封装工艺流程简介(英文版)
封装工艺流程简介 (3)
设备:
封装工艺流程简介
Tape and reel 编带
设备:
描述:
使用卷带包装设备，将单 颗产品用编带材料（卷带+盖 带）进行打卷包装。
封装工艺流程简介
Packing 包装
描述:
通过捆绑/包装以确 保产品在操作,运输的过 程中不受湿气, ESD的侵 袭,同时也确保产品在运 输过程中不受损伤。
封装工艺流程简介
2016-Jan-1
封装工艺流程简介
FOL
IQA SMT Pre-bake
基板收取Βιβλιοθήκη 来料检验IQA表面贴装* 可选 基板烘烤
Taping BG W/M
De-tape
D/S
2/O Fail
QA Pass
DA
DAC
Plasma
圆片收取 来料检验 贴保护膜 背部研磨 圆片装载 去掉保护膜
芯片切割 第二次光学检查
封装工艺流程简介
Baking 烘烤
描述:
PCB需要在做DA之 前做一下烘烤，以去 除PCB中的水分，提高 产品的可靠性能。
设备:
N2以防止PCB氧化
N2 inlet
Carrier Carrier
Outlet
125oC
封装工艺流程简介
Die Attach 装片
描述:
利用银浆或Film的 粘性将切割好的好的 晶粒吸取并粘贴于基 板上,以便于后制程作 业。
等离子清洗示意图
封装工艺流程简介
MD 包封
描述:
将前道完成后的产品 ，使用塑封料把芯片 塑封起来,免受外力损 坏。同时加强器件的 物理特性便于使用。
设备:
封装工艺流程简介
PMC 包封后烘
封测工艺流程英语
封测工艺流程英语Here is an English essay on the topic of "Encapsulation Process Workflow" that is over 1000 words, with no title and no extra punctuation:The encapsulation process is a critical step in the manufacturing of various products ranging from electronic devices to medical implants. This process involves the sealing of components or materials within a protective casing or housing to shield them from external environmental factors such as moisture, dust, and physical damage. The encapsulation process workflow is a systematic approach that ensures the consistency and quality of the final product.The first step in the encapsulation process workflow is the preparation of the components or materials that will be encapsulated. This involves cleaning and degreasing the surfaces to remove any contaminants that could interfere with the bonding process. Depending on the specific application, various cleaning methods may be used, such as solvent cleaning, ultrasonic cleaning, or plasma cleaning.Once the components are clean and prepared, the next step is theapplication of the encapsulation material. This material can be a polymer-based resin, such as epoxy or silicone, or a metal-based material, such as ceramic or glass. The choice of encapsulation material depends on the specific requirements of the application, including the operating environment, the required level of protection, and the desired physical and electrical properties.The encapsulation material is typically applied using one of several methods, such as potting, transfer molding, or injection molding. In the potting process, the encapsulation material is poured or injected into a mold or cavity containing the components to be encapsulated. The material then hardens or cures, forming a solid, protective casing around the components.In the transfer molding process, the encapsulation material is first heated and softened in a separate chamber, and then forced into a mold containing the components to be encapsulated. The material then cools and hardens, forming the protective casing.Injection molding is a similar process, but the encapsulation material is injected into the mold at a higher pressure, allowing for more complex and precise encapsulation geometries.Regardless of the specific method used, the goal of the encapsulation process is to ensure that the components or materialsare fully and evenly encapsulated, with no air pockets or voids that could compromise the integrity of the final product.After the encapsulation material has been applied, the next step in the workflow is curing or hardening. This process involves the application of heat, pressure, or other forms of energy to cause the encapsulation material to solidify and harden. The curing process can take anywhere from a few minutes to several hours, depending on the specific material and the required level of hardness.Once the encapsulation material has cured, the final step in the workflow is the removal of the encapsulated components from the mold or cavity. This process may involve the use of specialized tools or equipment, such as ejector pins or robotic handling systems, to gently remove the components without causing any damage.After the components have been removed from the mold, they may undergo additional processing steps, such as trimming, drilling, or surface finishing, to ensure that they meet the required specifications and standards.Throughout the encapsulation process workflow, quality control measures are in place to ensure the consistency and reliability of the final product. This may include visual inspections, dimensional measurements, and various testing and characterization techniques,such as X-ray imaging, thermal analysis, or electrical testing.The encapsulation process workflow is a critical component of the manufacturing process for a wide range of products, and its importance cannot be overstated. By protecting sensitive components and materials from environmental factors, the encapsulation process helps to ensure the long-term reliability and performance of the final product.As technology continues to advance and the demand for more complex and compact electronic devices and medical implants increases, the importance of the encapsulation process workflow will only continue to grow. Manufacturers must stay up-to-date with the latest materials, technologies, and best practices in order to remain competitive and meet the evolving needs of their customers.In conclusion, the encapsulation process workflow is a complex and multifaceted process that requires a deep understanding of materials science, manufacturing techniques, and quality control measures. By mastering this process, manufacturers can produce high-quality, reliable products that meet the needs of a wide range of industries and applications.。
led封装工艺流程（Ledpackagingprocess）
