MAX5510ETC-T中文资料
TLC5510中文资料
8位高速A/D转换器TLC5510中文资料2009-07-20 15:34TLC5510是美国德州仪器(TI)公司生产的8位半闪速结构模数转换器,它采用CMOS工艺制造,可提供最小20Msps的采样率。
可广泛用于数字TV。
医学图像。
视频会议。
高速数据转换以及QAM解调器等方面。
文中介绍了TLC5510的性能指标。
引脚功能。
内部结构和操作时序,给出了TLC5510的应用线路设计和参考电压的配置方法。
关键词:高速AD转换;数据采集;TLC55101概述TLC5510是美国TI公司生产的新型模数转换器件(ADC),它是一种采用CMOS工艺制造的8位高阻抗并行A/D芯片,能提供的最小采样率为20MSPS。
由于TLC5510采用了半闪速结构及CMOS工艺,因而大大减少了器件中比较器的数量,而且在高速转换的同时能够保持较低的功耗。
在推荐工作条件下,TLC5510的功耗仅为130mW。
由于TLC5510不仅具有高速的A/D转换功能,而且还带有内部采样保持电路,从而大大简化了外围电路的设计;同时,由于其内部带有了标准分压电阻,因而可以从+5V的电源获得2V满刻度的基准电压。
TLC5510可应用于数字TV。
医学图像。
视频会议。
高速数据转换以及QAM解调器等方面。
2内部结构。
引脚说明及工作原理2.1TLC5510的引脚说明TLC5510为24引脚。
PSOP表贴封装形式(NS)。
其引脚排列如图1所示。
各引脚功能如下:AGND:模拟信号地;ANALOGIN:模拟信号输入端;CLK:时钟输入端;DGND:数字信号地;D1~D8:数据输出端口。
D1为数据最低位,D8为最高位;OE:输出使能端。
当OE为低时,D1~D8数据有效,当OE为高时,D1~D8为高阻抗;VDDA:模拟电路工作电源;VDDD:数字电路工作电源;REFTS:内部参考电压引出端之一,当使用内部电压分压器产生额定的2V基准电压时,此端短路至REFT端;REFT:参考电压引出端之二;REFB:参考电压引出端之三;REFBS:内部参考电压引出端之四,当使用内部电压基准器产生额定的2V基准电压时,此端短路至REFB端。
MAX485CPA+中文资料
For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .General DescriptionThe MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 are low-power transceivers for RS-485 and RS-422 communication. Each part contains one driver and one receiver. The MAX483, MAX487, MAX488, and MAX489feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables,thus allowing error-free data transmission up to 250kbps.The driver slew rates of the MAX481, MAX485, MAX490,MAX491, and MAX1487 are not limited, allowing them to transmit up to 2.5Mbps.These transceivers draw between 120µA and 500µA of supply current when unloaded or fully loaded with disabled drivers. Additionally, the MAX481, MAX483, and MAX487have a low-current shutdown mode in which they consume only 0.1µA. All parts operate from a single 5V supply.Drivers are short-circuit current limited and are protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-imped-ance state. The receiver input has a fail-safe feature that guarantees a logic-high output if the input is open circuit.The MAX487 and MAX1487 feature quarter-unit-load receiver input impedance, allowing up to 128 MAX487/MAX1487 transceivers on the bus. Full-duplex communi-cations are obtained using the MAX488–MAX491, while the MAX481, MAX483, MAX485, MAX487, and MAX1487are designed for half-duplex applications.________________________ApplicationsLow-Power RS-485 Transceivers Low-Power RS-422 Transceivers Level TranslatorsTransceivers for EMI-Sensitive Applications Industrial-Control Local Area Networks__Next Generation Device Features♦For Fault-Tolerant ApplicationsMAX3430: ±80V Fault-Protected, Fail-Safe, 1/4Unit Load, +3.3V, RS-485 TransceiverMAX3440E–MAX3444E: ±15kV ESD-Protected,±60V Fault-Protected, 10Mbps, Fail-Safe, RS-485/J1708 Transceivers♦For Space-Constrained ApplicationsMAX3460–MAX3464: +5V, Fail-Safe, 20Mbps,Profibus RS-485/RS-422 TransceiversMAX3362: +3.3V, High-Speed, RS-485/RS-422Transceiver in a SOT23 PackageMAX3280E–MAX3284E: ±15kV ESD-Protected,52Mbps, +3V to +5.5V, SOT23, RS-485/RS-422,True Fail-Safe ReceiversMAX3293/MAX3294/MAX3295: 20Mbps, +3.3V,SOT23, RS-855/RS-422 Transmitters ♦For Multiple Transceiver ApplicationsMAX3030E–MAX3033E: ±15kV ESD-Protected,+3.3V, Quad RS-422 Transmitters ♦For Fail-Safe ApplicationsMAX3080–MAX3089: Fail-Safe, High-Speed (10Mbps), Slew-Rate-Limited RS-485/RS-422Transceivers♦For Low-Voltage ApplicationsMAX3483E/MAX3485E/MAX3486E/MAX3488E/MAX3490E/MAX3491E: +3.3V Powered, ±15kV ESD-Protected, 12Mbps, Slew-Rate-Limited,True RS-485/RS-422 TransceiversMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________Selection Table19-0122; Rev 8; 10/03Ordering Information appears at end of data sheet.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSSupply Voltage (V CC ).............................................................12V Control Input Voltage (RE , DE)...................-0.5V to (V CC + 0.5V)Driver Input Voltage (DI).............................-0.5V to (V CC + 0.5V)Driver Output Voltage (A, B)...................................-8V to +12.5V Receiver Input Voltage (A, B).................................-8V to +12.5V Receiver Output Voltage (RO).....................-0.5V to (V CC +0.5V)Continuous Power Dissipation (T A = +70°C)8-Pin Plastic DIP (derate 9.09mW/°C above +70°C)....727mW 14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)..800mW 8-Pin SO (derate 5.88mW/°C above +70°C).................471mW14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW 8-Pin µMAX (derate 4.1mW/°C above +70°C)..............830mW 8-Pin CERDIP (derate 8.00mW/°C above +70°C).........640mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C).......727mW Operating Temperature RangesMAX4_ _C_ _/MAX1487C_ A...............................0°C to +70°C MAX4__E_ _/MAX1487E_ A.............................-40°C to +85°C MAX4__MJ_/MAX1487MJA...........................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CDC ELECTRICAL CHARACTERISTICS(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V V IN = -7VV IN = 12V V IN = -7V V IN = 12V Input Current (A, B)I IN2V TH k Ω48-7V ≤V CM ≤12V, MAX487/MAX1487R INReceiver Input Resistance -7V ≤V CM ≤12V, all devices except MAX487/MAX1487R = 27Ω(RS-485), Figure 40.4V ≤V O ≤2.4VR = 50Ω(RS-422)I O = 4mA, V ID = -200mV I O = -4mA, V ID = 200mV V CM = 0V-7V ≤V CM ≤12V DE, DI, RE DE, DI, RE MAX487/MAX1487,DE = 0V, V CC = 0V or 5.25VDE, DI, RE R = 27Ωor 50Ω, Figure 4R = 27Ωor 50Ω, Figure 4R = 27Ωor 50Ω, Figure 4DE = 0V;V CC = 0V or 5.25V,all devices except MAX487/MAX1487CONDITIONSk Ω12µA ±1I OZRThree-State (high impedance)Output Current at ReceiverV 0.4V OL Receiver Output Low Voltage 3.5V OH Receiver Output High Voltage mV 70∆V TH Receiver Input Hysteresis V -0.20.2Receiver Differential Threshold Voltage-0.2mA 0.25mA-0.81.01.55V OD2Differential Driver Output (with load)V 2V 5V OD1Differential Driver Output (no load)µA±2I IN1Input CurrentV 0.8V IL Input Low Voltage V 2.0V IH Input High Voltage V 0.2∆V OD Change in Magnitude of Driver Common-Mode Output Voltage for Complementary Output States V 0.2∆V OD Change in Magnitude of Driver Differential Output Voltage for Complementary Output States V 3V OC Driver Common-Mode Output VoltageUNITS MINTYPMAX SYMBOL PARAMETERMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________3SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)DC ELECTRICAL CHARACTERISTICS (continued)(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)ns 103060t PHLDriver Rise or Fall Time Figures 6 and 8, R DIFF = 54Ω, C L1= C L2= 100pF ns MAX490M, MAX491M MAX490C/E, MAX491C/E2090150MAX481, MAX485, MAX1487MAX490M, MAX491MMAX490C/E, MAX491C/E MAX481, MAX485, MAX1487Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pF MAX481 (Note 5)Figures 5 and 11, C RL = 15pF, S2 closedFigures 5 and 11, C RL = 15pF, S1 closed Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFFigures 6 and 8,R DIFF = 54Ω,C L1= C L2= 100pF Figures 6 and 10,R DIFF = 54Ω,C L1= C L2= 100pF CONDITIONS ns 510t SKEW ns50200600t SHDNTime to ShutdownMbps 2.5f MAX Maximum Data Rate ns 2050t HZ Receiver Disable Time from High ns 103060t PLH 2050t LZ Receiver Disable Time from Low ns 2050t ZH Driver Input to Output Receiver Enable to Output High ns 2050t ZL Receiver Enable to Output Low 2090200ns ns 134070t HZ t SKD Driver Disable Time from High |t PLH - t PHL |DifferentialReceiver Skewns 4070t LZ Driver Disable Time from Low ns 4070t ZL Driver Enable to Output Low 31540ns51525ns 31540t R , t F 2090200Driver Output Skew to Output t PLH , t PHL Receiver Input to Output4070t ZH Driver Enable to Output High UNITS MIN TYP MAX SYMBOL PARAMETERFigures 7 and 9, C L = 100pF, S2 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 7 and 9, C L = 15pF, S1 closed Figures 7 and 9, C L = 15pF, S2 closedM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 4_______________________________________________________________________________________SWITCHING CHARACTERISTICS—MAX483, MAX487/MAX488/MAX489(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487 (continued)(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)3001000Figures 7 and 9, C L = 100pF, S2 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 5 and 11, C L = 15pF, S2 closed,A - B = 2VCONDITIONSns 40100t ZH(SHDN)Driver Enable from Shutdown toOutput High (MAX481)nsFigures 5 and 11, C L = 15pF, S1 closed,B - A = 2Vt ZL(SHDN)Receiver Enable from Shutdownto Output Low (MAX481)ns 40100t ZL(SHDN)Driver Enable from Shutdown toOutput Low (MAX481)ns 3001000t ZH(SHDN)Receiver Enable from Shutdownto Output High (MAX481)UNITS MINTYP MAX SYMBOLPARAMETERt PLH t SKEW Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFt PHL Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFDriver Input to Output Driver Output Skew to Output ns 100800ns ns 2000MAX483/MAX487, Figures 7 and 9,C L = 100pF, S2 closedt ZH(SHDN)Driver Enable from Shutdown to Output High2502000ns2500MAX483/MAX487, Figures 5 and 11,C L = 15pF, S1 closedt ZL(SHDN)Receiver Enable from Shutdown to Output Lowns 2500MAX483/MAX487, Figures 5 and 11,C L = 15pF, S2 closedt ZH(SHDN)Receiver Enable from Shutdown to Output Highns 2000MAX483/MAX487, Figures 7 and 9,C L = 100pF, S1 closedt ZL(SHDN)Driver Enable from Shutdown to Output Lowns 50200600MAX483/MAX487 (Note 5) t SHDN Time to Shutdownt PHL t PLH , t PHL < 50% of data period Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 7 and 9, C L = 15pF, S2 closed Figures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFFigures 7 and 9, C L = 15pF, S1 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 7 and 9, C L = 100pF, S2 closed CONDITIONSkbps 250f MAX 2508002000Maximum Data Rate ns 2050t HZ Receiver Disable Time from High ns 25080020002050t LZ Receiver Disable Time from Low ns 2050t ZH Receiver Enable to Output High ns 2050t ZL Receiver Enable to Output Low ns ns 1003003000t HZ t SKD Driver Disable Time from High I t PLH - t PHL I DifferentialReceiver SkewFigures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFns 3003000t LZ Driver Disable Time from Low ns 2502000t ZL Driver Enable to Output Low ns Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFns 2502000t R , t F 2502000Driver Rise or Fall Time ns t PLH Receiver Input to Output2502000t ZH Driver Enable to Output High UNITS MIN TYP MAX SYMBOL PARAMETERMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________530002.5OUTPUT CURRENT vs.RECEIVER OUTPUT LOW VOLTAGE525M A X 481-01OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )1.515100.51.02.0203540450.90.1-50-252575RECEIVER OUTPUT LOW VOLTAGE vs.TEMPERATURE0.30.7TEMPERATURE (°C)O U T P U TL O W V O L T A G E (V )500.50.80.20.60.40100125-20-41.5 2.0 3.0 5.0OUTPUT CURRENT vs.RECEIVER OUTPUT HIGH VOLTAGE-8-16M A X 481-02OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )2.5 4.0-12-18-6-14-10-203.54.5 4.83.2-50-252575RECEIVER OUTPUT HIGH VOLTAGE vs.TEMPERATURE3.64.4TEMPERATURE (°C)O U T P UT H I G H V O L T A G E (V )0504.04.63.44.23.83.01001259000 1.0 3.0 4.5DRIVER OUTPUT CURRENT vs.DIFFERENTIAL OUTPUT VOLTAGE1070M A X 481-05DIFFERENTIAL OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )2.0 4.05030806040200.5 1.5 2.53.5 2.31.5-50-2525125DRIVER DIFFERENTIAL OUTPUT VOLTAGEvs. TEMPERATURE1.72.1TEMPERATURE (°C)D I F FE R E N T I A L O U T P U T V O L T A G E (V )751.92.21.62.01.8100502.4__________________________________________Typical Operating Characteristics(V CC = 5V, T A = +25°C, unless otherwise noted.)NOTES FOR ELECTRICAL/SWITCHING CHARACTERISTICSNote 1:All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to deviceground unless otherwise specified.Note 2:All typical specifications are given for V CC = 5V and T A = +25°C.Note 3:Supply current specification is valid for loaded transmitters when DE = 0V.Note 4:Applies to peak current. See Typical Operating Characteristics.Note 5:The MAX481/MAX483/MAX487 are put into shutdown by bringing RE high and DE low. If the inputs are in this state for lessthan 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See Low-Power Shutdown Mode section.