltage Pin3V OUT2LDO Output Voltage Pin4PG Power-good Output Pin5A GND Analog Ground Pin6V FB / V OUT1Buck Feedback Voltage (Adjustable Version) / Buck Output Voltage (Fixed Version) Pin 7SHDN1Active Low Shutdown Input for Buck Regulator Output Pin8V IN1Buck Regulator Input Voltage Pin9L X Buck Inductor Output Pin10P GND Power Ground PinEP ExposedPad For the DFN package, the center exposed pad is a thermal path to remove heat from the device. Electrically this pad is at ground potential and should be connected to A GND.4.0DETAILED DESCRIPTION4.1Device OverviewThe TC1303B combines a 500mA synchronous buck regulator with a 300mA LDO and a power-good output. This unique combination provides a tiny, low-cost solution for applications that require two or more voltage rails. The buck regulator can deliver high-output current over a wide range of input-to-output voltage ratios while maintaining high efficiency. This is typically used for the lower-voltage, high-current processor core. The LDO is a minimal parts-count solution, (single-output capacitor), providing a regulated voltage for an auxiliary rail. The typical LDO dropout voltage (137mV @ 200mA) allows the use of very low input-to-output LDO differential voltages, minimizing the power loss internal to the LDO pass transistor. A power-good output is provided, indicating that the LDO output is in regulation (TC1303B). Additional features include independent shutdown inputs, UVLO, overcurrent and overtemperature shutdown.4.2Synchronous Buck RegulatorThe synchronous buck regulator is capable of supply-ing a 500mA continuous output current over a wide range of input and output voltages. The output voltage range is from 0.8V (min) to 4.5V (max). The regulator operates in three different modes and automatically selects the most efficient mode of operation. During heavy load conditions, the TC1303B buck converter operates at a high, fixed frequency (2.0MHz) using current mode control. This minimizes output ripple and noise (less than 8mV peak-to-peak ripple) while main-taining high efficiency (typically > 90%). For standby or light load applications, the buck regulator will automat-ically switch to a power-saving Pulse Frequency Modulation (PFM) mode. This minimizes the quiescent current draw on the battery, while keeping the buck output voltage in regulation. The typical buck PFM mode current is 38µA. The buck regulator is capable of operating at 100% duty cycle, minimizing the voltage drop from input to output for wide input battery-powered applications. For fixed-output voltage applica-tions, the feedback divider and control loop compensa-tion components are integrated, eliminating the need for external components. The buck regulator output is protected against overcurrent, short circuit and over-temperature. While shut down, the synchronous buck N-channel and P-channel switches are off, so the L X pin is in a high-impedance state (this allows for connecting a source on the output of the buck regulator as long as its voltage does not exceed the input voltage).4.2.1FIXED FREQUENCY PWM MODE While operating in Pulse Width Modulation (PWM) mode, the TC1303B buck regulator switches at a fixed 2.0MHz frequency. The PWM mode is suited for higher load current operation, maintaining low output noise and high conversion efficiency. PFM to PWM mode transition is initiated for any of the following conditions.