Object Serialization for Marshalling Data in a Java Interface to MPI

合集下载

一个Object-Z规格说明的证明责任产生器

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取谓词合取的方式。
０引言
形式化方法能使软件开发人员创建比那些使用传统方法或面向对象方法产生的需求规格说明更为完整、一致和无二义性
的规格说明。它能帮助开发人员发现用其它方法不容易发现的系统描述不一致性、明确性或不完整性，不有助于增加软件开发
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任产生器起着ＯｊｃＺ规格说明编辑器与证明器ＺＥＥｂｅｔ — ／ＶＳ之间的桥梁作用，方便于Ｏｊｃ— 式规格说明的验证。ｂｅｔＺ形

object类的九个方法 -回复

object类的九个方法-回复Object类是Java语言中的根类，它包含了一些基本的方法，这些方法可以在所有的Java类中被继承和使用。

下面将逐一介绍Object类的九个方法。

1. equals(Object obj)方法：该方法用于判断当前对象是否与另一个对象相等。

默认情况下，该方法直接比较两个对象的引用是否相同，即判断两个对象是否是同一个对象。

如果需要比较对象的内容是否相等，需要在子类中重写该方法。

2. hashCode()方法：该方法用于计算对象的哈希码值，并返回一个整数。

哈希码值在哈希表中用于快速定位对象，因此该方法的实现必须与equals 方法保持一致性，即如果两个对象相等，它们的哈希码值必须相等。

3. toString()方法：该方法将当前对象转换为字符串并返回。

默认情况下，该方法返回对象的类名和无符号十六进制表示的哈希码值。

可以在子类中重写该方法，以便返回更具有可读性的字符串表示。

4. getClass()方法：该方法返回当前对象的运行时类。

在Java中，对象的类是在运行时确定的，因此可以使用getClass方法获取对象的实际类型。

5. finalize()方法：该方法在对象被垃圾回收器回收之前被调用。

默认情况下，该方法不执行任何操作，可以在子类中重写该方法来实现对资源的释放或清理操作。

6. clone()方法：该方法用于创建并返回当前对象的一个副本。

要实现克隆功能，需要在子类中重写该方法，并使用深度克隆或浅度克隆的方式复制对象的字段。

7. notify()方法和notifyAll()方法：这两个方法用于实现线程之间的通信。

当一个线程在等待对象锁时，可以使用notify方法唤醒一个正在等待的线程，或使用notifyAll方法唤醒所有正在等待的线程。

8. wait()方法：该方法用于使当前线程进入等待状态，直到其他线程调用该对象的notify()或notifyAll()方法，或指定的等待时间到期。

MicroDIMM设计规范

4.20.12 - 214-Pin DDR2 SDRAM Unbuffered MicroDIMM DesignSpecificationPC2-4200/PC2-3200 DDR2 Unbuffered MicroDIMM Reference Design SpecificationRevision 0.526,April, 2004Contents1. Product Description (3)Product Family Attributes (3)Raw Card Summary (3)2. Environmental Requirements (4)Absolute Maximum Ratings (4)3. Architecture (4)Pin Description (4)Input/Output Functional Description (5)DDR2 SDRAM MicroDIMM Pinout (6)Block Diagram x16 2Ranks Raw Card A (7)Block Diagram x16 1Rank Raw Card B (8)4. Component Details (9)x16 Ballout for 256Mb, 512Mb, 1Gb, 2Gb and 4Gb DDR2 SDRAMs (Top View) (9)DDR2 SDRAM FBGA Component Specifications (9)Reference SPD Component Specifications (9)SPD Component DC Electrical Characteristics (9)5. Unbuffered MicroDIMM Details (10)DDR2 SDRAM Module Configurations (Reference Designs) (10)Input Loading Matrix (10)DDR2 MicroDIMM Gerber File Releases (11)Example Raw Card Component Placement (12)6. MicroDIMM Wiring Details (13)Signal Groups (13)General Net Structure Routing Guidelines (13)Explanation of Net Structure Diagrams (13)Differential Clock Net Structures (14)Data Net Structures (16)Control Net Structures S[1:0], CKE[1:0], ODT[1:0] (18)Address/Control Net Structures Ax, BAx, RAS, CAS, WE (19)Cross Section Recommendations (21)Test Points (22)7. Serial Presence Detect Definition (23)Serial Presence Detect Data Example (23)8. Product Label (26)9. MicroDIMM Mechanical Specifications (27)1. Product DescriptionThis reference specification defines the electrical and mechanical requirements for the PC2-4200 memory module, a 214-pin, 267 MHz clock (533 MT/s data rate), 64-bit wide, Unbuffered Synchronous Double Data Rate 2(DDR2) DRAM Micro Dual In-Line Memory Module (DDR2 SDRAM MicroDIMMs). It also defines a slower version, the PC2-3200, using 200MHz clock (400 MT/s data rate) DDR2 SDRAMs. These DDR2 SDRAM MicroDIMMs are intended for use as main memory when installed in systems such as mobile per-sonal computers.Reference design examples are included which provide an initial basis for Unbuffered MicroDIMM designs. Any modifications to these reference designs must meet all system timing, signal integrity and thermal requirements for 267 MHz clock rate support. Other designs are acceptable, and all Unbuffered DDR2MicroDIMM implementations must use simulations and lab verification to ensure proper timing requirements and signal integrity in the design.Raw Card SummaryProduct Family AttributesAttribute:Values:Notes:MicroDIMM Organizationx 64MicroDIMM Dimensions (nominal)30 mm high, 54.0mm wide MicroDIMM Types Supported Unbuffered Pin Count214SDRAMs Supported 256 Mb, 512 Mb, 1 Gb, 2 Gb, 4 GbCapacity128 MB, 256 MB, 512 MB, 1 GB, 2GB, 4 GB Serial Presence DetectConsistent with JEDEC Rev. 1.0Voltage Options, Nominal1.8 V V DD 1.8 V V DD Q1.8 V to 3.3 V V DD SPD 1InterfaceSSTL_18Note 1: V DD SPD is not tied to V DD or V DD Q on the DDR2 MicroDIMM.Raw CardNumber of DDR2 SDRAMsSDRAM OrganizationNumber of RanksA 8x162B4x1612. Environmental RequirementsPC2-4200 DDR2 SDRAM Unbuffered MicroDIMMs are intended for use in mobile computing environments that have limited capacity for heat dissipation.3. ArchitectureAbsolute Maximum RatingsSymbol ParameterRating Units Notes T OPR Operating Temperature (ambient) 0 to +65°C 1H OPR Operating Humidity (relative) 10 to 90%1T STG Storage Temperature-50 to +100°C 1H STGStorage Humidity (without condensation) 5 to 95%1Barometric Pressure (operating & storage)105 to 69kPa1, 21.Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and device functional operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.2.Up to 9850 ft.Pin DescriptionCK[1:0] Clock Inputs, positive line 2 DQ[63:0] Data Input/Output 64CK[1:0]Clock inputs, negative line 2DM[7:0] Data Masks 8CKE[1:0]Clock Enables 2DQS[7:0]Data strobes8RAS Row Address Strobe 1DQS[7:0]Data strobes complement8CAS Column Address Strobe 1WE Write Enable 1NC,TESTLogic Analyzer specific test pin (No connecton MicroDIMM1S[1:0]Chip Selects2A[9:0],A[15:11]Address Inputs15V DD Core and I/O Power 15A10/AP Address Input/Autoprecharge 1V SS Ground56BA[2:0] SDRAM Bank Address 3V REF Input/Output Reference 1ODT[1:0]On-die termination control2V DD SPD SPD Power1SCL Serial Presence Detect (SPD)Clock Input1RFU Reserved for future use 12 SDA SPD Data Input/Output 1 NCNo connect4SA[1:0]SPD address2Total:214Input/Output Functional DescriptionSymbol Type Polarity FunctionCK0/CK0, CK1/CK1InputCrosspointThe system clock inputs. All address and command lines are sampled on the cross point of therising edge of CK and falling edge of CK. A Delay Locked Loop (DLL) circuit is driven from theclock inputs and output timing for read operations is synchronized to the input clock.RFU pins for 2 CK pairs reserved.CKE[1:0]Input Active High Activates the DDR2 SDRAM CK signal when high and deactivates the CK signal when low. By deactivating the clocks, CKE low initiates the Power Down mode or the Self Refresh mode. RFU pins for 2 CKEs reserved.S[1:0]Input Active Low Enables the associated DDR2 SDRAM command decoder when low and disables the com-mand decoder when high. When the command decoder is disabled, new commands are ignored but previous operations continue. Rank 0 is selected by S0; Rank 1 is selected by S1. Ranks are also called "Physical banks". RFU pins for 2 Ss reserved.RAS, CAS,WE Input Active Low When sampled at the cross point of the rising edge of CK and falling edge of CK CAS, RAS, and WE define the operation to be executed by the SDRAM.BA[2:0]Input—Selects which DDR2 SDRAM internal bank of four or eight is activated.ODT[1:0]Input Active High Asserts on-die termination for DQ, DM, DQS, and DQS signals if enabled via the DDR2SDRAM mode register. RFU pins for 2 ODTs reserved.A[9:0],A10/AP, A[15:11]Input—During a Bank Activate command cycle, defines the row address when sampled at the crosspoint of the rising edge of CK and falling edge of CK. During a Read or Write command cycle,defines the column address when sampled at the cross point of the rising edge of CK and fall-ing edge of CK. In addition to the column address, AP is used to invoke autoprecharge opera-tion at the end of the burst read or write cycle. If AP is high, autoprecharge is selected andBA0-BAn defines the bank to be precharged. If AP is low, autoprecharge is disabled. During aPrecharge command cycle, AP is used in conjunction with BA0-BAn to control which bank(s) toprecharge. If AP is high, all banks will be precharged regardless of the state of BA0-BAninputs. If AP is low, then BA0-BAn are used to define which bank to precharge.DQ[63:0]In/Out—Data Input/Output pins.DM[7:0]Input Active High The data write masks, associated with one data byte. In Write mode, DM operates as a byte mask by allowing input data to be written if it is low but blocks the write operation if it is high. In Read mode, DM lines have no effect.DQS[7:0], DQS[7:0]In/Out CrosspointThe data strobes, associated with one data byte, sourced with data transfers. In Write mode,the data strobe is sourced by the controller and is centered in the data window. In Read mode,the data strobe is sourced by the DDR2 SDRAMs and is sent at the leading edge of the datawindow. DQS signals are complements, and timing is relative to the crosspoint of respectiveDQS and DQS. If the module is to be operated in single ended strobe mode, all DQS signalsmust be tied on the system board to VSS and DDR2 SDRAM mode registers programmedappropriately.V DD, V DD SPD,V SSSupply—Power supplies for core, I/O, Serial Presence Detect, and ground for the module.SDA In/Out—This is a bidirectional pin used to transfer data into or out of the SPD EEPROM. A resistor must be connected to V DD to act as a pull up.SCL Input—This signal is used to clock data into and out of the SPD EEPROM. A resistor may be con-nected from SCL to V DD to act as a pull up.SA[1:0]Input—Address pins used to select the Serial Presence Detect base address. RFU pins for 2nd SPD reserved.NC,TEST In/Out—The TEST pin is reserved for bus analysis tools and is not connected on normal