MAX5230AEEE-T中文资料

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5220与5230特性 symantec NBU

备份一体机市场份额及增长趋势
2014Q3全球在PBBA市场上增长率为11.2%，我们仍然以排名第二的地位保持了37.9% YoY的增长，远高于全球的平均增长，market share比去年同期从10.4%增长到12.9%。
Symantec Appliance 引言 NetBackup™ 5230/5330 Appliance
TB = 10^12 bytes = 1,000,000,000,000 bytes
NetBackup 5330 备份一体机
• 具有高速存储的介质服务器
NetBackup 5330
• 6U 到 10U（最多 1 个扩展盘架） • 114 到 229 TB 可用容量 • 混搭 • 存储：重复数据删除或高级磁盘（非重复数据删除） • 重复数据删除：内处理或后处理 • 重复数据删除：客户端或目标端 • 连接 • 光纤通道 • 1 Gb和 10 Gb 以太网
NetBackup 21
NetBackup 5330 组件
备份一体机服务器
• 两个双端口光纤通道 HBA
光纤通道 4 x 8 Gb
主存储盘架 (RBOD)
双 RAID 控制器
60 个 3 TB 磁盘驱动器 (HDD)
SAS 4 x 24 Gb
扩展存储盘架 (EBOD)
双扩展控制器 60 个 3 TB 磁盘驱动器 (HDD)
LAN 备份数据
应用层
应用层备份层
备份层
介质管理层 FC
备份层介质管理层 FC
消重
存储
备份设备
赛门铁克NBU：优化备份架构
SAN-Client：
• 完全的介质服务器控制设备，
NBU master

MAX产品后缀说明

MAX 产品后缀说明MAX 产品后缀说明三位后缀例: MAX1675E U A温度范围封装形式管脚数四位后缀另有一些MAXIM 产品后缀用四位表示,第一位表示产品精度等级;第二位表示温度范围：精度,后三位同三位后缀的IC.第三位表示封装形式;第四位表示产品管脚数。

例如：MAX631ACPA 第一个”A”表示5%的输出温度范围C 0°C - 70°C A -40°C - +125°CI -20°C - +85°C M -55 °C - +125°CE -40°C - +85°C封装形式A SSOP(密脚表面贴装)B CERQUAD(陶瓷方形封装)C TO220,TQFP(薄的四方表贴封装)D 陶瓷SB 封装E QSOP(四方表面贴封装)F 陶瓷Flat 封装H 模块SBGA 5*5TQFP J 陶瓷双列直插K SOT L LCCM MQFP(公制四方扁平封装) N 窄体陶瓷双列直插P 塑封DIP(双列直插) Q PLCCR 窄体陶瓷DIP S SO 表面贴封装T TO5,TO99,TO100 U TSSOP,uMAX,SOTV TO39 W 宽体SOX SC70 Y 窄SBZ TO92,MQUAD /D DICE(裸片)/PR 硬塑料/W 晶原管脚数A 8 N 18B 10,64 O 42C 12,192 P 20D 14 Q 2,100E 16 R 3,84F 22,256 S 4,80G 24 T 6,160H 44 U 38,60I 28 V 8(圆脚,隔离型)J 32 W 10(圆脚,隔离型)K 5,68 X 8L 40 Y 8(圆脚,隔离型)M 7,48 Z 10(圆脚,隔离型)。

MAX4145EEE+T中文资料

1
For free samples and the latest literature, visit or phone 1-800-998-8800. For small orders, phone 1-800-835-8769.
元器件交易网
High-Speed, Low-Distortion, Differential Line Receivers MAX4144/MAX4145/MAX4146
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC to VEE) ..................................................12V Voltage on IN_, SHDN, REF, OUT, SENSE, RG_.................................(VEE - 0.3V) to (VCC + 0.3V) Short-Circuit Duration to Ground ........................................10sec Input Current (IN_, RG_)...................................................±10mA Output Current................................................................±120mA Continuous Power Dissipation (TA = +70°C) 14-Pin SO (derate 8.33mW/°C above +70°C)..............667mW 16-Pin QSOP (derate 8.33mW/°C above +70°C).........667mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10sec) .............................+300°C

MAX4590EAE-T中文资料

General DescriptionThe MAX4580/MAX4590/MAX4600 dual analog switches feature low on-resistance of 1.25Ωmax. On-resistance is matched between switches to 0.25Ωmax and is flat (0.3Ωmax) over the specified signal range. Each switch can handle Rail-to-Rail ®analog signals. The off-leakage current is only 2.5nA max at +85°C. These analog switches are ideal in low-distortion applications and are the preferred solution over mechanical relays in automat-ic test equipment or applications where current switching is required. They have low power requirements, require less board space, and are more reliable than mechanical relays.The MAX4580 has two NC (normally closed) switches,the MAX4590 has two NO (normally open) switches,and the MAX4600 has one NC (normally closed) and one NO (normally open) switch.These switches operate from a +4.5V to +36V single supply or from ±4.5V to ±20V dual supplies. All digital inputs have +0.8V and +2.4V logic thresholds, ensuring TTL/CMOS-logic compatibility when using a +12V sin-gle supply or ±15V dual supplies.ApplicationsReed Relay Replacement Test EquipmentCommunication Systems PBX, PABX SystemsFeatureso Low On-Resistance (1.25Ωmax)o Guaranteed R ON Match Between Channels (0.25Ωmax)o Guaranteed R ON Flatness Over Specified Signal Range (0.3Ωmax)o Rail-to-Rail Signal Handlingo Guaranteed ESD Protection >2kV per Method 3015.7o Single-Supply Operation: +4.5V to +36V Dual-Supply Operation: ±4.5V to ±20V o TTL/CMOS-Compatible Control InputsMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches________________________________________________________________Maxim Integrated Products119-1394; Rev 1; 6/03Ordering Information continued at end of data sheet.Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.Pin Configurations/Functional Diagrams/Truth TablesOrdering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V+ to GND..............................................................-0.3V to +44V V- to GND...............................................................+0.3V to -44V V+ to V-...................................................................-0.3V to +44V V L to GND....................................................-0.3V to (V+ + 0.3V)All Other Pins to GND (Note 1) ...........(V- - 0.3V) to (V+ + 0.3V)Continuous Current (COM_, NO_, NC_) .......................±200mA Peak Current (COM_, NO_, NC_)(pulsed at 1ms, 10% duty cycle) ..............................±300mAContinuous Power Dissipation (T A = +70°C)16 SSOP (derate 7.1mW/°C above +70°C).................571mW 16 Wide SO (derate 9.52mW/°C above +70°C) ..........762mW 16 Plastic DIP (derate 10.53mW/°C above +70°C).....842mW Operating Temperature RangesMAX4_ _0C_E ....................................................0°C to +70°C MAX4_ _0E_E ..................................................-40°C to +85°C Storage Temperature Range ...........................-65°C to +160°C Lead Temperature (soldering, 10sec) ............................+300°CELECTRICAL CHARACTERISTICS–Dual Supplies(V+ = +15V, V- = -15V, V L = +5V, V IN_H = +2.4V, V IN_L = +0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 1:Signals on NC_, NO_, COM_, or IN_ exceeding V+ or V- are clamped by internal diodes. Limit forward diode current tomaximum current rating.ELECTRICAL CHARACTERISTICS–Dual Supplies (continued)MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches (V+ = +15V, V- = -15V, V L= +5V, V IN_H= +2.4V, V IN_L= +0.8V, T A = T MIN to T MAX, unless otherwise noted. Typical values are atT A= +25°C.)_______________________________________________________________________________________3M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS–Single Supply(V+ = +12V, V- = 0, V L = +5V, V INH = 2.4V, V INL = 0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T = +25°C.)MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________5ELECTRICAL CHARACTERISTICS—Single Supply (continued)(V+ = +12V, V- = 0, V L = +5V, V IN_H = 2.4V, V IN_L = 0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 2:The algebraic convention, where the most negative value is a minimum and the most positive value a maximum, is used inthis data sheet.Note 3:Guaranteed by design.Note 4:∆R ON = R ON(MAX)- R ON(MIN).Note 5:Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over thespecified analog signal range.Note 6:Leakage parameters are 100% tested at maximum-rated hot temperature and guaranteed by correlation at +25°C.Note 7:Off-isolation = 20 log 10[V COM / (V NC or V NO )], V COM = output, V NC or V NO = input to off switch.Note 8:Between any two switches.Note 9:Leakage testing at single supply is guaranteed by testing with dual supplies.0.51.01.52.02.5-20-12-8-16-448121620ON-RESISTANCE vs. V COM(DUAL SUPPLIES)V COM (V)R O N (Ω)ON-RESISTANCE vs. V COMAND TEMPERATURE (DUAL SUPPLIES)V COM (V)R O N (Ω)129-12-9-63-360.50.60.70.80.91.01.11.20.4-1515ON-RESISTANCE vs. V COM(SINGLE SUPPLY)V COM (V)R O N (Ω)2220181614121086421234524Typical Operating Characteristics(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)Typical Operating Characteristics (continued)(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 6_______________________________________________________________________________________ON-RESISTANCE vs. V COMAND TEMPERATURE (SINGLE SUPPLY)V COM (V)R O N (Ω)11108923456710.250.500.751.001.251.501.752.002.2500120.0010.010.11100101000-4020-20406080100POWER-SUPPLY CURRENTvs. TEMPERATURETEMPERATURE (°C)I +, I - (n A )10,0000.0010.01110-4020-20406080100ON/OFF-LEAKAGE vs. TEMPERATURETEMPERATURE (°C)L E A K A G E (n A )-500-3000200400-400-100100300500-15-50-10515CHARGE INJECTIONvs. V COMV COM (V)Q (p C )10-2000-1000.011100.1100-80FREQUENCY (MHz)L O S S (d B )P H A S E (d e g r e e s )-60-40-20-90-70-50-30-10+180-720-540-360-1800-630-450-270-90+9050100150250300-4010-15356085TURN-ON/TURN-OFF TIME vs. TEMPERATURETEMPERATURE (°C)t O N , t O F F (n s )MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________7801202001602402801012111314151617181920TURN-ON/TURN-OFF TIME vs. SUPPLY VOLTAGEV+, V- (V)t O N , t O F F (n s )Typical Operating Characteristics (continued)(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)TURN-ON/TURN-OFF TIME vs. V COMV COM (V)t O N , t O F F (n s )8642-2-4-6-8120140160180200220100-1010Pin DescriptionM A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches8__________________________________________________________________________________________________Applications InformationOvervoltage ProtectionProper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maxi-mum ratings, because stresses beyond the listed rat-ings can cause permanent damage to the devices.Always sequence V+ on first, then V-, followed by the logic inputs, NO, or COM. If power-supply sequencing is not possible, add two small signal diodes (D1, D2) in series with supply pins for overvoltage protection (Figure 1). Adding diodes reduces the analog signal range to one diode drop below V+ and one diode drop above V-, but does not affect the devices’ low switch resistance and low leakage characteristics. Device operation is unchanged, and the difference between V+and V- should not exceed 44V. These protection diodes are not recommended when using a single supply.Figure 1. Overvoltage Protection Using External Blocking DiodesFigure 2. Switching-Time Test CircuitMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________9Figure 4. Off-Isolation Test Circuit Figure 5. Crosstalk Test CircuitM A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 10______________________________________________________________________________________Ordering Information (continued)___________________Chip InformationTRANSISTOR COUNT: 100Figure 6. Switch Off-Capacitance Test CircuitFigure 7. Switch On-Capacitance Test CircuitPackage InformationMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline informationgo to /packages.) Array______________________________________________________________________________________11M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches S O I C W .E P SPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)Ma xim ca nnot a ssume responsibility for use of a ny circuitry other tha n circuitry entirely embodied in a Ma xim product. No circuit pa tent licenses a re implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.。

