CS8122_ch_v1.1

合集下载

芯海科技 CS1256 芯片使用者手册说明书

CS1256芯片用户手册带24bits ADC和BIM的高性能REV 1.2版本历史目录版本历史 (2)目录 (3)图清单 (5)表清单 (6)1简介 (7)主要特性 (7)应用场合 (7)功能说明 (8)极限值 (8)电气特性 (9)可靠性指标 (10)产品型号及引脚 (10)典型应用电路 (11)2功能寄存器说明 (12)功能寄存器列表 (12)功能寄存器说明 (12)2.2.1SYS—系统配置寄存器(地址00H) (12)2.2.2ADC0— ADC配置寄存器(地址01H) (13)2.2.3ADC1— ADC配置寄存器1(地址02H) (13)2.2.4ADC3— ADC配置寄存器3(地址04H) (14)2.2.5ADC4— ADC配置寄存器4(地址05H) (14)2.2.6ADC5— ADC配置寄存器5(地址06H) (15)2.2.7BIM0— BIM配置寄存器0(地址07H) (15)2.2.8BIM1— BIM配置寄存器(地址08H) (16)2.2.9ADO— ADC转换数据寄存器(地址09H) (16)2.2.10ADS— ADC转换数据读取标准寄存器(地址0AH) (16)3功能描述 (17)输入选择 (17)PGA和ADC (17)数字滤波器 (18)3.3.1频率响应 (18)3.3.2建立时间 (18)人体阻抗测量 (19)3.4.1正弦信号发生器 (20)3.4.2激励电极及测量电极 (21)3.4.3整流 (21)3.4.4阻抗校准 (21)参考电压源 (22)内部时钟源 (22)测量模式及其切换 (22)多种工作模式 (22)复位和掉电 (23)4转换有效位 (24)5典型特性 (25)LDO典型特性 (25)内部时钟典型特性 (25)BIM典型特性 (26)6三线串行通讯接口 (28)读时序 (28)写时序 (29)7封装 (31)8包装材料信息 (32)9产品丝印图说明 (33)图清单图 1-1 CS1256原理框图 (8)图 1-2 CS1256引脚图 (10)图 1-3 CS1256典型应用电路 (11)图 3-1模拟输入结构图 (17)图 3-2 PGA和ADC结构图 (17)图 3-3 COMB滤波器的频率响应特性(Fs=331Hz，DR=10Hz，3阶COMB） (18)图 3-4 COMB建立过程 (19)图 3-5 BIM模块结构图 (20)图 3-6 CS1256低功耗工作示意图 (23)图 5-1 LDO全电压全温度范围的典型特性(LDOS[1:0]=00，负载1mA) (25)图 5-2内部时钟全电压全温度范围的典型特性 (25)图 5-3 FWR模式下220欧姆纯电阻网络的测试结果 (26)图 5-4 FWR模式下510欧姆纯电阻网络的测试结果 (26)图 5-5 FWR模式下1958欧姆纯电阻网络的测试结果 (27)图 6-1读操作时序1(读AD值) (29)图 6-2读操作时序2(除AD值之外的寄存器) (29)图 6-3写操作时序 (29)图 7-1 芯片封装尺寸信息 (31)图 8-1 SOP16料管尺寸 (32)图 9-1 产品丝印图 (33)表清单表 1-1 CS1256 极限值 (8)表 1-2 CS1256电气特性 (9)表 1-3 CS1256引脚说明 (11)表 2-1功能寄存器列表 (12)表 2-2 SYS寄存器说明 (12)表 2-3 ADC0寄存器说明 (13)表 2-4 ADC1寄存器说明 (13)表 2-5 ADC3寄存器说明 (14)表 2-6 ADC4寄存器说明 (14)表 2-7 ADC5寄存器说明 (15)表 2-8 BIM0寄存器说明 (15)表 2-9 BIM1寄存器说明 (16)表 2-10 ADO寄存器说明 (16)表 2-11 ADO寄存器说明 (16)表 4-1 ADC信号链不同配置下的有效位(ENOB) (24)表 6-1串口通讯命令列表 (28)表 6-2 三线串行通讯接口时序表 (30)1简介主要特性✧BIM•支持4电极测量•支持5K/10K/25K/50K/100K/250KHz多档频率测量•支持阻抗绝对值和相角测量✧ADC•24-bit分辨率•输出速率10~1280Hz 8档可选✧ADC有效位• 2.35V参考、40Hz速率、128倍增益下19.5bits有效位✧LDO及内部参考电压•自带LDO，输出2.35/2.45/2.8/3.0V可选✧支持高性能、普通、低功耗、休眠模式✧支持电压测量、BIM测量及手动测量模式，可通过单命令切换✧低漂移片上时钟✧三线串行通讯应用场合✧人体阻抗分析✧交流测脂功能说明CS1256原理框图如图1-1所示。

CS1242_Datasheet_cn

深圳市芯海科技有限公司
2 -28
CS1242 用户手册
保密文档
图列表
图 1 CS1242 原理框图.......................................................................................................................... 5 图 2 CS1242 管脚图.............................................................................................................................. 7 图 3 CS1242 时序图............................................................................................................................ 11 图 4 多路输入选择原理框图 ............................................................................................................. 13 图 5 外部晶振连接图 ......................................................................................................................... 15
3 CS1242 功能模块描述 ................................................................................................................. 13

莫加 MPC-2121 系列 12英寸无风扇车辆面板计算机商品介绍说明书

MPC-2121Series12-inch industrial fanless panel computers with EN50155compliance for the railway marketFeatures and Benefits•12-inch panel computer•Intel Atom®processor E38451.91GHz•1000-nit sunlight-readable LCD•-40to70°C wide-temperature design,no fan or heater•EN50155:2017CompliantCertificationsIntroductionThe MPC-212112-inch panel computers with E3800Series Intel Atom®processor deliver a reliable,durable,and versatile platform for use in industrial environments.All interfaces come with IP66-rated M12connectors to provide anti-vibration and waterproof connections.With two software-selectable RS-232/422/485serial ports and two Ethernet ports,the MPC-2121panel computers support a wide variety of serial interfaces as well as high-speed IT communications,all with native network redundancy.The MPC-2121Series panel computers are designed with a wide,-40to70°C temperature range,and come with a fanless,streamlined enclosure designed for highly efficient heat dissipation,making this one of the most reliable industrial platforms available for vibration prone,harsh,hot, outdoor environments.The MPC-2121also features a1000-nit LCD panel offering a sunlight readable,projected-capacitive,multi-touch screen, providing an excellent user experience.AppearanceSpecificationsComputerCPU Intel Atom®Processor E3845(2M Cache,1.91GHz)Graphics Controller Intel®HD GraphicsSystem Memory Pre-installed4(8GB Max.)GB DDR3LSystem Memory Slot SODIMM DDR3/DDR3L slot x1Pre-installed OS MPC-2121-E4-LB-CT-T-W7E/MPC-2101-E4-CT-T-W7E:Windows Embedded Standard7(WS7P)64-bit pre-installedMPC-2121-E4-LB-CT-T-LX/MPC-2121-E4-CT-T-LX:Linux9pre-installedSupported OS Windows10Pro64-bitWindows10Embedded IoT Ent2019LTSC64-bitWindows10Embedded IoT Ent2016LTSBWindows7Pro for Embedded SystemsWindows Embedded Standard7(WS7P)64-bitLinux Debian9Expansion Slots Mini PCIeStorage Slot CFast slot x1SD slots x1,SD3.0(SDHC/SDXC)socketStorage Pre-installed MPC-2121-E4-LB-CT-T-W7E/MPC-2121-E4-CT-T-W7E:32GB CFast CardMPC-2121-E4-LB-CT-T-LX/MPC-2121-E4-CT-T-LX:32GB CFast CardComputer InterfaceEthernet Ports Auto-sensing10/100Mbps ports(M12D-coded4P)x2Serial Ports RS-232/422/485ports x1(M12A-code12P)USB2.0USB2.0hosts x1(M12A-coded5P)Digital Input DIs x4(M12A-code)Digital Output DOs x2(M12A-code)LED IndicatorsSystem Power x1DisplayActive Display Area245.76(H)x184.32(V)mmAspect Ratio4:3Contrast Ratio1000:1Light Intensity(Brightness)500/1000cd/m2Max.No.of Colors16.2M(8-bit/color)Panel Size12-inch viewable imagePixel Pitch(RGB)0.240(H)x0.240(V)mmPixels1024x768Response Time5ms(gray to gray)Viewing Angles176°/176°Touch FunctionTouch Type Capacitive Touch(PCAP)Touch Support Points4pointsGlove Support YesSerial InterfaceBaudrate50bps to115.2kbpsData Bits5,6,7,8Flow Control RTS/CTS,XON/XOFFParity None,Even,Odd,Space,MarkStop Bits1,1.5,2Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GND RS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersInput Voltage24to110VDCPhysical CharacteristicsHousing MetalIP Rating IP66Dimensions297x238x59mm(11.69x9.37x2.32in) Weight2850g(6.28lb)Environmental LimitsOperating Temperature-40to70°C(-40to158°F)Storage Temperature(package included)-40to70°C(-40to158°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kV;Signal:1kVIEC61000-4-6CS:10VIEC61000-4-8PFMFMechanical Protection Rating IEC60529,IP codeShock EN50155standardVibration EN50155standardEMC EN55032/35Safety IEC60950-1,IEC62368-1,UL62368-1 DeclarationGreen Product RoHS,CRoHS,WEEEWarrantyWarranty Period LCD:1yearSystem:3yearsDetails See /warrantyPackage ContentsDevice1x MPC-2121Series computerInstallation Kit6x screw,for panel-mounting1x M12-Phone jack power cable1x M12-Type A USB cable1x terminal block,2-pin(for remote power input) Documentation1x quick installation guide1x warranty cardDimensionsOrdering Information2.0MPC-2121-E4-LB-CT-T-W7E 12"(4:3)500nitsE3845Quadcore4GBW7E(64-bit)2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-CT-T-W7E12"(4:3)1,000nitsE3845Quadcore4GBW7E(64-bit)2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-LB-CT-T-LX 12"(4:3)500nitsE3845Quadcore4GB Debian92(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-CT-T-LX12"(4:3)1,000nitsE3845Quadcore4GB Debian92(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-LB-CT-T 12"(4:3)500nitsE3845Quadcore4GB–2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°CMPC-2121-E4-CT-T12"(4:3)1,000nitsE3845Quadcore4GB–2(M12)1(M12)1(M12)4/2(M12)24to110VDCIP66-40to70°C©Moxa Inc.All rights reserved.Updated Jun28,2021.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