memory mod-ules (MicroDIMMs)..DDR2 SDRAM MicroDIMM PinoutPin #LowerSidePin#UpperSidePin#LowerSidePin#UpperSidePin#LowerSidePin#UpperSidePin#LowerSidePin#UpperSide1V REF108V SS28DQS2135Vss55BA0162BA182DQ43189DQ47 2V SS109DQ429Vss136DQ2856WE163RAS83V SS190V SS 3DQ0110DQ530DQ18137DQ2957V DD164V DD84DQ48191DQ52 4DQ1111V SS31DQ19138Vss58RFU(S2)165S085DQ49192DQ535V SS112DM032Vss139DQS359RFU(ODT2)166ODT086V SS193V SS6DQS0113V SS33DQ24140DQS360CAS167A1387RFU(CK3)194CK17DQS0114DQ634DQ25141Vss61V DD168V DD88RFU(CK3)195CK18V SS115DQ735Vss142DQ3062S1169RFU(S3)89V SS196V SS9DQ2116V SS36DM3143DQ3163ODT1170RFU(ODT3)90DM6197DQS610DQ3117DQ1237Vss144Vss64V DD171V DD91V SS198DQS6 11V SS118DQ1338DQ26145NC,TEST65NC172NC92DQ50199V SS 12DQ8119V SS39DQ27146V DD66V SS173V SS93DQ51200DQ54 13DQ9120DM140Vss147CKE167DQ32174DQ3694V SS201DQ5514V SS121V SS41NC148RFU(CKE3)68DQ33175DQ3795DQ56202V SS15RFU(CK2)122CK042V DD149V DD69V SS176V SS96DQ57203DQ6016RFU(CK2)123CK043CKE0150A1570DQS4177DM497V SS204DQ6117V SS124V SS44RFU(CKE2)151A1471DQS4178V SS98DQS7205V SS18DQS1125DQ1445V DD152V DD72V SS179DQ3899DQS7206DM7 19DQS1126DQ1546BA2153A1273DQ34180DQ39100V SS207V SS 20V SS127V SS47A11154A974DQ35181V SS101DQ58208DQ62 21DQ10128DQ2048A7155A875V SS182DQ44102DQ59209DQ63 22DQ11129DQ2149V DD156V DD76DQ40183DQ45103V SS210V SS 23Vss130Vss50A5157A677DQ41184V SS104SDA211SA0 24DQ16131DM251A4158A378V SS185DQS5105SCL212RFU(*1) 25DQ17132Vss52A2159A179DM5186DQS5106NC213SA1 26Vss133DQ2253V DD160V DD80V SS187V SS107V DD SPD214RFU(*2) 27DQS2134DQ2354A10/AP161A081DQ42188DQ46Note: NC = No Connect; NC,TEST(pin 145) is for bus analysis tool and is not connected on normal memory modules. (*1) = SA0 for 2nd SPD, (*2) = SA1 for 2nd SPD.Block Diagram: Raw Card Version A (Populated as 2 ranks of x16 SDRAMs)Block Diagram: Raw Card Version B (Populated as 1 rank of x16 SDRAMs)#Unless otherwise noted, resistorand V DD Q values are 22 Ω ± 5%DQ wiring may differ from that described in this drawing;however, DQ/DM/DQS/DQS relationships are maintained as shown8pFLoad CapacitorsA0-AN RAS CAS WEmatching on ± 0.5pFBA0-BA23.0Ω±5%4. Component Detailsx16 Ballout for 256Mb, 512Mb, 1Gb, 2Gb and 4Gb DDR2 SDRAMs (Top View) 123789NC NC A NC NCBCVDD NC VSS D VSSQ UDQS VDDQ UDQ6VSSQ UDM E UDQS VSSQ UDQ7 VDDQ UDQ1VDDQ F VDDQ UDQ0VDDQ UDQ4VSSQ UDQ3G UDQ2VSSQ UDQ5VDD NC VSS H VSSQ LDQS VDDQ LDQ6VSSQ LDM J LDQS VSSQ LDQ7 VDDQ LDQ1VDDQ K VDDQ LDQ0VDDQ LDQ4VSSQ LDQ3L LDQ2VSSQ LDQ5 VDDL VREF VSS M VSSDL CK VDD CKE WE N RAS CK ODT BA2BA0BA1P CAS CSA10A1R A2A0VDD VSS A3A5T A6A4A7A9U A11A8VSS VDD A12A14V A15A13WYNC NC AA NC NCDDR2 SDRAM FBGA Component SpecificationsThe DDR2 SDRAM components used with this DIMM design specification are intended to be consistent with JEDEC MO-207 DK-Z and DL-Z.Reference SPD Component SpecificationsThe Serial Presence Detect EEPROMs have their own power pin, V DD SPD, so that they can be programmed or read without powering up the rest of the module. The wide voltage range permits use with 1.8V, 2.5V or 3.3V serial buses.SPD Component DC Electrical CharacteristicsSymbol Parameter Min Max UnitsV DD SPD Core Supply Voltage 1.7 3.6V5. Unbuffered MicroDIMM DetailsDDR2 SDRAM Module Configurations (Reference Designs)Raw Card MicroDIMMCapacityMicroDIMMOrganizationSDRAMDensitySDRAMOrganization# ofSDRAMs# ofRanksSDRAMPackage Type# of banks inSDRAM# Address bitsrow/colA256 MB32 M x 64256 Mbit16 M x 1682FBGA413/9 A512 MB64 M x 64512 Mbit32 M x 1682FBGA413/10 A 1 GB128 M x 64 1 Gbit64 M x 1682FBGA813/10 A 2 GB256 M x 64 2 Gbit128 M x 1682FBGA814/10 A 4 GB512 M x 64 4 Gbit256 M x 1682FBGA8TBDRaw Card MicroDIMMCapacityMicroDIMMOrganizationSDRAMDensitySDRAMOrganization# ofSDRAMs# ofRanksSDRAMPackage Type# of banks inSDRAM# Address bitsrow/colB128 MB16 M x 64256 Mbit16 M x 1641FBGA413/9 B256 MB32 M x 64512 Mbit32 M x 1641FBGA413/10 B512 MB64 M x 64 1 Gbit64 M x 1641FBGA813/10B 1 GB128 M x 64 2 Gbit128 M x 1641FBGA814/10B 2 GB256 M x 64 4 Gbit256 M x 1641FBGA8TBD Input Loading MatrixSignal NamesInputDeviceR/C A R/C BClock (CKn, CKn )SDRAM42 CKEn/Sn/ODTn SDRAM44 Addr/RAS/CAS/BA/WE SDRAM84 DQn/DQSn/DQSn/DMn SDRAM21 SCL/SDA/SAn EEPROM11DDR2 MicroDIMM Gerber File ReleasesReference design file updates will be released as needed. This specification will reflect the most recent design files, but may be updated to reflect clarifications to the specification only; in these cases, the design files will not be updated. The following table outlines the most recent design file releasesNote: Future design file releases will include both a date and a revision label. All changes to the design file are also documented within the ‘read-me’ file.Raw Card SpecificationRevisionApplicable Design File NotesA0.5A0 B0.5B0Example Raw Card Component PlacementThe component layout for Raw Cards A, and B are similar. In the case of Raw Card B, DDR2 SDRAMs will be included on the front side of the card; however, passive components are on both sides of the board. This example is for reference only; refer to JEDEC standard MO-TBD for details.6. MicroDIMM Wiring DetailsSignal GroupsThis specification categorizes SDRAM timing-critical signals into four groups whose members have identical loadings and routings. The following table summarizes the signals contained in each group..Signal Group Signals In Group PageClocks for Unbuffered MicroDIMM CK [1:0], CK [1:0]14, 15Data, Data Mask, Data Strobe DQ [63:0], DM[7:0], DQS[7:0], DQS[7:0]16, 17Select, Clock Enable, ODT S [1:0], CKE [1:0], ODT[1:0]18Address/Control Ax, BAx, RAS, CAS, WE19, 20General Net Structure Routing GuidelinesNet structures and lengths must satisfy signal quality and setup/hold time requirements for the memory inter-face. Net structure diagrams for each signal group are shown in the following sections. Each diagram is accompanied by a trace length table that lists the minimum and maximum allowable lengths for each trace segment and/or net.The general routing recommendations are as follows. Other stackups and layouts are possible that meet the electrical characteristics.•Route all signal traces using appropriate trace width(e.g: 0.075mm) and enough spacing(e.g: 0.15mm) between adjacent traces considering cross talk effect.•Route clocks as much as possible using the inner layers.•Test points are required.Explanation of Net Structure DiagramsThe net structure routing diagrams provide a reference design example for each raw card version. These designs provide an initial basis for unbuffered MicroDIMM designs. The diagrams should be used to deter-mine individual signal wiring on a MicroDIMM for any supported configuration. Only transmission lines (repre-sented as cylinders and labeled with trace length designators “TL”) represent physical trace segments. All other lines are zero in length. To verify MicroDIMM functionality, a full simulation of all signal integrity and tim-ing is required. The given net structures and trace lengths are not inclusive for all solutions.Once the net structure has been determined, the permitted trace lengths for the net structure can be read from the table below each net structure routing diagram. Some configurations require the use of multiple net structure routing diagrams to account for varying load quantities on the same signal. All diagrams define one load as one DDR2 SDRAM input unless mentioned. It is highly recommended that the net structure routing data in this document be simulated by the user.Differential Clock Net Structures CK[1:0], CK[1:0]DDR2 SDRAM clock signals must be carefully routed to meet the following requirements:•Signal quality •Rise/Fall time•Cross point of the differential pair in the SDRAM •JEDEC-compatible reference delays•Minimal segment length differences (less than 2.54mm total) between clocks of the same functionClock Net Wiring (Raw card A)Clock Routing Trace Lengths (Raw card A)Raw card TL0 Outer TL1 Inner TL2 Inner TL3 Outer TL4 Inner TL5 Outer Notes Min Max Min Max Min Max Min Max Min Max Min Max A2.02.36.26.77.78.13.84.36.37.90.70.911.All distances are given in millimeters and must be kept within a tolerance of ± 0.8 millimeter.TL0MicroDIMM ConnectorTL1TL2TL3TL3CK CKSDRAM SDRAMTL5TL2TL3TL3SDRAMSDRAMTL5R = 200 Ω± 5%R = 200 Ω± 5%TL4TL4Clock Net Wiring (Raw card B)Clock Routing Trace Lengths (Raw card B)Raw card TL0 Outer TL1 Inner TL2 Inner TL3 Outer TL4 Outer Notes Min Max Min Max Min Max Min Max Min Max B2.02.318.218.47.78.13.84.31.52.011.All distances are given in millimeters and must be kept within a tolerance of ± 0.8 millimeter.TL0MicroDIMM ConnectorTL1TL2TL3CK CKSDRAMTL2TL3SDRAMR = 200 Ω± 5%R = 200 Ω± 5%TL4TL4Data Net StructuresDQ[63:0], DM[7:0], DQS[7:0], DQS[7:0]Special attention has been paid to balancing the data nets within a DDR2 SDRAM, within a particularMicroDIMM, and across the MicroDIMM family. Data nets have been placed in order to bound the data strobe nets. Because data travels with the data strobe, the placement of the strobe in the middle of the narrow win-dow aids in data timing. Although it is not necessary to ensure consistent delays between SDRAMs and/or card types, doing so facilitates system design, system simulation, and DIMM specifications. It is recommend to maintain consistent delays for all nets as described in the following tables.Net Structure Routing for DQ[63:0], DM[7:0], DQS[7:0], DQS[7:0] (Raw card A)Trace Lengths for