MAX3245EETX+资料

________________General DescriptionThe MAX3224E/MAX3225E/MAX3226E/MAX3227E/MAX3244E/MAX3245E are 3V-powered EIA/TIA-232and V.28/V.24 communications interfaces with automat-ic shutdown/wakeup features, high data-rate capabili-ties, and enhanced electrostatic discharge (ESD)protection. All transmitter outputs and receiver inputs are protected to ±15kV using IEC 1000-4-2 Air-Gap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge,and ±15kV using the Human Body Model.All devices achieve a 1µA supply current using Maxim’s revolutionary AutoShutdown Plus™ feature. These devices automatically enter a low-power shutdown mode when the RS-232 cable is disconnected or the transmitters of the connected peripherals are inactive,and the UART driving the transmitter inputs is inactive for more than 30 seconds. They turn on again when they sense a valid transition at any transmitter or receiv-er input. AutoShutdown Plus saves power without changes to the existing BIOS or operating system.The MAX3225E/MAX3227E/MAX3245E also feature MegaBaud™ operation, guaranteeing 1Mbps for high-speed applications such as communicating with ISDN modems. The MAX3224E/MAX3226E/MAX3244E guar-antee 250kbps operation. The transceivers have a pro-prietary low-dropout transmitter output stage enabling true RS-232 performance from a +3.0V to +5.5V supply with a dual charge pump. The charge pump requires only four small 0.1µF capacitors for operation from a 3.3V supply. The MAX3224E–MAX3227E feature a logic-level output (READY) that asserts when the charge pump is regulating and the device is ready to begin transmitting.All devices are available in a space-saving TQFN,SSOP, and TSSOP (MAX3224E/MAX3225E/MAX3244E/MAX3245E) packages.________________________ApplicationsNotebook, Subnotebook, and Palmtop Computers Cellular PhonesBattery-Powered Equipment Hand-Held Equipment Peripherals Printers__Next Generation Device Features♦For Space-Constrained Applications:MAX3228E/MAX3229E: ±15kV ESD-Protected,+2.5V to +5.5V, RS-232 Transceivers in UCSP MAX3222E/MAX3232E/MAX3241E †/MAX3246E:±15kV ESD-Protected, Down to 10nA, +3.0V to +5.5V, Up to 1Mbps, True RS-232 Transceivers (MAX3246E Available in UCSP™)♦For Low-Voltage or Data Cable Applications:MAX3380E/MAX3381E: +2.35V to +5.5V, 1µA,2Tx/2Rx RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus________________________________________________________________Maxim Integrated Products119-1339; Rev 9; 2/07Ordering Information continued at end of data sheet.*EP = Exposed paddle.†Covered by U.S. Patent numbers 4,636,930; 4,679,134; 4,777,577;4,797,899; 4,809,152; 4,897,774; 4,999,761; 5,649,210; and other patents pending.AutoShutdown Plus, MegaBaud, and UCSP are trademarks of Maxim Integrated Products, Inc.Ordering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown PlusABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3V to +5.5V, C1–C4 = 0.1µF, tested at 3.3V ±10%; C 1= 0.047µF, C2–C4 = 0.33µF, tested at 5.0V ±10%; T A = T MIN to T MAX ,unless otherwise noted. Typical values are at T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V V+ to GND (Note 1)..................................................-0.3V to +7V V- to GND (Note 1)...................................................+0.3V to -7V V+ +⏐V-⏐(Note 1)................................................................+13V Input Voltages T_IN, FORCEON, FORCEOFF to GND................-0.3V to +6V R_IN to GND....................................................................±25V Output Voltages T_OUT to GND.............................................................±13.2V R_OUT, INVALID , READY to GND.........-0.3V to (V CC + 0.3V)Short-Circuit Duration T_OUT to GND.......................................................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin SSOP (derate 7.14mW/°C above +70°C).........571mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C)......754.7mW 16-Pin TQFN (derate 20.8mW/°C above +70°C)....1666.7mW20-Pin TQFN (derate 21.3mW/°C above +70°C)....1702.1mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...889mW 20-Pin SSOP (derate 8.00mW/°C above +70°C).........640mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C).......879mW 28-Pin Wide SO (derate 12.5mW/°C above +70°C)............1W 28-Pin SSOP (derate 9.52mW/°C above +70°C).........762mW 28-Pin TSSOP (derate 12.8mW/°C above +70°C).......1026mW 36-Pin TQFN (derate 26.3mW/°C above +70°C)...........2105mW Operating Temperature Ranges MAX32_ _EC_ _.................................................0°C to +70°C MAX32_ _EE_ _................................................-40°C to +85°C MAX32_ _EAA_..............................................-40°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10s).................................+300°C Note 1:V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.MAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V CC = +3V to +5.5V, C1–C4 = 0.1µF, tested at 3.3V ±10%; C 1= 0.047µF, C2–C4 = 0.33µF, tested at 5.0V ±10%; T A = T MIN to T MAX ,unless otherwise noted. Typical values are at T A = +25°C.)M A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus 4_______________________________________________________________________________________TIMING CHARACTERISTICS—MAX3224E/MAX3226E/MAX3244E(V CC = +3V to +5.5V, C1–C4 = 0.1µF, tested at 3.3V ±10%; C 1= 0.047µF, C2–C4 = 0.33µF, tested at 5.0V ±10%; T A = T MIN to T MAX ,unless otherwise noted. Typical values are at T A = +25°C.)TIMING CHARACTERISTICS—MAX3225E/MAX3227E/MAX3245E(V CC = +3V to +5.5V, C1–C4 = 0.1µF, tested at 3.3V ±10%; C 1= 0.047µF, C2–C4 = 0.33µF, tested at 5.0V ±10%; T A = T MIN to T MAX ,unless otherwise noted. Typical values are at T= +25°C.)Note 3:Transmitter skew is measured at the transmitter zero cross points.MAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus_______________________________________________________________________________________5-6-5-4-3-2-10123456010002000300040005000MAX3224E/MAX3226ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )246810121416010002000300040005000MAX3224E/MAX3226ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /μs )5101520253035404520001000300040005000MAX3224E/MAX3226E OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )-7.50-2.5-5.02.55.07.501000500150020002500MAX3225E/MAX3227ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )1510520253035404550010005001500200025003000MAX3225E/MAX3227E TRANSMITTER SKEW vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R S K E W (n s)807060504030201005001000150020002500MAX3225E/MAX3227ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /μs )2010403060507090801005001000150020002500MAX3225E/MAX3227E OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )20242230282636343238-40020-20406080100MAX3224E–MAX3227E READY TURN-ON TIME vs. TEMPERATURETEMPERATURE (°C)R E A D Y T U R N -O N T I M E (μs )__________________________________________Typical Operating Characteristics(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)20018016014012010080604020-40020-20406080100MAX3224E–MAX3227E READY TURN-OFF TIME vs. TEMPERATUREM A X 3224-7/44/45E -09TEMPERATURE (°C)R E A D Y T U R N -O F F T I M E (n s )M A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus 6____________________________________________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)-6-5-4-3-2-10123456010002000300040005000MAX3244ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )4286121014010002000300040005000MAX3244ESLEW RATE vs. LOAD CAPACITANCEM A X 3224-7/44/45E -11LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )302010405060020001000300040005000MAX3244EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )-7.50-2.5-5.02.55.07.50800400120016002000MAX3245ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )2010403060507090801000400800120016002000MAX3245EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )201040306050700400800120016002000MAX3245ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /μs )1510520253035404550100020003000MAX3245E TRANSMITT SKEW vs. LOAD CAPACITANCEM A X 3224-7/44/45E -16LOAD CAPACITANCE (pF)T R A N S M I T T E R S K E W (n s )MAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus_______________________________________________________________________________________7M A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus 8_______________________________________________________________________________________Dual Charge-Pump Voltage ConverterThe MAX3224E–MAX3227E/MAX3244E/MAX3245E’s internal power supply consists of a regulated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump), over the +3.0V to +5.5V range. The charge pump operates in discontinuous mode: if the output voltages are less than 5.5V, the charge pump ischarge-pump is disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies.The READY output (MAX3224E–MAX3227E) is low when the charge pumps are disabled in shutdown mode. The READY signal asserts high when V- goes below -4V.MAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus_______________________________________________________________________________________9RS-232 TransmittersThe transmitters are inverting level translators that convert CMOS-logic levels to 5.0V EIA/TIA-232 levels.The MAX3224E/MAX3226E/MAX3244E guarantee a 250kbps data rate (1Mbps, for the MAX3225E/MAX3227E/MAX3245E) with worst-case loads of 3k Ωin parallel with 1000pF, providing compatibility with PC-to-PC com-munication software (such as LapLink™). Transmitters can be paralleled to drive multiple receivers. Figure 1shows a complete system connection.When FORCEOFF is driven to ground or when the Auto-Shutdown Plus circuitry senses that all receiver and transmitter inputs are inactive for more than 30s, the transmitters are disabled and the outputs go into a high-impedance state. When powered off or shut down, the outputs can be driven to ±12V. The transmitter inputs do not have pullup resistors. Connect unused inputs to GND or V CC .Figure 1. Interface Under Control of PMUFigure 2. The MAX3244E/MAX3245E detect RS-232 activity when the UART and interface are shut down.LapLink is a trademark of Traveling Software.M A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus 10______________________________________________________________________________________RS-232 ReceiversThe receivers convert RS-232 signals to CMOS-logic output levels. The MAX3224E–MAX3227E feature inverting outputs that always remain active (Table 1).The MAX3244E/MAX3245E have inverting three-state outputs that are high impedance when shut down (FORCEOFF = GND) (Table 1).The MAX3244E/MAX3245E feature an extra, always active, noninverting output, R2OUTB. R2OUTB output monitors receiver activity while the other receivers are high impedance, allowing ring indicator applications to be monitored without forward biasing other devices connected to the receiver outputs. This is ideal for sys-tems where V CC is set to ground in shutdown to accommodate peripherals such as UARTs (Figure 2).The MAX3224E–MAX3227E/MAX3244E/MAX3245E fea-ture an INVALID output that is enabled low when no valid RS-232 voltage levels have been detected on all receiver inputs. Because INVALID indicates the receiv-er input’s condition, it is independent of FORCEON and FORCEOFF states (Figures 3 and 4).AutoShutdown Plus ModeThe MAX3224E–MAX3227E/MAX3244E/MAX3245E achieve a 1µA supplycurrent with Maxim’s AutoShutdown Plus feature, which operates when FORCEOFF is high and a FORCEON is low. When these devices do not sense a valid signal transition on any receiver and trans-mitter input for 30s, the on-board charge pumps are shut down, reducing supply current to 1µA. This occurs if the RS-232 cable is disconnected or if the connectedTable 1. Output Control Truth TableX = Don’t care*INVALID connected to FORCEON**INVALID connected to FORCEON and FORCEOFFMAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plusperipheral transmitters are turned off, and the UART dri-ving the transmitter inputs is inactive. The system turns on again when a valid transition is applied to any RS-232 receiver or transmitter input. As a result, the sys-tem saves power without changes to the existing BIOS or operating system.Figures 3a and 3b depict valid and invalid RS-232receiver voltage levels. INVALID indicates the receiver input’s condition, and is independent of FORCEON and FORCEOFF states. Figure 3 and Tables 1 and 2 sum-marize the operating modes of the MAX3224E–MAX3227E/MAX3244E/MAX3245E. FORCEON and FORCEOFF override AutoShutdown Plus circuitry.When neither control is asserted, the IC selects between these states automatically based on the last receiver or transmitter input edge received.When shut down, the device’s charge pumps turn off,V+ is pulled to V CC , V- is pulled to ground, the transmit-ter outputs are high impedance, and READY (MAX3224E–MAX3227E) is driven low. The time required to exit shutdown is typically 100µs (Figure 8).By connecting FORCEON to INVALID , the MAX3224E–MAX3227E/MAX3244E/MAX3245E shut down when no valid receiver level and no receiver or transmitter edge is detected for 30s, and wake up when a valid receiver level or receiver or transmitter edge is detected.Figure 3a. INVALID Functional Diagram, INVALID Low Figure 3b. INVALID Functional Diagram, INVALID HighFigure 3c. AutoShutdown Plus LogicFigure 3d. Power-Down LogicFigure 4a. Receiver Positive/Negative Thresholds for INVALIDM A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown PlusBy connecting FORCEON and FORCEOFF to INVALID ,the MAX3224E–MAX3227E/MAX3244E/MAX3245E shut down when no valid receiver level is detected and wake up when a valid receiver level is detected (same functionality as AutoShutdown feature on MAX3221E/MAX3223E/MAX3243E).A mouse or other system with AutoShutdown Plus may need time to wake up. Figure 5 shows a circuit that forces the transmitters on for 100ms, allowing enough time for the other system to realize that the MAX3244E/MAX3245E is awake. If the other system outputs valid RS-232 signal transitions within that time, the RS-232ports on both systems remain enabled.Software-Controlled ShutdownIf direct software control is desired, use INVALID to indicate DTR or ring indicator signal. Tie FORCEOFF and FORCEON together to bypass the AutoShutdown Plus so the line acts like a SHDN input.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostaticdischarges encountered during handling and assembly.The driver outputs and receiver inputs of the MAX3224E–MAX3227E/MAX3244E/MAX3245E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protectFigure 4b. AutoShutdown Plus, INVALID,and READY Timing DiagramFigure 5. AutoShutdown Plus Initial Turn-On to Wake Up a Mouse or Another SystemMAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plusthese pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways; the transmitter outputs and receiver inputs of this product family are characterized for protection to the following limits:1)±15kV using the Human Body Model2)±8kV using the Contact-Discharge Method specified in IEC1000-4-23)±15kV using IEC1000-4-2’s Air-Gap Method.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 6a shows the Human Body Model and Figure 6b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the test device through a 1.5k Ωresistor.Figure 6b. Human Body Current WaveformFigure 7b. IEC1000-4-2 ESD Generator Current WaveformFigure 6a. Human Body ESD Test Model Figure 7a. IEC1000-4-2 ESD Test ModelM A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus IEC1000-4-2The IEC1000-4-2 standard covers ESD testing and per-formance of finished equipment; it does not specifically refer to integrated circuits. The MAX3224E–MAX3227E,MAX3244E/MAX3245E help you design equipment that meets Level 4 (the highest level) of IEC1000-4-2, with-out the need for additional ESD-protection components.The major difference between tests done using the H uman Body Model and IEC1000-4-2 is higher peak current in IEC1000-4-2, because series resistance is lower in the IEC1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC1000-4-2 is generally lower than that measured using the H uman Body Model. Figure 7a shows the IEC1000-4-2 model and Figure 7b shows the current waveform for the 8kV,IEC1000-4-2, Level 4, ESD Contact-Discharge Method.The Air-Gap Method involves approaching the device with a charged probe. The Contact-Discharge Method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just RS-232 inputs and outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.__________Applications InformationCapacitor SelectionThe capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitorscan be used. The charge pump requires 0.1µF capaci-tors for 3.3V operation. For other supply voltages, see Table 3 for required capacitor values. Do not use val-ues smaller than those listed in Table 3. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1without also increasing the values of C2, C3, C4,and C BYPASS , to maintain the proper ratios (C1 to the other capacitors).When using the minimum required capacitor values,make sure the capacitor value does not degrade excessively with temperature. If in doubt, use capaci-tors with a larger nominal value. The capacitor’s equiv-alent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+and V-.Power-Supply DecouplingIn most circumstances, a 0.1µF V CC bypass capacitor is adequate. In applications that are sensitive to power-supply noise, use a capacitor of the same value as charge-pump capacitor C1. Connect bypass capaci-tors as close to the IC as possible.Transmitter Outputs when Exiting ShutdownFigure 8 shows two transmitter outputs when exiting shutdown mode. As they become active, the two trans-mitter outputs are shown going to opposite RS-232 lev-els (one transmitter input is high, the other is low). Each5μs/divV CC = 3.3V C1–C4 = 0.1μFFigure 8. Transmitter Outputs when Exiting Shutdown or Powering Uptransmitter is loaded with 3k Ωin parallel with 1000pF.The transmitter outputs display no ringing or undesir-able transients as they come out of shutdown. Note that the transmitters are enabled only when the magnitude of V- exceeds approximately -3V.High Data RatesThe MAX3224E/MAX3226E/MAX3244E maintain the RS-232 ±5.0V minimum transmitter output voltage even at high data rates. Figure 9 shows a transmitter loop-back test circuit. Figure 10 shows a loopback test result at 120kbps, and Figure 11 shows the same test at 250kbps. For Figure 10, all transmitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 11, a single transmitter was dri-ven at 250kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 250pF.The MAX3225E/MAX3227E/MAX3245E maintain the RS-232 ±5.0V minimum transmitter output voltage at data rates up to 1Mbps (MegaBaud). Figure 12 shows a loopback test result with a single transmitter driven at 1Mbps and all transmitters loaded with an RS-232receiver in parallel with 250pF.MAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown PlusFigure 9. Loopback Test CircuitFigure 10. MAX3224E/MAX3226E/MAX3244E Loopback Test Result at 120kbps2μs/divV CC = 3.3VFigure 11. MAX3224E/MAX3226E/MAX3244E Loopback Test Result at 250kbps2μs/divV CC = 3.3VFigure 12. MAX3225E/MAX3227E/MAX3245E Loopback Test Result at 1Mbps200ns/div5V/div5V/div5V/divV CC = 3.3VM A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus Figure 13a. Mouse Driver Test CircuitMAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown PlusMouse DriveabilityThe MAX3244E/MAX3245E are specifically designed to power serial mice while operating from low-voltage power supplies. They have been tested with leading mouse brands from manufacturers such as Microsoft and Logitech. The MAX3244E/MAX3245E successfully drove all serial mice tested and met their respective current and voltage requirements. The MAX3244E/MAX3245E dual charge pump ensures the transmitters supply at least ±5V during worst-case conditions.Figure 13b shows the transmitter output voltages under increasing load current. Figure 13a shows a typical mouse connection.Interconnection with 3V and 5V LogicThe MAX3224E–MAX3227E/MAX3244E/MAX3245E can directly interface with various 5V logic families, includ-ing ACT and HCT CMOS. See Table 4 for more informa-tion on possible combinations of interconnections.Table 5 lists other Maxim ESD-powered transceivers.Table 5. ±15kV ESD-Protected, 3.0V to 5.5V Powered RS-232 Transceivers from MaximM A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus___________________________________________________Typical Operating CircuitsMAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus___________________________________________________________Pin ConfigurationsM A X 3224E –M A X 3227E /M A X 3244E /M A X 3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus ___________________________________________Ordering Information (continued)___________________Chip InformationMAX3224E TRANSISTOR COUNT: 1129MAX3225E TRANSISTOR COUNT: 1129MAX3226E TRANSISTOR COUNT: 1129MAX3227E TRANSISTOR COUNT: 1129MAX3244E/MAX3245E TRANSISTOR COUNT: 1335PROCESS: BICMOS*EP = Exposed paddle.MAX3224E–MAX3227E/MAX3244E/MAX3245E †±15kV ESD-Protected, 1µA, 1Mbps 3.0V to 5.5V ,RS-232 Transceivers with AutoShutdown Plus______________________________________________________________________________________21Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

SI-30 chinese manual

2.1. 系统概述 ...................................................................................................................5 2.2. 特点...........................................................................................................................5
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自动识别系统 SI-30 中文操作说明书

目
录
1. 缩写.....................................................................................................................................5 2. 概要.....................................................................................................................................5
2.1.1. 主要信息 ........................................................................................

maxim integrated products , ds5230 , ip security m

DS5230IP Security Microcontroller________________________________________________________________Maxim Integrated Products 1For pricing, delivery, and ordering information,please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Note:Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, contact the factory.ABRIDGED DATA SHEETGeneral DescriptionThe DS5230 is a highly secure, four clocks-per-ma chine cycle, 100% 8051-instruction-set-compa tible microprocessor in the secure microcontroller fa mily from Maxim Integrated Products. It is a feature-reduced and cost-reduced version of the popular DS5250 high-speed secure microcontroller. Its proven a rchitecture protects embedded a pplica tion softwa re a nd da ta against reverse engineering or cloning. A key feature of the device is that it encrypts its program memory with a ha rdwa re-ba sed single- or triple-DES (da ta encryption standard) algorithm and provides optional data memory encryption, making it almost impossible to extract infor-ma tion. It a lso implements block cipher encoding tha t uses block a ddresses to modify the encrypted da ta ,further strengthening security. This ma kes the device idea l for stora ge a nd tra nsmission of pa sswords, per-sona l identifica tion numbers, encryption keys, a nd other highly confidential information.ApplicationsPIN PadsGaming MachinesSoftware-Protection ApplicationsFeatures♦Feature-Rich, 8051-Compatible MicroprocessorAccesses Up to 64KB Program and 64KB Data Memory (All Nonvolatile)In-System Programmable Through Serial Port Three 16-Bit Timer/Counters 256 Bytes of Scratchpad RAM ♦Advanced FeaturesCRC-16/32 Generator2KB Battery-Backed (Nonvolatile) Internal SRAMDedicated Single DES or 3DES Engine for Automatic Program Memory Encryption ♦High-Speed ArchitectureFour Clocks-per-Machine Cycle DC-to-25MHz OperationSingle-Cycle Instruction in 160ns Dual Data Pointers Can Increment or Decrement IndependentlyAutomatic Data Pointer (DPTR) Selection AvailableProgrammable Speed MOVX Instructions 1KB On-Chip Instruction Cache ♦High-Reliability OperationPower-Fail/Overvoltage ResetEarly Warning Power-Fail Interrupt Watchdog Timer♦Security FeaturesExecutes Single/3DES-Encrypted Programs to Prevent Observation One Self-Destruct Input Tamper-Sensing Mesh Detects Probe Attacks Programmable Attack Countermeasures True Random-Number Generator (RNG)Program Memory Integrity Checking♦DS5230 Evaluation Kit Available (DS5230-KIT)Ordering Information+Denotes a lead-free/RoHS-compliant package.PART TEMP RANGE MAX CLOCKSPEED(MHz)PIN-PACKAGEDS5230F+825 0°C to +70°C 25 80 MQFPDS5230F+8N5 -40°C to +85°C 25 80 MQFPPin Configuration appears at end of data sheet.D S 5230IP Security Microcontroller 10______________________________________________________________________________________ABRIDGED DATA SHEETFigure 4. Block DiagramNote to readers:This document is an abridged version of the full data sheet. To request the full data sheet, go to /DS5230and click on Request Full Data Sheet .。