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 6___________________________________________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = 5V, T A = +25°C, unless otherwise noted.)120008OUTPUT CURRENT vs.DRIVER OUTPUT LOW VOLTAGE20100M A X 481-07OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )6604024801012140-1200-7-5-15OUTPUT CURRENT vs.DRIVER OUTPUT HIGH VOLTAGE-20-80M A X 481-08OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )-31-603-6-4-2024-100-40100-40-60-2040100120MAX1487SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )20608050020060040000140100-50-2550100MAX481/MAX485/MAX490/MAX491SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )257550020060040000125100-50-2550100MAX483/MAX487–MAX489SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )257550020060040000125MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________7______________________________________________________________Pin DescriptionFigure 1. MAX481/MAX483/MAX485/MAX487/MAX1487 Pin Configuration and Typical Operating CircuitM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487__________Applications InformationThe MAX481/MAX483/MAX485/MAX487–MAX491 and MAX1487 are low-power transceivers for RS-485 and RS-422 communications. The MAX481, MAX485, MAX490,MAX491, and MAX1487 can transmit and receive at data rates up to 2.5Mbps, while the MAX483, MAX487,MAX488, and MAX489 are specified for data rates up to 250kbps. The MAX488–MAX491 are full-duplex trans-ceivers while the MAX481, MAX483, MAX485, MAX487,and MAX1487 are half-duplex. In addition, Driver Enable (DE) and Receiver Enable (RE) pins are included on the MAX481, MAX483, MAX485, MAX487, MAX489,MAX491, and MAX1487. When disabled, the driver and receiver outputs are high impedance.MAX487/MAX1487:128 Transceivers on the BusThe 48k Ω, 1/4-unit-load receiver input impedance of the MAX487 and MAX1487 allows up to 128 transceivers on a bus, compared to the 1-unit load (12k Ωinput impedance) of standard RS-485 drivers (32 trans-ceivers maximum). Any combination of MAX487/MAX1487 and other RS-485 transceivers with a total of 32 unit loads or less can be put on the bus. The MAX481/MAX483/MAX485 and MAX488–MAX491 have standard 12k ΩReceiver Input impedance.Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 8_______________________________________________________________________________________Figure 2. MAX488/MAX490 Pin Configuration and Typical Operating CircuitFigure 3. MAX489/MAX491 Pin Configuration and Typical Operating CircuitMAX483/MAX487/MAX488/MAX489:Reduced EMI and ReflectionsThe MAX483 and MAX487–MAX489 are slew-rate limit-ed, minimizing EMI and reducing reflections caused by improperly terminated cables. Figure 12 shows the dri-ver output waveform and its Fourier analysis of a 150kHz signal transmitted by a MAX481, MAX485,MAX490, MAX491, or MAX1487. High-frequency har-monics with large amplitudes are evident. Figure 13shows the same information displayed for a MAX483,MAX487, MAX488, or MAX489 transmitting under the same conditions. Figure 13’s high-frequency harmonics have much lower amplitudes, and the potential for EMI is significantly reduced.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________9_________________________________________________________________Test CircuitsFigure 4. Driver DC Test Load Figure 5. Receiver Timing Test LoadFigure 6. Driver/Receiver Timing Test Circuit Figure 7. Driver Timing Test LoadM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 10_______________________________________________________Switching Waveforms_________________Function Tables (MAX481/MAX483/MAX485/MAX487/MAX1487)Figure 8. Driver Propagation DelaysFigure 9. Driver Enable and Disable Times (except MAX488 and MAX490)Figure 10. Receiver Propagation DelaysFigure 11. Receiver Enable and Disable Times (except MAX488and MAX490)Table 1. TransmittingTable 2. ReceivingLow-Power Shutdown Mode (MAX481/MAX483/MAX487)A low-power shutdown mode is initiated by bringing both RE high and DE low. The devices will not shut down unless both the driver and receiver are disabled.In shutdown, the devices typically draw only 0.1µA of supply current.RE and DE may be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are guaranteed to enter shutdown.For the MAX481, MAX483, and MAX487, the t ZH and t ZL enable times assume the part was not in the low-power shutdown state (the MAX485/MAX488–MAX491and MAX1487 can not be shut down). The t ZH(SHDN)and t ZL(SHDN)enable times assume the parts were shut down (see Electrical Characteristics ).It takes the drivers and receivers longer to become enabled from the low-power shutdown state (t ZH(SHDN ), t ZL(SHDN)) than from the operating mode (t ZH , t ZL ). (The parts are in operating mode if the –R —E –,DE inputs equal a logical 0,1 or 1,1 or 0, 0.)Driver Output ProtectionExcessive output current and power dissipation caused by faults or by bus contention are prevented by two mechanisms. A foldback current limit on the output stage provides immediate protection against short cir-cuits over the whole common-mode voltage range (see Typical Operating Characteristics ). In addition, a ther-mal shutdown circuit forces the driver outputs into a high-impedance state if the die temperature rises excessively.Propagation DelayMany digital encoding schemes depend on the differ-ence between the driver and receiver propagation delay times. Typical propagation delays are shown in Figures 15–18 using Figure 14’s test circuit.The difference in receiver delay times, | t PLH - t PHL |, is typically under 13ns for the MAX481, MAX485,MAX490, MAX491, and MAX1487 and is typically less than 100ns for the MAX483 and MAX487–MAX489.The driver skew times are typically 5ns (10ns max) for the MAX481, MAX485, MAX490, MAX491, and MAX1487, and are typically 100ns (800ns max) for the MAX483 and MAX487–MAX489.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________1110dB/div0Hz5MHz500kHz/div10dB/div0Hz5MHz500kHz/divFigure 12. Driver Output Waveform and FFT Plot of MAX481/MAX485/MAX490/MAX491/MAX1487 Transmitting a 150kHz SignalFigure 13. Driver Output Waveform and FFT Plot of MAX483/MAX487–MAX489 Transmitting a 150kHz SignalM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 12______________________________________________________________________________________V CC = 5V T A = +25°CV CC = 5V T A = +25°CV CC = 5V T A = +25°CV CC = 5V T A = +25°CFigure 14. Receiver Propagation Delay Test CircuitFigure 15. MAX481/MAX485/MAX490/MAX491/MAX1487Receiver t PHLFigure 16. MAX481/MAX485/MAX490/MAX491/MAX1487Receiver t PLHPHL Figure 18. MAX483, MAX487–MAX489 Receiver t PLHLine Length vs. Data RateThe RS-485/RS-422 standard covers line lengths up to 4000 feet. For line lengths greater than 4000 feet, see Figure 23.Figures 19 and 20 show the system differential voltage for the parts driving 4000 feet of 26AWG twisted-pair wire at 110kHz into 120Ωloads.Typical ApplicationsThe MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 transceivers are designed for bidirectional data communications on multipoint bus transmission lines.Figures 21 and 22 show typical network applications circuits. These parts can also be used as line repeaters, with cable lengths longer than 4000 feet, as shown in Figure 23.To minimize reflections, the line should be terminated at both ends in its characteristic impedance, and stub lengths off the main line should be kept as short as possi-ble. The slew-rate-limited MAX483 and MAX487–MAX489are more tolerant of imperfect termination.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________13DIV Y -V ZRO5V 0V1V0V -1V5V 0V2µs/divFigure 19. MAX481/MAX485/MAX490/MAX491/MAX1487 System Differential Voltage at 110kHz Driving 4000ft of Cable Figure 20. MAX483, MAX487–MAX489 System Differential Voltage at 110kHz Driving 4000ft of CableFigure 21. MAX481/MAX483/MAX485/MAX487/MAX1487 Typical Half-Duplex RS-485 NetworkM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 14______________________________________________________________________________________Figure 22. MAX488–MAX491 Full-Duplex RS-485 NetworkFigure 23. Line Repeater for MAX488–MAX491Isolated RS-485For isolated RS-485 applications, see the MAX253 and MAX1480 data sheets.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________15_______________Ordering Information_________________Chip TopographiesMAX481/MAX483/MAX485/MAX487/MAX1487N.C. RO 0.054"(1.372mm)0.080"(2.032mm)DE DIGND B N.C.V CCARE * Contact factory for dice specifications.__Ordering Information (continued)M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 16______________________________________________________________________________________TRANSISTOR COUNT: 248SUBSTRATE CONNECTED TO GNDMAX488/MAX490B RO 0.054"(1.372mm)0.080"(2.032mm)N.C. DIGND Z A V CCYN.C._____________________________________________Chip Topographies (continued)MAX489/MAX491B RO 0.054"(1.372mm)0.080"(2.032mm)DE DIGND Z A V CCYREMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________17Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)S O I C N .E P SM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 18______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)MAX481/MAX483/MAX485/MAX487–MAX491Low-Power, Slew-Rate-Limited RS-485/RS-422 TransceiversMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________19©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487P D I P N .E PSPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。