DQ[63:0], DM[7:0], DQS[7:0], DQS[7:0] (Raw card A)Raw card TL0 Outer TL1 Outer TL2 Outer TotalR1Ohms Notes Min Max Min Max Min Max Min Max A1.04.618.720.92.93.125.325.5221,2,3,41.All distances are given in millimeters and must be kept within a tolerance of ± 0.8 millimeter.2.Total Min and Total Max refer to the min and max respectively of TL0 + TL1 + TL2.3.TL0 and TL1 of Raw Card A is adjusted to compensate for the delay caused by vias on DQ nets. Traces with one via are assumed to have 1.6mm additional length. Traces with two vias are assumed to have 3.2mm additional length.4.These signals must be referenced to ground.TL0MicroDIMM Connector22 Ω ± 5%TL2SDRAM PinTL2SDRAM PinTL1Net Structures Routing for DQ[63:0], DM[7:0], DQS[7:0], DQS[7:0] (Raw card B )Trace Lengths for DQ[63:0], DM[7:0], DQS[7:0], DQS[7:0] (Raw card B )Raw cardTL0 Outer TL1 OuterTotalR1Ohms Notes Min Max Min Max Min Max B1.04.621.723.925.325.5221,2,3,41.All distances are given in millimeters and must be kept within a tolerance of ± 0.8 millimeter.2.Total Min and Total Max refer to the min and max respectively of TL0 + TL1.3.TL0 and TL1 of Raw Card B is adjusted to compensate for the delay caused by via on DQ nets.Traces with one via are assumed to have 1.6mm additional length. Traces with two vias are assumed to have 3.2mm additional length.4.These signals must be referenced to ground.TL0MicroDIMM Connector22 Ω ± 5%SDRAM PinTL1Control Net Structures S [1:0], CKE[1:0], ODT[1:0] (Raw cards A, B)Net Structure Routing for Control Net Structures S [1:0], CKE[1:0], ODT[1:0] (Raw cards A, B)Trace Lengths for Control Net Structures S [1:0], CKE[1:0], ODT[1:0] (Raw cards A, B)TL0 OuterTL1 Outer/Inner TL2 Inner TL3 Inner TL4 Outer Notes Raw CardMin Max Min Max Min Max Min Max Min Max A 1.0 4.622.029.116.017.5 6.57.1 2.7 4.21,2,3B1.04.622.029.116.017.56.57.12.74.21,2,31. All distances are given in mm and should be kept within a tolerance of ± 0.8 mm2. TL0 and TL1 are adjusted to compensate for the delay caused by via. Traces with one via are assumed to have 1.6mm additional length. Traces with two vias are assumed to have3.2mm additional length.3. These signals must be referenced to VDD.TL0MicroDIMM ConnectorTL2TL23.0 Ω ± 5%TL1TL3TL3TL4SDRAM PinTL4SDRAM PinTL4SDRAM PinTL3TL3TL4SDRAM PinAddress/Control Net Structures Ax, BAx, RAS, CAS, WE (Raw card A ).Net Structure Routing for Address/Control Net Structures Ax, BAx, RAS, CAS, WE (Raw card A )Trace Lengths for Address/Control Net Structures Ax, BAx, RAS, CAS, WE (Raw card A )TL0 OuterTL1 Outer/Inner TL2 Inner TL3 inner TL4 Outer Notes Raw CardMin Max Min Max Min Max Min Max Min Max A1.04.622.029.116.017.56.57.11.08.31,2,31. All distances are given in mm and should be kept within a tolerance of ± 0.8 mm2. TL0 and TL1 are adjusted to compensate for the delay caused by via. Traces with one via are assumed to have 1.6mm additional length. Traces with two vias are assumed to have3.2mm additional length. 3. These signals must be referenced to VDD.TL0MicroDIMM ConnectorTL4SDRAM PinTL2TL23.0 Ω ± 5%TL1TL3TL3TL4SDRAM PinTL4SDRAM PinTL4SDRAM PinTL4SDRAM PinTL3TL3TL4SDRAM Pin TL4SDRAM PinTL4SDRAM PinAddress/Control Net Structures Ax, BAx, RAS, CAS, WE (Raw card B).Net Structure Routing for Address/Control Net Structures Ax, BAx, RAS, CAS, WE (Raw card B)Trace Lengths for Address/Control Net Structures Ax, BAx, RAS, CAS, WE (Raw card B)TL0 OuterTL1 Outer/Inner TL2 Inner TL3 inner TL4 Outer TL5 Outer Notes Raw CardMin Max Min Max Min Max Min Max Min Max Min Max B1.04.622.029.116.017.56.57.11.08.33.04.01,2,31. All distances are given in mm and should be kept within a tolerance of ± 0.8 mm2. TL0 and TL1 are adjusted to compensate for the delay caused by via. Traces with one via are assumed to have 1.6mm additional length. Traces with two vias are assumed to have3.2mm additional length.3. These signals must be referenced to VDD.TL0MicroDIMM ConnectorTL2TL23.0 Ω ± 5% TL1TL3TL3TL4SDRAM PinTL4SDRAM PinTL4SDRAM PinTL3TL3TL4SDRAM PinTL58pF ± 0.5pFCross Section RecommendationsAn example of the DDR2 MicroDIMM printed circuit board design uses six-layers of glass epoxy material. PCBs should contain full plane layers for reference plane. The reference planes can be divided so adjacent signal layers maintain a constant Vss or Vdd reference. All data group signals are referenced to Vss and all address/command are referenced to Vdd. The required board impedance is 60 Ω± 10%.PCB Electrical SpecificationsParameter Min Max UnitsTrace velocity: S0 (outer layers) 5.5 6.7ps/mmTrace velocity: S0 (inner layers) 6.57.6ps/mmTrace impedance: Z0 (all layers)5466OhmsExample Layer Stackup for 0.075mm width traceTest PointsAll DDR2 components are in BGA packages which makes the package pads inaccessible for probing during-system development. The DDR2 MicroDIMMs have test points identified to make initial evaluation easier. In some cases test pads have been added and in other cases existing vias are used as test points. An effort has been made to provide testability on some signals in all signal groups but 100% coverage is not possible.Raw Card A Test Points Example(Front View)DQ22CK0-CK1-DQS at resistor pack.CK0CK1DQ7DQ44DQ52DQ28Raw Card B Test Points Example(Front View)BA2DQ22CK0-CK1-A7A3A12A10A9A14S0-A11A6BA0A2BA1CKE0A15A5A1CAS-ODT0RAS-WE-DQS at resistor pack.CK0CK1DQ7DQ44DQ52A13A0A4A8DQ28DQ367. Serial Presence Detect DefinitionThe Serial Presence Detect (SPD) function MUST be implemented on the PC2-4200 DDR2 SDRAM Unbuf-fered MicroDIMM. The component used and the data contents must adhere to the most recent version of the JEDEC DDR2 SDRAM SPD Specifications. Please refer to this document for all technical specifications and requirements of the serial presence detect devices.The following table is intended to be an example of a typical PC2-4200 MicroDIMM. SPD values indicating different MicroDIMM performance characteristics will be utilized based on specific characteristics of the SDRAMs or MicroDIMMs. This example assumes:•Module Organization: 512MB•Device Composition: 32Mx16•Device Package: FBGA•Module Physical Ranks: 2•CAS latency: 4(DDR2-533), 3(DDR2-400)Serial Presence Detect Data Example (Part 1 of 3)Byte # (dec)Byte #(hex)DescriptionSPD Entry ValueSerial PDData Entry(Hexadecimal)NotesDDR2-533DDR2-400DDR2-533DDR2-400000Number of Serial PD Bytes written during production128801 101Total Number of Bytes in Serial PD device256082202Fundamental Memory Type (FPM, EDO, SDRAM,DDR, DDR2, ...)DDR2 SDRAM08303Number of Row Addresses on Assembly130D 404Number of Column Addresses on Assembly100A505Number of DIMM RanksModule height:30mm, Planar,card on card: no,2Ranks61606Data Width of this Assembly x6440 707Reserved Undefined00 808Voltage Interface Level of this assembly SSTL 1.8V05909SDRAM Cycle Time at maximum supported CASlatency (CL), CL = X3.75ns 5.00ns3D503100A SDRAM Access from Clock+/-0.50ns+/-0.50ns5050110B DIMM configuration type (Non-parity, or ECC)Non-Parity00120C Refresh Rate/Type7.8us/SR823,4 130D Primary SDRAM Width x1610140E Error Checking SDRAM Width NA00150F Reserved Undefined001.This will typically be programmed as 128 bytes.2.This will typically be programmed as 256 bytes.3.From Data sheet.4.High order bit is self refresh "flag". If set to "1", the assembly supports self refresh.5.These are optional, in accordance with JEDEC specification.1610SDRAM device attributes: Burst lengths supported4,80C1711SDRAM device attributes: Number of Banks onSDRAM device40431812SDRAM device attributes: CAS Latency4310083 1913Reserved Undefined000 2014DIMM type information MicroDIMM082115SDRAM Module Attributes Normal DIMM002216SDRAM device attributes: General no optional aspect002317Minimum Clock Cycle at CLX -1Undefined FF32418Maximum Data Access Time (t AC) from Clock at CLX -1Undefined FF32519Minimum Clock Cycle Time at CLX-2Undefined FF3261A Maximum Data Access Time (t AC) from Clockat CLX-2Undefined FF3271B Minimum Row Precharge Time (t RP)15.0ns15.0ns3C3C3 281C Minimum Row Active to Row Active delay (t RRD)7.5ns7.5ns1E1E3 291D Minimum RAS to CAS delay (t RCD)15.0ns15.0ns3C3C3 301E Minimum Active to Precharge Time (t RAS)45.0ns45.0ns2D2D3 311F Module Rank Density256MB403220Address and Command input Setup Time BeforeClock (t IS)0.60ns0.60ns606033321Address and Command input Hold Time After Clock(t IH)0.60ns0.60ns606033422Data Input Setup Time Before Clock (t DS)0.35ns0.35ns35353 3523Data Input Hold Time After Clock (t DH)0.35ns0.35ns35353 3624Write recovery time (t WR)15.0ns15.0ns3C3C3 3725Internal write to read command delay (t WTR)7.5ns10ns1E283 3826Internal read to precharge command delay (t RTP)7.5ns7.5ns1E1E3 3927Memory analysis probe characteristics Undefined004028Reserved Undefined004129SDRAM device minimum active to active/auto refreshtime (t RC)60.0ns60.0ns3C3C3422A SDRAM device minimum auto-refresh to active/autorefresh command period (t RFC)105.0ns105.0ns69693Serial Presence Detect Data Example (Part 2 of 3)Byte # (dec)Byte #(hex)DescriptionSPD Entry ValueSerial PDData Entry(Hexadecimal)NotesDDR2-533DDR2-400DDR2-533DDR2-4001.This will typically be programmed as 128 bytes.2.This will typically be programmed as 256 bytes.3.From Data sheet.4.High order bit is self refresh "flag". If set to "1", the assembly supports self refresh.5.These are optional, in accordance with JEDEC specification.。