R1-EC8124系列EtherCAT 4通道类比输入扩展模块使用说明书

DELTA_IA-IPC_R1-EC8124_UM_TC_20200521序言感謝您使用本產品，本使用手冊提供R1-EC8124系列EtherCAT遠端控制4通道類比輸入擴充模組的相關資訊。

本手冊內容包含：⏹產品檢查及型號說明⏹產品規格與各部說明⏹接線說明⏹CiA401 Drive Profile⏹Object Dictionary⏹SDO終止傳輸代碼EtherCAT遠端控制擴充模組產品特色R1-EC8124系列類比輸入模組支援EtherCAT (Ethernet Control Automation Technology)通訊協定，可成為高性能分散式I/O系統。

類比輸入模組提供了電壓、電流模式類比連續型信號狀態讀取介面，搭配E-BUS電源模組可提供EtherCAT主站遠端數位訊號的控制，能在1毫秒(1 ms) 的週期內即時獲取多組從站模組負載狀態的資訊。

EtherCAT系列產品線更有多項不同功能及特性的模組可滿足您不同遠端自動化控制需求。

本產品為多點負載狀態讀取的最佳整合平台，不僅在裝配上更容易、穩定性更佳、擴充更具彈性，是產品加值與產業再升級的最佳選擇。

如何使用本操作手冊您可視本手冊為學習使用R1-EC8124系列EtherCAT 4通道類比輸入擴充模組之參考資訊，手冊將告訴您如何安裝、設定、使用及維護本產品。

台達電子技術服務如果您在使用上仍有問題，歡迎洽詢經銷商或本公司客服中心。

EtherCAT○R is registered trademark and patented technology, licensed by Beckhoff Automation GmbH, Germany.i(此頁有意留為空白) ii目錄產品檢查及型號說明1.1 產品檢查 ········································································································1-21.2 型號說明 ········································································································1-21.3 產品使用說明 ··································································································1-2產品規格與各部說明2.1 電器規格 ········································································································2-22.2 實體示意圖與尺寸說明·······················································································2-32.2.1 R1-EC8124實體示意圖 ···············································································2-32.2.2 R1-EC8124模組尺寸說明 ············································································2-52.3 各部件說明及實體配置示意圖··············································································2-72.4 R1-EC8124端口說明 ························································································2-92.4.1 R1-EC8124D0訊號端點 ··············································································2-92.4.2 R1-EC8124W0訊號端點············································································2-112.5 R1-EC8124W0電源端點··················································································2-132.6 R1-EC8124燈號定義 ······················································································2-14接線說明3.1 輸入端口接線範例 ····························································································3-2CiA401 Drive Profile4.1 操作模式 ········································································································4-24.1.1 相關物件 ··································································································4-2Object Dictionary5.1 物件列表 ········································································································5-25.2 General objects ·······························································································5-35.2.1 Device type (1000h)····················································································5-35.2.2 Error register (1001h)··················································································5-35.2.3 Manufacturer device name (1008h)································································5-35.2.4 Manufacturer software version (100Ah)···························································5-45.2.5 Identity object (1018h)·················································································5-45.3 PDO mapping object·························································································5-55.3.1 Transmit PDO mapping ···············································································5-5 5.4 Sync manager communication objects··································································5-65.4.1 Sync manager communication type (1C00h) ····················································5-65.4.2 Sync manager PDO assignment (1C12h to 1C13h) ···········································5-65.4.3 Sync manager synchronization (1C32h to 1C33h) ·············································5-7 5.5 Manufacturer specific objects··············································································5-85.5.1 Range mode selection (2000h)······································································5-85.5.2 Oversampling rate selection (2001h) ······························································5-85.5.3 Input channel enable (2002h) ·······································································5-95.5.4 Average selection (2003h) ···········································································5-9 5.6 Device control ·······························································································5-105.6.1 Read analog input (6401h)·········································································5-10 SDO終止傳輸代碼6.1 SDO終止傳輸代碼 ···························································································6-2本章節主要介紹R1-EC8124系列之產品檢查、產品型號說明以及使用說明。

S-812C_1中文资料

*1. Attention should be paid to the power dissipation of the package when the load is large.
Applications
• Power source for home electric/electronic appliances • Power source for battery-powered devices • Power source for communication devices
*1
S-812C
1. 3
S-812CxxE series
S-812C
xx
E
UA
-
xxx
T2
G IC direction in tape specifications*1 Product name (abbreviation) Package name (abbreviation)*2 UA :SOT-89-3 Short-circuit protection and no power-off function Output voltage 20 to 60 (e.g. When the output voltage is 2.0 V, it is expressed 20)
*1. Refer to the taping specifications. *2. Refer to the “2. Product name list”.
Seiko Instruments Inc.
5
元器件交易网
HIGH OPERATING VOLTAGE CMOS VOLTAGE REGULATOR S-812C Series