MAX15301数据手册中文版
MAX15301是一个全功能,高效,数字化的点负载(POL)操纵器与先进的电源治理和遥测功能与PID 为基础的数字电源稳压器,MAX15301采纳Maxim拥有专利的Intune的™自动补偿,状态空间操纵算法。
Intune 的操纵律是有效的小信号和大信号响应,占占空比饱和度的阻碍。
这排除需要用户以确信和设置的阈值从线性转换到非线性模式。
这些能力在快速环路的瞬态响应,并减少输出电容器的数量相较,竞争的模拟和数字操纵器。
MAX15301包括多种功能,以优化效率。
内部开关BabyBuck的稳压器可产生栅极驱动器和内部偏置电源,低功耗的操纵器。
一种先进的,高效率的MOSFET的栅极驱动器,具有自适应非重叠按时,而持续调整的高侧和低侧的按时和驱动电压的全范围内的电压,电流和温度,以尽可能减少开关损耗。
MAX15301设计最终客户的设计环境的初衷。
上的PMBus™兼容的串行总线接口进行通信的监控器监控和故障治理。
全套的电源治理功能,无需复杂和昂贵的测序和监控IC。
大体的DC-DC转换操作,可设置通过引脚搭接,并非需要用户配置固件。
这使得电源子系统的快速进展前完成板级系统的工程。
Maxim提供支持的硬件和软件配置MAX15301 ,MAX15301可在32引线,5mm×5mm TQFN封装,工作在-40°C至+85°C的温度范围内。
特点:的自动补偿功能能够确保稳固,同时优化瞬态性能2.在快速瞬态响应减少输出电容的非线性补偿结果3.差分远端电压传感许诺±1%V OUT精度在整个温度范围内(-40°C至+85°C)接口用于配置,操纵和监测5.支持电压定位6.提高效率(自适应非重叠时序驱动器)至14V的宽输入电压范围8.高效片上BabyBuck稳压器的自偏置9.输出电压范围从到10.进入预偏置输出启动11.可配置的软启动和软停止时刻12.固定工作频率同步(300kHz至1MHz)13.灵活的排序和故障治理14.引脚手动跳线配置(输出电压,从机地址,开关频率,电流限制)15.能够快速原型图表典型工作电路引脚名字功能1SYNC外部开关频率同步输入端。
Ax5510芯片数据手册
BLOCK DIAGRAM
VCC 7uA SS FB COMP
Error Amplifier Summing Comparator
Soft Start
1.238V Reference
Thermal Shutdown
Enable/ Disable
EN
LX Control and Driver Logic
COMP 1 FB 2 EN 3 SGND 4 PGND 5 Exposed Pad
(SGND)
10 9
SS
FREQ 8 VCC 7 LX
6
Name Description VCC Power Input pin EN Enable Pin COMP Compensation Pin FB Feedback Pin Soft start Pin. Connect a capacitor to SS GND GND Ground Pin SGND Signal Ground PGND Power Ground LX Switch Output Pin Frequency select pin. The power switch operates at 680kHz if FREQ is FREQ connected to GND and at 1.2MHz if FREQ is connected to VCC
Units V V mV V μA μA V nA % % KHz V uA μA A mΩ V V mV μA % µA °C
AX5510A
PIN ASSIGNMENT The packages of AX5510A are MSOP-10L-EP, TDFN-10L, SOP-8L-EP and MSOP-8L-EP; the pin assignment is given by:
MAX5490VC10000-T中文资料
元器件交易网
100kΩ Precision-Matched Resistor-Divider in SOT23 MAX5490
ABSOLUTE MAXIMUM RATINGS
Voltage Between P1 and P2.................................................100V Maximum Current into Any Pin ......................................±1.00mA Continuous Power Dissipation (TA = +70°C) 3-Pin SOT23 (derate 7.1mW/°C above +70°C).........571.4mW 3-Pin SOT23 (θJ-A) .....................................................141°C/W Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C
元器件交易网
100kΩ Precision-Matched Resistor-Divider in SOT23
tlc5510
PACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TLC5510AINS ACTIVE SO NS2434Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC5510AINSG4ACTIVE SO NS2434Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC5510AINSLE OBSOLETE SO NS24TBD Call TI Call TITLC5510AINSR ACTIVE SO NS242000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC5510AINSRG4ACTIVE SO NS242000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLC5510INSLE OBSOLETE SO NS24TBD Call TI Call TITLC5510INSR ACTIVE SO NS242000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC5510INSRG4ACTIVE SO NS242000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLC5510IPW ACTIVE TSSOP PW2460Green (RoHS& no Sb/Br)CU NIPDAU Level-2-260C-1 YEARTLC5510IPWG4ACTIVE TSSOP PW2460Green (RoHS& no Sb/Br)CU NIPDAU Level-2-260C-1 YEARTLC5510IPWR ACTIVE TSSOP PW242000Green (RoHS& no Sb/Br)CU NIPDAU Level-2-260C-1 YEARTLC5510IPWRG4ACTIVE TSSOP PW242000Green (RoHS& no Sb/Br)CU NIPDAU Level-2-260C-1 YEAR(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Addendum-Page 1Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TLC5510AINSR SONS 242000330.024.48.215.4 2.512.024.0Q1TLC5510INSR SONS 242000330.024.48.215.4 2.512.024.0Q1TLC5510IPWR TSSOP PW 242000330.016.4 6.958.3 1.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) TLC5510AINSR SO NS242000346.0346.041.0 TLC5510INSR SO NS242000346.0346.041.0TLC5510IPWR TSSOP PW242000346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and /automotiveAutomotiveMicrocontrollers Video and Imaging /videoRFID Wireless /wireless-appsRF/IF and ZigBee®Solutions /lprfTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。
PanelView 5510终端技术数据指令手册说明书
Technical DataOriginal InstructionsPanelView 5510 Terminals SpecificationsCatalog Numbers 2715P-B7CD, 2715P-B7CD-B, 2715P-T7CD, 2715P-T7CD-B, 2715P-T7WD, 2715P-T7WD-B, 2715P-T9WD, 2715P-T9WD-B,2715P-B10CD, 2715P-B10CD-B, 2715P-T10CD, 2715P-T10CD-B, 2715P-T12WD, 2715P-T12WD-B, 2715P-B15CD, 2715P-B15CD-B, 2715P-T15CD, 2715P-T15CD-B, 2715P-T19CD, 2715P-T19CD-BThe PanelView™ 5510 terminals are operator interface devices that monitor and control devices attached to ControlLogix® L7 or L8 controllers, and CompactLogix™ L1, L2, or L3 controllers over an EtherNet/IP™ network. Animated graphic and text displays provide a view to operators into the operating state of a machine or process. Operators interact with the control system by using the touch screen or keypad of the terminal.The PanelView 5510 terminals include these features and capabilities:•Tightly integrated control and design environment allows information to be shared between the PanelView 5510 terminal and the Logix platforms.•The Studio 5000® environment provides one point of access for the Studio 5000 View Designer® and Studio 5000 Logix Designer® applications.(1)•Connection up to four ControlLogix L7 or L8 controllers, or CompactLogix L1, L2, or L3 controllers.(2)•Supports a maximum of 100 user-defined screens.•Supports a maximum of 4,000 Logix-based alarms.(1)•Ethernet communication that supports Device Level Ring (DLR), linear, or star network topologies.•High-speed human machine interface (HMI) button control and easily configured navigation menu.(1)PanelView 5510 firmware can support up to 4,000 Logix-based alarms if you use Studio 5000 View Designer application version 5 and Studio 5000 Logix Designer application version 32 or higher.Earlier versions of the Studio 5000 View Designer or Studio 5000 Logix Designer applications can support up to 1,000 Logix-based alarms. For more information about the Logic-based alarms, see footnote 2.(2) A combination of up to four of the following Logix controller models: ControlLogix L7 or L8 controller, or CompactLogix L1, L2, or L3 controller with revision 31 firmware or later.NOTE: If the PanelView 5510 terminal supports up to four Logix controllers, then each controller can use a mix (instruction-based and tag-based) of alarms up to 1,000 alarms per controller. If a single Logix controller is supported, then up to 4,000 alarms can be used but only 1,000 of them can be instruction-based.Summary of ChangesThis publication contains new and updated information as indicated in this table.Environmental SpecificationsThis table provides environmental specifications for the PanelView 5510 terminals.(1)The 19-inch terminals (2715P-T19CD and 2715P-T19CD-B) are rated to 0.006 pk-pk, 10…57 Hz, 1 g peak at 57…500 Hz.(2)The 19-inch terminals (2715P-T19CD and 2715P-T19CD-B) are rated to 15 g at 11 ms.CertificationsThis table provides certification information for the PanelView 5510 terminals.(1)When marked. See Product Certifications at rok.auto/certifications for declarations of conformity, certificates, and other certification details.PanelView 5510 Terminals Specifications Technical SpecificationsThis section provides technical specifications for the PanelView 5510 terminals.Technical Specifications, PanelView 5510 Terminals – 6.5-in. 7-in., 9-in., and 10.4-in. ModelsRockwell Automation Publication 2715P-TD001B-EN-P - March 20193PanelView 5510 Terminals SpecificationsTechnical Specifications, PanelView 5510 Terminals – 6.5-in. 7-in., 9-in., and 10.4-in. Models (Continued)(1)Add -B to the end of a catalog number to order a terminal without the Allen-Bradley logo and product identification, for example, 2715-T7CD-B.(2)DC-powered terminals support safety extra low voltage (SELV) and protective extra low voltage (PELV) 24V DC power supplies such as cat. nos. 1606-XLP95E, 1606-XLP100E, 2711P-RSACDIN.(3)Where PELV is defined in IEC 61131-2.4Rockwell Automation Publication 2715P-TD001B-EN-P - March 2019PanelView 5510 Terminals Specifications Technical Specifications, PanelView 5510 Terminals – 12.1-in., 15-in., and 19-in. models(1)Add -B to the end of a catalog number to order a terminal without the Allen-Bradley logo and product identification, for example, 2715-T7CD-B.(2)DC-powered terminals support safety extra low voltage (SELV) and protective extra-low voltage (PELV) 24V DC power supplies such as cat. nos. 1606-XLP95E, 1606-XLP100E, 2711P-RSACDIN.Rockwell Automation Publication 2715P-TD001B-EN-P - March 201956Rockwell Automation Publication 2715P-TD001B-EN-P - March 2019PanelView 5510 Terminals SpecificationsTerminal DimensionsThis section provides dimensions for the PanelView 5510 terminals. The 10.4-inch keypad and touch terminal is shown for illustrative purposes. All other terminal sizes look similar.PanelView 5510 Terminal Dimensions - (10.4-in. wide terminal shown)PanelView 5510 Terminal and Cutout Dimensions(1)When mounted in a panel, the front of the bezel extends less than 6.36 mm (0.25 in.) from the front of the panel.PanelView 5510 Terminals Specifications Studio 5000 EnvironmentUse the Studio 5000 environment to create HMI applications for the PanelView 5510 terminal.This environment includes these major components:•Studio 5000 View Designer – the application where you create and design projects for a specific PanelView 5500 terminal and deploy that project to the terminal.A project that is created for one terminal size can be converted for other terminals across the entire 5500 platform,regardless of size.