MMST4401T146;SST4401T116;中文规格书,Datasheet资料

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MW6S004NT1;中文规格书,Datasheet资料

MW6S004NT1;中文规格书,Datasheet资料

RF Power Field Effect TransistorN-Channel Enhancement-Mode Lateral MOSFETDesigned for Class A or Class AB base station applications with frequencies up to 2000 MHz. Suitable for analog and digital modulation and multicarrier amplifier applications.•Typical Two-Tone Performance @ 1960 MHz, 28 Volts, I DQ = 50 mA, P out = 4 Watts PEP Power Gain — 18 dB Drain Efficiency — 33%IMD — -34 dBc•Typical Two-Tone Performance @ 900 MHz, 28 Volts, I DQ = 50 mA, P out = 4 Watts PEP Power Gain — 19 dB Drain Efficiency — 33%IMD — -39 dBc•Capable of Handling 5:1 VSWR, @ 28 Vdc, 1960 MHz, 4 Watts CW Output Power Features•Characterized with Series Equivalent Large-Signal Impedance Parameters •On-Chip RF Feedback for Broadband Stability •Integrated ESD Protection •RoHS Compliant•In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.Table 1. Maximum RatingsRatingSymbol Value Unit Drain-Source Voltage V DSS -0.5, +68Vdc Gate-Source Voltage V GS -0.5, +12Vdc Storage Temperature Range T stg -65 to +150°C Operating Junction TemperatureT J150°CTable 2. Thermal CharacteristicsCharacteristicSymbol Value (1,2)Unit Thermal Resistance, Junction to CaseCase Temperature 76°C, 4 W PEP , Two-Tone Case Temperature 79°C, 4 W CWR θJC8.88.5°C/WTable 3. ESD Protection CharacteristicsTest MethodologyClass Human Body Model (per JESD22-A114)1C (Minimum)Machine Model (per EIA/JESD22-A115) A (Minimum)Charge Device Model (per JESD22-C101)IV (Minimum)1.MTTF calculator available at /rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product.2.Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to /rf. Select Documentation/Application Notes - AN1955.Document Number: MW6S004NRev. 4, 6/2009Freescale Semiconductor Technical DataMW6S004NT1Table 4. Moisture Sensitivity LevelTest MethodologyRating Package Peak TemperatureUnit Per JESD 22-A113, IPC/JEDEC J-STD-0203260°CTable 5. Electrical Characteristics (T A = 25°C unless otherwise noted)CharacteristicSymbolMinTypMaxUnitOff CharacteristicsZero Gate Voltage Drain Leakage Current (V DS = 68 Vdc, V GS = 0 Vdc)I DSS ——10μAdc Zero Gate Voltage Drain Leakage Current (V DS = 28 Vdc, V GS = 0 Vdc)I DSS ——10μAdc Gate-Source Leakage Current (V GS = 5 Vdc, V DS = 0 Vdc)I GSS——500nAdcOn CharacteristicsGate Threshold Voltage(V DS = 10 Vdc, I D = 50 mAdc)V GS(th) 1.22 2.7Vdc Gate Quiescent Voltage(V DS = 28 Vdc, I D = 50 mAdc)V GS(Q)— 2.7—Vdc Fixture Gate Quiescent Voltage (1)(V DD = 28 Vdc, I D = 50 mAdc, Measured in Functional Test)V GG(Q) 2.23 4.2Vdc Drain-Source On-Voltage(V GS = 10 Vdc, I D = 50 mAdc)V DS(on)—0.270.37VdcDynamic CharacteristicsReverse Transfer Capacitance(V DS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V GS = 0 Vdc)C rss —21—pF Output Capacitance(V DS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V GS = 0 Vdc)C oss —25—pF Input Capacitance(V DS = 28 Vdc, V GS = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)C iss—30—pFFunctional Tests (In Freescale Test Fixture, 50 ohm system) V DD = 28 Vdc, I DQ = 50 mA, P out = 4 W PEP , f1 = 1960 MHz, f2 = 1960.1 MHz, Two-Tone Test Power Gain G ps 16.51820dB Drain EfficiencyηD 2833—%Intermodulation Distortion IMD —-34-28dBc Input Return LossIRL—-12-10dBTypical Performance (In Freescale 900 MHz Demo Board, 50 ohm system) V DD = 28 Vdc, I DQ = 50 mA, P out = 4 W PEP , f = 900 MHz, Two-Tone Test, 100 kHz Tone Spacing Power Gain G ps —19—dB Drain EfficiencyηD —33—%Intermodulation Distortion IMD —-39—dBc Input Return LossIRL—-12—dB1.V GG = 11/10 x V GS(Q). Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit Schematic.MW6S004NT1Figure 1. MW6S004NT1 Test Circuit SchematicZ70.210″ x 1.220″ Microstrip Z80.054″ x 0.680″ Microstrip Z90.054″ x 0.260″ Microstrip Z100.025″ x 0.930″ MicrostripPCBArlon CuClad 250GX-0300-55-22, 0.020″, εr = 2.5Z10.054″ x 0.430″ Microstrip Z20.054″ x 0.137″ Microstrip Z30.580″ x 0.420″ Microstrip Z40.580″ x 0.100″ Microstrip Z50.025″ x 0.680″ Microstrip Z60.210″ x 0.100″ MicrostripV SUPPLYTable 6. MW6S004NT1 Test Circuit Component Designations and ValuesPartDescriptionPart Number Manufacturer C1100 nF Chip Capacitor CDR33BX104AKYS Kemet C2, C3, C6, C79.1 pF Chip Capacitors ATC100B9R1CT500XT ATC C4, C510 μF, 50 V Chip Capacitors GRM55DR61H106KA88B Murata C810 μF, 35 V Tantalum Chip Capacitor T490D106K035AT Kemet R1 1 k Ω, 1/4 W Chip Resistor CRCW12061001FKEA Vishay R210 k Ω, 1/4 W Chip Resistor CRCW12061002FKEA Vishay R310 Ω, 1/4 W Chip ResistorCRCW120610R0FKEAVishayMW6S004NT1Figure 2. MW6S004NT1 Test Circuit Component LayoutMW6S004NT1TYPICAL CHARACTERISTICS1420191716G p s , P O W E R G A I N (d B )100.1TWO−TONE SPACING (MHz)1100Figure 6. Intermodulation Distortion Productsversus Tone Spacing 26P in , INPUT POWER (dBm)1618222414Figure 7. Pulsed CW Output Power versusInput PowerI M D , I N T E R M O D U L A T I O N D I S T O R T I O N (d B c )181520MW6S004NT1TYPICAL CHARACTERISTICSA C P R (dB )−70P out , OUTPUT POWER (WATTS) AVG.50−2040−3030−4020−5010−600.01110Figure 8. Single-Carrier CDMA ACPR, Power Gainand Drain Efficiency versus Output PowerP out , OUTPUT POWER (WATTS) CWFigure 10. Power Gain versus Output Power 7151906171618234G p s , P O W E R G A I N (d B )1800−250f, FREQUENCY (MHz)Figure 11. Broadband Frequency Response−5−10−15−20210020502000195019001850S 11 (d B )851ηD , D R A I N E F F I C I E N C Y (%), G p s , P O W E R G A I N (d B )0.118.517.516.515.5MW6S004NT1TYPICAL CHARACTERISTICS25010790T J , JUNCTION TEMPERATURE (°C)Figure 12. MTTF versus Junction TemperatureThis above graph displays calculated MTTF in hours when the device is operated at V DD = 28 Vdc, P out = 4 W PEP, and ηD = 33%.MTTF calculator available at /rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product.106105104110130150170190M T T F (H O U R S )210230MW6S004NT1f = 1930 MHzZ o = 10 ΩZ loadZ sourcef = 1990 MHzf = 1930 MHzf = 1990 MHzV DD = 28 Vdc, I DQ = 50 mA, P out = 4 W PEPfMHzZ sourceWZ loadW1930 1.96 - j5.348.78 + j6.961960 1.89 - j5.108.93 + j7.461990 1.82 - j4.859.11 + j7.97Z source=Test circuit impedance as measured fromgate to ground.Z load=Test circuit impedance as measured fromdrain to ground.Z source Z loadOutputMatchingNetworkFigure 13. Series Equivalent Source and Load ImpedanceMW6S004NT1Table 7. Common Source Scattering Parameters (V DD = 28 V, 50 ohm system)I DQ = 50 mAf MH S 11S 21S 12S 22MHz |S 11|∠φ|S 21|∠φ|S 12|∠φ|S 22|∠φ5000.649-116.3407.902105.4200.056-73.7500.548-33.5705500.695-121.6807.50298.7900.053-80.5700.593-41.4806000.733-126.5607.11192.3800.049-87.0100.632-48.8906500.770-131.340 6.69986.2900.045-93.2800.669-56.0007000.800-135.740 6.30280.4500.041-99.1200.701-62.8107500.827-140.030 5.92274.8500.038-104.8500.727-69.2908000.848-143.950 5.55269.6300.035-110.1100.750-75.3508500.866-147.690 5.22064.5800.032-115.2200.770-81.1309000.882-151.140 4.89159.9700.029-119.9600.786-86.5709500.895-154.560 4.59755.4900.026-124.7900.800-91.73010000.907-157.590 4.31551.2400.024-129.0900.813-96.66010500.916-160.540 4.06047.1700.022-133.3700.824-101.34011000.923-163.310 3.81943.3400.020-137.4600.833-105.79011500.929-165.930 3.60139.6500.018-141.4400.840-110.05012000.935-168.430 3.39836.1100.017-145.3300.847-114.17012500.938-170.770 3.21032.7400.015-149.5400.851-118.06013000.942-173.030 3.03629.4900.014-153.4300.856-121.88013500.945-175.140 2.87526.3600.013-157.4600.859-125.52014000.948-177.170 2.72823.3300.012-161.9100.863-129.02014500.951-179.090 2.59020.4400.011-166.1800.866-132.39015000.953179.030 2.46417.6400.010-170.6300.869-135.65015500.954177.270 2.34714.9200.009-174.8900.872-138.76016000.955175.570 2.24012.3200.008179.9500.875-141.75016500.956173.980 2.1399.7400.008173.9200.877-144.65017000.957172.350 2.0477.2500.007167.7100.880-147.48017500.957170.800 1.958 4.8100.007161.8100.882-150.18018000.958169.340 1.879 2.4400.006155.3700.884-152.76018500.959167.920 1.8060.2600.006148.9400.886-155.23019000.959166.510 1.736-1.9800.005142.6300.887-157.58019500.960165.200 1.668-4.3100.005136.7400.888-160.05020000.959163.800 1.611-6.2400.005129.9100.890-162.07020500.959162.420 1.555-8.2900.005123.8100.891-164.19021000.958161.170 1.504-10.2700.005118.2000.892-166.14021500.958159.840 1.456-12.2100.005112.7400.893-168.06022000.957158.560 1.412-14.1300.005108.4600.894-169.84022500.957157.160 1.372-16.0100.005103.8400.896-171.61023000.955155.870 1.334-17.8700.00599.3100.896-173.26023500.954154.510 1.300-19.7000.00595.3600.897-174.83024000.953153.120 1.268-21.5100.00591.0300.898-176.39024500.953151.7301.238-23.2500.00587.4600.899-177.840MW6S004NT1Table 7. Common Source Scattering Parameters (V DD = 28 V, 50 ohm system) (continued)I DQ = 50 mAf MH S 11S 21S 12S 22MHz |S 11|∠φ|S 21|∠φ|S 12|∠φ|S 22|∠φ25000.952150.340 1.211-25.1200.00684.1600.899-179.27025500.950149.010 1.187-26.9200.00680.7800.897179.42026000.949147.380 1.166-28.6500.00677.8800.897178.12026500.948145.920 1.144-30.4200.00774.6700.898176.84027000.944144.200 1.121-32.3100.00771.3600.896175.48027500.944142.790 1.105-34.2300.00767.9800.897174.06028000.943141.020 1.088-36.0000.00763.9500.897172.93028500.941139.410 1.073-37.8700.00761.2300.896171.63029000.940137.640 1.058-39.7600.00859.8100.896170.33029500.938135.900 1.045-41.6800.00858.2800.896169.04030000.937133.8601.032-43.6100.00856.7400.895167.510分销商库存信息: FREESCALEMW6S004NT1。

