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CommScope HT3540H Series双密度全谱宽带WDM传输系统商品说明书

DATA SHEETHeadend Optics Platform (CH3000)HT3540H SeriesDouble-Density Full Spectrum DWDM Transmitter SystemThe CommScope HT3540H Series Double ‐Density Full Spectrum Dense Wave Division Multiplexing (DWDM) Transmitter System provides high performance and a high rack density forward path transmission solution for Cable TV service providers.The high ‐density packaging design allows up to four (4) HT3540H series high performance transmitters plus a CC3008 Communications Control Module to be stacked vertically and contained by the CA3008 module carrier, requiring only two chassis slots of a 3RU chassis. The compact solution supports up to 24 transmitters in a CH3000 chassis, including redundant power supplies.•Available in 40 wavelengths on ITU 100 GHz grid •Hot plug ‐in/out, individually replaceable transmitter modules•Optimized for full spectrum loading•Analog loading up to 552 MHz plus QAM loading •Manual or Automatic Gain Control (AGC) modes •Low power consumption•High rack density: 24 transmitters per 3RU chassis, with redundant power supplies and optical multiplexing•Front panel ‐20 dB input test point •Front panel laser On/Off switch•Local and remote status monitoring featuresFEATURESWhen installed in the chassis, the transmitters interface to a “zero ‐slot” back plate, providing support for up to four HT3540H series transmitters. The figure below shows a fully loaded carrier mated to the BD35M4 Double ‐Density multiplexing back plate that supports optical combining of four DWDM wavelengths in the forward path.The CC3008 Communications Module installed at the top of a HT3540H series transmitter stack provides the communications interface between the transmitters and the CH3000 mid ‐plane bus, allowing complete configuration and management control of the stack, both local andremote.HT3540H Series Quad ‐Stack and CC3008 Communications Module joined with a BD35M4 Multiplexing Back PlateHT3540H Series Double Density Full Spectrum DWDM Transmitters (1.2 GHz Passband)CommScope HT3540H Series Double‐Density Full Spectrum DWDM Transmitters are a key element of the CommScope HFC and Fiber Deep architectures in support of the evolution to all QAM transmission. These high‐performance transmitters are designed for Dense Wave Division Multiplexing (DWDM) applications for point‐to‐point forward path transmission of full spectrum broadcast and narrowcast services.HT3541H series transmitters are designed for “light” analog channel loading from 0 to 30 analog channels (up to 258 MHz) plus QAM channel loading, or for all QAM loading. They are also designed for QAM‐only loading for digital services as part of a BC/NC overlay system.HT3542H series transmitters are designed for “full” analog channel loading from 0 to 79 analog channels (up to 552 MHz) plus QAM channel loading.HT3543H series transmitters are designed for all QAM loading.These transmitters incorporate advanced dispersion compensation circuitry to enable transmission of high‐quality signals over maximum distances.The above figure shows a front view of the CA3008 carrier components: a single HT354xH Double‐Density Transmitter (left); a single CC3008 Communications Module (right), and a fully loaded “stack” (center) providing four (4) DWDM transmitters, requiring only 2 vertical slots of a CH3000 Chassis. A fully loaded CH3000 chassis supports 24 Double‐Density DWDM transmitters and redundant power supplies.Features•DWDM transmitter: 40 wavelengths on the ITU grid •Manual or Automatic Gain Control (AGC) modes •RF input amplification up to +6 dB•Optimized for full spectrum loading•HT3541H: Analog loading up to 258 MHz plus QAM loading, or all QAM loading.•HT3542H: Analog loading up to 552 MHz, plus QAM loading•HT3543H: All QAM loading •Hot plug‐in/out, individually insertable•Low power consumption•Industry’s highest DWDM rack density: 24 transmitters per 3RU chassis, with redundant power supplies •Front access ‐20 dB input test point•Front panel laser On/Off interlock switch•Local and remote status monitoringHT3540H SERIES SPECIFICATIONSPhysicalDimensions11.5” D x 0.8” H x 2.0” W (29.2 x 2.0 x 5.1 cm)*Weight0.75 lbs. (0.34 kg)* Four (4) transmitter units designed to be vertically stacked, plus a CC3008 Communications Module, and installedinside a CA3008 Module Carrier. The combination occupies two slots in a 3RU CH3000 Chassis.EnvironmentalOperating‐20°to +65°C (‐4°to 149°F)Storage‐40°to +85°C (‐40°to +185°F)Humidity5% to 95% non‐condensingRF and Optical InterfaceRF Input F‐type male located on BD31A4 or BD35M4 Back PlatesInput RF Test Point G‐type male (located at front panel, ‐20 dB)Optical Connector SC/APC located on BD31A4 or BD35M4 Back PlatesPower RequirementsInput Voltage12 V DCPower Consumption10 W (per transmitter) including controller and back plate cooling fanGeneralHot plug‐in/outManual gain alignmentChannel LoadingHT3541H: 0–30 Analog channels (up to 258 MHz), plus QAM channelsHT3542H: 0–79 Analog channels (up to 552 MHz), plus QAM channelsHT3543H: All QAM channelsOpticalOptical Output Power10 ±0.25 dBmWavelength See DWDM ITU Channel Plans descriptionFiber Length HT3541H and HT3543H: 60 km max. (Dispersion Compensation adjustable in 5 km steps)HT3542H: 40 km max. (Dispersion Compensation adjustable in 1 km steps)Compatible with external dispersion compensation for some applicationsElectricalPassband45 to 1218 MHzFrequency Response (Flatness including Slope)•±1.0 dB (BC input @ 25°C)•±0.5 dB (NC input relative to BC input)Nominal RF Input Levels (Input Attenuator = 0 dB)HT3541H:•16.2 dBmV/ch for 30 analog channels into BC input•10.2 dBmV/ch for 256‐QAM channels into BC input, or 16.2 dBmv/ch into NC inputHT3542H:•15 dBmV/ch for 79 analog channels into BC input•9 dBmV/ch for 256‐QAM channels into BC input, or 15 dBmv/ch into NC inputHT3543H:•10.7 dBmV/ch for 154 256‐QAM channels into BC input, or 16.7 dBmV/ch into NC inputRF Input Impedance75 Ω, nomRF Input Return Loss18 dB, minRF Input Attenuator/Amplify Range (Manual Mode)‐6.0 to +5.0 dB Normal mode. High‐gain mode (+5.5, +6.0 dB) supports BC RF input port, NC RF input is terminated. RF Input Attenuator Step Size0.5 dBAGC Mode Maintains RF level to within ±3 dB of the learned RF valueLevel Stability (Typical)±0.5 dB (‐1 worst case relative to 25°C)256‐QAM BER< 10–5(pre‐FEC, ITU‐C)MER> 37 dB to 50°C; > 36 dB to 65°CLink Performance HT3541H HT3542H HT3543HLoading30A + 124 QAM79A + 75 QAM154 QAMLength (km)406030404060CNR* (dB):52505150See MER See MERCSO (dB):61586058‐‐CTB (dB):65656565‐‐* max 1 dB degradation at temperature extremesAn HT3541H transmitter can also be used as a narrowcast transmitter. For example, in BC/NC overlay systems, itwould have the performance of an AT3535G‐xx‐1‐AS transmitter.For more information about BC/NC overlay systemperformance and evolution from low NC 256‐QAM channel loading to full spectrum 256‐QAM channel loading, or forinformation about full spectrum multiwavelength applications with up to 40 DWDM wavelengths, please contact yourCommScope representative.DWDM ITU Channel PlansCommScope supports DWDM network architectures with a variety of products on the standard DWDM ITU Grid (ITU‐T G.694.1). For a more complete description, please refer to the CommScope DWDM ITU Grid Channel Plan datasheet.Plate that multiplexes the output of four HT3540H Double‐Density Full Spectrum Transmitters.This back plate provides connections for a group of four HT3540H Series Transmitters installed in the sameCA3008 Module Carrier, along with the CC3008 Communications Control Module.These 4‐channel mux back plates (for which outputs can be cascaded from one back plate to another) maybe ordered for various channel groups.BD35M4‐AC BACK PLATE SPECIFICATIONSSpecificationPhysicalDimensions7.2” D x 5.2” H x 2.0” W* (18.2 x 13.2 x 5.1 cm)Weight 2.0 lb. (0.91 kg)EnvironmentalOperating‐20°to +65°C (‐4°to 149°F)Storage‐40°to +85°C (‐40°to +185°F)Humidity5% to 95% non‐condensingPower RequirementsInput Voltage12 V DCPower Consumption5 W max (2.5 W Typ), including the replaceable cooling fanOptical InterfaceOptical Connectors SC/APC (2)•DWDM INP (input from previous mux back plate)•DWDM OUT (output to network or next mux back plate)RF Interface8 F‐Type Connectors•4 BC and 4 NC (1 BC/NC pair per transmitter)OpticalChannel Spacing100 GHzChannel Plan See ITU Channel Plans descriptionInsertion Losses, Including Connectors Typ Max•DWDM Input to DWDM Output 1.0 dB 1.2 dB•Ch. yy Input to DWDM Output 1.4 dB 1.6 dBUniformity, Including Connectors•Module Uniformity0.7 dB 1.0 dB•Paired Uniformity0.4 dB0.6 dBReturn Loss, min45 dBDirectivity, min55 dBPassband @ 0.2 dB•Ch. yy Input to DWDM Output±0.125 nm•DWDM Input to DWDM Output Passes 1423.5 through 1617.5 with a notch at the channel add/drop band. WDL for the passband is within ±0.15 dB Ripple Within Passband0.5 dB maxPolarization Dependent Loss, max0.1 dB (typically < 0.05 dB)Power Handling, max (Any Input Port)21.8 dBmThe BD31A4 is a double‐density back plate that provides a choice of 4 separate BC and 4 separate NC RF inputs, or 1 common BC and 4 separate NC RF inputs, for four HT3541H Transmitters.The BD31A4‐100 provides RF input and optical connections to or from the HT3541H transmitters.BD31A4‐100‐H12F‐0‐AS is a double density back plate that provides 4 separate BC inputs and 4 separate NC RF inputs for four HT3541H Transmitters. Also supports four separate optical output SC/APC connectors.BD31A4‐100‐H10F‐0‐AS is a double density back plate that provides 1 common BC input and 4 separate NC RF inputs for four HT3541H Transmitters. Also supports four separate optical output SC/APC connectors.BD31A4‐100‐H12F‐0‐AS Back Plate CA3008 Module CarrierBD31A4‐100 BACK PLATE SPECIFICATIONSSpecificationPhysicalDimensions7.2” D x 5.2” H x 2.0” W* (18.2 x 13.2 x 5.1 cm)Weight 2.0 lb. (0.91 kg)EnvironmentalOperating‐20°to +65°C (‐4°to 149°F)Storage‐40°to +85°C (‐40°to +185°F)Humidity5% to 95% non‐condensingPower RequirementsInput Voltage12 V DCPower Consumption5 W max (2.5 W Typ), including the replaceable cooling fanOpticalThrough 4 SC/APC connectors, the BD31A4‐100 provides optical pass‐through from the HT354xH transmitter. Optical Insertion Loss0.2 dB Typ; 0.4 dB MaxRefer to the HT354xH product specifications for more information.RF InterfaceThe BD31A4‐100 provides RF to the HT354xH transmitter through F‐type RF connectors.•4 BC and 4 NC (BD31A4‐100‐H12F‐0‐AS)•1 BC and 4 NC (BD31A4‐100‐H10F‐0‐AS)H T 354*H –D –***0–2–A SDouble Density, Full Spectrum DWDM Transmitter (1.2 GHz)1 = Type 1, up to 30A + QAM Loading2 = Type 2, up to 79A + QAM Loading3 = Type 3, for all QAM LoadingFor HT3541H and HT3542H = A + ** ITU Channel #For HT3543H = E + ** ITU Channel #**= ITU Channel Number (20 through 62;See CommScope DWDM ITU Grid Channel Plan Data Sheet)Connector Type: SC/APCHT354xH TransmitterBack PlatesB D 31A 4–100–H 1*F –0–A SDouble Density Back plate for 4 HT3xxx Full Spectrum Transmitters with SC/APC Connector 0 = 1 common BC input and 4 NC RF Inputs 2 = 4 BC inputs and 4 NC RF Inputs Connector Type: SC/APCConnector Type: SC/APCB D 35M 4–***–H 02F –*–A SDouble Density Muxing Back plate for 4 HT354x Full Spectrum Transmitters with SC/APC ConnectorHT3541H 40 Wavelength PlanCode Wavelength Group Code Wavelength Group A0J ITU CH 20 ‐23A0P ITU CH 40 ‐43A0K ITU CH 24 ‐27A0R ITU CH 44 ‐47A0L ITU CH 28 ‐31A0S ITU CH 48 ‐51A0M ITU CH 32 ‐35A0T ITU CH 52 ‐55A0NITU CH 36 ‐39A0UITU CH 56 ‐591 = For up to 30A + QAM RF Loading2 = For up to 79A + QAM RF Loading3 = For all QAM RF loadingHT3543H16 Wavelength Plan Code Wavelength Group EEA ITU CH 21, 22, 24, 26EEB ITU CH 28, 33, 36, 39EEC ITU CH 44, 48, 52, 54EEDITU CH 57,60, 61,62HT3541H and HT3542H 16 Wavelength Plan Code Wavelength Group AC1ITU CH 20, 21, 24, 29AC2ITU CH 35, 42, 52, 54AC3ITU CH 23, 33, 44, 47AC4ITU CH 51, 57, 58, 59Contact Customer Care for product information and sales:•United States: 866‐36‐ARRIS •International: +1‐678‐473‐5656RELATED PRODUCTSCH3000 Chassis Optical Patch Cords Optical Transmitters Optical Passives Digital ReturnInstallation ServicesNote: Specifications are subject to change without notice.Copyright Statement:©2022CommScope,Inc.All rights reserved.ARRIS and the ARRIS logo are trademarks of CommScope,Inc.and/or its affiliates.All other trademarks are the property of their respective owners.No part of this content may be reproduced in any form or by any means or used to make any derivative work (such as translation,transformation,or adaptation)without written permission from CommScope,Incand/orits affiliates (“CommScope”).CommScope reserves the right to revise or change this content from time to time without obligation on the part of CommScope to provide notification of such revision or change.System AccessoriesC C 3008Communications Control ModuleC A 3008Module CarrierH T 3F I L DFiller Module for Double ‐Density Slots。

赫斯曼交换机型号说明书

赫思曼（hirschmann、赫斯曼）RS20系列交换机：·可提供4个、8个、9个、16个和24个10/100Mbps端口。

·多种软件版本可供选择：非网管型（U）、网管基础版（B）、网管增强版（E）以及网管专业版（P）。

·光纤端口为多模或单模形式。

·双电源输入和故障信号触点。

·用于备份/恢复配置以及故障设备快速更换的USB端口。

·0℃至+60℃的标志温度范围（另外提供-40℃至+70℃的扩展温度范围和保护涂层）·完全网管型（支持web、SNMP和通过串口连接的CLI）-VLAN、IGMP Snooping(组播过滤）、端口镜像、端口控制、端口安全性、链路报警、广播限制器、数据流量诊断、环冗余等。

