Pulsatilla saponin D_68027-15-6_DataSheet_MedChemExpress

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白头翁皂苷D说明书

【中文名称】：白头翁皂苷D
【英文名称】：Pulsatilla saponin D
【CAS编号】：68027-15-6
【分子式】：C47H76O17
【分子量】：912
【结构式】
【物理性状】：白色粉末
【生产厂家】：南京春秋生物
【质量承诺】：非人为造成的产品质量问题，我司负责退货换货。

【提取来源】：毛茛科植物白头翁
宿根草本，根圆锥形，有纵纹，全株密被白色长柔毛，株高10-40厘米，通常20－30厘米。

基生叶4-5片，三全裂，有时为三出复叶。

花单朵顶生，径约3-4厘米，萼片花瓣状，6片排成2轮，蓝紫色，外被白色柔毛；雄蕊多数，鲜黄色；花期4-6月。

瘦果，密集成头状，花柱宿存，银丝状。

【有效期】：24个月
【测定方法】：高效液相色谱
【贮存条件】：4℃冷藏、密封、避光
【所属类别】：植物提取物
【药理药效】：抗癌、抗肿瘤活性。

资生堂新品液相色谱柱思普乐介绍资料2_4

反相色谱柱S P O L A RSPOLAR C18　专为中国用户开发的普适型色谱柱～SPOLAR…Stable and Popular稳定而普适的色谱柱～思普乐C18柱使用高纯度硅胶为基材，在导入碳十八基团后采用资生堂公司独有的封端技术对色谱填料进行处理，有效地降低了色谱填料中残存硅醇基的2次影响。

思普乐C18柱通过合理优化制造步骤和生产工艺，有效的降低了生产成本，让更多的中国用户可以亲身体验资生堂色谱柱的高品质。

思普乐色谱柱卓越的耐酸能力、广泛的适用性和尖锐对称的峰形必将使您爱不释手。

表面极性具有良好的耐酸性，可在酸性条件下安定使用。

C18色谱柱在酸性条件下使用时,Si-O键易断裂导致C18流失,从而降低色谱柱的使用寿命。

我们参考考察卡赛帕克ACR耐酸性实验时的方法，特别选用苛刻的酸性流动相对思普乐C18进行考察,思普乐C18表现出了卓越的耐酸性。

耐酸性实验　物性值/参数图125300 2.82～10L119C18(碳十八基)　极性化合物以尖锐峰形快速溶出思普乐C18与卡赛帕克C18 MG相比具有略低的表面极性和疏水性，与卡赛帕克C18 UG120的保留能力相近。

对极性化合物的保留时间更短，峰形更加尖锐。

色谱柱：SPOLAR C18 5μm4.6 mm i.d.×150mm流动相：甲醇/三氟乙酸/水=10/1/89 （pH=1.0-1.2）流速：1.0 mL/min温度：60°C检测：UV 254 nm进样量：7μL样品：尿嘧啶苯甲醇（于25%甲醇溶液）※进行20小时的重复操作，苯甲醇的保留因子的维持率(%)通液时间（h）k维持率%①②③④⑤⑥⑦⑧⑨⑩０10203040[min]CAPCELL PAK MGCAPCELL PAK UG120SPOLAR色谱柱：5μm4.6 mm i.d.×150mm流动相：50% 甲醇流速：1.0 mL/min温度：40°C检测：UV 254 nm样品：十种标准样品（极性到非极性化合物）①尿嘧啶②咖啡因③苯酚④2-乙基吡啶⑤苯甲酸甲酯⑥苯⑦N,N’-二甲基苯胺⑧甲苯⑨1-苯基-2,4-戊二酮⑩萘达到10万/m的理论塔板数色谱柱：SPOLAR C18 5μm流动相：乙腈/水=60/40流速：1.0 mL/min温度：35°C检测：UV 254 nm进样量：2μL样品：①尿嘧啶②苯甲酸甲酯③甲苯④萘高理论塔板数和低柱压同时实现。

