导电浆料

浸涂 Dipping
920~940
*含有无机添加剂。Include inorganic additive.
主要特性
Characteristic 多层瓷介电容器用内电极浆料，适用于高 Q 值的 NPO 瓷料
MLC inner Electrode. Suitable for NPO ceramic with high Q value. 多层瓷介电容器用内电极浆料
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浆料(Paste)
1. 片式电容器 (For Multi-layer Ceramic Capaci固含量（%） 施工工艺
烧结温度（℃）
Product No. Composition Solid content Printing Method Firing temp.
3． 片式电感器(For Multi-layer Chip Inductors)
产品型号 Product No.
IT-100
IT-100N
IL-100
主要组成 Composition
Ag
Ag
Ag
固含量（%） Solid content
73±1.0
78±1.0
85±3.0
施工工艺
Printing Method 浸涂
MLC inner Electrode. 多层瓷介电容器用内电极浆料，金属含量较低，有效降低成本
MLC inner Electrode. Low metal content. 多层瓷介电容器用内电极浆料，金属含量低，适用于 X7R 瓷料
MLC inner Electrode. Low metal content, suitable for X7R ceramic. 多层瓷介电容器用内电极浆料，金属含量低，适用于 X7R 瓷料
Ag2O*
75±1.0
浸涂 Dipping
800~850
E-NF005B
Ni*
48±1.0
丝网印刷 Screen
1000~1400
E-NB003
Ni*
48±1.0
丝网印刷 Screen
1000~1400
E-NN019
Ni*
48±1.0
丝网印刷 Screen
1000~1400
CT-F-343
Cu*
78±2.0
MLC inner Electrode. Suitable for ceramic with low firing temperature. 多层瓷介电容器用内电极浆料，适用于低烧 MLCC(FH193)
MLC inner Electrode. Suitable for ceramic with low firing temperature (FH193). 片式电容器端头电极可镀浆料，良好的附着力
BME MLC Termination. Good adhesion.
Address: 18th FENGHUA ROAD,ZHAOQING,GUANGDONG,P.R,CHINA
Tel：86-758-2865108 2821974
Fax：86-758-2844425 2821974
E-mail: jmkfzx@
DD-1E05 Ag(含 0.5%Pd)
73±5.0
丝网印刷 Screen
DD-1E1
Ag(含 1.0%Pd)
73±5.0
丝网印刷 Screen
DD-1E2
Ag(含 2.0%Pd)
73±5.0
丝网印刷 Screen
DD-1E5
Ag(含 5.0%Pd)
73±5.0
丝网印刷 Screen
DD-1E7
Ag(含 7.0%Pd)
主要特性 Characteristic 片式电感器端头电极可镀浆料,良好的附着力 MLCI termination. Good platability. Good adhesion. 片式电感器端头电极可镀浆料,良好的附着力，浆料流平性好 MLCI termination. Good platability. Good adhesion. Good leveling property. 片式电感器内电极浆料,电极连续,电性能优良 MLCI inner Electrode. Fine line resolution. Good conductivity.
1st conductor. Good adhesion and good stability for topping electrode.
片式电阻器面电极,附着强度优良,高可靠性 1st conductor. Good adhesion and good reliability for topping electrode. 片式电阻器一次包封,浅绿,透明,激光透射好 1st overcoat. Green color. , Easy to laser trim. 片式电阻器二次包封,黑色,耐腐蚀性好,附着强度优良 2nd overcoat. Black color. Good adhesion. 片式电阻器标记,白色,标记字迹清晰,附着强度好 Marker paste. White color. Fine line resolution. Good adhesion. 片式电阻端头电极,可电镀 2nd conductor. Platable for termination.
Tel：86-758-2865108 2821974
Fax：86-758-2844425 2821974
E-mail: jmkfzx@

