11pF贴片电容0603CG110J500NT《风华电容样品单》

FENGHUA风华规格书

广东风华高新科技股份有限公司GUANGDONG FENGHUA ADV ANCED TECHNOLOGY HOLDING CO.，LTD.承认书APPROV AL SHEET客户名称:CUSTOMER品名：常规厚膜片式固定电阻器PARTNAME规格版本号VERSION日期DATE制造客户APPROV AL APPROV AL 拟制审核确认检验审核批准FENGHUAFENG HUA ADV ANCED TECHNOLOGY (HOLDING) CO., LTD序号 No 目录TABLE OF CONTENTS1.0 概述Summary2.0 结构及尺寸Structure And Dimensions3.0 型号规格表示办法How To Order4.0 电气性能Performance Specification5.0 可靠性Reliability Data6.0 包装Package7.0 环保情况说明 Environmental Protection Statement 8.0 推荐使用的焊接曲线Recommended soldering profile 9.0 使用注意事项Precautions For UseRC/RS□□□□1.0概述Summary片式电阻器主要生产的型号包括01005、0201、0402、0603、0805、1206、1210、2010、2512。

其特点是：The dimension type for chip resistor including01005、 0201、0402、0603、0805、1206、1210、2010、2512, and the features are as below:*体积小、重量轻miniature and light weight*电性能稳定，可靠性高 stable electrical capability and high reliability *机械强度高、高频特性优越superior mechanical and frequency*装配成本低，并与自动贴装设备匹配low assembly cost, suit for automatic SMT *适应再流焊与波峰焊suit for re-flow and wave flow soldering .*符合ROHS指令要求Compliant with ROHS Directive*符合无卤素要求Compliant with halogen free requirement*禁止使用SS-00259中规定的1级环境管理物质*SONY指定原材料只能从绿色伙伴认定供应商处采购产品广泛应用于计算机、通讯、工业自动化、航天航空、军事、数字电视、数字音响及消费类电子等领域。

27pF贴片电容0603CG270J500NT《风华电容样品单》

声明：1、本规格书是由风华高科授权代理商－南京南山半导体有限公司自风华高科官方网站下载整理，若有变更，恕不另行通知；2、本规格书没有足够的空间说明详细电性能参数，仅列明了标准规格，在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

|特性*具有高电容量稳定性，在-55℃~125℃工作范围内，其温度系数为0±30ppm/℃、0±60ppm/℃*独石结构，具有高可靠性。

*优良的焊接性和耐旱性，适合于回流焊和波峰焊。

|贴片电容封装代号与外形尺寸L(长)尺寸 1.6±0.1mm W(宽)尺寸0.8±0.1mm T(高)尺寸0.8±0.1mm 电极宽度wb 0.30±0.10mm 公制封装代号1608英制封装代号0603|通用型贴片电容特性曲线※贴片电容交流特性图※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图贴片电感样品申请单南山联系资料总机：技术支持：客服：传真：电邮：客户基本资料公司名称网址：联系方式电话：传真：□生产型企业□贸易商收货地址生产产品姓名：职务：□技术□采购□其他联络人电话：手机：电邮：样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期：规模生产日期：样品申请日期：样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写，可自行复制。

Service@2、请以附件的形式将该文档通过E-mail发送，并请将此单打印盖章后，电邮至：：。

3、公司将根据客户所填信息并综合相关情况，由样品小组负责确定该样品申请单是否执行及如何执行。

4、收到样品申请单并经审核通过后，南京库有现货2个工作日内发出；如需订货，交期3-4周，非常规品顺延1-2周。

5、样品免费，运费到付(一般选择顺丰快递)；样品数量：单个型号5～20pcs，或根据BOM表清单按2～5套提供。

11pF贴片电容0603CG110J500NT《风华电容样品单》

声明：1、本规格书是由风华高科授权代理商－南京南山半导体有限公司自风华高科官方网站下载整理，若有变更，恕不另行通知；2、本规格书没有足够的空间说明详细电性能参数，仅列明了标准规格，在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

|特性*具有高电容量稳定性，在-55℃~125℃工作范围内，其温度系数为0±30ppm/℃、0±60ppm/℃*独石结构，具有高可靠性。

*优良的焊接性和耐旱性，适合于回流焊和波峰焊。

|贴片电容封装代号与外形尺寸L(长)尺寸 1.6±0.1mm W(宽)尺寸0.8±0.1mm T(高)尺寸0.8±0.1mm 电极宽度wb 0.30±0.10mm 公制封装代号1608英制封装代号0603|通用型贴片电容特性曲线※贴片电容交流特性图※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图贴片电感样品申请单南山联系资料总机：技术支持：客服：传真：电邮：客户基本资料公司名称网址：联系方式电话：传真：□生产型企业□贸易商收货地址生产产品姓名：职务：□技术□采购□其他联络人电话：手机：电邮：样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期：规模生产日期：样品申请日期：样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写，可自行复制。

Service@2、请以附件的形式将该文档通过E-mail发送，并请将此单打印盖章后，电邮至：：。

3、公司将根据客户所填信息并综合相关情况，由样品小组负责确定该样品申请单是否执行及如何执行。

4、收到样品申请单并经审核通过后，南京库有现货2个工作日内发出；如需订货，交期3-4周，非常规品顺延1-2周。

5、样品免费，运费到付(一般选择顺丰快递)；样品数量：单个型号5～20pcs，或根据BOM表清单按2～5套提供。

风华贴片电容全系列规格书

第1页
共 23 页
风华高科广东风华高新科技股份有限公司
FENGHUA Fenghua Advanced Technology (Holding) CO. , LTD
二、尺寸及结构 DIMENSIONS AND STRUCTURE
※ 尺寸 DIMENSIONS
L L
W
T
WB WB
※X7R、X5R：X7R、X5R material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class Ⅱ capacitor whose capacitance is higher than that of class Ⅰ. These capacitors are classified as having a semi-stable temperature characteristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc.
FENGHUA Fenghua Advanced Technology (Holding) CO. , LTD
⑤ 额定电压 RATED VOLTAGE
表示方式
实际值
单位(unit)：V
(Express Method) 6R3 500 201 102 …
(Actual Value)

