液晶显示器行业内中英文对照表
液晶行业CF单词全版
英文專有名詞介紹1. General (一般專有名詞)2. Clean Room (潔淨室專有名詞)3. Factory Automation (工廠自動化專有名詞)*註.OPI(Operation POSEIDON Instruction)海神生產作業系統專有名詞介紹6.Cell段製程專有名詞介紹7. 日常使用的英文名詞通用术语Array Line进行Thin Film, Photo, Etch工艺的生产Line是Array Line，主要制造Glass上面TFT (Thin Film Transistor) 结构。
Cell Line进行PI Coating, Rubbing, Filling, Seal/TR印刷工艺等生产Line是Cell Line，主要生产TFT-LCD Cell 状态产品的过程。
Module Line是用TCP (Tape Carrier Package) 将PCB与CELL进行连接，并使用BEZEL进行组装的Ass’y工艺等的生产Line ，是生产TFT Module产品的过程。
LCD Liquid Crystal Display的简称。
用电场、磁场等外部影响,改变液晶分子排列 ,改变液晶分子结构的光学特性后,利用其明暗效果的显示元件.TFT-LCD 在形成FET (Field Effect Transistor)结构的 TFT Glass与Color Filter之间注入液晶而制成的显示元件,使用于Note Book PC、Monitor、中小型TV 等。
Polarizer (POL)偏光片将入射光分为2个直交的偏光，透射其中特定方向的光线,吸收或分散别的光线后,将透射光变为偏振光的高分子FilmBacklight (B/L)为了给 LCD提供光源,在Panel后部组装的发光部件,有EL, LED, CCFL 等。
Color Filter (C/F) 制造Color液晶显示元件时使用的主要原材料,指按一定的顺序排列了Red，Green，Blue像素的薄膜。
LCD专业术语中英文版
LCD专业术语中英文版Backlight:背光。
CCFL(CCFT) (Cold Cathode Fluorescent Light/Tube):冷阴极荧光灯。
Composite vide复合视频。
Component vide分量视频。
COB(Chip On Board):IC裸片通过邦定固定于印刷线路板上。
COF(Chip On Film):将IC封装于柔性线路板上。
COG(Chip On Glass):将IC封装于玻璃上。
CRT(Cathode Radial Tube):阴极射线管。
DPI(Dot Per Inch):点每英寸。
Duty:占空比，高出点亮的阀值电压的局部在一个周期中所占的比率。
DVI(Digital Visual Interface):〔VGA〕数字接口。
ECB(Electrically Controlled Birefringence):电控双折射。
EL(Electro luminescence):电致发光。
EL层由高分子量薄片构成FSTN(Formulated STN):薄膜补偿型STN,用于黑白显示。
HTN(High Twisted Nematic):高扭曲向列的显示类型。
IC(Integrate Circuit):集成电路。
Inverter:逆变器。
ITO(Indium-Tin Oxide):氧化铟锡。
LCD(Liquid Crystal Display):液晶显示器。
LCM(Liquid Crystal Module): 液晶模块。
LED(Light Emitting Diode):发光二极管。
LVDS(Low V oltage Differential Signaling):低压差分信号。
NTSC(National Television Systems Committee):NTSC 制式,全国电视系统委员会制式OSD(On Screen Display):在屏上显示。
LCD 行业英文专有名词
中文說明
Vehicle
運輸工具或載具
AGV (Automatic Guided Vehicle)
自動搬運車
MGV (Manual Guided Vehicle)
人力搬運車
Clean lifter
天井傳送車
LIM (Linear Induction Motor) Carrier
線性感應馬達傳送載具
Edge Exposure
邊緣曝光，指在顯影前將玻璃基板邊緣光阻較厚的部分再曝光，以防曝光量不足，造成光阻在顯影後殘留
Developer
顯影機***註.
Hard bake
硬烤***註.
Etcher
蝕刻機
Wet Etch
濕蝕刻***註.
Dry Etch
乾蝕刻***註.
Plasma
電漿ห้องสมุดไป่ตู้**註.
RIE (Reactive ion etching)
留置在當站製程（如有品質問題時）
Release
將hold住的貨放行,釋出
Equipment
設備（簡稱為EQP）
Tool
工具,機台
WIP (Work In Process)
在製品（製程在製品）
Maintenance
維修保養
Cassette
裝在製品的架子***註.
