PCB専门用语0

目 次 /目录/CONTENT

1-1-2-1変形切断断線变形而切断的开路Deformed and broken open10 1-1-2-2衝撃割れ断線冲击裂缝的开路Open by impact cracking11 1-1-2-3傷断線划伤的开路Open along scratch11 1-1-2-4衝撃削れ断線冲击切削的开路Open by impact scrape12

1-1-6-1欠け状擬似断線疑似缺口的开路Quasi open by nicking29 1-1-6-2はんだ溶食擬似断線焊料溶蚀的疑似开路Quasi open by dissolution29

1-1-6-4糊サンド擬似断線夹心胶的疑似开路Quasi open by sandwiched

adhesive31

1-1-6-5静電傷擬似断線静电损伤的疑似开路Quasi open by electrostatic

discharge31 1-1-6-6スルーホール擬似断線通孔的疑似开路Quasi PTH open32 1-1-6-7研磨傷起因擬似断線磨伤的疑似开路Quasi open by abrasion scratch33

1-2-2-1基板傷欠け板伤的缺口Nick by board surface damage42 1-2-2-2DFR密着不良欠けDFR压合不紧的缺口Nick by poor dry film adhesion42 1-2-2-3静電気傷欠け静电损伤的缺口Nick by electrostatic discharge43 1-2-2-4基板打痕欠け板件压痕的缺口Nick by base material dent43 1-2-2-5ダメージ欠け损伤的缺口Nick by board damage44

1-2-2-6AWF汚れ欠けAWF玷污的缺口Chipping by stained AWF Nick by

stained phototool44 1-2-2-7合せズレランド欠け错位的焊环缺口Hole break-out by misalignment45 1-2-2-8回路ギザ锯齿的线路Rough edged conductor45 1-2-2-9基準マーク欠け基准标记的缺口Nick of fiducial mark46 1-2-2-10基板銅めっき面薬液食れ镀铜面被药液腐蚀Etched copper of base material47

1-2-2-12導体貼付欠け导线转移的缺口Nick by tear and transfer of

conductor48 1-2-2-13カーボン印刷欠け碳油印刷的缺口Nick of carbon printed pattern48

1-2-2-14穴埋凹み起因DFR不密着欠け 填孔凹陷，DFR压合不紧的缺口。Chipping by poor DFR adhesion on plugged hole Conductor nick on a plugged hole by poor dry film adhesion

49

1-5-1-1AWF傷突起AWF划伤的凸出phototool55

1-5-1-2露光被り突起曝光阴影的凸出Projected conductor by exposing

light leakage56 1-5-1-3スカム突起余膜的凸出Projected conductor by scam56 1-5-1-4ヘドロ突起粘性污泥的凸出Projected conductor by sludge57

1-5-1-5積層板表面糊付着突起层压板面有胶迹的凸出Projected conductor by adhesive

on CCL surface58

1-5-1-6めっき面糊付着突起镀层面有胶迹的凸出Projected conductor by adhesive

on plated surface59

1-5-1-7プリプレグ残り突起B片屑的凸出Projected conductor by prepreg

debris59

1-5-1-8圧着突起压着铜屑的凸出Outward conductor projection by

adhered debris60

1-5-1-10めっきザラ碟形镀层Rough plating61

1-5-1-11めっきノジュール镀瘤Plating nodule62 1-5-1-12ウィスカ晶须Whisker62

1-5-1-13CF接着剤残り突起CF粘着剂屑的凸出Projected conductor by debris of

carrier film adhesive62 1-5-1-14粘着物付着突起粘性物的凸出Projected conductor by adhesives62

1-8-4-1導電性異物圧着短絡压入导电性杂物的短路foreign object86

1-8-4-2導電性異物SR巻込短絡SR中卷入导电性杂物的短路Short by a conductive foreign

object within solder resist86 1-8-4-3ダメージ短絡损伤的短路Short by damaged conductor87 1-8-4-4ウィッキング短絡灯芯的短路Short by wicking87 1-8-4-5樹脂中マイグレーション在树脂中的迁移Migration within resin88

1-8-4-6界面マイグレーション界面的迁移Migration at interface89

1-8-4-8空隙マイグレーション在空隙的迁移Migration along void90

1-8-4-9ETノズル詰り短絡ET喷嘴堵塞的短路Short by clogged etching nozzle91 1-8-4-10はんだブリッジ短絡焊料桥接的短路Short by solder bridge92

1-8-4-11層間導電異物短絡导电性杂物的层间短路Layer-to-layer short by a conductive

foreign object92

1-8-4-12導体間隔狭まり短絡导线间距变窄的短路Short by narrowed conductor

spacing93 1-8-4-13パターン紛い短絡疑似图形的短路Conductor pattern-like short93 1-8-4-14ビアホールズレ短絡 导通孔偏移的短路Short by misaligned via hole94 1-8-4-15擬似短絡疑似短路Quasi short95

1-8-4-16銅片挟まり短絡夹杂铜片的疑似短路Quasi short by copper debris

between conductor95

1-8-4-17カーボン回路短絡碳膏线路的短路Short between carbon paste

conductors96

1-8-4-18ビアホールズレ擬似短絡导通孔偏移的疑似短路Quasi short by misaligned via hole96 1-8-4-19回路形状不適短絡线路设计不合理的短路Short by improper conductive 97

2-1-1-1版合せズレ网版对位的偏移Solder resist misalignment100 2-1-1-2AWF合せズレAWF对位的偏移Phototool misalignment101 2-1-1-3カバーレイ貼りズレ覆盖膜的压合偏移Inaccurate coverlay placement101 2-1-1-4SRかすれSR的漏印Solder resist blur102 2-1-1-5SRにじみSR的渗出Solder resist (spread) ooze102 2-1-1-6SRインク違い误用SR油墨Wrong solder resist ink103 2-1-1-7SRインク溜まりSR油墨的积聚(聚油)Solder resist ink drop103 2-1-1-8SR気泡抱込SR吸附气泡Air entrapped in solder resist104

2-1-1-9全体的ＰSR現像残り整个板面的PSR显影不净Entirely underdeveloped photo

solder resist104

2-1-1-10部分的ＰSR現像残り局部的PSR显影不净Partially underdeveloped photo

solder resist105

2-1-1-11非スル穴SR垂込みSR进入非通孔Solder resist dripped in non-plated

through hole105