工作中常用中英文(含缩略语)
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工作中常用中英文(含缩略语)一、一般英语:
1. 采购- purchase
2. 材料- material
3. 评估- evaluation
4. 供应商- supplier / vendor
5. 总经理- general manager ( GM )
6. 进料incoming
7. 质量quality
8. 控制- control
9. 装箱单- packing list
10. 数量- quantity
11. 型号- model
12. 描述- description
13. 制表/发布- issue
14. 表格- form
15. 文件- document
16. 制造商- manufacturer
17. 接收- accept (Acc.)
18. 拒收- reject (Rej.)
19. 项目- item
20. 个- piece(Pc.)
21. 放宽- waive
22. 缺陷- defect
23. 合格- pass
24. 不合格- not good ( NG )
25. 日期- date
26. 生产线- production line / line
27. 备注- remark
28. 仓库- store
29. 产品- product
30. 静电敏感元件- static sensitive device (SSD)
31. 静电释放- electricity static discharge (ESD)
32. 进- in
33. 出- out
34. 结余- balance
35. 备注- remark
36. 参数- reference
37. 单位- UM
38. 标签- label
39. 打印- print
40. 计划- plan
41. 图表- chart
42. 质量- quality
43. 传真- fax
44. 新加坡- Singapore
45. 检查- check
46. 箱子- case / carton
47. 盒子- box
48. 系列号- serial number ( S/N )
49. 部门- department (Dept.)
50. 客户- customer
51. 通知- notice
52. 清单- bill
53. 平均- average
54. 文控中心- document control center ( DCC )
55. 计划员- planner
56. 流程图- flow chart
57. 工艺- instruction
58. 校准- calibration
59. 校验- verify
60. 设备- equipment
61. 培训- training
62. 不良品- failed product
63. 预计- forecast
64. 安全- safety
65. 程序- program / procedure
66. 图纸- drawing
67. 过程- process
68. 隔离- separate / insulate
69. 返工- rework
70. 合同- contract
71. 准时- just in time ( JIT )
72. 准时交付- delivery on time
73. 运输- shipment / transportation
74. 方式- method
75. 费用- cost
76. 报废- scrap
二、专业英语:
物资部——常用中英文缩略语:
1. CO:C u s t o m e r O r d e r客户订单
2. MO: Manufacture Order 生产订单
3. PO: P u r c h a s e O r d e r采购订单
4. DO: D e l i v e r y O r d e r发货单
5.F C S T:F o r e c a s t O r d e r预测订单
6.M R P I I: Manufacturing Resource Planning MRPII系统
7.F S: Fourth Shift 四班系统
8. PMC: Planner Material control 计划员
9.M R B:M a t e r i a l R e v i e w B o a r d物料评审会议10.RTV: Return To Vendor 退还供应商
11.E C N:E n g i n e e r i n g C h a n g e N o t i c e工程更改通知
12.GRN:G o o d s R e c e i v e d N o t e材料入库单
13.P W O:P r o d u c t i o n W o r k O r d e r配发单14.M R F:M a t e r i a l s R e q u i s i t i o n F o r m材料申请单
15.A M R F:N o n-P r o d/A u x M a t e r i a l s R e q u i s i t i o n F o r m辅助物料申请单
16.R T S:R e t u r n T o S t o r e回库单
17.S C R A P:S c r a p F o r m报废单
18.R C N:R e s u l t C h a n g e d N o t e进检结果更改单
19.I T N:I n v e n t o r y T r a n s f e r N o t e移库单20.I N V:I n v o i c e发票
21.D N:D e b i t N o t e借方凭单
22.C N:C r e d i t N o t e贷方凭单23.PCBA: Printed Circle Board Assembly 印刷线路板组装,
24.IQC: Incoming Quality Control 进料品质控制
25.IPQC: In Process Quality Control 在线品质检查
26.SMT: Surface Mounting Technology 表面贴装技术
27.AI: Automatic Insertion 自动插装
28.WIP: Work In Process 在制品
29.PCB: Printed Circle Board 印刷电路板
