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LM4040_05中文资料

LM4040Precision Micropower Shunt Voltage ReferenceGeneral DescriptionIdeal for space critical applications,the LM4040precision voltage reference is available in the sub-miniature SC70and SOT-23surface-mount package.The LM4040’s advanced design eliminates the need for an external stabilizing capaci-tor while ensuring stability with any capacitive load,thus making the LM4040easy to use.Further reducing design effort is the availability of several fixed reverse breakdown voltages:2.048V,2.500V,3.000V,4.096V,5.000V,8.192V,and 10.000V.The minimum operating current increases from 60µA for the LM4040-2.5to 100µA for the LM4040-10.0.All versions have a maximum operating current of 15mA.The LM4040utilizes fuse and zener-zap reverse breakdown voltage trim during wafer sort to ensure that the prime parts have an accuracy of better than ±0.1%(A grade)at 25˚C.Bandgap reference temperature drift curvature correction and low dynamic impedance ensure stable reverse break-down voltage accuracy over a wide range of operating tem-peratures and currents.Also available is the LM4041with two reverse breakdown voltage versions:adjustable and 1.2V.Please see the LM4041data sheet.Featuresn Small packages:SOT-23,TO-92and SC70n No output capacitor requiredn Tolerates capacitive loadsn Fixed reverse breakdown voltages of 2.048V,2.500V,3.000V,4.096V,5.000V,8.192V,and 10.000VKey Specifications (LM4040-2.5)j Output voltage tolerance(A grade,25˚C)±0.1%(max)j Low output noise(10Hz to 10kHz)35µV rms (typ)j Wide operating current range 60µA to 15mA j Industrial temperature range −40˚C to +85˚C j Extended temperature range −40˚C to +125˚C j Low temperature coefficient100ppm/˚C (max)Applicationsn Portable,Battery-Powered Equipment n Data Acquisition Systems n Instrumentation n Process Controln Energy Management n Product Testing n AutomotivenPrecision Audio ComponentsConnection DiagramsSOT-23TO-92SC7001132301*This pin must be left floating or connected to pin 2.Top ViewSee NS Package Number MF03A (JEDEC Registration TO-236AB)01132303Bottom ViewSee NS Package Number Z03A01132330*This pin must be left floating or connected to pin1.Top ViewSee NS Package Number MAA05AApril 2005LM4040Precision Micropower Shunt Voltage Reference©2005National Semiconductor Corporation Ordering InformationIndustrial Temperature Range (−40˚C to +85˚C)Reverse Breakdown Voltage Tolerance at 25˚C and Average Reverse Breakdown Voltage Temperature CoefficientPackageNS Package NumberM3(SOT-23)M7(SC70)Z (TO-92)Supplied as 1000Units Tape andReelSupplied as 3000Units tape andReelSupplied as 1000Units Tape andReelSupplied as 3000Units Tape andReel±0.1%,100ppm/˚C max (A grade)LM4040AIM3-2.0LM4040AIM3-2.5LM4040AIM3-3.0LM4040AIM3-4.1LM4040AIM3-5.0LM4040AIM3-8.2LM4040AIM3-10.0LM4040AIM3X-2.0LM4040AIM3X-2.5LM4040AIM3X-3.0LM4040AIM3X-4.1LM4040AIM3X-5.0LM4040AIM3X-8.2LM4040AIM3X-10.0LM4040AIZ-2.0LM4040AIZ-2.5LM4040AIZ-3.0LM4040AIZ-4.1LM4040AIZ-5.0LM4040AIZ-8.2LM4040AIZ-10.0MF03A,Z03A±0.2%,100ppm/˚C max (B grade)LM4040BIM3-2.0LM4040BIM3-2.5LM4040BIM3-3.0LM4040BIM3-4.1LM4040BIM3-5.0LM4040BIM3-8.2LM4040BIM3-10.0LM4040BIM3X-2.0LM4040BIM3X-2.5LM4040BIM3X-3.0LM4040BIM3X-4.1LM4040BIM3X-5.0LM4040BIM3X-8.2LM4040BIM3X-10.0LM4040BIM7-2.0LM4040BIM7-2.5LM4040BIM7-3.0LM4040BIM7-4.1LM4040BIM7-5.0LM4040BIM7X-2.0LM4040BIM7X-2.5LM4040BIM7X-3.0LM4040BIM7X-4.1LM4040BIM7X-5.0LM4040BIZ-2.0LM4040BIZ-2.5LM4040BIZ-3.0LM4040BIZ-4.1LM4040BIZ-5.0LM4040BIZ-8.2LM4040BIZ-10.0MF03A,Z03A,MAA05A ±0.5%,100ppm/˚C max (C grade)LM4040CIM3-2.0LM4040CIM3-2.5LM4040CIM3-3.0LM4040CIM3-4.1LM4040CIM3-5.0LM4040CIM3-8.2LM4040CIM3-10.0LM4040CIM3X-2.0LM4040CIM3X-2.5LM4040CIM3X-3.0LM4040CIM3X-4.1LM4040CIM3X-5.0LM4040CIM3X-8.2LM4040CIM3X-10.0LM4040CIM7-2.0LM4040CIM7-2.5LM4040CIM7-3.0LM4040CIM7-4.1LM4040CIM7-5.0LM4040CIM7X-2.0LM4040CIM7X-2.5LM4040CIM7X-3.0LM4040CIM7X-4.1LM4040CIM7X-5.0LM4040CIZ-2.0LM4040CIZ-2.5LM4040CIZ-3.0LM4040CIZ-4.1LM4040CIZ-5.0LM4040CIZ-8.2LM4040CIZ-10.0MF03A,Z03A,MAA05A ±1.0%,150ppm/˚C max (D grade)LM4040DIM3-2.0LM4040DIM3-2.5LM4040DIM3-3.0LM4040DIM3-4.1LM4040DIM3-5.0LM4040DIM3-8.2LM4040DIM3-10.0LM4040DIM3X-2.0LM4040DIM3X-2.5LM4040DIM3X-3.0LM4040DIM3X-4.1LM4040DIM3X-5.0LM4040DIM3X-8.2LM4040DIM3X-10.0LM4040DIM7-2.0LM4040DIM7-2.5LM4040DIM7-3.0LM4040DIM7-4.1LM4040DIM7-5.0LM4040DIM7X-2.0LM4040DIM7X-2.5LM4040DIM7X-3.0LM4040DIM7X-4.1LM4040DIM7X-5.0LM4040DIZ-2.0LM4040DIZ-2.5LM4040DIZ-3.0LM4040DIZ-4.1LM4040DIZ-5.0LM4040DIZ-8.2LM4040DIZ-10.0MF03A,Z03A,MAA05A ±2.0%,150ppm/˚C max (E grade)LM4040EIM3-2.0LM4040EIM3-2.5LM4040EIM3-3.0LM4040EIM3X-2.0LM4040EIM3X-2.5LM4040EIM3X-3.0LM4040EIM7-2.0LM4040EIM7-2.5LM4040EIM7-3.0LM4040EIM7X-2.0LM4040EIM7X-2.5LM4040EIM7X-3.0LM4040EIZ-2.0LM4040EIZ-2.5LM4040EIZ-3.0MF03A,Z03A,MAA05AL M 4040 2Extended Temperature Range(−40˚C to+125˚C)Reverse BreakdownVoltage Tolerance at25˚C and Average Reverse Breakdown Voltage Temperature CoefficientPackageM3(SOT-23) See NS Package Number MF03A±0.5%,100ppm/˚C max(C grade)LM4040CEM3-2.0,LM4040CEM3-2.5,LM4040CEM3-3.0,LM4040CEM3-5.0±1.0%,150ppm/˚C max(D grade)LM4040DEM3-2.0,LM4040DEM3-2.5,LM4040DEM3-3.0,LM4040DEM3-5.0±2.0%,150ppm/˚C max(E grade)LM4040EEM3-2.0,LM4040EEM3-2.5,LM4040EEM3-3.0LM40403SOT-23AND SC70Package Marking InformationOnly three fields of marking are possible on the SOT-23’s and SC70’s small surface.This table gives the meaning of the three fields.Part Marking Field DefinitionRJA SOT-23only First Field:R2A SOT-23only RKA SOT-23only R4A SOT-23only R =Reference R5A SOT-23onlySecond Field:J =2.048V Voltage Option 2=2.500V Voltage OptionR8A SOT-23only K =3.000V Voltage Option R0A SOT-23only4=4.096V Voltage Option RJB R2B 5=5.000V Voltage Option RKB R4B 8=8.192V Voltage Option R5B 0=10.000V Voltage Option R8B SOT-23only R0B SOT-23onlyThird Field:RJC R2C A–E =Initial Reverse Breakdown Voltage or Reference Voltage Tolerance RKC R4C A =±0.1%,B =±0.2%,C =+0.5%,D =±1.0%,E =±2.0%R5C R8C SOT-23only R0C SOT-23onlyRJD R2D RKD R4D R5D R8D SOT-23only R0D SOT-23onlyRJE R2E RKEL M 4040 4Absolute Maximum Ratings(Note1)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Reverse Current20mA Forward Current10mA Power Dissipation(T A=25˚C)(Note2)M3Package306mW Z Package550mW M7Package241mW Storage Temperature−65˚C to+150˚C Lead TemperatureM3PackageVapor phase(60seconds)+215˚C Infrared(15seconds)+220˚C Z PackageSoldering(10seconds)+260˚C ESD SusceptibilityHuman Body Model(Note3)2kVMachine Model(Note3)200V See AN-450“Surface Mounting Methods and Their Effect on Product Reliability”for other methods of soldering surface mount devices.Operating Ratings(Notes1,2) Temperature Range(T min≤T A≤T max) Industrial Temperature Range−40˚C≤T A≤+85˚C Extended Temperature Range−40˚C≤T A≤+125˚C Reverse CurrentLM4040-2.060µA to15mA LM4040-2.560µA to15mA LM4040-3.062µA to15mA LM4040-4.168µA to15mA LM4040-5.074µA to15mA LM4040-8.291µA to15mA LM4040-10.0100µA to15mALM4040-2.0Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZ(Limit)(Note5)LM4040BIM3LM4040BIZLM4040BIM7(Limit)(Note5)Units(Limit)V R Reverse Breakdown Voltage I R=100µA 2.048VReverse Breakdown Voltage Tolerance(Note6)I R=100µA±2.0±4.1mV(max)±15±17mV(max)I RMIN Minimum Operating Current45µA6060µA(max)6565µA(max)∆V R/∆T Average Reverse BreakdownVoltage TemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±100ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse Breakdown VoltageChange with OperatingCurrent Change(Note*NOTARGET FOR*)I RMIN≤I R≤1mA0.3mV0.80.8mV(max)1.0 1.0mV(max) 1mA≤I R≤15mA2.5mV6.0 6.0mV(max)8.08.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,I AC=0.1I R0.3Ω0.80.8Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHzLM40405LM4040-2.0Electrical Characteristics (Industrial Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.Symbol Parameter ConditionsTypical (Note 4)LM4040AIM3LM4040AIZ (Limit)(Note 5)LM4040BIM3LM4040BIZ LM4040BIM7(Limit)(Note 5)Units (Limit)∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%LM4040-2.0Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CIM3LM4040CIZ LM4040CIM7(Limit)(Note 5)LM4040DIM3LM4040DIZ LM4040DIM7(Limit)(Note 5)LM4040EIM7LM4040EIZ (Limit)(Note 5)Units(Limit)V RReverse Breakdown VoltageI R =100µA 2.048VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±10±20±41mV (max)±23±40±60mV (max)I RMINMinimum Operating Current45µA 606565µA (max)657070µA (max)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA ±20ppm/˚CI R =1mA ±15±100±150±150ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I RReverse Breakdown Voltage Change with Operating Current Change (Note *NO TARGET FOR *)I RMIN ≤I R ≤1mA 0.3mV 0.8 1.0 1.0mV (max)1.01.21.2mV (max)1mA ≤I R ≤15mA 2.5mV 6.08.08.0mV (max)8.010.010.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz 0.3ΩI AC =0.1I R 0.91.11.1Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrsT =25˚C ±0.1˚C 120ppmI R =100µA V HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%L M 4040 6LM4040-2.0Electrical Characteristics(Extended Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CEM3(Limit)(Note5)LM4040DEM3(Limit)(Note5)LM4040EEM3(Limit)(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 2.048VReverse Breakdown Voltage Tolerance (Note6)I R=100µA±10±20±41mV(max)±30±50±70mV(max)I RMIN Minimum OperatingCurrent 45µA606565µA(max)687373µA(max)∆V R/∆T Average ReverseBreakdown VoltageTemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±150±150ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.3mV0.8 1.0 1.0mV(max)1.0 1.2 1.2mV(max) 1mA≤I R≤15mA2.5mV6.08.08.0mV(max)8.010.010.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,I AC=0.1I R0.3Ω0.9 1.1 1.1Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHz∆V R Reverse BreakdownVoltage Long TermStability t=1000hrsT=25˚C±0.1˚CI R=100µA120ppmV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040-2.5Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZ(Limit)(Note5)LM4040BIM3LM4040BIZLM4040BIM7Limits(Note5)Units(Limit)V R Reverse Breakdown Voltage I R=100µA 2.500VReverse Breakdown Voltage Tolerance(Note6)I R=100µA±2.5±5.0mV(max)±19±21mV(max)I RMIN Minimum Operating Current45µA6060µA(max)6565µA(max)LM40407LM4040-2.5Electrical Characteristics (Industrial Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.Symbol Parameter ConditionsTypical (Note 4)LM4040AIM3LM4040AIZ (Limit)(Note 5)LM4040BIM3LM4040BIZ LM4040BIM7Limits (Note 5)Units (Limit)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA ±20ppm/˚CI R =1mA ±15±100±100ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.3mV0.80.8mV (max)1.01.0mV (max)1mA ≤I R ≤15mA2.5mV 6.0 6.0mV (max)8.08.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.3Ω0.80.8Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%LM4040-2.5Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CIM3LM4040DIZ LM4040CIM7Limits (Note 5)LM4040DIM3LM4040DIZ LM4040DIM7Limits (Note 5)LM4040EIM7LM4040EIZ Limits(Note 5)Units(Limit)V RReverse Breakdown VoltageI R =100µA 2.500VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±12±25±50mV (max)±29±49±74mV (max)I RMINMinimum Operating Current45µA 606565µA (max)657070µA (max)∆V R /∆TAverage Reverse Breakdown Voltage TemperatureCoefficient(Note 6)I R =10mA ±20ppm/˚C I R =1mA ±15±100±150±150ppm/˚C (max)I R =100µA±15ppm/˚CL M 4040 8LM4040-2.5Electrical Characteristics(Industrial Temperature Range)(Continued)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CIM3LM4040DIZLM4040CIM7Limits(Note5)LM4040DIM3LM4040DIZLM4040DIM7Limits(Note5)LM4040EIM7LM4040EIZLimits(Note5)Units(Limit)∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.3mV0.8 1.0 1.0mV(max)1.0 1.2 1.2mV(max) 1mA≤I R≤15mA2.5mV6.08.08.0mV(max)8.010.010.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz0.3ΩI AC=0.1I R0.9 1.1 1.1Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHz∆V R Reverse BreakdownVoltage Long TermStability t=1000hrsT=25˚C±0.1˚C120ppm I R=100µAV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040-2.5Electrical Characteristics(Extended Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CEM3Limits(Note5)LM4040DEM3Limits(Note5)LM4040EEM3Limits(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 2.500VReverse Breakdown VoltageTolerance(Note6)I R=100µA±12±25±50mV(max)±38±63±88mV(max)I RMIN Minimum OperatingCurrent 45µA606565µA(max)687373µA(max)∆V R/∆T Average ReverseBreakdown VoltageTemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±150±150ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.3mV0.8 1.0 1.0mV(max)1.0 1.2 1.2mV(max)1mA≤I R≤15mA 2.5mV6.08.08.0mV(max)8.010.010.0mV(max)LM40409LM4040-2.5Electrical Characteristics (Extended Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CEM3Limits (Note 5)LM4040DEM3Limits (Note 5)LM4040EEM3Limits (Note 5)Units(Limit)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.3Ω0.91.11.1Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stabilityt =1000hrsT =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis(Note 8)∆T =−40˚C to +125˚C0.08%LM4040-3.0Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.Symbol Parameter ConditionsTypical (Note 4)LM4040AIM3LM4040AIZ (Limit)(Note 5)LM4040BIM3LM4040BIZ LM4040BIM7Limits (Note 5)Units (Limit)V R Reverse Breakdown Voltage I R =100µA 3.000VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±3.0±6.0mV (max)±22±26mV (max)I RMINMinimum Operating Current47µA 6262µA (max)6767µA (max)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA ±20ppm/˚C I R =1mA ±15±100±100ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.6mV0.80.8mV (max)1.11.1mV (max)1mA ≤I R ≤15mA2.7mV 6.0 6.0mV (max)9.09.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.4Ω0.90.9Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%L M 4040 10LM4040-3.0Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CIM3LM4040DIZLM4040CIM7Limits(Note5)LM4040DIM3LM4040DIZLM4040DIM7Limits(Note5)LM4040EIM7LM4040EIZLimits(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 3.000VReverse Breakdown Voltage Tolerance (Note6)I R=100µA±15±30±60mV(max)±34±59±89mV(max)I RMIN Minimum OperatingCurrent 45µA606565µA(max)657070µA(max)∆V R/∆T Average ReverseBreakdown VoltageTemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±150±150ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.4mV0.8 1.1 1.1mV(max)1.1 1.3 1.3mV(max) 1mA≤I R≤15mA2.7mV6.08.08.0mV(max)9.011.011.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz0.4ΩI AC=0.1I R0.9 1.2 1.2Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHz∆V R Reverse BreakdownVoltage Long TermStability t=1000hrsT=25˚C±0.1˚C120ppm I R=100µAV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040-3.0Electrical Characteristics(Extended Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CEM3Limits(Note5)LM4040DEM3Limits(Note5)LM4040EEM3Limits(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 3.000VReverse Breakdown VoltageTolerance(Note6)I R=100µA±15±30±60mV(max)±45±75±105mV(max)I RMIN Minimum OperatingCurrent 47µA626767µA(max)707575µA(max)LM4040LM4040-3.0Electrical Characteristics (Extended Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CEM3Limits (Note 5)LM4040DEM3Limits (Note 5)LM4040EEM3Limits (Note 5)Units(Limit)∆V R /∆TAverage Reverse Breakdown Voltage TemperatureCoefficient (Note 6)I R =10mA ±20ppm/˚CI R =1mA ±15±100±150±150ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.4mV 0.8 1.1 1.1mV (max)1.11.31.3mV (max)1mA ≤I R ≤15mA2.7mV 6.08.08.0mV (max)9.011.011.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.4Ω0.91.21.2Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stabilityt =1000hrsT =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis(Note 8)∆T =−40˚C to +125˚C0.08%LM4040-4.1Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040AIM3LM4040AIZ Limits (Note 5)LM4040BIM3LM4040BIZ LM4040BIM7Limits (Note 5)Units (Limit)V R Reverse Breakdown Voltage I R =100µA 4.096VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±4.1±8.2mV (max)±31±35mV (max)I RMINMinimum Operating Current50µA 6868µA (max)7373µA (max)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient(Note 6)I R =10mA ±30ppm/˚C I R =1mA ±20±100±100ppm/˚C (max)I R =100µA±20ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.5mV0.90.9mV (max)1.21.2mV (max)1mA ≤I R ≤15mA3.0mV 7.07.0mV (max)10.010.0mV (max)L M 4040LM4040-4.1Electrical Characteristics(Industrial Temperature Range)(Continued)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZLimits(Note5)LM4040BIM3LM4040BIZLM4040BIM7Limits(Note5)Units(Limit)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,0.5ΩI AC=0.1I R 1.0 1.0Ω(max)e N Wideband Noise I R=100µA80µV rms10Hz≤f≤10kHz∆V R Reverse Breakdown VoltageLong Term Stability t=1000hrsT=25˚C±0.1˚CI R=100µA120ppmV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040LM4040-4.1Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C and D designate initial Re-verse Breakdown Voltage tolerances of ±0.5%and ±1.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CIM3LM4040CIZ LM4040CIM7Limits (Note 5)LM4040DIM3LM4040BIZ LM4040DIM7Limits (Note 5)Units (Limit)V R Reverse Breakdown Voltage I R =100µA 4.096VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±20±41mV (max)±47±81mV (max)I RMINMinimum Operating Current50µA 6873µA (max)7378µA (max)∆V R /∆T Average Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA±30ppm/˚C I R =1mA ±20±100±150ppm/˚C (max)I R =100µA ±20ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA 0.5mV0.9 1.2mV (max)1.21.5mV (max)1mA ≤I R ≤15mA3.0mV 7.09.0mV (max)10.013.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,0.5ΩI AC =0.1I R 1.01.3Ω(max)e N Wideband NoiseI R =100µA 80µV rms 10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%L M 4040LM4040-5.0Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZLimits(Note5)LM4040BIM3LM4040BIZLM4040BIM7Limits(Note5)Units(Limit)V R Reverse Breakdown Voltage I R=100µA 5.000VReverse Breakdown Voltage Tolerance(Note6)I R=100µA±5.0±10mV(max)±38±43mV(max)I RMIN Minimum Operating Current54µA7474µA(max)8080µA(max)∆V R/∆T Average Reverse Breakdown Voltage TemperatureCoefficient(Note6)I R=10mA±30ppm/˚CI R=1mA±20±100±100ppm/˚C(max) I R=100µA±20ppm/˚C∆V R/∆I R Reverse Breakdown VoltageChange with OperatingCurrent Change(Note7)I RMIN≤I R≤1mA0.5mV1.0 1.0mV(max)1.4 1.4mV(max) 1mA≤I R≤15mA 3.5mV8.08.0mV(max)12.012.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,0.5ΩI AC=0.1I R 1.1 1.1Ω(max)e N Wideband Noise I R=100µA80µV rms10Hz≤f≤10kHz∆V R Reverse Breakdown VoltageLong Term Stability t=1000hrsT=25˚C±0.1˚C120ppm I R=100µAV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040。