ARTISAN技术组-设备说明书

ErrataTitle & Document Type:Manual Part Number:Revision Date:HP References in this ManualThis manual may contain references to HP or Hewlett-Packard. Please note that Hewlett-Packard's former test and measurement, semiconductor products an d chemical analysis businesses are now part of Agilent Technologies. We have made no changes to this manual copy. The HP XXXX referred to in this document is now the Agilent XXXX. For example, model number HP8648A is now model number Agilent 8648A.About this ManualWe’ve added this manual to the Agilent website in an effort to help you support your product. This manual provides the best information we could find. It may be incomplete or contain dated information, and the scan quality may not be ideal. If we find a better copy in the future, we will add it to the Agilent website.Support for Your ProductAgilent no longer sells or supports this product. You will find any other available product information on the Agilent Test & Measurement website:Search for the model number of this product, and the resulting product page will guide you to any available information. Our service centers may be able to perform calibration if no repair parts are needed, but no other support from Agilent is available.16500B/16501A Logic Analysis System User's Reference 16500-97010April 1994U s er’s Ref er encePubl i c a t i on num be r16500-97010Fi r s t edi t i on,Apr i l1994For Sa f e t y i nf or m a t i on,W a r r a nt i es,a nd Reg ul a t or yi nf or m a t i on,s ee t he pa ges be hi nd t he i nde x©Copyr i g ht Hewl et t-Pac ka r d Com pa ny1987,1990,1993,1994 Al l Ri ght s Re s er v edHP 16500B/16501ALogi c Anal ys i s Sys t emI n Thi s BookW el c om e t o t he He wl et t-Pac ka r d Logi c Ana l y s i s Sys t em!The HP 16500B Logi c Ana l y s i s Sys t em i s des i gned t o be t heea s i es t s ys t em t o us e,ev e r.I t s m odul a r des i gn a l l ows you t o c onf i gur e i t wi t h j us t t he m ea s ur em ent m odul es you need now, yet a dd ot he r m odul es l a t e r.Thi s r e f er enc e expl a i ns t he oper a t i on of t he s ys t em m a i nf r a m e a nd I nt er m odul em enus.Al s o i nc l ude d i s i nf or m a t i on ont he m os t c om m on s ys t em opt i ons.O r gani zat i onW hen you or der t he HP 16500B,you get t wo bi nder s(one i s ext r a f or l a t e r us e). The m a i nf r a m e r e f er enc e i nf or m a t i on i s f ound be hi nd t he f i r s t t a b "HP 16500BM a i nf r a m e."I nf or m a t i on on t he opt i ona l keyboa r d,m ous e,a nd t he HP 16501A Expa ns i onFr a m e i s f ound behi nd t he s ec ond t a b, "Sys t em Opt i ons."As you a c c um ul a t eot her s ys t em opt i ons,pl a c e t hes er ef er e nc es behi nd t hi s t a b.Behi nd t he t hi r d t a b "Com m on M odul e Oper a t i ons"i s i nf or m a t i on c om m on t om os t m odul es,l i ke i ns t a l l i ng m odul e s,us i ng s ym bol s,a nd a s s i gni ng l a bel s.As you pur c ha s e a ddi t i ona l m ea s ur em ent m odul es,pl a c e t hei r r ef er e nc es a t t heba c k of t hi s bi nde r or i n t he s e c ondbi nder.W hat i s i n t he H P 16500B Us er’s Ref er ence?•Cha pt e r1 i nt r oduc es t he HP 16500B by s um m a r i z i ng i t s f ea t ur es.•Cha pt e r2 di s c r i bes t he m a i nf r a m e’s Sys t em Conf i g ur a t i on m e nu.•Cha pt e r3 di s c r i bes t he HP-I B a nd RS-232C i nt er f a c es.They a r e us ed f or pr i nt i ng s c r eens a nd c om put e r c ont r ol l ed m ea s ur em ent s.•Cha pt e r4 expl a i ns how t o pr i nt s c r eens t o v a r i ous g r a phi c s pr i nt er s.•Cha pt e r5 di s c r i bes t he f l exi bl e di s k a nd ha r d di s k ope r a t i ons.•Cha pt e r6 des c r i bes t he Sys t em Ut i l i t i es m enu.Adj us t m ent s t o t he r ea l-t i m e c l oc k,t ouc h c a l i br a t i on,a nd s c r een c ol or s a r e m a de her e.•Cha pt e r7 expl a i ns how t o m a ke i nt er m odul e m ea s ur em ent s.•Cha pt e r8 l i s t s t he i ns t r um ent s pec i f i c a t i ons a nd c ha r a c t er i s t i c s.•Cha pt e r9 expl a i ns t he gener a l i ns t r um ent m a i nt ena nc e a nd r epa c ki ngi nf or m a t i on.Al s o i nc l uded i s a des c r i pt i on of t he s el f-t es t t ha t i sper f or m ed when t he i ns t r um e nt i s t ur ned on.•Cha pt e r10 des c r i bes a l l s y s t e m a nd di s k er r or m es s a ges.W hat i s i n t he Sys t em O pt i ons?•Cha pt e r1 expl a i ns t he key boa r d a nd m ous e opt i ons.•Cha pt e r2 des c r i bes t he HP 16501A Expa ns i on Fr a m e opt i on.Ev en t hough you m a y not ha v e pur c ha s e d t he s e opt i ons yet,keep t hi si nf or m a t i on f or pos s i bl e f ut ur e us e.W hat i s i n t he C om m on M odul e O per at i ons?•Cha pt e r1 des c r i bes a s s i gni ng l a bel s.•Cha pt e r2 des c r i bes us i ng s ym bol s.•Cha pt e r3 expl a i ns t he gener a l i ns t a l l a t i on f or i ndi v i dua l m odul es.W her e t o go nextI f you ha v en’t a l r ea dy r ea d Se t t i ng Up The HP 16500 Logi c Anal ys i sSys t e m,pl ea s e r ea d i t be f or e c ont i nui ng.M S-DOS®i s a US r egi s t er e d t r a de m a r k of M i c r os of t Cor por a t i on.Cont ent sH P 16500BM ai nf r am e1W hat I s t he H P 16500B Logi c A nal ys i s Sys t em?Ke y Fea t ur es 1–3Opt i ona l Fea t ur es 1–3Us er I nt er f a c es1–4Def a ul t Conf i gur a t i ons 1–4Ac c es s or i es Suppl i ed 1–5Ac c es s or i es Av a i l a bl e 1–52The Sys t em Conf i gur at i on M enuGe t t i ng i nt o t he Sys t em Conf i g ur a t i on M enus 2–4La yout of t he Sy s t e m Conf i gur a t i on M enus 2–5Sl ot Des i gna t or s 2–63C onf i gur i ng t he H P-I B and RS-232CConf i gur i ng t he HP-I B I nt er f a c e3–4Conf i gur i ng t he RS-232C I nt er f a c e3–5Conf i gur i ng t he I nt er f a c e f or a Cont r ol l er or Pr i nt er 3–84C onnect i ng a Pr i nt erConne c t i ng HP-I B Pr i nt e r s 4–3Conne c t i ng RS-232C Pr i nt e r s 4–6Conne c t i ng t o Ot he r Hewl et t-Pa c ka r d Pr i nt er s 4–9Pr i nt i ng t he Di s pl a y 4–11Cont ent s–1Contents5The D i s k D r i ve M enusAc c es s i ng t he Di s k M enus 5–5I ns t a l l i ng a Fl exi bl e Di s k 5–6Sel e c t i ng a Di s k Oper a t i on 5–7Loa di ng a Fi l e 5–8For m a t t i ng a Di s k 5–10St or i ng Fi l es on a Di s k 5–12Rena m i ng a Fi l e 5–15Aut ol oa di ng a Fi l e 5–17Pur gi ng a Fi l e 5–19Copy i ng a Fi l e 5–20Pac ki ng a Di s k 5–22Dupl i c a t i ng a Di s k 5–23M a ki ng a Di r e c t or y 5–24Cha ngi ng t he Di r ec t or y 5–25Cr ea t i ng a Sys t em Fl e xi bl e Di s k 5–266The Sys t em Ut i l i t i es M enuThe Touc h a nd Sound Fi el ds 6–4Touc h Ca l i br a t i on 6–4Set t i ng t he Rea l-t i m e Cl oc k 6–6Tur ni ng t he Sound On/Of f 6–7Di s pl a y Col or Se l ec t i on 6–8Sel e c t i ng t he Col or,Hue,Sa t ur a t i on,a nd Lum i nos i t y Fi e l ds 6–10 Sel e c t i ng Col or s 6–12Ret ur ni ng t o t he De f a ul t Col or s 6–14Cont ent s–2Contents7I nt er m odul e M eas ur em ent sAc c es s i ng t he I nt er m odul e M enu 7–5Conf i gur i ng a Gr oup Run 7–6Conf i gur i ng Por t I n/Out 7–8The Gr oup Run/St op Fi el d 7–10The M odul es Li s t 7–11St a t us I ndi c a t or s a nd Ti m e Cor r el a t i on Ba r s 7–12Adj us t i ng Ske w 7–13W ha t Ar e Som e Typi c a l I nt er m odul e M e a s ur em e nt s?7–14Di s pl a y i ng M ul t i pl e M odul e Da t a on One Sc r een 7–18Hel pf ul Hi nt s 7–218G ener al Char act er i s t i csCha r a c t e r i s t i c s8–29M ai nt ai ni ng t he H P 16500BCl ea ni ng Requi r e m ent s9–2Dega us s i ng 9–3Ser v i c e a nd Ca l i br a t i on 9–3The Sys t em Tes t M enu 9–4Repa c ka gi ng f or St or a g e or Shi pm e nt 9–510Er r or M es s agesDi s k Er r or M es s a ges 10–3Di s k W a r ni ng M e s s a ge s10–5Power up Sel f-Tes t Doc um ent a t i on 10–6Fai l Codes 10–7Cr i t i c a l Er r or s10–8Non-Cr i t i c a l Er r or s10–8Cont ent s–3ContentsSys t em O pt i ons1Us i ng t he O pt i onal K eyboar d and M ous eM ov i ng t he Cur s or1-3Ent er i ng Da t a i nt o a M enu 1-5Us i ng t he Keyboa r d Ov er l a ys1-7Def i ni ng Ti m e Uni t s1-9Def i ni ng Vol t a ge Uni t s1-9As s i gni ng Edge Tr i gge r s1-10Cl os i ng a M enu 1-10Conne c t i ng t he Ke yboa r d a nd M ous e1-112The O pt i on H P 16501A Expans i on Fr am eCom ponent Det a i l s2-3Sys t em Conf i g ur a t i on 2-4Sys t em Ar m i ng a nd Tr i gg er i ng 2-4Conne c t i ng t he HP 16501A Expa ns i on Fr a m e 2-7 Com m on M odul eO per at i ons1Label s As s i gnm entLa bel As s i gnm ent Fi el ds1-3Rol l i ng La bel s a nd Pods1-52Sym bol s As s i gnm entSym bol s Fi e l d 2-33I ns t al l i ng and Rem ovi ng Car dsGe ner a l I ns t a l l a t i on Pr oc e dur e 3-3HP 16532A I ns t a l l a t i on Cons i de r a t i ons3-7HP 16517A/18A I ns t a l l a t i on Cons i der a t i ons3-11Cont ent s–41W hat I s t heH P 16500B Logi c Anal ys i s Sys t em?The H P 16500BThe HP 16500B i s t he m a i nf r a m e of t he Hewl e t t-Pa c ka r d Logi cAna l y s i s Sys t em.I t of f er s a m odul a r s t r uc t ur e f or pl ug-i n c a r ds wi t h a wi de r a ng e of s t a t e,t i m i ng,os c i l l os c ope,a nd pa t t er n g ener a t orc a pa bi l i t i es.Thi s a l l ows you t o c onf i gur e t he HP 16500B us i ng onl yt he m odul es you nee d i n or der t o per f or m a des i r ed m ea s ur em ent or s e t of m ea s ur em ent s,whi l e g i v i ng y ou t he f l exi bi l i t y t o c ha nge or upda t e t he m l a t er.The Log i c Ana l ys i s Sys t em pr ov i de s bot h exper i e nc e d a nd f i r s t-t i m e us er s wi t h power f ul m ea s ur em ent c a pa bi l i t i es.The pop-up m enusa nd c ol or gr a phi c s l ea d y ou t hr ough s et ups a nd m ea s ur e m e nt s qui c kl y a nd ea s i l y,wi t hout t he need t o m em or i z e a l ot of s t e ps.By t ouc hi ngt he a ppr opr i a t e f i el ds or us i ng t he c ur s or of ei t he r t he opt i ona l m ous e or keyboa r d,you c a n per f or m f unc t i ons,c onf i gur e m enus,a nd m ov ef r om one m e nu t o a not her.W i t h t he i nt er m odul e c a pa bi l i t i es of t he Logi c Ana l y s i s Sys t em,youc a n m a ke i nt e r a c t i v e m e a s ur em ent s be t ween m odul es.Thi s a l l ows you t o c onf i gur e m odul e s t o i nt er a c t wi t h ea c h ot her,us i ng t het r i g ger i ng c a pa bi l i t i es of one m odul e a nd t he a c qui s i t i on c a pa bi l i t i es of a not her.Syst em O pt i onsThe HP 16501A i s t he a dd-on m a i nf r a m e f or expa ndi ng t he m odul ec a pa c i t y of t he HP 16500B.W he n t he HP 16501A i s c onnec t ed t o t he HP 16500B,t heyf unc t i on a s a s i ngl e t en-c a r d s y s t em whi c h i s t ur ned on a nd c ont r ol l ed by t he HP 16500B.The HP 16501A f or m s a t i ght l y c oupl ed s ys t e m wi t h t he HP 16500B,per m i t t i ng ea ch of t he t wom a i nf r a m e s t o a r m or t r i g ger a ny m odul e f r om a ny ot her m odul e.An opt i ona l LAN i nt e r f a c e i s a v a i l a bl e f or di r ec t c onnec t i on t oc om put e r s l oc a t ed on a n Et her net l oc a l a r ea net wor k (LAN).The LAN i nt erf a c e ena bl es you t o upl oa d m e a s ur em ent da t a f or t he m os t c om pr ehens i v e pos t-pr oc es s i ng nee ds a nd ea s y a c c es s t o da t a f i l e s.1–2Key Feat ur esThe key f e a t ur es of t he HP 16500B a r e:•M odul a r m a i nf r a m e wi t h f i v e c a r d s l ot s .•9-i nc h c ol or m oni t or .•Touc hs c r e en wi t h on/of f c ont r ol .•Ba t t er y ba c ked Re a l -t i m e c l oc k.•Pr ogr a m m a bl e PORT I N v ol t a ge l ev e l a nd e dge s el ec t i on.•3.5-i nc h f l exi bl e di s k dr i v e wi t h DOS a nd LI F f or m a t s uppor t .•170 M by t e ha r d di s k dr i v e wi t h DOS f or m a t s uppor t .•I nt e r m odul e t r i gge r i ng a nd 2 ns t i m e c or r el a t i on of a c qui r ed da t a .•HP-I B a nd RS-232C i nt er f a c es f or :— Ha r dc opy out put t o a pr i nt er— Cont r ol l er i nt er f a c e .O pt i onal Feat ur esThe opt i ona l f e a t ur es of t he HP 16500B:•HP16501A Expa ns i on Fr a m e. I nc r ea s e a v a i l a bl e c a r d s l ot s t o t en whe n you c onnec t t he expa ns i on f r a m e t o a n HP 16500B.•M ous e.•Ke yboa r d.•Et her net LAN i nt er f a c e .•Expa nda bl e s ys t em m em or y up t o 64 M byt e s .See Also "Sys t em Opt i ons " f or m or e i nf or m a t i on on a v a i l a bl e s ys t em s of t wa r e a ndha r dwa r e opt i ons .What is the HP 16500B Logic Analysis System Key Features1–3What is the HP 16500B Logic Analysis SystemUser InterfacesU s er I nt er f acesThe HP 16500B ha s f our us er i nt e r f a c e dev i c es:t he knob on t he f r ont pa nel,t he t ouc hs c r ee n,t he opt i ona l m ous e,a nd t he opt i ona l key boa r d.The knob on t he f r ont pa nel i s us ed t o m ov e t he c ur s or on c er t a i n m enus,i nc r em ent or de c r em ent num e r i c f i e l ds,a nd t o r ol l t he di s pl a y.The t ouc hs c r e en f i e l ds c a n be s el ec t e d by t ouc h or wi t h t he opt i ona l m ous eor key boa r d.To a c t i v a t e a f i e l d by t ouc h,pr es s t he da r k bl ue f i e l d on t hedi s pl a y wi t h your f i ng er unt i l t he f i el d c ha ng es c ol or.Then m ov e your f i nge ra wa y f r om t he s c r een t o a c t i v a t e y our s el ec t i on.You ha v e t he opt i on ofdi s a bl i ng t he t ouc hs c r e en wi t h t he f r ont-pa ne l Touc h On/Of f but t on.See Also The "Sy s t e m Opt i ons"pa r t f or m or e i nf or m a t i on on us i ng t he opt i ona lke yboa r d a nd m ous e.Scr een C ont r as t and Br i ght nes sSc r een c ont r a s t a nd br i ght nes s a r e a dj us t ed by t ur ni ng t he t wo s m a l l knobsl oc a t ed be nea t h t he Touc h Sc r ee n but t on.The l e f t knob i s f or br i ght nes s a ndt he r i ght knob i s f or c ont r a s t.D ef aul t Conf i gur at i onsW hen t he i ns t r um e nt i s power ed up,pr edet er m i ned v a l ue s a r e a ut om a t i c a l l ya s s i gned t o t he di f f er ent f i e l ds of t he m e nus t o c onf i gur e t he i ns t r um ent f orba s i c m ea s ur em ent s.Thi s a l l ows y ou t o m a ke a ba s i c m ea s ur e m ent byt ur ni ng on t he i ns t r um ent,c onnec t i ng t he pr obes,a nd t ouc hi ng t he Runf i el d.Of t en,onl y m i nor c ha nges a r e ne eded f or m or e c om pl e x m ea s ur e m ent s.St or i ng D ef aul t C onf i gur at i onsThe def a ul t c onf i gur a t i ons m a y be s t or e d on a di s k f or l a t er us e or r es et byc yc l i ng t he power.St or i ng de f a ul t c onf i g ur a t i ons on a di s k i s a c onv eni entwa y t o r et ur n t o t he def a ul t v a l ue s wi t hout c yc l i ng t he power.Def a ul t v a l uesf or ea c h m odul e c a n be s t or e d s epa r a t el y or t oget her i n one f i l e.See Also The "Us i ng t he Di s k Dr i v e M e nus"c ha pt er f or m or e i nf or m a t i on on t he St or e ope r a t i on.1–4What is the HP 16500B Logic Analysis SystemAccessories SuppliedAcces s or i es Suppl i edThe f ol l owi ng l i s t of a c c es s or i es i s s uppl i e d wi t h t he HP 16500B Logi cAna l y s i s Sys t em.I f a ny a c c es s or y i s m i s s i ng,c ont a c t your l oc a l s a l es of f i c e. Accessories Supplied QtyTraining Kit1User’s Reference Guide1Programming Reference Guide1Service Guide1Setting Up the System Guide1RS-232C Loopback Connector1Power Cord1Disk pouch containing composite software1Feeling Comfortable With Logic Analyzers guide1Feeling Comfortable with Digitizing Oscilloscopes guide1Filler Panels**Quant i t y depends on how m any m odul es ar e or der ed w i t h t he HP 16500B/16501AAcces s or i es Avai l abl eOt her a c c es s or i es a v a i l a bl e f or t he HP 16500B/16501A Logi c Ana l y s i s Sys t em a r e l i s t ed i n t he Ac c e s s or i e s f or HP Logi c Anal yze r s br oc hur e.1–51–62The Sys t em Conf i gur at i on M enuThe Sys t em Conf i gur at i on M enuThe Sys t em Conf i gur a t i on m enu i s t he f i r s t m enu you s ee a f t er t hei ni t i a l power-up of t he i ns t r um ent.Thi s m enu l i s t s t he m odul es a nds of t wa r e opt i ons t ha t your s y s t em i s c onf i g ur ed wi t h a nd s howswhet her t her e a r e f i v e c a r d s l ot s(t he HP 16500B a l one)or t en c a r ds l ot s(t he HP 16500B wi t h t he opt i ona l HP 16501A a t t a c hed)a v a i l a bl e.I t a l s o s hows i f ei t her t he opt i ona l m ous e or keyboa r d i sc onnec t ed.I f a m ous e i s c onnec t e d,t he s ys t e m c onf i gur a t i on m enui ndi c a t es whet her t he m ous e i s c onnec t e d di r ec t l y t o t he HP 16500Bor t o a keyboa r d c onnec t ed t o t he m a i nf r a m e.Fi na l l y,t he s ys t e mc onf i gur a t i on m e nu g i v es you a c c e s s t o t he c onf i gur a t i on of t he HP-I B, RS-232C,a nd opt i ona l LAN i nte rf a c es.2–2The System Configuration Menu M enu M apThe f ol l owi ng m e nu m a p i l l us t r a t e s a l l f i el ds a nd a v a i l a bl e opt i ons i nt he Sys t em Conf i g ur a t i on m enu.The m enu m a p wi l l hel p you ge t a nov er v i ew a s wel l a s pr ov i de you wi t h a qui c k r ef er e nc e of wha t t heSys t e m Conf i gur a t i on m enu c ont a i ns.System Configuration Menu Map2–3G et t i ng i nt o t he Sys t em Conf i gur at i on M enusI n t he upper -l ef t c or ne r of t he m enu a r e t wo f i e l ds t ha t i ndi c a t e t he c ur r ent m enu a nd m odul e. The f i e l d t o t he e xt r em e l ef t (Sys t em ) s hows you whi c h m odul e y ou’r e i n a nd t he one t o t he r i g ht of t he m odul e f i el d (Conf i gur a t i on)s hows you wha t m enu wi t hi n t he m odul e y ou’v e a c c es s ed.To a c c e s s t he Sy s t e m Conf i gur a t i on m enu, f ol l ow t hes e s t eps :1I f t he m odul e f i el d i n t he upper -l ef t cor ner of t he s c r een doe s notdi s pl ay "Sys t em ," s el ect t hi s f i e l d and w he n t he pop-up appe ar s , s el ect System. Thi s w i l l g et y ou i nt o one of t he Sy s t em m enus .2I f t he m odul e f i el d i n t he upper -l ef t cor ner of t he s c r een di s pl ay s "Sy s t em ," but t he m enu f i el d t o t he r i ght of Sys t em doe s n’t di s pl ay "Conf i gur at i on," s el ect t hi s f i el d. W hen t he pop-up appear s , s e l ec t Configuration t o di s pl ay t he Sys t e m Conf i gur at i on m enu.Module and Menu FieldsThe System Configuration Menu Getting into the System Configuration Menus2–4The System Configuration MenuLayout of the System Configuration MenusLayout of t he Sys t em Conf i gur at i on M enusThe f i g ur e bel ow s hows t he l a yout of t he Sys t em Conf i g ur a t i on m e nu f or t he HP 16500B.The f i g ur e i s l a bel l ed wi t h t he m a j or f e a t ur es a nd f unc t i ons oft he m enu.ModuleModuleModuleModuleModuleSystem Configuration Menu2–5The System Configuration MenuSlot DesignatorsSl ot D es i gnat or sThe s l ot des i gna t or s a r e l i s t ed a s A t hr ough E f or t he HP 16500B a l one,or A t hr ough J f or t he HP 16500B wi t h t he HP 16501A a t t a c hed.The s l otdes i gna t or s a r e di s pl a yed t o t he l ef t of t he l i s t of c a r ds f or t he s y s t e m a nd i ndi c a t e t he l oc a t i ons or s l ot s f or e a c h c a r d.W he n you s el ec t t he M odul ef i el d,a pop-up a ppe a r s.The l et t e r s a f t er t he na m e of ea c h m odul e i ndi c a t e t he l oc a t i on of ea c h “m a s t e r”c a r d f or t ha t m odul e.Slot Designators in Master Frame2–63Conf i gur i ng t heH P-I B and RS-232CThe H P-I B and RS-232C I nt er f acesThi s c ha pt e r des c r i bes t he c ont r ol l er a nd pr i nt e r i nt er f a c e s a nd t hei r c onf i gur a t i ons.I t de f i ne s t he HP-I B i nt er f a c e a nd des c r i bes how t os e l ec t a ny one of t he 31 di f f er e nt HP-I B a ddr e s s es a v a i l a bl e.I t a l s o def i nes t he RS-232C i nt e r f a c e a nd t el l s y ou how t o s el ec t a ba ud r a t e, how t o c ha nge t he s t op bi t s,how t o s et t he pa r i t y a nd da t a bi t s,a nd how t o c ha nge t he pr ot oc ol.Controller and Printer Configuration3–2Configuring the HP-IB and RS-232C The C ont r ol l er I nt er f aceThe HP 16500B i s e qui pped wi t h a s t a nda r d RS-232C i nt er f a c e a nd a n HP-I B i nt er f a c e t ha t a l l ow you t o c onne c t t o a c ont r ol l er.Thi s gi v e s you r em ot e a c c e s s f or r unni ng m ea s ur em ent s,f or upl oa di ng a nd downl oa di ng c onf i g ur a t i ons a nd da t a,f or pr i nt i ng,a nd m or e.Thec ont r ol l er i nt er f a c e i s e xpl a i ned i n m ore det a i l i n t heHP 16500B/16501A Pr ogr am m er’s Gui de.The Pr i nt er I nt er f aceThe HP 16500B c a n out put i t s s c r een di s pl a y t o v a r i ous HP-I B a ndRS-232C g r a phi c s pr i nt e r s.Conf i gur ed m enus,wa v ef or m s,a nd ot her da t a c a n be pr i nt ed f or c om pl et e m ea s ur em ent doc um ent a t i on.Thepr i nt er i nt er f a c e i s e xpl a i ned i n m or e det a i l i n c ha pt er"Connec t i ng a Pr i nt er."3–3Conf i gur i ng t he H P-I B I nt er f aceThe Hewl e t t -Pac ka r d I nt er f a c e Bus (HP-I B) i s Hewl et t -Pa c ka r d’si m pl em ent a t i on of I EEE St a nda r d 488-1978, “St a nda r d Di gi t a l I nt er f a c e f orPr ogr a m m a bl e I ns t r um e nt a t i on.” The HP-I B i s a c a r ef ul l y de f i ned i nt er f a c et ha t s i m pl i f i es t he i nt eg r a t i on of v a r i ous i ns t r um e nt s a nd c om put er s i nt os ys t em s . I t us es a n a ddr es s i ng t ec hni que t o ens ur e t ha t ea c h de v i c e on t hebus (i nt e r c onnec t ed by HP-I B c a bl es ) r ec ei v es onl y t he da t a i nt ende d f or i t .To a c c om pl i s h t hi s , ea c h dev i c e i s s et t o a di f f er ent a ddr es s a nd t hi s a ddr es si s us ed t o c om m uni c a t e wi t h ot her de v i c es on t he bus .Sel ect i ng an H P-I B A ddr es sThe HP-I B a ddr es s c a n be s et t o 31 di f f er ent HP-I B a ddr es s es , f r om 0 t o 30.Si m pl y c hoos e a n a ddr es s t ha t i s c om pa t i bl e wi t h your dev i c e or s of t wa r e.The def a ul t i s 7.1Sel e ct t he Communications f i el d.2Us i ng t he knob or keypad, e nt er a n HP-I B addr es s i n t he f i el d di r ect l yunder "HP-I B Addr es s ."To us e t he keypa d, s el e c t t he HP-IB Address f i el d a nd a pop-up keypa d wi l la ppea r . Then, e nt er t he a ddr es s a nd s el ec t Done .3W hen you a r e f i ni s hed conf i gur i ng t he HP-I B Addr e s s , s e l ec t Done .Communications Configuration pop-up MenuConfiguring the HP-IB and RS-232CConfiguring the HP-IB Interface3–4Conf i gur i ng t he RS-232C I nt er f aceThe RS-232C i nt er f a c e on t hi s i ns t r um ent i s He wl et t -Pac ka r d’si m pl em ent a t i on of EI A Rec om m ende d St a nda r d RS-232C, “I nt e r f a c e Bet weenDa t a Ter m i na l Equi pm ent a nd Da t a Com m uni c a t i ons Equi pm ent Em pl oy i ngSer i a l Bi na r y Da t a I nt er c ha nge.” Thi s i nt er f a c e s ends da t a one bi t a t a t i m e ,a nd c ha r a c t er s a r e not s y nc hr oni z ed wi t h pr e c edi ng or s ubs equent da t ac ha r a c t e r s . Ea c h c ha r a c t er i s s ent a s a c om pl et e ent i t y wi t hout r el a t i ons hi pt o ot her ev ent s .Baud Rat eThe ba ud r a t e i s t he r a t e a t whi c h bi t s a r e t r a ns f e r r ed bet ween t he i nt er f a c ea nd t he per i pher a l . The ba ud r a t e m us t be s et t o t r a ns m i t a nd r e c ei v e a t t hes a m e r a t e a s t he pe r i pher a l , or da t a c a nnot be s uc c es s f ul l y t r a ns f er r ed.1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3W hen t he pop-up m e nu appear s , s e l ec t t he f i el d di r ect l y t o t he r i ght of“Baud Rat e.”RS-232C ConfigurationConfiguring the HP-IB and RS-232C Configuring the RS-232C Interface3–54W hen t he s e c ond pop-up a ppe a r s , s el ec t t he ba ud r a t e you wa nt f r om t he l i s tdi s pl a yed i n t he pop-up (110 t o 19.2k) a nd t he pop-up wi l l di s a ppea r .St op Bi t sSt op bi t s a r e us ed t o i dent i f y t he e nd of a c ha r a c t e r . The num ber of s t op bi t sm us t be t he s a m e f or t he c ont r ol l er a s f or t he Logi c Ana l ys i s Sys t em.1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3Sel e ct t he f i el d di r ect l y t o t he r i ght of “St op Bi t s ” i n t he RS-232CConf i gur a t i on pop-up m enu.4W hen t he new pop-up appe ar s , s el ect 1, 1.5, or 2 s t op bi t s t o i dent i f yt he e nd of t he char ac t e r . The pop-up di s appear s , pl aci ng yours el e ct i on i n t he appr opr i at e f i e l d.Par i t yThe pa r i t y bi t det ec t s er r or s a s i nc om i ng c ha r a c t er s a r e r e c ei v ed. I f t hepa r i t y bi t doe s not m a t c h t he e xpe c t ed v a l ue, t he c ha r a c t er i s a s s um ed t o bei nc or r ec t l y r ec e i v ed. The a c t i on t a ken when a n er r or i s det e c t ed depends onhow t he i nt e r f a c e a nd t he de v i c e pr ogr a m a r e c onf i gur ed.Par i t y i s det e r m i ned by t he r equi r em ent s of t he s ys t em. The pa r i t y bi t m a ybe i nc l uded or om i t t ed f r om e a c h c ha r a c t e r by ena bl i ng or di s a bl i ng t hepa r i t y f unc t i on.1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3Sel e ct t he f i el d di r ect l y t o t he r i ght of “Par i t y” i n t he RS-232CConf i gur a t i on m enu.4W hen t he pop-up a ppea r s , s el ect None, Odd , or Even t o m at ch t hepar i t y of t he ext er nal de vi c e. Af t er y ou m ake your s e l ec t i on, t hepop-up di s appear s .Configuring the HP-IB and RS-232C Configuring the RS-232C Interface3–6Pr ot ocolPr ot oc ol gov er ns t he f l ow of da t a bet ween t he i ns t r um ent a nd t he ext e r na ldev i c e .1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3Sel e ct t he f i el d di r ect l y t o t he r i ght of “Pr ot ocol ” i n t he RS-232CConf i gur a t i on pop-up m enu.4W hen t he pop-up a ppea r s , s el ect None or Xon/Xoff .None•W it h l es s t ha n a 5-wi r e i nt er f a c e , s e l ec t i ng None does not a l l ow t he s e ndi ng or r ec e i v i ng dev i c e t o c ont r ol how f a s t t he da t a i s bei ng s ent . Noc ont r ol ov er t he da t a f l ow i nc r ea s es t he pos s i bi l i t y of m i s s i ng da t a ort r a ns f er r i ng i nc om pl et e da t a .•W it h a f ul l 5-wi r e i nt er f a c e, s el ec t i ng None a l l ows a ha r dwa r e ha nds ha ke t o oc c ur . W i t h a ha r dwa r e ha nds ha ke, ha r dwa r e s i gna l s c ont r ol da t a f l ow.The HP 13242G c a bl e a l l ows t he HP 16500B t o s uppor t ha r dwa r eha nds ha ke.Xon/Xoff•Xon/Xof f s t a nds f or Tr a ns m i t On/Tr a ns m i t Of f . W i t h t hi s m ode, t he r ec e i v er c ont r ol s t he da t a f l ow a nd c a n r eques t t ha t t he pr i nt er s t op da t af l ow a t a ny t i m e .5Sel e ct Done .D at a Bi t sDa t a bi t s a r e t he num ber of bi t s s e nt a nd r ec ei v e d per c ha r a c t er t ha tr epr es ent t he bi na r y c ode of t ha t c ha r a c t er . The HP 16500B s uppor t s t he8-bi t bi na r y c ode .Configuring the HP-IB and RS-232C Configuring the RS-232C Interface3–7。