NSi812x高可靠双通道数字隔离器数据手册说明书

C O NF ID EN T IA LNSi8120/NSi8121/NSi8122: High ReliabilityDual-Channel Digital IsolatorsDatasheet (EN) 1.8Product OverviewThe NSi812x devices are high reliability dual-channel digital isolator. The NSi812x device is safety certified by UL1577 support several insulation withstand voltages (3.75kV rms , 5kV rms ), while providing high electromagnetic immunity and low emissions at low power consumption. The data rate of the NSi812x is up to 150Mbps, and the common-mode transient immunity (CMTI) is up to 150kV/us. The NSi812x device provides digital channel direction configuration and the default output level configuration when the input power is lost. Wide supply voltage of the NSi812x device support to connect with most digital interface directly, easy to do the level shift. High system level EMC performance enhance reliability and stability of use. AEC-Q100 (Grade 1) option is provided for all devices.Key Features• Up to 5000V rms Insulation voltage• Date rate: DC to 150Mbps• Power supply voltage: 2.5V to 5.5V • All devices are AEC-Q100 qualified • High CMTI: 150kV/us • Chip level ESD: HBM: ±6kV• High system level EMC performance:Enhanced system level ESD, EFT, Surge immunity• Default output high level or low level option • Isolation barrier life: >60 years• Low power consumption: 1.5mA/ch (1 Mbps) • Low propagation delay: <15ns • Operation temperature: -40℃~125℃ • RoHS-compliant packages:SOIC-8 narrow body SOIC-16 wide bodySafety Regulatory Approvals• UL recognition: up to 5000V rms for 1 minute per UL1577• CQC certification per GB4943.1-2011• CSA component notice 5A • DIN VDE V 0884-11:2017-01Applications• Industrial automation system • Isolated SPI, RS232, RS485• General-purpose multichannel isolation • Motor controlFunctional Block DiagramsC O NF ID EN T IA LIndex1.0 ABSOLUTE MAXIMUM RATINGS .............................................................................................................................. 3 2.0 SPECIFICATIONS ........................................................................................................................................................... 3 2.1. E LECTRICAL CHARACTERISTICS .................................................................................................................................................. 3 2.2. TYPICAL PERFORMANCE CHARACTERISTICS ........................................................................................................................... 7 2.3. P ARAMETER M EASUREMENT I NFORMATION . (8)3.0 HIGH VOLTAGE FEATURE DESCRIPTION (9)3.1. INSULATION AND SAFETY RELATED SPECIFICATIONS (9)3.2. DIN VDE V 0884-11（VDE V 0884-11）:2017-01 INSULATION CHARATERISTICS ....................................................................... 9 3.3. R EGULATORY INFORMATION ................................................................................................................................................... 11 4.0 FUNCTION DESCRIPTION ..........................................................................................................................................11 5.0 APPLICATION NOTE ................................................................................................................................................... 12 5.1. PCB L AYOUT ...................................................................................................................................................................... 12 5.2. H IGH SPEED PERFORMANCE ................................................................................................................................................... 12 5.3. T YPICAL S UPPLY C URRENT E QUATIONS ..................................................................................................................................... 13 6.0 PACKAGE INFORMATION ......................................................................................................................................... 13 7.0 TAPE AND REEL INFORMATION ............................................................................................................................. 17 8.0 ORDER INFORMATION .............................................................................................................................................. 20 9.0 REVISION HISTORY . (21)C O NF ID EN T IA L1.0 ABSOLUTE MAXIMUM RATINGSPower Supply Voltage VDD1, VDD2 -0.5 6.5 V Maximum Input Voltage VINA, VINB -0.4 VDD+0.41 V Maximum Output Voltage V OUTA , V OUTB -0.4 VDD+0.41 VMaximum Input/Output Pulse VoltageVINA, VINB, V OUTA , V OUTB-0.8VDD+0.8VPulse width should be less than 100ns, and the duty cycle should be less than 10%Common-Mode Transients CMTI ±150 kV/us Output currentIo -15 15mAMaximum Surge Isolation VoltageV IOSM5.3kVOperating Temperature Topr -40125 ℃Storage Temperature Tstg -40150℃Electrostatic dischargeHBM±6000VCDM±2000V1 The maximum voltage must not exceed 6.5V.2.0 SPECIFICATIONS2.1. ELECTRICAL CHARACTERISTICS(VDD1=2.5V~5.5V, VDD2=2.5V~5.5V, Ta=-40℃ to 125℃. Unless otherwise noted, Typical values are at VDD1 = 5V, VDD2 = 5V, Ta =25℃)Power on ResetVDD POR2.2 V POR threshold as during power-upVDD HYS 0.1 V POR threshold Hysteresis Input ThresholdV IT1.6 V Input Threshold at rising edge V IT_HYS 0.4 V Input Threshold Hysteresis High Level Input Voltage V IH 2 V Low Level Input Voltage V IL 0.8 V High Level Output Voltage V OH VDD-0.3 V I OH ≤ 4mA Low Level Output VoltageV OL0.3VI OL ≤ 4mAC O NF ID EN T IA LOutput Impedance R out 50 ohm Input Pull high or low CurrentI pull 8 15 uA Start Up Time after POR trbs 40 usec Common Mode Transient ImmunityCMTI±100±150kV/us(VDD1=5V± 10%, VDD2=5V± 10%, Ta=-40℃ to 125℃. Unless otherwise noted, Typical values are at VDD1 = 5V, VDD2 = 5V, Ta = 25℃)Supply currentNSi8120 I DD1(Q0) 0.58 0.87 mAAll Input 0V for NSi8120x0 Or All Input at supply for NSi8120x1 I DD2(Q0) 1.18 1.77 mA I DD1(Q1) 2.92 4.38 mA All Input at supply for NSi8120x0 Or All Input 0V for NSi8120x1I DD2(Q1) 1.241.86mAI DD1(1M) 1.71 2.56 mA All Input with 1Mbps, C L =15pFI DD2(1M)1.382.07mAI DD1(10M) 1.78 2.67 mA All Input with 10Mbps, C L =15pF I DD2(10M)3.24.8mA I DD1(100M)2.103.15 mA All Input with 100Mbps, C L =15pFI DD2(100M)21.031.5mANSi8121/ NSi8122 I DD1(Q0) 1.031.55 mA All Input 0V for NSi812xx0 Or All Input at supply for NSi812xx1 I DD2(Q0) 1.00 1.5 mA I DD1(Q1)2.203.3 mA All Input at supply for NSi812xx0Or All Input 0V for NSi812xx1 I DD2(Q1)2.133.2 mA I DD1(1M) 1.72 2.58 mA All Input with 1Mbps, C L =15pFI DD2(1M) 1.68 2.52 mA I DD1(10M) 2.62 3.93 mA All Input with 10Mbps, C L =15pFI DD2(10M) 2.71 4.06 mA I DD1(100M) 11.01 16.5 mA All Input with 100Mbps, C L = 15pF I DD2(100M)12.8 19.2 mA Data RateDR 0 150 MbpsC O NF ID EN T IA LPropagation Delayt PLH 5 8.20 15 ns See Figure 2.7 , C L = 15pF t PHL 5 10.56 15 ns See Figure 2.7, C L = 15pF Pulse Width Distortion |t PHL – t PLH | PWD5.0nsSee Figure 2.7 , C L = 15pFRising Time t r 5.0 ns See Figure 2.7 , C L = 15pF Falling Timet f 5.0 ns See Figure 2.7 , C L = 15pFPeak Eye Diagram Jitter t JIT (PK) 350 ps Channel-to-Channel Delay Skewt SK (c2c) 2.5 nsPart-to-Part Delay Skewt SK (p2p)5.0ns(VDD1=3.3V± 10%, VDD2=3.3V± 10%, Ta=-40℃ to 125℃. Unless otherwise noted, Typical values are at VDD1 = 3.3V, VDD2 = 3.3V, Ta =25℃)Supply currentNSi8120 I DD1(Q0) 0.550.83mA All Input 0V for NSi8120x0 Or All Input at supply for NSi8120x1 I DD2(Q0) 1.12 1.68 mA I DD1(Q1) 2.87 4.3 mA All Input at supply for NSi8120x0 Or All Input 0V for NSi8120x1 I DD2(Q1)1.18 1.77mA I DD1(1M)1.72.55mA All Input with 1Mbps, C L = 15pFI DD2(1M)1.271.91 mA I DD1(10M) 1.732.6 mA All Input with 10Mbps, C L = 15pF I DD2(10M)2.413.6 mA I DD1(100M) 2.05 3.08 mA All Input with 100Mbps, C L = 15pF I DD2(100M)14.0521.08mANSi8121/ NSi8122 I DD1(Q0) 0.98 1.47 mA All Input 0V for NSi812xx0 Or All Input at supply for NSi812xx1 I DD2(Q0) 0.95 1.43 mA I DD1(Q1) 2.14 3.21 mA All Input at supply for NSi812xx0 Or All Input 0V for NSi812xx1 I DD2(Q1) 2.08 3.12 mA I DD1(1M) 1.63 2.45 mA All Input with 1Mbps, C L = 15pFI DD2(1M) 1.59 2.39 mA I (10M)2.223.33mAAll Input with 10Mbps,C O NF I D EN T IA LI DD2(10M) 2.25 3.38 mA C L = 15pFI DD1(100M) 7.57 11.36 mA All Input with 100Mbps, C L = 15pF I DD2(100M)8.5 12.75 mA Data RateDR 0 150 Mbps Minimum Pulse Width PW 5.0 nsPropagation Delayt PLH 5 9.20 15 ns See Figure 2.7 , C L = 15pF t PHL5 10.40 15 ns See Figure 2.7, C L = 15pF Pulse Width Distortion |t PHL – t PLH | PWD5.0nsSee Figure 2.7 , C L = 15pFRising Time t r 5.0 ns See Figure 2.7 , C L = 15pF Falling Timet f5.0 nsSee Figure 2.7 , C L = 15pFPeak Eye Diagram Jitter t JIT (PK) 350psChannel-to-Channel Delay Skewt SK (c2c)2.5nsPart-to-Part Delay Skew t SK (p2p)5.0ns(VDD1=2.5V± 10%, VDD2=2.5V± 10%, Ta=-40℃ to 125℃. Unless otherwise noted, Typical values are at VDD1 = 2.5V, VDD2 = 2.5V, Ta =25℃)Supply currentNSi8120I DD1(Q0) 0.53 0.8 mA All Input 0V for NSi8120x0 Or All Input at supply for NSi8120x1 I DD2(Q0) 1.11.65 mA I DD1(Q1)2.85 4.28 mA All Input at supply for NSi8120x0 Or All Input 0V for NSi8120x1 I DD2(Q1)1.15 1.73 mA I DD1(1M) 1.632.45 mA All Input with 1Mbps, C L = 15pFI DD2(1M) 1.21 1.82 mA I DD1(10M) 1.68 2.52 mA All Input with 10Mbps, C L = 15pFI DD2(10M) 2.05 3.08 mA I DD1(100M) 1.95 2.93 mA All Input with 100Mbps, C L = 15pFI DD2(100M)10.415.6mANSi8121/ NSi8122I DD1(Q0) 0.96 1.44 mA All Input 0V for NSi812xx0 Or All Input at supply for NSi812xx1I (Q0)0.931.395mAF ID EN T IA LI DD1(Q1) 2.11 3.165 mA All Input at supply for NSi812xx0Or All Input 0V for NSi812xx1 I DD2(Q1) 2.05 3.075 mA I DD1(1M) 1.58 2.37 mA All Input with 1Mbps, C L = 15pFI DD2(1M) 1.54 2.31 mA I DD1(10M) 2.02 3.03 mA All Input with 10Mbps, C L = 15pFI DD2(10M) 2.04 3.06 mA I DD1(100M) 6.03 9.045 mA All Input with 100Mbps, C L = 15pF I DD2(100M)6 9 mAData RateDR 0 150 Mbps Minimum Pulse Width PW 5.0 nsPropagation Delayt PLH 5 10 15 nsSee Figure 2.7 , C L = 15pF t PHL5 10 15nsSee Figure 2.7, C L = 15pFPulse Width Distortion |t PHL – t PLH | PWD5.0nsSee Figure 2.7 , C L = 15pFRising Time t r5.0ns See Figure 2.7 , C L = 15pF Falling Timet f5.0 ns See Figure 2.7 , C L = 15pFPeak Eye Diagram Jitter t JIT (PK)350ps Channel-to-Channel Delay Skewt SK (c2c)2.5ns Part-to-Part Delay Skew t SK (p2p)5.0ns2.2. TYPICAL PERFORMANCE CHARACTERISTICSFigure 2.1 NSi8120 VDD1 Supply Current vs Data Rate Figure 2.2 NSi8120 VDD2 Supply Current vs Data RateC OE2.3. PARAMETER MEASUREMENT INFORMATIONC LFigure 2.7 Switching Characteristics Test Circuit and WaveformFigure 2.8 Common-Mode Transient Immunity Test CircuitC O NF ID EN T IA L3.0 HIGH VOLTAGE FEATURE DESCRIPTION3.1. INSULATION AND SAFETY RELATED SPECIFICATIONSMinimum External Air Gap (Clearance)L(I01) 4.0 8.0 mm Shortest terminal-to-terminal distance through air Minimum External Tracking (Creepage)L(I02)4.08.0mmShortest terminal-to-terminal distance across the package