4N37.SD中文资料
SN74LS37N,SN74LS37NSRE4,SN74LS37NE4,SN74S37N,SN74S37NE4,SN74S37D,SN74S37DE4, 规格书,Datasheet 资料
Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-9754101Q2A ACTIVE LCCC FK 201TBD Call TI Call TI 5962-9754101QCA ACTIVE CDIP J 141TBD Call TI Call TI 5962-9754101QCA ACTIVE CDIP J 141TBD Call TI Call TI 5962-9754101QDA ACTIVE CFP W 141TBD Call TI Call TI 5962-9754101QDAACTIVE CFP W 141TBD Call TI Call TI SN5437J OBSOLETE CDIP J 14TBD Call TI Call TI SN5437J OBSOLETE CDIP J 14TBDCall TI Call TISN54LS37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SN54LS37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SN54S37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SN54S37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SN7437N OBSOLETE PDIP N 14TBD Call TI Call TI SN7437N OBSOLETE PDIP N 14TBD Call TI Call TI SN7437N3OBSOLETE PDIP N 14TBD Call TI Call TI SN7437N3OBSOLETE PDIP N 14TBD Call TI Call TI SN74LS37D OBSOLETE SOIC D 14TBD Call TI Call TI SN74LS37D OBSOLETE SOIC D 14TBDCall TICall TISN74LS37N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74LS37N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74LS37N3OBSOLETE PDIP N 14TBD Call TI Call TI SN74LS37N3OBSOLETE PDIP N 14TBDCall TICall TISN74LS37NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74LS37NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74LS37NSR ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS37NSR ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS37NSRE4ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS37NSRE4ACTIVESONS142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM芯天下--/Addendum-Page 2Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)SN74LS37NSRG4ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS37NSRG4ACTIVE SO NS 142000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S37D ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S37D ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S37DE4ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S37DE4ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S37DG4ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S37DG4ACTIVE SOIC D 1450Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S37N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74S37N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74S37N3OBSOLETE PDIP N 14TBD Call TI Call TI SN74S37N3OBSOLETE PDIP N 14TBDCall TICall TISN74S37NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74S37NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SNJ5437J OBSOLETE CDIP J 14TBD Call TI Call TI SNJ5437J OBSOLETE CDIP J 14TBD Call TI Call TI SNJ5437W OBSOLETE CFP W 14TBD Call TI Call TI SNJ5437W OBSOLETE CFP W 14TBDCall TICall TISNJ54LS37FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg Type SNJ54LS37FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54LS37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SNJ54LS37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SNJ54LS37W ACTIVE CFP W 141TBD A42N / A for Pkg Type SNJ54LS37W ACTIVE CFP W 141TBD A42N / A for Pkg TypeSNJ54S37FKACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type芯天下--/Addendum-Page 3Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)SNJ54S37FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54S37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SNJ54S37J ACTIVE CDIP J 141TBD A42N / A for Pkg Type SNJ54S37W ACTIVE CFP W 141TBD A42N / A for Pkg Type SNJ54S37WACTIVECFPW141TBDA42N / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN5437, SN54LS37, SN54S37, SN7437, SN74LS37, SN74S37 :•Catalog: SN7437, SN74LS37, SN74S37•Military: SN5437, SN54LS37, SN54S37芯天下--/NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 4芯天下--/TAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS37NSR SONS142000330.016.48.210.52.512.016.0Q1PACKAGE MATERIALS INFORMATION14-Jul-2012*Alldimensions are nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)SN74LS37NSRSONS142000367.0367.038.0PACKAGE MATERIALS INFORMATION14-Jul-2012Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。
SD20-470中文资料