FUJITSU显示设备商品说明书

Smart displaysolutionsfor newworkspacesFUJITSU DisplaysA feast for your eyesStart here →Start exploring:Your go-to displays for a smart office environmentBack-to-back videoconferences, followed by intricate work on side-by-sides preadsheets? Fast typing in a multi-page document, then presenting toc olleagues over a remote link? Designing a graphic that needs utmost color fidelity, and next on the agenda is producing a video? In every smart, connected workplace, the display is the gateway to productive multitasking. And with morep eople than ever adopting flexible working, moving between homes and offices, it is vital to have the same excellent standards everywhere.When you choose a display from Fujitsu, you will never have to compromise. With display solutions for every user profile, from CAD and finance experts to mainstream office admin, and in sizes from 19 to 34 inches, ultrawide, curved or flat, Fujitsu displays are the heart of smart workplaces in the digital economy.Discover how Fujitsu displays can transform your viewing experience!w ellbeing at work Meet the cleandesk challengeFUJITSU Displaysfor every profileDisplay Quick FinderSave energy with smart displays olutionsReady for a freshview of your smartworkplace?Your choice of display makes a huge difference to health and wellbeing in the work-place. With Fujitsu, you have the confidence that you have made the right decision. We work with leading research organizations such as Fraunhofer Institute for Labor Economics and Organization (IAO) to create h uman-centric products and solutions. Our displays put people first – w ith features that are designed to enhance wellbeing at your desk, and keep you productive during the hours you work.Health first: A smart view on wellbeing at workWorking for a healthy environmentFUJITSU Displays are recognized and certified by leading environmental agencies such as EPA, EPEAT and TCO for their energy efficiency and impact on the environment. Our displays are up to 98% recyclable, helping to protectthe environment for future generations.Ultrawide viewing with IPS technology for clarity from any perspective6-in-1 flexibility: tilt, swivel, height-adjust and rotate your display to exactly the right position for youKeep your eyes healthy: Certified by German TÜV, FUJITSU displays are flicker-free, and with reduced blue-light emissionsFUJITSU Displays for every profileFujitsu displays strike the perfect balance between cutting-edge performance, usability, and reliability. With three product lines (each with a range of different models), you can easily find the right model for your line of work.E-LINEIdeal for home and office environments designedfor e nergy savings and economy■S creen sizes: 21.5 inches (54.6 cm)to 23.8 inches (60.5 cm)■Great viewing with In-Plane-Switching (IPS) technology ■10-finger touch version available■E nergy efficiency: ECO operation mode,ECO key and Status LED■“Backpack solution” for mounting Fujitsu FUTROThin Clients and ESPRIMO Q Mini PCs at rear of display ■Integrated speakersP-LINEP-line Superior displays are your choice forthe u ncompromising m odern workplace■S creen sizes: 23.8 inches (60.5 cm) to 34.1 inches (86.7 cm)■F rameless IPS panels with 100% coverage up to 138%■s RGB color space and up to 98% DCI P3 formaximum visual pleasure■6-in-1 stand: stand (height-adjust, tilt, swivel,pivot, cable guide, ready for backpack solution)■B uilt-in sensors: presence detection,Auto Brightness Control (ABC)■B uilt-in speakers (2x2W), headphone connectors■U SB Type - C docking: with 65W charging,DP Alternate Mode■D isplayView™ software: configure display via mouse(including split screen and multi-monitor control)B-LINEDesigned for the rigors of medium to large o rganizations,with a special e mphasis on healthand wellbeing features and 24/7 use■Screen sizes: 19 inches (48.3 cm) to 31.5 inches (80 cm)■5-in-1 stand (height-adjust, tilt, swivel, pivot, cableguide), picture over desk (down to 40mm)■Built-in speakers and headphone connectors■T actile keys front-side with haptic & sonic feedback,Eco button, multi-color status LED■D isplayView™ software: configure display via mouse(including split screen and multi-monitor control)Save energy with smart display solutionsFUJITSU Displays with built-in sensors* are designed to maximize your energy savings – for the benefit of the environment and your power bills.Presence-sensingThe display goes into sleep mode when you are away from your desk – and senses your presence when you return. For extra security, access is password-protected Auto Brightness Control (ABC)Bright sunlight? Gloomy winter afternoon? YourFujitsu display measures ambient lighting conditionsand adjusts brightness to save energyWorkplace Lighting GuideYour display alerts you if ambient light is too strongor weak, helping you to avoid unnecessary eye strain* Available in select modelsSpace often must double up for other purposes. A desk at home might be in the living space. A desk in the office could be used for a drop-in work session, to be taken over by another user later.A clean desk helps to keep space flexible.Fujitsu offers displays to keep your space clear – featuring one-cable docking systems to eliminate cable clutter, and flexible arms as stands that you can adjust to one height for working, and another for videoconferencing. Fujitsu Client Computing Devices can be hooked to the display’s arm and share its power supply, On/Off key, and LED indicator.Clean screen: on-screen organizationfor more productivityGood organization makes complex tasks easier to manage – and Fujitsu displays with DisplayView™ help you to bring structure to your task layout. The split screen software allows you to embed applications into your choice of layout, so you never lose track of what you are working on. The app is automatically sized to the selected window.It takes two: dual monitor setupsFujitsu offers displays to keep your space clear – featuring one-cable docking systems to eliminate cable clutter, and flexible arms and stands that you can adjust to one height for working, and another for videoconferencing. Fujitsu Client Computing Devices can be hooked to the display’s arm and share its power supply, On/Off key, and LED indicator.Spoilt for choice with the impressive range of Fujitsu displays available? This Quick Finder will help you to locatesuitable displays. Recommendations are based on typical requirements for small and medium-sized enterprises.Fast performance to run complex software, fine resolution for intricate on-screen d etailOptimized for setups with more than one display on the desk – including frameless designs and advanced connectivityAdd touch for greater flexibility in interactionCombine style with substance: a superb-looking display says you mean businessGreat performance and resolution for mainstream office appsB32-9 TS UHD B27-9 TE QHD B27-9 TS QHD P27-8 TS UHDP27-9 TE QHD P27-9 TS QHD P24-8 WE NeoB27-9 TE FHD B27-9 TS FHD B27-9 TE QHD B27-9 TS QHDP27-9 TS B24-9 TE B24-9 TS P24-9 TEP24-8 WE Neo B24-9 WS B24-9 WEE24-9 TouchP34-9 UE P34-9 US B27-9 TE B27-9 TSB24-9 TE B24-9 TSP24-8 WE Neo B24-9 WEB27-8 TE Pro B27-8 TS Pro B24W-7 LED B24-9 WEB24-9 WS B24-8 TE Pro B24-8 TS Pro B24-9 TEB24-9 TSB22-8 WE Neo B22-8 TS ProUSB Type C docking 24/7 operation Document management Budget Space-savingDisplay Quick FinderReady for a fresh view of your smart workplace?Enrich your smart workplace with FUJITSU Displays – and create the spaces for tomorrow’s ideas!© 2021 FUJITSU. All rights reserved.FUJITSU and FUJITSU logo are trademarks of Fujitsu Limited registered in many jurisdictions worldwide. Other product, service and company names mentioned herein may be trademarks of Fujitsu or other companies. This document is current as of the initial date of publication and subject to be changed by Fujitsu without notice. This material is provided for information purposes only and Fujitsu assumes no liability related to its use. We reserve the right to change delivery options or make technical modifications.Learn more about Displays from Fujitsu:→ /global/products/computing/peripheral/displays/。