SST2222A中文资料

SST2222A中文资料

UMT2222A,SST2222A,
MMST2222A
Collector power
dissipation
SST2222A
PC
PN2222A
Junction temperature
Tj
Storage temperature
Tstg
∗ When mounted on a 7 x 5 x 0.6 mm ceramic board
1000 100
Ta=125°C 25°C
−55°C
VCE=10V
10 0.1
1.0
10
100
COLLECTOR CURRENT : Ic(mA)
1000
Fig.4 DC current gain vs. collector current(ΙΙ)
AC CURRENT GAIN : hFE
1000 100
2.3
(1) Emitter (2) Base (3) Collector
!Electrical characteristics (Ta = 25°C)
Parameter Collector-base breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector cutoff current Emitter cutoff current Collector-emitter saturation voltage
MMST2222A
2.0±0.2 1.3±0.1 0.65 0.65 (1) (2)
0.9±0.1 0.2 0.7±0.1
1.25±0.1 2.1±0.1 0.1 ∼ 0.4

MBRS140T3G;中文规格书,Datasheet资料

MBRS140T3G;中文规格书,Datasheet资料

(Note: Microdot may be in either location)
Lead and Mounting Surface Temperature for Soldering Purposes:
ORDERING INFORMATION
Device MBRS140T3G SBRS8140T3G Package SMB (Pb−Free) SMB (Pb−Free) Shipping† 2,500 / Tape & Reel 2,500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DC
3 10
0
1
2
3
4
5
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Power Dissipation

3
/
MBRS140T3G, SBRS8140T3G
PACKAGE DIMENSIONS
Figure 3. Typical Capacitance
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
10 9 8 7 6 5 4 3 2 1 0 30 40 50 60 70 80 90 100 TC, CASE TEMPERATURE (C) 110 120 130

MMPQ2222A;FFB2222A;中文规格书,Datasheet资料

MMPQ2222A;FFB2222A;中文规格书,Datasheet资料

ON CHARACTERISTICS
hFE DC Current Gain IC = 0.1 mA, VCE = 10 V IC = 1.0 mA, VCE = 10 V IC = 10 mA, VCE = 10 V IC = 150 mA, VCE = 10 V* IC = 150 mA, VCE = 1.0 V* IC = 500 mA, VCE = 10 V* IC = 150 mA, IB = 15 mA IC = 500 mA, IB = 50 mA IC = 150 mA, IB = 15 mA IC = 500 mA, IB = 50 mA 35 50 75 100 50 40
*Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
Spice Model
NPN (Is=14.34f Xti=3 Eg=1.11 Vaf=74.03 Bf=255.9 Ne=1.307 Ise=14.34f Ikf=.2847 Xtb=1.5 Br=6.092 Nc=2 Isc=0 Ikr=0 Rc=1 Cjc=7.306p Mjc=.3416 Vjc=.75 Fc=.5 Cje=22.01p Mje=.377 Vje=.75 Tr=46.91n Tf=411.1p Itf=.6 Vtf=1.7 Xtf=3 Rb=10)
Thermal Characteristics
Symbol
PD RθJA
TA = 25°C unless otherwise noted
Characteristic
Total Device Dissipation Derate above 25°C Thermal Resistance, Junction to Ambient Effective 4 Die Each Die FFB2222A 300 2.4 415

全自动衬衫冷折装袋机操作手册说明书

全自动衬衫冷折装袋机操作手册说明书

全自动衬衫冷折装袋机Automatic Shirt Pocket Setter (MB1002B -1-S7300A-603P)使用说明书Instruction Manual常州智谷机电科技有限公司CHANGZHOU WISDOM &VALLEY ELECTRICAL TECHNOLOGY CO.,LTD在使用本设备之前请先阅读本使用说明书Please read the operation manual of the touch screen interface before using the device 请将本使用说明书放在便于查阅的地方保管Please keep this operation manual of touch screen interface in convenient placeforreference2022.04.03版本信息/Version感谢购买IMB工业用缝纫机。

在使用此机器之前,请仔细阅读以下的说明,这样可以更好地帮到您了解此机器的相关操作。

这些说明是根据现行的条例明确阐述了正确的工作方法。

Thank you for purchasing this industrial sewing machine from IMBBefore using this automatic unit,please read the following instructions,which will help you tounderstand how the machine operates.These instructions illustrate the correct working methods to comply with current regulations.在没有得到IMB授权许可的前提下,此说明书的任何部分是不可以被复制或者转录的。

说明书的内容可能被修改,而不需预先通知。

宝云兴业科贸 专业空气测计仪器 产品说明书

宝云兴业科贸 专业空气测计仪器 产品说明书

北京宝云兴业科贸有限公司成立于1998 年,自成立伊始,就秉持着“诚信、执着、创新、快速”的经营理念。

公司以国家相关标准为依据,引进国际先进仪器,以个性化配置方案与完善的服务体系为特色,先后成为国家卫生健康委员会、中国各省市疾控中心、卫生监督所等企事业单位的优质合作伙伴。

连续多年被推举为中国卫生监督协会环境卫生与健康专业委员会副主任委员单位,以及北京教育装备行业协会会员单位。

典型用户:国家卫生健康委员会、浙江省、福建省、安徽省、广西壮族自治区、江西省、辽宁省、河北省卫生厅、中国疾控中心、北京市疾控中心以及各省市卫生监督所、大专院校等单位。

美国TSI 公司成立于1961年,它是全球精密测量仪器设计和生产的行业领导者,出品的室内空气质量检测仪、颗粒物检测仪等都在国际上享有盛誉。

Sun Nuclear 成立于1984年,由一支经验丰富的辐射检测科学家和工程师队伍组成。

公司旨在为社会提供了一种新的测量辐射的方法,在提高了测量质量的同时也简化程序。

Mesalabs 股份有限公司是一家研发、制造及销售为一体的综合型企业,总部位于美国科罗拉多州的丹佛市。

公司主要产品包括监测仪器,数据采集仪器,气体流量校准仪器,环境监测仪及耗材等,仪器广泛应用于工业、实验室及环保等相关领域。

公司简介成功案例合作伙伴COMPANY PROFILESUCCESSFUL CASESPARTNERS美国SKC 公司是世界上最大的空气采样器制造商,是世界空气采样技术的领跑者,距今已有近60年的发展历史。

它向全球用户提供600种以上专业的空气采样产品。

日本理研计器株式会社成立于1939年,是日本知名的上市公司,也是日本首屈一指的气体测试仪器生产商,产品畅销于全球五大洲。

其生产的 FP-30MK2(C)甲醛检测仪,检测方法已被列为中国国标检测方法。

手动采样泵&检气管风速/新风量检测仪甲醛检测仪大气压力表射线检测仪水质检测套装空气采样泵流量校准器温湿度计振动测试仪细菌/病毒微生物采样系统差压计气体检测仪集中空调采样设备便携式B超检测仪在线监测系统采样附件颗粒物检测仪照度计热辐射检测仪撞击式空气微生物采样器室内空气质量检测仪测氡仪噪声检测仪水质检测仪061317263549 01082532 061520273655 05092633 0716252937产品手册 目录THE WHOLE INDUSTRYPRODUCT MANUALS01便携式采样泵(5-5000mL/min)产品特点AirChek Connect 型AirChek Connect 型便携式采样泵可通过蓝牙和USB 两种方式连接手机和电脑的低噪声采样泵。

