7703402XA中文资料
HT7033A中文资料
HT70XXVoltage DetectorSelection TablePart No.Detectable VoltageHysteresis WidthTolerance HT7022A 2.2V 0.11V ±5%HT7024A 2.4V 0.12V ±5%HT7027A 2.7V 0.135V ±5%HT7033A 3.3V 0.165V ±5%HT7039A 3.9V 0.195V ±5%HT7044A 4.4V 0.22V ±5%HT7050A 5.0V 0.25V ±5%HT7070A 7.0V0.35V±5%Note:The output type selection codes are:NMOS open drain normal open,active lowFor example:The HT7070A is a 7.0V,NMOS open drain active low outputOutput type selection tableV DDV DD >V DET (+)V DD £V DET (-)TypeV OUT AHi-ZVSSRev.1.601January 14,2003General DescriptionThe HT70XX series is a set of three-terminal low power voltage detectors implemented in CMOS technology.Each voltage detector in the series detects a particular fixed voltage ranging from 2.2V to 7V.The voltage de-tectors consist of a high-precision and low power con-sumption standard voltage source,a comparator,hysteresis circuit,and an output driver.CMOS technol-ogy ensures low power consumption.Although designed primarily as fixed voltage detectors,these devices can be used with external components to detect user specified threshold voltages (NMOS open drain type only).Features·Low power consumption ·Low temperature coefficient·Built-in high-stability reference source·Built-in hysteresis characteristic ·TO-92&SOT-89packageApplications·Battery checkers ·Level selectors ·Power failure detectors·Microcomputer reset ·Battery memory backup·Non-volatile RAM signal storage protectorsBlock DiagramN channel open drain output(normal open;active low)A typePin AssignmentRev.1.602January14,2003Pad AssignmentHT70XX (except HT7022A)Chip size:1317´1158(m m)2*The IC substrate should be connected to VDD in the PCB layout artwork.HT7022A onlyChip size:2032´1321(m m)2*The IC substrate should be connected to VDD in the PCB layout artwork.Absolute Maximum RatingsSupply Voltage,except HT7022A..................................................................................................V SS -0.3V to V SS +26V Supply Voltage,HT7022A only....................................................................................................................-0.3V to13V Output Voltage...........................V SS -0.3V to V DD +0.3V Output Current......................................................50mA Storage Temperature............................-50°C to 125°C Power Consumption..........................................200mWOperating Temperature 0°C to 70°CNote:These are stress ratings only.Stresses exceeding the range specified under ²Absolute Maximum Ratings ²maycause substantial damage to the device.Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-ity.Rev.1.603January 14,2003Pad CoordinatesHT70XX (except HT7022A)Unit:m m Pad No.X Y 1-483.30-379.502-234.60-399.503443.90-386.00HT7022A onlyUnit:m mPad No.X Y1-434.34394.972120.65461.013774.70412.75Electrical CharacteristicsHT7022A Ta=25°CHT7024A Ta=25°CHT7027A Ta=25°CRev.1.604January14,2003HT7039A Ta=25°CHT7044A Ta=25°CRev.1.605January14,2003HT7070A Ta=25°CRev.1.606January 14,2003Functional DescriptionThe HT70XX series is a set of voltage detectors equipped with a high stability voltage reference which is connected to the negative input of a comparator ¾de-noted as V REF in the following figure for NMOS output voltage detector.When the voltage drop to the positive input of the com-parator (i,e,V B )is higher than V REF ,VOUT goes high,M1turns off,and V B is expressed as V BH =V DD ´(R B +R C )/(R A +R B +R C ).If V DD is decreased so that V B falls to a value less than V REF ,the comparator output in-verts from high to low,V OUT goes low,V C is high,M1turns on,RC is bypassed,and V B becomes:V BL =V DD ´R B /(R A +R B ),which is less than V BH.By so doing,the comparator output will stay low to prevent the circuit from oscillating when V B »V REF.If V DD falls below the minimum operating voltage,the output becomes undefined.When VDD goes from low to V DD ´R B /(R A +R B )>V REF ,the comparator output and V OUT goes high.The detectable voltage is defined as:V DET (-)=R R R R R A B CB C +++´V REFThe release voltage is defined as:V DET (+)=R R R A BB+´V REFThe hysteresis width is:V HYS=V DET(+)-V DET(-)The figure demonstrates the NMOS output type withpositive output polarity(V OUT is normally open,activelow).The HT70XX series also supplies options for otheroutput types with active high outputs.Application cir-cuits shown are examples of positive output polarity(normally open,active low)unless otherwise specified.NMOS output voltage detector(HT70XXA) Application CircuitsMicrocomputer reset circuitNormally a reset circuit is required to protect the micro-computer system from malfunctions due to power line interruptions.The following examples show how differ-ent output configurations perform a reset function in var-ious systems.·NMOS open drain output application for separate power supply·NMOS open drain output application with R-C delayPower-on reset circuitWith several external components,the NMOS open drain type of the HT70XX series can be used to perform a power-on reset function as shown:Rev.1.607January14,20035V power line monitoring circuitGenerally,a minimum operating voltage of4.5V is guar-anteed in a5V power line system.The HT7044A is rec-ommended for use as5V power line monitoring circuit.·5V power line monitor with power-on reset·with5V voltage regulatorChange of detectable voltageIf the required voltage is not found in the standard prod-uct selection table,it is possible to change it by using ex-ternal resistance dividers or diodes.·Varying the detectable voltage with a resistance di-viderDetectable voltage=R RRA BB+´V DETHysteresis width=R RRA BB+´V HYS·Varying the detectable voltage with a diodeDetectable Voltage=V f1+V f2+V DETMalfunction analysisThe following circuit demonstrates the way a circuit ana-lyzes malfunctions by monitoring the variation or spikenoise of power supply voltage.Charge monitoring circuitThe following circuit shows a charged monitor for pro-tection against battery deterioration by overcharging.When the voltage of the battery is higher than the set de-tectable voltage,the transistor turns on to bypass thecharge current,protecting the battery from overcharg-ing.Rev.1.608January14,2003Level selectorThe following diagram illustrates a logic level selector.Rev.1.609January14,2003Package Information3-pin TO-92outline dimensionsSymbolDimensions in milMin.Nom.Max.A170¾200B170¾200C500¾¾D11¾20E90¾110F45¾55G45¾65H130¾160I8¾18a4°¾6°Rev.1.6010January14,20033-pin SOT-89outline dimensionsSymbolDimensions in milMin.Nom.Max.A173¾181B64¾72C90¾102D35¾47E155¾167F14¾19G17¾22H¾59¾I55¾63J14¾17Rev.1.6011January14,2003Product Tape and Reel SpecificationsTO-92reel dimensions(Unit:mm)Rev.1.6012January14,2003SOT-89reel dimensionsSOT-89Symbol Description Dimensions in mmA Reel Outer Diameter180±1.0B Reel Inner Diameter62±1.5C Spindle Hole Diameter12.75+0.15D Key Slit Width 1.9±0.15T1Space Between Flange12.4+0.2T2Reel Thickness17-0.4Rev.1.6013January14,2003TO-92Symbol Description Dimensions in mm I1Taped Lead Length(2.5)P Component Pitch12.7±1.0P0Perforation Pitch12.7±0.3P2Component to Perforation(Length Direction) 6.35±0.4F1Lead Spread 2.5+0.4-0.1F2Lead Spread 2.5+0.4-0.1D h Component Alignment0±0.1W Carrier Tape Width 18.0+1.0-0.5W0Hold-down Tape Width 6.0±0.5W1Perforation Position9.0±0.5W2Hold-down Tape Position(0.5)H0Lead Clinch Height16.0±0.5H1Component Height Less than24.7D0Perforation Diameter 4.0±0.2t Taped Lead Thickness0.7±0.2H Component Base Height19.0±0.5Note:Thickness less than0.38±0.05mm~0.5mmP0Accumulated pitch tolerance:±1mm/20pitches.()Bracketed figures are for consultation onlyRev.1.6014January14,2003SOT-89Symbol Description Dimensions in mmW Carrier Tape Width 12.0+0.3-0.1P Cavity Pitch8.0±0.1E Perforation Position 1.75±0.1F Cavity to Perforation(Width Direction) 5.5±0.05D Perforation Diameter 1.5+0.1D1Cavity Hole Diameter 1.5+0.1P0Perforation Pitch 4.0±0.1P1Cavity to Perforation(Length Direction) 2.0±0.10A0Cavity Length 4.8±0.1B0Cavity Width 4.5±0.1K0Cavity Depth 1.8±0.1t Carrier Tape Thickness0.30±0.013C Cover Tape Width9.3Rev.1.6015January14,2003Holtek Semiconductor Inc.(Headquarters)No.3,Creation Rd.II,Science-based Industrial Park,Hsinchu,TaiwanTel:886-3-563-1999Fax:886-3-563-1189Holtek Semiconductor Inc.(Sales Office)11F,No.576,Sec.7Chung Hsiao E.Rd.,Taipei,TaiwanTel:886-2-2782-9635Fax:886-2-2782-9636Fax:886-2-2782-7128(International sales hotline)Holtek Semiconductor(Shanghai)Inc.7th Floor,Building2,No.889,Yi Shan Rd.,Shanghai,ChinaTel:021-6485-5560Fax:021-6485-0313Holtek Semiconductor(Hong Kong)Ltd.RM.711,Tower2,Cheung Sha Wan Plaza,833Cheung Sha Wan Rd.,Kowloon,Hong KongTel:852-2-745-8288Fax:852-2-742-8657Holmate Semiconductor,Inc.48531Warm Springs Boulevard,Suite413,Fremont,CA94539Tel:510-252-9880Fax:510-252-9885CopyrightÓ2003by HOLTEK SEMICONDUCTOR INC.The information appearing in this Data Sheet is believed to be accurate at the time of publication.However,Holtek as-sumes no responsibility arising from the use of the specifications described.The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification,nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise.Holtek reserves the right to alter its products without prior notification.For the most up-to-date information,please visit our web site at .Rev.1.6016January14,2003。