纹理物体缺陷的视觉检测算法研究--优秀毕业论文

摘要
在竞争激烈的工业自动化生产过程中，机器视觉对产品质量的把关起着举足轻重的作用，机器视觉在缺陷检测技术方面的应用也逐渐普遍起来。与常规的检测技术相比，自动化的视觉检测系统更加经济、快捷、高效与安全。纹理物体在工业生产中广泛存在，像用于半导体装配和封装底板和发光二极管，现代化电子系统中的印制电路板，以及纺织行业中的布匹和织物等都可认为是含有纹理特征的物体。本论文主要致力于纹理物体的缺陷检测技术研究，为纹理物体的自动化检测提供高效而可靠的检测算法。纹理是描述图像内容的重要特征，纹理分析也已经被成功的应用与纹理分割和纹理分类当中。本研究提出了一种基于纹理分析技术和参考比较方式的缺陷检测算法。这种算法能容忍物体变形引起的图像配准误差，对纹理的影响也具有鲁棒性。本算法旨在为检测出的缺陷区域提供丰富而重要的物理意义，如缺陷区域的大小、形状、亮度对比度及空间分布等。同时，在参考图像可行的情况下，本算法可用于同质纹理物体和非同质纹理物体的检测，对非纹理物体的检测也可取得不错的效果。在整个检测过程中，我们采用了可调控金字塔的纹理分析和重构技术。与传统的小波纹理分析技术不同，我们在小波域中加入处理物体变形和纹理影响的容忍度控制算法，来实现容忍物体变形和对纹理影响鲁棒的目的。最后可调控金字塔的重构保证了缺陷区域物理意义恢复的准确性。实验阶段，我们检测了一系列具有实际应用价值的图像。实验结果表明本文提出的纹理物体缺陷检测算法具有高效性和易于实现性。关键字: 缺陷检测；纹理；物体变形；可调控金字塔；重构
Keywords: defect detection, texture, object distortion, steerable pyramid, reconstruction
II

UVM1.1应用指南及源代码分析_20111211版

I
而后半部分（第 10 到第 19 章）则介绍 UVM 背后的工作原理，用户群相对稀少。通常来说，一般的用户只要看懂前半部分就可以了。但是我想，世上总有像我一样有好奇心的人，不满足知其然再不知其所以然，会有人像我一样，会因为一个技术问题而彻夜难眠，如果你是这样的人，那么恭喜，这本书的后半部分就是为你准备的。
UVM1.1 应用指南及源代码分析
UVM1.1 Application Guide and Source Code Analysis
张强著
在这里，读懂 UVM
序
写这本书的难度超出了我的预料。从 8 月初开始写，一直到现在，4 个多月的时间，从刚开始的满含激情，到现在的精疲力尽。现在写出来的东西，距离我心目中的作品差距十万八千里，有太多的地方没有讲述清楚，有太多的地方需要仔细斟酌，有太多的语句需要换一种表述方式。
8. register model的使用 ..............................................................................................125
8.1. register model简介...................................................................................125
写这本书，只是想把自己会的一点东西完全的落于纸上。在努力学习 UVM 的过程中，自己花费了很多时间和精力。我只想把学习的心得记录下来，希望能够给后来的人以启发。如果这本书能够给一个人带来一点点的帮助，那么我的努力就不算是白费。
这本书的前半部分（第 1 到第 9 章）介绍了 UVM 的使用，其用户群较为广泛；

java object 序列化方法 -回复

java object 序列化方法-回复Java对象序列化是将对象转换为字节流的过程，在需要传输对象、保存对象到文件或数据库等场景中广泛应用。

本文将详细讨论Java对象序列化的基本原理、使用方法以及相关注意事项。

一、什么是Java对象序列化Java对象序列化是指将一个Java对象转换为字节流的过程。

字节流可以用于以二进制形式进行数据存储、传输或持久化。

二、Java对象序列化的基本原理Java对象序列化的基本原理是将对象转换为字节流，使得对象中的信息可以被保存或传递。

1. 实现Serializable接口Java中，要使一个类可以被序列化，需要实现Serializable接口。

Serializable是一个标记接口，没有任何方法定义。

只要类实现了Serializable接口，编译器会隐式地为该类添加一个序列化版本号和一个默认的序列化机制。

2. transient关键字在某些情况下，我们可能不希望某些字段被序列化，例如敏感信息或计算得出的临时结果。

可以使用transient关键字修饰字段，使其在对象序列化时被忽略。

3. ObjectOutputStream和ObjectInputStream ObjectOutputStream和ObjectInputStream是Java提供的核心类，用于实现对象的序列化和反序列化。

序列化时，使用ObjectOutputStream 的writeObject()方法将对象写入输出流；反序列化时，使用ObjectInputStream的readObject()方法从输入流读取对象。