led封装工艺流程（Led packaging process）LED process flowchart (revolution)LED packagingLED packaging technology has been developed and evolved on the basis of discrete device packaging technology, but it has great particularity. In general, the core of the discrete device is sealed in the encapsulation. The main function of encapsulation is to protect the core and complete the electrical interconnection. And LED encapsulation is completed the output electric signal, protection tube core work, output: the function of visible light, both the electric parameters, and the optical parameters of design and technical requirements, cannot simply be discrete device packaging for the LED.The core of the LED light-emitting part is composed of p-type and n-type semiconductor pn junction tube core, when the minority carrier injection pn junction with majority carrier compound, can emit visible light, ultraviolet light ornear-infrared light. But p-n junction area of photons is directional, to launch the same chance in all directions, therefore, not all of the light tube core can be released, the quality depends mainly on semiconductor materials, the sealed tube core structure and geometric shape, structure and coating materials, application for higher internal and external quantum efficiency of leds. Conventional Φ type 5 mm LED encapsulation is the side length of 0.25 mm square tube core bonding or sintering in lead frame, the positive by the spherical contact point of the tube core with gold, within the bonded to lead connected to a tube feet, the cathode throughreflection cup and wire rack connected to another pin, and then the top with epoxy resin coating. The function of the reflecting cup is to collect the light from the side of the tube and the interface, and to launch into the desired direction. The top encapsulated epoxy resin is made of a certain shape, which has several functions: protecting the core and so on. Using different shape and material properties (with or without dispersing agent), the function of lens or diffuse lens is used to control the divergence Angle of the light. Tube core index related to air refractive index is too big, causing the inside of the tube core total reflection critical Angle is small, its output of light only a fraction of the active layer is removed, most easily inside the tube core is absorbed by multiple reflection, easily lead to too much light in total reflection loss, choose corresponding refractive index of the epoxy resin as the transition, improve the efficiency of light emergent tube core. The epoxy resin used to form the shell of the tube shall be of moisture resistance, insulation, mechanical strength, the refractive index and transmittance of the light of the pipe core. Choose different refractive index of packaging materials, packaging geometry on the photon escape efficiency is different, the influence of the Angle of the luminous intensity distribution and core tube structure, the light output way, encapsulation used material and shape of the lens. If using the pointed resin lens, the light can be concentrated in the direction of the axis of the LED, and the corresponding Angle is smaller. If the resin lens at the top is rounded or flat, the corresponding Angle will increase.In general, the LED light wavelength with the temperature change of 0.2 0.3 nm / ℃, the spectral width will increase,affect the color brilliance. In addition, when the forward current flows through the p-n junction, and make the junction area produces a febrile loss, temperature near the room tempera ture, temperature rise per 1 ℃, the luminous intensity of leds will correspondingly reduced about 1%, encapsulation cooling; It is very important to maintain the color purity and the intensity of luminescence. In the past, the method of reducing the driving current is used to reduce the temperature, and the driving current of most leds is limited to about 20mA. However,LED light output will increase along with the increase of current, at present, a lot of power type LED drive current can reach 70 ma and 100 ma even 1 a, need to improve the encapsulation structure, new LED packaging design concept and low thermal resistance package structure and technology, improve the thermal characteristics. For example, large scale chip inversion structure is adopted to select silver gel with good thermal conductivity and increase the surface area of metal stents, and the silicon carrier of solder convex spots is directly installed in the hot and sink method. In addition, thermal design and thermal conductivity of PCB circuit board are also important in application design.1. Product packaging structure typeSince the 1990 s, research and development of LED chips and materials technology, has been a number of breakthroughs, transparent substrate trapezoidal structure, texture, surface structure, the structure of the flip chip, the commercialization of ultra-high brightness (1 CD) of red,orange, yellow, green, blue LED products have the introduction, as shown in table 1, 2000 in low, the luminous flux of special lighting applications. Leds, middle industry has been unprecedented attention, further promote the development of downstream encapsulation technology and industry, using different encapsulation structure forms and sizes, different light color tube core and double color, or three color combination, can produce various series of varieties, specifications of the products.The type of LED product packaging structure is shown in table 2, and it is classified according to the characteristics of luminescent color, chip material, luminance brightness, size and so on. Single tube core generally constitute a point light source, multiple core tube assembly in general can constitute a plane light source and line source, for information, state directives and display, light emitting display is also with multiple tube core, through the appropriate connection tube core (including series and parallel) with appropriate optical structure combination, constitute a light-emitting display light-emitting section and markers. The surface mounted LED can gradually replace the lead LED, the application design is more flexible, it has a certain share in the LED display market, and has the accelerated development trend. The solid lighting source has some products to go public, which is the long-term development direction of leds.2. Pin packagingLED the type USES the lead frame for various packaging shaped pin, were the first to market research and development successof encapsulation structure, the number of varieties is various, technical maturity is higher, package structure and reflector continues to improve. Standard LED display industry is considered by most customers is the most convenient and economical