MAX5231AEEE-T中文资料

General DescriptionThe MAX5230/MAX5231 low-power, dual 12-bit voltage-output digital-to-analog converters (DACs) feature an internal 10ppm/°C precision bandgap voltage reference and precision output amplifiers. The MAX5231 operates on a single 5V supply with an internal 2.5V reference and features a 4.095V full-scale output range. The MAX5230operates on a single 3V supply with an internal 1.25V ref-erence and features a 2.0475V full-scale output range.The MAX5231 consumes only 470µA while the MAX5230consumes only 420µA of supply current. Both devices feature low-power (2µA) software- and hardware-enabled shutdown modes.The MAX5230/MAX5231 feature a 13.5MHz SPI ™-,QSPI ™-, and MI CROWI RE™-compatible 3-wire serial interface. An additional data output (DOUT) allows for daisy-chaining and read back. Each DAC has a double-buffered digital input. The MAX5230/MAX5231 feature two software-selectable shutdown output impedances:1k Ωor 200k Ω. A power-up reset feature sets DAC out-puts at ground or at the midscale DAC code.The MAX5230/MAX5231 are specified over the extended temperature range (-40°C to +85°C) and are available in 16-pin QSOP packages.ApplicationsIndustrial Process Controls Automatic Test Equipment Digital Offset and Gain Adjustment Motion Control µP-Controlled SystemsFeatures♦Internal 10ppm/°C Precision Bandgap Reference2.465V (MAX5231)1.234V (MAX5230)♦Single-Supply Operation5V (MAX5231)3V (MAX5230)♦Low Supply Current470µA (MAX5231)420µA (MAX5230)♦13.5MHz SPI/QSPI/MICROWIRE-Compatible, 3-Wire Serial Interface ♦Pin-Programmable Power-Up Reset State to Zero or Midscale Output Voltage ♦Programmable Shutdown Modes with 1k Ωor 200k ΩInternal Output Loads ♦Recalls Output State Prior to Shutdown or Reset ♦Buffered Output Drives 5k Ω|| 100pF Loads ♦Space-Saving 16-Pin QSOP PackageMAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference________________________________________________________________Maxim Integrated Products 1Ordering Information19-2332; Rev 2; 9/08For pricing delivery, and ordering information please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Functional Diagram appears at end of data sheet.SPI and QSPI are trademarks of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor, Corp.Pin Configuration+M A X 5230/M A X 52313V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS—MAX5231Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V DD to AGND, DGND...............................................-0.3V to +6V AGND to DGND.....................................................-0.3V to +0.3V Digital Inputs to DGND.............................................-0.3V to +6V Digital Output (DOUT) to DGND...................-0.3V to V DD + 0.3V OUT_ to AGND.............................................-0.3V to V DD + 0.3V OS_ to AGND...................................................-4V to V DD + 0.3VMaximum Current into Any Pin............................................50mA Continuous Power Dissipation (T A = +70°C)16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS—MAX5231 (continued)(V DD = +4.5V to +5.5V, OS_ = AGND = DGND = 0, R L = 5k Ω, C L = 100pF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T= +25°C.)ELECTRICAL CHARACTERISTICS—MAX5230(V= +2.7V to +3.6V, OS_ = AGND = DGND = 0, R = 5k Ω, C = 100pF, T = T to T , unless otherwise noted. Typical valuesM A X 5230/M A X 52313V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—MAX5230 (continued)(V DD = +2.7V to +3.6V, OS_ = AGND = DGND = 0, R L = 5k Ω, C L = 100pF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T= +25°C.)MAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal ReferenceNote 1:Note 2:Note 3:∆V OUT over the temperature range isdivided by ∆T.Note 4:DC crosstalk is measured as follows: set DAC A to midscale, and DAC B to zero, and measure DAC A output; then changeDAC B to full scale, and measure ∆V OUT for DAC A. Repeat the same measurement with DAC A and DAC B interchanged.DC crosstalk is the maximum ∆V OUT measured.Note 5:Accuracy is better than 1LSB for V OUT_= 10mV to V DD - 180mV. Note 6:Guaranteed by design, not production tested.Note 7:R LOAD = ∞and digital inputs are at either V DD or DGND.TIMING CHARACTERISTICS—MAX5231(V DD = +4.5V to +5.5V, AGND = DGND = 0, T A = T MINto T MAX , unless otherwise noted. Typical values are at T A = +25°C.) ELECTRICAL CHARACTERISTICS—MAX5230 (continued)(V = +2.7V to +3.6V, OS_ = AGND = DGND = 0, R = 5k Ω, C = 100pF, T = T to T , unless otherwise noted. Typical valuesM A X 5230/M A X 52313V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 6_______________________________________________________________________________________TIMING CHARACTERISTICS—MAX5230(V DD = +2.7V to +3.6V, AGND = DGND = 0, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)contents.INTEGRAL NONLINEARITYvs. DIGITAL INPUT CODE (MAX5230)M A X 5230/M A X 5231 t o c 01DIGITAL INPUT CODEI N L (L S B )40003500300025002000150010005000-0.10-0.0500.050.100.15-0.15INTEGRAL NONLINEARITYvs. DIGITAL INPUT CODE (MAX5231)M A X 5230/M A X 5231 t o c 02DIGITAL INPUT CODEI N L (L S B )40003500300025002000150010005000-0.10-0.0500.050.100.15-0.15DIFFERENTIAL NONLINEARITY vs. DIGITAL INPUT CODE (MAX5230)M A X 5230/M A X 5231 t o c 03DIGITAL INPUT CODED N L (L S B )40003500300025002000150010005000-0.283-0.0370.0860.208-0.160Typical Operating Characteristics(V DD = +3V (MAX5230), V DD = +5V (MAX5231), R L = 5k Ω, C L = 100pF, OS_ = AGND, both DACs enabled with full-scale output code,T A = +25°C, unless otherwise noted.)MAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference_______________________________________________________________________________________7DIFFERENTIAL NONLINEARITY vs. DIGITAL INPUT CODE (MAX5231)M A X 5230/M A X 5231 t o c 04DIGITAL INPUT CODED N L (L S B )40003500300025002000150010005000-0.10-0.0500.050.100.15-0.15SUPPLY CURRENT vs. TEMPERATURE(MAX5230)M A X 5230/M A X 5231 t o c 05TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )603510-15410420430440450400-4085SUPPLY CURRENT vs. TEMPERATURE(MAX5231)M A X 5230/M A X 5231 t o c 06TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )603510-15410420430440450400-4085SUPPLY CURRENT vs. SUPPLY VOLTAGE(MAX5230)M A X 5230/M A X 5231 t o c 07SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )3.33.04054104154204254304002.73.6SUPPLY CURRENT vs. SUPPLY VOLTAGE(MAX5231)M A X 5230/M A X 5231 t o c 08SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )5.255.004.754654704754804854904604.505.50FULL POWER-DOWN SUPPLY CURRENTvs. TEMPERATURE (MAX5230)TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )6035-15100.450.500.550.600.650.700.750.800.40-4085TWO-DACs SHUTDOWN SUPPLY CURRENTvs. TEMPERATURE (MAX5230)TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )603510-15205210215220225230200-4085ONE-DAC SHUTDOWN SUPPLY CURRENTvs. TEMPERATURE (MAX5230)TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )603510-15305310315320325330300-4085FULL POWER-DOWN SUPPLY CURRENTvs. TEMPERATURE (MAX5231)TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )6035-15100.50.60.70.80.91.01.11.20.4-4085Typical Operating Characteristics (continued)(V DD = +3V (MAX5230), V DD = +5V (MAX5231), R L = 5k Ω, C L = 100pF, OS_ = AGND, both DACs enabled with full-scale output code, T A = +25°C, unless otherwise noted.)M A X 5230/M A X 52313V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 8_______________________________________________________________________________________Typical Operating Characteristics (continued)(V DD = +3V (MAX5230), V DD = +5V (MAX5231), R L = 5k Ω, C L = 100pF, OS_ = AGND, both DACs enabled with full-scale output code, T A = +25°C, unless otherwise noted.)TWO-DACs SHUTDOWN SUPPLY CURRENTvs. TEMPERATURE (MAX5231)TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )603510-15230235240245250255225-4085ONE-DAC SHUTDOWN SUPPLY CURRENTvs. TEMPERATURE (MAX5231)TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )603510-15355360365370375380350-4085FULL-SCALE OUTPUT VOLTAGE vs. TEMPERATURE (MAX5230)TEMPERATURE (°C)F U L L -S C A L E O U T P U T V O L T AG E (V )603510-152.04652.04702.04752.04802.0460-4085FULL-SCALE OUTPUT VOLTAGE vs. TEMPERATURE (MAX5231)TEMPERATURE (°C)F U L L -S C A L E O U T P U T V O L T AG E (V )603510-154.09154.09204.09254.09304.09354.09404.0910-4085FULL-SCALE ERROR vs. RESISTIVE LOAD(MAX5230)RESISTIVE LOAD (k Ω)F U L L -S C A L E E R R O R (L S B )6.55.54.53.50.050.100.150.200.250.300.3502.57.5FULL-SCALE ERROR vs. RESISTIVE LOAD(MAX5231)RESISTIVE LOAD (k Ω)F U L L -S C A L E E R R O R (L S B )6.55.54.53.50.050.100.150.200.252.57.5DYNAMIC RESPONSE RISE TIME(MAX5230)MAX5230/MAX5231 toc192µs/divV OUT 500mV/divV CS 2V/div2.048V3V 010mVDYNAMIC RESPONSE RISE TIME(MAX5231)MAX5230/MAX5231 toc202µs/divV OUT 1V/divV CS 5V/div4.096V5V 010mVDYNAMIC RESPONSE FALL TIME(MAX5230)MAX5230/MAX5231 toc212µs/divV OUT 500mV/divV CS 2V/div2.048V3V 010mVMAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference_______________________________________________________________________________________9DYNAMIC RESPONSE FALL TIME(MAX5231)MAX5230/MAX5231 toc222µs/divVOUT 1V/divV CS 5V/div4.096V5V 010mVANALOG CROSSTALK(MAX5230)MAX5230/MAX5231 toc23400µs/div OUTB 5mV/div AC-COUPLED OUTA 2V/div ANALOG CROSSTALK(MAX5231)MAX5230/MAX5231 toc24400µs/divOUTB 5mV/div AC-COUPLEDOUTA 5V/divDIGITAL FEEDTHROUGH(MAX5230)MAX5230/MAX5231 toc2510µs/div OUTA 1mV/div AC-COUPLED SCLK 2V/div DIGITAL FEEDTHROUGH(MAX5231)MAX5230/MAX5231 toc2610µs/div OUTA 1mV/div AC-COUPLEDSCLK 5V/div MAJOR-CARRY TRANSITION(MAX5230)MAX5230/MAX5231 toc272µs/divOUTA 100mV/div AC-COUPLEDCS 5V/divMAJOR-CARRY TRANSITION(MAX5231)MAX5230/MAX5231 toc282µs/div OUTA 100mV/div AC-COUPLEDCS 5V/divREFERENCE VOLTAGE vs. TEMPERATURE (MAX5230)TEMPERATURE (°C)R E F E R E N C E V O L T A G E (V )603510-151.23351.23401.23451.23501.2330-4085REFERENCE VOLTAGEvs. TEMPERATURE (MAX5231)TEMPERATURE (°C)R E F E R E N C E V O L T A G E (V )603510-152.46152.46202.46252.46302.4610-4085Typical Operating Characteristics (continued)(V DD = +3V (MAX5230), V DD = +5V (MAX5231), R L = 5k Ω, C L = 100pF, OS_ = AGND, both DACs enabled with full-scale output code, T A = +25°C, unless otherwise noted.)M A X 5230/M A X 52313V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 10______________________________________________________________________________________Detailed DescriptionThe MAX5230/MAX5231 12-bit, voltage-output DACs are easily configured with a 3-wire SPI -, QSPI -,MI CROWI RE-compatible serial interface. The devices include a 16-bit data-in/data-out shift register and have an input consisting of an input register and a DAC reg-ister. I n addition, these devices employ precision trimmed internal resistors to produce a gain of 1.6384V/V, maximizing the output voltage swing, and a programmable-shutdown output impedance of 1k Ωor 200k ΩThe full-scale output voltage is 4.095V for the MAX5231 and 2.0475V for the MAX5230. These devices produce a weighted output voltage proportion-al to the digital input code with an inverted rail-to-rail ladder network (Figure 3).Internal ReferenceThe MAX5230/MAX5231 use an on-board precision bandgap reference to generate an output voltage of 1.234V (MAX5230) or 2.465V (MAX5231). With a low temperature coefficient of only 10ppm/°C, REF can source up to 100µA and is stable for capacitive loads less than 35pF.Output AmplifiersThe output amplifiers have internal resistors that pro-vide for a gain of 1.6384V/V when OS_ is connected to AGND. The output amplifiers have a typical slew rate of0.6V/µs and settle to 1/2LSB within 10µs with a load of 5k Ωin parallel with 100pF. Use the serial interface to set the shutdown output impedance of the amplifiers to 1k Ωor 200k Ω.OS_ can be used to produce an offset voltage at the output. For instance, to achieve a 1V offset, apply -1V to OS_ to produce an output range from 1V to (1V +V FS /V REF ). Note that the DAC’s output range is still lim-ited by the maximum output voltage specification.MAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference______________________________________________________________________________________11Figure 3. Simplified DAC Circuit DiagramM A X 5230/M A X 5231The 3-wire serial interface (SPI , QSPI , MI CROWI RE compatible) used in the MAX5230/MAX5231 allows for complete control of DAC operations (Figures 4 and 5).Figures 1 and 2 show the timing for the serial interface.The serial word consists of 3 control bits followed by 12data bits (MSB first) and 1 sub-bit as described in Tables 1, 2, and 3. When the 3 control bits are all zero or all 1, D11–D8 are used as additional control bits,allowing for greater DAC functionality.The digital inputs allow any of the following: loading the input register(s) without updating the DAC register(s),updating the DAC register(s) from the input register(s),or updating the input and DAC register(s) simultane-ously. The control bits and D11–D8 allow the DACs to operate independently.Send the 16-bit data as one 16-bit word (QSPI) or two 8-bit packets (SPI , MI CROWI RE), with CS low during this period. The control bits and D11–D8 determine which registers update and the state of the registers when exiting shutdown. The 3-bit control and D11–D8determine the following:•Registers to be updated•Selection of the power-down and shutdown modes The general timing diagram of Figure 1 illustrates data acquisition. Driving CS low enables the device to receive data. Otherwise the interface control circuitry is disabled. With CS low, data at DIN is clocked into the register on the rising edge of SCLK. As CS goes high,data is latched into the input and/or DAC registers,depending on the control bits and D11–D8. The maxi-mum clock frequency guaranteed for proper operation is 13.5MHz. Figure 2 depicts a more detailed timing diagram of the serial interface.3V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 12______________________________________________________________________________________Power-Down and Shutdown ModesAs described in Tables 2 and 3, several serial interface commands put one or both of the DACs into shutdown mode. Shutdown modes are completely independent for each DAC. I n shutdown, the amplifier output be-comes high impedance, and OUT_ terminates to OS_through the 200k Ω(typ) gain resistors. Optionally (see Tables 2 and 3), OUT_ can have an additional termina-tion of 1k Ωto AGND.Full power-down mode shuts down the main bias gene-rator, reference, and both DACs. The shutdown impe-dance of the DAC outputs can still be controlled independently, as described in Tables 2 and 3.A serial interface command exits shutdown mode and updates a DAC register. Each DAC can exit shutdown at the same time or independently (see Tables 2 and 3). For example, if both DACs are shut down, updating the DAC A register causes DAC A to power up, while DAC B remains shut down. I n full power-down mode,powering up either DAC also powers up the main bias generator and reference. To change from full power-down to both DACs shutdown requires the waking of at least one DAC between states.When powering up the MAX5230/MAX5231 (powering V DD ), allow 400µs (max) for the output to stabilize. When exiting full power-down mode, also allow 400µs (max) for the output to stabilize. When exiting DAC shutdown mode, allow 160µs (max) for the output to stabilize.Reset Value (RSTV) andClear (CLR ) InputsDriving CLR low asynchronously forces both DAC out-puts and all the internal registers (input registers and DAC registers) for both DACs to either zero or midscale,depending on the level at RSTV. RSTV = DGND sets the zero value, and RSTV, = V DD sets the midscale value.The internal power-on reset circuit sets the DAC out-puts and internal registers to either zero or midscale when power is first applied to the device, depending on the level at RSTV as described in the preceding para-graph. The DAC outputs are enabled after power is first applied. I n order to obtain the midscale value on power-up (RSTV = V DD ), the voltage on RSTV must rise simultaneously with the V DD supply.Load DAC Input (LDAC )Asserting LDAC asynchronously loads the DAC registers from their corresponding input registers (DACs that are shut down remain shut down). The LDAC input is totally asynchronous and does not require any activity on CS ,SCLK, or DIN in order to take effect. If LDAC is asserted coincident with a rising edge of CS,which executes a serial command modifying the value of either DAC input register, then LDAC must remain asserted for at least 30ns following the CS rising edge. This requirement applies only for serial commands that modify the value of the DAC input registers.Power-Down Lockout Input (PDL )Driving PDL low disables shutdown of either DAC. When PDL is low, serial commands to shut down either DAC are ignored. When either DAC is in shutdown mode, a high-to-low transition on PDL brings the DACs and the refer-ence out of shutdown with DAC outputs set to the state prior to shutdown.MAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference13Figure 4. SPI/QSPI Interface ConnectionsFigure 5. Connections for MICROWIREM A X 5230/M A X 5231Applications InformationDefinitionsIntegral Nonlinearity (INL)Integral nonlinearity (Figure 6a) is the deviation of the val-ues on an actual transfer function from a straight line.This straight line can be either a best-straight-line fit (closest approximation to the actual transfer curve) or a line drawn between the endpoints of the transfer func-tion, once offset and gain errors have been nullified. For a DAC, the deviations are measured at every single step.Differential Nonlinearity (DNL)Differential nonlinearity (Figure 6b) is the difference between an actual step height and the ideal value of 1LSB. If the magnitude of the DNL is less than 1LSB, the DAC guarantees no missing codes and is monotonic.Offset ErrorThe offset error (Figure 6c) is the difference between the ideal and the actual offset point. For a DAC, the off-set point is the step value when the digital input is zero.This error affects all codes by the same amount and can usually be compensated for by trimming.Gain ErrorGain error (Figure 6d) is the difference between the ideal and the actual full-scale output voltage on the transfer curve, after nullifying the offset error. This error alters the slope of the transfer function and corre-sponds to the same percentage error in each step.Settling TimeThe settling time is the amount of time required from the start of a transition, until the DAC output settles to its new output value within the converter’s specified accuracy.3V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 14Digital feedthrough is noise generated on the DAC’s output when any digital input transitions. Proper board layout and grounding significantly reduce this noise,but there is always some feedthrough caused by the DAC itself.Unipolar OutputFigure 7 shows the MAX5230/MAX5231 configured for unipolar, rail-to-rail operation. The MAX5231 produces a 0 to 4.095V output, while the MAX5230 produces 0 to 2.0475V output. Table 4 lists the unipolar output codes.Digital Calibration and Threshold SelectionFigure 8 shows the MAX5230/MAX5231 in a digital cali-bration application. With a bright light value applied to the photodiode (on), the DAC is digitally ramped until it trips the comparator. The microprocessor (µP) stores this “high” calibration value. Repeat the process with a dim light (off) to obtain the dark current calibration. The µP then programs the DAC to set an output voltage at the midpoint of the two calibrated values. Applications include tachometers, motion sensing, automatic read-ers, and liquid clarity analysis.Sharing a Common DIN LineSeveral MAX5230/MAX5231s may share one common DIN signal line (Figure 9). In this configuration, the data bus is common to all devices; data is not shifted through a daisy-chain. The SCLK and DIN lines are shared by all devices, but each IC needs its own dedicated CS line.Daisy-Chaining DevicesAny number of MAX5230/MAX5231s can be daisy-chained by connecting the serial data output (DOUT) of one device to the digital input (DI N) of the following device in the chain (Figure 10).MAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference______________________________________________________________________________________15M A X 5230/M A X 5231Power-Supply and BypassingConsiderationsOn power-up, the input and DAC registers are cleared to either zero (RSTV = DGND) or midscale (RSTV =V DD ). Bypass V DD with a 4.7µF capacitor in parallel with a 0.1µF capacitor to AGND, and bypass V DD with a 0.1µF capacitor to DGND. Minimize lead lengths to reduce lead inductance.Grounding and Layout ConsiderationsDigital and AC transient signals on AGND or DGND can create noise at the output. Connect AGND and DGND to the highest quality ground available. Use propergrounding techniques, such as a multilayer board with a low-inductance ground plane or star connect all ground return paths back to the MAX5230/MAX5231 AGND.Carefully lay out the traces between channels to reduce AC cross-coupling and crosstalk. Wire-wrapped boards and sockets are not recommended. I f noise becomes an issue, shielding may be required.Chip InformationTRANSISTOR COUNT: 4745PROCESS: BiCMOS3V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference 16______________________________________________________________________________________Figure 9. Multiple MAX5230/MAX5231s Sharing a Common DIN LineMAX5230/MAX52313V/5V , 12-Bit, Serial Voltage-Output Dual DACswith Internal Reference______________________________________________________________________________________17Functional DiagramPackage InformationFor the latest package outline information and land patterns, go to /packages .M A X 5230/M A X 52313V/5V , 12-Bit, Serial Voltage-Output Dual DACs with Internal Reference Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.18____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2008 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.。