Description• Six sizes of shielded drum core inductors with low profiles (as low as 1.0mm) and high power density • Inductance range from .47uH to 1000uH• Current range from 6.00 to 0.088 Amps• Ferrite shielded, low EMIApplications• Digital cameras, CD players, cellular phones, and PDAs • PCMCIA cards• GPS systemsEnvironmental Data• Storage temperature range:-40C to +125C• Operating ambient temperature range:-40C to +85C (range is application specific).T emperature rise is approximately 40C at rated rms current• Infrared reflow temperature:+240C for 30 seconds maximum Packaging• Supplied in tape and reel packaging, 3800 (SD10, SD12 and SD18), 2900 (SD20 and SD25), and 3500 (SD52)per reelSD SeriesHigh Power Density,Low Profile,Shielded Inductors(1) Open Circuit Inductance T est Parameters:100KHz, 0.25Vrms, 0.0Adc.(2) RMS current for an approximate ∆T of 40°C without core loss.It isrecommended that the temperature of the part not exceed 125°C. (3) Peak current for approximate 30% roll off at 20°C.(4) DCR limits @ 20°C.5) Applied Volt-Time product (V-uS) across the inductor at 100kHz necessary togenerate a core loss equal to 10% of the total losses for 40°C temperature rise.Part Number Rated OCL (1)Part Irms (2)Isat (3)DCR (4)Volt Inductance+/-20%Marking Amperes Amperes(Ω)u-sec (µH)(µH)Typ.Typ. SD10-R470.4700.453A 2.59 3.540.0249 2.1 SD10-1R0 1.00 1.119B 1.93 2.250.0448 3.3 SD10-1R5 1.50 1.563C 1.60 1.910.0653 3.9SD10-4R7 4.70 4.893F 1.04 1.080.1535 6.9 SD10-6R2 6.20 6.743G0.940.920.18708.1 SD10-8R28.208.889H0.8000.8000.26079.3 SD10-10010.010.07J0.7600.7520.28889.9 SD10-15015.015.55K0.6130.6050.442912.3 SD10-22022.022.21L0.4980.5060.671814.7 SD10-33033.032.20M0.4120.4200.980717.7SD10-68068.070.01O0.3010.285 1.8426.1 SD10-82082.083.48P0.2580.261 2.5028.5 SD10-101100102.0Q0.2250.236 3.2931.5 SD10-151150149.2R0.2000.195 4.1538.1 SD10-221220222.2S0.1610.160 6.4146.5 SD10-331330330.4T0.1300.1319.8356.7 SD10-471470468.3U0.1170.11012.1067.5 SD12-R470.4700.490A 3.19 3.860.0246 2.84 SD12-1R2 1.20 1.21B 2.62 2.450.0366 4.47 SD12-1R5 1.50 1.69C 2.19 2.080.0521 5.28 SD12-2R2 2.20 2.25D 1.83 1.800.0747 6.09 SD12-3R3 3.30 3.61E 1.55 1.420.10437.71 SD12-4R7 4.70 4.41F 1.46 1.290.11778.53 SD12-6R2 6.20 6.25G 1.21 1.080.169910.15 SD12-8R28.208.41H 1.020.9310.239911.77SD12-22022.022.09L0.6280.5740.633819.08 SD12-33033.032.49M0.5190.4740.928923.14 SD12-47047.047.61N0.4280.391 1.3728.01 SD12-68068.068.89O0.3410.325 2.1633.70 SD12-82082.082.81P0.3260.297 2.3636.95 SD12-10110098.0Q0.3080.273 2.6440.19 SD12-151150151.3R0.2510.220 3.9649.94(1) Open Circuit Inductance T est Parameters:100KHz, 0.25Vrms, 0.0Adc.(2) RMS current for an approximate ∆T of 40°C without core loss.It is recommended that the temperature of the part not exceed 125°C.(3) Peak current for approximate 30% roll off at 20°C.(4) DCR limits @ 20°C.5) Applied Volt-Time product (V-uS) across the inductor at 100kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise.Part Number Rated OCL (1)Part Irms (2)Isat (3)DCR (4)Volt Inductance+/-20%Marking Amperes Amperes (Ω)u-sec (µH)(µH)Typ.Typ.SD12-331330334.9T 0.1860.1487.2574.30SD12-471470462.3U 0.1670.1268.9587.29SD12-681680670.8V 0.1490.10411.30105SD12-821820800.9W 0.1290.09514.93115SD12-1021000992.3X 0.1210.08617.20128SD18-R470.470.49A 3.58 4.630.0201 2.35SD18-R820.820.81B 3.24 3.600.0247 3.02SD18-1R5 1.50 1.69D 2.73 2.490.0345 4.37SD18-2R2 2.20 2.25E 2.55 2.160.0398 5.04SD18-3R3 3.30 3.61F 2.07 1.710.0605 6.38SD18-4R7 4.70 4.41G 1.77 1.540.08247.06SD18-6R2 6.20 6.25H 1.61 1.300.10008.40SD18-8R28.208.41J 1.38 1.120.13519.74SD18-10010.010.89K 1.280.9820.158411.09SD18-22022.022.09M 0.8760.6890.336615.79SD18-33033.032.49N 0.7150.5680.505719.15SD18-47047.047.61O 0.5780.4700.773223.18SD18-68068.068.89P 0.5140.3900.979827.89SD18-82082.082.81Q 0.4460.356 1.3030.58SD18-101100102.01R 0.4190.321 1.4733.94SD18-151150151.29S 0.3450.263 2.1841.33SD18-221220222.01T 0.2960.217 2.9550.06SD18-471470479.61V 0.2010.148 6.3973.58SD18-681680681.21W 0.1670.1249.2887.70SD18-821820823.69X 0.1450.11312.3596.43SD18-10210001004Y 0.1360.10214.01107SD20-R470.470.490A 3.59 4.000.0200 2.28SD20-1R2 1.20 1.21B 3.07 2.550.0275 3.58SD20-1R5 1.50 1.69C 2.88 2.150.0312 4.23SD20-3R3 3.30 3.61E 2.17 1.470.0547 6.18SD20-4R7 4.70 4.41F 2.05 1.330.0612 6.83SD20-6R2 6.20 6.25G 1.89 1.120.07208.13SD20-8R28.208.41H 1.610.9660.10009.43SD20-10010.09.61J 1.530.9030.110010.08SD20-15015.015.21K 1.250.7180.165512.68SD20-22022.022.09L 1.120.5960.205315.28SD20-47047.047.61N 0.7450.4060.465022.43SD20-68068.068.89O 0.6100.3370.694726.98SD20-82082.082.81P 0.5760.3080.778529.58SD20-10110098.01Q 0.4950.283 1.0632.18SD20-151150151.3R 0.4350.228 1.3739.98SD20-221220222.0S 0.3560.188 2.0448.43SD20-331330327.6T 0.2940.155 2.9958.83SD20-471470470.9U 0.2630.129 3.7470.53SD20-821820823.7W 0.2040.098 6.2293.28SD20-10210001004.9X 0.1720.0888.73103SD25-R470.470.466A 3.88 6.000.0177 2.13SD25-R820.820.770B 3.58 4.670.0208 2.74SD25-1R2 1.20 1.15C 3.33 3.810.0240 3.34SD25-1R5 1.50 1.61D 3.12 3.230.0274 3.95SD25-2R22.202.14E2.932.800.03114.56SD