艾默生CT-Unidrive M400中文彩页

• 智能控制的三速冷却风扇可根据电机负载和环境条件调节。这可省电、延长风扇寿命并减少噪音。
• 电机运行时非常安静，PWM 载波频率高达 16 kHz。
电机控制模式包括：
控制模式
感应电机开环矢量或 V/F 控制
增强的感应电机开环转子磁通控制 (RFC-A)
功能
针对感应电机的开环电机控制，可提供良好的性能，配置简单。可在多电机系统中使用 V/F 模式。
• 尺寸兼容 • 板载编程 • 额定功率扩展至高达 110 kW (150 hp) • 支持 Commander SK 参数文件的导入和驱动器复制典型应用：实现对输送带、正排量泵、物料传输和切割以及木材加工等的速度控制，这些应用中需要快速设置和诊断。

5
由 CODESYS 驱动的 Machine Control Studio 编程软件
常规表面和导轨安装（仅 1 型和 2 型提供导轨安装）
容易操作的控制接线容易断开的内置 EMC 滤波器*
容易操作的电源接线*
稳固的电缆管理系统为控制电缆和电源电缆屏蔽提供接地点
典型系统集成 (SI) 选件模块 * 在某些型号驱动器上，功能和位置有所变化
适用于可选通讯和扩展 I/O 的系统集成 (SI) 模块插槽
通过一种先进的矢量算法实现高性能速度和转矩控制，利用电流反馈大幅提高所有型号感应电机的性能，无需反馈设备。

7
❯ ❯
❯ ❯
Unidrive M400 的选件选择与端子布局
控制模式
1. 感应电机开环矢量或 V/F 控制 2. 感应电机开环转子磁通控制 (RFC-A)
可轻松访问机器控制功能
我们的软件工具、键盘和存储设备可供轻松快捷地访问 Unidrive M 的机器控制功能，以便配置、监控和诊断。

TSX Premium硬件组成

离散量I/O 模拟量I/O 专用通道网络数 As-I总线第三方总线
机架集成以太网口
512
512
1024 1024 1024
1024
1024 1024 1024 2048 2048
24
24
80
80
80
80
128
128
128
256
256
8
8
24
24
24
24
32
32
32
64
64
1
1
1
1
0
0
3
3
2
4
3
有故障
L
N
14
处理器单元: 57-103, 57-203
TSX Premium
处理器：描述
RUN ERR TER I/O
复位按钮（引起冷起动） %S0 （终端口 TER （用于连接FTX终端或兼容机 PC）辅助口 AUX（用于人机对话）
内存卡
备注：
Schneider Electric
PCMCIA type 3
处理器 : 控制器的状态显示
RUN ERR FIP TER I/O
亮
闪烁
工作正常
停机
灭
故障，应用不存在或无效
阻塞故障处理器模块故障系统或电源故障
• 来自模块的I/O故障 .
或I/O配置故障
非阻塞故障：
•应用不存在，无效或工作不正常 •存储卡故障或不兼容，电池故障 •系统总线出错 •总线故障（I/O 和ERR灯）
4 3 2 1
ON OFF
adr. = 01
TSX CBY ..0K 1, 3, 5,12,18,28,38,50,72,100 米

Boonton PMX40 RF Power Meter数据手册说明书

The PMX40 provides design engineers and technicians the utility of traditional benchtop instrument, the flexibility and performance of modern USB RF power sensors, and the simplicity of a multi-touch display built with Boonton award-winning technology.As a benchtop meter, the PMX40 provides a standalone solution for capturing, displaying, and analyzing peak and average RF power in both the time and statistical domains through an intuitive, multi-touch touchscreen display.The PMX40 Power Meter utilizes up to four RTP and CPS families of USB RF power sensors with industry- leading performance and capabilities either independently or for synchronized multi-channel measurements of CW, modulated, and pulsed signals.Providing the ultimate flexibility, the PMX40 sensors can be disconnected and independently used as standalone instruments.Key Features• Capture/display/analyze peak and average power• Frequency range from 4 kHz to 40 GHz• Industry-leading video bandwidth (195 MHz) and rise time (3 ns)• Industry-leading 100,000 measurements per second• Industry-leading 100 ps time resolution• Synchronous multi-channel measurements (up to 4 channels)• Sensors can be used as standalone instruments PMX40 RF Power MeterPulsed ModeAnalysis of fast-rising single pulses or pulses with short pulserepetition intervals (PRIs) requires an instrument with sophisticated trigger and data acquisition capability. Within Pulsed Mode, more than 16 pulse parameters can be measured.Continuous ModeFor simple, intuitive measurements of repetitive waveforms, the PMX40 Continuous Mode of operation provides a numeric display of average, maximum and minimum signal powers.Statistical ModeIn Statistical Mode, the PMX40 plots the Complementary Cumulative Distribution Function (CCDF). The CCDF plot shows the rate of occurrence of a specific crest factor for signals, such as those used in 5G, 4G/LTE, and Wi-Fi applications.PMX40 RF Power Meter – Front PanelConnect up to 4 USB sensors for multi-channel measurements.Multi-touch display with intuitive user interface.One touch to quickly access presets and favorite functions.Sync ports to source or receive triggers for timing and synchronization.Test source to verify sensor operation.The PMX40’s intuitive, multi-touch display enables fast configuration of up to four sensors as well as easy access to measurement and analysis tools, providing a standalone solution for capturing, displaying, and analyzing peak and average RF power in both the time and statistical domains. The meter also incorporates a test source to verify sensor operation.High-Performance and Versatile USB Power Sensors• Real-Time Power Processing™ technology with virtually zero measurement latency • 100,000 measurements per second • 80 dB dynamic range• Synchronized multi-channel measurementsAll RTP Real-Time Power SensorsThe Boonton PMX40 Power Meter utilizes Boonton RTP and CPS families of USB RF power sensors with indus-try leading performance and capabilities. All RTP sensors incorporate the unique Boonton Real-Time Power Processing™ technology, which virtually eliminates gaps in measurement suffered by other power sensors and enables industry best measurement speeds. In terms of RF performance, the RTP5000 series Real-Time Peak Power Sensors are the fastest responding sensors with 3 ns rise times and 195 MHz of video bandwidth. The RTP4000 series Real-Time True Average Power Sensors enable the lowest frequency measurements for diode-based average power measuring sensors and can make accurate measurements virtually independent of signal modulation bandwidth. CPS sensors offer flexible connectivity and performance leadership at anexcellent price point.Real-Time Power Processing™Boonton Real-Time Power Processing 1 dramatically reduces the total cycle time for acquiring and processing power measurement samples. By combining a dedicated acquisition engine, hardware trigger, integrated sample buffer, and a real-time optimized parallel processing architecture, Real-Time Power Processing™ performs most of the sweep processing steps simultaneously, beginning immediately after the trigger instead of waiting for the end of the acquisition cycle.The advantages of the Real-Time Power Processing technique are that key processing steps take place in parallel and keep pace with the signal acquisition. With no added computational overhead to prolong the sweep cycle, the sample buffer cannot overflow. As a result, there is no need to halt acquisition for trace processing. This means gap-free signal acquisition virtually guarantees that intermittent signal phenomena such as transients or dropouts will be reliably captured and analyzed.1RTPP is available within the RTP500 and RTP4000 sensors.Software FeaturesMeasurement Buffer ModeThe RTP series Measurement Buffer Mode is a remote control function that works in conjunction with Real-Time Power Processing to provide only therelevant burst or pulse information, eliminating the need to download and post-process large sample buffers. As a result, users can collect and analyze measurements from a virtually unlimited number of consecutive pulses or events without gaps. A wide variety of parameters can be calculated and plotted, such as duty cycle, pulse repetition rate, pulse width variation, and pulse jitter. In addition, anomalies,such as dropouts, can be identified.Dropouts, such as those shown left, are the sorts of events often missed by conventional power meters due to the acquisition gaps while processing takes place.Example seven pulse waveform.Measurement buffer data returned for waveform in above.Wi-Fi and Wireless Communication Signal AnalysisCharacterization and compliance testing of Wi-Fi and LTE chipsets and devices involves significant challenges for design and test engineers. With multiple-input, multiple-output (MIMO) architectures and channel bandwidths up to 160 MHz, testing is complex, especially when measuring RF power per channel and time alignment between channels. The PMX40 enables packet power measurements to be performed independently on multiple synchronous or asynchronous transmit chains with a common timebase shared among sensors.Use markers to define a portion of the waveform on which to make measurements. “Between Marker” measurements are ideal for monitoring specific portions of a packet over long intervals.Video bandwidth (VBW) describes the ability of a power sensor to track peak (envelope) power. Insufficient VBW will result in errant envelope and average power measurements. The PMX40 offers the widest video bandwidth (195 MHz) making it ideal for measuring 80 MHz, 100 MHz, and 160MHz channels.By comparing the peak-to-average power ratio, or crest factor (CF), of input and output signals of an RF transmission chain, engineers can assess circuit linearity. Additional insight can be provided with the PMX40 statistical mode Complementary Cumulative Distribution Function (CCDF) plot displaying the rate of occurrence of a specific CF. As an amplifier output compresses, the CF will reduce and the CCDF plot will move left.Indication of amplifier output compressionCrest FactorSecondary Surveillance Radar (SSR)Design, verification, troubleshooting and maintenance of secondary surveillanceradar (e.g. IFF-based radar) has never been more demanding.Proper design and operation of SSR systems is critical to the safety and security of aviation. The PMX40 can b e u sed t o easily a nd accurately capture SSR waveforms. Markers enable measurements on specific portions of the waveform.Industry-leading rise time (<3 ns) enables characterization of the most demanding radar signals.Utilize the superior 100 ps time resolution to zoom and uncover signal characteristics that might otherwise be missed.Key Features and Functionality• Data displayed as numerical meter or waveform trace • Statistical analysis with CCDF plot• Multiple marker measurements, including between marker data and marker ratios • Automated measurements; e.g., 16 automated pulse measurements • Export measurement data in .csv or .pdf formats • Up to 8 simultaneous power measurement channels• Simulation mode available to preview functionality when a sensor is not availableKey Features and Functionality• Large numeric readout and/or analog meter display • Zoom and pan through data logging strip chart• Quickly set frequency, aperture (averaging) and offset values all from the main screen• Calculates ratios between sensor measurements • Control up to 8 sensors at once• Simulation mode available to preview functionality when a sensor is not availableSensor SoftwarePower Viewer – Simple and Intuitive Measurement Software(for standalone operation of the CPS2000 Series of sensors)Power Viewer is a complimentary PC-based software package for CPS2008 sensor control, measurement configuration, and analysis. It includes USB drivers, remote control API, firmware updater and virtual instrument application.(for standalone operation of the RTP4000 and RTP5000 series of sensors)Power Analyzer is a complimentary PC-Based software package for RTP5000 and RTP4000 sensor control, measurement configuration, and advanced analysis. It includes USB drivers, remote control API, firmwareupdater and virtual instrument application.Power Analyzer - Advanced Measurement and Analysis SoftwareSensor SpecificationsRTP5006RTP5318 RF Frequency Range50 MHz to 6 GHz50 MHz to 18 GHz Dynamic RangeSpecificationsChannels Up to 4 Sensors RTP5000 SeriesRTP4000 SeriesCPS2000 Series Display5-inch WVGA multi-touch display with intuitive graphical user interfaceDisplay Modes Trace (power vs time)Statistical measurements Meter (numeric display)CCDFAutomatic measurements (pulse, statistical, and markers measurements)Marker Measurements (in Trace View)Markers (vertical cursors)Marker IndependentlyInterval Between MarkersPair of MarkersSettable in time relative to the trigger positionAvg, Min and Max Power at a specified time offsetAvg, Min and Max Power over the defined intervalRatio of power values at each markerPulse Mode – Automatic Measurements Pulse rise-timePulse widthPulse periodPulse duty cyclePulse peakPulse overshootTop level powerEdge delayPulse fall-timePulse off-timePulse repetition frequencyWaveform averagePulse averagePulse droopBottom level powerPulse edge skew between channelsStatistical Mode –Automatic Measurements Peak powerMinimum powerDynamic rangeCrest factor at cursorAverage powerPeak to average ratioPercent at cursorCrest factor at various percentsTrigger Synchronization*ModeSourceInternal Level RangeExternal Level RangeSlopeHold-off, Min Pulse Width, Max Trigger RateAmong RTP Series(internal trig distribution)Normal, Auto, Auto Pk-to-Pk, Free Run Any connected RTP Series sensor (via SMB’s) or rearpanel external trigger -40 dBm to +20 dBm (sensor dependent)±5 volts or TTL+ or -Sensor and timebase dependentTime Base Time Base Resolution, Range, AccuracyTime Base DisplayTrigger Delay RangeTrigger Delay ResolutionSensor dependent Sweeping or Roll Mode Sensor dependent0.02 divisionsSpecifications, ContinuedInputs/Outputs (front panel)USB with SMB trigger port Test Source50 MHz(optional rear panel placement)Inputs/Outputs (rear panel)LANUSB with SMB trigger portWireless Telecom Group Inc. 25 Eastmans Rd Parsippany, NJ United StatesTel: +1 973 386 9696 Fax: +1 973 386 9191 © Copyright 2020 All rights reserved.B/PMX40/0520/ENNote: Specifications, terms and conditions are subject to change without prior notice.PMX40RF Power Meter (includes 2 active channels)OptionsPMX40-4CH PMX40-GPIB PMX40-RTSAdds 2 Active Channels (for a total of 4)GPIB Control (internally installed)Moves Test Source output to the rear panelIncluded AccessoriesInformation Card (provides information on where to download the latest manual, software, utilities)Optional AccessoriesPMX40-RMK PMX40-TCASEFull-width 19” Rack Mount Kit (includes handles & hardware for mounting one or two meters)Transit case, hold the PMX40 and up to 4 sensorsRF Power SensorsCPS2008RTP4006RTP4106RTP4018*RTP4040*RTP5006RTP5318RTP5518RTP5340RTP5540True Average Connected Power Sensor Real-Time True Average Power Sensor Real-Time True Average Power Sensor Real-Time True Average Power Sensor Real-Time True Average Power Sensor Real-Time Peak Power Sensor Real-Time Peak Power Sensor Real-Time Peak Power Sensor Real-Time Peak Power Sensor Real-Time Peak Power Sensor50 MHz to 8 GHz 10 MHz to 6 GHz 4 kHz to 6 GHz 10 MHz to 18 GHz 10 MHz to 40 GHz 50 MHz to 6 GHz 50 MHz to 18 GHz 50 MHz to 18 GHz 50 MHz to 40 GHz 50 MHz to 40 GHzIncluded AccessoriesInformation Card (provides information on where to download the latest manual, software, utilities)0.9 m BNC (m) to SMB (m) cable (RTP sensors)0.9 m SMB (m) to SMB (m) cable (RTP sensors)1.8 m USB A (m) to USB B (m) locking SeaLATCH cable (RTP sensors)1.6 m USB A (m) to USB B (m) cable (CPS sensors)Ordering Information*RTP4018 and RTP4040 are currently in development. Specifications and performance subject to change。

