电容触摸屏QT703018EUPEa规格书

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70寸触摸一体机产品规格书

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魔方影音
-
Dolby解码
DD+
自动声音调整
●
2
端子
TV
1
视频输入
1(复合视频转接线)
TV USB输入
2（侧面*1前置*1）
PC USB输入
1（前置）
Touch USB输入
2（侧面*1前置*1）
音频输入)输入
1（复合视频转接线）
DVI输入/输出
1入/0出
OPS接口
70寸触摸一体机产品规格书
1
型号
LED70W20
外观
前壳（注明是否开模具）
铝合金型材
后壳（注明是否开模具）
钣金
底座
-
壁挂支架
一体化包装
扬声器
-
玻璃
5mm钢化玻璃
屏幕
背光光源
E-LED
屏幕尺寸
70
屏幕比例
16:9
分辨率
1920*1080
一键关屏
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声音
平衡调节
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五段式均衡器
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DTS
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SRS Trurround HD
3、RAM:1.5G；ROM:8GB
主要功能
结构一体化（内置触摸框、非外套）
支持android下触控（包括触控菜单）
可安装apk客户端
智能亮度感应(基于触摸下)
外挂电脑支持（安装于整机后壳）
红外遥控
6
1
HDMI输入
1(前置)
VGA输入/输出
1入/1出
音频输出
1（复合视频转接线）
视频输出
1（复合视频转接线）
SPDIF输出
1
红外输入
1

Unitronics SambaOPLC 3.5英寸、4.3英寸和7英寸平板颜色触摸屏PLC说明书

Samba™OPLC™ SM35-J-T20SM43-J-T20SM70-J-T20Technical SpecificationsOrdering InformationItemSM35-J-T20 PLC with Flat panel, Color touch display 3.5’’SM43-J-T20 PLC with Flat panel, Color touch display 4.3’’SM70-J-T20 PLC with Flat panel, Color touch display 7’’You can find additional information, such as wiring diagrams, in the product’s installation guide located in the Technical Library at .Power SupplyItem SM35-J-T20 SM43-J-T20 SM70-J-T20Input voltage 24VDCPermissible range 20.4VDC to 28.8VDC with less than 10% rippleMax. currentconsumptionSee Note 1npn inputs 215mA@24VDC 215mA@24VDC 340mA@24VDCpnp inputs 120mA@24VDC 120mA@24VDC 240mA@24VDCNotes:1. To calculate the actual power consumption, subtract the current for each unused element from the maximumcurrent consumption value according to the values below:Backlight Ethernet cardSM35/SM43 20mA 35mASM70 80mA 35mADigital InputsNumber of inputs 12. See Note 2Input type See Note 2Galvanic isolation NoneNominal input voltage 24VDCInput voltagepnp (source) 0-5VDC for Logic ‘0’17-28.8VDC for Logic ‘1’npn (sink) 17-28.8VDC for Logic ‘0’0-5VDC for Logic ‘1’Input current 8mA@24VDCInput impedance 3KΩResponse time 10ms typical, when used as normal digital inputsInput cable lengthNormal digital input Up to 100 metersHigh Speed Input Up to 50 meters, shielded, see Frequency table below2/15 Samba™ OPLC™High speed inputs Specifications below apply when wired as HSC/shaft-encoder.See Note 2Frequency (max) See Note 3Cable length (max.) HSC Shaft-encoder10m 30kHz 20kHz25m 30kHz 13kHz50m 25kHz 9kHzDuty cycle 40-60%Resolution 32-bitNotes:2. This model comprises a total of 12 inputs. Input functionality can be adapted as follows:12 inputs may be used as digital inputs. They may be wired, in a group, and set to eithernpn or pnp via a single jumper.In addition, according to jumper settings and appropriate wiring:Inputs 10 and 11 can function as either digital or analog inputs.Inputs 0, 2, and 4 can function as high-speed counters, as part of a shaft-encoder,or as normal digital inputs.Inputs 1, 3, and 5 can function as either counter reset, as part of a shaft-encoder,or as normal digital inputs.If inputs 0, 2, 4 are set as high-speed counters (without reset), inputs 1, 3, 5can function as normal digital inputs.3. pnp/npn maximum frequency is at 24VDC.Analog InputsNumber of inputs 2, according to wiring as described above in Note 2Input type Multi-range inputs: 0-10V, 0-20mA, 4-20mAInput range 0-20mA, 4-20mA 0-10VDCInput impedance 243Ω>150KΩMaximum input rating 25mA, 6V 15VGalvanic isolation NoneConversion method Successive approximationResolution (except 4-20mA) 10-bit (1024 units)Resolution (at 4-20mA) 204 to 1023 (820 units)Conversion time One configured input is updated per scan. See Note 4Precision 0.9%Status indication Yes – if an analog input deviates above the permissible range,its value will be 1024.Note:4. For example, if 2 inputs are configured as analog, it takes 2 scans to update all analog values.SMxx-J-T20 Technical Specifications 2/15Digital OutputsNumber of outputs 8 transistor pnp (source)Output type P-MOSFET (open drain)Isolation NoneOutput current (resistive load) 0.5A maximum per output3A maximum total per commonMaximum frequency 50Hz (resistive load)0.5Hz (inductive load)PWM maximum frequency 0.5KHz (resistive load). See Note 5Short circuit protection YesShort circuit indication Via softwareOn voltage drop 0.5VDC maximumPower supply for outputsOperating voltage 20.4 to 28.8VDCNominal voltage 24VDCNote:5. Outputs 0 to 6 can be used as PWM outputs.Graphic Display ScreenItem SM35-J-T20 SM43-J-T20 SM70-J-T20 LCD Type TFT, LCD display TFT, LCD display TFT, LCD display Illumination backlight White LED White LED White LED Display resolution 320x240 pixels 480x272 pixels 800x480 pixels Viewing area 3.5" 4.3" 7"Colors 65,536 (16-bit) 65,536 (16-bit) 65,536 (16-bit) Touchscreen Resistive, analog Resistive, analog Resistive, analog Screen brightness control Via software (Store value to SI 9, values range: 0 to 100%)Virtual Keypad Displays virtual keyboard when the application requires data entry.ProgramItem SM35-J-T20 SM43-J-T20 SM70-J-T20 Memory sizeApplication Logic 112KB 112KB 112KBImages 1MB 2MB 5MBFonts 512KB 512KB 512KBOperand type Quantity Symbol ValueMemory Bits 512 MB Bit (coil)Memory Integers 256 MI 16-bit signed/unsignedLong Integers 32 ML 32-bit signed/unsignedDouble Word 32 DW 32-bit unsignedMemory Floats 24 MF 32-bit signed/unsignedFast Bits 64 XB Fast Bits (coil) – not retainedFast Integers 32 XI 16 bit signed/unsigned (fast, not retained)Fast Long Integers 16 XL 32 bit signed/unsigned (fast, not retained)Fast Double Word 16 XDW 32 bit unsigned (fast, not retained)Timers 32T Res. 10 ms; max 99h, 59 min, 59.99sCounters 16 C 32-bitData Tables 32K dynamic data (recipe parameters, datalogs, etc.)16K fixed data (read-only data, ingredient names, etc)HMI displays Up to 24Program scan time 15µs per 1kb of typical application2/15 Samba™ OPLC™Communication PortsPort 1 1 channel, RS232 (SM35) , USB device (SM43/SM70)Galvanic isolation SM35 and SM43 – NoSM70 - YesBaud rate 300 to 115200 bpsRS232 (SM35 only)Input voltage ±20VDC absolute maximumCable length 15m maximum (50’)USB device (SM43,SM70 only)Port type Mini-BSpecification USB 2.0 complaint; full speedCable USB 2.0 complaint; up to 3mPort 2 (optional) See Note 6CANbus (optional) See Note 6Notes:6. The user may order and install one or both of the following modules:- A serial RS232/RS485 isolated/non-isolated interface module, or an Ethernet Interface module in port 2.- A CANbus modulemodules documentation is available on the Unitronics website.MiscellaneousClock (RTC) Real-time clock functions (date and time)Battery back-up 7 years typical at 25°C, battery back-up for RTC and system data, includingvariable dataBattery replacement Yes. Coin-type 3V, lithium battery, CR2450DimensionsItem SM35-J-T20 SM43-J-T20 SM70-J-T20Size 109 x 114.1 x 68mm(4.29 x 4.49 x 2.67”).See Note 7 136 x 105.1 x 61.3mm(5.35 x 4.13 x 2.41”).See Note 7210 x 146.4 x 42.3mm(8.26 x 5.76 x 1.66”).See Note 7Weight 205g (7.23 oz) 344g (12.13 oz) 633g (22.32 oz) Notes:7. For exact dimensions, refer to the product’s Installation Guide.EnvironmentOperational temperature 0 to 50ºC (32 to 122ºF)Storage temperature -20 to 60ºC (-4 to 140ºF)Relative Humidity (RH) 10% to 95% (non-condensing)Mounting method Panel mounted (IP65/66/NEMA4X)DIN-rail mounted (IP20/NEMA1)Operating Altitude 2000m (6562 ft)Shock IEC 60068-2-27, 15G, 11ms durationVibration IEC 60068-2-6, 5Hz to 8.4Hz, 3.5mm constant amplitude,8.4Hz to 150Hz, 1G acceleration.SMxx-J-T20 Technical Specifications 2/15 The information in this document reflects products at the date of printing. Unitronics reserves the right, subject to all applicable laws, at any time, at its solediscretion, and without notice, to discontinue or change the features, designs, materials and other specifications of its products, and to either permanently ortemporarily withdraw any of the forgoing from the market.All information in this document is provided "as is" without warranty of any kind, either expressed or implied, including but not limited to any implied warranties of merchantability, fitness for a particular purpose, or non-infringement. Unitronics assumes no responsibility for errors or omissions in the information presented inthis document. In no event shall Unitronics be liable for any special, incidental, indirect or consequential damages of any kind, or any damages whatsoever arising out of or in connection with the use or performance of this information.The tradenames, trademarks, logos and service marks presented in this document, including their design, are the property of Unitronics (1989) (R"G) Ltd. or other third parties and you are not permitted to use them without the prior written consent of Unitronics or such third party as may own them.DOC17017-A8 02/15。