4. 序列化版本号Java的序列化机制要求每个可序列化的类都有一个版本号，用来判断待反序列化的字节流与当前类定义是否一致。

如果两者版本号不一致，反序列化操作可能会失败。

可以通过serialVersionUID字段指定版本号，若不指定，则系统会自动生成。

三、Java对象序列化方法接下来，我们来讨论Java对象序列化的方法。

VW_01014 大众图纸图框及字体规范

Engineering DrawingsDrawing Frames and Text MacrosPrevious issuesVW 01014: 1971-05, 1984-03, 1992-08, 1998-04, 1998-10, 2000-09, 2001-03, 2002-06, 2003-11,2006-01, 2007-01, 2008-03, 2009-04, 2010-05, 2010-12, 2011-05, 2011-12ChangesThe following changes have been made compared with VW 01014: 2011-12:–Technical responsibility changes–Section 1 "Scope of application": the note concerning the application in section 6 has been re‐moved. It now appears as NOTE 3 in section 1–Section 2.3 "PDM drawing frame": English legal notice updated and table of existing PDM draw‐ing frame formats in KVS added.–Section 3.7 "Volkswagen AG Know-How Protection": text macro NO-A12 added ContentsPageScope .........................................................................................................................4Drawing frames ..........................................................................................................5Drawing frame for Design Engineering (series-production drawing), see Figure 1....................................................................................................................................5Type approval drawing frame, see Figure 2 ...............................................................6PDM drawing frame, see Figure 3 .............................................................................7Drawing frames for operating equipment ...................................................................8Basic drawing frame for operating equipment, see Figure 4 ......................................8Drawing frame for method plan, see Figure 5 ............................................................9Text macros .............................................................................................................10Basic title block .. (10)122.12.22.32.42.4.12.4.233.1Group StandardVW 01014Issue 2012-09Class. No.:02115Descriptors:drawing frames, text macro, standard frame, drawingVerify that you have the latest issue of the Standard before relying on it.This electronically generated Standard is authentic and valid without signature.The English translation is believed to be accurate. In case of discrepancies, the German version is alone authoritative and controlling.Page 1 of 43Confidential. All rights reserved. No part of this document may be provided to third parties or reproduced without the prior consent of the Standards Department of a Volkswagen Group member.This Standard is available to contracting parties solely via the B2B supplier platform .© Volkswagen AktiengesellschaftVWNORM-2011-08gTitle blocks for drawings with restrictions on use .....................................................11Title block for layout drawings (ENT) > A0 ...............................................................12Symbol for European projection method ..................................................................13Change block for formats > A0 .................................................................................13Tolerancing principle as per VW 01054 ...................................................................13Volkswagen Group know-how protection .................................................................13Drawing field ............................................................................................................14Lower left corner of drawing for formats > A0 ..........................................................14Left drawing edge for formats > A0 ..........................................................................14Explanation of parenthesized dimensions for formats > A0 (lower left corner ofdrawing field) ............................................................................................................14References for formats > A0 ....................................................................................15Migration from CATIA V4 to CATIA V5 ....................................................................15Parts marking ...........................................................................................................15Part number assignment drawn / symmetrically opposite ........................................15Note on utilization of scrap material .........................................................................16NO-F1 Drawings with multiple sheets ......................................................................16Repeating and unchanging notes, mostly on body components ..............................16Drawing only for the company stated .......................................................................16Note on parts which are subject to build sample approval (BMG) ...........................17Notes on testing as per Technical Supply Specifications (TL) .................................17Note on type approval ..............................................................................................17Note on undimensioned design models in the data record ......................................17Note on open-air weathering ....................................................................................17Note on model approval ...........................................................................................17Note on master model ..............................................................................................18Note on second original, font size 7 mm ..................................................................18Note on second original, font size 3,5 mm ...............................................................18Note on heavy-duty component ...............................................................................18Note on mandatory type approval ............................................................................19Note on avoidance of hazardous substances ..........................................................19Note on other relevant drawings ..............................................................................19Note on undimensioned bend and trim radii ............................................................19Note on simplified representation .............................................................................19Note on flawless condition of surfaces .....................................................................19Note on material for form tool in grain area ..............................................................20Table for RPS ...........................................................................................................20Note on emission behavior .......................................................................................20Note on length dimensions to be measured up to relevant functional datum plane ..................................................................................................................................20Note on related tolerances for nominal dimension ranges up to relevant functional datum plane .............................................................................................................21Note on tolerances of surfaces as compared to the data record and defined RPS..................................................................................................................................21Note on tolerances of marked surfaces as compared to the data record anddefined RPS .............................................................................................................21Note on tolerances of marked and limited surfaces as compared to the datarecord and defined RPS ...........................................................................................21Note on tolerances of marked edges as compared to the data record and defined RPS ..........................................................................................................................21Note on alternative materials and surface protection types .....................................22Note on color and grain .. (22)3.23.33.43.53.63.744.14.24.34.44.54.64.74.84.94.104.114.124.134.144.154.164.174.184.194.204.214.224.234.244.254.264.274.284.294.304.314.324.334.344.354.364.374.38Page 2VW 01014: 2012-09Note on temperature resistance ...............................................................................22Note on color consistency ........................................................................................22Note on lightfastness ................................................................................................22Note on fixing, clamping and contact surface ..........................................................23Note on related finished part drawing ......................................................................23Note on material specifications, complete ................................................................23Note on material specifications, subdivided .............................................................24Note on optional welding technology .......................................................................24Note on flammability features ...................................................................................24Note on table containing gear tooth data .................................................................25Note on weight indication .........................................................................................25Note on amine emission of foam parts .....................................................................25Note on cleanliness requirements for engine components ......................................25Countersinks for internal threads .............................................................................26Testing of rolled bushings ........................................................................................26Table for limit dimensions ........................................................................................26Detail drawing for radius under screw head, mostly for standard part drawings (27)Test specification for disk wheels .............................................................................27Test specification for brake drums ...........................................................................28General tolerances for castings ...............................................................................28General tolerances for forgings ................................................................................29Coordinate dimensioning for tubes and bars ...........................................................30Bill of materials for layout drawings (ENT) ...............................................................30Distribution list for layout drawings (ENT) ................................................................31Text macros for operating equipment ......................................................................31Title block for individual part .....................................................................................31Note on pass direction, left .......................................................................................32Note on pass direction, right ....................................................................................32Title block for operating equipment label .................................................................32General tolerances for nominal dimensions without tolerance specification ............32Note on simplified drawing specifications on surface roughnesses .........................33Permissible deviations for nominal sizes without tolerance specification onweldments ................................................................................................................33Permissible deviations for nominal dimensions without tolerance specificationson flame-cut parts ....................................................................................................33Note on parts used ...................................................................................................34Note on rolled flame-cutting template plots ..............................................................34Note on "Add ½ kerf" ................................................................................................34Note on "designed" and "symmetrical opposite" ......................................................34Text macros for the "3D drawingless process" (3DZP – German abbreviation) ......35VW copyright ............................................................................................................35Note on restriction on use ........................................................................................35Note on type approval documentation and type approval number ...........................35Draft number ............................................................................................................36Note on engineering project number ........................................................................36Note on safety documentation .................................................................................36Recycling requirements as per VW 91102 ...............................................................36All dimensions apply to the finished part including surface protection .....................36Surface roughness as per VW 13705 and VDA 2005 ..............................................36Surface roughness as per VW 13705 and VDA 2005 (reference without symbol) (37)4.394.404.414.424.434.444.454.464.474.484.494.504.514.524.534.544.554.564.574.584.594.604.614.6255.15.25.35.45.55.65.75.85.95.105.115.1266.16.26.36.46.56.66.76.86.96.9.1Page 3VW 01014: 2012-09Surface roughness as per VW 13705 and VDA 2005 (reference with symbol) .......37Surface roughness as per VW 13705 and VDA 2005 (reference with symbol,collective specification 1) .........................................................................................38Surface roughness as per VW 13705 and VDA 2005 (reference with symbol,collective specification 2) .........................................................................................39Workpiece edges as per VW 01088 .........................................................................39Workpiece edges as per VW 01088 (reference without symbol) .............................40Workpiece edges as per VW 01088 (reference with symbol) ..................................40Workpiece edges as per VW 01088 (reference with symbol, collectivespecification 1) .........................................................................................................41Workpiece edges as per VW 01088 (reference with symbol, collectivespecification 2) .........................................................................................................42Applicable documents ..............................................................................................426.9.26.9.36.9.46.106.10.16.10.26.10.36.10.47ScopeThis standard applies to the computer-aided graphical representation and presentation of drawing templates, standard frames and text macros for drawings within the Volkswagen Group.NOTE 1 The standardized text macros are subject to drawing standard regulations and are centrally managed by the "Virtual Systems and Standardization" department.NOTE 2 All drawing frames and text macros shown here are available in the appropriate standard system environment of the CAD systems CATIA and Creo Elements/Pro (formerly PRO/E). The PDM drawing frames are also available as IsoDraw and Excel templates in the KVS, and also as Catia V5templates.NOTE 3 The text macros shown in section 6 are for the drawingless process only. The creator and the user of the data must agree whether their process chain allows for the use of documents as per the 3DZP method, and whether this is permissible.1Page 4VW 01014: 2012-09Drawing framesDrawing frame for Design Engineering (series-production drawing), see Figure 1Figure 1 – Drawing frame for Design Engineering (series-production drawing)2 2.1Page 5VW 01014: 2012-09Type approval drawing frame, see Figure 2Figure 2 – Type approval drawing frame2.2 Page 6VW 01014: 2012-09PDM drawing frame, see Figure 3Figure 3 – PDM drawing frame2.3 Page 7VW 01014: 2012-09Drawing frames for operating equipmentBasic drawing frame for operating equipment, see Figure 4Figure 4 – Basic drawing frame for operating equipment2.4 2.4.1Page 8VW 01014: 2012-09Drawing frame for method plan, see Figure 5Figure 5 – Drawing frame for method plan2.4.2 Page 9VW 01014: 2012-09Text macrosBasic title blockFigure 6 – Code no: NO-A1Basic title block for formats > A03 3.1Page 10VW 01014: 2012-09Title blocks for drawings with restrictions on useFigure 7 – Code no: NO-A7 A3The title block may only be used if supplier original drawings are used as modified finished part drawings.Notes on the usage of these title blocks see VW 01058.3.2Title block for layout drawings (ENT) > A0Figure 8 – Code no: NO-A3ENT = Draft3.3Symbol for European projection methodFigure 9 – Code no: NO-A5Change block for formats > A0Figure 10 – Code no: NO-A6Tolerancing principle as per VW 01054Figure 11 – Code no: NO-A11Volkswagen Group know-how protectionFigure 12 – Code no: NO-A123.4 3.5 3.6 3.7Drawing fieldLower left corner of drawing for formats > A0Figure 13 – Code no: NO-B1Left drawing edge for formats > A0Figure 14 – Code no: NO-B3Explanation of parenthesized dimensions for formats > A0 (lower left corner of drawingfield)Figure 15 – Code no: NO-B644.1 4.2 4.3References for formats > A0Figure 16 – Code no: NO-B7Migration from CATIA V4 to CATIA V5Figure 17 – Code no: NO-B8Parts markingFigure 18 – Code no: NO-E2Part number assignment drawn / symmetrically oppositeFigure 19 – Code no: NO-E54.4 4.5 4.6 4.7Note on utilization of scrap materialFigure 20 – Code no.:NO-F1 Drawings with multiple sheetsFigure 21 – Code no: NO-F2Repeating and unchanging notes, mostly on body componentsFigure 22 – Code no: NO-F3Drawing only for the company statedFigure 23 – Code no: NO-F4 (do not use for new designs!)4.8 4.9 4.10 4.11Note on parts which are subject to build sample approval (BMG)Figure 24 – Code no: NO-F5Notes on testing as per Technical Supply Specifications (TL)Figure 25 – Code no: NO-F6Note on type approvalFigure 26 – Code no: NO-F7Note on undimensioned design models in the data recordFigure 27 – Code no: NO-F8Note on open-air weatheringFigure 28 – Code no: NO-F9Note on model approvalFigure 29 – Code no: NO-F104.12 4.13 4.14 4.15 4.16 4.17Note on master modelFigure 30 – Code no: NO-F11Note on second original, font size 7 mmFigure 31 – Code no: NO-F12Note on second original, font size 3,5 mmFigure 32 – Code no: NO-F13Note on heavy-duty componentFigure 33 – Code no: NO-F144.18 4.19 4.20 4.21Note on mandatory type approvalFigure 34 – Code no: NO-F15Note on avoidance of hazardous substancesFigure 35 – Code no: NO-F16Note on other relevant drawingsFigure 36 – Code no: NO-F17Note on undimensioned bend and trim radiiFigure 37 – Code no: NO-F18Note on simplified representationFigure 38 – Code no: NO-F19Note on flawless condition of surfacesFigure 39 – Code no: NO-F204.22 4.23 4.24 4.25 4.26 4.27Note on material for form tool in grain areaFigure 40 – Code no: NO-F22Table for RPSFigure 41 – Code no: NO-F23Note on emission behaviorFigure 42 – Code no: NO-F24Note on length dimensions to be measured up to relevant functional datum planeFigure 43 – Code no: NO-F254.28 4.29 4.30 4.31Note on related tolerances for nominal dimension ranges up to relevant functional datumplaneFigure 44 – Code no: NO-F26Note on tolerances of surfaces as compared to the data record and defined RPSFigure 45 – Code no: NO-F27Note on tolerances of marked surfaces as compared to the data record and defined RPSFigure 46 – Code no: NO-F28Note on tolerances of marked and limited surfaces as compared to the data record anddefined RPSFigure 47 – Code no: NO-F29Note on tolerances of marked edges as compared to the data record and defined RPSFigure 48 – Code no: NO-F304.32 4.33 4.34 4.35 4.36Note on alternative materials and surface protection typesFigure 49 – Code no: NO-F31Note on color and grainFigure 50 – Code no: NO-F32Note on temperature resistanceFigure 51 – Code no: NO-F33Note on color consistencyFigure 52 – Code no: NO-F35Note on lightfastnessFigure 53 – Code no: NO-F364.37 4.38 4.39 4.40 4.41Note on fixing, clamping and contact surfaceFigure 54 – Code no: NO-F37Note on related finished part drawingFigure 55 – Code no: NO-F38Note on material specifications, completeFigure 56 – Code no: NO-F394.42 4.43 4.44Note on material specifications, subdividedFigure 57 – Code no: NO-F40Note on optional welding technologyFigure 58 – Code no: NO-F41Note on flammability featuresFigure 59 – Code no: NO-F424.45 4.46 4.47Note on table containing gear tooth dataFigure 60 – Code no: NO-F43Note on weight indicationFigure 61 – Code no: NO-F44Note on amine emission of foam partsFigure 62 – Code no: NO-F45Note on cleanliness requirements for engine componentsFigure 63 – Code no: NO-F464.48 4.49 4.50 4.51Countersinks for internal threadsFigure 64 – Code no: NO-G0Testing of rolled bushingsFigure 65 – Code no: NO-G1Table for limit dimensionsFigure 66 – Code no: NO-G24.52 4.53 4.54Detail drawing for radius under screw head, mostly for standard part drawingsFigure 67 – Code no: NO-G4Test specification for disk wheelsFigure 68 – Code no: NO-G64.55 4.56Test specification for brake drumsFigure 69 – Code no: NO-G7General tolerances for castingsFigure 70 – Code no: NO-G84.57 4.58General tolerances for forgingsFigure 71 – Code no: NO-G94.59Coordinate dimensioning for tubes and barsFigure 72 – Code no: NO-G10Bill of materials for layout drawings (ENT)Figure 73 – Code no: NO-H14.60 4.61Distribution list for layout drawings (ENT)Figure 74 – Code no: NO-H2Text macros for operating equipmentTitle block for individual partFigure 75 – Code no: R001 individual part4.62 55.1Note on pass direction, leftFigure 76 – Code no: R002 pass direction, leftNote on pass direction, rightFigure 77 – Code no: R003 pass direction, rightTitle block for operating equipment labelFigure 78 – Code no: R004 operating equipment labelGeneral tolerances for nominal dimensions without tolerance specificationFigure 79 – Code no: R005 machining operation5.2 5.35.45.5Note on simplified drawing specifications on surface roughnessesFigure 80 – Code no: R006 surfacesPermissible deviations for nominal sizes without tolerance specification on weldmentsFigure 81 – Code no: R007 welded partsPermissible deviations for nominal dimensions without tolerance specifications on flame-cut partsFigure 82 – Code no: R008 flame-cut parts5.6 5.75.8Note on parts usedFigure 83 – Code no: R009 parts usedNote on rolled flame-cutting template plotsFigure 84 – Code no: R010 flame-cutting templateNote on "Add ½ kerf"Figure 85 – Code no: R011 kerfNote on "designed" and "symmetrical opposite"Figure 86 – Code no: R012 symmetrical opposite5.9 5.105.115.12Text macros for the "3D drawingless process" (3DZP – German abbreviation)The following text macros are not created in CAD systems, but only in the PDM system KVS.The design engineer must add the necessary parameters to the text macros.VW copyrightFigure 87 – Code no: NOZ-01Note on restriction on useLegend P01Company nameFigure 88 – Code no: NOZ-02Note on type approval documentation and type approval numberLegend P01Type approval doc. and type approval numberFigure 89 – Code no: NOZ-036 6.16.26.3Draft numberLegend P01Draft numberFigure 90 – Code no: NOZ-04Note on engineering project numberLegend P01Engineering project numberFigure 91 – Code no: NOZ-05Note on safety documentationLegend P01TLD number (technical guideline for documentation – German abbreviation)Figure 92 – Code no: NOZ-06Recycling requirements as per VW 91102Figure 93 – Code no: NOZ-07All dimensions apply to the finished part including surface protectionFigure 94 – Code no: NOZ-08Surface roughness as per VW 13705 and VDA 2005The design engineer must add the required parameters to the symbols shown here (e.g., Rz value).Two types of text macros (with and without graphical representation) have been defined. Variant NOZ-09 is a reference to Standard VW 13705, additional information possible, but restricted. Variants NOZ-09-01 a to f are reserved for the main surface roughness value. Due to system restrictions,identical symbols cannot be used more than once. For this reason, the symbols in section 6.9.3 and6.4 6.56.66.76.86.9section 6.9.4 must be used for cases of multiple use. If surface roughness values are added as a note, the text macros are placed beneath each other instead of beside each other. This deviating representation has been released for the 3DZP drawingless process.Surface roughness as per VW 13705 and VDA 2005 (reference without symbol)Figure 95 – Code no: NOZ-09Surface roughness as per VW 13705 and VDA 2005 (reference with symbol)Figure 96 – Code no: NOZ-09-01-aFigure 97 – Code no: NOZ-09-01-bFigure 98 – Code no.: NOZ-09-01-cLegend P01Machining allowance (numerical value in mm)P02Production processP03Surface parameter and numerical valueP04if applicable, additional requirement as per VDA 2005P05if applicable, additional requirement as per VDA 2005P06if applicable, second requirement on surface texture (surface parameter,numerical value)P07Specification of the surface groovesLegend P01Letter for simplified drawing specification. Method defined in section "simplified specifi‐cation" in VDA 2005Figure 99 – Code no: NOZ-09-01-d6.9.16.9.2Figure 100 – Code no: NOZ-09-01-e Figure 101 – Code no: NOZ-09-01-fSurface roughness as per VW 13705 and VDA 2005 (reference with symbol, collectivespecification 1)Figure 102 – Code no: NOZ-09-02-aFigure 103 – Code no: NOZ-09-02-bFigure 104 – Code no: NOZ-09-02-cLegend P01Machining allowance (numerical value in mm)P02Production processP03Surface parameter and numerical valueP04if applicable, additional requirement as per VDA 2005P05if applicable, additional requirement as per VDA 2005P06if applicable, second requirement onsurface texture (surface parameter,numerical value) P07Specifica‐tion of thesurface groovesCode no.:Legend P01Letter for simplified drawing specification. Method defined in section "simplified specifi‐cation" in VDA 2005Figure 105 – NOZ-09-02-dFigure 106 – Code no: NOZ-09-02-e Figure 107 – Code no: NOZ-09-02-f6.9.3。