Dell Inspiron 640M E1405 说明书

Dell™ Inspiron™ 640M/E1405用户手册型号：PP19Lw w w.d e l l.c o m|s u p p o r t.d e l l.c o m注、注意和警告注：注表示可以帮助您更好地使用计算机的重要信息。

注意：注意表示可能会损坏硬件或导致数据丢失，并告诉您如何避免此类问题。

警告：警告表示可能会导致财产损失、人身伤害甚至死亡。

缩写词和缩略词要获得缩写词和缩略词的完整列表，请参阅第 169 页的“词汇表”。

如果您购买的是 Dell™ n Series 计算机，则本说明文件中有关 Microsoft®Windows®操作系统的所有参考信息均不适用。

____________________本说明文件中的信息如有更改，恕不另行通知。

未经 Dell Inc. 书面许可，严禁以任何形式进行复制。

本文中使用的商标：Dell、DELL徽标、Inspiron、Dell Precision、Dimension、DellNet、OptiPlex、Latitude、PowerEdge、PowerConnect、PowerVault、PowerApp、Dell TravelLite、ExpressCharge、Dell Media Experience 和 Strike Zone 是 Dell Inc. 的商标；Intel、Celeron和Pentium 是 Intel Corporation 的注册商标；Microsoft、Outlook 和Windows是 Microsoft Corporation 的注册商标；Bluetooth是 Bluetooth SIG, Inc. 拥有的注册商标，并许可 Dell 使用；IBM是 International Business Machines Corporation 的注册商标；E MC是 EMC Corporation 的注册商标；能源之星是美国环保局的注册商标。

IXYS 集成电路分部 600V N-通道泡沫式 FET 数据手册说明书

I NTEGRATED C IRCUITS D IVISIONCPC3960600V N-ChannelDepletion-Mode FETPart #DescriptionCPC3960ZTRSOT -223: T ape and Reel (1000/Reel)BV DSX /BV DGX R DS(on) (max)I DSS (min)Package 600V44Ω100mASOT -223ApplicationsFeaturesDescriptionOrdering InformationCircuit Symbol• Current Regulator • Normally-O n Switches • Solid State Relays • Converters• T elecommunications • Power Supply• High Breakdown Voltage: 600V • O n-Resistance: 44Ω max. at 25ºC • Low V GS(off) Voltage: -1.4 to -3.1V • High Input Impedance• Small Package Size: SOT -223The CPC3960 is a 600V , N-channel, depletion-mode, Field Effect T ransistor (FET) created using IXYSIntegrated Circuits Division’s proprietary vertical DMOS process. Yielding a robust device with high input impedance, this process enables world class, high voltage MOSFET performance with an economical silicon gate architecture.As with all MOS devices, the FET structure prevents thermal runaway and thermal-induced secondary breakdown, which makes the CPC3960 ideal for use in high-power applications.The CPC3960 is a highly reliable FET device that has been used extensively in IXYS Integrated Circuits Division’s Solid State Relays for industrial and telecommunications applications.The CPC3960 is available in the SOT -223 package.Package PinoutGDSAbsolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.Absolute Maximum Ratings @ 25ºCElectrical Characteristics @ 25ºC (Unless Otherwise Noted)Ratings Units Drain-to-Source Voltage 600V Gate-to-Source Voltage ±15V Pulsed Drain Current150mA Total Package Dissipation 1 1.8W Operational T emperature-55 to +125ºC Junction Temperature, Maximum +125ºC Storage Temperature-55 to +125ºC1 Mounted on 1"x1"2 oz. Copper FR4 board.Symbol Min Typ Max Units Drain-to-Source Breakdown Voltage BV DSX V GS = -5.5V , I D =100µA 600--V Gate-to-Source Off VoltageV GS(off)V DS = 15V , I D =1μA -1.4--3.1V Change in V GS(off) with Temperature dV GS(off) /dT V DS = 15V , I D =1μA -- 4.5mV/ºC Gate Body Leakage Current I GSS V GS =±15V , V DS =0V --100nA Drain-to-Source Leakage Current I D(off)V GS = -5.5V , V DS =600V --1µA Saturated Drain-to-Source CurrentI DSS V GS = 0V , V DS =15V 100--mA Static Drain-to-Source On-State Resistance R DS(on)V GS = 0V , I D =100mA, V DS =10V--44ΩChange in R DS(on) with T emperature dR DS(on) /dT-- 2.5%/ºC Forward T ransconductance G fs I D = 50mA, V DS = 10V100--m ΩInput CapacitanceC ISS V GS = -3.5VV DS = 25V f= 1MHz-100-pF Common Source Output Capacitance C OSS 6.8Reverse T ransfer Capacitance C RSS4.2Source-Drain Diode Voltage Drop V SD V GS = -5V , I SD =150mA-0.721V Thermal Resistance Junction to Ambient ΘJA --55-ºC/WJunction to CaseΘJC--23-PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)**The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written speciﬁ cations, please contact our application department.V GS (V)-5-4-3-2-10I D (A )0.000.050.100.150.200.25Input Admittance(V=3V)Temperature (ºC)-50-250255075100125V G S (V )-3.5-3.0-2.5-2.0-1.5-1.0-0.50.0Threshold Voltage(I =1PA)I D (A)0.000.050.100.150.20-100100200300400Transconductance vs. Drain Current(V =3V)G m (m ):V DS (V)123456I D (m A )50100150200250Output CharacteristicsTemperature (ºC)-50-250255075100125O n -R e s i s t a n c e (:)1020304050On-Resistance vs. Temperature(V =0V, I=50mA)Temperature (ºC)-50-25255075100125L e a k a g e C u r r e n t (n A )020406080100120Leakage Current (V =-5V , V =600V)V DS (V)0510152025303540C a p a c i t a n c e (p F )50100150200Capacitance vs. Drain-Source Voltage(V =-5V)I D (A)0.00.10.20.30.40.50.6O n R e s i s t a n c e (:)5101520253035404550On-Resistance vs. Drain CurrentTemperature (ºC)020406080100120140P o w e r D i s s i p a t i o n (W )0.00.51.01.52.0Power Dissipationvs. Ambient TemperatureTemperature (ºC)-50-250255075100125B l o c k i n g V o l t a g e (V P )680700720740760780800Blocking Voltage vs. TemperatureVoltage (V)1101001000C u r r e n t (A )0.0010.010.11Forward Safe Operating Bias(V =0V , DC Load)Manufacturing InformationMoisture SensitivityAll plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS IntegratedCircuits Division classified all of its plastic encapsulated devices for moisture sensitivity according tothe latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.DeviceCPC3960Z MSL 1ESD SensitivityThis product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow ProfileThis product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed.DeviceCPC3960Z260ºC for 30 secondsBoard WashIXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.For additional information please visit our website at: IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard T erms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.Specification: DS-CPC3960-R02©Copyright 2015, IXYS Integrated Circuits Division Mechanical DimensionsCPC3960ZCPC3960ZTR Tape & ReelDimensions mm MIN / mm MAX (inches MIN / inches MAX)1.901.90PCB Land PatternDimensionsmm (inches)。

ETERNUS详细产品介绍

F6497C
Model 2200
60年代至今
1995年
1998年
2000年
2003年
2006年
2008年
未来更多创新技术
F1710/F6491
ETERNUS GR840
ETERNUS 6000 ETERNUS 3000
ETERNUS 8000 ETERNUS 4000
磁盘阵列系统产品线
Enterprise storage systems
High Reliability High Performance Connectivity Storage Management
Tape Libraries
RAID Systems
Software
ETERNUS LT Tape Libraries
ETERNUS8000 ETERNUS4000 ETERNUS DX60/80
中端存储系统
INTERNAL USE ONLY
多控制器架构带来高性能
高性能控制器带来出色的 IOPS
CPU：采用高性能的四核处理器，较前代产品IOPS提升1.3倍，吞吐量提升1.2倍。缓存：采用FB-DIMM，内存带库提高3 .3倍。 8GB主机接口：率先在业界提供8Gbps FC接口，传输速率翻倍。
模块化结构
模块化架构合并了先进的控制器模块(CM)、通道适配器(CA)和设备适配器(DA)，大大提高数据传输性能。通过专用高速PCI-E总线相互连接控制器模块，带来很好的冗余性和高性能。
CA
Module configuration
CA
CA
CA
CM
CPU
■
■
CM
CPU

SiMax V40 专业视频监控管理平台

全新的即时回放
当发生紧急情况而相应视频通道又没有做录像设置时，用户可以回放最近十分钟的录像。回放支持时间轴拖拽，轻松实现快进快退，同时，当然也支持另存为文件留档。
增强的时间切片和检索
SiMax 的时间切片功能确保录像视频可以通过切片快照来进行快速检索。
触摸型 PTZ 驱动
用鼠标点击图像任何位置，相机将自动转向所需方向，摄像机也可以自动调节转速判断新位置之间的距离和中心位置的图像。(需要 PTZ 摄像机支持)
在电视墙界面中，可以选择建立一个虚拟的电视墙用于同类型的监视需求，使用鼠标拖拽视频通道至解码单元组成的电视墙。虚拟电视墙界面与真正的电视墙同步显示图像。电视墙布局管理人性化，图形的大小和位置监控可以根据实际需要的真实电视墙布局来调整。
SiMax V4.0兼容到以下UTCFS产品: 集成KTD-405键盘用于电视墙视频切换。集成FCWnx7.6通过API，当接收到来自FCWnx的报警后可触发弹出窗口和电视墙显示。集成最新的UTCFS拼接屏(LCD/LED)产品，当警报弹出，引发拼接屏自动拼屏播放相应通道视频。
系统弹性扩展
SiMax 视频监控管理平台采用分布式架构设计，具有优秀的可扩展性。客户可以根据需求，在不同地点部署多台服务器来实现系统快速部署。同时，还可以按需增加或减少服务器数量，实现系统的灵活扩展。
SiMax V4.0 专业视频监控管理平台
特色功能
多屏同步操作
一个客户端同时操作多个显示器，每个显示器实现不同功能，如监视视频轮巡、文件检索回放等。
SiMaxTM Line /Video Surveillance
产品概述
SiMax 视频监控管理平台秉承“开放兼容”的理念，紧跟安防 IP 化的趋势，提供基于 IP 网络、全面开放、灵活丰富的视频监控管理功能。

法国西电MICS中文操作说明书

中文使用说明书目录1.前言1.1安全事项1.2电源连接1.3电气连接（控制）1.4电池预检查和试运行1.5MICS Telys 第一次加电1.6欢迎界面1.7“纵览”界面2.工作模式2.1停机模式2.2编程模式2.3自动模式2.4测试模式3.休眠模式及自动断电3.1休眠模式3.2自动断电4．察看电气指标。

4.1电压4.2电流4.3频率和累计时间5.察看发动机参数6.显示LEDs及灯测试7.屏幕对比度8.显示警报和故障信息8.1屏幕信息8.2清除屏幕信息9.状态信息的显示10.进入一级菜单11“告警/故障”菜单11.1故障特性11.2告警特性11.3其他的特别情况12.“状态”菜单13.“输入”菜单14.“输出”菜单15.“对比度”菜单16.“保护”菜单16.1活动保护16.2通过CIC的保护16.3特别情况17.发电机组的操作17.1水加热器17.2发动机预热17.3油阀控制17.4启动马达控制17.5启动马达的脱离17.6转速和电压稳定17.7发电机组的输出17.8发动机冷机和关机18.ATS的操作18.1停机模式18.2自动模式18.3手动模式1、机油压力故障/停机（红灯亮）2、水温故障/停机（红灯亮）3、过载故障/停机（红灯亮）4、超速故障/停机（红灯亮）5、发电机组带载或准备带载（绿灯亮）6、充电电机报警停机（红灯亮）7、一般报警（黄灯闪烁）8、一般故障/停机（红灯闪烁）自动关闭之后重新开启按钮主菜单按钮确认按钮退出按钮浏览选择按钮及灰度调节数字键盘断开发电机组断路器闭合发电机组断路器电压显示按钮电流显示按钮频率及小时计按钮显示发动机参数按钮自动模式按钮（灯亮）测试模式按钮（灯亮）停止模式按钮（灯亮）手动模式按钮（灯亮）故障复位按钮灯光测试按钮（不包括ON按钮的灯）1.机油压力故障/停机（红灯亮）2.水温故障/停机（红灯亮）3.启动失败故障/停机（红灯亮）4.超速故障/停机（红灯亮）5.发电机组带载或准备带载（绿灯亮）6.充电发电机告警停机（红灯亮）7.综合告警（黄灯闪烁）8.综合故障/停机（红灯闪烁）四、1、前言1、1概述MICS Telys连接到不同交流电压源。