S7700系列提供S7703
S7700系列提供S7703、S7706、S7712三种产品具体订购信息如下:S7700基本描述LE0BN66EDC N66E直流总装机柜(共4路40A输出,单路最大1600W,600X600X2200mm) LE0BN66EAC N66E交流总装机柜(共8路10A输出,单路最大1600W,600X600X2200mm) LE2BN66EA000 N66E交流总装机柜(共4路16A输出,单路最大2500W,600X600X2200mm) ES0B00770300 S7703总装机箱ES0B00770600 S7706总装机箱ES0B00771200 S7712总装机箱ES1BS7703S01 S7703总装机箱-支持FCCES1BS7706S01 S7706总装机箱-支持FCCES1BS7712S01 S7712总装机箱-支持FCCES0B017706P0 S7706 POE总装机箱ES0B017712P0 S7712 POE总装机箱ES1BS7706SP1 S7706 POE总装机箱-支持FCCES1BS7712SP1 S7712 POE总装机箱-支持FCCLE0M00FBXB00 宽电压68风机盒ES1M00FBX001 增强型宽电压68风机盒监控板LE0DCMUA0000 集中监控板主控处理单元ES0D00MCUA00 S7703 主控处理单元AES0D00SRUA00 S7706/S7712 主控处理单元AES0D00SRUB00 S7706/S7712 主控处理单元B-时钟ES1D2SRUD000 S7706/S7712 主控处理单元D-可选配时钟业务子卡ES0D00FSUA00 增强灵活业务子卡ES02VSTSA 集群业务子卡百兆以太网电接口板ES0D0F48TA00 48端口百兆以太网电接口板(EA,RJ45)ES0DF48TFA00 48端口百兆以太网电接口板(FA,RJ45)ES0D0F48TC00 48端口百兆以太网电接口板(EC,RJ45)十兆/百兆/千兆以太网电接口板ES0DG24TFA00 24端口十兆/百兆/千兆以太网电接口板(FA,RJ45)ES0D0G48TA00 48端口十兆/百兆/千兆以太网电接口板(EA,RJ45)ES0DG48TFA00 48端口十兆/百兆/千兆以太网电接口板(FA,RJ45)ES0D0G48TC00 48端口十兆/百兆/千兆以太网电接口板(EC,RJ45)ES1D2G48TED0 48端口十兆/百兆/千兆以太网电接口板(ED,RJ45)ES1D2G48TBC0 48端口十兆/百兆/千兆以太网电接口板(BC,RJ45)ES0D0T24XA00 24端口十兆/百兆/千兆以太网电接口和2端口万兆以太网光接口板(EA,RJ45/XFP) ES1D2G48TX1E 48端口十兆/百兆/千兆以太网电接口板(X1E,RJ45)百兆/千兆以太网光接口板ES0D0G24SA00 24端口百兆/千兆以太网光接口板(SA,SFP)ES0D0G24SC00 24端口百兆/千兆以太网光接口板(EC,SFP)ES0D0G24CA00 24端口百兆/千兆以太网光接口和8端口百兆/千兆Combo电接口板(SA,SFP/RJ45) ES0D0S24XA00 24端口百兆/千兆以太网光接口和2端口万兆以太网光接口板(EA,SFP/XFP)ES1D2S24XEC0 24端口百兆/千兆以太网光接口和2端口万兆以太网光接口板(EC,SFP/XFP)ES1D2G24SED0 24端口百兆/千兆以太网光接口板(ED,SFP)ES0D0G48SA00 48端口百兆/千兆以太网光接口板(EA,SFP)ES0D0G48SC00 48端口百兆/千兆以太网光接口板(EC,SFP)ES1D2G48SFA0 48端口百兆/千兆以太网光接口板(FA,SFP)ES1D2G48SED0 48端口百兆/千兆以太网光接口板(ED,SFP)ES1D2G48SBC0 48端口百兆/千兆以太网光接口板(BC,SFP)*ES1D2G48SX1E 48端口百兆/千兆以太网光接口板(X1E,SFP)百兆/千兆以太网光电混合接口板ES0DG48CEAT0 36端口百兆/千兆以太网电接口和12端口百兆/千兆以太网光接口板(EA,RJ45/SFP) 万兆以太网光接口板ES0D0X2UXA00 2端口万兆以太网光接口板(EA,XFP)ES0D0X2UXC00 2端口万兆以太网光接口板(EC,XFP)ES1D2X02XEC1 2端口万兆以太网光接口板(EC,XFP)-支持FCCES0D0X4UXA00 4端口万兆以太网光接口板(EA,XFP)ES0D0X4UXC00 4端口万兆以太网光接口板(EC,XFP)ES1D2X04XEC1 4端口万兆以太网光接口板(EC,XFP)-支持FCCES1D2X04XED0 4端口万兆以太网光接口板(ED,XFP)ES1D2S04SX1E 4端口万兆光接口和24端口百兆/千兆光接口和8端口十兆/百兆/千兆combo电接口板(X1E,RJ45/SFP/SFP+)ES1D2X08SED4 8端口万兆以太网光接口板(ED,SFP+)ES1D2X08SED5 8端口万兆以太网光接口板(ED,SFP+)-支持FCCES1D2S08SX1E 8端口万兆光接口和8端口百兆/千兆光接口和8端口十兆/百兆/千兆combo电接口板(X1E,RJ45/SFP/SFP+)ES0D0X12SA00 12端口万兆以太网光接口板(SA,SFP+)ES1D2X16SFC0 16端口万兆以太网光接口板(FC,SFP+)ES1D2X40SFC0 40端口万兆以太网光接口板(FC,SFP+)40GE以太网光接口板ES1D2L02QFC0 2端口40GE以太网光接口板(FC,QSFP+)ES1D2L08QSC0 8端口40GE以太网光接口板(SC,QSFP+)POE接口板ES0D0G48VA00 48端口百兆/千兆以太网POE电接口板(EA,RJ45,POE)增值业务板LE0D0VAMPA00 增值业务板**EH1D2PS00P00 开放业务平台单板***ET1D2FW00S00 下一代防火墙业务处理板A-含华为通用安全平台软件ET1D2FW00S01 下一代防火墙业务处理板B-含华为通用安全平台软件ET1D2FW00S02 下一代防火墙业务处理板C-含华为通用安全平台软件ET1D2IPS0S00 入侵防御和入侵检测业务处理板A-含华为通用安全平台软件ACU2 WLAN ACU2无线接入控制板(含128 AP控制资源)光模块FE-SFP光模块S-SFP-FE-LH40-SM1310 光模块-eSFP-FE-单模模块(1310nm,40km,LC)S-SFP-FE-LH80-SM1550 光模块-eSFP-FE-单模模块(1550nm,80km,LC)SFP-FE-SX-MM1310 光模块-SFP-100M/155M-多模模块(1310nm,2km,LC)eSFP-FE-LX-SM1310 光模块-eSFP-100M/155M-单模模块(1310nm,15km,LC)GE-SFP模块SFP-1000BaseT 电模块-SFP-GE-电接口模块(100m,RJ45)eSFP-GE-SX-MM850 光模块-eSFP-GE-多模模块(850nm,0.5km,LC)SFP-GE-LX-SM1310 光模块-SFP-GE-单模模块(1310nm,10km,LC)S-SFP-GE-LH40-SM1310 光模块-eSFP-GE-单模模块(1310nm,40km,LC)S-SFP-GE-LH40-SM1550 光模块-eSFP-GE-单模模块(1550nm,40km,LC)S-SFP-GE-LH80-SM1550 光模块-eSFP-GE-单模模块(1550nm,80km,LC)eSFP-GE-ZX100-SM1550 光模块-eSFP-GE-单模模块(1550nm,100km,LC)10GE-XFP光模块XFP-SX-MM850 光模块-XFP-10G-多模模块(850nm,0.3km,LC)XFP-STM64-LX-SM1310 光模块-XFP-10G-单模模块(1310nm,10km,LC)XFP-STM64-LH40-SM1550 光模块-XFP-10G-单模模块(1550nm,40km,LC)XFP-STM64-SM1550-80km 光模块-XFP-10G-单模模块(1550nm,80km,LC)10GE-SFP+光模块OMXD30000 光模块-SFP+-10G-多模模块(850nm,0.3km,LC)OSX010000 光模块-SFP+-10G-单模模块(1310nm,10km,LC)OSX040N01 光模块-SFP+-10G-单模模块(1550nm,40km,LC)OSXD22N00 光模块-SFP+-10G-多模模块(1310nm,0.22km,LC,LRM)LE2MXSC80FF0 光模块-SFP+-10G-单模模块(1550nm,80km,LC)SFP-10G-USR 光模块-SFP+-10G-多模模块(850nm,0.1km,LC)SFP-10G-ZR 光模块-SFP+-10G-单模模块(1550nm,80km,LC)SFP-10G-BXU1 10GBase-BIDI单纤双向光模块-SFP-10G-单模模块(TX1270nm/RX1330nm,10km,LC) SFP-10G-BXD1 10GBase-BIDI单纤双向光模块-SFP-10G-单模模块(TX1330nm/RX1270nm,10km,LC) SFP-10G-AOC3M AOC光模块-SFP+-850nm-1G~10G-0.003kmSFP-10G-AOC10M AOC光模块-SFP+-850nm-1G~10G-0.01kmSFP-10G-ZCW1511 光模块-SFP+-10G-单模模块(CWDM,1511nm,70km,LC)SFP-10G-ZCW1471 光模块-SFP+-10G-单模模块(CWDM,1471nm,70km,LC)SFP-10G-ZCW1491 光模块-SFP+-10G-单模模块(CWDM,1491nm,70km,LC)SFP-10G-ZCW1531 光模块-SFP+-10G-单模模块(CWDM,1531nm,70km,LC)SFP-10G-ZCW1551 光模块-SFP+-10G-单模模块(CWDM,1551nm,70km,LC)SFP-10G-ZCW1571 光模块-SFP+-10G-单模模块(CWDM,1571nm,70km,LC)SFP-10G-ZCW1591 光模块-SFP+-10G-单模模块(CWDM,1591nm,70km,LC)SFP-10G-ZCW1611 光模块-SFP+-10G-单模模块(CWDM,1611nm,70km,LC)40GE-QSFP+光模块QSFP-40G-SR4 光模块-QSFP+-40G-多模模块(850nm,0.15km,MPO)QSFP-40G-iSR4 40GBase-SR4光模块-QSFP+-40G-多模模块(850nm,0.15km,MPO) (可对接4个SFP+) QSFP-40G-LR4 40GBase-LR4光模块-QSFP+-40G-单模模块(1310nm,10km,LC)QSFP-40G-eiSR4 40GBase-eSR4光模块-QSFP+-40G-多模模块(850nm,0.3km,MPO) (可对接4个SFP+) BIDI-SFP光模块SFP-FE-LX-SM1310-BIDI 光模块-eSFP-FE-BIDI单模模块(TX1310/RX1550,15km,LC)SFP-FE-LX-SM1550-BIDI 光模块-eSFP-FE-BIDI单模模块(TX1550/RX1310,15km,LC)SFP-GE-LX-SM1310-BIDI 光模块-eSFP-GE-BIDI单模模块(TX1310/RX1490,10km,LC)SFP-GE-LX-SM1490-BIDI 光模块-eSFP-GE-BIDI单模模块(TX1490/RX1310,10km,LC)SFP-GE-BXU1-SC 1000Base-BIDI单纤双向光模块-SFP-GE-单模模块(TX1490nm/RX1310nm,10km,SC) LE2MGSC40ED0 光模块-SFP-GE-BIDI单模模块(TX1490/RX1310,40km,LC)LE2MGSC40DE0 光模块-SFP-GE-BIDI单模模块(TX1310/RX1490,40km,LC)电源LE0MPSD16 1600W直流电源模块(灰色)LE0MPSA08 800W交流电源模块(灰色)W0PSA2200 2200W交流电源模块(灰色)LE0W01DPDB 直流配电盒组件(共4路40A输出,单路最大1600W,含电源线)IN6W18L10A 交流分线盒组件(共8路10A输出,单路最大1600W,含电源线)IM1W24APD 交流分线盒组件(共4路16A输出,单路最大2500W,含电源线)软件ES0SMS217700 S7700基本软件,V200R001ES0SMS227700 S7700基本软件,V200R002ES1SBSM23000 S7700基本软件,V200R003ES1SBSM25000 S7700基本软件,V200R005ES0SMPLS7700 MPLS功能授权ES0SNQAF7700 NQA功能授权ES0SIPV67700 IPV6功能授权ES1SFIB128K0 X系列单板FIB资源授权-128KES1SWL512AP0 WLAN无线接入控制器AP资源授权-512AP(配合X系列单板使用) ES1SWL128AP0 WLAN无线接入控制器AP资源授权-128AP(配合X系列单板使用) ES1SWL64AP00 WLAN无线接入控制器AP资源授权-64AP(配合X系列单板使用) ES1SWL16AP00 WLAN无线接入控制器AP资源授权-16AP(配合X系列单板使用) ES1SPPPOE4K0 PPPoE接入用户资源授权-4K(配合X系列单板使用)ES1SPPPOE8K0 PPPoE接入用户资源授权-8K(配合X系列单板使用)ES1SPPPOE16K PPPoE接入用户资源授权-16K(配合X系列单板使用)L-ACU2-128AP ACU2无线接入控制器AP资源授权(128 AP)资料ES0I000DOC00 S7700 智能路由交换机产品文档*:BC系列板卡支持每端口200ms数据缓存。
G697LXXXTOU中文资料
Microprocessor Reset ICFeaturesPrecision Monitoring of +3V, +3.3V, and +5VPower-Supply VoltagesFully Specified Over Temperature Available in Three Output ConfigurationsPush-Pull RESET Output (G696L) Push-Pull RESET Output (G696H) Open-Drain RESET Output (G697L)Externally Programmable Time Delay Generator 14µA Supply CurrentGuaranteed Reset Valid to V CC = 0.8V Power Supply Transient Immunity5 pin SOT-23-5 or TSOT-23-5 Packages 2% Threshold AccuracyApplicationsComputers ControllersIntelligent InstrumentsCritical µP and µC Power Monitoring Portable / Battery-Powered Equipment AutomotiveGeneral DescriptionThe G696/G697 are microprocessor (µP) supervisory circuits used to monitor the power supplies in µP and digital systems. They provide excellent circuit reliability and low cost and adjustments when used with +5V, +3.3V, +3.0V- powered circuits.These circuits perform a single function: they assert a reset signal whenever the V CC supply voltage declines below a preset threshold, with hysteresis keeping it asserted for time delay determined by externally pro-grammable time delay generator after V CC has risen above the reset threshold. Reset thresholds suitable for operation with a variety of supply voltages are available.The G697L has an open-drain output stage, while the G696 have push-pull outputs. The G697L ’s open-drain RESET output requires a pull-up resistor that can be connected to a voltage higher than V CC . The G696L have an active-low RESET output, while the G696H has an active-high RESET output. The reset com-parator is designed to ignore fast transients on V CC , and the outputs are guaranteed to be in the correct logic state for V CC down to 0.8V.Low supply current makes the G696/G697 ideal for use in portable equipment. The G696/G697 are avail-able in 5-pin SOT23-5 or TSOT-23-5 packages.Pin Configuration Typical Application Circuit(RESET)RESET VCCSOT-23-5/TSOT-23-5NCGNDCD()is for G696H*G697 ONLYV COrdering InformationORDER NUMBER ORDER NUMBER(Pb free)TEMP. RANGE PACKAGEG696HxxxT1U G696HxxxT1Uf -40°C ~ +105°C SOT-23-5 G696LxxxT1U G696LxxxT1Uf -40°C ~ +105°C SOT-23-5 G697LxxxT1U G697LxxxT1Uf -40°C ~ +105°C SOT-23-5 G696HxxxTOU G696HxxxTOUf -40°C ~ +105°C TSOT-23-5 G696LxxxTOU G696LxxxTOUf -40°C ~ +105°C TSOT-23-5 G697LxxxTOU G697LxxxTOUf -40°C ~ +105°C TSOT-23-5 Note: T1: SOT-23-5 TO: TSOT-23-5U: Tape & Reel* xxx specifies the threshold voltage.e.g. 263 denotes the 2.64V threshold voltage.Selector GuideTO: TSOT-23-5Absolute Maximum RatingsTerminal Voltage (with respect to GND)V CC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V Delay Capacitor Pin Voltage, V CD. . -0.3 to (V CC +0.3V) RESET,RESET(push-pull) . . . . .