风华LP铝电解电容规格书

Internal Code 85 85 85 PET 85 PET 105
Code 81 85 8F 8E 11
Lead Foming Type
Bulk 5mm 5mmChip tape ( 4~ 6.3)2.5mm 2.5mmTape ( 4~ 6.3)3.5mm 3.5mmTape ( 4~ 8)5.0mm Lead forming 8)5mm 5mmTape 8mm orininal type(vertical)tape 5mm 5mm Lead forming C Lead forming B B lLead forming ( 4~ 5)2.5mm Lead forming 8x5 F2.5mm ( 4~
4.50
35
50
5.70
6800(682)
25 25 30 25 30 25 30
30 2.80
3.80
4.40
5.10
35
60
6.00
8200(822)
25
25 2.80
35 25 3.30 30 30 30 40 3.50 35 30 30 45 4.00 35 35 40 4.80 35 35 45 5.70 35 40 45 6.30
30 35 30 45 35 45 35 50 40 45 35 50 40 50
2.50
3.20
2700(272)
25
30
2.50
2.90
3.60
3300(332)
25
25
2.40
25 25 30 25 30 25 30 25 30 35 30 35 30 35 35
35 35 30 40 30 45 35 50 40 35 45 35 50 40 50

风华贴片电阻规格书

常规厚膜片式固定电阻器GENERAL CHIP FIXED RESISTOR特长 Features体积小重量轻Miniature and light weight.适应再流焊与波峰焊Suit for reflow and wave flow solder.电性能稳定可靠性高Stable electrical capability, high reliability.装配成本低并与自动Low assembly cost, suit for automatic SMT装贴设备匹配equipment.机械强度高高频特性优越Superior mechanical and frequencycharacteristics.符合RoHS指令要求According with RoHS standard品名构成 Type Designation例Example200ppm/400ppm/200ppm/400ppm/100ppm/0603080512061210181220102512250ppm/Resistance Value Code三位数E-24系列前两位表示有效数字第三位表示有效数字后零的个数Three digits (E-24series): The first two digits are significant figuresand the third one denotes number of zeros.四位数E-96系列前三位表示有效数字第四位表示有效数字后零的个数Four digits (E-96series):The first three digits are significantExample103=10K E-241003=100K E-961R0=1.00.5%1%2%5%10%结构及规格尺寸Construction and dimension单位Unit: mm 型号Type L W t a b 0201 0.600.05 0.300.05 0.230.05 0.100.05 0.150.05 0402 1.000.10 0.500.10 0.300.10 0.200.10 0.250.10 0603 1.600.15 0.800.15 0.400.10 0.300.20 0.300.20 0805 2.000.20 1.250.15 0.500.10 0.400.20 0.400.20 1206 3.200.20 1.600.15 0.550.10 0.500.20 0.500.20 1210 3.200.20 2.500.20 0.550.10 0.500.20 0.500.20 1812 4.500.20 3.200.20 0.550.10 0.500.20 0.500.20 2010 5.000.20 2.500.20 0.550.10 0.600.20 0.600.20 2512 6.400.20 3.200.20 0.550.10 0.600.20 0.600.20产品外观Appearance1.电阻器表面二次玻璃体保护膜覆盖完好且难以脱落,表面平整The surface of resistor is covered with Protective Coating which hard to fade, and the surface of coating should avoid unevenness.2.电阻器引出端电极覆盖均匀镀层较难脱落且平整无裂痕针孔变色The terminal part is covered equable , the plating is hard to fade, and should avoid unevenness, flaw, pinhole and discoloration.3.电阻器芯片无裂痕标志可辨With a clear mark , the resistor body is crack-free.参考标准 Reference StandardGB/T 5729-2003GB/T 9546-1995JIS C 5223-1995JIS C 5201-1998JIS C 5202-1990负荷下降曲线Derating Curve755025使用温度范围OperatingTemperatureRange-55125环境温度Ambient temperature ()当电阻使用的环境温度超过70时其额定负荷(额定电压)按上述曲线下降For resistors operated in ambient over 70,rated load (power rating) shall be derated in accordance with the above figure.额定值 Ratings项目 Item 0201 0402 06030805 1206 1210 1812 20102512常规功率系列Normal PowerSeries1/20W 1/16W1/16W1/10W1/8W 1/4W 1/2W 1/2W1W 额定功率Power Rating提升功率系列Upgraded PowerSeries/ /1/10W1/8W1/4W1/3W/ 3/4W/最大工作电压VMax.Working Voltage25 50 50 150200 200 200 200 200最大过负荷电压VMax.Overload Voltage50 100 100 300400 400 400 400 400电阻温度系数Resistance TemperatureCoefficient10R 1M:200ppm/1R<10,1M<R10M:400ppm/10R1M:100ppm/1R<10,1M<R10M:250ppm/阻值范围Resistance Range1~10ME-24E-96系列阻值误差精度Resistance Tolerance5%10%1~10M: 1%2%5%10%10~1M:0.5%1~10M: 1%2%5%10%10~1M:0.5%1% 2% 5%10% 使用温度范围Operating Temperature Range-55~+125额定温度Rated Temperature70注额定电压=额定功率标称电阻值或最大工作电压两者中的较小值Note Rated Voltage=Power Rating Resistance Value or Max. Working Voltage , whichever is lower.