Prosonic M FMU40、FMU41、FMU42、FMU44 产品说明书

Products Solutions ServicesSafety Instructions Prosonic M FMU40, FMU41, FMU42, FMU444-20 mA HART, PROFIBUS PA,FOUNDATION FieldbusATEX, IECEx:Ex db [ia] IIC T6...T4 Ga/Gb Ex db [ia] IIC GbXA00176F-F/00/EN/14.22-00715579042022-06-20Prosonic M FMU40, FMU41, FMU42, FMU44XA00176F-F Prosonic M FMU40, FMU41, FMU42, FMU444-20 mA HART, PROFIBUS PA, FOUNDATION FieldbusTable of contentsAbout this document (4)Associated documentation (4)Supplementary documentation (4)Manufacturer's certificates (4)Manufacturer address (5)Other standards (5)Extended order code (5)Safety instructions: General (7)Safety instructions: Special conditions (8)Safety instructions: Installation (8)Safety instructions: Ex d joints (9)Temperature tables (9)Connection data (9)Endress+Hauser3XA00176F-F Prosonic M FMU40, FMU41, FMU42, FMU444Endress+HauserAbout thisdocumentThis document has been translated into several languages. Legally determined is solely the English source text.The document translated into EU languages is available:•In the download area of the Endress+Hauser website: -> Downloads -> Manuals and Datasheets ->Type: Ex Safety Instruction (XA) -> Text Search: …•In the Device Viewer: -> Product tools ->Access device specific information -> Check device features If not yet available, the document can be ordered.Associated documentationThis document is an integral part of the following Operating Instructions:HART:BA00237F/00PROFIBUS PA:BA00238F/00FOUNDATION Fieldbus:BA00239F/00Supplementary documentationExplosion-protection brochure: CP00021Z/11The Explosion-protection brochure is available:•In the download area of the Endress+Hauser website: -> Downloads -> Brochures and Catalogs -> Text Search: CP00021Z •On the CD for devices with CD-based documentation Manufacturer's certificatesEU Declaration of Conformity Declaration Number:EG02007The EU Declaration of Conformity is available:In the download area of the Endress+Hauser website: -> Downloads -> Declaration -> Type: EU Declaration -> Product Code: ...EU type-examination certificate Certificate number:KEMA 02ATEX1006 XProsonic M FMU40, FMU41, FMU42, FMU44XA00176F-F Endress+Hauser 5List of applied standards: See EU Declaration of Conformity.IEC Declaration of Conformity Certificate number:IECEx DEK 11.0014X Affixing the certificate number certifies conformity with the following standards (depending on the device version):•IEC 60079-0 : 2017•IEC 60079-1 : 2014•IEC 60529 : 2013Manufacturer addressEndress+Hauser SE+Co. KG Hauptstraße 179689 Maulburg, Germany Address of the manufacturing plant: See nameplate.Other standardsAmong other things, the following standards shall be observed in their current version for proper installation:•IEC/EN 60079-14: "Explosive atmospheres - Part 14: Electrical installations design, selection and erection"•EN 1127-1: "Explosive atmospheres - Explosion prevention and protection - Part 1: Basic concepts and methodology"Extended order codeThe extended order code is indicated on the nameplate, which is affixed to the device in such a way that it is clearly visible. Additional information about the nameplate is provided in the associated Operating Instructions.Structure of the extended order code FMU4x –*************+A*B*C*D*E*F*G*..(Device type)(Basic specifications)(Optional specifications)* =Placeholder At this position, an option (number or letter) selected from the specification is displayed instead of the placeholders.XA00176F-F Prosonic M FMU40, FMU41, FMU42, FMU446Endress+HauserBasic specifications The features that are absolutely essential for the device (mandatory features) are specified in the basic specifications. The number of positions depends on the number of features available.The selected option of a feature can consist of several positions.Optional specifications The optional specifications describe additional features for the device (optional features). The number of positions depends on the number of features available. The features have a 2-digit structure to aid identification (e.g. JA). The first digit (ID) stands for the feature group and consists of a number or a letter (e.g. J = Test, Certificate). The second digit constitutes the value that stands for the feature within the group (e.g. A = 3.1 material (wetted parts), inspection certificate).More detailed information about the device is provided in the following tables. These tables describe the individual positions and IDs in the extended order code which are relevant to hazardous locations.Extended order code: Prosonic M The following specifications reproduce an extract from the product structure and are used to assign:•This documentation to the device (using the extended order code on the nameplate).•The device options cited in the document.Device type FMU40, FMU41, FMU42, FMU44Basic specificationsProsonic M FMU40, FMU41, FMU42, FMU44XA00176F-F Endress+Hauser 7Optional specifications No options specific to hazardous locations are available.Safety instructions:General•The device is intended to be used in explosive atmospheres as defined in the scope of IEC 60079-0 or equivalent national standards. If no potentially explosive atmospheres are present or if additional protective measures have been taken: The device may be operated according to the manufacturer's specifications.•Staff must meet the following conditions for mounting, electrical installation, commissioning and maintenance of the device:•Be suitably qualified for their role and the tasks they perform •Be trained in explosion protection •Be familiar with national regulations •Install the device according to the manufacturer's instructions and national regulations.•Avoid electrostatic charging:•Of plastic surfaces (e.g. enclosure, sensor element, special varnishing, attached additional plates, ..)•Of isolated capacities (e.g. isolated metallic plates)•Refer to the temperature tables for the relationship between the permitted ambient temperature for the electronics enclosure,depending on the range of application and the temperature class.XA00176F-F Prosonic M FMU40, FMU41, FMU42, FMU448Endress+HauserSafety instructions:Special conditionsPermitted ambient temperature range at the electronics enclosure:–40 °C ≤ T a ≤ +60 °C •Observe the information in the temperature tables.•To avoid electrostatic charging: Do not rub surfaces with a dry cloth.•In the event of additional or alternative special varnishing on the enclosure or other metal parts or for adhesive plates:•Observe the danger of electrostatic charging and discharge.•Do not install in the vicinity of processes (≤ 0.5 m) generating strong electrostatic charges.Device type FMU42, FMU44Avoid electrostatic charging of the sensor (e.g. do not rub dry and install outside the filling flow).Safety instructions:Installation1A Zone 11Tank, hazardous area Zone 02Electronic insert 3Enclosure 4Connection compartment (Ex db)5Power supply 6Tank, hazardous area Zone 17Local potential equalizationProsonic M FMU40, FMU41, FMU42, FMU44XA00176F-F Endress+Hauser 9•In potentially explosive atmospheres:•Do not disconnect the electrical connection of the power supply circuit when energized.•Do not open the connection compartment cover when energized.•Only use certified cable entries suitable for the application. Observe national regulations and standards.•When operating the transmitter enclosure at an ambient temperature under –20 °C, use appropriate cables and cable entries permitted for this application.•Continuous service temperature of the connecting cable: ≥ T a +5 K.•When connecting through a conduit entry approved for this purpose,mount the associated sealing unit directly at the enclosure.•Seal unused entry glands with approved Ex db sealing plugs.•Option:•Remote display, e.g. FHX40 (Observe Safety Instructions)•Service interface: Commubox with associated ToF cable (Observe Safety Instructions)Potential equalization Integrate the device into the local potential equalization.Safety instructions: Ex d joints•If required or if in doubt: ask manufacturer for specifications.•Flameproof joints are not intended to be repaired.Temperature tablesZone 1 - Application Observe the permitted temperature range.Connection dataConnection compartment Ex dbXA00176F-F Prosonic M FMU40, FMU41, FMU42, FMU4410Endress+Hauser Option Remote display, e.g. FHX40:Power supply and signal circuit with protection type: intrinsic safety Ex ia IIC, Ex ia IIB.Connecting the Commubox service interface with the associated ToF cable*71557904*71557904。

Eaton Series NRX 电路保护设备说明说明书

• Standard safety interlock accessories and covers provide additional protection during maintenance.
SEAMLESS.
Seamless integration to enable faster installation and commissioning
• Full range of trip units and a variety of accessories, designed for quick and easy installation. You can efficiently design your system with the reduced size of the Series NRX NF/RF frame and variety of available connection options.
Series NRX® with Power Xpert® Release trip units
Eaton 1000 Eaton Boulevard Cleveland, OH 44122 United States
© 2016 Eaton All Rights Reserved Printed in USA Publication No. BR013001EN October 2016
• Maximize trip unit capability with expanded functionality via Power Xpert Protection Manager (PXPM).
• Reduce ordering complexity and increase application flexibility through Eaton’s three position ground fault settings available in each trip unit.

IPAM-4050 数字量非隔离输入输出模块用户手册

5. 免责声明............................................................................................................ 24
产品用户手册
Quanzhou Jinjiang Airport Electronic Intelligent Technology Co.,Ltd
4. IPAM-4050 命令简析.......................................................................................... 18
4.1 MODBUS 协议命令........................................................................................................ 18 4.2 Custom-ASCII 协议命令解析......................................................................................... 19 4.3 Custom-ASCII 协议结构................................................................................................. 19 4.3.1 协议命令集.......................................................................................................... 19 4.3.2 公共命令集.......................................................................................................... 19 4.3.3 数字量输入输出模块命令集.............................................................................. 22

M-System 远程 I O R5 系列通信模块规格书说明书

远程 I/O R5 系列通信模块机型: R5－NM1①　①在下列代码中选择。

（例如: R5－NM1/Q）・特殊规格 (例如: /C01)①附加代码◆特殊规格未填写：无特殊规格/Q：特殊规格（请从特殊规格之项另行选择）/C01: 硅涂层/C02: 聚氨酯涂层/C03: 橡胶涂层　可从本公司的网站下载组态软件。

　将本产品连接到电脑时，需要专用的连接电缆线。

所需专　用电缆线的型号请参照本公司网站的下载网站或组态软件　的使用说明书。

　注）此软件的运作状况是在日文版与英文版OS上确认的。

・Modbus: 连接器型欧式端子盘　(适用电缆线: 0.2～2.5mm2、露线长度为7mm)・内部通信总线: 连接到底座（机型: R5－BS）上・内部电源: 由底座（机型: R5－BS）提供隔离: Modbus－内部通信总线・内部电源间RUN显示灯: 红/绿2色LED通信正常时亮绿色灯；接收数据时亮红色灯(用DIP开关进行切换)ERR显示灯: 红/绿2色LED通信异常时绿色灯亮灯/闪烁；发送数据时，亮红色灯(用DIP开关进行切换)数据占有区设定: 用侧面的DIP开关设定占有区1或占有区2传输距离: 500m以下传输电缆线: 双绞屏蔽线 (CPEV-0.9 ø)通信设定: 用侧面的DIP开关设定・数据: RTU (二进制)、ASCII・奇偶校验: 无奇偶校验、偶数校验、奇数校验・传输速度: 4800、9600、19.2k、38.4k (bps)节点地址设定: 01～F7 (用DIP开关设定)使用湿度范围: 30～90%RH (无冷凝)使用大气条件: 无腐蚀性气体和严重尘埃安装: 安装在底座 (机型: R5－BS) 上重量: 约100g隔离强度: Modbus－内部通信总线・内部电源间2000V AC　1分钟电磁兼容指令（EMC指令）　EMI EN 61000-6-4　EMS EN 61000-6-2RoHS指令■左视图■数据和控制功能代码名称01Read Coil Status ○Digital output from the slave （read ⁄write ）02Read Input Status○Status of digital inputs to the slave （read only ）03Read Holding Registers ○General purpose register within the slave （read ⁄write ）04Read Input Registers ○Collected data from the eld by the slave （read only ）05Force Single Coil○Digital output from the slave （read ⁄write ）06Preset Single Register ○General purpose register within the slave （read ⁄write ）07Read Exception Status 08Diagnostics ○09Program 48410Poll 48411Fetch Comm. Event Counter Fetch a status word and an event counter12Fetch Comm. Event Log A status word, an event counter, a message count and a eld of event bytes13Program Controller 14Poll Controller15Force Multiple Coils○Digital output from the slave （read ⁄write ）16Preset Multiple Registers ○General purpose register within the slave （read ⁄write ）17Report Slave ID Slave type ⁄‘RUN ’status18Program 884⁄M8419Reset Comm. Link20Read General Reference 21Write General Reference 22Mask Write 4X Register 23Read ⁄Write 4X Registers 24Read FIFO Queue■例外代码代码名称01Illegal Function○Function code is not allowable for the slave02Illegal Data Address○Address is not available within the slave03Illegal Data Value○Data is not valid for the function04Slave Device Failure05Acknowledge06Slave Device Busy07Negative Acknowledge08Memory Parity Error■诊断代码代码名称00Return Query Data○Loop back test01Restart Comm. Option○Reset the slave and clear all counters02Return Diagnostic Register○Contents of the diagnostic data（2 bytes）03Change ASCII Input Delimiter○Delimiter character of ASCII message04Force Listen Only Mode○Force the slave into Listen Only Mode数据占有区“1”时，所有的输入输出模块的输入输出数据为1个字。