规格书TD1410

规格书TD1410

General DescriptionThe TD1410 is a 380 KHz fixed frequency monolithic step down switch mode regulator with a built in internal Power MOSFET. It achieves 2A continuous output current over a wide input supply range with excellent load and line regulation.The device includes a voltage reference, oscillation circuit, error amplifier, internal PMOS and etc.The PWM control circuit is able to adjust the duty ratio linearly from 0 to 100%. An enable function, an over current protection function and a short circuit protection function are built inside. An internal compensation block is built in to minimize external component count.The TD1410 serves as ideal power supply units for portable devices.Features2A Constant Output Current140m Ω R DSON Internal Power PMOSFET SwitchUp to 95% EfficiencyFixed 380KHz FrequencyWide 3.6V to 20V Input Voltage RangeOutput Adjustable from 1.222V to 18V Built in Frequency Compensation Built in Thermal Shutdown Function Built in Current Limit Function SOP-8 Package is AvailableThe minimum dropout up to 0.3VApplicationsPortable DVD LCD Monitor / TVBattery Charger ADSL ModemTelecom / Networking EquipmentFigure 1 Package Type of TD1410Pin ConfigurationsFigure 2 Pin Configuration of TD1410 (Top View)Pin Description Pin NumberPin Name Description 1,6, 8NCNot Connect.2 Vin Supply V oltage Input Pin. TD1410 operates from a 3.6V to 20VDC voltage. Bypass Vin to GND with a suitably large capacitorto eliminate noise on the input.3 SWPower Switch Output Pin. SW is the switch node that suppliespower to the output.4 GNDGround Pin. Care must be taken in layout. This pin should be placed outside of the Schottky Diode to output capacitor groundpath to prevent switching current spikes from inducing voltage noise into TD1410.5 FB Feedback Pin. Through an external resistor divider network, FBsenses the output voltage and regulates it. The feedbackthreshold voltage is 1.222V .7 EN Enable Pin. EN is a digital input that turns the regulator on oroff .Drive EN pin high to turn on the regulator, drive it low toturn it off.Ordering InformationFunction BlockFigure 3 Function Block Diagram of TD1410Absolute Maximum RatingsUnit Parameter SymbolValueInput Voltage V IN-0.3 to 20 VFeedback Pin Voltage V FB-0.3 to Vin VEnable Pin Voltage V EN-0.3 to 12 VSwitch Pin Voltage V SW-0.3 to Vin VPower Dissipation P D Internally limited mWOperating Junction Temperature T J150 ºC Storage Temperature T STG-65 to 150 ºCLead Temperature (Soldering, 10 sec) T LEAD260 ºCESD (HBM) 2000 VThermal Resistance-Junction to Ambient RθJA 85 ºC / WThermal Resistance-Junction to Case RθJC 45 ºC / WNote1: Stresses greater than those listed under Maximum Ratings may cause permanent damageto the device. This is a stress rating only and functional operation of the device at these or anyother conditions above those indicated in the operation is not implied. Exposure to absolutemaximum rating conditions for extended periods may affect reliability.Recommended Operating ConditionsParameter Symbol Min. Max. UnitInput VoltageV IN 3.6 20 V Operating Junction Temperature T J -40 125 ºC Operating Ambient Temperature T A -40 85 ºCElectrical CharacteristicsV CC = 12V, T a = 25 unless otherwise specified.℃Parameters Symbol Test Condition Min.Typ. Max. UnitInput voltageV IN 3.6 20 V Shutdown Supply Current I STBY V EN =0V 30 90 uA Supply Current I CC V EN =2V , V FB = 1.3V 3.6 4 mA Feedback V oltage V FB V IN = 3.6V to 23V1.185 1.222 1.26VFeedback Bias Current I FBV FB = 1.3V 0.1 0.5 uASwitch Current Limit I LIM 3 4 A Oscillator FrequencyF OSC 320 380 440 KHzFrequency of CurrentLimit or Short Circuit Protection F OSC1 V FB =0V 42 KHzEN Pin ThresholdV EN 0.7 1.2 1.7 V I H V EN = 2.5V -0.1 -1 uA EN Pin Input Leakage CurrentI L V EN =0.5V -3 -10 uA Internal PMOS R DSON R DSON V IN =12V , V FB =0VV EN =12V , Iout=2A140 m ΩMax. Duty Cycle D MAX V FB =0V , I SW =0.1A 100 %Efficiency ηV IN =12V ,V out=5VIout=2A- 92 - %Thermal Shutdown T OTSD 165 ºCTypical Performance CharacteristicsFigure 5. Vfb vs. Temperature Figure 6. Icc vs. Temperature Figure 7. Efficiency vs. Load (Vin=10V) Figure 4. Switching Frequency vs. TemperatureTypical Application CircuitFig8. TD1410 Typical Application Circuit @ 5V/2ANote:In PCB layout. Reserved an area for CFF.Fig9. TD1410 Typical Application Circuit @ 3.3V/2ANote:In PCB layout. Reserved an area for CFF.TD1410TD14105.5V~20V DC INPUT4.5V~20V DC INPUT5V2A3.3V2AR2=2KR1=6.2KR2=3.6KR1=6.2KFig10. TD1410 Typical Application Circuit (with ceramic output capacitor) @ 5V/2ANote:In PCB layout. Reserved an area for CFF.Fig11. TD1410 Typical Application Circuit (with ceramic output capacitor) @ 3.3V/2ANote:In PCB layout. Reserved an area for CFF.TD1410TD14105.5V~20V DC INPUT4.5V~20V DC INPUT5V2A3.3V2AR2=2KR1=6.2KR2=3.6KR1=6.2KSchottky Rectifier Selection GuideVin (Max)2A Load CurrentPart Number VendorB220 120VSK23 6SR22 6Table 1 lists some rectifier manufacturers.SiteNo. Vendor WebInc. 1 Diodes,Semiconductor2 FairchildSemiconductor3 GeneralRectifier 4 InternationalSemiconductor 5 On6 Pan Jit International Table 2 Schottky Diode manufacturers.Output Voltage VS R1, R2 Resistor Selection GuideVout = (1+R1/R2)*1.222VVout R1 R21.8V 3.9K 8.2K2.5V3.2K 3K3.3V 6.2K 3.6K5V 6.2K 2K9V 13K 2K12V 16K 1.8KTable 3. Vout VS. R1, R2 Select TableFunction DescriptionPin FunctionsV INThis is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be present at this pin to minimize voltage transients and to supply the switching currents needed by the regulatorGndCircuit ground.SWInternal switch. The voltage at this pin switches between (V IN – V SAT) and approximately – 0.5V, with a duty cycle of approximately V OUT / V IN. To minimize coupling to sensitive circuitry, the PC board copper area connected to this pin should be kept a minimum.FBSenses the regulated output voltage to complete the feedback loop.ENAllows the switching regulator circuit to be shutdown using logic level signals thus dropping the total input supply current to approximately30uA. Pulling this pin below a threshold voltage of approximately 0.7 V turns the regulator down, and pulling this pin above 1.3V (up to a maximum of 12V) shuts the regulator on. For automatic starup condition , can be implemented by the addition ofa resistive voltage divider from V IN to GND. Thermal ConsiderationsThe TD1410 is available in SOP8 package.The SOP8 package needs a heat sink under most conditions. The size of the heat sink depends on the input voltage, the output voltage, the load current and the ambient temperature. The TD1410 junction temperature rises above ambient temperature for a 2A load and different input and output voltages. The data for these curves was taken with the TD1410 (SOP8 package) operating as a buck-switching regulator in an ambient temperature of 25o C (still air). These temperature rise numbers are all approximate and there are many factors that can affect these temperatures. Higher ambient temperatures require more heat sinking.For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout. (Once exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further.Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors that will affect these numbers. Some of these factors include board size, shape, thickness, position, location, and even board temperature. Other factors are, trace width, total printed circuit copper area, copper thickness, single or double-sided, multi-layer board and the amount of solder on the board.The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the board, as well as whether the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board.Setting the Output VoltageThe output voltage is set using a resistivevoltage divider from the output voltage to FB. The voltage divider divides theoutput voltage down by the ratio:VFB = VOUT * R2 / (R1 + R2)Thus the output voltage is:VOUT = 1.222 * (R1 + R2) / R2R2 can be as high as 100KΩ, but a typicalvalue is 10KΩ. Using that value, R1 isdetermined by:R1 ~= 8.18 * (VOUT – 1.222) (KΩ)For example, for a 3.3V output voltage, R2 is10KΩ, and R1 is 17KΩ.InductorThe inductor is required to supply constant current to the output load while being driven by the switched input voltage. A larger value inductor results in less ripple current that inturn results in lower output ripple voltage. However, the larger value inductor has a larger physical size, higher series resistance, and/or lower saturation current. Choose an inductor that does not saturate under the worst-case load conditions. A good rule for determiningthe inductance is to allow the peak-to-peak ripple current in the inductor to be approximately 30% of the maximum loadcurrent. Also, make sure that the peakinductor current (the load current plus half the peak-to-peak inductor ripple current) is below the TBDA minimum current limit. The inductance value can be calculated by the equation:L = (VOUT) * (VIN-VOUT) / VIN * f * ΔIWhere VOUT is the output voltage, VIN is the input voltage, f is the switching frequency, and ΔI is the peak-to-peak inductor ripple current. Input CapacitorThe input current to the step-down converter is discontinuous, and so a capacitor is requiredto supply the AC current to the step-down converter while maintaining the DC input voltage. A low ESR capacitor is required to keep the noise at the IC to a minimum. Ceramic capacitors are preferred, but tantalum or low-ESR electrolytic capacitors may also suffice.The input capacitor value should be greater than 10μF. The capacitor can be electrolytic, tantalum or ceramic. However since it absorbs the input switching current it requires an adequate ripple current rating. Its RMS current rating should be greater than approximately1/2 of the DC load current.For insuring stable operation should beplaced as close to the IC as possible. Alternately a smaller high quality ceramic0.1μF capacitor may be placed closer to the IC and a larger capacitor placed further away. If using this technique, it is recommended thatthe larger capacitor be a tantalum or electrolytic type. All ceramic capacitors should be places close to the TD1410.Output Capacitor The output capacitor is required to maintainthe DC output voltage. Low ESR capacitorsare preferred to keep the output voltage ripple low. The characteristics of the outputcapacitor also affect the stability of the regulation control system. Ceramic, tantalum,or low ESR electrolytic capacitors are recommended. In the case of ceramic capacitors, the impedance at the switching frequency is dominated by the capacitance,and so the output voltage ripple is mostly independent of the ESR. The output voltage ripple is estimated to be:VRIPPLE ~= 1.4 * VIN * (fLC/fSW)^2Where VRIPPLE is the output ripple voltage, VIN is the input voltage, fLC is the resonant frequency of the LC filter, fSW is the switching frequency. In the case of tanatalum or low-ESR electrolytic capacitors, the ESRdominates the impedance at the switching frequency, and so the output ripple iscalculated as:VRIPPLE ~= ΔI * RESRWhere VRIPPLE is the output voltage ripple, ΔI is the inductor ripple current, and RESR is the equivalent series resistance of the output capacitors.Output Rectifier DiodeThe output rectifier diode supplies the currentto the inductor when the high-side switch is off. To reduce losses due to the diode forward voltage and recovery times, use a Schottky rectifier.Table 1 provides the Schottky rectifier part numbers based on the maximum input voltage and current rating.Choose a rectifier who’s maximum reverse voltage rating is greater than the maximuminput voltage, and who’s current rating isgreater than the maximum load current. Feedforward Capacitor (CFF)For output voltages greater than approximately8V, an additional capacitor is required. The compensation capacitor is typically between 100 pF and 33 nF, and is wired in parallelwith the output voltage setting resistor, R1. It provides additional stability for high output voltages, low input-output voltages, and/or very low ESR output capacitors, such as solid tantalum capacitors.September, 2006 Techcode Semiconductor LimitedThis capacitor type can be ceramic, plastic, silver mica, etc.(Because of the unstable characteristics of ceramic capacitors made with Z5U material, they are not recommended.)Note:In PCB layout.Reserved an area for CFF. Over Current Protection (OCP)The cycle by cycle current limit threshold is set between 3A and 4A. When the load current reaches the current limit threshold, the cycle by cycle current limit circuit turns off the high side switch immediately to terminate the current duty cycle. The inductor current stops rising. The cycle by cycle current limit protection directly limits inductor peak current. The average inductor current is also limited due to the limitation on peak inductor current. When the cycle by cycle current limit circuit is triggered, the output voltage drops as the duty cycle is decreasing.Thermal Management and Layout ConsiderationIn the TD1410 buck regulator circuit, high pulsing current flows through two circuit loops. The first loop starts from the input capacitors, to the VIN pin, to the VOUT pins, to the filter inductor, to the output capacitor and load, and then returns to the input capacitor through ground.Current flows in the first loop when the high side switch is on. The second loop starts from the inductor, to the output capacitors and load, to the GND pin of the TD1410, and to the VOUT pins of the TD1410. Current flows in the second loop when the low side diode is on.In PCB layout, minimizing the two loops area reduces the noise of this circuit and improves efficiency. A ground plane is recommended to connect input capacitor, output capacitor, and GND pin of the TD1410.In the TD1410 buck regulator circuit, the two major power dissipating components are theTD1410 and output inductor. The total power dissipation of converter circuit can be measured by input power minus output power.P total _loss = V IN× I IN– V O× I OThe power dissipation of inductor can be approximately calculated by output current and DCR of inductor.P inductor _loss= I O2 × R inductor× 1.1The junction to ambient temperature can be got from power dissipation in the TD1410 and thermal impedance from junction to ambient.T (jun-amb)=(P totalloss–P inductorloss)× ΘJAThe maximum junction temperature of TD1410 is 145°C, which limits the maximum load current capability. Please see the thermal de-rating curves for the maximum load current of theTD1410 under different ambient temperatures. The thermal performance of the TD1410 is trongly affected by the PCB layout. Extra care should be taken by users during the design process to nsure that the IC will operate under the recommended environmental conditions.Several layout tips are listed below for the best electric and thermal performance.1. Do not use thermal relief connection to the VIN and the GND pin. Pour a maximized copper area to the GND pin and the VIN pin to help thermal dissipation.2. Input capacitor should be connected to the VIN pin and the GND pin as close as possible.3. Make the current trace from VOUT pins to L to the GND as short as possible.4. Pour copper plane on all unused board area and connect it to stable DC nodes, like VIN, GND, or VOUT.5. Keep sensitive signal traces such as trace connecting FB pin away from the VOUT pins.September, 2006 Techcode Semiconductor LimitedPackage InformationSOP8 Package Outline DimensionsDesign Notes。