-0.3V to (V CC + 0.3V) RESET(open drain). . . . . . . . . . . . . . . -0.3V to +6.0V Input Current, V CC . . . . . . . . . . . . . . . . . . . . . . . 20mA Output Current, RESET, RESET. . . . . . . . . . . 20mA Operating Temperature Range. . . . . .-40°C to +105°C Storage Temperature Range . . . . . . .-65°C to +150°C Reflow Temperature (soldering, 10sec) . . . .. . . 260°CStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Electrical Characteristics(V CC = full range, T A = -40°C to +105°C, unless otherwise noted. Typical values are at T A = +25°C, V CC = 5V for 463/438/400/330 versions, V CC= 3.3V for 308/293 versions, and V CC = 3V for 263/250 version.) (Note 1)ATypical Operating Characteristics(V CC = full range, T A = -40°C to +105°C, unless otherwise noted. Typical values are at T A = +25°C, V CC = 5V for 463/438/400/330 versions, V CC = 3.3V for 308/293 versions, and V CC = 3V for 263/250 version.)0.960.970.980.9911.011.021.031.041.051.06-40-30-20-1010202730405060708090T A , Ambient Temperature (°C)N o r m a l i z e d O r m a l i z e d V T H + , V T H -(V )Supply Current vs. VCC1234567800.61 1.21.51.82.12.42.73 3.23.33.43.53.73.94 4.55 5.56V CC (V)S u p p l y C u r r e n t (µA )Normalized Reset Threshold vs. Temperature0.11101001000100000.00010.0010.010.11CD, Delay P in Capacitance (µF)O u t p u t T i m e D e l a y (µS )Output Time Delay vs. Capacitance(V CC<VTH to output change)0.11101001000100000.00010.0010.010.11CD, Delay P in Capacitance (µF)O u t p u t T i m e D e l a y (m S )01234567-40-20020406080Temperature (°C)S u p p l y C u r r e n t (µA )Supply Curremt vs. Temperature (No Load)Output Time Delay vs. Capacitance(VCC>VTH to output change)Typical Operating Characteristics (continued)Recommended Minimum Footprint 050100150200250300-40-30-20-100102030405060708090T A, Ambient Temperature (°C)O u t p u t T i m e D e l ay (m s )Reset Output Time Delay vs. Temperature SOT-23-5 / TSOT-23-5Timing DiagramFigure 1Functional DiagramFigure 2V C C V TH +V TH -V C CV C CV C CV TH -V TH -0V0Vt D 2V C C , P in 2C D , P in 50.675 V INR eset O utput (A ctive Low ), P in 1R eset O utput (A ctive H igh), P in 1() is for G696HPin DescriptionDetailed DescriptionA microprocessor ’s (µP ’s) reset input starts the µP in a known state. The G697L/G696L/G696H assert reset to prevent code-execution errors during power-up,power-down, or brownout conditions. They assert areset signal whenever the V CC supply voltage declinesbelow a preset threshold (V TH-), keeping it asserted fortime delay set by capacitor connected to C D pin, after V CC has risen above the high reset threshold V TH+(V TH-+V HYS ). The G697L uses an open-drain output,and the G696L/G696H have a push-pull output stage.Connect a pull-up resistor on the G697L ’s RESET out-put to any supply between 0 and 5.5V. The time delay is set by external capacitor C D , and internal pull up current I CD . When the voltage at C D pin exceeds the buffer threshold, typically 1.25V, the RESET output high (RESET output low). The volt-age detector and buffer have built-in hysterisis to prevent erratic reset operation. The formula of time delay is T (ms) ≅ 1685 C D (µF). Fig1 and Fig2 show a timing deagram and a Functional Block.Figure3. RESET Valid to V CC = Ground CircuitEnsuring a Valid Reset Output Down to VCC = 0When V CC falls below 0.8V, the G696 RESET output no longer sinks current-it becomes an open circuit. Therefore, high-impedance CMOS logic inputs con-nected to RESET can drift to undetermined voltages. This presents no problem in most applications since most µP and other circuitry is inoperative with VCC below 0.8V. However, in applications where RESETmust be valid down to 0V, adding a pull-down resistor to RESET causes any stray leakage currents to flow to ground, holding RESET low (Figure 4). R1’s valueis not critical ; 100k Ω is large enough not to loadRESET and small enough to pull RESET to ground. A 100k Ω pull-up resistor to V CC is also recommended for the G697L if RESET is required to remain validfor V CC < 0.8V.Figure 4. Interfacing to µPs with Bidirectional Re-set I/OFigure 5. G697L Open-Drain RESET Output AllowsUse with Multiple SuppliesVInterfacing to µPs with Bidirectional Reset Pins Since the RESET output on the G697L is open drain, this device interfaces easily with µPs that have bidirec-tional reset pins, such as the Motorola 68HC11. Con-necting the µP supervisor’s RESET output directly to the microcontroller’s (µC’s) RESET pin with a single pull-up resistor allows either device to assert reset (Figure 5).G697L Open-Drain RESET Output Allows Use with Multiple SuppliesGenerally, the pull-up connected to the G697L will connect to the supply voltage that is being monitored at the IC’s V CC pin. However, some systems may use the open-drain output to level-shift from the monitored supply to reset circuitry powered by some other supply (Figure 6). Note that as the G697L’s V CC decreases below 1V, so does the IC’s ability to sink current at RESET. Also, with any pull-up, RESET will be pulled high as VCC decays toward 0. The voltage where this occurs depends on the pull-up resistor value and the voltage to which it is connected.Benefits of Highly Accurate Reset ThresholdMost µP supervisor ICs have reset threshold voltages between 5% and 10% below the value of nominal supply voltages. This ensures a reset will not occur within 5% of the nominal supply, but will occur when the supply is 10% below nominal.When using ICs rated at only the nominal supply ±5%, this leaves a zone of uncertainty where the supply is between 5% and 10% low, and where the reset may or may not be asserted.The G69_ _463/G69_ _308 use highly accurate circuitry to ensure that reset is asserted close to the 5% limit, and long before the supply has declined to 10% below nominal.Package InformationSOT-23-5 (T1) PackageNote:1. Package body sizes exclude mold flash protrusions or gate burrs2. Tolerance ±0.1000 mm (4mil) unless otherwise specified3. Coplanarity: 0.1000mm4. Dimension L is measured in gage planeDIMENSION IN MM DIMENSION IN INCHSYMBOLMIN. NOM. MAX. MIN. NOM. MAX.A 1.00 1.10 1.30 0.039 0.043 0.051 A1 0.00 ----- 0.10 0.000 ----- 0.004A2 0.70 0.80 0.90 0.028 0.031 0.035 b 0.35 0.40 0.50 0.014 0.016 0.020 C 0.10 0.15 0.25 0.004 0.006 0.010 D 2.70 2.90 3.10 0.106 0.114 0.122 E 1.40 1.60 1.80 0.055 0.0630.071 e ----- 1.90(TYP) ----- ----- 0.075(TYP) ----- e1 ----- 0.95 ----- ----- 0.037 ----- H 2.60 2.80 3.00 0.102 0.110 0.118 L 0.37 ------ ----- 0.015 ----- ----- θ1 1° 5° 9° 1° 5° 9°5.Ver: 1.8May 10, 2006TEL: 886-3-578883311 G696/G697Global Mixed-mode Technology Inc.TSOT-23-5 (TO) PackageNote:6. Package body sizes exclude mold flash protrusions or gate burrs7. Tolerance ±0.1000 mm (4mil) unless otherwise specified8. Coplanarity: 0.1000mm9. Dimension L is measured in gage planeDIMENSION IN MM DIMENSION IN INCHSYMBOL MIN. NOM. MAX. MIN. NOM. MAX. A ----- ----- 1.00 ----- ----- 0.039 A1 0.00 ----- 0.10 0.000 ----- 0.004 A2 ----- ----- 0.90 ----- ----- 0.035 b 0.35 0.40 0.50 0.014 0.016 0.020C 0.10 0.15 0.25 0.004 0.006 0.010D 2.70 2.90 3.10 0.106 0.114 0.122E 1.40 1.60 1.80 0.055 0.0630.071 e ----- 1.90(TYP) ----- ----- 0.075(TYP) ----- e1 ----- 0.95 ----- ----- 0.037 ----- H 2.60 2.80 3.00 0.102 0.110 0.118 L 0.37 ------ ----- 0.015 ----- ----- θ1 1° 5° 9° 1° 5° 9°Taping SpecificationPACKAGE Q ’TY/REEL SOT-23-5 3,000 eaTSOT-23-5 3,000 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Feed Direction TSOT-23-5、SOT-23-5 Package Orientation元器件交易网。
