SN74LVCH244APWT中文资料
SN74LVC244APWR中文资料
TA –40°C to 85°C
–40°C to 125°C
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
QFN – RGY
Reel of 1000
SN74LVC244ARGYR
VFBGA – GQN Reel of 1000
Copyright © 1992–2005, Texas Instruments Incorporated
元器件交易网
SN74LVC244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) > 2 V
at VCC = 3.3 V, TA = 25°C • Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V VCC) • Ioff Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 250 mA Per JESD 17 • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
IN74ACT244中文资料
O CTAL 3-S TATE N ONINVERTINGB UFFER/L INE D RIVER/L INE R ECEIVERHigh-Speed Silicon-Gate CMOS The IN74ACT244 is identical in pinout to the LS/ALS244, HC/HCT244. The IN74ACT244 may be used as a level converterfor interfacing TTL or NMOS outputs to High Speed CMOSinputs.designed to be used with 3-state memory address drivers, clocknoninverting outputs and two active-low output enables.•TTL/NMOS Compatible Input Levels•Outputs Directly Interface to CMOS, NMOS, and TTL•Operating Voltage Range: 4.5 to 5.5 V •Low Input Current: 1.0 µA; 0.1 µA @ 25°C •Outputs Source/Sink 24 mAORDERING INFORMATIONIN74ACT244N PlasticIN74ACT244DW SOICT A = -40° to 85° C for allpackagesFUNCTION TABLEInputs Outputs Enable A,Enable BA,B YA,YBL L LL H HH X ZX=don’t careZ = high impedanceLOGIC DIAGRAMPIN 20=V CCPIN 10 = GNDPIN ASSIGNMENTMAXIMUM RATINGS*Symbol Parameter ValueUnit V CC DC Supply Voltage (Referenced to GND) -0.5 to +7.0 VV IN DC Input Voltage (Referenced to GND) -0.5 to V CC +0.5 VV OUT DC Output Voltage (Referenced to GND) -0.5 to V CC +0.5 VI IN DC Input Current, per Pin ±20 mAI OUT DC Output Sink/Source Current, per Pin ±50 mAI CC DC Supply Current, V CC and GND Pins ±50 mAP D Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750500mWTstg Storage Temperature -65 to +150 °CT L Lead Temperature, 1 mm from Case for 10Seconds(Plastic DIP or SOIC Package)260 °C*Maximum Ratings are those values beyond which damage to the device may occur.Functional operation should be restricted to the Recommended Operating Conditions.+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°CSOIC Package: - 7 mW/°C from 65° to 125°CRECOMMENDED OPERATING CONDITIONSSymbol Parameter MinMaxUnit V CC DC Supply Voltage (Referenced to GND) 4.5 5.5 VV IN, V OUT DC Input Voltage, Output Voltage (Referenced toGND)0 V CC VT J Junction Temperature (PDIP) 140 °CT A Operating Temperature, All Package Types -40 +85 °CI OH Output Current - High -24 mAI OL Output Current - Low 24 mAt r, t f Input Rise and Fall Time * (except Schmitt Inputs) V CC=4.5 VV CC =5.5 V108.0ns/V* VINfrom 0.8 V to 2.0 VThis device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V IN and V OUT should be constrained to the range GND≤(V IN or V OUT)≤V CC.Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC). Unused outputs must be left open.DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)V CC Guaranteed LimitsSymbol Parameter Test Conditions V 25 °C -40°C to85°CUnit V IH Minimum High-Level Input VoltageV OUT = V CC -0.1 V 4.5 5.5 2.0 2.0 2.0 2.0 VV IL Maximum Low -Level Input VoltageV OUT =0.1 V 4.5 5.5 0.8 0.8 0.8 0.8 VV OH Minimum High-Level Output VoltageI OUT ≤ -50 µA 4.5 5.5 4.4 5.4 4.4 5.4 V*V IN =V IHI OH =-24 mAI OH =-24 mA4.55.5 3.86 4.86 3.76 4.76 V OL Maximum Low-Level Output VoltageI OUT ≤ 50 µA 4.5 5.5 0.1 0.1 0.1 0.1 V*V IN =V ILI OL =24 mAI OL =24 mA4.55.5 0.36 0.36 0.44 0.44 I IN Maximum Input Leakage CurrentV IN =V CC or GND 5.5 ±0.1 ±1.0 µAI OZ Maximum Three-State Leakage Current V IN (OE)=V IL or V IH V IN =V CC or GND V OUT =V CC or GND5.5 ±0.5 ±5.0 µA∆I CCT Additional MaxI CC /InputV IN =V CC - 2.1 V 5.5 1.5 mA I OLD +Minimum Dynamic Output CurrentV OLD =1.65 V Max 5.5 75 mAI OHD +Minimum Dynamic Output CurrentV OHD =3.85 V Min 5.5 -75 mAI CC Maximum Quiescent Supply Current(per Package)V IN =V CC or GND 5.5 8.0 80 µAAll outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time.AC ELECTRICAL CHARACTERISTICS(V CC=5.0 V ± 10%, C L=50pF,Input t r=t f=3.0 ns)LimitsGuaranteedUnitSymbol Parameter 25 °C -40°C to85°CMax MinMaxMin t PLH Propagation Delay, A to YA or B to YB2.0 9.0 1.5 10.0 ns(Figure 1)2.0 9.0 1.5 10.0 nst PHL Propagation Delay, A to YA or B to YB(Figure 1)1.5 8.5 1.0 9.5 nst PZH Propagation Delay, Output Enable to YAor YB (Figure 2)t PZL Propagation Delay, Output Enable to YA2.0 9.5 1.5 10.5 nsor YB (Figure 2)2.0 9.5 1.5 10.5 nst PHZ Propagation Delay, Output Enable to YAor YB (Figure 2)2.5 10.0 2.0 10.5 nst PLZ Propagation Delay, Output Enable to YAor YB (Figure 2)C IN Maximum Input Capacitance 4.5 4.5 pFTypical @25°C,V CC=5.0VC PD Power Dissipation Capacitance 45 pFFigure 1. Switching Waveforms Figure 2. Switching Waveforms。
AiP74HC244中文资料
3.3.3、交流参数 1 （Tamb=25℃，GND=0，tr=tf=6.0ns，CL=50pF，见图 5）
参数名称
符号
测试条件
最小 典型
最大 单 位
VCC=2.0V
－
30
110
ns
nAn 到 nYn 的传输延时
tPHL/tPLH
VCC=4.5V VCC=6.0V
－
11
22
ns
－
9
19
ns
见图 3 VCC=5V;CL=15pF －
1、概 述
AiP74HC244是一款高速硅栅CMOS器件，其引脚兼容低功耗肖特基TTL（LSTTL）系列。该电路完全 符合JEDEC标准no.7A。
AiP74HC244是一款带三态输出控制的八路缓冲器/线路驱动器。三态输出端由输入使能端（1 OE
和2 OE ）控制。当使能端（n OE ）为高电平时，输出端呈现高阻态。
VCC=6.0V ,IO=20uA
－
VCC=4.5V ,IO=6.0mA
－
VCC=6.0V ,IO=7.8mA
－
输入漏电流
ILI
VI =VCC 或 GND, VCC=6.0V
－
截止状态输出电流 IOZ VI =VIH 或 VIL, Vo=VCC 或 GND, VCC=6.0V －
静态电流
ICC VI =VCC 或 GND, VCC=6.0V, IO=0
最小 1.5 3.15 4.2 － － － 1.9 4.4 5.9 3.84 5.34 － － － －
典型 － － － － － － － － － － － － － － －
最大 － － － 0.5 1.35 1.8 － － － － － 0.1 0.1 0.1 0.33
SN74AHC244DWE4中文资料
PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9678201QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9678201SA ACTIVE CFP W 20TBD Call TI Call TI5962-9678201VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC244DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC244DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWLEOBSOLETETSSOPPW20TBDCall TICall TI24-Sep-2007Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74AHC244PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC244FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC244J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC244WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--TheMoisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.24-Sep-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244DBR DB 20SITE 41330168.27.5 2.51216Q1SN74AHC244DGVR DGV 20SITE 41330127.0 5.6 1.6812Q1SN74AHC244DWR DW 20SITE 413302410.813.0 2.71224Q1SN74AHC244NSR NS 20SITE 41330248.213.0 2.51224Q1SN74AHC244PWRPW20SITE 41330166.957.11.6816Q122-Sep-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC244DBR DB 20SITE 41346.0346.00.0SN74AHC244DGVR DGV 20SITE 41346.0346.00.0SN74AHC244DWR DW 20SITE 41346.0346.00.0SN74AHC244NSR NS 20SITE 41346.0346.00.0SN74AHC244PWRPW20SITE 41346.0346.00.022-Sep-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
SN74LVCH244APWTG4中文资料
INPUTS
OE
A
L
H
L
L
H
X
OUTPUT Y
H L Z
1 1OE
LOGIC DIAGRAM (P 1Y1
11 2A1
9 2Y1
1A2 4
16 1Y2
2A2 13
7 2Y2
1A3 6
14 1Y3
2A3 15
5 2Y3
1A4 8
12 1Y4
2A4 17
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down.