切纸机说明书 原稿

切纸机说明书 原稿

目录前言 (2)安全注意事项 (3)第一章简介 (8)一、开箱检查 (8)二、性能特点 (8)三、控制部件功能 (9)第二章基本操作与调节 (10)一、操作面板 (10)二、操作说明 (13)三、位置校正 (14)四、推纸器调节 (15)五、切刀调整 (15)六、刀条调整 (16)第三章润滑和维护保养 (17)一、润滑 (17)二、维修保养 (17)第四章一般故障与排除 (18)前言感谢您选择了智能系列切纸机。

我们将把的最优秀产品和最完善的服务提供给您。

智能系列切纸机是我公司总结原有老产品的经验,同时吸收了国内外同类产品的优点新研发的机型。

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从根本上解决了小型切纸机控制灵敏度差、使用不方便和裁切精度保持性、稳定性差等缺陷。

为了满足不同客户的需求,智能系列分为:450Z型精密切纸机、450T型精密数控切纸机、480-60A型精密切纸机、480-60V型精密数控切纸机。

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220V电源供电,可解决无动力电源的困难,完全适应中小型印刷企业及文印、办公等单位裁切纸张、书刊、图书、文件、档案等或其它非金属材料的裁切。

是您必备的裁切产品!安全注意事项为了避免发生意外事故和意外伤害,请按照相关标准允许专业操作工使用本机(禁止儿童或非专业操作人员操作、严禁将手放入压纸器下、严禁多人同时操作、严禁将磁性物品靠近本机),请您在使用和维护时务必要注意以下安全事项:电源请您按照说明正确的连接电源,机器电源应该是稳定的AC220V±10% 50Hz,如果电压过高或过低会导致机器运转不正常。

接地为了您的安全,请您必须使用接有地线的电源插座。

过载请不要在同一电源插座上连接多个电器产品,因为过载有可能会发生火灾或触电的危险。

清洁在您清洁或保养机器之前一定要先切断电源和拔出电源插头。

MMSZ4xxxT1G系列和SZMMSZ4xxxT1G系列零点电阻电源器件的商品说明书

MMSZ4xxxT1G系列和SZMMSZ4xxxT1G系列零点电阻电源器件的商品说明书

MMSZ4686T1G MMSZ4686T1G.MMSZ4xxxT1G Series, SZMMSZ4xxxT1G Series Zener Voltage Regulators 500 mW, Low I ZT SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 1.8 V to 43 V•Low Reverse Current (I ZT) − 50 m A•Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications•ESD Rating of Class 3 (>16 kV) per Human Body Model•SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free and are RoHS Compliant*Mechanical Characteristics:CASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSRating Symbol Max Units Total Power Dissipation on FR−5 Board,(Note 1) @ T L = 75°CDerated above 75°C P D5006.7mWmW/°CThermal Resistance, (Note 2) Junction−to−Ambient R q JA340°C/WThermal Resistance, (Note 2) Junction−to−Lead R q JL150°C/WJunction and Storage Temperature Range T J, T stg−55 to+150°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Cathode AnodeSee specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONSOD−123CASE 425STYLE 1Device Package Shipping†ORDERING INFORMATIONMARKING DIAGRAM†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.MMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & Reel xx= Device Code (Refer to page 3)M= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)1SZMMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelSZMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & ReelELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Symbol ParameterV Z Reverse Zener Voltage @ I ZTI ZT Reverse CurrentI R Reverse Leakage Current @ V RVR Reverse VoltageI F Forward CurrentV F Forward Voltage @ I FProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Device*DeviceMarkingZener Voltage (Note 3)Leakage CurrentV Z (Volts)@ I ZT I R @ V RMin Nom Max m A m A VoltsMMSZ4678T1G CC 1.71 1.8 1.89507.51 MMSZ4679T1G CD 1.90 2.0 2.105051 MMSZ4680T1G CE 2.09 2.2 2.315041 MMSZ4681T1G CF 2.28 2.4 2.525021 MMSZ4682T1G CH 2.565 2.7 2.8355011 MMSZ4683T1G CJ 2.85 3.0 3.15500.81 MMSZ4684T1G CK 3.13 3.3 3.47507.5 1.5 MMSZ4685T1G CM 3.42 3.6 3.78507.52 MMSZ4686T1G CN 3.70 3.9 4.105052 MMSZ4687T1G CP 4.09 4.3 4.525042 SZMMSZ4687T1G CG6 4.09 4.3 4.525042 MMSZ4688T1G CT 4.47 4.7 4.9450103 MMSZ4689T1G CU 4.85 5.1 5.3650103 MMSZ4690T1G/T3G CV 5.32 5.6 5.8850104 MMSZ4691T1G CA 5.89 6.2 6.5150105 MMSZ4692T1G CX 6.46 6.87.145010 5.1 MMSZ4693T1G CY7.137.57.885010 5.7 MMSZ4694T1G CZ7.798.28.61501 6.2 MMSZ4695T1G DC8.278.79.14501 6.6 MMSZ4696T1G DD8.659.19.56501 6.9 MMSZ4697T1G DE9.501010.505017.6 MMSZ4698T1G DF10.451111.55500.058.4 MMSZ4699T1G DH11.401212.60500.059.1 MMSZ4700T1G DJ12.351313.65500.059.8 MMSZ4701T1G DK13.301414.70500.0510.6 MMSZ4702T1G DM14.251515.75500.0511.4 MMSZ4703T1G†DN15.201616.80500.0512.1 MMSZ4704T1G DP16.151717.85500.0512.9 MMSZ4705T1G DT17.101818.90500.0513.6 MMSZ4706T1G DU18.051919.95500.0514.4 MMSZ4707T1G DV19.002021.00500.0115.2 MMSZ4708T1G DA20.902223.10500.0116.7 MMSZ4709T1G DX22.802425.20500.0118.2 MMSZ4710T1G DY23.752526.25500.0119.0 MMSZ4711T1G†EA25.652728.35500.0120.4 MMSZ4712T1G EC26.602829.40500.0121.2 MMSZ4713T1G ED28.503031.50500.0122.8 MMSZ4714T1G EE31.353334.65500.0125.0 MMSZ4715T1G EF34.203637.80500.0127.3 MMSZ4716T1G EH37.053940.95500.0129.6 MMSZ4717T1G EJ40.854345.15500.0132.6 3.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C ±1°C.*Include SZ-prefix devices where applicable.†MMSZ4703 and MMSZ4711 Not Available in 10,000/Tape & ReelTYPICAL CHARACTERISTICSV Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θV Z , NOMINAL ZENER VOLTAGE (V)Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θ100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (5C)Figure 3. Steady State Power Derating P p k, P E A K S U R G E P O W E R (W A T T S )PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge PowerP D , P O W E R D I S S I P A T I O N (W A T T S )V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener ImpedanceZ Z T , D Y N A M I C I M P E D A N C E ()ΩTYPICAL CHARACTERISTICSC , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 6. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01I Z , Z EN E R C U R R E N T (m A )V Z , ZENER VOLTAGE (V)1001010.10.01I R , L E A K A G E C U R R E N T (A )μV Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Leakage Current10001001010.10.010.0010.00010.00001I Z , Z E N E R C U R R E N T (m A )Figure 8. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 9. Zener Voltage versus Zener Current(12 V to 91 V)SOD−123CASE 425−04ISSUE GDATE 07 OCT 2009SCALE 5:1NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM MIN NOM MAXMILLIMETERSINCHESA0.94 1.17 1.350.037A10.000.050.100.000b0.510.610.710.020c1.600.150.055D 1.40 1.80E 2.54 2.69 2.840.100---3.680.140L0.253.860.0100.0460.0020.0240.0630.1060.1450.0530.0040.0280.0710.1120.152MIN NOM MAX3.56H E---------0.006------------GENERICMARKING DIAGRAM**For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT**This information is generic. Please refer to device datasheet for actual part marking. Pb−Free indicator, “G” ormicrodot “ G”, may or may not be present.XXX= Specific Device CodeM= Date CodeG= Pb−Free Package1STYLE 1:PIN 1. CATHODE2. ANODE0.910.036ǒmminchesǓSCALE 10:1------q001010°°°°(Note: Microdot may be in either location) MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.PUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************ON Semiconductor Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales RepresentativeMMSZ4686T1G MMSZ4686T1G.。