•Continuous inductor current is sensed•Inductor peak current exceeds 100mA•The buck regulator output voltage has droppedout of regulation (step load has occurred)The typical PFM-to-PWM threshold is 80mA.4.2.2PFM MODEPFM mode is entered when the output load on the buck regulator is very light. Once detected, the converter enters the PFM mode automatically and begins to skip pulses to minimize unnecessary quiescent current draw by reducing the number of switching cycles per second. The typical quiescent current for the switching regulator is less than 35µA. The transition from PWM to PFM mode occurs when discontinuous inductor current is sensed, or the peak inductor current is less than 60mA (typ.). The typical PWM to PFM mode threshold is 30mA. For low input-to-output differential voltages, the PWM to PFM mode threshold can be low due to the lack of ripple current. It is recommended that V IN1 be one volt greater than V OUT1 for PWM to PFM transitions.4.3Low Drop Out Regulator (LDO)The LDO output is a 300mA low-dropout linear regula-tor that provides a regulated output voltage with a single 1µF external capacitor. The output voltage is available in fixed options only, ranging from 1.5V to 3.3V. The LDO is stable using ceramic output capaci-tors that inherently provide lower output noise and reduce the size and cost of the regulator solution. The quiescent current consumed by the LDO output is typically less than 20µA, with a typical dropout voltage of 137mV at 200mA. The LDO output is protected against overcurrent and overtemperature.。
连接器中可以替代塑胶件的材料ppt实用资料
2300,ATX203R
2412
2400, 2410R,1010
光学滤镜/光纤阵列项目(基于面射型镭射的应用)
内部收发器的滤镜
晶体管的光学滤镜
LIGHT LEAK新一代外设高速传输 设备 微镜阵列
Ultem制造的微 镜阵列
器件说明: 连接大约10cm或者更短的距离,防电 磁干扰。和光纤接收器的要求相同。
光纤收发器的滤镜
光纤收发器能实现电气信号和光信号的互相转换,它是作为一个模块安装在印刷电路板上。 Ultem是用来做这个装置的滤镜 (光发射次模块TOSA/光接收次模块ROSA 的滤镜). 材料要求 : 高折射率(Ultem1010为1.64)
耐高温高湿环境: 85℃/85% 2,000H 高洁净度 (较低的杂质含量) 红外线透过性能 (红外波长为 850nm) 衰减控制 (特殊牌号 ULTEM 1010TC可以) UL94 V-0级别阻燃 高流动性 SABIC 材料:Ultem PEI 1010, 1010TC, DT1810EV
现有材料 : 无 客户要求 : 高流动性 低杂质含量 稳定的红外透过性能 (850nm) +-2% SABIC的材料: 1010
器件说明: 自动推进的网络系统 目前是使用 瑞翁公司生产的 ZEONEX,但是新一代产品将要求有 回流焊性能。
现有材料: ZEONEX (一种非晶型聚烯烃) 客户要求: 可回流焊 低杂质含量 红外透过性能 (850nm) SABIC的材料: 1010, XH6050, EXTEM XH
Ferrule
(TAM : 60MT)
SABIC 的对应材料 :
1010, XH6050, EXTEM XH
陶瓷插芯器固件定说明了:光纤的位置,并把从连接器到适配器器件的说明光:纤表面连接起来,而套筒是固定器陶件瓷说插明芯: 的。
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
TC1303BFeatures•Dual-Output Regulator (500mA Buck Regulator and 300mA Low-Dropout Regulator)•Power-Good Output with 300ms Delay•Total Device Quiescent Current = 65µA, Typ.•Independent Shutdown for Buck and LDO Outputs•Both Outputs Internally Compensated •Synchronous Buck Regulator:-Over 90% Typical Efficiency- 2.0MHz Fixed Frequency PWM(Heavy Load)-Low Output Noise-Automatic PWM to PFM mode transition-Adjustable (0.8V to 4.5V) and Standard FixedOutput Voltages (0.8V, 1.2V, 1.5V, 1.8V, 2.5V,3.3V)•Low-Dropout Regulator:-Low-Dropout Voltage=137mV Typ. @200mA-Standard Fixed Output Voltages(1.5V, 1.8V, 2.5V, 3.3V)•Power-Good Function:-Monitors LDO Output Function (TC1303B)-300ms Delay Used for Processor Reset •Small 10-pin 3X3 DFN or MSOP Package Options•Operating Junction Temperature Range:--40°C to +125°C•Undervoltage Lockout (UVLO)•Output Short Circuit Protection •Overtemperature ProtectionApplications•Cellular Phones•Portable Computers•USB Powered Devices•Handheld Medical Instruments•Organizers and PDAs DescriptionThe TC1303B combines a 500mA synchronous buck regulator and 300mA Low-Dropout Regulator (LDO) with a power-good monitor to provide a highly integrated solution for devices that require multiple supply voltages. The unique combination of an integrated buck switching regulator and low-dropout linear regulator provides the lowest system cost for