完整word版,PCB常用英语对照

Concord Electronics CO.,Ltd

zengxian

PCB常用英语对照

⏹第一章.认识我们的PCB

⏹第二章.了解客户要求(PO&MO)

⏹第三章.工程常用英语

⏹第四章.品质常用英语

⏹第五章.实用相关PCB英语

⏹第一章.认识我们的PCB

⏹ 1.元件面Component Side (CS)

⏹ 2.焊接面Solder Side (SS)

⏹ 3.单面板Single side board (SS)

⏹ 4.双面板Double side board (DS)

⏹ 5.多层板Multi-layer board

⏹ 6.孔Hole

⏹7.有铜孔Plated Though Hole (PTH)

⏹8.无铜孔None Plated Though hole (NPTH)

⏹9.过电孔Via Holes

⏹10.定位孔Tooling Holes

⏹11.锡/无铅喷锡Tin (Sn)/Lead free Hot air lever

⏹12.铜/抗氧化/松香Copper (Cu) /OSP/Entek/Flux

⏹13.金/电金/沉金Gold (Au)/Gold plating (Flash Gold)/Immersion Gold

⏹14.镍/电镍Nickel (Ni)/Nickel Plating

⏹15.铅/有铅锡Lead (Pb)/Hot air level (HAL)

⏹16.(绿)阻焊(Green) Solder mask

⏹17.(白)字符(White) Silkscreen (legend)

⏹18. 碳油Carbon

⏹19. (蓝)胶(Blue) peelable mask

⏹20.绿油桥solder mask bridge

⏹21.绿油塞孔Plug-holes

⏹22.绿油开窗Opening

⏹23.线路/线宽Track/line width

⏹24.线距Line spacing

⏹25.焊盘/焊环/贴片PAD/Ring/SMT/IC/BGA

⏹26. 大铜皮Copper area (GND)

⏹27.槽孔Slot hole

⏹28.外形Outline

⏹29.锣板CNC Routing

⏹30.啤板Punching

⏹31. V-坑V-Cut

⏹32.钻孔/二钻drill /Second drill

⏹33.工作边/对光点Frame /Fiducial mark

第二章.了解客户要求(PO&MO)

⏹ 1.采购订单Purchase Order

⏹ 2.生产订单Manufacturing Order

⏹ 3.客户名称Customer ‘s Name

⏹ 4.下单日期Order Date

⏹ 5.交货日期Delivery Date

⏹ 6.交货数量Order Qty

⏹7.客户编号Part Number( P/N.)

⏹8.本厂型号Factory Number (No.)

⏹9.单价Unit price

⏹10.菲林费Film Cost

⏹11.测试架费E-test Cost

⏹12.总金额Total Amount

⏹13.要求说明Specifications; note; warning

⏹14.单元尺寸Unit size

⏹15.拼版尺寸Panel size

⏹16.材料(板材) Material

⏹17.表面工艺Surface ;Finish

⏹18.阻焊(绿油)Solder mask ;Wetting film LPI;

⏹19.丝印(白字) Silkscreen ; legend

⏹20.外形Outline ;Profile

⏹21.叉板出货“X”-out panel

⏹22.包装Packing ;Vacuum-pack ;Manual-pack

⏹23.箱唛Carton Lable

⏹24.文件资料Offers file (data)

⏹25.备注Remarks

⏹26.供应商Supplier ; Vendor

⏹27.内容Description

第三章.工程常用英语

⏹ 1.计算机辅助设计Computer-Aided Design .(CAD)

⏹ 2.计算机辅助制造Computer-Aided Manufacturing .(CAM)

⏹ 3.制作指示Manufactural Instruction

⏹ 4.菲林Film

⏹ 5.样板Sample

⏹ 6.生产板Product Board

⏹7.顶层线路Top layer (c.s.)

⏹8.底层线路Bottom layer (s.s.)

⏹9.内层线路Inner layer

⏹10.接地/电源层GND/Power layer

⏹11.PP片Preprg

⏹12.顶/底层阻焊层Top/Bottom solder mask layer

⏹13.字符层Silkscreen layer

⏹14.碳油层Carbon layer

⏹15.蓝胶层Blue Peelable mask layer

⏹16.钢网层Paste layer

⏹17.外形层Profile layer(outline)

⏹18.分孔图drill chart

⏹19.机械图Machine drawing

⏹20.流程图Process drawing

⏹21.板厚Board Thickness (THK)

⏹22.铜厚Copper Thickness (THK)

⏹23.最大的Maximal

⏹24.最小的Minimum

⏹25.公差Tolerance

⏹26.尺寸Size

⏹27.长Long

⏹28.宽Width

⏹29.重Weight

⏹30.直径Diameter

⏹31.半径Radius

⏹32.光圈表Aperture list/ D-code

⏹33.钻孔表NC Tool Tables

⏹34.正方形/长方形Square/Rectangle

⏹35.圆形Round

⏹36.八角形Octangle

第四章.品质常用英语

⏹ 1.合格品Good (ok) board

⏹ 2.修理品Repairing board

⏹ 3.报废品Scrap board

⏹ 4.接受Accept (Acc.)

⏹ 5.拒收Reject (Rej.)

⏹ 6.出货报告Quality Assurance Outgoing Report

⏹7.切片报告Micro-Section Report

⏹8.可焊性测试报告Solderability Test Report

⏹9.纠正改善措施报告Complaint Action Report

⏹10.最小线宽Min. line width

⏹11.最小线距Min. Spacing

⏹12.最小焊环Min. Annular Ring

⏹13.顶层与底层对位偏差Front& Back Registration

⏹14.镀铜厚PTH thickness

⏹15.镍厚Nickel thickness

⏹16.金厚Gold thickness

⏹17.阻焊厚Solder coating thickness