元器件交易网
SN54LVCH244A, SN74LVCH244A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
SCES009O – JULY 1995 – REVISED FEBRUARY 2007
74HC244中文资料
54/74LS244三态八缓冲器/线驱动器/线接收器(3S,两组控制)简要说明:244为三态输出的八组缓冲器和总线驱动器,其主要电器特性的典型值如下(不同厂家具体值有差别):型号t PLH t phl P D54LS241/74LS241 12ns 12ns 110mW引出端符号:1A1~1A4,2A1~2A4 输入端/1G, /2G 三态允许端(低电平有效)1Y1~1Y4,2Y1~2Y4 输出端逻辑图:双列直插封装极限值:电源电压 (7V)输入电压…………………………………………. 5.5V输出高阻态时高电平电压…………………………. 5.5V工作环境温度54XXX …………………………………. -55~125℃74XXX …………………………………. 0~70℃存储温度…………………………………………. -65~150℃功能表:推荐工作条件:54LS244/74LS244单位最小额定最大电源电压Vcc 54 4.5 5 5.5V 74 4.75 5 5.25输入高电平电V iH 2 V输入低电平电V iL 54 0.7V 74 0.8输出高电平电流I OH 54 -12mA 74 -15输出低电平电流I OL 54 12mA 74 24动态特性(T A=25℃)参数测试条件LS244单位最大t PLH输出由低到高传输延迟时间Vcc =5VC L=45pFR L=667 Ω18 nst PHL输出由高到低传输延迟时间18 ns t PZH输出由高阻态到高允许时间23 ns t PZL输出由高阻态到低允许时间30 nst PHZ输出由高到高阻态禁止时间Vcc=5V C L=5pFR L=90 Ω18 nst PLZ输出由低到高阻态禁止时间25 ns 静态特性（TA为工作环境温度范围）参数测试条件【1】LS244单位最小最大V IK输入嵌位电压Vcc=最小，I ik=-18mA -1.5 V △V T滞后电压Vcc＝最小0.2 VV OH输出高电平电压Vcc＝最小，V IL＝最大，V IH=2V,I OH＝－3mA2.4 VV OL输出低电平电压Vcc=最小，V IL＝最大， I OL=最大54 0.4V74 0.5I I最大输入电压时输出电流Vcc＝最大，V I=7V 0.1 mA I IH输入高电平电流Vcc＝最大，VIH=2.7V 20 uA I IL输入低电平电流1A,2A Vcc＝最大，V IL=0.4V -0.2 mA I OS输出短路电流Vcc＝最大-40 -225 mAI OZH输出高阻态时高电平电流Vcc＝最大，V IH=2VV IL=最大，V O=2.7V20 uAI OZL输出高阻态时低电平电流Vcc＝最大，V IH=2V,V IL＝最大，V O=0.4V-20 uAIcc电源电流Vcc＝最大1Y,2Y均为高电平27mA 1Y,2Y均为低电平461Y,2Y均为高阻态54[1]: 测试条件中的“最小”和“最大”用推荐工作条件中的相应值。
74LVC244A资料
1/9February 2002s 5V TOLERANT INPUTSs HIGH SPEED: t PD = 5.9ns (MAX.) at V CC = 3V sPOWER DOWN PROTECTION ON INPUTS AND OUTPUTSsSYMMETRICAL OUTPUT IMPEDANCE:|I OH | = I OL = 24mA (MIN) at V CC = 3Vs PCI BUS LEVELS GUARANTEED AT 24 mA sBALANCED PROPAGATION DELAYS:t PLH ≅ t PHLsOPERATING VOLTAGE RANGE:V CC (OPR) = 1.65V to 3.6V (1.2V Data Retention)sPIN AND FUNCTION COMPATIBLE WITH 74 SERIES 244sLATCH-UP PERFORMANCE EXCEEDS 500mA (JESD 17)sESD PERFORMANCE:HBM > 2000V (MIL STD 883 method 3015); MM > 200VDESCRIPTIONThe 74LVC244A is a low voltage CMOS OCTAL BUS BUFFER (3-STATE) fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOS technology. It is ideal for 1.65 to 3.6V CC operations and low power and low noise applications.It can be interfaced to 5V signal environment for inputs in mixed 3.3/5V system.G control output governs four BUS BUFFERs.This device is designed to be used with 3 state memory address drivers, etc.It has more speed performance at 3.3V than 5V AC/ACT family, combined with a lower power consumption.All inputs and outputs are equipped with protection circuits against static discharge, giving them 2KV ESD immunity and transient excess voltage.74LVC244ALOW VOLTAGE CMOS QUAD BUS BUFFERS (3-STATE)HIGH PERFORMANCE.PIN CONNECTION AND IEC LOGIC SYMBOLSORDER CODESPACKAGE TUBE T & R SOP 74LVC244AM74LVC244AMTR TSSOP74LVC244ATTR74LVC244A2/9INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEX : Don’t careZ : High ImpedanceABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied1) I O absolute maximum rating must be observed 2) V O < GNDPIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2, 4, 6, 81A1 to 1A4Data Inputs 9, 7, 5, 32Y1 to 2Y4Data Outputs 11, 13, 15,172A1 to 2A4Data Inputs 18, 16, 14,121Y1 to 1Y4Data Outputs192G Output Enable Input 10GND Ground (0V)20V CCPositive Supply VoltageINPUTS OUTPUTG An Yn L L L L H H HXZSymbol ParameterValue Unit V CC Supply Voltage -0.5 to +7.0V V I DC Input Voltage-0.5 to +7.0V V O DC Output Voltage (High Impedance or V CC = 0V)-0.5 to +7.0V V O DC Output Voltage (High or Low State) (note 1)-0.5 to V CC + 0.5V I IK DC Input Diode Current- 50mA I OK DC Output Diode Current (note 2)- 50mA I O DC Output Current ± 50mA I CC or I GND DC V CC or Ground Current per Supply Pin± 100mA T stg Storage Temperature -65 to +150°C T LLead Temperature (10 sec)300°C74LVC244A3/9RECOMMENDED OPERATING CONDITIONS1) Truth Table guaranteed: 1.2V to 3.6V 2) V IN from 0.8V to 2V at V CC = 3.0VDC SPECIFICATIONSSymbol ParameterValue Unit V CC Supply Voltage (note 1) 1.65 to 3.6V V I Input Voltage0 to 5.5V V O Output Voltage (High Impedance or V CC = 0V)0 to 5.5V V O Output Voltage (High or Low State)0 to V CC V I OH , I OL High or Low Level Output Current (V CC = 3.0 to 3.6V)± 24mA I OH , I OL High or Low Level Output Current (V CC = 2.7 to 3.0V)± 12mA I OH , I OL High or Low Level Output Current (V CC = 2.3 to 2.7V)± 8mA I OH , I OL High or Low Level Output Current (V CC = 1.65 to 2.3V)± 4mA T op Operating Temperature-55 to 125°C dt/dvInput Rise and Fall Time (note 2)0 to 10ns/VSymbolParameterTest ConditionValueUnitV CC (V)-40 to 85 °C -55 to 125 °C Min.Max.Min.Max.V IHHigh Level Input Voltage 1.65 to 1.950.65V CC 0.65V CC V 2.3 to 2.7 1.7 1.72.7 to3.622V ILLow Level Input Voltage1.65 to 1.950.35V CC 0.35V CCV2.3 to 2.70.70.72.7 to3.60.80.8V OHHigh Level Output Voltage1.65 to 3.6I O =-100 µA V CC -0.2V CC -0.2V1.65I O =-4 mA 1.2 1.22.3I O =-8 mA 1.7 1.72.7I O =-12 mA 2.2 2.23.0I O =-18 mA 2.4 2.43.0I O =-24 mA 2.22.2V OLLow Level Output Voltage1.65 to 3.6I O =100 µA 0.20.2V1.65I O =4 mA 0.450.452.3I O =8 mA 0.70.72.7I O =12 mA 0.40.43.0I O =24 mA 0.550.55I I Input Leakage Current3.6V I = 0 to 5.5V ± 5± 5µA I off Power Off Leakage Current0V I or V O = 5.5V 1010µA I OZHigh Impedance Output Leakage Current3.6V I = V IH orV IL V O = 0 to 5.5V ± 5± 5µAI CCQuiescent Supply Current3.6V I = V CC or GND1010µA V I or V O = 3.6 to5.5V± 10± 10∆I CCI CC incr. per Input2.7 to3.6V IH = V CC -0.6V500500µA74LVC244A4/9DYNAMIC SWITCHING CHARACTERISTICS1) Number of output defined as "n". Measured with "n-1" outputs switching from HIGH to LOW or LOW to HIGH. The remaining output is measured in the LOW state.AC ELECTRICAL CHARACTERISTICS1) Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switch-ing in the same direction, either HIGH or LOW (t OSLH = | t PLHm - t PLHn |, t OSHL = | t PHLm - t PHLn |2) Parameter guaranteed by designCAPACITIVE