TSI说明书MMS6000

TSI说明书MMS6000

0-3-3
汽轮机安全监视装置说明书
D135D–000207CSM
通过便携/台式电脑及 MMS6910 操作工具包,可以读出配置参数、测量数据(包括顺序
分析数据,FFT 等)及监视器状态。
此外,操作工具包包括两个测量线用于测量传感器信号。通过这些线,可以将传感器 1
和 2 的信号通过监视器前面的小同轴插座连接到示波器上。
0-1-2
汽轮机安全监视装置说明书
D135D–000207CSM
0-2 电源部分 UES815
外部电源由主副两路输入,任一路工作,其余一路作备用,任何一路或两路电源故障均 有报警指示输出。外部电源经处理后进入两块 UES815 电源模板。其中任一块 UES815 故障均 有电源故障指示。请参阅 D135D-920000C 第 15,16 张;具体电路可参阅原版英文资料。
两 个 通 道 可 以 分 别 选 择 “ 振 动 频 率 ” ( Vibration velocity ) 或 “ 振 动 幅 度 ” (Vibration amplitude)操作方式。
“振动频率”方式的特性值与轴承振动频率的平方根成比例(振动强调参照 VDI2056)。校正信号的类型是电压校正模式(Vrms)。
标记 数 代号
期 标记 数 代号

1
汽轮机安全监视装置说明书
D135D–000207CSM


序号 1 2 3 4 5 6 7 8 9 10
章-节 0-1 0-2 0-3 0-4 0-5 0-6 0-7 0-8 0-9 0-10
名称 系统概述 电源部分 UES815 盖振监测模件 MMS6120 转速监测及超速控制 MMS6312 胀差及轴向位移监测模件 MMS6210 通讯单元 MMS6831 轴振模件 MMS6110 偏心监视模件 MMS6220 瞬态转速表 绝对膨胀监测器

K-9可选配件,微维克斯硬度试验机剪子订单号型号及描述说明书

K-9可选配件,微维克斯硬度试验机剪子订单号型号及描述说明书

G
steel ball 1471N(150kgf) beryllium copper, phosphor bronze
H
1/8”
588.4N(60kgf) Bearing metal
E
diameter 980.7N(100kgf)
K
steel ball 1471N(150kgf)
L
1/4”
588.4N(60kgf) Plastics, lead
50x50mm travel stage
Dimensions: 4.92x4.92”(125x125mm) Minimum reading: 0.01mm 810-012
Clamping devices (Vises)
Vise Max. opening: 1.77”(45mm) Standard for the MH series. 810-016
Indenters
Order No. 19BAA061 19BAA058 19BAA062 19BAA059 19BAA060
Type Knoop Indenter Vickers Indenter Knoop Indenter Vickers Indenter Vickers Indenter
Model H, HM Standard Series H, HM Standard Series MVK-H2, H3, HM114 MVK-H2, H3, HM114 HV, AVK-C Series
Micro-Vickers/Vickers Hardness Testing Machine
Test Blocks
Order No. 64BAA173 64BAA174 64BAA175 64BAA176 64BAA177 64BAA178 64BAA179 64BAA180 64BAA181 64BAA182 64BAA183 64BAA184 64BAA185 64BAA186 64BAA187 64BAA188 64BAA189 64BAA190 64BAA191 64BAA192 64BAA193 64BAA194 64BAA195 64BAA196 64BAA197 64BAA198 64BAA199 64BAA200 64BAA201 64BAA202 64BAA203 64BAA204 64BAA205 64BAA206 64BAA207 64BAA208 64BAA209 64BAA210 64BAA211 64BAA212 64BAA213 64BAA214 64BAA215 64BAA216 64BAA217 64BAA218 64BAA219 64BAA220