SIMATIC MULTIPANEL MP370 15英寸彩色TFT触摸屏显示器商品说明书

50 000 h
Touch screen
No No Yes
6AV6545-0DB10-0AX0 Page 1/8
08/16/2017
Subject to change without notice © Copyright Siemens
● alphanumeric keyboard ● hexadecimal keyboard ● Multi-key operation
6AV6545-0DB10-0AX0 Page 2/8
08/16/2017
Subject to change without notice © Copyright Siemens
Error LED
Time of day Clock ● Type ● retentive ● synchronizable
Installation type/mounting Mounting position maximum permissible angle of inclination without external ventilation
Supply voltage Type of supply voltage UPS connectable (serial)
IP65 IP20
CE, FM Class I Div. 2, cULus, EX Zone 2/22, C-TICK
0 °C 50 °C -20 °C 60 °C 85 %
Windows CE
ProTool Version 6 SP 2 or higher, or WinCC flexible Standard Version 2004 or higher (to be ordered separately)

7030说明书

校驗及校正聲明奧斯達儀器股份有限公司特別聲明，本操作使用手冊所列的儀器設備完全符合本公司一般型號上所標稱的規範和特性。

本儀器在出廠前已經通過本公司的廠內校驗。

本公司校驗用的所有儀器設備都已委請中央標準局認可的檢驗中心作定期校正，校驗的程式和步驟是符合電子檢驗中心的規範和標準。

産品品質保證奧斯達儀器股份有限公司保證所生産製造的新品機器均經過嚴格的品質確認，同時保證在出廠一年內，如有發現産品的製造瑕疵或零件故障，本公司負責免費給予修復。

但是如果使用者有自行更改電路、功能、或進行修理機器及零件或外箱損壞等情況，本公司不提供免費保修服務，得視實際狀況收取維修費用。

如果未按照規定將所有地線接妥或未按照安全規範操作機器而發生異常狀況，本公司恕不提供免費保修服務。

本保證不含本機器的附屬設備等非奧斯達電子所生産的附件在一年的保修期內，請將故障機組送回本公司維修中心或本公司指定的經銷商處，本公司會予以妥善修護。

如果本機組在非正常的使用下、或人爲疏忽、或非人力可控制下發生故障，例如地震、水災、暴動、或火災等非人力可控制的因素，本公司不予免費保修服務。

目錄第一章安全規定-------------------------3 第二章安規介紹-------------------------7 第三章技術指標-------------------------13 第四章面板/背板說明------------------- 16 第五章測試參數的設定-------------------19 第六章顯示訊息------------------------29 第七章操作程式及步驟-----------------35WARNING CAUTION 第一章：安全規定測試前應該仔細閱讀以下規定！！！1.1 一般規定使用本交流接地電阻測試儀器前，請認真閱讀該使用說明書，按說明書要求使用。

在開啓本機的輸入電源開關前，請先選擇正確的輸入電壓(115V/230V)規格。

236英寸电容触摸平板技术规格书

电容一体机23.6英寸电容触摸平板技术规格书（型号：ＨＢＹ－Ｄ２３６）备注：标配壁挂架，桌面式支架为选配产品；内容如有更改，恕不另行通知一、产品特性1.结构设计：（1）纯平面结构，人体工程学设计，纤巧美观、流线造型、工艺精良；（2）显示、触控、PC系统一体化超薄设计,仅厚43 mm；2.使用效果：（1）采用最新研发的投射式电容屏，完美10点触摸，支持手写及多点手势；（2）触摸速度小于3ms，精确度好，使用简单便捷、易于维护；（3）抗光干扰，确保操作的准确性（强光直射照常使用）；3.扩充性好：配置灵活，可扩充安装客户需求的各种功能配件；4.安全性高：铝合金+钣金结构，无锐利边缘，耐磨防腐烤漆工艺，整体防暴设计；5.性能稳定：先进的设计理念，严格的生产工艺，产品品质稳定可靠，故障率低；6.安装简便：通电一键开关机，免除现场安装调试。

二、系统设计三、液晶屏参数四、触摸屏参数五、显示参数 (仅做为触摸显示器部分使用)六、电源参数七、工作环境八、随机附件九、电脑参数十、物理规格屏幕23.6寸（对角线603.6mm）有效显示尺寸525.5×297 mm （16：9）整机尺寸（宽×高×厚）576（宽）×352（高）× 43（厚）mm 包装尺寸（宽×高×厚）635（宽）× 445（高）×140（厚）mm 底架标配壁挂架（净重0.78kg），可选配底座背部壁挂与机器连接的孔100×100 mm位尺寸（长×宽）壁挂螺丝规格M4净重（裸机）触显7.23 kg，一体机7.75kg毛重（包装）9.11 kg十一、整机结构图十二、产品细节图十三、产品款式/产品效果图十四、整机实拍图十五、产品配件图。

触摸屏ITO玻璃规格书

触摸屏ITO透明导电玻璃规格书客户：牧東光電（蘇州）有限公司规格：TKHTP(Chemical Tempered Glass/D-SiO2)发行日期：2008年9月1日编号：TK20080901-2所附说明是规格书中的一部分。

关于其中提到的生产过程和制造技术方面的信息已经被确认过，并保留了长信公司自身的特性。

长信保留根据需要更改一些技术方面信息的权利。

采购规格书（修订履历）触摸屏ITO透明导电玻璃规格书SPEC. NO. TK20080901-21.0概述1.1此说明书介绍了长信公司生产的触摸屏ITO透明导电玻璃和基片的主要特性。

1.2它适用于触摸屏ITO透明导电玻璃的生产过程和质量监控以及售后服务过程。

2.0产品品名及规格长信公司可提供以下规格触摸屏透明导电玻璃产品。

3.0 玻璃基片规格质量要求基片尺寸、公差及相应的检测方法如下。

4.0ITO玻璃质量要求质量保证区域为距玻璃四周边缘5mm以外的区域。

电阻保证区域为距玻璃四周边缘10mm以外的区域。

4.1 ITO玻璃表观质量4.2 ITO玻璃镀膜质量要求4.3ITO膜层稳定性5.0 质量保证5.1长信公司于2003年6月份通过ISO9001：2000质量体系认证，并与2006年11月份通过ISO14001：2004环境管理体系认证。

5.2长信公司在供货时提供出厂质量检验报告和产品合格证。

5.3抽样计划：请参考如下表格。

5.4质量问题的处理客户可以按照以下表格参数做IQC检测以认证长信公司产品对于在IQC认证中或客户生产过程中发现不合格品经过本公司确认后在双方达成协商情况下进行处理。

