AOT LED 3014规格书

APPROVAL SHEETAOT MODEL NAME 3014FAOT PART NUMBER 3014C-W3M6CUSTOMER NAME CMIDATE 2011/MarchVERSION 1MAKER CUSTOMERPrepared Checked ApprovedAOT HeadquartersNo. 13, Gongye 5th. Road, Hsinchu Industrial Park, Hukou Shiang,Hsinchu Hsien 303, Taiwan, R.O.C.TEL: +886-3-597-6988 / FAX: +886-3-598-7392Revision NoteDate Revision Page Version2011-03-08 Initiate Document 15 1Package OutlineType Number: 3014C-W3M6Unit: mm, Tolerance: ± 0.2 mmItem MaterialsPackage Heat-Resistant PolymerEncapsulating Material Silicone ( with phosphor )Electrode Ag Plating Copper Alloy•Single blue chip.•High brightness SMD.•Compact package outline (LxWxH) of 3.0 mm x 1.4 mm x 0.52 mm.•Compatible with reflow soldering.•Complies with RoHS Directive.Optical/Electronic Characteristics (Ta=25°C)Item Symbol Condition Value Unit Forward Voltage V F I F = 60 mA 2.8 ~ 3.4 V Luminous Flux φV I F =60mA 14 ~ 18.5 lm Reverse Current I R V R=5V≦2.0µA* V F measurement allowance is ±0.05V* Dominant wavelength measurement allowance is ±1nm* Luminous flux is NIST reading. Luminous flux tolerance: ±10%Absolute Maximum Ratings (Ta=25°C)Item Symbol Maximum Value Unit Forward Current I60 mAFPeak Pulse Forward Current; (1kHz,1/10 duty cycle) I100 mAFPReverse Voltage. V5 VRLED Junction Temperature. T j120 °C Operating Temperature. T-30 ~ +85 °CoprStorage Temperature. T-40 ~ +85 °CstgPower Dissipation P204 mWDSoldering Temperature TReflow Soldering 260℃,10secsldGroup Definition of Forward VoltageGroup Definition of BrightnessRank Condition φv(lm) Rank X2075 17.75 ~ 18.50 Rank X2000 17.00 ~ 17.75 Rank X1925 16.25 ~ 17.00 Rank X1850 15.50 ~ 16.25 Rank X1775 14.75~ 15.50 Rank X1700 T a =25oC I F =60mA14.0 ~ 14.7540mA and 60mA Table of Brightness and CIE40mA60mA φv(lm) CIE-x CIE-y φv(lm) CIE-x CIE-y IvxyIv * 1.37x-0.002y-0.002*A shipment shall consist of the LEDs of a combination of different ranks of luminous flux,wavelength and forward voltage. The percentage of each rank in the shipment shall be determined by AOT *The ranking information of LEDs can be found on the reel label.Rank Condition V F (V) L1 2.8 ~ 3.1 L2T a =25oC I F =60mA3.1~3.4Group Definition of Chromaticity CoordinateChromaticity coordinate groups are measured with an accuracy of ±0.01.Optical/Electronic CharacteristicsForward Voltage vs. Forward Current (Ta=25℃)Forward Current vs. Relative Luminous Flux (Ta=25℃)Ambient Temperature vs. Forward Voltage (I FP =60mA)Ambient Temperature vs. Relative Luminous Flux (I FP =60mA)Forward Current vs. Chromaticity Coordinate (Ta=25℃) Ambient Temperature vs. Chromaticity Coordinate (I FP=60mA)Spectrum Radiation PatternSurface Mounting ConditionIn automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices.Soldering Reflow-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering.-In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices.-AOT cannot guarantee the LEDs after they have been assembled using the solder dipping method. 1) Lead Solder2) Lead-free Solder3) Manual Soldering Conditions- Lead SolderMax. 300 o C for Max. 3sec, and only one time.- Lead-free SolderMax. 350 o C for Max. 3sec, and only one time.- There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method.- After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not.