surfaceMinimum internal gap DTI 20 um Distance through insulationTrackingResistance(Comparative Tracking Index) CTI>400VDIN EN 60112 (VDE 0303-11); IEC 60112Material GroupⅡ3.2. DIN VDE V 0884-11（VDE V 0884-11）:2017-01 INSULATION CHARATERISTICSSOIC-8 SOIC-16 Installation Classification per DIN VDE 0110For Rated Mains Voltage ≤ 150V rms Ⅰto Ⅳ Ⅰto Ⅳ For Rated Mains Voltage ≤ 300V rms Ⅰto Ⅲ Ⅰto Ⅳ For Rated Mains Voltage ≤ 400V rms Ⅰto Ⅲ Ⅰto Ⅳ Climatic Classification10/105/2110/105/21 Pollution Degree per DIN VDE 0110, Table 122Maximum repetitive isolation voltageVIORM 565 849 Vpeak Input to Output Test Voltage, Method B1V IORM × 1.5 = V pd (m) , 100%production test, t ini = t m = 1 sec, partial discharge < 5 pCV pd (m)8471273VpeakInput to Output Test Voltage, Method AAfter Environmental Tests Subgroup 1V IORM × 1.2= V pd (m) , t ini = 60 sec, t m = 10 sec, partial V pd (m)6781018VpeakC O N T IA LAfter Input and /or Safety Test Subgroup 2 and Subgroup 3 V IORM × 1.2= V pd (m) , t ini = 60 sec, t m = 10 sec, partialdischarge < 5 pC V pd (m)6781018VpeakMaximum transient isolation voltage t = 60 sec VIOTM 5300 7000 Vpeak Maximum Surge Isolation VoltageTest method per IEC60065,1.2/50uswaveform, VTEST=VIOSM×1.3VIOSM53845384VpeakIsolation resistance VIO =500V RIO >109 >109 Ω Isolation capacitance f = 1MHzCIO 0.6 0.6pFInput capacitanceCI22pF Total Power Dissipation at 25℃Ps1499 mW Safety input, output, or supply currentθJA = 140 °C/W, V I = 5.5 V, T J = 150 °C, T A = 25 °C Is160mAθJA = 84 °C/W, V I = 5.5 V, T J = 150 °C, T A = 25 °C237 mA Case TemperatureTs150150℃Figure 3.2 NSi8120W/NSi8121W/NSi8122W Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per DIN VDE V 0884-11C O NF ID EN T IA L3.3. REGULATORY INFORMATIONThe NSi8120N/NSi8121N/NSi8122N are approved by the organizations listed in table.UL 1577 Component Recognition Program 1Approved under CSA ComponentAcceptance Notice 5ADIN VDE V 0884-11:2017-012Certified by CQC11-471543-2012 GB4943.1-2011Single Protection, 3750V rms Isolation voltageSingle Protection, 3750V rms IsolationvoltageBasic Insulation 565Vpeak, V IOSM =5384VpeakBasic insulation at 400V rms (565Vpeak)File (E500602)File (E500602)File (5024579-4880-0001)File (pending)1 In accordance with UL 1577, each NSi8120N/NSi8121N/NSi8122N is proof tested by applying an insulation test voltage ≥ 4500 Vrms for 1 sec.2 In accordance with DIN VDE V 0884-11, each NSi8120N/NSi8121N/NSi8122N is proof tested by applying an insulation test voltage ≥ 847 V peak for 1 sec(partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN VDE V 0884-11 approval.The NSi8120W/NSi8121W/NSi8122W are approved by the organizations listed in table.UL 1577 Component Recognition Program 1Approved under CSAComponent Acceptance Notice5ADIN VDE V 0884-11(VDE V 0884-11):2017-012 Certified by CQC11-471543-2012 GB4943.1-2011Single Protection, 5000V rms Isolation voltageSingle Protection, 5000V rmsIsolation voltageBasic Insulation 849Vpeak, V IOSM =5384Vpeak Basic insulation at 800V rms (1131Vpeak) Reinforced insulation at 400V rms (565Vpeak)File (E500602)File (E500602)File (5024579-4880-0001)File (pending)1 In accordance with UL 1577, each NSi8120W/NSi8121W/NSi8122W is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 sec.2 In accordance with DIN VDE V 0884-11, each NSi8120W/NSi8121W/NSi8122W is proof tested by applying an insulation test voltage ≥ 1273 V peak for 1 sec(partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN VDE V 0884-11 approval.4.0 FUNCTION DESCRIPTIONThe NSi812x is a Dual-channel digital isolator based on a capacitive isolation barrier technique. The digital signal is modulated with RF carrier generated by the internal oscillator at the Transmitter side. Then it is transferred through the capacitive isolation barrier and demodulated at the Receiver side.The NSi812x devices are high reliability dual-channel digital isolator with AEC-Q100 qualified. The NSi812x device is safety certified by UL1577 support several insulation withstand voltages (3.75kV rms , 5kV rms ), while providing high electromagnetic immunity and low emissions at low power consumption. The data rate of the NSi812x is up to 150Mbps, and the common-mode transient immunity (CMTI) is up to 150kV/us. The NSi812x device provides digital channel direction configuration and the default output level configuration when the input power is lost. Wide supply voltage of the NSi812x device support to connect with most digital interface directly, easy to do the level shift. High system level EMC performance enhance reliability and stability of use.The NSi812x has a default output status when VDDIN is unready and VDDOUT is ready as shown in Table 4.1, which helps for diagnosis when power is missing at the transmitter side. The output B follows the same status with the input A within 1us after powering up.C O NF ID EN T IA LCopyright © 2019, NOVOSENSEPage 12 Table 4.1 Output status vs. power statusH Ready Ready H Normal operation.L Ready Ready L XUnreadyReadyL HThe output follows the same status with the input within 60us after input side VDD1 is powered on.X Ready Unready XThe output follows the same status with the input within 60us after output side VDD2 is powered on.5.0 APPLICATION NOTE5.1. PCB LAYOUTThe NSi812x requires a 0.1 µF bypass capacitor between VDD1 and GND1, VDD2 and GND2. The capacitor should beplaced as close as possible to the package. Figure 5.1 to Figure 5.4 show the recommended PCB layout, make sure the space under the chip should keep free from planes, traces, pads and via. To enhance the robustness of a design, the user may also include resistors (50–300 Ω ) in series with the inputs and outputs if the system is excessively noisy. The series resistors also improve the system reliability such as latch-up immunity.The typical output impedance of an isolator driver channel is approximately 50 Ω, ±40%. When driving loads where transmission line effects will be a factor, output pins should be appropriately terminated with controlled impedance PCB traces.Figure5.1 Recommended PCB Layout — Top Layer Figure5.2 Recommended PCB Layout — Bottom LayerFigure5.3 Recommended PCB Layout — Top Layer Figure5.4 Recommended PCB Layout — Bottom Layer5.2. HIGH SPEED PERFORMANCEFigure 5.5 shows the eye diagram of NSi812x at 200Mbps data rate output. The result shows a typical measurement on the NSi812x with 350ps p-p jitter.C O NF ID EN T IA LFigure5.5 NSi812x Eye Diagram5.3. TYPICAL SUPPLY CURRENT EQUATIONSThe typical supply current of NSi812x can be calculated using below equations. I DD1 and I DD2 are typical supply currents measured in mA, f is data rate measured in Mbps, C L is the capacitive load measured in pFNSi8120:I DD1 = 0.19 *a1+1.45*b1+0.82*c1. I DD2 = 1.36+ VDD1*f* C L *c1*10-9When a1 is the channel number of low input at side 1, b1 is the channel number of high input at side 1, c1 is the channel number of switch signal input at side 1.NSi8121/ NSi8122:I DD1 = 0.87 +1.26*b1+0.63*c1+ VDD1*f* C L *c2*10-9I DD2 = 0.87 +1.26*b2+0.63*c2+ VDD1*f* C L *c1*10-9When b1 is the channel number of high input at side 1, c1 is the channel number of switch signal input at side 1, b2 is the channel number of high input at side 2, c2 is the channel number of switch signal input at side 2.6.0 PACKAGE INFORMATIONVDD GND 22VDD INA GND 2VDD 2Figure 6.1 NSi8120N Package Figure 6.2 NSi8121N PackageC O NF ID EN T IA LVDD INBGND 22Figure 6.3 NSi8122N PackageFigure 6.4 SOIC8 Package Shape and Dimension in millimeters (inches)Table6.1 NSi8120N/ NSi8121N/ NSi8122N Pin Configuration and DescriptionNSi8121N PIN NO.NSi8122N PIN NO.SYMBOL FUNCTION1 1 1 VDD1 Power Supply for Isolator Side 12 7 2 INA Logic Input A3 3 6 INB Logic Input B4 4 4 GND1 Ground 1, the ground reference for Isolator Side 15 5 5 GND2 Ground 2, the ground reference for Isolator Side 26 6 3 OUTB Logic Output B7 2 7 OUTA Logic Output A888VDD2Power Supply for Isolator Side 2C O NFVDD GND GND 2VDD 2GND 2GND NC NCNC VDD GND GND 2VDD 22GND NC NC NCFigure 6.5 NSi8120W Package Figure 6.6 NSi8121W PackageVDD INB GND GND 2VDD 2GND 2GND NC NC NCFigure 6.7 NSi8122W PackageFigure 6.8 WB SOIC16 Package Shape and Dimension in millimeters and (inches)C O NF ID EN T IA LTable 6.2 NSi8120W/ NSi8121W/ NSi8122W Pin Configuration and Description1 1 1 GND1 Ground 1, the ground reference for Isolator Side 12 2 2 NC No Connection.3 3 3 VDD1 Power Supply for Isolator Side 14 13 4 INA Logic Input A5 5 12 INB Logic Input B6 6 6 NC No Connection.7 7 7 GND1 Ground 1, the ground reference for Isolator Side 18 8 8 NC No Connection. 9 9 9 GND2 Ground 2, the ground reference for Isolator Side 210 10 10 NC No Connection. 11 11 11 NC No Connection. 12 12 5OUTB Logic Output A 13 4 13OUTALogic Output B 14 14 14 VDD2 Power Supply for Isolator Side 215 15 15 NC No Connection.161616GND2Ground 2, the ground reference for Isolator Side 27.0TAPE AND REEL INFORMATIONLAITNEDIFNOCC O NF ID EN T IA LFigure 7.1 Tape and Reel Information of SOIC8LAITNEDIFNOCFigure 7.2 Tape and Reel Information of WB SOIC16NF ID EN T IA L8.0 ORDER INFORMATIONNSi8120N0 3.75 2 0 150 Low -40 to 125℃ NO SOIC8 NSi8120N1 3.75 2 0 150 High -40 to 125℃ NO SOIC8 NSi8121N0 3.75 1 1 150 Low -40 to 125℃ NO SOIC8 NSi8121N1 3.75 1 1 150 High -40 to 125℃ NO SOIC8 NSi8122N0 3.75 1 1 150 Low -40 to 125℃ NO SOIC8 NSi8122N1 3.75 1 1 150 High -40 to 125℃ NO SOIC8 NSi8120W0 5 2 0 150 Low -40 to 125℃ NO WB SOIC16 NSi8120W1 5 2 0 150 High -40 to 125℃ NO WB SOIC16 NSi8121W0 5 1 1 150 Low -40 to 125℃ NO WB SOIC16 NSi8121W1 5 1 1 150 High -40 to 125℃ NO WB SOIC16 NSi8122W0 5 1 1 150 Low -40 to 125℃ NO WB SOIC16 NSi8122W1 5 1 1 150 High -40 to 125℃ NO WB SOIC16 NSi8120N0Q 3.75 2 0 150 Low -40 to 125℃ YES SOIC8 NSi8120N1Q 3.75 2 0 150 High -40 to 125℃ YES SOIC8 NSi8121N0Q 3.75 1 1 150 Low -40 to 125℃ YES SOIC8 NSi8121N1Q 3.75 1 1 150 High -40 to 125℃ YES SOIC8 NSi8122N0Q 3.75 1 1 150 Low -40 to 125℃ YES SOIC8 NSi8122N1Q 3.75 1 1 150 High -40 to 125℃ YES SOIC8 NSi8120W0Q 5 2 0 150 Low -40 to 125℃ YES WB SOIC16 NSi8120W1Q 5 2 0 150 High -40 to 125℃ YES WB SOIC16 NSi8121W0Q 5 1 1 150 Low -40 to 125℃ YES WB SOIC16 NSi8121W1Q 5 1 1 150 High -40 to 125℃ YES WB SOIC16 NSi8122W0Q 5 1 1 150 Low -40 to 125℃ YES WB SOIC16 NSi8122W1Q 5 1 1 150 High -40 to 125℃YES WB SOIC16 NOTE: All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifications and peak solder temperatures. All devices are AEC-Q100 qualified.Part Number Rule:NSi(81)(2)(1)(N)(1)(Q)C O NF ID EN T IA LNSi8120/NSi8121/NSi81229.0 REVISION HISTORY1.0 Original2017/11/15 1.1 Change to Ordering information2018/3/26 1.2 Add maximum operation current specification. 2018/6/20 1.3 Change block diagram 2018/7/28 1.4 Correct Table 6.2 Pin No.2018/8/20 1.5 Add specification “Input Pull high or low Current” 2018/9/10 1.6 Add “Maximum Input/Output Pulse Voltage” 2018/10/91.7 Change to Ordering information 2018/12/20 1.8 Change Certification Information2019/06/17。