UDM40HSXSXR4LTX中文资料

•Multi-input modular instrument 4dgt LED •0.1% RDG basic accuracy•TRMS AC current and voltage measurements•AC/DC current measurements; selectable full scales (200µA to 5A)•AC/DC voltage measurements; selectable full scales (200mV to 500V)•°C or °F temperature measurements(Pt100-250-500-1000, Ni100, TC J-K-S-T -E)•Resistance measurements; selectable full scales (20Ωto 20k Ω)•Up to 4 independent alarm set-points (optional)•20mA/10VDC analog output (optional)•Serial port RS485 or RS232 (optional) •MODBUS, JBUS communication protocol •Front protection degree:IP67, NEMA4x•LED display, selectable colour (red, amber, green)Product Descriptionµp-based digital panel meter, 4-dgt LED indicator,for current, voltage, temper-ature and resistance mea-surements. Measuring ranges and functions easily programmable from the key-pad or from the PC bymeans of optional UdmSoft software. UDM 40includes storage min-max functions and double level protection password. Housing for panel mounting with front protec-tion degree: IP67, NEMA4x.Digital Panel MetersModular Indicator and Controller Type UDM40Type SelectionSlot A (measuring inputs)LSX:signal inputs:0.2-2-20mA DC/AC;0.2-2-20V DC/ACLSE/LSF:signal inputs: + AUX:0.2-2-20mA DC/AC;0.2-2-20V DC/ACHSX:signal inputs:0.2-2-5A DC/AC; 20-200-500V DC/ACTRX:signal inputs: TC tem-perature probes (J-K-S-T-E, Pt100-250-500-1000) and resistance (0.02-0.2-2-20k Ω)Slot B (communication)XX:NoneSX:Serial port RS485SY:Serial port RS232AV(*):Single analogue output, 0to 20mA DC and 0to 10V DC Slot C (communication and alarm)XX:NoneR1:Single relay output,(AC1-8AAC, 250VAC)R2:Dual relay output,(AC1-8AAC, 250VAC)R4:Dual relay output, (AC1-8AAC, 250VAC) +dualopen collector output (NPN, 100mA)R5:4relay outputs(AC1-5AAC, 250VAC)AV(*):Single analogue output,0to 20mA DC and 0to 10V DCSlot D (power supply)H:90 to 260V AC/DC L:18to 60V AC/DCOptions XX:NoneTX:TropicalizationInput Specifications•The alarm status can be coupled to the different colour of the display•Linearization of V and A inputs up to 16 pointsHow to orderUdmSoft-kitUdmSoft-kit: software plus “UCOM1” communication cable for programming UDM40 by means of PC .(*):The two analogue outputs cannot be used at the same time. It is possible to plug in only one module by instru-ment.Measurement accuracy , temp. drifts, max and min indicationsAll accuracies and min/max indications are referred to an ambient temp. range of 25°C ±5°C, rel. humidity ≤60% and scale ratio (electri-cal/displayed scale) equal to 1. The conversion into °F is obtained acting on the electrical/displayed scale ratio.*<45Hz >65Hz= ±(0.5%RDG+3DGT) 0% to 25% FS;±(0.5%RDG+2DGT) 25% to 110% FS.( )The min. indication for TRMS measurement (AC or DC) is 0; it is possible to modify the decimal point position.All accuracies and min/max indications refer to an ambient temperature range of 25°C ±5°C, relevant humidity ≤60% and scale ratio (elec-Input impedances and overloads(*) Maximum measuring current generated for resistance equal to 0UDM40Output specificationsUDM40Software functionsGeneral SpecificationsUDM40AC/DC voltage90 to 260V (standard)18 to 60V (on request)Energy consumption≤30VA/12W (90 to 260V)≤20VA/12W (18 to 60V)Supply SpecificationsAvailable modulesPossible module combinationsOnly for TRMS Measurements Instantaneous effective voltage (TRMS)å×=ni V nV 1211)(1å×=ni A n A 1211)(1Used calculation formulasInstantaneous effective current (TRMS)Insulation between inputs and outputsExcitation outputUDM40Wiring diagramsProcess signal wiring diagramsWirings for high-level signalsWiring diagrams of optional modulesBO R1: 1 relay outputBO R2: 2 relay outputs BO AV: analogue output (10V, 20mA DC)UDM40Wiring diagrams for temperature measurements Wiring diagrams (cont.)Wiring diagrams for power supplyBO R5: 4 relay outputsUDM40BO R4: dual relay output + dual open collector output: the load resistances (Rc) must be designed so that the close contact current is lower than 100mA; the VDC voltage must be lower than or equal to 30VDC.VDC: power supply outputVo+: positive output (open collector transistor).GND: ground collector (open collector transistor).BR SX: RS485 4-wire connection:additional devices provided with RS485 port (indicated as RS1,2,3...N) are connected in parallel. The termination of the serial port is carried out only on the last instrument of the network. The serial module is provided with a jumper for the termination of the RS485 network as shown in the figure above.Note:particular types of cables or plants may require an external termination. For the network connections use twisted cable type AWG26.RS1,2,3...NWiring diagrams of optional modules (cont.)VccUDM40 is programmable by PC by means of the UdmSoft software (available on request). The user can program all parameters of UDM40that will be subse-quently uploaded and set in the instrument by the RS485 network (BR SX).Should UDM40 be without the RS485 serial module, all programming parameters will be uploaded and set in the instrument by the RS232 auxiliary serial connec-tion (1) located on the side of the measuring input module using the special con-nection cable (2) available on request, as shown in the figures on the left. It is also possible to program the instrument using the dot connector (1) by means of the HyperTerminal Windows functions of a PC.Note:the RS232 auxiliary port IS NOT insulated from the measuring inputs. Ordering code of the cable (2): UCOM1Programming UDM40 by means of PCBO SY: RS232 directconnection to PC by means of COM port.RS232 has no termi-nalization.UDM40DimensionsFront panel description1.Key-padThe programming of the configuration parameters and the display may be easily controlled by means of the 4 function :to enter the programming phase and to confirm the Engineering UnitsSpecifications are subject to change without notice UDM40DS 04070611UDM40BP LPower supply:18 to 60V AC/DCBO R4Dual relay output +Dual open collectorBO R2Dual relay outputBO AVSingle analogueoutput 10V , 20mA DCBQ LSX, BQ LSE, BQ LSF , BQ HSX, BQ TRX Measuring inputs Input modulesSerial port modules BR SXRS485 Serial port BP HPower supply: 60 to 260V AC/DCModulesBO R1Single relay outputOutput modulesScale 1:1Power supply modulesOutput modulesBO R54relay outputsBR SYRS232 Serial port元器件交易网。

IMS-5WD-40中文资料

InductorsMiniature, ShieldedIMS-5WD-40Vishay Dale For technical questions contact magnetics@Document Number: 3405126Revision: 10-Aug-06ELECTRICAL SPECIFICATIONSInductance Tolerance: ± 10 % on Q-Meter for 0.10 µH to 22 µH ± 5 % on 1KC Bridge for 27 µH to 1000 µH± 10 % on 1KC Bridge for 1200 µH to 56 000 µH± 20 % on 1KC Bridge measured at point on leads 1/4"[6.35 mm] from body for 68 000 µH to 180 000 µH Dielectric Strength: 700 VRMS at sea level Operating Temperature: - 55 °C to + 125 °CSelf-Resonant Frequency: Minimum SRF measured with full length leads on Grid-Dip Meter Q: Measured on a Q-MeterMaximum Current: Based on temperature rise not to exceed 40 °C at + 85 °C ambient.FEATURES•Miniature shielded inductor •High inductance-to-size ratio•Inductance range is 0.10 µH to 180 000 µH•Encapsulated non-flammable shielded unit•0.164" [4.17 mm] diameter by 0.450" [11.43 mm] long envelope•Offers extremely high inductance for density packagingMECHANICAL SPECIFICATIONSTerminal Strength: Meets 5 pound pull testDENSITY SPECIFICATIONSWeight: 0.75 gram maximumShielding: Less than 3 % coupling with two units mounted side by side at 1000 cycles* Incremental Current:The DC current required to cause a 5 % reduction in the nominal inductance valueSTANDARD ELECTRICAL SPECIFICATIONSMODEL IND.(µH)TOL.Q MIN.TEST FREQ.Q (MHz)SELF-RESONANTFREQ. MIN.(MHz)DCR MAX.(Ohms)RATED DC CURRENT (mA)INCREMENTAL*CURRENT (mA)IMS-5W D-400.10± 10 %55254000.020********P H E N O L I CIMS-5W D-400.12± 10 %55254000.029********IMS-5W D-400.15± 10 %55254000.03230003000IMS-5W D-400.18± 10 %50253660.04028502850IMS-5W D-400.22± 10 %56253310.0452*******IMS-5W D-400.27± 10 %50252980.0820002000IMS-5W D-400.33± 10 %48252700.0919001900IMS-5W D-400.39± 10 %48252480.1614201420IMS-5W D-400.47± 10 %48252260.1714001400IMS-5W D-400.56± 10 %45252060.36960960IMS-5W D-400.68± 10 %45251880.37940940IMS-5W D-400.82± 10 %41251710.46870870IMS-5W D-40 1.0± 10 %427.91310.06223002300I R O N IMS-5W D-40 1.2± 10 %437.91200.06722002200IMS-5W D-40 1.5± 10 %417.91080.1614201420IMS-5W D-40 1.8± 10 %427.9990.1713701370IMS-5W D-40 2.2± 10 %427.9900.1913001300IMS-5W D-40 2.7± 10 %417.9860.2012701270IMS-5W D-403.3± 10 %407.9730.3110301030IMS-5WD-40Inductors, Miniature, ShieldedVishay DaleDocument Number: 34051For technical questions contact magnetics@Revision: 10-Aug-0627* Incremental Current: The DC current required to cause a 5 % reduction in the nominal inductance valueSTANDARD ELECTRICAL SPECIFICATIONSMODEL IND.(µH)TOL.Q MIN.TEST FREQ.Q (MHz)SELF-RESONANTFREQ. MIN.(MHz)DCR MAX.(Ohms)RATED DC CURRENT (mA)INCREMENTAL*CURRENT (mA)IMS-5W D-40 3.9± 10 %407.9680.3310001000I R O NIMS-5W D-40 4.7± 10 %407.9610.58750750IMS-5W D-40 5.6± 10 %407.9560.64710710IMS-5W D-40 6.8± 10 %407.9510.68680680IMS-5W D-408.2± 10 %45 2.546 1.3500500IMS-5W D-4010± 10 %46 2.542 1.4480480IMS-5W D-4012± 10 %47 2.538 1.5460460IMS-5W D-4015± 10 %47 2.534 1.7440440IMS-5W D-4018± 10 %45 2.5430.88610235F E R R I T E IMS-5W D-4022± 10 %47 2.5380.95590220IMS-5W D-4027± 10 %42 2.535 1.15530200IMS-5W D-4033± 10 %43 2.532 1.2520193IMS-5W D-4039± 10 %45 2.530 1.6450183IMS-5W D-4047± 10 %46 2.526 1.8420177IMS-5W D-4056± 10 %40 2.524 2.2390170IMS-5W D-4068± 10 %40 2.522 2.3375165IMS-5W D-4082± 10 %420.7914 2.4360160IMS-5W D-40100± 10 %630.7912 2.6345157IMS-5W D-40120± 10 %620.7911 2.9330145IMS-5W D-40150± 10 %630.7910 3.3315126IMS-5W D-40180± 10 %600.799.2 3.6300110IMS-5W D-40220± 10 %570.798.8 4.1280105IMS-5W D-40270± 10 %520.798.0 4.826091IMS-5W D-40330± 10 %500.797.2 5.624087IMS-5W D-40390± 10 %430.79 6.8 6.223072IMS-5W D-40470± 10 %660.79 6.410.018067IMS-5W D-40560± 10 %640.79 6.011.517065IMS-5W D-40680± 10 %710.79 5.212.016060IMS-5W D-40820± 10 %670.79 4.813.815055IMS-5W D-401000± 10 %620.25 4.516.014052IMS-5W D-401200± 10 %520.25 1.218.213550IMS-5W D-401500± 10 %510.25 1.223.711848IMS-5W D-401800± 10 %510.25 1.130.210542IMS-5W D-402200± 10 %500.25 1.033.79937IMS-5W D-402700± 10 %510.250.9443.18733IMS-5W D-403300± 10 %520.250.8448.78230IMS-5W D-403900± 10 %480.250.7762.77229IMS-5W D-404700± 10 %480.250.6770.56828IMS-5W D-405600± 10 %480.250.651045624MARKING- Model - Inductance value - Tolerance - Date codeORDERING INFORMATIONIMS-5WD-400.10 µH 10 %ER e2MODELINDUCTANCEVALUEINDUCT ANCE TOLERANCEPACKAGE CODEJEDEC LEAD (Pb)-FREEST ANDARDDocument Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