SeriesHigh Power Density,Low Profile,Shielded InductorsMechanical Diagrams TOP VIEWBOTTOM VIEWRECOMMENDED PCB LAYOUTSCHEMATIC215.2Max5.2Max aHT1.5 Typ.Ref.12SIDE VIEWPin #1identifierPart marking(Note A)21R2.2502.9755.9502.97524 PAD LAYOUTR2.2505.9591.02.97525.152.57522 PAD LAYOUT5.9509(see chart below)Part Number Rated OCL (1)Part Irms (2)Isat (3)DCR (4)Volt Inductance+/-20%Marking Amperes Amperes (Ω)u-sec (µH)(µH)Typ.Typ.SD25-3R3 3.30 3.43F 2.64 2.210.0384 5.78SD25-4R7 4.70 5.03G 2.39 1.830.0467 6.99SD25-6R8 6.80 6.93H 2.19 1.560.05568.21SD25-8R28.207.99J 1.92 1.450.07248.82SD25-10010.010.35K 1.80 1.270.082410.03SD25-15015.014.45L 1.67 1.080.095611.86SD25-22022.022.81M 1.340.8570.147814.90SD25-33033.033.07N 1.110.7110.214917.94SD25-47047.047.89O 0.9190.5920.315621.58SD25-68068.068.64P 0.7410.4820.485025.84SD25-82082.082.17Q 0.7130.4410.524228.27SD25-101100100.79R 0.6700.3980.593731.31SD25-151150148.4S 0.5530.3280.872338.00SD25-221220222.4T 0.4460.268 1.3446.51SD25-331330332.2U 0.3590.219 2.0756.85SD25-471470472.4V 0.2930.184 3.1067.79SD25-681680677.2W 0.2620.154 3.8881.17SD25-821820826.7X 0.2300.139 5.0489.68SD25-10210001003.4Y0.2160.1265.7098.80Series HT SD10 1.0mm max SD12 1.2mm max SD18 1.8mm max SD20 2.0mm max SD25 2.5mm max(1) Open Circuit Inductance T est Parameters:100KHz, 0.25Vrms, 0.0Adc.(2) RMS current for an approximate ∆T of 40°C without core loss.It is recommended that the temperature of the part not exceed 125°C.(3) Peak current for approximate 30% roll off at 20°C.(4) DCR limits @ 20°C.5) Applied Volt-Time product (V-uS) across the inductor at 100kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise.SD SeriesHigh Power Density,Low Profile,Shielded InductorsSD SeriesA) Part Marking:Line 1:(1st digit indicates the inductance value per part marking designator in chart above)(2nd digit is a bi-weekly production date code)(3rd digit is the last digit of the year produced)Line 2:12 (indicates the product size code)Direction of feedSECTION A-ASD20/25 SeriesDimensions are in millimeters.Direction of feedSD12/18 SeriesPackaging Information ACTUAL SIZESD12ACTUAL SIZESD18ACTUAL SIZESD20ACTUAL SIZESD25SD SeriesHigh Power Density,Low Profile,Shielded InductorsAo=5.45mm Bo=5.45mm Ko=2.00mmParts packaged on 13" Diameter reel, 3,800 parts per reel.Direction of feedSECTION A-ASD10 SeriesACTUAL SIZESD10Ao=5.45mm Bo=5.45mm Ko=1.20mmParts packaged on 13" Diameter reel,3,800 parts per reel.Ao=5.45mm Bo=5.45mm Ko=2.70mmParts packaged on 13" Diameter reel,2,900 parts per reel.SD SeriesHigh Power Density,Low Profile,Shielded InductorsDC Current vs.TemperatureIdc (A)T e m p e r a t u r e R i s e (D e g . C)0.000.100.200.300.400.500.600.70Idc (A)T e m p e r a t u r e R i s e (D e g . C )SD10-220Idc (A)T e m p e r a t u r e R i s e (D e g . C)SD10-471Idc (A)T e m p e r a t ur e R i s e (D e g . C )T e m p e r a t u r e R i s e (D e g . C )0.000.100.200.300.400.500.600.700.80Idc (A)T e m p e r a t u r e R i s e (D e g . C )Idc (A)T e m p e r a t u r e R i s e (D e g . C )Idc (A)T e m p e r a t u r e R i s e (D e g . C )Idc (A)T e m p e r a t u r e R i s e (D e g . C )Idc (A)T e m p e r a t u r e R i s e (D e g . C )RolloffCore LossOCL vs Isat SD100102030405060708090100% of Isat O C L (%)OCL vs Isat SD1201020304050607080901000102030405060708090100110120% of Isat O C L (%)OCL vs Isat SD1801020304050607080901000102030405060708090100110120130140150160% of IsatO C L (%)OCL vs Isat SD2001020304050607080901000102030405060708090100110120130140150160170% of IsatO C L (%)OCL vs Isat SD2501020304050607080901000102030405060708090100110120130140150% of IsatO C L (%)Irms DERATING WITH CORE LOSS% of Applied Volt-µSecond% o f L o s s e s f r o m I r m s (m a x i m u m)SD SeriesHigh Power Density,Low Profile,Shielded InductorsSD SeriesHigh Power Density,Low Profile,Shielded InductorsPart Number Rated OCL (1)Part Irms (2)Isat (3)DCR (4)Volt Inductance+/-20%Marking Amperes Amperes (Ω)u-sec (µH)(µH)Typ.Typ.SD52-1R2 1.20 1.20A 2.33 3.140.0279 1.49SD52-2R2 2.20 2.20B 1.98 2.300.0385 2.03SD52-3R5 3.50 3.50C 1.73 1.820.0503 2.57SD52-4R7 4.70 4.70D 1.63 1.640.0568 2.84SD52-6R8 6.80 6.80E 1.39 1.280.0777 3.65SD52-10010.010.0F 1.11 1.110.1215 4.19SD52-15015.015.0G 0.970.880.1618 5.27SD52-22022.022.0H 0.860.730.2042 6.35SD52-27027.027.0J 0.730.650.28647.16SD52-33033.033.0K 0.700.610.30747.70SD52-47047.047.0L 0.580.500.44659.32SD52-68068.068.0M 0.470.420.682911.21SD52-101100100N0.390.351.000013.37RECOMMENDED PCB LAYOUTSCHEMATIC2.02 plcs6.01.32 plcsBOTTOM VIEW1SIDE VIEW±SD52 SeriesA) Part Marking:Line 1:(1st digit indicates the inductance value per part markingdesignator in chart above)(2nd digit is a bi-weekly production date code)(3rd digit is the last digit of the year produced)Line 2:12 (indicates the product size code)Mechanical Diagrams Dimensions are in millimeters.Direction of feedKoSECTION A-A1.5 Dia min.BoB AoA 8.0804.002.00± 0.051.5 Dia.