安捷伦产品目录

15
Real-Time PCR
16
Mx3000P QPCR System
17
Brilliant III Ultra-Fast SYBR Green QPCR and QRT-PCR Reagents
18
Brilliant III Ultra-Fast QPCR and QRT-PCR Reagents
Agilent / STRATAGENE
Agilent website: /genomics
Welgene | Agilent Stratagene
威健股份有限公司 | Stratagene 總代理
Table of Content
Table of Contents
/ XL1-Red Competent Cells SoloPack Gold Supercompetent Cells
/ TK Competent Cells Specialty Cells
/ Classic Cells / Fine Chemicals For Competent Cells
適用於 UNG 去汙染或 bisulphite
sequencing
適用於 TA Cloning
最高敏感性
取代傳統 Taq 的好選擇
-
2
威健股份有限公司 | Stratagene 總代理
PCR Enzyme & Instrument
Agilent SureCycler 8800
市場上領先的 cycling 速度和 sample 體積 10 ～ 100 μL 簡易快速可以選擇 96 well 和 384 well 操作盤優秀的溫控設備讓各個 well 都能保持溫度的穩定七吋的高解析度觸控螢幕讓操作上更為簡便可以透過網路遠端操控儀器及監控儀器 Agilent 專業的技術支援可以幫助您應對各種 PCR 的問題

巴斯夫帝派斯Ultra PA 4560 AN表面活性剂制品安全技术说明书

安全技术说明书页: 1/10 巴斯夫安全技术说明书按照GB/T 16483编制日期 / 本次修订: 21.05.2023版本: 6.0日期/上次修订: 16.02.2023上次版本: 5.2日期 / 首次编制: 26.01.2011产品: 帝派斯 Ultra PA 4560 AN 表面活性剂制品Product: Dispex® Ultra PA 4560 AN(30766813/SDS_GEN_CN/ZH)印刷日期 08.09.20231. 化学品及企业标识帝派斯 Ultra PA 4560 AN 表面活性剂制品Dispex® Ultra PA 4560 AN推荐用途和限制用途: 分散剂公司:巴斯夫(中国)有限公司中国上海浦东江心沙路300号邮政编码 200137电话: +86 21 20391000传真号: +86 21 20394800E-mail地址: **********************紧急联络信息:巴斯夫紧急热线中心（中国）+86 21 5861-1199巴斯夫紧急热线中心（国际）:电话: +49 180 2273-112Company:BASF (China) Co., Ltd.300 Jiang Xin Sha RoadPu Dong Shanghai 200137, CHINA Telephone: +86 21 20391000Telefax number: +86 21 20394800E-mail address: ********************** Emergency information:Emergency Call Center (China):+86 21 5861-1199International emergency number: Telephone: +49 180 2273-1122. 危险性概述纯物质和混合物的分类:皮肤腐蚀/刺激: 分类3对水环境的急性危害: 分类3巴斯夫安全技术说明书日期 / 本次修订: 21.05.2023版本: 6.0产品: 帝派斯 Ultra PA 4560 AN 表面活性剂制品Product: Dispex® Ultra PA 4560 AN(30766813/SDS_GEN_CN/ZH)印刷日期 08.09.2023标签要素和警示性说明:警示词:警告危险性说明:H316造成轻微皮肤刺激。