6.0 包装和标识6.1长信公司按客户的要求进行包装。

6.2 每片玻璃用间隔纸隔开，以防止玻璃之间相互滑动所造成膜面和玻璃的划痕。

6.3产品要求包装成小包，上下夹以硬纸板，并用热塑膜热缩包装。

6.4玻璃小包装和成品装箱数量如下：6.5标识说明6.5.1 小包装标识说明每包小包装上印有产品品名、生产批号、包号、数量、检验号和膜面指示章。

ELAN EM78F811N 8位微控制器产品规格书说明书

产品规格书版本1.5义隆电子股份有限公司2021.07商标告之:IBM 为一个注册商标，PS/2是IBM 的商标之一。

Windows 是微软公司的商标。

ELAN 和ELAN 标志是义隆电子股份有限公司的商标。

关于该规格书的准确性、适当性或者完整性，义隆电子股份有限公司不承担任何责任。

义隆电子股份有限公司不承诺对本规格书之内容及信息有更新及校正之义务。

本规格书的内容及信息将为符合确认之指示而变更。

在任何情况下，义隆电子股份有限公司对本规格书中的信息或内容的错误、遗漏，或者其它不准确性不承担任何责任。

由于使用本规格书中的信息或内容而导致的直接，间接，特别附随的或结果的损害，义隆电子股份有限公司没有义务负责。

本规格书中提到的软件（如果有），都是依据授权或保密合约所合法提供的，并且只能在这些合约的许可条件下使用或者复制。

义隆电子股份有限公司的产品不是专门设计来应用于生命维持的用具，装置或者系统。

义隆电子股份有限公司的产品不支持而且禁止在这些方面的应用。

未经义隆电子股份有限公司书面同意，任何个人或公司不得以任何形式或方式对本规格书的内容之任一部分进行复制或传输。

义隆电子股份有限公司总公司:地址: 30076新竹科学工业园区创新一路12号电话: +886 3 563-9977 传真: +886 3 563-9966 *****************.tw http :// 香港分公司:义隆电子(香港)股份有限公司地址:九龙观塘巧明街95号世达中心19楼A 室电话: +852 2723-3376 传真: +852 2723-7780美国:Elan InformationTechnology Group (U.S.A.) 地址: 10268 Bandley Drive Suite 101 , Cupertino , CA 95014,USA 电话: +1 408 366-8225 传真: +1 408 366-8225深圳分公司:义隆电子(深圳)有限公司地址:518057深圳市南山区高新技术产业园南区高新南六道迈科龙大厦8A电话: +86 755 2601-0565 传真: +86 755 2601-0500 ******************.cn上海分公司:义隆电子(上海)有限公司地址:上海市浦东新区盛荣路88弄3号703室(盛大天地源创谷内)电话：+86 21 5080-3866 ******************.cn目录目录1 综述 (1)2 特性 (1)3 引脚配置 (2)3.1 10-Pin MSOP (2)3.2 16-Pin DIP/SOP (2)3.3 14-Pin SOP (2)4 引脚描述 (3)5 系统概述 (5)5.1 内存图 (5)5.2 模块图 (6)6 功能描述 (7)6.1 操作寄存器 (7)6.1.1 R0:IAR (间接寻址寄存器) (7)6.1.2 R1 :TCC(定时器时钟) (7)6.1.3 R2:PC (程序计数器和堆栈) (7)6.1.4 R3 :SR(状态寄存器) (10)6.1.5 R4 :RSR(RAM选择寄存器) (10)6.1.6 Bank 0 R5 ~ R6, R8 (Port 5 ~ Port 6, Port 8) (10)6.1.7 Bank 0 R9:TBLP (指令TBRD表指针寄存器) (11)6.1.8 Bank 0 RA:WUPC (唤醒控制寄存器) (11)6.1.9 Bank 0 RB:EECR (EEPROM控制寄存器) (12)6.1.10 Bank 0 RC: EEPA (128 字节 EEPROM 地址) (12)6.1.11 Bank 0 RD: EEPD (128字节EEPROM 数据) (12)6.1.12 Bank 0 RE: OMCR (模式选择寄存器) (12)6.1.13 Bank 0 RF: ISR1 (中断状态寄存器 1) (15)6.1.14 R10 ~ R3F (15)6.1.15 Bank 1 R5~R7 (16)6.1.16 Bank 1 R8 (IRC 选择寄存器) (16)6.1.17 Bank 1 R9: TM1CR1 (定时器/计数器 1控制寄存器1) (16)6.1.18 Bank 1 RA: TM1CR2(定时器/计数器 1控制寄存器 2) (17)6.1.19 Bank 1 RB: TM1DAH (定时器/计数器 1数据缓冲A高字节) (18)6.1.20 Bank 1 RC: TM1DAL (定时器/计数器 1数据缓冲A低字节) (18)6.1.21 Bank 1 RD: TM1DBH (定时器/计数器 1数据缓冲B高字节) (18)6.1.22 Bank 1 RE: TM1DBL (定时器/计数器 1数据缓冲B低字节) (18)6.1.23 Bank 1 RF: ISR2 (中断状态寄存器 2) (19)6.1.24 Bank 2 R5:AISR (ADC输入选择寄存器) (19)6.1.25 Bank 2 R6: ADCON (A/D控制寄存器) (20)6.1.26 Bank 2 R7: ADCON2 (A/D控制寄存器2) (21)6.1.27 Bank 2 R8 : ADDH (AD高 8位数据缓存) (22)6.1.28 Bank 2 R9 : ADDL (AD低4位数据缓存) (22)6.1.29 Bank 2 RA: URCR (UART控制寄存器) (22)6.1.30 Bank 2 RB: URS (UART 状态寄存器) (23)6.1.31 Bank 2 RC: URTD (UART 发送数据缓冲寄存器) (24)6.1.32 Bank 2 RD: URRDL (UART 接收数据低位缓冲寄存器) (24)目录6.1.33 Bank 2 RE: URRDH (UART 接收数据高位缓冲寄存器) (24)6.1.34 Bank 2 RF (24)6.1.35 Bank 3 R5 (24)6.1.36 Bank 3 R6 : TBHP(指令TBRD的表指针寄存器) (24)6.1.37 Bank 3 R7: CMP2CON(比较器2控制寄存器) (25)6.1.38 Bank 3 R8 ~ RC (25)6.1.39 Bank 3 RD :TC3CR (定时器3控制) (25)6.1.40 Bank 3 RE :TC3D (定时器 3 数据缓存) (27)6.1.41 Bank 3 RF (27)6.2 特殊功能寄存器 (28)6.2.1 A (累加器) (28)6.2.2 CONT (控制寄存器) (28)6.2.3 IOC5 ~ IOC6, IOC8 (I/O端口控制寄存器) (28)6.2.4 IOC7, IOC9 (28)6.2.5 IOCA:WDTCR (WDT 控制寄存器) (29)6.2.6 IOCB: P6PDCR (下拉控制寄存器2) (29)6.2.7 IOCC: P6ODCR (漏极开路控制寄存器) (30)6.2.8 IOCD: P9PHCR (上拉控制寄存器2) (30)6.2.9 IOCE:IMR2 (中断屏蔽寄存器2) (31)6.2.10 IOCF: IMR1(中断屏蔽寄存器1) (31)6.3 TCC/WDT 与预分频器 (33)6.4 I/O 端口 (34)6.4.1 使用端口6输入状态改变唤醒/中断功能 (36)6.5 复位和唤醒 (37)6.5.1 复位 (37)6.5.2 总结唤醒和中断模式操作 (39)6.5.3 寄存器初始值的总结 (42)6.5.4 状态寄存器的T和P状态 (49)6.6 中断 (50)6.7 数据EEPROM (52)6.7.1 数据EEPROM控制寄存器 (52)6.7.2 编程步骤 / 举例示范 (52)6.8 模拟数字转换器(ADC) (53)6.8.1 A/D 取样时间 (53)6.8.2 A/D 转换时间 (54)6.8.3 睡眠期间的A/D转换 (54)6.8.4 编程步骤/注意事项 (55)6.9 定时器/计数器1 (TM1) (58)6.9.1 定时器/计数器模式 (58)6.9.2 窗口模式 (59)6.9.3 捕捉模式 (60)6.9.4 可编程分频输出模式和脉冲宽度调制模式 (62)6.9.5 蜂鸣器 (63)6.10 定时器/计数器3 (63)6.11 UART (65)6.11.1 UART 模式 (66)6.11.2 发送 (67)目录6.11.3 接收 (67)6.11.4 波特率发生器 (68)6.11 .5 UART 时序 (68)6.12 比较器 (69)6.12.1 外部参考信号 (69)6.12.2 内部参考电压 (70)6.12.3 比较器输出 (70)6.12.4 中断 (70)6.12.5 从睡眠至唤醒 (70)6.12.6 比较器初始化步骤 (71)6.13 振荡器 (71)6.13.1 振荡模式 (71)6.13.2 晶振 / 陶瓷谐振器(晶体) (72)6.13.3 外部RC振荡模式 (73)6.13.4 内部 RC 振荡模式 (74)6.14 代码选项寄存器 (75)6.14.1 代码选项寄存器 (Word 0) (75)6.14.2 代码选项寄存器(Word 1) (77)6.14.3 客户ID寄存器(Word 2) (78)6.15 上电注意事项 (79)6.16 外部上电复位电路 (79)6.17 残留电压保护 (80)6.18 指令集 (81)7片上调试系统(OCDS) (84)7.1 片上调试的限制 (84)8 时序图 (85)9 绝对最大额定参数 (86)10 DC电气特性 (87)11 AC电气特性 (92)A 编码与制造信息 (93)B 封装类型 (94)C 封装结构 (95)C.1 EM78F811NMS10 (95)C.2 EM78F811NSO14 (96)C.3 EM78F811NAD16 (97)C.4 EM78F811NASO16A (98)D 品质保证和可靠性 (99)D.1 地址缺陷检测 (99)目录规格修订历史目录用户应用注意事项(使用此IC前，应注意如下描述的注意事项，它包含重要信息)1. 如果IRC频率从A频率变为B频率，MCU需要等待一些时间才可以工作。

北京英博有源滤波触摸屏产品说明书版本_V2.0

动态滤波补偿控制器LSVG-2000产品说明指南版本号V2.0目录1.产品说明 (1)1.1.使用要点 (1)1.2.安全守则 (1)1.3.使用条件 (1)2.产品外形与端子定义 (2)2.1.产品外形尺寸 (2)2.2.端子定义 (3)3.LSVG-2000界面结构与说明 (4)3.1LSVG-2000界面结构 (4)3.2LSVG-2000界面说明 (4)4.LSVG-2000通讯功能 (17)附录LSVG-2000与上位机通讯点表 (18)1.产品说明1.1.使用要点本说明书旨在帮助您安全、规范的操作使用控制器在安装和操作控制器之前，请仔细阅读以下事项。

本手册供安装、维护和操作的人员使用。

1.2.安全守则1)不要打开控制器的外壳，因为控制器内部没有可以由用户来维护的部件。

2)不要将本产品用于除原目的以外的其他用途。

1.3.使用条件●海拔高度：海拔1500米以下●环境温度：-10～+40℃●相对湿度：最湿月的月平均最大相对湿度为90%，同时该月的月平均最低温度为25℃时表面无凝露●使用场所：不得有易燃、易爆、腐蚀性气体和液体等危险产品●地震烈度：6级以下●污秽等级：Ⅲ级以下注：其它特殊使用场合、环境条件可定制。

2.产品外形与端子定义2.1.产品外形尺寸LSVG-2000尺寸如表1所示：表1产品尺寸位置长(mm)宽(mm)深(mm)总体226.516336前面板226.51636后面板21315030机柜开孔215152-图1触摸屏外形尺寸图2.2.端子定义触摸屏供电电源为直流24V、1A，配备有专用的电源接口；触摸屏的USB接口为程序维护端口，仅供内部程序更新使用；触摸屏DB9接口包含了1个备用端口（COM1），2个485端口（COM2/COM3）。

表2端子口说明3.LSVG-2000界面结构与说明3.1LSVG-2000界面结构LSVG-2000界面显示结构框图如图2所示，总体由7个部分组成，分别为主画面、运行状态、报警信息、谐波分析、波形显示、专家参数以及用户登录。

PT2041A 规格书说明书

目录1.产品概述 (2)2.主要特性 (2)3.系统框图 (2)4.封装及引脚说明 (3)5.功能描述 (5)5.1输出模式和选项脚位 (5)5.2按键最长输出时间 (5)5.3低功耗模式 (5)5.4灵敏度调整 (5)6.应用电路 (6)7.电气特性 (7)7.1电气特性极限参数 (7)7.2直流特性 (7)8.封装信息 (8)8.1SOT23-6封装 (8)8.2DFN2x2-6L封装尺寸 (9)8.3DFN2x2-6L编带信息 (10)8.4DFN1x1-4L封装尺寸 (11)8.5DFN1x1-4L编带信息 (12)9.历史记录 (12)单触控单输出IC文件编号：PT-DS210071.产品概述PT2041A是一款单通道触摸检测芯片。