Empty
空的
Reserve
預約
Report
AMSR (Sheet Resistance)
沈積膜的電阻值測試設備
ATOS (Open/Short Tester)
斷短路測試機
ATTG (TEG Tester or TFT Device Measurement)
液晶电视工厂设置中英文对照
工厂设置中英文对照表英文1、ADC ADJUST 模式R-GAING-GIANB-GIANR-OFFSETG-OFFSETB-OFFSETAUTO ADC2、PICTURE MODE 模式PICTURE MODE BRIGHTNESS CONTRAST SHARPNESSTINT3、W/B ADJUST 模式TEMPERATURE R-GAING-GIANB-GIANR-OFFSETG-OFFSETB-OFFSETCOPY ALL4、SSCMIU EnableMIU SpanMIU StepLVDS Enable中文模数转换校正R 增益校正G 增益校正 B 增益校正R 偏移量校正G 偏移量校正 B 偏移量校正自动校正图像模式图像模式亮度对比度清晰度（锐度）色调白平衡调节色温R 增益校正G 增益校正B 增益校正R 偏移量校正G 偏移量校正B 偏移量校正全部复制展频设置MIU 开MIU 跨度MIU 进度LVDS 开LVDS SpanLVDS Step5、SPECIAL SETNo signal sleepWDTWHITE PATTERN 恢复工厂设置蓝屏设置AGING MODE POWERLVDS AdjustPANEL TYPET1 MODEOE SWAPPw131 lvds adjust6、VIF1VIF1VIF2VIF37、SW INFORMATION VERSIONBUILD TIMEMIUO DQS0MIUO DOS18、UART DEMUG9、OverScan OverScan reslaution OVERSCAN-HPO OVERSCAN-HSIZE OVERSCAN-VPO OVERSCAN-VSIZE 10、NONLINEAR 模式PICTURE MODE Brightness Curve LVDS 跨度LVDS 进度特殊设置无信号睡眠看门狗白板模式老化模式开机状态LVDS 调节面板类型LVDS 模式OE 置换Pw131 lvds 调节VIF 防护软件SW 信息版本制造时间重现率设置重现率设置水平方向上的位置水平方向上的缩放垂直方向上的位置垂直方向上的缩放曲线设置图像模式亮度曲线Contrast Curve Saturation Curve Hue Curve Sharpness CurveVolume Curve11、软件升级（USB）对比度曲线饱和度曲线色度曲线清晰度曲线声音曲线。
液晶显示器行业内中英文对照表
附：缩略语中英文对照表ＡACFﻩﻩＡnisotrｏpic ＣｏnductivｅFiｌmﻩ各向异性导电薄膜ADＣﻩ Analoｇ－Dｉｇｉtal Cｏｎvertｅrﻩﻩﻩﻩ模数转换器ＡESﻩＡｕger Eｌecｔｒon Specｔrometeｒ俄歇电子能谱仪ＡＦＦSﻩ Advａnced FFＳﻩＡFＬC ﻩAnti－Ferroeｌecｔric Lｉquid Cryｓtaｌﻩ反铁电液晶ＡMLＣDﻩＡcｔiｖeＭatｒｉｘLｉquid Ｃrystａl Displaｙﻩﻩ有源矩阵液晶显示器件AMＯＬEDﻩActive Mａtrix Orｇanｉc ＬighｔEmiｔｔｉnｇDiｓplayﻩ有源矩阵有机电致发光二极管AＰCＶD Atｍospheric Preｓsure CheｍicaｌVａｐor Depositｉon常压化学气相沉积AＰＰｌasma ﻩAtmospheriｃPressｕrｅPlasma ﻩ常压等离子清洗AＱK ﻩﻩAqua Kniｆｅﻩﻩﻩﻩﻩ水刀清洗a－SｉﻩＡmorｐhｏus Silicoｎﻩﻩ非晶硅AS—IPS Advancｅd—Ｓupeｒ—In—Plane Switchinｇ超高级面内切换宽视角技术BBCE ﻩﻩBaｃkＣhａnnｅl Etched ﻩﻩﻩﻩ背沟道刻蚀型BEＦﻩBrightnｅss Enhancｅmｅnt Fｉlmﻩﻩﻩ增亮膜BEＷＢlurred Edge width ﻩﻩﻩﻩﻩ边界模糊区域宽度Ｂ/LﻩBａck Lighｔﻩﻩﻩﻩﻩﻩ背光源ＢＭﻩBｌack Matｒix ﻩﻩ黑色矩阵或黑矩阵BS ﻩBａcｋＣhaｎnｅｌＳtop ﻩﻩ背沟道保护型BJ ﻩＢｕbｂle Ｊet ﻩﻩﻩﻩ气泡清洗方法，又被称为ＣJＣCCＤﻩCｈａｒge Cｏupled Dｅvｉcｅﻩﻩ电荷耦合器件CCＦL ﻩＣold Cａthode FｌuorescenｔLaｍp（Light) 冷阴极荧光灯ＣD ﻩCriｔical Ｄimensioｎﻩﻩ显影后或刻蚀后的图形尺寸CF ﻩＣolor Filterﻩﻩ彩色滤光片ＣFI ﻩＣolor FilteｒIｎteｇraｔiｏn ﻩﻩ彩色滤光片集成CIE CommissioｎＩnternatｉonale ｄeｌ'Ｅcｌairage ﻩ国际照明委员会ＣJﻩＣabitation Jeｔﻩﻩﻩﻩﻩ用加了高压的去离子水与空气混合后所产生的大量气泡来去除灰尘的一种清洗方法CＯA Ｃｏｌor Fｉlter on Ａrrａy ﻩﻩﻩ阵列上彩色滤光片COＦﻩﻩChiｐOｎFilｍﻩ薄膜芯片集成COＧChipＯn Glass ﻩﻩﻩﻩ玻璃芯片集成COP ﻩﻩＣycio Olefins Ｐolymeｒﻩﻩﻩ环烯烃聚合物CRT ﻩCａtｈｏde Ｒay Ｔube ﻩﻩﻩ阴极射线管ＣVＤﻩChemicaｌVａｐor Depoｓitioｎﻩﻩ化学气相沉积CSTNﻩColor STＮﻩﻩﻩ彩色超扭曲向列型ＤDＡP Depth AＥＳPｒoｆｉlesﻩﻩﻩﻩ俄歇深度剖面分析Ｄ．C。
液晶行业CF单词全版
英文專有名詞介紹1. General (一般專有名詞)2. Clean Room (潔淨室專有名詞)3. Factory Automation (工廠自動化專有名詞)*註.OPI(Operation POSEIDON Instruction)海神生產作業系統專有名詞介紹6.Cell段製程專有名詞介紹7. 日常使用的英文名詞通用术语Array Line进行Thin Film, Photo, Etch工艺的生产Line是Array Line，主要制造Glass上面TFT (Thin Film Transistor) 结构。
Cell Line进行PI Coating, Rubbing, Filling, Seal/TR印刷工艺等生产Line是Cell Line，主要生产TFT-LCD Cell 状态产品的过程。
Module Line是用TCP (Tape Carrier Package) 将PCB与CELL进行连接，并使用BEZEL进行组装的Ass’y工艺等的生产Line ，是生产TFT Module产品的过程。
LCD Liquid Crystal Display的简称。
用电场、磁场等外部影响,改变液晶分子排列 ,改变液晶分子结构的光学特性后,利用其明暗效果的显示元件.TFT-LCD 在形成FET (Field Effect Transistor)结构的 TFT Glass与Color Filter之间注入液晶而制成的显示元件,使用于Note Book PC、Monitor、中小型TV 等。
Polarizer (POL)偏光片将入射光分为2个直交的偏光，透射其中特定方向的光线,吸收或分散别的光线后,将透射光变为偏振光的高分子FilmBacklight (B/L)为了给 LCD提供光源,在Panel后部组装的发光部件,有EL, LED, CCFL 等。
