SN54LV165A_07中文资料

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SNJ54LVTH162245WD中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678001QXA ACTIVE CFP WD 481TBD Call TI Level-NC-NC-NC 5962-9678001VXA ACTIVE CFP WD 481TBDCall TI Level-NC-NC-NC 74LVTH162245DGGRG4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245DLRG4ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245GRDR ACTIVE LFBGA GRD 541000TBDSNPB Level-1-240C-UNLIM 74LVTH162245GRE4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245ZQLR ACTIVE VFBGA ZQL 561000Green (RoHS &no Sb/Br)SNAGCU Level-1-260C-UNLIM 74LVTH162245ZRDR ACTIVE LFBGA ZRD 541000Green (RoHS &no Sb/Br)SNAGCU Level-1-260C-UNLIM SN74LVTH162245DGGR ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DL ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DLG4ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DLR ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245KR ACTIVE VFBGA GQL 561000TBD SNPB Level-1-240C-UNLIM SNJ54LVTH162245WDACTIVECFPWD481TBDCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in anew design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM4-Oct-2005Addendum-Page 1元器件交易网元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

sn74lv165a原理

sn74lv165a原理SN74LV165A是一种串行输入并行输出的移位寄存器，它可以连接到其他SN74LV165A芯片来扩展输入线。

该芯片可以在微控制器和其他数字电路中起到重要作用。

在此文章中，我们将深入探讨SN74LV165A芯片的工作原理以及其在电路设计中的应用。

SN74LV165A芯片的工作原理SN74LV165A芯片是一种8位移位寄存器，它可以从串行输入线读取数据，并将数据存储在并行输出线中。

该芯片有一个时钟输入端CLK和一个异步清零输入端CLR。

在时钟输入端输入正脉冲时，SN74LV165A芯片将数据从串行输入线读取，并将其存储在内部寄存器中。

当输入完8位数据后，数据将被并行传输到输出线。

SN74LV165A芯片还有一个串行输出端QH'，可以将芯片中的数据通过串行输出线传输出去。

此外，该芯片还具有一个使能输入端，当该端输入低电平时，芯片处于失能状态，此时芯片将不会从串行输入线读取数据，也不会将数据传输到输出线。

SN74LV165A芯片在电路设计中的应用SN74LV165A芯片具有广泛的应用，特别是在数字电路中。

在以下场景中，SN74LV165A芯片被广泛使用：1.扩展输入线：SN74LV165A芯片可以通过串联连接来扩展输入线。

在需要大量输入的应用场景中，SN74LV165A芯片可以通过连接多个芯片来扩展输入线。

2. 计数器：SN74LV165A芯片可以用作计数器的输入接口。

当计数器的计数值达到8时，计数器将停止计数。

在此之后，计数器的输出线可以将计数值传输给其他部件。

3. 时序控制器：在时序控制器中，SN74LV165A芯片可以用作状态机的输入接口。

在时钟输入端输入正脉冲时，状态机将根据当前状态执行不同的操作。

总结SN74LV165A芯片是一种广泛使用的移位寄存器，它可以将串行输入数据转换为并行输出数据。

该芯片可以用于扩展输入线、计数器和时序控制器等应用中。

在电路设计中，SN74LV165A芯片可以提高电路的效率和可靠性，是一种非常有用的电子元件。

SN54LV00A中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LV00AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74LV00ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADBRG4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV00APWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74LV00APWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWTG4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ARGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS123中文资料