特性 Characteristics项目Item标准Specifications测试方法JIS C 5202标准Test Methods (JIS C 5202)端头强度Bending Strength无可见损伤No mechanical damageR 1.0%R+0.05弯曲速度(Speed):1mm/s弯曲距离(Bending Distance):0201040206030805120612103mm1812201025121mm电阻温度系数T.C.R在规定值内within specified T.C.R测定范围-55~+125Measure between -55~+125温度循环TemperatureCycling无可见损伤No mechanical damageR 1.0%R+0.05-5530分钟~常温5分钟~12530分钟5个循环-5530min~normal temperature5min~12530min 5 cycles短时间过负载Short TimeOverload无可见损伤No mechanical damageR 2.0%R+0.052.5倍额定电压或最大过负荷电压取最小者保持5秒2.5Rated voltage or Max. Overload Voltagewhichever is lower for 5 seconds续上表稳态湿热Steady state humidity无可见损伤No mechanical damage R 3.0%R+0.1 40290~95RH 1000小时 402 90~95RH 1000h70耐久性 Load Life无可见损伤No mechanical damageR 3.0%R+0.17021000小时额定电压通1.5小时/断0.5小时7021000hRated voltage 1.5h on/0.5h off上限类别温度耐久性 Endurance atupper temperature 无可见损伤No mechanical damageR 3.0%R+0.11252 1000h 耐溶剂性Resistance toSolvent无可见损伤 No mechanical damage R 1.0%R+0.05 浸入三氯乙烯 10h 1hDip in chloroethylene for 10h 1h .绝缘电阻Insulation Resistance1000M Min在电极与基片间施加100V 直流电压,保持1分钟,然后测绝缘电阻值.Apply DC 100V between substrate and terminationfor 1 minute, then check insulation resistance .耐焊接热 Resistance toSoldering Heat无可见损伤No mechanical damageR 1.0%R+0.052605 10s 1s 可焊性Solderability 可焊面积95% 95% Cover Min2355 2s 0.5s 附着力Adhesion 外观无可见损伤 No mechanical damage 施加力5N 10s 1s Applying 5N 10s 1s包装 Packaging编带包装 Tape and reel * 纸带编带 Paper taping 020104020603080512061210单位unit: mm 型号Type A B W F E 0201 0.700.1 0.400.1 8.00.20 3.50.05 1.750.10402 1.200.1 0.700.1 8.00.20 3.50.05 1.750.10603 1.850.1 1.100.1 8.00.20 3.50.05 1.750.10805 2.350.1 1.650.1 8.00.20 3.50.05 1.750.11206 3.500.2 1.900.2 8.00.20 3.50.05 1.750.11210 3.500.2 2.800.2 8.00.20 3.50.05 1.750.1单位unit: mm 型号Type P P0 P1 ФD0 T 0201 2.00.05 4.00.1 2.00.05 1.50.1 0.5Max0402 2.00.05 4.00.1 2.00.05 1.50.1 0.6Max0603 4.00.1 4.00.1 2.00.05 1.50.1 0.600.10805 4.00.1 4.00.1 2.00.05 1.50.1 0.750.11206 4.00.1 4.00.1 2.00.05 1.50.1 0.750.11210 4.00.1 4.00.1 2.00.05 1.50.1 0.750.1*塑料带编带 Embossed taping单位unit: mm型号Type A0 B0WFEt 1812 4.800.10 3.400.10 12.000.10 5.500.10 1.750.10 0.250.05 2010 5.450.10 2.770.10 12.000.10 5.500.10 1.750.10 0.240.05 25126.730.10 3.400.10 12.000.10 5.500.10 1.750.10 0.240.05单位unit: mm型号Type PP0P1 ФD0ФD1K0 1812 4.000.10 4.000.10 2.000.05 1.550.10 1.500.10 1.000.10 2010 4.000.10 4.000.10 2.000.05 1.50+0.10/-0 1.500.10 0.840.10 25124.000.10 4.000.10 2.000.051.50+0.10/-0 1.500.100.810.10* 卷盘 Reel单位unit: mm型号Type MWTABCD0201 0402 0603 0805 1206 1210 178 2.09.5 1.012.5 1.52.0 0.513.0 0.521.0 0.558.0 2.01812 2010 2512178 2.013.0 0.515.5 1.52.0 0.513.0 0.521.0 0.557.0 2.0*塑料盒包装Bulk case单位unit:mm包装数量 Packaging quantity包装方法Packagingstyle编带Tape and reel塑料盒Bulk case塑料袋散装Bulk型号Type 020104020603080512061210181220102512020104020603 0805 12061210201018122512020104020603080512061210181220102512数量PCSQuantity10000 5000 4000 50000 25000 10000 5000 1500 1000 50000 10000 4000。