Color Filter (C/F) 制造Color液晶显示元件时使用的主要原材料,指按一定的顺序排列了Red，Green，Blue像素的薄膜。
LCD专业术语中英文版
LCD专业术语中英文版Backlight:背光。
CCFL(CCFT) (Cold Cathode Fluorescent Light/Tube):冷阴极荧光灯。
Composite vide复合视频。
Component vide分量视频。
COB(Chip On Board):IC裸片通过邦定固定于印刷线路板上。
COF(Chip On Film):将IC封装于柔性线路板上。
COG(Chip On Glass):将IC封装于玻璃上。
CRT(Cathode Radial Tube):阴极射线管。
DPI(Dot Per Inch):点每英寸。
Duty:占空比，高出点亮的阀值电压的部分在一个周期中所占的比率。
DVI(Digital Visual Interface):（VGA）数字接口。
ECB(Electrically Controlled Birefringence):电控双折射。
EL(Electro luminescence):电致发光。
EL层由高分子量薄片构成FSTN(Formulated STN):薄膜补偿型STN,用于黑白显示。
HTN(High Twisted Nematic):高扭曲向列的显示类型。
IC(Integrate Circuit):集成电路。
Inverter:逆变器。
ITO(Indium-Tin Oxide):氧化铟锡。
LCD(Liquid Crystal Display):液晶显示器。
LCM(Liquid Crystal Module): 液晶模块。
LED(Light Emitting Diode):发光二极管。
LVDS(Low Voltage Differential Signaling):低压差分信号。
NTSC(National Television Systems Committee):NTSC制式,全国电视系统委员会制式OSD(On Screen Display):在屏上显示。
液晶电视中英文对照
液晶电视中英文对照术语：英文意义，中文解释LCD：Liquid Crystal Display，液晶显示LCM：Liquid Crystal Module，液晶模块TN：Twisted Nematic，扭曲向列。
液晶分子的扭曲取向偏转90°STN：Super Twisted Nematic，超级扭曲向列。
约180~270°扭曲向列FSTN：Formulated Super Twisted Nematic，格式化超级扭曲向列。
一层光程补偿片加于STN，用于单色显示TFT：Thin Film Transistor，薄膜晶体管Backlight：背光Inverter：逆变器OSD：On Screen Display，在屏上显示DVI：Digital Visual Interface，（VGA）数字接口TMDS：Transition Minimized Differential SignalingLVDS：Low V oltage Differential Signaling，低压差分信号Panelink：－IC：Integrate Circuit，集成电路TCP：Tape Carrier Package，柔性线路板COB：Chip On Board，通过邦定将IC裸片固定于印刷线路板上COF：Chip On FPC，将IC固定于柔性线路板COG：Chip On Glass，将芯片固定于玻璃上Duty：占空比，高出点亮的阀值电压的部分在一个周期中所占的比率LED：Light Emitting Diode，发光二极管EL：Electro Luminescence，电致发光。
EL层由高分子量薄片构成CCFL(CCFT)：Cold Cathode Fluorescent Light/Tube，冷阴极荧光灯PDP：Plasma Display Panel，等离子显示屏CRT：Cathode Radial Tube，阴极射线管VGA：Video Graphic Array，视频图形阵列PCB：Printed Circuit Board，印刷电路板Composite video：复合视频Component video：分量视频S-video：S端子，与复合视频信号比，将对比和颜色分离传输NTSC：National Television Systems Committee，NTSC制式、全国电视系统委员会制式PAL：Phase Alternating Line，PAL制式(逐行倒相制式)SECAM：SEquential Couleur Avec Memoire，SECAM制式(顺序与存储彩色电视系统) VOD：Video On Demand，视频DPI：Dot Per Inch，点每英寸。
LCD专业术语中英文版
LCD专业术语中英文版Backlight:背光。
CCFL(CCFT) (Cold Cathode Fluoresce nt Light/Tube):冷阴极荧光灯。
Composite vide 复合视频。
Comp onent vide 分量视频。
COB(Chip On Board):IC裸片通过邦定固定于印刷线路板上。
COF(Chip On Film):将IC封装于柔性线路板上。
COG(Chip On Glass)将IC封装于玻璃上。
CRT(Cathode Radial Tube)阴极射线管。
DPI(Dot Per In ch):点每英寸。
Duty:占空比，高出点亮的阀值电压的部分在一个周期中所占的比率。
DVI(Digital Visual In terface): (VGA)数字接口。
ECB(Electrically Con trolled Birefri nge nee):电控双折射。
EL(Electro luminescenee)电致发光。
EL层由高分子量薄片构成FSTN(Formulated STN):薄膜补偿型STN,用于黑白显示。
HTN(High Twisted Nematic):高扭曲向列的显示类型。
IC(I ntegrate Circuit):集成电路。
In verter:逆变器。
ITO(Indium-Tin Oxide):氧化铟锡。
LCD(Liquid Crystal Display):液晶显示器。
LCM(Liquid Crystal Module):液晶模块。
LED(Light Emitting Diode):发光二极管。
LVDS(Low Voltage Differential Signaling):低压差分信号。
NTSC(National Television Systems Committee):NTSC制式，全国电视系统委员会制式OSD( On Screen Display)在屏上显示。
TFT_LCD厂中英文用语对照表