RETRIGGERABLE MONOSTABLE MULTIVIBRATORSThese dc triggered multivibrators feature pulse width control by three meth-ods. The basic pulse width is programmed by selection of external resistance and capacitance values. The LS122 has an internal timing resistor that allows the circuits to be used with only an external capacitor. Once triggered, the ba-sic pulse width may be extended by retriggering the gated low-level-active (A)or high-level-active (B) inputs, or be reduced by use of the overriding clear.•Overriding Clear Terminates Output Pulse•Compensated for V CC and T emperature Variations•DC Triggered from Active-High or Active-Low Gated Logic Inputs •Retriggerable for Very Long Output Pulses, up to 100% Duty Cycle •Internal Timing Resistors on LS122SN54/74LS122 (TOP VIEW)(SEE NOTES 1 THRU 4)SN54/74LS123 (TOP VIEW)(SEE NOTES 1 THRU 4)NOTES:1.An external timing capacitor may be connected between C ext and R ext /C ext (positive).2.To use the internal timing resistor of the LS122, connect R int to V CC .3.For improved pulse width accuracy connect an external resistor between R ext /C ext and V CC with R int open-circuited.4.To obtain variable pulse widths, connect an external variable resistance between R int /C ext and V CC .R ext/CR ext/C ext 11ĂRext/2CLRC extNC Ċ NO INTERNAL CONNECTION.。

SNJ54ALS00AW中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-86833012A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC 5962-8683301DA ACTIVE CFP W 141None Call TI Level-NC-NC-NC JM38510/37001B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/37001BCA ACTIVE CDIP J 141None Call TI Level-NC-NC-NC SN54ALS00AJ ACTIVE CDIP J 141None Call TI Level-NC-NC-NC SN54AS00J ACTIVE CDIP J 141None Call TI Level-NC-NC-NC SN74ALS00AD ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74ALS00ADBR ACTIVE SSOP DB 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74ALS00ADR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74ALS00AN ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74ALS00AN3OBSOLETE PDIP N 14None Call TI Call TISN74ALS00ANSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74AS00D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74AS00DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74AS00N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74AS00NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54ALS00AFK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54ALS00AJ ACTIVE CDIP J 141None Call TI Level-NC-NC-NC SNJ54ALS00AW ACTIVE CFP W 141None Call TI Level-NC-NC-NC SNJ54AS00FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54AS00JACTIVECDIPJ141NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.28-Feb-2005Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.28-Feb-2005IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