solution, in typical conventional leds can withstand the 0.1 W input power coating, 90% of the heat is distributed by the cathode pin frame to the PCB, and then send out into the air, how to reduce the work of pn junction temperature rise is encapsulation and application must be considered. Coating material with high temperature curing epoxy resin, the optical performance is good, good adaptability to process, product * can be high, but make it colored or colorless transparent or colorless, transparent and colored scattering scattering lens assembly, different lens shape a variety of shapes and sizes, for example, circles are divided into Φ diameter 2 mm, 3 mm and 4.4 mm ΦΦ, 5 mm and 7 mm ΦΦseveral kinds, such as the different components of the epoxy resin can produce different luminous effect. There are many different kinds of packaging structure for the color point light source: ceramic base epoxy resin packaging has better working temperature performance.The pins can be bent into the desired shape, small volume; The metal base plastic reflector is an energy-saving indicator, suitable for power supply indication; The scintillation will encapsulate the CMOS oscillating circuit chip and LED tube core, which can generate the blinking light of the stronger visual impact. Double color type is composed of two different luminous color tube core, packaging in the same epoxy resin lens, in addition to the double color can also be a third of the mixed color, has extensive application in the large screen displaysystem, and packaging of double color display devices; The voltage type will encapsulate the constant current source chip and LED tube core, and can directly replace the various voltage indicator lamps of 5-24v. Plane light source is multiple LED chip bonding on the regulation of miniature PCB position, plastic reflection and potting epoxy resin to form a box cover, the different PCB design to determine the outer lead arrangement and connection mode, there are dual in structure with single upright, etc. The light source has developed hundreds of package shapes and sizes for the market and customers.LED luminescent display can be composed of a variety of products, such as a digital tube or a meter pipe, a symbol tube, and a rectangular tube. The actual requirements are designed into various shapes and structures. Digital tube, for example, a reflector type, monolithic integrated type, such as a single seven sections of three kinds of encapsulation structure, the connection mode has a total of anode and cathode two, one is often said of the digital tube, two or more commonly known as the monitor. Reflector type, with large fonts, with makings provinces, hybrid packaging characteristics of flexible assembly, generally made of white plastic into shape shell with reflective cavity seven pieces, will be a single LED chip bonding with seven reflex reflector cavity registration on the PCB board of each other, each reflection cavity at the bottom of the center position is a form of luminous tube core area, bonding with bonding method fuses, within the reflector drops of epoxy resin, and the tube core PCB surface glue, glue and curing. The reflector type is divided into two kinds, namely empty sealing and solid seal. The former USES the epoxy resinof the scattering agent and the dye, which is used in the unit and the two devices. The latter is covered with a filter and a smooth film, and on the tube core and the bottom plate are coated with a transparent insulating gel, which increases the efficiency of the light, which is generally used for more than four figures. Monolithic integrated chip is in luminescent material on a large number of seven segment digital display graphics chip, then scribing divided into single chip graphics chip, bonding, bonding and encapsulating the lens (commonly known as the fisheye lens). A single seven stages will have to make a good large LED chips, cross cut into article contains one or more than just the core of light, so the same seven bonding in digital glyph of kovar rack, the bonding, epoxy resin encapsulation. The feature of single chip and single style is micro-miniaturization, which can be used in double column direct interpolation, mostly dedicated products. LED light display on the 106 mm length of the circuit board, 101 just core (up to 201 just core), belongs to high density packaging, using optics refraction principle, make the point light through a transparent cover article 13 to 15 grating imaging, finish every just core from dot to line, according to packaging technology is more complicated.Electroluminescent mechanism of semiconductor pn junction decision is unlikely to have a continuous spectrum of white light LED, at the same time, single LED is not likely to produce two or more of the high brightness monochromatic light, only in the wrapping with the aid of fluorescent material,The blue or ultraviolet LED tube is coated with phosphor powder, which indirectly produces the broad band spectrum, and thewhite light is synthesized. Or adopt several (two or three or more kinds) of tubes with different colored light to be encapsulated in a component shell, which forms white leds through a mixture of colored light. Both methods have practical application, the Japanese production white LED up to 100 million, 2000, developed into a kind of steady hair white light products, and will be more than white LED assembly design flux requirement is not high, in pairs is given priority to with local adornment effect, the pursuit of new electric light source.3. Surface mounting and packagingIn 2002, surface-mount package LED (SMD leds) is gradually accepted by the market, and get a certain market share, from pin type packaging to SMD conforms to the whole electronic industry development trend, many manufacturers to launch such products.The early SMD leds were mostly modified with sot-23 with transparent plastic body, with a size of 3.04 x 1.11mm, and the packing of the coil tray. Based on SOT - 23, the slm-125 series with high brightness SMD with lens is developed, and slm-245 series leds, the former is monochrome, and the latter is