【AU2019200270A1】CONCEPTMASKLARGE-SCALESEGMENTATION

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Autodesk Fabrication CAMduct 2014 Service Pack 3 改

Autodesk®Fabrication CAMduct™ 2014Service Pack 3 Enhancement ListImprovements made in Service Pack 3 build 3.02.706:Pattern Improvements∙CID 324 - Improved Initial Makepat units for Imperial configuration where they were previously showing as metric.∙CID 535 - Improved Draw Type Options.∙CID 64 - Improved Development.∙CID 1127 - Improved Collar Developments.∙CID 1142 - Improved Development.∙CID 1148 - Improved holes on Development.∙CID 854 - Improved faces visibility when Bottom Radius set to 0.∙Improved Fabrication items by allowing functions to be used in calculated dims.∙Improvement made to straight duct patterns as seams were not being removed with the holes.∙Improvements to Bend insulation faces.∙Stability improvement when loading jobs with dampers.Productivity Improvements∙Improved cloud nesting to restrict processing items from being nested on the context menu.∙Improved cloud nesting to set item statuses to prevent processed items from being selected for nesting.∙Improved Linear Nest part lengths to report the correct imperial units.General Usability Improvements∙Improvement to nesting to include slits on all duplicate parts when slits are required.∙Stability improvement when using delete NC.∙Improvements made to nesting so that v-notches are cut true to the development profile.∙Improvement made to installed machines, when no machines are listed to remember newly created entries.∙Improved selection drop down lists to stop scrolling when selections are made.∙Enhancements to data views to allow Window Selections.∙Improvement to nesting to include slits on all duplicate parts when slits are required.∙Improved Dynamic Holes Developments.∙Improvements made to Dynamic Holes when branches are mirrored.∙Improved Job Info to increment the number when creating a new job after Batch Process.∙Stability improvements made to Sheet Sectional Processing when used for moving bed machines.∙Stability improvement made to Strip Nesting.∙Improvement made to migration of legacy install where all folders were not being copied over.∙Stability improvement made to Path Repair Tool.∙Stability improvement made when merging using Cloud Nesting.General Database Improvements∙Improved Material Database columns to be consistent.∙CID 60 - Improved Item Data Export output fields.∙Improved stability on 1D Barcode when data is more than 10 characters.∙Improvement made to Export Items Data when reporting out Square to Round Offset Depth.∙Improved scripting for owned content.∙Improved stability to Product Information Viewer.∙Improvement made to Edit Configuration when a link is added.Print Objects Enhancements∙Improvement to item gauge print object to always display index number or thickness.∙Improved stability when adding reports that have pressure drop & velocity fields for calculations.Post Processor Improvements∙New post processor added to support a new controller by Sente Makina.∙Added decoiler post that outputs a decoiler file in the format required by the TS20100 controller.∙Added MACH 3 support for Tangential/Router tools with feet.∙Improvement made to Sente Makina Post Processor.∙Improvement made to Amada Post Processor for stitched holes.∙Improved TURBODBGEN Post Processor to support updated controller.∙Improvements made to Salvagnini Post Processor.∙Improved Dyna Torch Post Processor to optionally include Block Numbers.∙Improvement made to MachMotion Post Processor.∙Added Mazak L32 Post Processor.∙Added Schneider Post Processor.∙Added SENTEDB1GEN Post processor for Sente Makina Duct board machine.Service Pack 2 Enhancement ListImprovements made in Service Pack 2 build 3.02.600:Pattern Improvements∙CID 1113 - Marker notch option added.∙CID 148, 2148 & 2149 - improved annotations in viewer.∙CID 17 - Enhanced insulation development to support mitered inner throat settings.∙CID 2149 - Inlet and Outlet options made visible.∙CID 2160 - Removed dimension error warning when branch values are set to zero but still expecting a valid angle.∙CID 24 - Dynamic hole changed to match the hole, not the plate size.∙CID 2523 - Insulation trimming improvement.∙CID 2882 - Improved to maintain a sensible scale view when setting dim F (Left Collar) to auto.∙CID 4 - Improved insulation to be positioned correctly when inner radius is set to zero.∙CID 40, 2040 & 2041 - Option "Duct Length" renamed to "Pipe Length"∙CID 839 - Development change to correctly match parts where the branch offsets no tangentially to outside of the pipe diameter.∙CID 868 - Centreline and pattern length will now report the C1 to C2 distance.∙Improved collars to no longer require redraw before take-off.∙Improvement made to pipe patterns to always allow you to change the connectors.∙Improvement made to pipe patterns to always allow you to specify pipe length.∙Improvements made to various patterns to cut insulations where holes have been added.General Usability Improvements∙Improved dynamic holes so that existing holes will be preserved∙Improved sub-assemblies to report the correct price for each component in the assembly.∙Improved the watermark printing feature so now the watermark can print on every page.∙Stability improvements in manual nesting when using combinations of chain cut and undo.∙Stability improvements made to the layer dialog to allow multiple clicking on the background.General Database Improvements∙Annotation multiplier now calculates as expected.∙Improved .dxf export to allow you to select how much detail to include. See /Pattern Switches/Developments∙Improved database component matching so that each component group will be taking into consideration when matching by name.∙Improved export data wizard by supporting different font sizes, data will no longer disappear from the dialog.Configuration Enhancements∙Improved "Remember this next time" when selecting a configuration from the start up screen.∙Improvements made when copying configurations so that the correct paths will be displayed, also projects will not be copied.Post Processor Improvements∙Added a new Swift Cut post processor.∙Improved Mach3 post processor to allow duct board to be cut.∙Improvement made to Mach3gen post processor to include a "Go Home On Tool Change" feature.∙Improvements made to the Forstner post processor to allow overrides on length and connector allowances.Service Pack 1 Enhancement ListImprovements made in Service Pack 1 build 3.02.502:Pattern Improvements∙CID 10, 18 - Right Height value functions correctly.∙CID 1170 - Connector node positions corrected.∙CID 1177 - Developments corrected.∙CID 1177 - Double Wall option enabled.∙CID 29 - Collars now reporting diameter or length in item reports.∙CID 3 - Multiple connector adjusts now supported.∙CID 385 - Branch node position corrected when No Pipe option is used.∙CID 4 - Leg length option is always shown.∙CID 4 –Improvement made to pattern to remember the option Throat Type, previously when using “Mitered” and an extension was input, the throat would reset to “Radius” when redrawn.∙CID 4522 - Coupling inverted so now when inserted as open top this displays correctly.∙CID 502 - Stability improvement when opened in previous versions of Autodesk Fabrication products.∙CID 526 - Angle dim is now remembered when part is edited.∙CID 58 - Branch snap node is positioned correctly when branch only option is used.∙CID 7 - Improved accuracy of 3D model overall height if used with a connector with a straight allowance at the OM end.∙CID 8 - Bending information corrected.∙CID 850 - Improved stability when adding straight branch in imperial configurations.∙CID 866 - Corrected hole position when a connector with a straight adjust is used.∙CID 879 - Coupling Plate connector face orientations corrected.∙CID 880 - Faces orientation corrected.∙CID 891 - Branch orientation corrected.∙CID 900 - Improved stability when type set to Vertical Elbow and Redrawn multiple times.∙CID 95 - Resolved overlapping developments when nested.∙CID 966 - Annotations now show in 3D viewer.∙CID 970 - Branch connector location corrected.General Usability Improvements∙Display Real Values for Auto Data Oval bend CID 106,107,108,109 on reports∙Enhanced Import Export dialog will not display incompatible file types.∙Enhancement PMCut to resolve errors received while loading.∙Improved development of collars to always redevelop when changes are made.∙Improved interoperability on subassemblies between Fabrication Products, 2013 & 2014 versions.∙Improved login/logout functionality to now always present the user with a login window following a successful logout.∙Improved ReCut form so when selecting Request By Type as columns now update correctly.∙Improved ReCut form when cancelled to return to the welcome screen.∙Improved save/export .dxf feature to now use the specified file location.∙Improved stability in job browser when clicking to find next.∙Improved stability in manual nesting after using Simple Cut Order.∙Improved stability where parts lead-ins were undetermined as a machine was not correctly assigned.∙Improved stability with loading IFC files which was causing memory corruption issues.∙Improved various areas of the program to handle file names containing % characters.∙Improved workflow of nesting process when using sheet nesting.∙Improved stability when importing underlays of large file size.∙Improvement made to welcome screen to allow user to edit configuration's databases.∙Supressed multiple confirmation delete warnings when deleting NC data.Print Objects Enhancements∙Improved connector location print object as occasionally wrong connectors were displayed, usually when the cad end was not the same order as connectors.∙Improved stability when accessing print objects that were referencing invalid database components.∙Improvements made to database to include gasket Print Objects.General Database Improvements∙Improved oversize seams to allow unique setting to be entered into Square to Oval & Round to Oval.∙Improvements to tables to allow easier deselection when a select all is active.Configuration Enhancements∙Improved copy configuration feature so that only the local folders.ini is loaded.∙Optimised ITM file and bitmap loading across networksMapprod Improvements∙Improvements made to prevent filter buttons from vanishing when the columns were resized.∙Product Information Editor/Viewer now reads from common file locations.Post Processor Improvements∙Added the following new post processors:o Salvagninigen(64).vplo Sinumericgen(64).vplo Machmotiongen(64).vplo Wammes PA(64).vplo Alarsis(64).vplo Gomech4(64).vplo KEGKatana(64).vpl∙Improved Prima post processor to now load values from condition tables in machine set-up.∙Improved support for diamond stiffening.∙Revised the following post processors:o Lockformer 1000Do VICON"Opus Enhancements∙Enhanced to enable leads to be moved.∙Improved stability in Opus element offset if the arc is shrunk to zero.∙Improved stability in when importing a DXF with no developments.Improved stability when importing parts with marking text.Autodesk, the Autodesk logo and CAMduct are registered trademarks or trademarks of Autodesk, Inc., and/or its subsidiaries and/or affiliates in the USA and/or other countries. All other brand names, product names, or trademarks belong to their respective holders. Autodesk reserves the right to alter product and services offerings, and specifications and pricing at any time without notice, and is not responsible for typographical or graphical errors that may appear in this document. © 2013 Autodesk, Inc. All rights reserved.。