sn74lv165a原理

sn74lv165a原理SN74LV165A采用了串行输入、并行输出的设计，它的输入端有一个串行数据输入引脚（SER）和一个时钟输入引脚（CLK）。

通过时钟信号的边沿触发，从串行输入端输入的数据会依次被移位进入移位寄存器中。

移位寄存器内部由8个触发器组成，可以存储8位数据。

当所有数据移入寄存器后，通过并行输出引脚（Q7-Q0）可以同时输出这8位数据。

SN74LV165A的输入端还有一个使能端（CE）和一个清除端（CLR）。

使能端用于控制移位寄存器是否工作，当使能端为高电平时，移位寄存器开始工作；当使能端为低电平时，移位寄存器停止工作，输入数据不再移位。

清除端用于清除移位寄存器内的数据，当清除端为低电平时，寄存器内的数据被清零。

SN74LV165A的时钟输入引脚（CLK）和使能端（CE）可以根据实际需求进行配置。

时钟输入引脚可以选择上升沿触发或下降沿触发，以适应不同的时钟信号；使能端可以选择低电平有效或高电平有效，以满足不同的控制要求。

SN74LV165A具有很多优点，使其在实际应用中得到广泛的应用。

首先，它可以扩展微控制器的输入端口，使其能够同时读取多个输入信号。

其次，它可以实现串行数据的并行输出，提高数据处理的效率。

此外，SN74LV165A的工作电压范围广泛，从2V到5.5V，可以适应不同的电源系统。

在实际应用中，SN74LV165A可以用于数据采集、键盘输入、状态检测等场景。

例如，在一个温度监控系统中，可以使用SN74LV165A从多个温度传感器中读取数据，并将数据传输给微控制器进行处理和显示。

又如，在一个键盘输入系统中，可以使用SN74LV165A来读取用户按下的按键，并将按键数据传输给微控制器进行相应的操作。

SN74LV165A是一种功能强大的串行输入、并行输出的移位寄存器，它具有广泛的应用领域。

通过合理配置时钟输入引脚和使能端，可以实现高效的数据采集和处理。

在实际应用中，SN74LV165A可以用于数据采集、键盘输入、状态检测等场景，为各种系统的设计提供了便利。

SN54LS123J中文资料

PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 752658POST OFFICE BOX 655303 • DALLAS, TEXAS 752659 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-7603901VEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 5962-7603901VFAACTIVE CFP W 161None Call TI Level-NC-NC-NC 7603901EA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 7603901FA ACTIVE CFP W 161None Call TI Level-NC-NC-NC JM38510/01203BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/31401BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401BFAACTIVE CFP W 161None Call TI Level-NC-NC-NC SN54122J OBSOLETE CDIP J 14None Call TI Call TISN54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN74122N OBSOLETE PDIP N 14None Call TI Call TISN74123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS122D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS122N3OBSOLETE PDIP N 14None Call TI Call TISN74LS122NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123D ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123DR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123J OBSOLETE CDIP J 16None Call TI Call TISN74LS123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS123NSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54122J OBSOLETE CDIP J 14None Call TI Call TISNJ54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54123W ACTIVE CFP W 161None Call TI Level-NC-NC-NC SNJ54LS123FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54LS123WACTIVECFPW161NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 28-Feb-2005Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LV14A中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN5405, SN54LS05, SN54S05 TTL型反相器说明书

SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20031POST OFFICE BOX 655303 •DALLAS, TEXAS 75265D Package Options Include PlasticSmall-Outline (D, NS), Shrink Small-Outline (DB), and Ceramic Flat (W) Packages,Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPsD Dependable Texas Instrument Quality andReliabilitySN5405, SN54LS05, SN54S05...J PACKAGESN7405...N PACKAGESN74LS05...D, DB, N, OR NS PACKAGE SN74S05...D, N, OR NS PACKAGE(TOP VIEW)12345671413121110981A 1Y 2A 2Y 3A 3Y GNDV CC 6A 6Y 5A 5Y 4A 4Y32120199101112134567818171615146Y NC 5A NC 5Y2A NC 2Y NC 3ASN54LS05, SN54S05...FK PACKAGE(TOP VIEW)1Y 1A N C 4A6A3Y G N D N C C CV 4Y NC − No internal connectionSN54LS05, SN54S05...W PACKAGE (TOP VIEW)12345671413121110981A 2Y 2A V CC 3A 3Y 4A1Y 6A 6Y GND 5Y 5A 4Ydescription/ordering informationThese devices contain six independent inverters. T o perform correctly, the open-collector outputs require pullup resistors. These devices may be connected to other open-collector outputs to implement active-low wired-OR or active-high wire-AND functions. Open-collector devices often are used to generate high V OH levels.ORDERING INFORMATIONT APACKAGE †ORDERABLE PART NUMBER TOP-SIDE MARKING SN7405NSN7405N SN74LS05N SN74LS05N PDIP − NTube SN74S05N SN74S05N TubeSN74LS05D Tape and reel SN74LS05DR LS050°C to 70°CSOIC − DTube SN74S05D Tape and reelSN74S05DR S05SN74LS05NSR 74LS05SOP − NS Tape and reel SN74S05NSR 74S05SSOP − DB Tape and reel SN74LS05DBR LS05SNJ54LS05J SNJ54LS05J CDIP − JTube SNJ54S05J SNJ54S05J SNJ54LS05W SNJ54LS05W −55°C to 125°CCDIP − W Tube SNJ54S05W SNJ54S05W SNJ54LS05FK SNJ54LS05FK LCCC − FKTubeSNJ54S05FKSNJ54S05FK†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.The SN5405 is obsolete and no longer is supplied.Copyright 2003, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.On products compliant to MILĆPRFĆ38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20032POST OFFICE BOX 655303 •DALLAS, TEXAS 75265FUNCTION TABLE (each inverter)INPUT OUTPUTA YH L LHlogic diagram (positive logic)1A2A3A4A5A6A 1Y2Y3Y4Y5Y6Y1359111324681012Y = APin numbers shown are for the D, DB, J, N, and NS packages.The SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20033POST OFFICE BOX 655303 •DALLAS, TEXAS 75265schematic (each inverter)Resistor values shown are nominal.4 k ΩInputAOutput YGNDV CC1.6 k Ω1 k Ω’0520 k ΩInputAOutput YV CC8 k Ω4.5 k Ω’LS05GND2.8 k ΩOutput YV CC900 Ω500 Ω’S05InputA250 Ωabsolute maximum ratings over operating free-air temperature (unless otherwise noted)†Supply voltage, V CC (see Note 1): ’05, ’LS05, ’S05 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, V I : ’05, ’S05 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ’LS05 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Off-state output voltage, V O 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 2):D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DB package 96°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N package 80°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, T stg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.Voltage values are with respect to network ground terminal.2.The package thermal impedance is calculated in accordance with JESD 51-7.The SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20034POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN5405SN7405MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 1616mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)†SN5405SN7405PARAMETER TEST CONDITIONS MIN TYP ‡MAX MIN TYP ‡MAX UNIT V IK V CC = MIN,I I = −12 mA −1.5−1.5V I V V V IL = 0.8 V 0.25OH CC = MIN,OH = 5.5 V V IL = 0.7 V 0.25mA V OL V CC = MIN,V IH = 2 V,I OL = 16 mA0.20.40.20.4V I I V CC = MAX,V I = 5.5 V 11mA I IH V CC = MAX,V I = 2.4 V 4040µA I IL V CC = MAX,V I = 0.4 V −1.6−1.6mA I CCH V CC = MAX,V I = 0 V 612612mA I CCLV CC = MAX,V I = 4.5 V18331833mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 1)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH R L = 4 k ΩL 4055t PHLAYR L = 400 ΩC = 15 pF815nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20035POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN54LS05SN74LS05MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.70.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 48mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)SN54LS05SN74LS05PARAMETER TEST CONDITIONS †MIN TYP ‡MAXMIN TYP ‡MAXUNIT V IK V CC = MIN,I I = −18 mA −1.5−1.5V I OH V CC = MIN,V IL = MAX,V OH = 5.5 V0.10.1mA V V V I OL = 4 mA 0.250.40.250.4OL CC = MIN,IH = 2 V I OL = 8 mA0.350.5V I I V CC = MAX,V I = 7 V 0.10.1mA I IH V CC = MAX,V I = 2.7 V 2020µA I IL V CC = MAX,V I = 0.4 V −0.4−0.4mA I CCHV CC = MAX,V I = 0 V1.22.41.22.4mA I CCL V CC = MAX,V I = 4.5 V3.6 6.6 3.66.6mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 2)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH L ΩL 1732t PHLAYR = 2 k ,C = 15 pF1528nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20036POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN54S05SN74S05MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 2020mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)†SN54S05SN74S05PARAMETER