CHARACTERISTICS1) C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I CC(opr) = C PD x V CC x f IN + I CC /n (per circuit)SymbolParameterTest ConditionValue UnitV CC (V)T A = 25 °C Min.Typ.Max.V OLP Dynamic Low Level Quiet Output (note 1)3.3C L = 50pFV IL = 0V, V IH = 3.3V0.8V V OLV-0.8SymbolParameterTest ConditionValueUnitV CC (V)C L (pF)R L (Ω)t s = t r (ns)-40 to 85 °C -55 to 125 °C Min.Max.Min.Max.t PLH t PHLPropagation Delay Time1.65 to 1.953010002.09.012ns2.3 to 2.730500 2.07.910.52.750500 2.5 1.5 6.98.33.0 to 3.650500 2.515.97.1t PZL t PZHOutput Enable Time 1.65 to 1.95301000 2.01114.3ns2.3 to 2.730500 2.09.612.52.750500 2.518.610.33.0 to 3.650500 2.517.69.1t PLZ t PHZOutput Disable Time 1.65 to 1.95301000 2.09.011.7ns2.3 to 2.730500 2.07.810.12.750500 2.52 6.88.23.0 to 3.6505002.526.57.8t OSLH t OSHLOutput To Output Skew Time (note1, 2)2.7 to3.611nsSymbolParameterTest ConditionValue UnitV CC (V)T A = 25 °C Min.Typ.Max.C IN Input Capacitance4pF C PDPower Dissipation Capacitance (note 1)1.8f IN = 10MHz28pF 2.5303.33474LVC244A TEST CIRCUITT OUTTEST CIRCUIT AND WAVEFORM SYMBOL VALUEV CCSymbol1.65 to 1.95V2.3 to 2.7V 2.7V3.0 to 3.6VC L30pF30pF50pF50pFR L =R11000Ω500Ω500Ω500ΩV S 2 x V CC 2 x V CC6V6VV IH V CC V CC 2.7V 2.7VV M V CC/2V CC/2 1.5V 1.5VV OH V CC V CC 3.0V 3.0VV X V OL + 0.15V V OL + 0.15V V OL + 0.3V V OL + 0.3VV Y V OH - 0.15V V OH - 0.15V V OH - 0.3V V OH - 0.3Vt r = t r<2.0ns<2.0ns<2.5ns<2.5ns5/974LVC244A6/9WAVEFORM 1: PROPAGATION DELAYS (f=1MHz; 50% duty cycle)WAVEFORM 2: OUTPUT ENABLE AND DISABLE TIME(f=1MHz; 50% duty cycle)74LVC244A Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2002 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.© 9/9。
74HC245详细中文资料
74HC245详细中文资料74HC245是一款高速CMOS器件，74HC2 45引脚兼容低功耗肖特基TTL（LSTTL）系列。
74HC245译码器可接受3位二进制加权地址输入（A0, A1和A2），并当使能时，提供8个互斥的低有效输出（Y0至Y7）。
74HC245特有3个使能输入端：两个低有效（E1和E2）和一个高有效（E3）。
除非E1和E2置低且E3置高，否则74HC138将保持所有输出为高。
利用这种复合使能特性，仅需4片7 4HC245芯片和1个反相器，即可轻松实现并行扩展，组合成为一个1-32（5线到32线）译码器。
任选一个低有效使能输入端作为数据输入，而把其余的使能输入端作为选通端，则74HC245亦可充当一个8输出多路分配器，未使用的使能输入端必须保持绑定在各自合适的高有效或低有效状态。
74HC245与74HC 238逻辑功能一致，只不过74HC138为反相输出。
功能CD74HC245 ，CD74HC238和CD74HCT245， CD74HCT238是高速硅栅CMO S解码器，适合内存地址解码或数据路由应用。
74HC245作用原理于高性能的存贮译码或要求传输延迟时间短的数据传输系统,在高性能存贮器系统中,用这种译码器可以提高译码系统的效率。
将快速赋能电路用于高速存贮器时,译码器的延迟时间和存贮器的赋能时间通常小于存贮器的典型存取时间,这就是说由肖特基钳位的系统译码器所引起的有效系统延迟可以忽略不计。
HC138 按照三位二进制输入码和赋能输入条件,从8 个输出端中译出一个低电平输出。
两个低电平有效的赋能输入端和一个高电平有效的赋能输入端减少了扩展所需要的外接门或倒相器,扩展成24 线译码器不需外接门;扩展成32 线译码器,只需要接一个外接倒相器。
在解调器应用中,赋能输入端可用作数据输入端。
特性复合使能输入，轻松实现扩展兼容JEDEC标准no.7A 存储器芯片译码选择的理想选择低有效互斥输出 ESD保护 HBM EIA/JESD22-A114-C超过2000 V MM EIA/JESD22-A115-A超过200 V 温度范围 -40～+85 ℃ -40～+125 ℃多路分配功能74HC245是一款高速CMOS器件，74HC245引脚兼容低功耗肖特基T TL（LSTTL）系列。
74VHC244M_NL中文资料
© 2005 Fairchild Semiconductor Corporation DS011522November 1992Revised April 200574VHC244 Octal Buffer/Line Driver with 3-STATE Outputs74VHC244Octal Buffer/Line Driver with 3-STATE OutputsGeneral DescriptionThe VHC244 is an advanced high speed CMOS octal bus buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissi-pation. The VHC244 is a non-inverting 3-STATE buffer hav-ing two active-LOW output enables. These devices are designed to be used as 3-STATE memory address drivers,clock drivers, and bus oriented transmitter/receivers.An input protection circuit ensures that 0V to 7V can be applied to the input pins without regard to the supply volt-age. This device can be used to interface 5V to 3V systems and two supply systems such as battery back up. This cir-cuit prevents device destruction due to mismatched supply and input voltages.Featuress High Speed: t PD 3.9ns (typ) at V CC 5V s High noise immunity: V NIH V NIL 28% V CC (min)s Power down protection is provided on all inputs s Low noise: V OLP 0.6V (typ)s Low power dissipation: I CC 4 P A (max) @ T A 25q C s Pin and function compatible with 74HC244Ordering Code:Surface mount packages are also available on T ape and Reel. Specify by appending the suffix letter “X” to the ordering code.Pb-Free package per JEDEC J-STD-020B.Logic SymbolIEEE/IECConnection DiagramOrder Number Package NumberPackage Description74VHC244M M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74VHC244SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide74VHC244MTC MTC2020-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74VHC244NN20A20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 274V H C 244Pin DescriptionsTruth TablesH HIGH Voltage Level L LOW Voltage Level I ImmaterialZ High ImpedancePin NamesDescriptionOE 1, OE 23-STATE Output Enable Inputs I 0–I 7InputsO 0–O 73-STATE OutputsInputsOutputsOE 1I n (Pins 12, 14, 16, 18)L L L L H H HXZ InputsOutputsOE 2I n (Pins 3, 5, 7, 9)L L L L H H HXZ74VHC244Absolute Maximum Ratings (Note 1)Recommended Operating Conditions (Note 2)Note 1: Absolute Maximum Ratings are values beyond which the devicemay be damaged or have its useful life impaired. The databook specifica-tions should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading vari-ables. Fairchild does not recommend operation outside databook specifica-tions.Note 2: Unused inputs must be held HIGH or LOW. They may not float.DC Electrical CharacteristicsNoise CharacteristicsNote 3: Parameter guaranteed by design.Supply Voltage (V CC ) 0.5V to 7.0V DC Input Voltage (V IN ) 0.5V to 7.0V DC Output Voltage (V OUT ) 0.5V to V CC 0.5VInput Diode Current (I IK ) 20 mA Output Diode Current (I OK )r 20 mA DC Output Current (I OUT )r 25 mA DC V CC /GND Current (I CC )r 75 mAStorage Temperature (T STG ) 65q C to 150q CLead Temperature (T L )(Soldering, 10 seconds)260q CSupply Voltage (V CC ) 2.0V to 5.5VInput Voltage (V IN )0V to 5.5VOutput Voltage (V OUT )0V to V CCOperating Temperature (T OPR ) 40q C to 85q C Input Rise and Fall Time (t r , t f )V CC 3.3V r 0.3V 0 ns/V a 100 ns/V V CC 5.0V r 0.5V0 ns/V a 20 ns/VSymbol ParameterV