MAXTRAC 系列产品部件清单说明书

REF.NO.PART NO.DESCRIPTIONREF.NO.PART NO.DESCRIPTIONMAXTRAC 50/100 AND 820 SERIES202680223M05Shield, PA, VHF &UHF 202680223M05Shield, PA, 800 MHz 210980131M01Connector, antenna 222680124L03Heatsink, UHF &VHF 222680124L02Heatsink, 800 MHz 230980255E01Connector, power240310943M10Taptite Screw (M3 x 8); 8 used 250380271L01Machine Screw (M4 x 17); 2 used 260380043L01Taptite Screw (M3 x 10); 2 used 270400131974Washer; 2 used281580076M01Housing, accessory connector 297580918T02Pad, shock insulating; 5 used 300400002636Washer, int loc313280014N02Gasket, accessory connector 321380276L02Escutcheon, 2 frequencyNON-REFERENCED ITEMS:HLN5184B Switchboard 3380017N14Nameplate10380270L01Front Mounting Screws; 2 used 21580129L01Control Head Housing 33680144M01Control Knob 45080085D02Speaker54280253L01Speaker Retainer; 4 used 60310945A11Plastic Screw; 9 used 73880272L02Push Button; 2 used 84380273L01Push Button Spacer 97580200L01Keypad102900129883Wire Wrap; 2 used 110780037M01Bracket, switch board 122780128L04Chassis Frame 131580953T01Cover, VCO shield 142680038M03Shield, chassis RF150310943M09Taptite Screw (M3 x 6); 12 used 161580127L01Cover, housing; 2 used 171580124M01Cover, logic shield180310943R55Taptite Screw (M3 x 8, flathead); 4 used190310943R04Taptite Screw (M2.5 x 8, flathead); 2 usedREF.NO.PART NO.DESCRIPTIONREF.NO.PART NO.DESCRIPTIONMAXTRAC 300 AND 840 SERIES232680223M05Shield, PA, VHF&UHF232680223M05Shield, PA, 800 MHz240980131M01Connector, antenna252680124L03Heatsink, UHF &VHF252680124L02Heatsink, 800 MHz260980255E01Connector, power270310943M10Taptite Screw (M3 x 3); 8 used280380271L01Machine Screw (M4 x 27); 2 used290380043L01Taptite Screw (M3 x 10); 2 used300400131974Washer; 2 used313280039M01Gasket321580076M01Housing, accessory connector337580918T02Pad, shock insulating; 5 used340400002636Washer, int loc353280014N02Gasket, accessory connector361380277L01Escutcheon (16 freq. models)NON-REFERENCED ITEMS:HLN5184B Switchboard3380017N14NameplateNOTE: The part number for the speaker lead assembly,including connector P10 and two lugs, is 0180747T30.10380270L01Front Mounting Screws; 2 used 21580129L01Control Head Housing33680144M01Control Knob45080085D02Speaker54280253L01Speaker Retainer; 4 used 60310945A11Plastic Screw; 9 used73880272L02Push Button(6 freq. models); 3 used(16 freq. models); 5 used 84380274L01Push Button Spacer (1 x 2) 94380275L01Push Button Spacer (1 x 3) 107580201L01Keypad113880077N01Button Plug; 2 used123280907T01Gasket (6 freq. models only); 2 used 132900129883Wire Wrap; 2 used140780037M01Bracket Switch Board152780128L04Chassis Frame161580953T01Cover, VCO shield172680038M03Shield, chassis, RF180310943M09Taptite Screw (M3 x 6); 12 used 191580127L01Cover, housing; 2 used 201580124M01Cover, logic shield210310943R55Taptite Screw (M3 x 8, flathead);4 used220310943R04Taptite Screw (M2.5 x 8, flathead);2 usedMICROPHONESHSN4019B HMN1035CMOUNTING HARDWARE HLN4426AIGNITION SWITCH CABLEAccessories, Antennas ANTENNA ADAPTERHAD4008AHAD4006AVHF ANTENNASHAD4010ARAD4002ARA HAD4013AVHF ANTENNAHAE4003ARAE4022ARAUHF ANTENNAS800 MHZ ANTENNASRAF4011ARLRRA4933ASERVICE TOOLSRLN4008B RSX4043A6680163F010180357A57Service Aids, Manuals SERVICE AIDSHMN1035CHLN4426AHSN4019BHKN9327AEmergency Alarm 3dB, roof top w/14 ft. cable (890-960 MHz)3dB, roof top w/22 ft. cable 1/4 Wave, roof top (136-144 MHz)1/4 Wave, roof top (144-152 MHz)1/4 Wave, roof top (150.8-162 MHz)1/4 Wave, roof top (162-174 MHz)3dB, roof top (136-174 MHz)1/4 Wave, roof top (403-430 MHz)1/4 Wave, roof top (450-470 MHz)1/4 Wave, roof top (470-512 MHz)3.5dB, roof top (406-420 MHz)3.5dB, roof top (450-470 MHz)3.5dB, roof top (470-495 MHz)3.5dB, roof top (494-512 MHz)1/4 Wave Base Loaded Antenna 1/4 Wave Base Loaded Antenna 1/4 Wave Base Loaded Antenna HMN3000BHLN9330BHPN4002B HAE4013A。

ZD5232A中文资料(Cystech Electonics)中文数据手册「EasyDatasheet - 矽搜」

3.0
6.0
3.0
6.5
3.0
6.5
3.0
7.0
3.0
8.0
2.0
8.4
1.0
9.1
0.5
9.9
0.1
11
0.1
12
0.1
14
0.1
15
0.1
17
0.1
18
0.1
21
0.1
21
0.1
23
0.1
25
0.1
27
0.1
30
0.1
33
芯片中文手册,看全文,戳
规格.编号：C326SH 发布日期：2009.10.07
ZD5252A K2 24 23.52 24.48 33 5.2 600
ZD5254A K4 27 26.46 27.54 41 5.0 600
ZD5255A K5 28 27.44 28.56 44 4.5 600
ZD5256A M1 30 29.40 30.60 49 4.2 600
ZD5257A M2 33 32.34 33.66 58 3.8 700
°C
最大正向电压@ I
F=10mA ………………………………………………………........0.9V
最大功率耗散
总功率耗散@T 热阻,结到环境空气ř
L=75 °C Ptot （注1） ................................................... 500毫瓦
ZD5223A C3 2.7 2.65 2.75
30 20 1300
ZD5225A C5 3.0 2.94 3.06
30 20 1600

MAX532 资料官方文档

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Call toll free 1-800-998-8800 for free samples or literature.
Dual, Serial-Input, Voltage-Output, 12-Bit MDAC MAX532
ABSOLUTE MAXIMUM RATINGS
Pin Voltages VDD to DGND, AGNDA, AGNDB........................-0.3V to +17V VSS to DGND, AGNDA, AGNDB (Note 1) ..........+0.3V to -17V VREFA, VREFB.............................(VSS - 0.3V) to (VDD + 0.3V) AGNDA, AGNDB .....................(DGND - 0.3V) to (VDD + 0.3V) VOUTA, VOUTB ...........................(VSS - 0.3V) to (VDD + 0.3V) RFBA, RFBB.................................(VSS - 0.3V) to (VDD + 0.3V) SCLK, DIN, DOUT, LDAC, CS ..(DGND - 0.3V) to (VDD + 0.3V) DOUT Sink Current .............................................................20mA Continuous Power Dissipation (TA = +70°C) Plastic DIP (derate 10.53mW/°C above +70°C) ..........842mW Wide SO (derate 9.52mW/°C above +70°C)................762mW CERDIP (derate 10.00mW/°C above +70°C) ...............800mW Operating Temperature Ranges: MAX532_C__ ......................................................0°C to +70°C MAX532_E__....................................................-40°C to +85°C MAX532_MJE ................................................-55°C to +125°C Junction Temperatures: MAX532_C__, E__........................................................+150°C MAX532_MJE...............................................................+175°C Storage Temperature Range ........................... -65°C to +160°C Lead Temperature (soldering, 10sec) ........................... +300°C