三模式探头系列P7500系列数据表P7516（含可选功能P75PDPM）特点与优势说明书

TriMode™Probe FamilyP7500SeriesDatasheetP7516with optional P75PDPMFeatures &Bene ﬁtsTriMode™Probe –One Setup,Three Measurements without Adjusting Probe Tip Connections Differential Single EndedCommon Mode (Requires only one probe vs.conventional probing techniques)Signal Fidelity25GHz P7520A (with P75PST tip)20GHz P7520A 16GHz P751613GHz P7513A 8GHz P75086GHz P75064GHz P7504Versatile Connectivity –Solder Down,Handheld,Fixtured Variety of Solder-down Options TriMode™Solder TipsSmall Form Factor for High-density Probing Bandwidth Choices from 4to 25GHz1.5m Extension Cable for High-temperature Probing Quickly and Reliably Connect to Multiple Probe TipsPrecision Differential Probing Module –Optional Handheld and Fixtured ProbingSmall Precision Tapered Tips,an Articulated Joint for Compliance,and Variable Tip Spacing TekConnect ®Interface –TekConnect Scope/Probe Control and UsabilityDirect Control from Probe Compensation Box or from Scope Menu Automated Measurement Control through the TekConnect ®Interface to Connect to Tektronix Real-time OscilloscopesView TriMode/Attentuation Settings on Probe Compensation Box from Top or End PanelApplicationsExamples Include,but are Not Limited To:PCI Express 3.0,Serial ATA III,DDR2/3/4,QPI,XAUI1981DatasheetBefore TriMode:1Probe for Differential;2Probes for SE and Common Mode;or 1Probe Soldered and Resoldered 3times;2Probes for Common Mode.TriMode™Probing,Connectivity,and PerformanceTriMode™Probing ArchitectureOne-probe setup makes differential,single ended,and common mode measurements accurately and de ﬁnitively.Tektronix is a known leader when it comes to signal ﬁdelity and signalacquisition.Building on our history of market-leading innovations inprobing,After TriMode (P75TLRST):1Probe for Differential,Single Ended,and Common Mode,with only 1setup required.we invented a revolutionary probing architecture called “TriMode™Probing”that de ﬁnes the next-generation industry benchmark for usability and signal ﬁdelity.This architecture changes the rules of probing and allows you to work more effectively and ef ﬁciently.By enabling unique functionality,the P7500Series TriMode probes allow you to switch between differential,single ended,and common mode measurements without moving the probe from its connection points.Improved productivity is achieved by reducing setup time.One setup can be used to make the three different types of measurements all with the press of a button.The TriMode Probe architecture for the P7500Series probes continues the Tektronix tradition of high-bandwidth and low-DUT loading while providing improved connectivity and value.2TriMode™Probe Family —P7500SeriesConnectivity Plus –Solder Down –Handheld –FixturedThe P7500Series TriMode probe architecture offers various levels of connectivity and provides the highest probe ﬁdelity available for real-time oscilloscopes.The multipoint connectivity solutions of the P7500Series include:TriMode Performance Solder Tip The highest-performance solder tip.Up to 25GHzbandwidth.TriMode Long-reach Solder Tip A high performance solder tip with a long reach and very small,low-pro ﬁle form factor.Up to 20GHzbandwidth.TriMode Resistor Solder Tip High-performance solder tip with easy-to-solder tip resistors.Up to 18GHzbandwidth.TriMode Extended-resistor Solder Tip Medium-performance solder tip with long easy-to-solder tip resistors.Up to 7GHzbandwidth.3DatasheetTriMode Micro-coax Tip Low-cost,quick-connect solder tips.Up to 4GHzbandwidth.TriMode High-temperature Tip When used with the 1.5m Socket Cable XL,this tip can be used in environments from –55°C to 150°C.Up to 10GHz bandwidth withDSP.Damped Wire Tip Low-cost solder tips ideal for high-density probing.Up to 8GHzbandwidth.Precision Differential Probing Module High-performance handheld probing module.Up to 18GHzbandwidth.Handheld and ﬁxtured probing needs are met using the optional Precision Differential Probing Module (P75PDPM).Its small precision tapered tips,variable articulation of the probe tip,and quick-adjusting variable tip spacing provides the needed ﬂexibility for adapting to vias and other test points of differing sizes from 30mils to 180mils.These precision connectivity tools enable you to access multiple signals on anything from convenient test pads to hard-to-reach,high-density circuitry.4TriMode™Probe Family —P7500SeriesSignal FidelityYou can be con ﬁdent in the signal ﬁdelity of your measurements.The innovative new Tektronix differential architecture,coupled with the superior electrical performance of IBM SiGe Technology,provides the bandwidth and ﬁdelity to meet the industry needs of today as well as tomorrow.The P7500Series Probe Architecture provides:Highest bandwidth available –25GHz Excellent step response Low-DUT loading High CMRRDifferential,single ended,or common mode measurements using one probePerformance You Can Count OnDepend on Tektronix to provide you with performance you can count on.In addition to industry-leading service and support,this product comes backed by a one-year warranty as standard.CharacteristicsP7500with P75PDPMTriMode Probe ArchitectureP7520AP7516P7513A P7508P7506P7504Bandwidth (Typical,Probe Only)>20GHz,A-B mode >18GHz,P75PDM,other modes >16GHz >13GHz >8GHz >6GHz >4GHz Rise Time (10-90%)(Typical,Probe Only)<27ps,A-B mode <29ps,other modes <32ps <40ps <55ps <75ps <105ps Rise Time (20-80%)(Typical,Probe Only)<18ps,A-B mode <20ps,other modes<24ps <28ps <35ps <50ps <70ps Attenuation(User Selectable)5X or 12.5X 5X or 12.5X 5X or 12.5X 5X or 12.5X 5X or 12.5X 5X or 12.5X Differential Input Range ±0.625V (5X)±1.6V (12.5X)±0.75V (5X)±1.75V (12.5X)±0.75V (5X)±1.75V (12.5X)±0.75V (5X)±1.75V (12.5X)±0.75V (5X)±1.75V (12.5X)±0.75V (5X)±1.75V (12.5X)Operating Voltage Window+3.7to –2.0V +4.0to –2.0V +4.0to –2.0V +4.0to –2.0V +4.0to –2.0V +4.0to –2.0V Offset Voltage Range+2.5to –1.5V,A-B mode +3.4to –1.8V,other modes +2.5to –1.5V,A-B mode +3.4to –1.8V,other modes +2.5to –1.5V,A-B mode +3.4to –1.8V,other modes +2.5to –1.5V,A-B mode +3.4to –1.8V,other modes +2.5to –1.5V,A-B mode +3.4to –1.8V,other modes +2.5to –1.5V,A-B mode +3.4to –1.8V,other modes DC Input Resistance (Differential)100k ohms 100k ohms 100k ohms 100k ohms 100k ohms 100k ohms Noise<33nV /√Hz (5X)<48nV /√Hz (12.5X)<33nV /√Hz (5X)<48nV /√Hz (12.5X)<33nV /√Hz (5X)<48nV /√Hz (12.5X)<33nV /√Hz (5X)<48nV /√Hz (12.5X)<33nV /√Hz (5X)<48nV /√Hz (12.5X)<33nV /√Hz (5X)<48nV /√Hz (12.5X)CMRR(Differential Mode)>60dB at DC >40dB at 50MHz >30dB at 1GHz >20dB at 10GHz >12dB at 20GHz>60dB at DC >40dB at 50MHz >30dB to 1GHz >20dB to 8GHz >15dB to 16GHz>60dB at DC >40dB at 50MHz >30dB to 1GHz >20dB to 7GHz >15dB to 13GHz>60dB at DC >40dB at 50MHz >30dB at 1GHz >25dB at 4GHz >20dB at 8GHz>60dB at DC >40dB at 50MHz >30dB at 1GHz >25dB at 3GHz >20dB at 6GHz>60dB at DC >40dB at 50MHz >30dB at 1GHz >28dB at 2GHz >25dB at 4GHzNondestructive Input Range ±15V ±15V ±15V ±15V ±15V ±15V Interface TekConnect™TekConnect™TekConnect™TekConnect™TekConnect™TekConnect™Cable Length1meter1meter1.3meters1.3meters1.3meters1.3metersFor additional characteristics,refer to the individual probe Technical Reference Manuals.5DatasheetTypical System Speci ﬁcationsThe typical system speci ﬁcations in the table below are achieved using a P7520A probe with a DPO/DSA72504D or DPO/DSA73304D Oscilloscope and a P75PST solder tip.CharacteristicA-B ModeAll Other ModesSystem Bandwidth25GHz >18GHz System Rise Time (10%–90%)<20ps <29ps System Rise Time (20%–80%)<14ps<20psMinimum System Requirements /Instrument CompatibilityP7500Series TriMode Differential Probes are compatible with the DPO/DSA/MSO70000and TDS6000B/C Series TekConnect Oscilloscopes.The chart below shows recommended probe/oscilloscope model combinations.InstrumentBW (Scope)FW VersionRecommended ProbeDPO/DSA73304D 33GHz V6.4.1or higher P7520A DPO/DSA72504D 25GHz V6.4.1or higher P7520A DPO/DSA7200420GHz V3.0or higher P7520A DPO/DSA7160416GHz V3.0or higher P7516DPO/DSA7125412.5GHz V3.0or higher P7513A DPO/DSA708048GHz V3.0or higher P7508DPO/DSA706046GHz V3.0or higher P7506DPO/DSA704044GHzV3.0or higher P7504TDS6000C 12.5GHz,15GHz V5.1.7P7516,P7513A TDS6000B8GHz,6GHzV5.1.3P7508,P750680A03TekConnect Probe Interface V2.3All P7500Series probes RTPA2A TekConnect Probe InterfaceV2.3All P7500Series probesOrdering InformationP7520A TriMode™Differential Probe,20GHz,for TekConnect Interface Oscilloscopes.P7516TriMode™Differential Probe,16GHz,for TekConnect Interface Oscilloscopes.P7513A TriMode™Differential Probe,13GHz,for TekConnect Interface Oscilloscopes.P7508TriMode™Differential Probe,8GHz,for TekConnect Interface Oscilloscopes.P7506TriMode™Differential Probe,6GHz,for TekConnect Interface Oscilloscopes.P7504TriMode™Differential Probe,4GHz,for TekConnect Interface Oscilloscopes.All Include :One-year warranty,plus see Standard Accessories table.Service OptionsOptionDescriptonCA1Single Calibration or Functional Veri ﬁcation C3Calibration Service 3Years C5Calibration Service 5YearsD3Calibration Data Report 3Years (with Option C3)D5Calibration Data Report 5Years (with Option C5)G3Complete Care 3Years (includes loaner,scheduled calibration and more)G5Complete Care 5Years (includes loaner,scheduled calibration and more)R3Repair Service 3Years R5Repair Service 5YearsAdditional Service Products Available During Warranty (DW)R3PDW Repair service coverage 3years (includes product warranty period).3-year period starts at time of customer instrument purchaseR5PDWRepair service coverage 5years (includes product warranty period).5-year period starts at time of customer instrument purchase6TriMode™Probe Family —P7500SeriesStandard AccessoriesDescriptionP7520A/P7516P7513A/P7508P7506/P7504Reorder Part Number020-2790-xx(P7516/P7513A/P7508)020-2977-xx (P7506/P7504)The documentation kit contains:Printed Quick Start User Manuals,CD-ROM contains PDFs of basic probe and measurement literature,and the probe manuals (Quick Start User Manual and Technical Reference Manual)1each *11each 1each071-3048-xx (P7520A)Antistatic Wrist Strap1each 006-3415-xx Certi ﬁcate of Traceable Calibration1each 1each 1each Standard with probe Data Calibration Report:Lists themanufacturing test results of your probe at the time of shipment and is included with every probe1each 1each 1eachStandard with probeDC Probe Calibration Fixture1each 067-1821-xx DC Probe Calibration Fixture1each 1each 067-1967-xx 50ΩCoax Cable –Male BNC to Male BNC1each 1each 1each 012-0208-xx 50ΩCoax Cable –Male SMA to Male SMA1each 1each 1each174-1120-xx Solder Tip Ramps (25each)1each (P7520A only)020-3118-xx P7520A/P7516/P7513A/P7508Accessory Box (See contents listing below 1through 7)1)TriMode Long-reach Solder Tip2each 2eachP75TLRST 2)G3PO Bullet Kit (includes 4bullets)1each 013-0359-xx 3)G3PO Bullet Removal Tool1each 003-1896-xx 4)Solder Kit:Solder Spool,Wire Spool1each 1each 020-2754-xx 5)Tape,Adhesive (Strip,10each)1each 1each 006-8237-xx 6)Marker Band Set (2each of 5colors)1each 1each 016-0633-xx 7)Socket Cable1each020-2954-xxP7506/P7504Accessory Box (See contents listing below 1through 6)1)Socket Cable1each 020-2954-xx 2)TriMode Micro-coax Tip4each 020-2955-xx 3)TriMode High-temperature Tip2each 020-2958-xx 4)Solder Kit:Solder Spool,Wire Spool 1each 020-2754-xx 5)Tape,Adhesive (Strip,10each)1each 006-8237-xx 6)Marker Band Set (2each of 5colors)1each016-0633-xx*1P7520A documentation is a printed instruction manual.7DatasheetContact Tektronix:ASEAN /Australasia (65)63563900Austria 0080022554835*Balkans,Israel,South Africa and other ISE Countries +41526753777Belgium 0080022554835*Brazil +55(11)37597627Canada 180********Central East Europe and the Baltics +41526753777Central Europe &Greece +41526753777Denmark +4580881401Finland +41526753777France 0080022554835*Germany 0080022554835*Hong Kong 4008205835India 0008006501835Italy 0080022554835*Japan 81(3)67143010Luxembourg +41526753777Mexico,Central/South America &Caribbean 52(55)56045090Middle East,Asia,and North Africa +41526753777The Netherlands 0080022554835*Norway 80016098People’s Republic of China 4008205835Poland +41526753777Portugal 800812370Republic of Korea 00180082552835Russia &CIS +7(495)7484900South Africa +41526753777Spain 0080022554835*Sweden 0080022554835*Switzerland 0080022554835*Taiwan 886(2)27229622United Kingdom &Ireland 0080022554835*USA 180*********European toll-free number.If not accessible,call:+41526753777Updated 10February 2011For Further Information.Tektronix maintains a comprehensive,constantly expanding collection of application notes,technical briefs and other resources to help engineers working on the cutting edge of technology.Please visit Copyright ©Tektronix,Inc.All rights reserved.Tektronix products are covered by U.S.and foreign patents,issued and rmation in this publication supersedes that in all previously published material.Speci ﬁcation and price change privileges reserved.TEKTRONIX and TEK are registered trademarks of Tektronix,Inc.All other trade names referenced are the service marks,trademarks,or registered trademarks of their respective companies.17Aug 201251W-20271-13Optional Tip AccessoriesDescriptionPart NumberTriMode Performance Solder TipP75PST P7500Series Precision Differential Probing ModuleP7500Precision Differential Probing Module Accessory Kit (See 1through 7below)P75PDPM 1)Tip Cable (1ps matched pair,1each)P75TC 2)Probing Module TipProbe Tips Replacement Kit 1Each (Right and left side)P75PMT 3)Accessory Kit;Ground Spring,Large 4Each 016-1998-xx 4)Accessory Kit;Ground Spring,Small 4Each 016-1999-xx 5)Handle,Adapter (Probing Module)367-0545-xx 6)G3PO Separator Tool 003-1897-xx 7)Ground Spring Tool 003-1900-xx TriMode Resistor Solder Tip020-2936-xx TriMode Extended-resistor Solder Tip 020-2944-xx Resistor Replacement Kit 020-2937-xx Solder Tip Ramps,25Each 020-3118-xx Socket Cable 020-2954-xx Socket Cable,XL020-2960-xx TriMode High-temperature Tip 020-2958-xx TriMode Micro-coax Tip 020-2955-xx Damped Wire Tip020-2959-xx Nexus Interposer DDR Solder Tip 020-3022-xx Deskew Fixture 067-1586-xx Probe PositionerPPM100Precision,3Position,Probe Positioner PPM203B 8200Series TekConnect ®Probe Interface 80A03(FW Version ≥2.3)RTSA Series TekConnect ®Probe InterfaceRTPA2A(FW Version ≥2.3)Tektronix is registered to ISO 9001and ISO 14001by SRI Quality SystemRegistrar.Product(s)complies with IEEE Standard 488.1-1987,RS-232-C,and with Tektronix Standard Codes and Formats.。