该芯片内建稳压电路，提供稳定电压给触摸感应电路使用，同时内部集成高效完善的触摸检测算法，使得芯片具有稳定的触摸检测效果。

该芯片专为取代传统按键而设计，具有宽工作电压与低功耗的特性，可广泛地满足不同消费类应用的需求。

2.主要特性⚫工作电压范围：2.4~5.5V⚫工作温度范围：-40~85℃⚫抗干扰性能优良：内置稳压电路、上电复位、低压复位功能及环境自适应算法等多种措施⚫待机工作电流：典型值2uA@V DD=3V/无负载⚫按键最长响应时间：低功耗模式下约200ms@V DD=3V⚫可接外部电容（1~50pF）调整触摸灵敏度⚫输出模式选择（TOG）：同步输出或锁存（toggle）输出⚫CMOS输出（QC）有效电平选择（AHLB）：高电平或低电平输出有效⚫按键最长输出时间：16秒（±30%）⚫上电约0.4秒的初始化时间，此期间内不要触摸检测点，且此时所有功能被禁止⚫HBM ESD：大于2KV⚫封装形式：SOT23-6、DFN2*2-6L、DFN1*1-4L3.系统框图传感器震荡电路时序计算器 &功能选项控制电路系统振荡电路传感器 &参考检测电路触摸检测电路输出&驱动电路TCHQCTOGAHLB图1 系统框图4.封装及引脚说明QC VSS TCHTOGVDDAHLB 34 PT2041AT6图2 PT2041A SOT23-6管脚示意图TCH VSS QCAHLBVDDTOG65423PT2041AD6 1图3 PT2041A DFN2x2-6L管脚示意图注：引脚布局与SOT23-6反向VDD TCHQCVSS43 2PT2041AD41图4 PT2041A DFN1x1-4L封装管脚示意图注：固定为同步输出模式,输出高电平有效表1引脚说明表223VSS P地312TCH I触摸感应输入46/AHLB I-PL 输出高电平有效或低电平有效选择0（默认值）：高电平有效；1：低电平有效551VDD P电源64/TOG I-PL 输出模式选择0（默认值）：同步输出；1：锁存（toggle）输出引脚类型：I：CMOS输入O：CMOS输出I/O：CMOS输入/输出P：电源/接地I-PH：CMOS输入内置上拉电阻I-PL：CMOS输入内置下拉电阻5.功能描述5.1 输出模式和选项脚位AHLB 和TOG 选项脚位为锁存类型：上电默认状态为0，若上电前管脚被接至VDD ，则上电后状态变为1，且不会有电流漏电。

XH70745B7寸电容触摸屏规格书-杭州旭虹科技有限公司)

边沿区域漏光宽度≤0.25mm
★
边沿区域漏光宽度>0.25mm
★
ITO表面不允许有不可清洁处理的脏
污、水印
★
无法清洁的脏污按点状不良判定
★
FPC 缺陷
凹痕，针孔 a≤w/3
★
开路/划伤线路/裂开
★
氧化，污染
★
FPC 折伤
FPC 折伤/压伤 ;死折（锐角折痕）不
允许，锐角凸起
★
6. Notice 注意事项
NO PART OF THIS SPECIFICATION MAY BE REPRODUCED OR TRANSMITTED IN ANY FORM OR BY ANY MEANS WITHOUT THE EXPRESSED WRITTEN PERMISSION OF WGJ.
工业液晶屏ｈｔｔｐ：／／ｗｗｗ．ｈｚｘｕｈｏｎｇ．ｃｏｍ
80ºC,240hrs -30ºC,240hrs 60ºC/90% RH,240hrs
70ºC,24hrs -20 ºC,24hrs 60ºC/90%RH,24hrs -30 ~ 80℃, 60 Mins/cycle , Total 10
Cycles
4. Touch panel description 触摸屏功能描述
Date 日期 Ver.版
ＨａｎｇｚｈｏｕＸｕＨｏｎｇＴｅｃｈｎｏｌｏｇｙＣｏ．，Ｌｔｄ
History of Version 变更记录
Description 描述
Page 页 Design by 变更人
2016-02-27
A0 在 XH70745A-GDA-A1 基础上更改盖板
10/10
LLL
2016-03-15

WS51F7030 系列物联网 MCU 用户手册说明书

前海维晟WIS EWS51F7030系列物联网MCU用户手册1T 8051内核，8KB Flash ，512B SRAM ，128B EEPROM ，12通道过CS-10V 低功耗Touch Key ，1个5位精度DAC ，3对6通道16位互补输出PWM ，3个通用定时器，1个UART ，1个I2C ，1个WDT ，1个WKT ，软件LED 驱动，软件LCD 驱动版本：1.1深圳前海维晟智能技术有限公司电话：+086-0755-********前海维晟W IS E目录1 特性 .......................................................................................................................................................................... 5 2 概述 .......................................................................................................................................................................... 6 3 命名规则................................................................................................................................................................... 6 4 订购信息................................................................................................................................................................... 7 5 产品信息. (7)5.1 产品资源 ........................................................................................................................................................ 7 5.2 管脚定义 .. (8)5.2.1 封装类型：SOP8 ................................................................................................................................ 8 5.2.2 封装类型：MSOP10 ........................................................................................................................... 8 5.2.3 封装类型：SOP14 .............................................................................................................................. 8 5.2.4 封装类型：SOP16 .............................................................................................................................. 9 5.3 管脚说明 ........................................................................................................................................................ 9 6 总体架构.. (11)6.1 8051内核 (11)6.1.1 简介................................................................................................................................................... 11 6.1.2 寻址方式 ........................................................................................................................................... 11 6.1.3 寄存器描述 ....................................................................................................................................... 12 6.2 芯片结构框图 .............................................................................................................................................. 15 6.3 存储器分布 .................................................................................................................................................. 16 6.4 SFR 映像 ........................................................................................................................................................ 17 7 基本功能.. (19)7.1 外部RAM ..................................................................................................................................................... 19 7.2 Flash 存储器 . (19)7.2.1 Flash 数据区 ...................................................................................................................................... 19 7.2.2 NVR 数据区 ........................................................................................................................................ 21 7.2.3 EEPROM 数据区................................................................................................................................. 23 7.2.4 Checksum 校验 .................................................................................................................................. 24 7.2.5 寄存器描述 ....................................................................................................................................... 24 7.3 IO 端口 . (28)7.3.1 简介................................................................................................................................................... 28 7.3.2 IO 端口功能复用 ............................................................................................................................... 28 7.3.3 寄存器描述 ....................................................................................................................................... 29 7.4 定时器0/1/2 .. (31)7.4.1 定时器0............................................................................................................................................ 31 7.4.2 定时器1............................................................................................................................................ 33 7.4.3 定时器2............................................................................................................................................ 35 7.4.4 寄存器描述 ....................................................................................................................................... 37 7.5 中断系统 (41)7.5.1 简介................................................................................................................................................... 41 7.5.2 外部中断 ........................................................................................................................................... 41 7.5.3 寄存器描述 ....................................................................................................................................... 41 7.6 时钟系统 (46)前海维晟WIS E7.6.2 时钟控制关系 ................................................................................................................................... 46 7.6.3 寄存器描述 ....................................................................................................................................... 46 7.7 复位系统 (48)7.7.1 上电复位（POR ）和掉电复位（BOR ） ......................................................................................... 48 7.7.2 看门狗（WDT ）复位 ....................................................................................................................... 48 7.7.3 低电压检测（LVD ）复位 ................................................................................................................. 48 7.7.4 外部硬复位和内部软复位 ............................................................................................................... 49 7.7.5 寄存器描述 ....................................................................................................................................... 49 7.8 电源管理 (50)7.8.1 LDO (50)7.8.2 IDLE 模式............................................................................................................................................ 50 7.8.3 STOP 模式 .......................................................................................................................................... 50 7.8.4 寄存器描述 (50)8 增强功能 (52)8.1 脉宽调制（PWM ） (52)8.1.1 简介................................................................................................................................................... 52 8.1.2 PWM 工作原理 .................................................................................................................................. 52 8.1.3 寄存器描述 ....................................................................................................................................... 54 8.2 通用串行接口（UART 0） .. (57)8.2.1 简介................................................................................................................................................... 57 8.2.2 UART0 . (57)8.2.3 寄存器描述 ....................................................................................................................................... 60 8.3 I²C 接口（I2C ） .. (62)8.3.1 简介................................................................................................................................................... 62 8.3.2 I2C 总线互联...................................................................................................................................... 62 8.3.3 I2C 通信原理...................................................................................................................................... 62 8.3.4 I2C 工作模式...................................................................................................................................... 63 8.3.5 寄存器描述 ....................................................................................................................................... 63 8.4 看门狗定时器（WDT ） (66)8.4.1 简介................................................................................................................................................... 66 8.4.2 功能描述 ........................................................................................................................................... 66 8.4.3 寄存器描述 ....................................................................................................................................... 66 8.5 自唤醒定时器（WKT ） (68)8.5.1 简介................................................................................................................................................... 68 8.5.2 功能描述 ........................................................................................................................................... 68 8.5.3 寄存器描述 ....................................................................................................................................... 68 8.6 低压差线性稳压器（LDO ） .. (69)8.6.1 简介................................................................................................................................................... 69 8.6.2 内部基准及输出电压校准 ............................................................................................................... 69 8.6.3 LDO 工作模式 .................................................................................................................................... 69 8.6.4 寄存器描述 ....................................................................................................................................... 69 8.7 低电压检测（LVD ） (71)8.7.1 简介................................................................................................................................................... 71 8.7.2 功能描述 . (71)前海维晟W IS E8.8 数模转换器（DAC ） (72)8.8.1 简介................................................................................................................................................... 72 8.8.2 功能描述 ........................................................................................................................................... 72 8.8.3 寄存器描述 ....................................................................................................................................... 73 8.9 触摸按键（Touch Key ） .. (74)8.9.1 简介................................................................................................................................................... 74 8.9.2 工作模式 ........................................................................................................................................... 74 8.10 软件LED 驱动（SLED ） . (75)8.10.1 简介................................................................................................................................................. 75 8.10.2 LED 显示原理 ................................................................................................................................... 75 8.10.3 LED 与Touch Key 共用实现方法..................................................................................................... 75 8.10.4 寄存器描述 ..................................................................................................................................... 76 8.11 软件LCD 驱动（SLCD ） (79)8.11.1 简介................................................................................................................................................. 79 8.11.2 1/2偏压软件LCD ............................................................................................................................ 79 8.11.3 寄存器描述 . (79)9 程序下载和仿真 (81)9.1 程序下载 ...................................................................................................................................................... 81 9.2 在线仿真 ...................................................................................................................................................... 81 10 电气特性 (82)10.1 极限参数 .................................................................................................................................................... 82 10.2 直流电气特性 ............................................................................................................................................ 82 10.3 交流电气特性 ............................................................................................................................................ 84 10.4 POR 电气特性 ............................................................................................................................................. 84 10.5 内部HRC 电气特性 ................................................................................................................................... 85 10.6 内部LRC 电气特性 .................................................................................................................................... 86 10.7 LVD 电气特性 .............................................................................................................................................. 87 10.8 DAC 电气特性 ............................................................................................................................................. 87 11 封装信息 (90)11.1 WS51F7030S08U (SOP8) ............................................................................................................................. 90 11.2 WS51F7030M10U (MSOP10) ...................................................................................................................... 90 11.3 WS51F7030S14U (SOP14) ........................................................................................................................... 91 11.4 WS51F7030S16U (SOP16) ........................................................................................................................... 91 12 附录 ...................................................................................................................................................................... 92 13 版本历史 (99)前海1特性⏹工作电压：⏹工作温度：⏹封装类型：⏹内核：⏹⏹Flash ROM：⏹EEPROM：⏹SRAM：内部⏹时钟（●内置RC●内置RC⏹中断●7●4下沿/⏹定时器●3个16⏹IO端口●14●支持推挽●上拉可选●⏹●1个UART⏹I2C接口（●内置1路快速模式⏹看门狗（●15●8●⏹●可选⏹脉宽调制（●3对6占空比W IS E2 概述WS51F7030系列芯片是基于增强型1T 8051内核的8位微控制器，指令完全兼容传统8051，而运行速度比传统8051快10倍。