TEST CONDITIONS MIN TYP ‡MAXMIN TYP ‡MAXUNIT V IK V CC = MIN,I I = −18 mA −1.2−1.2V I V V V IL = 0.8 V 0.25OH CC = MIN,OH = 5.5 V V IL = 0.7 V 0.25mA V OL V CC = MIN,V IH = 2 V,I OL = 20 mA0.50.5V I I V CC = MAX,V I = 5.5 V 11mA I IH V CC = MAX,V I = 2.7 V 5050µA I IL V CC = MAX,V I = 0.5 V −2−2mA I CCH V CC = MAX,V I = 0 V 919.8919.8mA I CCLV CC = MAX,V I = 4.5 V30543054mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 1)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONSMIN TYP MAX UNIT t PLH L 257.5t PHL L C = 15 pF24.57nst PLH AYR = 280 ΩL 7.5t PHLC = 50 pF7nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20037POST OFFICE BOX 655303 •DALLAS, TEXAS 75265PARAMETER MEASUREMENT INFORMATIONSERIES 54/74 AND 54S/74S DEVICESFrom Output Under TestC L(see Note A)R LTest PointV CCLOAD CIRCUIT1.5 V1.5 VHigh-LevelPulse1.5 V1.5 Vt wLow-LevelPulseVOLTAGE WAVEFORMSPULSE WIDTHSNOTES: A.C L includes probe and jig capacitance.B.In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, and:For Series 54/74, t r ≤ 7 ns, t f ≤ 7 ns.For Series 54S/74S, t r ≤ 2.5 ns, t f ≤ 2.5 ns.D.The outputs are measured one at a time with one input transition per measurement.1.5 V1.5 VInputt PLHIn-Phase Output3 V0 V 1.5 V1.5 VV OHV OL t PHL1.5 V1.5 VV OHV OLt PHLt PLHOut-of-PhaseOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESFigure 1. Load Circuit and Voltage WaveformsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20038POST OFFICE BOX 655303 •DALLAS, TEXAS 75265PARAMETER MEASUREMENT INFORMATIONSERIES 54LS/74LS DEVICESFrom Output Under TestC L(see Note A)R LTest PointV CCLOAD CIRCUIT1.3 V1.3 VHigh-LevelPulse1.3 V1.3 Vt wLow-LevelPulseVOLTAGE WAVEFORMSPULSE WIDTHSNOTES: A.C L includes probe and jig capacitance.B.In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, t r ≤ 1.5 ns, t f ≤ 2.6 ns.D.The outputs are measured one at a time with one input transition per measurement.1.3 V1.3 VInputt PLHIn-Phase Output3 V0 V 1.3 V1.3 VV OHV OL t PHL1.3 V1.3 VV OHV OLt PHLt PLHOut-of-PhaseOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESFigure 2. Load Circuit and Voltage WaveformsThe SN5405 is obsolete and no longer is supplied.PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2PACKAGE OPTION ADDENDUM 11-Apr-2023OTHER QUALIFIED VERSIONS OF SN54LS05, SN54S05, SN74LS05, SN74S05 :•Catalog : SN74LS05, SN74S05•Military : SN54LS05, SN54S05NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 3 1-Jul-2023TAPE AND REEL INFORMATIONA0B0K0WDimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONS Sprocket Holes P1*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS05DBR SSOPDB 142000330.016.48.35 6.6 2.412.016.0Q1SN74LS05DR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1SN74LS05NSR SONS 142000330.016.48.210.5 2.512.016.0Q1SN74S05NSR SO NS 142000330.016.48.210.5 2.512.016.0Q11-Jul-2023*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm) SN74LS05DBR SSOP DB142000356.0356.035.0SN74LS05DR SOIC D142500356.0356.035.0SN74LS05NSR SO NS142000356.0356.035.0SN74S05NSR SO NS142000356.0356.035.01-Jul-2023 TUBET - Tube*All dimensions are nominalDevice Package Name Package Type Pins SPQ L (mm)W (mm)T (µm) B (mm)SN7405N N PDIP142550613.9711230 4.32SN7405N N PDIP142550613.9711230 4.32SN7405NE4N PDIP142550613.9711230 4.32SN7405NE4N PDIP142550613.9711230 4.32SN74LS05D D SOIC1450506.683940 4.32SN74LS05N N PDIP142550613.9711230 4.32SN74LS05N N PDIP142550613.9711230 4.32SN74LS05NE4N PDIP142550613.9711230 4.32SN74LS05NE4N PDIP142550613.9711230 4.32SN74S05D D SOIC1450506.683940 4.32SN74S05N N PDIP142550613.9711230 4.32SN74S05N N PDIP142550613.9711230 4.32SNJ54LS05FK FK LCCC201506.9812.062030NASNJ54LS05W W CFP141506.9826.166220NASNJ54S05FK FK LCCC201506.9812.062030NAGENERIC PACKAGE VIEWThis image is a representation of the package family, actual package may vary.Refer to the product data sheet for package details.LCCC - 2.03 mm max height FK 20LEADLESS CERAMIC CHIP CARRIER8.89 x 8.89, 1.27 mm pitchPACKAGE OUTLINECDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGENOTES:1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This package is hermitically sealed with a ceramic lid using glass frit.4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.5. Falls within MIL-STD-1835 and GDIP1-T14.EXAMPLE BOARD LAYOUTCDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGEMECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001POST OFFICE BOX 655303 •DALLAS, TEXAS 75265DB (R-PDSO-G**)PLASTIC SMALL-OUTLINE4040065/E 12/0128 PINS SHOWNGage Plane8,207,400,550,950,253812,9012,302810,50248,50Seating Plane9,907,903010,509,900,385,605,00150,2214A 28120166,506,50140,05 MIN 5,905,90DIMA MAX A MIN PINS **2,00 MAX 6,907,500,65M 0,150°–ā8°0,100,090,25NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion not to exceed 0,15.D.Falls within JEDEC MO-150IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements.These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.TI objects to and rejects any additional or different terms you may have proposed.Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2023, Texas Instruments Incorporated。