如需了解产品具体价格或技术参数，请联系我们。

常用型号：全电口RS20-0400T1T1SDAEHC （4×RJ45,0℃至+60℃标准温度，网管增强型）RS20-0400T1T1SDAPHC （4×RJ45,0℃至+60℃标准温度，网管专业版）RS20-0800T1T1SDAEHC （8×RJ45,0℃至+60℃标准温度，网管增强型）RS20-0800T1T1SDAPHC （8×RJ45,0℃至+60℃标准温度，网管专业版）RS20-1600T1T1SDAEHC （16×RJ45,0℃至+60℃标准温度，网管增强型）RS20-1600T1T1SDAPHC （16×RJ45,0℃至+60℃标准温度，网管专业版）RS20-2400T1T1SDAEHC （24×RJ45,0℃至+60℃标准温度，网管增强型）RS20-2400T1T1SDAPHC （24×RJ45,0℃至+60℃标准温度，网管专业版）多模光纤RS20-0400M2T1SDAEHC （3×RJ45 1×SC,0℃至+60℃标准温度，网管增强型）RS20-0400M2T1SDAPHC （3×RJ45 1×SC,0℃至+60℃标准温度，网管专业版）RS20-0400M2M2SDAEHC （2×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-0400M2M2SDAPHC （2×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）RS20-0800M2M2SDAEHC （6×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-0800M2M2SDAPHC （6×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）RS20-0800M4M4SDAEHC （6×RJ45 2×ST,0℃至+60℃标准温度，网管增强型）RS20-0800M4M4SDAPHC （6×RJ45 2×ST,0℃至+60℃标准温度，网管专业版）RS20-1600M2T1SDAEHC （15×RJ45 1×SC,0℃至+60℃标准温度，网管增强型）RS20-1600M2T1SDAPHC （15×RJ45 1×SC,0℃至+60℃标准温度，网管专业版）RS20-1600M2M2SDAEHC （14×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-1600M2M2SDAPHC （14×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）RS20-2400M2M2SDAEHC （22×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-2400M2M2SDAPHC （22×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）单模光纤RS20-0400S2T1SDAEHC （3×RJ45 1×SC,0℃至+60℃标准温度，网管增强型）RS20-0400S2T1SDAPHC （3×RJ45 1×SC,0℃至+60℃标准温度，网管专业版）RS20-0400S2S2SDAEHC （2×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-0400S2S2SDAPHC （2×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）RS20-0800S2S2SDAEHC （6×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-0800S2S2SDAPHC （6×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）RS20-1600S2S2SDAEHC （14×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-1600S2S2SDAPHC （14×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）RS20-2400S2S2SDAEHC （22×RJ45 2×SC,0℃至+60℃标准温度，网管增强型）RS20-2400S2S2SDAPHC （22×RJ45 2×SC,0℃至+60℃标准温度，网管专业版）赫思曼（hirschmann、赫斯曼）MS4128-L2P系列交换机：·4个100Mbps插槽形式。

Parker Hose 产品目录说明书

More of what you need to work smarter,AccessoriesV i s u a l I n d e x59RG D-17T1RG D-17Partek Sleeve D-18ParKoil™ (PG) D-19GuardsO-Rings for CA, CE,CF MetricFlange “D” Rings Caterpillar ® Style FlangesT ube O-Ring Fittings and CompressorFittingsO-Rings for Compression Fittings (IT126)O-Rings for C9, OC, 1C Metric Swivels88HC-H Clamp D-2488DB Clamp D-24Hose Assembly D-26Workstations3/4 Reel Rack D-2772B-Cabinet D-28HR6 Hose Bin D-28Hose Adapters D437° Flare Metric Triple-Lok ®Sizes: 6 mm – 38 mmMaterials : Steel, Stainless Steel Pressures : Up to 7200 psi60° Cone BSPPK4Sizes : 1/8” – 2”Materials : Steel Pressures : Up to 5000 psi30° Flare Komatsu StyleSizes : M14 x 1.5 – M33 x 1.5Materials : Steel Pressures : Up to 4000 psiO-Ring Face-Seal Metric Seal-Lok™Sizes: 1/4” – 2”Materials: Steel, Stainless Steel Pressures: Up to 9200 psiJapanese Industrial Standard JISSizes : 1/4” – 1”Materials : Steel Pressures : Up to 5000 psiWhen ordering Parker Adapters, please state the Catalogued Number of each type of adapter desired. Be sure to double check tube and hose sizes of items required.To select proper seal materials for specific applications, refer to Media Compatibility Chart in Tube Fitting Catalog 4300, or contact your Parker Tube Fitting Distributor.If in doubt about which type or size of fitting to specify, consult your Parker Tube Fitting Distributor. In addition Parker Field Sales, Technical Services,the Tube Fitting Division and your local Parker Service Center will help you find answers to all your issues.Phone: (614) 279-7070Fax: (614) 279-7685Web: /tfdNote: Refer to Parker Catalog 4300 for more detailed application information.CALL TOLL-FREE 1-800-C PARKER (1-800-272-7537)Parker Information Center for catalogs, literature or additional information.O-Ring Face-Seal Seal-Lok™ Sizes: 6 mm – 38 mm Materials: Steel, Stainless Steel Pressures: Up to 9200 psi37° Flare FittingsTriple-Lok ®Sizes: 1/8” – 2”Materials: Steel, Stainless Steel, BrassPressures: Up to 9000 psiPipe Fittings and Port AdaptersSizes: 1/8” – 2”Materials : Steel, Stainless Steel, BrassPressures : Up to 7200 psiPipe SwivelsSizes : 1/8” – 2”Materials : Steel, Stainless Steel Pressures : Up to 5000 psiConversion AdaptersSizes: 1/4” – 1-1/2”Materials : Steel, Stainless Steel Pressures : Up to 7700 psiHydraulic Flange and Flange AdaptersSizes : 3/4” – 3”Materials : Steel, Stainless Steel Pressures : Up to 6000 psi15T3SAE (Code 61) Flange – Male SAE (JIC) 37˚ FlareCaution: Do not use the T3 flange to tube or swivel nut to tube adapter in hose assembly applications inwhich pressures exceed the SAE100R2 working pressure range.17T3SAE (Code 61) Flange – Male SAE (JIC) 37˚ Flare - 45˚ Elbow19T3SAE (Code 61) Flange – Male SAE (JIC) 37˚ Flare - 90˚ Elbow39T3Male - Female Swivel - SAE (JIC) 37˚ - 90˚ Elbow41T3Male - Female Swivel - SAE (JIC) 37˚ - 90˚ Elbow - Long4AH3SAE Code 61 Flange - Male SAE (JIC) 37˚ Flare - 5000 psi Caution: Do not use the T3 flange to tube or swivel nut to tube adapter in hose assembly applications in which pressures exceed the SAE100R2 working pressure range.4FH3SAE Code 61 Flange - Male SAE (JIC) 37˚ Flare - 5000 psi -45˚ Elbow4NH3SAE Code 61 Flange - Male SAE (JIC) 37˚ Flare - 5000 psi -90˚ Elbow6AH3SAE Code 62 Flange - Male SAE (JIC) 37˚ Flare6FH3SAE Code 62 Flange - Male SAE (JIC) 37˚ Flare - 45˚ Elbow4AJMCode 61 Flange - Male Seal-Lok4FJMCode 61 Flange - Male Seal-Lok - 45˚ Elbow4NJMCode 61 Flange - Male Seal-Lok - 90˚ Elbow6NH3SAE Code 62 Flange - Male SAE (JIC) 37˚ Flare - 90˚ Elbow6NJMCode 62 Flange - Male Seal-Lok - 90˚ Elbow6FJMCode 62 Flange - Male Seal-Lok - 45˚ Elbow6AJMCode 62 Flange - Male Seal-LokNote:*5000 psi with 4A, 4F and 4N Fittings and 50H Flange Halves.There are two non-interchangeable SAE split flanges: a: S tandard or Code 61 is for 3,000psi to 5,000psi maximum, depending on size.b.H igh Pressure or Code 62 is for 6,000psi maximum, r egardless of size. The flange head is “V” notched for identification.Consult these tables to determine flange halves and flange kits specifications.High Pressure (Code 62)Standard Pressure (Code 61)Note: For use with 4A, 4F and 4N Flanges.50H5000 psi Flange Half (Code 61)Note: For use with 4A, 4F and 4N Flanges.Note: High pressure applications also require the use of Code 61 Flange End hose fittings.51HSAE Flange Half (Code 61)5050HK5000 psi Flange Kit (Code 61)5151HKSAE Flange Kit (Code 61)HFHSAE Flange Half (Code 62) HFHFHKSAE Flange Kit (Code 62) 8FHFlange Half (8000 psi)8FHFHKFlange Kit (8000 psi)DIN and ISO Metric PortsDIN (German) and ISO (International Organization for Standardization) flange heads are the same as SAE flange heads. By comparison, the ports have the same configura-tion except that the DIN and ISO Type I ports accept metric bolts. This requires specialflange halves in most sizes.Note: High pressure applications also require the use of Code 62 Flange End hose fittings.M1HDIN (ISO) Flange HalfM1M1HKDIN (ISO) Flange Kit (Code 61)M2M2HKDIN (ISO) Flange Kit (Code 62)M2HDIN (ISO) Flange Half (Code 62)711509O-Rings - SAE Thread (Compound N552-90)*711510O-Rings - Code 61 and Code 62 Flanges (Compound N552-90)**Note: F or use with petroleum base fluids, other compounds available for Phosphate Ester fluids.Please contact The Parker Hannifin Seal Group/O-Ring Division (1-800-C-PARKER) for additional information.C9RG O-Rings for CA, CE, CF MetricC9RG O-Rings for C9, OC, 1C Metric SwivelsD9DTBonded Seal for BSPP Port Fittings*Note: D 9DT must be ordered from the Tube FittingsDivision. Please contact TFD for additional size and product information.XARGFlange “D” Rings Caterpillar ®Style FlangesJ0RGO-Rings - Seal-Lok ®Note: O -Rings for use in Seal-Lok ® connections are illustrated in actual size. Part numbers for O-Ringsused in Seal-Lok ® and in SAE port connections are also listed in the table. O-Rings are supplied in Nitrile NBR compound, 90 durometer hardness.SAE 711509-4-8Seal-Lok J0RG-8-8Photo shows an actual comparison between an SAE port O-Ring (top) and a Seal-Lok ® O-Ring (bottom). They differ in both diameter and cross section.8ARGFlange “D” Rings for 76 Series Style FlangeT1RGO-Rings for Compression Fittings (1T126)Charge Ports CapsR134aR12CORGCaptive O-Ring Assembly ToolsParker’s new CORG Assembly Tools are designed to facilitate the installation of the O-Ring into the half-dovetail groove of the O-Ring face seal fitting.Note: C ORG Assembly T ools must be ordered from the T ube Fittings Division (614) 279-7070.Note: O -Rings listed are for use with petroleum base fluids. Other compounds are available for Phosphate Ester fluids by special order. For Viton ® or otherO-Ring compounds, consult Parker Hannifin, Seal/O-Rings Products Division (1-800-C-PARKER.)Bench TypeHand Type59RGO-Rings for Tube O-Ring Fittingsand Compressor FittingsNote:T he above O-Rings (RG) have HNBR compound number N1195-70 (green).Accessory Selection Guide – Partek Sleeve (AS-B, AS-Y or PS)Note: T he inside flat “A” dimension correspondswith the inside diameter “B” dimension. For example, AS-Y -13 flat surface “A” is 1.34 in. This offers a .86 in. inside diam-eter “B”. Hose with a smaller O.D. can be specified for this size sleeve. Parker 201-5 hose has a .58 in. O.D. and can easily be inserted in the Partek AS-Y -13Sleeve.Note: 1. T he dimensions shown are related to the hose outside diameter and may not fit over the fitting. For over the fitting applications, a larger sizesleeve may be required.2. Cut lengths are available. Contact your local distributor for prices ().Partek SleevePartek “PS” SleeveParker’s Partek Nylon Protective Sleeving gives you tough hose abrasion protection two ways. First, per the ISO 6945 specification, Partek has a unique tubular weave nylon construction, Partek “AS” is strong enough to withstand greater than 200,000 abrasion cycles without wearing through the fabric at any loca-tion. Partek “PS” can withstand greater than 50,000 abrasion cycles. In addition, this weave also gives an exceptionally smooth interior wall, allowing rubber hose to move freely inside the sleeve. This provides easy installation and prevents any internal abrasion problems. Partek sleeving is available in either black or yellow and in sizes to fit most hydraulic hose. Partek, the quick and easy solution to hose protection in high-abrasion areas.Temperature Range: -67°F to +248°F (-53°C to +120°C)Accessory Selection Guide – PolyGuard (HG)• S hield hose from abrasion and cuts • Minimize kinking• Cannot rust or corrode • R esist water, oil, gasoline, hydraulic fluid, and most solvents • I deal for bundling plastic tubing or hose lines • E asy to install without removing hose lines; no clamps neededPolyGuardHeavy-duty polyethylene provides protection in rugged operating conditions.Great for b undling high-pressure hose lines.Cut edges can be smoothed by applying heat.CAUTION: This material will support combustion.Color: BlackTemperature Range:0˚F to +200˚F (-17˚C to +93˚C)Parkoil ™Lower-cost protection for applications that call for a tighter bend radius and are less demanding.Cut edges can be smoothed by applying heat.CAUTION: This material will support combustion.Color: BlackTemperature Range:0˚F to +200˚F (-17˚C to +93˚C)Accessory Selection Guide – ParKoil ™ (PG)Accessory Selection Guide – Spring Guard and Armor GuardNote:Spring Guard and Armor Guard are packaged in 10 ft. pieces.Parker Spring Guard and Armor Guard are two products that prolong the life of hose lines that are exposed to rugged operating conditions. They distribute bending radii to avoid kinking in hose lines and protect hose from abrasion and deep cuts. Guards areconstructed of steel wire and plated to resist rust.Spring Guard (SG)Armor Guard (AG)Accessory Selection Guide – Firesleeve (FS-F)Parker Firesleeve is a flame resistant sheath that protects the hose from extreme temperature conditions. Firesleeve easily slides over hoses and readily expands over fitting. It can be assembled with Parker FSC or properly sized wormgear clamp.Construction: Braided fiberglass sleeve and an orange,bonded and seamless silicone rubber cover.Specifications: Conforms to SAE Aerospace Standard 1072A Type 2A.Temperature Range:-54˚C to +260˚C (-65˚F to +500˚F).Note: T he Firesleeve inside dimension (I.D.)must exceed the outside diameter (O.D.) of the hose and offer an allowance for easy hose insertion. For example, 201-16 has a 1.23 in. O.D. FS-S-24, with an I.D. of 1.46 in., is the suggested Firesleeve. Note: P arker FSC Clamp fits all hoses up to2 in. O.D. Note: P arker HC Clamps (wormgear) are listedon page D-24.Note: See Page D-22 for Firesleeve assembly instructions.Firesleeve (FS-F)FSC ClampPart Number: FSC(One size fits all hoses up to 2 inch O.D.)Accessory Selection Guide – Firesleeve (cont.)1. A ssemble one end fitting on hose. Cut firesleeve to same length as hose. Cover approximately 1” of each end of fire-sleeve with FSS sealant and allow to dry.2. P ush firesleeve back from cut end of hose and assemble the second end fitting. Then pull firesleeve completely over both sockets.3. I nsert tail of FSC clamp into FST clamping tool.4. P osition clamp around middle of socket and tighten with tool. Bend end of band back over buckle. Repeat on other end.Repair any scuffs or abrasions in firesleeve with FSS sealant.FSC ClampUsed to attach firesleeve around socket on hose sizes with a 2” maximum O.D.FST Clamp ToolPart Number: FST -711617 Used to secure FSC clamp.FSS Firesleeve SealantKeeps end of firesleeve from fraying - for neater, longer lasting installation.FiresleeveAssembly InstructionsAccessory Selection Guide – CL ClampVinyl coated steel clamps provide hose support where long lengths are used. Provides neater installation of hose lines, minimizes hose chafing and prevents damage to hose.Material: CR Steel with Zinc PlatingCoating: Black Vinyl Plastisol - 0,8 mm (0.03 inch) thick.Temperature Range:-40°C to +107°C (-40°F to +225°F).Accessory Selection Guide – HC, 88HC-H and 88DB ClampThe Parker HC Clamp is a stainless steel worm gear clamp designed for low presure industrial hose applications.Material: Stainless steelSpecifications: SAE J1508, Type F and Type HD88HC-HSeries Hose Clamp(High Torque Wormgear)88DBSeries Heavy Duty Hose Clamp(Double Bolt Hose Clamp)HC Hose Clamp TableNote: See 88 Series Assembly Instructions for proper 88HC-H clamp attachment.Accessory Selection Guide – Protection Shields (HP , HT, and HP-B)Prevent hose abrasion while extending your hose life. Parker Hose Protection Shields extend hose life by protecting the hose from abrasion that occurs when hose rubs against other hose, metal or concrete. Parker hose shields are resistant to oil, lubricants, gasoline, most solvents and can withstand ambient temperatures from -40° to +300° F . Easily installed and secured by cable ties without disconnect-ing any hose lines. Use with hose from 1/4” to 2” I.D.♦ Eliminate hose abrasion on concrete, metal or any rough surface. ♦ Guard against hose deterioration on mobile hydraulic equipment. ♦Let Parker fill all your hydraulic and pneumatic hose product needs.Hose Protector Shields are a fast and extremely cost effective way to isolate fluid lines from direct contact with other lines, components or structural members. They’re available in 4-inch, 6-inch and 8-inch lengths and the width can be trimmed to satisfy a variety of situations. These flexible protectors simply clamp around the hose and are securely held in place by nylon cable ties which are included. The cable ties are recessed in molded grooves to protect them from abrasion. You don’t need to disconnect a line to install a Parker Hose Protector Shield the way you do with a continuous tubular sleeve. Just wait until the installation is up and running to see exactly where contact needs to be prevented.Parker Hose Protector Shields are available in bulk quantities and in convenient assortments in 4”, 6” and 8” sizes. Cable ties are included with all protectors and are also available in bulk.Hose ShieldsTie Wraps HP-B-13X18-KIT2 ea. HP-13 RFL HT -12-KIT 30 ea. HT -12 Tie Wraps 2 ea. HP-15 RFL HT -16-KIT 30 ea. HT -16 Tie Wraps4 ea. HP-18 RFLHT -22-KIT15 ea. HT -22 Tie Wraps20 Hose Protectors and 60 Tie Wraps for each size are in point of purchase display box.HP-B-13-RFL 10 ea. HP-B-13 Hose Protectors (4”). 30 ea. HT -12 Tie Wraps in a sealed plastic bag.HP-B-15-RFL10 ea. HP-B-15 Hose Protectors (6”). 30 ea. HT -16 Tie Wraps in a sealed plastic bag.HP-B-18-RFL5 ea. HP-B-18 Hose Protectors (8”). 15 ea. HT -22 Tie Wraps in a sealed plastic bag.Contact your authorized Parker Hose Products Distributor for pricing and delivery information.Note: Parker Hose Protector Shield products are intended to prevent damage. They are not suitable as patches or repairs for lines which are already damaged or worn beyond safe use standards.Counter DisplayThe complete on-site complete hose assembly workstation design (above) includes:• TH7-5-C—6’ table with 1 hose reel and 1 bottom shelf • TH7-6—16 hose reel system, with rotating base • T H7-7—15” wide table set up for Parker 239 or 339 Cut-Off Saw Specifications: HoseFab Table (heavy duty)• Laminated wood table top • 1-1/2” square tubing structure • Gussetted corner braces • 6-leg design• All legs have adjustable feet • Hose reel/shelf combinations• 40B-Cabinet or 72B-Cabinet for fitting storage • Optional: Hose trough for measurement of hose • Calibrated to line up to Saw Table • Adjustable stop for standard length cuts• Built-in tape measureSpecifications: Rotary Reel Rack (TH7-6)• 16 Hose reel capacity • Compact design• Rotates for 1 man use• Center post bolts to floor in 4 places • Optional: Overhead craneSpecifications: Saw Table (TH7-7)• Calibrated to line up to Hose trough • Adjustable feet• Mounts to 6-foot benchSpecifications: 3 or 4 Reel Rack • Free standing 3 reel rack (TH7-8)• Bolts to floor• Optional: 4th reel capacity with wall mounts (TH7-8-F)• (2) 40B-Cabinet 40 openings - 4·1/2” x 4·1/2” x 12” in size • TH7-6-C—Optional overhead crane • T H7-5-HT—Optional 6’ measured hose trough with ad -justable hose stopPictured left is a complete on-site hose assembly workstation, the Parker Kart:The Parker Kart, TH7-4, is a portable all-in-one unit designed to hold a Minikrimp, Karrykrimp, Karrykrimp 2, or Parkrimp 1; a 332T -115V Cut-off Saw; 4 reels of hose; and has a 40 bin cabinet with 3 drawers for tools. The TH7-4 can be customized to fit your specific hose assembly needs. Contact Parker HPD or your Parker Hose distributor for details.Note: Part number TH7-4 does not include hose, fittings or equipment.Note: Part number and specifications of components for both workstations are listed on the following pages.HPD Hose Assembly WorkstationsHose Products Division has set up an agreement to allow Hose Products customers to purchase directly from our vendor, Safety Step.Safety Step’s contact information is:Safety Step Annette Cox 888-448-4237*********************See Safety Step contact information at the top of this pageSaw TableFeaturesThe Saw Table, specially designed for Parker 239 or 339 Hose Cut-Off Saw, attaches directly to the HoseFab Table.Part Number DescriptionTH7-715” wide table set up for Parker 239 or 339 Cut-Off Saw Table measurements:H eight - 18” Width - 28”Length - 14”3/4 Reel RackFeaturesCompact in its design, the standard version will hold 3 reels of hose. Optional 4th reel capacity designed with wall anchor mounts.P art Number DescriptionTH7-8 Upright 3 hose reel rackTH7-8-FO ptional extension with wall anchor for 4th reel Rack measurements:Height - 59” (82·1/2” with 4th reel option) Width - 27·3/4”Length - 27·1/2”HoseFab TableFeaturesHeavy duty constructed table for mounting Minikrimp, Karrykrimp, Karrykrimp 2, or Parkrimp 1. HoseFab Table is available in 3 versions to meet your require-ments. Options include two 40B-Cabinets or 72B-Cabinets for fitting storage.Part Number Description TH7-5-R 6’ table with 2 hose reels TH7-5-S 6’ table with 2 bottom shelves TH7-5-C 6’ table with 1 hose reel and 1 bottom shelf TH7-5-HT O ptional 6’ measured hose trough with adjustable hose stop 40B-Cabinet 40 openings - 4·1/2” x 4·1/2” x 12” in size 72B-Cabinet 72 openings - 4·1/2” x 4·1/2” x 12” in size Table measurements: Height - 31-3/4” Width - 29”Length - 72”Rotary Reel RackFeatures16 Hose reel capacity that fits in a compact area. Supplied with heavy duty casters which allow for ease of turning, even when fully loaded. Optional overhead crane available.Part Number DescriptionTH7-6 16 hose reel system, with rotating base TH7-6-C Optional overhead craneRack measurements:Height - 104” (120” with optional overhead crane) Width - 67”Length - 67”See Safety Step contact information on page D-26See Safety Step contact information on page D-26See Safety Step contact information on page D-26See Safety Step contact information on page D-26Parker Kart Part No. TH7-4Parker Kart organizes and stores all your necessary Parker hoses, fittings, power and hand tools - everything you need to make fast hose assemblies on site. As a valued addition to any facility, Parker Kart will save on downtime and labor costs, as well as eliminate errors in cutting and fitting attachment. With Parker Kart, you’ll always have the materials you need, right when and where you need them.• Easy one-man movement• Eight-inch urethane casters with brakes• Forklift carry tubes• Electric receptable with cord• Fitting bins and drawers• Large tool drawer• Four hose reel holders• Choice of Parker crimping equipment• Optional accessories availableParker Kart can be customized to fit specific hose assem-bly needs. Parker Kart does not include hose, fittings orequipment.Fitting Stock Bins72B-Cabinet36” wide, 43” high, 12” deep, with 72 openings each 4-1/2”x 4-1/2” x 12”, heavy duty steel, all welded construction.Product bin labels are available.Hose Stock BinsHR6-Hose-BinRugged metal cabinet for stocking coils of Parker hose 36”wide, 28” high, 20” deep, with upright separators to provide6 compartments varying in width from 4” to 8”.Provides suitable base on which to place the fittings stockbin (top measures 36” x 20”, bottom of fittings bin measures36” x 12”.)Yellow with black “Parker Hose” lettering.See Safety Step contact information on page D-26。