+0.1/-0.0AA1.755.5012.0+/-0.30210.203.0SD52 SeriesACTUAL SIZESD52Ao=5.72mm Bo=5.72mm Ko=2.30mmParts packaged on 13" Diameter reel,3,500 parts per reel.(1) Open Circuit Inductance T est Parameters:100KHz, 0.25Vrms, 0.0Adc.(2) RMS current for an approximate ∆T of 40°C without core loss.It is recommended that the temperature of the part not exceed 125°C.(3) Peak current for approximate 30% roll off at 20°C.(4) DCR limits @ 20°C.5) Applied Volt-Time product (V-uS) across the inductor at 100kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise.Packaging InformationSD SeriesHigh Power Density,Low Profile,Shielded InductorsOCL vs Isat SD5201020304050607080901000102030405060708090100110120130140% of IsatO C L (%)RolloffDC Current vs.TemperatureIdc (A)T e m p e r a t u r e R i s e (D e g . C)0.00.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0Idc (A)T e m p e r a t u r e R i s e (D e g . C )Visit us on the Web at 3601 Quantum Boulevard Boynton Beach, Florida 33426-8638T el:+1-561-752-5000 T oll Free:+1-888-414-2645 Fax:+1-561-742-1178This bulletin is intended to present product design solutions and technical information that will help the end user with design applications. Cooper Electronic Technologies reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Electronic Technologies also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.PM-4311 1/03© Cooper Electronic Technologies 2003。
四氯丹SDS 化学品安全技术说明书MSDS
一、物品與廠商資料物品名稱：四氯丹 (Captafol)其他名稱：－建議用途及限制使用：殺(真)菌劑製造商或供應商名稱、地址及電話：－緊急聯絡電話/傳真電話：－二、危害辨識資料物品危害分類：急毒性物質第5級（吞食）、腐蝕／刺激皮膚物質第3級、皮膚過敏物質第1級、致癌物質第1級、水環境之危害物質（慢毒性）第1級標示內容：象徵符號：健康危害、驚嘆號、環境警 示 語：危險危害警告訊息：吞食可能有害造成輕微皮膚刺激可能造成皮膚過敏可能致癌對水生生物毒性非常大並具有長期持續影響危害防範措施：勿倒入排水溝如遇意外或覺得不適，立即洽詢醫療避免暴露於此物質－需經特殊指示使用避免釋放至環境中其他危害：－三、成分辨識資料純物質：中英文名稱：四氯丹 (Captafol)同義名稱：順-N-(1,1,2,2-四氯乙硫基)-4-環己烯-1,2-二羧醯亞胺、(N-(1,1,2,2-T0065Trachloroethylthio)cyclohex-ene-1,2-dicarboximide)化學文摘社登記號碼（CAS No.）：2425-06-1危害物質成分（成分百分比）：100四、急救措施不同暴露途徑之急救方法：吸入：1.立刻離開受污染地區，以呼吸新鮮空氣。
2.提供救災人員呼吸保護設備。
3.如有咳嗽、呼吸困難或其他任何症狀發生(甚至在暴露後數小時才發生不適性情形)，應立即尋求醫療救援。
皮膚接觸：1.趕快脫下受污染的衣物。
2.立刻以大量的肥皂和水清洗接觸到的皮膚。
3.如果臉部、眼睛或皮膚發生腫脹，應立即就醫。
眼睛接觸：1.脫下配戴的任何鏡片。
2.以大量的水沖洗15分鐘以上。
3.偶爾將眼瞼向上、向下抬動。
食入：1.如果沒有痙攣現象，給患者1至2杯的水或牛奶稀釋物質。
2.如果患者的呼吸道暢通，立即向醫療或毒物中心聯絡尋問是否催吐。
最重要症狀及危害效應：產生呼吸短促，發出喘氣聲、咳嗽等的過敏性危害。
對急救人員之防護：應穿著C級防護裝備在安全區實施急救。
SN74LS674DWG4中文资料
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
MEMORY存储芯片MT47R128M8HQ-3中文规格书
Table 114: Single-Ended Output Slew RateNotes: 1.SR = slew rate; Q = query output; se = single-ended signals.2.In two cases a maximum slew rate of 12V/ns applies for a single DQ signal within a byte lane:•Case 1 is defined for a single DQ signal within a byte lane that is switching into a cer-tain direction (either from HIGH-to-LOW or LOW-to-HIGH) while all remaining DQ sig-nals in the same byte lane are static (they stay at either HIGH or LOW).•Case 2 is defined for a single DQ signal within a byte lane that is switching into a cer-tain direction (either from HIGH-to-LOW or LOW-to-HIGH) while all remaining DQ sig-nals in the same byte lane are switching into the opposite direction (from LOW-to-HIGH or HIGH-to-LOW, respectively). For the remaining DQ signal switching into the opposite direction, the standard maximum limit of 9 V/ns applies.Differential OutputsTable 115: Differential Output LevelsNote: 1.The swing of ±0.3 × V DDQ is based on approximately 50% of the static single-ended out-put peak-to-peak swing with a driver impedance of R ZQ /7 and an effective test load of 50Ω to V TT = V DDQ at each differential output.Using the same reference load used for timing measurements, output slew rate for fall-ing and rising edges is defined and measured between V OL,diff(AC) and V OH,diff(AC) for dif-ferential signals.Table 116: Differential Output Slew Rate Definition4Gb: x8, x16 Automotive DDR4 SDRAM Electrical Characteristics – AC and DC Output Measurement LevelsFigure 230: Differential Output Slew Rate DefinitionTR TF diffV OH,diff(AC)V OL,diff(AC)D i f f e r e n t i a l I n p u t V o l t a g e (D Q S _t , D Q S _c )Table 117: Differential Output Slew RateNote: 1.SR = slew rate; Q = query output; diff = differential signals.Reference Load for AC Timing and Output Slew RateThe effective reference load