Clean booth FEOL (Front End of Line) BEOL (Back End of Line) Scribe (1st scribe，2nd sBcreriabke)(1st break，2nd break) PI Post-bake Rubbing GSerianldPattern，Seal dispense Spacer Sprayer End Seal Alignment Seal Pre-bake Vacuum Anneal Injection Cell Backlight Visual inspection Bezel Driver IC Soldering Assembly Aging Packing Screw TFaPpCe(Flexible Printed CPCabBle(P) rinted Circuit Board) TAB (Tape Automated Bonding) OLB (Outer Lead Bonding) ILB (Inner Lead Bonding) CTCOPG((TCahpiep CoanrGrielarsPsa)ckage ) ACF (Anisotropic Conductive Film)
Al (Aluminum) AlNd (Aluminum and Neodymium Alloy) Reticle or Mask Detergent Note LAL-50 O3 ( Ozone ) NBA (1-butyl Acetate) Resist or Photo Resist HMDS AC-1 TMAH Oxalic Acid (H2C2O4) DHF ITO-Etchant BHF Al-Etchant
TFT-LCD工程中英对照表
沉积
显影
干刻
干刻
清除边缘光刻胶
边缘曝光，指在显影前将玻璃基板边缘光阻较厚的部分再曝光，以防曝光量不足，造成 光阻在显影后残留
简称ER，指在旋转涂布光阻后，用NBA洗净残留在玻璃边缘的光阻
曝光
Technology Management Dept. BOE OT Copyright ⓒ 2008
8
工程名词
Technology Management Dept. BOE OT Copyright ⓒ 2008
3
材料名词
用语
Glass, substrate or glass substrate Glove H2 Hairnet HCl He Hood ILB (Inner Lead Bonding) IPA ( Isopropyl Alcohol) IR (Infra-Red) ITO (Indium Tin Oxide) ITO-Etchant Kr L.G.P: Light Guide Plate LAL-50 Lamp Reflector LED Cover LC (Liquid Crystal) LED: Light Emitting Diode Mask
Company Confidential
用语说明
玻璃基版 手套 氢气，制程气体 网帽 氯化氢，制程气体，蚀刻n+时的电浆源之一 氦气，制程气体，混合在其它制程气体中，共同形成电浆源，使电浆组成分布均匀 头罩 内引线焊接 异丙醇：主要用来作为设备擦拭液，在去光阻制程中亦用来清除玻璃基板上的有机残留 物（如光阻或去光阻液） 红外线 铟锡氧化物 ITO刻蚀液：成份中含盐酸HCl及硝酸HNO3，主要用来蚀刻7PEP中的Poly-ITO 氪气……制程气体，用来轰击溅镀机上的金属靶 导光板:将从光源收到的水平光线进行方向改变，转换成向上端出射 含NH4F与HF，为清洗机用来清洗玻璃表面氧化层的化学溶液 灯反射罩：将从光源发出的光集中导向到导光板的入射面 液晶，既具有液体的流动性，又具有晶体的各向异性，液晶显示元件的主要原材料之一
液晶显示器行业术语中英文版
液晶显示器行业术语中英文版英文缩写：BLU（Back Light Unit）:背光源CCFL/CCFT (Cold Cathode Fluorescent Light/Tube):冷阴极荧光灯Composite vide:复合视频Component vide:分量视频COB(Chip On Board):IC裸片通过邦定固定于印刷线路板上COF(Chip On Film):将IC封装于柔性线路板上COG(Chip On Glass):将IC封装于玻璃上CRT(Cathode Radial Tube):阴极射线管DPI(Dot Per Inch):点每英寸Duty:占空比，高出点亮的阀值电压的部分在一个周期中所占的比率DVI(Digital Visual Interface):（VGA）数字接口ECB(Electrically Controlled Birefringence):电控双折射EL(Electro luminescence):电致发光，EL层由高分子量薄片构成FSTN(Formulated STN):薄膜补偿型STN,用于黑白显示HTN(High Twisted Nematic):高扭曲向列的显示类型IC(Integrate Circuit):集成电路Inverter:逆变器ITO(Indium-Tin Oxide):氧化铟锡LCD(Liquid Crystal Display):液晶显示器LCM(Liquid Crystal Module): 液晶模块LED(Light Emitting Diode):发光二极管LVDS(Low Voltage Differential Signaling):低压差分信号NTSC(National Television Systems Committee):NTSC制式,全国电视系统委员会制式OSD(On Screen Display):在屏上显示PAL(Phase Alternating Line)AL制式(逐行倒相制式)PCB(Print Circuit Board):印刷线路板PDP(Plasma Display Panel):等离子体显示SECAM(SE quential Couleur Avec Memoire):SECAM制式(顺序与存储彩色电视系统)STN(Supper Twisted Nematic):超扭曲向列的显示类型S-videS端子，与复合视频信号比，将对比和颜色分离传输TAB(Tape Automated Bonding):柔性带自动连接TCP(Tape Carrier Package):柔性线路板TFT(Thin Film Transistor):薄膜晶体管显示类型TN(Twisted Nematic):扭曲向列的显示类型VFD(Vacuum Fluorescence Display):真空荧光显示VGA(Video Graphic Array):视频图形阵列VOD(Video On Demand):视频点播专有名词：有效显示区域( Active Area) ：LCD Panel 的有效显示区域，即可显示文字图形的总面积，图示一般为白色区域即此片Panel 的有效显示区域开口率(Aperture Ratio) ：开口率即是每个画素可透光的有效区域除以画素的总面积，开口率越高，整体画面越亮画面比率(Aspect Ratio) ：Aspect Ratio为画面宽与高之比率。
液晶显示常用中英对照表