CS8402A中文资料
Specifications are subject to change without notice.
2
DS60F1
元器件交易网
CS8401A CS8402A
DIGITAL CHARACTERISTICS - RS422 DRIVERS
(TXP, TXN pins only; VD+ = 5V ±10%)
元器件交易网
Semiconductor Corporation
CS8401A CS8402A
Digital Audio Interface Transmitter
Features
General Description
• Monolithic Digital Audio Interface
3. The ’-CP’ and ’-CS’ parts are specified to operate over 0 to 70 °C but are tested at 25 °C only. The ’-IP’ and ’-IS’ parts are tested over the full -40 to 85 °C temperature range.
RD/WR low (writing)
tcsdhw
0
CS falling to DATA valid
RD/WR high (reading)
tcsddr
35
CS rising to DATA Hi-Z
RD/WR high (reading)
tcsdhr
5
A4 - A0
CS
RD/WR Writing
D7 - D0
The CS8401/2A are monolithic CMOS devices which encode and transmit audio data according to the
24位1 MSPS超低功耗转换器AD7702Data Sheet说明书
Information their respective owners.Rev. Gfurnished by Analog Devices is believed to be accurate and reliable. However , no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Speci cations subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property ofOne Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 Fax: 781.461.3113 ©2000–2011 Analog Devices, Inc. All rights reserved.引脚配置01525-001OUT A 1V–2+IN 3V+5–IN4AD8601TOP VIEW (Not to Scale)图1. 5引脚SOT-23(RJ 后缀)OUT A 1–IN A 2+IN A 3V–4V+8OUT B 7–IN B6+IN B5AD8602TOP VIEW (Not to Scale)01525-002图2. 8引脚MSOP(RM 后缀)和8引脚SOIC(R 后缀)01525-0031234567AD8604–IN A +IN A V+OUT B –IN B +IN B OUT A 141312111098–IN D +IN D V–OUT C–IN C +IN C OUT D TOP VIEW (Not to Scale)图3. 14引脚TSSOP(RU 后缀)和14引脚SOIC(R 后缀)12345678161514131211109–IN A +IN A V+OUT B–IN B +IN B OUT A –IN D+IN D V–OUT CNCNCNC = NO CONNECT–IN C +IN C OUT D TOP VIEW (Not to Scale)AD860401525-004图4. 16引脚紧缩小型封装QSOP(RQ 后缀)ADI 中文版数据手册是英文版数据手册的译文,敬请谅解翻译中可能存在的语言组织或翻译错误,ADI 不对翻译中存在的差异或由此产生的错误负责。
ZXMD63N02XTA;ZXMD63N02XTC;中文规格书,Datasheet资料
DUAL 20V N-CHANNEL ENHANCEMENT MODE MOSFETProduct SummaryV (BR)DSSR DS(ON) Package I DT A = +25°C(Notes 5 & 6)20V130m Ω @ V GS = 4.5VMSOP-82.5A150m Ω @ V GS = 2.7V2.3ADescriptionThis MOSFET has been designed to minimize the on-state resistance (R DS(on)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.Applications• DC-DC Converters• Power Management functions • Motor Control • Disconnect SwitchesFeatures• Low On-Resistance • Low Threshold • Fast Switching Speed • Low Gate Drive• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • Qualified to AEC-Q101 Standards for High ReliabilityMechanical Data• Case: MSOP-8 • Case Material: Molded Plastic, “Green” Molding Compound.UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Matte Tin Finish •Weight: 0.008 grams (approximate)Ordering Information (Note 4)Product Marking Reel size (inches) Tape width (mm)Quantity per reelZXMD63N02XTA ZXM63N02 7 12 1,000 ZXMD63N02XTC ZXM63N02 1312 4,000Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.2. See for more information about Diodes Incorporated’s definitions of Halogen and Antimony free,"Green" and Lead-Free.3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at Marking Informatione3Top ViewMSOP8Device SymbolTop View Pin-OutZXM63N02 = Product type Marking CodeMaximum Ratings(@T A = +25°C, unless otherwise specified.)Characteristic Symbol Value UnitDrain-Source Voltage V DSS20 V Gate-Source Voltage V GSS±12 VContinuous Drain Current SteadyState@ V GS = 10V;T A= +25°C (Note 5 & 6)@ V GS = 10V;T A= +70°C (Note 5 & 6)@ V GS = 10V;T A= +100°C (Note 5 & 6)I D2.51.90.78APulsed Drain Current (Notes 6 & 7) I DM19 AContinuous Source Current (Body Diode) (Notes 5 & 6) I S 1.5 APulsed Source Current (Body Diode) (Notes 6 & 7) I SM19 AThermal CharacteristicsCharacteristic SymbolValueUnitPower Dissipation (Notes 6 & 8)P D0.87W (Notes 5 & 6) 1.25(Notes 8 & 9) 1.04Thermal Resistance, Junction to Ambient (Notes 6 & 8)RθJA143°C/W (Notes 5 & 6)100(Notes 8 & 9)120Thermal Resistance, Junction to Leads (Note 10) RθJL84.9 °C/W Operating and Storage Temperature Range T J, T STG-55 to +150 °CNotes: 5. For a device surface mounted on FR4 PCB measured at t ≤ 10 sec.6. For device with one active die.7. Repetitive rating - 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300μs – pulse width limited by maximum junction temperature.8. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.9. For device with two active die running at equal power.10. Thermal resistance from junction to solder-point (at the end of the drain lead).Thermal Characteristics204060801001201401600.00.10.20.30.40.50.60.70.80.9Derating CurveTemperature (°C)M a x P o w e r D i s s i p a t i o n (W )Transient Thermal Impedance T h e r m a l Re s i s t a n c e (°C /W )Pulse Width (s)Pulse Power DissipationPulse Width (s)M a x i m u m P o w e r (W )Electrical Characteristics (@T A = +25°C, unless otherwise specified.)CharacteristicSymbol Min Typ Max Unit Test ConditionOFF CHARACTERISTICSDrain-Source Breakdown VoltageBV DSS 20 - - V V GS = 0V, I D = 250μA Zero Gate Voltage Drain Current T J = +25°C I DSS - - 1.0 µA V DS = 20V, V GS = 0V Gate-Source Leakage I GSS - - 100 nA V GS = ±12V, V DS = 0V ON CHARACTERISTICS Gate Threshold VoltageV GS(th) 0.7 - 3 V V DS = V GS , I D = 250μAStatic Drain-Source On-Resistance (Note 11) R DS (ON) -65 130 m Ω V GS = 4.5V, I D = 1.7A90 150 V GS = 2.7V, I D = 0.85AForward Transconductance (Notes 11 & 13) g fs 2.6 - - S V DS = 10V, I D = 0.85A Diodes Forward Voltage (Note 11) V SD - 0.85 0.95 V T J = 25°C, I S = 1.7A, V GS = 0V DYNAMIC CHARACTERISTICS Input Capacitance (Note 12 & 13) C iss - 350 700pFV DS = 15V, V GS = 0V,f = 1.0MHzOutput Capacitance (Notes 12 & 13)C oss - 120 250 Reverse Transfer Capacitance (Notes 12 & 13) C rss - 50 100 Gate Resistance (Notes 12 & 13) R g - 3.8 7.6 Ω f = 1MHz, V GS = 0V, V DS = 0V Total Gate Charge (Notes 12 & 13) Q g - 4.5 6nCV GS = 4.5V, V DS = 16V,I D = 1.7AGate-Source Charge (Notes 12 & 13) Q gs - 0.5 0.65 Gate-Drain Charge (Notes 12 & 13) Q gd - 2 2.5 Reverse Recovery Time (Note 13) t rr - 15 30 ns T J = +25°C, I F = 1.7A,di/dt = 100A/µs Reverse Recovery Charge (Note 13) Q rr - 5.9 - nCTurn-On Delay Time (Notes 12 & 13) t D(on) - 3.4 - nsV DD = 10V, I D = 1.7A,R G = 6Ω, R D = 5.7Ω, Turn-On Rise Time (Notes 12 & 13) t r - 8.1 - Turn-Off Delay Time (Notes 12 & 13) t D(off) - 13.5 - Turn-Off Fall Time (Notes 12 & 13)t f- 9.1 -Notes:11. Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤2%. 12. Switching characteristics are independent of operating junction temperature. 13. For design aid only, not subject to production testing.Typical CharacteristicsTypical Characteristics (cont.)Test CircuitsPackage Outline DimensionsSuggested Pad LayoutMSOP-8Dim Min Max Typ A - 1.10 - A1 0.050.15 0.10 A2 0.750.95 0.86 A3 0.290.49 0.39 b 0.220.38 0.30 c 0.080.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e - - 0.65 L 0.400.80 0.60 a 0° 8° 4° x - - 0.750 y - - 0.750 All Dimensions in mmDimensions Value (in mm)C 0.650 X 0.450 Y 1.350 Y15.300Detail CIMPORTANT NOTICEDIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which:1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause thefailure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.Copyright © 2012, Diodes Incorporated分销商库存信息:DIODESZXMD63N02XTA ZXMD63N02XTC。
TDA7703R
dynamic range and FM adaptive bandwidth control ■ RDS demodulation with group and block synchronization ■ High performance stereodecoder with noiseblanker ■ I2C bus controlled ■ Single 5 V supply ■ LQFP44 package
TDA7703R
Highly integrated tuner for AM/FM car radio
Features
■ Fully integrated VCO for world tuning ■ High performance PLL for fast RDS system ■ AM/FM mixers with high image rejection ■ Integrated AM-LNA and AM-PINDIODE ■ Automatic self alignment for image rejection ■ Digital IF signal processing, high performance
2.3 AM - LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 AM - AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
HD6432344FA中文资料
294 to 309 9.2.3 Timer I/O Control Register (TIOR) 420 12.2.5 Serial Mode Register (SMR)
429 to 431 Table 12.3 BRR Settings for Various Bit Rates (Asynchronous Mode) 441
Figure 12.2 Data Format in Asynchronous Amended Communication (Example with 8-Bit Data, Parity, Two Stop Bits) Figure 12.15 Sample SCI Initialization Flowchart Note added