铜电极烧结表面
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4． 厚膜电路、电阻网络、分立电阻、电位器(For Thick Film Circuit、Resistance Networks、Resistors、
产品型号 Product No.
FHAP20
FHAP15 FHAP10 FHAP5 FHAP3 FHAP1 FHAP05 FHG501 FHG502 FHG503
MLC Termination. Good platability. Good adhesion. 片式电容器端头电极可焊浆料，良好的附着力
MLC Termination. Good solderability. Good adhesion. 贱金属多层瓷介电容器用内电极浆料（Y5V） BME MLC inner Electrode.（Y5V） 贱金属多层瓷介电容器用内电极浆料（X7R） BME MLC inner Electrode.（X7R） 贱金属多层瓷介电容器用内电极浆料（NPO） BME MLC inner Electrode.（NPO） 贱金属多层瓷介电容器用端电极浆料，良好的附着力
MLC inner Electrode. Low metal content, suitable for X7R ceramic. 多层瓷介电容器用内电极浆料，适用于较低烧温的产品
MLC inner Electrode. Suitable for ceramic with middle or low firing temperature. 多层瓷介电容器用内电极浆料，适用于低烧产品
Pd/Ag=60/40
55±1.0
丝网印刷 Screen
900~1300
E-2152
Pd/Ag=10/90
52±2.0
丝网印刷 Screen
900~1000
E-1052
Ag*
65±2.0
丝网印刷 Screen
800~930
MT-100N
Ag*
77±1.0
浸涂 Dipping
720~780
MT-100S
Dipping 浸涂
Dipping 丝网印刷
Screen
烧结温度（℃） Firing temp. 780~800
660~700
800~900
主要特性 Characteristic
片式电阻器背电极,附着强度优良 1st conductor. Good adhesion for back electrode. 片式电阻器背电极,附着强度优良 1st conductor. Good adhesion for back electrode. 片式电阻器面电极,低成本,附着强度优良 1st conductor. Good adhesion and low cost for topping electrode. 片式电阻器面电极,标准品,附着强度优良 1st conductor. Good merchantable quality. Good adhesion for topping electrode. 片式电阻器面电极,尺寸小,附着强度优良 1st conductor. Small size. Good adhesion for topping electrode. 片式电阻器面电极,附着强度优良,高稳定性
Address: 18th FENGHUA ROAD,ZHAOQING,GUANGDONG,P.R,CHINA
Tel：86-758-2865108 2821974
Fax：86-758-2844425 2821974
E-mail: jmkfzx@

73±5.0
丝网印刷 Screen
DB-1A
玻璃 glass frit
65±3.0
丝网印刷 Screen
DB-2A
玻璃 glass frit
72±3.0
丝网印刷 Screen
DB-3A
玻璃 glass frit
60±3.0
丝网印刷 Screen
DD-2C
Ag
70±3.0
浸涂 Dipping
烧结温度（℃） Firing temp. 850±3 850±3 850±3 850±3 850±3 850±3 850±3 600±2 600±2 600±2 600±2
E-2369B
Pd/Ag=30/70
60±1.0
丝网印刷 Screen
900~1150
E-2369E
Pd/Ag=30/70
52.5±1.0
丝网印刷 Screen
900~1150
E-2348
Pd/Ag=30/70*
55±1.0
丝网印刷 Screen
900~1150
E-2342
Pd/Ag=30/70*
52±1.0
Potentiometers)
主要组成
固含量（%）
施工工艺
Composition Solid content Printing Method
Pd / Ag =20/80
75±3.0
丝网印刷 Screen
Pd / Ag =15/85
丝网印刷 Screen
900~1150
E-2337A
Pd/Ag=30/70*
49±1.0
丝网印刷 Screen
900~1150
E-2283
Pd/Ag=20/80
52±1.0
丝网印刷 Screen
900~1080
E-2857A
Pd/Ag=15/85
54±1.0
丝网印刷 Screen
900~1020
E-2652
MLC inner Electrode. Suitable for ceramic with low firing temperature. 多层瓷介电容器用内电极浆料，适用于高烧产品
MLC inner Electrode. Suitable for ceramic with high firing temperature. 多层瓷介电容器用内电极浆料，适用于低温 MLCC
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2． 片式电阻器(For Chip Resistors)
产品型号 Product No.
主要组成 Composition
固含量（%）
施工工艺
Solid content
Printing Method
DD-1F
Ag
73±5.0
丝网印刷 Screen
DD-1C
Ag(含 0.5%Pd)
73±5.0
丝网印刷 Screen

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镍电极烧结表面状况
镍电极烧结连续性
铜电极烧结概貌
铜电极烧结切面
Address: 18th FENGHUA ROAD,ZHAOQING,GUANGDONG,P.R,CHINA