•Studio 5000 Logix Designer – the application that is used to develop control logic for a CompactLogix or ControlLogix controller and deploy that logic to the terminal.In the Studio 5000 environment, you can create an application for any PanelView 5510 terminal and reuse that same application across the entire platform.AccessoriesThis section lists accessories for the PanelView 5510 terminals.Protective Overlays(1)Three overlays are shipped with each catalog number.Rockwell Automation Publication 2715P-TD001B-EN-P - March 201978Rockwell Automation Publication 2715P-TD001B-EN-P - March 2019PanelView 5510 Terminals SpecificationsThe SD™ and SDHC™ accessory cards in the above table have been designed to meet industrial robustness andenvironmental requirements. Rockwell Automation recommends that you use these accessory cards with the terminal to help reduce the chances of corruption. Studio 5000 View Designer software requires the following for SD cards that are inserted into the HMI device:• 4 GB of free space• A supported SDHC card type, preferably one listed in the Secure Digital (SD) Cards table •An environmental rating for the PanelView 5000 environment • A supported format of either FAT32 or ext3Power Supplies and Power Terminal BlocksUSB Programming CableMounting Hardware(1)Catalog number 2711P-RMCP mounting levers are used with the PanelView 5510 terminals. Do not use gray mounting levers; they arenot compatible with PanelView 5510 terminals.Battery ReplacementSecure Digital (SD) Cards (1)(1)To help reduce the chance of corruption when you use SD Cards or USB driveswith the terminal, Rockwell Automation recommends that you use only the above SD card catalog numbers.PanelView 5510 Terminals Specifications Additional ResourcesThese documents contain more information about related products from Rockwell Automation.Y ou can view or download publications at https:///global/literature-library/ overview.page. T o order paper copies of technical documentation, contact your local Allen-Bradley distributor or Rockwell Automation sales representative.Rockwell Automation Publication 2715P-TD001B-EN-P - March 20199Rockwell Automation maintains current product environmental information on its website at /rockwellautomation/about-us/sustainability-ethics/product-environmental-compliance.page. Allen-Bradley, CompactLogix, ControlLogix, LISTEN. THINK. SOLVE., PanelView, Rockwell Automation, Rockwell Software, Studio 5000, Studio 5000 View Designer, and Studio 5000 Logix Designer are trademarks of RockwellAutomation, Inc.EtherNet/IP is a trademark of ODVA.SD and SDHC are trademarks of SD-3C LLC.Rockwell Otomasyon Ticaret A.Ş., Kar Plaza İş Merkezi E Blok Kat:6 34752 İçerenköy, İstanbul, T el: +90 (216) 5698400Publication 2715P-TD001B-EN-P - March 2019Supersedes Publication 2715P-TD001A-EN-P - June 2018Copyright © 2019 Rockwell Automation, Inc. All rights reserved. Printed in the U.S.A.。
泰格瑞德产品手册
在未来的发展中,我们将以射频识别、智能系统、物联网为技术基底,以研发、市场营销及 技术支持作为运营核心,以满足客户需求为宗旨,不断地突破现有科技,为客户提供更多创新、 高端和时尚的终端产品,同时为客户提供完善的系统解决方案,也可为客户量身打造各种独特的 应用系统,为客户创造新的经济增长点。
目 录 Contents
读写距离:300mm(与标签以及周边环境相关) 典型应用:图书馆借还书管理系统 生产线产品检测登记系统
资产检索记录系统 文物管理系统 其它有较大的信息读取的场所
FR300/FR310 HF远距离带SWR检测单通道/四通道读写器
产品特性:可进行天线SWR值调试,方便客户制作天线和在现场调试天线,方便设备 在不同环境中应用 一通道和四通道可选,降低应用成本
尺寸规格:280*280*73mm
工作频率:840~960MHz(可选)
射频功率:10~30dBm(可选) 通信协议:ISO-18000-6C(EPC G2)
电源规格:5V DC/2A
典型应用:车辆门禁管理、不停车自动收费(流监控、生产自动化管理等
FR1600多通道超高频读写器
南瑞励磁培训教材10年版 第二篇NES5100励磁系统介绍
第一章 NES5100调节器的系统配置 (3)1.1电气系统配置 (3)1.1.1系统框图 (3)1.1.2 输入输出接口 (4)1.1.3 硬件配置 (6)第二章 NES5100调节器的软件系统原理 (13)2.1概述 (13)2.2励磁应用程序主流程 (13)2.3调节控制程序 (14)2.3.1模拟量测量和A/D变换 (15)2.3.2给定调节 (15)2.3.3调差 (15)2.3.4 软起励 (16)2.3.5 自动跟踪机 (16)2.3.6脉冲输出 (16)2.4.限制及保护程序 (17)2.4.1低励磁限制 (18)2.4.2 过励磁限制 (19)2.4.3 PT断线保护 (22)2.4.4 电力系统稳定器(PSS) (22)2.4.5 逻辑判断 (23)2.4.6 参考值设定 (23)2.4.7 双机通讯 (23)2.4.8 自检和自诊断 (24)2.4.9 人机对话 (24)2.4.10 对外通讯 (24)第三章NES5100调节器的界面操作 (25)3.1 NES-HMI励磁智能监控界面介绍 (25)3.1.1界面启动前的准备 (25)3.1.2界面使用 (25)3.2 参数修改 (45)3.2.1主要参数含义 (45)3.2.1.1系统设置 (46)3.2.1.2系统参数 (46)3.2.1.3采样系数 (48)3.2.1.4软压板 (48)3.2.1.5并联PID调节参数 (49)3.2.1.6串联PID调节参数 (50)3.2.1.7计算上下限 (51)3.2.1.8欠励限制器 (52)3.2.1.9过励限制器 (52)3.2.1.10 V/F限制器 (53)3.2.1.11强励反时限限制器 (54)3.2.1.12 PSS参数 (54)3.2.1.13电源检测参数 (56)3.2.1.14 U485设置 (57)3.2.1.15 DA测试组 (57)3.2.1.16 保护功能 (58)3.2.1.17附加控制 (60)3.2.1.18大阶跃设置 (60)3.2.1.19给定限制 (61)3.2.1.20开机保护 (63)3.2.1.21手自跟踪 (64)3.2.1.22 Kp调节参数 (64)3.2.1.23试验设置 (64)3.2.1.24励磁稳定器 (65)3.2.2修改参数 (65)3.2.2.1生成参数文件修改参数 (66)3.2.2.2参数设置修改参数 (68)3.2.2.1过、欠励参数修改 (70)附录一:人机界面安装 (73)1.1安装环境 (73)1.2界面安装 (73)1.2.1准备有关安装软件 (73)1.2.2确定安装环境 (73)1.2.3安装 (73)1.3界面软件设置 (76)1.3.1启动人机界面 (78)1.4下载程序和参数 (79)1.4.1下载程序 (79)1.4.1下载参数 (80)1.5下载组态逻辑文件 (81)第一章 NES5100调节器的系统配置NES5100发电机励磁调节器继承了我公司前两代励磁调节器SJ800和SAVR2000的核心技术,借鉴了前两代励磁调节器几十年现场运行经验,参考了IEEE Std 421.5TM-2005励磁系统数学模型,还吸收了目前数字控制领域内最先进的研究成果和工艺。
ADAM-5510系列产品快速入门手册
第一章 ADAM-5510 SERIES 的概述ADAM-5510 SERIES是基于 PC 的可独立完成数据采集与控制的可编程控制器。
采用坚固的工业级塑封外壳可确保系统在恶劣的工业环境中可靠运行。
ADAM-5510 SERIES具备通用编程功能,可用于信号的程控放大、模拟I/O、数字I/O及通讯参数的设定。
ADAM-5510 SERIES提供输入/输出(3000VDC)、COM2口通信(2500VDC)、电源(3000VDC)隔离功能,可阻绝地线电流,减少电气躁声对系统的影响,保护系统不受高压和放电所引起的浪涌电流冲击。
ADAM-5510 series也包括实时时钟和看门狗定时器功能。
实时钟可实时记录事件发生的时刻,而当系统死机时看门狗定时器可重置处理器,这不仅减少了系统维护工作,而且使ADAM-5510 SERIES可应用于系统稳定性要求较高的场合。
ADAM-5510 series可编程控制器包括:ADAM-5510M:4槽可编程控制器ADAM-5510E:8槽可编程控制器ADAM-5510/TCP:带以太网口的可编程控制器ADAM-5510E/TCP: 8槽带以太网口的可编程控制器注意:ADAM-5510不属于ADAM-5510 series可编程控制器。
因为上述四种可编程控制器有相同的硬件结构和软件函数库,而ADAM-5510有独立的硬件结构和函数库。
关于ADAM-5510请参考其说明书或快速入门手册。
ADAM-5510 SERIES设置了四个串行通信口COM1(RS232/485)、COM2(RS485)、COM3(Program口/RS232)和COM4口(RS232/485),可适用于多种应用场合。
第二章 ADAM-5510 SERIES Utility工具软件的使用1 ADAM-5510 SERIES Utility的安装把ADAM-5510 SERIES 随机附带光盘放入计算机的光驱中,选择ADAM5510series Utility 安装选项,出现如下安装界面:根据后续的软件安装提示,完成ADAM5510 series Utility 的安装。
5510说明书
4.7、安装附着装置……………………………………………………………40
4.8、塔机接地设施……………………………………………………………44
五、电器控制与操纵系统……………………………………………………44
5.1、塔机的操作………………………………………………………………45
6.3、各种安全装置的调整……………………………………………………51
七、塔机的使用与维护保养…………………………………………………56
7.1、塔机的安全使用须知……………………………………………………56
7.2、塔机的维护保养…………………………………………………………57
7.3、塔机的工作条件和工作环境……………………………………………59
30
28.51
26.30
28.51
26.3
24.37
21.89
19.8
起重幅度(m)
40
42
45
起重量
(KN)
a=4
18.58
17.47
16
a=2
18.58
17.47
16
表1.5
注意:为了保证塔机安全,塔吊司机应严格按照载荷特性表中的数据起吊重物。
二.塔机机构的构造及特点(其主要参数阅表1.1、表1.2)
①工作中严禁长时间使用低速,连续使用低速不得超过1.5分钟,否则将烧坏电机。
②额定起重量严禁使用高速,高速只能用于空钩升降或额定重量的1/2,否则也将会烧坏电机。
2.2变幅机构(参图2.3)
2~13.62
15
18
20
22
25
MAX14595ETA+T MAX14595低功耗双通道逻辑级转换器说明书
MAX14595ETA+TMAX14595 Low-Power Dual-Channel Logic-Level TranslatorGeneral DescriptionThe MAX14595 is a dual-channel, bidirectional logic-level translator designed specifically for low power consumption making it suitable for portable and battery-powered equipment. Externally applied voltages, V CC and V L, set the logic levels on either side of the device. A logic signal present on the V L side of the device appears as the same logic signal on the V CC side of the device, and vice-versa.The device is optimized for the I2C bus as well as the management data input/output (MDIO) bus where often high-speed, open-drain operation is required. When TS is high, the device allows the pullup to be connected to the I/O port that has the power. This allows continuous I2C operation on the powered side without any disruption while the level translation function is off.The part is specified over the extended -40N C to +85N C temperature range, and is available in 8-bump WLP and 8-pin TDFN packages.ApplicationsPortable and Battery-Powered ElectronicsDevices with I2C CommunicationDevices with MDIO CommunicationGeneral Logic-Level TranslationBenefits and Features S Meets Industry Standards✧ I2C Requirements for Standard, Fast, and High* Speeds✧ MDIO Open Drain Above 4MHz*S Allows Greater Design Flexibility✧ Down to 0.9V Operation on V L Side✧ Supports Above 8MHz Push-Pull OperationS Ultra-Low Power Consumption✧ 7µA V CC Supply Current✧ 3µA V L Supply CurrentS Provides High Level of Integration✧ Pullup Resistor Enabled with One Side PowerSupply when TS Is High✧ 12k I (max) Internal Pullup✧ Low Transmission Gate R ON: 17I (max)S Saves Space✧ 8-Bump, 0.4mm Pitch, 0.8mm x 1.6mm WLPPackage✧ 8-Pin, 2mm x 2mm TDFN PackageTypical Operating Circuit Ordering Information appears at end of data sheet.For related parts and recommended products to use with this part, refer to /MAX14595.related.*Requires external pullups.EVALUATION KIT AVAILABLEMAX14595Low-Power Dual-Channel Logic-Level TranslatorVoltages referenced to GND.V CC , V L , TS .............................................................-0.5V to +6V IOVCC1, IOVCC2 ...................................-0.5V to +(V CC + 0.5V)IOVL1, IOVL2 ............................................-0.5V to +(V L + 0.5V)Short-Circuit Duration IOVCC1, IOVCC2,IOVL1, IOVL2 to GND ...........................................Continuous V CC , IOVCC_ Maximum Continuous Current at +110N C ....100mA V L IOVL_ Maximum Continuous Current at +110N C ..........40mATS Maximum Continuous Current at +110N C .....................70mA Continuous Power Dissipation (T A = +70N C)TDFN (derate 6.2mW/N C above +70N C) ......................496mW WLP (derate 11.8mW/N C above +70N C)......................944mW Operating Temperature Range ..........................-40N C to +85N C Storage Temperature Range ............................-65N C to +150N C Lead Temperature (TDFN only, soldering, 10s) .............+300N C Soldering Temperature (reflow) ......................................+260N CTDFNJunction-to-Ambient Thermal Resistance (B JA ) ........162N C/W Junction-to-Case Thermal Resistance (B JC ) ...............20N C/WWLPJunction-to-Ambient Thermal Resistance (B JA ) ..........85N C/WABSOLUTE MAXIMUM RATINGSNote 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layerboard. For detailed information on package thermal considerations, refer to /thermal-tutorial .Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ELECTRICAL CHARACTERISTICS(V CC = +1.65V to +5.5V, V L = +0.9V to min(V CC + 0.3V, +3.6V), T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = +3V, V L = +1.2V, and T A = +25N C.) (Notes 2, 3)PACKAGE THERMAL CHARACTERISTICS (Note 1)PARAMETERSYMBOLCONDITIONS MIN TYP MAX UNITSPOWER SUPPLY Power Supply Range V L 0.9 5.5V V CC 1.655.5V CC Supply Current I CC IOVCC_ = V CC , IOVL_ = V L , TS = V CC 715F A V L Supply CurrentI L IOVCC_ = V CC , IOVL_ = V L , TS = V CC 36F A V CC Shutdown Supply Current I CC-SHDN TS = GND0.41F A TS = V CC , V L = GND, IOVCC_ = unconnected 0.41V L Shutdown Supply Current I L-SHDN TS = GND0.11F A TS = V L , V CC = GND, IOVL_ = unconnected 0.11IOVCC_, IOVL_ Three-State Leakage CurrentI LEAK T A = +25N C, TS = GND 0.11F A TS Input Leakage Current I LEAK_TS T A = +25N C 1F A V CC Shutdown Threshold V TH_VCC TS = V L , V CC falling0.8 1.35V V L Shutdown Threshold V TH_VLTS = V CC , V L falling, V L = 0.9V0.250.60.86V V L Above V CC Shutdown ThresholdV TH_VL-VCC V L rising above V CC , V CC = +1.65V 0.40.73 1.1V IOVL_ Pullup Resistor R VL_PU Inferred from V OHL measurements 37.612k I IOVCC_ Pullup Resistor R VCC_PUInferred from V OHC measurements37.612k I IOVL_ to IOVCC_ DC Resistance R IOVL-IOVCC Inferred from V OLx measurements617IMAX14595 Low-Power Dual-Channel Logic-Level Translator ELECTRICAL CHARACTERISTICS (continued)(V CC= +1.65V to +5.5V, V L= +0.9V to min(V CC + 0.3V, +3.6V), T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = +3V, V L= +1.2V, and T A = +25N C.) (Notes 2, 3)PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LOGIC LEVELSIOVL_ Input-Voltage High V IHL IOVL_ rising, V L = +0.9V, V CC = +1.65V(Note 4)V L - 0.2VIOVL_ Input-Voltage Low V ILL IOVL_ falling, V L = +0.9V, V CC = +1.65V(Note 4)0.15VIOVCC_ Input-Voltage High V IHC IOVCC_ rising, V L = +0.9V, V CC = +1.65V(Note 4)V CC - 0.4VIOVCC_ Input-Voltage Low V ILC IOVCC_ falling, V L = +0.9V, V CC = +1.65V(Note 4)0.2VTS Input-Voltage High V IH TS rising, V L = +0.9V or +3.6V, V CC > V L V L - 0.15V TS Input-Voltage Low V IL TS falling, V L = +0.9V or +3.6V, V CC > V L0.2VIOVL_ Output-Voltage High V OHL IOVL_ source current 20F A, V IOVCC_ = V L toV CC (V CC R V L)0.7 x V L VIOVL_ Output-Voltage Low V OLL IOVL_ sink current 5mA, V IOVCC_P 0.05V0.2V IOVCC_ Output-Voltage High V OHC IOVCC_ source current 20F A, V IOVL_ = V L0.7 x V CC V IOVCC_ Output-Voltage Low V OLC IOVCC_ sink current 5mA, V IOVL_P 0.05V0.25V RISE/FALL TIME ACCELERATOR STAGEAccelerator Pulse Duration V L = +0.9V, V CC = +1.65V92248nsIOVL_ Output Accelerator Source Impedance V L = +0.9V, IOVL_ = GND, V CC = +1.65V26I V L = +3.3V, IOVL_ = GND, V CC = +5V 6.8IOVCC_ Output Accelerator Source Impedance V CC = +1.65V, IOVCC_ = GND26I V CC = +5V, IOVCC_ = GND 6.5THERMAL PROTECTIONThermal Shutdown T SHDN+150N C Thermal Hysteresis T HYST10N CMAX14595 Low-Power Dual-Channel Logic-Level Translator TIMING CHARACTERISTICS(V CC= +1.65V to +5.5V, V L= +0.9V to +3.6V, V CC R V L, TS = V L, C VCC= 1F F, C VL = 0.1F F, C IOVL_P 100pF, C IOVCC_P 100pF, T A = -40N C to +85N C, unless otherwise noted. Typical values are at V CC = +3V, V L= +1.2V and T A = +25N C. All timing is 10% to 90%Note 2:All devices are 100% production tested at T A = +25N C. Limits over the operating temperature range are guaranteed by design and not production tested.Note 3: V L must be less than or equal to V CC during normal operation. However, V L can be greater than V CC during startup and shutdown conditions.Note 4: V IHL, V ILL, V IHC, and V ILC are intended to define the range where the accelerator triggers.Note 5:Guaranteed by design.Note 6:External pullup resistors are required.MAX14595 Low-Power Dual-Channel Logic-Level TranslatorFigure 1. Push-Pull Driving IOVL_ Figure 2. Open-Drain Driving IOVL_Figure 3. Push-Pull Driving IOVCC_ Figure 4. Open-Drain Driving IOVCC_MAX14595Low-Power Dual-Channel Logic-Level TranslatorTypical Operating Characteristics(V CC = +3V, V L = +1.5V, R L = 1M I , C L = 15pF, push-pull driving data rate = 8Mbps, T A = +25N C, unless otherwise noted.)V L DYNAMIC SUPPLY CURRENT vs. V CC SUPPLY VOLTAGE (OPEN-DRAIN DRIVING ONE IOVL_)M A X 14595 t o c 01V CC (V)V L S U P P L Y C U R R E N T (µA )4.954.403.303.852.752.202040608010012014016018020001.655.50V L DYNAMIC SUPPLY CURRENT vs. V CC SUPPLY VOLTAGE (PUSH-PULL DRIVING ONE IOVCC_)V CC (V)V L S U P P L Y C U R R E N T (µA )4.954.403.30 3.852.752.202040608010012014016018020001.65 5.50V CC DYNAMIC SUPPLY CURRENT vs. V L SUPPLY VOLTAGE (PUSH-PULL DRIVING ONE IOVL_)M A X 14595 t o c 03V L (V)V C C S U P P L Y C U R R E N T (µA )3.33.01.2 1.5 1.8 2.42.1 2.71002003004005006007008000.9 3.6V CC DYNAMIC SUPPLY CURRENT vs. V L SUPPLY VOLTAGE (OPEN-DRAIN DRIVING ONE IOVCC_)M A X 14595 t o c 04V L (V)V C C S U P P L Y C U R R E N T (µA )3.33.01.2 1.5 1.8 2.42.1 2.710020030040050060070080000.9 3.6V L DYNAMIC SUPPLY CURRENT vs. TEMPERATURE(OPEN-DRAIN DRIVING ONE IOVL_)M A X 14595 t o c 05TEMPERATURE (°C)V L S U P P L Y C U R R E N T (µA )603510-15204060801001201401601802000-4085V L DYNAMIC SUPPLY CURRENT vs. TEMPERATURE(PUSH-PULL DRIVING ONE IOVCC_)M A X 14595 t o c 06TEMPERATURE (°C)V L S U P P L Y C U R R E N T (µA )603510-15204060801001201401601802000-4085V L DYNAMIC SUPPLY CURRENT vs. CAPACITIVELOAD (OPEN-DRAIN DRIVING ONE IOVL_)M A X 14595 t o c 07CAPACITIVE LOAD (pF)V L S U P P L Y C U R R E N T (µA )806040202040608010012014016018020000100V CC DYNAMIC SUPPLY CURRENT vs. CAPACITIVELOAD (PUSH-PULL DRIVING ONE IOVL_)CAPACITIVE LOAD (pF)V C C S U P P L Y C U R R E N T (m A )806020400.20.40.60.81.21.01.41.60100RISE/FALL TIME vs. CAPACITIVE LOAD (PUSH-PULL DRIVING ONE IOVL_)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )8060402051015202530350100MAX14595Low-Power Dual-Channel Logic-Level TranslatorTypical Operating Characteristics (continued)(V CC = +3V, V L = +1.5V, R L = 1M I , C L = 15pF, push-pull driving data rate = 8Mbps, T A = +25N C, unless otherwise noted.)PROPAGATION DELAY vs. CAPACITIVE LOAD(PUSH-PULL DRIVING ONE IOVL_)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )8060204024681210141600100RISE/FALL TIME vs. CAPACITIVE LOAD (PUSH-PULL DRIVING ONE IOVCC_)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )806020402468121014160100PROPAGATION DELAY vs. CAPACITIVE LOAD(PUSH-PULL DRIVING ONE IOVCC_)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )80602040123465780100R IOVL-IOVCC vs. V LV L (V)R I O V L -I O V C C (Ω)54321123456789006RAIL-TO-RAIL DRIVING (PUSH-PULL DRIVING ONE IOVL_)(V L = +1.5V, V CC = +3.3V, C L = 15pF, R L = 1M Ω, R S = 50ΩMAX14595 toc1440ns/divIOVL_1V/divIOVCC_1V/divRAIL-TO-RAIL DRIVING (OPEN-DRAIN DRIVING ONE IOVL_)(V L = +1.5V, V CC = +3.3V, C L = 100pF, R L = 50Ω,R S = 50Ω, PULLUP ON IOVL_/IOVCC_ = 1k Ω)MAX14595 toc1540ns/div IOVL_1V/div IOVCC_1V/divEXITING SHUTDOWN MODE(V L = 1.2V, V CC = 3.0V, IOVCC_ = 0V,C L = 100pF, R PU_VL = 50ΩMAX14595 toc1640µs/divTS500mV/divIOVL_500mV/divMAX14595Low-Power Dual-Channel Logic-Level TranslatorPin DescriptionPin ConfigurationsBUMP/PIN NAME FUNCTIONWLP TDFN A11V L Logic Supply Voltage, +0.9V to min(V CC + 0.3V, +3.6V). Bypass V L to GND with a 0.1F F ceramic capacitor as close as possible to the device.A22IOVL2Input/Output 2. Reference to V L .A33IOVL1Input/Output 1. Reference to V L .A44TSActive Low Three-State Input. Drive TS low to place the device in shutdown mode withhigh-impedance output and internal pullup resistors disconnected. Drive TS high for normal operation.B18V CC Power-Supply Voltage, +1.65V to +5.5V. Bypass V CC to GND with a 1F F ceramic capacitor as close as possible to the device.B27IOVCC2Input/Output 2. Reference to V CC .B36IOVCC1Input/Output 1. Reference to V CC .B45GNDGround13486527V CC V CCIOVCC1IOVCC1GND GNDMAX14595IOVCC2IOVCC2V LV LIOVL1IOVL1IOVL2IOVL2TDFNBUMPS ON BOTTOMTSTS+A1234B+TOP VIEW MAX14595WLPMAX14595 Low-Power Dual-Channel Logic-Level TranslatorBlock DiagramDetailed Description The MAX14595 is a dual-channel, bidirectional level trans-lator. The device translates low voltage down to +0.9V on the V L side to high voltage on the V CC side and vice-ver-sa. The device is optimized for open-drain and high-speed operation, such as I2C bus and MDIO bus.The device has low on-resistance (17I max), which is important for high-speed, open-drain operation. The device also features internal pullup resistors that are active when the corresponding power is on and TS is high.Level Translation For proper operation, ensure that +1.65V P V CC P +5.5V, and +0.9V P V L P V CC. When power is supplied to V L while V CC is less than V L, the device automatically disables logic-level translation function. Also, the device enters shutdown mode when TS = GND.High-Speed Operation The device meets the requirements of high-speed I2C and MDIO open-drain operation. The maximum data rate is at least 4MH z for open-drain operation with the total bus capacitance equal to or less than 100pF.Three-State Input TS The device features a three-state input that can put the device into high-impedance mode. When TS is low, IOVCC_ and IOVL_ are all high impedance and the inter-nal pullup resistors are disconnected. When TS is high, the internal pullup resistors are connected when the corresponding power is in regulation, and the resistors are disconnected at the side that has no power on. In many portable applications, one supply is turned off but the other side is still operating and requires the pullup resistors to be present. This feature eliminates the need for external pullup resistors. The level translation function is off until both power supplies are in range.Thermal-Shutdown Protection The device features thermal-shutdown protection to protect the part from overheating. The device enters thermal shutdown when the junction temperature exceeds +150N C (typ), and the device is back to normal operation again after the temperature drops by approximately 10N C (typ). When the device is in thermal shutdown, the level translator is disabled.Low-Power Dual-Channel Logic-Level Translator10Maxim Integrated Ordering InformationNote: All devices are specified over -40°C to +85°C operating temperature range.+Denotes a lead(Pb)-free/RoHS-compliant package.T = Tape and reel.Chip InformationPROCESS: BiCMOSPackage InformationFor the latest package outline information and land patterns (foot-prints), go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.PARTTOP MARKPIN-PACKAGE MAX14595ETA+T BNT 8 TDFN MAX14595EWA+TAAE8 WLPPACKAGE TYPE PACKAGE CODE OUTLINE ND PATTERN NO.8 TDFNT822CN+121-048790-03498 WLPW80A1+121-0555Refer to Application Note 1891Low-Power Dual-Channel Logic-Level TranslatorMaxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-100011© 2011 Maxim Integrated Products, Inc.Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.Revision HistoryREVISION NUMBERREVISION DATE DESCRIPTIONPAGES CHANGED12/11Initial release—MAX14595ETA+T。
MEMORY存储芯片MAX8815AETB+T中文规格书
Figure 1. Maximum Transient Duration without Causing a Reset Pulse vs. Comparator Overdrive
VCC MAX811
RESET R1
GND
Figure 2. RESET Valid to VCC = Ground Circuit
Figure 1 shows typical transient durations vs. reset comparator overdrive, for which the MAX811/MAX812 do not generate a reset pulse. This graph was generated using a negative-going pulse applied to VCC, starting above the actual reset threshold and ending below it by the magnitude indicated (reset comparator overdrive). The graph indicates the typical maximum pulse width a negative-going VCC transient may have without causing a reset pulse to be issued. As the magnitude of the transient increases (goes farther below the reset threshold), the maximum allowable pulse width decreases. Typically, a VCC transient that goes 125mV below the reset threshold and lasts 40μs or less (MAX81_L/M) or 20μs or less (MAX81_T/S/R) will not cause a reset pulse to be issued. A 0.1μF capacitor mounted as close as possible to VCC provides additional transient immunity.