超米特电子有限公司产品说明书

1US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Superior elongation and tensilestrength help to prevent tearing in use due to mishandling. Typical properties for CHO-SEAL 1310 and 1273 materi-al are shown on pages 33 and 32respectively.High Shielding PerformanceCHO-SEAL 1310 material provides more than 80 dB of shielding effectiv-ness from 100 MHz to 10 GHz, while CHO-SEAL 1273 material provides more than 100 dB.Low Volume ResistivityBoth materials have exceptionally low volume resistivity, which makes them well suited for grounding appli-cations in which a flexible electrical contact is needed.Low Compression GasketSpacer gaskets are typicallydesigned to function under low deflec-tion forces. Chomerics uses design tools such as Finite Element Analysis (FEA) to accurately predict compres-sion-deflection behavior of various cross section options. Refer to page16.LCP Plastic SpacerLiquid crystal polymer (LCP)spacers, including those made with Vectra A130 material, provide aCHO-SEAL ®1310 or 1273Conductive ElastomersWith EMI spacer gaskets, shielding and grounding are provided by Chomerics’CHO-SEAL 1310 and 1273 conductive elastomers, specifi-cally formulated for custom shape molded parts. They provide excellent shielding and isolation against electro-magnetic interference (EMI), or act as a low impedance ground path between PCB traces and shielding media. Physically tough, these elas-tomers minimize the risk of gasket damage, in contrast to thin-walled extrusions or unsupported molded gaskets.Silicone-based CHO-SEAL 1310and 1273 materials offer excellent resistance to compression set over a wide temperature range, resulting in years of continuous service. CHO-SEAL 1310 material is filled with silver-plated-glass particles, while 1273 utilizes silver-plated-copper filler to provide higher levels of EMI shielding effectiveness.EMI Spacer GasketsThe unique design of Chomerics’EMI spacer gaskets features a thin plastic retainer frame onto which a conductive elastomer is molded. The elastomer can be located inside or outside the retainer frame, as well as on its top and bottom surface. EMI spacer gaskets provide a newapproach to designing EMI gaskets into handheld electronics such as dig-ital cellular phones. Board-to-board spacing is custom designed to fit broad application needs. Customized cross sections and spacer shapes allow for very low closure forcerequirements and a perfect fit in any design or device.Robotic InstallationSpacer gaskets can be installed quickly by robotic application. Integral locater pins in the plastic spacer help ensure accuratepositioning in both manual and pick-and-place assembly. Benefits include faster assembly and lower labor costs.The integrated conductive elastomer/plastic spacer gasket is a low cost,easily installed system for providing EMI shielding and grounding in small electronic enclosures.Figure 1Single Piece EMI Gasket/Locator PinsCHO-SEAL 1310 or 1273 Conductive Elastomer (Inside)Plastic Spacer Around Outsideor InsideApplications for EMI Spacer GasketsThe spacer gasket concept is especially suited to digital and dual board telephone handsets or other handheld electronic devices. It provides a low impedance path between peripheral ground traces on printed circuit boards and components such as:•the conductive coating on a plastic housing•another printed circuit board •the keypad assemblyTypical applications for EMI spacer gaskets include:•Digital cellular, handyphone and personal communications services (PCS) handsets •PCMCIA cards•Global Positioning Systems (GPS)•Radio receivers•Other handheld electronics, e.g.,personal digital assistants (PDAs)•Replacements for metal EMI shield-ing “fences” on printedcircuit boards in wireless tele-communications devicesstable platform for direct, highprecision molding of conductive elas-tomers. The Vectra A130 material described in Table 1 has excellent heat deflection temperature character-istics (489°F, 254°C). For weight con-siderations, the LCP has aspecific gravity of only 1.61. This plas-tic is also 100% recyclable.Typical EMI Spacer Gasket Design ParametersThe EMI spacer gasket concept can be considered using the design parameters shown in Table 2. Some typical spacer gasket profiles are shown below.Figure 2Typical Spacer Gasket Profiles3US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Finite Element AnalysisChomerics, a division of the Parker Hannifin Corporation’s Seal Group, is the headquarters of Parker Seal’s Elastomer Simulation Group. This unit specializes in elastomer finite element analysis (FEA) using MARC K6 series software as a foundation for FEA capability.Benefits of FEA include:•Quickly optimizing elastomer gasket designs•Allowing accurate predictions of alternate elastomer design concepts •Eliminating extensive trial and error prototype evaluationTypical use of FEA in EMI spacer gasket designs is to evaluate the force vs. deflection requirements of alternate designs.For example, onespacer design features a continuous bead of con-ductive elastomer molded onto a plastic spacer. An alternative designemploys an “interrupted bead,” where the interrup-tions (gaps left on the plastic frame) are sized to maintain the requiredlevel of EMI shielding. Figure 4illustrates these alternative designs.Gasket DeflectionFigure 5 compares the effect of continuous and interrupted elastomer gasket designs in terms of the force required to deflect the conductive elastomer. This actual cellular handset application required a spacer gasket with interrupted bead to meet desired deflection forces.Chomerics Designand Application ServicesChomerics will custom design a spacer for your application. Advice,analysis and design assistance will be provided by Chomerics Applications and Design engineers at no additional fee. Contact Chomerics directlyat the locations listed at the bottom of the page.Figure 3FEA Example of an EMISpacer Gasket Cross SectionFigure 4Continuous (top) and InterruptedElastomer GasketsFigure 5Typical Spacer Gasket Deflection。