ICP-212S3 枪支说明书

H-UP調整：BB彈呈現一直線的彈道才是正確射法。

過於上飄：將撥片往後拉。

過於下墜：將撥片往前推。

H-up Adjustment: Make sure the trajectory of the BB pellets to be straight.When the BB pellet flies up: Push the H-UP lever backward to raise the trajectory.When the BB pellet falls down: Push the H-UP lever forward to lower the trajectory.5H-UP 彈道調整H-UP Adjustment3-2槍身結合3號齒輪箱正確位置圖The correct position of sector gear before reassembling3號齒在槍身結合時，必須轉到正確位置，才可將上槍身蓋下。

Make sure the sector gear is turned to the correct position before reassem-bling the receiver .The piston and gear may be damaged without correcting the position in advance.未進行歸位校正，會損壞活塞及齒輪3可動部的說明Movable Parts3-1槍機拉柄操作Charging Handle將槍機拉柄向後拉至底端(不可放開)Pull the charging handle back to theend of the groove.1按壓槍托調整壓板後，即可前後調整長度。

Press the Stock Adjustment Lever to adjust the length.1按壓貼塞調整鈕後，即可上下調整高度。

AD9122_cn

概述
AD9122 是一款双通道、 16 位、高动态范围数模转换器 (DAC)，提供1200 MSPS采样速率，可以产生最高达奈奎斯特频率的多载波。它具有针对直接变频传输应用进行优化的特性，包括复数数字调制以及增益与失调补偿。DAC输出经过优化，可以与模拟正交调制器无缝接口，例如ADI 公司的ADL537x F-MOD系列调制器。四线式串行端口接口允许对许多内部参数进行编程和回读。满量程输出电流可以在8.7 mA至31.7 mA范围内进行编程。该器件采用72引脚 LFCSP封装。
产品聚焦
1. 利用超低噪声与交调失真 (IMD)特性，从基带到高中频的宽带信号可以实现高质量合成。 2. 专有的DAC输出开关技术可增强动态性能。 3. 电流输出配置简便，可以用于各种单端或差分电路拓扑结构。 4. 灵活的LVDS数字接口允许标准32线式总线的宽度降至原来的½或¼。
应用
无线基础设施 W-CDMA、CDMA2000、TD-SCDMA、WiMAX、GSM、LTE 数字高/低中频合成发射分集宽带通信：LMDS/MMDS、点对点
Rev. A
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved.
图1
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Speci cations subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

BOSE CSP-1248商用音频处理器产品说明

产品概述可实现快速安装的 DSP — Bose CSP -1248 商用音频处理器是包括扬声器、控制中心和软件在内的综合平台的一部分，可帮助安装人员高效地配置优质音响系统。

板载 CSP 配置实用程序和基于浏览器的直观用户界面可提供快速设置工作流。

以逻辑性的方式呈现常见任务，因此您可以更快地配置系统，从而缩短安装时间，同时提高安装准确性。

安装后，Bose 专有算法带来可预测的性能，同时 ControlCenter 数字区域控制器和 ControlSpace Remote 远程控制应用程序等可选配件可让终端用户实现轻松操作。

关键特性连接尺寸适中，适合经济型商业安装 - 8 x 4 平衡模拟输入/输出，4 对混音单声道 RCA 输入、8 个控制输入、1 个控制输出、静音触点、以太网接口和 Bose AmpLink 连接CSP 配置实用程序具有基于浏览器的用户界面，便于实时显示和设置电平、路由、阈值、优先级、设定事件、Bose 扬声器 EQ 、输入和区域 EQ后面板以太网接口适用于 PC/Mac 配置；同时还可以连接 ControlCenter 数字区域控制器和 ControlSpace® Remote 远程控制应用程序自动音量补偿会根据环境噪声不断调整区域输出电平，只需与 Bose AVM-1 感应麦克风（单独出售）配合使用即可Opti -voice 寻呼功能可提供音乐和广播之间的平滑过渡Opti -source 电平管理可监控多达 4 个音源的输入电平，在切换音源时保持一致的音量SmartBass 处理可在任何音量下对支持的 Bose 扬声器扩展低音的性能和响应Bose AmpLink 输出可简单地将数字音频与兼容的功率放大器连接，减少中断和相关故障点直观的终端用户操作 — 可选的 ControlCenter CC-1D 、CC-2D 和 CC-3D （单独出售）数字区域控制器和 ControlSpace Remote 远程控制应用程序能够提供轻松的音量控制和音源选择应用零售餐厅酒店技术数据Bose CSP -1248 商用音频处理器技术规格q RCA 输入 – 四对混音单声道用于连接非平衡音源w 平衡输入 – 八路平衡模拟麦克风/线路输入（配备可选的 +48V 幻象电源）ePBX 输入 – 用于 600 Ω 电话系统的专用寻呼控制输入r 平衡输出 – 四路平衡模拟线路输出t MOH 输出 – 标准平衡输出或用于 600 Ω 音乐保持 (Music On Hold) 电话系统的音源。

DSP2812 flash 烧写成功方法,烧录器下载器 2812下载器编程器

DSP2812成功批量烧录下载、调试仿真DSP2812_FLASH烧写成功经验总结初次接触DSP2812的FLASH烧写，在“成功”锁死2块DSP2812和处理了一堆报错后，终于烧写成功。

其中CMD\LIB\ASM文件，可以在网上下载到，大家找找就可以1. 一定要下载最新的FLASH烧写插件，可以避免很多奇怪的错误出现，这一点非常重要，本人就是在此问题困扰了一整天。

2.下载烧写FLASH配套CMD文件、LIB文件以及起始代码asm文件。

CMD文件名称：DSP281x_Headers_nonBIOS.cmdCMD文件名称：F2812.cmdLIB文件名称：rts2800_ml.libASM文件名称：DSP281x_CodeStartBranch.asm另外在RAM调试时用以下两个文件：F2812_EzDSP_RAM_lnk.cmdDSP281x_Headers_nonBIOS.cmd3.配置C文件配置好主程序的C文件，才能将FLASH成功烧录，并且将FLASH中的文件拷贝到RAM中运行。

关于C文件的配置。

首先在F2812.CMD文件中，我们可以看到有关于加载FLASH到RAM的内容，以及在C文件中调用FLASH 到RAM的函数memcpy，将它放在系统初始化（InitSystem();）之后即可，所以，我们需要定义所用变量，这些定义都是：DSP281x_GlobalPrototypes.h 当中,当然，也可以放在其他系统初始化的地方。