MAX33250E和MAX33251E RS-232 串行转换接收器说明书

MAX33251EELC+General DescriptionThe MAX33250E and MAX33251E are isolated2Tx/2Rx and1Tx/1Rx RS-232transceivers,respectively,with a galvanic isolation of600V RMS(60sec)between the logic UART side and field side.The isolation barrier protects the logic UART side from electrical transient strikes from the field side.It also breaks ground loops and large dif-ferences in ground potentials between the two sides that can potentially corrupt the receiving and sending of data. The MAX33250E and MAX33251E conform to the EIA/ TIA-232E standard and operate at data rates up to1Mbps. The isolated RS-232transceivers have integrated charge pumps and an inverter to eliminate the need for a high positive and negative voltage supply.Both devices also have integrated charge pump and inverter capacitors to help further reduce PCB space.The supply pin V CCA on the UART logic side operates from a dual voltage sup-ply from+3V to+5.5V.V CCB also operates from+3V to +5.5V,simplifying power requirements and enabling lev-el translation between the two voltages.The transmitters and receivers on the field side of these devices are rated for±15kV of ESD HBM protection,suitable for applications where RS-232 cables are frequently worked on.Both are available in a12-pin,6mm x6mm LGA package and operate over the -40ºC to +85ºC temperature range.Applications●Diagnostics Equipment●POS Systems●Industrial Equipment●GPS Equipment●Communication Systems●Medical Equipment Benefits and Features●High Integration Saves Space and Simplifies Designs•Integrated Charge Pumps and Inverter Eliminates Extra Power Supplies•Four Internal Capacitors Saves PCB Space•Integrated Isolator Saves Up to 63% Versus a Discrete Solution●Integrated Protection for Robust Communications•600V RMS Withstand Isolation Voltage for 60 Seconds (V ISO)•200V RMS Working Voltage for >50 years (V IOWM)•Integrated ±15kV ESD Human Body Model (HBM) Ordering Information appears at end of data sheet.Click here for production status of specific part numbers.MAX33250E/ MAX33251E 600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESDand Integrated CapacitorsEVALUATION KIT AVAILABLE19-100400, Rev 1; 11/18Absolute Maximum RatingsV CCA to GNDA.........................................................-0.3V to +6V V CCB to GNDB.........................................................-0.3V to +6V T_IN to GNDA..........................................................-0.3V to +6V T_OUT to GNDB...............................................................±13.2V R_IN to GNDB......................................................................±25V R_OUT to GNDA......................................................-0.3V to +6V Short-Circuit Duration (T_OUT to GNDB)..................Continuous Short-Circuit Duration (R_OUT to GNDA)..................ContinuousSide A (V CCA , T1IN, T2IN, R1OUT, R2OUT) to GNDA ESD±2kV Side B (V CCB ) to GNDB ESD...............................................±2kV Side B (T1OUT, T2OUT, R1IN, R2IN) to GNDB ESD HBM±15kV Continuous Power Dissipation (Single Layer Board)(T A =+70°C,derate 10mW/°C above +70°C.)...........................510mW Continuous Power Dissipation (Multilayer Board)(T A =+70°C,derate 10mW/°C above +70°C.)...........................700mW Operating Temperature Range.............................-40°C to +85°CStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Package InformationLGA-12For the latest package outline information and land patterns (footprints), go to /packages .Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to /thermal-tutorial .MAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESD and Integrated CapacitorsElectrical Characteristics(V CCA -V GNDA =3.0V to 5.5V,V CCB -V GNDB =3.0V to 5.5V,T A =T MIN to T MAX ,unless otherwise noted.Typical values are at V CCA -V GNDA =3.3V,V CCB -V GNDB =3.3V,V GNDA =V GNDB ,and T A =+25°C.(Note 1),Limits are 100%tested at T A =+25°C.Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization.Specifications marked "GBD" are guaranteed by design and not production tested.)PARAMETER SYMBOLCONDITIONSMINTYPMAXUNITSPOWER Supply VoltageV CCA , V CCB3.05.5VSupply CurrentI CCAV CCA = 5V, R_IN and T_IN idle 12mA V CCA = 3.3V, R_IN and T_IN idle 10I CCBV CCB = 5V, R_IN and T_IN idle, no load 12V CCB = 3.3V, R_IN and T_IN idle, no load10Undervoltage-Lockout ThresholdV UVLO V CCA - V GNDA (Note 2) 2.0V Undervoltage-Lockout HysteresisV UVLOHYSV CCA - V GNDA (Note 2)0.1V INPUT INTERFACE (T_IN, R_IN)Input Low VoltageV ILT_IN relative to GNDA0.8VR_IN relative to GNDB, T A = 25ºC,V CC = 3.3V0.6R_IN relative to GNDB, T A = 25ºC,V CC = 5V0.8Input High VoltageV IHT_IN relative to GNDA0.7 x V CCA VR_IN relative to GNDB, V CCB = 3.3V and 5V, T A = 25°C 2.4Transmitter Input Hysteresis (T_IN)0.5V Receiver Input Hysteresis (R_IN)0.5V Transmitter Input Leakage(T_IN)±1μA Input Resistance (R_IN)T A = 25ºC357kΩRECEIVER OUTPUT INTERFACE (R_OUT)Output Low Voltage V OL R_OUT relative to GNDA,sink current = 4mA 0.8V Output High Voltage V OHR_OUT relative to GNDA,source current = 4mAV CCA -0.4V Output Short-Circuit Current±110mATRANSMITTER OUTPUT (T_OUT)Output Voltage SwingT_OUT loaded with 3kΩ to GNDB±5VMAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESD and Integrated CapacitorsElectrical Characteristics (continued)(V CCA -V GNDA =3.0V to 5.5V,V CCB -V GNDB =3.0V to 5.5V,T A =T MIN to T MAX ,unless otherwise noted.Typical values are at V CCA -V GNDA =3.3V,V CCB -V GNDB =3.3V,V GNDA =V GNDB ,and T A =+25°C.(Note 1),Limits are 100%tested at T A =+25°C.Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization.Specifications marked "GBD" are guaranteed by design and not production tested.)PARAMETER SYMBOLCONDITIONSMIN TYP MAXUNITS Output Resistance V CCB = 0V,transmitters = ±2V30010MΩOutput Short-Circuit Current±70mA Output Leakage CurrentV CCB = 0V, V OUT =±12V±25μAESD AND ISOLATION PROTECTIONESD for R_IN, T_OUTIEC 61000-4-2 Air Discharge±12kVIEC 61000-4-2 Contact Discharge ±6ESD Human Body Model JEDEC JS-001-2014±15Isolation Voltage V ISO t = 60s (Note 3)600V RMS Working Isolation VoltageV IOWM> 50 years (Note 3)200V RMS TIMING CHARACTERISTICS Maximum Data Rate V CCB = 5V, R L = 3kΩ, C L = 1000pF 1000kbps Receiver Propagation Delayt PHL , t PLH R_IN to R_OUT, C L = 150pF0.15μs Transmitter Skew | t PHL - t PLH |(Note 4)35ns Receiver Skew | t PHL - t PLH |60ns Transition-Region Slew RateV CCA = V CCB = 3.3V, T A = +25C, R L =3k to 7k, C L = 150pF to 1000pF,measured from +3V to -3V or -3V to +3V24150V/μsNote 1:All units are production tested at T A =25°C.Specifications over temperature are guaranteed by design.All voltages of side Aare referenced to GNDA. All voltages of side B are referenced to GNDB.Note 2:The undervoltage lockout threshold and hysteresis guarantee that the outputs are in a known state when the supply voltagedips.Note 3:The isolation is guaranteed by design and not production tested.Note 4:Transmitter skew is measured at the transmitter zero cross points.MAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESD and Integrated CapacitorsTypical Operating Characteristics (V DD= 5V, V L= 3.3V, R L= 60Ω, C L= 15pF, T A= +25°C, unless otherwise noted.)MAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESDand Integrated CapacitorsTypical Operating Characteristics (continued) (V DD= 5V, V L= 3.3V, R L= 60Ω, C L= 15pF, T A= +25°C, unless otherwise noted.)MAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESDand Integrated CapacitorsMAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESDand Integrated Capacitors Pin ConfigurationsPin DescriptionPINNAME FUNCTIONMAX33250EMAX33251E11V CCA Supply Voltage of Logic Side A. Bypass V CCA with a 0.1μF ceramic capacitor to GNDA 22T1IN TTL/CMOS Transmitter Input 13---T2IN TTL/CMOS Transmitter Input 244R1OUT TTL/CMOS Receiver Output 15---R2OUT TTL/CMOS Receiver Output 266GNDA Ground for Logic Side A 77GNDB Ground for Field Side B 8---R2IN RS-232 Receiver Input 299R1IN RS-232 Receiver Input 110---T2OUT RS-232 Transmitter Output 21111T1OUT RS-232 Transmitter Output 11212V CCBSupply Voltage of Logic Side B. Bypass V CCB with a 0.1μF ceramic capacitor to GNDBMAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESD and Integrated CapacitorsMAX33250E/MAX33251E600V Isolated 2Tx/2Rx and 1Tx/1Rx RS-232Transceiver with ±15kV ESDand Integrated Capacitors Detailed DescriptionThe MAX33250E and MAX33251E are1Mbps,600V RMS isolated RS-232transceivers.The MAX33250E has2 transmitters and2receivers(2Tx/2Rx),and the MAX33251E has1transmitter and1receiver(1Tx/1Rx).The isolation is provided by Maxim’s proprietary insulation material that can withstand600V RMS for60seconds.The MAX33250E and MAX33251E conform to the EIA/TIA-232standard and operates at data rates up to1Mbps over the temperature range of -40ºC to 85ºC.Digital IsolationThe MAX33250E and MAX33251E provide galvanic isolation and protection for digital signals from the local microcontroller’s logic UART port(primary side)to the field lines(secondary side).A capacitive design is utilized where the insulation material for the isolation barrier is rated for600V RMS withstand voltage(V ISO)for60seconds.The same material can also be exposed to a differential of200V RMS of working voltage(V IOWM)for more than50years,providing longevity for many different types of end equipment.The isolation barrier also breaks ground loops and level translation for two different systems where it could potentially create inadvertent or misinterpret data signals.Dual Charge Pump Voltage Converter and InverterBoth parts have internal RS-232power supplies that consist of a regulated dual charge pump that provides output voltages of+5.5V(doubling charge pump)and-5.5V(inverting charge pump),over the+3.0V to+5.5V range.Each charge pump is internally connected to a pair of flying capacitors and a pair of reservoir capacitors to generate the internal V+ and V- supplies, as shown in Typical Application Diagram.Startup and Undervoltage LockoutThe V CCA and V CCB supplies are both internally monitored for undervoltage conditions.Undervoltage events can occur during power-up,power-down,or during normal operation due to a dip in either power supply line.When an undervoltage event is detected on either of the supplies,all outputs on both sides are automatically controlled,regardless of the status of the inputs.Table 1. Output Control Truth TableINPUTS V CCA V CCB RxOUT TxOUT RxIN = 1Undervoltage Powered High---RxIN = 0Undervoltage Powered Follows V CCA---TxIN = 1Undervoltage Powered—LowTxIN = 0Undervoltage Powered—LowRxIN = 1Powered Undervoltage High---RxIN = 0Powered Undervoltage High---TxIN = 1Powered Undervoltage—*LowTxIN = 0Powered Undervoltage—*Low*TxOUT will be out of compliance with the RS-232 specification as V CCB falls below 2.9V.Transceiver with ±15kV ESDand Integrated CapacitorsRS-232 TransmittersThe transmitters are inverting level translators that convert CMOS-logic levels from the UART or equivalent output port to+5V EIA/TIA-232levels.The two devices guarantee1Mbps with worst-case loads of3kΩin parallel with1000pF, providing compatibility with PC-to-PC communication software.Transmitters can be paralleled to drive multiple receivers. RS-232 ReceiversThe receivers convert RS-232signals to CMOS-logic output levels to the UART or equivalent input port.The devices feature inverting outputs that always remain active.Power Supply DecouplingTo reduce ripple and the chance of introducing data errors,bypass V CCA and V CCB with0.1μF ceramic capacitors to GNDA and GNDB, respectively. Place the bypass capacitors as close to the power-supply input pins as possible.Insulation and Safety CharacteristicsPARAMETERSYMBOL CONDITIONSVALUE UNIT IEC INSULATION AND SAFETY RELATED FOR SPECIFICATIONSExternal Tracking (Creepage)CPG IEC 60664-1 4.4mm External Air Gap (Clearance)CLRIEC 60664-1 4.4mm Minimum Internal Gap Insulation Thickness 0.0026mm Tracking Resistance(Comparative Tracking Index)CTI IEC 112/VDE 030 Part 1175V Insulation Resistance Across Barrier R ISO 1GΩCapacitance Across Isolation BarrierC IOf = 1MHz12pFVDE IEC INSULATION CHARACTERISTICS Surge Isolation VoltageV IOSM IEC 60747-17,section 5.3.1.6and 5.4.6for basic insulation1kV PEAK Repetitive Peak Isolation Voltage V IORM IEC 60747-17, section 5.3.1.3282kV PEAK Rated Transient Isolation Voltage V IOTM IEC 60747-17, section 5.3.1.4850kV PEAK Safety Limiting Temperature T S IEC 60747-17, section 7.2.1150°C Safety Limiting SideAPowerDissipation P SAIEC 60747-17, section 7.2.10.75WSafety Limiting Side B PowerDissipationP SB IEC 60747-17, section 7.2.10.75W Apparent Charge Method q pdIEC 60747-17, section 7.4 method a and b 5pC Overvoltage Category IEC 60664-1, single or three phase 50V DC or AC I,II —Overvoltage Category IEC 60664-1,single or three phase 100V DC or AC I —Climatic Category 40/125/21—Pollution DegreeDIN VDE 01102—Transceiver with ±15kV ESD and Integrated CapacitorsTransceiver with ±15kV ESDand Integrated Capacitors Typical Application CircuitOrdering InformationPART NUMBER TEMPERATURERANGE CHANNEL-CONFIGURATION DATA RATE PIN-PACKAGE MAX33250EELC+-40°C to +85°C 2 Transmitters, 2 Receivers 1Mbps 12 (6mm x 6mm) LGA MAX33251EELC+-40°C to +85°C1 Transmitter, 1 Receiver1Mbps12 (6mm x 6mm) LGA+Denotes a lead(Pb)-free/RoHS-compliant package.T = Tape-and-reel.Transceiver with ±15kV ESD and Integrated CapacitorsRevision HistoryREVISION NUMBERREVISION DATE DESCRIPTIONPAGES CHANGED09/18Initial release—111/18Updated Ordering Information13For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https:///en/storefront/storefront.html.Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patentlicenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.Transceiver with ±15kV ESD and Integrated CapacitorsMAX33251EELC+。

MMSZ5230中文资料

1/20/99
元器件交易网
MMSZ5225 THRU MMSZ5267
ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Type
Marking Code
-0.075 -0.070 -0.065 -0.060 -0.055 ±0.030 ±0.030 +0.038 +0.038 +0.045 +0.050 +0.058 +0.062 +0.065 +0.068 +0.075 +0.076 +0.077 +0.079 +0.082 +0.082 +0.083 +0.084 +0.085 +0.086 +0.086 +0.087 +0.087 +0.089 +0.090 +0.091 +0.091 +0.092 +0.093 +0.094 +0.095 +0.095 +0.096 +0.096 +0.097 +0.097 +0.097 +0.098
1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.0 6.0 6.5 6.5 7.0 8.0 8.4 9.1 9.9 10 11 12 13 14 14 15 17 18 19 21 21 23 25 27 30 33 36 39 43 46 47 52 56
NOTES: (1) The Zener Impedance is derived from the 1kHz AC voltage which results when an AC current having an RMS value equal to 10% of the Zener current (IZT or IZK) is superimposed on IZT or IZK. Zener Impedance is measured at two points to insure a sharp knee on the breakdown curve and to eliminate unstable units. (2) Measured with device junction in thermal equilibrium.