of 50Ω to V TT = V DDQ and driver impedance of R ZQ /7 for each output was used in defining the relevant AC timing parameters of the device as well as output slew rate measurements.R ON nominal of DQ, DQS_t and DQS_c drivers uses 34 ohms to specify the relevant AC timing parameter values of the device. The maximum DC high level of output signal =1.0 × V DDQ , the minimum DC low level of output signal = { 34 /( 34 + 50 ) } × V DDQ = 0.4 ×V DDQ .The nominal reference level of an output signal can be approximated by the following:The center of maximum DC high and minimum DC low = { ( 1 + 0.4 ) / 2 } × V DDQ = 0.7 ×V DDQ . The actual reference level of output signal might vary with driver R ON and refer-ence load tolerances. Thus, the actual reference level or midpoint of an output signal is at the widest part of the output signal’s eye.4Gb: x8, x16 Automotive DDR4 SDRAM Electrical Characteristics – AC and DC Output Measurement LevelsFigure 231: Reference Load For AC Timing and Output Slew RateDDQConnectivity Test Mode Output LevelsTable 118: Connectivity Test Mode Output LevelsNote: 1.Driver impedance of R ZQ /7 and an effective test load of 50Ω to V TT = V DDQ .Figure 232: Connectivity Test Mode Reference Test Load0.5 × V DDQ V 4Gb: x8, x16 Automotive DDR4 SDRAM Electrical Characteristics – AC and DC Output Measurement Levels。
0739437000;中文规格书,Datasheet资料
This document was generated on 08/09/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:73943-7000Status:ActiveOverview:HDM®Description:2.00mm Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail, Closed End, 144 CircuitsDocuments:3D ModelRoHS Certificate of Compliance (PDF)Drawing (PDF)Agency CertificationCSA LR19980ULE29179GeneralProduct Family Backplane Connectors Series73943Application Backplane CommentsSolder Tail Component Type PCB Header OverviewHDM®Product Name HDM®Style N/AUPC800754013987PhysicalCircuits (Loaded)144Circuits (maximum)144Color - ResinBlack, Natural Durability (mating cycles max)250First Mate / Last Break No Flammability94V-0Guide to Mating Part No Keying to Mating Part NoneMaterial - MetalPhosphor Bronze Material - Plating MatingGold Material - Plating Termination TinMaterial - Resin High Temperature Thermoplastic Net Weight6.775/g Number of Columns 24Number of Pairs Open Pin Field Number of Rows 6Orientation Vertical PC Tail Length 3.50mm PCB Locator No PCB RetentionNone PCB Thickness - Recommended 2.50mm Packaging TypeTube Pitch - Mating Interface2.00mm Pitch - Termination Interface 2.00mm Plating min - Mating0.762µm Plating min - Termination 2.540µm StackableYes Surface Mount Compatible (SMC)YesTemperature Range - Operating -55°C to +105°C Termination Interface: StyleThrough HoleSeriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHCContains SVHC: No Low-Halogen Status Low-HalogenNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 73943SeriesMates With73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM®Board-to-Board Daughtercard Receptacle Application Tooling | FAQTooling specifications and manuals are found by selecting the products below.Crimp Height Specifications are then contained in the Application Tooling Specification document.GlobalDescription Product #Extraction Tool 0621001000Backplane Insertion Signal Contact Tool0621001400ElectricalCurrent - Maximum per Contact1AData Rate 1.0 GbpsVoltage - Maximum250V ACSolder Process DataDuration at Max. Process Temperature (seconds)40Lead-free Process Capability SMC & Wave Capable (TH only)Max. Cycles at Max. Process Temperature3Process Temperature max. C260Material InfoReference - Drawing NumbersSales Drawing SD-73943-001HDM and High Density Metric are trademarks of Amphenol CorporationThis document was generated on 08/09/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0739437000。
SN74LS377D中文资料
D Q
E Q0
3
Q0
2
Q1
6
Q1
7
Q2
11
Q2
10
Q3
14
Q3
15
FAST AND LS TTL DATA 5-535
元器件交易网
SN54/74LS377 • SN54/74LS378 • SN54/74LS379
GUARANTEED OPERATING RANGES
Symbol VCC TA IOH IOL Supply Voltage Operating Ambient Temperature Range Output Current — High Output Current — Low Parameter 54 74 54 74 54, 74 54 74 Min 4.5 4.75 – 55 0 Typ 5.0 5.0 25 25 Max 5.5 5.25 125 70 – 0.4 4.0 8.0 Unit V °C mA mA
20 1
J SUFFIX CERAMIC CASE 732-03
PIN NAMES
LOADING (Note a) HIGH LOW 0.25 U.L. 0.25 U.L. 0.25 U.L. 5 (2.5) U.L. 5 (2.5) U.L.
20 1
N SUFFIX PLASTIC CASE 738-03
3 D0
4 D1
5 Q1
6 D2
7 Q2
8 GND
SN54 / 74LS379
VCC 16 Q3 15 Q3 14 D3 13 D2 12 Q2 11 Q2 10 CP 9
NOTE: The Flatpak version has the same pinouts (Connection Diagram) as the Dual In-Line Package.