dual-output voltage applications that require one lower processor core voltage and one higher bias voltage. The 500mA synchronous buck regulator switches at a fixed frequency of 2.0MHz when the load is heavy providing a low noise, small-size solution. When the load on the buck output is reduced to light levels, it changes operation to a Pulse Frequency Modulation (PFM) mode to minimize quiescent current draw from the battery. No intervention is necessary for smooth transition from one mode to another.The LDO provides a 300mA auxiliary output that requires a single 1µF ceramic output capacitor, minimizing board area and cost. The typical dropout voltage for the LDO output is 137mV for a 200mA load.For the TC1303B, the power-good output logic level is based on the regulation of the LDO output only. The buck regulator can be turned on and off without affecting the power-good signal.The TC1303B is available in either the 10-pin DFN or MSOP package.Additional protection features include: UVLO, overtemperature and overcurrent protection on both outputs.For a complete listing of TC1303B standard parts, con-sult your Microchip representative.Package Type10-Lead DFN12687910543SHDN2V IN2V OUT2A GNDP GNDL XV IN1SHDN1V FB1/V OUT1PG10-Lead MSOP12687910543SHDN2V IN2V OUT2A GNDP GNDL XV IN1SHDN1V FB1/V OUT1PG500mA Synchronous Buck Regulator,+ 300mA LDO with Power-Good Output© 2005 Microchip Technology Inc.DS21949A-page 1TC1303BDS21949A-page 2© 2005 Microchip Technology Inc.Functional Block DiagramSynchronous BUCK RegulatorNDRVPDRVP GNDV IN1L XDriverP GNDControlV OUT1/V FB1V IN2SHDN1PGV REFLDOV OUT2A GNDA GNDP GNDUndervoltage LockoutUVLOUVLOSHDN2V REFTC1303BPG Generator with Delay(UVLO)© 2005 Microchip Technology Inc.DS21949A-page 3TC1303BTypical Application Circuits10-Lead DFN12687910543SHDN2V IN2V OUT2A GNDP GND L XV IN1SHDN1V OUT1PG4.7µFProcessor RESETInput Voltage 4.7µH4.7µF2.1V @1µF3.3V @4.5V to5.5V Adjustable Output Application121k Ω200k Ω 4.99k Ω33pF 12687910543SHDN2V IN2V OUT2A GNDP GND L X V IN1SHDN1V OUT1PG4.7µFProcessor RESET4.7µH4.7µF1.5V @ 500mA1µF2.5V @ 300mA2.7V to 4.2VTC1303BV OUT1V OUT2V IN V OUT1V OUT21.0µF*Optional Capacitor V IN2300mA500mANote: Connect DFN package exposed pad to A GND .10-Lead MSOPFixed Output ApplicationTC1303BNoteTC1303BDS21949A-page 4© 2005 Microchip Technology Inc.1.0ELECTRICALCHARACTERISTICSAbsolute Maximum Ratings †V IN - A GND ......................................................................6.0V All Other I/O ..............................(A GND - 0.3V) to (V IN + 0.3V)L X to P GND ..............................................-0.3V to (V IN + 0.3V)P GND to A GND ...................................................-0.3V to +0.3V Output Short Circuit Current .................................Continuous Power Dissipation (Note 7)..........................Internally Limited Storage temperature.....................................-65°C to +150°C Ambient Temp. with Power Applied.................-40°C to +85°C Operating Junction Temperature...................-40°C to +125°C ESD protection on all pins (HBM)....................................... 