CC T A 25q C T A 40q C to 85q C Units Conditions(V)Min TypMaxMin MaxV IH HIGH Level 2.0 1.5 1.5V Input Voltage 3.0 5.50.7 V CC0.7 V CCV IL LOW Level 2.00.50.5VInput Voltage 3.0 5.50.3 V CC0.3 V CC V OHHIGH Level 2.0 1.9 2.0 1.9V IN V IH I OH 50 P AOutput Voltage3.0 2.9 3.0 2.9Vor V IL4.5 4.4 4.54.43.0 2.58 2.48VI OH 4 mA 4.53.943.80I OH 8 mAV OLLOW Level 2.00.00.10.1V IN V IH I OL 50 P AOutput Voltage3.00.00.10.1V or V IL4.50.00.10.13.00.360.44V I OL 4 mA 4.50.360.44I OL 8 mAI OZ 3-STATE Output 5.5r 0.25r 2.5P AV IN V IH or V IL Off-State Current V OUT V CC or GND I IN Input Leakage Current 0 5.5r 0.1r 1.0P A V IN 5.5V or GND I CCQuiescent Supply Current5.54.040.0P AV IN V CC or GND Symbol ParameterV CC T A 25q C Units Conditions(V)Typ Limits V OLP Quiet Output Maximum 5.00.60.9VC L 50 pF(Note 3)Dynamic V OLV OLV Quiet Output Minimum 5.00.60.9VC L 50 pF(Note 3)Dynamic V OLV IHD Minimum HIGH Level 5.03.5VC L 50 pF(Note 3)Dynamic Input Voltage V ILD Maximum HIGH Level 5.01.5VC L 50 pF(Note 3)Dynamic Input Voltage 474V H C 244AC Electrical CharacteristicsNote 4: Parameter guaranteed by design. t OSLH |t PLHmax t PLHmin |; t OSHL |t PHLmax t PHLmin |.Note 5: C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC (OPR.) C PD * V CC * f IN I CC /8 (per bit).Symbol ParameterV CC T A 25q C T A 40q C to 85q C Units Conditions(V)MinTyp Max Min Max t PLH Propagation Delay 3.3 r 0.35.88.4 1.010.0ns C L 15 pF t PHLTime8.311.9 1.013.5C L 50 pF 5.0 r 0.53.9 5.5 1.0 6.5ns C L 15 pF 5.47.5 1.08.5C L 50 pF t PZL 3-STATE Output 3.3 r 0.3 6.610.6 1.012.5nsR L 1 k :C L 15 pF t PZHEnable Time9.114.1 1.016.0C L 50 pF 5.0 r 0.54.77.3 1.08.5ns C L 15 pF 6.29.3 1.010.5C L 50 pF t PLZ 3-STATE Output 3.3 r 0.310.314.0 1.016.0ns R L 1 k :C L 50 pF t PHZ Disable Time5.0 r 0.56.79.2 1.010.5C L 50 pF t OSLH Output to Output 3.3 r 0.3 1.5 1.5ns (Note 4)C L 50 pF t OSHL Skew5.0 r 0.51.0 1.0C L 50 pFC IN Input Capacitance 41010pF V CC Open C OUT Output Capacitance6pF V CC 5.0V C PDPower Dissipation Capacitance19pF(Note 5)74VHC244Physical Dimensions inches (millimeters) unless otherwise noted20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" WidePackage Number M20B 674V H C 244Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M20D 74VHC244Physical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm WidePackage Number MTC20874V H C 244 O c t a l B u f f e r /L i n e D r i v e r w i t h 3-S T A T E O u t p u t sPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" WidePackage Number N20AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。
74LVCH244APW中文资料
元器件交易网SO20:plastic small outline package; 20 leads; body width 7.5 mm SOT163-1SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1TSSOP20:plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1DefinitionsShort-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.DisclaimersLife support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.Philips Semiconductors811 East Arques AvenueP.O. Box 3409Sunnyvale, California 94088–3409Telephone 800-234-7381© Copyright Philips Electronics North America Corporation 1998All rights reserved. Printed in U.S.A.print code Date of release: 05-96。
74LVT244AD-T中文资料
IIK
input clamping current VI < 0 V
-
−50
mA
IOK
output clamping current VO < 0 V
-
பைடு நூலகம்
−50
mA
IO
output current
output in LOW-state
-
128
mA
output in HIGH-state
-
−64
mA
Tstg
2. Features
I Octal bus interface I 3-state buffers I Output capability: +64 mA and −32 mA I TTL input and output switching levels I Input and output interface capability to systems at 5 V supply I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs I Power-up 3-state I Live insertion and extraction permitted I No bus current loading when output is tied to 5 V bus I Latch-up protection:
SOT163-1
plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
SN74AHC244PWG4中文资料
PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9678201QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9678201SA ACTIVE CFP W 20TBD Call TI Call TI5962-9678201VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9678201VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74AHC244DBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74AHC244DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AHC244NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWLEOBSOLETETSSOPPW20TBDCall TICall TI24-Sep-2007Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74AHC244PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHC244PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AHC244FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AHC244J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54AHC244WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--TheMoisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.24-Sep-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244DBR DB 20SITE 41330168.27.5 2.51216Q1SN74AHC244DGVR DGV 20SITE 41330127.0 5.6 1.6812Q1SN74AHC244DWR DW 20SITE 413302410.813.0 2.71224Q1SN74AHC244NSR NS 20SITE 41330248.213.0 2.51224Q1SN74AHC244PWRPW20SITE 41330166.957.11.6816Q122-Sep-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC244DBR DB 20SITE 41346.0346.00.0SN74AHC244DGVR DGV 20SITE 41346.0346.00.0SN74AHC244DWR DW 20SITE 41346.0346.00.0SN74AHC244NSR NS 20SITE 41346.0346.00.0SN74AHC244PWRPW20SITE 41346.0346.00.022-Sep-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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SN74LVC244A资料
FEATURES
• Operates From 1.65 V to 3.6 V • Inputs Accept Voltages to 5.5 V • Specified From –40°C to 85°C and –40°C to
125°C • Max tpd of 5.9 ns at 3.3 V • Typical VOLP (Output Ground Bounce) < 0.8 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data s applied to any output in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
19 2OE
18 1Y1
2A1 11
9 2Y1
1A2 4
16 1Y2