MAX1940EEE+T资料

General DescriptionThe MAX1940 triple current-limited switch with auto-reset supplies a guaranteed 500mA load per channel in accordance with USB specifications. The MAX1940operates from a 4V to 5.5V input supply and consumes only 60µA of quiescent current when operating and only 3µA in standby. Selectable active-high/active-low con-trol logic and independent shutdown controls for each channel provide additional flexibility. An autoreset fea-ture latches the switch off in the event of a short circuit,saving system power. The switch reactivates upon removal of the shorted condition.The MAX1940 provides several safety features to pro-tect the USB port. Built-in thermal-overload protection turns off the switch when the die temperature exceeds +160°C. Accurate internal current-limiting circuitry pro-tects the input supply against both overload and short-circuit conditions. Independent open-drain fault signals (FAULTA , FAULTB , and FAULTC ) notify the micro-processor when a thermal-overload, current-limit,undervoltage lockout (UVLO), or short-circuit fault occurs. A 20ms fault-blanking feature enables the cir-cuit to ignore momentary faults, such as those caused when hot-swapping a capacitive load, preventing false alarms to the host system. The fault-blanking feature also prevents fault signals from being issued when the device powers up the load.The MAX1940 is available in a space-saving 16-pin QSOP package and operates over the extended (-40°C to +85°C) temperature range.ApplicationsFeatureso Triple USB Switch in Tiny 16-Pin QSOP Package o Autoreset Feature Saves System Power o Guaranteed 500mA Load Current per Channel o Built-In 20ms Fault-Blanking Circuitry o Active-High/Active-Low Control Logic o Fully Compliant to USB Specifications o 4V to 5.5V Input Voltage Range o Independent Shutdown Control o Independent Fault Indicator Outputs o Thermal-Overload Protection o 3µA Standby Current o UL Certification PendingMAX1940Triple USB Switch with Autoreset andFault Blanking________________________________________________________________Maxim Integrated Products 1Typical Operating CircuitOrdering Information19-2497; Rev 0; 7/02For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Pin ConfigurationUSB Ports USB HubsNotebook Computers Desktop ComputersPDAs and Palmtop Computers Docking StationsM A X 1940Triple USB Switch with Autoreset and Fault Blanking 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.IN_, ON_, OUT_, SEL, FAULT_, to GND...................-0.3V to +6V IN1, IN2 to OUTA......................................................-0.3V to +6V IN2, IN3 to OUTB......................................................-0.3V to +6V IN4, IN5 to OUTC .....................................................-0.3V to +6V OUT_ Continuous Switch Current(per channel, internally limited).........................................1.4A FAULT_DC Current............................................................20mAContinuous Power Dissipation (T A = +70°C)16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICSMAX1940Triple USB Switch with Autoreset andFault Blanking_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V= 5V, C = 0.1µF, C = 1µF, T = 0°C to +85°C , unless otherwise noted. Typical values are at T = +25°C.)(V IN_= 5V, C IN_= 0.1µF, C OUT_= 1µF, T A = -40°C to +85°C , unless otherwise noted.) (Note 2)continuous current limit.Note 2:Specifications to -40°C are guaranteed by design, not production tested.M A X 1940Triple USB Switch with Autoreset and Fault Blanking 4_______________________________________________________________________________________Typical Operating Characteristics(Circuit of Figure 2, V IN_= 5V, C IN_= 0.1µF, C OUT_= 1µF, ON_ = SEL, T A = +25°C, unless otherwise noted.)QUIESCENT SUPPLY CURRENTvs. INPUT VOLTAGEINPUT VOLTAGE (V)Q U I E S C E N T S U P P L Y C U R R E N T (µA )5.04.54.03.53.02.52.01.51.00.51020304050607000 5.5QUIESCENT SUPPLY CURRENTvs. TEMPERATURETEMPERATURE (°C)Q U I E S C E N T S U P P L Y C U R R E N T (µA )603510-156162636465666768697060-4085SHUTDOWN SUPPLY CURRENTvs. TEMPERATURETEMPERATURE (°C)S H U T D O W N S U P P L Y C U R R E N T (µA )603510-152.62.72.82.93.02.5-4085SWITCH OFF-LEAKAGE (ONE SWITCH)vs. TEMPERATURETEMPERATURE (°C)S W I T C H O F F -L E A K A G E (n A )603510-150.111010010000.01-4085NORMALIZED ON-RESISTANCEvs. TEMPERATUREM A X 1940 t o c 05TEMPERATURE (°C)N O R M A L I Z E D O N -R E S I S T A N C E603510-150.80.91.01.11.21.30.7-4085CONTINUOUS CURRENT-LIMIT THRESHOLDvs. TEMPERATURETEMPERATURE (°C)C O N T I N U O U S C U R R E N T -L I M I T T H R E S H O LD (m A )603510-15904908912916920900-4085TURN-ON TIME (t ON + t RISE )vs. TEMPERATURETEMPERATURE (°C)T U R N -O N T I M E (m s )603510-153.13.23.33.43.53.0-4085TEMPERATURE (°C)T U R N -O F F T I M E (m s )603510-152.72.82.93.03.13.23.32.6-4085TURN-OFF TIME (t OFF + t FALL )vs. TEMPERATUREFAULT-BLANKING TIME vs. TEMPERATURETEMPERATURE (°C)F A U L T -B L A N K I NG T I M E (m s )603510-1519.520.020.521.021.522.019.0-4085MAX1940Triple USB Switch with Autoreset andFault Blanking_______________________________________________________________________________________5TEMPERATURE (°C)F A U L T O U T P U T L O W V O L T AG E (m V )603510-15110120130140150160170180190200210220230240250100-4085FAULT OUTPUT LOW VOLTAGEvs. TEMPERATUREAUTORESET CURRENT vs. TEMPERATURETEMPERATURE (°C)A U T O R E S E T C U R R E N T (m A )603510-152022242628303234363818-4085AUTORESET CURRENT vs. INPUT VOLTAGEINPUT VOLTAGE (V)A U T O R E S E T C U R R E N T (m A )5.35.13.7 3.9 4.1 4.5 4.74.3 4.95101520253035403.5 5.5OVERLOAD RESPONSE INTO 2.5ΩMAX1940 toc1310ms/divBA C5V 0DA: V IN_ 5V/div B: V OUT_ 5V/divC: V 5V/div D: I OUT_ 1A/divOVERLOAD RESPONSE INTO 2.5Ω(EXPANDED TIME SCALE)MAX1940 toc14400µs/divB A C05VD5VA: V IN_ 5V/div B: V OUT_ 5V/divC: V 5V/div D: I OUT_ 1A/divSHORT-CIRCUIT RESPONSE INTO 0ΩMAX1940 toc1510ms/divB AC5V5VD5VA: V IN_ 5V/div B: V OUT_ 5V/divC: V FAULT_ 5V/div D: I OUT_ 1A/divSHORT-CIRCUIT RESPONSE INTO 0Ω(EXPANDED TIME SCALE)MAX1940 toc16400µs/divB AC5VD5VA: V IN_ 5V/div B: V OUT_ 5V/divC: V 5V/div D: I IN_ 2A/div1ms/divBA5V 5VA: V ON_ 5V/div B: V OUT_ 2V/divV SEL = 5V R OUT_ = 10ΩC OUT_ = 1µFSWITCH TURN-ON TIME (t ON + t RISE )1ms/divBA5VA: V ON_ 5V/div B: V OUT_ 2V/divV SEL = 5V R OUT_ = 10ΩC OUT_ = 1µF SWITCH TURN-ON TIME (t ON + t FALL )Typical Operating Characteristics (continued)(Circuit of Figure 2, V IN_= 5V, C IN_= 0.1µF, C OUT_= 1µF, ON_ = SEL, T A = +25°C, unless otherwise noted.)M A X 1940Triple USB Switch with Autoreset and Fault Blanking 6_______________________________________________________________________________________STARTUP TIME C OUT = 1µF400µs/div BAC5V 5V500mAD5VA: V ON_ 5V/divB: V FAULT_ 5V/div C: V OUT_ 5V/div D: I OUT_ 500mA/divV SEL = 5V, R OUT_ = 10Ω, C OUT_ = 1µF 1ms/divB AC5V5V500mADA: V ON_ 5V/divB: V 5V/div C: V OUT_ 5V/div D: I OUT_ 500mA/divV SEL = 5V, R OUT_ = 10Ω, C OUT_ = 330µFSTARTUP TIME C OUT = 330µF1ms/divBAC5V 5V500mAD5VA: V ON_ 5V/divB: V FAULT_ 5V/div C: V OUT_ 2V/div D: I OUT_ 500mA/divV SEL = 5V, R OUT_ = 10Ω, C OUT_ = 100µF STARTUP TIME C OUT = 100µFUNDERVOLTAGE LOCKOUT RESPONSE10ms/divBACA: V IN_ 5V/div B: V OUT_ 5V/divC: V FAULT_ 5V/divR OUT_ = 10Ω, C OUT_ = 1µFTypical Operating Characteristics (continued)(Circuit of Figure 2, V IN_= 5V, C IN_= 0.1µF, C OUT_= 1µF, ON_ = SEL, T A = +25°C, unless otherwise noted.)MAX1940Triple USB Switch with Autoreset andFault Blanking_______________________________________________________________________________________7M A X 1940Detailed DescriptionThe MAX1940 triple current-limited USB power switch provides three independent switches, each with its own enable-control input and fault indicator (see Figure 1).A logic input sets the active polarity of the enable con-trol inputs. The fault indicators notify the system when the current-limit, short-circuit, undervoltage lockout, or thermal-shutdown threshold is exceeded.The MAX1940 operates from a 4V to 5.5V input supply and supplies a minimum output current of 700mA per channel. A built-in current limit of 0.9A (typ) limits the output current in the event of an overload condition.Built-in short-circuit detection pulses the output current ifthe output voltage falls below 1V, resulting in lower RMS output current and reduced power dissipation in the device. Independent thermal shutdown allows normal operation to continue if one channel experiences a pro-longed overload or short-circuit condition.Low-R ON NMOS switches enable the MAX1940 to pro-vide three switches in the space-saving 16-pin QSOP package. An internal micropower charge pump gener-ates the high-side supply needed for driving the gates of these high-side switches. Separate current-limiting and thermal-shutdown circuitry permits each switch to operate independently, improving system robustness.Triple USB Switch with Autoreset and Fault Blanking 8_______________________________________________________________________________________Figure 1. Functional DiagramOn/Off Control andUndervoltage Lockout SEL sets the active polarity of the logic inputs of the MAX1940. Connect ON_ to the same voltage as SEL to enable the respective OUT_ switch. Connect ON_ to the opposite voltage as SEL to disable the respective output (see Table1). The output of a disabled switch enters a high-impedance state.The MAX1940 includes a UVLO circuit to prevent erro-neous switch operation when the input voltage goes low during startup and brownout conditions. Input voltages of less than 3.4V inhibit operation of the device. FAULT_ asserts low during an undervoltage lockout condition.Output Fault Protection andAutoreset The MAX1940 senses the switch output voltage and selects continuous current limiting for V OUT_greater than 1V, or short-circuit current limiting for V OUT_less than 1V. When V OUT_is greater than 1V, the device operates in a continuous current-limit mode that limits output current to 0.9A. When V OUT_is less than 1V, the device operates in short-circuit current-limit mode, sourcing 1.2A pulses to the load. When either fault con-dition persists for 20ms, the output turns off and its fault flag is asserted. The output automatically restarts 20ms after the short or overload is removed.The MAX1940 detects short-circuit removal by sourcing 25mA from the output and monitoring the output volt-age. When the voltage at the output exceeds 0.5V for 20ms, the fault flag resets, the output turns back on, and the 25mA current source turns off. Active loads are not expected to have measurable current when sup-plied with less than 0.5V.Thermal Shutdown Independent thermal shutdown for each channel per-mits normal operation of two switches to continue while a third experiences a thermal fault. The switch turns off and the FAULT_output asserts low immediately when the junction temperature exceeds +160°C. Thermal shutdown does not utilize the 20ms fault-blanking time-out period. The switch turns on again and FAULT_ returns high when the junction temperature cools by +15°C. The switch cycles on and off if the overload condition persists, resulting in a pulsed output that reduces system power.The MAX1940 provides an independent open-drain fault output (FAULT_) for each switch. Connect FAULT_to IN_ through a 100kΩpullup resistor for most applications. FAULT_asserts low when any of the following conditions occur:•The input voltage is below the UVLO threshold.•The switch junction temperature exceeds the +160°C thermal-shutdown temperature limit.•The switch is in current-limit or short-circuit current-limit mode after the fault-blanking period (20ms)expires.The FAULT_output deasserts after a 20ms delay oncethe fault condition is removed. Ensure that the MAX1940input bypass capacitance prevents glitches from trigger-ing the FAULT_outputs. Limit the input voltage slew rateto 0.2V/µs to prevent erroneous FAULT_indications.To differentiate large capacitive loads from short cir-cuits or sustained overloads, the MAX1940 has an independent fault-blanking circuit for each switch.When a load transient causes the device to enter cur-rent limit, an internal counter monitors the duration ofthe fault. For load faults exceeding the 20ms fault-blanking time, the switch turns off, FAULT_asserts low,and the device enters autoreset mode (see the OutputFault Protection and Autoreset Mode section). Only cur-rent-limit and short-circuit faults are blanked. Thermal overload faults and input voltage drops below the UVLO threshold immediately turn the switch off and assert FAULT_low.Fault blanking allows the MAX1940 to handle USBloads that might not be fully compliant with USB specifi-cations. The MAX1940 successfully powers USB loadswith additional bypass capacitance and/or large start-up currents while protecting the upstream power source. No fault is reported if the switch brings up theload within the 20ms blanking period. See Table2 for a summary of current-limit and fault behavior.MAX1940Triple USB Switch with Autoreset andFault Blanking _______________________________________________________________________________________9M A X 1940Applications InformationInput Power Supply and CapacitanceConnect all IN_ inputs together externally. IN_ powers the internal control circuitry and charge pump for each switch. Bypass IN_ to GND with a 0.1µF ceramic capacitor. When driving inductive loads or operating from inductive sources, which may occur when the MAX1940 is powered by long leads or PC traces, larger input bypass capacitance is required to prevent volt-age spikes from exceeding the MAX1940’s absolute maximum ratings during short-circuit events.Output CapacitorBypass OUT_ to GND with a 1µF ceramic capacitor for local decoupling. Additional bulk capacitance (up to 470µF) reduces output-voltage transients under dynamic load conditions. Using output capacitors greater than 470µF might assert FAULT_if the current limit cannot charge the output capacitor within the 20ms fault-blanking period. In addition to bulk capaci-tance, small-value (0.1µF or greater) ceramic capaci-tors improve the output ’s resilience to electrostatic discharge (ESD).Driving Inductive LoadsA wide variety of devices (mice, keyboards, cameras,and printers) typically connect to the USB port withcables, which might add an inductive component to the load. This inductance causes the output voltage at the USB port to oscillate during a load step. The MAX1940drives inductive loads, but avoid exceeding the device ’s absolute maximum ratings. Usually, the load inductance is relatively small, and the MAX1940’s input includes a substantial bulk capacitance from an upstream regulator as well as local bypass capacitors,limiting overshoot. If severe ringing occurs because of large load inductance, clamp the MAX1940 outputs below +6V and above -0.3V.Turn-On and Turn-Off BehaviorThe MAX1940’s slow turn-on and turn-off minimizes load transients on the upstream power source. Under fault conditions, the outputs of the MAX1940 turn off rapidly to provide maximum safety for the upstream power source and downstream devices. Internal blocks shut down to minimize supply current when all three channels are off.Layout and Thermal DissipationKeep all traces as short as possible to reduce the effect of undesirable parasitic inductance and optimize the switch response time to output short-circuit condi-tions. Place input and output capacitors no more than 5mm from device leads. Connect IN_ and OUT_ to theTriple USB Switch with Autoreset and Fault Blanking 10______________________________________________________________________________________power bus with short traces. Wide power bus planes at IN_ and OUT provide superior heat dissipation as well.An active switch dissipates little power with minimal change in package temperature. Calculate the power dissipation for this condition as follows:P = (I OUT_)2x R ONAt the normal operating current (I OUT_= 0.5A) and the maximum on-resistance of the switch (135mΩ), the power dissipation is:P = (0.5A)2x 0.135Ω= 34mW per switch.The worst-case power dissipation occurs when the output current is just below the current-limit threshold (1.2A max)with an output voltage greater than 1V. In this case, the power dissipated in each switch is the voltage drop across the switch multiplied by the current limit:P = I LIM x (V IN- V OUT)For a 5V input and 1V output, the maximum power dis-sipation per switch is:P = 1.2A x (5V - 1V) = 4.8WBecause the package power dissipation is 667mW, theMAX1940 die temperature exceeds the +160°C thermal shutdown threshold, and the switch output shuts downuntil the junction temperature cools by +15°C. The dutycycle and period are strong functions of the ambient temperature and the PC board layout (see the Thermal Shutdown section).If the output current exceeds the current-limit threshold,or the output voltage is pulled below the short-circuit detect threshold, the MAX1940 enters a fault state after20ms, at which point autoreset mode is enabled and25mA is sourced by the output. For a 5V input, OUT_short-circuited to GND, and autoreset mode active, the power dissipation is as follows:P = 0.025A x 5V = 0.125WChip Information TRANSISTOR COUNT: 4259PROCESS: BiCMOSMAX1940Triple USB Switch with Autoreset andFault Blanking ______________________________________________________________________________________11M A X 1940Triple USB Switch with Autoreset and Fault Blanking Maxim cannot assume responsibility for use of any circuitry oth er th an circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2002 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

E1UAA20-16.257M中文资料(ECLIPTEK)中文数据手册「EasyDatasheet - 矽搜」

E1U列•符合RoHS（无铅）•HC-49 / US短包•AT或BT切提供•电阻焊接密封•紧公差/稳定性•磁带和卷轴,绝缘片,和自定义引线长度可供选择NOTES H 2.50L 11.18W 4.70水晶_____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________ _____________________________________________________________________________________________________________________________________________________________________________________________电气特性频率范围频率公差/稳定性在工作温度范围温度范围工作温度范围老化（25°C）存储温度范围并联电容绝缘电阻驱动电平负载电容（C)3.579545MHz为50.000MHz为±50ppm /±100ppm（标准）,±30ppm/为±50ppm（AT切割只）,±15ppm/±30ppm（AT切割只）,±15ppm/±20ppm（AT切割只）,或±10ppm/±15ppm（AT切割专用）0°C到70°C,-20°C至70°C（AT切割只）,或-40°C至85°C（AT切割专用）±5ppm/年最大-40°C至125°C7pF最大500兆欧最低在100V1 mWatt最大18pF之（标准）,自定义C 10pF,或串联谐振等效串联电阻（ESR）,运作模式（MODE）,切频率范围3.579545MHz到4.999MHz5.000MHz到5.999MHz6.000MHz到7.999MHz8.000MHz到8.999MHz9.000MHz到9.999MHz10.000MHz到14.999MHz ESR (Ω)200最大150最大120最大90马克斯80马克斯70马克斯模式/剪切基本/ AT基本/ AT基本/ AT基本/ AT基本/ AT基本/ AT频率范围15.000MHz到15.999MHz16.000MHz到23.999MHz24.000MHz到30.000MHz24.000MHz到40.000MHz24.576MHz为29.999MHz30.000MHz到50.000MHzESR (Ω)60马克斯50马克斯40马克斯40马克斯150最大100最大模式/剪切基本/ AT基本/ AT基本/ AT基本/ BT三次泛音/ AT三次泛音/ AT.ECLIPTEK CORP.CRYSTAL E1U HC-49/US Short CR4111/07零件编码指南E1U A A 18 - 20.000M - I2 TR频率公差/稳定性A =±50PPM 25°C时,±0℃至100ppm70℃B =±50PPM,在25°C,±100ppm-20℃至70℃C =±50PPM,在25°C,±100ppm温度范围为-40°C至85°CD =±30ppm25°C时,±0℃50PPM至70℃E =±30ppm25°C时,为±50ppm -20℃至70℃F =±30ppm25°C时,为±50ppm -40°C至85°CG =±15ppm25°C时,±0℃为30ppm至70℃H =±15ppm25°C时,±30ppm-20℃至70℃J =±15ppm25°C时,±30ppm温度范围为-40°C至85°C K =±15ppm25°C时,±0℃为20ppm至70℃L =±15ppm25°C时,±20ppm-20℃至70℃M =±15ppm25°C时,±20ppm温度范围为-40°C至85°C N =±10ppm25°C时,±0℃为15ppm至70℃P =±10ppm25°C时,±15ppm-20℃至70℃包装选择空白=散装,A =盘,TR =卷带式可选项空白=无（标准）CX =自定义引线长度I2 =绝缘子标签频率负载电容S =系列X X = X X pF（自定义）动作模式/水晶切割A =基本/ A TB =三次泛音/ A TD =基本/ BT外形尺寸ALL DIM ENSIONS IN M ILLIM ET ERS 卷带尺寸ALL DIM ENSIONS IN M ILLIM ET ERS环境/机械特性PARAMET ER SPECIFICAT ION 标记规格1000 Pieces per ReelCompliant to EIA-468B精细泄漏测试总泄漏测试铅完整铅端接机械冲击耐焊接热抗溶剂可焊性温度循环振荡M IL-STD-883,方法1014,条件AM IL-STD-883,方法1014,条件CM IL-STD-883 2004方法锡2微米 - 6微米M IL-STD-202,方法213,条件CM IL-STD-202,方法210M IL-STD-202,方法215M IL-STD-883,2002年法M IL-STD-883,法1010M IL-STD-883,方法2007,条件A1号线：电子X X.X X X中号Frequency in MHz(5 Digits Maximum + Decimal).ECLIPTEK CORP.CRYSTAL E1U HC-49/US Short CR4111/07。

戴尔5230 5350快速指南说明书

Dell 5230/5350 Guida rapida Caricamento della carta e dei supporti speciali Caricamento del vassoio da 250 o 550 fogli1Estrarre il vassoio.Nota: non rimuovere i vassoi durante la stampa o quando sul display viene visualizzato il messaggio Occupata. Ciò potrebbe causare un inceppamento della carta.2Premere verso l'interno la linguetta della guida della larghezza come illustrato e spostare la guida nella posizione adeguata alle3Sbloccare la guida della lunghezza, premere la linguetta della guida della lunghezza verso l'interno come illustrato e far scorrerela guida nella posizione adeguata alle dimensioni della cartacaricata.Note:•utilizzare gli indicatori del formato carta sul fondo del vassoioper posizionare le guide.•Per i formati carta standard, bloccare la guida della l unghezza.4Flettere i fogli avanti e indietro in modo da separarli, quindi aprirlia ventaglio. Non piegare o sgualcire la carta. Allineare i bordi suuna superficie piana.5Caricare la carta:•Per la stampa su un solo lato, caricare la carta con il lato distampa rivolto verso il basso, posizionando il bordo superioredel foglio rivolto verso la parte anteriore del vassoio.Nota: Per i processi di stampa che utilizzano un fascicolatoreopzionale della cucitrice, posizionare il bordo superiore delfoglio rivolto verso la parte posteriore del vassoio.•Per la stampa fronte-retro (su due lati), caricare la carta con illato di stampa rivolto verso l'alto, posizionando il bordosuperiore del foglio rivolto verso la parte posteriore delvassoio.Nota: Per i processi di stampa che utilizzano un fascicolatoreopzionale della cucitrice, posizionare il bordo superiore delfoglio rivolto verso la parte anteriore del vassoio.Nota: Fare riferimento al limite massimo di caricamento sul latodel vassoio, indicante l'altezza massima per il caricamento dellacarta. Non sovraccaricare il vassoio.6Se necessario, regolare le guide della carta finché non toccanoleggermente i lati della risma, quindi bloccare la guida dellalunghezza nella posizione adeguata alle dimensioni della cartaindicata sul vassoio.7Inserire il vassoio.8Se è stato caricato un tipo di carta diverso da quello caricato inprecedenza nel vassoio, modificare l'impostazione Tipo di cartaper il vassoio dal pannello di controllo della stampante.Rimozione degli inceppamenti200 - 201 Inceppamento carta1Premere il gancio di sblocco, quindi abbassare lo sportellodell'alimentatore multiuso.2Premere il gancio di sblocco, quindi aprire il coperchio anteriore.3Sollevare ed estrarre la cartuccia del toner dalla stampante.Avvertenza — Danno potenziale: Non toccare il tamburo fotoconduttore situato nella parte inferiore della cartuccia.Utilizzare la maniglia della cartuccia ogni volta che è necessariotoccarla.4Posizionare la cartuccia di toner su una superficie piana e liscia.Avvertenza — Danno potenziale: Evitare di esporre la cartuccia alla luce per un periodo di tempo prolungato.Avvertenza — Danno potenziale: La carta inceppata potrebbe presentare residui di toner che potrebbero macchiare gli indumenti e la pelle.5Rimuovere la carta inceppata.ATTENZIONE — SUPERFICIE MOLTO CALDA: L'area interna della stampante potrebbe surriscaldarsi. Perevitare infortuni, lasciare raffreddare la superficie prima di toccarla.Nota: Se non si riesce a rimuovere la carta, estrarla tramite lo sportello posteriore.6Allineare e reinstallare la cartuccia di toner.7Chiudere il coperchio anteriore.8Chiudere lo sportello dell'alimentatore multiuso.9202 e 203 Inceppamenti cartaSe la carta non esce dalla stampante:1Abbassare lo sportello posteriore superiore.2Rimuovere l entamente la carta inceppata per evitare di strapparla.3Chiudere lo sportello posteriore superiore.4241 - 245 Inceppamento carta1Estrarre il vassoio indicato sul display.2Rimuovere l'eventuale carta inceppata, quindi inserire il vassoio.34Se si continua a visualizzare il m essaggio di inceppamento rel ativoal vassoio da 250 o 550 fogli, estrarre il vassoio dalla stampante.5Rimuovere l'eventuale carta inceppata, quindi inserire il vassoio.6。