DISCUS L 产品说明书

DISCUS® LEPA Registration Number: 59807-181. IDENTIFICATION OF THE SU BSTANCE/MIXTU REAND OF THE COMPANY/UNDERTAKINGProduct identifierTrade name . . . . . . . . . . . . .: DI SCUS® LEPA Registration No. . . . . .: 59807-18Relevant identified uses of the substance or mixture and uses advised againstUse . . . . . . . . . . . . . . . . . . .: I nsecticideRestrictions on use . . . . . .: See product label forrestrictions .Company information . . . .: OHP, Inc .PO Box 746Bluffton, SC 29910-0746(800) 659-6745Emergency telephone numberTRANSPORTATION EMERGENCY(24 hours a day) call . . . .: Chemtrec: 1-800-424-9300MEDICAL EMERGENCY (24 hours a day) and ProductInformation call . . . . . . . .: 1-800-356-4647SDS Information orRequest . . . . . . . . . . . . . . . .: ohp .com2. HAZARDS IDENTIFICATIONClassification in accordance with regulationHCS 29CFR §1910.1200This material is not hazardous under the criteria ofthe Federal OSHA Hazard Communication Standard29CFR 1910 .1200 .Other hazards . . . . . . . . . . .: No particular hazards known .3. COMPOSITION/INFORMATION ON INGREDIENTSHazardousComponent Concentration Name CAS-No. % by weight Imidacloprid 138261-41-3 2.94Cyfluthrin 68359-37-5 0.7Glycerine 56-81-5 12.04. FIRST AID MEASURESDescription of first aid measuresGeneral advice . . . . . . . . . .: When possible, have the product container or label with you when calling apoison control center or doctor or going for treatment .Inhalation . . . . . . . . . . . . . .: Move to fresh air . I f person is not breathing, call 911 or an ambulance, then giveartificial respiration, preferably mouth-to-mouth ifpossible . Call a physician or poison control centerimmediately .Skin contact . . . . . . . . . . . .: Take off contaminated clothing and shoes immediately . Wash off immedi-ately with plenty of water for at least 15 minutes . Calla physician or poison control center immediately .Eye contact . . . . . . . . . . . . .: Hold eye open and rinse slowly and gently with water for 15-20 minutes .Remove contact lenses, if present, after the first 5minutes, then continue rinsing eye . Call a physicianor poison control center immediately .Ingestion . . . . . . . . . . . . . . .: Call a physician or poison control center immediately . Rinse out mouth and givewater in small sips to drink . DO NOT induce vomit-ing unless directed to do so by a physician or poisoncontrol center . Never give anything by mouth to anunconscious person . Do not leave victim unattended .Most important symptoms and effects, both acute anddelayedSymptoms . . . . . . . . . . . . .: To date no symptoms are known .Indication of any immediate medical attention andspecial treatment neededTreatment . . . . . . . . . . . . . .: Appropriate supportive and symptomatic treatment as indicated by the pa-tient’s condition is recommended . There is no spe-cific antidote .5. FIREFIGHTING MEASURESExtinguishing mediaSuitable . . . . . . . . . . . . . . . .: Use water spray, alcohol-resistant foam, dry chemical or carbon dioxide .Unsuitable . . . . . . . . . . . . .: High volume water jetSpecial hazards arising from thesubstance or mixture . . . .: Dangerous gases areevolved in the event of a fire .DISCUS® LEPA Registration Number: 59807-18Advice for firefightersSpecial protective equipment forfire-fighters . . . . . . . . . . . .: Firefighters should wearNIOSH approved self-contained breathing apparatusand full protective clothing .Further information . . . . . .: Keep out of smoke . Fight fire from upwind position . Cool closed containers ex-posed to fire with water spray . Do not allow run-offfrom fire fighting to enter drains or water courses .Flash point . . . . . . . . . . . . .: > 93 °CAutoignition temperature .: no data availableLower explosion limit . . . .: no data availableUpper explosion limit . . . .: no data availableExplosivity . . . . . . . . . . . . .: not applicable6. ACCIDENTAL RELEASE MEASURESPersonal precautions, protective equipment andemergency proceduresPrecautions . . . . . . . . . . . .: Remove all sources of ignition . I solate hazard area . Keep unauthorizedpeople away . Avoid contact with spilled product orcontaminated surfaces .Methods and materials for containment and cleaningupMethods for cleaning up . .: Soak up with inert absor-bent material (e .g . sand, silica gel, acid binder, uni-versal binder, sawdust) . Collect and transfer theproduct into a properly labelled and tightly closedcontainer . Clean contaminated floors and objectsthoroughly, observing environmental regulations .Additional advice . . . . . . . .: Use personal protective equipment . Do not allow to enter soil, waterways orwaste water canal .Reference toother sections . . . . . . . . .: Information regarding safehandling, see section 7 .I nformation regarding personal protective equip-ment, see section 8 .nformation regarding waste disposal, see section13 .7. HANDLING AND STORAGEPrecautions for safe handlingAdvice on safehandling . . . . . . . . . . . . . .: Use only in area providedwith appropriate exhaust ventilation . Handle andopen container in a manner as to prevent spillage .Hygiene measures . . . . . . . .: Wash hands thoroughly with soap and water after handling and before eat-ing, drinking, chewing gum, using tobacco, using thetoilet or applying cosmetics .Remove Personal Protective Equipment (PPE) im-mediately after handling this product . Before remov-ing gloves clean them with soap and water . Removesoiled clothing immediately and clean thoroughly be-fore using again . Wash thoroughly and put on cleanclothing .Conditions for safe storage, including any incompat-ibilitiesRequirements for storageareas and containers . . . .: Store in a cool, dry placeand in such a manner as to prevent cross contami-nation with other crop protection products, fertilizers,food, and feed . Store in original container and out ofthe reach of children, preferably in a locked storagearea .8. EXPOSURE CONTROLS / PERSONALPROTECTIONControl parameters continuedComponents CAS-No.Controlparameters Update Basis Imidacloprid138261-41-350ug/m3(ST ESL)07 2011TX ESLImidacloprid138261-41-35ug/m3(AN ESL)07 2011TX ESLImidacloprid138261-41-30.7 mg/m3(TWA)OES BCS*Cyfluthrin(Particulate.)68359-37-55ug/m3(AN ESL)02 2013TX ESLCyfluthrin(Particulate.)68359-37-550ug/m3(ST ESL)02 2013TX ESLCyfluthrin68359-37-50.01 mg/m3(TWA)OES BCS*Glycerine(Respirable fraction.)56-81-5 5 mg/m3(PEL)02 2006OSHA Z1Glycerine(Total dust.)56-81-515 mg/m3(PEL)02 2006OSHA Z1Glycerine(Total dust.)56-81-510 mg/m3(TWA)1989OSHA Z1AGlycerine(Respirable fraction.)56-81-5 5 mg/m3(TWA)1989OSHA Z1AGlycerine(Total dust and mist.)56-81-510 mg/m3(TWA)06 2008TN OELDISCUS® LEPA Registration Number: 59807-18 Control parameters continuedComponents CAS-No.Controlparameters Update BasisGlycerine (Respirable fraction and dust or fume.)56-81-5 5 mg/m3(TWA)06 2008TN OELGlycerine (Vapor.)56-81-51000ug/m3(ST ESL)02 2013TX ESLGlycerine (Particulate.)56-81-550ug/m3(ST ESL)02 2013TX ESLGlycerine (Vapor.)56-81-5100ug/m3(AN ESL)02 2013TX ESLGlycerine (Particulate.)56-81-55ug/m3(AN ESL)02 2013TX ESL* OES BCS: Internal Bayer CropScience “Occupational Exposure Standard”Exposure controlsPersonal protectiveequipment . . . . . . . . . . . . .: In normal use and han-dling conditions please refer to the label and/or leaf-let . In all other cases the following recommendationswould apply .Respiratory protection . . .: When respirators arerequired, select NIOSH approved equipment basedon actual or potential airborne concentrations andin accordance with the appropriate regulatory stan-dards and/or industry recommendations .Hand protection . . . . . . . . .: Chemical resistant nitrilerubber glovesEye protection . . . . . . . . . .: Safety glasses withside-shieldsSkin and bodyprotection . . . . . . . . . . . . .: Wear long-sleeved shirtand long pants and shoes plus socks .General protectivemeasures . . . . . . . . . . . . .: Follow manufacturer’sinstructions for cleaning/maintaining PPE . If no suchinstructions for washables, use detergent and warm/tepid water .Keep and wash PPE separately from other laundry .9. PHYSICAL AND CHEMICAL PROPERTIESAppearance . . . . . . . . . . . . .: tanPhysical State . . . . . . . . . . .: liquidOdor . . . . . . . . . . . . . . . . . . .: weakOdour Threshold . . . . . . . . .: no data availablepH . . . . . . . . . . . . . . . . . . . . .: no data availableVapor Pressure . . . . . . . . . .: no data availableVapor Density (Air = 1) . . . .: no data availableDensity . . . . . . . . . . . . . . . . .: ca . 1 .05 g/cm³ at 20 °CEvapouration rate . . . . . . . .: no data availableBoiling Point . . . . . . . . . . . .: no data availableMelting / Freezing Point . . .: no data availableWater solubility . . . . . . . . . .: dispersibleMinimum Ignition Energy . .: not applicableDecompositiontemperature . . . . . . . . . . . .: not applicablePartition coefficient:n-octanol/water . . . . . . . . .: no data availableViscosity . . . . . . . . . . . . . . . .: 350 - 600 mPa .s at 20 °CVelocity gradient 0 .5 /s Flash point . . . . . . . . . . . . . .: > 93 °CAutoignition temperature . .: no data availableLower explosion limit . . . . .: no data availableUpper explosion limit . . . . .: no data availableExplosivity . . . . . . . . . . . . . .: not applicable10. STABILITY AND REACTIVITYReactivityThermal decomposition . .: not applicableChemical stability . . . . . . .: Stable under normal conditions .Possibility of hazardousreactions . . . . . . . . . . . . . .: No dangerous reactionknown under conditions of normal use .Conditions to avoid . . . . . .: no data availableIncompatible materials . . .: Strong oxidizing agents, BasesHazardous decompositionproducts . . . . . . . . . . . . . .: No decompositionproducts expected under normal conditions of use .DISCUS® LEPA Registration Number: 59807-1811. TOXICOLOGICAL INFORMATIONExposure routes . . . . . . . . .: Eye contact, Skin Absorp-tion, Inhalation, Ingestion Immediate EffectsEye . . . . . . . . . . . . . . . . . . .: Moderate eye irritation .Skin . . . . . . . . . . . . . . . . . . .: Harmful if absorbedthrough skin .Ingestion . . . . . . . . . . . . . . .: Harmful if swallowed .Inhalation . . . . . . . . . . . . . .: Harmful if inhaled .Information on toxicological effectsAcute oral toxicity . . . . . . .: LD50 (male rat)> 5,000 mg/kgLD50 (female rat)> 5,100 mg/kgAcute inhalation toxicity . .: LC50 (male/femalecombined rat) > 2 .23 mg/lExposure time: 4 hDetermined in the form of liquid aerosol .(actual)LC50 (male/femalecombined rat) > 8 .92 mg/lExposure time: 1 hDetermined in the form of liquid aerosol .Extrapolated from the 4 hr LC50 .(actual)Acute dermal toxicity . . . .: LD50 (male/femalecombined rat)> 5,030 mg/kgSkin irritation . . . . . . . . . . .: No skin irritation (rabbit)Eye irritation . . . . . . . . . . . .: Mild eye irritation . (rabbit)Sensitisation . . . . . . . . . . .: Non-sensitizing .(guinea pig)Assessment repeated dose toxicityImidacloprid did not cause specific target organ tox-icity in experimental animal studies .The toxic effects of Cyfluthrin are related to transienthyperactivity typical for pyrethroid neurotoxicity .Assessment mutagenicityImidacloprid was not mutagenic or genotoxic basedon the overall weight of evidence in a battery of invitro and in vivo tests .Cyfluthrin was not mutagenic or genotoxic in a bat-tery of in vitro and in vivo tests .Assessment carcinogenicityImidacloprid was not carcinogenic in lifetime feedingstudies in rats and mice .Cyfluthrin was not carcinogenic in lifetime feedingstudies in rats and mice .ACGIH . . . . . . . . . . . . . . . . . .: None .NTP . . . . . . . . . . . . . . . . . . . .: None .IARC . . . . . . . . . . . . . . . . . . .: None .OSHA . . . . . . . . . . . . . . . . . .: None .Assessment toxicity to reproductionI midacloprid caused reproduction toxicity in a two-generation study in rats only at dose levels also toxicto the parent animals . The reproduction toxicity seenwith Imidacloprid is related to parental toxicity .Cyfluthrin caused reproduction toxicity in a two-gen-eration study in rats only at dose levels also toxic tothe parent animals . The reproduction toxicity seenwith Cyfluthrin is related to parental toxicity .Assessment developmental toxicityI midacloprid caused developmental toxicity only atdose levels toxic to the dams . The developmental ef-fects seen with Imidacloprid are related to maternaltoxicity .Cyfluthrin caused developmental toxicity only at doselevels toxic to the dams . The developmental effectsseen with Cyfluthrin are related to maternal toxicity .Further informationAcute toxicity studies have been bridged from a simi-lar formulation(s) .The non-acute information pertains to the activeingredient(s) .12. ECOLOGICAL INFORMATIONToxicity to fish . . . . . . . . . . .: LC50 (Oncorhynchusmykiss (rainbow trout))0 .00047 mg/lExposure time: 96 hThe value mentioned relates to the active ingredientcyfluthrin .LC50 (Oncorhynchusmykiss (rainbow trout))211 mg/lExposure time: 96 hThe value mentioned relates to the active ingredientimidacloprid .Toxicity to aquaticinvertebrates . . . . . . . . . . .: EC50 (Daphnia magna(Water flea)) 0 .00016 mg/lExposure time: 48 hThe value mentioned relates to the active ingredientcyfluthrin .EC50 (Daphnia magna(Water flea)) 85 mg/lExposure time: 48 hThe value mentioned relates to the active ingredientimidacloprid .DISCUS® LEPA Registration Number: 59807-18LC50 (Chironomusriparius (non-bitingmidge)) 0 .0552 mg/lExposure time: 24 h The value mentioned relates to the active ingredient imidacloprid .Toxicity to aquatic plants . .: IC50 (Desmodesmussubspicatus) > 10 mg/lGrowth rate;Exposure time: 72 h The value mentioned relates to the active ingredient cyfluthrin .EC50 (Desmodesmussubspicatus) > 10 mg/lGrowth rate;Exposure time: 72 h The value mentioned relates to the active ingredient imidacloprid .Biodegradability . . . . . . . . .: Cyfluthrin: not rapidly biodegradableImidacloprid: not rapidly biodegradableKoc . . . . . . . . . . . . . . . . . . . .: Cyfluthrin: Koc: 64300Imidacloprid: Koc: 225 Bioaccumulation . . . . . . . . .: Cyfluthrin:Bioconcentration factor(BCF) 506; Does not bioaccumulate .I midacloprid:Does not bioaccumulate . Mobility in soil . . . . . . . . . . .: Cyfluthrin: Immobile in soilI midacloprid:Moderately mobile in soils Environmentalprecautions . . . . . . . . . . . .: Do not apply directly to water, to areas where surface water is present or to intertidal areas below the mean high water mark .Do not contaminate surface or ground water by cleaning equipment or disposal of wastes, including equipment wash water .Do not apply when weather conditions favor runoff or drift .Drift and runoff from treated areas may be hazardous to aquatic organisms in adjacent sites .Do not apply this product or allow it to drift to bloom-ing crops or weeds if bees are visiting the treatment area .Apply this product as specified on the label .13. DISPOSAL CONSIDERATIONSWaste treatment methodsProduct . . . . . . . . . . . . . . . .: Pesticide, spray mixture or rinse water that cannot be used according to labelinstructions may be disposed of on site or at an ap-proved waste disposal facility .Contaminated packaging . .: Do not re-use emptycontainers .Triple rinse containers .Rinsed packaging may be acceptable for landfill,otherwise incineration will be required in accordancewith local regulations .If burned, stay out of smoke .RCRA Information . . . . . . . .: Characterization andproper disposal of this material as a special or haz-ardous waste is dependent upon Federal, State andlocal laws and are the user’s responsibility . RCRAclassification may apply .14. TRANSPORT INFORMATION49CFR . . . . . . . . . . . . . . . . . .: Not dangerous goods /not hazardous material IMDGUN number . . . . . . . . . . . . .: 3082Class . . . . . . . . . . . . . . . . . .: 9Packaging group . . . . . . . .: I I IMarine pollutant . . . . . . . . .: YESProper shipping name . . . .: ENVI RONMENTALLYHAZARDOUS SUBSTANCE, LIQUID, N .O .S .(CYFLUTHRIN, IMIDACLOPRID SOLUTION) IATAUN number . . . . . . . . . . . . .: 3082Class . . . . . . . . . . . . . . . . . .: 9Packaging group . . . . . . . .: I I IEnvironm.Hazardous Mark . . . . . . . .: YESProper shipping name . . . .: ENVI RONMENTALLYHAZARDOUS SUBSTANCE, LIQUID, N .O .S .(CYFLUTHRIN, IMIDACLOPRID SOLUTION )This transportation information is not intended toconvey all specific regulatory information relating tothis product . I t does not address regulatory varia-tions due to package size or special transportationrequirements .Freight Classification . . . . .: INSECTICIDES ORFUNGICIDES, N .O .I ., OTHER THAN POISONDISCUS® LEPA Registration Number: 59807-1815. REGULATORY INFORMATIONEPA Registration No. . . . . .: 59807-18US Federal RegulationsTSCA listGlycerine 56-81-5US. Toxic Substances Control Act (TSCA) Section12(b) Export Notification (40 CFR 707, Subpt D)None.SARA Title III - Section 302 - Notification and Informa-tionNone.SARA Title III - Section 313 - Toxic Chemical ReleaseReportingCyfluthrin 68359-37-5 25,000 lbs US States Regulatory ReportingCA Prop65This product does not contain any substances knownto the State of California to cause cancer .This product does not contain any substances knownto the State of California to cause reproductive harm .US State Right-To-Know IngredientsCyfluthrin 68359-37-5 NJ, RIGlycerine 56-81-5 MNCanadian RegulationsCanadian Domestic Substance ListGlycerine 56-81-5EnvironmentalCERCLANone.Clean Water Section 307 Priority PollutantsNone.Safe Drinking Water Act Maximum Contaminant Lev-elsNone.International RegulationsEuropean Inventory of Existing Commercial Sub-stances (EINECS)Glycerine 56-81-5OHP982420 03/17 (03/12/15)EPA/FIFRA InformationThis chemical is a pesticide product registered bythe Environmental Protection Agency and is subjectto certain labeling requirements under federal pes-ticide law . These requirements differ from the clas-sification criteria and hazard information requiredfor safety data sheets, and for workplace labels ofnon-pesticide chemicals . Following is the hazard in-formation required on the pesticide label:Signal word . . . . . . . . . . . .: Caution!Hazard statements . . . . . . .: Moderate eye irritation .Harmful if swallowed, inhaled or absorbed throughthe skin .Avoid contact with skin, eyes and clothing .Avoid inhalation of vapour or mist .Wash thoroughly with soap and water after handling .Remove and wash contaminated clothing before re-use .16. OTHER INFORMATIONNFPA 704 (National Fire Protection Association):Health - 1 Flammability - 1 Instability - 0 Others - noneHMIS (Hazardous Materials Identification System, based on the Third Edition Ratings Guide)Health - 1 Flammability - 1 Physical Hazard - 0 PPE -0 = minimal hazard, 1 = slight hazard, 2 = moderate haz-ard, 3 = severe hazard, 4 = extreme hazardReason for Revision . . . . . .: Revised according to the current OSHA Hazard Communication Standard(29CFR1910 .1200)Revision Date . . . . . . . . . . . .: 03/29/2017This information is provided in good faith but without express or implied warranty . The customer assumes all responsibility for safety and use not in accordance with label instructions .Discus is a registered trademark of OHP, Inc .。

DD12.8111.111;DD12.8121.111;DD12.2111.111;DD12.1111.111;DD12.4111.111;中文规格书,Datasheet资料

References Alternative: version without line filter DD11 Alternative: version for snap-in mounting KMF
Weblinks pdf, html, General Product Information, Approvals, RoHS, CHINA-RoHS, Mating Connectors, e-Shop, SCHURTER-Stock-Check, DistributorStock-Check, Accessories, Wire Harness
10
Standard Version
1
Standard Version
1-pole 2-pole
2
Standard Version
4
Standard Version
6
Standard Version
2-pole 2-pole 2-pole
8
Standard Version
10
Standard Version
Rated Current Filter-Type [A]
Fuseholder
1
Standard Version
2
Standard Version
4
Standard Version
6
Standard Version
8
Standard Version
1-pole 1-pole 1-pole 1-pole 1-pole
C14
70° C
Description - Panel Mount:
Screw-on from front side - 4 Functions:

全自动生化分析仪贝克曼AU680仪器报警列表中文报警翻译

R2试剂瓶空了
3519
Reagent Refrigerator Cover Open
试剂冰箱盖打开
3521
STAT Table Large Cover Open
急诊仓大盖子打开
3522
STAT Table Small Cover Open
急诊仓小盖子打开
3524
ISE Cover Open
电解质盖子打开
探针清洗液少了
3215
Probe Detergent Empty
探针清洗液空了
3216
ReagentProbeW2DetergentShort
试剂针W2清洗液少了
3217
R2 Reagent Short
R2试剂少了
3218
R2 Reagent Run Out
R2试剂耗尽
3219
R2 Reagent Empty
试剂条码错误
3500
DI Water Empty
去离子水桶空了
3501
Detergent (Concentrated) Empty
浓缩清洗液桶空了
3502
Detergent Empty
清洗液空了
3503
Sample Probe (FA) Error (Up-Down)
样本针上下错误
3504
Reagent Probe (FD) Error (Up-Down)
多点定标吸光度斜率检查错误
5313
1/2 POINT-CAL. CORRECTION FACTOR ERROR
一点/两点校准因数错误
5314
QC DATA RANGE OVER
质控数据范围超上限
5315

基因毒性小册子

基因毒性⼩册⼦基因毒性⼩册⼦Contents吗多明中吗啉的测定 (2)噻托溴铵中杂质离⼦的测定 (3)左⼄拉西坦中四丁基铵的测定 (4)盐酸法舒地尔中⾼哌嗪的含量测定 (5)苯甲酸阿格列汀中3-氨基哌啶的测定 (6)盐酸⽶诺环素中三⼄胺的测定 (7)坎地沙坦酯中羟胺的测定 (8)头孢曲松中甲基肼的测定 (9)重组⼈胰岛素中微量⼄醇胺的测定 (10)⽶氮平中⼆⼄基⼄醇胺的分析 (11)利培酮中羟胺、2-羟⼄基肼、肼的分析 (12)维格列汀中⾦刚烷胺的分析 (13)雷沙吉兰中羟胺的分析 (14)盐酸帕洛诺司琼中的（S）-（-）-3-氨基奎宁环胺双盐酸盐的分析 (15)考来维仑中有机胺类有关物质的分析 (16)安乃近中⼆甲氨基⼄醇的分析 (17)替加环素中叔丁胺的测定 (18)多肽中三氟⼄酸的测定 (19)疫苗中氰根的测定 (20)药物中叠氮根的测定 (21)药品中甲磺酸和三氟甲磺酸的测定 (22)吗多明中吗啉的测定1．简介吗多明是临床常⽤的预防⼼绞痛药物。