30.PCBA: Printed Circle Board Assembly 印刷电路板组装
31.P/A: PCB Assembly 电子产品装配
32.ICT: Internal Circle Test 内部线路测试
33.FCT: Function Test 功能测试
34.BOM: Bill of Material 材料清单
35.AVL: Approved Vendor List 合格供应商清单
36.DOC: Declaration of Conformity 符合性声明,由供方向客户或相关方提供。
37.SOC: Statement of Conformity 符合性公告,由供方向公众提供。
38.VCAR: Vendor Corrective Action Report 供应商改善措施报告
39.QA: Quality Assurance 品质保证
40.ESD: Electrostatic Discharge 静电放电
41.4M1E: Man/ Machine/Material/Method/ Environment 人/机器/原材料/作业方法/环境
42.FMEA: Failure Mode Effect Analysis 失效模式与后果分析
43.CP: Control Plan 控制计划
44.ISO: International Standardization Organization 国际标准化组织
45.EDX-720: Energy Dispersive X- Ray Spectrometer,能量色散型X荧光光谱仪。
品质部——常用中英文缩略语
1.4M1E:Man/ Machine/Material/Method/ Environment 人/机器/原材料/作业方法/环境
2.AI: Automatic Insertion 自动插装
3.AQL: Accepted Quality Level 品质充收水准
4.AOI: Auto Optics Inspection 自动光学检测
5.AOQ:Average Outgoing Quality 平均出货水平
6.APQP:Advanced Product Quality Planning产品先期策划
7.AVL: Approved Vendor List 合格供应商清单
8.BOM: Bill of Material 材料清单
9.BS: Bottom Side 下表面(通常指PCBA的焊点面)
10.CP: Control Plan 控制计划
11.COC: Certificate of Conformance 一致性声明
12.CAR: Corrective Action Report 改善措施报告
13.CPK: Capability Process Index 制程能力指数
14.CTQ: Critical to Quality 关键质量特性
15.DMAIC:Define-Measure-Analyse-Improve-Control 定义-测量-分析-改善-控制(6Sigma分析的5个步骤)
16.DOC: Declaration of Conformity 符合性声明
17.DPMO: Defect Per Million Opportunity 百万缺陷机会数
18.DOE: Design of Experiment 实验设计
19.ECN: Engineering Change Notice 工程更攺通知
20.EMC: Electro Magnetic Compatibility 电磁兼容
21.ESD: Electrostatic Discharge 静电放电
22.FMEA: Failure Mode Effect Analysis 失效模式与后果分析
23.F/A: Final (Product) Assembly 最终装配(总装)
24.FQC: Final Quality Check 最终品质检查
25.FCT: Function Test 功能测试
26.FAAR: First Article Approved Report 首件检验报告
27.FIFO:First In First Out 先入先出
28.ISO: International Standardization Organization 国际标准化组织
29.IQC: Incoming Quality Check 进料品质检查
30.IPQC: In Process Quality Control 在线品质检查
31.ICT: Internal Circle Test 内部线路测试
32.LSL: Lower Specification Limit 规格下限
33.LCL: Lower Control Limit 控制下限
34.MRB: Material Review Board 物料评审会议
35.MSA: Measure System Analysis 测量系统分析
36.MSDS:Material Safety Data Sheet原材料安全资料
37.MTBF: Mean Time Between Failures 平均无故障时间
38.ODM: Original Design & Manufacture 委托设计与制造
39.OEM: Original Equipment Manufacture 委托代工
40.OQA: Outgoing Quality Assurance 出货品质保证
41.ORT: Outgoing Reliability Test 出货产品可靠性测试
42.P/A: PCB Assembly 电子产品装配
43.PDCA: Plan-Do-Check-Action 计划-做-检查-规范(一种管理模式)
44.PCB: Printed Circle Board 印刷电路板
45.PCBA: Printed Circle Board Assembly 印刷电路板组装
46.PPAP:Production Part Approval Process 生产件批准程序
47.QA: Quality Assurance 品质保证
48.QCC: Quality Control Circle 品管圈
49.QE: Quality Engineering 品质工程
50.QFD: Quality Function Deployment 质量功能展开
51.QMS:Quality Management System 品质管理体系