贴片电容型对照表三星国巨风华选型替代必备

风华高科电容多层片式陶瓷电容0805 CG 104 J 500 N T1 2 3 4 5 6 71、尺寸2、介质种类3、标称电容量（PF）4、误差级别5、工作电压6、端头类别7、包装方式型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记端头材料标记包装0402 0.04*0.02 1.00*0.5 CG COG和NPO 100 10*100J ±5% 6R3 6.3V S 纯银T 编带0603 0.06*0.03 1.6*0.8 101 10*101G ±2% 100 10V C 纯铜 B 散装0805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF 250 25V N 三层电镀1206 0.12*0.06 3.2*1.6 500 50V三星电容多层片式陶瓷电容CL 10 C 101 J B 8 N N N C1 2 3 4 5 6 7 8 9 10 11CL表示：多层陶瓷贴片电容2、尺寸3介质种类4、标称电容量（PF）5、误差级别6、工作电压7、厚度8端头类别型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记尺寸(mm)标记端头材料0402 0.04*0.02 1.00*0.5 CPRSTUL COGP2HR2HS2HT2HU2JS2L100 10*100 J ±5% R 4V 3 0.3 N 三层电镀0603 0.06*0.03 1.6*0.8 101 10*101 G ±2% Q 6.3V 4 0.50805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF P 10V 89ACD0.8 0.9 0.650.851.001206 0.12*0.06 3.2*1.6 OALB 16V 25V 35V 50VAB Y F X X5RX7RX7SY5VX6SKMZ±10%±20%+80/-20%CDEFGHIJK100V200V250V350V500V630V1000V2000V3000V国巨（YAGEO）电容多层片式陶瓷电容CC ×××× × ×NPO ×BN ×××1 2 3 4 51、尺寸2、误差精度3、包装形式4、实际电压值5、标称电容量型号英制型号公制代码误差表示方法实际值代码电压代码实际值0201 0603 BCDFGJ±0.1PF±0.25PF±0.5PF±1%±2%±5%R 纸卷盘7inch 7 16V 100 10*1000402 1005 K 吸塑卷盘7inch 8 25V 101 10*101 0603 1608 P 纸卷盘13inch 9 50V 102 10*102 0805 2012 F 吸塑卷盘13inch1206 3216 C 散装1210 32251812 4532TDK贴片电容型号TDK贴片电容的参数识别C 2012 X7R 1H 104 K T系列名称体积材料电压容量误差包装0603=0201 CH 0J=6.3V C=0.25 T=卷带1005=0402 COG 1A=10V D=0.5 B=袋装1608=0603 JB 1C=16V J=5%2012=0805 JF 1E=25V K=10%3216=1206 X7R 1H=50V M=20%3225=1210 X5R 2A=100V Z=+80-20%4532=1812 Y5V 2E=250V5650=2220 2J=630V4520=1808 3A=1KV3D=2KV3F=3KV。

贴片电容容量表大全

贴片电容容量表厚度与符号对应表0201～1206 X7R贴片电容选型表1210～2225 X7R贴片电容选型表NPO COG 贴片电容容量规格表默认分类 2009-07-15 16:28 阅读354 评论1字号：大大中中小小NPO(COG)贴片电容属于Class 1温度补偿型电容。

它的容量稳定，几乎不随温度、电压、时间的变化而变化。

尤其适用于高频电子电路。

具有最高的电容量稳定性，在-55℃～125℃工作温度范围内,温度特性为：0±30ppm/℃(COG）、0±60ppm/℃(COH）。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于各种高频电路,如:振荡、计时电路等。