bichromatic or trichromatic luminescence. Development become a hot spot in recent years, SMD LED, well solved the brightness, perspective, flatness, can be *, consistency, use lighter PCB board and reflector material, the display reflector need fill less epoxy resin, pins and remove the heavier carbon steel material, through the smaller size, lower weight, half the weight of the product, and easily will eventually make theapplication more hasten is perfect, especially suitable for indoor, half outdoor full-color display applications.Table 3 shows several sizes of common SMD leds and the best viewing distance calculated according to size (plus necessary clearance). The welding disk is an important channel for its heat dissipation. The data of SMD LED supplied by the manufacturer are based on the welding disk of 4.0 x 4.0 mm, and the backflow welding can be designed as the welding disk and the primer phase. Ultra-high brightness LED products can be used PLCC (laminate with lead chip carrier) - 2 encapsulation, shape size is 3.0 * 2.8 mm, with unique method high brightness tube core assembly, product thermal resistance of 400 k/W, can press welding CECC way, its luminous intensity in 50 ma drive current issued 1250 MCD. One, two, three and four digital SMD LED display devices have a height of 5.08-12.7 mm, indicating a wide range of sizes. PLCC encapsulation to avoid the pin 7 digital display for manual insert and pin alignment process, conform to the requirements of the automatic pick up - SMT equipment production, flexible application design space, display bright and clear. Multicolor PLCC encapsulated with an external reflector, can be easily combined with luminous tube or optical, replace the current transmission type with reflective optical design, to provide uniform illumination for wide area, research and development under the condition of 3.5 V, 1 a drive to work the power type of SMD leds encapsulation.4. Power type packageLED chip and package to develop in the direction of high power, the big electric flow produce 10 to 20 times larger than 5 mmledΦluminous flux, must adopt effective heat dissipation and no degradation of the packaging material to solve the problem of light failure, therefore, shell and assembly as well as the key technology, can withstand the number W power LED packaging.5 W series of white, green, blue, green, and blue type power supply LED from the beginning of 2003, white LED light output up to 1871 m, 44.31 m/W green lighting failure problems, develop sustainable 10 W power leds, large tube; The size of the dagang is 2.5 x 2.5 mm, which can be used to work at 5A, and the light output reaches 2001m. As a solid lighting source, there is a lot of room for development.Luxeon series power LED is A1GalnN power type inversion tube core inversion welding in silicon with solder bumps carrier, and then put the complete inversion welding silicon carrier into heat sink and the shell, the bonding wire for encapsulation. This kind of encapsulation is optimal for the efficiency of light, heat dissipation, and the design of higher working current density. Its main features: low thermal resistance, generally is only 14 ℃ / W, only 1/10 of the conventional leds; Fill the sealed * can be high, stable flexible gel, the range - 40-120 ℃, without internal stress caused by temperature shock, make gold and lead frame disconnected, and prevent yellowing epoxy resin lens, lead frame will not defiled by oxidation; The best design of the reflection cup and lens makes the radiation pattern controlled and optical efficiency the highest. In addition, the output light power, the external quantum efficiency and other performance are excellent, the LED solid light source development to a new level.Norlux series power LED encapsulation structure for the hexagonal aluminum plate base (which is not conductive) multichip combination, base diameter of 31.75 mm, light emitting area is located in the center of the site, (0.375 x 25.4) mm in diam., can accommodate 40 only LED tube core, aluminum plate as a hot line at the same time. Tube core bonding wire through the base of the contact points of the two connected to the positive and negative, according to the size of the output light power required to determine the base with the number of the tube core, composable encapsulation of ultra-high brightness AlGaInN and AlGaInP tube core, the emission light monochrome, respectively, for the color or synthetic white, with high refractive index material finally according to the shape of optical design for coating. This using conventional tube core density composite packaging, high light efficiency, low thermal resistance, better protection tube core and bonding wire, in large electrical shed have higher optical output power, is also a kind of promising LED solid-state light source.In the application, can be in already packaging product assembly with an aluminum laminated metal core PCB, form the power density of LED, PCB board as a device of electrode connection wiring, aluminum core sandwich can be used for hot line, higher luminous flux and photoelectric conversion efficiency. In addition, the encapsulated SMD LED is small, and can be combined flexibly to form a colorful lighting source, such as modular, light-emitting, optical, reflective, and so on.Thermal characteristics of the power type LED directly affect the LED working temperature, the luminous efficiency, lightwavelength, service life, etc., therefore, the power type LED chips encapsulation design, the manufacture technology is more important.。
COB封装工艺流程
四、匀底胶
4.1先配胶水
A硅
B硅
透明A+B硅胶 *胶水必须配好后方
可开始搅拌
4.2抽真空
抽出搅拌时产生的气 泡
注意事项。
真空箱必须洁净
抽真空的时间和温度。
4.3匀胶
匀胶作用？ 1.方便制成控制 2.提高产品良率
注意：
1.匀胶胶量需要保持一致，防 止产生色差。 2.必须均匀平铺COB发光区域，
COB介绍
F
COB封装工艺流程
COB应用
前景
COB产品的封装工艺 COB流程
一：固晶
1 原材料 ① 芯片 ② 银胶 ③ 基板
银胶作用？
1.固定芯片 2.散热 3.导电
基板作用？ 1.固定芯片
2.电路走线 3.散热
1.2、烘烤
A. 固晶完毕的材料必须 在1小时内放入烤箱烘烤。
B.调制好使用烘烤温度.
测试分光
测试分BIN项目 1.光通量
2.显色指数 3.相关色温
5.电压 6.电流 7.电性不良
老化测试
喷码、包装入库
可根据客户需求进行喷码、包装。
COB介绍
CO是LED发光二极管
LED发光原理
1 基本原理
➢ 周期表 ➢ LED晶片的元素为III-V族化合半单体
底胶平 铺前
底胶平 铺后
4.1抽真空
抽出匀胶时产生的气 泡
注意事项。
真空箱必须洁净
抽真空的时间和温度。
4.2、烘烤
A. 匀好底胶的材料必须 在1小时内放入烤箱烘烤。
B.调制好使用烘烤温度.