(华为OSN)04-第4章单板

目录第4章单板.............................................................................................................................4-14.1 单板分类说明.....................................................................................................................4-14.2 单板外形.............................................................................................................................4-34.3 STM-64光接口单元SL64...................................................................................................4-44.3.1 功能.........................................................................................................................4-44.3.2 原理.........................................................................................................................4-44.3.3 面板说明..................................................................................................................4-64.3.4 单板参数配置...........................................................................................................4-84.3.5 版本说明..................................................................................................................4-84.3.6 技术参数..................................................................................................................4-84.4 STM-16光接口单元SL16/SF16.......................................................................................4-104.4.1 功能.......................................................................................................................4-104.4.2 原理.......................................................................................................................4-104.4.3 面板说明................................................................................................................4-124.4.4 单板参数配置.........................................................................................................4-144.4.5 版本说明................................................................................................................4-144.4.6 技术参数................................................................................................................4-154.5 STM-4光接口单元SL4/SLQ4/SLD4.................................................................................4-174.5.1 功能.......................................................................................................................4-174.5.2 原理.......................................................................................................................4-184.5.3 面板说明................................................................................................................4-194.5.4 单板参数配置.........................................................................................................4-214.5.5 版本说明................................................................................................................4-214.5.6 技术参数................................................................................................................4-224.6 STM-1光接口单元SLT1/SLQ1/SL1.................................................................................4-244.6.1 功能.......................................................................................................................4-244.6.2 原理.......................................................................................................................4-254.6.3 面板说明................................................................................................................4-264.6.4 单板参数配置.........................................................................................................4-284.6.5 版本说明................................................................................................................4-284.6.6 技术参数................................................................................................................4-294.7 STM-1电接口单元SLH1/SEP1/EU08/OU08 /TSB8........................................................4-304.7.1 功能.......................................................................................................................4-314.7.2 原理.......................................................................................................................4-314.7.3 面板说明................................................................................................................4-324.7.4 单板保护配置.........................................................................................................4-344.7.5 单板参数配置.........................................................................................................4-374.7.6 版本说明................................................................................................................4-374.7.7 技术参数................................................................................................................4-37 4.8 E4/STM-1电接口单元SPQ4/MU04/TSB8.......................................................................4-394.8.1 功能.......................................................................................................................4-394.8.2 原理.......................................................................................................................4-394.8.3 面板说明................................................................................................................4-414.8.4 单板保护配置.........................................................................................................4-424.8.5 单板参数配置.........................................................................................................4-454.8.6 版本说明................................................................................................................4-454.8.7 技术参数................................................................................................................4-46 4.9 E3/T3电接口单元PL3/PL3A/PD3/C34S/D34S................................................................4-474.9.1 功能.......................................................................................................................4-474.9.2 原理.......................................................................................................................4-474.9.3 面板说明................................................................................................................4-484.9.4 单板保护配置.........................................................................................................4-504.9.5 单板参数配置.........................................................................................................4-534.9.6 版本说明................................................................................................................4-534.9.7 技术参数................................................................................................................4-53 4.10 E1/T1电接口单元PQ1/PQM/D75S/D12S/D12B............................................................4-554.10.1 功能.....................................................................................................................4-554.10.2 原理.....................................................................................................................4-554.10.3 面板说明..............................................................................................................4-574.10.4 单板保护配置.......................................................................................................4-584.10.5 单板参数配置.......................................................................................................4-604.10.6 版本说明..............................................................................................................4-604.10.7 技术参数..............................................................................................................4-61 4.11 千兆以太网接口单元EGS2.............................................................................................4-624.11.1 功能.....................................................................................................................4-624.11.2 原理.....................................................................................................................4-634.11.3 面板说明..............................................................................................................4-654.11.4 单板参数配置.......................................................................................................4-664.11.5 版本说明..............................................................................................................4-674.11.6 技术参数..............................................................................................................4-67 4.12 千兆以太网接口单元EGT2.............................................................................................4-694.12.1 功能.....................................................................................................................4-694.12.2 原理.....................................................................................................................4-704.12.3 面板说明..............................................................................................................4-714.12.4 单板参数配置.......................................................................................................4-724.12.5 版本说明..............................................................................................................4-724.12.6 技术参数..............................................................................................................4-73 4.13 快速以太网处理单元EFS4/EFS0/ETF8/EFF8/ETS8......................................................4-744.13.1 功能.....................................................................................................................4-744.13.2 原理.....................................................................................................................4-764.13.3 面板说明..............................................................................................................4-774.13.4 单板保护配置.......................................................................................................4-784.13.5 单板参数配置.......................................................................................................4-804.13.6 版本说明..............................................................................................................4-814.13.7 技术参数..............................................................................................................4-82 4.14 快速以太网处理单元EFT8..............................................................................................4-834.14.1 功能.....................................................................................................................4-834.14.2 原理.....................................................................................................................4-844.14.3 面板说明..............................................................................................................4-854.14.4 单板参数配置.......................................................................................................4-874.14.5 版本说明..............................................................................................................4-874.14.6 技术参数..............................................................................................................4-87 4.15 弹性以太环网单元EMR0/EGR2.....................................................................................4-894.15.1 功能.....................................................................................................................4-894.15.2 原理.....................................................................................................................4-914.15.3 面板说明..............................................................................................................4-934.15.4 单板参数配置.......................................................................................................4-944.15.5 版本说明..............................................................................................................4-954.15.6 技术参数..............................................................................................................4-96 4.16 ATM处理单元ADL4/ADQ1.............................................................................................4-974.16.1 功能.....................................................................................................................4-974.16.2 原理.....................................................................................................................4-984.16.3 面板说明..............................................................................................................4-994.16.4 单板参数配置.....................................................................................................4-1004.16.5 版本说明............................................................................................................4-1014.16.6 技术参数............................................................................................................4-101 4.17 ATM/IMA业务处理单元IDL4/IDQ1...............................................................................4-1034.17.1 功能...................................................................................................................4-1034.17.2 原理...................................................................................................................4-1044.17.3 面板说明............................................................................................................4-1054.17.4 单板保护配置.....................................................................................................4-1064.17.5 单板参数配置.....................................................................................................4-1074.17.6 版本说明............................................................................................................4-1074.17.7 技术参数............................................................................................................4-108 4.18 SAN业务和Vedio业务单元MST4.................................................................................4-1094.18.1 功能...................................................................................................................4-1094.18.2 原理...................................................................................................................4-1104.18.3 面板说明............................................................................................................4-1114.18.4 单板参数配置.....................................................................................................4-1134.18.5 版本说明............................................................................................................4-1134.18.6 技术参数............................................................................................................4-113 4.19 波长转换单元LWX.......................................................................................................4-1144.19.1 功能...................................................................................................................4-1144.19.2 原理...................................................................................................................4-1144.19.3 面板说明............................................................................................................4-1154.19.4 版本说明............................................................................................................4-1174.19.5 技术参数............................................................................................................4-117 4.20 双路光分插复用单元MR2A/MR2C...............................................................................4-1204.20.1 功能...................................................................................................................4-1204.20.2 原理...................................................................................................................4-1214.20.3 面板说明............................................................................................................4-1214.20.4 版本说明............................................................................................................4-1234.20.5 技术参数............................................................................................................4-123 4.21 光放大单元BA2/BPA....................................................................................................4-1244.21.1 功能...................................................................................................................4-1244.21.2 应用...................................................................................................................4-1244.21.3 原理...................................................................................................................4-1254.21.4 面板说明............................................................................................................4-1264.21.5 版本说明............................................................................................................4-1274.21.6 技术参数............................................................................................................4-127 4.22 盒式光纤放大器COA....................................................................................................4-1294.22.1 功能...................................................................................................................4-1304.22.2 应用...................................................................................................................4-1304.22.3 原理...................................................................................................................4-1314.22.4 面板说明............................................................................................................4-1324.22.5 安装位置............................................................................................................4-1354.22.6 版本说明............................................................................................................4-1364.22.7 技术参数............................................................................................................4-136 4.23 色散补偿单元DCU.......................................................................................................4-1374.23.1 功能...................................................................................................................4-1374.23.2 应用...................................................................................................................4-1374.23.3 原理...................................................................................................................4-1384.23.4 面板说明............................................................................................................4-1394.23.5 版本说明............................................................................................................4-1404.23.6 技术参数............................................................................................................4-140 4.24 交叉时钟单元GXCSA/EXCSA.....................................................................................4-1414.24.1 功能...................................................................................................................4-1414.24.2 原理...................................................................................................................4-1424.24.3 面板说明............................................................................................................4-1434.24.4 单板参数配置.....................................................................................................4-1444.24.5 版本说明............................................................................................................4-1444.24.6 技术参数............................................................................................................4-144 4.25 系统控制与通信单元GSCC..........................................................................................4-1464.25.1 功能...................................................................................................................4-1464.25.2 原理...................................................................................................................4-1474.25.3 面板说明............................................................................................................4-1494.25.4 版本说明............................................................................................................4-1514.25.5 技术参数............................................................................................................4-151 4.26 辅助接口单元AUX........................................................................................................4-1524.26.1 功能...................................................................................................................4-1524.26.2 原理...................................................................................................................4-1524.26.3 面板说明............................................................................................................4-1534.26.4 版本说明............................................................................................................4-1584.26.5 技术参数............................................................................................................4-159 4.27 公务处理单元EOW.......................................................................................................4-1604.27.1 功能...................................................................................................................4-1604.27.2 原理...................................................................................................................4-1604.27.3 面板说明............................................................................................................4-1614.27.4 版本说明............................................................................................................4-1654.27.5 技术参数............................................................................................................4-165 4.28 电源接口单元PIU.........................................................................................................4-1664.28.1 功能...................................................................................................................4-1664.28.2 原理...................................................................................................................4-1664.28.3 面板说明............................................................................................................4-1674.28.4 版本说明............................................................................................................4-1674.28.5 技术参数............................................................................................................4-167 4.29 风扇单元FANA.............................................................................................................4-1694.29.1 功能...................................................................................................................4-1694.29.2 原理...................................................................................................................4-1704.29.3 面板说明............................................................................................................4-1714.29.4 版本说明............................................................................................................4-1714.29.5 技术参数............................................................................................................4-171插图目录图4-1 OptiX OSN 7500单板外形...................................................................................4-3图4-2 SL64工作原理框图..............................................................................................4-5图4-3 SL64的面板图.....................................................................................................4-6图4-4 SL16工作原理框图............................................................................................4-11图4-5 SL16/SF16的面板图..........................................................................................4-13图4-6 SL4/SLQ4/SLD4板工作原理框图.......................................................................4-18图4-7 SL4、SLD4和SLQ4的面板图...........................................................................4-20图4-8 SLT1/SLQ1/SL1工作原理框图...........................................................................4-25图4-9 SLT1/SLQ1/SL1的面板图..................................................................................4-27图4-10 SLH1/SEP工作原理框图..................................................................................4-31图4-11 SLH1/SEP1/EU08/OU08/TSB8的面板图........................................................4-33图4-12 SLH1 1:3的TPS保护原理................................................................................4-34图4-13 SLH1板1组1:3保护时工作板和保护板的配置关系........................................4-36图4-14 SPQ4工作原理框图.........................................................................................4-40图4-15 SPQ4和MU04的面板图..................................................................................4-41图4-16 SPQ4板1:3 TPS保护原理图...........................................................................4-43图4-17 SPQ4板1:3保护时工作板和保护板的配置关系...............................................4-44图4-18 PL3/PD3板的原理框图....................................................................................4-48图4-19 PL3、PL3A、PD3、C34S和D34S的面板图....................................................4-49图4-20 PD3板1:3 TPS保护的实现原理图...................................................................4-51图4-21 PL3/PD3板1:3保护时工作板和保护板的槽位配置..........................................4-52图4-22 PQ1/ PQM板的原理框图..................................................................................4-56图4-23 PQ1、PQM、D75S、D12S和D12B的面板图..................................................4-57图4-24 PQ1板1:4 TPS保护原理.................................................................................4-59图4-25 PQ1/PQM 1:4保护时工作板和保护板的配置关系............................................4-60图4-26 EGS2板原理框图.............................................................................................4-64图4-27 EGS2的面板图................................................................................................4-65图4-28 EGT2板原理框图.............................................................................................4-70图4-29 EGT2的面板图................................................................................................4-71图4-30 EFS4/EFS0板原理框图...................................................................................4-76图4-31 EFS0、 EFS4、ETF8、ETS8和EFF8的面板图.............................................4-77图4-32 EFS0板1:1 TPS保护的实现原理图.................................................................4-79图4-33 EFS0板1:1 TPS保护时工作板和保护板的槽位配置........................................4-80图4-34 EFT8板原理框图.............................................................................................4-84图4-35 EFT8的面板图.................................................................................................4-86图4-36 EMR0/EGR2板原理框图.................................................................................4-92图4-37 EMR0/EGR2的面板图.....................................................................................4-93图4-38 ADL4和ADQ1板原理框图...............................................................................4-98图4-39 ADL4和ADQ1的面板图...................................................................................4-99图4-40 IDL4和IDQ1板原理框图................................................................................4-104图4-41 IDL4和IDQ1的面板图...................................................................................4-105图4-42 MST4板原理框图...........................................................................................4-110图4-43 MST4板的面板图...........................................................................................4-112图4-44 LWX板工作原理框图......................................................................................4-115图4-45 LWX板的面板图.............................................................................................4-116图4-46 MR2A/MR2C用作OTM站点............................................................................4-120图4-47 MR2A/MR2C与LWX实现两波上下的OADM站点............................................4-120图4-48 MR2A/MR2C工作原理框图............................................................................4-121图4-49 MR2A板的面板图...........................................................................................4-122图4-50 BA、PA在光传输系统中的位置......................................................................4-125图4-51 BA2，BPA工作原理框图................................................................................4-125。

Agilent I O Hardware 数据手册说明书

82357A technical specificationsGeneral requirementsMinimum system requirements Windows 98(SE)/Me 2•PCI IEEE-488 interface for PCs•Transfer rates up to 900 KB/s•Dual processor support onWindows 2000/XPBest for•Maximum GPIB throughput forall configurationsHigh performance for manufacturingtest applicationsThe 82350B is Agilent’s highest-performance GPIB interface. Witha direct PCI computer connection,transaction overhead is minimizedfor the best overall performance.The 82350B card de-couples GPIBtransfers from PCI bus transfers.Buffering provides I/O and systemperformance that is superior to directmemory access (DMA). The hardwareis software configurable and compati-ble with the Plug-and-Play standardfor easy hardware installation. TheGPIB interface card plugs into a 5 voltPCI slot in the backplane of your PC.For programming capability youhave access with the latest versionof IO Libraries suite, version 14.1, toprogram in all standard developmentenvironments. Agilent’s IO LibrariesSuite 14.1 is easy to use and workswith virtually any vendor’s instrumentor T&M programming softwareapplication and includes automaticconfiguration for Agilent or NI VISA,NI-488.2, VISA COM or T&M ToolkitDirect IO. Even if you use NI IO soft-ware Agilent will configure automati-cally so as a user you do not have tobe concerned with the behind-the-scenes details.382350B technical specifications General requirements Minimum system requirements Windows 98(SE)/Me (note 98 supported with version 14.0 only)/2000/XP Software required Agilent IO Libraries Suite (included); see requirements on page 1PCI bus slot 5-V PCI slot, 32 bits Supported standards PCI rev 2.2IEEE 488.1 and IEEE 488.2 compatible General characteristics Power Backplane +5 V PCI Connectors Standard 24-pin GPIB (IEEE-488)+5V PCI Maximum data rate More than 900 KB/s Maximum instrument connection 14 instruments—daisy chain via GPIB Buffering Built-in Configuration Plug-and-Play EMC and safety *IEC 61326-1Group 1, Class A IEC 61010-1Warranty 1 year Dimensions Length, width, and height 122 mm (L) x 122 mm (W) x 22 mm (H) (a full-height PCI card)Weight 0.091 kg Environmental specifications Operating environment 0°C to 55°C Operating humidity Up to 90% at 40°C non-condensing Storage environment -40°C to +70°C Storage humidity Up to 90% at 65°C non-condensing * Additional detail and information in the Declaration of ConformityThis traditional GPIB connection still offers the highest throughputE5810A technical specifications 45USB port on your PC to up to fourRS-232 instruments or devices•Fully compatible with WindowsCOM driver and industry-standardVISA I/O software.Best for•Easy connection to RS-232 devices•Notebook computer RS-232connectionsAdd four serial ports in minutesThe Agilent E5805A USB/4-portRS232 interface provides a directconnection from the USB port onyour notebook or desktop PC to up tofour RS-232 instruments or devices.There are no switches to set, no PCcards to install, and no external powersupplies are required. Simply installthe driver and plug in the E5805AUSB 4-port RS232 interface to addfour RS-232 ports to your computer.Since the E5805A is a standardPlug-and-Play device, your computerautomatically detects and configuresit when it is connected to your com-puter USB port. You can interface upto four devices, with baud rates up to230 Kb/s per serial port. The E5805Aprovides four DB9 serial connectorsand ships with a 1.8-meter USB cable.E5813A technical specificationsGeneral requirements67Agilent Technologies’ Test and Measurement Support, Services, and Assistance Agilent Technologies aims to maximize the value you receive, while minimizing your risk and problems. We strive to ensure that you get the test and measurement capabilities you paid for and obtain the support you need. Our extensive support resources and services can help you choose the right Agilent products for your applications and apply them successfully. Every instru-ment and system we sell has a global warranty. Support is available for at least five years beyond the production life of the product. Two concepts underlie Agilent’s overall support policy: “Our Promise” and “Your Advantage.”Our Promise Our Promise means your Agilent test and measurement equipment will meet its advertised performance and functionality. When you are choosing new equipment,we will help you with product information, including realistic performance specifications and practical recom-mendations from experienced test engineers. When you receive your new Agilent equipment, we can help verify that it works properly, and help with initial product operation.Your AdvantageYour Advantage means that Agilent offers a wide range of additional expert test and measurement services, which you can purchase according to your unique technical and business needs. Solve problems efficiently and gain a competitive edge by contracting with us for calibration, extra-cost upgrades, out-of-warranty repairs, and onsite education and training, as well as design, system integration, project management, and other professional engineering services. Experienced Agilent engineers and techni-cians worldwide can help you maximize your productivity,optimize the return on investment of your Agilent instruments and systems, and obtain dependable measurement accuracy for the life of those products./find/emailupdates Get the latest information on the products and applications you /find/openAgilent Open simplifies the process of connecting and programming test systems to help engineers design,validate and manufacture electronic products. Agilentoffers open connectivity for a broad range of system-ready instruments, open industry software, PC-stan-dard I/O and global support, which are combined to more easily integrate test system development. For more assistance with your test & measurement needs or to find your local Agilent office go to /find/contactus Microsoft, Windows and Visual Studio are U.S. registered trademarks of Microsoft Corporation.Pentium is a U.S. registered trademark of Intel Corporation.Product specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2005Printed in USA, August 5, 20055989-1889EN Agilent Open Agilent Email Updates •Agilent E2094N IO Libraries Suite, Data sheet pub no. 5989-1439EN •Modern Connectivity–Using USB and LAN I/O Converters, Application note 1475-1pub no. 5989-0123EN •Simplified PC Connections for GPIB Instruments,Application note 1409-1, pub no. 5988-5897EN •Using LAN in Test Systems: The Basics,Application note 1465-9, pub no. 5989-1412ENpub no. 5989-1417EN •Computer I/O Considerations, Application note 1465-2, pub no. 5988-9818EN Learn more at /find/io-ds Join the Agilent Developer Network to get updated I/O software, instrument drivers, code examples,white papers, and more! Registration is easy and free at /find/adn.。