478, 479 481 483 484 488, 489
Figure 13.2 Schematic Diagram of Smart Amended Card Interface Pin Connections Figure 13.3 Smart Card Interface Data Format Amended
461 467
Figure 12.20 Sample Flowchart of Note amended Simultaneous Serial Transmit and Receive Operations 13.2.2 Serial Status Register (SSR) 13.2.4 Serial Control Register (SCR) Description of bits 4 and 2 amended Description of bits 1 and 0 amended
Table 13.5 Examples of Bit Rate B (bit/s) Amended (ø = 20.00 MHz column added) for Various BRR Settings (When n = 0) Table 13.6 Examples of BRR Settings for Bit Rate B (bit/s) (When n = 0)
TPS77030中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。
AON7702中文资料
SymbolTyp Max 30406075R θJC 3.1 3.7°C/WThermal Characteristics ParameterUnits Maximum Junction-to-Ambient A t ≤ 10s R θJA °C/W °C/W Maximum Junction-to-Case DSteady-StateMaximum Junction-to-Ambient A Steady-State Absolute Maximum Ratings T A =25°C unless otherwise noted AON7702SDSRFET S Integrated Schottky DiodePin 1SymbolMin TypMaxUnits BV DSS 30V 100T J =55°C500I GSS 100nA V GS(th)1 1.63V I D(ON)80A810T J =125°C12151114g FS 21S V SD 0.380.5V I S6A C iss 23904250pF C oss 480pF C rss 180pF R g0.51 1.5ΩQ g (10v)3748nC Q g (4.5v)1621nC Q gs 9.3nC Q gd 5.5nC t D(on)9ns t r 14ns t D(off)32ns t f 16ns t rr 2938ns Q rr15nC 1503514COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE.Drain-Source Breakdown Voltage On state drain currentI D =250µA, V GS =0V V GS =10V, V DS =5V V DS =30V, V GS =0VV DS =0V, V GS = ±20V Zero Gate Voltage Drain Current Gate-Body leakage current I DSS µA Body Diode Reverse Recovery Charge I F =13.5A, dI/dt=100A/µsBody Diode Reverse Recovery TimeV GS =10V, I D =13.5AReverse Transfer Capacitance I F =13.5A, dI/dt=100A/µsGate Threshold Voltage V DS =V GS I D =250µA Electrical Characteristics (T J =25°C unless otherwise noted)STATIC PARAMETERS ParameterConditions R DS(ON)Static Drain-Source On-ResistanceForward TransconductanceDiode Forward Voltage Maximum Body-Diode Continuous CurrentInput Capacitance Output Capacitance DYNAMIC PARAMETERS V GS =4.5V, I D =11AI S =1A,V GS =0V V DS =5V, I D =13.5Am ΩTurn-On Rise Time Turn-Off DelayTime V GS =10V, V DS =15V, R L =1.1Ω, R GEN =3ΩTurn-Off Fall TimeTurn-On DelayTime Gate Drain Charge V GS =0V, V DS =15V, f=1MHz SWITCHING PARAMETERS Total Gate Charge Gate Source Charge Gate resistanceV GS =0V, V DS =0V, f=1MHzTotal Gate Charge V GS =10V, V DS =15V, I D =13.5AA: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. B: Repetitive rating, pulse width limited by junction temperature.C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The SOA curve provides a single pulse rating.F. The current rating is based on the t ≤ 10s junction to ambient thermal resistance rating.G.The maximum current rating is limited by bond-wires.Rev0: Sept 2007。
st7703规格书
ST7703是一种用于A-SITFT液晶显示器的单芯片解决方案,它结合了电源驱动和电源电路驱动A-SITFT点阵液晶显示器,最大为720 RGB×1280点。
ST7703支持Mipi接口,采用步进和电压跟随电路来产生A-SI TFT和栅内面板(GIP)所需的驱动电压,其中包括动态背光控制功能来控制背光亮度。
以下是ST7703的主要规格:显示分辨率:720RGB x (480)。
显示类型:A-SITFT。
显示尺寸:最大为720 RGB×1280点。
支持接口:Mipi接口。
背光控制:动态背光控制功能来控制背光亮度。
ST7703适用于需要长期驱动功能的小型或中型便携式移动解决方案,如数字移动电话、PDA和智能手机。
梅特勒-托利多 770MAX多参数分析仪 变送器 操作说明
第4 章 菜单的使用 ..................................... 13
引言 ........................................................ 主菜单 ..................................................... 进入 ............................................... 退出 ............................................... 测量菜单 ................................................. 测量 ............................................... 传感器输入 .................................... 单位 ............................................... 名称 ............................................... 13 13 13 13 13 13 14 14 14
TL7702A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。
TLC7703中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9750901Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-9750901QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-9751301Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-9751301QHA ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type 5962-9751301QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLC7701ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7701IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7701IPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701IPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7701IPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITLC7701IPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701IPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701QDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701QDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701QP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7701QPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7701QPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701QPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7701QPWLE PREVIEW TSSOP PW8TBD Call TI Call TITLC7701QPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7701QPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7703ID ACTIVE SOIC D875Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLC7703IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7703IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7703IPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703IPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7703IPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITLC7703IPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703IPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7703QPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7703QPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7703QPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7705IPE4ACTIVE PDIP P850Pb-Free CU NIPDAU N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)(RoHS)TLC7705IPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705IPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7705IPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITLC7705IPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705IPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7705MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLC7705MJG ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLC7705MJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLC7705MUB ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type TLC7705QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705QDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705QDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705QP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7705QPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7705QPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705QPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7705QPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITLC7705QPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7705QPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7725IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7725IPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7725IPWG4ACTIVE TSSOP PW8150Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLC7725IPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITLC7725IPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725IPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725QDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725QP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7725QPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7725QPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725QPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC7725QPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITLC7725QPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7725QPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7733IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7733IPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733IPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733IPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733IPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLC7733MJG ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLC7733MJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLC7733QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLC7733QDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733QDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733QP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7733QPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLC7733QPW ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733QPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733QPWR ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC7733QPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