奔腾双核

奔腾双核Intel 奔腾双核E2140(散)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 1.6GHz外频200MHz倍频8倍总线类型FSB总线总线频率800MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心线程数双线程制作工艺65纳米核心类型AllendaleCPU架构Core热设计功耗65W(TDP)内核电压0.85-1.5V晶体管数量 1.05亿核心面积77平方毫米封装模式PLGACPU缓存一级缓存32KB二级缓存1MB技术参数指令集支持MMX/SSE/SSE2/SSE3/Sup-SSE3/EM64T集成显卡否超线程技术不支持虚拟化技术不支持64位处理器是Turbo Boost不支持技术SpeedStep技支持术可信执行技不支持术热监测技术支持其他参数工作温度73.3℃其它性能支持病毒防护技术数据来源：中关村在线报价中心() Intel 奔腾双核E2160(散)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾E CPU频率主频 1.8GHz外频200MHz倍频9倍总线频率800MHz CPU插槽插槽类型LGA 775 针脚数目775pin CPU内核核心数量双核心制作工艺65纳米核心类型Allendale CPU架构Core热设计功耗65W (TDP)内核电压0.85-1.5V 晶体管数量 1.05亿核心面积77平方毫米封装模式PLGA CPU缓存一级缓存128KB二级缓存1MB技术参数指令集MMX, SSE, SSE2, SSE3, Sup-SSE3, EM64T 内存控制器视主板芯片而超线程技术不支持虚拟化技术不支持其他参数其它性能支持病毒防护技术支持增强型英特尔SpeedStep 技术支持增强暂停状态（C1E功能）支持英特尔64技术其它特点工作温度：< 61.4℃数据来源：中关村在线报价中心()Intel 奔腾双核E2180(散)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频2GHz外频200MHz倍频10倍总线频率800MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心制作工艺65纳米核心类型AllendaleCPU架构Core热设计功耗(TDP)65W内核电压0.85-1.5V晶体管数量 1.05亿核心面积77平方毫米封装模式PLGACPU缓存一级缓存128KB二级缓存1MB技术参数指令集MMX, SSE, SSE2, SSE3, Sup-SSE3, EM64T 内存控制器视主板芯片而定超线程技术不支持虚拟化技术不支持其他参数其它性能支持vista操作系统支持病毒防护技术支持增强型英特尔SpeedStep 技术支持增强暂停状态（C1E功能）支持英特尔64技术其它特点工作温度：< 73.2℃数据来源：中关村在线报价中心() Intel 奔腾双核E2210(盒) 查看：更多信息或更多图片参数规格基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 2.2GHz外频200MHz倍频11倍总线频率800MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心制作工艺45纳米核心类型Wolfdale热设计功耗65W(TDP)CPU缓存二级缓存1MB数据来源：中关村在线报价中心()Intel 奔腾双核E2220(散)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 2.4GHz外频200MHz倍频12倍总线频率800MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心制作工艺65纳米热设计功耗65W(TDP)内核电压 1.25VV晶体管数量 1.05亿核心面积77平方毫米封装模式采用PLGA封装CPU缓存二级缓存1MB技术参数指令集支持MMX/SSE/SSE2/SSE3/Sup-SSE3/EM64T指令集虚拟化技术不支持其他参数其它性能支持病毒防护技术支持增强型英特尔Speedstep技术支持英特尔64位技术数据来源：中关村在线报价中心()Intel 奔腾双核E5200(散)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 2.5GHz外频200MHz倍频12.5倍总线类型FSB总线总线频率800MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心线程数双线程制作工艺45纳米核心类型WolfdaleCPU架构Core热设计功耗65W(TDP)内核电压0.85-1.3625V晶体管数量 2.28亿核心面积82平方毫米CPU缓存一级缓存64KB二级缓存2MB技术参数指令集MMX, SSE, SSE2, SSE3, SSSE3, EM64T内存控制器视主板芯片而定集成显卡否超线程技术不支持虚拟化技术不支持64位处理器是Turbo Boost不支持技术SpeedStep技支持术可信执行技不支持术热监测技术支持其他参数工作温度74.1℃其它性能支持病毒防护技术数据来源：中关村在线报价中心()Intel 奔腾双核E5300(散)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 2.6GHz外频200MHz倍频13倍总线类型FSB总线总线频率800MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心线程数双线程制作工艺45纳米核心类型WolfdaleCPU架构Core热设计功耗65W(TDP)内核电压0.85-1.3625V晶体管数量 2.28亿核心面积82平方毫米CPU缓存一级缓存64KB二级缓存2MB技术参数指令集MMX, SSE, SSE2, SSE3, SSSE3, EM64T内存控制器视主板芯片而定集成显卡否超线程技术不支持虚拟化技术Intel VT64位处理器是Turbo Boost不支持技术SpeedStep技支持术可信执行技不支持术热监测技术支持其他参数工作温度74.1℃其它性能支持病毒防护技术数据来源：中关村在线报价中心() Intel 奔腾双核E5400(盒)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 2.7GHz外频200MHz倍频13.5倍总线类型FSB总线总线频率800MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心线程数双线程制作工艺45纳米核心类型Wolfdale热设计功耗65W(TDP)内核电压0.85–1.3625V晶体管数量 2.28亿核心面积82平方毫米CPU缓存一级缓存64KB二级缓存2MB技术参数指令集MMX，SSE，SSE2，SSE3，SSSE3，EM64T内存控制器视主板芯片而定集成显卡否超线程技术不支持虚拟化技术Intel VT64位处理器是Turbo Boost不支持技术SpeedStep技支持术可信执行技不支持术热监测技术支持其他参数工作温度74.1℃其它性能支持病毒防护技术数据来源：中关村在线报价中心() Intel 奔腾双核E5700（盒）参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频3GHz外频200MHz倍频15倍总线类型FSB总线总线频率800MHzCPU内核制作工艺45纳米核心类型Wolfdale内核电压 1.2VCPU缓存一级缓存2×64K二级缓存2M技术参数64位处理器是其他参数其它特点三年保修数据来源：中关村在线报价中心()Intel 奔腾双核E6300（盒）参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 2.8GHz外频266MHz倍频10.5倍总线类型FSB总线总线频率1066MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心线程数双线程制作工艺45纳米核心类型WolfdaleCPU架构Core热设计功耗65W(TDP)内核电压0.85-1.3625V晶体管数量 2.28亿核心面积82平方毫米CPU缓存一级缓存64KB二级缓存2MB技术参数指令集MMX, SSE, SSE2, SSE3, SSSE3, EM64T 集成显卡否超线程技术不支持虚拟化技术Intel VT64位处理器是Turbo Boost不支持技术SpeedStep技支持术可信执行技不支持术热监测技术支持其他参数工作温度74.1℃其它性能支持病毒防护技术数据来源：中关村在线报价中心()Intel 奔腾双核E6500(盒)参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 2.93GHz总线类型FSB总线总线频率1066MHzCPU插槽插槽类型LGA 775针脚数目775pinCPU内核核心数量双核心线程数双线程制作工艺45纳米核心类型WolfdaleCPU架构Core热设计功耗65W(TDP)内核电压0.85-1.3625V晶体管数量 2.28亿核心面积82平方毫米CPU缓存一级缓存64KB二级缓存2MB技术参数指令集MMX,SSE,SSE2,SSE3,SSSE3,EM64T集成显卡否超线程技术不支持虚拟化技术Intel VT64位处理器是Turbo Boost不支持技术SpeedStep技支持术可信执行技不支持术热监测技术支持其他参数工作温度74.1℃其它性能支持病毒防护技术数据来源：中关村在线报价中心()Intel 奔腾双核E6800参数规格查看：更多信息或更多图片基本参数适用类型台式机生产厂商IntelCPU系列奔腾ECPU频率主频 3.33GHz外频266MHz倍频12.5倍总线频率1066MHzCPU插槽插槽类型LGA 775CPU内核核心数量双核心制作工艺45纳米核心类型Wolfdale热设计功耗65W(TDP)CPU缓存一级缓存2×64K二级缓存2M数据来源：中关村在线报价中心()。