Tmax T5 Ekip E-LSIG说明书
The productWith this new trip unit, covering the range from 320A upto 630A, ABB completes its offer of ‘integrated solution for energy measurement’ for applications with values of rating currents starting from 16A up to 1600A.Main characteristics•Available for T5 in three-pole and four-pole versions.•Protections:– against overloads (L): 0.18...1xIn adjustable protection threshold, with adjustable time trip curve;– against short-circuits with delay (S): 0,6...10xIn adjustable protection threshold, with adjustable time trip curve;– against instantaneous short-circuits (I): 1,5...12xIn adjustable protection threshold, with instantaneous tripcurve;– of the neutral in four-pole circuit-breakers.• Measurements:– available from 0.1xIn in Vaux mode;– Currents: three phases (L1, L2, L3), neutral (Ne) and earthfault;– Voltage: phase-phase, phase-neutral;– Power: active, reactive and apparent;– Power factor;– Frequency and peak factor;– Energy: active, reactive, apparent, counter.•Setting:– manual setting using the relative dip-switches on the front of the trip unit, which allow the settings to be made evenwhen the trip unit is off;– electronic setting, made both locally using Ekip T&P accessory and also via remote control, with version of tripunit with communication function. The electronic settinghave a wider range and a thicker regulation step. Use ofelectronic setting allows other functions to be activated:- function for protection against earth faults (G);- over voltage protection;- under voltage protection.•LED:– LED on with steady green light indicating that the trip unit is supplied correctly. The LED comes on when the currentexceeds 0.2xIn;– red LED for each protection:- L: LED with steady red light, indicates pre-alarm forcurrent exceeding 0.9xI1;- L: LED with flashing red light, indicates alarm for current exceeding setted threshold;- fixed LED MAN/ELT show the kind of active parameters;- LSI: LED with steady red light, shows that the protectionhas tripped. After the circuit-breaker has opened,connect the Ekip TT or Ekip T&P accessory to find outwhich protection function tripped the trip unit;– the trip unit is equipped with a device that detects the eventual opening solenoid disconnection thanks to thesimultaneous blinking of all the LED.•Test connector on the front of the release:– to connect the Ekip TT trip test unit, which allows trip test, LED test and signalling about the latest trip happened;– to connect the Ekip T&P unit, which allows themeasurements to be read, the trip test to be conducted,the protection functions test to be carried out, electronicsetting of the protection functions of the trip unit and of thecommunication parameters;•Self-supply from a minimum current of 0.2xIn up.•With version of trip unit with communication function, you can:– acquire and transmit a wide range of information via remote control;– accomplish the circuit-breaker opening and closing commands by means of the motor operator in theelectronic version (MOE-E);– know the state of the circuit-breaker (open/closed/trip) via remote control;– setting the configuration and programming the unit, such as the current thresholds and the protection function curves. •The three-pole version can be accessorized with external neutral current transformer and, in order to measure alsophase powers, with external neutral voltage connection kit.2Tmax T5 Ekip E-LSIGNew integrated solution for energy measurementThis new trip unit will have the following ratings:Ratings IECIn (A)320400630T5 400••-T5 630•••With Ekip E-LSIG T5, upon request, will be availablesimultaneously the communication, through internal bus, with ABB interface on the front of the switchgear HMI030 and, through system bus, with an external MODBUS network.Indeed for any ratings will be offered two versions:- with MODBUS communication function - without MODBUS communication function.The new solutionWith this new electrical trip unit, ABB offers an optimal solution for energy and power measurements without theusage of external accessories, as the device VM210Protection featuresUV(1)Tollerances in case of:– self-powered trip unit at full power;– 2 or 3 phase power supply.In conditions other than those considered, the following tollerance hold:Protection Trip threshold Trip time±20%L release between 1.1 and 1.3 x I1S±10%±20%I±15%≤60msG±15%±20%(2)Protection G is inhibited for currents higher than 4 In.(3)T5 630 I2 max = I3 max = 9.5In.(4)T5 630 t1 max = 42s.34ValueRange Accuracy Specified measuring range CurrentPhase current (I1, I2, I3, IN)0.1 … 12 InCl 10.2 … 1.2 InPhase current minimum value Phase current maximum value Ground current (Ig)0 … 4 In ––VoltagePhase voltage runtime, max and min (V1N, V2N, V3N) (3)5 … 480 V ±0.5%30 … 400 V Line voltage runtime, max and min (U12, U23, U31)10 … 828 V±0.5%50 … 690 V Power ActivePhase power runtime, max and min (P1, P2, P3) (3)-5.76 In kW … 5.76 In kW Cl 2-480In W … -6In W 6In W … 480In W (1)Total power runtime, max and min-17.28 In kW … 17.28 In kW Cl2 -1.44In kW … -18In W 18In W … 1.44In kW (1)ReactivePhase power runtime, max and min (Q1, Q2, Q3) (3)-5.76 In kvar … 5.76 In kvar Cl 2-480In var … -6In var 6In var … 4.80In var (1)Total power runtime, max and min-17.28 In kvar … 17.28 In kvar Cl2 -1.44In kvar … -18In var 18In var … 1.44In kvar (1)ApparentPhase power runtime, max and min (S1, S2, S3) (3)In VA … 5.76 In kVA Cl 26In VA … 480In VA Total power runtime, max and min 3 In VA … 17.28 In kVA Cl 218In VA … 1.44In kVA Energy ActiveTotal energy 1 kWh … 214.75 GWhCl 21 kWh … 214.75 GWhIncoming energy Outgoing energyReactive Total energy 1 kvarh … 214.75 Gvarh Cl 2 1 kvarh … 214.75 GvarhIncoming energy Outgoing energyApparentTotal energy 1 kVAh … 214.75 GVAh Cl 2 1 kVAh … 214.75 GVAh Power qualityHarmonic analisys (2)11th (50 - 60Hz)––THD of phase L1, L2, L3 (2)0 … 1000%±10%0 … 500%Frequency runtime, max, min 44 … 440 Hz ±0.2%45 … 66 Hz PF of phase L1, L2, L3 (3)-1 (1)±2%-1 ... -0.50.5 (1)(1) For: 0.2In < Ii < 1.2 In and 30V < Vi < 400V(2)Available on demand by sending a Modbus command (3)Not available if Neutral is not connectedTmax T5 Ekip E-LSIGNew integrated solution for energy measurement5Functions LSIG electronic settingTrip curves for power distributionG6CodesDescriptions1SDA081043R1T5N 400 Ekip E-LSIG In=320A 3p F F 1SDA081044R1T5S 400 Ekip E-LSIG In=320A 3p F F 1SDA081045R1T5H 400 Ekip E-LSIG In=320A 3p F F 1SDA081046R1T5L 400 Ekip E-LSIG In=320A 3p F F 1SDA081047R1T5V 400 Ekip E-LSIG In=320A 3p F F 1SDA081048R1T5N 400 Ekip E-LSIG In=400A 3p F F 1SDA081049R1T5S 400 Ekip E-LSIG In=400A 3p F F 1SDA081050R1T5H 400 Ekip E-LSIG In=400A 3p F F 1SDA081051R1T5L 400 Ekip E-LSIG In=400A 3p F F 1SDA081052R1T5V 400 Ekip E-LSIG In=400A 3p F F 1SDA081053R1T5N 400 Ekip E-LSIG In=320A 4p F F 1SDA081054R1T5S 400 Ekip E-LSIG In=320A 4p F F 1SDA081055R1T5H 400 Ekip E-LSIG In=320A 4p F F 1SDA081056R1T5L 400 Ekip E-LSIG In=320A 4p F F 1SDA081057R1T5V 400 Ekip E-LSIG In=320A 4p F F 1SDA081058R1T5N 400 Ekip E-LSIG In=400A 4p F F 1SDA081059R1T5S 400 Ekip E-LSIG In=400A 4p F F 1SDA081060R1T5H 400 Ekip E-LSIG In=400A 4p F F 1SDA081061R1T5L 400 Ekip E-LSIG In=400A 4p F F 1SDA081062R1T5V 400 Ekip E-LSIG In=400A 4p F F 1SDA081063R1T5N 630 Ekip E-LSIG In=630A 3p F F 1SDA081064R1T5S 630 Ekip E-LSIG In=630A 3p F FCodesDescriptions1SDA081065R1T5H 630 Ekip E-LSIG In=630A 3p F F 1SDA081066R1T5L 630 Ekip E-LSIG In=630A 3p F F 1SDA081067R1T5V 630 Ekip E-LSIG In=630A 3p F F 1SDA081068R1T5N 630 Ekip E-LSIG In=630A 4p F F 1SDA081069R1T5S 630 Ekip E-LSIG In=630A 4p F F 1SDA081070R1T5H 630 Ekip E-LSIG In=630A 4p F F 1SDA081071R1T5L 630 Ekip E-LSIG In=630A 4p F F 1SDA081072R1T5V 630 Ekip E-LSIG In=630A 4p F F 1SDA081094R1DIALOG Ekip E-LSIG MOD.T5 (EXTR)1SDA081082R1Ekip E-LSIG In=320 3p T51SDA081083R1Ekip E-LSIG/COM In=320 3p T51SDA081084R1Ekip E-LSIG In=320 4p T51SDA081085R1Ekip E-LSIG/COM In=320 4p T51SDA081086R1Ekip E-LSIG In=400 3p T51SDA081087R1Ekip E-LSIG/COM In=400 3p T51SDA081088R1Ekip E-LSIG In=400 4p T51SDA081089R1Ekip E-LSIG/COM In=400 4p T51SDA081090R1Ekip E-LSIG In=630 3p T5 6301SDA081091R1Ekip E-LSIG/COM In=630 3p T5 6301SDA081092R1Ekip E-LSIG In=630 4p T5 6301SDA081093R1Ekip E-LSIG/COM In=630 4p T5 6301SDA081073R1KIT x CONNECTION Ext Ne T5In order to receive for each complete CB the version with the communication function active, the extracode 1SDA081094R1 will have to be added.Ordering codesThe product will be available as loose trip units and also already mounted to specific breaking parts:Tmax T5 Ekip E-LSIGNew integrated solution for energy measurementMechanical and Electrical accessoriesThe following electrical accessories for Tmax trip units:– Aux-E, electronic auxiliary contacts– MOE-E, stored energy motor operator– Aux-S51, contact for signaling electronic trip unit tripped– HMI030, interface on the front of switchgear–Current sensor for external neutral– Ekip T&P, test and configuration kitand all the electrical and mechanical accessories for Tmax breaking parts will be compatible with the new trip unit Ekip E-LSIG. For the commercial codes please refer to the technical catalogue “SACE Tmax. T Generation”.75.512-22L1612CDS1For more information please contact:ABB SACEA division of ABB S.p.A.L.V. BreakersVia Pescaria, 524123 BergamoPhone: +39 035 395.111Fax: +39 035 395.306-433The data and illustrations are not binding. We reserve the right to make changes in the course of technical development of the product.Copyright 2015 ABB. All rights reserved.。
ZTE ET H 产品 AT 命令手册说明书
RS485 To ETH AT Command ManualContent1.What is the AT command (4)2.How to use the AT command (4)2.1.How to Enter AT command Mode (4)3.AT Command Set (5)4.AT Command Details (7)4.1.AT+E (7)4.2.AT+Z (7)4.3.AT+VER (7)4.4.AT+ENTM (7)4.5.AT+RELD (8)4.6.AT+MAC (8)4.7.AT+USERMAC (8)4.8.AT+WEBU (8)4.9.AT+WANN (9)4.10.AT+DNS (9)4.11.AT+WEBPORT (10)4.12.AT+UART (10)4.13.AT+SOCK (11)4.14.AT+TCPSE (11)4.15.AT+SOCKLK (12)4.16.AT+SOCKPORT (12)4.17.AT+RFCEN (12)4.18.AT+PDTIME (13)4.19.AT+REGEN (13)4.20.AT+REGTCP (13)4.21.AT+REGCLOUD (14)4.22.AT+REGUSR (14)4.23.AT+HTPTP (15)4.24.AT+HTPURL (15)4.25.AT+HTPHEAD (15)4.26.AT+HTPCHD (16)4.27.AT+HEARTEN (16)4.28.AT+HEARTTP (16)4.29.AT+HEARTTM (17)4.30.AT+HEARTDT (17)4.31.AT+SCSLINK (17)4.32.AT+CLIENTRST (18)4.33.AT+INDEXEN (18)4.34.AT+SOCKSL (18)4.35.AT+SHORTO (19)4.36.AT+UARTCLBUF (19)4.37.AT+RSTIM (19)4.38.AT+MAXSK (20)4.39.AT+MID (20)4.40.AT+H (20)1.What is the AT commandAT command is used for controlling module. You can use AT command to configure and query the settings2.How to use the AT commandFor RSxxx TO ETH (hereafter called as ETH Module), it is in transparent mode normally, you must enter AT command mode at first. Then you can send AT command to configure or query the settings. After you configure the ETH module, you should restart ETH module to make the settings take effect. Every time module restart will work in work mode rather ATcommand mode.Every AT command must add character carriage return <CR> and line feed <LF>. In Hex, <CR> is 0x0D <LF> is 0x0A2.1.How to Enter AT command Mode⚫Connect module to PC via UART interface (a UART to USB module is required)⚫Open Serial Assistant software on PC, and set it to 115200 8N1⚫Send “+++” to module, it responses “a”⚫Send “a” to confirm, and you will get a response “+OK”. Now you enter the Command Mode successfully.3.AT Command Set4.AT Command Details4.1.AT+E4.2.AT+Z4.3.AT+VER4.4.AT+ENTM4.6.AT+MAC4.7.AT+USERMAC4.8.AT+WEBU4.10.AT+DNS4.11.AT+WEBPORT4.12.AT+UART4.14.AT+TCPSE4.16.AT+SOCKPORT4.17.AT+RFCEN4.19.AT+REGEN4.20.AT+REGTCP4.21.AT+REGCLOUD4.22.AT+REGUSR4.24.AT+HTPURL4.25.AT+HTPHEAD4.27.AT+HEARTEN4.28.AT+HEARTTP4.29.AT+HEARTTM4.30.AT+HEARTDT4.31.AT+SCSLINK4.32.AT+CLIENTRST4.33.AT+INDEXEN4.34.AT+SOCKSL4.36.AT+UARTCLBUF4.37.AT+RSTIM4.39.AT+MID4.40.AT+H。
Stanley STDR5510 电动旋转钻机说明书
1. Work area safety a. Keep work area clean and well lit. Cluttered or dark
areas invite accidents. b. Do not operate power tools in explosive
liquids, gases or dust. Power tools create sparks which may ignite the dust or fumes. c. Keep children and bystanders away while operating a power tool. Distractions can cause you to lose control.