我们把用来制造片式多层瓷介电容（MLCC）的陶瓷叫电容器瓷。

这里所说的瓷介就是用电容器瓷制成的陶瓷介质。

大家知道，陶瓷是一类质硬、性脆的无机烧结体。

就其显微结构而论，大都具有多晶多相结构。

其性能往往决定于其成份和结构。

当配方确定之后，能否达到预期的效果，关键取决于制造陶瓷粉料的工艺。

按其用途可以分为三类：①高频热补偿电容器瓷（UJ、SL）；②高频热稳定电容器瓷（NPO）；③低频高介电容器瓷（X7R、Y5V、Z5U）。

按温度系数分可以分为两类：①负温度系数电容器瓷（即高频热补偿电容器瓷）；②正温度系数电容器瓷（即平时我们常说的COG、X7R、Y5V瓷料）。

按工作频率可以分为三类：低频、高频、微波介质。

高频热补偿、热稳定电容器瓷是专供Ⅰ类瓷介电容器作介质用，其瓷料主要成分是MgTiO3、CaTiO3、SrTiO3和TiO2再加入适量的稀土类氧化物等配制而成。

其特点是介质系数较大，介质损耗小，温度系数和范围广，一般在（+120～-5600）ppm/℃之间可调。

高频热补偿电容瓷常用来制造的负温产品，其用途最广的地方就是振荡回路，像彩电高频头。

大家知道，振荡回路都是由电感和电容构成，回路中的电感线圈一般具有正的电感温度系数。

风华中高压贴片电容规格书

MULTILAYER CHIP CERAMIC CAPACITOR(:)DC Medium-voltage MLCCDC medium-voltage MLCC has good high-voltage reliability,it is made in special design that based on the MLCC technology and equipments.It is suitable for surface-mounting ,can improve the properties of circuits.New monolithic structureThe size of the capacitor is small,yet has high electrostatic capacitance,can operate at high-voltage levels.Has good solderability.Technology Parameter (refer to the picture below):DC-DC converter.The circuit filter and vibration bell of telephone,electrograph and modem.Snubber circuit for switching power supply.FeaturesApplicationsProduct Part Number Expression1206CG100J202NTWMULTILAYER CHIP CERAMIC CAPACITORCapacitance RangeOutside DimensionWMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITOR【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R 1808 (V)10018122225200 200 200 5001000 2000 3000 4000 100 500 1000 2000 3000 4000 100 500 1000 2000 3000 4000 5000 /250 /250 /250100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3 F 10 F 22 F75【南京南山半导体有限公司 — 贴片电容选型资料】ItemX7R Medium-voltage MLCCDielectric 1808 1812 2225 Size Rated 100 200 5001000 2000 3000 4000 100 200 500 1000 2000 3000 4000 100 200 500 1000 2000 3000 4000 5000 /250 /250 Volatage(V) /250 Capacitance 100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3. F 10 F 22 F76【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V 0603 (V) 100 100 0805 200 250 100 1206 200 250 100 1210 200 250 100 1812 200 250 100 2225 200 2501000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 F 2.2 3.3 10 F F F77【南京南山半导体有限公司 — 贴片电容选型资料】ItemY5V Medium-voltage MLCC 1210 100 200 250 100 1812 200 250 100 2225 200 250Dielectric 0603 0508 1206 Size Rated Volatage(V) 100 100 200 250 100 200 250 Capacitance 1000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 2.2 3.3 10 F F F F78【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG1-551251. 2. 3. 2 4. , , , , , 105.3 4 :HP4278A 1. 2. 5 (D.F.) 3. HP4284 25 5 :30% 75% 1.0 0.2V C<1000PF,1.0 0.1MHz; C 1000PF,1.0 0.1KHZ :10( :SF2511) >500V6I.R. 500V: , 60 5>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA 150+0/-10 60 55S 5S 5S824 2 -55 125 25975235 5 5 2 0.5 150+0/-10 5% 0.5PF, 10 1 D.F. 24 2 265 5 24 2 25 2.5mm/ : 25 2.5mm/ 60 524510I.R.1 2100 170120 2001 179【南京南山半导体有限公司 — 贴片电容选型资料】Middle and high Voltage COG MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed innerelectrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified toleranceCr 5PF 0.56% -4 5PF Cr 50PF 1.5[(150/Cr)+7] 10 Cr 50PF 0.15%Check by using microscope10.3 4Dimensions Capacitance Dissipation Factor (DF) Insulation ResistanceUsing micrometer or vernier calipers Measuring Equipment:HP4278 capacitance meter,HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature:25 5 .Humidity: 30%~75%. 2.Measuring Voltage:1.0 0.2V. 3.Measuring Frequency:C<1000PF 1.0 0.1MHz C 1000PF 1.0 0.1KHz Measuring Equipment:Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method:Must measure at rated voltage, and if Ur>500V,then just use 500V,measure the IR within 60 1 seconds. Ur Max. Current Measuring Time 1000V 1000V 2000V 2000V 50mA 50mA 10mA 5S 5S 5S56C<10nF,IR 5 10 C>10nF,IR CR 500S10Withstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur8Must meet the capacitor Capacitance temperature coefficient Temperature requirements within the Characteristics operating temperature range. Solderability Tin coverage 75% should be of the outer electrode covered by Tin Appearance Cap. Change ratio No defects visible 5% or 0.5PF whichever is bigger Same as original standard Same as original standardFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55~125 or 55~85 , the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution, and then dip it into 235 5 eutectic solder solution for 2 0.5 seconds. Dipping speed: 25 2.5mm/second. First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1 seconds. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minutes 1minutes9 Resistance to Soldering10DFIR80【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR1 10N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 12 55Hz10 55Hz 10Hz 2 6 123 420 mmmm3mm mm mm mmmm150+0/-10 14 24 260 524 281【南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Adhesive Strength of TerminationStandard No removal of the termination or other defect shall occurTest Method Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder.Then apply a 10N force inthe direction shown as the arrowhead.The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc.11Fig.1 Vibration Resistance10N,10 1s Speed:1.0mm/s Glss epoxy resin board12Appearance No defects or Solder the capacitor to the test jig (glass epoxy resin abnormities board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the Capacitance Within the frequency being varied uniformly between the specified approximate limits of 10 and 55Hz, shall be traversed tolerance range (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute.This motion shall be applied for a period of 2 DF Same as hours in each 3 mutually perpendicular directions original (total is 6 hours). standardFig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown in Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. mmmm13mmmm mmmmTemperature Cycle 14Appearance No defects or abnormitiesPre-treatment: Heat-treat the capacitor for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Perform five cycles according to the four heat treatments listed in the following table. Set it for 24 2 hours at room temperature, the measure.82【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR2.5% 0.25PF, min. 14 D.F. I.R. 10000M 1 2 3 4 2 3 30 2 30 2 3 3 3 34029095 24 2500+24/-05% 0.5PF, 15 ( ) D.F. I.R. 10000M1.5 50mA ( 5% 0.5PF, 16 .) >2000V100012 24 21.2D.F. I.R. 10000M83【南京南山半导体有限公司 — 贴片电容选型资料】NumberItems Temperature CycleStandard Cap. Change ratio 2.5% or 0.25PF whichever is larger Same as original standard More than 10000M Heat-treatment:Test MethodD.F. 14 I.R.Stage Temperature Time 1 lowest operating temperature 3 30 2 2 Room Temperature 3 Highes operating temperature 2 30 4 Room Temperature 2min. 3 3 3 3Humidity Steady State 15AppearanceNo defects or abnormities 5% or 0.5PF whichever is larger Same as original standard More than 10000M No defects or abnormities 5% or 0.5PF (whichever is larger) Same as original standard More than 10000MSet the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.Cap. Change ratioD.F.I.R. Life Test AppearanceCap. Change ratio 16Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2times Ur to test)D.F.I.R.84【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R1-551251. 