注意： 注意烘烤温度和烤箱水平度
五、点荧光胶流程
led封装流程英语介绍
led封装流程英语介绍英文回答：LED Packaging Process.The LED packaging process is a critical step in the manufacturing of light-emitting diodes (LEDs). It involves assembling the LED chip, encapsulating it in a protective material, and providing electrical connections. The packaging process helps to protect the LED chip from damage and ensures that it can operate reliably for its intended lifespan.The first step in the LED packaging process is to mount the LED chip on a substrate. The substrate is typically made of metal or ceramic and provides a stable base for the LED chip. The LED chip is then wire bonded to the substrate using gold or aluminum wires. The wire bonds provide the electrical connections between the LED chip and the external circuit.Once the LED chip is mounted and wire bonded, it is encapsulated in a protective material. The encapsulation material is typically a polymer or epoxy resin that protects the LED chip from moisture, dust, and other environmental factors. The encapsulation process also helps to dissipate heat from the LED chip.The final step in the LED packaging process is to provide electrical connections to the LED. This istypically done by soldering leads to the substrate. The leads provide the electrical connections between the LED and the external circuit.The LED packaging process is a complex and precise process that requires specialized equipment and materials. The quality of the packaging process can have a significant impact on the performance and reliability of the LED.中文回答：LED封装流程。
封装制程简介(Assembly Process Introduction)
產品製造流程及相關說明
QC Lot Acceptance
使用顯微鏡以抽樣方式抽檢接線完成
之半成品品質是否有不良,漏接線D/ie短
路/ 打偏…..等
Pad
Plastic Body
壓模 Molding
壓模後烘烤 Post Mold Cure
將完成接線之半成品置入模具中;利用高溫將 壓模膠溶化成液態狀並用高壓將壓模膠注入模 穴中,經固化後形成一特定型狀藉以保護前述之半成品
- Continued
產品製造流程及相關說明
切連桿 Trim / Dejunk
電鍍 Solder Plating
將裝有烘烤完成之半成品的彈匣置入 切連 桿機之進料端,利用輸送機構將材料送 入沖 切模具中將連桿切斷分離
於導線架表面鍍上一層錫鉛保護層,避免導線 架氧化增加可焊性
正印 Top Side Mark
- Continued
製造流程及相關說明
晶圓切割 Wafer Saw/Clean
將裝載有鐵環之提籃置入切割機中, 利用自動送料/辨識/切割/清洗/烘乾等 步驟將晶圓上的每一顆晶粒切穿分離。 切割前須設定刀具之運動座標,切割時並用純水沖 洗殘屑,沖洗完並以Spin Dry方式烘乾。 間接材料 : 純水 治具 : 刀片
將完成壓模之半成品置入烤箱中烘烤;使壓模膠化學 反應更趨完全,(分子與分子結合更緊密避免水氣之侵入 )
-
Continued
產品製造流程及相關說明
Key Process Concerns-Molding
*製程管理 -
1. 導線架&彈匣方向要確認後始才作業,以防止壓模方向錯誤。 2. 要掌握壓模膠有效壽命;適當儲存,回溫後才可使用。以確保壓模
cowos封装工艺流程
cowos封装工艺流程英文回答：Cowos stands for Chip-on-Wafer-on-Substrate, which is a packaging technology used in the semiconductor industry. It involves the integration of multiple chips onto a single wafer, which is then attached to a substrate for electrical connections. This technology offers several advantages, such as improved performance, reduced form factor, and increased functionality.The Cowos packaging process begins with the fabrication of individual chips on separate wafers. These chips can be of different types or functionalities, depending on the desired application. Once the chips are ready, they are transferred onto a common wafer using a process called chip transfer. This involves aligning and bonding the chips onto the wafer surface.After the chip transfer, the next step is the waferthinning process. This is done to reduce the thickness of the wafer, making it more flexible and easier to handle. Thinning is typically achieved through mechanical grinding or chemical etching. The thickness of the thinned wafer depends on the specific requirements of the application.Once the wafer is thinned, the next step is the redistribution layer (RDL) formation. RDL is a crucial part of the Cowos process as it provides the electrical interconnects between the chips and the substrate. RDL is created by depositing and patterning metal layers on the wafer surface, which are then connected to the chip pads using fine-pitch bonding techniques.After the RDL formation, the wafer is ready for the chip-on-wafer bonding process. This involves aligning and bonding the wafer with the chips onto a substrate. The bonding can be achieved through various methods, such as soldering, thermocompression bonding, or adhesive bonding. The choice of bonding method depends on factors like chip size, substrate material, and electrical requirements.Once the bonding is complete, the final step is the singulation process. This involves separating theindividual packaged chips from the wafer and substrate. Singulation can be done through dicing, where a diamond saw is used to cut the wafer into individual chips. Alternatively, laser cutting or mechanical scribing techniques can also be used.In conclusion, Cowos is a packaging technology that enables the integration of multiple chips onto a single wafer, offering various benefits in terms of performance and form factor. The process involves chip transfer, wafer thinning, redistribution layer formation, chip-on-wafer bonding, and singulation. This technology plays a crucial role in the advancement of semiconductor devices, allowing for more compact and efficient electronic systems.中文回答：Cowos是芯片-晶圆-基板封装技术的缩写，是半导体行业中使用的一种封装技术。