3
ENGLISH
f. Dress properly. Do not wear loose clothing or jewellery. Keep your hair, clothing and gloves away from moving parts. Loose clothes, jewellery or long hair can be caught in moving parts.
3. Personal safety a. Stay alert, watch what you are doing and use
Vigor Pro5510C产品参数介绍(中文)
Draytek VigorPro5510C 系列产品具有统一威胁管理(UTM)功能的整合型网络安全设备中小企业(SMB)安全网络防护的新纪元¾高性能的安全功能¾独有的MSSI(Multi-Stack Stateful Inspection)专利技术加速¾阻挡间谍软件,网络钓鱼,病毒和垃圾邮件的攻击¾即时通信(IM),P2P(点到点)应用更细粒度的控制(CSM)¾URL、WEB 过滤¾免费的网站分类过滤产品优势:统一威胁管理(UTM)是网络安全发展的新趋势依靠单一防火墙就足以将攻击者阻挡在公司网络之外已成为历史,而统一威胁管理(UTM)则是网络安全应用市场上的最新趋势。
站在技术前沿,Draytek VigorPro5510C系列产品通过MSSI(Multi-Stack Stateful Inspection)专利技术,这项新技术引进了全新的多合一网络安全设备,它提供内容过滤,反病毒,反垃圾邮件以及入侵检测这些传统意义上需要多台设备提供的功能。
高性能All-in-one一体化设计从商业前景来看,IT管理人员都应当以“企业级规划”考虑广泛的安全问题。
他们现在能够利用all-in-one一体化设备提供坚实的防护和高性能, UTM解决方案。
下面所有功能被整合在一台设备里面,并且通过简单的统一界面进行管理:反病毒、入侵检测与保护、反垃圾邮件、防火墙、虚拟私有网(VPN)、负载均衡、带宽管理(QOS)和URL、内容过滤(WEB)。
硬件加速的内容处理器VigorPro系列产品将一个硬件加速的内容处理器集成在设备中,以提高检测过程中字串匹配的速度。
因此,作为一款入线式安全设备,VigorPro5510C才在保证良好的传输性能的同时,实时地保护整个网络不受病毒、入侵或是恶意软件的伤害。
MSSI(Multi-Stack Stateful Inspection)专利技术基于MSSI核心技术,VigorPro5510C不仅可以通过防入侵检测出蠕虫攻击,还能够检测出压缩文件或是MIME电子邮件中的病毒,而且不受文件大小限制。
V03 英国深海控制器 DSE5510模块软件界面中文介绍2011年6月28日
4. Setup
参数监控
设置
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6. About
校订
关于
DSE POWER® 优控系列 DSE5510 自启动控制模块
软件界面整体介绍
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1. Config Manager 设置管理
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校订
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General DescriptionThe MAX5510/MAX5511 are single, 8-bit, ultra-low-power, voltage-output, digital-to-analog converters (DACs) offering rail-to-rail buffered voltage outputs. The DACs operate from a 1.8V to 5.5V supply and consume less than 6µA, making them desirable for low-power and low-voltage applications. A shutdown mode reduces overall current, including the reference input current, to just 0.18µA. The MAX5510/MAX5511 use a 3-wire serial interface that is compatible with SPI™,QSPI™, and MICROWIRE™.At power-up, the MAX5510/MAX5511 outputs are dri-ven to zero scale, providing additional safety for appli-cations that drive valves or for other transducers that must be off during power-up. The zero-scale outputs enable glitch-free power-up.The MAX5510 accepts an external reference input. The MAX5511 contains an internal reference and provides an external reference output. Both devices have force-sense-configured output buffers.The MAX5510/MAX5511 are available in a 4mm x 4mm x 0.8mm, 12-pin, thin QFN package and are guaranteed over the extended -40°C to +85°C temperature range.For 12-bit compatible devices, refer to the MAX5530/MAX5531 data sheet. For 10-bit compatible devices,refer to the MAX5520/MAX5521 data sheet.ApplicationsPortable Battery-Powered Devices InstrumentationAutomatic Trimming and Calibration in Factory or FieldProgrammable Voltage and Current Sources Industrial Process Control and Remote Industrial DevicesRemote Data Conversion and Monitoring Chemical Sensor Cell Bias for Gas Monitors Programmable Liquid Crystal Display (LCD) BiasFeatures♦Single +1.8V to +5.5V Supply ♦Ultra-Low 6µA Supply Current♦Shutdown Mode Reduces Supply Current to 0.18µA (max)♦Small 4mm x 4mm x 0.8mm Thin QFN Package ♦Flexible Force-Sense-Configured Rail-to-Rail Output Buffers ♦Internal Reference Sources 8mA of Current (MAX5511)♦Fast 16MHz 3-Wire SPI-/QSPI-/MICROWIRE-Compatible Serial Interface ♦TTL- and CMOS-Compatible Digital Inputs with Hysteresis ♦Glitch-Free Outputs During Power-UpMAX5510/MAX5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit,Voltage-Output DACs________________________________________________________________Maxim Integrated Products 1Pin ConfigurationOrdering InformationSelector Guide19-3120; Rev 1; 2/07For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .SPI and QSPI are trademarks of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor Corp.*EP = Exposed paddle (internally connected to GND).M A X 5510/M A X 5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit, Voltage-Output DACsABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V DD = +1.8V to +5.5V, OUT unloaded, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V DD to GND..............................................................-0.3V to +6V OUT to GND...............................................-0.3V to (V DD + 0.3V)FB to GND..................................................-0.3V to (V DD + 0.3V)SCLK, DIN, CS to GND ..............................-0.3V to (V DD + 0.3V)REFIN, REFOUT to GND ............................-0.3V to (V DD + 0.3V)Continuous Power Dissipation (T A = +70°C)Thin QFN (derate 16.9mW/°C above +70°C).............1349mWOperating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Junction Temperature.....................................................+150°C Lead Temperature (soldering, 10s).................................+300°CMAX5510/MAX5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit,Voltage-Output DACsELECTRICAL CHARACTERISTICS (continued)M A X 5510/M A X 5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit, Voltage-Output DACs 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS (continued)MAX5510/MAX5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit,Voltage-Output DACs_______________________________________________________________________________________5TIMING CHARACTERISTICS(V DD = +4.5V to +5.5V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)TIMING CHARACTERISTICS(V DD = +1.8V to +5.5V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 2:Offset is tested at code 6.Note 3:Gain is tested at code 250. FB is connected to OUT.Note 4:Guaranteed by design. Not production tested.Note 5:V DD must be a minimum of 1.8V.Note 6:Outputs can be shorted to V DD or GND indefinitely, provided that the package power dissipation is not exceeded.Note 7:Optimal noise performance is at 2nF load capacitance.Note 8:Thermal hysteresis is defined as the change in the initial +25°C output voltage after cycling the device from T MAX to T MIN .Note 9:All digital inputs at V DD or GND.Note 10:Load = 10k Ωin parallel with 100pF, V DD = 5V, V REF = 4.096V (MAX5510) or V REF = 3.9V (MAX5511).M A X 5510/M A X 5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit, Voltage-Output DACs 6_______________________________________________________________________________________Typical Operating Characteristics(V DD = 5.0V, V REF = 4.096V (MAX5510) or V REF = 3.9V (MAX5511), T A = +25°C, unless otherwise noted.)SUPPLY CURRENT vs. SUPPLY VOLTAGE(MAX5511)M A X 5510 t o c 01SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )5.55.04.0 4.52.5 3.0 3.52.01234567891001.5 6.0SUPPLY CURRENT vs. TEMPERATURE(MAX5511)M A X 5510 t o c 02TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )603510-15123456789100-4085SHUTDOWN SUPPLY CURRENT vs. TEMPERATURE (MAX5511)M A X 5510 t o c 03TEMPERATURE (°C)S H U T D O W N S U P P L Y C U R R E N T (n A )603510-1511010010000.1-4085STANDBY SUPPLY CURRENT vs. TEMPERATURE (MAX5511)TEMPERATURE (°C)S T A N D B Y S U P P L Y C U R R E N T (µA )603510-150.51.01.52.02.53.03.54.04.55.00-4085SUPPLY CURRENT vs. CLOCK FREQUENCYFREQUENCY (kHz)S U P P L Y C U R R E N T (µA )1000010001001010.110100100010.01100000SUPPLY CURRENT vs. LOGIC INPUT VOLTAGELOGIC INPUT VOLTAGE (V)S U P P L Y C U R R E N T (m A )4.54.03.0 3.51.0 1.5 2.0 2.50.50.51.01.52.02.53.03.54.04.55.00 5.0INL vs. INPUT CODE (V DD = V REF = 1.8V)DIGITAL INPUT CODEI N L (L S B )25020050100150-0.25-0.20-0.15-0.10-0.0500.050.10-0.30300INL vs. INPUT CODE (V DD = V REF = 5V)DIGITAL INPUT CODEI N L (L S B )25020050100150-0.25-0.20-0.15-0.10-0.0500.050.10-0.30300DNL vs. INPUT CODE (V DD = V REF = 1.8V)M A X 5510 t o c 09DIGITAL INPUT CODED N L (L S B )25020015010050-0.004-0.00200.0020.0040.0060.0080.0100.0120.014-0.006300MAX5510/MAX5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit,Voltage-Output DACs_______________________________________________________________________________________7DNL vs. INPUT CODE (V DD = V REF = 5V)M A X 5510 t o c 10DIGITAL INPUT CODE D N L (L S B )25020015010050-0.02-0.0100.010.020.030.04-0.03300OFFSET VOLTAGE vs. TEMPERATURETEMPERATURE (°C)O F F S E T V O L T A G E (m V )603510-15-0.8-0.6-0.4-0.200.20.40.60.81.0-1.0-4085GAIN-ERROR CHANGE vs. TEMPERATURETEMPERATURE (°C)G A I N -E R R O R C H A N G E (L S B )603510-15-0.020-0.015-0.010-0.00500.0050.0100.0150.0200.025-0.025-4085DIGITAL FEEDTHROUGH RESPONSE(DAC OUTPUT SET TO 0)20µs/divCS 5V/divSCLK 5V/div DIN 5V/divOUT 50mV/divZERO SCALEDAC OUTPUT LOAD REGULATIONvs. OUTPUT CURRENTDAC OUTPUT CURRENT (µA)D A C O U T P U T V O L T A GE (V )8006004002000-200-400-600-8000.60420.60440.60460.60480.60500.6040-10001000DAC OUTPUT LOAD REGULATIONvs. OUTPUT CURRENTDAC OUTPUT CURRENT (mA)D A C O U T P U T V O L T A GE (V )86-8-6-42-241.94051.94101.94151.94201.94251.94301.94351.94401.9400-1010DAC OUTPUT VOLTAGE vs. OUTPUT SOURCE CURRENTOUTPUT SOURCE CURRENT (mA)O U T P U T V O L T A G E (V )1010.10.011234500.001100DAC OUTPUT VOLTAGE vs. OUTPUT SINK CURRENTM A X 5510 t o c 17OUTPUT SINK CURRENT (mA)D A C O U T P U T V O L T A GE (V )1010.10.010.51.01.52.02.53.03.54.04.55.000.001100OUTPUT LARGE-SIGNAL STEP RESPONSE(V DD = 1.8V, V REF = 1.219V)MAX5510 toc18100µs/divV OUT200mV/divTypical Operating Characteristics (continued)(V DD = 5.0V, V REF = 4.096V (MAX5510) or V REF = 3.9V (MAX5511), T A = +25°C, unless otherwise noted.)M A X 5510/M A X 5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit, Voltage-Output DACs 8_______________________________________________________________________________________OUTPUT LARGE-SIGNAL STEP RESPONSE(V DD = 5V, V REF = 3.9V)MAX5510 toc19200µs/divV OUT500mV/divOUTPUT MINIMUM SERIES RESISTANCEvs. LOAD CAPACITANCECAPACITANCE (µF)M I N I M U M S E R I E S R E S I S T A N C E (Ω)1010.10.010.0011002003004005006000.0001100POWER-UP OUTPUT VOLTAGE GLITCHMAX5510 toc2120ms/divV OUT 10mV/divV DD 2V/divMAJOR CARRY OUTPUT VOLTAGE GLITCH(CODE 7FFh TO 800h)(V DD = 5V, V REF = 3.9V)MAX5510 toc22100µs/divV OUTAC-COUPLED 5mV/divREFERENCE OUTPUT VOLTAGEvs. TEMPERATURETEMPERATURE (°C)R E F E R E N C E O U T P U T V O L T A G E (V )6035-15103.9053.9103.9153.9203.9253.9303.9353.9403.900-4085REFERENCE OUTPUT VOLTAGE vs. REFERENCE OUTPUT CURRENTREFERENCE OUTPUT CURRENT (µA)R E F E R E N C E O U T P U T V O L T A G E (V )75005500350015001.2151.2161.2171.2181.2191.2201.214-500REFERENCE OUTPUT VOLTAGE vs. REFERENCE OUTPUT CURRENTREFERENCE OUTPUT CURRENT (µA)R E F E R E N C E O U T P U T V O L T A G E (V )14,50012,00095007000450020003.893.903.913.923.88-500REFERENCE OUTPUT VOLTAGEvs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)R E F E R E N C E O U T P U T V O L T A G E (V ) 5.55.04.0 4.52.5 3.0 3.52.01.217321.217341.217361.217381.217401.217421.217441.217461.217481.217501.217301.5 6.0REFERENCE LINE-TRANSIENT RESPONSE(V REF = 1.2V)MAX5510 toc27100µs/div2.8V V DD 1.8V V REF500mV/divTypical Operating Characteristics (continued)(V DD = 5.0V, V REF = 4.096V (MAX5510) or V REF = 3.9V (MAX5511), T A = +25°C, unless otherwise noted.)MAX5510/MAX5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit,Voltage-Output DACs_______________________________________________________________________________________9REFERENCE LINE-TRANSIENT RESPONSE(V REF = 3.9V)MAX5510 toc28100µs/div 5.5V V DD 4.5V V REF500mV/div 3.9VREFERENCE LOAD TRANSIENT(V DD = 1.8V)MAX5510 toc29200µs/div REFOUT SOURCE CURRENT 0.5mA/div V REFOUT 500mV/divREFERENCE LOAD TRANSIENT(V DD = 5V)MAX5510 toc30200µs/divREFOUT SOURCE CURRENT 0.5mA/divV REFOUT 