2A2 13
7 2Y2
1A3 6
14 1Y3
2A3 15
5 2Y3
1A4 8
12 1Y4
2A4 17
Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.
常用数字元件
SN74AHC02DR：四2输入正或非门
SN74AHC02N：四2输入正或非门
SN74AHC1G02DBVR：单2输入正或非门
SN74AHC1G02DCKT：单2输入正或非门
SN74AHCT02D：四2输入正或非门
SN74AHCT02DR：四2输入正或非门
SN74AHC00DR：四2输入正与非门
SN74AHC00N：四2输入正与非门
SN74AHC132PW：四2输入施密特触发正与非门
SN74AHC1G00DBVR：单2输入正与非门
SN74AHC1G00DCKR：单2输入正与非门
SN74AHC1G00DCKT：单2输入正与非门
SN74AHCT00D：四2输入正与非门
数字逻辑器件 异或门
CD4070BE：四异或门
SN74AC86D：四2输入异或门
SN74ACT86N：四2输入异或门
SN74AHC1G86DBVR：单2输入异或门
SN74AHC1G86DCKT：单2输入异或门
SN74AHC86D：四2输入异或门
SN74AHC86N：四2输入异或门
SN74HC00N：四2输入正与非门
SN74HC132D：四2输入施密特触发正与非门
SN74HC20N：双4输入正与非门
SN74HCT00D：四2输入正与非门
SN74HCT00N：四2输入正与非门
SN74LVC10AD：三3输入正与非门
SN74LVC1G00DBVR：单2输入正与非门
SN74LVC1G02DCKR：单2输入正或非门
SN74LVC1G02DCKT：单2输入正或非门
TI SN74AHC244Q 数据手册说明书
SN74AHC244Q Octal Buffer/driver with 3-State Outputs1 Features•Q devices meet automotive performance requirements•Customer-specific configuration control can be supported along with major-change approval •EPIC™ (Enhanced-Performance Implanted CMOS) process•Operating range of 2 V to 5.5 V V CC•Latch-Up performance exceeds 250 mA per JESD 172 Applications•Enable or disable a digital signal•Eliminate slow or noisy input signals•Hold a signal during controller reset•Debounce a switch 3 DescriptionThis octal buffer/driver is designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.(1)Package drawings, standard packing quantities, thermal data,symbolization, and PCB design guidelines are available at/sc/package.Table of Contents1 Features ............................................................................12 Applications .....................................................................13 Description .......................................................................14 Revision History ..............................................................25 Function Table .................................................................36 Specifications ..................................................................46.1 Absolute Maximum Ratings........................................46.2 ESD Ratings...............................................................46.3 Recommended Operating Conditions.........................46.4 Thermal Information....................................................56.5 Electrical Characteristics.............................................56.6 Switching Characteristics, V CC = 3.3 V ± 0.3 V ..........56.7 Switching Characteristics, V CC = 5 V ± 0.5 V .............66.8 Noise Characteristics..................................................66.9 Operating Characteristics...........................................67 Parameter Measurement Information . (7)8 Detailed Description ........................................................88.1 Overview.....................................................................88.2 Functional Block Diagram...........................................88.3 Device Functional Modes............................................89 Application and Implementation ....................................99.1 Power Supply Recommendations...............................99.2 Layout.........................................................................910 Device and Documentation Support ..........................1110.1 Documentation Support..........................................1110.2 Receiving Notification of Documentation Updates..1110.3 Support Resources.................................................1110.4 Trademarks.............................................................1110.5 Electrostatic Discharge Caution..............................1110.6 Glossary..................................................................1111 Mechanical, Packaging, and OrderableInformation (12)4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision * (February 2002) to Revision A (April 2023)Page •Added Applications , Package Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device Functional Modes , Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, andOrderable Information section (1)SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 20235 Function TableFigure 5-1. DW or PW Package (Top View)SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 6 Specifications6.1 Absolute Maximum Ratings1.Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to thedevice. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.2.The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 6.2 ESD Ratings(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.3 Recommended Operating Conditions(1)(1)(1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs , literature number SCBA004.6.4 Thermal Information(1)For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.6.5 Electrical Characteristics6.6 Switching Characteristics, V CC = 3.3 V ± 0.3 VSN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 6.7 Switching Characteristics, V CC = 5 V ± 0.5 V6.8 Noise Characteristics(1)(1)Characteristics are for surface-mount packages only.6.9 Operating Characteristics7 Parameter Measurement InformationA.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, t r ≤ 3 ns, t f ≤ 3 ns.D.The outputs are measured one at a time with one input transition per measurement.Figure 7-1. Load Circuit and Voltage WaveformsSN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 20238 Detailed Description8.1 OverviewThe SN74AHC244Q is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.8.2 Functional Block DiagramFigure 8-1. Logic Diagram (Positive Logic)†Figure 8-2. Logic Symbol8.3 Device Functional Modes†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 20239 Application and ImplementationNoteInformation in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.9.1 Power Supply RecommendationsThe power supply can be any voltage between the MIN and MAX supply voltage rating located in the Section 6.3 table.Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1 μf is recommended; if there are multiple VCC pins, then 0.01 μf or 0.022 μf is recommended for each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μf and a 1 μf are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results.9.2 Layout9.2.1 Layout GuidelinesWhen using multiple-bit logic devices, inputs should never float.In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Layout Diagram specifies the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or V CC , whichever makes more sense or is more convenient. It is generally acceptable to float outputs, unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the output section of the part when asserted. This will not disable the input section of the I/Os, so they cannot float when disabled.SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 9.2.1.1 Layout ExampleFigure 9-1. Layout Diagram10 Device and Documentation Support10.1 Documentation Support10.1.1 Related DocumentationThe table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.10.2 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on . Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.10.3 Support ResourcesTI E2E ™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need.Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use .10.4 TrademarksTI E2E ™ is a trademark of Texas Instruments.All trademarks are the property of their respective owners.10.5 Electrostatic Discharge CautionThis integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.10.6 GlossaryTI GlossaryThis glossary lists and explains terms, acronyms, and definitions.SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 2023SN74AHC244QSGDS017A – FEBRUARY 2002 – REVISED APRIL 11 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andAddendum-Page 1continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATIONA0B0K0W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSSprocket HolesP1*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC244QDWRG4SOIC DW 202000330.024.410.813.3 2.712.024.0Q1SN74AHC244QDWRG4Q1SOIC DW 202000330.024.410.813.3 2.712.024.0Q1SN74AHC244QPWR TSSOP PW 202000330.016.4 6.957.0 1.48.016.0Q1SN74AHC244QPWRG4TSSOPPW202000330.016.46.957.01.48.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm) SN74AHC244QDWRG4SOIC DW202000367.0367.045.0SN74AHC244QDWRG4Q1SOIC DW202000367.0367.045.0 SN74AHC244QPWR TSSOP PW202000356.0356.035.0SN74AHC244QPWRG4TSSOP PW202000356.0356.035.0PACKAGE OUTLINESOIC - 2.65 mm max heightDW0020ASOICNOTES:1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.5. Reference JEDEC registration MS-013.EXAMPLE BOARD LAYOUT DW0020ASOIC - 2.65 mm max heightSOIC ArrayNOTES: (continued)6. Publication IPC-7351 may have alternate designs.7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.EXAMPLE STENCIL DESIGN DW0020ASOIC - 2.65 mm max heightSOIC ArrayNOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternatedesign recommendations.9. Board assembly site may have different recommendations for stencil design.PACKAGE OUTLINETSSOP - 1.2 mm max heightPW0020ASMALL OUTLINE PACKAGENOTES:1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.5. Reference JEDEC registration MO-153.EXAMPLE BOARD LAYOUTTSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGENOTES: (continued)6. Publication IPC-7351 may have alternate designs.7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.EXAMPLE STENCIL DESIGNTSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGENOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.9. Board assembly site may have different recommendations for stencil design.IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements.These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.TI objects to and rejects any additional or different terms you may have proposed.Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2023, Texas Instruments Incorporated。
SN74ACT244PW中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN74LVTZ244PWRG4,SN74LVTZ244DBRE4,SN74LVTZ244DBRG4,SN74LVTZ244DWE4, 规格书,Datasheet 资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LVTZ244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74LVTZ244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTZ244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74LVTZ244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVTZ244DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LVTZ244DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LVTZ244PWRTSSOPPW202000330.016.46.957.11.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LVTZ244DBR SSOP DB202000367.0367.038.0 SN74LVTZ244DWR SOIC DW202000367.0367.045.0SN74LVTZ244PWR TSSOP PW202000367.0367.038.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s 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TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。
74HC245引脚图应用电路与中文资料
74HC245引脚图应用电路与中文资料74HC244 是一款常见的驱动信号芯片，常用于各种单片机mcu系统中，单片机io口输出的电流很小而244芯片就是用来放大电流，他是具有三态输出的八路缓冲器和线路驱动器，他与74HC245的唯一区别是74HC244是单向的，数据只能从A端流向Y 端，而74HC245则是双向的。
他们的驱动能力相同。
74hc244的pdf资料下74HC244也常常用于隔离，比如单片机和并口等设备直连理论上可以直接用单片机的几根I/O口接并口线，但如果电路板没做好，可能会连带把计算机并口烧坏，所以要加个74HC244芯片隔离一下74HC244 是CMOS电路，74ls244 是双极晶体管型电路，二者的特性差别很大，LS器件是淘汰型，尽量不要选用。
74HC240，74HC241，74HC244为同一系列的产品，他们的区别很小在引脚及其功能方面下面的中文资料中都有详细的说明.74hc244实物图74hc244管脚图下面介绍74hc244的功能：74HC244芯片内部共有两个四位三态缓冲器，使用时可分别以1C和2G作为它们的选通工作信号。
当1C和2G都为低电平时，输出端Y和输入端A状态相同；当1G和2G都为高电平时，输出呈高阻态。
八同相三态缓冲器/线驱动器74HC233芯片功能如果输入的数据可以保持比较长的时间（比如键盘），简单输入接口扩展通常使用的典型芯片为74HC244，由该芯片可构成三态数据缓冲器。
74HC244芯片引脚排列如图1所示。
74HC244芯片内部共有两个四位三态缓冲器，使用时分别以1C和2G作为它们的选通工作信号。
当1/0E和2/0E都为低电平时，输出端Y和输入端A状态相同；当1/0E和2/0E 都为高电平时，输出成高阻态dip封装的74hc244引脚图贴片74hc244引脚图74hc244封装图74hc244真值表74hc244及74hc241 74hc240功能表缓冲并行端口电路74hc244应用电路74hc244电流最大值74hc244电压温度等操作条件。
74ls244中文资料