SN54LS07_91中文资料

元器件交易网SN54LS07, SN74LS07, SN74LS17HEX BUFFERS/DRIVERS WITHOPEN-COLLECTOR HIGH-VOLTAGE OUTPUTSCopyright 1991, Texas Instruments IncorporatedV OH High-level output voltage V SN54LS07SN54LS07, SN74LS07, SN74LS17HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS元器件交易网I OHV OL V CC = MIN,V IL = 0.8 V V CC = MIN,V IH = 2 V V mA SN54LS07PARAMETERTEST CONDITIONS MIN TYP MAX UNIT A Y R L = 110 Ω,C L = 15 pF nsSN54LS07, SN74LS07, SN74LS17HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1995, Texas Instruments Incorporated。

SN54LS365A资料

元器件交易网
3-STATE HEX BUFFERS
These devices are high speed hex buffers with 3-state outputs. They are organized as single 6-bit or 2-bit / 4-bit, with inverting or non-inverting data (D) paths. The outputs are designed to drive 15 TTL Unit Loads or 60 Low Power Schottky loads when the Enable (E) is LOW. When the Output Enable (E) is HIGH, the outputs are forced to a high impedance “off” state. If the outputs of the 3-state devices are tied together, all but one device must be in the high impedance state to avoid high currents that would exceed the maximum ratings. Designers should ensure that Output Enable signals to 3-state devices whose outputs are tied together are designed so there is no overlap.
2
3
4
5
6
7
8 GND
TRUTH TABLE
INPUTS E1 L L H X E2 L L X H D L H X X L H (Z) (Z) OUTPUT L L H X

SN54LS607资料

Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1996, Texas Instruments IncorporatedTexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN54LVC07A中文资料

元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. To minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2003, Texas Instruments Incorporated。