500mV/div 3.9VREFERENCE LOAD TRANSIENT(V DD = 1.8V)MAX5510 toc31200µs/div REFOUT SINK CURRENT 50µA/div V REFOUT 500mV/divREFERENCE LOAD TRANSIENT(V DD = 5V)MAX5510 toc32200µs/divREFOUT SINK CURRENT 100µA/divV REFOUT 500mV/div 3.9VREFERENCE PSRR vs. FREQUENCYFREQUENCY (kHz)P O W E R -S U P P L Y R E J E C T I O N R A T I O (d B )100100.11102030405060708000.011000REFERENCE PSRR vs. FREQUENCYFREQUENCY (kHz)P O W E R -S U P P L Y R E J E C T I O N R A T I O (d B )100100.11102030405060708000.011000REFERENCE OUTPUT NOISE(0.1Hz TO 10Hz) (V DD = 1.8V, V REF = 1.2V)MAX5510 toc351s/div100µV/divREFERENCE OUTPUT NOISE(0.1Hz TO 10Hz) (V DD = 5V, V REF = 3.9V)MAX5510 toc361s/div100µV/divTypical Operating Characteristics (continued)(V DD = 5.0V, V REF = 4.096V (MAX5510) or V REF = 3.9V (MAX5511), T A = +25°C, unless otherwise noted.)M A X 5510/M A X 5511+1.8V to +5.5V , Ultra-Low-Power, 8-Bit, Voltage-Output DACs 10______________________________________________________________________________________MAX5510 Functional DiagramMAX5510/MAX5511Voltage-Output DACs______________________________________________________________________________________11Detailed DescriptionThe MAX5510/MAX5511 single, 8-bit, ultra-low-power,voltage-output DACs offer Rail-to-Rail buffered voltage outputs. The DACs operate from a 1.8V to 5.5V supply and require only 6µA (max) supply current. These devices feature a shutdown mode that reduces overall current, including the reference input current, to just 0.18µA. The MAX5511 includes an internal reference that saves additional board space and can source up to 8mA, making it functional as a system reference. The 16MH z, 3-wire serial interface is compatible with SPI,QSPI, and MICROWIRE protocols. When V DD is applied, all DAC outputs are driven to zero scale with virtually no output glitch. The MAX5510/MAX5511 out-put buffers are configured in force sense allowing users to externally set voltage gains on the output (an output-amplifier inverting input is available). These devices come in a 4mm x 4mm thin QFN package.Digital InterfaceThe MAX5510/MAX5511 use a 3-wire serial interface compatible with SPI, QSPI, and MICROWIRE protocols (Figures 1 and 2).The MAX5510/MAX5511 include a single, 16-bit, input shift register. Data loads into the shift register through the serial interface. CS must remain low until all 16 bits are clocked in. Data loads MSB first, D9–D0. The 16bits consist of 4 control bits (C3–C0), 8 data bits (D7–D0), and 4 sub-bits. (see Table 1). D7–D0 are the DAC data bits and S3–S0 are the sub-bits. The sub-bits must be set to zero for proper operation. The control bits C3–C0 control the MAX5510/MAX5511, as outlined in Table 2.Each DAC channel includes two registers: an input reg-ister and a DAC register. The input register holds input data. The DAC register contains the data updated to the DAC output.The double-buffered register configuration allows any of the following:•Loading the input registers without updating the DAC registers•Updating the DAC registers from the input registers •Updating all the input and DAC registers simultaneouslyMAX5511 Functional DiagramM A X 5510/M A X 5511Voltage-Output DACs 12______________________________________________________________________________________Figure 1. Timing DiagramFigure 2. Register Loading DiagramMAX5510/MAX5511Voltage-Output DACs______________________________________________________________________________________13X = Don’t care.*Standby mode can be entered from normal operation only. It is not possible to enter standby mode from shutdown.M A X 5510/M A X 5511Voltage-Output DACs 14______________________________________________________________________________________Power ModesThe MAX5510/MAX5511 feature two power modes to conserve power during idle periods. In normal opera-tion, the device is fully operational. In shutdown mode,the device is completely powered down, including the internal voltage reference in the MAX5511. The MAX5511 also offers a standby mode where all circuitry is powered down except the internal voltage reference.Standby mode keeps the reference powered up while the remaining circuitry is shut down, allowing it to be used as a system reference. Standby mode also helps reduce the wake-up delay by not requiring the refer-ence to power up when returning to normal operation.Shutdown ModeThe MAX5510/MAX5511 feature a software-program-mable shutdown mode that reduces the typical supply current and the reference input current to 0.18µA (max). Writing an input control word with control bits C[3:0] = 1110 places the device in shutdown mode (Table 2). In shutdown, the MAX5510 reference input and DAC output buffers go high impedance. Placing the MAX5511 into shutdown turns off the internal refer-ence, and the DAC output buffers go high impedance.The serial interface remains active for all devices.Table 2 shows several commands that bring the MAX5510/MAX5511 back to normal operation. The power-up time from shutdown is required before the DAC outputs are valid.Note: For the MAX5511, standby mode cannot be entered directly from shutdown mode. The device must be brought into normal operation before entering stand-by mode.Standby Mode (MAX5511 Only)The MAX5511 features a software-programmable standby mode that reduces the typical supply current to 6µA. Standby mode powers down all circuitry except the internal voltage reference. Place the device in standby mode by writing an input control word with control bits C[3:0] = 1100 (Table 2). The internal refer-ence and serial interface remain active while the DAC output buffers go high impedance. If the MAX5511 is coming out of standby, the power-up time from standby is required before the DAC outputs are valid.For the MAX5511, standby mode cannot be entereddirectly from shutdown mode. The device must be brought into normal operation before entering standby mode. To enter standby from shutdown, issue the com-mand to return to normal operation, followed immedi-ately by the command to go into standby.Table 2 shows several commands that bring the MAX5511back to normal operation. When transitioning from standby mode to normal operation, only the DAC power-up time is required before the DAC outputs are valid.Reference InputThe MAX5510 accepts a reference with a voltage range extending from 0 to V DD . The output voltage (V OUT ) is represented by a digitally programmable voltage source as:V OUT = (V REF x N / 256) x gainwhere N is the numeric value of the DAC’s binary input code (0 to 255), V REF is the reference voltage and gain is the externally set voltage gain for the MAX5510/MAX5511.In shutdown mode, the reference input enters a high-impedance state with an input impedance of 2.5G Ω(typ).Reference OutputThe MAX5511 internal voltage reference is software configurable to one of four voltages. Upon power-up,the default reference voltage is 1.214V. Configure the reference voltage using the D6 and D7 data bits (Table 3) when the control bits are as follows: C[3:0] = 1100,1101, or 1110 (Table 2). V DD must be kept at a mini-mum of 200mV above V REF for proper operation.Applications Information1-Cell and 2-Cell CircuitSee Figure 3 for an illustration of how to power the MAX5510/MAX5511 with either one lithium-ion battery or two alkaline batteries. The low current consumption of the devices makes the MAX5510/MAX5511 ideal for battery-powered applications.Programmable Current SourceSee the circuit in Figure 4 for an illustration of how to configure the MAX5510 as a programmable current source for driving an LED. The MAX5510 drives a stan-dard NPN transistor to program the current source. The current source (I LED ) is defined in the equation in Figure 4.Voltage Biasing a Current-OutputTransducerSee the circuit in Figure 5 for an illustration of how to con-figure the MAX5510 to bias a current-output transducer.In Figure 5, the output voltage of the MAX5510 is a func-tion of the voltage drop across the transducer added to the voltage drop across the feedback resistor R.Self-Biased Two-Electrode Potentiostat ApplicationSee the circuit in Figure 6 for an illustration of how to use the MAX5511 to bias a two-electrode potentiostat on the input of an ADC.MAX5510/MAX5511Voltage-Output DACs______________________________________________________________________________________15Figure 3. Portable Application Using Two Alkaline Cells or One Lithium Coin CellFigure 4. Programmable Current Source Driving an LEDFigure 5. Transimpedance Configuration for a Voltage-BiasedCurrent-Output TransducerM A X 5510/M A X 5511Voltage-Output DACs 16Unipolar OutputFigure 7 shows the MAX5510 in a unipolar output con-figuration with unity gain. Table 4 lists the unipolar out-put codes.Bipolar OutputThe MAX5510 output can be configured for bipolar operation, as shown in Figure 8. The output voltage is given by the following equation:V OUT = V REF x [(N A - 128) / 128]where NA represents the numeric value of the DAC’s binary input code. Table 5 shows digital codes (offset binary) and the corresponding output voltage for the circuit in Figure 4.Configurable Output GainThe MAX5510/MAX5511 have a force-sense output,which provides a connection directly to the inverting ter-minal of the output op amp, yielding the most flexibility.The advantage of the force-sense output is that specific gains can be set externally for a given application. The gain error for the MAX5510/MAX5511 is specified in a unity-gain configuration (op-amp output and inverting ter-minals connected), and additional gain error results from external resistor tolerances. Another advantage of the force-sense DAC is that it allows many useful circuits to be created with only a few simple external components.Figure 8. Bipolar Output CircuitFigure 6. Self-Biased Two-Electrode Potentiostat ApplicationFigure 7. Unipolar Output CircuitAn example of a custom fixed gain using the force-sense output of the MAX5510/MAX5511 is shown in Figure 9. In this example R1 and R2 set the gain for V OUT .V OUT = [(V REFIN x N A ) / 256] x [1 + (R2 / R1)]where N A represents the numeric value of the DAC input code.Power Supply and BypassingConsiderationsBypass the power supply with a 0.1µF capacitor to GND.Minimize lengths to reduce lead inductance. If noise becomes an issue, use shielding and/or ferrite beads to increase isolation. For the thin QFN package, connect the exposed paddle to ground.Layout ConsiderationsDigital and AC transient signals coupling to GND can create noise at the output. Use proper grounding tech-niques, such as a multilayer board with a low-inductance ground plane. Wire-wrapped boards and sockets are not recommended. For optimum system performance, use printed circuit (PC) boards. Good PC board ground lay-out minimizes crosstalk between DAC outputs, reference inputs, and digital inputs. Reduce crosstalk by keeping analog lines away from digital lines.MAX5510/MAX5511Voltage-Output DACs______________________________________________________________________________________17Figure 9. Separate Force-Sense Outputs Create Unity and Greater-than-Unity DAC Gains Using the Same ReferenceFigure 10. Software-Configurable Output GainChip InformationTRANSISTOR COUNT: 10,688PROCESS: BiCMOSRevision HistoryPages changed at Rev 1: 1, 13, 17, 18M A X 5510/M A X 5511Voltage-Output DACs Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. N o circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.18____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2007 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。