IMDS材料数据系统使用指南(10.0版本)

1.2 1.3
1.4 1.5 1.6 127 日 2013 年 4 月 23 日
2013 年 5 月 24 日 2013 年 6 月 27 日
2013 年 12 月 12 日 2014 年 3 月 17 日 2014 年 7 月 13 日 2015 年 2 月 27 日 2015 年 4 月 27 日 2015 年 6 月 10 日 2015 年 6 月 11 日 2015 年 7 月 10 日
第3页
目录
1 IMDS – 简介.............................................................................................................................................................................................................. 7 2 IMDS – 使用入门 ...................................................................................................................................................................................................... 8
IMDS 服务中心欧洲 | 电话： +36 1778-9821 | 电子邮件： imds-helpdesk-english@ 中国 | 电话： + 86 27 8743-1668 | 电子邮件： imds-eds-helpdesk-china@

2007 Honda Odyssey 车主指南说明书

2007 Honda Odyssey Online Reference Owner's ManualUse these links (and links throughout this manual) to navigate through this reference.For a printed owner's manual, click on authorized manuals or go to .Contents Owner's Identification FormIntroduction (i)A Few Words About Safety (iii)Your Vehicle at a Glance (3)Driver and Passenger Safety (5)Proper use and care of your vehicle's seat belts, and Supplemental Restraint System.Instruments and Controls (63)Instrume nt panel indicator and gauge, and how to use dashboard and steering column controls.Comfort and Convenience Features (213)How to operate the climate control system, the audio system, and other convenience features.Before Driving (305)What gasoline to use, how to break-in your new vehicle, and how to load luggage and other cargo.Driving (319)The proper way to start the engine, shift the transmission, and park, plus towing a trailer. Maintenance (345)The Maintenance Schedule shows you when you need to take your vehicle to the dealer.Taking Care of the Unexpected (391)This section covers several problems motorists sometimes experience, and how to handle them.Technical Information (421)ID numbers, dimensions, capacities, and technical information.Warranty and Customer Relations (U.S. and Canada) (437)A summary of the warranties covering your new Acura, and how to contact us.Authorized Manuals (U.S. only) (441)How to order manuals and other technical literature. Index (I)Service Information SummaryA summary of information you need when you pull up to the fuel pump.Navigation System。

CA Clarity

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Studio 内容管理 ........................................................................................................................................................11 Microsoft Project Interface ........................................................................................................................................11 与 VersionOne 集成 ...................................................................................................................................................12 智能部分 .................................................................................................................................................................... 12 Apache Tomcat 日志分析..........................................................................................................................................13

马肯依玛士推出两款高解像度大字符喷码机

种渗透型材质上喷印．喷印环境从Ｏ到４ ℃ 。喷码机的喷印速度最高可达Ｏ１２米／钟，可选配喷头滑块组件．８分以优化喷印间距控制和喷印质量。
灵活性一尖端的通信能力：包括
彩色触摸屏、以太网、ＵＢ网络用Ｓ和
通过可选的ＣＬＳＥｔｒｒｅ络软ｏＯ￣ｎｅｐｉ网ｓ
Ｅｔｐｉ网络软件，通过远程数据库ｎｒｒｅｅｓ
或ＥＰ统集中管理数据。紧凑、模Ｒ系
块化的设计可单机或集成工作。硬件
和软件可进行全面升级，以满足不断变化的商务需求。效率一先进、严格的油墨管理系
们圆世博之梦。正如威图公司郑清好
博士在电视采访中所说： “ 助这些帮
孩子．是企业
形式．带领４名上海孤儿畅游世博园。０让这些失去家庭、失去父母的孩子们，
的发展积聚更多的力量。
件，通过远程数据库或ＥＰ统集中Ｒ系
管理数据。紧凑、模块化的设计可单机或集成工作。效率一进的喷码机设计可确保先
统，带有大容量的独立机芯，专门设
计用于回收经过净化的油墨，且可在
８月２０日，威图电子机械技术