MURATA LQW18AN_00系列芯片电容器（芯片电感）产品说明书

SpecNo.JELF243A-0024Y-01 P.1/11Reference OnlyCHIP COIL (CHIP INDUCTORS) LQW18AN □□□□00D REFERENCE SPECIFICATION1.ScopeThis reference specification applies to LQW18AN_00 series, Chip coil (Chip Inductors).2.Part Numbering(ex) LQ W 18 A N 2N2 D 0 0 DProduct ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging(L×W) andD:Taping Characteristics*B:Bulk *Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)3.Rating・Operating Temperature Range. –55°C to +125°C ・Storage Temperature Range. –55°C to +125°CCustomer Part NumberMURATA Part NumberInductance Q (min.)DC Resistance (Ω max.)Self Resonant Frequency (MHz min.)Rated Current (mA)(nH)ToleranceLQW18AN2N2D00D 2.2D:±0.5nH 160.042 6000700LQW18AN3N6C00D 3.6C:±0.2nH D:±0.5nH250.059 850LQW18AN3N6D00D LQW18AN3N9C00D 3.935LQW18AN3N9D00D LQW18AN4N3C00D 4.3 LQW18AN4N3D00D LQW18AN4N7D00D 4.7D:±0.5nHLQW18AN5N6C00D 5.6C:±0.2nH D:±0.5nH0.082 750LQW18AN5N6D00D LQW18AN6N2C00D 6.2 LQW18AN6N2D00D LQW18AN6N8C00D 6.8 LQW18AN6N8D00D LQW18AN7N5C00D 7.5 LQW18AN7N5D00D LQW18AN8N2C00D 8.20.11 650LQW18AN8N2D00D LQW18AN8N7C00D 8.7 LQW18AN8N7D00D LQW18AN9N1C00D 9.1 LQW18AN9N1D00D LQW18AN9N5D00D 9.5D:±0.5nHLQW18AN10NG00D 10G:±2% J:±5%LQW18AN10NJ00D LQW18AN11NG00D 11 LQW18AN11NJ00D LQW18AN12NG00D 120.13 600LQW18AN12NJ00D LQW18AN13NG00D 13 LQW18AN13NJ00D LQW18AN15NG00D 1540 LQW18AN15NJ00D LQW18AN16NG00D 160.165500550LQW18AN16NJ00D LQW18AN18NG00D 18 LQW18AN18NJ00D LQW18AN20NG00D 204900LQW18AN20NJ00D LQW18AN22NG00D 220.17 4600 500LQW18AN22NJ00DSpecNo.JELF243A-0024Y-01 P.2/11Reference OnlyCustomerPart NumberMURATA Part NumberInductance Q (min.)DC Resistance (Ω max.)Self Resonant Frequency (MHz min.)Rated Current (mA)(nH)ToleranceLQW18AN24NG00D 24 G:±2%J:±5%400.213800 500LQW18AN24NJ00D LQW18AN27NG00D 27 3700 440 LQW18AN27NJ00D LQW18AN30NG00D 300.23 3300420LQW18AN30NJ00D LQW18AN33NG00D 33 3200 LQW18AN33NJ00D LQW18AN36NG00D 360.26 2900400LQW18AN36NJ00D LQW18AN39NG00D 39 2800 LQW18AN39NJ00D LQW18AN43NG00D 430.292700380LQW18AN43NJ00D LQW18AN47NG00D 47382600 LQW18AN47NJ00D LQW18AN51NG00D 51 0.33 2500 370LQW18AN51NJ00D LQW18AN56NG00D 56 0.35 2400 360LQW18AN56NJ00D LQW18AN62NG00D 62 0.51 2300 280LQW18AN62NJ00D LQW18AN68NG00D 68 0.38 2200 340 LQW18AN68NJ00D LQW18AN72NG00D 72340.56 2100270LQW18AN72NJ00D LQW18AN75NG00D 75 2050LQW18AN75NJ00D LQW18AN82NG00D 82 0.60 2000 250LQW18AN82NJ00D LQW18AN91NG00D 91 0.64 1900 230 LQW18AN91NJ00D LQW18ANR10G00D 1000.68 1800 220 LQW18ANR10J00D LQW18ANR11G00D 110321.2 1700 200 LQW18ANR11J00D LQW18ANR12G00D 120 1.3 1600 180 LQW18ANR12J00D LQW18ANR13G00D 130 1.4 1450 170 LQW18ANR13J00D LQW18ANR15G00D 150 1.5 1400 160 LQW18ANR15J00D LQW18ANR16G00D 1602.1 1350 150 LQW18ANR16J00D LQW18ANR18G00D 18025 2.2 1300 140 LQW18ANR18J00D LQW18ANR20G00D 200 2.4 1250120LQW18ANR20J00D LQW18ANR22G00D 220 2.5 1200LQW18ANR22J00D LQW18ANR27G00D 270303.4 960 110 LQW18ANR27J00D LQW18ANR33G00D 3305.580085LQW18ANR33J00D LQW18ANR39G00D 390 6.2 80 LQW18ANR39J00D LQW18ANR47G00D 4707.0 700 75LQW18ANR47J00DSpecNo.JELF243A-0024Y-01 P.3/11Reference Only4. Testing Conditions《Unless otherwise specified》《In case of doubt》Temperature : Ordinary Temperature / 15°C to 35°C Temperature: 20°C±2°CHumidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)Atmospheric Pressure : 86kPa to 106 kPa5.Appearance and Dimensions■Unit Mass (Typical value)0.003g(in mm).Reference OnlySpecNo.JELF243A-0024Y-01 P.4/11SpecNo.JELF243A-0024Y-01 P.5/11Reference Only8.Environmental Performance It shall be soldered on the substrate.No. Item Specification Test Method 8.1 Heat Resistance Appearance:No damage Inductance Change: within ±5% Q Change: within ±20% Temperature:125°C±2°CTime:1000h (+48h,0h) Then measured after exposure in the room condition for 24h±2h.8.2 Cold Resistance Appearance:No damage Inductance Change: within ±5% Q Change: within ±20%Temperature:-55°C±2°CTime:1000h (+48h,-0h) Then measured after exposure in the roomcondition for 24h±2h.8.3 Humidity Temperature:40°C±2°CHumidity:90%(RH) to 95%(RH) Time:1000h (+48h,-0h)Then measured after exposure in the room condition for 24h±2h.8.4 Temperature Cycle 1 cycle:1 step:-55°C±2°C / 30min±3 min2 step:Ordinary temp. / 10min to 15 min3 step:+125°C±2°C / 30min±3 min4 step:Ordinary temp. / 10min to15 min Total of 10 cyclesThen measured after exposure in the room condition for 24h±2h.9.Specification of Packaging9.1 Appearance and Dimensions of paper tape (8mm-wide)(in mm)9.2 Specification of Taping(1) Packing quantity (standard quantity)4,000 pcs. / reel(2) Packing MethodProducts shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket holeThe sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced pointBase tape and Top tape has no spliced point. (5) Missing components numberMissing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept.9.3 Pull StrengthTop tape 5N min.Bottom tape4.0±0.1φ1.5±2.0±0.054.0±0.1Direction of feed1.1max.1.0±0.051.8±0.058.0±0.23.5±0.051.75±0.10.10SpecNo.JELF243A-0024Y-01 P.6/11Reference Only9.4 Peeling off force of cover tapeSpeed of Peeling off 300mm/min Peeling off force0.1N to 0.6N(minimum value is typical)9.5 Dimensions of Leader-tape,Trailer and ReelThere shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.9.6 Marking for reelCustomer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking (∗2), Quantity etc ･･･∗1) <Expression of Inspection No.> □□ OOOO ×××(1) (2) (3)(1) Factory code(2) Date First digit: Year / Last digit of yearSecond digit: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day(3) Serial No.∗2) <Expression of RoHS Marking >ROHS – Y (△)(1) (2)(1) RoHS regulation conformity parts.(2) MURATA classification number9.7 Marking for Outside package (corrugated paper box)Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･9.8. Specification of Outer CaseOuter Case Dimensions(mm)Standard Reel Quantityin Outer Case (Reel)W D H 186 186 93 5∗ Above Outer Case size is typical. It depends on a quantity of an order.10. ！ CautionLimitation of ApplicationsPlease contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the aboveF165to 180degreeTop tapeBottom tape Base tapeWDLabelHSpecNo.JELF243A-0024Y-01 P.7/11Reference Only11. NoticeProducts can only be soldered with reflow.This product is designed for solder mounting.Please consult us in advance for applying other mounting method such as conductive adhesive.11.1 Land pattern designingRecommended land patterns for reflow soldering are as follows:These have been designed for Electric characteristics and solderability.Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process.(in mm)11.2 Flux, Solder・Use rosin-based flux.Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder.・Standard thickness of solder paste : 100μm to 150μm.11.3 Reflow soldering conditions・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.・Standard soldering profile and the limit soldering profile is as follows.The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality.・Reflow soldering profileStandard Profile Limit Profile Pre-heating 150°C ～180°C 、90s ±30s Heating above 220°C ､30s ～60s above 230°C ､60s max. Peak temperature 245°C ±3°C 260°C,10s Cycle of reflow 2 times 2 timesA 0.6 to 0.8B 1.9 to 2.0 C0.7 to 1.0Limit ProfileStandard Profile90s±30s230℃260℃245℃±3℃220℃30s ～60s60s max.180150Temp.