聚四氟乙烯性能参数

1．聚四氟乙烯聚四氟乙烯是用于密封的氟塑料之一。

聚四氟乙烯以碳原子为骨架，氟原子对称而均匀地分布在它的周围，构成严密的屏障，使它具有非常宝贵的综合物理机械性能(表14—9)。

聚四氟乙烯对强酸、强碱、强氧化剂有很高的抗蚀性，即使温度较高，也不会发生作用，其耐腐蚀性能甚至超过玻璃、陶瓷、不锈钢以至金、铂，所以，素有“塑料王”之称。

除某些芳烃化合物能使聚四氟乙烯有轻微的溶胀外，对酮类、醇类等有机溶剂均有耐蚀性。

只有熔融态的碱金属及元素氟等在高温下才能对它起作用。

聚四氟乙烯的介电性能优异，绝缘强度及抗电弧性能也很突出，介质损耗角正切值很低，但抗电晕性能不好。

聚四氟乙烯不吸水、不受氧气、紫外线作用、耐候性好，在户外暴露3年，抗拉强度几乎保持不变，仅伸长率有所下降。

聚四氟乙烯薄膜与涂层由于有细孔，故能透过水和气体。

聚四氟乙烯在200℃以上，开始极微量的裂解，即使升温到结晶体熔点327℃，仍裂解很少，每小时失重为万分之二。

但加热至400℃以上热裂解速度逐渐加快，产生有毒气体，因此，聚四氟乙烯烧结温度一般控制在375～380℃。

聚四氟乙烯分子间的范德华引力小，容易产生键间滑动，故聚四氟乙烯具有很低的摩擦系数及不粘性，摩擦系数在已知固体材料中是最低的。

聚四氟乙烯的导热系数小，该性能对其成型工艺及应用影响较大。

其不但导热性差，且线膨胀系数较大，加入填充剂可适当降低线膨胀系数。

在负荷下会发生蠕变现象，亦称作“冷流”，加入填充剂可减轻蠕变程度。

聚四氟乙烯可以添加不同的填充剂，选择的填充剂应基本满足下述要求：能耐380℃高温即四氟制品的烧结温度；与接触的介质不发生反应；与四氟树脂有良好的混入性；能改善四氟制品的耐磨性、冷流性、导热性及线膨胀系数等。

常用的填充剂有无碱无蜡玻璃纤维、石墨、碳纤维、MoS2、A123、CaF2、焦炭粉及各种金属粉。

如填充玻璃纤维或石墨，可提高四氟制品的耐磨、耐冷流性，填充MoS2可提高其润滑性，填充青铜、钼、镍、铝、银、钨、铁等，可改善导热性，填充聚酰亚胺或聚苯酯，可提高耐磨性，填充聚苯硫醚后能提高抗蠕变能力，保证尺寸稳定等。

SNJ54LV4040AFK中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LV4040AD ACTIVESOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADBR ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADBRE4ACTIVE SSOP DB 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADGVR ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADGVRE4ACTIVE TVSOP DGV 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ADRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040AN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LV4040ANE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LV4040ANSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ANSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APW ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWE4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWR ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWRE4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWRG4ACTIVE TSSOP PW 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWT ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040APWTE4ACTIVE TSSOP PW 16250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV4040ARGYR ACTIVE QFN RGY 161000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LV4040ARGYRG4ACTIVEQFNRGY161000Green (RoHS &no Sb/Br)CU NIPDAULevel-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.6-Dec-2006NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Dec-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。

SNJ54145J中文资料

PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-8508401VEAACTIVE CDIP J 161TBD Call TICall TI85084012A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 85084012A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 8508401EA ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type 8508401EA ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type 8508401FA ACTIVE CFP W 161TBD A42N /A for Pkg Type 8508401FA ACTIVE CFP W 161TBD A42N /A for Pkg Type SN54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SN54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SN74145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145N3OBSOLETE PDIP N 16TBD Call TI Call TI SN74145N3OBSOLETE PDIP N 16TBD Call TI Call TISN74145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRACTIVESOICD162500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM4-Jun-2007Orderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LS145DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145N3OBSOLETE PDIP N 16TBD Call TI Call TI SN74LS145N3OBSOLETE PDIP N 16TBD Call TI Call TISN74LS145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SNJ54145J ACTIVE CDIP J 161TBD A42SNPBN /A for Pkg TypeSNJ54LS145FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54LS145FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SNJ54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SNJ54LS145W ACTIVE CFP W 161TBD A42N /A for Pkg Type SNJ54LS145WACTIVECFPW161TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered4-Jun-2007at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.4-Jun-2007TAPE AND REELINFORMATION9-Jun-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74145NSR NS 16MLA 330168.210.5 2.51216Q1SN74LS145DR D 16FMX 330166.510.3 2.1816Q1SN74LS145NSRNS16MLA330168.210.52.51216Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74145NSR NS 16MLA 342.9336.628.58SN74LS145DR D 16FMX 342.9336.628.58SN74LS145NSRNS16MLA342.9336.628.589-Jun-20079-Jun-2007PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)5962-8508401VEAACTIVE CDIP J 161TBD A42SNPBN /A for Pkg Type85084012A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 85084012A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 8508401EA ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type 8508401EA ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type 8508401FA ACTIVE CFP W 161TBD A42N /A for Pkg Type 8508401FA ACTIVE CFP W 161TBD A42N /A for Pkg Type SN54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SN54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SN74145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145N3OBSOLETE PDIP N 16TBD Call TI Call TI SN74145N3OBSOLETE PDIP N 16TBD Call TI Call TISN74145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRACTIVESOICD162500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM9-Oct-2007Orderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LS145DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145N3OBSOLETE PDIP N 16TBD Call TI Call TI SN74LS145N3OBSOLETE PDIP N 16TBD Call TI Call TISN74LS145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRE4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS145NSRG4ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SNJ54145J ACTIVE CDIP J 161TBD A42SNPBN /A for Pkg TypeSNJ54LS145FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54LS145FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SNJ54LS145J ACTIVE CDIP J 161TBD A42SNPB N /A for Pkg Type SNJ54LS145W ACTIVE CFP W 161TBD A42N /A for Pkg Type SNJ54LS145WACTIVECFPW161TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered9-Oct-2007at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.9-Oct-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74145NSR NS 16SITE 41330168.210.5 2.51216Q1SN74LS145DR D 16SITE 2733016 6.510.3 2.1816Q1SN74LS145NSRNS16SITE 41330168.210.52.51216Q14-Oct-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74145NSR NS 16SITE 41346.0346.033.0SN74LS145DR D 16SITE 27342.9336.628.58SN74LS145NSRNS16SITE 41346.0346.033.04-Oct-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74LVC07中文资料