GridVis-Basic 电力分析仪产品说明书

1Network visualisation software• GridVis ®-Basic (in the scope of supply)3 digital inputs/outputs•Usable as either inputs or outputs•Switch output•Threshold value output •Logic output•Remote via Modbus / ProfibusT emperature measurement •PT100, PT1000, KTY83, KTY84Interfaces •RS485•Ethernet•SNTP •TFTP•BACnet (optional)Networks• T N, T T , IT networks•3 and 4-phase networks•Up to 4 single-phase networksMeasured data memory •256 MB Flash• H armonics up to 40th harmonic •Rotary field components•Distortion factor T HD-U / T HD-I2 analogue inputs • A nalogue, temperature or residual current input (RCM)Residual current measurement BACnet (optional)HomepageAlarm managementMemory 256 MB Ethernet-Modbus gateway2• M easurement, monitoring and checking of electrical characteristics in energy distribution systems • R ecording of load profiles in energy management systems (e.g. ISO 50001)• Acquisition of the energy consumption for cost centre analysis • M easured value transducer for building management systems or PLC (Modbus)• M onitoring of power quality characteristics, e.g. harmonics up to 40th harmonic • R esidual current monitoring (RCM)Areas of applicationMain featuresUniversal meter• O perating current monitoring for general electrical parameters • H igh transparency through a multi-stage and scalable measurement system in the field of energy measurement • A cquisition of events through continuous measurement with 200 ms high resolutionRCM device• C ontinuous monitoring of residual currents (Residual Current Monitor, RCM)• A larming in case a preset threshold fault current reached • N ear-realtime reactions for triggering countermeasures • P ermanent RCM measurement for systems in permanent operation without the opportunity to switch offEnergy measurement device•Continuous acquisition of the energy data and load profiles • E ssential both in relation to energy efficiency and for the safe design of power distribution systemsHarmonics analyser / event recorder• Analysis of individual harmonics for current and voltage •Prevention of production downtimes•Significantly longer service life for equipment • R apid identification and analysis of power quality fluctuations by means of user-friendly tools (GridVis ®)Fig.: UMG 96RM-E with residual current monitoring via measuring inputs I5 / I6Fig.: Event logger: Voltage dip in the low voltage distribution system3Extensive selection of tariffs• 7 tariffs each for effective energy (consumption, delivery and without backstop)• 7 tariffs each for reactive energy (inductive, capacitive and without backstop)•7 tariffs for apparent energy •L1, L2 and L3, for each phaseHighest possible degree of reliability•Continuous leakage current measurement • H istorical data: Long-term monitoring of the residual current allows changes to be identified in good time, e.g. insulation faults•Time characteristics: Recognition of time relationships •Prevention of neutral conductor carryover • R CM threshold values can be optimized for each individual case: Fixed, dynamic and stepped RCM threshold value • M onitoring of the CGP (central ground point) and the sub-distribution panelsAnalysis of fault current events• E vent list with time stamp and values•Presentation of fault currents with characteristic and duration • R eproduction of phase currents during the fault current surge • P resentation of the phase voltages during the fault current surgeAnalysis of the harmonic fault current components•Frequencies of the fault currents (fault type)•Current peaks of the individual frequency components in A and %•Harmonics analysis up to 40th harmonic •Maximum values with real-time bar displayDigital IOs• E xtensive configuration of IOs for intelligent integration, alarmand control tasksFig.: Continuous leakage current measurementFig.: Analysis of fault current eventsFig.: Analysis of the harmonic fault current components4Dimension diagramsAll dimensions in mmSide viewRear viewEthernet (TCP/IP)- / Homepage- / Ethernet-Modbus gateway functionality•Simple integration into the network •More rapid and reliable data transfer •Modern homepage • W orld-wide access to measured values by means of standard web browsers via the device's inbuilt homepage • Access to measurement data via various channels • R eliable saving of measurement data possible over a very long periods of time in the 256 MByte measurement data memory • C onnection of Modbus slave devices via Ethernet-ModbusgatewayFig.: Ethernet-Modbus gateway functionalityMeasuring device homepage• W ebserver on the measuring device, i.e. device's own homepage •Remote operation of the device display via the homepage •Comprehensive measurement data incl. PQ • O nline data directly available via the homepage, historic data optional via the APP measured value monitor, 51.00.246Fig.: Illustration of the online data via the device's inbuilt homepageCut out: 92+0,8 x 92+0,8 mm5Typical connectionDevice overview and technical dataFig.: Connection example residual currentmeasurement and PE monitoringFig.: Connection example with temperature and residual current measurementS2S1S2S2S1S1Digital-Eingänge/Ausgänge UMG 96RM-E (RCM)L1L2L3Spannungsmessung 3456StrommessungVersorgungs-spannung12RS4851617BAB AV e r b r a u c h e r230V/400V 50HzI 41918N282930313233343536Analog-Eingänge13141524V DC K1K2=E t h e r n e t10/100B a s e -TPCK3K4K5==37R J 450-30 mAS2S1I DIFFI 5I 6PT100S1S2S3Gruppe 1Gruppe 2V 1V 2V 3V N N/-L/+2)1)2)2)3)3)3)3)Digital inputs/outputs Power supply voltage Current measurement Measuring voltage Analog inputs L o d s Group 1Group 2Comment:For detailed technical information please refer to the operation manual and the Modbus address list.•= included - = not included *1 Inclusive UL certification.6Fig.: GridVis ®software, configuration menuComment:For detailed technical information please refer to the operation manual and the Modbus address list.• = included - = not included*2 O ptional additional functions with the packages GridVis ®-Professional, GridVis ®-Service and GridVis ®-Ultimate.7Fig.: RCM configuration, e.g. dynamicthreshold value formation, for load-dependent threshold value adaptationFig.: Summation current transformer for the acquisition of residual currents. Wide range with different configurations and sizes allow use in almost all applicationsMeasurement surge voltage Power consumption Overload for 1 sec.Sampling frequency per channel (50 / 60 Hz)Residual current inputAnalogue inputsMeasurement range, residual current input*Digital outputsSwitching voltage Switching current Response timePulse output (energy pulse)Comment:For detailed technical information please refer to the operation manual and the Modbus address list.•= included - = not included*3 E xample of residual current input 30 mA with 600/1 residual current transformer: 600 x 30 mA = 18,000 mA *4A ccurate device dimensions can be found in the operation manual.8Comment:For detailed technical information please refer to the operation manual and the Modbus address list.• = included - = not included。

德国icHaus产品选型

德国i c H a u s产品选型集团企业公司编码：（LL3698-KKI1269-TM2483-LUI12689-ITT289-德国icHaus是生产特殊应用集成电路芯片（ASSP），特定应用集成电路（ASIC），是一个单片的混合信号和微处理芯片的领先专家，有25年历史。

icHaus秉承创新、可靠技术和着名的集成电路及微软系统的FMEA（失效模式与影响分析），在工业、医疗和汽车方面得到广泛应用创意电子正式代理德国iChaus磁传感器、光编码器、插补细分器、激光二极管驱动ic。

光编码器IC：iC-LG 21位光学位置编码器带串行/并行和Sin/Cos输出iC-LGC 21位光学位置编码器带串行/并行和Sin/Cos输出iC-LNB 18位光学位置编码器带SPI,串行/并行和FlexCount输出IC-LNG 16位光学位置编码器带SPI和串行/并行输出iC-LSB 8通道主动光敏器件阵列iC-LSC 12通道主动光敏器件阵列iC-LSHB 增量式光敏器件阵列iC-LSHC 3通道Sin/Cos光敏器件阵列IC-LTA 6通道增量光学编码器iC-LV 6光编码器带级联串行接口（SSI）iC-OF 3位光学编码器iC-OG 8位差分扫描光编码器带LED控制iC-OV 5位光编码器iC-OW 增量式光编码器带A/B门索引和LED控制iC-PD3948 5通道相控阵列正弦编码器（D39,2048PPR）iC-PN26xx相控阵列游标编码器（D26：256,512，1024PPR)iC-PN33xx相控阵列游标光编码器（D33：256，512，1024PPR)iC-PN39xx 相控阵列游标光编码器（D39：1024PPR）iC-PNH3348 相控阵列游标光编码器（D33：2048PPR）iC-PT26xx 相控阵列光编码器（D26：256,500,1000，1250PPR）iC-PT33xx 相控阵列光编码器（D33：1000，1024，1250,2000,2500PPR）iC-WG14位差分扫描光编码器（D33,1250PPR）磁编码器IC：iC-MA8位角度霍尔编码器，可级联iC-MH/812位角度霍尔编码器带换向，增量，串行和模拟输出iC-MHA角度霍尔编码器带Sin/Cos输出iC-ML8位线性位置霍尔编码器，可级联iC-MP8位霍尔编码器带比率计输出iC-MU磁偏轴绝对位置编码器激光二极管驱动ICiC-HB3只155MHz激光开关带LVDS输入iC-HG200MHz激光开关高达3AiC-HK,iC-HKB155MHz双通道尖峰释放激光开关iC-HL适用于APCs的非易失性激光偏置电位计iC-NZ失效安全激光二极管驱动器CW和脉冲工作高达155MHziC-NZNN型激光二极管驱动器带APC和ACCiC-NZPP型激光二极管驱动器带APC和ACCiC-VJ，iC-VJZ激光二极管控制器带发射功能iC-WJ,iC-WJZ激光二极管驱动器CW和脉冲工作高达300MHziC-WJB适应于电池供电的2.7到6V激光二极管驱动器iC-WK,iC-WKL低功耗通用激光驱动CW工作2.4V以上iC-WKMM型CW激光二极管驱动器，为蓝光M型激光二极管优化iC-WKNN型CW激光二极管驱动器，为N型激光二极管优化iC-WKPP型CW激光二极管驱动器，P型激光二极管优化插补细分器iC-MG8位Sin/Cos插补器带RS422线驱动iC-MN可编程9位Sin/Cos插补器带失效安全RS422线驱动iC-MQ3通道，同时采样13位Sin/Cos插补器带游标计算iC-NG8位正弦到数字转换器处理器带波形适配iC-NQ13位信号调理插补器带BiSSB接口IC-NQI13位信号调理插补器带2-Wire接口iC-NQC13位信号调理插补器带BiSSC接口iC-NQL13位信号调理插补器带SSI接口iC-NV6位Sin/Cos快速转换器带管脚选择插补器（×16），iC-NVH6位Sin/Cos快速转换器带管脚选择插补器（×16），半周期索引iC-TW2可编程8位Sin/Cos择插补器带EEPROMiC-TW48位Sin/Cos择插补器带自动偏置矫正iC-TW816位Sin/Cos择插补器带自动矫正24V线性驱动器iC-DL3通道差分线驱动器带集成阻抗匹配iC-HD24差分线驱动器，管脚兼容xx2068iC-HD74差分线驱动器，管脚兼容xx7272和26LS31iC-HE3通道差分线驱动器iC-HX3通道差分线驱动器带减少电源消耗iC-VX3通道差分线驱动器带兼容24V输出iC-WE3通道75Ohm线驱动器适用于RS422和24V应用ET7272双差分线驱动带单独的逻辑偏置和驱动偏置传感器ICiC-LA64*1线性图像传感器带双向位移和扩展的I/OiC-LF1401128*1线性图像传感器带电子快门功能iC-LFL1402256*1连续光谱线性图像传感器带电子快门功能iC-LFM64*1线图像传感器带电子快门功能iC-LFS32*1线性图像传感器带电子快门功能IC-LO智能三角测量传感器iC-LQNP脉冲和交流光传感器带补偿输出iC-OC双集成光学传感器带移动寄存器给链式连接iC-OD光学位置敏感检测器（2.6mmPSD）带环境光抑制iC-ODL光学位置敏感检测器（8.4mmPSD）带环境光抑制iC-OR5单元光学二极管阵列iC-VP可调节敏感度的光电开关磁性产品iC-MZ差分霍尔开关和齿轮齿牙传感器带线驱动器iC-SM2LAMR线性位置传感器（间隙：2mm）iC-SM5LAMR线性位置传感器（间隙：5mm）信号调理和监控iC-MSBSin/Cos传感器信号调理器带安全失效1Vpp线驱动iC-MSB2Sin/Cos传感器信号调理器/多路器带安全失效1Vpp线驱动iC-RC1000正弦/余弦信号安全监控ICiC-TW3自动信号调理器带LUT温度补偿和1Vpp（100Ohm）/2Vpp输出iC-WT3通道光电二极管放大器-比较强带LED控制器输出级iCsiC-DN4V到36V200mA低边开关带输入/输出退耦iC-DP4V到36V200mA高边开关带输入/输出退耦iC-DX通用数字传感器输出驱动iC-DXC数字传感器输出驱动器（200mA）带IO-LINK反馈回路iC-MFL8倍失效-安全逻辑N-FET驱动器iC-MFLT12倍失效-安全逻辑N-FET驱动器iC-MFN8倍失效-安全N-FET驱动器带电平转换高达40ViC-MFP8倍失效-安全P-FET驱动器带电平转换高达40VLEDsiC-SD85850nm红外LED带平面玻璃适用于高分辨光编码器iC-SG85850nm红外LED带塑料镜头适用于高质量大面积流明高分别率光编码器iC-SN85850nm红外LED带塑料镜头适用于高质量大面积照明iC-TL85850nm红外LED带镜头或者平面窗适用于高分辨光编码器继电器/螺线管驱动器iC-GE宽工作电压范围PWM继电器/螺线管驱动器(1A)IC-GE100PWM继电器/螺线管驱动器（100mA）iC-JES低功耗继电器/螺线管驱动器安全光幕iCs发射器适用于机器安全保护系统（IEC61496-1，ESPE）,测量光幕iC-NL光栅脉冲驱动器带调制输入iC-NT光幕光栅脉冲驱动器，光电池和电子敏感保护设备iC-NX8通道光栅脉冲驱动器带调制输入C-NXL8通道光栅脉冲驱动器接收器适用于机器安全保护系统（IEC61496-1，ESPE）,测量光幕iC-LK光栅脉冲接收器集成光敏二极管iC-ME2通道光栅脉冲接收器iC-MK2通道光栅脉冲接收器iC-NE光幕光栅脉冲接收器光电池和电子敏感保护装置iC-NK光栅脉冲接收器I/O接口iCsiC-DI双传感器接口3.3V/5V电源供电iC-GFIO-Link从机IO-Llink传输器iC-JRX2*4双向24V高边驱动器带uC接口iC-JX4*4双向24V高边驱动器带负责诊断和uC接口iC-MDRS422正交编码器接收器/计数器带SPI和BiSS接口iC-TW916位ABZ正交计数器iC-VRV2*424V低边驱动器带I/O功能和uC接口接口iCs.BISSiC-MB3BiSS接口主机，1通道/3从机电源管理iCsiC-DC可编程的双2.5/3.3VBuck/Boost开关电源iC-JJ电源管理IC带经济功能iC-WD8V到36V开关模式双5V调整器iC-WDA8V到36V开关模式双3.3V调整器iC-WDB8V到36V开关模式3.3V(200mA)和5V调整器iC-WDC8V到36V开关模式3.3V和5V(200mA)调整器线性功能iC-BM4重4象限模拟乘法器iC-HC双超快ATE信号比较器高达36ViC-HQ4高性能运算放大器带超低偏置（小于1uV）iC-HQL4高性能运算放大器带超低偏置（小于10uV）。

兼容所有高清视频格式

(规格尺寸)
90 mm
117 mm 44.5 mm
13.2 mm
160 mm
12 mm
DC+12 V
信号灯
光圈控制
变焦/聚焦控制D型15针微型接口变焦聚焦接口91 8 10 2
7 12 11 3 654
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12
Signal Focus control selection Zoom control selection GND Forcible iris closing Iris control +Voltage COM Focus control Zoom control Iris control selection COM +Voltage COM -Voltage
1080: 60i/59.94i/50i/30psF/29.97psF/25psF/24psF/23.98psF 720: 60p/59.94p/50p F10.0 (2 000 lx, 3 200 K,白光反射率 89.9%) 0.015 lx (F1.4 / 68 dB) 72 dB 54 dB 小于 -130 dB 45 % (27.5 MHz, 720 p / 60 p) 内/外同步 (三电平 SYNC/Black Burst) 同步锁相: BNC x 1,接口:D型15针微型接口 HD-SDI : BNC x 1 镜头端子、镜头变焦/聚焦端子 0 ˚C 至 + 40 ˚C -20 ˚C 至 + 60 ˚C DC 12 V 大约 17 W 大约 90 mm x 117 mm x 160 mm 大约 1.5 kg
当伽玛曲线是基于图像的亮部区域当基于暗部区域调整时，图像较亮