FUJITSU CELSIUS H770移动工作站数据册说明书
Data SheetFUJITSU CELSIUS H770Mobile WorkstationMobile Workstation Meets SecurityIf you are looking for workstation power on-the-go packed in a 39.6 cm (15.6-inch) stylish form factor,then the FUJITSU CELSIUS H770 mobile workstation is the right choice. Its port replicator is compatible with seven LIFEBOOK devices and thus ideal for a shared desk environment. Maximum data security is guaranteed by the unique PalmSecure™ technology.Mobile Workstation Meets SecurityWhen true workstation performance meets the elegant style of a laptopChoose between Intel® Core™ processors or powerful Intel® Xeon processor ® E3-1500M familySupport of Windows 10 ProUHD/4k and Full HD LED anti-glare displaysUp to 64 GB DDR4 2400 MHz memory (ECC optional)M.22 SSDs PCIe NVMe technology supports quick loading of core applicationsFull connectivity and worry-free docking experienceNo compromise in terms of port connectivities - whether you are travelling, in meetings or sitting at your deskUSB Type-C™ connector offering more speed (40 Gbps), more protocols (including Thunderbolt 3)and charging capabilities (power delivery of 15W)Full monitor connectivity support: 1x VGA and1x DisplayPort (Full size)One port replicator shared across eight mobile devices: Notebooks, Ultrabook™, 2 in 1 and mobileworkstationsMaximum SecurityData security and peace of mindOptional PalmSecure™, a l eading-edge highly secure authentication system using biometrictechnology tat authenticates users through vein patten recognitionOptional fingerprint sensorIntegrated SmartCard readerTPM 2.0 and Advanced Theft ProtectionCOMPONENTSBase Unit CELSIUS H770Operating System Windows 10 ProProcessor Intel® Xeon® processor E3-1505M v6 (3.0 GHz, up to 4.0 GHz, 8 MB, Intel® HD Graphics P630)Intel® Core™ i7-7820HQ processor (2.9 GHz, up to 3.9 GHz, 8 GB, Intel® HD Graphics 630)Memory modules 8GB (2x 4GB) DDR4 2400Mhz16GB (2x 8GB) DDR4 2400Mhz16GB (2x 8GB) DDR4 2400Mhz, ECC32GB (2x 16GB) DDR4 2400Mhz32GB (2x 16GB) DDR4 2400Mhz, ECCHard disk drives (internal) SSHD SATA III, 5400 rpm, 500 GBSSHD SATA III, 5400 rpm, 1 TBSSD SATA III, 512 GBSSD SATA III, 512 GB, SEDSSD SATA III, 1 TB, SEDPCIe-SSD, 512GB, SEDPCIe-SSD, 1 TB, SEDHard disk notes One Gigabyte equals one billion bytes, when referring to hard disk drive capacity.Accessible capacity may vary, also depending on used software.Up to 20 GB of HDD space is reserved for system recoveryInternal HDD interface: S-ATA III (6GBit/s)Modular Bay Options 2nd bay batteryDVD Super MultiWeight SaverInterface add on cards/components (optional)4G/LTE (Optional) LTE Sierra Wireless EM7305 (Downlink speed up to 100 Mbit/s, Uplink speed up to 50 Mbit/s)WLAN (Optional) Intel® Dual Band Wireless-AC 8265 802.11ac/a/b/g/n (2x2) and Bluetooth® 4.2 ComboDisplay 39.6 cm (15.6-inch), LED backlight, (Full HD), Anti-Glare, WVA, 1,920 x 1,080 pixel, 700:1, 300 cd/m²39.6 cm (15.6-inch), LED backlight, (4K UHD), Anti-glare, WVA, 3,840 x 2,160 pixel, 700:1, 300 cd/m² MultimediaCamera (Optional) Built-in webcam, 2.0 megapixelMicrophone 2x digitalBase unitBase unit CELSIUS H770General system informationChipset Intel® QM175 or CM238 (depending on CPU)Supported capacity RAM (min.) 8 GBSupported capacity RAM (max.) 64 GBMemory slots total 4 DIMM (DDR4)Memory notes Memory Slots are depending on processor type. 2 DIMM slots with dual core processors, 4 DIMM slots withquad core processorLAN Built-in 10/100/1000 MBit/s, Intel® I219LMBIOS features InsydeH20 BiosAudio type On boardAudio codec Realtek ALC255 with MaxxAudioAudio features Stereo Speakers, 2 digital microphonesDisplayDisplay notes ISO 9241-307 - Pixel class II[Full HD] Viewing angle: Left/Right 85°, Top 85°, Bottom 85°; Color Gamut: 72%[4K UHD] Viewing angle: Left/Right 85°, Top 85°, Bottom 85°; Color Gamut: 72%GraphicsGraphics card NVIDIA® Quadro® M1200M 4GB GDDR5: 640 CUDA CoresNVIDIA® Quadro® M2200M 4GB GDDR5: 1024 CUDA CoresGraphics features DualView3 Display Support (2 external, 1 internal)5 Display Support w/ Port Replicator (4 external, 1 internal)Max. resolution (DisplayPort) Up to 4,096 x 2,160Max. resolution (USB Type-C DP) Up to 4,096 x 2,160Max. resolution (D-SUB) Up to 1,920 x 1,200Max. resolutionUp to 4,096 x 2,160(DisplayPort 1,2 on Port Replicator)Up to 1,920 x 1,200Max. resololution(DVI on Port Replicator)Max. resolutionUp to 1,920 x 1,200(D-SUB on Port Replicator)InterfacesDC-in 1Audio: line-in / microphone 1Audio: line-out / headphone 1Internal microphones 2 digital microphones (array)USB 2.0 total 1USB 3.1 Gen1 total 2USB 3.1 Type-C 1 (USB 3.1 Gen2 (10 Gbps), Thunderbolt 3 (20/40Gbps), Power Delivery (15W), DP 1.2)VGA 1DisplayPort 1Ethernet (RJ-45) 1Memory card slots 1 (SD/SDHC) SD/microSD = 2GB, SDHC/micro SDHC = 32GB, SDXC = 64GBSmartCard slot 1SIM card slot 1 (only for models with integrated 4G/LTE module)Kensington Lock Support 1Port Replicator interfaces (optional)DC-in 1 (19V)Power on switch 1Audio: headphone 1Audio: microphone 1USB 3.0 total 4DisplayPort 2 - 1 DP (next to DVI) is shared with DVI, works when DVI not connectedVGA 1DVI 1 - shared with DP (next to DVI) - works when DP (next to DVI) not connectedEthernet (RJ-45) 1 (10/100/1000)Kensington Lock support 1 (Port rep & System)eSATA 1Notes Port replicator supports 0-Watts functionalityKeyboard and pointing devicesUS Keyboard w/o BacklightNumber of keyboard keys: 104 (w/10 keys), Keyboard pitch: 18.4 mm, Keyboard stroke: 1.7 mmTouchpad with three mouse buttonsECO ButtonStatus LEDPower ButtonWireless technologiesAntennas 2 Dual band WLAN antennas, 2 UMTS/LTE antennas optional, 1 Bluetooth antenna shared with WLAN Bluetooth Bluetooth® 4.1 (Win10)WLAN encryption WEP, WPA, WPA2WLAN notes Import and usage according to country-specific regulations.WiDi support Yes (with Intel W-LAN)Power supplyAC Adapter 19 V / 150 W (7.89 A), 100 V - 240 V, 50 Hz - 60 Hz, 3-pin (grounded) AC AdapterBattery 1st Battery: Li-Ion battery 6-cell, 72 Wh2nd Bay Battery: Li-Ion battery 6-cell, 28 Wh1st Battery Run-time Up to 11hrs (MobileMark® 2014)1st and 2nd Battery Run-time Up to 14hrs (MobileMark® 2014)Battery notes Battery runtime information is based on worldwide acknowledged BAPCo® MobileMark® 2014 (officeproductivity). Refer to for additional details.The BAPCo® MobileMark® Benchmark provides results that enable direct product comparisons betweenmanufacturers. It does not guarantee any specific battery runtime which actually can be lower and may varydepending on product model, configuration, application and power management settings. The batterycapacity decreases slightly with every re-charge and over its lifetime.Dimensions / Weight / EnvironmentalDimensions (W x D x H) 380.0 x 257.0 x 24.8-31.9 mm (w/o bump)Weight Start from 2.75 kg (6.1 lbs)Weight notes Actual weight may vary depending on configurationOperating ambient temperature 5 - 35 °C (41 - 95 °F)Operating relative humidity 20 - 80 % (relative humidity, non-condensing)ComplianceGlobal RoHS (EU & China)Medical EMC standard IEC60601-1-2 in combination with medical kitENERGY STAR® 6.1EPEAT® Gold (dedicated regions)Additional SoftwareAdditional Software (preinstalled)Fujitsu Anytime USB Charge UtilityFujitsu Battery UtilityFujitsu Bonus AppsFujitsu Function ManagerFujitsu LIFEBOOK Application PanelFujitsu Mic Mute UtilityFujitsu Mobility Center Extension UtilityFujitsu Software AutoInstallerFujitsu Workplace ProtectMicrosoft® Office 2016 TrialMcAfee Multi Access 60 days TrialAdditional Software (optional) Sierra Wireless Skylight (optional with WWAN)CyberLink PowerDVD (optional with DVD Super Multi)Recovery DVD for Windows®ManageabilityManageability technology PXE 2.1 Boot codeWake up from S5 (off mode)WoL (Wake on LAN)Intel® vPro™ technology (depending on CPU)iAMT 11.0 (depending on CPU)Supported standards WMI, PXESecurityPhysical Security Kensington Lock supportSystem and BIOS Security Optional: Discrete Trusted Platform Module (TPM 2.0)Optional: Fujitsu EraseDiskUser Security Hard disk passwordUser and supervisor BIOS passwordEmbedded fingerprint