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pythonmarshal对象序列化和反序列化

pythonmarshal对象序列化和反序列化有时候，要把内存中的⼀个对象持久化保存到磁盘上，或者序列化成⼆进制流通过⽹络发送到远程主机上。

Python中有很多模块提供了序列化与反序列化的功能，如：marshal, pickle, cPickle等等。

今天就讲讲marshal模块。

注意： marshal并不是⼀个通⽤的模块，在某些时候它是⼀个不被推荐使⽤的模块，因为使⽤marshal序列化的⼆进制数据格式还没有⽂档化，在不同版本的Python中，marshal的实现可能不⼀样。

也就是说，⽤python2.5序列为⼀个对象，⽤python2.6的程序反序列化所得到的对象，可能与原来的对象是不⼀样的。

但这个模块存在的意义，正如Python⼿册中所说：The marshal module exists mainly to support reading and writing the “pseudo-compiled” code for Python modules of .pyc files.下⾯是marshal模块中定义的⼀些与序列化/反序列化有关的函数：marshal.dump(value, file[, version]) 将值写⼊到⼀个打开的输出流⾥。

参数value表⽰待序列化的值。

file表⽰打开的输出流。

如:以”wb”模式打开的⽂件，sys.stdout或者os.popen。

对于⼀些不⽀持序列类的类型，dump⽅法将抛出ValueError异常。

要特别说明⼀下，并不是所有类型的对象都可以使⽤marshal 模块来序列化/反序列化的。

在python2.6中，⽀持的类型包括：None , integers, long integers, floating point numbers, strings, Unicode objects, tuple, list, set, dict, 和 code objects。

objectdeserializer 用于list数组

objectdeserializer 用于list数组对象反序列化是将二进制或其他格式的数据转换为程序中的对象的过程。

在软件开发中，对象反序列化常用于数据的持久化、数据传输等场景。

本文将讨论对象反序列化的基本概念，以及如何在这一过程中有效地处理List数组。

对象反序列化基本概念1. 什么是对象反序列化？对象反序列化是将序列化的对象数据重新还原为原始的对象的过程。

在序列化过程中，对象被转换为字节流以便于存储或传输。

反序列化则是将这些字节流还原为相应的对象，使得程序能够继续使用这些对象。

2. 序列化与反序列化的作用•数据持久化：序列化对象可以将对象保存到文件或数据库中，以实现数据的长期存储。

•分布式系统：在网络中传输对象时，序列化可将对象转换为字节流，传输后再反序列化还原为对象。

3. 常见的序列化格式•Java中的序列化：Java提供了Serializable接口，可以使用ObjectOutputStream进行对象的序列化，ObjectInputStream进行反序列化。

•JSON序列化：JSON是一种轻量级的数据交换格式，广泛应用于Web开发。

常用的JSON序列化库有Jackson、Gson等。

处理List数组的对象反序列化1. 对象中包含List数组如果对象中包含List数组，需要注意List的实现类必须是Serializable 的。

例如：import java.io.Serializable;import java.util.List;public class MyObject implements Serializable{private List<String>myList;// 省略其他属性和方法}2. 使用Java对象流反序列化List数组import java.io.FileInputStream;import java.io.ObjectInputStream;import java.util.List;public class DeserializationExample {public static void main(String[]args){try(ObjectInputStream ois =new ObjectInputStream(new FileInputStream("serializedObject.dat"))){MyObject myObject =(MyObject)ois.readObject();List<String>myList =myObject.getMyList();// 对List进行进一步处理for(String item :myList){System.out.println(item);}}catch(Exception e){e.printStackTrace();}}}3. 使用JSON库反序列化List数组import com.fasterxml.jackson.databind.ObjectMapper;import java.io.File;import java.util.List;public class JSONDeserializationExample {public static void main(String[]args){try{ObjectMapper objectMapper =new ObjectMapper();MyObject myObject =objectMapper.readValue(new Fil e("serializedObject.json"),MyObject.class);List<String>myList =myObject.getMyList();// 对List进行进一步处理for(String item :myList){System.out.println(item);}}catch(Exception e){e.printStackTrace();}}}注意事项与建议1.List的元素类型需实现Serializable接口：List中的元素类型必须是可序列化的，以确保整个对象图的完整性。

objectdeserializer 反序列化详解

ObjectDeserializer反序列化详解一、引言在当今的数据处理和网络通信中，数据序列化和反序列化已成为一种常见的需求。

序列化是将对象状态转换为字节流的过程，以便于存储或通过网络传输；反序列化则是其逆过程，即将字节流转换回为对象状态。

在这一过程中，ObjectDeserializer起着至关重要的作用。

本篇文章将详细解读ObjectDeserializer 的工作原理及其在反序列化过程中的重要性。

二、ObjectDeserializer详解ObjectDeserializer是一个通用的反序列化类，它负责将字节流还原为原始对象。

在Java中，ObjectInputStream类是实现这一功能的主要类。

当一个对象被序列化后，其状态被转换为字节流，而ObjectDeserializer正是将这个字节流还原回为原始对象。

这个过程通常包括以下步骤：读取字节流中的标记和数据，并将其还原为相应的对象属性和类型。

为了能够实现反序列化，被序列化的对象必须满足以下条件：该对象的类必须具有无参构造方法，以便在反序列化过程中创建新的对象实例；对象的所有属性都必须是可以序列化的，即这些属性值必须实现了Serializable接口。

此外，反序列化过程还需要处理多种可能出现的异常情况，如输入流的异常、类找不到异常等。

三、反序列化过程反序列化过程主要分为以下步骤：首先，读取序列化对象的字节流数据，这一步主要涉及到对字节流的解析和读取；其次，根据字节流中的标记和数据，动态地还原出原始对象的各个属性值，这个过程涉及到Java的类型识别和值转换；最后，通过将对象的所有属性设置为其相应的值，还原出完整的原始对象。