阿特克公司产品:手动电机启动器MMS系列说明书

阿特克公司产品:手动电机启动器MMS系列说明书

M a n u a l M o t o r S t a r t e r sManual Motor StartersMMS SeriesUL508 Type E E252942Standards and Certifications•UL508 (Manual Motor Controller)•UL508 (Type E self-protected Manual Motor Controller)•CSA C22.2 No.14•IEC 60947-2 & IEC 60947-4-2Features•DIN Rail and Screw Mounting •Lockable Handle in OFF position •Finger safe terminals•Class 10 thermal Overload protection •Trip test feature•Phase failure protection •Adjustable thermal release•Type F combination Manual Motor Controller (with MC-Series Contactor)•Wide range of common accessories:•Auxiliary contacts •Alarm Switch•Undervoltage/ Shunt Trip •Rotary Handle •Busbar•MC-Series Mounting Adapter Terminal Size Acceptability and TorqueWire Type ConductorsMMS-32H MMS-63H MMS-100H Solid 118-8 AWG 18-2AWG 12-2/0 AWG 218-10AWG 18-4AWG 12-1/0 AWG Stranded 118-10AWG 18-2AWG 12-2/0 AWG 218-10AWG 18-4AWG 12-1/0 AWG Flexible 118-10AWG 18-4AWG 12-2/0 AWG 218-10AWG 18-6AWG 12-1/0 AWG Torque7-22 lb-in.26-39 lb-in.35-53 lb-in.General SpecificationsMaximum Voltage600V ACShort Circuit Current Rating (SCCR)up to 65kA@480VAC Rated Frequency50/60HzMax Operating Frequency 25 operations/hourOperating Temperature -20°C (-4°F) to +60°C (140°F)Storage Temperature -50°C (-58°F) to +80°C (176°F)Degree of protection IP20Resistance to Shock 25gResistance to Vibration5 - 150HzUL508Type EM a n u a l M o t o r S t a r t e r sManual Motor StartersMMS-32H MMS-63H MMS-100HUL508 Type E E252942Drawings and other technical information can be found on page 24-25.FX...LAM...RS...RU...RUX...M a n u a l M o t o r S t a r t e r s- MMS SeriesAuxiliary ContactsPart No.Poles ConfigurationMounting FX-2022NO Front FX-1121NO/1NC Front FX-0222NC Front LX-2022NO Side LX-1121NO/1NC Side LX-0222NCSideAlarm ContactsPart No.Poles ConfigurationMounting LA-20Any Trip 2NO Side LA-11Any Trip 1NO/1NC Side LA-02Any Trip 2NC Side LAM-20Magnetic Trip 2NO Side LAM-11Magnetic Trip 1NO/1NC Side LAM-02Magnetic Trip2NCSideShunt Trips*Part No.Control Voltage50 Hz 60HzRS-28V 24VAC 28VAC RS-120V 110VAC 120VAC RS-220V 200VAC 200-220VAC RS-260V 220-230VAC 240-260VAC RS-277V 240VAC 277VAC RS-440V 380-400VAC 440-460VAC RS-480V 415-440VAC 460-480VAC *cannot be used with RU or RUX Undervoltage Trips**Part No.Control Voltage50 Hz 60HzRU-28V 24VAC 28VAC RU-120V 110VAC 120VAC RU-220V 200VAC 200-220VAC RU-260V 220-230VAC 240-260VAC RU-277V 240VAC 277VAC RU-440V 380-400VAC 440-460VAC RU-480V 415-440VAC 460-480VAC **cannot be used with RS or RUX Undervoltage Trips with Switches***includes 2NO Auxiliary Contacts Part No.Control Voltage50 Hz 60HzRUX-28V 24VAC 28VAC RUX-120V 110VAC 120VAC RUX-220V 200VAC 200-220VAC RUX-260V 220-230VAC 240-260VAC RUX-277V 240VAC 277VAC RUX-440V 380-400VAC 440-460VAC RUX-480V 415-440VAC 460-480VAC ***cannot be used with RS or RUUL508 Type E E252942Dial CoverM a n u a l M o t o r S t a r t e r sExtended Handles- Lockable in ON/ OFF position - IP65 protection Part No.MMS-Type Shaft LengthMEH-32-115MMS-32H 115mm (4.53in.)MEH-32-315MMS-32H 315mm (12.4in.)MEH-63-115MMS-63H 115mm (4.53in.)MEH-63-315MMS-63H 315mm (12.4in.)MEH-100-115MMS-100H 115mm (4.53in.)MEH-100-315MMS-100H315mm (12.4in.)BusbarsPart No.MMS Type No, MMSRated CurrentMMS-32H 263A MMS-32H 363A MMS-63H 2108A MMS-63H3108ADirect Adapters and Mounting Units- Connect MMS directly with Metasol or Mini Contactor- Type F combination Motor Controllers consisting of Type E MMS device with MC Series contactor Part No.MMS Type Combined Contactor Type Mounting Unit DA-16HA MMS-32H Mini Contactor GMC-6M…12M AC MU-45DA-16HD MMS-32H Mini Contactor GMC-6M…12M AC MU-45DA-22HA MMS-32H MC-9B…22B AC MU-45DA-22HD MMS-32H MC-9B…22B DC MU-45DA-32HA MMS-32H MC-32A…40A AC MU-45DA-32HD MMS-32H MC-32A…40A DC MU-45MMS-63H MC-50A…65A AC MU-55MMS-63H MC-50A…65A DC MU-55MMS-100H MC-75A…100A AC MU-70MMS-100H MC-75A…100A DC MU-70Insulation CapPart No.Busbar Type PBPC-32PB-32x PBPC-63PB-63xInsulated Enclosure- IP65 protection Part No.MMS Type MKMS-32HDial Coverto protect set valuefrom unintended operation (for all types)Part No.DIAL COVERInsulation Barrierto increase creepage and clearance distance (for MMS-100H only)Part No.IB100UL508 Type E E2529421.0110010P e a k c u r r e n t I p (k A )010111.00.010.11101001A1.6A2.5A6A 8A 10A 13A 17A22A 26A 32A 4AIcc rms(A)P e a k c u r r e n t I p (k A )M a n u a l M o t o r S t a r t e r sMMS SeriesMMS-32HMMS-63H, MMS-100HMMS-32HTrip Curves Thermal Short Circuit Limit MMS-63H1) Side auxiliary switch 2) Side magnetic trip alarm switch3) Side shunt release or Side undervoltage release 4) Front auxiliary switch 5) Handle lock in OFF position( 5 )6) Push-in Lugs for screw mounting7) 35 standard mounting rail acc. to EN 50 022[mm ]0.79 lb.1) Side auxiliary switch 2) Side magnetic trip alarm switch3) Side shunt release or Side undervoltage release 4) Front auxiliary switch 5) Handle lock in OFF position( 5 )6) 35 standard mounting rail acc. to EN 50 0222.2 lb.1) Side auxiliary switch 2) Side magnetic trip alarm switch3) Side shunt release or Side undervoltage release 4) Front auxiliary switch 5) Handle lock in OFF position( 5 )6) 35 standard mounting rail acc. to EN 50 0227) 75 standard mounting rail acc. to EN 50 0238) 4 hexagon socket screw4.85 lb.M a n u a l M o t o r S t a r t e r sDimensions in mm (to convert to inches multiply by 0.03937).。

ICS4_6x系列防爆称重方案快速使用指南.pdf_1701914538.2239728说明书

ICS4_6x系列防爆称重方案快速使用指南.pdf_1701914538.2239728说明书

5 Maintenance
14
5.1 Cleaning .............................................................................................................................................................................................................................. 14
4.6 Taring ........................................................................................................................ 10
4.7 Printing or transferring data........................................................................................... 10
ICS4_6x-series
English Quick Guide ICS4_6x-series Explosion-protected weighing solutions 中文 快速使用指南 ICS4_6x 系列 防爆称重方案
ICS466x ICS466x
ICS426x
en
Congratulations on choosing the quality and precision of METTLER TOLEDO. Proper use of your new equipment according to this Manual and regular calibration and maintenance by our factory-trained service team ensures dependable and accurate operation, protecting your investment. Contact us about a service agreement tailored to your needs and budget. Further information is available at /service There are several important ways to ensure you maximize the performance of your investment: 1 Register your product: We invite you to register your product at

麦考特磁性测厚仪说明书

麦考特磁性测厚仪说明书

Mikrotest磁性测厚仪操作手册德国EPK公司制造中国总代理:上海耀壮检测仪器设备有限公司地址:上海市松江区广富林路697号昂立大厦1108室服务电话:021-******** Mikrotest6型Mikrotest7型Mikrotest磁性测厚仪符合下列国际标准:DIN50981,50982;ASTM8499,E367,D1186,B530,G12;BS5411;DIN EN ISO 2178,2361欢迎您选购EPK 公司的Mikrotest 麦考特磁吸力式测厚仪。

Mikrotest 所有型号产品技术数据如下表(1)所示。

使用前请仔细阅读本说明书。

请参照原英文图示照片与技术说明,将有助于理解本说明书的内容。

表一型号测量范围读值精度±最小测量区直径mm 基体最小厚度mm 适用场合Mikrotest 6G 0-100um 1um 或5%读值20mm 0.5钢、铁基体上电镀层、漆、搪瓷、塑料、橡胶层等Mikrotest 6F 0-1000um 3um 或5%读值30mm 0.5Mikrotest 6S30.2-3mm 5%读值30mm 1.0Mikrotest 6S50.5-5mm 5%读值50mm 1.0Mikrotest 6S10 2.5-10mm 5%读值50mm 2.0Mikrotest 6NiFe500-50um 2um 或8%读值20mm 0.5钢铁基体上电镀镍Mikrotest 7G 0-300um 2um 或3%读值20mm 0.5钢、铁基体上电镀层、漆、搪瓷、塑料、橡胶层等Mikrotest 7F 0-1500um 5um 或3%读值30mm 0.5Mikrotest 7S50.5-5mm 4%读值50mm 1.0Mikrotest 7S153.0-15mm4%读值100mm7.0注:表中钢铁基体均指未硬化钢铁(C15到C45)一、应用型号不同的Mikrotest 麦考特测厚仪,可无损伤地测量:a 、铁上的所有非磁性涂层。

MMST4401 贴片三极管 SOT-323三极管封装MMST4401规格参数

MMST4401 贴片三极管 SOT-323三极管封装MMST4401规格参数

A,Oct,2010JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTDSOT-323 Plastic-Encapsulate TransistorsMMST4401 TRANSISTOR (NPN)FEATURES● Complementary to MMST4403● Small Surface Mount PackageMARKING: K3XMAXIMUM RATINGS (T a =25℃ unless otherwise noted) SymbolParameter Value Unit V CBOCollector-Base Voltage 60 V V CEOCollector-Emitter Voltage 40 V V EBOEmitter-Base Voltage 6 V I CCollector Current 600 mA P CCollector Power Dissipation 200 mW R ΘJAThermal Resistance From Junction To Ambient 625 ℃/W T jJunction Temperature 150 ℃ T stg Storage Temperature -55~+150 ℃ ELECTRICAL CHARACTERISTICS (Ta =25℃ unless otherwise specified) ParameterSymbol Test conditions Min Typ MaxUnit Collector-base breakdown voltageV (BR)CBO I C =100µA, I E =0 60 V Collector-emitter breakdown voltageV (BR)CEO I C =1mA, I B =0 40 V Emitter-base breakdown voltageV (BR)EBO I E =100µA, I C =0 6 V Collector cut-off currentI CBO V CB =35V, I E =0 100 nA Collector cut-off current I CEO V CE =35V, I B =0500 nA V CE =1V, I C =100µA20 V CE =1V, I C =1mA40 V CE =1V, I C =10mA80 V CE =1V, I C =150mA100 300 DC current gain h FE V CE =2V, I C =500mA40 I C =150mA, I B =15mA 0.4 V Collector-emitter saturation voltageV CE(sat) I C =500mA, I B =50mA 0.75 V I C =150mA, I B =15mA 0.75 0.95 V Base-emitter saturation voltageV BE(sat) I C =500mA, I B =50mA 1.2 V Transition frequencyf T V CE =10V,I C =20mA , f=100MHz 250 MHz Collector output capacitance C ob V CB =5V, I E =0, f=1MHz 6.5 pF 【南京南山半导体有限公司 — 长电三极管选型资料】 【南京南山半导体有限公司 — 长电三极管选型资料】The bottom gasketThe top gasket3000×1 PCS 3000×15 PCS Label on the Reel Label on the Inner Box Label on the Outer Box QA Label Seal the boxwith the tape Seal the boxwith the tape Stamp “EMPTY”on the empty box Inner Box: 210mm ×208mm ×203m m Outer Box: 440mm ×440mm ×230mm。