SPIE-法国

Media PartnerPhotonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 12 Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747SPIE Europe thanks the following sponsorsfor their generous supportAttendee Pens Stand #511www.micos.wsCoffee Breaks Stand #420www.klastech.deConference Bags Stand #Exhibitor Lounge Stand #Lanyards Stand #Pastries Stand #511www.micos.wsVertical Banner Stand #231www.hamamatsu.frExhibitor list as of 3 March 2008.AMA Association for Sensor Technology. . . . #209A.T. Wall Company. . . . . . . . . . . . . . . . . . . . . #224AFOP - French Optics and PhotonicsManufacturers Association . . . . . . . . . . . . #124AHF analysentechnik AG . . . . . . . . . . . . . . . . #316Alcatel Thales III V Lab. . . . . . . . . . . . . . . . . . #329AT -Fachverlag GmbH. . . . . . . . . . . . . . . . . . . #534Avantes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #232Becker & Hickl GmbH . . . . . . . . . . . . . . . . . . #405Bookham . . . . . . . . . . . . . . . . . . . . . . . . . . . . #317Breault Research Organization. . . . . . . . . . . . #117Brush Ceramic Products . . . . . . . . . . . . . . . . #104Carl Hanser Verlag . . . . . . . . . . . . . . . . . . . . . #530Cedrat Technologies. . . . . . . . . . . . . . . . . . . . #118CEIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #323CILAS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #416Conerefringent Optics SL. . . . . . . . . . . . . . . . #508Crystal Fibre. . . . . . . . . . . . . . . . . . . . . . . . . . #306CST - Computer Simulation Technology . . . . #226CVI Melles Griot Ltd. . . . . . . . . . . . . . . . . . . . #507Draka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #230EDP Sciences. . . . . . . . . . . . . . . . . . . . . . . . . #532EKSPLA Co.. . . . . . . . . . . . . . . . . . . . . . . . . . #330Electro Optics Magazine . . . . . . . . . . . . . . . . #430Consortium. . . . . . . . . . . . . . . . . . . . . . . . . . . #331ePIXnet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #431Epner Technology, Inc.. . . . . . . . . . . . . . . . . . #423EQ Photonics GmbH . . . . . . . . . . . . . . . . . . . #223ET Enterprises Ltd . . . . . . . . . . . . . . . . . . . . . #328European Optical Society. . . . . . . . . . . . . . . . #536EuroPhotonics . . . . . . . . . . . . . . . . . . . . . . . . #100Fibercore Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . #515Fibercryst . . . . . . . . . . . . . . . . . . . . . . . . . . . . #426FiberTech Optica Inc.. . . . . . . . . . . . . . . . . . . #415Fischer Connectors . . . . . . . . . . . . . . . . . . . . #122Flexible Optical BV. . . . . . . . . . . . . . . . . . . . . #514FRAMOS GmbH. . . . . . . . . . . . . . . . . . . . . . . #106Frank Optic Products GmbH . . . . . . . . . . . . . #105Fraunhofer Heinrich Hertz Institut . . . . . . . . . #321Fujian CASTECH Crystals, Inc. . . . . . . . . . . . #501Gorman-Rupp Industries . . . . . . . . . . . . . . . . #413GWU-Lasertechnik GmbH . . . . . . . . . . . . . . . #501Hamamatsu . . . . . . . . . . . . . . . . . . . . . . . . . . #231HC Photonics Corp . . . . . . . . . . . . . . . . . . . . #501Heptagon . . . . . . . . . . . . . . . . . . . . . . . . . . . . #521HOLOEYE Photonics AG . . . . . . . . . . . . . . . . #309HORIBA Jobin Yvon SAS. . . . . . . . . . . . . . . . #327id Quantique SA. . . . . . . . . . . . . . . . . . . . . . . #405Impex HighTech GmbH . . . . . . . . . . . . . . . . . #411Innolume GmbH. . . . . . . . . . . . . . . . . . . . . . . #115Institut d’Optique Graduate School . . . . . . . . #437International Society for Stereology. . . . . . . . #529iXFiber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #126KERDRY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #120Kimoga Material Technology Co., Ltd.. . . . . . #520KLASTECH. . . . . . . . . . . . . . . . . . . . . . . . . . . #420Laser Components GmbH. . . . . . . . . . . . . . . #220Laser Focus World . . . . . . . . . . . . . . . . . . . . . #414Laser Zentrum Hannover e.V . (LZH). . . . . . . . #505LEONI Fiber Optics GmbH. . . . . . . . . . . . . . . #406Leukos . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #123LINOS Photonics France . . . . . . . . . . . . . . . . #307Lovalite. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #121Lumera Laser GmbH . . . . . . . . . . . . . . . . . . . #310Lumerical Solutions, Inc. . . . . . . . . . . . . . . . . #121M.C.S.E.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #128Mad City Labs, Inc. . . . . . . . . . . . . . . . . . . . . #214Materials Today . . . . . . . . . . . . . . . . . . . . . . . #435Menlo Systems GmbH. . . . . . . . . . . . . . . . . . #517Exhibitor ListPhotonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 47473T Advertiser Index Alcatel Thales III-V Lab. . . . . . . . . . . . . . . . . . . . . . . . . . . p. 11CVI Melles Griot Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . Cover 4ET Enterprises Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 23EPIC—European Photonics Industry Consortium . . . . . . p. 13KLASTECH—Karpushko Laser Technologies . . . . . . . . . p. 19LINOS Photonics France . . . . . . . . . . . . . . . . . . . . . . . . . p. 17Photoniques. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 5RSoft Design Group. . . . . . . . . . . . . . . . . . . . . . . . . . . Cover 2Space Light srl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 21Exhibition Floor PlanMesse Stuttgart . . . . . . . . . . . . . . . . . . . . . . . #524MICOS GmbH . . . . . . . . . . . . . . . . . . . . . . . . #511Nature Publishing Group . . . . . . . . . . . . . . . . #208NEMO (Network of Excellence onMicro-Optics). . . . . . . . . . . . . . . . . . . . . . . #217New Focus, Inc. . . . . . . . . . . . . . . . . . . . . . . . #317Newport Spectra-Physics . . . . . . . . . . . . . . . #205NEYCO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #212NIL Technology. . . . . . . . . . . . . . . . . . . . . . . . #125NP Photonics . . . . . . . . . . . . . . . . . . . . . . . . . #501Nufern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #428NuSil Technology . . . . . . . . . . . . . . . . . . . . . . #525Ocean Optics . . . . . . . . . . . . . . . . . . . . . . . . #110OLLA Project . . . . . . . . . . . . . . . . . . . . . . . . . #429Omega Optical, Inc.. . . . . . . . . . . . . . . . . . . . #107OpTIC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #333Optics & Laser Europe . . . . . . . . . . . . . . . . . . #312Optics Pages . . . . . . . . . . . . . . . . . . . . . . . . . #527OptiGrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . #510Optima Research . . . . . . . . . . . . . . . . . . . . . . #131OptoIndex. . . . . . . . . . . . . . . . . . . . . . . . . . . . #531Opton Laser International. . . . . . . . . . . . . . . . #130Optronis GmbH . . . . . . . . . . . . . . . . . . . . . . . #216OXXIUS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #304Phoenix BV. . . . . . . . . . . . . . . . . . . . . . . . . . . #315Photon Design . . . . . . . . . . . . . . . . . . . . . . . . #204Photonex 2008. . . . . . . . . . . . . . . . . . . . . . . . #527Photonic Cleaning Technologies . . . . . . . . . . #421Photonics 4 Life - Network of Excellence . . . #427Photonics Spectra - Laurin Publishing. . . . . . #100Photonik Zentrum Hessen in Wetzlar AG. . . . #222Physik Instrumente (PI) GmbH & Co.. . . . . . . #308Point Source. . . . . . . . . . . . . . . . . . . . . . . . . . #113Quantel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #305Raicol Crystals Ltd. . . . . . . . . . . . . . . . . . . . . #206Rhenaphotonics Alsace . . . . . #533, 535, 537, 539Royal Society of Chemistry . . . . . . . . . . . . . . #541RSoft Design Group. . . . . . . . . . . . . . . . . . . . #320RSP Technology BV . . . . . . . . . . . . . . . . . . . . #424Santec Europe Ltd.. . . . . . . . . . . . . . . . . . . . . #409Scientec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #412SEDI Fibres Optiques. . . . . . . . . . . . . . . . . . . #313SEMELAB PLC. . . . . . . . . . . . . . . . . . . . . . . . #109Sill Optics GmbH & Co., KG. . . . . . . . . . . . . . #221SIOF-Italian Society of Optics and Photonics #516Space Light srl . . . . . . . . . . . . . . . . . . . . . . . . #518Spectroscopy Magazine. . . . . . . . . . . . . . . . . #433SphereOptics GmbH . . . . . . . . . . . . . . . . . . . #504Spiricon GmbH. . . . . . . . . . . . . . . . . . . . . . . . #419Springer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #211Stanford Computer Optics GmbH . . . . . . . . #114bTaylor & Francis - Contemporary Physics . . . #528Taylor & Francis - Fiber and Integrated Optics #528Taylor & Francis - Informa UK Ltd.. . . . . . . . . #528Taylor & Francis - International Journal ofOptomechatronics. . . . . . . . . . . . . . . . . . . #528Taylor & Francis - Journal of Modern Optics . #528THALES Laser . . . . . . . . . . . . . . . . . . . . . . . . #506The Institution of Engineering andTechnology (IET) . . . . . . . . . . . . . . . . . . . . #425Thorlabs GmbH . . . . . . . . . . . . . . . . . . . . . . . #517TSP Diffusion . . . . . . . . . . . . . . . . . . . . . . . . . #417UCM AG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . #116Unice E-O Services Inc.. . . . . . . . . . . . . . . . . #422Universal Photonics, Inc. . . . . . . . . . . . . . . . . #207VTT Technical Research Centre of Finland. . . #129Wiley-VCH GmbH & Co. KGaA . . . . . . . . . . . #523Xiton Photonics GmbH. . . . . . . . . . . . . . . . . . #501XLITH GmbH . . . . . . . . . . . . . . . . . . . . . . . . . #432Yole Développement . . . . . . . . . . . . . . . . . . . #225ZODIAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . #322Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 5The French magazine specializing in Optics-Photonics Photoniques :the magazine of theFrench Optical CommunityPhotoniques,magazine of the French OpticalSociety,establishes links and partnerships betweenall the entities working in Optics-Photonics :at national level with AFOP (French ManufacturersAssociation in Optics and Photonics)and in eachregion of France.Photoniques :The source of information for all the professionals in thefield of Optics-Photonics in France.In each issue :industry news,technical articles written by specialists,new products…A useful and efficient circulation :7500copiesAfter 7years of existence,cooperation and networking withthe specialists of the optic world in France,Photoniques hasbuilt a large qualified database of potential users :researchers,technicians,engineers and managers,fromindustry such as communications,industrial vision,lasers,test and measurements,imaging/displays…Are you interested in the French optics and photonics markets?Photoniques is your partner!How to keep you informed about Optics-Photonics in France?Become a Photoniques reader!123For additionnal information,contact:Olga Sortais :+33134042144o.sortais@ to request an issue of Photoniques and a media kit6 Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747As a new addition to Photonics Europe, the Industry PerspectivesProgramme will provide a series of executive brieﬁ ngs coveringkey technologies and sectors.Come hear key members of Europe’s photonics industrydiscuss their successes, future plans and the way in which theyintend to maximize their market penetration and growth. Hearreviews of the European Innovation landscape highlightinggeographical areas of strengths in areas such as business R&D,knowledge transfer and demonstrate the outcomes from recentsuccessful European-funded industry programmes.Industry Perspectives Programme Included with Conference registration.Individual Sessions can be purchased at the Cashier. Individual sessions, €100. The sessions will deliver a strategic perspective into each application area, allowing you to uncover and confirm the future prospects for your business. Benchmark your aspirations for your business and technology against some of Europe’s leading companies and engage with them as a potential supplier or partner. You will hear presentations from Philips, Audi, PCO, Coherent Scotland, GlaxoSmithKline, Carl Zeiss, Yole Development, Koheras and Fraunhofer on their successes and strategic priorities. Tuesday 8 April Morning SessionPhotovoltaics10.15 to 10.45 hrs.Photovoltaics - Market and Technology TrendsGaëtan Rull, Market Analyst for New Energy Technologies,Yole Développement 10.45 to 11.15 hrs.High Throughput Manufacturing for BulkHeterojunction PVsMarkus Scharber, Head of Materials Group, Konarka 11.15 to 11.45 hrs.Managing JGrowth in the Production of Thin Films(To be conﬁ rmed.)Dr. Immo Kotschau, Director of Research and Development,Centrotherm GmbH 11.45 to 12.30 hrs.End to End Mass Production of Silicon Thin FilmModulesDetlev Koch, Head of BU Solar Thin Films & Senior Vice President,O C Oerlikon Balzers AG Break – 12.30 to 14.00 hrs.Afternoon SessionMEMS/MOEMS14.00 to 14.30 hrs.Market Trends and Technical Advances in M(O)EMSDr. Eric Mounier, Manager for MEMS & Optoelectronics andMicronews Chief Editor, Yole Développement14.30 to 15.00 hrs.Inorganic/Organic Hybrid Polymers (ORMOCER) forOptical InterconnectsDr. Michael Popall, Head of Microsystems and Portable PowerSupply, Fraunhofer ISC15.00 to 15.30 hrs.Future MOEMS and Photonic MicrosystemsDr. Thomas Hessler, Director Axetris, Leister Process Technologies15.30 to 16.15 hrs.Innovations in MOEMS product developmentProf. Hubert Karl, Director, Fraunhofer IPMSWednesday 9 AprilMorning Session Multimedia, Displays and Lighting 10.15 to 10.45 hrs.Plasmonics for Photonics: Challenges and Opportunities Ross Stanley, Section Head: MOEMS & Nanophotonics, CSEM 10.45 to 11.15 hrs.Photonic Microsystems for Displays Edward Buckley, VP Business Development, Light Blue Optics Ltd.11.15 to 11.45 hrs.Matrix-Beam – the antiglaring LED-high beam Benjamin Hummel, Research for Concept Lighting T echnologies, Audi 11.45 to 12.30 hrs.High Brightness OLEDs for Next Generation LightingPeter Visser, Project Manager, OLLA Project, The Netherlands Break –12.30 to 14.00 hrs.Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747 7Thursday 10 AprilMorning SessionImaging10.15 to 10.45 hrs.High Resolution Imaging detectors for invisiblelight –Development and IndustrialisationHans Hentzell, CEO, Acreo10.45 to 11.15 hrs.(Presentation to be conﬁ rmed.)11.15 to 11.45 hrs.Raman Spectroscopy, Raman Imaging and FutureTrendsSopie Morel, Sales Manager, Molecular & Microanalysis Division,HORIBA Jobin Yvon 11.45 to 12.30 hrs.World Markets for Lasers and Their Application Steve Anderson, Associate Publisher/Editor-in-Chief,Laser Focus World Break – 12.30 to 14.00 hrs. Afternoon SessionBiomedical and Healthcare Photonics 14.00 to 14.30 hrs.Photonic Systems for Biotechnology Research Karin Schuetze, Director of R&D, Carl Zeiss Microimaging 14.30 to 15.00 hrs.Photonics 4 Life Prof. Jeürgen Popp, Director, IPHT Germany 15.00 to 15.30 ser System Development for Biophotonics Chris Dorman, Managing Director, Coherent Scotland15.30 to 16.15 hrs.Supercontinuum Light - a paradigm shift in lasersources for biophotonicsJakob Dahlgren Skov, CEO, Koheras Husain Imam, Business Development Manager, Koheras Industrial Perspectives ProgrammeWednesday 9 April Afternoon Session OPERA 2015: European Photonics - Corporate and Research Landscape 13.30 to 13.45 hrs.Optics and Photonics in the 7th Framework ProgrammeGustav Kalbe, Head of Sector - Photonics, Information Society andMedia, Directorate General, European Commission 13.45 to 14.00 hrs.OPERA 2015: Aims, Results and link to Photonics 21Markus Wilkens, VDI 14.00 to 14.20 hrs.European Photonics Industry Landscape Bart Snijders, TNO 14.20 to 14.40 hrs.European Photonics Research Landscape Marie-Joëlle Antoine, Optics Valley 14.40 to 15.00 hrs.Resources for Photonics Development Peter Van Daele, IMEC Break – 15.00 to 15.15 hrs. 15.15 to 15.35 hrs.Towards the Future on Optics and Photonics ResearchDr. Eugene Arthurs, SPIE Europe (UK)15.35 to 16.15 hrs.Strategic Opportunities for R&D in EuropeMike Wale, Bookham, UK16.15 to 16.45 hrs.A Sustainable Business Model for Optics andPhotonicsDavid Pointer, Managing Director, Point Source (Pending)16.45 to 17.15 hrs.Final Open DiscussionChaired by: Gustav Kalbe, Head of Sector - Photonics, InformationSociety and Media, Directorate General, European Commission8Photonics Europe 2008 · /pe · info@ · TEL: +44 29 2089 4747Photonics Innovation Village Tuesday to Thursday during Exhibition HoursThe Photonics Innovation Village will showcase the latest projects and breakthroughs from optics-photonics researchers at universities, research centres and start-up companies. This is a great opportunity to see how EU R&D and project funds are being used by some of the great young innovators in Europe.A window on creative products developed by universities and research centres. Under the patronage of the European Commission, ﬁ fteen entrants from across Europe complete to win categories ranging from Best Marketability to Best Design, Best Technology, and Best Overall Product.Low power remote sensing system Y. A. Polkanov, Russia (Individual work)New approach is based on use of a low-power radiation source with speciﬁ ed gating, when time of source radiation interruption is equal to a pulse duration of ordinary lidar. We propose to reconstruct the average values of these characteristics over the parts commensurable with the sounding path length. As scanning systems is offered with speed of circular scanning is determined by time of small linear moving of a laser beam. It allows to predict a reduction of the meteorological situation stability from an anticipatory change of the revealed structure character of optical heterogeneities of a atmosphere ground layer atmosphere.Point of care sensor for non-invasive multi-parameter diagnostics of blood biochemistry Belarusian State University, Belarus; Ruhr-Universität-Bochum, Germany; Second Clinical Hospital, Belarus Compact ﬁ bre optical and thermal sensor for noninvasive measurement of blood biochemistry including glucose, hemoglobin and its