52.R&R: Repeatability & Reproducibility (测量系统中)重复性和再现性
53.SCAR: Supplier Corrective Action Report 供应商改善措施报告
54.SMT: Surface Mounting Technology 表面贴装技术
55.SQE: Supplier Quality Engineering 供应商品质工程
56.SOC: Statement of Conformity 符合性公告
57.SPC: Statistical Process Control 统计过程控制
58.TQM: Total Quality Management 全面质量管理
59.TPM: Total Production Management 全面生产管理
60.TS: Top Side 上表面(通常指PCBA的元件面)
L: Upper Specification Limit 规格上限
62.UCL: Upper Control Limit 控制上限
63.VCAR: Vendor Corrective Action Report 供应商改善措施报告
64.WIP: Work In Process 在制品
65.WI: Working Instruction 操作指引
SMT——常用中英文缩略语
1.表面贴装技术- surface mounting technology ( SMT )
2.品质计划- quality plan ( QP )
3.制造工程师- manufacturing engineer ( ME )
4.文控中心- document control center ( DCC )
5.组织结构图- organization chart
6.流程图- flow chart
7.产品品质先期策划- advanced product quality planning ( APQP )
8.潜在失效模式及影响分析- potential failure model and effect analysis ( PFMEA)
9.控制计划- control plan ( CP )
10.工艺- instruction
11.出货检查标准- outgoing quality inspection instruction
12.工程更改通知- engineering change notice (ECN)
13.锡膏- solder paste
14.红胶- glue
15.印锡- paste printing
16.在线测试- in circle test ( ICT )
17.设备- equipment
18.培训- training
19.不良品- failed product
20.预计- forecast
21.生产订单- manufacturing order ( MO )
22.印锡机- printing machine
23.贴片机- mounter
24.烘炉- oven
25.自动插机- automatic insert ( AI )
26.制程中- work in process ( WIP )
27.百万分之- PPM28.钢网:stencil
29.表面贴装设备:surface mount device (SMD)
30.飞达:feeder
31.印刷线路板: print circuit board (PCB)
32.BS面:bottom side (BS)
33.TS面: top side (TS)
34.自动插件:automatic insertion (AI)
35.单列直插:single line package (SIP)
36.双列直插:dual line package (DIP)
37.小型封装晶体管:small outlet transistor (SOT)
38.电阻:resistor (R)
39.电容:capacitor (C)
40.二极管: diode (D)
41.三极管: transistor (T)
42.电感: inductor (L)
43.晶振: crystal
44.连接器: connector
45.开关: switch
46. 球形触点阵列: ball grid array (BGA)
47.四侧引脚扁平封装: quad flat package (QFP)
48.板上芯片封装: chip on board (COB)
生产部——常用中英文缩略语
PCB组装
1. 插机- insert / insertion
2.外观检查- visual inspection
3. 波峰焊接- wave soldering
4. 过波峰模板- panel
5. 分板- depanning
6. 补焊- touch up
7. 清洗- clearing
8.点胶- gluing9.功能测试- function test
10.自动测试仪- automatic test machine ( ATM )
11.高压测试- hi-pot test
12.绝缘测试- insulation test
13.老化- burn-in
14.包装- packing
15.客户样品- golden sample / customer sample
16.试生产- trial run
17.临时样品- temporary sample
18.功能测试- function test
19.终检- final inspection
20.试产报告- trial run report
21.首件报告- first article approval report ( FAAR )
22.在线品质控制- in process quality control ( IPQC )
23.可疑材料- suspect material
24.纠正措施- corrective action
25.预防措施- preventive action
26.改善措施报告- corrective action report ( CAR )
总装
27.总装- final assembly
28.超音波焊接机- supersonic welding machine
29.基准- benchmark
30.测量系统分析- measurement system analysis ( MSA )
31.量具重复性和再现性- gauge repeatability & reproducibility ( GR&R