SOP封装工艺流程介绍
目录
• SOP封装简介 • SOP封装工艺流程 • SOP封装材料 • SOP封装技术发展趋势 • SOP封装工艺问题与对策
01
SOP封装简介
SOP封装定义
SOP封装，全称为Small Outline Package，是一种常见的电子封装形 式，主要用于将集成电路（IC）封装 在印刷电路板（PCB）上。
微型化是指通过减小封装尺寸来减小整个电子设备的体积和重量。SOP封装技 术通过改进封装结构、减小引脚间距、采用薄型小尺寸封装等形式，实现了更 小的封装尺寸，满足了电子设备微型化的需求。
高集成度
总结词
随着集成电路技术的发展，SOP封装技术也呈现出高集成度 的发展趋势。
详细描述
高集成度是指通过在单一封装内集成更多的电子元件和功能 ，提高整个系统的性能和功能。SOP封装技术通过采用多芯 片组装、集成无源元件等方式，实现了更高的集成度，提高 了系统的性能和功能。
02
这一步骤中，需要检查产品是否有明显的缺陷、污渍或不良的
机械性能。
外观检查通常采用自动化设备进行，以提高检查效率和准确性。
03
测试与筛选
测试与筛选是对已完成的SOP封装产品进行电气 性能测试和筛选的过程。
这一步骤中，需要使用测试设备对产品的电气性 能进行检测，如电压、电流、电阻和电容等。
对于不合格的产品需要进行筛选和处理，以确保 最终产品的质量和可靠性。
VS
详细描述
引脚扭曲的原因可能包括引脚材料质量不 佳、加工精度不足、插装过程中受到外力 等。为了解决这个问题，可以加强引脚材 料的质量控制、提高加工精度、优化插装 工艺，并在插装过程中避免外力作用。
芯片破损
总结词
点胶机封装工艺流程
点胶机封装工艺流程英文回答：Glue dispensing is a crucial process in the packaging industry, especially in electronic manufacturing. Itinvolves applying adhesive materials to specific areas of a product for bonding or sealing purposes. The processensures product stability, durability, and protection against external factors.The glue dispensing process typically follows a seriesof steps. First, the product or component that requires adhesive application is prepared. This may involve cleaning, surface treatment, or positioning the product in a fixtureor jig for precise dispensing.Next, the appropriate adhesive material is selected based on the specific requirements of the product and its intended use. There are various types of adhesives available, such as epoxy, silicone, acrylic, or UV-curableadhesives. Each type has its own characteristics, such as viscosity, curing time, and bonding strength, which need to be considered during the selection process.Once the adhesive material is chosen, it is loaded into a dispensing system, such as a glue gun or a pneumatic dispenser. The dispensing system is set up with the desired dispensing parameters, including the flow rate, dispense pattern, and dispense volume. These parameters are determined based on factors such as the size and shape of the product, the required bond strength, and the desired aesthetic appearance.After the dispensing system is prepared, the adhesiveis dispensed onto the product in a controlled manner. The operator guides the dispensing system over the designated areas, ensuring precise application. The dispensed adhesive may be in the form of dots, lines, or patterns, depending on the requirements of the product and the dispensing system used.Once the adhesive is applied, the product may undergo acuring process to facilitate bonding. This can be done through various methods, such as air drying, heat curing, or UV curing. The curing time and conditions depend on the type of adhesive used and the desired bond strength.Finally, the product is inspected to ensure the adhesive application meets the required standards. This may involve visual inspection, mechanical testing, or other quality control measures. Any defects or inconsistencies in the adhesive application are identified and rectified to ensure the product's reliability and performance.中文回答：点胶机封装工艺流程在包装行业中至关重要，尤其在电子制造领域。
【半导体封装测试】IC封装测试工艺流程
EOL– Molding（注塑）
Before Molding After Molding
※为了防止外部环境的冲击，利用EMC 把Wire Bonding完成后的产品封装起 来的过程，并需要加热硬化。
EOL– Molding（注塑）
L/F L/F
Cavity
Molding Tool（模具）
➢EMC（塑封料）为黑色块状，低温存储，使用前需先回温。其特 性为：在高温下先处于熔融状态，然后会逐渐硬化，最终成型。
Wafer Wash主要清洗Saw时候产生的各种粉尘，清洁Wafer；
FOL– Wafer Saw晶圆切割
Wafer Saw Machine
Saw Blade(切割刀片)：
Life Time：900~1500M； Spindlier Speed：30~50K rpm： Feed Speed：30~50/s;
• QFN—Quad Flat No-lead Package 四方无引脚扁平封装 • SOIC—Small Outline IC 小外形IC封装 • TSSOP—Thin Small Shrink Outline Package 薄小外形封装 • QFP—Quad Flat Package 四方引脚扁平式封装 • BGA—Ball Grid Array Package 球栅阵列式封装 • CSP—Chip Scale Package 芯片尺寸级封装
Molding Cycle
-L/F置于模具中，每 -高温下，EMC开始
个Die位于Cavity中， 熔化，顺着轨道流
模具合模。
向Cavity中
-块状EMC放入模具 孔中
-从底部开始，逐渐 覆盖芯片
-完全覆盖包裹完毕， 成型固化
COB封装工艺流程 ppt课件
➢ 材料的排列模式: Si （硅） • 原子內各层的稳定电子数: 2, 8, 8, …..个
• 矽的外层电子 数为4个电子
➢ N-type的排列模式: Si （硅）+ As（砷）
• 在Si(硅)的排列中 放入As(砷）,则将 多出一个电子, 在结 构上称为带负电 (Negative),故定义为 N-type.
COB介绍
F
COB封装工艺流程
COB应用
前景
目录
COB封装工艺流程
COB流程
COB封装工艺流程
1 原材料 ① 芯片 ② 银胶 ③ 基板 银胶作用？
1.固定芯片 2.散热 3.导电
基板作用？
1.固定芯片
2.电路走线 3.散热
1.2、烘烤
A. 固晶完毕的材料必须 在1小时内放入烤箱烘烤。
B.调制好使用烘烤温度.