BD45271G中文资料
Voltage detectors
BD45XXXG BD46XXXG
IDD (µA) IOL (mA) IDS (mA)
Circuit current
(BD45281G)
"L" output current
18
(BD45281G)
"H" output current
(BD46281G)
1.5
15
15 VDD=6.0V
IOL
0.4
1.2
2.0
5
— —
∗1
IOH
1.0
2.2
1.2
2.7
— —
Output leak current
∗1 Ilaek
—
—
0.1
"H" transmission delay time
ER pin "H" voltage ER pin "L" voltage
∗1
45
50
55
tPLH
90
100
110
∗1
—
0.70
2.10
Icc1
—
0.75
2.25
—
0.80
2.40
∗1
—
0.75
2.25
Circuit current when OFF
Icc2
—
0.80
2.40
—
0.85
2.55
Min. operating voltage
VOPL
0.95
—
—
"L" output current "H" output current
SN74LS297N;SN74LS297NE4;中文规格书,Datasheet资料
Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LS297N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS297NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS297NE4ACTIVEPDIPN1625Pb-Free (RoHS)CU NIPDAUN /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Effortsare underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM18-Sep-2008Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDLP®Products Communications and /communicationsTelecomDSP Computers and /computersPeripheralsClocks and Timers /clocks Consumer Electronics /consumer-appsInterface Energy /energyLogic Industrial /industrialPower Mgmt Medical /medicalMicrocontrollers Security /securityRFID Space,Avionics&/space-avionics-defenseDefenseRF/IF and ZigBee®Solutions /lprf Video and Imaging /videoWireless /wireless-appsMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2010,Texas Instruments Incorporated分销商库存信息:TISN74LS297N SN74LS297NE4。
4N37中文资料
CTR
H11A3
%
4N27
4N28
10
H11A4
(IF = 10 mA, VCE = 10 V, TA = -55°C)
4N35
4N36
40
4N37
(IF = 00°C)
4N35
4N36
40
4N37
4N25
(IC = 2 mA, IF = 50 mA)
Test Conditions
(IF = 10 mA) (VR = 6.0 V)
(IC = 1.0 mA, IF = 0) (IC = 100 µA, IF = 0) (IE = 100 µA, IF = 0) (VCE = 10 V, IF = 0)
(VCB = 10 V) (VCE = 0 V, f = 1 MHz)
30 70 7 150 2.0 (non-M), 1.76 (-M)
Units
°C °C °C mW
mA V A mW mW/°C
V V V mW mW/°C
© 2003 Fairchild Semiconductor Corporation
Page 2 of 15
5/7/03
元器件交易网
VCE = 5.0V TA = 25°C
1.2
Normalized to IF = 10 mA
1.0
0.8
0.6
0.4
0.2
0.0 0
5
10
15
20
IF - FORWARD CURRENT (mA)
Fig. 5 Normalized CTR vs. Ambient Temperature (Black Package)
TFS370资料
VI TELEFILTER Potsdamer Straße 18 D 14 513 TELTOW / Germany Measurement conditionAmbient temperature: 23 °C Input power level: 0 dBm Terminating impedances *): for input:170 Ω // -0,50 pF for output :170 Ω // -0,50 pFCharacteristicsRemark:Reference level for the relative attenuation a rel of the TFS 370 is the minimum of the pass band attenuation a min . The minimum of the pass band attenuation a min is defined as the insertion loss a e . The centre frequency f c is the arithmetic mean value of the upper and lower frequencies at the 3 dB filter attenuation level relative to the insertion loss a e . The nominal frequency f N is fixed at 370 MHz without tolerance. The given values for the relative attenuation a rel and for the group delay ripple have to be reached at the frequencies given below even if the centre frequency f c is shifted due to the temperature coefficient of frequency TC f in the operating temperature range and due to a production tolerance for the centre frequency f c .D a t a typ. value tolerance/limitInsertion loss a e = a min 2,80 dB3 dB (Reference level)Nominal frequency f N - 370 MHzCentre frequency f c 370 MHz -Pass band ripplewithin f N ± 10 MHz1,5** dB max. 2 dB**(at ambient temperature)Relative attenuation a relf N …f N ± 10 MHz1,30 dB max. 3 dB f N - 80 MHz …f N - 100 MHz60 dB min. 50 dB f N -35 MHz …f N - 55 MHz60 dB min. 30 dB f N + 25 MHz …f N + 57,5 MHz 25 dB min. 20 dB f N + 57,5 M Hz …f N + 82,5 MHz 60 dB min. 40 dB f N + 127,5 M Hz …f N + 152,5 MHz 60dbmin.57 dBIntermodulation IP3 - min. 20 dBm***Input power lewel-max. 10 dBmPermissible DC voltageV DC -max. 12 VOperating temperature range - 25 °C ... + 75 °C Storage temperature range- 40 °C … + 85 °CTemperature coefficient of frequency TC f **** -72 ppm/K -reference values only. Should there be additional questions, do not hesitate to ask for an application note or contact our design team. **) 2 dB bandwidth (f N ± 10 MHz) is guaranteed at ambient temperature (23°C). ***) intermodulation signals: f N + 1 MHz and f N + 2 MHz, each of 10 dBm ****) ∆f c (Hz) = Tc f (ppm/K) x (T - T A ) x f CTA (MHz)generated:checked / approved:VI TELEFILTER Potsdamer Straße 18 D 14 513 TELTOW / GermanyConstruction, pin configuration and 50 Ω - matching network(All dimensions in mm)date code+0.15Pin 1 outputPin 5 inputPin 2 output rf return Pin 6 input rf return Pin 3 groundPin 7 groundPin 4package groundPin 8 package ground50 Ohm Test circuit50 Ω test circuit2,3,4,6,7,8VI TELEFILTER Potsdamer Straße 18 D 14 513 TELTOW / GermanyStability CharacteristicsAfter the following tests the filter shall meet the whole specification:1. Shock: 500g, 18 ms, half sine wave, 3 shocks each plane; DIN IEC 68 T2 - 272. Vibration: 10 Hz to 500 Hz, 0,35 mm or 5g respectively, 1 octave per min, 10 cycles per plan, 3 plans; DIN IEC 68 T2 - 63. Change of temperature: -55 °C to 125°C / 30 min. each / 10 cycles DIN IEC 68 part 2 – 14 Test N4. Resistance tosolder heat (reflow): reflow possible: twice max.;for temperature conditions, please refer to the attached "Air reflow temperature conditions" on page 4;PackingTape & Reel: IEC 286 - 3, with exception of value for N and minimum bending radius; tape type II , embossed carrier tape with top cover tape on the upper side;max. pieces of filters per reel: 3000reel of empty components at start:min 300 mm reel of empty components at start including leader: min 500 mm trailermin 300 mmCOVER TAPECTTape (all dimensions in mm)W : 12 ± 0,3Po : 4 ± 0,1Do : 1,5 + 0,1 E : 1,75 ± 0,1F : 5,5 ± 0,05G (min) : 0,75P2 : 2 ± 0,05P1 : 8 ± 0,1D1(min) : 1,5Ao : 5,3 ± 0,1Bo : 5,3 ± 0,1CT : 9,5 ± 0,1Reel (all dimensions in mm): A : 330W1 : 12,4 + 2 / 0 W2 (m ax) : 18,4 N (m in) : 50C : 13 + 0,5 / -0,2The minimum bending radius is 45 mm. The mounting surface of the filters faces the bottom side of the embossed carrier tape. Markings on the filters can be read if the upper side of the carrier tape is regarded with the sprocket holes on its right.VI TELEFILTER Potsdamer Straße 18 D 14 513 TELTOW / GermanyAir reflow temperature conditions1st and 2nd air reflow profileName: pre-heating periods main-heating periods peak temperature Temperature: 150 °C - 170 °C over 200 °C 255 °C ± 5 °CTime:60 sec. - 90 sec.20 sec. - 25 sec.Tolerance of temperatures: ± 5 °C time / sec. temperature / °C time / sec. temperature / °C 0 23 140 160 10 34 150 161 20 46 160 164 30 60 170 170 40 80 180 180 50 103 190 205 60 121 195 230 70 134 200 255 80 143 205 230 90 150 210 205 100 154 215 180 110 156 220 165 120 158 230 140 130 159 240 120VI TELEFILTER Potsdamer Straße 18 D 14 513 TELTOW / GermanyHistoryVersion Reason of Changes Name D ate1.0 - generation of specification Pfeiffer 05.09.2002 1.1 - changing packagePfeiffer 09.09.2002 1.2 - change of specification of 2 dB bandwidthDr. Sabah21.10.20021.3 - change from development specification to filter specification; Dr. Sabah 29.10.2002add typical values and terminating impedance。