作为⼀种钙拮抗剂，吗多明可扩张⾎管平滑肌，减轻⼼脏⼯作负荷，减少⼼肌氧耗，且能扩张冠状动脉，促进侧枝循环，改善缺⾎⼼肌缺⾎。

在吗多明⽣产的起始原料中⽤到了吗啉。

吗啉是⼯业⽤重要环胺之⼀，由于其具有氮氧杂环的结构特点，在医药⽅⾯被⼴泛⽤于⽣产病毒灵、布洛芬、咳必定等多种药物的合成。

吗啉对黏膜、上呼吸道、眼睛、⽪肤等有强烈的刺激性，对⼈体有较⼤伤害，必须严格控其制成药中的残留量。

⽬前测定吗啉最常见的⽅法为⽓相⾊谱法，但由于吗啉极性较⼤，使⽤⽓相⾊谱法存在担体处理、⾊谱柱寿命等问题，且其灵敏度较低，⽆法满⾜质控要求。

吗啉的结构中含有伯胺，酸性条件下在阳离⼦交换⾊谱柱上保留良好，且在电导检测器上有⾮常灵敏的响应。

离⼦⾊谱电导法⽤于吗多明中吗啉的残留监测，结果准确可靠。

2. 实验部分Thermo Fisher Dionex ICS 5000+，AS-AP⾃动进样器；甲基磺酸（Fisher，99%），ThermoScientific Barnstead GenPure Pro超纯⽔；⾊谱柱：；IonPac CS16（5×250mm）保护柱：Ionpac? CG16（5×50 mm）；检测器：抑制电导检测；⾊谱图：图1 吗多明中吗啉的测定⾊谱图1-吗啉噻托溴铵中杂质离⼦的测定1．简介噻托溴铵由德国柏林格殷格翰公司研发，与辉瑞公司共同销售，2002年6⽉在荷兰和菲律宾⾸次上市。

无内毒素质粒小量提取试剂盒使用说明

9、向吸附柱中加入 700ul 漂洗液 (使用前请先检查是否已加入无水乙醇 )， 12000rpm 离心 1min，弃废液，将吸附柱放入收集管中。
10、向吸附柱中加入 500ul 漂洗液， 12000rpm 离心 1min，弃废液，将吸附柱放入收集管中。
3、向离心管中加入 200ul 溶液 P2，温和地上下翻转 6-8 次使菌体充分裂解。注意：混匀一定要温和，以免污染细菌基因组 DNA，此时菌液应变得清亮粘稠，作用时间不要超过 5 min，以免质粒受到破坏。
2. 洗脱缓冲液体积不应少于 50ul，体积过小影响回收效率；洗脱液的

pH 值对洗脱效率也有影晌，若需要用水做洗脱液应保证其 pH 值在 8.0 左右 (可用 NaOH 将水的 pH 值调至此范围 )， pH 值低于 7. 0 会降低洗脱效率。
由于质粒dna本身的性质清除过程可导致部分质粒dna丢失但内毒素却能得到最大限度清所有溶液应用无内毒素的高纯水配制所有器械材料均应不含内毒素玻璃器皿可高温烘烤非挥发性水溶液可高压处理

无内毒素质粒小量提取试剂盒使用说明货号： D1140 规格： 50T/100T 保存：常温干燥保存，复检期为一年。试剂盒内容：

有机化合物。内毒素清除剂可最大限度地除去内毒素。从 1-5ml 大肠杆菌 LB 培养液中，可快速提取 5-15μ g 高纯度质粒 DNA，提取率达 85-90%。使用本试剂盒提取的质粒 DNA 纯度高，可直接用于细胞转染等要求较高的实验，以及其他各种常规操作，包括酶切、 PCR、测序、连接和转化等试验。

Modicon Quantum 32 O 型号 140DDO35300 产品数据表说明书

D i s c l a im er : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n sProduct data sheetCharacteristics140DDO35300discrete output module Modicon Quantum - 32 O solid stateMainRange of productModicon Quantum automation platform Product or component type Dc discrete output module Discrete output number32ComplementaryGroup of channels 4 groups of 8Discrete output logic Positive logic (source)Addressing requirement 2 output words Discrete output voltage 24 V DC Output voltage limits 19.2...30 VAbsolute maximum output 56 V for 1.3 s decaying pulse Voltage drop0.4 V 0.5 A Maximum load current16 A per module 16 A per module 4 A per group 4 A per group Surge current <= 5 A for 0.0005 s Response time <= 1 ms at state 0 to state 1<= 1 ms at state 1 to state 0Leakage current 0.4 mA 30 VLoad inductance Inductance(H) = 0.5/((current(A))² x (switching frequency(Hz))) 50 Hz Fault indication Blown fuseLoss of field power Associated fuse rating3 A each point 3 A each point 5 A per group 5 A per groupIsolation between channels and bus 1780 Vrms DC for 1 minute Isolation between group 500 Vrms DC for 1 minuteProtection typeInternal output protection by 5 A fuse per groupPower dissipation 1.75 W + (0.4 V x total module load current)Marking CELocal signalling1 LED green bus communication is present (Active)1 LED red external fault detected (F)32 LEDs green input status Bus current requirement 330 mA 330 mA Module format Standard Product weight0.45 kgEnvironmentProduct certificationsABS BV C-Tick DNVFM Class 1 Division 2GL GOST RINA RMRSSafety certification non interfering StandardsCSA C22.2 No 142UL 508Resistance to electrostatic discharge 4 kV contact conforming to IEC 801-28 kV on air conforming to IEC 801-2Resistance to electromagnetic fields 10 V/m 80...2000 MHz conforming to IEC 801-3Ambient air temperature for operation 0...60 °C Ambient air temperature for storage -40...85 °CRelative humidity 95 % without condensation Operating altitude<= 5000 mOffer SustainabilitySustainable offer status Green Premium productRoHS (date code: YYWW)Compliant - since 0848 - Schneider Electric declaration of conformity Schneider Electric declaration of conformity REAChReference not containing SVHC above the threshold Reference not containing SVHC above the threshold Product environmental profileAvailableProduct environmental Product end of life instructionsAvailableEnd of life manualContractual warrantyWarranty period18 monthsDimensions DrawingsRacks for Modules MountingDimensions of Modules and Racks(1) 2 slots (2) 3 slots (3) 4 slots (4) 6 slots (5)10 slots (6)16 slotsConnections and Schema24 Vdc Discrete Output Source Module Wiring Diagram。

赛米控丹佛斯电子 Board_93_GB_SKYPER_42_R 数据表

®Adaptor boardIGBT Driver CoreBoard 93 GB SKYPER 42 R Preliminary Data Features•Two output channels •Gold nickel finish •Failure managementTypical Applications*•Adaptor board for SKYPER 42 IGBT drivers in bridge circuits for industrial applications •PCB with gold plating •DC bus up to 1200VFootnotesIsolation test voltage with external high voltage diodeThe isolation test is not performed as a series test at SEMIKRONThe driver power can be expanded to 50µC with external boost capacitorsIsolation coordination in compliance with EN50178 PD2Operating temperature is real ambient temperature around the driver core Degree of protection: IP00This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.Absolute Maximum Ratings SymbolConditionsValuesUnitV s Supply voltage primary 16V Iout PEAK Output peak current 30A Iout AVmax Output average current 150mA f max Max. switching frequency100kHz V CECollector emitter voltage sense across the IGBT1700V V isol IO Isolation test voltage input - output (AC, rms, 2s)4000V V isolPD Partial discharge extinction voltage, rms, Q PD ≤ 10pC1500V V isol12Isolation test voltage output 1 - output 2 (AC, rms, 2s)1500V R Gon min Minimum rating for external R Gon 0.8ΩR Goff min Minimum rating for external R Goff 0.8ΩT op Operating temperature -40...85°C T stgStorage temperature-40 (85)°CCharacteristics SymbolConditionsmin.typ.max.UnitV s Supply voltage primary side 14.41515.6V V i Input signal voltage on / off 15 / 0V V IT+Input treshold voltage HIGH 12.3V V IT-Input threshold voltage (LOW) 4.6V V G(on)Turn on output voltage 15V V G(off)Turn off output voltage-8V t d(on)IO Input-output turn-on propagation time 1.1µs t d(off)IOInput-output turn-on propagation time1.1µsAdaptor Board 93 SKYPER® 42 RTechnical ExplanationsRevision 04------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ This Technical Explanation is valid for the following parts:Related documents:Prepared by: Johannes Krapp------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ ContentApplication and Handling Instructions (2)Further application support (2)General Description (2)Dimensions (3)PIN Array (3)Setting Dynamic Short Circuit Protection (4)Collector Series Resistance (4)Adaptation Gate Resistors (5)Boost Capacitors (6)Environmental conditions (6)Mounting Notes (6)Please note:All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by user’s technical experts for each application.Application and Handling Instructions▪Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.▪Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module.▪When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage.▪It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.▪The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V S +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.▪The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the driver leads should be twisted.Further application supportLatest information is available at . For design support please read the SEMIKRON Application Manual Power Modules available at .General DescriptionThe Board 93 GB SKYPER® 42 is an adaptor board for the IGBT module SKiM® 93 (spring contact). The board is paralleling three channels so the SKiM module can be used in half bridge configuration. The board can be customized allowing adaptation and optimization to the used IGBT module.The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed by variation of R Gon and R Goff. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see Technical Explanations SKYPER® 42 R).Please note:This technical explanation is based on the Technical Explanations for SKYPER®42 R. Please read the Technical Explanations SKYPER® 42 R before using the Adaptor Board.Dimensions116 PIN ArraySetting Dynamic Short Circuit ProtectionThe Vce formula for the Vce monitoring is described in the technical explanation of SKYPER 42 R. Collector Series ResistanceDesignation Shape SettingR105 MiniMELF (SMD) R VCE*Factory setting: not equippedTOPR205 MiniMELF (SMD) R VCE *Factory setting: not equippedBOTAdaptation Gate ResistorsBoost CapacitorsEnvironmental conditionsPlease refer to the technical explanation of SKYPER 42 R for the environmental conditions.Mounting NotesDISCLAIMERSEMIKRON reserves the right to make changes withoutfurnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume any liability arising out of the application or use of any product or circuit described herein. Furthermore,。

紫外分光光度法快速测定二哌嗪-1-鎓硫酸盐

医药化工化工设计通讯Pharmaceutical and ChemicalChemical Engineering Design Communications·206·第46卷第7期2020年7月二哌嗪-1-鎓硫酸盐是哌嗪的一种衍生物，是重要的医药中间体和精细化工原料。

二哌嗪-1-鎓硫酸盐中含有哌嗪环，在医药研究方面，这类氮杂环会被经常使用，其主要应用于驱肠虫药磷酸哌嗪、枸橼酸哌嗪等的生产，在医药、环保、化工和材料等诸多领域都有广泛的应用。

紫外分光光度法是一种简便的仪器分析方法，可用于定性和定量分析。

关于紫外吸收光谱的定量方法，常见的有以下几种：绝对法、标准对照法、吸收系数法、标准曲线法、最小二乘法等。

哌嗪的测定方法，常见的有气相色谱法[2]、紫外分光光度法。

二哌嗪-1-鎓硫酸盐作为一种新型的哌嗪衍生物，在医药、化工领域有着重要作用。

本文通过紫外分光光度法，结合最小二乘法面积拟合处理数据，快速测定溶液中的二哌嗪-1-鎓硫酸盐浓度。

1 实验部分1.1 仪器与试剂Sartorius 电子天平，上海析达水浴锅，UV-2550紫外-可见分光光度计；所用试剂均为分析纯，所用水均为二次蒸馏水；二哌嗪-1-鎓硫酸盐溶液，由黄石法姆药业股份有限公司提供。

1.2 紫外吸收光谱以二次蒸馏水作为参比溶液，分别对0.001mol/L 、0.002mol/L 、0.004mol/L 、0.006mol/L 、0.008mol/L 、0.01mol/L 、0.012mol/L 、0.02mol/L 、0.05mol/L 的二哌嗪-1-鎓硫酸盐水溶液进行紫外光谱扫描，扫描波段为190~450nm ，步长0.5nm ，扫描结果如图1所示。

0.05mol/L 0.02mol/L 0.01mol/L 0.012mol/L 0.008mol/L 0.006mol/L 0.004mol/L 0.002mol/L 0.001mol/L200220240260280300320波长/nm图1 二哌嗪-1-鎓硫酸盐紫外吸收光谱测定上述系列样品的pH ，结果见表1。