HD6409中文资料

clock (DCLK). SDO is forced low when RST is low.
6
O
SRST Serial Reset
In the converter mode, SRST follows RST. In the repeater mode, when RST goes low, SRST goes low and remains low after RST goes high. SRST goes high only when RST is high, the reset bit is zero, and a valid synchronization sequence is received.
元器件交易网
HD-6409
March 1997
CMOS Manchester Encoder-Decoder
Features
• Converter or Repeater Mode • Independent Manchester Encoder and Decoder
Operation • Static to One Megabit/sec Data Rate Guaranteed • Low Bit Error Rate • Digital PLL Clock Recovery • On Chip Oscillator • Low Operating Power: 50mW Typical at +5V • Available in 20 Lead Dual-In-Line and 20 Pad LCC
CO IX OX
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

HiISP 开发参考

文档版本 00B08(2013-04-02)
第 3 章 AE 3.5.1AE 的数据类型中 ISP_AE_MODE_E、ISP_AE_ATTR_S 的【注意】有更新。第 6 章 IMP 6.9 去雾功能描述有更新，数据类型 ISP_ANTIFOG_S 增加说明及成员。
文档版本 00B07(2013-02-28)
表示有潜在风险，如果忽视这些文本，可能导致设备损坏、数据丢失、设备性能降低或不可预知的结果。
表示能帮助您解决某个问题或节省您的时间。表示是正文的附加信息，是对正文的强调和补充。
修订记录
修订记录累积了每次文档更新的说明。最新版本的文档包含以前所有文档版本的更新内容。
文档版本 03 (2014-02-26)
文档版本 02(2013-09-25)
第 3 章 AE ISP_AE_ATTR_EX_S 的【参数】u32SystemGainMax 的描述更新。 ISP_EXP_STA_INFO_S 新增【参数】u8ExpHistTarget[5]及描述；新增【注意事项】。 ISP_INNER_STATE_INFO_S 的【注意事项】中删除关于高精度 Sensor 模拟增益、数字增益和高精度 ISP 数字增益的相关描述。第 4 章 AWB ISP_WB_STA_INFO_S 新增【参数】u32Rgain、u32Ggain、u32Bgain 及描述。第 8 章 AF ISP_FOCUS_STA_INFO_S 新增【参数】u8MetricsShift、u8NpOffset 及描述。第 10 章 Proc 调试信息新增。
6.2.2 API 参考，HI_MPI_ISP_GetGammaTable 的【注意】中的描述修改为“无”。
6.3.3 数据类型，ISP_DRC_ATTR_S 的【定义】和【成员】中新增 u32VarianceSpace 和 u32VarianceIntensity；并修改部分成员的描述。

HLU-HD四线制用户手册2013要点

四线制超声波物位计用户手册MANUAL珠海欧美莱仪表设备有限公司目录概述 (1)用途 (1)应用场合 (1)特点 (1)量程 (1)组成结构 (2)技术原理 (3)技术规格 (4)物位计外形尺寸 (5)电子单元的面板布置 (7)仪表接线图 (7)仪表操作 (8)显示方式 (8)按键 (8)工作状态与参数设置 (8)开机及复位 (11)继电器工作 (11)仪表测试 (12)仪表安装 (12)安装要求 (13)接线方法 (14)通电工作 (14)仪表密封 (15)故障处理 (16)概述用途：液位或料位的测量。

液位和料位统称为物位。

应用场合：能够保证超声波有效传播到被测液面或料面的场合。

如：储罐、料槽、池子、水井、水渠、计量箱、粮仓、料仓等。

特点：·一体化设计，安装方便·四线制接线，声波发射强劲，测量稳定可靠·带有LCD的大显示窗，便于调试和观察·提供DC4-20mA输出或高低位继电器输出及0-10V电压输出·过压过流保护，雷电保护·先进的自夹紧式接线端子，保证接线永不松动·智能信号处理技术，保证仪表适应各种工况·全塑料探头，耐酸碱，适应恶劣环境量程：仪表具有如下量程规格：液位：4m、6m、8m、12m、15m、20m、30m、40m料位：3m、5m、7m、10m、15m、20m注：1. 以上量程仅限液位测量，料位测量有效量程为上述数据的50%左右。

2. 寒冷地区室外安装应用时，应防止探头表面结霜或结冰。

可选择探头加长型的物位计，使探头伸入容器内部，选型时在上述型号后加字母L。

1组成结构4m 、6m 、8m 型物位计 12m 型物位计15m 、20m 、30m 、40m 型物位计2技术原理物位计由设计于一体的超声波探头和电子单元构成。

物位计安装于容器上部，在电子单元的控制下，超声波探头向被测物体发射一束超声波脉冲。

声波被物体表面反射，部分反射回波由探头接收并转换为电信号。

HBAT54中文资料

Page No. : 1/3 Array HBAT54\A\C\SDescriptionSilicon Schottky Barrier Double DiodesFeaturesThese diodes feature very low turn-on voltage and fast switching.There is a PN junction guard ring against excessive voltage such aselectronics attic discharges protects these devices.Absolute Maximum Ratings• Maximum TemperaturesStorage Temperature.............................................................................................. -65~+125 °C Junction Temperature.................................................................................................... +125 °C • Maximum Power DissipationTotal Power Dissipation (Ta=25°C)................................................................................ 230 mW • Maximum Voltages and Currents (Ta=25°C)Repetitive Peak Reverse Voltage........................................................................................ 30 V Forward Continuous Current.......................................................................................... 200 mA Repetitive Peak Forward Current .................................................................................. 300 mA Surge Forward Current (tp<1s)....................................................................................... 600 mA Characteristics (Ta=25°C)Characteristic Symbol Condition Min.Max.Unit Reverse breakdown Voltage V(BR)R IR=10uA30-VVF(1)IF=0.1mA-240mVVF(2)IF=1mA-320mV Forward VoltageVF(3)IF=10mA-400mVVF(4)IF=30mA-500mVVF(5)IF=100mA-1000mVReverse Current IR VR=25V- 2.0uATotal Capacitance CT VR=1V, f=1MHz-10pF Reverse Recovery Time Trr IF=IR=10mA RL=100Ω-5nSmeasured at IR=1mAPage No. : 2/3Characteristics CurvePage No. : 3/3SOT-23 Dimension• HBAT54: Single Diode , also available as double diodes. (Marking Code L4)• HBAT54A: Common Anode. (Marking Code L42)• HBAT54C: Common Cathode. (Marking Code L43)• HBAT54S: Series Connected. (Marking Code L44)*: TypicalInches MillimetersInches MillimetersDIM Min.Max.Min.Max.DIM Min.Max.Min.Max.A 0.11020.1204 2.80 3.04J0.00340.00700.0850.177B 0.04720.0630 1.20 1.60K 0.01280.02660.320.67C 0.03350.05120.89 1.30L 0.03350.04530.85 1.15D 0.01180.01970.300.50S 0.08300.1083 2.10 2.75G 0.06690.0910 1.70 2.30V0.00980.02560.250.65H0.00050.00400.0130.10Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.2.Controlling dimension: millimeters.3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.Material:• Lead: 42 Alloy; solder plating• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0Important Notice:• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.• HSMC reserves the right to make changes to its products without notice.• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.Head Office And Factory:• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931。

焊材采购书(中英文 )081210

供应商的名字和商标。
C. Size and net weight尺寸和净重
D.Lot, or heat numbers批号或熔炉号
4. Package包装
The Flux and Electrode shall be suitably packaged to ensure against
damage during shipment and storage under normal conditions
and mechanical test result shall meet Table 2 and Table 3 requirements.
试验和检验要满足SFA-5.1M-2007Ed的要求。化学和机械性能试验结果要满足表格2和表格3的要求。
Table 2 Weld metal chemical composition
Table 1
A) Quantity（数量）50kg100kg
B) Specification（标准）SFA-5.1MSFA-5.1M
C) Brand（铭牌）E4916E4916
(E7016) (E7016)
D) Type（种类）Low- Low-
hydrogenhydrogen
E) Diameter（直径）3.2mm4.0mm
Table 1
Electrode（焊丝）Flux（焊剂）
A. Quantity（数量）100kg150kg
B. Specification（标准）SFA-5.17MSFA-5.17M
C. Brand（铭牌）EH14 F48A3-EH14(F7A2-EH14)
D. Diameter and size（直径及尺寸）Φ4 mm
在每包焊丝和焊剂的包装外面必须明确的标有以下信息：

敞开式直线光栅尺持续稳定的测量值和详细的精度数据

技术信息
敞开式直线光栅尺：持续稳定的测量值和详细的精度数据
敞开式直线光栅尺广泛用于测量值精度要求极高的应用中。例如半导体行业的生产和测量设备、PCB电路板组装机以及测量机。为确保直线光栅尺在整个生命周期中保持持续的高精度，海德汉开发了信号处理ASIC HSP 1.0，将它应用于增量式位置测量的敞开式直线光栅尺。这款ASIC芯片几乎能完全补偿干扰造成的信号幅值波动。也就是说能显著提高信号稳定性，有效抵消测量基准或扫描掩膜污染的影响。以此保证持续稳定的测量信号几乎不受细分精度或更大噪音因素的影响。对于敞开式直线光栅尺，海德汉开始引入全新的精度数据。这些数据让设计工程师在为应用选用适当光栅尺时拥有更详细的信息。除精度外，还能拥有以下数据： •• 短间隔宽度上的光栅精度 •• 细分精度 •• 位置信号噪声
高可靠性的高质量测量信号海德汉HSP 1.0信号处理ASIC芯片持续监测扫描信号。如果测量基准或扫描掩膜被污染将导致信号变化，HSP 1.0几乎能完全补偿这种变化。
这款智能化的ASIC芯片用于确保扫描信号持续保持高质量和长期稳定。在正常工作条件下，细分误差和位置信号噪音将不因污染而增大。
持续稳定的信号因此，配HSP 1.0信号处理ASIC芯片的敞开式光栅尺在位置测量中的整个测量范围上提供极稳定的信号—无论行程中是否存在被污染的部位。信号幅值几乎始终保持在1 VPP不变（图3）。即使污染不断加重，污染情况极为恶化而超出ASIC的控制范围时，也不会导致信号的突然失效。相反，信号幅值只是缓慢衰减。
图3：污染的测量基准与相应的信号幅值，传统扫描方式与用HSP 1.0信号处理ASIC芯片扫描方式的比较
3
详细的精度数据准确的信息促进更好地选型
海德汉现在提供更详细的敞开式直线光栅尺精度数据。以前，各光栅尺的具体误差比较笼统地用精度等级和单信号周期内位置误差表示。未来，用户将能看到以下更详细的信息： •• 测量基准的精度 •• 细分精度 •• 位置信号噪声

大华产品的介绍___存储产品线提供

HDMI1
HDMI2
SPOT OUT
DVR技术亮点—预览降噪
通过预览降噪，使画面干净清晰
友商效果
大华效果
DVR技术亮点—区域动检独立触发
针对不同场景，区域动检独立触发，提高动检准确度，减少误报率
二楼入口：灵敏度60
大厅：灵敏度30
二楼出口：灵敏度70
工作区域：灵敏度20
DVR重点产品—混合960H
HCVR5104HS-V3 HCVR5108HS-V3 HCVR5108HE-V3
HCVR5216AN-V3
HCVR5216A-V3
HCVR5400L-V2 HCVR5424L HCVR5432L
HCVR5800S-V2 HCVR5824S HCVR5832S
960H
HCVR4216AN-V3
HCVR4104HS-V3 HCVR4108HS-V3 HCVR4108HE-V3 HCVR4116HS-V3
标清模拟
高清变标清后端自适应
HDCVI
标清变高清后端自适应
IPC
1080P/720P自适应
渠道产品特点 | 模数转换
IPC IPC
HDCVI 模拟摄像机模拟摄像机
……
… …
渠道产品特点 | P2P（私网穿透）
手机应用：随时随地查看，想看就看轻松管理：一个帐号轻松管理多个设备及时报警通知：报警信息及时推送,让您更放心
大华全系列产品-存储
大华全系列产品
存储产品线介绍
存储产品线分类
DVR
HCVR
NVR
网络存储
云存储
DVR—渠道产品族谱
960H
51系列
54系列