2. 3. 2 4. , , , , , 105.3 4 : HP4278A HP42845(D.F.)25010-41.255:30% 75% 2. 3. : :1.0 :1.0 0.2V 0.1KHz ( :SF2511 ) >500V , 60 56I.R.C 25nF,IR 10000M C>25nF,R C 500S 500V:>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA5S 5S 5S150+0/-10 24 8 25 -55 125 2605235 9 75 245 5 25 2.5mm/ 2 0.5585【南京南山半导体有限公司 — 贴片电容选型资料】General X7R MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of the termination width. Within the specified dimensions Within the specified tolerance 250 10-4Check by using microscope10 .3 4Dimensions Capacitance Dissipation Factor (DF)5Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency:1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 1 seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5SInsulation Resistance 6C 25nF,IR 10000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000V8Capacitance Temperature CharacteristicsMust meet the capacitor character temperature coefficient requirements within the operating temperature range. 75% of the outer electrode should be covered by TinFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 ,then set it for 24 2 hours at room temperature. Measure the capacitance at -55 125 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 245 5 eutectic solder solution for 2 0.5 seconds. Dipping speed:25 2.5mm/second.Solderability 986【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 10% D.F. 10 I.R. 25 : 10 1 24 2 26560 5 24522.5mm/1 2100 170120 2001 1110N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 55Hz 55Hz 10Hz 1 2 12 6 1023 13 ( ) 487【南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Within 10% ratio DF 10 IR Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defect shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1388【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mmmmmm13mmmmmmmmmin. 20% 1 2 14 D.F. I.R. 3 4 2 3 30 2 30 2 3 3 3 340 20% 15 ( ) D.F. I.R.29095 48 2500+24/-01.5 20% .) 16 D.F. I.R 50mA ( >2000V100012 24 21.289【南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmmmm13mm mmmmTemperature CycleAppearanceNo defects or abnormities 20%Cap. Change Within ratio 14Stage Temperature Time min. 1 Min. Operating Temperature 3 30 3 2 Room Temperature 2 3 3 Max. Operating Temperature 2 30 3 4 Room Temperature 2 3D.F.Same as original Specification Same as original Specification No defects or abnormities 20% Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 48 2 hours at room temperature, then measure.I.R.Humidity Steady StateAppearanceCap. Change within ratio D.F.15 I.R. Life Test AppearanceSame as original Specification Same as original Specification No defects or abnonrmities 20% Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2Ur to test.)Cap. Change within ratio 16 D.F.Same as original specification Same as original specificationI.R.90【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V1-25~851. 2. 3. 2 4. 5. , , , , ,103 4 : HP4278A 1. 5 (D.F.) 500 10-4HP4284 25 5 75% 0.2V 0.1kHz:30% 2. 3. : :1.0 :1.06I.R.C 25nF,IR 40000M C>25nF,R C 500S( : ,: SF2511 60 5)7>300V >400V >500V100V 200V 250V50mA 50mA 50mA5S 5S 5S150+0/-10 8 24 -25 85 2605 25975235 25 0.52455 25 2.5mm/91【南京南山半导体有限公司 — 贴片电容选型资料】General Y5V MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -25 85 Standard Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified tolerance 500 10-4Check by using microscope10.3 4Dimensions Capacitance) Dissipation Factor (DF)Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency: 1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 5seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5S5Insulation Resistance 6C 25nF,IR 40000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000VCapacitance Temperature Characteristics 8Must meet the capacitor temperature coefficient requirements within the operating temperature range.First, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55 125 or 55 85 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 235 5 (or 245 5 leadless eutectic solder solution) eutectic solder solution hanging lead for 2 0.5seconds. Dipping speed: 25 2.5mm/second.Solderability 975% of the outer electrode should be covered by Tin92【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 30% D.F. I.R. 10 60 5 24 22655 24 2 25 2.5mm/ :1011 2100 170120 200 11 110N11 10N,10 1 :1.0mm/ 11.5mm D.F. 10 55Hz 12 55Hz 10Hz 1 2 6 1023 ( 13 ) 493【南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Z5U, Y5V: within ratio DF 10 IR30%Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defects shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1394【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mm mmmm13mm mmmmmm30%min. 1 2 3 4 3 2 30 2 30 2 3 3 3 3D.F. 14 I.R.40 30%29095 48 2500+24/-015()D.F. I.R.30% 16 D.F. I.R 48 21.5 50mA10001295【南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmm13mmmmmmmmTemperature CycleAppearanceNo defects or abnonrmities 2.5Cap. Change Within ratio 14Stage Temperature Time 30 1 Min. Operating Temperature 3 2 Room Temperature 2 3 Max. Operating Temperature 2 30 4 Room Temperature 2min. 3 3 3 3D.F.Same as original spec. Same as original spec. No defects or abnonrmities Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.I.R.Humidity Steady State 15AppearanceCap. Change within 30% ratio Same as D.F. original spec. I.R. Same as original spec. No defects or abnonrmities 30%Life TestAppearanceCap. Change within ratio 16 D.F.Same as original spec. Same as original spec.Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.I.R.96。