Memcpy这个函数应该是rts2800_ml.lib库文件中自带的，不需要我们定义。

关于FLASH的初始化配置Initflash(); 我把它放置在Memcpy 函数之后。

关于ramfuncs，则在系统初始化中定义即可。

如:sysctrl.c中#pragmaCODE_SECTION(InitFlash, "ramfuncs"); 另外，许多朋友没有注意需要定义自己其他子程序，导致最终运行的主程序还是在FLASH中，比如你需要运行的子程序ABC，则需要定义#pragma CODE_SECTION(ABC, "ramfuncs") 烧写成功后的注意事项：1 一定要拔除仿真器（JTAG端），给电路板重新上电，方能实现FLASH启动。

罗克韦尔自动化 Trusted TMR 处理器接口适配器 T8120, T8121, T8122,

ICSTT-RM239J-EN-P (PD-T812X) Trusted Trusted TMR Processor Interface Adapter(T8120, T8121, T8122, T8123)Product OverviewThis document provides general information for the Trusted® Processor Interface Adapter T812X. The Adapter provides easy access to the communications ports of the Trusted Triple Modular Redundant (TMR) Processor (T8110B & T8111) in the Controller Chassis for the Distributed Control System (DCS) and other links. The unit is also used to enable a number of extended facilities available on the Trusted TMR Processor including facilities for the reception of IRIG-B time synchronisation signals, enabling the use of Dual (‘enhanced’) Peer to Peer and enabling the Trusted System to become MODBUS Master.Features:•Allows easy access for external systems to communicate with a Trusted TMR Processor.•Easy installation (connects directly to the rear of the Controller Chassis).•Two RS422/485 configurable 2 or 4 wire connections.•One RS422/485 2 wire connection.•Fault/fail connections for Active and Standby Processors.•Processor diagnostics connection.•PSU shutdown monitor connections.•Option for connecting IRIG-B122 and IRIG-B002 time synchronisation signals.•Option to enable MODBUS Master on the Trusted Communications Interface.Trusted ICSTT-RM239J-EN-P (PD-T812X)Page intentionally left blankPREFACEIn no event will Rockwell Automation be responsible or liable for indirect or consequential damages resulting from the use or application of this equipment. The examples given in this manual are included solely for illustrative purposes. Because of the many variables and requirements related to any particular installation, Rockwell Automation does not assume responsibility or reliability for actual use based on the examples and diagrams.No patent liability is assumed by Rockwell Automation, with respect to use of information, circuits, equipment, or software described in this manual.Allen-Bradley, LISTEN. THINK. SOLVE., Rockwell Automation, TechConnect, and Trusted are trademarks of Rockwell Automation, Inc.All trademarks are acknowledged.DISCLAIMERIt is not intended that the information in this publication covers every possible detail about the construction, operation, or maintenance of a control system installation. You should also refer to your own local (or supplied) system safety manual, installation and operator/maintenance manuals. REVISION AND UPDATING POLICYThis document is based on information available at the time of its publication. The document contents are subject to change from time to time. The latest versions of the manuals are available at the Rockwell Automation Literature Library under "Product Information" information "Critical Process Control & Safety Systems".TRUSTED RELEASEThis technical manual was updated for Trusted Release 4.0.LATEST PRODUCT INFORMATIONFor the latest information about this product review the Product Notifications and Technical Notes issued by technical support. Product Notifications and product support are available at the Rockwell Automation Support Centre atAt the Search Knowledgebase tab select the option "By Product" then scroll down and select the Trusted product.Some of the Answer ID’s in the Knowledge Base require a TechConnect℠ Support Contract. For more information about TechConnect Support Contract Access Level and Features, click on the following link:https:///app/answers/detail/a_id/898272This will get you to the login page where you must enter your login details.IMPORTANT A login is required to access the link. If you do not have an account then you can create one using the "Sign Up" link at the top right of the web page.DOCUMENTATION FEEDBACKYour comments will help us serve your documentation needs better. If you have any suggestions on how to improve this document, complete the How Are We Doing? format /idc/groups/literature/documents/du/ra-du002_-en-e.pdf.SCOPEThis manual specifies the maintenance requirements and describes the procedures to assist troubleshooting and maintenance of a Trusted system. WHO SHOULD USE THIS MANUALThis manual is for plant maintenance personnel who are experienced in the operation and maintenance of electronic equipment and are trained to work with safety systems. SYMBOLSIn this manual we will use these notices to tell you about safety considerations.SHOCK HAZARD: Identifies an electrical shock hazard. If a warning label is fitted, it can be on or inside the equipment.WARNING: Identifies information about practices or circumstances that can cause an explosion in a hazardous environment, which can cause injury or death, property damage or economic loss.ATTENTION: Identifies information about practices or circumstances that can cause injury or death.CAUTION: Identifies information about practices or circumstances that can cause property damage or economic loss.BURN HAZARD: Identifies where a surface can reach dangerous temperatures. If a warning label is fitted, it can be on or inside the equipment.This symbol identifies items which must be thought about and put in place when designing and assembling a Trusted controller for use in a Safety Instrumented Function (SIF). It appears extensively in the Trusted Safety Manual.IMPORTANT Identifies information that is critical for successful application and understanding of the product.NOTE Provides key information about the product or service.TIP Tips give helpful information about using or setting up the equipment.WARNINGS AND CAUTIONSWARNING: EXPLOSION RISKDo not connect or disconnect equipment while the circuit is live or unless the area is known to be free of ignitable concentrations or equivalentAVERTISSEMENT - RISQUE D’EXPLOSIONNe pas connecter ou déconnecter l’équipement alors qu’il est sous tension, sauf si l’environnement est exempt de concentrations inflammables ou équivalenteMAINTENANCEMaintenance must be carried out only by qualified personnel. Failure to follow these instructions may result in personal injury.CAUTION: RADIO FREQUENCY INTERFERENCEMost electronic equipment is influenced by Radio Frequency Interference. Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.CAUTION:The module PCBs contains static sensitive components. Static handling precautions must be observed. DO NOT touch exposed connector pins or attempt to dismantle a module.ISSUE RECORDIssue Date Comments6 Sep 05 Format7 Aug 06 Dual Peer to Peer8 Sep 07 Port purposes9 Sep 14 Fault/Fail connector identity10 Sep 15 Rebranded and reformatted with standardisation of the RelativeHumidity Range and Operating Temperature specifications11 Apr 16 Updated to incorporate IEEE standards and correct typographical errors12 Oct 19 Updated Figure 2 Adapter LayoutUpdated Table 2 Connector SK1 PinoutUpdated Section 1.2 Fault/Fail ConnectorsRemoved Diagnostic Connector (J4) informationSplit J5 into two connectors, J5 and J13Updated Table 7 Mating ConnectorsAdded Table 8 Single Point ConnectionAdded Table 9 Multi-drop ConnectionUpdated Section 3.2 IRIG-B PortsUpdated Specifications tablePage intentionally left blankTrusted TMR Processor Interface Adapter Table of Contents Table of Contents1.Description (3)1.1. Processor Interface Connector (SK1) (5)1.2. Fault/Fail Connectors (J2 and J3) (J17 and J15) (6)1.3. PSU Shutdown Monitor Connector (J6) (6)1.4. Serial Port 1 (Diagnostic) Connectors (J7 and J12) (6)1.5. Serial Ports 2 and 3 Connectors (J8 to J11) (7)1.6. IRIG B Connectors (J5 and J13) (7)1.7. Mating Connectors (8)2.Installation (9)3.Input Configuration (11)3.1. Serial Ports (11)3.2. IRIG-B Ports (12)4.Available Operations (13)5.Specifications (15)Table of Contents Trusted TMR Processor Interface AdapterPage intentionally left blankTrusted TMR Processor Interface Adapter 1. Description 1.DescriptionFigure 1 Photo T812XThe Trusted Processor Interface Adapter T812x is designed to be connected directly to the rear of a Trusted TMR Processor position in a Trusted Controller Chassis T8100. The Adapter provides a communications connection interface between the Trusted TMR Processor and remote systems. The Adapter also provides the option of connecting IRIG-B time synchronisation signals to the Processor. Connection between the Adapter and the Trusted TMR Processor is via two 48-way DIN41612 E-type connectors (SK1), one each for connection to the Active and Standby Processors.1. Description Trusted TMR Processor Interface Adapter Figure 2 shows the physical layout of serial port, diagnostics and IRIG-B connectors on the Adapter printed circuit board (PCB).Figure 2 Adapter LayoutThe Adapter comprises a PCB on which the communications ports, IRIG-B connectors and both SK1 sockets (connectors to the Active/Standby Trusted TMR Processors) are mounted. The Adapter is contained within a metal enclosure and is designed to be clipped onto the appropriate connector at the rear of the Controller Chassis. Release