IGBT导热硅脂的涂抹及表面粗糙度要求
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Thermal grease for Infineon modules
What should be the behavior and how a grease has to look like
Baginski
IFAG AIM PMD ID AE
Infineon modules with baseplate: Roughness of baseplate
R Zmax. = 16 µm;R Ztyp. = 4 – 6 µm
Infineon modules without baseplate: Roughness of ceramic
R Zmax.= 9 µm; R Ztyp. = 3 – 4 µm
Heatsink: Specification of roughness regarding Application Note Modules with and without baseplate: R Zmax.= 10 µm
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be
Example of roughness of baseplate and heatsink
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain
functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be
Thermal conductivity:
Copper: λ ≈ 390 W / mK
Aluminium: λ ≈ 237 W / mK
Thermal compound: λ ≈ 1 W / mK
Copper
=> Thermal barrier
TIM
Aluminium
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be
R th CH metall << R th CH thermal grease mK/W << 1 mK/W << R th CH air << 42 mK/W
=> Metal to Metal contact essential
=> Thermal grease that fills only the gapes is prefered
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be
Thermal grease consists of different components
Oily parts
Only needed to adjust the viscosity of the grease
Thermal conducting parts
Necessary to conduct baseplate and heatsink together
The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain
functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be