TA
Operating free-air temperature
VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V
Reel of 250
SN74LVC07APWT
TVSOP – DGV
Reel of 2000
SN74LVC07ADGVR
CDIP – J
Tube of 25
SNJ54LVC07AJ
CFP – W
Tube of 150
SNJ54LVC07AW
LCCC – FK
Tube of 55
SNJ54LVC07AFK
Inputs can be driven from 1.8-V, 2.5-V, 3.3-V (LVTTL), or 5-V (CMOS) devices. This feature allows the use of these devices as translators in a mixed-system environment.
(2) Product preview
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER VOL
VCC Supply voltage range
VI

SN54LS95BJ资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

SNJ5407FK中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00803BCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/00803BDA ACTIVE CFP W141None Call TI Level-NC-NC-NC SN5407J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SN5417J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSN7407D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7407DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7407J OBSOLETE CDIP J14None Call TI Call TISN7407N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7407N3OBSOLETE PDIP N14None Call TI Call TISN7407NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7417N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7417N3OBSOLETE PDIP N14None Call TI Call TISN7417NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSNJ5407FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NCSNJ5407J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSNJ5407W ACTIVE CFP W141None Call TI Level-NC-NC-NCSNJ5417J ACTIVE CDIP J141None Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS86A中文资料

SN54LS86A中文资料PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/07501BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/07501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/07501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30502B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30502B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30502BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30502BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30502BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30502BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5486J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5486J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS86AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS86AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S86J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S86J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7486N OBSOLETE PDIP N14TBD Call TI Call TISN7486N OBSOLETE PDIP N14TBD Call TI Call TISN7486N3OBSOLETE PDIP N14TBD Call TI Call TISN7486N3OBSOLETE PDIP N14TBD Call TI Call TI SN74LS86AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ADR ACTIVE SOIC D142500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ADR ACTIVE SOIC D142500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ADRE4ACTIVE SOIC D142500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ADRE4ACTIVE SOIC D142500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86AN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NCSN74LS86AN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS86AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS86AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS86ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS86ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS86ANSR ACTIVE SO NS142000Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS86ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ANSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS86ANSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S86N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S86N3OBSOLETE PDIP N14TBD Call TI Call TISN74S86N3OBSOLETE PDIP N14TBD Call TI Call TISN74S86NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S86NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S86NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S86NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5486J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ5486J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ5486W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ5486W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS86AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS86AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS86AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS86AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ54LS86AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS86AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S86FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S86FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S86J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S86J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S86W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S86W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latestrelevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and co nditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。