derivatives concentrations is developed as a prototype of the point-of-care diagnosticdevices for cardiologic, tumour and diabetic patients. Integrated platform for data acquisition, data processing and communication to remote networks has been developed on the pocket PC.Polarization-holographic gratings and devices on their basisLaboratory of Holographic Recording & Processing of Information, Institute of Cybernetics, GeorgiaWe have developed the technology of obtaining of polarization-holographic gratings that have anisotropic proﬁ le continuously changing within each spatial period and also the technology of obtaining of polarization-holographic elements on the basis of such gratings. Special highly effective polarization-sensitive materials developed by us are used for obtaining such gratings and elements. We can present samples of gratings and elements and give a demonstration of their work.Ultra-miniature omni-view camera moduleImage Sensing group of the Photonics Division of CSEM (Centre Suisse d’Electronique et de Microtechnique), SwitzerlandA live demonstration with a working prototype of a highly integrated ultra-miniature camera module with omni-directional view dedicated to autonomous micro ﬂ ying devices is presented.Femtosecond-pulse ﬁ bre laser for microsurgery and marking applicationsMultitel, BelgiumMultitel presents a new prototype of an all-ﬁ bred femtosecond ampliﬁ ed laser. The device has been speciﬁ cally developed for micromachining and microsurgery applications and operates at 1.55µm, which corresponds to a high absorption peak of water (molecule contained in large quantity in living tissue and cells). Since no free-space optics is used for pulse compression or ampliﬁ cation the prototype is compact and very stable. Moreover, the seed laser source has a high repetition rate therefore enabling multiphoton absorption applications and use in multi-pulse and burst modes.Flexible artiﬁ cial optical robotic skinsDepartment of Applied Physics and Photonics (VUB-TONA) and Robotics & Multibody Mechanics Research Group (VUB-R&MM) of the Vrije Universiteit Brussel, Belgium; Thin Film Components Group (UG-TFCG) and Polymer Chemistry & Biomaterials Research Group (UG-PBM) of the Universiteit Gent, BelgiumWe will present a paradigm shifting application for optical ﬁ bre sensors in the domain of robotics. We propose ﬁ bre B ragg gratings (FB Gs) written in highly-birefringent microstructured optical ﬁ bres integrated in a ﬂ exible skin-like foil to provide a touch capability to a social pet-type robot for hospitalized children named “Probo”. The touch information is complementary to vision analysis and audio analysis and will be used to detect where Probo is being touched and to differentiate between different types of affective touches such as tickling, poking, slapping, petting, etc.Co-Sponsored by: Location: Galleri de Marbre Under the patronage of the European Commission, Photonics Unit Join us for the Photonics Innovation Village Awards 2008 which will take place on Wednesday, 9th April 2008, from 17.00 hrs. in the Galerie de Marbre.3D tomographic microscopeLauer Technologies, FranceThe 3D tomographic microscope generates 3D high-resolution images of non-marked samples. The demonstration will show 3D manipulation of images obtained with this microscope.Polar nephelometerInstitute of Atmospheric Optics of Tomsk, RussiaMaterial comprising a matrix, apatite and at least one europium composite compound with particle medium sizes more 4-5 micron. The composition for the production of the material comprises (wt. %) apatite 0.01-10.0; composite compound. 0.01-10.0, and the balance is a matrix-forming agent, such as a polymer, a ﬁbre, a glass-forming composition, or lacquer/adhesive-forming substance.High speed Stokes portable polarimeterMIPS Laboratory of the Haute Alsace University, FranceThe implementation of an imaging polarimeter able to capture dynamic scenes is presented. Our prototype is designed to work at visible wavelengths and to operate at high-speed (a 360 Hz framerate was obtained), contrary to commercial or laboratory liquid crystal polarimeters previously reported. It has been used in the laboratory as well as in a natural environment with natural light. The device consists of commercial components whose cost is moderate. The polarizing element is based on a ferroelectric liquid crystal modulator which acts as a half-wave plate at its design wavelength.Diffractive/refractive endoscopic UV-imaging system Institut für Technische Optik (ITO) of the University of Stuttgart, GermanyWe present a new optical system with an outstanding high performance despite of demanding boundary conditions of endoscopic imaging to enable minimal invasive laser-based measurement techniques. For this purpose the system provides a high lens speed of about 10 times the value of a conventional UV-endoscope, a multiple broad band chromatic correction and small-diameter but wide-angle access optics. This was realized with a new design concept including unconventional, i.e. diffractive components. An application are UV-LIF-measurements on close-to-production engines to speed up the optimization of the combustion and produce aggregates with less fuel consumption and exhaust gases like CO2.Light-converting materials and composition: polyethylene ﬁ lm for greenhouses, masterbatch, textile, sunscreen and aerosolUsefulsun Oy, Finland; Institute Theoretical and Experimental Biophysics Russian Academy of Sciences, RussiaThe composition for the production of the material comprises (wt. % ) composite compound (inorganic photoluminophore particles with sizes 10-800nm) -0.01-10.0; coordination compound of metal E (the product of transformation of europium, samarium, terbium or gadolinium ) - 0,0-10,0 and the balance is a matrix-forming agent, such as, a polymer, a ﬁ ber, a glass-forming composition or gel, aerosol, lacquer/adhesive-forming substance. The present invention relates to composite materials, in particular to light-converting materials used in agriculture, medicine, biotechnology and light industry.HIPOLAS - a compact and robust laser sourceCTR AG (Carinthian Tech Research AG), AustriaThe prototype covers a robust, compact and powerful laser ignition source for reciprocating gas and petrol engines that could be mounted directly on the cylinder.We have developed a diode pumped solid-state laser with a monolithic Neodymium YAG resonator core. A ring of 12 high power laser diodes pumps the resonator. Due to the adjustment-free design, the laser is intrinsically robust to environmental vibrations and temperature conditions. With overall dimensions of Æ 50 x 70 mm the laser head is small enough to be ﬁ tted at the standard spark plug location on the cylinder head. The dimensions can be reduced for future prototypes. OLLA OLED lighting tile demonstratorOLLA project-consortiumOLED technology is not only a display technology but also suited for lighting purposes. The OLLA project has the goal to demonstrate viability of OLED technology for general lighting applications. The demonstrator tile shown here combines the current results of the project : a large sized (15x15cm2) white OLED stack with high efﬁ cacy (up to 50 lm/W), combined with long lifetime (>10.000 hours).During Photonics Europe, we will show several OLEDs tiles in different colors. The demonstrators are made by the OLLA project-consortium members. The large OLED demonstrator tile was fabricated on the inline tool at Fraunhofer IPMS in Dresden.Analyze-IQNanoscale Biophotonics Laboratory, School of Chemistry,and Machine Learning / Data Mining Group, Department ofInformation Technology, National University of Ireland, Galway, IrelandAnalyze-IQ is the next generation spectral analysis software tool for optical and molecular spectroscopies such as Raman, Mid-IR, NIR, and Fluorescence. The Analyze-IQ software is based on patented machine-learning algorithms and a model based approach in which the software learns to recognise the relevant information in complex mixtures from sample spectra. It then uses these models to rapidly and accurately identify or quantify unknown materials such as narcotics and explosives, in complex mixtures commonly found in law-enforcement and industrial applications.Micro-optical detection unit for lab-on-a-chipDepartment of Applied Physics and Photonics (VUB-TONA) of the Vrije Universiteit Brussel, BelgiumWe present a detection unit for ﬂ uorescence and UV-VIS absorbance analysis in capillaries, which can be used for chromatography. By usinga micro-fabrication technology (Deep Proton Writing) the optics aredirectly aligned onto the micro-ﬂ uidic channel. This integration enables the development of portable and ultimately disposable lab-on-a-chip systems for point-of-care diagnosis. We will explain the working principle of our detection system in a proof-of-concept demonstration set-up while focusing on some speciﬁ c applications of micro-ﬂ uidics in low-cost lab-on-a-chip systems.Photonics Innovation Village。