符号 VCC VIH
参数 电源电压 输入高电平电压 ViH
图 1 74244 逻辑引脚功能图
最小值 4.75 2
典型值 5 -
最大值 5.25 -
单位 V V
VIL
输入低电平电压 ViL
-
-
0.8
V
IOH
输出高电平电流 IOH
-
-
-15
mA
IOL
输出低电平电流 IOL
-
-
24
mA
TA
工作温度
0
-
70
-
20 μA
VO = 0.4V -
-
-20 μA
VCC = Max
VI = 7V
-
-
0.1 mA
VCC = Max VCC = Max VCC = Max (Note 3)
VCC = Max, Outputs Open
VI = 2.7V -
-
VI = 0.4V -0.5 -
-40 -
Outputs HIGH -
2.4 3.4 -
V
mA
VCC = Min, VIH = Min VIL = 0.5V, IOH =
2
-
-
Max
VCC = Min VIL = Max
IOL = 12mA -
-
0.4
V
IOL = Max -
-
0.5
VIH = Min VCC = Max VIL = Max VIH = Min
VO = 2.7V -
13
Outputs LOW -
27
Outputs
-
32
Disabled
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FEATURESSN54LVCH244A...J OR W PACKAGE SN74LVCH244A...DB, DBQ, DGV, DW,NS, OR PW PACKAGE(TOP VIEW)SN54LVCH244A...FK PACKAGE(TOP VIEW)12345678910201918171615141312111OE 1A12Y41A22Y31A32Y21A42Y1GNDV CC 2OE 1Y12A41Y22A31Y32A21Y42A132120199101112134567818171615141Y12A41Y22A31Y31A22Y31A32Y21A42Y 41A 11O E 1Y 42A 2O E2Y 1G N D 2A 1V C CSN74LVCH244A...RGY PACKAGE(TOP VIEW)12010112345678919181716151413122OE 1Y12A41Y22A31Y32A21Y41A12Y41A22Y31A32Y21A42Y11O E2A 1V G N DC CDESCRIPTION/ORDERING INFORMATIONSN54LVCH244A ,SN74LVCH244AOCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCES009O–JULY 1995–REVISED FEBRUARY 2007•Operate From 1.65V to 3.6V •I off Supports Partial-Power-Down Mode Operation•Inputs Accept Voltages to 5.5V •Bus Hold on Data Inputs Eliminates the Need •Max t pd of 5.9ns at 3.3Vfor External Pullup/Pulldown Resistors•Typical V OLP (Output Ground Bounce)•Latch-Up Performance Exceeds 250mA Per <0.8V at V CC =3.3V,T A =25°CJESD 17•Typical V OHV (Output V OH Undershoot)•ESD Protection Exceeds JESD 22>2V at V CC =3.3V,T A =25°C–2000-V Human-Body Model (A114-A)•Support Mixed-Mode Signal Operation on All Ports–200-V Machine Model (A115-A)(5-V Input/Output Voltage With 3.3-V V CC )–1000-V Charged-Device Model (C101)The SN54LVCH244A octal buffer/line driver is designed for 2.7-V to 3.6-V V CC operation,and the SN74LVCH244A octal buffer/line driver is designed for 1.65-V to 3.6-V V CC operation.These devices are organized as two 4-bit line drivers with separate output-enable (OE)inputs.When OE is low,these devices pass data from the A inputs to the Y outputs.When OE is high,the outputs are in the high-impedance state.Active bus-hold circuitry holds unused or undriven inputs at a valid logic e of pullup or pulldown resistors with the bus-hold circuitry is not recommended.Inputs can be driven from either 3.3-V or 5-V devices.This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment.These devices are fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the devices when they are powered down.To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.1Y11OE1A11Y21A21Y31A31Y41A42Y12OE2A12Y22A22Y32A32Y42A4SN54LVCH244A ,SN74LVCH244A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCES009O–JULY 1995–REVISED FEBRUARY 2007ORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING QFN –RGY Reel of 1000SN74LVCH244ARGYR LCH244A Tube of 25SN74LVCH244ADW SOIC –DW LVCH244A Reel of 2000SN74LVCH244ADWR SOP –NSReel of 2000SN74LVCH244ANSR LVCH244A SSOP –DBReel of 2000SN74LVCH244ADBR LCH244A –40°C to 85°CSSOP (QSOP)–DBQ Reel of 2500SN74LVCH244ADBQR LVCH244ATube of 70SN74LVCH244APW TSSOP –PW Reel of 2000SN74LVCH244APWR LCH244AReel of 250SN74LVCH244APWT TVSOP –DGV Reel of 2000SN74LVCH244ADGVR LCH244ACDIP –JTube of 20SNJ54LVCH244AJ SNJ54LVCH244AJ –55°C to 125°CCFP –W Tube of 85SNJ54LVCH244AW SNJ54LVCH244AW LCCC –FKTube of 55SNJ54LVCH244AFKSNJ54LVCH244AFK (1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.FUNCTION TABLE (EACH BUFFER)INPUTS OUTPUTYOE A L H H L L L HXZLOGIC DIAGRAM (POSITIVE LOGIC)Absolute Maximum Ratings(1)SN54LVCH244A,SN74LVCH244A OCTAL BUFFERS/DRIVERSWITH3-STATE OUTPUTS SCES009O–JULY1995–REVISED FEBRUARY2007over operating free-air temperature range(unless otherwise noted)MIN MAX UNIT V CC Supply voltage range–0.5 6.5VV I Input voltage range(2)–0.5 6.5VV O Voltage range applied to any output in the high-impedance or power-off state(2)–0.5 6.5VV O Voltage range applied to any output in the high or low state(2)(3)–0.5V CC+0.5VI IK Input clamp current V I<0–50mA I OK Output clamp current V O<0–50mA I O Continuous output current±50mAContinuous current through V CC or GND±100mADB package(4)70DBQ package(4)68DGV package(4)92θJA Package thermal impedance DW package(4)58°C/WNS package(4)60PW package(4)83RGY package(5)37T stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD51-7.(5)The package thermal impedance is calculated in accordance with JESD51-5.Recommended Operating Conditions (1)SN54LVCH244A ,SN74LVCH244A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCES009O–JULY 1995–REVISED FEBRUARY 2007SN54LVCH244ASN74LVCH244AUNIT MINMAX MIN MAX Operating2 3.61.65 3.6V CCSupply voltageVData retention only 1.51.5V CC =1.65V to 1.95V0.65×V CCV IHHigh-level input voltageV CC =2.3V to 2.7V 1.7VV CC =2.7V to 3.6V 22V CC =1.65V to 1.95V0.35×V CCV IL Low-level input voltage V CC =2.3V to 2.7V 0.7V V CC =2.7V to 3.6V0.80.8V I Input voltage 0 5.50 5.5V High or low state 0V CC 0V CC V OOutput voltageV 3-state 05.55.5V CC =1.65V–4V CC =2.3V –8I OHHigh-level output currentmA V CC =2.7V –12–12V CC =3V –24–24V CC =1.65V4V CC =2.3V 8I OLLow-level output currentmA V CC =2.7V 1212V CC =3V2424∆t/∆v Input transition rise or fall rate 1010ns/V T A Operating free-air temperature–55125–4085°C (1)All unused control inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.Electrical Characteristics SN54LVCH244A,SN74LVCH244A OCTAL BUFFERS/DRIVERSWITH3-STATE OUTPUTS SCES009O–JULY1995–REVISED FEBRUARY2007over recommended operating free-air temperature range(unless otherwise noted)SN54LVCH244A SN74LVCH244A PARAMETER TEST CONDITIONS V CC UNITMIN TYP(1)MAX MIN TYP(1)MAX1.65V to3.6V V CC–0.2I OH=–100µA2.7V to3.6V V CC–0.2I OH=–4mA 1.65V 1.2V OH I OH=–8mA 2.3V 1.7V2.7V 2.2 2.2I OH=–12mA3V 2.4 2.4I OH=–24mA3V 2.2 2.21.65V to3.6V0.2I OL=100µA2.7V to3.6V0.2I OL=4mA 1.65V0.45V OL VI OL=8mA 2.3V0.7I OL=12mA 2.7V0.40.4I OL=24mA3V0.550.55I I V I=0to5.5V 3.6V±5±5µAI off V I or V O=5.5V0±10µAV I=0.58V(2)1.65VV I=1.07V(2)V I=0.7V452.3VI I(hold)V I=1.7V–45µAV I=0.8V75753VV I=2V–75–75V I=0to3.6V(3) 3..6V±500±500I OZ V O=0to5.5V 3.6V±15±10µAV I=V CC or GND1010I CC I O=0 3.6VµA3.6V≤V I≤5.5V(4)1010One input at V CC–0.6V,∆I CC 2.7V to3.6V500500µA Other inputs at V CC or GNDC i V I=V CC or GND 3.3V4124pFC o V O=V CC or GND 3.3V 5.512 5.5pF(1)All typical values are at V CC=3.3V,T A=25°C.