3kV† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied.Exposure to maximum rating conditions for extended periods may affect device reliability.DC CHARACTERISTICSElectrical Characteristics: V IN1=V IN2=SHDN1,2=3.6V,C OUT1=C IN =4.7µF, C OUT2=1µF,L =4.7µH, V OUT1 (ADJ)=1.8V, I OUT1=100ma, I OUT2=0.1mA T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C .ParametersSymMinTypMaxUnitsConditionsInput/Output Characteristics Input VoltageV IN 2.7— 5.5V Note 1, Note 2, Note 8Maximum Output Current I OUT1_MAX 500——mA Note 1Maximum Output Current I OUT2_MAX 300——mA Note 1Shutdown CurrentCombined V IN1 and V IN2 Current I IN_SHDN—0.051µA SHDN1=SHDN2=GND TC1303B Operating I Q I Q—65.0110µA SHDN1=SHDN2=V IN2I OUT1=0mA,I OUT2=0mA Synchronous Buck I Q —38—µA SHDN1 = V IN , SHDN2 = GND LDO I Q + Voltage Monitor I Q —46—µA SHDN1 = GND, SHDN2 = V IN2Shutdown/UVLO/Thermal Shutdown CharacteristicsSHDN1,SHDN2,Logic Input Voltage Low V IL ——15%V IN V IN1=V IN2=2.7V to 5.5V SHDN1,SHDN2,Logic Input Voltage High V IH 45——%V IN V IN1=V IN2=2.7V to 5.5V SHDN1,SHDN2,Input Leakage Current I IN -1.0±0.011.0µAV IN1=V IN2=2.7V to 5.5V SHDNX =GND SHDNY =V IN Thermal ShutdownT SHD —165—°C Note 6, Note 7Thermal Shutdown Hysteresis T SHD-HYS —10—°C Undervoltage Lockout (V OUT1 and V OUT2)UVLO 2.4 2.55 2.7V V IN1 FallingUndervoltage Lockout Hysteresis UVLO -HYS—200—mVNote 1:The Minimum V IN has to meet two conditions: V IN ≥ 2.7V and V IN ≥ V RX + V DROPOUT , V RX = V R1 or V R2.2:V RX is the regulator output voltage setting.3:TCV OUT2 = ((V OUT2max – V OUT2min ) * 106)/(V OUT2 * D T ).4:Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current.5:Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.6:The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junctiontemperature and the thermal resistance from junction to air. (i.e. T A , T J , θJA ). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown.7:The integrated MOSFET switches have an integral diode from the L X pin to V IN , and from L X to P GND . In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.8:V IN1 and V IN2 are supplied by the same input source.TC1303BSynchronous Buck Regulator (V OUT1)Adjustable Output Voltage Range V OUT10.8— 4.5VAdjustable Reference FeedbackVoltage (V FB1)V FB10.780.80.82VFeedback Input Bias Current(I FB1)I VFB1—-1.5—nAOutput Voltage Tolerance Fixed(V OUT1)V OUT1-2.5±0.3+2.5%Note2Line Regulation (V OUT1)V LINE-REG—0.2—%/V V IN =V R+1V to 5.5V,I LOAD = 100mALoad Regulation (V OUT1)V LOAD-REG—0.2—%V IN=V R+1.5V,I LOAD=100mA to500mA (Note1)Dropout Voltage V OUT1V IN – V OUT1—280—mV I OUT1 = 500mA, V OUT1=3.3V(Note5)Internal Oscillator Frequency F OSC 1.6 2.0 2.4MHzStart Up Time T SS—0.5—ms T R = 10% to 90%R DSon P-CHANNEL R DSon-P—450650mΩI P=100mAR DSon N-CHANNEL R DSon-N—450650mΩI N=100mAL X Pin Leakage Current I LX-1.0±0.01 1.0μA SHDN = 0V, V IN = 5.5V, L X = 0V,L X = 5.5VPositive Current Limit Threshold+I LX(MAX)—700—mALDO Output (V OUT2)Output Voltage Tolerance (V OUT2)V OUT2-2.5±0.3+2.5%Note2Temperature Coefficient TCV OUT—25—ppm/°C Note3Line RegulationΔV OUT2/ΔV IN-0.2±0.02+0.2%/V(V R+1V) ≤ V IN≤ 5.5VLoad Regulation, V OUT2≥ 2.5VΔV OUT2/I OUT2-0.750.1+0.75%I OUT2 = 0.1mA to 300mA(Note4)Load Regulation, V OUT2 < 2.5VΔV OUT2/I OUT2-0.900.1+0.90%I OUT2 = 0.1mA to 300mA(Note4)Dropout Voltage V OUT2 > 2.5V V IN – V OUT2—137205300500mV I OUT2 = 200mA (Note5)I OUT2=300mAPower Supply Rejection Ratio PSRR—62—dB f ≤ 100Hz, I OUT1 = I OUT2 = 50mA,C IN = 0µFOutput Noise eN— 1.8—µV/(Hz)½ f ≤ 1kHz, I OUT2=50mA,SHDN1=GNDOutput Short Circuit Current (Average)I OUT sc2—240—mA R LOAD2≤ 1ΩDC CHARACTERISTICS (CONTINUED)Electrical Characteristics: V IN1=V IN2=SHDN1,2=3.6V,C OUT1=C IN=4.7µF, C OUT2=1µF,L=4.7µH, V OUT1 (ADJ)=1.8V,I OUT1=100ma, I OUT2=0.1mA T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C.Parameters Sym Min Typ Max Units ConditionsNote1:The Minimum V IN has to meet two conditions: V IN≥ 2.7V and V IN≥ V RX + V DROPOUT, V RX = V R1 or V R2.2:V RX is the regulator output voltage setting.3:TCV OUT2 = ((V OUT2max – V OUT2min) * 106)/(V OUT2 * D T).4:Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current.5:Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.6:The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e. T A, T J, θJA). Exceeding the maximum allowable powerdissipation causes the device to initiate thermal shutdown.7:The integrated MOSFET switches have an integral diode from the L X pin to V IN, and from L X to P GND. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is notable to limit the junction temperature for these cases.8:V IN1 and V IN2 are supplied by the same input source.© 2005 Microchip Technology Inc.DS21949A-page 5TC1303BDS21949A-page 6© 2005 Microchip Technology Inc.Wake-Up Time (From SHDN2 mode), (V OUT2)t WK —31100µs I OUT1 = I OUT2 = 50mA Settling Time (From SHDN2 mode), (V OUT2)t S—100—µsI OUT1 = I OUT2 = 50mAPower-Good Voltage Range PGV PG1.01.2—5.55.5VT A = 0°C to +70°C T A = -40°C to +85°C V IN ≤ 2.7 I SINK = 100µA PG Threshold High (V OUT1 or V OUT2)V TH_H —9496% of V OUTX On Rising V OUT1 or V OUT2V OUTX =V OUT1 or V OUT2PG Threshold Low (V OUT1 or V OUT2)V TH_L 8992—% of V OUTX On Falling V OUT1 or V OUT2V OUTX =V OUT1 or V OUT2PG Threshold Hysteresis (V OUT1 and V OUT2)V TH_HYS —2—% of V OUTXV OUTX =V OUT1 or V OUT2PG Threshold Tempco ΔV TH /ΔT —30—ppm/°C PG Delayt RPD —165—µs V OUT1 or V OUT2=(V TH + 100mV)to (V TH - 100mV)PG Active Time-out Periodt RPU140262560msV OUT1or V OUT2=V TH -100mV to V TH +100mV,I SINK = 1.2mAPG Output Voltage LowPG_V OL——0.2VV OUT1o r V OUT2=V TH -100mV , I PG = 1.2mA V IN2>2.7VI PG = 100µA, 1.0V <V IN2< 2.7V PG Output Voltage HighPG_V OH 0.9*V OUT2——VV OUT1 or V OUT2=V TH + 100mV V OUT2 ≥ 1.8V, I PG =-500µA VOUT2 < 1.8V,I PG =-300µADC CHARACTERISTICS (CONTINUED)Electrical Characteristics: V IN1=V IN2=SHDN1,2=3.6V,C OUT1=C IN =4.7µF, C OUT2=1µF,L =4.7µH, V OUT1 (ADJ)=1.8V, I OUT1=100ma, I OUT2=0.1mA T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C .ParametersSym Min Typ Max Units ConditionsNote 1:The Minimum V IN has to meet two conditions: V IN ≥ 2.7V and V IN ≥ V RX + V DROPOUT , V RX = V R1 or V R2.2:V RX is the regulator output voltage setting.3:TCV OUT2 = ((V OUT2max – V OUT2min ) * 106)/(V OUT2 * D T ).4:Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current.5:Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.6:The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junctiontemperature and the thermal resistance from junction to air. (i.e. T A , T J , θJA ). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown.7:The integrated MOSFET switches have an integral diode from the L X pin to V IN , and from L X to P GND . In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.8:V IN1 and V IN2 are supplied by the same input source.TC1303BTEMPERATURE SPECIFICATIONSElectrical Specifications: Unless otherwise indicated, all limits are specified for: V IN = +2.7V to +5.5V Parameters Sym Min Typ Max Units Conditions Temperature RangesT J-40—+125°C Steady stateOperating Junction TemperatureRangeStorage Temperature Range T A-65—+150°CMaximum Junction Temperature T J——+150°C TransientThermal Package ResistancesThermal Resistance, 10L-DFNθJA—41—°C/W Typical 4-layer board withInternal Ground Plane and 2 Viasin Thermal PadThermal Resistance, 10L-MSOPθJA—113—°C/W Typical 4-layer board withInternal Ground Plane© 2005 Microchip Technology Inc.DS21949A-page 7TC1303BDS21949A-page 8© 2005 Microchip Technology Inc.2.0TYPICAL PERFORMANCE CURVESNote: Unless otherwise indicated, V IN1= V IN2=SHDN1,2=3.6V,C OUT1=C IN =4.7µF,C OUT2=1µF,L =4.7µH,V OUT1 (ADJ)=1.8V, T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A =+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-1:I Q Switcher and LDO Current vs. Ambient Temperature.FIGURE 2-2:I Q Switcher Current vs. Ambient Temperature.FIGURE 2-3:I Q LDO Current vs. AmbientTemperature.FIGURE 2-4:V OUT1 Output Efficiency vs. Input Voltage (V OUT1 = 1.2V).FIGURE 2-5:V OUT1 Output Efficiency vs. I OUT1 (V OUT1 = 1.2V).FIGURE 2-6:V OUT1 Output Efficiency vs. Input Voltage (V OUT1 = 1.8V).Note:The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.TC1303B Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-7:V OUT1 Output Efficiency vs.I OUT1 (V OUT1 = 1.8V).FIGURE 2-8:V OUT1 Output Efficiency vs.Input Voltage (V OUT1 = 3.3V).FIGURE 2-9:V OUT1 Output Efficiency vs.I OUT1 (V OUT1 = 3.3V).FIGURE 2-10:V OUT1 vs. I OUT1(V OUT1 = 1.2V).FIGURE 2-11:V OUT1 vs. I OUT1(V OUT1 = 1.8V).FIGURE 2-12:V OUT1 vs. I OUT1(V OUT1 = 3.3V).© 2005 Microchip Technology Inc.DS21949A-page 9TC1303BDS21949A-page 10 2005 Microchip Technology Inc.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN =4.7µF, C OUT2=1µF, L =4.7µH,V OUT1 (ADJ)=1.8V, T A =+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A =+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.OUT1 Switching Frequencyvs. Input Voltage.OUT1 Switching Frequency vs. Ambient Temperature.OUT1 Adjustable Feedback Voltage vs. Ambient Temperature.OUT1 Switch Resistancevs. Input Voltage.Resistance vs. Ambient Temperature.OUT1 Dropout Voltage vs. Ambient Temperature.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-19:V OUT1 and V OUT2 HeavyLoad Switching Waveforms vs. Time.FIGURE 2-20:V OUT1 and V OUT2 LightLoad Switching Waveforms vs. Time.FIGURE 2-21:V OUT2 Output Voltage vs.Input Voltage (V OUT2 = 1.5V).FIGURE 2-22:V OUT2 Output Voltage vs.Input Voltage (V OUT2 = 1.8V).FIGURE 2-23:V OUT2 Output Voltage vs.Input Voltage (V OUT2 = 2.5V).FIGURE 2-24:V OUT2 Output Voltage vs.Input Voltage (V OUT2= 3.3V).Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-25:V OUT2 Dropout Voltage vs.Ambient Temperature (V OUT2 = 2.5V).FIGURE 2-26:V OUT2 Dropout Voltage vs.Ambient Temperature (V OUT2 = 3.3V).FIGURE 2-27:V OUT2 Line Regulation vs.Ambient Temperature.FIGURE 2-28:V OUT2 Load Regulation vs.Ambient Temperature.FIGURE 2-29:PG Active Delay Time-outvs. Ambient Temperature.FIGURE 2-30:PG Threshold Voltage vs.Ambient Temperature.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-31:PG Output Voltage LevelLow vs. Ambient Temperature.FIGURE 2-32:PG Output Voltage LevelHigh vs. Ambient Temperature.FIGURE 2-33:V OUT2 Power Supply RippleRejection vs. Frequency.FIGURE 2-34:V OUT2 Noise vs. Frequency.FIGURE 2-35:V OUT1 Load Step Responsevs. Time.FIGURE 2-36:V OUT2 Load Step Responsevs. Time.Note: Unless otherwise indicated, V IN1= V IN2=SHDN1,2 =3.6V, C OUT1=C IN=4.7µF,C OUT2=1µF,L=4.7µH,V OUT1 (ADJ)=1.8V, T A=+25°C. Boldface specifications apply over the T A range of -40°C to +85°C. T A=+25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.FIGURE 2-37:V OUT1 and V OUT2 Line StepResponse vs. Time.FIGURE 2-38:V OUT1 and V OUT2 StartupWaveforms.FIGURE 2-39:V OUT1 and V OUT2 ShutdownWaveforms.FIGURE 2-40:Power-Good Output Timing.3.0PIN DESCRIPTIONSThe descriptions of the pins are listed in Table3-1. TABLE 3-1:PIN FUNCTION TABLE3.1LDO Shutdown Input Pin (SHDN2) SHDN2 is a logic level input used to turn the LDO Reg-ulator on and off. A logic high (> 45% of V IN), will enable the regulator output. A logic low (< 15% of V IN) will ensure that the output is turned off.3.2LDO Input Voltage Pin (V IN2)V IN2 is a LDO power input