需要注意的是，由于字节流可能包含了旧版本的类结构信息或其他不安全的设置，因此在反序列化过程中需要进行相应的安全校验和过滤。

四、安全性问题在反序列化过程中，安全性是一个不可忽视的问题。

恶意用户可能会通过构造恶意的序列化数据来攻击系统，这种攻击被称为“对象注入攻击”。

objectdeserializer 获取类型

objectdeserializer 获取类型ObjectDeserializer获取类型ObjectDeserializer是一种在Java编程语言中常用的工具，它用于获取某个对象的类型。

通过ObjectDeserializer，我们可以轻松地获取对象的类名、包名、实现的接口等信息。

本文将详细介绍ObjectDeserializer 的用途和使用方法，以帮助读者更好地理解和应用该工具。

一、ObjectDeserializer的定义和作用ObjectDeserializer是一种用于获取对象类型的工具。

它可以通过反射机制获取对象的类名、包名、父类名、实现的接口等信息。

在实际开发中，我们经常需要获取对象的类型信息，以便进行相应的操作，比如序列化和反序列化、对象拷贝、类型判断等等。

二、ObjectDeserializer的使用方法1. 引入ObjectDeserializer在使用ObjectDeserializer之前，我们首先需要在代码中引入相应的包或类，以便能够正常使用该工具。

可以通过以下方式完成引入：```javaimport ng.reflect.Field;import ng.reflect.Method;import ng.reflect.Type;```2. 创建对象并获取类型使用ObjectDeserializer获取对象的类型信息，首先需要创建对象。

可以通过以下方式创建一个示例对象：```javaExampleObject obj = new ExampleObject();```接下来，我们可以使用ObjectDeserializer来获取对象的类型。

可以通过以下方式获取对象的类名：```javaString className = obj.getClass().getName();```获取对象的包名可以使用以下代码：```javaString packageName = obj.getClass().getPackage().getName();```获取对象的父类名可以使用以下代码：```javaString superClassName = obj.getClass().getSuperclass().getName();```获取对象实现的接口可以使用以下代码：```javaClass<?>[] interfaces = obj.getClass().getInterfaces();for(Class<?> i : interfaces) {String interfaceName = i.getName();// 对接口进行处理...}```3. 获取字段和方法的类型信息除了获取对象的类型信息外，ObjectDeserializer还可以帮助我们获取对象的字段和方法的类型信息。

objectdeserializer 获取类型

标题：深度解析：objectdeserializer 获取类型在软件开发中，objectdeserializer 是一个常见的工具，用于将对象的JSON 表示转换为实际的类型。

在本文中，我将深入探讨objectdeserializer 获取类型的方法和相关知识，并共享一些个人观点和理解。

一、objectdeserializer 的基本概念在开始探讨 objectdeserializer 获取类型之前，让我们先来了解一下objectdeserializer 的基本概念。

简而言之，objectdeserializer 是一个用于将 JSON 数据转换为对象的工具，它负责将 JSON 字符串解析为相应的 Java 对象或其他编程语言中的数据结构。

在这个过程中，objectdeserializer 需要获取目标类型的信息，以便正确地进行类型转换。

二、objectdeserializer 获取类型的方法1. 反射机制：在 Java 中，可以使用反射机制来获取类型的信息。

通过Class 对象的相关方法，objectdeserializer 可以获取目标类型的构造函数、字段、方法等信息，从而实现类型的动态解析和转换。

这种方法可以实现较高的灵活性，但可能会引发性能和安全性问题。

2. 注解和泛型：除了反射机制外，objectdeserializer 还可以通过注解和泛型来获取类型信息。

通过在目标类型上添加特定的注解，或者利用泛型的特性，objectdeserializer 可以在解析 JSON 数据时获取到相应的类型信息。

这种方法通常能够提高代码的可读性和可维护性。

3. 配置文件或映射表：有些 objectdeserializer 实现会使用配置文件或映射表来存储类型与 JSON 数据结构之间的映射关系。

通过这种方式，objectdeserializer 可以在运行时根据配置文件或映射表中的信息来获取目标类型，从而实现类型的动态转换。

详解Python序列化Serialize和反序列化Deserialize

详解Python序列化Serialize和反序列化Deserialize详解Python 序列化Serialize 和反序列化Deserialize序列化 (serialization)序列化是将对象状态转换为可保持或传输的格式的过程。

与序列化相对的是反序列化，它将流转换为对象。

这两个过程结合起来，可以轻松地存储和传输数据。

序列化和反序列化的⽬的 1、以某种存储形式使⾃定义对象持久化； 2、将对象从⼀个地⽅传递到另⼀个地⽅。

3、使程序更具维护性序列化由于存在于内存中的对象都是暂时的，⽆法长期驻存，为了把对象的状态保持下来，这时需要把对象写⼊到磁盘或者其他介质中，这个过程就叫做序列化。

反序列化反序列化恰恰是序列化的反向操作，也就是说，把已存在在磁盘或者其他介质中的对象，反序列化（读取）到内存中，以便后续操作，⽽这个过程就叫做反序列化。

概括性来说序列化是指将对象实例的状态存储到存储媒体（磁盘或者其他介质）的过程。

在此过程中，先将对象的公共字段和私有字段以及类的名称（包括类所在的程序集）转换为字节流，然后再把字节流写⼊数据流。

在随后对对象进⾏反序列化时，将创建出与原对象完全相同的副本。

Python中可以使⽤ Pickle 和 json, 以及⾃定义序列化反序列化函数进⾏处理需要序列化的数据。

代码如下：import pickleimport jsond = [1,2,3,4]print(pickle.dumps(d))print(type(pickle.dumps(d)))print(json.dumps(d))print(type(json.dumps(d)))感谢阅读，希望能帮助到⼤家，谢谢⼤家对本站的⽀持，如有疑问请留⾔或者到本站社区交流讨论，⼤家共同进步！。

C#序列化（Serialize）、反序列化（Deserialize）

C#序列化（Serialize）、反序列化（Deserialize）序列化⼜称串⾏化，是.NET运⾏时环境⽤来⽀持⽤户定义类型的流化的机制。

其⽬的是以某种存储形成使⾃定义对象持久化，或者将这种对象从⼀个地⽅传输到另⼀个地⽅。

.NET框架提供了两种串⾏化的⽅式：1、是使⽤BinaryFormatter进⾏串⾏化；2、使⽤SoapFormatter进⾏串⾏化；3、使⽤XmlSerializer 进⾏串⾏化。

第⼀种⽅式提供了⼀个简单的⼆进制数据流以及某些附加的类型信息，⽽第⼆种将数据流格式化为XML存储；第三种其实和第⼆种差不多也是XML的格式存储，只不过⽐第⼆种的XML格式要简化很多(去掉了SOAP特有的额外信息)。

可以使⽤[Serializable]属性将类标志为可序列化的。

如果某个类的元素不想被序列化，1、2可以使⽤[NonSerialized]属性来标志，2、可以使⽤[XmlIgnore]来标志。

⼆进制序列器：对象序列化之后是⼆进制形式的，通过BinaryFormatter类来实现的，这个类位于System.Runtime.Serialization.Formatters.Binary命名空间下[Serializable] //使对象可序列化(必须添加)特性程序集，类，⽅法，属性都可以使⽤特性BinaryFormatter //创建⼆进制序列化器Serialize(Stream(流),object(序列化对象))流：可以理解成打通内存和硬盘的⼀个⼯具输⼊流：从硬盘到内存输出流：从内存到硬盘XML序列化器：对象序列化之后的结果符合SOAP协议，也就是可以通过SOAP?协议传输，通过System.Runtime.Serialization.Formatters.Soap命名空间下的SoapFormatter类来实现的。

SOAP序列化器：对象序列化之后的结果是XML形式的，通过XmlSerializer?类来实现的，这个类位于System.Xml.Serialization命名空间下。

could not serialize reference object

Could not serialize reference object1. IntroductionIn computer programming, serialization refers to the process of converting an object into a format that can be stored or transmitted. This allows the object to be reconstructed later, possibly in adifferent environment. However, there are cases where serialization may fail, resulting in the error message “Could not serialize reference object.” In this article, we will explore the reasons behind this error and discuss possible solutions.2. Understanding SerializationSerialization is an essential concept in many programming languages, including Java, C#, and Python. It enables objects to be converted into a stream of bytes that can be saved to a file, sent over a network, or stored in a database. The reverse process, deserialization, allows the object to be reconstructed from the serialized form.3. Common Causes of “Could not serialize reference object” ErrorWhen encountering the “Could not serialize reference object” error, there are several potential causes to consider:3.1 Circular ReferencesCircular references occur when two or more objects reference each other. During serialization, the serializer may get stuck in an infinite loop trying to serialize the objects. This situation can lead to the “Could not serialize reference object” error.3.2 Unserializable ObjectsSome objects cannot be serialized due to their nature. For example, objects that hold references to non-serializable resources or objects with transient or static fields may cause serialization failures.3.3 Incompatible Serialization VersionsIf the serialized object was created using a different version of the class or assembly, deserialization may fail. This can happen when theobject’s structure or data members have changed between different versions.3.4 Missing Serialization AttributesIn languages that require explicit serialization attributes, such as C# with the [Serializable] attribute, forgetting to mark a class as serializable can result in the “Could not serialize reference object” error.4. Solutions to the ErrorWhen facing the “Could not serialize reference object” error, there are several approaches to resolve the issue:4.1 Handling Circular ReferencesTo handle circular references, one option is to mark certain references as transient or non-serializable. This prevents the serializer from attempting to serialize them, breaking the circular chain. Another approach is to use custom serialization methods that explicitly handle circular references.4.2 Implementing Custom SerializationIn cases where standard serialization is insufficient, implementing custom serialization methods can provide more control over the serialization process. By overriding serialization and deserialization methods, developers can handle complex object graphs or perform additional logic during the process.4.3 Versioning and CompatibilityTo avoid compatibility issues, it is crucial to consider versioning when working with serialized objects. This involves ensuring backward and forward compatibility by carefully managing changes to the object’s structure and data members. Techniques such as version-tolerant serialization or using serialization surrogates can help handle versioning challenges.4.4 Using External Libraries or FormatsIf the default serialization mechanisms provided by the programming language are insufficient, utilizing external libraries or alternative serialization formats may be necessary. For example, JSON or XMLserialization can be used as an alternative to binary serialization in certain scenarios.5. Best Practices for SerializationTo minimize the occurrence of the “Could not serialize reference object” error and ensure smooth serialization, consider the following best practices:5.1 Design Serializable Classes CarefullyWhen designing classes that need to be serialized, consider the implications of serialization from the beginning. Ensure that all necessary fields can be serialized and that any non-serializableresources are properly handled.5.2 Test Serialization and DeserializationRegularly test the serialization and deserialization process to catchany potential issues early on. This can help identify and resolve problems before they become more significant.5.3 Document Serialization RequirementsWhen working in a team or sharing serialized objects across different systems, documenting the serialization requirements and anycompatibility constraints can prevent future errors and misunderstandings.5.4 Keep Serialization Code SimpleAvoid overcomplicating serialization code. Keeping it simple and straightforward reduces the chances of introducing errors and makes maintenance easier.6. ConclusionSerialization is a fundamental concept in programming, allowing objectsto be stored, transmitted, and reconstructed. However, the “Could not serialize reference object” error can occur due to circular references, unserializable objects, compatibility issues, or missing serialization attributes. By understanding the causes and implementing appropriate solutions, developers can overcome this error and ensure successful serialization. Following best practices and considering serializationrequirements from the beginning can further enhance the reliability and maintainability of serialized objects.。