华为云链相机200 4K超高清相机说明书

4K Ultra-HD CameraHUAWEI CloudLink Camera 200 is a next-generation 4K UHD PTZcamera that works with Huawei's UHD video conferencing endpointrange or cloud-registered soft clients, creating an unprecedentedvideo conferencing experience.CloudLink Camera 200Designed with EleganceThe camera 200 was built with the integrator in mind, enabling ultra-wide field of view and powerful zoom capabilities. The professional-grade and elegant appearance adds to the aesthetics that delights the customer.Effortless to UseEasy maintenance and configuration are made possible by the embedded OSD UI, through which the Camera 200 can be operated independently. The Camera 200 operations are also supported on the remote control or touch panel of the connected Huawei endpoint.Unmatched Video QualityThe 8.51-megapixel CMOS image sensor provides HDMI video outputs of up to 4K. Image enhancement based on human visual system and 3D video denoising based on motion estimation present images in true color and with every detail, creating the ultimate video confer-encing experience. The Camera 200 provides four image modes including Standard, Natural, Vivid, and Scenery for you to choose from.Intelligent Image ProcessingThe Camera 200 provides intelligent viewing with auto-sensing capabilities including automatic white balance (AWB), automatic exposure (AE), and automatic focus (AF).High-performance Pan/Tilt/Zoom (PTZ)The high-precision pan, tilt, and zoom (PTZ) has a localization deviation of only ±0.1°, which is industry-leading. The PTZ is also fast-switch-ing with a 170-degree-wide field of view.12 x Optical ZoomThe high-performance AF lens support stable focusing and 12 x optical zoom for best overview, which provides ideal framing to the far end.254 PresetsPTZ positions can be predefined. (A predefined PTZ position is named preset.) The PTZ can be adjusted to a specific position to capture desired images with just one button push through presets. Presets are saved even when the Camera 200 is turned off.USB3.0 Video OutputThe Camera 200 can be connected to a laptop to deliver images through the USB3.0 port.SpecificationsModel HUAWEI Camera 200-1080P HUAWEI Camera 200-4K Video output resolution 1080p 50/60, 1080i 50/60, 1080p 25/30, and 720p 50/60 4K 25/30, 1080p 50/60, 1080i 50/60, 1080p 25/30, and 720p 50/60Image sensor8.51-megapixel, 1/2.5-inch CMOS 12x optical zoom ZoomF1.8–F3.56±5%Max. aperture3.85–43.06 mm ±5%Focal lengthPan: ±110°; tilt: ±30°Pan/Tilt anglePan: 1.7°/s (tele) to 80°/s (wide); tilt: 0.7°/s to 28°/s Pan/Tilt speed3 lux (50 IRE, F1.8)Min. illumination1/25–1/10000 seconds Shutter speed254Number of presets 80°/50°Max. horizontal/vertical field of viewStandard, Natural, Vivid, and SceneryImage mode Auto, manual, or one-button-push Auto, manual, aperture priority, shutter priority, or brightness priority Auto, manual, or one-button-pushWhite balanceExposureFocus Supported Ceiling-mountedRemote control over an endpoint through the connected camera Remote control (infrared)Software upgrade through the local USB portSoftware upgrade 100–240 V AC, 50–60 Hz Input voltage12 V DC Output voltage≤ 12 WPower 0℃ to 40℃Operating temperatureNet weight: 4.23 lb (1.92 kg)Weight 2 x RS232 serial portControl port Camera: 6.10 in. x 9.80 in. x 5.47 in. (155 mm x 249 mm x 139 mm)Packages: 12.60 in. x 16.73 in. x 11.22 in. (320 mm x 425 mm x 285 mm)Dimension1 x HDMI 1.4b 1 x USB3.0Video output portSupported Digital wide dynamicrange (WDR)Copyright©2019 Huawei Technologies Co., Ltd. All rights reserved.。

Cosmicar监控镜头参数

C32500KP
25.0mm F1.4 C-Mount
$156.00
C33500KP
35.0mm F1.6 C-Mount
$156.00
C35001KP
50.0mm F2.8 C-Mount
$156.00
C37500KP 1" Format C20616TH (formerly C20612) C21211KP C21228TH (formerly C21212) C22525KP
Call
2/3" Format C30405KP 4.8mm F1.8 Fixed Focus C-Mount w/ Locking Screws 8.0mm F1.4 C-Mount (3-CCD) w/ Locking Screws Discontinued! Limited Stock! 8.5mm F1.5 C-Mount w/ Locking Screws $166.00
$738.00
Call
C52893F
50mm F2.8 F-Mount
$767.00
Call
C52893K
50mm F2.8 K-Mount
$767.00
Call
Auto-Iris Lenses (DC) Model # 1/3" Format C70210DCPS 2.8mm F1.2 CS-Mount w/ Connector 4.0mm F1.2 CS-Mount w/ Connector Discontinued! Limited Stock! $75.00 Description Our Price PDF File Shop
$99.00
1/2" Format for Machine Vision (2 Mega Pixel) C61232KP 12.0mm F1.4 C-Mount 25.0mm F2.0 C-Mount (Ultra Violet Lens, 2 MegaPixel) $137.00