(2)This information was not available at the time of publication.(3)This is the bus-hold maximum dynamic current required to switch the input from one state to another.(4)This applies in the disabled state only.Switching CharacteristicsSwitching CharacteristicsOperating CharacteristicsSN54LVCH244A ,SN74LVCH244A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCES009O–JULY 1995–REVISED FEBRUARY 2007over recommended operating free-air temperature range (unless otherwise noted)(see Figure 1)SN54LVCH244AFROM TO V CC =3.3V PARAMETERV CC =2.7V UNIT(INPUT)(OUTPUT)±0.3V MIN MAXMIN MAX t pd A Y 7.51 6.5ns t en OE Y 918ns t disOEY817ns over recommended operating free-air temperature range (unless otherwise noted)(see Figure 1)SN74LVCH244AFROM TO V CC =1.8V V CC =2.5V V CC =3.3V PARAMETERV CC =2.7V UNIT(INPUT)(OUTPUT)±0.15V ±0.2V ±0.3V MIN MAXMINMAXMIN MAXMIN MAX t pd A Y (1)(1)(1)(1) 6.9 1.5 5.9ns t en OE Y (1)(1)(1)(1)8.617.6ns t disOEY(1)(1)(1)(1)6.81.55.8ns(1)This information was not available at the time of publication.T A =25°CV CC =1.8VV CC =2.5VV CC =3.3VTEST PARAMETERUNIT CONDITIONS TYPTYPTYP Outputs enabled (1)(1)47Power dissipation capacitance C pd f =10MHzpFper buffer/driverOutputs disabled(1)(1)2(1)This information was not available at the time of publication.PARAMETER MEASUREMENT INFORMATIONFrom Output Under TestLOAD CIRCUITOpen Data InputTiming InputV I0 VV I0 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OLV I0 V InputOutput Waveform 1S1 at V LOAD (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH V LOAD /20 V≈0 VV IVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PLH /t PHL t PLZ /t PZL t PHZ /t PZHOpen V LOAD GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.All parameters and waveforms are not applicable to all devices.Output Control V I1.8 V ± 0.15 V2.5 V ± 0.2 V2.7 V3.3 V ± 0.3 V1 k Ω500 Ω500 Ω500 ΩV CC R L 2 × V CC 2 × V CC 6 V 6 VV LOAD C L 30 pF 30 pF 50 pF 50 pF0.15 V 0.15 V 0.3 V 0.3 VV ∆V CC V CC 2.7 V 2.7 VV I V CC /2V CC /21.5 V 1.5 VV M t r /t f ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 nsINPUTS SN54LVCH244A ,SN74LVCH244AOCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTSSCES009O–JULY 1995–REVISED FEBRUARY 2007Figure 1.Load Circuit and Voltage WaveformsPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9754201Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9754201QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9754201QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9754201V2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9754201VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9754201VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74LVCH244ADBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74LVCH244ADBQR ACTIVE SSOP/QSOP DBQ 202500Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVCH244ADBQRE4ACTIVE SSOP/QSOP DBQ 202500Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVCH244ADBQRG4ACTIVE SSOP/QSOP DBQ 202500Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVCH244ADBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADBRG4ACTIVE SSOP DB 202000TBDCall TI Call TISN74LVCH244ADGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ADWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ANSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ANSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APWLE OBSOLETE TSSOP PW 20TBDCall TI Call TISN74LVCH244APWRACTIVETSSOPPW202000Green (RoHS &CU NIPDAULevel-1-260C-UNLIM26-May-2007Orderable DeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)SN74LVCH244APWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APWT ACTIVE TSSOP PW 20250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APWTE4ACTIVE TSSOP PW 20250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244APWTG4ACTIVE TSSOP PW 20250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH244ARGYR ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVCH244ARGYRG4ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAULevel-2-260C-1YEARSNJ54LVCH244AFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54LVCH244AJ ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54LVCH244AWACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Wheredesigned to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.26-May-2007TAPE AND REELINFORMATIONPACKAGE MATERIALS INFORMATION19-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVCH244ADBQR DBQ 20MLA 33016 6.59.0 2.1816Q1SN74LVCH244ADBR DB 20MLA 330168.27.5 2.51216Q1SN74LVCH244ADGVR DGV 20MLA 330127.0 5.6 1.6812Q1SN74LVCH244ADWR DW 20MLA 3302410.813.0 2.71224Q1SN74LVCH244ANSR NS 20MLA 330248.213.0 2.51224Q1SN74LVCH244APWR PW 20MLA 33016 6.957.1 1.6816Q1SN74LVCH244ARGYRRGY20MLA180123.84.81.6812Q1TAPE AND REEL BOX INFORMATIONDevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74LVCH244ADBQR DBQ 20MLA 0.00.00.0SN74LVCH244ADBR DB 20MLA 342.9336.628.58SN74LVCH244ADGVR DGV 20MLA 338.1340.520.64SN74LVCH244ADWR DW 20MLA 333.2333.231.75SN74LVCH244ANSR NS 20MLA 333.2333.231.75SN74LVCH244APWR PW 20MLA 342.9336.628.58SN74LVCH244ARGYRRGY20MLA190.0212.731.7519-May-200719-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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