sensor (optional)Embedded palm vein sensor (optional)Smartcard reader (integrated)Fujitsu Workplace Protect (secure authentication solution)WarrantyStandard warranty 3 years (depending on country)Service level Bring-in Service (depending on country specific requirements)Maintenance and Support ServicesRecommended service 3 years, 9x5, Response Time: Next Business DaySpare Parts availability 5 years after end of product lifeRecommended AccessoriesClassic Port Replicator Flexibility, expandability, desktop replacement and investment protection are just a few benefits ofFujitsu docking options. It takes just a second to attach your notebook to the Port Replicator andget connected to your external display, keyboard and mouse. Your workplace is simple and tidywhile you are instantly ready to work with your notebook.Compatible Models: LIFEBOOK U745, T7, E5, E7, CELSIUS H730, H760Fujitsu Prestige Backpack The FUJITSU Prestige Backpack 17 protects notebooks with up to 17-inch displays. It contains threelarge compartments, two elastic mesh side pockets and a front bay. The padded backcompartment provides protection for your notebook, while other sections store power adaptors andoffice supplies. Padded shoulder straps and back cushions provide comfort on the move.Fujitsu Display P24-8 WS Pro The FUJITSU P24-8 WS Pro display (24-inch, 16:10) provides outstanding picture performancethanks to cutting edge panel technology. It is the perfect choice for CAD and documentmanagement applications with request for 1,200 lines. It also boasts unique and innovativefeatures such as our patent-applied Presence Sensor technology and USB support during standby.More informationIn addition to Fujitsu CELSIUS H770, Fujitsu provides a range of platform solutions. They combine reliable Fujitsu products with the best in services, know-how and worldwide partnerships.Dynamic InfrastructuresWith the Fujitsu Dynamic Infrastructures approach, Fujitsu offers a full portfolio of IT products, solutions and services, ranging from clients to data centre solutions, Managed Infrastructure and Infrastructure-as-a-Service. How much you benefit from Fujitsu technologies and services depends on the level of cooperation you choose. This takes IT flexibility and efficiency to the next level.Computing Products/global/services/computing To learn more about Fujitsu CELSIUS H770,please contact your Fujitsu salesrepresentative, Fujitsu Business partner, orvisit our website./pcAll rights reserved, including intellectualproperty rights. Technical data subject tomodifications and delivery subject toavailability. Any liability that the data andillustrations are complete, actual or correct isexcluded. Designations may be trademarksand/or copyrights of the respectivemanufacturer, the use of which by third partiesfor their own purposes may infringe the rightsof such owner.Fujitsu Green Policy Innovation is ourworldwide project for reducing burdens on theenvironment.Using our global know-how, we aim tocontribute to the creation of a sustainableenvironment for future generations throughIT.Please find further information at http://www./global/about/environment/Technical data are subject to modification anddelivery subject to availability. Any liabilitythat the data and illustrations are complete,actual or correct is excluded. Designations maybe trademarks and/or copyrights of therespective manufacturer, the use of which bythird parties for their own purposes mayinfringe the rights of such owner.HONG KONGFujitsu PC Asia Pacific LtdTel: (852) 3910-8228Email:***********************.com /pc SINGAPOREFujitsu Asia Pte Ltd.Tel: (65) 6710-5403Email:**********************.com/pcCHINAFujitsu (China) Co., Ltd.Tel:(86*************Email:*************************.com/pcINDONESIAPt. Fujitsu IndonesiaTel: (62) 21-570-9330Email:*********************.com/pcPHILIPPINESFujitsu Philippines, Inc. Tel: (63) 2-812-4001 Email:***************.com /pc MALAYSIAFujitsu (Malaysia) Sdn. BhdTel: (60) 3-8318-3700Email:********************.com/pcTAIWANFujitsu Taiwan Ltd.Tel: (886) 0800-688-028Email:*******************.com/pcTHAILANDFujitsu (Thailand) Co., LtdTel: (66) 0-2302-1500Email:***************.com/pcVIETNAMFujitsu Vietnam Limited (Hanoi)Tel: (84) 4-2220-3113Email:****************.com/pcNote: For countries not listed above, please contact our Hong Kong office.Ultrabook, Celeron, Celeron Inside, Core Inside, Intel, Intel Logo, Intel Atom, Intel Atom Inside, Intel Core, Intel Inside, Intel Inside Logo, Intel vPro, Itanium,Itanium Inside, Pentium, Pentium Inside, vPro Inside, Xeon, and Xeon Inside are trademarks of Intel Corporation in the U.S. and/or other countries.All rights to the mentioned trademarks reside with their respective owners. Fujitsu endeavours to ensure that the information in this documentation is correct and fairly stated, but does not accept liability for any errors or omissions. The development of Fujitsu products and services is continuous and published information may not be up to date. It is important to check the current position with Fujitsu. The document is not part of the contract or licence save in so far as may be expressly agreed.Last Update: 6th July 2017。
NCV7703D2G;NCV7703D2R2G;NCV7703GEVB;中文规格书,Datasheet资料
V −0.3 to 40
−1
Output Pin OUTx (DC) (AC), t < 500 ms, IOUTx > −2 A
V −0.3 to 40
−1
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, VCC)
Output Current (OUTx) (DC) (AC) (50 ms pulse, 1 s period)
5
SI
Serial Input
6
SCLK
Serial Clock
7
GND*
Ground. Connect all grounds together.
8
GND*
Ground. Connect all grounds together.
9
SO
Serial Output
10
EN
Enable. Logic high wakes the IC up from a sleep mode.
OUT3
14 1
SOIC−14 D2 SUFFIX CASE 751A
MARKING DIAGRAM
14
NCV7703G AWLYWW
1
NCV7703 = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
Y
NCV7703
Triple Half-Bridge Driver with SPI Control
The NCV7703 is a fully protected Triple Half−Bridge Driver designed specifically for automotive and industrial motion control applications. The three half−bridge drivers have independent control. This allows for high side, low side, and H−Bridge control. H−Bridge control provides forward, reverse, brake, and high impedance states. The drivers are controlled via a standard SPI (Serial Peripheral Interface). This device is fully compatible with ON Semiconductor’s NCV7708 Double Hex Driver.
W671340P资料
AUX VTX -IN VFB
SW+ SW-
Test Access
Detector Logic
Control Logic
F2 F1 F0
RT SH E0 DETALM
BSEL SWC
-3-
Publication Release Date: March 2004 Revision 0.5
W671300 SERIES
The 3.3V family of Ringing Subscriber Line Interface Circuits (RSLIC), collected under the W671300 series, support interfacing to analog Plain Old Telephone Service (POTS) lines. On board ringing generation supports short and medium loop lengths, up to 5,000 ft at the highest operating voltage of 100V. This makes the devices are ideal for emerging customer premises equipment applications such as VoIP gateways, VoIP enabled DSL or Cable Modems as well as Analog Telephone Adapters. Furthermore the family contains seven different product variations, offering the flexibility to match performance to individual system requirements. All variations, however, are distinguished by low power consumption, particularly in standby modes. The W671300 series allow extensive parameters to be programmed, including the loop current limit, the transient loop current limit, Ring Trip and Switch Hook Detect thresholds. Integrated test and diagnostic features are also offered on selected products to support loopback testing as well as line measurement tests. Winbond also offers a 3V A-Law/µ-Law CODEC solution (W681310). Using this CODEC in conjunction with the W671300 series completes the termination of the analog POTS line and provides a cost-effective solution to support the complete BORSCHT feature requirements.
X40237资料
WIPER COUNTER REGISTER
8 - BIT NONVOLATILE
MEMORY
POWER-ON / LOW VOLTAGE
RESET GENERATION
RH
RW
Optional
64 or 100 Tap DCP
V3FAIL V2FAIL RESET
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
X40231 PIN ASSIGNMENT
SOIC 1 2
Name NC NC
3
V3MON
4
V3FAIL
5
MR
6
WP
7
SCL
8
SDA
9
VSS
10
NC
11
RH0
12
RW0
13 V2MON
14 V2FAIL
15 RESET
16
VCC
Function
No Connect
No Connect
V3MON Voltage Monitor Input. V3MON i s the input to a non-inverting voltage comparator circuit. When the V3MON input is higher than the VTRIP3 threshold voltage, V3FAIL makes a transition to a HIGH level. Connect V3MON to VSS when not used.