注意：烘烤事项
COB封装工艺流程
a.焊线就是把芯片和 基板上的电路进行连 接导通，使芯片在通 电情况下正常发光。
b.焊好线的产品要经 过QC检验后转入下站 工序。
焊线产品
全自动焊线机
COB封装工艺流程
围坝主要为了方便后面点 荧光粉工序和发光面积的 需要。
3.2、烘烤
围坝好的材料必须 在1小时内放入烤箱烘烤。
COB封装工艺流程
COB封装工艺 流程
1.使用自动点胶机作 业（图1） 2.点分后荧光胶自动 平铺表面，后转入下 一工序。
注意：
1.点粉时注意空气洁净度， 人员需带口罩和无尘手套。 2.严禁点粉时接触橡胶制品 3.严禁附近有化学品和易挥 发液体。如：丙酮、酒精等 。
5抽真空
抽出点粉时产生的气泡
注意：必须使用专用烤箱，不能 与固精烤箱混用。
半导体封装工艺 流程 名词解释表
半导体封装工艺流程名词解释表Semiconductor packaging process is a crucial step in the production of modern electronic devices, which involves encapsulating the integrated circuit (IC) into a protective casing to ensure its functionality and durability. The packaging process plays a significant role in protecting the IC from external factors such as moisture, dust, and mechanical stress, thus enhancing its reliability and performance. Therefore, it is essential to have a clear understanding of the semiconductor packaging process and its various techniques.半导体封装工艺是现代电子设备生产中一个至关重要的步骤，它涉及将集成电路封装到保护壳中，以确保其功能性和耐用性。
封装工艺在保护集成电路免受潮湿、灰尘和机械应力等外部因素方面起着重要作用，从而提高其可靠性和性能。
因此，对半导体封装工艺及其各种技术有清晰的了解是至关重要的。
One of the key techniques in semiconductor packaging process is wire bonding, which involves connecting the IC to the package using thin wires made of gold, aluminum, or copper. Wire bonding is a crucial step in the packaging process as it provides electricalconnections between the IC and the external circuitry. There are two main types of wire bonding techniques: ball bonding and wedge bonding. Ball bonding uses a small ball of wire to make the connection, while wedge bonding uses a wedge-shaped tool to create the bond.半导体封装工艺中的关键技术之一是线性键合，它涉及使用由金、铝或铜制成的细线将集成电路连接到封装中。
封测工艺流程英文
封测工艺流程英文English:The process of chip packaging and testing typically involves several stages. First, the integrated circuit (IC) is put through wafer probing, where each individual chip on the wafer is tested for functionality. Next, the good chips are placed into packages, which provide protection and allow for connections to external devices. The packaged chips are then subjected to final testing, where they are checked for proper functionality and performance. This involves a series of electrical tests, such as checking for signal integrity and power consumption. Once the chips have passed all tests successfully, they are ready to be shipped out to customers for use in various electronic devices. Throughout this entire process, strict quality control measures are implemented to ensure that only high-quality chips are delivered to consumers.中文翻译:芯片封装和测试的工艺流程通常包括几个阶段。
封装工艺流程英文
Here's a description of the encapsulation process flow in English:---Encapsulation Process FlowThe encapsulation process is a crucial step in the manufacturing of electronic components, particularly integrated circuits (ICs), where individual semiconductor devices are housed within protective enclosures to ensure their reliability and functionality. The following outlines the typical encapsulation process flow:1. Die Preparation: The process begins with the preparation of semiconductor dies, which are individual components containing integrated circuits or other electronic elements. Dies are typically fabricated on silicon wafers using photolithography and etching techniques.2. Die Attach: In this step, the semiconductor dies are mounted onto a substrate or carrier using a die attach adhesive. The adhesive is applied to the substrate, and the dies are carefully placed in position using automated equipment. The die attach adhesive is then cured to secure the dies in place.3. Wire Bonding: After die attach, wire bonding is performed to establish electrical connections between the semiconductor dies and the substrate. Thin metal wires, typically made of gold or aluminum, are bonded to the contact pads on the dies and the corresponding pads on the substrate using ultrasonic or thermocompression bonding techniques.4. Mold Encapsulation: Once wire bonding is complete, the semiconductor dies and wire bonds are encapsulated within a protective housing or package. This is typically done using a molding compound, such as epoxy resin or plastic, which is injected into a mold cavity surrounding the dies and wire bonds. The mold compound is then cured to form a solid, protective encapsulation around the components.5. Trim and Form: After encapsulation, the packaged devices undergo trimming and forming processes to achieve their final dimensions and shape. Excess mold compound and lead frames are trimmed away, and the leads or terminals of the packaged devices are formed into the desired configuration.6. Testing and Inspection: The encapsulated devices undergo rigorous testing and inspection to ensure their quality and reliability. This may include electrical testing, visual inspection, and environmental testing to verify performance under various operating conditions.7. Marking and Packaging: Finally, the tested and inspected devices are marked with identifying information, such as part numbers and date codes, and packaged for shipment to customers. Packaging may include tape and reel, trays, or tubes, depending on customer requirements.8. Quality Assurance: Throughout the encapsulation process flow, strict quality assurance measures are implemented to monitor and control the quality of the finished devices. This includes adherence to industry standards and specifications, as well as continuous process improvement initiatives to optimize yield and reliability.In summary, the encapsulation process flow plays a critical role in the manufacturing of electronic components, ensuring the reliability, functionality, and performance of integrated circuits and other semiconductor devices. Each step in the process is carefully controlled and monitored to produce high-quality encapsulated devices that meet customer requirements and industry standards.。
封装工艺流程英文
封装工艺流程英文English:The encapsulation process is a critical step in the manufacturing of electronic components, as it involves protecting delicate circuits and components from environmental factors such as moisture, dust, and mechanical shock. The first step in the encapsulation process is to select the appropriate encapsulant material, which can vary depending on the specific requirements of the component being manufactured. Once the encapsulant material is chosen, it is then applied to the component using various techniques such as molding, potting, or underfill dispensing. The encapsulant is then cured to ensure that it forms a protective barrier around the component. After curing, any excess encapsulant is removed, and the component is inspected for quality control purposes. The encapsulated component is then tested to ensure that it meets the required specifications before it is ready for assembly into larger electronic systems. Overall, the encapsulation process is essential for ensuring the reliability and longevity of electronic components in various applications.中文翻译:封装工艺是电子组件制造过程中的关键步骤，因为它涉及保护脆弱的电路和元件免受湿度、灰尘和机械冲击等环境因素的影响。
封装焊丝生产工艺流程
封装焊丝生产工艺流程英文回答：Encapsulated Wire Production Process.1. Raw Material Preparation.Copper rod or aluminum rod: cut into desired lengths and cleaned to remove any impurities.Polymer resin: mixed with additives to enhance the desired properties of the insulation.2. Extrusion.The copper or aluminum rod is heated and forced through a die to form a continuous wire.The polymer resin is also heated and extruded around the wire, forming a protective insulation layer.3. Cross-Linking.The extruded wire is heated in an oven or irradiated with UV light to cross-link the polymer chains, creating a strong and durable insulation.4. Curing.The cross-linked wire is heated to further stabilize the insulation and improve its electrical properties.5. Coiling.The cured wire is coiled onto spools for easy handling and storage.6. Packaging.The spools are packed into cartons or boxes for shipment.7. Quality Control.Throughout the production process, rigorous quality control measures are implemented to ensure the integrity of the encapsulated wire. This includes testing for electrical properties, insulation thickness, and tensile strength.中文回答：封装焊丝生产工艺流程。
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Wire Bond
DB Glue Cure WB QC Visual MD PMC
8
Function
To bond wires on the die and on the package leads, in order to connect die and leads to realize electrically link.