supply pin. Connect variable input voltage source to V IN2. Connect V IN1 and V IN2 together with board traces as short as possible. V IN2 provides the input voltage for the LDO regulator. An additional capacitor can be added to lower the LDO regulator input ripple voltage.3.3LDO Output Voltage Pin (V OUT2)V OUT2 is a regulated LDO output voltage pin. Connect a 1µF or larger capacitor to V OUT2 and A GND for proper operation.3.4Power-Good Output Pin (PG)PG is an output level indicating that V OUT2 (LDO) is within 94% of regulation. The PG output is configured as a push-pull for the TC1303B.3.5Analog Ground Pin (A GND)A GND is the analog ground connection. Tie A GND to the analog portion of the ground plane (A GND). See the physical layout information in Section 5.0 “Application Circuits/Issues” for grounding recommendations. 3.6Buck Regulator Output Sense Pin(V FB/V OUT1)For V OUT1 adjustable output voltage options, connect the center of the output voltage divider to the V FB pin. For fixed-output voltage options, connect the output of the buck regulator to this pin (V OUT1). 3.7Buck Regulator Shutdown InputPin (SHDN1)regulator on and off. A logic-high (> 45% of V IN), will enable the regulator output. A logic-low (< 15% of V IN) will ensure that the output is turned off.3.8Buck Regulator Input Voltage Pin(V IN1)V IN1 is the buck regulator power input supply pin. Connect a variable input voltage source to V IN1. Connect V IN1 and V IN2 together with board traces as short as possible.3.9Buck Inductor Output Pin (L X) Connect L X directly to the buck inductor. This pin carries large signal-level current; all connections should be made as short as possible.3.10Power Ground Pin (P GND)Connect all large-signal level ground returns to P GND. These large-signal, level ground traces should have a small loop area and length to prevent coupling of switching noise to sensitive traces. Please see the physical layout information supplied in Section 5.0“Application Circuits/Issues” for grounding recommendations.3.11Exposed Pad (EP)For the DFN package, connect the EP to A GND with vias into the A GND plane.Pin Function1SHDN2Active Low Shutdown Input for LDO Output Pin2V IN2Analog Input Supply Voltage Pin3V OUT2LDO Output Voltage Pin4PG Power-good Output Pin5A GND Analog Ground Pin6V FB / V OUT1Buck Feedback Voltage (Adjustable Version) / Buck Output Voltage (Fixed Version) Pin 7SHDN1Active Low Shutdown Input for Buck Regulator Output Pin8V IN1Buck Regulator Input Voltage Pin9L X Buck Inductor Output Pin10P GND Power Ground PinEP ExposedPad For the DFN package, the center exposed pad is a thermal path to remove heat from the device. Electrically this pad is at ground potential and should be connected to A GND.4.0DETAILED DESCRIPTION4.1Device OverviewThe TC1303B combines a 500mA synchronous buck regulator with a 300mA LDO and a power-good output. This unique combination provides a tiny, low-cost solution for applications that require two or more voltage rails. The buck regulator can deliver high-output current over a wide range of input-to-output voltage ratios while maintaining high efficiency. This is typically used for the lower-voltage, high-current processor core. The LDO is a minimal parts-count solution, (single-output capacitor), providing a regulated voltage for an auxiliary rail. The typical LDO dropout voltage (137mV @ 200mA) allows the use of very low input-to-output LDO differential voltages, minimizing the power loss internal to the LDO pass transistor. A power-good output is provided, indicating that the LDO output is in regulation (TC1303B). Additional features include independent shutdown inputs, UVLO, overcurrent and overtemperature shutdown.4.2Synchronous Buck RegulatorThe synchronous buck regulator is capable of supply-ing a 500mA continuous output current over a wide range of input and output voltages. The output voltage range is from 0.8V (min) to 4.5V (max). The regulator operates in three different modes and automatically selects the most efficient mode of operation. During heavy load conditions, the TC1303B buck converter operates at a high, fixed frequency (2.0MHz) using current mode control. This minimizes output ripple and noise (less than 8mV peak-to-peak ripple) while main-taining high efficiency (typically > 90%). For standby or light load applications, the buck regulator will automat-ically switch to a power-saving Pulse Frequency Modulation (PFM) mode. This minimizes the quiescent current draw on the battery, while keeping the buck output voltage in regulation. The typical buck PFM mode current is 38µA. The buck regulator is capable of operating at 100% duty cycle, minimizing the voltage drop from input to output for wide input battery-powered applications. For fixed-output voltage applica-tions, the feedback divider and control loop compensa-tion components are integrated, eliminating the need for external components. The buck regulator output is protected against overcurrent, short circuit and over-temperature. While shut down, the synchronous buck N-channel and P-channel switches are off, so the L X pin is in a high-impedance state (this allows for connecting a source on the output of the buck regulator as long as its voltage does not exceed the input voltage).4.2.1FIXED FREQUENCY PWM MODE While operating in Pulse Width Modulation (PWM) mode, the TC1303B buck regulator switches at a fixed 2.0MHz frequency. The PWM mode is suited for higher load current operation, maintaining low output noise and high conversion efficiency. PFM to PWM mode transition is initiated for any of the following conditions.•Continuous inductor current is sensed•Inductor peak current exceeds 100mA•The buck regulator output voltage has droppedout of regulation (step load has occurred)The typical PFM-to-PWM threshold is 80mA.4.2.2PFM MODEPFM mode is entered when the output load on the buck regulator is very light. Once detected, the converter enters the PFM mode automatically and begins to skip pulses to minimize unnecessary quiescent current draw by reducing the number of switching cycles per second. The typical quiescent current for the switching regulator is less than 35µA. The transition from PWM to PFM mode occurs when discontinuous inductor current is sensed, or the peak inductor current is less than 60mA (typ.). The typical PWM to PFM mode threshold is 30mA. For low input-to-output differential voltages, the PWM to PFM mode threshold can be low due to the lack of ripple current. It is recommended that V IN1 be one volt greater than V OUT1 for PWM to PFM transitions.4.3Low Drop Out Regulator (LDO)The LDO output is a 300mA low-dropout linear regula-tor that provides a regulated output voltage with a single 1µF external capacitor. The output voltage is available in fixed options only, ranging from 1.5V to 3.3V. The LDO is stable using ceramic output capaci-tors that inherently provide lower output noise and reduce the size and cost of the regulator solution. The quiescent current consumed by the LDO output is typically less than 20µA, with a typical dropout voltage of 137mV at 200mA. The LDO output is protected against overcurrent and overtemperature.。