不同等级茉莉花茶香气成分比较分析

不同等级茉莉花茶香气成分比较分析陈军海1,2,刘盼盼3,邓亮1,2,汪瑶1,2,王梦佳1,郑鹏程3,周宏福4,韩艳娜1∗㊀(1.湖北省茶业集团股份有限公司,湖北武汉430014;2.湖北省赵李桥茶厂有限责任公司,湖北赤壁437318;3.湖北省农业科学院果树茶叶研究所,湖北武汉430064;4.湖北科技学院,湖北咸宁437100)摘要㊀采用感官审评法和顶空固相微萃取法,并结合气相色谱-质谱联用技术,对6个不同等级茉莉花茶样品挥发性成分进行分析鉴定㊂结果表明:不同等级茉莉花茶共检出52种香气化合物,包括酯类㊁醇类㊁烯类㊁醛类㊁酮类㊁酚类和其他化合物;酯类和醇类是关键呈香化合物,乙酸苯甲酯㊁芳樟醇㊁顺-3-己烯-苯甲酸酯㊁邻氨基苯甲酸甲酯㊁水杨酸甲酯和苯甲酸甲酯是主要的呈香成分;顺-3-己烯-苯甲酸酯㊁吲哚㊁T -杜松醇㊁丁香酚㊁α-法尼烯等16个香气组分与茉莉花茶香气品质呈极显著正相关(P <0.01,r ȡ0.83);进一步研究发现利用XFJTF 指数可以较准确地区分不同等级茉莉花茶香气品质的优劣㊂关键词㊀茉莉花茶;茶叶等级;香气成分;顶空固相微萃取;相关性分析中图分类号㊀TS 272㊀㊀文献标识码㊀A㊀㊀文章编号㊀0517-6611(2023)23-0168-05doi :10.3969/j.issn.0517-6611.2023.23.039㊀㊀㊀㊀㊀开放科学(资源服务)标识码(OSID):Comparative Analysis of Aroma Components of Jasmine Tea in Different GradesCHEN Jun-hai 1,2,LIU Pan-pan 3,DENG Liang 1,2et al㊀(1.Hubei Tea Group Co.,Ltd.,Wuhan,Hubei 430014;2.Hubei Province Zhaoliqiao Tea Factory Co.,Ltd.,Chibi,Hubei 437318;3.Institute of Fruit and Tea,Hubei Academy of Agricultural Sciences,Wuhan,Hu-bei 430064)Abstract ㊀The volatile components of six different grades of jasmine tea samples were analyzed and identified using sensory evaluation method and headspace solid-phase microextraction method,combined with gas chromatography-mass spectrometry technology(HS-SPME /GC-MS).The results showed that total 52aroma constituents were identified and the dominant ones being esters,alcohols,alkenes,aldehydes,ketones,phenols and other compounds.Esters and alcohols were key aroma compounds,among which benzyl acetate,linalool,(Z)-3-hexene-benzo-ate,methyl anthranilate,methyl salicylate and methyl benzoate were the dominant aroma substances.Sixteen aroma components,including (Z)-3-hexene-benzoate,indole,T-juninol,eugenol and α-farnesene,were significantly positively correlated with the aroma quality of jasmine tea.Further research found that the use of XFJTF index could more accurately distinguish the pros and cons of aroma quality of different grades of jasmine tea.Key words ㊀Jasmine tea;Tea grade;Aroma components;Headspace-solid phase microextraction;Correlation analysis基金项目㊀国家重点研发计划子课题(2021YFD1601103)㊂作者简介㊀陈军海(1976 ),男,湖北赤壁人,工程师,从事茶叶加工研究㊂∗通信作者,工程师,硕士,从事茶叶加工及品质调控研究㊂收稿日期㊀2022-12-07;修回日期㊀2023-01-11㊀㊀茉莉花茶属于再加工茶类,主产区为广西㊁福建㊁云南㊁四川等地,因其香气馥郁芬芳㊁滋味醇厚而深受消费者喜爱㊂茉莉花茶传统的窨制工艺包括茶坯处理㊁鲜花处理㊁茶花拌和㊁静置窨花㊁通花散热㊁收堆续窨㊁起花㊁复火干燥等[1]㊂依据GB /T 22292 2017‘茉莉花茶“,烘青茉莉花茶分为6个等级,花香的吸附强度和持久性是茉莉花茶分级的关键因素[2]㊂众多学者对茉莉花茶香气成分及其在窨制过程中的变化规律展开了研究㊂An 等[3]研究认为茉莉花茶的关键香气成分是苯甲醇㊁芳樟醇㊁(Z)-3-乙酸己烯酯㊁苯甲酸甲酯㊁乙酸苄酯㊁吲哚和α-法尼烯,并且得出最佳窨制参数为65%~78%的花量㊁15~17h㊁35~40ħ㊂Zhang 等[4]研究发现茉莉花和茉莉花茶中的萜烯㊁酯㊁醇㊁含氮化合物和碳氢化合物含量在窨制过程中先升后降㊂Lin 等[5]提出了茉莉花茶风味指数[(Z)-3-苯甲酸己烯酯㊁α-法尼烯㊁邻氨基苯甲酸甲酯与芳樟醇的峰面积百分比之比],作为茉莉花茶香气质量评价指标㊂但是,该风味指数的准确率仍需要更多的研究去验证并修改完善㊂该研究以不同等级的茉莉花茶为材料,采用顶空固相微萃取(HS -SPME)和气相色谱-质谱联用(GC -MS)检测分析茉莉花茶香气成分组成,通过相关性分析法明确特征成分,并进一步验证茉莉花香气指数的准确性,旨在探究茉莉花茶特征香气成分,更深入地了解不同级别茉莉花茶的关键香气成分,为茉莉花茶窨制工艺优化及品质评价提供理论依据㊂1㊀材料与方法1.1㊀试验材料㊀6个不同等级的茉莉花茶(JT01~JT06),不同级别茶坯以不同数量的鲜花和窨制次数加工而成,湖北省茶业集团股份有限公司提供㊂手动SPME 进样器㊁50/30μm DVB /CAR /PDMS 固相微萃取头,美国Supeclo 公司;7890A 型气相色谱仪㊁5975C 型质谱仪,美国Agilent 公司;HHS 型恒温水浴锅,上海博迅实业有限公司医疗设备厂;Milli -RO PLUS 30型纯水机,法国Millipore 公司;癸酸乙酯㊁C 6~C 20正构烷烃混标,美国Sigma -Aldrich 公司㊂1.2㊀试验方法1.2.1㊀感官审评方法㊂根据GB /T 23776 2018‘茶叶感官审评方法“中的花茶审评法,由3名专业人员对样品的外形㊁汤色㊁香气㊁滋味进行感官审评㊂1.2.2㊀HS -SPME 萃取法㊂准确称取5.0g 茶样放入萃取瓶中,加入50mL 沸水㊁20μL 内标(8.64mg /L 癸酸乙酯),然后将装有50/30μm DVB /CAR /PDM 萃取头(试验前须在250ħ老化15min)的SPME 手持器通过瓶盖的橡皮垫插入㊀㊀㊀安徽农业科学,J.Anhui Agric.Sci.2023,51(23):168-172萃取瓶的顶空部分,在60ħ水浴中平衡10min,推出萃取头,吸附50min 后,取出并立即插入气相色谱仪的进样口中,热解析3min,同时启动仪器进行数据收集分析[6]㊂1.2.3㊀GC -MS 条件㊂1.2.3.1㊀GC 条件㊂色谱柱为HB -5MS(30m ˑ0.32mm ˑ0.25μm)弹性石英毛细管柱㊂进样口温度为240ħ;载气为高纯氦气;流速1.0mL /min㊂柱温程序:初温50ħ保持5min,以3ħ/min 升至180ħ保持2min,再以10ħ/min 升至250ħ保持3min㊂1.2.3.2㊀MS 条件㊂EI 电离能量为70eV;质量扫描范围为50~500amu;离子源温度为230ħ;四极杆温度为150ħ;质谱传输线温度为280ħ㊂1.3㊀物质鉴定㊀利用NIST14.L 谱库对得到的质谱图进行串联检索和人工解析㊂查找有关质谱资料,对基峰㊁质核比和相对峰度等方面进行分析,结合保留时间和质谱分别对各峰加以确认㊂釆用内标癸酸乙酯定量香气成分,计算公式:待测物含量=癸酸乙酯含量ˑ待测物峰面积/癸酸乙酯峰面积㊂1.4㊀茉莉花茶香气指数㊀茉莉花茶香气JTF 指数=(α-法尼烯+顺-3-苯甲酸叶醇酯+邻氨基苯甲酸甲酯+吲哚)/芳樟醇[5],JTF 数值越大,花茶的等级越高;茉莉花茶香气XFJTF 指数=(顺式-3-己烯醇苯甲酸酯+吲哚+氨茴酸甲酯)/(芳樟醇+乙酸叶醇酯+乙酸卞酯)ˑ100[7],根据得分将花茶分为6个级别(特级㊁一级㊁二级㊁三级㊁四级㊁五级),得分越高,花茶品质越好㊂1.5㊀数据分析㊀采用SPSS 17.0软件进行方差分析㊁相关性分析㊂2㊀结果与分析2.1㊀不同等级茉莉花茶风味特征分析㊀不同等级茉莉花茶风味特征感官分析结果如表1所示㊂6个等级茉莉花茶风味特征有明显差异,其中以特级茉莉花的香气和滋味品质最优,花香馥郁㊁持久,滋味浓醇爽口㊂随着等级的下降,花香强度和持久性也明显减弱,四级㊁五级茉莉花的花香淡薄,强度也最低,这可能与窨制次数㊁茉莉花质量直接相关;同样滋味的浓度与爽口度也随着等级的下降而减弱,这可能与茶坯的质量好坏密切相关㊂表1㊀不同等级茉莉花茶风味品质分析Table 1㊀Flavor and quality analysis of jasmine tea with different grades样品编号Sample No.样品级别Sample grade香气特征Aroma characteristic评分Score 滋味特征Taste characteristic评分Score JT1特级花香馥郁㊁持久95.0浓醇爽口94.0JT2一级花香浓郁92.0浓醇91.5JT3二级花香较高88.0醇厚88.5JT4三级花香尚高86.0醇和85.0JT5四级淡薄80.0尚醇和81.0JT6五级香弱78.0平和77.52.2㊀不同等级茉莉花茶主要香气化合物种类分析㊀不同等级茉莉花茶香气组分的定性和定量结果如表2所示㊂6个等级茉莉花茶中共检测到52个香气化合物,从鉴定出的香气组分来看,主要包括酯类㊁醇类㊁烯类㊁醛类㊁酮类㊁酚类和其他化合物(图1)㊂6个不同等级茉莉花茶香气化合物种类具有明显差异㊂酯类和醇类是主导香气化合物,酯类物质含量占总香气含量的比例最高(56.07%~72.71%),主要是乙酸苯甲酯㊁顺-3-己烯-苯甲酸酯㊁邻氨基苯甲酸甲酯等;其次为醇类物质,占总香气含量的比例为14.47%~29.93%,主要包括芳樟醇㊁苯甲醇等㊂以往对茉莉花茶的研究表明,酯类和醇类化合物是其关键呈香成分,对花香特征有很大贡献[4,8-9]㊂该研究中,高等级(特级㊁一级和二级)茉莉花茶的酯类及其他类(吲哚)的含量总体明显高于低等级(三级㊁四级和五级),而高等级的醇类㊁醛类和酮类总量明显低于低等级㊂酯类中的大部分物质及吲哚来源于茉莉花的窨制工艺,而茶坯本身具备的香气成分以醇类㊁醛类和酮类为主,因此,高等级的茉莉花茶随着窨制次数的增加其特征酯类物质含量也明显上升,而低等级的茉莉花茶由于窨制质量不高导致特征酯类物质含量相对较低㊂表2㊀不同等级茉莉花茶香气成分含量Table 2㊀Aroma component contents in different grades of jasmine tea序号No.保留时间Retention timemin化合物Compound含量Contentʊμg /L特级Special grade一级Level 1二级Level 2三级Level 3四级Level 4五级Level 5113.45(E)-3-己烯-1-醇乙酸酯17.6418.3019.0214.5921.5820.93217.85苯甲酸甲酯88.9885.75100.9687.33103.88121.62321.49乙酸苯甲酯601.14541.56637.69397.44504.47543.90421.64苯甲酸乙酯 3.85 4.92 4.02 5.85 5.21 6.74522.40反-丁酸-3-己烯酯2.52 1.89 2.78 1.41 1.44 1.66622.65水杨酸甲酯130.74127.60138.01101.47104.4493.37726.05水杨酸乙酯1.20 1.681.721.320.841.10接下表96151卷23期㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀陈军海等㊀不同等级茉莉花茶香气成分比较分析续表2序号No.保留时间Retention timemin化合物Compound含量Contentʊμg /L特级Special grade一级Level 1二级Level 2三级Level 3四级Level 4五级Level 5829.42邻氨基苯甲酸甲酯252.27164.30174.5065.8855.8043.08931.29(Z)-己-3-烯醇(Z)-己-3-烯酸酯8.19 5.077.08 1032.07N -甲基邻氨基苯甲酸甲酯15.269.7212.758.90 6.68 4.981138.94顺-3-己烯-苯甲酸酯366.29275.02224.70118.8381.6651.121239.10苯甲酸己酯7.15 3.69 4.28 3.43 3.24 1.361345.83苯甲酸苯甲酯 2.23 1.98 3.19 ㊀ 14 6.673-己烯-1-醇 4.05 4.43 4.34 4.02 3.85 6.421514.95苯甲醇32.5835.2145.7941.6531.1053.281618.38芳樟醇251.27274.80284.59323.98354.61385.431725.37橙花醇 4.54 4.41 4.000001841.37T -杜松醇 5.48 5.53 3.52 3.58 3.13 2.101914.50柠檬烯 1.59 2.290.75 2.19 2.88 1.852015.443-蒈烯 1.91 2.08 1.67㊀㊀㊀ 2129.56α-荜澄茄油烯㊀ 7.677.74 4.63 3.46 2.452230.76α-古巴烯 3.08 2.75 2.81 4.01 2.66 2.352332.39α-柏木烯 1.10 1.200.98 2.72 1.170.832433.01大根香叶烯 1.04 1.070.97㊀㊀㊀ 2533.67苊烯 1.05 1.07 1.03㊀㊀㊀ 2634.05α-蛇麻烯 1.75 1.64 1.51 2.37 1.61 1.302734.76δ-杜松烯 1.36 1.23 1.27㊀㊀㊀ 2835.86α-摩勒烯 6.42 4.81 5.547.12 5.59 3.692936.22α-法尼烯35.4431.6426.77 4.59 3.72 2.113036.42γ-杜松烯 6.32 6.48 6.589.19 6.17 5.223136.65β-杜松烯17.4718.2216.1716.8212.1410.203236.76去氢白菖烯 3.29 3.47 2.37 4.34 3.84 2.433337.50二去氢菖蒲烯0.94 1.110.79 2.03 1.320.8434 2.751-戊烯-3-酮0.300.450.540.580.96 1.313516.643,5-辛二烯-2-酮㊀㊀㊀ 9.8011.837.463631.56顺-茉莉酮 1.00 1.10 1.07 3732.77α-紫罗酮 2.76 2.45 3.6016.7012.509.353833.90反-香叶基丙酮 4.51 4.24 5.4824.7718.6212.643935.10β-紫罗酮13.8612.1914.1243.3430.3023.6540 4.74己醛0.200.260.41 1.75 2.68 1.84418.45庚醛㊀㊀㊀ 0.65 1.07 1.214211.23苯甲醛7.96 6.068.2417.6416.4114.484313.04反,反-2,4-庚二烯醛 1.71 1.16 2.29 5.7212.827.224416.062-辛烯-1-醛㊀㊀㊀ 3.09 2.99 2.844522.80藏红花醛㊀㊀㊀ 5.53 4.55 5.814623.33癸醛 1.13 1.29 1.78 4.42 3.41 2.184723.79β-环柠檬醛 1.47 1.56 2.55 6.67 6.22 5.914829.79丁香酚9.917.348.84 6.18 3.96 3.114939.492,4,6-三叔丁基苯酚 3.60 6.6412.08 3.09 2.38 1.985022.13萘 1.28 1.20 1.89 1.23 1.27 2.115127.21吲哚127.45104.0490.1031.3015.2212.695236.94二氢猕猴桃内酯 4.153.773.3116.187.408.04㊀注: 表示未检出㊂㊀Note: indicates notdetected.图1㊀不同等级茉莉花茶香气种类的比例Fig.1㊀Proportion of aroma types in different grades of jasminetea2.3㊀不同等级茉莉花茶主要香气成分分析㊀对不同等级茉莉花茶的香气化合物进一步分析,发现乙酸苯甲酯(397.44~637.69μg /L)㊁芳樟醇(251.27~385.43μg /L)㊁顺-3-己烯-苯甲酸酯(51.12~366.29μg /L)㊁邻氨基苯甲酸甲酯(43.08~252.27μg /L)㊁水杨酸甲酯(93.37~138.01μg /L)和苯甲酸甲酯(85.75~121.62μg /L)等成分含量较高(图2),这与前人的研究结果相似[3,10-11]㊂由图2可知,6个不同等级茉莉花茶主要香气成分具有明显差异㊂顺-3-己烯-苯甲酸酯含量随着茉莉花茶等级的下降而明显降低,而芳樟醇的含量正好相反;高等级(特级㊁一级和二级)茉莉花茶的乙酸苯甲酯㊁顺-3-己烯-苯甲酸酯和水杨酸甲酯明显高于低等级(三级㊁四级和五级);苯甲酸71㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀安徽农业科学㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀2023年甲酯在不同等级之间差异不明显㊂乙酸苯甲酯具有花香㊁果香气味[9],芳樟醇具有愉悦的花香[12],顺-3-己烯-苯甲酸酯具有青草气㊁辛辣㊁木香气味[10,13],邻氨基苯甲酸甲酯呈现水果㊁葡萄气味[10,13],水杨酸甲酯一般呈现薄荷㊁冬青叶气味[14],苯甲酸甲酯具有花香㊁果香[3,15],正是这些关键香气成分的含量与比例的差异构成了不同等级茉莉花茶的香气特征㊂图2㊀不同等级茉莉花茶关键香气化合物比较Fig.2㊀Comparison of key aroma compounds in different grades of jasmine tea2.4㊀不同等级茉莉花茶香气品质与香气成分的相关性分析㊀基于不同等级茉莉花茶的香气感官评分(表1)与香气成分的含量(表2),采用SPSS 软件进行相关性分析,得到影响茉莉花茶香气品质的关键香气成分(表3)㊂其中顺-3-己烯-苯甲酸酯㊁吲哚㊁T -杜松醇㊁丁香酚㊁α-法尼烯㊁邻氨基苯甲酸甲酯㊁β-杜松烯㊁N -甲基邻氨基苯甲酸甲酯㊁3-蒈烯㊁橙花醇㊁大根香叶烯㊁δ-杜松烯㊁苊烯㊁(Z)-己-3-烯醇(Z)-己-3-烯酸酯㊁顺-茉莉酮㊁苯甲酸己酯这16个组分与香气评分呈极显著正相关(P <0.01,r ȡ0.83);而1-戊烯-3-酮㊁芳樟醇㊁庚醛㊁己醛㊁β-环柠檬醛㊁反,反-2,4-庚二烯醛㊁2-辛烯-1-醛㊁藏红花醛这8个组分与香气评分呈极显著负相关(P <0.01,r ɤ-0.83)㊂酯类是茉莉花茶的主要香气化合物,且大部分成分与香气品质呈正相关,这与Wang 等[10]的研究结果相符㊂从相关性分析结果来看,烯类物质对香气品质也非常重要,烯类主要呈现清香㊁花香等风味[16-17],叶秋萍等[16]研究发现茶叶吸附茉莉花香气后烯烃类物质的种类增加最多,尤其是γ-焦烯㊁β-荜澄茄油烯㊁(+)-香橙烯㊁γ-荜澄茄烯等多来源于茉莉花,利于茉莉花茶鲜灵度和花果香风味的提高㊂己醛㊁庚醛㊁反,反-2,4-庚二烯醛等醛类成分大多与香气品质呈现负相关,醛类主要具有青草气㊁果香㊁脂肪风味,对绿茶香气呈现有很大的贡献[18-20]㊂随着窨制次数的增加,酯类等花香成分逐渐增加,进而可能使得醛类化合物的比例下降,因此醛类在高等级茉莉花茶中占比较低,而在低等级花茶中占比较高㊂表3㊀茉莉花茶香气得分与香气成分含量相关性分析Table 3㊀Correlation analysis between aroma score and aroma component content of jasmine tea编号No.香气化合物Aroma compound相关系数Correlation coefficient 编号No.香气化合物Aroma compound相关系数Correlation coefficient11-戊烯-3-酮-0.947∗∗13丁香酚0.921∗∗2己醛-0.870∗∗14(Z)-己-3-烯醇(Z)-己-3-烯酸酯0.848∗∗3庚醛-0.934∗∗15顺-茉莉酮0.837∗∗4反,反-2,4-庚二烯醛-0.832∗∗16N -甲基邻氨基苯甲酸甲酯0.880∗∗53-蒈烯0.870∗∗17大根香叶烯0.867∗∗62-辛烯-1-醛-0.830∗∗18苊烯0.857∗∗7芳樟醇-0.945∗∗19δ-杜松烯0.866∗∗8藏红花醛-0.839∗∗20α-法尼烯0.916∗∗9β-环柠檬醛-0.845∗∗21β-杜松烯0.897∗∗10橙花醇0.876∗∗22顺-3-己烯-苯甲酸酯0.961∗∗11吲哚0.946∗∗23苯甲酸己酯0.845∗∗12邻氨基苯甲酸甲酯0.911∗∗24T -杜松醇0.929∗∗㊀注: ∗∗ 表示极显著相关(P <0.01)㊂㊀Note: ∗∗ indicates extremely significant correlation(P <0.01).17151卷23期㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀陈军海等㊀不同等级茉莉花茶香气成分比较分析2.5㊀茉莉花茶香气品质评价指标验证分析㊀根据前人提出的茉莉花茶品质评价公式计算不同等级茉莉花茶样的香气品质JTF和XFJTF指数,结果如表4所示㊂随着等级的下降,JTF和XFJTF指数均呈现下降趋势,但是JTF指数在一级与二级㊁三级与四级㊁四级与五级之间无显著差异㊂2个指数都可以区分不同等级茉莉花茶,相较而言,XFJTF指数可以更显著区分每个等级,区分度更优㊂XFJTF指数中的乙酸叶醇酯在此次检测中未检出,因此该评价公式也需要在分析大量代表性样品基础上进一步优化完善㊂表4㊀茉莉花茶香气品质指数分析Table4㊀Analysis of aroma quality index of jasmine tea等级Grade JTF指数JTF index XFJTF指数XFJTF index 特级Special grade 3.11a87.52a一级Level1 2.09b66.56b二级Level2 1.81b53.05c三级Level30.68c29.94d四级Level40.44cd17.77e五级Level50.28d11.50f㊀注:同列不同小写字母表示差异显著(P<0.05)㊂㊀Note:Different lowercase letters in the same column indicate significant differences(P<0.05).3㊀结论与讨论该研究发现不同等级茉莉花茶中共检测到52个香气化合物,主要包括酯类㊁醇类㊁烯类㊁醛类㊁酮类㊁酚类和其他化合物;酯类和醇类化合物是关键呈香成分,高等级(特级㊁一级和二级)茉莉花茶的酯类及其他类(吲哚)的含量总体明显高于低等级(三级㊁四级和五级),而高等级的醇类㊁醛类和酮类总量明显低于低等级㊂乙酸苯甲酯㊁芳樟醇㊁顺-3-己烯-苯甲酸酯㊁邻氨基苯甲酸甲酯㊁水杨酸甲酯和苯甲酸甲酯是主要的呈香成分㊂相关性分析表明,顺-3-己烯-苯甲酸酯㊁吲哚等16个组分对花香品质有直接贡献㊂进一步研究发现利用XFJTF指数可以较准确地区分不同等级茉莉花茶香气品质的优劣㊂该研究综合分析了6个等级茉莉花茶的香气类别㊁主要香气成分,并结合感官审评结果,讨论了香气成分与其香气感官品质间的相关性,验证分析了香气品质评价指标的准确性与实用性㊂不同等级茉莉花茶的香气组分及比例的不同形成了其独特的香气特征,该试验结果明确了不同等级茉莉花茶的特征成分的差异,并进一步验证了香气评价指数的准确性,但其评价公式还有待不断完善㊂另外,电子鼻技术也常用于判别不同等级㊁不同产地茶叶香气特征[21-23],这些评价技术各有优势,未来如何联合感官审评㊁GC-MS与电子鼻技术快速准确识别不同等级茉莉花茶㊁加香精茉莉花茶还需要进一步开展研究㊂参考文献[1]夏涛.制茶学[M].3版.北京:中国农业出版社,2019.[2]SHEN J X,RANA M M,LIU G F,et al.Differential contribution of jasmine floral volatiles to the aroma of scented green tea[J].Journal of food quali-ty,2017,2017:1-10.[3]AN H M,OU X C,ZHANG Y B,et al.Study on the key volatile compounds and aroma quality of jasmine tea with different scenting technology[J]. Food chemistry,2022,385:1-10.[4]ZHANG Y B,XIONG Y F,AN H M,et al.Analysis of volatile components of jasmine and jasmine tea during scenting process[J].Molecules,2022,27(2):1-21.[5]LIN J,CHEN Y,ZHANG P,et al.A novel quality evaluation index and strategies to identify scenting quality of jasmine tea based on headspace volatiles analysis[J].Food science and biotechnology,2013,22(2):331-340.[6]刘盼盼,郑鹏程,王胜鹏,等.青砖茶初制㊁渥堆过程中挥发性风味成分分析[J].食品与发酵工业,2017,43(12):176-183.[7]陈梅春,林增钦,郑梅霞,等.茉莉花茶香气品质评价指标的构建与研究[J].茶叶通讯,2021,48(1):90-97.[8]安会敏,欧行畅,熊一帆,等.茉莉花茶特征香气成分研究[J].茶叶科学,2020,40(2):225-237.[9]张俊杰,傅天龙,傅天甫,等.福州茉莉花茶窨制次数与香气成分的关联分析[J].茶叶科学,2021,41(1):113-121.[10]WANG S Y,ZHAO F,WU W X,et parison of volatiles in different jasmine tea grade samples using electronic nose and automatic thermal desorption-gas chromatography-mass spectrometry followed by multivariate statistical analysis[J].Molecules,2020,25(2):1-16.[11]CHEN M C,ZHU Y J,LIU B,et al.Changes in the volatiles,chemical components,and antioxidant activities of Chinese jasmine tea during the scenting processes[J].International journal of food properties,2017,20(3):681-693.[12]刘盼盼,郑鹏程,龚自明,等.青砖茶渥堆工艺优化及风味物质分析[J].中国食品学报,2021,21(8):224-234.[13]傅天龙,郭晨,傅天甫,等.福州8种主要茉莉花茶特征香气成分比较与分析[J].茶叶科学,2020,40(5):656-664.[14]刘盼盼,郑鹏程,龚自明,等.橘红茶香气特征及风味成分分析[J].食品科学,2021,42(8):198-205.[15]LI H H,LUO L Y,MA M J,et al.Characterization of volatile compounds and sensory analysis of jasmine scented black tea produced by different scenting processes[J].Journal of food science,2018,83(11):2718-2732.[16]叶秋萍,余雯,郑世仲,等.茉莉花茶窨制过程水分变化与香气品质变化的相关性分析[J].食品科学,2022,43(24):266-272. [17]GUO X Y,HO C T,SCHWAB W,et al.Aroma profiles of green tea made with fresh tea leaves plucked in summer[J].Food chemistry,2021,363:1 -10.[18]WANG M Q,MA W J,SHI J,et al.Characterization of the key aroma com-pounds in Longjing tea using stir bar sorptive extraction(SBSE)combined with gas chromatography-mass spectrometry(GC-MS),gas chromatogra-phy-olfactometry(GC-O),odor activity value(OAV),and aroma recombi-nation[J].Food research international,2020,130:1-11. [19]LIU P P,ZHENG P C,GONG Z M,et paring characteristic aroma components of bead-shaped green teas from different regions using head-space solid-phase microextraction and gas chromatography-mass spectrom-etry/olfactometry combined with chemometrics[J].European food re-search and technology,2020,246(9):1703-1714.[20]YIN P,KONG Y S,LIU P P,et al.Temporal variation of the non-volatile compounds and key odorants in Xinyang Maojian green teas during the spring and autumn seasons[J].Agronomy,2022,12(5):1-14. [21]KAUSHAL S,NAYI P,RAHADIAN D,et al.Applications of electronic nose coupled with statistical and intelligent pattern recognition techniques for monitoring tea quality:A review[J].Agriculture,2022,12(9):1-19.[22]LU X H,WANG J,LU G D,et al.Quality level identification of West Lake Longjing green tea using electronic nose[J].Sensors and actuators B: Chemical,2019,301:1-10.[23]XU M,WANG J,GU S.Rapid identification of tea quality by E-nose and computer vision combining with a synergetic data fusion strategy[J].Jour-nal of food engineering,2019,241:10-17.271㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀安徽农业科学㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀㊀2023年。