(s)(℃)Time.resistSpecNo.JELF243A-0024Y-01 P.8/11Reference Only11.4 Reworking with soldering ironThe following conditions must be strictly followed when using a soldering iron.Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)sTime 2 timesNote :Do not directly touch the products with the tip of the soldering iron in order to prevent thecrack on the products due to the thermal shock.11.5 Solder Volume・Solder shall be used not to be exceeded the upper limits as shown below.・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.1/3T ≦t ≦TT ：thickness of product11.6 Product’s locationThe following shall be considered when designing and laying out P.C.B.'s.(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.［Products direction ］Products shall be located in the sidewaysdirection (Length:a ＜b) to the mechanical stress.(2) Components location on P.C.B. separation.It is effective to implement the following measures, to reduce stress in separating the board.It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress.Contents of MeasuresStress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part.A >B (3) Keep the mounting position of the component away from the board separation surface. A > C*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.〈Poor example〉〈Good example〉baSeamSlitADBCbaLength:a <bReference OnlySpecNo.JELF243A-0024Y-01 P.9/11(3) Mounting Components Near Screw HolesWhen a component is mounted near a screw hole, it may be affected by the board deflection that occurs duringthe tightening of the screw. Mount the component in a position as far away from the screw holes as possible.11.7 Cleaning ConditionsProducts shall be cleaned on the following conditions.(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonancephenomenon at the mounted products and P.C.B.Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.(3) Cleaner1. Alcohol type cleanerIsopropyl alcohol (IPA)2. Aqueous agentPINE ALPHA ST-100S(4) There shall be no residual flux and residual cleaner after cleaning.In the case of using aqueous agent, products shall be dried completely after rinse with de-ionizedwater in order to remove the cleaner.(5) Other cleaning Please contact us.11.8 Resin coatingThe inductance value may change due to high cure-stress of resin to be used for coating/molding products.An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, oroperating condition etc. Some resin contains some impurities or chloride possible to generate chlorine byhydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.So, please pay your careful attention in when you select resin in case of coating/molding the productswith the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating productsmounted on your board.11.9 Caution for use・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the winding portion to prevent the breaking of wire.・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.11.10 Notice of product handling at mountingIn some mounting machines,when picking up components support pin pushes up the components from thebottom of base tape. In this case, please remove the support pin. The support pin may damage the componentsand break wire.In rare case ,the laser recognition can not recognize this component. Please contact us when you use laserrecognition. (There is no problem with the permeation and reflection type.)11.11 Handling of a substrateAfter mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to thesubstrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screwto the substrate.Excessive mechanical stress may cause cracking in the product.Bending TwistingReference OnlySpecNo.JELF243A-0024Y-01 P.10/1111.12 Storage and Handing Requirements(1) Storage periodUse the products within 12 months after delivered.Solderability should be checked if this period is exceeded.(2) Storage conditions・Products should be stored in the warehouse on the following conditions.Temperature ：-10°C to 40°CHumidity ：15% to 85% relative humidity No rapid change on temperature and humidity・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may causeoxidization of electrode, resulting in poor solderability.・Products should not be stored on bulk packaging condition to prevent the chipping of thecore and the breaking of winding wire caused by the collision between the products.・Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.(3) Handling ConditionCare should be taken when transporting or handling product to avoid excessive vibration ormechanical shock.12．! Note(1)Please make sure that your product has been evaluated in view of your specifications with our product beingmounted to your product.(2)You are requested not to use our product deviating from the reference specifications.(3)The contents of this reference specification are subject to change without advance notice.Please approve our product specifications or transact the approval sheet for product specificationsbefore ordering.Reference OnlySpecNo.JELF243A-0024Y-01 P.11/11Mouser ElectronicsAuthorized DistributorClick to View Pricing, Inventory, Delivery & Lifecycle Information:M urata:LQW18AN10NG00D LQW18AN10NJ00D LQW18AN11NG00D LQW18AN11NJ00D LQW18AN12NG00D LQW18AN12NJ00D LQW18AN13NG00D LQW18AN13NJ00D LQW18AN15NG00D LQW18AN15NJ00D LQW18AN16NG00D LQW18AN16NJ00D LQW18AN18NG00D LQW18AN18NJ00D LQW18AN20NG00D LQW18AN20NJ00D LQW18AN22NG00D LQW18AN22NJ00D LQW18AN24NG00D LQW18AN24NJ00D LQW18AN27NG00D LQW18AN27NJ00D LQW18AN2N2D00D LQW18AN30NG00D LQW18AN30NJ00D LQW18AN33NG00D LQW18AN33NJ00D LQW18AN36NG00D LQW18AN36NJ00D LQW18AN39NG00D LQW18AN3N6C00D LQW18AN3N6D00D LQW18AN3N9C00D LQW18AN3N9D00D LQW18AN43NG00D LQW18AN43NJ00D LQW18AN47NG00D LQW18AN47NJ00D LQW18AN4N3C00D LQW18AN4N3D00D LQW18AN4N7D00D LQW18AN51NG00D LQW18AN51NJ00D LQW18AN56NG00D LQW18AN56NJ00D LQW18AN5N6C00D LQW18AN5N6D00D LQW18AN62NG00D LQW18AN62NJ00D LQW18AN68NG00D LQW18AN68NJ00D LQW18AN6N2C00D LQW18AN6N2D00D LQW18AN6N8C00D LQW18AN6N8D00D LQW18AN72NG00D LQW18AN72NJ00D LQW18AN75NG00D LQW18AN75NJ00D LQW18AN7N5D00D LQW18AN82NG00D LQW18AN82NJ00D LQW18AN8N2D00D LQW18AN8N7D00D LQW18AN91NG00D LQW18AN91NJ00D LQW18AN9N1D00D LQW18AN9N5D00D LQW18ANR10G00D LQW18ANR10J00D LQW18ANR11G00D LQW18ANR11J00D LQW18ANR12G00D LQW18ANR12J00D LQW18ANR13G00D LQW18ANR13J00D LQW18ANR15G00D LQW18ANR15J00D LQW18ANR16G00D LQW18ANR16J00D LQW18ANR18G00D LQW18ANR18J00D LQW18ANR20G00D LQW18ANR20J00D LQW18ANR22G00D LQW18ANR22J00D LQW18ANR27G00D LQW18ANR27J00D LQW18ANR33G00D LQW18ANR33J00D LQW18ANR39G00D LQW18ANR39J00D LQW18ANR47G00D LQW18ANR47J00D LQW18AN9N1C00D LQW18AN8N7C00D LQW18AN7N5C00D LQW18AN8N2C00D。

国巨电容规格书

Example:
CC 0805 K K X7R 9 B N 104
Code 1~2 Series Name CC = Multi-layer
chip cap. CA = Cap. Array CL=Low. Inductance
Code 3~6
Size Code
inches (mm)
0402 (1005)
Tanδ≤ 5% or ≤ 7%, 25V/50V depending on capacitance value
Tan δ ≤ 4%, 50V Tan δ ≤ 6%, 25V
Tanδ≤ 9% or ≤12.5%, Tan δ ≤ 9%, 16V 16V depending on capacitance value
-1-
YAGEO CORPORATION
3. ELECTRICAL CHARACTERISTICS
Characteristics
Operation temperature range Temperature characteristic/coefficient (TC) Capacitance tolerance
C ≥ 10pF Tan δ ≤ 10 x 10-4
±15%
±10%, ±20%
Tan δ ≤ 2.5%, 50V Tan δ ≤ 2.5%, 25V Tan δ ≤ 3.5%, 16V Tan δ ≤ 5%, 10V
+30% to –80%
+22% to –56%
±20%, -20%~+80% ±20%, -20%~+80%
Tan δ ≤ 12.5%, 10V
Insulation resistance(IR)