1nF贴片电容0603CG102J500NT《风华电容样品单》

声明：1、本规格书是由风华高科授权代理商－南京南山半导体有限公司自风华高科官方网站下载整理，若有变更，恕不另行通知；2、本规格书没有足够的空间说明详细电性能参数，仅列明了标准规格，在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

|特性*具有高电容量稳定性，在-55℃~125℃工作范围内，其温度系数为0±30ppm/℃、0±60ppm/℃*独石结构，具有高可靠性。

*优良的焊接性和耐旱性，适合于回流焊和波峰焊。

|贴片电容封装代号与外形尺寸L(长)尺寸 1.6±0.1mm W(宽)尺寸0.8±0.1mm T(高)尺寸0.8±0.1mm 电极宽度wb 0.30±0.10mm 公制封装代号1608英制封装代号0603|通用型贴片电容特性曲线※贴片电容交流特性图※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图贴片电感样品申请单南山联系资料总机：技术支持：客服：传真：电邮：客户基本资料公司名称网址：联系方式电话：传真：□生产型企业□贸易商收货地址生产产品姓名：职务：□技术□采购□其他联络人电话：手机：电邮：样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期：规模生产日期：样品申请日期：样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写，可自行复制。

Service@2、请以附件的形式将该文档通过E-mail发送，并请将此单打印盖章后，电邮至：：。

3、公司将根据客户所填信息并综合相关情况，由样品小组负责确定该样品申请单是否执行及如何执行。

4、收到样品申请单并经审核通过后，南京库有现货2个工作日内发出；如需订货，交期3-4周，非常规品顺延1-2周。

5、样品免费，运费到付(一般选择顺丰快递)；样品数量：单个型号5～20pcs，或根据BOM表清单按2～5套提供。

风华瓷片电容规格

损耗低、容量稳定性高，电容量变化与温度呈线性关系。多种温度系数，适用于谐振回路及温度补偿效应的电路。
Low DF, stable capacitance, the linear capacitance change with temperature. Designed from all series T.C suits for resonant circuit and temperature compensated circuit.
5 瓷片电容引线形式 Lead style
代号 symbol
引线形式
1
直脚 (长20mm-28mm)b
2
直脚 (长16mm-19mm)b
3
切脚(短脚)
4
编带直脚型 (b )
5
编带小内弯型
6
编带大内弯型 (a )
7
特殊脚型 (b )
8
双外弯 (c )
9
外单弯(w )
0
前后弯 (b )
Style Straight lead (length 20mm) Straight lead (length 16mm)
CC81 CT1
高压高电介质常数瓷片电容器半导体瓷片电容器
CT81 CS1
交流瓷片电容器
CT7
Low voltage temperature compensated disk ceramic capacitor High voltage temperature compensated disk ceramic capacitor Low voltage high dielectric constant disk ceramic capacitor High voltage high dielectric constant disk ceramic capacitor Semiconductor dielectric insulator disk ceramic capacitor Alternating current disk ceramic capacitor

三星国巨、风华高科贴片电容型号对照表选型替代必备

0402
0.04*0.02
1.00*0.5
C
P
R
S
T
U
L
COG
P2H
R2H
S2H
T2H
U2J
S2L
100
10*100
J
±5%
R
4V
3
0.3
N
三层电镀
0603
0.06*0.03
1.6*0.8
101
10*101
G
±2%
Q
6.3V
4
0.5
0805
0.08*0.05
2.00*1.25
102
10*102
C
±0.25PF
风华高科电容
多层片式陶瓷电容
0805CG104J500NT
1 2 3 4 5 6 7
1、尺寸
2、介质种类
3、标称电容量（PF）
4、误差级别
5、工作电压
6、端头类别
7、包装方式
型号
英寸
毫米
代码
介质材料
表示方法
实际值
代码
误差
表示方法
实际电压
标记
端头材料
标记
包装
0402
0.04*0.02
1.00*0.5
CG
E
F
H
I
J
L
M
P
Q
S
U
V
Y
1.10
1.25
1.60
2.00
2.50
3.20
1.15
1.15
1.25
1.35
1.80
2.50
1.25
国巨（YAGEO）电容

贴片电容型对照表三星国巨风华选型替代必备

贴片电容型对照表三星国巨风华选型替代必备 SANY标准化小组 #QS8QHH-HHGX8Q8-GNHHJ8-HHMHGN#风华高科电容多层片式陶瓷电容0805CG104J500NT 1 23 4 5 6 71、尺寸2、介质种类3、标称电容量（PF ）4、误差级别5、工作电压6、端头类别7、包装方式型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记端头材料标记包装 0402 * * CG COG 和NPO 100 10*100J ±5%6R3 S 纯银 T 编带0603 * * 101 10*101G ±2%100 10V C 纯铜 B 散装0805 * * 102 10*102C ±250 25V N 三层电镀 1206**500 50V三星电容多层片式陶瓷电容CL10C101JB8NNNC 1 234 5 6 7 8 9 10 11CL 表示：多层陶瓷贴片电容2、尺寸3介质种类4、标称电容量（PF ）5、误差级别6、工作电压7、厚度8端头类别型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记尺寸(mm) 标记端头材料 0402 * * C P R S T U L COG P2H R2H S2H T2H U2J S2L 100 10*100 J ±5% R 4V 3N 三层电镀 0603 * * 101 10*101 G ±2% Q 40805 * * 102 10*102 C ± P 10V 89 A C D1206**O A L B 16V25V35V50VA ？B ？ Y F XX5R X7R X7S Y5V X6SK M Z±10% ±20% +80/-20% C D E F G H I J K 100V200V 250V350V 500V 630V 1000V 2000V 3000V多层片式陶瓷电容CC ×××××× NPO × BN ×××123 45TDK型号TDK贴片电容的参数识别C 2012 X7R 1H 104 K T系列名称体积材料电压容量误差包装0603=0201 CH 0J= C= T=卷带1005=0402 COG 1A=10V D= B=袋装1608=0603 JB 1C=16V J=5%2012=0805 JF 1E=25V K=10%3216=1206 X7R 1H=50V M=20%3225=1210 X5R 2A=100V Z=+80-20% 4532=1812 Y5V 2E=250V5650=2220 2J=630V4520=1808 3A=1KV3D=2KV3F=3KV。