32.灌胶:fill glue
其它
33.待检区: check-waiting zone
34.周转箱:box turnover
35.电阻:resistor (R)
36.电容:capacitor (C)
37.二极管: diode (D)
38.三极管: transistor (T)
39.电感: inductor (L)
40.晶振: crystal
41.连接器: connector
42.开关: switch
43.成品区:finished product zone
44.项目组:item brigade
45.工具:Tool facility
46.工艺- instruction
47.设备- equipment
48.不良品- failed product
49.生产订单- manufacturing order ( MO )
50.不良品- failed product
51.锡炉:stannum furnace
52.报表:report forms
53.宣传栏:announce cote
ME部——常用中英文缩略语
1.品质计划- quality plan ( QP )
2.制造工程师- manufacturing engineer ( ME )
3.项目工程师- project engineer (PE)
4.文控中心- document control center ( DCC )
5.组织结构图- organization chart
6.流程图- flow chart
7.产品品质先期策划- advanced product quality planning ( APQP )
8.潜在失效模式及影响分析- potential failure model and effect analysis ( PFMEA)
9.控制计划- control plan ( CP )
10.线路板总装-print circuit board assembly (PCBA)
11.工艺- work instruction
12.出货检查标准- outgoing quality inspection instruction
12.工程更改通知- engineering change notice (ECN)
13.临时工程更改通知- temporarily engineering change notice(TECN)
14.设计更改通知- design engineering change notice(DECN)
15.温度曲线-profile
16.x-ray
17.BGA 返修台
18.锡膏- solder paste
16.红胶- glue
17.印锡- paste printing
18.在线测试- in circle test ( ICT )
17.设备- equipment
18.培训- training
19.不良品- failed product
20.预计- forecast
21.生产订单- manufacturing order ( MO )
22.印锡机- printing machine
23.贴片机- mounter
24.烘炉- oven
25.自动插机- automatic insert ( AI )
26.制程中- work in process ( WIP )
27.百万分之- PPM
产品技术部——常用中英文缩略语
1.charge 充电器
2.transformer 变压器
3.inductance 电感
4.leakage inductance 漏感
5.automatic test equipment 自动测试设备
6.wrong component 错件
7.resistor value deviation 阻值偏差
ponent short with heat sink 元件与散热器短路
9.leads no insert 管脚没插入
ponent damaged 元件破损
11.gold finger dirty 金手指脏
12.gold finger with solder 金手指上锡
13.short circuit 短路
14.open circuit 开路
15.copper pad peel off 跳铜皮
ponent inverse 元件反
17.test fixture 测试工装
19.miss component 漏件
20. void solder 虚焊
21.solder ball& solder residue 锡珠和锡渣
22.manufacture inverse 加工反
23.open circuit in primary 初级断线
24.secondary circuit short 次级短路
25.wire of transformer break 变压器线断
26.PWM Pulse Width Modulation 脉冲编码调制
27.SPI Serial periphery interface 串行外围接口
28.DAC Digital-to-Analog Converter 数模转换
29.BGA(ball grid array) 球形触点陈列
30.PCB Printed Circuit Board 印刷电路板
31.ICT:in circuit test 在线电路测试
32.AOI:automatism optics inspect 自动光学检测
33.FCT;function test 功能测试
34.MSA:measure system analyse 测量系统分析
35.ATE:automatism test equipment 自动测试设备
36.WM:Pulse Width Multiplier 脉冲宽度倍增器
37.LCR测试仪:inductance capacitance resistance 电感、电容、电阻测试仪
38.PED:product engineering department 产品技术部
39.ADC:Analog-to-Digital Converter 模数转换器
40.PEC:Precision Electronic Components 光电管、光电元件
41.MOS管:Metal-Oxide Semiconductor 金属氧化物半导体
42.IC:interchange 集成电路、指令计数器