SN74LS297NE4资料
Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 75265IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
MEMORY存储芯片MT47H32M16NF-25EH中文规格书
DDR3L SDRAMMT41K2G4 – 256 Meg x 4 x 8 banksMT41K1G8 – 128 Meg x 8 x 8 banksMT41K512M16 – 64 Meg x 16 x 8 banksDescriptionDDR3L (1.35V) SDRAM is a low voltage version of the DDR3 (1.5V) SDRAM. Refer to a DDR3 (1.5V) SDRAM data sheet specifications when running in 1.5V com-patible mode.Features•V DD = V DDQ = 1.35V (1.283–1.45V)•Backward compatible to V DD = V DDQ = 1.5V ±0.075V –Supports DDR3L devices to be backward com-patible in 1.5V applications•Differential bidirectional data strobe•8n-bit prefetch architecture•Differential clock inputs (CK, CK#)•8 internal banks•Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals •Programmable CAS (READ) latency (CL)•Programmable posted CAS additive latency (AL)•Programmable CAS (WRITE) latency (CWL)•Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])•Selectable BC4 or BL8 on-the-fly (OTF)•Self refresh mode •T C of 0°C to +95°C–64ms, 8192-cycle refresh at 0°C to +85°C–32ms at +85°C to +95°C•Self refresh temperature (SRT)•Automatic self refresh (ASR)•Write leveling•Multipurpose register•Output driver calibrationOptions Marking •Configuration– 2 Gig x 42G4– 1 Gig x 81G8–512 Meg x 16512M16•FBGA package (Pb-free) – x4, x8–78-ball (9mm x 13.2mm)SN •FBGA package (Pb-free) – x16–96-ball (9mm x 14mm)HA •Timing – cycle time– 1.25ns @ CL = 11 (DDR3-1600)-125– 1.07ns @ CL = 13 (DDR3-1866)-107•Operating temperature–Commercial (0°C ≤ T C≤ +95°C)None–Industrial (–40°C ≤ T C≤ +95°C)IT •Revision:ATable 1: Key Timing ParametersNote: 1.Backward compatible to 1600, CL = 11 (-125).Slew Rate Definitions for Differential Output Signals8Gb: x4, x8, x16 DDR3L SDRAMOutput Characteristics and Operating ConditionsTable 54: Electrical Characteristics and AC Operating Conditions (Continued)Table 55: Electrical Characteristics and AC Operating Conditions for Speed Extensions (Continued)Table 55: Electrical Characteristics and AC Operating Conditions for Speed Extensions (Continued)。
MEMORY存储芯片MT47H32M16NF-25E中文规格书
DQS DQ
Disabled
See normal operations
Enabled Disabled
n/a
(1)
(1)
Low Off Off
˖˖
High On
˖˖, or
120˖
Enabled
n/a
(0)
Low Off
˖˖, or High On 120˖
DRAM State
Case Notes
Write leveling not enabled
0
DQS not receiving: not terminated Prime DQ High-Z: not terminated Other DQ High-Z: not terminated
1
2
DQS not receiving: terminated by RTT
MEMORY存储芯片MT47H32M16BN-3IT D中文规格书
–Subsequent legal commands while in V REFDQ calibration mode: ACT, WR, WRA, RD,RDA, PRE, DES, and MRS (to set V REFDQ values and exit V REFDQ calibration mode).•All subsequent V REFDQ calibration MR setting commands are MR6[7:6]10[5:0]VVVVVV .–"VVVVVV" are desired settings for V REFDQ .•Issue ACT/WR/RD looking for pass/fail to determine V CENT (midpoint) as needed.•To exit V REFDQ calibration, the last two V REFDQ calibration MR commands are:–MR6[7:6]10 [5:0]VVVVVV* where VVVVVV* = desired value for V REFDQ .–MR6[7]0 [6:0]XXXXXXX to exit V REFDQ calibration mode.The following are typical script when applying the above rules for V REFDQ calibration routine when performing V REFDQ calibration in Range 2:•MR6[7:6]11 [5:0]XXXXXXX.–Subsequent legal commands while in V REFDQ calibration mode: ACT, WR, WRA, RD,RDA, PRE, DES, and MRS (to set V REFDQ values and exit V REFDQ calibration mode).•All subsequent V REFDQ calibration MR setting commands are MR6[7:6]11[5:0]VVVVVV .–"VVVVVV" are desired settings for V REFDQ .•Issue ACT/WR/RD looking for pass/fail to determine V CENT (midpoint) as needed.•To exit V REFDQ calibration, the last two V REFDQ calibration MR commands are:–MR6[7:6]11 [5:0]VVVVVV* where VVVVVV* = desired value for V REFDQ .–MR6[7]0 [6:0]XXXXXXX to exit V REFDQ calibration mode.Note: Range may only be set or changed when entering V REFDQ calibration mode;changing range while in or exiting V REFDQ calibration mode is illegal.Figure 64: V REFDQ Training Mode Entry and Exit Timing DiagramCK_cCK_tCommandREFDQ REFDQ value or write REFDQ value or write REFDQ Don’t CareNotes: 1.New V REFDQ values are not allowed with an MRS command during calibration mode en-try.2.Depending on the step size of the latest programmed V REF value, V REF must be satisfied before disabling V REFDQ training mode.8Gb: x8, x16 Automotive DDR4 SDRAM V REFDQ Calibrationbe applied with power-down exit latency, t XP , after CKE goes HIGH. Power-down exit la-tency is defined in the AC Specifications table.Figure 89: Active Power-Down Entry and ExitCK_t CK_cCommandAddress CKEpower-downmode power-down modeT0T1T2Ta0Ta1Tb0Tb1Tc0Don’t CareTime Break Notes: 1.Valid commands at T0 are ACT, DES, or PRE with one bank remaining open after comple-tion of the PRECHARGE command.2.ODT pin driven to a valid state; MR5[5] = 0 (normal setting).3.ODT pin drive/float timing requirements for the ODT input buffer disable option (for ad-ditional power savings during active power-down) is described in the section for ODT In-put Buffer Disable Mode for Power-Down (page 162); MR5[5] = 1.8Gb: x8, x16 Automotive DDR4 SDRAM Power-Down Mode。
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4N35
TON
4N36
4N37
2
10
µs
© 2003 Fairchild Semiconductor Corporation
Page 4 of 15
5/7/03
元器件交易网
GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS
30 70 7 150 2.0 (non-M), 1.76 (-M)
Units
°C °C °C mW
mA V A mW mW/°C
V V V mW mW/°C
© 2003 Fairchild Semiconductor Corporation
Page 2 of 15
5/7/03
元器件交易网
5/7/03
元器件交易网
GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS
4N25 4N37
4N26 H11A1
4N27 H11A2
4N28 H11A3
4N35 H11A4
4N36 H11A5
TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified.)