EngineeringPE TE IE EE CE零 OPM Operation Project Management 理DCC料New Project( )T/R P/RCR Comercial Release DR PI PO L/T 理 LPREPR PPR MP量 MPR量 Engineering Change ( 更)EN ECR更 ECN更臨 更 ECO更 令MN/FN 更 PCN更 CRB更ME DCN更Engineering Product( )LCD FDSPECLEDSoftware( )DDC 數EEPROM 讀ROM 讀RAMCPU 理OSDSafety( )EMIEMCESDDPMS 理HI-POTVESAVGA省Performances( )鈴CG率EngineeringBrightness(亮度)度度W/BGeometric Distrotion( ) 行 度 SPin, barrelOthers( )SYNC率 x 亮老 QualityQC QEIQC VQA IPQC 量 OQA OQC OOBQRE DQE RMA CSTQM量 理R/D R/DCECQA 料 量TM Quality Vendor/Supplier( )IQC 料 VQAAQLDMR 料Visual Mechanical Inspection AVL Approval Vendor ListQVL Qualified Vendor ListVQM Vendor Quality Management 量 理5R Right (Quality/Price/Quantity/Time/Place) RLOTFactory( )IPQC In Precess Quality Control 量SPC Statistic Process ControlFQC Final Qualit ControlFAI First Article InspctionMQA Manufacturing Quality Assurance 量QCC Quality Control CycleEAR Engineering Analysis RequestCAR Corrective Action Request4M1E Man / Machine / Material / Method/Event4M1ES/T Short TermL/T Long TermFMEA Failure Mode & Effective Action不良 &8D8 Discipline8 錄ORT On-going Reliability Test 度MTBF Mean Time Between Failure 率5S 理/ / 理/ / /Open Box AuditLife Test T/C Temperature Cycle 度H/T High Temperature TestL/T Low Temperature Test Quality Customer( )CS Customer ServiceCustomer FeedbackCustomer ComplaintPLT Pre-life TestELT Early life TestOthers( )PPM Percentage Per MillonDPPM Defective Percentage Per Millon 不良數TTL Total Production MFG SMD 零 SMTPDPCBAAI Auto InsertionMI Manual InsertionManufacturing( )W/S Wave SloderingT/U Touch UpSoldering Iron烙ICT In Circuit Test 路F/T Functional TestGlue ASS'Y AssemblyITC Integrated Tube Component CRT DYVoltage AdjustHigh Voltage Adjust W/B White BalanceCG ConvergenceCAA Computer Auto AdjustFQA Final Quality AssurancePacking Production Line Efficiency( 率)Line Balance B/N Bottle NeckDL Direct LaborIDL Indirect LaborDirect Labor HourPPH Pieces Per Hour 數CP Capacity Process 力DT Machine Down TimeOthers( )W/I Work InstructionSOP Standard Operation ProcedureWPS Work Procedure SheetOS Operation StandardWIP Waitting In ProcessCKD Completed Kits DeliverySKD Semi Kits Delivery Logistic PURPMC ( ) (料) (理) MCPCMaterial( 料)BOM Bill Of Material 料Raw Material 料P/N Part Number料PCB Printed Circuit Board 路CRT Cathode Ray TubeDY DynamicFBT Fly Back TransformerLOT Linearity Output TransformerIC Integrated Circuit 路Purchasing( )PUR PurchasingPR Purchasing RequestPO Purchasing Order Logistic Import/Export( )HAWB House Air Way BillTwenty Foot Equipment Unit(Container)Forty Foot Equipment Unit(Container) CY Container YardTHC Terminal Handling ChargeORC Original Receiving ChargeCIF Cost Insurance Freight + +Others( )MPS Mass Production Schedule量Finished Goods Inventory UTS Units To StockCost Reduction Program降 INV InventoryProduction Shipping Inventory JIT Just In TimeOpen AccountSafty Inventory 量W/H WarehouseReceiving Center 料 F/G Finished Goods InventorySI Shipping INSTRUCTION 令PL Packing LISTI/V InvoiceETD Estimate Time of Departure 離ETA Estimate Time of ArriveB/L Bill Of Landing ( )AWB Air Way Bill ( )MAWB Master Air Way Bill Administration VP 理 理Mg'r 理HR 力FINEDPED Plant Engineering DivisionMIS 理Finance & Accounting( )FIN FinanceP/L Profit & LosePV Performance Variance 異3 Element Of Cost = M, L, OM Material 料L Labor 力O/H OverheadFix Overhead 理Variable Overhead不 理Standard Production Cost AR Account ReceivableAP Account PayableMIS( 理 )MIS Managiment