产品规格书

9
控制方式
同步控制伎持双备份
10
控制距离
超五类双绞网线，超过100米使用光纤传输
11
软件接口
Windows
12
信号输入
RJ45
(7)屏体运行参数
1
工作电压
AC:n0V~240V∖50~60Hz伎持双备份
2
峰值功率
≤400W∕m2
3
平均功率
100W∕m2〜180W∕m2
4
连续工作时间
≥7×24hrs,支持连续不间断显示
1
LED种类
SMD1515
2
像素点间距
1.875mm
3
像素点组成
IRlGlB
（3）模组技术参数
1
模组分辨率（宽*高）
160像素*90像素
2
模组尺寸（宽X高）
（宽）30Ommχ（高）168.75mm
3
模组信号输入
支持精密镀金接插件直连
4
模组电源输入
支持精密镀金接插件直连
5
模组数据存储
支持数据存储
6
电磁兼容
5
平均无故障工作时间
>1000H
6
LED寿命
10万小时
7
离散失控点
<0.001,出厂时为0
8
连续失Hale Waihona Puke 点09盲点率
≤0.001,出厂时为0
10
屏幕温升(使用运行状态)
M5度
11
运彳再境温度
-10℃-60℃
12
运行环境湿度
10%~90%RH,猿结
注：参数指标根据项目的具体情况会有变化(产品按照提交合同规格书为准)

CPT213B 电容触摸感应评估板用户指南说明书

UG294: CPT213B SLEXP8019A Kit User's GuideThe CPT213B Capacitive Sense Evaluation Board is an excellent starting point to get familiar with Capacitive Sense touch pads.The device serves as a user input peripheral for application development. The device can be configured for different touch sense capabilities and also contains easy access breakout pads and other peripherals for user feedback.The kit includes the following:KEY FEATURES•CPT213B Capacitive Sense device with I2C•20-pin expansion header for connection with a Silicon Labs Starter Kit (EFM8 or EFM32)•Breakout test points for easy access to touch pads•Power sources include USB and EXT Header•13 Capacitive Sense touch pads•CPT213B Capacitive Sense Evaluation Board• 1 x acrylic overlay•Getting Started card • 1 x mini USB cableNo tR e co mme nd edf or N e wDe si g n s1. Getting StartedHardwareTo set up the hardware for the CPT213B SLEXP8019A kit:1.Provide power to the board by connecting the DBG USB connector to the PC using the provided USB cable. When a connectionhas been established successfully, the LED (marked in the picture) lights up.2.Place the acrylic overlay on the board over the capacitive sense pads.Figure 1.1. Hardware SetupSoftwareThe first step to get started with your new CPT213B SLEXP8019A kit is to go to/simplicityThe Simplicity Studio software package contains all the tools, drivers, software examples, and documentation needed to use the CPT213B Capacitive Sense Evaluation Board. The board comes preconfigured for a Touch Demo for use with the acrylic overlay. The demo enables the board to recognize touch events and touch release events. Every time a touch is sensed, the touch is communicated on the I2C interface.After downloading the latest version of Simplicity Studio and installing the software:1.In the [Launcher], select [CPT213B] in [Device] pane. On the board, a successful USB connection is established when the LEDnext to the USB connector turns on.2.In the [Launcher], under [Compatible Tools], click the [Capacitive Sense Profiler] tile. This utility graphs touch-related data andevents received from the CPT213B SLEXP8019A for evaluation and analysis.Getting Started NotRecommendedfors2. Kit Block DiagramAn overview of the CPT213B Capacitive Sense Evaluation Board is shown in the figure below.Figure 2.1. CPT213B SLEXP8019A Block DiagramKit Block DiagramNo tR e co mm3. Kit Hardware LayoutThe layout of the CPT213B Capacitive Sense Evaluation Board is shown below.Expansion HeaderCapacitive Touch PadsConfig and CPT213B DeviceToolStick BaseAdapterFigure 3.1. CPT213B SLEXP8019A Hardware LayoutThe CPT213B device on the kit can be connected to external peripherals other than the assigned pin functions using the vias on the board. The table below shows all of the external connections to the fixed function CPT213B device.Table 3.1. CPT213B Device Connectionsd edf or N e wDe si g n sNo tR e co mme nd edf or N e wDe si g n s4. Power and Operation4.1 Power SelectionThe CPT213B Capacitive Sense Evaluation Board is designed to be powered by two different sources:•Through the on-board USB.•Through the EXP header.The figure shows how the different power sources are connected to the device.Figure 4.1. CPT213B SLEXP8019A Power SupplyWhen the USB is connected, the board is powered from the LDO internal to the USB device, which is in turn powered by the USB cable.The board can also be powered externally through the VMCU and GND pins of the expansion header when the board is attached to a power supply or an EFM MCU Starter Kit.When power is provided through the USB or an external power supply, the device can act as a stand alone device. When it is connec-ted to an EFM MCU Starter Kit through the expansion header, the device acts as a peripheral to the MCU by providing capacitive sense capabilities.4.2 StandaloneIn standalone mode, the CPT213B SLEXP8019A on the CPT213B Capacitive Sense Evaluation Board is designed to showcase and test the board's features or act as a breakout board for any application. To operate in this mode, apply power using the USB connector or an external supply.The board can operate on its own to demonstrate and test the board's touch features and functionalities. The CPT213B SLEXP8019A features configurable options such as touch characteristics, output characteristics, and user feedback peripherals. The device's fea-tures can be configured in Simplicity Studio using [Xpress Configurator ], and the capacitive sense data can be viewed in the [Capaci-tive Sense Profiler ].The touch qualification engine on the device will process the touch information and output the results through I2C. The device outputs can be accessed through the expansion header, and the capacitive sense inputs can be accessed through the vias on the board.No tR e co mme nd edn s4.3 Connected to the Expansion HeaderThe CPT213B Capacitive Sense Evaluation Board is designed to quickly attach to any EFM32 and EFM8 MCU starter kit and jump-start the development of capacitive sense capable applications. Attach the CPT213B Capacitive Sense Evaluation Board to the STK through the expansion header to connect the power and communication pins.To see how the board works in conjunction with the MCU starter kit, go to the starter kit's [Demos ] under [Getting Started ] in Simplicity Studio and run [CPT213B Demo ].For more details on the starter kit, see the corresponding starter kit's user guide.Note: Not all EFM32 starter kits support this expansion board. See the available demos in Simplicity Studio for more information.Figure 4.2. CPT213B SLEXP8019A Connected to an Example EFM8BB2 STKNo tR e co mme nd edf or N e wDe si g n s5. PeripheralsThe starter kit has a set of peripherals that showcase some of the features of the CPT213B device.Be aware that some CPT213B I/O routed to peripherals are also routed to the breakout pads. This must be taken into consideration when using the breakout pads for your application.5.1 Capacitive Sense Touch PadsThe kit has 13 capacitive sense touch pads. The touch pads are connected in order to pins CS00 - CS12 of the CPT213B SLEXP8019A. After the touch pad inputs have been processed by the touch qualification engine, the CPT213B SLEXP8019A will out-put the result through I2C.The capacitive sense inputs can be configured for different thresholds, debounce counter values, scan periods, gain, scanning meth-ods, touch time-outs, and touch exclusiveness using the [Xpress Configurator ] in Simplicity Studio. The device outputs can also be configured for different pin polarities and drive strength.See the CPT213B SLEXP8019A Data Sheet for more detailed information on the different configurations.CPT213B DeviceFigure 5.1. Capacitive Sense Touch PadsNo tR e co mme nd ee si g n s6. Connectors6.1 Test PointsThe test points located on the left of the touch pads are routed to the capacitive sense input traces and power rails.The capacitive sense input traces can be accessed through the vertically aligned vias located in middle of the board on the left of the touch pads. All 13 CPT213B capacitive sensing touch pads are bound to each via.At the bottom left corner of the board, there are two test points for VMCU labeled "ST1" to measure the active current of the board using an in-circuit ammeter. A 2.54 mm pitch pin header can be soldered in for easy access to these pins.Note: In order for the capacitive sense pins to be connected properly to your application or power to be measured correctly, the 0 ohm resistors must be removed. The 0 ohm resistor for a channel can be found next to the corresponding via on the top side of the board.At the top left corner of the board, there are three test points for Config Clk, Config Data, and GND to allow programming of external CPT devices.CS00CS01CS02CS03CS04CS05CS06CS07CS08CS09CS10CS11CS12Figure 6.1. Breakout PadsNo tR e co mme nd edf or N e wDe si g n s6.2 Expansion HeaderOn the left hand side of the board is a female expansion header to connect to a Silicon Labs EFM8 or EFM32 Starter Kit (STK). The connecter contains a number of output and communication pins that can be used to communicate with the MCU on the STK. The re-sults from the touch qualification engine are routed out to these pins. Additionally, the VMCU, 3V3, and 5V power rails are also impor-ted. The figure below shows the pin assignment of the expansion header.The CPT213B SLEXP8019A outputs using I2C.The pin assignment of the expansion header and the peripheral function are listed below in the figure and table.EB_INT RSTb EB_SDA EB_I2CNC NC NC NC NC NC NCNCNC NC CPT PinFigure 6.2. Expansion HeaderTable 6.1. Pins available on Expansion HeaderNo tR e co mf or N e wDe si g n s7. Simplicity StudioFigure 7.1. Simplicity StudioNo tR e co mme nd edf or N e wDe si g n s7.1 Xpress Configurator[Xpress Configurator ] provides the necessary tools to modify the CPT213B SLEXP8019A's functionalities for a custom application in an easy-to-use GUI. To use [Xpress Configurator ] within Simplicity Studio:1.Provide power to the board by connecting the USB connector to the PC using the provided USB cable.2.Select [CPT213B ] in the [Device ] pane.3.Go to [Compatible Tools ] and click the [Xpress Configurator ] tile.4.Select the desired configuration for the engine and peripherals.More information about each of the options in [Xpress Configurator ] is available in AN957: "TouchXpress Configuration and Profiling Guide." Application notes can be accessed within Simplicity Studio under [Documentation ] or on the Silicon Labs website (/interface-appnotes ).Figure 7.2. Simplicity Studio Xpress ConfiguratorNo tR e co mme nd edf or N e wDe si g n s7.2 Capacitive Sense ProfilerThe [Capacitive Sense Profiler ] in Simplicity Studio displays touches, raw and processed data, and noise information in a simple-to-use GUI. Touch and release any of the capacitive sensing peripherals on the board and the profiler will display the data in a table and as a graph over time.To access and setup the [Capacitive Sense Profiler ] in [Simplicity Studio ]:1.Provide power to the board by connecting the USB connector to the PC using the provided USB cable.2.select the [CPT213B ] kit in the [Device ] pane.3.Go to [Compatible Tools ] and select the [Capacitive Sense Profiler ] tile.4.In the [Control Panel ], click [Use Device...] .Once the board is connected, touch and release any of the capacitive sensing touch peripherals on the board to view the raw and pro-cessed data. The profiler can view the data as [Raw Data ], [Noise ], and [Buttons ]. The Buttons view is particularly useful since it shows the state of the capacitive sense touch pads as either on or off.More information about [Capacitive Sense Profiler ] is available in AN957: "TouchXpress Configuration and Profiling Guide." Applica-tion notes can be accessed within Simplicity Studio under [Documentation ] or on the Silicon Labs website (/interface-appnotes ).Figure 7.3. Simplicity Studio Capacitive Sense ProfilerNo tR e co mme nd edf or N e wDe si g n s8. Advanced Energy MonitorWhen the CPT213B Capacitive Sense Evaluation Board is connected to a Silicon Labs STK, the STK's Advanced Energy Monitor (AEM) hardware also measures the CPT213B power consumption using the VMCU connection on the EXP header. By using the [Ener-gy Profiler ] in Simplicity Studio, current consumption and voltage can be measured in real time.More details about AEM and its operation can be found in the STK User Guide. Note that AEM will measure the current for all circuitry connected to VMCU, including the STK MCU and the CPT device.Figure 8.1. Measuring CPT213B SLEXP8019A Current Using AEMAdvanced Energy MonitorNo tR e co mme nd edf or g n s9. Schematics, Assembly Drawings, and BOM9.1 Board FilesThe schematics, assembly drawings and bill of materials (BOM) for the CPT213B Capacitive Sense Evaluation Board are available through Simplicity Studio when the kit documentation package has been installed. To access these documents, click the [Kit Docu-mentation ] tile after selecting the device in the left pane.9.2 Board Revision History •A00 — Initial production revision.A00 Revision BoardsThese boards do not currently have any known issues.Schematics, Assembly Drawings, and BOMNo tR e co mme nd edf or N e wDe si g n sSilicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASimplicity StudioOne-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux!IoT Portfolio /IoTSW/HW/simplicityQuality/qualitySupport and CommunityDisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.No tR e co md edf or N e wDe si g n s。