集成延迟时钟的3.75kV、6通道

表2. 开关规格
参数 MCLK, MO, SO SPI时钟速率数据速率高(MO、SO) 传播延迟脉冲宽度脉冲宽度失真同向通道匹配1 抖动，高速 MSS 数据速率高传播延迟脉冲宽度脉冲宽度失真建立时间2 抖动，高速 DCLK 数据速率传播延迟脉冲宽度失真脉冲宽度时钟延迟误差抖动 VIA, VIB 数据速率低传播延迟脉冲宽度抖动，低速 VIx3最低输入偏斜4
12367-001
CONTROL BLOCK CLK DELAY
CONTROL BLOCK
14 13 12 11
DCLK 9 GND1 10
图1.
应用
工业可编程逻辑控制器(PLC) 传感器隔离
概述
ADuM31501 是一款6通道SPIsolator™数字隔离器，针对隔离式串行外设接口(SPI)进行了优化。这些器件基于ADI公司的iCoupler®芯片级变压器技术，在CLK、MO/SI、MI/SO和 SS SPI总线信号中具有低传播延迟特性，可支持最高17 MHz 的SPI时钟速率。这些通道在工作时具有14 ns传播延迟和1 ns 抖动，以针对SPI优化时序。 ADuM3150隔离器还额外提供2个独立的低数据速率隔离通道，每个方向1个通道。器件以250 kbps数据速率对慢速通道中的数据进行采样和串行化，并伴有2.5 μs抖动。 ADuM3150还支持输出一个延时时钟在器件主机侧的。该输出可与主机上的额外时钟端口搭配，以支持40 MHz的时钟性能。更多信息参见“延迟时钟”部分。
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2014 Analog Devices, Inc. All rights reserved. Technical Support

各类生化仪器的读点增加迈瑞型号

10-250 15-250 10-170
10分钟共计 62
33
反应量 (uL) 120-
120-360
样本量 (uL)
2.0-25.0
2.0-35
样本步进试剂量
量(uL)
(uL)
100<R1<
0.1 345,20<
R2<300
100<R1<
0.1 345,20<
R2<300
2000FR 雅培系列
量(uL)
(uL)
R1:1251 327,R2:6
-75
DXC800
150-
1.5-
0.1
20-
AU480 AU680 AU5800 东芝系列
40FR
加入2试剂时间
31点加入，33点
搅拌
120FR 16-17
秒/点 9 18
90-350 1.0-25.0 0.1 120-425 1.6-25.0 0.1 80-287 1.0-17.0 0.1
17
M
18
33 100-360 1.5-35
1000.1 300/15-
300
杜邦 ARX/RXL
R3(加入2 试剂位置)
秒/点
10分钟共计
不分点，都用秒表
示
ARX/RXL
样本固定在0S,R2加入从R1计
SYSMEX180
R3(加入2 试剂位置)
秒/点
10分钟共计
SYSMEX180
13-14
(uL)
量(uL)
(uL)
BS- 根据孵育 200/220 时间变化
16
BS330E/350

贝克曼AU680参数

在线帮助程序，用户自定义参数窗，实时质控，实时反应曲线，自动质控，自动定标，用户自定义自动重测判断，用户自定义计算试验，用户自定义试剂交叉污染程序，样品和实验原始数据编辑，CLIA软件包，系统状态显示，项目间计算，检体空白修正，正常值，危险值，报警值,试剂吸光度,反应吸光度，检查异常值未检再检表，纠正修正内部相关实验，试剂应用表，每日测试统计，相关更正因子，应用规定计算测试，功能组合测试，样品与测试的数据编辑等。
搅拌系统
多头回旋式，双清洗位，螺旋搅拌棒，特富龙涂层。具有搅拌棒的转速检测报警功能。
搅拌棒清洗
清洗液+温水（2遍）+风干；
样品再检
急诊台，重测样品架，稀释或浓缩样品再测。
测光
全反应过程测光，28测试点，每点4次测光平均值。单/双波长法。
吸光度范围
0-3Abs（精度：0.0001Abs）
条码阅读器
标准配置5部条码阅读器（病人ID、样品架ID、急诊病人ID、试剂1、试剂2）
操作系统windowsxp图形操作界面网络鼠标键盘或触摸屏选购件耗水量平均28升小时通讯主机和电脑中rj45连接rs232c双向实时或批方式软件功能在线帮助程序用户自定义参数窗实时质控实时反应曲线自动质控自动定标用户自定义自动重测判断用户自定义计算试验用户自定义试剂交叉污染程序样品和实验原始数据编辑clia软件包系统状态显示项目间计算检体空白修正正常值危险值报警值试剂吸光度反应吸光度检查异常值未检再检表纠正修正内部相关实验试剂应用表每日测试统计相关更正因子应用规定计算测试功能组合测试样品与测试的数据编辑等
反应量
最小120ul，最大425ul。
反应温度
37±0.1℃
试剂瓶
120，60，30，15ml。

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Product Name:
Pulsatilla saponin D CAS No.:
68027-15-6Cat. No.:
HY-N0834
Product Data Sheet
MWt:
913.10Formula:
C47H76O17Purity :>98%
Solubility:
DMSO
y Mechanisms:
Biological Activity:
Pulsatilla saponin D(SB365)isolated from the root of Pulsatilla koreana has exhibited potential
Pathways:Others; Target:Others Pulsatilla saponin D(SB365) isolated from the root of Pulsatilla koreana, has exhibited potential beneficial effects as a chemopreventive agent for critical health conditions including cancer.
IC50 value:
Target:SB365 effectively inhibited the growth of gastric cancer cells. Its apoptotic effect was accompanied by increased evidence of cleaved caspase-3 and poly(ADP ribose) polymerase. To elucidate the anticancer mechanism of SB365, we used an array of 42 different receptor tyrosine kinases (RTKs).Of the 42 different phospho-RTKs, SB365 strongly inhibited expression of activated c-mesenchymal-epithelial transition factor (c-Met) in gastric cancer cells [1]. SB365 strongly suppressed the growth References:
[1]. Hong SW, et al. SB365, Pulsatilla saponin D, targets c-Met and exerts antiangiogenic and
antitumor activities. Carcinogenesis. 2013 Sep;34(9):2156-69.[2]. Son MK, et al. SB365, Pulsatilla saponin D suppresses proliferation and induces apoptosis of p ()g []g y pp g and proliferation of 5 human pancreatic cancer cell lines (MIAPaCa-2, BXPC-3, PANC-1, AsPC-1and HPAC). The apoptotic effect of SB365 was demonstrated by increased levels of c...
pancreatic cancer cells. Oncol Rep. 2013 Aug;30(2):801-8.[3]. Son MK, et al. SB365, Pulsatilla saponin D suppresses the proliferation of human colon cancer cells and induces apoptosis by modulating the AKT/mTOR signalling pathway. Food Chem. 2013
Jan 1;136(1):26-33.Caution: Not fully tested. For research purposes only
Medchemexpress LLC
18 W i l k i n s o n W a y , P r i n c e t o n , N J 08540,U S A
E m a i l : i n f o @m e d c h e m e x p r e s s .c o m W e b : w w w .m e d c h e m e x p r e s s .c o m。