buttons are provided to enable the Adapter to be disconnected.The communication ports available at the Adapter are RS422/RS485 2 wire on Port 1, and RS422/RS485 2 or 4 wire on Ports 2 and 3.An earth point is provided on the PCB so that the Chassis earth of the Processor will be connected to the shell of the Adapter and module rack earth. It is an important safety and Electrostatic Discharge (ESD) requirement that the equipotential bonding is connected and maintained.Trusted TMR Processor Interface Adapter 1. Description 1.1.Processor Interface Connector (SK1)SK1 is a 48-way DIN41612, E-type connector.PinCONNECTOR SK1 PINOUTA C E2 Fault Relay (NC) DIAG_RTN (NC) Failed Relay (NC)4 Fault Relay(Common) DIAG_IN_1 (NC) Failed Relay(Common)6 Fault Relay (NO) 0 V Port 1 Failed Relay (NO)8 N.C. Serial Port 1 B N.C.10 5 V_D Serial Port 1 A IRIG B122+12 DATA_OUT 0 V Port 2 IRIG B122-14 ENABLE Serial Port 2 B TX Reserved16 DATA_IN Serial Port 2 A TX Reserved18 CLK Serial Port 2 B RX/TX IRIG-B002-20 0 V Serial Port 2 A RX/TX IRIG-B002+22 Chassis GND 0 V Port 3 Chassis GND24 Chassis GND Serial Port 3 B TX Chassis GND26 Chassis GND Serial Port 3 A TX Chassis GND28 24 V PSU 1 LVWarningSerial Port 3 B RX/TX 24 V PSU 1 Shutdown30 24 V PSU 2 LVWarningSerial Port 3 A RX/TX 24 V PSU 2 Shutdown 32 24 V Return 24 V Return 24 V ReturnTable 1 Connector SK1 Pinout1. Description Trusted TMR Processor Interface Adapter1.2.Fault/Fail Connectors (J2 and J3) (J17 and J15)J2, J3, J15 and J17 are Phoenix contact 2.5 mm pitch connectors.J2 / J3Pin Service1. FAULT_n_NC2. FAULT_n_COM3. FAULT_n_NOJ17 / J15Pin Service1.FAIL_n_NC2. FAIL_n_COM3. FAIL_n_NOTable 2 Fault/Fail ConnectorsNote: n=1 for connectors J2 and J17, n=2 for connectors J3 and J15 providing fault and fail connections for the Active and Standby Processors respectively. FAULT NC relay contacts open on any system fault which sets the Processor System Healthy LED flashing red. FAIL NC relay contacts open on Processor shutdown.1.3.PSU Shutdown Monitor Connector (J6)J6 is Phoenix contact 2.5 mm pitch connector. These two system inputs are made available to the application on the Processor’s complex I/O equipment definition. The inputs expect volt-free contacts to the RTN pin.Pin Service1 24 V_PSU1_SHUTDOWN2 24 V_PSU2_SHUTDOWN3 24 V_RTNTable 3 PSU S/D Monitor Connection1.4.Serial Port 1 (Diagnostic) Connectors (J7 and J12)J7 and J12 are Phoenix 2.5 mm pitch connectors.Trusted TMR Processor Interface Adapter 1. DescriptionPin Service1 0 V2 SERIAL_1_B3 SERIAL_1_ATable 4 Serial Port 1 Diagnostic Connectors1.5.Serial Ports 2 and 3 Connectors (J8 to J11)These are Phoenix 2.5 mm pitch connectors.Pin Service1 0 V2 SERIAL_TX_B3 SERIAL_TX_A4 SERIAL_RX/TX_B5 SERIAL_RX/TX_ATable 5 Serial Ports 2 and 3 Connectors1.6.IRIG B Connectors (J5 and J13)J5 and J13 Phoenix 2.5 mm pitch connectors.J5Pin Service1 IRIG-B122+2 IRIG-B122-J13Pin Service1 IRIG-B002-2 IRIG-B002+1. Description Trusted TMR Processor Interface AdapterTable 6 IRIG-B Connectors1.7.Mating ConnectorsThe following table lists the connectors required to mate with the Trusted Processor Interface Adapter.Connector Phoenix Contact Part No ICS Part No No of WaysJ5, J13 18 81 32 5 3JX073 2J2, J3, J6,J7,J12, J15, J17 18 81 33 8 3JX075 3J8,J9,J10,J11 18 81 35 4 3JX076 5Table 7 Mating ConnectorsTrusted TMR Processor Interface Adapter 2. Installation 2.InstallationFigure 3 Correct Installation PositionThe Adapter should be fitted on the rear of the chassis behind the Processor slots, as shown above. The two connectors should fit into the third and sixth slots from the right, where the Processor connectors will fit. In the correct position, two empty slots will be visible on the right. Insert the Adapter into position about 5 mm lower than its final position, and ensure it is slotted in on both sides. Raise the Adapter upwards until the retaining clips click into place.2. Installation Trusted TMR Processor Interface AdapterPage intentionally left blankTrusted TMR Processor Interface Adapter 3. Input Configuration 3.Input Configuration3.1.Serial PortsThe serial ports connectors are arranged so that multi-drop RS422/485 connections can be easily configured. J7, J8 and J10 together with LK1, LK2 and LK3 form the basic terminations for ports 1, 2 and 3 respectively.Port No. Serial In TerminationPort 1 J7 Fit LK1Port 2 J8 Fit LK2Port 3 J10 Fit LK3Table 8 Single Point ConnectionPort No. Serial In Serial OutPort 1 J7 J12Port 2 J8 J9Port 3 J10 J11Table 9 Multi-drop ConnectionFor a single point connection the termination would be made to the relevant connector and its corresponding link would be fitted. For a multi-drop connection the ‘incoming’ connections would be made to the connections listed above and the ‘outgoing’ to J12, J9 or J11 for ports 1 to 3 respectively. This time however, the link will be removed as only the last connection on a multi-drop chain should be terminated.The provision of the two connectors for each serial port will enable quicker configuration of serial cabling as there is now no need to terminate two cables onto the same connector. The links LK1 to LK3 provide the serial ports with an easy way to add 120 Ω AC termination onto the receivers extremely close to the receiving devices.The 4 wire serial ports 2 and 3 have connectors that are pin compatible with those used on the Trusted Communications Interface Termination Unit (T8153).Serial connections should use screened twisted pair cable with the A-B signals connected as a pair. The screen should be connected to chassis ground at one end only. Some equipment may require a common 0 V connection. In order to operate correctly, the 0 V on the connector should be connected to 0 V on the other equipment to facilitate this.3. Input Configuration Trusted TMR Processor Interface Adapter Note: RS485 bus biasing is implemented differently in the T8111 compared to legacy T8110. For more information and technical support, refer to the Rockwell Automation Support Centre:Further information on serial port configuration can be found in the standards listed below: •EIA/TIA-422-B•EIA-485•CCITT V.113.2.IRIG-B PortsThe IRIG-B002 input is a pulse width modulated signal at 100bits/s and uses RS422 voltage levels. Connection to this port should be by twisted pair cable. A 120 Ω termination (R13) is provided on the module. The termination resistance connects to the circuit by fitting LK4. For multi-drop configurations, remove LK4 from all but the last interface adapter.The IRIG-B122 input is a 1 kHz amplitude modulated signal where the modulating signal has the same format as IRIG-B002. The peak amplitude (mark) of the input signal is nominally 1 V to 6 V into 600 Ω. The Trusted TMR Processor is able to receive signals in the range 0.25 V PK-PK to 10 V PK-PK. IRIG-B122 is normally provide via co-axial cable although any suitable medium would be acceptable.Further information on IRIG configuration can be found in the standards listed below: •Range Commanders Council IRIG STANDARD 200-98•IEEE Std 1344-1995 Annex F.2Trusted TMR Processor Interface Adapter 4. Available Operations 4.Available OperationsThe following table lists the variants of the Trusted Processor Adapter Unit and the Trusted TMR Processor options that can be made available by using them. All the variants below will enable the use of Dual (‘enhanced’) Peer to Peer with other Trusted Systems, using the dxpnc40 I/O definition and its associated data transfer I/O definitions.Variant Options EnabledT8120 None.Basic module with terminations for serial ports and ancillary connections.T8121 IRIG-B.Enables decode of IRIG-B002 or IRIG-B122 time synchronisation signals by theTrusted TMR Processor.T8122 MODBUS Master.Enables the Trusted System to operate as MODBUS Master.See Note.T8123 IRIG-B and MODBUS Master.Enables IRIG-B time signal decode and MODBUS Master operation.Table 10 Available OptionsNote: The Trusted Communications Interface (T815X) is also required for MODBUS Master operation. The serial ports on the Trusted TMR Processor can only be used for MODBUS Slave operation.4. Available Operations Trusted TMR Processor Interface AdapterPage intentionally left blankTrusted TMR Processor Interface Adapter 5.Specifications 5.SpecificationsPower Supply Powered from Trusted TMR ProcessorPower Dissipation 0.1 WIsolationBetween; Rear Serial Ports, IRIG Ports, Relay Ports and Chassis 50 V Reinforced (continuous) (1) 250 V Basic (fault) (2)[Type tested at 2436 Vdc for 60 s]Fusing None PortsPort 1 Ports 2 and 3 IRIG B RS422/485RS422/485IRIG-B122 and IRIG-B002 on a single connectorOperating Temperature 0 °C to +60 °C (+32 °F to +140 °F)Storage Temperature -25 °C to +70 °C (-13 °F to +158 °F)Relative Humidity – Operating and Storage 10 % – 95 %, non-condensingEnvironmental Specifications Refer to Trusted 8000 - Series B: InternationalSafety & Environmental Approvals, publicationICSTT-TD003DimensionsHeight: 138 mm (5.43 in)Width: 120 mm (4.72 in)Depth: 108 mm (4.25 in)Weight 877 g (1.93 lb)Note 1) 50 Vrms Secondary circuit derived from Mains, OVC II up to 300V.Note 2) 250 Vrms Mains circuit, OVC II up to 300V. Exposure to voltages at these levels shall be temporally constrained consistent with the system MTTR.。