43.UDS:=Universal Data System 通用数据系统
44.LED:light-emitting diode 发光二极管
45.IMEI:IMEI(INTERNATIONAL MOBILE EQUIPMENT IDENTIFIER).国际移动设备识别码
46.Mobile Phone 移动电话
47.GSM: Global System for Mobile Communication 全球移动通信系统
48.AFC(Automatic Frequency Control) 自动频率控制
49.AGC(Automatic Gain Control) 自动增益控制
50.AFT(Automatic Frequency Tune) 自动频率调谐
R(C/N )(Carrier to Noise Ration) 载噪比
52.ACI(Adjacent-Channel Interference) 邻频干扰
53.DPX(Diplexer) 双工器
54.FDMA(Frequency Division Multiple Access) 频分多址
55.CDMA Code Division Multiple Access
56.TDMA: Time Division Multiple Access 时分多址
57.TCH: Traffic Channel 业务信道
CH: Common Control Channel 公共控制信道
59.BCCH: Broadcast Control Channel 广播控制信道
60.SIM: Subscriber Identity Module 用户识别卡
61.SMS: Short Message Service 短消息业务
62.MMS: Multimedia Messaging Service中文译为多媒体信息服务,也称“彩信”
63.PIN: Personal Identification Number 个人识别号码
64.PHS Personal Handy-phone System 小灵通
65.BT Board test 板测
66.DL Download 下载
67.PCM: Pulse Code Modulation 脉码调制
68.ANT(Antenna) 天线
69.GMSK: Gaussian Filtered Minimum Shift Frequency Keying 高斯滤波最小移频键控
70.BER: Bit Error Rate 比特误码率
71.打火: spark
72.单片机: MCU
73.模式: mode
74.C总线: C-BUS
HRD——常用中英文缩略语
人力资源管理:(Human Resource Management ,HRM)
人力资源经理:( human resource manager)
高级管理人员:(executive)职业:(profession)道德标准:(ethics)
操作工:(operative employees)专家:(specialist)
人力资源认证协会:(the Human Resource Certification Institute,HRCI)
外部环境:(external environment)内部环境:(internal environment)
政策:(policy)企业文化:(corporate culture)目标:(mission)股东:(shareholders)
非正式组织:(informal organization)跨国公司:(multinational corporation, MNC)
管理多样性:(managing diversity)工作:(job) 职位:(posting)工作分析:(job analysis)
工作说明:(job description)工作规范:(job specification)
工作分析计划表:(job analysis schedule, JAS)
职位分析问卷调查法:(Management Position Description Questionnaire, MPDQ)
行政秘书:(executive secretary)地区服务经理助理:(assistant district service manager)
人力资源计划:(Human Resource Planning, HRP)
战略规划:(strategic planning)
长期趋势:(long term trend)要求预测:(requirement forecast)
供给预测:(availability forecast)管理人力储备:(management inventory)
裁减:(downsizing)人力资源信息系统:(Human Resource Information System, HRIS)
招聘:(recruitment)
员工申请表:(employee requisition)
招聘方法:(recruitment methods)内部提升:(Promotion From Within ,PFW)
工作公告:(job posting)广告:(advertising)职业介绍所:(employment agency)
特殊事件:(special events)实习:(internship)选择:(selection)选择率:(selection rate)
简历:(resume)标准化:(standardization)有效性:(validity)客观性:(objectivity)
规范:(norm)录用分数线:(cutoff score)准确度:(aiming)
业务知识测试:(job knowledge tests)求职面试:(employment interview)
非结构化面试:(unstructured interview)结构化面试:(structured interview)
小组面试:(group interview)职业兴趣测试:(vocational interest tests)会议型面试:(board interview)
组织变化与人力资源开发
人力资源开发:(Human Resource Development ,HRD)
培训:(training)开发:(development)定位:(orientation)训练:(coaching)辅导:(mentoring)