OMRON 电子体温计MC-440 使用说明书

OMRON 电子体温计MC-440 使用说明书

开始准备
装入电池 ...................................................11 设置日期和时间 ........................................13 设置闹钟提醒及音量 .................................17
[
(取消)]按钮
从各种设置模式退出时,或取 消设置内容时,按此按钮。
[
灯光(背光灯)]按钮
[
(确定)]按钮
确定设置内容时,按此按钮。
按此按钮后,显示屏会 点亮大约 10 秒钟。
8
This Manual: /file/11252
体温计的使用方法
开始准备
表示本体的环保使用期限为 10 年 , 并且可以回收利用 , 不应随意丢弃 , 不 包括干电池。
符号是表示注意(包括警告和危险) 。
1
This Manual: /file/11252
警告
对测量结果进行自我判断和治疗很危险。请遵照医生的指导。 • 自我判断可能导致病情恶化。 请将本体放在儿童接触不到的地方。同时,请避免让儿童单独使用 本体。 • 否则可能会导致儿童受伤。 请将电池放在儿童接触不到的地方。 • 否则可能会导致儿童吞食。如不慎将电池吞食,请立即与医生联系。 万一电池中的电解液不慎进入眼中,请立即用大量清水冲洗。 • 可能会造成失明等伤害,请立即到医院接受治疗。 本体不防水,请避免水等液体进入本体内部。 • 可能导致测量出现误差或引起机器故障。 请不要多人使用。 • 可能会引起病原菌感染。 本产品为口腔专用体温计,请不要用于口腔以外的其它部位测量体温。 • 否则不能正确测量,并有受伤的危险。
5
This Manual: /file/11252

MS-160标准包装内容说明说明书

MS-160标准包装内容说明说明书
• Cleaning: — For microscope body, unplug power and use a soft slightly damp cloth to clean dust or dirt. — For optical surfaces, such as the eyepiece lens or objective lens, use a slightly damp microfiber cloth or Carson’s Lens Cleaners to gently remove dust or debris.
cated under the diaphragm) outwards, place the filter flat inside the top part of the holder and then fully rotate the filter holder back into position.
INSTRUCTION MANUAL | MS-160
Standard Included Accessories: 10x and 16x Wide Field Eyepiece, Dust Cover, Blue Color Filter, Spare LED and Fuse
Eyepieces
Binocular Head
Care & Maintenance:
• Please take care when using our microscope. Try to avoid brinபைடு நூலகம்ing your microscope into contact with any dirt, debris, dust or moisture. Place the dust cover the microscope when not in use.

快思聪产品品技术参数描述大全

快思聪产品品技术参数描述大全

快思聪产品技术参数描述触摸屏系列 (3)TPS-4L (3)TPS-6L (4)TPSI-6X (4)CT-1000的技术参数: (4)STI-1550C单向无线触摸屏: (4)CT-1550C有线触摸屏: (5)STI-1700C单向无线触摸屏: (5)STXI-1700CXP双向无线触摸屏: (5)STXI-1700CXP双向无线触摸屏: (5)TPS-1700C触摸屏: (6)TPS-2000L: (6)TPS-3000L: (6)TPMC-8L的技术参数: (7)TPS-3000: (7)TPS-4000的技术参数: (7)TPS-4000L的技术参数: (8)MiniTouch:MT-1000C (8)MiniTouch:ML-500无线紧凑式射频LCD远程遥控器 (8)MiniTouch:ML-600无线紧凑式射频LCD远程遥控器 (9)MLX-2:MiniLCD2路RF掌上遥控 (9)WPR-48 具有防水性能的遥控器 (9)TPS-12 (9)TPS-15 (10)TPS-17 (10)TPMC-CH-IMC 界面模块 (11)TPS-12G-QM (11)TPS-15-G-QM (11)TPMC-4XG Isys i/O™ WiFi 触摸屏: (12)TPMC-8X Isys i/O™ WiFi 触摸屏 (12)TPMC-8X-DS技术参数: (13)TPMC-15-QM Isys i/O™ 15” 触摸屏媒体中心 (13)TPMC-17-QM Isys i/O™ 17”触摸屏媒体中心 (15)控制主机系列 (16)MC2E的技术参数: (17)MC2W的技术参数: (17)CP2的技术参数: (17)CP2E的技术参数: (17)A V2的技术参数: (18)PRO2的技术参数: (18)MP2的技术参数: (18)MP2E的技术参数: (19)C2N-MMS的技术参数: (19)CNXRMC: (19)CNXRMCLV: (19)C2N-DVP4DI的技术参数: (20)DVPHD-PRO的技术参数: (20)MPS-100的技术参数: (21)MPS-300技术参数: (23)PAC2的技术参数: (24)PAC2M - Pro Mini 控制主机技术参数 (24)AADSI的技术参数: (25)AESI的技术参数: (25)AAE音频扩展器技术参数: (25)音频(AAS) 技术参数: (25)TPS-ENET的技术参数: (26)TPS-VID-1的技术参数: (26)TPS-VID-2: (26)TPS-XVGA的技术参数: (26)CNXRY-16的技术参数: (26)C2IR-8的技术参数: (27)C2COM-2的技术参数: (27)C2COM-3的技术参数: (27)C2ENET-1的技术参数: (27)C2ENET-2的技术参数: (27)C2VEQ-4 (27)常用扩展模块 (28)TPS-XTX-RF的技术参数: (28)CEN-TIA电话接口模块技术参数: (28)C2N-VEQ-4 (28)STI-COM的技术参数: (29)CNECI-4A的技术参数: (29)CLI-220N-4的技术参数: (29)CHAO-12模拟量控制模块 (29)SP-4的技术参数: (29)C2N-CAMIDSPT数字伺服式摄像机电动云台 (30)C2N-CAMIDJ操纵杆控制器 (31)CNRFGW A无线接收器 (31)CNRFGW-418无线接收器 (31)STRFGW A双向接收器 (32)TPS-RFGWXI (32)CEN-RFGW-ZB:ZigBee网关 (32)CENI-HPRFGW:高性能电源RF网关 (32)CLSI-C6A的技术参数: (33)C2N-SSC-2 (33)C2N-SDC-DC (33)CNX-B2...B12: .. (33)C2N-CB的技术参数: (34)APAD的技术参数: (34)CEN-IDOC Apple iPod®界面技术参数 (34)MediaManager (34)QM-RMC (35)QM-WMC: 墙面媒体终端 (35)QM-WMIC:墙面媒体终端 (36)QM-RMCRX: 主处理器 (36)QM-FTCC: 弹出式计算机界面 (36)QM-FTSC: 上翻式存储中心 (37)QM-FTDC:上翻式数据中心 (37)QM-MD8x8: QM切换矩阵 (37)QM-MD7x2: 快思聪矩阵 (38)QM-MD5X1 (38)QM-TX (39)QM-RX: QuickMedia 接收器 (39)QM-FTCC-TPS (39)QM-RX1-3G: (40)QM-TX2-MC (40)QM-TX2-CC (40)QM-WMC-CC (41)QM-WCC-2 (41)QM-WCC-1 (41)网络解决方案 (41)CEN-W AP-ABG-1G:802.11a/b/g无线接入点 (42)CEN-SW-POE-5: 5埠PoE切换器 (42)PW-4803RU:PoE电源供应器 (42)ADAD六路数字音频服务器 (42)快思聪优惠套装解决方案 (43)TPMC-10 Isys i/O 10” WiFi 平板式触摸屏 (44)QM-AMP3x80MM: 块思聪功放 (45)CNPI-48 48键控制面板接口 (46)IRP2 红外线发射器探头 (47)触摸屏系列TPS-4L● 3.6 英寸有源矩阵彩色触摸屏●32 位Coldfire® 处理器●320x240 象素●8 MB 闪存,16M DRAM●16 位Isys™ 图像引擎●10个白色背光按键●可播放W A V音频文件●紧凑的、流行的嵌墙式触摸屏●可以通过以太网和Cresnet与主机通讯TPS-6L●紧凑的、流行的嵌墙式触摸屏●可以通过以太网和Cresnet与主机通讯●12个白色背光按键,并可刻字● 5.7 英寸有源矩阵彩色触摸屏●640x480 象素●16 位Isys™ 图像引擎●可播放W A V音频文件●支持PNG 和半透明化●支持动态图像,cover art, Adagio AS, Request, Windows Media Center.●内置麦克风●可伸缩视频窗口,支持视频显示●可选颜色杏仁、黑色、白色TPSI-6X●用于掌上和桌面式的轻便型轮廓设计● 5.7寸有源矩阵彩色触摸屏显示●16位isys图形●640*480分辨率●高速2.4GHz RF 无线技术●内置单向IR无线功能●有线以太网以及快思聪Home CAT5视频连接CT-1000的技术参数:● 3.8”墙装式彩色触摸屏;●256色;●10个常用指令快捷按钮;●可自由编程;●独家感光显示,可自行调节其亮度已适应周边环境;●可储存及重播W A V声音档案;STI-1550C单向无线触摸屏:● 5.7“彩色单向无线触摸屏;●320X240分辨率;●256色;●1M闪存;●可自由编程;●传输距离:300英尺(约100米);●包含可充电电池STI-BTPN、充电座STI-DSN;●无线接收器为CNRFGWA;CT-1550C有线触摸屏:●STI-1550C的有线版本;● 5.7“彩色触摸屏;●320X240分辨率;●256色;●1M闪存;●可自由编程;STI-1700C单向无线触摸屏:● 5.7“彩色单向无线触摸屏;●320X240分辨率;●64,000种色彩;●4M flash存储器,8M SDRAM内存●可自由编程;●10个可定义功能的快捷按键;●传输距离:300英尺(约100米);●包含可充电电池STI-BTPN、充电座STI-DSN;●无线接收器为CNRFGWA;STXI-1700CXP双向无线触摸屏:● 5.7“彩色双向无线触摸屏;●320X240分辨率;●64,000种色彩;●4M flash存储器,8M SDRAM内存●可自由编程;●10个可定义功能的快捷按键;●传输距离:300英尺(约100米);●包含可充电电池STI-BTPN、充电座STI-DSN;●无线接收器为STRFGWX;STXI-1700CXP双向无线触摸屏:● 5.7“彩色双向无线触摸屏;● 2.4G工作频率,WiFi 友好●320X240分辨率;●64,000种色彩;●4M flash存储器,8M SDRAM内存●可自由编程;●10个可定义功能的快捷按键;●传输距离:100-300英尺(约30-60米);●包含可充电电池STI-BTPN、充电座STI-DSN;●无线接收器为TPS-RFGWX;TPS-1700C触摸屏:● 5.7“彩色触摸屏;●320X240分辨率;●64,000种色彩;●4M flash存储器,8M SDRAM内存●可自由编程;●10个可定义功能的快捷按键;TPS-2000L:●5“彩色触摸屏;●320X234分辨率;●64,000种色彩;●32 MIPS Coldfire® 处理器●2M flash与8M DRAM内存;●可自由编程;●10个可定义功能的快捷按键;●平衡/非平衡视频输入●可存储播放W A V文件TPS-3000L:● 6.4“彩色挂墙式触摸屏;●640X480分辨率;●64,000种色彩;●可自由编程;●5个可定义功能的快捷按键;●8M flash,8M DRAM 存储器●1路视频输入显示;●内建麦克风;立体声扬声器●支持W A V文件格式;●内置控制RS-232 接口;TPMC-8L的技术参数:●8.4寸有源矩阵彩色触摸屏●800*600的分辨率●16位isys i/o图形●动态图形功能●DNav动态菜单对象●支持windows sideshow●内置网站浏览,流媒体,电子邮件,VOIP和远程计算机控制功能●多格式流动视频和音频●平衡音频输出●生物指纹扫描仪●16个可选按钮●背光灯雕刻可选●自动调光感应●WA V文件音频反馈功能●以太网通信●连接usb键盘和鼠标●墙面,讲桌和白色可选●有杏色,黑色和白色可选TPS-3000:● 6.4“彩色触摸屏;●640X480分辨率;●64,000种色彩;●可自由编程;●8M flash,8M DRAM 存储器●1路视频输入显示;●内建麦克风;立体声扬声器●支持W A V文件格式;●内置控制RS-232 接口;TPS-4000的技术参数:●10.4” 有源矩阵显示●16-Bit 彩色LCD●640x480 分辨率●Isys® 图形处理器: Synapse Rendering, etc.●8M flash,8M DRAM 存储器●可用于斜坡式讲台●一路视频输入,自动探测复合视频/S-Video格式●可调整的视频窗口或满屏显示●内嵌麦克风/扬声器(半双工,可用于对讲)●RS-232 端口,用来直接连接PCTPS-4000L的技术参数:●嵌墙式安装版本●10.4” 有源矩阵显示●16-Bit 彩色LCD●640x480 分辨率●Isys® 图形处理器: Synapse Rendering, etc.●8M flash,8M DRAM 存储器●一路视频输入,自动探测复合视频/S-Video格式●可调整的视频窗口或满屏显示●内嵌麦克风/扬声器(半双工,可用于对讲)●5个快捷按键,可编程MiniTouch:MT-1000C● 3.8”无线彩色触摸屏;●13个快捷按钮;可自由编程;●240X320分辨率;●16K色彩,高对比,可以显示3D效果●传输距离:100英尺(约30米);●无线接收器为CNRFGWA-418;●使用锂电池●配有充电底座MiniTouch:ML-500无线紧凑式射频LCD远程遥控器● 1.4“ x 2.1” LCD 显示器●27 个可编程按钮●导航轮式设计实现上、下、左、右,以及确认功能。