- Reflow soldering should not be done more than two times.Taping and Orientation Quantity: 2,500 pcs/reelItem Spec. Tolerance(mm) Item Spec. Tolerance(mm) W 8.00 ±0.10 P2 2.00 ±0.05E 1.75 ±0.10 t 0.25 ±0.02F 3.50 ±0.05 A0 1.53 ±0.10D0 1.50 +0.10 B0 3.20 ±0.10D10.72 ±0.10 K00.72 ±0.10P0 4.00 ±0.10Packing FormationPackage Outlook302 26725 Metal Bag/1 Carton 62,500 pcs/ 1CartonAntistatic Shielding Metal Bag 1 Reel / Bag Diameter : 178 mm Width : 8 mm 2,500 pcs/Reel Antistatic Reel +5g drying agentLBin(Vf/Iv/CIE) ：Vendor PN ：3014C-W3M6 SN ：a : Customer part numberb : Forward voltage rangec : brightness ranged : CIE range e : min Vf f : max Vfg : min Ivh : max Ivnn : quantity of LEDAYMDxxxx –xxxx : A: AOT, Y: year, M: month, D: day, xxxx-xxx : serial No. SYMDxxxx: S: AOT factory , Y: year, M: month, D: day, xxxx : serial NoPN ： aLot No ：AYMDxxxx -xxx:Qty ：nn EABin(Vf/Iv/CIE) ：b-c-dVendor PN ：3014C-W3M5SN ：SYMDxxxxNo.Test Item Standard Test TestNote Number of1 Steady State Operating Life Internal Ref. I F =20 mATa=25 oC 168 hr 0/20 2 Thermal ShockJESD22-A106-A -40 oC ~ 85 oC Hold 30 min 84 cycles 0/20 3 High TemperatureStorage JESD22-A103-A Ta=125 oC 168 hr 0/20 4 Low TemperatureStorage Internal Ref. Ta=-40 o C 168 hr 0/20 5 High Temperature High Humidity JESD22-A101-B Ta=85 o C RH=85% 168 hr 0/20 6On-Off TestInternal Ref.2 sec ON - 2sec OFF100,000 cycles0/20Criteria for Judging Damage* U.S.L: Upper Standard Level * L.S.L: Lower Standard LevelCriteria for Judgment Item Symbol Test ConditionsMin. Max. Forward Voltage V F I F =140mA - *U.S.L×1.1 Reverse Current I R V R =5V - *U.S.L×2.0 Luminous FluxφVI F =140mA*L.S.L×0.7 -Cautions1. Storage ConditionsBefore opening the package:℃within a The LEDs should be kept at 30 or less and 90%RH or less. The LEDs should be usedyear. When storing the LEDs, moisture proof packaging with absorbent material is recommended.After opening the package:℃ be soldered within The LEDs should be kept at 30 or less and 70%RH or less. The LEDs should168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material.It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.If the moisture absorbent material has faded away or the LEDs have exceeded the storage time , baking treatment should be performed using the following conditions.℃Baking treatment : more than 24 hours at 65 ± 5 .AOT LED electrodes are gold plated. The gold surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations; it is recommended that the User use the LEDs as soon as possible.2. Please avoid rapid transitions in ambient temperature especially in high humidity environmentwhere condensation can occur.3. Heat generation must be taken into design consideration when using the LED.4. Power must be applied resistors for protection, over current would be caused the optic damage tothe devices and wavelength shift.5. Manual tip solder may damage to Chips. It is advised that heat of iron should be lower than 15Wwith temperature control less than 5 seconds at 230-260 deg. C. (The device would be damaged in reworking process if overheat overtime.)6. All equipment and machinery must be properly grounded. It is recommended to use a wristband oranti-electrostatic glove when handling the LED.7. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package andthe silicon, Ultrasonic cleaning should not be done.8. Damaged LED will show unusual characteristics such as remarkably high leaking current, turn-onvoltage becomes lower and the LED gets unlighted at low current.NOTE.All the information published is considered to be reliable. However, AOT does not assume any liability arising out of the application or use of any product described herein.AOT reserves the right to make changes at any time without notice to any products in order to improve reliability, function or design.AOT products are not authorized for use as critical components in life support devices or systems without the express written approval from the managing director of AOT.。