marshal方法

marshal方法marshal方法简介marshal方法是Python中用于序列化和反序列化对象的模块。

它将一个对象转换为字节流，并且可以将字节流还原为原始对象。

方法一：()使用()方法可以将对象序列化为字节流。

•参数：–obj：要序列化的对象。

•返回值：–返回一个字节对象表示序列化的对象。

方法二：()使用()方法可以将字节流反序列化为对象。

•参数：–bytes_object：要反序列化的字节流。

•返回值：–返回原始对象。

方法三：()使用()方法可以将对象序列化后存储到文件中。

•参数：–obj：要序列化的对象。

–file_object：要存储序列化对象的文件对象。

•返回值：–无返回值。

方法四：()使用()方法可以将存储在文件中的序列化对象还原为原始对象。

•参数：–file_object：包含序列化对象的文件对象。

•返回值：–返回原始对象。

注意事项•marshal模块的序列化是基于二进制的，所以不能用于序列化为可读的文本文件。

•marshal方法只能反序列化通过marshal序列化的对象，并且需要保证使用相同版本的Python进行序列化和反序列化。

示例下面是一个简单的示例，演示了如何使用marshal方法进行对象的序列化和反序列化：import marshal# 序列化对象data = [1, 2, 3]serialized_data = (data)# 反序列化对象deserialized_data = (serialized_data)print(deserialized_data) # 输出：[1, 2, 3]结论通过使用marshal方法，我们可以方便地将对象序列化为字节流，并从字节流还原为原始对象。

然而，需要注意的是，marshal方法的序列化是基于二进制的，且在不同版本的Python之间的兼容性可能存在问题，因此在使用前需要进行充分的测试和验证。

marshal方法简介marshal方法是Python中用于序列化和反序列化对象的模块。

Redis使用redis存储对象反序列化异常SerializationFailedExce。。。

Redis使⽤redis存储对象反序列化异常SerializationFailedExce。

案例使⽤Redis进⾏对象存储，在处理业务逻辑的时候，丛Redis获取对象发现反序列化失败，抛出如下异常:Caused by: org.springframework.data.redis.serializer.SerializationException: Cannot deserialize; nested exception is org.springframework.core.serializer.support.SerializationFailedException: Failed to deserialize payload. Is the byte array a result of correspon at org.springframework.data.redis.serializer.JdkSerializationRedisSerializer.deserialize(JdkSerializationRedisSerializer.java:82)at org.springframework.data.redis.core.AbstractOperations.deserializeValue(AbstractOperations.java:318)at org.springframework.data.redis.core.AbstractOperations$ValueDeserializingRedisCallback.doInRedis(AbstractOperations.java:58)at org.springframework.data.redis.core.RedisTemplate.execute(RedisTemplate.java:207)at org.springframework.data.redis.core.RedisTemplate.execute(RedisTemplate.java:169)at org.springframework.data.redis.core.AbstractOperations.execute(AbstractOperations.java:91)at org.springframework.data.redis.core.DefaultValueOperations.get(DefaultValueOperations.java:43)at com.ppmoney.geedai.wechat.service.wechat.impl.GetAccessTokenServiceImpl.get(GetAccessTokenServiceImpl.java:37)at com.ppmoney.geedai.wechat.service.wechat.impl.CustomMsgServiceImpl.send(CustomMsgServiceImpl.java:32)... 82 common frames omittedCaused by: org.springframework.core.serializer.support.SerializationFailedException: Failed to deserialize payload. Is the byte array a result of corresponding serialization for DefaultDeserializer?; nested exception is java.io.InvalidClassException: weixin.popu at org.springframework.core.serializer.support.DeserializingConverter.convert(DeserializingConverter.java:78)at org.springframework.core.serializer.support.DeserializingConverter.convert(DeserializingConverter.java:36)at org.springframework.data.redis.serializer.JdkSerializationRedisSerializer.deserialize(JdkSerializationRedisSerializer.java:80)... 90 common frames omittedCaused by: java.io.InvalidClassException: weixin.popular.bean.token.Token; local class incompatible: stream classdesc serialVersionUID = -584152862903853930, local class serialVersionUID = 8841433872811285796at java.io.ObjectStreamClass.initNonProxy(ObjectStreamClass.java:616)at java.io.ObjectInputStream.readNonProxyDesc(ObjectInputStream.java:1623)at java.io.ObjectInputStream.readClassDesc(ObjectInputStream.java:1518)at java.io.ObjectInputStream.readOrdinaryObject(ObjectInputStream.java:1774)at java.io.ObjectInputStream.readObject0(ObjectInputStream.java:1351)at java.io.ObjectInputStream.readObject(ObjectInputStream.java:371)at org.springframework.core.serializer.DefaultDeserializer.deserialize(DefaultDeserializer.java:70)at org.springframework.core.serializer.support.DeserializingConverter.convert(DeserializingConverter.java:73)... 92 common frames omitted解决⽅案经排查，原因是存放的对象忘了添加序列化号，导致存储的序列化编号和反序列化编号不⼀致，所以反序列化异常。

对象序列化Serialization与Deserialize方法进行反序列化

对象序列化Serialization与Deserialize⽅法进⾏反序列化所谓对象序列化Serialization，是指将对象保存到流Steam中（⼀般是磁盘⽂件数据流，可以使对象“永⽣”），需要时可以从流中重新读取数据重建对象（称为反序列化Deserialization）。

（1）定义被序列化的类，即加上[Serializable]属性。

如[SerializableAttribute]public class Student{string name;public string Name{get { return name; }set { name = value; }}public void SayHi(){Console.WriteLine("Hi,My name is {0}.",Name);}}（2）调⽤BinaryFormatter类的Serialize⽅法进⾏序列化。

如public static void Save(Student s){using (FileStream fileStream = new FileStream("profile.bin", FileMode.Create)){BinaryFormatter bf = new BinaryFormatter();bf.Serialize(fileStream, s);fileStream.Close();}}（3）调⽤BinaryFormatter类的Deserialize⽅法进⾏反序列化。

如public static Student Load(){Student s = new Student();using (FileStream fileStream = new FileStream("profile.bin", FileMode.Open)){BinaryFormatter bf = new BinaryFormatter();s= (Student)bf.Deserialize(fileStream);fileStream.Close();}return s;}（4）需要时可以调⽤上⾯的⽅法，进⾏序列化和反序列化：static void Main(string[] args){Student s = new Student(); = "aa";Save(s);Student otherStudent = Load();otherStudent.SayHi();Console.ReadKey();}在这过程中需要引⽤命名空间：using System.Runtime.Serialization.Formatters.Binary;using System.IO;。

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MPI datatype Java datatype MPI.BYTE byte MPI.CHAR char MPI.SHORT short MPI.BOOLEAN boolean MPI.INT int MPI.LONG long MPI.FLOAT float MPI.DOUBLE double MPI.OBJECT Object Figure 1: Basic datatypes in proposed Java binding 1.2 Related work Early work by the current authors on Java MPI bindings is reported in 2]. A comparable approach to creating full Java MPI interfaces has been taken by Getov and Mintchev 14, 9]. A subset of MPI is implemented in the DOGMA system for Java-based parallel programming 11]. A pure Java implementation of MPI built on top of JPVM has been described in 5]. So far these systems have not attempted to use object serialization for data marshalling. For an extensive discussion of performance issues surrounding object serialization see section 3 of 10] and references therein. The discussion there mainly relates to serialization in the context of fast RMI implementations. The cost of serialization is likely to be an even more critical issue in MPI, because the message-passing paradigm usually has lower overheads. 2 Datatypes in a Java API for MPI The MPI standard is explicitly object-based. The C++ binding speci ed in the MPI 2 standard collects these objects into suitable class hierarchies and de nes most of the library functions as class member functions. The Java API proposed in 4] follows this model, and lifts its class hierarchy directly from the C++ binding. In our Java version a class MPI with only static members acts as a module containing global services, such as initialization of MPI, and many global constants including a default communicator COMM WORLD1. The communicator class Comm is the single most important class in MPI. All communication functions are members of Comm or its subclasses. Another class that is relevant for the discussion below is the Datatype class. This describes the type of the elements in the message bu ers passed to send, receive, and other communication functions. Various basic datatypes are prede ned in the package. These mainly correspond to the primitive types of Java, shown in gure 1. The standard send and receive operations of MPI are members of Comm with interfaces
Object Serialization for halling Data in a Java Interface to MPI
Bryan Carpenter, Geo rey Fox, Sung Hoon Ko and Sang Lim NPAC at Syracuse University Syracuse, NY 13244 fdbc,gcf,shko,slimg@
same type, and they are selected from the elements of a onedimensional Java array passed as the bu er argument. This approach preserves some of the functionality of the original MPI mechanism|for example the ability to describe strided sections of a one dimensional bu er argument, and to represent a subset of elements selected from the bu er argument by an indirection vector. But it does not allow description of bu ers containing elements of mixed primitive types. The derived datatype mechanism is retained in the initial draft of 4], but its usefulness seems to be limited. In the context of Java, a more promising approach may be the addition a new basic datatype to MPI representing a serializable object. The bu er array passed to communication functions is still a one-dimensional array, but as well as allowing arrays with elements of primitive type, the element type is allowed to be Object. The serialization paradigm of Java can be adopted to transparently serialize bu er elements at source and unserialize them at destination. An immediate application is to multidimensional arrays. A Java multidimensional array is an array of arrays, and an array is an object. Therefore a multidimensional array is a one-dimensional array of objects and it can be passed directly as a bu er array. The options for representing sections of such an array are limited, but at least one can communicate whole multidimensional arrays without explicitly copying them (of course there may well be copying inside the implementation). 1.1 Overview of this article. This article discusses our current work on use of object serialization to marshal arguments of MPI communication operations. It builds on earlier work on the mpiJava interface to MPI 1], which is implemented as a set of JNI wrappers to native C MPI packages for various platforms. The original implementation of mpiJava supported MPI derived datatypes, but not object types. Section 2 reviews the parts of the API of 4] relating to derived datatypes and object serialization. Section 3 describes our prototype implementation of automatic object serialiation in mpiJava. In section 4 we describe some benchmarks for this initial implementation. The results imply that naive use of existing Java serialization technology does not provide the performance needed for high performance message passing environments. Possible remedies for this situation are outlined brie y in the nal discussion section.