使用说明手册

使用说明手册
修人员使用。 该手册涉及了 XMT- 140 产品的维护,安 装,线 路,功能和正确 的运行程序。 在运行 XMT- 140产品时请将该手册置于工作现场。使用该产品 时,您应该按照手册中所提供的指导去做 。
关于安全 ,对设备或设施的潜在损坏和附加说明的问题 ,以下的栏目中 将会有所说明 :
!警 告
m 操作要十分小心 ,警惕会引起人身伤亡的危险情况 。
N: 无报警 1:上限报警 2:下限报警
N: 无报警 1:上限报警 2:下限报警
N: 无 W :有
馈 配 件:
X M T-140 型仪表 1台
产品说明手册
1册
安装夹具
1套
通讯
N: 无 S:R S485 R:RS232C
注:涉及任何有关产品 , 附件及相关细节的问题请与我们或代理 商联系 。
l XMT-1 4 0A型仪表提供了一 个作为热交换的通风孔,注意防止金 属或其他外界物质阻塞通风孔,否则可能会导致产品产生诸多问 题甚至可能导致起火 。不要阻塞通风孔或让灰尘之类的东西粘到 通 风 孔 上,任 何 温 度 的 增 加 或 绝 热 的 失 效 都 可 能 导 致 产 品 寿 命 的 缩短或产生许多其它问题。
l 关于安装仪表之间的空间大小,请参阅第 3 页2 -4.外部尺寸及开 孔尺寸 。值得注意的是重复测试电压,噪 音,脉冲等可能会导致 仪 器 损 坏。
目录
1. 序言 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1-1 . 使用前检查 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1-2. 产品质量保证 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1-3 . 使用警告 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
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Transistors
Rev.B 1/3
NPN Medium Power Transistor (Switching)
SST4401 / MMST4401
z Features
1) BV CEO >40V (I C =1mA)
2) Complements the SST4403 / MMST4403.
z Package, marking, and packaging specifications
Part No.Packaging type Marking Code
Basic ordering unit (pieces)
SST4401SST3R2X T1163000
MMST4401SMT3R2X T1463000
z Absolute maximum ratings (T a=25°C)
Parameter
Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current
Junction temperature
Storage temperature
Symbol V CBO V CEO V EBO I C
Tj
Tstg Limits 604060.6150
−55 to +150
Unit V V V A Collector power dissipation
P C
0.2
0.35
W W ˚C ˚C
∗ Mounted on a 7 5 0.6mm CERAMIC SUBSTRATE
+
+
z Dimensions (Unit : mm)
z Electrical characteristics (T a=25°C)
Parameter
Symbol Min.Typ.Max.Unit Conditions
Collector-base breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector cutoff current Emitter cutoff current
BV CBO BV CEO BV EBO I CBO I EBO 60406−−−−−−−−−−0.10.1V V V µA µA I C =100µA I C =1mA I E =100µA V CB =35V V EB =5V
−− 1.2Base-emitter saturation voltage
V BE(sat)
−−0.95V
−−0.75I C /I B =500mA/50mA Collector-emitter saturation voltage V CE(sat)−−0.4V I C /I B =150mA/15mA I C /I B =500mA/50mA I C /I B =150mA/15mA 40
−−100−300DC current transfer ratio
h FE
80−−−40
−−20−−V CE =1V, I C =0.1mA V CE =1V, I C =1mA V CE =1V, I C =10mA V CE =1V, I C =150mA V CE =2V, I C =500mA
Transition frequency
Collector output capacitance f T Cob 250−−−−6.5MHz pF V CE =10V, I E = −20mA, f =100MHz V CB =10V, f =100kHz Emitter input capacitance Cib −−30pF V EB =0.5V, f =100kHz
Delay time td −−15ns V CC =30V, V EB(OFF)=2V, I C =150mA, I B1=15mA V CC =30V, V EB(OFF)=2V, I C =150mA, I B1=15mA Rise time tr −−20ns Storage time tstg −−225ns V CC =30V, I C =150mA, I B1=-I B2=15mA V CC =30V, I C =150mA, I B1=-I B2=15mA
Fall time
tf


30
ns
Transistors
Rev.B 2/3
z Electrical characteristic curves
C O L L E C T O R C U R R E N T : I c (m A )
COLLECTOR-EMITTER VOLTAGE : V CE (V)
Fig.1 Grounded emitter output characteristics
D C C U R R
E N T G A I N : h
F E
COLLECTOR CURRENT : Ic(mA)
Fig.3 DC current gain vs. collector current(Ι)
C O L L E C T O R E M I T T E R S A T U R A T I O N V O L T A G E : V C E (s a t )(V )
COLLECTOR CURRENT : Ic(mA)
Fig.2 Collector-emitter saturation voltage vs. collector current
D C C U R R
E N T G A I N : h
F E
COLLECTOR CURRENT : Ic(mA)
Fig.4 DC current gain vs. collector current(ΙΙ)
A C C U R R E N T G A I N : h F E
COLLECTOR CURRENT : Ic(mA)
Fig.5 AC current gain vs. collector current
B A S E E M I T T E R S A T U R A T I O N V O L T A G E : V B E (s a t )(V )
COLLECTOR CURRENT : Ic (mA)
Fig.6 Base-emitter saturation
voltage vs. collector current
Transistors
Rev.B 3/3
B A S E E M I T T E R V O L T A G E : V B E (O N )(V )
COLLECTOR CURRENT : Ic(mA)
Fig.7 Grounded emitter propagation characteristics
T U R N O N T I M E : t o n (n s )
COLLECTOR CURRENT : Ic(mA)
Fig.8 Turn-on time vs. collector current
R I S E T I M E : t r (n s )
COLLECTOR CURRENT : Ic (mA)
Fig.9 Rise time vs. collector current
S T O R A G E T I M E : t s (n s )
COLLECTOR CURRENT : Ic (mA)
Fig.10 Storage time vs. collector current
F A L L T I M E : t f (n s )
COLLECTOR CURRENT : Ic (mA)
Fig.11 Fall time vs. collector current
C A P A C I T A N C E (p F )
REVERSE BIAS VOLTAGE (V)
Fig.12 Input / output capacitance vs. voltage
C O L L E C T O R -E M I T T E R V O L T A G E : V C E (V )
COLLECTOR CURRENT : Ic (mA)
Fig.13 Gain bandwidth product
C U R R E N T G A I N -B A N
D W I D T H P R O D U C T (M H z )
COLLECTOR CURRENT : Ic (mA)
Fig.14 Gain bandwidth product vs. collector current
Appendix1-Rev2.0
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Appendix
分销商库存信息:
ROHM
MMST4401T146SST4401T116。

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