Products Application Overview
Advance
- Powertrain (动力传动） - Safety (安全） - Car Multimedia （汽车） - Lighting （灯塔） - Alarm （报警） - Navigation System （逻辑系统）
4
Home Entertainment & Display (HED)
SOP
DIP
SOP
DIP
SOT
SOT
Unit with Wire bonding
Molding Compound
Machine Type： FUSHI SANJIA ( SKMP250) Machine Characteristic 1. Half-automated 2. High Capacity (Dip and Sot: 12 pcs / per mold; Sop: 8 pcs / per mold ) 3. Easier for in process control
Machine Type： ASM iHAWK Machine Characteristic： 1. Good flexibility: suitable for all dimension Cu and Ag on lead frame and die. 2. Bonding at room temperature. 3. Protect atmosphere not need.
Not included in factory Not included in factory
Visual/ Mechanical 100%
Flow
Flow
Included in factory Included in factory Not included in factory
QC Visual / Mechanical
Individቤተ መጻሕፍቲ ባይዱal Units
12
Testing （only for Dip package)
DB Glue Cure WB QC Visual MD PMC Trim /Form (dip) Test (dip) Marking (dip) Visual/Packi ng (dip) QC visual (dip)
Role of SMC COMPANY
3
Our role on semiconductor manufacturing
Wafer from CRM Our company (Assembly + Testing) Final Products Customer
Assembly
Test
Material (e.g. Frames Resin)
Molded units on the lead frame
10
Post Mold Curing
DB Glue Cure WB QC Visual MD PMC
11
Function
PMC --- To cure the molding compound 8hours under the environment of 175+/-5º C, in order to stabilize cohesion between resin and lead frame and enhance structural strength of molding compound.
Un-tested unit
Machine Type： DES&MFG (CT S8002) PowerTECH (QH-11000) Machine Characteristic： 1. Fully automated 2. HV,LV testing module individually
12
Function
To form and singularize each unit from strip, so that they can be proceed test process individually.
Lead Frame
Machine Type： PROPER (Trim / Form systemDip 4) Machine Characteristic： 1. Fully automated
SOP
DIP SOT
Lead frame
SOP DIP SOT
Machine Type： Sliver glue
CANON (BESTEM-D11) for SOP package HOSON (GS850P-L) for DIP package ASM (AD838) for SOT package
Glue Characteristic： 1. Weight loss under high temperature 2. More strength cohesion after Weight loss. 3. NO DMA after weight loss
Machine Type： ETOMA PMC Machine Characteristic： 1. Use N2 Gas to protect production from oxidation 2. Machine panel showing device for temperature and time control. 3. High Capacity
Die
Sliver glue Lead frame 6
Glue Cure
DB Glue Cure WB QC Visual MD PMC
7
Function
To cure the sliver glue 1hours under the environment of 175+/-5º C, in order to stabilize cohesion between die, glue and frame and enhance structural strength of glue, so that make sure enough force to perform die shearing, and no DMA.
100%
50%
0%
Machine Type： PUHUA PMC (PHT-640) ESPEC (PH201) Machine Characteristic： 1. Use N2 Gas to protect production from oxidation 2. Machine Proving Device for temperature and time control. 3. High Capacity
Frame with Die
Wafer (Dice)
Machine Characteristic： 1. The adhesive have two kinds (Electrically and no electrically conductive) 2. The protect atmosphere in the oven is H2+N2
Box filled lead frame with wires
Machine Type： Stereo Microscope visual inspection under microscope (1 lead frame / per box)
Without defects units
Molding
Silver glue cure
Cu Wire Bond
De-flashing
Post Mold Curing
Molding
QC Visual Gate
Plating
Baking
DIP4
Trim / Form
Testing
Marking
Sot / Sop
Marking
Trim / Form
Visual/ Mechanical 100% QC Visual / Mechanical
Before WB
Capillary
After Wire bonding
Wire (Cu / Ag)
8
QC Visual Gate
DB Glue Cure WB QC Visual MD PMC
9
Function
Visual inspection, wire pull test and shear test to monitor good devices, so that make sure bonding wire perfect.
- High definition DVD - Digital & HD TV - Audio （高清晰DVD，
数字电视，音频设备）
SOP 8
SOT23 - 3/5/6
DIP 4
Industrial & Others
- Welding （焊接） - Industry Robots （工业机器人） - Power supply （电源） - Motor control （马达控制） - 3-Phase Driver （3线电驱动）
Testing
Warehouse
5
Die Bond