电容触摸屏控制器规格书

Customer Approval
Hale Waihona Puke HIGGSTEC INCORPORATED
8 F., No. 609, Wan Shou Rd., Sec. 1, Kweishan, Taoyuan Hsien 33350, Taiwan. TEL：886-2-8209-9696 FAX：886-2-8200-3030 E-mail：info@
萬達光電科技股份有限公司
PRODUCT
SPECIFICATIONS
Customer： Model： Controller for 15” PCT (Provisional) Mode： Projected Capacitive USB controller Date： Sep. 29, 2011 Version： 1.0
Approve
Review
Preparation
Andy
Eric
Jason
OVERVIEW
The touch screen controller provides the optimistic performance for projected capacitive touch panels. It communicates with PC system directly through USB port. The touch screen device driver emulates mouse left and right button.
HARDWARE SPECIFICATIONS
Circuit Board Dimension Power Requirements Operation Temperature Storage Tempeture Relative Humidity Interface Resolution Report Rate Response Time 105.00 mm x 28.00 mm D.C.+5V (100mA typical, 50mV peak to peak maximum ripple and noise) -25 to 80 ℃ -55 to 150 ℃ 95% at 60 ℃,RH Non-condensing USB 1.1 Full speed 2048 * 2048 Max. USB: 120 points/sec Max. 25 ms

15英寸电容触摸屏显示器用户手册说明书

TCM006Table of ContentsChapter I: Overview21.1 Safety Information21.2 Electromagnetic Compatibility Statement3 Chapter II: Installation Guide32.1 Appearance of TCM006 Touch Screen Monitor:42.2 The Rear Panel I/O Signs and Description:4Key Function:5 Chapter III: Instructions for Installation63.1 Touch Screen Driver Installation:6 Chapter IV: Common Problems and Solutions15 No display on the screen15 Characters look too dark or too light15 The monitor display needs to be adjusted15 The text on the screen is unclear or blurred15 Touch panel doesn’t respond15Chapter I: OverviewDear Valued Customer,Thank you for purchasing 3nStar products. We are committed to continuously maintaining the product quality and providing better after-sales service. In order to take full advantage of our devices, we recommend reading through this manual before the driver installation.1.1 Safety Information●TCM006 is fully compliant with the relevant requirements of the national standardGB/4943-2001 IT equipment security.●Make sure the electricity meets the power requirements (such as voltage, frequency)before installation and power outlet are properly grounded.●Lightning may damage the product. Unplug the network cable, power cable or anyother conductors during lightning storms.●Do not unplug the components and connections (except for the USB device) when thepower is on.●Do not open the cabinet of the product by a non-professional technician.●Do not leave any item or liquid inside the product. Do not place any objects into theventilation holes, it may cause short-circuit of the internal components and may causefire or electric shock.●In accordance with the national standards GB/T9813-2000 microcomputers generalspecification, after the computer is below the temperature of 10 ° C, place the machinein room temperature (10-35 ° C) conditions for more than two hours to avoid damagefrom low temperature. In the meantime, please do not remove the casing but allow thecomputer to restore the natural temperature. Avoid heating the unit up too fast becausethe computer may generate frost and condensation that might damage the electricalcomponents.●This unit is in strict compliance with the electrical appliance standards.●Safe use voltage range: 100V ~ 240V & 50Hz/60Hz.●Verify that the power outlet is available to connect to a reliable ground circuit.●Keep the device clean, dry, away from dust, moisture and direct sunlight.●Do not share the same power outlet with high-power consumption electrical devices.Keep distance from high level magnetic interference.●Turn off the power to the monitor after use to extend useful life.●Do not use sharp points with, draw on or cut the touch screen to ensure a normal lifecycle.●Switch off the power supply before plugging in or unplugging the communication cableor connecting to an external device.●Unauthorized and unqualified technicians should not open the machine, or they assumeall risks and may damage the unit.When any of the following occurs:●Liquid penetrates into the body of the monitor●Monitor is accidentally damaged●Monitor produces a burning smell●Monitor display is suddenly abnormal or distortedDisconnect the power supply immediately, unplug the power cord and contact a qualified service technician to service the unit.1.2 Electromagnetic Compatibility Statement●TCM006 is fully compliant with the relevant requirements of the national standards(GB/9254-1998) “The limits and measurement methods of radio disturbancecharacteristics of information technology equipment” for Class B products.●TCM006 is fully compliant with the relevant requirements of the People's Republic ofChina’s national standards of (GB/17625.1-2003) “Electromagnetic CompatibilityLimits for harmonic current emission limits” for Class B products.Chapter II: Installation Guide2.1 Appearance of TCM006 Touch Screen Monitor:2.2 The Rear Panel I/O Signs and Description:A row of the external device connection interface is located at the rear bottom panel of the monitor, such as: power outlet, Line in, VGA and USB interface, detailed as follows:●TOUCH USB: this is connected to PC’s USB Ports, used for touch function●DC In: 12V DC in, power supply for the touch monitor.●VGA In: This is connected to PC’s VGA output port.Key Function:●Menu: Press this button to get a pop-up OSD menu, and enter the menu item (function)highlighted while the OSD menu is activated.●ON/OFF: Turn the LCD power on and off. When the power is on, the light is showinggreen, stand by will be red●UP: Press this button to increase the value of the function selected or move to theprevious function●Down: Press this button to decrease the value of the function selected or move to theprevious function●AUTO/EXIT: Press this button to apply the monitor setting automatically and Exit theOSD menuTCM006 touch screen monitor uses a manual handle design which is able to be adjusted within the range of 0 degrees to 90 degrees to make operation and viewing more comfortable.Chapter III: Instructions for Installation3.1 Touch Screen Driver Installation:Step 1: Open the installer directory on the CD, double-click “Setup.exe”Step 2: Installation begins as the following figure shows. Click Next to proceed to the next step.Step 3: Installation in progressStep 4: Click “Install PS/2 interface driver” and click “Next” to proceed with the installation.Step 5: For the touch interface RS232, click “Install RS232 interface driver” and click “Next” to proceed with the installation.Step 6: When choosing the calibrations, select NONE and click “Next” to proceed with the installation.Step 7: When installing USB touch, please connect the USB controller and USB cable.Step 8: When using two or more touch screens, please select “Support multi- monitor system”.Step 9: Select the destination location to store the driver. The default path isC: \ Program Files \ eGalaxtouch. Use the default path here and click “Next” toproceed with the installation.Click “Next” to proceed with the installation.Step 10: Select the option to create a desktop shortcut icon.After installing the driver successfully, identify the USB controller card and RS232 control card as the following two figures show:Related touch function settingTouch device line testTouch screen settingTouch device edge correction setting Touch device hardware information displayChapter IV: Common Problems and SolutionsNo display on the screen●Power saving mode is on, press any key on the keyboard or move the mouseto activate.●The pins of the VGA cable connector are bent or lost contact to the VGAinterface. Change the VGA cable. If the problem still persists, bring the unit to an authorized service provider.Characters look too dark or too lightUse the OSD Menu to adjust the brightness.The monitor display needs to be adjustedThe resolution frequency should be changed.The text on the screen is unclear or blurredMake sure the resolution or refresh rate are compatible with the Display Mode. Touch panel doesn’t respondMake sure the touch screen driver is installed properly into your PC system and calibration is done.Thank you very much for using this 3nStar product.。