FOXBORO I A Series HARDWARE产品规格说明书

FOXBORO ®The FBM214 HART ® Communication Input Interface Module provides eight input channels, each accepting a 4 to 20mA analog signal or a digital HART signal superimposed on a 4 to 20 mA analog input signal.FEATURESKey features of the FBM214 module are:Eight analog input channels, each accepting oneof the following inputs:•Standard 4 to 20 mA analog sensor signal •Digital HART Frequency Shift Keying (FSK) signal superimposed on a 4 to 20 mA analog input signal.FSK modem dedicated to each input channel forbi-directional digital communications with a HART field deviceAnalog to digital conversion of each of the 4to20mA input signals from the HART devicesSupport for the HART universal commandsnecessary to interface the field device with the I/A Series ® system databaseGalvanic isolation of the group of 8 inputchannels from ground and module logicCompact, rugged design suitable for enclosure inClass G3 (harsh) environmentsHigh accuracy achieved by sigma-delta dataconversions for each channelTermination Assemblies (TAs) for locally orremotely connecting field wiring to the FBM214Termination Assemblies for per channel internallyand/or externally loop powered transmitters.PSS 21H-2Z14 B4 Page 2OVERVIEWThe FBM214 HART Communication Input Interface Module contains eight 4to20mA group isolated analog input channels. The FBM214 supports any mix of standard 4to20mA devices and HART devices.The FBM214 serves as a HART communications field device host, enabling the I/A Series system to request and receive two digital messages per second from the field device. The message pass-through capability can be used to support HART universal, common practice, and device-specific commands, but not the burst communication mode. These commands are implemented using the Intelligent Field Device Configurator (IFDC — refer toPSS 21S-8A3 B3 for details).The FBM214 provides a common isolated power supply to power all eight channels. Optionally, the channels can be powered by an external power supply. However, when a common external power supply is used with two or more channels, a Cable Balun module is required to prevent channel cross talk.COMPACT DESIGNThe FBM214 has a compact design, with a rugged extruded aluminum exterior for physical protection of the circuits. Enclosures specially designed for mounting the FBMs provide various levels of environmental protection, up to harsh environments per ISA Standard S71.04.HIGH ACCURACYFor high accuracy, the module incorporates a Sigma-Delta converter which can provide new analog input values for each channel every 100 milliseconds.VISUAL INDICATORSLight-emitting diodes (LEDs) incorporated into the front of the module provide visual indication of the module’s operational status, and communication activity on the channels.EASY REMOVAL/REPLACEMENTThe module can be removed/replaced without removing field device termination cabling, power, or communications cabling.FIELDBUS COMMUNICATIONA Fieldbus Communication Module or a Control Processor interfaces the redundant 2 Mbps module Fieldbus used by the FBMs. The FBM214 module accepts communication from either path (A or B) of the redundant 2 Mbps fieldbus – should one path fail or be switched at the system level, the module continues communication over the active path.The use of an external power supply common to two or more loops requires a Cable Balun Module to maintain communication signal line balance.MODULAR BASEPLATE MOUNTINGThe module mounts on a modular baseplate which accommodates up to four or eight FBMs. The modular baseplate is either DIN rail mounted or rack mounted, and includes signal connectors for redundant fieldbus, redundant independent dc power, and termination cables.TERMINATION ASSEMBLIESField input signals connect to the FBM subsystem via DIN rail mounted TAs. The TAs used with theFBM214 are described in “TERMINATION ASSEMBLIES AND CABLES” on page8.PSS 21H-2Z14 B4Page 3CABLE BALUN MODULEThe Cable Balun module is used to maintain digital communication line balance for HART Transmitter to FBM loops that are powered from a common external power supply. This powering effectively connects one line of each loop together. Without the Baluns, in each loop so powered, the common connection at the external power supply, would cause near end crosstalk at the system end of the loop wiring cable. Loops using FBM internal power source do not require Baluns.The Cable Balun module contains multiple Baluns. One Balun segment is interconnected in each loop powered from an external power supply per the diagram above. There is one Cable Balun module.Figure 1. Cable Balun Module Cable Balun ModuleModule Model ModulePart No.No. of Balunsin the ModuleCBM-4P0903SV4PSS 21H-2Z14 B4Page 4FUNCTIONAL SPECIFICATIONSField Device ChannelsVERSION SUPPORTEDHART Protocol v6INTERFACE8 group-isolated channelsCOMMUNICATION TO THE DEVICEPoint-to-point, master/slave, asynchronous, half-duplex, at 1200 baud.ERROR CHECKINGParity on each byte, and one CRC check byte.SPEED2 messages per secondFASTEST ALLOWED ECB BLOCK PERIOD500 msecMAXIMUM DISTANCE (FBM214 TO FIELDDEVICE)Meets HART FSK physical layer specificationHCF_SPEC-54, Revision 8.1 [up to 3030 m(10000ft)](1).COMPLIANCE VOLTAGE18 V dc minimum at 20.5 mACURRENT INPUTSSense Resistor61.9 Ω nominalTotal Input Resistance280 Ω minimumAccuracy (Includes Nonlinearity)±0.03% of full scaleTemperature Coefficient50 ppm/ºCResolution15 bitsUpdate Rate100 msIntegration Time500 msCommon Mode Rejection>100 db at 50 or 60 HzNormal Mode Rejection>35 db at 50 or 60 HzMAXIMUM LOOP RESISTANCE280 Ω (not including the field device)(2)LOOP POWER SUPPLY PROTECTIONEach channel is galvanically group isolated,current limited and voltage regulated. All inputsare limited by their design to less than 30 mA. Ifthe current limit circuit shorts out, the current islimited to about 85 mA.FBM INPUT IMPEDANCE280 Ω minimumFBM INTERNAL POWER FOR FIELD DEVICE24 V dc ±10% common power supply for allchannels. Loop load limited to one device perchannel.ISOLATIONThe channels are not galvanically isolated fromeach other, but are galvanically isolated (bothoptical and transformer isolation) as a group from ground and module logic. Inputs use an internal FBM isolated power supply for field power. Themodule withstands, without damage, a potential of 600 V ac applied for one minute between the group-isolated channels and earth (ground).CAUTIONThis does not imply that these channels areintended for permanent connection tovoltages of these levels. Exceeding the limitsfor input voltages, as stated elsewhere in thisspecification, violates electrical safety codesand may expose users to electric shock. Fieldbus CommunicationCommunicates with its associated FCM or FCP via the redundant 2 Mbps module FieldbusHEAT DISSIPATION4 W (maximum)(1)The maximum allowable distance decreases when the loop is operated through an intrinsic safety barrier. The maximum distance ofthe field device from the FBM is a function of compliance voltage, wire gauge and voltage drop at the device.(2)In an intrinsic safety application, if a zener barrier is used between the FBM and the field device, the power supply must be set at24V dc +5%, -1%. There are no specific constraints with the use of galvanic barriers.PSS 21H-2Z14 B4Page 5 FUNCTIONAL SPECIFICATIONS (CONTINUED)Power RequirementsINPUT VOLTAGE RANGE (REDUNDANT)24V dc ±5%CONSUMPTION7 W (maximum)Regulatory ComplianceELECTROMAGNETIC COMPATIBILITY (EMC) European EMC Directive 89/336/EECMeets:EN 50081-2 Emission standardEN 50082-2 Immunity standardEN 61326 Annex A (Industrial Levels) CISPR 11, Industrial Scientific and Medical(ISM) Radio-frequency Equipment -Electromagnetic Disturbance Characteristics- Limits and Methods of MeasurementMeets Class A LimitsIEC 61000-4-2 ESD ImmunityContact 4 kV, air 8 kVIEC 61000-4-3 Radiated Field Immunity10 V/m at 80 to 1000 MHzIEC 61000-4-4 Electrical FastTransient/Burst Immunity2 kV on I/O, dc power and communicationlinesIEC 61000-4-5 Surge Immunity2kV on ac and dc power lines; 1kV on I/Oand communications linesIEC 61000-4-6 Immunity to ConductedDisturbances Induced by Radio frequencyFields10 V (rms) at 150 kHz to 80 MHz on I/O,dc power and communication linesIEC 61000-4-8 Power Frequency MagneticField Immunity30 A/m at 50 and 60 HzPRODUCT SAFETY (FBM AND CABLE BALUN) Underwriters Laboratories (UL) for U.S. andCanadaUL/UL-C listed as suitable for use inUL/UL-C listed Class I, Groups A-D;Division 2; temperature code T4 enclosurebased systems. These modules are also ULand UL-C listed as associated apparatus forsupplying non-incendive communicationcircuits for Class I, Groups A-D hazardouslocations when connected to specifiedI/A Series® processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Wherepower is supplied by the FBM,communications circuits also meet therequirements for Class2 as defined inArticle725 of the National Electrical Code(NFPA No.70) and Section 16 of theCanadian Electrical Code (CSA C22.1).Conditions for use are as specified in theI/A Series DIN Rail Mounted SubsystemUser’s Guide (B0400FA).European Low Voltage Directive 73/23/EECand Explosive Atmospheres (ATEX) directive94/9/ECCENELEC (DEMKO) certified as EEx nA IICT4 for use in CENELEC certified Zone 2enclosure certified as associated apparatusfor supplying non-incendive field circuits forZone 2, Group IIC, potentially explosiveatmospheres when connected to specifiedI/A Series processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Also,see Table1 on page9.Calibration RequirementsCalibration of the module or termination assembly is not required.PSS 21H-2Z14 B4Page 6ENVIRONMENTAL SPECIFICATIONS(3)OperatingTEMPERATUREModule-20 to +70°C (-4 to +158°F)Termination AssemblyPVC-20 to +50°C (-4 to +122°F)PA-20 to +70°C (-4 to +158°F) RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +3,000m (-1,000 to +10,000ft)StorageTEMPERATURE-40 to +70°C (-40 to +158°F)RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +12,000m (-1,000 to +40,000ft) ContaminationSuitable for use in Class G3 (Harsh) environments as defined in ISA Standard S71.04, based on exposure testing according to EIA Standard 364-65, Class III. Vibration7.5 m/S2 (0.75 g) from 5 to 500 Hz(3)The environmental limits of this module may be enhanced by the type of enclosure containing the module. Refer to the applicableProduct Specification Sheet (PSS) which describes the specific type of enclosure that is to be used.PSS 21H-2Z14 B4Page 7 PHYSICAL SPECIFICATIONSMountingMODULEFBM214 mounts on a modular baseplate. Thebaseplate can be mounted on a DIN rail(horizontally or vertically), or horizontally on a19-inch rack using a mounting kit. Refer toPSS21H-2W6B4 for details.TERMINATION ASSEMBLYThe TA mounts on a DIN rail and accommodates multiple DIN rail styles including 32mm (1.26in) and 35mm 1.38in).MassMODULE284 g (10 oz) approximateTERMINATION ASSEMBLYCompression181 g (0.40 lb) approximateRing Lug249 g (0.55 lb) approximateDimensions – ModuleHEIGHT102 mm (4 in)114 mm (4.5 in) including mounting lugsWIDTH45 mm (1.75 in)DEPTH104 mm (4.11 in)Dimensions – Termination AssemblySee page10.Part NumbersFBM214 MODULEP0922VTTERMINATION ASSEMBLIESSee “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” on page8. Termination CablesCABLE LENGTHSUp to 30 m (98 ft)CABLE MATERIALSPolyurethane or Hypalon®/XLPTERMINATION CABLE TYPEType 1 – See Table2 on page9.CABLE CONNECTION – TA25-pin male D-subminiatureConstruction – Termination AssemblyMATERIALPolyvinyl Chloride (PVC), compressionPolyamide (PA), compressionPVC, ring lugFAMILY GROUP COLORGreen – communicationTERMINAL BLOCKS3 tiers, 8 positionsField Termination ConnectionsCOMPRESSION-TYPE ACCEPTED WIRINGSIZESSolid/Stranded/AWG0.2 to 4 mm2/0.2 to 2.5 mm2/24 to 12 AWGStranded with Ferrules0.2 to 2.5 mm2 with or without plastic collarRING-LUG TYPE ACCEPTED WIRING SIZES#6 size connectors (0.375 in (9.5 mm))0.5 to 4 mm2/22 AWG to 12 AWGPSS 21H-2Z14 B4Page 8TERMINATION ASSEMBLIES AND CABLESField input signals connect to the FBM subsystem via DIN rail mounted Termination Assemblies, which are electrically passive.TAs for the FBM214 are available in the following forms: Compression screw type using Polyvinyl Chloride(PVC) materialCompression screw type using Polyamide (PA) material Ring lug type using PVC material.See the following “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” for a list of TAs used with the FBM214.The FBM214 provides sufficient loop resistance to allow use of the HART Hand-Held Terminal, or PC20 Intelligent Field Device Configurator (PSS 2A-1Z3 E).A removable termination cable connects the DIN railmounted TA to the FBM via a field connector on the baseplate in which the FBM is installed. Termination cables are available in the following materials: PolyurethaneHypalon XLP .Termination cables are available in a variety of lengths, up to 30 meters (98feet), allowing the Termination Assembly to be mounted in either theenclosure or in an adjacent enclosure. See Table 2 for a list of termination cables used with the TAs forthe FBM214.FUNCTIONAL SPECIFICATIONS – TERMINATION ASSEMBLIESFBM Type Input SignalTA Part NumberTermination TA Cable TACertification PVC (a)(a)PVC is polyvinyl chloride rated from -20 to +50°C (-4 to +122°F).PA is Polyamide rated from -20 to +70°C (-4 to +158°F).PA (a)Type (b)(b) C = TA with compression terminals; RL = TA with ring lug terminals.Type (c)(c)See Table 2 for cable part numbers and specifications.Type (d)(d)See Table 1 for Termination Assembly certification definitions.FBM2148 input channels, 4 to 20mA analog signal, alone or with HART signal superimposedP0916BX P0926EA P0926TD CRL11, 2PSS 21H-2Z14 B4Page 9Table 1. Certification for Termination AssembliesType Certification (a)(a)All TAs are UL/UL-C listed to comply with applicable ordinary location safety standards for fire and shock hazards. Hazardous locationtypes comply with ATEX directive for II 3 G use. They also comply with the requirements of the European Low Voltage Directive. All listings/certifications require installation and use within the constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA) and the conditions stated in UL and DEMKO reports.Type 1TAs are UL/UL-C listed as suitable for use in Class I; Groups A-D; Division 2 temperature code T4 hazardous locations. They are CENELEC (DEMKO) certified EEx nA IIC T4 for use in Zone 2 potentially explosive atmospheres.Type 2TAs are UL/UL-C listed as associated apparatus for supplying non-incendive field circuits Class I; Groups A-D; Division 2 hazardous locations when connected to specified DIN rail mounted FBMs and field circuits meeting entity parameter constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA). They are also CENELEC (DEMKO) certified as associated apparatus for supplying field circuits for Group IIC, Zone 2 potentially explosive atmospheres. Field circuits are also Class 2 limited energy (60 V dc, 30 V ac, 100 VA or less) if customer-supplied equipment meets Class 2 limits.Table 2. Cables Types and Part NumbersCable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)Cable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)0.5 (1.6)P0916DA P0916VA 10.0 (32.8) P0916DE P0916VE 1.0 (3.2) P0916DB P0916VB 15.0 (49.2) P0916DF P0916VF 2.0 (6.6)P0931RM P0931RR 20.0 (65.6) P0916DG P0916VG 3.0 (9.8) P0916DC P0916VC 25.0 (82.0) P0916DH P0916VH 5.0 (16.4)P0916DDP0916VD30.0 (98.4)P0916DJP0916VJ(a)P/PVC is polyurethane outer jacket and semi-rigid PVC primary conductor insulation.(b)H/XLPE is Hypalon outer jacket and XLPE (cross-linked polyethylene) primary conductor insulation.PSS 21H-2Z14 B4Page 10DIMENSIONS – NOMINALRELATED PRODUCT SPECIFICATION SHEETSCompression Termination AssemblyRing Lug Termination Assembly(a) Overall width – for determining DIN rail loading.(b) Height above DIN rail (add to DIN rail height for total).PSS NumberDescriptionPSS 21H-2W1 B3DIN Rail Mounted FBM Subsystem OverviewPSS 21H-2W2 B3DIN Rail Mounted FBM Equipment, Agency CertificationsPSS 21H-2Z14 B4Page 11PSS 21H-2Z14 B4 Page 12IPS Corporate Headquarters 5601 Granite Parkway Suite 1000 Plano, TX 75024United States of AmericaFoxboro Global Client Support Inside U.S.: 1-866-746-6477 Outside U.S.: 1-508-549-2424 or contact your local Foxboro representative.Facsimile: 1-508-549-4999Invensys, Foxboro, I/A Series and the IPS Logo are trademarks of Invensys plc, its subsidiaries, and affiliates. All other brand names may be trademarks of their respective owners.Copyright 2002-2010 Invensys Systems, Inc.All rights reservedMB 21A Printed in U.S.A. 0210。

VH HS产品资料

高灵敏度科研、工业用固定式红外热像仪
VarioCAM® hr head －HS系列
采用640x480和384x288像素高灵敏度探测器
主要特点： □ 640x480和384x288像素高灵敏度微量热型焦平面探测器 □ ORI®光学分辨率提升功能（选项） □ 优化模式下热灵敏度最高可达0.03℃ □ 测温范围宽：-40～1200℃，最高可扩展至2000℃ □ 测量精确，±1.5℃( 0~100℃量程) □ 使用显微镜头时，解析度最高可达25um □ 手动和自动量程转换 □ 手动和自动调焦 □ 最大8倍图像连续缩放 □ 定时定量自动保存 □ 16位数字红外图像60Hz实时采集和传输（选项） □ 声音和颜色报警 □ 合金壳体坚固耐用，整机仅重约1kg □ 中文界面软件配置齐备、功能丰富、易于使用
InfraTec GmbH Infrarotsensorik und Messtechnik
Specifications
规格
型号 VH-620HS IR-特点
VH-680HS
VH-780HS
VH-420HS
VH-480HS
VH-580HS
探测器类型
高灵敏度长波非制况微量热型焦平面探测器（Microbolometer）
外部光学/窗口校正图像显示
自动,基于输入的光学/窗口穿透率和温度
外接显示器
可选
显示功能图像存储可移动式SD存储卡数据传输
红外热图,操作指南,菜单,结果,状态,温标,时间可选
数字红外视频
√
√
√
√
√
√
60Hz 测量数据实时传输
无
√
√
无
√
√
接口
S-video, PAL/ NTSC-FBAS

