IGBT导热硅脂的涂抹及表面粗糙度要求内容

Thermal grease for Infineon modules

What should be the behavior and how a grease has to look like

Baginski

IFAG AIM PMD ID AE

Infineon modules with baseplate: Roughness of baseplate

R Zmax. = 16 µm;R Ztyp. = 4 – 6 µm

Infineon modules without baseplate: Roughness of ceramic

R Zmax. = 9 µm; R Ztyp. = 3 – 4 µm

Heatsink: Specification of roughness regarding Application Note Modules with and without baseplate: R Zmax. = 10 µm

The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be

Example of roughness of baseplate and heatsink

The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain

functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be

Thermal conductivity:

Copper: λ ≈ 390 W / mK

Aluminium: λ ≈ 237 W / mK

Thermal compound: λ ≈ 1 W / mK

Copper

=> Thermal barrier

TIM

Aluminium

The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be

R th CH metall << R th CH thermal grease 0.004 mK/W << 1 mK/W << R th CH air << 42 mK/W

=> Metal to Metal contact essential

=> Thermal grease that fills only the gapes is prefered

The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be

Thermal grease consists of different components

Oily parts

Only needed to adjust the viscosity of the grease

Thermal conducting parts

Necessary to conduct baseplate and heatsink together

The information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain

functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be