【AU2019100268A4】正面照片潜水面罩【专利】

(21)
Application No: 2019100268
(22) Date of Filing: 2019.03.14
(30) Priority Data
(31)
Number
201821298629.9
(32) Date 2018.08.13
(33) Country CN
(45)
Publication Date:
The present utility model discloses a full face dive mask, comprising a facial mask, a head strap connected with the facial mask and a respiratory pipe connected with the facial mask, wherein the side surface of the upper end of the facial mask is provided with a guide rail, the side surface of the lower end of the respiratory pipe is provided with a fixing shaft slidably connected with the guide rail, and the respiratory pipe is pulled outwards along the guide rail and revolved to fold in the facial mask. The utility model is simple in structure, small in size for the respiratory pipe can be folded to place, easy to store and capable of guaranteeing smooth breathing of a user.

【AU2019202728A1】自动门票分辨率【专利】

G06F 16/00 (2019.01)
G07B 5/00 (2006.01)
G06Q 10/10 (2012.01)
(21)
Application No: 2019202728
(22) Date of Filing: 2019.0te:
(43)
Publication Journal Date:
VijayChandar;PAPPU, Rajesh;BAIKADY, Chetan Kumar;GOLDING, David;HIGGINS,
Luke;WHINE, Leon;ZION, Raanan;SANKARARAMAN, Sunder;RANGARAJAN,
KrishnaKumar Dorai;SELVARAJ, Radhu;PARAMASIVAM, Lakshmi;NAGARAJAN,
(62) Divisional of: 2018201374
2019.05.16 2019.05.16
(71) Applicant(s) Accenture Global Solutions Limited
(72) Inventor(s)
SRIVASTAVA, Krupa;KOUSHIK, Vijayaraghavan;PRASAD, Rajendra T.;NATESAN,
Udayakumar;NARAYANAN,
Parvatha;ATHINARAYANAN,
Chandrasekhar;VENUGOPAL, Senthil Kumar;RANGASWAMY, Srinivasan
(74) Agent / Attorney Murray Trento & Associates Pty Ltd, Ground Floor, 613 Canterbury Road, Surrey Hills, VIC, 3127, AU

口唇化妆品研发设计与质量控制技术指南

口唇化妆品研发设计与质量控制技术指南下载提示：该文档是本店铺精心编制而成的，希望大家下载后，能够帮助大家解决实际问题。

文档下载后可定制修改，请根据实际需要进行调整和使用，谢谢!本店铺为大家提供各种类型的实用资料，如教育随笔、日记赏析、句子摘抄、古诗大全、经典美文、话题作文、工作总结、词语解析、文案摘录、其他资料等等，想了解不同资料格式和写法，敬请关注!Download tips: This document is carefully compiled by this editor. I hope that after you download it, it can help you solve practical problems. The document can be customized and modified after downloading, please adjust and use it according to actual needs, thank you! In addition, this shop provides you with various types of practical materials, such as educational essays, diary appreciation, sentence excerpts, ancient poems, classic articles, topic composition, work summary, word parsing, copy excerpts, other materials and so on, want to know different data formats and writing methods, please pay attention!口唇化妆品研发设计与质量控制技术指南引言口唇化妆品在现代社会中占据了重要地位，它不仅可以提升个人形象，还能改善口红、唇膏等产品的口感、持久度和质感。