戴尔5230 5350快速参考指南说明书

Dell 5230/5350 Guide de référence rapideChargement du papier et des supports spéciaux Chargement du tiroir 250 feuilles ou 550 feuilles1Tirez sur le tiroir pour le dégager.Remarque : Ne retirez pas les tiroirs lorsqu'un travail est en cours d'impression ou lorsque le message Occupé apparaît à l'écran.Vous risqueriez de provoquer des bourrages.2Pincez les taquets du guide de longueur vers l'intérieur, de la manière illustrée, puis faites glissez le guide de façon à l'ajuster3Déverrouillez le guide de longueur, pincez les taquets du guidede longueur vers l'intérieur, de la manière illustrée, puis faitesglissez le guide de façon à l'ajuster au format du support chargé.Remarques :•utilisez les repères de format situés en bas du tiroir pourajuster les guides au mieux.•Pour les formats de support standard, verrouillez le guide delongueur.4Déramez les feuilles pour les détacher, puis ventilez-les. Ne pliezpas le papier et ne le froissez pas. Egalisez les bords sur une surfaceplane.5Chargez le papier :•En insérant la face d'impression vers le bas et en plaçant lebord supérieur de la feuille vers l'avant du tiroir pour uneimpression sur un seul côté.Remarque : En plaçant le bord supérieur de la feuille versl'arrière du tiroir pour les travaux d'impression avec une unitéde finition optionnelle.•En insérant la face d'impression vers le haut et en plaçant lebord supérieur de la feuille vers l'arrière du tiroir pour uneimpression sur deux faces ou recto verso.Remarque : En plaçant le bord supérieur de la feuille versl'avant du tiroir pour les travaux d'impression avec une unitéde finition optionnelle.Remarque : Vérifiez le repère de chargement maximal sur le côtédu tiroir qui indique la hauteur maximale de chargement dupapier. Ne surchargez pas le tiroir.6Si besoin, ajustez les guide-papier pour qu'ils touchentlégèrement le bord de la pile puis verrouillez le guide de longueuraux tailles de papier indiquées sur le tiroir.7Insérez le tiroir.8Si vous avez chargé un type de papier différent de celui qui setrouvait auparavant dans le tiroir, modifiez le paramètre Typepapier de ce tiroir sur le panneau de commandes de l'imprimante.Elimination des bourragesBourrages papier 200 et 2011Poussez le loquet d'ouverture, puis baissez la porte du chargeurmultifonction.2Poussez le loquet d'ouverture, puis ouvrez le capot avant.3Soulevez la cartouche de toner et retirez-la de l'imprimante.Attention — Dommages potentiels : Ne touchez pas letambour du photoconducteur au-dessous de la cartouche.Lorsque vous manipulez la cartouche, utilisez toujours sapoignée.4Placez la cartouche de toner de côté, sur une surface lisse et plane.Attention — Dommages p otentiels : N e laissez pas la cartouche exposée très longtemps à la lumière.Attention — Dommages potentiels : Le papier coincé peut être couvert de toner non fondu susceptible de tâcher les vêtements et la peau.5Retirez le papier coincé.MISE EN GARDE—SURFACE BRULANTE : L'intérieur del'imprimante risque d'être brûlant. Pour réduire le risquede brûlure, laissez la surface ou le composant refroidiravant d'y toucher.Remarque : Si le papier ne peut être retiré facilement, ouvrez laporte arrière et retirez le papier coincé.6Alignez et réinstallez la cartouche de toner.7Refermez le capot avant.8Refermez le chargeur multifonction.9202 – 203 Bourrages papierSi le papier ne sort pas de l’imprimante :1Abaissez la porte arrière supérieure.2Retirez doucement le papier coincé en prenant soin de ne pas ledéchirer.3Refermez la porte arrière supérieure.4Bourrages papier 241–2451Tirez le tiroir indiqué à l'écran.2Retirez le papier coincé, puis réinsérez le tiroir.34Si le message de bourrage reste affiché pour un tiroir 250 feuillesou 550 feuilles, retirez le tiroir de l'imprimante.5Retirez le papier coincé, puis réinsérez le tiroir.6。

ACT5230资料

FeaturesBlock Diagrams Full militarized QED RM5230 microprocessorsDual Issue superscalar microprocessor - can issue one integer and one floating-point instruction per cycleq 100, 133 and 150 MHz operating frequency – ConsultFactory for latest speeds q 228 Dhrystone2.1 MIPSq SPECInt95 4.2 SPECfp95 4.5sSystem interface optomized for embedded applicationsq 32-bit system interface lowers total system cost with up to87.5 MHz operating frequencyq High performance write protocols maximize uncached write bandwidthq Operates at processor clock divisors 2 through 8q 5V tolerant I/O'sq IEEE 1149.1 JTAG boundary scansIntegrated on-chip cachesq 16KB instruction - 2 way set associative q 16KB data - 2 way set associative q Virtually indexed, physically taggedq Write-back and write-through on per page basis q Early restart on data cache missessIntegrated memory management unitq Fully associative joint TLB (shared by I and D translations)q 48 dual entries map 96 pagesq Variable page size (4KB to 16MB in 4x increments)sHigh-performance floating point unitq Single cycle repeat rate for common single precisionoperations and some double precision operationsq Two cycle repeat rate for double precision multiply and double precision combined multiply-add operations q Single cycle repeat rate for single precision combined multiply-add operationsMIPS IV instruction setq Floating point multiply-add instruction increasesperformance in signal processing and graphics applicationsq Conditional moves to reduce branch frequency q Index address modes (register + register)sEmbedded application enhancementsq Specialized DSP integer Multiply-Accumulate instructionand 3 operand multiply instruction q I and D cache locking by setq Optional dedicated exception vector for interruptssFully static CMOS design with power down logicq Standby reduced power mode with WAIT instruction q 2.5 Watts typical with less than 70 mA standby currents 128-pin Power Quad-4 package (F22), Consult Factory forpackage configurationPreliminaryStore BufferData Set A Data T ag A DTLB Physical Data T ag BInstruction Set AInteger Instruction RegisterFP Instruction RegisterInstruction Set B Address Buffer Instruction T ag A ITLB PhysicalInstruction Tag BSys ADWrite Buffer Read Buffer Data Set BDBusControlFloating-point Register FileJoint TLBTagAux TagIntIBusFloating-point Coprocessor 0Unpacker/PackerMAdd, Add, Sub,CvtPC Incrementer Branch Adder DV ALoad AlignerInteger Register File Integer/Address Adder Data TLB Virtual Shifter/Store AlignerLogic Unit Integer Multiply , DivideInteger ControlInstruction TLB Virtual F l o a t i n g p o i n t C o n t r o lPhase Lock LoopInstruction SelectFPIBusABusSystem/MemoryControlProgram CounterIVADiv , SqRt32-Bit Superscaler MicroprocessorACT5230DESCRIPTIONThe ACT5230 is a highly integrated superscalar microprocessor that implements a superset of the MIPS IV Instruction Set Architecture(ISA). It has a high performance 64-bit integer unit, a high throughput, fully pipelined 64-bit floating point unit, an operating system friendly memory management unit with a 48-entry fully associative TLB, a 16 KByte 2-way set associative instruction cache, a 16 KByte 2-way set associative data cache, and a high-performance 32-bit system interface. The ACT5230 can issue both an integer and a floating point instruction in the same cycle.The ACT5230 is ideally suited for high-end embedded control applications such as internetworking, high performance image manipulation, high speed printing, and 3-D visualization.HARDWARE OVERVIEWThe ACT5230 offers a high-level of integration targeted at high-performance embedded applications. Some of the key elements of the ACT5230 are briefly described below. Superscalar DispatchThe ACT5230 has an efficient asymmetric superscalar dispatch unit which allows it to issue an integer instruction and a floating-point computation instruction simultaneously. With respect to superscalar issue, integer instructions include alu, branch, load/store, and floating-point load/store, while floating-point computation instructions include floating-point add, subtract, combined multiply-add, converts, etc. In combination with its high throughput fully pipelined floating-point execution unit, the superscalar capability of the ACT5230 provides unparalleled price/performance in computationally intensive embedded applications.CPU RegistersLike all MIPS ISA processors, the ACT5230 CPU has a simple, clean user visible state consisting of 32 general purpose registers, two special purpose registers for integer multiplication and division, a program counter, and no condition code bits. PipelineFor integer operations, loads, stores, and other non-floating-point operations, the ACT5230 uses the simple 5-stage pipeline also found in the QED circuits R4600, R4700, and R5000. In addition to this standard pipeline, the ACT5230 uses an extended seven stage pipeline for floating-point operations. Like the QED R5000, the ACT5230 does virtual to physical translation in parallel with cache access. Integer UnitLike the QED R5000, the ACT5230 implements the MIPS IV Instruction Set Architecture, and is therefore fully upward compatible with applications that run on processors implementing the earlier generation MIPS I-III instruction sets. Additionally, the ACT5230 includes two implementation specific instructions not found in the baseline MIPS IV ISA but that are useful in the embedded market place. Described in detail in the QED RM5230 datasheet,, these instructions are integer multiply-accumulate and 3-operand integer multiply.The ACT5230 integer unit includes thirty-two general purpose 64-bit registers, a load/store architecture with single cycle ALU operations (add, sub, logical, shift) and an autonomous multiply/divide unit. Additional register resources include: the HI/LO result registers for the two-operand integer multiply/ divide operations, and the program counter(PC). Register FileThe ACT5230 has thirty-two general purpose registers with register location 0 hard wired to zero. These registers are used for scalar integer operations and address calculation. The register file has two read ports and one write port and is fully bypassed to minimize operation latency in the pipeline.ALUThe ACT5230 ALU consists of the integer adder/ subtractor, the logic unit, and the shifter. The adder performs address calculations in addition to arithmetic operations, the logic unit performs all logical and zero shift data moves, and the shifter performs shifts and store alignment operations. Each of these units is optimized to perform all operations in a single processor cycleFor Detail Information regarding the operation of the Quantum Effect Design (QED) RISCMark™RM5230™, 32-Bit Superscalar Microprocessor see the QED datasheet (Revision 1.2 July 1998).Absolute Maximum Ratings1Symbol Rating Range Units T TERM T erminal Voltage with respect to GND-0.52 to 4.6V T CASE Operating T emperature0 to +85°C T BIAS Case T emperature under Bias-55 to +125°C T STG Storage T emperature-55 to +125°CI IN DC Input Current203mAI OUT DC Output Current50mA Notes:1. Stresses above those listed under "AbsoluteMaximums Rating" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.2. V IN minimum = -2.0V for pulse width less than 15nS. V IN maximum should not exceed +5.5 Volts.3. When V IN < 0V or V IN > Vcc.4. No more than one output should be shorted at one time. Duration of the short should not exceed more than 30 second.Recommended Operating ConditionsSymbol Parameter Minimum Maximum Units V CC Power Supply Voltage+3.135+3.465V V IH Input High Voltage0.7V CC V CC+ 0.5V V IL Input Low Voltage-0.50.2V CC V T C Operating Temperature Case (Commercial)0 +85°CDC Characteristics(V CC = 3.3V ±5%; T CASE = 0°C to +85°C)Parameter Sym Conditions133 / 150MHzUnits Min MaxOutput Low Voltage V OL1I OL = 20 µA0.1V Output High Voltage V OH1I OL = 20 µA Vcc - 0.1V Output Low Voltage V OL2I OL = 4 mA0.4V Output High Voltage V OH2I OL = 4 mA 2.4V Input High Voltage V IH0.7V CC V CC+ 0.5V Input Low Voltage V IL-0.50.2V CC V Input Current I IN1V IN = 0V-20+20µA Input Current I IN2V IN = V CC-20+20µA Input Current I IN3V IN = 5.5V-250+250µA Input Capacitance C IN10pF Output Capacitance C OUT10pFAC Characteristics(V CC = 3.3V ±5%; T CASE = 0°C to +85°C)Power ConsumptionParameter Symbol Conditions133MHz, 3.3V 150MHz, 3.3V Units Typ 5Max Typ 5Max Active Operating Supply CurrentI CC1C L = 0pF , 150/75MHz, No SysAD activityTBD TBD TBD TBD mA I CC2C L = 50pF , 150/75MHz, R4000 write protocol without FPU operation 1000175011501950mA I CC3C L = 50pF , 150/75MHz, write re-issue or pipelined writes 1100200012502250mA Standby CurrentI SB1C L = 0pF , 150/75MHz TBD TBD mA I SB1C L = 50pF , 150/75MHzTBDTBDmANotes:5. Typical integer instruction mix and cache miss rates.Capacitive Load DerationSymbol Parameter133 / 150MHz Units MinimumMaximumC LDLoad Derate2ns/25pFClock ParametersParameter Symbol Test Conditions133/150MHz Units Min MaxSysClock High t SCHigh T ransition < 5ns 4ns SysClock Low t SCLowT ransition < 5ns4ns SysClock Frequency 63375MHz SysClock Period t SCP 30ns Clock Jitter for SysClock t JitterIn ±250ps SysClock Rise Time t SCRise 5ns SysClock Fall Time t SCFall 5ns ModeClock Period t ModeCKP 256*t SCP ns JT A Clock Periodt JT AGCKP 4*t SCP nsNotes:6. Operation of the ACT5230 is only guaranteed with the Phase Loop enabled.System Interface Parameters7Parameter Symbol Test Conditions133MHz150MHzUnits Min Max Min MaxData Output8t DO mode14...13 = 10 (fastest)TBD TBD TBD TBD ns mode14...13 = 11TBD TBD TBD TBD ns mode14...13 = 00 1.08.0 1.08.0ns mode14...13 = 01 (slowest)TBD TBD TBD TBD nsData Setup t DS t RISE = 5ns 4.0 4.0ns Data Hold t DH t FALL= 5ns00ns Notes:7. Timmings are are measured from from 1.5V of the clock to 1.5V of the signal.8. Capacitive load for all output timing is 50pF.Boot Time Interface ParametersParameter Symbol Test Conditions133/150MHzUnits Min MaxMode Data Setup t DS4SysClock cycles Mode Data Hold t DH0SysClock cyclesACT5230 Microprocessor – PQUAD PinoutsPin #Function Pin #FunctionPin # Function Pin # Function 1Vcc 53NC 105Vcc 157NC 2NC 54NC 106NMI*158NC 3NC 55NC 107ExtRqst*159NC 4Vcc 56Vcc 108Reset*160NC 5Vss 57Vss 109ColdReset*161Vcc 6SysAD458ModeIn 110VccOK 162Vss 7NC 59RdRdy*111BigEndian 163SysAD288SysAD560WrRdy*112Vcc 164NC 9NC 61ValidIn*113Vss 165SysAD2910Vcc 62ValidOut*114SysAD16166NC 11Vss 63Release*115NC 167Vcc 12SysAD664VccP 116Vcc 168Vss 13NC 65VssP 117Vss 169SysAD3014Vcc 66SysClock 118SysAD17170NC 15Vss 67Vcc 119NC 171Vcc 16SysAD768Vss 120SysAD18172Vss 17NC 69Vcc 121NC 173SysAD3118SysAD870Vss 122Vcc 174NC 19NC 71Vcc 123Vss 175SysADC220Vcc 72Vss 124SysAD19176SysADC621Vss 73SysCmd0125NC 177Vcc 22SysAD974SysCmd1126Vcc 178Vss 23NC 75SysCmd2127Vss 179SysADC324Vcc 76SysCmd3128SysAD20180SysADC725Vss 77Vcc 129NC 181Vcc 26SysAD1078Vss 130SysAD21182Vss 27NC 79SysCmd4131NC 183SysADC028SysAD1180SysCmd5132Vcc 184SysADC429NC 81Vcc 133Vss 185Vcc 30Vcc 82Vss 134SysAD22186Vss 31Vss 83SysCmd6135NC 187SysADC132SysAD1284SysCmd7136Vcc 188SysADC533NC 85SysCmd8137Vss 189SysAD034Vcc 86SysCmdP 138SysAD23190NC 35Vss 87Vcc 139NC 191Vcc 36SysAD1388Vss 140SysAD24192Vss 37NC 89Vcc 141NC 193SysAD138SysAD1490Vss 142Vcc 194NC 39NC 91Vcc 143Vss 195Vcc 40Vcc 92Vss 144SysAD25196Vss 41Vss 93Int0*145NC 197SysAD242SysAD1594Int1*146Vcc 198NC 43NC 95Int2*147Vss 199SysAD344Vcc 96Int3*148SysAD26200NC 45Vss 97Int4*149NC 201Vcc 46ModeClock 98Int5*150SysAD27202Vss 47JTDO 99Vcc 151NC 203NC 48JTDI 100Vss 152Vcc 204NC 49JTCK 101NC 153Vss 205NC 50JTMS 102NC 154NC 206NC 51Vcc 103NC 155NC 207Vcc 52Vss104NC156Vss208Vss(Pa c k a g e& P i no u t ss u b j e ct t oc h a n g e – C on t a c tF a c t o r y )Sample Ordering InformationPart Number Screening Speed (MHz)Package ACT -5230PC-133F22I Industrial Temperature 133 128 Lead PQUAD ACT -5230PC-150F22C Commercial Temperature 150 128 Lead PQUAD ACT -5230PC-200F22T Military Temperature 200 128 Lead PQUAD ACT -5230PC-200F22MMilitary Screening200128 Lead PQUADAeroflex Circuit Technology 35 South Service RoadPlainview New York 11803 Telephone: (516) 694-6700FAX: (516) 694-6715Toll Free Inquiries: (800) /act1.htmE-Mail: sales-act@Specifications subject to change without notice.C I R C U I T T E C H N O L O G YPart Number BreakdownACT–5230PC –133F22MAeroflex Circuit TechnologyBase Processor Type133 = 133MHz 150 = 150MHz 200 = 200MHzCache StylePackage Type & SizeC = Commercial Temp, 0°C to +70°C I = Industrial T emp, -40°C to +85°C T = Military T emp, -55°C to +125°CM = Military T emp, -55°C to +125°C, Screened *Q = MIL-PRF-38534 Compliant/SMD if applicableScreening* Screened to the individual test methods of MIL-STD-883PC = Primary CacheMaximum Pipeline Freq.Surface Mount PackageF22 = 1.10" SQ 128 Lead PQUAD。