Cyrus Plus 技术参考手册说明书

CYRUS PLUS MOTHERBOARD TECHNICAL REFERENCE MANUAL VERSION 1.1.1 AMIGAONE X50001CONTENTS1Contents (2)2Introduction (7)2.1Technical Support (7)2.2Abbreviations (7)3Architecture (8)3.1CPU (8)3.1.1P3041 (8)3.1.2P5020 (9)3.1.3P5040 (9)3.2Main Memory (9)3.3Ethernet Phy (9)3.4Xena (9)3.5CPLD (9)3.6Boot SD Card (10)3.7BIOS (10)4CPU (11)4.1SerDes Lanes (11)4.2UARTS (11)4.3GPIOs (12)4.4External Interrupts (12)4.5I2C Controller (12)4.6Serial Terminal (13)5DDR3 DIMMs (14)5.1Size (14)5.2Speed (14)5.3Serial Presence Detect (14)6XMOS Subsystem (15)6.1Block Diagram (16)6.2XENA Connetors (17)6.3XMOS Device Type and Clocking (17)6.4Bootstrapping and Debug (17)6.5CPU COMMS (18)6.6Xorro Slot (19)6.7LEDs (19)6.8Spare Port Line (19)6.9PCU (19)6.10Haze Xorro Header (19)7CPLD (20)7.1CPU COMMS (20)7.1.1CPLD XMOS DEBUG Register (21)7.1.2CPLD XMOS JTAG register (21)7.1.3CPLD PCIe register (21)7.1.4CPLD Build Format (21)8MCU (22)8.1Supervisor Interface (22)8.1.1Power Button (22)8.1.2Shut Power Down (22)8.1.3Temperatures Readings (22)8.1.4Voltages (23)8.1.5CPU Fan Speed (24)8.2Debug Serial Terminal (24)9Boot (26)9.1Micro SD card (26)9.2U-Boot (26)10CONNECTOR, JUMPER AND LEDS (27)10.1Switches (27)10.2Jumpers (27)10.3LEDs (28)10.4PCIe and PCI Slots (29)10.5Xena Connectors (33)10.6Programming Headers (36)10.6.1CPLD (36)10.6.2MCU (36)Figure 1: Cyrus Plus Block Diagram (8)Figure 2: XMOS Subsystem Block Diagram (16)Figure 3: XENA connector positions (17)Figure 4: MCU Debug header (24)Figure 5: Front Panel LED and switches (27)Figure 6: Cyrus Jumpers (27)Figure 7: Cyrus Plus LEDs (28)Figure 8: PCIe and PCI slots (29)Figure 9: Programming Headers (36)Table 1: Ethernet link speed (9)Table 2: CPU SerDes Lane Assignments (11)Table 3: CPU GPIOs (12)Table 4: CPU External interrupts (12)Table 5: I2C CPU List (13)Table 6: SIMM SPD Addresses (14)Table 7: XMOS CPLD pin connections (18)Table 8: XMOS CPLD memory map (18)Table 9: Haze Xorro pinout (19)Table 10: CPLD Local bus memory map (20)Table 11: CPLD register XMOS Debug pin map (21)Table 12: CPLD register XMOS JTAG pin map (21)Table 13: CPLD register PCIe signals map (21)Table 14: MCU serial pinout (24)Table 15: SD boot loader blocks (26)Table 16: U-Boot critical settings (26)Table 17: U-Boot Amiga OS boot setting (26)Table 18: Jumpers (27)Table 19: LEDs (28)Table 20: PCIe x16 Slots Pinout (30)Table 21: PCIe x4 Slots Pinout (31)Table 22: PCIe x1 Slots Pinout (31)Table 23: PCI Slots Pinout (32)Table 24: Xorro Slot Pinout - A row (33)Table 25: Xorro Slot Pinout - B row (34)Table 26: Xorro Slot Signal Descriptions (35)Table 27: XTAG Connector Pinout (35)Table 28: CPLD JTAG Header (36)Table 29: MCU Programming Header (36)The Cyrus Plus motherboard combines a high performance Freescale QorIQ CPU with powerful and flexible I/O features to deliver the ultimate desktop platform for AmigaOS users.This manual contains hardware and software reference information to assist with installation, configuration and low level programming of Cyrus Plus.2.1TECHNICAL SUPPORTFor technical support, please contact your reseller.2.2ABBREVIATIONSCyrus Plus’s architecture is shown in Figure 1 below:Figure 1: Cyrus Plus Block Diagram3.1CPUThe CPU on Cyrus Plus is a Freescale QorIQ Power Architecture P series processor. There are 3 options of CPU, these are the P3041, P5020 and P5040.This CPU combines four 1.5 GHz 32-bit e500mc core with a 128KB L2 cache, a single DDR3 memory controller (1333MT/s) and 18 SerDes channels.The Power Architecture e500mc cores adhere to most of the Power ISA v2.06 for more information on thee500mc check the Freescale website.This CPU combines two 2 GHz 64-bit e5500 core with a 512KB L2 cache, dual DDR3 memory controller (1333MT/s) and 18 SerDes channels.The Power Architecture e5500 cores adhere to most of the Power ISA v2.06 for more information on thee5500 check the Freescale website.This CPU combines four 2.2 GHz 64-bit e5500 core with a 512KB L2 cache, dual DDR3 memory controller (1600MT/s) and 20 SerDes channels.The Power Architecture e5500 cores adhere to most of the Power ISA v2.06 for more information on thee5500 check the Freescale website.3.2MAIN MEMORYThe P5020 and P5040 variants have two memory controllers, the P3041 variant has one memory controller. Each CPU memory controller is connected to a standard DDR3 DIMM slot.For further details, see section 5.3.3ETHERNET PHYThe two Micrel KSZ9021RN Gigabit Ethernet PHYs use the RGMII protocol.The PHYs adaptors use two LEDs to indicate the link speed connection as shown in Table 1. The on LED blinks when there is activity on the port.Table 1: Ethernet link speed3.4XENAAn XMOS XS1-L16A-128 “Software Defined Silicon” (SDS) device is provided to support simple, high performance I/O.3.5CPLDThe CPLD provides glue logic and control registers. It also provides a fast mailbox and data interface between the CPU and the XENA device.For further details on the CPLD, see section 7.1 and for the XENA see section 6.5.3.6BOOT SD CARDThe Cyrus Plus motherboard is booted from a micro SD card. This needs to be fitted in P29 for the Cyrus Plus motherboard to boot with a valid BIOS in the first 1258 blocks. For more information see section 9.3.7BIOSA micro SD card provided will hold BIOS code.The BIOS code is maintained by Hyperion.4This section provides programmer visible details of CPU hardware implementation.4.1SERDES LANESThe SerDes lanes are connected as shown in Table 2 below:Table 2: CPU SerDes Lane AssignmentsNotes:Lane 18-19 are only available on the P5040.Unused ports are left un-connected.4.2UARTSThe CPU provides two UARTs, one for external RS232 communication and one for MCU supervisor interface.The UART 0 signals are available on a DB9 connector, P16. This is a 5 wire RS232 interface with RTS and CTS, U-Boot does not used hardware flow control.UART 1 is connected to the MCU to get temperature and voltage readings. For further details on the supervisor interface see section 8.1.4.3GPIOSThe CPU provides 32 general purpose I/Os (GPIOs) and 14 are used. For details of how these are wired, see Table 3 below.Table 3: CPU GPIOsNotes:A ‘#’ suffix denotes an active-low signal.4.4EXTERNAL INTERRUPTSTable 4: CPU External interrupts4.5I2C CONTROLLERThe CPU has 4 I2C controllers the use of each controller is shown below in Table 5.Table 5: I2C CPU List4.6SERIAL TERMINALFor serial communications, on a PC it is recommended to use TeraTerm. The serial port control must be configured as follows:▪ 115200 Baud▪ 8 bit data▪ No Parity▪ 1 Stop bit▪ No Flow ControlCyrus Plus uses standard 1.5V DDR3 DIMMs, 1 socket for P3041 and 2 sockets for P5020/P5040.The board has been qualified with unbuffered non-ECC DIMMs. For the latest information on recommended DIMM module types, please contact your reseller.It is recommended to use DIMMs in matched pairs.5.1SIZEThe total physical maximum size of memory that the memory controllers can address is 64GB, however the practical memory size limit will depend on software.5.2SPEEDThe maximum speed supported by the memory controllers is DDR3-1333 for the P3041 and P5020 variants and DDR3-1600 for the P5040 variant. Faster memory may be fitted but this speed limit will apply.5.3SERIAL PRESENCE DETECTThe Serial Presence Detect (SPD) addresses of the 2 DIMM sockets is are as follows:Table 6: SIMM SPD AddressesCyrus Plus includes direct support for XMOS “SDS” (Software Defined Silicon) technology. A dedicated XMOS device, designated “Xena” here, is provided on-board.Xena is connected to both the main CPU and a custom expansion slot (“Xorro”), which is mechanically aligned with a conventional PCI Express x1 slot.Xorro expansion cards may be enhanced by adding connectivity to the PCI Express bus. Alternatively, if the Xorro slot is not required, the PCI Express slot connector can be used for conventional PCI Express x1 add-in cards.This section provides essential details of Cyrus Plus’s XMOS subsystem, and should be read in conjunction with relevant XMOS documentation.6.1BLOCK DIAGRAMFigure 2 shows how Xena is connected to the main processor, the CPLD, the XTAG debug header and the Xorro slot.Figure 2: XMOS Subsystem Block Diagram6.2 XENA CONNECTORSThe XENA connectors are displayed below in Figure 3.Figure 3: XENA connector positions6.3 XMOS DEVICE TYPE AND CLOCKINGXena is a 500MHz, dual-core XS1-L16A (formerly XS1-L2), in a 124-pin QFN package. It is clocked from a 25MHz oscillator, and its PLL is configured for x20 operation i.e. a core clock speed of 500MHz.6.4BOOTSTRAPPING AND DEBUGBootstrapping and debug of Xena is accomplished via its reset, JTAG and debug signals. These are connected to the CPLD, and may be controlled and sampled via the CPU local bus registers that are implemented within it. For details of these, see section 7.Normally, software running on the main CPU will only see the Xena chip on this interface. If a Xorro card isfitted in the slot, and this asserts the slot PRESENT# signal, the CPLD will route the JTAG chain through the Xorro card, so that any devices on it will appear before Xena (Xorro’s TDO connects to Xena’s TDI).Xena’s control and debug signals are also connected to a header to allow the use of an XMOS XTAG debugger.If one is connected, the CPLD will float most of its pins, allowing the XTAG to take over. It will, however, still provide automatic routing of the TDI/TDO signal chain through a Xorro card, if required, so that the XTAG cancontrol both Xena and Xorro together.Haze Xorro connectorXTAG headerXorroslotXMOS LEDsJP5SPI XMOS EnableThe addition for Cyrus Plus is for an SPI option to boot for the Xena. The SPI device can be programmed via the CPU when PROG_XSPI (GPIO28) is driven low. This allows for the Xena to be booted at startup without any need for JTAG programming.6.5CPU COMMSAs shown in Figure 2, a number of ports from Xcore 1 are connected to the CPU via the CPLD via a mailbox interface with a shared dual port RAM. An interrupt is generated when the CPU has written data to the RAM for the Xena to read data.Table 7: XMOS CPLD pin connectionsThe intention is that a thread on Xcore 1 should be programmed for the mailbox protocol using the pin assignment in Table 7. The protocol uses indirect addressing in that the address of the area of the memory to be accessed is first written to the index register (using DI low to select the index register), then reading or writing the data with DI driven high. Note that the index register will auto increment when reading or writing to the RAM. When finished writing data to RAM the code should write to the MBX2C register to generate an interrupt to the CPU. Example code for this will be provided.The CPU communications to the Xena is similar to the CPLD to Xena, but the index or data registers are directly memory mapped. The index address is 0x0 and the data address is 0x8000. For example to read the SIG1 value, from the CPU you write 0x0 at address 0x0 and then read the data in 0x8000.The memory map for Xena to the CPLD is shown below in Table 8.Table 8: XMOS CPLD memory map6.6XORRO SLOTThe Xorro slot connector is physically a PCI Express x8 (98 pin) card edge connector. Xorro cards are not compatible with PCI Express x8 cards.The pinout of the Xorro slot connector is provided in section 10.5, together with signal descriptions.6.7LEDSA pair of simple LEDs is provided for diagnostic purposes. These are connected to Xcore 0 (port P1K) and Xcore1 (port P1E), and are illuminated when driven low.6.8SPARE PORT LINEThe spare port line (Xcore 0 port P1L) is connected to the CPLD. Its use is reserved and it should be tri-stated.6.9PCUXena’s PCU (Power Control Uni t) is not used.6.10HAZE XORRO HEADERThere is an additional header to the Xena to allow for direct connection between the Xena and CPU via the serial port. The pin out of the Haze Xorro connector, H7 is shown in Table 9.Table 9: Haze Xorro pinoutWarning: When using the Haze Xorro header make sure that you have configured the Xena IOs so that it is not driving outputs onto the CPU output signals.7The CPLD is connect to the CPU via the local bus and allows for the high speed interface between the CPU and the XMOS. There are other read only registers which include the CPU fan speed.7.1CPU COMMSThe interface for the CPU to the CPLD is similar to the XMOS mail box, the address of the register to be accessed should first be written to the index register at address (0x0). The data can then be read and written using the data address (0x8000). For example to check the speed of the CPU fan TACHO you would write 0x10 into address 0x0, then read data from address 0x8000.For more details on the Xena link protocol referrer to section 6.5.The memory map for the CPU to the CPLD is shown below in Table 10.Table 10: CPLD Local bus memory mapNotes:1.The FAN_TACHO signal should be read multiple times to get rid of metastability.2.VID values are relevant to P5040 boards only.Table 11: CPLD register XMOS Debug pin mapTable 12: CPLD register XMOS JTAG pin mapTable 13: CPLD register PCIe signals mapThe format of the CPLD build time and date are stored in a 32-bit value using BCD, on for build date and one for build time. The date is store as YYYYMMDD and the time is store as 00HHMMSS.8The MCU is a supervisor for the Cyrus Plus motherboard and provides voltage and temperature monitoring for the CPU.8.1SUPERVISOR INTERFACEThe supervisor interface is like an ACPI and is connected over serial port 1 to the CPU. The connection should be setup using:▪ 38400 Baud▪ 8 bit data▪ No Parity▪ 1 Stop bit▪ No Flow ControlEach packet has a start and end character. The CPU can tell the MCU to turn off the power, get temperatures and get voltages.Commands can be pipelined as the serial interface is interrupt driven, and responses contain the command it is responding to.All MCU to CPU messages start with '$' and end with a new line character, ASCII 0x0A.All CPU to MCU messages start with '#' and end with a new line character, ASCII 0x0A.When the power button is pressed, a 1ms low pulse is generated on IRQ4# to the CPU. The CPU can use the interrupt to cleanly shut down the OS and the power supplies via the ACPI serial interface.Holding the power button for greater than 5s will force the power off.To shut down the power of the Cyrus Plus motherboard from the CPU, the 's' command is used.Example:To read the temperature readings, the 't' command is used.Returns the temperatures in the following format:$t<sign>HH...<sign>HHWhere HH is the ASCII hex value of the temperature, and <sign> is either '+' or '-'.There are three temperature available to read on the Cyrus Plus motherboard. The temperatures given are returned in this order:1.PCB temperature2.CPU temperature3.PCIe switch temperatureExample:Represents+32°C for the PCB temperature+56°C for the CPU temperature+75°C for the PCIe switch temperatureTo read all the measured voltages, the 'v' command is used.Returns the voltages in the following format:$vXXYY...XXYYWhere XX represents the whole number of volts as ASCII hex, YY represents the number of 10mV units as ASCII hex.The voltages are sent in the order:1.CPLD, 3.3V2.Xena/Xorro3.3V3.Xena/Xorro 1.0V4.PCIe switch, 1.0V5.Xena 1.0V6. 3.3V7. 2.5V8.Ethernet 1.2V9.Platform, 1.0V10.Core A, 1.0V for P3041 1.1V for P5020, 1.1V-1.2V for P504011.Core B, 1.0V for P3041 1.1V for P5020, 1.1V-1.2V for P504012.DDR3 IO, 1.5V13.Serdes, 1.8VExample for the above default values:To read the CPU fan speed, the 'f ' command is used. This returns the fan speed (in RPM) and the fan duty cycle (0 -> 255, where 0 is off and 255 is full on). Returns the fan status in the following format: $fXXYYYYWhere XX is the ASCII hex value of the PWM (0x00 to 0xFE) YYYY is the ASCII hex value of the RPM, MSB first. Example:RepresentsFan PWM, 0xC0, 192 decimal Fan RPM, 0x10E6, 4326 decimal8.2 DEBUG SERIAL TERMINALThe MCU also provides serial debug interface for status reporting of the read voltages and temperature rails. This uses a 6 pin FTDI USB-TTL cable pinout (P18), see Figure 4 for location.Figure 4: MCU Debug headerThe pinout of the Debug serial terminal is give below in Table 14.Table 14: MCU serial pinoutNotes:Pins 2-4 and 6 are unconnected.MCU Debug headerTo set up a serial communications on a PC, it is recommended to use TeraTerm. The serial port must be configured as follows:▪ 38400 Baud▪ 8 bit data▪ No Parity▪ 1 Stop bit▪ No Flow ControlThis section contains specific Cyrus Plus boot information on the micro SD card and U-Boot.9.1MICRO SD CARDThe micro SD card contains all the U-Boot data. This is required to boot the system to U-Boot. The first 629kB or 1258 blocks contain the boot loader. The boot loader data should not be edited when accessing the SD card otherwise the system will cease to boot. The structure of the boot loader blocks of the micro SD card is shown in Table 15 below.Table 15: SD boot loader blocks9.2U-BOOTCyrus Plus uses a standard version of U-Boot configured for the Cyrus Plus hardware. For further reference of the U-Boot commands check out U-Boot website.There are specific environment settings which need to be configured for the system work correctly, these are shown in Table 16. These should not be edited as they will affect the functionality of Cyrus Plus Motherboard.Table 16: U-Boot critical settingsThere are specific environment settings for booting Amiga OS and these are listed in Table 17 below. Environment name Environment valueaosautoboot if run aosusbboot; then echo OK; else sata init; if run aossata0boot; then echo OK;echo if run aossata1boot; then echo OK; else run aosnetboot; fi; fi; fibootmenu_0 OS4 Auto Boot=run aosautobootbootmenu_1 USB Boot=run aosusbbootbootmenu_2 Net Boot=run aosnetbootbootmenu_3 SATA 0 Boot=sata init; run aossata1bootbootmenu_4 SATA 1 Boot=sata init; run aossata1bootTable 17: U-Boot Amiga OS boot setting10.1 SWITCHESHeaders are provided for front panel power and reset switches/buttons of the momentary, normally open type.Figure 5: Front Panel LED and switchesP6 (labelled POWER) is for the power button. P7 (RESET) is for the reset button. For P6 pin 1 is grounded and pin 2 is pulled up to 3.3V. For P7 pin 2 is grounded and pin 1 is pulled up to 3.3V.10.2 JUMPERSJumpers are provided to select boot configuration options, there position on the motherboard as shown in Figure 6.Figure 6: Cyrus JumpersTable 18: Jumpers10.3 LEDSCyrus provides 12 on-board LEDs and headers for 3 off board LEDs. Their location on the motherboard is shown in Figure 5 and Figure 7.Figure 7: Cyrus Plus LEDsTable 19: LEDsNotes:The LED header drivers are of the constant current (20mA) type and are suitable for driving LEDs with a forward voltage of between 2 and 12V (they will directly drive any standard LED assuming it is rated for 20mA or more). P12 is pinned out as follows: 1,2 = +/anode, 3 = -/cathode. P10 and P13 are pinned out as follows: 1 = +/anode, 2 = -/cathode. Pin 1 is marked by an arrow in each case.10.4PCIE AND PCI SLOTSThe pinout of the PCIe slots 1 shown in Table 20. The pinout for slot 2 is shown in Table 21.The pinout of slots 3, 4 and 5 is shown in Table 22. The pinout of slots 6 and 7 is shown in Table 23. The position of the connector for the PCIe and PCI slots is shown in Figure 8.Figure 8: PCIe and PCI slotsPCI Slots SLOT7 SLOT6PCIe SlotsSLOT5 SLOT4 SLOT3 SLOT2 SLOT1Table 20: PCIe x16 Slots Pinout Note: Slot 1 lanes 4-15 are always no connect.Table 21: PCIe x4 Slots PinoutTable 22: PCIe x1 Slots PinoutTable 23: PCI Slots Pinout10.5XENA CONNECTORSThe pinout of the Xorro slot is shown in Table 24 and Table 25 below. See Table 26 for signal descriptions. The pinout of the XTAG (XMOS JTAG) header is shown in Table 27.Table 24: Xorro Slot Pinout - A rowPorts LinksTable 25: Xorro Slot Pinout - B rowTable 26: Xorro Slot Signal DescriptionsNotes:3.Signal direction is with respect to the Xorro card. “I” signifies a signal driven from the motherboardto the card.4.Cards that do not provide any JTAG devices should connect TDI to TDO, and leave other JTAGsignals unconnected.Table 27: XTAG Connector PinoutNotes:1.The XTAG# signal is wired to ground on the XTAG debugger and is used to sense its presence byCyrus Plus (it is pulled up to 3.3V).10.6PROGRAMMING HEADERSThe locations for the programing header are located below in Figure 9.Figure 9: Programming HeadersThe pinout for H2 (labelled PLD JTAG) is shown in Table 28 below:Table 28: CPLD JTAG HeaderThe pinout for H3 (labelled MCU PROG) is shown in Table 28 below:Table 29: MCU Programming HeaderMCU headerCPLD JTAG header。