AD7703BR资料
REV. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. © Analog Devices, Inc., 1996 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703
DVDD 15 AVDD 14
LC2MOS 20-Bit A/D Converter AD7703
FUNCTIONAL BLOCK DIAGRAM
AVSS 7 DVSS 6 SC1 4 SC2 17
AD7703
CALIBRATION SRAM CALIBRATION MICROCONTROLLER 13 CAL
A DD DD SS SS IN 1 IN REF
= +2.5 V; fCLKIN = 4.096 MHz;
Test Conditions/Comments
Parameter STATIC PERFORMANCE Resolution Integral Nonlinearity, T MIN to TMAX +25 °C TMIN to TMAX Differential Nonlinearity, TMIN to TMAX Positive Full-Scale Error 3 Full-Scale Drift 4 Unipolar Offset Error 3 Unipolar Offset Drift 4 Bipolar Zero Error 3 Bipolar Zero Drift 4 Bipolar Negative Full-Scale Errors 3 Bipolar Negative Full-Scale Drift 4 Noise (Referred to Output) DYNAMIC PERFORMANCE Sampling Frequency, f S Output Update Rate, f OUT Filter Corner Frequency, f –3 dB Settling Time to ± 0.0007% FS SYSTEM CALIBRATION Positive Full-Scale Calibration Range Positive Full-Scale Overrange Negative Full-Scale Overrange Maximum Offset Calibration Ranges 5, 6 Unipolar Input Range Bipolar Input Range Input Span 7 ANALOG INPUT Unipolar Input Range Bipolar Input Range Input Capacitance Input Bias Current 1 LOGIC INPUTS All Inputs except CLKIN VINL, Input Low Voltage VINH, Input High Voltage CLKIN VINL, Input Low Voltage VINH, Input High Voltage IIN, Input Current LOGIC OUTPUTS VOL, Output Low Voltage VOH, Output High Voltage Floating State Leakage Current Floating State Output Capacitance POWER REQUIREMENTS Power Supply Voltages Analog Positive Supply (AV DD) Digital Positive Supply (DV DD) Analog Negative Supply (AV SS) Digital Negative Supply (DV SS) Calibration Memory Retention Power25؇C; AV = DV = +5 V; AV = DV = –5 V; V AD7703–SPECIFICATIONS BP/UP = +5 V; MODE = +5 V; A Source Resistance = 1 k⍀ with 1 nF to AGND at A unless otherwise noted.)
AN7704资料
9.80±0.10
8.7±0.3
0.80max. 0.55±0.15 0.10±0.05 2.30±0.10 1.00±0.30
2.30 4.60±0.10
0.75±0.10
1
2
3
U-type Package
3.8 4.2±0.25 ±0.25
2.77±0.3
12.5±0.2 17.0±0.2 26.1±0.2 29.0±0.3
* *
IO(Peak)1 VIN = 4 V, Tj = 25°C IO(Peak)2 VIN = 13 V, Tj = 25°C IO(Peak)3 VIN = 18 V, Tj = 25°C RR VIN = 4 V to 6 V, IOUT = 100 mA, f = 120 Hz
Note) * : This current exceeds PD(max) because it is a parameter during abnormal (overcurrent) operation. However, normally, it shall conform to the derating curve ( s Characteristic curve chart PD Ta ).
s Absolute Maximum Ratings at Ta = 25°C
Parameter Supply voltage Supply current
*2 *3 *4
Symbol VIN IIN
Rating 30 2.4 15 10.25 5.0
3
Unit V A W
Power dissipation
2
元器件交易网
Voltage Regulators AN7700, AN7700F, AN7700SP Series
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Original Creation Date: 06/27/95Last Update Date: 09/18/95Last Major Revision Date: 06/27/95MDLM117HV-H REV 0A0MICROCIRCUIT DATA SHEETPOSITIVE THREE TERMINAL HIGH VOLTAGE ADJUSTABLE REGULATORGeneral DescriptionThe LM117HV adjustable 3-terminal positive voltage regulator is capable of supplying in excess of 0.5A over a 1.2V to 57V output range. It is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, both line and load regulation are are better than standard fixed regulators.In addition to higher performance than fixed regulators, the LM117HV offers full overload protection available only in IC's. Included on the chip are current limit, thermaloverload protection and safe area protection. All overload protection circuitry remains fully functional even if the adjustment terminal is disconnected.Normally, no capacitors are needed unless the device is situated more than 6 inches from the input filter capacitors in which case an input bypass is needed. An optional output capacitor can be added to improve transient response. The adjustment terminal can bebypassed to achieve very high ripple rejection ratios which are difficult to achieve with standard 3-terminal regulators.Besides replacing fixed regulators, the LM117HV is useful in a wide variety of other applications. Since the regulator is "floating" and sees only the input-to-outputdifferential voltage, supplies of several hundred volts can be regulated as long as the maximum input to output differential is not exceeded, (i.e. do not short the output to ground).Also, it makes an especially simple adjustable switching regulator, a programmable output regulator, or by connecting a fixed resistor between the adjustment and output, theLM117HV can be used as a precision current regulator. Supplies with electronic shutdown can be achieved by clamping the adjustment terminal to ground which programs the output to 1.2V where most loads draw little current.NS Part NumbersLM117HVH-SMDIndustry Part NumberLM117HVHPrime DieLM117HVHControlling DocumentDESC.# 7703402XAProcessingMIL-STD-883, Method 5004Quality Conformance InspectionMIL-STD-883, Method 5005Subgrp Description Temp ( C)o 1Static tests at +252Static tests at +1253Static tests at -554Dynamic tests at +255Dynamic tests at +1256Dynamic tests at -557Functional tests at +258A Functional tests at +1258B Functional tests at -559Switching tests at +2510Switching tests at +12511Switching tests at-55MICROCIRCUIT DATA SHEET MDLM117HV-H REV 0A0Features- Adjustable output down to 1.2V.- Guaranteed 0.5A output current.- Line regulation typically 0.01%/V.- Load regulation typically 0.1%.- Current limit constant with temperature.- Eliminates the need to stock many voltages.- 80 dB ripple rejection.- Output is short-circuit protected.MICROCIRCUIT DATA SHEET MDLM117HV-H REV 0A0(Absolute Maximum Ratings)(Note 1)Power DissipationInternally LimitedInput-Output Voltage Differential+60V, -0.3VMaximum Junction Temperature150 CStorage Temperature Range-65 C to +150 CLead Temperature (Soldering, 10 seconds)300 CThermal ResistanceThetaJA(Still Air)186 C/W(500LF/Min Air flow)64 C/WThetaJC21 C/WESD Tolerance(Note 2)2000VNote 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is intended to befunctional, but do not guarantee specific performance limits. For guaranteedspecifications and test conditions, see the Electrical Characteristics. Theguaranteed specifications apply only for the test conditions listed.Note 2:Human body model, 1.5K Ohms in series with 100pF.Recommended Operating ConditionsOperating Temperature Range-55 C < TA < +125 CMDLM117HV-H REV 0A0MICROCIRCUIT DATA SHEETElectrical CharacteristicsDC PARAMETERS(The following conditions apply to all the following parameters, unless otherwise specified.)DC:Il = 8mASYMBOL PARAMETER CONDITIONS NOTES PIN-NAME MIN MAX UNITSUB-GROUPSVref Reference Voltage Vdiff = 3V 1.2 1.3V1Vdiff = 40V 1.2 1.3V1, 2,3Vdiff = 60V 1.2 1.3V1, 2,3Vdiff = 3.3V 1.2 1.3V2, 3 Rline Line Regulation3V < Vdiff < 40V, Vout = Vref-99mV140V < Vdiff < 60V, Vout = Vref-55mV140V < Vdiff < 60V, Vout = Vref-1010mV2, 33V < Vdiff < 60V-1414mV13V < Vdiff < 60V-3333mV2, 33.3V < Vdiff < 40V, Vout = Vref-2323mV2, 3 Rload Load Regulation Vdiff = 3V, 10mA < Il < 500mA-1515mV1Vdiff = 40V, 10mA < Il < 150mA-1515mV1Vdiff = 60V, 10mA < Il < 20mA-1515mV1, 2,3Vdiff = 3.3V, 10mA < Il < 500mA-1515mV2, 3Vdiff = 40V, 10mA < Il < 100mA-1515mV2, 3Vrth ThermalRegulation Vin = 14.6V, Il = 300mA, Pd = 4W,t = 20mS-3.1 3.1mV1Iadj Adjustment PinCurrent Vdiff = 3V100uA1Vdiff = 40V100uA1, 2,3Vdiff = 60V100uA1, 2,3Vdiff = 3.3V100uA2, 3Delta Iadj Adjustment PinCurrent Change Vdiff = 3V, 10mA < Il < 500mA-55uA1Vdiff = 40V, 10mA < Il < 150mA-55uA13V < Vdiff < 40V-55uA13.3V < Vdiff < 60V-55uA1, 2,3Vdiff = 3.3V, 10mA < Il < 500mA-55uA2, 3 Vdiff = 40V, 10mA < Il < 100mA-55uA2, 3 3.3V < Vdiff < 40V-55uA2, 3MDLM117HV-H REV 0A0MICROCIRCUIT DATA SHEETElectrical CharacteristicsDC PARAMETERS(Continued)(The following conditions apply to all the following parameters, unless otherwise specified.)DC:Il = 8mASYMBOL PARAMETER CONDITIONS NOTES PIN-NAME MIN MAX UNITSUB-GROUPSIlmin Minimum LoadCurrent Vdiff = 3V, Vout = 1.4V (forced)5mA1Vdiff = 40V, Vout = 1.4V (forced)5mA1, 2,3Vdiff = 60V, Vout = 1.4V (forced)7mA1, 2,3Vdiff = 3.3V, Vout = 1.4V (forced)5mA2, 3Icl Current Limit Vdiff = 5V.5 1.65A1, 2,3Vdiff = 40V.15.65A1Vdiff = 60V.02.28A1AC PARAMETERS(The following conditions apply to all the following parameters, unless otherwise specified.)AC:Il = 8mARn Ripple Rejection f = 120Hz, Vout = Vref, Cadj = 10uF,Iout = 100mA 166dB4, 5,6Note 1:Group "A" sample only, test at all temperature.MICROCIRCUIT DATA SHEET MDLM117HV-H REV 0A0Graphics and DiagramsGRAPHICS#DESCRIPTION9784HRB13LD .200 DIA P.C. METAL CAN PKG (B/I CKT)H03ARD3LD .200 DIA P.C. METAL CAN PKG (P/P DWG)See attached graphics following this page.。