通信网络-Agilent PNA-L Network Analyzers N5230A

Agilent PNA-LNetwork AnalyzersN5230A300 kHz to 6, 13.5 or 20 GHz 10 MHz to 20, 40, or 50 GHzAdvanced capability at an affordable priceSpeed and accuracy you can count on2Introducing thePNA-L network analyzerCalibrate with confidence•Exceptional accuracy with NIST 2-traceable electronic calibration (ECal) modules (optional)•User-characterized ECal modules for added flexibility •Advanced calibrations include TRL and Unknown Thru •Automatic port extension – unique feature to easily compensate for fixture loss and electrical delay •Match-corrected scalar calibration for mixer/converter measurements (optional)Ease-of-use•Up to 16,001 points per trace, eight traces per window and an unlimited 3number of windows •Up to 32 independent measurement channels for easy execution and viewing of complex test plans •Advanced connectivity with LAN, USB and two GPIB interfacesPNA-L 2-port and 4-portfrequency range coverage.Key featuresUnsurpassed performance•Fast measurements – less than 4 to 9 µs per point •Low trace noise – as low as 0.004 dB rms at 1 kHz bandwidth •High dynamic range – up to 108 dB at 20 GHz Multi-purpose capabilities•Configurable test set for applications such as high power measurements with additional test ports •Built-in second source for fixed and swept-LO testing of mixers/converters and intermodulation distortion (IMD) testing of amplifiers 1(optional)•Single-ended and balanced measurements 1•4-port network embedding/de-embedding•4-port differential matching and port impedance conversion 1•Equation editor – calculates and displays non-standard, application-specific results using S-parameter or receiver measurement data •Time-domain analysis and frequency-offset measurements (optional)Accelerate time to market and reduce cost of test3multiple windows (10 markers per trace, up to 16,001 points per trace)One-button macros simplify common measurements2-port PNA-LThe Agilent PNA-L is designed for your general-purposenetwork analysis needs and priced for your budget.Advanced features help you work quickly, easily, and accurately.Integrated Windows ®operatingsystem for maximum flexibility4-port PNA-LWith the same firmware as the PNA, the PNA-L offers the perfect balance of value and performance. PNA-L provides efficiency and flexibility in both manufacturing and R&D applications for industries ranging from wireless LAN component production to Aerospace & Defense.architecture provides access to signal paths to easily optimize your applicationVariety of sweep types: Linear/log/segment, CW, powerTrace math and statistical analysis functions are powerful and easy to use2- and 4-port ECal modules (optional) allow you to calibrate up to 30 times faster than mechanical standard calibrationRemoving calibration complexitywith ECalCalibration is crucial for accurate measurements. Agilent offers a variety of NIST-traceable electronic calibration (ECal) modules to speed your calibration process.With ECal modules, you can perform fast, repeatable calibrations that are as accurate as a sliding load mechanical calibration, but less error-prone andmore than 30 times faster.ECal simplifies calibration and reduces operator error.Two-port ECal modules operating from 300 kHz to 67 GHz are available in a variety of connector types. Two-port ECal modules can be used to perform a full 4-port cali-bration with only four connections and disconnections(the same as a 4-port ECal module).Full 4-port calibration to 20 GHz in one single step.For even more convenience and time savings, 4-port ECal modules offer one-step calibrations from 300 kHz to 20 GHz, satisfying the requirements of a wide variety of component test applications.To make the ECal module even more flexible, the User Characterization feature provides you the ability to create custom module characterizations for use with adapters and fixtures to meet your connector needs. Use the User Characterization feature to create a custom waveguidecalibration module.ECal modules in a widerange of frequenciesand connectors.Precise calibrations provide confidence45In-fixture measurementsNormal coaxial calibrations do not account for the effects of fixtures on measurements, and resulting errors can become quite significant at microwave frequencies. ThePNA-L offers a variety of easy and accurate methods to correct for fixtures.Port extensionsTraditional port extensions allow the user to enter an electrical delay, correcting for the physical length of the test fixture. However, as test frequencies increase beyond a few GHz the insertion loss of a fixture becomes significant as well. The PNA-L port extension feature allows a user to input an insertion loss value in addition to electrical delay, allowing for much more accurate fixture compensation.To further simplify fixture compensation, Agilent provides the innovative Automatic Port Extension feature. With a single click, the PNA-L automatically determines a fixture’s electrical length and insertion loss and applies the correction to measurements,making in-fixture measurements easy and accurate.Simple and easy-to-use, Automatic Port Extension is ideal for in-fixture measurements, especially those with multiple ports.Embedding and de-embeddingThe PNA-L offers full embedding and de-embedding of user-supplied S-parameter data files, as well as predefined matching circuit topologies that can be mathematically embedded. Port impedance conversion is available for testing devices that are not 50 ohms.Accurate measurements improve yieldsAdaptor characterizationEmbedding (adding) or de-embedding (removing)requires the “.s2p” file of the 2-port device to be embed-ded or de-embedded. The PNA-L provides a feature for the user to easily create the “.s2p” characterization of the 2-port device (adaptor) and then subsequently apply to S-parameter measurements.Create “.s2p” files of each path of the fixture using Adaptor Characterization. Apply these files to subsequent S-parameter measurements for de-embedding of the fixture.Embedding and de-embedding of 4-port networks, as well as 2-port networks, are available for achieving accurate results.6Advanced featuresfor R&D and manufacturingMixer and converter measurementsWith frequency-offset mode, the PNA-L Series can set its source and receiver frequencies independently for measuring:•Mixer conversion loss/gain•Harmonic and spurious responses •Intermodulation distortion (IMD)Converter measurements using frequency-offset mode of the PNA-L and an external PSG.Built-in second source simplifies setupsAvailable with 4-port models only, an internal second source simplifies setups for testing mixers, converters and amplifiers.The second source improves sweep speed by at least 20times compared to using an external source.Built-in second source simplifies converter measurements. Plus,with the configurable test set,an external booster amplifier can be added to increase the output power of the LO signal.Scalar-calibrated converter measurementsTo obtain the highest amplitude accuracy possible for your conversion loss/gain measurements, scalar mixer calibration (SMC) combines a short-open-load-through (SOLT) calibration and a power meter calibration to deliver match-corrected amplitude measurements.DUTGPIBScalar-calibrated converterMultiportFor devices with more than four ports, a test set can be added to expand the number of test ports. Different test sets can be added depending on your measurement needs. Control of the test set is done by the PNA-L’s firmware, so no extra software is needed.Analysis toolThe PNA-L is supported by Agilent's Advanced Design System (ADS), enabling device data to be used in circuit and system simulation. Users can also save 4-port data as “.s4p” files, or “.snp” files for n-port devices which are easily imported into ADS for analysis.Analysis features such as trace statistics, trace math,and equation editor provide insight into device behavior,while mixed-mode measurements such as common-to-differential mode conversion allow you to discover design flaws early in the design process.Equation editor allows you to create parameters such as K-factor.7Simple and easy to measure various devicesDifferential devicesThe PNA-L can easily measure single-ended, balanced,and mixed-mode S-parameters in addition to ratioed and unratioed receiver measurements.Graphical interface makes it easy to set up balanced measurements.Physical layer testUse Agilent's Physical Layer Test System (PLTS) software to expand the 4-port PNA-L’s measurement capabilities for high-speed differential interconnect design andvalidation.PLTS software combines frequency-domain,time-domain, and eye-diagram analysis to provide a com-prehensive view of your physical layer element. It also controls measurement setup and calibration to provide the most accurate measurements for model extraction,characterization, and validation of your designs.Characterize and validate differential channels with a full suite of analysistools available in PLTS.Adding a 4-port test set expands the 4-port PNA-L to an 8-port system with 8-port calibration and measurement capabilities.11.Option 551 required for N-port capabilities.8The entire family of PNA network analyzers offer reliable,accurate measurementsyou can count on.Sharing a common architecture,all PNA’s have the same user and programming interface, providingfamiliarity and compatibility across the entire PNA Series.The PNA Series offers a variety of solutionsSeries comparisons1.Up to 67 GHz.Agilent’s PNA-L is a quality, cost-effective solutiondesigned for general purpose network applications such as S-parameter, filter, basic amplifier, basic mixer, and multiport measurements.Agilent’s higher performance microwave E836x PNA Series provides the world’s most advanced performance and is specifically designed for more demanding meas-urement needs and applications such as antenna, pulsed,and banded mm-wave measurements.9Agilent’s ENA and PNA-L network analyzers and Physical Layer Test Systems (PLTS) provide a variety of 4-port and balanced measurement solutions from 300 kHz to 67 GHz to meet your specific application and budget needs.Since all of these products use common calibration and measurement algorithms, you can be sure no matter which Agilent solution you use, you will get the right answer every time.Select a specific frequency range that suits your application needs...Specification summaryGet consistent results with the ENA and PNA-L network analyzers.Agilent offers a comprehensiveportfolio of 4-port solutions10PNA-L test set options4-port test set options•Standard test set and power range – Option x40•Configurable test set and extended power range – Option x45Adds nine front panel access loops and a 60 dB step attenuator. This provides the capability to add external components for high power measurements, improve instrument sensitivity for measuring low-level signals, or to add other peripheral instruments for a variety of measurement applications. •Configurable test set, extended power range and internal second source – Option x46Available with 4-port models only, this option adds an internal second source, nine front panel access loops and two 60 dB step attenuators. This provides an additional fixed or swept tone for two-tone third-order-intercept (TOI) and intermodulation testing of amplifiers, or it can be used as a fast swept-LO signal for fixed-IF testing of mixers and converters. In either case, sweep speed is more than 20 times faster than using an external source (Option 080 required).Standard test set (Option x40)PORT 4PORT 3PORT 2PORT 12-port test set options•Standard 2-port test set and power range – Option x20•Configurable 2-port test set and extended power range – Option x25Adds six front panel access loops and two 60 dB step attenuators as shown in the figures below. This provides the capability to improve instrument sensitivity for measuring low-level signals, to reverse the directional coupler to achieve even more dynamic range or to add components and other peripheral instruments for a variety of measurement applications.Standard test set (Option x20)Configurable test set and extended power range (Option x25)Source out Receiver R2 in PORT 2Source out Coupler thru Coupler arm Receiver B inPORT 1Coupler thru Source out Receiver A in Coupler armReceiver R1 in Source outPORT 2PORT 1Configurable test set and extended power range (Option x45)Configurable test set, extended power range and internal second source (Option x46)11PORT 4Coupler arm Receiver D in Source out Coupler thru PORT 3Coupler arm Receiver C in Source out Coupler thru PORT 2Coupler thru Source outReceiver B in Coupler arm PORT 1Coupler thru Source out Receiver A in Coupler arm Source out Receiver R inPNA-L test set option descriptionsAdditional optionsTime domain – Option 010This option enables the PNA-L to view reflection and transmission responses in both time or distance e time domain to tune filters, gate out the response of fixtures and cables, characterize the impedance of transmission and more.Frequency offset – Option 080This option enables the PNA-L to set the source frequency independently from where the receivers are tuned. This ability is important for two general classes of devices:mixers (converters) and amplifiers.Scalar-calibrated converter measurements - Option 082Using a simple setup, this application provides the high-est accuracy of conversion-loss (or gain) measurements by combining one-port and power meter calibrations to remove mismatch errors (Option 080 is required).4-port measurement application - Option 550Adds full 4-port error correction and differentialmeasurements on a 2-port network analyzer. An external test set is required.N-port capabilities - Option 551Adds full N-port error correction and measurement capabilities to any PNA-L network analyzers. An exter-nal test set is required.Certification optionsCommercial calibration certification with test data – Option UK6Complete set of measurements which tests unit to manu-facturer’s published specifications. Includes calibration label, calibration certificate, and data report. Conforms to ISO 9001.ISO 17025 compliant calibration – Option 1A7Complete set of measurements which tests unit to manu-facturer’s published specifications. Includes calibration label, ISO17025 calibration certificate, and data report,measurement uncertainties and guard bands on all customer specifications. Conforms to ISO 17025 and ISO 9001.ANSI Z540 compliant calibration - Option A6JComplete set of measurements which tests unit to manu-facturer's published specifications. Includes pre- and post-adjustment data with measurement uncertainty information compliant to the ANSI/NCSL Z540 standard.For more information visit: /find/pnalPORT 4Coupler arm Receiver D in Source out Coupler thru PORT 3Coupler arm Receiver C in Source out Coupler thru PORT 2Coupler thru Source out Receiver B in Coupler armPORT 1Coupler thru Source out Receiver A in Coupler arm Source out Receiver R inWeb resourcesVisit our Web sites for additional product information and literature.PNA-L microwave network analyzers /find/pnal PNA microwave network analyzers /find/pna ENA RF network analyzers /find/ena Physical layer test systems /find/plts Multiport test solutions/find/multiport Antenna test/find/antennaElectronic calibration (ECal) modules /find/ecal RF and microwave accessories /find/accessoriesFor more information on Agilent Technologies’ products,applications or services, please contact your local Agilent office.The complete list is available at:/find/contactus Phone or Fax United States:Korea:(tel) 800 829 4444(tel) (080) 769 0800(fax) 800 829 4433(fax) (080) 769 0900Canada:Latin America:(tel) 877 894 4414(tel) (305) 269 7500(fax) 800 746 4866Taiwan :China:(tel) 0800 047 866(tel) 800 810 0189(fax) 0800 286 331(fax) 800 820 2816Other Asia Pacific Europe:Countries:(tel) 31 20 547 2111(tel) (65) 6375 8100Japan:(fax) (65) 6755 0042(tel) (81) 426 56 7832Email: tm_ap@(fax) (81) 426 56 7840Revised: 09/14/06Product specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2006Printed in USA, October 24, 20065989-5541EN/find/emailupdatesGet the latest information on the products and applications you select./find/quickQuickly choose and use your test equipment solutions with confidence./find/openAgilent Open simplifies the process of connecting and programming test systems to help engineers design, validate and manufacture electronic products. Agilent offers open connectivity for a broad range of system-ready instruments, open industry software, PC-standard I/O and global support, which are combined to more easily integrate test system development.Windows is a U.S. registered trademark of Microsoft Corporation.Agilent Email UpdatesAgilent DirectAgilent OpenRemove all doubtOur repair and calibration services will get your equipment back to you, performing like new, when promised. You will get full value out of your Agilent equipment throughout its lifetime.Your equipment will be serviced by Agilent-trained technicians using the latest factory calibration procedures, automated repair diagnostics and genuine parts. You will always have the utmost confidence in your measurements.Agilent offers a wide range of additional expert test and measurement services for your equipment, including initial start-up assistance , onsite education and training, as well as design, system integration, and project management. 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