经营管理策略:(business games)案例研究:(case study)会议方法:(conference method)
角色扮演:(role playing)工作轮换:(job rotating)
在职培训:(on-the-job training ,OJT)媒介:(media)
企业文化与组织发展
企业文化:(corporate culture)组织发展:(organization development, OD)调查反馈:(survey feedback) 质量圈:(quality circles)目标管理:(management by objective, MBO)全面质量管理:(Total Quality Management, TQM)
团队建设:(team building)
职业计划与发展
职业:(career)职业计划:(career planning)职业道路:(career path)职业发展:(career development)
自我评价:(self-assessment)职业动机:(career anchors)
绩效评价
绩效评价:(Performance Appraisal ,PA)小组评价:(group appraisal)业绩评定表:(rating scales method) 关键事件法:(critical incident method)排列法:(ranking method)平行比较法:(paired comparison)
硬性分布法:(forced distribution method)晕圈错误:(halo error)宽松:(leniency)严格:(strictness)
反馈:(-degree feedback)叙述法:(essay method)集中趋势:(central tendency)
报酬与福利
报酬:(compensation)
直接经济报酬:(direct financial compensation)
间接经济报酬:(indirect financial compensation)
非经济报酬:(no financial compensation)
公平:(equity)
外部公平:(external equity)内部公平:(internal equity)员工公平:(employee equity)小组公平:(team equity) 工资水平领先者:(pay leaders)现行工资率:(going rate)工资水平居后者:(pay followers)
劳动力市场:(labor market)
工作评价:(job evaluation)
排列法:(ranking method)分类法:(classification method)因素比较法:(factor comparison method)
评分法:(point method)海氏指示图表个人能力分析法:(Hay Guide Chart-profile Method)
工作定价:(job pricing)工资等级:(pay grade)工资曲线:(wage curve)工资幅度:(pay range)
福利和其它报酬问题
福利(间接经济补偿)
员工股权计划:(employee stock ownership plan, ESOP)值班津贴:(shift differential)
奖金:(incentive compensation)分红制:(profit sharing)
安全与健康的工作环境
安全:(safety)健康:(health)频率:(frequency rate)紧张:(stress)角色冲突:(role conflict) 催眠法:(hypnosis)酗酒:(alcoholism)
员工和劳动关系
工会:(union)地方工会:(local union)行业工会:(craft union)
产业工会:(industrial union)全国工会:(national union)
谈判组:(bargaining union)劳资谈判:(collective bargaining)仲裁:(arbitration)
罢工:(strike)内部员工关系:(internal employee relations)
纪律:(discipline)纪律处分:(disciplinary action)申诉:(grievance)
降职:(demotion)调动:(transfer)晋升:(promotion)
设备部——常用中英文缩略语
与波峰焊接相关的:
波峰焊接机 wave soldering machine
低固态免清洗助焊剂Low-Solids No-Clean Liquid Flux
稀释剂 thinner
溶剂 solvent
无卤化物 halide-free
流量 flux
气压 air pressure
比重 specific gravity
固态含量 percent solids
发泡 foam
喷雾 spray
锡条 Tin bar
合金 alloy
熔点 melting point
密度 density
氧化物 oxide
残留物 residue
可焊性 solderability
预热温度 preheat temperature
焊接温度 soldering temperature
预热时间 preheating time
触波时间 dwell time
波峰形状 solder wave shape
斜率 slope
链速 conveyor speed
风刀 air knife
预热区 preheating zone
表面张力 surface tension
锡 Sn 银Ag铜Cu铅Pb锌Zn铁Fe砷As镍Ni铋Bi镉Cd铝Al铟In
与工装相关的:
工装 fixture
夹具 jig
模具 die/mould/mold
铣床 milling machine
车床 lathe
钻床 drilling machine
磨床grinding machine
弓锯机 hack sawing machine
线切割机床linear cutting machine
计算机数控CNC=Computer Numerical Control
精度 precision
硬度 hardness
表面处理 surface finish
电镀 plating
电木 bakelite
黄铜 brass
钢 steel
不锈钢stainless steel
铆钉 rivet
螺栓 bolt
螺钉 screw
螺母 nut
弹簧 spring。