DSP2812实验指导书第三部分

第4章实验内容实验一编写一个以C语言为基础的DSP程序一．实验目的1．学习用标准C语言编制程序；了解常用的C语言程序设计方法和组成部分。

2．学习编制连接命令文件，并用来控制代码的连接。

3．学会建立和改变map文件，以及利用它观察DSP内存使用情况的方法。

4．熟悉使用软件仿真方式调试程序。

二．实验设备PC兼容机一台，操作系统为Windows2000(或Windows98，WindowsXP，以下默认为Windows2000)，安装Code Composer Studio 2.0软件。

三．实验原理1．标准C语言程序CCS支持使用标准C语言开发DSP应用程序。

当使用标准C语言编制的程序时，其源程序文件名的后缀应为.c (如：volume.c)。

CCS在编译标准C语言程序时，首先将其编译成相应汇编语言程序，再进一步编译成目标DSP 的可执行代码。

最后生成的是coff格式的可下载到DSP中运行的文件，其文件名后缀为.out。

由于使用C语言编制程序，其中调用的标准C的库函数由专门的库提供，在编译连接时编译系统还负责构建C运行环境。

所以用户工程中需要注明使用C的支持库。

2．命令文件的作用命令文件(文件名后缀为cmd)为链接程序提供程序和数据在具体DSP硬件中的位置分配信息。

通过编制命令文件，我们可以将某些特定的数据或程序按照我们的意图放置在DSP所管理的内存中。

命令文件也为链接程序提供了DSP外扩存储器的描述。

在程序中使用CMD文件描述硬件存储区，可以只说明使用部分，但只要是说明的，必须和硬件匹配，也就是只要说明的存储区必须是存在的和可用的。

3．内存映射(map)文件的作用一般地，我们设计、开发的DSP程序在调试好后，要固化到系统的ROM中。

为了更精确地使用ROM空间，我们就需要知道程序的大小和位置，通过建立目标程序的map文件可以了解DSP 代码的确切信息。

当需要更改程序和数据的大小和位置时，就要适当修改cmd文件和源程序，再重新生成map文件来观察结果。

SinOne SCT80S16B 10V CS 8 通道触控按键专用 IC 说明书

SCT80S16B SinOne10V CS 8通道触控按键专用IC 目录目录 (1)1 总体描述 (3)2 主要功能和优势 (3)2.1 功能 (3)2.2 优势 (3)3 管脚定义 (3)3.1 管脚配置 (3)3.2 管脚定义 (4)4 电气性能 (4)4.1 推荐工作条件 (4)4.2 直流电气特性 (4)5 封装信息 (5)6 应用设计指南 (6)6.1 未使用通道处理 (6)6.2 邻键距离 (6)6.3 通讯输出选择 (6)6.3.1 通讯输出选择OUTS (6)6.3.2 灵敏度设置和键值读取格式 (6)7 注意事项 (9)7.1 典型应用电路 (9)7.2 电路Check List (9)7.3 电源要求 (9)7.4 PCB布局 (9)7.5 PCB布线 (10)7.6 PCB参考图 (10)Page 1 of 11 V 1.17.7 触控面板材料选择 (10)8 规格更改记录 (11)1 总体描述SCT80S16B 是一颗有8个触控通道，带UART/IIC 通讯接口的触控专用IC ，用户可通过UART/IIC 通讯来设置灵敏度。

此IC 具有工业级规格，拥有4KV EFT 和6KV 接触ESD 能力，可顺利通过3V 动态和10V 静态CS 测试，是用户高性能触控按键方案的首选。

非常适合应用于大小家电、安防、工控等应用场合。

2 主要功能和优势2.1 功能● 工作电压：3.3V ~ 5.5V ● 工作温度：-40 ~ 85℃● 触控按键通道：8通道，最多支持两个按键同时被按下 ● 触控按键输出通讯协议：UART/IIC 输出 ● 灵敏度调节：UART/IIC 通讯调节● 上电2s 内可通过UART/IIC 通讯来设置触控通道灵敏度等级 ● 覆盖物厚度：0 ~ 10mm● 有效触摸反应时间：小于100ms ● 允许按键长按时间为10S ●封装：SOP162.2 优势● 发明专利，业界独创； ● 完美触控按键操作体验； ● 用户根据需要设置灵敏度；●超强抗干扰能力，4KV EFT 、6KV ESD 、10V CS 。

DSP2812开发板说明书

2．概述
2812开发板系统主要分为两部分，分别为硬件系统和相应的测试软件。
在开发板系统中主要集成了DSP、SRAM、FLASH、A/D、PWM、QEF、UART、SPI、CAN、USB、以太网、LCD接口等，这样能够使其应用在电机、电力、车载等工业控制领域。
相应的测试软件包括以下几部分：
DSP对片外SRAM和FLASH的操作示例 DSP对片内外设A/D的操作示例 DSP对片内外设定时器0和定时器2的操作示例 DSP对片内外设GPIO的操作示例 DSP对片内外设SPI的操作示例 DSP对片内外设MCBSP的操作示例 DSP对片内外设SCI的操作示例 DSP对片内外设CAN的操作示例 DSP对片内外设PWM的操作示例外部中断扩展示例 LED跑马灯示例 GUI图形接口示例 TCP/IP协议栈示例 HOST USB操作示例（选配） FAT文件系统示例（选配）
TMS320F2812的外部存储器接口包括：19位地址线，16位数据线，3个片选控制线及读写控制线。这3个片选线映射到5个存储区域，Zone0,Zone1,Zone2,Zone6和Zone7。其中， Zone0和Zone1共用1个片选线XCS0AND1，Zone6和Zone7共用1个片选线XCS6AND7。这5个存储区域可分别设置不同的等待周期。
第三章 TMS320F2812的基本系统
1．时钟电路
开发板用30MHz外部晶体给DSP提供时钟，并使能F2812 片上PLL电路。PLL倍频系数由PLL 控制寄存器PLLCR的低4位控制，可由软件动态的修改。外部复位信号（RS）可将此4位清零（CCS 中的复位命令将不能对这4位清零）。TMS320F2812的CPU最高可工作在150M的主频下，也即是对30M输入频率进行5倍频。

Get清风DSP2812引脚说明

DSP2812引脚说明表1-2 引脚功能和信号情况‡名字引脚号I/O/Z PU/PDS说明179针GHH 封装176针PGF封装128针PBK封装XMP/MC F1 17 —I PU 可选择微处理器/微计算机模式。

可以在两者之间切换。

为高电平时外部接口上的区域7有效，为低电平时区域7无效，可使用片内的Boot ROM功能。

复位时该信号被锁存在XINTCNF2存放器中，通过软件可以修改这种模式的状态。

此信号是异步输入，并与XTIMCLK同步XHOLD E7 159 —I PU 外部DMA保持请求信号。

XHOLD为低电平时请求XINTF释放外部总线，并把所有的总线与选通端置为高阻态。

当对总线的操作完成且没有即将对XINTF进行访问时，XINTF释放总线。

此信号是异步输入并与XTIMCLK同步XHOLDA K10 82 —O/Z —外部DMA保持确认信号。

当XINTF响应XHOLD的请求时XHOLDA呈低电平，所有的XINTF总线和选通端呈高阻态。

XHOLD和XHOLDA信号同时发出。

当XHOLDA有效〔低〕时外部器件只能使用外部总线1ANDXZCSP1 44 —O/Z —XINTF区域0和区域1的片选，当访问XINTF区域0或1时有效〔低〕2XZCS P13 88 —O/Z —XINTF区域2的片选。

当访问XINTF区域2时有效〔低〕7AND6XZCSB13 133 —O/Z —XINTF区域6和7的片选。

当访问区域6或7时有效〔低〕XWE N11 84 —O/Z —写有效。

有效时为低电平。

写选通信号是每个区域操作的根底，由XTIMINGx存放器的前一周期、当前周期和后一周期的值确定XRD M3 42 O/Z ——读有效。

低电平读选通。

读选通信号是每个区域操作的根底，由XTIMINGx存放器的前一周期、当前周期和后一周期的值确定。

注意：XRD和XWE是互斥信号XR/W N4 51 —O/Z —通常为高电平，当为低电平时表示处于写周期，当为高电平时表示处于读周期续表名字引脚号I/O/Z PU/PDS 说明179针GHH封装176针PGF封装128针PBK封装XREADY B6 161 —I PU 数据准备输入，被置1表示外设已为访问做好准备。

萤石智能照明-调光驱动器 CS-HAL-WC1-2CG 使用说明书

产品简介安装设备WC1是一款新型无线调光控制设备（以下简称“设备”），将设备关联到萤石网关并添加到“萤石云视频”客户端，配合0-10V调光驱动器和筒射灯一起使用，可以实现亮度和色温调节、联动控制等功能。

***RESET按键长按5秒：设备重置并进入添加模式装箱清单*指示灯蓝色快闪：进入添加模式蓝色慢闪：设备离线蓝色常亮：添加超时/退出添加模式下载“萤石云视频”设备添加本设备须搭配萤石Zigbee智能网关（以下简称“网关”）使用。

请先将网关添加至“萤石云视频”客户端，详情参见网关用户指南；然后将设备添加到网关。

方式一：扫描二维码添加登录“萤石云视频”客户端，选择添加设备，进入扫描二维码界面。

231确认您的手机处于联网状态。

方式二：通过网关本地添加根据网关用户指南操作，使网关进入添加模式。

1添加完成后，网关会有语音提示。

3登录“萤石云视频”客户端，选择添加设备，进入扫描二维码界面。

21扫描下面的二维码，下载并安装。

手机扫描二维码下载“萤石云视频”客户端用户指南×1调光控制器×1-20℃~50℃0%~95%RH Zigbee 3.0110-240V~，50/60Hz 工作温度工作湿度通讯方式电源电压IP20IP20防水等级防尘等级规格参数售后服务支持如果您在使用过程中遇到任何问题，您可以拨打服务热线或者联系在线客服。

服务热线：400- 878-7878您可以登录萤石官网查询售后服务站点。

萤石官网：您还可以添加萤石官方公众号，咨询在线客服。

上门安装服务连线示意图完成示意图萤石可提供有偿上门安装服务，请拨打服务热线400-878-7878查询提供安装服务的城市和收费，或者扫描下面的二维码，预约上门安装。

如果您购买的商品包安装服务，无需预约或者拨打服务热线，工作人员会主动联系您。

声明本产品为互联网设备，升级到官方最新软件版本，可使您获得更好的用户体验。

设备的具体参数、维修方法、使用范围等内容请登录萤石官网查询或联系客服。