OV5640_Camera_Module_Hardware_Application_Notes_R1.0英文手册

OV5640 Camera ModuleHardware Application NotesLast Modified: Apr 19th, 2010Document Revision: 1.0OmniVision Technologies, Inc. reserves the right to make changes without further notice to any product herein to improve reliability, function or design. OmniVision does not assume any liability arising out of the application or use of any project, circuit described herein; neither does it convey any license under its patent nor the right of others.Sensor datasheet is the official document of OmniVision. Software/hardware/dual camera applicaton notes are application guide lines for reference.If there are any difference between sensor datasheet and application notes,please follow sensor datasheet and kindly report the difference to OVT FAE.This document contains information of a proprietary nature. None of this information shall be divulged to persons other than OmniVision Technologies, Inc. employee authorized by the nature of their duties to receive such information,or individuals or organizations authorized by OmniVision Technologies, Inc.Table of Contents1. OV5640 Camera Module Reference Design (3)2. OV5640 Interface with Host (5)2.1 Host 1.8V IO and 5640 1.8V IO (5)2.2 Host 2.8V IO and 5640 1.8V IO (5)2.3 Host 2.8V IO and 5640 2.8V IO (7)3. OV5640 Camera Interface Reference for Camera Phone (8)3.1 Pin Definition (8)3.2 Power Supply (8)4. OV5640 Camera Operation (10)4.1 Power Saving Modes (10)4.2 Camera Operation in Power Down Mode (10)4.2.1 Battery On (10)4.2.2 Wake up From Power Down (11)4.2.3 Power Down (11)4.3 Camera Operation in Power Off Mode (12)4.3.1 Battery On (12)4.3.2 Camera On (12)5. SCCB Bus sharing (14)6. Timing Considerations for Phone PCB Design (15)6.1 Sample with PCLK (15)6.2 Sample with XCLK (16)6.3 Using EMI/ESD Device (16)7. Hardware Check List (17)7.1 Check Hardware Design (17)7.1.1 Module Function (17)7.1.2 Check Camera Interface of Phone (17)7.2 Check if Camera Module is Working (17)7.3 Check SCCB (18)7.4 Check Camera Interface (18)7.5 Some Typical Issues (19)7.6 Image Direction (20)7.6.1 Sensor 4:3, LCD 3:4 (20)7.6.2 Sensor 3:4, LCD 3:4 (20)7.7 Check Color/Brightness (20)7.8 Check Image Center (21)Revision History (22)1. OV5640 Camera Module Reference DesignNote:1.PWND, active HIGH as DOVDD to power down OV5640, should be connected to groundoutside of module if unused2.RESETB. Active LOW to reset OV5640, should be connected to DOVDD outside ofmodule if unused3.AVDD is 2.6-3.0V of sensor analog power (clean). 2.8V is recommended. AVDD must be2.5V+-5% for OTP write, and OTP read does not have such requirement4.DVDD is 1.5V±5% of sensor digital power(clean). Using the internal DVDD regulator isstrongly recommended5.DOVDD. 1.8V recommended is 1.7V-3.0V of sensor digital IO power(clean)6.sensor AGND and DGND should be separated and connected to a single point outside PCB,Do not connect inside module7.Capacitors should be close to the related sensor pins8.D[9:0] is sensor 10 bit RGB RAW output. D[9:2] is sensor 8-bit YUV/RGB outputFor OV5640 camera module, below two kinds of power supplies are recommended:A.2 External Power Supplies⏹DOVDD = 1.8V, DVDD generated by internal regulator⏹AVDD = 2.8V⏹Support both Power Down and Power Off mode for power saving.B. 3 External Power Supplies⏹DOVDD = 2.8V⏹DVDD = 1.5V⏹AVDD = 2.8V⏹Use Power Off mode for power saving. Power Down mode is not supported for powersaving.2. OV5640 Interface with Host2.1 Host 1.8V IO and 5640 1.8V IOFor those hosts can support 1.8V IO.2.2 Host 2.8V IO and 5640 1.8V IOHowever, for some legacy phones or baseband chips, they only accepts 2.8V IO signals, for this kind of application, we suggest 5640 use 1.8V with level shift in between 5640 and host for all video signals.In this case, 5640 works in the 1.8V IO, and host works in required 2.8V IO. For this case:1)OV5640 output pins (HREF/HSYNC, VSYNC, DATA0~9, PCLK, FREX, STROBE,GPIO1~2) are tri-state when sensor is in standby mode (PWDN pin is high). Please makesure that it would not cause any problem(current leak) for other devices’ input. You may put 10kohm pull-down resistor on all tri-state pins if tri-state is an issue for level-shifter or host chip.2)Add level-shifter for all video signals -- HREF/HSYNC, VSYNC, DATA0~9, PCLK.3)Sensor SCL and SDA can tolerance high voltage. So it is no problem for 5640 to use 1.8VIO and I2C pull up resistors connect to 2.8V.4)Sensor PWDN and XCLK are no problem for 2.8V signal. PWDN can directly connect to2.8V for sensor power down. If has extra level shift pins, add level shift for these two pinsas well.5)For RESETB pin, please don’t provide 2.8V signal since 5640 has internal pull-up resistorto IO power. If provide 2.8V signal on this pin, it will cause power leak (from 2.8V signal to the sensor 1.8V IO power through the pull-up resistor and diode). Here are some solutions.a) Host drive this pin to low for reset mode, and change it to floating/input in operatingmode and let sensor internal pull-up resistor to drive high (1.8V).b) Add level-shifter for RESETB as well.2.3 Host 2.8V IO and 5640 2.8V IOOV5640 also support 2.8V IO. If use 2.8V IO, the 1.5V DVDD must be supplied by external power. And power off mode is recommended for power saving. Power down mode is not supported for power saving.3. OV5640 Camera Interface Reference for Camera Phone3.1 Pin DefinitionThe video port of OV5640 has 10-bit, D[9:0]. For 10-bit RGB raw output, please use D[9:0]. For 8-bit YCbCr or 8-bit RGB raw or 8-bit RGB 565 output, please use D[9:2].The Href and Hsync signal is on the same pin – Href. The function of this pin could be selected by SCCB setting.The SIO_C and SIO_D bus should have external pull up resistors, the typical value of the pull up resistors is 5.1K.RESET# is active low with internal pull-up resistor. Reset# should be controlled by backend chip for proper power up sequence.PWDN is active high with internal pull-down resistor. PWDN should be controlled by backend chip for proper power up sequence.3.2 Power SupplyIf DOVDD uses 1.8V, then DVDD is generated by internal regulator. So 2 regulators should be used.If DOVDD uses 2.8V, then DVDD is supplied from external power supply. So 3 regulators should be used. Power down mode is not supported for power saving here.Note:The AGND and DGND should be separate inside module and connected together on phone PCB very close to camera module connector.4. OV5640 Camera Operation 4.1 Power Saving ModesThere are 2 kinds of power saving modes: power down mode and power off mode.Power down mode means that in power saving mode, all the power supplies to camera module are kept. The cameras are set into power down mode by pull high PWDN pin.Power off mode means that in power saving mode, all the power supplies to camera module are cut.4.2 Camera Operation in Power Down ModeTo support power down mode for power saving, the DOVDD of OV5640 should be 1.8V and DVDD is generated by internal regulator. If DOVDD of OV5640 is higher than 1.8V, the power down mode can not be used for power saving. But it still could be used for sharing SCCB bus with other I2C device or share single DVP port with other cameras.4.2.1 Battery Ont0: >= 0ms. Delay from DOVDD stable to AVDD stable.t2: >= 5ms. Delay from AVDD stable to sensor power up stable.t3: >= 1ms. Delay from sensor power up stable to Reset# pull high.t4: >=20ms. Delay from Reset pull high to SCCB initialization.Step 1:Reset# is applied to OV5640 camera module. PWDN is pulled high.Step 2:DOVDD and AVDD powers are applied. The 2 powers could be applied simultaneously. Ifapplied separately, the power on sequence should be DOVDD first, and AVDD last.Reset#PWDNSIO_CSIO_DDOVDDAVDDXCLKStep 3: after 5ms of AVDD reaching stable, pull PWDN to low.Step 4:after 1ms of PWDN go low, pull high Reset#.Step 5: After 20ms, initialize OV5640 by SCCB initialization. Please find the settings from “OV5640 Camera Module Software Application Notes” or contact with OmniVision local FAE.Step 6:Pull high PWDN. Set OV5640 to power down mode.Step 7:Pull XCLK low.After battery on, OV5640 camera should be initialized first, then set to power down mode.4.2.2 Wake up From Power DownStep 1:Apply XCLKStep 2:after 10ms, Pull low PWDNOptional Step 3:Full SCCB Initialization. Please find the settings from “OV5640 Camera Module Software Application Notes” or contact with OmniVision local FAE.4.2.3 Power DownPWDNSIO_CSIO_DXCLKStep 1: Pull PWDN pin high.Step 2:Pull XCLK low4.3 Camera Operation in Power Off ModeIf DOVDD of OV5640 is higher than 1.8V, and DVDD is generated by internal regulator, the voltage drop across the internal regulator is too big. There is potential over heat issue. So theDVDD should be provided by external power supply to prevent over heat if DOVDD is higher than1.8V. In this situation, power down mode is not supported. Power off mode is used for power saving.4.3.1 Battery OnNo operation. Camera module is power off.4.3.2 Camera OnPWDNSIO_CSIO_DXCLKReset#PWDNSIO_CSIO_DDOVDDAVDDDVDDXCLKt0: >= 0ms. Delay from DOVDD stable to AVDD stable.t1: >= 0ms. Delay from AVDD stable to DVDD stable.t2: >= 5ms. Delay from DVDD stable to sensor power up stable.t3: >= 1ms. Delay from sensor power up stable to Reset# pull high.t4: >=20ms. Delay from Reset pull high to SCCB initialization.Step 1:Reset# is applied to OV5640 Camera Module.Step 2:DOVDD, DVDD and AVDD powers are applied. The 3 powers could be applied simultaneously. If applied separately, the power on sequence should be DOVDD first, AVDD second and DVDD last.Step 3:after 5ms of last power applied, pull low PWDN.Step 4:after 1ms. Pull high Reset#.Step 5:After 20ms, initialize OV5640 by SCCB initialization. Please find register setting from “OV5640 Camera Module Hardware Application Notes” or contact OmniVision local FAE for initialization settings.Note: If there is no powerdown pin in your module, this means powerdown pin is connect with GND.4.3.3 Camera OffStep 1.Pull low XCLK,Step 2.Turn off AVDD, DVDD and DOVDD. The 3 powers could be turned off simultaneously. If turned off separately, DVDD should be turned off first, AVDD second and DOVDD third.Step 3.Pull Low PWDN and RESET5. SCCB Bus sharing The SCCB bus of OV5640 camera module could be shared with other I2C device. WhenOV5640 is working, the read/write operation is separated by device address. The device address of OV5640 is 0x78 for write and 0x79 for read. I2C read/write to address other than the 2 addressabove will not affect SCCB registers of OV5640. If device address of OV5640 conflict with other I2c devices, OV5640 should be put into power down mode or power off mode to access other I2c device. When OV5640 camera module is powerdown or power off, the SCCB Bus is leave free. The SCCB of OV5640 doesn't affect the read/write of other I2C device.DOVDDDVDD AVDDXCLKResetPWDN6. Timing Considerations for Phone PCB DesignThere are 2 clock signal for OV5640 camera module. One is the main clock (input clock) XCLK, the other is the pixel clock (output clock) PCLK. Some backend/baseband chips may use XCLK as pixel sample clock, some backend/baseband chips may use PCLK as pixel sample clock. It is recommended to use PCLK as pixel sample clock.Let's look at the clock distribution first.delay is over the spec. of backend/baseband chip, the backend/baseband chip can not get video data correctly. The incorrect video data may have wrong color, fixed or moving horizontal lines.From the clock distribution diagram above, the delays are:Delay_XCLK = 0Delay_PCLK = PCB_Delay_XCLK + Internal_Delay + PLL_Delay + PCB_Delay_PCLKDelay_Data = PCB_Delay_XCLK + Internal_Delay + PLL_Delay + PCLK_to_Data_Delay + PCB_Delay_Data6.1 Sample with PCLKIf Backend/baseband sample video data with PCLK, the clock data delay isclock_data_delay = Delay_Data – Delay_PCLK= PCLK_to_Data_Delay + PCB_Delay_Data – PCB_Delay_PCLK The clock data delay is not related with PCB delay of XCLK.If PCB is carefully designed so that the wire length of PCLK and Data are same, thenPCB_Delay_Data = PCB_Delay_PCLK, the clock data delay isclock_data_delay = PCLK_to_Data_Delay, not related to PCB layout6.2 Sample with XCLKIf Backend/baseband sample video data with PCLK, the clock data delay isclock_data_delay = Delay_Data – Delay_XCLK= PCB_Delay_XCLK + Internal_Delay + PLL_Delay + PCLK_to_Data_Delay + PCB_Delay_Data The data to clock delay at Baseband/Backend chip are much bigger than sampled with PCLK. And the delay is highly depend on PCB layout. So if XCLK is used to sample video data, it is very likely to have timing issue which would cause incorrect video data.6.3 Using EMI/ESD DeviceIf EMI/ESD device are used in phone design, the PCB delay increase very much. It should be very careful to manipulate the delays to meet timing spec. of backend/baseband chips.1.Try to use PCLK as sample clock of video data.2.XCLK and PCLK should not share ESD/EMI device with other signals. Use dedicateESD/EMI device or R/C filters for XCLK and PCLK. So that the delay on XCLK andPCLK could be adjusted later.3.For dual camera module, use single ESD/EMI device or single R/C filter for XCLK andPCLK to minimize clock delay.4.Carefully layout PCB to keep XCLK wire as short as possible, PCLK wire the same lengthas data lines.5.Minimize the length of FPC of camera module.7. Hardware Check List7.1 Check Hardware Design7.1.1 Module FunctionCheck camera module function with USB 2.0 test board (Module interface board may be needed, please contact with module maker). The module should display image correctly on PC.Check module schematic design, pin definition match with camera interface of phone. Analog ground and digital ground are separated inside camera module.7.1.2 Check Camera Interface of PhonePin definition matches with camera module design.AVDD is supplied by separate regulator. DVDD and DOVDD could be supplied by separate regulator or shared regulator with other circuits. The voltage of each power supplied are within sensor specification.If there is a long flex cable to connect camera module to main board of phone, please make sure the ground of camera module is not shared with other circuits. For flip type phone, share camera ground with LCD module would cause very strong power/ground noise.7.2 Check if Camera Module is WorkingEvidence of camera module workingPCLK outputHREF, VSYNC outputsD[9:0] outputCheck proceduresa. Voltages of power supplies are within sensor specificationb. input clock is correctc. all input signals are in correct statePWDN = in active, Reset = in active, SIO_D = H, SIO_C = Hd. for OV5640 and later, please check SCCB initialization waveform to make sure SCCB initialization is completed.If all the check are passed, the camera module still can not work, please check if the camera module is damaged or contact OmniVision local FAE.7.3 Check SCCBa. Check SCCB connection: Pull up resistors exist. Recommended value is around 4.7K.b. SCCB write speed should not be too fast for first debug. Recommended not over 100K. The write speed could be increased up to 400K later on.c. Simple ways to check SCCBSCCB read could be verified by read register 0x0a, 0x0b (version).SCCB write could be verified by write register 0x11 and check PCLK frequency.d. To make sure SCCB read/write are correct, please use oscilloscope to capture whole waveforms of SCCB initialization.e. Make sure the SCCB device ID is correct for read/write operation.SCCB address is 0xc0/0xc1 for CIF sensorsSCCB address is 0x42/0x43 for VGA sensorsSCCB address is 0x60/0x61 for 1.3M and 2.0M sensorsSCCB address is 0x78/0x79 for 3.0M ，5.0M sensorsf. If SCCB soft reset is used, please wait at least 2~5ms after SCCB soft rest.7.4 Check Camera Interfacea. Check polarity of HREF(HSYCN), VSYNC, PCLK, make sure the polarity of camera module matches with backend or baseband side.b. Check sample clock. Please pay attention to baseband/backend sample with MCLK. In this case, the clock divider inside sensor could not be turned on. Please also pay attention to possible timing issues listed in section 5.c. check window position.If camera interface uses HREF, then the window position is defined by sensor.If camera interface uses HSYNC, then the window position is defined by backend / baseband.7.5 Some Typical IssuesLine width tooIn sufficient outputlinesLine width too Wrong WindowPositionHorizontal SyncIssueVertical SyncIssueSample Rate tooHighSample rate toolowTimingIssue7.6 Image Direction7.6.1 Sensor 4:3, LCD 3:4Full screen display is not full view angleFull view angle display is not full screenFull view angle Full Screen Camera module7.6.2 Sensor 3:4, LCD 3:4Sensor rotate 90 degree in camera modulePicture scan line direction should be changed by phoneFull Screen and Full view angle on LCDFull view angle & Full Screen Change scan line direction of camera7.7 Check Color/Brightnessa. There are only red/green color in pictureY and U/V exchanged.b. R/B exchangeU/V exchangec. color/brightness not continuouscheck connection of d[9:0]7.8 Check Image CenterPlace an object in front of camera module, check if the picture is on center of LCD. If not, the output window of camera is not correct.Revision History。