Information System 理IT Information TechnologySAP System Application PlanningERP Enterprise Resource ProgrammingMRP Material Requisition Plan 料ADM Administration DeptADG Advanced Design GroupAQA Application Quality AssuranceAUT Automation DeptBU-Monitors Business Units-MonitorsCI&IP Control Item & Improvement PlanCQT Component Quality & Technology DeptCWQI Company Wide Quality ImprovementCAD Computer Aided DesignCR Commercial ReleaseCRT Cathode Ray TubeCS Concept StartDEV DevelopmentDOR Document Of Representation(for business control)DU Deflection UnitDFA Design For AssemblyDQA Design Quality AssuranceDQE Design Quality EvaluationEHT Electrical High TensionERD Employee Relation DeskFBT FlyBack TransformerFCR Field Call RateFOS Front Of ScreenHRM Human Resource ManagementICC International Center Of CompetenceID Idea(It is a suggestion system)IS International SupportIR Industrial ReleaseLMD Logistics Management DeptLAN Local Area NetworkM.D.P.Marketing Development Production(Business Team)MPR Mass Production ReleaseMQA Manufacturing Quality AssuranceMQFS Material Quality Feedback SheetMED Manufacturing Engineering DeptMgt ManagementMD Management DevelopmentN.O.National OrganizationOED Organization & Efficiency DeptOEM Original Equipment ManufacturingOQC Outgoing Quality Control DeptPED Plant Engineering DeptPCP Product Oriented ProjectPRP Product Realization ProcessPRS Product Range StartPQA-90Philips Quality Award of 1990sPus Production UnitsQCC Quality Control Circle(In PEI-CE, it is called CSM)QFD Quality Function DeploymentQAA Quality Assurance ActivitiesQAPS Quality Assurance Process SheetQBR Quarterly Business ReviewQDS Quality Description SheetQFD Quality Function DeploymentQIS Quality Information SystemTDD Technology Development DeptTPM Total Preventive MaintenanceTQA Total Quality AaauranceVDP Video Display ProductVQA Vendor Quality AssuranceVSM Voluntary Study MeetingWWC-A/P Wire Wind Component - Asia Pacific。
液晶显示行业英文专有名词 80413
3. Factory Automation (工廠自動化專有名詞)
英文專有名詞 Vehicle AGV (Automatic Guided Vehicle)
中文說明 運輸工具或載具 自動搬運車
2
MGV (Manual Guided Vehicle) Clean lifter LIM (Linear Induction Motor) Carrier OHS (Overhead Shuttle) Stocker (clean depot) Battery Bay Bumper Charger Controller Conveyor Crane FFU (Fan Filter Unit) Host I/O (Input / Output) Inter-bay Intra-bay IR (Infra-Red) IRIF(Infra-Red InterFace) Load Unload Magnetic tape POSEIDON Retrieve RTM (Rotary Transfer Machine) SCARA arm Reset Transportation
Monitor Pixel XGA: eXtended Graphics Array=1024*768Pixels SXGA: Super XGA=1280*1024Pixels Computer Notebook RGB (Red, Green, Blue) PM (Preventive Maintenance) Quality Standard Material Yield CIM (Computer Integration Manufacturing) FA (Factory Automation) Exit Precaution Warning Emergency Alarm
液晶显示器行业术语中英文版