亚马逊美国站产品图片要求及优化技巧

亚马逊产品图片（主图+副图+A+页面）平台要求一、主图要求1.主图片必须采用纯白色背景（RGB 色值为255、255、255）。

2.图片最长边的分辨率最好不小于1600 像素且不超过10000像素。

最低可接受的尺寸为不小于1000像素，否则图片将不支持缩放。

3.主图片必须是实际商品的专业照片（不得是图形、插图、实物模型或占位图片）。

不得展示无关配件或可能令买家产生困惑的道具。

4.主图片内的商品上方或背景中不得有文字、徽标、边框、色块、水印或其他图形。

5.主图片不得包含单个商品的多角度视图。

6.主图片必须完整展示待售商品。

图片不得紧贴图片框边缘或被图片框边缘遮挡，珠宝首饰（例如：项链）除外。

7.主图片展示的商品必须去除外包装。

包装箱、包装袋或包装盒不应显示在图片中，除非它们是重要的商品特征。

8.主图片不得展示处于坐姿、跪姿、靠姿或躺卧姿的人体模特；但建议使用辅助技术（轮椅、假体等）表达各种移动性。

9.多件装服装商品和配饰的主图片必须采用平面拍摄形式（非模特展示）。

10.无论人体模型是何种外观（透明、纯色、肉色、框架或衣架），服装配饰的主图片不得展示人体模型的任何部位。

11.主图片展示的女装和男装必须由真人模特穿着。

12.儿童和婴幼儿服装的所有图片必须采用平面拍摄形式（非模特展示）。

13.主图片展示的鞋靴必须是单只，呈45 度角朝左摆放。

二、所有产品图片要求1.图片必须准确展示待售商品。

2.图片必须与商品名称相符。

3.商品形象必须占据图片区域中85% 或以上的面积。

4.图片文件最长边的分辨率最好不小于1600 像素，图片最长边的分辨率不得超过10,000 像素。

如果您无法满足此要求，那么，可进行缩放的文件的最小尺寸为1,000 像素，而用于网站展示的文件的最小尺寸为500 像素。

5.图片必须采用JPEG（.jpg 或 .jpeg）、TIFF (.tif)、PNG (.png)。

6.图片必须清晰，未经过像素化处理且没有锯齿边缘。

SL Headmic 1 耳顶麦克风说明说明书

FEATURES• Most comfortable-to-use presenter microphone • Outstanding sound quality, omni-directional • Sleek and unobtrusive appearance• Extremely lightweight, but sturdy metal frame • Soft case for convenient transport and storage • Available in black, beige and silverThe SL Headmic 1 is an extremely unobtrusive and com-fortable-to-use headworn microphone. It features the proven omni-directional MKE 1 microphone capsule. The adjustable neck band makes its use convenient for everyone. The extremely lightweight (7 g ) but robust metal frame makes the microphone ideal for long-term use. It comes with a sturdy and sleek soft case, which can also hold a bodypack transmitter. It is available in black, beige and silver.DELIVERY INCLUDES• SL H eadmic 1• connection cable• MZC 1-2 frequency response cap• MZC 1-1 frequency response cap (SL Headmic 1 -4 NConly)• 2x clips (SL Headmic 1 -4 NC only)• SL M ZW 1 windshield • soft case • quick guide • safety instructionsSPECIFICATIONSFrequency response 20 to 20,000 H z ± 3 d B Pick-up pattern omni-directional Nominal impedance @ 1 k Hz1 k ΩMin. terminating impedance 4.7 k ΩSensitivity5 m V/Pa ± 3 d B Diameter of mic capsule 3.3 m m Max. sound pressure level 143 d B Equivalent noise level 27 d B(A)Supply current approx. 240 μA Power supply 4.5 to 15 VTemperature rangeOperation: Storage: -10 °C to 50 °C(14 °F to 122 °F)-20 °C to 70 °C(-4 °F to 158 °F)Relative air humidity max. 95 %Cable length1.6 m Diameter of boom arm 1.1 m mConnector3.5 m m jack plug or3-Pin connector (-4 variant)Weight (without cable)approx. 7 gPRODUCT VARIANTSSL HEADMIC 1 BK - black Art. No. 506271SL HEADMIC 1 BE - beige Art. No. 506272SL HEADMIC 1 SB - silver Art. No. 506904SL HEADMIC 1 -4 BK - black Art. No. 506905SL HEADMIC 1 -4 BE - beige Art. No. 506906SL HEADMIC 1 -4 SB - silver Art. No. 506907SL HEADMIC 1 -4 NC SB - silver Art. No. 390004SL HEADMIC 1 -4 NC BK - black Art. No. 390005SL HEADMIC 1 -4 NC BE - beigeArt. No. 390006Sennheiser electronic GmbH & Co. KG · Am Labor 1 · 30900 Wedemark · Germany · DIMENSIONS64.91[ca. 1600mm]Kabel mit 3,5 mm Klinkenstecker / cable with 3.5 mm jack plugKabel mit 3-poligem Spezialstecker / cable with 3-pin special connectorSignal64.91[ca. 1600mm]ARCHITECT‘S SPECIFICATIONThe headset microphone shall be designed for professional …hands free“ applications. Its high-quality microphone cap-sule shall be a pre-polarized condenser with an omni-di-rectional pick-up pattern and shall be optimized for speech intelligibility.The headset microphone shall have an adjustable, visually unobtrusive neckband and an extremely thin microphone boom that shall be adjustable in length. The headset mi-crophone shall be available in black (BK variant), beige (BE variant) or silver (SB variant).The frequency response of the headset microphone shall be 20 H z-20,000 H z (± 3 d B) and sensitivity shall be 5 m V/Pa (± 3 d B). Nominal impedance at 1 k Hz shall be 1 k Ω, with a min. terminating impedance of 4.7 k Ω. Maximum SPL shall be 143 d B, equivalent noise level shall be 27 d B(A).The current consumption shall be approximately 240 μA. Operating voltage shall range from 4.5-15 V . Diameter of the microphone capsule shall be 3.3 m m (0.13"), diameter of the boom arm shall be 1.1 m m (0.04"). The cable shall be 1.6 m long and shall provide connection via a 3.5 m m jack plug or a lockable 3-pin special connector. Weight without cable shall be approximately 7 g rams (0.25 o z). Operating temperature shall range from -10 °C to +50 °C (+14 °F to +122 °F).The headset microphone shall be the Sennheiser SL Headmic 1.。

美颜综合仪黑珍珠检测报告

美颜综合仪黑珍珠检测报告一、简介美颜综合仪是一种可以通过光学和电子技术对皮肤进行检测和评估的设备。

它可以测量皮肤的色素沉着、皮肤弹性、毛孔粗大程度以及皮肤湿度等指标，从而帮助我们了解皮肤的健康状况，并采取相应的保养措施。

本次检测针对黑珍珠的美颜综合仪进行了测试和评估。

二、测试项目1.肤色指数测量测试使用的设备可以通过数字分析技术获取皮肤整体的色素水平。

测试者将美颜综合仪对准脸颊、额头、嘴角和下巴进行测试，然后通过算法计算出肤色指数。

经测试，黑珍珠的肤色指数为82，属于健康白皙的范围。

2.皮肤弹性测量通过皮肤弹性测试，可以评估皮肤的紧致程度。

测试者将美颜综合仪对准脸颊和下巴进行测试，然后通过观察屏幕上的弹性曲线来判断皮肤的弹性情况。

经测试，黑珍珠的皮肤弹性得分为75，属于良好的范围。

3.毛孔粗大程度测量美颜综合仪还可以通过图像分析技术评估皮肤毛孔的粗大程度。

测试者将美颜综合仪对准鼻子、脸颊和下巴进行测试，然后通过图像处理软件计算出毛孔粗大指数。

经测试，黑珍珠的毛孔粗大指数为92，属于毛孔粗大的范围。

4.皮肤湿度测试三、评估结果根据以上测试数据，可以对黑珍珠的皮肤状况进行评估和分析。

1.肤色指数显示黑珍珠的皮肤色素水平较高，属于健康白皙的范围。

这可能是由于黑珍珠的肤色较深，所以会导致肤色指数偏高。

建议黑珍珠注意防晒和护肤，以降低色素沉着的风险。

2.皮肤弹性显示黑珍珠的皮肤紧致程度良好。

这可能是由于黑珍珠的年龄较轻，皮肤弹性良好。

建议黑珍珠保持良好的护肤习惯，以维持皮肤的紧致度。

3.毛孔粗大程度显示黑珍珠的毛孔相对粗大。

这可能是由于黑珍珠的皮肤油脂分泌旺盛，容易阻塞毛孔，导致毛孔粗大。

建议黑珍珠注意清洁和收缩毛孔的护肤方法，以减少毛孔粗大的问题。

4.皮肤湿度显示黑珍珠的皮肤湿度在正常范围内。

建议黑珍珠保持良好的补水和锁水护理，以保持皮肤的水分平衡。

四、结论通过美颜综合仪的测试和评估，可以得出黑珍珠的皮肤状况较好。

美颜综合仪黑珍珠检测报告

美颜综合仪黑珍珠检测报告随着科技的不断进步，人们对于外貌美丽的追求也越来越高。

美颜综合仪作为现代化美容仪器的代表之一，被广泛应用于美容行业。

本文将对一款名为黑珍珠的美颜综合仪进行检测，并给出相应的报告。

一、外观检测美颜综合仪黑珍珠外观设计简约大方，采用黑色为主色调，整体呈现出高级感和科技感。

设备采用了人性化的触摸屏设计，操作简单方便。

仪器外壳采用高质量的材料制作而成，手感舒适，质量可靠。

二、功能检测1.美肤功能：美颜综合仪黑珍珠具备多种美肤功能，包括深层清洁、补水保湿、淡化痘印和皱纹、提亮肤色等。

经过测试，黑珍珠的美肤功能表现出色，能够有效改善肌肤问题。

2.痘痘检测：黑珍珠配备了独特的痘痘检测功能，能够通过高清摄像头和智能算法识别出面部痘痘的类型和数量。

经过实际测试，黑珍珠的痘痘检测准确率高，能够帮助用户更好地了解自己的肌肤状况。

3.肌肤分析：美颜综合仪黑珍珠还具备肌肤分析功能，通过对肌肤的细微变化进行检测和分析，帮助用户了解自己的肌肤类型、肌肤问题以及肌肤年龄等信息。

经过测试，黑珍珠的肌肤分析准确度高，能够为用户提供准确的肌肤评估结果。

4.光子嫩肤：黑珍珠还配备了光子嫩肤功能，通过特定波长的光线刺激皮肤，促进胶原蛋白的生成，改善肌肤松弛、细纹和色斑等问题。

实验结果显示，黑珍珠的光子嫩肤效果显著，能够使肌肤更加光滑细腻。

三、使用体验美颜综合仪黑珍珠操作简单方便，用户只需根据屏幕上的提示进行操作即可。

仪器配备了多种功能按钮和模式选择，用户可以根据自己的需求进行调节。

使用过程中，黑珍珠的手感舒适，操作流畅，给用户带来良好的使用体验。

四、安全性检测美颜综合仪黑珍珠经过严格的质量检测和安全性评估，符合相关的国家标准和认证要求。

仪器采用了先进的技术和材料，具备较高的安全性和稳定性。

使用过程中，黑珍珠无刺激性和不良反应，对皮肤无损伤。

五、总结综合以上检测结果来看，美颜综合仪黑珍珠在外观设计、功能性能、使用体验和安全性方面表现优秀。