贴片电容型号对照表三星国巨风华 -选型替代必备

风华高科电容多层片式陶瓷电容0805 CG 104 J 500 N T1 2 3 4 5 6 71、尺寸2、介质种类3、标称电容量（PF）4、误差级别5、工作电压6、端头类别7、包装方式型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记端头材料标记包装0402 0.04*0.02 1.00*0.5 CG COG和NPO 100 10*100J ±5% 6R3 6.3V S 纯银T 编带0603 0.06*0.03 1.6*0.8 101 10*101G ±2% 100 10V C 纯铜 B 散装0805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF 250 25V N 三层电镀1206 0.12*0.06 3.2*1.6 500 50V三星电容多层片式陶瓷电容CL 10 C 101 J B 8 N N N C1 2 3 4 5 6 7 8 9 10 11CL表示：多层陶瓷贴片电容2、尺寸3介质种类4、标称电容量（PF）5、误差级别6、工作电压7、厚度8端头类别型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记尺寸(mm)标记端头材料0402 0.04*0.02 1.00*0.5 CPRSTUL COGP2HR2HS2HT2HU2JS2L100 10*100 J ±5% R 4V 3 0.3 N 三层电镀0603 0.06*0.03 1.6*0.8 101 10*101 G ±2% Q 6.3V 4 0.50805 0.08*0.05 2.00*1.25 102 10*102 C ±0.25PF P 10V 89ACD0.8 0.9 0.650.851.001206 0.12*0.06 3.2*1.6 OALB 16V 25V 35V 50VAB Y F X X5RX7RX7SY5VX6SKMZ±10%±20%+80/-20%CDEFGHIJK100V200V250V350V500V630V1000V2000V3000V国巨（YAGEO）电容多层片式陶瓷电容CC ×××× × ×NPO ×BN ×××1 2 3 4 51、尺寸2、误差精度3、包装形式4、实际电压值5、标称电容量型号英制型号公制代码误差表示方法实际值代码电压代码实际值0201 0603 BCDFGJ±0.1PF±0.25PF±0.5PF±1%±2%±5%R 纸卷盘7inch 7 16V 100 10*1000402 1005 K 吸塑卷盘7inch 8 25V 101 10*101 0603 1608 P 纸卷盘13inch 9 50V 102 10*102 0805 2012 F 吸塑卷盘13inch1206 3216 C 散装1210 32251812 4532TDK贴片电容型号TDK贴片电容的参数识别C 2012 X7R 1H 104 K T系列名称体积材料电压容量误差包装0603=0201 CH 0J=6.3V C=0.25 T=卷带1005=0402 COG 1A=10V D=0.5 B=袋装1608=0603 JB 1C=16V J=5%2012=0805 JF 1E=25V K=10%3216=1206 X7R 1H=50V M=20%3225=1210 X5R 2A=100V Z=+80-20%4532=1812 Y5V 2E=250V5650=2220 2J=630V4520=1808 3A=1KV3D=2KV3F=3KV。

电容的图片实例

元件值工作电压
c、大容量聚脂电容：材质聚脂薄膜，外观上呈方形，有蓝色和黑色，薄膜材料为聚乙烯。表面有丝印，无极性。容量比较大一般为微法级，工作电压比较高一般在交流220V以上。并且大部分有安全要求。
容值识别规则：第一、二位表示元件值有效数字，第三位表示有效数字后应乘的位数。且印有工作电压。基本单位： μF。
元件值读取的例子：图片中电容的丝印为100，读取其元件值：第一、二位10 X 第三位0＝10X1＝10μF 250V~表示工作电压为交流250V。
工作电压
电容值
负极标示
温度系数
容许误差
d、电解电容：材质电解质。外观上有一端引脚方式和两端引脚方式元件有丝印，有极性。电容值的辨认非常容易因为厂家将容量及单位都印在电容的封套上，并且印有工作电压、容许误差、温度系数等。
b、贴片纸多层电容：普通型，材质纸质。表面部分厂家的元件有丝印，外形主要有椭圆和方形两种，外观上椭圆形一般呈银白有金属光泽、方形呈褐色，从侧面能看到纸介质分层情况。这种电容没有极性。尺寸有各种大小，但体积一般较大（主要尺寸见附页1贴片元件尺寸介绍）。
普通贴片电容的基本单位：pF. 但此电容量一般较大在μF级。
元件值读取的例子：图片中电容的丝印为561K，读取其元件值：
第一、二位56 X 第三位1＝56X10＝560pF K表示容许误差：10% ，B代表温度系数:-25℃~85℃
元件值
容许误差工作电压
b、聚脂电容：材质聚脂薄膜，外观上有绿色、红褐色和透明的，薄膜材料有聚丙烯和聚乙烯两种，绿色和透明的一般为聚乙烯，红褐色一般为聚丙烯。性能上聚丙烯优于聚乙烯。表面有丝印，无极性。

各类电容图片一览

各类电容图片一览第1幅图1 胆电容。

图2 灯具电容器。

图3 MKPH电容。

图4 MET电容。

图5，10 PEI电容，图6，胆贴片电容。

图7 MPE电容。

图8贴片电容。

图11 轴向电解电容器。

图12 MPP电容838电子第2幅ab126计算公式大全新艺图库图1 PPN电容。

图2 PET电容。

图3 MEA电容图4MPB 电容。

图5 PPT 电容。

图6 MPT电容。

图7电解电容器。

图8 MET电容。

图9 MKPH电容。

图10，11电机用电容。

图12 MKS电容。

第3幅：ab126计算公式大全新艺图库图1 MKS电容。

图2 瓷片电容。

图3 ，4 MKP电容。

图5 贴片电解电容。

图6 史普瑞电容 Sprague Orange Drop Capacitors。

图7 电机用电容。

图8 MKT电容。

图9陶瓷电容。

8第4幅：图1 MKS电容。

图3，8 云母电容。

图4 MPP电容。

图5 MKP 电容。

图9 MEP电容。

图10 MPP电容。

图11 PPN电容。

图12 PEI 电容。

8第5幅：ab126计算公式大全新艺图库图1，2，3，陶瓷电容器。

图4 色环陶瓷电容。

图5，10，11，电机起动及运行电容器。

图12充放电用电容838电子第6幅：图1 双连调谐电容。

图2微调电容。

图3 四连调谐电容。

图4 单连调谐电容。

11pF贴片电容0603CG110J500NT《风华电容样品单》

FENGHUA风华规格书

27pF贴片电容0603CG270J500NT《风华电容样品单》

11pF贴片电容0603CG110J500NT《风华电容样品单》

风华贴片电容全系列规格书

风华LP铝电解电容规格书

风华贴片电阻规格书

贴片电容型对照表三星国巨风华选型替代必备

贴片电容容量表大全

风华中高压贴片电容规格书

1nF贴片电容0603CG102J500NT《风华电容样品单》

风华瓷片电容规格

三星国巨、风华高科贴片电容型号对照表 选型替代必备

贴片电容型对照表三星国巨风华选型替代必备

贴片电容型号对照表 三星 国巨 风华 -选型替代必备

电容的图片实例

各类电容图片一览

三星国巨、风华高科贴片电容型号对照表选型替代必备

贴片电容型号对照表三星国巨风华 -选型替代必备