液晶显示器行业术语中英文版英文缩写：BLU（Back Light Unit）:背光源CCFL/CCFT (Cold Cathode Fluorescent Light/Tube):冷阴极荧光灯Composite vide:复合视频Component vide:分量视频COB(Chip On Board):IC裸片通过邦定固定于印刷线路板上COF(Chip On Film):将IC封装于柔性线路板上COG(Chip On Glass):将IC封装于玻璃上CRT(Cathode Radial Tube):阴极射线管DPI(Dot Per Inch):点每英寸Duty:占空比，高出点亮的阀值电压的部分在一个周期中所占的比率DVI(Digital Visual Interface):（VGA）数字接口ECB(Electrically Controlled Birefringence):电控双折射EL(Electro luminescence):电致发光，EL层由高分子量薄片构成FSTN(Formulated STN):薄膜补偿型STN,用于黑白显示HTN(High Twisted Nematic):高扭曲向列的显示类型IC(Integrate Circuit):集成电路Inverter:逆变器ITO(Indium-Tin Oxide):氧化铟锡LCD(Liquid Crystal Display):液晶显示器LCM(Liquid Crystal Module): 液晶模块LED(Light Emitting Diode):发光二极管LVDS(Low Voltage Differential Signaling):低压差分信号NTSC(National Television Systems Committee):NTSC制式,全国电视系统委员会制式OSD(On Screen Display):在屏上显示PAL(Phase Alternating Line)AL制式(逐行倒相制式)PCB(Print Circuit Board):印刷线路板PDP(Plasma Display Panel):等离子体显示SECAM(SE quential Couleur Avec Memoire):SECAM制式(顺序与存储彩色电视系统)STN(Supper Twisted Nematic):超扭曲向列的显示类型S-videS端子，与复合视频信号比，将对比和颜色分离传输TAB(Tape Automated Bonding):柔性带自动连接TCP(Tape Carrier Package):柔性线路板TFT(Thin Film Transistor):薄膜晶体管显示类型TN(Twisted Nematic):扭曲向列的显示类型VFD(Vacuum Fluorescence Display):真空荧光显示VGA(Video Graphic Array):视频图形阵列VOD(Video On Demand):视频点播专有名词：有效显示区域( Active Area) ：LCD Panel 的有效显示区域，即可显示文字图形的总面积，图示一般为白色区域即此片Panel 的有效显示区域开口率(Aperture Ratio) ：开口率即是每个画素可透光的有效区域除以画素的总面积，开口率越高，整体画面越亮画面比率(Aspect Ratio) ：Aspect Ratio为画面宽与高之比率。
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附：缩略语中英文对照表AACF Anisotropic Conductive Film 各向异性导电薄膜ADC Analog-Digital Converter 模数转换器AES Auger Electron Spectrometer 俄歇电子能谱仪AFFS Advanced FFSAFLC Anti-Ferroelectric Liquid Crystal 反铁电液晶AMLCD Active Matrix Liquid Crystal Display 有源矩阵液晶显示器件AMOLED Active Matrix Organic Light Emitting Display 有源矩阵有机电致发光二极管APCVD Atmospheric Pressure Chemical Vapor Deposition常压化学气相沉积AP Plasma Atmospheric Pressure Plasma 常压等离子清洗AQK Aqua Knife 水刀清洗a-Si Amorphous Silicon 非晶硅AS-IPS Advanced-Super-In-Plane Switching 超高级面内切换宽视角技术BBCE Back Channel Etched 背沟道刻蚀型BEF Brightness Enhancement Film 增亮膜BEW Blurred Edge width 边界模糊区域宽度B/L Back Light 背光源BM Black Matrix 黑色矩阵或黑矩阵BS Back Channel Stop 背沟道保护型BJ Bubble Jet 气泡清洗方法,又被称为CJCCCD Charge Coupled Device 电荷耦合器件CCFL Cold Cathode Fluorescent Lamp（Light）冷阴极荧光灯CD Critical Dimension 显影后或刻蚀后的图形尺寸CF Color Filter 彩色滤光片CFI Color Filter Integration 彩色滤光片集成CIE Commission Internationale de l'Eclairage 国际照明委员会CJ Cabitation Jet 用加了高压的去离子水与空气混合后所产生的大量气泡来去除灰尘的一种清洗方法COA Color Filter on Array 阵列上彩色滤光片COF Chip On Film 薄膜芯片集成COG Chip On Glass 玻璃芯片集成COP Cycio Olefins Polymer 环烯烃聚合物CRT Cathode Ray Tube 阴极射线管CVD Chemical Vapor Deposition 化学气相沉积CSTN Color STN 彩色超扭曲向列型DDAP Depth AES Profiles 俄歇深度剖面分析D.C. Direct Current 直流DICD Development Inspection CD 显影后光刻胶之间的间距DI water Deionized water 去离子水DLDS Dynamical Low Discrepancy Sequences 网点图案生成方法DLP Digital Light Processing 数字光处理器DMD Digital Micromirror Device 数字微镜装置DRCR Contrast Ratio in Dark Room 暗室对比度EECR Electron Cyclotron Resonance电子回旋共振刻蚀EMI Electro Magnetic Interference 电磁干扰EML Emission layer 发光层EPD End Point Detection 刻蚀结束点的测量EPD Electronic Paper Display 电子纸张显示器件ESR Enhanced Specular Reflector 光学增强反射膜ETL Electron transport layer 电子传输层FFED Field Emitting Display 场致发射显示器FFD Feed Forward Drive 过驱动FFL Flat Fluorescent Lamp 平面荧光灯FFS Fringe Field Switching 边缘场转换宽视角技术FICD Final Inspection CD 刻蚀完成后被刻物质外观图形间距测试得到的尺寸FLC Ferroelectric Liquid Crystal 铁电液晶FPDM Flat Panel Display Measurements 平板显示测量方法FSC Field-Sequential Color 场序彩色GHHTL Hole transport layer 空穴传输层HTPS High Temperate Polycrystal Silicon 高温多晶硅IIC Integrate Circuit 集成电路ICM Illumination and Color