4N25 4N37
4N26 H11A1
4N27 H11A2
4N28 H11A3
4N35 H11A4
4N36 H11A5
TYPICAL PERFORMANCE CURVES
VF - FORWARD VOLTAGE (V)
Fig. 1 LED Forward Voltage vs. Forward Current (Black Package)
VCE = 5.0V TA = 25°C
1.2
Normalized to IF = 10 mA
1.0
0.8
0.6
0.4
0.2
0.0 0
5
10
15
20
IF - FORWARD CURRENT (mA)
Fig. 5 Normalized CTR vs. Ambient Temperature (Black Package)
Symbol
VF IR
BVCEO BVCBO BVECO
ICEO ICBO CCE
Min
Typ*
Max
Unit
1.18
1.50
V
0.001
10
µA
30
100
V
70
120
V
7
10
V
1
50
nA
20
nA
8
pF
ISOLATION CHARACTFra bibliotekRISTICS
Characteristic Input-Output Isolation Voltage Isolation Resistance Isolation Capacitance
Test Conditions
(IF = 10 mA) (VR = 6.0 V)
(IC = 1.0 mA, IF = 0) (IC = 100 µA, IF = 0) (IE = 100 µA, IF = 0) (VCE = 10 V, IF = 0)
(VCB = 10 V) (VCE = 0 V, f = 1 MHz)
GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS
4N25 4N37
4N26 H11A1
4N27 H11A2
4N28 H11A3
4N35 H11A4
4N36 H11A5
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
元器件交易网
GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS
4N25 4N37
4N26 H11A1
4N27 H11A2
WHITE PACKAGE (-M SUFFIX)
6 6
1 1
6 1
BLACK PACKAGE (NO -M SUFFIX)
4N28 H11A3
4N35 H11A4
4N36 H11A5
SCHEMATIC
1
6
2
5
3
NC
4
PIN 1. ANODE 2. CATHODE 3. NO CONNECTION 4. EMITTER 5. COLLECTOR 6. BASE
6
1
6
1
6 1
DESCRIPTION
The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin dual in-line package.
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Collector-Emitter Breakdown Voltage Collector-Base Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current Collector-Base Dark Current Capacitance
Test Conditions Symbol Min
(Non ‘-M’, Black Package) (f = 60 Hz, t = 1 min) (‘-M’, White Package) (f = 60 Hz, t = 1 sec) (VI-O = 500 VDC) (VI-O = &, f = 1 MHz) (‘-M’ White Package)
CTR
H11A3
%
4N27
4N28
10
H11A4
(IF = 10 mA, VCE = 10 V, TA = -55°C)
4N35
4N36
40
4N37
(IF = 10 mA, VCE = 10 V, TA = +100°C)
4N35
4N36
40
4N37
4N25
(IC = 2 mA, IF = 50 mA)
VISO RISO CISO
5300 7500 1011
Typ*
0.5 0.2
Max 2
Units
Vac(rms) Vac(pk)
Ω pF pF
Note * Typical values at TA = 25°C
© 2003 Fairchild Semiconductor Corporation
Page 3 of 15
GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS
4N25 4N37
4N26 H11A1
4N27 H11A2
4N28 H11A3
4N35 H11A4
4N36 H11A5
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
4N26 4N27
0.5
4N28
Collector-Emitter Saturation Voltage
VCE (SAT)
4N35 4N36 4N37
0.3
V
(IC = 0.5 mA, IF = 10 mA)
H11A1 H11A2
H11A3
0.4
H11A4
H11A5
AC Characteristic
Parameter
Symbol
Value
TOTAL DEVICE Storage Temperature Operating Temperature Wave solder temperature (see page 14 for reflow solder profiles) Total Device Power Dissipation @ TA = 25°C Derate above 25°C EMITTER DC/Average Forward Input Current Reverse Input Voltage Forward Current - Peak (300µs, 2% Duty Cycle) LED Power Dissipation @ TA = 25°C Derate above 25°C DETECTOR Collector-Emitter Voltage Collector-Base Voltage Emitter-Collector Voltage Detector Power Dissipation @ TA = 25°C Derate above 25°C
FEATURES
• Also available in white package by specifying -M suffix, eg. 4N25-M • UL recognized (File # E90700) • VDE recognized (File # 94766)
- Add option V for white package (e.g., 4N25V-M) - Add option 300 for black package (e.g., 4N25.300)