Management 照明色彩管理IEC International Electrical Commission 国际电工委员会ILB Inner Lead Bonding 内引线焊接IPS In-Plane Switching 面内切换宽视角技术IR Infrared Ray 远红外线IS Inverted Staggered 反交叠结构ISO International Organization for Standardization 国际标准化组织ITO Indium Tin Oxide 锡掺杂氧化铟薄膜JKLLCOS Liquid Crystal On Silicon 硅基液晶（液晶反射式）LCD Liquid Crystal Display 液晶显示器LDD Lightly Doped Drain 微掺杂沟道型LDS Low Discrepancy Sequences 超均匀分布列理论LED Light Emitting Diode 发光二极管LGP Light Guide Plate 导光板LMD Light Measurement Device 光学测试仪器LPCVD Low Pressure Chemical Vapor Deposition 低压化学气相沉积LP-MBE Low Pressure Molecular Beam Epitaxy 低压分子束外延LRCR Contrast Ratio in Lighted Room 亮室对比度LTPS Low Temperate Polycrystal Silicon 低温多晶硅LVDS low V oltage Differential Signaling 低压差分信号MMCU Micro Control Unit 微控制单元MOS-FET Metal Oxide Silicon–Field Effect Transistor 金属-氧化物-硅场效应晶体管MPRT Moving Picture Response Time 运动图象响应速度MS Mega Sonic MHz的超声波清洗方法MV A Multi-domain Vertical Alignment 多畴垂直取向NNB Notebook 笔记本电脑NS Normal Staggered 正交叠结构NTSC National Television System Committee 国际电视系统委员会OOCB Optical Compensated Bending 光学补偿弯曲宽视角技术ODF One Drop Filling 液晶滴注OLB Outer Lead Bonding 外部引线连接OLED Organic Light Emitting Display 有机电致发光二极管OSD On Screen Display 屏幕菜单式调节PPAD 焊接衬垫PCB Print Circuit Board 印刷电路板PDA Personal Digital Assistant 个人数字处理机PDP Plasma Display Panel 等离子体显示屏PE Plasma Etching 等离子体刻蚀PECVD Plasma Enhanced Chemical Vapor Deposition 等离子体增强化学气相沉积PEP Photo Engraving Process 光刻工艺PI Polyimide 聚酰亚胺取向层PLED Polymer Light Emitting Diode 高分子有机电致发光显示器PMMA Polymethyl Methacrylate 聚甲基丙烯酸甲酯POL Polarizer 偏振片PR Photo Resist 光刻胶p-Si Polycrystal Silicon(Polysilicon) 多晶硅PV A Patterned Vertical Alignment 垂直取向构型PVA Polyvinyl Alcohol 聚乙烯醇PWM Pulse width modulation 脉冲宽度调制QQVGA Quarter Video Graphics Array 1/4视频圆形阵列（240×320象素)RRB Roll BRUSH 辊刷RF Radio Frequency 射频RF Power Radio Frequency Power 射频功率RGB Red Green Blue 红绿蓝RIE Reactive Ion Etching 反应离子刻蚀SSEM Scanning Electron Microscope 扫描电子显微镜SEMI Semiconductor Equipment and Materials International 国际半导体设备与材料协会SID Society for Information Display 信息显示协会S-IPS Super- In-Plane Switching 超级面内切换宽视角技术SMD Surface Mounted Device 表面贴装器件SOC System On Chip 芯片上系统SOG System On Glass 玻璃上系统SOP System On Panel 屏上系统SPC Solid Phase Crystallization 固相晶化法SPWG Standard Panel Working Group 屏标准化工作组SSFLC Surface Stabilized Ferroelectric Liquid Crystal 表面稳定化双稳态模式STN Super Twisted Nematic 超扭曲向列型SW Shower 喷淋清洗TTAB Tape Automated Bonding 带载自动连接TAC Triacetyl Cellulose 三醋酸纤维素TCON Timing Controller 时序控制器TCP Tape Carrier Package 带载封装TEM Transmission Electron Microscope 透射电子显微镜TFT-LCD Thin Film Transistor Liquid Crystal Display 薄膜晶体管液晶显示器TMDS Transition Minimized Differential Signaling 最小化传输差分信号TN Twisted Nematic 扭曲向列型UUS UltraSonic 超声波清洗UV UltraViolet lamp 紫外灯清洗VV A Vertical Alignment 垂直取向VESA Video Electronics Standards Association 视频电子标准协会WWB Wire Bonding 线连接XXPS X-ray Photoelectron Spectrom X射线光电子能谱分析YZ工业常用的英文缩写品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数媵CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号藊L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material Size XsLMC Least Material ConditionLMS Least Material Size UmLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable11 / 1111 / 11。